Features And Benefits This Style Is “Heading” 02 MLX90393 Getting Started Guide [Melexis Y2015]

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MLX90393 Getting Started Guide
Abstract
This guide was written with the goal of describing the basic setup and
troubleshooting steps required for integrating the MLX90393 Triaxis™ device
in an application. A simple rotary sensing application is used as an example.

Applicable Applications
All rotary, linear, and joystick applications using the MLX90393.

Recommended Tools and Resources
MLX90393 Datasheet
Oscilloscope or I2C->PC adaptor with I2C decoding
MLX90393 EVB (evaluation board) and MBED LPC1768 board

Convention, Acronyms, and
Abbreviations
Number Format and Text
Values in hexadecimal are shown with a preceding “0x”. For
example: 0x12 is decimal 18.
Binary values are shown with a preceding “0b”. For example:
0b10010 is decimal 18.
Textual descriptions are shown in this format
Code examples are shown in this format
Warnings and cautions are shown in this format

Acronyms
SDA = Serial Data Line
SCK = Serial Clock Line
VDD = Analog Supply
VDD_IO = Digital Supply

Rev 004

MSb = Most Significant Bit
LSb = Least Significant Bit
MSB = Most Significant Byte
LSB = Least Significant Byte

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Table of Contents
Abstract..............................................................................................................................................................................1
Applicable Applications......................................................................................................................................................1
Recommended Tools and Resources .................................................................................................................................1
Convention, Acronyms, and Abbreviations .......................................................................................................................1
Number Format and Text ..............................................................................................................................................1
Acronyms .......................................................................................................................................................................1
Table of Contents ...............................................................................................................................................................2
Pinout.................................................................................................................................................................................4
Axis Definition ....................................................................................................................................................................5
Practical getting started .....................................................................................................................................................6
Practical getting started guide ......................................................................................................................................7
MLX90393 interface library for mbed ...........................................................................................................................7
CherryStone soft-and firmware releases & compatibility .............................................................................................8
Communication .................................................................................................................................................................9
2

I C Protocol ....................................................................................................................................................................9
SPI Protocol .................................................................................................................................................................10
Memory Model ................................................................................................................................................................11
HALLCONF ...................................................................................................................................................................11
GAIN_SEL .....................................................................................................................................................................11
Z_SERIES ......................................................................................................................................................................11
BURST_DATA_RATE .....................................................................................................................................................11
BURST_SEL ...................................................................................................................................................................12
TCMP_EN .....................................................................................................................................................................12
EXT_TRIG .....................................................................................................................................................................12
WOC_DIFF ...................................................................................................................................................................12
COMM_MODE .............................................................................................................................................................12
TRIG_INT_SEL ..............................................................................................................................................................12
OSR ..............................................................................................................................................................................12
DIG_FILT ......................................................................................................................................................................12
RES_XYZ .......................................................................................................................................................................12
OSR2 ............................................................................................................................................................................13
SENS_TC_LT & SENS_TC_HT ........................................................................................................................................13
OFFSET_X, OFFSET_Y & OFFSET_Z ...............................................................................................................................13
WOXY_THRESHOLD, WOZ_THRESHOLD & WOT_THRESHOLD....................................................................................13
Address 10-31 ..............................................................................................................................................................13
Key Commands ................................................................................................................................................................14
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CONTROL COMMANDS ................................................................................................................................................14
Exit (EX)........................................................................................................................................................................14
Reset (RT) ....................................................................................................................................................................15
MEMORY COMMANDS ................................................................................................................................................15
Memory Store (HS) ......................................................................................................................................................15
Memory Recall (HR).....................................................................................................................................................15
Read Register (RR) .......................................................................................................................................................15
Write Register (WR).....................................................................................................................................................15
MEASUREMENT COMMANDS .....................................................................................................................................15
Start Burst Mode (SB) ..................................................................................................................................................15
Single Measurement (SM) ...........................................................................................................................................16
Read Measurement (RM) ............................................................................................................................................16
Start Wake-up on Change (SWOC) ..............................................................................................................................16
Application specific ..........................................................................................................................................................17
Resolution....................................................................................................................................................................17
Calculation of conversion time ....................................................................................................................................17
Sensitivity .........................................................................................................................................................................18
Available hardware (EVB) ............................................................................................................................................19
Example #1: Rotary Application .......................................................................................................................................20
Magnetic Configuration ...............................................................................................................................................20
Suggested EEPROM Configuration ..............................................................................................................................20
Rotary Code Example ..................................................................................................................................................21

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Pinout
NC

NC

A1

A0

The pinout for the MLX90393 is below.

