B plus B SmartWorx WLRG601 802.11 b/g radio module User Manual

B&B; Electronics 802.11 b/g radio module

User Manual

 Product Specification    802.11b/g SDIO/SPI Airborne Radio WLRG-RA-DP600 Family Revision:  2.4  June 2010 File name: wlrg-ra-dp601 product brief v2.4 Document Number: 846-8310-240
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  2 1.0  Product Description The WLNG-RA-DP600 family is a Marvell 88W8686 based 802.11b/g SDIO/SPI radio, designed by Quatech, to support handheld, mobile station and other power sensitive applications. The radio features the following:   802.11b/g radio   Based upon Marvell Libertas 88W8686 Chipset  30 pin high density SMT connector (Molex 53748-0308)   Single (1) Hirose U.FL RF connector for 802.11b/g   Supports WEP, WPA, WPA2 (Home and Enterprise) and 802.1x Supplicants   Bluetooth Co-existence 3-wire interface through main connector   SDIO 1.0 and Generic SPI host interface through 30 pin header   Operating Temperature (-30°C to 85°C)   Storage temp (-30°C to 125°C)   Advanced Low power modes   High vibration mounting holes   Supports host downloaded radio firmware    Single antenna   Driver support for WinCE 5.0, Windows Mobile 5.0/6.0, Linux 2.6 and other embedded OS‟s  Small form factor radio module (Dimensions: 29mm x 21mm x 6.0mm) Figure 1- Lakemore Radio Example
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  3 2.0  Block Diagram The following outlines the block diagram of the radio: Marvell 88W8686 IEEE 802.11 MAC Processor & RF TranscieverSDIO/SPI InterfacePower Management32.768KHz Xtal Oscillator40 MHz Xtal Oscillator802.11b/g FEMU.FL RF ConnectorVDD (3.3VDC)BT CoexistenceSerial EEPROM802.11b/g RFVHIO  (1.8VDC or VDD)External Sleep Clock Option Available
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  4 3.0  Model Numbers The following table identifies the model numbers associated with the radio family. Please contact Quatech sales for details, quotes and availability. Table 1 - Model Numbers 802.11b 802.11g SDIO SPI BT Co VDD VHIOWLRG-RA-DP601802.11b/g, SDIO/SPI, Bluetooth Coexistence, VDD & VHIO supply(Lakemore)l ll1l1llllWLEG-RA-DP601802.11b/g SDIO/SPI Radio Eval Kit   WLRG-RA-DP601 radio  SDIO Adapter Card  Tools/Documentation CD  Drivers (WinCE/Linux/XP) lNotes: 1. Interface selection through pin 5 (SDIO) on main conector.2. Radio supports external sleep oscillator option. Please contact Quatech sales for more information.3. The Bluetooth Coexistance interface does not include RF antenna  sharing option. For more details contact Quatech sales.RoHSEval KitModel Number WiFiInterfaceSupplyDescription
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  5 4.0  Pin out and Connectors Table 2 – Radio Pin Definition Pin Signal Pin I/O Type Description 1 GND  Ground 2 GND  Ground 3 DNC  Reserved pin, DO NOT CONNECT 4 VHIO Supply Input Host Digital I/O Supply voltage for SDIO/SPI and Bluetooth interfaces.  VHIO = 1.8VDC or VDD. Internally decoupled to GNDHIO. 5 SDIO Digital Input Serial Host mode. SPI = GND, SDIO = VDD 6 VHIO Supply Input Host Digital I/O Supply voltage for SDIO/SPI and Bluetooth interfaces.  VHIO = 1.8VDC or VDD. Internally decoupled to GNDHIO. 7 DATA2 Digital I/O SDIO Bit 2 (VHIO Domain) SDIO 4-bit: Data bit 2 or Read Wait (Optional) SDIO 1-bit: Read Wait (Optional) SDIO SPI: Reserved SPI: SPI Interrupt output (active low) 8 GND  Ground 9 GND  Ground 10 DATA1 Digital I/O SDIO Bit 1 (VHIO Domain) SDIO 4-bit: Data bit 1 SDIO 1-bit: Interrupt SDIO SPI: Reserved SPI: Data Output 11 DATA3 Digital I/O SPI/SDIO Card Select (Active Low) (VHIO Domain) SDIO 4-bit: Data bit 3 SDIO 1-bit: Reserved SDIO SPI: Card Select (Active Low) 12 SERCLK Digital Input SPI/SDIO Clock from host(VHIO Domain) SDIO 4-bit: Clock input SDIO 1-bit: Clock Input SDIO SPI: Clock Input SPI: Clock Input 13 DATA0 Digital I/O SDIO Bit 0 (VHIO Domain) SDIO 4-bit: Data bit 0 SDIO 1-bit: Data Line SDIO SPI: Data Output SPI: SPI Device Select (Active Low) 14 CMD Digital Input SPI/SDIO data input for 4-Wire mode, data input/output for 3-wire mode. (VHIO Domain) SDIO Command/Response SDIO 4-bit: Command/response SDIO 1-bit: Command SDIO SPI: 4-wire = Data Input. 