California Eastern Laboratories FSTARPRO FreeStar Pro Zigbee Module User Manual Manual

California Eastern Laboratories FreeStar Pro Zigbee Module Manual

Contents

Manual

Page 1ZFSM-201-1FREESTAR PRO SERIES TRANSCEIVER MODULESDESCRIPTION CEL’s FreeStar Pro module provides a high performance and cost effective RF transceiver solution for 2.4 GHz IEEE 802.15.4, ZigBee, and Zigbee PRO wireless networks. The FreeStar Pro module is based on the Freescale™ MC13224V transceiver platform. It combines Freescale’s transceiver IC with an onboard 100mW Power Amplier. Ideal for remote sensing, AMR/AMI, home and building automation, industrial control, and security applica-tions, FreeStar Pro combines extensive processing capability with high output power and low power consumption. The processing power of the MC13224V enables the FreeStar Pro to provide a level of integration unprecedented in a ZigBee module. The 32-bit ARM7TDMI processor and expansive on-chip memory enable designers to eliminate the peripheral host processors often required by 8- and 16-bit transceiver solutions. This high level of integration reduces component count, lower power consumption and overall system costs. Integrated Transceiver Modules for ZigBee / IEEE 802.15.4Evaluation Kit available: ZFSM-201-KIT-1 The information in this document is subject to change without notice, please conrm data is currentDocument No: 0006-00-07-00-000 (Preliminary)Date Published: June 11, 2009• Transmit Power: 100 mW• Receive Sensitivity: -94 dBm• Freescale MC13224V platform• 128 kB Serial Flash Memory• 96 kB SRAM• 80 kB ROM • 32-bit ARM7TDMI-based MCU• 46 GPIO Pins• 12-bit ADCFREESTAR PRO ZFSM-201-1 APPLICATIONS• Powerful 32-bit ARM7TDMI based microprocessor• Extensive on-board memory resources• Up to 100 mW output power• Miniature footprint: 1” x 1.4” (25.4 mm x 36.5 mm)• Integrated PCB trace antenna• 16 RF channels• Over 4000 feet of range• AES 128-bit encryption• Low power consumption• FCC, CE and IC certications pending• RoHS compliantORDERING INFORMATIONPart Number Order Number Supplying FormZFSM-201 SeriesFREESTAR PROZFSM-201-1 100 mW Output power, PCB Trace AntennaZFSM-201-1C 100 mW Output power, MMCX connector for external antennaZFSM-201-KIT-1 Engineering Evaluation KitFEATURES Home & Building Automation• Security• HVAC control• Lighting control• ThermostatsIndustrial Controls• Food processing controls• Trafc Management• Sensor Networks• Asset Management• Barcode reader• Patient Monitoring• Glucose monitorAutomated Meter Reading• In meter applications• Thermostats• In-home display units
ZFSM-201 SeriesPage 2FREESTAR PRO MODULE BLOCK DIAGRAMEVALUATION KITThe FreeStar Pro Kits assists users in both evaluation and development. As a stand alone radio system, the kit allows users to place the modules into the target environment and evaluate performance. The FreeStar Pro kit also serves as an invaluable aid in application development. Through the many headers on the interface board, the user has access to all pins on the ZFSM-201-1 enabling easy connection to the target system for application development. The FreeStar Pro module contains the Freescale™ MC13224V transceiver IC, an NEC high gain Power Amplier, XTALs, Power Regulator, and an integrated PCB antenna. The interface board features a serial communication interface, a power management module, peripherals such as potentiometer LEDs, and GPIO headers. The Evaluation Kit also contains four AA batteries and two USB cables.For more detailed information regarding FreeStar Pro Evaluation Kit, refer to the FreeStar Pro Evaluation Kit User Guide document. (Available at CEL’s website http://www.cel.com)Kit Contents:32.768 kHz XTAL (optional)32.768 kHz XTALCastellation EdgeConnector24 MHz XTALPWRRegRadioANTMicroprocessorFreescaleMC13224VRF Front End(NEC PA andNEC Switch)FreeStar Pro• Three Evaluation Boards with ZFSM-201-1 Modules• Two USB A/B Cables• Ten Jumpers (Spares)• Four AA Batteries• Software & Technical Information CD
ZFSM-201 SeriesPage 3Introduction and OverviewDescription.............................................................................................................................................................................................. 1Features.................................................................................................................................................................................................. 1Applications............................................................................................................................................................................................ 1Ordering Information............................................................................................................................................................................. 1Module Block Diagram........................................................................................................................................................................... 