Buddi ST1 Smart TAG User Manual GE865 Harware User Guide

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit assumes
no liability resulting from any inaccuracies or omissions in this document, or from use of the
information obtained herein. The information in this document has been carefully checked and is
believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or
omissions. Telit reserves the right to make changes to any products described herein and
reserves the right to revise this document and to make changes from time to time in content
hereof with no obligation to notify any person of revisions or changes. Telit does not assume
any liability arising out of the application or use of any product, software, or circuit described
herein; neither does it convey license under its patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit products
(machines and programs), programming, or services that are not announced in your country.
Such references or information must not be construed to mean that Telit intends to announce
such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit
and its licensors certain exclusive rights for copyrighted material, including the exclusive right
to copy, reproduce in any form, distribute and make derivative works of the copyrighted
material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in
the Telit products described in this instruction manual may not be copied, reproduced,
distributed, merged or modified in any manner without the express written permission of Telit.
Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by
implication, estoppel, or otherwise, any license under the copyrights, patents or patent
applications of Telit, as arises by operation of law in the sale of a product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit
and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs,
including the exclusive right to copy or reproduce in any form the copyrighted computer
program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs
contained in the Telit products described in this instruction manual may not be copied (reverse
engineered) or reproduced in any manner without the express written permission of Telit or the
3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant
either directly or by implication, estoppel, or otherwise, any license under the copyrights,
patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal
non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.
Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is furnished
by express license agreement only and may be used only in accordance with the terms of such
an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT faulttolerant and are NOT designed, manufactured, or intended for use as on-line control equipment
in the following hazardous environments requiring fail-safe controls: the operation of Nuclear
Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life
Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically
disclaim any expressed or implied warranty of fitness for such High Risk Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service
names are the property of their respective owners.
Copyright © Telit Communications S.p.A.
Contents
1.
INTRODUCTION ......................................................................................................................................................... 7
1.1.
1.2.
1.3.
1.4.
1.5.
1.6.
SCOPE ....................................................................................................................................................................... 7
AUDIENCE ................................................................................................................................................................. 7
CONTACT INFORMATION, SUPPORT........................................................................................................................... 7
DOCUMENT ORGANIZATION ..................................................................................................................................... 8
TEXT CONVENTIONS ................................................................................................................................................. 9
RELATED DOCUMENTS ............................................................................................................................................. 9
2.
OVERVIEW .............................................................................................................................................................. 10
3.
GE865 MECHANICAL DIMENSIONS .......................................................................................................................... 11
4.
GE865 MODULE CONNECTIONS ............................................................................................................................... 12
4.1.
PIN-OUT ................................................................................................................................................................ 12
4.1.1.
BGA Balls Layout .......................................................................................................................................... 15
5.
HARDWARE COMMANDS ........................................................................................................................................ 16
5.1.
TURNING ON THE GE865 ....................................................................................................................................... 16
5.2.
TURNING OFF THE GE865 ...................................................................................................................................... 20
5.3.
RESETTING THE GE865 ........................................................................................................................................... 22
5.3.1.
Hardware Unconditional restart ................................................................................................................... 22
6.
POWER SUPPLY ....................................................................................................................................................... 25
6.1.
POWER SUPPLY REQUIREMENTS ............................................................................................................................. 25
6.2.
POWER CONSUMPTION ............................................................................................................................................ 26
6.2.1.
Power consumption Plots .............................................................................................................................. 27
6.3.
GENERAL DESIGN RULES ........................................................................................................................................ 31
6.3.1.
Electrical Design Guidelines ......................................................................................................................... 31
6.3.2.
Thermal Design Guidelines ........................................................................................................................... 34
6.3.3.
Power Supply PCB layout Guidelines ........................................................................................................... 35
7.
ANTENNA ................................................................................................................................................................ 36
7.1.
GSM ANTENNA REQUIREMENTS ............................................................................................................................ 36
7.2.
GSM ANTENNA - PCB LINE GUIDELINES ................................................................................................................ 37
7.3.
PCB GUIDELINES IN CASE OF FCC CERTIFICATION ................................................................................................. 38
7.3.1.
Transmission line design ............................................................................................................................... 38
7.3.2.
Transmission line measurements ................................................................................................................... 39
7.4.
GSM ANTENNA - INSTALLATION GUIDELINES ........................................................................................................ 41
8.
LOGIC LEVEL SPECIFICATIONS .................................................................................................................................. 42
8.1.
9.
RESET SIGNAL ......................................................................................................................................................... 43
SERIAL PORTS .......................................................................................................................................................... 44
9.1.
9.2.
9.3.
MODEM SERIAL PORT ....................................................................................................................................... 44
RS232 LEVEL TRANSLATION ................................................................................................................................... 46
UART BEHAVIOUR ................................................................................................................................................. 49
10.
AUDIO SECTION OVERVIEW ................................................................................................................................ 50
10.1. ELECTRICAL CHARACTERISTICS ............................................................................................................................. 51
10.1.1.
Input Lines ..................................................................................................................................................... 51
10.1.2.
Output Lines .................................................................................................................................................. 52
11.
GENERAL PURPOSE I/O ....................................................................................................................................... 53
11.1.
11.2.
11.3.
11.4.
11.5.
11.6.
11.7.
11.8.
11.9.
11.10.
12.
GPIO LOGIC LEVELS ............................................................................................................................................... 54
USING A GPIO PAD AS INPUT ............................................................................................................................... 55
USING A GPIO PAD AS OUTPUT ........................................................................................................................... 55
USING THE RF TRANSMISSION CONTROL GPIO4.................................................................................................... 55
USING THE RFTXMON OUTPUT GPIO5 ................................................................................................................ 56
USING THE ALARM OUTPUT GPIO6........................................................................................................................ 56
USING THE BUZZER OUTPUT GPIO7 ....................................................................................................................... 56
INDICATION OF NETWORK SERVICE AVAILABILITY .................................................................................................. 57
RTC BYPASS OUT ................................................................................................................................................... 58
EXTERNAL SIM HOLDER IMPLEMENTATION ...................................................................................................... 58
DAC AND ADC SECTION ....................................................................................................................................... 59
12.1. DAC CONVERTER ................................................................................................................................................... 59
12.1.1.
Description .................................................................................................................................................... 59
12.1.2.
Enabling DAC ............................................................................................................................................... 60
12.1.3.
Low Pass Filter Example ............................................................................................................................... 60
12.2. ADC CONVERTER ................................................................................................................................................... 61
12.2.1.
Description .................................................................................................................................................... 61
12.2.2.
Using ADC Converter ................................................................................................................................... 61
13.
MOUNTING THE GE865 ON YOUR BOARD ........................................................................................................... 62
13.1. GENERAL ................................................................................................................................................................ 62
13.2. MODULE FINISHING & DIMENSIONS ........................................................................................................................ 62
13.3. RECOMMENDED FOOT PRINT FOR THE APPLICATION................................................................................................ 63
13.4. DEBUG OF THE GE865 IN PRODUCTION ................................................................................................................... 64
13.5. STENCIL .................................................................................................................................................................. 64
13.6. PCB PAD DESIGN .................................................................................................................................................... 65
13.7. SOLDER PASTE ........................................................................................................................................................ 66
13.7.1.
GE865 Solder reflow ..................................................................................................................................... 67
14.
PACKING SYSTEM ................................................................................................................................................ 69
14.1. PACKING ON TRAY .................................................................................................................................................. 69
14.1.1.
Tray detail ..................................................................................................................................................... 70
14.2. PACKAGING ON REEL .............................................................................................................................................. 71
14.2.1.
Carrier Tape detail ........................................................................................................................................ 71
14.2.2.
Reel detail ...................................................................................................................................................... 72
14.2.3.
Packaging detail ............................................................................................................................................ 73
14.3. MOISTURE SENSIBILITY ........................................................................................................................................... 73
15.
CONFORMITY ASSESSMENT ISSUES ..................................................................................................................... 74
16.
SAFETY RECOMMANDATIONS ............................................................................................................................. 76
17.
DOCUMENT HISTORY .......................................................................................................................................... 77
1.
Introduction
1.1.
Scope
The aim of this document is the description of some hardware solutions useful for developing a
product with the Telit GE865 module.
1.2.
Audience
This document is intended for Telit customers, who are integrators, about to implement their
applications using our GE865 modules.
1.3.
Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit’s Technical Support Center (TTSC) at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations on
accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and
suggestions for improvements.
Telit appreciates feedback from the users of our information.
1.4.
Document Organization
This document contains the following chapters:
Chapter 1: “Introduction” provides a scope for this document, target audience, contact and
support information, and text conventions.
Chapter 2: “Overview” provides an overview of the document.
Chapter 3: “GE865 Mechanical Dimensions”
Chapter 4: “GE865 Module Connections” deals with the pin out configuration and layout.
Chapter 5: “Hardware Commands” How to operate on the module via hardware.
Chapter 6: “Power supply” Power supply requirements and general design rules.
Chapter 7: “Antenna” The antenna connection and board layout design are the most important
parts in the full product design.
Chapter 8: “Logic Level specifications” Specific values adopted in the implementation of logic
levels for this module.
Chapter 9: “Serial ports” The serial port on the Telit GE865 is the core of the interface between
the module and OEM hardware
Chapter 10: “Audio Section overview” Refers to the audio blocks of the Base Band Chip of the
GE865 Telit Modules.
Chapter 11: “General Purpose I/O” How the general purpose I/O pads can be configured.
Chapter 12 “DAC and ADC Section” Deals with these two kind of converters.
Chapter 13: “Mounting the GE865 on the application board” Recommendations and specifics on
how to mount the module on the user’s board.
1.5.
Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module, if
these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when integrating
the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6.
Related Documents

