Datalogic S r l RHINOIIWEC7 802.11abgn M.2 module w/SDIO interface User Manual Rev 02 171030

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Datasheet
M2SD50NBT
M2SD50NBT
Datasheet
CONTENTS
10
11
12
13
Scope ................................................................................................................................................................. 3
Specifications..................................................................................................................................................... 3
WLAN Functional Description ........................................................................................................................... 5
3.1
Overview ................................................................................................................................................ 5
Bluetooth Functional Description ..................................................................................................................... 7
Electrical Characteristics ................................................................................................................................... 8
5.1
Absolute Maximum Ratings ................................................................................................................... 8
5.2
Recommended Operating Conditions ................................................................................................... 8
5.3
DC Electrical Characteristics................................................................................................................... 8
5.4
WLAN Radio Receiver Characteristics .................................................................................................. 10
Bluetooth Radio Characteristics ...................................................................................................................... 11
SDIO Timing Requirements ............................................................................................................................. 13
Pin Definitions ................................................................................................................................................. 14
Mechanical Specifications ............................................................................................................................... 17
Mounting ......................................................................................................................................................... 17
RF Layout Design Guidelines/Precautions....................................................................................................... 19
Regulatory ....................................................................................................................................................... 20
12.1 Certified Antennas ............................................................................................................................... 20
FCC and IC Regulatory ..................................................................................................................................... 21
13.1 FCC ....................................................................................................................................................... 21
13.1.1
Federal Communication Commission Interference Statement........................................ 21
13.1.2
End Product Labeling........................................................................................................ 22
13.1.3
Manual Information to the End User ............................................................................... 22
13.2 Industry Canada ................................................................................................................................... 22
13.2.1
Industry Canada Statement .............................................................................................. 22
13.2.2
Antenna Information ........................................................................................................ 23
13.2.3
Radiation Exposure Statement ......................................................................................... 24
13.2.4
Déclaration d'exposition aux radiations ........................................................................... 24
13.2.5
End Product Labeling........................................................................................................ 25
13.2.6
Plaque signalétique du produit final ................................................................................ 25
13.2.7
Manual Information to the End User ............................................................................... 25
13.2.8
Manuel d'information à l'utilisateur final ........................................................................ 25
M2SD50NBT
Datasheet
1 SCOPE
This document describes key hardware aspects of the Laird M2SD50NBT module. This document is intended to
assist device manufacturers and related parties with the integration of this radio into their host devices. Data in
this document is drawn from a number of sources and includes information found in the Laird SSD50NBT which
including Qualcomm Atheros (QCA) QCA6004 and Cambridge Silicon Radio Ltd. (CSR) CSR8811 A08 data sheet
issued in July 2011, along with other documents provided from QCA and CSR
Note that the information in this document is subject to change. Please contact Laird to obtain the most recent
version of this document.
2 SPECIFICATIONS
Table 1: Specifications
Feature
Description
Wi‐Fi Interface
1‐bit or 4‐bit Secure Digital I/O
Bluetooth Interface
Host Controller Interface (HCI) using High Speed UART
Main Chip
Wi‐Fi – Qualcomm Atheros QCA6004
BT – Cambridge Silicon Radio Ltd. (CSR) CSR8811 A08
Input Voltage Requirements
3.3 VDC (3.20V min to 3.46V max)
I/O Signalling Voltage
3.3 VDC ± 5% or 1.8 VDC ± 5%
Operating Temperature
‐30° to 85°C (‐22° to 185°F)
Operating Humidity
10 to 90% (non‐condensing)
Storage Temperature
‐40° to 85°C (‐40° to 185°F)