3-wire = Data I/O SPI: Data Input 15 VDD Analog Supply Input Supply Voltage (3.3VDC) 16 WLNAPU Digital Input  (Pull Down) Card Power Up Enable from Host (active High). Internal Pull-up. 17 VDD Analog Supply Input Supply Voltage (3.3VDC) 18 SPI_RSTn Digital Input SPI Device RESET from MCU. Active Low 19 RF_ACTIVE Digital Input Asserted by the BT device during Rx or Tx slots that it wishes to use. 20 DNC  Reserved pin, DO NOT CONNECT 21 TXCONF Digital Output Transmission confirmed. Pulled low when the radio wants to prevent the BT device‟s use of the medium 22 STATUS Digital Input Pulsed if the BT device has a priority need for the slot. After that it indicates the BT radio mode (Tx or RX) 23 DNC  Reserved pin, DO NOT CONNECT 24 MCU_WAKEUP Digital Output MCU “wake up” request to the host. Active high. (GPIO5) 25 NC/SLEEPCLK  No connect, optional SLEEPCLK pin for host sourced sleep clock. 26 MAC_WAKEUP Digital Input WLAN MAC “wake-up”/interrupt from the host MCU. Active high (GPIO4) 27 UARTSIN 1.8V UART UART Serial Input. 28 UARTSOUT 1.8V UART UART Serial Output. 29 GND  Ground 30 GND  Ground
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  6 Table 3 - SDIO Interface Definition Table SDIO Pin Module Pin SD 4-bit Pin Name SD 4-bit Description SD 1-bit Pin Name SD 1-bit Description 1 11 DATA3 Data bit 3 N/C Reserved 2 14 CMD Command line. CMD Command line. 3 1, 2, 8,9, 29, 30 VSS1 Ground (GND) VSS1 Ground 4 4, 6 VDD Supply Voltage (VHIO) VDD Supply Voltage (VHIO) 5 12 CLK Clock from host (up to 48MHz) CLK Clock from host (up to 48MHz) 6 1, 2, 8,9, 29, 30 VSS2 Ground (GND) VSS2 Ground 7 13 DATA0 Data bit 0 DATA Data line 8 10 DATA1 Data bit 1 IRQ Interrupt 9 7 DATA2 Data bit 2 RW Read/Write (optional)  Table 4 - SPI Interface Definition table Module Pin SPI Pin Name SPI Description 7 DATA2 SPI Host Interrupt Request. Asserted by card to request an SPI data transfer. Interrupt output. 10 DATA1 SPI Data Output (MISO). 12 CLK Clock from host (up to TBD MHz) 13 DATA0 SPI Card Select from host. Active Low 14 CMD SPI Data Input (MOSI). 18 SPI_RSTn SPI Device RESET from host. Active Low (Section Error! Reference source not found.)     1. It is recommended pins 27 and 28 be brought out to test pads or a pinned header.
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  7 There are a total of two connectors to the radio: J1:   30 pin Digital SDIO/SPI Host interface to radio Baseband processor. Molex: 0537480308 (0.50mm (.020") Pitch SlimStack™Plug, Surface Mount, Dual Row, Vertical, 3.00mm (.118") Stack Height, 30 Circuits) J2:   RF connector for 802.11b/g antenna. Hirose U.FL.  RF ShieldJ2Top View Bottom ViewJ1Component Area
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  8 5.0  Electrical & RF Specification (Preliminary) Table 5- Absolute Maximum Values1 Parameter Min Max Unit Maximum EMU Supply Voltage -0.3 7.0 VDC Power Dissipation  2.00 W Operating Temperature Range2 -30 85 oC Storage Temperature -50 125 oC   1. These are absolute ratings; exceeding these values may cause permanent damage to the device. 2. Device is operational over full temperature range, however will provide reduced RF compatibility. Fully compliant temperature range -10C to 85C. Table 6 – Operating Conditions & DC Specification Symbol Parameter Min Typ Max Units VDD Supply Voltage  2.97 3.30 3.63 V VHIO Host SDIO Interface supply1 1.62 1.86 1.98 V IVHIO SDIO/SPI host interface supply current VHIO=3.3VDC  8.4 10 mA ICCTXB Constant transmit current (802.11b) Transmitting @ 11Mb/s  218 263 mA ICCRXB Constant receive current (802.11b) Receiving valid packets @ 11MB/s  146 164 mA ICCTXG Constant transmit current (802.11g) Transmitting @ 54Mb/s  161 276 mA ICCRXG Constant receive current (802.11g) Receiving valid packets @ 54MB/s  174 200 mA ISBIEEE IEEE Power Save Mode Associated, Idle, Beacon Interval = 100ms  6 9 mA ISBPS Deep power save mode  440  A ISBFPD Full power down mode  160  A   1. When VHIO is not 1.8VDC, use VDD parameter for signal levels (VHIO=VDD).
