COVER DVDR129

User Manual: DVDR129

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DVD- RECORDER
Chassis : ANDES (3rd Generation)
DVD-R129/XAA, XAC

SERVICE MANUAL

SERVICE

DVD-R129

DVD-RECORDER

Manual
Main Features
ΠMulti format recording
DVD-RW/ DVD-R

ELECTRONICS

´ Multi format playback
DVD/ DVD-RAM/ DVD-RW/ DVD-R
CD/ CD-R/ CD-RW/ MP3/ JPEG/
VCD(Canada Only)
ˇ Recording mode
XP(1Hour)/ SP(2Hour)/ LP(4Hour)/ EP(6~8Hour)
¨ Progressive scan
ˆ Automatic Chapter product on
Ø 49mm Slim Design
∏ Quick Recording

This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
international and/or domestic law.

© Samsung Electronics Co., Ltd. JUN. 2006
Printed in Korea
AK82-01188A

CONTENTS
1. Precautions
1-1
1-2
1-3
1-4

Safety Precaution
Servicing Precautions
ESD Precautions
Handling the optical pick-up

2. Product Specification
2-1
2-2
2-3
2-4
2-5

Reference Information
Chassis Product Specification
Option Product Specification
Introduction to DVD
DVD-Video Fromat

3. Software Update
3-1 Drive Firmware Update
3-2 Flash Update

4. Disassembly and Reassembly
4-1 Cabinet and PCB
4-2 PCB Location

5. Trouble Shooting
6. Exploded View and Parts List
6-1 Cabinet Assembly

7. Electrical Parts List
8. Block Diagrams
8-1
8-2
8-3
8-4
8-5
8-6
8-7

All Block Diagram
DIC1(S5L3200) Block Diagram
AIC1(PCM1742) Block Diagram
AIC2 (PCM1802) Block Diagram
FIC1 (TSB4AB1) Block Diagram
VIC1 (TW9906) Block Diagram
IC4N01(MSP3407G) Block Diagram

1-1 ~ 1-6
(1-1)
(1-3)
(1-4)
(1-5)

2-1 ~ 2-12
(2-1)
(2-2)
(2-3)
(2-4)
(2-6)

3-1 ~ 3-4
(3-1)
(3-3)

4-1 ~ 4-6
(4-1)
(4-6)

5-1 ~ 5-16
6-1 ~ 6-4
(6-2)

7-1 ~ 7-12
8-1 ~ 8-8
(8-2)
(8-3)
(8-4)
(8-5)
(8-6)
(8-7)
(8-8)

CONTENTS
9. Wiring Diagram

9-1 ~ 9-2

10. PCB Diagrams

10-1 ~ 10-8

10-1
10-2
10-3
10-4

Main PCB
Jack PCB
Key PCB
Sub PCB

11. Schematic Diagrams
11-1 S.M.P.S (Jack PCB)
11-2 TM Block (Jack PCB)
11-3 AV Input (Jack PCB)
11-4 Micom (Jack PCB)
11-5 CBS Function Block (Jack PCB)
11-6 I/O (Jack PCB)
11-7 AV Codec (Main PCB)
11-8 DDR (Main PCB)
11-9 DV_1394 (Main PCB)
11-10 Latch And Audio (Main PCB)
11-11 Main Connector (Main PCB)
11-12 Video Decoder (Main PCB)
11-13 Sub and Key (Sub and Key PCB)

(10-2)
(10-4)
(10-6)
(10-7)

11-1 ~ 11-14
(11-2)
(11-3)
(11-4)
(11-5)
(11-6)
(11-7)
(11-8)
(11-9)
(11-10)
(11-11)
(11-12)
(11-13)
(11-14)

12. Operating Instructions

12-1 ~ 12-18

13. Circuit Operating Descriptions

13-1 ~ 13-16

13-1
13-2
13-3
13-4
13-5
13-6
13-7
13-8

Power
AV Codec
SERVO (DVP Multi Drive)
Video Input
Video Output
Audio
Tuner
IF

(13-1)
(13-4)
(13-7)
(13-9)
(13-11)
(13-13)
(13-14)
(13-15)

CONTENTS
14. Reference Information
14-1 About IEEE-1394

14-1 ~ 14-4
(14-1)