Storage Humidity
10 to 90% (non‐condensing)
Size
22 mm X 30 mm X 3.3 mm (.87” x 1.18” x .13”)
Weight
Wi‐Fi Standards
< 3.0 grams (< 0.105822 ounces)
Bluetooth Standards
Bluetooth version 2.1 with Enhanced Data Rate
Bluetooth 4.0 (Bluetooth Low Energy or BLE)
Wi‐Fi Data Rates Supported
11a (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11b (DSSS, CCK) 1, 2, 5.5, 11 Mbps
802.11g (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n (OFDM, MCS 0‐15)
Full Guard Interval: 6.5,13.0, 19.5, 26.0,39.0,52.0,58.5,65.0, 13.0,26.0,39.0,
52.0, 78.0,104.0,117.0 Mbps
Short Guard Interval: 1.2,14.4,21.7,29.9,43.3,57.8,65.0,72.2,
14.4,28.9,43.3,57.8, 86.7,115.6,130.0,144.4 Mbps
IEEE 802.11a, 802.11b, 802.11d, 802.11e, 802.11g, 802.11h, 802.11i,
802.11n, 802.11r
M2SD50NBT
Datasheet
Feature
Modulation
802.11n Spatial Streams
Bluetooth Data Rates
Supported
Bluetooth Modulation
Description
BPSK @ 1, 6,9, 6.5, 7.2,13 and 14.4 Mbps
QPSK @ 2, 12, 18, 13, 14.4,19.5, 21.7, 26, 28.9, 39,43.3 Mbps
CCK @ 5.5 and 11 Mbps
16‐QAM @ 24, 36,26, 29.9,39,43.3,52,57.8,78,86.7 Mbps
64‐QAM @ 48,54,52, 57.8, 58.5, 65,72.2,104.0,115.6,117.0,130.0,144.4
Mbps
2 (2x2 MIMO)
1, 2, 3 Mbps
GFSK@ 1 Mbps
Pi/4‐DQPSK@ 2 Mbps
8‐DPSK@ 3 Mbps
Regulatory Domain Support
FCC (Americas, Parts of Asia, and Middle East)
ETSI (Europe, Middle East, Africa, and Parts of Asia)
IC (Industry Canada )
MIC (Japan) (formerly TELEC) – Option
KC (Korea) (formerly KCC) – Option
2.4 GHz Frequency Bands
ETSI: 2.4 GHz to 2.483 GHz
FCC: 2.4 GHz to 2.473 GHz
MIC: 2.4 GHz to 2.495 GHz
KC: 2.4 GHz to 2.483 GHz
2.4 GHz Operating Channels
(Wi‐Fi)
ETSI: 13 (3 non‐overlapping)
FCC: 11 (3 non‐overlapping)
MIC: 14 (4 non‐overlapping)
KC: 13 (3 non‐overlapping)
5 GHz Frequency Bands
ETSI
5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)
5.47 GHz to 5.725 GHz (Ch
100/104/108/112/116/120/124/128/132/136/140)
FCC
5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)
5.47 GHz to 5.725 GHz (Ch
100/104/108/112/116/120/124/128/132/136/140
5.725 GHz to 5.825 GHz(Ch 149/153/157/161/165)
MIC (Japan)
5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)
5.47 GHz to 5.725 GHz (Ch
100/104/108/112/116/120/124/128/132/136/140)
KC
5.15 GHz to 5.35 GHz (Ch 36/40/44/48/52/56/60/64)
5.47 GHz to 5.725 GHz (Ch 100/104/108/112/116/120/124)
5.725 GHz to 5.825 GHz (Ch 149/153/157/161)
M2SD50NBT
Datasheet
Feature
5 GHz Operating Channels
(Wi‐Fi)
Certifications
Warranty
Description
ETSI: 19 non‐overlapping
FCC: 24 non‐overlapping
MIC: (Japan): 19 non‐overlapping
KC: 19 non‐overlapping
Wi‐Fi Alliance
802.11a, 802.11b, 802.11g , 802.11n
WPA Enterprise
WPA2 Enterprise
Cisco Compatible Extensions (Version 4)
Bluetooth SIG Qualification
Three Year Warranty
All specifications are subject to change without notice
3 WLAN FUNCTIONAL DESCRIPTION
3.1
Overview
The M2SD50NBT WLAN block is based on the Laird SSD50NBT SIP (System in Package). It is optimized for low‐
power embedded applications and is configured to operate in dual‐band, two‐stream (2x2 MIMO) mode. Its
functionality includes:



Improved throughput on the link due to frame aggregation, RIFS (reduced inter‐frame spacing), and half‐
guard intervals.
Support for STBC (space‐time block coding) and LDPC (Low Density Parity Check) codes.
Improved 11n performance due to features such as 11n frame aggregation (A‐MPDU and A‐MSDU) and
low‐overhead host‐assisted buffering (RX A‐MSDU and RX A‐MPDU). These techniques can improve
performance and efficiency of applications involving large bulk data transfers such as file transfers or high‐
resolution video streaming.
M2SD50NBT
Datasheet
Other functionality includes the following:
Feature
Description
An RTC block controls the clocks and power going to other internal modules. Its inputs
contain sleep requests from these modules and its outputs contain clock enable and
power signals which are used to gate the clocks going to these modules. The RTC block
also manages resets going to other modules with the device. The M2SD50NBT’s clocking is
grouped into two types: high‐speed and low‐speed.
3.1.1.1 High Speed Clocking
System Clocking
(RTC Block)
The reference 26 MHz clock source drives the PLL and RF synthesizer of Wi‐Fi and
Bluetooth. To minimize power consumption, the reference clock source is powered off in
SLEEP, HOST_OFF, and OFF states.
3.1.1.2 Low Speed Clocking
This module requires an external sleep clock (32.768 KHz) source from host platform
through pin‐50 on the NFGG golden finger. It is used to place BT into deep sleep mode. For
Wi‐Fi only application, it is not needed.
3.1.1.3 Interface Clock
The host interface clock represents another clock domain for the M2SD50NBT. This clock
comes from the SDIO and is independent from the other internal clocks. It drives the host
interface logic as well as certain registers which can be accessed by the host in HOST_OFF
and SLEEP states.
MAC/BB/RF Block
Baseband Block
Clock Sharing
The M2SD50NBT Wireless MAC consists of five major blocks:
 Host interface unit (HIU) for bridging to the AHB for bulk data accesses and APB for
register accesses
 Ten queue control units (QCU) for transferring TX data
 Ten DCF control units (DCU) for managing channel access
 Protocol control unit (PCU) for interfacing to baseband
 DMA receive unit (DRU) for transferring RX data
The M2SD50NBT baseband block (BB) is the physical layer controller for the 802.11b/g/n
air interface.
 It modulates data packets in the transmit direction
 Detects and demodulates data packets in the receive direction.
 It has a direct control interface to the radio to enable hardware to adjust analog gains
and modes dynamically.
 Clock sharing is implemented on the M2SD50NBT. The Bluetooth chip (CSR8811)
receives a reference clock from the Wi‐Fi chip (QCA6004). When Wi‐Fi is in power
off/reset state, Bluetooth is also off.
 External 32.768 KHz signal present on pin 50 allows the BT chip to go into deep sleep
mode and consume lowest amount of power
M2SD50NBT
Datasheet
4 BLUETOOTH FUNCTIONAL DESCRIPTION
The M2SD50NBT Bluetooth (BT) block is based on the CSR8811A08 and described in the Table 2.
