Cypress Semiconductor 3025 Bluetooth Module User Manual CYBT 013033 01 EZ BT Module

Cypress Semiconductor Bluetooth Module CYBT 013033 01 EZ BT Module

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3025 User Manual

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Document Number: 002-xxxxx Rev. ** Page 2 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00ContentsOverview............................................................................ 3Functional Block Diagram ........................................... 3Module Description...................................................... 3Pad Connection Interface ................................................ 5Recommended Host PCB Layout ................................... 6Module Connections ........................................................ 8Connections and Optional External Components ..... 10Power Connections (VDD) ........................................ 10External Reset (XRES).............................................. 10External Component Recommendation .................... 10Critical Components List ........................................... 12Antenna Design......................................................... 12Bluetooth Baseband Core ............................................. 13Infrared Modulator.......................................................... 14Infrared Learning ............................................................ 15Wireless Charging .......................................................... 16Security ........................................................................... 16Support for NFC Tag Based Pairing ............................. 16Bluetooth Smart Audio .................................................. 16ADC Port.......................................................................... 17Serial Peripheral Interface ............................................. 18Microprocessor Unit....................................................... 18Internal Reset ............................................................ 19External Reset (XRES).............................................. 19Integrated Radio Transceiver ........................................ 20Transmitter Path........................................................ 20Digital Modulator ....................................................... 20Power Amplifier ......................................................... 20Receiver Path............................................................ 20Digital Demodulator and Bit Synchronizer................. 20Receiver Signal Strength Indicator............................ 20Local Oscillator.......................................................... 20Calibration ................................................................. 20Internal LDO Regulator ............................................. 20Peripheral Transport Unit .............................................. 21Broadcom Serial Communications Interface............. 21Peripheral Block ........................................................ 21GPIO Port ........................................................................ 22PWM................................................................................. 23Power Management Unit................................................ 24RF Power Management ............................................ 24Host Controller Power Management ......................... 24BBC Power Management.......................................... 24Electrical Characteristics............................................... 25RF Specifications ........................................................... 28Timing and AC Characteristics ..................................... 30UART Timing............................................................. 30SPI Timing................................................................. 30BSC Interface Timing ................................................ 31Environmental Specifications ....................................... 33Environmental Compliance ....................................... 33RF Certification.......................................................... 33Safety Certification .................................................... 33Environmental Conditions ......................................... 33ESD and EMI Protection ........................................... 33Regulatory Information.................................................. 34FCC........................................................................... 34Industry Canada (IC) Certification............................. 35European R&TTE Declaration of Conformity ............ 35MIC Japan................................................................. 36Packaging........................................................................ 37Ordering Information...................................................... 39Acronyms........................................................................ 40Document Conventions ................................................. 40Units of Measure ....................................................... 40Document History Page................................................. 41Sales, Solutions, and Legal Information ...................... 42Worldwide Sales and Design Support....................... 42Products .................................................................... 42PSoC® Solutions ...................................................... 42Cypress Developer Community................................. 42Technical Support ..................................................... 42

Document Number: 002-xxxxx Rev. ** Page 3 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00OverviewFunctional Block DiagramFigure 1 illustrates the CYBLE-0130XX-00 functional block diagram.Figure 1. Functional Block Diagram Module DescriptionThe CYBLE-0130XX-00 module is a complete module designed to be soldered to the applications main board. Module Dimensions and DrawingCypress reserves the right to select components from various vendors to achieve the Bluetooth module functionality. Such selectionswill still guarantee that all mechanical specifications and module certifications are maintained. Designs should be held within thephysical dimensions shown in the mechanical drawings in Figure 2 on page 4. All dimensions are in millimeters (mm).Table 1. Module Design DimensionsSee Figure 2 for the mechanical reference drawing for CYBLE-0130XX-00.Dimension Item SpecificationModule dimensions Length (X) 14.52 ± 0.10 mmWidth (Y) 19.50 ± 0.10 mmAntenna connection location dimensions Length (X) 14.52 mmWidth (Y) 4.80 mmPCB thickness Height (H) 0.80 ± 0.10 mmShield height Height (H) 1.45 mm typicalMaximum component height Height (H) 1.45 mm typicalTotal module thickness (bottom of module to highest component) Height (H) 2.25 mm typical

Document Number: 002-xxxxx Rev. ** Page 4 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Figure 2. Module Mechanical DrawingBottom View (Seen from Bottom)Side ViewTop View (See from Top)Notes2. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see “Recommended Host PCB Layout” on page 6.3. The CYBLE-0130XX-00 includes castellated pad connections, denoted as the circular openings at the pad location above.

Document Number: 002-xxxxx Rev. ** Page 5 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Pad Connection InterfaceAs shown in the bottom view of Figure 2 on page 4, the CYBLE-0130XX-00 connects to the host board via solder pads on the backsideof the module. Table 2 and Figure 3 detail the solder pad length, width, and pitch dimensions of the CYBLE-0130XX-00 module. Figure 3. Solder Pad Dimensions (Seen from Bottom)To maximize RF performance, the host layout should follow these recommendations:1. The ideal placement of the Cypress BLE module is in a corner of the host board with the trace antenna located at the far corner. This placement minimizes the additional recommended keep out area stated in item 2. Please refer to AN96841 for module placement best practices.2. To maximize RF performance, the area immediately around the Cypress BLE module trace antenna should contain an additional keep out area, where no grounding or signal trace are contained. The keep out area applies to all layers of the host board. The recommended dimensions of the host PCB keep out area are shown in Figure 4 (dimensions are in mm). Figure 4. Recommended Host PCB Keep Out Area Around the CYBLE-0130XX-00 AntennaTable 2. Connection DescriptionName Connections Connection Type Pad Length Dimension Pad Width Dimension Pad PitchSP 31 Solder Pads 1.02 mm 0.71 mm 1.27 mm

Document Number: 002-xxxxx Rev. ** Page 6 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Recommended Host PCB LayoutFigure 5, Figure 6, Figure 7, and Table 3 provide details that can be used for the recommended host PCB layout pattern for theCYBLE-0130XX-00. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.635 mm from center of the padon either side) shown in Figure 7 is the minimum recommended host pad length. The host PCB layout pattern can be completed usingeither Figure 5, Figure 6, or Figure 7. It is not necessary to use all figures to complete the host PCB layout pattern. Figure 5. CYBLE-0130XX-00 Host Layout (Dimensioned) Figure 6. CYBLE-0130XX-00 Host Layout (Relative to Origin)Top View (Seen on Host PCB)Top View (Seen on Host PCB)

