Chongqing Jinou Science and Technology Development BLE0305C2P Bluetooth Low Energy Module (BLE) User Manual BLE0305C2P

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ChongQing JINOU Science & Technology
BLE0305C2P Bluetooth Module Data Sheet
目录
FCC ID: SI8-BLE0305C2P
Product: Bluetooth Low Energy Module（BLE）
Model(s): BLE0305C2P
Revision History .......................................................................................................................................... i
1.
Features ......................................................................................................................................... 1
2.
Product Description ................................................................................................................... 1
3.
Block Diagram ............................................................................................................................... 1
4.
Pin Descriptions ......................................................................................................................... 2
5.
Electrical Specifications ....................................................................................................... 4
5.1.
Absolute Maximum ratings ................................................................................................. 4
5.2.
Recommended Operating Conditions ................................................................................. 4
5.3.
Electrical Characteristics ............................................................................................. 4
6.
Radio Characteristics ............................................................................................................... 6
6.1.
General Radio Characteristics ....................................................................................... 6
6.2.
Radio current consumption (Transmitter) ................................................................... 6
6.3.
Radio current consumption (Receiver) ......................................................................... 6
6.4.
Transmitter specification ............................................................................................... 7
6.5.
Receiver operation ............................................................................................................. 7
6.6.
selectivity ........................................................................................................................... 7
6.7.
RX intermodulation ............................................................................................................. 8
6.8.
Radio timing ......................................................................................................................... 8
6.9.
Received Signal Strength Indicator (RSSI) specifications ................................. 8
6.10.
Jitter ..................................................................................................................................... 9
6.11.
Delay when disabling the RADIO ..................................................................................... 9
7.
NFCT - Near field communication tag ................................................................................... 9
7.1.
NFCT Timing Parameters ..................................................................................................... 9
7.2.
NFCT Timing Parameters ..................................................................................................... 9
8.
SAADC - Successive approximation analog-todigital converter ................................. 10
8.1.
Reference ............................................................................................................................. 10
8.2.
Acquisition time ............................................................................................................... 10
8.3.
Limits event monitoring ................................................................................................. 10
8.4.
SAADC Electrical Specification ................................................................................... 11
9.
Physical Dimensions ................................................................................................................. 14
10.
Solder Profiles ......................................................................................................................... 15
10.1.
Solder Re-Flow Profile for Devices with Lead-Free Solder Balls.................... 15
Revision
1.0
Date
2018-05-30
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Revision History
Description/Changes
First release
(Added / Changes / Merged / Deleted)
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Page i of 18
ChongQing JINOU Science & Technology
BLE0305C2P Bluetooth Module Data Sheet
1. Features

Surface-mount, Size: 15.24mm×26.035mm = 600mil×1025mil
2. Product Description
For more information on Jinou’s wireless platform solutions for Bluetooth, see Jinou's
homepage(www.jinoux.com).
3. Block Diagram
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Page 1 of 18
ChongQing JINOU Science & Technology
BLE0305C2P Bluetooth Module Data Sheet
4. Pin Descriptions
Device Terminal Functions(设备接线端列表)
序号
说明
GND
P25
P26
P27
P28
P29
P30
P31
P02
10
P03
11
P04
12
P05
13
VCC
14
GND
15
GND
16
VCC
17
P06
18
P07
Device Terminal Functions(设备接线端功能描述)
No.
