Chongqing Jinou Science and Technology Development BLE0305C2P Bluetooth Low Energy Module (BLE) User Manual BLE0305C2P

Chongqing Jinou Science & Technology Development Co., Ltd. Bluetooth Low Energy Module (BLE) BLE0305C2P

user manual

ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page i of 18 目录 FCC ID: SI8-BLE0305C2P Product: Bluetooth Low Energy Module（BLE） Model(s): BLE0305C2P Revision History .......................................................................................................................................... i1.Features ......................................................................................................................................... 12.Product Description ................................................................................................................... 13.Block Diagram ............................................................................................................................... 14.Pin Descriptions ......................................................................................................................... 25.Electrical Specifications ....................................................................................................... 45.1.Absolute Maximum ratings ................................................................................................. 45.2.Recommended Operating Conditions ................................................................................. 45.3.Electrical Characteristics ............................................................................................. 46.Radio Characteristics ............................................................................................................... 66.1.General Radio Characteristics ....................................................................................... 66.2.Radio current consumption (Transmitter) ................................................................... 66.3.Radio current consumption (Receiver) ......................................................................... 66.4.Transmitter specification ............................................................................................... 76.5.Receiver operation ............................................................................................................. 76.6.selectivity ........................................................................................................................... 76.7.RX intermodulation ............................................................................................................. 86.8.Radio timing ......................................................................................................................... 86.9.Received Signal Strength Indicator (RSSI) specifications ................................. 86.10.Jitter ..................................................................................................................................... 96.11.Delay when disabling the RADIO ..................................................................................... 97.NFCT - Near field communication tag ................................................................................... 97.1.NFCT Timing Parameters ..................................................................................................... 97.2.NFCT Timing Parameters ..................................................................................................... 98.SAADC - Successive approximation analog-todigital converter ................................. 108.1.Reference ............................................................................................................................. 108.2.Acquisition time ............................................................................................................... 108.3.Limits event monitoring ................................................................................................. 108.4.SAADC Electrical Specification ................................................................................... 119.Physical Dimensions ................................................................................................................. 1410.Solder Profiles ......................................................................................................................... 1510.1.Solder Re-Flow Profile for Devices with Lead-Free Solder Balls .................... 15 Revision History Revision Date Description/Changes 1.0 2018-05-30 First release (Added / Changes / Merged / Deleted)
