California Eastern Laboratories WB4343WF3SP2 WiFi/Bluetooth/Bluetooth Smart Mini Module User Manual MeshConnect

California Eastern Laboratories WiFi/Bluetooth/Bluetooth Smart Mini Module MeshConnect

Exhibit D Users Manual per 2 1033 b3

1 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) Date Published: May 23, 2016 DESCRIPTION The WB4343W and W43364 Wi-Fi®/Bluetooth®/Bluetooth Smart Mini Modules are complete standalone solutions for designers looking to take advantage of the high data rate of Wi-Fi, to interface to legacy Bluetooth Classic devices already in the field, and to utilize the low power consumption and mesh network capabilities of Bluetooth Smart. They eliminate design risk and significantly reduce time-to-market for a multitude of M2M applications. These devices are footprint-compatible with CEL’s existing line of ZigBee®, Thread, and Bluetooth®-based modules, allowing solutions which easily transition between multiple wireless networking standards via drop-in compatible module hardware. The WB4343W and W43364 Mini Module family consists of four drop-in compatible devices so the feature set can be optimized for your application. Options include Wi-Fi/Bluetooth/Bluetooth Smart (WB4343W) or Wi-Fi only (W43364) radios, plus different MCU memory sizes (STM32F411 MCU with 512kB flash/128kB RAM or STM32F412 MCU with 1MB flash/256kB RAM). Based on the Broadcom BCM4343W and BCM43364 transceivers and the ST Micro STM32 microprocessor, the Cortet Mini Modules combine the BCM43xxx's 32-bit ARM® Cortex®-M3 MCU, integrated ROM & RAM, 2.4 GHz radio, LNA, PA, and internal transmit/receive RF switch with an ultra low power, high performance 32-bit ARM® Cortex®-M4F MCU with FPU, 512KB or 1MB flash, 128kB or 256kB SRAM, and all necessary crystals and filtering. These devices leverage the world-class WICED™ SDK toolset from Broadcom, and are capable of running the WICED stack plus the product application code without requiring an additional microprocessor. They are optimized for small size and low power consumption, and can be run directly from a rechargeable mobile platform battery. They include Broadcom’s Enhanced Collaborative Coexistence algorithms and hardware mechanisms, allowing for an extremely collaborative Wi-Fi and Bluetooth coexistence. KEY FEATURES • Wi-Fi (802.11 b/g/n, single stream) • Bluetooth 2.1+EDR & 3.0, Bluetooth 4.1 (BLE) • Fully Compatible with the Broadcom WICED SDK • Dual MCUs (32-bit ARM® Cortex®-M3 & -M4F) • 512 kB or 1MB Flash, 128kB or 256kB SRAM • Up to 25 GPIOs, including SPI, USART, I2C, ADCs and timers • Internal antenna or RF port for external antenna • Mini footprint: 0.940” x 0.655” (23.9 x 16.6mm) • Footprint-compatible with CEL's Bluetooth, ZigBee, and Thread module family • FCC, IC, Wi-Fi Alliance, and Bluetooth SIG certified APPLICATIONS • Connected Home & Appliances • Building Control & Automation • Lighting • Security • Wireless Sensor Networks • Wireless Audio & Video • Remote Health and Wellness Monitoring • General M2M Wireless Networking Wi-Fi®/Bluetooth®/Bluetooth Smart Mini Module WB4343WFxSP2, W43364FxSP2 BroadcomTM Transceiver-Based Module PRELIMINARY DATASHEET Embedded Wireless LAN Controller Module
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 2 PRELIMINARY DATASHEET TABLE OF CONTENTS DESCRIPTION ...................................................................................................................................... 1 KEY FEATURES ..................................................................................................................................... 1 APPLICATIONS ..................................................................................................................................... 1 TABLE OF CONTENTS ........................................................................................................................... 2 DEVELOPMENT TOOLS......................................................................................................................... 3 BLOCK DIAGRAM................................................................................................................................. 3 ORDERING INFORMATION ................................................................................................................... 4 ANTENNA ............................................................................................................................................ 4 TRANSCEIVER IC .................................................................................................................................. 5 MICROPROCESSOR .............................................................................................................................. 5 SOFTWARE/FIRMWARE ....................................................................................................................... 