1990_Fujitsu_Power_Transistor_Products_Data_Book 1990 Fujitsu Power Transistor Products Data Book

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Ring Emitter Transistors
Full Plastic Mold Ring Emitter Transistors
Darlington Transistor Arrays
Field Effect Transistor Arrays

..
EI
III

..

Ordering Information

Ell
1m

Sales Information

III

Design Information

Appendix

o

OJ

FUJITSU

Power Transistor Products
1990
Data
Book

Fujitsu Limited
Tokyo. Japan
Fujitsu Microelectronics. Inc.
Son Jose. California. U.S.A.
Fujitsu Mikroelectronlk GmbH
Frankfurt. ER. Germany
Fujitsu Microelectronics Asia PTE limited
Singapore

Copyrighl© 1990 Fujitsu Microelaclronica,lnc., San Jose, California
All Rights Reserved.
Circuit diagrams using Fujitsu products are included to illustrate typical semiconduc;tor applications. Information sufficient for
construction purposes may not be shown.
The information contained in this document has been carefuUy checked and is believed to be reliable. However, Fujitsu
Microeiaclronics, Inc. assumes no responsibilily for inaccuracies.

The information convayed in this document doss not convey any license under the copyrights, palent rights or trademarks
claimed and owned by Fujitsu Umiled, its subsidiaries, or Fujitsu Microelectronics, Inc.
Fujitsu Microelectronics, Inc. reserves the right to change products or specifications without notice.
No part of this publication may be copied or reproduced in any form or by any means, or transferred to any third party without prior
written consent of Fujitsu MicroeIacIronics, Inc.
This document i. published by the Publications Department, Fujitsu Microeiaclronics, Inc.,
3545 North First Street, San Jose, California, U.S.A. 95134-1804; U.S.A.
Printed in the U.S.A.
Edition 1.1

Contents
Power Transistor Products
Power Transistor Cross Reference Index ................................................. viii
Infroduction-Fujitsu's Power Transistor Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. xi

Section 1 - Ring Emitter Transistors - At a Glance ............................

1-1

2SA1041
2SA1042
2SC2431
2SC2432

Silicon
Silicon
Silicon
Silicon

PNP/NPN
PNP/NPN
PNP/NPN
PNP/NPN

Ring
Ring
Ring
Ring

Emitter Transistor
Emitter Transistor
Emitter Transistor
Emitter Transistor

.........................
.........................
.........................
.........................

1-3
1-3
1-3
1-3

2SA1043
2SA1044
2SC2433
2SC2434

Silicon
Silicon
Silicon
Silicon

PNP/NPN
PNP/NPN
PNP/NPN
PNPINPN

Ring
Ring
Ring
Ring

Emitter Transistor
Emitter Transistor
Emitter Transistor
Emitter Transistor

.........................
.........................
.........................
.........................

1-7
1-7
1-7
1-7

2SA1072
2SA1072A
2SA1073

Silicon PNP Ring Emitter Transistor ............................ 1-11
Silicon PNP Ring Emitter Transistor ............................ 1-11
Silicon PNP Ring Emitter Transistor ............................ 1-11

2SA1077

Silicon PNP Ring Emitter Transistor ............................ 1-13

2SA1078

Silicon PNP Ring Emitter Transislor ............................ 1-15

2SA1080

Silicon PNP Ring Emitter Transistor ............................ 1-17

2SC2428

Silicon NPN Ring EmHterTransistor ............................ 1-19

2SC2522
2SC2522A
2SC2523

Silicon NPN Ring EmHter Transistor ............................ 1-21
Silicon NPN Ring EmHterTransistor ............................ 1-21
Silicon NPN Ring EmHter Transistor ............................ 1-21

2SC2525
2SC2526

Silicon NPN Ring Emitter Transistor ............................ 1-23
Silicon NPN Ring EmHter Transistor ............................ 1-23

2SC2527

Silicon NPN Ring Emitter Transistor ............................ 1-25

2SC2528

Silicon NPN Ring EmHter Transistor ............................ 1-27

2SC2530

Silicon NPN Ring Emitter Transistor ............................ 1-29

2SC2429
2SC2429A
2SC2920
2SC2964
2SC2965

Silicon NPN
Silicon NPN
Silicon NPN
Silicon NPN
Silicon NPN

2SC3044
2SC3044A

Silicon NPN Ring EmHter Transistor ............................ 1-45
Silicon NPN Ring EmHter Transistor ............................ 1-45

Ring Emitter Transistor
Ring EmHter Transistor
Ring EmHter Transistor
Ring Emitter Transistor
Ring Emitter Transistor

............................
............................
............................
............................
............................

1-31
1-31
1-31
1-31
1-31

III

Contents (Continued)
Power Transistor Products
Section 1 - Ring Emitter Transistors

(Continued)

2SC3045

Silicon NPN Ring Emitter Transistor ............................ 1-51

2SC3046

Silicon NPN Ring Emitter Transistor ............................ 1-57

2SC3055

Silicon NPN Ring Emitter Transistor ...•................•....... 1-63

2SC3056
2SC3056A

Silicon NPN Ring Emitter Transistor ............................ 1-69
Silicon NPN Ring Emitter Transistor ............................ 1-69

2SC3057

Silicon NPN Ring Emitter Transistor ............................ 1-75

2SC3058

Silicon NPN Ring Emitter Transistor ........•................... 1-81

2SC3058A

Silicon NPN Ring Emitter Transistor ............................ 1-87

2SC3059
2SC3060
2SC3061
2SC3178

Silicon NPN
Silicon NPN
Silicon NPN
Silicon NPN

FT1551
FT2551

Silicon NPN Ring Emitter Transistor ...•....................... 1-113
Silicon PNP Ring Emitter Transistor ........................... 1-115

Ring
Ring
Ring
Ring

Emitter Transistor
Emitter Transistor
Emitter Transistor
Emitter Transistor

............................
............................
............................
..............•.............

1-93
1-93
1-93
1-93

Section 2 - Full Plastic Mold Ring Emitter Transistors - At a Glance .........

2-1

Introduction ............................................................. 2-3
2SC3842
T0-3PF Full Plastic Mold NPN Power Transistor ................... 2-5
2SC3843
T0-3PF Full Plastic Mold NPN Power Transistor ................... 2-9
2SC3844
T0-3PF Full Plastic Mold NPN Power Transistor .................. 2-13
2SC3845
T0-3PF Full Plastic Mold NPN Power Transistor •................. 2-17
T0-3PF Full Plastic Mold NPN Power Transistor .................. 2-21
2SC3846
T0-3PF Full Plastic Mold NPN Power Transistor .................. 2-25
2SC3847
T0-3PF Full Plastic Mold NPN Power Transistor ........•......... 2-29
2SC3947
TO-3PF Full Plastic Mold NPN Power Transistor .................. 2-33
2SC3948
TO-3PF Full Plastic Mold NPN Power Transistor .................. 2-37
2SC3949

Section 3 - Darlington Transistor Arrays - At a Glance ....................

3-1

Introduction ...............................•............................• 3-3
FT5753M
Silicon NPN Darlington Transistor Array .......................... 3-9
FT5756M
Silicon NPN Darlington Transistor Array .......................... 3-9
FT5754M
Silicon NPN Darlington Transistor Array ......................... 3-11
FT5757M
Silicon NPN Darlington Transistor Array ......................... 3-11

Iv

Contents

(Continued)

Power Transistor Products
Section 3 - Darlington Transistor Arrays - At a Glance (Continued)
FT5755M
FT5758M
FT5759M
FT5760M
FT5761M
FT5763M
FT5766M
FT5764M
FT5767M
FT5769M
FT5770M
FT5776M
FT5777M
FT5778M
FT5786M
FT5787M

Silicon NPN Darlington Transistor Array .........................
Silicon NPN Darlington Transistor Array .........................
Silicon PNP Darlington Transistor Array .........................
Silicon PNP Darlington Transistor Array .........................
Silicon PNP Darlington Transistor Array .........................
Silicon NPN Darlington Transistor Array .........................
Silicon NPN Darlington Transistor Array .........................
Silicon NPN Darlington Transistor Array .........................
Silicon NPN Darlington Transistor Array .........................
Silicon PNP Darlington Transistor Array .........................
Silicon PNP Darlington Transistor Array .........................
Silicon NPN and PNP Darlington Transistor Array .................
Silicon NPN and PNP Darlington Transistor Array .................
Silicon NPN and PNP Darlington Transistor Array .................
Silicon NPN and PNP Darlington Transistor Array .................
Silicon NPN and PNP Darlington Transistor Array .................

3-13
3-13
3-15
3-17
3-19
3-21
3-21
3-23
3-23
3-25
3-27
3-29
3-33
3-37
3-41
3-45

Section 4 - Field Effect Transistor Arrays - At a Glance . ................... 4-1
Introduction ............................................................. 4-3
FT611 0
Silicon N-channel Enhancement Mode Power ..................... 4-7
FT6110D
MOS FET Array
FT6111
Silicon N-channel Enhancement Mode Power .................... 4-11
FT6111 D
MOS FET Array
Silicon N-channel Enhancement Mode Power .................... 4-15
FT6112
FT6112D
MOS FET Array
FT6120
Silicon N-channel Enhancement Mode Power .................... 4-19
FT6120D
MOS FET Array
FT6121
Silicon N-channel Enhancement Mode Power .................... 4-23
FT6121D
MOS FET Array
FT6122
Silicon N-channel Enhancement Mode Power .................... 4-27
FT6122D
MOS FET Array

Section 5 - Design Information - At a Glance ............................ 5--1
Application Notes ........................................................ 5--3
Quality Control at Fujitsu .................................................. 5--45
Quality Control Flowchart ................................................. 5--47

v

Contents

(Continued)

Power Transistor Products
Section 6 - Ordering Information - At a Glance ........................... 6-1
Product Marking ..............................................•.•........ 6-3
Ordering Codes ............................•....................•........ 6-3
Package Codes .......•..•.....................................•......... 6-3

Section 7 - Sales Information - At a Glance . ............................. 7-1
Introduction to Fujitsu ..•..•..•................................•.........•. 7-3
Integrated Circuits Corporate Headquarters - Worldwide .......................... 7-7
FMI Sales OHices for North and South America ................................. 7-8
FMI Representatives - USA ..••.•..•.......•............................... 7-9
FMI Representatives - Canada ............................................. 7-11
FMI Representatives - Mexico .................•.•......................... 7-11
FMI Representatives - Puerto Rico ......................................... 7-11
FMI Distributors - USA ................................................... 7-12
FMI Distributors - Canada .................•.............................. 7-16
FMG Sales OHices for Europe ...................••......................•. 7-17
FMG Distributors - Europe ............................................... 7-18
FMA Sales OHices for Asia and Australia ..•.................................. 7-20
FMA Representatives - Asia ...•........................................... 7-21
FMA Distributors - Asia and Australia ........•................•............. 7-22

Section 8 - Appendix - Table of Product Specifications •...•......................•.... 8-1

vi

Power Transistor Cross Reference Index
FMI Replacement
Part Number

Industry Standard

EXACT
Replacement

Pag.Number

EQUIVALENT
Replacement

Pag.Number

1811 0A-1 00

2803061

1-93

18110A-100

2803846

2-21

2N4399

28A1044

1-7

2N5302

2802434

1-7

2N5879

28A1042

1-3

2N5881

2802432

1-3

2N5883

28A1044

1-7

2N6438

28A1043

1-7

2N6834

2803044A

1-45

28A1072

28A1072

1-11

28A1072A

28A1072A

1-11

28A1073

28A1073

1-11

28A1077

28A1077

1-13

28A1078

28A1078

1-15

28A1080

28A1080

1-17

2802422

2802522

141
1-19

2802428

2802428

2802429

2802429

1-31

2802522A

2802522A

141

2802523

2802523

141

2802527

2802527

145

2802528

2802528

1-27

2802530

2802530

149

2802920

2802920

1-31

2803059

2803059

1-93

2803178

2803178

1-93

2803843

2803843

2-9

2803847

2803847

2-,25

2803948

2803948

2-33

280310

2802964

1-31

280311

2802964

1-31

280395

2802965

1-31

280395

2803949

2-37

280396

2802964

1-31

BOY93

2803044

1-45

BOY94

2803044280

1-45

vii

Power Transistor Cross Reference Index (Continued)
F.. Replacement
Part Number
Induatry Standard

EQUIVALENT

EXACT
Replacement

Page Number

BU221

2503044

1-45

BU222

2503044

1-45

BU326A

2503044

1-45

BU5313

25C2964

1-31

BU513A

25C2429A

1-31

BU514

2503058

1~1

BU514A

2503058A

1~7

Replacement

PegeNumber

2503844

2-13

BUS46P

2SC3044A

1-45

BUS46P

2503056A

1~9

BUW44

25C2964

1-31

BUW45

25C2964

1-31

BUW46

25C2429A

1-31

BUX17

25C2964

1-31

BUX17A

25C2964

1-31

BUX17B

25C2964

1-31

BUX17C

25C2964

1-31

BUX48

25C2964

1-31

BUX48A

25C2429A

1-31

BUX84

2503055

1~

BUX98

25C3058

1~1

BUX98A

2503058A

1~7

FTl551

FTl551

1-113

FT2551

FT2551

1-115

IR519

25C2964

1-31

MJ12020

25C3060

1~

MJ13015

25C3045

1-51

MJ13090

25C2964

1-31

MJ15015

25C2431

1-3

MJl5016

25A1041

1-3

BUX48A

2503844

25C3844

2-13

2503056

1-59

MJ16002

2503044A

1-45

MJ16004

25C3044A

1-45

2503949

2-37

MJ13070

MJ16006A

2503947

2~9

25C2965

1-31

MJ16010
MJ16010

viii

Power Transistor Cross Reference Index (Continued)
FM Replacement
Part Number
Industry Standard

EQUIVALENT

EXACT

Replacement

Page Number

M116018

Replacement

Page Number

2S03061

1-93

2S03846

2-21

M14502

2SA1043

1-7

M1802

2SC2433

1-7

2S03061

1-93

M18505

2SC3846

2-21

M1E13007

2S03057

1-75

M1E13007

2S03842

2-5

MJE16002

2S03056A

1-59

MJE16002

2S03949

2-37

M116018
M116110

M18505

2SC2964

2SC3061

1-31

1-93

MJE16004

2S03056A

1-59

M1E16004

2S03949

2-37
2-17

MJE16032

2S03845

M1E16106

2SC3057

1-75

M1E16106

2S03842

2-5

RCA8767AIB

2SC2964

1-31

RCA9113A1
82SC2964

25C2964

1-31

5DT13304

2SC2965

1-31

SDT13304

2SC3949

2-37

SGSF564

2S03061

1-93

SGSF564

2S03846

2-21

SVT7532

2S03044A

1-45

SVT7532

2S03056A

1-59

SVT7535

2S03044A

1-45

SVT7535

2S03056A

1-59

SVT7550

2SC2965

1-31

SVT7550

2S03949

2-37

SVT7551

2S02965

1-31

SVT7551

2S03949

2-37

SVT350-12

2SC2964

1-31

SVT7552

2SC2965

1-31

SVT7552

2S03949

2-37

SVT7554

2S02965

1-31

SVT7554

2S03949

2-37

/x

Power Transistor Cross Reference Index (Continued)
AI Replacement
Part Number

Induatry Standard

EXACT
Replacement

EQUIVALENT

Page Number

Raplacemant

Pag_Number

SVT7555

2S02965

1-31

SVT7555

2SC3949

2-37

SVT7560

2SC2965

1-31

SVT7560

2SC3949

2-37

SVT7570

2SC2965

1-31

SVT7570

2S03949

2-37

TIPL751A

2S03044A

1-45

TIPL751A

2S03056A

1-69

TIPL755A

2S02965

1-31

TIPL755A

2S03949

2-37

TIPL760A

2SC3044A

1-45

TIPL760A

2SC3056A

1-69

Jt

Fujitsu's Power Transistor Products

Introduction
Fujitsu manufactures a wide range of power actuators that
include: ring emitter transistors, darlington transistor arrays
and field effect transistor arrays.
The Power Transistor Product line offers devices for use in
applications that provide the designer with a complete
solution to the implementation of control systems, when
combined with Fujitsu's broad line of integrated circuit
technologies.
Ring EmHter Transistors (REn
RET devices offer significant improvement over conventional
power transistors due to their high speed switching
characteristics and large safe operating area. A typical RET
consists of several hundred multiple ring-emitters connected
to a common emitter electrode through diffused ballast
resistors. The RET structure is a superior transistor for motor
control and switch mode converter applications.
Darlington Transistor Arrays
These devices are ideally suited for todays multiple output
applications. Features include: large DC current gain and
large collector power dissipation. A fast recovery diode to
absorb flyback voltage is included, and fast switchinq speed
is also provided This array is well suited for motor drive
applications and terminal equipment where IC outputs must
be boosted to drive print hammers or solenoids.
Field Effect Transistor Arrays (FET)
FET arrays are faster easier to drive and in motor control or
switching power supply applications result in significant
parts-count reductions and higher overall efficiency.
Telecommunication applications require irJl)edance to be
strictly controlled in signal line interfaces; FET arrays offer
this control in solid state switching while providing more
reliability than traditional reed arrays.

xii

Section 1
R"ma Emltter Translstors -

A ta Glance
Maximum Rating.
YeEO(V) Ie (A)

Page

DavIca

C... (na)

Polarity

1-3

2SAl041
2SA1042
2SC2431
2SC2432

JEDEC TO-.'!

-120

2SA1043
2SA1044
2SC2433
2SC2434

JEDEC TO-.'!

1-11

2SA1072
2SA1072A
2SA1073

JEDEC TO-.'!
JEDEC TO-.'!

PNP
PNP
NPN
NPN
PNP
PNP
NPN
NPN
PNP
PNP
PNP

1-13

2SA10n

JEDEC T0-220

1-15

2SA1078

JEDEC T0-220

1-17

2SA1080

JEDEC T0-220

PNP
PNP
PNP
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN
NPN

1-7

1-19

2SC2428

JEDEC TO-.'!

1-21

2SC2522
2SC2522A
2SC2523

JEDEC TO-.'!
JEDEC TO-.'!

1-23

2SC2525
2SC25:!6

RM-aO

1-25

2SC2527

JEDEC T0-220

1-27

2SC2528

JEDEC TO-22O

1-29

2SC2530

JEDEC TO-220

1-31

2SC2429
2SC2429A
2SC2920
2SC2964
2SC2965

JEDEC TO-.'!

1-45

2SC3044
2SC3044A

JEDEC TO-.'!

1-01

2SC3045

JEDEC TO-.'!

1-07

2SC3048

JEDEC TO-.'!

1-63

2SC3055

JEDEC TO-220

1-69

JEDEC TO-220

1-75

2SC3056
2SC3056A
2SC3057

1-81

2SC3058

JEDEC TO-.'!

1-87

2SC3058A

JEDEC TO-.'!

JEDEC TO-22O

-70
120

70
-120

-15
-15
15
15

120
70

-30
-30
30
30

120
150
160

12
12
12

120

10

-70

120

2

40
180

0.5

120
150
160

12
12
12

120
160

12
12

120

10

12

120

2

40

0.5

400
450
400
400
450

15
15
15
15
15

400
450

6
6

400

10

450

10

400

2

400
400
400

6
6
10

400

30
30

450

1-1

..

Section 1

Rina Emitter Transistors -

1-2

At a Glance (Continued)

Paga

Device

Caaa(na)

Polarity

1-93

2SC3059
2SC3060
2SC3061
2803178

JEDECTO--$

1-113

FTl551

JEDEC~

1-115

FT2551

JEDEC~

NPN
NPN
NPN
NPN
NPN
PNP

Maximum Radng.
Ie (A)

V CEO (V)

850
850
850
850

2
5
10
2

120

2

120

2

cP

January 1990

FUJITSU

Edition 1.1
PRODUCT PROFILE

2SA1041, 2SA1042, 2SC2431, 2SC2432
Silicon High Speed Power Transistor
DESCRIPTION
This series are silicon PNP/NPN planer general purpose. high power switching
transistors fabricated with Fujitsu's unique Ring Emitter Transistor (RET) tech·
nology. RET devices are constructed with multiple emitters connected through
diffused ballast resistors which provide uniform current density. This structure
permits the design of high power transistors with superior switching characteristics
and frequency response in high current applications.
This series are especially well-suited for high speed/high voltage switching systems
or other applications where large SOA is required.

..

OUTlINE DIMENSION
JEDEC TO-3

Features

*
*

*
*
*
*

2SA1041,2SA1042

2SC2431, 2SC2432

:

60MHz (typ.)

80MHz (typ.)

tr:

0.15/-1s (typ.)

0.20/-ls (tyP.)

t, :

0.24/-1s (typ.)

0.70/-ls (typ.)

t, :

0.08/-1s (typ.)

0.12/-1s (tyP.)

fT

Excellent Safe Operating Area:

2SA1041-2SC2431

Complements:

2SA 1042-2SC2432
1: Base 2: Emitter 3: Collector (Case)
Dimension in inches and (millimeters)

ABSOLUTE MAXIMUM RATINGS
Value
Rating

Value

Symbol

Unit
2SA1041

2SA1042

2SC2431

2SC2432

Collector to Base Voltage

VeBo

-120

-70

120

70

V

Emitter to Base Voltage

VEBO

-5

-5

5

5

V

Collector to Emitter Voltage

VeEo

-120

-70

120

70

V

Collector Cu rrent

Ie

-15

-15

15

15

A

Base Current

IB

-5

-5

5

5

A

Collector Power Dissipation (Te = 25°C)

Pc

100

100

W

Junction Temperature

Tj

Storage Temperature Range

Tst9

100

100
+175

+175

°c

-65~+175

-65~+175

°c

1-3

2SA1041, 2SA1042, 2SC2431, 2SC2432

ELECTRICAL CHARACTERISTICS (T. = 2S0C)
2SA1041,2SA1042
Limits

Parameter

Symbol

2SA1041

Test Conditions

Min.
Collector Cutoff Current

Collector Cutoff Current

I"BO
leBO

Emitter Cutoff Current

'EBO

Collector Cutoff Current

ICED

Collector Cutoff Current
Collector to Base Breakdown Voltage
Emitter to Base Breakdown Voltage
Collector to Emitter Breakdown Voltage
DC Current Gain
DC Current Gain

'CEO

VIBR)CBO
VIBR)EBO
VIBR)CEO
hFE
hFE2

Collector to Emitter Saturation Voltage

VeE sat)

Base to Emitter Saturation Voltage

VSE(sat

Gain-Bandwidth Product

Output Capacitance
Rise Time
Storage Time
Fall Time

IT
Cob
t,
t sta
t,

V"B = -120V,
VCB = -70V,
VEB = -4V,
VCE = -120V,
VCE = -70V,
Ic = -50jlA,
Ie"" -1mA.
Ic = lOmA,
VCE - -5V,
VCE = -5V,
Ic = -7A,

IE
IE
IC
IB
IB
IE
Ic

Unit

TVD. Max.

Min.

-50

=0
=0
=0
=0
=0
=0
=0

RBe -

2SA1042

TVD. Max.

-50
-50
-1

-50
-1

co

Ie = -1.5A·
Ic - -15A •

-120
-5
-120
35

200

-70
-5
-70
35
10

200

-0.6

-0.6

1.5
-1.2 -1.8
60
350
0.15 0.8
0.24 1.0
0.08 0.8

18 =...o.7A *

Ic=-lA
VCE - -10V,
V CB = -10V, IE =0,1= lMHz
Ic = -7.5A,
RL =40
IBl = -I B2 = -O.75A

pA
pA
pA
mA
mA
V
V
V

-1.2
60
350
0.15
0.24
0.08

-1.5
-1.8

0.8
1.0
0.8

V
V
MHz
pF
1"
1"
1"

2SC2431, 2SC2432
Limits
Parameter

Symbol

2SC2431

Test Conditions

Min.
Collector Cutoff Current

ICBO

Collector Cutoff Current

I CBO

Emitter Cutoff Current

lEBO

Collector Cutoff Current

ICEO

Collector Cutoff Current

ICED
VeBR CBO
VIBR)EBO
VIBR)CEO

Collector to Base Breakdown Voltage
Emitter to Base Breakdown Voltage
Collector to Emitter Breakdown Voltage

VCB = 120V,
VCB = 70V,
VEB=4V,
VCE = 120V,
VCE - 70A,
Ic = 50jlA,
IE =lrnA,
Ic = lOmA,

DC Current Gain

hFE1

VCE =.5V.

DC Current Gain

hFE2

VCE=5V,

Collector to Emitter Saturation Voltage
Base to Emitter Satu ration Voltage
Gain..eandwidth Product

VCE(satl
VSE(sat)

Rise Time

IT
Cob
t,

Storage Time

t stg

Output Capacitance

Fall Time

t,

Ic=7A,

IE
IE
Ic
IB

=0
=0
=0
=0

-

50
1

Min.

-

-

'E = 0
IC=O
RBE

:::00

Ic = 1.5A·
I c =15A'

-

Ic = 7.5A, RL =40
IS1 = -I B2 = 0.75A

-

jlA

50
50

I'A
jlA
rnA
rnA
V
V
V

1
120
5
120
35
7

'a=O.7A*

VCE = 10V,
Ic = lA
VCB = 10V, IE = 0, 1= lMHz

Unit

Typ. Max.

's=O

-

-

200

0.4
1.2
80
200
0.20
0.70
0.12

* Pulsed Pw

1-4

2SC2432

Typ. Max.
- 50

1.6
1.8

0.8
1.0
0.8

70
5
70
35
10

-

-

-

200

0.4
1.2
80
200
0.20
0.70
0.12

1.5
1.8

0.8
1.0
0.8

~ 300 IJ, Duty Ratio ~ 6%

V
V
MHz
pF
jl'
jl'
I'S

2SA1041 , 2SA1042, 2SC2431, 2SC2432

2SA1041 , 2SA1042

2SC2431, 2SC2432

DC CURRENT GAIN

DC CURRENT GAIN
e';~5"C

~200
.c

V E = 5V

.~ 100
C)

c

,~
"
g
10 -0.02 -0.05 -0.1 -0.2 -0.5 -1

-2

-5

10

50

20
10

\.
0.02 0.05 0.1 0.2

Collector Current Ie (A)

w
u

> -O.2J--++++t+tH---+--+-H+tI+t--b"l-+t+ttH----l

. .N./

-0.1~~~~II~lt-l~~1'I·~"II~~

5 -0.05
g
.~

..

:il-O.02~j;;tgmt=;;i;;±:J;;l;t±Jt=;p:tt±l±!t:::j
-0.02 -0.05 -0.1 -0.2

-0.5 -1

-2

10

2

SATURATION VOLTAGE

Te=25"e1IIIIIIIa"le/10 ,

i ~~~i!~ii~~~v~~n~!I';~~!iiir~
~
t

1

Collector Current Ie IA}

SATURATION VOLTAGE

j

0.5

-5 -10

~

]
w
>'"
]

Te =2S"Cla = lel10

IIIII

l'

a1 1
llll

1

w 0.5

~

t

0.2

gc

O. 1

III ..'\

-J~

o
.j; 0.05

5

:il 0.02

0.02 0.05 0.1 0.2

0.5

1

2

5

10

Collector Current Ie tA)

Collector Current Ie (A)

SAFE OPERATING AREAS

SAFE OPERATING AREAS

-20I-H-++1OtI--n:t-+-It1-t1m' 25' C
'v~ N ~II

~
S'

-1°~11~~&;~~1===~=~
5

0

"
5

f.IJ[~ =25"C

~~ ~~~~

2
1

Du tv Cycle =1 1/100

5

!:j

o. 2
-5 -10 -20

-50 -100-200

Collector-Emitter Voltage VeE (V)

10

20

fj-

~ ~

50 100 200

Coliector·Emitter Voltage VeE tV)

1-5

..

2SA1041, 2SA1042, 2SC2431, 2SC2432

~

~

2SA1041.2SA1042

2SC2431. 2SC2432

GAIN BANDWIDTH PRODUCT

GAIN BANDWIDTH PRODUCT

~0H+~~~~~~~

01:-100
£~.

~!

50

~

~

!:

10~~0~.1~0~.2~~0~.S~~~~~~W

8 10WU~~~~~~~~~~~~

Collector Current Ie (A)

Collector Current Ie (A)

0: 2000

OUTPUT CAPACITANCE
tC"2~C
IE~O~
f-1M z

.!;
.01000

cJ
~

500

r-.

l!

.~

13

~

0

-20

-SO -100

Collector-Base Voltage V eB (V)

200

.................

100
50

10

20

50

SWITCHING TIME

SWITCHING TIME

s

O.I~n

o.osEl:!!ll==
-1

-2

-5 -10 -20

Collector Current Ie (A)

1-6

100

Collector-Base Voltage V eB (V)

0.1~.

o.os~
O.S

1

10

20

Collector Current Ie (A)

00

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

2SA 1043, 2SA 1044, 2SC2433, 2SC2434

Silicon High Speed Power Transistor
DESCRIPTION
This series are silicon PNP/NPN planer general purpose, high power switching
transistors fabricated with Fujitsu's unique Ring Emitter Transistor (RET) tech·
nology. RET devices are constructed with multiple emitters connected through
diffused ballast resistors which provide uniform current density. This structure
permits the design of high power transistors with superior switching characteristics
and frequency response in high current applications.
This series are especially well-suited for high speed/high voltage switching systems
or other applications where large SOA is required.

OUTLINE DIMENSION
JEDEC TO-3

Features

*
*
*

t,

2SA1043,2SA1044

2SC2433, 2SC2434

60MHz (typ.)

BOMHz (typ.)

0.20/.ls (typ.)

0.2B /.lS (typ.)

0.24/.ls (typ.)

0.70/.lS (typ.)

O.OB /.lS (typ_)

0.15/.ls (typ.)

Excellent Safe Operating Area:

2SA 1043-2SC2433

Complements:

2SA1044-2SC2434
1: Base 2: Emitter 3: Collector (Case)
Dimension in inches and (millimeters)

ABSOLUTE MAXIMUM RATINGS
Value
Rating

Value

Symbol

Unit
2SA 1043

2SA1044

2SC2433

2SC2434

Collector to Base Voltage

V CBO

-120

-70

120

70

V

Emitter to Base Voltage

VEBO

-5

-5

5

5

V

Collector to Emitter Voltage

VeEo

-120

-70

120

70

V

Collector Current

Ie

-30

-30

30

30

A

Base Current

IB

-10

-10

10

10

A

Collector Power Dissipation (Tc = 25°C)

Pc

150

150

W

Junction Temperature

TJ

Storage Temperature Range

T stg

c.pynght@ 'lID by FUJITSU UIIlED _

Fu,..., _

150

150
+175

+175

°c

-65-+175

-65-+175

°c

.......
1-7

2SA1043, 2SA1044, 2SC2433, 2SC2434

ELECTRICAL CHARACTERISTICS (T.

= 25°C)

2SA1043,2SA1044
Limits
Parameter

Symbol

Collector Cutoff Current

leBO

Collector Cutoff Current

ICBO

Emitter Cutoff Current

lEBO

Collector Cutoff Current

'CEO

Collector Cutoff Current
Collector to Base Breakdown Voltage

'CEO

V(SR)CSO

Emitter to Base Breakdown Voltage

V(SR ESO

Collector to Emitter Breakdown Voltage

V(EiR)CEO

DC Current Gain

hFE1

DC Current Gain

hFE2

Collector to Emitter Saturation Voltage

VeE sat

Base to Emitter Saturation Voltage

VSE(sat)

Gain-Bandwidth Product

fT

Output Capacitance

Cob

Rise Time
Storage Time

tstQ

Fall Time

"

2SA1043
Min. TYp· Max.

Test Conditions

VCS - -120V,
VCS - -70V,
VES - -4V,
VCE = -120V,
VCE - -70V,
Ic - -50~A,
IE - -lmA,
Ic = -10mA,

IE - 0
IE - 0

-50

Ic - 0
Is - 0
Is - 0
IE 0

-50
-1

2SA1044
Typ. Max.
-50
-50
-1

Ic - 0
RBE -

Min.

con

VeE = -5V,
V CE--5V,

Ie = -3A

Ie = -15A,

Is = -1.5A'

*

-120
-5
-120
35

70
-5
-70
200

Ie - -30A *

35

Unit
-50
I'A
I'A
mA
mA
V
V
V

200

10
-0.7
1.2

VCE - -10V,

Ic - -2A
VCS - -10V, IE-O, f-1MHz

60
600

Ic = -15A, RL = 2n
IS1 =-I S2 =-1.5A

0.20
0.24
0.08

'f

-1.5
-2.0

-0.5
-1.1

-1.-5
2.0

60
700

V
V
MHz
pF

0.8
1.0

0.20
0.24

0.8
1.0

1"

0.8

0.08

0.8

1"

1"

2SC2433, 2SC2434
Limits
Parameter
Collector Cutoff Current
Collector Cutoff CUrrent

Symbol
'CBO
I CBO

Emitter Cutoff Current

lEBO

Collector Cutoff Current

'CEO

Collector Cutoff Current
Collector to Base Breakdown Voltage

'CEO
V BR CBO

Emitter to Base Breakdown Voltage

V(BR EBO

Collector to Emitter Breakdown Voltage

V(SR)CEO

DC Current Gain

hFE1

DC Current Gain

hFE2

Collector to Emitter Saturation Voltage.

VCE(sat)

Base to Emitter Saturation Voltage

VSE!s.t)
fT

Gain-Bandwidth Product
Output Capacitance

Cob

Rise Time

"
t stg

Storage Time
Fall Time

'f

Test Conditions

VCS = 120V,
VCS - 70V,
VES = 4V,
VCE = 120V,
ICE = 70V,
Ic - 50l'A,
IE -lmA,
Ic -10mA,
V C E-5V,
VeE 5V,
Ic = 15A,

IE
IE
Ie
IS

=

0
0
0
0

Is -0
IE 0
Ic -0

2SC2433
Min. Typ. Max.
50

-

oon
,
IC =3A
Ic = 30A *

7

Ie = 15A, RL = 2n
IS1 = -IS2 = 1.5A

-

-

-

200

0.5

I B =1.5A*

IC 2A
VeE 10V,
Vcs=10V, IE=O, f=lMHz

50
1

-

1.2
80

-

350
0.28
0.70
0.15

70
5
70

50
50

-

Unit

I'A
I'A
I'A
mA
mA
V
V
V

200
0.5

-

1.2
80
350

-

0.28
0.70
0.15

0.8
1.0
0.8

-

35
10

1.5
2.0

-

-

-

* Pulsed P w ~ 300 /.LS, Duty Ratio

1-8

-

-

1
120
5
120
35

RBE -

-

2SC2432
Typ. Max.

Min.

1.5
2.0

-

V
V
MHz
pF

0.8
1.0

1"

0.8

1"

~ 6%

1"

2SA1043, 2SA1044, 2SC2433, 2SC2434

2SC2433,2SC2434

2SC1043,2SA1044

DC CURRENT GAIN

DC CURRENT GAIN

1

w

1" 200

'"
c

50 . . -

u
u

201----1--

~

Cl

10

t:--

-:[
f--I

.~ 100

Te=25bC
VeE =-5

··.·-F·'

-f-

11

1-.

l··

.~

-0.02 -0.05 -0.1-0.2

0.5

-2

1

-5 -10 -20

201----l--50

10

1\

0.02 0.05 0.1 0.2

Collector Current Ie (Al

·m . I
11

i 1~~l·····±···rrnmr!1'1Jn~I~ElIJll[t.~1!IV~~1
r ;
1

w -O.5

I :~c+' {![bl.".~ m~ ·j· j..-'~II'I
.g -0.05
~

t~~

It

.

~II

~tf-Ilil-

t-

.

.;J -O.02t;t:tj:mtttt~tIjjtttJt=t±ijj±tij;;=ttl;j
-0.02-0.05-0.1-0.2 -0.5 -1

-2

-5 -10 -20

SAFE OPERATING AREAS

-50

]

1
0,5

w

u

>

j

"0

>

g

."
~

~

III

0.2

2

~

-1iJir-

R~

~.,,~

-

O. 1

0.02 0.05 0.1 0.2

5

--t- .

I
lOut y Cycle = 1 100

8 -0. 5

0.5

.

-0. 2
-5 -10 -20

0
0

2

.

1

1--

5

Coliector·Emitter-Voltage VeE (V)

10

1

20

50

SAFE OPERATING AREAS

l-

..! ~
:t
!!l
~
-50-100-200

III

Col/ector Current tA)

5

..

2

j

I~I~~~"~

0.05

Te = 2sOC

l~:~·

-20

viif

~tlllll!!

w

>'"

0

~ -1 0

50

Te = 25"C
18 = 'e110

WIIlL

~

Collector Current Ie (A)

-50

20

10

2

SATURATION VOLTAGE

Te=25°C
I. = 'e110

11--.

1--- . . .

-2---

1

Collector Current {A)

SATURATION VOLTAGE

~

0.5

Tc =25"C

~.....~&'~II
i\. r\ ~,,;)
j-.

Du ty Cycle = 1/166

... l:j
N~.

o. 2
10

20

1* ~

50 100 200

Collector-Emitter-Voltage VeE (V)

1-9

2SA1043, 2SA1044, 2SC2433, 2SC2434

2SA 1043, 2SA1044

2SC2433,2SC2434

GAIN BANDWIDTH PRODUCT

GAIN BANDWIDTH PRODUCT

"B

g 2OOUlllL.

Tc = 2flo~~H

.f:I

TC· 25"C
V 0 -10V

.11
Vco=-10V

£NI001=·":·I~
r

.-

'C:!E

' j - 50

].t"
III

20

c

~

0

r

10

-0.1 -0.2

-2

-0.5 -1

-5

0.1

0.2

0.5

2

1

10

Collector Current Ie (AI

-10

Collector Current Ie (AI

OUTPUT CAPACITANCE

5000

Te -25"C
10 =0
f= lMHz

iC

.e

-

..c 2000
UO

g 1000
~

.~

500

Cl

-: 1000E-~~fj~m14
cJ
IB

500

l

200

~

(3

c:l
~

OUTPUT CAPACITANCE

iC2000r--'-'-rrnTIT---r-r~~~~

200

o
-1

-2

-5

-10 -20

Collector-Base-Voltage

-50 -100

Collector-Sase-Voltage VCA (V)

Vee (V)

SWITCHING TIME

SWITCHING TIME
. e=2~_C
Vee =:lIlV

Te=25"~!
Vee

IBI

=-JOV

5

= -Ie, "" Ici1~

1st

1

1

i=

go
II

~ o. 1

JII o.

'\t

~

0.05
-0.5 -1

-2

V[\

~

II

-5 -10 -20

Collector Current Ie (AI

1-10

Ir.

EO. 5

0.5

:E 0.2

II ItI

2

.....
~

lSI"" -l s2 "" le/10

-50

/

2

o. 1

0.0 5
0.5

~

Y'I
10

20

Collector Current Ie {AI

50

OJ

January 1990

FUJITSU

Edition 1.1
PRODUCT PROFILE

2SA 1072, 2SA 1072A, 2SA 1073
Silicon High Speed Power Transistor
DESCRIPTION
The 2SA107212SA1072A12SA1073 are silicon PNP general purpose, high power
swkching transistors fabricated wkh Fujksu's unique Ring Emitter Transitor (RET)
technology. RET devices are constructed with multiple emitters connected through
diffused ballast resistors which provide unHorm current densky. This structure
permks the design of high power transistors wkh exceptional swkching characteristics and frequency response in high current applications.

OUTLINE DIMENSION
JEDEC TO-3

The 2SA 107212SA1072A12SA 1073 are especially well-suked for high frequency
power amplHiers, audio power amplHiers, switching regulators and DC-DC
converters. NPN complements, 2SC252212SC2522A12SC2523, are available.
High IT - 60 MHz (typ)
Ultra last swkching speed

•
•

Excellent safe operating area
Improved reverse second-breakdown
capabilky

ABSOLUTE MAXIMUM RATINGS
Rating

Symbol

Unit

value
2SA1072 2SAl072A 2SAl073

Collector 10 Base Voltage

VCBO

Emitter 10 Base Voltage

VEBO

120
7

150
7

160
7

Collector 10 Emil19r Voltage

VCEO

120

150

160

V

Ic

12

12

12

A

Pc
TI
Tatg

120

120

120

Collector Current
Collector Power Dissipation (Tc = 25°C)
Junction Temperature
Storage Temperature Range

ELECTRICAL CHARACTERISTICS (Ta

+150
-6510+150

V
V

1: Emitter 2: S ... 3: CollectOr (CI881

W

Dimension in inches and (mlilimete,..1

°c
°c

=25°C)
Uml..
2SA107212SA1072A

Parameter

Symbol

Teat Condition.

Collector Cutoff Currant

ICBO

Vea = 12OVlI60V,IE=0

Emil1er Culoff Current

lEBO

VES =7V,lc=0

Collector Cutoff Current

ICEO

Vr'S' = 12OVlI60V, R... = ..

Collector 10 Base Breakdown Voltage

V(BR)CBO Ic =50 IJA,IE = 0

Emitter to Base Breakdown Voltage

V(SR)EBO IE=50JIA.Ic=O

Collector 10 Emil19r Breakdown Voltage

V(SRICEO Ic= 1 mAo RBE="

DC Current Gain

hFE1

VCE=SV. Ic= 1 A*

Min.

-

50/-

-

50

-

1/-

-

--;sr -

-

160

-

-

7

120
7
120

--;sr 60

DC Current Gain

hFE2

VCE=SV.

10- 7 A*

40

Collector 10 Emll19r Saturation Voltage

VCE(aaI)

Ic·SA,

IB-O.S A*

Base 10 Emitter Voltage

VBE

V.... =5A.

-

Gain-Bandwidth Product
Output Capecitance

IT

VCE = 10 V. Ic = 1 A. I = 10 MHz
Vea = 10 V. IE. O. I = 1 MHz

Cab

Rise lime

t,

Storage lime

Ieog

.

~
Fall lime
Pulsed. Pulse width ~ 300J!S; Duty Cycle ~ 6%
t For 2SA 1072A only

,CopyrIgJoA@, •

1,,-5 A*

Ic= 7.SA. FiL=40
IB1 = -182 = 0.75 A

2SA1073

Typ. Max. Min.

45

-

Typ. Max.

Unit

-

-150

JIA

50

JIA

-

-11

mA

-

V

-

V

-

V

200

V

-

160

-

200

60

0.9

1.8

-

09

1.8

1.25
60

1.7

1.7

45

1.25
60

300

470

300

470

pF

0.15

-

0.15

-

J!S

-

J!S
J!S

40

0.5
0.11

-

-

0.5
0.11

-

V

MHz

..,FIJITlIU UWTED ond """'" _ - . . . . . . ....

1-11

2SA1072,2SA1072,2SA1073
GAIN BANDWIDTH PRODUCT

Jc !!-'10V

0.5

1

:l

"

I;

I C. Collector Current (AMP)

.,

..

u

'c. Collector Current (AMP)

OUTPUT CAPACITANCE

"COLLECTOR SATURATION VOLTAGE

r"m. .
~~~

t

'I

&00

u

! ~~~---+-+-+++tHt-~~~-HiTH
8

""Billa

.g

u

,

V ca. Collector Base' Voltage (VOLTS)

Ie. Collector Currant (AMP)

SWITCHING TIME

SAFE OPERATING AREAS

"
~

"
,

.,,;>.~

~

III

TC=:iI6:t;

~~il

PuIS.

"',

~

'~t=

"

,

"

0e-

:1--

,

.
,
,
11.6

1

6

10

Ie. Collector Currant (AMP)

1-12

r

.

"

SI"~

2SA107~

. l~um ,.
~

~

VeE. Collector-Emitter Voltage (VOLTS)

cP

January 1990

FUJITSU

Edition 1.1
PRODUCT PROFILE

2SA1077
Silicon High Speed Power Transistor
DESCRIPTION
The 2SA 1077 is silicon PNP general purpose, high power switching transistors
fabricated with Fujitsu's unique Ring Emitter Transistor (RET) technology. RET
devices are constructed with multiple emitters connected through diffused ballast
resistors which provide uniform current density. This structure permits the design
of high power transistors with exceptional switching characteristics and frequency
response in high current applications.
The 2SA 1077 is especially well·suited for High frequency power amplifiers, Audio
power amplifiers, Switching regulators and DC-DC Converters.
A NPN complement, 2SC 2527, is available.
•
•
•
•

..

OUTLINE DIMENSION
JEDEC TO·220

High fT = 60 MHz (typ)
Ultra fast switching speed
Excellent Safe Operating Area
Improved reverse Second-Breakdown Capability

ABSOLUTE MAXIMUM RATINGS
Symbol

Value

Unit

Collector to Base Voltage

V CBO

120

V

Emitter to Base Voltage

VEBO

7

V

Collector to Emitter Voltage

V CEO

120

V

Rating

Collector Current
Collector Power Dissipation ITc

= 25"C)

Junction Temperature

Storage Temperature Range

Ic

10

A

Pc

60

W

Tj

lS0

Tstg

-6S-+1S0

°c
°c

1: B... 2: Collector 3: Emitter

Dimension in inches and {millimetert!.

ELECTRICAL CHARACTERISTICS (T. = 25°C)
Limits
Parameter

Unit

Test Conditions

Symbol

Min.

Typ.

Max.

Collector Cutoff Current

ICBO

VCB = 120V,

IE = 0

SO

Emitter Cutoff Current

lEBO

VEB = 7V,

IC = 0

SO

VCE = 120V,

IB = 0

Collector Cutoff Current
Collector to Base Breakdown Voltage

'CEO
. - f--'"

__ c-"<"~CBO

Ic

=

SO~A,

IE = 0

~~~)~_BO_

IE

=

SO~A,

IC =0

V(B~)CEO

Ic

"" 1mA,

Emitter to Base Breakdown Voltage
.~

Collector to Emitter Breakdown Voltage
DC Current Gain

hFE1

DC Current Gain
Collector to

Emi~er

hFE2
Saturation Voltage

Base to Emitter Voltage
Gain-Bandwidth Product
Output Capacitance
Rise Time
Storage Time
Fall Time

VCE(sat)

V BE

VCE = 5V,
VCE = SV,
Ic

= SA,

VCE = SV,

RBE ""

V
00

60

Ic = SA

40

200

I B = O.SA

0.9

1.8

V

Ic = SA

1.25

1.7

V

V CE=10V,IC=lA, f = 10MHz

"

V

120

Ic = lA

VCB = 10V, IE =0, f= lMHz

Copyr'ght@ 'Il10 III' FU.mIU U..TED .... ""'IOU - " " ' " 1nc.

V

120

fT

'st.

~A

mA

Cob

t,

~A

I C = 7.SA, RL = 4n
lB. = -IB2 = 0.7SA

30

MHz

60
300
O.lS

470

pF
~s

O.S

~S

0.11

~s

... Pulsed: Pulse Width ~ 30fl1,t.s

Duty Cycle ~ 6%

1-13

2SA1077

,.,.,rm",.,O:,.U,.T,...PUT CAPACITANCE

.c

o
u

veB, Collector Base Voltage (VOLTS)

SWITCHING TIME

VBE, Base Emitte r Voltage (VOLTS)

1-14

Ie. Collector Currant (AMP)

cP

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

2SA1078
Silicon High Speed Power Transistor
DESCRIPTION
The 2SA1078 is a silicon PNP general purpose, medium power transistor fabricated
with Fujitsu's unique Ring Emitter Transistor (RET) technology. RET devices are
constructed with multiple emitters connected through diffused ballast resistors
which provide uniform current density. This structure permits the design of medium
power transistors with exceptional frequency response in high current applications.
The 2SA1078 is especially well·suited for High frequency power amplifiers, Audio
power amplifiers and drivers.
A NPN complement, 2SC2528, is available.
•
•
•
•

..

OUTLINE DIMENSION
JEDEC TO·220

High fr = 140 MHz (typ)
Excellent Safe Operating Area
Improved reverse Second·Breakdown Capability
Excellent Current Gain linearity

ABSOLUTE MAXIMUM RATINGS
Rating

Symbol

Value

Collector to Base Voltage

V CBO

120

V

Emitter to Base Voltage

V EBO

5

V

Collector to Emitter Voltage

VCEO

Unit

120

V

Collector Current

IC

2

A

Collector Power Dissipation ITc "" 25°C)

Pc

25

W

Junction Temperature

Tj

150

T stg

-65-+150

'c
'c

Storage Temperature Range

1: B_ 2: Collector 3: Emitter
Dimension In inches and (millimeters)

ELECTRICAL CHARACTERISTICS (T. = 25°C)
Limits

Parameter

Test Conditions

Symbol

Unit
Min.

Typ.

-

1

"A

-

1

"A

-

100

"A

-

V

Collector Cutoff Current

'eBO

V CB = 120V,

iE =0

Emitter Cutoff Current

lEBO

V EB = 5V,

iC=O

Collector Cutoff Current

'CEO

VCE = 120V,

i'B= 0

-

Collector to Base Breakdown Voltage

V(BR)CBO

IC

= I/lA,

IE = 0

120

Emitter to Base Breakdown Voltage

V(BR)EBO

IE

= I"A,

IC= 0

5

Collector to Emitter Breakdown Voltage

V(BR)CEO

IC == lmA,

R Be =

120

00

Max.

-

V
V

DC Current Gai n

hFEl

VCE= 5V,

IC = 0.3A'

60

. DC Current Gain

hFE2

VCE= 5V,

Ic = 0.7A'

50

18 = O.07A*

_.