1. Precautions
1-1 Safety Precautions
1) Before returning an instrument to the customer,
always make a safety check of the entire instrument,
including, but not limited to, the following items:
(1) Be sure that no built-in protective devices are
defective or have been defeated during servicing.
(1)Protective shields are provided to protect both
the technician and the customer. Correctly replace
all missing protective shields, including any
removed for servicing convenience.
(2)When reinstalling the chassis and/or other assembly in the cabinet, be sure to put back in place
all protective devices, including, but not limited to,
nonmetallic control knobs, insulating fish papers,
adjustment and compartment covers/shields, and
isolation resistor/capacitor networks. Do not operate this instrument or permit it to be operated without all protective devices correctly installed and
functioning.
(2) Be sure that there are no cabinet openings through
which adults or children might be able to insert
their fingers and contact a hazardous voltage. Such
openings include, but are not limited to, excessively wide cabinet ventilation slots, and an improperly fitted and/or incorrectly secured cabinet back
cover.
(3) Leakage Current Hot Check-With the instrument
completely reassembled, plug the AC line cord
directly into a 120V AC outlet. (Do not use an isolation transformer during this test.) Use a leakage
current tester or a metering system that complies
with American National Standards institute (ANSI)
C101.1 Leakage Current for Appliances and
Underwriters Laboratories (UL) 1270 (40.7). With
the instrument’s AC switch first in the ON position
and then in the OFF position, measure from a
known earth ground (metal water pipe, conduit,
etc.) to all exposed metal parts of the instrument
(antennas, handle brackets, metal cabinets, screwheads, metallic overlays, control shafts, etc.), especially any exposed metal parts that offer an electrical return path to the chassis.
Any current measured must not exceed 0.5mA.
Reverse the instrument power cord plug in the outlet and repeat the test. See Fig. 1-1.

Any measurements not within the limits specified
herein indicate a potential shock hazard that must
be eliminated before returning the instrument to
the customer.
(READING SHOULD
NOT BE ABOVE
0.5mA)
LEAKAGE
CURRENT
TESTER

DEVICE
UNDER
TEST
TEST ALL
EXPOSED METER
SURFACES
2-WIRE CORD
ALSO TEST WITH
PLUG REVERSED
(USING AC ADAPTER
PLUG AS REQUIRED)

EARTH
GROUND

Fig. 1-1 AC Leakage Test
(4) Insulation Resistance Test Cold Check-(1) Unplug
the power supply cord and connect a jumper wire
between the two prongs of the plug. (2) Turn on the
power switch of the instrument. (3) Measure the
resistance with an ohmmeter between the
jumpered AC plug and all exposed metallic cabinet
parts on the instrument, such as screwheads,
antenna, control shafts, handle brackets, etc. When
an exposed metallic part has a return path to the
chassis, the reading should be between 1 and 5.2
megohm. When there is no return path to the chassis, the reading must be infinite. If the reading is
not within the limits specified, there is the possibility of a shock hazard, and the instrument must be
repaired and rechecked before it is returned to the
customer. See Fig. 1-2.
Antenna
Terminal

Exposed
Metal Part

ohm

ohmmeter

Fig. 1-2 Insulation Resistance Test
Samsung Electronics

1-1

Precautions

2) Read and comply with all caution and safety related notes on or inside the cabinet, or on the chassis.
3) Design Alteration Warning-Do not alter or add to
the mechanical or electrical design of this instrument. Design alterations and additions, including
but not limited to, circuit modifications and the
addition of items such as auxiliary audio output
connections, might alter the safety characteristics of
this instrument and create a hazard to the user. Any
design alterations or additions will make you, the
servicer, responsible for personal injury or property
damage resulting therefrom.
4) Observe original lead dress. Take extra care to
assure correct lead dress in the following areas:
(1) near sharp edges, (2) near thermally hot parts (be
sure that leads and components do not touch thermally hot parts), (3) the AC supply, (4) high voltage,
and (5) antenna wiring. Always inspect in all areas
for pinched, out-of-place, or frayed wiring, Do not
change spacing between a component and the
printed-circuit board. Check the AC power cord for
damage.

1-2

5) Components, parts, and/or wiring that appear to
have overheated or that are otherwise damaged
should be replaced with components, parts and/ or
wiring that meet original specifications.
Additionally, determine the cause of overheating
and/or damage and, if necessary, take corrective
action to remove any potential safety hazard.
6) Product Safety Notice-Some electrical and mechanical parts have special safety-related characteristics
which are often not evident from visual inspection,
nor can the protection they give necessarily be
obtained by replacing them with components rated
for higher voltage, wattage, etc. Parts that have special safety characteristics are identified by shading,
an (
)or a (
)on schematics and parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire and/or
other hazards. Product safety is under review continuously and new instructions are issued whenever appropriate.

Samsung Electronics

Precautions

1-2 Servicing Precautions
CAUTION : Before servicing units covered by this
service manual and its supplements, read and follow
the Safety Precautions section of this manual.
Note : If unforseen circumstances create conflict
between the following servicing precautions and any
of the safety precautions, always follow the safety precautions. Remember: Safety First.

1-2-1 General Servicing Precautions
(1) a. Always unplug the instrument’s AC power cord
from the AC power source before (1) re-moving
or reinstalling any component, circuit board,
module or any other instrument assembly, (2)
disconnecting any instrument electrical plug or
other electrical connection, (3) connecting a test
substitute in parallel with an electrolytic capacitor in the instrument.
b. Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this
service manual might be equipped.
c. Do not apply AC power to this instrument and
/or any of its electrical assemblies unless all
solid-state device heat sinks are correctly installed.
d. Always connect a test instrument’s ground lead
to the instrument chassis ground before connecting the test instrument positive lead. Always
remove the test instrument ground lead last.