Table 2: Bluetooth functions
Feature
HCI‐UART Interface
PCM or I2S Interface
CPU and Memory
Build‐in Standard
WLAN Coexistence
Description
The UART Interface is a standard high‐speed UART interface. It operates up to 4 Mbps,
supporting Bluetooth HCI UART interface.
 Continuous PCM encoded audio data transmission and reception over Bluetooth
 Processor overhead reduction through hardware support for continual
transmission and reception of PCM data
 A bi‐directional digital audio interface that routes directly into the baseband layer
of the firmware. It does not pass through the HCI protocol layer
 Hardware on CSR8811 for sending data to and from a SCO connection
 Up to three SCO connections on the PCM interface at any one time
 PCM interface master, generating PCM_SYNC and PCM_CLK
 PCM interface slave, accepting externally generated PCM_SYNC and PCM_CLK.
 Various clock formats including:
– *Long Frame Sync
– *Short Frame Sync
 GCI timing environments
 13‐bit or 16‐bit linear, 8‐bit μ‐law or A‐law companded sample formats
 Receives and transmits on any selection of three of the first four slots following
PCM_SYNC
 The PCM configuration options are enabled by setting SKEY_PCM_CONFIG32
 Uses a 16‐bit RISC MCU for low power consumption and efficient use of memory.
The MCU, interrupt controller, and event timer run the Bluetooth software stack
and control the Bluetooth radio and host interfaces.
 56 KB of on‐chip RAM is provided to support the RISC MCU and is shared between
the ring buffers used to hold voice/data for each active connection and the
general‐purpose memory required by the Bluetooth stack.
 5 Mb of Internal ROM memory is available on the CSR8811. This memory is
provided for system firmware, storing CSR8811 settings and program code.
The M2SD50NBT internally supports the standard WLAN coexistence interface
through the WLAN_ACTIVE, BT_PRIORITY, and BT_ACTIVE pins.
Reference Clock
The BT block is configured for 26 MHz reference clock frequency. The clock source is
provided to BT internally from the WLAN block on demand from BT_CLK_REQ.
Note: The WLAN block must be initialized prior before BT clock sharing is enabled.
BT Low Energy
Supports Low Energy specification which allows for connections to devices with single
mode LE function (such as a watch, sensor, and HID). The implementation is optimized
for coexistence with WLAN.
BT_RFKILL
The NGFF pin‐54 is connected to (BT_PWD_L) resets and powers down the BT block.
Holding the pin‐54 at Low state turns off the entire BT block; all state information is
lost. To ensure a full reset, the reset signal should be asserted for a period greater
than five milliseconds.
M2SD50NBT
Datasheet
Feature
Description
Radio
The BT radio shares the single antenna port with the WLAN through an internal three‐
way RF switch. The M2SD50NBT implements WLAN/BT coexistence internally.
VDDIO is to set the I/O voltage internally with either 1.8 V or 3.3 V to ensure same
voltage level for the internal Wi‐Fi and BT coexistence signal. Refer to the reference
design specifications for details.
5 ELECTRICAL CHARACTERISTICS
5.1
Absolute Maximum Ratings
Table 3 summarizes the absolute maximum ratings and Table 4 lists the recommended operating conditions for
the M2SD50NBT. Absolute maximum ratings are those values beyond which damage to the device can occur.
Functional operation under these conditions, or at any other condition beyond those indicated in the
operational sections of this document, is not recommended.
Note: Maximum rating for signals follows the supply domain of the signals.
Table 3: Absolute Maximum Ratings
Symbol (Domain)
VDDIO
VCC3_3
Storage
ANT1; ANT2
ESD
5.2
Parameter
WLAN host SDIO interface and BT I/O supply
External 3.3V power supply
Storage Temperature
Maximum RF input (reference to 50‐Ω input)
Electrostatic discharge tolerance
Max Rating
‐0.3 to 3.6
‐0.3 to 3.6
‐40 to +85
+10
2000
Unit
°C
dBm
Recommended Operating Conditions
Table 4: Recommended Operating Conditions
Symbol (Domain)
VDDIO
VCC3_3
T‐ambient
5.3
Parameter
WLAN host interface and BT I/O supply
External 3.3V power supply
Ambient temperature
Min
1.71/3.2
3.2
‐30
Typ
1.8/3.3
3.30
25
Max
1.89/3.46
3.46
85
Unit
°C
DC Electrical Characteristics
Table 5 and Table 6 list the general DC electrical characteristics over recommended operating conditions (unless
otherwise specified).
