AMD Family 10h Desktop Processor Power And Thermal Data Sheet (PUB) Phenom 43375

User Manual: Phenom 10h

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Advanced Micro Devices
AMD Family 10h
Desktop Processor
Power and Thermal Data Sheet
Publication # 43375
Revision: 3.46
Issue Date: September 2010
Trademarks
AMD, the AMD Arrow logo, AMD Athlon, AMD Phenom, AMD Sempron, and combinations thereof are trademarks of
Advanced Micro Devices, Inc.
HyperTransport is a licensed trademark of the HyperTransport Technology Consortium.
Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
© 2008 – 2010 Advanced Micro Devices, Inc. All rights reserved.
The contents of this document are provided in connection with Advanced Micro Devices,
Inc. (“AMD”) products. AMD makes no representations or warranties with respect to the
accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. The informa-
tion contained herein may be of a preliminary or advance nature and is subject to change
without notice. No license, whether express, implied, arising by estoppel or otherwise, to
any intellectual property rights is granted by this publication. Except as set forth in AMD’s
Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and dis-
claims any express or implied warranty, relating to its products including, but not limited
to, the implied warranty of merchantability, fitness for a particular purpose, or infringement
of any intellectual property right.
AMD’s products are not designed, intended, authorized or warranted for use as compo-
nents in systems intended for surgical implant into the body, or in other applications
intended to support or sustain life, or in any other application in which the failure of
AMD’s product could create a situation where personal injury, death, or severe property or
environmental damage may occur. AMD reserves the right to discontinue or make changes
to its products at any time without notice.
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
3Contents
Table of Contents
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
1.1 Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
1.1.1 Ordering Part Number Description Section Overview . . . . . . . . . . . . . . . . . . 8
1.1.2 Thermal and Power Table Guide Overview . . . . . . . . . . . . . . . . . . . . . . . . . .8
1.1.3 Thermal and Power Table Section Overview . . . . . . . . . . . . . . . . . . . . . . . . . 9
1.1.4 Power Supply Specification Chapter Overview . . . . . . . . . . . . . . . . . . . . . . . 9
1.2 Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
1.3 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
2 AMD Phenom™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
2.1 AMD Phenom™ Processor Ordering Part Number Description . . . . . . . . . . . . . . . . 12
2.2 AMD Phenom Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . 24
2.3 AMD Phenom Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . .25
2.3.1 HD mmmm OB pnc GD (65 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.3.2 HD mmmm WC pnc GD (95 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.3.3 HD mmmm XA pnc GD (125 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.3.4 HD mmmm WC pnc GH (95 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2.3.5 HD mmmm XA pnc GH (125 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
2.3.6 HD mmmm FA pnc GH (140 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
2.3.7 HD mmmm OD pnc GH (65 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
2.3.8 HD mmmm WC pnc HH (95 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
2.3.9 HD mmmm WC pnc HI (95 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
2.3.10 HD mmmm XC pnc GI (125 W, DT, AM2r2) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
2.3.11 HD mmmm WF pnc GI (95 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
2.3.12 HD mmmm OC pnc GI (65 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
2.3.13 HD mmmm WF pnc GM (95 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
2.3.14 HD mmmm FB pnc GM (125 W, 140 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
2.3.15 HD mmmm WF pnc GR (95 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
2.3.16 HD mmmm FB pnc GR (125 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
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3 AMD Athlon™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
3.1 AMD Athlon™ Processor Ordering Part Number Description . . . . . . . . . . . . . . . . . 62
3.2 AMD Athlon Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . . 68
3.3 AMD Athlon Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . . . 69
3.3.1 AD mmmm OC pnc GQ (65 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
3.3.2 AD mmmm WF pnc GM (95 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
3.3.3 AD mmmm OC pnc GM (65 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
3.3.4 AD mmmm HD pnc GM (45 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
3.3.5 AD mmmm SC pnc GM (25 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
4 AMD Sempron™ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82
4.1 AMD Sempron™ Processor Ordering Part Number Description . . . . . . . . . . . . . . .82
4.2 AMD Sempron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . . . . 85
4.3 AMD Sempron Processor Thermal and Power Specifications . . . . . . . . . . . . . . . . . 86
4.3.1 SD mmmm HB pnc GM (45 W, DT, AM3) Thermal and Power
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
5 Power Supply Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
5.1 bsmmmmrr J ncdd – AM2r2 Power Supply Operating Conditions . . . . . . . . . . . . . .89
5.2 bsmmmmrr K ncdd – AM3 Power Supply Operating Conditions . . . . . . . . . . . . . . .92
6 MTOPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
7 APP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
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5List of Figures
List of Figures
Figure 1. AMD Phenom™ Processor Ordering Part Number Diagram . . . . . . . . . . . . . . 12
Figure 2. AMD Phenom Processor Ordering Part Number Example . . . . . . . . . . . . . . . 12
Figure 3. AMD Athlon™ Processor Ordering Part Number Diagram . . . . . . . . . . . . . . . 62
Figure 4. AMD Athlon Processor Ordering Part Number Example . . . . . . . . . . . . . . . . 62
Figure 5. AMD Sempron™ Processor Ordering Part Number Diagram . . . . . . . . . . . . . 82
Figure 6. AMD Sempron Processor Ordering Part Number Example . . . . . . . . . . . . . . . 82
Figure 7. Socket AM2 AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Figure 8. Socket AM3 AC and DC Transient Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
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List of Tables
List of Tables
Table 1. AMD Phenom™ Processor Part Definition Options . . . . . . . . . . . . . . . . . . . . 13
Table 2. AMD Phenom Processor Cache Size Options . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3. AMD Phenom Processor Number of Cores . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 4. AMD Phenom Processor Package Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 5. AMD Phenom Processor Roadmap Options . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 6. AMD Phenom Processor Model Number Options . . . . . . . . . . . . . . . . . . . . . . 15
Table 7. AMD Phenom Processor Thermal Profiles . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 8. AMD Phenom Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . 24
Table 9. AMD Athlon™ Processor Part Definition Options . . . . . . . . . . . . . . . . . . . . . 63
Table 10. AMD Athlon Processor Cache Size Options . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 11. AMD Athlon Processor Number of Cores . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 12. AMD Athlon Processor Package Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 13. AMD Athlon Processor Roadmap Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 14. AMD Athlon Processor Model Number Options . . . . . . . . . . . . . . . . . . . . . . . 64
Table 15. AMD Athlon Processor Thermal Profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Table 16. AMD Athlon Processor Thermal and Power Table Guide . . . . . . . . . . . . . . . . 68
Table 17. AMD Sempron™ Processor Part Definition Options . . . . . . . . . . . . . . . . . . . . 83
Table 18. AMD Sempron Processor Cache Size Options . . . . . . . . . . . . . . . . . . . . . . . . . 83
Table 19. AMD Sempron Processor Number of Cores . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Table 20. AMD Sempron Processor Package Options . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Table 21. AMD Sempron Processor Roadmap Options . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Table 22. AMD Sempron Processor Model Number Options . . . . . . . . . . . . . . . . . . . . . 83
Table 23. AMD Sempron Processor Thermal Profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Table 24. AMD Sempron Processor Thermal and Power Table Guide . . . . . . . . . . . . . . 85
Table 25. bsmmmmrr J ncdd DC Operating Conditions for VDD Power Supply . . . . . 89
Table 26. bsmmmmrr J ncdd AC Operating Conditions for VDD Power Supply . . . . . 89
Table 27. bsmmmmrr J ncdd Maximum Power-Up and Power-Down Conditions
for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Table 28. bsmmmmrr J ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Table 29. bsmmmmrr K ncdd DC Operating Conditions for VDD Power Supply . . . . . 92
Table 30. bsmmmmrr K ncdd AC Operating Conditions for VDD Power Supply . . . . . 92
Table 31. bsmmmmrr K ncdd Maximum Power-Up and Power-Down Conditions
for Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Table 32. bsmmmmrr K ncdd AC and DC Operating Conditions for non-VDD
Power Supplies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Table 33. Composite Theoretical Performance (CTP) Calculation . . . . . . . . . . . . . . . . . 95
Table 34. Adjusted Peak Performance (APP) Calculation . . . . . . . . . . . . . . . . . . . . . . . 96
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Revision History
Revision History
Date Revision Description
September 2010 3.46 Seventh public release.
• Added OPNs to the AMD Phenom™ Processor, AMD Athlon™ Processor,
and AMD Sempron™ Processor sections.
• Added Thermal Profile W on page 66.
• Updated thermal and power specifications for ADX445WFK32GM on
page 72.
• Updated Table 33 on page 95 (CTP) and Table 34 on page 96 (APP).
April 2010 3.40 Sixth public release.
• Added OPNs to the AMD Phenom™ Processor section and to the
AMD Athlon™ Processor section.
• Added the AMD Sempron™ Processor section.
September 2009 3.33 Fifth public release.
• Updated note to Table 28 on page 91 and Table 32 on page 94 in the Power
Supply Specifications section.
June 2009 3.28 Fourth public release.
• Added new OPNs to the AMD Phenom™ processor section.
• Added the AMD Athlon™ processor section.
• Added Section 5.2, AM3 Power Supply Operating Conditions.
• Updated Table 34 on page 96 (APP).
January 2009 3.18 Third public release.
• Added new 95-W, AM3 OPNs to the AMD Phenom™ Processor section.
January 2009 3.14 Second public release.
• Added new OPNs to the AMD Phenom™ Processor section.
• Added Table 27 on page 90.
October 2008 3.00 Initial public release.
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8Overview
1 Overview
This document contains processor thermal specifications and power specifications. The specifications
in this document supersede those found in the power roadmaps. For all other electrical specifications,
refer to the appropriate product data sheet and the AMD Family 10h Processor Electrical Data Sheet,
order# 40014.
1.1 Organization
This document is organized into the following sections:
• Document overview (Section 1)
• One section for each brand represented in the desktop segment, containing the following
subsections:
• Ordering Part Number (OPN) description (content overview in Section 1.1.1)
• Thermal and power specification tables (content overview in Section 1.1.3 on page 9)
• Power supply specifications (content overview in Section 1.1.4 on page 9)
•MTOPS section in Table 33 on page 95
•APP section in Table 34 on page 96
1.1.1 Ordering Part Number Description Section Overview
The Ordering Part Number (OPN) Description section contains a depiction and description of a valid
OPN for the brand contained in that chapter. Each character or group of characters within an OPN has
a specific meaning (for example, model number, socket compatibility). The meaning of each OPN
character is detailed in the OPN description section. Each OPN identifies a processor with a unique
thermal and power specification table entry.
The OPN description section also contains a full description of the Subsection Ordering Part Number
(SOPN) abstraction characters for the brand contained in that chapter. SOPNs are used to group and
organize OPNs into subsections for the thermal and power tables and power supply specifications. A
definition of SOPNs is contained in Section 1.3 on page 10.
1.1.2 Thermal and Power Table Guide Overview
The thermal and power table guide section contains a table mapping SOPNs and the properties
associated with their defined characters to the proper thermal and power table subsections and page
numbers. This table is designed to be used as a quick reference for finding the appropriate subsection
for the thermal and power tables corresponding to an SOPN.
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9Overview
1.1.3 Thermal and Power Table Section Overview
The thermal and power specification tables contain the thermal and power requirements for each
OPN. This includes the information necessary for thermal management (for example, heat sink
requirements, ambient temperature assumptions) and power delivery (for example, voltage and
current, and power dissipation for each P-state).
The thermal and power specification tables are organized into subsections that correspond to
Subsection Ordering Part Numbers (SOPNs). SOPNs for the thermal and power tables have the
brand, power limit, and part definition characters defined. They are of the form AB mmmmrrpnc GH.
Each chapter provides a guide table that maps the SOPNs in the thermal and power tables within that
chapter to the appropriate subsection number and page number. Within each subsection the OPNs are
sorted by model number, socket compatibility, voltage, temperature, and cache size, respectively.
1.1.4 Power Supply Specification Chapter Overview
The power supply specification chapter contains the operating conditions and requirements for all
voltage planes required by the processor. Power supply requirements are organized into subsections
that correspond to socket infrastructure. The socket infrastructure of a particular OPN can be found in
Table 5 on page 14.
1.2 Conventions
Following are conventions used with numbers.
• Binary numbers. Binary numbers are indicated by appending a “b” at the end, for example: 0110b.
• Decimal numbers. Unless specified otherwise, all numbers are decimal.
• Hexadecimal numbers. Hexadecimal numbers are indicated by appending an “h” to the end, for
example: 45F8h.
• Underscores in numbers. Underscores are used to break up numbers to make them more readable,
for example: 0110_1100b. They do not imply any operation.
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10Overview
1.3 Definitions
Following are some key definitions.
•CPU COF. CPU Current Operating Frequency.
•CTP. Composite Theoretical Performance.
• Dual-plane. Platforms in which the VDD and VDDNB (Northbridge) planes are isolated on the
platform and controlled as separate voltages.
•DP. Dual Processor. Each link on DP models supports connections to I/O devices, and any one link
or any sub-link can connect to another MP or DP processor.
•MP. Multiprocessor. Each link on MP models supports connections to I/O devices or an MP or DP
processor. Systems are limited to the number of nodes supported by all the processors. Refer to the
BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for
more details.
•MTOPS. Millions Of Theoretical Operations Per Second.
•NB COF. Northbridge Current Operating Frequency.
•OPN. Ordering Part Number. An OPN uniquely identifies a processor and its associated
specifications in the thermal and power tables and power supply specifications section.
• P-state. Processor Performance State. P-states are valid combinations of CPU voltage, CPU COF,
Northbridge voltage, and NB COF.
• Single-plane. Platforms in which all the VDD and VDDNB power planes are connected together
on the platform and controlled as a single power plane.
•SOPN. Subsection Ordering Part Number. An SOPN is an OPN with a subset of defined characters.
All defined characters in an SOPN are bolded and capitalized. All abstracted characters in an SOPN
are in non-bolded lowercase. Information for any OPN that matches all of the defined characters in
an SOPN is contained in that subsection. For example, OPN AB12344CDE5FGH appears under the
subsection for SOPN AB mmmmmrrpnc GH. The abstracted (lowercase) character definitions for
SOPNs are contained in the OPN description section of each chapter.
•State. Indicates the ACPI defined sleep state, power state, and performance state for the related
specifications. 'x' indicates the related specifications are independent of the associated ACPI state.
For example, S0.C0.P0 indicates sleep state 0, power state 0, and performance state 0. S3.Cx.Px
indicates sleep state 3 entered from any power and performance state combination.
•TDP. Thermal Design Power. The thermal design power is the maximum power a processor can
draw for a thermally significant period while running commercially useful software. The
constraining conditions for TDP are specified in the notes in the thermal and power tables.
•UP. Uniprocessor. Each link on UP models supports connections to I/O devices.
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11Overview
•VID_VDD. The VID_VDD voltage is the VID-requested VDD supply level. Refer to the BIOS and
Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for VID to
voltage translation specifications.
•VID_VDDNB. The VID_VDDNB voltage is the VID-requested VDD Northbridge supply level.
Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors,
order# 31116, for VID to voltage translation specifications.
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12AMD Phenom™ Processor
2 AMD Phenom™ Processor
The following sections contain the OPN description and thermal and power specifications for the
AMD Phenom™ processor. Each column in the thermal and power tables represents a specific
Ordering Part Number (OPN). Section 2.1 provides an example of the OPN structure for this
processor family.
