Benq H10 Module User Manual H10 Manual 20070813

Benq Corporation Module H10 Manual 20070813

Manual

1 Datasheet H10 (Data-Only) HSDPA PCI Express mini card module Datasheet Rev. 0.2 (Preliminary) 2007/06/22 COPYRIGHT BENQ Corporation This document contains proprietary technical information which is the property of BenQ Corporation and is issued in strict confidential and shall not be disclosed to others parties in whole or in parts without written permission of BenQ Corporation The documents contain information on a product, which is under development and is issued for customer evaluation purposes only. BENQ may make changes to product specifications at any time, without notice.
2 BenQ Corporation Mobile Communications BG 18 JiHu Road, Nei-Hu, Taipei 114, Taiwan, R.O.C. Tel: +886-2-2799-8800 Fax: +886-2-2656-6390 http://www.BenQ.com HISTORY Version Date Notes VER: 0.1 2007-APR-24 FIRST RELEASE VER: 0.2 2007-JUN-22 Update characteristic of RF
3 1. INTRODUCTION..................................................................................................... 4 1.1 Description.........................................................................................................4 1.2 Application Device..............................................................................................4 2. FEATURES ............................................................................................................... 5 2.1 General Characteristics .......................................................................................5 2.2 RF Functionalities...............................................................................................6 Maximum TX Power ........................................................................................6 Parametric Performance ...................................................................................6 Sensitivity .........................................................................................................7 Radio Frequency...............................................................................................7 3. HARDWARE DESCRIPTION..................................................................................... 9 3.1 System Interface..................................................................................................9 3.2 Functional Diagram.......................................................................................... 10 3.3 Pin Description................................................................................................. 11 3.4 Terminal Definition .......................................................................................... 13 3.5 Electrical Characteristics ................................................................................... 15 DC characteristics........................................................................................... 15 Digital interface .............................................................................................. 16 USB Transceiver DC characteristics................................................................. 16 USIM Interface ............................................................................................... 17 3.6 Environmental.................................................................................................. 17 3.7 Physical Package ............................................................................................... 18 4. SOFTWARE CHARACTERISTICS ............................................................................ 21 4.1 Introduction ..................................................................................................... 21 4.2 Software Architecture........................................................................................ 21 5.1 Compliance with FCC Rules and Regulations
