California Eastern Laboratories WD907102 Zigbee & BLE Module User Manual MeshConnect
California Eastern Laboratories Zigbee & BLE Module MeshConnect
Exhibit D Users Manual per 2 1033 b3
| Download: |  |
| Mirror Download [FCC.gov] | |
| Document ID | 3593475 |
| Application ID | 0TAWbYhNyuti2vYQ3+wUiw== |
| Document Description | Exhibit D Users Manual per 2 1033 b3 |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 36.02kB (450214 bits) |
| Date Submitted | 2017-10-05 00:00:00 |
| Date Available | 2017-10-05 00:00:00 |
| Creation Date | 2017-09-13 13:35:52 |
| Producing Software | Adobe PDF Library 11.0 |
| Document Lastmod | 2017-09-13 13:35:55 |
| Document Title | MeshConnect |
| Document Creator | Acrobat PDFMaker 11 for Word |
| Document Author: | Fabian Cuevas |
PRELIMINARY DATASHEET
Zigbee®/Thread®/Bluetooth® Smart Mini Module
ZB3212F6R4SP2-1, ZB3212F6R4SP2-1C
Silicon Labs Mighty Gecko-Based Module
Embedded Multi-Protocol IOT Module
DESCRIPTION
The ZB3212F6R4SP2 ZigBee, Thread, Bluetooth Smart Mini Modules
feature the Silicon Labs EFR32MG12 single chip transceiver. These
devices are footprint-compatible with CEL’s existing line of ZigBee-,
Thread-, and Bluetooth-based modules, allowing for fast and simple
performance upgrades via drop-in compatible hardware.
The ZB3212F6R4SP2 Mini Modules are fully certified standalone
solutions for designers looking to take advantage of the robustness of
the Silicon Labs EmberZNet PRO™ stack while having the flexibility
to interface to Bluetooth Smart-enabled devices previously deployed
in the field. These modules eliminate design risk and significantly
reduce time-to-market for a multitude of IoT applications.
These EFR32-based devices are compatible with Silicon Labs’
Simplicity Studio development environment which includes an eclipsebased IDE, documentation, debug, energy management tools, and
flashing tools. Simplicity Studio supports a multitude of sample
applications for many common uses of the ERF32, accelerating the
development proof-of-concept designs and demos.
APPLICATIONS
KEY FEATURES
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Multi-Protocol Support in a Single Device:
ZigBee 3.0, Thread, Bluetooth Smart 5.0
Enhanced Memory
1MB Flash
256kB SRAM
Up to 24 Analog/Digital GPIOs, including SPI,
USART, I2C, 12b ADC, iDAC, Comparators and
Timers
Radiated Output power up to 20dBm
Two Antenna Configurations
o Integrated PCB Trace Antenna
o External Antenna Connections via 50Ω RF
Castellation Port for development
Mini Footprint: 0.940” x 0.655” (23.9 x 16.6mm)
Footprint-compatible with CEL's Bluetooth, ZigBee,
and Thread Module Family, Allowing for Fast and
Simple Performance Upgrades
ZB3212F6R4SP2-1 Variant FCC, IC, Certified* for
Usage Throughout North America and Canada
* Official FCC & IC certifications are in process and
pending final approval by the respective
governmental bodies.
This document is subject to change without notice.
Document No: 0020-00-07-00-000 (Issue A)
Date Published: September 11, 2017
Connected Home & Appliances
Building Control & Automation
Lighting
Security
Wireless Sensor Networks
Wireless Audio & Video
Remote Health and Wellness Monitoring
General IoT Wireless Networking
PRELIMINARY DATASHEET
ZB3212F6R4SP2
TABLE OF CONTENTS
DESCRIPTION ...................................................................................................................................... 1
KEY FEATURES ..................................................................................................................................... 1
TABLE OF CONTENTS ........................................................................................................................... 2
BLOCK DIAGRAM................................................................................................................................. 3
ORDERING INFORMATION................................................................................................................... 3
ANTENNA............................................................................................................................................ 4
RECOMMENDED OPERATING CONDITIONS .......................................................................................... 4
DC CHARACTERISTICS .......................................................................................................................... 5
RF CHARACTERISTICS........................................................................................................................... 5
I/O PIN ASSIGNMENTS ........................................................................................................................ 6
CEL MINI MODULE COMPATIBILITY...................................................................................................... 7
MODULE DIMENSIONS ........................................................................................................................ 7
MODULE LAND FOOTPRINT ................................................................................................................. 8
PROCESSING ....................................................................................................................................... 9
AGENCY CERTIFICATIONS ...................................................................................................................11
SHIPMENT, HANDLING AND STORAGE ................................................................................................12
QUALITY ............................................................................................................................................12
REVISION HISTORY .............................................................................................................................13
DISCLAIMER .......................................................................................................................................13
This document is subject to change without notice.