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 1 of 18 1. Features  Surface-mount, Size: 15.24mm×26.035mm = 600mil×1025mil 2. Product Description For more information on Jinou’s wireless platform solutions for Bluetooth, see Jinou's homepage(www.jinoux.com). 3. Block Diagram
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 2 of 18 4. Pin Descriptions Device Terminal Functions(设备接线端列表) 序号 说明 说明 序号1 GND GND 38 2 P25 P24 37 3 P26 P23 36 4 P27 P22 35 5 P28 SWD 34 6 P29 SWC 33 7 P30 P21 32 8 P31 P20 31 9 P02 P19 30 10 P03 P18 29 11 P04 P17 28 12 P05 P16 27 13 VCC P15 26 14 GND P14 25 15 16 17 18 19 20 21 22 23 24 GND VCC P06 P07 P08 P09 P10 P11 P12 P13 Device Terminal Functions(设备接线端功能描述) No. Name Type Description P00 XL1 Digital I/O Analog input General purpose I/O Connection for 32.768 kHz crystal (LFXO) P01 XL2 Digital I/O Analog input General purpose I/O Connection for 32.768 kHz crystal (LFXO) P02 AIN0 Digital I/O Analog input General purpose I/O SAADC/COMP/LPCOMP input P03 AIN1 Digital I/O Analog input General purpose I/O SAADC/COMP/LPCOMP input P04 AIN2 Digital I/O Analog input General purpose I/O SAADC/COMP/LPCOMP input P05 AIN3 Digital I/O Analog input General purpose I/O SAADC/COMP/LPCOMP input P06 Digital I/O General purpose I/O P07 Digital I/O General purpose I/O P08 Digital I/O General purpose I/O NFC1 P09 NFC input Digital I/O NFC antenna connection General purpose I/O**1 NFC2 P10 NFC input Digital I/O NFC antenna connection General purpose I/O**1 P11 Digital I/O General purpose I/O P12 Digital I/O General purpose I/O P13 Digital I/O General purpose I/O P14 TRACEDATA[3] Digital I/O General purpose I/O Trace port output P15 TRACEDATA[2] Digital I/O General purpose I/O Trace port output P16 TRACEDATA[1] Digital I/O General purpose I/O Trace port output P17 Digital I/O General purpose I/O P18 TRACEDATA[0] / SWO Digital I/O General purpose I/O Trace port output / Single wire output P19 Digital I/O General purpose I/O P20 Digital I/O General purpose I/O
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 3 of 18 TRACECLK Trace port clock output P0.21 nRESET Digital I/O General purpose I/O Configurable as pin reset P22 Digital I/O General purpose I/O P23 Digital I/O General purpose I/O P24 Digital I/O General purpose I/O P25 Digital I/O General purpose I/O P26 Digital I/O General purpose I/O P27 Digital I/O General purpose I/O P0.28 AIN4 Digital I/O Analog input General purpose I/O**2 SAADC/COMP/LPCOMP input P0.29 AIN5 Digital I/O Analog input General purpose I/O**2 SAADC/COMP/LPCOMP input P0.30 AIN6 Digital I/O Analog input General purpose I/O**2 SAADC/COMP/LPCOMP input P0.31 AIN7 Digital I/O Analog input General purpose I/O**2 SAADC/COMP/LPCOMP input SWDCLK OR SWC Digital input Serial wire debug clock input for debug and programming SWDIO OR SWD Digital I/O Serial wire debug I/O for debug and programming VCC Power Ground GND Power Power supply **1 See GPIO located near the radio for more information. **2 See NFC antenna pins for more information. 1 GPIO located near the radio Radio performance parameters, such as sensitivity, may be affected by high frequency digital I/O with large sink/source current close to the Radio power supply and antenna pins. Table 5: GPIO recommended usage for module identify some GPIO that have recommended usage guidelines to maximize radio performance in an application. Table 5: GPIO recommended usage for module Recommended usage Low drive, low frequency I/O only. Included GPIO P22, P23, P24, P25, P26, P27, P28, P29, P30, P31. 2 NFC antenna pins Two physical pins can be configured either as NFC antenna pins (factory default), or as GPIOs, as shown below. NFC pad name GPIO NFC1 P09 NFC2 P10 When configured as NFC antenna pins, the GPIOs on those pins will automatically be set to DISABLE state and a protection circuit will be enabled preventing the chip from being damaged in the presence of a strong NFC field. The protection circuit will short the two pins together if voltage difference exceeds approximately 2V. For information on how to configure these pins as normal GPIOs, see NFCT — Near field communication tag on page 416 and UICR — User information configuration registers on page 54. Note that the device will not be protected against strong NFC field damage if the pins are configured as GPIO and an NFC antenna is connected to the device. The pins will always be configured as NFC pins during power-on reset until the configuration is set according to the UICR register. These two pins will have some limitations when configured as GPIO. The pin capacitance will be higher on these pins, and there is some current leakage between the two pins if they are driven to different logical values. To avoid leakage between the pins when configured as GPIO, these GPIOs should always be at the same logical value whenever entering one of the device power saving modes. See Electrical specification.