VSS

VDDIO

NC

INT/
TRG

MLX90393

NC

SDA/
MOSI

SCLK

NC

CS

MISO

INT

VDD

PIN 1

Figure 1: Pinout

Pin Number
1

Pin Function
Data ready signal output pin, active high (DRDY flag)
Chip select, used when communicating in SPI mode
2
CS
Pull high when in I2C mode
3
SCLK
Serial clock for both SPI and I2C mode
4, 9, 10, 14, 16
NC
5
SDA/MOSI Data input pin in SPI mode, data input/output pin in I2C mode
6
MISO
Data output pin in SPI mode
7
INT/TRIG Trigger pin, can be used to start measurement
8
VDDIO
Power supply for digital
11
A1
Bit 1 of the 7-bit I2C address (0 0 0 1 1 A1 A0)
12
A0
Bit 0 of the 7-bit I2C address (0 0 0 1 1 A1 A0)
13
VSS
Ground
15
Vdd
Power supply

Rev 004

Pin Name
INT

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MLX90393 Getting Started Guide
Axis Definition
The axes of the MLX90393 are defined in the datasheet and are shown below.

Figure 2: MLX90393 QFN Axis Definitions

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MLX90393 Getting Started Guide
Practical getting started
Legend:

Software
Firmware
Communication
Application Diagram I2C

Getting Started in practice

Application Diagram SPI

Host PC/ Laptop
· Download LabVIEW Run-Time Engine (12.0) à install
· Download NI-VISA Driver (5.0.3) à install
· Download MBED USB-driver à install (connect mbed)
Mbed LPC1768
· Download MBED -Firmware à upload to mbed and reset
MLX90393
· Make physical connections between PC,MBED and MLX90393

MBED USBdriver

CherryStone.exe

USB

Physical USB-cable

Firmware (SPI or I2C)
9039X
.h

9039X
.cpp

Physical connection
cables (I2C)

OR

USB

SPI

Main.cpp

SPI

NI-VISA
Driver

I2C

LabVIEW Run-Time
Engine

I2C

Host PC/Laptop
· Download CherryStone.exe à install and run

Physical connection
cables (SPI)

Host PC / Laptop

MLX9039X

MBED LPC1768

Implementation / Installation sequence
CherryStone.exe
LabVIEW Run-Time Engine
NI-VISA Driver

Rev 004

Firmware (SPI or I2C)

MBED Driver

MLX9039X

SPI OR I2C - protocol

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MLX90393 Getting Started Guide
Practical getting started guide
1.

NI LabView Runtime Engine

A first step before installing the CherryStone executable is installing LabVIEW Run-Time Engine 12.0. This software
can be downloaded directly from National Instruments website.
32-bit version: Click here
http://www.ni.com/download/labview-run-time-engine-2012/3433/en/

2.

NI VISA-driver

Visa Driver: Click here
http://www.ni.com/download/ni-visa-run-time-engine-5.0.3/2257/en
3.

MBED driver

Make sure your mbed is connected while executing this step
Mbed Driver: Click here
http://developer.mbed.org/media/downloads/drivers/mbedWinSerial_16466.exe
4.

CherryStone Software Executable

CherryStone (= the interface program, refer to diagram shown earlier in this document): Click here
5.

MBED firmware

MBED SPI firmware: Click here
2
MBED I C firmware: Click here
Upload the firmware to mbed:
·
·
·

Connect your mbed to your PC/laptop - a new drive called “MBED” should appear.
Download the firmware from the Melexis website (either SPI, or I2C) and drag and drop the file directly into
the drive”.
Once the bin-file is uploaded, the mbed must be reset by pressing the push button at the center of the
mbed.

MLX90393 interface library for mbed
Sample code and a complete library holding all MLX90393’s functions are written for mbed and can be downloaded
from www.mbed.org/teams/melexis or directly from our website
The MBED used at Melexis is the LPC1768. Please note that the firmware BIN files made available have been
compiled for this specific MBED hardware. When using other MBED devices, or other microcontrollers in general, the
source code is recommended as a starting point for software development.

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CherryStone soft-and firmware releases & compatibility
Date
January 2015

Rev 004

CherryStone.exe

CherryStone.bin

CherryStone 3

CherryStone3_I2C(SDA = p9, SCL = p10, A1=p21, A0=p22).bin
CherryStone3_SPI(MOSI =p5, MISO = p6, CLK= p7, CS=p8).bin

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Communication
The MLX90393 can be used with either an SPI or an I2C bus. The use of both protocols will be explained in the next
sections. This user guide gives a brief introduction to our user interface tool for quick ‘plug and play’ solutions that
enables you to communicate with the MLX90393 without having to make the effort of implementing the
communication protocol yourself.