Name
Type
P00
Digital I/O
XL1
Analog input
P01
Digital I/O
XL2
Analog input
P02
Digital I/O
AIN0
Analog input
P03
Digital I/O
AIN1
Analog input
P04
Digital I/O
AIN2
Analog input
P05
Digital I/O
AIN3
Analog input
P06
Digital I/O
P07
Digital I/O
P08
Digital I/O
NFC1
NFC input
P09
Digital I/O
NFC2
NFC input
P10
Digital I/O
P11
Digital I/O
P12
Digital I/O
P13
Digital I/O
P14
Digital I/O
TRACEDATA[3]
P15
Digital I/O
TRACEDATA[2]
P16
Digital I/O
TRACEDATA[1]
P17
Digital I/O
P18
Digital I/O
TRACEDATA[0] / SWO
P19
Digital I/O
P20
Digital I/O
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说明
GND
P24
P23
P22
SWD
SWC
P21
P20
P19
P18
P17
P16
P15
P14
19
P08
20
P09
21
P10
22
P11
23
P12
Description
General purpose I/O
Connection for 32.768 kHz crystal (LFXO)
General purpose I/O
Connection for 32.768 kHz crystal (LFXO)
General purpose I/O
SAADC/COMP/LPCOMP input
General purpose I/O
SAADC/COMP/LPCOMP input
General purpose I/O
SAADC/COMP/LPCOMP input
General purpose I/O
SAADC/COMP/LPCOMP input
General purpose I/O
General purpose I/O
General purpose I/O
NFC antenna connection
General purpose I/O**1
NFC antenna connection
General purpose I/O**1
General purpose I/O
General purpose I/O
General purpose I/O
General purpose I/O
Trace port output
General purpose I/O
Trace port output
General purpose I/O
Trace port output
General purpose I/O
General purpose I/O
Trace port output / Single wire output
General purpose I/O
General purpose I/O
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序号
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
P13
ChongQing JINOU Science & Technology
TRACECLK
P0.21
nRESET
P22
P23
P24
P25
P26
P27
P0.28
AIN4
P0.29
AIN5
P0.30
AIN6
P0.31
AIN7
SWDCLK OR SWC
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Analog input
Digital I/O
Analog input
Digital I/O
Analog input
Digital I/O
Analog input
BLE0305C2P Bluetooth Module Data Sheet
Trace port clock output
General purpose I/O
Configurable as pin reset
General purpose I/O
General purpose I/O
General purpose I/O
General purpose I/O
General purpose I/O
General purpose I/O
General purpose I/O**2
SAADC/COMP/LPCOMP input
General purpose I/O**2
SAADC/COMP/LPCOMP input
General purpose I/O**2
SAADC/COMP/LPCOMP input
General purpose I/O**2
SAADC/COMP/LPCOMP input
Digital input
Serial wire debug clock input for debug and
programming
SWDIO OR SWD
Digital I/O
Serial wire debug I/O for debug and programming
VCC
Power
Ground
GND
Power
Power supply
**1 See GPIO located near the radio for more information.
**2 See NFC antenna pins for more information.
1 GPIO located near the radio
Radio performance parameters, such as sensitivity, may be affected by high frequency digital I/O with
large sink/source current close to the Radio power supply and antenna pins.
Table 5: GPIO recommended usage for module identify some GPIO that have recommended usage guidelines to
maximize radio performance in an application.
Table 5: GPIO recommended usage for module
Recommended usage
Low drive, low frequency I/O only.
Included GPIO
P22, P23, P24, P25, P26, P27, P28, P29, P30, P31.
2 NFC antenna pins
Two physical pins can be configured either as NFC antenna pins (factory default), or as GPIOs, as
shown below.
NFC pad name
GPIO
NFC1
P09
NFC2
P10
When configured as NFC antenna pins, the GPIOs on those pins will automatically be set to DISABLE
state and a protection circuit will be enabled preventing the chip from being damaged in the presence
of a strong NFC field. The protection circuit will short the two pins together if voltage difference exceeds
approximately 2V.
For information on how to configure these pins as normal GPIOs, see NFCT — Near field communication
tag on page 416 and UICR — User information configuration registers on page 54. Note that the device
will not be protected against strong NFC field damage if the pins are configured as GPIO and an NFC antenna
is connected to the device. The pins will always be configured as NFC pins during power-on reset until
the configuration is set according to the UICR register.
These two pins will have some limitations when configured as GPIO. The pin capacitance will be higher
on these pins, and there is some current leakage between the two pins if they are driven to different
logical values. To avoid leakage between the pins when configured as GPIO, these GPIOs should always be
at the same logical value whenever entering one of the device power saving modes. See Electrical
specification.
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ChongQing JINOU Science & Technology
BLE0305C2P Bluetooth Module Data Sheet
5. Electrical Specifications
5.1. Absolute Maximum ratings
Maximum ratings are the extreme limits to which the chip can be exposed for a limited
amount of time without permanently damaging it. Exposure to absolute maximum ratings for
prolonged periods of time may affect the reliability of the device.
