AMD Family 10h Desktop Processor Power And Thermal Data Sheet (PUB) Phenom 43375
User Manual: Phenom 10h
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AMD Family 10h Desktop Processor Power and Thermal Data Sheet Publication # 43375 Revision: 3.46 Issue Date: September 2010 Advanced Micro Devices © 2008 – 2010 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro Devices, Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. The information contained herein may be of a preliminary or advance nature and is subject to change without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this publication. Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. AMD’s products are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other application in which the failure of AMD’s product could create a situation where personal injury, death, or severe property or environmental damage may occur. AMD reserves the right to discontinue or make changes to its products at any time without notice. Trademarks AMD, the AMD Arrow logo, AMD Athlon, AMD Phenom, AMD Sempron, and combinations thereof are trademarks of Advanced Micro Devices, Inc. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies. PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table of Contents Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.1 Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.1.1 Ordering Part Number Description Section Overview . . . . . . . . . . . . . . . . . . 8 1.1.2 Thermal and Power Table Guide Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.1.3 Thermal and Power Table Section Overview . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.1.4 Power Supply Specification Chapter Overview . . . . . . . . . . . . . . . . . . . . . . . 9 1.2 Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 1.3 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2 AMD Phenom™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.1 AMD Phenom™ Processor Ordering Part Number Description . . . . . . . . . . . . . . . . 12 2.2 AMD Phenom Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . 24 2.3 AMD Phenom Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . . 25 2.3.1 HD mmmm OB pnc GD (65 W, DT, AM2r2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2.3.2 HD mmmm WC pnc GD (95 W, DT, AM2r2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 2.3.3 HD mmmm XA pnc GD (125 W, DT, AM2r2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 2.3.4 HD mmmm WC pnc GH (95 W, DT, AM2r2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 2.3.5 HD mmmm XA pnc GH (125 W, DT, AM2r2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 2.3.6 HD mmmm FA pnc GH (140 W, DT, AM2r2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 2.3.7 HD mmmm OD pnc GH (65 W, DT, AM2r2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 2.3.8 HD mmmm WC pnc HH (95 W, DT, AM2r2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 2.3.9 HD mmmm WC pnc HI (95 W, DT, AM2r2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 2.3.10 HD mmmm XC pnc GI (125 W, DT, AM2r2) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 2.3.11 HD mmmm WF pnc GI (95 W, DT, AM3) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 2.3.12 HD mmmm OC pnc GI (65 W, DT, AM3) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 2.3.13 HD mmmm WF pnc GM (95 W, DT, AM3) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 2.3.14 HD mmmm FB pnc GM (125 W, 140 W, DT, AM3) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 2.3.15 HD mmmm WF pnc GR (95 W, DT, AM3) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 2.3.16 HD mmmm FB pnc GR (125 W, DT, AM3) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Contents 3 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet 3 AMD Athlon™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 3.1 AMD Athlon™ Processor Ordering Part Number Description . . . . . . . . . . . . . . . . . 62 3.2 AMD Athlon Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . . 68 3.3 AMD Athlon Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . 69 3.3.1 AD mmmm OC pnc GQ (65 W, DT, AM3) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 3.3.2 AD mmmm WF pnc GM (95 W, DT, AM3) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 3.3.3 AD mmmm OC pnc GM (65 W, DT, AM3) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 3.3.4 AD mmmm HD pnc GM (45 W, DT, AM3) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 3.3.5 AD mmmm SC pnc GM (25 W, DT, AM3) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 4 AMD Sempron™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 4.1 AMD Sempron™ Processor Ordering Part Number Description . . . . . . . . . . . . . . . 82 4.2 AMD Sempron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . 85 4.3 AMD Sempron Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . 86 4.3.1 SD mmmm HB pnc GM (45 W, DT, AM3) Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 5 Power Supply Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 5.1 bsmmmmrr J ncdd – AM2r2 Power Supply Operating Conditions . . . . . . . . . . . . . . 89 5.2 bsmmmmrr K ncdd – AM3 Power Supply Operating Conditions . . . . . . . . . . . . . . . 92 6 MTOPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 7 APP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Contents 4 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet List of Figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. AMD Phenom™ Processor Ordering Part Number Diagram . . . . . . . . . . . . . . 12 AMD Phenom Processor Ordering Part Number Example . . . . . . . . . . . . . . . 12 AMD Athlon™ Processor Ordering Part Number Diagram . . . . . . . . . . . . . . . 62 AMD Athlon Processor Ordering Part Number Example . . . . . . . . . . . . . . . . 62 AMD Sempron™ Processor Ordering Part Number Diagram . . . . . . . . . . . . . 82 AMD Sempron Processor Ordering Part Number Example . . . . . . . . . . . . . . . 82 Socket AM2 AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Socket AM3 AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 List of Figures 5 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet List of Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. AMD Phenom™ Processor Part Definition Options . . . . . . . . . . . . . . . . . . . . 13 AMD Phenom Processor Cache Size Options . . . . . . . . . . . . . . . . . . . . . . . . . 13 AMD Phenom Processor Number of Cores . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 AMD Phenom Processor Package Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 AMD Phenom Processor Roadmap Options . . . . . . . . . . . . . . . . . . . . . . . . . . 14 AMD Phenom Processor Model Number Options . . . . . . . . . . . . . . . . . . . . . . 15 AMD Phenom Processor Thermal Profiles . . . . . . . . . . . . . . . . . . . . . . . . . 17 AMD Phenom Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . 24 AMD Athlon™ Processor Part Definition Options . . . . . . . . . . . . . . . . . . . . . 63 AMD Athlon Processor Cache Size Options . . . . . . . . . . . . . . . . . . . . . . . . . . 63 AMD Athlon Processor Number of Cores . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 AMD Athlon Processor Package Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 AMD Athlon Processor Roadmap Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 AMD Athlon Processor Model Number Options . . . . . . . . . . . . . . . . . . . . . . . 64 AMD Athlon Processor Thermal Profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 AMD Athlon Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . 68 AMD Sempron™ Processor Part Definition Options . . . . . . . . . . . . . . . . . . . . 83 AMD Sempron Processor Cache Size Options . . . . . . . . . . . . . . . . . . . . . . . . . 83 AMD Sempron Processor Number of Cores . . . . . . . . . . . . . . . . . . . . . . . . . . 83 AMD Sempron Processor Package Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 AMD Sempron Processor Roadmap Options . . . . . . . . . . . . . . . . . . . . . . . . . . 83 AMD Sempron Processor Model Number Options . . . . . . . . . . . . . . . . . . . . . 83 AMD Sempron Processor Thermal Profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 AMD Sempron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . 85 bsmmmmrr J ncdd DC Operating Conditions for VDD Power Supply . . . . . 89 bsmmmmrr J ncdd AC Operating Conditions for VDD Power Supply . . . . . 89 bsmmmmrr J ncdd Maximum Power-Up and Power-Down Conditions for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 bsmmmmrr J ncdd AC and DC Operating Conditions for non-VDD Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 bsmmmmrr K ncdd DC Operating Conditions for VDD Power Supply . . . . . 92 bsmmmmrr K ncdd AC Operating Conditions for VDD Power Supply . . . . . 92 bsmmmmrr K ncdd Maximum Power-Up and Power-Down Conditions for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 bsmmmmrr K ncdd AC and DC Operating Conditions for non-VDD Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Composite Theoretical Performance (CTP) Calculation . . . . . . . . . . . . . . . . . 95 Adjusted Peak Performance (APP) Calculation . . . . . . . . . . . . . . . . . . . . . . . 96 List of Tables 6 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Revision History Date Revision Description September 2010 3.46 Seventh public release. • Added OPNs to the AMD Phenom™ Processor, AMD Athlon™ Processor, and AMD Sempron™ Processor sections. • Added Thermal Profile W on page 66. • Updated thermal and power specifications for ADX445WFK32GM on page 72. • Updated Table 33 on page 95 (CTP) and Table 34 on page 96 (APP). April 2010 3.40 Sixth public release. • Added OPNs to the AMD Phenom™ Processor section and to the AMD Athlon™ Processor section. • Added the AMD Sempron™ Processor section. September 2009 3.33 Fifth public release. • Updated note to Table 28 on page 91 and Table 32 on page 94 in the Power Supply Specifications section. June 2009 3.28 Fourth public release. • Added new OPNs to the AMD Phenom™ processor section. • Added the AMD Athlon™ processor section. • Added Section 5.2, AM3 Power Supply Operating Conditions. • Updated Table 34 on page 96 (APP). January 2009 3.18 Third public release. • Added new 95-W, AM3 OPNs to the AMD Phenom™ Processor section. January 2009 3.14 Second public release. • Added new OPNs to the AMD Phenom™ Processor section. • Added Table 27 on page 90. October 2008 3.00 Initial public release. Revision History 7 PID: 43375 Rev 3.46 - September 2010 1 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Overview This document contains processor thermal specifications and power specifications. The specifications in this document supersede those found in the power roadmaps. For all other electrical specifications, refer to the appropriate product data sheet and the AMD Family 10h Processor Electrical Data Sheet, order# 40014. 1.1 Organization This document is organized into the following sections: • Document overview (Section 1) • One section for each brand represented in the desktop segment, containing the following subsections: • Ordering Part Number (OPN) description (content overview in Section 1.1.1) • Thermal and power specification tables (content overview in Section 1.1.3 on page 9) • Power supply specifications (content overview in Section 1.1.4 on page 9) • MTOPS section in Table 33 on page 95 • APP section in Table 34 on page 96 1.1.1 Ordering Part Number Description Section Overview The Ordering Part Number (OPN) Description section contains a depiction and description of a valid OPN for the brand contained in that chapter. Each character or group of characters within an OPN has a specific meaning (for example, model number, socket compatibility). The meaning of each OPN character is detailed in the OPN description section. Each OPN identifies a processor with a unique thermal and power specification table entry. The OPN description section also contains a full description of the Subsection Ordering Part Number (SOPN) abstraction characters for the brand contained in that chapter. SOPNs are used to group and organize OPNs into subsections for the thermal and power tables and power supply specifications. A definition of SOPNs is contained in Section 1.3 on page 10. 1.1.2 Thermal and Power Table Guide Overview The thermal and power table guide section contains a table mapping SOPNs and the properties associated with their defined characters to the proper thermal and power table subsections and page numbers. This table is designed to be used as a quick reference for finding the appropriate subsection for the thermal and power tables corresponding to an SOPN. Overview 8 PID: 43375 Rev 3.46 - September 2010 1.1.3 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Thermal and Power Table Section Overview The thermal and power specification tables contain the thermal and power requirements for each OPN. This includes the information necessary for thermal management (for example, heat sink requirements, ambient temperature assumptions) and power delivery (for example, voltage and current, and power dissipation for each P-state). The thermal and power specification tables are organized into subsections that correspond to Subsection Ordering Part Numbers (SOPNs). SOPNs for the thermal and power tables have the brand, power limit, and part definition characters defined. They are of the form AB mmmmrrpnc GH. Each chapter provides a guide table that maps the SOPNs in the thermal and power tables within that chapter to the appropriate subsection number and page number. Within each subsection the OPNs are sorted by model number, socket compatibility, voltage, temperature, and cache size, respectively. 1.1.4 Power Supply Specification Chapter Overview The power supply specification chapter contains the operating conditions and requirements for all voltage planes required by the processor. Power supply requirements are organized into subsections that correspond to socket infrastructure. The socket infrastructure of a particular OPN can be found in Table 5 on page 14. 1.2 Conventions Following are conventions used with numbers. • Binary numbers. Binary numbers are indicated by appending a “b” at the end, for example: 0110b. • Decimal numbers. Unless specified otherwise, all numbers are decimal. • Hexadecimal numbers. Hexadecimal numbers are indicated by appending an “h” to the end, for example: 45F8h. • Underscores in numbers. Underscores are used to break up numbers to make them more readable, for example: 0110_1100b. They do not imply any operation. Overview 9 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet 1.3 Definitions Following are some key definitions. • CPU COF. CPU Current Operating Frequency. • CTP. Composite Theoretical Performance. • Dual-plane. Platforms in which the VDD and VDDNB (Northbridge) planes are isolated on the platform and controlled as separate voltages. • DP. Dual Processor. Each link on DP models supports connections to I/O devices, and any one link or any sub-link can connect to another MP or DP processor. • MP. Multiprocessor. Each link on MP models supports connections to I/O devices or an MP or DP processor. Systems are limited to the number of nodes supported by all the processors. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for more details. • MTOPS. Millions Of Theoretical Operations Per Second. • NB COF. Northbridge Current Operating Frequency. • OPN. Ordering Part Number. An OPN uniquely identifies a processor and its associated specifications in the thermal and power tables and power supply specifications section. • P-state. Processor Performance State. P-states are valid combinations of CPU voltage, CPU COF, Northbridge voltage, and NB COF. • Single-plane. Platforms in which all the VDD and VDDNB power planes are connected together on the platform and controlled as a single power plane. • SOPN. Subsection Ordering Part Number. An SOPN is an OPN with a subset of defined characters. All defined characters in an SOPN are bolded and capitalized. All abstracted characters in an SOPN are in non-bolded lowercase. Information for any OPN that matches all of the defined characters in an SOPN is contained in that subsection. For example, OPN AB12344CDE5FGH appears under the subsection for SOPN AB mmmmmrrpnc GH. The abstracted (lowercase) character definitions for SOPNs are contained in the OPN description section of each chapter. • State. Indicates the ACPI defined sleep state, power state, and performance state for the related specifications. 'x' indicates the related specifications are independent of the associated ACPI state. For example, S0.C0.P0 indicates sleep state 0, power state 0, and performance state 0. S3.Cx.Px indicates sleep state 3 entered from any power and performance state combination. • TDP. Thermal Design Power. The thermal design power is the maximum power a processor can draw for a thermally significant period while running commercially useful software. The constraining conditions for TDP are specified in the notes in the thermal and power tables. • UP. Uniprocessor. Each link on UP models supports connections to I/O devices. Overview 10 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet • VID_VDD. The VID_VDD voltage is the VID-requested VDD supply level. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for VID to voltage translation specifications. • VID_VDDNB. The VID_VDDNB voltage is the VID-requested VDD Northbridge supply level. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for VID to voltage translation specifications. Overview 11 PID: 43375 Rev 3.46 - September 2010 2 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AMD Phenom™ Processor The following sections contain the OPN description and thermal and power specifications for the AMD Phenom™ processor. Each column in the thermal and power tables represents a specific Ordering Part Number (OPN). Section 2.1 provides an example of the OPN structure for this processor family. 2.1 AMD Phenom™ Processor Ordering Part Number Description b s mmmm rr p n c dd Part Definition Cache Size Number of Cores Package Roadmap Model Segment Brand Figure 1. AMD Phenom™ Processor Ordering Part Number Diagram H D 9100 OB J 4 B GD Part Definition: GD (see Table 1) Cache Size: B (see Table 2) Number of Cores: 4 (see Table 3) Package: J (see Table 4) Roadmap: OB (see Table 5) Model Number: 9100 (see Table 6) Segment: D = Desktop Brand: H = AMD Phenom™ Processor Figure 2. AMD Phenom™ Processor Ordering Part Number Example AMD Phenom™ Processor 12 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 1. AMD Phenom™ Processor Part Definition Options Part Definition Revision CPUID 8000_0001h EAX [31:0] (CPUID) GD Rev B2 00100F22h GH Rev B3 00100F23h HH Rev B2 00100F22h HI Rev B3 00100F23h GI Rev C2 00100F42h GM Rev C3 00100F43h GR Rev E0 00100FA0h Table 2. AMD Phenom™ Processor Cache Size Options OPN Character L2 Cache Size L3 Cache Size B 512 KB 2048 KB F 512 KB 4096 KB D 512 KB 6144 KB Table 3. AMD Phenom™ Processor Number of Cores OPN Character Number of Cores 2 2 3 3 4 4 6 6 Table 4. AMD Phenom™ Processor Package Options OPN Character Package J AM2r2 K AM3 AMD Phenom™ Processor 13 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 5. AMD Phenom™ Processor Roadmap Options OPN Character Max TDP Socket IDD Max Infrastructure (VDD) IDD Max HS Class (NB) OB 65 W AM2r2 60 A 20 A HS 65 WC 95 W AM2r2 80 A 20 A HS 65 WF 95 W AM3 80 A 20 A HS 65 XA 125 W AM2r2 95 A 20 A HS 78 FA 140 W AM2r2 110 A 20 A HS 78 FB 125 W, 140 W AM3 110 A 20 A HS 78 OD 65 W AM2r2 60 A 20 A HS 55 XC 125 W, Dual-Plane AM2r2 95 A 20 A HS 78 OC 65 W AM3 60 A 20 A HS 55 AMD Phenom™ Processor 14 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 6. AMD Phenom™ Processor Model Number Options Model Number Core Single-Plane Frequency NB Frequency Dual-Plane NB Number Frequency of Cores Max DDR Speed Max HT Link Speed 9100 1800 MHz 1600 MHz 1600 MHz 4 800 MT/s 3200 MT/s 9150 1800 MHz 1600 MHz 1600 MHz 4 800 MT/s 3200 MT/s 9350 2000 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s 8250 1900 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s 8400 2100 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s 8450 2100 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s 9450 2100 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s 9500 2200 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s 9550 2200 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s 8550 2200 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s 8600 2300 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s 860B 2300 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s 9600 2300 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s 960B 2300 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s 960Z 2300 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s 9650 2300 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s 8650 2300 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s 8750 2400 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s 875B 2400 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s 875Z 2400 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s 9700 2400 MHz 2000 MHz 2000 MHz 4 800 MT/s 4000 MT/s 9750 2400 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s 975B 2400 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s 700E 2400 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s 900E 2400 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s 8850 2500 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s 9850 2500 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s 985B 2500 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s 985Z 2500 MHz 2000 MHz 2000 MHz 4 800 MT/s 4000 MT/s X805 2500 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s 705E 2500 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s 905E 2500 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s AMD Phenom™ Processor 15 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 6. AMD Phenom™ Processor Model Number Options (Continued) Model Number Core Single-Plane Frequency NB Frequency Dual-Plane NB Number Frequency of Cores Max DDR Speed Max HT Link Speed 995Z 2600 MHz 2000 MHz 2000 MHz 4 800 MT/s 4000 MT/s X810 2600 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s X910 2600 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s X710 2600 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s T35T 2600 MHz 2000 MHz 2000 MHz 6 1333 MT/s 4000 MT/s T45T 2700 MHz 2000 MHz 2000 MHz 6 1333 MT/s 4000 MT/s X920 2800 MHz 1600 MHz 1800 MHz 4 1066 MT/s 3600 MT/s Z720 2800 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s X925 2800 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s T55T 2800 MHz 2000 MHz 2000 MHz 6 1333 MT/s 4000 MT/s Z940 3000 MHz 1600 MHz 1800 MHz 4 1066 MT/s 3600 MT/s X545 3000 MHz 1600 MHz 2000 MHz 2 1333 MT/s 4000 MT/s T75T 3000 MHz 2000 MHz 2000 MHz 6 1333 MT/s 4000 MT/s Z550 3100 MHz 1600 MHz 2000 MHz 2 1333 MT/s 4000 MT/s T90Z 3200 MHz 2000 MHz 2000 MHz 6 1333 MT/s 4000 MT/s Z560 3300 MHz 1600 MHz 2000 MHz 2 1333 MT/s 4000 MT/s Z970 3500 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s AMD Phenom™ Processor 16 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 7. AMD Phenom™ Processor Thermal Profiles Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W 85.0 W 90.0 W 95.0 W A 0.29°C/W 42°C 0.232°C/W 48°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 56.1°C 57.3°C 58.4°C 59.6°C 60.8°C 61.9°C 63.1°C 64.2°C 65.4°C 66.6°C 67.7°C 68.9°C 70.0°C Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W 85.0 W 90.0 W 95.0 W 100.0 W 105.0 W 110.0 W 115.0 W 120.0 W 125.0 W B 0.18°C/W 38°C 0.136°C/W 44°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.6°C 56.2°C 56.9°C 57.6°C 58.3°C 59.0°C 59.6°C 60.3°C 61.0°C Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications are met. AMD Phenom™ Processor 17 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 7. AMD Phenom™ Processor Thermal Profiles (Continued) Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W 85.0 W 90.0 W 95.0 W C HS65 0.30°C/W 42°C 0.242°C/W 48°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.3°C 56.5°C 57.7°C 58.9°C 60.1°C 61.3°C 62.5°C 63.7°C 64.9°C 66.2°C 67.4°C 68.6°C 69.8°C 71.0°C Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W D 0.29°C/W 42°C 0.200°C/W 48°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 56.0°C 57.0°C 58.0°C 59.0°C 60.0°C 61.0°C Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications are met. AMD Phenom™ Processor 18 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 7. AMD Phenom™ Processor Thermal Profiles (Continued) Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W 85.0 W 90.0 W 95.0 W 100.0 W 105.0 W 110.0 W 115.0 W 120.0 W 125.0 W 130.0 W 135.0 W 140.0 W E 0.18°C/W 38°C 0.143°C/W 44°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.4°C 56.2°C 56.9°C 57.6°C 58.3°C 59.0°C 59.7°C 60.4°C 61.2°C 61.9°C 62.6°C 63.3°C 64.0°C Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W F 0.42°C/W 42°C 0.338°C/W 48°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 56.5°C 58.1°C 59.8°C 61.5°C 63.2°C 64.9°C 66.6°C 68.3°C 70.0°C Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications are met. AMD Phenom™ Processor 19 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 7. AMD Phenom™ Processor Thermal Profiles (Continued) Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W G HS65 0.44°C/W 42°C 0.354°C/W 48°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.1°C 56.9°C 58.6°C 60.4°C 62.2°C 63.9°C 65.7°C 67.5°C 69.2°C 71.0°C Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W 85.0 W 90.0 W 95.0 W H HS65 0.32°C/W 42°C 0.263°C/W 48°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.9°C 57.2°C 58.5°C 59.8°C 61.2°C 62.5°C 63.8°C 65.1°C 66.4°C 67.7°C 69.0°C 70.4°C 71.7°C 73.0°C Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications are met. AMD Phenom™ Processor 20 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 7. AMD Phenom™ Processor Thermal Profiles (Continued) Thermal Profile Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W 85.0 W 90.0 W 95.0 W 100.0 W 105.0 W 110.0 W 115.0 W 120.0 W 125.0 W I 0.19°C/W 38°C 0.144°C/W 44°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.5°C 56.2°C 57.0°C 57.7°C 58.4°C 59.1°C 59.8°C 60.6°C 61.3°C 62.0°C Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W J HS55 0.43°C/W 42°C 0.338°C/W 48°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 56.5°C 58.1°C 59.8°C 61.5°C 63.2°C 64.9°C 66.6°C 68.3°C 70.0°C Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications are met. AMD Phenom™ Processor 21 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 7. AMD Phenom™ Processor Thermal Profiles (Continued) Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W K HS55 0.45°C/W 42°C 0.369°C/W 48°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.4°C 57.2°C 59.1°C 60.9°C 62.8°C 64.6°C 66.5°C 68.3°C 70.1°C 72.0°C Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W P HS65 0.35°C/W 42°C 0.275°C/W 48°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 56.3°C 57.6°C 59.0°C 60.4°C 61.8°C 63.1°C 64.5°C 65.9°C 67.3°C 68.6°C 70.0°C Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications are met. AMD Phenom™ Processor 22 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 7. AMD Phenom™ Processor Thermal Profiles (Continued) Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0W 10 W 20 W 30 W 40 W 50 W 60 W 70 W 80 W 90 W 95 W AD HS 65 0.30°C/W 42.0°C 0.242°C/W 48.0°C Tcase Max 55.0°C 55.0°C 55.0°C 55.3°C 57.7°C 60.1°C 62.5°C 64.9°C 67.4°C 69.8°C 71.0°C Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0W 10 W 20 W 30 W 40 W 50 W 60 W 70 W 80 W 90 W 95 W 100 W 105 W 110 W 115 W 120 W 125 W AE HS 78 0.19°C/W 38.0°C 0.144°C/W 44.0°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.5°C 57.0°C 57.7°C 58.4°C 59.1°C 59.8°C 60.6°C 61.3°C 62.0°C Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications are met. AMD Phenom™ Processor 23 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet 2.2 AMD Phenom™ Processor Thermal and Power Table Guide The thermal and power table guide shown in Table 8 maps SOPNs and the properties associated with their defined characters to the proper thermal and power table subsections and page numbers. This table is designed to be used as a quick reference for finding the appropriate subsection for the thermal and power tables corresponding to an SOPN. Table 8. AMD Phenom™ Processor Thermal and Power Table Guide SOPN Power Revision Thermal/Power Tables HD mmmm OB pnc GD 65 W B2 Section 2.3.1 on page 26 HD mmmm WC pnc GD 95 W B2 Section 2.3.2 on page 27 HD mmmm XA pnc GD 125 W B2 Section 2.3.3 on page 30 HD mmmm WC pnc GH 95 W B3 Section 2.3.4 on page 31 HD mmmm XA pnc GH 125 W B3 Section 2.3.5 on page 39 HD mmmm FA pnc GH 140 W B3 Section 2.3.6 on page 41 HD mmmm OD pnc GH 65 W B3 Section 2.3.7 on page 42 HD mmmm WC pnc HH 95 W B2 Section 2.3.8 on page 45 HD mmmm WC pnc HI 95 W B3 Section 2.3.9 on page 46 HD mmmm XC pnc GI 125 W C2 Section 2.3.10 on page 47 HD mmmm WF pnc GI 95 W C2 Section 2.3.11 on page 48 HD mmmm OC pnc GI 65 W C2 Section 2.3.12 on page 52 HD mmmm WF pnc GM 95 W C3 Section 2.3.13 on page 54 HD mmmm FB pnc GM 125 W, 140 W C3 Section 2.3.14 on page 55 HD mmmm WF pnc GR 95 W E0 Section 2.3.15 on page 56 HD mmmm FB pnc GR 125 W E0 Section 2.3.16 on page 58 AMD Phenom™ Processor 24 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet 2.3 AMD Phenom™ Processor Thermal and Power Specifications The thermal and power specification tables contain the thermal and power requirements for each OPN. This includes the information necessary for thermal management (for example, heat sink requirements, temperature assumptions) and power delivery (for example, voltage, current, and power dissipation for each P-state). Refer to the AMD Family 10h Processor Electrical Data Sheet, order# 40014, for all other electrical specifications for the processor. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for power management BIOS requirements. Section 2.1 on page 12 provides an example of the OPN structure for processors documented in this chapter and Table 8 on page 24 provides a guide to OPN organization in the following subsections. Refer to Section 1.2 on page 9 and Section 1.3 on page 10 for numbering conventions and terminology definitions used in these tables. AMD Phenom™ Processor 25 PID: 43375 Rev 3.46 - September 2010 2.3.1 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm OB pnc GD (65 W, DT, AM2r2) Thermal and Power Specifications OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 HD9100OBJ4BGD Notes Single-Plane Dual-Plane Tcase Max 1 55 oC to 61 oC Tctl Max 2 70 oC Tambient Min 5 oC Thermal Profile D S0.C0.P1 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 1600 MHz VID_VDDNB 11,7 N/A 1.150 V IDDNB Max 12 N/A 9.6 A S0.C0.P1 1800 MHz CPU COF 6 TDP 3 65.0 W 65.0 W VID_VDD Min 9 1.100 V 1.100 V VID_VDD Max 9 1.150 V 1.150 V IDD Max 3,10 53.8 A 44.9 A CPU COF 6 TDP 3 46.3 W 39.3 W VID_VDD Min 9 1.100 V 1.000 V VID_VDD Max 9 1.150 V 1.000 V IDD Max 3,10 38.0 A 23.7 A 3,10,14 14.6 A 3.5 A S0.C1.Pmin IDD Max 900 MHz S0 I/O Power 13 7.2 W 7.2 W S3 I/O Power 13 350 mW 350 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 26 PID: 43375 Rev 3.46 - September 2010 2.3.2 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm WC pnc GD (95 W, DT, AM2r2) Thermal and Power Specifications HD8600WCJ3BGD HD860BWCJ3BGD OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 Notes Single-Plane Dual-Plane o o HD8400WCJ3BGD Single-Plane Dual-Plane o Tcase Max 1 55 C to 71 C 55 C to 71 oC Tctl Max 2 70 oC 70 oC Tambient Min o 5 C 5 oC Thermal Profile C C S0.C0.P1 S0.C0.P1 Startup P-State 5 HTC P-State 4 NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 14.5 A N/A 15.2 A CPU COF 6 TDP 3 95.0 W 95.0 W 95.0 W 95.0 W VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 73.4 A 60.3 A 73.3 A 59.6 A CPU COF 6 TDP 3 72.2 W 54.6 W 74.2 W 55.6 W VID_VDD Min 9 1.200 V 1.050 V 1.200 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V IDD Max 3,10 56.3 A 30.5 A 57.7 A 30.6 A 3,10,14 26.1 A 6.7 A 28.1 A 7.4 A S0.C1.Pmin IDD Max S0.C0.P1 S0.C0.P1 2300 MHz 1150 MHz 2100 MHz 1050 MHz S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 27 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD9600WCJ4BGD HD960BWCJ4BGD OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 Notes Single-Plane Dual-Plane o o HD9500WCJ4BGD Single-Plane Dual-Plane o Tcase Max 1 55 C to 70 C 55 C to 70 oC Tctl Max 2 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile A A Startup P-State 5 S0.C0.P1 S0.C0.P1 HTC P-State 4 S0.C0.P1 S0.C0.P1 NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 12 A N/A 15 A CPU COF 6 2300 MHz 2200 MHz TDP 3 95 W 95 W 95 W 95 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 75.2 A 65.6 A 75.6 A 65.3 A CPU COF 6 TDP 3 66.3 W 56.7 W 67.2 W 66.1 W VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V IDD Max 3,10 53.7 A 35.5 A 56.4 A 40.8 A 3,10,14 37.6 A 17.3 A 44.4 A 24.1 A S0.C1.Pmin IDD Max 1150 MHz 1100 MHz S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 28 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 HD960ZWCJ4BGD Notes Single-Plane Dual-Plane Tcase Max 1 55 oC to 70 oC Tctl Max 2 70 oC Tambient Min 5 oC Thermal Profile A Startup P-State 5 S0.C0.P1 HTC P-State 4 S0.C0.P1 NB COF 6,7 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.250 V IDDNB Max 12 N/A 12.0 A CPU COF 6 2300 MHz TDP 3 95.0 W 95.0 W VID_VDD Min 9 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V IDD Max 3,10 75.2 A 65.6 A 1150 MHz CPU COF 6 TDP 3 66.3 W 56.7 W VID_VDD Min 9 1.150 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V IDD Max S0.C1.Pmin IDD Max 3,10 53.7 A 35.5 A 3,10,14 37.6 A 17.3 A S0 I/O Power 13 7.2 W 7.2 W S3 I/O Power 13 350 mW 350 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 29 PID: 43375 Rev 3.46 - September 2010 2.3.3 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm XA pnc GD (125 W, DT, AM2r2) Thermal and Power Specifications OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 HD9700XAJ4BGD Notes Single-Plane Dual-Plane Tcase Max 1 55 oC to 61 oC Tctl Max 2 70 oC Tambient Min 5 oC Thermal Profile B S0.C0.P1 Startup P-State 5 HTC P-State 4 NB COF 6,7 2000 MHz 2000 MHz VID_VDDNB 11,7 N/A 1.300 V IDDNB Max 12 N/A 16.8 A CPU COF 6 TDP 3 125.0 W 125.0 W VID_VDD Min 9 1.200 V 1.200 V VID_VDD Max 9 1.300 V 1.300 V IDD Max 3,10 95.4 A 82.3 A CPU COF 6 TDP 3 90.8 W 69.4 W VID_VDD Min 9 1.200 V 1.050 V VID_VDD Max 9 1.300 V 1.050 V IDD Max 3,10 71.6 A 41.1 A 3,10,14 57.6 A 39.4 A S0.C1.Pmin IDD Max S0.C0.P1 2400 MHz 1200 MHz S0 I/O Power 13 7.2 W 7.2 W S3 I/O Power 13 350 mW 350 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 30 PID: 43375 Rev 3.46 - September 2010 2.3.4 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm WC pnc GH (95 W, DT, AM2r2) Thermal and Power Specifications OPN State S0.C0.Px Specification8 Notes Single-Plane Dual-Plane o Single-Plane Dual-Plane 1 55 C to 71 C 55 C to 71 oC Tctl Max 2 70 oC 70 oC o 5 C 5 oC C C S0.C0.P1 S0.C0.P1 Tambient Min Thermal Profile 5 o HD8550WCJ3BGH Tcase Max Startup P-State S0.Cx.Px HD8450WCJ3BGH o S0.C0.P1 HTC P-State 4 NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 15.2 A N/A 14.9 A 2100 MHz S0.C0.P1 2200 MHz CPU COF 6 TDP 3 95.0 W 95.0 W 95.0 W 95.0 W VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 73.3 A 59.6 A 73.4 A 59.9 A CPU COF 6 TDP 3 74.2 W 55.6 W 73.2 W 55.1 W VID_VDD Min 9 1.200 V 1.050 V 1.200 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V IDD Max 3,10 57.7 A 30.6 A 57.0 A 30.5 A Core Power 15,18 15.5 W 7.8 W 14.7 W 7.4 W S0.C1.Pmin NB Power 17 16.5 W 19.0 W 16.1 W 18.6 W I/O Power S0.C1E.Pmin TDP S3 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 16 12.9 W 12.9 W 12.4 W 12.4 W 13 350 mW 350 mW 350 mW 350 mW S0.C0.P0 S0.C0.P1 1050 MHz 1100 MHz The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 31 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 HD8650WCJ3BGH Notes Single-Plane Dual-Plane o o HD860BWCJ3BGH Single-Plane Dual-Plane o Tcase Max 1 55 C to 71 C 55 C to 71 oC Tctl Max 2 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile C C Startup P-State 5 S0.C0.P1 S0.C0.P1 HTC P-State 4 S0.C0.P1 S0.C0.P1 NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 14.5 A N/A 12.8 A CPU COF 6 2300 MHz 2300 MHz TDP 3 95.0 W 95.0 W 95.0 W 95.0 W VID_VDD Min 9 1.200 V 1.200 V 1.250 V 1.250 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 73.4 A 60.3 A 72.4 A 59.6 A 1150 MHz 1150 MHz CPU COF 6 TDP 3 72.2 W 54.6 W 72.2 W 48.7 W VID_VDD Min 9 1.200 V 1.050 V 1.250 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V IDD Max 3,10 56.3 A 30.5 A 54.2 A 26.9 A Core Power 15,18 13.8 W 7.0 W 12.0 W 5.0 W S0.C1.Pmin NB Power 17 15.8 W 18.2 W 16.0 W 16.0 W I/O Power S0.C1E.Pmin TDP S3 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 16 12.0 W 12.0 W 9.7 W 9.7 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 32 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 HD8750WCJ3BGH Notes Single-Plane Dual-Plane o o HD875BWCJ3BGH Single-Plane Dual-Plane o Tcase Max 1 55 C to 71 C 55 C to 71 oC Tctl Max 2 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile C C Startup P-State 5 S0.C0.P1 S0.C0.P1 HTC P-State 4 S0.C0.P1 S0.C0.P1 NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 14.2 A N/A 12.5 A CPU COF 6 2400 MHz 2400 MHz TDP 3 95.0 W 95.0 W 95.0 W 95.0 W VID_VDD Min 9 1.200 V 1.200 V 1.250 V 1.250 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 73.5 A 60.6 A 72.4 A 59.9 A 1200 MHz 1200 MHz CPU COF 6 TDP 3 71.3 W 54.2 W 71.3 W 48.3 W VID_VDD Min 9 1.200 V 1.050 V 1.250 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V IDD Max 3,10 55.6 A 30.4 A 53.4 A 26.8 A Core Power 15,18 13.1 W 6.6 W 11.1 W 4.6 W S0.C1.Pmin NB Power 17 15.5 W 17.8 W 15.6 W 15.6 W I/O Power S0.C1E.Pmin TDP S3 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 16 11.6 W 11.6 W 9.3 W 9.3 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 33 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 HD875ZWCJ3BGH Notes Single-Plane Dual-Plane o o HD8850WCJ3BGH Single-Plane Dual-Plane o Tcase Max 1 55 C to 71 C 55 C to 71 oC Tctl Max 2 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile C C Startup P-State 5 S0.C0.P1 S0.C0.P1 HTC P-State 4 S0.C0.P1 S0.C0.P1 NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 14.2 A N/A 13.9 A CPU COF 6 2400 MHz 2500 MHz TDP 3 95.0 W 95.0 W 95.0 W 95.0 W VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 73.5 A 60.6 A 73.6 A 61.0 A 1200 MHz 1250 MHz CPU COF 6 TDP 3 71.3 W 54.2 W 70.4 W 53.7 W VID_VDD Min 9 1.200 V 1.050 V 1.200 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V IDD Max 3,10 55.6 A 30.4 A 54.9 A 30.3 A Core Power 15,18 13.1 W 6.6 W 12.3 W 6.2 W S0.C1.Pmin NB Power 17 15.5 W 17.8 W 15.1 W 17.4 W I/O Power S0.C1E.Pmin TDP S3 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 16 11.6 W 11.6 W 11.1 W 11.1 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 34 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet OPN Specification8 State S0.C0.Px S0.Cx.Px HD9850WCJ4BGH Notes Single-Plane Dual-Plane o o HD985BWCJ4BGH Single-Plane Dual-Plane o Tcase Max 1 55 C to 70 C 55 C to 70 oC Tctl Max 2 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile A A Startup P-State 5 S0.C0.P1 S0.C0.P1 HTC P-State 4 S0.C0.P1 S0.C0.P1 NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz VID_VDDNB Min 11,7 N/A 1.200 V N/A 1.225 V VID_VDDNB Max 11,7 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 11.1 A N/A 10.1 A CPU COF 6 TDP 3 95.0 W 95.0 W 95.0 W 95.0 W VID_VDD Min 9 1.200 V 1.200 V 1.225 V 1.225 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 74.1 A 63.8 A 73.9 A 63.8 A CPU COF 6 TDP 3 63.6 W 49.6 W 63.6 W 46.6 W VID_VDD Min 9 1.200 V 1.050 V 1.225 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V IDD Max 3,10 49.3 A 29.7 A 48.3 A 28.3 A Core Power 15,18 24.5 W 21.5 W 16.6 W 14.6 W S0.C1.Pmin NB Power 17 12.5 W 16.3 W 12.3 W 12.3 W I/O Power S0.C1E.Pmin TDP S3 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 16 10.0 W 10.0 W 12.3 W 12.3 W 13 350 mW 350 mW 350 mW 350 mW S0.C0.P0 S0.C0.P1 2500 MHz 1250 MHz 2500 MHz 1250 MHz The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 35 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 HD9750WCJ4BGH Notes Single-Plane Dual-Plane o o HD975BWCJ4BGH Single-Plane Dual-Plane o Tcase Max 1 55 C to 70 C 55 C to 70 oC Tctl Max 2 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile A A Startup P-State 5 S0.C0.P1 S0.C0.P1 HTC P-State 4 S0.C0.P1 S0.C0.P1 NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 13.5 A N/A 11.6 A CPU COF 6 2400 MHz 2400 MHz TDP 3 95.0 W 95.0 W 95.0 W 95.0 W VID_VDD Min 9 1.150 V 1.150 V 1.200 V 1.200 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 75.2 A 64.0 A 74.0 A 63.4 A 1200 MHz 1200 MHz CPU COF 6 TDP 3 65.3 W 56.9 W 64.7 W 50.3 W VID_VDD Min 9 1.150 V 1.050 V 1.200 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V IDD Max 3,10 52.8 A 33.8 A 50.2 A 29.8 A Core Power 15,18 25.9 W 22.7 W 21.1 W 18.0 W S0.C1.Pmin NB Power 17 12.9 W 16.9 W 12.8 W 14.5 W I/O Power S0.C1E.Pmin TDP S3 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 16 10.6 W 10.6 W 8.1 W 8.1 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 36 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 HD960BWCJ4BGH Notes Single-Plane Dual-Plane o o HD9650WCJ4BGH Single-Plane Dual-Plane o Tcase Max 1 55 C to 70 C 55 C to 70 oC Tctl Max 2 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile A A Startup P-State 5 S0.C0.P1 S0.C0.P1 HTC P-State 4 S0.C0.P1 S0.C0.P1 NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V IDDNB Max 12 N/A 12.0 A N/A 14.0 A CPU COF 6 2300 MHz 2300 MHz TDP 3 95.0 W 95.0 W 95.0 W 95.0 W VID_VDD Min 9 1.200 V 1.200 V 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 73.9 A 62.9 A 75.1 A 63.5 A 1150 MHz 1150 MHz CPU COF 6 TDP 3 65.8 W 50.9 W 66.1 W 57.6 W VID_VDD Min 9 1.200 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V IDD Max 3,10 51.1 A 29.9 A 53.6 A 34.0 A Core Power 15,18 22.7 W 19.1 W 27.4 W 23.8 W S0.C1.Pmin NB Power 17 13.2 W 15.0 W 13.3 W 17.5 W I/O Power S0.C1E.Pmin TDP S3 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 16 8.7 W 8.7 W 11.2 W 11.2 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 37 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 HD9550WCJ4BGH Notes Single-Plane Dual-Plane Tcase Max 1 55 oC to 70 oC Tctl Max 2 70 oC Tambient Min 5 oC Thermal Profile A Startup P-State 5 S0.C0.P1 HTC P-State 4 S0.C0.P1 NB COF 6,7 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.250 V IDDNB Max 12 N/A 14.4 A CPU COF 6 2200 MHz TDP 3 95.0 W 95.0 W VID_VDD Min 9 1.150 V 1.150 V VID_VDD Max 9 1.250 V 1.250 V IDD Max 3,10 74.9 A 63.0 A CPU COF 6 TDP 3 67.0 W 58.3 W VID_VDD Min 9 1.150 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V 1100 MHz IDD Max 3,10 54.4 A 34.1 A Core Power 15,18 28.9 W 24.9 W S0.C1.Pmin NB Power 17 13.7 W 18.0 W I/O Power S0.C1E.Pmin TDP 13 7.2 W 7.2 W S3 I/O Power 16 11.9 W 11.9 W 13 350 mW 350 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 38 PID: 43375 Rev 3.46 - September 2010 2.3.5 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm XA pnc GH (125 W, DT, AM2r2) Thermal and Power Specifications OPN Specification8 State S0.C0.Px S0.Cx.Px HD985ZXAJ4BGH Notes Single-Plane Dual-Plane o o HD9750XAJ4BGH Single-Plane Dual-Plane o Tcase Max 1 55 C to 61 C 55 C to 61 oC Tctl Max 2 70 oC 70 oC Tambient Min o 5 C 5 oC Thermal Profile B B S0.C0.P1 S0.C0.P1 Startup P-State 5 HTC P-State 4 NB COF 6,7 2000 MHz 2000 MHz 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.300 V N/A 1.300 V IDDNB Max 12 N/A 18.4 A N/A 18.3 A S0.C0.P1 S0.C0.P1 2400 MHz CPU COF 6 TDP 3 125.0 W 125.0 W 125.0 W 125.0 W VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V VID_VDD Max 9 1.300 V 1.300 V 1.300 V 1.300 V IDD Max 3,10 95.0 A 80.1 A 95.0 A 80.2 A CPU COF 6 TDP 3 89.4 W 69.7 W 90.7 W 70.2 W VID_VDD Min 9 1.200 V 1.050 V 1.200 V 1.050 V VID_VDD Max 9 1.300 V 1.050 V 1.300 V 1.050 V IDD Max 3,10 70.2 A 39.4 A 71.2 A 39.9 A Core Power 15,18 40.8 W 32.3 W 42.2 W 33.0 W S0.C1.Pmin NB Power 17 17.9 W 23.9 W 17.7 W 23.8 W I/O Power S0.C1E.Pmin TDP 13 7.2 W 7.2 W 7.2 W 7.2 W 16 13.6 W 13.6 W 14.5 W 14.5 W I/O Power 13 350 mW 350 mW 350 mW 350 mW S0.C0.P0 S0.C0.P1 S3 2500 MHz 1250 MHz 1200 MHz The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 39 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 HD9850XAJ4BGH Notes Single-Plane Dual-Plane o o HD995ZXAJ4BGH Single-Plane Dual-Plane o Tcase Max 1 55 C to 61 C 55 C to 61 oC Tctl Max 2 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile B B Startup P-State 5 S0.C0.P1 S0.C0.P1 HTC P-State 4 S0.C0.P1 S0.C0.P1 NB COF 6,7 2000 MHz 2000 MHz 2000 MHz 2000 MHz VID_VDDNB 11,7 N/A 1.300 V N/A 1.300 V IDDNB Max 12 N/A 18.4 A N/A 17.8 A CPU COF 6 2500 MHz 2600 MHz TDP 3 125.0 W 125.0 W 125.0 W 125.0 W VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V VID_VDD Max 9 1.300 V 1.300 V 1.300 V 1.300 V IDD Max 3,10 95.0 A 80.1 A 95.0 A 80.5 A 1250 MHz 1300 MHz CPU COF 6 TDP 3 89.4 W 69.7 W 88.2 W 68.9 W VID_VDD Min 9 1.200 V 1.050 V 1.200 V 1.050 V VID_VDD Max 9 1.300 V 1.050 V 1.300 V 1.050 V IDD Max 3,10 70.2 A 39.4 A 69.2 A 39.3 A Core Power 15,18 40.8 W 32.3 W 39.0 W 31.1 W S0.C1.Pmin NB Power 17 17.9 W 23.9 W 17.5 W 22.2 W I/O Power S0.C1E.Pmin TDP 13 7.2 W 7.2 W 7.2 W 7.2 W 16 13.7 W 13.7 W 13.1 W 13.1 W I/O Power 13 350 mW 350 mW 350 mW 350 mW S3 The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 40 PID: 43375 Rev 3.46 - September 2010 2.3.6 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm FA pnc GH (140 W, DT, AM2r2) Thermal and Power Specifications HD995ZFAJ4BGH19 OPN Specification8 State S0.C0.Px Notes Single-Plane Dual-Plane o Tcase Max 1 55 C to 64 oC Tctl Max 2 70 oC 5 oC Tambient Min E Thermal Profile S0.C0.P1 Startup P-State 5 HTC P-State 4 NB COF 6,7 2000 MHz 2000 MHz VID_VDDNB 11,7 N/A 1.300 V IDDNB Max 12 N/A 18.1 A CPU COF 6 TDP 3 140.0 W 140.0 W VID_VDD Min 9 1.250 V 1.250 V VID_VDD Max 9 1.300 V 1.300 V IDD Max 3,10 105.9 A 89.6 A CPU COF 6 TDP 3 102.6 W 69.8 W VID_VDD Min 9 1.250 V 1.050 V VID_VDD Max 9 1.300 V 1.050 V IDD Max 3,10 78.5 A 39.8 A Core Power 15,18 44.2 W 31.8 W S0.C1.Pmin NB Power 17 20.4 W 23.5 W I/O Power S0.C1E.Pmin TDP S3 I/O Power 13 7.2 W 7.2 W 16 13.4 W 13.4 W 13 350 mW 350 mW S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P1 2600 MHz 1300 MHz The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 41 PID: 43375 Rev 3.46 - September 2010 2.3.7 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm OD pnc GH (65 W, DT, AM2r2) Thermal and Power Specifications OPN Specification8 State S0.C0.Px S0.Cx.Px HD8450ODJ3BGH Notes Single-Plane Dual-Plane o o HD8250ODJ3BGH Single-Plane