Telit's GSM/GPRS Family Software User Guide, 1vv0300784

Audio settings application note , 80000NT10007a

Digital Voice Interface Application Note, 80000NT10004a

GE865 Product description,

SIM Holder Design Guides, 80000NT10001a

AT Commands Reference Guide, 80000ST10025a

Telit EVK2 User Guide, 1vv0300704
2.
Overview
The aim of this document is the description of some hardware solutions useful for developing a
product with the Telit GE865 module.
In this document all the basic functions of a mobile phone will be taken into account; for each
one of them a proper hardware solution will be suggested and eventually the wrong solutions
and common errors to be avoided will be evidenced. Obviously this document cannot embrace
the whole hardware solutions and products that may be designed. The wrong solutions to be
avoided shall be considered as mandatory, while the suggested hardware configurations shall not
be considered mandatory, instead the information given shall be used as a guide and a starting
point for properly developing your product with the Telit GE865 module. For further hardware
details that may not be explained in this document refer to the Telit GE865 Product Description
document where all the hardware information is reported.
NOTICE:
(The integration of the GSM/GPRS GE865 cellular module within user application shall be
done according to the design rules described in this manual.
The information presented in this document is believed to be accurate and reliable. However, no
responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of
patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent rights of Telit Communications S.p.A. other than for
circuitry embodied in Telit products. This document is subject to change without notice.
3.
GE865 Mechanical Dimensions
The GE865-QUAD overall dimensions are:




Length:
Width:
Thickness:
Weight:
22 mm
22 mm
3.0 mm
3,2 g
4.
GE865 module connections
4.1.
PIN-OUT
Ball
Signal
I/O
Function
Note
Type
Audio
E8
EAR-
AO
Earphone signal output, phase -
Audio
D8
EAR+
AO
Earphone signal output, phase +
Audio
B8
MIC+
AI
Mic.signal input; phase+
Audio
C8
MIC-
AI
Mic.signal input; phase-
Audio
SIM card interface
External SIM signal – Clock
A5
SIMCLK
1,8 / 3V
A8
SIMRST
External SIM signal – Reset
A6
SIMIO
I/O
External SIM signal – Data I/O
B7
SIMIN
External SIM signal – Presence (active low)
1,8 / 3V
A7
SIMVCC
External SIM signal – Power supply for the SIM
1,8 / 3V
1,8 / 3V
4.7K Pull up
1,8 / 3V
Trace
D1
TX_AUX
Auxiliary UART (TX Data to DTE)
CMOS 2.8V
E1
RX_AUX
Auxiliary UART (RX Data from DTE)
CMOS 2.8V
Prog. / Data + HW Flow Control
A3
C103/TXD
Serial data input (TXD) from DTE
CMOS 2.8V
A4
C104/RXD
CMOS 2.8V
B3
C108/DTR
A1
C105/RTS
Serial data output to DTE
Input for Data terminal ready signal (DTR) from
DTE
Input for Request to send signal (RTS) from DTE
A2
C106/CTS
Output for Clear to send signal (CTS) to DTE
CMOS 2.8V
B5
C109/DCD
Output for Data carrier detect signal (DCD) to DTE
CMOS 2.8V
B2
C107/DSR
Output for Data set ready signal (DSR) to DTE
CMOS 2.8V
B4
C125/RING
Output for Ring indicator signal (RI) to DTE
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
DAC and ADC
G7
DAC_OUT
AO
Digital/Analog converter output
D/A
F5
ADC_IN1
AI
Analog/Digital converter input
A/D
F6
ADC_IN2
AI
Analog/Digital converter input
A/D
Miscellaneous Functions
C1
RESET*
Reset input
H2
VRTC
AI/O
VRTC Backup capacitor
Internal pull-up
Power
G8
STAT_LED
Status indicator led
CMOS 1.8V
B1
ON_OFF*
Input command for switching power ON or OFF
(toggle command).
47K Pull Up
Pull up to VRTC
E2
PWRMON
Power ON Monitor
CMOS 2.8V
H5
Antenna
RF
H1
Service
Antenna output – 50 Ω
Service pin can be used to upgrade the
module from ASC1 as a alternative to default
upgrading procedure using ASC0
Any pull-up/down
are required
CMOS 2.8V
Ball
Signal
I/O
D3
GPIO_01 / DVI_WA0
I/O
D2
GPIO_02 / JDR /
DVI_RX
I/O
E4
GPIO_03 / DVI_TX
I/O
H7
GPIO_04 / TX_DISAB
I/O
G2
GPIO_05 / RFTXMON
I/O
H8
GPIO_06 / ALARM
I/O
G6
GPIO_07 / BUZZER
I/O
D4
GPIO_08 / DVI_CLK
I/O
Function
Note
GPIO
GPIO01 Configurable GPIO / Digital Audio
Interface (WA0)
GPIO02 I/O pin / Jammer Detect Report / Digital
Audio Interface (RX)
GPIO03 GPIO I/O pin // Digital Audio Interface
(TX)
GPIO04 Configurable GPIO / TX Disable input
GPIO05 Configurable GPIO / Transmitter ON
monitor
GPIO06 Configurable GPIO / ALARM
Type
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
F4
GPIO_09
I/O
GPIO07 Configurable GPIO / Buzzer
GPIO08 Configurable GPIO / Digital Audio
Interface (CLK)
GPIO09
CMOS 2.8V
E3
GPIO_10
I/O
GPIO10
F1
VBATT
Main power supply (Baseband)
Power
F2
VBATT_PA
Main power supply (Radio PA)
Power
CMOS 2.8V
4.7 K Pull Up
Open Drain
4.7 K Pull Up
Open Drain
Power Supply
F3
VBATT_PA
Main power supply (Radio PA)
Power
G1
GND
Ground
Power
C2
GND
Ground
Power
C7
GND
Ground
Power
E5
GND
Ground
Power
E7
GND
Ground
Power
G5
GND
Ground
Power
G4
GND
Ground
Power
G3
GND
Ground
Power
H3
GND
Ground
Power
H6
GND
Ground
Power
RESERVED
B6
C3
C4
C5
C6
D5
D6
D7
E6
F7
F8
WARNING:Reserved pins must not be connected.
NOTE:
If not used, almost all pins should be left disconnected. The only exceptions are the following
pins:
pin
F1,F2,F3
G1, C2, C7, E5, E7, G5,
G4, G3, H3, H6
signal
VBATT & VBATT_PA
B1
A3
C1
A4
A1
D1
E1
H1
ON/OFF*
TXD
RESET*
RXD
RTS
TXD_AUX
RXD_AUX
Service
GND
RTS pin should be connected to the GND (on the module side) if flow control is not used
4.1.1.
BGA Balls Layout
TOP VIEW
C105 / RTS
ON_OFF
RESET*
TX_AUX
RX_AUX
VBATT
GND
SERVICE
C106/CTS
C107/DSR
GND
GPIO_02 /
DVI_RX
PWRMON
VBATT_P
GPIO_05
VRTC
C103_TXD
C108/DTR
GPIO_01 /
DVI_WA0
GPIO_10
VBATT_P
GND
GND
C104/RXD
C125/RING
GPIO_08 /
DVI_CLK
GPIO_03 /
DVI_TX
GPIO_09
GND
SIMCLK
C109/DCD
GND
ADC1
GND
ANT
SIMIO
ADC2
GPIO_07
GND
SIMVCC
SIMIN
GND
GND
DAC
GPIO_04
SIMRST
MIC+
MIC-
EAR+
EAR-
STATLED
GPIO_06
LEGENDA:
AUDIO
SIM CARD
ANTENNA
UARTS
DAC and ADC
MISCELLANEOUS
GPIO
POWER SUPPLY VBATT
POWER SUPPLY GND
RESERVED
NOTE:
The pin defined as H4 has to be considered RESERVED and not connected on any pin in the
application. The related area on the application has to be kept empty.
5.
Hardware Commands
5.1.
Turning ON the GE865
To turn on the GE865 the pad ON# must be tied low for at least 1 second and then released.
When the power supply voltage is lower than 3.4V the pad ON# must be tied low at least 5
seconds.
The maximum current that can be drained from the ON# pad is 0,1 mA.
A simple circuit to do it is:
NOTE:
Don't use any pull up resistor on the ON# line, it is internally pulled up. Using pull up resistor
may bring to latch up problems on the GE865 power regulator and improper power on/off of the
module. The line ON# must be connected only in open collector configuration.
NOTE:
In this document all the lines that are inverted, hence have active low signals are labelled with a
name that ends with”#" or with a bar over the name.
TIP:
To check if the device has powered on, the hardware line PWRMON should be monitored. After
900ms the line raised up the device could be considered powered on.
NOTE:
It is mandatory to avoid sending data to the serial ports during the first 200mS of the module
start-up.
A flow chart showing the proper turn on procedure is displayed below:
Modem ON Proc.
PWMON = ON?
DELAY= 900mSec
Enter AT
ON_OFF = LOW
Delay = 5 Sec
AT answer in 1Sec ?
ON_OFF = HIGH
PWMON = ON?
AT init sequence.
Modem RESET
Proc.
Delay 1s
Start AT CMD.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the GE865 when the module is powered off or during
an ON/OFF transition.
A flow chart showing the AT command managing procedure is displayed below:
Start AT CMD.
DELAY= 300mSec
Enter AT
AT answer in
1Sec ?
Disconnect VBatt
Modem ON Proc.
AT init sequence.
For example:
1- Let's assume you need to drive the ON# pad with a totem pole output of a +3/5 V
microcontroller (uP_OUT1):
2- Let's assume you need to drive the ON# pad directly with an ON/OFF button:
5.2.
Turning OFF the GE865
Turning off of the device can be done in two ways:

via AT command (see GE865 Software User Guide, AT#SHDN)

by tying low pin ON#
Either ways, the device issues a detach request to network informing that the device will not be
reachable any more.
To turn OFF the GE865 the pad ON# must be tied low for at least 2 seconds and then released.
A Pulse duration less than 2 seconds should also start the power off procedure, but this is not
guaranteed.
The same circuitry and timing for the power on must be used.
The device shuts down after the release of the ON# pad.
TIP:
To check if the device has been powered off, the hardware line PWRMON must be monitored.
The device is powered off when PWRMON goes low.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the GE865 when the module is powered off or during
an ON/OFF transition.
The following flow chart shows the proper turnoff procedure:
Modem OFF Proc.
PWMON = ON?
ON_OFF = LOW
Delay = 2 Sec
ON_OFF = HIGH
Modem ON Proc.
PWMON = ON?
Delay 15s
PWMON = ON?
Disconnect PWR
supply
5.3.
Resetting the GE865
5.3.1.
Hardware Unconditional restart
WARNING:
The hardware unconditional Restart must not be used during normal operation of the device
since it does not detach the device from the network. It shall be kept as an emergency exit
procedure to be done in the rare case that the device gets stacked waiting for some network or
SIM responses.
To unconditionally reboot the GE865, the pad RESET# must be tied low for at least 200
milliseconds and then released.
The maximum current that can be drained from the RESET# pad is 0,15 mA.
NOTE:
Do not use any pull up resistor on the RESET* line nor any totem pole digital output. Using pull
up resistor may bring to latch up problems on the GE865 power regulator and improper
functioning of the module. The line RESET* must be connected only in open collector
configuration.
TIP:
The unconditional hardware restart must always be implemented on the boards and the software
must use it as an emergency exit procedure.
A simple circuit to do it is:
In the following flow chart is detailed the proper restart procedure:
Modem Reset Proc.
Reset# = LOW
Delay 200ms
Reset# = HIGH
PWRMON = ON
Delay 1s
Modem ON Proc.
Delay 1s
Start AT CMD.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the GE865 when the module is powered off or during
an ON/OFF transition.
For example:
1. Let us assume you need to drive the RESET# pad with a totem pole output of a +3/5 V
microcontroller (uP_OUT2):
6.
Power Supply
The power supply circuitry and board layout are a very important part in the full product design
and they strongly reflect on the product overall performances, hence read carefully the
requirements and the guidelines that will follow for a proper design.
6.1.
Power Supply Requirements
The external power supply must be connected to VBATT & VBATT_PA signals and must
fulfill the following requirements:
POWER SUPPLY
Nominal Supply Voltage
Normal Operating Voltage Range
Extended Operating Voltage Range
VOLTAGE RIPPLE
Normal conditions, Power control level for
Pout Max
@ f <200KHz
@ f >200KHz
3.8 V
3.4 V÷ 4.20 V
3.22 V÷ 4.50 V
Value
50mV
2m V
NOTE:
The Operating Voltage Range MUST never be exceeded; care must be taken in order to fulfil
min/max voltage requirement.
NOTE:
Overshoot voltage (regarding MAX Extended Operating Voltage) and drop in voltage
(regarding MIN Extended Operating Voltage) MUST never be exceeded;
The “Extended Operating Voltage Range” can be used only with completely assumption and
application of the HW User guide suggestions.
NOTE:
When the power supply voltage is lower than 3.4V, to turn ON the module, the pad ON# must
be tied low for at least 3 seconds. See para 5.1.
6.2.
Power Consumption
The GE865 power consumptions are:
GE865
Average
Mode
(mA)
SWITCHED OFF
Switched Off
<62uA
AT+CFUN=1
AT+CFUN=4
16,0
16,0
3,9
2,5
AT+CFUN=0 or =5
2,4
1,5
CSD TX and RX mode
GSM900 CSD PL5
240
DCS1800 CSD PL0
175
GPRS (class 1) 1TX + 1RX
GSM900 PL5
225
DCS1800 PL0
160
GPRS (class 10) 2TX + 3RX
GSM900 PL5
420
DCS1800 PL0
290
Mode description
Module supplied but Switched Off
IDLE mode
Normal mode: full functionality of the module
Disabled TX and RX; module is not registered on the network
Paging Multiframe 2
Paging Multiframe 3
Paging Multiframe 4
Paging Multiframe 9
GSM Voice call
GPRS Sending data mode
GPRS Sending data mode
The GSM system is made in a way that the RF transmission is not continuous, else it is packed
into bursts at a base frequency of about 216 Hz, and the relative current peaks can be as high as
about 2A. Therefore the power supply has to be designed in order to withstand with these
current peaks without big voltage drops; this means that both the electrical design and the board
layout must be designed for this current flow.
If the layout of the PCB is not well designed a strong noise floor is generated on the ground and
the supply; this will reflect on all the audio paths producing an audible annoying noise at 216
Hz; if the voltage drop during the peak current absorption is too much, then the device may even
shutdown as a consequence of the supply voltage drop.
NOTE:
The electrical design for the Power supply should be made ensuring it will be capable of a peak
current output of at least 2 A.
6.2.1.
Power consumption Plots
This document section is showing the typical Current consumption plots (using Agilent 66319D)
in the normal working conditions of the module.
GSM900 – Voice Call – Power level 5
GSM900 – GPRS Call – Power level 5 - 1 Slot TX
GSM900 – GPRS Call – Power level 5 - 2 Slot TX, 3 Slot RX
DCS1800 – Voice Call – Power level 0
DCS1800 – GPRS Call – Power level 0 – 1 Slot TX
PCS1900 – GPRS Call – Power level 0 - 2 Slot TX, 3 Slot RX
6.3.
General Design Rules
The principal guidelines for the Power Supply Design embrace three different design steps:
 the electrical design
 the thermal design
 the PCB layout.
6.3.1.
Electrical Design Guidelines
The electrical design of the power supply depends strongly from the power source where this
power is drained. We will distinguish them into three categories:
 +5V input (typically PC internal regulator output)
 +12V input (typically automotive)
 Battery
6.3.1.1.
+ 5V input Source Power Supply Design Guidelines





