COBAN ELECTRONICS CB900 GSM Module User Manual CB 900 GSM GPRS Module
Shenzhen Coban Electronics Co., Ltd. GSM Module CB 900 GSM GPRS Module
User manual
CB900 GSM/GPRS Module Product Technical Specifications Date Document Version Our Reference 2013-9-11 1.1 02000B33 CONTENTS 1. Introduction ....................................................................................................................... 3 1.1. 1.2. 2. Abbreviations ......................................................................................................... 3 Safety Precautions ................................................................................................... 4 Technical Specifications ..................................................................................................... 5 2.1. General Specifications ............................................................................................. 5 2.2. GSM/ GPRS Specifications ..................................................................................... 5 2.3. RF Frequencies ....................................................................................................... 6 2.4. Baseband Functionalities ......................................................................................... 6 3. 2.5. Interface Specifications ........................................................................................... 6 Functional Architecture ...................................................................................................... 7 4. INTERFACES ................................................................................................................... 8 4.1. 4.2. 4.3. Pin Assignments...................................................................................................... 8 Pin description ........................................................................................................ 9 Power Supply and Ground ..................................................................................... 11 4.4. 4.5. 4.6. 4.7. Operating Modes................................................................................................... 12 Analog to Digital Converter (ADC) ....................................................................... 13 Power ON Control ................................................................................................ 13 Subscriber Identity Module (SIM) Interface ........................................................... 14 4.8. Serial Link (UART) Interfaces ............................................................................... 15 4.9. USB Interface ....................................................................................................... 17 4.10. Analog Audio Interfaces .................................................................................... 18 4.10.1. 4.10.2. 4.10.3. Microphone input ...................................................................................... 18 Speaker ..................................................................................................... 19 Earphone ................................................................................................... 20 4.11. General Purposes Input / Output ports .................................................................... 21 4.12. Keyboard Interface ............................................................................................ 21 4.13. 2-Wire Serial Interface ...................................................................................... 22 4.14. RF interface ...................................................................................................... 22 4.14.1. RF Performance ......................................................................................... 22 4.14.2. Recommendations...................................................................................... 22 1. Introduction This document describes the hardware interface, including interface specifications, electrical and mechanical details, of the CB900 module that connects to the cellular device application. 