CyberTAN Technology WD105 1x1 802.11b/g/n module User Manual
CyberTAN Technology Inc. 1x1 802.11b/g/n module
User Manual.pdf
WD105 Datasheet CyberTAN Technology, Inc. Model Name WD105 Description 802.11n LGA IoE Module Version Release 0.3a Date March 20, 2014 Author Cindy Fan Confidential 2014-03-18 WD105 Datasheet Revision History Date Release Author Description 2013-06-11 0.1 Cindy Fan First preliminary release. 2013-06-18 0.2 Cindy Fan Engineering Release. 2013-08-23 0.2a Cindy Fan Temporary Engineering Revision. 2014-03-18 0.3 Cindy Fan Update §4. Mechanical Characteristics. 2014-03-20 0.3a Cindy Fan Add §8. Regulatory Information Related Documents Date Author Description Qualcomm Atheros QCA4002 datasheet IEEE.org IEEE 802.11b/g/n specifications CyberTAN Technology, Inc. No. 99, Park Avenue III Hsinchu Science Park Hsinchu, Taiwan 30077 R.O.C. ® ® CyberTAN is a registered trademark of CyberTAN Technology, Inc. Bluetooth is a trademark of the Bluetooth SIG. All other trademarks appearing herein are the property of their respective owners. This document may contain privileged or confidential information that is the property of CyberTAN Technology, Inc. and the improper disclosure of which is an offense punishable under law. This document may be viewed and used only by the individual or other entity that received it directly from CyberTAN. Redistribution of this document in any form is strictly prohibited. The products described in this document are not intended or designed for use in any application involving risk of harm to persons or property. CYBERTAN PROVIDES THIS DOCUMENT AS-IS, WITHOUT WARRANTY OF ANY KIND. CYBERTAN DISCLAIMS ALL WARRANTIES, EXPRESSED AND IMPLIED, INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT. 2014-03-20 WD105 Datasheet Table of Contents 1. INTRODUCTION ................................................................................................................................................ 4 2. FEATURES .......................................................................................................................................................... 4 3. SPECIFICATION ................................................................................................................................................. 5 4. MECHANICAL CHARACTERISTICS ............................................................................................................. 7 4.1 MODULE DIMENSIONS .......................................................................................................................................... 7 4.2 PIN OUT DEFINITIONS .......................................................................................................................................... 8 4.3 PAD NUMBERINGS ................................................................................................................................................ 9 4.4 PAD SIZE ............................................................................................................................................................ 10 4.5 PIN DEFINITIONS ................................................................................................................................................ 11 5. BLOCK DIAGRAM ............................................................................................................................................. 14 6. WARRANTY......................................................................................................................................................... 14 7. PACKAGE AND ASSEMBLY NOTES ............................................................................................................... 15 7.1 REEL SPECIFICATIONS ........................................................................................................................................ 15 7.2 CARRIER SPECIFICATIONS .................................................................................................................................. 15 7.3 TAPE PET COVER SPECIFICATION ...................................................................................................................... 16 7.4 TAPE PROTECTION RIBBON ................................................................................................................................ 