Application Note 1125 Laminate CSP (Chip Scale Package) AN

User Manual: AN-1125

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Laminate CSP (Chip ScalePackage)IntroductionCHIP SCALE PACKAGESLaminate substrate based CSPs are an extension of Na-tional Semiconductor’s current Plastic Ball Grid Array(PBGA) technology and are the package of choice for por-table applications. CSPs are available in two package de-signs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).The interconnection of FBGA to the board is achieved usingsolder ball technology, while the Laminate CSP uses periph-eral nickel-gold pads for the package to board interconnec-tion. The construction and materials used in these packagesare designed to provide the highest performance and reli-ability for National Semiconductor’s new miniaturized prod-ucts. The Laminate CSP is available in a Plastic Thin FinePitch Quad Flat No Lead Package (P-TFQFN) and a PlasticThin Shrink Small Outline No Lead Package (P-TSSON) de-sign.Surface Mount (SMT) board reliability is a key concern forCSPs, and an outstanding surface mount reliability isachieved with the laminate CSPs. The 16, 24, 28L laminateCSP has a solder joint reliability greater than 1600 cycleswithout any solder joint failures for test condition (-40˚C to125˚C 1 cycle/hr). The 16, 24, 28 lead laminate CSP arecompletely qualified at National Semiconductor and areavailable for a wide range of products. By designing thermalvias and pads to enhance power dissipation to the mother-board, the Laminate CSP provides superior thermal perfor-mance compared to standard package form factors.APPLICATIONSPortable applications, including cellular phone, wireless,computers, memory, DSP and gate array.CSP FEATURESNational Semiconductor’s CSP strategy is to make use ofthe current PBGA infrastructure for materials, process anddesign innovation to provide the best value and ease forimplementing miniature packaging solutions.•Small outline•Low profile (1.0 mm for CSP’s, 1.4 mm for FBGA’s)•Light weight•Moisture Resistance JEDEC Level 3•Enhanced Electrical Performance >2.4 GHz•JEDEC MO-208 Standard Outline for quad package,P-TFQFN•JEDEC MO-209 Standard Outline for Dual Inline Pack-age, P-TSSONTHERMAL CHARACTERISTICSThermal performance is measured using a low effective ther-mal conductivity test board fabricated per EIA/JESD51-3.Package Body Size (mm) Die Size (mm) θj-a (˚C/Watt)CSP-16 Lead 3.5 x 3.5 x 1.0 1.45 x 1.40 130CSP-24 Lead 4.5 x 3.5 x 1.0 1.80 x 1.32 112CSP-28 Lead 4.5 x 5.5 x 1.0 2.74 x 2.67 72CSP-48 Lead 8.1 x 12.5 x 1.0 5.18 x 3.72 39 (Note 1)CSP-96 Lead 8x8x1.0 3.05 x 3.05 89CSP-48 FBGA 7x7x1.4 2.54 x 2.54 85CSP-64 FBGA 8 x 8x 1.4 3.00 x 1.80 62CSP-100 FBGA 10 x 10 x 1.4 7.9 x 7.9 35Note 1: with thermal padsNote 2: Simulated dataNational SemiconductorApplication Note 1125Shaw W. Lee and Wayne LeeJune 2000Laminate CSP (Chip Scale Package) AN-1125© 2000 National Semiconductor Corporation AN101093 www.national.com
RELIABILITY•Moisture Sensitivity Level 3 (30˚C/60% RH, 168hrs floor life)•Characterization 30˚C/60% RH, 336 HoursSoak•Autoclave 121˚C, 100% RH, 15 psi,168 Hours•Temperature Cycle - 40˚C to 125˚C, 1000Cycles•Dynamic OP Life 125˚C, 1000 Hours•Temp. HumidityBias Test85˚C/85% RH, 1000 HoursLaminate CSP ROADMAPOver the next two years National Semiconductor will bringon-line laminate CSP’s covering a range of I/O counts to sat-isfy customer requirements. SeeTable 1.TABLE 1. Laminate CSP RoadmapPackage Information FY2000 (6/99 -5/2k) FY2001 FY2002I/O Count Body Size (mm) Pitch (mm) Q1 Q2 Q3 Q416/20 CSP 3.5 x 3.5 x 1.0 0.5 p24 CSP 3.5 x 4.5 x 1.0 0.5 p28/32 CSP 4.5 x 5.5 x 1.0 0.5 p40 CSP 5.5 x 6.5 x 1.0 0.5 d s q p48 CSP 12.5 x 8.1 x 1.0 0.5 p56 CSP 8.0 x 8.0 x 1.0 0.5 d s q p49 FBGA 7.0 x 7.0 x 1.4 0.8 d, s, q, p64 FBGA 8.0 x 8.0 x 1.4 0.8 p81 FBGA 9.0 x 9.0 x 1.4 0,8 d s q p100 FBGA 10.0 x 10.0 x 1.4 0.8 d s q p192 FBGA 14.0 x 14.0 x 1.4 0.8 d s q q & p80 CSP 7.0 x 7.0 x 1.0 0.5 d s q q & p96 CSP 8.0 x 8.0 x 1.0 0.5 d s q q & p112 CSP 9.0 x 9.0 x 1.0 0.5 d s q q & p128 CSP 10.0 x 10.0 x 1.0 0.5 d s q q & p208 CSP 15.0 x 15.0 x 1.0 0.5 d, s, q, pd = design, s = sample, q = qualification, p = productionCSP Cross SectionAN101093-1Cross Section View for 24-Lead Laminate CSPAN-1125www.national.com 2

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