Digi 50M1745 802.11 b/g/n digital transceiver module User Manual Digi Connect ME and Wi ME Hardware Reference
Digi International Inc 802.11 b/g/n digital transceiver module Digi Connect ME and Wi ME Hardware Reference
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User Manual 1
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| Document ID | 1521485 |
| Application ID | 12FD7ek3EibOSuBFLE2QnQ== |
| Document Description | User Manual 1 |
| Short Term Confidential | No |
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| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 127.65kB (1595685 bits) |
| Date Submitted | 2011-08-11 00:00:00 |
| Date Available | 2011-08-11 00:00:00 |
| Creation Date | 2011-05-03 15:04:36 |
| Producing Software | Acrobat Distiller 9.0.0 (Windows) |
| Document Lastmod | 2011-05-03 15:04:36 |
| Document Title | Digi Connect ME and Wi-ME Hardware Reference |
| Document Creator | FrameMaker 9.0 |
| Document Author: | Digi International |
Digi Connect Wi‐ME® 9210 Hardware Reference 90001247_A 5/3/2011 © 2011 Digi International Inc. All rights reserved. Digi, Digi International, the Digi logo, a Digi International Company, Digi Connect, Digi Connect Wi-ME, ConnectCore, NET+ and NET+OS are trademarks or registered trademarks of Digi International, Inc. in the United States and other countries worldwide. All other trademarks are the property of their respective owners. All other trademarks mentioned in this document are the property of their respective owners. Information in this document is subject to change without notice and does not represent a commitment on the part of Digi International. Digi provides this document “as is,” without warranty of any kind, either expressed or implied, including, but not limited to, the implied warranties of fitness or merchantability for a particular purpose. Digi may make improvements and/or changes in this manual or in the product(s) and/or the program(s) described in this manual at any time. This product could include technical inaccuracies or typographical errors. Changes are periodically made to the information herein; these changes may be incorporated in new editions of the publication. About This Document •••••••••••••••••••••••••••••••••••••••••••••••••••••••• Scope of the Reference Manual The purpose of this document is to enable developers to integrate the Digi Connect Wi-ME 9210 embedded modules with other devices, enabling these devices to make use of the module’s rich networking features. Unless mentioned specifically by name, the products will be referred to as the embedded modules or modules. Individual naming is used to differentiate product specific features. Note: Related Documentation See the NS9210 Hardware Reference for information on the NS9210 chip. Support Information To get help with a question or technical problem or make comments and recommendations about Digi products and documentation, use the following contact information. General Customer Service and Support Digi International United States: 1 877-912-3444 11001 Bren Road East Other Locations: 1 952-912-3444 Minnetonka, MN 55343 www.digi.com/support/eservice/ eservicelogin.jsp U.S.A. 4 Contents About This Document ................................................................................................................ 3 Related Documentation .................................................................................................... 3 Support Information ......................................................................................................... 3 Chapter 1: Contents .............................................................................................................. 5 Chapter 2: About the Digi Connect Wi-ME Embedded Module7 Overview .......................................................................................................................... 7 Types of Modules............................................................................................................. 8 Connectors: Power and Device Interface ......................................................................... 9 Connectors: Antenna ...................................................................................................... 11 Module LEDs ................................................................................................................. 12 Chapter 3: About the Development Board ....................................................................... 13 Overview ........................................................................................................................ 13 Basic Description ........................................................................................................... 14 Port Descriptions ............................................................................................................ 16 Connectors and Blocks................................................................................................... 19 Switches and Push Buttons............................................................................................. 24 Development Board LEDs ............................................................................................. 25 Power Jack P15 .............................................................................................................. 27 Test Points ...................................................................................................................... 28 Chapter 4: Programming Considerations......................................................................... 29 Overview ........................................................................................................................ 29 Module Pinout ................................................................................................................ 30 Reset ............................................................................................................................... 32 Memory .......................................................................................................................... 33 Appendix A Module Specifications .................................................................................... 