2Evaluation Kit......................................................................................................................................................................................... 2System Level FunctionModule Microprocessor......................................................................................................................................................................... 4Modes of Operation (TX, RX, Sleep)...................................................................................................................................................... 5Power Amplier....................................................................................................................................................................................... 6Power Amplier Control Line................................................................................................................................................................. 6Interface.................................................................................................................................................................................................. 6Host Protocol Interface Commands...................................................................................................................................................... 6Electrical SpecicationAbsolute Maximum Ratings................................................................................................................................................................... 7Recommended (Operating Conditions)................................................................................................................................................ 7DC Characteristics.................................................................................................................................................................................. 7RF Characteristics.................................................................................................................................................................................. 7Pin Signal & InterfacesPin Signals I/O Conguration................................................................................................................................................................ 8I/O Pin Assignments............................................................................................................................................................................... 9Module Dimensions................................................................................................................................................................................ 11Processing 13Agency Certications 14Shipment, Storage & Handling 16References & Revision History 17TABLE OF CONTENTS
ZFSM-201 SeriesPage 4MICROPROCESSOR The primary component of the FreeStar Pro module is Freescale’s third generation ZigBee platform. It incorporates a complete, low power, 2.4 GHz radio frequency transceiver, 32-bit ARM7TDMI-based microprocessor, hardware acceleration for both IEEE 802.15.4 MAC and AES security plus a full suite of processor peripherals.The MC13224V architecture offers superior processing power for ZigBee applications. The core operates up to 26 MHz. An 80 kByte ROM is utilized for the low level IEEE 802.15.4 MAC and PHYsical layer commands. This off loads the Flash memory, leaving more space for the end user application. The MC13224V supports 128 kBytes of Flash memory. The program code is mirrored in 96 kBytes of RAM for faster execution by the processor core. A full set of peripherals and Direct Memory Access (DMA) capability for transceiver packet data are also included.In addition, the MC13224V provides extensive power savings options. options, including low current sleep modes allowing for maximum operating life when battery-powered.ANTENNA FreeStar Pro modules include an integrated PCB trace antenna. An optional MMCX connector can be specied, enabling connection to a 50-ohm external antenna of the user’s choice. See Ordering Information on page 1. The PCB antenna employs an F-Antenna topology that is compact and supports an omni-directional radiation pattern. To maximize antenna efciency, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host board under the module will contribute signicantly to antenna performance. The position of the module on the host board and overall design of the product enclosure contribute to antenna perfor-mance. Poor design affects radiation patterns and can result in reection, diffraction, and/or scattering of the transmitted signal. Here are some design guidelines to help ensure antenna performance: • Never place the ground plane or route copper traces directly underneath the antenna portion of the module. • Never place the antenna close to metallic objects. • In the overall design, ensure that wiring and other components are not placed near the antenna. • Do not place the antenna in a metallic or metallized plastic enclosure. • Keep plastic enclosures 1cm or more from the antenna in any direction.