Dual-Plane o Tcase Max 1 55 C to 71 C 55 C to 71 oC Tctl Max 2 70 oC 70 oC Tambient Min o 5 C 5 oC Thermal Profile G G S0.C0.P1 S0.C0.P1 Startup P-State 5 HTC P-State 4 NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.200 V N/A 1.200 V IDDNB Max 12 N/A 11.0 A N/A 11.6 A S0.C0.P1 2100 MHz S0.C0.P1 1900 MHz CPU COF 6 TDP 3 65.0 W 65.0 W 65.0 W 65.0 W VID_VDD Min 9 1.125 V 1.125 V 1.125 V 1.125 V VID_VDD Max 9 1.200 V 1.200 V 1.200 V 1.200 V IDD Max 3,10 51.8 A 42.1 A 51.6 A 41.4 A CPU COF 6 TDP 3 46.7 W 39.1 W 48.2 W 40.1 W VID_VDD Min 9 1.125 V 1.000 V 1.125 V 1.000 V VID_VDD Max 9 1.200 V 1.000 V 1.200 V 1.000 V IDD Max 3,10 37.5 A 21.5 A 38.7 A 21.6 A Core Power 15,18 5.5 W 3.2 W 6.8 W 3.9 W S0.C1.Pmin NB Power 17 10.9 W 13.2 W 11.4 W 13.9 W I/O Power S0.C1E.Pmin TDP S3 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 16 8.6 W 8.6 W 9.6 W 9.6 W 13 350 mW 350 mW 350 mW 350 mW S0.C0.P0 S0.C0.P1 1050 MHz 950 MHz The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 42 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD9150ODJ4BGH OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 Notes Single-Plane HD9350ODJ4BGH Dual-Plane Single-Plane Dual-Plane o Tcase Max 1 55 C to 70 oC 55 oC to 70 oC Tctl Max 2 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile F F Startup P-State 5 S0.C0.P1 S0.C0.P1 HTC P-State 4 S0.C0.P1 S0.C0.P1 NB COF 6,7 1600 MHz 1600 MHz 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.125 V N/A 1.125 V IDDNB Max 12 N/A 10.1 A N/A 9.8 A CPU COF 6 1800 MHz 2000 MHz TDP 3 65.0 W 65.0 W 65.0 W 65.0 W VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V IDD Max 3,10 54.9 A 45.8 A 55.0 A 46.0 A 900 MHz 1000 MHz CPU COF 6 TDP 3 47.2 W 41.7 W 45.5 W 40.5 W VID_VDD Min 9 1.075 V 1.000 V 1.075 V 1.000 V VID_VDD Max 9 1.125 V 1.000 V 1.125 V 1.000 V IDD Max 3,10 39.7 A 25.9 A 38.1 A 25.0 A Core Power 15,18 17.8 W 16.0 W 15.4 W 14.1 W S0.C1.Pmin NB Power 17 9.9 W 11.3 W 9.2 W 10.5 W I/O Power S0.C1E.Pmin TDP S3 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W 16 10.6 W 10.6 W 8.8 W 8.8 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 43 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 HD9450ODJ4BGH Notes Single-Plane Dual-Plane Tcase Max 1 55 oC to 70 oC Tctl Max 2 70 oC Tambient Min 5 oC Thermal Profile F Startup P-State 5 S0.C0.P1 HTC P-State 4 S0.C0.P1 NB COF 6,7 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.125 V IDDNB Max 12 N/A 9.4 A CPU COF 6 2100 MHz TDP 3 65.0 W 65.0 W VID_VDD Min 9 1.075 V 1.075 V VID_VDD Max 9 1.125 V 1.125 V IDD Max 3,10 55.1 A 46.4 A CPU COF 6 TDP 3 44.7 W 39.9 W VID_VDD Min 9 1.075 V 1.000 V VID_VDD Max 9 1.125 V 1.000 V 1050 MHz IDD Max 3,10 37.4 A 24.8 A Core Power 15,18 14.5 W 13.5 W S0.C1.Pmin NB Power 17 9.3 W 10.6 W I/O Power S0.C1E.Pmin TDP 13 7.2 W 7.2 W S3 I/O Power 16 8.1 W 8.1 W 13 350 mW 350 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 44 PID: 43375 Rev 3.46 - September 2010 2.3.8 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm WC pnc HH (95 W, DT, AM2r2) Thermal and Power Specifications OPN Specification8 State S0.C0.Px HD8400WCJ3BHH Notes Single-Plane Dual-Plane Tcase Max 1 55 oC to 71 oC Tctl Max 2 70 oC Tambient Min 5 oC Thermal Profile C Startup P-State S0.C0.P1 5 S0.C0.P1 HTC P-State 4 NB COF 6,7 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.250 V IDDNB Max 12 N/A 15.2 A CPU COF 6 TDP 3 95.0 W 95.0 W VID_VDD Min 9 1.200 V 1.200 V VID_VDD Max 9 1.250 V 1.250 V IDD Max 3,10 73.3 A 59.6 A CPU COF 6 TDP 3 74.2 W 55.6 W VID_VDD Min 9 1.200 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V IDD Max 3,10 57.7 A 30.6 A Core Power 15,18 15.5 W 7.8 W S0.C1.Pmin NB Power 17 16.5 W 19.0 W I/O Power S0.C1E.Pmin TDP 13 7.2 W 7.2 W 16 12.9 W 12.9 W 13 350 mW 350 mW S0.Cx.Px S0.C0.P0 S0.C0.P1 S3 I/O Power 2100 MHz 1050 MHz The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 45 PID: 43375 Rev 3.46 - September 2010 2.3.9 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm WC pnc HI (95 W, DT, AM2r2) Thermal and Power Specifications OPN Specification8 State S0.C0.Px HD8550WCJ3BHI Notes Single-Plane Dual-Plane Tcase Max 1 55 oC to 71 oC Tctl Max 2 70 oC Tambient Min 5 oC Thermal Profile C Startup P-State S0.C0.P1 5 S0.C0.P1 HTC P-State 4 NB COF 6,7 1800 MHz 1800 MHz VID_VDDNB 11,7 N/A 1.250 V IDDNB Max 12 N/A 14.9 A CPU COF 6 TDP 3 95.0 W 95.0 W VID_VDD Min 9 1.200 V 1.200 V VID_VDD Max 9 1.250 V 1.250 V IDD Max 3,10 73.4 A 59.9 A CPU COF 6 TDP 3 73.2 W 55.1 W VID_VDD Min 9 1.200 V 1.050 V VID_VDD Max 9 1.250 V 1.050 V IDD Max 3,10 57.0 A 30.5 A Core Power 15,18 14.7 W 7.4 W S0.C1.Pmin NB Power 17 16.1 W 18.6 W I/O Power S0.C1E.Pmin TDP 13 7.2 W 7.2 W 16 12.4 W 12.4 W 13 350 mW 350 mW S0.Cx.Px S0.C0.P0 S0.C0.P1 S3 I/O Power 2200 MHz 1100 MHz The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 46 PID: 43375 Rev 3.46 - September 2010 2.3.10 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm XC pnc GI (125 W, DT, AM2r2) Thermal and Power Specifications HDX920XCJ4DGI19 OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 Specification8 Tcase Max Notes Single-Plane Dual-Plane 55 oC to 62 oC 1 Tctl Max 2 HDZ940XCJ4DGI19 Single-Plane Dual-Plane 55 oC to 62 oC 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile I I S0.C0.P3 S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 1800 MHz 1600 MHz 1800 MHz VID_VDDNB Min 11,7 N/A 1.150 V N/A 1.150 V VID_VDDNB Max 11,7 N/A 1.300 V N/A 1.300 V IDDNB Max 12 N/A 20.0 A N/A 20.0 A CPU COF 6 TDP 3,7 140.8 W 125.0 W 139.6 W 125.0 W VID_VDD Min 9 1.225 V 1.225 V 1.225 V 1.225 V VID_VDD Max 9 1.425 V 1.425 V 1.425 V 1.425 V IDD Max 3,10 102.5 A 78.9 A 102.3 A 79.4 A CPU COF 6 TDP 3,7 94.7 W 91.4 W 94.9 W 91.7 W VID_VDD Min 9 1.150 V 1.125 V 1.150 V 1.125 V VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V IDD Max 3,10 77.6 A 55.2 A 77.7 A 56.0 A CPU COF 6 S0.C0.P3 S0.C0.P3 2800 MHz 2100 MHz 1600 MHz 3000 MHz 2300 MHz 1800 MHz TDP 3,7 88.7 W 70.1 W 88.9 W 70.8 W VID_VDD Min 9 1.150 V 1.025 V 1.150 V 1.025 V VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V IDD Max 3,10 72.4 A 39.3 A 72.5 A 40.1 A CPU COF 6 800 MHz 800 MHz TDP 3,7 79.2 W 52.7 W 77.0 W 48.8 W VID_VDD Min 9 1.150 V 0.925 V 1.150 V 0.875 V VID_VDD Max 9 1.150 V 1.150 V 1.150 V 1.150 V IDD Max 3,10 64.1 A 24.9 A 62.1 A 21.4 A Core Power (Pre-Flush) 20 39.7 W 8.8 W 38.7 W 6.9 W Core Power (Post-Flush) 20 36.8 W 6.3 W 35.8 W 4.8 W NB Power 17 30.4 W 22.3 W 31.0 W 22.3 W I/O Power 13 5.5 W 5.5 W 5.5 W 5.5 W S0.C1E.Pmin TDP S3 I/O Power 16 19.7 W 11.4 W 18.9 W 10.4 W 13 350 mW 350 mW 350 mW 350 mW S0.C1.Pmin The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 47 PID: 43375 Rev 3.46 - September 2010 2.3.11 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm WF pnc GI (95 W, DT, AM3) Thermal and Power Specifications HDX805WFK4FGI19 OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 Specification8 Tcase Max Notes Single-Plane Dual-Plane 55 oC to 71 oC 1 Tctl Max 2 HDX810WFK4FGI19 Single-Plane Dual-Plane 55 oC to 71 oC 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile C C S0.C0.P3 S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.150 V N/A 1.150 V VID_VDDNB Max 11,7 N/A 1.300 V N/A 1.300 V IDDNB Max 12 N/A 20.0 A N/A 20.0 A CPU COF 6 TDP 3,7 104.0 W 95.0 W 104.0 W 95.0 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.425 V 1.425 V 1.425 V 1.425 V IDD Max 3,10 75.8 A 58.7 A 75.8 A 58.9 A CPU COF 6 TDP 3,7 85.5 W 71.7 W 85.5 W 71.7 W VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V IDD Max 3,10 68.5 A 40.5 A 68.5 A 40.8 A CPU COF 6 S0.C0.P3 2500 MHz 1800 MHz 1300 MHz S0.C0.P3 2600 MHz 1900 MHz 1400 MHz TDP 3,7 79.5 W 57.2 W 79.5 W 57.2 W VID_VDD Min 9 1.150 V 0.950 V 1.150 V 0.950 V VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V IDD Max 3,10 63.3 A 28.3 A 63.3 A 28.7 A CPU COF 6 800 MHz 800 MHz TDP 3,7 73.5 W 48.4 W 72.3 W 47.6 W VID_VDD Min 9 1.150 V 0.875 V 1.150 V 0.875 V VID_VDD Max 9 1.150 V 1.150 V 1.150 V 1.150 V IDD Max 3,10 58.1 A 20.2 A 57.1 A 19.9 A Core Power (Pre-Flush) 20 37.5 W 6.6 W 36.5 W 6.5 W Core Power (Post-Flush) 20 34.6 W 4.4 W 33.5 W 4.3 W NB Power 17 22.3 W 22.3 W 22.3 W 22.3 W I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W S0.C1E.Pmin TDP S3 I/O Power 16 17.5 W 10.0 W 17.0 W 9.9 W 13 350 mW 350 mW 350 mW 350 mW S0.C1.Pmin The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 48 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HDX910WFK4DGI19 OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 Specification8 Tcase Max Notes Single-Plane Dual-Plane 1 55 oC to 71 oC Tctl Max 2 HDX925WFK4DGI19 Single-Plane Dual-Plane 55 oC to 71 oC 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile C C S0.C0.P3 S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.150 V N/A 1.150 V VID_VDDNB Max 11,7 N/A 1.300 V N/A 1.300 V IDDNB Max 12 N/A 20.0 A N/A 20.0 A S0.C0.P3 S0.C0.P3 2800 MHz CPU COF 6 TDP 3,7 104.0 W 95.0 W 103.1 W 95.0 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.425 V 1.425 V 1.425 V 1.425 V IDD Max 3,10 75.8 A 58.9 A 75.8 A 59.5 A CPU COF 6 2600 MHz 1900 MHz 2100 MHz TDP 3,7 85.5 W 71.7 W 85.5 W 72.2 W VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V IDD Max 3,10 68.5 A 40.8 A 68.5 A 41.6 A CPU COF 6 1400 MHz 1600 MHz TDP 3,7 79.5 W 57.2 W 79.5 W 58.0 W VID_VDD Min 9 1.150 V 0.950 V 1.150 V 0.950 V VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V IDD Max 3,10 63.3 A 28.7 A 63.3 A 29.6 A CPU COF 6 TDP 3,7 72.3 W 47.6 W 70.0 W 46.1 W VID_VDD Min 9 1.150 V 0.875 V 1.150 V 0.850 V VID_VDD Max 9 1.150 V 1.150 V 1.150 V 1.125 V 800 MHz 800 MHz IDD Max 3,10 57.1 A 19.9 A 55.0 A 18.1 A Core Power (Pre-Flush) 20 36.5 W 6.5 W 35.5 W 5.6 W Core Power (Post-Flush) 20 33.5 W 4.3 W 32.5 W 3.6 W NB Power 17 22.3 W 22.3 W 22.3 W 22.3 W I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W S0.C1E.Pmin TDP S3 I/O Power 16 17.0 W 9.9 W 16.1 W 9.5 W 13 350 mW 350 mW 350 mW 350 mW S0.C1.Pmin The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 49 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HDX710WFK3DGI19 OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 Specification8 Tcase Max Notes Single-Plane Dual-Plane 55 oC to 73 oC 1 Tctl Max 2 HDZ720WFK3DGI19 Single-Plane Dual-Plane 55 oC to 73 oC 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile H H S0.C0.P3 S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.150 V N/A 1.150 V VID_VDDNB Max 11,7 N/A 1.300 V N/A 1.300 V IDDNB Max 12 N/A 20.0 A N/A 20.0 A S0.C0.P3 2600 MHz S0.C0.P3 CPU COF 6 TDP 3,7 107.4 W 95.0 W 106.5 W 95.0 W VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V VID_VDD Max 9 1.425 V 1.425 V 1.425 V 1.425 V IDD Max 3,10 75.9 A 57.1 A 75.8 A 57.5 A CPU COF 6 1900 MHz 2800 MHz 2100 MHz TDP 3,7 87.6 W 72.2 W 87.6 W 72.6 W VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V IDD Max 3,10 70.3 A 40.0 A 70.3 A 40.5 A CPU COF 6 1400 MHz 1600 MHz TDP 3,7 83.1 W 57.8 W 83.1 W 58.5 W VID_VDD Min 9 1.150 V 0.950 V 1.150 V 0.950 V VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V IDD Max 3,10 66.4 A 28.5 A 66.4 A 29.1 A CPU COF 6 TDP 3,7 77.7 W 48.8 W 75.9 W 47.2 W VID_VDD Min 9 1.150 V 0.875 V 1.150 V 0.850 V VID_VDD Max 9 1.150 V 1.150 V 1.150 V 1.125 V 800 MHz 800 MHz IDD Max 3,10 61.8 A 20.5 A 60.2 A 18.7 A Core Power (Pre-Flush) 20 39.6 W 7.9 W 38.7 W 6.9 W Core Power (Post-Flush) 20 36.6 W 5.2 W 35.8 W 4.4 W NB Power 17 22.3 W 22.3 W 22.3 W 22.3 W I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W S0.C1E.Pmin TDP S3 I/O Power 16 19.6 W 10.5 W 19.0 W 10.4 W 13 350 mW 350 mW 350 mW 350 mW S0.C1.Pmin The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 50 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HDZ550WFK2DGI19 OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 Specification8 Tcase Max Notes Single-Plane Dual-Plane 55 oC to 70 oC 1 Tctl Max 2 HDX545WFK2DGI19 Single-Plane Dual-Plane 55 oC to 70 oC 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile P P S0.C0.P3 S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.050 V N/A 1.050 V VID_VDDNB Max 11,7 N/A 1.150 V N/A 1.150 V IDDNB Max 12 N/A 15.1 A N/A 15.3 A S0.C0.P3 3100 MHz S0.C0.P3 3000 MHz CPU COF 6 TDP 3,7 94.0 W 80.0 W 94.3 W 80.0 W VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V VID_VDD Max 9 1.425 V 1.425 V 1.425 V 1.425 V IDD Max 3,10 67.8 A 50.1 A 67.9 A 50.0 A CPU COF 6 2400 MHz 2300 MHz TDP 3,7 65.6 W 60.7 W 65.6 W 60.7 W VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V IDD Max 3,10 49.2 A 35.8 A 49.1 A 35.6 A CPU COF 6 1900 MHz 1800 MHz TDP 3,7 49.8 W 48.3 W 49.7 W 48.3 W VID_VDD Min 9 1.050 V 1.000 V 1.050 V 1.000 V VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V IDD Max 3,10 41.1 A 26.1 A 41.0 A 25.9 A CPU COF 6 TDP 3,7 44.5 W 35.4 W 44.9 W 36.8 W VID_VDD Min 9 1.050 V 0.850 V 1.050 V 0.875 V VID_VDD Max 9 1.075 V 1.075 V 1.100 V 1.100 V 800 MHz 800 MHz IDD Max 3,10 36.0 A 14.4 A 36.4 A 15.6 A Core Power (Pre-Flush) 20 23.9 W 5.7 W 24.2 W 6.3 W Core Power (Post-Flush) 20 21.5 W 3.3 W 21.8 W 3.8 W NB Power 17 14.9 W 14.9 W 15.1 W 15.1 W I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W S0.C1E.Pmin TDP S3 I/O Power 16 9.2 W 6.7 W 9.4 W 7.0 W 13 350 mW 350 mW 350 mW 350 mW S0.C1.Pmin The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 51 PID: 43375 Rev 3.46 - September 2010 2.3.12 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm OC pnc GI (65 W, DT, AM3) Thermal and Power Specifications HD900EOCK4DGI19 OPN Specification8 State Tcase Max Tctl Max S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 Notes Single-Plane 1 Dual-Plane o o 55 C to 70 C HD905EOCK4DGI19 Single-Plane 55 C to 70 oC o 2 Tambient Min Thermal Profile Dual-Plane o 70 C 70 oC 5 oC 5 oC J J Startup P-State 5 S0.C0.P3 S0.C0.P3 HTC P-State 4 S0.C0.P3 S0.C0.P3 NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.050 V N/A 1.050 V VID_VDDNB Max 11,7 N/A 1.100 V N/A 1.100 V IDDNB Max 12 N/A 14.6 A N/A 14.3 A CPU COF 6 TDP 3,7 69.5 W 65.0 W 69.2 W 65.0 W VID_VDD Min 9 1.050 V 1.025 V 1.050 V 1.025 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 58.0 A 43.0 A 58.0 A 43.2 A CPU COF 6 2400 MHz 2500 MHz 1800 MHz 1900 MHz TDP 3,7 60.8 W 51.7 W 60.6 W 54.2 W VID_VDD Min 9 1.050 V 0.950 V 1.050 V 0.975 V VID_VDD Max 9 1.175 V 1.175 V 1.200 V 1.200 V IDD Max 3,10 49.5 A 31.9 A 49.5 A 34.0 A CPU COF 6 1400 MHz 1400 MHz TDP 3,7 55.7 W 44.7 W 54.4 W 44.0 W VID_VDD Min 9 1.050 V 0.900 V 1.050 V 0.900 V VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V IDD Max 3,10 45.9 A 25.6 A 45.1 A 25.1 A CPU COF 6 TDP 3,7 48.9 W 37.7 W 47.8 W 35.9 W VID_VDD Min 9 1.050 V 0.850 V 1.050 V 0.825 V VID_VDD Max 9 1.075 V 1.075 V 1.050 V 1.050 V IDD Max 3,10 40.6 A 18.6 A 39.8 A 17.3 A Core Power (Pre-Flush) 20 24.1 W 5.6 W 23.6 W 5.0 W Core Power (Post-Flush) 20 800 MHz 800 MHz 21.7 W 3.7 W 21.2 W 3.2 W NB Power 17 N/A 14.8 W N/A 14.5 W I/O Power S0.C1E.Pmin TDP S3 I/O Power 13 16 6.7 W 10.4 W 6.7 W 7.0 W 6.7 W 10.1 W 6.7 W 6.6 W 13 350 mW 350 mW 350 mW 350 mW S0.C1.Pmin The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 52 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD700EOCK3DGI19 OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin Specification8 Tcase Max Notes Single-Plane Dual-Plane 1 55 oC to 72 oC Tctl Max 2 HD705EOCK3DGI19 Single-Plane Dual-Plane 55 oC to 72 oC 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile K K S0.C0.P3 S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.050 V N/A 1.050 V VID_VDDNB Max 11,7 N/A 1.100 V N/A 1.100 V IDDNB Max 12 N/A 16.4 A N/A 16.1 A S0.C0.P3 S0.C0.P3 CPU COF 6 TDP 3,7 71.3 W 65.0 W 71.0 W 65.0 W VID_VDD Min 9 1.050 V 1.025 V 1.050 V 1.025 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 