California Eastern Laboratories B1010SP0 MeshConnect Bluetooth Low Energy Module User Manual Exhibit D Users Manual per 2 1033 b3
California Eastern Laboratories MeshConnect Bluetooth Low Energy Module Exhibit D Users Manual per 2 1033 b3
Exhibit D Users Manual per 2 1033 b3
D
E
C
E
ris
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e
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A
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and signific
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e
rgy wireless
o
tocol.
e
se devices ar
Bee and Thre
a
n
sition betwe
e
o
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e
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r
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Supports UA
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o
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n
Health Sens
o
Mobile Acce
s
General Blu
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I
Part Numbe
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MeshConnec
B1010SP0 Mi
n
Modules
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N
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ect Bluetooth
®
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ntly reduce t
i
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e footprint-co
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y program th
e
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ipts.
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d
er Number
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Me
s
P
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L’s award-wi
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Descriptio
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CSR1010 IC
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ceiver M
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ect
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odules f
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a
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ANT
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Me
CS
R
solu
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appl
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t
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SD
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the
f
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the
r
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T
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ELOPM
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shConne
c
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a
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ion for produ
c
L
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a
prehensive w
a
ications using
h
kit contains:
Evaluatio
n
CSR µEn
o
S
e
o
x
o
P
Mini-USB
Setup &
Q
t
meshconne
c
shWorks
B
Bluetooth® S
m
K
and wireless
f
ollowing:
MeshWo
r
IDE, and
S
Two Blue
t
for rapidl
y
Compani
o
smartpho
t
http://www.c
e
r
espective dev
e
T
ORDERI
N
Kit Family
MeshConnect
µEnergy Starter
Development Kit
MeshWorks
Bluetooth Smart
Development Kit
E
NT KITS
c
t µEnergy
a
tform provide
s
c
ts using the Bl
a
rter Develop
m
a
y for designer
s
CSR's µEnerg
n
board with B
ergy Platform
S
S
oftware Deve
e
xamples and
d
x
IDE for µEne
r
P
roduction tes
t
Cable
Q
uick Start Gui
c
t.cel.com/B1
0
B
luetooth
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m
art module is
networking pl
a
r
ks™ Software
S
criptNinja™
c
t
ooth® Smart
S
y
prototyping
m
o
n app to com
m
ne (used as a
e
l.com/Mesh
W
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lopment kit u
s
N
G INFOR
M
Ord
e
B101
0
B
M
BMW
-
Starter D
e
s
a complete B
uetooth Low E
m
ent Kit is a si
m
s
to develop Bl
y solution.
1010SP0 Mini
S
oftware
lopment Kit (S
D
d
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(includes c
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and configur
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for more in
f
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mart De
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s
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ensor Nodes
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any different
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W
orks
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M
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Description
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it, with license fo
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aluation Kit (Incl
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PCBANTEN
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con
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up t
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i
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microproces
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umption and
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se visit www.c
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TENNA
L
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M
s
a castellation
B
trace antenn
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PCB antenna
p
rovided on th
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rmance (it sh
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ptimum ante
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following are
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ormément à l
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T
ERNAL
E
B1010SP0 M
e
updates. Th
e
R
1010 referen
c
instruction se
t
e
details.
E
R IC
e
ct B1010SP0
i
s part of CSR
s
or. Together
w
h
igh performa
n
s
r.com.
