California Eastern Laboratories WD907102 Zigbee & BLE Module User Manual MeshConnect

California Eastern Laboratories Zigbee & BLE Module MeshConnect

Exhibit D Users Manual per 2 1033 b3

1 This document is subject to change without notice. Document No: 0020-00-07-00-000 (Issue A) Date Published: September 11, 2017 DESCRIPTION The ZB3212F6R4SP2 ZigBee, Thread, Bluetooth Smart Mini Modules feature the Silicon Labs EFR32MG12 single chip transceiver. These devices are footprint-compatible with CEL’s existing line of ZigBee-, Thread-, and Bluetooth-based modules, allowing for fast and simple performance upgrades via drop-in compatible hardware. The ZB3212F6R4SP2 Mini Modules are fully certified standalone solutions for designers looking to take advantage of the robustness of the Silicon Labs EmberZNet PRO™ stack while having the flexibility to interface to Bluetooth Smart-enabled devices previously deployed in the field. These modules eliminate design risk and significantly reduce time-to-market for a multitude of IoT applications. These EFR32-based devices are compatible with Silicon Labs’ Simplicity Studio development environment which includes an eclipse-based IDE, documentation, debug, energy management tools, and flashing tools. Simplicity Studio supports a multitude of sample applications for many common uses of the ERF32, accelerating the development proof-of-concept designs and demos. KEY FEATURES • Multi-Protocol Support in a Single Device: ZigBee 3.0, Thread, Bluetooth Smart 5.0 • Enhanced Memory 1MB Flash 256kB SRAM • Up to 24 Analog/Digital GPIOs, including SPI, USART, I2C, 12b ADC, iDAC, Comparators and Timers • Radiated Output power up to 20dBm • Two Antenna Configurations o Integrated PCB Trace Antenna o External Antenna Connections via 50Ω RF Castellation Port for development • Mini Footprint: 0.940” x 0.655” (23.9 x 16.6mm) • Footprint-compatible with CEL's Bluetooth, ZigBee, and Thread Module Family, Allowing for Fast and Simple Performance Upgrades • ZB3212F6R4SP2-1 Variant FCC, IC, Certified* for Usage Throughout North America and Canada * Official FCC & IC certifications are in process and pending final approval by the respective governmental bodies. APPLICATIONS • Connected Home & Appliances • Building Control & Automation • Lighting • Security • Wireless Sensor Networks • Wireless Audio & Video • Remote Health and Wellness Monitoring • General IoT Wireless Networking Zigbee®/Thread®/Bluetooth® Smart Mini Module ZB3212F6R4SP2-1, ZB3212F6R4SP2-1C Silicon Labs Mighty Gecko-Based Module PRELIMINARY DATASHEET Embedded Multi-Protocol IOT Module
This document is subject to change without notice. Document No: 0020-00-07-00-000 (Issue A) 2 PRELIMINARY DATASHEET ZB3212F6R4SP2 TABLE OF CONTENTS DESCRIPTION ...................................................................................................................................... 1 KEY FEATURES ..................................................................................................................................... 1 TABLE OF CONTENTS ........................................................................................................................... 2 BLOCK DIAGRAM................................................................................................................................. 3 ORDERING INFORMATION ................................................................................................................... 3 ANTENNA ............................................................................................................................................ 4 RECOMMENDED OPERATING CONDITIONS .......................................................................................... 4 DC CHARACTERISTICS .......................................................................................................................... 5 RF CHARACTERISTICS ........................................................................................................................... 5 I/O PIN ASSIGNMENTS ........................................................................................................................ 6 CEL MINI MODULE COMPATIBILITY...................................................................................................... 7 MODULE DIMENSIONS ........................................................................................................................ 