California Eastern Laboratories B1010SP0 MeshConnect Bluetooth Low Energy Module User Manual Exhibit D Users Manual per 2 1033 b3
California Eastern Laboratories MeshConnect Bluetooth Low Energy Module Exhibit D Users Manual per 2 1033 b3
Exhibit D Users Manual per 2 1033 b3
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| Mirror Download [FCC.gov] | |
| Document ID | 2618912 |
| Application ID | D8PJwvRrrmMusVMPVpX6gQ== |
| Document Description | Exhibit D Users Manual per 2 1033 b3 |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 165.77kB (2072091 bits) |
| Date Submitted | 2015-05-19 00:00:00 |
| Date Available | 2015-05-19 00:00:00 |
| Creation Date | 2015-05-15 10:24:11 |
| Producing Software | Acrobat Distiller 15.0 (Windows) |
| Document Lastmod | 2015-05-15 10:24:11 |
| Document Title | Microsoft Word - 15. BLE1010SP0 Mini Module Datasheet _Draft - May 14 2015_.docx |
| Document Creator | PScript5.dll Version 5.2.2 |
| Document Author: | lhan |
PR
RELIMINAR
RY DATAS
SHEET
Mes
shConn
nect™ B1010SP0 Mini
M Mod
dules
B1010SP0-1x
BL
LE Transceiiver Based Modules
Integratted Trans
sceiver Modules fo
or Blueto
ooth® Sma
art Applic
cations
DE
ESCRIPTIO
ON
®
CE
EL’s MeshConn
nect Bluetooth Smart Module
es eliminate de
esign
risk
k and significa
antly reduce tiime-to-market for Bluetooth Low
Ene
ergy wireless solutions, inclu
uding the innovative CSRme
esh™
pro
otocol.
ese devices are footprint-com
mpatible with CEL’s existing line of
The
ZigBee and Threa
ad-based Mod
dules, allowing designers to easily
tran
nsition betwee
en multiple wireless networking standardss via
dro
op-in compatible module hardware.
e B1010SP0-1x is also compatible with CE
EL’s award-win
nning
The
Me
eshWorksTM pla
atform. By em
mploying Mesh
hWorks, userss can
quickly and easily program the
e B1010SP0-1x for standard
d (i.e.
n-CSRmesh) Bluetooth Sm
mart applicatio
ons using siimple
non
Pytthon-based scrripts.
BLO
OCK DIAGR
RAM
Best-in-Classs RF Range of 50m to 100m
+8dBm Transsmit Power
TM
Supports CSRMesh
h Avi-onTM Softtware
Available with
TM
Interoperable
e with CEL's Me
eshWorks Platform
15 Analog/Digital I/O Pins
Supports UART, I2C & SPI
AP
PPLICATIO
ONS
Connected Home
Building Auto
omation
Sports & Fitn
ness Sensors
Health Senso
ors
Mobile Accesssories
General Blue
etooth Wirelesss Sensor Netwo
orking
External
EEPROM
Castellation Edge
Connector
KE
EY FEATUR
RES
32 kHz
XTAL
16 MHz
XTAL
ANT
CSR1010
Micro
processor
Radio
RDERING INFORMAT
TION
OR
Part Numberr
Ord
der Number
Description
MeshConnect
B1010SP0 Min
ni
Modules
B1010SP0-1-R
CSR1010 IC, +8dBm Output Power,
PCB Trace
e Antenna
600/600
CSR1010 IC, +8dBm Output Power,
Castellatio
on Pin for Externall Antenna
600/600
B10
010SP0-1C-R
Min/Multiple
B1010SP0 Mini Modules
DEV
VELOPME
ENT KITS
MeshConnec
ct µEnergy Starter De
evelopmen
nt Kit
CSR
R's µEnergy pla
atform provides
s a complete Bluetooth qualified
solution for produccts using the Bluetooth Low Energy standard
d.