16 7.5 PACKING INSTRUCTION ...................................................................................................................................... 16 7.6 ALUMINUM BAG LABEL ..................................................................................................................................... 18 7.7 WHITE BOX LABEL AND ALUMINUM BAG LABEL .............................................................................................. 18 7.8 CARTON LABEL .................................................................................................................................................. 18 7.9 PALLET SPECIFICATION ................................................................................................................................... 19 8. REGULATORY INFORMATION ...................................................................................................................... 21 8.1 FCC NOTICE (USA) ........................................................................................................................................... 21 8.2 FCC LABELING REQUIREMENTS ...................................................................................... 錯誤! 尚未定義書籤。 8.3 RF EXPOSURE .................................................................................................................. 錯誤! 尚未定義書籤。 8.4 INDUSTRY CANADA NOTICE ............................................................................................................................... 23 2014-03-20 WD105 Datasheet List of Figures FIGURE 1: PCB OUTLINE TOP VIEW (UNIT: MM) ........................................................................................................ 7 FIGURE 2: PIN OUT CONFIGURATION........................................................................................................................... 8 FIGURE 3: PAD LAYOUT (TOP VIEW) .......................................................................................................................... 9 FIGURE 4: PAD SIZE TOP VIEW (UNIT: MM) .............................................................................................................. 10 FIGURE 5: BLOCK DIAGRAMN ................................................................................................................................... 14 List of Tables TABLE 1: PIN DEFINITIONS ....................................................................................................................................... 11 TABLE 1-1: PIN DEFINITIONS : SPI............................................................................................................................ 12 TABLE 1-2: PIN DEFINITIONS : SDIO ........................................................................................................................ 12 TABLE 1-3: PIN DEFINITIONS : I2S ............................................................................................................................ 13 TABLE 1-4: PIN DEFINITIONS : JTAG........................................................................................................................ 13 TABLE 1-5: PIN DEFINITIONS : HOST INTERFACES .................................................................................................... 13 TABLE 2: WHITE BOX LABEL SPECIFICATION ......................................................................................................... 18 TABLE 3: CARTON LABEL SPECIFICATION ............................................................................................................... 18 TABLE 4: PALLET DIMENSIONS SPECIFICATION ....................................................................................................... 19 TABLE 5: MAX. HEIGHT SPECIFICATION .................................................................................................................. 19 2014-03-20 WD105 Datasheet 1. Introduction WD105 is IoE Smart Network module that enables wireless internet connectivity for any device wishing to be monitored or managed remotely. The WD105 is architected for ultra-low power consumption, with near-zero power consumption in power down modes with fast wakeup. 