2.1 AMD Phenom™ Processor Ordering Part Number Description
Figure 1. AMD Phenom™ Processor Ordering Part Number Diagram
Figure 2. AMD Phenom™ Processor Ordering Part Number Example
Part Definition
Cache Size
Number of Cores
Package
Roadmap
Model
Brand
Segment
b s mmmm rr p n c dd
H D 9100 OB J 4 B GD
Part Definition: GD (see Table 1)
Cache Size: B (see Table 2)
Number of Cores: 4 (see Table 3)
Package: J (see Table 4)
Roadmap: OB (see Table 5)
Model Number: 9100 (see Table 6)
Brand: H = AMD Phenom™ Processor
Segment: D = Desktop
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13AMD Phenom™ Processor
Table 1. AMD Phenom™ Processor Part Definition Options
Part
Definition Revision CPUID 8000_0001h EAX [31:0]
(CPUID)
GD Rev B2 00100F22h
GH Rev B3 00100F23h
HH Rev B2 00100F22h
HI Rev B3 00100F23h
GI Rev C2 00100F42h
GM Rev C3 00100F43h
GR Rev E0 00100FA0h
Table 2. AMD Phenom™ Processor Cache Size Options
OPN
Character L2 Cache Size L3 Cache Size
B 512 KB 2048 KB
F 512 KB 4096 KB
D 512 KB 6144 KB
Table 3. AMD Phenom™ Processor Number of Cores
OPN
Character
Number of
Cores
22
33
44
66
Table 4. AMD Phenom™ Processor Package Options
OPN
Character Package
JAM2r2
KAM3
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
14AMD Phenom™ Processor
Table 5. AMD Phenom™ Processor Roadmap Options
OPN
Character Max TDP Socket
Infrastructure
IDD Max
(VDD)
IDD Max
(NB) HS Class
OB 65 W AM2r2 60 A 20 A HS 65
WC 95 W AM2r2 80 A 20 A HS 65
WF 95 W AM3 80 A 20 A HS 65
XA 125 W AM2r2 95 A 20 A HS 78
FA 140 W AM2r2 110 A 20 A HS 78
FB 125 W, 140 W AM3 110 A 20 A HS 78
OD 65 W AM2r2 60 A 20 A HS 55
XC 125 W, Dual-Plane AM2r2 95 A 20 A HS 78
OC 65 W AM3 60 A 20 A HS 55
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
15AMD Phenom™ Processor
Table 6. AMD Phenom™ Processor Model Number Options
Model
Number
Core
Frequency
Single-Plane
NB Frequency
Dual-Plane NB
Frequency
Number
of Cores
Max DDR
Speed
Max HT Link
Speed
9100 1800 MHz 1600 MHz 1600 MHz 4 800 MT/s 3200 MT/s
9150 1800 MHz 1600 MHz 1600 MHz 4 800 MT/s 3200 MT/s
9350 2000 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s
8250 1900 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s
8400 2100 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s
8450 2100 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s
9450 2100 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s
9500 2200 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s
9550 2200 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s
8550 2200 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s
8600 2300 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s
860B 2300 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s
9600 2300 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s
960B 2300 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s
960Z 2300 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s
9650 2300 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s
8650 2300 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s
8750 2400 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s
875B 2400 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s
875Z 2400 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s
9700 2400 MHz 2000 MHz 2000 MHz 4 800 MT/s 4000 MT/s
9750 2400 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s
975B 2400 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s
700E 2400 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s
900E 2400 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s
8850 2500 MHz 1800 MHz 1800 MHz 3 800 MT/s 3600 MT/s
9850 2500 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s
985B 2500 MHz 1800 MHz 1800 MHz 4 800 MT/s 3600 MT/s
985Z 2500 MHz 2000 MHz 2000 MHz 4 800 MT/s 4000 MT/s
X805 2500 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s
705E 2500 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s
905E 2500 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
16AMD Phenom™ Processor
995Z 2600 MHz 2000 MHz 2000 MHz 4 800 MT/s 4000 MT/s
X810 2600 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s
X910 2600 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s
X710 2600 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s
T35T 2600 MHz 2000 MHz 2000 MHz 6 1333 MT/s 4000 MT/s
T45T 2700 MHz 2000 MHz 2000 MHz 6 1333 MT/s 4000 MT/s
X920 2800 MHz 1600 MHz 1800 MHz 4 1066 MT/s 3600 MT/s
Z720 2800 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s
X925 2800 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s
T55T 2800 MHz 2000 MHz 2000 MHz 6 1333 MT/s 4000 MT/s
Z940 3000 MHz 1600 MHz 1800 MHz 4 1066 MT/s 3600 MT/s
X545 3000 MHz 1600 MHz 2000 MHz 2 1333 MT/s 4000 MT/s
T75T 3000 MHz 2000 MHz 2000 MHz 6 1333 MT/s 4000 MT/s
Z550 3100 MHz 1600 MHz 2000 MHz 2 1333 MT/s 4000 MT/s
T90Z 3200 MHz 2000 MHz 2000 MHz 6 1333 MT/s 4000 MT/s
Z560 3300 MHz 1600 MHz 2000 MHz 2 1333 MT/s 4000 MT/s
Z970 3500 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s
Table 6. AMD Phenom™ Processor Model Number Options (Continued)
Model
Number
Core
Frequency
Single-Plane
NB Frequency
Dual-Plane NB
Frequency
Number
of Cores
Max DDR
Speed
Max HT Link
Speed
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
17AMD Phenom™ Processor
Table 7. AMD Phenom™ Processor Thermal Profiles
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
Thermal Profile A
Heat S ink Thermal
Re si s tance 0.29°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Re si s tance 0.232°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.0°C
30.0 W 55.0°C
35.0 W 56.1°C
40.0 W 57.3°C
45.0 W 58.4°C
50.0 W 59.6°C
55.0 W 60.8°C
60.0 W 61.9°C
65.0 W 63.1°C
70.0 W 64.2°C
75.0 W 65.4°C
80.0 W 66.6°C
85.0 W 67.7°C
90.0 W 68.9°C
95.0 W 70.0°C
Thermal Profile B
Heat S ink Thermal
Resi stance 0.18°C/W
Heat S ink Local
Ambi e n t 38°C
Profile Thermal
Resi stance 0.136°C/W
Profile Ambient 44°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.0°C
30.0 W 55.0°C
35.0 W 55.0°C
40.0 W 55.0°C
45.0 W 55.0°C
50.0 W 55.0°C
55.0 W 55.0°C
60.0 W 55.0°C
65.0 W 55.0°C
70.0 W 55.0°C
75.0 W 55.0°C
80.0 W 55.0°C
85.0 W 55.6°C
90.0 W 56.2°C
95.0 W 56.9°C
100.0 W 57.6°C
105.0 W 58.3°C
110.0 W 59.0°C
115.0 W 59.6°C
120.0 W 60.3°C
125.0 W 61.0°C
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
18AMD Phenom™ Processor
Table 7. AMD Phenom™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
Thermal Profile C
Heat S ink Class HS65
Heat S ink Thermal
Re si s tance 0.30°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Re si s tance 0.242°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.0°C
30.0 W 55.3°C
35.0 W 56.5°C
40.0 W 57.7°C
45.0 W 58.9°C
50.0 W 60.1°C
55.0 W 61.3°C
60.0 W 62.5°C
65.0 W 63.7°C
70.0 W 64.9°C
75.0 W 66.2°C
80.0 W 67.4°C
85.0 W 68.6°C
90.0 W 69.8°C
95.0 W 71.0°C
Thermal Profile D
Heat S ink Thermal
Re si s tance 0.29°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Re si s tance 0.200°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.0°C
30.0 W 55.0°C
35.0 W 55.0°C
40.0 W 56.0°C
45.0 W 57.0°C
50.0 W 58.0°C
55.0 W 59.0°C
60.0 W 60.0°C
65.0 W 61.0°C
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
19AMD Phenom™ Processor
Table 7. AMD Phenom™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
Thermal Profile E
Heat S ink Thermal
Re si s tance 0.18°C/W
Heat S ink Local
Ambi e n t 38°C
Profile Thermal
Re si s tance 0.143°C/W
Profile Ambient 44°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.0°C
30.0 W 55.0°C
35.0 W 55.0°C
40.0 W 55.0°C
45.0 W 55.0°C
50.0 W 55.0°C
55.0 W 55.0°C
60.0 W 55.0°C
65.0 W 55.0°C
70.0 W 55.0°C
75.0 W 55.0°C
80.0 W 55.4°C
85.0 W 56.2°C
90.0 W 56.9°C
95.0 W 57.6°C
100.0 W 58.3°C
105.0 W 59.0°C
110.0 W 59.7°C
115.0 W 60.4°C
120.0 W 61.2°C
125.0 W 61.9°C
130.0 W 62.6°C
135.0 W 63.3°C
140.0 W 64.0°C
Thermal Profile F
Heat S ink Thermal
Re si s tance 0.42°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Re si s tance 0.338°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 56.5°C
30.0 W 58.1°C
35.0 W 59.8°C
40.0 W 61.5°C
45.0 W 63.2°C
50.0 W 64.9°C
55.0 W 66.6°C
60.0 W 68.3°C
65.0 W 70.0°C
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
20AMD Phenom™ Processor
Table 7. AMD Phenom™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
Thermal Profile G
Heat S ink Class HS65
Heat S ink Thermal
Re si s tance 0.44°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Re si s tance 0.354°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.1°C
25.0 W 56.9°C
30.0 W 58.6°C
35.0 W 60.4°C
40.0 W 62.2°C
45.0 W 63.9°C
50.0 W 65.7°C
55.0 W 67.5°C
60.0 W 69.2°C
65.0 W 71.0°C
Thermal Profile H
Heat S ink Class HS65
Heat S ink Thermal
Re si s tance 0.32°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Re si s tance 0.263°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.0°C
30.0 W 55.9°C
35.0 W 57.2°C
40.0 W 58.5°C
45.0 W 59.8°C
50.0 W 61.2°C
55.0 W 62.5°C
60.0 W 63.8°C
65.0 W 65.1°C
70.0 W 66.4°C
75.0 W 67.7°C
80.0 W 69.0°C
85.0 W 70.4°C
90.0 W 71.7°C
95.0 W 73.0°C
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
21AMD Phenom™ Processor
Table 7. AMD Phenom™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
Thermal Profile I
Heat S ink Thermal
Re si s tance 0.19°C/W
Heat S ink Local
Ambi e n t 38°C
Profile Thermal
Re si s tance 0.144°C/W
Profile Ambient 44°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.0°C
30.0 W 55.0°C
35.0 W 55.0°C
40.0 W 55.0°C
45.0 W 55.0°C
50.0 W 55.0°C
55.0 W 55.0°C
60.0 W 55.0°C
65.0 W 55.0°C
70.0 W 55.0°C
75.0 W 55.0°C
80.0 W 55.5°C
85.0 W 56.2°C
90.0 W 57.0°C
95.0 W 57.7°C
100.0 W 58.4°C
105.0 W 59.1°C
110.0 W 59.8°C
115.0 W 60.6°C
120.0 W 61.3°C
125.0 W 62.0°C
Thermal Profile J
Heat S ink Class HS55
Heat S ink Thermal
Re si s tance 0.43°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Re si s tance 0.338°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 56.5°C
30.0 W 58.1°C
35.0 W 59.8°C
40.0 W 61.5°C
45.0 W 63.2°C
50.0 W 64.9°C
55.0 W 66.6°C
60.0 W 68.3°C
65.0 W 70.0°C
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
22AMD Phenom™ Processor
Table 7. AMD Phenom™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
Thermal Profile K
Heat S ink Class HS55
Heat S ink Thermal
Re si s tance 0.45°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Re si s tance 0.369°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.4°C
25.0 W 57.2°C
30.0 W 59.1°C
35.0 W 60.9°C
40.0 W 62.8°C
45.0 W 64.6°C
50.0 W 66.5°C
55.0 W 68.3°C
60.0 W 70.1°C
65.0 W 72.0°C
Thermal Profile P
Heat S ink Class HS65
Heat S ink Thermal
Re si s tance 0.35°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Re si s tance 0.275°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.0°C
30.0 W 56.3°C
35.0 W 57.6°C
40.0 W 59.0°C
45.0 W 60.4°C
50.0 W 61.8°C
55.0 W 63.1°C
60.0 W 64.5°C
65.0 W 65.9°C
70.0 W 67.3°C
75.0 W 68.6°C
80.0 W 70.0°C
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
23AMD Phenom™ Processor
Table 7. AMD Phenom™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
Thermal Profile AE
Heat S ink Class HS78
Heat S ink Thermal
Re si s tance 0.19°C/W
Heat S ink Local
Ambi e n t 38.0°C
Profile Thermal
Re si s tance 0.144°C/W
Profile Ambient 44.0°C
TDP Tcase Max
0 W 55.0°C
10 W 55.0°C
20 W 55.0°C
30 W 55.0°C
40 W 55.0°C
50 W 55.0°C
60 W 55.0°C
70 W 55.0°C
80 W 55.5°C
90 W 57.0°C
95 W 57.7°C
100 W 58.4°C
105 W 59.1°C
110 W 59.8°C
115 W 60.6°C
120 W 61.3°C
125 W 62.0°C
Thermal Profile AD
Heat S ink Class HS65
Heat S ink Thermal
Re si s tance 0.30°C/W
Heat S ink Local
Ambi e n t 42.0°C
Profile Thermal
Re si s tance 0.242°C/W
Profile Ambient 48.0°C
TDP Tcase Max
0 W 55.0°C
10 W 55.0°C
20 W 55.0°C
30 W 55.3°C
40 W 57.7°C
50 W 60.1°C
60 W 62.5°C
70 W 64.9°C
80 W 67.4°C
90 W 69.8°C
95 W 71.0°C
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
24AMD Phenom™ Processor
2.2 AMD Phenom™ Processor Thermal and Power Table Guide
The thermal and power table guide shown in Table 8 maps SOPNs and the properties associated with
their defined characters to the proper thermal and power table subsections and page numbers. This
table is designed to be used as a quick reference for finding the appropriate subsection for the thermal
and power tables corresponding to an SOPN.
Table 8. AMD Phenom™ Processor Thermal and Power Table Guide
SOPN Power Revision Thermal/Power Tables
HD mmmm OB pnc GD 65 W B2 Section 2.3.1 on page 26
HD mmmm WC pnc GD 95 W B2 Section 2.3.2 on page 27
HD mmmm XA pnc GD 125 W B2 Section 2.3.3 on page 30
HD mmmm WC pnc GH 95 W B3 Section 2.3.4 on page 31
HD mmmm XA pnc GH 125 W B3 Section 2.3.5 on page 39
HD mmmm FA pnc GH 140 W B3 Section 2.3.6 on page 41
HD mmmm OD pnc GH 65 W B3 Section 2.3.7 on page 42
HD mmmm WC pnc HH 95 W B2 Section 2.3.8 on page 45
HD mmmm WC pnc HI 95 W B3 Section 2.3.9 on page 46
HD mmmm XC pnc GI 125 W C2 Section 2.3.10 on page 47
HD mmmm WF pnc GI 95 W C2 Section 2.3.11 on page 48
HD mmmm OC pnc GI 65 W C2 Section 2.3.12 on page 52
HD mmmm WF pnc GM 95 W C3 Section 2.3.13 on page 54
HD mmmm FB pnc GM 125 W, 140 W C3 Section 2.3.14 on page 55
HD mmmm WF pnc GR 95 W E0 Section 2.3.15 on page 56
HD mmmm FB pnc GR 125 W E0 Section 2.3.16 on page 58
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
25AMD Phenom™ Processor
2.3 AMD Phenom™ Processor Thermal and Power Specifications
The thermal and power specification tables contain the thermal and power requirements for each
OPN. This includes the information necessary for thermal management (for example, heat sink
requirements, temperature assumptions) and power delivery (for example, voltage, current, and
power dissipation for each P-state). Refer to the AMD Family 10h Processor Electrical Data Sheet,
order# 40014, for all other electrical specifications for the processor. Refer to the BIOS and Kernel
Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for power management
BIOS requirements.
Section 2.1 on page 12 provides an example of the OPN structure for processors documented in this
chapter and Table 8 on page 24 provides a guide to OPN organization in the following subsections.
Refer to Section 1.2 on page 9 and Section 1.3 on page 10 for numbering conventions and
terminology definitions used in these tables.
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
26AMD Phenom™ Processor
2.3.1 HD mmmm OB pnc GD (65 W, DT, AM2r2) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 1600 MHz
VID_VDDNB 11,7 N/A 1.150 V
IDDNB Max 12 N/A 9.6 A
CPU COF 6
TDP 3 65.0 W 65.0 W
VID_VDD Min 9 1.100 V 1.100 V
VID_VDD Max 9 1.150 V 1.150 V
IDD Max 3,10 53.8 A 44.9 A
