SUSS MICROTEC Presentation HD2611 5 Kevin Yang

User Manual: HD2611

Open the PDF directly: View PDF .
Page Count: 25

Download
Open PDF In Browser	View PDF

SUSS SOLUTIONS FOR LARGE FORMAT PATTERNING
UV Scanning Lithography and Excimer Laser Ablation

Kevin Yang, Habib Hichri, Ralph Zoberbier
SÜSS MicroTec Photonic Systems Inc.
June 18, 2015

SUSS MicroTec

MARKET DRIVER

Mobile Applications drive Advanced Packaging Development.
 Small Form Factor
 High Performance
 High Bandwidth
 Low Power Consumption
 Low Cost

•
•
•
•

Smaller L/S and Via
Higher I/O count
Higher Yield
Higher Reliability

+ Higher Performance
+ Lower Cost

2

SUSS MicroTec

AP PLATFORMS AND PROCESS STEPS

SUSS MicroTec’s patterning solution:

UV Scanner and Excimer Laser Ablation System
3

SUSS MicroTec

AP INFRASTRUCTURE ROADMAP
 All platforms may coexist.
 450mm being slow, panel based packaging will
grow.
 Each sector has different benefits.


OSAT, IDM: FOWLP



Substrate Manufacturer: Embedded Die

 Same requirements: Cost, Size, Performance
 Collaboration required for reliable infrastructure

Yole Developpement 2012
4

SUSS MicroTec

LARGE PANEL ADVANTAGES
 Wafer vs. Panel: technology dependent
 Rectangular: natural choice for better fit and surface utilization
 Throughput: reduced handling/transfer time
 Standards and Infrastructure
 Process and equipment
 Size
 Material

5

SUSS MicroTec

PHOTOLITHOGRAPHY VS. DIRECT ABLATION
 Photolithography
 Proven technology
 Resolution limitation

 Multistep process
 Hazardous/environmentally unfriendly wet chemical process
 Balance of the photo characteristics with the desired
thermal/mechanical properties of the material
 Cure of the polymer after photo-process

 Excimer Laser Ablation
 Direct material removal according to the mask pattern
 Simpler process without wet develop step
 Fine via with high aspect ratio
 Material properties not limited by the need of photo-imaging
 Cure of the polymer before laser processing

6

SUSS MicroTec

SUSS EXPOSURE PRODUCT PORTFOLIO
Mask Aligner

MA200 Gen3
Automatic
150/200mm

MA300 Gen2
Automatic
200/300mm

MA/BA8 Gen3
Semi-Automatic
Pieces up to 200mm

MA12
Manual
200/300mm (squares)

7

SUSS MicroTec

Projection Scanner Excimer Ablation System

DSC300 Gen2
Automatic
200/300mm

DSC500 / DSC800
Automatic
450x500mm / 650x780mm

ELP300 Gen2
Automatic
200/300mm

ELP600
Automatic
600x600mm

DSC300/500/800 UV PROJECTION SCANNER
 Proven UV projection scanning technology
 Low cost
 Full-Field No-Stitch 1:1 Projection Imaging

 Alignment accuracy: TSA < 1µm
 Variable NA – high DoF to high resolution
 Full automation
 Wafers: 200mm, 300mm, 450mm

 Panels: 450x500mm, 650 x 780mm

DSC500:
Near Vertical Orientation
8

SUSS MicroTec

DSC 300 - Wafers

DSC500 - Panels
DSC300 Beam Delivery System

DSC PROJECTION SCANNER IMAGING EXAMPLES

30µm vias in 100µm WBR2100

40µm vias in 80µm AZ125nXT

5µm vias in 10µm AZ10XT

6µm and 7µm L/S in 15µm AZ4620

6µm vias in 10µm HD8820 PBO

10µm L/S in 12µm AZ15nxT

9

SUSS MicroTec

ELP 300/600 EXIMER ABLATION SYSTEM
 ELP300: up to 300mm wafer
 ELP600: up to 600mm x 600mm substrate

ELP300

10

SUSS MicroTec

ELP600

EXCIMER LASER ABLATION
 248nm and 308nm
 Direct removal of the material



Add enough energy to break the molecular bonds at the surface.
Limited thermal effect for heating or change to adjacent area or underlying material.