35 Network Interface........................................................................................................... 35 Serial Interface ............................................................................................................... 36 Data Rates (bps) ............................................................................................................. 36 DC Characteristics.......................................................................................................... 36 Power Management (Digi Connect ME 9210 only) ...................................................... 38 Thermal Specifications .................................................................................................. 39 Mechanical ..................................................................................................................... 40 Bar Code ........................................................................................................................ 41 Dimensions..................................................................................................................... 41 Recommended PCB Layout........................................................................................... 44 Antenna Information ...................................................................................................... 45 RF Exposure Statement.................................................................................................. 47 Safety Statements........................................................................................................... 47 Appendix B Certifications.................................................................................................. 49 FCC Part 15 Class B ...................................................................................................... 49 Industry Canada ............................................................................................................. 50 Declaration of Conformity ............................................................................................. 51 International EMC Standards......................................................................................... 52 Appendix C Sample Application: PoE Power Supply ..................................................... 55 Appendix D Sample Application: TTL Signals to EIA-232 ............................................ 59 Appendix E Change Log .................................................................................................... 61 About the Digi Connect Wi-ME Embedded Module Overview The Digi Connect Wi-ME 9210 b/g is a fully customizable and secure 802.11b/g wireless embedded module that provides integration flexibility in a variety of connection options. Built on the new Digi NS9210 processor in combination with a 802.11bgn Wi-Fi radio, it is pin-compatible with the existing Digi Connect Wi-ME 802.11b module allowing customers to easily migrate to the next-generation version of the product. The NS9210 processor provides a host of features such as an ARM926EJ-S core running at speeds from 75-150MHz, on-chip AES encryption engine, one PICs, a serial port, SPI and I2C interfaces, PWM, and others. Most importantly, it is a “drop-in” replacement for the NS7520, which means that is the ideal upgrade vehicle to deliver a next-generation design. The integrated FIM on the NS9210 processor offer interface flexibility allowing the modules to provide high performance interface functionality and unique software-driven configuration flexibility by dynamically loading software support for application specific interfaces, e.g. UART, CAN, USB device, 1-Wire, SDIO, and others. The Digi Connect Wi-ME 9210 embedded module offers freedom and flexibility of professional embedded software development provided by the easy-to-use, cost-effective and complete Digi JumpStart Kits™ for NET+OS and Microsoft.NET Micro Framework. From medical systems to building control and industrial automation, in virtually any application where embedded device connectivity over a wireless network is needed, embedded modules are the ideal choice, delivering high-performance functionality. Note: Unless mentioned specifically by name, the products will be referred to as the embedded modules or modules. Individual naming is used to differentiate product specific features. This chapter provides information about the modules hardware and contains the following topics: "Types of Modules" on page 8 "Connectors: Antenna" on page 11 "JTAG Jumper" on page 10 "Module LEDs" on page 12 Types of Modules There are two types of modules. One module utilizes Digi Plug-and-Play Firmware, while the second is customizable with the option to develop a firmware application in .NET MF or NET+OS. If you are developing your firmware application in NET+OS, you will be using a module with a JTAG interface. Note: JTAG is a commonly used term that is also referred to as IEEE 1149.1, an industry standard test protocol. JTAG is an abbreviation for the European Joint Test Action Group, which invented the first versions of the IEEE 1149.1 interface. The JTAG interface, along with the other development tools, enables you to download, run and debug programs on the module. The following figures show the two types of modules. Digi Connect Wi-ME Modules Model Description Used for development purposes only JTAG interface No JTAG interface Ordered independently for use in your implementation. DC-WME-Y402-JT DC-WME-Y402-S DC-WME-Y402-C Note: Figure -S: No JTAG for use with Digi Plug-and-Play Firmware -C: No JTAG for use with custom NET+OS applications -JT: With JTAG for use with custom firmware development Connectors: Power and Device Interface Difference in pin assignments/availability Digi Connect Wi-ME 9210 module uses a 14 pin male connector that fits into the Digi Connect ME family 20 pin foot print. Pins 1 through 6 are not used and have been removed from the Connect Wi-ME module. The pin assignment table shows the appropriate values. Power and Device Interface Connector Viewed from bottom of the module: Wi-ME Pin 2 Wi-ME Pin 1 > ME 20 Pin Connector ME Pin 2 ME Pin 1 > Module Front ME Pin 20 Wi-ME 14 Pin Connector ME Pin 19 > Bottom View Power and Device Interface Connector Pin Assignments Signal ME Wi-ME Pin # Description Pin # Function Function VETH+ — ME: Power Pass-Thru+ Wi-ME: Position Removed VETH- — ME: Power Pass-ThruWi-ME: Position removed 3-6 — — Position removed RXD RXD Receive Data (Input) TXD TXD Transmit Data (Output) Power and Device Interface Connector Pin Assignments Signal ME Wi-ME Description Pin # Function Pin # Function RTS RTS Request to Send (Output) 10 DTR DTR Data Terminal Ready (Output) 11 CTS CTS Clear to Send (Input) 12 DSR DSR Data Set Ready (Input) 13 DCD DCD Data Carrier Detect (Input) 14 /RESET /RESET Reset 15 +3.3V +3.3V Power 16 GND 10 GND Ground 17, 18 — 11, 12 — Not accessible with Digi Plug-and-Play Firmware. If using a development kit, see "Module Pinout" on page 30 for detailed IO configuration information. 