CPU COF 6
TDP 3 46.3 W 39.3 W
VID_VDD Min 9 1.100 V 1.000 V
VID_VDD Max 9 1.150 V 1.000 V
IDD Max 3,10 38.0 A 23.7 A
S0.C1.Pmin IDD Max 3,10,14 14.6 A 3.5 A
S0 I/O Power 13 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW
OPN HD9100OBJ4BGD
S0.C0.Px
55 oC to 61 oC
70 oC
5 oC
D
S0.C0.P1
S0.C0.P1
S0.Cx.Px
S0.C0.P0
1800 MHz
S0.C0.P1
900 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
27AMD Phenom™ Processor
2.3.2 HD mmmm WC pnc GD (95 W, DT, AM2r2) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz
VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V
IDDNB Max 12 N/A 14.5 A N/A 15.2 A
CPU COF 6
TDP 3 95.0 W 95.0 W 95.0 W 95.0 W
VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 73.4 A 60.3 A 73.3 A 59.6 A
CPU COF 6
TDP 3 72.2 W 54.6 W 74.2 W 55.6 W
VID_VDD Min 9 1.200 V 1.050 V 1.200 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 56.3 A 30.5 A 57.7 A 30.6 A
S0.C1.Pmin IDD Max 3,10,14 26.1 A 6.7 A 28.1 A 7.4 A
S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
C
S0.C0.P1
S0.C0.P1
HD8400WCJ3BGD
55 oC to 71 oC
70 oC
5 oC
OPN
HD8600WCJ3BGD
HD860BWCJ3BGD
S0.C0.Px
55 oC to 71 oC
70 oC
5 oC
C
S0.C0.P1
S0.C0.P1
S0.Cx.Px
1050 MHz
2100 MHz
S0.C0.P0
2300 MHz
S0.C0.P1
1150 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
28AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz
VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V
IDDNB Max 12 N/A 12 A N/A 15 A
CPU COF 6
TDP 3 95 W 95 W 95 W 95 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 75.2 A 65.6 A 75.6 A 65.3 A
CPU COF 6
TDP 3 66.3 W 56.7 W 67.2 W 66.1 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 53.7 A 35.5 A 56.4 A 40.8 A
S0.C1.Pmin IDD Max 3,10,14 37.6 A 17.3 A 44.4 A 24.1 A
S0 I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
55 oC to 70 oC
OPN
HD9600WCJ4BGD
HD960BWCJ4BGD
5 oC
HD9500WCJ4BGD
S0.C0.Px
55 oC to 70 oC
S0.C0.P0
1100 MHz1150 MHz
70 oC
S0.C0.P1
S0.C0.P1
2300 MHz 2200 MHz
AA
S0.Cx.Px
S0.C0.P1 S0.C0.P1
70 oC
5 oC
S0.C0.P1
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
29AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 1800 MHz
S0.Cx.Px VID_VDDNB 11,7 N/A 1. 250 V
IDDNB Max 12 N/A 12.0 A
CPU COF 6
TDP 3 95.0 W 95.0 W
VID_VDD Min 9 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V
IDD Max 3,10 75.2 A 65.6 A
CPU COF 6
TDP 3 66.3 W 56.7 W
VID_VDD Min 9 1.150 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V
IDD Max 3,10 53.7 A 35.5 A
S0.C1.Pmin IDD Max 3,10,14 37.6 A 17.3 A
S0 I/O Power 13 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW
OPN HD960ZWCJ4BGD
S0.C0.Px
55 oC to 70 oC
70 oC
5 oC
S0.C0.P1
S0.C0.P1
A
S0.C0.P0
2300 MHz
S0.C0.P1
1150 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
30AMD Phenom™ Processor
2.3.3 HD mmmm XA pnc GD (125 W, DT, AM2r2) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tct l Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-St ate 4
NB COF 6,7 2000 MHz 2000 MHz
VID_VDDNB 11,7 N/A 1.300 V
IDDNB Max 12 N/A 16.8 A
CPU COF 6
TDP 3 125.0 W 125.0 W
VID_VDD Min 9 1.200 V 1.200 V
VID_VDD Max 9 1.300 V 1.300 V
IDD Max 3,10 95.4 A 82.3 A
CPU COF 6
TDP 3 90.8 W 69.4 W
VID_VDD Min 9 1.200 V 1.050 V
VID_VDD Max 9 1.300 V 1.050 V
IDD Max 3,10 71.6 A 41.1 A
S0.C1.Pmin IDD Max 3,10,14 57.6 A 39.4 A
S0 I/O Power 13 7.2 W 7.2 W
S3 I/O Power 13 350 mW 350 mW
OPN HD9700XAJ4BGD
S0.C0.Px
55 oC to 61 oC
70 oC
5 oC
B
S0.C0.P1
S0.C0.P1
S0.Cx.Px
S0.C0.P0
2400 MHz
S0.C0.P1
1200 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
31AMD Phenom™ Processor
2.3.4 HD mmmm WC pnc GH (95 W, DT, AM2r2) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
32AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz
VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V
IDDNB Max 12 N/A 14.5 A N/A 12.8 A
CPU COF 6
TDP 3 95.0 W 95.0 W 95.0 W 95.0 W
VID_VDD Min 9 1.200 V 1.200 V 1.250 V 1.250 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 73.4 A 60.3 A 72.4 A 59.6 A
CPU COF 6
TDP 3 72.2 W 54.6 W 72.2 W 48.7 W
VID_VDD Min 9 1.200 V 1.050 V 1.250 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 56.3 A 30.5 A 54.2 A 26.9 A
Core Power 15,18 13.8 W 7.0 W 12.0 W 5.0 W
NB Power 17 15.8 W 18.2 W 16.0 W 16.0 W
I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S0.C1E.Pmin TDP 16 12.0 W 12.0 W 9.7 W 9.7 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
5 oC
C
HD860BWCJ3BGH
5 oC
C
S0.C0.Px
70 oC
55 oC to 71 oC
S0.C0.P1
S0.C0.P1S0.C0.P1
55 oC to 71 oC
HD8650WCJ3BGH
70 oC
S0.C0.P1
OPN
S0.C1.Pmin
S0.C0.P1
S0.Cx.Px
S0.C0.P0
1150 MHz
2300 MHz2300 MHz
1150 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
33AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz
VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V
IDDNB Max 12 N/A 14.2 A N/A 12.5 A
CPU COF 6
TDP 3 95.0 W 95.0 W 95.0 W 95.0 W
VID_VDD Min 9 1.200 V 1.200 V 1.250 V 1.250 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 73.5 A 60.6 A 72.4 A 59.9 A
CPU COF 6
TDP 3 71.3 W 54.2 W 71.3 W 48.3 W
VID_VDD Min 9 1.200 V 1.050 V 1.250 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 55.6 A 30.4 A 53.4 A 26.8 A
Core Power 15,18 13.1 W 6.6 W 11.1 W 4.6 W
NB Power 17 15.5 W 17.8 W 15.6 W 15.6 W
I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S0.C1E.Pmin TDP 16 11.6 W 11.6 W 9.3 W 9.3 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
70 oC
OPN
S0.C0.P1
HD8750WCJ3BGH
55 oC to 71 oC
C
70 oC
5 oC
S0.C0.Px
S0.C0.P1S0.C0.P1
5 oC
C
HD875BWCJ3BGH
55 oC to 71 oC
S0.C1.Pmin
2400 MHz
1200 MHz
S0.C0.P1
S0.C0.P0
2400 MHz
S0.Cx.Px
1200 MHz
S0.C0.P1
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
34AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz
VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V
IDDNB Max 12 N/A 14.2 A N/A 13.9 A
CPU COF 6
TDP 3 95.0 W 95.0 W 95.0 W 95.0 W
VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 73.5 A 60.6 A 73.6 A 61.0 A
CPU COF 6
TDP 3 71.3 W 54.2 W 70.4 W 53.7 W
VID_VDD Min 9 1.200 V 1.050 V 1.200 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 55.6 A 30.4 A 54.9 A 30.3 A
Core Power 15,18 13.1 W 6.6 W 12.3 W 6.2 W
NB Power 17 15.5 W 17.8 W 15.1 W 17.4 W
I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S0.C1E.Pmin TDP 16 11.6 W 11.6 W 11.1 W 11.1 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
HD875ZWCJ3BGH
55 oC to 71 oC
70 oC
5 oC
2400 MHz
S0.C0.Px C
S0.C0.P1
S0.C0.P1
OPN
S0.C0.P1
S0.C1.Pmin
S0.C0.P0
C
S0.C0.P1
1200 MHz
S0.Cx.Px
2500 MHz
1250 MHz
S0.C0.P1
HD8850WCJ3BGH
55 oC to 71 oC
70 oC
5 oC
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
35AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz
VID_VDDNB Min 11,7 N/A 1.200 V N/A 1.225 V
VID_VDDNB Max 11,7 N/A 1.250 V N/A 1.250 V
IDDNB Max 12 N/A 11.1 A N/A 10.1 A
CPU COF 6
TDP 3 95.0 W 95.0 W 95.0 W 95.0 W
VID_VDD Min 9 1.200 V 1.200 V 1.225 V 1.225 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 74.1 A 63.8 A 73.9 A 63.8 A
CPU COF 6
TDP 3 63.6 W 49.6 W 63.6 W 46.6 W
VID_VDD Min 9 1.200 V 1.050 V 1.225 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 49.3 A 29.7 A 48.3 A 28.3 A
Core Power 15,18 24.5 W 21.5 W 16.6 W 14.6 W
NB Power 17 12.5 W 16.3 W 12.3 W 12.3 W
I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S0.C1E.Pmin TDP 16 10.0 W 10.0 W 12.3 W 12.3 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.Cx.Px
S0.C0.P1
S0.C0.P1
2500 MHz
S0.C0.P0
2500 MHz
S0.C0.P1
S0.C0.P1
HD9850WCJ4BGH
5 oC
70 oC
S0.C0.Px
55 oC to 70 oC
A
S0.C1.Pmin
S0.C0.P1
1250 MHz
HD985BWCJ4BGH
55 oC to 70 oC
70 oC
A
5 oC
1250 MHz
OPN
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
36AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz
VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V
IDDNB Max 12 N/A 13.5 A N/A 11.6 A
CPU COF 6
TDP 3 95.0 W 95.0 W 95.0 W 95.0 W
VID_VDD Min 9 1.150 V 1.150 V 1.200 V 1.200 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 75.2 A 64.0 A 74.0 A 63.4 A
CPU COF 6
TDP 3 65.3 W 56.9 W 64.7 W 50.3 W
VID_VDD Min 9 1.150 V 1.050 V 1.200 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 52.8 A 33.8 A 50.2 A 29.8 A
Core Power 15,18 25.9 W 22.7 W 21.1 W 18.0 W
NB Power 17 12.9 W 16.9 W 12.8 W 14.5 W
I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S0.C1E.Pmin TDP 16 10.6 W 10.6 W 8.1 W 8.1 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P1
S0.C0.P1
A
5 oC
HD975BWCJ4BGH
55 oC to 70 oC
OPN HD9750WCJ4BGH
S0.C0.Px
55 oC to 70 oC
70 oC
5 oC
70 oC
S0.Cx.Px
S0.C0.P1
A
S0.C0.P1
S0.C1.Pmin
1200 MHz
S0.C0.P0
S0.C0.P1
1200 MHz
2400 MHz 2400 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
37AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 1800 MHz 1800 MHz 1800 MHz
VID_VDDNB 11,7 N/A 1.250 V N/A 1.250 V
IDDNB Max 12 N/A 12.0 A N/A 14.0 A
CPU COF 6
TDP 3 95.0 W 95.0 W 95.0 W 95.0 W
VID_VDD Min 9 1.200 V 1.200 V 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 73.9 A 62.9 A 75.1 A 63.5 A
CPU COF 6
TDP 3 65.8 W 50.9 W 66.1 W 57.6 W
VID_VDD Min 9 1.200 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V 1.250 V 1.050 V
IDD Max 3,10 51.1 A 29.9 A 53.6 A 34.0 A
Core Power 15,18 22.7 W 19.1 W 27.4 W 23.8 W
NB Power 17 13.2 W 15.0 W 13.3 W 17.5 W
I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S0.C1E.Pmin TDP 16 8.7 W 8.7 W 11.2 W 11.2 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
HD960BWCJ4BGH
A
55 oC to 70 oC
5 oC
S0.C0.P1
A
55 oC to 70 oC
HD9650WCJ4BGH
S0.C0.P1
OPN
70 oC
5 oC
S0.Cx.Px
S0.C0.Px
70 oC
S0.C0.P1S0.C0.P1
S0.C1.Pmin
S0.C0.P1
S0.C0.P0
1150 MHz
2300 MHz
1150 MHz
2300 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
38AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 1800 MHz
VID_VDDNB 11,7 N/A 1.250 V
IDDNB Max 12 N/A 14.4 A
CPU COF 6
TDP 3 95.0 W 95.0 W
VID_VDD Min 9 1.150 V 1.150 V
VID_VDD Max 9 1.250 V 1.250 V
IDD Max 3,10 74.9 A 63.0 A
CPU COF 6
TDP 3 67.0 W 58.3 W
VID_VDD Min 9 1.150 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V
IDD Max 3,10 54.4 A 34.1 A
Core Power 15,18 28.9 W 24.9 W
NB Power 17 13.7 W 18.0 W
I/O Power 13 7.2 W 7.2 W
S0.C1E.Pmin TDP 16 11.9 W 11.9 W
S3 I/O Power 13 350 mW 350 mW
OPN
S0.C0.Px
S0.C0.P1
HD9550WCJ4BGH
55 oC to 70 oC
70 oC
5 oC
A
S0.C0.P1
S0.C1.Pmin
S0.C0.P1
S0.Cx.Px
1100 MHz
S0.C0.P0
2200 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
39AMD Phenom™ Processor
2.3.5 HD mmmm XA pnc GH (125 W, DT, AM2r2) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
40AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 2000 MHz 2000 MHz 2000 MHz 2000 MHz
VID_VDDNB 11,7 N/A 1.300 V N/A 1.300 V
IDDNB Max 12 N/A 18.4 A N/A 17.8 A
CPU COF 6
TDP 3 125.0 W 125.0 W 125.0 W 125.0 W
VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V
VID_VDD Max 9 1.300 V 1.300 V 1.300 V 1.300 V
IDD Max 3,10 95.0 A 80.1 A 95.0 A 80.5 A
CPU COF 6
TDP 3 89.4 W 69.7 W 88.2 W 68.9 W
VID_VDD Min 9 1.200 V 1.050 V 1.200 V 1.050 V
VID_VDD Max 9 1.300 V 1.050 V 1.300 V 1.050 V
IDD Max 3,10 70.2 A 39.4 A 69.2 A 39.3 A
Core Power 15,18 40.8 W 32.3 W 39.0 W 31.1 W
NB Power 17 17.9 W 23.9 W 17.5 W 22.2 W
I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S0.C1E.Pmin TDP 16 13.7 W 13.7 W 13.1 W 13.1 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P1
S0.Cx.Px
S0.C0.P0
S0.C0.P1
2500 MHz
70 oC
5 oC
1250 MHz
S0.C0.Px B
55 oC to 61 oC
OPN HD9850XAJ4BGH
S0.C1.Pmin
S0.C0.P1
HD995ZXAJ4BGH
1300 MHz
B
S0.C0.P1
S0.C0.P1
2600 MHz
55 oC to 61 oC
70 oC
5 oC
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
41AMD Phenom™ Processor
2.3.6 HD mmmm FA pnc GH (140 W, DT, AM2r2) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 2000 MHz 2000 MHz
VID_VDDNB 11,7 N/A 1.300 V
IDDNB Max 12 N/A 18.1 A
CPU COF 6
TDP 3 140.0 W 140.0 W
VID_VDD Min 9 1.250 V 1.250 V
VID_VDD Max 9 1.300 V 1.300 V
IDD Max 3,10 105.9 A 89.6 A
CPU COF 6
TDP 3 102.6 W 69.8 W
VID_VDD Min 9 1.250 V 1.050 V
VID_VDD Max 9 1.300 V 1.050 V
IDD Max 3,10 78.5 A 39.8 A
Core Power 15,18 44.2 W 31.8 W
NB Power 17 20.4 W 23.5 W
I/O Power 13 7.2 W 7.2 W
S0.C1E.Pmin TDP 16 13.4 W 13.4 W
S3 I/O Power 13 350 mW 350 mW
S0.Cx.Px
S0.C0.P0
2600 MHz
S0.C1.Pmin
S0.C0.P1
1300 MHz
OPN HD995ZFAJ4BGH19
S0.C0.Px
55 oC to 64 oC
70 oC
5 oC
S0.C0.P1
S0.C0.P1
E
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
42AMD Phenom™ Processor
2.3.7 HD mmmm OD pnc GH (65 W, DT, AM2r2) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
43AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 1600 MHz 1800 MHz 1800 MHz
VID_VDDNB 11,7 N/A 1.125 V N/A 1.125 V
IDDNB Max 12 N/A 10.1 A N/A 9.8 A
CPU COF 6
TDP 3 65.0 W 65.0 W 65.0 W 65.0 W
VID_VDD Min 9 1.075 V 1.075 V 1.075 V 1.075 V
VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V
IDD Max 3,10 54.9 A 45.8 A 55.0 A 46.0 A
CPU COF 6
TDP 3 47.2 W 41.7 W 45.5 W 40.5 W
VID_VDD Min 9 1.075 V 1.000 V 1.075 V 1.000 V
VID_VDD Max 9 1.125 V 1.000 V 1.125 V 1.000 V
IDD Max 3,10 39.7 A 25.9 A 38.1 A 25.0 A
Core Power 15,18 17.8 W 16.0 W 15.4 W 14.1 W
NB Power 17 9.9 W 11.3 W 9.2 W 10.5 W
I/O Power 13 7.2 W 7.2 W 7.2 W 7.2 W
S0.C1E.Pmin TDP 16 10.6 W 10.6 W 8.8 W 8.8 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
OPN HD9350ODJ4BGH
S0.C0.Px
55 oC to 70 oC
70 oC
5 oC
S0.C0.P1
S0.C0.P1
F
S0.C0.P1
S0.C1.Pmin
S0.Cx.Px
S0.C0.P0
2000 MHz
S0.C0.P1
1000 MHz900 MHz
HD9150ODJ4BGH
55 oC to 70 oC
70 oC
5 oC
F
S0.C0.P1
1800 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
44AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 1800 MHz
VID_VDDNB 11,7 N/A 1.125 V
IDDNB Max 12 N/A 9.4 A
CPU COF 6
TDP 3 65.0 W 65.0 W
VID_VDD Min 9 1.075 V 1.075 V
VID_VDD Max 9 1.125 V 1.125 V
IDD Max 3,10 55.1 A 46.4 A
CPU COF 6
TDP 3 44.7 W 39.9 W
VID_VDD Min 9 1.075 V 1.000 V
VID_VDD Max 9 1.125 V 1.000 V
IDD Max 3,10 37.4 A 24.8 A
Core Power 15,18 14.5 W 13.5 W
NB Power 17 9.3 W 10.6 W
I/O Power 13 7.2 W 7.2 W
S0.C1E.Pmin TDP 16 8.1 W 8.1 W
S3 I/O Power 13 350 mW 350 mW
S0.C1.Pmin
OPN
S0.C0.Px
HD9450ODJ4BGH
55 oC to 70 oC
70 oC
5 oC
S0.C0.P1
2100 MHz
F
S0.C0.P1
1050 MHz
S0.C0.P1
S0.Cx.Px
S0.C0.P0
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
45AMD Phenom™ Processor
2.3.8 HD mmmm WC pnc HH (95 W, DT, AM2r2) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 1800 MHz
VID_VDDNB 11,7 N/A 1.250 V
IDDNB Max 12 N/A 15.2 A
CPU COF 6
TDP 3 95.0 W 95.0 W
VID_VDD Min 9 1.200 V 1.200 V
VID_VDD Max 9 1.250 V 1.250 V
IDD Max 3,10 73.3 A 59.6 A
CPU COF 6
TDP 3 74.2 W 55.6 W
VID_VDD Min 9 1.200 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V
IDD Max 3,10 57.7 A 30.6 A
Core Power 15,18 15.5 W 7.8 W
NB Power 17 16.5 W 19.0 W
I/O Power 13 7.2 W 7.2 W
S0.C1E.Pmin TDP 16 12.9 W 12.9 W
S3 I/O Power 13 350 mW 350 mW
S0.C1.Pmin
S0.Cx.Px
S0.C0.P0
2100 MHz
S0.C0.P1
1050 MHz
OPN HD8400WCJ3BHH