Document Number: 002-xxxxx Rev. ** Page 7 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Tab l e 3 provides the center location for each solder pad on the CYBLE-0130XX-00. All dimensions reference the to the center of thesolder pad. Refer to Figure 6 for the location of each module solder pad. Table 3. Module Solder Pad Location Figure 7. Solder Pad Reference LocationSolder Pad(Center of Pad)Location (X,Y) from Orign (mm)Dimension from Orign (mils)1 (0.39, 4.88) (15.35, 192.13)2 (0.39, 6.15) (15.35, 242.13)3 (0.39, 7.42) (15.35, 292.13)4 (0.39, 8.69) (15.35, 342.13)5 (0.39, 9.96) (15.35, 392.13)6 (0.39, 11.23) (15.35, 442.13)7 (0.39, 12.50) (15.35, 492.13)8 (0.39, 13.77) (15.35, 542.13)9 (0.39, 15.04) (15.35, 592.13)10 (0.39, 16.31) (15.35, 642.13)11 (0.39, 17.58) (15.35, 692.13)12 (2.04, 18.82) (80.31, 740.94)13 (3.31, 18.82) (130.31, 740.94)14 (4.58, 18.82) (180.31, 740.94)15 (5.85, 18.82) (230.31, 740.94)16 (7.12, 18.82) (280.31, 740.94)17 (8.39, 18.82) (330.31, 740.94)18 (9.66, 18.82) (380.31, 740.94)19 (10.93, 18.82) (430.31, 740.94)20 (12.20, 18.82) (480.31, 740.94)21 (13.47, 18.82) (530.31, 740.94)22 (14.14, 16.31) (556.69, 642.12)23 (14.14, 15.04) (556.69, 592.12)24 (14.14, 13.77) (556.69, 542.12)25 (14.14, 12.50) (556.69, 492.12)26 (14.14, 11.23) (556.69, 442.12)27 (14.14, 9.96) (556.69, 392.12)28 (14.14, 8.69) (556.69, 342.12)29 (14.14, 7.42) (556.69, 292.12)30 (14.14, 6.15) (556.69, 242.12)31 (14.14, 4.88) (556.69, 192.12)Top View (Seen on Host PCB)

Document Number: 002-xxxxx Rev. ** Page 8 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Module ConnectionsTab l e 4 and Table 5 detail the solder pad connection definitions and available functions for the pad connections for theCYBLE-013025-00 and CYBLE-013030-00 respectively. Table 4 and Ta ble 5 lists the solder pads on the CYBLE-0130XX-00 modules,the silicon device pin, and denotes what functions are available for each solder pad.Table 4. CYBLE-013025-00 Solder Pad Connection Definitions Pad Num-ber Pad Name UART/SPI/I2C PWM GPIO Other Function1 XRES Power Supply Input (3.30V)2 GND/NC Ground Can be NC3 GND/NC Ground Can be NC4 P11/27 SPI2_MOSI(master/slave) 33ADC input, QOC, XTALI32K5 P12/26 SPI2_CS(slave) 33ADC input, QOC, XTALO32K6P15 3ADC input, SWDIO, IR_RX7 P14/38 SPI2_MOSI(master/slave) 33ADC Input, IR_TX8P13/28 33ADC input, QOC, IR_TX9P24PUART_RX,SPI2_CLK(master/slave)) 310 NC Not Connect11 NC Not Connect12 P25 PUART_RX,SPI2_MISO(master/slave) 313 P4 PUART_RX,SPI2_MOSI(master/slave) 3IR_TX, Q_Y014 P2 PUART_RX,SPI2_MOSI(master)/SPI2_CS(slave) 3QDX015 VDD VDD16 P3 PUART_CTS,SPI2_CLK(master/slave) 3QDX117 P8/33 3ADC input, TX_PD, QDX1,ACLK118 P32 3ADC input, ACLK019 P1 PUART_RTS,SPI2_MISO 3ADC input, IR_TX20 P0 PUART_TX,SPI2_MOSI(master/slave) 3ADC input, IR_RX21 SDA I2C_SDA 322 SCL I2C_SCL 323 UP_TX 3(UART_TXD) 324 UP_RX 3(UART_RXD) 325 GND Ground26 GND Ground27 GND Ground28 GND Ground29 NC Not Connect30 NC Not Connect31 NC Not Connect

Document Number: 002-xxxxx Rev. ** Page 9 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Table 5. CYBLE-013030-00 Solder Pad Connection Definitions Pad Num-ber Pad Name UART/SPI/I2C PWM GPIO Other Function1 XRES Power Supply Input (3.30V)2 GND/NC Ground Can be NC3 GND/NC Ground Can be NC4 P11/27 SPI2_MOSI(master/slave) 33ADC input, QOC, XTALI32K5 P12/26 SPI2_CS(slave) 33ADC input, QOC, XTALO32K6P15 3ADC input, SWDIO, IR_RX7 P14/38 SPI2_MOSI(master/slave) 33ADC Input, IR_TX8P13/28 33ADC input, QOC, IR_TX9P24PUART_RX,SPI2_CLK(master/slave)) 310 NC Not Connect11 NC Not Connect12 P25 PUART_RX,SPI2_MISO(master/slave) 313 P4 PUART_RX,SPI2_MOSI(master/slave) 3IR_TX, Q_Y014 P2 PUART_RX,SPI2_MOSI(master)/SPI2_CS(slave) 3QDX015 VDD VDD16 P3 PUART_CTS,SPI2_CLK(master/slave) 3QDX117 P8/33 PUART_RX,SPI1_MOSI 3ADC input, TX_PD, QDX1,ACLK118 P32 PUART_TX,SPI1_MISO/CS 3ADC input, ACLK019 P1 PUART_RTS,SPI2_MISO 3ADC input, IR_TX20 P0 PUART_TX,SPI2_MOSI(master/slave) 3ADC input, IR_RX21 SDA I2C_SDA 322 SCL I2C_SCL 323 UP_TX 3(UART_TXD) 324 UP_RX 3(UART_RXD) 325 GND Ground26 GND Ground27 GND Ground28 GND Ground29 NC Not Connect30 NC Not Connect31 NC Not Connect

Document Number: 002-xxxxx Rev. ** Page 10 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Connections and Optional External ComponentsPower Connections (VDD)The CYBLE-0130XX-00 contains one power supply connection, VDD.VDD accepts a supply input range of 2.3V to 3.6 V. Table 14 provides this specification. The maximum power supply ripple for thispower connection is 100 mV, as shown in Table 14. External Reset (XRES)The CYBLE-0130XX-00 has an integrated power-on reset circuit which completely resets all circuits to a known power on state. This action can also be driven by an external reset signal, which can be used to externally control the device, forcing it into a power-on reset state. The XRES signal is an active-low signal, which is an input to the CYBLE-0130XX-00 module. External Component RecommendationPower Supply CircuitryIt is not required to place any power supply decoupling or noise reduction circuitry on the host PCB. If desired, an external ferrite beadbetween the supply and the module connection can be included, but is not necessary. If used, the ferrite bead should be positionedas close as possible to the module pin connection. If used, the recommended ferrite bead value is 330Ω, 100 MHz. (Murata BLM21PG331SN1D).