7 MODULE LAND FOOTPRINT ................................................................................................................. 8 PROCESSING ....................................................................................................................................... 9 AGENCY CERTIFICATIONS ...................................................................................................................11 SHIPMENT, HANDLING AND STORAGE ................................................................................................12 QUALITY ............................................................................................................................................12 REVISION HISTORY .............................................................................................................................13 DISCLAIMER .......................................................................................................................................13
This document is subject to change without notice. Document No: 0020-00-07-00-000 (Issue A) 3 PRELIMINARY DATASHEET ZB3212F6R4SP2 BLOCK DIAGRAM ORDERING INFORMATION Order Number Description Min/Multiple ZB3212F6R4SP2-1-R Zigbee/Thread/BT Smart Module, EFR32MG12P433F1024GM48-C0 single chip transceiver + MCU (1MB flash, 256kB RAM), Trace Antenna 600 ZB3212F6R4SP2-1C-R Zigbee/Thread/BT Smart Module, EFR32MG12P433F1024GM48-C0 single chip transceiver + MCU (1MB flash, 256kB RAM), Castellation Pin for External Antenna. NOT FCC OR IC CERTIFIED. END USER MUST CERTIFY BEFORE PLACING ON THE MARKET. 600 EFR32MG12P432F1024GM48Radio TransceiverARM Cortex M4 LPF Antenna Match32 KHzCrystal38.4 MHz CrystalCortet ModuleEdgeCastellation2405 –2480MHzVCC GNDSPII2CTIMERUSARTADCGPIODEBUG
This document is subject to change without notice. Document No: 0020-00-07-00-000 (Issue A) 4 PRELIMINARY DATASHEET ZB3212F6R4SP2 ANTENNA The Cortet Mini Modules include an integrated Printed Circuit Board (PCB) trace antenna certified for FCC & IC requirements. An optional configuration which uses a castellation pin on the module allows the user to connect to an external antenna however this implementation would require certification by the end user and may not use the CEL FCC ID number on the label. The PCB antenna employs a topology that is compact and highly efficient. To maximize range, an adequate ground plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute significantly to the antenna performance. For optimum antenna performance, the Cortet Mini Module should be mounted with the PCB trace antenna overhanging the edge of the host board and ideally in the upper left corner of the host board so that free space is left of the module as opposed to additional pcb and components. To further improve performance, a ground plane may be placed on the host board under the module, up to the antenna but not extending under the antenna (a minimum of 1.5" x 1.5" is recommended). The installation of an uninterrupted ground plane on a layer directly beneath the module will also allow traces to be routed under the layer. Refer to the application note Mini Modules Hardware Design Guidelines for more details. CEL can assist with your PCB layout. The following are some design guidelines to help ensure optimal antenna performance: • The antenna portion of the Mini Module should hang over the host board so that there is not any additional PCB under the antenna. • Never place the antenna close to metallic objects • In the final assembly, ensure that wiring and other components are not placed near the antenna • Do not place the antenna in a metallic or metalized plastic enclosure • Keep plastic enclosures a minimum of 1cm away from the antenna in any direction Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. ABSOLUTE MAXIMUM RATINGS Description Min Max Unit Power Supply Voltage 0 3.8 V Voltage on any 5V Tolerant IO Line -0.3 Min of 5.25 and VDD+2 V Voltage on any non-5V Tolerant IO Line -0.3 VDD+0.3 V RF Input Power - 10 dBm Storage Temperature -50 150 °C Reflow Soldering Temperature - 260 °C RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit Power Supply Voltage 2.4 3.3 3.8 V Frequency 2405 2480 MHz Ambient Temperature Range -40 85 °C