(4) An insulation tube or tape is sometimes used and
some components are raised above the printed
wiring board for safety. The internal wiring is
sometimes clamped to prevent contact with heating components. Install such elements as they
were.
(5) After servicing, always check that the removed
screws, components, and wiring have been installed correctly and that the portion around the
serviced part has not been damaged and so on.
Further, check the insulation between the blades of
the attachment plug and accessible conductive
parts.

1-2-2 Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet
and turn the power ON. Connect the insulation resistance meter (500V) to the blades of the attachment
plug. The insulation resistance between each blade of
the attachment plug and accessible conductive
parts(see note) should be more than 1 Megohm.
Note : Accessible conductive parts include metal panels, input terminals, earphone jacks, etc.

Note : Refer to the Safety Precautions section ground
lead last.
(2) The service precautions are indicated or printed on
the cabinet, chassis or components. When servicing, follow the printed or indicated service precautions and service materials.
(3) The components used in the unit have a specified
flame resistance and dielectric strength.
When replacing components, use components
which have the same ratings. Components identified by shading, by( ) or by ( ) in the circuit diagram are important for safety or for the characteristics of the unit. Always replace them with the exact
replacement components.

Samsung Electronics

1-3

Precautions

1-3 ESD Precautions
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity.
Such components commonly are called Electrostatically Sensitive Devices(ESD). Examples of typical ESD
devices are integrated circuits and some field-effect
transistors and semiconductor chip components. The
following techniques should be used to help reduce
the incidence of component damage caused by static
electricity.
(1) Immediately before handling any semiconductor
component or semiconductor-equipped assembly,
drain off any electrostatic charge on your body by
touching a known earth ground. Alternatively,
obtain and wear a commercially available discharging wrist strap device, which should be
removed for potential shock reasons prior to applying power to the unit under test.

(7) Immediately before removing the protective materials from the leads of a replacement ESD device,
touch the protective material to the chassis or circuit assembly into which the device will be
installed.
CAUTION : Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
(8) Minimize bodily motions when handling unpackaged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your
clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient
to damage an ESD device).

(2) After removing an electrical assembly equipped
with ESD devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
(3) Use only a grounded-tip soldering iron to solder or
unsolder ESD devices.
(4) Use only an anti-static solder removal devices.
Some solder removal devices not classified as
“anti-static” can generate electrical charges sufficient to damage ESD devices.
(5) Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage
ESD devices.
(6) Do not remove a replacement ESD device from its
protective package until immediately before your
are ready to install it.(Most replacement ESD
devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive materials).

1-4

Samsung Electronics

Precautions

1-4 Handling the optical pick-up
The laser diode in the optical pick up may suffer electrostatic breakdown because of potential static electricity from clothing and your body.

WRIST-STRAP
FOR GROUNDING

1M

The following method is recommended.
(1) Place a conductive sheet on the work bench (The
black sheet used for wrapping repair parts.)
(2) Place the set on the conductive sheet so that the
chassis is grounded to the sheet.
(3) Place your hands on the conductive sheet(This
gives them the same ground as the sheet.)
(4) Remove the optical pick up block
(5) Perform work on top of the conductive sheet. Be
careful not to let your clothes or any other static
sources to touch the unit.

THE UNIT

1M

CONDUCTIVE SHEET

Fig.1-3
(6) Short the short terminal on the PCB, which is inside the Pick-Up ASS’Y, before replacing the PickUp. (The short terminal is shorted when the PickUp Ass’y is being lifted or moved.)
(7) After replacing the Pick-up, open the short terminal on the PCB.

◆ Be sure to put on a wrist strap grounded to the
sheet.
◆ Be sure to lay a conductive sheet made of copper
etc. Which is grounded to the table.

Samsung Electronics

1-5

Precautions

MEMO

1-6

Samsung Electronics

2. Product Specification
2-1 Product Specification

General

Power requirements

120V AC,60Hz

Power consumption

19Watts

Weight

5.07 IB

Dimensions

16.9inch(W) x 8.2inch(D) x 1.9inch(H)

Operating temp

+41°F to 95°F

Other conditions

Keep level when operating. Less than 75% operating humidity

Video (1,2)

Input

1.0 V p-p at 75ohm load, sync negative
S-Video input (Y:1.0Vp-p, C: 0.286Vp-p at 75ohm load)

Audio (1,2)

Max. Audio input level : 2Vrms

DV Input

IEEE 1394(4p) compatible jack

Receivable Channels

Regular TV broadcasting : VHF (2~13), UHF (14~69)
Cable TV broadcasting: 1~125
Audio output jacks 1,2

Audio

Optical/coaxial digital audio output
Full scale analog output level : 2Vrms

Output

Video output jacks 1,
Video

S-Video output 1 (Y: 1.0Vp-p, C:0.286Vp-p at 75 ohm load)
Component output (Y: 1.0Vp-p ,Pb:0.70Vp-p, Pr:0.70Vp-p at 75ohm load)