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 4 of 18 5. Electrical Specifications 5.1. Absolute Maximum ratings Maximum ratings are the extreme limits to which the chip can be exposed for a limited amount of time without permanently damaging it. Exposure to absolute maximum ratings for prolonged periods of time may affect the reliability of the device. Min Max Unit Supply voltages VCC -0.3 +3.9 V GND 0 V I/O pin voltage VI/O, VCC ≤3.6 V -0.3 VCC+0.3V V VI/O, VCC >3.6 V -0.3 3.9 V NFC antenna pin current INFC1/2 80 mA Radio RF input level 10 dBm Storage temperature -40 +125 ℃ MSL (moisture sensitivity level) 2 ESD HBM (human body model) 4000 V ESD CDM (charged device model) 1000 V Flash memory Endurance (Write/Erase cycles) 10000 Retention (at 40℃) 10 years 5.2. Recommended Operating Conditions Parameter Min Type Max UnitVoltage at POWER pin(VCC) 2.7 3.3 3.6 V Voltage at digital pins(P00 – P31) -0.3 - VCC+0.3V V Abs(NFC1 – NFC2) 2 V Operating temperature -40 25 85 ℃ 5.3. Electrical Characteristics GPIO Electrical Specification Symbol Description Min Typ Max UnitsVIH Input high voltage 0.7* VCC VCC V VIL Input low voltage GND 0.3*VCC V VOH,HDH Output high voltage, high drive, 5 mA, VCC >= 2.7 V VCC-0.4 VCC V VOL,HDH Output low voltage, high drive, 5 mA, VCC >= 2.7 V GND GND+0.4 V IOL,HDH Current at GND+0.4 V, output set low, high drive, VCC >= 2.7 V 6 10 15 mA IOH,HDH Current at VCC-0.4 V, output set high, high drive, VCC >= 2.7 V 6 9 14 mA tRF,15pF Rise/fall time, low drive mode, 10-90%, 15 pF load1 9 nS tRF,25pF Rise/fall time, low drive mode, 10-90%, 25 pF load1 13 nS tRF,50pF Rise/fall time, low drive mode, 10-90%, 50 pF load1 25 nS tHRF,15pF Rise/Fall time, high drive mode, 10-90%, 15 pF load1 4 nS tHRF,25pF Rise/Fall time, high drive mode, 10-90%, 25 pF load1 5 nS tHRF,50pF Rise/Fall time, high drive mode, 10-90%, 50 pF load1 8 nS RPU Pull-up resistance 11 13 16 KΩ
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 5 of 18 RPD Pull-down resistance 11 13 16 KΩ CPAD Pad capacitance 3 pF CPAD_NFC Pad capacitance on NFC pads 4 pF INFC_LEAK Leakage current between NFC pads when driven to different states 2 10 uA The current drawn from the battery when GPIO is active as an output is calculated as follows: IGPIO=VCC Cload f Cload being the load capacitance and “f” is the switching frequency. GPIO drive strength vs Voltage, standard drive, VCC = 3.0 V GPIO drive strength vs Voltage, high drive, VCC = 3.0 V Max sink current vs Voltage, standard drive Max sink current vs Voltage, high drive Rise and fall time vs Temperature, 10%-90%, 25pF load capacitance, VCC = 3.0 V
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 6 of 18 6. Radio Characteristics 6.1. General Radio Characteristics Symbol Description Min. Typ. Max. UnitsfOP Operating frequencies 2360 2500 MHz fPLL,PROG,RES PLL programming resolution 2 KHz fPLL,CH,SP PLL channel spacing 1 MHz fDELTA,1M Frequency deviation @ 1 Msps ±170 KHz fDELTA,BLE,1M Frequency deviation @ BLE 1Msps ±250 KHz fDELTA,2M Frequency deviation @ 2 Msps ±320 KHz fDELTA,BLE,2M Frequency deviation @ BLE 2 Msps ±500 KHz fskSPS On-the-air data rate 1 2 Msps 6.2. Radio current consumption (Transmitter) Symbol Description Min. Typ. Max. UnitsITX,PLUS4dBM TX only run current PRF = +4 dBm 16.6 mA ITX,0dBM TX only run current PRF = 0dBm 11.6 mA ITX,MINUS4dBM TX only run current PRF = -4 dBm 9.3 mA ITX,MINUS8dBM TX only run current PRF = -8 dBm 8.4 mA ITX,MINUS12dBM TX only run current PRF = -12 dBm 7.7 mA