Bilian Electronic R8782MS1 150Mbps Wireless N SDIO Module User Manual R8782MS1 20150831
Shenzhen Bilian Electronic Co., Ltd. 150Mbps Wireless N SDIO Module R8782MS1 20150831
User manual
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| Document ID | 2792825 |
| Application ID | 4C38jy2TC82hPMkrfiREtg== |
| Document Description | User manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 77.61kB (970129 bits) |
| Date Submitted | 2015-10-25 00:00:00 |
| Date Available | 2015-10-25 00:00:00 |
| Creation Date | 2015-09-01 11:05:51 |
| Producing Software | Acrobat Distiller 7.0 (Windows) |
| Document Lastmod | 2015-09-01 11:05:51 |
| Document Title | Microsoft Word - User Manual_R8782MS1_20150831 |
| Document Creator | PScript5.dll Version 5.2.2 |
| Document Author: | sally.zhang |
BL‐R8782MS1 Product Specification WLAN 11b/g/n USB MODULE Version: 2.0 FCC Statement This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. The 150Mbps Wireless N SDIO Module is designed to comply with the FCC statement. FCC ID is S8J-R8782MS1. The host system using 150 Mbps Wireless N SDIO Module, should have label indicated it contain modular’s FCC ID：S8J-R8782MS1. This radio module must not installed to colocate and operating simultaneously with other radios in host system , additional testing and equipment authorization may be required to operating simultaneously with other radio. RF warning for Mobile device: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. B‐LINK ELECTRONIC CO., LTD in shenzhen Contents Contents .............................................................................................................................................................1 1:General Description......................................................................................................................................... 2 2: The range of applying...................................................................................................................................... 2 3:Features ...........................................................................................................................................................2 4: DC Characteristics............................................................................................................................................5 5: The main performance of product.. ................................................................................................................5 6: DC/RF characteristics.................. ....................................................................................................................6 7: The block diagram of product principle............................................................................................................7 8: The supported platform.............. ....................................................................................................................7 9: The definition of product Pin....... ...................................................................................................................8 10: The Structure and Size of product..................................................................................................................9 11: The 14th Pin connect to antenna, please refer to design demand..................................................................10 12: Tpical Solder Reflow Profile................................................... .....................................................................11 13: SDIO Interface Characteristics................................................ .....................................................................12 B‐LINK ELECTRONIC CO., LTD in shenzhen 1. General Description BL‐R8782MS1 product Accord with FCC CE and is a SDIO wireless module with smaller size, high performance and high linearity output power consumption, specifically designed to support high throughput data rates for next generation WLAN products. It is designed to supports IEEE 802.11g/b and 802.11n payload data rates. It provides the combined functions of DSSS and OFDM baseband modulation, MAC, CPU, memory, host interfaces, and direct conversion WLAN RF radio on a single integrated chip. For security, It supports 802.11i security standards through implementation of the AES /CCMP, WEP with TKIP, AES/CMAC, and WAPI security mechanisms. For video, voice, and multimedia applications is supported .It is also equipped with a coexistence interface for external, co‐located 2.4GHz radios, also supported a SDIO interface for connecting WLAN activity to the host processor. 2. The range of applying Digital products (Printer, Digital camera, Digital photo frame) Game player Consumer electronic device and intelligent appliances (such as TV, DVD player, media player, etc) Table computer, notebook, E book Smart phone and other mobile applications 3.Features Feature Power supply Implementation Clock source 40MHz Temperature range VCC_3.3V +‐0.2V Work temperature: ‐20ºC‐‐‐70ºC Storage temperature ‐55°C ~ +125°C Package SMT 14 pins WLAN features General features ■single‐chip integration of 802.11 wireless radio baseband, MAC, CPU, memory, host interface ■CMOS and low‐swing sinewave input clock ■19.2,26,38,4,and 40MHz crystal clock support with auto‐frequency detection if external sleep clock is available B‐LINK ELECTRONIC CO., LTD in shenzhen ■Low power operation supporting deep sleep and standby modes ■Power management with external sleep clock support for near zero deep sleep power ■ Option to power directly from battery or to use 3.3v/1.8v/1.2v pre‐regulated supplies ■One time programmable (OTP) memory to eliminate need for external EEPROM Host Interface ■Fully compatible with Marvell Power Management device(s) SDIO device interface(SPI,1‐bit SDIO,4bit SDIO transfer modes at full clock range up to 