Recording

Picture compression format

MPEG-II

Audio compression format

Dolby digital 2ch/256kbps

Recording Quality
Audio frequency characteristics

Samsung Electronics

XP (about 8 Mbps), SP (about 4 Mbps), LP (about 2 Mbps),
EP (about 1.2 Mbps), FR (about 1.2 Mbps to 8Mbps)
20 Hz ~ 20 KHz

2-1

Product Specification

2-2 Chassis Product Specification
General

Info
SYSTEM

RECORER
FUNCTION

SUB
FUNCTION

PLAYBACK
FUNCTION

IN/OUT

ETS

2-2

Model Name

DVD-R129/XAA

Function
COLOR SYSTEM
BROADCAST SSTEM
AUTO CLOCK
DVD-RAM
DVD-R
DVD-RW
VIDEO
AUDIO
DVD-RAM/-R(4.7GB)
HDD
Flexible Recording
OTR
Time Slip
VCR+Plus
Quick Dubbing
EPG(Gemstar)
IR Blaster
Play Lis
Auto Chaptering
JPEG Browser with BG music
DV Input
10in2 Memory Slot
DVD-RAM/-R/-RW
DVD-Video/VCD/CD-DA
CD-R/RW
Music CD
MPEG4/Divx
Multi Memory Card
Progressive Scan Output
Upscaling(720P/1080i)
DV/AV1/AV2/CH
Video Input
Video Output
S-Video Input
S-Video Output
Component Output
HDMI Output
Analog Audio Input(L/R)
Analog Audio Output(L/R)
Optical/Coaxial
Panel disply
REMOCON
IB
Size: Net(W x H x D)
Weight

Standard
NTSC
M
O
O
O
MPEG-2
2ch
O
O
O
-/O
O
O
O/O/(O)
O/-/O
O/O
O
-/O
O/O/O/O
2ea
1ea
1ea
1ea
1ea
2sets
2sets
O/O
LED Module
Multi 47key
English
430X49.5X210
2.3Kg
Samsung Electronics

Product Specification

2-3 Option Product Specification
Description Fig

Description

Remote
Control

Batteries for
Remote Control

Parts No

AK59-00055A

Remark

Model Standard of
DVD-R129/XAA

Model Standard of
AC43-12002H

DVD-R129/XAA
S.N.A

User’s Manual

AK68-01174A

Quick Guide

AK68-01175A

Model Standard of
DVD-R129/XAA

Model Standard of
DVD-R129/XAA
S.N.A

Video/Audio
Cable

RF Cable

Samsung Electronics

AC39-00073A

AC39-42001J

Model Standard of
DVD-R129/XAA

Model Standard of
DVD-R129/XAA

2-3

Product Specification

2-4 Introduction to DVD
2-4-1 The Definition of DVD
DVD is the next generation medium and is the acronym of the Digital Versatile Disc or thr Digital Video Disc,
which maximizes the saving density of the disk surface using the MPEG-2 compression technology to enable the
storage of 17G bytes of data on the same size CD.
1) 7 times the storage capacity of the conventional CD
- Minimized the track pitch and pit size to 1/2 of conventional CD.
- Uses red laser with short-wavelenght of 650nm (635nm).
DVD Vs. CD-ROM
CD-ROM

CD-R/RW

DVD-ROM

DVD-R/RW

DVD-RAM

1.2mm

1.2mm

0.6*2mm

0.6*2mm

0.6*2mm

0.45

0.45(0.5)

0.6

0.6

0.6

Laser wavelenght

780um

780um

650um

650um

650um

Track pitch

1.6pm

1.6pm

0.74pm

0.74pm

0.615pm

Capacity

0.65GB

0.65GB

4.7GB

4.7GB

4.7GB

Track structure

Pit train

Groove

Pit train

Groove

Land/Groove

Disc Thickness
Lens NA

2) Disc Formats
DVD consists of two 0.6mm discs attached together, enabling access to the upper and lower side of the disk,
and 4 sides could be used at maximum.

Single Layer : 4.7GByte
Label
Polycarbonate
Bonding layer
Reflective layer
Polycarbonate

Dual Side Single Layer : 9.5GByte
Polycarbonate
Reflective layer
Bonding layer
Reflective layer
Polycarbonate

2-4

Dual Layer : 8.5GByte
Label
Polycarbonate
Reflective layer
Bonding layer
Semi-reflective layer
Polycarbonate
Dual Side Dual Layer : 17GByte
Polycarbonate
Semi-reflective layer
Reflective layer
Bonding layer
Reflective layer
Semi-reflective layer
Polycarbonate

Samsung Electronics

2-4-2 DVD Types
FORMAT

TYPE

DVD-Video

Playback Only

DVD-ROM

Read Only

DVD-Audio

Playback Only

DVD-R

1 Time Recording
Rewritable

APPLICATIONS
High quality image and sound for movies and other video media.
Multi-functional, multi-media software that requires large storage capacity.
High quality sound that exceeds the CD, multi-channel Audio.
As with CD-R, write only once
This can be virtually used as hard-disk, with a random

DVD-RAM
(more than 100,000 times)
Rewritable

read-write access
Similar to DVD-RAM except than its technology features

DVD-RW
(About 1,000 times)

Samsung Electronics

a separated read-write access more like phonograph than a hard disk.