ITX,MINUS16dBM TX only run current PRF = -16 dBm 7.3 mA ITX,MINUS20dBM TX only run current PRF = -20 dBm 7.0 mA ITX,MINUS40dBM TX only run current PRF = -40 dBm 5.9 mA ISTART,TX TX start-up current, PRF = 4 dBm 8.8 mA Symbol Description Min. Typ. Max. UnitsITX,PLUS4dBM,DCDC TX only run current (DCDC, 3V) PRF =+4 dBm 7.5 mA ITX,0dBM,DCDC TX only run current (DCDC, 3V)PRF = 0dBm 5.3 mA ITX,MINUS4dBM,DCDC TX only run current DCDC, 3V PRF = -4dBm 4.2 mA ITX,MINUS8dBM,DCDC TX only run current DCDC, 3V PRF = -8 dBm 3.8 mA ITX,MINUS12dBM,DCDC TX only run current DCDC, 3V PRF = -12 dBm 3.5 mA ITX,MINUS16dBM,DCDC TX only run current DCDC, 3V PRF = -16 dBm 3.3 mA ITX,MINUS20dBM,DCDC TX only run current DCDC, 3V PRF = -20 dBm 3.2 mA ITX,MINUS40dBM,DCDC TX only run current DCDC, 3V PRF = -40 dBm 2.7 mA ISTART,TX,DCDC TX start-up current DCDC, 3V, PRF = 4 dBm 4.0 mA 6.3. Radio current consumption (Receiver) Symbol Description Min. Typ. Max. UnitsIRX,1M RX only run current 1Msps / 1Msps BLE 11.7 mA IRX,2M RX only run current 2Msps / 2Msps BLE 12.9 mA ISTART,RX,LDO RX start-up current (LDO 3V) 7.5 mA Symbol Description Min. Typ. Max. UnitsIRX,1M,DCDC RX only run current (DCDC, 3V) 1Msps / 1Msps BLE 5.4 mA IRX,2M,DCDC RX only run current (DCDC, 3V) 2Msps / 2Msps BLE 5.8 mA ISTART,RX,DCDC RX start-up current (DCDC 3V) 3.5 mA
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 7 of 18 6.4. Transmitter specification Symbol Description Min. Typ. Max. UnitsPRF Maximum output power 4 6 dBm PRFC RF power control range 24 dB PRFCR RF power accuracy ±4 dB PRF1,1 1st Adjacent Channel Transmit Power 1 MHz (1 Msps Nordic proprietary mode) -25 dBc PRF2,1 2nd Adjacent Channel Transmit Power 2 MHz (1 Msps Nordic proprietary mode) -50 dBc PRF1,2 1st Adjacent Channel Transmit Power 2 MHz (2 Msps Nordic proprietary mode) -25 dBc PRF2,2 2nd Adjacent Channel Transmit Power 4 MHz (2 Msps Nordic proprietary mode) -50 dBc PRF1,2,BLE 1st Adjacent Channel Transmit Power 2 MHz (2 Msps BLE mode) -20 dBc PRF2,2,BLE 2nd Adjacent Channel Transmit Power 4 MHz (2 Msps BLE mode) -50 dBc 6.5. Receiver operation Symbol Description Min. Typ. Max. UnitsPRX,MAX Maximum received signal strength at < 0.1% BER 0 dBm PSENS,IT,1M Sensitivity, 1Msps nRF mode 16 -93 dBm PSENS,IT,SP,1M,BLE Sensitivity, 1Msps BLE ideal transmitter, <=37 bytes BER=1E-3 17 -96 dBm PSENS,IT,LP,1M,BLE Sensitivity, 1Msps BLE ideal transmitter >=128 bytes BER=1E-4 18 -95 dBm PSENS,IT,2M Sensitivity, 2Msps nRF mode 19 -89 dBm PSENS,IT,SP,2M,BLE Sensitivity, 2Msps BLE ideal transmitter, Packet length <=37bytes -93 dBm PSENS,DT,SP,2M,BLE Sensitivity, 2Msps BLE dirty transmitter, Packet length <=37bytes -93 dBm PSENS,IT,LP,2M,BLE Sensitivity, 2Msps BLE ideal transmitter >= 128bytes -92 dBm PSENS,DT,LP,2M,BLE Sensitivity, 2Msps BLE dirty transmitter, Packet length >= 128bytes -92 dBm **16 Typical sensitivity applies when ADDR0 is used for receiver address correlation. When ADDR[1...7] are used for receiver address correlation, the typical sensitivity for this mode is degraded by 3dB. **17 As defined in the Bluetooth Core Specification v4.0 Volume 6: Core System Package (Low Energy Controller Volume) **18 Equivalent BER limit < 10E-04 **19 Typical sensitivity applies when ADDR0 is used for receiver address correlation. When ADDR[1...7] are used for receiver address correlation, the typical sensitivity for this mode is degraded by 3dB. 6.6. selectivity RX selectivity with equal modulation on interfering signal20 **20 Wanted