Min
Max
Unit
-0.3
+3.9
-0.3
-0.3
VCC+0.3V
3.9
NFC antenna pin current
INFC1/2
80
mA
Radio
RF input level
10
dBm
+125
4000
1000
℃
Supply voltages
VCC
GND
I/O pin voltage
VI/O, VCC ≤3.6 V
VI/O, VCC >3.6 V
Storage temperature
MSL (moisture sensitivity level)
ESD HBM (human body model)
ESD CDM (charged device model)
Flash memory
Endurance (Write/Erase cycles)
Retention (at 40℃)
-40
10000
10
years
5.2. Recommended Operating Conditions
Parameter
Voltage at POWER pin(VCC)
Voltage at digital pins(P00 – P31)
Abs(NFC1 – NFC2)
Operating temperature
Min
2.7
-0.3
Type
3.3
-40
25
Max
3.6
VCC+0.3V
85
Unit
℃
5.3. Electrical Characteristics
GPIO
Symbol
VIH
VIL
VOH,HDH
VOL,HDH
IOL,HDH
IOH,HDH
tRF,15pF
tRF,25pF
tRF,50pF
tHRF,15pF
tHRF,25pF
tHRF,50pF
RPU
Electrical Specification
Description
Input high voltage
Input low voltage
Output high voltage, high drive, 5 mA, VCC >= 2.7 V
Output low voltage, high drive, 5 mA, VCC >= 2.7 V
Current at GND+0.4 V, output set low, high drive, VCC >= 2.7 V
Current at VCC-0.4 V, output set high, high drive, VCC >= 2.7 V
Rise/fall time, low drive mode, 10-90%, 15 pF load1
Rise/fall time, low drive mode, 10-90%, 25 pF load1
Rise/fall time, low drive mode, 10-90%, 50 pF load1
Rise/Fall time, high drive mode, 10-90%, 15 pF load1
Rise/Fall time, high drive mode, 10-90%, 25 pF load1
Rise/Fall time, high drive mode, 10-90%, 50 pF load1
Pull-up resistance
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Min
0.7* VCC
GND
VCC-0.4
GND
11
Typ
10
13
25
13
Max
VCC
0.3*VCC
VCC
GND+0.4
15
14
16
Page 4 of 18
Units
mA
mA
nS
nS
nS
nS
nS
nS
KΩ
ChongQing JINOU Science & Technology
RPD
CPAD
CPAD_NFC
INFC_LEAK
BLE0305C2P Bluetooth Module Data Sheet
Pull-down resistance
Pad capacitance
Pad capacitance on NFC pads
11
Leakage current between NFC pads when driven to different states
13
16
10
The current drawn from the battery when GPIO is active as an output is calculated as follows:
IGPIO=VCC Cload f
Cload being the load capacitance and “f” is the switching frequency.
GPIO drive strength vs Voltage, standard drive,
VCC = 3.0 V
GPIO drive strength vs Voltage, high drive,
VCC = 3.0 V
Max sink current vs Voltage, standard drive
Max sink current vs Voltage, high drive
Rise and fall time vs Temperature, 10%-90%, 25pF
load capacitance, VCC = 3.0 V
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KΩ
pF
pF
uA
ChongQing JINOU Science & Technology
BLE0305C2P Bluetooth Module Data Sheet
6. Radio Characteristics
6.1. General Radio Characteristics
Symbol
fOP
fPLL,PROG,RES
fPLL,CH,SP
fDELTA,1M
fDELTA,BLE,1M
fDELTA,2M
fDELTA,BLE,2M
fskSPS
Description
Operating frequencies
PLL programming resolution
PLL channel spacing
Frequency deviation @ 1 Msps
Frequency deviation @ BLE 1Msps
Frequency deviation @ 2 Msps
Frequency deviation @ BLE 2 Msps
On-the-air data rate
Min.
2360
Typ.
Max.
2500
Units
MHz
KHz
MHz
±170
KHz
±250
KHz
±320
KHz
±500
KHz
Msps
6.2. Radio current consumption (Transmitter)
Symbol
ITX,PLUS4dBM
ITX,0dBM
ITX,MINUS4dBM
ITX,MINUS8dBM
ITX,MINUS12dBM
ITX,MINUS16dBM
ITX,MINUS20dBM
ITX,MINUS40dBM
ISTART,TX
TX
TX
TX
TX
TX
TX
TX
TX
TX
only run
only run
only run
only run
only run
only run
only run
only run
start-up
Description
current PRF = +4 dBm
current PRF = 0dBm
current PRF = -4 dBm
current PRF = -8 dBm
current PRF = -12 dBm
current PRF = -16 dBm
current PRF = -20 dBm
current PRF = -40 dBm
current, PRF = 4 dBm
Symbol
ITX,PLUS4dBM,DCDC
ITX,0dBM,DCDC
ITX,MINUS4dBM,DCDC
ITX,MINUS8dBM,DCDC
ITX,MINUS12dBM,DCDC
ITX,MINUS16dBM,DCDC
ITX,MINUS20dBM,DCDC
ITX,MINUS40dBM,DCDC
ISTART,TX,DCDC
TX
TX
TX
TX
TX
TX
TX
TX
TX
only run
only run
only run
only run
only run
only run
only run
only run
start-up
current
current
current
current
current
current
current
current
current
Description
(DCDC, 3V) PRF =+4 dBm
(DCDC, 3V)PRF = 0dBm
DCDC, 3V PRF = -4dBm
DCDC, 3V PRF = -8 dBm
DCDC, 3V PRF = -12 dBm
DCDC, 3V PRF = -16 dBm
DCDC, 3V PRF = -20 dBm
DCDC, 3V PRF = -40 dBm
DCDC, 3V, PRF = 4 dBm
Min.