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  9  Table 7 - SDIO/SPI Interface Electrical Characteristics Symbol Parameter  Min Typ Max Units VIHSDIO Input HIGH Voltage  VCC=MAX, MIN 0.7 VHIO   VHIO+0.3 V VILSDIO Input LOW voltage VCC=MIN, MAX 0  0.3 VHIO V VOHSDIO Output HIGH Voltage IOL = 0.2mA, VCC=MIN VHIO-0.2  VHIO V VOLSDIO Output LOW voltage IOL = 6mA, VCC=MIN 0  0.6 V ILSDIO Input Leakage Current VCC=MAX,  Input = 0V or VCC -1  1  A CINSDIO Input Capacitance   TBD  pF COUTSDIO Output Capacitance   TBD  pF  Table 8 - Supported Data Rates by Band Band Supported Data Rates (Mbps) 802.11b 11, 5.5, 2, 1 802.11g 54, 48, 36, 24, 18, 12, 9, 6  Table 9 - Operating Channels Band Region Freq Range (GHz) No. of Channels Channels 802.11b US/Canada 2.4 - 2.4835 11 1 - 11 Europe 2.4 - 2.4835 13 1 - 13 France  2.4 - 2.4835 4 10 - 13 Japan 2.4 - 2.497 14 1 - 14 802.11g US/Canada 2.4 - 2.4835 11 1 - 11 Europe 2.4 - 2.4835 13 1 - 13 France  2.4 - 2.4835 4 10 - 13 Japan 2.4 - 2.497 13 1 - 13     1. Channel count denotes number of non-overlapping channels.
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  10 Table 10 - RF Characteristics – 802.11b/g Symbol Parameter Rate (Mbps) Min Average  dBm / mW Peak  dBm / mW Units POUTB Transmit Power Output 802.11b 11, 5.5, 2, 1  13.2 20.1 18.2 66.1 dBm POUTG Transmit Power Output 802.11g 48, 54  12.8 19.1 17.3 53.7 dBm 24, 36  12.7 18.6 17.2 52.5 12, 18  12.8 19.1 17.3 53.7 6, 9  12.5 17.8 17.0 50.1 PRSENB Receive Sensitivity 802.11b 11  -89  dBm 1  -92  PRSENG Receive Sensitivity 802.11g 54  -72  dBm 36  -78  18  -83  6  -88  FRANGEBG Frequency Range  2412  2484 MHz     1. All values measured at TA.
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  11 6.0  Antenna The unit supports antenna connection through a single Hirose U.FL connector, located on the top surface of the radio next to the RF shielding.  Any antenna used with the system must be designed for operation within the 2.4GHz  ISM band and specifically must support the 2.412GHz to 2.482GHz for 802.11b/g operation. They are required to have a VSWR of 2:1 maximum referenced to a 50 system impedance. 6.1  Antenna Selection The Airborne radio supports a number of antenna options, all of which require connection to the U.FL connectors on the radio. Ultimately the antenna option selected will be determined by a number of factors, these include consideration of the application, mechanical construction and desired performance. Since the number of possible combinations is endless we will review some of the more common solutions in this section. If your application is not covered during this discussion please contact Technical Support for more specific answers. The available antenna connections include:   Host board mounted antenna   Host Chassis mounted antenna   Embedded antenna In addition to the above options, location and performance need to be considered, the following sections discuss these items. 6.2  Host Board Mounted Antenna Host board mounted requires that an antenna connection is physically mounted to the host system board. It also requires that the host board include a U.FL connector (two (2) if diversity is being used) to allow a U.FL to U.FL coaxial lead to connect from the radio to the host board. It will then require 50 matched PCB traces to be routed from the U.FL connector to the antenna mount. There are several sources for the U.FL to U.FL coaxial cable these include Hirose, Sunridge and IPEX. Please contact Quatech for further part numbers and supply assistance. This approach can simplify assembly but does require that the host system configuration can accommodate an antenna location that is determined by the host PCB. There are also limitations on the ability to seal the enclosure when using this approach. This approach also restricts the selection of available antenna.  When using this approach antennas that screw or press fit to the PCB mount connector must be used. There are many options for the antenna connector type, however if you wish to utilize the FCC/IOC modular approval the connector choice must comply with FCC regulations, these state a non-standard connector is required e.g.