I2C Protocol
2

One initial hurdle with starting work with the MLX90393 is configuring the I C bus correctly. The clock frequency can
2
be set between 10kHz (low-speed mode), 100kHz(standard mode), 400kHz (Fast mode). Every I C device on the bus
2
must also be assigned an address. The two LSB’s of the MLX90393 I C address can be selected via the A0 and A1 pins
allowing for four different addresses. In this document it is assumed that the A0 and A1 pins are shorted to ground.
2
This results in an I C address of 0x19 (for MBED, in other environments this might be defined in another way).
2

The7 bit I C address in MBED is defined as follows as a byte:
7 bit I2C address
0

0

0

1

1

A1

A0

1

Defined by Melexis

Defined by connecting pins
A0 and A1 to GND/ VDD

R/W bit set
2

Figure 3: MBED I C address definition

The orange section is set in the NVRAM of the IC, the yellow section depends on how pins A0 and A1 are connected.
The last bit should be set for the MBED, no matter if one reads or write to the IC. The MBED will send on the bus the
correct R/W bit automatically.
The MLX90393 operates on a command / response configuration and can be broken down into two sequences:
Command Write and Response Read.
Command Write:
To initiate a communication sequence the master addresses the slave with the write bit set. If the MLX90393
recognizes the address it responds with an ACK. The master then issues the command to the MLX90393. If accepted,
the MLX90393 responds with another ACK.
SCL

1

SDA

2

3

4

5

I2C_ADDR[6:0]

6

7

8

9

W

ACK

1

2

3

4

5

COMMAND[7:0]

6

7

8

9
ACK

S
2

Figure 4: Sending an I C command

Response Read:
To read back the response the master addresses the MLX90393 with the R bit set. The master then sends enough
clock pulses to clock out all the required data bytes. The number of data bytes depends on the command transmitted

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and can range from zero (eg: NOP message) to eight (eg: measurement with all axes, temp, and a status byte). The
number of data bytes is indicated in the status byte which is always the first byte read out from the MLX90393.
SCL

1

2

SDA

3

4

5

6

7

I2C_ADDR[6:0]

8

9

R

ACK

1

2

3

4

5

6

7

8

STATUS_BYTE[7:0]

9
ACK

Sr

P
2

Figure 5: I C readback of status byte

Note: Failure to readdress the slave after the Command Write will result in the transaction failing.

SPI Protocol
One initial hurdle with starting work with the MLX90393 is configuring the SPI bus correctly. The chip can handle
clock frequencies up to 10MHz. The SPI communication is implemented in a half-duplex way, showing high
2
similarities with the I C communication. Addressing on the bus is done through the \CS instead of physical addresses.
Both three- and four-wire SPI is possible (three wire by shorting the MISO and MOSI). SPI mode 3 is implemented:
CPHA=1 (data changed on leading edge and captured on trailing edge, and CPOL=1 (high level is inactive state). The
Chip Select line is active-low.
The MLX90393 operates on a command / response configuration and both are sequentially done in one go in SPI.
The communication is also bundled in bytes, equally MSB first and MSByte first. A command can of course consist of
more than 1 byte as can the response be from the MLX90393 in the form of multiple bytes after the status byte.
Figure 6 shows an example of an SPI command being followed by the readback of the status byte.
/CS
SCL

1

MOSI

2

3

4

5

6

7

8

1

COMMAND[7:0]

MISO

2

3

4

5

6

7

8

X (4-wire SPI) or Z (3-wire SPI)

Z (3 & 4-wire SPI)

STATUS_BYTE[7:0]

ADD

NADD

Figure 6: SPI example

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MLX90393 Getting Started Guide
Memory Model
As the code example will be modifying the register contents it is useful to review the memory model of the
MLX90393. It operates with a dual memory model consisting of volatile and nonvolatile areas. During operating
conditions the values in the volatile memory are used and are loaded from nonvolatile memory at power up or when
a recall command is issued. It is necessary to know that if the write register command is issued this affects the
volatile memory only. A store command is needed to permanently store the modifications. Refer to the datasheet for
more details. The first 32 addresses are programmable by the user.
VOLATILE
MEMORY

NON-VOLATILE
MEMORY

CUSTOMER AREA

CUSTOMER AREA
STORE (HS)