58.1 A 41.3 A 58.1 A 41.6 A CPU COF 6 2400 MHz 2500 MHz 1800 MHz 1900 MHz TDP 3,7 64.7 W 52.8 W 64.5 W 55.4 W VID_VDD Min 9 1.050 V 0.950 V 1.050 V 0.950 V VID_VDD Max 9 1.175 V 1.175 V 1.175 V 1.175 V IDD Max 3,10 50.7 A 31.2 A 50.7 A 33.4 A CPU COF 6 1300 MHz 1300 MHz TDP 3,7 59.2 W 44.1 W 58.0 W 45.4 W VID_VDD Min 9 1.050 V 0.875 V 1.050 V 0.875 V VID_VDD Max 9 1.100 V 1.100 V 1.100 V 1.100 V IDD Max 3,10 47.3 A 23.4 A 46.7 A 24.6 A CPU COF 6 TDP 3,7 54.2 W 39.0 W 53.1 W 37.3 W VID_VDD Min 9 1.050 V 0.825 V 1.050 V 0.800 V VID_VDD Max 9 1.050 V 1.050 V 1.050 V 1.025 V 800 MHz 800 MHz IDD Max 3,10 44.0 A 18.4 A 43.4 A 17.1 A Core Power (Pre-Flush) 20 27.4 W 6.3 W 26.9 W 5.6 W Core Power (Post-Flush) 20 25.0 W 4.1 W 24.6 W 3.5 W NB Power 17 N/A 16.5 W N/A 16.3 W I/O Power S0.C1E.Pmin TDP S3 I/O Power 13 16 6.7 W 12.3 W 6.7 W 7.8 W 6.7 W 12.0 W 6.7 W 7.4 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 53 PID: 43375 Rev 3.46 - September 2010 2.3.13 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm WF pnc GM (95 W, DT, AM3) Thermal and Power Specifications HDZ560WFK2DGM21 OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 Notes Single-Plane Dual-Plane Tcase Max 1 55 oC to 70 oC Tctl Max 2 70 oC 5 oC Tambient Min P Thermal Profile S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.150 V VID_VDDNB Max 11,7 N/A 1.250 V IDDNB Max 12 N/A 15.4 A CPU COF 6 800 MHz 3300 MHz TDP 3,7 35.3 W 80.0 W VID_VDD Min 9 1.150 V 1.225 V VID_VDD Max 9 1.250 V 1.425 V IDD Max 3,10 41.9 A 46.9 A CPU COF 6 N/A 2600 MHz S0.C0.P3 TDP 3,7 N/A 64.2 W VID_VDD Min 9 N/A 1.150 V VID_VDD Max 9 N/A 1.325 V IDD Max 3,10 N/A 35.5 A CPU COF 6 N/A 2200 MHz TDP 3,7 N/A 53.9 W VID_VDD Min 9 N/A 1.075 V VID_VDD Max 9 N/A 1.250 V IDD Max 3,10 N/A 27.8 A CPU COF 6 N/A 800 MHz TDP 3,7 N/A 35.3 W VID_VDD Min 9 N/A 0.875 V VID_VDD Max 9 N/A 1.050 V IDD Max 3,10 N/A 12.3 A Core Power (Pre-Flush) 20 N/A 5.0 W Core Power (Post-Flush) 20 N/A 3.2 W NB Power 17 N/A 10.7 W I/O Power 13 N/A 6.7 W S0.C1E.Pmin TDP S3 I/O Power 16 N/A 6.6 W 13 N/A 350 mW S0.C1.Pmin The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 54 PID: 43375 Rev 3.46 - September 2010 2.3.14 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm FB pnc GM (125 W, 140 W, DT, AM3) Thermal and Power Specifications HDZ970FBK4DGM 21 OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 Specification8 Tcase Max Notes Single-Plane Dual-Plane 1 55 oC to 62 oC Tctl Max 2 70 oC 5 oC Tambient Min Thermal Profile I Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.050 V S0.C0.P0 S0.C0.P0 VID_VDDNB Max 11,7 N/A 1.150 V IDDNB Max 12 N/A 17.0 A CPU COF 6 800 MHz 3500 MHz TDP 3,7 52.1 W 125.0 W VID_VDD Min 9 1.050 V 1.225 V VID_VDD Max 9 1.050 V 1.425 V IDD Max 3,10 43.2 A 60.5 A CPU COF 6 N/A 2800 MHz TDP 3,7 N/A 94.1 W VID_VDD Min 9 N/A 1.125 V VID_VDD Max 9 N/A 1.350 V IDD Max 3,10 N/A 60.5 A CPU COF 6 N/A 2200 MHz TDP 3,7 N/A 71.6 W VID_VDD Min 9 N/A 1.050 V VID_VDD Max 9 N/A 1.250 V IDD Max 3,10 N/A 45.3 A CPU COF 6 N/A 800 MHz TDP 3,7 N/A 39.6 W VID_VDD Min 9 N/A 0.825 V VID_VDD Max 9 N/A 1.050 V IDD Max 3,10 N/A 17.2 A Core Power (Pre-Flush) 20 N/A 5.9 W Core Power (Pos t-Flush) 20 N/A 4.7 W NB Power 17 N/A 8.2 W I/O Power 13 N/A 6.7 W S0.C1E.Pmin TDP S3 I/O Power 16 N/A 8.1 W 13 350 mW 350 mW S0.C1.Pmin The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 55 PID: 43375 Rev 3.46 - September 2010 2.3.15 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm WF pnc GR (95 W, DT, AM3) Thermal and Power Specifications HDT35TWFK6DGR21 OPN Specification8 Tcase Max Tctl Max S0.C0.Px Tambient Min Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF C-State Count TDP S0.C0.Pb0 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P0 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P1 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P2 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P3 VID_VDD Min VID_VDD Max IDD Max Core Power (Pre-Flush) Core Power (Post-Flush) S0.C1.Pmin NB Power I/O Power S0.C1E.Pmin TDP I/O Power S3 State Notes Single-Plane Dual-Plane 1 55 oC to 71 oC 70 oC 2 5 oC AD 5 S0.C0.P0 S0.C0.P3 4 S0.C0.P0 S0.C0.P3 6,7 2000 MHz 2000 MHz 11,7 N/A 1.050 V 11,7 N/A 1.175 V 12 N/A 15.4 A 6 N/A 3100 MHz 23 N/A 3 22 N/A 95.0 W 9 N/A 1.225 V 9 N/A 1.425 V 3,10 N/A 80.0 A 6 800 MHz 2600 MHz 3,7 47.8 W 95.0 W 9 0.975 V 1.075 V 9 1.175 V 1.375 V 3,10 27.9 A 68.7 A 6 N/A 2000 MHz 3,7 N/A 78.3 W 9 N/A 1.050 V 9 N/A 1.350 V 3,10 N/A 54.8 A 6 N/A 1400 MHz 3,7 N/A 59.9 W 9 N/A 1.000 V 9 N/A 1.300 V 3,10 N/A 39.9 A 6 N/A 800 MHz 3,7 N/A 47.8 W 9 N/A 0.975 V 9 N/A 1.175 V 3,10 N/A 27.9 A 20 N/A 13.0 W 20 N/A 9.8 W 17 N/A 9.7 W 13 N/A 6.1 W 16 N/A 12.1 W 13 N/A 300 mW HDT55TWFK6DGR21 Single-Plane Dual-Plane 55 oC to 71 oC 70 oC 5 oC AD S0.C0.P0 S0.C0.P3 S0.C0.P0 S0.C0.P3 2000 MHz 2000 MHz N/A 1.050 V N/A 1.175 V N/A 14.9 A N/A 3300 MHz N/A 3 N/A 95.0 W N/A 1.225 V N/A 1.425 V N/A 80.0 A 800 MHz 2800 MHz 46.3 W 95.0 W 0.975 V 1.075 V 1.175 V 1.375 V 26.9 A 70.0 A N/A 2200 MHz N/A 78.4 W N/A 1.050 V N/A 1.350 V N/A 56.6 A N/A 1500 MHz N/A 58.5 W N/A 1.000 V N/A 1.300 V N/A 40.2 A N/A 800 MHz N/A 46.3 W N/A 0.975 V N/A 1.175 V N/A 26.9 A N/A 12.4 W N/A 9.2 W N/A 9.4 W N/A 6.1 W N/A 11.4 W N/A 300 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 56 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HDT45TWFK6DGR21 OPN Specification8 Tcase Max Tctl Max S0.C0.Px Tambient Min Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF C-State Count TDP S0.C0.Pb0 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P0 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P1 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P2 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P3 VID_VDD Min VID_VDD Max IDD Max Core Power (Pre-Flush) Core Power (Post-Flush) S0.C1.Pmin NB Power I/O Power S0.C1E.Pmin TDP I/O Power S3 State Notes Single-Plane Dual-Plane 55 oC to 71 oC 1 2 70 oC 5 oC AD 5 S0.C0.P0 S0.C0.P3 4 S0.C0.P0 S0.C0.P3 6,7 2000 MHz 2000 MHz 11,7 N/A 1.050 V 11,7 N/A 1.175 V 12 N/A 15.2 A 6 N/A 3200 MHz 23 N/A 3 22 N/A 95.0 W 9 N/A 1.225 V 9 N/A 1.425 V 3,10 N/A 80.0 A 6 800 MHz 2700 MHz 3,7 47.1 W 95.0 W 9 0.975 V 1.075 V 9 1.175 V 1.375 V 3,10 27.4 A 69.5 A 6 N/A 2000 MHz 3,7 N/A 76.4 W 9 N/A 1.050 V 9 N/A 1.350 V 3,10 N/A 54.0 A 6 N/A 1400 MHz 3,7 N/A 58.3 W 9 N/A 1.000 V 9 N/A 1.300 V 3,10 N/A 39.3 A 6 N/A 800 MHz 3,7 N/A 47.1 W 9 N/A 0.975 V 9 N/A 1.175 V 3,10 N/A 27.4 A 20 N/A 12.7 W 20 N/A 9.5 W 17 N/A 9.6 W 13 N/A 6.1 W 16 N/A 11.8 W 13 N/A 300 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 57 PID: 43375 Rev 3.46 - September 2010 2.3.16 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HD mmmm FB pnc GR (125 W, DT, AM3) Thermal and Power Specifications HDT55TFBK6DGR21 OPN Specification8 Tcase Max Tctl Max S0.C0.Px Tambient Min Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF C-State Count TDP S0.C0.Pb0 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P0 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P1 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P2 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P3 VID_VDD Min VID_VDD Max IDD Max Core Power (Pre-Flush) Core Power (Post-Flush) S0.C1.Pmin NB Power I/O Power S0.C1E.Pmin TDP I/O Power S3 State Notes Single-Plane Dual-Plane 1 55 oC to 62 oC 70 oC 2 5 oC AE 5 S0.C0.P0 S0.C0.P3 4 S0.C0.P0 S0.C0.P3 6,7 2000 MHz 2000 MHz 11,7 N/A 1.050 V 11,7 N/A 1.175 V 12 N/A 17.0 A 6 N/A 3300 MHz 23 N/A 3 22 N/A 125.0 W 9 N/A 1.250 V 9 N/A 1.475 V 3,10 N/A 95.0 A 6 800 MHz 2800 MHz 3,7 55.4 W 125.0 W 9 1.000 V 1.150 V 9 1.225 V 1.475 V 3,10 32.9 A 89.7 A 6 N/A 2200 MHz 3,7 N/A 101.0 W 9 N/A 1.100 V 9 N/A 1.400 V 3,10 N/A 69.5 A 6 N/A 1500 MHz 3,7 N/A 77.3 W 9 N/A 1.050 V 9 N/A 1.325 V 3,10 N/A 50.9 A 6 N/A 800 MHz 3,7 N/A 55.4 W 9 N/A 1.000 V 9 N/A 1.225 V 3,10 N/A 32.9 A 20 N/A 16.4 W 20 N/A 12.9 W 17 N/A 10.8 W 13 N/A 6.1 W 16 N/A 15.8 W 13 N/A 300 mW HDT90ZFBK6DGR21 Single-Plane Dual-Plane 55 oC to 62 oC 70 oC 5 oC AE S0.C0.P0 S0.C0.P3 S0.C0.P0 S0.C0.P3 2000 MHz 2000 MHz N/A 1.050 V N/A 1.175 V N/A 16.2 A N/A 3600 MHz N/A 3 N/A 125.0 W N/A 1.250 V N/A 1.475 V N/A 95.0 A 800 MHz 3200 MHz 53.1 W 125.0 W 1.000 V 1.150 V 1.225 V 1.475 V 31.4 A 92.8 A N/A 2400 MHz N/A 98.5 W N/A 1.100 V N/A 1.400 V N/A 69.9 A N/A 1600 MHz N/A 75.7 W N/A 1.050 V N/A 1.325 V N/A 50.4 A N/A 800 MHz N/A 53.1 W N/A 1.000 V N/A 1.225 V N/A 31.4 A N/A 15.4 W N/A 12.0 W N/A 10.3 W N/A 6.1 W N/A 14.8 W N/A 300 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 58 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet HDT75TFBK6DGR21 OPN State Specification8 Tcase Max Tctl Max S0.C0.Px Tambient Min Thermal Profile Startup P-State HTC P-State NB COF VID_VDDNB Min S0.Cx.Px VID_VDDNB Max IDDNB Max CPU COF C-State Count TDP S0.C0.Pb0 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P0 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P1 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P2 VID_VDD Min VID_VDD Max IDD Max CPU COF TDP S0.C0.P3 VID_VDD Min VID_VDD Max IDD Max Core Power (Pre-Flush) Core Power (Post-Flush) S0.C1.Pmin NB Power I/O Power S0.C1E.Pmin TDP I/O Power S3 Notes Single-Plane Dual-Plane 1 55 oC to 62 oC 2 70 oC 5 oC AE 5 S0.C0.P0 S0.C0.P3 4 S0.C0.P0 S0.C0.P3 6,7 2000 MHz 2000 MHz 11,7 N/A 1.050 V 11,7 N/A 1.175 V 12 N/A 16.5 A 6 N/A 3500 MHz 23 N/A 3 22 N/A 125.0 W 9 N/A 1.250 V 9 N/A 1.475 V 3,10 N/A 95.0 A 6 800 MHz 3000 MHz 22 53.8 W 125.0 W 9 1.000 V 1.150 V 9 1.225 V 1.475 V 3,10 31.9 A 91.5 A 6 N/A 2300 MHz 22 N/A 99.5 W 9 N/A 1.100 V 9 N/A 1.400 V 3,10 N/A 69.5 A 6 N/A 1600 MHz 22 N/A 77.0 W 9 N/A 1.050 V 9 N/A 1.325 V 3,10 N/A 51.2 A 6 N/A 800 MHz 22 N/A 53.8 W 9 N/A 1.000 V 9 N/A 1.225 V 3,10 N/A 31.9 A 20 N/A 15.7 W 20 N/A 12.1 W 17 N/A 10.3 W 13 N/A 6.1 W 16 N/A 14.4 W 13 N/A 300 mW The notes for this table are on page 60 and page 61. AMD Phenom™ Processor 59 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AMD Phenom™ Processor Thermal and Power Specification Table Notes: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. Tcase Max is the maximum case temperature specification which is a physical value in degrees Celsius. Tcase Max can be any valid Tcase Max value in the range specified for the corresponding OPN. Tctl Max (maximum control temperature) is a non-physical temperature on an arbitrary scale that can be used for system thermal management policies. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116. The processor thermal solution should be designed to accommodate thermal design power (TDP) at Tcase Max. TDP is measured under the conditions of all cores operating at CPU COF, Tcase Max, and VDD at the voltage requested by the processor. TDP includes all power dissipated on-die from VDD, VDDNB, VDDIO, VLDT, VTT, and VDDA. TDP is not the maximum power of the processor. P-state limit when HTC is active. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116 for more information. Hardware transitions the part to startup P-state at cold boot. During initialization, the startup NB COF and VID_VDDNB values may differ from those of the startup P-state. Please see the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116 for detailed power sequencing information. Frequency reported to the OS is rounded to the nearest 100-MHz boundary. During initialization, the startup NB COF and VID_VDDNB values may differ from those of the startup P-state. Please see the BIOS and Kernel Developer’s Guide (BKDG) For AMD Family 10h Processors, order# 31116 for specific power sequencing information. Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and equivalent Tcase conditions for all cores. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order #31116, for details on P-state operation for multi-core processors. Variable voltage, any valid voltage between VID_VDD Min and VID_VDD Max is allowed. TDP IDD conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDD Max specification. Single-plane platforms have VID_VDD and VID_VDDNB tied together, and use the VID_VDD specification. TDP IDDNB conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDDNB Max specification. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only. Assumes VDDIO = 1.8 V and VTT = VDDIO / 2. Refer to erratum 308 in the Revision Guide for AMD Family 10h Processors, order# 41322 for the appropriate clock divisor setting. Assumes 50°C, Min P-state VID_VDD, core clock divider set to 128, and L2 and data cache scrubbing disabled. Refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116 for recommended settings. Assumes 35°C, min P-state VID_VDD, core clock divider set to 16, HyperTransport™ link s disconnected, memory in self-refresh mode, and DDR2 SDRAM interface tristated. Recommended settings in the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116, provide improved power values. Thermal Design Power dissipated by the processor at min P-state VID_VDDNB. Thermal Design Power dissipated by the processor at min P-state VID_VDD. This product is recommended for dual-plane platforms only. Core Power (Pre-Flush) and (Post-Flush) refers to the Cache Flush On Halt feature described in the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116. Core Power pre-flush and post-flush values are based on the recommended BKDG settings. Actual C1 idle core power varies with system usage according to the following equation: C1 idle Core Power = F3xDC[CashFlushOnHaltTmr]/OS timer tick interval * Core Power (Pre-Flush) + (1 - F3xDC[CachFlushOnHaltTmr]/OS timer tick interval * Core Power (Post-Flush)) The default Microsoft ® Windows Vista ® timer tick interval is 15.6 ms. This interval varies between operating systems and within an operating system depending on usage. Valid for dual-plane operation only. AMD Phenom™ Processor 60 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AMD Phenom™ Processor Thermal and Power Specification Table Notes (Continued): 22. The processor thermal solution should be designed to accommodate thermal design power (TDP) at Tcase Max. TDP in this state is measured at Tcase Max and VDD at the voltage requested by the processor with the number of cores in the C1 state specified by C-State Count. TDP includes all power dissipated on-die from VDD, VDDNB, VDDIO, VLDT, VTT, and VDDA. Due to increased power density in the state, the processor has an increased probability of hardware thermal control (HTC) activation compared to S0.C0.P1 at the same ambient temperature. TDP is not the maximum power of the processor. 23. C-State Count indicates the minimum number of cores in the C1 state required for the remaining cores to enter this P-state. Refer to F4x164[CstateCnt] in the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116, for more details about the entry requirements into this P-state. AMD Phenom™ Processor 61 PID: 43375 Rev 3.46 - September 2010 3 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AMD Athlon™ Processor The following sections contain the OPN description and thermal and power specifications for the AMD Athlon™ Processor. Each column in the thermal and power tables represents a specific Ordering Part Number (OPN). Section 3.1 provides an example of the OPN structure for this processor family. 