Typ.
16.6
11.6
9.3
8.4
7.7
7.3
7.0
5.9
8.8
Max.
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
Min.
Typ.
7.5
5.3
4.2
3.8
3.5
3.3
3.2
2.7
4.0
Max.
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
Max.
Units
mA
6.3. Radio current consumption (Receiver)
Symbol
IRX,1M
IRX,2M
ISTART,RX,LDO
Symbol
IRX,1M,DCDC
IRX,2M,DCDC
ISTART,RX,DCDC
Description
RX only run current 1Msps / 1Msps BLE
Min.
Typ.
11.7
RX only run current 2Msps / 2Msps BLE
12.9
mA
RX start-up current (LDO 3V)
7.5
mA
Description
RX only run current (DCDC, 3V) 1Msps / 1Msps BLE
Min.
Typ.
5.4
Max.
Units
mA
RX only run current (DCDC, 3V) 2Msps / 2Msps BLE
5.8
mA
RX start-up current (DCDC 3V)
3.5
mA
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ChongQing JINOU Science & Technology
BLE0305C2P Bluetooth Module Data Sheet
6.4. Transmitter specification
Symbol
PRF
PRFC
PRFCR
PRF1,1
PRF2,1
PRF1,2
PRF2,2
PRF1,2,BLE
PRF2,2,BLE
Description
Maximum output power
RF power control range
RF power accuracy
Min.
Typ.
24
Max.
±4
1st Adjacent Channel Transmit Power 1 MHz (1 Msps Nordic proprietary mode)
-25
-50
-25
-50
-20
-50
2nd Adjacent Channel Transmit Power 2 MHz (1 Msps Nordic proprietary mode)
1st Adjacent Channel Transmit Power 2 MHz (2 Msps Nordic proprietary mode)
2nd Adjacent Channel Transmit Power 4 MHz (2 Msps Nordic proprietary mode)
1st Adjacent Channel Transmit Power 2 MHz (2 Msps BLE mode)
2nd Adjacent Channel Transmit Power 4 MHz (2 Msps BLE mode)
Units
dBm
dB
dB
dBc
dBc
dBc
dBc
dBc
dBc
6.5. Receiver operation
Symbol
Description
Maximum received signal strength at < 0.1% BER
Sensitivity, 1Msps nRF mode 16
Min.
Typ.
Max.
Units
PRX,MAX
dBm
PSENS,IT,1M
-93
dBm
Sensitivity, 1Msps BLE ideal transmitter, <=37 bytes BER=1E-3
PSENS,IT,SP,1M,BLE
-96
dBm
Sensitivity, 1Msps BLE ideal transmitter >=128 bytes BER=1E-4
PSENS,IT,LP,1M,BLE
-95
dBm
PSENS,IT,2M
Sensitivity, 2Msps nRF mode 19
-89
dBm
Sensitivity, 2Msps BLE ideal transmitter, Packet length <=37bytes
PSENS,IT,SP,2M,BLE
-93
dBm
Sensitivity, 2Msps BLE dirty transmitter, Packet length <=37bytes
PSENS,DT,SP,2M,BLE
-93
dBm
PSENS,IT,LP,2M,BLE
Sensitivity, 2Msps BLE ideal transmitter >= 128bytes
-92
dBm
Sensitivity, 2Msps BLE dirty transmitter, Packet length >= 128bytes
PSENS,DT,LP,2M,BLE
-92
dBm
**16 Typical sensitivity applies when ADDR0 is used for receiver address correlation. When ADDR[1...7]
are used for receiver address correlation, the typical sensitivity for this mode is degraded by 3dB.