ZFSM-201 SeriesPage 5MODES OF OPERATION FreeStar Pro power management is controlled through the Freescale MC13224V’s Clock and Reset Module (CRM). The CRM is a dedicated module to handle clock, reset, and power management functions including control of the power regula-tors. All these functions have direct impact on attaining the lowest power. The FreeStar Pro module supports three modes of operation: Active, Doze and Hibernation. The latter two modes are the low-power sleep modes. Active ModeIn this mode all functions / features are operating normally.Doze ModeDoze mode provides signicant reduction in power consumption while still maintaining a high degree of sleep timing accu-racy. In Doze mode, the reference oscillator of the processor continues to operate normally. Hibernation ModeHibernation mode provides the greatest reduction in power consumption however the sleep timing accuracy is not as pre-cise as in Doze mode. The CRM manages the recovery from the low-power modes, similar to power-up from reset, providing regulator and clock management. The module can be awoken from the low-power modes in 3 ways, wake-up can occur: • On external interrupts through any of the 4 Keyboard Interface inputs • From internal interrupts • On the Real Time (wake-up) timer interrupt For more detail information on modes of operation refer to Freescale’s MC13224V datasheet available at Freescale’s website (www.freescale.com)
ZFSM-201 SeriesPage 6POWER AMPLIFIER The FreeStar Pro module incorporates a high performance Power Amplier from NEC Electronics.Power Amplier Control Line FreeStar Pro modules include a separate 1.8V regulator supplying a bias that enables consistent module output performance over the wide operating range. To prevent excessive sleep current draw, this regulator should be disabled when the module is placed into sleep mode.The voltage regulator is controlled by GPIO42 (ANT1), setting GPIO42 high enables the regulator while setting GPIO42 low disables the regulator. See the table below for the Turn on Time requirements for the voltage regulator.SPECIFICATIONS — GPIO42Parameter Min Typ Max UnitRegulator enable voltage 0.95 VRegulator disable voltage 0.40 VTurn on Time for VOUT=1.8V (Default) 105 200 µsecFor the TX_ON and RX_ON pins, the function table is as follows:Parameter TX Mode RX ModeTX_ON High Low RX_ON Low HighOther Notes: • The GPIO43 (ANT2) pin is not used and is left unconnected. • Due to the long turn on time (105µs) of the regulator, the regulator is enabled or ON all the time with the execption of sleep mode. • The RF switch uses both the TX_ON and RX_ON outputs as control inputs. • The PA uses the TX_ON line as the control input. RF Output Power SettingIn order to comply with emissions requirements, the Freestar PRO module must operate at reduced power settings on channels 11,12, and 26. The rmware provided with the modules limits users to Test Tool power step 4 maximum on channels 11 & 12 and power step 1 on channel 26. The resulting maximum RF output power using these power setting is 10dBm on channels 11 & 12, and -1dBm on channel 26.In addition to restricting power, the rmware also limits the maximum data payload to 106 bytes for any transmitted packet. INTERFACE The FreeStar Pro module has all major pins routed to the castellation connectors, this includes, but is not limited, to the pins for JTAG, serial communication, A/D, etc.
ZFSM-201 SeriesPage 7HOST PROTOCOL INTERFACE COMMANDSCEL provides the Host Serial and RF Protocols document which details the protocols and commands between the Host processor (i.e. an external microprocessor, a PC, etc.) and the FreeStar Pro module. An example of the commands, but not limited to, included in the host protocol interface are as follows: • Query Version (MAC version, SMAC version, etc) • Set RF Channel • Set RF Power • Transmit Packet Error TestFor more detail refer to Host Serial and RF Protocols document listed on our website at http://www.cel.com (FreeStar Pro Host & RF Protocol)ABSOLUTE MAXIMUM RATINGSDescription Min Max UnitPower Supply Voltage -0.3 3.6 VDCVoltage on Any Digital Pin -0.3 VCC + 0.2 VDCRF Input Power 10 dBmStorage Temperature Range -45 125 °CReow Soldering Temperature 260 °CNote: Exceeding the maximum ratings may cause permanent damage to the module.RECOMMENDED OPERATING CONDITIONSDescription Min Typ Max UnitPower Supply Voltage (VCC) 2.1 3.6 VDCAmbient Temperature Range -40 25 85 °CCrystal Reference Oscillator 24 MHz DC CHARACTERISTICS (@ 25°C, VCC = 3.3V unless otherwise noted)Description Typ Max UnitTransmit Mode Current (at +20 dBm Output Power) 193 mAReceive Mode Current 30 mAHibernate or Doze Mode Current 5 µA
ZFSM-201 SeriesPage 8RF CHARACTERISTICS (@ 25°C, VCC = 3.3V unless otherwise noted)Parameter Min Typ Max UnitGeneral CharcteristicsRF Frequency Range 2400 2483.5 MHzRF Data Rate 250 kbpsTransmitterNominal Output Power 20 dBmProgrammable Output Power Range 18 dBError Vector Magnitude 8 35 %ReceiverReceiver Sensitivity (1% PER) -92 -94 dBmSaturation (Maximum Input Level) (1% PER) 0 dBm802.15.4 Adjacent Channel Rejection (±5 MHz) 35 40 dB802.15.4 Alternate Channel Rejection (±10 MHz) 50 dBPIN SIGNALS I/O PORT CONFIGURATIONThe FreeStar Pro module has 60 edge I/O interfaces for connection to the user’s host board. Figure 1 shows the layout of the 60 edge castellations.