5 ABSOLUTE MAXIMUM RATINGS .......................................................................................................... 6 RECOMMENDED OPERATING CONDITIONS .......................................................................................... 6 DC CHARACTERISTICS .......................................................................................................................... 7 RF CHARACTERISTICS ........................................................................................................................... 7 I/O PIN ASSIGNMENTS .......................................................................................................................11 CEL MINI MODULE COMPATIBILITY.....................................................................................................12 MODULE DIMENSIONS .......................................................................................................................12 MODULE LAND FOOTPRINT ................................................................................................................13 PROCESSING ......................................................................................................................................14 AGENCY CERTIFICATIONS ...................................................................................................................16 SHIPMENT, HANDLING AND STORAGE ................................................................................................17 QUALITY ............................................................................................................................................17 REVISION HISTORY .............................................................................................................................18 DISCLAIMER .......................................................................................................................................18
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 3 PRELIMINARY DATASHEET DEVELOPMENT TOOLS Cortet Radio WICED Evaluation Kit for Wi-Fi and Bluetooth The Cortet Radio WICED Evaluation Kit is designed for rapid evaluation of the WB43xxxSP2 family. Based on the best-in-class Broadcom WICED software development environment, the WB43xxx Evaluation Kit is a comprehensive solution for software prototyping and making hardware measurements. Kit contents: • Evaluation board with push buttons, LEDs, analog inputs, JTAG over USB interface for software programming and debug, external voltage inputs, ammeter interface, and GPIO breakout pins • Daughtercard with WB4343WF3SP2-1C module (Wi-Fi/ Bluetooth transceiver + STM32F411 MCU, including 512kB flash and 128kB RAM) • Programming interface cable • Link to online documentation Visit cortet.cel.com/wb4343 for more information. The Cortet Radio WICED Evaluation Kit utilizes a modular daughtercard architecture. Once the base kit (WB43XXX-EVK-1) has been purchased, WB43xxxSP2 daughtercards containing a header compatible with the WB43xxx Evaluation Kit can be ordered separately for all members of the WB43xxxSP2 module family. See ordering information below for more details. BLOCK DIAGRAM ARM Cortex-M4F BCM43xxx26MHz Crystal37.4MHz CrystalLPF1MBExternal FlashAntenna matchJTAG Connector (SW debug)VCCI2CSPITIMERUSARTADCGPIOCEL ModuleOptional External Antenna32kHz Crystal WB43xxx Evaluation Kit Add-on daughtercard for use with WB43xxx Evaluation Kit
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 4 PRELIMINARY DATASHEET ORDERING INFORMATION Order Number Description Min/Multiple WB4343WF3SP2-1-R Wi-Fi/BT Module, BCM4343W Transceiver + STM32F411 MCU (512kB flash, 128kB RAM), Trace Antenna 600 WB4343WF3SP2-1C-R Wi-Fi/BT Module, BCM4343W Transceiver + STM32F411 MCU (512kB flash, 128kB RAM), Castellation Pin for External Antenna 600 WB4343WF4SP2-1-R Wi-Fi/BT Module, BCM4343W Transceiver + STM32F412 MCU (1MB flash, 256kB RAM), Trace Antenna 600 WB4343WF4SP2-1C-R Wi-Fi/BT Module, BCM4343W Transceiver + STM32F412 MCU (1MB flash, 256kB RAM), Castellation Pin for External Antenna 600 W43364F3SP2-1-R Wi-Fi Module, BCM43364 Transceiver + STM32F411 MCU (512kB flash, 128KB RAM), Trace Antenna 600 W43364F3SP2-1C-R Wi-Fi Module, BCM43364 Transceiver + STM32F411 MCU (512kB flash, 128KB RAM), Castellation Pin for External Antenna 600 W43364F4SP2-1-R Wi-Fi Module, BCM43364 Transceiver + STM32F412 MCU (1MB flash, 256KB RAM), Trace Antenna 600 W43364F4SP2-1C-R Wi-Fi Module, BCM43364 Transceiver + STM32F412 MCU (1MB flash, 256KB RAM), Castellation Pin for External Antenna 600 WB43XXX-EVK-1 WB43xxx Evaluation Kit - Universal Eval Board + WB43xxx Programming Fixture, pre-populated with WB4343F3SP2-1C-EVB on daughtercard 1 WB4343WF3SP2-1-EVB