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  12 TNC/SMA are not allowed (there are more that are not), RP-TNC/RP-SMA are allowed. 6.3  Host Chassis Mounted Antenna Host Chassis mounted antennas require no work on the host PCB. They utilize an antenna type called „flying lead‟. There are two types of flying leads; one which provides a bulkhead mounted antenna connector and one which provides a bulk head mounted antenna. The type you choose will be determined by the application. A flying lead system connects a U.FL coaxial lead to the radio‟s U.FL connector, the other end of the coax is attached to either a bulkhead mounted antenna connector or directly to an antenna that has an integrated bulkhead mount.  In either of the two cases, the use of this approach significantly reduces the antenna system development effort and provides for greater flexibility in the available antenna types and placement in the host system chassis. When using the flying lead antenna (integrated bulk head mounting), there are no connector choice restrictions for use with the FCC/IOC modular certification. However if the flying lead connector is used, the same restrictions as identified for the Host Mounted Antenna apply. There are many suppliers of flying lead antenna and connectors; Quatech‟s Airborne Antenna product line offers a range of antenna solutions. 6.4  Embedded Antenna Use of Embedded antenna can be the most interesting approach for M2M, industrial and medical applications. Their small form factor and absence of any external mounting provides a very compelling argument for their use. There is a downside to this antenna type and it comes with performance. Antenna performance for all of the embedded options will, in most cases, be less that that achievable with external antenna. This does not make them unusable; it will impact choice of antenna type and requires more focus on placement. The three main embedded antenna types are PCB embedded, chip (PCB mounted) and flying lead; each has its advantages and disadvantages (See Table 11).  Table 11 - Embedded Antenna Options Antenna Type Features Cost Size Availability Performance PCB Embedded Lowest Largest Custom Poor Chip Low Small Standard Poor Flying Lead Low Small Standard Fair
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  13 PCB Embedded – This approach embeds an antenna design into the host PCB. This approach is very common with add-in WiFi card (CF, PCMCIA, SDIO, etc.) as it requires no external connections and is the cheapest production approach. The lower production cost requires significant development cost and lack of performance and flexibility. Chip – The integration of a chip antenna is simple and requires a relatively small footprint on the host system, however, it does suffer from the same limitations of flexibility and performance seen with the PCB embedded approach. There are relatively large numbers of suppliers of this type of antenna; there is also a range of configuration and performance options. Flying Lead – This approach is similar to the flying lead solution for external antennas, the difference is that the form factors are smaller and provide a range of chassis and board mounting options, all for internal use. This approach suffers less from the performance and flexibility limitations of the other approaches, since the location of the antenna it not determined by the host PCB design. The assembly of a system using this approach maybe slightly more complex since the antenna is not necessarily mounted on the host PCBA. 6.5  Antenna Location The importance of this design choice cannot be over stressed; it can in fact be the determining factor between success and failure of the WiFi implementation.  There are several factors that need to be considered when determining location:   Distance of Antenna from radio   Location of host system  Proximity to RF blocking or absorbing materials  Proximity to potential noise or interference  Position relative to infrastructure (Access Points or Laptops)   Orientation of host system relative to infrastructure  Is it known  Is it static To minimize the impact of the factors above the following things need to be considered during the development process:   Minimize the distance between the radio and the location of the antenna. The coaxial cable between the two impacts the Transmit Power and Receive Sensitivity negatively. Quatech recommends using 1.32-1.37mm outer diameter U.FL coaxial cables.   Minimize the locations where metal surfaces come into contact or are close to the location of the antenna.   Avoid locations where RF noise, close to or over lapping the ISM bands, may occur. This would include microwave ovens and wireless telephone systems in the 2.4GHz and 5.0GHz frequency range.   Mount the antenna as high on the equipment as possible.