3.1 AMD Athlon™ Processor Ordering Part Number Description b s mmmm rr p n c dd Part Definition Cache Size Number of Cores Package Roadmap Model Segment Brand Figure 3. AMD Athlon™ Processor Ordering Part Number Diagram A D 6500 WC J 2 B GH Part Definition: GH (see Table 9) Cache Size: B (see Table 10) Number of Cores: 2 (see Table 11) Package: J (see Table 12) Roadmap: WC (see Table 13) Model Number: 6500 (see Table 14) Segment: D = Desktop Brand: A = AMD Athlon™ Processor Figure 4. AMD Athlon™ Processor Ordering Part Number Example AMD Athlon™ Processor 62 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 9. AMD Athlon™ Processor Part Definition Options Part Definition Revision CPUID 8000_0001h EAX [31:0] (CPUID) GQ Rev C2 00100F62h GM Rev C3 00100F43h, 00100F53h, 00100F63h Table 10. AMD Athlon™ Processor Cache Size Options OPN Character L2 Cache Size L3 Cache Size 2 512 KB 0 KB 3 1024 KB 0 KB Table 11. AMD Athlon™ Processor Number of Cores OPN Character Number of Cores 2 2 3 3 4 4 Table 12. AMD Athlon™ Processor Package Options OPN Character Package K AM3 Table 13. AMD Athlon™ Processor Roadmap Options OPN Character Max TDP Socket Infrastructure IDD Max (VDD) IDD Max (NB) HS Class HD 45 W AM3 45 A 20 A HS 44 OC 65 W AM3 60 A 20 A HS 55 WF 95 W AM3 80 A 20 A HS 65 SC 25 W AM3 20 A 20 A HS 27 AMD Athlon™ Processor 63 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 14. AMD Athlon™ Processor Model Number Options Model Number Core Single-Plane Frequency NB Frequency Dual-Plane NB Number Frequency of Cores Max DDR Speed Max HT Link Speed 270U 2000 MHz 1800 MHz 1800 MHz 2 1333 MT/s 3600 MT/s 610E 2400 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s 415E 2500 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s 615E 2500 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s 420E 2600 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s X220 2800 MHz 1600 MHz 2000 MHz 2 1066 MT/s 4000 MT/s 245E 2900 MHz 1600 MHz 2000 MHz 2 1333 MT/s 4000 MT/s X250 3000 MHz 1600 MHz 2000 MHz 2 1066 MT/s 4000 MT/s X640 3000 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s X645 3100 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s 250E 3000 MHz 1600 MHz 2000 MHz 2 1333 MT/s 4000 MT/s X445 3100 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s X260 3200 MHz 1600 MHz 2000 MHz 2 1333 MT/s 4000 MT/s X450 3200 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s X265 3300 MHz 1600 MHz 2000 MHz 2 1333 MT/s 4000 MT/s AMD Athlon™ Processor 64 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 15. AMD Athlon™ Processor Thermal Profiles Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W N HS55 0.48°C/W 42°C 0.400°C/W 48°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 56.0°C 58.0°C 60.0°C 62.0°C 64.0°C 66.0°C 68.0°C 70.0°C 72.0°C 74.0°C Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W S HS44 0.66°C/W 42°C 0.533°C/W 48°C Tcase Max 55.0°C 55.0°C 55.0°C 56.0°C 58.7°C 61.3°C 64.0°C 66.7°C 69.3°C 72.0°C Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between partspecific power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications are met. AMD Athlon™ Processor 65 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 15: AMD Athlon™ Processor Thermal Profiles (Continued) Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W W HS27 1.56°C/W 42°C 1.320°C/W 48°C Tcase Max 55.0°C 55.0°C 61.2°C 67.8°C 74.4°C 81.0°C Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W 85.0 W 90.0 W 95.0 W Z HS65 0.34°C/W 42°C 0.284°C/W 48°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.0°C 55.1°C 56.5°C 57.9°C 59.4°C 60.8°C 62.2°C 63.6°C 65.0°C 66.5°C 67.9°C 69.3°C 70.7°C 72.1°C 73.6°C 75.0°C Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between partspecific power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications are met. AMD Athlon™ Processor 66 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 15: AMD Athlon™ Processor Thermal Profiles (Continued) Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W 50.0 W 55.0 W 60.0 W 65.0 W 70.0 W 75.0 W 80.0 W 85.0 W 90.0 W 95.0 W AA HS65 0.30°C/W 42°C 0.242°C/W 48°C Tcase Max 55.0 °C 55.0 °C 55.0 °C 55.0 °C 55.0 °C 55.0 °C 55.3 °C 56.5 °C 57.7 °C 58.9 °C 60.1 °C 61.3 °C 62.5 °C 63.7 °C 64.9 °C 66.2 °C 67.4 °C 68.6 °C 69.8 °C 71.0 °C Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 40.0 W 45.0 W AB HS44 0.65°C/W 42°C 0.533°C/W 48°C Tcase Max 55.0 °C 55.0 °C 55.0 °C 56.0 °C 58.7 °C 61.3 °C 64.0 °C 66.7 °C 69.3 °C 72.0 °C Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between partspecific power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications are met. AMD Athlon™ Processor 67 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet 3.2 AMD Athlon™ Processor Thermal and Power Table Guide The thermal and power table guide shown in Table 16 maps SOPNs and the properties associated with their defined characters to the proper thermal and power table subsections and page numbers. This table is designed to be used as a quick reference for finding the appropriate subsection for the thermal and power tables corresponding to an SOPN. Table 16. AMD Athlon™ Processor Thermal and Power Table Guide Thermal/Power Tables SOPN Power Revision AD mmmm OC pnc GQ 65 W C2 Section 3.3.1 on page 70 AD mmmm WF pnc GM 95 W C3 Section 3.3.2 on page 71 AD mmmm OC pnc GM 65 W C3 Section 3.3.3 on page 73 AD mmmm HD pnc GM 45 W C3 Section 3.3.4 on page 76 AD mmmm SC pnc GM C3 Section 3.3.5 on page 80 25 W AMD Athlon™ Processor 68 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet 3.3 AMD Athlon™ Processor Thermal and Power Specifications The thermal and power specification tables contain the thermal and power requirements for each OPN. This includes the information necessary for thermal management (for example, heat sink requirements, temperature assumptions) and power delivery (for example, voltage, current, and power dissipation for each P-state). Refer to the AMD Family 10h Processor Electrical Data Sheet, order# 40014, for all other electrical specifications for the processor. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for power management BIOS requirements. Section 3.1 on page 62 provides an example of the OPN structure for processors documented in this chapter and Table 16 on page 68 provides a guide to OPN organization in the following subsections. Refer to Section 1.2 on page 9 and Section 1.3 on page 10 for numbering conventions and terminology definitions used in these tables. AMD Athlon™ Processor 69 PID: 43375 Rev 3.46 - September 2010 3.3.1 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AD mmmm OC pnc GQ (65 W, DT, AM3) Thermal and Power Specifications ADX250OCK23GQ19 OPN State S0.C0.Px Specification8 Tcase Max Notes Single-Plane Dual-Plane 1 55 oC to 74 oC Tctl Max 2 5 oC Tambient Min Thermal Profile N Startup P-State S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin 70 oC S0.C0.P3 5 S0.C0.P3 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.150 V VID_VDDNB Max 11,7 N/A 1.200 V IDDNB Max 12 N/A 3.7 A CPU COF 6 TDP 3,7 61.8 W 60.2 W VID_VDD Min 9 1.200 V 1.200 V VID_VDD Max 9 1.425 V 1.425 V IDD Max 3,10 45.0 A 41.6 A CPU COF 6 3000 MHz 2300 MHz TDP 3,7 55.4 W 51.2 W VID_VDD Min 9 1.125 V 1.100 V VID_VDD Max 9 1.325 V 1.325 V IDD Max 3,10 40.7 A 30.2 A CPU COF 6 1800 MHz TDP 3,7 51.7 W 37.2 W VID_VDD Min 9 1.125 V 1.000 V VID_VDD Max 9 1.225 V 1.225 V IDD Max 3,10 37.7 A 21.8 A CPU COF 6 TDP 3,7 44.3 W 23.1 W VID_VDD Min 9 1.125 V 0.850 V VID_VDD Max 9 1.125 V 1.075 V 800 MHz IDD Max 3,10 31.5 A 11.8 A Core Power (Pre-Flush) 20 18.8 W 3.7 W Core Power (Post-Flush) 20 17.6 W 2.9 W NB Power 17 N/A 1.7 W I/O Power 13 6.5 W 6.5 W S0.C1E.Pmin TDP S3 I/O Power 16 13.4 W 3.5 W 13 350 mW 350 mW The notes for this table are on page 81. AMD Athlon™ Processor 70 PID: 43375 Rev 3.46 - September 2010 3.3.2 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AD mmmm WF pnc GM (95 W, DT, AM3) Thermal and Power Specifications ADX640WFK42GM19 OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin Specification8 Tcase Max Notes Single-Plane Dual-Plane 1 55 oC to 71 oC Tctl Max 2 ADX645WFK42GM19 Single-Plane Dual-Plane 55 oC to 71 oC 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile AA AA S0.C0.P3 S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.125 V N/A 1.125 V VID_VDDNB Max 11,7 N/A 1.175 V N/A 1.175 V IDDNB Max 12 N/A 12.8 A N/A 12.4 A CPU COF 6 TDP 3,7 99.4 W 95.0 W 99.0 W 95.0 W VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V VID_VDD Max 9 1.400 V 1.400 V 1.400 V 1.400 V IDD Max 3,10 75.9 A 70.1 A 75.7 A 63.7 A CPU COF 6 S0.C0.P3 S0.C0.P3 3000 MHz 3100 MHz 2400 MHz 2300 MHz TDP 3,7 70.8 W 68.5 W 70.9 W 68.6 W VID_VDD Min 9 1.125 V 1.100 V 1.125 V 1.100 V VID_VDD Max 9 1.300 V 1.300 V 1.300 V 1.300 V IDD Max 3,10 57.0 A 49.2 A 57.1 A 44.9 A CPU COF 6 1900 MHz 1800 MHz TDP 3,7 64.1 W 51.6 W 64.2 W 51.8 W VID_VDD Min 9 1.125 V 1.000 V 1.125 V 1.000 V VID_VDD Max 9 1.200 V 1.200 V 1.200 V 1.200 V IDD Max 3,10 51.0 A 34.8 A 51.1 A 31.9 A CPU COF 6 TDP 3,7 50.6 W 33.4 W 49.3 W 32.7 W VID_VDD Min 9 1.125 V 0.850 V 1.125 V 0.850 V VID_VDD Max 9 1.150 V 1.050 V 1.150 V 1.050 V 800 MHz 800 MHz IDD Max 3,10 39.0 A 17.2 A 37.9 A 14.8 A Core Power (Pre-Flush) 20 20.1 W 5.5 W 19.4 W 4.5 W Core Power (Post-Flush) 20 17.6 W 3.9 W 16.9 W 3.0 W NB Power 17 N/A 9.4 W N/A 2.4 W I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W S0.C1E.Pmin TDP S3 I/O Power 16 10.9 W 5.1 W 9.4 W 4.5 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 81. AMD Athlon™ Processor 71 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet ADX445WFK32GM19 OPN Specification8 State S0.C0.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin Dual-Plane Single-Plane Dual-Plane Tcase Max 1 55 oC to 75 oC 55 oC to 75 oC Tctl Max 2 70 oC 70 oC o 5 oC 5 C Tambient Min Z Z S0.C0.P3 S0.C0.P3 Thermal Profile Startup P-State S0.Cx.Px Notes Single-Plane ADX450WFK32GM19 5 S0.C0.P3 S0.C0.P3 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.125 V N/A 1.125 V VID_VDDNB Max 11,7 N/A 1.200 V N/A 1.175 V IDDNB Max 12 N/A 16.4 A N/A 14.9 A 3200 MHz 3100 MHz CPU COF 6 TDP 3,7 103.4 W 95.0 W VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V VID_VDD Max 9 1.500 V 1.500 V 1.500 V 1.500 V IDD Max 3,10 77.1 A 59.3 A 77.0 A 59.6 A 103.0 W 2400 MHz 95.0 W 2500 MHz CPU COF 6 TDP 3,7 75.4 W 70.7 W VID_VDD Min 9 1.125 V 1.100 V 1.125 V 1.100 V VID_VDD Max 9 1.400 V 1.400 V 1.400 V 1.400 V IDD Max 3,10 59.7 A 41.9 A 59.4 A 42.3 A CPU COF 6 73.5 W 1900 MHz 70.7 W 2000 MHz TDP 3,7 70.0 W 55.1 W 69.1 W 57.3 W VID_VDD Min 9 1.125 V 1.000 V 1.125 V 1.025 V VID_VDD Max 9 1.300 V 1.300 V 1.325 V 1.325 V IDD Max 3,10 55.4 A 30.0 A 55.4 A 32.1 A CPU COF 6 800 MHz 800 MHz TDP 3,7 59.3 W 38.1 W 58.5 W 37.4 W VID_VDD Min 9 1.125 V 0.850 V 1.125 V 0.850 V VID_VDD Max 9 1.175 V 1.150 V 1.150 V 1.150 V IDD Max 3,10 46.8 A 15.4 A 46.0 A 15.2 A Core Power (Pre-Flush) 20 26.9 W 5.2 W 26.5 W 5.1 W Core Power (Post-Flush) 20 24.2 W 3.7 W 23.7 W 3.7 W N/A 11.8 W N/A 11.6 W NB Power 17 I/O Power S0.C1E.Pmin TDP S3 I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W 16 14.9 W 7.6 W 14.6 W 7.4 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 81. AMD Athlon™ Processor 72 PID: 43375 Rev 3.46 - September 2010 3.3.3 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AD mmmm OC pnc GM (65 W, DT, AM3) Thermal and Power Specifications ADX260OCK23GM19 OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin Notes Single-Plane Dual-Plane Tcase Max 1 55 oC to 74 oC Tctl Max 2 70 oC 5 oC Tambient Min N Thermal Profile S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.150 V VID_VDDNB Max 11,7 N/A 1.175 V IDDNB Max 12 N/A 4.0 A S0.C0.P3 3200 MHz CPU COF 6 TDP 3,7 61.8 W 60.2 W VID_VDD Min 9 1.200 V 1.200 V VID_VDD Max 9 1.400 V 1.400 V IDD Max 3,10 44.9 A 41.1 A CPU COF 6 2500 MHz TDP 3,7 45.0 W 43.5 W VID_VDD Min 9 1.100 V 1.100 V VID_VDD Max 9 1.300 V 1.300 V IDD Max 3,10 34.2 A 29.5 A CPU COF 6 1900 MHz TDP 3,7 41.1 W 31.9 W VID_VDD Min 9 1.100 V 1.000 V VID_VDD Max 9 1.200 V 1.200 V IDD Max 3,10 30.8 A 20.8 A CPU COF 6 TDP 3,7 34.0 W 19.3 W VID_VDD Min 9 1.100 V 0.825 V VID_VDD Max 9 1.125 V 1.025 V IDD Max 3,10 24.5 A 9.9 A Core Power (Pre-Flush) 20 15.1 W 3.4 W Core Power (Post-Flush) 20 13.2 W 2.5 W 800 MHz NB Power 17 N/A 2.1 W I/O Power 13 6.5 W 6.5 W S0.C1E.Pmin TDP S3 I/O Power 16 9.4 W 4.4 W 13 350 mW 350 mW The notes for this table are on page 81. AMD Athlon™ Processor 73 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet ADX265OCK23GM19 OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin Notes Single-Plane Dual-Plane Tcase Max 1 55 oC to 74 oC Tctl Max 2 70 oC 5 oC Tambient Min N Thermal Profile S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1800 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.175 V VID_VDDNB Max 11,7 N/A 1.175 V IDDNB Max 12 N/A 4.2 A S0.C0.P3 CPU COF 6 TDP 3,7 62.1 W 60.2 W VID_VDD Min 9 1.200 V 1.200 V VID_VDD Max 9 1.500 V 1.500 V IDD Max 3,10 44.9 A 40.9 A CPU COF 6 3300 MHz 2600 MHz TDP 3,7 48.4 W 43.6 W VID_VDD Min 9 1.150 V 1.100 V VID_VDD Max 9 1.400 V 1.400 V IDD Max 3,10 36.4 A 29.5 A CPU COF 6 1900 MHz TDP 3,7 43.7 W 31.5 W VID_VDD Min 9 1.150 V 1.000 V VID_VDD Max 9 1.300 V 1.300 V IDD Max 3,10 32.3 A 20.4 A CPU COF 6 TDP 3,7 36.7 W 19.1 W VID_VDD Min 9 1.150 V 0.825 V VID_VDD Max 9 1.150 V 1.125 V IDD Max 3,10 26.3 A 9.6 A Core Power (Pre-Flush) 20 19.7 W 3.8 W Core Power (Post-Flush) 20 18.1 W 3.0 W 800 MHz NB Power 17 N/A 2.1 W I/O Power 13 6.5 W 6.5 W S0.C1E.Pmin TDP S3 I/O Power 16 12.1 W 4.3 W 13 350 mW 350 mW The notes for this table are on page 81. AMD Athlon™ Processor 74 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet ADX220OCK22GM19 OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin Notes Single-Plane Dual-Plane Tcase Max 1 55 oC to 74 oC Tctl Max 2 70 oC 5 oC Tambient Min N Thermal Profile S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.125 V VID_VDDNB Max 11,7 N/A 1.200 V IDDNB Max 12 N/A 17.4 A S0.C0.P3 2800 MHz CPU COF 6 TDP 3,7 69.7 W 65.0 W VID_VDD Min 9 1.100 V 1.050 V VID_VDD Max 9 1.400 V 1.400 V IDD Max 3,10 56.9 A 43.6 A CPU COF 6 2100 MHz TDP 3,7 64.8 W 55.5 W VID_VDD Min 9 1.100 V 1.000 V VID_VDD Max 9 1.250 V 1.250 V IDD Max 3,10 52.9 A 35.0 A CPU COF 6 1600 MHz TDP 3,7 61.6 W 50.6 W VID_VDD Min 9 1.100 V 0.975 V VID_VDD Max 9 1.150 V 1.150 V IDD Max 3,10 49.9 A 28.4 A CPU COF 6 TDP 3,7 56.5 W 41.7 W VID_VDD Min 9 1.100 V 0.900 V VID_VDD Max 9 1.100 V 0.950 V IDD Max 3,10 45.3 A 18.7 A Core Power (Pre-Flush) 20 27.2 W 7.8 W Core Power (Post-Flush) 20 25.1 W 6.4 W 800 MHz NB Power 17 N/A 12.7 W I/O Power 13 6.7 W 6.7 W S0.C1E.Pmin TDP S3 I/O Power 16 14.9 W 8.7 W 13 350 mW 350 mW The notes for this table are on page 81. AMD Athlon™ Processor 75 PID: 43375 Rev 3.46 - September 2010 3.3.4 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AD mmmm HD pnc GM (45 W, DT, AM3) Thermal and Power Specifications AD415EHDK32GM19 OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin Specification8 Tcase Max Notes Single-Plane Dual-Plane 1 55 oC to 72 oC Tctl Max 2 AD420EHDK32GM19 Single-Plane Dual-Plane 55 oC to 72 oC 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile AB AB S0.C0.P3 S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.100 V N/A 1.100 V VID_VDDNB Max 11,7 N/A 1.100 V N/A 1.100 V IDDNB Max 12 N/A 3.9 A N/A 3.1 A CPU COF 6 TDP 3,7 50.0 W 45.0 W 45.4 W 45.0 W VID_VDD Min 9 1.050 V 1.000 V 1.050 V 1.000 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 41.2 A 34.4 A 35.7 A 33.3 A S0.C0.P3 S0.C0.P3 2600 MHz 2500 MHz 2200 MHz CPU COF 6 TDP 3,7 46.7 W 35.5 W 40.9 W 35.6 W VID_VDD Min 9 1.050 V 0.925 V 1.050 V 0.925 V VID_VDD Max 9 1.175 V 1.175 V 1.175 V 1.175 V IDD Max 3,10 38.1 A 26.7 A 32.6 A 25.9 A CPU COF 6 2100 MHz 1900 MHz 1800 MHz TDP 3,7 44.2 W 28.8 W 38.5 W 29.0 W VID_VDD Min 9 1.050 V 0.850 V 1.050 V 0.850 V VID_VDD Max 9 1.100 V 1.100 V 1.100 V 1.100 V IDD Max 3,10 35.8 A 21.0 A 30.3 A 20.5 A CPU COF 6 800 MHz 800 MHz TDP 3,7 36.1 W 20.5 W 29.5 W 19.3 W VID_VDD Min 9 1.050 V 0.775 V 1.050 V 0.775 V VID_VDD