Bilian Electronic R8723RB1 Bluetooth 150Mbps Wireless N USB Module User Manual

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Document ID	2734589
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Date Submitted	2015-09-01 00:00:00
Date Available	2015-09-01 00:00:00
Creation Date	2015-08-31 14:42:29
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Document Author:	sally.zhang

Product Specification
IEE802.11 b/g/n 2.4G 1T1R WIFI+BT V2.1+EDR/BT3.0/BT 3.0+HS/4.0 USB
MODULE Version: 1.0
BL‐R8723RB1
FCC Statement
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance could void the
user's authority to operate the equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference
by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help.
The 150Mbps Wireless N SDIO
Module is designed to comply with the FCC statement. FCC ID is S8J-R8723RB1. The host system
using 150Mbps Wireless N SDIO Module, should have label indicated it contain modular’s
FCC ID：S8J-R8723RB1.
This radio module must not installed to colocate and operating simultaneously with other radios in h
ost system , additional testing and equipment authorization
may be required to operating simultaneously with other radio.
RF warning for Mobile device:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.
B‐LINK ELECTRONIC CO., LTD in shenzhen
Contents
1. General Description ................................................................................................ 2
2. The range of applying ............................................................................................. 2
3. Features .................................................................................................................. 2
4. DC Characteristics ..................................................................................................... 4
5. Functional Specifications .......................................................................................... 5
6. The block diagram of product principle ................................................................... 6
7. The supported platform ........................................................................................... 6
8. The definition of product Pin ................................................................................... 7
9. The Structure and Size of product ............................................................................ 8
10. : The ANT Pin connect to antenna, please refer to design demand .............. 8
11. Tpical Solder Reflow Profile ................................................................................... 9
B‐LINK ELECTRONIC CO., LTD in shenzhen
1. General Description
BL‐8723RB1 product Accord with FCC CE and is a small size and low profile of WiFi+BT combo
module with LGA (Land‐Grid Array) footprint, board size is 19.5mm*12.4 mm with module height
0.6mm. It is 150 wireless USB adapter which has lower power consumption, high linearity output
power, accords with IEEE802.11B/G/N, and supports IEEE802.11i safety protocol, along with IEEE
802.11e standard service quality. It connects with other wireless device which accorded with these
standards together, supports the new data encryption on 64/128 bit WEP and safety mechanism on
WPA‐PSK/WPA2‐PSK, WPA/WPA2.Its wireless transmitting rate rises 150M, equivalent to 10 times of
common 11b product. The inner AI high gain ceramics antenna adapts different kinds of work
environment. It’s easy and convenient to link to wireless network for the users using desktop, laptop
and other device that needs connect to wireless network.
The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n b/g/n MIMO technology
and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0.
2. The range of applying
MID, networking camera, STB GPS, E‐book, Hard disk player, Network Radios, PSP, etc, the
device which need be supported by wireless networking.