19 — 13 — Reserved. Do not connect. 20 /INIT 14 /INIT Software Reset Note: The development board provides connectors for an optional PoE application kit. Note: Any pins not used can be left floating. Note: See "Module Pinout" on page 30 for detailed IO configuration information. JTAG Jumper The J1 controls the way in which the Digi Connect Wi-ME 9210 JTAG device responds to pin 14 being pulled low. 10 Jumper Result None No reset 1-2 Hard reset 2-3 Soft reset Jumper is in the 1/2 position Hard Reset The embedded modules support a hardware reset on pin 8 of the 14-pin header. Pulling pin 8 low with an open drain driver will force the module into a hard reset state. The module will remain in the reset state as long and pin 8 is held low and will leave this reset state ~250mS after pin 8 goes high. Do not actively drive pin 8 high and do not allow the rise time of the pin 14 to be longer than 100uS. When used with the development board, this pin is wired to reset button SW4, which means it acts as a hard reset button. Connectors: Antenna The Digi Connect Wi-ME is available with 1 RP-SMA connector. The antenna is connected to the module with a reverse polarity SMA connector (sub-miniature size A). The antenna only fits on the module one way to ensure a proper connection. Caution: This Part 15 radio device operates on a non-interference basis with other devices operating at this frequency when using the antennae listed in the Antenna Specification table. Any changes or modification to the product not expressly approved by Digi International could void the user’s authority to operate the device. Antenna Specifications Type Dipole Part number DG-ANT-20DP-BG Gain 2 dBi 11 Module LEDs LED Locations Associated/Diagnostic Network Activity Note: The LEDs are the same for a module with or without a JTAG connector. LED Behaviors LED 12 Digi Plug and Play Firmware Digi Connect Wi-ME Customizable Modules Left Associated/Diagnostic: On - unit is associated with an access point. Blinking slowly - unit is in ad hoc mode. Blinking quickly - unit is scanning for a network. Same as Digi Plug-and Play Firmware (Network link status). Right Network Activity: Blinking -network data is transmitted or received. This LED is software programmable. About the Development Board Overview The development board is a hardware platform from which you can determine how to integrate the embedded modules into your design. The board consists of the following main features: Socket for connecting the embedded modules JTAG connection (for use with the development kit only) GPIO switches Serial and GPIO ports Power input This chapter provides information on development board components and contains the topics listed below. For more detailed information on the development board, see the schematic and mechanical drawings on the CD that accompanies your kit. Once you’ve installed the software that comes with your kit, you can access the schematic from the Start menu. "Basic Description" on page 14 "Placement of Module" on page 16 "Connectors and Blocks" on page 19 "Switches and Push Buttons" on page 24 "Development Board LEDs" on page 25 "Power Jack P15" on page 27 "Test Points" on page 28 13 Basic Description The development board contains connectors, switches, and LEDs for use while integrating the embedded module into your design. See the following figure for the location of the connectors, switches, and LEDs. Additionally, the board provides test points (not shown on the figure). For more information about test points, see "Test Points" on page 28. Board Layout and Connector Locations: 14 Connectors, Switches and LEDs Board Description Markers 1-5 Secondary Serial Port, P2 Primary Port LEDs, CR5 CR18 GPIO Switch Bank, SW3 Prototyping Area, P4 JTAG Header, P12 Connectors, Switches and LEDs Board Description (continued) Markers 6-10 10 232 Enable Jumper Block, P5 Embedded Module Connector, P10 JTAG Connector, P11 Primary Serial Port, P1 GPIO Port, P7 Connectors, Switches and LEDs Board Description (continued) Markers 11-15 11 12 13 14 15 Digital I/O LEDs, CR19 CR23 Logic Analyzer header, P3 POE Source LED, CR24 Reset Switch, SW4 User Pushbuttons, SW1 & SW2 Connectors, Switches and LEDs Board Description (continued) Markers 16-21 16 17 18 19 20 21 Power Jack, P15 On/Off switch, SW5 Secondary Port LEDs CR1-CR4 -48V DC output from module P13 12V output from PoE module P14 Current Measurement Option P8 "Port Descriptions" on page 16 "Connectors and Blocks" on page 19 "Switches and Push Buttons" on page 24 "Development Board LEDs" on page 25 "Power Jack P15" on page 27 See the following figures for placement of either module onto the development board. 15 Placement of Module Caution: When handling the development board, wear a grounding wrist strap to avoid ESD damage to the board. Port Descriptions The development board provides the following ports: Primary Serial Port, P1 Secondary Serial Port, P2 GPIO Port, P7 See the figure titled "Board Layout and Connector Locations:" on page 14 for the location of the ports. The following sections describe the ports. Primary Serial Port, P1 The Primary Serial Port is a DB-9 male connector that is labeled as P1 on the development board. See the following figure for pin orientation; see the following table for pin assignments. 