L's µEnergy Sta
arter Developm
ment Kit is a sim
mple yet
CEL
comprehensive wa
ay for designers
s to develop Bluetooth Smart
applications using CSR's µEnergy solution.
h kit contains:
Each
Evaluation
n board with B1010SP0 Mini Module
CSR µEnergy Platform Software
o Software
Development Kit (SD
DK) application
examples
and development
to
ools
o xIDE
for µEnerrgy (includes co
ompiler)
o Production
testt and configura
ation tools
Mini-USB Cable
Setup & Quick
Start Guides
Visitt meshconnec
ct.cel.com/B10
010 for more infformation.
MeshWorks Bluetooth
Smart
Dev
velopment Kit
The Bluetooth® Sm
mart module is an integral parrt of the MeshW
Works™
K and wireless networking pla
atform. The MesshWorks™ kit contains
SDK
the following:
MeshWorrks™ Software, including Pyth
hon scripting la
anguage,
IDE, and ScriptNinja™
configuration
to
ool
Two Bluettooth® Smart Sensor
Nodes with integrated
d sensors
for rapidly
y prototyping many
different applications
Companio
on app to comm
municate with Bluetooth®
4.xx-equipped
smartphone (used as a bridge)
Visitt http://www.ce
e information. R
Refer to
el.com/MeshW
Works for more
the respective
deve
elopment kit usser guides.
KIT
T ORDERIN
NG INFORM
MATION
Kit Family
Orde
er Number
MeshConnect
µEnergy Starter
Development Kit
B1010
0SP0-EVB-1
MeshWorks
Bluetooth Smart
Development Kit
BM
MW-KIT-1
BMW--SENSOR-1
Description
Min/Multiple
µEnergy Starte
er Development Kit,
K with license forr CSR µEnergy SD
DK
1/1
Bluetooth Sma
art MeshWorks Evvaluation Kit (Inclu
udes Two Sensor Nodes)
1/1
Bluetooth Sma
art MeshWorks Se
ensor Node
1/1
B1010SP0 Mini Modules
TABLE OF CO
ONTENTS
DESSCRIPTION ..........................................................................................................................................1
KEY
Y FEATURES ........................................................................................................................................1
APP
PLICATIONS ........................................................................................................................................1
BLO
OCK DIAGRA
AM ....................................................................................................................................1
ORD
DERING INFO
ORMATION......................................................................................................................1
DEV
VELOPMENTT KITS ...............................................................................................................................3
KIT ORDERING INFORMATIION ................................................................................................................3
BLE OF CONTTENTS ..............................................................................................................................4
TAB
TRA
ANSCEIVER IC .....................................................................................................................................5
ANTTENNA ...............................................................................................................................................5
EXTTERNAL EEPR
ROM ................................................................................................................................5
SOFFTWARE / FIIRMWARE ........................................................................................................................6
CRY
YSTAL TRIM VALUES ...........................................................................................................................6
ABSSOLUTE MAX
XIMUM RATTINGS .............................................................................................................7
REC
COMMENDEED OPERATIN
NG CONDITIIONS ............................................................................................7
DC CHARACTER
RISTICS .............................................................................................................................7
RF CHARACTER
RISTICS ..............................................................................................................................8
I/O PIN ASSIGN
NMENTS ...........................................................................................................................9
ZICM
M35x ZIGBEEE/THREAD MODULE
CO
OMPATIBILITTY ..............................................................................9
MO
ODULE DIMEENSIONS .........................................................................................................................10
MO
ODULE LAND
D FOORTPRIN
NT ................................................................................................................10
PRO
OCESSING .........................................................................................................................................11
AGEENCY CERTIFFICATIONS (PCB
ANTENNA ONLY) ..................................................................................13
SHIPMENT, HANDLING AND STORAGE..................................................................................................14
QUA
ALITY ...............................................................................................................................................14
REFFERENCES .........................................................................................................................................15
REV
VISION HISTO
ORY ...............................................................................................................................15
DISCLAIMER .........................................................................................................................................15
B1010SP0 Mini Modules
TRA
ANSCEIVE
ER IC
CEL
L’s MeshConne
ect B1010SP0 Mini Module, utilizing the C
CSR1010 transsceiver IC, is a single-mode
e Bluetooth Low
w Energy
(BLE
E) device that is
i part of CSR's µEnergy pla
atform. This transceiver incorp
porates a base
eband modem,, RF circuitry, and
a 16-bit
XAP
P microprocesssor. Together with
w CSR's qualified Bluetoo
oth v4.x specifiication stack, iit is an excelle
ent low cost, lo
ow power
cons
sumption and high
performan
nce solution ide
eally suited for all BLE applications. For mo
ore information about the CSR
R1010 IC,
please visit www.cssr.com.