WB4343WF3SP2-1 on daughtercard for use with WB43xxx-EVK-1 1 WB4343WF3SP2-1C-EVB WB4343WF3SP2-1C on daughtercard for use with WB43xxx-EVK-1 1 WB4343WF4SP2-1-EVB WB4343WF4SP2-1 on daughtercard for use with WB43xxx-EVK-1 1 WB4343WF4SP2-1C-EVB WB4343WF4SP2-1C on daughtercard for use with WB43xxx-EVK-1 1 W43364F3SP2-1-EVB W43364F3SP2-1 on daughtercard for use with WB43xxx-EVK-1 1 W43364F3SP2-1C-EVB W43364F3SP2-1C on daughtercard for use with WB43xxx-EVK-1 1 W43364F4SP2-1-EVB W43364F4SP2-1 on daughtercard for use with WB43xxx-EVK-1 1 W43364F4SP2-1C-EVB W43364F4SP2-1C on daughtercard for use with WB43xxx-EVK-1 1 ANTENNA The Cortet Mini Modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional configuration which uses a castellation pin on the module allows the user to connect to an external antenna. The WB43xxxSP2 family has been certified with the PCB trace antenna only. The PCB antenna employs a topology that is compact and highly efficient. To maximize range, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute significantly to the antenna performance. For optimum antenna performance, the Cortet Mini Module should be mounted with the PCB trace antenna overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the host board under the module, up to the antenna but not extending under the antenna (a minimum of 1.5" x 1.5" is recommended). The installation of an uninterrupted ground plane on a layer directly beneath the module will also allow traces to be routed under the layer. Refer to the application note Mini Modules Hardware Design Guidelines for more details. CEL can assist with your PCB layout. The following are some design guidelines to help ensure optimal antenna performance: • The antenna portion of the Mini Module should hang over the host board so that there is not any additional PCB under the antenna. • Never place the antenna close to metallic objects • In the final assembly, ensure that wiring and other components are not placed near the antenna • Do not place the antenna in a metallic or metalized plastic enclosure • Keep plastic enclosures a minimum of 1cm away from the antenna in any direction Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 5 PRELIMINARY DATASHEET Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. TRANSCEIVER IC The WB43xxxSP2 family utilizes the BCM4343W or BCM43364 transceiver (WB4343WFxSP2 or W43364FxSP2 models respectively), which is a highly integrated 2.4GHz WLAN IEEE 802.11 b/g/n MAC/baseband transceiver. It integrates a power amplifier (PA) and a low-noise amplifier (LNA) for best-in-class receiver sensitivity and an internal transmit/receive RF switch. The BCM4343W transceiver supports the Wi-Fi, Bluetooth, and Bluetooth Smart protocols, while the BCM43364 transceiver supports Wi-Fi only. Both transceivers also contain an ARM® Cortex®-M3 32-bit RISC microprocessor, with 640kB ROM and 512kB RAM for running software from the Link Control Layer up to the Host Controller Interface. MICROPROCESSOR The Cortet Mini Modules contain a STM32 microprocessor from ST Micro, which is a 32-bit ARM® Cortex®-M4F processor running at 100MHz. The WB43xxxF3 utilizes the STM32F411 with 512kB of flash and 128kB of SRAM, and the WB43xxxF4 utilizes the STM32F412 with 1MB of flash and 256kB of SRAM. Both MCUs support a rich set of peripherals, including SPI, USART, I2C, 12-bit ADCs and timers. This ARM® Cortex®-M4F core features a floating point unit (FPU) which supports all ARM® single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security. With the resources of the on-board STM32 microprocessor, the WB43xxxF3 and WB43xxxF4 Mini Modules are capable of running the full Broadcom WICED stack plus the product application code, providing a full standalone solution. The WB43xxxF4 is ideal for resource-intensive applications like a Wi-Fi/Bluetooth Smart Bridge with support for Amazon Web Services and Apple HomeKit, while the WB43xxxF3 is a more cost-effective solution for Wi-Fi enabled end devices. SOFTWARE/FIRMWARE The Cortet Mini Modules utilize the WICED software development environment, which allows designers to quickly and easily integrate Wi-Fi and Bluetooth connectivity into any product. WICED is an open-source build system based on GNU ‘make’ and will also run on commercial toolchains such as IAR. It has a GUI development environment based on Eclipse CDT, and supports a JTAG programmer and single-step, thread-aware debugger based on OpenOCD and gdb. The WICED platform offers several RTOS/TCP stack options, has a simple API for accessing hardware peripherals, and includes advanced security and networking features like SSL/TLS and IPv4/IPv6 TCP/IP networking stacks. It is a production-ready application framework, including a bootloader, flash storage API, over-the-air upgrades, factory reset, and a system monitor.