Document Number: 002-xxxxx Rev. ** Page 11 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Figure 8 illustrates the CYBLE-0130XX-00 schematic.Figure 8. CYBLE-0130XX-00 Schematic Diagram

Document Number: 002-xxxxx Rev. ** Page 12 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Critical Components ListTab l e 6 details the critical components used in the CYBLE-0130XX-00 module.Table 6. Critical Component ListAntenna DesignTab l e 7 details trace antenna used in the CYBLE-0130XX-00 module. For more information, see Table 7 .Table 7. Trace Antenna SpecificationsComponent Reference Designator DescriptionSilicon U1 32-pin QFN BLE Silicon Device - CYW20737rSilicon U2 8-pin TDF8N, 128KSerial Flash Crystal Y1 24.000 MHz, 12PFItem DescriptionFrequency Range 2400 – 2500 MHzPeak Gain 0.5 dBi typicalReturn Loss 10 dB minimum

Document Number: 002-xxxxx Rev. ** Page 13 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Bluetooth Baseband CoreThe Bluetooth Baseband Core (BBC) implements all of the time-critical functions required for high performance Bluetooth operation.The BBC manages the buffering, segmentation, and data routing for all connections. It also buffers data that passes through it, han-dles data flow control, schedules ACL TX/RX transactions, monitors Bluetooth slot usage, optimally segments and packages datainto baseband packets, manages connection status indicators, and composes and decodes HCI packets. In addition to these func-tions, it independently handles HCI event types and HCI command types.The following transmit and receive functions are also implemented in the BBC hardware to increase TX/RX data reliability and secu-rity before sending over the air:The following transmit and receive functions are also implemented in the BBC hardware to increase TX/RX data reliability and security before sending over the air:nReceive Functions: symbol timing recovery, data deframing, forward error correction (FEC), header error control (HEC), cyclic redundancy check (CRC), data decryption, and data dewhitening.nTransmit Functions: data framing, FEC generation, HEC generation, CRC generation, link key generation, data encryption, and data whitening.Frequency Hopping GeneratorThe frequency hopping sequence generator selects the correct hopping channel number depending on the link controller state, Bluetooth clock, and device address.E0 EncryptionThe encryption key and the encryption engine are implemented using dedicated hardware to reduce software complexity and provide minimal processor intervention.Link Control LayerThe link control layer is part of the Bluetooth link control functions that are implemented in dedicated logic in the Link Control Unit (LCU). This layer consists of the Command Controller, which takes software commands, and other controllers that are activated or configured by the Command Controller to perform the link control tasks. Each task performs a different Bluetooth link controller state. STANDBY and CONNECTION are the two major states. In addition, there are five substates: page, page scan, inquiry, and inquiry scan.Adaptive Frequency HoppingThe CYBLE-0130XX-00 gathers link quality statistics on a channel-by-channel basis to facilitate channel assessment and channelmap selection. The link quality is determined by using both RF and baseband signal processing to provide a more accurate frequencyhop map.

Document Number: 002-xxxxx Rev. ** Page 14 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Bluetooth Low Energy ProfilesThe CYBLE-0130XX-00 supports Bluetooth low energy, including the following profiles that are supported[4] in ROM:nBattery statusnBlood pressure monitornFind menHeart rate monitornProximitynThermometernWeight scalenTimenAlliance for Wireless Power (A4WP) wireless chargingnAutomation profilenSupport for secure OTAThe following additional profiles can be supported[4] from RAM:nBlood glucose monitornTemperature alarmnLocationnCustom profileTest Mode SupportThe CYBLE-0130XX-00 fully supports Bluetooth Test mode, as described in the Bluetooth low energy specification.Infrared ModulatorThe CYBLE-0130XX-00 includes hardware support for infrared TX. The hardware can transmit both modulated and unmodulated waveforms. For modulated waveforms, hardware inserts the desired carrier frequency into all IR transmissions. IR TX can be sourced from firmware-supplied descriptors, a programmable bit, or the peripheral UART transmitter. If descriptors are used, they include IR on/off state and the duration between 1~32767 µsec. The CYBLE-0130XX-00 IR TX firmware driver inserts this information in a hardware FIFO and makes sure that all descriptors are played out without a glitch due to underrun (see Figure 9) . Notes4. Full qualification and use of these profiles may require FW updates from Cypress. Some of these profiles are under development/approval at the Bluetooth SIG and conformity with the final approved version is pending. Contact your local representative for updates and the latest list of profiles.

Document Number: 002-xxxxx Rev. ** Page 15 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Figure 9. Infrared TXInfrared LearningThe CYBLE-0130XX-00 includes hardware support for infrared learning. The hardware can detect both modulated and unmodulated signals. For modulated signals, the CYBLE-0130XX-00 can detect carrier frequencies between 10 kHz~500 kHz and the duration that the signal is present or absent. The CYBLE-0130XX-00 firmware driver supports further analysis and compression of learned signal. The learned signal can then be played back through the CYBLE-0130XX-00 IR TX subsystem (see Figure 10).Figure 10. Infrared RX

