CyberTAN Technology WD105 1x1 802.11b/g/n module User Manual

CyberTAN Technology Inc. 1x1 802.11b/g/n module

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Document Author: 92145

WD105
Datasheet
CyberTAN Technology, Inc.
Model Name
WD105
Description
802.11n LGA IoE Module
Version
Release 0.3a
Date
March 20, 2014
Author
Cindy Fan
Confidential
2014-03-18
WD105
Datasheet
Revision History
Date
Release
Author
Description
2013-06-11
0.1
Cindy Fan
First preliminary release.
2013-06-18
0.2
Cindy Fan
Engineering Release.
2013-08-23
0.2a
Cindy Fan
Temporary Engineering Revision.
2014-03-18
0.3
Cindy Fan
Update §4. Mechanical Characteristics.
2014-03-20
0.3a
Cindy Fan
Add §8. Regulatory Information
Related Documents
Date
Author
Description
Qualcomm Atheros QCA4002 datasheet
IEEE.org
IEEE 802.11b/g/n specifications
CyberTAN Technology, Inc.
No. 99, Park Avenue III
Hsinchu Science Park
Hsinchu, Taiwan 30077
R.O.C.
®
®
CyberTAN is a registered trademark of CyberTAN Technology, Inc. Bluetooth is a trademark of the Bluetooth SIG.
All other trademarks appearing herein are the property of their respective owners.
This document may contain privileged or confidential information that is the property of CyberTAN Technology, Inc.
and the improper disclosure of which is an offense punishable under law. This document may be viewed and used only
by the individual or other entity that received it directly from CyberTAN. Redistribution of this document in any form
is strictly prohibited.
The products described in this document are not intended or designed for use in any application involving risk of harm
to persons or property. CYBERTAN PROVIDES THIS DOCUMENT AS-IS, WITHOUT WARRANTY OF ANY
KIND. CYBERTAN DISCLAIMS ALL WARRANTIES, EXPRESSED AND IMPLIED, INCLUDING, WITHOUT
LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, AND NON-INFRINGEMENT.
2014-03-20
WD105
Datasheet
Table of Contents
1.
INTRODUCTION ................................................................................................................................................ 4
2.
FEATURES .......................................................................................................................................................... 4
3.
SPECIFICATION ................................................................................................................................................. 5
4.
MECHANICAL CHARACTERISTICS ............................................................................................................. 7
4.1 MODULE DIMENSIONS .......................................................................................................................................... 7
4.2 PIN OUT DEFINITIONS .......................................................................................................................................... 8
4.3 PAD NUMBERINGS ................................................................................................................................................ 9
4.4 PAD SIZE ............................................................................................................................................................ 10
4.5 PIN DEFINITIONS ................................................................................................................................................ 11
5. BLOCK DIAGRAM ............................................................................................................................................. 14
6. WARRANTY......................................................................................................................................................... 14
7. PACKAGE AND ASSEMBLY NOTES ............................................................................................................... 15
7.1 REEL SPECIFICATIONS ........................................................................................................................................ 15
7.2 CARRIER SPECIFICATIONS .................................................................................................................................. 15
7.3 TAPE PET COVER SPECIFICATION ...................................................................................................................... 16
7.4 TAPE PROTECTION RIBBON ................................................................................................................................ 16
7.5 PACKING INSTRUCTION ...................................................................................................................................... 16
7.6 ALUMINUM BAG LABEL ..................................................................................................................................... 18
7.7 WHITE BOX LABEL AND ALUMINUM BAG LABEL .............................................................................................. 18
7.8 CARTON LABEL .................................................................................................................................................. 18
7.9 PALLET SPECIFICATION ................................................................................................................................... 19
8. REGULATORY INFORMATION ...................................................................................................................... 21
8.1 FCC NOTICE (USA) ........................................................................................................................................... 21
8.2 FCC LABELING REQUIREMENTS ...................................................................................... 錯誤! 尚未定義書籤。
8.3 RF EXPOSURE .................................................................................................................. 錯誤! 尚未定義書籤。
8.4 INDUSTRY CANADA NOTICE ............................................................................................................................... 23
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WD105
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List of Figures
FIGURE 1: PCB OUTLINE TOP VIEW (UNIT: MM) ........................................................................................................ 7
FIGURE 2: PIN OUT CONFIGURATION........................................................................................................................... 8
FIGURE 3: PAD LAYOUT (TOP VIEW) .......................................................................................................................... 9
FIGURE 4: PAD SIZE TOP VIEW (UNIT: MM) .............................................................................................................. 10
FIGURE 5: BLOCK DIAGRAMN ................................................................................................................................... 14
List of Tables
TABLE 1: PIN DEFINITIONS ....................................................................................................................................... 11
TABLE 1-1: PIN DEFINITIONS : SPI............................................................................................................................ 12
TABLE 1-2: PIN DEFINITIONS : SDIO ........................................................................................................................ 12
TABLE 1-3: PIN DEFINITIONS : I2S ............................................................................................................................ 13
TABLE 1-4: PIN DEFINITIONS : JTAG........................................................................................................................ 13
TABLE 1-5: PIN DEFINITIONS : HOST INTERFACES .................................................................................................... 13
TABLE 2: WHITE BOX LABEL SPECIFICATION ......................................................................................................... 18
TABLE 3: CARTON LABEL SPECIFICATION ............................................................................................................... 18
TABLE 4: PALLET DIMENSIONS SPECIFICATION ....................................................................................................... 19
TABLE 5: MAX. HEIGHT SPECIFICATION .................................................................................................................. 19
2014-03-20
WD105
Datasheet
1. Introduction
WD105 is IoE Smart Network module that enables wireless internet connectivity for any device
wishing to be monitored or managed remotely. The WD105 is architected for ultra-low power
consumption, with near-zero power consumption in power down modes with fast wakeup.