 Mask based projection
 Throughput independent of the pattern shape or density.

Suitable Materials:
 Most organic materials

mask

 Polymers/Organic Dielectrics (PI, PBO, BCB, Epoxy etc.)
 Epoxy Mold Compounds (EMC – filled and unfilled)

 Some inorganics
 Dielectrics (SiNx < 1µm thick with 248nm )
 Thin metals (Ti, TiW, TaN, Ta, Cu, Ag, Al, etc. < 600nm thick on organic material)
 Conductive materials (ITO, IZO, CNT < 1µm thick on organic material)

11

SUSS MicroTec

substrate

EXCIMER LASER ABLATION
 Fluence and Etch Rate
 With threshold fluence F0 ~ constant
etch depth per pulse (etch rate) can be predicted.
 Depth control by number of pulses

Via 30µm
Stopped on Cu pad
No etching of Cu

 Metal Pad as Etch Stop
 Metal pads (> ~1µm) become natural stop layer
for Excimer via ablation.
 Flexibility for material thickness variation.

Cu Pad

Y. H. Chen, H. Y. Zheng, K. S. Wong, and S. C. Tam, “Excimer laser drilling of polymers”,
Proc. SPIE 3184, 1997
12

SUSS MicroTec

Al Pad

WAVELENGTH, FLUENCE, PULSE, AND ETCH RATE
 Absorption and etch rate vary:
 Wavelength
 Fluence

Polyimide Ablation Rate Dependence on Wavelength

 Etch depth control by number of pulses

0.6

0.4
KrF – 248 nm

Etch Rate (μm)

Etch Depth (μm)

Ablation rate, µm/pulse

0.5

XeCl – 308 nm

0.3

Linear (XeCl –
308 nm)
Linear (KrF –
248 nm)

0.2

0.1

0
400
Number of Pulses

13

SUSS MicroTec

500

600

700

800

900

Fluence, mJ/cm²
Fluence
(mJ/cm2)

1000

1100

1200

SIDE-WALL ANGLE AND FLUENCE
 Side-wall Angle controlled by Fluence
 Steeper wall with higher fluence
 Higher etch rate with higher fluence

65°

376 mJ/cm2, 45 pulses

14

SUSS MicroTec

81°

1200 mJ/cm2, 12 pulses

EXCIMER LASER ABLATION ADVANTAGES
 Technical benefits
 Higher via resolution < 3μm (2μm demonstrated)
 High overlay control:
 300mm Wafer: +/- 1μm
 Panels: +/- 2μm
 Side-wall angle control
 Limited thermal effect
 Simpler process
 Eliminate develop and chemical etch steps
 Reduce bake/curing step
 Safety and environmental protection
 Reduction of hazardous process steps and chemicals
 Reduction of chemical waste
 Benefit with Non-Photo Material
 Cost Reduction

 Combination of desirable material properties

15

SUSS MicroTec

PHOTO AND NON-PHOTO MATERIAL EXAMPLE
 Non-photo material’s advantages
 Desirable properties
 Low cost

16

SUSS MicroTec

Photo/Non-Photo

Non-Photo

Photo

Material

PI

PI

Manufacturer

HD Micro

HD Micro

Product

PI-2611

HD-4100

CTE (ppm/°C)

3

35

Modulus (GPa)

8.5

3.4

Tensile Strength (MPa)

350

200

Elongation (%)

100

45

ELP600 – TECHNICAL CHARACTERISTICS

ELP600

17

SUSS MicroTec

ELP EXCIMER STEPPER PATTERNING EXAMPLES
(PHOTO MATERIAL)
JSR WPR 5100 10µm

HD8930 PBO 13µm

HD4004 8.2µm

40 µm vias

15 µm dia vias

18

SUSS MicroTec

ELP EXCIMER STEPPER PATTERNING EXAMPLES
(NON-PHOTO MATERIAL)
EMC (undisclosed) 10µm

HD (proprietary) 8µm

HD2574

19

SUSS MicroTec

Dow BCB Cyclotene 302X 12µm

ELP EXCIMER STEPPER PATTERNING EXAMPLES
(BCB CROSS SECTION)
Mask:
7 μm
Top:
6 μm
Bottom: 4.2 μm
650 mJ/cm2