Document Number: 002-xxxxx Rev. ** Page 16 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Wireless ChargingThe CYBLE-0130XX-00 includes support for wireless charging in hardware, software, and firmware. It supports the protocol for implementing wireless charging solutions based on the specifications written by the Alliance for Wireless Power (A4WP).The A4WP protocol is embedded in the CYBLE-0130XX-00. Hardware and firmware elements required for wireless charging are either implemented in the CYBLE-0130XX-00 or can be obtained through a Cypress technical support representative.An end-to-end charging solution comprises of the following:nPower Transmitting Unit (PTU): The PTU transfers the power to the receiving unit. The receiving unit is any device (phone, wearable, or other embedded device) that needs to be charged. The PTU is typically plugged into a power source such as a wall outlet. The CYBLE-0130XX-00 includes the peripherals needed to implement and drive a reference charging circuit and otherwise requires only a few external components. PTU reference designs based on the CYBLE-0130XX-00, including bills of material (BOMs), are available through Cypress technical support. Depending on charging power requirements, a Power Management Unit (PMU) such as the BCM8935X may be included in the design. However, most PTUs requiring < 5W will not need a PMU. The references designs leverage ADCs, PWMs, and other internal peripherals to help drive the charging circuitry for energy transfer as well as provide feedback for charging control. The application and algorithm that drive the reference designs are available on request.nPower Receive Unit (PRU): The PRU receives energy from the PTU to charge the local device, and is typically embedded in the local device. Like the PTU, a separate PMU may or may not be needed depending on power requirements. PRU reference designs based on the BCM20736, both with and without a PMU, are also available through Broadcom technical support.SecurityCYBLE-0130XX-00 provides elaborate mechanisms for implementing security and authentication schemes using:nRSA (Public Key Cryptography)nX.509 (excluding parsing)nHash functions: MD5, SHA-1, SHA-224, SHA-256, SHA-384, SHA-512 nMessage authentication code: HMAC MD5, HMAC SHA-1Details on how to use this functionality via SDK are available in application notes on this topic.Support for NFC Tag Based PairingCYBLE-0130XX-00 provides support for "ease of pairing" and "secure key exchange" use cases using passive tags. Active tags can be used with the chip for OOB pairing. In a typical use case, the BCM20203 (NFC tag) can be used to provide "tap to pair" functionality for easy pairing.Note: Details on how to use this functionality via SDK are available in application notes on this topic.Bluetooth Smart AudioCYBLE-0130XX-00 supports using the BLE link for audio streaming. This functionality can be used for audio applications in toys, wearable, and HID devices, as well as in hearing aids.Details on how to use this functionality via SDK are available in application notes on this topic.

Document Number: 002-xxxxx Rev. ** Page 17 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00ADC PortThe CYBLE-0130XX-00 contains a 16-bit ADC (effective number of bits is 10).Additionally:nThere are 9 analog input channels in the 32-pin packagenThe following GPIOs can be used as ADC inputs: pP0pP1pP8/P33 (select only one)pP11 on P11/P27 pinpP12 on P12/28 pinpP13/P28 (select only one)pP14/P38 (select only one)pP15pP32nThe conversion time is 10 us.nThere is a built-in reference with supply- or bandgap-based reference modes.nThe maximum conversion rate is 187 kHz.nThere is a rail-to-rail input swing.The ADC consists of an analog ADC core that performs the actual analog-to-digital conversion and digital hardware that processes the output of the ADC core into valid ADC output samples. Directed by the firmware, the digital hardware also controls the input multiplexers that select the ADC input signal Vinp and the ADC reference signals Vref.The ADC input range is selectable by firmware control:nWhen an input range of 0~3.6V is used, the input impedance is 3 MW.nWhen an input range of 0~2.4V is used, the input impedance is 1.84 MW.nWhen an input range of 0~1.2V is used, the input impedance is 680 kW.ADC modes are defined in Ta b l e 8.Table 8. ADC ModesMode ENOB (Typical) Maximum Sampling Rate (kHz) Latency[5] (u?s)0 13 5.859 1711 12.6 11.7 85212 46.875 213 11.5 93.75 11410 187 55. Settling time after switching channels. .

Document Number: 002-xxxxx Rev. ** Page 18 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Serial Peripheral InterfaceThe CYBLE-0130XX-00 has two independent SPI interfaces. One is a master-only interface and the other can be either a master or a slave. Each interface has a 16-byte transmit buffer and a 16-byte receive buffer. To support more flexibility for user applications, the CYBLE-0130XX-00 has optional I/O ports that can be configured individually and separately for each functional pin as shown in Tab l e 9, Ta b l e 10, and Ta ble 11 . The CYBLE-0130XX-00 acts as an SPI master device that supports 1.8V or 3.3V SPI slaves. The CYBLE-0130XX-00 can also act as an SPI slave device that supports a 1.8V or 3.3V SPI master.Microprocessor UnitThe CYBLE-0130XX-00 microprocessor unit (µPU) executes software from the link control (LC) layer up to the application layer components. The microprocessor is based on an ARM® Cortex® M3, 32-bit RISC processor with embedded ICE-RT debug and JTAG interface units. The µPU has 320 KB of ROM for program storage and boot-up, 60 KB of RAM for scratch-pad data, and patch RAM code. The SoC has a total storage of 380 KB, including RAM and ROM.The internal boot ROM provides power-on reset flexibility, which enables the same device to be used in different HID applications with an external serial EEPROM or with an external serial flash memory. At power-up, the lowest layer of the protocol stack is executed from the internal ROM memory.External patches may be applied to the ROM-based firmware to provide flexibility for bug fixes and feature additions. The device canalso support the integration of user applications.Table 9. CYBLE-0130XX-00 First SPI Set (Master Mode)Pin Name SPI_CLK SPI_MOSI SPI_MISO11. SPIFFY1 MISO should always be P32. Boot ROM does not configure any others.SPI_CS22. Any GPIO can be used as SPI_CS when SPI 1 is in master mode, and when the SPI slave is not a serial flash.Configured Pin Name SCL SDA – –––––––P32P3333. P33 is always SPI_CS when a serial flash is used for non-volatile storage.Table 10. CYBLE-0130XX-00 Second SPI Set (Master Mode)Pin Name SPI_CLK SPI_MOSI SPI_MISO SPI_CS11. Any GPIO can be used as SPI_CS when SPI is in master mode.Configured Pin Name P3 P0 P1 ––P4P25–P24 P27 – –Table 11. CYBLE-0130XX-00 Second SPI Set (Slave Mode)Pin Name SPI_CLK SPI_MOSI SPI_MISO SPI_CSConfigured Pin Name P3 P0 P1 P2–P27––P24 P33 P25 P26–––P32

Document Number: 002-xxxxx Rev. ** Page 19 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Internal ResetFigure 11. Internal Reset TimingExternal Reset (XRES)The CYBLE-0130XX-00 has an integrated power-on reset circuit that completely resets all circuits to a known power-on state. Anexternal active low reset signal, XRES, can be used to put the CYBLE-0130XX-00 in the reset state. The XRES pin has an internalpull-up resistor and, in most applications, it does not require that anything be connected to it. XRES should only be released after theVDDO supply voltage level has been stabilized.Figure 12. External Reset Timing