Document No: 0020-00-07-00-000 (Issue A)
PRELIMINARY DATASHEET
ZB3212F6R4SP2
BLOCK DIAGRAM
Cortet Module
VCC
GND
SPI
I2C
TIMER
USART
ADC
GPIO
2405 – 2480
M Hz
EFR32MG12P432F1024GM48
ARM Cortex M4
Radio Transceiver
LPF
Antenna Match
DEBUG
Edge
Castellation
38.4 MHz
Crystal
32 KHz
Crystal
ORDERING INFORMATION
Order Number
ZB3212F6R4SP2-1-R
ZB3212F6R4SP2-1C-R
Description
Zigbee/Thread/BT Smart Module, EFR32MG12P433F1024GM48-C0
single chip transceiver + MCU (1MB flash, 256kB RAM), Trace Antenna
Zigbee/Thread/BT Smart Module, EFR32MG12P433F1024GM48-C0
single chip transceiver + MCU (1MB flash, 256kB RAM), Castellation Pin
for External Antenna. NOT FCC OR IC CERTIFIED. END USER MUST CERTIFY BEFORE
PLACING ON THE MARKET.
This document is subject to change without notice.
Document No: 0020-00-07-00-000 (Issue A)
Min/Multiple
600
600
PRELIMINARY DATASHEET
ZB3212F6R4SP2
ANTENNA
The Cortet Mini Modules include an integrated Printed Circuit Board (PCB) trace antenna certified for FCC & IC requirements.
An optional configuration which uses a castellation pin on the module allows the user to connect to an external antenna however
this implementation would require certification by the end user and may not use the CEL FCC ID number on the label. The PCB
antenna employs a topology that is compact and highly efficient. To maximize range, an adequate ground plane must be
provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute significantly to the antenna
performance.
For optimum antenna performance, the Cortet Mini Module should be mounted with the PCB trace antenna overhanging the
edge of the host board and ideally in the upper left corner of the host board so that free space is left of the module as opposed to
additional pcb and components. To further improve performance, a ground plane may be placed on the host board under the
module, up to the antenna but not extending under the antenna (a minimum of 1.5" x 1.5" is recommended). The installation of
an uninterrupted ground plane on a layer directly beneath the module will also allow traces to be routed under the layer. Refer to
the application note Mini Modules Hardware Design Guidelines for more details. CEL can assist with your PCB layout.
The following are some design guidelines to help ensure optimal antenna performance:
The antenna portion of the Mini Module should hang over the host board so that there is not any additional
•
PCB under the antenna.
Never place the antenna close to metallic objects
•
In the final assembly, ensure that wiring and other components are not placed near the antenna
•
Do not place the antenna in a metallic or metalized plastic enclosure
•
Keep plastic enclosures a minimum of 1cm away from the antenna in any direction
•
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and
its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication.
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
ABSOLUTE MAXIMUM RATINGS
Description
Min
Max
Unit
3.8
Voltage on any 5V Tolerant IO Line
-0.3
Min of
5.25 and
VDD+2
Voltage on any non-5V Tolerant IO Line
-0.3
VDD+0.3
10
dBm
Power Supply Voltage
RF Input Power
Storage Temperature
-50
150
°C
260
°C
Min
Typ
Max
Unit
2.4
3.3
3.8
2405
2480
MHz
-40
85
°C
Reflow Soldering Temperature
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Power Supply Voltage
Frequency
Ambient Temperature Range
This document is subject to change without notice.
Document No: 0020-00-07-00-000 (Issue A)
PRELIMINARY DATASHEET
ZB3212F6R4SP2
DC CHARACTERISTICS
(@ 3.3VDC and 25°C unless otherwise specified)
Item
Condition
Tx Mode: 2.4 GHz 19.5
Tx Mode: 2.4 GHz 10
dBm1
dBm1
Tx Mode: 2.4 GHz 0 dBm1
Rx mode
Sleep Modes
Min
Nom
Max
Unit
Continuously Modulated Carrier
120
mA
Continuously Modulated Carrier
55
mA
Continuously Modulated Carrier
18
mA
802.15.4
12
mA
Bluetooth Smart
12
mA
EM1 all peripherals disabled
65
µA/MHz
EM2 deep sleep mode
2.8
µA
EM3 stop mode
2.7
µA
EM4 Hibernate mode
0.62
µA
1. Power referenced at the IC output.
RF CHARACTERISTICS
TRANSMITTER
Item
Condition
Maximum Radiated TX Power
3.8 V supply
Minimum TX Power
Power Setting -20 or less
Frequency Range
Nom
Unit
20
dBm
-25
dBm
2400 - 2483.5
MHz
Nom
Unit
The RF performance reported above assumes a default supply voltage of 3.3V unless otherwise noted.