S0.C0.Px
55 oC to 71 oC
70 oC
5 oC
C
S0.C0.P1
S0.C0.P1
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
46AMD Phenom™ Processor
2.3.9 HD mmmm WC pnc HI (95 W, DT, AM2r2) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 1800 MHz
VID_VDDNB 11,7 N/A 1.250 V
IDDNB Max 12 N/A 14.9 A
CPU COF 6
TDP 3 95.0 W 95.0 W
VID_VDD Min 9 1.200 V 1.200 V
VID_VDD Max 9 1.250 V 1.250 V
IDD Max 3,10 73.4 A 59.9 A
CPU COF 6
TDP 3 73.2 W 55.1 W
VID_VDD Min 9 1.200 V 1.050 V
VID_VDD Max 9 1.250 V 1.050 V
IDD Max 3,10 57.0 A 30.5 A
Core Power 15,18 14.7 W 7.4 W
NB Power 17 16.1 W 18.6 W
I/O Power 13 7.2 W 7.2 W
S0.C1E.Pmin TDP 16 12.4 W 12.4 W
S3 I/O Power 13 350 mW 350 mW
S0.C1.Pmin
OPN HD8550WCJ3BHI
S0.C0.Px
55 oC to 71 oC
70 oC
5 oC
C
S0.C0.P1
S0.C0.P1
2200 MHz
S0.C0.P1
1100 MHz
S0.Cx.Px
S0.C0.P0
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
47AMD Phenom™ Processor
2.3.10 HD mmmm XC pnc GI (125 W, DT, AM2r2) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 1800 MHz 1600 MHz 1800 MHz
VID_VDDNB Min 11,7 N/A 1.150 V N/A 1.150 V
VID_VDDNB Max 11,7 N/A 1.300 V N/A 1.300 V
IDDNB Max 12 N/A 20.0 A N/A 20.0 A
CPU COF 6
TDP 3,7 140.8 W 125.0 W 139.6 W 125.0 W
VID_VDD Min 9 1.225 V 1.225 V 1.225 V 1.225 V
VID_VDD Max 9 1.425 V 1.425 V 1.425 V 1.425 V
IDD Max 3,10 102.5 A 78.9 A 102.3 A 79.4 A
CPU COF 6
TDP 3,7 94.7 W 91.4 W 94.9 W 91.7 W
VID_VDD Min 9 1.150 V 1.125 V 1.150 V 1.125 V
VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V
IDD Max 3,10 77.6 A 55.2 A 77.7 A 56.0 A
CPU COF 6
TDP 3,7 88.7 W 70.1 W 88.9 W 70.8 W
VID_VDD Min 9 1.150 V 1.025 V 1.150 V 1.025 V
VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V
IDD Max 3,10 72.4 A 39.3 A 72.5 A 40.1 A
CPU COF 6
TDP 3,7 79.2 W 52.7 W 77.0 W 48.8 W
VID_VDD Min 9 1.150 V 0.925 V 1.150 V 0.875 V
VID_VDD Max 9 1.150 V 1.150 V 1.150 V 1.150 V
IDD Max 3,10 64.1 A 24.9 A 62.1 A 21.4 A
Core Power (Pre-Flush) 20 39.7 W 8.8 W 38.7 W 6.9 W
Core Power (Post-Flush) 20 36.8 W 6.3 W 35.8 W 4.8 W
NB Power 17 30.4 W 22.3 W 31.0 W 22.3 W
I/O Power 13 5.5 W 5.5 W 5.5 W 5.5 W
S0.C1E.Pmin TDP 16 19.7 W 11.4 W 18.9 W 10.4 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.Cx.Px
S0.C0.P0
1600 MHz 1800 MHz
2800 MHz 3000 MHz
S0.C0.P3
S0.C0.P3
I
HDZ940XCJ4DGI19
55 oC to 62 oC
70 oC
5 oC
OPN HDX920XCJ4DGI19
S0.C0.Px
55 oC to 62 oC
70 oC
5 oC
I
S0.C0.P3
S0.C0.P3
S0.C1.Pmin
S0.C0.P3
800 MHz
2300 MHz
S0.C0.P2
S0.C0.P1
2100 MHz
800 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
48AMD Phenom™ Processor
2.3.11 HD mmmm WF pnc GI (95 W, DT, AM3) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.150 V N/A 1.150 V
VID_VDDNB Max 11,7 N/A 1.300 V N/A 1.300 V
IDDNB Max 12 N/A 20.0 A N/A 20.0 A
CPU COF 6
TDP 3,7 104.0 W 95.0 W 104.0 W 95.0 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.425 V 1.425 V 1.425 V 1.425 V
IDD Max 3,10 75.8 A 58.7 A 75.8 A 58.9 A
CPU COF 6
TDP 3,7 85.5 W 71.7 W 85.5 W 71.7 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V
IDD Max 3,10 68.5 A 40.5 A 68.5 A 40.8 A
CPU COF 6
TDP 3,7 79.5 W 57.2 W 79.5 W 57.2 W
VID_VDD Min 9 1.150 V 0.950 V 1.150 V 0.950 V
VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V
IDD Max 3,10 63.3 A 28.3 A 63.3 A 28.7 A
CPU COF 6
TDP 3,7 73.5 W 48.4 W 72.3 W 47.6 W
VID_VDD Min 9 1.150 V 0.875 V 1.150 V 0.875 V
VID_VDD Max 9 1.150 V 1.150 V 1.150 V 1.150 V
IDD Max 3,10 58.1 A 20.2 A 57.1 A 19.9 A
Core Power (Pre-Flush) 20 37.5 W 6.6 W 36.5 W 6.5 W
Core Power (Post-Flush) 20 34.6 W 4.4 W 33.5 W 4.3 W
NB Power 17 22.3 W 22.3 W 22.3 W 22.3 W
I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W
S0.C1E.Pmin TDP 16 17.5 W 10.0 W 17.0 W 9.9 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
800 MHz
1900 MHz
1400 MHz
1800 MHz
2600 MHz
S0.C0.P3
OPN HDX805WFK4FGI19
S0.C0.Px
55 oC to 71 oC
S0.C0.P3
70 oC
5 oC
C
S0.C0.P3
HDX810WFK4FGI19
55 oC to 71 oC
70 oC
5 oC
C
S0.C0.P0
2500 MHz
S0.C0.P3
1300 MHz
S0.C0.P1
S0.Cx.Px
S0.C1.Pmin
S0.C0.P2
S0.C0.P3
800 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
49AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.150 V N/A 1.150 V
VID_VDDNB Max 11,7 N/A 1.300 V N/A 1.300 V
IDDNB Max 12 N/A 20.0 A N/A 20.0 A
CPU COF 6
TDP 3,7 104.0 W 95.0 W 103.1 W 95.0 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.425 V 1.425 V 1.425 V 1.425 V
IDD Max 3,10 75.8 A 58.9 A 75.8 A 59.5 A
CPU COF 6
TDP 3,7 85.5 W 71.7 W 85.5 W 72.2 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V
IDD Max 3,10 68.5 A 40.8 A 68.5 A 41.6 A
CPU COF 6
TDP 3,7 79.5 W 57.2 W 79.5 W 58.0 W
VID_VDD Min 9 1.150 V 0.950 V 1.150 V 0.950 V
VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V
IDD Max 3,10 63.3 A 28.7 A 63.3 A 29.6 A
CPU COF 6
TDP 3,7 72.3 W 47.6 W 70.0 W 46.1 W
VID_VDD Min 9 1.150 V 0.875 V 1.150 V 0.850 V
VID_VDD Max 9 1.150 V 1.150 V 1.150 V 1.125 V
IDD Max 3,10 57.1 A 19.9 A 55.0 A 18.1 A
Core Power (Pre-Flush) 20 36.5 W 6.5 W 35.5 W 5.6 W
Core Power (Post-Flush) 20 33.5 W 4.3 W 32.5 W 3.6 W
NB Power 17 22.3 W 22.3 W 22.3 W 22.3 W
I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W
S0.C1E.Pmin TDP 16 17.0 W 9.9 W 16.1 W 9.5 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C0.P2
1400 MHz
1900 MHz
S0.C0.P1
S0.Cx.Px
S0.C0.P0
2600 MHz
55 oC to 71 oC55
oC to 71 oC
C
70 oC
5 oC
C
S0.C0.P3
S0.C0.P3
S0.C0.Px
HDX925WFK4DGI19
OPN HDX910WFK4DGI19
70 oC
5 oC
S0.C0.P3
S0.C0.P3
S0.C1.Pmin
2800 MHz
2100 MHz
1600 MHz
800 MHz
S0.C0.P3
800 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
50AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.150 V N/A 1.150 V
VID_VDDNB Max 11,7 N/A 1.300 V N/A 1.300 V
IDDNB Max 12 N/A 20.0 A N/A 20.0 A
CPU COF 6
TDP 3,7 107.4 W 95.0 W 106.5 W 95.0 W
VID_VDD Min 9 1.150 V 1.150 V 1.150 V 1.150 V
VID_VDD Max 9 1.425 V 1.425 V 1.425 V 1.425 V
IDD Max 3,10 75.9 A 57.1 A 75.8 A 57.5 A
CPU COF 6
TDP 3,7 87.6 W 72.2 W 87.6 W 72.6 W
VID_VDD Min 9 1.150 V 1.050 V 1.150 V 1.050 V
VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V
IDD Max 3,10 70.3 A 40.0 A 70.3 A 40.5 A
CPU COF 6
TDP 3,7 83.1 W 57.8 W 83.1 W 58.5 W
VID_VDD Min 9 1.150 V 0.950 V 1.150 V 0.950 V
VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V
IDD Max 3,10 66.4 A 28.5 A 66.4 A 29.1 A
CPU COF 6
TDP 3,7 77.7 W 48.8 W 75.9 W 47.2 W
VID_VDD Min 9 1.150 V 0.875 V 1.150 V 0.850 V
VID_VDD Max 9 1.150 V 1.150 V 1.150 V 1.125 V
IDD Max 3,10 61.8 A 20.5 A 60.2 A 18.7 A
Core Power (Pre-Flush) 20 39.6 W 7.9 W 38.7 W 6.9 W
Core Power (Post-Flush) 20 36.6 W 5.2 W 35.8 W 4.4 W
NB Power 17 22.3 W 22.3 W 22.3 W 22.3 W
I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W
S0.C1E.Pmin TDP 16 19.6 W 10.5 W 19.0 W 10.4 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
2800 MHz
2100 MHz
H
S0.C0.P3
S0.C0.P3
HDZ720WFK3DGI19
55 oC to 73 oC
70 oC
5 oC
S0.C1.Pmin
S0.C0.P2
1400 MHz
S0.C0.P3
800 MHz 800 MHz
1600 MHz
OPN HDX710WFK3DGI19
S0.C0.Px
55 oC to 73 oC
70 oC
5 oC
H
S0.C0.P1
1900 MHz
S0.C0.P3
S0.C0.P3
S0.Cx.Px
S0.C0.P0
2600 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
51AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.050 V N/A 1.050 V
VID_VDDNB Max 11,7 N/A 1.150 V N/A 1.150 V
IDDNB Max 12 N/A 15.1 A N/A 15.3 A
CPU COF 6
TDP 3,7 94.0 W 80.0 W 94.3 W 80.0 W
VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V
VID_VDD Max 9 1.425 V 1.425 V 1.425 V 1.425 V
IDD Max 3,10 67.8 A 50.1 A 67.9 A 50.0 A
CPU COF 6
TDP 3,7 65.6 W 60.7 W 65.6 W 60.7 W
VID_VDD Min 9 1.100 V 1.100 V 1.100 V 1.100 V
VID_VDD Max 9 1.325 V 1.325 V 1.325 V 1.325 V
IDD Max 3,10 49.2 A 35.8 A 49.1 A 35.6 A
CPU COF 6
TDP 3,7 49.8 W 48.3 W 49.7 W 48.3 W
VID_VDD Min 9 1.050 V 1.000 V 1.050 V 1.000 V
VID_VDD Max 9 1.225 V 1.225 V 1.225 V 1.225 V
IDD Max 3,10 41.1 A 26.1 A 41.0 A 25.9 A
CPU COF 6
TDP 3,7 44.5 W 35.4 W 44.9 W 36.8 W
VID_VDD Min 9 1.050 V 0.850 V 1.050 V 0.875 V
VID_VDD Max 9 1.075 V 1.075 V 1.100 V 1.100 V
IDD Max 3,10 36.0 A 14.4 A 36.4 A 15.6 A
Core Power (Pre-Flush) 20 23.9 W 5.7 W 24.2 W 6.3 W
Core Power (Post-Flush) 20 21.5 W 3.3 W 21.8 W 3.8 W
NB Power 17 14.9 W 14.9 W 15.1 W 15.1 W
I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W
S0.C1E.Pmin TDP 16 9.2 W 6.7 W 9.4 W 7.0 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C1.Pmin
S0.C0.P3
800 MHz
1800 MHz
800 MHz
S0.C0.P2
1900 MHz
S0.C0.P1
2400 MHz
HDX545WFK2DGI19
55 oC to 70 oC
70 oC
5 oC
2300 MHz
S0.C0.P3
P
S0.C0.P3
S0.C0.P3
3000 MHz
S0.C0.P3
S0.Cx.Px
S0.C0.P0
3100 MHz
OPN HDZ550WFK2DGI19
S0.C0.Px
55 oC to 70 oC
70 oC
5 oC
P
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
52AMD Phenom™ Processor
2.3.12 HD mmmm OC pnc GI (65 W, DT, AM3) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tc ase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.050 V N/A 1.050 V
VID_VDDNB Max 11,7 N/A 1.100 V N/A 1.100 V
IDDNB Max 12 N/A 14.6 A N/A 14.3 A
CPU COF 6
TDP 3,7 69.5 W 65.0 W 69.2 W 65.0 W
VID_VDD Min 9 1.050 V 1.025 V 1.050 V 1.025 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 58.0 A 43.0 A 58.0 A 43.2 A
CPU COF 6
TDP 3,7 60.8 W 51.7 W 60.6 W 54.2 W
VID_VDD Min 9 1.050 V 0.950 V 1.050 V 0.975 V
VID_VDD Max 9 1.175 V 1.175 V 1.200 V 1.200 V
IDD Max 3,10 49.5 A 31.9 A 49.5 A 34.0 A
CPU COF 6
TDP 3,7 55.7 W 44.7 W 54.4 W 44.0 W
VID_VDD Min 9 1.050 V 0.900 V 1.050 V 0.900 V
VID_VDD Max 9 1.125 V 1.125 V 1.125 V 1.125 V
IDD Max 3,10 45.9 A 25.6 A 45.1 A 25.1 A
CPU COF 6
TDP 3,7 48.9 W 37.7 W 47.8 W 35.9 W
VID_VDD Min 9 1.050 V 0.850 V 1.050 V 0.825 V
VID_VDD Max 9 1.075 V 1.075 V 1.050 V 1.050 V
IDD Max 3,10 40.6 A 18.6 A 39.8 A 17.3 A
Core Power (Pre-Flush) 20 24.1 W 5.6 W 23.6 W 5.0 W
Core Power (Post-Flush) 20 21.7 W 3.7 W 21.2 W 3.2 W
NB Power 17 N/A 14.8 W N/A 14.5 W
I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W
S0.C1E.Pmin TDP 16 10.4 W 7.0 W 10.1 W 6.6 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C1.Pmin
1400 MHz 1400 MHz
S0.C0.P3
800 MHz 800 MHz
S0.C0.P2
S0.C0.P1
1800 MHz 1900 MHz
S0.Cx.Px
S0.C0.P0
2400 MHz 2500 MHz
S0.C0.P3 S0.C0.P3
S0.C0.P3 S0.C0.P3
JJ
5 oC5
oC
S0.C0.Px
55 oC to 70 oC55
oC to 70 oC
70 oC 70 oC
HD900EOCK4DGI19 HD905EOCK4DGI19
OPN
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
53AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.050 V N/A 1.050 V
VID_VDDNB Max 11,7 N/A 1.100 V N/A 1.100 V
IDDNB Max 12 N/A 16.4 A N/A 16.1 A
CPU COF 6
TDP 3,7 71.3 W 65.0 W 71.0 W 65.0 W
VID_VDD Min 9 1.050 V 1.025 V 1.050 V 1.025 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 58.1 A 41.3 A 58.1 A 41.6 A
CPU COF 6
TDP 3,7 64.7 W 52.8 W 64.5 W 55.4 W
VID_VDD Min 9 1.050 V 0.950 V 1.050 V 0.950 V
VID_VDD Max 9 1.175 V 1.175 V 1.175 V 1.175 V
IDD Max 3,10 50.7 A 31.2 A 50.7 A 33.4 A
CPU COF 6
TDP 3,7 59.2 W 44.1 W 58.0 W 45.4 W
VID_VDD Min 9 1.050 V 0.875 V 1.050 V 0.875 V
VID_VDD Max 9 1.100 V 1.100 V 1.100 V 1.100 V
IDD Max 3,10 47.3 A 23.4 A 46.7 A 24.6 A
CPU COF 6
TDP 3,7 54.2 W 39.0 W 53.1 W 37.3 W
VID_VDD Min 9 1.050 V 0.825 V 1.050 V 0.800 V
VID_VDD Max 9 1.050 V 1.050 V 1.050 V 1.025 V
IDD Max 3,10 44.0 A 18.4 A 43.4 A 17.1 A
Core Power (Pre-Flush) 20 27.4 W 6.3 W 26.9 W 5.6 W
Core Power (Post-Flush) 20 25.0 W 4.1 W 24.6 W 3.5 W
NB Power 17 N/A 16.5 W N/A 16.3 W
I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W
S0.C1E.Pmin TDP 16 12.3 W 7.8 W 12.0 W 7.4 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
S0.C1.Pmin
S0.C0.P3
800 MHz 800 MHz
S0.C0.P2
1300 MHz 1300 MHz
S0.C0.P1
1800 MHz 1900 MHz
S0.Cx.Px
S0.C0.P0
2400 MHz 2500 MHz
S0.C0.P3 S0.C0.P3
5 oC5
oC
S0.C0.Px
55 oC to 72 oC55
oC to 72 oC
KK
S0.C0.P3 S0.C0.P3
70 oC70
oC
OPN HD700EOCK3DGI19 HD705EOCK3DGI19
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
54AMD Phenom™ Processor
2.3.13 HD mmmm WF pnc GM (95 W, DT, AM3) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.150 V
VID_VDDNB Max 11,7 N/A 1.250 V
IDDNB Max 12 N/A 15.4 A
CPU COF 6 800 MHz 3300 MHz
TDP 3,7 35.3 W 80.0 W
VID_VDD Min 9 1.150 V 1.225 V
VID_VDD Max 9 1.250 V 1.425 V
IDD Max 3,10 41.9 A 46.9 A
CPU COF 6 N/A 2600 MHz
TDP 3,7 N/ A 64. 2 W
VID_VDD Min 9 N/A 1.150 V
VID_VDD Max 9 N/A 1.325 V
IDD Max 3,10 N/A 35.5 A
CPU COF 6 N/A 2200 MHz
TDP 3,7 N/ A 53. 9 W
VID_VDD Min 9 N/A 1.075 V
VID_VDD Max 9 N/A 1.250 V
IDD Max 3,10 N/A 27.8 A
CPU COF 6 N/A 800 MHz
TDP 3,7 N/ A 35. 3 W
VID_VDD Min 9 N/A 0.875 V
VID_VDD Max 9 N/A 1.050 V
IDD Max 3,10 N/A 12.3 A
Core Power (Pre-Flush) 20 N/A 5.0 W
Core Power (Post-Flush) 20 N/A 3.2 W
NB Power 17 N/A 10.7 W
I/O Power 13 N/A 6.7 W
S0.C1E.Pmin TDP 16 N/A 6.6 W
S3 I/O Power 13 N/A 350 mW
5 oC
P
S0.C0.P3
S0.C0.P3
55 oC to 70 oC
HDZ560WFK2DGM21
70 oC
S0.C1.Pmin
S0.C0.P3
S0.C0.P1
S0.C0.P2
S0.C0.P0
S0.C0.Px
S0.Cx.Px
OPN
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
55AMD Phenom™ Processor
2.3.14 HD mmmm FB pnc GM (125 W, 140 W, DT, AM3) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.050 V
VID_VDDNB Max 11,7 N/A 1.150 V
IDDNB Max 12 N/A 17.0 A
CPU COF 6 800 MHz 3500 MHz
TDP 3,7 52.1 W 125.0 W
VID_VDD Min 9 1.050 V 1.225 V
VID_VDD Max 9 1.050 V 1.425 V
IDD Max 3,10 43.2 A 60.5 A
CPU COF 6 N/A 2800 MHz
TDP 3,7 N/A 94.1 W
VID_VDD Min 9 N/A 1.125 V
VID_VDD Max 9 N/A 1.350 V
IDD Max 3,10 N/A 60.5 A
CPU COF 6 N/A 2200 MHz
TDP 3,7 N/A 71.6 W
VID_VDD Min 9 N/A 1.050 V
VID_VDD Max 9 N/A 1.250 V
IDD Max 3,10 N/A 45.3 A
CPU COF 6 N/A 800 MHz
TDP 3,7 N/A 39.6 W
VID_VDD Min 9 N/A 0.825 V
VID_VDD Max 9 N/A 1.050 V
IDD Max 3,10 N/A 17.2 A
Core Power (Pre-Flush) 20 N/A 5.9 W
Core Power (Post-Flush) 20 N/A 4.7 W
NB Power 17 N/A 8.2 W
I/O Power 13 N/A 6.7 W
S0.C1E.Pmin TDP 16 N/A 8.1 W
S3 I/O Power 13 350 mW 350 mW
S0.C0.P3
S0.C1.Pmin
S0.C0.P0
S0.C0.P0
S0.Cx.Px
S0.C0.P0
S0.C0.P1
S0.C0.P2
OPN HDZ970FBK4DGM21
S0.C0.Px
55 oC to 62 oC
70 oC
5 oC
I
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
56AMD Phenom™ Processor
2.3.15 HD mmmm WF pnc GR (95 W, DT, AM3) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5 S0.C0.P0 S0.C0.P3 S0.C0.P0 S0.C0.P3
HTC P-State 4 S0.C0.P0 S0.C0.P3 S0.C0.P0 S0.C0.P3
NB COF 6,7 2000 MHz 2000 MHz 2000 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.050 V N/A 1.050 V
VID_VDDNB Max 11,7 N/A 1.175 V N/A 1.175 V
IDDNB Max 12 N/A 15.4 A N/A 14.9 A
CPU COF 6 N/A 3100 MHz N/A 3300 MHz
C-State Count 23 N/A 3 N/A 3
TDP 22 N/A 95.0 W N/A 95.0 W
VID_VDD Min 9 N/A 1.225 V N/A 1.225 V
VID_VDD Max 9 N/A 1.425 V N/A 1.425 V
IDD Max 3,10 N/A 80.0 A N/A 80.0 A
CPU COF 6 800 MHz 2600 MHz 800 MHz 2800 MHz
TDP 3,7 47.8 W 95.0 W 46.3 W 95.0 W
VID_VDD Min 9 0.975 V 1.075 V 0.975 V 1.075 V
VID_VDD Max 9 1.175 V 1.375 V 1.175 V 1.375 V
IDD Max 3,10 27.9 A 68.7 A 26.9 A 70.0 A
CPU COF 6 N/A 2000 MHz N/A 2200 MHz
TDP 3,7 N/A 78.3 W N/A 78.4 W
VID_VDD Min 9 N/A 1.050 V N/A 1.050 V