1.1. Abbreviations The following abbreviations are used in this document: Abbreviation Description ACM Accumulated Call Meter ADC Analog Digital Convertor AMR Adaptive Multi-rate AMR- FR AMR Full-rate ADN Abbreviated Dialing Number APN Access Point Name CLIP Calling Line Identity Presentation CSD Circuit Switched Data DCD Data Carrier Detect DCE Data Communication Equipment DCS Data Coding Scheme DTE Data Terminal Equipment DTMF Dual Tone Multi Frequency DTR Data Terminal Ready EFR Enhanced Full-rate FR Full-rate GPIO General Purpose Input Output GPRS General Packet Radio Service GSM Global Standard for Mobile Communications IP Internet Protocol PDP Packet Data Protocol PDU Packet Data Unit PPP Point-to-Point Protocol RF Radio Frequency RTS Ready To Send SIM Subscriber Identification Number SMS Short Messages Service TCP Transmission Control Protocol UART Universal Asynchronous Receiver Transmitter UDP User Data Protocol USSD Unstructured Supplementary Service Data 1.2. Safety Precautions For your own safety, please follow the safety precautions listed below during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating the CB900 Module. All manufacturers of these cellular terminals or mobile devices are advised to include the following safety precautions into all manuals provided with their terminal or mobile device, and pass this information to device users and operating personnel. Failure to comply may be dangerous or illegal. Road safety Do not use a mobile device while driving. Park the vehicle first or use a hand free earphone. It is illegal in some countries to use a mobile device while driving. Switch off in aircraft Cellular terminal or mobile devices can cause interference to aircraft electronics. Using them on aircraft is both illegal and dangerous. Switch off when refueling vehicle Do not use the cellular terminal or mobile device at a refueling station or near fuels or chemicals. Forbidden Usage Always switch off your cellular terminal or mobile device where it is forbidden to be used in any areas like a hospital. Interference All cellular terminals or mobile devices may be subjected to radio interference, which could affect their performance. Emergency calls As the GSM/GPRS module is based on GSM standard for radio signals and cellular networks, this connection cannot be guaranteed at all times under all conditions. It should never be entirely relied upon for essential communications such as an emergency call. Note on compliance with international rules and regulations The CB900 module is a fully certified cellular radio engine. The module has been tested and certified for compliance to international safety and GSM standard requirements at the modular level. Manufacturers of cellular terminal or mobile equipment incorporating the CB900 are required to test their final products to ensure compliance to these EMC tests/requirements: ESD Radiated Spurious Emissions Conducted Emissions, if applicable Further tests if applicable The module was not assessed against the essential requirement ‘health’. Manufacturers of the final products are also responsible to ensure that their products are tested for compliance to any other health requirements that might be applicable. A few other important notes regarding safety in implementation and usage of the module: The module shall be supplied by a Limited Power Supply (LPS) according to EN60950:2000. No necessary spacing (creepage and clearance distance) shall be reduced by installing the module into the final equipment. Provisions shall be made for fastening the module securely in the end product. Instructions and equipment markings related to safety shall be in a language, which is acceptable in the country in which the equipment is to be installed. 