RECALL (HR)
MELEXIS AREA

RR

MELEXIS AREA

WR

Figure 7: Memory model
15
0
1 TRIG_INT_SEL
2
3
4
5
6
7
8
9

14

13

COMM_MODE
RESERVED

12
11
RESERVED_LOW
WOC_DIFF
EXT_TRIG
OSR2
SENS_TC_HT

10
TCMP_EN

9

8

7
Z_SERIES
BURST_SEL
RES_XYZ

6

5
GAIN_SEL

4

3

2

1

0

HALLCONF
BURST_DATA_RATE
DIG_FILT
SENS_TC_LT

OSR

OFFSET_X
OFFSET_Y
OFFSET_Z
WOXY_THRESHOLD
WOZ_THRESHOLD
WOT_THRESHOLD

Figure 8: Memory map of customer area

HALLCONF
Spinning and chopping rate adjustment.
HALLCONF[3:2] defines the duration of one Hall plate spinning phase in clock cycles: #clocks/spinning_phase = 8 *
HALLCONF[3:2]
2
. Default this value is 3.
HALLCONF[1:0] defines the number of amplifier chopping periods inside one spinning phase:
HALLCONF[1:0]
#chopping_periods/spinning_phase = 2
. Default this value is 0.
The default HALLCONF is 0xC.

GAIN_SEL
Selection of the gain, adjustable from 0 to 7. See sensitivity table for sensitivity of the IC in LSB/G for each setting of
the gain and the resolution.

Z_SERIES
Connection of the Hall plates for Z-axis measurements. Recommended setting: 0x0.

BURST_DATA_RATE
This parameter controls the data rate in burst mode and in WOC mode. The rate is defined as the time between the
end of one measurement and the start of a new measurement, regardless of the fact if the data is read out or not. A
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value of 0x0 means a continuous burst mode, other value encode as follows: interval = 20ms * BURST_DATA_RATE.
The max is 0x3F, corresponding to 1260ms. This interval can be observed by looking at the DRDY flag.

BURST_SEL
This parameter determines the measurements (X, Y, Z and Temp, or any combination of them) to be performed in the
case that the SB or SWOC command did not specify the measurements. The bit order is (from MSB to LSB): ZYXT.

TCMP_EN
Enables the temperature compensation. Please refer to the application note on the temperature compensation for
more info.

EXT_TRIG
When this bit is set, the external pin INT/TRIG can be used to start a measurement. This only works when
TRIG_INT_SEL is not set (digital input). Otherwise, changes at this pin will be ignored. The axes to be measured are
specified by BURST_SEL.

WOC_DIFF
Absolute or derivative WOC mode:
If 0, an absolute mode is used. Measurements are compared to the first measurements;
If 1, a relative mode is used. Measurements are compared to the previous ones.

COMM_MODE
Defines the communication mode. If it is 0x0 or 0x1, the IC can be used both by I2C and SPI. If 0x2, only SPI can be
used and if 0x3 only I2C can be used.

TRIG_INT_SEL
Selects the function of the INT/TRIG pin. When set, the pin is used as digital output, otherwise it is an input.

OSR
Defines the oversampling rate of the ADC decimation filter for magnetic measurements. OSR_ADC = 64 * 2
will directly impact the measurement time for magnetic measurements.
Note: The chip will not work properly with the following combinations: OSR=0 and DIG_FILT=0, OSR=0 and
DIG_FILT=1 and OSR=1 and DIG_FILT=0

OSR

. This

DIG_FILT
DIG_FILT

A control for the digital filter. An averaging over a certain amount (2
) will be done. This will directly impact the
measurement time for magnetic measurements.
Note: The chip will not work properly with the following combinations: OSR=0 and DIG_FILT=0, OSR=0 and
DIG_FILT=1 and OSR=1 and DIG_FILT=0

RES_XYZ
This 6 bit parameter consists out of three parts, one for each axis. The two MSBs act on the Z-axis, the 2 LSBs on the
X-axis and the middle 2 bits on the Y-axis. Internally each magnetic measurement is 19 bits long. On the output, only
16 bits can be read out. This parameter selects for each axis which 16 bits to read out. Please refer to section Error!
eference source not found. for further detailed information.

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OSR2
Defines the oversampling rate of the ADC decimation filter for a temperature measurement. OSR_ADC = 64 * 2
This will directly impact the measurement time for the temperature measurement.

OSR

.