Table 5: General DC Electrical Characteristics (For 3.3V I/O Operation)
Symbol
Parameter
Conditions
VIH
High Level Input Voltage
VIL
Low Level Input Voltage
IIL
Input
Leakage
Current
Without Pull‐up
or Pull‐down
With Pull‐up
Min
Typ
Max
0.7 x VDD
0V < VIN < VDD
0V < VOUT< VDD
0 V < VIN < VDD
0V < VOUT < VDD
Unit
0.3 x
VDD
‐3
nA
16
48
µA
M2SD50NBT
Datasheet
Symbol
Parameter
With Pull‐down
VOH
High Level Output Voltage
Conditions
0V < VIN < VDD
0V < VOUT < VDD
IOH = ‐4mA
IOH = ‐12mA
Min
Typ
‐14
Unit
‐47
µA
0.9 x VDD
0.9 x VDD
0.1 x
VDD
0.1 x
VDD
IOH = 4mA
VOL
Max
Low Level Output Voltage
IOH = 12mA
Table 6: General DC Electrical Characteristics (For 1.8V I/O Operation)
Symbol
VIH
Parameter
High Level Input Voltage
VIL
Low Level Input Voltage
IIL
Input
Leakage
Current
VOH
VOL
Conditions
Min
0.7 x VDD
Typ
Max
Unit
0.3 x VDD
Without Pull‐up
or Pull‐down
0V < VIN < VDD
0V < VOUT < VDD
‐3
nA
With Pull‐up
0V < VIN < VDD
0V < VOUT < VDD
3.5
13
µA
With Pull‐down
0V < VIN < VDD
0V < VOUT < VDD
‐6.2
‐23
µA
High Level Output Voltage
Low Level Output Voltage
IOH = ‐4mA
0.9 x VDD
IOH = ‐12mA
0.9 x VDD
IOH = 4mA
0.1 x VDD
IOH = 12mA
0.1 x VDD
Figure 1: Power On/Off Timing
Figure 2: Reset Timing
M2SD50NBT
Datasheet
Table 7: Timing Diagram Definitions
Timing
Tb
Description
Time between VDD33 (3.3V )supplies valid, to SDIO reset (pin‐
56;WLAN_PWD_L ) negation.
Min
Unit
µsec
msec
µsec
Note: have suitable 10K ohm Pull‐up on SDIO bus, already. No extra
pull‐up resistor is required.
Tc
Time between VDD33 (3.3V) supplies valid and
BT_RFKILL (pin‐54; BT_PWD_L ) negation
Td
Time between SDIO reset (pin‐56;WLAN_PWD_L ) negation and
VDD33 (3.3V) invalid, or time between BT_RFKILL (pin‐54;
BT_PWD_L ) negation and VDD33(3.3V) invalid.
Time of SDIO reset (pin‐56;WLAN_PWD_L ) assertion during reset
or power down period. 3.3V should keep ON.
Time of BT_RFKILL (pin‐54; BT_PWD_L )assertion during reset or
power down period. 3.3V should keep ON.
Tf
Tg
µsec
msec
Important: There is 10K ohm pull high resistor already implemented on SD_D0, SD_D1, and SD_D3. No
external pull‐up is required for those three lines.
5.4
WLAN Radio Receiver Characteristics
Table 8 and Table 9 summarize the WLAN M2SD50NBT receiver characteristics.
Table 8: WLAN Receiver Characteristics for 2.4 GHz Signal Chain Operation
Symbol
Frx
Srf
Radj
Parameter
Receive input frequency
range
Sensitivity
CCK, 1 Mbps
CCK, 11 Mbps
OFDM, 6 Mbps
OFDM, 54 Mbps
HT20, MCS0
HT20, MCS7
Adjacent channel rejection
OFDM, 6 Mbps
OFDM, 54 Mbps
HT20, MCS0
HT20, MCS7
Conditions
Min
Typ
2.412
Max
Unit
2.484
GHz
See Note3
‐94
‐87
‐91
‐74
‐91
‐71
dBm
See Note4
32
16
31
14
dB
Performance data are measured under signal chain operation.
Performance data are measured under signal chain operation.
Table 9: WLAN Receiver Characteristics for 5 GHz Dual Chain Operation
Symbol
Frx
Parameter
Receive input frequency
Conditions
10
Min
5.15
Typ
Max
5.825
Unit
GHz
M2SD50NBT
Datasheet
Symbol
Srf
Radj
Parameter
range
Sensitivity
OFDM, 6 Mbps
OFDM, 54 Mbps
HT20, MCS0
HT20, MCS7
HT40, MCS0
HT40, MCS7
Adjacent channel rejection
OFDM, 6 Mbps
OFDM, 54 Mbps
HT20, MCS0
HT20, MCS7
Conditions
Min
Typ
Max
Unit
See Note5
‐92
‐74
‐92
‐71
‐86
‐66
dBm
See Note6
22
20
19
dB
Performance data are measured under signal chain operation.
Performance data are measured under signal chain operation.
6 BLUETOOTH RADIO CHARACTERISTICS
Table 10 through Table 11 describe the basic rate transmitter performance, enhanced data transmitter
performance, basic rate receiver performance, enhanced rate receiver performance, and current consumption
conditions at 25°C.
Table 10: Basic Rate Transmitter Performance Temperature at 25°C (3.3V)
Test Parameter
Maximum RF Output Power
Min
0.5
Typ
Max
—
BT Spec.
–6 to +10
Unit
dBm
Frequency Range
2.4
—
2.4835
2.4 ≤ f ≤ 2.4835
GHz
20 dB Bandwidth
—
925
—
≤ 1000
KHz
—
–36
—
≤ –20
dBm
Adjacent Channel TX Power F = F0 + 2
MHz
Adjacent Channel TX Power F = F0 +3
MHz
Δf1avg Maximum Modulation
—
–42
—
≤ –40
dBm
140
165
175
140 < Δf1avg < 175
KHz
Δf2max Minimum Modulation
—
135
—
≥ 115
KHz
Δf2avg/Δf1avg
—
0.9
—
≥ 0.80
—
Initial Carrier Frequency
—
—
≤±75
KHz
Drift Rate
—
—
≤ 20
KHz/50 µs
Drift (DH1 packet)
—
—
≤25
KHz
Drift (DH5 packet)
—
—
≤ 40
KHz
Table 11: Enhanced Data Rate Transmitter Performance 25°C (3.3V)
Test Parameter
Relative Transmit Power
Max Carrier Frequency
π/4 DQPSK
Min
–1
Typ
Max
BT Spec.