2. Features
•
•
•
•
•
•
•
•
Fast wake up when loading firmware from inexpensive external NVMEM (SPI flash
device)
Direct connect to a 50-Ω antenna
Standard interfaces: SPI slave and GPIO
On-SIP integrated IPv4/Ipv6 stack reduces CPU and Flash requirements on host
microcontroller.
On-Board 4Mb flash to accommodate firmware.
BSD-like interface provides a common easy interface across different operating systems,
simplifying porting of the IP Stack offload
TCP or UDP operation
Compatible with IEEE 802.11b/g and 802.11n standard.
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WD105
Datasheet
3. Specification
Model Number
WD105
Product Type
802.11n perforation IoE module
Memory Size
4Mbit of Flash
Host Interface(s)
SPI, HSIC, USB2.0, SDIO (selectable, see Table 1-5)
Embedded MAC Address
Yes
WiFi Chip(s)
Qualcomm Atheros QCA4002
Package
27-pin perforation
Wireless Standard(s)
IEEE 802.11b/g/n
Spreading
IEEE 802.11b DSSS and 802.11g/n OFDM
Operating Frequency
2412~2484MHz ISM band
Antenna
On-board PCB antenna. (On request an I-PEX plug leading
to an external antenna can be made available)
Number of Channels
11 (US), 13 (EU), 14 (Japan)
Data Rates
802.11n: up to 72.2Mbps
802.11g: 54Mbps with fallback to 48,36,24,18,12,9 and
6Mbps
802.11b: 11Mbps with fallback to 5.5, 1 and 1Mbps
Modulation Schemes
802.11g/n:
64QAM (up to 72.2Mbps),
16QAM (39/36/26/24Mbps),
QPSK (19.5/18/13/12Mbps),
BPSK (9/6.5/6Mbps)
802.11b:
CCK (11/5.5Mbps), DQPSK (2Mbps), DBPSK (1Mbps)
Tx
Tx Power
Power(average)
(typical)
18dBm for 802.11b
14dBm for 802.11g
13dBm for 802.11n (MSC7)
Rx Sensitivity (typical)
-92dBm for 1Mbps @ 8% PER
-85dBm for 11Mbps @ 8% PER
-72dBm for 54Mbps @ 10% PER
-69dBm for HT20, MCS7 @ 10% PER
Media Access Protocol
CSMA/CA with ACK
Operating System Support
Not Applicable. Controlled with a command set.
2014-03-20
WD105
Datasheet
Model Number
WD105
Power Requirements (typical)
Tx mode :
11Mbps: 240mA
54Mbps: 210mA
72.2Mbps: 220mA
Rx mode :
11Mbps: 62mA
54Mbps: 62mA
72.2Mbps: 62mA
Dimensions
25 x 20 x 2.6 ±0.25 mm (typical)
Regulatory Conformance
FCC Part 15b, Part 15c
RoHS Compliance
Yes
Operating Temperatures
0 ~ 70oC
Software Functions
n/a
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WD105
Datasheet
4. Mechanical Characteristics
4.1 Module Dimensions
Figure 1: PCB Outline Top View (Unit: mm)
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WD105
Datasheet
4.2 Pin Out Definitions
The logical definitions of the module’s pins are depicted below.