3. Features
Feature
Power supply
Implementation
Clock source
40MHz
Temperature range
The connect type of
VCC_3.3V +‐0.2V
Work temperature:
‐20ºC‐‐‐70ºC
Storage temperature ‐40°C ~ +80°C
Connect to the 6th pin of Module
Antenna
Package
SMT 10 pins
WLAN and BT features
General features
■ CMOS MAC, Baseband PHY, and RF in a single chip for IEEE
802.11b/g/n compatible WLAN
■ Complete 802.11n solution for 2.4GHz band
■ 72.2Mbps receive PHY rate and 72.2Mbps transmit PHY rate using
20MHz bandwidth
■150Mbps receive PHY rate and 150Mbps transmit PHY rate using
40MHz bandwidth
■ Compatible with 802.11n specification
B‐LINK ELECTRONIC CO., LTD in shenzhen
■ Backward compatible with 802.11b/g devices while operating in
802.11n mode
■Qualified BT 2.1, BT 3.0 and BT 4.0 Dual mode
■Support for Bluetooth Low Energy
■Integrated class 1, class 2, and class 3 PA
and modem in Bluetooth Controlle
Host Interface
■ Complies with USB Specification Revision 2.0
■ IEEE 802.11b/g/n compatible WLAN
Standards Supported
■ IEEE 802.11e QoS Enhancement (WMM)
■ IEEE 802.11h TPC, Spectrum Measurement
■ 802.11i (WPA, WPA2). Open, shared key, and pair‐wise key
authentication services
■ BT v2.1, EDR/BT v3.0 and HS/BT v4.0
■ Frame aggregation for increased MAC efficiency (A‐MSDU, A‐MPDU)
■ Low latency immediate High‐Throughput Block Acknowledgement
WLAN
(HT‐BA)
MAC
■ Long NAV for media reservation with CF‐End for NAV release
Features
■ PHY‐level spoofing to enhance legacy compatibility
■ Power saving mechanism
■ Channel management and co‐existence
■ Transmit Opportunity (TXOP) Short Inter‐Frame Space (SIFS) bursting
for higher multimedia bandwidth
■ IEEE 802.11n OFDM
■ One Transmit and one Receive path (1T1R)
■ 20MHz and 40MHz bandwidth transmission
WLAN
■ Short Guard Interval (400ns)
PHY
■ DSSS with DBPSK and DQPSK, CCK modulation with long and short
Features
preamble
■ OFDM with BPSK, QPSK, 16QAM, and 64QAM modulation.
Convolutional Coding Rate: 1/2, 2/3, 3/4, and 5/6
■ Maximum data rate 54Mbps in 802.11g and 150Mbps in 802.11n
■ Switch diversity for DSSS/CCK
■ Hardware antenna diversity
■ Selectable receiver FIR filters
■ Programmable scaling in transmitter and receiver to trade
quantization noise against increased probability of clipping Fast
B‐LINK ELECTRONIC CO., LTD in shenzhen
■ receiver Automatic Gain Control (AGC)
■ On‐chip ADC and DAC
■ 1Mbps for Basic Rate; 2,3Mbps for Enhanced Data Rate;
6,9,12,18,24,36,48,54Mbpsfor High Speed
■ AFH, Time Division for Media Access Control
BT Controller
■ 8DPSK, π/4 DQPSK, GFSK for Modulation Techniques
■PCM interface for audio data transmission
via BT controller.
■Integrated MCU to execute Bluetooth
protocol stack
■Support all packet types in basic rate and
enhanced data rate
■Support SCO / eSCO link (allow one link
for PCM interface and three links for
HS-UART)
■Support 4 piconets in a scattern
■Support Secure Simple Pairing
■Support Low Power Mode (Sniff / Sniff
Sub-rating / Hold / Park)
■Enhanced BT/WIFI Coexistence Control to
improve transmission quality in different profiles
■Bluetooth 4.0 Dual Mode support:
Simultaneous LE and BR/EDR
■Support multiple states of Low Energy to
increase the flexibility of application
■Fast AGC control to improve receiving
dynamic range
■Support AFH to dynamically detect channel
quality to improve transmission quality
Bluetooth Transceiver ■Integrated internal class 1, class 2, and class
3 PA
Features
■Bluetooth 3.0+HS compliant
■Power Control / Enhanced Power Control
Supported
■Bluetooth Low Energy supported