ANTENNA
CEL
L’s B1010SP0 Mini
M Modules in
nclude an integ
grated Printed Circuit Board (PCB)
trace antenna. An optio
onal configurattion which
uses
s a castellation pin on the mo
odule allows the
e user to conne
ect an externall antenna. The B1010SP0 ha
as been certified with the
PCB
B trace antenna
a only.
The PCB antenna employs a top
pology that is compact
and highly efficient. To
T maximize ra
ange, an adequate ground plane must
be provided
on the
e host PCB. Co
orrectly position
ned, the ground plane on the
e host PCB will contribute significantly to the
e antenna
perfo
ormance (it sho
ould not be dire
ectly under the
e module PCB antenna). The position of the
e module on the
e host board and overall
design of the prod
duct enclosure contribute to antenna perfo
ormance. Poorr design affectss radiation pattterns and can
n result in
refle
ection, diffractio
on and/or scatte
ering of the transmitted signa
al.
For optimum
anten
nna performancce, the MeshCo
onnect Mini Mo
odules should be
b mounted with the PCB trac
ce antenna ove
erhanging
the edge
of the hos
st board. To further improve performance,
a ground plane
e may be placed
d on the host board
under the
e module,
up to
o the antenna (a minimum of
o 1.5" x 1.5" is recommend
ded). The insta
allation of an u
uninterrupted ground
plane on
o a layer
direc
ctly beneath the module will also
allow you to
t run traces un
nder this layer.. CEL can provvide assistance
e with your PCB
B layout.
design gu
uidelines to hellp ensure anten
nna performance:
The following are some
• Never pllace the ground
d plane or route copper trace
es directly unde
erneath the ante
enna portion of the module
• Never pllace the antenn
na close to metallic objects
• In the ovverall design, ensure
that wiring and other ccomponents are
e not placed ne
ear the antenna
• Do not place
the anten
nna in a metallic
c or metalized plastic enclosu
ure
• Keep pla
astic enclosure
es 1cm or more
e away from the
e antenna in an
ny direction
nna of a type and
a maximum (or
( lesser)
Under Industry Canada regulations, this radio trransmitter mayy only operate using an anten
t transmitter by Industry Ca
anada. To redu
uce potential ra
adio interferencce to other userrs, the antenna
a type and
gain approved for the
should be
e so chosen th
hat the equiva
alent isotropica
ally radiated power
(e.i.r.p.) is not more than
that nece
essary for
its gain
succ
cessful communication.
Confformément à la
a réglementatio
on d'Industrie Canada,
le préssent émetteur radio peut foncctionner avec une
u antenne d'u
un type et
d'un gain maximal (ou inférieur) approuvé
pour l'émetteur parr Industrie Canada. Dans le but
b de réduire les risques de brouillage
radio
oélectrique à l'iintention des autres
utilisateu
urs, il faut choissir le type d'antenne et son gain de sorte qu
ue la puissance
e isotrope
rayo
onnée équivalente (p.i.r.e.) ne
e dépasse pas l'intensité néce
essaire à l'établissement d'une communicatiion satisfaisantte.
EXT
TERNAL EEPROM
The B1010SP0 Mini Module incorporates an additional
512kkB external EE
EPROM for sto
oring program code and Ove
er-The-Air
code
e updates. The
e EEPROM is connected to the
t master I2C interface using I2C_SCL, I2
2C_SDA, and PIO[2]
as detaiiled in the
CSR
R1010 referencce design.
The instruction sett for the EEPR
ROM is similarr to the Fudan FM24C512D. See the Fuda
an Microelectro
onics Group website
for
more
e details.
