CyberTAN Technology WD105 1x1 802.11b/g/n module User Manual

CyberTAN Technology Inc. 1x1 802.11b/g/n module

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WD105

Datasheet

CyberTAN Technology, Inc.

Model Name WD105

Description 802.11n LGA IoE Module

Version Release 0.3a

Date March 20, 2014

Author Cindy Fan

WD105

Datasheet

2014-03-20

Revision History

Date Release Author Description

2013-06-11 0.1 Cindy Fan First preliminary release.

2013-06-18 0.2 Cindy Fan Engineering Release.

2013-08-23 0.2a Cindy Fan Temporary Engineering Revision.

2014-03-18 0.3 Cindy Fan Update §4. Mechanical Characteristics.

2014-03-20 0.3a Cindy Fan Add §8. Regulatory Information

Related Documents

Date Author Description

Qualcomm Atheros QCA4002 datasheet

IEEE.org IEEE 802.11b/g/n specifications

CyberTAN Technology, Inc.

No. 99, Park Avenue III

Hsinchu Science Park

Hsinchu, Taiwan 30077

R.O.C.

CyberTAN® is a registered trademark of CyberTAN Technology, Inc. Bluetooth® is a trademark of the Bluetooth SIG.

All other trademarks appearing herein are the property of their respective owners.

This document may contain privileged or confidential information that is the property of CyberTAN Technology, Inc.

and the improper disclosure of which is an offense punishable under law. This document may be viewed and used only

by the individual or other entity that received it directly from CyberTAN. Redistribution of this document in any form

is strictly prohibited.

The products described in this document are not intended or designed for use in any application involving risk of harm

to persons or property. CYBERTAN PROVIDES THIS DOCUMENT AS-IS, WITHOUT WARRANTY OF ANY

KIND. CYBERTAN DISCLAIMS ALL WARRANTIES, EXPRESSED AND IMPLIED, INCLUDING, WITHOUT

LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR

PURPOSE, AND NON-INFRINGEMENT.

WD105

Datasheet

2014-03-20

Table of Contents

1.INTRODUCTION ................................................................................................................................................ 4

2.FEATURES .......................................................................................................................................................... 4

3. SPECIFICATION ................................................................................................................................................. 5

4. MECHANICAL CHARACTERISTICS ............................................................................................................. 7

4.1 MODULE DIMENSIONS .......................................................................................................................................... 7

4.2 PIN OUT DEFINITIONS .......................................................................................................................................... 8

4.3 PAD NUMBERINGS ................................................................................................................................................ 9

4.4 PAD SIZE ............................................................................................................................................................ 10

4.5 PIN DEFINITIONS ................................................................................................................................................ 11

5. BLOCK DIAGRAM ............................................................................................................................................. 14

6. WARRANTY ......................................................................................................................................................... 14

7. PACKAGE AND ASSEMBLY NOTES ............................................................................................................... 15

7.1 REEL SPECIFICATIONS ........................................................................................................................................ 15

7.2 CARRIER SPECIFICATIONS .................................................................................................................................. 15

7.3 TAPE PET COVER SPECIFICATION ...................................................................................................................... 16

7.4 TAPE PROTECTION RIBBON ................................................................................................................................ 16

7.5 PACKING INSTRUCTION ...................................................................................................................................... 16

7.6 ALUMINUM BAG LABEL ..................................................................................................................................... 18

7.7 WHITE BOX LABEL AND ALUMINUM BAG LABEL .............................................................................................. 18

7.8 CARTON LABEL .................................................................................................................................................. 18

7.9 PALLET SPECIFICATION ................................................................................................................................... 19

8. REGULATORY INFORMATION ...................................................................................................................... 21

8.1 FCC NOTICE (USA) ........................................................................................................................................... 21

8.2 FCC LABELING REQUIREMENTS ...................................................................................... 錯誤! 尚未定義書籤。

8.3 RF EXPOSURE .................................................................................................................. 錯誤! 尚未定義書籤。

8.4 INDUSTRY CANADA NOTICE ............................................................................................................................... 23

WD105

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List of Figures

FIGURE 1: PCB OUTLINE TOP VIEW (UNIT: MM) ........................................................................................................ 7

FIGURE 2: PIN OUT CONFIGURATION........................................................................................................................... 8

FIGURE 3: PAD LAYOUT (TOP VIEW) .......................................................................................................................... 9

FIGURE 4: PAD SIZE TOP VIEW (UNIT: MM) .............................................................................................................. 10

FIGURE 5: BLOCK DIAGRAMN ................................................................................................................................... 14