2-5

Product Specification

2-5 DVD-Video Fromat
2-5-1 Main Features
1) Able to store up to 160 minutes of Movie by utilizing the MPEG-2 compression technology. ( Aver. 133min.)
2) Enables more than 500 lines of horizontal resolution. (Class corresponding to the Master Tapes used in
broadcasting stations)
3) Provides Dolby Digital 5.1ch Surround 3D sound, which enables theater quality sound (NTSC area).
• For PAL areas, 1 of either MPEG-2 Audio or Dolby Digital must be selected.
4) Multi-Language
• Able to store up to 8 languages of dubbing.
• Able to store up to 32 subtitle languages.
5) Multi-Aspect Ratio
3TV Mode alternatives ; 16:9 Wide Screen (DVD Basic)/4:3 Pan & Scan/Letter Box.
6) Multi-Story
Possible to implement Interactive Viewing which enables the user to select the scenario.
7) Multi-Angle
Able to view the camera angle you selected among the scenes recorded with multiple camera angles.
Note ; The above media features must have the DVD Title that contains the appropriate contents to function
properly.

2-5-2 Audio & Video Specifications
Classification

VIDEO

DVD-Video

Video-CD

Compression

MPEG-2

MPEG-1

Pixel

720 x 480

352 x 240

Horizontal resolution

Max. 500 Lines

Max. 250 Lines

Compression rate

1/40

1/140

Transmission speed

Max. 9.8Mbps (variable)

1.15Mbps (fixed)

TV aspect

16:9 / 4:3

Audio

Max. 8 streams

Recording type
AUDIO

2-6

4:3
2CH stereo

Dolby Digital

Linear PCM

MPEG-1 Layer 2

Transmission rate

448Kbps/stream

6.144Mbps/stream

224Kbps

Channel

5.1CH/stream

8CH/stream

2CH

Sampling frequency

48KHz

16, 20, 24Bit/48, 96KHz

16Bit/44.1KHz

LD
Analog
Max.420 Lines
Analog
4:3
2 Analog CH.
2 Digital CH.
(16Bit/44.1KHz)

or
1 Analog CH.
1 Stream of Dolby Digital
2 Digital CH.
(16Bit/44.1KHz)

Samsung Electronics

2-5-3 Detailed Feature
DVD-Video Feature 1

When Developing the DVD Software, various addition and modification is possible.

As the storage capacity increases, the DVD-Video separates the main data and the additional data such as the
Multi-Function into different data areas, enabling the control of time-data ratio to provide the format that enables
the flexible Software development
• 1 Movie (3.5Mbps)
+ Subtitle (1 Language)
+ Surround Audio (1 Language)
= 160min storage (4.673Gbytes)
• 1 Movie (3.5Mbps)
+ Subtitle (4 Language)
+ Surround Audio (4 Language)
= 160min storage (4.680Gbytes)
• 1 Music Video (4Mbps)
+ 2ch High quality Audio (96kHz/24bit)
= 72min storage (4.648Gbytes)

DVD-Video Feature 2

Application of the MPEG-2 compression technology.

DVD-Video uses the variable compresion technology, the MPEG-2 to compress the moving image optimally, minimizing the Data loss to Provide a clear, natural screen while increasing the storage time.

• MPEG-2 (Variable compression : Max. 1/40)

DVD-Video

Video-CD

• MPEG-1 (Fixed compression : Max. 1/140)
- Frame unit compression.
- Compresses all data using the same ratio.
- Fast movements are jagged, and unnatural

Samsung Electronics

Amount of data

- Field unit compression.
- Compression rate change according to the amount of Data.
- Differentiates the still image and the moving image
compression rate, reducing Data loss and enables
efficient compression.

Time

Amount of data

Loss area

Time

2-7

Product Specification

DVD-Video Feature 3

High quality surround audio.

DVD-Video can store the audio using the 5.1ch Dolby Digital compression or the advanced Liner PCM method,
providing the better-than-CD quality and theater like audio quality.
• DTS (Digital Theater System)
Home theatre and music playback in the home, DTS provides high quality 5.1-channel surround sound with
many extras not offered by other consumer formats. As well as handling DTS-branded releases from a growing
number of music labels and consumer software producers, DTS provides enhanced 6.1 matrix and DTS 6.1
discrete decoding that envelopes the listener in sound. DTS technology is featured in a wide cross section of
receiver/pre-amplifiers, DVD players and and add-on components from leading consumer audio vendors
• Dolby Digital (AC-3)
- Unlike the traditional Dolby pro-Logic method, the Dolby Digital method separates all 5 main channels
(Front L/R, Center, Surround (Rear) L/R)and the Sub woofer to provide live surround audio.
- Using the Down Mix method, the conventional Dolby Pro-Logic and Stereo are all compatible.
- Each separated channels are played back at CD quality sound. (Frequency band: 20Hz ~ 20KHz)
• Linear PCM (Pulse Code Modulation)
- Provides the high quality Digital sound without the audio data compression.
- Various Digital Recordings are possible as shown in the table to the right.