16 Primary Serial Port Pin Orientation Pin 1 Pin 5 Pin 6 Pin 9 Primary Serial Port Pin Assignments Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 DCD RXD TXD DTR GND DSR RTS CTS — Data Carrier Detect Receive Data Transmit Data Data Terminal Ready Signal/ Chassis Ground Data Set Ready Request To Send Clear To Send — Secondary Serial Port, P2 The Secondary Serial Port is a DB-9 male connector that is labeled as P2 on the development board. The port is used only with the Digi Connect ME modules with JTAG interfaces for debugging purposes. See the following figure for pin orientation; see the following table for pin assignments. Secondary Serial Port Pin Orientation Pin 1 Pin 5 Pin 6 Pin 9 17 Secondary Serial Port Pin Assignments Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 — RXD TXD — GND — — — — — Receive Data Transmit Data — Signal/ Chassis Ground — — — — RS232-Enable Pin Header, P5 P5 is used to enable or disable serial port RS232s transceiver. Shorting P5 pins 1 and 2 will enable the RS232 transceiver. Shorting P5 pins 2 and 3 will disable the RS232 transceiver. GPIO Port, P7 The GPIO port is a 9-pin male right-angle connector that is labeled as P7 on the development board. See the following figure for pin orientation; see the following tables for pin assignments. For input and output threshold specifications, see "DC Characteristics" on page 36. Note that each signal has a 220 ohm series resistor between the P7 pin and the module (except GND). Note: The development board is shipped with a 9-pin screw-flange plug attached to the GPIO port. GPIO Port Pin Orientation Pin 1 Pin 9 GPIO Port Pin Assignments Signal 18 Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 GPIO-1 GND GPIO-2 GND GPIO-3 TXD_TTL GPIO-4 RXD_TTL GPIO-5 Connectors and Blocks The development board provides the following connectors and blocks: Embedded Module Connector, P10 The Digi Connect Wi-ME module does not provide pins 1-6 JTAG Debugger Connector, P12. -48V DC input to PoE module (Digi Connect ME must be connected to a Powering Device for this feature.), P13 12V DC output from PoE module into Dev Board Power Supply, P14 Logic Analyzer Header, P3 See the figure titled "Board Layout and Connector Locations:" on page 14 for the location of the connectors and blocks. The following sections describe the connectors and blocks. Embedded Module Connector, P10 The Digi Connect ME embedded module Connector is a 20-pin female vertical header that is labeled P10 on the development board. See the following figure for pin orientation; see the following table for pin assignments. Note: The figure shows the connector using the same orientation as shown in the figure titled "Board Layout and Connector Locations:" on page 14. 19 Embedded Module Connector Pin Orientation Connect ME 19 Connect Wi-ME & Wi-ME 9210 20 13 14 Module Connector Pin Assignments Signal ME 20 Wi-ME Description Pin # Function Pin # Function VETH+ — — ME: Power Pass-Thru + Wi-ME: Position removed VETH- — — ME: Power Pass-Thru Wi-ME: Position removed 3-6 Position Removed — — RXD RXD Receive Data (Input) TXD TXD Transmit Data (Output) RTS RTS Request to Send (Output) 10 DTR DTR Data Terminal Ready (Output) 11 CTS CTS Clear to Send (Input) 12 DSR DSR Data Set Ready (Input) 13 DCD DCD Data Carrier Detect (Input) 14 /RESET /RESET Reset 15 +3.3V +3.3V Power 16 GND 10 GND Ground 17, 18 — 11, 12 — Not accessible with Digi Plug-and-Play Firmware. If using a development kit, see "Module Pinout" on page 30 for detailed IO configuration information. 19 — 13 — Reserved 20 /INIT 14 /INIT Digi Plug-and-Play Firmware Software Reset Note: The Digi Connect Wi-ME module does not provide pins 1-6 Note: See "Module Pinout" on page 30 for detailed IO configuration information. Module JTAG Interface Connector, P11 The Module’s JTAG Interface Connector is a 14-pin female vertical header that is labeled P11 on the development board. The connector mates with the JTAG connector on the embedded module. The Module’s JTAG Connector pins are tied to the debugger connector (see “JTAG Debugger Connector, P12”). Since the modules' JTAG connectors are mounted on the bottom side of the modules, the pin 1 location is mirrored from that of the Development board's mating JTAG connector (P11). The resulting pin mapping is indicated in the Module JTAG Interface Connector Pin Assignments table below. ME JTAG Connector Pin 14 Pin 13 Development Board JTAG Connector (P11) Pin 2 Pin 13 Pin 1 Pin 14 Pin 1 Pin 2 (Top View) (Bottom View) Bottom side of module (left) and development board from top (right) Module JTAG Interface Connector Pin Assignments JTAG Signal ME JTAG pin # JTAG Connector (P11) pin # +3.3V GND TRST# GND TDI GND TMS GND TCK 10 RXD 10 TDO 11 12 SRST 12 11 +3.3V 13 14 TXD 14 13 21 JTAG Debugger Connector, P12 The JTAG debugger connector is a 20-pin male vertical header that is labeled P12 on the development board. The connector mates with a JTAG debugger plug (for example, a Digi JTAG Link). The connector is used with the development kit only. See the following figure for pin orientation. See the following table for pin assignments. The figure shows the connector using the same orientation as shown in the figure titled "Board Layout and Connector Locations:" on page 14. Note: JTAG Debugger Connector Pin Orientation JTAG Debugger Connector Pin Assignments 22 Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin 9 Pin 10 VCC+ VCC+ /TRST GND TDI GND TMS GND TCK GND Pin 11 Pin 12 Pin 13 Pin 14 Pin 15 Pin 16 Pin 17 Pin 18 Pin 19 Pin 20 RTCK GNO TDO GND /SRST GNO N/A GND N/A GND Logic Analyzer Header, P3 The Logic Analyzer Header is a 20-pin male vertical header that is labeled P3 on the development board. The header is for connecting a digital signal analyzer (for example, a logic analyzer) to the development board. See the following figure for pin orientation; see the following table for pin assignments. The figure shows the connector using the same orientation as shown in the figure titled "Board Layout and Connector Locations:" on page 14. Note: Logic Analyzer Header Pin Orientation Logic Analyzer Header Pin Assignments Pin Pin Pin 3 Pin 4 Pin 5 Pin 6 Pin 7 Pin 8 Pin Pin 10 V_Ether+ V_Ether- Not Connected Not Connected Not Connected Not Connected RXD TXD GPIO-4 GPIO-5 Pin 13 Pin 14 Pin 17 Pin 18 Pin 19 Pin 20 Reserved /INIT Pin 11 GPIO-2 Pin 12 GPIO-3 GPIO-1 /RST Pin 15 3.3v Pin 16 GND See "Power and Device Interface Connector Pin Assignments" on page 9 for details. 