List of Tables

TABLE 1: PIN DEFINITIONS ....................................................................................................................................... 11

TABLE 1-1: PIN DEFINITIONS : SPI ............................................................................................................................ 12

TABLE 1-2: PIN DEFINITIONS : SDIO ........................................................................................................................ 12

TABLE 1-3: PIN DEFINITIONS : I2S ............................................................................................................................ 13

TABLE 1-4: PIN DEFINITIONS : JTAG ........................................................................................................................ 13

TABLE 1-5: PIN DEFINITIONS : HOST INTERFACES .................................................................................................... 13

TABLE 2: WHITE BOX LABEL SPECIFICATION ......................................................................................................... 18

TABLE 3: CARTON LABEL SPECIFICATION ............................................................................................................... 18

TABLE 4: PALLET DIMENSIONS SPECIFICATION ....................................................................................................... 19

TABLE 5: MAX. HEIGHT SPECIFICATION .................................................................................................................. 19

WD105

Datasheet

2014-03-20

1. Introduction

WD105 is IoE Smart Network module that enables wireless internet connectivity for any device

wishing to be monitored or managed remotely. The WD105 is architected for ultra-low power

consumption, with near-zero power consumption in power down modes with fast wakeup.

2. Features

• Fast wake up when loading firmware from inexpensive external NVMEM (SPI flash

device)

• Direct connect to a 50-Ω antenna

• Standard interfaces: SPI slave and GPIO

• On-SIP integrated IPv4/Ipv6 stack reduces CPU and Flash requirements on host

microcontroller.

• On-Board 4Mb flash to accommodate firmware.

• BSD-like interface provides a common easy interface across different operating systems,

simplifying porting of the IP Stack offload

• TCP or UDP operation

• Compatible with IEEE 802.11b/g and 802.11n standard.

WD105

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2014-03-20

3. Specification

Model Number WD105

Product Type 802.11n perforation IoE module

Memory Size 4Mbit of Flash

Host Interface(s) SPI, HSIC, USB2.0, SDIO (selectable, see Table 1-5)

Embedded MAC Address Yes

WiFi Chip(s) Qualcomm Atheros QCA4002

Package 27-pin perforation

Wireless Standard(s) IEEE 802.11b/g/n

Spreading IEEE 802.11b DSSS and 802.11g/n OFDM

Operating Frequency 2412~2484MHz ISM band

Antenna On-board PCB antenna. (On request an I-PEX plug leading

to an external antenna can be made available)

Number of Channels 11 (US), 13 (EU), 14 (Japan)

Data Rates 802.11n: up to 72.2Mbps

802.11g: 54Mbps with fallback to 48,36,24,18,12,9 and

6Mbps

802.11b: 11Mbps with fallback to 5.5, 1 and 1Mbps

Modulation Schemes 802.11g/n:

64QAM (up to 72.2Mbps),

16QAM (39/36/26/24Mbps),

QPSK (19.5/18/13/12Mbps),

BPSK (9/6.5/6Mbps)

802.11b:

CCK (11/5.5Mbps), DQPSK (2Mbps), DBPSK (1Mbps)

Tx Power (typical) 18dBm for 802.11b

14dBm for 802.11g

13dBm for 802.11n (MSC7)

Rx Sensitivity (typical) -92dBm for 1Mbps @ 8% PER

-85dBm for 11Mbps @ 8% PER

-72dBm for 54Mbps @ 10% PER

-69dBm for HT20, MCS7 @ 10% PER

Media Access Protocol CSMA/CA with ACK

Operating System Support Not Applicable. Controlled with a command set.

Tx Power (average)

WD105

Datasheet

2014-03-20

Model Number WD105

Power Requirements (typical) Tx mode :

11Mbps: 240mA

54Mbps: 210mA

72.2Mbps: 220mA

Rx mode :

11Mbps: 62mA

54Mbps: 62mA

72.2Mbps: 62mA

Dimensions 25 x 20 x 2.6 ±0.25 mm (typical)

Regulatory Conformance FCC Part 15b, Part 15c

RoHS Compliance Yes

Operating Temperatures 0 ~ 70oC

Software Functions n/a

WD105

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2014-03-20

4. Mechanical Characteristics

4.1 Module Dimensions

Figure 1: PCB Outline Top View (Unit: mm)

WD105

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2014-03-20

4.2 Pin Out Definitions

The logical definitions of the module’s pins are depicted below.

Figure 2: Pin out Configuration

WD105

Datasheet

2014-03-20

4.3 Pad Numberings

Pin numbers are defined according to the following map.