Document Number: 002-xxxxx Rev. ** Page 20 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Integrated Radio TransceiverThe CYBLE-0130XX-00 has an integrated radio transceiver that is optimized for 2.4 GHz Bluetooth wireless systems. It has beendesigned to provide low power, low cost, and robust communications for applications operating in the globally available 2.4 GHz unli-censed ISM band. It is fully compliant with Bluetooth Radio Specification 4.1 and meets or exceeds the requirements to provide thehighest communication link quality of service.Transmitter PathThe CYBLE-0130XX-00 features a fully integrated transmitter. The baseband transmit data is GFSK modulated in the 2.4 GHz ISMband.Digital ModulatorThe digital modulator performs the data modulation and filtering required for the GFSK signal. The fully digital modulator minimizesany frequency drift or anomalies in the modulation characteristics of the transmitted signal.Power AmplifierThe CYBLE-0130XX-00 has an integrated power amplifier (PA) that can transmit up to +4 dBm for class 2 operation.Receiver PathThe receiver path uses a low IF scheme to down convert the received signal for demodulation in the digital demodulator and bit syn-chronizer. The receiver path provides a high degree of linearity, and an extended dynamic range to ensure reliable operation in thenoisy 2.4 GHz ISM band. The front-end topology, which has built-in out-of-band attenuation, enables the CYBLE-0130XX-00 to beused in most applications without off-chip filtering.Digital Demodulator and Bit SynchronizerThe digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency tracking and bit syn-chronization algorithm.Receiver Signal Strength IndicatorThe radio portion of the CYBLE-0130XX-00 provides a receiver signal strength indicator (RSSI) to the baseband. This enables thecontroller to take part in a Bluetooth power-controlled link by providing a metric of its own receiver signal strength to determinewhether the transmitter should increase or decrease its output power.Local OscillatorThe local oscillator (LO) provides fast frequency hopping (1600 hops/second) across the 79 maximum available channels. TheCYBLE-0130XX-00 uses an internal loop filter.CalibrationThe CYBLE-0130XX-00 radio transceiver features a self-contained automated calibration scheme. No user interaction is requiredduring normal operation or during manufacturing to provide optimal performance. Calibration compensates for filter, matching net-work, and amplifier gain and phase characteristics to yield radio performance within 2% of what is optimal. Calibration takes processand temperature variations into account, and it takes place transparently during normal operation and hop setting times.Internal LDO RegulatorThe CYBLE-0130XX-00 has an integrated 1.2 V LDO regulator that provides power to the digital and RF circuits. The 1.2V LDO reg-ulator operates from a 1.425 V to 3.63 V input supply with a 30 mA maximum load current.

Document Number: 002-xxxxx Rev. ** Page 21 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Peripheral Transport UnitBroadcom Serial Communications InterfaceThe CYBLE-0130XX-00 provides a 2-pin master BSC interface, which can be used to retrieve configuration information from an external EEPROM or to communicate with peripherals such as track-ball or touch-pad modules, and motion tracking ICs used in mouse devices. The BSC interface is compatible with I2C slave devices. The BSC does not support multimaster capability or flexible wait-state insertion by either master or slave devices.The following transfer clock rates are supported by the BSC:n100 kHzn400 kHzn800 kHz (not a standard I2C-compatible speed.)n1 MHz (Compatibility with high-speed I2C-compatible devices is not guaranteed.)The following transfer types are supported by the BSC:nRead (Up to 16 bytes can be read.)nWrite (Up to 16 bytes can be written.)nRead-then-Write (Up to 16 bytes can be read and up to 16 bytes can be written.)nWrite-then-Read (Up to 16 bytes can be written and up to 16 bytes can be read.)Hardware controls the transfers, requiring minimal firmware setup and supervision.The clock pin (SCL) and data pin (SDA) are both open-drain I/O pins. Pull-up resistors external to the CYBLE-0130XX-00 are required on both the SCL and SDA pins for proper operation.USupport for changing the baud rate during normal HCI UART operation is included through a vendor-specific command that allowsthe host to adjust the contents of the baud rate registers.The CYBLE-0130XX-00 UART operates correctly with the host UART as long as the combined baud rate error of the two devices iswithin ±5%.Clock FrequenciesPeripheral BlockThe peripheral blocks of the CYBLE-0130XX-00 all run from a single 128 kHz low-power RC oscillator. The oscillator can be turned on at the request of any of the peripherals. If the peripheral is not enabled, it shall not assert its clock request line.The keyboard scanner is a special case, in that it may drop its clock request line even when enabled, and then reassert the clockrequest line if a keypress is detected.32 kHz Crystal OscillatorFigure 13 shows the 32 kHz crystal (XTAL) oscillator with external components and Table 12 lists the oscillator’s characteristics. It is a standard Pierce oscillator using a comparator with hysteresis on the output to create a single-ended digital output. The hysteresis was added to eliminate any chatter when the input is around the threshold of the comparator and is ~100 mV. This circuit can be operated with a 32 kHz or 32.768 kHz crystal oscillator or be driven with a clock input at similar frequency. The default component values are: R1 = 10 M?, C1 = C2 = ~10 pF. The values of C1 and C2 are used to fine-tune the oscillator.

Document Number: 002-xxxxx Rev. ** Page 22 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Figure 13. 32 kHz Oscillator Block DiagramGPIO PortThe CYBLE-0130XX-00 has 14 general-purpose I/Os (GPIOs) in the 32-pin package. All GPIOs support programmable pull-up and pull-down resistors, and all support a 2 mA drive strength except P26, P27, and P28, which provide a 16 mA drive strength at 3.3V supply. The following GPIOs are available:n P0-P4n P8/P33 only available for CYBLE-013030-00n P11/P27 (Dual bonded, only one of two is available.)n P12/P26 (Dual bonded, only one of two is available.)n P13/P28 (Dual bonded, only one of two is available.)n P14/P38 (Dual bonded, only one of two is available.)n P15n P24n P25n P32 - only available for CYBLE-013030-00For a description of all GPIOs, see Ta ble 2 .Table 12. XTAL Oscillator CharacteristicsParameter Symbol Conditions Minimum Typical Maximum UnitOutput frequency Foscout – – 32.768 – kHzFrequency tolerance– Crystal dependent – 100 – ppmStart-up time Tstartup – – – 500 msXTAL drive level Pdrv For crystal selection 0.5 – – ?WXTAL series resis-tanceRseries For crystal selection – – 70 k?XTAL shunt capaci-tanceCshunt For crystal selection – – 1.3 pF