VID_VDD Max 9 N/A 1.350 V N/A 1.350 V
IDD Max 3,10 N/A 54.8 A N/A 56.6 A
CPU COF 6 N/A 1400 MHz N/A 1500 MHz
TDP 3,7 N/A 59.9 W N/A 58.5 W
VID_VDD Min 9 N/A 1.000 V N/A 1.000 V
VID_VDD Max 9 N/A 1.300 V N/A 1.300 V
IDD Max 3,10 N/A 39.9 A N/A 40.2 A
CPU COF 6 N/A 800 MHz N/A 800 MHz
TDP 3,7 N/A 47.8 W N/A 46.3 W
VID_VDD Min 9 N/A 0.975 V N/A 0.975 V
VID_VDD Max 9 N/A 1.175 V N/A 1.175 V
IDD Max 3,10 N/A 27.9 A N/A 26.9 A
Core Power (Pre-Flush) 20 N/A 13.0 W N/A 12.4 W
Core Power (Post-Flush) 20 N/A 9.8 W N/A 9.2 W
NB Power 17 N/A 9.7 W N/A 9.4 W
I/O Power 13 N/A 6.1 W N/A 6.1 W
S0.C1E.Pmin TDP 16 N/A 12.1 W N/A 11.4 W
S3 I/O Power 13 N/A 300 mW N/A 300 mW
S0.C1.Pmin
S0.C0.Pb0
S0.C0.P2
S0.C0.P3
S0.C0.P1
55 oC to 71 oC
70 oC
5 oC
AD
S0.C0.P0
HDT55TWFK6DGR21
55 oC to 71 oC
70 oC
5 oC
AD
S0.Cx.Px
OPN HDT35TWFK6DGR21
S0.C0.Px
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
57AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Spe cification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5 S0.C0.P0 S0.C0.P3
HTC P-State 4 S0.C0.P0 S0.C0.P3
NB COF 6,7 2000 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.050 V
VID_VDDNB Max 11,7 N/A 1.175 V
IDDNB Max 12 N/A 15.2 A
CPU COF 6 N/A 3200 MHz
C-State Count 23 N/A 3
TDP 22 N/A 95.0 W
VID_VDD Min 9 N/A 1.225 V
VID_VDD Max 9 N/A 1.425 V
IDD Max 3,10 N/A 80.0 A
CPU COF 6 800 MHz 2700 MHz
TDP 3,7 47.1 W 95.0 W
VID_VDD Min 9 0.975 V 1.075 V
VID_VDD Max 9 1.175 V 1.375 V
IDD Max 3,10 27.4 A 69.5 A
CPU COF 6 N/A 2000 MHz
TDP 3,7 N/A 76.4 W
VID_VDD Min 9 N/A 1.050 V
VID_VDD Max 9 N/A 1.350 V
IDD Max 3,10 N/A 54.0 A
CPU COF 6 N/A 1400 MHz
TDP 3,7 N/A 58.3 W
VID_VDD Min 9 N/A 1.000 V
VID_VDD Max 9 N/A 1.300 V
IDD Max 3,10 N/A 39.3 A
CPU COF 6 N/A 800 MHz
TDP 3,7 N/A 47.1 W
VID_VDD Min 9 N/A 0.975 V
VID_VDD Max 9 N/A 1.175 V
IDD Max 3,10 N/A 27.4 A
Core Power (Pre-Flush) 20 N/A 12.7 W
Core Power (Post-Flush) 20 N/A 9.5 W
NB Power 17 N/A 9.6 W
I/O Power 13 N/A 6.1 W
S0.C1E.Pmin TDP 16 N/A 11.8 W
S3 I/O Power 13 N/A 300 mW
S0.C0.P2
S0.C0.P3
S0.C1.Pmin
S0.Cx.Px
S0.C0.Pb0
S0.C0.P0
S0.C0.P1
OPN HDT45TWFK6DGR21
S0.C0.Px
55 oC to 71 oC
70 oC
5 oC
AD
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
58AMD Phenom™ Processor
2.3.16 HD mmmm FB pnc GR (125 W, DT, AM3) Thermal and Power Specifications
The notes for this table are on page 60 and page 61.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5 S0.C0.P0 S0.C0.P3 S0.C0.P0 S0.C0.P3
HTC P-State 4 S0.C0.P0 S0.C0.P3 S0.C0.P0 S0.C0.P3
NB COF 6,7 2000 MHz 2000 MHz 2000 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.050 V N/A 1.050 V
VID_VDDNB Max 11,7 N/A 1.175 V N/A 1.175 V
IDDNB Max 12 N/A 17.0 A N/A 16.2 A
CPU COF 6 N/A 3300 MHz N/A 3600 MHz
C-State Count 23 N/A 3 N/A 3
TDP 22 N/A 125.0 W N/A 125.0 W
VID_VDD Min 9 N/A 1.250 V N/A 1.250 V
VID_VDD Max 9 N/A 1.475 V N/A 1.475 V
IDD Max 3,10 N/A 95.0 A N/A 95.0 A
CPU COF 6 800 MHz 2800 MHz 800 MHz 3200 MHz
TDP 3,7 55.4 W 125.0 W 53.1 W 125.0 W
VID_VDD Min 9 1.000 V 1.150 V 1.000 V 1.150 V
VID_VDD Max 9 1.225 V 1.475 V 1.225 V 1.475 V
IDD Max 3,10 32.9 A 89.7 A 31.4 A 92.8 A
CPU COF 6 N/A 2200 MHz N/A 2400 MHz
TDP 3,7 N/A 101.0 W N/A 98.5 W
VID_VDD Min 9 N/A 1.100 V N/A 1.100 V
VID_VDD Max 9 N/A 1.400 V N/A 1.400 V
IDD Max 3,10 N/A 69.5 A N/A 69.9 A
CPU COF 6 N/A 1500 MHz N/A 1600 MHz
TDP 3,7 N/A 77.3 W N/A 75.7 W
VID_VDD Min 9 N/A 1.050 V N/A 1.050 V
VID_VDD Max 9 N/A 1.325 V N/A 1.325 V
IDD Max 3,10 N/A 50.9 A N/A 50.4 A
CPU COF 6 N/A 800 MHz N/A 800 MHz
TDP 3,7 N/A 55.4 W N/A 53.1 W
VID_VDD Min 9 N/A 1.000 V N/A 1.000 V
VID_VDD Max 9 N/A 1.225 V N/A 1.225 V
IDD Max 3,10 N/A 32.9 A N/A 31.4 A
Core Power (Pre-Flush) 20 N/A 16.4 W N/A 15.4 W
Core Power (Post-Flush) 20 N/A 12.9 W N/A 12.0 W
NB Power 17 N/A 10.8 W N/A 10.3 W
I/O Power 13 N/A 6.1 W N/A 6.1 W
S0.C1E.Pmin TDP 16 N/A 15.8 W N/A 14.8 W
S3 I/O Power 13 N/A 300 mW N/A 300 mW
S0.C1.Pmin
S0.Cx.Px
S0.C0.Pb0
S0.C0.P0
S0.C0.P1
S0.C0.P2
70 oC
5 oC5
oC
S0.C0.P3
OPN HDT55TFBK6DGR21 HDT90ZFBK6DGR21
S0.C0.Px
55 oC to 62 oC55
oC to 62 oC
AE AE
70 oC
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
59AMD Phenom™ Processor
The notes for this table are on page 60 and page 61.
State Specification8 Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5 S0.C0.P0 S0.C0.P3
HTC P-State 4 S0.C0.P0 S0.C0.P3
NB COF 6,7 2000 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.050 V
VID_VDDNB Max 11,7 N/A 1.175 V
IDDNB Max 12 N/A 16.5 A
CPU COF 6 N/A 3500 MHz
C-State Count 23 N/A 3
TDP 22 N/A 125.0 W
VID_VDD Min 9 N/A 1.250 V
VID_VDD Max 9 N/A 1.475 V
IDD Max 3,10 N/A 95.0 A
CPU COF 6 800 MHz 3000 MHz
TDP 22 53.8 W 125.0 W
VID_VDD Min 9 1.000 V 1.150 V
VID_VDD Max 9 1.225 V 1.475 V
IDD Max 3,10 31.9 A 91.5 A
CPU COF 6 N/A 2300 MHz
TDP 22 N/A 99.5 W
VID_VDD Min 9 N/A 1.100 V
VID_VDD Max 9 N/A 1.400 V
IDD Max 3,10 N/A 69.5 A
CPU COF 6 N/A 1600 MHz
TDP 22 N/A 77.0 W
VID_VDD Min 9 N/A 1.050 V
VID_VDD Max 9 N/A 1.325 V
IDD Max 3,10 N/A 51.2 A
CPU COF 6 N/A 800 MHz
TDP 22 N/A 53.8 W
VID_VDD Min 9 N/A 1.000 V
VID_VDD Max 9 N/A 1.225 V
IDD Max 3,10 N/A 31.9 A
Core Power (Pre-Flush) 20 N/A 15.7 W
Core Power (Post-Flush) 20 N/A 12.1 W
NB Power 17 N/A 10.3 W
I/O Power 13 N/A 6.1 W
S0.C1E.Pmin TDP 16 N/A 14.4 W
S3 I/O Power 13 N/A 300 mW
AE
HDT75TFBK6DGR21
55 oC to 62 oC
70 oC
5 oC
S0.C1.Pmin
S0.Cx.Px
S0.C0.Pb0
S0.C0.P0
S0.C0.P1
S0.C0.P2
S0.C0.P3
OPN
S0.C0.Px
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
60AMD Phenom™ Processor
AMD Phenom™ Processor Thermal and Power Specification Table Notes:
1. Tcase Max is the maximum case temperature specification which is a physical value in degrees
Celsius. Tcase Max can be any valid Tcase Max value in the range specified for the corresponding
OPN.
2. Tctl Max (maximum control temperature) is a non-physical temperature on an arbitrary scale that can be
used for system thermal management policies. Refer to the
BIOS and Kernel Developer’s Guide (BKDG)
for AMD Family 10h Processors, order# 31116.
3. The processor thermal solution should be designed to accommodate thermal design power (TDP) at
Tcase Max. TDP is measured under the conditions of all cores operating at CPU COF, Tcase Max, and
VDD at the voltage requested by the processor. TDP includes all power dissipated on-die from VDD,
VDDNB, VDDIO, VLDT, VTT, and VDDA. TDP is not the maximum power of the processor.
4. P-state limit when HTC is active. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD
Family 10h Processors, order# 31116 for more information.
5. Hardware transitions the part to startup P-state at cold boot. During initialization, the startup NB COF
and VID_VDDNB values may differ from those of the startup P-state. Please see the BIOS and Kernel
Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116 for detailed power sequencing
information.
6. Frequency reported to the OS is rounded to the nearest 100-MHz boundary.
7. During initialization, the startup NB COF and VID_VDDNB values may differ from those of the startup
P-state. Please see the BIOS and Kernel Developer’s Guide (BKDG) For AMD Family 10h Processors,
order# 31116 for specific power sequencing information.
8. Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and
equivalent Tcase conditions for all cores. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 10h Processors, order #31116, for details on P-state operation for multi-core processors.
9. Variable voltage, any valid voltage between VID_VDD Min and VID_VDD Max is allowed.
10. TDP IDD conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDD Max
specification.
11. Single-plane platforms have VID_VDD and VID_VDDNB tied together, and use the VID_VDD
specification.
12. TDP IDDNB conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDDNB
Max specification.
13. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only. Assumes
VDDIO = 1.8 V and VTT = VDDIO / 2.
14. Refer to erratum 308 in the Revision Guide for AMD Family 10h Processors, order# 41322 for the
appropriate clock divisor setting.
15. Assumes 50°C, Min P-state VID_VDD, core clock divider set to 128, and L2 and data cache scrubbing
disabled. Refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors,
order# 31116 for recommended settings.
16. Assumes 35°C, min P-state VID_VDD, core clock divider set to 16, HyperTransport™ link s
disconnected, memory in self-refresh mode, and DDR2 SDRAM interface tristated. Recommended
settings in the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order#
31116, provide improved power values.
17. Thermal Design Power dissipated by the processor at min P-state VID_VDDNB.
18. Thermal Design Power dissipated by the processor at min P-state VID_VDD.
19. This product is recommended for dual-plane platforms only.
20. Core Power (Pre-Flush) and (Post-Flush) refers to the Cache Flush On Halt feature described in the
BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116. Core Power
pre-flush and post-flush values are based on the recommended BKDG settings. Actual C1 idle core
power varies with system usage according to the following equation:
C1 idle Core Power = F3xDC[CashFlushOnHaltTmr]/OS timer tick interval * Core Power (Pre-Flush) +
(1 - F3xDC[CachFlushOnHaltTmr]/OS timer tick interval * Core Power (Post-Flush))
The default Microsoft
®
Windows Vista
®
timer tick interval is 15.6 ms. This interval varies between
operating systems and within an operating system depending on usage.
21. Valid for dual-plane operation only.
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
61AMD Phenom™ Processor
AMD Phenom™ Processor Thermal and Power Specification Table Notes (Continued):
22. The processor thermal solution should be designed to accommodate thermal design power (TDP) at
Tcase Max. TDP in this state is measured at Tcase Max and VDD at the voltage requested by the
processor with the number of cores in the C1 state specified by C-State Count. TDP includes all power
dissipated on-die from VDD, VDDNB, VDDIO, VLDT, VTT, and VDDA. Due to increased power density
in the state, the processor has an increased probability of hardware thermal control (HTC) activation
compared to S0.C0.P1 at the same ambient temperature. TDP is not the maximum power of the
processor.
23. C-State Count indicates the minimum number of cores in the C1 state required for the remaining cores
to enter this P-state. Refer to F4x164[CstateCnt] in the BIOS and Kernel Developer's Guide (BKDG) for
AMD Family 10h Processors, order# 31116, for more details about the entry requirements into this
P-state.
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
62AMD Athlon™ Processor
3 AMD Athlon™ Processor
The following sections contain the OPN description and thermal and power specifications for the
AMD Athlon™ Processor. Each column in the thermal and power tables represents a specific
Ordering Part Number (OPN). Section 3.1 provides an example of the OPN structure for this
processor family.
3.1 AMD Athlon™ Processor Ordering Part Number Description
Figure 3. AMD Athlon™ Processor Ordering Part Number Diagram
Figure 4. AMD Athlon™ Processor Ordering Part Number Example
Part Definition
Cache Size
Number of Cores
Package
Roadmap
Model
Brand
Segment
b s mmmm rr p n c dd
A D 6500 WC J 2 B GH
Part Definition: GH (see Table 9)
Cache Size: B (see Table 10)
Number of Cores: 2 (see Table 11)
Package: J (see Table 12)
Roadmap: WC (see Table 13)
Model Number: 6500 (see Table 14)
Brand: A = AMD Athlon™ Processor
Segment: D = Desktop
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
63AMD Athlon™ Processor
Table 9. AMD Athlon™ Processor Part Definition Options
Part
Definition Revision CPUID 8000_0001h EAX [31:0]
(CPUID)
GQ Rev C2 00100F62h
GM Rev C3 00100F43h, 00100F53h, 00100F63h
Table 10. AMD Athlon™ Processor Cache Size Options
OPN
Character L2 Cache Size L3 Cache Size
2 512 KB 0 KB
3 1024 KB 0 KB
Table 11. AMD Athlon™ Processor Number of Cores
OPN
Character
Number of
Cores
22
33
44
Table 12. AMD Athlon™ Processor Package Options
OPN
Character Package
KAM3
Table 13. AMD Athlon™ Processor Roadmap Options
OPN
Character Max TDP Socket
Infrastructure
IDD Max
(VDD)
IDD Max
(NB) HS Class
HD 45 W AM3 45 A 20 A HS 44
OC 65 W AM3 60 A 20 A HS 55
WF 95 W AM3 80 A 20 A HS 65
SC 25 W AM3 20 A 20 A HS 27
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
64AMD Athlon™ Processor
Table 14. AMD Athlon™ Processor Model Number Options
Model
Number
Core
Frequency
Single-Plane
NB Frequency
Dual-Plane NB
Frequency
Number
of Cores
Max DDR
Speed
Max HT Link
Speed
270U 2000 MHz 1800 MHz 1800 MHz 2 1333 MT/s 3600 MT/s
610E 2400 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s
415E 2500 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s
615E 2500 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s
420E 2600 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s
X220 2800 MHz 1600 MHz 2000 MHz 2 1066 MT/s 4000 MT/s
245E 2900 MHz 1600 MHz 2000 MHz 2 1333 MT/s 4000 MT/s
X250 3000 MHz 1600 MHz 2000 MHz 2 1066 MT/s 4000 MT/s
X640 3000 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s
X645 3100 MHz 1600 MHz 2000 MHz 4 1333 MT/s 4000 MT/s
250E 3000 MHz 1600 MHz 2000 MHz 2 1333 MT/s 4000 MT/s
X445 3100 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s
X260 3200 MHz 1600 MHz 2000 MHz 2 1333 MT/s 4000 MT/s
X450 3200 MHz 1600 MHz 2000 MHz 3 1333 MT/s 4000 MT/s
X265 3300 MHz 1600 MHz 2000 MHz 2 1333 MT/s 4000 MT/s
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
65AMD Athlon™ Processor
Table 15. AMD Athlon™ Processor Thermal Profiles
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between partspecific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
Thermal Profile N
Heat S ink Class HS55
Heat S ink Thermal
Re si s tance 0.48°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Re si s tance 0.400°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 56.0°C
25.0 W 58.0°C
30.0 W 60.0°C
35.0 W 62.0°C
40.0 W 64.0°C
45.0 W 66.0°C
50.0 W 68.0°C
55.0 W 70.0°C
60.0 W 72.0°C
65.0 W 74.0°C
Thermal Profile S
Heat S ink Class HS44
Heat S ink Thermal
Re si s tance 0.66°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Re si s tance 0.533°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 56.0°C
20.0 W 58.7°C
25.0 W 61.3°C
30.0 W 64.0°C
35.0 W 66.7°C
40.0 W 69.3°C
45.0 W 72.0°C
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
66AMD Athlon™ Processor
Table 15: AMD Athlon™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between partspecific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications are
met.
