Bilian Electronic R8782MS1 150Mbps Wireless N SDIO Module User Manual R8782MS1 20150831

Shenzhen Bilian Electronic Co., Ltd. 150Mbps Wireless N SDIO Module R8782MS1 20150831

User manual

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BLR8782MS1
Product Specification
WLAN11b/g/nUSBMODULE
Version:2.0
FCC Statement
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's
authority to operate the equipment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference
in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the following measures:
-Reorient or relocate the receiving antenna.
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help.
The 150Mbps Wireless N SDIO
Module is designed to comply with the FCC statement. FCC ID is S8J-R8782MS1. The host system using 150
Mbps Wireless N SDIO Module, should have label indicated it contain modular’s
FCC IDS8J-R8782MS1.
This radio module must not installed to colocate and operating simultaneously with other radios in host system
, additional testing and equipment authorization
may be required to operating simultaneously with other radio.
RF warning for Mobile device:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
BLINKELECTRONICCO.,LTDinshenzhen 
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Contents
Contents.............................................................................................................................................................1
1:GeneralDescription.........................................................................................................................................2
2:Therangeofapplying......................................................................................................................................2
3:Features...........................................................................................................................................................2
4:DCCharacteristics............................................................................................................................................5
5:Themainperformanceofproduct..................................................................................................................5
6:DC/RFcharacteristics......................................................................................................................................6
7:Theblockdiagramofproductprinciple............................................................................................................7
8:Thesupportedplatform..................................................................................................................................7
9:ThedefinitionofproductPin..........................................................................................................................8
10:TheStructureandSizeofproduct..................................................................................................................9
11:The14thPinconnecttoantenna,pleaserefertodesigndemand..................................................................10
12:TpicalSolderReflowProfile........................................................................................................................11
13:SDIOInterfaceCharacteristics.....................................................................................................................12
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1. GeneralDescription
BLR8782MS1productAccordwithFCCCEandisaSDIOwirelessmodulewithsmallersize,
highperformanceandhighlinearityoutputpowerconsumption,specificallydesignedtosupport
highthroughputdataratesfornextgenerationWLANproducts.ItisdesignedtosupportsIEEE
802.11g/band802.11npayloaddatarates.ItprovidesthecombinedfunctionsofDSSSandOFDM
basebandmodulation,MAC,CPU,memory,hostinterfaces,anddirectconversionWLANRFradioon
asingleintegratedchip.Forsecurity,Itsupports802.11isecuritystandardsthroughimplementation
oftheAES/CCMP,WEPwithTKIP,AES/CMAC,andWAPIsecuritymechanisms.Forvideo,voice,and
multimediaapplicationsissupported.Itisalsoequippedwithacoexistenceinterfaceforexternal,
colocated2.4GHzradios,alsosupportedaSDIOinterfaceforconnectingWLANactivitytothehost
processor.