M
ini Modules i
n
pin on the m
o
a
only.
employs a to
p
e
host PCB. C
o
o
uld not be dir
e
d
uct enclosur
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n and/or scatt
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n
na performan
c
s
t board. To fu
(a minimum
o
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a
s
ome design g
u
l
ace the groun
d
l
ace the anten
n
v
erall design,
e
p
lace the ante
n
a
stic enclosur
e
nada regulatio
t
he transmitter
e
so chosen t
h
nication.
a
réglementati
o
(ou inférieur)
a
i
ntention des
a
nte (p.i.r.e.) n
e
E
EPROM
ini Module inc
e
EEPROM is
c
e design.
t
for the EEP
R
Mini Module,
's µEnergy pl
a
w
ith CSR's qu
n
ce solution id
e
n
clude an inte
g
o
dule allows th
e
p
ology that is
c
o
rrectly positio
n
e
ctly under th
e
contribute to
e
ring of the tra
c
e, the MeshC
o
rther improve
p
o
f 1.5" x 1.5"
a
lso allow you
t
u
idelines to he
l
d
plane or rout
n
a close to me
e
nsure that wiri
n
na in a metalli
c
e
s 1cm or mor
e
ns, this radio t
r
by Industry C
a
h
at the equiv
a
o
n d'Industrie
C
a
pprouvé pour
a
utres utilisate
u
e
dépasse pas
orporates an
a
connected to
t
R
OM is simila
r
utilizing the
C
a
tform. This tra
alified Blueto
o
e
ally suited for
g
rated Printed
e
user to conn
e
c
ompact and hi
n
ed, the groun
e
module PCB
antenna perf
o
nsmitted sign
a
o
nnect Mini M
o
p
erformance,
a
is recommen
d
t
o run traces u
n
l
p ensure ante
n
e copper trac
e
tallic objects
ng and other
c
c
or metalized
e
away from th
e
r
ansmitter ma
y
a
nada. To red
u
a
lent isotropic
a
C
anada, le pré
s
l'émetteur pa
r
u
rs, il faut choi
s
l'intensité néc
e
a
dditional 512
k
t
he master I
2
C
r
to the Fudan
C
SR1010 tran
s
nsceiver incor
p
o
th v4.x specif
i
all BLE applic
Circuit Board
(
e
ct an externa
l
ghly efficient.
T
d plane on th
e
antenna). The
o
rmance. Poo
r
a
l.
o
dules should
b
a
ground plan
e
d
ed). The inst
a
n
der this layer
.
n
na performan
e
s directly und
e
c
omponents ar
e
plastic enclos
u
e
antenna in a
n
y
only operate
u
ce potential r
a
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lly radiated
p
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ent émetteur
r
Industrie Can
s
ir le type d'an
e
ssaire à l'étab
k
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E
interface usin
FM24C512D.
s
ceiver IC, is
p
orates a bas
e
i
cation stack,
i
ations. For m
o
(
PCB) trace an
l
antenna. The
T
o maximize r
a
e
host PCB will
position of th
e
r
design affect
s
b
e mounted wi
e
may be place
d
a
llation of an
u
.
CEL can pro
v
ce:
e
rneath the ant
e
e
not placed n
e
u
re
n
y direction
using an ante
n
a
dio interferen
c
p
ower (e.i.r.p.)
radio peut fon
c
ada. Dans le
b
tenne et son g
lissement d'un
E
PROM for st
o
g I2C_SCL, I
2
See the Fud
a
B1010SP0
a single-mod
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e
band modem
,
i
t is an excell
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re information
tenna. An opti
o
B1010SP0 h
a
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nge, an adeq
contribute sig
e
module on th
e
s
radiation pa
t
th the PCB tra
c
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u
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v
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ar the antenn
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u
b
ut de réduire l
ain de sorte q
u
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2
C_SDA, and
P
a
n Microelectr
o
Mini Modul
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Bluetooth Lo
w
,
RF circuitry,
a
e
nt low cost, l
o
about the CS
R
o
nal configura
t
a
s been certifie
uate ground p
nificantly to th
e
e
host board a
t
terns and ca
n
c
e antenna ov
e
b
oard under th
e
g
round plane
o
e
with your PC
B
f the module
a
a
nd maximum
(
r
s, the antenn
a
t
han that nec
e
u
ne antenne d'
u
es risques de
u
e la puissanc
e
i
on satisfaisan
t
code and Ov
e
P
IO[2] as deta
i
o
nics Group
w
es
w
Energy
a
nd 16-bit
o
w power
R
1010 IC,
t
ion which
d with the
lane must
e
antenna
nd overall
n
result in
e
rhanging
e
module,
o
n a layer
B
layout.