signal level at PIN = -67 dBm. One interferer is used, having equal modulation as the wanted signal. The input power of the interferer where the sensitivity equals BER = 0.1% is presented Symbol Description Min. Typ. Max. UnitsC/I1M,co-channel 1Msps mode, Co-Channel interference 9 dB C/I1M,-1MHz 1 Msps mode, Adjacent (-1 MHz) interference -2 dBC/I1M,+1MHz 1 Msps mode, Adjacent (+1 MHz) interference -10 dBC/I1M,-2MHz 1 Msps mode, Adjacent (-2 MHz) interference -19 dBC/I1M,+2MHz 1 Msps mode, Adjacent (+2 MHz) interference -42 dBC/I1M,-3MHz 1 Msps mode, Adjacent (-3 MHz) interference -38 dBC/I1M,+3MHz 1 Msps mode, Adjacent (+3 MHz) interference -48 dBC/I1M,±6MHz 1 Msps mode, Adjacent (≥6 MHz) interference -50 dBC/I1MBLE,co-channel 1 Msps BLE mode, Co-Channel interference 6 dBC/I1MBLE,-1MHz 1 Msps BLE mode, Adjacent (-1 MHz) interference -2 dBC/I1MBLE,+1MHz 1 Msps BLE mode, Adjacent (+1 MHz) interference -9 dBC/I1MBLE,-2MHz 1 Msps BLE mode, Adjacent (-2 MHz) interference -22 dBC/I1MBLE,+2MHz 1 Msps BLE mode, Adjacent (+2 MHz) interference -46 dBC/I1MBLE,>3MHz 1 Msps BLE mode, Adjacent (≥3 MHz) interference -50 dBC/I1MBLE,image Image frequency Interference -22 dBC/I1MBLE,image,1MHz Adjacent (1 MHz) interference to in-band image frequency -35 dBC/I2M,co-channel 2Msps mode, Co-Channel interference 10 dB
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 8 of 18 C/I2M,-2MHz 2 Msps mode, Adjacent (-2 MHz) interference 6 dBC/I2M,+2MHz 2 Msps mode, Adjacent (+2 MHz) interference -14 dBC/I2M,-4MHz 2 Msps mode, Adjacent (-4 MHz) interference -20 dBC/I2M,+4MHz 2 Msps mode, Adjacent (+4 MHz) interference -44 dBC/I2M,-6MHz 2 Msps mode, Adjacent (-6 MHz) interference -42 dBC/I2M,+6MHz 2 Msps mode, Adjacent (+6 MHz) interference -47 dBC/I2M,≥12MHz 2 Msps mode, Adjacent (≥12 MHz) interference -52 dBC/I2MBLE,co-channel 2 Msps BLE mode, Co-Channel interference 7 dBC/I2MBLE,±2MHz 2 Msps BLE mode, Adjacent (±2 MHz) interference 0 dBC/I2MBLE,±4MHz 2 Msps BLE mode, Adjacent (±4 MHz) interference -47 dBC/I2MBLE,≥6MHz 2 Msps BLE mode, Adjacent (≥6 MHz) interference -49 dBC/I2MBLE,image Image frequency Interference -21 dBC/I2MBLE,image, 2MHz Adjacent (2 MHz) interference to in-band image frequency -36 dB 6.7. RX intermodulation RX intermodulation21 **21 Wanted signal level at PIN = -64 dBm. Two interferers with equal input power are used. The interferer closest in frequency is not modulated, the other interferer is modulated equal with the wanted signal. The input power of the interferers where the sensitivity equals BER = 0.1% is presented. Symbol Description Min. Typ. Max. UnitsPIMD,1M IMD performance, 1 Msps (3 MHz, 4 MHz, and 5 MHz offset) -33 dBm PIMD,1M,BLE IMD performance, BLE 1 Msps (3 MHz, 4 MHz, and 5 MHz offset) -30 dBm PIMD,2M IMD performance, 2 Msps (6 MHz, 8 MHz, and 10 MHz offset) -33 dBm PIMD,2M,BLE IMD performance, BLE 2 Msps (6 MHz, 8 MHz, and 10 MHz offset) -32 dBm 6.8. Radio timing Symbol Description Min. Typ. Max. UnitstTXEN Time between TXEN task and READY event after channel FREQUENCY configured 140 uS tTXEN,FAST Time between TXEN task and READY event after channel FREQUENCY configured (Fast Mode) 40 uStTXDISABLE Time between DISABLE task and DISABLED event when the radio was in TX and mode is set to 1Msps 6 uStTXDISABLE,2M Time between DISABLE task and DISABLED event when the radio was in TX and mode is set to 2Msps 4 uStRXEN Time between the RXEN task and READY event after channel FREQUENCY configured in default mode 140 uStRXEN,FAST