Thermal Profile W
Heat S ink Class HS27
Heat S ink Thermal
Resistance 1.56°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Resistance 1.320°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 61.2°C
15.0 W 67.8°C
20.0 W 74.4°C
25.0 W 81.0°C
Thermal Profile Z
Heat S ink Class HS65
Heat S ink Thermal
Re si s tance 0.34°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Re si s tance 0.284°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.0°C
25.0 W 55.1°C
30.0 W 56.5°C
35.0 W 57.9°C
40.0 W 59.4°C
45.0 W 60.8°C
50.0 W 62.2°C
55.0 W 63.6°C
60.0 W 65.0°C
65.0 W 66.5°C
70.0 W 67.9°C
75.0 W 69.3°C
80.0 W 70.7°C
85.0 W 72.1°C
90.0 W 73.6°C
95.0 W 75.0°C
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
67AMD Athlon™ Processor
Table 15: AMD Athlon™ Processor Thermal Profiles (Continued)
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between partspecific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.
Thermal Profile AA
Heat S ink Class HS65
Heat S ink Thermal
Re si s tance 0.30°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Re si s tance 0.242°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0 °C
5.0 W 55.0 °C
10.0 W 55.0 °C
15.0 W 55.0 °C
20.0 W 55.0 °C
25.0 W 55.0 °C
30.0 W 55.3 °C
35.0 W 56.5 °C
40.0 W 57.7 °C
45.0 W 58.9 °C
50.0 W 60.1 °C
55.0 W 61.3 °C
60.0 W 62.5 °C
65.0 W 63.7 °C
70.0 W 64.9 °C
75.0 W 66.2 °C
80.0 W 67.4 °C
85.0 W 68.6 °C
90.0 W 69.8 °C
95.0 W 71.0 °C
Thermal Profile AB
Heat S ink Class HS44
Heat S ink Thermal
Re si s tance 0.65°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Re si s tance 0.533°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0 °C
5.0 W 55.0 °C
10.0 W 55.0 °C
15.0 W 56.0 °C
20.0 W 58.7 °C
25.0 W 61.3 °C
30.0 W 64.0 °C
35.0 W 66.7 °C
40.0 W 69.3 °C
45.0 W 72.0 °C
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
68AMD Athlon™ Processor
3.2 AMD Athlon™ Processor Thermal and Power Table Guide
The thermal and power table guide shown in Table 16 maps SOPNs and the properties associated
with their defined characters to the proper thermal and power table subsections and page numbers.
This table is designed to be used as a quick reference for finding the appropriate subsection for the
thermal and power tables corresponding to an SOPN.
Table 16. AMD Athlon™ Processor Thermal and Power Table Guide
SOPN Power Revision Thermal/Power
Tables
AD mmmm OC pnc GQ 65 W C2 Section 3.3.1 on
page 70
AD mmmm WF pnc GM 95 W C3 Section 3.3.2 on
page 71
AD mmmm OC pnc GM 65 W C3 Section 3.3.3 on
page 73
AD mmmm HD pnc GM 45 W C3 Section 3.3.4 on
page 76
AD mmmm SC pnc GM 25 W C3 Section 3.3.5 on
page 80
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
69AMD Athlon™ Processor
3.3 AMD Athlon™ Processor Thermal and Power Specifications
The thermal and power specification tables contain the thermal and power requirements for each
OPN. This includes the information necessary for thermal management (for example, heat sink
requirements, temperature assumptions) and power delivery (for example, voltage, current, and
power dissipation for each P-state). Refer to the AMD Family 10h Processor Electrical Data Sheet,
order# 40014, for all other electrical specifications for the processor. Refer to the BIOS and Kernel
Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for power management
BIOS requirements.
Section 3.1 on page 62 provides an example of the OPN structure for processors documented in this
chapter and Table 16 on page 68 provides a guide to OPN organization in the following subsections.
Refer to Section 1.2 on page 9 and Section 1.3 on page 10 for numbering conventions and
terminology definitions used in these tables.
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
70AMD Athlon™ Processor
3.3.1 AD mmmm OC pnc GQ (65 W, DT, AM3) Thermal and Power Specifications
The notes for this table are on page 81.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.150 V
VID_VDDNB Max 11,7 N/A 1.200 V
IDDNB Max 12 N/A 3.7 A
CPU COF 6
TDP 3,7 61.8 W 60.2 W
VID_VDD Min 9 1.200 V 1.200 V
VID_VDD Max 9 1.425 V 1.425 V
IDD Max 3,10 45.0 A 41.6 A
CPU COF 6
TDP 3,7 55.4 W 51.2 W
VID_VDD Min 9 1.125 V 1.100 V
VID_VDD Max 9 1.325 V 1.325 V
IDD Max 3,10 40.7 A 30.2 A
CPU COF 6
TDP 3,7 51.7 W 37.2 W
VID_VDD Min 9 1.125 V 1.000 V
VID_VDD Max 9 1.225 V 1.225 V
IDD Max 3,10 37.7 A 21.8 A
CPU COF 6
TDP 3,7 44.3 W 23.1 W
VID_VDD Min 9 1.125 V 0.850 V
VID_VDD Max 9 1.125 V 1.075 V
IDD Max 3,10 31.5 A 11.8 A
Core Power (Pre-Flush) 20 18.8 W 3.7 W
Core Power (Post-Flush) 20 17.6 W 2.9 W
NB Power 17 N/A 1.7 W
I/O Power 13 6.5 W 6.5 W
S0.C1E.Pmin TDP 16 13.4 W 3.5 W
S3 I/O Power 13 350 mW 350 mW
800 MHz
5 oC
70 oC
ADX250OCK23GQ19
N
S0.C0.Px
55 oC to 74 oC
OPN
S0.C0.P3
3000 MHz
1800 MHz
S0.C0.P3
S0.C0.P0
S0.C0.P3
S0.Cx.Px
S0.C1.Pmin
S0.C0.P1
2300 MHz
S0.C0.P2
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
71AMD Athlon™ Processor
3.3.2 AD mmmm WF pnc GM (95 W, DT, AM3) Thermal and Power Specifications
The notes for this table are on page 81.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.125 V N/A 1.125 V
VID_VDDNB Max 11,7 N/A 1.175 V N/A 1.175 V
IDDNB Max 12 N/A 12.8 A N/A 12.4 A
CPU COF 6
TDP 3,7 99.4 W 95.0 W 99.0 W 95.0 W
VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V
VID_VDD Max 9 1.400 V 1.400 V 1.400 V 1.400 V
IDD Max 3,10 75.9 A 70.1 A 75.7 A 63.7 A
CPU COF 6
TDP 3,7 70.8 W 68.5 W 70.9 W 68.6 W
VID_VDD Min 9 1.125 V 1.100 V 1.125 V 1.100 V
VID_VDD Max 9 1.300 V 1.300 V 1.300 V 1.300 V
IDD Max 3,10 57.0 A 49.2 A 57.1 A 44.9 A
CPU COF 6
TDP 3,7 64.1 W 51.6 W 64.2 W 51.8 W
VID_VDD Min 9 1.125 V 1.000 V 1.125 V 1.000 V
VID_VDD Max 9 1.200 V 1.200 V 1.200 V 1.200 V
IDD Max 3,10 51.0 A 34.8 A 51.1 A 31.9 A
CPU COF 6
TDP 3,7 50.6 W 33.4 W 49.3 W 32.7 W
VID_VDD Min 9 1.125 V 0.850 V 1.125 V 0.850 V
VID_VDD Max 9 1.150 V 1.050 V 1.150 V 1.050 V
IDD Max 3,10 39.0 A 17.2 A 37.9 A 14.8 A
Core Power (Pre-Flush) 20 20.1 W 5.5 W 19.4 W 4.5 W
Core Power (Post-Flush) 20 17.6 W 3.9 W 16.9 W 3.0 W
NB Power 17 N/A 9.4 W N/A 2.4 W
I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W
S0.C1E.Pmin TDP 16 10.9 W 5.1 W 9.4 W 4.5 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
AA
S0.C0.P3
ADX645WFK42GM19
55 oC to 71 oC
70 oC
5 oC
1900 MHz
800 MHz
3100 MHz
2400 MHz
S0.C0.P3
AA
S0.C0.P3
S0.Cx.Px
S0.C0.P0
3000 MHz
S0.C0.P3
800 MHz
OPN ADX640WFK42GM19
S0.C0.Px
55 oC to 71 oC
70 oC
5 oC
S0.C0.P3
S0.C1.Pmin
S0.C0.P1
2300 MHz
S0.C0.P2
1800 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
72AMD Athlon™ Processor
The notes for this table are on page 81.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.125 V N/A 1.125 V
VID_VDDNB Max 11,7 N/A 1.200 V N/A 1.175 V
IDDNB Max 12 N/A 16.4 A N/A 14.9 A
CPU COF 6
TDP 3, 7 103.4 W 95.0 W 103.0 W 95.0 W
VID_VDD Min 9 1.200 V 1.200 V 1.200 V 1.200 V
VID_VDD Max 9 1.500 V 1.500 V 1.500 V 1.500 V
IDD Max 3,10 77.1 A 59.3 A 77.0 A 59.6 A
CPU COF 6
TDP 3, 7 75.4 W 70.7 W 73.5 W 70.7 W
VID_VDD Min 9 1.125 V 1.100 V 1.125 V 1.100 V
VID_VDD Max 9 1.400 V 1.400 V 1.400 V 1.400 V
IDD Max 3,10 59.7 A 41.9 A 59.4 A 42.3 A
CPU COF 6
TDP 3, 7 70.0 W 55.1 W 69.1 W 57.3 W
VID_VDD Min 9 1.125 V 1.000 V 1.125 V 1.025 V
VID_VDD Max 9 1.300 V 1.300 V 1.325 V 1.325 V
IDD Max 3,10 55.4 A 30.0 A 55.4 A 32.1 A
CPU COF 6
TDP 3, 7 59.3 W 38.1 W 58.5 W 37.4 W
VID_VDD Min 9 1.125 V 0.850 V 1.125 V 0.850 V
VID_VDD Max 9 1.175 V 1.150 V 1.150 V 1.150 V
IDD Max 3,10 46.8 A 15.4 A 46.0 A 15.2 A
Core Power (Pre-Flush) 20 26.9 W 5.2 W 26.5 W 5.1 W
Core Power (Post-Flush) 20 24.2 W 3.7 W 23.7 W 3.7 W
NB Power 17 N/A 11.8 W N/A 11.6 W
I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W
S0.C1E.Pmin TDP 16 14.9 W 7.6 W 14.6 W 7.4 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
ADX450WFK32GM19
55 oC to 75 oC
70 oC
5 oC
800 MHz
S0.C0.P3
3200 MHz
2500 MHz
2000 MHz
S0.C1.Pmin
ADX445WFK32GM19
55 oC to 75 oC
70 oC
5 oC
OPN
Z
S0.C0.P3
S0.C0.P2
S0.C0.Px
S0.Cx.Px
S0.C0.P0
Z
S0.C0.P3
S0.C0.P3
S0.C0.P3
3100 MHz
2400 MHz
1900 MHz
800 MHz
S0.C0.P1
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
73AMD Athlon™ Processor
3.3.3 AD mmmm OC pnc GM (65 W, DT, AM3) Thermal and Power Specifications
The notes for this table are on page 81.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.150 V
VID_VDDNB Max 11,7 N/A 1.175 V
IDDNB Max 12 N/A 4.0 A
CPU COF 6
TDP 3,7 61.8 W 60.2 W
VID_VDD Min 9 1.200 V 1.200 V
VID_VDD Max 9 1.400 V 1.400 V
IDD Max 3,10 44.9 A 41.1 A
CPU COF 6
TDP 3,7 45.0 W 43.5 W
VID_VDD Min 9 1.100 V 1.100 V
VID_VDD Max 9 1.300 V 1.300 V
IDD Max 3,10 34.2 A 29.5 A
CPU COF 6
TDP 3,7 41.1 W 31.9 W
VID_VDD Min 9 1.100 V 1.000 V
VID_VDD Max 9 1.200 V 1.200 V
IDD Max 3,10 30.8 A 20.8 A
CPU COF 6
TDP 3,7 34.0 W 19.3 W
VID_VDD Min 9 1.100 V 0.825 V
VID_VDD Max 9 1.125 V 1.025 V
IDD Max 3,10 24.5 A 9.9 A
Core Power (Pre-Flush) 20 15.1 W 3.4 W
Core Power (Post-Flush) 20 13.2 W 2.5 W
NB Power 17 N/A 2.1 W
I/O Power 13 6.5 W 6.5 W
S0.C1E.Pmin TDP 16 9.4 W 4.4 W
S3 I/O Power 13 350 mW 350 mW
1900 MHz
S0.C0.P3
ADX260OCK23GM19
S0.C0.P3
55 oC to 74 oC
70 oC
5 oC
N
OPN
S0.C0.Px
S0.C0.P0
3200 MHz
2500 MHz
S0.C0.P3
S0.Cx.Px
800 MHz
S0.C1.Pmin
S0.C0.P2
S0.C0.P1
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
74AMD Athlon™ Processor
The notes for this table are on page 81.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.175 V
VID_VDDNB Max 11,7 N/A 1.175 V
IDDNB Max 12 N/A 4.2 A
CPU COF 6
TDP 3,7 62.1 W 60.2 W
VID_VDD Min 9 1.200 V 1.200 V
VID_VDD Max 9 1.500 V 1.500 V
IDD Max 3,10 44.9 A 40.9 A
CPU COF 6
TDP 3,7 48.4 W 43.6 W
VID_VDD Min 9 1.150 V 1.100 V
VID_VDD Max 9 1.400 V 1.400 V
IDD Max 3,10 36.4 A 29.5 A
CPU COF 6
TDP 3,7 43.7 W 31.5 W
VID_VDD Min 9 1.150 V 1.000 V
VID_VDD Max 9 1.300 V 1.300 V
IDD Max 3,10 32.3 A 20.4 A
CPU COF 6
TDP 3,7 36.7 W 19.1 W
VID_VDD Min 9 1.150 V 0.825 V
VID_VDD Max 9 1.150 V 1.125 V
IDD Max 3,10 26.3 A 9.6 A
Core Power (Pre-Flush) 20 19.7 W 3.8 W
Core Power (Post-Flush) 20 18.1 W 3.0 W
NB Power 17 N/A 2.1 W
I/O Power 13 6.5 W 6.5 W
S0.C1E.Pmin TDP 16 12.1 W 4.3 W
S3 I/O Power 13 350 mW 350 mW
800 MHz
S0.Cx.Px
S0.C0.P0
3300 MHz
S0.C0.P1
2600 MHz
OPN ADX265OCK23GM19
S0.C0.Px
55 oC to 74 oC
70 oC
5 oC
N
S0.C0.P3
S0.C0.P3
S0.C1.Pmin
S0.C0.P2
1900 MHz
S0.C0.P3
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
75AMD Athlon™ Processor
The notes for this table are on page 81.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.125 V
VID_VDDNB Max 11,7 N/A 1.200 V
IDDNB Max 12 N/A 17.4 A
CPU COF 6
TDP 3,7 69.7 W 65.0 W
VID_VDD Min 9 1.100 V 1.050 V
VID_VDD Max 9 1.400 V 1.400 V
IDD Max 3,10 56.9 A 43.6 A
CPU COF 6
TDP 3,7 64.8 W 55.5 W
VID_VDD Min 9 1.100 V 1.000 V
VID_VDD Max 9 1.250 V 1.250 V
IDD Max 3,10 52.9 A 35.0 A
CPU COF 6
TDP 3,7 61.6 W 50.6 W
VID_VDD Min 9 1.100 V 0.975 V
VID_VDD Max 9 1.150 V 1.150 V
IDD Max 3,10 49.9 A 28.4 A
CPU COF 6
TDP 3,7 56.5 W 41.7 W
VID_VDD Min 9 1.100 V 0.900 V
VID_VDD Max 9 1.100 V 0.950 V
IDD Max 3,10 45.3 A 18.7 A
Core Power (Pre-Flush) 20 27.2 W 7.8 W
Core Power (Post-Flush) 20 25.1 W 6.4 W
NB Power 17 N/A 12.7 W
I/O Power 13 6.7 W 6.7 W
S0.C1E.Pmin TDP 16 14.9 W 8.7 W
S3 I/O Power 13 350 mW 350 mW
S0.C0.P3
5 oC
N
S0.C0.P3
OPN ADX220OCK22GM19
S0.C0.Px
55 oC to 74 oC
70 oC
S0.Cx.Px
S0.C0.P0
2800 MHz
S0.C0.P2
1600 MHz
S0.C0.P3
800 MHz
S0.C1.Pmin
S0.C0.P1
2100 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
76AMD Athlon™ Processor
3.3.4 AD mmmm HD pnc GM (45 W, DT, AM3) Thermal and Power Specifications
The notes for this table are on page 81.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.100 V N/A 1.100 V
VID_VDDNB Max 11,7 N/A 1.100 V N/A 1.100 V
IDDNB Max 12 N/A 3.9 A N/A 3.1 A
CPU COF 6
TDP 3,7 50.0 W 45.0 W 45.4 W 45.0 W
VID_VDD Min 9 1.050 V 1.000 V 1.050 V 1.000 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 41.2 A 34.4 A 35.7 A 33.3 A
CPU COF 6
TDP 3,7 46.7 W 35.5 W 40.9 W 35.6 W
VID_VDD Min 9 1.050 V 0.925 V 1.050 V 0.925 V
VID_VDD Max 9 1.175 V 1.175 V 1.175 V 1.175 V
IDD Max 3,10 38.1 A 26.7 A 32.6 A 25.9 A
CPU COF 6
TDP 3,7 44.2 W 28.8 W 38.5 W 29.0 W
VID_VDD Min 9 1.050 V 0.850 V 1.050 V 0.850 V
VID_VDD Max 9 1.100 V 1.100 V 1.100 V 1.100 V
IDD Max 3,10 35.8 A 21.0 A 30.3 A 20.5 A
CPU COF 6
TDP 3,7 36.1 W 20.5 W 29.5 W 19.3 W
VID_VDD Min 9 1.050 V 0.775 V 1.050 V 0.775 V
VID_VDD Max 9 1.050 V 1.025 V 1.050 V 1.025 V
IDD Max 3,10 28.0 A 12.3 A 21.7 A 11.2 A
Core Power (Pre-Flush) 20 13.6 W 3.7 W 10.4 W 3.6 W
Core Power (Post-Flush) 20 11.5 W 2.5 W 8.2 W 2.2 W
NB Power 17 N/A 2.9 W N/A 2.2 W
I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W
S0.C1E.Pmin TDP 16 7.3 W 2.6 W 4.9 W 2.1 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
1900 MHz
2600 MHz
2200 MHz
AD420EHDK32GM19
55 oC to 72 oC
70 oC
5 oC
AB
S0.C0.P3
S0.C0.P3
S0.C0.P3
S0.C1.Pmin
S0.C0.P0
2500 MHz
S0.C0.P1
2100 MHz
S0.C0.P2
1800 MHz
S0.Cx.Px
OPN AD415EHDK32GM19
S0.C0.Px
55 oC to 72 oC
70 oC
5 oC
AB
S0.C0.P3
S0.C0.P3
800 MHz 800 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
77AMD Athlon™ Processor
The notes for this table are on page 81.