(
or lesser)
a
type and
e
ssary for
u
n type et
brouillage
e
isotrope
t
e
.
e
r-The-Air
i
led in the
w
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YSTAL T
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o
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uation board i
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is displayed.
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ar if the appr
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lopment kit in
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e key names
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sing the com
m
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flash the ap
p
was exported
o
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o
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M
ini Modules
r
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IM VALU
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ly save the cr
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he evaluation
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r
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the value is 0
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u
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standard that
o
ugh a mesh,
e
controlled th
r
a
feature-rich
B
solution. This
i
a
r Bluetooth
S
d configuratio
n
E
S
e
ss, all B101
0
s
etting the cry
s
n
ds saving the
e
rent software
f
y
stal trim valu
e
your PC.
h
e Connection
board uses th
e
e
module. Thi
s
w
ere installed
d
e
dure. Once it
a
yed in the left
l
r
ight list. The
c
c
y trim”. In the
x
0015. The ke
s
->Export to fil
u
ring your app
l
n
ded to export
o
n of this tool
w
ithin the deve
l
a
re. Finally, m
e
the module u
s
ergy platform,
010SP0 Mini
M
enables mes
comprehensiv
e
r
ough a smart
p
B
luetooth Sm
a
i
ncludes a full
y
S
mart and CS
n
tools. For mo
0
SP0 Mini Mo
d
s
tal trim token
crystal trim va
f
or optimal per
f
e
s, install CSR
'
Options dialo
g
e
USB SPI
s
option shoul
d
d
uring the
is selected,
l
ist and their
c
rystal trim
example
ys can be
e… and
l
ication
the keys to a
l
opment kit.
e
rge the key fil
e
s
ing the
which is a full
y
M
odules also
s
sages to be
r
e
lighting, ho
m
p
hone, tablet,
o
a
rt developme
n
y
licensed xID
E
Rmesh profile
re information,
d
ules are tes
t
so the freque
n
lue, which is s
t
f
ormance.
'
s µEnergy de
v
g
d
e
y
qualified Blu
e
s
upport CSRm
e
r
elayed over
m
m
e automation,
o
r any other B
L
n
t environmen
t
E
software dev
e
s, example h
o
visit www.csr.
t
ed for full R
F
n
cy error for a
n
t
ored in the e
x
v
elopment kit
a
B1010SP0
e
tooth Low En
e
e
sh, which is
a
m
ultiple Bluet
o
and building
a
L
E 4.x device.
t
and contain
s
e
lopment envi
r
o
st applicatio
n
com.
F
and DC fun
c
n
unmodulate
d
x
ternal EEPR
O
a
nd launch the
Mini Modul
e
rgy solution. I
a
protocol laye
r
o
oth Smart d
e
a
utomation sol
u
s
everything r
e
r
onment (with
c
n
s for iOS an
d
c
tionality. Thi
s
d
RF tone is a
s
O
M, before refl
a
CsConfig
tool
es
n addition
r
that runs
e
vices. By
u
tions can
e
quired to
c
ompiler),
d
Android
s
includes
s
close as
a
shing the
while the
A
B
De
s
Sto
Po
w
I/O
Ot
h
* V
D
RE
De
s
Op
e
Po
w
I/O
D
C
De
s
Tra
Tra
Re
c
Sle
B
SOLUTE
M
s
cription
rage temperatu
r
w
er supply volta
g
supply voltage
h
er terminal volt
a
D
D = Terminal
S
COMMEN
D
s
cription
e
rating temperat
w
er supply volta
g
supply voltage (
V
CHARAC
T
s
cription
nsmitter Curren
t
nsmitter Curren
t
c
eiver Current D
e
p mode curren
t
M
AXIMUM
e range
g
e (VDD_BAT)
a
ge*
S
upply Domain
D
ED OPE
R
ure range
g
e (VDD_BAT)
V
DD_PADS)
T
ERISTIC
S
t
Draw, max out
p
t
Draw @ 0dBm
r
aw
t
(Dormant mod
e
RATINGS
Min
-40
1.8
-0.4
VSS - 0.4
R
ATING C
O
S
(@25⁰C unles
C
p
ut power
e
)
Max
85
4.4
4.4
VDD + 0.4
O
NDITION
S
Min
-30
1.8
1.2
s otherwise spe
c
C
onditions
@ 2.7V
@ 1.8V
@ 3.6V
@ 2.7V
@ 2.7V
@ 1.8V
@ 3.6V
@ 3.3V
Unit
⁰C
V
V
V
S
Typ M
a
- 8
5
- 3.