2. Features • • • • • • • • Fast wake up when loading firmware from inexpensive external NVMEM (SPI flash device) Direct connect to a 50-Ω antenna Standard interfaces: SPI slave and GPIO On-SIP integrated IPv4/Ipv6 stack reduces CPU and Flash requirements on host microcontroller. On-Board 4Mb flash to accommodate firmware. BSD-like interface provides a common easy interface across different operating systems, simplifying porting of the IP Stack offload TCP or UDP operation Compatible with IEEE 802.11b/g and 802.11n standard. 2014-03-20 WD105 Datasheet 3. Specification Model Number WD105 Product Type 802.11n perforation IoE module Memory Size 4Mbit of Flash Host Interface(s) SPI, HSIC, USB2.0, SDIO (selectable, see Table 1-5) Embedded MAC Address Yes WiFi Chip(s) Qualcomm Atheros QCA4002 Package 27-pin perforation Wireless Standard(s) IEEE 802.11b/g/n Spreading IEEE 802.11b DSSS and 802.11g/n OFDM Operating Frequency 2412~2484MHz ISM band Antenna On-board PCB antenna. (On request an I-PEX plug leading to an external antenna can be made available) Number of Channels 11 (US), 13 (EU), 14 (Japan) Data Rates 802.11n: up to 72.2Mbps 802.11g: 54Mbps with fallback to 48,36,24,18,12,9 and 6Mbps 802.11b: 11Mbps with fallback to 5.5, 1 and 1Mbps Modulation Schemes 802.11g/n: 64QAM (up to 72.2Mbps), 16QAM (39/36/26/24Mbps), QPSK (19.5/18/13/12Mbps), BPSK (9/6.5/6Mbps) 802.11b: CCK (11/5.5Mbps), DQPSK (2Mbps), DBPSK (1Mbps) Tx Tx Power Power(average) (typical) 18dBm for 802.11b 14dBm for 802.11g 13dBm for 802.11n (MSC7) Rx Sensitivity (typical) -92dBm for 1Mbps @ 8% PER -85dBm for 11Mbps @ 8% PER -72dBm for 54Mbps @ 10% PER -69dBm for HT20, MCS7 @ 10% PER Media Access Protocol CSMA/CA with ACK Operating System Support Not Applicable. Controlled with a command set. 2014-03-20 WD105 Datasheet Model Number WD105 Power Requirements (typical) Tx mode : 11Mbps: 240mA 54Mbps: 210mA 72.2Mbps: 220mA Rx mode : 11Mbps: 62mA 54Mbps: 62mA 72.2Mbps: 62mA Dimensions 25 x 20 x 2.6 ±0.25 mm (typical) Regulatory Conformance FCC Part 15b, Part 15c RoHS Compliance Yes Operating Temperatures 0 ~ 70oC Software Functions n/a 2014-03-20 WD105 Datasheet 4. Mechanical Characteristics 4.1 Module Dimensions Figure 1: PCB Outline Top View (Unit: mm) 2014-03-20 WD105 Datasheet 4.2 Pin Out Definitions The logical definitions of the module’s pins are depicted below. Figure 2: Pin out Configuration 2014-03-20 WD105 Datasheet 4.3 Pad Numberings Pin numbers are defined according to the following map. Figure 3: Pad Layout (Top View) 2014-03-20 WD105 Datasheet 4.4 Pad Size Pin numbers are defined according to the following map. Figure 4: Pad Size Top View (Unit: mm) 10 2014-03-20 WD105 Datasheet 4.5 Pin Definitions This section describes module signals and the associated pins. Table 1: Pin Definitions Pin No. Pin name Description Genernal Type Ground Ground VDDIO_SDIO Connect to 3.3V host I/O supply or 1.8V peripheral I/O supply UART1_CTS|TDO UART Clear to Send TCK|I2C_CLK I2C Clock UART1_TXD|TESTMODE UART1 Series Output. UART1_RXD|TMS UART1 Series intput. I2C_DATA|TDI I2C DATA SPI_CLK|SD_CLK|I2S2_MCK Ground Ground 10 3.3V Connect to 3.3V supply 11 I/O I/O SPI_MISO|SD_DATA0|I2S2_WS|JTA G_EN USB D+ signal; carries USB data to and from the USB 2.0 12 USB_DP 13 USB_DN 14 SPI_INT|SD_DATA1|I2S2_SDO 15 SD_DATA2|I2S2_SDI|HM0 16 SPI_MOSI|SD_DATA3|I2S2_BCK 17 SPI_CS|SD_CMD|HM1 18 CHIP_PWD# Chip power-down control 19 Ground Ground 20 DVDD_GPIO Connect to 3.3V host I/O supply or 1.8V peripheral I/O supply 21 GPIO23 General purpose input/output 23 22 I2S1_WS|TRST_8x8 23 UART1_RTS PHY USB D- signal; carries USB data to and from the USB 2.0 PHY Bluetooth UART Request to Send. 11 IA/OA IA/OA I/O 2014-03-20 WD105 Datasheet Pin No. Pin name Description Genernal Type 24 UART2_TXD|I2S1_SDI UART2 Series Output. 25 UART2_RXD|TRST_7x7|I2S1_SDO UART2 Series Input. 