0.45

1.0

0.8

1.7

V

-

140

-

MHz

100

-

pF

Collector to Emitter Saturation Voltage

VCE(sat)

Base to Emitter Voltage

VBE

Gain-Bandwidth Product

fT

Output Capacitance

Cob

Copyrlght@II1OIorFI/JIT8UUllllED_FuJ1ou _ _ Inc.

iC

~0.7A,

VCE = 5V,

Ic = 0.7A'

VCE=l OV ,1 C=0.5A,f=10MHz
V CB =20V .iE=O,f=l MHz

350

V

* Pul$ed: Pulse Width :s; 300,u.s
Duty Cycle ~ 6%

1-15

2SA1078
_ ,.• .....,r-<-r-,..--r~OrU...,T_P-rU_T.,-,CHARACTrE...,R"I"S,..T"TICS..",.""""....--,-.,..-'"r"l

t:tj:::t~~~:::tj:::t~:::~~
'l: uHHH-+++±,.o..,;iI:I!I

"1111

~
~:

~

u ...

SII.II

U~ 0.2

E

00

E
~::"·H-+-++H
i
u~

I

l

a

(

6

6

1

'0

VeE. Collector-Emitter Voltage
(VOe TS)

VCS- 10V-

:-

..
,,~t--++++-l
~
~.
'
~

8...
"
so..
t
~::

U.
1
8 '-49

GAIN BANDWIDTH PRODUCT
r-ri~t+Ht--i-i-rh

E

IqoA

-'If:':

0.2

°0

10

20

30

'"

50

60 ' - :

80

-!

100

VeE. Collector-Emitter Voltage
(VOe TS)

m.~m,L~.~*~~.~,--~,,~~~~~,--~~
Ie. Collector Current (AMP)

COLLECTOR SATURATION VOLTAGE

DC CURRENT GAIN

~~Mm~~~~~W~~'±~~~'M~~'~'~~U~~~~~-7~
Ie. Collector Current (AMP)

SAFE OPERATING AREAS

0:-

~ 'H-I,*"~+-I'\,
c

~

u

e
¥

~ o.2rH~--++~Hf~~
u

9

~~.I~,,§~.~l.~_,oo~~_

VeE. Collector-Emitter Voltage

~'.~~~~,.~.~~~~,~,~~~

VSE. Sase-Emitter Voltage (VOLTS)

1-16

(VOeTS)

cP

Janual}' 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

2SA10BO
Silicon High Speed Power Transistor
DESCRIPTION
The 2SA 1080 is • silicon PNP M.C.·Head amplifier use transistor fabricated with
Fujitsu's unique Ring Emitter Transistor (RET) technology. RET devices are
constructed with multiple emitters connected through diffused balast resistors
which provide uniform current density. This structure permits the design of
M.C.-Head amplifier use transistors with exceptional frequency response along with
excellent current gain linearity.

..

OUTLINE DIMENSION
JEDEC TO·220

A NPN complement, 2SC 2530, is available .
• High f T =30MHz (TYP.)
• Excellent Current Gain-Linearity

ABSOLUTE MAXIMUM RATINGS
Symbol

Value

Unit

Collector to Base Voltage

V CBO

40

V

Emitter to Base Voltage

VEBO

7

V

Collector to Emitter Voltage

VCEO

40

V

Collector Current

IC

0.5

A

Collector Power Dissipation (T C = 25" C)

Pc

20

W

+150

"C
"C

Rating

Junction Temperature

Tj

Storage Temperature Range

Tstg

-65-+150

1: Ba.. 2: Collector 3: Emitter
Dimension In inches and (mililmeters), . y

ELECTRICAL CHARACTERISTICS (T.
Limits

Parameter

Test Conditions

Svmbol

Unit
Typ.

Max.

leBo

Vcs =4OV,

IE = 0

-

-

100

nA

lEBO

VEB =7V.

Ic =0

-

100

nA

ICEO

VCE =40V,

Min.

Collector Cutoff Current
Emitter Cutoff Current

IB = 0

-

-

500

nA

Collector to Base Breakdown Voltage

V(BR)CBO

Ie

= 100nA.

IE = 0

40

-

-

V

Emitter to Base Breakdown Voltage

V(BR)EBO

IE = 100nA,

IC =0

7

-

V

40

-

-

100

-

350

-

-

0.025

0.5

V

-

0.65

1.0

V

VCE-10V.lc=10mA.I=10MHz

-

30

-

MHz

VCB=20V,I E-0.1-1MHz

-

65

-

pF

Collector Cutoff Current

Collector to Emitter Breakdown Voltage
DC Current Gain

V(BR)CEO
hFE

Ic=1mA.
VCE

=5V.

RBE

=00

Ic = 10mA

Collector to Emitter Saturation Voltage

VCE(sat)

IC= 10mA,

IB=1mA

Base to Emitter Saturation Voltage

VBE(sat)

Ic = 10mA.

Is= 1mA

Gain-Bandwidth Product

IT

Output Capacitance
Copyrighl@' ... ..,FWITSII UonED _

Cob

fIt1aU _

..... Inc.

·
·
·

-

V

* Pulsed: Pulse Width ::; 300~s
Du,y Cycle if 6%

1-17

2SA1080
DC CURRENT GAIN

GAIN BANDWIDTH PRODUCT

Ie. Collec:tor Current (rnA)

Ie. Collector Current (rnA)

Vea, Collector Base Voltage (Va L TS)

,.-.

~,
. ~

Ie. Collector Current (rnA)

1-18

OJ

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

2SC2428
Silicon High Speed Power Transistor
DESCRIPTION
The 2SC 2428 is a silicon NPN general purpose, high power switching transistor
fabricated with Fujitsu's unique Ring Emitter Transistor (RET) technology. RET
devices are constructed with multiple emitters connected through diffused ballast
resistors which provide uniform current density. This structure permits the design
of high power transistors with exceptional switching characteristics and frequency
response in high current applications.

OUTLINE DIMENSION
JEDEC TQ-3

The 2SC 2428 is especially well·suited for High frequency power amplifiers, Audio
power amplifiers, Switching regulators and DC-DC Converters.
•
•
•
•

I-----t---i-i

High fT = 80 MHz (typ)
Ultra fast switching speed
Excellent Safe Operating Area
Improved Reverse Second-Breakdown Capability

~~==~~

ABSOLUTE MAXIMUM RATINGS
Symbol

Value

Collector to Base Voltage

V eBO

180

V

Emitter to Base Voltage

VEBO

7

V

Collector to Emitter Voltage

V eEO

180

V

Rating

Unit

Collector CUrrent

Ie

12

A

Base Current

IB

3

A

Collector Power Dissipation (Tc

= 25°C)

Pe

120

W

Tj

+175

T sts

-65---+175

°c
°c

Junction Temperature
Storage Temperature Range

ELECTRICAL CHARACTERISTICS

CT. ,. 2S0C)
Limits

Parameter

Test Conditions

Symbol

Unit

Min.
Collector Cutoff Current

leBO

VeB-l80V.

IE -0

Em itter Cutoff Current

lEBO

VEa' 7V.

Ie -0

ICEO

VeE-180V,

la - 0

Collector Cutoff Curre!lt
Collector to Base Breakdown Voltage

V(BR)CBO

Ie

- 5o,.A. "IE =0

Emitter to Base Breakdown Voltage

VlaRIEaO

IE

=lmA,

Collector to Emitter Breakdown Voltage

VIBRleEO

Ie

-lOrnA, RBE =00

Typ.

Max.
50

mA
180

V

180

V

V

Ic- O

DC Current Gain

hFE1-

VeE- 5V.

Ie -0.5A

35

DC Current Gain

hFE2

VeE-5V.

Ie -5A

15

110

200

Collector to Emitter Saturation Voltage

VCE(sat)

Ie

- 5A,

la- 1A

0.3

O.S

Base to Emitter Saturation Voltage

VSE(sat)

IC

- 5A.

la -lA

1.15

1.5

Gain-Bandwidth Product
Rise Time
Storage Time
Fall Time

'T

"

tst9

'f

COPY'lght© 1180 by FWITSU UIlITED one! Fup..u _OOI_onl... Inc.

VeE-l0V.le-1A,I-l0MHz
le- 7 .5A,

RL -4n

lal ~ -l a2 - 0.7SA

p.A
mA

40

V
V
MHz

80

p.s

0.2

1.0

0.6

1.2

p.s

0.15

1.0

p.s

.

Pulsed: Pulse Width S 300SlS
Duty Cycle ~ 2%

1-19

..

DC CURRENT GAIN

GAIN BANDWIDTH PRODUCT

Ie. Collector Currant (AMP)

Ie. Collector Currant (AMP)

o
'ii

"::
~

o
o

c
W

..

z:

SATURATION VOLTAGE
""'l'Z71,"",,",,!l""ITlJ

.

OUTPUT CAPACITANCE

veB. Collector Base Voltage (Ve L TS)
Ie. Collector Currant (AMP)

SAFE OPERATING AREAS
SWITCHING TIME

Ie.

1-20

Collector Current (A~P)

VeE. Collector-Emitter Voltage (VOLTS)

cP

January 1990

FUJITSU

Edition 1.1
PRODUCT PROFILE

2SC2522, 2C2522A, 2C2523
Silicon High Speed Power Transistor
DESCRIPTION
The 2SC252212SC2522A12SC2523 are silicon NPN general purpose, high power
swttchingtransistors fabricated wtth Fujttsu's unique Ring Emitter Transitor (RE1)
technology. RET devices are constructed with muRipIe emitters connected
through diffused ballast resistors which provide unHorm current density. This
structure permits the design of high power transistors with exceptional switching
characteristics and frequency response in high current applications.

..,..

High Ir - 80 MHz (typ)
URra fast switching speed

n

~u
...,.. -

The 2SC252212SC2522A12SC2523 are especially well-suited for high frequency
power amplHiers, audio power amplHiers, switching regulators and DC-DC
converters. PNP complements, 2SA107212SA1072A12SA1073, are available.
•

..

OUTLINE DIMENSION
JEDEC TO-3

,

=

..!

!~

' o.oawn.

Excellent safe operating area
Improved reverse second-breakdown

capability

ABSOLUTE MAXIMUM RATINGS
Ra.lng

Symbol

Valu.
Unit
2SC2S22 ~522A 2SC2523
120
150
160
V
7
7
7
V
120
150
160
V
12
12
12
A

Collector 11> Base Voltage
VCBO
Emitter 11> Base Voltage
VEBO
Collector 11> Emitter Voltage
VCEO
Collector Cumont
Ie
,Collector Power Dissipation (Tc = 25"C) Pc
TI
Junction Temperatura
S1Ilrege Temperature Range
TIIIg

ELECTRICAL CHARACTERISTICS (1.

Parameter

120

+150
-Qi1O+150

1: Emitter 2: Base 3: Colloctor (Casel

W

Dimension in inches and (millimeters)

"C
"C

=25°C)

Symbol

T••• Conalt......

Umlll
2SC252212SC2S22A
2SC2523
IIln.
Typ. lIax. Unit
Typ. Max. IIln.

Collector CU1Ilff Curran.

leBO

VC!I • 120VI160V, IE·O

-

Emil1er Cu1l>ff Cumon.

VEB-7V Ie-O

-

CoKec1Ilr CU1Ilff Curren.

lEBO
ICEO

Collector 10 Base Breakdown Voltage

V(8A)CBO Ic- 50 IlA.IE=O

Emil1er 10 Base Braakdown Voltage

V(8R)EBO IE=50IIA.lc=O

'::o11ec1llr 11> Em,itter Breakdown Voltage

V(8R)CEO Ic= 1 mAo Rae="

DC Cumon. Gain

hFEl

DC Cumon. Gain

hFE2

VCE=5V. Ie = 1 A·
VCE=5V. 1e;,7 A·

Collec1or 10 Emil1er Saturation Voltage

VCE("""

Ic-SA.

Base 10 Emitter Voltage

Vae

Gain-Bandwidth Product
Output Capacitance

fr

VCE=5V. Ic=5 A·
VCE = .10V.1c:' = 1 A, f.l0MHz
Vea .10V.IE .0. f= lMHz

Ri... T"""

Storage Time
Fan lime

Co!!

....

-

.Y

I

120

120

VCE = 120VlI60v. RaE - ..

IB=O.Sr A·

Ic=7.SA. Rt.=4Q
IBI = -l82 • 0:1:5 A

-

120
1sd
-,

- -

-150

IlA

-

-

50

IlA

-

-11

mA

-

160

-

160

-

-

V

7

-

501-

50
1/-

7

-

~
Isd
60

-

200

60

40

-

40

-

-

0.7

1.8

-

0.7

1.25 1.7
80
180 300

-

1.25 1.7
80 ,180 300

50

50

-

-

1.3
0.2

- - -

1.3
0.2

V

200

-

-

1.8

V
V
MHz
pF
lIS'

0,3

0.3

V

-

lIS
lIS

• Pulsed: Pulse width ~ 3OO1iS; Duty Cycle ~ 6%
t For 2SC2522A only

1-21

2SC2522,2SC2522A,2SC2523

COLLECTOR SATURATION VOLTAGE

TRANSFER CHARACTERISTICS

SWITCHING TIME

sc
a
10
20
60
100
IOU 3DCI
VeE. Collector-Emitter Voltage (VOLTS)

0.1

o.s
1.0
1.5
2.0
2.6
VSE, Base Emlttar Voltage (VOLTS)

1-22

3.0

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

2SC2525, 2SC2526

Silicon High Speed Power Transistor
DESCRIPTION
The 2SC 2525/2SC 2526 are silicon NPN general purpose, high power switching
transistors fabricated with Fujitsu's unique Ring Emitter Transistor (RET) tech·
nology. RET devices are constructed with multiple emitters connected through
diffused ballast resistors which provide uniform current density. This structure
permits the design of high power transistors with exceptional switching charac·
teristics and frequency response in high current applications.
The 2SC 2525/2SC 2526 are especially well·suited for High frequency power
amplifiers, Audio power amplifiers, Switching regulators and DC·DC Converters"
PNP complements, 2SA 1075/2SA 1076, are available.

..

OUTLINE DIMENSION

RM-80

• High fT = 80 MHz (typ)
• Ultra fast switching speed
• Excellent Safe Operating Area
• Improved reverse Second·Breakdown Capability

ABSOLUTE MAXIMUM RATINGS
Value
Symbol

Rating

2SC 2525 2SC 2526

Unit

Collector to Base Voltage

VCBO

120

160

V

Emitter to Base Voltage

VEBO

7

7

V

Collector to Emitter Voltage

VCEO

120

160

V

IC

12

12

A

Pc

120

Collector Current
Collector Power Dissipation (TC

= 25°C)

Junction Temperature

Storage Temperature Range

W

120

TJ

+150

Tstg

-65 - +150

°c
°c

ELECTRICAL CHARACTERISTICS (T. = 2S0C)
Limits

Parameter

Symbol

2SC 2525

2SC 2526

Min.

Typ.

Typ.

Max.

-

-

50/-

-

-

-/50

"A

-

50

-

-

50

-

1/-

"A
mA

Test Conditions

Collector Cutoff Current

ICBO

Ves = 120V/160V, IE = 0

Em itter Cutoff Current

lEBO

VEe = 7V,

Collector Cutoff Current

ICEO

VCE = 120V/160V,RBE=OO

Ie =0

Max. Min.

-/1

Collector to Base Breakdown Voltage

V(BRICBO

Ic

=50"A,

IE = 0

120

-

-

160

Emitter to Base Breakdown Voltage

V(BR)EBO

IE

=50"A,

IC = 0

7

-

7

Collector to Emitter Breakdown Voltrage

V(BR)CEO

Ie

= 1mA,

Aae = 00

120

-

-

160

DC Current Gain

hFE1

VCE = 5V,

IC = 1A

DC Current Gain

hFE2

VeE = 5V,

Ic =7A

Collector to Emitter Saturation Voltage

VCE(,atl

IC

=5A,

IB = 0.5A

Base to Emitter Voltage

VBE

Gain-Bandwidth Product

IT

VCE =10V,lc=1A,I=10MHz

Output Capacitance

Cab

VCB = 10V, IE = 0, 1= 1 MHz

Rise Time

Storage Time
Fall Time

VCE = 5V,

Ic = 5A

t,

's,.
t,

IC = 7.5A, RL = 40
IBI = -IB2 = 0.75A

·· ·· -

60
40

50

-

Unit

200

60

-

-

V
V
V

200

-

-

40

0.7

1.8

0.7

1.8

1.25

1.7

-

1.25

1.7

V

80

-

50

80

-

MHz

180

300

-

180

300

pF

-

-

0.3

-

-

-

1.3

-

-

0.2

-

".
".

-

\ 0.3

-

1.3

-

0.2

V

".
"

* Pulsed: Pulse Width .:s:. 300 s
Duty Cycle::;; '6%

1-23

2SC2525,2SK:2526
DC CURRENT GAIN

.

Ie. Collector Current (AMP)

;'"".-

COLLECTOR SATURATION VOLTAGE

u.

~

.to
~

Ii

u ~'~~~-4-4-+~~~~~~-H~

,

~'oo:."
..;

o

~

U

I

2

6

10

20

60

Vea. Collector Base Voltage (VOLTS)

TRANSFER CHARACTERISTICS

SWITCHING TIME
VCC'30V~

II!.! .~ -182 .. Ic;"~!~
~

D.'
1.&

2.0

2.6

veE. Base Emitter Voltage (VOLTS)

1-24

5

10

20

!III

100

zoo

300

VeE, Collector-Emitter Voltage (VOLTS)

OJ

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

2SC2527
Silicon High Speed Power Transistor
DESCRIPTION
The 2SC 2527 is silicon NPN general purpose, high power switching transistors
fabricated with Fujitsu's unique Ring Emitter Transistor (RET) technology. RET
devices are constructed with multiple emitters connected through diffused ballast
resistors which provide uniform current density. This structure permits the design
of high power transistors with exceptional switching characteristics and frequency
response in high current applications.
The 2SC 2527 is especially well-suited for High frequency power amplifiers, Audio
power amplifiers, Switching regulators and DC·DC Converters.
A PNP complement, 2SA 1077 is available.
•
•
•
•

..

OUTLINE DIMENSION
JEDEC TO·22O
0.,413 MAX
(1G.1MAX.1

High fT = 80 MHz (typ)
Ultra fast switching speed
Excellent Safe Operating Area
Improved reverse Second·Breakdown Capability

ABSOLUTE MAXIMUM RATINGS
Rating

Symbol

Value

Collector to Base Voltage

V CBO

120

V

Emitter to Base Voltage

V EBO

7

V

Collector to Emitter Voltage

VCEO

Unit

120

V

Collector Current

IC

10

A

Collector Power Dissipation (TC = 25° C)

Pc

60

Junction Temperature

Tj

ISO

·c

Tort.

-6S-+ISO

·C

Storage Temperature Range

\~;~,~i';~~

W

I: Base 2: Col!..ter:~:~;~~
Dimension In inchetland (mlII~1' '

ELECTRICAL CHARACTERISTICS (T. = 25°C)
limits
Parameter

Symbol

Unit

Test Conditions

= 120V,

Min.

Typ.

Max.

-

50

Collector Cutoff Current

leBo

VCB

Emitter Cutoff Current

lEBO

VEB = 7V,

IC =0

Collector Cutoff Current

ICEO

VCE = 120V,

IB =0

-

IE = 0

Collector to Base Breakdown Voltage

V(BR)CBO

IC

=

5O~A,

IE = 0

120

Emitter to Base Breakdown Voltage

V(BR)EBO

IE

~SIlI'A,

IC =0

7

Collector to Emitter Breakdown Voltage

V(BR)CEO

Ic

= 1mA,

RBE =

DC Current Gain
DC Current Gain
Collector to Emitter Saturation Voltage

hFE1
hFE2

VCE(sat)

Base to Emitter Voltage

V BE

Gain-Bandwidth Product

IT

Output Capacitance
Rise Time
Storage Time
Fall Time

Cob

VCE = SV,

Ic = IA

VCE = SV,

Ic =SA

IC

=5A,

IB = O.SA

VCE

~

Ic =SA

6V,

VCE ~IOV,lc=1 A,I-IOMHz
V CB = 10V,IE =0, I = IMHz

t,

'st.
t,

Copl'iahl© 1110..,. F\I.IIT8U UlllED ond F...... - - l e o , Inc:.

I c = 7.SA, RL

= 40

IB' = -IB2 = 0.7SA

120

00

I'A

SO

I'A

I

mA

-

V
V
V

·

60

··

-

0.7

1.8

1.2S

1.7

V

40

80

-

MHz
pF

·

40

200

V

-

180

300

-

0.3

-

~.

-

1.3

-

1"

-

0.2

-

1"

• Pulsed: Pulse Width ;:i! 30lll's
Duty Cycle ~ 6%

1-25

2SC2527
GAIN BANDWIDTH PRODUCT

DC CURRENT GAIN

II

,f

.,~ t-

VC~ ;;'SV

--

~-

~:-

'°0.1

I i i

VFE = 10V

->
[--

--- I--

II

i

II

I

H, r
II ,I
.,
I

I

, I,
.., , Current
'"
"' Ie. Collector
(AMP)

..II .,

'"

"'

Ie. Collector Current (AMP)

OUTPUT CAPACITANCE

~Ll

.

IE f = 1MHz

OL

~1000

c

.~~

U

C

"

'.J

ilo
">
Ul_
-;: &

.

"

......

1

o.

;

lOO

1"--- t"'-

e, ,

.!!!::
Wo

0>
>

~

o ""

0.1

1>
o
u

~

,
.

O.S

1

leI Collector CUrrent (AMP)

TRANSFER CHARACTERISTICS

,

,

'"

'"

~

Ves. Collector Base Voltage (VOLTS)

:.

SWITCHING TIME

'""

SAFE OPERATING AREAS

~ll

'"

'"

"-

TC~25"C

Sin*
~

Pulse

,~

"la-"t.~·
O

,

{I U,

,~-== t-

~.

I'-

I'

.,

~~

.,
O.S

1.S

2.0

2.5

VeE, Base Emitter Voltage (VOl.. TS)

1-26

1

2

5

10

Ie, Collector Current (AMP)

1"'_

"veE. Collector-Emitter
'"
'"
'"" (VOLTS)
Voltage
00

~

cP

January 1990

FUJITSU

Edition 1.1
PRODUCT PROFILE

2SC2528
Silicon High Speed Power Transistor
DESCRIPTION
The 2SC2528 is a silicon NPN general purpose, medium power transistor fabricated
with Fujitsu's unique Ring Emitter Transistor (RET) technology. RET devices are
constructed with mUltiple emitters connected through diffused ballast resistors
which provide uniform current density. This structure permits the design of medium
power transistors with exceptional frequency response in high current applications.
The 2SC2528 is especially well·suited for High frequency power amplifiers, Audio
power amplifiers and drivers.
A PNP complement, 2SA1078, is available.

D

OUTLINE DIMENSION
JEDEC TO·220
0.413 MAX
110.5MA)(')

• High fT = 160 MHz (typ)
• Excellent Safe Operating Area
• Improved reverse Second·Breakdown Capability
• Excellent Current Gain Linearity

0/10.148

.,."
l~; ~ti'
.~

Iii :';

ABSOLUTE MAXIMUM RATINGS
Rating

10.81

Symbol

Value

Collector to Base Voltage

V CBO

120

V

Emitter to Base Voltage

VESO

5

V

Collector to Emitter Voltage

VCEO

120

V

2

A

....

lUI

....
,• .51

Collector Current

IC

Collector Power Dissipation (Tc "" 25°Ct

Pc

25

W

Junction Temperature

Tj

150

·C

-65-+150

·c

Storage Temperature Range

!~::Ja

123-~
,

Unit

T

st.

1: Base 2: Cotlector 3: Emitter
Dimension in inches and (millimeters)

ELECTRICAL CHARACTERISTICS (T. = 25°C)
Limits

Parameter

Test Conditions

Svmbol

Unit

Min.

Typ.

-

1

~A

-

100

~A

-

-

V

-

V

Collector Cutoff Current

ICSO

VCS= 120V,

IE =0

-

Emitter Cutoff Current

IESO

V ES = 5V,

IC= 0

Collector Cutoff Current

'CEO

VeE!" 120V,

Is=O

-

Collector to Base Breakdown Voltage

V(SR)eSO

Ie

=

l~A,

IE =0

120

Emitter to Base Breakdown Voltage

V(SR)ESO

IE

=

l~A,

le=O

5

Collector to Emitter Breakdown Voltage

V(SR)eEO

Ie

= lmA,

DC Current Gain
DC Current Gain
Collector to Emitter Saturation Voltage

120

00

1

~A

V

350

hFE1

VeE = 5V,

Ic = 0.3A'

60

hFE2

VeE = 5V,

Ie = 0.7A'

50

Ie "'O.07A*

-

0.15

1.0

Ie'" O.7A*

-

0.8

1.7

V

V CE=l OV ,l e =0.5A,I=1 OMHz

-

160

MHz

V es"20V ,I E='O,I=l MHz

-

60

-

VCE(sat)

Base to Emitter Voltage

VBe

Gain-Bandwidth Product

IT

Output Capacitance

RBe '"

Max.

Cob

CopyrIghl@,I8OIIt'FUJll"8UUI8TEDondFuJtou_I....

Ie

=0.7A,

V cE =5V,

-

• Pulsed: Pulse Width

-

~

V

pF

300.us

Duty Cycle ~ 6%

1-27

2SC2528
OUTPUT CHARACTERISTICS

V

!"'10V

2
II

8"H&+......,
··~
••~~••~~.!-:',~+.u~~.!:.~~,--~~
Ie. Collector Current (AMP)

COLLECTOR SATURATION VOLTAGE

DC CURRENT GAIN

.

..

m~rum~~~~=~~.~m~~.~.~~,~~.~,~~~~~+--'
Ie. Collector Current (AMPS)

TRANSFER CHARACTERISTICS

SAFE OPERATING AREAS

-r';.25'"c

Vel-

Sinala

\II....

~'n.

~M

2
il

=a

u

11.2

H-+ffi~++++++Ia-a~

E~~.~~..~~.~~t~~I,.~~_
.m,!:• ..J..:....L..:.I.o..J....,.!-:'.LL.........!.-.!....,,!:.• -'-...L...l
VBE, Base-Emitter Voltage (VOLTS)

1-28

VeE, Collector-Emitter Voltage
(VOLTS)

OJ

January 1990

FUJITSU

Edition 1.1
PRODUCT PROFILE

2SC2530
Silicon High Speed Power Transistor
DESCRIPTION
The 2SC 2530 is a silicon NPN M.C.-Head amplifier use transistor fabricated with
Fujitus's unique Ring Emitter Transistor (RET) technology. RET devices are
constructed with multiple emitters connected through diffused balast resistors
which provide uniform current density. This structure permits the design of
M.C_-Head amplifier use transistors with exceptional frequency response along with
excellent current gain linearity.

..

OUTLINE DIMENSION
JEDEC TO·220

A PNP complement, 2SA 1080, is available .
• High fT=35MHz (TYP.)
• Excellent Current Gain-Linearity

ABSOLUTE MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector to Base Voltage

Vcso

40

V

Emitter to Base Voltage

VESO

7

V

Collector to Emitter Voltage

VCEO

40

V

Collector Current

Ic

0.5

A

Col/ector Power Dissipation (TC =25° C)

Pc

20

W

Tj

+150

"C

Tstg

-65-+150

"C

Junction Temperature

Storage Temperature Range

e...

1:
2: Collector 3: Emitter;
Dimension In Inches and (mlll1~

ELECTRICAL CHARACTERISTICS (T.
Limits

Parameter

Symbol

Unit

Test Conditions
Min.

Typ.

Max.

-

100

nA

-

100

nA

ICEO

VCE = 4OV,

IS =0

-

-

500

nA

Collector to Base Breakdown Voltage

V(SRICSO

Ic'= 100nA,

IE -0

40

-

V

Emitter to Base Breakdown Voltage

VISRIESO

IE = 100nA,

IC =0

7

-

Collector to Emitter Breakdown Voltage

V(SR)CEO

IC= lmA,

ABE

40

-

-

V

hFE

Collector Cutoff Current

IcSO

VCS = 40V,

IE =0

Emitter Cutoff Current

IESO

VES = 7V,

Ic =0

Collector Cutoff Current

DC Current Gain

=00

100

-

350

-

-

0,065

0.5

V

0,6

1.0

V

VCE=10V,I C=10mA, f=10MHz

-

35

-

MHz

VCs=20V, IE =0,f=1MHz

-

25

-

VCE = 5V,

Ic = 10mA

Collector to Emitter Saturation Voltage

VCE(sat)

IC = 10mA,

Is=1mA

Base to Emitter Saturation Voltage

VSE{sat)

IC = 10mA,

Is=1mA

Gain~Bandwidth

Product

Output Capacitance

IT
Cob

c~ '110 brFWITSU UIm!DondFuJtou _ _ 1nc.

··

V

·

* Pulsed: Pulse Width
Duty Cycle

pF
~

300,",5

f 6%

1-29

2SC2530
GAIN BANOWIDTH PRODUCT

u

o
w'
u.

~

"

"

"
'"
Ie. Collector
Current (mA)

Ie. Collector Current (rnA)

COLLECTOR TO EMITTER SATURATION VOLTAGE

10

zo

60

VeB. Collector Base Voltage (VOLTS)

'c. Collector Current (mA)
BASE TO EMITTER SATURATION VOLTAGE

1-30

cP

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

2SC2920, 2SC2429, 2SC2429A, 2SC2964, 2SC2965
Silicon High Speed Power Transistor
DESCRIPTION
This series are silicon NPN planer general purpose, high power switching
transistors fabricated with Fujitsu's unique Ring Emitter Transistor
(RET) technology. RET devices are constructed with multiple emitters
connected through diffused ballast resistors which provide uniform
current density. This structure permits the design of high power
transistors with superior switching characteristics and frequency
response in high current applications.

OUTLINE DIMENSION
JEDEC TO-3

This series are especially well-suit.. d for high speed/high voltage
switching systems or other applications where large SOA is required.

Applications

Features

*
*
*

* Switching regulators
* Motor controls
* Ultrasonic oscillators
* Class C and D amplifiers
* Deflection circuits

High voltage
Ultra-fast switching
Large safe operating area

1: EmiHllr 2: B... 3: Callector (CI")
Dirnensionin inchasand (mllllmaters)

Outline of the Series (Ta = 25°C)
VCEO (V)
Min.

t.tg (ps)
Typ. at 10 A

tf (PS)
Typ. at lOA

2SC2920

400

1.80 '1

0.18 '1

20-50

kHz

2SC2429

400

2SC2429A

450

1.80 '2

0.11 '2

50-100

kHz

2SC2964

400

2SC2965

450

0.84 '2

0.10 '2

Parts Number

*1: IBI = -IB2

= 1 A,

Operating Frequency Range
of Switching Regulator

100-200

kHz

*2: IBI =-IB2=2A

Maximum Ratings (Ta =25°C)
Item

\SymbOI

Storage Temperature

Tstg

Junction Temperature

Tj

Collector-Base Voltage

VCBO

Emitter-Base Voltage

VEBO

Test
Ratings
Condition . 2SC2920 12SC2429I 2SC2429A I 2SC2964 I 2SC2965

450

Icp

Base Current-Continuous

IB

Collector Power
Dissipation

Pc

·C

I

600

V

7.0
400

IC

Collector Current-Pulsed

·C

+175

+175

Collector-Emitter Voltage VCEO
Collector CurrentContinuous

-

-65

Pw~'0mS
D.R.S;, %
Tc = 25·C

I

450

Unit

V

I

400

I

450

V

15

A

20

A

5

A

150

W

Copyrlghl@,I1O..,FUJITSU UIllTED .... FuII'"" _ _ 1nc.

MAY 1982

1-31

2SC2920,2SC2429,2SC2429A,2SC2964,2SC2965

• Test Circuit used for Measurement of Switching Time (Resistive)
-Ie
200Sl

90%

Vee = 150V

C2920
C2429, C2429A, C2964, C2965:

IB1 = -IB2 = le/10
IB1 = -182 = le/5

90%

t,

• Test Circuit used for Measurement of
V CEXISUS) and Reverse Bias Safe Operating Area
L= 200j.lH

t Adjusted to Obtain Ie
Leoil (Ie)

200Sl
IB2
RBB
VBE(off)
~5V

®

1

Vclamp

Vee
~20V

'ld-.

VeEX(SUSI
Ie = 8 A, IB1 = 2 A, IB2 = -1 A, RBB = 5Sl, Vcl amp =450V

®

Reverse 8ias Safe Operating Area
IB1~4A,IB2=-1A, RB B =5Sl

1-32

d::J

January 1990

FUJITSU

Edition 1.1
PRODUCT PROFILE

2SC2920
Silicon High Speed Power Transistor
ABSOLUTE MAXIMUM RATINGS ITa = 25 °Cl
Symbol

2SC2920

Unit

Collector to Emitter Voltage

VCEO

400

V

Collector to Base Voltage

VCBO

450

V

VEBO

7

V

Ic

15

A

Icp

20

A

Rating

Emitter to Base Voltage
Collector Current·Continuous
Collector Current·Pulsed ( :;~R~~02

r;,s)

Base Current-Continuous

IB

5

A

Collector Power Dissipation (TC = 25°C)

Pc

150

W

Junction Temperature

Tj

175

°c

T stg

-65-+175

DC

Storage Temperature Range

..

ELECTRICAL CHARACTERISTICS (Ta = 25 °Cl

Parameters
Collector to Base Breakdown Voltage

Symbols

limits

Test Conditions

VIBR)CBO

Ic = 100llA, IE = 0

Emitter to Base Breakdown Voltage

VIBR)EBO

IE = 1 mA, Ic = 0

Collector to Emitter Sustaining Voltage

VCEOISUS)

Typ.

450

-

-

V

7

-

-

V

-

-

V

-

Collector to Emitter Sustaining Voltage

VCE.XISUS)

400
Ic = 1 A, RSE = ~ n
J*1)
Ic=8A,IB2=-lA, L=2001lH 450

Collector Cutoff Current

Max.

Unit

Min.

V

ICBO

VCB=450V,IE=0

-

-

100

IlA

Emitter Cutoff Current

lEBO

VEB=6V,lc=0

-

-

100

IlA

DC Current Gain

hFE

VCE=2V,lc=10A

Collector to Emitter Saturation Voltage

VCElsatl
Ic = 10 A, IB = 1 A

1*2)

10

13

30

-

0.56

1.0

V

1*2)

-

1.2

1.5

V

-

240

-

PF

-

Base to Emitter Saturation Voltage

VBElsatl

Output Capacitance

c.rn

VCB = 10V, IE = 0, f = 1 MHz

Gain Bandwidth Product

fT

VCE = 10V, Ic -2 A

Rise Time

tr
VCC= 150V

Storage Ti me

tstg

Fall Time

tf

*1 Test Circuit
*2 Pulsed Pw ~ 300 Ils, Duty Ratio ~ 6 %

-

MHz

0.20

0.5

Ils

-

1.80

3.0

j.IS

-

0.18

0.3

j.IS

1*1)
Ic = 10 A, IBI = -IB2= 1 A

30

MARCH 1981

Copyrlght© ,HO .., FUJITSU UMTED .... Fufhou _ _ leo, Inc.

1-33

2SC2920

Switching Time
DC Current Gain

~.

~""l.?S

7S·0C
W
Ii.

.J:

.
...

.5

a

VCE - 2 V

50

.......
.......

Tc-150°C

,.·c

t!)

c
I!?

2SoC

5

2D

10

:!S'C

C

k-

Vec -150V
IBl - IB21el10
Pulsed (50,,5)
Duty Cycle = 1 %

ttls

'" ,

2

25. o C

~

-....

II

(.)

I'

1

0
0.06

0.1

0.2

0.5

2

5

010

20

25'C

.;,

JO .5

Collector Current Ic (A)

75'C
125°C

t,

,

'L'

~'
.....

o.2
Gain Bandwidth Product

"

~ ~ <'
t,

o1

fA

.c.

.........

#' '/

1f>,;;r

r-::: ~c

Tc = 25 DC
VCE = 10V
0

v ...
0.1

I--"

-

0.05

r-..
1\

l--""

2
5
10
Collector Current Ic (A)

2
0.2
0.5
Collector Current Ic (A)

5

20

10

Reverse Bias Safe Operating Area
Tc "" 25°C
20

5

Output Capacitance

LL

Tc - 25 DC
f - 1 MHz

~
D

."

500

'u

200

cJ
19

!

~

...
e:>

c5

1-34

\

~

...'"

t.l

.......

c

1\

.!:!
....c:

.......

9

.¥

r-...

8

100
.. -

50

2
5
10
2D
50
Collector· Base Voltage VCB (V)

100

* 1 Test Circuit _

\
\

10

"

200

o

o

-

L=2oo"H
IB2=-lA RBB2=5r1 _

Ie (pulse) max.

100
200
300
400
500
Coliector·Emitter Voltage Velamp (V)

2SC2920

Switching Time

Vee = 150V
le= lOA
Pulsed (50/lS)

Saturation Voltage

Duty Ratio = 1 %

Te=25°C

5

~w

2

~-1

I......
2

.........

I"-

j

1'---

~

o.5

"iC

150"C

=
-ISiIS·'i

"o
.~ o. H~..::,--25lc

Vc;,Elsa,1

~ o.2

0.05

0.1

0.2

0.5

It?"

"

Is = le/ 10 -

2

10

20

Collector Current Ie (A)

IS2 (A)