Figure 3: Pad Layout (Top View)

WD105

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2014-03-20

4.4 Pad Size

Pin numbers are defined according to the following map.

Figure 4: Pad Size Top View (Unit: mm)

WD105

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2014-03-20

4.5 Pin Definitions

This section describes module signals and the associated pins.

Table 1: Pin Definitions

Pin No. Pin name Description Genernal Type

1 Ground Ground P

2 VDDIO_SDIO Connect to 3.3V host I/O supply or 1.8V peripheral I/O supply P

3 UART1_CTS|TDO UART Clear to Send O

4 TCK|I2C_CLK I2C Clock I/O

5 UART1_TXD|TESTMODE UART1 Series Output. O

6 UART1_RXD|TMS UART1 Series intput. I

7 I2C_DATA|TDI I2C DATA I/O

8 SPI_CLK|SD_CLK|I2S2_MCK

9 Ground Ground P

10 3.3V Connect to 3.3V supply P

SPI_MISO|SD_DATA0|I2S2_WS|JTA

G_EN

12 USB_DP

USB D+ signal; carries USB data to and from the USB 2.0

PHY

IA/OA

13 USB_DN

USB D- signal; carries USB data to and from the USB 2.0

PHY

IA/OA

14 SPI_INT|SD_DATA1|I2S2_SDO

15 SD_DATA2|I2S2_SDI|HM0

16 SPI_MOSI|SD_DATA3|I2S2_BCK

17 SPI_CS|SD_CMD|HM1

18 CHIP_PWD# Chip power-down control I

19 Ground Ground P

20 DVDD_GPIO Connect to 3.3V host I/O supply or 1.8V peripheral I/O supply P

21 GPIO23 General purpose input/output 23 I/O

22 I2S1_WS|TRST_8x8

23 UART1_RTS Bluetooth UART Request to Send. O

WD105

Datasheet

2014-03-20

Pin No. Pin name Description Genernal Type

24 UART2_TXD|I2S1_SDI UART2 Series Output. O

25 UART2_RXD|TRST_7x7|I2S1_SDO UART2 Series Input. I

26 Ground Ground P

27 EXT_ANT option for external RF path, default not enable RF I/O

Table 1-1: Pin Definitions : SPI

Pin No. Pin name Host Interface

function1-SPI function1 type

8 SPI_CLK|SD_CLK|I2S2_MCK SPI Clock I/O

11 SPI_MISO|SD_DATA0|I2S2_WS|JTAG_EN SPI MISO O

14 SPI_INT|SD_DATA1|I2S2_SDO SPI INT I/O

16 SPI_MOSI|SD_DATA3|I2S2_BCK SPI MOSI I

17 SPI_CS|SD_CMD|HM1 SPI CS I

Table 1-2: Pin Definitions : SDIO

Pin No. Pin name Host Interface function1-SDIO function2 type

8 SPI_CLK|SD_CLK|I2S2_MCK SDIO Clock I/O

11 SPI_MISO|SD_DATA0|I2S2_WS|JTAG_EN SDIO Data Line 0. I/O

14 SPI_INT|SD_DATA1|I2S2_SDO SDIO Data Line 1. I/O

15 SD_DATA2|I2S2_SDI|HM0 SDIO Data Line 2. I/O

16 SPI_MOSI|SD_DATA3|I2S2_BCK SDIO Data Line 3. I/O

17 SPI_CS|SD_CMD|HM1 SDIO command line I/O

WD105

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2014-03-20

Table 1-3: Pin Definitions : I2S

Pin No. Pin name Interface function3 function3 type

8 SPI_CLK|SD_CLK|I2S2_MCK I2S2 MCK I/O

11 SPI_MISO|SD_DATA0|I2S2_WS|JTAG_EN I2S2 WS

14 SPI_INT|SD_DATA1|I2S2_SDO I2S2_SDO O

15 SD_DATA2|I2S2_SDI|HM0 I2S2_SDI I

16 SPI_MOSI|SD_DATA3|I2S2_BCK I2S2_BCK I/O

22 I2S1_WS|TRST_8x8 I2S1_WS I

24 UART2_TXD|I2S1_SDI I2S1_SDI I

25 UART2_RXD|TRST_7x7|I2S1_SDO I2S1_SDO O

Table 1-4: Pin Definitions : JTAG

Pin No. Pin name debug

function4 function4

type Bootstrap function4

3 UART1_CTS|TDO TDO I

4 TCK|I2C_CLK TCK I/O

5 UART1_TXD|TESTMODE

JTAG mode: TESTMODE,pull high

through 10 kohm to VDDIO_SDIO for

JTAG mode enable

6 UART1_RXD|TMS TMS I

7 I2C_DATA|TDI TDI I

11 SPI_MISO|SD_DATA0|I2S2_WS|JTAG_EN

JTAG mode: JTAG_EN ,pull high

through 10 kohm to VDDIO_SDIO for

JTAG mode enable

Table 1-5: Pin Definitions : Host Interfaces

Pin No. Pin name debug

function4 function4

type Bootstrap function4

15 SD_DATA2|I2S2_SDI|HM0 HM0: Host selection mode0

17 SPI_CS|SD_CMD|HM1 HM1: Host selection mode1

WD105

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2014-03-20

5. Block Diagram

Figure 5: Block Diagramn

6. Warranty

One year limited warranty.

WD105

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2014-03-20

7. Package and Assembly Notes

7.1 Reel Specifications

The following diagram depicts the reel specifications in shipping WD105.

(TBD)

Figure 6: Reel Specifications

7.2 Carrier Specifications

The following diagram depicts the carrier specifications in shipping WD105.

(TBD)

Figure 7: Carrier Specifications

WD105

Datasheet

2014-03-20

7.3 Tape PET Cover Specification

The following diagram depicts the Tape PET Cover specification in shipping WD105.

(TBD)

Figure 8: Tape PET Cover Specification

7.4 Tape Protection Ribbon