2. Technical Specifications 2.1. General Specifications Feature Description Network Type Quad-Band GSM/GPRS Frequency Bands Quad Band: GSM850 / EGSM900 / DCS1800 / PCS1900 Output Power GSM 850 / EGSM 900 : Class 4 (2W) DCS1800 / PCS1900: Class 1 (1W) Physical Dimensions Dimensions: 27.3 *27.3 *3mm Weight: 5g (including of shielding) Power Supply 3.5V to 4.6V Operational Environmental Description Normal Operating Temperature -20°C to +55°C Extended Operating Temperature Relative humidity -40°C to +85°C 5 – 95% 2.2. GSM/ GPRS Specifications Feature Description Telephony Emergency call Half Rate, Full Rate and Enhanced Full Rate (HR/FR/EFR) GSM Audio Adaptive Multi-rate (AMR) Hands-Free Operation Echo Cancellation (Enhanced AEC) Noise Reduction DTMF (encoding only) Point-to-point (MO/MT) SMS Cell Broadcast Text and PDU mode Class 12/10/8 Mobile Station Class B GPRS Coding Schemes MCS1 – MCS4 TCP Stack, UDP Stack HTTP Stack, FTP Stack PPP Stack 2.3. RF Frequencies RF functionalities comply with the GSM Phase II GSM 850/EGSM 900/DCS 1800/PCS 1900 recommendations. The frequencies covered are: Tx GSM850: (824 ~ 849 MHz) Tx EGSM900: (880 ~ 915 MHz) Rx GSM850: (869 ~ 894 MHz) Rx EGSM900: (925 ~ 960 MHz) Tx DCS1800: (1710 ~ 1785 MHz) Tx PCS1900: (1850 ~ 1910 MHz) Rx DCS1800: (1805 ~ 1880 MHz) Rx PCS1900: (1930 ~ 1990 MHz) 2.4. Baseband Functionalities The Baseband is composed of an ARM, The digital baseband power supply is 1.2V and the digital IO power supply is 1.8V. 2.5. Interface Specifications Feature Description 68-pin LCC Power Supply Back-up Battery Keypad 2 Serial Link UART USB 1.1 1.8V/3V SIM Real time clock GPIOs Analog to Digital Converter Analog Audio Reset Power On Battery Charging Interface I2C master* *For hardware reference only. These features are not enabled in the standard module firmware as it requires a certain level of firmware customization depending on its intended application. Please contact COBAN for more information 3. Functional Architecture Figure 1 shows a block diagram of CB900 module and illustrate the major functional components Figure 1: CB900 Functional Architecture Block Diagram 4. INTERFACES 4.1. Pin Assignments Figure 2: CB900 Pin assignments Pin Signal Name GND RF_ANT GND GPIO79 Signal I/O Pin Signal Name Signal I/O 35 MCDA3 I/O 36 MCCLK I/O 37 MCDA1 I/O I/O 38 MCINS I/O KP_LED I/O 39 LSA0DA0 I/O PWR_KEY 40 LSCK0 I/O VBAT 41 LSCE0B0 I/O VBAT 42 LSDA0 I/O I/O 9 GPIO81 I/O 43 LSRSTB0 10 ADC1 44 LSDIO I/O 11 BACKUP I/O 45 VIO18 12 GND 46 VIO28 13 MIC- 47 LCM_LED- 14 MIC+ 48 GPIO45 I/O 15 XMIC 49 GPIO61 I/O 16 SPK+ 50 UTXD2 17 SPK- 51 URXD2 18 MP3_R 52 EINT0 19 MP3_L 53 GPIO16 I/O 20 GND 54 KCOL3 I/O 21 GPIO18 I/O 55 KCOL0 I/O 22 VCHG 56 KCOL2 I/O 23 GND 57 KROW4 I/O 24 USB_DP I/O 58 KROW3 I/O 25 USB_DM I/O 59 GND 26 GND 60 NC 27 VSIM1 61 GND 28 SIM1_CLK 62 KCOL4 I/O 29 SIM1_RST 63 KROW0 I/O 30 SIM1_DATA I/O 64 KROW2 I/O 31 VMC 65 SCL28 I/O 32 MCDA0 I/O 66 SDA28 I/O 33 MCDA2 I/O 67 URXD1 34 MCCM0 I/O 68 UTXD1 4.2. Pin description Pin Signal Name Signal I/O Description GND RF_ANT GND I/O RF I / O 50 ohm characteristic impedance GPIO79 I/O General Purpose IO Not to float KP_LED I/O Keyboard backlight Not to float PWR_KEY Low PWR_KEY for a specified time period to boot or shutdown VBAT VBAT VBAT=3.5V~4.6V Remark Internally pulled up to 2.8V Maximum load current 2A GPIO81 I/O General Purpose IO Not to float 10 ADC1 Analog to digital conversion Not to float 11 BACKUP I/O Backup battery pin Not to float 12 GND 13 MIC- 14 MIC+ Audio Input channel 1 15 XMIC Audio Input channel 2 16 SPK+ 17 SPK- Audio Output channel 1 18 MP3_R 19 MP3_L Audio Output channel 2 20 GND 21 GPIO18 I/O General Purpose IO Not to float 22 VCHG Charging Pin Not to float 23 GND 24 USB_DP I/O USB data cable positive signal Not to float 25 USB_DM I/O USB data cable negative signal Not to float 26 GND 27 VSIM1 SIM card supply voltage 28 SIM1_CLK SIM card clock line 29 SIM1_RST SIM card reset line SIM card into the module line 30 SIM1_DATA I/O SIM card data cable should not exceed 20cm 31 VMC SD card power cable Not to float 32 MCDA0 I/O SD card data cable Not to float 33 MCDA2 I/O SD card data cable Not to float 34 MCCM0 I/O SD card command line Not to float 35 MCDA3 I/O SD card data cable Not to float 36 MCCLK I/O SD card clock line Not to float 37 MCDA1 I/O SD card data cable Not to float 38 MCINS I/O SD card insertion detection line Not to float 39 LSA0DA0 I/O LCD address line Not to float 40 LSCK0 I/O LCD clock line Not to float 41 LSCE0B0 I/O LCD chip select line Not to float 42 LSDA0 I/O LCD data address line Not to float 43 LSRSTB0 LCD reset line Not to float 44 LSDIO I/O LCD data cable Not to float 45 VIO18 46 VIO28 47 LCM_LED- LCD backlight Not to