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 6 PRELIMINARY DATASHEET ABSOLUTE MAXIMUM RATINGS Description Min Max Unit Storage Temperature -40 85 °C Voltage Ripple (Max. value not to exceed operating voltage) 2 % Power Supply Voltage 4 V RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit Frequency 2405 2484 MHz Power Supply Voltage 3.0 3.3 3.6 V Operating Temperature -40 85 °C Humidity Range Non condensing 95 %
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 7 PRELIMINARY DATASHEET DC CHARACTERISTICS (@ 25°C unless otherwise specified) WLAN Item Condition Min Nom Max Unit Tx mode (11b Max current) 11Mbps 300 mA Tx mode (11g Max current) 54Mbps 275 mA Tx mode (11n Max current) MCS7 275 mA Rx mode 11b (11Mbps) 45 mA 11g (54Mbps) 45 mA 11n (MCS7) 46 mA BLUETOOTH (WB4343W variants only) Condition: +10dBm Item Condition Min Nom Max Unit Tx Mode 3DH5 30 mA RX Mode 3DH5 20 mA BLE Scan 1.28 s. interval with 11.25 ms window 350 µA BLE Adv. – Unconnectable 1 sec. 270 µA BLE Connected 1 sec. 250 µA RF CHARACTERISTICS Wi-Fi RF SPECIFICATION Features Description WLAN Standards IEEE 802 Part 11 b/g/n (802.11b/g/n single stream) Antenna Port Support Single Antenna for Wi-Fi / Diversity with external switch Frequency Band 2.4000 – 2.497 GHz (2.4 GHz ISM Band) Number of selectable Sub CH 14 channels Modulation OFDM, DSSS (Direct Sequence Spread Spectrum), DBPSK, DQPSK, CCK , 16QAM, 64QAM, 256QAM Supported rates 1, 2, 5.5,11, 6, 9,12, 24, 36, 48, 54 Mbps & HT20 MCS0~7 Item Condition Nom Unit Maximum RX Input Level with PER < 8%@11 Mbps -10 dBm with PER < 10%@54 Mbps -20 dBm with PER < 10%@MCS7 -20 dBm Output Power 17dBm @ 802.11b 17 dBm 13dBm @ 802.11g 13 dBm 12dBm @ 802.11n 12 dBm @ 802.11n (256QAM) 10 dBm The RF performance reported above assumes a default supply voltage of 3.3V.