This document is subject to change without notice. Document No: 0020-00-07-00-000 (Issue A) 5 PRELIMINARY DATASHEET ZB3212F6R4SP2 DC CHARACTERISTICS (@ 3.3VDC and 25°C unless otherwise specified) Item Condition Min Nom Max Unit Tx Mode: 2.4 GHz 19.5 dBm1 Continuously Modulated Carrier 120 mA Tx Mode: 2.4 GHz 10 dBm1 Continuously Modulated Carrier 55 mA Tx Mode: 2.4 GHz 0 dBm1 Continuously Modulated Carrier 18 mA Rx mode 802.15.4 12 mA Bluetooth Smart 12 mA Sleep Modes EM1 all peripherals disabled 65 µA/MHz EM2 deep sleep mode 2.8 µA EM3 stop mode 2.7 µA EM4 Hibernate mode 0.62 µA 1. Power referenced at the IC output. RF CHARACTERISTICS TRANSMITTER Item Condition Nom Unit Maximum Radiated TX Power 3.8 V supply 20 dBm Minimum TX Power Power Setting -20 or less -25 dBm Frequency Range 2400 - 2483.5 MHz The RF performance reported above assumes a default supply voltage of 3.3V unless otherwise noted. RECEIVER Item Condition Nom Unit 1% PER 802.15.4 250kbps -101 dBm 1 % PER Sensitivity 2Mbps 2GFSK signal -89.2 dBm 0.1 % BER Sensitivity 250kbps 2GFSK signal -99.1 dBm Frequency Range 2400 - 2483.5 MHz
This document is subject to change without notice. Document No: 0020-00-07-00-000 (Issue A) 6 PRELIMINARY DATASHEET ZB3212F6R4SP2 I/O PIN ASSIGNMENTS Refer to the STM32 datasheet for pin functionality details. Module Pin Number Pin Name Notes 1, 2, 12, 31, 33 GND 3 PA0 4 Reset 5 PA1 6 PA2 7 PA3 8 PA5/US0_SCLK/CTS 9 PB11/US0_CS/RTS 10 PB12/US1_TX 11 PB13/Wake/US1_RX/I2C0_SDA 13 VCC Input power to the module. 14 PC6/I2C0_SCL/US1_CLK 15 PC7/US1_CS 16 PC8 17 PC9 18 PC10/ 19 PC11/I2C0_SDA/US0_TX 20 PF4/I2C0_SCL/US0_RX 21 PF0/JTCK/SWCLK 22 PF2/JTDO/SWO 23 PF3/JTDI 24 PF1/JTMS/SWDIO 25 PF5 26 PF6/APBY/APAX Could be A/D or GPIO 27 PF7 28 PD13/APCY/APDX Could be A/D or GPIO 29 PD14/APDY/APCX Could be A/D or GPIO 30 PD15/APCY/APDX Could be A/D or GPIO 32 RF OUT Castellation Pin for External Antenna
This document is subject to change without notice. Document No: 0020-00-07-00-000 (Issue A) 7 PRELIMINARY DATASHEET ZB3212F6R4SP2 CEL MINI MODULE COMPATIBILITY The geometry of the land pattern and location of the RF castellations is identical to CEL’s ZICM35x family of ZigBee/Thread and B1010 Bluetooth Smart Mini Modules. The digital and analog mapping to develop a drop-in compatible solution is described below: Pin # Function ZICM35x B1010 ZB3212F6R4SP2 4 Reset RESET N/C RESET 7 Wake PA7 WAKE PA3 8, 9, 19, 20 Serial Controller 1 UART/SPI/I2C Two wire UART/I2C USART/I2C 10, 11, 14, 15 Serial Controller 2 SPI/I2C I2C SPI/I2C 16, 17, 21, 22, 23, 24, 27 Debug & Programming Debug & Programming Debug & Programming Debug & Programming 28, 30 ADC PB7, PB5 AIO[1], AIO[2] PD13, PD15 29 Timer PB6 PIO[11] PD14 MODULE DIMENSIONS
This document is subject to change without notice. Document No: 0020-00-07-00-000 (Issue A) 8 PRELIMINARY DATASHEET ZB3212F6R4SP2 MODULE LAND FOOTPRINT
This document is subject to change without notice. Document No: 0020-00-07-00-000 (Issue A) 9 PRELIMINARY DATASHEET ZB3212F6R4SP2 PROCESSING Recommended Reflow Profile Parameter Values Ramp Up Rate (from Tsoakmax to Tpeak) 3º/sec max Minimum Soak Temperature 150ºC Maximum Soak Temperature 200ºC Soak Time 60-120 sec TLiquidus 217ºC Time above TLiquidus 60-150 sec Tpeak 250ºC Time within 5º of Tpeak 20-30 sec Time from 25º to Tpeak 8 min max Ramp Down Rate 6ºC/sec max Pb-Free Solder Paste Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process. Note: The quality of solder joints on the castellations ("half vias") where they contact the host board should meet the appropriate IPC Specification. See the Castellated Terminations Section in the latest IPC-A-610 Acceptability of Electronic Assemblies document. Cleaning In general, cleaning the populated module is strongly discouraged. Residuals under the module cannot be easily removed with any cleaning process. • Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads. Water could also damage any stickers or labels. • Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels. • Ultrasonic cleaning could damage the module permanently. The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step. Optical Inspection After soldering the module to the host board, consider optical inspection to check the following: • Proper alignment and centering of the module over the pads • Proper solder joints on all pads • Excessive solder or contacts to neighboring pads or vias Repeating Reflow Soldering Only a single reflow soldering process is encouraged for host boards.