**17 As defined in the Bluetooth Core Specification v4.0 Volume 6: Core System Package (Low Energy
Controller Volume)
**18 Equivalent BER limit < 10E-04
**19 Typical sensitivity applies when ADDR0 is used for receiver address correlation. When ADDR[1...7]
are used for receiver address correlation, the typical sensitivity for this mode is degraded by 3dB.
17
18
6.6. selectivity
20
RX selectivity with equal modulation on interfering signal
**20 Wanted signal level at PIN = -67 dBm. One interferer is used, having equal modulation
as the wanted signal. The input power of the interferer where the sensitivity equals BER
= 0.1% is presented
Symbol
C/I1M,co-channel
C/I1M,-1MHz
C/I1M,+1MHz
C/I1M,-2MHz
C/I1M,+2MHz
C/I1M,-3MHz
C/I1M,+3MHz
C/I1M,±6MHz
C/I1MBLE,co-channel
C/I1MBLE,-1MHz
C/I1MBLE,+1MHz
C/I1MBLE,-2MHz
C/I1MBLE,+2MHz
C/I1MBLE,>3MHz
C/I1MBLE,image
C/I1MBLE,image,1MHz
C/I2M,co-channel
Description
1Msps mode, Co-Channel interference
1 Msps mode, Adjacent (-1 MHz) interference
1 Msps mode, Adjacent (+1 MHz) interference
1 Msps mode, Adjacent (-2 MHz) interference
1 Msps mode, Adjacent (+2 MHz) interference
1 Msps mode, Adjacent (-3 MHz) interference
1 Msps mode, Adjacent (+3 MHz) interference
1 Msps mode, Adjacent (≥6 MHz) interference
1 Msps BLE mode, Co-Channel interference
1 Msps BLE mode, Adjacent (-1 MHz) interference
1 Msps BLE mode, Adjacent (+1 MHz) interference
1 Msps BLE mode, Adjacent (-2 MHz) interference
1 Msps BLE mode, Adjacent (+2 MHz) interference
1 Msps BLE mode, Adjacent (≥3 MHz) interference
Image frequency Interference
Adjacent (1 MHz) interference to in-band image frequency
2Msps mode, Co-Channel interference
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Min.
Typ.
-2
-10
-19
-42
-38
-48
-50
-2
-9
-22
-46
-50
-22
-35
10
Max.
Units
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
Page 7 of 18
ChongQing JINOU Science & Technology
C/I2M,-2MHz
C/I2M,+2MHz
C/I2M,-4MHz
C/I2M,+4MHz
C/I2M,-6MHz
C/I2M,+6MHz
C/I2M,≥12MHz
C/I2MBLE,co-channel
C/I2MBLE,±2MHz
C/I2MBLE,±4MHz
C/I2MBLE,≥6MHz
C/I2MBLE,image
C/I2MBLE,image, 2MHz
BLE0305C2P Bluetooth Module Data Sheet
2 Msps mode, Adjacent (-2 MHz) interference
2 Msps mode, Adjacent (+2 MHz) interference
2 Msps mode, Adjacent (-4 MHz) interference
2 Msps mode, Adjacent (+4 MHz) interference
2 Msps mode, Adjacent (-6 MHz) interference
2 Msps mode, Adjacent (+6 MHz) interference
2 Msps mode, Adjacent (≥12 MHz) interference
2 Msps BLE mode, Co-Channel interference
2 Msps BLE mode, Adjacent (±2 MHz) interference
2 Msps BLE mode, Adjacent (±4 MHz) interference
2 Msps BLE mode, Adjacent (≥6 MHz) interference
Image frequency Interference
-14
-20
-44
-42
-47
-52
-47
-49
-21
-36
Adjacent (2 MHz) interference to in-band image frequency
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
6.7. RX intermodulation
21
RX intermodulation
**21 Wanted signal level at PIN = -64 dBm. Two interferers with equal input power are used.
The interferer closest in frequency is not modulated, the other interferer is modulated
equal with the wanted signal. The input power of the interferers where the sensitivity
equals BER = 0.1% is presented.
Symbol
PIMD,1M
PIMD,1M,BLE
PIMD,2M
PIMD,2M,BLE
Description
Min.
Typ.
-33
-30
-33
-32
Max.
Units
dBm
dBm
dBm
dBm
Min.
Typ.
140
Max.