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 8 PRELIMINARY DATASHEET TRANSMITTER SPECIFICATION 802.11b Transmitter Item Condition Min. Typ. Max. Unit Transmit Output Power 1M/2M/5.5M/11M 17 dBm Transmit spectrum mask Fc-22MHz<F<Fc-11MHz & Fc+11MHz<F<Fc+22MHz(1/2/5.5/11Mbps; channel 1~13) -30 dBc F<Fc-22MHz &F>Fc+22MHz(1/2/5.5/11Mbps; channel 1~13) -50 dBc Transmit power - on 10% ~ 90 % 0.3 2 µs Transmit power - down 90% ~ 10 % 1.5 2 µs Transmit modulation accuracy 1/2/5.5/11 Mbps -17 -10 dB 802.11g Transmitter Item Condition Min. Typ. Max. Unit Transmit Output Power 6M/9M/12M/18M/24M/36M/48M/54M 13 dBm Transmit spectrum mask @ 11MHz -20 dBc @ 20MHz -28 dBc @30MHz -40 dbc Transmit modulation accuracy 6Mbps -5 dB 9Mbps -8 dB 12Mbps -10 dB 18Mbps -13 dB 24Mbps -16 dB 36Mbps -19 dB 48Mbps -22 dB 54Mbps -25 dB 802.11n Transmitter Item Condition Min. Typ. Max. Unit Transmit Output Power HT20 MCS 0~7 12 dBm HT20 MCS7 10 dBm Transmit spectrum mask @ 11MHz -20 dBc @ 20MHz -28 dBc @30MHz -40 dbc Transmit modulation accuracy HT20 MCS 0~7 -27 dB HT20 MCS7 -32 dB
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 9 PRELIMINARY DATASHEET Bluetooth Transmitter (WB4343W variants only) Item Condition Min. Typ. Max. Unit Frequency Range 2402 2480 MHz Channel Spacing 1 MHz Transmit Output Power GFSK 10 dBm QPSK 6 dBm BPSK 6 dBm Initial Carrier Freq. Tolerance 25 75 kHz Lock Time 72 µS Frequency Drift DH1 Packet 8 25 kHz DH3 Packet 8 40 kHz DH5 Packet 8 40 kHz Drift Rate 5 20 KHz/50µS Frequency Deviation 00001111 sequence 140 155 175 kHz 10101010 sequence 115 140 kHz Bluetooth Low Energy Transmitter (WB4343W variants only) Item Condition Min. Typ. Max. Unit Frequency Range 2402 2480 MHz Transmit Output Power 8 dBm Mod Char: delta f1 average 225 225 275 kHz Mod Char: delta f2 max 99.9 % Mod Char: ratio 0.8 0.95 % RECEIVER SPECIFICATION 802.11b Receiver Item Condition Min. Typ. Max. Unit Minimum Input Level Sensitivity (PER < 8%) 1Mbps -80 -93 dBm 2Mbps -80 -91 dBm 5.5Mbps -76 -89 dBm 11Mbps -76 -86 dBm Maximum Input Level (PER < 8%) 1/2/5.5/11Mbps -10 dBm 802.11g Receiver Item Condition Min. Typ. Max. Unit Minimum Input Level Sensitivity (PER < 10%) 6Mbps -82 -88 dBm 9Mbps -81 -87 dBm 12Mbps -79 -85 dBm 18Mbps -77 -83 dBm 24Mbps -74 -80.5 dBm 36Mbps -70 -78.5 dBm 48Mbps -66 -74 dBm 54Mbps -65 -72 dBm Maximum Input Level (PER < 10%) 6/9/12/18/24/36/48/54Mbps -20 dBm
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 10 PRELIMINARY DATASHEET 802.11n Receiver Item Condition Min. Typ. Max. Unit Minimum Input Level Sensitivity (PER < 10%) HT20, MCS0 -82 -87.5 dBm HT20, MCS1 -79 -84 dBm HT20, MCS2 -77 -82 dBm HT20, MCS3 -74 -80.5 dBm HT20, MCS4 -70 -77 dBm HT20, MCS5 -66 -72 dBm HT20, MCS6 -65 -71 dBm HT20, MCS7 -64 -70 dBm 256-QAM R 3/4 -68 dBm 256-QAM R=5/6 -66 dBm Maximum Input Level (PER < 10%) MSC0~MSC7 -20 dBm Bluetooth Receiver (WB4343W variants only) Item Condition Min. Typ. Max. Unit Minimum Input Level Sensitivity (PER < 10%) GFSK, 0.1% BER, 1Mbps -91 dBm π/4-DQPSK, 0.01% BER, 2Mbps -93 dBm 8-DPSK, 0.01% BER, 3Mbps -87 dBm Input IP3 -16 dBm Maximum Input Level -20 dBm Bluetooth Low Energy Receiver (WB4343W variants only) Item Condition Min. Typ. Max. Unit Minimum Input Level Sensitivity with Dirty Transmitter GFSK, 0.1% BER, 1Mbps -94 dBm