This document is subject to change without notice. Document No: 0020-00-07-00-000 (Issue A) 10 PRELIMINARY DATASHEET ZB3212F6R4SP2 Wave Soldering If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering process is encouraged. Hand Soldering Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711). Rework The Cortet module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak reflow temperature of 250ºC. Caution If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to thermal shock. Avoid overheating. Warning Never attempt a rework on the module itself (i.e., replacing individual components); such actions will terminate warranty coverage. Additional Grounding Attempts to improve the module or the system grounding by soldering braids, wires or cables onto the module RF shield cover is done at the customer's own risk. The ground pins at the module perimeter should be sufficient for optimum immunity to external RF interference.
This document is subject to change without notice. Document No: 0020-00-07-00-000 (Issue A) 11 PRELIMINARY DATASHEET ZB3212F6R4SP2 AGENCY CERTIFICATIONS NOTE: Certifications are in process and pending final approval FCC Compliance Statement Part 15.19, Section 7.15 of RSS-GEN This device complies with Part 15 of the FCC Rules and with Industry Canada licence-exempt RSS Standards. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. Warning (Part 15.21) Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment. 20cm Separation Distance To comply with FCC/IC RF exposure limits for general population/uncontrolled exposure, the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be operated in conjunction with any other antenna or transmitter. OEM Responsibility to the FCC and IC Rules and Regulations The Cortet Mini Module has been certified per FCC Part 15 Rules and to Industry Canada license exempt RSS Standards for integration into products without further testing or certification. To fulfill the FCC and IC certification requirements, the OEM of the Cortet Module must ensure that the information provided on the Cortet label is placed on the outside of the final product. The Cortet Mini Module is labeled with its own FCC ID number and IC ID number. If the FCC ID and the IC ID are not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. The exterior label can use wording such as the following “Contains Transmitter Module FCC ID: W7Z-WB4343S” “Contains Transmitter Module IC: 8254A-WB4343S" The OEM of the Cortet Mini Module may only use the approved antennas (PCB Trace Antenna) that have been certified with this module. The OEM of the Cortet Mini Module must test their final product configuration to comply with Unintentional Radiator Limits before declaring FCC Compliance per Part 15 of the FCC Rules. IC Certification — Industry Canada Statement The term "IC" before the certification/registration number only signifies that the Industry Canada technical specifications were met. Certification IC — Déclaration d'Industrie Canada Le terme "IC" devant le numéro de certification/d'enregistrement signifie seulement que les spécifications techniques Industrie Canada ont été respectées. Section 14 of RSS-210 The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php L'article 14 du CNR-210 Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou orientée de telle sorte qu'il ne pas émettre de champ RF au-delà des limites de Santé Canada pour la population générale. Consulter le Code de sécurité 6, disponible sur le site Web de Santé Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php
This document is subject to change without notice. Document No: 0020-00-07-00-000 (Issue A) 12 PRELIMINARY DATASHEET ZB3212F6R4SP2 SHIPMENT, HANDLING AND STORAGE Shipment The Cortet modules are delivered in reels of 600 units. The reel diameter is 12.992 inches (330mm). Handling The Cortet modules are designed and packaged to be processed in an automated assembly line. Warning The Cortet modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage the module permanently. Warning The Cortet modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake. Moisture Sensitivity Level (MSL) MSL 3, per J-STD-033 Storage Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity. QUALITY CEL modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with the IPC-A-610 specification, Class II. Our modules go through JESD22 qualification processes which includes high temperature operating life tests, mechanical shock, temperature cycling, humidity and reflow testing. CEL builds the quality into our products, giving our customers confidence when integrating our products into their systems.
This document is subject to change without notice. Document No: 0020-00-07-00-000 (Issue A) 13 PRELIMINARY DATASHEET ZB3212F6R4SP2 REVISION HISTORY Previous Versions Changes to Current Version Page(s) 0020-00-07-00-000 (Issue A) September 2017 Initial Preliminary Data Sheet N/A DISCLAIMER FOR MORE INFORMATION For more information about CEL Cortet products and solutions, visit our website at cortet.cel.com. TECHNICAL ASSISTANCE For Technical Assistance, visit cortet.cel.com/tech-support. The information in this document is current as of the published date. The information is subject to change without notice. For actual design-in, refer to the latest publications of CEL Data Sheets or Data Books, etc., for the most up-to-date specifications of CEL products. Not all products and/or types are available in every country. Please check with a CEL sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL. CEL assumes no responsibility for any errors that may appear in this document. CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information.

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