Units
uS
IMD performance, 1 Msps (3 MHz, 4 MHz, and 5 MHz offset)
IMD performance, BLE 1 Msps (3 MHz, 4 MHz, and 5 MHz offset)
IMD performance, 2 Msps (6 MHz, 8 MHz, and 10 MHz offset)
IMD performance, BLE 2 Msps (6 MHz, 8 MHz, and 10 MHz offset)
6.8. Radio timing
Symbol
tTXEN
tTXEN,FAST
tTXDISABLE
tTXDISABLE,2M
tRXEN
tRXEN,FAST
tSWITCH
tRXDISABLE
tTXCHAIN
tRXCHAIN
tRXCHAIN,2M
Description
Time between TXEN task and READY event after channel
FREQUENCY configured
Time between TXEN task and READY event after channel
FREQUENCY configured (Fast Mode)
Time between DISABLE task and DISABLED event when the
radio was in TX and mode is set to 1Msps
Time between DISABLE task and DISABLED event when the
radio was in TX and mode is set to 2Msps
Time between the RXEN task and READY event after
channel FREQUENCY configured in default mode
Time between the RXEN task and READY event after
channel FREQUENCY configured in fast mode
The minimum time taken to switch from RX to TX or TX
to RX (channel FREQUENCY unchanged)
Time between DISABLE task and DISABLED event when the
radio was in RX
TX chain delay
RX chain delay
RX chain delay in 2Msps mode
40
uS
uS
uS
140
uS
40
uS
20
uS
uS
0.6
9.4
uS
uS
uS
6.9. Received Signal Strength Indicator (RSSI) specifications
Symbol
RSSIACC
RSSIRESOLUTION
RSSIPERIOD
Description
RSSI Accuracy Valid range -90 to -20 dBm
RSSI resolution
Sample period
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Min.
Typ.
±2
0.25
Max.
Units
dB
dB
uS
Page 8 of 18
ChongQing JINOU Science & Technology
6.10.
Symbol
BLE0305C2P Bluetooth Module Data Sheet
Jitter
tREADYJITTER
Description
Jitter on DISABLED event relative to END event when
shortcut between END and DISABLE is enabled.
Jitter on READY event relative to TXEN and RXEN task.
6.11.
Delay when disabling the RADIO
tDISABLEDJITTER
Symbol
tTXDISABLE,1M
tRXDISABLE,1M
Description
Min.
Typ.
0.25
Units
uS
0.25
Min.
Typ.
Disable delay from TX.
Delay between DISABLE and DISABLED for MODE = Nrf_1Mbit
and MODE = Ble_1Mbit
Disable delay from RX.
Delay between DISABLE and DISABLED for MODE = Nrf_1Mbit
and MODE = Ble_1Mbit
7. NFCT -
Max.
uS
Max.
Units
uS
uS
Near field communication tag
7.1. NFCT Timing Parameters
Symbol
fc
CMI
DR
fs
Vswing
Vsense
Isense
Iactivated
Rin_min
Rin_max
Rin_loadmod
Imax
Description
Frequency of operation
Carrier modulation index
Data Rate
Modulation sub-carrier frequency
Min.
Typ.
13.56
22
80
Max.
Units
500
uS
20
uS
106
fc/16
VCC
Peak differential Field detect threshold level on NFC1-NFC235
1.0
100
480
Current in SENSE STATE
Current in ACTIVATED STATE
Minimum input resistance when regulating voltage swing
Input resistance when load modulating
Maximum input current on NFC pins
Units
MHz
Kbps
MHz
Vp
Vp
nA
uA
Ω
kΩ
Ω
mA
95
Peak differential Input voltage swing on NFC1 and NFC2
Maximum input resistance when regulating voltage swing
Max.
40
1.0
7.2. NFCT Timing Parameters
Symbol
tactivate
tsense
Description
Time from task_ACTIVATE in SENSE or DISABLE state to
ACTIVATE_A or IDLE state36
Time from remote field is present in SENSE mode to
FIELDDETECTED event is asserted
Min.
Typ.
NFCT timing parameters (Shortcuts for FIELDDETECTED and FIELDLOST are disabled)
**35 Input is high impedance in sense mode
**36 Does not account for voltage supply and oscillator startup times
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8. SAADC -
BLE0305C2P Bluetooth Module Data Sheet
Successive approximation analog-todigital converter
8.1. Reference
The ADC can use two different references, controlled in the REFSEL field of the
CH[n].CONFIG register. These are:
• Internal reference
• VCC as reference
The internal reference results in an input range of ±0.6 V on the ADC core. VCC as
reference results in an input range of ±VCC/4 on the ADC core. The gain block can be used
to change the effective input range of the ADC.