State Specification8Notes Single-Plane Dual-Plane Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.100 V N/A 1.100 V
VID_VDDNB Max 11,7 N/A 1.100 V N/A 1.100 V
IDDNB Max 12 N/A 3.2 A N/A 2.5 A
CPU COF 6
TDP 3,7 49.6 W 45.0 W 45.0 W 45.0 W
VID_VDD Min 9 1.050 V 1.000 V 1.050 V 1.000 V
VID_VDD Max 9 1.250 V 1.250 V 1.250 V 1.250 V
IDD Max 3,10 40.9 A 35.1 A 35.8 A 33.9 A
CPU COF 6
TDP 3,7 44.2 W 34.2 W 40.0 W 35.2 W
VID_VDD Min 9 1.050 V 0.925 V 1.050 V 0.925 V
VID_VDD Max 9 1.175 V 1.175 V 1.175 V 1.175 V
IDD Max 3,10 35.7 A 26.1 A 31.7 A 26.2 A
CPU COF 6
TDP 3,7 42.0 W 28.2 W 36.7 W 28.4 W
VID_VDD Min 9 1.050 V 0.850 V 1.050 V 0.850 V
VID_VDD Max 9 1.100 V 1.100 V 1.100 V 1.100 V
IDD Max 3,10 33.6 A 21.1 A 28.6 A 20.6 A
CPU COF 6
TDP 3,7 32.2 W 19.3 W 25.9 W 17.9 W
VID_VDD Min 9 1.050 V 0.775 V 1.050 V 0.775 V
VID_VDD Max 9 1.050 V 1.025 V 1.050 V 1.025 V
IDD Max 3,10 24.3 A 11.7 A 18.3 A 10.3 A
Core Power (Pre-Flush) 20 10.7 W 3.0 W 7.5 W 2.8 W
Core Power (Post-Flush) 20 8.4 W 1.8 W 5.2 W 1.3 W
NB Power 17 N/A 2.4 W N/A 1.8 W
I/O Power 13 6.7 W 6.7 W 6.7 W 6.7 W
S0.C1E.Pmin TDP 16 5.2 W 1.9 W 2.9 W 1.3 W
S3 I/O Power 13 350 mW 350 mW 350 mW 350 mW
800 MHz
2500 MHz
2100 MHz
AD615EHDK42GM19
55 oC to 72 oC
70 oC
5 oC
AB
S0.C0.P3
S0.C0.P3
S0.Cx.Px
1800 MHz
800 MHz
S0.C1.Pmin
2400 MHz
S0.C0.P1
1900 MHz
S0.C0.P2
1700 MHz
S0.C0.P0
S0.C0.P3
AD610EHDK42GM19
S0.C0.Px
55 oC to 72 oC
70 oC
5 oC
AB
S0.C0.P3
S0.C0.P3
OPN
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
78AMD Athlon™ Processor
The notes for this table are on page 81.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.125 V
VID_VDDNB Max 11,7 N/A 1.125 V
IDDNB Max 12 N/A 3.1 A
CPU COF 6
TDP 3,7 46.0 W 45.0 W
VID_VDD Min 9 1.150 V 1.150 V
VID_VDD Max 9 1.400 V 1.400 V
IDD Max 3,10 33.3 A 30.4 A
CPU COF 6
TDP 3,7 34.9 W 31.9 W
VID_VDD Min 9 1.100 V 1.050 V
VID_VDD Max 9 1.250 V 1.250 V
IDD Max 3,10 25.8 A 20.8 A
CPU COF 6
TDP 3,7 31.2 W 24.6 W
VID_VDD Min 9 1.100 V 0.975 V
VID_VDD Max 9 1.150 V 1.150 V
IDD Max 3,10 22.5 A 15.0 A
CPU COF 6
TDP 3,7 26.9 W 18.0 W
VID_VDD Min 9 1.100 V 0.875 V
VID_VDD Max 9 1.100 V 1.000 V
IDD Max 3,10 16.9 A 8.4 A
Core Power (Pre-Flush) 20 10.7 W 3.2 W
Core Power (Post-Flush) 20 9.0 W 2.3 W
NB Power 17 N/A 1.7 W
I/O Power 13 6.5 W 6.5 W
S0.C1E.Pmin TDP 16 6.5 W 3.7 W
S3 I/O Power 13 350 mW 350 mW
S0.C1.Pmin
S0.C0.P3
800 MHz
S0.C0.P2
S0.C0.P0
2900 MHz
S0.C0.P1
2100 MHz
1500 MHz
S
S0.Cx.Px
5 oC
S0.C0.P3
S0.C0.Px
55 oC to 72 oC
S0.C0.P3
70 oC
OPN AD245EHDK23GM19
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
79AMD Athlon™ Processor
The notes for this table are on page 81.
State Spe cification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.125 V
VID_VDDNB Max 11,7 N/A 1.125 V
IDDNB Max 12 N/A 3.1 A
CPU COF 6
TDP 3,7 45.9 W 45.0 W
VID_VDD Min 9 1.150 V 1.150 V
VID_VDD Max 9 1.400 V 1.400 V
IDD Max 3,10 33.3 A 30.5 A
CPU COF 6
TDP 3,7 34.9 W 32.0 W
VID_VDD Min 9 1.100 V 1.050 V
VID_VDD Max 9 1.250 V 1.250 V
IDD Max 3,10 25.9 A 20.9 A
CPU COF 6
TDP 3,7 31.9 W 25.5 W
VID_VDD Min 9 1.100 V 0.975 V
VID_VDD Max 9 1.150 V 1.150 V
IDD Max 3,10 23.1 A 15.6 A
CPU COF 6
TDP 3,7 26.4 W 17.1 W
VID_VDD Min 9 1.100 V 0.850 V
VID_VDD Max 9 1.100 V 0.975 V
IDD Max 3,10 16.4 A 7.7 A
Core Power (Pre-Flush) 20 10.3 W 2.8 W
Core Power (Post-Flush) 20 8.7 W 2.0 W
NB Power 17 N/A 1.7 W
I/O Power 13 6.5 W 6.5 W
S0.C1E.Pmin TDP 16 6.3 W 3.4 W
S3 I/O Power 13 350 mW 350 mW
S0.C1.Pmin
1700 MHz
S0.C0.P3
800 MHz
S0.C0.P0
S0.C0.P1
S0.C0.P2
S
S0.C0.P3
3000 MHz
2200 MHz
S0.Cx.Px
S0.C0.Px
AD250EHDK23GM19
S0.C0.P3
5 oC
55 oC to 72 oC
70 oC
OPN
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
80AMD Athlon™ Processor
3.3.5 AD mmmm SC pnc GM (25 W, DT, AM3) Thermal and Power Specifications
The notes for this table are on page 81.
State Specification8Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1800 MHz 1800 MHz
VID_VDDNB Min 11,7 N/A 1.050 V
VID_VDDNB Max 11,7 N/A 1.050 V
IDDNB Max 12 N/A 2.0 A
CPU COF 6
TDP 3,7 25.0 W 25.0 W
VID_VDD Min 9 1.050 V 1.000 V
VID_VDD Max 9 1.150 V 1.150 V
IDD Max 3,10 17.7 A 15.7 A
CPU COF 6
TDP 3,7 22.4 W 20.7 W
VID_VDD Min 9 1.050 V 0.950 V
VID_VDD Max 9 1.100 V 1.100 V
IDD Max 3,10 15.3 A 12.2 A
CPU COF 6
TDP 3,7 17.3 W 13.8 W
VID_VDD Min 9 1.050 V 0.825 V
VID_VDD Max 9 1.050 V 0.975 V
IDD Max 3,10 10.4 A 6.1 A
Core Power (Pre-Flush) 20 4.8 W 1.7 W
Core Power (Post-Flush) 20 3.4 W 0.8 W
NB Power 17 N/A 1.2 W
I/O Power 13 6.4 W 6.4 W
S0.C1E.Pmin TDP 16 2.4 W 1.8 W
S3 I/O Power 13 350 mW 350 mW
5 oC
S0.C0.P2
S0.C0.P2
OPN AD270USCK23GM19
S0.C0.Px
55 oC to 81 oC
70 oC
W
S0.C1.Pmin
S0.C0.P1
1600 MHz
S0.C0.P2
800 MHz
S0.Cx.Px
S0.C0.P0
2000 MHz
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
81AMD Athlon™ Processor
AMD Athlon™ Processor Thermal and Power Specification Table Notes:
1. Tcase Max is the maximum case temperature specification which is a physical value in degrees
Celsius. Tcase Max can be any valid Tcase Max value in the range specified for the corresponding
OPN.
2. Tctl Max (maximum control temperature) is a non-physical temperature on an arbitrary scale that can be
used for system thermal management policies. Refer to the
BIOS and Kernel Developer’s Guide (BKDG)
for AMD Family 10h Processors, order# 31116.
3. The processor thermal solution should be designed to accommodate thermal design power (TDP) at
Tcase Max. TDP is measured under the conditions of all cores operating at CPU COF, Tcase Max, and
VDD at the voltage requested by the processor. TDP includes all power dissipated on-die from VDD,
VDDNB, VDDIO, VLDT, VTT, and VDDA. TDP is not the maximum power of the processor.
4. P-state limit when HTC is active. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD
Family 10h Processors, order# 31116 for more information.
5. Hardware transitions the part to startup P-state at cold boot. During initialization, the startup NB COF
and VID_VDDNB values may differ from those of the startup P-state. Please see the BIOS and Kernel
Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116 for detailed power sequencing
information.
6. Frequency reported to the OS is rounded to the nearest 100-MHz boundary.
7. During initialization, the startup NB COF and VID_VDDNB values may differ from those of the startup
P-state. Please see the BIOS and Kernel Developer’s Guide (BKDG) For AMD Family 10h Processors,
order# 31116 for specific power sequencing information.
8. Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and
equivalent Tcase conditions for all cores. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 10h Processors, order #31116, for details on P-state operation for multi-core processors.
9. Variable voltage, any valid voltage between VID_VDD Min and VID_VDD Max is allowed.
10. TDP IDD conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDD Max
specification.
11. Single-plane platforms have VID_VDD and VID_VDDNB tied together, and use the VID_VDD
specification.
12. TDP IDDNB conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDDNB
Max specification.
13. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only. Assumes
VDDIO = 1.8 V and VTT = VDDIO / 2.
14. Refer to erratum 308 in the Revision Guide for AMD Family 10h Processors, order# 41322 for the
appropriate clock divisor setting.
15. Assumes 50°C, Min P-state VID_VDD, core clock divider set to 128, and L2 and data cache scrubbing
disabled. Refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors,
order# 31116 for recommended settings.
16. Assumes 35°C, min P-state VID_VDD, core clock divider set to 16, HyperTransport™ link s
disconnected, memory in self-refresh mode, and DDR2 SDRAM interface tristated. Recommended
settings in the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order#
31116, provide improved power values.
17. Thermal Design Power dissipated by the processor at min P-state VID_VDDNB.
18. Thermal Design Power dissipated by the processor at min P-state VID_VDD.
19. This product is recommended for dual-plane platforms only.
20. Core Power (Pre-Flush) and (Post-Flush) refers to the Cache Flush On Halt feature described in the
BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116. Core Power
pre-flush and post-flush values are based on the recommended BKDG settings. Actual C1 idle core
power varies with system usage according to the following equation:
C1 idle Core Power = F3xDC[CashFlushOnHaltTmr]/OS timer tick interval * Core Power (Pre-Flush) +
(1 - F3xDC[CachFlushOnHaltTmr]/OS timer tick interval * Core Power (Post-Flush))
The default Microsoft
®
Windows Vista
®
timer tick interval is 15.6 ms. This interval varies between
operating systems and within an operating system depending on usage.
21. Valid for dual-plane operation only.
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
82AMD Sempron™ Processor
4 AMD Sempron™ Processor
The following sections contain the OPN description and thermal and power specifications for the
AMD Sempron™ Processor. Each column in the thermal and power tables represents a specific
Ordering Part Number (OPN). Section 4.1 provides an example of the OPN structure for this
processor family.
4.1 AMD Sempron™ Processor Ordering Part Number Description
Figure 5. AMD Sempron™ Processor Ordering Part Number Diagram
Figure 6. AMD Sempron™ Processor Ordering Part Number Example
Part Definition
Cache Size
Number of Cores
Package
Roadmap
Model
Brand
Segment
b s mmmm rr p n c dd
S D X145 HB K 1 3 GM
Part Definition: GM (see Table 17)
Cache Size: 3 (see Table 18)
Number of Cores: 1 (see Table 19)
Package: K (see Table 20)
Roadmap: HB (see Table 21)
Model Number: X145 (see Table 22)
Brand: S = AMD Sempron™ Processor
Segment: D = Desktop
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
83AMD Sempron™ Processor
Table 17. AMD Sempron™ Processor Part Definition Options
Part
Definition Revision CPUID 8000_0001h EAX [31:0]
(CPUID)
GM Rev C3 00100F63h
Table 18. AMD Sempron™ Processor Cache Size Options
OPN
Character L2 Cache Size L3 Cache Size
3 1024 KB 0 KB
Table 19. AMD Sempron™ Processor Number of Cores
OPN
Character
Number of
Cores
11
Table 20. AMD Sempron™ Processor Package Options
OPN
Character Package
KAM3
Table 21. AMD Sempron™ Processor Roadmap Options
OPN
Character Max TDP Socket
Infrastructure
IDD Max
(VDD)
IDD Max
(NB) HS Class
HB 45 W AM3 45 A 20 A HS 55
Table 22. AMD Sempron™ Processor Model Number Options
Model
Number
Core
Frequency
Single-Plane
NB Frequency
Dual-Plane NB
Frequency
Number
of Cores
Max DDR
Speed
Max HT Link
Speed
X145 2800 MHz 1600 MHz 2000 MHz 1 1066 MT/s 4000 MT/s
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
84AMD Sempron™ Processor
Table 23. AMD Sempron™ Processor Thermal Profiles
Note: The thermal profile is used to define the relationship between Tcase max and device-specific Thermal
Design Power. The heat sink thermal resistance and heat sink local ambient values specify heat sink design
targets. The profile thermal resistance and profile ambient values specify the relationship between part-specific
power and part-specific Tcase Max. If the heat sink design targets are met, the thermal profile specifications
are met.AMD Athlon™ Processor Thermal Profiles
Thermal Profile R
Heat S ink Class HS55
Heat S ink Thermal
Resistance 0.51°C/W
Heat S ink Local
Ambi e n t 42°C
Profile Thermal
Resistance 0.366°C/W
Profile Ambient 48°C
TDP Tcase Max
0.0 W 55.0°C
5.0 W 55.0°C
10.0 W 55.0°C
15.0 W 55.0°C
20.0 W 55.3°C
25.0 W 57.2°C
30.0 W 59.0°C
35.0 W 60.8°C
41.0 W 63.0°C
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
85AMD Sempron™ Processor
4.2 AMD Sempron™ Processor Thermal and Power Table Guide
The thermal and power table guide shown in Table 24 maps SOPNs and the properties associated
with their defined characters to the proper thermal and power table subsections and page numbers.
This table is designed to be used as a quick reference for finding the appropriate subsection for the
thermal and power tables corresponding to an SOPN.
Table 24. AMD Sempron™ Processor Thermal and Power Table Guide
SOPN Power Revision Thermal/Power
Tables
SD mmmm HB pnc GM 45 W C3 Section 4.3.1 on
page 87
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
86AMD Sempron™ Processor
4.3 AMD Sempron™ Processor Thermal and Power Specifications
The thermal and power specification tables contain the thermal and power requirements for each
OPN. This includes the information necessary for thermal management (for example, heat sink
requirements, temperature assumptions) and power delivery (for example, voltage, current, and
power dissipation for each P-state). Refer to the AMD Family 10h Processor Electrical Data Sheet,
order# 40014, for all other electrical specifications for the processor. Refer to the BIOS and Kernel
Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116, for power management
BIOS requirements.
Section 4.1 on page 82 provides an example of the OPN structure for processors documented in this
chapter and Table 24 on page 85 provides a guide to OPN organization in the following subsections.
Refer to Section 1.2 on page 9 and Section 1.3 on page 10 for numbering conventions and
terminology definitions used in these tables.
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
87AMD Sempron™ Processor
4.3.1 SD mmmm HB pnc GM (45 W, DT, AM3) Thermal and Power Specifications
The notes for this table are on page 88.
State Specification Notes Single-Plane Dual-Plane
Tcase Max 1
Tctl Max 2
Tambient Min
Thermal Profile
Startup P-State 5
HTC P-State 4
NB COF 6,7 1600 MHz 2000 MHz
VID_VDDNB Min 11,7 N/A 1.175 V
VID_VDDNB Max 11,7 N/A 1.175 V
IDDNB Max 12 N/A 4.4 A
CPU COF 6
TDP 3,7 42.0 W 41.0 W
VID_VDD Min 9 1.100 V 1.100 V
VID_VDD Max 9 1.350 V 1.350 V
IDD Max 3,10 30.1 A 26.7 A
CPU COF 6
TDP 3,7 36.9 W 30.3 W
VID_VDD Min 9 1.050 V 1.000 V
VID_VDD Max 9 1.250 V 1.250 V
IDD Max 3,10 27.6 A 18.7 A
CPU COF 6
TDP 3,7 35.5 W 23.9 W
VID_VDD Min 9 1.050 V 0.900 V
VID_VDD Max 9 1.150 V 1.150 V
IDD Max 3,10 26.4 A 13.6 A
CPU COF 6
TDP 3,7 32.7 W 19.4 W
VID_VDD Min 9 1.050 V 0.825 V
VID_VDD Max 9 1.075 V 1.075 V
IDD Max 3,10 23.9 A 9.5 A
Core Power (Pre-Flush) 20 15.9 W 4.1 W
Core Power (Post-Flush) 20 14.1 W 2.9 W
NB Power 17 N/A 2.2 W
I/O Power 13 6.5 W 6.5 W
S0.C1E.Pmin TDP 16 9.8 W 4.9 W
S3 I/O Power 13 350 mW 350 mW
S0.C0.P3
2800 MHz
S0.Cx.Px
OPN SDX145HBK13GM19
S0.C0.Px
55 oC to 63 oC
70 oC
5 oC
R
S0.C0.P3
S0.C0.P2
1600 MHz
S0.C0.P3
800 MHz
S0.C0.P1
2000 MHz
S0.C0.P0
S0.C1.Pmin
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
88AMD Sempron™ Processor
AMD Sempron™ Processor Thermal and Power Specification Table Notes:
1. Tcase Max is the maximum case temperature specification which is a physical value in degrees
Celsius. Tcase Max can be any valid Tcase Max value in the range specified for the corresponding
OPN.
2. Tctl Max (maximum control temperature) is a non-physical temperature on an arbitrary scale that can be
used for system thermal management policies. Refer to the
BIOS and Kernel Developer’s Guide (BKDG)
for AMD Family 10h Processors, order# 31116.