ZFSM-201 SeriesPage 9FREESTAR PRO I/O PIN ASSIGNMENTSPin # Name Type Description IC Pin #1 GND GND GND 852 GND GND GND 843 GND GND GND 754 ADC2_VREFL Analog Input or Digital I/OGPIO39 Alternate function: Low reference voltage for ADC2 615 ADC1_VREFL Analog Input or Digital I/OGPIO41 Alternate function: Low reference voltage for ADC1 626 ADC1_VREFH Analog Input or Digital I/OGPIO40 Alternate function: High reference voltage for ADC1 637 ADC2_VREFH Analog Input or Digital I/OGPIO38 Alternate function: Low reference voltage for ADC2 648 ADC0 Analog Input or Digital I/OGPIO30 Alternate function: ADC analog input Channel 0 19 ADC1 Analog Input or Digital I/OGPIO31Alternate function: ADC analog input Channel 1 210 ADC2 Analog Input or Digital I/OGPIO32 Alternate function: ADC analog input Channel 2 311 ADC3 Analog Input or Digital I/OGPIO33 Alternate function: ADC analog input Channel 3 412 VCC Power Input High side supply voltage to buck regulator switching MOSFET & IO buffers 4513 ADC4 Analog Input or Digital I/OGPIO34 Alternate function: ADC analog input Channel 4 514 ADC5 Analog Input or Digital I/OGPI035 Alternate function: ADC analog input Channel 5 615 ADC6 Analog Input or Digital I/OGPIO036Alternate function: ADC analog input Channel 6 716 ADC7_RTCK Analog Input or Digital I/OGPI037 Alternate function: ADC analog input Channel 7 / Return ClocK 817 TDO Digital I/O GPI049 Alternate function: JTAG Test Data Output 918 TDI Digital I/O GPI048 Alternate function: JTAG Test Data Input 1019 TCK Digital I/O GPIO47 Alternate function: JTAG Test Clock Input 1120 TMS Digital I/O GPIO46 Alternate function: JTAG Test Mode Select Input 1221 UART2_RTS Digital I/O GPIO21 Alternate function: UART2 Request to Send input 1322 GND GND GND 7623 UART2_CTS Digital I/O GPI020Alternate function: UART2 Clear to Send output 1424 UART2_RX Digital I/O GPIO19 Alternate function: UART2 RX data input 1525 UART2_TX Digital I/O GPIO18Alternate function: GPIO18UART2 TX data output 1626 UART1_RTS Digital I/O GPI017 Alternate function: UART1 Request to Send input 1727 UART1_CTS Digital I/O GIO016Alternate function: UART1 Clear to Send output 1828 I2C_SDA Digital I/O GPIO13 Alternate function: I2C Bus data 2129 I2C_SCL Digital I/O GPIO12Alternate function: I2C Bus clock 2230 TMR3 Digital I/O GPIO11 Alternate function: Timer 3 IO signal 23
ZFSM-201 SeriesPage 10FREESTAR PRO I/O PIN ASSIGNMENTS (Continued)Pin # Name Type Description IC Pin #31 VCC Power Input High side supply voltage to buck regulator switching MOSFET & IO buffers 4532 TMR2 Digital I/O GPIO10 Alternate function: Timer 2 IO signal 2433 TMR1 Digital I/O GPIO9 Alternate function: Timer 1 IO signal 2534 TMR0 Digital I/O GPIO8 Alternate function: Timer 0 IO signal 2635 SPI_SCK Digital I/O GPIO7 Alternate function: SPI Port clock 2736 UART1_TX Digital I/O GPIO14 Alternate function: UART1 TX data output 2037 UART1_RX Digital I/O GPIO15 Alternate function: UART1 RX data input 1938 GND GND GND 7739 SPI_MOSI Digital I/O GPIO6 Alternate function: SPI Port MOSI 2840 SPI_MISO Digital I/O GPIO5 Alternate function: SPI Port MISO 2941 SPI_SS Digital I/O GPIO4 Alternate function: SPI Port SS 3042 SSI_BITCK Digital I/O GPIO3 