–4 to +1
Unit
dBm
—
—
≤ ±10
KHz
11
M2SD50NBT
Datasheet
Test Parameter
Stability |wo|
8 DPSK
Max Carrier Frequency
Stability |wi|
Max Carrier Frequency
Stability |w0+wi|
RMS DEVM
Peak DEVM
Min
—
Typ
Max
—
BT Spec.
Unit
π/4 DQPSK
—
—
8 DPSK
—
—
≤ ±75
KHz
π/4 DQPSK
—
—
≤ ±75
KHz
8 DPSK
—
1.5
—
π/4 DQPSK
—
—
≤ 20
8 DPSK
—
—
≤13
π/4 DQPSK
—
16
—
≤ 35
8 DPSK
—
15
—
≤ 25
π/4 DQPSK
—
12
—
≤ 30
8 DPSK
—
—
≤ 20
99% DEVM
EDR Differential Phase Encoding
Adjacent Channel Power
12
—
99
—
≥ 99
F≥ ± 3MHz
—
–60
—
< –40
dBm
F = ± 2MHz
—
–28
—
≤ –20
dBm
F = ±1MHz
—
–32
—
≤ –26
dB
Table 12: Basic Rate Receiver Performance at 3.3V
Test Parameter
Min
Typ
Max
BT Spec.
Unit
Sensitivity
BER ≤ 0.1%
—
–84
‐78
≤ –70
dBm
Maximum Input
BER ≤ 0.1%
–20
‐10
—
≥ –20
dBm
Co‐Channel
—
—
11
11
Adjacent Channel (±
1 MHz)
—
‐4/‐2
dB
Second Adjacent
Channel (± 2 MHz)
—
‐35/‐28
–30
–30
dB
Third Adjacent
Channel (± 3 MHz)
—
‐42
–40
–40
dB
–39
‐30
‐
≥ –39
dBm
Carrier‐to‐Interferer
Ratio (C/I)
Maximum Level of Intermodulation Interferers
Table 13: Enhanced Data Rate Receiver Performance 3.3V
Test Parameter
Sensitivity (BER ≤0.01%)
8 DPSK
Min
Typ
Max
Bluetooth
Specification
Unit
—
–76
‐71
≤ –70
dBm
12
M2SD50NBT
Datasheet
—
Bluetooth
Specification
≥ –20
dBm
—
—
≥ –20
dBm
—
10
13
≤ ±13
dB
8 DPSK
—
18
20
≤ ±20
dB
Adjacent Channel C/I (BER≤
0.1%)
π/4 DQPSK
—
‐9/‐6
≤0
dB
8 DPSK
—
‐3/0
≤5
dB
Second Adjacent Channel
C/I (BER ≤ 0.1%)
π/4 DQPSK
—
‐42/‐28
–30
≤ –30
dB
8 DPSK
—
‐28/‐22
–25
≤ –25
dB
Third Adjacent Channel C/I
(BER ≤ 0.1%)
π/4 DQPSK
—
‐45
–40
≤ –40
dB
8 DPSK
—
‐39
–33
≤ –33
dB
Test Parameter
Maximum Input (BER
≤0.1%)
Co‐Channel C/I (BER ≤0.1%)
Min
Typ
Max
π/4 DQPSK
–20
—
8 DPSK
–20
π/4 DQPSK
Unit
7 SDIO TIMING REQUIREMENTS
The following figure (Figure 3) and table display SDIO default mode timing.
Figure 3: SDIO Default Mode Timing
Note: Timing is based on CL ≤ 40 pF load on CMD and Data.
Table 14: SDIO Timing Requirements
Symbol
fPP
Parameter
Frequency – Data Transfer mode
Min.
Typ.
‐
Max.
50
Unit
MHz
tWL
Clock low time
‐
‐
ns
tWH
Clock high time
‐
‐
ns
tTLH
Clock rise time
‐
‐
10
ns
tTHL
Clock low time
‐
‐
10
ns
‐
‐
ns
Inputs: CMD, DAT (referenced to CLK)
tISU
Input setup time
13
M2SD50NBT
Datasheet
Symbol
tIH
Parameter
Input hold time
Min.
Typ.
‐
Max.
‐
Unit
ns
‐
14
ns
Outputs: CMD, DAT (referenced to CLK)
tODLY
Output delay time – Data Transfer mode
8 PIN DEFINITIONS
Pin #
Name
Type
GND
‐
Voltage
Reference
‐
Ground
If Not
Used
GND
3.3Vaux
‐
‐
3.3V power supply
3.3V
Reserved
I/O
‐
Reserved pin. Please leave open.
N/C
3.3Vaux
‐
‐
3.3V power supply
3.3V
Reserved
I/O
‐
LED#1
‐
‐
GND
‐
‐
Ground
GND
BT_PCM_CLK
I/O
1.8V
BT PCM clock
N/C
SDIO_CLK
1.8V
WLAN SDIO clock
Only used for M2SD50NBT.
N/C
10
BT_PCM_SYNC
I/O
1.8V
BT PCM Synchronous data
N/C
11
SDIO_CMD
1.8V
WLAN SDIO command data
Only used on M2SD50NBT.
N/C
12
BT_PCM_OUT
1.8V
BT PCM synchronous data output
N/C
13
SDIO_DATA0
I/O
1.8V
WLAN SDIO Data0
Only used on M2SD50NBT.
N/C
14
BT_PCM_IN
1.8V
BT PCM synchronous data input
N/C
15
SDIO_DATA1
I/O
1.8V
WLAN SDIO Data1
Only used on M2SD50NBT.