B1010SP0 Mini Modules
OFTWARE / FIRMWAR
RE
SO
CEL
L’s B1010SP0 Mini
M Modules run
r CSR's µEnergy platform, which is a fullyy qualified Blue
etooth Low Ene
ergy solution. In addition
to su
upporting stand
dard BLE 4.x devices,
the B1010SP0 Mini M
Modules also support
CSRme
esh, which is a protocol layerr that runs
on top
of the Bluetooth Smart standard that enables messages to be relayed
over m
multiple Blueto
ooth Smart de
evices. By
expa
anding the netw
work range thro
ough a mesh, comprehensive
e lighting, hom
me automation, and building automation
solu
utions can
easily be develope
ed which can be
e controlled thrrough a smartp
phone, tablet, or
o any other BL
LE 4.x device.
y platform is a feature-rich Bluetooth
Sma
art developmen
nt environmentt and containss everything re
equired to
The CSR µEnergy
ate an interoperrable BLE 4.x solution. This includes
a fullyy licensed xIDE
E software deve
elopment envirronment (with compiler),
crea
exam
mple applicatio
ons for popula
ar Bluetooth Smart
and CSRmesh profiles, example ho
ost application
ns for iOS and
d Android
platfforms, and prod
duction test and configuration
n tools. For more information, visit www.csr.com.
CR
RYSTAL TR
RIM VALUE
ES
During the manufa
acturing proce
ess, all B1010
0SP0 Mini Mod
dules are testted for full RF
F and DC funcctionality. Thiss includes
asuring frequen
ncy error and setting
the crysstal trim token so the frequen
ncy error for an
n unmodulated
d RF tone is ass close as
mea
poss
sible to zero. CEL
recommen
nds saving the crystal trim value, which is sttored in the exxternal EEPRO
OM, before refla
ashing the
B1010SP0 Mini Mo
odule with diffe
erent software for
f optimal perfformance.
es, install CSR''s µEnergy devvelopment kit a
and launch the CsConfig tool while the
In orrder to manually save the cryystal trim value
evaluation board iss connected to your PC.
en the tool is firrst launched, th
he Connection Options dialog
Whe
box is displayed. The
T evaluation board uses the
e USB SPI
sport to commu
unicate with the
e module. Thiss option should
trans
appe
ear if the appro
opriate drivers were
installed during
the
deve
elopment kit insstallation proce
edure. Once it is selected,
click
k OK.
All th
he key names are
a now displa
ayed in the left list
l and their
corre
esponding valu
ues are in the right
list. The crystal
trim
value is named “Crrystal frequenccy trim”. In the example
wn to the right, the value is 0xx0015. The keys can be
show
expo
orted to a .keyrr file using Keys
s->Export to file… and
inclu
uded into your xIDE
project du
uring your appllication
deve
elopment.
nded to export the keys to a
During production, it is recommen
the comm
mand line versio
on of this tool
file using
(csconfigcmd.exe) also present within
the devellopment kit.
Then
n flash the app
plication firmwa
are. Finally, me
erge the key file
that was exported previously into the module us
sing the
csco
onfigcmd.exe to
ool again.