RECEIVER
Item
Condition
1% PER 802.15.4
250kbps
-101
dBm
1 % PER Sensitivity
2Mbps 2GFSK signal
-89.2
dBm
0.1 % BER Sensitivity
250kbps 2GFSK signal
-99.1
dBm
2400 - 2483.5
MHz
Frequency Range
This document is subject to change without notice.
Document No: 0020-00-07-00-000 (Issue A)
PRELIMINARY DATASHEET
I/O PIN ASSIGNMENTS
Refer to the STM32 datasheet for pin functionality details.
Module Pin
Number
Pin Name
1, 2, 12, 31,
33
GND
PA0
Reset
PA1
PA2
PA3
PA5/US0_SCLK/CTS
PB11/US0_CS/RTS
10
PB12/US1_TX
11
PB13/Wake/US1_RX/I2C0_SDA
13
VCC
14
PC6/I2C0_SCL/US1_CLK
15
PC7/US1_CS
16
PC8
17
PC9
Notes
Input power to the module.
18
PC10/
19
PC11/I2C0_SDA/US0_TX
20
PF4/I2C0_SCL/US0_RX
21
PF0/JTCK/SWCLK
22
PF2/JTDO/SWO
23
PF3/JTDI
24
PF1/JTMS/SWDIO
25
PF5
26
PF6/APBY/APAX
27
PF7
28
PD13/APCY/APDX
Could be A/D or GPIO
29
PD14/APDY/APCX
Could be A/D or GPIO
30
PD15/APCY/APDX
Could be A/D or GPIO
32
RF OUT
Castellation Pin for External Antenna
This document is subject to change without notice.
Document No: 0020-00-07-00-000 (Issue A)
Could be A/D or GPIO
ZB3212F6R4SP2
PRELIMINARY DATASHEET
ZB3212F6R4SP2
CEL MINI MODULE COMPATIBILITY
The geometry of the land pattern and location of the RF castellations is identical to CEL’s ZICM35x family of ZigBee/Thread and
B1010 Bluetooth Smart Mini Modules. The digital and analog mapping to develop a drop-in compatible solution is described
below:
Pin #
8, 9, 19, 20
10, 11, 14,
15
16, 17, 21,
22, 23, 24,
27
28, 30
29
Function
Reset
Wake
Serial Controller 1
Serial Controller 2
ZICM35x
RESET
PA7
UART/SPI/I2C
SPI/I2C
B1010
N/C
WAKE
Two wire UART/I2C
I2C
ZB3212F6R4SP2
RESET
PA3
USART/I2C
SPI/I2C
Debug &
Programming
Debug &
Programming
Debug &
Programming
Debug &
Programming
ADC
Timer
PB7, PB5
PB6
AIO[1], AIO[2]
PIO[11]
PD13, PD15
PD14
MODULE DIMENSIONS
This document is subject to change without notice.
Document No: 0020-00-07-00-000 (Issue A)
PRELIMINARY DATASHEET
MODULE LAND FOOTPRINT
This document is subject to change without notice.
Document No: 0020-00-07-00-000 (Issue A)
ZB3212F6R4SP2
PRELIMINARY DATASHEET
ZB3212F6R4SP2
PROCESSING
Recommended Reflow Profile
Parameter Values
Ramp Up Rate (from Tsoakmax to Tpeak)
3º/sec max
Minimum Soak Temperature
150ºC
Maximum Soak Temperature
200ºC
Soak Time
60-120 sec
TLiquidus
217ºC
Time above TLiquidus
60-150 sec
Tpeak
250ºC
Time within 5º of Tpeak
20-30 sec
Time from 25º to Tpeak
8 min max
Ramp Down Rate
6ºC/sec max
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations ("half vias") where they contact the host board should meet the
appropriate IPC Specification. See the Castellated Terminations Section in the latest IPC-A-610 Acceptability of Electronic
Assemblies document.
Cleaning
In general, cleaning the populated module is strongly discouraged. Residuals under the module cannot be easily removed with
any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host
board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits
between neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two
housings, which is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads
• Proper solder joints on all pads
• Excessive solder or contacts to neighboring pads or vias
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
This document is subject to change without notice.
Document No: 0020-00-07-00-000 (Issue A)
PRELIMINARY DATASHEET
ZB3212F6R4SP2
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave soldering
process is encouraged.
Hand Soldering
Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711).
Rework
The Cortet module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder
joint and module should not exceed the maximum peak reflow temperature of 250ºC.
Caution
If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to thermal shock.
Avoid overheating.
Warning
Never attempt a rework on the module itself (i.e., replacing individual components); such actions will terminate warranty coverage.