N/C
16
LED#2
‐
‐
N/C
N/C
17
SDIO_DATA2
I/O
1.8V
WLAN SDIO Data2 (used on M2SD50NBT)
N/C
18
GND
‐
‐
Ground
19
SDIO_DATA3
I/O
1.8V
WLAN SDIO Data3 (used on M2SD50NBT)
N/C
20
BT_UART_WAKE
3.3V
N/C
21
Wake on WLAN
1.8V
Reserved for BT to wakeup Host.
When BT wakes up from its deep sleep
state, it sends an H pulse signal out to Host.
Normally, it is Low state.
Reserved for Wake‐ON‐Wireless
(WOW) LAN, WLAN output signal to wake
up host, active Low and already has internal
10K pull up.
Note: Not supported by current software.
Description
Reserved pin. Please leave open.
Reserved for Wi‐Fi LED indicator,
Active High.
Note: Not supported by current software.
14
N/C
N/C
Ground
N/C
M2SD50NBT
Datasheet
Name
Type
22
BT_UART_TXD
Voltage
Reference
1.8V
23
WLAN reset
1.8V
WLAN reset or power down; Active L
Already has internal 10K pull‐up.
Hold this to L to power down the Wi‐Fi chip.
24
Mechanical Key‐E
‐
‐
‐
‐
25
Mechanical Key‐E
‐
‐
‐
‐
26
Mechanical Key‐E
‐
‐
‐
‐
27
Mechanical Key‐E
‐
‐
‐
‐
28
Mechanical Key‐E
‐
‐
‐
‐
29
Mechanical Key‐E
‐
‐
‐
‐
30
Mechanical Key‐E
‐
‐
‐
‐
31
Mechanical Key‐E
‐
‐
‐
‐
32
BT_UART_RXD
1.8V
BT UART receives data.
N/C
33
GND
‐
‐
Ground
GND
34
BT_UART_RTS
1.8V
BT UART Ready to Send.
N/C
35
N/C
‐
‐
N/C
N/C
36
BT_UART_CTS
1.8V
BT UART Clear to Send.
N/C
37
N/C
‐
‐
N/C
NC/
38
N/C
‐
‐
N/C
N/C
39
GND
‐
‐
Ground
GND
40
N/C
‐
‐
N/C
N/C
41
N/C
‐
‐
N/C
N/C
42
N/C
‐
‐
N/C
N/C
43
N/C
‐
‐
N/C
N/C
44
LTE_COEX3
1.8V
Reserved for LTE coexistence
Note: Not currently supported.
N/C
45
GND
‐
‐
Ground
GND
46
LTE_ACTIVE
1.8V
Reserved for LTE coexistence
Note: Not currently supported.
N/C
47
N/C
‐
‐
N/C
N/C
48
LTE_FRAME_SYNC
1.8V
Reserved for LTE coexistence
Note: Not currently supported.
N/C
49
N/C
‐
‐
N/C
N/C
50
CLK_32K
3.3V
32.768KHz slow clock input.
Necessary to put BT into deep sleep mode.
N/C
51
GND
‐
‐
Ground
GND
52
N/C
‐
‐
N/C
N/C
53
N/C
‐
‐
N/C
N/C
54
BT_RFKILL
3.3V
Reset BT or to disable BT; Active L
N/C
Pin #
Description
BT UART transmission data.
15
If Not
Used
N/C
N/C
M2SD50NBT
Datasheet
Name
Type
55
N/C
‐
Voltage
Reference
‐
56
WIFI_RFKILL
3.3V
57
GND
‐
‐
N/C
Reserved for RF disable (RF Kill) feature.
Active Low.
Note: Not supported by current software.
Ground
58
N/C
‐
‐
N/C
N/C
59
N/C
‐
‐
N/C
N/C
60
N/C
‐
‐
N/C
N/C
61
N/C
‐
‐
N/C
N/C
62
N/C
‐
‐
N/C
N/C
63
GND
‐
‐
Ground
GND
64
N/C
‐
‐
N/C
N/C
65
N/C
‐
‐
N/C
N/C
66
N/C
‐
‐
N/C
N/C
67
N/C
‐
‐
N/C
N/C
78
N/C
‐
‐
N/C
N/C
69
GND
‐
‐
Ground
GND
70
N/C
‐
‐
N/C
N/C
71
N/C
‐
‐
N/C
N/C
72
3.3Vaux
‐
‐
3.3V power supply
3.3V
73
N/C
‐
‐
N/C
N/C
74
3.3Vaux
‐
‐
3.3V power supply
3.3V
75
GND
‐
‐
Ground
GND
Pin #
Description
16
If Not
Used
N/C
N/C
GND
M2SD50NBT
Datasheet
9 MECHANICAL SPECIFICATIONS
Figure 4: M.2 mechanical drawings
Note:
The Wi‐Fi MAC address is located on the product label. The BT MAC address is always be numerically
subsequent to the Wi‐Fi MAC address. Therefore, the BT MAC address is Wi‐Fi MAC address plus one.
10 MOUNTING
The M2SD50NBT connects to the host via a standard PCI EXPRESS M2 connector.
Kyocera’s (www.Kyocera‐connector.com) 6411 series provide 1.8 mm, 2.3 mm and 3.2 mm connector heights.
M2SD50NBT is a signal‐side component module; Laird recommends part number
24‐6411‐067‐101‐897E which has 2.3 mm connector height.
The stand‐off mating to the recommend 2.3 mm connector from EMI STOP (www.EMISTOP.com) is part number
F50M16‐041525P1D4M. Detail layout and stencil opening are show in Figure 5.