B1010SP0 Mini Modules
BSOLUTE MAXIMUM
RATINGS
AB
Des
scription
Min
Max
Unit
Storage temperature range
-40
85
⁰C
Pow
wer supply voltag
ge (VDD_BAT)
1.8
4.4
I/O supply voltage
-0.4
4.4
VSS - 0.4
VDD + 0.4
Oth
her terminal volta
age*
* VD
DD = Terminal Supply
Domain
RECOMMEND
DED OPER
RATING CO
ONDITIONS
Des
scription
Min
Typ
Ma
ax
Unit
Ope
erating temperature range
-30
85
⁰C
Pow
wer supply voltag
ge (VDD_BAT)
1.8
3.6
I/O supply voltage (V
VDD_PADS)
1.2
3.6
DC CHARACT
TERISTICS
S (@25⁰C unless otherwise speccified)
Des
scription
Transmitter Currentt Draw, max outp
put power
Transmitter Currentt Draw @ 0dBm
Rec
ceiver Current Draw
Sleep mode currentt (Dormant mode
e)
Conditions
Min
Ty
yp
Max
Unit
@ 2.7V
35
mA
@ 1.8V
54
mA
@ 3.6V
25
mA
@ 2.7V
23
mA
@ 2.7V
24
mA
@ 1.8V
39
mA
@ 3.6V
17
mA
@ 3.3V
0..9
µA
B1010SP0 Mini Modules
RF CHARACT
TERISTICS
S (@25⁰C unlesss otherwise speccified)
Patth
Description
Conditions
Operating Frequency
RX
Typ
2402
Max
Unit
2480
MHz
Maximum output
power
dBm
2nd Harmon
nic
54
dBuV
3rd Harmon
nic
54
dBuV
F = Fo ± 2MHz
-38
dBm
F = Fo ± 3MHz
-38
dBm
F = Fo ± > 3M
MHz
-38
dBm
Modulation delta F1 average
225
255
275
kHz
Modulation delta F1 / F2
0.8
Modulation delta F2 max
100
Frequency accuracy
-100
25
100
kHz
Frequency offset
-100
25
100
kHz
Maximum Drift
D Rate (kHz/50
0µs)
-20
20
kHz / 50uS
In-band emissions
TX
Min
Receiver Se
ensitivity
-94
Receiver Se
ensitivity (with dirrty transmitter)
-93
Maximum re
eceived signal att 30.8% PER
-10
dBm
dBm
≥ -10
dBm
B1010SP0 Mini Modules
I/O PIN ASSIG
GNMENTS
Refer to the CSR1010 datasheet for pin
p functionality details.
Module Pin
Number
CSR1010 IC
Pin Number
Pin Name
1, 2,
2 12, 31,
33
33 to 48
VSS
26
SPI_IO#_S
SEL
4 5, 6
4,
NC
NC
WAKE
8,9
NC
NC
10
16
PIO[3]
11
29
I2C_SDA
13
32
VDD_BAT_S
SMPS
14
28
I2C_SCL
15
17
PIO[4]
1 17
16,
NC
NC
18
23
PIO[9]
19
15
PIO[1] / UART
T_RX
20
14
PIO[0] / UART_TX
21
24
PIO[10]
22
19
PIO[6]
23
20
PIO[7]
24
22
PIO[8]
25
13
AIO[0]
26
NC
NC
27
18
PIO[5]
28
12
AIO[1]
29
25
PIO[11]
30
11
AIO[2]
32
NC
RF Out
Notes
Castellation Pin
n for External Antenna
ZIC
CM35x ZIGB
BEE/THRE
EAD MODU
ULE COMPA
ATIBILITY
he land pattern and location of
o the RF castellation is identiccal to the ZICM
M35x family of ZigBee/Thread
The geometry of th
dules. The digittial and analog
g I/O mapping is described be
elow:
mod
ZICM35x
B1010S
SP0
Notes
Serial
Co
ontroller 1
UART/SPI/I2C
Two wire UA
ART/I2C
PB3 and PB4
4 are not conneccted
Serial
Co
ontroller 2
SPI/I2C
SPI/I2
2C
GPIO
PA6
PIO9
GPIO
PC2
PIO6
GPIO
PC3
PIO7
GPIO
PC4
PIO8
GPIO
PC0
PIO5
GPIO
PB6
PIO11
ADC
PB0, PB5, PB7
AIO0, AIO2
2, AIO1
PB6 is connected to PIO11. PC1, PA
A4 and PA5
are no
ot connected
B1010SP0 Mini Modules
MO
ODULE DIM
MENSIONS
MO
ODULE LAN
ND FOORT
TPRINT
Dime
ensions are sh
hown in inches, with millimeter conversion in
n brackets
Note: Refer to the An
ntenna section in this document for
fo layout recomm
mendations which will yield optim
mal antenna perfo
ormance.
B1010SP0 Mini Modules
PROCESSING
commende
ed Reflow Profile
Rec
Parrameter Values
Ram
mp Up Rate (from
m Tsoakmax to Tpeakk)
3º/sec max
Minimum Soak Tem
mperature
150ºC
Max
ximum Soak Tem
mperature
200ºC
Soa
ak Time
TLiquuidus
60-120 sec
217ºC
Tim
me above TL
Tpeaak
60-150 sec
250ºC
Tim
me within 5º of Tpeeak
20-30 sec
Tim
me from 25º to Tpeeak
8 min max
Ram
mp Down Rate
6ºC/sec max
Pb--Free Solder Paste
Use of “No Clean” soldering paste
e is strongly re
ecommended, a
as it does not require
cleaning
g after the sold
dering process.