The desired output for the power supply is 3.8V, hence there's not a big difference
between the input source and the desired output and a linear regulator can be used. A
switching power supply will not be suited because of the low drop out requirements.
When using a linear regulator, a proper heat sink shall be provided in order to dissipate
the power generated.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks close to the GE865, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is
rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the
GE865 from power polarity inversion.
An example of linear regulator with 5V input is:
6.3.1.2.
+ 12V input Source Power Supply Design Guidelines








The desired output for the power supply is 3.8V, hence due to the big difference between
the input source and the desired output, a linear regulator is not suited and shall not be
used. A switching power supply will be preferable because of its better efficiency
especially with the 2A peak current load represented by the GE865.
When using a switching regulator, a 500kHz or more switching frequency regulator is
preferable because of its smaller inductor size and its faster transient response. This
allows the regulator to respond quickly to the current peaks absorption.
In any case the frequency and Switching design selection is related to the application to
be developed due to the fact the switching frequency could also generate EMC
interferences.
For car PB battery the input voltage can rise up to 15,8V and this should be kept in mind
when choosing components: all components in the power supply must withstand this
voltage.
A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output (usually a tantalum one) is
rated at least 10V.
For Car applications a spike protection diode should be inserted close to the power input,
in order to clean the supply from spikes.
A protection diode should be inserted close to the power input, in order to save the
GE865 from power polarity inversion. This can be the same diode as for spike protection.
An example of switching regulator with 12V input is in the below schematic:
6.3.1.3.
Battery Source Power Supply Design Guidelines
 The desired nominal output for the power supply is 3.8V and the maximum voltage
allowed is 4.2V, hence a single 3.7V Li-Ion cell battery type is suited for supplying the
power to the Telit GE865 module.
WARNING:
The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB types MUST NOT BE
USED DIRECTLY since their maximum voltage can rise over the absolute maximum voltage
for the GE865 and damage it.
NOTE:
DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly connected with GE865. Their use
can lead to overvoltage on the GE865 and damage it. USE ONLY Li-Ion battery types.




A Bypass low ESR capacitor of adequate capacity must be provided in order to cut the
current absorption peaks, a 100μF tantalum capacitor is usually suited.
Make sure the low ESR capacitor (usually a tantalum one) is rated at least 10V.
A protection diode should be inserted close to the power input, in order to save the
GE865 from power polarity inversion. Otherwise the battery connector should be done in
a way to avoid polarity inversions when connecting the battery.
The battery capacity must be at least 500mAh in order to withstand the current peaks of
2A; the suggested capacity is from 500mAh to 1000mAh.
6.3.2.
Thermal Design Guidelines
The thermal design for the power supply heat sink should be done with the following
specifications:
 Average current consumption during transmission @ max PWR level:
500mA
 Average current consumption during transmission @ min PWR level:
150mA
 Average current during Power Saving (CFUN=5) :
2,4mA
 Average current during idle (Power Saving disabled):
24mA
NOTE:
The average consumption during transmissions depends on the power level at which the device
is requested to transmit by the network. The average current consumption hence varies
significantly.
Considering the very low current during idle, especially if Power Saving function is enabled, it
is possible to consider from the thermal point of view that the device absorbs current
significantly only during calls.
If we assume that the device stays into transmission for short periods of time (let's say few
minutes) and then remains for a quite long time in idle (let's say one hour), then the power
supply has always the time to cool down between the calls and the heat sink could be smaller
than the calculated one for 500mA maximum RMS current, or even could be the simple chip
package (no heat sink).
Moreover in the average network conditions the device is requested to transmit at a lower power
level than the maximum and hence the current consumption will be less than the 500mA, being
usually around 150mA.
For these reasons the thermal design is rarely a concern and the simple ground plane where the
power supply chip is placed can be enough to ensure a good thermal condition and avoid
overheating.
For the heat generated by the GE865, you can consider it to be during transmission 1W max
during CSD/VOICE calls and 2W max during class10 GPRS upload.
This generated heat will be mostly conducted to the ground plane under the GE865; you must
ensure that your application can dissipate it.
6.3.3.
Power Supply PCB layout Guidelines
As seen on the electrical design guidelines the power supply shall have a low ESR capacitor on
the output to cut the current peaks and a protection diode on the input to protect the supply from
spikes and polarity inversion. The placement of these components is crucial for the correct
working of the circuitry. A misplaced component can be useless or can even decrease the power
supply performances.








The Bypass low ESR capacitor must be placed close to the Telit GE865 power input pads
or in the case the power supply is a switching type it can be placed close to the inductor
to cut the ripple provided the PCB trace from the capacitor to the GE865 is wide enough
to ensure a dropless connection even during the 2A current peaks.
The protection diode must be placed close to the input connector where the power source
is drained.
The PCB traces from the input connector to the power regulator IC must be wide enough
to ensure no voltage drops occur when the 2A current peaks are absorbed. Note that this
is not made in order to save power loss but especially to avoid the voltage drops on the
power line at the current peaks frequency of 216 Hz that will reflect on all the
components connected to that supply, introducing the noise floor at the burst base
frequency. For this reason while a voltage drop of 300-400 mV may be acceptable from
the power loss point of view, the same voltage drop may not be acceptable from the noise
point of view. If your application doesn't have audio interface but only uses the data
feature of the Telit GE865, then this noise is not so disturbing and power supply layout
design can be more forgiving.
The PCB traces to the GE865 and the Bypass capacitor must be wide enough to ensure
no significant voltage drops occur when the 2A current peaks are absorbed. This is for
the same reason as previous point. Try to keep this trace as short as possible.
The PCB traces connecting the Switching output to the inductor and the switching diode
must be kept as short as possible by placing the inductor and the diode very close to the
power switching IC (only for switching power supply). This is done in order to reduce
the radiated field (noise) at the switching frequency (100-500 kHz usually).
The use of a good common ground plane is suggested.
The placement of the power supply on the board should be done in such a way to
guarantee that the high current return paths in the ground plane are not overlapped to any
noise sensitive circuitry as the microphone amplifier/buffer or earphone amplifier.
The power supply input cables should be kept separate from noise sensitive lines such as
microphone/earphone cables.
7.
Antenna
The antenna connection and board layout design are the most important aspect in the full
product design as they strongly affect the product overall performances, hence read carefully
and follow the requirements and the guidelines for a proper design.
7.1.
GSM Antenna Requirements
As suggested on the Product Description the antenna and antenna transmission line on PCB for a
Telit GE865 device shall fulfil the following requirements:
Frequency range
Bandwidth
Gain
Impedance
Input power
VSWR absolute max
VSWR recommended
ANTENNA REQUIREMENTS
Depending by frequency band(s) provided by the network
operator, the customer shall use the most suitable antenna
for that/those band(s)
70 MHz in GSM850, 80 MHz in GSM900, 170 MHz in
DCS & 140 MHz PCS band
1.4dBi @900 and 3dBi @1800
1.4dBi @850 and 3dBi @1900
50Ω
>2W
≤ 10:1 (limit to avoid permanent damage)
≤ 2:1 (limit to fulfil all regulatory requirements)
When using the GE865, since there's no antenna connector on the module, the antenna must be
connected to the GE865 antenna pad (BGA Ball H5) by means of a transmission line
implemented on the PCB.
In the case the antenna is not directly connected at the antenna pad of the GE865, then a PCB
line is needed in order to connect with it or with its connector.
This transmission line shall fulfill the following requirements:
ANTENNA LINE ON PCB REQUIREMENTS
Characteristic Impedance
50Ω
Max Attenuation
0,3 dB
Coupling with other signals shall be avoided
Cold End (Ground Plane) of antenna shall be equipotential to the
GE865 ground pins
Furthermore if the device is developed for the US market and/or Canada market, it shall comply
with the FCC and/or IC approval requirements:
This device is to be used only for mobile and fixed application. In order to re-use the Telit
FCC/IC approvals the antenna(s) used for this transmitter must be installed to provide a
separation distance of at least 20 cm from all persons and must not be co-located or operating in
conjunction with any other antenna or transmitter. If antenna is installed with a separation
distance of less than 20 cm from all persons or is co-located or operating in conjunction with
any other antenna or transmitter then additional FCC/IC testing may be required. End-Users
must be provided with transmitter operation conditions for satisfying RF exposure compliance.
Antennas used for this OEM module must not exceed 3dBi gain for mobile and fixed operating
configurations.
7.2.
GSM Antenna - PCB line Guidelines