- 3.
c
ified)
Min T
y
- 3
- 5
- 2
- 2
2
3
1
- 0
.
a
x Unit
5
⁰C
6 V
6 V
y
p Max
5 -
4 -
5 -
3 -
4
9
7
.
9 -
B1010SP0
Unit
mA
mA
mA
mA
mA
mA
mA
µA
Mini Modules
RF
Pa
t
TX
RX
CHARAC
T
t
h Descriptio
n
Operating
F
Maximum
o
2nd Harmo
n
3rd Harmo
n
In-band em
Modulation
Modulation
Modulation
Frequency
a
Frequency
o
Maximum
D
Receiver S
e
Receiver S
e
Maximum r
e
T
ERISTIC
S
n
F
requency
o
utput power
n
ic
n
ic
issions
delta F1 averag
e
delta F1 / F2
delta F2 max
a
ccuracy
o
ffset
D
rift Rate (kHz/5
0
e
nsitivity
e
nsitivity (with di
r
e
ceived signal a
t
S
(@25⁰C unles
s
e
0
µs)
r
ty transmitter)
t
30.8% PER
s
otherwise spe
c
Condition
s
F = Fo ± 2M
F = Fo ± 3M
F = Fo ± > 3
M
c
ified)
s
Min
T
2402
-
-
-
Hz -
Hz -
M
Hz -
225
2
0.8
-
-100
-100
-20
T
yp Max
2480
8 -
- 54
- 54
-38 -
-38 -
-38 -
2
55 275
- -
100 -
25 100
25 100
8 20
-94
-93
-10 ≥ -10
B1010SP0
Unit
MHz
dBm
dBuV
dBuV
dBm
dBm
dBm
kHz
-
%
kHz
kHz
kHz / 50uS
dBm
dBm
dBm
Mini Modules
I/O
Refe
Mo
N
1,
2
4
1
ZI
C
The
mo
d
C
o
C
o
PIN ASSI
G
r to the CSR101
dule Pin
N
umber
C
P
2
, 12, 31,
33
3
4
, 5, 6
7
8,9
10
11
13
14
15
1
6, 17
18
19
20
21
22
23
24
25
26
27
28
29
30
32
C
M35x ZIG
B
geometry of t
h
d
ules. The digi
t
Serial
o
ntroller 1
Serial
o
ntroller 2
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
ADC
G
NMENTS
0 datasheet for
p
SR1010 IC
in Number
33 to 48
26
NC
4
NC
16
29
32
28
17
NC
23
15
14
24
19
20
22
13
NC
18
12
25
11
NC
B
EE/THR
E
h
e land pattern
t
ial and analo
g
ZICM35x
UART/SPI/I2C
SPI/I2C
PA6
PC2
PC3
PC4
PC0
PB6
PB0, PB5, PB7
p
in functionality
d
Pin Nam
VSS
SPI_IO#_
S
NC
WAKE
NC
PIO[3]
I2C_SD
A
VDD_BAT_
S
I2C_SC
L
PIO[4]
NC
PIO[9]
PIO[1] / UAR
T
PIO[0] / UAR
PIO[10
]
PIO[6]
PIO[7]
PIO[8]
AIO[0]
NC
PIO[5]
AIO[1]
PIO[11
]
AIO[2]
RF Out
E
AD MOD
U
and location
o
g
I/O mapping
B1010
S
Two wire U
A
SPI/I
2
PIO
9
PIO
6
PIO
7
PIO
8
PIO
5
PIO1
AIO0, AIO
2
d
etails.