T quality of solder
joints on
n the castellatio
ons ("half vias"") where they ccontact the hosst board should
d meet the
Note: The
appropriate IPC Speciffication. See the
Castellated
d Terminationss Section in tthe latest IPC
C-A-610 Accep
ptability of
Electronicc Assemblies document.
Cle
eaning
In ge
eneral, cleanin
ng the populate
ed module is sttrongly discourraged. Residua
als under the m
module cannot be easily removed with
any cleaning proce
ess.
• Cleaning with water can
lead to capillary
effeccts where watter is absorbe
ed into the gap
between the host
d the module. The
T combinatio
on of soldering
g flux residualss and encapsulated water could lead to sho
ort circuits
board and
between neighboring
pa
ads. Water coulld also damage
e any stickers or
o labels.
• Cleaning with alcohol or a simila
ar organic so
olvent will like
ely flood sold
dering flux re
esiduals into the two
for post-washing
in
nspection. The solvent could a
also damage any stickers or labels.
housings, which is not accessible
anently.
• Ultrasonicc cleaning could damage the module perma
h is to consider using a “No Clean” solder pa
aste and eliminate the post-so
oldering cleanin
ng step.
The best approach
Optical Inspe
ection
Afterr soldering the module to the host board, co
onsider optical inspection to check
the follow
wing:
• Proper alig
gnment and centering of the module
over the pads
• Proper solder joints on alll pads
acts to neighbo
oring pads or vvias
• Excessive solder or conta
B1010SP0 Mini Modules
Rep
peating Re
eflow Solde
ering
Only
y a single reflow
w soldering pro
ocess is encourraged for host boards.
Wa
ave Solderiing
If a wave soldering process is required
on the
e host boards due to the prresence of lea
aded components, only a sin
ngle wave
i encouraged..
soldering process is
Han
nd Soldering
Hand soldering is possible.
When
n using a solde
ering iron, follow
w IPC recomme
endations.(refe
erence docume
ent IPC-7711).
Rew
work
The MeshConnect Module can be
e unsoldered frrom the host bo
oard. Use of a hot air rework tool should be programmable
e and the
odule should no
ot exceed the maximum
peakk reflow temperrature of 250ºC
C.
solder joint and mo
Cau
ution
If tem
mperature ram
mps exceed the
e reflow temperature profile, module and co
omponent dam
mage may occu
ur due to therm
mal shock.
Avoiid overheating.
Wa
arning
Neve
er attempt a rework on the
e module itself (i.e., replacin
ng individual components);
such actions will terminate warranty
cove
erage.
Add
ditional Grrounding
Attem
mpts to improvve the module or
o the system grounding
by soldering
braids
s, wires or cables onto the mo
odule RF shield cover is
done
e at the custom
mer's own risk. The ground piins at the module perimeter should
be sufficcient for optimum immunity to
o external
RF interference.
B1010SP0 Mini Modules
AG
GENCY CER
RTIFICATIO
ONS (PCB ANTENNA
A ONLY)
The following certiffications are in effect:
• B1010SP0: FCC and IC
FCC
C Complia
ance Statem
ment Part 15.19, Section 7.15 of
o RSS-GEN
This device complies with Part 15
5 of the FCC Rules
and with Industry Canad
da license-exem
mpt RSS Stand
dards. Operatio
on is
wing two conditions:
subject to the follow
1. This devicce may not cau
use harmful interference.
2. This devicce must acceptt any interferen
nce received, in
ncluding interfe
erence that mayy cause undesired operation.
appareiil est conforme
e aux CNR d'Ind
dustrie Canada
a applicables aux
a appareils ra
adio exempts de
d licence. L'exxploitation
Le présent
est autorisée
aux deux
conditionss suivantes:
1. l'appareil ne doit pas pro
oduire de brouillage, et
ur de l'appareil doit accepter tout
brouillage radioélectrique
e subi, même ssi le brouillage est
2. l'utilisateu
susceptib
ble d'en compro
omettre le fonctionnement.