Max 9 1.050 V 1.025 V 1.050 V 1.025 V IDD Max 3,10 28.0 A 12.3 A 21.7 A 11.2 A Core Power (Pre-Flush) 20 13.6 W 3.7 W 10.4 W 3.6 W Core Power (Post-Flush) 20 11.5 W 2.5 W 8.2 W 2.2 W NB Power 17 N/A 2.9 W N/A 2.2 W I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W S0.C1E.Pmin TDP S3 I/O Power 16 7.3 W 2.6 W 4.9 W 2.1 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 81. AMD Athlon™ Processor 76 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AD610EHDK42GM19 OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin Specification8 Tcase Max Notes Single-Plane Dual-Plane 1 55 oC to 72 oC Tctl Max 2 AD615EHDK42GM19 Single-Plane Dual-Plane 55 oC to 72 oC 70 oC 70 oC Tambient Min 5 oC 5 oC Thermal Profile AB AB S0.C0.P3 S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.100 V N/A 1.100 V VID_VDDNB Max 11,7 N/A 1.100 V N/A 1.100 V IDDNB Max 12 N/A 3.2 A N/A 2.5 A CPU COF 6 TDP 3,7 49.6 W 45.0 W 45.0 W 45.0 W VID_VDD Min 9 1.050 V 1.000 V 1.050 V 1.000 V VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V IDD Max 3,10 40.9 A 35.1 A 35.8 A 33.9 A S0.C0.P3 S0.C0.P3 2500 MHz 2400 MHz 2100 MHz CPU COF 6 TDP 3,7 44.2 W 34.2 W 40.0 W 35.2 W VID_VDD Min 9 1.050 V 0.925 V 1.050 V 0.925 V VID_VDD Max 9 1.175 V 1.175 V 1.175 V 1.175 V IDD Max 3,10 35.7 A 26.1 A 31.7 A 26.2 A CPU COF 6 1900 MHz 1800 MHz 1700 MHz TDP 3,7 42.0 W 28.2 W 36.7 W 28.4 W VID_VDD Min 9 1.050 V 0.850 V 1.050 V 0.850 V VID_VDD Max 9 1.100 V 1.100 V 1.100 V 1.100 V IDD Max 3,10 33.6 A 21.1 A 28.6 A 20.6 A CPU COF 6 800 MHz 800 MHz TDP 3,7 32.2 W 19.3 W 25.9 W 17.9 W VID_VDD Min 9 1.050 V 0.775 V 1.050 V 0.775 V VID_VDD Max 9 1.050 V 1.025 V 1.050 V 1.025 V IDD Max 3,10 24.3 A 11.7 A 18.3 A 10.3 A Core Power (Pre-Flush) 20 10.7 W 3.0 W 7.5 W 2.8 W Core Power (Post-Flush) 20 8.4 W 1.8 W 5.2 W 1.3 W NB Power 17 N/A 2.4 W N/A 1.8 W I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W S0.C1E.Pmin TDP S3 I/O Power 16 5.2 W 1.9 W 2.9 W 1.3 W 13 350 mW 350 mW 350 mW 350 mW The notes for this table are on page 81. AMD Athlon™ Processor 77 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AD245EHDK23GM19 OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin Notes Single-Plane Dual-Plane Tcase Max 1 55 oC to 72 oC Tctl Max 2 70 oC 5 oC Tambient Min Thermal Profile S S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.125 V VID_VDDNB Max 11,7 N/A 1.125 V IDDNB Max 12 N/A 3.1 A S0.C0.P3 CPU COF 6 TDP 3,7 46.0 W 45.0 W VID_VDD Min 9 1.150 V 1.150 V VID_VDD Max 9 1.400 V 1.400 V IDD Max 3,10 33.3 A 30.4 A CPU COF 6 2900 MHz 2100 MHz TDP 3,7 34.9 W 31.9 W VID_VDD Min 9 1.100 V 1.050 V VID_VDD Max 9 1.250 V 1.250 V IDD Max 3,10 25.8 A 20.8 A CPU COF 6 1500 MHz TDP 3,7 31.2 W 24.6 W VID_VDD Min 9 1.100 V 0.975 V VID_VDD Max 9 1.150 V 1.150 V IDD Max 3,10 22.5 A 15.0 A CPU COF 6 TDP 3,7 26.9 W 18.0 W VID_VDD Min 9 1.100 V 0.875 V VID_VDD Max 9 1.100 V 1.000 V IDD Max 3,10 16.9 A 8.4 A Core Power (Pre-Flush) 20 10.7 W 3.2 W 9.0 W 2.3 W Core Power (Post-Flush) 20 800 MHz NB Power 17 N/A 1.7 W I/O Power 13 6.5 W 6.5 W S0.C1E.Pmin TDP S3 I/O Power 16 6.5 W 3.7 W 13 350 mW 350 mW The notes for this table are on page 81. AMD Athlon™ Processor 78 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AD250EHDK23GM 19 OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin Specification8 Tcase Max Notes Single-Plane Dual-Plane 1 55 oC to 72 oC Tctl Max 2 70 oC 5 oC Tambient Min S Thermal Profile Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.125 V VID_VDDNB Max 11,7 N/A 1.125 V IDDNB Max 12 N/A 3.1 A CPU COF 6 TDP 3,7 45.9 W 45.0 W VID_VDD Min 9 1.150 V 1.150 V VID_VDD Max 9 1.400 V 1.400 V IDD Max 3,10 33.3 A 30.5 A CPU COF 6 TDP 3,7 34.9 W 32.0 W VID_VDD Min 9 1.100 V 1.050 V VID_VDD Max 9 1.250 V 1.250 V IDD Max 3,10 25.9 A 20.9 A CPU COF 6 S0.C0.P3 S0.C0.P3 3000 MHz 2200 MHz 1700 MHz TDP 3,7 31.9 W 25.5 W VID_VDD Min 9 1.100 V 0.975 V VID_VDD Max 9 1.150 V 1.150 V IDD Max 3,10 23.1 A 15.6 A CPU COF 6 800 MHz TDP 3,7 26.4 W 17.1 W VID_VDD Min 9 1.100 V 0.850 V VID_VDD Max 9 1.100 V 0.975 V IDD Max 3,10 16.4 A 7.7 A Core Power (Pre-Flush) 20 10.3 W 2.8 W 8.7 W 2.0 W Core Power (Post-Flush) 20 NB Power 17 N/A 1.7 W I/O Power 13 6.5 W 6.5 W S0.C1E.Pmin TDP S3 I/O Power 16 6.3 W 3.4 W 13 350 mW 350 mW The notes for this table are on page 81. AMD Athlon™ Processor 79 PID: 43375 Rev 3.46 - September 2010 3.3.5 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AD mmmm SC pnc GM (25 W, DT, AM3) Thermal and Power Specifications AD270USCK23GM19 OPN Specification8 State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C1.Pmin Notes Single-Plane Dual-Plane o Tcase Max 1 55 C to 81 oC Tctl Max 2 70 oC 5 oC Tambient Min Thermal Profile W Startup P-State 5 HTC P-State 4 NB COF 6,7 1800 MHz 1800 MHz VID_VDDNB Min 11,7 N/A 1.050 V VID_VDDNB Max 11,7 N/A 1.050 V IDDNB Max 12 N/A CPU COF 6 TDP 3,7 25.0 W 25.0 W VID_VDD Min 9 1.050 V 1.000 V VID_VDD Max 9 1.150 V 1.150 V IDD Max 3,10 17.7 A 15.7 A CPU COF 6 TDP 3,7 22.4 W 20.7 W VID_VDD Min 9 1.050 V 0.950 V VID_VDD Max 9 1.100 V 1.100 V IDD Max 3,10 15.3 A 12.2 A CPU COF 6 S0.C0.P2 S0.C0.P2 2.0 A 2000 MHz 1600 MHz 800 MHz TDP 3,7 17.3 W 13.8 W VID_VDD Min 9 1.050 V 0.825 V VID_VDD Max 9 1.050 V 0.975 V IDD Max 3,10 10.4 A 6.1 A Core Power (Pre-Flush) 20 4.8 W 1.7 W Core Power (Post-Flush) 20 3.4 W 0.8 W NB Power 17 N/A 1.2 W I/O Power S0.C1E.Pmin TDP S3 I/O Power 13 6.4 W 6.4 W 16 2.4 W 1.8 W 13 350 mW 350 mW The notes for this table are on page 81. AMD Athlon™ Processor 80 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AMD Athlon™ Processor Thermal and Power Specification Table Notes: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. Tcase Max is the maximum case temperature specification which is a physical value in degrees Celsius. Tcase Max can be any valid Tcase Max value in the range specified for the corresponding OPN. Tctl Max (maximum control temperature) is a non-physical temperature on an arbitrary scale that can be used for system thermal management policies. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116. The processor thermal solution should be designed to accommodate thermal design power (TDP) at Tcase Max. TDP is measured under the conditions of all cores operating at CPU COF, Tcase Max, and VDD at the voltage requested by the processor. TDP includes all power dissipated on-die from VDD, VDDNB, VDDIO, VLDT, VTT, and VDDA. TDP is not the maximum power of the processor. P-state limit when HTC is active. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116 for more information. Hardware transitions the part to startup P-state at cold boot. During initialization, the startup NB COF and VID_VDDNB values may differ from those of the startup P-state. Please see the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116 for detailed power sequencing information. Frequency reported to the OS is rounded to the nearest 100-MHz boundary. During initialization, the startup NB COF and VID_VDDNB values may differ from those of the startup P-state. Please see the BIOS and Kernel Developer’s Guide (BKDG) For AMD Family 10h Processors, order# 31116 for specific power sequencing information. Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and equivalent Tcase conditions for all cores. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order #31116, for details on P-state operation for multi-core processors. Variable voltage, any valid voltage between VID_VDD Min and VID_VDD Max is allowed. TDP IDD conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDD Max specification. Single-plane platforms have VID_VDD and VID_VDDNB tied together, and use the VID_VDD specification. TDP IDDNB conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDDNB Max specification. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only. Assumes VDDIO = 1.8 V and VTT = VDDIO / 2. Refer to erratum 308 in the Revision Guide for AMD Family 10h Processors, order# 41322 for the appropriate clock divisor setting. Assumes 50°C, Min P-state VID_VDD, core clock divider set to 128, and L2 and data cache scrubbing disabled. Refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116 for recommended settings. Assumes 35°C, min P-state VID_VDD, core clock divider set to 16, HyperTransport™ link s disconnected, memory in self-refresh mode, and DDR2 SDRAM interface tristated. Recommended settings in the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116, provide improved power values. Thermal Design Power dissipated by the processor at min P-state VID_VDDNB. Thermal Design Power dissipated by the processor at min P-state VID_VDD. This product is recommended for dual-plane platforms only. Core Power (Pre-Flush) and (Post-Flush) refers to the Cache Flush On Halt feature described in the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116. Core Power pre-flush and post-flush values are based on the recommended BKDG settings. Actual C1 idle core power varies with system usage according to the following equation: C1 idle Core Power = F3xDC[CashFlushOnHaltTmr]/OS timer tick interval * Core Power (Pre-Flush) + (1 - F3xDC[CachFlushOnHaltTmr]/OS timer tick interval * Core Power (Post-Flush)) The default Microsoft ® Windows Vista ® timer tick interval is 15.6 ms. This interval varies between operating systems and within an operating system depending on usage. Valid for dual-plane operation only. AMD Athlon™ Processor 81 PID: 43375 Rev 3.46 - September 2010 4 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AMD Sempron™ Processor The following sections contain the OPN description and thermal and power specifications for the AMD Sempron™ Processor. Each column in the thermal and power tables represents a specific Ordering Part Number (OPN). Section 4.1 provides an example of the OPN structure for this processor family. 4.1 AMD Sempron™ Processor Ordering Part Number Description b s mmmm rr p n c dd Part Definition Cache Size Number of Cores Package Roadmap Model Segment Brand Figure 5. AMD Sempron™ Processor Ordering Part Number Diagram S D X145 HB K 1 3 GM Part Definition: GM (see Table 17) Cache Size: 3 (see Table 18) Number of Cores: 1 (see Table 19) Package: K (see Table 20) Roadmap: HB (see Table 21) Model Number: X145 (see Table 22) Segment: D = Desktop Brand: S = AMD Sempron™ Processor Figure 6. AMD Sempron™ Processor Ordering Part Number Example AMD Sempron™ Processor 82 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 17. AMD Sempron™ Processor Part Definition Options Part Definition Revision CPUID 8000_0001h EAX [31:0] (CPUID) GM Rev C3 00100F63h Table 18. AMD Sempron™ Processor Cache Size Options OPN Character L2 Cache Size L3 Cache Size 3 1024 KB 0 KB Table 19. AMD Sempron™ Processor Number of Cores OPN Character Number of Cores 1 1 Table 20. AMD Sempron™ Processor Package Options OPN Character Package K AM3 Table 21. AMD Sempron™ Processor Roadmap Options OPN Character Max TDP Socket Infrastructure IDD Max (VDD) IDD Max (NB) HS Class HB 45 W AM3 45 A 20 A HS 55 Table 22. AMD Sempron™ Processor Model Number Options Model Number Core Single-Plane Frequency NB Frequency Dual-Plane NB Number Frequency of Cores Max DDR Speed Max HT Link Speed X145 2800 MHz 2000 MHz 1066 MT/s 4000 MT/s 1600 MHz 1 AMD Sempron™ Processor 83 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 23. AMD Sempron™ Processor Thermal Profiles Thermal Profile Heat S ink Class Heat S ink Thermal Resistance Heat S ink Local Ambient Profile Thermal Resistance Profile Ambient TDP 0.0 W 5.0 W 10.0 W 15.0 W 20.0 W 25.0 W 30.0 W 35.0 W 41.0 W R HS55 0.51°C/W 42°C 0.366°C/W 48°C Tcase Max 55.0°C 55.0°C 55.0°C 55.0°C 55.3°C 57.2°C 59.0°C 60.8°C 63.0°C Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications are met.AMD Athlon™ Processor Thermal Profiles AMD Sempron™ Processor 84 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet 4.2 AMD Sempron™ Processor Thermal and Power Table Guide The thermal and power table guide shown in Table 24 maps SOPNs and the properties associated with their defined characters to the proper thermal and power table subsections and page numbers. This table is designed to be used as a quick reference for finding the appropriate subsection for the thermal and power tables corresponding to an SOPN. Table 24. AMD Sempron™ Processor Thermal and Power Table Guide SOPN Power SD mmmm HB pnc GM 45 W Revision C3 Thermal/Power Tables Section 4.3.1 on page 87 AMD Sempron™ Processor 85 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet 4.3 AMD Sempron™ Processor Thermal and Power Specifications The thermal and power specification tables contain the thermal and power requirements for each OPN. This includes the information necessary for thermal management (for example, heat sink requirements, temperature assumptions) and power delivery (for example, voltage, current, and power dissipation for each P-state). Refer to the AMD Family 10h Processor Electrical Data Sheet, order# 40014, for all other electrical specifications for the processor. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for power management BIOS requirements. Section 4.1 on page 82 provides an example of the OPN structure for processors documented in this chapter and Table 24 on page 85 provides a guide to OPN organization in the following subsections. Refer to Section 1.2 on page 9 and Section 1.3 on page 10 for numbering conventions and terminology definitions used in these tables. AMD Sempron™ Processor 86 PID: 43375 Rev 3.46 - September 2010 4.3.1 AMD Family 10h Desktop Processor Power and Thermal Data Sheet SD mmmm HB pnc GM (45 W, DT, AM3) Thermal and Power Specifications SDX145HBK13GM19 OPN State S0.C0.Px S0.Cx.Px S0.C0.P0 S0.C0.P1 S0.C0.P2 S0.C0.P3 S0.C1.Pmin Specification Notes Single-Plane Dual-Plane Tcase Max 1 55 oC to 63 oC Tctl Max 2 70 oC 5 oC Tambient Min R Thermal Profile S0.C0.P3 Startup P-State 5 HTC P-State 4 NB COF 6,7 1600 MHz 2000 MHz VID_VDDNB Min 11,7 N/A 1.175 V VID_VDDNB Max 11,7 N/A 1.175 V IDDNB Max 12 N/A 4.4 A S0.C0.P3 CPU COF 6 TDP 3,7 42.0 W 41.0 W VID_VDD Min 9 1.100 V 1.100 V VID_VDD Max 9 1.350 V 1.350 V IDD Max 3,10 30.1 A 26.7 A CPU COF 6 2800 MHz 2000 MHz TDP 3,7 36.9 W 30.3 W VID_VDD Min 9 1.050 V 1.000 V VID_VDD Max 9 1.250 V 1.250 V IDD Max 3,10 27.6 A 18.7 A CPU COF 6 1600 MHz TDP 3,7 35.5 W 23.9 W VID_VDD Min 9 1.050 V 0.900 V VID_VDD Max 9 1.150 V 1.150 V IDD Max 3,10 26.4 A 13.6 A CPU COF 6 TDP 3,7 32.7 W 19.4 W VID_VDD Min 9 1.050 V 0.825 V VID_VDD Max 9 1.075 V 1.075 V IDD Max 3,10 23.9 A 9.5 A Core Power (Pre-Flush) 20 15.9 W 4.1 W Core Power (Post-Flush) 20 14.1 W 2.9 W 800 MHz NB Power 17 N/A 2.2 W I/O Power 13 6.5 W 6.5 W S0.C1E.Pmin TDP S3 I/O Power 16 9.8 W 4.9 W 13 350 mW 350 mW The notes for this table are on page 88. AMD Sempron™ Processor 87 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet AMD Sempron™ Processor Thermal and Power Specification Table Notes: 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. Tcase Max is the maximum case temperature specification which is a physical value in degrees Celsius. Tcase Max can be any valid Tcase Max value in the range specified for the corresponding OPN. Tctl Max (maximum control temperature) is a non-physical temperature on an arbitrary scale that can be used for system thermal management policies. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116. The processor thermal solution should be designed to accommodate thermal design power (TDP) at Tcase Max. TDP is measured under the conditions of all cores operating at CPU COF, Tcase Max, and VDD at the voltage requested by the processor. TDP includes all power dissipated on-die from VDD, VDDNB, VDDIO, VLDT, VTT, and VDDA. TDP is not the maximum power of the processor. P-state limit when HTC is active. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116 for more information. Hardware transitions the part to startup P-state at cold boot. During initialization, the startup NB COF and VID_VDDNB values may differ from those of the startup P-state. Please see the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116 for detailed power sequencing information. Frequency reported to the OS is rounded to the nearest 100-MHz boundary. During initialization, the startup NB COF and VID_VDDNB values may differ from those of the startup P-state. Please see the BIOS and Kernel Developer’s Guide (BKDG) For AMD Family 10h Processors, order# 31116 for specific power sequencing information. Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and equivalent Tcase conditions for all cores. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order #31116, for details on P-state operation for multi-core processors. Variable voltage, any valid voltage between VID_VDD Min and VID_VDD Max is allowed. TDP IDD conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDD Max specification. Single-plane platforms have VID_VDD and VID_VDDNB tied together, and use the VID_VDD specification. TDP IDDNB conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDDNB Max specification. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only. Assumes VDDIO = 1.8 V and VTT = VDDIO / 2. Refer to erratum 308 in the Revision Guide for AMD Family 10h Processors, order# 41322 for the appropriate clock divisor setting. Assumes 50°C, Min P-state VID_VDD, core clock divider set to 128, and L2 and data cache scrubbing disabled. Refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116 for recommended settings. Assumes 35°C, min P-state VID_VDD, core clock divider set to 16, HyperTransport™ link s disconnected, memory in self-refresh mode, and DDR2 SDRAM interface tristated. Recommended settings in the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116, provide improved power values. Thermal Design Power dissipated by the processor at min P-state VID_VDDNB. Thermal Design Power dissipated by the processor at min P-state VID_VDD. This product is recommended for dual-plane platforms only. Core Power (Pre-Flush) and (Post-Flush) refers to the Cache Flush On Halt feature described in the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116. Core Power pre-flush and post-flush values are based on the recommended BKDG settings. Actual C1 idle core power varies with system usage according to the following equation: C1 idle Core Power = F3xDC[CashFlushOnHaltTmr]/OS timer tick interval * Core Power (Pre-Flush) + (1 - F3xDC[CachFlushOnHaltTmr]/OS timer tick interval * Core Power (Post-Flush)) The default Microsoft ® Windows Vista ® timer tick interval is 15.6 ms. This interval varies between operating systems and within an operating system depending on usage. AMD Sempron™ Processor 88 PID: 43375 Rev 3.46 - September 2010 5 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Power Supply Specifications For socket infrastructures not covered by this document refer to the AMD Infrastructure Roadmap, order# 41842. 5.1 bsmmmmrr J ncdd – AM2r2 Power Supply Operating Conditions Table 25. bsmmmmrr J ncdd DC Operating Conditions for VDD Power Supply Symbol Parameter Units VID_VDD VID-Requested VDD Supply Level V VDD_PON DC Tolerance - VDD Supply Voltage Metal Mask VID V VDDNB_dc VDDNB Supply voltage V VID_VDDNB VDDNB Supply voltage V VDD_dc V Min Typ Max Notes Refer to the thermal/power tables under the appropriate SOPN section for this OPN-specific parameter. VID_VDD VID_VDD VID_VDD – 50 mV + 50 mV 0.95 1.00 MaxVID_VDD 1,2 VID_VDDNB VID_VDDNB VID_VDDNB – 50 mV + 50 mV Refer to the thermal/power tables under the appropriate SOPN section for this OPN-specific parameter. 0.95 1.00 MaxVID_VDDNB 1,2 VDDNB_PON Metal Mask VDDNB V Notes: 1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during device manufacturing. 2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS). Table 26. bsmmmmrr J ncdd AC Operating Conditions for VDD Power Supply Symbol Parameter Units VDD_ac VDD Supply Voltage V VDDNB_ac VDDNB Supply Voltage V Min Typ VID_VDD – VID_VDD 140 mV VID_VDDNB VID_VDDNB – 140 mV Max VID_VDD + 150 mV VID_VDDNB + 150 mV Notes 1 1 Notes: 1) The voltage set-point must be contained within the DC specification in order to ensure proper operation. Voltage ripple and transient events outside the DC specification must remain within the AC specification at all times. Transients above dc max must return to within the DC specification within 30 μS and must stay under a triangle described by the AC limit at one end and the DC limit at the other, as shown in Figure 7 on page 90. Power Supply Specifications 89 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 27. bsmmmmrr J ncdd Maximum Power-Up and Power-Down Conditions for Power Supplies Symbol VDDIO VDDIO VLDT VDDA VDD, VDDNB Parameter VDDIO Supply Voltage for DDR2 electricals VDDIO Supply Voltage for DDR3 electricals VLDT Supply Voltage VDDA Supply Voltage VDD, VDDNB Supply Voltage Units Max V 2.05 V 1.65 V V 1.32 2.70 Max AC Voltage V VID + 1 50 mV VID + 50 mV VID VID – 50 mV VID – 140 mV 30 μs Figure 7. Socket AM2 AC and DC Transient Limits Power Supply Specifications 90 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 28. bsmmmmrr J ncdd AC and DC Operating Conditions for non-VDD Power Supplies Symbol VDDIO_dc Parameter Units VDDIO Supply Voltage for V DDR2 electricals Min Typ Max Notes 1.70 1.80 1.90 1 VDDIO_ac VDDIO Supply voltage V VLDT VLDT Supply Voltage VTT Supply Voltage for DDR2 electricals V VDDIO_dc – 150 mV 1.14 V 0.85 VTT_dc VTT_ac VTT Supply Voltage V VDDA VDDA Supply Voltage VDDIO Power Supply Current V IDDIO1 ITT1 ILDT IDDA VTT_dc – 75mV 2.40 1.20 VDDIO_dc + 150 2, 3 mV 1.26 12 0.90 0.95 VTT_dc VTT_dc + 75mV 2, 3 2.50 2.60 VDDIO_dc 4 A 3.60 7, 9 VTT Power Supply Current A 1.75 6, 8, 9 VLDT Power Supply Current VDDA Power Supply Current A 1.40/ link 0.65/ link 5, 9 9,10,11 mA 250 9 Notes: 1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid violating the VDDIO_dc minimum spec of 1.70 V. 2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all data bus bits switching. 3) Power supply A/C measurements use a 20-MHz scope bandwidth limit. 4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level measured at the processor VTT_SENSE pin tracks 0.5*VDDIO_dc and stays within the specified maximum and minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage regulator setting must be set 20 mV higher so that VTT still tracks 0.5*VDDIO_dc and stays within the range of 0.85 V and 0.95 V. 5) ILDT is specified for one 16x16-bit Gen3 link. 6) VTT must both sink and source current. 7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.). 8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.). 9) This specification reflects the values published in the appropriate power roadmap document. 10) ILDT is specified for each unconnected HyperTransport™ link or for each 16x16 bit Gen1 HyperTransport link operating at max 2.0 GT/s or less. 11) Please refer to erratum 396. 12) Tolerances apply to both VLDT_dc and VLDT_ac conditions. Power Supply Specifications 91 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet 5.2 bsmmmmrr K ncdd – AM3 Power Supply Operating Conditions Table 29. bsmmmmrr K ncdd DC Operating Conditions for VDD Power Supply Symbol Parameter Units VID_VDD VID-Requested VDD Supply Level V VDD_dc DC Tolerance - VDD Supply Voltage V VDD_PON Metal Mask VID V VDDNB_dc VDDNB Supply voltage V VID_VDDNB VDDNB Supply voltage V Min Typ Max Refer to the thermal/power tables under the appropriate SOPN section for this OPNspecific parameter. VID_VDD VID_VDD VID_VDD –50 mV + 50 mV 0.95 1.00 Notes MaxVID_VDD 1,2 VID_VDDNB VID_VDDNB VID_VDDNB –50 mV + 50 mV Refer to the thermal/power tables under the appropriate SOPN section for this OPNspecific parameter. 0.95 1.00 MaxVID_VDD 1,2 VDDNB_PON Metal Mask VDDNB V Notes: 1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during device manufacturing. 2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS). Table 30. bsmmmmrr K ncdd AC Operating Conditions for VDD Power Supply Symbol Parameter Units VDD_ac VDD Supply Voltage V VDDNB_ac VDDNB Supply Voltage V Min Typ VID_VDD VID_VDD –140 mV VID_VDDNB VID_VDDNB –140 mV Max VID_VDD + 150 mV VID_VDDNB + 150 mV Notes 1 1 Notes: 1) The voltage set-point must be contained within the DC specification in order to ensure proper operation. Voltage ripple and transient events outside the DC specification must remain within the AC specification at all. times. Transients above dc max must return to within the DC specification within 30 μS and must stay under a triangle described by the AC limit at one end and the DC limit at the other, as shown in Figure 8 on page 93. Power Supply Specifications 92 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 31. bsmmmmrr K ncdd Maximum Power-Up and Power-Down Conditions for Power Supplies Symbol VDDIO VDDIO VLDT VDDA VDD, VDDNB Parameter VDDIO Supply Voltage for DDR2 electricals VDDIO Supply Voltage for DDR3 electricals VLDT Supply Voltage VDDA Supply Voltage VDD, VDDNB Supply Voltage Units Max V 2.05 V 1.65 V V 1.32 2.70 Max AC Voltage V VID + 1 50 mV VID + 50 mV VID VID – 50 mV VID – 140 mV 30 μs Figure 8. Socket AM3 AC and DC Transient Limits Power Supply Specifications 93 PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor Power and Thermal Data Sheet Table 32. bsmmmmrr K ncdd AC and DC Operating Conditions for non-VDD Power Supplies Symbol VDDIO_dc Parameter Units VDDIO Supply Voltage for V DDR3 electricals VDDIO_ac VDDIO Supply voltage VLDT VLDT Supply Voltage V VDDR Supply Voltage for V DDR3 electricals VDDR_dc V VDDR_ac VDDR Supply Voltage V VDDA VDDA Supply Voltage VDDIO Power Supply Current VDDR Power Supply Current VLDT Power Supply Current VDDA Power Supply Current V IDDIO1 IDDR ILDT IDDA Min Typ Max Notes 1.375 1.500 1.625 1 VDDIO_dc – VDDIO_dc 125 mV 1.14 1.20 VDDIO_dc + 125 mV 1.26 1.14 1.26 VDDR_dc –60mV 2.40 1.20 VDDR_dc 2.50 VDDR_dc + 60mV 2.60 2, 3 12 4 2, 3 A 3.60 7, 9 A 1.75 6, 8, 9 A 1.40/ link 0.65/ link 5, 9 9,10,11 mA 9 Notes: 1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then the voltage regulator setting for VDDIO should not be lower than 1.425 V to avoid violating the VDDIO_dc minimum spec of 1.375 V. 2) VDDIO_ac and VDDR_ac parameters are measured over 60 seconds time frame with all data bus bits switching. 3) Power supply A/C measurements use a 20-MHz scope bandwidth limit. 4) All voltages are referenced to VSS. Voltage regulator for VDDR must be set accordingly so that VDDR_dc level measured at the processor with VDDR_SENSE pin stay within the specified maximum and minimum DC tolerance limits. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated for to ensure the VDDR stays within the specified DC tolerance limits. 5) ILDT is specified for one 16x16-bit Gen3 link. 6) VDDR must both sink and source current. 7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.). 8) VDDR current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.). 9) This specification reflects the values published in the appropriate power roadmap document. 10) ILDT is specified for one 16x16-bit HyperTransport™ link operating at 2.0 GT/s. 11) Please refer to erratum 396. 12) Tolerances apply to both VLDT_dc and VLDT_ac conditions. Power Supply Specifications 94 PID: 43375 Rev 3.46 - September 2010 6 AMD Family 10h Desktop Processor Power and Thermal Data Sheet MTOPS Table 33 shows Composite Theoretical Performance (CTP) calculations. The calculations are stated in Millions of Theoretical Operations per Second (MTOPS) and are based upon a formula in the United States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory Note 4 for Category 4). All calculations contained herein are subject to change without notice. AMD makes no representation or warranty as to the accuracy or reliability of such calculations. THESE CALCULATIONS ARE PROVIDED “AS IS” AND AMD MAKES NO WARRANTIES WHATSOEVER, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS. Furthermore, AMD shall have no liability for any losses or damages including direct, indirect, special, punitive, incidental, or consequential, such as but not limited to, loss of anticipated profits or other economic loss occurring in connection with use of the calculations, even if AMD has been advised in advance of the possibility of such damages. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein. Table 33. Composite Theoretical Performance (CTP) Calculation Frequency 1600 1700 1800 1900 2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000 3100 3200 3300 3400 MTOPS MTOPS MTOPS MTOPS S ingle-Core Dual-Core Triple-Core Quad-Core 8,667 16,267 23,867 31,467 9,209 17,284 25,359 33,434 9,750 18,300 26,850 35,400 10,292 19,317 28,342 37,367 10,834 20,334 29,834 39,334 11,375 21,350 31,325 41,300 11,917 22,367 32,817 43,267 12,459 23,384 34,309 45,234 13,000 24,400 35,800 47,200 13,542 25,417 37,292 49,167 14,084 26,434 38,784 51,134 14,625 27,450 40,275 53,100 15,167 28,467 41,767 55,067 15,709 29,484 43,259 57,034 16,250 30,500 44,750 59,000 16,792 31,517 46,242 60,967 17,334 32,534 47,734 62,934 17,875 33,550 49,225 64,900 18,417 34,567 50,717 66,867 MTOPS S ix-Core 46,667 49,584 52,500 55,417 58,334 61,250 64,167 67,084 70,000 72,917 75,834 78,750 81,667 84,584 87,500 90,417 93,334 96,250 99,167 MTOPS 95 PID: 43375 Rev 3.46 - September 2010 7 AMD Family 10h Desktop Processor Power and Thermal Data Sheet APP Table 34 shows the Adjusted Peak Performance (APP) calculations for the AMD Phenom™ processor and the AMD Athlon™ processor. The calculations are stated in millions of Weighted Teraflops (WT) and are based upon a formula in the United States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory Note 4 for Category 4). All calculations contained herein are subject to change without notice. AMD makes no representation or warranty as to the accuracy or reliability of such calculations. THESE CALCULATIONS ARE PROVIDED “AS IS” AND AMD MAKES NO WARRANTIES WHATSOEVER, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS. Furthermore, AMD shall have no liability for any losses or damages including direct, indirect, special, punitive, incidental, or consequential, such as but not limited to, loss of anticipated profits or other economic loss occurring in connection with use of the Calculations, even if AMD has been advised in advance of the possibility of such damages. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein. Table 34. Adjusted Peak Performance (APP) Calculation Frequency APP S ingle-Core APP Dual-Core APP Triple-Core APP Quad-Core APP S ix-Core 1600 1700 1800 1900 2000 2100 2200 2300 2400 2500 2600 2700 2800 2900 3000 3100 3200 3300 3400 0.0019 0.0020 0.0022 0.0023 0.0024 0.0025 0.0026 0.0028 0.0029 0.0030 0.0031 0.0032 0.0034 0.0035 0.0036 0.0037 0.0038 0.0040 0.0041 0.0038 0.0041 0.0043 0.0046 0.0048 0.0050 0.0053 0.0055 0.0058 0.0060 0.0062 0.0065 0.0067 0.0070 0.0072 0.0074 0.0077 0.0079 0.0082 0.0058 0.0061 0.0065 0.0068 0.0072 0.0076 0.0079 0.0083 0.0086 0.0090 0.0094 0.0097 0.0101 0.0104 0.0108 0.0112 0.0115 0.0119 0.0122 0.0077 0.0082 0.0086 0.0091 0.0096 0.0101 0.0106 0.0110 0.0115 0.0120 0.0125 0.0130 0.0134 0.0139 0.0144 0.0149 0.0154 0.0158 0.0163 0.0115 0.0122 0.0130 0.0137 0.0144 0.0151 0.0158 0.0166 0.0173 0.0180 0.0187 0.0194 0.0202 0.0209 0.0216 0.0223 0.0230 0.0238 0.0245 APP 96
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