Sampling Frequency

Bit Rate
16bit

48KHz

20bit
24bit
16bit

96KHz

20bit
24bit

• Dolby Digital compatible Audio Mode
Channel Format
Audio Coding
Mode

Front
L

1/0

2-8

C

Surround (Rear)
R

L

R

O

2/0

O

3/0

O

2/1

O

3/1

O

2/2

O

3/2

O

Mono
O

O

O

O

Remark

Stereo

O
O

Mono

O

Mono

Surround

O

O

O

O

O

O

Samsung Electronics

DVD-Video Feature 4

Multi-Language

• Audio Dubbing - Max. 8 Languages
• Subtitle - Max. 32 Languages. Capable of storing, and selectiong.
• Linear PCM (Pulse Code Modulation)

DVD-Video Feature 5

Multi-Aspect

• Unlike the conventional VCD or LD, DVD-Video has the default of 16:9 Wide, and can be viewed using the
conventional 4:3 TV, enabling the expansion of viewer selection capabilities.
- 16 : 9 TV : Wide Mode (16:9 Wide Full Screen)
- 4 : 3 TV : Letter Box Mode, Pan & Scan Mode

16:9 Wide

4:3 Pan & Scan

4:3 Letter Box

Note ; This function is disc-dependent, may not work on all DVDs.

DVD-Video Feature 6

Multi-Angle

• Up to 9 angles of view may be stored, enabling the viewer to select a specific viewpoint at a given time.
--> Especially, for the Music Video and Sports Title, this provides a more lively image of the scene.

Note ; This function is disc-dependent, may not work on all DVDs.

Samsung Electronics

2-9

Product Specification

DVD-Video Feature 7

Multi-Story

• DVD-Video provides the enviroment suitable for the bi-directional Software develoment, providing multiple
scenarios. This feature enables the Multi-Story function.

OPTION

Parental Lock

• For the titles that are not suitable for children viewing, Parental Locks are set, requesting user defined
passwords for viewing
• Parential Locks may be set on specific frames of the Title, enabling the player to skip those frames during
playback.

COPYRIGHT

Regional Code & Macrovision

• Classify the world into 6 regions, and if the DVD Title and the Player’s “Reginal Code” do not agree, playback
is prohibited.
• Regionnal Coding is optional for the Soft developers (Region 0 All Code), but the Hardware developers
must adopt the appropriate regionnal code for sale.
- Region 1 : The United States and its territories, Canada.
- Region 2 : Europe, Japan, Greenland, Egypt, South Africa, the Middle East.
- Region 3 : Taiwan, Hongkong, Korea, South East Asia.
- Region 4 : Mexico, South America, Australia, New Zealand.
- Region 5 : Russia, Eastern Europe, India, Africa.
- Region 6 : China.
- Region 0 : Worldwide (All Code)

ˆ

Œ
´
Ø

Œ

´

Œ

ˇ

¨

´

ˆ
¨

• Adoptation of the Macrovision System disables the copying on to other media.

2-10

Samsung Electronics

Product Specification

Remark

DVD-Video Authoring Process

• The image quality of the DVD-Video may vary accoring to the quality of the Master and the Authoring Process
- The image quality of the DVD-Video varies according to the Digital Mastering Source such as the
conventional LD, VCD, or Original Film.
- Different Authoring Process are used accoring to the Software developers, and this may affect the
DVD image quality.
• Authoring Process

Video/Audio
Master

MPEG-2
Encoding

Surround Audio
Master

AC-3/MPEG Audio
Encoding

Subtitle
Master

Subtitle
Encoding

bit stream

Disc
Production
bit stream

Video/Audio
Subtitle
Multiplexing

Cutting
Master

bit stream

Authoring Process

Samsung Electronics

2-11

Product Specification

MEMO

2-12

Samsung Electronics

3. Software Update
3-1 Drive Firmware Update
3-1-1 Introduction
When you can not record and play on specific recording media (especially on newly available DVD-RW or DVD-R).

3-1-2 How to make an update disc
• Write the downloaded file onto a blank CD-R or CD-RW disc, using the following settings :
1) Download the software update file from the samsung internet site. (www.samsung.com)
2) Write the file to disc using the CD-RW of your computer.

NOTE
• Recommended Application Program
- Nero Burning / Easy CD Creator ..etc
• Option
- Extension name : “*.SMD”
- Multisession : No Multisession
- File name lenght : Max. of 11 = 8 + 3
- Character set : ISO 9660 or Joliet Format
- CD Close & Disc at once

WARNING
It is very important : please read the below notice below before updating your unit.
The following events may interrupt the update process and MAY RESULT IN PERMANENT DAMAGE TO THE UNIT WHILE UPDATING
! Unplugging the power cord.
@ Power Outage.
# Dirt or Scratches on the disc.
$ Opening a disc tray during processing.