Make sure that the transmission line’s characteristic impedance is 50Ω ;
Keep line on the PCB as short as possible, since the antenna line loss shall be less than
around 0,3 dB;
Line geometry should have uniform characteristics, constant cross section, avoid
meanders and abrupt curves;
Any kind of suitable geometry / structure (Microstrip, Stripline, Coplanar, Grounded
Coplanar Waveguide...) can be used for implementing the printed transmission line
afferent the antenna;
If a Ground plane is required in line geometry, that plane has to be continuous and
sufficiently extended, so the geometry can be as similar as possible to the related
canonical model;
Keep, if possible, at least one layer of the PCB used only for the Ground plane; If
possible, use this layer as reference Ground plane for the transmission line;
It is wise to surround (on both sides) the PCB transmission line with Ground, avoid
having other signal tracks facing directly the antenna line track.
Avoid crossing any un-shielded transmission line footprint with other signal tracks on
different layers;
The ground surrounding the antenna line on PCB has to be strictly connected to the main
Ground Plane by means of via holes (once per 2mm at least), placed close to the ground
edges facing line track;
Place EM noisy devices as far as possible from GE865 antenna line;
Keep the antenna line far away from the GE865 power supply lines;
If EM noisy devices are present on the PCB hosting the GE865, such as fast switching
ICs, take care of the shielding of the antenna line by burying it inside the layers of PCB
and surround it with Ground planes, or shield it with a metal frame cover.
If EM noisy devices are not present around the line, the use of geometries like Microstrip
or Grounded Coplanar Waveguide has to be preferred, since they typically ensure less
attenuation if compared to a Stripline having same length;
7.3.
PCB Guidelines in case of FCC certification
In the case FCC certification is required for an application using GE865, according to FCC KDB
996369 for modular approval requirements, the transmission line has to be similar to that
implemented on GE865 interface board and described in the following chapter.
7.3.1.
Transmission line design
During the design of the GE865 interface board, the placement of components has been chosen
properly, in order to keep the line length as short as possible, thus leading to lowest power losses
possible. A Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this kind of
transmission line ensures good impedance control and can be implemented in an outer PCB layer
as needed in this case. A SMA female connector has been used to feed the line.
The interface board is realized on a FR4, 4-layers PCB. Substrate material is characterized by
relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz.
A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm, clearance
from coplanar ground plane = 0.3 mm each side. The line uses reference ground plane on layer 3,
while copper is removed from layer 2 underneath the line. Height of trace above ground plane is
1.335 mm. Calculated characteristic impedance is 51.6 Ω, estimated line loss is less than 0.1 dB.
The line geometry is shown below:
03
. mm
02
. mm
03
. mm
L1
FR 4
11
. mm
L2
13
. 35mm
00
. 35mm
00
. 35mm
00
. 35mm
2. m
11
. mm
L3
7.3.2.
Transmission line measurements
HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A calibrated
coaxial cable has been soldered at the pad corresponding to GE865 RF output; a SMA connector
has been soldered to the board in order to characterize the losses of the transmission line
including the connector itself. During Return Loss / impedance measurements, the transmission
line has been terminated to 50 Ω load.
Return Loss plot of line under test is shown below:
Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω load) is
shown in the following figure:
Insertion Loss of G-CPW line plus SMA connector is shown below:
7.4.
GSM Antenna - Installation Guidelines





Install the antenna in a place covered by the GSM signal.
If the device antenna is located greater then 20cm from the human body and there are no
co-located transmitter then the Telit FCC/IC approvals can be re-used by the end product
If the device antenna is located less then 20cm from the human body or there are no colocated transmitter then the additional FCC/IC testing may be required for the end
product (Telit FCC/IC approvals cannot be reused)
Antenna shall not be installed inside metal cases
Antenna shall be installed also according Antenna manufacturer instructions.
8.
Logic level specifications
Where not specifically stated, all the interface circuits work at 2.8V CMOS logic levels. The
following table shows the logic level specifications used in the GE865 interface circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin
-0.3V +3.1V
(CMOS 2.8) when on
Input level on any digital pin
-0.3V +2.1V
(CMOS 1.8) when on
Input voltage on analog pins when -0.3V +3.0 V
on
Operating Range - Interface levels (2.8V CMOS)
Level
Min
Max
2.1V
3.1V
Input high level
Input low level
Output high level
Output low level
0V
2.2V
0V
0.5V
3.1V
0.35V
For 1.8V signals:
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
1.6V
2.0V
Input high level
Input low level
Output high level
Output low level
0V
1,65V
0V
0.4V
2.0V
0.35V
Current characteristics
Level
Typical
Output Current
1mA
Input Current
1uA
8.1.
Reset signal
Signal
RESET#
Function
Phone reset
I/O
Bga Ball
C1
RESET# is used to reset the GE865 . Whenever this signal is pulled low, the GE865 is reset.
When the device is reset it stops any operation. After the release of the reset GE865 is
unconditionally shut down, without doing any detach operation from the network where it is
registered. This behaviour is not a proper shut down because any GSM device is requested to
issue a detach request on turn off. For this reason the Reset signal must not be used to normally
shutting down the device, but only as an emergency exit in the rare case the device remains
stuck waiting for some network response.
The RESET# is internally controlled on start-up to achieve always a proper power-on reset
sequence, so there's no need to control this pin on start-up. It may only be used to reset a device
already on that is not responding to any command.
NOTE:
Do not use this signal to power off the GE865. Use the ON/OFF signal to perform this function
or the AT#SHDN command.
Reset Signal Operating levels:
Signal
RESET Input high
RESET Input low
Min
1.8V*
0V
Max
2.1V
0.2V
* this signal is internally pulled up so the pin can be left floating if not used.
If unused, this signal may be left unconnected. If used, then it must always be connected with
an open collector transistor, to permit to the internal circuitry the power on reset and under
voltage lockout functions.
9.
Serial Ports
The serial port on the GE865 is the core of the interface between the module and OEM hardware.
2 serial ports are available on the module:
 MODEM SERIAL PORT 1 (Main, ASC0)
 MODEM SERIAL PORT 2 (Auxiliary, ASC1)
9.1.
MODEM SERIAL PORT
Several configurations can be designed for the serial port on the OEM hardware, but the most
common are:
 RS232 PC com port
 microcontroller UART @ 2.8V - 3V (Universal Asynchronous Receive Transmit)
 microcontroller UART @ 5V or other voltages different from 2.8V
Depending from the type of serial port on the OEM hardware a level translator circuit may be
needed to make the system work. The only configuration that doesn't need a level translation is
the 2.8V UART.
The serial port on the GE865 is a +2.8V UART with all the 7 RS232 signals. It differs from the
PC-RS232 in the signal polarity (RS232 is reversed) and levels. The levels for the GE865
UART are the CMOS levels:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital -0.3V
+3.1V
pad when on
Input voltage on analog
-0.3V
+3.1V
pads when on
Operating Range - Interface levels (2.8V CMOS)
Level
Min
Max
Input high level VIH
2.1V
3.1 V
Input low level VIL
Output high level VOH
Output low level VOL
0V
2.2V
0V
0.5V
3.1V
0.35V
The signals of the GE865 serial port are:
RS232
Pin
Number
Signal
GE865
Pad Number
Name
DCD - dcd_uart
B5
Data Carrier Detect
A4
Transmit line *see Note
Output transmit line of GE865 UART
A3
Receive line *see Note
Input receive of the GE865 UART
DTR - dtr_uart
B3
Data Terminal Ready
Input to the GE865 that controls the DTE
READY condition
GND
C2, C7, E5,
E7, G1, G3,
G4, G5, H3,
H6
Ground
DSR - dsr_uart
B2
Data Set Ready
RTS -rts_uart
A1
Request to Send
CTS - cts_uart
A2
Clear to Send
RI - ri_uart
B4
Ring Indicator
RXD tx_uart
TXD rx_uart
Usage
Output from the GE865 that indicates the
carrier presence
ground
Output from the GE865 that indicates the
module is ready
Input to the GE865 that controls the
Hardware flow control
Output from the GE865 that controls the
Hardware flow control
Output from the GE865 that indicates the
incoming call condition
NOTE:
According to V.24, RX/TX signal names are referred to the application side, therefore on the
GE865 side these signal are on the opposite direction: TXD on the application side will be
connected to the receive line (here named TXD/ rx_uart ) of the GE865 serial port and
viceversa for RX.
NOTE:
For a minimum implementation, only the TXD and RXD lines can be connected, the other lines
can be left open provided a software flow control is implemented.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the GE865 when the module is powered off or during
an ON/OFF transition.
9.2.
RS232 level translation
In order to interface the GE865 with a PC com port or a RS232 (EIA/TIA-232) application a
level translator is required. This level translator must:

invert the electrical signal in both directions;

change the level from 0/2.8V to +15/-15V .
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower
levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the level
translator. Note that the negative signal voltage must be less than 0V and hence some sort of
level translation is always required.
The simplest way to translate the levels and invert the signal is by using a single chip level
translator. There are a multitude of them, differing in the number of drivers and receivers and in
the levels (be sure to get a true RS232 level translator not a RS485 or other standards).
By convention the driver is the level translator from the 0-2.8V UART to the RS232 level. The
receiver is the translator from the RS232 level to 0-2.8V UART.
In order to translate the whole set of control lines of the UART you will need:
 5 drivers
 3 receivers
NOTE:
The digital input lines working at 2.8V CMOS have an absolute maximum input voltage of
3.0V; therefore the level translator IC shall not be powered by the +3.8V supply of the module.
Instead, it must be powered from a +2.7V / +2.9V (dedicated) power supply.
This is because in this way the level translator IC outputs on the module side (i.e. GE865 inputs)
will work at +3.8V interface levels, damaging the module inputs.
An example of level translation circuitry of this kind is:
The
example
is
done with a SIPEX SP3282EB RS232 Transceiver that could accept supply voltages lower than
3V DC.
NOTE:
In this case Vin has to be set with a value compatible with the logic levels of the module. (Max
2.9V DC). In this configuration the SP3282EB will adhere to EIA/TIA-562 voltage levels
instead of RS232 (-5 ~ +5V).
Second solution could be done using a MAXIM transceiver (MAX218) In this case the
compliance with RS232 (+-5V) is possible.
Another
level
adapting
method could be done using a standard RS232 Transceiver (MAX3237EAI) adding some
resistors to adapt the levels on the GE865 Input lines.
NOTE: In this case has to be taken in account the length of the lines on the application to avoid
problems in case of High-speed rates on RS232.
The RS232 serial port lines are usually connected to a DB9 connector with the following layout:
5V UART level translation
If the OEM application uses a microcontroller with a serial port (UART) that works at a voltage
different from 2.8 - 3V, then a circuitry has to be provided to adapt the different levels of the
two set of signals. As for the RS232 translation there are a multitude of single chip translators.
For example a possible translator circuit for a 5V TRANSMITTER/RECEIVER can be:
TIP:
Note that the TC7SZ07AE has open drain output; therefore the resistor R2 is mandatory.
NOTE:
The input lines working at 2.8VCMOS can be pulled-up with 47KΩ
In case of reprogramming of the module has to be considered the use of the RESET line to start
correctly the activity.
The preferable configuration is having an external supply for the buffer.
9.3.
UART Behaviour
The UART ports have a different behaviour according to the module’s selected functional mode
(i.e. Power Saving).
Please refer to the SW User Guide to have a full overview of the Serial port signals behaviour in
the different selected conditions.
10.
Audio Section Overview
The Base Band Chip of the GE865 provides one audio path both in Uplink (transmit) and in
Downlink (receive) direction , as shown in the next figure .
For more information refer to Telit document :
“ 80000NT10007a Audio Settings Application Note “.
Audio Section Block Diagram
10.1.
Electrical Characteristics
TIP: Being the microphone circuitry the more noise sensitive, its design and layout must be
done with particular care. Both microphone paths are balanced and the OEM circuitry must
be balanced designed to reduce the common mode noise typically generated on the ground
plane. However the customer can use the unbalanced circuitry for particular application.
10.1.1.
Input Lines
“MIC 1” differential microphone path
Line Coupling
AC*
Line Type
Balanced
Coupling capacitor
≥ 100nF
Differential input resistance
50kΩ
Differential input voltage
≤ 1,03Vpp @ MicG=0dB
(*) WARNING : AC means that the signals from the microphone have to be connected to
input lines of the module through capacitors which value has to be ≥ 100nF.
Not
respecting this constraint, the input stages will be damaged.
WARNING: when particular OEM application needs a Single Ended Input configuration, it is
forbidden connecting the unused input directly to Ground, but only through a capacitor which
value has to be ≥ 100nF..
Don’t forget that in Single Ended configuration the useful input signal will be halved.
10.1.2.
Output Lines
TIP : We suggest driving the load differentially , thus the output swing will double and the need
for the big output coupling capacitor avoided. However if particular OEM application needs,
also a Single Ended (S.E) circuitry can be implemented but the output power will be reduced
four times.
The OEM circuitry shall be designed to reduce the common mode noise typically generated on
the ground plane,getting the maximum power output from the device (low resistance tracks).
WARNING. When in Single Ended configuration, the unused output line must be left open: if
this constraint is not respected, the output stage will be damaged.
“EAR_MT” Output Lines
line coupling
single-ended
differential
output load resistance
AC
DC
≥ 14 Ω
internal output resistance
4 Ω (typical)
signal bandwidth
150 ÷4000 Hz @ -3dB
max. differential output voltage
1.31 Vrms (typical, open circuit)
differential output voltage
328mVrms /16 Ω @ -12dBFS (*)
volume increment
2 dB per step
volume steps
10
(*) 0dBFS is the normalized overall Analog Gain equal to 3,7Vpp differential
11.
General Purpose I/O
The general purpose I/O pads can be configured to act in three different ways:

input

output

alternate function (internally controlled)
Input pads can only be read ; they report the digital value (high or low) present on the pad at the
read time .
Output pads can only be written or queried and set the value of the pad output.
An alternate function pad is internally controlled by the GE865 firmware and acts depending on
the function implemented.
For Logic levels please refer to chapter 8.
The following table shows the available GPIO on the GE865 .
Signal
I/O
Function
GPIO_01
I/O
GPIO01 Configurable GPIO
GPIO_02
I/O
GPIO_03
Type
Default
State
ON_OFF
state
CMOS 2.8V
Input /
output
current
1uA/1mA
INPUT
State
during
Reset
Note
GPIO02 Configurable GPIO
CMOS 2.8V
1uA/1mA
INPUT
I/O
GPIO03 Configurable GPIO
CMOS 2.8V
1uA/1mA
INPUT
GPIO_04
I/O
GPIO04 Configurable GPIO
CMOS 2.8V
1uA/1mA
INPUT
GPIO_05
I/O
GPIO05 Configurable GPIO
CMOS 2.8V
1uA/1mA
INPUT
GPIO_06
I/O
GPIO06 Configurable GPIO
CMOS 2.8V
1uA/1mA
INPUT
GPIO_07
I/O
GPIO07 Configurable GPIO
CMOS 2.8V
1uA/1mA
INPUT
GPIO_08
I/O
GPIO08 Configurable GPIO
CMOS 2.8V
1uA/1mA
INPUT
GPIO_09
I/O
GPIO09 Configurable GPIO
CMOS 2.8V
Open Drain
GPIO_10
I/O
GPIO10 Configurable GPIO
CMOS 2.8V
Open Drain
Alternate function
(JDR)
Alternate function
(RF Transmission
Control)
Alternate function
(RFTXMON)
Alternate function
(ALARM)
Alternate function
(BUZZER)
Not all GPIO pads support all these three modes:





GPIO2 supports all three modes and can be input, output, Jamming Detect Output
(Alternate function)
GPIO4 supports all three modes and can be input, output, RF Transmission Control
(Alternate function)
GPIO5 supports all three modes and can be input, output, RFTX monitor output
(Alternate function)
GPIO6 supports all three modes and can be input, output, alarm output (Alternate
function)
GPIO7 supports all three modes and can be input, output, buzzer output (Alternate
function
11.1.
GPIO Logic levels
Where not specifically stated, all the interface circuits work at 2.8V CMOS logic levels.
The following table shows the logic level specifications used in the GE865 interface circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin
-0.3V
+3.1V
when on (CMOS 2.8)
Input level on any digital pin
-0.3V
+2.1V
when on (CMOS 1.8)
Input voltage on analog pins
-0.3V
+3.0V
when on
Operating Range - Interface levels (2.8V CMOS)
Level
Min
Max
Input high level
Input low level
Output high level
Output low level
2.1V
0V
2.2V
0V
3.1V
0.5V
3.1V
0.35V
For 1.8V signals:
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
Input low level
Output high level
Output low level
1.6V
0V
1,65V
0V
2.0V
0.4V
1.85V
0.35V
11.2.
Using a GPIO Pad as INPUT
The GPIO pads, when used as inputs, can be connected to a digital output of another device and
report its status, provided this device has interface levels compatible with the 2.8V CMOS levels
of the GPIO.
If the digital output of the device to be connected with the GPIO input pad has interface levels
different from the 2.8V CMOS, then it can be buffered with an open collector transistor with a
47K pull up to 2.8V.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the GE865 when the module is powered off or during
an ON/OFF transition.
11.3.
Using a GPIO Pad as OUTPUT
The GPIO pads, when used as outputs, can drive 2.8V CMOS digital devices or compatible
hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up
resistor may be omitted.
11.4.
Using the RF Transmission Control GPIO4
The GPIO4 pin, when configured as RF Transmission Control Input, permits to disable the
Transmitter when the GPIO is set to Low by the application.
In the design is necessary to add a pull up resistor (47K to 2.8V);
11.5.
Using the RFTXMON Output GPIO5
The GPIO5 pin, when configured as RFTXMON Output, is controlled by the GE865 module
and will rise when the transmitter is active and fall after the transmitter activity is completed.
There are 2 different modes for this function:
1) Active during all the calls:
For example, if a call is started, the line will be HIGH during all the conversation and it will be
again LOW after hanged up.
The line rises up 300ms before first TX burst and will became again LOW from 500ms to 1s
after last TX burst.
2) Active during all the TX activity:
The GPIO is following the TX bursts
Please refer to the AT User interface manual for additional information on how to enable this
function.
11.6.
Using the Alarm Output GPIO6
The GPIO6 pad, when configured as Alarm Output, is controlled by the GE865 module and will
rise when the alarm starts and fall after the issue of a dedicated AT command.
This output can be used to power up the GE865 controlling microcontroller or application at the
alarm time, giving you the possibility to program a timely system wake-up to achieve some
periodic actions and completely turn off either the application and the GE865 during sleep
periods, dramatically reducing the sleep consumption to few μA.
In battery-powered devices this feature will greatly improve the autonomy of the device.
11.7.
Using the Buzzer Output GPIO7
The GPIO7 pad, when configured as Buzzer Output, is controlled by the GE865 module and
will drive a Buzzer driver with appropriate square waves.
This permits to your application to easily implement Buzzer feature with ringing tones or
melody played at the call incoming, tone playing on SMS incoming or simply playing a tone or
melody when needed.
A sample interface scheme is included below to give you an idea of how to interface a Buzzer to
the GPIO7:
TR2
SMBT2907A
+V buzzer
R1
4,7K
D1
D1N4148
C1
33pF
R2
1K
GPIO7
TR1
BCR141W
NOTE:
To correctly drive a buzzer a driver must be provided, its characteristics depend on the Buzzer
and for them refer to your buzzer vendor.
11.8.
Indication of network service availability
The STAT_LED pin status shows information on the network service availability and Call status.
In the GE865 modules, the STAT_LED usually needs an external transistor to drive an external
LED.
Therefore, the status indicated in the following table is reversed with respect to the pin status.
LED status
Permanently off
Fast blinking
(Period 1s, Ton 0,5s)
Slow blinking
(Period 3s, Ton 0,3s)
Permanently on
Device Status
Device off
Net search / Not registered /
turning off
Registered full service
a call is active
A schematic example could be:
11.9.
RTC Bypass out
The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the
digital part, allowing having only RTC going on when all the other parts of the device are off.
To this power output a backup capacitor can be added in order to increase the RTC autonomy
during power off of the battery. NO Devices must be powered from this pin.
11.10.
External SIM Holder Implementation
Please refer to the related User Guide (SIM Holder Design Guides, 80000NT10001a).
12.
DAC and ADC section
12.1.
DAC Converter
12.1.1.
Description
The GE865 provides a Digital to Analog Converter. The signal (named DAC_OUT) is available
on BGA Ball G7 of the GE865 and on pin 17 of PL102 on GE865 Interface Board (CS1324).
The on board DAC is a 10 bit converter, able to generate a analogue value based a specific input
in the range from 0 up to 1023. However, an external low-pass filter is necessary
Voltage range (filtered)
Range
Min
Max
2,6
1023
Units
Volt
Steps
The precision is 10 bits so, if we consider that the maximum voltage is 2V, the integrated
voltage could be calculated with the following formula:
Integrated output voltage = (2 *value) / 1023
DAC_OUT line must be integrated (for example with a low band pass filter) in order to obtain
an analog voltage.
12.1.2.
Enabling DAC
An AT command is available to use the DAC function.
The command is: AT#DAC= [ [, ]]
 - scale factor of the integrated output voltage (0..1023 - 10 bit precision)
it must be present if =1
Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.
NOTE:
The DAC frequency is selected internally. D/A converter must not be used during
POWERSAVING.
12.1.3.
Low Pass Filter Example
12.2.
ADC Converter
12.2.1.
Description
The on board A/D are 11-bit converter. They are able to read a voltage level in the range of 0÷2
volts applied on the ADC pin input, store and convert it into 11 bit word.
Input Voltage range
AD conversion
Resolution
Min
Max
11
<1
Units
Volt
bits
mV
The GE865 module provides 2 Analog to Digital Converters.
The input lines are:
ADC_IN1
available on Ball F5 and Pin 19 of PL102 on GE865 Interface Board (CS1324).
ADC_IN2
available on Ball F6 and Pin 20 of PL102 on GE865 Interface Board (CS1324).
12.2.2.
Using ADC Converter
An AT command is available to use the ADC function.
The command is AT#ADC=1,2
The read value is expressed in mV
Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.
13.
Mounting the GE865 on your Board
13.1.
General
The GE865 modules have been designed in order to be compliant with a standard lead-free
SMT process.
13.2.
Module finishing & dimensions
Bottom View
13.3.
Recommended foot print for the application
order to easily rework the GE865 is suggested to consider on the application a 1.5mm Inhibit area
around the module.
It is also suggested, as common rule for an SMT component, to avoid having a mechanical part of the
application in direct contact with the module.
NOTE: In the customer application, the region under INHIBIT WIRING *1 (see figure)
must be clear from signal or ground paths.
13.4.
Debug of the GE865 in production
To test and debug the mounting of the GE865, we strongly recommend to foreseen test pads on
the host PCB, in order to check the connection between the GE865 itself and the application and
to test the performance of the module connecting it with an external computer. Depending by the
customer application, these pads include, but are not limited to the following signals:
 TXD
 RXD
 ON/OFF
 RESET
 GND
 VBATT
 TX_AUX
 RX_AUX
 PWRMON
 SERVICE
13.5.
Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120µm.
13.6.
PCB pad design
Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.
Recommendations for PCB pad dimensions
Ball pitch [mm]
Solder resist opening diameter A [mm]
Metal pad diameter B [mm]
2,4
1,150
1 ± 0.05
It is not recommended to place via or microvia not covered by solder resist in an area of 1,6mm
diameter around the pads unless it carries the same signal of the pad itself. (see following figure).
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Electro-less Ni /
Immersion Au
Layer thickness [µm]
3 –7 /
0.05 – 0.15
Properties
