Bilian Electronic R8192EU6 WLAN 11b/g/n USB MODULE User Manual
Shenzhen Bilian Electronic Co., Ltd. WLAN 11b/g/n USB MODULE
User manual
WLAN 11b/g/n USB MODULE BL‐R8192EU6 Version: 0.1 Customer Date BL‐R8192EU6 Model Name Part NO. Blink Approve Field ENGINEER QC SALES Customer Approve Field ENGINEER QC MANUFACTORY PURCHASING B‐LINK ELECTRONIC CO., LTD in shenzhen Content Content.......................................................................................................................................................1 0. Revision History ......................................................................................................................................3 1. General Description.................................................................................................................................3 2. The range of applying..............................................................................................................................3 3. Product Specification ..............................................................................................................................3 3.1 Function Block diagram ............................................................................................................................. 3 3.2 Electrical and Performance Specification.................................................................................................. 4 3.3 DC Characteristic ....................................................................................................................................... 5 3.4 Product Photo............................................................................................................................................ 6 3.5 Mechanical Specification........................................................................................................................... 6 3.6 Product Pin Definition ............................................................................................................................... 7 4. Typical Solder Reflow Profile ...................................................................................................................8 5. Precautions for use .................................................................................................................................8 B‐LINK ELECTRONIC CO., LTD in shenzhen FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. The WLAN 11b/g/n USB MODULE is designed to comply with the FCC statement. FCC ID is S8JR8192EU6. The host system using WLAN 11b/g/n USB MODULE, should have label indicated it contain modular’s FCC ID:S8J-R8192EU6. This radio module must not installed to colocate and operating simultaneously with other radios in host system , additional testing and equipment authorization may be required to operating simultaneously with other radio. * RF warning for Mobile device: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. B‐LINK ELECTRONIC CO., LTD in shenzhen 0. Revision History Date 2015/08/22 Document Product revision revision V0.1 V0.1 Change Description Draft initial release 1. General Description BL‐R8192EU6 product is designed base on The Realtek RTL8192EU chipset . It uses a highly integrated single‐chip MIMO (Multiple In, Multiple Out) Wireless LAN (WLAN) solution for the wireless high throughput 802.11n specification. It combines a MAC, a 2T2R capable baseband, and RF in a single chip. It provides a complete solution for a high throughput performance wireless Lan controller. The RTL8192EU baseband implements Multiple Input, Multiple Output (MIMO) Orthogonal Frequency Division Multiplexing (OFDM) with 2 transmit and 2 receive paths (2T2R) and is compatible with the 802.11n specification. It supports fast receiver Automatic Gain Control (AGC) with synchronous and asynchronous control loops among antennas, antenna diversity functions, and adaptive transmit power control functions to obtain the better performance in the analog portions of the transceiver. 2. The range of applying MID, networking camera, STB GPS, E‐book, Hard disk player, Network Radios, PSP and other device which need be supported by wireless networking 3. Product Specification 3.1 Function Block diagram B‐LINK ELECTRONIC CO., LTD in shenzhen 3.2 Electrical and Performance Specification Item Description Product Name WLAN 11b/g/n USB MODULE Major Chipset RTL8192EU Host Interface USB2.0 Standard IEEE802.11b, IEEE 802.11g,IEEE 802.11n Frequency Range 2412‐2462MHz for 802.11b/g/n(HT20) ; 2422‐2452MHz for 802.11n(HT40) Modulation Type 802.11b: CCK, DQPSK, DBPSK 802.11g: 64‐QAM,16‐QAM, QPSK, BPSK 802.11n: 64‐QAM,16‐QAM, QPSK, BPSK Working Mode Infrastructure, Data Transfer Rate 1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120 ,135and maximum of 300Mbps Spread Spectrum IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum) IEEE 802.11g/n:OFDM (Orthogonal Frequency Division Multiplexing) Sensitivity @PER(Typical) 1M: ‐94dBm@8%PER 6M: ‐91dBm@10%PER 11M:‐86dBm@8%PER 54M:‐74dBm@10%PER 135M:‐68dBm@10%PER RF Power Ad‐Hoc 18dBm@11b,14dBm@11g ,13dBm@11n (Tolerance:+/‐2dB) B‐LINK ELECTRONIC CO., LTD in shenzhen Antenna type Connect to the external antenna through the IPEX The transmit distance Indoor 100M, Outdoor 300M, according the local environment Dimension(L*W*H) 40.0x 20.0x 3.2mm (LxWxH) Tolerance:+/‐0.2mm Power supply 3.3V +/‐0.2V Power Consumption standby mode 30mA@3.3V , TX mode 190mA@3.3V Clock source 40.00MHz Working Temperature ‐10ºC to +50ºC Storage temperature ‐40°C ~ +85°C 3.3 DC Characteristic Terms Contents Specification : IEEE802.11b Mode DSSS / CCK Data rate 1, 2, 5.5, 11Mbps DC Characteristics min Typ. max. unit TX mode 182 190 204 mA Rx mode 37 40 41 mA Sleep mode 28 30 32 mA Specification : IEEE802.11g Mode OFDM Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps DC Characteristics min Typ. max. unit TX mode 176 184 192 mA Rx mode 36 38 41 mA 29 31 mA Sleep mode 26 Specification : IEEE802.11n Mode OFDM Data rate 13.5,27,40.5,54,81,108,121.5,135Mbps DC Characteristics min Typ. max. unit TX mode 184 196 200 mA Rx mode 37 41 42 mA Sleep mode 26 30 32 mA B‐LINK ELECTRONIC CO., LTD in shenzhen 3.4 Product Photo TOP Bottom 3.5 Mechanical Specification Module dimension: Typical (W x L x H): 40.0mmx20.0mm x3.2mm Tolerance : +/‐0.2mm B‐LINK ELECTRONIC CO., LTD in shenzhen 3.6 Product Pin Definition B‐LINK ELECTRONIC CO., LTD in shenzhen 4. Typical Solder Reflow Profile 5. Precautions for use 1. Pls handle the module under ESD protection. 2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature 245℃. 3. Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours. Baking condition: 125 degree C, 12 hours Baking times: 1 time 4. Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity indicator cards must be blue, <30%.
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