SENS_TC_LT & SENS_TC_HT
These parameters are used for the temperature compensation for the sensitivity drift of the Hall elements.
SENS_TC_HT is the parameter for temperatures above 35 degC, SENS_TC_LT is the parameter for temperatures
below 35 degC. Please refer to the application note on the temperature compensation for more info. These values
can be blindly programmed to the values given in this document (if not already programmed).

OFFSET_X, OFFSET_Y & OFFSET_Z
These parameters are used to compensate the offset in case the temperature compensation is enabled. They are not
used with TCMP disabled. Please refer to the application note on the temperature compensation for more info. These
values can be blindly programmed to the values given in this document (if not already programmed).

WOXY_THRESHOLD, WOZ_THRESHOLD & WOT_THRESHOLD
Defines the wake up thresholds on X, Y, Z axis or on temperature. The resolution of the temperature sensor is
45.2LSB/K.

Address 10-31
Address 10 to 31 are free to use by the customer. For example traceability information could be stored in here.

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Key Commands
Table 1 shows an overview of all commands possible with the MLX90393. The amount of bytes to be sent and read
back is different for each command. In case more bytes are needed, first byte #1 is sent, then byte #2 and so on.
Table 1: Commands overview
Command

Symbol

CMD byte #1

CMD byte #2

CMD byte #3

CMD byte #4

# bytes to read back

EXit

EX

1000 0000

-

-

-

1 (status)

Start Burst mode

SB

0001 zyxt

-

-

-

1 (status)

Start Wake-up On
Change

SWOC

0010 zyxt

-

-

-

1 (status)

Start Measurement
(polling mode)

SM

0011 zyxt

-

-

-

1 (status)

Read Measurement

RM

0100 zyxt

-

-

-

1 (status) + 2*[z+x+y+t]
(data)

Read from a Register

RR

0101 0000

A[5:0] << 2

-

-

1 (status) + 2 (data)

Write from a Register

WR

0110 0000

D[15:8]

D[7:0]

A[5:0] << 2

1 (status)

Reset

RT

1111 0000

-

-

-

1 (status)

Memory Recall

HR

1101 0000

-

-

-

1 (status)

Memory Store

HS

1110 0000

-

-

-

1 (status)

No OPeration

NOP

0000 0000

-

-

-

1 (status)

All commands will return a status byte showing the current state the IC is in. The 8 bits out of which the status byte
consists are explained below:
Bit 7

Burst_mode

Bit 6

WOC_mode

Bit 5

Bit 4

SM_mode

ERROR

Bit 3

SED

Bit 2

RS

Bit 1

D1

Bit 0

D0

Figure 9: Status byte

•
•
•
•
•
•
•

Burst_mode: if set, the IC is working in burst mode.
WOC_mode: if set, the IC is in wake-up-on-change mode
SM_mode: if set, the IC is executing a measurement sequence in polling mode. It can be initiated by a SM
command or a pulse on the TRIG input
ERROR: indicates an error. Can be set when reading out a measurement while the measurement is not yet
completed or when reading out the same measurement twice.
SED: indicates that a single bit error has been corrected by the NVRAM
RS: indicates that the device has been reset successfully by a reset command.
D1-D0: indicates the number of bytes (2D[1:0]) to follow the status byte after a read measurement or a read
register command has been sent.

CONTROL COMMANDS
Exit (EX)
The exit command is used to force the IC into idle mode. The command will be used to exit the burst mode and the
wake-up-on-change mode. During a single measurement in polling mode, the command is rejected. The status byte
will then show an error and indicate that the IC is in polling mode (SM_mode).

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MLX90393 Getting Started Guide
Reset (RT)
This command is used to reset the IC. On reset, the idle mode will be entered again. The status byte will reflect that
the reset has been successful.

MEMORY COMMANDS
Memory Store (HS)
If the HS command is used, the content from the volatile RAM is overwritten in the non-volatile RAM. On the next
reset, this content will be loaded into the volatile RAM.
Warning: To reliably store the register it is required to supply the IC with 3.3V (VDD)

Memory Recall (HR)
If the HR command is used, the content from the non-volatile RAM is overwritten in the volatile RAM. The same is
automatically done at start-up.

Read Register (RR)
The RR command is used to read out the content of one specific address of the volatile RAM. The address ranges
from 0 to 63. Remind that the last 32 addresses are MLX area which cannot be changed by the user. They are readonly. Note that in the command, the address will be sent as if it is multiplied by 4 (shifted two bits).