2. Therangeofapplying
Digital products (Printer, Digital camera, Digital photo frame)
Game player
Consumer electronic device and intelligent appliances (such as TV, DVD player, media player,
etc)
Table computer, notebook, E book
Smart phone and other mobile applications
3.Features
FeatureImplementation
PowersupplyVCC_3.3V+0.2V
Clocksource40MHz
Tempe rature rangeWorktemperature:‐20ºC‐‐‐70ºC
Storagetemperature‐55°C~+125°C
PackageSMT14pins
WLANfeatures
Generalfeaturessinglechipintegrationof802.11wirelessradiobaseband,
MAC,CPU,memory,hostinterface
CMOSandlowswingsinewaveinputclock
19.2,26,38,4,and40MHzcrystalclocksupportwithautofrequency
detectionifexternalsleepclockisavailable
BLINKELECTRONICCO.,LTDinshenzhen 
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Lowpoweroperationsupportingdeepsleepandstandbymodes
Powermanagementwithexternalsleepclocksupportfornearzero
deepsleeppower
Optiontopowerdirectlyfrombatteryortouse3.3v/1.8v/1.2v
preregulatedsupplies
Onetimeprogrammable(OTP)memorytoeliminateneedforexternal
EEPROM
FullycompatiblewithMarvellPowerManagementdevice(s)
HostInterface
SDIOdeviceinterface(SPI,1bitSDIO,4bitSDIOtransfermodesatfull
clockrangeupto50MHZ)
StandardsSupported
IEEE802.11dataratesof1and2Mbps
IEEE802.11bdataratesof5.5and11Mbps
IEEE802.11gdataratesof6,9,12,18,24,36,48and54Mbpsfor
multimediacontenttransmission
802.11g/bperformanceenhancements
802.11ncompliant,withmaximumdataratesupto72Mbps(20MHz
channel)and150Mbps(40MHzchannel)
Fullysupportsclients(stations)implementingIEEEPowerSavemode
WiFiDirectconnectivity
WLANMACFeatures
AdHocandinfrastructureModes
RTS/CTSforoperationunderDCF
Hardwarefilteringof32multicastaddressesandduplicateframe
detectionforupto32unicastaddresses
OnchipTxandRxFIFOformaximumthroughput
OpenSystemandSharedKeyAuthenticationservices
AMPDURx(deaggregation)andTx(aggregation)
20/40MHzcoexistence
ReducedinterFrameSpacing(RIFS)bursting
Managementinformationbasedcounters
Radioresourcemeasurementcounters
Blockacknowledgementwith802.11nextension
Transmitbeamformeesupport
Transmitrateadaptation
Transmitpowercontrol
Longandshortpreamblegenerationonaframebyframebasisfor
802.11bframes
MarvellMobileHotspot
BLINKELECTRONICCO.,LTDinshenzhen 
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WLANRadio
Integrateddirectconversionradio
20/40MHZchannelbandwidths
IntegratedT/Rswitch,PA,andLNAfor2.4GHzpath
WLANRxPathDirectconversionarchitectureeliminatesneedforexternalSAWfilter
OnchipgainselectableLNASwithoptimizednoisefigureandpower
consumption
HighdynamicrangeAGCfunctioninreceivemode
WLANTxPathIntegratedpoweramplifierswithpowercontrol
Closed/openlooppowercontrol(0.5dBincrements)
OptimizedTxgaindistributionforlinearityandnoiseperformance
WLANEncryptionWEP64and128bitencryptionwithhardwareTKIPprocessing(WPA)
AESCCMPhardwareimplementationaspartof802.11isecurity
standard(WPA2)
EnhancedAESengineperformance
WLANAuthenticationandPrivacyInfrastructure(WAPI)
BLINKELECTRONICCO.,LTDinshenzhen 
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4.DCCharacteristics
5.Themainperformanceofproduct
ItemDescription
Thesupportedprotocoland
standardIEEE802.11n,IEEE802.11g,IEEE802.11b
InterfacetypeSDIO
Therangeoffrequency2.4122.462GHZ
Theamountofworking
Channel111America,Canada
DataModulationOFDM/DBPSK/DQPSK/CCK
WorkingModeInfrastructure,AdHoc
Thetransmittingrate 135/54/48/36/24/18/12/9/6/1M selfadapting
SpreadspectrumDSSS
Sensitivity@PER
54/135M:74dBm@10%PER,
11M:85dBm@8%PER
6M:‐88dBm@10%PER,
1M:‐90dBm@8%PER
BLINKELECTRONICCO.,LTDinshenzhen 
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Throughput90Mbps(external5dbiantenna,damping40dbminShielding
box)
Theconnecttypeof
Antenna
Connecttotheexternalantennathroughthehalfhole,Connectto
theexternalantennathroughthehalfhole,Theantennaandother
interfacegetconnectedtotheexternaldevicesbytheedgehalfa
circleweldingplate
ThetransmitdistanceIndoor100M,Outdoor300M,accordingthelocalenvironment
WorkingPowerconsumption600MW
MENS(L*W*H)13.5mm*13mm*1.5mm
ThechipsetmodelMarvell88W8782
6.DC/RFcharacteristics
TermsContents
Specification:IEEE802.11b
ModeDSSS/CCK
Frequency24122462MHz
Datarate1,2,5.5,11Mbps
DCCharacteristicsmin Typ.max.Unit
TXmode305309311MA
Rxmode175180181MA
standbymode180185186UA
Specification:IEEE802.11g
ModeOFDM
Frequency2412‐2462MHz
Datarate6,9,12,18,24,36,48,54Mbps
DCCharacteristicsminTyp.max.Unit
TXmode244245245MA
Rxmode182185186MA
standbymode183185186UA
Specification:IEEE802.11n
ModeOFDM
Frequency2412‐2462MHz
Datarate6.5,13,19.5,26,39,52,58.5,65Mbps
DCCharacteristicsminTyp.max.Unit
TXmode240242244MA
Rxmode189190191MA
standbymode184185186UA
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7.Theblockdiagramofproductprinciple
8.Thesupportedplatform
OperatingSystemCPUFrameworkDriver
WIN2000/XP/VISTA/WIN7X86PlatformEnable
LINUX2.4/2.6ARM,MIPSIIEnable
WINCE5.0/6.0ARM,MIPSIIEnable
BLINKELECTRONICCO.,LTDinshenzhen 
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9.ThedefinitionofproductPin
 