Samsung Electronics

3-1

Software Update

1) Press OPEN/CLOSE to open the disc tray.
2) Insert the update CD-R disc with the software update, label
facing up.
3) Press OPEN/CLOSE to close the disc tray.
* It takes about 1~2 minites before the mesage below appears.

Fig. 3-2 Remote Control
Drive Update
Do you want to update drive-firmware?
Version: Xx.X.R129-> XX.X.R129

Atfer checking old and new version, select “Yes” or “No”
with “ ” or “ ” on the remote control.
* The Version is indicated by “XX.X modelname”

No

Yes

Fig. 3-1
* If you don’t see the message above, try another disc. Generally, this is caused by disc quality and by disc creating problem.
4) Press the ENTER button on the remote control (Fig. 3-2).
You will see “LOAD” on FLT Display.
Drive Update
Now, processing...
please, do not turn off the power.

Fig.3-3
5) It takes about 1~2 minutes to complete the update.
The message below will be displayed in the screen after update is completed and the tray will open automatically.

Drive Update
Drive firmware is successfully
updated.

Fig. 3-4

Fig. 3-5

6) After removing the update disc, turn off the unit with power button.
And there after turn on the unit with power button and then the will be closed.
The drive firmware is now completed.
3-2

Samsung Electronics

Software Update

3-2 Flash Update (Main PCB)
3-2-1 Introduction
When you encounter a problem which is not related to the DVD drive.

3-2-2 How to make an update disc
Write the downloaded file onto a blank CD-R or CD-RW disc, using the following settings :
1) Download the software update file from the samsung internet site. (www.samsung.com)
2) Write the file to disc using the CD-RW of your computer.

NOTE
• Recommended Application Program
- Nero Burning / Easy CD Creator ..etc
• Option
- Multisession : No Multisession
- CD close & disc at once
- ISO 9660 or joliet format
- Extension name : “*.RUF”
• In order to increase dise playability, add a dummy file (over 100MB) together with the latest program.
(The dummy file can be used any kind of file except MP3 file etc which can be played in the unit and we recommend to use a file whin
extension name as “*.dmy”, which can be changed from original one.)

WARNING
It is very important : please read the below notice below before updating your unit.
The followong events may interrupt the update process and MAY RESULT IN PERMANENT DAMAGE TO THE UNIT WHILE UPDATING
! Unplugging the power cord.
@ Power Outage.
# Dirt or Scratches on the disc.
$ Opening a disc tray during processing.

Samsung Electronics

3-3

Software Update

1) Press OPEN/CLOSE to open the disc tray.
2) Insert the update CD-R disc with the software update, label
facing up.
3) Press OPEN/CLOSE to close the disc tray.

Fig. 3-7 Remote Control
Flash Update
Do you want to update flash memory?
Version : YYMMDD.xx.R129
-> YYMMDD.xx.R129
No

Yes

Atfer checking old and new version, select “Yes” or “No”
with “ ” or “ ” on the remote control.
* The Version is indicated by “YYMMDD.xx modelname”

Fig. 3-6
* If you don’t see the message above, try another disc.
Generally, this is caused by disc quality and by disc creating problem.
4) Press the ENTER button on the remote control (Fig. 3-7).

Flash Update
Now, Processing...
Plase. do not turn off the power.

Fig. 3-8
5) It takes about 5 minutes to complete the update.
The message below will be displayed in the screen after update is completed and the tray will open automatically.

Flash Update

* If the message to the left isn’t displayed after 10minutes
and the unit is no longer functioning properly, contact a
samsung authorized service center.

Flash memory is successfully
updated.

Fig. 3-9
6) After removing the update disc, turn off the unit with power button.
And there after turn on the unit with power button and then the will be closed.
The Flash update is now completed.

3-4

Samsung Electronics

4. Disassembly and Reassembly
4-1 Cabinet and PCB
Note : Reassembly in reverse order.

4-1-1 Top Cabinet Removal
1) Remove 5 Screws Œ, ´, ˇ.
2) Lift up the Top Cabinet in direction of arrow.

1 SCREW
(3 x 10 B)

3 SCREWS
(3 x 10 B)

1 SCREW
(3 x 10 B)

Fig. 4-1 Top Cabinet Removal

Samsung Electronics

4-1

Disassembly and Reaasembly

4-1-2 Ass’y Front-Cabinet Removal
1) Release 6 Hooks Œ, ´, ˇ, ¨ and Ass’y Front-Cabinet ˆ.

2 HOOKS
1 HOOK

1 HOOK
2 HOOKS

Assy Front-Cabinet

Fig. 4-2 Ass’y Front-Cabinet Removal

4-2

Samsung Electronics

Disassembly and Reaasembly

4-1-3 Ass’y Deck Removal
1) Remove 4 Screws Œ, ´ from the Ass’y Deck ˇ and lift it up.