Alternate function: SSI Bit Clock 3143 SSI_FSYN Digital I/O GPIO2 Alternate function: SSI Frame Sync 3244 SSI_RX Digital I/O GPIO1 Alternate function: SSI RX data input 3345 SSI_TX Digital I/O SSI TX data output / GPIO0 3446 KBI_7 Digital I/O GPIO29 Alternate function: Keyboard Interface Bit 7 3547 COIL_BK Power Switch Output Buck Converter coil drive output 4348 KBI_6 Digital I/O GPIO28 Alternate function: Keyboard Interface Bit 6 3649 RESETB Digital Input System reset input 5150 LREG_BK_FB Power Input Voltage input to onboard regulators, buck regulator feedback voltage 4451 GND GND GND 7852 KBI_5 Digital I/O GPIO27 Alternate function: Keyboard Interface Bit 5 3753 KBI_4 Digital I/O GPIO26 Alternate function: Keyboard Interface Bit 4 3854 KBI_3 Digital I/O GPIO25 Alternate function: Keyboard Interface Bit 3 3955 KBI_2 Digital I/O GPIO24 Alternate function: Keyboard Interface Bit 2 4056 KBI_1 Digital I/O GPIO23 Alternate function: Keyboard Interface Bit 1 4157 KBI_0_HST _WK Digital I/O GPIO22 Alternate function: Keyboard Interface Bit 0 / Host Walk-up output 4258 GND GND GND 7959 GND GND GND 8660 GND GND GND 87
ZFSM-201 SeriesPage 11MODULE DIMENSIONS Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.For layout recommendation for optimum antenna performance, refer to Antenna section in this document.FreeStar PRO ZFSM-201-1CFreeStar PRO ZFSM-201-1RF Shield0.895”1.413”Pitch = 0.05”1.000”0.062”.193”0.085”0.075”Pin 1Pin 21 Pin 40Pin 60RF ShieldZFSM-201-1C6 J1C12C7C11C300006-00-00-00-001ISSUE RF ShieldJ2 Connector0.895”1.413”Pitch = 0.05”1.000”0.062”.193”0.085”0.075”Pin 1Pin 21 Pin 40Pin 60RF ShieldZFSM-201-1CC6C12C7C11C300006-00-00-00-001ISSUE
ZFSM-201 SeriesPage 12MODULE LAND FOOTPRINT NOTE: Dimensions in inches. Tolerances = +/-0.005” unless otherwise noted.1.100 [27.93]0.308 [7.82]0.050 [1.26]0.050 [1.27]60 X 0.040 [1.02]60 X 0.100 [2.54]1.155 [29.34]1.040 [26.42]0.890 [22.61]0.104 [2.65]1.000 [25.40]COPPER KEEPOUT AREAFigure 2
ZFSM-201 SeriesPage 13PROCESSINGRecommended Reow ProleParameters Values Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time 60-120 sec TLiquidus 217ºC Time above TL 60-150 sec Tpeak 260 + 0ºC Time within 5º of Tpeak 20-30 sec Time from 25º to Tpeak 8 min max Ramp down rate 6ºC/sec max Achieve the brightest possible solder llets with a good shape and low contact angle.Pb-Free Soldering Paste Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Specication. See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.4 Castellated Terminations.”Cleaning In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process.• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels.• Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.• Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a “no clean” soldering paste and eliminate the post-soldering cleaning step.Optical InspectionAfter soldering the Module to the host board, consider optical inspection to check the following:• Proper alignment and centering of the module over the pads.• Proper solder joints on all pads.• Excessive solder or contacts to neighboring pads, or vias.Repeating Reow SolderingOnly a single reow soldering process is encouraged for host boards.