23 Switches and Push Buttons The development board provides the following switches: User PB1 User PB2 GPIO Switch Bank 1, SW3 Reset, SW4 Power On/Off SW5 See the figure titled "Board Layout and Connector Locations:" on page 14 for the location of the switches. The following sections describe the switches. GPIO Switch Bank 1, SW3 GPIO Switch Bank 1, labeled SW3, is a set of five slide switches that allows the embedded module to use either serial signals or GPIO signals to communicate with a device. With the switch to the left position, the module’s signal is connected to the Serial Port1 RS232 transceiver. In the right position, the module signal is connected to the appropriate pin of the GPIO Port P7. GPIO Switch Bank 1 Settings Left Position Right Position DCD GPIO-1 CTS GPIO-2 DSR GPIO-3 RTS GPIO-4 DTR GPIO-5 Switch Number User Push Button 1, SW1 When switch number 1 is set to GPIO-1, pushing User Push Button 1, SW1, will drive GPIO-1 (Wi-ME pin 7, ME pin 12) low. 24 User Push Button 2, SW2 Pushing User Push Button 2, SW2, will drive Wi-ME module pin 12 (ME module pin 18) low. Reset, SW4 The Reset switch is a push button switch labeled SW4 on the development board. Pressing the switch holds the embedded module in reset. When the push button is released, the module reboots. Power On/Off Switch, SW5 The left position means that power is on. The right position means that power is off. Development Board LEDs The development board contains 25 LEDs that are labeled CR1 through CR25. The following table lists and describes the LEDs. Development Board LED Descriptions Board Label Description State Indication CR1 TXD, Secondary Serial Port Yellow On Logic 1 on TTL, mark, -V on line side CR2 TXD, Secondary Serial Port Yellow On Logic 1 on TTL, mark, -V on line side CR3 RXD, Secondary Serial Port Yellow On Logic 1 on TTL, mark, -V on line side CR4 RXD, Secondary Serial Port Green On Logic 0 on TTL, space, +V on line side CR5 DCD, Primary Serial Port Yellow On Logic 1 on TTL, mark, -V on line side CR6 DCD, Primary Serial Port Green On Logic 0 on TTL, space, +V on line side CR7 DSR, Primary Serial Port Yellow On Logic 1 on TTL, mark, -V on line side CR8 DSR, Primary Serial Port Green On Logic 0 on TTL, space, +V on line side CR9 CTS, Primary Serial Port Yellow On Logic 1 on TTL, mark, -V on line side CR10 CTS, Primary Serial Port Green On Logic 0 on TTL, space, +V on line side 25 Development Board LED Descriptions Board Label Description State CR11 RXD, Primary Serial Port On Logic 1 on TTL, mark, -V on line side CR12 RXD, Primary Serial Port On Logic 1 on TTL, mark, -V on line side CR13 DTR, Primary Serial Port Yellow On Logic 1 on TTL, mark, -V on line side CR14 DTR, Primary Serial Port Green On Logic 0 on TTL, space, +V on line side CR15 RTS, Primary Serial Port Yellow On Logic 1 on TTL, mark, -V on line side CR16 RTS, Primary Serial Port Green On Logic 0 on TTL, space, +V on line side CR17 TXD, Primary Serial Port Yellow On Logic 1 on TTL, mark, -V on line side CR18 TXD Primary Serial Port Green On Logic 0 on TTL, space, +V on line side On Logic 1 CR19 GPIO 1 Green Off Logic 0 On Logic 1 Off Logic 0 On Logic 1 Off Logic 0 On Logic 1 Off Logic 0 On Logic 1 Off Logic 0 On +12v present from POE Off No POE present On Power On Off Power Off CR20 CR21 CR22 CR23 CR24 CR25 26 Indication GPIO 2 Green GPIO 3 Green GPIO 4 Green GPIO 5 Green POE Active LED Green 3.3v LED Green Power Jack P15 The Power Jack P15 is a barrel connector that accepts 9 to 30 VDC. The following table shows the polarity of the power jack. Power Jack Polarity Contact Polarity Center +9 to +30 VDC Outer Ground The following figure schematically represents the polarity of the power jack. Power Jack Polarity, Schematic +9 to +30 VDC 00000014 Ground 27 Test Points The development board provides 13 test points that can be identified by a board label. The test point numbers are in the development board schematic drawings. The following table lists the test point number, board label, and a brief description of each test point. Test Point Descriptions 28 Test Point Board Label Description TP2 TXD TXD-2, Transmit, Secondary Serial Port TP3 RXD RXD-2, Receive, Secondary Serial Port TP4 CTS CTS, Primary Serial Port TP5 DTR DTR, Primary Serial Port TP6 TXD TXD, Primary Serial Port TP7 RXD RXD, Primary Serial Port TP8 RTS RTS, Primary Serial Port TP9 DCD DCD, Primary Serial Port TP10 DSR DSR, Primary Serial Port TP12 Reset Reset TP13 POE 12v POE 12v TP14 3.3v 3.3v Supply TP15 GND Ground Programming Considerations Overview This chapter provides information programmers may require to make use of some embedded module hardware resources. It provides programming information on the following topics for the Digi Connect ME 9210, the Digi Connect ME and the Digi Connect Wi-ME: "Module Pinout" on page 30 "Reset" on page 32 "Memory" on page 33 "SDRAM" on page 33 29 Module Pinout General Information The NS7520/NS9210 processors support 16 General Purpose I/O (GPIO) lines, some of which are reserved for specific functions and some of which can be customized. For Digi Plug and Play Firmware users, see the Digi Connect Family Users Guide for details on what Pin configurations are available to you. Module Pinout The following table provides signal header pinout information for the Digi Connect ME, Digi Connect Wi-ME and Digi Connect ME 9210 modules. Please refer to the color key below. Key Applies to Digi Connect ME/Wi-ME modules. Applies to Digi Connect ME 9210/Wi-ME 9210 modules. Applies to Digi Connect ME/Wi-ME and ME 9210/Wi-ME 9210 modules. 