The following diagram depicts the Tape Protection Ribbon specification in shipping WD105.

(TBD)

Figure 9: Tape Protection Ribbon

7.5 Packing Instruction

The following diagram depicts the packing instruction specification in shipping WD105.

WD105

Datasheet

2014-03-20

Figure 10: Packing Instruction

WD105

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2014-03-20

7.6 Aluminum Bag Label

The following diagram depicts the Aluminum bag label specification in shipping WD105.

(TBD)

Figure 11: Aluminum Bag Label 1

7.7 White Box Label and Aluminum Bag Label

(TBD)

Figure 12: Box Label

Table 2: White Box Label Specification (TBD)

7.8 Carton Label

(TBD)

Figure 13: Carton Label

Table 3: Carton Label Specification (TBD)

WD105

Datasheet

2014-03-20

7.9 Pallet Specification

7.9.1 Pallet Dimensions

The following table the pallet specification in shipping WD105.

Table 4: Pallet Dimensions Specification

Shipping ways Pallet Size W x L x H

Air Shipment 113cm x 120cm x 12cm (recommended)

Sea Shipment 113cm x 120cm x 12cm (recommended)

7.9.2 Max. Height

The following table the max. height specification in shipping WD105.

Table 5: Max. Height Specification

Shipping ways Height Limitation (including pallet height)

Air Shipment Less than150cm

Sea Shipment Less than190cm

WD105

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2014-03-20

7.9.3 Pallet Packaging

a). V-boards and strapping:

a-1. Put 4 V-boards on the four side corners to prevent cartons collapse.

a-2. Put 4 V-boards on the four top edges.

a-3. Fix the unit by at least 2 pieces of PP straps.

b). Wrapping:

b-1. Put 3 layers at least on each surface.

b-2. Carton logo need to be recognized

if over 3 layers.

b-3. Make sure not to tighten too much

as it can damage he loads.

b-4. Need to seal the top layer with wrap.

V-boards and Strapping

4-way strapping, V-boards on side

corner and top edges

WD105

Datasheet

2014-03-20

8. Regulatory Information

8.1 FCC Notice (USA)

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This

device may not cause harmful interference, and (2) this device must accept any interference received, including

interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part

15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed

and used in accordance with the instructions, may cause harmful interference to radio communications. However,

there is no guarantee that interference will not occur in a particular installation. If this equipment does cause

harmful interference to radio or television reception, which can be determined by turning the equipment off and on,

the user is encouraged to try to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that

to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could

void the user's authority to operate this equipment.

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This

equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

WD105

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2014-03-20

This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM

integrator is still responsible for testing their end-product for any additional compliance requirements required

with this module installed

IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop

configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid

and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be

responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC

authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm

may be maintained between the antenna and users. The final end product must be labeled in a visible area with

the following: “Contains FCC ID: N89-WD105”. The grantee's FCC ID can be used only when all FCC

compliance requirements are met.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module. The end user

manual shall include all required regulatory information/warning as show in this manual.

WD105

Datasheet

2014-03-20

8.4 Industry Canada Notice

(TBD)

CyberTAN Technology WD105 1x1 802.11b/g/n module User Manual

CyberTAN Technology Inc. 1x1 802.11b/g/n module

User Manual.pdf

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