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  14   Locate the antenna where there is a minimum of obstruction between the antenna and the location of the Access Points. Typically Access Points are located in the ceiling or high on walls.  Keep the main antenna‟s polarization vertical, or in-line with the antenna of the Access Points. 802.11 systems utilize vertical polarization and aligning both transmit and receive antenna maximizes the link quality. Even addressing all of the above factors, does not guarantee a perfect connection, however with experimentation an understanding of the best combination will allow a preferred combination to be identified. 6.6  Performance Performance is difficult to define as the appropriate metric changes with each application or may indeed be a combination of parameters and application requirements. The underlying characteristic that, in most cases, needs to be observed is the link quality. This can be defined as the bandwidth available over which communication, between the two devices, can be performed, the lower the link quality the less likely the devices can communicate. Measurement of link quality can be made in several ways; Bit Error rate (BER), Signal to Noise (SNR) ratio, Signal Strength and may also include the addition of distortion. The link quality is used by the radio to determine the link rate, generally as the link quality for a given link rate drops below a predefined limit, the radio will drop to the next lowest link rate and try to communicate using it. The reciprocal is also true, if the radio observes good link quality at one rate it will try to move up to the next rate to see if communication can be sustained using it. It is important to note that for a given position the link quality improves as the link rate is reduced. This is because as the link rate drops the radios Transmit power and Receive sensitivity improve. From this is can be seen the looking at the link rate is an indirect way of assessing the quality of the link between the device and an Access Point. You should strive to make the communication quality as good as possible in order to support the best link rate. However be careful not to over specify the link rate. Consider your applications bandwidth requirements and tailor your link rate to optimize the link quality e.g. the link quality for a location at 6Mb/s is better than it would be for 54Mb/s, if the application only needs 2Mb/s of data throughput, the 6Mb/s rate would provide a better link quality. Aside from the radio performance, there are a number of other things that contribute to the link quality; these include the items discussed earlier and choices made when looking at the overall antenna gain. The antenna gain contributes to the Equivalent Isotropically Radiated Power (EIRP) of the system. This is part of an overall measurement of the link quality called link margin. Link Margin provides a measure of all the parts of the RF path that impact the ability of two systems to communicate. The basic equation looks like this:
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  15 EIRP (dB) = TxP + TxA – TxC Link Margin (dB) = EIRP – FPL + (RxS + RxA – RxC) Where:  TxP = Transmitter output power (dBm) TxA = Transmitter antenna gain (dBi) TxC = Transmitter to Antenna coax cable loss (dB) FPL = Free Path Loss (dB) RxS = Receiver receive sensitivity (dBm) RxA = Receiver antenna gain (dBi) RxC = Receiver to Antenna coax cable loss (dB) This is a complex subject and requires more information that is presented here, Quatech does recommend at least looking at the subject and evaluating any system at a basic level. It is then possible, with a combination of the above items and an understanding of the application demands, to achieve a link quality optimized for the application and host design. It is important to note that this is established with a combination of hardware selection, design choices and configuration of the radio.
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  16 7.0  Bluetooth Coexistence Interface The Bluetooth coexistence interface implemented on the Airborne 802.11b/g WLRG-RA-DP600 family of radio‟s is a three wire configuration, designed to support the identified coexistence recommended practices in the IEEE 802.15.2 standard for the coexistence of WLAN and Bluetooth devices. This includes collaborative TDMA method described as Packet Traffic Arbitration (PTA).  The Airborne radio includes a PTA Controller integrated into the BB/MAC processor; this requires the Bluetooth device to act as a PTA slave to the PTA control module. Table 12 - BT Interface Pin Definition Signal Direction Description RF_ACTIVE (Active High) Input Asserted by the BT device during Rx or Tx slots that it wishes to use. STATUS Input Pulsed if the BT device has a priority need for the slot. After that it indicates the BT radio mode (Tx or RX) TXCONF (Active Low) Output Transmission confirmed. De-asserted when the radio wants to prevent the BT device‟s use of the medium