Tc=25°C

O. 5

~~0.2

~

~~~:g

~

-2

-

2S'C
2S"C

13

'"

-1

TC2

8,

~''1

-0.5

1

w

..

~

co

>

~
11, '" "-

Collector Saturation Region

""'I'

II

~<

"" ~

O. 1

-0.5

,A

Tc = 25°C

3A

5A

7A

,oA

w w
U

»

co

2

-2

-1
IS2 (A)

Vee

,OA

t, - ISl

Te = 25°C

1

5A

'~~
I"\.\:>~.
""'1/

0.1

1\

,

~
11" '"

o

0.05

V
Vee

r\

\
0.1

t:::

I--~

3A

,A
0.2

I--

7A

t::b:

i--

I0.2

0.5

2

5

Base Current IS (A)
2

0.5
ISl (A)

1-35

2SC2920

Forward Bias Safe Operating Area
Tc = 25°C

20

~

0

Thermal Response
~

<:

"'-

.~ ~

"U
"'0_

0.5

f-

0-0.5

f-

+-b.2

.~



'

~
_

io"""

~

~ ~

1

> ~
" >
.~ .;;0.5
-1

-5

-2
182 (A)

V'Eiull

Tc- 2S"C

-

2S"C

75(C

:; 1!
~ ~
> 0.2

150°C

......:::~
I<"'"
Tc-:.~~

Te

= 25 DC

0.1

0.5

~

V~!oot)

F=,"'C
t--1r5Q °C
0.05

0.1

0.2

0.5

2

10

5

20

Collector Current Ie (A)

0.2

~

I~<

0.1

Collector Saturation Region

~~

Ie

~

""
0.05

J, ~

31A

\

7!

I,~

Tc=25 D C

~

~~

2

w w

-1

-2

-5

U

»

ID

IB2 (A)
tr -IB1

Te =25 D C

0.2

lOA
7A

0.1

~<~
7",

-

,.,~

f--

I\"

5

~~

1'a

2

f-:: ~
--: ~ ~ :;...-

\.!CE

\

4)--.:
..........

0.05

5A

3A
Ie -, A

V,"

0.05

A.'

0.2
0.5
1
Base Current I B (AI

2

5

IB1 (A)

1-39

..

2SC2429,2SC2429A

Forward Bias Safe Operating Area

Ie (pulse)mp:.

20

Thermal Response

TC I ~rlC

I-

~

'\

L~J

'~

5
1>

.E

0-·&

~

c:

,

"

Tc=25°C
Single Pulse

~~J

I"

10

I

1

c rnax .

"-

%I

2

D

I::

---!;.;t'l D t,lt,
t,l-

f-::;;

JLJL

o.1"""

~

u

E
<.>

.!1

0.5

"0

U

2

5

10

20

50

100 200

500 1000

Time or Pulse Width t, (mS)

0.2

~

0.1

1"\

0.05

.

•5
I
5

10

20

50

100

~ I'l
500

200

Collector-Emitter Voltage VeE (V)

Forward Bias Safe Operating Area

20

Tc 75°C Single Pulse

Ie (pl,llselmllX.

1>

5

t:
~

1

~

0.5

U

...c:

U 02

.
!<:

~~

20

50

100 200

U
500

Collector-Emitter Voltage VeE (V)

1-40

~~

"0

!i
10

'c

0<>

t ..

.:e'i r-

750C

~

!>. ,';1'
~
~-F f-

-~r1

Cl

'"l!'
0.05

0.1

0.2

0.5

1

2

10

5

Collector Current Ic (A)

I

L~rt>

o
2

en

~

~
>

~"l

I

J

:l

o

>

t- 25°C
Sri I C

o

.~

............

0.2

-5

-2
IB2 (A)

O.1

TJ" ~25lc

IB = le/5

~jII'

I--::: -:;.~

VCEI ... I

25"C,
75°C

'1"y'

~"

0.5

-

'Y

150 C

c:

.........
-1

~Tc"25aC

O.

!j,

'-...

~<'..,
'<"\.~ l - -

O. 1

--

0.05

0.1

"

::;..-

1--

1A

-,

~

\ '0'

5A

,...~:::::

\

\::

Vc ,

'-

0.2
0.5
Base Current IB (A)

2

5

-5

IB1 (A)

1-43

..

2SC2964, 2SC2965

Forward Bias Safe Operating Area

Thermal Response

Tc = 25°C

]
5

10

20

50

100

200

500 1000

;3

0.2

~:Wmt=t:t=~tfmF~· 1\

Time or Pulse Width t, (mS)

'\

1\

0.111_0
0.05

5

10

20

50

100 200

~J

500

Collector-Emitter Voltage VeE (V)

Forward Bias Safe Operating Area

-

JJlIII
20

Ie (pulse) max.

~Y1 r"!.~
~o;.1

10

Forward Bias Safe Operating Area

Tc = 75°C
Single Pulse

.

1

~

5

,,~rv~~

...
~

o~

2

ft

1

a 0.5
8~ o.

~"f\

\

I'\.

2

o.1

1---3i

0.05

~

"
!IJ !IJ
u

5

10

20

50

100 200

u

500

Collector-Emitter Voltage VeE (V)

1-44

5

10

20

50

100

200

500

Collector-Emitter Voltage VeE (V)

cP

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

2SC3044, 2SC3044A
Silicon High Speed Power Transistor
DESCRIPTION

..

The 2SC3044/2SC3044A are silicon NPN planar general purpose, high power
switching transistors fabricated with Fujitsu's unique Ring Emitter Transistor
(RET) technology. RET devices are constructed with multiple emitters connected
through diffused ballast resistors which provide uniform current density. This
structure permits the design of high power transistors with superior switching
characteristics and frequency response in high current applications.
The 2SC3044/2SC3044A are especially well .. uited for high speed/high voltage
switching systems or other applications where large SOA is required.

Features

*

*
*

OUTLINE DIMENSION
JEDEC TO-3

Applications

*

High voltage
Ultra·fast switching
Large safe operating area

*
*
*
*

Switching regulators
Motor controls
Ultrasonic osicillators
Class C and D amplifiers
Deflection circuits

ABSOLUTE MAXIMUM RATINGS
Rating

Value

Symbol

304413044A

Unit

I 450

Collector to Emitter Voltage

V CEO

Collector to Base Voltage

V CBO

450

V

Emitter to Base Voltage

VEBO

7

V

Ic

6

A

Collector Current-Continuous

400

V

Collector Current-Pulsed pw~ 1Oms. D.R .:5:. 2%

Icp

15

A

Base Current-Continuous

la

4

A

Collector Power Dissipation (T c:z::: 25°C)

Pc

100

W

Junction Temperature

T·

+175

°c

T stg

-65 - +175

°c

Storage Temperature Range

1: Base 2: Emitter 3: Collector

i~r'

Dimension in inches and (millim~~>

ELECTRICAL CHARACTERISTICS (Ta = 25°C)
Parameter

Test Conditions

Symbol

Limits

Unit

Min.

Typ.

Max.

-

V

100

I'A

1

mA

100

IlA

ICBO

VCB • 450V.IE =0

-

Collector Cutoff Current

ICBO

Vca' 400V, IE '0, Tc • 100°C

-

Emitter Cutoff Current

lEBO

VEB • 6V.

Ic'O

-

-

DC Current Gain

hFE

VCE' 5V.

I C '3A

10

15

40

-

la ·0.6A (*2)

0.33

1.0

V

Ic=3A,

1.0

1.5

V

100

-

pF

Collector to Base Breakdown Voltage

V(BR)CaO

Ic=1mA.

IE '0

450

Emitter to Base Breakdown Voltage

V(aR)EaO

IE'" 1mA.

IC '0

7

Collector to Emitter Sustaining Voltage

VCEO(sus)

Ic' OBA,

RBe '" 00.0

4001 450

Collector to Emitter Sustaining Voltage

VCEX{sus~

Ic=2A. la2=-IA, L'2QOI'H (*1)

450

Collector Cutoff Current

Collector to Emitter Saturation Voltage
Base to Emitter Saturation Voltage
Output Capacitance

VCE(sa't)
VBE(sat)
Cob

Gain Bandwidth Product

'T

Rise Time

t,

Storage Ti me

tstg

Fall Time

.Copyrlght@ 1110..,. FVJIT8U UIITED _

t,
F.,... _

(*2)

..... rno.

Vca -10V, IE - 0, I · lMHz
VCE -10V, Ic"' IA
(*1)
Vcc 'l50V
IC = 3A, la1 • -la2 ·0.6A

*1 Test Circuit

-

30

V
V
V

MHz

0.05

0.5

,,{

1.25

1.5

jlS

0.09

0.3

jlS

*2 Pulsed Pw ~ 300 JSS. Duty Ratio ~ 6%

1-45

2SC3044,2SC3044A

SWITCHING TIME

DC CURRENT GAIN
w

u.

~

c:
.iij
Cl

E

a
~

1

o

o

Collector Current Ie (A)

GAIN BANDWIDTH PRODUCT

Collector Current Ie (A)

Collector Current Ie (A)

~

OUTPUT CAPACITANCE

..e,

REVERSE BIAS SAFE OPERATING AREA

~
2
E
~

.c

cJ

"

0

!!
c:

~

..

l!

.!!

c.

8

·u
~

'5

e
"

0

Co.Hector·Base Voltage VeB (V)

1-46

Coliector·Emitter Voltage Vclamp (V)

2SC3044,2SC3044A

SATURATION VOLTAGE

SWITCHING TIME
VCC=lS0V
Ic=3A

IB=IC/S

PW=SOIlS
Duty Ratio = 1%

.,w

>
~C=2S'C

S

_l1li"

t::-

11=
-25 C
2S'C
7S'C
O.S
TC=l50 C

VBE(sa1l

......

.........

w

I

>"

~~IJ
,..~

"0

r--. ~)

1

~

"

o.S

0, 2

2S'C

i5'c
>
"o o. 1

~~C

-1

..

~

f-- r-VCE Isa1l

0.0S
0.02

-{l.S

T =lS0'C_

.~

a"

~
~

r ..

,..

o.OS

0.1

0.2

o.S

I

2

Collector Current IC (AI

IB2IA)

o.S

Tc=2S'C

COLLECTOR SATURATION REGION

~

O.2

o. 1

«H++---+---+-~cW,;lJ

~

=H~~"
-

III

f--

~''''d

.6'"

f-l~

0.0S

II
-{l.S

-1

'B2 (A)

t, -181
TC=2S'C

o. 1

~
.3 0.0S

-~
I-~~

"''"
~

. . II!!

\- -2s'e

w

Te=25'C
5

IB=l e /5

0.5

25'C
7s'e Te-1so'e

>
<- o. 1

"a

V

veE (satl

'0

.~

..

,

w

u

I"-

25'e ,,=::2S'e
75'C
Te -1S0'e

::; 0.0S

~

I
0.02

0.05

1m0.1

0.2

10

0.5

Collector Current Ie (A)
-1).5

-2

Tc=2S

+e~J5JJ

j

«

....

It)

()

2

O. 1

VSE
-1).5

-1

-2

IS2 (A)

-

,

7A~

....

5A
._3A

1

\
-

~

o

0.1

m:J::I+::

\.
0.02

\
0.05

"0.1

:;...:::::: ~

~:;E:

le-0 .5A 1A -

t, - IS1

1.;0'1:::

~ r:::::

~
......

0.2

VeE

1-1-~

0.5

5

Base Current Is (A)

o.05/-H-H+t----+-l
1

IS1 (A)

1-53

2SC3045

FORWARD BIAS SAFE
OPERATING AREA

THERMAL RESPONSE

Time or Pulse Width t, (mS)
10

20

50

100 200

500

Collector-Emitter Voltage VeE (V)

FORWARD BIAS SAFE
OPEARTING AREA

FORWARD BIAS SAFE
OPEARTING AREA
o

I

.'-

10

~~U"

~

1
0,5

~

o

0.0 5

5

10

\

I

11111

20

50

100

200

500

Collector-Emitter Voltage VeE (V)

1-54

'\

0,2
0, 1

ITllr-t

Pulse

~X '<;l1

2

u

Single

'"

5

~

Tc~112 5°~'

~ Ip~I~1 max_ I I

10

20

50

100 200

500

Collector-Emitter Voltage VeE (V)

2SC3045

TEST CIRCUIT USED FOR MEASUREMENT OF SWITCHING TIME (RESISTIVE)

~

---Ie

[(32.

..

'B2

~

2ClOn

~
ABB
90%

vee ";1S0V

90%

VBB";SV

I B, = -IB2 = le/5
'e

'l
t,

0
tstg tf

TEST CIRCUIT USED FOR MEASUREMENT OF
VCEXISUSI AND REVERSE BIAS SAFE OPERATING AREA

t, Adjusted to Obtain Ie
2000

15463 x 6

VBE(aff)

1

Vee
"i 30V

Vcl amp

"iSV

®

VCEX(SUS)

Ie

= 2A,

IB,

= 1A, IB2 = -1A,

RBB

= 5Q, V clamp = 450V

® Reverse Bias Safe Operating Area
I B, :<:;4A, IB2 = -1A, RBB = 5Q

1-55

1-56

cP

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

2SC3046
Silicon High Speed Power Transistor
DESCRIPTION
The 2SC3046 is a silicon NPN planar general purpose, high power switching tran·
sistor fabricated with Fujitsu's unique Ring Emitter Transistor (RET) technology.
RET devices are constructed with multiple emitters connected through diffused
ballast resistors whiCh provide uniform current density. This structure permits the
design of high power transistors with superior switching characteristics and fre·
quency response in high current applications.

D

The 2SC3046 is especially well-suited for high speed/high voltage switching systems
or other applications where large SOA is required.

Features

*
*
*

OUTLINE DIMENSION
JEDEC TO-3

Applications

High voltage
Ultra·fast switching
Large safe operating area

*

Switching regulators

*

Deflection circuits

* Motor controls
* Ultrasonic osicillators
* Class C and 0 amplifiers

ABSOLUTE MAXIMUM RATINGS
Rating

Symbol

Value

Unit
V

Collector to Emitter Voltage

V CEO

450

Collector to Base Voltage

VCBO

600

V

Emitter to Base Voltage

VEBO

7

V

IC

10

A

Icp

20

A

Base Current-Continuous

IB

5

A

Collector Power Dissipation (T c;;; 25°C)

Pc

100

W

+175

°c

Collector Current-Continuous
Collector Current-Pulsed PW~ 10ms, D.R.~2%

T

Junction Temperature

Storage Temperature Range

T stg

-65 - +175

°c

ELECTRICAL CHARACTERISTICS (Ta = 25°C)
ParameteF

Limits

Test Conditions

Symbol

Min.

Typ.

Max.

Unit

V(BRlCBO

IC-lmA,

IE -0

600

-

-

V

V(BRlEBO

IE =lmA,

Ic =0

7

-

V

Ic -0.8A,

RBE =ooSl'

450

-

-

V

Collector to Base Breakdown Voltage

Emitter to Base Breakdown Voltage
Collector to Emitter Sustaining Voltage

VCEO(sus)

Collector to Emitter Sustaining Voltage

VCEX(sus)

Collector Cutoff Current

lCBO

)c = SA, IB2 = -lA, L = 200 I'H (*1)
V CB =500V,IE =0

450

-

-

V

100

lOA

-

-

1

mA)

100

I'A

14

30

V

Collector Cutoff Current

ICBO

VCB = 500V, IE = 0, Tc = 100°C

Emitter Cutoff Current

lEBO

VEB = 6V,

IC =0

DC Current Gain

hFE

VCE = 5V,

Ic =6A

(*2)

10

Ic -SA,

lB = 1.2A (*2)

-

0.43

1.0

1.05

1.5

V

-

230

-

pF
MHz

-

O.os

0.3

lOS

-

1.25

1.5

-

0.07

0.2

Collector to Emitter Saturation Voltage
Base to Emitter Saturation Voltage
Output Capacitance

VBE(sat)

Cob

Gain Bandwidth Product

IT

Rise Time

"

Storage Time

',;g

Fall Time

Copyriaht© .... .., FUJITSU U"lED _

VCE(sat)

"
""'.... _

..... Inc.

VCB"·10V, IE = 0, 1= lMHz
VCE = 10V, Ic=2A
(*1 )

VCC -150V
IC - 6A, IBI

a

-IB2 -1.2A
·1 Test Circuit

28

'"

1"

"2 Pulsed Pw ;a; 300 lAS. Duty Ratio

;a; 6%

1-57

2SC3046

DC CURRENT GAIN
w

u.

.c

"

~

50
20

C

10

Er:fiw:

~~150·C

t-

5

-76"
2

-

5

0.05

0.1

0.2
0.5
2
Collector Current Ic (A)

10

.-

-....: .......

,

-2!fc

1

20

.t:i

VCC' l50V
IB1=-ls2=lcl5
Pulsed (Sal'll)
Outv Cvcle = 1%i

1'C"'1:o>S"C

-~

~5·

~

""t::
U"
U

SWITCHING TIME

v

- :?S·c

tat.

i'

;

....... -!'--

·f

I~

-

'\

.0

:~o

O. 5

~
1J'125·C

O. 2

o. 1

GAIN BANDWIDTH PRODUCT

t;~,
t~
"

~~

~ 7S·C
S'C

TC=25·C
0.05

Vce-1OV

~

I'

V

0.1

f'

",. 1--''''''

t~'

0.2

5
10
20
Collector Current Ic (A)

.......

"

1
2
0.5
Collector Current Ie (A)

~

10

REVERSE BIAS SAFE OPERATING AREA

OUTPUT CAPACITANCE

u:..9:

J
~
l!
'g

500

200

c. 100

a
~

50

o
10
Collector-Base Voltage VCB (V)

1-58

Collector-Emitter Voltage Vclamp (V)

2SC3046

SWITCHING TIME

SATURATION VOLTAGE

VCC=150V
Ic =6A
Pulsed (50"S)

IB=IC/5

Duty Ratio == 1%

2
w

>'"

t--VBE{satl

'I==Tc=-25"e
TC=j5"e

w

u

i'~~-iL
~' ?-i ~
/.

1

>
"'"
2!

g

~=]25.JC

t--75"e
0.5 f---I' I

0.2 f----

t:

a
.~
::I

I--

1-1150~e

~c~-25

~~

VCE{S.')

e

i--::~

25"e

75°C

150"e

O. 1

~
0.05

0.5

0.1

0.2

0.5

2

10

5

20

Coliector Current fe (AI
-1

-2

IB2 (A)

0.5r-r-,-rr-r----,-...,
HH-+++--Tc=2S"e

COLLECTOR SATURATION REGION

0.2H+++f---j---I

f---- j -

~,

f---- j-

.9

11~ j - J ~.

i~

"---1

S! r-- j-+c~2~jJ

..:

2

VaE
0.05HH-+++--I

10
-2

1
1--- Ic=IA

IB2 (A)

3A

5

7

I'

~ VCE

J

"-

~
tr -fBI

0

0.05

0.1

-

~~

F'"

0.2

0.5

5

Base Current 18 (AI

~
.: 0.05H-I-+++--fBI (AI

1-59

2SC3046

FORWARD BIAS SAFE
OPEARTING AREA
Te=25'
20

THERMAL RESPONSE

10

II~a~.

f'.

i,

'\

~O;,.

5

'" ~~

~~"
~:'is>
~

.<

2

l~

1

~

~I~

Single P

.Ie (pulse) max;

.~

. l\

o.5

.!!

;3
Time or Pulse Width t, (mS)

1,\

" 1\.'

O.2

o.1
0.0 5

5

10

20

50

100

200

500

Collector-Emitter Voltage VCE (V)

FORWARD BIAS SAFE
OPEARTING AREA~

FORWARD BIAS SAFE
OPERATING AREA
T e =125'C

--::'-:±-I--H-t+H+--t-Single Pulse

500

Collector-Emitter Voltage VCE (V)

1-60

Collector-Emitter Voltage VCE (V)

2SC3046

TEST CIRCUIT USED FOR MEASUREMENT OF SWITCHING TIME (RESISTIVE)

~

----Ie

[d"

..

IS2

~

2000

I;;RSB
90%

Vee "o'50V

90%

V BB ::;5V

IB' = -IB2 = le/5

Ie

0
t,

t stg tf

TEST CIRCUIT USED FOR MEASUREMENT OF
VCEXlSUSI AND REVERSE BIAS SAFE OPERATING AREA

t, Adjusted to Obtain Ie
2000

,S463 x 6

VSE{off)

1

Vee
=, 20V

V clamp

=,5V

®

VCEX(SUSl

Ie

= 8A,

IBl

= 2A, IB2 = -1A,

RBB

= 5!"!, Vclamp = 450V

® Reverse Bias Safe Operating Area
I B,

:S; 4A, IB2 = -1A, RBB = 5!"!

1-61

1-62

cP

January 1990

FUJITSU

Edition 1.1
PRODUCT PROFILE

2SC3055
Silicon High Speed Power Transistor
DESCRIPTION

..

The 2SC3055 is a silicon NPN planar general purpose. high power switching tran·
sistor fabricated with Fuiitsu's unique Ring Emitter Transistor (RET) technology.
RET devices are constructed with multiple emitters connected through diffused
ballast resistors which provide uniform current density. This structure permits the
design of high power transistors with superior switching characteristics and frequency response in high current applications.
The 2SC3055 is especially well·suited for high speed/high voltage switching systems
or other applications where large SOA is required.

Features

*
*
*

OUTLINE DIMENSION
JEDEC TO-220

Applications

*
*
*
*
*

High voltage
Ultra·fast switching
Large safe operating area

Switching regulators
Motor controls
Ultrasonic oscillators
Class C and 0 amplifiers
Deflection circuits

ABSOLUTE MAXIMUM RATINGS
Symbol

Value

Unit

Collector to Emitter Voltage

VCEO

400

V

Collector to Base, \l?ltage

VCBO

450

V

Emitter to Base Voltage

VEBO

7

V

Rating

Collector Current-Continuous

Ic

2

A

Collector Current-Pulsed Pw:S 10ms, D.R.:S2%

Icp

4

A

Base Current-Continuous

Collector Power Dissipation (T c

= 25°C)

IB

1

A

Pc

15

W

Junction Temperature

Ti

Storage Temperature Range

Tstg

+150

·C

-55 - +150

"C

1: Base 2: Collector
3: Emitter 4: Fin (Collector)
Dimension in inches and (millimeters)

ELECTRICAL CHARACTERISTICS IT. = 25°C)
limits
Parameter

Symbol

Test Conditions

Unit
Min

Collector to Base Breakdown Voltage

VIBRlCBO

IC= lmA,

Emitter to Base Breakdown Voltage

VIBRlEBO

IE =

Collector to Emitter Sustaining Voltage

VCEO(sus)

Ic = 0.5A,

RBe = oon

400

Collecto~

VCEX(sus)

IC = lA, IB2 = -0.2A, L = 200 IiH (*11

450

to Emitter Sustaining Voltage

50~A,

Typ.

Max.

450

IE = 0

V
V

I.c = 0

V
V

Collector Cutoff Current

ICBO

V CB = 400V,IE = 0

10

~A

Collector Cutoff Current

ICBO

VCB = 400V,IE = 0, Tc = 100"C

500

~A

Emitter Cutoff Current

lEBO

V EB = 6V.

Ic = 0

10

~A

VCE = 5V,

Ic = 0.lA/0.5A (*2)

IC =0.5A,

IB =O.lA

DC Current Gain

hFE1/hFE2

Collector to Emitter Saturation Voltage

VCE(sat)

Base to Emitter SaturatiDn Voltage

VBE(sat)

(*21

20/10

35/-

80/-

0.45

1.0

V

1.1

1.2

V

Output Capacitance

Cob

VCB= 10V,IE=O,f=1 MHz

25

pF

Gain Bandwidth Product

fT

VCE = 10V,I c = 0.2A

28

MHz

Rise Time

f,

Storage Time

t stg

Fall Time

If

Copyrlghl@ '110 by FUJITSU U ..1ED -FUJIOU

_ _ lco,lnc.

(*1)
VCC = 150V
IC = 0.5A,IBI = -I B2 = O.lA

*1 Test Circuit

0.06

0.5

2.00

3.0

/.IS

0.09

0.3

/.IS

!'.

*2 Pulsed Pw ~ 300 JJS, Duty Ratio ~ 6%

1-63

2SC3055

DC CURRENT GAIN

SWITCHING TIME

w 1

u.
..c:
t:

'iii
(!l

Collector Current Ie (A)

GAIN BANDWIDTH PRODUCT
~

U

:::J

¥

Collector Current Ie (At

Q.

£~

~~2
~.t"

'"
t:

~

Collector Current Ie (A)

OUTPUT CAPACITANCE

.c 100
0

50

19

3

tJ

.!!!

"0
u

'u

~

~

:::J

t,)

2;

U

..

4

<::

.s
'"c:

~
.9
~

~

u

REVERSE BIAS SAFE OPERATING AREA

20

U

~

:::J

e

10

:::J

0

Collector-Emitter Voltage Vclamp (V)

1-64

2SC3055

SWITCHING TIME

SATURATION VOLTAGE

Vee = 150V
Ie

= 0.5A

~

Pw = 50"S

Tc=26"C

f'.r-.
1

O.

5

]

~!iC-25 C

~

76"C
0.5

>

""

2

VeElsatl

>

t stg -I B 2
5

r-.

~ le=le/5

W

m

Duty Ratio = 1%

~

'r-

~~o"..,

kl~~

-0.5

E

I--Te=1&fC't+H+---+~-+~~~--~~~~++tH~--+--r~

->0

·r

0.2' --t---t-'H-ttttt---+-t--;!;:i-25'
25'cTiLC "'"~~
76"C~iI!!I!

....

VCElsatl

.~ 0'1~fill.~~T~C~=1~5~"~icl~~J~I~til~~~j
~

~

0.002

0.005 0.01

0.02

0.05
0.1
0.2
Collector Current Ic (A)

0.5

2

-2

-1

IB.IA)

O. 2

~

~~

O. 1

I-

~ U"'"0.'''''
0.

f'/

COLLECTOR SATURATION REGION

.......,

0.05
-0.05

Tc=26"C

-0.1

.... CI,..,
-0.2

IB2 IA)

t

0;:

>g'
~.t::

~ a
.~>

E

~

w~

1

~.~

...

tJw
TC = 26"C

~~ 0.05I-H++++"~

=~
0",

um

Base Current I B (A)

0.02'0.05

1-65

..

2SC3055

THERMAL RESPONSE

Time or Pulse Width t, (mS)

FORWARD BIAS SAFE
OPERATING AREA

~

~

E

E

8(;

u

~

§

~

t)

.~

8

.!!!

0

u

Collector-Emitter Voltage VeE (V)

1-66

FORWARD BIAS SAFE
OPERATING AREA

Collector-Emitter Voltage V CE tV)

2SC3055

TEST CIRCUIT USED FOR MEASUREMENT OF SWITCHING TIME (RESISTIVE)

~

--Ie

lft'

..

IB2

~

200n

~

Vas =:= 5V

IB1

= -IB2 = lel5

,i
90%

vee =,150V

Ie

t,

90%

0
t stg tf

TEST CIRCUIT USED FOR MEASUREMENT OF
VCEX(SUS) AND REVERSE BIAS SAFE OPERATING AREA

t, Adjusted to Obtain Ie
200n

Vee
=,20V
VSE(off)

,,5V

®

VCEX(SUS)

Ie

= lA,

IB1 = O.5A, IB2 = -O.2A, RBB = 21m, Vclamp = 450V

® Reverse Bias Safe Operating Area
IB1 S,2A,I B2 =-O.2A, R BS =25Q

1-67

1-68

cP

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

2SC3056, 2SC3056A
Silicon High Speed Power Transistor
DESCRIPTION

..

The 2SC3056/2SC3056A are silicon NPN planar general purpose, high power
switching transistors fabricated with Fujitsu's unique Ring Emitter Transistor
(RET) technology. RET devices are constructed with multiple emitters connected
through diffused ballast resistors which provide uniform current density. This
structure permits the design of high power transistors with superior switching
characteristics and frequency response in high current applications.
The 2SC3056/2SC3056A are especially well-suited for high speed/high voltage
switching systems or other application where large SOA is required.

Features

*
*
*

OUTLINE DIMENSION
JEDEC TO·220

Applications

*

High voltage
Ultra·fast switching
Large safe operating area

*
*
*
*

Switching regulators
Motor controls
Ultrasonic osicillators
Class C and D amplifiers
Deflection circuits

D.413 MAX
J I10.5MA )(.)1

I

10;\0.148

'103.7)

I

ABSOLUTE MAXIMUM RATINGS
Rating

Value

Symbol

Unit

305s1305sA

Collector to Emitter Voltage

V

Collector to Base Voltage

VCOO

450

V

Emitter to Base Voltage

V EBO

7

V

Ic

S

A

Collector Current.continuous
PW~10ms,

Icp

15

A

Base Current-Continuous

10

4

A

Collector Power Dissipation (T C =25° C)

Pc

50

W

Junction Temperature

TJ

+150

"C

T stg

-55 - +150

"C

Collector Current.pulsed

O.R.::::;;:2%

Storage Temperature Range

0....

11.5)

I 450

400

VCEO

0.020
10.5)

1; Base ·2; Collector
3; Emitter 4; Fin (Collector)
Dimension in inches and (milllimeters)

ELECTRICAL CHARACTERISTICS (Ta = 25°C)
Paramet~r

Limits

Symbol

Test Conditions

Min.

Typ.

Max.

Unit

Collector to Base Breakdown Voltage

V(BR)CBO

Ic=lmA,

IE =0

450

-

-

Emitter to Base Breakdown Voltage

V(BRJEBO

'IE =lmA,

Ic=O

7

V

Collector to Emitter Sustaining Voltage

VCEO(sus)

Ic =O.8A,

ROE =

Collector to Emitter Sustaining Voltage

VCEX(sus)

IC = 2A, 102 = -lA, L = 200l'H (*2)

100

I'A

1

mA

100

"A

V

Collector Cutoff Current

leBO

VCO

Collector Cutoff Current

leBO

VCO =400V, IE =0, Tc = l00"C

-

Emitter Cutoff Current

IESO

VEO

-

-

DC Current Gain

hFE

VCE =5V,

10

15

40

0.42

1.0

V

1.0

1.5

V

V co =10V, IE=O, 1=IMHz

-

100

-

pF

VCE = 10V,

-

30

-

MHz

-

0.05

0.5

1"

1.25

1.5

1"

0.09

0.3

1"

Collector to Emitter Saturation Voltage
Base to

Em~tter

Saturation Voltage

Output Capacitance
Gain Bandwidth Product
Rise Time
Storage Time
Fall Time

VCE(sat)

= 450V,
=

SV,

Ic=3A,

IE =

~n

a

Ic=O
I c =3A (*2)
10 = O.SA (*2)

VBE(sat)
Cob

IT

"

t,tg

Ic=IA

(*1)
VCC = 150V
IC =3A, JB1 - -1 02 = O.SA

tf

*1 Test Circuit

4001450
450

*2 Pulsed Pw ~

3OO~s,

V
V

-

Duty Ratio

~

6%

1-69

2SC3056,2SC3056A

DC CURRENT GAIN

SWITCHING TIME
VCC· ,50V
IB1=ls2-I C15
Pw=5011S
DutY Ratio = 1% .

w

u.

5

.s:
c:
.;

7:

I-

r-

Cl
~

c:
~

o

0.05

0.1

0.2

0.5

1

2

5

Collector Current Ie (A)

totg

'"

r-- t::::'"r--- ....

1

en

0.02

~

7~-'"
:2 'c

21-

8u

-iJs. It';:-.

.CJ CJ

/lJl'

.3

.

;:-

i" .,..."

o.5

,."CJ
l

~

.;

\

0.2

o.
GAIN BANDWIDTH PRODUCT

71"0-1. II

1~.
1=

~

0.05

c~26"e
Vc .-10V

I
CJ

V, Ii
,,~'t I
'v

0

0

~

......

10-'10~

,

0.5

10

2

20

Collector Current Ie (A)

~

I'

0

0.1

0.2

0.5

1

2

5

Collector Current Ie (A)

REVERSE BIAS SAFE OPERATING AREA
20

ii:'

OUTPUT CAPACITANCE

I-Ic (PuL) max.

~
~ 10
u"

cJ
11c:

1 .' . s,;.

i--

~

0

li}~~.~

1)

..

j!!

~

'u

tt-:

;3

Co

u

e"
"

0

o

Coliector·Base Voltage VeB (V)

,,";'\i''''

100

" ..

'~~,:

'

~." ~~.
"'2

~

rt&:±, ~'.,

~

1-70

.,

c:

<>

R&B=W-

I

.2
~

..90

T c=2S-126'C
L=200uHIB2--1A

;::'" ~

.

hi··

.,

200

300

'.~ [,;"1.".;,
400

500

Collector-Emitter Voltage Vdamp (V)

,,,,,?,:,

2SC3056,2SC3056A

SATURATION VOLTAGE

SWITCHING TIME
VCC=150V

le=lc/S

IC=5A

2

Pw=50~S

= 1%

Duty Ratio

w

tstg-IB2

T -25'C

5
~

...........

I""'-

:;.'"

>'"

T

~

>

~

~~~~ r---

......
1

t

(5

>

"o

"""III

' _ _25' C
25'C
"S'
0.5
I-- C· ,25'C

2

O.

I

V

...

~

~

25'C
75°C
0 .1t=:
!=="c·,25'C

..

,•

VeE Isat

/

VCE satl

.~

~
c?l

0.05

0.5

0.05

0.02
-0.5

0.1

5

2

0.5

0.2

Collector Current Ic (A)

-1

le2 (I',I

Tc =2S·C

O.5

COLLECTOR SATURATION REGION
~

0.2

O. 1

,~ n;r -,j-

1

«
It!

~

~ ''f.~ f= --;~1~'6'~ ,---

'i'

'"

u

~

0.05

I

-0.5

Vee

-1

le2 (AI

A·
1

2A-

t, - 181

~. =a.5A
=25'C

:-/~

.3

..: 0.05

I~'«
0.02

II

0.5
IBI (A)

\.

o
I----

0.02

i~

\~

0.05

0.1

0.2

-

-'"

~
~

"

~

VCE

....
....

i'

I'

:.

'--'r.-~
~f-'C1~

~

lA

~

L' .

O. 1
(i)

~}J5!J

«

M

~

0.5

2

5

Base Current 18 (A)

"

1-71

2SC3056,2SC3056A

THERMAL RESPONSE

0.1 _ _
0.5

~~

5
10 20
50 100 200
Time or Pulse Width t1 (mS)

500

FORWARD BIAS SAFE
OPERATING AREA

FORWARD BIAS SAFE
OPERATING AREA

0.02!H-H-+t+if----+--++++++-I+--I-HlH+lH+
5

Collector-Emitter Voltage VCE (V)

1-72

10 20
50 100 200
500
Collector-Emitter Voltage VCE (V)

2SC3056,2SC3056A

TEST CIRCUIT USED FOR MEASUREMENT OF SWITCHING TIME (RESISTIVE)

~

--Ie

If±"
IB2

~

200n

-r;;-

T.U.T.

RBB
90%

Ve e,,'50V

90%

VBS=::5V

IB1 = -IB2 = le/5

Ie

'l
t,

0
t stg tf

TEST CIRCUIT USED FOR MEASUREMENT OF
VCEXlSUS) AND REVERSE BIAS SAFE OPERATING AREA

t, Adjusted to Obtain Ie
200n

I

VBE(off)

Vee
,,30V
Vcl amp

";5V

o

VCEX(SUS)

Ic

= 2A,

IB1

= lA,

IB2

= -lA,

RBB

= 5Q, VcI,mp = 450V

® Reverse Bias Safe Operating Area
IB1 :": 4A, IB2 = -lA, RBB = 5Q

1-73

1-74

cO

Janual)' 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

2SC3057
Silicon High Speed Power Transistor
DESCRIPTION

..

The 2SC3057 is a silicon NPN planar general purpose, high power switching tran·
sistor fabricated with Fujitsu's unique Ring Emitter Transistor (RET) technology.
RET devices are constructed with multiple emitters connected through diffused
ballast resistors which provide uniform current density. This structure permits the
design of high power transistors with superior switching characteristics and fre·
quency response in high current applications.
The 2SC3057 is especially well .. uited for high speed/high voltage switching systems
or other appl ications where large SOA is required.

*
*
*

OUTLINE DIMENSION
,
JEDEC TO·220

Applications

Features

* Switching regulators
* Motor controls
* Ultrasonic osicillators
* Class C and D amplifiers
* Deflection circuits

High voltage
Ultra-fast switching
Large safe operating area

0.413 MAX

1",.5 MAX'>
(10.148
t~.71

ABSOLUTE MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector to Emitter Voltage

V CEO

400

V

Collector to Base Voltage

VCSO

450

V

Emitter to Base Voltage

VESO

7

V

10

A

Collector Current-Continuous

Collector Current-Pulsed

PW~10ms,

IC

D.R.$2%

ICp

IS

A

5

A

Base Current-Continuous

Is

Collector Power Dissipation (T C "" 25° C)

Pc

50

W

Junction Temperature

TJ

+150

°c

Storage Tempetature Range

T stg

ELECTRICAL CHARACTERISTICS

-65 - +150

0.020

".,

1: Base 2: Collector
3: Emitter 4: Fin (Collector)

°c

'Dimension in

i~hes

and (millimeters)

IT. = 25°C}
Limits

Parameter

Symbol

Test Conditions

Unit

Typ.

Max.

Collector to Base Breakdown Voltage

V(SR)CSO

Ic""lmA,

IE = 0

450

-

-

V

Emitter to Base Breakdown Voltage

V(SR)ESO

'E =lmA.

Ic -0

7

-

-

V

RSE = ~a

400

-

-

V

450

-

-

V

-

-

100

/LA

I

mA

-

100

"A

16

40

V

Collector to Emitter Sustaining Voltage

VCEO(sus)

Ic -O.SA.

,Collector to Emitter Sustaining Voltage

VCEX(sus)

IC

Collector Cutoff Current

ICBO

z

2A, IS2 = -lA, L = 200 /LH (*1)

VCS = 450V, IE =0

Min.

Collector Cutoff Current

ICBO

VCS=4ooV. IE =0, TC= 100°C

Emitter Cutoff Current

lEBO

VES =6V,

Ic =0

DC Current Gain

hFE

VCE=5V.

IC =5A

(*21

10

-

1.0

Is =IA

(*2)

0.46

Ic=5A.

-

1.2

1.5

V

100

-

pF

0.09

0.5

-

1.90

2.5

0.14

0.3

Collector to

Emitte~

Saturation Voltage

Base to Emitter Saturation Voltage
Output Capacitance

VCE(sat)
VBE(sat)
Cob

Gain Bandwidth Product

IT

Rise Time

I,

Storage Time
Fall Time

t stg

VCS = 10V, Ie = 0, I -IMHz
VeE = 10V.lc = fA
(*1)

Vcc -150V
IC = SA, lSI - -IB2= IA

If

copyrlghl© 'lID.., FWITIIU UIiTEDMd FuJtou _ _ ..... !no.

'1-1 Test Circuit

-

32

MHz

...
...
...

'1-2 Pulsed Pw ~ 300 #,5, Dutv Ratio ~ 6%

1-75

2SC3057

w 100
u.

.I:

c:

~

DC CURRENT GAIN

ru:

SWITCHING TIME

{,~~~6V
10

t---T C':t
25

1::

0

E

8u

~

lUl,50V

I-"::~

Pw=50jlS

Duty Ratio

= 1%

'stg

~ ~ 1'0..:

~

0

c

5

r" f:::1'
,

2

Vi

0.02

0.05

0.1

0.2
0.5
2
Collector Current Ie (A)

5

5

10

1

~

o"i"

!! 'l<>Jz,,"
ry

~'"

II

/o.,CJ

.; o.5
;(;V I~

0.2

0

~,'I)

.~~
.!

o.1

TC*25°e
Vce=10V

-

~;

.;yrPJv

-

11'"

",
I

~-

0.05

1,,\

~~

!'\.
,

,

GAIN BANDWIDTH PRODUCT

0

I

lSI =I S2 =l c /5

1= ~ {,~5
7,~
5
.......

50

e
..a e

I II
7"6 ...

0.5

~

10
2
5
Collector Current I c (A)

20

.>,<

0.1

02

O.
2
Collector Current Ie (A)

5

REVERSE BIAS SAFE OPERATING AREA
20

OUTPUT CAPACITANCE

ii:
S

~

c:

~::>

cJ

..

'u

c.

10

U

(;

100

1:)

fl

.!!!

8

50

l'l
::>

..........

"\-,,

20
10

20

50

100

Collector-Base Voltage VCB (V)

1-76

200

\
'\
\

"

~

e
0"

IPL..) max.

\

2

.c 200

8c:

-Ie

~

TC-25-125°C'
L=2QO"HIS2=-IA ----,RSB=50

o

T

300,
500
100
200
400
Collector-Emitter Voltage V clamp (V)

2SC3057

SWITCHING TIME

SATURATION VOLTAGE
la=lc/S

W

III

>

TC=2Sb C
S

"

w

VaElsatl

>
<':!- -

~1~

1

..

~

0.2

13

o

:;; o. 1
o

'fii
~

~

..

l.4!

u

~

2

!

1=1-

\--2S'C
2S'C'
7S'C
0.5
t---fT c-1SO'C

l.L

V

JC2)C

2S'C

_~TC-1S0C

VCElsati

0,0 S

I

~

0.02

1

O.OS

0.1

L U
o.S

0.2

10

Collector Current Ic (A)
-O.S

-1

-2

la21AI

tf -

IS2
TC=2S'C

COLLECTOR SATURATION REGION

o. S

r---l'"

~~

t-rt

2

II

J.

I~

I

..,l ~~

~d!

1\

" O. 5

"

U

U

Su

Su

.l!!

"0

u

.l!!

"0

u

O.2
O. 1

\

0.05
0.02
10

Collector-Emitter Voltage VCE (V)

1-78

20

50

100 200

500

Collector-Emitter Voltage VCE (V)

2SC3057

TEST CIRCUIT USED FOR MEASUREMENT OF SWITCHING TIME (RESISTIVE)

~

--'e

lit"

..

'e2

~

200n

-----,;;Ree

,i
90%

Vee ';1S0V
VBB~5V

Ie, = -le2 = le/5
'e

t,

90%

0
tstg tf

TEST CIRCUIT USED FOR MEASUREMENT OF
VCEX(SUS) AND REVERSE BIAS SAFE OPERATING AREA

t, Adjusted to Obtain Ie
200n

15463 x 6

VSE{Off)

1

Vee
';30V

Vclamp

=,SV

o

VCEX(SUSI

Ie = 2A,IB' = IA,I e2 =-IA, Ree =5n, Vclamp = 450V

® Reverse Bias Safe Operating Area
le1 :::; 4A, le2 = -lA, Ree =

sn

1-79

1-80

cP

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

2SC3058
Silicon High Speed Power Transistor
DESCRIPTION
The 2SC3058 is a silicon NPN planar general purpose, high power switching tran·
sistor fabricated with Fujitsu's unique Ring Emitter Transistor (RET) technology.
RET devices are constructed with multiple emitters connected through diffused
ballast resistors which provide uniform current density. This structure permits the
design of high power transistors with superior switching characteristics and fre·
quency response in high current applications.
The 2SC3058 is especially well-suited for high speed/high voltage switching systems
or other applications where large SOA is required.

Features

*
*
*

OUTLINE DIMENSION
JEDEC TO-3

Applications

* Switching regulators
* Motor controls
Ultrasonic osicillators
* Class C and D amplifiers

High voltage
Ultra·fast switching
Large safe operating area

*
*

Deflection circuits

ABSOLUTE MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector to Emitter Voltage

V CEO

400

V

Collector to Base Voltage

V CBO

600

V

Emitter to Base Voltage

VEBO

7

V

Collector Current-Continuous

Ie

30

A

Collector Current-Pulsed PwS,1Oms. O.R.~2%

lep

50

A

Base Current-Continuous

IB

10

A

Collector Power Dissipation (T c

=2SoC)

Pe

Junction Temperature

T·
T stg

Storage Temperature Range

200

W

+175

"C

-65 - +175

"C

a...

I:
2: Emitter 3: Collector (<::ase)
Dimension iil inch~ and tmHlllmett;rs)

ELECTRICAL CHARACTERISTICS (Ta = 25°C)
Parameter

Limits

Symbol

Test Conditions

Unit

Min.

Typ.

Max.

-

-

V

-

-~

Collector to Base Breakdown Voltage

V(BR)eBO

tc=lmA.

Ie =0

600

Emitter to Base Breakdown Voltage

VIBR)eBO

IE =lmA,

le=O

7

Collector to Emitter Sustaining Voltage

VCEO(sus)

Ie =O.BA,

RBe = 000

400

-

Collector to Emitter Sustaining Voltage

VeEX(sus)

Ie = lOA, IB2 = -2A, L = 200 pH (*11

450

-

-

100

pA

-

-

2

mA

100

"A

10

14

40

-

0.55

1.0

V

1.25

1.5

V

420

-

pF

-

MHz

Collector Cutoff Currerit

leBO

VeB = 5OOV, Ie = 0

Collector Cutoff Current

leBO

VeB~5OOV, le=O, Te=loo'C

Emitter Cutoff Current

lEBO

VEB =6A,

le=O

DC Current Gain

hFE

Vee m5V,

Ic = 20A

Collector to Emitter Saturation Voltage

VCE(S8t)

Base to Emitter Saturation Voltage

VBE(sai)

Output Capacitance

Gain Bandwidth Product
AiseTime

Storage Time
Fall Time

Cob
IT

"

t stg

"

Ie = 2OA,

IB=4A

(*21
(*21

VCB = 10V, IE=O,I=IMHz
Vee = 10V,
Vee = 150V
Ie

=2OA,

le=4A
!*II

IBI = -IB2 = 4A

·1 Test Circuit

-

30

V

Ii

0.17

0.5

p.

2.10

3.0

ps

0.10

0.3

p.

*2 Pulsed Pw ~ 300 ps, Duty Ratio ~ 6%

1-81

2SC3058

DC CURRENT GAIN

SWITCHING TIME

w

U.
.t=

c:

""to

(!l

a"
u

c

Collector Current Ie (A)

GAIN BANDWIDTH PRODUCT

Collector Current Ie (A)

1

REVERSE BIAS SAFE OPERATING AREA

Collector Current Ie (A)

~
OUTPUT CAPACITANCE

u:-

oS

.!:?
to
~
::l

U

c;

.D

cJ

to
"0
u
.!!

!!

!

.

"u

Co

a....
e
0"
::l

Collector-Base Voltage VeB (V)

1-82

Collector-Emitter Voltage Vclamp (V)

2SC3058

SATURATION VOLTAGE

SWITCHING TIME

II

VCC=I50V
IC=2OA

Vi

PW=50"S

>"'

!

I jc-26"C

N

r~

w

Duty Ratio'" 1 %

Rtf--

"~1;--t--

'"

1

w

u

1

0.5

.

>
'"
fl

o

>

"o
.~

I(~t

L.......- ~

-25'C

2 C
75
c .I60 C

Yf

0.2

~~

26 C -2S'C
75'C

i3

..

~

Vce!..t

o. 1

1~-lc/6

17

~r.

Tc ·I50'C

c?l
0.1

0.2

0.5

1

10

20

Collector Current Ie (AI
0.5

-2

-5

0.5

j

0.2

S
O. 1

+c·ks"e

~~ ~

COLLECTOR SATURATION REGION

~'~

-2

-5
IS21AI

t, -lSI

0.51-+--1-+++-1

Base Current 18 (AI

181 (AI

1-83

2SC3058

FORWARD BIAS SAFE
OPERATING AREA

THERMAL RESPONSE

Time or Pulse Width t, (mS)

FORWARD BIAS SAFE
OPERATING AREA

~

~

.!:?

.!:?

1:

~

~"
u"

e

:;

u

B
<.>

~

.!!!

.!!!

8

"0
u

Collector-Emitter Voltage VCE (V)

1-84

FORWARD BIAS SAFE
OPERATING AREA

Collector-Emitter Voltage VCE (V)

2SC3058

TEST CIRCUIT USED FOR MEASUREMENT OF SWITCHING TIME (RESISTIVE)

~

~Ie

lff"

..

'B2

~

200n

I-;;RBB

IB1 ~ -IB2 ~ le/5

,!
90%

Vee '0 150V

VBB~ 5V

Ie

t,

90%

t 5t9 !f

TEST CIRCUIT USED FOR MEASUREMENT OF
VCEXISUS) AND REVERSE BIAS SAFE OPERATING AREA

t, Adjusted to Obtain Ie
200n

VSE(off)

I

Vee
"" 50V
Vclamp

",,5V

o

VCEX(SUS)

Ie ~ lOA, IB1 ~ 4A, IB2 ~ -2A, RBB ~ 2.5Q, VCI'mp~ 450V

® Reverse Bias Safe Operating Area
IB1

<; 8A,

IB2~ -2A, RBB ~

2.5Q

1-85

1-86

cP

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

2SC3058A
Silicon High Speed Power Transistor
DESCRIPTION

..

The 2SC3058A is a silicon NPN planar general purpose, high power switching tran*

sistor fabricated with Fujitsu·s unique Ring Emitter Transistor (RET) technology.
RET devices are constructed with multiple emitters connected through diffused
ballast resistors which provide uniform current density. This structure permits the
design of high power transistors with superior switching characteristics and fre*
quency response in high current applications.
The 2SC3058A is especially well·suited for high speed/high voltage switching
systems or other applications where large SOA is required.

Features

*
*

*

OUTLINE DIMENSION
JEDEC TO-3

Applications

*
*
*

High voltage
Ultra·fast switching
Large safe operating area

*
*

Switching regulators
Motor controls
Ultrasonic osicillators
Class C and D amplifiers
Deflection circuits

ABSOLUTE MAXIMUM RATINGS
Symbol

Rating

Unit

Value

Collector to Emitter Voltage

V CEO

450

V

Collector to Base Voltage

V CBO

600

V

Emitter to Base Voltage

V EBO

Collector Current-Continuous
Collector

Current~ulsed

P w :$.10ms, D.R.:$.2%

Base Current-Continuous
Collector Power Dissipation (T c

"" 2S0C)

Junction Temperature

7

V

Ic

30

A

Icp

50

A

IB

10

A

Pc

200

W

+175

'c
'c

TJ

Storage Temperature Range

T stg

-65 - +175

2: Emitter 3: Collector (Case)
Dimension in inches and (millimeters)

1: Base

ELECTRICAL CHARACTERISTICS (Ta = 25°C)
Parameter

Symbol

limits

Test Conditions
Min.

Collector to Base Breakdown Voltage

V(BR1CBO

Ie"" lmA,

IE"" 0

Emitter to Base Breakdown Voltage

V(BR)EBO

IE

Ie"" 0

Collector to Emitter Sustaining Voltage

VCEO(sus)

Ic "" O.SA,

RBE ""~.n

450

Collector to Emitter Sustaining Voltage

VCEX(sus)

Ie"" lOA, IS2

= -2A,

450

Collector Cutoff Current

ICBO

=

lmA,

Typ.

Unit
Max.
V

600

V

L"" 200 JlH (*1)

V
V

VeB = 500V. IE =0

100

!,A

100

!,A

Collector Cutoff Current

mA

Emitter Cutoff Current
DC Current Gain

hFE

Collector to Emitter Saturation Voltage

VCE(sat)

Base to Emitter Saturation Voltage

VBE(sat)

V CE =5V.
IC~

20A.

Ic=20A
IS =4A

1*2)

12

40

0.7

1.0

1.25

1.5

(*2)

Output Capacitance
Gain Bandwidth Product

30

VCE "" 10V, Ic =4A

----------------lI--~~--4

tf

(*1)

le=20A. I s ,=-l s2 =4A

*1 Test Circuit

V
V

pF

420

Rise Time
tr
--s'-o-'a-g-.-T7im-.-----------lI---,..:.,,-g--1 Vee = 150V
Fall Time

10

MHz

0.20

0.5

!"

1.70

2.0

!"

0.10

0.3

!"

*2 Pulsed P w

~

300 JlS. Duty Ratio

~

6%

copyrlaht@ 1880 by FUJITSU UMTED Mel FuJI"" IIIcrCMtlactronlc., Inc.

1-87

2SC3058A

DC CURRENT GAIN

SWITCHING TIME

W

LL

.r::

c:
"iii

50

C1
~

c:
~

20

3

u
U

10

0

Collector CUrrent Ie (A)

GAIN BANDWIDTH PRODUCT

REVERSE BIAS SAFE OPERA,TING AREA
Collector Current Ie (A)

OUTPUT CAPACITANCE

2
~

c:

LL

~

..e,

"

U

.D

~

cJ

l3u

1.lc:

.!!

;3

:s

..

"u

C-

U

~

eo"

"

0

Collector-Base Voltage VeB (V)

1-88

Collector-Emitter Voltage Vclamp (V)

2SC3058A

SWITCHING TIME

SATURATION VOLTAGE

VCC ·,S0V

I

IC·20A

v~Eisa\1

PW·SOIlS

i

S

I-

w

Duty Ratio =1 %

>"'

C• 2S'C

I

-2S'C
2S'C
7S'C
O.S
Tc·,50'C I-

~

2

'

....... ....
......

~

"

1

0.2

c:

2

~

C~

~

-25"C

75"C

O. 1

';:;

~

..

"

~1iI'

>
o

~

VCE satl

>

1J,

~~
~9,"<;o.,..q

18 al CJS

~ ~I'

TC·,50'C

~"

0.1

O.S

0.2

10

S

20

Collector Current Ie IA)
O.S

-2

-S

tf -

IB2

iC·~S,IC

O.S

_

COLLECTOR SATURATION REGION

0.2

3
O. 11--

~~ ~
h"..,
-~

I-- I-- -

~~

J

It
.9

11--, < hl-J
N

on

M

J::

....

t~l~5"e_

<- < -

!'l

~

w w 2

»u"'
-2

-S

t

0"

182 (A)

V 8E

>g'

~-5

20A

:t:>

,H

t, -IBI

1

~.~

C·25'C

Ic·'A

bW

2A

~~
0

..

UIIl

O. S

'-

~

O.2

O. 1

2

o

~~'.?

K~'6'"'1/.

0.05

"

0.1

I'
0.2

A

A7

,

A

~
A

O.S

2

~
VCE

5

10

Base Current IB (A)

1
S

IBI (A)

1-89

2SC3058A

FORWARD BIAS SAFE
OPERATING AREA
50 -Ie (pulse max.

THERMAL RESPONSE

I

g

1.0

l!

o. 5 -

.~ ~

O:u
(V L.
E -'"

Te-2s'>C

0() •

O.".!,
0.1

O. 2

',f-j

goD
~ a: o. ,51

I--

0.0

5~ ~~

~
S!

. :--

F--'

---

0.5

~

I.

.-

2

1:

=', It,

Bm.m\II

~
.!!

_.10

"t::

::>
U

0.51

;3
20

50

100 200

"\

0.21-.H++t++--+-t--t+ttttt-----''t-i\-Ntt+ttti

500

Time or Pulse Width tl (";5)

~
O"B~mI

0.05

U

10

5

20

50

100 200

500

Coliector·Emitter Voltage VeE (V)

FORWARD BIAS SAFE
OPERATING AREA
50

Ie (PU'I~~ max

"

I:

8

5 Ie (pulse) max.

20

~~'t::

\

1

U

~

9

"

5

.!!

"0
u

;3
0.2

5

.9

\

2

a" o.

.!!

"' I"

1'\

10

f

Te=75"~E

Single Pulse

20

~

FORWARD BIAS SAFE
OPEARTING AREA

2

1\1\

O
.
O.O.
1

5

2

<

o.1

1

i

0.0 5

0.0 5

u

III

5

10

20

50

100 200

500

Coliector·Emitter Voltage VeE (V)

1-90

5

10

20

50

100 200

500

Coliector·Emitter Voltage VeE (V)

2SC3058A

TEST CIRCUIT USED FOR MEASUREMENT OF SWITCHING TIME (RESISTIVE)

~

----Ie

ld"

..

IB2

~

200n

I;;RSB
V BB ==;5V

IB1 = -IB2 = le/5

,1
90%

Vee ";IS0V

Ie

t,

90%

10%

0

tstg t f

TEST CIRCUIT USED FOR MEASUREMENT OF
VCEX(SUSI AND REVERSE BIAS SAFE OPERATING AREA

t, Adjusted to Obtain Ie

200n

I

VSE(off)

Vee
V clamp

" sov

"SV

o

';r,
l6=j-L

f

VCEXISUS)

Ie = IDA, 181 = 4A, IB2 = -2A, R88 = 2.517., V,'amp= 450V

® Reverse Bias Safe Operating Area
181

:s:; 8A,

182 =-2A, R88

= 2.517.

1-91

1-92

00

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

2SC3178, 2SC3059, 2SC3060, 2SC3061
Silicon High Speed Power Transistor
DESCRIPTION

..

This series are silicon NPN planer general purpose, high power switching transistors fabricated with Fujitsu's
unique Ring Emitter Transistor (RET) technology. RET devices are constructed with multiple emitters
connected through ballast resistors which provide uniform current density. This structure permits the design
of high power transistors with superior switching characteristics and frequency response in high current
applications.
This series are especially well·suited for" high speed/high voltage switching systems or other applications
where large SOA is required.

Features

Applications

• High voltage
• Ultra·fast switching
• Large safe operating area

•
•
•
•
•

Switching regulators
Motor controls
Ultrasonic oscillators
Class C and D amplifiers
Deflection circuits

Outline of the Series
Item

Symbol

2SC317812SC3059

2SC3060

2SC3061

Unit

Collector to Base Breakdown Voltage

VeBo

1200

V

Collector to Emitter Breakdown Voltage

VeEo

850

V

Emitter to Base Breakdown Voltage

V EBO

Collector Current (continuous)

Ie

Collector Current (pulsed)

lep

Collector Power Dissipation
@

900V

I

100

2.5

RBSOA

V
5

4

60

Pc

Reverse Bias Safe Operating Area

7
2

10

A

8

20

A

150

200

W

5

7

A

Rise Time

(Typ.)

tr

0.20

Il S

Storage Time

(Typ.)

t S'9

2.50

IlS

Fall Time

(Typ.)

IlS

V

tl

0.07

Collector to Emitter Saturation Voltage (Typ.)

VCE(sat)

0.3

Base to Emitter Saturation Voltage (Typ.)

VSE(sat)

-

Package
copyrighl© , ... ~ FUJ1T8U U..1ED ond

V

1.0
TO·220

I

TO·3

-

Fu,'" _ _... ,....

1-93

2SC3178,2SC3059,2SC3060,2SC3061

OUTLINE DIMENSION

2SC3059
2SC3060
2SC3061

2SC3178

.001l..:1N(' I)JMtNslQk' .
J~I)EC

TO·22G··
'-,"

1-94

'

.

QIJTLINE .DIIIiIENSIOIIr>
JEOECT(»'

2SC3178, 2SC3059, 2SC3060, 2SC3061

TEST CIRCUIT USED FOR MEASUREMENT OF SWITCHING TIME (RESISTIVE)

lifo

~

--Ie

'.2

~

200n

----r;;-

D

R ••

VB.

'B'--1.2/3 -

90%

Vee ";400V

~5V

'e llO

Ie

90%

'l
t,

0
t stg tf

TEST CIRCUIT USED FOR MEASUREMENT OF
VCEXISUS) AND REVERSE BIAS SAFE OPERATING AREA

Ie

L-l mH

t, Adjusted to Obtain Ie
200n

I

VSE(off)

Vee
"; 70V
Vel amp

";5V

VCEXISUS)
Type No.

l6d-L

REVERSE BIAS SAFE OPERATING AREA
Ie IA)

'B2IA)

RBBIn!

Type No.

IB2 IA)

RBBln)

-0.3

20

2SC3178

2SC3178
2SC3059

r ~,

2.5

-0.3

20

2SC3059

2SC30S0

5.0

-O.S

10

2SC30S0

-O.S

10

2SC30S1

7.0

-1.2

5

2SC3061

-1.2

5

V clamp"" 900V

1-95

1-96

00

January 1990

FUJITSU

Edition 1.1
PRODUCT PROFILE

2SC3178
Silicon High Speed Power Transistor
ABSOLUTE MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector to Emitter Voltage

V CEO

850

V

Collector to Base Voltage

V CBO

1200

V

Emitter to Base Voltage

V EBO

7

V

Collector Current·Continuous

Ic

2

A

Collector Current·Pulsed Pw ~ 25 fls, D.R.~ 50%

Icp

4

A

Base Current-Continuous

IB

1

A

Collector Power Dissipation (Tc = 25°C)

Pc

60

W

Junction Temperature

Tj

+150

°c

Storage Temperature Range

T stg

-55

~

..

°c

+150

ELECTRICAL CHARACTERISTICS (T. = 25°C)
Parameter

Symbol

Collector to Base Breakdown Voltage

VCBR)CBO

Test Conditions

Limit

Unit

Min.

Typ.

Max.

Ic = lmA, IE =0

1200

-

-

V

Emitter to Base Breakdown Voltage

VCBR)EBO

IE = lmA, Ic = 0

7

-

-

V

Collector to Emitter Sustaining Voltage

VCBR)CEO

Ic = 10mA, RBE =~n

850

-

-

V

Collector to Emitter Sustaining Voltage

V CEX (SUS)

Ic=2.5A, IB2=-0.3A, L=lmH(*I)

900

-

-

V

Collector Cutoff Current

ICBO

V eB = 1000V, IE = 0

-

-

100

IlA

Collector Cutoff Current

ICBO

V CB = 1000V, IE = 0, Tc = 100°C

-

1

mA

Emitter Cutoff Current

lEBO

V EB = 6V, Ic = 0

-

-

100

IlA

DC Current Gain

hFE

VCE = 5V, Ic = lA (*2)

10

15

30

-

Collector to Emitter Saturation Voltage

VeE (sat)

-

0.3

1.5

V

Ic = lA, IB = 0.2A (*2)
Base to Emitter Saturation Voltage

V BE (sat)

-

1.0

2.0

V

Output Capacitance

Cob

V CB = 10V, IE = 0, f = lMHz

-

60

-

pF

Gain Bandwidth Product

fT

VeE = 10V, Ic = 0.2A

-

15

-

MHz

Rise Time

t,

-

0.2

0.5

Ils

-

2.5

3.5

IlS

0.07

0.3

IlS

Storage Time

t stg

Fall Time

tj

*1 Test Circuit

Vcc =400V (*1)
Ic = lA, 31 B1 = -)B2 = 0.3A

*2 Pulse Pw ~ 300 IlS,Duty Ratio ~ 6%

1-97

2SC3178

SWITCHING TIME

DC CURRENT GAIN

Collector Current Ie (A)

0.1~~.