4 1. INTRODUCTION 1.1 Descrip便ion Overview This document describes all the functions, features, and interfaces of the HSDPA PCI Express Mini Card Module -- H10 from BenQ. BenQ H10 HSDPA module supports Tri-band WCDMA/HSDPA and Quad-band GSM/GPRS/EDGE network connection capability. BenQ H10 HSDPA card can provides high speed data connection, and the data speed of downlink path is up to 7.2Mbps. Furthermore, users can ease to use this module by using the “Qsyncher” application software that we provide for Windows XP and Vista system. With the BENQ H10 HSDPA module, devices are enhanced in both functionality and usability based on state of the art wireless technology. 1.2 Applica便ion Device Scope BenQ H10 module is a high speed modem card with PCI Express minicard form factor and is focusing on the Notebook, UMPC, MID and other portable device marketing. 汗 No便ebook 汗 Ul便ra Mobile PC 汗 Mobile In便erne便 Device 汗 Wireless Rou便er 汗 USB Modem 汗 Car Embedded Sys便em
5 2. FEATURES 2.1 General Charac便eris便ics BAND: GSM850/EGSM900/DCS1800/PCS1900/WCDMA850/WCDMA1900/WCDMA2100 Band TX RX GSM850 824~849 MHz 869~894MHz EGSM900 880~915 MHz 925~960MHz DCS1800 1710~1785MHz 1805~1880MHz PCS1900 1850~1910MHz 1930~1990MHz WCDMA850 824~849 MHz 869~894MHz WCDMA1900 1850~1910MHz 1930~1990MHz WCDMA2100 1920~1980MHz 2110~2170MHz Support SIM Interface: 1.8V/3V Form factor i. Dimension: 50.95 x 30 x 5.0 mm ii. Weight: 12g Power Operation Voltage: 3.3V +/- 9% Power Consumption: Speech Mode: Band Typ Max Unit GSM850 / PCL=5 385 400 mA EGSM900 / PCL=5 395 410 mA DCS / PCL=0 312 325 mA PCS / PCL=0 280 295 mA WCDMA (all band) 720 820 mA Standby Mode: Typ (Average) Max (Average) Unit GSM / Page frame=2 3.5 4.5 mA GSM / Page frame=9 2.0 3 mA DCS / Page frame=2 3.5 4.5 mA DCS / Page frame=9 2.0 3 mA PCS / Page frame=2 3.5 4.5 mA PCS / Page frame=9 2.0 3 mA WCDMA / DRX=6 (0.64 S) 3.6 4.5 mA WCDMA / DRX=9 (5.12 S) 1.5 3 mA
6 Hardware Interface: 52 Pins PCI Express Mini Card connector interface 2 RF Antenna Coaxial Connectors Software Interface: USB driver Qsyncher software tool. 2.2 RF Func便ionali便ies Maximum TX Power The performance of the transmitter meets test requirement ETSI TS 151 010-1 chapter 13.3 for GSM, chapter 13.17.3 for EDGE and TS 34.121 chapter 5.2&5.4.3 for WCDMA, chapter 5.2A for HSDPA Band Max Min GSM8S0 33 dBm ±2dBm S dBm ±SdBm EGSM 33 dBm ±2dBm S dBm ±SdBm DCS 30 dBm ±2dBm 0 dBm ±SdBm PCS 30 dBm ±2dBm 0 dBm ±SdBm GSM8S0(EDGE) 27 dBm ±3dBm S dBm ±SdBm EGSM(EDGE) 27 dBm ±3dBm S dBm ±SdBm DCS(EDGE) 26 dBm ±3dBm 2 dBm ±SdBm PCS(EDGE) 26 dBm ±3dBm 2 dBm ±SdBm UMTS-2100 24 dBm +1/-3dBm Less than -S0dBm UMTS-1900 24 dBm +1/-3dBm Less than -S0dBm UMTS-8S0 24 dBm +1/-3dBm Less than -S0dBm 1/1S βo/βd 12/1S (HS-DPCCH) 24 dBm +1/-3dBm 13/1S βo/βd 1S/8 (HS-DPCCH) 23 dBm +2/-3dBm 1S/7 βo/βd 1S/0 (HS-DPCCH) 22 dBm +3/-3dBm Parame便ric Performance Tests carried out at -20ºC, 25ºC and 60ºC for each voltage 3V, 3.3V and 3.6V. The Measured Peak Phase, RMS Phase, frequency error, power level, and static sensitivity meets ETSI TS 151 010-1 chapter 13.1 for GSM and TS 34.121 chapter 5.13.1 for WCDMA, chapter 5.13.1A for HSDPA Band (GSM) Peak Phase Error RMS Phase Error GSM8S0 <20° <S° EGSM <20° <S° DCS <20° <S° PCS <20° <S° Band (WCDMA) Error Vector Magnitude UMTS-2100(HS-DPCCH) <17.S% UMTS-1900(HS-DPCCH) <17.S% UMTS-8S0(HS-DPCCH) <17.S%
7 Sensi便ivi便y The performance of the receiver meets test requirement ETSI TS 151 010-1 chapter 14.2.1 for GSM, chapter 14.18.1 for EDGE and TS 34.121 chapter 6.2 for WCDMA. Band Typical Min GSM8S0 -107 dBm -104 dBm EGSM -107 dBm -104 dBm DCS -107 dBm -103 dBm PCS -107 dBm -103 dBm EDGE(GMSK modulation) -107 dBm -104 dBm EDGE(8-PSK modulation) -104 dBm -102 dBm UMTS-2100(Primary) -109 dBm -106.7 dBm UMTS-2100(Secondary) -109 dBm N/A UMTS-1900 -107 dBm -104.7 dBm UMTS-8S0(Primary) -109 dBm -106.7 dBm UMTS-8S0(Secondary) -109 dBm N/A Radio Frequency GSM850 (850 MHz) Frequency Range TX 824-849 MHz; RX 869-894 MHz Channel Spacing 200 KHz Number of Channels 124 Carriers x 8 (TDMA) Modulation GMSK / 8-PSK Duplex Spacing 4S MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 33 dBm Class 8 (2 W peak) – S dBm Output Impedance S0 Ohm Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz) EGSM (900 MHz) Frequency Range TX 880-91S MHz; RX 92S-960 MHz Channel Spacing 200 KHz Number of Channels 124 Carriers x 8 (TDMA) Modulation GMSK / 8-PSK Duplex Spacing 4S MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 33 dBm Class 8 (2 W peak) – S dBm Output Impedance S0 Ohm Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz) DCS (1800 MHz) Frequency Range TX 1710-178S MHz; RX 180S-1880 MHz Channel Spacing 200 KHz Number of Channels 374 Carriers x 8 (TDMA) Modulation GMSK / 8-PSK Duplex Spacing 9S MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 30 dBm – 0 dBm