Input range = (+/- 0.6 V or +/-VDD/4)/Gain
For example, choosing VCC as reference, single ended input (grounded negative input),
and a gain of 1/4 the input range will be:
Input range = (VCC/4)/(1/4) = VCC
With internal reference, single ended input (grounded negative input), and a gain of
1/6 the input range will be:
Input range = (0.6 V)/(1/6) = 3.6 V
The AIN0-AIN7 inputs cannot exceed VCC, or be lower than GND.
8.2. Acquisition time
To sample the input voltage, the ADC connects a capacitor to the input.
For illustration, see Figure 103: Simplified ADC sample network on page. The
acquisition time indicates how long the capacitor is connected, see TACQ field in
CH[n].CONFIG register. The required acquisition time depends on the source (Rsource)
resistance. For high source resistance the acquisition time should be increased, see Table
89: Acquisition time on page.
Figure 103: Simplified ADC sample network
Table 89: Acquisition time
TACQ [μs]
Maximum source resistance [kOhm]
10
40
10
100
15
200
20
400
40
800
8.3. Limits event monitoring
A channel can be event monitored by configuring limit register CH[n].LIMIT.
If the conversion result is higher than the defined high limit, or lower than the defined
low limit, the appropriate event will get fired.
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BLE0305C2P Bluetooth Module Data Sheet
Figure 104: Example of limits monitoring on channel 'n'
Note that when setting the limits, CH[n].LIMIT.HIGH shall always be higher than or equal to
CH[n].LIMIT.LOW . In other words, an event can be fired only when the input signal has been sampled outside
of the defined limits. It is not possible to fire an event when the input signal is inside a defined range
by swapping high and low limits.
The comparison to limits always takes place, there is no need to enable it. If comparison is not required
on a channel, the software shall simply ignore the related events. In that situation, the value of the
limits registers is irrelevant, so it does not matter if CH[n].LIMIT.LOW is lower than CH[n].LIMIT.HIGH
or not.
8.4. SAADC Electrical Specification
Symbol
DNL
INL
VOS
CEG
fSAMPLE
tACQ,10k
tACQ,40k
tACQ,100k
tACQ,200k
tACQ,400k
tACQ,800k
tCONV
IADC,CONV
Description
Differential non-linearity, 10-bit resolution
Integral non-linearity, 10-bit resolution
Min.
-0.95
Differential offset error (calibrated), 10-bit resolution
Gain error temperature coefficient
Maximum sampling rate
Acquisition time (configurable), source Resistance <= 10kOhm
Acquisition time (configurable), source Resistance <= 40kOhm
Acquisition time (configurable), source Resistance <= 100kOhm
Acquisition time (configurable), source Resistance <= 200kOhm
Acquisition time (configurable), source Resistance <= 400kOhm
Acquisition time (configurable), source Resistance <= 800kOhm
Conversion time
ADC current during ACQuisition and CONVersion
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Typ.
<1
±2
0.02
Max.
200
10
15
20
40
<2
700
Units
LSB
LSB
LSB
% / ℃
kHz
uS
uS
uS
uS
uS
uS
uS
uA
Page 11 of 18
ChongQing JINOU Science & Technology
IADC,IDLE
EG1/6
EG1/4
EG1/2
EG1
CSAMPLE
RINPUT
ENOB
SNDR
SFDR
RLADDER
BLE0305C2P Bluetooth Module Data Sheet
Idle current, when not sampling, excluding clock
sources and regulator base currents33
Errorb for Gain = 1/6
Errorb for Gain = 1/4
Errorb for Gain = 1/2
Errorb for Gain = 1
Sample and hold capacitance at maximum gain34
Input resistance
Effective number of bits, differential mode, 12-bit
resolution, 1/1 gain, 3 μs acquisition time, crystal
HFCLK, 200 ksps
Peak signal to noise and distortion ratio,
differential mode, 12-bit resolution, 1/1 gain, 3 μs
acquisition time, crystal HFCLK, 200ksps
Spurious free dynamic range, differential mode,
12-bit resolution, 1/1 gain, 3 μs acquisition time,
crystal HFCLK, 200 ksps
Ladder resistance
<5
-3
-3
-3
-3
uA
2.5
>1
pF
MΩ
Bit
56
dB
70
dBc
160
kΩ
Figure 105: Model of SAADC input (one channel)
Note: SAADC average current calculation for a given application is based on the sample period,
conversion and acquisition time ( tconv and tACQ) and conversion and idle current (IADC,CONV and IADC,IDLE). For
example, sampling at 4kHz gives a sample period of 250μs. The average current consumption would then
be:
Figure 106: ADC INL vs Output Code
**a Digital output code at zero volt differential input.
**33 When tACQ is 10us or longer, and if DC/DC is active, it will be allowed to work in refresh mode if
no other resource is requiring a high quality power supply from 1V3. If tACQ is smaller than 10us and
DC/DC is active, refresh mode will not be allowed, and it will remain in normal mode from the START
task to the STOPPED event. So depending on tACQ and other resources' needs, the appropriate base current
needs to be taken into account.