GAIN BANDWIDTH PRODUCT
50

0.05~

TC=25·C _
V E = 10V

N

J:

e

p

.t"

g 20

"~
"-

~

.t:

Collector Current Ie (A)

..--

....... ~

~ 10
~

-g
~

·i

5

CJ

REVERSE BIAS SAFE OPERATING AREA
0.1

0.2

0.5

2

Collector Current Ie (AI

OUTPUT CAPACITANCE

Collector-Base Voltage

1-98

Vee (V)

BOO

1200

Collector-Emitter Voltage V clamp (V)

1601)

2SC3178

SWITCHING TIME
vee =400V
Ie = lA
Pw =50#'
Duty ratio = 1%

SATURATION VOLTAGE
20

10

..

Te ·26°C

N,~

q,;...,-= ~

"'

"q~

"Z

"'

1'-.
2

0.1

"

0.2
-I B2 (A)

III

I

0.02

Te = 25°C

10

.01

0

.02

0.05

0.1

0.2

0.5

2

Collector Current Ie (A)

0.2

" ~q..,..,
,~

o

r--:'..,

COLLECTOR SATURATION REGION

"'

1-++H-hf1--.1

0.05

??
w w
0.1

t

"0

~

> Ii'

Te· 25°C

.5 il
OW

~o m

~ --1I-N-+4-H-l-H--+---l

I-H+I-I-Il-----t-I-f-I-+++II+---\-f-1I-+ VBE

"I.e?;::
.,,"'."
"

=
-

+>-1--4---1

I-H+I-I-it-<-----t-+-f-I-++++II----'~2A ~....~~'I----+___l

1 I-H+I-I-i+-----t-1I-f-1-1A!
O.SA
IC·0.2A

UID

~q,.,.

0.05

~

•
~~~~~---+-+~H-+1~~-++-~-+4-~H+----I-~

.

H

~ .~

'\

Te= 25"c
.( ~ ..: -H-l-++t+---+---l

»

t, -IB1

1

II

um

0.2
-I B2 (A)

0.2

1-H-+1-H1,~ - - I ~

t

.~ -

\

A

1.SA

':

\

:\

-;;;.

\.

~

ttH!rnE~~~~\~~i'-~~;;HK~£j
C ... .

O[

j

0.005 0.01

0.02

0.05

0.1

0.2

0.5

I

2

Base Current 18 (A)

0.1

0.2

IB1 (A)

6

1-99

2SC3.178

THERMAL RESPONCE

pf.&,
;;
0:

~

0:

~ 0.2

~

6;;;iI li-

I

~ 0.5
'ij

lit

. .".

(I
~~

~

~

~~

Iii

rul"'"
' ~,

~..,'#
.~

,

O. 1

0.5

T ... 26.~

10

2

20

50

100

200

,

500 1000

Time or Pulse Width tl (ms)

FOWARD BIAS SAFE OPERATING AREA

DMaX.

FOWARO BIAS SAFE OPERATING AREA

101~g

,,"~(

1 0 - , . _

2

'ftl~"M"'(.

5

r : 0.2

~

<> 0.2

:;

$Ingl. Pulse

~

O. 1

"0

]

Tc·-:Z5"c

8

<>

0.1
0.05

0.02 H-Htt--ic-H-t-I*H--t-t-tf'kHlH

0.02

0.01~_

0.01

10

20

50

100

_
200

500 1000

Coliector·Emitter Voltage VeE (V)

1-100

10

20

50

100

200

500 1000

Coliector·Emitter Voltage VCE IV)

o':J

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

2SC3059
Silicon High Speed Power Transistor
ABSOLUTE MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector to Emitter Voltage

VeEo

850

V

Collector to Base Voltage

V eBo

1200

V

Emitter to Base Voltage

V EBO

7

V

Collector Current-Continuous

Ie

2

A
A

Icp

4

Base Current-Continuous

IB

1

A

Collector Power Dissipation (Te = 25°C)

Pe

100

W

Junction Temperature

T)

+175

°c

Storage Temperature Range

T""

Collector Current-Pulsed Pw

~

25/1s. D.R. ~ 50%

..

°c

-65 - +175

ELECTRICAL CHARACTERISTICS (T. = 2S0C)
Parameter

Symbol

Test Conditions

Limit

Unit

Min.

Typ.

Max.

1200

-

-

V

Collector to Base Breakdown Voltage

V(BR)CBO

Emitter to Base Breakdown Voltage

V(BR)EBO

IE = lmA, Ie =0

7

-

-

V

Collector to Emitter Sustaining Voltage

V(BR)CEO

Ic = 10mA, RBE = 000

850

-

V

I c =2.5A, IB2=-0.3A, L=lmH(*l)

900

-

-

Ie = lmA, IE =0

V

Collector to Emitter Sustaining Voltage

VcExISUS)

Collector Cutoff Current

ICBO

V CB = 1000V, IE = 0

-

-

100

/1A

-

-

1

mA

100

/1A

Collector Cutoff Current

ICBO

V CB = 1000V, IE = 0, Tc = 100°C

Emitter Cutoff Current

lEBO

V EB = 6V, Ie = 0

DC Current Gain

hFE

VCE = 5V, Ie = lA (*2)

-

-

10

15

-

30

-

0.3

1.5

V

1.0

2.0

V

Collector to Emitter Saturation Voltage

VCE(sat)

Base to Emitter Saturation Voltage

V BE (sat)

Output Capacitance

Cob

V CB = 10V, lEO, f = lMHz

-

60

-

PF

Gain Bandwidth Product

fT

VeE = 10V, Ie = 0.2A

-

15

-

MHz

Rise Time

tr

-

0.2

0.5

/1S

Storage Time

t stg

-

2.5

3.5

/1S

0.07

0.3

/1S

Ie = 1A, IB = 0.2A (*2)

Fall Time
*1 Test Circuit

Vcc =400V (*1)
Ie = lA, 31 B,= -IB2 = 0.3A

tf
*2 Pulsed Pw ~ 300 /1s, Duty Ratio ~ 6%

Copyright@> 1110 IIr FWrrsu UlnED and FuJItsu lIIcroelectronlce. Inc.

1-101

2SC3059

DC CURRENT GAIN

SWITCHING TIME

100

Vcc -4OQV
IBI --III2f3-lc11d.

vee-sir:

T

0.01

Pw• 5Q#t

REVERSE BIAS SAFE OPERATING AREA

0.5

Collector Curreht Ie (AI

41--I--+--+-oh

OUTPUT CAPACITANCE

u:

200

.e

" 100
g 50
0

u

l!i

.~

--

,

I ~II
Itc w2!$/)c

"

foil

MHz

-:..

~

~

5 20
&

....

~

.'

0

."

10

;

'.'

2

5

10

20

50

Collector-Base Voltage VeB (VI

100

200

400

800

1200

Collector-Emitter Voltage Vclamp (VI

1-102

1600

2SC3059

SWITCHING TIME
vcc = 400V
Ic= lA
Pw"" SOp.s
Duty Ratio = 1 %

SATURATION VOLTAGE

t,;,g - IB2
20

10

T C =25'C

Ie· leiS

~

!

~$,~

""

..........q7

'Z

==

>'"

"

0.1

VeE (sad

Tc·
25'C
0.5 75'C
125'Cr--

!

w

u

>

8,

0.2

l!!

'\

..

..,..;

w

q","l---==

"0

,

'im

160°C

-625'C
="

c

1

>
0
.0

.,

0.1

75'
125'

ell 0.05

'?9'

~

~ ~~

125'C

75'C
25'C

VCE (sad

I I

II

IB2

tf -

0.01

0.02

0.05

TC = 2SQC

0.1

0.2

5

0.5

Collector Current Ie (A)

0.2

~
o

1

q","l

---.: 7,,/

...."

COLLECTOR SATURATION REGION

II

..

0.05

I~

d"---

0.1

~~

0.2

U-J-<

--I~

~

"l

Tc' 2S'C

N

~

0

2

w w

-IB2 (AI

»U

'"

VeE
TC

0.2

~
~"

1

=25'C
Ic· O.2A

,,''\" -

lA

\
\

~ 300 J.1s, Duty Ratio 1> 6%

© 1990 by FUJITSU LIt.tTED and Fuptau Mcroelectronics, Inc.

1-105

~SC3060

DC CURRENT GAIN

SWITCHING TIME

W
IL

.t::

c:

~

!

~

:

;

d
g

~

~
e

~

~

5
Collector Current Ie (A)

10

:;:

i

GAIN BANDWIDTH PRODUCT
N

50

:!:

~

..t

il~ 20

Collector Current Ic (A)

."

£
of; 10

."

·il

.

."

c:

co
c:

5

~
REVERSE BIAS SAFE OPERATING AREA

Collector Current Ic(A)

OUTPUT CAPACITANCE

~
!:!

u"

E
~

0

!lc:

~

u

.
It

.l!l

I8

tl
~

~

&
~

0

Collector-Base Voltage VCB (V)
Collector Emther Voltage V clamp (V)

1-106

2SC3060

SWITCHING TIME
vcc '400V
Ic' 2A
Pw = 5O~s
Duty Ratio = 1%

to,g 20

]

I'....

10

SATURATION VOLTAGE

182

rr'C

J

'''1;]-:
1!1I-i-

5

""

~~
I~

0.2

0.5
-IB2IA)

?

2

!w

1

I

0

>

!l,

O. 1

.~

•

0.05

en

i;

ff

125'~~

75'C:;::
125'C
150'C

0

~

150'C

+~I25'C

"0
c

-

lljfC

O. 2

~

>

VsE \satl

25'C
75'C
125'C

O. 5

L..o~

.1.

TC~

>"

!w

IS -lcl5

=-- I-VCE (sat)

7SoC

25'C

I

U0.D1

I
0.02

0.05

0.1

10

0.5

0.2

Collector Current Ie (AJ

ic=
0.2

25'C

~I
o
1/11

.~

"I

COLLECTOR SATURATION REGION
0.05

I

..:

"l

2

0.2

I
'"

';1

0.5

.II

..:

..:
N

~

.9

-IB2 (A)

4A

fC= 25'C
O. 2

I -O.SA

.o?,

.....

'''' '".

-I-

0.01

0.02

~I-

1\
\

1\
\
o

VBe
~
~~
~

2A

N~))r-

~

0.05

3A

1

~~J

j
-;;: O. 1

Tc·2S·C

..: II)
«

0.05

0.1

0.2

J:..-'
0.5

2

5

Base Current I B (A)
N

.

...• " ... ~ I""
0.5

0·2
IBl (A)

1-107

2SC3060

THERMAL RESPONSE

§~

0.05

to-

II III

I I

0.02 '--'-'-'-~0."::5"':-1-~2~..l.....'-;!-.u..":1-::0--:2~0:-'--"-:50:';:-l."-':'10~0:--=20~0:-'---'::5±00~1~000
Time or Pulse Width t1 (ms)

FORWARD BIAS SAFE OPERATING AREA

FORWARD BIAS SAFE OPERATING AREA
20
10

.';~,

IllIPuIJ)ML

~

\'

2

'j
"&

'\

3

'.

~f
~\

1:
~
~

(J

j
'0
(J

0.5

Single Pulse
TC ~ l00·C

0.2

. ~~

0.1
0.05

.,
0.02
10
Collector-Emitter Voltage VeE (V)

1-108

20

50

100

200

500

Collector-Emitter Voltage V CE (V)

1000

cO

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

2SC3061

Silicon High Speed Power Transistor
ABSOLUTE MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector to Emitter Voltage

VCEO

850

V

Collector to Base Voltage

VCBO

1200

V

Emitter to Base Voltage

V EBO

7

V

Collector Current-Continuous

Ic

10

A

Collector Current·Pulsed Pw ~ 25 jlS,

QR;::;50%

Base Current-Continuous

Icp

20

A

IB

5

A

Collector Power Dissipation (T C = 25°C)

Pc

200

W

Junction Temperature

Tj

+175

°c

Storage Temperature Range

T""

..

°c

-65 - +175

ELECTRICAL CHARACTERISTICS (T. = 25°C)
Parameter

Symbol

Collector to Base Breakdown Voltage
Emitter to Base Breakdown Voltage

Limit

Test Conditions

Unit

Min.

Typ.

Max.

V'BR) CBO

Ic = lmA,IE =0

1200

-

-

V

V'BR) EBO

IE = lmA,lc =0

7

-

-

V

850

-

-

V

900

-

-

V

Collector to Emitter Sustaining Voltage

V'BR)CEO

Ic = 10mA, RBE = oon,

Collector to Emitter Sustaining Voltage

V CEX (sus)

Ic = 7A, IB2 = -1.2A, L=lmH(*l)

Collector Cutoff Cu rrent

'CBO

VCB = 1000V, IE = a

-

-

100

jlA

Collector Cutoff Current

'CBO

V CB = 1000V, IE = 0, Tc = 100°C

-

-

1

rnA

Emitter Cutoff Current

lEBO

VEB

= 6V,

Ic =

a

-

-

100

jlA

DC Current Gain

hFE

VCE

= 5V,

Ic = 4A(*2)

10

15

30

-

-

0.3

1.5

V

-

1.0

2.0

V

Collector to Emitter Saturation Voltage

VCE (sat)

Base to Emitter Saturation Voltage

V BE (sat)

Output Capacitance

Ic = 4A, IB = 0.8A(*2)

Cob

VCB

= 10V,

IE = 0, f = lMHz

-

220

-

PF

Gain Bandwidth Product

fT

VCE

= 10V,

Ic = lA

-

15

-

MHz

Rise Time

t,

-

0.2

0.5

jlS

-

2.5

3.5

jlS

-

0.07

0.3

jlS

Storage Time

t"s

Fall Time

tf

*1 Test Circuit

Vcc = 400V(*1)
Ic = 4A, 31 B1 = -IB2 = 1.2A

*2 Pulsed Pw ~ 300 jlS, Duty Ratio ~ 6%

Copyrlgh.@ , ... ov FIIJITSU UIiTED _

Fup'" - . . . . . 1... Inc.

1-109

2SC3061

DC CURRENT GAIN

SWITCHING TIME

Collector Current Ie (A)

GAIN BANDWIDTH PRODUCT

Collector Current Ie (A)

REVERSE BIAS SAFE OPERATING AREA

Collector Current Ie (A)

OUTPUT CAPACITANCE

Collector-Base Voltage V CB IV)

1-110

Collector-Emitter Voltage Vclamp IV)

2SC3061

SWITCHING TIME
Vee: 400V
Ie: 4A
Pw =: 50,us
Duty Ratio

= 1%
SATURATION VOLTAGE

III

0
Te: 25°C

,f---P--,J.
,
5

"-

3w
1'0.'6'''1_

"-

w

1rC

.
u

>

01

~

w

"

I

2

>


a

'"

125°C"

VeE (sat)

TL
T

~

J.e.!

~25OC

75°C

25°C

c

'':;

~

-

1510°C

O. 2

O. 1

..

I~SEJ

1
Te:
25°C
O. 5 75°C
125°C

Is - le/5

0.0

5 75°C
25°C
15foc
0.05

0.1

0.2

0.5

10

20

Collector Current Ie (A)

Te: 25°C
0.2

.3

:;

~~,J
~"1
0.1 f-- f-tE,,"I

COLLECTOR SATURATION REGION

0.05

TC= 26"C

0.2

J

~~.

t·

.3

1\",

O. 1

0.0 5

,

J'

'~r---

C·
~.;';
+

"

Base Current 18 (A)

0.5

1-111

2SC3061

THERMAL RESPONSE

Time or Pulse Width 1, (ms)

FORWARD BIAS SAFE OPERATING AREA

FOWARD BIAS SAFE OPERATING AREA

50
20

'0

0.'-,._

0.05~

0.02 w..l.J..!-,1:0--:21:
0 ...J:::...J.;50:I:-'-.LI::I,0:!-;0:--=200~..1....0':5:!:'OO::!-L,!I!!OOO
Collector-Emitter Voltage VeE (V)

1-112

Collector-Emitter Voltage V CE (V)

cP

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

FT1551
Silicon High Speed Power Transistor
DESCRIPTION
The FT1551 is a silicon NPN general purpose, medium power transistor fabricated
with Fujitsu's unique Ring Emitter Transistor (RET) technology. RET devices are
constructed with multiple emitters connected through diffused ballast resistors
which provide uniform current density. This structure permits the design of high
power transistors with exceptional frequency response in high current applications.
The FT1551 is especially well·suited for High frequency power amplifiers, Audio
power amplifiers and drivers.
A PNP complement, FT2551, is available.

OUTi.lNE DIMENSION
JEDEC TO-68

• High fr = 85 MHz (typ)
• Excellent Safe Operating Area
• Improved reverse Second·Breakdown Capability
• Excellent Current Gain Linearity

ABSOLUTE MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector to Base Voltage

VCBO

120

V

Emitter to Base Voltage

VEBO

4

V

Collector to Emitter Voltage

V CEO

120

V

Collector Current

IC

2

A

Collector Power Dissipation (Tc ::: 2SQ C)

Pc

20

W

Tj

150

T stg

~5-+150

·C
·C

Junction Temperature
Storage Temperature Range

ELECTRICAL CHARACTERISTICS (Ta = 25°C)
limits

Parameter

Symbol

Unit

Test Conditions
Min.

Typ.

-

10

~A

-

50

~A

-

100

~A

-

V

V

Collector Cutoff Current

leBo

V CB = 100V.

IE = 0

Emitter Cutoff Current

lEBO

VEB= 4V.

IC = 0

Collector Cutoff Current

'CEO

VCE = 100V,

IB =0

-

Max.

Collector to Base Breakdown Voltage

V(BRICBO

IC

= 50llA,

Ie'" 0

120

Emitter to Base Breakdown Voltage

V(BRIEBO

IE

= 50llA,

Ic = 0

4

-

Collector to Emitter Breakdown Voltage

V(BRICEO

Ic

= lmA,

RBE ""

120

-

-

-

350

DC Current Gain
DC Current Gain
, Collector to Emitter Saturation Voltage
Base to Emitter Voltage
Gain·Bandwidth Product
Output Capacitance

00

V

hFE1

VCE = 5V,

Ie = 10mA*

60

hFE2

VCE = 5V.

Ic = 0.3A·

50

-

-

IB = 0.07A*

-

0.1

1.0

V

0.8

1.5

V

85

-

MHz

VCE(sat)
VBE
IT
Cob

Copyrlah\© 111D IIr FWITSU UInED .... Fu..... - o n I c o , Inc.

IC

=0.7A.

VCE = 5V.

Ie:: O.7A*

V CE =10V.IC=0.2A.I=10MHz
VCs=10V.IE=0.I=lMHz

* Pulsed:

75

Pulse Width
Duty Cycle

pf

~ 300~s

;£ 6%

1-113

FT1551
OUTPUT CHARACTERISTICS

Ie, Collector Current (AMP)

DC CURRENT GAIN

OUTPUT CAPACITANCE

~E

oa
9.06
G.I
0.2
DJ5
Ie. Collector Current (AMP)

.

~

2

~

1

U

II

~
u
•.m!:.~;:.l..~::;ll'-!::--'.:!:m:-"--';;.,,!;!-lJJ.!:,,"---'-:u~u.f.~c'-l.JLl!-"";'+--'
Ie. Collector Current (AMP)

'" H'r#f""'4"'+

9~'~"
i~U

W

(VO~TS)

1-114

~ ~

VeE. Collector-Emitter Voltage

00

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

FT2551
Silicon High Speed Power Transistor
DESCRIPTION
The FT2551 is a silicon PNP general purpose, medium power transistor fabricated
with Fujitsu's unique Ring Emitter Transistor (RET) technology. RET devices are
constructed with multiple emitters connected through diffused ballast resistors
which provide uniform current density. This structure permits the design of medium
power transistors with exceptional frequency response in high current applications.
The FT2551 is especially well-suited for High frequency power amplifiers, Audio
power amplifiers and drivers.
A NPN complement, FT1551, is available.
• High fT = 60 MHz (typ)
• Excellent Safe Operating Area
• Improved reverse Second·Breakdown Capability
• Excellent Current Gain Linearity

i

t:::::=~====±::::=--e.;

u------,,--,,".I

ABSOLUTE MAXIMUM RATINGS
Rating

Symbol

Value

Unit

Collector to Base Voltage

VCBO

120

V

Emitter to Base Voltage

VEBO

4

V

Collector to Emitter Voltage

VCEO

120

V

Collector Current

IC

2

Collector Power Dissipation (T C = 25°C)

Pc

20

Junction Temperature

Storage Temperature Range

D

OUTLINE DIMENSION
JEDEC. TO-66

A

Tj

150

T stg

-65-+150

w
°c
°c

ELECTRICAL CHARACTERISTICS (Ta = 25°C)
Parameter

Limits

Test Conditions

Symbol

Min.

Unit

Typ.

Max.

Collector Cutoff Current

leBo

VCB" 100V,

IE = 0

-

~

10

I"A

Emitter Cutoff Current

lEBO

V EB = 4V,

IC =0

-

-

50

I"A

ICEO

V CE = 100V,

IB =0

-

-

100

I"A

Collector to Base Breakdown Voltage

V(BR)CBO

Ic

= 50l"A,

IE = 0

120

V(BR)EBO

IE

=50,"A,

IC =0

4

-

V

Emitter to Base Breakdown Voltage

-

Collector to Emitter Breakdown Voltage

V(BR)CEO

IC

=1mA,

RBe =

120

-

-

V

-

350

Collector Cutoff Current

DC Current Gain
DC Current Gain
Collector to Emitter Saturation Voltage
Base to Emitter Voltage
Gain·Bandwidth Product
Output Capacitance

Copyrlaht© 1Il10 .., FU.mIU UIIITED ond FuJtou

00

hFEl

VCE= SV,

Ic =10mA*

60

hFE2

VCE= 5V,

IC = 0.3A*

VCE(sat)
V BE
IT
Cob

--..1... Inc.

IC

=0.7A,

VCE= 5V,

V

50

-

-

IB = 0.07A*

-

0.1

1.0

V

IC = 0.7A*

-

0.8

1.S

V

-

60

-

MHz

120

-

pF

V CE =10V,I C=0.2A,I=10MHz
V CB -l OV ,I E=O,I=l MHz

.. Pulsed:

Pulse Width ~ 300,",5
Duty Cycle 6%

i£

1-115

FT2551
GAIN BANOWIOTH PRODUCT

OUTPUT CHARACTERISTICS

._.". oo_. ,~
. II
. ,~
Ie. Collector Current (AMP)

'.

10

5

15

VeE, Collector-Emitter Voltage (VOLTS)

DC CURRENT GAIN

OUTPUT CAPACITANCE

11~~E~5~!-....

"

IE-OJ::=::

folMHz=

r-;;;;

~

"-

"

m

~

"
"

,

.,,'

.-

M'

.

....

'00
"
Ie. Collector Current (AMP)

"

.

,

,

"

..

"

.

SAFE OPERATING AREAS
T c "'25°
Singi.

COLLECTOR SATURATION VOLTAGE

~3-

IC: IS"ID:l::

,-

(;

>

"
f~
;>0

,

Pille

~

~

0_

V

:~ :I.I!!IIII~I,l!I!II~!l~!ll!II!!1!~
.., ..

,

5w

!: ....

....~

"

Ie. Collector Current (AMP)

00

.

"

"

~

~

-

VeE. Collector-Emitter Voltage

(VOLTS)

1-116

'"

Vea. Collector-Base Voltage (VOLTS)

~

Section 2

Full Plastic Mold Rina Emitter Transistors -

At a Glance

Maximum RaUng.

Page

Device

c... In.)

2-5

2SC3842

lO-{lPF

NPN

400

2-9

2SC3843

T~PF

NPN

450

10

2-13

2SC3844

lO-{lPF

NPN

450

15

2-17

2SC3845

lO-{lPF

NPN

800

3

2-21

2SC3846

T~PF

NPN

800

6

2-25

2SC3847

T~PF

NPN

800

10

2-29

2SC3947

T~PF

NPN

500

5

2-33

2SC3948

TO-3PF

NPN

500

10

2--37

2SC3949

T~PF

NPN

500

15

Polarity

Vceolv)

lelA)
10

2-1

Full Pklstic Mold Ring Emitter Transistors

2-2

Power Transistor Products

FuN Plas6c Mold Ring Emitter Transistors

Power Transistor Products

INTRODUCTION
TO-3PF Full Plastic Mold Power NPN Transistors
(Ring Emitter Transistors)
Fujitsu's exclusive line of Full Plastic Mold TO-3PF
High Speed Switching Power NPN Thmsistors
eliminates the need for electrically isolating the
package from the heatsink with materials such as
mica and/ or a mounting screw bushing. Collector

power dissipation (Pc) is equal to or higher than other TO-3P type packages that require insulating materials and mounting screw isolation bushings as
shown in the table below.

Features:
High Reliability RET Transistor Design
Up to 85 W collector power dissipation (Pc)

isolation MaterIal

Package

Full Mold TO-3PF

Voltage ratings (VCEQ) up to 800 Volts
DC current ratings (Ie) up to 15 Amps maximum at 25°C TA

No need to isolate package from heat sink
Up to 25 KV isolation voltage (package and
heatsink)

Applications:
Switching regulators (60 to 200 KHz)
CRT display deflection circuits (32 to 128
KHz)

Ultrasound systems

OtherTQ-3P

Pc

Not Required

S5W

MICA 10011 (600 V)

S5W

MICA 15011 (1200 V) 65W

Cool Sheet 20011
..
(Tc = 25C. wtth SIlicon grease)

55W

The mounting of this TO-3PF on the heatsink is
completed with just one screw, so the mounting labor cost is reduced.

TIghten Torque requirement

5 kg
8 kg

*
*

cm (Standard)
cm (Maximum)

Isolation Voltage between package and heatsink:
25 KV minimum

2-3

Full Plastic Mold Ring Emitter Transistors

Power Transistor Products

TO-3PF FULL PLASTIC MOLD POWER TRANSISTORS
(RING EMITTER TRANSISTORS)
ELECTRICAL CHARACTERISTICS
Maximum Ratings IT, = 25°C)
Type No.

VCBO

V CEO

IV)

IV)

Ic
IA)

Electrical Characteristics IT, = 25°C)

ICM'
IA)

Pc
IW)

IcIA)

hFE
Min.

tf IllS)

VCE IV)

0.3

Max.

2SC3842

600

400

10

15

70

5

5

10

2SC3843

600

450

10

20

75

5

6

10

0.2

2SC3844

600

450

15

20

75

5

10

10

0.3

2SC3845

1200

800

3

6

75

5

1

10

0.3

2SC3846

1200

800

6

10

80

5

2

10

0.3

2SC3847

1200

800

10

20

85

5

4

10

0.3

2SC3947

850

500

5

8

70

5

2.5

10

0.3

2SC3948

850

500

10

15

75

5

5

10

0.3

2SC3949

850

500

15

20

80

5

10

10

0.3

* Pulsed Pw :s;: 251ls, D.R. :s;: 50%

2

2-4

cP

January 1990

FUJITSU

Edition 1.1
PRODUCT PROFILE

2SC3842
Silicon High Speed Power Transistor
3SC3842 400V, 10A
ABSOLUTE MAXIMUM RATINGS
Parameter

Symbol

Conditions

Rating

Unit

-55 - +150

°c

+150

°c

V CBO

600

V

Emitter to Base Voltage

V EBO

7

V

Collector to Emitter Voltage

V CEO

400

V

Storage Temperature Range

Tstg

Junction Temperature

TJ

Collector to Base Voltage

Collector Current

10

Ic
ICM

Base Current

IB

Collector Power Dissipation

Pc

ELECTRICAL CHARACTERISTICS (T.

A

Pw ~ 10ms, D.R. ~ 2%

15
5

A

Tc = 25°C

70

W

=25°C)
Limit

Parameter
Collector to Base Breakdown Voltage

Symbol
V(BR)CBO

Test Conditions
Ic = lmA, IE = 0

Unit
Min.

Typ.

Max.

600

-

-

V
V

7

-

-

400

-

-

V

Ic = 2A, IB2 = -lA,
L = 200ttH'

450

-

-

V

V CB = 500V, IE = 0

-

-

100

tt A

V CB = 500V, IE = 0,
Tc=100°C

-

-

1

rnA
tt A

Emitter to Base Breakdown Voltage

V(BR)EBO

IE = lmA, Ic =0

Collector to Emitter Sustaining Voltage

VCEO(SUS)

Ic = 0.8A, RBE =

Collector to Emitter Sustaining Voltage

VCEX(SUS)

Collector Cutoff Current

ICBO

con

Emitter Cutoff Current

lEBO

V BE =6V, Ic =0

-

-

100

DC Currentt Gain

hFE

VCE = 5V, Ic = 5A"

10

17

40

-

Collector to Emitter Saturation Voltage

VCE(satl

0.38

1.0

V

Ic = 5A, IB = 1A**

-

Base to Emitter Saturation Voltage

VeE (sat)

-

1.15

1.5

V

Output Capacitance

COb

V CB = 10V, IE = 0, f = lMHz

100

fT

VCE = 10V, Ic = lA

32

-

pF

Gain Bandwidth Product

MHz

Rise Time

t,

-

0.09

0.5

ttS

-

1.90

2.5

ttS

-

0.14

0.3

tIS

Storage Time

t stg

Fall Time

tf

Vcc = 150V
Ic = 5A, IB1 = -IB2 = 1A*

*1 Test Circuit **2 Pulse Pw ~ 300tlS, Duty Ratio;;;;: 6%
CoJ>l'r1gh1@ 1HO.., FUJITSU IJlllTEDMd FujIIou _cnl... Inc.

2-5

2SC3842

VCE (sad, V BE (sad - Ic

~~

i~

LUlU

>o >"'

E
"0

>
c

.";o
eli
Collector Current Ie (A)

Collector Current Ie (A)

ColiectorMBase Voltage V CB IV)

0.05

0.1

0.2

0.5

Collector Current Ie IA)

Thermal Response

Puis. Width t1 (ms)

2-6

2SC3842

I

IC· O•SA

3A

2A

SA 7A

lA
5

j

2

J

VBe

1

f---

3A
A

lA

Ic· O.S

SA

;::

~

~

c

o
.~

Ji
Collector Current Ie (A)

Collector Current Ie (A)

Collector-Base Voltaga V CB (V)

Collector Current Ie (A)

Thermal Response

Pul •• Width tl (m.)

2-10

2SC3843

Vee. VBe -IB
3A

'C· IA

Tc- 25'C

Tc·

5

6A 7A IDA

26' C

Vcc·'60V
'c· 6A

II

'wD.A.-'%

6O,..

7

"-~~

2

Vae

.:J.t:

1,
~~
~"1

iDA
_'c·'A

I
I
o
o.02

A 6A 7A

~ ~.,I.Vee
\..

"-

0.05 0.1

0.5
-0.5

I
0.2

1

0.5

2

5

10

-1

r

......

-2

-5

Base Current 192 (A)

Base Current I B (A)

]
;!'

~
i=

]

~.

;!'

i

E

i=

-2

g'

~

-5

Base Current I B2 (A)

.~
II)

Collector Current Ie (AI
Test Circuit for Switching Time

~-=r.~,

-

l...[LB2

V'o

Sase Current I B 1 (A)

2-11

2SC3843

Forward Bias Safe Operating Area - 1

Forward Bias Safe Operating Area - 2

= 25°C

Tc

100"C

=

, • Singfe Pulle

~

w

o

>

5

10

Collector Current Ie IA)

20

50 100

200

500 1000

Collector Current Ie (A)

Reverse Bias Safe Operating Area

Pc -To

Tc

=25°C -

150"C

20

!

~

0

0-

.!!
1:

c

·2

~

~

~

9
~



ii.

i=
&

~Pw •.so,.,s
Duty Ratio

0

~

~~

.-E >

400V
-,%

I,J~-J-:VCC.
'.!I,~
IC·'A

5

~'-1
i'-.

E

~ .~

Jl

"-

t>w

.!! .D

011
om

2

0.5

-0.05

2

-0.1

-0.2

"

-0.5

Base Current I B2 (A)

Base Current 18 (A)

..

]

..j

]

~
i=
0;

.:

LL

~go
~

'j;

en

Base Current 182 (A)

0.05

0.1

0.2

0.5

5

Collector Current Ie (A)

Test Circuit for Switching Time

v,"
~~~~~s ' -_ _+-'-..:.-'----~---' vee
Base Current I B1 (A)
IB1 --1&2" Ic/10

2-19

2SC3845

Forward Bias Safe Operating Area - 2

Forward Bias Safe Operating Area - 1
T

=

Tc = lOO'C

2S'C

5

5

~

~

~

c

~

~

(J

8

5

j

j

"0

(J

"0

(J

Collector-Emitter Voltage VeE (V)

Collector-Emitter Voltage VeE IV)

!

D-

u

5

C
0

~

"R

c

~

"i2

is

~

10

(J

5

I

g
'5

"0
(J

(J

AmbientTemperature Ta (OC)
Test Circuit for VCEX(sus) and Reverse Bias Safe Operating Area

Collector Voltage V clamp (V)

r-=_ _C'-L~"200",H

L-_~- -,- : . :. .-,- I_:_:~_,~_,- ,:",~,
_ __

t,
t1

2-20

=. ~~~:cl

VCEX(SUSI: Vcl amp ~ 900V

Ie

~

2.5A

'e2"' -O.3A

ReB - 20.0

cP

January 1990

FUJITSU

Edition 1.1
PRODUCT PROFILE

2SC3846
Silicon High Speed Power Transistor
2SC3846 800V, 6A
ABSOLUTE MAXIMUM RATINGS
Parameter

Symbol

Rating

Unit

-55 - +150

°c

TJ

+150

°c

Collector to Base Voltage

VCBO

1200

V

Emitter to Base Voltage

V EBO

7

V

Collector to Emitter Voltage

V eEo

800

V

Storage Temperature Range

Tstg

Junction Temperature

Conditions

6

Ie

A

Collector Current

leM

Base Current

IB

Collector Power Dissipation

Pe

Pw ~ 25)1s, D.R. ~ 50%

10
3

A

Te=.25°C

80

W

ELECTRICAL CHARACTERISTICS (T. = 25°C)
Limit

Parameter
Collector to Base Breakdown Voltage
Emitter to Base Breakdown Voltage
Collector to Emitter Sustaining Voltage

Symbol

Test Conditions

Unit
Min.

Typ.

Max.

V(BR)eBO

Ie = lmA, IE = a

1200

-

-

V(BR)EBO

IE = lmA, Ie = a

7

-

-

V

800

-

-

V

-

V

oon

V

V(BR)eEO

Ie = lamA, RBE =

Collector to Emitter Sustaining Voltage

VeEX(SUS)

Ie = 5A, IB2 = -0.6A,
L = lmA*

900

-

V eB = 1000V, IE = a

-

-

100

)1A

Collector Cutoff Current

leBo

V eB = 1000V, IE = 0,
T. = 100°C

-

-

1

mA

Emitter Cutoff Current

lEBO

V EB =6V, Ie =0

-

-

100

)1A

DC Currentt Gain

hFE

VeE =5V, Ie =2A**

10

15

30

-

-

0.3

1.5

V

Collector to Emitter Saturation Voltage

VCE(sat)

Base to Emitter Saturation Voltage

VBE(sat)

Output Capacitance

COb

V eB = 10V, IE =0, f=lMHz

Gain Bandwidth Product

fT

VeE = 10V, Ie = 0.5A

Rise Time

t,

Storage Time

t stg

Fall Time

tf

*1 Test Circuit

Ie = 2A, IB = O.4A**

Vee = 400V
Ie = 2A, 31 B1 =-IB2 =0.6A*

-

1.0

2.0

V

-

120

-

pF

15

-

MHz

-

0.20

0.5

)1S

-

2.50

3.5

)1s

-

0.07

0.3

)1s

**2 Pulse Pw ~ 300)1s, Duty Ratio ~ 6%

Copyrlght© 1990 by FWITSU UJAiTED and Fujitsu Microelectronics, Inc.

2-21

2SC3846

VeE (sat), VSE (sat) - Ie

hFE -Ie

w
u.
~

0

~
0

~

(,)
(,)

0

Collector Current Ie (AI

Collector Current !e (A)

fT -Ie

~

50

~

.t
\> 20
~

"C
0

.t

""
'6

10

.~

~

cil

5

0

~

0.1

0.2

0.5

1

Collector Current Ie (A)

Collector-Base Voltage V eB (V)

Thermal Response

Pulse Width t1 (ms)

2-22

2SC3846

afi i!

~ m
CJ'"

3A

q!=1

~

~

"

r-: ;;...

-'L

0.01 0.02 0.05 0.1

0.2

D~ty Ratio - 1"

~~:t{~.~ot

,J'

~

4A

-1 II

o

Te = 25'c

Vee -400V
Ie -2A
Pw -60,..

r--..

-g'10

~6A

I~A

Ie lA
O.SA-=

~ .~
tlw

20

'i

}

.~ ~

t stg - 182

Te = 25'C
4A 6A
2A 3A

.1 1
ill
I-- Ie
·lll~J
w w
om I-- o·~III[11I
»2
II III
..
Ui
o
"
III
>ll'

0.5

2

1

'K.

r-..

- 0.2

-0.1

Base Current I B (A)

q~

lIB

-0.5

Base Current 182 (A)

20
Vee -400V
IB1 --IB2/3-le!10
10

]

Pw -60ps
t- Duty Ratio - 1"

'"
~

Pw " so,.s
Duty FIlitlo"'"

,......

....
2

:;

"-

1'\

~

~
i=

Vee -4OQV
le- 2A

...

5

:;

~~

Te=25'C

0.5

0.2

~7~

toto

';&.o~

1

'iD

q"'-i~

o. 1

11.

I

0

"

O.5

.~

tt-

'"
o. 2
o. 1
0.05

I'

,~

'-

0.05

-0.1

t,

-""
r'"

-0.2

U
1'1

·c- wc
---!!-ll1f1"C

t, -IBI
5

0.5

-0.5

Base Current 182 (A)

10

20

Te =25'C

Vee -4OQV
Ie -2A
'

Collector Current Ie (AI

0-

Pw-1IOjoa .'
]

0.2

~

Test Circuit for Switching Time

~

0.1

~{

/:

,',.

PW=50pS
DR = 1% ' -_ _>-_--<_~

0.1

"'15"

".:.~... '
J\.

."

I

0.05

"

'.

"'~

~
i=
it:

DUi l'Iatlo .; ,,,

0.2

I

0.5

Base Current IS1 (AI

2-23

2SC3846

Forward Bias Safe Operating Area - 2

Forward Bias Safe Operating Area - 1
Tc

=2SoC

Tc

= 100°C

~
5!

~
5!

c

c

~

~
u

u

(;

(;

]

~

8

~

Collector-Emitter Voltage VeE (V)

Collector· Emitter Voltage VeE (V)

Pc -T.

100
Ambient Temperature T a (Oe)

200

Test Circuit for VCEX(sus) and Reverse Bias Safe Operating Area
L"200~H

r-=,,",,""'''-.
VCEX(SUS):Vclemp ~900V

Ie'" 5A
IS2"'-O.6A

2-24

Raa'" 10n

Collector Voltage Vclamp (V)

00

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

2SC3847
Silicon High Speed Power Transistor
2SC3847 800V, lOA
ABSOLUTE MAXIMUM RATINGS
Parameter

Symbol

Conditions

Rating

Unit

-55 - +150

°c

TJ

+150

°c

Collector to Base Voltage

V CBO

1200

V

Emitter to Base Voltage

V EBO

7

V

Collector to Emitter Voltage

VCEO

800

V

Ic

10

Storage Temperature Range

T stg

Junction Temperature

Collector Current

ICM
Base Current

IB

Collector Power Dissipation

Pc

ELECTRICAL CHARACTERISTICS

IT.

A

Pw ~ 25/lS, D.R. ~ 50%

20
5

A

Tc = 25°C

85

W

= 2S0C)
Limit

Parameter

Symbol

Test Conditions

Collector to Base Breakdown Voltage

V(BR)CBO

Emitter to Base Breakdown Voltage

V(BR)EBO

IE = lmA, Ic = 0

Collector to Emitter Sustaining Voltage

V(BR)CEO

Ic = lOrnA, RBE =

Collector to Emitter Sustaining Voltage

VCEX(SUS)

Collector Cutoff Current

Iceo

Ic = 1mA, IE = 0

Unit
Min.

Typ.

Max.

1200

-

-

V

7

-

-

V

800

-

-

V

Ic = 7A, IB2 = -1.2A,
L = lmH*

900

-

-

V

Vce = 1000V, IE = 0

-

-

100

p.A

V CB = 1000V, IE = 0,
T c =100·C

-

-

1

rnA

oon

Emitter Cutoff Current

lEBO

V Ee =6V,l c =0

-

-

100

/lA

DC Currentt Gain

hFE

VCE = 5V, Ic = 4A**

10

15

30

-

Collector to Emitter Saturation Voltage

VCE (.. ,)

0.3

1.5

V

Ic = 4A, Ie = O.SA"
Base to Emitter Saturation Voltage

V BE (.. ,)

-

1.0

2.0

V

Output Capacitance

Cob

Vce = 10V, IE =0. f= 1MHz

-

220

Gain Bandwidth Product

fT

VCE = 10V,I c =O.lA

-

15

-

MHz

Rise Time

tr

-

0.20

0.5

/lS

Vcc = 400V
Ic =4A,31Bl =-le2=1.2A*

2.50

3.5

/lS

0.07

0.3

/ls

Storage Ti me

t stg

Fall Time

t,

'1 Test Circuit

pF

'*2 Pulse Pw ~ 300/lS, Duty Ratio ~ 6%

Copyrlglll© 11190 by FUJITSU U ..lED ond Fu.lou _ o n l... Inc.

2-25

2SC3847

VeE (satl. VBE (sat) - Ie

hFE -Ie

~~

..

-;;

w

==
ww

ff

U

III

»

c

'iQ

&

"

:l

c
l!!

'0

>

5

u

c
0

U

.~

0

~

.,10

IfII

Collector Current Ie (AI

Collector Current Ie (A)

fT -Ie
N

:r

e

.c

~

0

u

g

1!c

¥

:l
'~

Q.

~
'~

a
;;
9

'tI

c

.!!

c5

c

~
Collector Current Ie (AI

Collector-Base Voltage VI

Pulse Width t, 1m,)

2-26

2SC3847

IC· 'A

2A

II 1\ II
U ill I
I U
i .1
I
I
i3A

1

7

......

r-

JJJ

2

I II

0

-0.2

0.05 0.1

0.2

0.2

0.5

1

2

Base Current 18 (A)

'

.~-

l-::::;;fil!
1\ Vce

1\

I II

~

~~O

AlBA

\

=

25"C

Vcc· 4OOV
IC· 4A
PW· 60,..
DutyRltlo -1%

Vee
lOA

A

Ic· 'A

TC

20

3A 4A 6A 7A 10A

5

10

~1Fj

r--:-

"'

~
'j 1'-.

-0.5
-1
Base Current '82 (AI

-

5

]
;r

j
.;
~
i=

m

c

~

Base Current 182 (A)

'"
0.1

Collector Current Ie (A)

Test Circuit for Switching Time

Pw '" 60/015

C.R. '" 1% L -_ _+-_ _+-~

IB1 "-1 8 2= le/lO

"

Base Current 181 (A)

2-27

2SC3847

Forward Bias Safe Operating Area - 2

Forward Bias Safe Operating Area - 1

Tc = 100'C

Tc = 25'C

5

5

~

~

~

a

E
~

<3

j

t;

]
;3

"0

u

Collector-Emitter Voltage VeE IV)

Collector-Emitter Voltage V CE (V)

Reverse Bias Safe Operating Area

Pc -Ta

5

~

~

...

CJ

E

c

~

0

"i

u

~

j

t;

u

"0

~

"0

u

Collector Voltage Vclamp (V)

Ambient Temperature Ta (oC)

Test Circuit for VCEX(sus) and Reverse Bias Sate Operating Area
L"' 200I'H

r=""''''''n"'-~

t, ... Leallfle)
vee

2-28

cO

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

2SC3947
Silicon High Speed Power Transistor
2SC3947 500V, 5A
ABSOLUTE MAXIMUM RATINGS
Rating

Unit

-55 - +150

°c

TJ

+150

°c

Collector to Base Voltage

V CBO

850

V

Emitter to Base Voltage

V EBO

7

V

Collector to Emitter Voltage

V CEO

500

V

Parameter

Symbol

Storage Temperature Range

T stg

Junction Temperature

Collector Current

Conditions

5

Ic

Base Current

IB

Collector Power Dissipation

Pc

A

Pw ;;;: 25/.1s, D. R.;;;: 50%

ICM

8

T C = 25°C

2

A

70

W

ELECTRICAL CHARACTERISTICS (T. = 25°C)
Limit
Parameter

Symbol

Test Conditions

Unit
Min.

Typ.

Max.

V

Collector to Base Breakdown Voltage

VIBR)CBO

Ic = 1mA,IE =0

850

-

Emitter to Base Breakdown Voltage

VIBR)EBO

IE = 1mA,Ic =0

7

-

Collector to Emitter Sustaining Voltage

VIBR)CEO

Ic = 10mA, RBE =

500

-

-

Collector to Emitter Sustaining Voltage

VCEXISUS)

Ic = 3A, IB2 = -1A,
L = 200/.lH*

700

-

-

V

V CB = 800V, IE = 0

-

-

100

/.I A

Collector Cutoff Current

ICBO

V CB = 800V, IE = 0,
Tc=100°C

-

-

1

rnA
/.IA

oon

V

V

Emitter Cutoff Current

lEBO

V EB =6V,l c =0

-

-

100

DC Currentt Gain

hFE

VCE = 5V, Ic = 2.5A **

10

15

30

-

Collector to Emitter Saturation Voltage

VCEI ..,)

0.5

1.0

V

Base to Emitter Saturation Voltage

VBE(sat)

1.2

1.5

V

Output Capacitance

Cob

V CB = 10V, IE =0, f= 1MHz

70

-

pF

Gain Bandwidth Product

fT

VCE = 10V, IE = 0.5A

Rise Time

t,

Storage Ti me

t stg

-

Fall Time

tf

Ic = 2.5A, I B = 0.5A **

Vcc = 250V
Ic = 2.5A, 21., = -IB2 = 1A

-

20

-

MHz

0.18

0.5

/.Is

1.50

3.0

/.Is

0.07

0.3

/.Is

"1 Test Circuit **2 Pulse Pw ;;;: 300/.ls, Duty Ratio;;;: 6%
Copyrlght@ ..00 by FUJITSU UlIiTED ond FujItou _ _ I... Inc.

2-29

2SC3947

VCE (sat), VBE (sat) - Ic

W
IL

.c
C

'm

CI
c

~

8
c<>

IDI

Collector Current Ie (A)

Collector Current Ie (A)

Collector Current Ie (A)

Collector-Base Voltage VeB (V)

Pulse Width tl (m.)

2-30

2SC3947

I~ !!fO.5A

5

4A III
2A 3A
SA

lA

'"

2

BAA

j::

VSE

3A
1

le· O•SA

lA

2A

VCC-2liVV.lc·2;~:

~

.E

t-.

2

F

B 1

i-

,... Duty

1',."

'"

I....
V6,,1

.J ,I;

Rltlo • 0.2'16

~·jB1L'A
('j .
~h:1··
; O.6A
O.26A

0.5
-0.2

-0.5

-1

-2

Base Current I 92 (A)

0,01 0.02

0.05 0.1

0.2

0.5

Base Current I B (A)

Base Current I 92 (A)

Collector Current Ie (A)

Test Circuit for Switching Time

~

F

.~

0::

Base Current 'S1 (A)

2-31

2SC394?

Forward Bias Safe Operating Area - 1
Tc

=

Forward Bias Safe Operating Area - 2
Tc = 100°C

25Q C

10

~
J!
c

~

()

0.5

j
"0

0.2

()

0.1
0.05

Collector-Emitter Voltage VeE (V)

Collector-Emitter Voltage VeE (V)

Reverse Bias Safe Operating Area

~

u

~

c

J!