17
M2SD50NBT
Datasheet
Figure 5: Mounting information for M2SD50NBT and recommended land pad for stand‐off
18
M2SD50NBT
Datasheet
11 RF LAYOUT DESIGN GUIDELINES/PRECAUTIONS
The following is a list of RF layout design guidelines and recommendation when installing a Laird radio into your
device.










Do not run antenna cables directly above or directly below the radio.
Do not place any parts or run any high speed digital lines below the radio.
If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the devices
as far apart from each other as possible. Also, make sure there are at least 25dB isolation between
Bluetooth antenna and Wi‐Fi antenna.
Laird recommends the use of a double shielded cable for the connection between the radio and the
antenna elements.
Be sure to put the capacitor on the power pin as close as possible to reduce the radiation issue.
Use proper electro‐static‐discharge (ESD) procedures when installing the Laird radio module.
In order to get maximum throughput when operate at MIMO 2x2, two antennas with at least 25dB isolation
is recommended.
To avoid negatively impacting TX power and receiver sensitivity, do no cover the antennas with metallic
objects or components.
Opening/handing/removing must be done on an anti‐ESD treated workbench.
All workers must also have undergone anti‐ESD treatment.
The devices should be mounted within one year of the date of delivery.
19
M2SD50NBT
Datasheet
12 REGULATORY
12.1 Certified Antennas
NOTE: The module is professionally installed device and installed in industry computer that is generally for
industrial use. The device cannot be sold retail, to the general public or by mail order. It must be sold to dealers
or have strict marketing control (such as Datalogic S.r.l. and SOREDI touch system GmbH).
The module must be installed by a specified installers that require approval installation by Datalogic S.r.l. and
SOREDI touch system GmbH.
Due to this module is a professional installation device, only the antennas listed below are allowed to use.
Model
HUBER+SUHNER
1399.99.0124
Model
HUBER+SUHNER
1399.17.0106
Type
PCB
Connector
2400~2500MHz 5150~5875MHz
Antenna
includes
cable
pigtail,
terminated
by
connector
U.FL
1 dBi (2.4‐2.5GHz), 1dBi (5.15‐5.875GHz)
Type
Connector
Sencity®
Omni‐S
Antenna
N, 50 jack
(female)
20
2400~2500MHz 2500~2700MHz
3400~3700MHz 4900~5470MHz
5470~5935MHz
6 dBi (2.4‐2.5GHz), 6dBi (2.5‐2.7GHz)
7 dBi (3.4‐3.7GHz), 8dBi (4.9‐5.47GHz)
8dBi (5.47‐5.935)
M2SD50NBT
Datasheet
13 FCC AND IC REGULATORY
Model
M2SD50NBT
US/FCC
U4G‐RHINOIIWEC7
CANADA/IC
3862E‐RHINOIIWEC7
The M2SD50NBT is designed to pass certification with the antenna listed below. The required antenna
impedance is 50 ohms.
Peak gain ( dBi )
Model
HUBER+SUHNER
1399.99.0124
Type
Connector
PCB
Antenna
includes
cable pigtail
terminated
by
connector
U.FL
2400~2500
MHz
5150~5875MHz
1 dBi
1dBi
Peak gain ( dBi )
Model
Type
Connector
HUBER+SUHNER
1399.17.0106
Sencity®
Omni‐S
Antenna
N, 50 jack
(female)
2400~2500
MHz
2500~2700
MHz
6 dBi
6 dBi
3400~3700 4900~5470 5470~5935
MHz
MHz
MHz
7 dBi
8 dBi
8 dBi
13.1 FCC
13.1.1 Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment
does cause harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one of the following
measures:




Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
21
M2SD50NBT
Datasheet
13.1.1.1 FCC Caution:
Any changes or modifications not expressly approved by the party responsible for compliance could void the
user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, including
interference that may cause undesired operation.
13.1.1.2 Important Note:
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator and your body.
This transmitter must not be co‐located or operating in conjunction with any other antenna or transmitter.
Country Code selection feature to be disabled for products marketed to the US/Canada.
This device is intended only for OEM integrators under the following conditions:
1. The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2. The transmitter module may not be co‐located with any other transmitter or antenna,
3. For all products market in US, OEM has to limit the operation channels in CH1 to CH11 for 2.4G band by
supplied firmware programming tool. OEM shall not supply any tool or info to the end‐user regarding to
Regulatory Domain change.
As long as the three conditions above are met, further transmitter testing will not be required. However, the
OEM integrator is still responsible for testing their end‐product for any additional compliance requirements
required with this module installed.
13.1.1.3 Important Note:
In the event that these conditions cannot be met (for example certain laptop configurations or co‐location with
another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on
the final product. In these circumstances, the OEM integrator will be responsible for re‐evaluating the end
product (including the transmitter) and obtaining a separate FCC authorization.
13.1.2 End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm
may be maintained between the antenna and users. The final end product must be labeled in a visible area with
the following: Contains FCC ID: U4G‐RHINOIIWEC7.
13.1.3 Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
13.2 Industry Canada
13.2.1 Industry Canada Statement
This device complies with Industry Canada’s license‐exempt RSSs. Operation is subject to the following two
conditions:
22
M2SD50NBT
Datasheet


This device may not cause interference; and
This device must accept any interference, including interference that may cause undesired operation of
the device.
Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes:


l’appareil ne doit pas produire de brouillage;
l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d’en compromettre le fonctionnement.