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  17 8.0  GSPI Interface The General Serial Peripheral Interface (GSPI) for the WLRG-RA-DP601 is detailed in the following section. The interface is powered by the VHIO (pin 4 & 6) supply as defined in Table 2. 8.1  SPI Protocol Timing The following figures and table define the required timing for the GSPI interface. Figure 2 - GSPI Timing Diagram SPI Clock (CLK)SPI Select (DATA0)SPI Data Out (DATA1)SPI Data In (CMD)TCSS  TSCLK  TCSH TWR  TWF TWH  TWLTSU TH TVHi-ZVALID DATA IN Figure 3 - GSPI Inter-Transaction Timing SPI Select (DATA0)TCRFlll lll
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  18 Table 13 - GSPI Protocol Timing Values Symbol Parameter Min Typ Max Units TSCLK Clock period  20   ns TWH Clock High 5   ns TWL Clock Low 9   ns TWR Clock Rise Time   1 ns TWF Clock Fall Time   1 ns TH Serial Data In Hold Time 2.5   ns TSU Serial Data In Setup Time 2.5   ns TV Serial Data Out Hold Time 5   ns TCSS Chip Select Low to Clock Valid 5   ns TCSH Clock Rise or Fall to Chip Select High 0   ns TCRF Chip select High to Chip Select Low 400   ns
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  19 9.0  SDIO Interface The Serial Data Input Output (SDIO) interface for the WLRG-RA-DP601 is detailed in the following section. The interface is powered by the VHIO (pin 4 & 6) supply as defined in Table 2. The interface is compliant to v1.0 of the SDIO interface standard. 9.1  SDIO Protocol Timing The following figures and table define the required timing for the SDIO interface. Figure 4 – SDIO Protocol Timing Diagram SDIO ClockData OUTData INtODLYfPPtWLData OUTData INtWHtISU tIH Figure 5 – SDIO Protocol Timing Diagram – High Speed SDIO ClockData OUTData INtOHfPPtWLData OUTData INtWHtODLYtISU tIH
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  20 Table 14 - SDIO Protocol Timing Values Symbol Parameter Condition Min Typ Max Units fPP Clock Frequency Normal 0  25 MHz High Speed 0  50 MHz TWL Clock Low Normal 10   ns High Speed 7   ns TWH Clock High Normal 10   ns High Speed 7   ns TISU Input Setup Time Normal 5   ns High Speed 6   ns TIH Input Hold Time Normal 5   ns High Speed 2   ns TODLY Output Delay Time  0  14 ns TOH Output Hold Time High Speed 2.5   ns
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  21 10.0  Mechanical Outline Figure 6 - Mechanical Outline 29.00mm25.00mm12.50mmMolex 53748-0308BOTTOM VIEW17.00mm8.50mm 1.20mm21.00mmØ1.85mmTOP VIEW2.50mm5.87mm0.80mm12.00mm4.50mm802.11 Antenna Connector129230 Radio Connector:   0537480308 (Molex)  (0.50mm (.020") Pitch SlimStack™ Plug, Surface Mount, Dual Row, Vertical, 3.00mm (.118") Stack Height, 30 Circuits) Board Connector:  0529910308   (0.50mm (.020") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, Vertical, 3.00mm (.118") Stack Height, 30 Circuits) RF Connector:  U.FL   (Hirose, Ultra Small Surface Mount Coaxial Connector) Mounting Screw:  M1.6, 0.35mm pitch, 6-8mm length, Stainless Steel   (McMaster-Carr Part# 91800A008) Mounting Nut:  M1.6, 0.35mm Pitch, Hex, Stainless Steel   (McMaster-Carr Part# 91828A006) Spacer:  3mm, OD 3-4 mm, ID 2–2.5mm  (Bivar Part# 9913-3mm, Nylon 3mm , 2.3mm ID, 4.7mm OD)
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  22 11.0  Design Guidelines The WLRG-RA-DP601 is designed for integration in to a wide range of advanced electronic systems and diverse applications, the success of the integration and final performance of the complete system depends upon the integration process and hardware design, the following section provides a set of guidelines to aid in the integration of the radio. The following guidelines address hardware design requirements for the integration of the radio under normal conditions, should your application not be able to support the listed guidelines please contact Quatech. 11.1  VDD/VHIO Power Supply The WLRG-RA-DP601 supports a split power supply; it requires both a VHIO and VDD power supply to function correctly. VHIO defines the power domain that supports the host interface and must be powered to support the mating interface on the host. It will support both a 1.8VDC and 3.3VDC supply rail. VDD is the main power supply for the radio and supplies all aspects of the radio with the exception of the host interface. The VDD is a 3.3VDC supply, please refer to Table 6 for the power supply requirements.  If the SDIO interface is being used the radio supports the power specification as defined by the SDIO interface specification, no additional power supply support is required. It is acceptable to supply VHIO from the VDD power rail if the host supports a 3.3VDC interface. The full interface specification can be referenced in Table 7. 11.2  SDIO (pin #5) This pin defines the host interface boot definition for the radio, defining either a SDIO or SPI interface. This pin should be configured as shown in Table 15 for the radio to boot successfully. Table 15 - SDIO (Pin #5) Configuration Options    Figure 7 show the recommended network for the pin. SDIO Mode Description SPI Pin must be pulled to ground. SDIO Pin must be pulled to VDD.