Thefrontside

Thebackside

TopandbottomviewofBLR8782MS1
1
2
3
4
5
6
7
14
13
12
11
10
9
8
BLINKELECTRONICCO.,LTDinshenzhen 
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PinNoTYPEDescription
1 SD-DATA2 SDIO Data Cable
2 SD-DATA3 SDIO Data Cable
3 SD-CMD SDIO Control Line
4 GND GND(Negative)
5 SD-CLK SDIO Clock request signal
6 SD-DATA0 SDIO Data Cable
7 SD-DATA1 SDIO Data Cable
8 SD-POWER 3.3V Power supply
9 PDN-Full Power down Low power consumption
10 GND GND(Negative)
11 ANT Antenna connection
12 GND GND(Negative)
13 GPIO-WAKEUP-INPUT Wake/Suspend input control
14 GPIO-WAKEUP-OUTPUT Wake/Suspend output control
BLINKELECTRONICCO.,LTDinshenzhen 
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10.TheStructureandSizeofproduct
BLINKELECTRONICCO.,LTDinshenzhen 
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11:The14thPinconnecttoantenna,pleaserefertodesigndemand
RT8782 peripheral
circuit design re
a) Thecurrentof3.3Vpowersupplymustbe>300mA,itsripplewavemustbe<30mV.TheGND
pinsofmoduleandexternalantennaneedtobeanincorporatedpart.Thegroundplaneshould
belarger,moduleandantennashouldkeepfarawayfrominterferencesource.
b) Thesixthpinis2.4Ghighfrequencyoutput,coplanarimpedanceoflayoutlinebetweenthispin
toantennainterfaceshouldbe50Ω,wesuggestusearclineorstraightline,andbesidetheline
therewillbegroundplanethatitslengthasshoutaspossible,thelongestlengthisnomore
than50mm.
c) L1,C1,C2constituteaπ‐typenetworkthatwepreset,pleasemakeitclosetoantennainterface,
thisπ‐typenetworkisusedtomatchtheantennaparametersandcontroltheradiation.It
shouldbeadjustedaccordingtotherealconditionwhenbeingused.Normallyyoucanonly
mountL1thatitsparametersare:2.7nH,NP0material.NoneedC3andC4.
BLINKELECTRONICCO.,LTDinshenzhen 
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12.SDIOInterfaceCharacteristics

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