e
S
EL
A
S
MPS
L
T
_RX
T_TX
U
LE COMP
A
o
f the RF caste
is described b
e
S
P0
A
RT/I2C
2
C
9
6
7
8
5
1
2
, AIO1 PB6
Castellation Pi
n
A
TIBILIT
Y
llation is identi
c
e
low:
PB3 and PB
4
is connected to
are n
o
Notes
n
for External An
Y
c
al to the ZIC
M
Notes
4
are not conne
c
PIO11. PC1, P
A
o
t connected
B1010SP0
tenna
M
35x family of
Z
c
ted
A
4 and PA5
Mini Modul
Z
igBee/Threa
d
es
d
M
O
M
O
Dim
e
Note
O
DULE DI
M
O
DULE LA
N
e
nsions are s
h
: Refer to the A
n
M
ENSIONS
N
D FOOR
T
h
own in inches,
n
tenna section in
T
PRINT
with millimete
this document
fo
r conversion i
n
fo
r la
y
out recom
m
n
brackets
m
endations which will
y
ield o
p
ti
m
B1010SP0
m
al antenna
p
erf
o
Mini Modul
o
rmance.
es
PR
Re
c
Pa
r
Ra
m
Min
Ma
x
So
a
T
Li
qu
Ti
m
T
p
e
a
Ti
m
Ti
m
Ra
m
Pb
-
Use
Cl
e
In g
e
any
The
Op
Afte
r
OCESSIN
G
c
ommend
e
r
ameter Values
m
p Up Rate (fro
m
imum Soak Te
m
x
imum Soak Te
m
a
k Time
u
idus
m
e above TL
a
k
m
e within 5º of T
pe
m
e from 25º to T
pe
m
p Down Rate
-
Free Sold
of “No Clean”
Note:
T
appropria
Electroni
c
e
aning
e
neral, cleani
n
cleaning proc
e
• Cleaning
board an
d
between
n
• Cleaning
housings,
• Ultrasoni
c
best approac
h
tical Insp
e
r
soldering the
• Proper ali
g
• Proper sol
• Excessive
G
e
d Reflow
m
T
soakmax
to T
p
ea
k
m
perature
m
perature
e
ak
e
ak
er Paste
soldering past
e
T
he quality of
s
te IPC Speci
f
c
Assemblies
d
n
g the populat
e
e
ss.
with water
c
d
the module.
T
n
eighboring p
a
with alcohol
which is not
a
c
cleaning coul
h
is to consider
e
ction
module to the
g
nment and ce
der joints on a
l
solder or cont
a
Profile
k
) 3º/sec
m
150º
C
200º
C
60-120
s
217º
C
60-150
s
250º
C
20-30
s
8 min
m
6ºC/sec
m
e
is strongly r
e
s
older joints o
n
f
ication. See
t
d
ocument.