8 Output Impedance S0 Ohm Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz) Compatible with phase 2 feature PCS (1900 MHz) Frequency Range TX: 18S0~1910MHz; RX: 1930~1990MHz Channel Spacing 200KHz Number of Channels 299 Carriers x 8 (TDMA) Modulation GMSK / 8-PSK Duplex Spacing 80 MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 30 dBm – 0 dBm Output Impedance S0 Ohm Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz) Compatible with phase 2 feature WCDMA_IMT (2100 MHz) Frequency Range TX: 1920~1980MHz; RX: 2110~2170MHz Channel Raster 200KHz Number of Channels 299 Carriers x 8 (TDMA) Modulation QPSK Duplex Spacing 190 MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 24 dBm +1/-3dBm - less than -S0dBm Output Impedance S0 Ohm Spurious Emission -67dBm(92S-93SMHz);-79dBm(93S-960MHz);-71dBm(180S-1880MHz) ;-60dBm(184S-1880MHz);-41dBm(188S-1920MHz) WCDMA_PCS (1900 MHz) Frequency Range TX: 18S0~1910MHz; RX: 1930~1990MHz Channel Raster 200KHz Number of Channels 299 Carriers x 8 (TDMA) Modulation QPSK Duplex Spacing 80 MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 24 dBm +1/-3dBm - less than -S0dBm Output Impedance S0 Ohm Spurious Emission WCDMA_850 (850 MHz) Frequency Range TX 824-849 MHz; RX 869-894 MHz Channel Raster 200KHz Number of Channels 299 Carriers x 8 (TDMA) Modulation QPSK Duplex Spacing 4S MHz Frequency Stability +/- 0.1 ppm (Uplink TX) Power Output 24 dBm +1/-3dBm - less than -S0dBm Output Impedance S0 Ohm Spurious Emission -60dBm(869-894MHz;1930-1990MHz;2110-21SSMHz)
9 3. HARDWARE DESCRIPTION 3.1 Sys便em In便erface The I/O connectors of H10 module are PCI EXPRESS MINI CARD and two RF antenna connectors. Table 3-1 summarizes the 25 signals and 18 power lines that are supported by the PCI Express Mini Card System Interface. Table 3-2 shows the antenna interface. Table 3-1 System Interface Signal Group Pin no. Description Power S 3.3V power source GND 13 Return current path USB 2 USB serial data interface compliant to the USB 2.0 specification PERST# 1 Function reset to the card W_DISABLE# 1 Shutdown the HSDPA module UIM 4 SIM function LED 3 Status indicators Table 3-2 Antenna interface Signal Group Connector no. Description ANT 2 Antenna interface
1 3.2 Func便ional Diagram
1 3.3 Pin Descrip便ion Pin Signal name Direction Description 1 NC No connect 2 +3.3Vaux Power 3.3V power source 3 NC No connect 4 GND Power Return current path 5 NC No connect 6 NC No connect 7 NC No connect 8 UIM_PWR Output Power source for the USIM 9 GND Power Return current path 10 UIM_DATA Input / Output USIM data signal 11 NC No connect 12 UIM_CLK Output USIM clock signal 13 NC No connect 14 UIM_RESET Output USIM reset signal 15 GND Power Return current path 16 NC No connect 17 NC No connect 18 GND Power Return current path 19 NC No connect 20 W_DISABLE# Input Active low signal. This signal is used by the system to shutdown the HSDPA module. 21 GND Power Return current path 22 PERST# Input Active low signal. Function reset to the card. 23 NC No connect 24 +3.3Vaux Power 3.3V power source 25 NC No connect 26 GND Power Return current path 27 GND Power Return current path 28 NC No connect 29 GND Power Return current path 30 NC No connect 31 NC No connect
1 32 NC No connect 33 NC No connect 34 GND Power Return current path 35 GND Power Return current path 36 USB_D- Input / Output USB serial data interface (negative) 37 GND Power Return current path 38 USB_D+ Input / Output USB serial data interface (postive) 39 +3.3Vaux Power 3.3V power source 40 GND Power Return current path 41 +3.3Vaux Power 3.3V power source 42 LED_WWAN# Output Active low signal. WAN status LED driver. 43 GND Power Return current path 44 LED_WLAN# Output Active low signal. LAN status LED driver. 45 NC No connect 46 LED_WPAN# Output Active low signal. PAN status LED driver. 47 NC No connect 48 NC No connect 49 NC No connect 50 GND Power Return current path 51 NC No connect 52 +3.3Vaux Power 3.3V power source
1 3.4 Terminal Defini便ion Recommend an便enna connec便 Hirose Coaxial Connectors
1 Sys便em connec便or 52 pins PCI Express Mini Card