Figure 2: Pin out Configuration
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WD105
Datasheet
4.3 Pad Numberings
Pin numbers are defined according to the following map.
Figure 3: Pad Layout (Top View)
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WD105
Datasheet
4.4 Pad Size
Pin numbers are defined according to the following map.
Figure 4: Pad Size Top View (Unit: mm)
10
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WD105
Datasheet
4.5 Pin Definitions
This section describes module signals and the associated pins.
Table 1: Pin Definitions
Pin No. Pin name
Description
Genernal Type
Ground
Ground
VDDIO_SDIO
Connect to 3.3V host I/O supply or 1.8V peripheral I/O supply
UART1_CTS|TDO
UART Clear to Send
TCK|I2C_CLK
I2C Clock
UART1_TXD|TESTMODE
UART1 Series Output.
UART1_RXD|TMS
UART1 Series intput.
I2C_DATA|TDI
I2C DATA
SPI_CLK|SD_CLK|I2S2_MCK
Ground
Ground
10
3.3V
Connect to 3.3V supply
11
I/O
I/O
SPI_MISO|SD_DATA0|I2S2_WS|JTA
G_EN
USB D+ signal; carries USB data to and from the USB 2.0
12
USB_DP
13
USB_DN
14
SPI_INT|SD_DATA1|I2S2_SDO
15
SD_DATA2|I2S2_SDI|HM0
16
SPI_MOSI|SD_DATA3|I2S2_BCK
17
SPI_CS|SD_CMD|HM1
18
CHIP_PWD#
Chip power-down control
19
Ground
Ground
20
DVDD_GPIO
Connect to 3.3V host I/O supply or 1.8V peripheral I/O supply
21
GPIO23
General purpose input/output 23
22
I2S1_WS|TRST_8x8
23
UART1_RTS
PHY
USB D- signal; carries USB data to and from the USB 2.0
PHY
Bluetooth UART Request to Send.
11
IA/OA
IA/OA
I/O
2014-03-20
WD105
Datasheet
Pin No. Pin name
Description
Genernal Type
24
UART2_TXD|I2S1_SDI
UART2 Series Output.
25
UART2_RXD|TRST_7x7|I2S1_SDO
UART2 Series Input.
26
Ground
Ground
27
EXT_ANT
option for external RF path, default not enable
RF I/O
Table 1-1: Pin Definitions : SPI
Pin name
Host Interface
function1-SPI
SPI_CLK|SD_CLK|I2S2_MCK
SPI Clock
I/O
11
SPI_MISO|SD_DATA0|I2S2_WS|JTAG_EN
SPI MISO
14
16
17
SPI_INT|SD_DATA1|I2S2_SDO
SPI_MOSI|SD_DATA3|I2S2_BCK
SPI_CS|SD_CMD|HM1
SPI INT
SPI MOSI
SPI CS
I/O
Pin No.
function1 type
Table 1-2: Pin Definitions : SDIO
Pin No.
Pin name
Host Interface function1-SDIO
SPI_CLK|SD_CLK|I2S2_MCK
SDIO Clock
I/O
11
SPI_MISO|SD_DATA0|I2S2_WS|JTAG_EN
SDIO Data Line 0.
I/O
14
15
16
17
SPI_INT|SD_DATA1|I2S2_SDO
SD_DATA2|I2S2_SDI|HM0
SPI_MOSI|SD_DATA3|I2S2_BCK
SPI_CS|SD_CMD|HM1
SDIO Data Line 1.
SDIO Data Line 2.
SDIO Data Line 3.
SDIO command line
I/O
I/O
I/O
I/O
12
function2 type
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WD105
Datasheet
Table 1-3: Pin Definitions : I2S
Pin No.