Wa
arning (Parrt 15.21)
Changes or modificcations not exp
pressly approve
ed by CEL cou
uld void the use
er's authority to
o operate the eq
quipment.
20 cm Separa
ation Dista
ance
To comply
with FC
CC/IC RF expossure limits for general
populattion/uncontrolle
ed exposure, th
he antenna(s) used
for this
trans
smitter must be
e installed to prrovide a separa
ation distance o
of at least 20 cm
c from all perssons and mustt not be co-loca
ated or
operrating in conjun
nction with any other antenna or transmitter..
OEM Responsibility to the
t FCC an
nd IC Rule
es and Regulations
The MeshConnect Mini Module has
h been certified per FCC Pa
art 15 Rules an
nd to Industry C
Canada license
e-exempt RSS
ndards for integ
gration into products without further
testing o
or certification. To fulfill the FC
CC and IC Cerrtification requirrements,
Stan
the OEM
of the Me
eshConnect Mo
odule must enssure that the infformation provided on the Me
eshConnect lab
bel is placed on
n the
outside of the final product. The MeshConnect
Mini
M Module is labeled with its
s own FCC ID Number and IC
C ID Number. If the FCC
the module is installed in
nside another device,
then the
e outside of the
e device into which the
ID and the IC ID arre not visible when
dule is installed must also disp
play a label refe
erring to the en
nclosed module
e. The exterior label can use wording such as
a the
mod
follow
wing:
“Containss Transmitter Module
FCC ID:: W7Z-B1010S
SP0” or “Contains FCC ID: W7
7Z-B1010SP0”
“Containss Transmitter Module
IC: 8254
4A-B1010SP0"" or "Contains IC: 8254A-B1010SP0”
eshConnect Mini Module may
y only use the approved ante
enna (PCB trace antenna) tha
at has been cerrtified with
The OEM of the Me
of the Mes
shConnect Min
ni Module mustt test their final product config
guration to com
mply with Uninte
entional
this module. The OEM
Compliance per Part 15 of the FCC Ru
ules.
Radiator Limits beffore declaring FCC
IC Certificatio
on — Indus
stry Canad
da Stateme
ent
The term "IC" before the certificattion/registration
n number only signifies that th
he Industry Canada technicall specifications were
met.
Cerrtification IC - Déclarration d'Ind
dustrie Can
nada
Le te
erme "IC" deva
ant le numéro de
d certification//d'enregistreme
ent signifie seulement que less spécificationss techniques
Indu
ustrie Canada ont
o été respecté
ées.
Sec
ction 14 off RSS-210
The installer of thiss radio equipme
ent must ensurre that the ante
enna is located or pointed succh that it does not
n emit RF field in
ess of Health Canada
limits fo
or the general population.
Con
nsult Safety Co
ode 6, obtainab
ble from Health
h Canada's web
bsite:
exce
http://www.hc-sc.gcc.ca/ewh-semtt/pubs/radiation
n/99ehd-dhm23
37/index-eng.p
php
B1010SP0 Mini Modules
L'article 14 du
u CNR-210
Le programme
d'in
nstallation de ce
et équipement radio doit s'asssurer que l'ante
enne est située
e ou orientée de telle sorte qu
u'il ne pas
éme
ettre de champ RF au-delà de
es limites de Sa
anté Canada po
our la populatio
on générale. C
Consulter le Cod
de de sécurité 6,
disponible sur le site Web de San
nté Canada: htttp://www.hc-scc.gc.ca/ewh-sem
mt/pubs/radiatiion/99ehd-dhm
m237/index-eng
g.php
G AND STO
ORAGE
SHIPMENT, HANDLING
Shiipment
The MeshConnect Modules are delivered
in tap
pe and reel. The
e reel diameterr is 12.992" (33
30mm) and con
ntains 600 mod
dules.
Han
ndling
The MeshConnect Modules are designed
and packaged
to be
e processed in an
a automated assembly line.