Write Register (WR)
The WR command is used to write directly in the volatile RAM. The address ranges from 0 to 63. Remind that the last
32 addresses are MLX area which cannot be changed by the user. They are read-only. Note that in the command, the
address will be sent as if it is multiplied by 4 (shifted two bits). Always full words will be written. Words 0x00 to 0x09
are used to store operating parameters. Words 0x0A to 0x1F are free and usable to store any other data.
Warning: The WR command modifies volatile memory and changes will be lost upon a power cycle. If the modified
values are required to be permanent then a memory store (HS) command must be issued after modifying the
desired registers.

MEASUREMENT COMMANDS
These commands are used for doing measurements or are related to measurement based behavior. In all these
commands, the first byte consists out of 4 bits that determine the command and 4 bits (4 LSBs) stating the stuff to be
measured. In Table 1, these 4 LSBs are called z, y, x and t. By setting the correct bits, one can choose what
information needs to be measured or read back. z, y and x stand for the magnetic fields in 3D, t is temperature.
Disabling certain measurements will end up in a shorted measuring time.

Start Burst Mode (SB)
To start the burst measuring mode, this command will be used. It consists of a single byte with four user-defined bits:
z, y, x, and t. These four bits determine which axes will be converted whenever they are set to a 1. Setting an axis to 0
results in the MLX90393 not performing a conversion on that axis and therefore yields a faster conversion cycle and
reduced current consumption. When zyxt = 0x0, the SB command will enable the measurements specified by the
NVRAM parameter BURST_SEL. The command will only be accepted in case the IC is not operating in another mode
(WOC or SM mode). If this is the case, the error flag is raised in the status byte. In case the command is received
successfully, the Burst_mode flag of the status byte will be set. After the measurement is complete, the DRDY flag is
set (INT pin high). On the start of a new measurement, the DRDY flag is set low again, even if the previous
measurement has not been read out.

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Single Measurement (SM)
The single measurement command is used to instruct the MLX90393 to perform an acquisition cycle. It consists of a
single byte with four user-defined bits: z, y, x, and t. These four bits determine which axes will be converted
whenever they are set to a 1. Setting an axis to 0 results in the MLX90393 not performing a conversion on that axis
and therefore yields a faster conversion cycle and reduced current consumption. When zyxt = 0x0, the SM command
will enable the measurements specified by the NVRAM parameter BURST_SEL (like with SB command). The command
will only be accepted in case the IC is not operating in another mode (WOC or burst mode). If this is the case, the
error flag is raised in the status byte. In case the command is received successfully, the SM_mode flag of the status
byte will be set. The next command following this command usually is RM. After the measurement is complete, the
DRDY flag is set (INT pin high).

Read Measurement (RM)
The Read Measurement command is used to retrieve the data previously acquired by the SM or SB command. Similar
to these commands, the RM command can also select which data is transmitted. Typically the value for z, y, x, and t
will be the same as the SM command preceding the RM command.
The status byte received from the MLX90393 will indicate the number of data bytes waiting to be read out. In the
case where all axes and temp are converted the number of bytes will be 8. The data is output in the following order:
T (MSB), T (LSB), X (MSB), X (LSB), Y (MSB), Y (LSB), Z (MSB), Z (LSB)
If an axis wasn’t selected to be read or converted then that value will be skipped in the transmission.

Start Wake-up on Change (SWOC)
If this command is sent, the WOC mode is entered. The IC will raise the DRDY flag (INT pin) when the thresholds are
crossed specified by WOXY_THRESHOLD, WOZ_THRESHOLD and WOT_THRESHOLD. Both a differential mode and
absolute mode is available (WOC_DIFF). For the differential mode, each change equal to the threshold after a RM
command will be flagged. The x, y, z and t in the command specify which measurements should be done. When zyxt =
0x0, the SWOC command will enable the measurements specified by the NVRAM parameter BURST_SEL.
The status byte will show the WOC mode has been entered.