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 11 PRELIMINARY DATASHEET I/O PIN ASSIGNMENTS Refer to the STM32 datasheet for pin functionality details. Module Pin Number STM32F41x UFBGA100 Pin Number Pin Name Notes 1, 2, 12, 31, 33 D3,F2,J1,F12,F11, GND 3 J2 PC1 4 H2 Reset 5 A4 BOOT0 6 L6 PB2/BOOT1 7 L2 PA0/WAKE 8 B12 PA11/USART1_CTS 9 A12 PA12/USART1_RTS 10 M4 PA7/SPI1_MOSI 11 L4 PA6/SPI1_MISO 13 C4,E2,G2,M1,G12,G11 VDD Input power to the module. 14 K4 PA5/SPI1_SCK 15 M3 PA4/SPI1_NSS 16 B5 PB6 17 B4 PB7 18 H1 PC0 19 D10 PA9/USART1_TX 20 C12 PA10/USART_RX 21 A10 PA14/JTCK 22 A8 PB3/JTDO 23 A9 PA15/JTDI 24 A11 PA13/JTMS 25 J3 PC2 26 K2 PC3/ADC1_13 Could be A/D or GPIO 27 A7 PB4/JRST 28 L3 PA3/ADC1_3 Could be A/D or GPIO 29 K3 PA2/ADC1_2 Could be A/D or GPIO 30 M2 PA1/ADC1_1 Could be A/D or GPIO 32 - RF OUT Castellation Pin for External Antenna NOTE: I/O PINOUTS ARE PRELIMINARY AND SUBJECT TO CHANGE. CONTACT CEL BEFORE COMMITTING TO PCB LAYOUTS TO ENSURE THAT PINOUT MAPPING MATCHES CEL'S FINAL DESIGN.
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 12 PRELIMINARY DATASHEET CEL MINI MODULE COMPATIBILITY The geometry of the land pattern and location of the RF castellations is identical to CEL’s ZICM35x family of ZigBee/Thread and B1010 Bluetooth Smart Mini Modules. The digital and analog mapping to develop a drop-in compatible solution is described below: Pin # Function ZICM35x B1010 WB43xxx Notes 4 Reset RESET N/C RESET 5, 6 Low frequency crystal PC6, PC7 N/C N/C Low frequency crystal is internal for B1010 and WB43xxx 7 Wake PA7 WAKE PA0 8, 9, 19, 20 Serial Controller 1 UART/SPI/I2C Two wire UART/I2C USART/I2C 10, 11, 14, 15 Serial Controller 2 SPI/I2C I2C SPI/I2C 16, 17, 21, 22, 23, 24, 27 Programming Programming Programming Programming 28, 30 ADC PB7, PB5 AIO[1], AIO[2] PA3, PA1 29 Timer PB6 PIO[11] PA2 MODULE DIMENSIONS
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 13 PRELIMINARY DATASHEET MODULE LAND FOOTPRINT
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 14 PRELIMINARY DATASHEET PROCESSING Recommended Reflow Profile Parameter Values Ramp Up Rate (from Tsoakmax to Tpeak) 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time 60-120 sec TLiquidus 217ºC Time above TLiquidus 60-150 sec Tpeak 250ºC Time within 5º of Tpeak 20-30 sec Time from 25º to Tpeak 8 min max Ramp Down Rate 6ºC/sec max Pb-Free Solder Paste Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations ("half vias") where they contact the host board should meet the appropriate IPC Specification. See the Castellated Terminations Section in the latest IPC-A-610 Acceptability of Electronic Assemblies document. Cleaning In general, cleaning the populated module is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. • Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. • Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step. Optical Inspection After soldering the module to the host board, consider optical inspection to check the following: • Proper alignment and centering of the module over the pads • Proper solder joints on all pads • Excessive solder or contacts to neighboring pads or vias Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards.