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  23  Figure 7 - SDIO (Pin #5) Configuration Options 100KSDIOVDD0SDIOR1SPIR2üDNPR1R2üDNP 11.3  WLNAPU (pin #16) This pin should be pulled to VHIO through a 100K resistor, as shown in Fig XX. Figure 8 - WLNAPU (Pin #16) Network 100KTo HostWLNAPUVHIO
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  24 11.4  SPI_RSTn (pin #18) This pin should be pulled to VHIO through a 100K resistor, as shown in Figure 9. Figure 9 - SPI_RSTn (Pin #18) Network 100KTo HostSPI_RSTnVHIO
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  25 11.5  Recommended PCB Layout The following outlines Quatech‟s recommendations for layout of the PCB for the WLRG-RA-DP601, these are guidelines only and should serve as guidance when designing the host system board.  If there are questions relating to the guidelines please contact Quatech Technical Support. Figure 10 - Recommended PCB Layout Board OutlineMolex 52991-0308Ø1.85mm17.00mm1.20mm29.00mm25.00mm12.50mm8.50mm21.00mm2930 21
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  26 Figure 11 - Recommended Connector Footprint 1.10mm2.20mm±0.10mm30 20.25mm±0.05mm290.50mm±0.05mm1.80mm±0.10mm1 11.6  Mechanical Mounting It is recommended that mechanical mounting, other than the mated connector, be used to secure the radio to the host system. The radio includes four (4) holes specifically for this purpose. These holes are provides in the four corners and are unplated, this allows the use of metallic mounting systems without impacting the electrical performance of the unit. The mounting holes can be seen in Fig, they are 1.85mm in diameter. A mechanical spacer will be required to maintain the physical separation of the board from the host and aid in ensuring optimal interference in the connector. The height of the spacer should be 3mm±0.1mm. The material should not be easily compressed. 11.7  EMI/EMF Guidelines To minimize electromagnetic interference (EMI) and radio frequency interference (RFI), pay strict attention to power and signal routing near the Radio. As much as possible, the keep-clear area below the Radio should be a solid copper ground plane. It is anticipated that the Radio will be mounted on a board with a committed ground plane. Ensure the PCB interconnect has a designed impedance of 50-75 Ohms. To keep signal impedance as low as possible, connect the ground plane to internal ground planes by several vias. Ground signals to the Radio connector should connect directly to the ground plane below the Radio. Individual ground connections to the Radio should have a solid ground connection, preferably directly to the ground plane on the same surface side where the Radio resides. Do not connect ground pins directly to an inside layer ground plane using vias only.
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  27 Keep interconnects from the Radio connector as short as possible on the mounting layer. All inboard signals–including pin numbers–must immediately transition to a different routing layer using a via as close to the connector as possible. Outboard signals (odd pin numbers) should also be kept to a minimum length.
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  28 12.0  Certification & Regulatory Approvals The unit complies with the following agency approvals: Table 16 - Regulatory Approvals Country Standard Status North America (US & Canada) FCC Part 15, Sec. 15.107, 15.109, 15.207, 15.209, 15.247 RSS-210 Modular Approval Granted Europe EN60950 inc. A1, A2, A3, A4 ETSI EN 300 328 Part 1 V1.2.2 (2000-07) ETSI EN 300 328 Part 2 V1.1.1 (2000-07) ETSI EN 301 893 V1.2.1 (2002-07) ETSI EN 301 489-1 V1.4.1 (2002-08) ETSI EN 301 489-17 V1.4.1 (2000-09) Pending Japan ARIB STD-T71 v1.0, 14 (Dec 2000) ARIB RCR STD-T33 (June 19, 1997) ARIB STD-T66 v2.0 (March 28, 2002) Pending 12.1  FCC Statement This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules.  These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:   Reorient or relocate the receiving antenna.   Increase the separation between the equipment and receiver.   Connect the equipment to an outlet on a circuit different from that to which the receiver is connected.   Consult the dealer or an experienced radio/TV technician for assistance. 12.2  SAR Statement The WLRG-RA-DP601 has been tested for body-worn Specific Absorption Rate (SAR) compliance. The FCC has established detailed SAR requirements and has established that these requirements have been met while the WLRG-RA-DP601 was installed in a host representative host system.