Pin name
Interface function3
function3 type
SPI_CLK|SD_CLK|I2S2_MCK
I2S2 MCK
11
SPI_MISO|SD_DATA0|I2S2_WS|JTAG_EN
I2S2 WS
14
SPI_INT|SD_DATA1|I2S2_SDO
I2S2_SDO
15
SD_DATA2|I2S2_SDI|HM0
I2S2_SDI
16
SPI_MOSI|SD_DATA3|I2S2_BCK
I2S2_BCK
I/O
22
I2S1_WS|TRST_8x8
I2S1_WS
24
UART2_TXD|I2S1_SDI
I2S1_SDI
25
UART2_RXD|TRST_7x7|I2S1_SDO
I2S1_SDO
I/O
Table 1-4: Pin Definitions : JTAG
Pin No. Pin name
UART1_CTS|TDO
TCK|I2C_CLK
UART1_TXD|TESTMODE
UART1_RXD|TMS
I2C_DATA|TDI
11
SPI_MISO|SD_DATA0|I2S2_WS|JTAG_EN
debug
function4
function4
type
TDO
TCK
I/O
Bootstrap function4
JTAG mode: TESTMODE,pull high
through 10 kohm to VDDIO_SDIO for
JTAG mode enable
TMS
TDI
JTAG mode: JTAG_EN ,pull high
through 10 kohm to VDDIO_SDIO for
JTAG mode enable
Table 1-5: Pin Definitions : Host Interfaces
Pin No. Pin name
15
17
debug
function4
SD_DATA2|I2S2_SDI|HM0
SPI_CS|SD_CMD|HM1
function4
type
Bootstrap function4
HM0: Host selection mode0
HM1: Host selection mode1
13
2014-03-20
WD105
Datasheet
5. Block Diagram
Figure 5: Block Diagramn
6. Warranty
One year limited warranty.
14
2014-03-20
WD105
Datasheet
7. Package and Assembly Notes
7.1 Reel Specifications
The following diagram depicts the reel specifications in shipping WD105.
(TBD)
Figure 6: Reel Specifications
7.2 Carrier Specifications
The following diagram depicts the carrier specifications in shipping WD105.
(TBD)
Figure 7: Carrier Specifications
15
2014-03-20
WD105
Datasheet
7.3 Tape PET Cover Specification
The following diagram depicts the Tape PET Cover specification in shipping WD105.
(TBD)
Figure 8: Tape PET Cover Specification
7.4 Tape Protection Ribbon
The following diagram depicts the Tape Protection Ribbon specification in shipping WD105.
(TBD)
Figure 9: Tape Protection Ribbon
7.5 Packing Instruction
The following diagram depicts the packing instruction specification in shipping WD105.
16
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WD105
Datasheet
Figure 10: Packing Instruction
17
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WD105
Datasheet
7.6 Aluminum Bag Label
The following diagram depicts the Aluminum bag label specification in shipping WD105.
(TBD)
Figure 11: Aluminum Bag Label 1
7.7 White Box Label and Aluminum Bag Label
(TBD)
Figure 12: Box Label
Table 2: White Box Label Specification
(TBD)
7.8 Carton Label
(TBD)
Figure 13: Carton Label
Table 3: Carton Label Specification
18
(TBD)
2014-03-20
WD105
Datasheet
7.9 Pallet Specification
7.9.1 Pallet Dimensions
The following table the pallet specification in shipping WD105.
Table 4: Pallet Dimensions Specification
Shipping ways
Pallet Size W x L x H
Air Shipment
113cm x 120cm x 12cm (recommended)
Sea Shipment
113cm x 120cm x 12cm (recommended)
7.9.2 Max. Height
The following table the max. height specification in shipping WD105.
Table 5: Max. Height Specification
Shipping ways
Height Limitation (including pallet height)
Air Shipment
Less than150cm
Sea Shipment
Less than190cm
19
2014-03-20
WD105
Datasheet
7.9.3 Pallet Packaging
a). V-boards and strapping:
a-1. Put 4 V-boards on the four side corners to prevent cartons collapse.
a-2. Put 4 V-boards on the four top edges.
a-3. Fix the unit by at least 2 pieces of PP straps.
b). Wrapping:
b-1. Put 3 layers at least on each surface.
b-2. Carton logo need to be recognized
if over 3 layers.
b-3. Make sure not to tighten too much
as it can damage he loads.
b-4. Need to seal the top layer with wrap.
4-way strapping, V-boards on side
corner and top edges
V-boards and Strapping
20
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WD105
Datasheet
8. Regulatory Information
8.1 FCC Notice (USA)
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this equipment does cause
harmful interference to radio or television reception, which can be determined by turning the equipment off and on,
the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could
void the user's authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Radiation Exposure Statement:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
21
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WD105
Datasheet
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements required
with this module installed
IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop
configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid
and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC
authorization.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm
may be maintained between the antenna and users. The final end product must be labeled in a visible area with
the following: “Contains FCC ID: N89-WD105”. The grantee's FCC ID can be used only when all FCC
compliance requirements are met.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end user
manual shall include all required regulatory information/warning as show in this manual.
22
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WD105
Datasheet
8.4 Industry Canada Notice
(TBD)
23
2014-03-20

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FCC ID Filing: N89-WD105

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