30 Pin Pin UART GPIO [Wi-ME/ [ME/ME Wi-ME [All] 9210] [ME/ Wi-ME] GPIO [ME 9210] 9210] Ext IRQ Ext IRQ I2C SPI [ME 9210/ [ME 9210/ Wi-ME Wi-ME [ME/ [ME 9210/ 9210] 9210] Wi-ME] Wi-ME 9210] FIM CAN BUS Timer Other [ME 9210/Wi- [ME 9210/Wi- [ME 9210/ ME 9210] ME 9210] Wi-ME 9210] [All] VETH+ VETH- 3-6 Positions Removed RXD A3 GPIO[3] DATA IN TXD A7 GPIO[7] DATA OUT Timer Out 7 Timer In RTS A5 GPIO[5] CLK Timer Out 6 10 DTR A6 GPIO[6] 11 CTS A1 GPIO[1] PIC_0_GEN _IO[1] 12 DSR A2 GPIO[2] PIC_0_GEN _IO[2] 13 DCD A0 GPIO[0] 14 /RST 15 3.3V 10 16 GND 11 17 C4 GPIO[12] 12 18 C1 GPIO[9] 13 19 14 20 PIC_0_GEN _IO[3] PIC_CAN _TXD EN SDA Timer In PIC_CAN _RXD PIC_0_GEN _IO[0] CLK RESET_ DONE SCL Reserved C5 GPIO [13] CLK Timer Out 9 /INIT Note: The CAN Bus interface is available on the 8/16 Digi Connect ME 9210, WiME 9210 variants. Note: When using the 8/16 ME 9210/ Wi-ME 9210 CAN Bus, the DTR (9210 signal GPIO 6) line must be tri-stated. When the DTR signal (9210 GPO/I 6) is used, 9210 GPO/I 15 must be tri-stated. These two 9210 signals are wired together on the 9210 modules. Note: The Digi Connect Wi-ME 9210 module does not provide pins 1-6. Note: When using I2C, make sure to put a 10k pull up on the SDA and SCL lines. 31 Reset Hard Reset The Wi-ME 9210 module supports a hardware reset via pin 8 of the 14-pin header. The unit is forced into a hard reset when pulling the pin to ground, or less than 0.8v, for one microsecond. When plugged into a development board, this pin is wired to the push button at SW4. As a result, this switch acts as a hard reset button. Reset Characteristics Characteristic 32 Specification Delay 250 milliseconds (typical) Low ActiveThreshold 0.8 V High Inactive Threshold 2.4V Minimum Hold Time 1 microsecond pulse Rise Time 100 microseconds max Memory Flash Depending on the variant, the Digi Connect Wi-ME 9210 has 8 or 16MB of flash memory. The Digi Connect Wi-ME 9210/ARM9 family, the flash memory is controlled by chip select 2 (default=st_cs1) and is located at 0x50000000. SDRAM The Digi Connect Wi-ME 9210’s SDRAM is controlled by chip select 1. Depending on the variant, the module will have either 8 or 16MB of SDRAM memory. The following table illustrates typical power consumptions using these power management mechanisms. These measurements were taken with all Digi NS9210 processor’s I/O clocks disabled except UART A, UART C, I/O Hub and Memory Clock0 using a standard module plugged into a Digi JumpStart Kit development board, with nominal voltage applied: Mode Power Consumption 1 Normal Tx Operational Mode 1.7W (520mA peak) Normal Receive Operational Mode2 1.14W (346mA) Full Clock Scaling Mode3 .613W (186mA) Sleep Mode4 .469/w (146mA) Note 1: The current measurement was taken from the R6 current sense resistor using a 0.025 ohm shunt on the JumpStart Kit development board. The supply voltage was 3.3V. Note 2: This is the default power consumption mode when entering applicationStart(), as measured with the napsave sample application. The value of the NS9210 Clock Configuration register (A090017C) is 0001200B hexadecimal. Note 3: This measurement was produced by selecting the “Clock Scale” menu option in the napsave sample application. Note 4: This measurement was produced by selecting the “Deep Sleep/Wakeup with an External IRA” menu option in the napsave sample application. 33 34 Module Specifications Network Interface Digi Connect Wi-ME 9210 Standard: IEEE 802.11b/g/n Frequency: 2.4 GHz Data Rate: Up to 65 Mbps with automatic fallback Modulation: CCK (11/5 Mbps), DQPSK (2 Mbps), DBPSK (1 Mbps), OFDM ((6, 9, 12, 18, 24, 36, 48, 54, and 65 Mbps) Transmit Power: 11 Mbps 17dbm 54/65Mbps 12dbm Receive sensitivity: 1Mbps: -100 26Mbps: -71dbm 2Mbps: -97 36Mbps: -76 dbm 5.5Mbps: -96 39Mbps: -67dbm 6Mbps: -84 dbm 48Mbps: -72 dbm 6.5Mbps: -79dbm 52Mbps: -63dbm 9Mbps: -84 dbm 54Mbps: -69 dbm 11Mbps: -92 58.5Mbps: -62dbm 12Mbps: -83 dbm 65Mbps: -61dbm 13Mbps: -76dbm 18Mbps: -81 dbm 19.5Mbps: - 74dbm 24Mbps: -79 dbm Antenna Connector: 1 x RP-SMA Caution: The Digi Connect Wi-ME 9210 embedded modules were designed for use in no clean flux wave soldering processes. The product is not designed to support draining after a water-wash process, which can lead to water residue inside the enclosure resulting from direct entry or condensation after the wash process. 35 Serial Interface One TTL serial interface (CMOS 3.3v) with full modem control signals (DTR, DSR, DCD, RTS, CTS). The Digi Connect Wi-ME 9210 also supports SPI and FIM-based application specific interfaces. Data Rates (bps) 50, 75, 110, 134, 150, 200, 300, 600, 1200, 1800, 2400, 4800, 9600, 14400,19200, 28800, 38400, 57600, 115200, 230400, 460800 DC Characteristics The following tables provide DC characteristics for operating conditions, inputs, and outputs. Operating Conditions Symbol Description VCC Supply Voltage n/a Power Supply Ripple ICC Supply Current Min Typ Max Unit 3.14 3.3 3.45 40 mVpp — Rx mode 270 Tx mode 520 (peak) mA — IIL 16K pull up resistor -10 — 200 A IIH 16K pull up resistor -10 — 10 A IOZ HighZ Leakage Current -10 — 10 A IOD Output Drive Strength — — mA CIO Pin Capacitance (VO=0) — — pF Warning: The rise time of the 3.3v power supply must be between 700 S and 140ms and the inrush current must be limited to less than 2 A. A rise time outside of these limits may cause the device to malfunction and give a 3-1-3 diagnostic error. 36 Inputs Symbol Description Min Typ Max Unit VIH Input High Voltage — VCC+0.3a VIL Input Low Voltage VSS-0.3 — .8 a.) All I/O are 5v tolerant. Outputs Symbol Description Min Typ Max Unit VOH Output High Voltage Vdd -.6V — Vdda VOL Output Low Voltage — 0.4 IOH Output High Current — — mA IOL Output Low Current — — mA a.) All I/O are 5v tolerant. Digi Connect ME Digi Connect Wi-ME Storage Temperature -40°F to 257°F (-40°C to 125°C) Relative Humidity Not to exceed 95% non-condensing (4° C to 45°C), constant absolute humidity above 45°C Altitude 12000 feet (3657.60 meters) Grounding Recommendation It is recommended that you connect the tabs on the chassis of the Digi Connect ME / WiME, and the ground pins directly to the logic ground plane. It is also recommended that you connect the Digi Connect ME / Wi-ME to the metal chassis of your enclosure. The idea is to provide the shortest path or a path away from circuitry for ESD to travel to ground. 