"0

c

l

~

()

is

j

i

"0

"0

()

()

Collector Voltage Vcl amp (V)

Ambient Temperature Ta lOCI

Test Circuit for VCEX(sus) and Reverse Bias Safe Operating Area
L" 200$lH
200n

~T.-U.""T"'.m-~

VCEXISUS): Vel amp ~450V

Ie

"--+---'----<---'

2-32

~~~v

~
"

Ie'" 2A

RBB '" 5n

IS1"'-ls2"'lA

,

OJ

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

2SC3948
Silicon High Speed Power Transistor
2SC3948 SOOV. 10A
ABSOLUTE MAXIMUM RATINGS
Parameter

Symbol

Rating

Unit

-55-+150

°c

TI

+150

°c

Collector to Base Voltage

V CBO

B50

V

Emitter to Base Voltage

V EBO

7

V

Collector to Emitter Voltage

V CEO

500

V

Storage Temperature Range

T stg

Junction Temperature

Collector Current

Conditions

Ic

10

ICM

Base Current

IB

Collector Power Dissipation

Pc

A

Pw ~ 25j.ls, D.R. ~ 50%

15
4

A

Tc = 25°C

75

W

ELECTRICAL CHARACTERISTICS (T. = 2S0C)
Limit

Parameter

Symbol

Test Conditions

Unit
Min.

Typ.

Max.

Collector to Base Breakdown Voltage

V1BR)CBO

Ic = lmA, IE =0

850

-

V1BR)EBO

IE = lmA, Ic = 0

7

-

-

V

Emitter to Base Breakdown Voltage
Collector to Emitter Sustaining Voltage

V(BR)CEO

Ic = lOrnA, RBE =oon

500

-

-

V

Collector to Emitter Sustaining Voltage

VCEX(SUS)

Ic = 4A, IB2 = -2A,
L = 200j.lH"

700

-

-

V

V CB = 800V, IE = 0

-

-

100

j.lA

Collector Cutoff Current

ICBO

V CB = 800V, IE = 0,
Tc=100°C

-

-

1

rnA

V

Emitter Cutoff Current

lEBO

V EB = 6V, Ic = 0

-

-

100

j.lA

DC Currentt Gain

hFE

VCE = 5V, Ic = 5A""

10

15

30

-

Collector to Emitter Saturation Voltage

V CE1s.,)

0.5

1.0

V

Ic =5A, IB = lA""

Base to Emitter Saturation Voltage

VSE(satl

-

1.2

1.5

V

Output Capacitance

COb

V CB = 10V, IE =O,f=lMHz

-

130

pF

Gain Bandwidth Product

fT

VCE = 10V, Ic = lA

-

20

-

MHz

0.18

0.5

j.lS

1.50

2.5

j.lS

0.07

0.3

j.lS

Rise Time

t,

Storage Ti me

tst9

Fall Time

t,

Vcc = 250V
Ic =5A,2I s1 =-l s2 =2A"

'1 Test Circuit "2 Pulse Pw ~ 300j.lS, Duty Ratio ~ 6%

2-33

2SC3948

VCE (sat). VBE (sat) - Ic

~ ~

5 ~ 0.5
> >

Collector Current Ie (A)

Collector-Base Voltage Vee (V)

Collector Current Ie (A)

Thermal Response

Pulse Width

t,

(ms)

32

2-34

2SC3948

VeE. VBE -IB
4A
2A 3A 6A 7A

ICi.1A

~
w_
u>
>-

Tc=25°C

lOA

J

8, ~2

~

l!i>
"0 !!,
> ~

;;:

~

.~ ~

~.~ 1
~afi,

,

1-.

.ll
Ic· 'A

0.5

A

~

A:1~J,.

Vcc:-2!iOV.IC·~ Out

]

r-...' ,,'

"'"

IEi,'-2A
I",IA

.6~-+5

0.5
Base Current 182 (AI

~ ~

Ual

a
0.010.02

0.05 0.'

0.2

0.5

2

Base Current I B (A)

trt t stg • tr - Ie

0.5
Base Current 182 (A)

t, -IBI

Collector Current Ie (A)
Test Circuit for Switching Time

v,"
~'~Q

D.R. "1% ' -_ _,*-':"':''-,*---'

~

2-35

2SC3948

Forward Bia. Safe Operating Area - 1

Forward Bia. Safe Operating Area - 2

• 25'C

TC' IOO'C
20
10

~
.2
~

~
~

tJ

0.5

5

~

0.2

0

tJ

0.1
0.05
0.02
Collector-Emitter Voltage VeE (V)

Collector-Emitter Voltage VeE (V)

Pc -T.

!

...u
~

0

!

~
.2

"=
is

I

~

e

8

'&
tJ

~

'&
tJ

Ambient Temperature Ta (DC)
Test Circuit for VCEX(sus) and Reverse Bias Safe Operating Area
L"~H

~ct"---...,

1_:_:_':_'..Jj~L

,-_-+---,--,---,-_..
t1 :;

2-36

Lc~~:cl

"

Collector-Emitter Voltage V clamp (V)

OJ

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

2SC3949
Silicon High Speed Power Transistor
2SC3949 500V, 15A
ABSOLUTE MAXIMUM RATINGS
Parameter

Symbol

Rating

Unit

-55 - +150

DC

+150

DC

V CBO

B50

V

V EBO

7

V

V CEO

500

V

Storage Temperature Range

T stg

Junction Temperature

TJ

Collector to Base Voltage
Emitter to Base Voltage
Collector to Emitter Voltage
Collector Current

15

Ic

A

Pw ~ 25j.1S. D.R. ~ 50%

ICM
Base Current

Conditions

20
6

A

80

W

IB

Collector Power Dissipation

Tc = 25 DC

Pc

ELECTRICAL CHARACTERISTICS (T. = 25°C)
Limit

Parameter

Symbol

Unit

Test Conditions
Min.

Typ.

Max.

Collector to Base Breakdown Voltage

V(BR)CBO

Ic = 1mA, IE = 0

850

-

-

V

Emitter to Base Breakdown Voltage

V(BR)EBO

IE = 1mA,Ic =0

7

-

V

Collector to Emitter Sustaining Voltage

V(BR)CEO

Ic = 10mA, RBE =

500

-

-

Collector to Emitter Sustaining Voltage

VCEX(SUS)

Ic = 6A, IB2 = -4A,
L = 200j.lH*

700

-

-

V

V CB = BOOV, IE = 0

-

-

100

j.lA

Collector Cutoff Current

ICBO

V CB = BOOV, IE = 0,
Tc=100°C

-

-

1

mA

Emitter Cutoff Current

lEBO

V EB = 6V, Ic = 0

-

-

100

j.lA

hFE

VCE = 5V, Ic = 10A**

10

15

30

-

-

0.5

1.0

V

1.2

1.5

V

260

-

pF

20

-

MHz

-

0.18

0.5

j.ls

-

1.50

3.0

j.ls

0.07

0.3

j.IS

DC Currentt Gain
Collector to Emitter Saturation Voltage

VeE (sat)

Base to Emitter Saturation Voltage

VBE(SO')

oon

Ic = 10A, IB = 2A**
Output Capacitance

Cob

V CB = 10V, IE =0, f= 1MHz

Gain Bandwidth Product

fT

VCE = 10V, Ic = 2A

Rise Time

t,

Storage Time

t stg

Fall Time

tf

Vcc = 250V
Ic = 10A, 2181 = -IB2 =4A *

V

*1 Test Circuit **2 Pulse Pw ~ 300j.lS, Duty Ratio ~ 6%
.Copyrlght@ , ... .., FWITSU UIllTED .... Fu'.... _ _ Inc.

2-37

2SC3949

VCE (sat). VBE (sat) - Ic

hFE - IC

w

Ie

.<=

c

~

8,

E

l!!
0

~

5
(.)

>
c
0

(.)

'"
.,~

0

~

Collector Curren t ic{A,

CoHectoi Current Ie (A)

Cob -VCB

u:
.s

~
~
~

.c
0

(.)

g
'tJ
e

~

..

l!!

1

.<=

-li

c:l

'~

;;
0.
;;

-g
&l

.

0

c

'

"

Collector-Base Voltage VCB (VI

Collector Current 'c(A)

Thermal Response

Pulse Width t1 (msl

2-38

T c =25'C

TC = 25"C

2SC3949

VCE. VBE -IB

TC::: 25° C

le·'~~~~~~~~~++~+--1
lA 2A 3A 5A 7A lOA l5A

lSI -3A

11

l~

ru

~

20

ru

> g>

"

"
~g

]"UJ'§~ '~~~~~~~c!mE~bj:t~
~

r....'
r....,

~ r....

..

o

"-.,.
'"

~

0.5

.!!. o8lJ~~~

oUal~

0.05 0.1 0.2

0.5

1

10

Vee· 260V. Ie = lOA. Duty Re'loI I II II
I ' 0.2%
0.5

'T

T

Base Current IB2 (A)

20

Base Current 18 (AI

Vee = 250V, Ie • lOA. Duty Astlo

=0.2%

0.2
Te =100'C

IIIII~ t--

;!;'

Tlel=tI5~ r-- r--

Jilli

~tgl

Puis. Width - 50,.,
Duty Ratio = 0.2%

ru

.~

lA-

LL

I

f--

0.5

I

0.5

Te = 100"C

Base Current 182 (A)

I.

II

m
c

en

;::
m 0.05

~

;::

§

j!A

E

1 Vee = 250V. 'Bl = -IS2/2 - le/5

E

~

O. 1

IBY:?

~:Te0.2

O.

1

25°C

TC=2SO~

1,.

~p.

tf

0.05

V
10

t, -IBI

20

Collector Current Ie (A)

.:

Test Circuit for Switching Time

R .I,J\~~,
L

-

LG82

0.21-++H-ttf+-,...,."....r--l--l-1

O"~m

0.05B3::!
0.5

Base Current 'S1 (A)

37

2-39

2SC3949

Forward Bias Safe Operating Area - 1
Tc

Forward Bia. Safe Operating Area - 2

=25"C

= 100"C

O'i.~.

0.05

5
Collect~r·Emltter Voltage VeE (V)

Collector-Emitter Voltage VeE (V)

Pc -T.
Reverse Bias Safe Operating Area
"..."..,...T",c",=..,.25' C - 150' C

!

..

5

0

2

0

<

.~

~
§

Q.

"ji

i5

(J

j

15

~

8

'0
(J

Ambient Temperature Ta fC)
Collector-Emitter Voltage V clamp (V)
Test Circuit for VCEX(sus) and ReVerse Bias Sate Operating Area

2-40

Section 3
Darlington Transistor Arrays -

At a Glance

Page

Davlce

ease(ns)

Polarity

3--9

FT5753M
FT5756M

R~

3-11

FT5754M
FT5757M

R~

3-13

FT5755M
FT5758M

R~

3-15

FT5759M

R~

3-17

FT5760M

R~

3-19

FT5761M

R~

3-21

FT5763M
FT5766M

RM-67

3-23

FT5764M
FT5767M

RM-67

3-25

FT5769M

RM-67

3-27

FT5770M

RM-67

3-29

FT5776M

R~

NPN
NPN
NPN
NPN
NPN
NPN
PNP
PNP
PNP
NPN
NPN
NPN
NPN
PNP
PNP
NPNlPNP

3-33

FT5777M

R~

3-37

FT5778M

3-41

3-45

Maximum Ratings
VCEo(V) Ie (A)
100
100

±1.5
±1.5

100
100

±3
±3

100
100

±5
±5

-100

±1.5

-100

±3

-100

±5

100
100

±1.5
±1.5

100
100

±3
±3

-100

±1.5

-100

±3

100
-100

±1.5

NPNlPNP

100
-100

±3

R~

NPNlPNP

100
-100

±5

FT5766M

RM-67

NPN/PNP

100
-100

±1.5

FT5787M

RM-67

NPN/PNP

100
-100

±3

3-1

Field Effect Transistor Amlys

3-2

Power Transistor Products

Darlingron Transistor A"ays

Power Transistor Products

INTRODUCTION
DARLINGTON TRANSISTOR ARRAY SERIES
Description
This series is Silicon Darlington Transistor Arrays. Each array consists of 4-Darlington
Transistors. The array is packaged in a small plastic 12-pin single in-line package with or
without an isolated heatsink.
The series is well suited for motor drive applications where IC outputs must be boosted
to drive print hammers. The series are extremely cost effective and space saving compared
to using four separate TO-220 type Darlington transistors.

Features

Application

•
•
•
•

• Solenoid Drives

4-Circuits included in one package
Large DC Current Gain
Large Collector Power Dissipation
Fastrecovery diode included to absorb
fly-back voltage
• Fast switch ing speed

Printer Head Drives
Hummer Drives

• Motor Drives
• Amplifiers

Outline of the .erie.
Device Type

NPN
2 devices + 2 devices

NPN
4 device independent

PNP
4 device independent

NPN + PNP
2NPN + 2PNP independent

Diode"

Ves

No

No

No

Ie = 1.5A

Ie = 3.0A

FT5753M

FT5754M

FT5763M

FT5764M

Circuit A

Circuit A

FT5756M

FT5757M

FT5766M

FT5767M

Circuit C

Circuit C

FT5759M

FT5760M

FT5769M

FT5770M

Circuit E

Circuit E

FT5776M

FT5777M

FT5786M

FT5787M

Circuit F

Circuit F

Ie = 5.DA

FT5755M
Circuit B

FT5758M
Circuit 0

FT5761M
Circuit E

FT5778M
Circuit F

* Diode: Fast recovery diode which absorb fly back energy.

3-3

Darlington Transistor Arrays

Power Transistor Products

DARLINGTON TRANSISTOR ARRAY SERIES
• Selection Guide
RM·65 Series
Device Number

V eBO
((V)

V eEo
(V)

Ie
DC
(A)

lep
Pulsed
(A)

'PT
Ta = 25°C

'PT
Tc = 25°C

(W)

(W)

h Fe
TYP.

PAGE
~-.-

NPN

lID
PNP

FT5753M

150

100

±1.5

±3

4

19

6000

3-9

FT5754M

150

100

±3

±5

5

21

6000

3-11
3-13

FT5755M

150

100

±5

±8

5

25

4000

FT5756M

150

100

±1.5

±3

4

19

6000

3-9

FT5757M

150

100

±3

±5

5

21

6000

3-11

FT5758M

150

100

±5

±8

5

25

4000

3-13

FT5759M

-100

-100

±1.5

±3

4

19

6000

3-15

FT5760M

-100

-100

±3

±5

5

21

6000

3-17

FT5761M

-100

-100

±5

±8

5

25

6000

3-19

FT5776M

100
-100

100
-100

±1.5

±3

4

19

6000

3-29

FT5777M

100
-100

100
-100

±3

±5

5

21

6000

3-33

FT5778M

100
100

100
100

±5

±8

5

25

6000

3-37

NPN

+
PNP

.

4 Darlington TranSIStors

RM·67 Series
Device Number

NPN

PNP

NPN

V eEo
(V)

Ie
DC
(A)

lep
Pulsed
(A)

'PT
Ta = 25°C

'P T
Tc = 25°C

(W)

(W)

hFE
TYP.

150

100

±1.5

±3

3.5

17

6000

3-21

FT5764M

150

100

±3

±5

4

19

6000

3-23

FT5766M

150

100

±1.5

±3

3.5

17

6000

3-21

FT5767M

150

100

±3

±5

4

19

6000

3-23

FT5769M

-100

-100

±1.5

±3

3.5

17

6000

3-25

FT5770M

-100

-100

±3

±5

4

19

6000

3-27

FT5786M

100
-100

100
-100

±1.5

±3

3.5

17

6000

3-41

100
-100

100
-100

±3

±5

4

19

6000

3-45

FT5787M

*4 Darlington Transistors

3-4

PAGE

FT5763M

+
PNP

V eBO
(V)

Power Transistor Products

Darlington Transistor Arrays

CIRCUIT AND PIN ASSIGNMENT
A

B
3

9

4

10

11

D7

13: FIN (N.C.)

13: FIN (N.C.l

0, ..... 04: Flywheel diode
05- 08: Fast recovery diode to absorb fly-back voltage
R 1 -R4: -10011

0, ...... 04: Flywheel diode

lID

05 ..... OS: Fast recovery diode to absorb fly-back voltage

R 1-R4: :'2kl1
Rs-Rs: :, 20011

o

c

10

6

13: Fin (N.C.)

13: Fin (N.C.)

0,-04: Flywheel diode
Rl-R4: ';2kl1
RS-RS :, 20011

0,- 04: Flywheel diode
Rl-R4: -10011

F

E

13: Fin (N.C.)

0,- 04: Flywheel diode

3-5

Darfington TfBllsistor AllaYs

Power Transistor Products

PACKAGE DIMENSIONS

O,21MAX
(S.3MAXJ

0.079
12.0)

O.088It
(~:~)

U.it~~;"l"";"":·:

3-6

Darlington Transistor Arrays

Power Transistor Products

Applications for solenoid drives and motor drives
1)

General Discription
In solenoid drive applicatins and motor drive applications, the fly-back voltage is generated at the mode of a transistor
inductive turn-off.
The darlington transistor array series (FT5753M, FT5754M, FT5755M, FT5763M, FT5764M) can easily absorb the
fly-back energy through the fast recovery diodes with the flywheel diode connected between the collector and emitter of
the Darlington pair. This guarantees the arrays a very efficient operation.
•

Flyback energy absorption circuit

Fig. 1 shows the equivalent drive circuit for a single device of the DLTARY.
During the turn-on mode of the darlington transistor (Q). the current (it) flows through the inductive load (L).
During the turn-off of the darlington transistor (Q), the fly-back energy which is stored in the inductive load (L) is
absorbed by current (id which flows through the fast recovery diode.
Fig. 1- Circuit for absorbing fly-back energy

i-I

:

0

I
I
I
I
I

I
I
I
I

it

I

ON

Jb

IiQi

I
I

ON state

I
I
I
__ JI

2)

Solenoid drive circuit
Four solenoids can be driven by one DLTARY.
Fig. 2- Solenoid drive circuit
Vee

Q

r---------------,

DZ

I

I
I
I

Q

DLTARY

l
Dz

Solenoid

R

Drive current limiting
resistance

Speed~up

zener diode

Vee: Collector supply voltage
VD : Drive voltage

Control

Ie

I

I

L ___ _

I
I

I

_ _ _ _ _ _ _ _ --lI

3-7

Darlington Transistor Arrays

3)

Power Transistor Products

Motor Drive

3-1)

Driving form (ex. 4·phase motor)
Motors may be driven in either a unipolar or (Fig.·3(a)) bipolar manner (Fig.·3(b)). The Current in uni·polar mode
flows in only one direction while the current in bi·polar mode flows in both directions.
Fig.3-(a)

Fig. 3,...(b) Bipolar driving form
• Large Output Torque

Uni·polar driving form
* Easy Construction

T

3-2)

Principle circuit for pulse width modulate drive
Fig. 4- Principle circuit for pulse width modulate drive

"... ,.------------------'\
I

;

I

I

I

,
I

I

I

I

I

I

t

I
I
I

I

D21

I
I

I
I

I

\

.. )

I

I

I

I

I
I

I
I

I
I

,
,I
' ... _ - - - - - /

\

Example of Pulse Width Modulate Drive

3-8

D,

The output current is controlled by the pulse width of modu·
lator transistor (Tr,), when the PWM transistor (Tr,) is in the
off·state and the darlington transistor (Tr2) is in the on'state,
the current flows through the fast recovery diode (02 ), (Solid
line)
In this mode the fast recovery diode operates similarly to a fly·
wheel diode.
When both the PWM transistor (Tr,) and darlington transistor
are in the off·state current flows through the flywheel diode.
(Dashed line)
In this mode, the current flows back to the DC power supply to
improve the operating efficiency.

cP

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

FT5753M, FT5756M
Silicon Darlington Transistor Array
ABSOLUTE MAXIMUM RATINGS
Symbol

Rating

Condition

Value

Unit

-55 - +150

°c

+150

°c

Storage Temperature

Tst9

Junction Temperature

T

Collector to Base Voltage

V CBO

150

V

Em itter to Base Voltage

V EBO

5

V

Collector to Emitter Voltage

V CEO

100

V

±1.5

A

Collector Current

I (Pulsed)

(Continuous)

Base Current (Continuous)

Ic
Icp

Pw ~ 1 ms, D,R. ~ 50%

IB

±3

A

0.1

A
A

IFM

Pw ~ 0.5 ms, D.R. ~ 25% (*)

1.5

I FSM

Pw ~ 100 ms, Single Pulse (*)

3

A

Diode Reverse Voltage

VR

Pin 3-Pin 2,4. Pin 10-Pin 9,11 (,)

110

V

500

V r •m . s.

Diode Forward Current

Isolation Voltage

ViSD

Fin 13 - Pin 1 - 12

Collector Power Dissipation

Pc

Ta = 25°C: Single DL T operation

Total Collector Power Dissipation

PT

Ta = 25°C: 4-DL T operation

Total Collector Power Dissipation

PT

Tc = 25°C: 4-DL T operation
(,) Fast recovery Diode

1.9

W

4

W

19

W

DL T: Darlington Transistor

ELECTRICAL CHARACTERISTICS
Single Darlington Transistor Operation

Parameter

Symbol

Collector to Base Breakdown Voltage

V(BRiCBO

Ie = 100 /lA.

Emitter to Base Breakdown Voltage

V(BR)EBO

IE = 70 rnA. Ie = 0

Collector to Emitter Breakdown Voltage

V(BR)CEO

Ic = 10 rnA.

Collector Cutoff Current
DC Current Gain

IE = 0

RBE

==

00

V CB = 100 V, IE = 0

hFE1

Ic = 0.75 A, VCE = 5 V (**)

hFE2

Ic

VeE',.,

Base to Emitter Saturation Voltage

VBE(s.,)
ton

= 1.5 A,

VeE = 5 V

(**)

le= 0.75A. IB = 1.5 rnA (

Storage Time

t,tII

VCC = 30 V
Ic =0.75A

Fall Time

tf

IB1

= -IB2

= 1.5 rnA

..

)

(***)

Unit

Typ.

Max.

150

-

5
100

-

-

-

-

10

2000

6000

15000

-

-

-

-

-

1.1

1.5

V

-

1.6

2.0

V

-

0.5

-

/lS

-

2.1

/lS

-

0.4

-

Min.

ICBO

Collector to Emitter Saturation Voltage
Turn-On Time

Limit

Test Condition

500

V
V
V
/lA

/lS

Singl. F••trecovery Diode Operation (FT5753M Only)

Parameter

Symbol

Limit

Test Condition
Min.

Typ.

-

Forward Voltage

VF

IF -100 rnA

-

Reverse Current

IR

V R = 100 V

-

VR

IR = 10/lA

Reverse Voltage

(.. ) Pulsed

Pulse Width ~ 300 /lS
Duty Ratio ~ 6%

110

(.. ,) Pulsed

Unit
Max.
1.0

V

5

/lA

-

V

Pulse Width = 50 /lS
Duty Ratio ~ 1%

Copyrlght@ , ... by FWITSU U..TED ..... FuJIOU _ _1... 1....

3-9

FT5753M, FT5756M

DC CURRENT GAIN

Collector Current Ie (A)

Ell

SATURATION VOLTAGE

SWITCHING TIME

Collector Current Ie (AI

FORWARD BIAS SAFE OPERATING
AREA

Collector Current Ie (AI
Collector to Emitter Voltage Vee (V)

COLLECTOR SATURATION REGION

POWER DISSIPATION DERATING

Base Current I B (mAl

Ambient Temperature Ta (OC)

3-10

o':J

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

FT5754M, FT5757M
Silicon Darlington Transistor Array
ABSOLUTE MAXIMUM RATINGS
Rating

(Ta = 25°C)
Symbol

Storage Temperature

Tstg

Junction Temperature

TJ

Condition

Value

Unit

-55-+150

°c

+150

°c

Coliector to Base Voltage

V eBo

150

V

Emitter to Base VoJtage

V EBO

5

V

Coliector to Emitter Voltage

V eEo

100

V

Coliector Current

:

(Continuous)

Ie

(Pulsed)

Icp

Base Current (Continuous)

Pw ;;;; 1 ms, D.R.;;;; 50%

IB

±33

A

±5

A

0.2

A

IFM

Pw ;;;; 0.5 ms, D.R.;;;; 25% (")

3

A

I F8M

Pw";: 100 ms, Single Pulse (")

5

A

Diode Reverse Voltage

VR

Pin 3-Pin 2,4. Pin 10-Pin 9,11 (0)

110

V

Isolation Voltage

Viso

Fin 13 - Pin 1 -12

500

Vr .m

Coli ector Power Dissipation

Pc

Ta = 25°C: Single DL T operation

2.3

W

Total Coliector Power Dissipation

PT

Ta = 25°C: 4·DL T operation

5

W

Total Coliector Power Dissipation

PT

Tc = 25°C: 4·DL T operation

21

W

Diode Forward Current

(") Fast recovery Diode

.s .

DL T: Darlington Transistor

ELECTRICAL CHARACTERISTICS
Single Darlington Transistor Operation

Parameter

(Ta = 25°C)
Symbol

Limit

Test Condition

Unit

Min.

Typ.

Max.

-

V

-

V

Collector to Base Breakdown Voltage

V(BR)eBO

Ie = 100llA,

IE = 0

150

-

Emitter to Base Breakdown Voltage

V(BR)EBO

IE = 70 mA,

Ie = 0

5

Collector to Emitter Breakdown Voltage

V(BR)eEO

Ie = 10mA,

RBE

-

-

-

10

IlA

Coliector Cutoff Current

leBo

DC Current Ga in

= 00

100

V eB - 100 V, IE - 0

hFE1

le= 1.5 A,

VeE - 5V

(**)

2000

6000

15000

-

hFE2

Ie - 3.0 A, VeE - 5V

(**)

500

-

-

-

(**)

-

Collector to Emitter Saturation Voltage

VCE(sat)

Base to Emitter Saturation Voltage

VBE(sat)

Ie = 1.5 A, IB =3 mA

Turn·On Time

ton

Storage Time

tst9

Vee=30V
Ie = 1.5 A

Fall Time

tf

IB1 = IB2 = 3 mA

(***)

-

1.2

1.5

V

1.7

2.0

V

0.6

-

lIS

1.8
0.6

-

!lS

Single Fastrecovery Diode Operation (FT5754M Only)
Parameter

Test Condition

Forward Voltage

VF

IF -100 mA

Reverse Current

IR

V R -100V

VR
(.. ) Pulsed

IR

= 10llA

Pulse W,dth;;;; 300 lIS
Dutv Ratio ;;;; 6%

.Copyrlght© 11190 br FWITSU U..TED _

Fuji'"

lIS

(Ta = 25°C)

Symbol

Reverse Voltage

V

Limit

Unit

Min.

Typ.

Max.

-

-

1.0

-

5

110
(... ) Pulsed

-

V
IlA

-

V

Pulse W,dth= 50!lS
Duty Ratio;;;; 1%

_-"'00,'''''
3-11

FT5754M, FT5757M

DC CURRENT GAIN

SWITCHING TIME

0

Ta"" 25 C

o

~

,3

"o

0.02

0.1

0.1

IIDI

0.2

0.5

Collector Current Ie (A)

Collector Current Ie (A)

FORWARD BIAS SAFE OPERATING
AREA

SATURATION VOLTAGE

o

~

8

Collector Current Ie (A)

Collector to Emitter Voltage V CE (V)

COLLECTOR SATURATION REGION

Base Current I B (mA)

3-12

POWER DISSIPATION DERATING

Ambient Temperature Ta ("C)

cP

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

FT5755M, FT5758M
Silicon Darlington Transistor Array
ABSOLUTE MAXIMUM RATINGS
Rating

(Ta = 25°C)
Symbol

Value

Unit

-55 - +150

°c

+150

°c

Condition

Storage Temperature

T stg

Junction Temperature

Tj

Collector to Base Voltage

V CBO

150

V

Emitter to Base Voltage

V EBO

7

V

Collector to Emitter Voltage

V CEO

100

V

5

A

8

A

0.5

A
A

Collector Current

I

(Continuous)

Ic

I

(Pulsed)

lep

Base Current (Continuous)

Pw sIms. D.R. s 50%

IB
IFM

Pw ~ 0.5 ms, D.R. ~ 25% (*)

5

I FSM

Pw S 100 ms, Single Pulse (*)

8

A

Diode Reverse Voltage

VR

Pin 3-Pin 2,4. Pin la-Pin 9,11 (*)

110

V

Isolation Voltage

Viso

Fin 13-Pin 1-12

500

Vr .m .s .

Collector Power Dissipation

Pc

Ta = 25°C: Single DLT operation

2.5

W
W
W

Diode Forward Current

Total Collector Power Dissipation

PT

Ta = 25°C: 4·DL T operation

5

Total Collector Power Dissipation

PT

Tc = 25°C: 4-DL T operation

25

(*) Fast recovery Diode

D L T: Darl ington Transistor

ELECTRICAL CHARACTERISTICS
Single Darlington Transistor Operation

Parameter

(Ta = 25°C)
Symbol

Test Condition

Collector to Base Breakdown Voltage

';/(BR)CBO

Ic = 100ltA,

IE - 0

Collector to Emitter Breakdown Voltage

V(BR)CEO

Ic = 25 rnA,

RBE =

lEBO

V EB = 7V,

Ic = a

Emitter Cutoff Current
Collector Cutoff Current
DC Current Gain

Limit

00

..

Min.

Typ.

Unit
Max.

150

-

-

100

-

-

-

-

V
V
5

rnA

1

itA

ICBO

V CB = 100V, IE =0

-

-

hFEl

Ic=3A,

VCE = 2V

(**)

2000

4000

15000

-

hFE2

Ic =5A,

VCE - 2V

(**)

5000

-

-

-

Ic =3A,

IB = 3 rnA

(**)

Collector to Emitter Saturation Voltage

V CE (... )

Base to Emitter Saturation Voltage

VSE(sat)

Turn-On Time

ton

Storage Time

tstg

Fall Time

tf

VCC = 50 V
Ic =3A
IBI =-182 =3mA

(

)

(***)

-

1.2

1.5

V

-

1.6

2.0

V

1.0

-

Its

2.0

-

1.0

-

Its

(Ta = 2SoC)

Single Fastrecovery Diode Operation (FT575SM Onlyl

Parameter

Its

Limit
Symbol

Test Condition

Min.

Typ.

Max.

Unit

Forward Voltage

VF

IF -IA

-

-

1.0

V

Reverse Current

IR

V R - 100 V

-

-

10

itA

110

-

-

V

Reverse Voltage

VR
(**) Pulsed

IR = 15IJ.A
Pulse WIdth ~ 300 IJ.S
Duty Ratio ~ 6%

(***1 Pulsed

Pulse WIdth 50 IJ.S
Duty Ratio ~ 1%

--~-----------------------'opyrlgh'@ .190 by FUJITSU UIiTED ond ""'.... _ _ _ Inc.

3-13

IDI

FT5755M, FT5758M

DC CURRENT GAIN
SWITCHING TIME

!:;
~t

c

~

~
;::
m

c

~

0.5

.~

'"
0.5

10
Collector Current Ie (AI

0.1

0.5

0.2

Collector Current Ie (AI

FORWARD BIAS SAFE OPERATING
AREA
SATURATION VOLTAGE

~

Ta

= 25°C

1','"

!SI---,o-t-..z..'::"';Y"""-'-";I--"::"">

!
"

>

tg

6

'~

a

"l

Collector Current Ie (AI

10

50

20

100

200

Collector to Emitter Voltage VeE (V)

COLLECTOR SATURATION REGION

POWER DISSIPATION DERATING

~

w

"

>

t

g

Base Current IB lmAI

3-14

100
Ambient Temperature Ta (DC)

00

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

FT5759M
Silicon Darlington Transistor Array
ABSOLUTE MAXIMUM RATINGS
Symbol

Rating

Value

Unit

+lS0

°c
°c

V CBO

-100

V

V EBO

-S

V

V CEO

-100

V

±l.S

A

Tstg

Junction Temperature

Tj

Collector to Base Voltage
Emitter to Base Voltage
Collector to Emitter Voltage
Collector Current

I
I

(Continuous)

Ic

(Pulsed)

Icp

Base Current (Continuous)

Condition

-55 - +lS0

Storage Temperature

Pw

s: 1 ms, D.R. s: SO%

IB

±3

A

-0.1

A

SOO

V r. m .s.
W

Isolation Voltage

Visa

Pin 13-Pin 1-12

Collector Power Dissipation

Pc

Ta : 2SoC: Single DL T, operation

Total Collector Power Dissipation

PT

Ta : 2SoC: 4·DLT operation

4

W

Total Collector Power Dissipation

PT

Tc - 2SoC: 4·DLT operation

19

W

1.9

DL T: Darlington TranSistor

ELECTRICAL CHARACTERISTICS
Singl. Darlington Transistor Operation
Limit

Parameter

Symbol

Test Condition

Min.

Typ.

Max.

Unit

V(BRICBO

Ic: -100/LA,

IE: 0

-lS0

Emitter to Base Breakdown Voltage

VIBRIEBO

IE: -SOmA,

Ic: 0

-S

-

-

V

Collector to Emitter Breakdown Voltage

VIBRICEO

Ic : -10 rnA,

RBE =

-100

-

-

V

Collector to Base Breakdown Voltage

Collector Cutoff Current
DC Current Gain

ICBO

V CB : -90V, IE - 0

hFE1

Ic : -0.75 A,

hFE2

Ic: -1.5 A,

Collector to Emitter Saturation Voltage

VCE(sat)

Base to Emitter Saturation Voltage

VBEI,.,I

-

VCE : -5 V (*) 2000
VCE : -5 V

(*)

Ic : -0.75 A, IB : -1.5 rnA (*)

Turn·On Time

ton

Storage Time

t stg

Vcc:-30V
Ic: -0.75 A

Fall Time

tf

IB1 : -IB2 : -1.5mA

(*) Pulsed

00

Pulse Width ~300/Ls
Duty Ratio ~ 6%

(**)

500

-

-

-10

6000

lS000

-

-

V

/LA

-

-

-1.1

-1.5

-

-1.6

-2.0

-

0.5

-

/LS

-

1.4

-

0.4

-

/lS

(**) Pulsed

V
V
/Ls

Pulse width: 50/Ls
Duty Ratio ~ 1%

Copyo-Ight© , ... by FUJITSU UllilED ond FuIItou 1oI\:rOe........... Inc.

3-15

IDI

FT5759M

SWITCHING TIME

DC CURRENT GAIN

j

;1

;;-

...~

c

~

j

~
""0

~
;::
~

c

:i'

i

0.1

-{I.05 -0.1

-0.2

-0.5

-1

-2

f-+-+-+---+--+-+--I
-0.05 -0.1

-0.2

-0.5

-1

-2

Collector Current Ie (A)

Collector Current Ie IA)

FORWARD BIAS SAFE OPERATING
AREA
Ta = 25°C
SATURATION VOLTAGE

~

~
~

-5

>

"£
u

-2

>

f

>

.~

-1

g

-

.~ -0.5

.ll
-0.1
Collector Current Ie (A)

-5

-10

-20

-50 -100 -200

Collector to Emitter Voltage VeE (V)

COLLECTOR SATURATION REGION
POWER DISSIPATION DERATING

Ambient Temperature Ta 1°C)

-0.5

-1

-2

-5

-10

-20

Base Current I B (rnA)

3-16

c:P

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

FT5760M
Silicon Darlington Transistor Array
ABSOLUTE MAXIMUM RATINGS
Symbol

Rating

Value

Unit

-55~+150

°c

Tj

+lS0

°c

Collector to Base Voltage

V eBo

-100

V

Emitter to Base Voltage

V EBO

-5

V

Collector to Emitter Voltage

V CEO

-100

V

Ic

±3.0

A

±S.O

A

Storage Temperature

T stg

Junction Temperature

Collector Current

I (Continuous)
J (Pulsed)

lep

Base Current (Continuous)

IB

Isolation Voltage

Visa

Condition

Pw ~ 1 ms, D.R. ~ 50%

-0.2

A

Pin 13 - Pin 1 ~ 12

500

V r. m . s.

2.3

W

5

W

21

W

Collector Power Dissipation

Pc

Ta = 25°C: Single DLT operation

Total Collector Power Dissipation

PT

Ta = 25°C: 4·DL T operation

Total Collector Power Dissipation

PT

Tc = 25°C: 4·DL T operatioo

DL T: Darlington Transistor

ELECTRICAL CHARACTERISTICS
Single Darlington Transistor Operation

Parameter

Symbol

Limit

Test Condition

Min.

Typ.

Max.

Unit

Collector to Base Breakdown Voltage

VIBR)CBO

Ic =-100I'A, IE =0

-100

-

-

V

Emitter to Base Breakdown Voltage

V(BR)EBO

IE = -90 rnA. Ic = 0

-5

-

V

Collector to Emitter Breakdown Voltage

VIBR)CEO

Ic = -10 rnA, Rse =

-

V

ICBO

Vcs = -90 V, IE =0

-

-

-10

I'A

hFE1

Ic =-1.5A, VCE =-5V (u)

2000

6000

15000

-

hFE2

Ic = -3 A, VCE = -S V

-

-

-

Collector Cutoff Current
DC Current Gain
Collector to Emitter Saturation Voltage

VCE(sat)

Base to Emitter Saturation Voltage

VSE(sat)

-100

00

Ie = -1.5A, IB = -3mA

..

(
(

..

...

(

)
)

)

SOO

-

-1.1

-1.S

-

-1.7

-2.0

0.5

Turn·On Time

ton

Vcc = -30 V

Storage Time

t stg

Ie = -1.5 A

-

1.3

Fall Time

tf

IB1 = -IB2 = -3 rnA

-

O.S

(.. ) Pulsed

Pulse Width ~ 300 I's
Duty Ratio ~ 6%

(... ) Pulsed

-

V
V
I's

I'S
I's

Pulse Width = 50 I'S
Duty Ratio ~ 1%

Copyrlght© .... by FUJITSU U..TED_F_ _ _ Inc.

3-17

FT5760M

DC CURRENT GAIN

SWITCHING TIME

liCE' -5V

Ver!'..:JfJV
Is,· -192 --3mA
Pw -SO,ps
Duty Rat~ ~ 1%

,.

,.,

f--

"'t.

ton

t,

2

~

b

r;:;

~~,

~

~,

o. 1
-0.05

-0.1 -0.2

-0.5

-1

-2

-0.1

Collector Current Ie (A)

-0.2

-0.5

-1

-2

-5

Collector Current Ie (AI

FORWARD BIAS SAFE OPERATING
AREA

SATURATION VOLTAGE

~

5
iii

>"

-5

5
iii

"

>

t

"0

>

~

;::

-2

-2
-1

-1

S

.~

Ji

-0.5

-0.1 t---I--+,----t~
-0.05 r---1:--+~4-"-'
Collector Current Ie (AI

Collector to Emitter Voltage VeE (V)

COLLECTOR SATURATION REGION
POWER DISSIPATION DERATING

~

i

"0

>

.~

w -1

II

~
"0

u

100
Ambient Temperature Ta 1°C)
Base Current Ie (rnA)

3-18

cP

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

FT5761M
Silicon Darlington Transistor Array
FT5761M

ABSOLUTE MAXIMUM RATINGS
Rating

Symbol

Value

Unit

-55 - +150

°c

Tj

+150

°c

Collector to Base Voltage

Vcao

-100

V

Emitter to Base Voltage

V Eao

-5

V

Collector to Emitter Voltage

V CEO

-100

V

±5

A

±8

A

Storage Temperature

T stg

Junction Temperature

Collector Current

I
I

(Continuous)

Ic

(Pulsed)

Icp

Condition

Pw ~ 1 ms. D.R. ~ 50%

Base Current (Continuous)

I.

-0.5

Isolation Voltage

Visa

Pin 13 - Pin 1 - 12

500

Collector Power Dissipation

Pc

Ta = 25°C: Single DL T, operation

2.5

Total Collector Power Dissipation

PT

Ta = 25°C: 4·DL T operation

Total Collector Power Dissipation

PT

Tc = 25°C: 4·DL T operation

A

V r. m .s.
W
W

5
25

W

DL T: Darlington TranSistor

ELECTRICAL CHARACTERISTICS
Single Darlington Transistor Operation

Parameter

Symbol

Limit

Test Condition

Unit

Min.

Typ.

Max.

-

V

-

V

Collector to Base Breakdown Voltage

V(aRICaO

Ic = -10011 A, IE = 0

-100

-

Emitter to Base Breakdown Voltage

V (BR)EBO

IE = -150 mA, Ic = 0

-5

Collector to Emitter Breakdown Voltage

VlaRlcEo

Ic = -25 rnA,

RSE =

Icao

Vca = -90 V,

IE = 0

-

-

hFEl

Ic = -3 A, VCE =-5V

(*)

2000

6000

15000

hFE2

Ic - -5 A, VCE - -5 V

(*)

500

-

-

(0)

-

-1.1

-1.5

Ic = -3 A, la = -6 mA

-1.7

-2.0

Collector Cutoff Current
DC Current Gain
Collector to Emitter Saturation Voltage

VCE(sat)

Base to Emitter Saturation Voltage

VBE(sat)

Turn·On Time

ton

Storage Time

t stg

Vcc=-30V
Ie = -3 A

Fall Time

tf

lal = -l a2 = -6 rnA

(*) Pulsed

Pulse Width ~ 300 JlS
Duty Ratio ~ 6%

-100

00

(**)

-10

-

0.4

(.*) Pulsed

V
IlA

V
V

-

IlS

1.2

-

IlS

0.5

-

IlS

Pulse Width = 50lls
Duty Ratio ~ 1%

copyright@ 'HOlly FIJ.ITSU UIaTED ond F...... _onleo, Inc.

3-19

FT5761M

SWITCHING TIME

DC CURRENT GAIN

0,'

Collector Current Ie (A)

P'--1-O;-"-,+-O;-f--t---'-'-'"

Collector Current Ie (A)

SATURATION VOLTAGE

~

iw

.

>

~u

>

!I,
B
"0

>

-,

5

.~

~
Collector Current Ie (AI

Collector to Emitter Voltage VeE IV)

COLLECTOR SATURATION, REGION

Base Current.ls (rnA)

3-20

POWER DISSIPATION DERATING

'00

Ambient Temperature Ta (0 C)

cP

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

FT5763M, FT5766M
Silicon Darlington Transistor Array
FT5763M, FT5766M

ABSOLUTE MAXIMUM RATINGS

(Ta = 25 D c)
Symbol

Rating

Condition

Value

Tstg

Storage Temperature

-5S-+1S0

Unit
DC

Junction Temperature

Tj

+1S0

DC

Collector to Base Voltage

V CBO

1S0

V

Emitter to Base Voltage

V EBO

S

V

Collector to Emitter Voltage

V CEO

100

V

±1.S

A

Collector Current :

(Continuous)

Ic

(Pulsed)

lep

Base Current (Continuous)

Pw ,,;: 1 ms, D.R.";: SO%

IB

±3

A

0.1

A

IFM

Pw";: O.S ms, D.R.";: 1S% (*)

O.S

A

I FSM

Pw";: 100 ms, Single Pulse (*)

3

A

Diode Reverse Voltage

VA

Pin 3-Pin 2,4. Pin 10-Pin 9,11 (.)

Collector Power Dissipation

Pc

Total Collector Power Dissipation
Total Collector Power Dissipation

Diode Forward Current

110

V

Ta = 2SDC: Single DL T operation

1.S

W

PT

Ta = 2SDC: 4-DL T operation

3.S

W

PT

Tc = 2SDC: 4-DL T operation

17

W

(*) Fast recovery Diode

DL T: Darlington Transistor

ELECTRICAL CHARACTERISTICS
Single Darlington Transistor Operation

Parameter

(Ta
Symbol

Test Condition

Collector to Base Breakdown Voltage

V(BA)CEO

Ic = 100j.lA, IE =0

Emitter to Base Breakdown Voltage

V(BA)EBO

IE = 70 rnA, Ic = 0

Collector to Emitter Breakdown Voltage

V(8A)CEO

Ic = 10mA, RBE

Collector Cutoff Current
DC Current Gai n

Unit

Min.

Typ.

Max.

1S0

-

-

V

5

-

V

100

-

-

-

-

10

j.lA

V CB = 100V, IE = 0

hFE1

Ic = 0.7SA, VCE = S V (**)

2000

SOOO

1S000

-

hFE2

Ic - 1.SA, VCE - S V (.*)

SOO

-

-

-

-

1.1

1.S

V

-

1.S

2.0

V

-

O.S

-

j.ls

-

2.1

-

j.ls

0.4

-

j.ls

V CE( .. t)

Base to Em itter Saturation Votage

VSE(sat)

ton

Storage Time

t st•

Fall Time

t,

Ic = 0.7SA, IB = 1.5 rnA ( •• )
(***)
VCC =30V
Ic = 0.7S A
IB1 = -182 = 1.S rnA

(Ta = 2SD C)

Single Fast Recovery Diode Operation (FT5763M Only)
Parameter

V

ICBO

Collector to Emitter Saturation Voltage
Turn-On Time

=~

Limit

2SD C)

Symbol

Test Condition

Limit

Unit

Typ.

Max.

Forward Voltage

VF

IF = 100mA

Min.
-

-

1.0

V

Reverse Current

IA

VA = 100V

-

-

5

j.lA

110

-

-

V

Reverse Voltage

VA
(*.) Pulsed

IA = 10j.lA
Pulse Width ~ 300 j.ls
Duty Ratio ~ S%

( ••• ) Pulse

-Pulse Width =.50 j.ls
Duty Ratio ~ 1%

COpyrlght@111O"'FUJlTSUUIlTED _ _ _ _ 1nc.

3-21

.FT576:3M,t FT5?f:j6M

DC CURRENT GAIN

SWITCHING TIME

Vee- 30V

20K
I-~+-~+-_-+
w

Duty Retio ~ 1%

u.

""c

a

I,,, - -I",,' 1.5mA

_Pw"'60p.s

10 K
5K

c

~

2K

u
u
0

lK
500
0.1 F-~P--t";"''-'-+-+--+----1
.'

0.02

0.05

0.1

0.2

0.5

Collector Current Ie (A)

IIDI

SATURATION VOLTAGE

0.1

0.2

0.5

Collector Current Ie (AI

FORWARD BIAS SAFE OPERATING
AREA

Collector Current Ie (A)
Collector to Emitter Voltage VCE(V)

COLLECTOR SAT'URATION REGION

POWER DISSIPATION DERATING

Base Current I B (mAl

Ambient Temperature Ta 1°C)

3-22

cO

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

FT5764M, FT5767M
Silicon Darlington Transistor Array
ABSOLUTE MAXIMUM RATINGS

(Ta = 25°C)
Symbol

Rating
Storage Temperature

T stg

Junction Temperature

T]

Condition

Unit

Value
-55 - +150

°c

+150

°c

Collector to Base Voltage

V eBo

150

V

Emitter to Base Voltage

V EBO

5

V

Collector to Emitter Voltage

VeEO

100

V

±3

A

Collector Current

~

(Continuous)
(Pulsed)

Base Current (Continuous)

Ie
lep

Pw ;,;

1

ms, D.R.;'; 30%

18

IFM

Pw ;,; 0.5 ms, D.R.;'; 15% (*)

I FSM

Pw

Diode Reverse Voltage

VR

Pin 3-Pin 2,4. Pin 10-Pin 9,11 (*)

Collector Power Dissipation

Pe

Ta = 25°C: Single DL T operation

Total Collector Power Dissipation

PT

Ta = 25°C: 4·DL T operation

Total Collector Power Dissipation

PT

Tc = 25°C: 4·DL T operation

Diode Forward Current

~

100 ms, Single Pulse (*)

(*) Fast recovery Diode

±5

A

0.2

A

3

A

5

A

110

V

1.7

W

4

W

19

W

DL T: Darlington Transistor

ELECTRICAL CHARACTERISTICS
(Ta = 25°C)

Single Darlington Transistor Operation

Parameter

Symbol

Collector to Base Breakdown Voltage

V (BR)eBO

Ie = 1001lA, IE = 0

. Emitter to Base Breakdown Voltage

V (BR)EBO

IE = 70 mA, Ie = 0

V(BR)CEO

Collector to Emitter Breakdown Voltage
Collector Cutoff Current
DC Current Gain

Limit

Test Condition

Unit

Typ.

Max.

150

-

-

V

5

-

-

V

Min.

Ie = 10mA, RBE =00

100

-

-

V

I CBO

V eB -l00V,I E -0

-

-

10

IlA

hFE1

Ie = 1.5 A, VeE - 5 V

(**)

2000

6000

15000

-

hFE2

Ie = 3.0 A, VeE - 5 V

(**)

500

-

-

-

Ie = 1.5 A, IB = 3 rnA

(.*)

V

Collector to Emitter Saturation Voltage

VeE (sat)

Base to Emitter Saturation Votage

VBE(sat)

Turn-On Time

ton

Storage Time

t stg

Fall Time

t,

Vee=30V
Ie = 1.5 A
I Bl = -182 = 3 rnA

(.**)

-

1.2

1.5

-

1.7

2.0

V

-

0.6

Ils

-

0.6

-

1.8

Symbol

Test Condition

Limit
Min.

Typ.

-

Forward Voltage

VF

IF = 100mA

-

Reverse Current

IR

V R -100V

-

Reverse Vol tage

VR
(**) Pulsed

IR = 10llA
Pulse Width;'; 300!lS
Duty Ratio;'; 6%

Copyrlght© ' ' ' ' by FUJITSU

Ils

(Ta = 25°C)

Single Fast Recovery Diode Operation (FT5764M Only)
Parameter

IlS

110
(***) Pulsed

Unit
Max.
1.0

V

5

IlA

-

V

Pulse Width = 50 IlS
Duty Ratio;'; 1%

u..1ED .... FuJ.... --"'co,lnc.

3-23

FT5764M, FT5767M

SWITCHING TIME

DC CURRENT GAIN

.

T "25"c

Vee": 30,V

fs,'" -I B2 '" 3 ~A_
pw"so".s
Duty~i()~f%

J

o

f---' •

,5'

~

"

0.5

~

c

".~

0.2

~

~

-

i!!-

0.1

0.02

0.05

0.1

0.1

0.5

0.2

'V

".......

.

.~

---

~

,"

0.5

0.2

Collector Current Ie (A)

Collector Current Ie (A)

..

FORWARD BIAS SAFE OPERATING
AREA
SATURATION VOLTAGE

Ie'

!w

.

T

,-

~

1~/500

Single Pulse

>

~

iii

.....-V

Va.,";,}

~

il

/

VCE(~tl

1

~

It<

"

2

~

K \ ~t
~~~~.

~
2

5

~

~

i

0.5

OJ

0.2

'0

c

o
.~

\ ",\
~

0.1

0.5

t--

.

·.K'

.ii

25"C

Sin It Darlington Transistor Operation

0.05
0.2

0.1

0.5

Collector Current Ie (A)

10

20

50

100

200

Collector to Emitter Voltage V CE (V)

..