Additional Grounding
Attempts to improve the module or the system grounding by soldering braids, wires or cables onto the module RF shield cover is
done at the customer's own risk. The ground pins at the module perimeter should be sufficient for optimum immunity to external
RF interference.
This document is subject to change without notice.
Document No: 0020-00-07-00-000 (Issue A)
10
PRELIMINARY DATASHEET
ZB3212F6R4SP2
AGENCY CERTIFICATIONS
NOTE: Certifications are in process and pending final approval
FCC Compliance Statement Part 15.19, Section 7.15 of RSS-GEN
This device complies with Part 15 of the FCC Rules and with Industry Canada licence-exempt RSS Standards. Operation is
subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired operation.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.
Warning (Part 15.21)
Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment.
20cm Separation Distance
To comply with FCC/IC RF exposure limits for general population/uncontrolled exposure, the antenna(s) used for this transmitter
must be installed to provide a separation distance of at least 20cm from all persons and must not be operated in conjunction with
any other antenna or transmitter.
OEM Responsibility to the FCC and IC Rules and Regulations
The Cortet Mini Module has been certified per FCC Part 15 Rules and to Industry Canada license exempt RSS Standards for
integration into products without further testing or certification. To fulfill the FCC and IC certification requirements, the OEM of the
Cortet Module must ensure that the information provided on the Cortet label is placed on the outside of the final product. The
Cortet Mini Module is labeled with its own FCC ID number and IC ID number. If the FCC ID and the IC ID are not visible when
the module is installed inside another device, then the outside of the device into which the module is installed must also display a
label referring to the enclosed module. The exterior label can use wording such as the following
“Contains Transmitter Module FCC ID: W7Z-WB4343S”
“Contains Transmitter Module IC: 8254A-WB4343S"
The OEM of the Cortet Mini Module may only use the approved antennas (PCB Trace Antenna) that have been certified with this
module. The OEM of the Cortet Mini Module must test their final product configuration to comply with Unintentional Radiator
Limits before declaring FCC Compliance per Part 15 of the FCC Rules.
IC Certification — Industry Canada Statement
The term "IC" before the certification/registration number only signifies that the Industry Canada technical specifications were
met.
Certification IC — Déclaration d'Industrie Canada
Le terme "IC" devant le numéro de certification/d'enregistrement signifie seulement que les spécifications techniques Industrie
Canada ont été respectées.
Section 14 of RSS-210
The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF field in
excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's website:
http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php
L'article 14 du CNR-210
Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou orientée de telle sorte qu'il ne
pas émettre de champ RF au-delà des limites de Santé Canada pour la population générale. Consulter le Code de sécurité 6,
disponible sur le site Web de Santé Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/radio_guide-lignes_direct-eng.php
This document is subject to change without notice.
Document No: 0020-00-07-00-000 (Issue A)
11
PRELIMINARY DATASHEET
ZB3212F6R4SP2
SHIPMENT, HANDLING AND STORAGE
Shipment
The Cortet modules are delivered in reels of 600 units. The reel diameter is 12.992 inches (330mm).
Handling
The Cortet modules are designed and packaged to be processed in an automated assembly line.
Warning
The Cortet modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may destroy or damage
the module permanently.
Warning
The Cortet modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized in J-STD033. Read carefully to prevent permanent damage due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.
QUALITY
CEL modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with the IPC-A-610
specification, Class II. Our modules go through JESD22 qualification processes which includes high temperature operating life
tests, mechanical shock, temperature cycling, humidity and reflow testing.
CEL builds the quality into our products, giving our customers confidence when integrating our products into their systems.
This document is subject to change without notice.
Document No: 0020-00-07-00-000 (Issue A)
12
PRELIMINARY DATASHEET
ZB3212F6R4SP2
REVISION HISTORY
Previous Versions
0020-00-07-00-000
(Issue A) September 2017
Changes to Current Version
Initial Preliminary Data Sheet
Page(s)
N/A
DISCLAIMER
The information in this document is current as of the published date. The information is subject to change without notice. For actual
design-in, refer to the latest publications of CEL Data Sheets or Data Books, etc., for the most up-to-date specifications of CEL products.
Not all products and/or types are available in every country. Please check with a CEL sales representative for availability and additional
information.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL.
CEL assumes no responsibility for any errors that may appear in this document.
CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising
from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express,
implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor
product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s
equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by customers
or third parties arising from the use of these circuits, software and information.
FOR MORE INFORMATION
For more information about CEL Cortet products and solutions, visit our website at cortet.cel.com.
TECHNICAL ASSISTANCE
For Technical Assistance, visit cortet.cel.com/tech-support.
This document is subject to change without notice.
Document No: 0020-00-07-00-000 (Issue A)
13
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