e
d module is s
t
c
an lead to
c
T
he combinati
o
a
ds. Water cou
l
or a simil
a
a
ccessible for
p
d damage the
using a “No C
host board, c
o
ntering of the
m
l
l pads
a
cts to neighb
o
m
ax
C
C
s
ec
C
s
ec
C
ec
m
ax
m
ax
e
commended,
a
n
the castellati
o
t
he Castellate
d
t
rongly discou
r
c
apillary effe
c
o
n of solderin
g
l
d also damag
e
a
r organic s
o
p
os
t
-washing i
n
module perm
a
lean” solder p
a
o
nsider optical
m
odule over th
o
ring pads or
v
a
s it does not
r
o
ns ("half vias
"
d
Termination
s
r
aged. Residu
a
c
ts where wa
t
g
flux residual
s
e
any stickers
o
o
lvent will lik
e
n
spection. The
a
nently.
a
ste and elimin
inspection to
c
e pads
v
ias
r
equire cleanin
g
"
) where they
c
s
Section in
t
a
ls under the
m
t
er is absorb
e
s
and encapsu
o
r labels.
e
ly flood sol
d
solvent could
a
ate the post-s
o
c
heck the follo
w
B1010SP0
g
after the sol
d
c
ontact the ho
s
t
he latest IP
C
m
odule cannot
e
d into the
g
lated water co
d
ering flux r
e
a
lso damage a
o
ldering cleani
n
w
ing:
Mini Modul
d
ering process.
s
t board shoul
d
C
-A-610 Acce
p
be easily rem
g
ap between
uld lead to sh
o
e
siduals into
ny stickers or l
n
g step.
es
d
meet the
p
tability of
oved with
the host
o
rt circuits
the two
abels.
Re
p
Onl
y
W
a
If a
sold
Ha
n
Han
Re
w
The
sold
Ca
u
If te
m
Avo
i
W
a
Nev
e
cov
e
Ad
d
Atte
m
don
e
RF i
p
eating R
e
y
a single reflo
w
a
ve Solder
i
wave solderin
ering process
i
n
d Solderi
d soldering is
p
w
ork
MeshConnect
er joint and m
o
u
tion
m
perature ra
m
i
d overheating.
a
rning
e
r attempt a
e
rage.
d
itional G
r
m
pts to impro
v
e
at the custo
m
nterference.
e
flow Sold
e
w
soldering pr
o
i
ng
g process is
r
i
s encouraged
.
ng
p
ossible. Whe
n
Module can b
e
o
dule should n
o
m
ps exceed th
e
rework on th
e
r
ounding
v
e the module
o
m
er's own risk.
e
ring
o
cess is encou
r
r
equired on th
e
.
n
using a sold
e
e
unsoldered f
r
o
t exceed the
m
e
reflow tempe
e
module itsel
o
r the system
g
The ground p
i
r
aged for host
e
host boards
e
ring iron, follo
w
r
om the host b
o
m
aximum pea
k
rature profile,
f (i.e., replaci
n
g
rounding by
s
i
ns at the mod
boards.
due to the p
r
w
IPC recomm
e
o
ard. Use of a
k
reflow tempe
r
module and c
o
n
g individual
c
s
oldering braid
s
ule perimeter
s
r
esence of le
a
e
ndations.(ref
e
hot air rework
r
ature of 250º
C
o
mponent da
m
c
omponents);
s
, wires or cab
s
hould be suffi
c
B1010SP0
a
ded compone
e
rence docum
e
tool should be
C
.
m
age may occ
u
such actions
les onto the m
o
c
ient for optim
Mini Modul
nts, only a si
n
e
nt
IPC-7711
).
programmabl
e
u
r due to ther
m
will terminate
o
dule RF shiel
um immunity t
o
es
n
gle wave
e
and the
m
al shock.
warranty
d cover is
o
external
A
G
The
FC
C
This
subj
Le
p
est
a
W
a
Cha
20
To
c
tran
s
ope
r
O
E
The
Sta
n
the
O
outs
ID a
mo
d
follo
w
The
this
Rad
IC
C
The
met
.