37 Power Management (Digi Connect ME 9210 only) Using the Digi NET+OS development environment, applications on the Digi Connect WiME 9210 are capable of operating the module in several reduced power consumption modes. These reduced power operating modes utilize the power management mechanisms for the NS9210 processor for CPU clock scaling and sleep. In the Clock Scaling mode, the system itself continues to execute instructions, but at a different clock rate, which can be changed on-the-fly, using Digi’s patented circuitry inside the NS9210 processor. The clock speed is changed programmatically to lower or raise the system clock speed, thus reducing or increasing the module’s power footprint, respectively. Additionally, a Sleep mode is available in which the system stops executing instructions. Based on the application needs, wake-up triggers can be set up programmatically to activate the processor back to wherever it left off. In this mode, a drastic power reduction is realized by reducing the power consumption of the NS9210 processor and the on-module PHY. For sample power consumption figures for normal (typical) and power management related operation of the Digi Connect Wi-ME 9210, see below: 3.3VDC @ 346 mA typical (1.14W) UART and Rx activated Sleep Mode (approximate) 38 3.3VDC @ 142mA Thermal Specifications The table below shows the standard operating temperature ranges for the entire Digi Connect ME family of embedded modules.. Standard Operating Temperature Ranges Product Operating Temperature Range Digi Connect Wi-ME 9210 -40C to 64C no external thermal pad -40C to 85C external thermal pad The lower standard operating temperature ranges are specified without restrictions, except condensation must not occur. The upper operating temperature limit depends on the host PCB layout and surrounding environmental conditions. To simplify the customer’s design process, a maximum case temperature has been specified. Maximum Case Temperature Product Digi Connect Wi-ME Maximum Case Temperature 84C no external thermal pad 95C external thermal pad The maximum case temperature must remain below the maximum, measured at the location shown in the figure below. Measure Temperature Here 39 Additional Design Recommendations The following list provides additional design guidance with respect to thermal management in applications with operating temperatures at the high end or beyond the specified standard ambient temperature range. Providing air movement will improve heat dissipation. The host PCB plays a large part in dissipating the heat generated by the module. A large copper plane located under the Digi Connect Wi-ME 9210 and soldered to the module’s mounting tabs will improve the heat dissipation capabilities of the PCB. If the design allows, added buried PCB planes will also improve heat dissipation. The copper planes create a larger surface to spread the heat into the surrounding environment. Adding a thermal pad or thermal compound, such as Sil-Pad®, Gap Pad® or Gap Filler products made by the Bergquest Company (www.bergquistcompany.com), between the host PCB and the underside of the module will significantly increase the thermal transfer between the module’s enclosure and the host PCB. Limit the fill area to the folded metal portion of the module’s underside. Mechanical Dimensions Digi Connect Wi-ME Length 1.445 in. (36.703 mm) Width 0.75 in. (19.05 mm) Height 0.854 in. (21.69 mm) Weight .616oz. 17.463g Device/serial interface connector 40 14-pin micro header (7-pin double row) with .05-inch (1.27-mm) pitch. Bar Code The 50m PN is code 3 of 9 (39) and the MAC is code 128. All scanners are set up so if they read code 3 of 9 they will automatically read 128. The reason for the two different code types is to maximize the size of the bars within a given space to improved readability. Dimensions The following figures show the dimensions of Digi Connect Wi-ME module. Note: These are the tolerances for the drawings shown on this and the following pages: Measure Tolerance .XX ± .02 .XXX ± .010 Angles ± 3° Digi Connect Wi-ME Module Front Wi-ME 41 Side Wi-ME 42 Bottom Wi-ME 43 Recommended PCB Layout The following figure shows the recommended PCB (printed circuit board) layout of the Digi Connect Wi-ME. Digi Connect ME and Wi-ME 44 Antenna Information Antenna Strength The following diagram demonstrates the strength of the signal received by the whip antenna on both a horizontal and vertical plane. The diagram shows the magnetic field when the antenna is in a vertical position. The outside line represents the horizontal plane and the inside dotted line represents the vertical plane. Radiation Patterns Antenna Specifications Antenna Description Frequency Dipole 2.4~2.5 GHz Power Output 2W DB Gain 2 dBi VSWR < or = 2.0 Nominal Impedance 50 ohm Dimension 108.5 x 10.0 mm Weight Connector Part Number 10.5g RP-SMA DG-ANT-20DP-BG Any antenna matching the in-band and out-of-band signal patterns and strengths of the antenna, whose characteristics are given in the Antenna Description table and the Radiation Pattern graphic may be used with the Digi Connect Wi-ME 9210. 45 1.200 (30.5) 1.010 (25.4) .399 (10.1) 90.0˚ 3.300 (83.8) 46 bOBITRON SCALE 3.000 UNITS: mm 3.500 (88.9) .360 (9.1) R .125 (3.2) Dipole Antenna Dimensions RF Exposure Statement The Digi Connect Wi-ME 9210module complies with the RF exposure limits for humans as called out in RSS-102. It is exempt from RF evaluation based on its operating frequency of 2.4 GHz, and effective radiated power less than the 3 watt requirement for a mobile device (>20 cm separation) operating at 2.4 GHz. Safety Statements To avoid contact with electrical current: Never install electrical wiring during an electrical storm. Never install an ethernet connection in wet locations unless that connector is specifically designed for wet locations. Use caution when installing or modifying ethernet lines. Use a screwdriver and other tools with insulated handles. You and those around you should wear safety glasses or goggles. Do not place ethernet wiring or connections in any conduit, outlet or junction box containing electrical wiring. Installation of inside wire may bring you close to electrical wire, conduit, terminals and other electrical facilities. Extreme caution must be used to avoid electrical shock from such facilities. You must avoid contact with all such facilities. Ethernet wiring must be at least 6 feet from bare power wiring or lightning rods and associated wires, and at least 6 inches from other wire (antenna wires, doorbell wires, wires from transformers to neon signs), steam or hot water pipes, and heating ducts. Do not place an ethernet connection where it would allow a person to use an ethernet device while in a bathtub, shower, swimming pool, or similar hazardous location. Protectors and grounding wire placed by the service provider must not be connected to, removed, or modified by the customer. Do not touch un-insulated ethernet wiring if lightning is likely! Do not touch or move the antenna(s) while the unit is transmitting or receiving. Do not hold any component containing a radio such that the antenna is very close to or touching any exposed parts of the body, especially the face or eyes, while transmitting. Do not operate a portable transmitter near unshielded blasting caps or in an explosive environment unless it is a type especially qualified for such use Any external communications wiring you may install needs to be constructed to all relevant electrical codes. In the United States this is the National Electrical Code Article 800. Contact a licensed electrician for details. 