Time between the RXEN task and READY event after channel FREQUENCY configured in fast mode 40 uStSWITCH The minimum time taken to switch from RX to TX or TX to RX (channel FREQUENCY unchanged) 20 uStRXDISABLE Time between DISABLE task and DISABLED event when the radio was in RX 0 uStTXCHAIN TX chain delay 0.6 uStRXCHAIN RX chain delay 9.4 uStRXCHAIN,2M RX chain delay in 2Msps mode 5 uS 6.9. Received Signal Strength Indicator (RSSI) specifications Symbol Description Min. Typ. Max. UnitsRSSIACC RSSI Accuracy Valid range -90 to -20 dBm ±2 dB RSSIRESOLUTION RSSI resolution 1 dB RSSIPERIOD Sample period 0.25 uS
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 9 of 18 6.10. Jitter Symbol Description Min. Typ. Max. UnitstDISABLEDJITTER Jitter on DISABLED event relative to END event when shortcut between END and DISABLE is enabled. 0.25 uS tREADYJITTER Jitter on READY event relative to TXEN and RXEN task. 0.25 uS 6.11. Delay when disabling the RADIO Symbol Description Min. Typ. Max. UnitstTXDISABLE,1M Disable delay from TX. Delay between DISABLE and DISABLED for MODE = Nrf_1Mbitand MODE = Ble_1Mbit 6 uS tRXDISABLE,1M Disable delay from RX. Delay between DISABLE and DISABLED for MODE = Nrf_1Mbitand MODE = Ble_1Mbit 0 uS 7. NFCT - Near field communication tag 7.1. NFCT Timing Parameters Symbol Description Min. Typ. Max. Unitsfc Frequency of operation 13.56 MHz CMI Carrier modulation index 95 % DR Data Rate 106 Kbps fs Modulation sub-carrier frequency fc/16 MHz Vswing Peak differential Input voltage swing on NFC1 and NFC2 VCC Vp Vsense Peak differential Field detect threshold level on NFC1-NFC235 1.0 Vp Isense Current in SENSE STATE 100 nA Iactivated Current in ACTIVATED STATE 480 uA Rin_min Minimum input resistance when regulating voltage swing 40 Ω Rin_max Maximum input resistance when regulating voltage swing 1.0 kΩ Rin_loadmod Input resistance when load modulating 8 22 Ω Imax Maximum input current on NFC pins 80 mA 7.2. NFCT Timing Parameters Symbol Description Min. Typ. Max. Unitstactivate Time from task_ACTIVATE in SENSE or DISABLE state to ACTIVATE_A or IDLE state36 500 uS tsense Time from remote field is present in SENSE mode to FIELDDETECTED event is asserted 20 uS NFCT timing parameters (Shortcuts for FIELDDETECTED and FIELDLOST are disabled) **35 Input is high impedance in sense mode **36 Does not account for voltage supply and oscillator startup times
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 10 of 18 8. SAADC - Successive approximation analog-todigital converter 8.1. Reference The ADC can use two different references, controlled in the REFSEL field of the CH[n].CONFIG register. These are: • Internal reference • VCC as reference The internal reference results in an input range of ±0.6 V on the ADC core. VCC as reference results in an input range of ±VCC/4 on the ADC core. The gain block can be used to change the effective input range of the ADC. Input range = (+/- 0.6 V or +/-VDD/4)/Gain For example, choosing VCC as reference, single ended input (grounded negative input), and a gain of 1/4 the input range will be: Input range = (VCC/4)/(1/4) = VCC With internal reference, single ended input (grounded negative input), and a gain of 1/6 the input range will be: Input range = (0.6 V)/(1/6) = 3.6 V The AIN0-AIN7 inputs cannot exceed VCC, or be lower than GND. 8.2. Acquisition time To sample the input voltage, the ADC connects a capacitor to the input. For illustration, see Figure 103: Simplified ADC sample network on page. The