3. The processor thermal solution should be designed to accommodate thermal design power (TDP) at
Tcase Max. TDP is measured under the conditions of all cores operating at CPU COF, Tcase Max, and
VDD at the voltage requested by the processor. TDP includes all power dissipated on-die from VDD,
VDDNB, VDDIO, VLDT, VTT, and VDDA. TDP is not the maximum power of the processor.
4. P-state limit when HTC is active. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for AMD
Family 10h Processors, order# 31116 for more information.
5. Hardware transitions the part to startup P-state at cold boot. During initialization, the startup NB COF
and VID_VDDNB values may differ from those of the startup P-state. Please see the BIOS and Kernel
Developer's Guide (BKDG) for AMD Family 10h Processors, order# 31116 for detailed power sequencing
information.
6. Frequency reported to the OS is rounded to the nearest 100-MHz boundary.
7. During initialization, the startup NB COF and VID_VDDNB values may differ from those of the startup
P-state. Please see the BIOS and Kernel Developer’s Guide (BKDG) For AMD Family 10h Processors,
order# 31116 for specific power sequencing information.
8. Specifications for multi-core processors assume equivalent P-states (voltage and frequency) and
equivalent Tcase conditions for all cores. Refer to the BIOS and Kernel Developer’s Guide (BKDG) for
AMD Family 10h Processors, order #31116, for details on P-state operation for multi-core processors.
9. Variable voltage, any valid voltage between VID_VDD Min and VID_VDD Max is allowed.
10. TDP IDD conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDD Max
specification.
11. Single-plane platforms have VID_VDD and VID_VDDNB tied together, and use the VID_VDD
specification.
12. TDP IDDNB conditions: single-plane platforms supply IDD and IDDNB tied together and use the IDDNB
Max specification.
13. Thermal Design Power dissipated by the processor VDDIO and VTT power planes only. Assumes
VDDIO = 1.8 V and VTT = VDDIO / 2.
14. Refer to erratum 308 in the Revision Guide for AMD Family 10h Processors, order# 41322 for the
appropriate clock divisor setting.
15. Assumes 50°C, Min P-state VID_VDD, core clock divider set to 128, and L2 and data cache scrubbing
disabled. Refer to the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors,
order# 31116 for recommended settings.
16. Assumes 35°C, min P-state VID_VDD, core clock divider set to 16, HyperTransport™ links
disconnected, memory in self-refresh mode, and DDR2 SDRAM interface tristated. Recommended
settings in the BIOS and Kernel Developer's Guide (BKDG) for AMD Family 10h Processors, order#
31116, provide improved power values.
17. Thermal Design Power dissipated by the processor at min P-state VID_VDDNB.
18. Thermal Design Power dissipated by the processor at min P-state VID_VDD.
19. This product is recommended for dual-plane platforms only.
20. Core Power (Pre-Flush) and (Post-Flush) refers to the Cache Flush On Halt feature described in the
BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 10h Processors, order# 31116. Core Power
pre-flush and post-flush values are based on the recommended BKDG settings. Actual C1 idle core
power varies with system usage according to the following equation:
C1 idle Core Power = F3xDC[CashFlushOnHaltTmr]/OS timer tick interval * Core Power (Pre-Flush) +
(1 - F3xDC[CachFlushOnHaltTmr]/OS timer tick interval * Core Power (Post-Flush))
The default Microsoft
®
Windows Vista
®
timer tick interval is 15.6 ms. This interval varies between
operating systems and within an operating system depending on usage.
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
89Power Supply Specifications
5 Power Supply Specifications
For socket infrastructures not covered by this document refer to the AMD Infrastructure Roadmap,
order# 41842.
5.1 bsmmmmrr J ncdd – AM2r2 Power Supply Operating Conditions
Table 25. bsmmmmrr J ncdd DC Operating Conditions for VDD Power Supply
Table 26. bsmmmmrr J ncdd AC Operating Conditions for VDD Power Supply
Symbol Parameter Units Min Typ Max Notes
VID_ VDD VID-Requested VDD
Supply Level V
VDD_ d c DC Tolerance - VDD
Supply Voltage VVID_ VDD
– 50 mV VID_ VDD VID_ VDD
+ 50 mV
VDD_PON Metal Mas k VID V 0.95 1.00 MaxVID_VDD 1,2
VDDNB_ d c VDDNB Su p p ly v o lt a g e V VID_ VDDNB
– 50 mV
VID_VDDNB VID_VDDNB
+ 50 mV
VID_VDDNB VDDNB Supply voltage V
VDDNB_PON Metal Mas k VDDNB V 0.95 1.00 MaxVID_VDDNB 1,2
Notes:
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-specific
parameter.
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-specific
parameter.
1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during device
manufacturing.
2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS).
Symbol Parameter Units Min Typ Max Notes
VDD_ a c VDD Su p p ly Vo lt a g e V VID_ VDD –
140 mV VID_ VDD VID_VDD + 150
mV 1
VDDNB_ a c VDDNB Su p p ly Vo lt a g e V VID_ VDDNB
– 140 mV VID_ VDDNB VID_ VDDNB
+ 150 mV 1
Notes:
times. Transients above dc max must return to within the DC specification within 30 μS and must stay under a
triangle described by the AC limit at one end and the DC limit at the other, as shown in
1) The voltage set-point must be contained within the DC specification in order to ensure proper operation.
Voltage ripple and transient events outside the DC specification must remain within the AC specification at all
Figure 7 on page 90.
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
90Power Supply Specifications
Table 27. bsmmmmrr J ncdd Maximum Power-Up and Power-Down Conditions for Power
Supplies
Figure 7. Socket AM2 AC and DC Transient Limits
S ymbol Par ameter Units Max
VDDIO VDDIO Su p p ly Vo lt a g e fo r
DDR2 electricals V2.05
VDDIO VDDIO Su p p ly Vo lt a g e fo r
DDR3 electricals V1.65
VLDT VLDT Su p p ly Vo lt a g e V 1.32
VDDA VDDA S u p p ly Vo lt a g e V 2.70
VDD, VDDNB VDD, VDDNB Su p p ly
Vo lt a g e VMax AC
Vo lt ag e
30 μs
VID
VID + 50 mV
VID + 150 mV
VID – 50 mV
VID
–
140 mV
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
91Power Supply Specifications
Table 28. bsmmmmrr J ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol Parameter Units Min Typ Max Notes
VDDIO_ d c VDDIO Su p p ly Vo lt a g e fo r
DDR2 electricals V 1.70 1.80 1.90 1
VDDIO_ a c VDDIO Su p p ly v o lt a g e V VDDIO_dc –
150 mV VDDIO_ d c VDDIO_dc + 150
mV 2, 3
VLDT VLDT Supply Voltage V 1.14 1.20 1.26 12
VTT_dc VTT Supply Voltage for
DDR2 electricals V 0.85 0.90 0.95 4
VTT_ac VTT Supply Voltage V VTT_dc –
75mV VTT_dc VTT_dc + 75mV 2, 3
VDDA VDDA Supply Voltage V 2.40 2.50 2.60
IDDIO1 VDDIO Power Supply
Current A 3.60 7, 9
ITT1 VTT Power Supply Current A 1.75 6, 8, 9
1.40/ link 5, 9
0.65/ link 9,10,11
IDDA VDDA Power Supply
Current mA 250 9
Notes:
be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then
ILDT
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be
A
VLDT Power Supply
Current
the voltage regulator setting for VDDIO should not be lower than 1.75 V to avoid violating the VDDIO_dc
minimum spec of 1.70 V.
2) VDDIO_ac and VTT_ac parameters are measured over 60 seconds time frame with all
data bus bits switching.
minimum range. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and
compensated for. For example, if the inaccuracy and IR drop amounts to 20 mV, the voltage regulator setting
must be set 20 mV higher so that VTT still tracks 0.5*VDDIO_dc and stays within the range
11) Please refer to erratum 396.
10) ILDT is specified for each unconnected HyperTransport™ link or for each 16x16 bit Gen1
HyperTransport link operating at max 2.0 GT/s or less.
12) Tolerances apply to both VLDT_dc and VLDT_ac conditions.
5) ILDT is specified for one 16x16-bit Gen3 link.
3) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
8) VTT current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
9) This specification reflects the values published in the appropriate power roadmap document.
4) All voltages are referenced to VSS. Voltage regulator for VTT must be set accordingly so that VTT_dc level
measured at the processor VTT_SENSE pin tracks 0.5*VDDIO_dc and stays within the specified maximum and
of 0.85 V and 0.95 V.
6) VTT must both sink and source current.
7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
92Power Supply Specifications
5.2 bsmmmmrr K ncdd – AM3 Power Supply Operating Conditions
Table 29. bsmmmmrr K ncdd DC Operating Conditions for VDD Power Supply
Table 30. bsmmmmrr K ncdd AC Operating Conditions for VDD Power Supply
Symbol Parameter Units Min Typ Max Notes
VID_ VDD VID-Requested VDD
Supply Level V
VDD_ d c DC Tolerance - VDD
Supply Voltage VVID_ VDD
–50 mV VID_ VDD VID_ VDD
+ 50 mV
VDD_PON Metal Mas k VID V 0.95 1.00 MaxVID_VDD 1,2
VDDNB_ d c VDDNB Su p p ly v o lt a g e V VID_ VDDNB
–50 mV
VID_VDDNB VID_VDDNB
+ 50 mV
VID_VDDNB VDDNB Supply voltage V
VDDNB_PON Metal Mas k VDDNB V 0.95 1.00 MaxVID_VDD 1,2
Notes:
1) After PWROK assertion, the VID signals change from the Metal Mask VID to the value programmed during
device manufacturing.
2) MaxVID is reported in MSRC001_0071 (COFVID_STATUS).
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-
specific parameter.
Refer to the thermal/power tables under the
appropriate SOPN section for this OPN-
specific parameter.
S ymbol Par ameter Units Min Typ Max Notes
VDD_ a c VDD S u p p ly Vo lt a g e V VID_ VDD
–140 mV VID_ VDD VID_ VDD +
150 mV 1
VDDNB_ a c VDDNB Su p p ly Vo lt a g e V VID_ VDDNB
–140 mV VID_ VDDNB VID_ VDDNB
+ 150 mV 1
Notes:
1) The voltage set-point must be contained within the DC specification in order to ensure proper operation.
Voltage ripple and transient events outside the DC specification must remain within the AC specification at all.
times. Transients above dc max must return to within the DC specification within 30 μS and must stay under a
triangle described by the AC limit at one end and the DC limit at the other, as shown in
Figure 8 on page 93.
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
93Power Supply Specifications
Table 31. bsmmmmrr K ncdd Maximum Power-Up and Power-Down Conditions for Power
Supplies
Figure 8. Socket AM3 AC and DC Transient Limits
S ymbol Par ameter Units Max
VDDIO VDDIO Su p p ly Vo lt a g e fo r
DDR2 electricals V2.05
VDDIO VDDIO Su p p ly Vo lt a g e fo r
DDR3 electricals V1.65
VLDT VLDT Su p p ly Vo lt a g e V 1.32
VDDA VDDA S u p p ly Vo lt a g e V 2.70
VDD, VDDNB VDD, VDDNB Su p p ly
Vo lt a g e VMax AC
Vo lt ag e
30 μs
VID
VID + 50 mV
VID + 150 mV
VID – 50 mV
VID
–
140 mV
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
94Power Supply Specifications
Table 32. bsmmmmrr K ncdd AC and DC Operating Conditions for non-VDD Power Supplies
Symbol Parameter Units Min Typ Max Notes
VDDIO_ d c VDDIO Su p p ly Vo lt a g e fo r
DDR3 electricals V 1.375 1.500 1.625 1
VDDIO_ a c VDDIO Su p p ly v o lt a g e V VDDIO_dc –
125 mV VDDIO_ d c VDDIO_ d c +
125 mV 2, 3
VLDT VLDT Supply Voltage V 1.14 1.20 1.26 12
VDDR_ d c VDDR Su p p ly Vo lt a g e fo r
DDR3 electricals V 1.14 1.20 1.26 4
VDDR_ ac VDDR Su p p ly Vo lt a g e V VDDR_ d c
–60mV VDDR_ d c VDDR_ d c +
60mV 2, 3
VDDA VDDA Supply Voltage V 2.40 2.50 2.60
IDDIO1 VDDIO Power Supply
Current A3.607, 9
IDDR VDDR Power Supply
Current A 1.75 6, 8, 9
1.40/ link 5, 9
0.65/ link 9,10,11
IDDA VDDA Power Supply
Current mA 9
Notes:
4) All voltages are referenced to VSS. Voltage regulator for VDDR must be set accordingly so that VDDR_dc level
be carefully considered and compensated for. For example, if the inaccuracy and IR drop amounts to 50 mV, then
the voltage regulator setting for VDDIO should not be lower than 1.425 V to avoid violating the VDDIO_dc
minimum spec of 1.375 V.
2) VDDIO_ac and VDDR_ac parameters are measured over 60 seconds time frame with all data bus bits switching.
ILDT
8) VDDR current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
A
1) All voltages are referenced to VSS. In order to ensure proper functionality, DC voltage regulator must be
set accordingly to ensure that VDDIO_dc level measured at the VDDIO_FB_H/L pins does not exceed the
specified maximum and minimum range. As such, factors such as voltage regulator inaccuracy and IR drop must
limits. Factors such as voltage regulator inaccuracy and IR drop must be carefully considered and compensated
measured at the processor with VDDR_SENSE pin stay within the specified maximum and minimum DC tolerance
VLDT Power Supply
Current
f
or to ensure the VDDR stays within the specified DC tolerance limits.
3) Power supply A/C measurements use a 20-MHz scope bandwidth limit.
5) ILDT is specified for one 16x16-bit Gen3 link.
10) ILDT is specified for one 16x16-bit HyperTransport™ link operating at 2.0 GT/s.
12) Tolerances apply to both VLDT_dc and VLDT_ac conditions.
6) VDDR must both sink and source current.
7) VDDIO current is consumed by I, O, I/O switching current and on-chip functions (PDL, DLL, level-shifters, etc.).
9) This specification reflects the values published in the appropriate power roadmap document.
11) Please refer to erratum 396.
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
95MTOPS
6MTOPS
Table 33 shows Composite Theoretical Performance (CTP) calculations. The calculations are stated
in Millions of Theoretical Operations per Second (MTOPS) and are based upon a formula in the
United States Department of Commerce Export Administration Regulations 15 CFR 774 (Advisory
Note 4 for Category 4).
All calculations contained herein are subject to change without notice. AMD makes no representation
or warranty as to the accuracy or reliability of such calculations.
THESE CALCULATIONS ARE PROVIDED “AS IS” AND AMD MAKES NO WARRANTIES
WHATSOEVER, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY
WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY
PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD
PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS.
Furthermore, AMD shall have no liability for any losses or damages including direct, indirect,
special, punitive, incidental, or consequential, such as but not limited to, loss of anticipated profits or
other economic loss occurring in connection with use of the calculations, even if AMD has been
advised in advance of the possibility of such damages. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted herein.
Table 33. Composite Theoretical Performance (CTP) Calculation
1600 8,667 16,267 23,867 31,467 46,667
1700 9,209 17,284 25,359 33,434 49,584
1800 9,750 18,300 26,850 35,400 52,500
1900 10,292 19,317 28,342 37,367 55,417
2000 10,834 20,334 29,834 39,334 58,334
2100 11,375 21,350 31,325 41,300 61,250
2200 11,917 22,367 32,817 43,267 64,167
2300 12,459 23,384 34,309 45,234 67,084
2400 13,000 24,400 35,800 47,200 70,000
2500 13,542 25,417 37,292 49,167 72,917
2600 14,084 26,434 38,784 51,134 75,834
2700 14,625 27,450 40,275 53,100 78,750
2800 15,167 28,467 41,767 55,067 81,667
2900 15,709 29,484 43,259 57,034 84,584
3000 16,250 30,500 44,750 59,000 87,500
3100 16,792 31,517 46,242 60,967 90,417
3200 17,334 32,534 47,734 62,934 93,334
3300 17,875 33,550 49,225 64,900 96,250
3400 18,417 34,567 50,717 66,867 99,167
MTOPS
Six-Core
MTOPS
Single-Core
Frequency MTOPS
Dual-Core
MTOPS
Triple-Core
MTOPS
Quad-Core
PID: 43375 Rev 3.46 - September 2010 AMD Family 10h Desktop Processor
Power and Thermal Data Sheet
96APP
7APP
Table 34 shows the Adjusted Peak Performance (APP) calculations for the
AMD Phenom™ processor and the AMD Athlon™ processor. The calculations are stated in millions
of Weighted Teraflops (WT) and are based upon a formula in the United States Department of
Commerce Export Administration Regulations 15 CFR 774 (Advisory Note 4 for Category 4).
All calculations contained herein are subject to change without notice. AMD makes no representation
or warranty as to the accuracy or reliability of such calculations.
THESE CALCULATIONS ARE PROVIDED “AS IS” AND AMD MAKES NO WARRANTIES
WHATSOEVER, EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO ANY
WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY
PARTICULAR PURPOSE OR ANY WARRANTY OTHERWISE ARISING OUT OF AMD
PROVIDING OR ANY PARTY'S USE OF THE CALCULATIONS.
Furthermore, AMD shall have no liability for any losses or damages including direct, indirect,
special, punitive, incidental, or consequential, such as but not limited to, loss of anticipated profits or
other economic loss occurring in connection with use of the Calculations, even if AMD has been
advised in advance of the possibility of such damages. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted herein.
Table 34. Adjusted Peak Performance (APP) Calculation
1600 0.0019 0.0038 0.0058 0.0077 0.0115
1700 0.0020 0.0041 0.0061 0.0082 0.0122
1800 0.0022 0.0043 0.0065 0.0086 0.0130
1900 0.0023 0.0046 0.0068 0.0091 0.0137
2000 0.0024 0.0048 0.0072 0.0096 0.0144
2100 0.0025 0.0050 0.0076 0.0101 0.0151
2200 0.0026 0.0053 0.0079 0.0106 0.0158
2300 0.0028 0.0055 0.0083 0.0110 0.0166
2400 0.0029 0.0058 0.0086 0.0115 0.0173
2500 0.0030 0.0060 0.0090 0.0120 0.0180
2600 0.0031 0.0062 0.0094 0.0125 0.0187
2700 0.0032 0.0065 0.0097 0.0130 0.0194
2800 0.0034 0.0067 0.0101 0.0134 0.0202
2900 0.0035 0.0070 0.0104 0.0139 0.0209
3000 0.0036 0.0072 0.0108 0.0144 0.0216
3100 0.0037 0.0074 0.0112 0.0149 0.0223
3200 0.0038 0.0077 0.0115 0.0154 0.0230
3300 0.0040 0.0079 0.0119 0.0158 0.0238
3400 0.0041 0.0082 0.0122 0.0163 0.0245
Frequency APP
Single-Core
APP
Six-Core
APP
Dual-Core
APP
Triple-Core
APP
Quad-Core

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