Mask:
5 μm
Top:
4.1 μm
Bottom:
2.6 μm
650 mJ/cm2

Michael Töpper, Karin Hauck, Mario Schima Danny Jaeger, KlausDieter Lang, “A sub-4 μm Via Technology of Thin film Polymers using
Scanning Laser Ablation”, ECTC 2015

20

SUSS MicroTec

ELP EXCIMER STEPPER PATTERNING EXAMPLES
(BCB DRY FILM CROSS SECTION)
Mask:
10 μm
Top:
10.3 μm
Bottom:
7.2 μm
Thickness: 15 μm

Mask:
5 μm
Top:
4.7 μm
Bottom:
2.8 μm
Thickness: 15 μm

Michael Töpper, Karin Hauck, Mario Schima Danny Jaeger, KlausDieter Lang, “A sub-4 μm Via Technology of Thin film Polymers using
Scanning Laser Ablation”, ECTC 2015

21

SUSS MicroTec

ELP EXCIMER STEPPER PATTERNING EXAMPLES
(FILLED VIA AND RDL)
polishing mold

40µm

10µm

2 metal layer with 10µm fully filled micro-vias
at 40µm pitch and 2.5µm line

10µm ZS100
30µm: buffer layer (ZS100)

Glass (300µm: core)

8-10µm fully filled micro-vias at 20µm pitch
Yuya Suzuki, Jan Brune, Rolf Senczuk, Rainer Pätzel, Ryuta Furuya, Fuhan
Liu, Venky Sundaram, Rao Tummala, “Demonstration of 20μm Pitch Micro-vias
by Excimer Laser Ablation in Ultra-thin Dry-film Polymer Dielectrics for Multilayer RDL on Glass Interposers”, ECTC 2015 Georgia Tech PRC ZEON
22

SUSS MicroTec

POST LASER ABLATION CLEANING
 Post ablation cleaning is required for subsequent
processes in most cases.

before

after

 Sacrificial layer
 Successful cleaning of HD4104
 Sacrifiall layer removed with high-pressure CO2 ionized water
Sacrificial Layer

O2 plasma cleaning

 Successful cleaning of PBO, BCB, HD2611, HD4110
 In-house tool (vacuum plasma) available

CO2 snow cleaning

 Successful cleaning PBO with most aggressive CO2 snow
 3rd party tool available

O2 plasma

DPSS Cleaning
 Successful cleaning PBO (HD8820)
 Using pico second DPSS Laser
 In-house tool available

CO2 snow

 The material determines the cleaning method.
DPSS

23

SUSS MicroTec

SUMMARY
 Mobile products drive packaging trend
 Cost, Form Factor, Performance, Yield
 Large size rectangular panel will grow for high volume manufacturing.
 Driven by cost reduction
 Patterning is a major factor along with material development.
 Suss MicroTec provides Mask Aligner, UV Projection Scanner and Excimer Laser
Ablation for patterning applications.
 UV scanner and excimer laser stepper are available for large format patterning.
 Excimer laser stepper provides maximum benefits with non-photo materials.
 Excimer laser stepper applications in RDL Via and Trench formation,
SLR and Laser Debonding.

 Demo and evaluation test available
 In-house at Suss MicroTec
 Fraunhofer Institute IZM
ELP600
24

SUSS MicroTec

25

SUSS MicroTec



---

Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.5
Linearized                      : No
Page Count                      : 25
Language                        : en-US
Tagged PDF                      : Yes
Title                           : SUSS MICROTEC Powerpoint presentation template
Author                          : Lutter, Stefan
Subject                         : SUSS MicroTec Master-Template
Create Date                     : 2015:06:22 01:29:26-07:00
Modify Date                     : 2015:06:22 01:29:26-07:00
Producer                        : Microsoft® PowerPoint® 2010
Creator                         : Microsoft® PowerPoint® 2010

EXIF Metadata provided by EXIF.tools