acquisition time indicates how long the capacitor is connected, see TACQ field in CH[n].CONFIG register. The required acquisition time depends on the source (Rsource) resistance. For high source resistance the acquisition time should be increased, see Table 89: Acquisition time on page. Figure 103: Simplified ADC sample network Table 89: Acquisition time TACQ [μs] Maximum source resistance [kOhm] 3 10 5 40 10 100 15 200 20 400 40 800 8.3. Limits event monitoring A channel can be event monitored by configuring limit register CH[n].LIMIT. If the conversion result is higher than the defined high limit, or lower than the defined low limit, the appropriate event will get fired.
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 11 of 18 Figure 104: Example of limits monitoring on channel 'n' Note that when setting the limits, CH[n].LIMIT.HIGH shall always be higher than or equal to CH[n].LIMIT.LOW . In other words, an event can be fired only when the input signal has been sampled outside of the defined limits. It is not possible to fire an event when the input signal is inside a defined range by swapping high and low limits. The comparison to limits always takes place, there is no need to enable it. If comparison is not required on a channel, the software shall simply ignore the related events. In that situation, the value of the limits registers is irrelevant, so it does not matter if CH[n].LIMIT.LOW is lower than CH[n].LIMIT.HIGH or not. 8.4. SAADC Electrical Specification Symbol Description Min. Typ. Max. UnitsDNL Differential non-linearity, 10-bit resolution -0.95 <1 LSB INL Integral non-linearity, 10-bit resolution 1 LSB VOS Differential offset error (calibrated), 10-bit resolutiona ±2 LSB CEG Gain error temperature coefficient 0.02 % / ℃fSAMPLE Maximum sampling rate 200 kHz tACQ,10k Acquisition time (configurable), source Resistance <= 10kOhm 3 uS tACQ,40k Acquisition time (configurable), source Resistance <= 40kOhm 5 uS tACQ,100k Acquisition time (configurable), source Resistance <= 100kOhm 10 uS tACQ,200k Acquisition time (configurable), source Resistance <= 200kOhm 15 uS tACQ,400k Acquisition time (configurable), source Resistance <= 400kOhm 20 uS tACQ,800k Acquisition time (configurable), source Resistance <= 800kOhm 40 uS tCONV Conversion time <2 uS IADC,CONV ADC current during ACQuisition and CONVersion 700 uA
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 12 of 18 IADC,IDLE Idle current, when not sampling, excluding clock sources and regulator base currents33 <5 uA EG1/6 Errorb for Gain = 1/6 -3 3 % EG1/4 Errorb for Gain = 1/4 -3 3 % EG1/2 Errorb for Gain = 1/2 -3 4 % EG1 Errorb for Gain = 1 -3 4 % CSAMPLE Sample and hold capacitance at maximum gain34 2.5 pF RINPUT Input resistance >1 MΩ ENOB Effective number of bits, differential mode, 12-bit resolution, 1/1 gain, 3 μs acquisition time, crystal HFCLK, 200 ksps 9 Bit SNDR Peak signal to noise and distortion ratio, differential mode, 12-bit resolution, 1/1 gain, 3 μs acquisition time, crystal HFCLK, 200ksps 56 dB SFDR Spurious free dynamic range, differential mode, 12-bit resolution, 1/1 gain, 3 μs acquisition time, crystal HFCLK, 200 ksps 70 dBc RLADDER Ladder resistance 160 kΩ Figure 105: Model of SAADC input (one channel) Note: SAADC average current calculation for a given application is based on the sample period, conversion and acquisition time ( tconv and tACQ) and conversion and idle current (IADC,CONV and IADC,IDLE). For example, sampling at 4kHz gives a