■Integrated 32K oscillator for power
management
4. DC Characteristics
Symbol
VD33A,
VD33D
VD28A,
VD28D
VD15A,
Parameter
3.3V I/O Supply
Voltage
1.2V Core
Supply Voltage
1.5V Supply
Minimum
3.0
Typical
3.3
Maximum
3.6
Units
1.10
1.2
1.32
1.425
1.5
1.575
B‐LINK ELECTRONIC CO., LTD in shenzhen
VD15D
Voltage
5. Functional Specifications
Host Interface
USB2.0
Standard
WiFi: EEE 802.11b, IEEE 802.11g, IEEE 802.11n
B T:
V2.1+EDR/BT v3.0/BT v3.0+HS/BT v4.0
Frequency Range
2.4GHz~2.4835GHz
Modulation Type
Working Mode
802.11b: CCK, DQPSK, DBPSK
802.11g: 64 QAM, 16 QAM, QPSK, BPSK
802.11n: 64 QAM, 16 QAM, QPSK, BPSK
B T:
8DPSK, π/4 DQPSK, GFSK
Infrastructure, Ad‐Hoc
Wifi：802.11b: 11, 5.5, 2, 1 Mbps
802.11g: 54, 48, 36, 24, 18, 12, 9, 6 Mbps
802.11n: MCS 0 to 7 for HT20MHz ;MCS 0 to 7 for
Data Transfer Rate
HT40MHz
B T: 1 Mbps for Basic Rate
2,3 Mbps for Enhanced Data Rate
IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum)
IEEE 802.11g/n:OFDM (Orthogonal Frequency Division
Spread Spectrum
Multiplexing)
BT：FHSS(Frequency‐Hopping Spread Spectrum)
Wi Fi: 1M: ‐92dBm@8%PER
6M: ‐89dBm@10%PER
11M:‐86dBm@8%PER
Sensitivity @PER（Tolerance：
54M:‐73dBm@10%PER
+/‐2dB）
135M:‐67dBm@10%PER
B T: ‐89dBm@1Mbps, ‐85dBm@2Mbps, ‐83dBm@3Mbps
14 dBm@11b, 12dBm@11g , 11dBm@11n（Tolerance：
RF Power
+/‐1.5dB）
BT: MAX +4.5dBm
Connect to the external antenna through the half hole. The
The connect type of Antenna
antenna and other interface get connected to the external
devices by the edge half a circle welding plate.
B‐LINK ELECTRONIC CO., LTD in shenzhen
6. The block diagram of product principle
7. The supported platform
Operating System
CPU Framework
Driver
WIN2000/XP/VISTA/WIN7
X86 Platform
Enable
LINUX2.4/2.6
ARM, MIPSII
Enable
WINCE5.0/6.0
ARM ,MIPSII
Enable
B‐LINK ELECTRONIC CO., LTD in shenzhen
8. The definition of product Pin
10
Top and bottom view of BL‐8723RB1
Pin No：
TYPE
Description
DC:3.3V
I/O
UDM‐
I/O
UDP+
GND
GND
ANT
BT_PCM_SYNC
BT_PCM_CLK
BT_PCM_IN
10
BT_PCM_OUT
B‐LINK ELECTRONIC CO., LTD in shenzhen
9. The Structure and Size of product
10: The ANT Pin connect to antenna, please refer to design demand
Connect to the 6th pin of Module
Connect to the 5th pin of Module
a) The current of 3.3V power supply must be >300mA, its ripple wave must be <30mV. The GND
pins of module and external antenna need to be an incorporated part. The ground plane should
be larger, module and antenna should keep far away from interference source.
b) The sixth pin is 2.4G high frequency output, coplanar impedance of layout line between this pin
to antenna interface should be 50Ω, we suggest use arc line or straight line, and beside the line
there will be ground plane that its length as shout as possible, the longest length is no more
than 50mm.
c)
L1, C1, C2 constitute a π‐type network that we preset, please make it close to antenna interface,
this π‐type network is used to match the antenna parameters and control the radiation. It
should be adjusted according to the real condition when being used. Normally you can only
mount L1 that its parameters are: 10pF, NP0 material. No need C1 and C2
B‐LINK ELECTRONIC CO., LTD in shenzhen
11. Typical Solder Reflow Profile

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Modify Date                     : 2015:08:31 14:42:29+08:00
Format                          : application/pdf
Title                           : Microsoft Word - 要改的
Creator                         : sally.zhang
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