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability of tinlead solder paste on the described surface plating is better compared to lead-free solder paste.
13.7.
Solder paste
Solder paste
Lead free
Sn/Ag/Cu
It is recommended to use only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
13.7.1.
GE865 Solder reflow
The following is the recommended solder reflow profile
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up Rate
Time maintained above:
– Temperature (TL)
– Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak
Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Pb-Free Assembly
3°C/second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
245 +0/-5°C
10-30 seconds
6°C/second max.
8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on the package body surface
WARNING:
The GE865 module withstands one reflow process only.
14.
Packing system
14.1.
Packing on tray
The GE865 modules are packaged on trays of 50 pieces each. This is especially suitable for the
GE865 according to SMT processes for pick & place movement requirements. See detail B for
module positioning and tray orientation into the envelope.
14.1.1.
Tray detail
The size of the tray is: 329 x 176mm.
WARNING: These trays can withstand at the maximum temperature of 65° C.
14.2.
Packaging on reel
The GE865-QUAD can be packaged on reels of 200 pieces each. See figure for module
positioning into the carrier.
DIRECTION OF UNREELING
NOT Rounded
Corner
14.2.1.
Carrier Tape detail
14.2.2.
Reel detail
14.2.3.
Packaging detail
Silica-gel bag (x3)
Shielding & ESD envelope
Humidity indicator
Multi Device &
Packaging label
Reel label
TOTAL: 200 MODULES
14.3.
Moisture sensibility
The level of moisture sensibility of the Product is “3”, according with standard IPC/JEDEC JSTD-020, take care of all the relative requirements for using this kind of components.
Moreover, the customer has to take care of the following conditions:
a) The shelf life of the Product inside of the dry bag must be 12 months from the bag seal date,
when stored in a non-condensing atmospheric environment of <40°C / 90% RH
b) Environmental condition during the production: <= 30°C / 60% RH according to IPC/JEDEC
J-STD-033A paragraph 5
c) The maximum time between the opening of the sealed bag and the reflow process must be
168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more
15.
Conformity Assessment Issues
The Telit GE865 Module has been assessed in order to satisfy the essential requirements of the
R&TTE Directive 1999/05/EC (Radio Equipment & Telecommunications Terminal
Equipments) to demonstrate the conformity against the harmonised standards with the final
involvement of a Notified Body.
0889
By using our certified module, the evaluation under Article 3.2 of the R&TTE is considerably
reduced, allowing significant savings in term of cost and time in the certification process of the
final product.
In all cases the assessment of the final product must be made against the Essential requirements
of the R&TTE Directive Articles 3.1(a) and (b), Safety and EMC respectively, and any relevant
Article 3.3 requirements.
This Hardware User Guide contain all the information you may need for developing a product
meeting the R&TTE Directive.
Furthermore the GE865 Module module is FCC Approved as module to be installed in other
devices. This device is to be used only for fixed and mobile applications. If the final product
after integration is intended for portable use, a new application and FCC is required.
The GE865 Module is conforming to the following US Directives:
• Use of RF Spectrum. Standards: FCC 47 Part 24 (GSM 1900)
• EMC (Electromagnetic Compatibility). Standards: FCC47 Part 15
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause
undesired operation.
To meet the FCC's RF exposure rules and regulations:
• The system antenna(s) used for this transmitter must be installed to provide a separation distance
of at least 20 cm from all the persons and must not be co-located or operating in conjunction
with any other antenna or transmitter.
• The system antenna(s) used for this module must not exceed 1.4dBi (850MHz) and 3.0dBi
(1900MHz) for mobile and fixed or mobile operating configurations.
• Users and installers must be provided with antenna installation instructions and transmitter
operating conditions for satisfying RF exposure compliance.
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to
clarify any regulatory questions and to have their complete product tested and approved for FCC
compliance.
16.
SAFETY RECOMMANDATIONS
READ CAREFULLY
Be sure the use of this product is allowed in the country and in the environment required. The
use of this product may be dangerous and has to be avoided in the following areas:
 Where it can interfere with other electronic devices in environments such as hospitals,
airports, aircrafts, etc.
 Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is
responsibility of the user to enforce the country regulation and the specific environment
regulation.
Do not disassemble the product; any mark of tampering will compromise the warranty validity.
We recommend following the instructions of the hardware user guides for a correct wiring of the
product. The product has to be supplied with a stabilized voltage source and the wiring has to be
conforming to the security and fire prevention regulations. The product has to be handled with
care, avoiding any contact with the pins because electrostatic discharges may damage the
product itself. Same cautions have to be taken for the SIM, checking carefully the instruction for
its use. Do not insert or remove the SIM when the product is in power saving mode.
The system integrator is responsible of the functioning of the final product; therefore, care has to
be taken to the external components of the module, as well as of any project or installation issue,
because the risk of disturbing the GSM network or external devices or having impact on the
security. Should there be any doubt, please refer to the technical documentation and the
regulations in force. Every module has to be equipped with a proper antenna with specific
characteristics. The antenna has
to be installed with care in order to avoid any interference with other electronic devices and has
to guarantee a minimum distance from the body (20 cm). In case of this requirement cannot be
satisfied, the system integrator has to assess the final product against the SAR regulation.
The European Community provides some Directives for the electronic equipments
introduced on the market. All the relevant information’s are available on the European
Community website:
http://ec.europa.eu/enterprise/sectors/rtte/documents/
The text of the Directive 99/05 regarding telecommunication equipments is available,
while the applicable Directives (Low Voltage and EMC) are available at:
http://ec.europa.eu/enterprise/sectors/electrical/
17.
Document History
Revision
Date
ISSUE#0
ISSUE#1
ISSUE#2
2009-01-26
2009-02-15
2009-02-15
ISSUE#3
2009-03-18
ISSUE#4
ISSUE#5
ISSUE#6
2009-04-02
03/06/2009
04/06/2009
ISSUE#7
2009-05-26
ISSUE#8
2009-06-18
ISSUE#9
2009-07-27
ISSUE#10
2009-09-22
ISSUE#11
2010-07-12
ISSUE#12
2010-07-28
ISSUE#13
2011-10-11
ISSUE#14
2012-03-12
ISSUE#15
2012-04-23
ISSUE#16
2013-04-22
Changes
First ISSUE# 0 - DRAFT
Updated current consumptions table
Updated Pinout description
Updated mechanical dimensions (balls spacing),
charger description removed,
Added better explanation of pin H5 (RF) and H1 (service)
Updated VBATT supply Range, DAC schematic, Conformity assessment
Updated section 13 (FCC Conformity assessment)
Updated section 13 (FCC Conformity assessment)
Applied new layout + minor editing
Edited PCB pad design par.13.1.6
Updated all schematic drawings
Updated Chapter 10 Audio Section
Substituted GE865-QUAD with GE865
Corrected GE864-QUAD/PY with GE865
Updated Overview section
Changed par. 5.1 Turning ON…. and par. 6.1 Power supply Requirements
Changed par. 13.3 and par.15 Conformity Assessment Issues
Added DVI pins description
Updated table of power consumptions.
Added note on chapters 5.1, 5.2, 9.3
Corrected chapter 1.1
Updated logic levels specification
Added NOTE on ON_OFF procedure, serial port , GPIO section
Corrected note on RESET section
Updated Current Consumptions
Updated flow charts for ON OFF and Reset
Updated name for Auxiliary UART port
Updated Chapter 7
Updated Chapter 14
Updated Chapters 13.2, 13.5, 13.6, 14, 14.3.
Updated Chapter 4.1-Reset-internal pull-up
Updated Chapter 14.3 Moisture sensibility – add details
Updated Chapter 16. Safety Recommendations – updated with FCC and IC
requirements
Updated page 44 cut the sentence about the PULL-UP resistor on TX RTS and CTS
Solder paste chapter updated, added Power consumption plots section, added serial
port behavior section, cut Buzzer section
Updated Chapter 15 Conformity Assessment Issues

---

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Title                           : GE865 Harware User Guide
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