Document Number: 002-xxxxx Rev. ** Page 23 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00PWMThe CYBLE-0130XX-00 has four PWMs. The PWM module consists of the following:nPWM0-3nThe following GPIOs can be mapped as PWMs:p. P26p. P27p. P14/P28 (Dual bonded, only one of two is available.)p. P13 on P13/28nPWM0–3. Each of the four PWM channels contains the following registers:p10-bit initial value register (read/write)p10-bit toggle register (read/write)p10-bit PWM counter value register (read)nPWM configuration register shared among PWM0–3 (read/write). This 12-bit register is used:pTo configure each PWM channelpTo select the clock of each PWM channel pTo change the phase of each PWM channelFigure 14 shows the structure of one PWM.Figure 14. PWM Block Diagram

Document Number: 002-xxxxx Rev. ** Page 24 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Power Management UnitThe Power Management Unit (PMU) provides power management features that can be invoked by software through power management registers or packet-handling in the baseband core.RF Power ManagementThe BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4 GHz trans-ceiver, which then processes the power-down functions accordingly.Host Controller Power ManagementPower is automatically managed by the firmware based on input device activity. As a power-saving task, the firmware controls the disabling of the on-chip regulator when in deep sleep mode.BBC Power ManagementThere are several low-power operations for the BBC:nPhysical layer packet handling turns RF on and off dynamically within packet TX and RX.nBluetooth-specified low-power connection mode. While in these low-power connection modes, the CYBLE-0130XX-00 runs on the Low Power Oscillator and wakes up after a predefined time period.The CYBLE-0130XX-00 automatically adjusts its power dissipation based on user activity. The following power modes are supported:nActive modenIdle modenSleep modenHIDOFF (Deep Sleep) modenTimed Deep Sleep modeThe CYBLE-0130XX-00 transitions to the next lower state after a programmable period of user inactivity. Busy mode is immediately entered when user activity resumes.nIn HIDOFF (Deep Sleep) mode, the CYBLE-0130XX-00 baseband and core are powered off by disabling power to LDOOUT. The VDDO domain remains powered up and will turn the remainder of the chip on when it detects user events. This mode minimizes chip power consumption and is intended for long periods of inactivity.

Document Number: 002-xxxxx Rev. ** Page 25 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Electrical CharacteristicsTab l e 13 shows the maximum electrical rating for voltages referenced to VDD pin.Tab l e 14 shows the power supply characteristics for the range TJ = 0 to 125×C.Table 15 shows the specifications for the ADC characteristics.Table 13. Maximum Electrical RatingRating Symbol Value UnitVDD –3.8 VVoltage on input or output pin – VSS – 0.3 to VDD + 0.3 VOperating ambient temperature range Topr –30 to +85 °CStorage temperature range Tstg –40 to +125 °CTable 14. Power SupplyParameter Description Minimum11. Overall performance degrades beyond minimum and maximum supply voltages.Typical MaximumaUnitVDD Power Supply Input 2.3 – 3.6 VVDD_RIPPLE Maximum power supply ripple for VDD input voltage – – 100 mVTable 15. ADC SpecificationsParameter Symbol Conditions Min Typ Max UnitNumber of Input channels – – – 9 – –Channel switching rate fch – – – 133.33 kch/sInput signal range Vinp –0–3.63VReference settling time – Changing refsel 7.5 – – μsInput resistance Rinp Effective, single ended – 500 – kΩInput capacitance Cinp –––5pFConversion rate fC– 5.859 – 187 kHzConversion time TC– 5.35 – 170.7 μsResolution R – – 16 – bitsEffective number of bits – In specified performance range – See Tab l e 8 on page 17–Absolute voltage measurement error– Using on-chip ADC firmware driver – ±2 – %Current I Iavdd1p2 + Iavdd3p3 –– 1 mAPower P – – 1.5 – mWLeakage current Ileakage T = 25×C – – 100 nAPower-up time Tpowerup –––200µsIntegral nonlinearity3INL In guaranteed performance range – – 1 LSB1Differential nonlin-earity<Superscript>1 DNL In guaranteed performance range – – 1 LSB1

Document Number: 002-xxxxx Rev. ** Page 26 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Table 16 shows the specifications for the digital voltage levels.1. LSBs are expressed at the 10-bit level.Table 16. Digital Levels11. This table is also applicable to VDDMEM domain.Characteristics Symbol Min Typ Max UnitInput low voltage VIL ––0.4VInput high voltage VIH 0.75 × VDDO – – VInput low voltage (VDDO = 1.62V) VIL ––0.4VInput high voltage (VDDO = 1.62V) VIH 1.2 ––VOutput low voltage22. At the specified drive current for the pad.VOL ––0.4VOutput high voltage2VOH VDDO – 0.4 – – VInput capacitance (VDDMEM domain) CIN –0.12–pF

Document Number: 002-xxxxx Rev. ** Page 27 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Table 17 shows the specifications for current consumption.Table 17. Current Consumption11. Currents measured between power terminals (Vdd) using 90% efficient DC-DC converter at 3V.Operational Mode Conditions Typ Max UnitReceive Receiver and baseband are both operating, 100% ON. 9.8 10.0mATransmit Transmitter and baseband are both operating, 100% ON. 9.19.3 mASleep Internal LPO is in use. 12.0 13.0 µA–0.65–Table 18. Power Supply Current ConsumptionPower Supply Advertisement Rates Typ Max UnitVDD 20 ms 1.96 mA

Document Number: 002-xxxxx Rev. ** Page 28 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00RF SpecificationsTable 19. Receiver RF SpecificationsParameter Mode and Conditions Min Typ Max UnitReceiver Section11. 30.8% PER.Frequency range – 2402 – 2480 MHzRX sensitivity (standard) 0.1%BER, 1 Mbps – –94 – dBmRX sensitivity (low current) – –91.5 – dBmInput IP3 – –16 – – dBmMaximum input – –10 – – dBmInterference Performance<Superscript>1,22. Desired signal is 3 dB above the reference sensitivity level (defined as –70 dBm).C/I cochannel 0.1%BER – – 21 dBC/I 1 MHz adjacent channel 0.1%BER – – 15 dBC/I 2 MHz adjacent channel 0.1%BER – – –17 dBC/I ℜ≥ 3 MHz adjacent channel 0.1%BER – – –27 dBC/I image channel 0.1%BER – – –9.0 dBC/I 1 MHz adjacent to image channel 0.1%BER – – –15 dBOut-of-Band Blocking Performance (CW)1,230 MHz to 2000 MHz 0.1%BER33. Measurement resolution is 10 MHz.– –30.0 – dBm2003 MHz to 2399 MHz 0.1%BER44. Measurement resolution is 3 MHz.– –35 – dBm2484 MHz to 2997 MHz 0.1%BER4– –35 – dBm3000 MHz to 12.75 GHz 0.1%BER55. Measurement resolution is 25 MHz.– –30.0 – dBmSpurious Emissions30 MHz to 1 GHz – – – –57.0 dBm1 GHz to 12.75 GHz – – – –55.0 dBmTable 20. Transmitter RF SpecificationsParameter Minimum Typical Maximum UnitTransmitter SectionFrequency range 2402 – 2480 MHzOutput power adjustment range –20 – 4 dBmDefault output power – 4.0 – dBmOutput power variation – 2.0 – dBAdjacent Channel Power|M – N| = 2 – – –20 dBm|M – N| ℜ≥ 3 – – –30 dBmOut-of-Band Spurious Emission