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 15 PRELIMINARY DATASHEET Wave Soldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged. Hand Soldering Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711). Rework The Cortet module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak reflow temperature of 250ºC. Caution If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to thermal shock. Avoid overheating. Warning Never attempt a rework on the module itself (i.e., replacing individual components); such actions will terminate warranty coverage. Additional Grounding Attempts to improve the module or the system grounding by soldering braids, wires or cables onto the module RF shield cover is done at the customer's own risk. The ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference.
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 16 PRELIMINARY DATASHEET AGENCY CERTIFICATIONS NOTE: Certifications are in process and pending final approval FCC Compliance Statement Part 15.19, Section 7.15 of RSS-GEN This device complies with Part 15 of the FCC Rules and with Industry Canada licence-exempt RSS Standards. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Warning (Part 15.21) Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment. 20cm Separation Distance To comply with FCC/IC RF exposure limits for general population/uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be co-located or operated in conjunction with any other antenna or transmitter. OEM Responsibility to the FCC and IC Rules and Regulations The Cortet Mini Module has been certified per FCC Part 15 Rules and to Industry Canada license exempt RSS Standards for integration into products without further testing or certification. To fulfill the FCC and IC certification requirements, the OEM of the Cortet Module must ensure that the information provided on the Cortet label is placed on the outside of the final product. The Cortet Mini Module is labeled with its own FCC ID number and IC ID number. If the FCC ID and the IC ID are not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. The exterior label can use wording such as the following “Contains Transmitter Module FCC ID: W7Z-WB4343S” “Contains Transmitter Module IC: 8254A-WB4343S" The OEM of the Cortet Mini Module may only use the approved antennas (PCB Trace Antenna) that have been certified with this module. The OEM of the Cortet Mini Module must test their final product configuration to comply with Unintentional Radiator Limits before declaring FCC Compliance per Part 15 of the FCC Rules. IC Certification — Industry Canada Statement The term "IC" before the certification/registration number only signifies that the Industry Canada technical specifications were met. Certification IC — Déclaration d'Industrie Canada Le terme "IC" devant le numéro de certification/d'enregistrement signifie seulement que les spécifications techniques Industrie Canada ont été respectées. Section 14 of RSS-210 The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php L'article 14 du CNR-210 Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou orientée de telle sorte qu'il ne pas émettre de champ RF au-delà des limites de Santé Canada pour la population générale. Consulter le Code de sécurité 6, disponible sur le site Web de Santé Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 17 PRELIMINARY DATASHEET SHIPMENT, HANDLING AND STORAGE Shipment The Cortet modules are delivered in reels of 600 units. The reel diameter is 12.992 inches (330mm). Handling The Cortet modules are designed and packaged to be processed in an automated assembly line. Warning The Cortet modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning The Cortet modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) MSL 3, per J-STD-033 Storage Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity. QUALITY CEL modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with the IPC-A-610 specification, Class II. Our modules go through JESD22 qualification processes which includes high temperature operating life tests, mechanical shock, temperature cycling, humidity and reflow testing. CEL builds the quality into our products, giving our customers confidence when integrating our products into their systems.
WB4343WFxSP2, W43364FxSP2 This document is subject to change without notice. Document No: 0021-00-07-00-000 (Issue B) 18 PRELIMINARY DATASHEET REVISION HISTORY Previous Versions Changes to Current Version Page(s) 0021-00-07-00-000 (Issue A) January 22, 2016 Initial Preliminary Data Sheet N/A 0021-00-07-00-000 (Issue B) May 23, 2016 Revisions to Entire Document N/A DISCLAIMER FOR MORE INFORMATION For more information about CEL Cortet products and solutions, visit our website at cortet.cel.com. TECHNICAL ASSISTANCE For Technical Assistance, visit cortet.cel.com/tech-support. The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL Data Sheets or Data Books, etc., for the most up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please check with a CEL sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information.

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