float 48 GPIO45 I/O General Purpose IO Not to float LCD power Not to float Not to float 49 GPIO61 I/O General Purpose IO Not to float 50 UTXD2 Serial data transmit Not to float 51 URXD2 Serial data receive Not to float 52 EINT0 External interrupt input Not to float 53 GPIO16 I/O General Purpose IO Not to float 54 KCOL3 Keyboard input Not to float 55 KCOL0 Keyboard input Not to float 56 KCOL2 Keyboard input Not to float 57 KROW4 Keyboard input Not to float 58 KROW3 Keyboard input Not to float 59 GND 60 NC 61 GND 62 KCOL4 Keyboard input Not to float 63 KROW0 Keyboard input Not to float 64 KROW2 Keyboard input Not to float 65 SCL28 I/O I2C clock line Not to float 66 SDA28 I/O I2C data cable Not to float 67 URXD1 Serial data receive Not to float 68 UTXD1 Serial data transmit Not to float 4.3. Power Supply and Ground The power supply design is one of the key design areas for a GSM terminal due to the burst characteristics of GSM transmission. The supply must be able to deliver very high current peaks in a very short time during a GSM transmit burst, typically up to 2A. During these bursts, it is recommended that the voltage drop does not exceed 400mV. The voltage ripple should not exceed 50mV at frequencies up to 200 kHz and 2mV at frequencies above 200 kHz. This might cause the module to reset. All four legs of the shield must be soldered onto the target PCB. The ground connection of the target PCB has to go through a full ground plane on the PCB. Power Supply Voltage The power supply voltage for VBATT is given below: Power Supply Parameters Conditions Min Type Max Unit Supply Voltages Voltage measured at the VBAT pin. If voltage drops below 3.5V, the module will automatically power off. 3.5* 4.2 4.6 Voltage Drop Normal condition with max transmitter output 400 mV VBAT Voltage Ripple Normal condition with max transmitter output 50 Note: * must be guaranteed to ensure compliance with the GSM certification requirements. Figure 3: voltage and current waveform of the modules at launch Figure 4: VBAT input reference circuit 4.4. Operating Modes Operation Type Mode Description GSM IDLE The module is registered to the network. Power consumption depends on the interval of the network paging. Normal Operation GSM CONNECTED The module has established a call connection with the network. Power consumption depends on the network settings and coverage mV GPRS IDLE The module is attached to the GPRS network. Power consumption depends on the network settings. The module sends and receives data from the network. GPRS DATA Power consumption depends on the network settings and GPRS configurations. In order to extend the battery life of hand held GSM SLEEP Reduced devices, the module can enter into a sleep mode with software command. The module will wake up from the sleep mode if there are any activities. operation The module disconnect from the network just like AIRPLANE SLEEP but keep the SIM active so that activity like accessing the phone book in SIM is still possible. Battery Charging The module performs battery charging in parallel with CHARGE other operation 4.5. Analog to Digital Converter (ADC) Electrical Characteristics Parameters Conditions Min Type Max Unit Resolution 10 Bits Reference voltage 2.8 Differential non-linearity -2 LSB Integral non-linearity Best Fitting -2 LSB Input Range 2.8 Input Resistance 100 KΩ Figure 5: ADC input reference circuit 4.6. Power ON Control This input pin is used to switch the module ON. A switch-ON interruption is triggered in the module at the detection of a falling edge of this signal pin over a period of 250ms. Note: The module should be properly switched OFF before all power supplies are removed. This is to avoid any unforeseen corruption of internal data. Pin Description Electrical Characteristics Parameters Min Type Max Unit High level input voltage, VIH Low level input voltage, VIL -0.805 Figure 6: KEY Power ON reference circuit Boot timing diagram is as following: Figure 7: Boot timing diagram 4.7. Subscriber Identity Module (SIM) Interface The SIM card interface is composed of an internally dedicated voltage regulator and I/O level shifters. It is able to support both 1.8V and 3V SIM cards. It is recommended