ZFSM-201 SeriesPage 14AGENCY CERTIFICATIONSFCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GENThis device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. This device may not cause harmful interference. 2. This device must accept any interference received, including interference that may cause undesired operation. Warning (Part 15.21)Changes or modications not expressly approved by CEL could void the user’s authority to operate the equipment. 20 cm Separation DistanceTo comply with FCC/IC RF exposure limits for general population / uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter.OEM Responsibility to the FCC Rules and RegulationsThe FreeStar Pro Module has been certied per FCC Part 15 rules for integration into products without further testing or certication. To fulll the FCC certication requirements, the OEM using the FreeStar Pro Module must ensure that the information provided on the FreeStar Pro Label is placed on the outside of the nal product. The FreeStar Pro Module is labeled with its own FCC ID Number. If the FCC ID is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: W7Z-FSTARPRO” or “Contains FCC ID: W7Z-FSTARPRO”The OEM using the FreeStar Pro Module must only use the approved antenna, (PCB Trace Antenna) that has been certi-ed with this module. The OEM using the FreeStar Pro Module must test their nal product conguration to comply with Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.PROCESSING (Continued) Wave SolderingIf a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged.Hand SolderingHand soldering is possible. Use a soldering iron temperature setting equivalent to 350°C, follow IPC recommendations/reference document IPC-7711.ReworkThe FreeStar Pro Module can be unsoldered from the host board. Use of a hot air rework tool and hot plate for pre-heating from underneath is recommended. Avoid overheating.!Warning Never attempt a rework on the module itself, e.g. replacing individual components. Such actions will terminate warranty coverage.Additional GroundingAttempts to improve module or system grounding by soldering braids, wires, or cables onto the module RF shield cover is done at the customers own risk. The numerous ground pins at the module perimeter should be sufcient for optimum immunity to external RF interference.
ZFSM-201 SeriesPage 15AGENCY CERTIFICATIONS (Continued)IC Certication — Industry Canada Statement The term "IC" before the certication / registration number only signies that the Industry Canada technical specications were met.Section 14 of RSS-210The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF eld in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.phpCE Certication — Europe The FreeStar Pro RF module has been tested and certied for use in the European Union. OEM Responsibility to the European Union Compliance Rules If the FreeStar Pro module is to be incorporated into a product, the OEM must verify compliance of the nal product to the European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of these standards and kept on le as described in Annex II of the R&TTE Directive.The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining European Union Compliance. If any of the specications are exceeded in the nal product, the OEM is required tomake a submission to the notied body for compliance testing.OEM Labeling RequirementsThe `CE' mark must be placed on the OEM product in a visible location.The CE mark shall consist of the initials “CE” with the following form: · If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be adhered to. · The CE mark must be a minimum of 5mm in height · The CE marking must be afxed visibly, legibly, and indelibly Since the 2400 - 2483.5 MHz band is not harmonized by a few countries throughout Europe, the Restriction sign must be placed to the right of the `CE' marking as shown in the picture
ZFSM-201 SeriesPage 16SHIPMENT, HANDLING, AND STORAGE Shipment The FreeStar Pro Modules are delivered in trays of TBD.HandlingThe FreeStar Pro Modules are designed and packaged to be processed in an automated assembly line.!Warning The FreeStar Pro Modules contain a highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. !Warning According to JEDEC ISP, the FreeStar Pro Modules are moisture sensitive devices. Appropriate handling instructions and precautions are summarized in Section 2.1. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL)MSL 3, per J-STD-033 StorageStorage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.
ZFSM-201 SeriesPage 17REFERENCES & REVISION HISTORYReferences Reference DocumentsFreeStar Pro Module Evaluation Kit User Guide FreeScale MC13224V DatasheetFreescale Semiconductor MC1322x Reference Manual MC1322xRMFreescale Semiconductor BeeKit™ Quick Start Guide BKWCTKQUGFreescale Semiconductor BeeKit™ User Guide BKWCTKUGFreescale Semiconductor Software Driver Reference Manual 22XDRVRRMFreescale Semiconductor MC1322x Simple Media Access Controller (SMAC) Reference Manual 22xSMACRMFreescale Semiconductor Simple Media Access Controller (SMAC) User’s Guide SMACRMIAR J-Link and IAR J-Trace user Guide J-Link_J-TraceARM-1ARM® IAR Embedded Workbench® IDE User Guide UARM-13 Revision History Previous Versions Changes to Current Version Page0006-00-07-00-000 (Preliminary) October 28, 2008 Initial advance datasheet. N/A0006-00-07-00-000 (Preliminary) May 20, 2009 Updated to current revisions to the Freescale Silicon IC N/A0006-00-07-00-000 (Preliminary) June 11, 2009 Updated FCC and IC Agency Statements 14-15Disclaimer • The information in this document is current as of June, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most up-to-date specications of CEL products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. • CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s •equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in CEL products, customers must incorporate sufcient safety measures in their design, such as redundancy, re-containment and anti-failure features.

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