Ce
r
Le t
e
Ind
u
Se
c
The
exc
e
http
:
G
ENCY CE
R
following certi
f
• B1010SP
C
Compli
a
device compli
ect to the follo
w
1. This devi
c
2. This devi
c
p
résent appare
i
a
utorisée aux
d
1. l'appareil
2. l'utilisate
u
suscepti
b
a
rning (Pa
r
nges or modifi
c
cm Separ
a
c
omply with F
C
s
mitter must b
e
r
ating in conju
n
M Respon
MeshConnect
n
dards for inte
g
O
EM of the M
e
ide of the final
nd the IC ID a
r
d
ule is installed
w
ing:
“Contain
s
“Contain
s
OEM of the M
e
module. The
O
iator Limits be
f
C
ertificati
o
term "IC" befo
r
tification
e
rme "IC" dev
a
u
strie Canada
o
c
tion 14 o
f
installer of thi
s
e
ss of Health
C
//www.hc-sc.g
c
R
TIFICATI
O
f
ications are in
0: FCC and I
C
a
nce State
m
es with Part 1
5
w
ing two condi
c
e may not ca
u
c
e must accep
t
i
l est conform
e
d
eux condition
s
ne doit pas pr
o
u
r de l'appareil
b
le d'en compr
o
r
t 15.21)
c
ations not ex
p
a
tion Dist
a
C
C/IC RF expo
s
e
installed to p
r
n
ction with any
sibility to
t
Mini Module
h
g
ration into pro
e
shConnect M
o
product. The
M
r
e not visible
w
must also dis
p
s
Transmitter
M
s
Transmitter
M
e
shConnect M
O
EM of the Me
s
f
ore declaring
F
o
n — Indu
s
re the certifica
t
IC - Décla
r
a
nt le numéro
d
o
nt été respect
é
f
RSS-210
s
radio equipm
e
C
anada limits f
o
c
.ca/ewh-sem
t
O
NS (PCB
effect:
C
m
ent Part
5
of the FCC
R
tions:
u
se harmful int
t
any interfere
n
e
aux CNR d'In
d
s
suivantes:
o
duire de brou
doit accepter
t
o
mettre le fonc
p
ressly approv
e
a
nce
s
ure limits for
g
r
ovide a separ
a
other antenna
t
he FCC a
n
h
as been certifi
ducts without
f
o
dule must en
s
M
eshConnect
M
w
hen the modul
p
lay a label ref
e
M
odule FCC ID
:
M
odule IC: 825
4
ini Module ma
y
s
hConnect Mi
n
F
CC Complian
s
try Cana
d
t
ion/registratio
n
r
ation d'In
d
d
e certification
/
é
es.
e
nt must ensu
r
o
r the general
p
t
/pubs/radiatio
n
ANTENN
A
15.19, Sec
R
ules and with I
erference.
n
ce received, i
n
d
ustrie Canad
a
illage, et
t
out brouillage
tionnement.
e
d by CEL co
u
g
eneral popula
t
a
tion distance
o
or transmitter
.
n
d IC Rul
e
ed per FCC P
a
f
urther testing
o
s
ure that the in
f
M
ini Module is
e is installed i
n
e
rring to the e
n
:
W7Z-B1010
S
4
A-B1010SP0
"
y
only use the
n
i Module mus
t
ce per Part 15
d
a Statem
e
n
number only
d
ustrie Ca
n
/
d'enregistrem
e
r
e that the ant
e
p
opulation. Co
n
n
/99ehd-dhm2
3
A
ONLY)
tion 7.15
o
ndustry Cana
d
n
cluding interf
e
a
applicables
a
radioélectriqu
e
u
ld void the us
e
t
ion/uncontroll
e
of at least 20
c
.
e
s and Re
g
a
rt 15 Rules a
n
o
r certification.
f
ormation prov
labeled with it
s
n
side another
d
n
closed modul
e
S
P0” or “Contai
"
or "Contains I
approved ant
e
t
test their final
of the FCC R
u
e
nt
signifies that t
h
n
ada
e
nt signifie seu
e
nna is located
n
sult Safety C
o
3
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