that the routing traces of the SIM interface lines be kept as short as possible. ESD diodes can be added to the signals connected to the SIM socket to prevent any ESD-related issues. The diodes shall be placed as close to the SIM socket as possible. Also, a decoupling capacitor of about 100nF should be added on the VSIM1 line near the SIM socket. At any point of time, only one SIM card is to be connected as the same pins of both (SIM holder placed on top of the module, external SIM holder) are shorted. Pin Description Pin Signal Name Signal I/O Description 27 VSIM1 SIM card supply voltage, the module automatically selects 1.8v or 3.0v 28 SIM1_CLK SIM card clock line 29 SIM1_RST SIM card reset line 30 SIM1_DATA I/O SIM card data cable Electrical Characteristics Parameters VSIM1 Figure 8: Conditions Min Type Max Unit SIM 3V 2.7 2.85 2.95 SIM 1.8V 1.65 1.8 1.95 Example of a SIM socket implementation 4.8. Serial Link (UART) Interfaces The module has two UART. Baud rate from 300 bits/s up to 115200 bits/s feature. Note: Default factory setting baudrate is set at 115200, unless other specified. Pin Signal Name Signal I/O Description 50 UTXD2 DCE Data Transmit 51 URXD2 DCE Data Receive 67 URXD1 DCE Debug serial Data Receive 68 UTXD1 DCE Debug serial Data Transmit Application The block diagram below shows the possible UART connection. Figure 9: Interfacing with UART Figure 10: Interfacing with UART Figure 11: Level-shifter connection to 5V level Figure 12: Level-shifter connection to RS232 4.9. USB Interface The USB interface supports a USB 1.1. It is primarily intended for flashing of firmware and for use as command and data interface. Application Note: Connection of a 4.7F Capacitor externally at VBUS for filtering is required. Figure 13: Example of USB implementation 4.10. Analog Audio Interfaces 4.10.1. Microphone input The handset differential inputs MICIP and MICIN can be amplified by the differential handset microphone amplifier. The microphone reference voltage is at 2V. Pin Description Pin Signal Name 13 MIC- 14 MIC+ Signal I/O Description Microphone amplifier input (-ve) Microphone amplifier input (+ve) Electrical Characteristics Parameters Conditions Min Type Max Unit Maximum differential input range (MIC+ – MIC-) Input 3 dBm0 0.8 Vpp Nominal reference level (MIC+ – MIC-) -10 dBm Differential input resistance (MIC+ – MIC-) 50 KΩ Amplifier gain for (MICIP-MICIN) input Differential MIC 39 dB Recommended MIC Impedance 2k Ohms Recommended MIC Sensitivity 40 50 dB/PA Recommended MIC SNR 50 dB MIC Application This section describes the two common approaches to microphone connection. Since this feature is exposed to the environment, provision for ESD protection is recommended. Typical characteristics of a microphone device which can be used: Impedance: ~2 kohm, sensitivity ~ 40-50 dB/PA and SNR >50 dB. Differential Ended Differential ended connection is the recommended implementation. The following diagram shows a proposed implementation. The capacitance values chosen may need to be optimized based on application, for GSM related EMI, this can be from 10 pF to 47 pF for an 0402 size. If not needed, these components may be unplaced. Figure 14: Example of Microphone implementation 4.10.2. Speaker The class D amplifier is capable of driving 700 mWrms into an 8 ohms load. Default switching frequency is 600 kHz. Pin Description Pin Signal Name 16 SPK+ 17 SPK- Signal I/O Description Speaker signal (+ve) Speaker signal (-ve) Electrical Characteristics Parameters Min Type Max Unit Output Load Resistance Ω Application The connections to the speaker should run in parallel to the transducer and provisions for shunt capacitors are recommended for filtering RF and Digital Noise. Suggested values are 33 pF for EMI. Ensure that the voltage rating of the selected components can withstand operation at the maximum swing voltages in both directions, 16 volt parts should be sufficient. Since this feature is exposed to the environment, provision for ESD protection is recommended. Figure 15: Example of speaker implementation 4.10.3. Earphone The earphone amplifier provides a full differential signal on the MP3_R and MP3_L terminals. The amplifier is capable of driving 