Document Number: 002-xxxxx Rev. ** Page 29 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-0030 MHz to 1 GHz – – –36.0 dBm1 GHz to 12.75 GHz – – –30.0 dBm1.8 GHz to 1.9 GHz – – –47.0 dBm5.15 GHz to 5.3 GHz – – –47.0 dBmLO PerformanceInitial carrier frequency tolerance – – ±150 kHzFrequency DriftFrequency drift – – ±50 kHzDrift rate – – 20 kHz/50 µsFrequency DeviationAverage deviation in payload(sequence used is 00001111)225 – 275 kHzMaximum deviation in payload(sequence used is 10101010)185– – kHzChannel spacing – 2 – MHzTable 20. Transmitter RF Specifications (continued)Parameter Minimum Typical Maximum Unit

Document Number: 002-xxxxx Rev. ** Page 30 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Timing and AC CharacteristicsIn this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams.UART TimingFigure 15. UART TimingSPI TimingThe SPI interface supports clock speeds up to 12 MHz with VDDIO ≥ 2.2V. The supported clock speed is 6 MHz when 2.2V > VDDIO ≥ 1.62V.Figure 16 and Figure 17 show the timing requirements when operating in SPI Mode 0 and 2, and SPI Mode 1 and 3, respectively.Table 21. UART Timing SpecificationsReference Characteristics Min Max Unit1 Delay time, UART_CTS_N low to UART_TXD valid – 24 Baud out cycles2 Setup time, UART_CTS_N high before midpoint of stop bit – 10 ns3 Delay time, midpoint of stop bit to UART_RTS_N high – 2 Baud out cyclesTable 22. SPI Interface Timing SpecificationsReference Characteristics Min Typ Max1 Time from CSN asserted to first clock edge 1 SCK 100 ?2 Master setup time – ¾ SCK –3 Master hold time ¾ SCK – –4 Slave setup time – ¾ SCK –5Slave hold time ¾ SCK––6 Time from last clock edge to CSN deasserted 1 SCK 10 SCK 100

Document Number: 002-xxxxx Rev. ** Page 31 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Figure 16. SPI Timing – Mode 0 and 2Figure 17. SPI Timing – Mode 1 and 3BSC Interface TimingTable 23. BSC Interface Timing SpecificationsReference Characteristics Min Max Unit1 Clock frequency – 100 kHz40080010002 START condition setup time 650 – ns3 START condition hold time 280 – ns4 Clock low time 650 – ns5 Clock high time 280 – ns6 Data input hold time10 – ns

Document Number: 002-xxxxx Rev. ** Page 32 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Figure 18. BSC Interface Timing Diagram7 Data input setup time 100 – ns8 STOP condition setup time 280 – ns9 Output valid from clock – 400 ns10 Bus free time2650 – ns1. As a transmitter, 300 ns of delay is provided to bridge the undefined region of the falling edge of SCL to avoid unintended generation of START or STOP conditions.2. Time that the cbus must be free before a new transaction can start.Table 23. BSC Interface Timing SpecificationsReference Characteristics Min Max Unit

Document Number: 002-xxxxx Rev. ** Page 33 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Environmental SpecificationsEnvironmental ComplianceThis Cypress BLE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen-Free (HF)directives. The Cypress module and components used to produce this module are RoHS and HF compliant.RF CertificationThe CYBLE-0130XX-00 module will be certified under the following RF certification standards at production release.nFCC: WAP3025nCEnIC: 7922A-3025nMIC: TBDSafety CertificationThe CYBLE-0130XX-00 module complies with the following safety regulations:nUnderwriters Laboratories, Inc. (UL): Filing E331901nCSAnTUVEnvironmental ConditionsTab l e 24 describes the operating and storage conditions for the Cypress BLE module.ESD and EMI ProtectionExposed components require special attention to ESD and electromagnetic interference (EMI).A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings in the enclosurenear the module should be surrounded by a grounded conductive layer to provide ESD protection and a low-impedance path to ground. Device Handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability.Table 24. Environmental Conditions for CYBLE-0130XX-00Description Minimum Specification Maximum SpecificationOperating temperature −30 °C 85 °COperating humidity (relative, non-condensation) 5% 85%Thermal ramp rate – 3 °C/minuteStorage temperature –40 °C 85 °CStorage temperature and humidity – 85 °C at 85%ESD: Module integrated into system Components[6] –15 kV Air2.0 kV ContactNote6. This does not apply to the RF pins (ANT).

Document Number: 002-xxxxx Rev. ** Page 34 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Regulatory InformationFCCFCC NOTICE:The device CYBLE-0130XX-00 complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitterapproval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This devicemay not cause harmful interference, and (2) This device must accept any interference received, including interference that may causeundesired operation.CAUTION:The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved byCypress Semiconductor may void the user's authority to operate the equipment.This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipmentgenerates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions,ê may causeharmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipmentoff and on, the user is encouraged to try to correct the interference by one or more of the following measures:nReorient or relocate the receiving antenna. nIncrease the separation between the equipment and receiver. nConnect the equipment into an outlet on a circuit different from that to which the receiver is connected. nConsult the dealer or an experienced radio/TV technician for help LABELING REQUIREMENTS:The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes a clearly visiblelabel on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor FCC identifier for this product as wellas the FCC Notice above. The FCC identifier is FCC ID: WAP3025.In any case the end product must be labeled exterior with "Contains FCC ID: WAP3025"ANTENNA WARNING: This device is tested with a standard SMA connector and with the antennas listed below. When integrated in the OEMs product, thesefixed antennas require installation preventing end-users from replacing them with non-approved antennas. Any antenna not in thefollowing table must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for emissions.RF EXPOSURE: To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure to install the approvedantenna in the previous.The preceding statement must be included as a CAUTION statement in manuals, for products operating with the approved antennasin Table 7 on page 12, to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removalinstructions about the integrated radio module is not allowed.The radiated output power of CYBLE-0130XX-00 with the trace antenna is far below the FCC radio frequency exposure limits.Nevertheless, use CYBLE-0130XX-00 in such a manner that minimizes the potential for human contact during normal operation. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided withtransmitter operating conditions for satisfying RF exposure compliance.