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  29 12.3  RF Exposure Information The radio module has been evaluated under FCC Bulletin OET 65C (01-01) and found to be compliant to the requirements as set forth in CFR 47 Sections, 2.1093, and 15.247 (b) (4) addressing RF Exposure from radio frequency devices. This model meets the applicable government requirements for exposure to radio frequency waves. The highest SAR level measured for this device was 0.993 W/kg (802.11b) and 0.442 W/Kg (802.11g). For the limited modular approval if the device is used less than 20 cm from persons (i.e. portable) then the antenna must be mounted outside of the host. If the device is used more than 20cm from persons (i.e. mobile) then the antenna does not need to be mounted outside of the host. Certified antennas include: Company Description Part No. L-Com 2.2 dBi Omni-directional, 2.4GHz, RP-SMA, Rubber Duck HG2402RD-RSF 12.4  Information for Canadian Users (IC Notice) This device has been designed to operate with an antenna having a maximum gain of 5dBi for 802.11b/g band. An antenna having a higher gain is strictly prohibited per regulations of Industry Canada. The required antenna impedance is 50 ohms. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (EIRP) is not more than required for successful communication. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. 12.5  FCC/IOC Limited Modular Approval This document describes the Airborne WLN FCC limited modular approval and the guidelines for use as outlined in FCC Public Notice (DA-00-1407A1).  The WLRG-RA-DP601 is covered by the following limited modular grants: Country Standard Grant North America (US) FCC Part 15 Sec. 15.107, 15.109, 15.207, 15.209, 15.247 Modular Approval F4AWLRG601 Canada RSS 210 Modular Approval 3913A-WLRG601  By providing FCC limited modular approval on the Airborne radio modules, our customers are relieved of any need to perform FCC part15 subpart C Intentional
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  30 Radiator testing and certification, except where they wish to use an antenna that is not already certified.  Quatech supports a group of pre-approved antenna; use of one of these antennas eliminates the need to do any further subpart C testing or certification. If an antenna is not on the list, it is a simple process to add it to the pre-approved list without having to complete a full set of emissions testing. Please contact Quatech Technical support for details of our qualification processes. Please note that as part of the FCC requirements for the use of the modular approval, the installation of any antenna must require a professional installer. This is to prevent any non-authorized antenna being used with the radio. There are ways to support this requirement but the most popular is to utilize a non-standard antenna connector, this designation includes the reverse polarity versions of the most popular RF antenna types (SMA, TNC, etc.). For more details please contact Quatech. The following documents are associated with this applications note:   FCC Part 15 – Radio Frequency Devices  FCC Public Notice – DA-00-1407A1  (June 26th, 2000) Quatech recommends that during the integration of the radio, into the customers system, that any design guidelines be followed. Please contact Quatech Technical Support if you have any concerns regarding the hardware integration. Contact Quatech Technical support for a copy of the FCC and IOC grant certificates, the test reports and updated approved antenna list. 12.6  Regulatory Test Mode Support The WLRG-RA-DP601 includes support for all FCC, IC and ETSI test modes required to perform regulatory compliance testing.  Please contact Quatech Technical Support for details on enabling and using these modes.
Product Brief – Airborne SDIO/SPI 802.11b/g Radio    Quatech, Inc. 846-8310-240  June 2010  31 13.0  Change Log The following table indicates all changes made to this document: Version Date Section Change Description Author A 2/11/2007 - Internal Release ACR B 2/19/2007 4.0 Updated Table 2.0 ACR 1.3 3/12/2008 - Changed revision numbering from Alpha to Numeric ACR 2.0 Updated block diagram to remove BT RF connector. 4.0 Updated Table 2.0 to reflect updated pin out. Updated Connector reference diagram to remove BT connector. 7.0 Updated Fig 2.0 to remove BT U.FL connector. 1.4 3/21/2008 4.0 Updated Table 2.0 ACR 5.0 Updated Table 6.0, 7.0 and 10 with tested values. Updated notes. 7.0 Updated Fig 2.0 mechanical Outline with new pin #1 identifier. 8.0 Added section 9.0 Added section 1.5 5/8/2008 1.0 Fig 1.0 updated to actual radio image. ACR 8.0 Fig 3.0 was updated to reflect 10K ohm resistor and modified population table. 1.6 6/31/2008 7.0 Added Bluetooth Coexistence Interface section. ACR 9/17/2008 8.0 Added GSPI Section, incremented all sections above. 1.7 11/21/2008 Title Updated title to include product part number ACR 4.0 Updated tables 2.0 and 4.0 to correct issues with SPI interface description. 8.1 Updated Fig 2 & 3 to reflect changes to SPI interface description. 2.0 3/31/09 Title Removed „Preliminary‟ ACR 5.0 Updated Table 10 with RevB test data. 11.0 Typographical correction 2.1 6/17/2009 5.0 Added Note 2 to Table 5.0 ACR 10.4 Changed Figure reference to identify correct diagram. 11.0 Deleted RESETSection. 2.2 1/31/2010 3.0 Note 1 of Table 1: Correct pin reference from pin 6 to pin 5. ACR 10.0 Updated mounting hardware reference. 2.3 6/22/2010 12 Updated with FCC/IC regulatory information upon approval. CHM 2.4 6/28/2010 12 Added SAR certification notice. Changed FCC/IC approval to limited modular. ACR

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