sample period of 250μs. The average current consumption would then be: Figure 106: ADC INL vs Output Code **a Digital output code at zero volt differential input. **33 When tACQ is 10us or longer, and if DC/DC is active, it will be allowed to work in refresh mode if no other resource is requiring a high quality power supply from 1V3. If tACQ is smaller than 10us and DC/DC is active, refresh mode will not be allowed, and it will remain in normal mode from the START task to the STOPPED event. So depending on tACQ and other resources' needs, the appropriate base current needs to be taken into account. **b Does not include temperature drift **34 Maximum gain corresponds to highest capacitance.
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 13 of 18 Figure 107: ADC DNL vs Output Code Figure 108: FFT of a 2.8 kHz sine at 200 ksps ()
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 14 of 18 9. Physical Dimensions A A1 A2 A3 A4 B B1 B2 B3 C Unit 1025 50 50 325 310 600 75 50 75 80 mil 26.035 1.27 1.27 8.255 7.874 15.24 1.905 1.27 1.905 2.286 mm ×38 C1 D1 E1 Unit 32 42 32 mil 0.8128 1.0668 0.8128 mm ×38
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 15 of 18 10. Solder Profiles The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder re-flow. There are four zones: 1.Preheat Zone - This zone raises the temperature at a controlled rate, typically 1-2.5°C/s. 2.Equilibrium Zone - This zone brings the board to a uniform temperature and also activates the flux. The duration in this zone (typically 2-3 minutes) will need to be adjusted to optimise the out gassing of the flux. 3.Reflow Zone - The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. 4.Cooling Zone - The cooling rate should be fast, to keep the solder grains small which will give a longer lasting joint. Typical rates will be 2-5°C/s. 10.1. Solder Re-Flow Profile for Devices with Lead-Free Solder Balls Composition of the solder ball: Sn 95.5%, Ag 4.0%, Cu 0.5% Typical Lead-Free Re-flow Solder Profile Key features of the profile:  Initial Ramp = 1-2.5°C/sec to 175°C±25°C equilibrium  Equilibrium time = 60 to 180 seconds  Ramp to Maximum temperature (250°C) = 3°C/sec max.  Time above liquidus temperature (217°C): 45-90 seconds  Device absolute maximum reflow temperature: 260°C Devices will withstand the specified profile. Lead-free devices will withstand up to three reflows to a maximum temperature of 260°C. Notes：They need to be baked prior to mounting。 China ChongQing JINOU Science & Technology Co.,LTD Tel: +86-23-68798999 Email: jinou@jinoux.com
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 16 of 18 Modular Approval: The BLE0305C2P module is designed to comply with the FCC statement. FCC ID is SI8-BLE0305C2P. The host system using BLE0305C2P, should have label indicated it contain modular’s FCC ID SI8-BLE0305C2P. RF warning for Mobile device: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. 15.19 Labelling requirements. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 15.21 Information to user. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by Chongqing JINOU Science and Technology Development Co., Ltd. turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna -Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
ChongQing JINOU Science & Technology BLE0305C2P Bluetooth Module Data Sheet http://www.jinoux.com +86-23-68798999 Page 17 of 18 Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.

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