Document Number: 002-xxxxx Rev. ** Page 35 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Industry Canada (IC) CertificationCYBLE-0130XX-00 is licensed to meet the regulatory requirements of Industry Canada (IC), License: IC: 7922A-3025Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensurecompliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance fromwww.ic.gc.ca.This device has been designed to operate with the antennas listed in Ta ble 7 on page 12, having a maximum gain of 0.5 dBi. Antennasnot included in this list or having a gain greater than 0.5 dBi are strictly prohibited for use with this device. The required antennaimpedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antennaor transmitter.IC NOTICE:The device CYBLE-0130XX-00 including the built-in trace antenna complies with Canada RSS-GEN Rules. The device meets therequirements for modular transmitter approval as detailed in RSS-GEN. Operation is subject to the following two conditions: (1) Thisdevice may not cause harmful interference, and (2) This device must accept any interference received, including interference thatmay cause undesired operation.IC RADIATION EXPOSURE STATEMENT FOR CANADAThis device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1)this device may not cause interference, and (2) this device must accept any interference, including interference that may causeundesired operation of the device.Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation estautorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit acceptertout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.LABELING REQUIREMENTS:The Original Equipment Manufacturer (OEM) must ensure that IC labelling requirements are met. This includes a clearly visible labelon the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor IC identifier for this product as well as the ICNotice above. The IC identifier is 7922A-3025. In any case, the end product must be labeled in its exterior with "Contains IC:7922A-3025"European R&TTE Declaration of ConformityHereby, Cypress Semiconductor declares that the Bluetooth module CYBLE-013025-00 complies with the essential requirements andother relevant provisions of Directive 1999/5/EC. As a result of the conformity assessment procedure described in Annex III of theDirective 1999/5/EC, the end-customer equipment should be labeled as follows: All versions of the CYBLE-0130XX-00 in the specified reference design can be used in the following countries: Austria, Belgium,Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxem-bourg, Malta, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, The Netherlands, the United Kingdom, Switzerland, and Norway.

Document Number: 002-xxxxx Rev. ** Page 36 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00MIC JapanCYBLE-0130XX-00 is certified as a module with type certification number TBD. End products that integrate CYBLE-013025-00 do notneed additional MIC Japan certification for the end product.End product can display the certification label of the embedded module.

Document Number: 002-xxxxx Rev. ** Page 37 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00PackagingThe CYBLE-0130XX-00 is offered in tape and reel packaging. Figure 19 details the tape dimensions used for the CYBLE-0130XX-00.Figure 19. CYBLE-0130XX-00 Tape Dimensions (TBD)Figure 20 details the orientation of the CYBLE-0130XX-00 in the tape as well as the direction for unreeling.Figure 20. Component Orientation in Tape and Unreeling Direction (TBD)Table 25. Solder Reflow Peak TemperatureModule Part Number Package Maximum Peak Temperature Maximum Time at Peak Temperature No. of CyclesCYBLE-0130XX-00 14-pad SMT 260 °C 30 seconds 2Table 26. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2Module Part Number Package MSL CYBLE-0130XX-00 31-pad SMT MSL 3

Document Number: 002-xxxxx Rev. ** Page 38 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Figure 21 details reel dimensions used for the CYBLE-0130XX-00.Figure 21. Reel DimensionsThe CYBLE-0130XX-00 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. Thecenter-of-mass for the CYBLE-0130XX-00 is detailed in Figure 22.Figure 22. CYBLE-0130XX-00 Center of Mass (TBD)

Document Number: 002-xxxxx Rev. ** Page 39 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Ordering InformationTab l e 27 lists the CYBLE-0130XX-00 part number and features. Tab le 28 lists the reel shipment quantities for the CYBLE-0130XX-00.The CYBLE-0130XX-00 is offered in tape and reel packaging. The CYBLE-0130XX-00 ships in a reel size of TBD. For additional information and a complete list of Cypress Semiconductor BLE products, contact your local Cypress sales representative. To locate the nearest Cypress office, visit our website.Table 27. Ordering InformationPart NumberCPU Speed (MHz)Flash Size (KB)RAM Size (KB) UART BSC (I2C) PWM Package PackagingCYBLE-013025-00 24 128 60 Yes Yes 4 31-SMT Tape and ReelCYBLE-013030-00 24 – 60 Yes Yes 4 31-SMT Tape and ReelTable 28. Tape and Reel Package Quantity and Minimum Order AmountDescription Minimum Reel Quantity Maximum Reel Quantity CommentsReel Quantity TBD TBD Ships in TBD unit reel quantities. Minimum Order Quantity (MOQ) TBD – –Order Increment (OI) TBD – –U.S. Cypress Headquarters Address 198 Champion Court, San Jose, CA 95134U.S. Cypress Headquarter Contact Info (408) 943-2600Cypress website address http://www.cypress.com

Document Number: 002-xxxxx Rev. ** Page 40 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Acronyms Document ConventionsUnits of MeasureTable 29. Acronyms Used in this DocumentAcronym DescriptionBLE Bluetooth Low EnergyBluetooth SIG Bluetooth Special Interest GroupCE European ConformityCSA Canadian Standards AssociationEMI electromagnetic interferenceESD electrostatic dischargeFCC Federal Communications CommissionGPIO general-purpose input/outputIC Industry CanadaIDE integrated design environmentKC Korea CertificationMIC Ministry of Internal Affairs and Communications (Japan)PCB printed circuit boardRX receiveQDID qualification design IDSMTsurface-mount technology; a method for producing electronic circuitry in which the components are placed directly onto the surface of PCBsTCPWM timer, counter, pulse width modulator (PWM)TUV Germany: Technischer Überwachungs-Verein (Technical Inspection Association)TX transmitTable 30. Units of MeasureSymbol Unit of Measure°C degree CelsiuskV kilovoltmA milliamperesmm millimetersmV millivoltμA microamperesμm micrometersMHz megahertzGHz gigahertzVvolt

Document Number: 002-xxxxx Rev. ** Page 41 of 42PRELIMINARY CYBLE-013025-00CYBLE-013030-00Document History Page Document Title: CYBLE-0130XX-00 EZ-BLE™ WICED ModuleDocument Number: 002-XXXXXRevision ECN Orig. of ChangeSubmission Date Description of Change** PRELIM-INARYDSO Preliminary datasheet for CYBLE-0130XX-00 module.

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