COLLECTOR SATURATION REGION

T

\
1\

~
w

u

>

2

l-\..:-.. lX",'\!

t ~
.....
.~
E

S

l

~A

1~

I-V,I A

8
0.5

4·0&r ingten }'ransistor Operation

1 J'"

"\';

,..,

\"

,.

Si Gr...... [
Horizontal position

~

-:\

.t
c

--.. ""'-

"

10

I\~

'is=
~
&.
j;

,

'0

....0

'l)~
10

I~"

,

~"

I- r-~Ir
.I I ,,~

~

20

f-

.~

I"<-

til.

20

0

..........

Base Current I B (mAl

3-24

30

,

>

w

POWER DISSIPATION DERATING
25°C

50

100

200

100

\
Ambient Temperature Ta (oC)

200

OJ

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

FT5769M
Silicon Darlington Transistor Array
ABSOLUTE MAXIMUM RATINGS

(Ta = 25°C)
Symbol

Rating

Condition

Value

Unit

-55 - +150

°c

Storage Temperature

T stg

Junction Temperature

Tj

+150

°c

Collector to Base Voltage

V CBO

-100

V

Em itter to Base Voltage

V EBO

-5

V

Collector to Emitter Voltage

V CEO

-100

V

(Continuous)

Ic

±1.5

A

(Pulsed)

Icp

Collector Current

I

Pw ~ 1 ms, D.R. ~ 30%

±3

A

-0.1

A

1.5

W

3.5

W

Base Current (Continuous)

IB

Collector Power Dissipation'

Pc

Ta

Total Collector Power Dissipation

PT

Ta = 25°C: 4·DL T operation

Total Collector Power Dissipation

PT

Tc = 25°C: 4·DL T operation

17

W

= 25°C:

Single DL T operation

DL T: Darlington Transistor

ELECTRICAL CHARACTERISTICS
Single Darlington Transistor Operation

Parameter

(Ta = 25°C)
Symbol

Limit

Test Condition
Min.

Collector to Base Breakdown Voltage

V(BR)CBO

Ic =-100/-lA,I E =0

Emitter to Base Breakdown Voltage

V(BR)EBO

IE

Collector to Emitter Breakdown Voltage

V(BR)CEO

Ic = -10 rnA, RBE = 00

Collector Cutoff Current
DC Current Gain

Ic = -0.75 A, VCE = -5 V (-)

Collector to Emitter Saturation Voltage

V CE ("')

Base to Emitter Saturation Votage

VBE(oa') I
ton

Storage Time

t stg

Fall Time

t,
(0) Pulsed

Ic
Ic

= -1.5 A, V CE = -5 V
= -0.75 A,

(.)

I B =-1.5mA(·)

VCC =-30V
Ic = -0.75 A
IB1 = -IB2 = -1.5 rnA
Pulse Width ~ 300 /-Is
Duty Ratio ~ 6%

(_.)

V
V

-10

2000

6000

15000

/-I A
-

500

-

-

-

-

-1.1

-1.5

V

-1.6

-2.0

0.5

-

-100

hFE1

-

-

-5

V CB = -90 V, IE =0

Unit
Max.

-

-150

=0

ICBO

hFE2

Turn-On Time

= -BOmA,lc

Typ.

( •• ) Pulsed

1.4
0.4

-

V

V
/-IS
/-Is
/-Is

Pulse width = 50/-IS
Duty Ratio ~ 1%

Copyright@ 1800 by FWITSU UlllED Mel Fuji'" _-..ronlco,lnc.

3-25

FT5769M

SWITCHING TIME

DC CURRENT GAIN

Vee' -3(}V
let'" -192'" -1.5 mA_
Pw G<50.us

-

3

Duty Ratio

~

r--..

~

~.

tot•

..~

~
;:: 0.5 I---- ton

V

~

0

Ii
.~

t,

~

1%

~

0.2

V>

0.1

-0,05

-0.1

-0.2

-0.5

-1

-0.05 -0.1

-2

-5

"1>

" I\. r\'¥~

-1

\

j
-2

-o~~-:-

I---f-

I\'~
.. ~

8

8

~
.':i

,,~

~ -0.5

-1

-2

Single Dar.lington !ransi8tor
Operation Single PulIS

to

-0.5

-1

c

-2

-0.2

-0.5

FORWARD BIAS SAFE OPERATING
AREA
Ta' 2SoC

SATURATIDN VOLTAGE

-0.1

-0.2

Collector Current Ie (A)

Collector Current Ic (AI

-0.2

1\.'

-0.1

\

-0.05

Collector Current Ie (AI

-

-10 -20

-50

100

-200

Collector to Emitter Voltage VeE (V)

COLLECTOR SATURATION REGION

POWER DISSIPATION DERATING

Base Current I B (rnA)

3-26

Ambient Temperature Ta 1°C)

OJ

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

FT5770M
Silicon Darlington Transistor Array
ABSOLUTE MAXIMUM RATINGS

(Ta = 25°C)
Symbol

Rating

Condition

Value

Unit

-55~+150

°c

Storage Temperature

Tstg

Junction Temperature

Tj

+150

°c

Collector to Base Voltage

V CBO

-100

V

Emitter to Base Voltage

V EBO

-5

V

Collector to Emitter Voltage

V CEO

-100

V

±3

A

±5

A

Collector Current

r

(Continuous)
(Pulsed)

Ic
lop

Pw ~ 1 ms, D.R. ~ 50%

-0.2

A

1.7

W

Ta = 25°C: 4·DLT operation

4

W

Tc = 25°C: 4·DLT operation

19

W

Base Current (Continuous)

IB

Collector Power Dissipation

Pc

Ta = 25°C: Single DL T operation

Total Collector Power Dissipation

PT

Total Collector Power Dissipation

PT

DLT: Darlington TranSIStor

ELECTRICAL CHARACTERISTICS
Single Darlington Transistor Operation

Parameter

(Ta = 25°C)
Symbol

Limit

Test Condition

Collector to Base Breakdown Voltage

V(BR)CBO

Ic = -100J.lA,IE = 0

Emitter to Base Breakdown Voltage

V(BR)ESO

IE = -90 rnA, Ic = 0

Collector to Emitter Breakdown Voltage

V(SR)CEO

Ic =-10mA, RSE

Typ.

Max.

-100

-

V

-

V

-100

-

-

V

-

-

-10

J.lA

-5

=~

Unit

Min.

Collector Cutoff Current

ICBO

VCS =-90V,I E =0

DC Current Gain

hFE'

Ic = -1.5 A, VCE = -5 V

(*)

2000

6000

15000

-

hFE2

Ic = -3 A, VCE = -5 V

(.)

500

-

-

-

Ic=-1.5A,IB=-3mA

(*)

Collector to Emitter Saturation Voltage

VCE( ..,)

Base to Emitter Saturation Votage

VBE(sat)

Turn-On Time

ton

Storage Time

tstg

Fall Time

tf
(*) Pulsed

Vcc = -30 V
Ic =-1.5A
I B, = -IB2 = -3 mA
Pulse Width ~ 300 J.IS
Duty Ratio ~ 6%

(**)

-

-1.1

-1.5

V

-

-1.7

-2.0

V

-

0.5

-

J.ls

-

1.3

-

J.IS

-

0.5

-

J.ls

( •• ) Pulsed

Pulse Width = 50 J.ls
Duty Ratio ~ 1%

Copyrlght© , ... by FUJITSU UIaTED ond Fuji'" _ - . . 1... Inc.

3-27

III

FT577011/1

DC CURRENT GAIN

SWITCHING TIMF

!
j

~

j
~
;::

go

0.5

:2

S

.~

'"

0.2
0.1

-0.1

-0.2

Collector Curre"nt Ie (AI

-0.5

-1

-2

-5

Collector Current Ie (AI

FORWARD BIAS SAFE OPERATING'
AREA

SATURATION VOLTAGE

5
~

-2
-1

II
j -0.2 r--"""~l--l-"""~-1,"",~-I

8
-0.1

-0.2

-0.5

-1

-2

-5

-O.ll-+--I"-:--+--'4--''IF--H

-0.05 r-+-~b-4--+--Ir--+-+

Collector Current Ie (AI

-5

-10

-20

-50 -100 -200

Collector to Emitter Voltage VeE (V)

COLLECTOR SATURATION REGION
POWER DISSIPATION DERATING

o

L....o.._........___.............---'
-0.5
-0.1
-2

Ambient Temperature Ta (OCI

-5

-10

Base Current 18 (mA)

3-28

-50

-100

-200

cP

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

FT5776M
Silicon Darlington Transistor Array
ABSOLUTE MAXIMUM RATINGS
Rating

(Ta = 25°C)
Symbol

Value

Conditions
NPN

PNP

Unit

Storage Temperature

Tstg

Junction Temperature

TJ

Collector to Base Voltage

V eBo

100

-100

V

Emitter to Base Voltage

V EBO

5

-5

V

Collector to Emitter Voltage

V eEo

Collector Current

(Continuous)
II (Pulsed)

Ie
lep

Base Current (Continuous)

IB

Pw 5: 1 ms, D.R. 5: 50%

Isolation Voltage

Visa

Fin 13 - Pin 1 - 12

Collector Power Dissipation

Pe

Ta = 25°C: Single DL T Operation

Total Power Dissipation

PT

Total Power Dissipation

PT

ELECTRICAL CHARACTERISTICS

-55 - +150

°c

+150

°c

100

-100

V

±1.5

±1.5

A

±3

±3

A

0.1

0.1

A

500

Vr.m.s.

1.9

W

Ta = 25°C: 4·DL T Operation

4

W

Tc = 25°C: 4·DL T Operation

19

W

DLT: Darlington Transistor
SINGLE DARLINGTON TRANSISTOR OPERATION
[NPN]

Parameter

Symbol

Limit

Test Condition
Min.

Max.

5

-

V

Ie = 10mA, RBE =oon

100

-

-

V eB = 100 V, IE = 0

-

-

10

j.ls

Collector to Base Breakdown Voltage

V(BR)eBO

Ie = 100j.lA,I E = 0

Emitter to Base Breakdown Voltage

V(BR)EBO

IE = 70 rnA, Ie = 0

Collector to Emitter Breakdownyoltage

V(BR)eEO

Collector Cutoff Current

leBo

DC Current Gain

Unit

Typ.

100

V

V

"FE1

Ie =0.75A,V eE =5V

"

2000

6000

15000

h FE2

Ie = 1.5 A, VeE = 5V

"

500

-

-

-

Ie = 0.75 A, IB = 1.5 rnA

"

V

Collector to Em itter Saturation Voltage

VeE(sa,)

Base to Emitter Saturation Voltage

V BE (..,)

Turn·On Time

ton

Storage Time

t51:9

Fall Time

t,

Vee = 30 V
Ie = 0.75 A
IB1 = -IB2 = 1.5 rnA

-

1.1

1.5

-

1.S

2.0

-

0.5

-

0.4

-

j.lS

V

2.1

V
j.IS

j.ls

[PNP]
Collector to Base Breakdown Voltage

V(BR)eBO

Ie = -100j.lA,IE = 0

-100

V(BR)EBO

'E = -BO rnA, Ie = 0

-5

-

-

Emitter to Base Breakdown Voltage

-

V

Collector to Emitter Breakdown Voltage

V(BR)eEO

Ie = -10 rnA, RBE = oon

-100

-

-

V

Collector Cutoff Current
DC Current Gain

leBo

V eB - -90V, IE - 0

-

-

-10

j.ls

hFE1

Ie - -0.75 A, VeE = -5 V "

2000

SOOO

15000

-

hFE2

Ie = -1.5 A, VeE = -5 V

"

500

-

-

-

-

-1.1

-1.5

V

-

-1.6

-2.0

V

-

0.5

-

j.lS

-

1.4

-

j.ls

Collector to Emitter Saturation Voltage

VeE (sa,)

Base to Emitter Saturation Voltage

VBE(sa')

Turn·On Time

ton

Storage Time

t stg

Fall Time

t,

Copyrlght© , ... .., FUJITSU UIiTED one! F"'III.

_-......Ico, ....

Ie = -0.75 A, IB = -1.5 rnA"
Vee = -30 V
Ie = -0.75 A
IB1 =-IB2 =-1.5mA

0.4

j.ls

" Pulsed Pw 5:300j.ls, D.R.5:S%

3-29

FT5776M
[NPN]
DC CURRENT GRAIN

SWITCHING TIME
5

]
;:

~

J'
c
~

~
i= 0.5

'"

c

:E

.~

0.2

CIl

200~~~~~~~~~~~f--*-J
0.01 0.02 0.05 0.1 0.2
0.5

Collector CUrrent Ie (A)

Collector Current Ie (A)

COLLECTOR SATURATION REGION
SATURATION VOLTAGE

~

II Ta .26~C

w

0

>

18 -1c/600

2

8.

l!0
>

;;

VBEts.'1

.~

VeE!",)

w

B
0.05

0.1

j

0.5

0.2

2

0

()

Collector Current Ie (A)

10
Base Current "B (rnA)

SAFE OPERATING AREA
5

I-To - 2 5 ' c - -Single Pul..

\. i\..

2

1-1~

'"~ \;
~

~ 0.5

8
5

j

~

Transistor Operation

~ ~~J

1\

~

Single Darlington

I·

~

~,

0.2

\

0

()

0.1
0.05

0.02

,
5

10

20

50

100

200

Collector to Emitter Voltage VeE (v)

3-30

FT5776M
[PNP]
DC CURRENT GAIN
SWITCHING TIME

'1l

20 k

Vee· -30V
IB1=-IS2=-1.5mA
Pw =50",
Duty Ratio;:; 1%

VeE --5V

..... 1--' 1'"

10k

~v

w

~

"", ~v

~

iJ)",'};

~
~

8

"

~ O. 5

......

ton

0>

1/

k

(J

1

'"~

~

2k

c

"',g

,"-: oV

5k

c

C

:c

tf

II

~ o. 2
500
O. 1

-0.05

200
-0.02

0.05

0.01

0.5

-1

SA TURATION VOLTAGE T.

~

=

25'C

IB -1c/500

-2

-''0

.-t

VBEI••t)

-1

CECI.d

>
c

."E

'E

-2

8

-0.5
-0.05

- 0.1

-0.2

-0.5

1111-<
1

Collector Current Ie (A)

~

==

0

i3
.l'l

w

-1

l- t'\.

I-

~

o

-0.2

-0.5-1

~
0
0.

1i
~

"'

\. 1\

-2

"

~

~

~
I

CJ

S

-"

8 -0. 1
-0.05

~~

Ambient Temperature Ta (Oe)

1\1'
~

-0. 2

l!l

";

'!Q.

~

~

~.~1'

100

~_t

Transistor Operation

~~

Jl -0. 5

" ~-I'~<
- r--- ~,,;~ ,~
o
o

T. = 25'C

1\ 1\ ~~I~.

I~

1\\.

I:.

-50 -100 200

Single Darlington

4-D.arlington Transistors ( ~.r.\ion

~"'...

20

Singl. Puis.

3. Horizontal position

~
~

-10

SAFE OPERATING AREA

\,*
10

-5

-5

1

'[

-2

Base Current I B (mA)

C

.~
0
:;;

=25"c

.......

~.1

0.
0

T.

-"'

~.

S
i5

(Not.1
1. Heat .ink 2mmt AI
2. Si Grease
20

-2

"•
l\(
'V

'CP

f-ffi.
,,~

POWER DISSIPATION DERATING

!

-1

III
III
\-III
I~- r-

~ -2

,

l!l,

II

C

z:
w

~

-0.5

COLLECTOR SATURATION REGION

-5

=m
LULU
0 II!
> >

-0.2

Collector qurrent Ie (AI

Collector Current Ie (A)

Z:Z:

-0.1

-2

200

-0.02

5

10

-20

-50

-100

- 200

Collector to Emitter Voltage VeE (V)

3-31

3-32

00

January 1990

FUJITSU

Edition 1.1
PRODUCT PROFILE

FT5777M
Silicon Darlington Transistor Array
ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
Rating

Symbol

Value

Conditions

NPN
Strage, Temperature

Unit

PNP

°c
°c

-SO - +lS0

Junction Temperature

T","
TJ

Collector to Base Voltage

V CBO

100

-100

V

Emitter to Base Voltage

VEBO

S

-S

V

Collector to Emitter Voltage

V CEO

100

-100

V

±3

±3

A

±S

±S

A

0.2

-0.2

A

Collector Current

i

(Continuous)

Ic

(Pulsed)

lep

Base Current (Continuous)

+lS0

Pw ~ 1 ms, D.R. ~ SO%

IB

Isolation Voltage

Visa

Fin 13 - Pin 1 -12

Collector Power Dissipation

Pc

Ta = 2SoC: Single DLT operation

Total Collector Power Dissipation

PT

Total Collector Power Dissipation

PT

SOO

Vr . m . s .

2.3

W

Ta = 2SoC: 4·DL T operation

S

W

Tc = 2SoC: 4·DL T operation

21

W

lID

DL T: Darlington TranSIStor

ELECTRICAL CHARACTERISTICS (SINGLE DARLINGTON TRANSISTOR OPERATION)
[NPN]

Parameter

Symbol

Collector to Base Breakdown Voltage

V(BR)CBO

Ic = 100J.(A, IE = 0

Emitter to Base Breakdown Voltage

V(BRIEBO

IE =70mA,l c =0

Collector to Emitter Breakdown Voltage

V(BR)CEO

Ic = 10 rnA, RBE =

ICBO

V CB = 100V,I E =0

hFE1

Ic=l.SA,Vce=SV

hFE2

Ic = 3 A, VCE = S V

Collector Cutoff Current
DC Current Gain
Collector to Emitter Saturation Voltage

VCE(sat)

Base to Emitter Saturation Votage

VBE(sat)

Turn-On Time
Storage Time

ton
t stg

Fall Time

t,

limit

Test Condition

Min.

oon

Ic = I.S A, IB = 3 mA

·
·
·

VCC = 30 V
Ic = I.S A
IB1 = -IB2 = 3 rnA

Unit

Typ.

Max.

100

-

S

-

-

100

-

-

V

-

-

10

J.(A

2000

V
V

6000

lS000

-

SOD

-

-

-

-

1.2

I.S

V

-

1.7

2.0

V

0.6

-

J.lS

-

1.B

-

J.(s

-

0.6

-

J.(s

-100

-

-

V

-S

-

V

-

V

-

-

-10

J.(A

2000

6000

lS000

SOO

-

-

-

-

-1.1

-l.S

V

-

-1.7

-2.0

V

-

O.S

-

J.(s

-

1.3

-

J.(s

-

O.S

-

J.(s

[PNP]
Collector to Base Breakdown Voltage

V(BR)CBO

Ic = -100J.(A,IE = 0

Emitter to Base Breakdown Voltage

V(BR)EBO

IE=-90mA,lc=0

Collector to Emitter Breakdown Voltage

V(BR ceo

Ic = -10 mA, RBE =

ICBO

V CB = -90 V, Ie = 0

hFE1

Ic = -l.SA, VCE = -SV

hFE2

Ic = -3 A, VCE = -S V

Collector Cutoff Current
DC Current Gain
Collector to Emitter Saturation Voltage

VCE1sa')

Base to Emitter Saturation Votage

VBE(sat)

Turn-On Time

ton

Storage Time

t stg

Fall Time

t,

Copyright@> 1HO by FtUTSU UMTED and FuJtar MIcroeIectronIcl, Inc.

oon

I C = -1.5 A, I B = -3 rnA

VCC = -30 V
I c =-1.5A
IB1 = -IB2 = -3 rnA

-100

·
·
·

• Pulsed Pw ~ 300 J.(s' D.R. ~ 6%

3-33

FT5777M
[NPN]

SWITCHING TIME

DC CURRENT GRAIN

5

- V ee· 3OV

_IS1~-IB2-3mA

c

~

c

Pw- SO,..

2

-

1

:::::;:,"'g

oJ

~

Dutv Ratio ~ 1%

r---

• 25°C

~

.,

E o. 5

.3o
" 500

I--T

i=

g>

l~

t-- ton

r---

f-t;"" r-

0.2
O. 1
0.05

2

0.2

0.1

I-0.5

1

2

5

Collector Current Ie (A)

5~TTrrSA~T_U,R_A-.T_IO,N-rV~OTLTT~ArG__E-,~T~.,._25~O~C

COLLECTOR SATURATION REGION

~

w

u

>

IDI

l).
~

2

P~
" b.<, "
c,,

1<:,'.
0.05

0.1

0.2

0.5

1
Collector Current lelA)

"

~

!;!::::;

;'"•...
"

4,

5

0
(,2

(

1

2

0

~o

Base Current I B (rnA)

SAFE OPERATING AREA

3-34

.....

,

......
r--

1
0.5

f,Ta",;U'C

~'.

'02JU

FT5777M
[PNP]
SWITCHING TIME

DC CURRENT GAIN
20k HI-ill-ll--J-I.j..j.
111-4--++H+-I+I+_+-~
VCE • -5V

VCC' -30V
IB1 • -IB2 =-3mA
PW" 50llS

2

t otg

r--.. -

ton

V

Duty Ratio';; 1%

1

--

EO. 5

i=

'"o
~ 0.2

500 _
-0.02

-0.5

-1

-2

"

~

_

-0.05 -0.1 -0.2

-5

-0.05

- 0.1

SATURATION VOLTAGE,

Ta - 25'C
IB

!~ !~

-2

VBEI..,I

> >

.".;'

1

1 1
= Ic/5oo

11

U

'-,

I\K"9 ~

>

'i -

"

l.::!!:S"';;!-

w

r?'~1

"0

-2

-1

-5

I

r

I

5

2
1

~

--b.'rt,~~~
I--

10-

~.

o

,t

+-,~ ~\

~

8

~ i>~~t\. 1\

~~\
.........

o

o

100

,

r\ 1\

~

Ambient Temperatura.. Ta (oC)

1
061

~.
f\.\ \~~
"'-

-0, 5

<>
i5

~+~ '-~;;

.

j:::Single P u l s e .
:
~Single Darlington Tra.nsistor Operation-

t

1\

I-

-5 -10 -20 -50 -100 -200 -500

SAFE OPERATING AREA

\4-0arltngton Transistor Operation

k.

-O.lA

0

1. Heat sink 2mmt AI 2. Si Grease
_
3. Horizontal position
r

<-

Base Current I B (rnA)

(Notel

--

•\.>

"\.

0.2 -0.5-1

POWER DISSIPATION DERATING

0

Ta ·2S0C

,.

~

0

<>

Collector Current Ie (A)

k

("I

I,

2

t
"0

j

-0.5

-5

-2

,.,.

w

-0.5
-0.2

-1

COLLECTOR SATURATION REGION

8

-0.1

-0.5

~
>

VCElsati

-0.05

-0.2

Collector Current Ie (AI

Collector Current Ie (A)

-5

Ta = 25'C

5

"'1\

-0. 2

1\

-0.05
200
-0.02

-10

-20

-50

-100

-200

Collector to Emitter Voltage VeE (V)

3-35

3-36

cP

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

FT5778M
Silicon Darlington Transistor Array
ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)
Symbol

Rating

Value

Conditions

NPN

PNP

Unit

··55 - +150

°c

+150

°c

Storage Temperature

Tstg

Junction Temperature

Tj

Collector to Base Voltage

Vcso

100

-100

V

Emitter to Base Voltage

V EBO

5

-5

V

Collector to Emitter Voltage

VCEO

100

-100

V

±5

±5

A

Collector Current

II (Continuous)
(Pulsed)

Ic
lep

Base Current (Continuous)

Is

Pw

~

1 ms, D.R.

~

50%

Isolation Voltage

Viso

FinI3-Pinl-12

Collector Power Dissipation

Pc

Ta = 25°C: Single DLT Operation

Total Power Dissipation

PT

Total Power Dissipation

f'T

±8

±8

A

0.5

-0.5

A

500

Vr.m.s.

2.5

W

T a = 25° C: 4·D L T Operation

5

W

Tc = 25°C: 4·DL T Operation

25

W

ID

DL T: Darlington TranSistor

ELECTRICAL CHARACTERISTICS (SINGLE DARLINGTON TRANSISTOR OPERATION)
[NPN]

Parameter

Symbol

Limit

Test Condition

Min.

a

-

-

V

-

V

-

V

-

-

10

2000

6000

15000

I1s
-

500

-

-

-

-

1.2

1.5

V

-

1.6

2.0

V

-

1

-

I1S

-

2

-

IJ.s

-

1

-

IJ.s

-

V

Ic = 100 I1A, IE =

V(SR)ESO

IE = 5 rnA, Ic = a

Collector to Em itter Breakdown Voltage

V(SR)CEO

Ic = 25 rnA, RSE =oon

100

VCS = 100V, IE =0

DC Current Gain

h FEI

I c =3A,V cE =5V

hFE2

Ic = 5 A, VCE = 5 V

Collector to Emitter Saturation Voltage

VCE(sat)

Base to Emitter Saturation Voltage

VaE(sat)

Turn·On Time

ton

Storage Time

t stg

Fall Time

tf

··
·

Ic = 3 A, Is = 6 rnA
Vcc =30V
Ic = 3A
lSI = -ls2 = 3 rnA

Unit

5

V(SR)CSO

Emitter to Base Breakdown Voltage

Icso

Max.

100

Collector to Base Breakdown Voltage

Collector Cutoff Current

Typ.

[PNP]
Collector to Base Breakdown Voltage

V (SR)CSO

Ic = -IOOI1A, IE =0

Emitter to Base Breakdown Voltage

V (SRIESO

IE = -150 rnA, Ic =0

Collector to Emitter Breakdown Voltage

V(SR)CEO

Collector Cutoff Current
DC Current Gain

Icso
hFEl

Ic - -3 A, VCE - -5 V

hFE2

Ic =-5 A, VCE = -5 V

Collector to Emitter Saturation Voltage

V CE(sat)

Base to Emitter Saturation Voltage

VCE(sat)

Turn-On Time

ton

Storage Time

tstg

Fall Time

tf

Ic = -3 A, Is = -6 rnA
Vcc=-30V
Ic = -3 A
lSI = -IS2 = -6 rnA

-100

-

-

-

-10

IJ.s

2000

6000

15000

-

-

-

-

-

-1.1

-1.5

V

-

-1.7

-2.0

V

-

0.4

I1S

!1S
I1s

-5

Ic = -2 rnA, RSE = oon
VCS = -100 V, IE = 0

-

-100

··

·

500

-

1.2

-

-

0.5

-

V
V

• Pulsed Pw ~ 300 IJ.s, D.R. ~. 6%

3-37

FT5778M

[NPN]
SWITCHING TIME

DC CURRENT GRAIN
Vee -5V
W

5k

LL

.c

.~

2k

Cl
c

e

9

500

11

t"g/

c

.9

oCo

'I

u

g

s

...~

...~.,,

.~E('f)

i!

2

~1;lT

w

>" 2

-~

J.- 1-'-" BE(ta')
'.' b ·
I~ ,

.2

rll

III

III

o
>c

1

COLLECTOR SATURATION REGION

~

Is -l c l6oo

.!!
ww

0.5

Collector Current Ie (A)

SATURATION VOLTAGE T =25°C

"

~~

17

'i

100
0.05 0.1

r'\

ton

C
:r o. 5

200

= 25°C

It

C>

/

/~

1

~
;.:

~

.

T

l-~c~~50V

I-ISl = -IS2 - 3mA
Pw = 50 s
2 I- Duty Ratio';; 1%

]

V

c;

k

3

5

/Ji

10k

500 1000

FT5778M
[PNP)
SWITCHING TIME

DC CURRENT GAIN

so k

L~~Ell~~~

,........

20 k

~
E
~

g

~

/!~!

2k

.3

1

"'};~

k

r)·

1k

!:/

If

I
-0.5
-1
-2
Collector Current Ie (AI

-0.2
-1

-2

-

T - 2SoC

-S

]]

Is

~

-2

o

.~w - 1

~

f--- I- VSEI ..,)

V

-1

VCEI.atl

j

.~

~ -0.5

-0.2

-0.1

-O.S

-1

2

-10

-S

~+

~ ~"'7.
-p.5.<\

l-

,

n.

-0.2A

C

1 "'
-

~

10

I-

r..

I

I

I

SAFE OPERATING AREA

I

S:G~..

o

-1 0

__

4'D.rlingt~ln Tr~nSisior 6perai;on

,

S

,~;..

5
2

I\,

-2

~\ ~

~

5
u

1\

-..;;

'i~s

1\

1

-0.5

'.

1,<

~

-0.2

1,\

-0.1

1'.r\ 1\

-0.05

~,

"' ~~

100
Ambient Temperature Ta rC)

\~~
~:'Go

~

u

" 1'.... ~"""1\,
1"""-- 1'--.

o

-1000

3. Horizontal position

S

l'iii

-50 -100-200

Singl. Pulsa
Single Darl.lngton Transistor Operation

,

a.

-S -10

Base Current I B (rnA)

-2 0

1\

!20
f-

.....

0
-0.2 -O.S -1 -2

;3

1. Heat sink 2mmt AI -

2.

'c

t....P"

ton

~ O. 2

200
-0.02 -O.OS -0.1 -0.2 -O.S

»U

~

O. 5

'"
~
c

500

~~

......

t.,g

r,v

-"

Vce' -30V
lSI = -IS2' -6mA
Pw = 601"
Duty Ratio 5: 1%

2

.- \

~ 10k

c

Ta -- 2SoC

S

;
-5

200

-10

....
-20

-50

100

200

Collector to Emitter Voltage VeE (V)

3-39

3-40

cP

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

FT5786M
Silicon Darlington Transistor Array
ABSOLUTE MAXIMUM RATINGS

(Ta ~ 25°C)

Rating

Symbol

Value

Conditions
NPN

Storage Temperature

T stg

Junction Temperature

Tj

Unit

PNP
~

-55

+150

°c
°c

+150

Collector to Base Voltage

V CBO

100

-100

V

Em itter to Base Voltage

V EBO

5

-5

V

Collector to Emitter Voltage

V CEO

100

-100

V

±1.5

±1.5

A

±3

±3

A

0,1

0.1

A

Collector Current

I

(Continuous)

Ic

I (Pulsed)

Icp

Base Current (Continuous)

IB

~

Pw

~

1 ms, D.R.

50%

Isolation Voltage

VisO

Fin 13 - Pin 1 ~ 12

Collector Power Dissipation

Pc

Ta ~ 25°C: Single DL T Operation

1.5

W

Total Power Dissipation

PT

Ta ~ 25°C: 4-DL T Operation

3.5

W

Total Power Dissipation

PT

Tc ~ 25°C: 4-DL T Operation

17

W

Symbol

Parameter

V(BRICBO

Ic

~

Emitter to Base Breakdown Voltage

V(BRIEBO

IE

~70mA,lc ~O

Collector to Emitter Breakdown Voltage

V(BRICEO

Ic

~

Collector Cutoff Current

ICBO

DC Current Gain
V

V CB

100j.LA,I E

~

100V,I E

hFE1

Ic

~

Ic

~1.5

Ic

~

Min.

~O

10 rnA, RBE

hFE2
CE(sat)

Limit

Test Condition

Collector to Base Breakdown Voltage

-Base to Emitter Saturation Voltage

V r. m . s.

DL T: Darlington TranSistor
(SINGLE DARLINGTON TRANSISTOR OPERATION)
[NPN]

ELECTRICAL CHARACTERISTICS

Collector to Emitter Saturation Voltage

500

0.75 A, VCE

~

oon

~O
~

5V

A, VCE = 5V

·
·

0.75 A. IB = 1.5 rnA *

VBE(sat)

Turn-On Time

ton

Storage Time

t stg

Fall Time

t,

Vcc ~30V
Ic ~0.75A
IBl ~ -IB2 ~ 1.5 rnA

Unit

Typ.

Max.

100

-

-

V

5

-

-

V

100

-

-

V

-

-

10

j.LS

2000

6000

15000

-

500

-

-

-

-

1.1

1.5

V

-

1.B

2.0

V

-

0.5

-

j.Ls

-

2.1

-

j.Ls

-

0.4

-

j.LS

-100

-

-

V

-5

-

V

-

V

-

-

-10

j.LS

2000

BOOO

15000

-

500

-

-

-

-

-1.1

-1.5

V

-

-l.B

-2.0

-

0.5

j.Ls
j.Ls

[PNP]
Collector to Base Breakdown Voltage

V(BR)CBO

Ic=-100j.LA,IE

Emitter to Base Breakdown Voltage

V(BR)EBO

IE

~

Collector to Emitter Breakdown Voltage

V(BR)CEO

Ic

~-10mA,

Collector Cutoff Current
DC Current Gain

~O

-80 rnA, Ic = 0
~

RBE =oon
~

ICBO

V CB

hFEl

Ic ~ -0.75 A, VCE ~ -5 V *

hFE2

Ic

Collector to Emitter Saturation Voltage

V CE(sat)

Base to Emitter Saturation Voltage

V BE (sat)

Turn·On Time

ton

Storage Time

t stg

Fall Time

~,

Copyrigh'@ '''' ~ FUJITSU UIiTED ond~uJtou .....-1... 100.

100 V, IE

-100

~-1.5

A, VCE

~

0

-5V

·

Ie ~ -0.75 A, 19 ~ -1.5 rnA *
Vee =-30V
Ie ~ -0.75 A
IBl ~ -IB2 ~ -1.5 rnA

-

1.4

-

-

0.4

-

* Pulsed Pw_
~300

V
j.LS

5, D.R.~B%

3-41

FT5786M

[NPN)

SWITCHING TIME

DC CURRENT GAIN

.

T ·2S'C
S

'1111

III
tot

~

O.S

lio

£.~ 0.2

tf

'"

c

Vee· 3OV

O.OS

l-

lSI =-IE\2 ·1.SmA
Pw =50""
Duty Ratio li 1%

I

'"

l"

t,.;...1.--

0.1

0.2

O.S

1

Collector Current Ie (A)
Collector Current Ie (AI

SATURATION VOLTAGE

COLLECTOR SATURATION REGION

?:

~II~ ~ lefS06 -

to tii
$.!!l.

I.

w w

»U

.

T ·2S'C

'"

VB~( ..t)

t

.~

>

w

§

."
~

O.OS

0.1

0.2

8

Collector Current Ie (A)

r-.

1

O.IA

j

2

O.S

l~

o.s~s.q

B

O.S

~

~

>

T. = 2S'C

\'\s-"V

2

t
o

V

VeE(.at)

o

>

ItI

\C..

w

U

II
0
0.2

S

O.S

10

20

Base Current I B (mAl

SAFE OPERATING AREA

\.
I!\.

5
J1

Ta = 2S'C

Singlo Puleo
~±
Singlo Darlington

r'\

Transis~or

Operation

r\ ~[11$

•

i."\

~:lit'\ ~

o.s

~

-(

~

u

B

\

0.2

~
0
u 0.1
O.OS

0.02

S

10

20

SO

100

200

Collector to Emitter Voltage VeE (VI

3-42

SO 100 200

FT5786M

[PNP]

DC CURRENT GRAIN

SWITCHING TIME

III

20 k

VeE
10 k
w

I~V
...'8 v

k

u.

""c

~

\.

rO

~.7

·m
t!l

k

~

Vee = -30V
I B1 = -I B2 = -1.5mA +I-+++If..----+--+---l
Pw = 50llS
Duty Ratio ~ 1%

=-SV

...... J....

~

/

~

u
u

k

"

50 0

0~~~.0~5~~0~.1~L_~0~.2~~_~0~.5~-U_~1--L-~2~
200
-0.02

-O.OS -0.01

-O.S

-1

Collector Current Ie (AI

Collector Current Ie (AI

-2

COLLECTOR SATURATION REGION

.

SATURATION VOLTAGE T =2SoC
-5
~

I I

~

m=
WW
o III
»

-

2

IB = le/SOO

H

VBE( •• ,)

V
1

veE I..,)

c

.~

1= Ff-

-0.5

a

g

IIii

rl'l

-0.05

-0.1

-0.2

-1
Collector Current Ie (A)

9
B

8

-2

IIJ4

o.~~~~~~~~~~~I~lllu'I~IIII~
0.2
0.5 1
10 20
50 100 200
Base Current Is (rnA)

SAFE OPERATING AREA T

POWER DISSIPATION DERATING
S

~

~t-\.

I-

\. I\'

2

20

i\

1

4-Darllngton Transistor Operation

1\ \~I·1
,
~~

0.
C

0

c

1
'gj
~
0

~-> ..

-0. 5

~

u

j

0

o

0.

u

~
I-

:t-

il'

~

i5

2SoC

=

Single Pulli.
~~
Single Darlington
Transistor Operation

\

-0. 2

'.

.

-0. 1
-0.0S

0

o

100
Ambient Temperature Ta (OC)

200

-0.02

-5

-10

-20

-50

-100 -200

Collector to Emitter Voltage VeE (V)

3-43

3-44

cP

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

FT5787M
Silicon Darlington Transistor Array
ABSOLUTE MAXIMUM RATINGS
Rating
Storage Temperature

(Ta = 25°C)
Symbol

Value

Conditions

NPN

PNP

Unit

-55 - +150

°c

+150

°c

Junction Temperature

Tot.
Tj

Collector to Base Voltage

V CBO

100

-100

V

Emitter to Base Voltage

VEBO

5

-5

V

Collector to Emitter Voltage

V CEO

100

-100

V

±3

±3

A

±5

±5

A

0.2

-0.2

Collector Current

II (Continuous)
(Pulsedl

Ic
Icp

Pw ;;;; 1 ms, D.R.;;;; 50%

Base Current (Continuous)

IB

Isolation Voltage

Viso

Fin 13 - Pin 1 - 12

Collector Power Dissipation

Pc

Ta = 25°C: Single DL T Operation

Total Power Dissipation

PT

Ta = 25°C: 4·DL T Operation

Total Power Dissipation

PT

Tc = 25°C: 4·DL T Operation

ELECTRICAL CHARACTERISTICS
Parameter

A

500

Vr.m.s.

1.7

W

4

W

19

W

DL T: Darlington TranSistor
(SINGLE DARLINGTON TRANSISTOR OPERATION)
[NPNj
Symbol

Limit

Test Condition

Min.

Typ.

Max.

Unit

Collector to Base Breakdown Voltage

V(BR)CBO

Ic = 1OOIlA, IE = 0

100

-

-

V

Emitter to Base Breakdown Voltage

V(BR)EBO

IE=70mA,lc=0

5

-

-

V

Collector to Emitter Breakdown Voltage

V(BR)CEO

Ic = lOrnA, RBE =oon

100

V

-

-

-

V CB = 100V, IE =0

10

liS

*
*

2000

6000

15000

-

-

-

-

·

-

1.2

1.5

V

-

1.7

2.0

V

-

0.6

-

liS

1.8

-

liS

0.6

-

lIS

Collector Cutoff Current
DC Current Gain

ICBO
hFE1

Ic = 1.5 A, V CE = 5 V

hFE2

Ic =3A,V CE =5V

Collector to Emitter Saturation Voltage

VCE(satl

Base to Emitter Saturation Voltage

VBE(sat)

Turn·On Time

ton

Storage Time

t stg

Fall Time

tf

Ie = 1.5 A, I B = 3 rnA
Vcc = 30 V
Ic = 1.5 A
IB1 = -IB2 = 3 rnA

500

[PNPj
Collector to Base Breakdown Voltage

VIBR)CBO

Ic =-100IlA, IE = 0

-100

-

-

V

Emitter to Base Breakdown Voltage

VIBR)EBO

IE = -90 rnA, Ic = 0

-5

-

-

V

Collector to Emitter Breakdown Voltage

VIBR)CEO

Ic = -10 rnA, RBE = oon

-100

-

-

V

-

-

-10

liS

2000

6000

15000

-

-

-

-

-

-1.1

-1.5

V

-1.7

-2.0

V

-

0.5

-

liS

-

1.3

-

liS

0.5

-

liS

Collector Cutoff Current
DC Current Gain

ICBO

V eB = -90 V, IE = 0

hFE1

Ic = -1.5 A, VCE = -5 V

hFE2

Ic = -3 A, VCE = -5V

Collector to Emitter Saturation Voltage

VCE(sat)

Base to Emitter Saturation Voltage

VBElsat)

Turn-On Time

ton

Storage Time

t stg

Fall Time

tf

Ic = -1.5 A, I B = -3 rnA
Vcc = -30 V
le=-1.5A
IB1 =-IB2 =-3mA

·
·
*

500

* Pulsed Pw ;;;; 300 lIS, D.R.;;;; 6%
Copyright@ 1980 by FWITSU UIllTED and FuJlau lIcroelectronk:l. Inc.

3-45

FT5787M

[NPN]
SWITCHING TIME

DC CURRENT GRAIN

Vce,-SV

20 k
"-

.t:
C

~
c

k

~

:>

~

k

S

2

a

J
c

~~
if;'r,L'f- ~~

5k

U
U

j

'-

w 10k

.2

0

500
200

0.02

0.05 0.1

0.2

0.5

2

5

Collector Current Ie (A)

SATURATION VOLTAGE

~~

.H
w w
»u

"'

COLLECTOR SATURATION REGION

,.,
2

~OO

~:
.--V;
,

VCEIHt)

f

~,r

~"':ik~ .

,

" ....' ..,'0

./

II'IiEIHtI

'0

>c
0

.~

I,~\:'

0.5

~

II)

0.05

0.1

0.2

0.5

1

",

2

Collector Cu rrent lelA)

Base Current I B (rnA)

SAFE OPERATING AREA
10Ef~~~~~~~~=g~
Slilt!1a P~I.(

,

"

Sillf' ""rll~on TraMlstor 0pe11tl""

50
100 200
10
20
Collector to Emitter Voltage VeE (V)

3-4&

FT5787M
[PNPj
SWITCHING TIME

DC CURRENT GAIN
20 k

VeE --5V

'v

~

,,~~v

5k

c

~
c

~

2k

u
u

lk

~

o

,

y. /.

//~v

;=

It

.~. 0.2

~

-0.05

0.1 -0.2

-0.5

-1

-2

-5

-0.2

-0.05

.-

SATURATION VOLTAGE

~~

I

1/,

,./

-1

~

~

l!!
.~
w

eEeaat)=

>

~

-0.5

-0.2

-0.5

-1
Collector Current Ie IA)

-2

-5

;3 -~.2

~

-

\

C
0

's.

"

'=

i5 10

~

-5 -10 -20 -50 -100 -200 -500

5

r

.

=

25'C

\
\(..~.

-==

\. \~I

2

8~

~~

I-

.

SingIe Darl;ngton Transistor Operation

'\ rv"
~

c

~

-0.5

j

;3

-0.2
-0. 1

~,
o
o

-0.5 -1 -2

1

\~.

I>.

~

~

-O.IA

Singl. Puis.

-

~~

0

'\.

IK

SAFE OPERATING AREA T

4-Darlington Transist!)r Operation

I>.

"

I'\.

2'1 Ho'tonia! Pjltlor-

"'\.

l-

\.>

&

10

eJote)l- I I I
20

:~..,

Base Current I B (rnA)

POWER DISSIPATION DERATING

1. SIG'....

'-,

h-Dlr"

j

-0.1

a'" 25°~

1 -O.SA

B

-0.05

-5

'\

-V

VeEe ..!)

-2

...

le· l e/5OO

-2

-1

COLLECTOR SATURATION REGION

T - 25'C

i!

§
."

-0.5

Collector Current Ie (AI

-5

f!

V

ton

g'
:<;

Collector Current Ie (A)

"0

--

~ 0.5

~.

-0.02

~ ~

~

'st

I

c

~o

500

»

= 25'C

Vee -,.30V
IBI • -182· -3mA
Pw ·50",
DUlY Ratio S. 1"-

10k

LU

.

T

5

11111

'\

r-.....t---..~
100

Ambient Temperature Ta (OC)

-

-0.05
200

i
-0.02

-5

-10

-20

-50 -100 -200

Collector to Emitter Voltage VeE (V)

3-47

..

3-48

Section 4

Field Effect Transistor Arrays -

At a Glance
Maximum Frequency
Voss (V) ID(A)

Page

DevIce

c... (...)

4-7

FT6110
FT6110D

R~

120
120

±2
±2

4-11

FT6111
FT6111D

R~

120
120

±3
±3

4-15

FT6112
FT6112D

R~

120
120

±4.5
±4.5

4-19

FT6120
FT6120D

RM-97

120
120

±1.5
±1.5

4-23

FT6121
FT6121D

RM-97

120
120

±2.5
±2.5

4-27

FT6122
FT6122D

RM-97

120
120

±4
±4

a

4-1

Reid Effect Transistor Al7Bys

4-2

Power Transistor Products

Power Transistor Products

Field Effect Transistor Arrays

INTRODUCTION
POWER MOS FET ARRAY SERIES
Description
This series is Silicon Enhancement-Mode Power MOS FET Arrays. Each array consists of 4 MOS FETs. The
array is packaged in a small plastic 12-pin single in-line package with or without an isolated heatsink.
The series is well suited for motor drive applications where IC outputs must be boosted to drive print hammets.
The series are extremely cost effective and space saving compared to using four separate TO-220 type Power
MOS FETs.
Features
• 4-Circuits included in one package
• Direct Drive from Logic-Level
• Large Power Dissipation
• Bu ilt-in fast recovery diode to
absorb fly-back voltage
• Fast switching speed
• No Secondary Breakdown

Application
• Solenoid Drives

Printer Head Drives
Hammer Drives

• Motor Drives
• Amplifiers

PACKAGE DIMENSIONS

FUJITSU PKG No. RM_

FUJITSU PKG No. RM-D

1 MAX
131,5MAXI

0.10
(2.541

O.17MAX
14.3MAX)

0.0336
(0.85)

13: Fin(N.CJ

Unit In inch Imml

0.0236
10.61
0.07
(1.71

11x0.1o-1.10
111K2.S+-27.94)
Unitininchlmml

4-3

Power Transistor Products

Reid Effect Transistor Arrays

• Selection Guide
RM-65 Series (with isolatedd heatsink)
Circuit
Config_

Device
Number

Voss

Maximum Ratings (Ta = 25°C)
PT"
lo(oc}

(V)

(A)

FT6110D
FT6111D

A

FT6112D

120

FT6110
FT6111

B

FT6112

(W)

..

Electrical Characteristics (Ta = 25°C)
Tch

RoS(on)

TYP.
(OHM)

("C)

VGS(off}
TYP.
(V)

C..
TYP.
(pF)

±2

4

1.2

130

±3

5

0.55

280

0.32

±4.5

5

±2

4

+3

5

0.55

280

±4.5

5

0.32

450

150

450

1.3

1.2

130

" ; 4-MOSFET operation " ; VGS = 4 V
RM-67 Series (without isolated heatsink)
Electrical Characteristics (Ta= 25°C)

Maximum Ratings (Ta = 25°C)
Device
Number

Circuit
Config.

Voss
(V)

FT6120D
FT6121D

A

FT6122D

120

FT6120
FT6121

B

FT6122

lo(oc}

PT'

Tch
("C)

ROS(on}
TYP.
(OHM)

Cios
TYP.
(pF)

VGS(off}
TYP_
(V)

(A)

(W)

±1.5

3.5

1.2

130

±2.5

4

0.55

280

0.32

450

±4

4

±1.5

3.5

±2.5

4

0.55

280

±4

4

0.32

450

150

1.3

1.2

130

• ; 4-MOSF ET operation, •• ; V GS = 4 V

•

Circuit Configuration

(B)

(A)
2

3

4

9

10

11

02~
6

13: FIN (N.C.)
D, - D, : Flywheel diode
D. - D.: Fast recovery diode to absorb fly-back voltage

2

02~

~ 01~
3

11

9

4

6

13 : FIN (N.C.)
D, - D, : Flywheel diode

~

03

04

10

Reid Effect Transistor Arrays

Power Transistor Products

Applications for solenoid drives and motor drives
1) General Discription
In solenoid drive applications and motor drive applications, the fly-back voltage is generated at the mode
of a transistor inductive turn-off.
The power MOS FET array series (FT6110D, FT6111D, FT6112D, FT6120D, FT6121D, FT6122D) can
easily absorb the flyback energy through the fast recovery diodes_ This guarantees the arrays a very
efficient operation_
• Flyback energy absorption circuit
Fig_ 1 shows the equivalent drive circuit for a single device of the power MOS FET array_
During the turn-on mode of the power MOS FET (a), the current (it) flows through the inductive load
(L)_
During the turn-off of the power MOS FET (a), the fly-back energy which is stored in the inductive load
(L) is absorbed by current (i L) which flows through the fast recovery diode_
Fig_ 1-Circuit for absorbing fly-back energy

lEI

r-I
:

0

I

I
I

I

ON

Logic level
Gate drive

~
OFF

j ! ~Nnm

:

~L__________1101
I

I

I
I

I

_..JI

2) Solenoid drive circuit
Four solenoids can be driven by one power MOS FET array
Fig_ 2-Solenoid drive circuit

o

DZ

Power MOS FET array

Q

:

L
DZ

: Solenoid
: Speed-up zener diode

R

: Drive current limiting
resistance
: Supply voltage

V0
Control
Ie

R

R
I
I ___ _
L

4-5

Field Effect Transistor Arrays

Power Transistor Products

3) Motor Drive
3-1) Driving form (ex. 4-phase motor)
Moton; may be driven in either a unipolar or (Fig.·3(a)) bipolar manner (Fig.-3(b)). The current in unipolar mode flows in only one direction while the current in bi-polar mode flows in both directions.
Fig. 3-(a)

Fig. 3-(b)

Uni-polar driving form
* Easy Construction

Bipolar driving form
* Large Output Torque

fj/·······]mI
A

A

B

B

I

I

I

I

-19 --1 J -15 ~9

3-2) Principle circuit for pulse width modulate drive
Fig. 4- Principle circuit for pulse width modulate drive
.......