This radio transmitter (M2SD50NBT – IC: 3862E‐RHINOIIWEC7) has been approved by Industry Canada to
operate with the antenna types listed below with the maximum permissible gain indicated. Antenna types not
included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Le présent émetteur radio (M2SD50NBT –IC: 3862E‐RHINOIIWEC7)) a été approuvé par Industrie Canada pour
fonctionner avec les types d'antenne énumérés ci‐dessous et ayant un gain admissible maximal. Les types
d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement
interdits pour l'exploitation de l'émetteur.
13.2.2 Antenna Information
NOTE: The module is professionally installed device and installed in industry computer that is generally for
industrial use. The device cannot be sold retail, to the general public or by mail order. It must be sold to dealers
or have strict marketing control (such as Datalogic S.r.l. and SOREDI touch system GmbH).
The module must be installed by a specified installers that require approval installation by Datalogic S.r.l. and
SOREDI touch system GmbH.
Due to this module is a professional installation device, only the antennas listed below are allowed to use.
Peak gain ( dBi )
Model
HUBER+SUHNER
1399.99.0124
Type
Connector
PCB
Antenna
includes
cable pigtail
terminated
by
connector
U.FL
2400~2500
MHz
5150~5875MHz
1 dBi
1dBi
Peak gain ( dBi )
Model
Type
Connector
HUBER+SUHNER
1399.17.0106
Sencity®
Omni‐S
Antenna
N, 50 jack
(female)
2400~2500
MHz
2500~2700
MHz
6 dBi
6 dBi
23
3400~3700 4900~5470 5470~5935
MHz
MHz
MHz
7 dBi
8 dBi
8 dBi
M2SD50NBT
Datasheet
13.2.2.1 Caution:
(i) The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for
harmful interference to co‐channel mobile satellite systems;
(ii) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the bands 5250‐
5350 MHz and 5470‐5725 MHz shall be such that the equipment still complies with the EIRP limit;
(iii) For devices with detachable antenna(s), the maximum antenna gain permitted for devices in the band 5725‐
5850 MHz shall be such that the equipment still complies with the EIRP limits specified for point‐to‐point and
non‐point‐to‐point operation as appropriate; and
Operations in the 5.25‐5.35GHz band are restricted to indoor usage only.
13.2.2.2 Avertissement:
(i) les dispositifs fonctionnant dans la bande de 5150 à 5250MHz sont réservés uniquement pour une utilisation
à l'intérieur afin de réduire les risques de brouillage préjudiciable aux systèmes de satellites mobiles utilisant les
mêmes canaux;
(ii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis pour les dispositifs
utilisant les bandes de 5250 à 5350MHz et de 5470 à 5725 MHz doit être conforme à la limite de la p.i.r.e;
(iii) pour les dispositifs munis d'antennes amovibles, le gain maximal d'antenne permis (pour les dispositifs
utilisant la bande de 5725 à 5850 MHz) doit être conforme à la limite de la p.i.r.e. spécifiée pour l'exploitation
point à point et l'exploitation non point à point, selon le cas;
Les opérations dans la bande de 5.25‐5.35GHz sont limités à un usage intérieur seulement.
13.2.3 Radiation Exposure Statement
This equipment complies with Canada radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
13.2.4 Déclaration d'exposition aux radiations
Cet équipement est conforme Canada limites d'exposition aux radiations dans un environnement non contrôlé.
Cet équipement doit être installé et utilisé à distance minimum de 20cm entre le radiateur et votre corps.
This device is intended only for OEM integrators under the following condition:

The transmitter module may not be co‐located with any other transmitter or antenna.
As long as the condition above is met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end‐product for any additional compliance requirements required
with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:

Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.
Tant que les 1 condition ci‐dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas
nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes
exigences de conformité supplémentaires requis pour ce module installé.
13.2.4.1 Important Note:
In the event that these conditions cannot be met (for example certain laptop configurations or co‐location with
another transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used
24
M2SD50NBT
Datasheet
on the final product. In these circumstances, the OEM integrator will be responsible for re‐evaluating the end
product (including the transmitter) and obtaining a separate Canada authorization.
13.2.4.2 Note Importante:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations
d'ordinateur portable ou de certaines co‐localisation avec un autre émetteur), l'autorisation du Canada n'est
plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances,
l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une
autorisation distincte au Canada.
13.2.5 End Product Labeling
The final end product must be labeled in a visible area with the following: Contains IC: IC: 3862E‐RHINOIIWEC7.
13.2.6 Plaque signalétique du produit final
Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: IC: 3862E‐RHINOIIWEC7.
13.2.7 Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.
13.2.8 Manuel d'information à l'utilisateur final
L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon
d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements
comme indiqué dans ce manuel.
25

---

Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.5
Linearized                      : Yes
Author                          : tina_huang
Create Date                     : 2017:10:30 10:17:48+08:00
Modify Date                     : 2017:10:30 10:17:48+08:00
XMP Toolkit                     : Adobe XMP Core 5.4-c005 78.147326, 2012/08/23-13:03:03
Format                          : application/pdf
Title                           : Microsoft Word - M2SD50NBT User Manual _171030_.docx
Creator                         : tina_huang
Creator Tool                    : PScript5.dll Version 5.2.2
Producer                        : Acrobat Distiller 11.0 (Windows)
Document ID                     : uuid:15ea8b64-094d-44ac-b5f5-29008b41abd6
Instance ID                     : uuid:35cf1bf4-f7d8-47d8-be52-67b0c93cf47c
Page Count                      : 25

EXIF Metadata provided by EXIF.tools