47 48 Certifications These products comply with the following standards. FCC Part 15 Class B Radio Frequency Interference (RFI)(FCC 15.105) The Digi Connect ME and Digi Connect Wi-ME embedded modules have been tested and found to comply with the limits for Class B digital devices pursuant to Part 15 Subpart B, of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential environment. This equipment generates, uses, and can radiate radio frequency energy, and if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try and correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. 49 Labeling Requirements (FCC 15.19) This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. If the FCC ID is not visible when installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module FCC ID. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: MCQ-50M1745 / IC: 1846A-50M1745 Modifications (FCC 15.21) Changes or modifications to this equipment not expressly approved by Digi may void the user's authority to operate this equipment. Industry Canada This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications. Le present appareil numerique n'emet pas de bruits radioelectriques depassant les limites applicables aux appareils numeriques de la class B prescrites dans le Reglement sur le brouillage radioelectrique edicte par le ministere des Communications du Canada. 50 Declaration of Conformity Digi Connect Wi-ME 9210Conformity (In accordance with FCC Dockets 96-208 and 95-19) Manufacturer's Name: Digi International Corporate Headquarters: 11001 Bren Road East Minnetonka MN 55343 Manufacturing Headquarters: 10000 West 76th Street Eden Prairie MN 55344 Digi International declares, that the product: Product Name: Digi Connect Wi-ME 9210 embedded module Model Number: 50001745 to which this declaration relates, meets the requirements specified by the Federal Communications Commission as detailed in the following specifications: Part 15, Subpart B, for Class B Equipment FCC Docket 96-208 as it applies to Class B personal Computers and Peripherals The product listed above has been tested at an External Test Laboratory certified per FCC rules and has been found to meet the FCC, Part 15, Class B, Emission Limits. Documentation is on file and available from the Digi International Homologation Department. 51 International EMC Standards Digi Connect ME Digi Connect Wi-ME Storage Temperature -40°F to 257°F (-40°C to 125°C) Relative Humidity Not to exceed 95% non-condensing (4° C to 45°C), constant absolute humidity above 45°C Altitude 12000 feet (3657.60 meters) The Digi Connect ME and Digi Connect Wi-ME embedded modules meet the following standards: Standards Digi Connect ME Digi Connect Wi-ME AS/NZS 3548 CISPR 22 Japan IOH 003NY04115 0000 003GZ04064 0000 AS/NZS 3548 FCC Part 15 Subpart C (FCC ID: MCQ-50M880) IC RSS 210 (IC:1846A-50M880) Emissions Immunity FCC Part 15 Subpart B ICES-003 EN 55022 EN 61000-4-2 EN 61000-4-3 EN 61000-4-6 EN 301 489-3 EN 300 328 VCCI EN 55024 UL 60950-1 Safety CSA 22.2 No. 60950--1 EN 60950 52 Antenna configurations This device has been designed to operate with the antennas listed below, and having a maximum gain of [10] dBi. Antennas not included in this list or having a gain greater than [10] dBi are strictly prohibited for use with this device. The required antenna impedance is [50] ohms The following antenna configurations that were tested with the Connect Wi-ME 9210 module. Digi 29000095, Bobbintron SA-006-1, +2 dBi dipole antenna (NP-SMA) To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. 53 54 Sample Application: PoE Power Supply The following schematics are examples of PoE Power Supplies: 55 A POS POS NEG D2 MB2S NEG D1 MB2S R7 53R6 R3 33K2 R4 590K C3 220n/100V C4 47n/100V R5 15K R1 24K9 R2 1K R6 100K 12 17 16 11 13 10 15 U1 LM5070SD C33 1u/10V 14 L6 4,7uH C36 2u2/100V D14 12V/200mW C39 220P/50V P1 4p_R/A_TSM AC AC AC AC C37 2u2/100V R8 1K C5 47n/100V NC C38 2u2/100V C6 1n/50V C34 1u/10V R27 1K R10 100R C32 1n/100V U3 FDC2512 NOT POP D11 56V D4 LL4148 3 D12 Dual 100V R11 18R R9 47R R12 0R33 NC NC C9 3.3u U2 FOD2741ASDV 10 T1 C1586-ALD D15 SS26 60V/2A C27 10u/10V C16 100n/100V R17 33R R29 1K8 R24 0R R14 10K C28 10u/10V R16 1K C29 10u/10V C20 100n/100V C11 47n/100V C10 1n/50V L5 4,7uH R30 4K7 R28 3K3 CR1 RED R21 1K 56 C30 100n/100V C40 330u/35V P2 6p_R/A_TSM 2/8 Digi Connect ME C15 100n/100V C12 1u/10V C7 1u/10V D3 SMAJ60A-13-F C2 100n/100V A P 13 18000335 TP 15 T E S T P OINT 18000336 T E S T P OINT TP 13 J AC K 3P L O C K ING 18000302 P 14 G ND 220 R 12 3.3V LE D D10 D9 R 19 TP 14 S W_S LIDE _S PDT SW5 T E S T P OINT 100mohms G ND G ND 220 R 13 +3.3V 3.3V LE D 100uF C 28 C R 25 L2 45.3k R7 0.1uF C 29 1uF C 30 G ND 100mohms R9 270pF PCB 30006002-04 R evA 3000XXX2-XX P C B2 S C HE MAT IC 30006001-04 R evA 3000XXX1-XX P C B1 D8 47 22uH 21000122 R 8 C 31 L1 AS S E MB LY 30006004-04 R evA 3000XXX4-XX AS E E MBLY S HT 1 & 2 V out = 3.29V V ripp = 26.5mV LM3485 VR 1 FDC 5614P +3.3V _S W U7 P 15 C R 24 R 11 15k R 10 24.9k +3.3V C 26 1uF 100uF C 23 4/8 Digi Connect ME modules and Digi Connect ME 9210 modules 57 58 Sample Application: TTL Signals to EIA-232 The following schematic is an example of how to convert the modules’s TTL signals to EIA-232. 59 60 Change Log The following changes have been made since the last revision of this document. 61 62
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