100 mWrms into a 16 ohm load. Pin Description Pin Signal Name Signal I/O Description 15 XMIC Earphone input 18 MP3_R 19 MP3_L Earphone amplifier output (+ve) Earphone amplifier output (-ve) Electrical Characteristics Parameters Conditions Min Type Max Unit Power supply rejection Mono Modes(GSM Voice) 90 100 dB Load = OPEN 4.1 Vpp Maximum Output Swing at EARP-EARN Figure 15: Example of earphone implementation 4.11. General Purposes Input / Output ports Pin Description and Electrical Characteristics Pin Signal Name GPIO79 21 48 GPIO81 GPIO18 GPIO45 49 53 GPIO61 GPIO16 Parameters Min High level input voltage, VIH Type Max Unit 2.5 Low level input voltage, VIL 0.3 High level output voltage, VOH 2.6 2.8 2.85 Low level output voltage, VOL 0.45 4.12. Keyboard Interface The 10-pin keyboard interface includes 4 row inputs and 4 column outputs. The 8 lines can be used as general purpose inputs and outputs. Please contact COBAN directly for more information on the extended customization to this interface. Pin Description and Electrical Characteristics Pin Signal Name Parameters Min 54 KCOL3 High level input voltage, VIH 55 56 KCOL0 KCOL2 Low level input voltage, VIL Type Max Unit 2.5 0.3 57 58 KROW4 KROW3 62 KCOL4 63 KROW0 64 KROW2 High level output voltage, VOH 2.6 2.8 2.85 Low level output voltage, VOL 0.45 4.13. 2-Wire Serial Interface This is a half-duplex serial port using 2-line for data transmission consisting of SDA data signal and SDL clock signal. It can transfer at speeds up to 400Kbits/s (fast-mode). Note: Supports 1.8V I2C compliant devices. Pin Description and Electrical Characteristics Pin Signal Name 65 66 SCL28 SDA28 Parameters Min Type Max Unit High level input voltage (SDA and SCL), VIH 2.8 Low level input voltage(SDA and SCL), VIL This feature is not enabled in the standard module firmware as it requires a certain level of firmware customization depending on its intended application. Please contact COBAN for more information. 4.14. RF interface CB900 RF interface has a characteristic impedance of 50. The matching networks for an external antenna connection are not included in the module and should be placed on the application board. 4.14.1. RF Performance Frequency Bands RF Sensitivity (dBm) (Nominal) GSM 850/EGSM 900 -106dBm DCS1800/ PCS1900 -104dBm 4.14.2. Recommendations The antenna must fulfill the following requirements below: Frequency Bands EGSM 900 DCS 1800 GSM 850 PCS 1900 TX Frequency 880 - 915 MHz 1710 - 1785 MHz 824 - 849 MHz 1850 - 1910 MHz RX Frequency 925 - 960 MHz 1805 - 1880 MHz 869 - 894 MHz 1930 - 1990 MHz Impedance 50 ohm VSWR Rx max 1.5 : 1 VSWR Tx max 1.5 : 1 Typical radiated gain 0 dBi in one direction at least The optimum operating frequency depends on the application. A dual-band or a quad band antenna must operate in the above frequency bands. FCC Caution. § 15.19 Labelling requirements. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. § 15.21 Changes or modification warning Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. § 15.105 Information to the user. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between theequipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. * RF warning for Portable device: The device has been evaluated to meet general RF exposure requirement. The device can be used in portable exposure condition without restriction. The GSM module is designed to comply with the FCCstatement. FCC ID is 2AA64CB900. The host system using GSM module, should have label indicated FCC ID :2AA64CB900
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File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.6 Linearized : No Tagged PDF : Yes XMP Toolkit : Adobe XMP Core 4.0-c316 44.253921, Sun Oct 01 2006 17:14:39 Create Date : 2013:09:14 15:18:22Z Creator Tool : Microsoft® Office Word 2007 Modify Date : 2013:11:13 23:30:18+08:00 Metadata Date : 2013:11:13 23:30:18+08:00 Producer : Microsoft® Office Word 2007 Format : application/pdf Title : CB-900 GSM/GPRS Module Document ID : uuid:d126fe99-e7e6-4381-b587-aeca510fc80a Instance ID : uuid:bd65a0c1-de7d-4501-980d-f798e427b9b0 Page Count : 24 Language : zh-CN Creator : Microsoft® Office Word 2007EXIF Metadata provided by EXIF.tools