50MHZ) Standards Supported ■IEEE 802.11 data rates of 1 and 2 Mbps ■IEEE 802.11b data rates of 5.5 and 11 Mbps ■IEEE 802.11g data rates of 6,9,12,18,24,36,48 and54 Mbps for multimedia content transmission ■802.11g/b performance enhancements ■802.11n compliant, with maximum data rates up to 72Mbps (20MHz channel ) and 150Mbps (40MHz channel) ■Fully supports clients (stations) implementing IEEE Power Save mode ■Wi‐Fi Direct connectivity WLAN MAC Features ■Ad‐Hoc and infrastructure Modes ■RTS/CTS for operation under DCF ■Hardware filtering of 32 multicast addresses and duplicate frame detection for up to 32 unicast addresses ■On‐chip Tx and Rx FIFO for maximum throughput ■Open System and Shared Key Authentication services ■A‐MPDU Rx (de‐aggregation) and Tx (aggregation) ■20/40MHz coexistence ■Reduced inter‐Frame Spacing (RIFS) bursting ■Management information based counters ■Radio resource measurement counters ■Block acknowledgement with 802.11n extension ■Transmit beamformee support ■Transmit rate adaptation ■Transmit power control ■Long and short preamble generation on a frame‐by‐frame basis for 802.11b frames ■Marvell Mobile Hotspot B‐LINK ELECTRONIC CO., LTD in shenzhen ■Integrated direct conversion radio WLAN Radio ■20/40MHZ channel bandwidths ■Integrated T/R switch ,PA, and LNA for 2.4GHz path WLAN Rx Path ■Direct conversion architecture eliminates need for external SAW filter ■On‐chip gain selectable LNAS with optimized noise figure and power consumption ■High dynamic range AGC function in receive mode WLAN Tx Path ■Integrated power amplifiers with power control ■Closed/open loop power control (0.5dB increments) ■Optimized Tx gain distribution for linearity and noise performance WLAN Encryption ■WEP 64‐and 128 bit encryption with hardware TKIP processing(WPA) ■AES‐CCMP hardware implementation as part of 802.11i security standard(WPA2) ■Enhanced AES engine performance ■WLAN Authentication and Privacy Infrastructure (WAPI) B‐LINK ELECTRONIC CO., LTD in shenzhen 4. DC Characteristics 5.The main performance of product Item Description The supported protocol and IEEE 802.11n, IEEE 802.11g,IEEE 802.11b standard Interface type SDIO The range of frequency 2.412‐2.462GHZ The amount of working 1‐11（America, Canada） Channel Data Modulation OFDM/DBPSK/DQPSK/CCK Infrastructure, Ad‐Hoc Working Mode 135/54/48/36/24/18/12/9/6 /1M（self‐adapting） The transmitting rate Spread spectrum Sensitivity @PER DSSS 54/135M:‐74dBm@10%PER, 11M:‐85dBm@8%PER 6M: ‐88dBm@10%PER , 1M: ‐90dBm@8%PER B‐LINK ELECTRONIC CO., LTD in shenzhen Throughput The connect type of Antenna The transmit distance Working Power consumption MENS(L*W*H) The chipset model 90Mbps(external 5dbi antenna ,damping 40dbm in Shielding box ) Connect to the external antenna through the half hole, Connect to the external antenna through the half hole, The antenna and other interface get connected to the external devices by the edge half a circle welding plate Indoor 100M, Outdoor 300M, according the local environment 600MW 13.5mm*13mm *1.5 mm Marvell 88W8782 6. DC/RF characteristics Terms Contents Specification : IEEE802.11b Mode DSSS / CCK Frequency 2412 – 2462MHz Data rate 1, 2, 5.5, 11Mbps DC Characteristics min Typ. max. Unit TX mode 305 309 311 MA Rx mode 175 180 181 MA standby mode 180 185 186 UA Specification : IEEE802.11g Mode OFDM Frequency 2412 ‐ 2462MHz Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps DC Characteristics min Typ. max. Unit TX mode 244 245 245 MA Rx mode 182 185 186 MA standby mode 183 185 186 UA Specification : IEEE802.11n Mode OFDM Frequency 2412 ‐ 2462MHz Data rate 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps DC Characteristics min Typ. max. Unit TX mode 240 242 244 MA Rx mode 189 190 191 MA standby mode 184 185 186 UA B‐LINK ELECTRONIC CO., LTD in shenzhen 7.The block diagram of product principle 8.The supported platform Operating System CPU Framework Driver WIN2000/XP/VISTA/WIN7 X86 Platform Enable LINUX2.4/2.6 ARM, MIPSII Enable WINCE5.0/6.0 ARM ,MIPSII Enable B‐LINK ELECTRONIC CO., LTD in shenzhen 9.The definition of product Pin 14 13 12 11 10 The front side The back side Top and bottom view of BL‐R8782MS1 B‐LINK ELECTRONIC CO., LTD in shenzhen TYPE Description SD-DATA2 SDIO Data Cable SD-DATA3 SDIO Data Cable SD-CMD SDIO Control Line GND GND（Negative） SD-CLK SDIO Clock request signal SD-DATA0 SDIO Data Cable SD-DATA1 SDIO Data Cable SD-POWER 3.3V Power supply Pin No： 10 PDN-Full Power down Low power consumption GND GND（Negative） 11 ANT Antenna connection 12 GND GND（Negative） 13 14 GPIO-WAKEUP-INPUT GPIO-WAKEUP-OUTPUT Wake/Suspend input control Wake/Suspend output control B‐LINK ELECTRONIC CO., LTD in shenzhen 10.The Structure and Size of product 10 B‐LINK ELECTRONIC CO., LTD in shenzhen 11: The 14th Pin connect to antenna, please refer to design demand RT8782 peripheral circuit design re a) The current of 3.3V power supply must be >300mA, its ripple wave must be <30mV. The GND pins of module and external antenna need to be an incorporated part. The ground plane should be larger, module and antenna should keep far away from interference source. b) The sixth pin is 2.4G high frequency output, coplanar impedance of layout line between this pin to antenna interface should be 50Ω, we suggest use arc line or straight line, and beside the line there will be ground plane that its length as shout as possible, the longest length is no more than 50mm. c) L1, C1, C2 constitute a π‐type network that we preset, please make it close to antenna interface, this π‐type network is used to match the antenna parameters and control the radiation. It should be adjusted according to the real condition when being used. Normally you can only mount L1 that its parameters are: 2.7nH, NP0 material. No need C3 and C4 . 11 B‐LINK ELECTRONIC CO., LTD in shenzhen 12. SDIO Interface Characteristics 12
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