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MLX90393 Getting Started Guide
Application specific
Resolution
The resolution of the sensor can be changed by parameter RES_XYZ. This 6 bit parameter consists out of three parts,
one for each axis. The two MSBs act on the Z-axis, the 2 LSBs on the X-axis and the middle 2 bits on the Y-axis.
Internally each magnetic measurement is 19 bits long. On the output, only 16 bits can be read out.
By setting the resolution, one can choose which 16 bits to read out as follows (for 0G):

Res = 0x3
Res = 0x2
Res = 0x1
Res = 0x0

18 17 16 15 14 13 12 11 10 9

8

7

6

5

4

3

2

1

0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

1
1
1
1

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

Note that at 0G, the 19 bit value equals 0x20000. This means for resolution 0 and 1, the 16 bit output is centered
around 0 and in 2s complement format. For resolution 2, 0G equals 0x8000 and for resolution 3 0G equals 0x4000.
For 0G + 1LSB19bit this becomes:

Res = 0x3
Res = 0x2
Res = 0x1
Res = 0x0

18 17 16 15 14 13 12 11 10 9

8

7

6

5

4

3

2

1

0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

1
1
1
1

18 17 16 15 14 13 12 11 10 9

8

7

6

5

4

3

2

1

0

0
0
0
0

1
1
1
1

1
1
1
1

1
1
1
1

1
1
1
1

1
1
1
1

1
1
1
1

1
1
1
1

1
1
1
1

1
1
1
1

1
1
1
1

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

0
0
0
0

For 0G - 1LSB19bit this becomes:

Res = 0x3
Res = 0x2
Res = 0x1
Res = 0x0

0
0
0
0

1
1
1
1

1
1
1
1

1
1
1
1

1
1
1
1

1
1
1
1

1
1
1
1

1
1
1
1

1
1
1
1

Calculation of conversion time
There are four parameters that determine the conversion time for a specific measurement: OSR, DIG_FILT, OSR2 and
ZYXT. The typical conversion time can be calculated as follows:

TCONV  TSTANDBY  TACTIVE  n  TCONVXYZ  m  TCONVT
Where TCONVXYZ is the conversion time for 1 magnetic measurement (1 axis), TCONVT the conversion time for the
temperature measurement. Based on ZYXT, the values of n and m can be filled in.

TSTANDBY  TACTIVE  0.5ms



TCONVXYZ  0.063ms  2OSR  2  2 DIG _ FILT



TCONVT  0.18ms  2 OSR2
In the ‘worst case’, when all parameters are max and ZYXT equals 0b1111, the conversion time typically is 198.5ms.
Over temperature, these values will deviate due to the clock which gets slower at rising temperature.

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MLX90393 Getting Started Guide
Sensitivity
The sensitivity is dependent on the selected gain (Gain_sel) and the chosen resolution (RES_X/Y/Z). The typical
sensitivity in µT/LSb for different combination is as followed:

GAIN_SEL
0
1
2
3
4
5
6
7

RES = 0
SENSXY
SENSZ
0.805
1.468
0.644
1.174
0.483
0.881
0.403
0.734
0.322
0.587
0.268
0.489
0.215
0.391
0.161
0.294

RES = 1
SENSXY
SENSZ
1.610
2.936
1.288
2.349
0.966
1.762
0.805
1.468
0.644
1.174
0.537
0.979
0.429
0.783
0.322
0.587

RES = 2
SENSXY
SENSZ
3.220
5.872
2.576
4.698
1.932
3.523
1.610
2.936
1.288
2.349
1.073
1.957
0.859
1.566
0.644
1.174

RES = 3
SENSXY
SENSZ
6.440
11.744
5.152
9.395
3.864
7.046
3.220
5.872
2.576
4.698
2.147
3.915
1.717
3.132
1.288
2.349

The output range depends on the resolution and the saturation level of the IMC. This is given below for both
temperature compensation enabled and disabled. The difference between both is explained in the application note
on temperature compensation.

ABA

RESi

0
1
2
3

Rev 004

TCMP_EN = 0x0
TCMP_EN = 0x1
RANGE
TYPE
RANGE
TYPE
2’s
complement
unsigned
±215
±215
0µT = 0LSB
0µT = 215LSB
2’s complement
unsigned
±215
±215
0µT = 0LSB
0µT = 215LSB
unsigned
±22000
0µT = 215LSB
N/A
unsigned
±11000
0µT = 215LSB

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MLX90393 Getting Started Guide
Available hardware (EVB)
A EVB is available for easy access to the MLX90393. A MLX90393 is soldered to the
2
PCB and extra samples are included in the box. Both SPI and I C are supported.
Default the PCB is prepared to be used with SPI. Simply connect VDD, VSS, MISO,
MOSI, CS and SCLK to the microcontroller to communicate with the MLX90393
2

To use I C, some soldering is needed depending on the address needed:
· Rcs should be shorted (or place 0 Ohm);
· The I2C address should be set to the desired value by shorting the correct R_Ax_x pads. Default 0 Ohm is
placed on R_A0_0 and R_A1_0 which sets the I2C address to 0x19 (Both A0 and A1 are shorted to VSS).
Moving the resistor to R_Ax_1 will connect the pin to the VDD.
· Optionally Rpu1 and Rpu2 are foreseen as a pull up for the SCL and SDA communication lines. Usually this
pull up is on the microcontroller side.
2
Only 4 wires are needed from the EVB to the microcontroller to work with I C: VDD, VSS, SDA and SCL.
Also on the PCB is a pad for an optional decoupling capacitor C1 (Between VDD and VSS).
Below the schematic of the EVB can be seen. The orange external components are placed by default.