-- ------- - - - - - - ' \
I

I
I
I

I
I

I
I

0,

'...... J

Example of Pulse Width Modulate Drive

4-6

The output current is controlled by the pulse width
of modulator transistor (0,), when the PWM
transistor (0,) is in the off-state and the power MOS
FET (0 2 ) is in the on·state, the current flows through
the fast recovery diode (D 2 ). (Solid line) In this
mode the fast recovery diode operates similarly to a
flywheel diode.
When both the PWM transistor (0, ) and power MOS
F ET are in the off-state current flows through the
flywheel diode.
(Dashed line)
In this mode, the current flows back to the DC power
supply to improve the operating efficiency.

00

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

FT6110, FT6110D
Power MOS FET Arrays
Silicon N·channel Enhancement Mode Power MOS FET Arrays
(Ta = 25°C)

ABSOLUTE MAXIMUM RATINGS
Rating
Drain Source Voltage

I
I

Continuous

10

Pulsed
Reverse Drain Current (Continuous)

V

±20

V

2

A

10M

4

A

lOR

2

A

2
4

A
V

Pw ;:,: 0.5 ms, DR ;:,: 25%

IFSM
VR
PT

Pw ;:,: 100 ms, Single Pulse
Ta = 25°C, 4·MOS FET operation

130
4

PT

Tc = 25°C, 4·MOS FED operation

32

W

R"'l-c
Tch
T ...

Tc = 25°C, 4-MOS FED operation

3.9

°C/W
C

Fast Recovery Diode Reverse Voltage
Total Drain Power Dissipation

Storage Temperature

Tc = 25°C

120

IFM

Fast Recovery Diode Forward Current

Thermal Resistance Junction to Case
Channel Temperature

Unit

Value

Voss
V GS

Gate Source Voltage
Drain Current

Condition

Symbol

A
W

+150
-55 - +150

°c

ELECTRICAL CHARACTERISTICS (Ta = 25°C) . for Single MOS FET
Parameter

Symbol

Drain to Source Breakdown Voltage

BVoss

10 = 100llA, VGS = OV

Gate to Source Leakage Current

IGSS

VGs = ±20 V, Vos = 0 V

Zero Gate Voltage Drain Current
Gate to Source Cutoff Voltage

loss
VGS(off)

Vos = 120V, VGs =OV
10 = 1 rnA, Vos = 10 V

Static Drain to Source On-State
Resistance

ROS(on)

10 = 1 A, VGS = 4 V

ROS(on)

10 = 1 A, VGs= 10V

Forward Transconductance

lit.

10 = 1 A, Vos = 10 V

Input Capacitance

C..

Vos = 25 V

Output Capacitance

COlI

VGs = 0 V

Reverse Transfer Capacitance

C...

f = 1 MHz

Turn·On Delay Time

td(on)

10 = 1 A

Rise Time
Turn-Off Delay Time

t,

Voo = 60V
V GS = 10 V

Fall Time

tf

td(off)

Limit

Test Condition

(See Test Ci rcu it)

··
·

Unit

Min.
120

Typ.
-

Max.
-

-

-

±100

nA

-

100

0.9

1.3
1.2

1.7
1.7
1.3

IlA
V

-

0.8

-

RGS = 50n
• Pulsed: Pulse Width;:': 300 liS, D.R. ;:,: 6%

0.9
1.3

-

V

n
n

80

S
pF
pF

15

30

pF

20

-

ns

-

ns
ns

130

170

45

10
40
10

-

ns

SOURCE·DRAIN DIODE CHARACTERISTICS: for Single MOS FET
Forward On-Voltage
Reverse Recovery Time

V

lOR - 1 A, VGS - 0 V
lOR = 1 A, dl oR /dt=100Allls

ns

FAST RECOVERY DIODE CHARACTERISTICS: for Single Diode (FT6110D only)
Forward Voltage
Reverse Current
Reverse Voltage

VF
IR
VR

IF-l00mA
V R -120V
IR - 10llA

130

-

1.0

V

5
-

IlA
V

copynght@ , ... by FUJITSU UlaTED ond Fu,,"" _ _ Inc.

4-7

FT6110, FT6110D

Threshhold
V OS-l0V

20


t-

~

Drain to Source Saturation Region

Ta=25°C
2

r->~

Gate to Source Voltage V GS(V)

Transconductance-Drain Current

VOS=10V

r.l.
jI,

V

2

Gate to Source Voltage VGS(V)

.s,

Vos -l0V

~a=25°C

3

~
~
u

~

'0e

4

1:

II

2

I

E

1=

1:
~
~

Transfer Characteristics
5

0

>

f'..

~

1

rn

II

2

I\.

~

e0

0.5'

o

IO=2.0A

0

/

:-t:-

-~

r--

1.0A
0.5A.

o
o

3

o

4

3

2

5

4

On-Resistance-Drain Current

On-Resistance - Drain Current
VGS=4V

VGS=10V

§

3.0

c0

Ii>

2.0

Ta=125°C

0

Ta=125°C

a:

Il

2.0

r-=

~

t'l

l7S-c
2JC

'i

~
0

f-"

1.0

....I-"'"
~j5°6
.I--~

r- ~ 5°C

V

.....

,/

--

1.0

o

1.0
Drain Current IotA)

4-8

6

Gate to Source Voltage VGS(V)

Drain Current IotA)

2.0

o

2

3

Drain Current IO(A)

4

FT6110, FT6110D

Source-Drain Diode Forward Voltage

Capacitance-Drain to Source Voltage

10

Ta=25°C

VGS=OV

SOO

~

;(

Ii:

'h

E

W

u:

~

V;V

E

~

()

t=

O.S

~

.~

f-

Cl

~

II

0.2

~

II:

Ta25"C
;::::=
7SOC t- t-e12SOC

~-

f::::;;

SO

I-

l'!

.~

It

-"" ""'I--

Crss

0.8

1.0

1.2

1.4

::'.::
-

r-r---

f=t:
0.6

-f

u

O.OS
0.4

-.-4 f=
f=

Coss·

1---'

20
10

0.2

VGS =OV
f=lMHz

...

0

Ii

--1i

Ciss. ' - -

r--- ~::-".

100

u

C3

Common Source

_.. -

-

200

1i

/I

0.1

5

r---r--

-

-

~-

-

20

10

2

1.6

Drain to Source Voltage Vos(VI

Source to Drain Voltage VSO(V)

Switching Time - Drain Currant

Switching Waveform

Ta""'2SoC

200

Vg=l°~l
Rgs=SOO
P.W.=S",
O.R.< 1%

if

==0

100

J

;.

10

50

C

'd(off)

J
E

II

0

i=

I!'

I"-

,~lon)

20

i

~

III

VOO=60V

1

~ :/

~

~

'd(on)

O.S

'd(off)

---~--

::::;;

10

90

90

o --.l..I-I==:H
~~+--

'r
2

S

10

Test Circuit for Switching Time

Drain Current lo(A)

P.W.=5j1s
D.R.~l%

4-9

FT6110, FT6110D

Power Dissipation Derating
I

I

I

I

I

Note:
1.
2.
3.
4.

40

\

30

!

\

l-

I>.

0::

o

o

\~.

\.

I

II

Heat sink AP. 2mmt
Si Grease
Horizontal Position
4-Device Operation

~.

20

\9,<:,.
I\~'

!

!

\t

........
10

--

~

~

\

'fJJ"+,~ \
~~ ~

- --- F_I~~ \
o

-

~i'...: ~
....:::::!!o\

o

100

200

Ambient Temperature Ta (PC)

Maximum Transient Thermal Resistance
T1F25·C

: For One de;:'8t 4:

3.0

"'

G
~

~

~

~

E

&

4

>

3

l!
0

2.0

'C

I-

5

0

>

U

tl

6

Gate to Source Voltage VGs(V)

~
tSl
II
~

1.0

2

"?'n-

~

'f

'-

0

0

2A
lA

0

0

2

4

5

6

o

7

3

2

III

iO-3A

r-....

4

5

6

Gate to Source Voltage VGS(V)

Drain Current lo(A)

On-Resistance-Drain Current
On-Resistance - Drain Current

VGS=10V

1.0
1.1

§

VGs=4V

§

1.0
Ta-125°C

C
0
iii 0.9

C
0

~

5

0

0:8

.i

0.7

0;

0.6

II!
~

a:

0.7

J

0.6

8

25°C

0.5

1--

1.0

2.0

Crain Current IDIAl

3.0

--

I

-

75°C

~

2~oC

0.5
0.4

o

'"

I- T ... 125°C
0.8

g

~

0

0.9

iii

0

a:

I I

'"

I
o

3

4

6

7

Drain Current IO(A)

4-13

FT6111, FT6111D

Power Dissipation Derating

~ot.~

I

I

I

1. Heat sink AR. 2mrnt
2. Si Grease
3. Horizontal Position

40

\

4.

4~Device

Operation

\

30

\

!

I-

1\
\9.

0-

..,0
C

....

'1;..

C-

"l.

20

is

I

1,\\

\<:.

0
0-

~.

r- ~

S0

'i.

1,\

i'..

I-

10

ID

r- r-- '£I:,
--~
\
~+
r- r-

0

~~~">

K"
~"
f'

o

\
~I\

~~

100

200

Ambient Temperature Ta (oe)

Maximum Transient Thermal Resistance

~
0

Ta=2SoC

1000

. 0,:" devi:~;.Vii:.

"'i'

:sa:
~
S

100

c

~c

1Il

::::::

10

J

.,\~

~.

~

'I

III

./

E
I-

',/.

;\~

nlil

0.1
0.1

10

Pu Iso Width., (m.)

4-14

100

1000

cP

January 1990

FUJITSU

Edition 1.1
PRODUCT PROFILE

FT6112, FT6112D

Power MOS FET Arrays
Silicon N·chaimel Enhancement Mode Power MOS FET Arrays

ABSOLUTE MAXIMUM RATINGS
Rating
Drain Source Voltage
Gate Source Voltage

I
I

Drain Current

Continuous

Pulsed

Reverse Drain Current (Continuous)
Fast Recovery Diode Forward Current
Fast Recovery Diode Reverse Voltage
Total Drain Power Dissipation
Thermal Resistance Junction to Case
Channel Temperature
Storage Temperature

Symbol
Voss
V GS
10
10M
IDA
IFM
IFSM
VA
PT
PT
Rthl ·e
Teh

Condition

Unit
V
V
A
A
A

Value
120
±20
4.5
9

Tc = 25°C

4.5
4.5
9
130
5
40

Pw ~ 0.5 ms, DR ~ 25%
Pw ~ 100 ms, Single Pulse
Ta = 25°C, 4·MOSFET operation
Tc = 25°C, 4·MOSFET operation
Tc = 25°C, 4·MOSFET operation

A
A
V
W
W

3.2
+150
-55 - +150

T...

°CIW
°c
C

ELECTRICAL CHARACTERISTICS (Ta = 25°C) : for Single MOS FET
Parameter
Drain to Source Breakdown Voltage
Gate to Source Leakage Current
Zero Gate Voltage Drain Current
Gate to Source Cutoff Voltage
Static Drain to Source On-State
Resistance

Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn·On Delay Time
Rise Time
Turn·Off Delay Time
Fall Time

Symbol
BVoss
IGSS
loss
VGS(off)
ROS(on)
ROS(on)

g",
C.
Co.
C....
td(on}

t,
td(off)
tf

Test Condition
10 = loo/lA, VGS =OV
VGS = ±20 V, Vos = 0 V
Vos = 120 V, VGS = 0 V
10 = 1 mA, Vos = 10 V
10 = 3 A, VGS = 4 V
10=3A,VGs=10V
10 =3A, Vos = 10V
Vos =25V
VGS = 0 V
f = 1 MHz
10 = 3 A (Set Test Circuit)
Voo =60V
VGS = 10V

Min.
120

-

··
·

0.9

2.5

-

-

-

RGS = 50n
• Pulsed: Pulse Width ~ 300 /IS, D.R. ~ 6%

Limit
Typ.

Max.

-

-

-

100
100
1.7
0.5
0.4

1.3
0.32
0.25
4.5
450
140
60
25
30
75
35

Unit
V
nA
/l A

550
210
90

V
n
n
S
pF
pF
pF

-

ns
ns
ns
ns

-

SOURCE·DRAIN DIODE CHARACTERISTICS: for Single MOS FET
Forward On·Voltage
Reverse Recovery Time

V
ns

IDA = 3 A, VGS = 0 V
lOR = 3 A, dloA/dt = 100 A/Ils

FAST RECOVERY DIODE CHARACTERISTICS: for Single Diode (FT6112D only)
Forward Voltage
Reverse Cu rrent
Reverse Voltage

Copyr;9ht© "90 by FUJITSU UIlTED .... """"" _

VF
IA
VA

IF = 1 A
VA = 120 V
IA = 151lA

130

-

1.0

V

-

10

pA
V

-

-

.._on!co, Inc.

4-15

lEI

FT6112, FT6112D

Transfer Characteristics

Threshhold Region
12

Vos 10V

VOS=10V

20

10

II

10



c
>

V

4

t

I

0

~

"C

c
0

3

4

>

3

~

2

~

W

c

e

5

2

'O=4.5A

S

I-

04

C

A

0

o
o

4

6

8

o

10

Drain Current IO(A)

I I I

0.7

a:

~

0.4

!!=c

0.3

0

§
C
0

L ~-

1--

0:6

.j

VGS=4V

Ta-12SoC

C 0.6
.g

c;,
C
a:
"Xi
0

~

0.2
0.1

4

5

6

-

1
I

-

7Soc

1l

I
3

~'_1125lc

I-r-

0.4

2~C

Drain Current IO(A)

4-16

r-r-

0.3

2

I I

0.5

~

0.2

o

6

V~SLI6v

I I

0.6

!?f-

5

4

On-Resistance-Drain Current
0.7

I I I

§

3

2

Gate to Source Voltage V GS(V)

On-Resistance - Drain Current
0.8

.,c

r T T;;:

.....A

ofc

5"6
I
I
I
o

4

6

8

Drain Current IotA)

10

12

FT6112, FT6112D

Capacitance-Drain to Source Voltage

Source-Drain Diode Forward Voltage

Ta-25°C
2000

20

<
Ii:
E
<:

1000

5

u:
S

2

'j!

5

Ta=

'IL

~

<:

comTsource

VGS-OV

10

25°C
75°C
125°C

0.5

If

u

~.

0

u

~

11

~

0::

0.2

VGS-OV

r- f--r- f-~

500 f-~

- f-1MHz

c~

---

r--.-

I

200

't--

......

c rssl

100

l!l

'g
0.1

~

-

CiS

-

.-

-~I"'<;

=
=1=

50

0.05
20

0.2 0.4 0.6

O.S

1.0 1.2

10

2

1.4 1.6

20

Drain to Source Voltage Vos{V)

Source to Drain Voltage VSO(V)

Switching Waveform

Switching Time - Drain Current
Ta-25"C

90

V in

10

0 _ . ------

-

11--

10

10

V out

_90

90

o ___

.-

lellon)

lelloff)

tt

'r
0.5

2

5

10

n-

Test Circuit for Switching TIme

Drain Current IotA)

,-JWIr+_ _V-tin-c>-t

4-17

FT6112, FT6112D·

Power Dissipe1ion Deming

~-~
1. Heat sink AR 2mmt
I

40

\

I

I

2. Si Grease

3. Horizontal Position
4. 4-Device Operation

\
\

!

\

30

to.

1\

6

\<2.

'i

'ii5

I

~

~.
,,?>

20

~.

\\

0.

!

'\
'y~
10

0

"- ........

---o

-

\

~+

'-!~~
l"'t

\

1

1'' :. ,1~'\

\

\

~J' ~
-.::: ~
I

o

100

200

Ambient Temperature Ta (oC)

~
u

...'I'

Maximum Transient Thermal Resistance
Ta-25"C

1000

For One device at 4-device
operation (F rae Ai r)

iII:


1i

<;j'''~.

E
G
""t-

1

0.1

0=','"

" '!f

~
0.1

1111
10
Pulse Width t1 (ms)

4-18

100

1000

OJ

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

FT6120, FT6120D
Power MOS FET Arrays
Silicon N-channel Enhancement Mode Power MOS FET

ABSOLUTE MAXIMUM RATINGS
Rating

Symbol

Condition

Drain Source Voltage

Voss=_.

Gate Source Voltage

VGS

I
I

Drain Current

Continuous
Pulsed

10
10M

Reverse Drain Current (Continuous)

lOR

Fast Recovery Diode Forward Current

IFM
IFSM

Fast Recovery Diode Reverse Voltage
Total Drain Power Dissipation
Thermal Resistance Junction to Case
Channel Temperature
Storage Temperature

Unit

Value
120
±20

V
V

Tc = 25°C

1.5

A

._----.

3
1.5

A

Pw ~ 0.5 ms, DR ~. 25%

1.5

A

Pw ~ 100 ms, Single Pulse

3

A

130
3.5

V
W
W
°CIW
°c
°c

VR
PT
PT

Tc = 25°C, 4·MOSFET operation

28

Rm).e

Tc = 25°C, 4·MOSFET operation

4.5

Ta = 25°C, 4·MOSFET operation

A

+150
-55 - +150

Teh
T ...

ELECTRICAL CHARACTERISTICS ITa = 25°C) . for Single MOS FET
Parameter

Symbol

Test Condition

Min.

Limit
Typ.

Max.

Drain to Source Breakdown Voltage
Gate to Source Leakage Current

BVoss

lo-l00pA,VGs-OV

120

IGSS

VGs-±20V,Vo s-OV

Zero Gate Voltage Drain Current

loss
VGS(off)
ROS(en)

Vos = 120 V, VGS = 0 V

-

-

10 -1 mA, Vos -10V

0.9

1.3

1.7

V

-

1.2

1.7

n

Gate to Source Cutoff Voltage
Static Drain to Source on State
Resistance
Forward Transconductance

- - J:!.oS(on)
g..

10 = 1 A, VGS = 4 V
10=IA,VGs=10V
10 = 1 A, Vos = 10V

Input Capacitance

C..

Vos = 25 V

Output Capacitance
Reverse Transfer Capacitance

Co..
C...

Turn·On Delay Time

td(on)

VGS =OV
f = 1 MHz
10 = 1 A (See Test Circuit)

Rise Time
Turn·Off Delay Time

t,
td(off)

Voo =60V
VGs=10V

Fall Time

tf

RGS = 50n

··
·

-

Unit

100
100

V
nA
pA

-

0.9

1.3

n

0.8

1.3

-

-

130
45

170
80

S
pF
pF

15

30

pF

20

-

ns

10

-

ns

40

-

ns

10

-

ns

• Pulsed: Pulse Width ~ 300 tJs, D.R. ~ 6%

SOURCE·DRAIN DIODE CHARACTERISTICS: for Single MOS FET
Forward On·Voltage
Reverse Recovery Time

V
ns

lOR = 1 A, VGS = 0 V
lOR -1 A,dloR/dt-l00AltJs

FAST RECOVERY DIODE CHARACTERISTICS: for Single Diode IFT6120D only)
Forward Voltage

VF

IF = 100mA

Reverse Current
Reverse Voltage

IR

VR - 120 V

-

V"

I" -10pA

130

CoPyrI9h.© ,."

-

1.0

V

5

tJ A
V

-

or FWrrsu UlaTED .... F_ _ani... Inc.

4-19

FT6120, FT6120D
Threshhold Region
VOS=10V

20


1.5

0

>

/'

/
I

0

II)

l!

!\..

2

\.

c

'0e

0.5

o

o

4

2

2

4

3

5

Gate to Source Voltage VGSIV)

On-Resistance-Drain Current

On-Resistance - Drain Current
VGS-4V

3.0

VGS=10V

§

§

"i:
0
0;

-

0

2.0

.j

Ta-12S"C ,..

75°C

==Fr
11
I

o

1l

1.0
Orain Current lOlA)

I--"

-

;

'iii

II:

/'

Ta=125°C

0
II:

-

2s"C
1.0

"i: 2.0
0
0;

/'

,..

-1

-

~
c
0

4-20

1.0A
TO.5A

"-

Drain Current lo(A)

.g

...... ~A

r--.

0

o

II:

6

Gate to Source Voltage VGSIV)

Gate to Source Voltage VGS(V)

VOS=10V _

~

75°C

,..

i.- I-

25°C
1.0

r-

<:

0

2.0

o

3
Drain Current IO(A)

4

6

FT6120,FT6120D
Source-Drain Diode Forward Voltage
Capacitance-Drain to Source Voltage

10
VGS OV

;(

Ii:

2

V-

E
~

c

0.5

I-

.~

0

~

~
II:

~

&

Ta25 C
75"C

~



i'\:

10

'\
1\
r---l::.."'eAir

o

I I F= +--l\
o

100

200

Ambient Temperature Ta (OC)

Maximum Transient Thermal Resistance
Ta=25"C

For One device at 4-dev ice
operation (Free Air)

0=0.5
0.2

-

0.1
0.05

'iJ\"~.

;....-

fl"\'"
0=t 1 /t,

t

mr
111111
10
Pulse Width tl (ms)

4-22

urt,
III
100

TTIIll

IIIII
1000

cP

January 1990
Edition 1.1

FUJITSU

PRODUCT PROFILE

FT6121, FT6121D
Power MOS FET Arrays
Silicon N-channel Enhancement Mode Power MOS FET
(Ta = 25°C)

ABSOLUTE MAXIMUM RATINGS
Rating
Drain Source Voltage
Gate Source Voltage
Continuous

I
I

Drain Current

Pulsed
Reverse Drain Current (Continuous)
Fast Recovery Diode Forward Current

Fast Recovery Diode Reverse Voltage
Total Drain Power Dissipation
Thermal Resistance Junction to Case
Channel Temperature
Storage Temperature

Symbol
Voss
VGS
10
10M
lOA
IFM
IFSM
VR
PT
PT
R"".c
Tch
T...

Value

Condition

Tc - 25°C

Pw ~ 0.5 ms, DR ~ 25%
Pw ~ 100 ms, Single Pulse
Ta - 25°C, 4·MOSFET operation
Tc = 25°C, 4-MOSFET operation
Tc = 25°C, 4-MOSFET operation

120
±20
2.5
5

Unit
V
V
A
A

2.5
2.5
5

A
A
A

130
4

V
W
W

32
3.9
+150
-55 - +150

CIW
C
C

ELECTRICAL CHARACTERISTICS (Ta = 25°C) : for Single MOS FET
Parameter
Drain to Source Breakdown Voltage
Gate to Source Leakage Current
Zero Gate Voltage Drain Current
Gate to Source Cutoff Voltage
Static Drain to Source On-State
Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn·On Delay Time

Symbol
BVoss
IGSS
loss
VGS(off)
RoS(on}

ROS(on)
gfs
C..
Co.
C".

Rise Time

td(on)
t,

Turn-Off Delay Time
Fall Time

td(off)
t1

Test Condition
10 = 100pA, VGS = 0 V
VGS = ±20 V, Vos = 0 V
Vos=120V,VGs=OV
10 = 1 mA, Vos = 10V
10 = 1.5A, VGs =4V
10 = 1.5A, VGS = 10V
10 = 1.5A, Vos= 10V
Vos - 25 V
VGS = OV
f = 1 MHz
10 - 1.5 A (See Test Circuit)
Voo=60V
VGS = 10V

Min.
120

-

··
·

0.9

1.2

-

RGS = 50n
• Pulsed: Pulse Width ~ 300 IlS, D.R. ~ 6%

Limit
Typ.

1.3
0.55
0.45
2.4
280
80
35

Max.

100
100
1.7
0.75
0.6

360
130
60

20
15
55

-

15

-

-

Unit
V
nA
IlA
V
n
n
S
pF
pF
pF
ns
ns
ns
ns

SOURCE-DRAIN DIODE CHARACTERISTICS: for Single MOS FET
Forward On-Voltage
Reverse Recovery Time

V

IOA=I.5A,VGs=OV
lOA = 1.5 A, dloA/dt=IOOA!lls

ns

FAST RECOVERY DIODE CHARACTERISTICS: for Single Diode (FT6121D only)
Forward Voltage
Reverse Current
Reverse Vol tage

Copyright

VF
IA
VA

IF = 100mA
VR = 120V
IR - 10llA

-

130

-

1.0
5

-

V
IlA
V

© 1980 by FWITSU LI .. TED and Fulfteu Mieroelectronlc8,lnc.

4-23

FT6121, FT6121D

Transfer Characteristics

Threshhold Region
VOS=10V

20



Ta=25°C

E

E
E

~
~
u

E

75°C

5

1'25~C

2

IT

.~
0

I

.

IT

I

...

6

5

~

4

u

3

"

-

'§

-

0

2

o
0.8

1.0 1.2 1.4

1.6 1.8 2.0

o

Gate to Source Voltage VGS(V}

>

Vo =10V

4

5

6

Ta~5"C

6

~

5

~

4

~

3

>

3.0

~

0

>
2.0

~

0

VI

J

3

Drain to Source Saturation Region

Ta=25°C

~

2

Gate to Source Voltage VGS(V)

Transconductance-Drain Current

]

125°C

-

0.5

j

Ta=~~:t

5

g

2

IO=2.5A

c

1.0

'f

o

t-

.....

0

2A
lA

0

o

2

3

o

6

4

4
5
Gate to Source Voltage VGS(V)
2

Drain Current IO(A)

6

On·Resistance·Drain Current
On-Resistance - Drain Current

1I 1
11 r

1.0

§
c:0

0.9

Q
It:

0.8

Ta=125"C

-H"

iii

0.6

II

"

7~

§

t-

c:
0

:1 c

0.5

l-;::;o'

11c

1.0

-

0.7

II-

.... --

75°C

~

0.6

It:

0.5

C

1---

V

r-"a=125°C

1-

'jB

25LC

0

-f-

0.4

I
o

0.9
0.8

iii
It:

1

0

2.0

Drain Current IO(A)

4-24

~v

0

II

0.7

VG

I 1

iii

.~"

VGS-l0V

1.0

1.1

3.0

o

2

3

4

Drain Current IO(A)

5

6

FT6121, FT6121D

Source-Drain Diode Forward Voltage
Capacitance-Drain to Source Voltage

10

Ta=25°C

VGS=OV
1000

ommo~ ~~~~~

~

~

Ii:
9

1/1

2

r-_

'/

1/·/
Ta5°C
75'C

c

~~

0

0.5

c

t-

"j!
Q

~

~

It

-III

0.2

"-

100

125°~_ '--'-

Ciss

I'--

200

t= t=:=

I- 1-1-

t---.Coss
Crss

----.

50

III

0.1

F

r-t--r--

f=IMHz

500

rrr-

20
0.05
10
0.2

0.4

0.6

0.8

1.0

1.2

1.4

5

1

1.6

10

20

Drain to Source Voltage VOS(V)

Source to Drain Voltage VSO(V)

Switching Time - Drain Curront

Switching Waveform

Ta=25°C

r---,90

Voo=60V

~

200

Vg=10~J

Rgs=50n
P.W.=.)!",
D.R.=I%

iF

~

100

~

,s.

e0

.,c

:c
.~

'"

V out

'dloff)

10

10

50

~

E
;::

10

o

II
20

tf
10
0.5

~

tdlon)

90

~

90

o __ 1-.1_'/===~...1.
'dlon)

I...-

'dloH)

ffr
2

5

10

Test Circuit for Switching Time

Drain Current IO(A)

r------1
I

II

Rg,

I
I

IL _____ ...l

P.W.=5",
O.R.~I%

4-25

FT6121, FT6121 0

Power Dissipation Derating

~0t8,1

I

I

I

1. Heat sink AR. 2mmt
2. Si Grease
3. Horizontal Position

40

4. 4-Device Operation

\
\
\
\~.

t.~

~.

~.

%,
!\

10

\
\

-

\

..!:.!.... A.ir

o

o

T- -~

200

100

Ambient Temperature Ta (Oe)

Maximum Transient Thermal Resistance
Ta-25°C
For One device at 4-device

~ 1000

,

0

eo.

dperation (Free Air)

~
;;:

100

0=0.5

S
~

0.2

0

~

0.1

~

i

I-'

0.05

10

<;,,';8

a:

v",,9b
O=t,lt,

'iii

E
G

~

t,

.j
!!

to.

tJ

V

IIII

0.1
0.1

10
Pulse Width t, (mo)

4-26

100

1000

OJ

January 1990

FUJITSU

Edition 1.1

PRODUCT PROFILE

FT6122, FT6122D
Power MOS FET Arrays
Silicon N-channel Enhancement Mode Power MOS FET Arrays
(Ta = 25°C)

ABSOLUTE MAXIMUM RATINGS
Rating
Drain Source Voltage

Drain Current

I

Condition

Continuous

10

Unit

Value
120

Voss
V GS

Gate Source Voltage

I

Symbol

Tc - 25°C

V

±20

V

4

A
A

10M

B

Reverse Drain Current (Continuous)

lOR

4

A

Fast Recovery Diode Forward Current

IFM
I FSM

4

A

Fast Recovery Diode Reverse Voltage

VR

Pulsed

Total Drain Power Dissipation
Thermal Resistance Junction to Case
Channel Temperature
Storage Temperature

Pw~0.5ms,DR~25%

Pw ~ 100 ms, Single Pulse

B

A

130

V
W

PT

Ta = 25° C, 4·MOSF ET operation

4

PT

Tc = 25°C, 4·MOSFET operation

36

W

Rthi -c
Tch
TS1g

Tc - 25°C, 4·MOSFET operation

3.5

CIW

+150

C

-55 - +150

C

ELECTRICAL CHARACTERISTICS (Ta = 25°C) : for Single MOS FET
Parameter

Symbol

Test Condition

Min.

Drain to Source Breakdown Voltage

BVoss

10 - 100jolA, VGS - 0 V

120

Gate to Source Leakage Current

IGSS

VGS = ±20 V, Vos = 0 V

Limit
Typ.

-

Max.

Unit

-

V

100

nA
JJ.A

Zero Gate Voltage Drain Current

loss

Vos = 120 V, VGS = 0 V

-

-

100

Gate to Source Cutoff Voltage

VGSIOtl)

10 -1 mA, V os -l0V

0.9

1.3

1.7

V

Static Drain to Source On-5tate
Resistance

ROSlon)

10

-

0.32

0.5

n

ROSlon)
g,.

n

Forward Transconductance

10 =3A, Vos = 10V

I nput Capacitance

Cis

Vos =25V

Output Capacitance

C.,..

VGS =OV

Reverse Transfer Capacitance

C,..

f = 1 MHz

Turn·On Delay Time

td(on)

10 = 3 A (See Test Ci rcuit)

RiseTime

t,

Voo =60V

Turn·Off Delay Time

tdlotl)

VGS = 10V

Fall Time

tf

RGS =50n

3A, V GS

4V

10 =3A, VGS = 10V

··
·

-

0.25

0.4

2.5

4.5

-

S

-

450

550

pF

140

210

pF

60

90

pF

25

-

ns

30
75
35

ns
ns
ns

• Pulsed: Pulse Width ~ 300 /J.S, D.R. ~ 6%

SOURCE-DRAIN DIODE CHARACTERISTICS: for Single MOS FET
Forward On·Voltage

lOR = 3 A, VGS = 0 V

V

Reverse Recovery Time

lOR = 3 A, dloR/dt = 100 A/JJ.s

ns

FAST RECOVERY DIODE CHARACTERISTICS: for Single Diode (FT6122D only)
Forward Voltage

VF

IF = 1 A

Reverse Current

IR
VR

V R = 120V

-

IR -15jo1A

130

Reverse Voltage

-

-

1.0

V

10

JJ.A

-

V

Copyrlgh.© , ... by FWITSU UlllEO .... FuJtou - . . . 1... Inc.

4-27

FT6122, FT6122D

Transfer Characteristics

Threshhold Region
12

V'DS~lriV

VOS-l0V

20

10

II

10



.Jj

0

0.5
1.0 1.2

0.8

1.4 1.6

o

1.8 2.0

Gate to Source Voltage VGS(V)

."

/
3

2

6

5

4

Gate to Source Voltage V GS(V)

Transconductance-Drain Current

Drain to Source Saturation Region

Ta~25°C

Ta=25°C
6

VOS=10V

6

..

§

iIIr:

.,:;c

f-

5

>

IL

V

4

~

i

4

>

3

il

2

'0

tl

3

~

W 2
f

en

"D

r:
0

r:

5

"

S

I-

o

A

0

o

2

4

6

8

o

10

On-Resistance - Drain Current
0.7

VGS=4V
0.7

g

c

II:

!lr:

0'.5

.j

0.4

~
r:
0

0.3

Ta=125°C

~!--

o

~

0.3

r--

II:

0.2

g

f-

J

_125 C

0.5
0.4

II:

Ta=125 C
75"C
2h

0

Drain Currant lo(A)

......

4

6

5

0.1
6

->-

.~

i:

2

5

JGS~I&V

0.6

-

c

I
I

0.2

4-28

C
0
in

~

,...-t'""
- - _175l C

4

On-Resistance-Drain Current

0.8

C 0.6
0
in

3

2

Gate to Source Voltage VGS(V)

Drain Current IO(A)

g

!p=4A

~

r:

e<:>

I
o

2

4

6

8

Drain Current IO(A)

10

12

FT6122, FT6122D

Capacitance-Drain to Source Voltage

Source-Drain Diode Forward Voltage

Ta=2SoC

20

2000

comml:VGS=ov

'VG -OV

5"':

':h/~

.:!I
0.1

III

./
0.1

10
Pulse Width tl (ms)

4-30

100

1000

Section 5
Design Information Plllle
5-3

At a Glance

TlUe
AppUcation Noles

5-3

Uhra-High Speed Voltage SW~ching Transistor

5-19

Obtaining Optimum Performance lrom Ring Emitter
Transistors

5-29

Using Bipolar Ring Emitter Transistor

5-37

Using Ring Emitter Transistors

5-45 Quality Con1ro1 at Fuj~su
5-47 Quality Con1ro1 Flowchart

5-1

Design Information

5-2

Power Transistor Products

January 1990
Edition 1.1

APPLICATION NOTE

rufrrsu

A New Ultra-High Speed Voltage
Switching Transistor
Fujitsu Microelectronics, Inc.
Copyright© 1990 by Fujitsu Microelectronics, Inc.

ABSTRACT
The silicon Ring Emitter lransistor (RET) device is a power semiconductor which utilizes a concept of
combining many small, high frequency transistor cells on one chip, in order to provide high power handling
capability. A typical RET consists of several hundred multiple ring-emitters connected to a common emitter
electrode through diffused ballast resistors. RET devices offer significant improvement over conventional
power transistors due to their high speed switching characteristics and 1arge reverse bias safe operating area
(RBSOA). An ultra-high speed switching regulator was constructed with RET devices; based upon test results,
this application appears practical and superior to low frequency designs utilizing conventional; transistors.

5-3

Ultra-High Speed Voltage SwItching Transistor

5-4

Power Transistor Producls

Power Transistor Products

Ultra-Hish Speed Voltage SWitching Transistor

Introduction
The past decade has witnessed rapid progress in the design of voltage regulators for sophisticated
electronic systems. Perhaps the most significant advance has been the development of switching
regulators which, compared to series-pass regulators, offer improved efficiency, smaIl size, lighter weight
and better reliability. Applications for switching regulators now encompass a wide range of electronic
systems; these include computers, microcomputers, communication equipment, test and measurement
equipment and consumer products such as audio amplifiers.
The normal switching frequency for switching regulators has been limited to about 20 KHz because of
practical limitations imposed by the components utilized to manufacture the products. However, it is
recognized that higher frequency regulators would have advantages in size and weight reduction, as well
as improved reliability by eliminating the electrolytic capacitor. But in order to design a high frequency
switching regulator, new power transistors that can operate reliably at high switching frequencies without
additional switching losses are required.
The advanced technology of the RET device offers features which make such high frequency switching
regulators possible. This paper will discuss the RET structure, performance and application in a 0.5 MHz
switching regulator.

The Ring Emitter TranSistor
In power transistor device fabrication, the historical trade-off between speed and power has resulted in
optimized performance for safe operating area (SOA) or switching speed (or frequency response), but not
both. Usually, high switching speed or frequency could only be obtained by limiting voltage or current
parameters to a reduced SOA.

The unique RET structure (discussed in the next section) was developed to solve this problem by
permitting a more optimum high switching speed and frequency response without reduction is SOA.

5-5

Ultra-High Speed Voltage Swilching Transistor

Power Transistor Products

RET Structure
In general, the RET design concept consists of many small geometry high frequency transistor devices
integrated on one silicon chip. The multiplicity of parallel connected devices provides the high current
capability of the integrated structure.
The RET device typically consists of several hundred small, ring-like shaped emitters connected by a
common emitter electrode through diffused resistors. The ballast resistors insure uniform distribution of
current to each emitter and prevent thermal runaway, even with a shallow base diffusion.

Figure 1 is a photo-micrograph of a RET transistor chip. In Figure 2 and Figure 3, two types of RET cell
geometry are shown. Both types have similar performance characteristics. In Figure 2a, the outer ring-like
area is the base contact region, and the enclosed inner region (bold line) is the emitter area. Cross-hatching
indicates the diffused ballast resistors. Orcular areas in the base contact region are base contact windows.
Within the emitter region, there are five rectangular contact windows. The two windows connected by the
ballast resistor regions connect the emitter electrodes to the ballast resistors; and the center window
connects the ballast resistors to the shorting-bar electrode. The other two windows are emitter area
contacts to the shorting-bar electrode. All electrodes are aluminum and are indicated by dashed lines. The
cell shown in Figure 2a is 150 X l.51J!un.
A cell cross-section is shown in Figure 2b at the line A-A indicated in Figure 2a. The base diffusion depth
is about 511J1l and the emitter diffusion depth is about 2.511J1l. The ballast resistor is diffused about ll1J1l.
The center portion of the emitter area is more shallow than the active emitter area in order to reduce
internal base resistance and prevent current crowding during tumo{)ff mode.
Current flow in the RET device, referring to Figure 2b is "C" _ "i" - "B" - "E" - "S.E." - ''R'' - "E.E"
for an NPN transistor.
The equivalent circuit for the RET device is shown in Figure 2c.

Figure 1. Photomicrograph of RET Chip

5-6

Power Transistor Products

Uhra-High Speed Voltage Switching Transistor

B-E-

E-.E..

LE.

B-E-

Figure 28. RET Cell Geometry Dashed Lines Indicate Electrodes
Legend:

E:
emitter area
B:
basearea
E.E: emitter electrodes
B.E: base electrodes
S.E: shorting-bar electrode

Legend:

R:

Figure 2b. RET Single Cell Cross Section of Figure 2a, Line A·A.
diffused ballast resistor layer
E:
emitter layer
base layer
B:
p+: base contact layer
i:
intrinsic layer
C:
collector layer
E.E: emitter electrodes

B.E: base electrodes
S.E: shorting-bar electrode
R.C: resistor contact windows
S.C: shorting-bar rontact windows
E.C: emitter contact windows
B.C: base contact windows
Cross-hatch areas are silicon dioxide passivation.

5-7

Ultra-High Speed Vollage SW~ching Transistor

Power Transistor Producls

Planar technology is utilized in the RET structure to provide stable high voltage operation; and silicon
dioxide passivation prevents surface contamination.

c

E

Tr, and R, "'present one RET eel. The RET slrUcture conaislS of H\I9ra1 hundllld een •.

Figure 2c. RET Equivalent ClrcuH

B.E

E.E

B.E

Figure 3. RET Single Cell Geometry
Dashed lines indicate electrodes.
Legend:

E:

emitter area
base area
E.E: emitter electrode
B.E: base electrode
B:

5-8

Power Transistor ProdUCIS

Ullra-High Speed Voltage Switching Transistor

RET Performance Characteristics
DC Current Gain
RET devices have very linear DC current gain. This is attributed to the large emitter periphery, reduced
base resistance and unifonn current distribution through the diffused balJast resistors.
Gain Bandwidth Product and Safe Operating Area
Gain bandwidth product (ft ) isa function of base width. Conventional power transistors can be built with
a high gain bandwidth product, but only by sacrificing SOA. However, with the RET structure, both high
ft and large SOA can be achieved. The RET shallow base, which permits high ft. will not result in thermal
runaway problems because the ballast resistors control unifonn current distribution to each emitter.
Further, the ballast resistors provide greater power dissipation area and improve the secondary
breakdown characteristics of the device.
Saturation VoHage
Saturation voltage is a function of emitter periphery and the resistance of the collector layer, intrinsic
layer, base layer, emitter layer and, in the case of a RET, the ballast resistor; that is, the resistance of the
current path in the transistor. For a unit RET cell, the diffused ballast resistor has a value of about 15
ohms. For a RET device with 758 cells, the parallel resistance value of all the cells is only about 20
milliohms for the entire chip. Further, the base resistance is reduced by the long emitter periphery relative
to the small base area. This permits relatively low saturation voltage at high operating currents.
Switching Time and Reverse Bias Safe Operating Area (RBSOA)
In general, a conventional power transistor designed for high switching speed cannot withstand the
energy in-rush in the reverse bias tum-off mode. The flyback voltage N f) at tum-off can be written as:
Vf=VCEX-Vee=L:
=L Icp (1)
tf
Where: VCEX = collector-emitter voltage
Vee = collector bias voltage
L
= load inductance
Icp = peak collector current
tf
= fall time
Thus, a fast tum-off device with limited current handling capability (or vice-versa) is limited by its
maximum RBSOA to driving relatively smaller inductive loads.
With the RET structure, a method for solving the problem caused by the relationship between RBSOA and
switching time has been determined. Two different kinds of RET structure were made experimentally. In
Type-A, the length of one side of the unit cell was 15OJun; in 'JYpe-B, the cell side dimension was 400Jun.
Identical wafer processing conditions were utilized, and both devices had the same base area and
electrical ratings NCEO = 400 V, Ie = 15 A, Pc = 150 W). Experimental results are shown in Table 1.

5-9

Ultra-High Speed Voltage SWitching Transistor

Power Transistor Products

Table 1. Comparison of Experimental Data for Two Types of RET Structure
Characteristics

A

B

J1

150

400

Unn.

UnHSize
No. of Unit at One Chip

pes

758

112

Emitter Area (AE)

em2

0.078

0.076

Emitter Periphery (LE)

em

33.6

15.2

LEIAE

1/em

431

200

35
35

35
0.32

DC Current Drain

-

Gain Bandwidth Product

MHz

Rise TIme

J1S
J1S

0.15
1.20

1.20

IJ.S

0.10

0.26

A

12

3

Storage TIme
Fall TIme

35

Secondary Breakdown
Current

From Poisson's equation, the secondary breakdown current, isIS, (3), (4), (5) can be written by:
Is/B

=EC Z2.

E.Y. Y.W
(S t B) (2)

VCE.IBVl'B
Where: Ee

Z
E

= critical field corresponding to the onset of avalanche injection

= emitter periphery dimension

= permittivity
= electron saturation voltage
= thennal voltage
WB = basewidth
VCE = clamped voltage
IB
= base current
= base resistivity
PB

Vs
Vr

5-10

Ultra-High Speed Voltage Switching Transistor

Power Transistor Products

IS/B is measured with the test circuit shown in Figure 4_

Vea.

182
Current Probe

To Oscilloscope
TUT

ReBI

Clamp
Diode

Jl

Vee

P.G.
VClNAP

0.10

ISIB

To OscillosoopB

Figure 4. Test Circuit Used for Measurement of Reverse Bias SOA and VCEX (sus)
Under reverse bias turn-off conditions, the current is usuaIly concentrated in the center portion of the
emitter area of a conventional power transistor. But in a RET structure, the ring emitter geometry
constrains current concentration to a large periphery at the inner edge of the ring. Figure S shows the RET
current concentration, Figure Sa, compared with a conventional device, Figure Sb. Therefore, as the Figure
indicates, a shallow, low resistance base is adequate for a higher current density.

g

p
a RET

E

B
C

I
b Conventional TR.

Figure 5. Transistor Current Concentration In Tum-off Mode
Legend:

E:

emitter
base layer
C:
collector layer
Experimental results indicate that IS/B and faIl time caIlate to ceIl unit size; that is, they are proportional to
internal base resistance. This is shown in Figure 6 for the experimental results listed in Table 1. The results
B:

compare weIl with the theoretical calculation of Poisson's equation [eq. (2» IS/B which is plotted with a
dashed line in Figure 6.

5-11

Ultra-High Speed Voltage Switching Transistor

Power Transistor Products

,
10

7

5

"
---

"'- ~

ISIB

~

-~

3
2

/
/'

o.7
100

V

'-/
~

0.5

/

,,,

0.3
0.2

~

0.1
0.07

500

700

Figure 6. IS/s and t, at the Dependence of Unit Size
Therefore, the structural features of a power transistor device which offers good RBSOA and fast
switching characteristics, such as the RET, can be summarized as follows:
a. Large emitter periphery in a limited base area.
b. Reduced base resistance.
c. Hollowed-out center portion of the emitter area.
d. Uniform, shallow diffusion of the base and emitter regions.
Figure 7 shows Switching time at the dependence of collector current for the Type-A RET, 2SC2429. Figure
8 shows RBSOA for the same device compared to a conventional power transistor geometry.

5-12

Ultra-His/! Speed VoIlape Switching Transistor

Pawa' Transistor Products

Ta =25"C

3

2

0.7

~
...

0.5

I-

-r---.. r.....

"'-

I-Vcc= 150V
I- IBI = -l82 • Ie 15
Pulse Width = 100 J1 S

Jo

w
:::ii

0.3

(!l

0.2

(Resistiva)

IY /

;:::

:r

i

"

Duty Ratio ~ 1%

~

.j

z

"

0.1
0.07
0.05

/ ;I

~

~

--

" ......... ".........

/

-::::;:::;;'"

./

~

r--

..>-

23571020
Collector Cunen~ Ie (A)

Figure 7. Switching TIme
Te = 25°C

L= 200llH
182-1 A
RaB2= Q

20

\

~
.!l

j

I

Conventional P. 1,.
10

\
\

\

\\

"

RET

~

-

0
0

200

400

600

Collector-Emittar VoiIage. Vcex (V)

Figure 8. Reverse Bias Safe Operation Area

5-13

Ultra·High Speed Vollage SWitching Transistor

Power Transistor Products

Temperature Characteristics
In a power transistor, electrical characteristics at the dependence of temperature are of critical importance
in most applications. In a conventional transistor, case temperature must be maintained in the 600C to
800C region for normal steady state operation to prevent degradation of switching speeds. With the RET
structure, the device characteristics exhibit less variation at the dependence of temperature. This is shown
in Figure 9 which compares fall time and storage time for conventional and RET (2SC2429) devices at the
dependence of case temperature.
4

~~/ ........
~

"'to

1.0-.......
3

~

....

~...
.j

~

2

F

~

f\E1f..----~

~

f.--

~k\f'

--

1------ ~-

_to

-

-~

RET
~

o

20

40

60

80

100

120

140

Case Temperature, Tc (oC)

Figure 9. SWnchlng TIme at the Dependence of case Temperature
A High Frequency Swnchlng Regulator UsIng RET
A high frequency, single-end forward type DC-DC switching converter can be constructed with RET
devices.For experimental purposes, four such systefns were constructed utilizing the 2SA1041 RET at
switching frequencies of 20 KHz, 100 KHz, 0.5 Hz and 1.0 MHz. The same circuit was also utilized for
comparison with conventional switching transistors except that operation was found to be impractical
above 200 KHz. Results comparing the RET to the conventional transistor are shown in Figure 10 which
plots power loss vs. frequency for the power transistor.

5-14

Power Transistor Products

Ultra-High Speed Voltage Switching Transistor

20

-~ET

!.

- - - Conventional T,.

V

5

,., ,.,"

2

..,"
,......
~
20

VV

50
100
200
Switching Frequency (KHz)

500

1000

Figure 10. Loss Measurement In Converter Application

Base Driwr

+

~IL

Tr·1

01

Ein
48V

Tr.•

T1

AMP.

IE.REF.

Figure 11. Block Diagram of DC-DC Converter, 0.5 MHz

5-15

Ultra-High Speed Voltage Switching Transistor

Power Transistor Products

tr'1 RET (2SA1041)
TR 2 : 2SC2080, 2SC1150
Figure 11 shows the circuit block diagram of the 0.5 MHz converter. Input voltage is 48 V DC, and output
voltage is 5 V and 10 A. Rectifiers D1 and ~ are Schottky barrier diodes. The magnetic core material of
the main transformer is ferrite. The operating waveforms for the main switching device, RET 2SA1041, are
shown in Figure 12. Figure 13 shows output voltage regulation and efficiency at the dependence of the
output current. Total conversion efficiency above 4 amps was better than 80 percent..

Ir 1-\

lr- "'" Ia.

o 18

L

~.
r'" r\

r\. ,.,..
1

r

~

\

,.

'Y "\

o VeE

"..

I

o Ie

12a. Operating Wayeforma nme: O.5J1.S1dlv.,
Is: 500 rnA/dlv.,VeE: 5OIdlv.,lc: 2Aldlv.

Irr\..
VeE ~

J

it-'"
V I\,

r....

~Ie

~

0

12b. Turn-on Waveforma nme: 50 nsSldly.,
Vee: 20Vldlv.,le: 1 Aldly.
A

1'1.

J

Ie

"

V

r

.&

V

\

'V

.A

-

VeE

0

12c. Turn-off Wayeforma nme: 50 nsSldly.,
Vee: 2OVldlv.,Ic: 1A1dlv.

Figure 12. Operating waYelonns of DC-DC Conyerter, 0.5 MHz

5-16

Power Transistor Products

Ultra-High Speed Voltage Switching Transistor

~

l

I="

~
c:

VOUT

100
90

5.0

.iI!

ill
w

5.5

1\

....

80

)r"""

~

J
J
~

4.5

i

70

0

2

4

6

8

10

12

Output Currant (A)

Figure 13. Output and Efficiency of RET Converter
Legend:

X:
.:
0:

VIN = 43 V DC
VIN =48VDC
VIN =53VDC

Conclusion
The RET structure is a superior power transistor for applications where high RBSOA and fast switching
speed are required.
Switching speed and RBSOA depend on internal base resistance which is minimized in the design of a
RET. RET devices can operate satisfactorily in high frequency switching regulators. An experimental
circuit was constructed that result in 80 percent efficiency at a switching frequency of 05 MHz.
In the future, if smaller geometry cells are realized, even better RBSOA and higher switching speeds may
be obtainable.

Acknowledgement
The authors would like to thank Mr. Y. Saito and Mr. K. Katori for their helpful suggestions and
comments.

References
J. R. Hauser. IEEE Trans. on Electron Devices. Ed. 11, pp.238-242 (1964)
P. L. Hawer and V. G. K. Reddi.IEEE Trans. on Electron Devices, Ed. 17, pp. 320-335 (1970)
M. Kobayashi and Y. Nawata. Nikkei Electronics No. 165, pp. 106-1215 (1073) (in Japanses)
S. Krishina and P. L. Hower. Proceeding of the IEEE, No,. 61, pp. 393-395 (1973)
K. Tsuda. Mikkei Electronic No. 191, pp. 87-99 (1978) (in Japanese)

5-17

Ultra-High Speed Vollage Switching Transistor

5-18

Power Transistor Products

OJ

January 1990
Edition 1.1
APPLICATION NOTE

FUJITSU

Techniques for Obtaining Optimum
Performance from Ring Emitter Transistors
(Reprinted from Application Note AN003)

Fujitsu Microelectronics, Inc.
Copyright© 1990 by Fujitsu Microelectronics, Inc.

5-19

Obtaining Optimum Perfonnance from Ring Emilt8r Transi81Dr8

5-20

Power Transistor Products

Power Transistor Products

Obtaining Optimum Performance from Ring Emitter Transistors

Introduction
The past decade has witnessed rapid progress toward the sophistication of efficient switching regulators
for use in electronic systems.
The nonnal switching frequency of regulators has been limited to around 20 KHz because of inadequacies
in both active and passive components used to manufacture the regulator. However, it is recognized that
higher frequency regulators would offer incredible advantages in decreasing size and weight, not to
mention a savings in energy and resources.
In order to design such a high frequency switching regulator, new power transistors are needed that can
operate reliably at high speed without additional switching losses. The advanced bipolar technology of
the Ring Emitter Thansistor device now makes such high frequency operation possible and economical.
This application note will discuss how to derive the maximum performance from the RET.

Maximum Ratings and Electrical Characteristics
(Note: This section will reference a 2SC3056A, which is a 450 V, 6 amp RET.>

Collector-Emitter Avalanche Voltage
Figure 1 shows the shape of the avalanche characteristics of a triple diffused power transistor which is
identical to that of the RET.
VCEO
VCEO(sus)

VCER
VCEX(VCEV)

Veps
VCBO

Collector-Emitter Breakdown Voltage, Base Open
Collector-Emitter Sustaining Voltage, Base Open
Collector-Emitter Breakdown Voltage, Base-Emitter Resistor
Collector-Emitter Breakdown Voltage, Base-Emitter Reverse Bias
Collector-Emitter Breakdown Voltage, Base-Emitter Short
Collector-Base Breakdown Voltage, Emitter Open

5-21

Obtaining Optimum Perionnance from Ring Emitter Transistors

Power Transistor Products

v
Figure 1. Avalanche Characteristics
Collector and Base COunt
The maximum collector current (continuous and pulsed) and base current (continuous) are detennined as
follows:
Collector Current (continuous) -Ie:
DC current applied for five minutes with no damage.
Collector Current (pulse) -Icp:

Pw .s 10 ms, D. R.s 2% (2SC3056A)
Base Current (continuous):
Same condition as for Ie

Safe Operating Area
Forward Bias Safe Operating Area, Base-Emitter Forward Bias (Figure 2).
There are four types of limitations:
1. Collector Current (pulse) Limit
2. Thermal limit
3. Secondary Breakdown Limit
4. VCEO(sus) limit
The RET has FBSOA also specified at high temperature.

5-22

Obtaining Optimum Performance from Ring Emitter Transistors

Power Transistor Products

Collector Current Ie (A)
0

0

~

i;1

~

;;,~
3
~

0

;;

m

'" - '"

:+=
I

-

1°
a"

0

0

0

~

--17-

~-

g:

~

0

~=

!~

~

~,

<
0_

~>

iiT8

'Ii
<~
l;l 0

V ~a
;
r i
1 l fjI

I

2 -

1

I -t+

1

t

. 1-- t--

1 - .--

._-

!\
0.02

0.05

0.1

I
V BE

I

31. 5A

""
...--=::;;:: :::::~

2A
VeE

\

.-

I,

"'

I

.1

I

lA

--- --- ~-. \c=o.5A

0

t

~e L25!J

\.

- - --

i'

....
i-""

0.2
0.5
Base Current I B (A)

Figure 5. Collector Saturation Region
Switching Time
The switching characteristics of a transistor depend on the rate of decrease or increase of stored charges in

the base and collector region. Figure 6 shows the switching waveform and the stored charge changes.

OFF-ON

r-r---r--r---""T"'I

E

OFF-ONrr~~-r-=-r-~--n

E

B

B

Storad

Charge
10%

Is

------------ --------~--

Figure 6. SchematiC Drawing of a Transistor as a SWHch

5-25

Obtaining Optimum Performance from Ring Emillllr TransialDrs

Power Transistor Products

The following transistor states occur during various states of the RET device.
OFF State to ON State
1.
2.
3.
4.
5.

Base emitter bias added

Base emitter junction capacitance charge
Junction is forward biased

Accumulation of charge in the collector
Accumulation of charge in the base continues until it reaches the final value of the collector
current.
ON State
1. Conductive modulation; the transistor is in the saturation region VCE(SAU
ON State to OFF State
1.
2.
3.
4.

Base emitter bias reduced and negative bias added
Reduction of collector current
Reduction of the stored charge in the collector and base region
Base emitter junction and collector-base junction return to the cut off state independently

Specific recommendations for obtaining maximum performance from the RET
It is important not to have too little base drive current. If the transistor is not in the saturation region, the

collector current and the collector emitter voltage add simultaneously and the SOA is exceeded, hence
bum-out.
It is also important not to have too much base drive current. Assuming the transistor is in the hard

saturation region, the switching speed (storage time, fall time) becomes very slow. Figure 7 shows the
switching speed at the dependence of the base drive current. Under the conditions Ie = 3 A, IBI = 0.6 A
and 1m =1 A, we can obtain totg =9(X) ns, tf =60 ns.

l,tg- 182

•
$

2

:;

" ~~"~~I

~

1

~

0.2

'"
0.1

D••

."

..

182 (A)

tr -

T e 25°C

D.•

,

TC=2SoC

-~~

iii

$

.s

0.05

-

~~of r--

=~G
~'''of r----r-----

III

0.02

O.S
101 (AI

0.05

-1

"'.S

-1

182 (AI
VCC"'150V

Ic=5A
Pw=50IlS

Duty Ratio" 1%

Figure 7. SWHchlng 11me

5-26

"'1

Power Transistor Products

Obtaining Optimum Performance from Ring Emitter Transistors

The fast switching speed means the following:
Base Drive (Figure 8)
1.
2.
3.

Large volume of capacitance (C) is not required.
The speed-up diode (D) is not always required.
The distance between the transistor and drive magnetic core has to be short without any
leakage inductance.
4.. The distance between the emitter of the transistor and ground has to be short without any
leakage inductance.
Main lransformer

The distance between the transistor and the main transformer has to be short without any
leakage inductance.
Using the techniques recommended in this application note, we have constructed experimental regulators
capable of switching at 500 KHz with over 80 percent efficiency. In the future, as smaller geometry RET
cells are realized, even better RBSOA and faster switching speeds will be obtained.

II

Figure 8. Base Drive Circuit Example

5-27

Obtaining Optimum Performance from Ring Emil18r TransislDrS

5-28

Power Transistor Products

OJ

January 1990
Edition 1.1

APPLICATION NOTE

FUJITSU

A 100 KHz, 50 Watt Switching Regulator
(Single-Ended Forward Type)
Using the Bipolar Ring Emitter Transistor
(Reprinted from Application Note AN005)

Fujitsu Microelectronics, Inc.
Copyright© 1990 by Fujitsu Microelectronics, Inc.

5-29

Using the Bipolar Rina Emitter Transistor

5-30

Power Transistor Products

Using the Bipolar Ring Emitter Transistor

Power Transistor Products

Introduction
The 100 KHz regulator was designed and built to demonstrate how an extremely efficient low ripple
switching regulator can be built cost effectively by taking advantage of the performance inherent to the
RET transistor.
The major constraint of this design was to keep the component cost low and still achieve very respectable
output characteristics. Small size and light weight were a primary consideration as well.
A conversion efficiency of 74 percent with an output ripple content of 30 mV peak-to-peak was achieved.
Voltage regulation was maintained to within 1 percent. (See Figure 1.)

~

5.01

!!

~

~

I

5.00
4.99
4.98

----J---.L---

....... - ........ ...... ....
Output Voltage
..... .. -~--- .......... ....... . ... ..... .. .........
--- ....... .. .......... ...... .. ... ..... .. .. .......

,

••

·•

~.-

••
••
-

Efficiency

---~

..

"'---I

-

:1
70!

50
40

RipplE

--

30
20

I
~

I

I

,tPUtDC V, lOA
80

80

100

110

Input Voltage AC (V)

Figure 1. 100 KHz - 50 W Single-Ended Forward Type SWitching Regulator (2SC3056A)

5-31

Power Transistor Products

Using the Bipolar Ring Emll18r Transistor

A block diagram is shown in Figure 2.

I
I
I
I

~

~

Trans~mer I
I

L ____________ _

_

I
I
I
I
I
I
I
I
_ _ _ _ _ _ _ _ _ _ _ _ _ .JI

Figure 2. Block Diagram of 100 KHz - 50 W SWHchlng Regulator

Circuit
The circuit detail is shown in Figure 3 and the parts list is shown in Table 1.

Turn-on and Turn-off
Tum-on and tum-off waveforms are shown in Figures 4, 5, and 6. The following losses were measured:
Tum-on loss - 0.06 W

Output 5 VDC, lOA (SO W)

Tum-off loss - 0.92 W
Transistor operating regions are shown in Figures 5 and 6. The characteristics of the main switching
transistor (2SC3056A) are as follows:
Thm-on Crossover TIme - 90 ns

IC=1.6A

Thm-off Crossover TIme - 60 ns

m,=O.35A

Storage TIme - 600 ns

IB2 =-0.8 A

Switching Regulator-Physical Size
The outline of the 100 KHz - SO W switching regulator is shown in Figure 8. The volume without the
heatsink radiator is 20.58 cu in (4.2"L x 3.5"W x 1.4 "H").

5-32

Using1he Bipolar Ring Emiller Transistor

Power Transistor Products

I ~+
C1n

DC OUT

5V -IDA

r------------~~------------l

I

~

;1

(."

1
I
I

"

-*-'~'
Q

":~' ': ';~~

,I,e

."

"

"

~~.'~

"