**b Does not include temperature drift
**34 Maximum gain corresponds to highest capacitance.
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ChongQing JINOU Science & Technology
BLE0305C2P Bluetooth Module Data Sheet
Figure 107: ADC DNL vs Output Code
Figure 108: FFT of a 2.8 kHz sine at 200 ksps ()
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ChongQing JINOU Science & Technology
BLE0305C2P Bluetooth Module Data Sheet
9. Physical Dimensions
×38
1025
26.035
A1
50
1.27
A2
50
1.27
A3
325
8.255
A4
310
7.874
600
15.24
B1
75
1.905
B2
50
1.27
B3
75
1.905
80
2.286
Unit
mil
mm
×38
C1
32
0.8128
D1
42
1.0668
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E1
32
0.8128
Unit
mil
mm
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Page 14 of 18
ChongQing JINOU Science & Technology
BLE0305C2P Bluetooth Module Data Sheet
10. Solder Profiles
The soldering profile depends on various parameters necessitating a set up for each
application. The data here is given only for guidance on solder re-flow. There are four
zones:
1.Preheat Zone - This zone raises the temperature at a controlled rate, typically
1-2.5°C/s.
2.Equilibrium Zone - This zone brings the board to a uniform temperature and also
activates the flux.
The duration in this zone (typically 2-3 minutes) will need to be adjusted to optimise
the out gassing of the flux.
3.Reflow Zone - The peak temperature should be high enough to achieve good wetting
but not so high as to cause component discoloration or damage. Excessive soldering time
can lead to intermetallic growth which can result in a brittle joint.
4.Cooling Zone - The cooling rate should be fast, to keep the solder grains small which
will give a longer lasting joint. Typical rates will be 2-5°C/s.
10.1. Solder Re-Flow Profile for Devices with Lead-Free Solder Balls
Composition of the solder ball: Sn 95.5%, Ag 4.0%, Cu 0.5%
Typical Lead-Free Re-flow Solder Profile
Key features of the profile:
 Initial Ramp = 1-2.5°C/sec to 175°C±25°C equilibrium
 Equilibrium time = 60 to 180 seconds
 Ramp to Maximum temperature (250°C) = 3°C/sec max.
 Time above liquidus temperature (217°C): 45-90 seconds
 Device absolute maximum reflow temperature: 260°C
Devices will withstand the specified profile. Lead-free devices will withstand up to three
reflows to a maximum temperature of 260°C.
Notes：They need to be baked prior to mounting。
China ChongQing JINOU Science & Technology Co.,LTD
Tel: +86-23-68798999
Email: jinou@jinoux.com
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ChongQing JINOU Science & Technology
BLE0305C2P Bluetooth Module Data Sheet
Modular Approval:
The BLE0305C2P module is designed to comply with the FCC statement. FCC ID
is SI8-BLE0305C2P. The host system using BLE0305C2P, should have label indicated it
contain modular’s FCC ID SI8-BLE0305C2P.
RF warning for Mobile device:
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This equipment should be installed and operated with minimum
distance 20cm between the radiator & your body.
15.19 Labelling requirements.
This device complies with part 15 of the FCC Rules. Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.
15.21 Information to user.
Note: This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful interference in a residential
installation. This equipment generates uses and can radiate radio frequency energy
and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by Chongqing
JINOU Science and Technology Development Co., Ltd.
turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
-Reorient or relocate the receiving antenna
-Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help.
the OEM integrator is still responsible for testing their end-product for any
additional compliance requirements required with this module installed
IMPORTANT NOTE: In the event that these conditions cannot be met (for example certain
laptop configurations or co-location with another transmitter), then the FCC
authorization is no longer considered valid and the FCC ID can not be used on the final
product. In these circumstances, the OEM integrator will be responsible for
re-evaluating the end product (including the transmitter) and obtaining a separate
FCC authorization.
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BLE0305C2P Bluetooth Module Data Sheet
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding
how to install or remove this RF module in the user’s manual of the end product which
integrates this module.
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