26 Ground Ground 27 EXT_ANT option for external RF path, default not enable RF I/O Table 1-1: Pin Definitions : SPI Pin name Host Interface function1-SPI SPI_CLK|SD_CLK|I2S2_MCK SPI Clock I/O 11 SPI_MISO|SD_DATA0|I2S2_WS|JTAG_EN SPI MISO 14 16 17 SPI_INT|SD_DATA1|I2S2_SDO SPI_MOSI|SD_DATA3|I2S2_BCK SPI_CS|SD_CMD|HM1 SPI INT SPI MOSI SPI CS I/O Pin No. function1 type Table 1-2: Pin Definitions : SDIO Pin No. Pin name Host Interface function1-SDIO SPI_CLK|SD_CLK|I2S2_MCK SDIO Clock I/O 11 SPI_MISO|SD_DATA0|I2S2_WS|JTAG_EN SDIO Data Line 0. I/O 14 15 16 17 SPI_INT|SD_DATA1|I2S2_SDO SD_DATA2|I2S2_SDI|HM0 SPI_MOSI|SD_DATA3|I2S2_BCK SPI_CS|SD_CMD|HM1 SDIO Data Line 1. SDIO Data Line 2. SDIO Data Line 3. SDIO command line I/O I/O I/O I/O 12 function2 type 2014-03-20 WD105 Datasheet Table 1-3: Pin Definitions : I2S Pin No. Pin name Interface function3 function3 type SPI_CLK|SD_CLK|I2S2_MCK I2S2 MCK 11 SPI_MISO|SD_DATA0|I2S2_WS|JTAG_EN I2S2 WS 14 SPI_INT|SD_DATA1|I2S2_SDO I2S2_SDO 15 SD_DATA2|I2S2_SDI|HM0 I2S2_SDI 16 SPI_MOSI|SD_DATA3|I2S2_BCK I2S2_BCK I/O 22 I2S1_WS|TRST_8x8 I2S1_WS 24 UART2_TXD|I2S1_SDI I2S1_SDI 25 UART2_RXD|TRST_7x7|I2S1_SDO I2S1_SDO I/O Table 1-4: Pin Definitions : JTAG Pin No. Pin name UART1_CTS|TDO TCK|I2C_CLK UART1_TXD|TESTMODE UART1_RXD|TMS I2C_DATA|TDI 11 SPI_MISO|SD_DATA0|I2S2_WS|JTAG_EN debug function4 function4 type TDO TCK I/O Bootstrap function4 JTAG mode: TESTMODE,pull high through 10 kohm to VDDIO_SDIO for JTAG mode enable TMS TDI JTAG mode: JTAG_EN ,pull high through 10 kohm to VDDIO_SDIO for JTAG mode enable Table 1-5: Pin Definitions : Host Interfaces Pin No. Pin name 15 17 debug function4 SD_DATA2|I2S2_SDI|HM0 SPI_CS|SD_CMD|HM1 function4 type Bootstrap function4 HM0: Host selection mode0 HM1: Host selection mode1 13 2014-03-20 WD105 Datasheet 5. Block Diagram Figure 5: Block Diagramn 6. Warranty One year limited warranty. 14 2014-03-20 WD105 Datasheet 7. Package and Assembly Notes 7.1 Reel Specifications The following diagram depicts the reel specifications in shipping WD105. (TBD) Figure 6: Reel Specifications 7.2 Carrier Specifications The following diagram depicts the carrier specifications in shipping WD105. (TBD) Figure 7: Carrier Specifications 15 2014-03-20 WD105 Datasheet 7.3 Tape PET Cover Specification The following diagram depicts the Tape PET Cover specification in shipping WD105. (TBD) Figure 8: Tape PET Cover Specification 7.4 Tape Protection Ribbon The following diagram depicts the Tape Protection Ribbon specification in shipping WD105. (TBD) Figure 9: Tape Protection Ribbon 7.5 Packing Instruction The following diagram depicts the packing instruction specification in shipping WD105. 16 2014-03-20 WD105 Datasheet Figure 10: Packing Instruction 17 2014-03-20 WD105 Datasheet 7.6 Aluminum Bag Label The following diagram depicts the Aluminum bag label specification in shipping WD105. (TBD) Figure 11: Aluminum Bag Label 1 7.7 White Box Label and Aluminum Bag Label (TBD) Figure 12: Box Label Table 2: White Box Label Specification (TBD) 7.8 Carton Label (TBD) Figure 13: Carton Label Table 3: Carton Label Specification 18 (TBD) 2014-03-20 WD105 Datasheet 7.9 Pallet Specification 7.9.1 Pallet Dimensions The following table the pallet specification in shipping WD105. Table 4: Pallet Dimensions Specification Shipping ways Pallet Size W x L x H Air Shipment 113cm x 120cm x 12cm (recommended) Sea Shipment 113cm x 120cm x 12cm (recommended) 7.9.2 Max. Height The following table the max. height specification in shipping WD105. Table 5: Max. Height Specification Shipping ways Height Limitation (including pallet height) Air Shipment Less than150cm Sea Shipment Less than190cm 19 2014-03-20 WD105 Datasheet 7.9.3 Pallet Packaging a). V-boards and strapping: a-1. Put 4 V-boards on the four side corners to prevent cartons collapse. a-2. Put 4 V-boards on the four top edges. a-3. Fix the unit by at least 2 pieces of PP straps. b). Wrapping: b-1. Put 3 layers at least on each surface. b-2. Carton logo need to be recognized if over 3 layers. b-3. Make sure not to tighten too much as it can damage he loads. b-4. Need to seal the top layer with wrap. 4-way strapping, V-boards on side corner and top edges V-boards and Strapping 20 2014-03-20 WD105 Datasheet 8. Regulatory Information 8.1 FCC Notice (USA) This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. - Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. 21 2014-03-20 WD105 Datasheet This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization. End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: N89-WD105”. The grantee's FCC ID can be used only when all FCC compliance requirements are met. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 22 2014-03-20 WD105 Datasheet 8.4 Industry Canada Notice (TBD) 23 2014-03-20
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