~~~
'"

; .J' .. '"
I

t~

I::e-;I"

e'f--

f--

e.

:

''''''

e,

I
1
1

1

e"

Figure 3.100 KHz - 50 W (Single-Ended Forward TYpe) Swnchlng Regulator (2SC3056A)

o
o
o
o

..- 1

r-

.... 1

,.-

If
~

"

Ie (2Aldiv.)

2!<
/

-

r\.

VCE (1OOv/diy.)

- - Pc (10W/diy.)
(1ooW/dly.)

5OnS/diy.

Figure 5. Operating Region of 1\Irn-on Waveform

5-34

Power Transistor Products

Using the Bipolar Ring Emitter Transistor

Table 1. Parts List
RESISTORS
Main Circuit
Rl
- 5W,ln,10%wirewound

Cl0

- 2200MF, 50 V, electrolytic

Cll

- 4700PF, 1K V, ceramic

C12

- 4700PF, 1K V, ceramic

C13

- CEUSMl E331 (330MF, 25 V)

R2

- 1W, 100Kil, 5% metal fillm

R3

- 1W, 1Sil, 5% metal fillm

C14

- CESSMl HOl 0 (1 MF, 50 V)

R4

- 112W, 560, 5% carbon fillm

C15

- CESSM1H010(lMF,50V)

R5

- 112W, lSil, 5% carbon fillm

C16

- CESSM1Cl00 (10MF)

R6

- 112W, 4700, 5% carbon fillm

C17

- CESSM1Cl00 (10MF)

R7

- 1/4W, 2.20, 5% carbon fillm

Control Circuit
Cl
-.OlMF, 50 V, ceramic

R8

- 1/4W, 1Kil, 5% carbon fillm

C2

-.OO68MF, 50 V, ceramic

R9

- 1/4W, 4.7n, 5% carbon fillm

C3

-1 OOPF, 50 V, ceramic

Rl0

- 1/4W, 1Kil, 5% carbon fillm

C4

-.0022MF, 50 V, ceramic

C5

-.0047MF, 50 V, ceramic

Controt Circuit
Rl
- l/8W, 1Kil,5% carbon film
R2

- l/8W, 1Kil,5% carbon film

DIODES
Main Circuit
01
-Swkching Diode (Vl96 Hitachi)

R3

- l/8W, 3.3Kil,5% carbon film

02

-Swkching Diode (V196 Hnachi)

R4

- l/8W, 2.2Kil,5% carbon film

03

-Swkching Diode (V196 Hkachi)

R5

- l/8W, 2.2Kil,5% carbon film

D4

-Swkching Diode (V196 Hnachi)

R6

- 1/8W, 3.9Kil,5% carbon film

05

-Swkching Diode (V196 Hkachi)

R7

- l/8W, 1.8Kil,5% carbon film

06

-Swkching Diode (1 S1585 Toshiba)

R8

- 1/8W, 1Kil,5% carbon film

BOl

-Diode Bridge (1 G4841 Toshiba)

R9

- l/8W, 1Kil,5% carbon film

B02

-Schottky Twin Diode (ESA 083-004 Fuji
Electronics)

Rl0

- l/8W, 10Kil,5% carbon film

Rll

- 1/8W,100Kil,5%carbonfilrii

B03
20

-Diode Bridge (1 B4842 Toshiba)
-5.2 V, :1:2% Zener (H25C H~achi)

R12

- l/8W, 2.2Kil,5% carbon film

R13

- l/8W, 10Kil,5% carbon film

R14

- l/8W, 1.5Kil,5% carbon film

R15

- 1/4W, 2.2Kil,5% carbon film

R16

- 1/4W, 2.2Kil,5% carbon film

CAPACITORS
Main Current
Cl
- .1 MF, 100 V, metalized film
C2

- 2200PF, 1000 V, ceramic

C3

2200PF, 1000 V, ceramic

C4

- .1 MF, 100 V, metalized film

C5

- 330MF, 50, electrolytic

C6

- 4700PF, 1K V, ceramic

C7

- 2200MF, 50 V, electrolytic

C8
C9

- 2200MF, 50 V, electrolytic
- 2200MF, 50 V, electrolytic

01·02 -Sw~ching Diode (1 S1585 Toshiba)
Control Circuit
20
-4.3 V, ±2% Zener (H24C Hitachi)
TRANSISTORS
Main Circuit
01
-2SC3056A (Fuj~su)
Control Circuit
02
-2SA495 (Tobisha)
TRANSFORMERS
Tl, T2, T3-TDK H7Cl core, nl ~ n2 = 22T
1 mm wire n3 - 3T 2 mm wire
-TDK H7Cl core, nl _ n2 _ 45T
PT
1 mm wire n3 - 15T 2 mm wire
POTEN110METER
VRl
-Murata 3321 N·l·l02
VR2

-Murata 3321N·I-201

TH

-Thyristor (SFOR1A42 Toshiba)

IC

-Pulse Width Modulator (MB3759 Fujitsu)

5-35

Usinalhe Bipolar Rlna Emiller Transistor

Power Transistor Products

OPERATING REGION (VCE·IC'"
6

I-

'\

o

o

100

200

300

400

VCE (V)

IC (O.5Aldlv.)

-

TURN·OFF WAVEFORM

"

VCE (l00V/dlv.)

V

Pc (10W/dl••)

V

AI .....

h

(l00W/dl••)

"

SOnS/dl••

FIgure 6. Operating Region of lUrn-off region

88888888888888
88888888888888

• 00000000000000 •

Tr
94

;0

~
~

..

~

!=>

~_M4

Z.M3

"---

1/

I
I

,,

I
I

1+-37

7t

• : II

132

.:.15•
MAX
IS

Figure 7. Outline of 100 KHz-SO W SwHchlng Regulator (Dimensions In mm)

5-36

OJ

January 1990
Edition 1.1

APPLICATION NOTE

FUJITSU

A 50 KHz, 200 WaH Half-Bridge
Switching Power Supply
Using Ring Emitter Transistors

Fujitsu Microelectronics, Inc.
Copyright© 1990 by Fujitsu Microelectronics, Inc.

5-37

Using Ring Emiller Transislllrs

5-38

Power Transistor Products

Power Transistor Products

Using Ring Emilie' Transistors

Introduction

To demonstrate how excellent perfonnance characteristics can be achieved when using bipolar ring
emitter transistors in classic switching regulator circuits, a half-bridge supply was constrructed with the
Fujitsu 2SC3058 transistor. The total conversion efficiency was 82 percent. Figure 1 is a block diagram of
the regulator.

.----.....---'."",.............r.;:;:::r--o

B
DC

r-+___---......oL:..::.::::..J-ooutput
AC
Input

o-",-_....J--;--

Figure 1. 50 KH-200 W Half-Bridge SwHchlng Regulator Block Diagram

5-39

Usina Ring Emillllr Transistors

Power Transistor Products

Characteristics of the 2SC3058A
The 2SC3058A is a high voltage, high current and fast Switching device which was specifically designed
for high frequency, high power switching regulators. Its electrical characteristics are shown in Table 1.

Table 1. Electrical Characteristics (TA = 25·C)
Limits
Parameter
Collector to Base Breakdown Vo~age
Emitter to Base Breakdown Vo~age
Collector to Emitter Sustainina Voltaae
Collector to Emitter Sustaining Vo~age

Symbol
V'BRICBO
V,aRIEBO
Vc",,(.~,

Vc"",...,

Test Conditions
le-lmA,Ie-O
IE-lmA,lc-O

' Ie - O.SA, R"" - 00{}
'Ie -lOA, I.. _-2A, L-200 u.H ('I)

Collector Cutoff Current
Collector Cutoff Current
Emitter Cutoff Current

leao
ICBO
lEBO

VCR .SOO V,IE - 0
VCR - 500 V, IE - 0, Tc _ 100·C

DC Current Gain
Collector to Emitter-saturation Vo~age

hFE
VCESATI

Vee - 5 V,

Base to Emitter-saturation Vo~e
Output Capacitance
Gain Bandwidth Product
Rise Time
Storage Time

VaEfSATI
Cab

Fall Time

iT
t
tola
t

V"" -6 V,lc-O

Ie -

Ie -

20A ('2)

20A, la - 4A ('2)

VCR _10 V, IE,_ 0, f _IMHz
Vee _10 V,Ie - 4A
Vee - ISO V ('I)
Ie - 20A, lat - I.. - 4A

Min.
600
7
450
450

10

-

1\'p. Max.

-

-

12
0.7

40

1.25
420
30
0.20
1.70
1.10

100
2
100
1.0
1.5

0.5
2.0
0.3

Unit
V
V
V
V

l1A
mA

l1A

-

V
V
pF
MHz

lIS
lIS
lIS

Legend: "1 Test Circuit
·2 Pulsed P~IIS, Duty Ratio S-6%

The Circuit
Figure 2 describes the circuit of the 50 KHz power supply. Other than the 2SC3058A, the major switching
components are:

Drive Transformer
EE-30, Ferrite (H7Cl, TDK)

N1 = 1ST, N2 = 1ST, N3 = 2T
Main Transformer
EE-40, Ferrite (H7Cl, TDK)
N1 =8T,N2= IT,N3= IT

Schottky Diode
ERG-81-004

5-40

Power Transistor Products

Using Ring Emitter Transistors

In +
ERG-81-004
47nF

OulDC
5V,40A

1T

1T

aT
H7Cl
(EE-40)
MB3759
C3058A

Figure 2. The Circuit

Characteristics of the Regulator
To measure switching speeds, several kinds of waveforms must be analyzed.
a)

L
U

-

r I-

r f0U h

n

l

L

~ .-,

to- ~
J

J

~

VCE

( SOV/dlv.)

IC
(4A1dlv.)

o

Figure 38. VCE and Ic VS. t

5-41

Using Ring Emitter Transistors

Power Transistor Products

b)

.-

VCE
(20Vldl ••)

\

/

-

V

r-

~ ......

i""""I

1C
(2A1dl •.)

o

t (50 nsec/dl •.)

Figure 3b. VeE and Ie VS. t (Turn-on)
c)

,...
II
II

~

IC
(2A1dl ••)

-- -

VCE
(20 Vldl•.)

I~

..I \

o

t (50 nacldl••)

Figure 3c. VCE and

d)

r

(' I-

,..ho
........

Ie VS. t (Turn-off)

~

t- ho
~

Figure 3d. la and VaE VS. t

5-42

o la (IAldl •.)

o VaE (2V/dl •.)

Power Transistor Products

Usins Ring Emitter Transistors

)r-- ---,

f\

I

f--

-"

o la (lAldiv.)

I

o VaE (2V/dlv.)

I'

II

V
t (O.2.sec/dlv.)

Figure 3e. Is and VSE VB. t (Turn-off)

A measured conversion efficiency of 82 percent was achieved with the regulator switching speed
determined to be:
tr = 120ms

lUI =.6A,
1m =-2. 2A, Ie =6A

t"tg=850ms
tc (crossover time) = 40 ms Ie

Figure 4 shows the efficiency and voltage regulation as a function of DC output current.

~
I="

~
·u"

90

....

ill

·1

SO

Vi= 110Wp

........ ........
-]..--

.,./"'

5.00
~o-+

-

..........

-,

........~

4.95

0

0

70

4.90
20

30
40
DC Output Current to (A)

50

Figure 4. Characteristics of the Regulator

5-43

Using Ring EmillB. TransisIDra

5-44

Power Transistor Products

Power Transi$lO! PtodJcts

OuaHtur and Control

Quality Control at Fujitsu

BulH-ln Quality and Reliability

Fujitsu's integrated circuits work. The reason they work is
Fujitsu's single-minded approach to built-in quality and reliability,
and its dedication to providing components and systems that
meet exacting requirements allowing no room for failure.
Fujitsu's philosophy is to build quality and reliability into every
step of the manufacturing process. Each design and process is
scrutinized by Individuals and teams of professionals dedicated
to perfection.
The quest for perfection does not end when the product leaves
the Fujitsu factory. It extends to the customer's factory as well,
where integrated circuits are subsystems of the customer's final
product. Fujitsu emphasizes meticulous interaction between the
individuals who design, manufacture, evaluate, sell, and use its
products.
Ouality control for all Fujitsu products is an integrated process
that crosses all lines of the manufacturing cycle. The quality
control process begins with inspection of all incoming raw
materials and ends with shipping and reliability tests following
final test of the finished product. Prior to warehousing, Fujitsu
products have been subjected to the scrutiny of man, machine,
and technology, and are ready to serve the customer in the
deSignated application.

5-45

Quality and Control

Power Transistor Products

Quality Control Processes at Fujitsu

Chackltama

~"e::'~~~g~:~~

Inspection of Incoming Ma18ria1
Waler Processing

Diffusionllon Implantation
Parts, Chemicals, Etc
Wafer Surface Inspection and
Pho1Detching
Sample Tests of Thickness,
Surfaoa Resistanoa, Diffusion
Depth, Electrical Parameters, and Doping
Wafar Surface and Patlem Inspection
Passivation (Insulating Layer Formation)
Wefar Surface Inspection,
MonilDr Test of Film Thickness
Probing Test
Wafar Surfaoa Inspection,
MonilDr Test of Film Thickness
Wafer Shipping Inspection
Test of Electrical Characteristics, SIle •• Test
Dicing (CHIP Separation)
CHIP Selection
CHIP Shipping Inspection

Sample Surface Inspection
Bond-Wetting and Surface Inspection, ~~M~ti~~ Calibra~on
Bonci-Position and Surfaoa Inspection,
Sample Wire Bond Strength Test,
MoniIDr Test of Sample run for Machine Calibration
Internal Visual Inspection

Pre-Cep Visual
Inspection

In18ma! Sampling Visual Inspection

Continued on next page

5-46

In18mal Merchant
Inspection

Power Transistor Products

Oualituy and Control

Quality Control Processes at Fujitsu

(Continued)

Sealing or Molding

Leak Test (Hennetic Package Only)
Fine and Gross Leak Tests
Exlemal Sampling Visual Inspection
External Sampling Visuellnspection
Exlemal Sampling Visual Inspection

Exlemal Visual Inspection

ExlBmai Mechanical Inspection

Exlemal Sampling Visual Inspection

Shipping Tests

Test of ACIDC Characleristics and Functions
Henneticity (Fine and Gross Leak Tests), Exlemai and Marking Inspections""/
Electrical Characleristics Tests, All Sampling Tests

U

Endurance and Environmental Tests

0

Reliability Tests
Lot Tests/Periodic Tests
Warehousing

Legend:

o

o

IQI

<>

Production Process
Test/Inspection
Production Process
and Test/Inspection

ac Gale (Sampling)

Note:
The flow sequence may vary slighUy
wijh incividual product type.

5-47

OuaDtr and ConIlDl

5-48

Power Transistor Products

Section 6
Ordering Information - At a Glance

I Page
Eh3
Eh3

6-4

TlU.
Transistor Product Marking
Transistor Ordering Code (Part Number)
Transistor Package Types

6-1

Ordering Information

6-2

Power Transistor Products

Power Transistor Products

Ordering Information

Transistor Product Marking
Ring Emitter Transistors (RETs)
Part Number
(See Ordering Codes below)

EIAJ Registered Transistor

Date Code

Fujitsu Logo

Polarity
A ~ PNP, High Frequency
B ~ NPN, High Frequency
C ~ NPN, Low Frequency
~ NPN, Low Frequency

o

Darlington Arrays, MOSFET Arrays, RETs

Fujitsu Logo

Note;

Marking formats may vary, depending on the product. The country of origin appears on all finished parts.

Transistor Ordering Code (Part Number)
2SC
2SA
FT XXXXX

1L:v~eTYPe
Family Designator

2SC = High Frequency NPN
2SA = High Frequency PNP
FT = Fujitsu Transistor
Example: 2SC2429 High Frequency NPN Transistor, VCEO

=400 V, Ic =15 A

6-3

Po!!t!! TrenVIc!! PtpWCts

Otderins Information

Transistor Package Types
Products are available in the following package types.
T0-3

PNP

T0-220

NPN

PNP

NPN

TO-3pF

PNP

NPN

2SA1041

2SC2428

2SA10n

2SC2527

2SC3842

2SA1042

2SC2429

2SA1078

2SC2528

2SC3843

2SA1043

2SC2429A 2SA1080

2SC2530

2SC3844

2SA1044

2SC2431

2SC3055

2SC3845

2SA1045

2SC2432

2SC3056

2SC3846

2SA1072

2SC2433

2SC3056A

2SC3847

2SA1073

2SC2434

2SC3057

2SC3947

2SA1180

2SC2522

2SC3178

2SC3948

2SC2522A
2SC2523
2SC2920
2SC2964
2SC2965
2SC3044
2SC3044A
2SC3045
2SC3046
2SC3058
2SC3058A
2SC3059
2SC3060
2SC3061

6-4

2SC3949

TO-el

PNP

MPH

FT2551

FT1551

Section 7
Sales Information - At a Glance

I

PIIge

7-3
7-7

7-8
7-9
7-11
7-11
7-11
7-12
7-16
7-17
7-18

7-'21)
7-21
7-22

nile
Introduction 10 FujilBu
Inlegratad CI.... iIs Corporate Headquarters - Worldwide
FMI Sales OIIioes for Norlh and Soulh America
FMI Represenrati""s - USA

FMI Represenlatill8S - Caneda
FMI Represenlalives - Mexico
FMI Represenrati""s - Puet1I> Rico
FMI o;stribulors- USA
FMI Distribulonl- Canada
FMG Sales OIIioeslo, Europe
FMG o;stribulonl- Europe
FMA Sales Offices for Asia and Ausnlla
FMA Represenrati""s - Asia and Ausnlla
FMA Distributors - Asia and Au.nlla

7-1

Sales Information

..
7-2

Power Transistor Products

Power Transistor ProcAJcts

Sales InformaUon

Introduction to Fujitsu

Fujitsu Limited
FujHsu LimHed, headquartered near Tokyo, Japan, is the largest
supplier of colqJuters in Japan and is among the top ten
companies operating in Japan. Fujitsu is also one of the world's
largest suppliers of telecommunications equipment and
semiconductor devices.
Established in 1935 as the Communications Division spinoff of
Fuji Electric Company Limited, Fujitsu LimHed, In 1985,
celebrated 50 years of service to the world through the development and manufacture of state-of-the-art products In data
processing, telecommunications and semiconductors.
FujHsu has five plants in key industrial regions in Japan covering
all steps of semiconductor production. Five wholly-owned
Japanese subsidiaries provide addHional capacity for production
of advanced semiconductor devices. Two addHional facilHies
operate in the U.S. and one in Europe to help meet the growing
worldwide demand for FujHsu semiconductor products.

7-3

PoWfJ( Transistor Products

Sales Information

Introduction to Fujitsu (Continued)
Fujitsu Microelectronics, Inc.
Fujitsu Microelectronics, Inc. (FMI), with headquarters in San
Jose, CalHomia, was established in 1979 as a wholly-owned
Fujitsu Limited subsidiary for the marketing, sales, and distribution of Fujitsu integrated cirruit and component products. Since
1979, FMI has grown to three marketing divisions, two manufacturing divisions and a subsidiary. FMI offers a complete array of
semiconcluctor products for its customers.
The Advanced Products Division (APD) is responsible for the
complete product development cycle, from design through
operations support and wortdwide marketing and sales. Products
are the resuH of both internal development and external
relationships, such as joint development agreements, technology
licenses, and joint ventures. The SPAROM RISC processor was
developed by both APD and Sun Microsystems, Inc.
In addition to designing and selling a full line of SPARC
processors and peripheral chips, APD also deSigned and is
selling the EtherStarT" LAN controller - the first VLSI device to
integrate both StarLAN"' and Ethemet® protocols Into one
device. The core of APD's EtherStar chip was the resuH of APD's
cooperative venture with Ungermann-Bass.
The Microwave and Optoelectronics Division (MOD) markets
GaAs, FETs, and FET power amplifiers, lightwave and microwave devices, optical devices, emitters, and SI transistors.
The largest FMI marketing division Is the Integrated Circuits
Division (ICD).

..

Memory and programmable devices marketed by ICD include the
following:
DRAMs and DRAM Modules
EPROMs
EEPROMs
NOVRAMs
CMOS masked ROMs
CMOS SRAMs and CMOS SRAM Modules
BiCMOS SRAMs
Bipolar PROMs
ECLRAMs
STRAMs (self-timed RAM)
Hi-Rei PROMs and SRAMs
UHra High-speed ECUECL-TIL Translator Circuits
Linear ICs and Transistors

7-4

POW9/' Transistor Products

Sales Information

Introduction to Fujitsu (Continued)
ASIC products offered by ICD include the following:
CMOS, ECl, and BiCMOS gate arrays
CMOS standard cells
Design Software Support
Customer support and customer training for ASIC products are
available through the following FMI design centers:
San Jose
Dallas
Atlanta

Gresham
Chicago

Boston

Microcomputer and communications products offered by ICD
include the following:
4-bitMCUs
8- and 16-bit MPUs
SCSI and controllers
DSPs
Prescalers
Plls
Memory Cards
FMl's manufacturing divisions are in San Diego, Califomia and
Gresham, Oregon. The San Diego Manufacturing Division
assembles and tests memory devices. In 1988, the Gresham
Manufacturing Division began manufacturing ASIC products and
DRAM memories. This facility, when completed, will have one
million square feet of manufacturing-the largest Fujitsu
manufacturing plant outside Japan.
FMl's subsidiary, FuJHsu Components of America, markets
connectors, keyboards, plasma displays, relays, and hybrid ICs.

III

Fujitsu Mlkroelektronlk GmbH (European Sales Operation)
Fujitsu Mikroeleklronik GmbH (FMG) was established in June,
1980, in Frankfurt, West Germany, and is a wholly-owned
subsidiary of Fujitsu Limited, Tokyo. FMG is the sole representative of the Fujitsu Electronic Device Group in Europe. The wide
range of ICs, lSI memories, microprocessors, and ASIC
products are noted throughout Europe for design excellence and
unmatched njliabilily. Branch offices are located in Munich,
london, Paris, Stockholm, and Milan.

7-5

Power Transistor Products

Sa/e.lnforma~on

Introduction to Fujitsu (Continued)
Fujitsu Microelectronics Ireland, Ltd. (European Production Operation)

Fujitsu Microelectronics Ireland, Ltd. (FME) was established in
1980, in the suburbs of Dublin, as Fujitsu's European Production
Center for integrated circuits. FME assembles DRAMs,
EPROMs, and other LSI memory products.
Fujitsu Microelectronics, Ltd. (European ASIC Dealgn Operation)

Fujitsu Microelectronics, Ltd., Fujitsu's European VLSI Design
Center, opened in October of 1983 in Manchester, England. The
Design Center is equipped with highly sophisticated CAD
systems to ensure fast and reliable processing of input data. An
experienced staff of engineers is available to assist in all phases
of the design process.
Fujitsu Microelectronics Asia PTE Ltd. (Asian/Oceanian Sales Operation)

Fujitsu Microelectronics Asia PTE Ltd. (FMA) opened in August
1986 in Hong Kong as a wholly-owned Fujitsu subsidiary for
sales of electronic devices to Asian and Southwest Pacific
markets.

E'_'.

01 _

SPARC11II II a trademark of Boo MlcroIya.."... Inc.
areg-.cl _ _
CooporaIIon.

EthlrSWlII la. tradItmark of FuJtau MlcrD8Iec:tronic: Inc.
StarlANYIIII8 a trademark of AT&T.

7-6

Power Transistor Products

Sales Information

Integrated Circuits Corporate Headquarters - Worldwide
International Corporate Headquarters

FUJITSU LIMITED
Marunouchi Headquarters
6-1, Marunouchi 1-chome
Chiyoda-ku, Tokyo 100
Japan
Tel: (03) 216-3211
Telex: 781-22833
FAX: (03) 213-7174

For integrated circuits marketing information please contact the following:
Headquarters for Japan

FUJITSU LIMITED
In1egra1ed Circuits and Semiconductor Marketing
Furukawa Sago Bldg,
6-1, Marunouchi 2-chome
Chiyoda-ku, Tokyo 100

Japan
Tel: (03) 216-3211
Telex: 781-2224361
FAX: (03) 211-3987

Headquarters for North and South America

FUJITSU MICROELECTRONICS, INC,
In1egra1ed Circuits Division
3545 Nor1h First Street
San Jose, CA 95134-1804

USA
Tel: (408) 922--9000
Telex: 91o--331Hll90
FAX: (408) 432~

Headquarters for Europe

FUJITSU MIKROELEKTRONIK GmbH
Lyoner Sb'asse 44-48
Arabella Centre 9. OG
~OO Frankfurt 71
Federal Republic 01 Germany
Tel: (069) 66320
Telex: 441963
FAX: (069) 6632122

IDI

Headquarters for Asia and Australia

FUJITSU MICROELECTRONICS ASIA PTE LIMITED
~~7Pamby~ePmX

No. 52 Bras Baseh Road
Singapore 0718
Tel: (65) 336-1600
Telex: 55573
FAX: (65) 336-1609

7-7

Power Transisror Products

Sa/e./nforma~on

Fujitsu Microelectronics, Inc. (FMI) Sales Offices for
North and South America
NORTHERN CALIFORNIA

MASSACHUSETTS (Boston)

NEW YORK (Hauppauge)

Fujitsu Microelectronics, Inc.

Fujitsu !icroeIectronics, Inc.

10600 N. De Anza Blvd.

75 WeHs A""nue

Suite 225

SuiteS

Cupertino, CA 95014
Tel: (408) 996-1600
FAX: (408) 72H746

Newton Center, MA 0215H251
Tel: (617) 964-7080
FAX: (617) 964-3301

Fujitsu Microelectronics, Inc.
601 Veterans Memorial Highway
SuileP
Hauppauge, NY 11788--1054
Tel: (516) 361~
FAX: (516) 361-6460

SOUTHERN CALIFORNIA

MNNESOTA (Minneapolis)

OREGON (Portland)

Fujitsu Microelectronics, Inc.

Fujitsu Miaoelectronics, Inc.
3460 Washinglon DriIIII
Suile209
Eagan, MN 55122-1303
Tel: (812) 45oHl323
FAX: (612) 45oHl601

Fujitsu Microelectronics, Inc.
5285 SW Meadows Road
Suile222
Lake Oswego, OR 97035-9998
Tel: (503) 684-4545
FAX: (503) 684-4547

NEW JERSEY (Mt. Laurel)

TEXAS (Dallas)

Fujitsu Mcroelaclronics, Inc.

Fujitsu Microelectronics, Inc.
14785 Presion Road
Suite 670

Century Cen1r8
2603 Main Street
SUite 510
Irvine, CA 92714
Tel: (714) 724-6m
FAX: (714) 724-6778

GEORGIA (Atlanta)
Fujitsu Microelectronics, Inc.
3500 Parkway Lane
SUite 210

NOra-OBS, GA 30092
Tel: (404) 449-8539
FAX: (404) 441-2016

ILLINOIS (Chicago)
Fujitsu Microelectronics, Inc.
Cne Pierce Place
SUite 910
Itesca,IL5014~1
TeI:(708)~

FAX: (708) 250-8591

7-8

Horizon Corporate Center
3000 Atrium Way
Suile 100

Dallas, TX 75240

MI. Laurel, NJ 08054

Tel: (214) 23H394
FAX: (214) 386-7917

Tel: (609) 727~700
FAX: (609) 727~797

SaI9.lnforma~on

Power Transistor PIoduers

FMI Representatives -

USA

For product information, oontact your near9st Representative.
Alabama

Connecticut

Indiana

The Nows Group, Inc.
2905 Westcorp Blvd.
Suite 120
Huntsville. AL 35805
Tel: (205) 534-0044
FAX: (205) 53oHll86

eonntech Sales, Inc.
182 Grand Slraat
Suite 318
Waterbury. CT 06702
Tel: (203) 754-2823
FAX: (203)5~

Fred Dorsey & Associates
3518 Eden Place
Carmel, IN 46032
Tel: (3171844-4842
FAX: (317) 844-4843

Arizona

Florida

Aztech Component Sales Inc.
15230 N 75th SIr99I
Suite 1031
Scottsdale. AZ 85260
Tel: (602) 991-6300
FAX: (602) 991-0063

Samlronic Associates, Inc.
657 Maitland Avenue
Altamonte Springs. FL 32701
Tel: (407) 831-8233
FAX: (407) 831-2844

Iowa

California
Harvey King, Inc.
6393 Nancy Ridge Drive
San Diego, CA 92121
Tel: (619) 587-9300
FAX: (619) 587-{)5()7
InfinHy Sales, Inc.
4500 Campus Drive
SuHa300
Newpon Beach, CA 92660
Tel: (714) 833-0300
FAX: (714) 83:Hl303
Norcomp
3350 Scott Blvd.,
Suite 24
Santa Clara, CA 95054
Tel: (406) 727-7707
FAX: (408) 986-1947
Norcomp
2140 Professional Drive
SuHa200
Roseville, CA 95661
Tel: (916) 782-aD70
FAX: (916) 782-aD73

Colorado
Front Range Marketing
3100 Arapahoe Road
Suite 404
Boulder, CO 80303
Tel: (303) 443-4780
FAX: (303) 447-0371

SamlJ"onic Associates, Inc.
1467 S. Missouri Avenue
Clearwater, FL 33516
Tel: (813) 461-04675
FAX: (813) 442-2234
Samlronic Associates, Inc.
3471 NW 65th Slreal
Fllauderdale, FL 33309
Tel: (305) 731-2484
FAX: (305) 731-1019

Georgia
The Novus Group, Inc.
6115-A Oakbrook Pkwy
Norcross, GA 30093
Tel: (404) 263-0320
FAX: (404) 263-8948

Idaho
Cascade Components
2710 Sunrise Rim Road
Suite 130
Boise, ID 83705
Tel: (208) 343-9886
FAX: (208) 343-9887

illinois
Beta Technology
1009 Hawthorn Drive
Itasca, IL 80143
Tel: (708) 256-9586
FAX: (708) 256-9592

Electromec Sales
1500 2nd Avenue
SuHe205
Cedar Rapids, IA 52403
Tel: (319) 362-6413
FAX: (319) 362-6535

Kansas
Rothkopf & Associates, Inc.
1948 E. Santa Fe
Suite H
Olathe, KS 66062
Tel: (913) 829-8897
FAX: (913) 829-1664

Maryland
Arbotek Associates
102 W. Joppa Road
Towson, MD 21204
Tel: (301)8~775
FAX: (301) 337-2781

Massachusetts
Mill-Barn Associates
2 Mack Road
Wobum, MA 01801
Tel: (617) 932-3311
FAX: (617) 932-0511

MIchigan
Greiner Associates, Inc.
15324 E. Jallarson Avenue
Suite 12
Grosse Point Perk, MI 48230
Tel: (313) 499-0188
FAX: (313) 499-0665

7-9

..

Sales Information

Power Transistor Products

FMI Representatives - USA (Continued)
Minnesota
Elecb'Omec Sales
1601 E Highway 13
Suite 200
Bumsville, MN 55337
Tel: (612) 894-8200
FAX: (612) 89.01-9352

Missouri
Rolhkopf & Associates, Inc.
8721 Mancheslllr Road

St Louis, MO 63144
Tel: (314) 961--4485
FAX: (314) 961-4736

New Jersey
BGR Associallls
Evesham Commons
525 Roulll 73
Suite 100
Marlton, NJ 08053
Tel: (609) 983-1020
FAX: (609) 983-1879
Technical Applications & Marketing
91 Clinton Road
Suite 10
Fairfield, NJ 07006
Tel: (201)575-4130
FAX: (201) 575-4563

Quality Components
118 FayaIII Street
Manlius, NY 13104
Tel: (315) 882-8885
FAX: (315) 682-2277
Quality Components
2318 TllUs Ave.
Rochestar, NY 14622
Tel: (716) 34~7229
FAX: (716) 342-7227

North Carolina
The Now. Group, Inc.
1026 Comrnonweallh Court
Cary, NC 27511
Tel: (919) 460-ml
FAX: (919) 460-5703

Technical Marketing, Inc.
3320 Wiley Post Road
Carrollton, TX 75006
Tel: (214) 387-3601
FAX: (214) 387-3605
Technical Marketing, Inc.
2901 Wilcrest Drive
Suite 139
Houston, TX 77042
Tel: (713) 783-4497
FAX: (713) 783-6307
Technical Marketing, Inc.
1315 Sam Bass Circle
Suite~

Round Rock, TX 78681
Tel: (512) 244-2291
FAX: (512) 338-1596

Ohio
Spec1rum ESD
3947 Ray Court Road
Morrow, OH 45152
Tel: (513) 89l1-{l26O
FAX: (513) 899-3260

Spec1rum ESD
8925 Galloway Trail
Novelty, OH 44072
Tel: (216) 338-5226
FAX: (216) ~214

New York

Oregon

QuaUty Components
3343 Harlem Road
Butlalo, NY 14225
Tel: (716) 837-5430
FAX: (716) 837-{)662

L-Squared Umillld
15234 NW Greenbrier Pkwy
Beaver1on, OR 97006
Tel: (503) 621H!555
FAX: (503) 645-8196

7-10

Texas

Washington
L-Squered Umited
105 Centrai Way
Suite 203
Kirkland, WA 98033
Tel: (206) 827-aSS5
FAX: (206) 82Hl02

Wisconsin
Beta Technology
9401 W Beloit Street
Suite304C
Milwaukee, WI 53227
Tel: (414) 543-a609
FAX: (414) ~268

Power Transistor Products

Sales Information

FMI Representatives - Canada, Mexico and Puerto Rico
Canada

Mexico

Puerto Rico

Pipe-Thompson Limited
5468 Dundas Street W.
Suite 206
Islington, Ontario M9B 6E3
Tel: (416) 236-2355
FAX: (416) 236-3387

Solano Elec1ronica
Ermita 1039-10
Colonia Chapalita
Guadalajara, JAL. 45042

Semtronic Associates
Mercantil Plaza Building
Suite 816
Hato Ray, Puerto Rico 00918
Tel: (809) 766-0700

Pipe-Thompson Limited
RR2 North Gower
Ottawa, Ontario KOZ 2TO
Tel: (613) 258-4067
FAX: (613) 25S-7649

Solano Electronicas
Thier. 100
Colonia Anzures
Mexico CiIy, D.F. 11590
Tel: (55) 31-6915
FAX: (55) 31-6915

Tel: (36) 47-4250
FAX: (36) 473433

7-11

IDI

Power Transistor Products

Sales Informarion

FMI Distributors - USA
Alabama
Marshall Industries
3313 S. Memorial Highway
SUita121
Huntsville, AL 35801
(205) 881~235
ReplDn EleclrOnics
4950 Corporate Drive
SUital05C
HuntsvHle, AL 35805
(205) 722~65

Arizona
Insight Electronics
1515 W. University Drive
SUite 103
Tempe, AZ 85281
(602)82~18oo

Sterling Electronics
3501E.~yRoad

Phoeniz, AZ 85040
(602) 268-2121
Marshall Industries
9830 s. 51 st S1reet
SUitaB121
Phoenix, AZ 85044
(602) 498-0290

california
Insight Electronics
28035 Dorolhy Drive
SUite 220
Agoura, CA 91301
(818) 707-2100
Insight Electronics
15635 Alton Parkway
Suite 120
Irvine, CA 92718
(714) 727-2111
Insight Electronics
6885 Flanders Drive
SUilliG
San Diego, CA 92126
(619)587~757

Mershallindustries
9710 Desoto Ave.
Chatsworth, CA 91311
(818) 407--4100
Marshallindlstries
9674 Tetstar Ave.
EI Monte, CA91731
(818)45~00

7-12

Marshalllndls1ries
One Morgan
Irvine, CA 92718
(714) 458-5308
Marshallindls1l'ies
336 Los Coches Slraet
Milpites, CA 95035
(408) 942-4600
MarshaDlndus1ries
3039 Kilgora Ave.
Rancho Cordova, CA 95670
(916) 635-9700
Mershallndus1l'ies
10105 eanon Canyon Road
San Diego,CA 92131
(619)578-9600
Merit Electronics
2070 Ringwood Avenue
San Jose, CA 95131
(408) 434-C800
Sterling Electronics
55310 Deny
Unit X
Agoura, CA 91301
(818)707~11

Sterling Electronics
9410 Topanga Canyon Rd.
Chatsworth, CA 91311
(818)407~

Sterling Electronics
1342 Ben Avenue
Tustin, CA 92680
(714)2~

Western Microtechnology
28720 Roadside Dr.
SUite 175
Agoura HMls, CA 91301
(818) 35IHl180

Colorado
Mershallindustries
12351 N. Grant Road
SUite A
Thornton, CO 80241
(303)451~383

Sterling Electronics
8200 Soulh Akron Streel
SUite 111
Englewood, CO 80112
(303) 792-3939

Connecticut
Mershallindustries
20 Sterling Drive
WaHingford, CT 06492
(203) 265-3822
Milgray Electronics
326 W. Main S1reet
Milford, CT 06460
(203) 79!Hl711
Western Microtechnology, Inc.
731 Main S1reeI
SUiteB2
Lantern Ridge Monroe, CT 06468
(203) 452-0533

Florida
Marshall Industries
380 S. NorIhlake Blvd
SUite 1024
Al1amonte Springs, FL 32701
(407)787~5

Marshall Industries
2700 W. Cyptess Creek Rd.
SUiteC 106
Fl Lauderdale, FL 33309
(305) 977-4880
Marshall Industries
2840 Sharar Drive

Western Microtechnology
1637 North Brian
Orange, CA 92667
(714) 637-0200

St. Petersburg, FL33716

Wesl8m Microtechnology
8837 Nancy Ridge Drive
San Diego, CA 92121
(619) 453-9430

Milgray Electronics
1850 Lee Road
SUite 104
Winter Park, FL 32789
(407) 847...0747

Western M'lCIOIechnoIogy
12900 Saratoga Ave.
Saratoga, CA 95070
(408) 725-1660

(813)573-1399

Power Transistor PromJcts

FMI Distributors -

Sales Information

USA (Continued)

Florida (Continued)

Kansas

Michigan

Reptron Eleclronics
33320 N.W. 53rd Street
Suite 206
Ft. lauderdale, FL 33309
(305) 735-1112

Marshallindustrias
10413 W. 84th Terrace
Lanexa, KS 66214
(913) 492-3121

Reptron Electronics
34403 Glendale
Livonia, MI48150
(313) 525-2700

Reptron Elaclronics
14501 McCormick Drive
Tampa, FL33626
(813) 855-2351

Milgray Electronial
6901 W. 63rd Street
Owrland Park, KS 66202
(913) 236-8800
Maryland

Georgia
MarshalllndusVias
5300 Oakbrook Pkwy
Suite 146
Norcross, GA 30093
(404) 923-5750
Georgia
Milgray Elec1ronics
3000 Nor1hwoods Parl
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