Wa
arning
The MeshConnectt Modules conttain highly senssitive electronicc circuitry. Han
ndling without p
proper ESD prrotection may destroy
or
mage the modulle permanentlyy.
dam
Wa
arning
The MeshConnect Modules are moisture-sensit
tive devices. Appropriate handling instructio
ons and precautions are summ
marized in
TD-033. Read carefully
to pre
event permanen
nt damage due
e to moisture intake.
J-ST
Mo
oisture Sen
nsitivity Lev
vel (MSL)
MSL
L 3, per J-STD--033
Sto
orage
Storage/shelf life in
n sealed bags is
i 12 months at <40°C and <9
90% relative hu
umidity.
UALITY
QU
CEL
L Modules offerr the highest quality
at comp
petitive prices. Our modules are
a manufactu
ured in complia
ance with the IPC-A-610
spec
cification, Class
s II. Our modu
ules go through
h JESD22 qua
alification proce
esses which inccludes high temperature ope
erating life
tests
s, mechanical shock, temperrature cycling, humidity and re
eflow testing. CEL
conducts RF and DC fac
ctory testing on
n 100% of
all production partss.
L builds the qua
ality into our pro
oducts, giving our
o customers confidence wh
hen integrating our products in
nto their system
ms.
CEL
B1010SP0 Mini Modules
REFERENCES
Refere
ence Documents
CS--231985-DS - CS
SR1010 Data Sheet
Download
Link
REV
VISION HIS
STORY
Previous Vers
sions
0019-00-07-00-000
May
y 15, 2015
Changes to Current Version
Initial Preliminary Da
ata Sheet
Page(s)
N/A
DIS
SCLAIMER
The information in this document iss current as of the
e published date
e. The information
n is subject to ch
hange without no
otice. For actual
design-in, refer to the latest publiications of CEL Data Sheets or Data Books, etc.,
for the mosst up-to-date sp
pecifications of CEL
oducts. Not all products
and/or types
are availab
ble in every country. Please che
eck with an CEL
L sales representative for availab
bility
pro
and additional inforrmation.
o part of this docu
ument may be co
opied or reproduced in any form o
or by any means
s without the prio
or written consent of CEL.
No
CE
EL assumes no re
esponsibility for any errors that may
m appear in thiis document.
CE
EL does not assu
ume any liability for
f infringement of patents, copyyrights or other in
ntellectual properrty rights of third parties by or arissing
fro
om the use of CE
EL products liste
ed in this docume
ent or any otherr liability arising from
the use of such
products. No
N license, expre
ess,
implied or otherwisse, is granted und
der any patents, copyrights or oth
her intellectual property rights of CEL or others.
escriptions of circ
cuits, software and other related information in th
his document are
e provided for illu
ustrative purpose
es in semicondu
uctor
De
pro
oduct operation and
a application examples.
The in
ncorporation of th
hese circuits, software and inform
mation in the dessign of a custom
mer’s
equipment shall be done under th
he full responsib
bility of the customer. CEL asssumes no respo
onsibility for any losses incurred
d by
stomers or third parties arising from the use of these circuits, softtware and information.
cus
FOR MORE IN
NFORMAT
TION
For more
informatio
on about CEL MeshConnect products and ssolutions, visit our
o website at www.cel.com/M
MeshConnect.
TEC
CHNICAL ASSISTAN
NCE
For Technical
Assistance, visit http://www.cel.co
om/MeshConne
ectHelp
Source Exif Data:
File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.5 Linearized : Yes Author : lhan Create Date : 2015:05:15 10:24:11-05:00 Modify Date : 2015:05:15 10:24:11-05:00 XMP Toolkit : Adobe XMP Core 5.6-c015 81.157285, 2014/12/12-00:43:15 Creator Tool : PScript5.dll Version 5.2.2 Producer : Acrobat Distiller 15.0 (Windows) Format : application/pdf Title : Microsoft Word - 15. BLE1010SP0 Mini Module Datasheet _Draft - May 14 2015_.docx Creator : lhan Document ID : uuid:f66af2d9-79c6-4b71-90bf-1572e51a4d35 Instance ID : uuid:1569a544-2697-4d6a-8647-082e254e883b Page Count : 14EXIF Metadata provided by EXIF.tools