1 3.5 Elec便rical Charac便eris便ics DC charac便eris便ics Pin Function/ Name Direction Parameter Min Typ Max Unit1 NC 2 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V 3 NC 4 GND Power Ground S NC 6 NC 7 NC Supply Voltage 1.S 2.8S 3.0S V 8 UIM_PWR Output Current 1S0 mA9 GND Power Ground 10 UIM_DATA Input / Output 11 12 NC UIM_CLK Output 13 NC 14 UIM_RESET Output 1S GND Power Ground 16 NC 17 NC 18 GND Power Ground 19 NC Logic High Input Voltage 1.69 2.6 2.9 V 20 W_DISABLE# Input Logic Low Input Voltage -0.3 0 0.91 V 21 GND Power Ground Logic High Input Voltage 1.69 2.6 2.9 V 22 PERST# Input Logic Low Input Voltage -0.3 0 0.91 V 23 NC 24 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V 2S NC 26 GND Power Ground 27 GND Power Ground 28 NC 29 GND Power Ground 30 NC 31 NC
1 32 NC 33 34 NC GND Power Ground 3S GND Power Ground 36 USB_D- Input / Output Termination Voltage 3.0 3.3 3.6 V 37 GND Power Ground 38 USB_D+ Input / Output Termination Voltage 3.0 3.3 3.6 V 39 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V 40 GND Power Ground 41 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V 42 LED_WWAN# Output Driver current 0 1S0 mA43 GND Power Ground 44 LED_WLAN# Output Driver current 0 1S0 mA4S NC 46 LED_WPAN# Output Driver current 0 300 mA47 NC 48 NC 49 NC S0 GND Power Ground S1 NC S2 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V Digi便al in便erface Parameter Min Typ Max Unit Logic High Input Voltage 1.69 2.6 2.9 V Logic Low Input Voltage -0.3 0 0.91 V Logic High Output Voltage 2.1S 2.6 2.6 V Logic Low Output Voltage -0.3 0 0.4S V USB Transceiver DC charac便eris便ics The USB interface is powered from 3.3V power source. Parameter Comments Min Typ Max Unit Input sensitivity (differential) |D+ D-|, VIN=0.8 to 2.SV 0.2 V Output voltage Logic LOW Logic HIGH RL=1.SKΩ to 3.6V RL=1.SKΩ to GND, IO=1mA 2.8 0.3 3.6 V V Series output resistance D+, D- 28 33 44 Ω
1 Internal pull-up resistor 3.3V to D+, 3.3V to D- 1.42S 1.S 1.S7S KΩ Internal pull-down resistor D+ to GND, D- to GND 14.3 1S 24.8 KΩ USIM In便erface The USIM signals are defined on system connector to provide the interface between the removable User Identity Module. USIM interface usually run off either 1.8V or 3.0V. Pin Name Direction Description 8 UIM_PWR Output Power source for the USIM 10 UIM_DATA Input / Output USIM data signal 12 UIM_CLK Output USIM clock signal 14 UIM_RESET Output USIM reset signal Parameter Comments Min Typ Max Unit Logic High Input Voltage 1.8S2S 2.8S 3.1S V Logic Low Input Voltage -0.3 0 0.997S V Logic High Output Voltage 2.4 2.8S 2.8S V Logic Low Output Voltage -0.3 0 0.4S V Schmitt Hysteresis 1S0 mV Logic input leakage current -200 200 nA Internal pull-up resistor Programmable range 1 30 KΩ 3.6 Environmen便al Operational temperature: -20 ~ +60 Functional temperature: -20 ~ +70 Storage temperature: -40 ~ +85
1 3.7 Physical Package Top View
1 Bo便便om View
2 Side View
2 4. SOFTWARE CHARACTERISTICS 4.1 In便roduc便ion We provide the PC Tool – Qsyncher for H10 HSDPA card. The main functions in this tool are Contacts (only SIM card), SMS, Settings, and QMI. QMI is the independent network software; user can run this service alone without Qsycher active. 4.2 Sof便ware Archi便ec便ure
2 5 Compliance with FCC Rules and Regulations 15.21 Federal Communications Commission (FCC) Statement You are cautioned that changes or modifications not expressly approved by the part responsible for compliance could void the user’s authority to operate the equipment. 15.105(b) Federal Communications Commission (FCC) Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. You are cautioned that changes or modifications not expressly approved by the party responsible for compliance could void your authority to operate the equipment. Operation is subject to the following two conditions: 1) this device may not cause interference and 2) this device must accept any interference, including interference that may cause undesired operation of the device.
2 FCC RF Radiation Exposure Statement: 1. This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20 centimeters between the radiator and your body. OEMs who install this module into an enclosure where the module’s FCC ID label is not visible from the outside of the enclosure must label the enclosure with these words: ‘Contains Transmitter Module FCC ID: JVPH10.’ Failure to follow these labeling instructions makes the OEM subject to sanctions from the FCC.”

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