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MLX90393 Getting Started Guide
Example #1: Rotary Application
Rotary applications are among the most common and are also the easiest to implement as they require only two axes
of data and a minimum amount of post processing of the data.

Magnetic Configuration
A diametrically magnetized magnet (similar to the one shown in the above
image) is normally used and recommended. While there is no restriction on size
beyond that needed to fulfill the magnetic field strength requirement (10-50mT)
it is advised to not make the magnet too small in diameter as errors caused by
off-axis assembly errors increase as the magnet diameter shrinks. A general rule
of thumb is that the magnet diameter has to be ten times the maximum off-axis
error to maintain a nonlinearity error of less than 1 degree. The following
magnet configurations have been used with the sensor and yielded good results.
Care should be taken to select a magnet that does not exceed the magnetic field
limits over temperature, lifetime aging, and mechanical tolerances and wear.
Magnet
1
2

Diameter
(mm)
10.52
6.50
TBD
TBD
TBD

Height
(mm)
2.72
2.69
TBD
TBD
TBD

Magnetization
Diametrical
Diametrical
Diametrical
Diametrical
Diametrical

Material
SmCo
SmCo
NdFeB
NdFeB
Ceramic

Air Gap (mm)
Min
Max
4.0
7.0
3.0
5.0
TBD
TBD
TBD
TBD
TBD
TBD

Available
Part Number
Dexter 6312007
Dexter 6312002

Note: For applications with high performance requirements it is suggested that a magnet supplier be contacted to
define the best magnet for the application.

Suggested EEPROM Configuration
For rotary applications three EEPROM addresses may need to be modified. They control the gain, filter, and
communication mode among others. Suggested EEPROM values when using magnet 1 in the above table are given
below. These settings allow a sampling rate of 100Hz with minimal noise and a nominal airgap of 6mm.
Parameter

Value

Parameter

Value

ANA_RESERVED_LOW

0x0

EXT_TRIG

0x0

BIST

0x0

TCMP_EN

0x0

Z_SERIES

0x0

BURST_SEL

0x0

GAIN_SEL

0x5

BURST_DATA_RATE

0x0

HALL_CONF

0xC

OSR2

0x0

TRIG_INT

0x0

RES_XYZ

0x1

COMM_MODE

0x0

DIG_FILT

0x5

WOC_DIFF

0x0

OSR

0x0

Modifications to the above table can be made based on the users performance objectives.

Rev 004

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MLX90393 Getting Started Guide
Rotary Code Example
The following flowchart is an example for the microcontroller to configure the MLX90393 via a series of register
read/write operations, permanently store the modifications, and continuously read out the magnetic information.
Processing of the data is performed to obtain a magnetic angle and compute whether the gain should be modified.
After processing, the data is collected, formatted, and can be sent to a PC via the virtual serial port.
A SM/RM cycle is performed approximately every 100ms which does not include the time required to transmit the
various data over the serial port.

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MLX90393 Getting Started Guide
Sequence
ID1 Read

1

Master

Slave
ID1 Data

ID2 Read

2

Master

Slave
ID2 Data

ID3 Read

3

Master

Slave

Loop three
times to write
0x00, 0x01,
0x02

ID2 Data

WR 0x00..

4, 6,
8

Master

5, 7,
9

Master

n

Master

Slave
Status

RR 0x00..

Slave
Status, RR Data

SM

Slave

∞ Loop

Status

RM

n+1

Master

Slave
Status , RM Data

n+2

Compute norm and update gain

WR 0x00..

n+3

Master

Slave
Status

RR 0x00..

n+4

Master

Slave
Status, RR Data

Rev 004

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MLX90393 Getting Started Guide

For the latest version of this document, go to our website at
www.melexis.com
Or for additional information contact your regional sales office
Europe, Africa, Asia:
Phone: +32 1367 0495
Email: sales_europe@melexis.com

America:
Phone: +1 248 306 5400
Email: sales_usa@melexis.com

ISO/TS 16949 and ISO 14001 Certified

Rev 004

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