2 SCREWS

2 SCREWS

(3 x 8 Y)

(3 x 10 Y)

Ass’y Deck

Fig. 4-3 Ass’y Deck Removal

Samsung Electronics

4-3

Disassembly and Reaasembly

4-1-4 Main PCB Removal
1) Remove 2 Screws Œ, from the Main PCB ´ and lift it up.

2 SCREWS
(3 x 8 Y)

Fig. 4-4 Main PCB Removal

4-4

Samsung Electronics

Disassembly and Reaasembly

4-1-5 Jack PCB and Sub PCB Removal
1) Remove 5 Screws Œ, ´ from the Jack PCB ˇ and lift it up.
2) Remove 1 Screw ¨ from the Sub PCB ˆ and lift it up.

4 SCREWS

1 SCREW

(3 x 6 Y)

(3 x 6 Y)

1 SCREW
(3 x 6 W)

Fig. 4-5 Jack PCB and Sub PCB Removal

Samsung Electronics

4-5

Disassembly and Reaasembly

4-2 PCB Location

Main PCB

Jack PCB

Sub PCB

Fig. 4-6 PCB Location

4-6

Samsung Electronics

5. Troubleshooting
NO Power Detected
(Stand by LED OFF)

PAFT1 is normal?

No

Change fuse

Yes

PVDL1/2~PSDZ1/2
PFZZ1/2~ PVZL1/2
SHORT and OPEN
Are normal?

No

Change short circuited or
opened parts

Yes

Is there voitage at
PQIZ1[Pin 5]?
(Over 10V)

No

Change PQIZ1 IC.

Yes

Operation of PQIZ1 is
Normal?

No

Replace PQIZ1

Yes

Check feed back PQIZ1[PIN 3]
Is 5.8V

Samsung Electronics

5-1

Troubleshooting

There's no Digital Audio Out

Check Current Digital Audio
Setting is PCM.

No

Check the A/V Receiver
can Decode Current
Bit-Steam

Yes

ChecK Digital Audio data
at pin 2 of CN4
(MAIN PCB)

No

Set audio setting to
Bitstream in customer
menu.

Yes

No

Replace Main PCB

Yes

Check 5V AVJ5

No

Replace AVJ5
AUDIO DATA

Yes

Check the Cable

5-2

Samsung Electronics

Troubleshooting

CVBS (Video) output error

PIN 10 of
CN3 of Jack PCB
or CN2 of Main PCB has
1V pk-pk level?

No

Check the DIC1 on MAIN PCB

Yes

Analog signals are
Inputted normally
VIC1[pin4]

No

Check the connection between
10Pin in CN3 Of JACK PCB and VIC1

No

Check the connection between
VIC1[pin1] and Power line (VL6, PPIF1).

Yes

Power is
Normal(5v) at VIC1[pin1]?

Yes

Pin5 in VIC1 is
In high state?
Yes

Video signal of
About P-P1V appears at
Output Jack?

No

Check the connection between
VIC1(PIN5) and IC601(PIN89).
Check VIC1 peripheral circuit.

# IF Recorder is under PSO (progressive scan output) MODE, it does not
output the CVBS& S-Video signal.

No

Check the connection between
VIC1 and output jack.
CVBS(Color-bar)

Yes

Check the RCA Cable

Samsung Electronics

5-3

Troubleshooting

S-Video output error

Pin10 and
Pin8 in CN3 of Jack PCB or
CN2 of Main PCB has *
normal level?

No

Check the DIC1 on MAIN PCB

Yes

Analog signals are
Inputted normally
VIC1(pin4,2)

No

Check the connection between
Pin10 and Pin8 in CN3 Of JACK PCB
and VIC1

No

Check the connection between
VIC1[pin1] and Power line (VL6, PPIF1).

Yes

Power is
Normal(5v) at VIC1(pin1)?

Yes

Pin5 in VIC1 is
In high state?
Yes

Video signal of
About P-P1V appears at
Output Jack?

# IF Recorder is under PSO (progressive
scan output) MODE, it does not output the CVBS& S-Video signal.

No

Check the connection between
VIC1(PIN5) and IC601(PIN89).
Check VIC1 peripheral circuit.

# Nomal level
: pin 10 is 1Vpk-pk
pin 8 is 0.28V on color burst
No

Y(Color-bar)

Check the connection between
VIC1 and output jack.
C(Color-bar)

Yes

Check the RCA cable

5-4

Samsung Electronics

Troubleshooting

AV2 CVBS Video Input Error

Pin 5 In IC702
Has about p-p 1V level?

No

Check the connection between
Pin 5 in IC702 and L2 Pin-Jack.

Yes

Pin 13 In IC702
Has about p-p 1V signal?

Yes

No

Check Pin 1 in IC702
of input power(5V).

VIC1 of Main PCB Clock

A

VIC1 of Main PCB DATA

Samsung Electronics

5-5

Troubleshooting

AV1 CVBS Video Input Error

Pin 3 In IC702
Has about p-p 1V level?

No

Check the connection between
Pin 3 in IC702 and L1 Pin-Jack.

No

Check Pin 7 in IC702
of input power(5V).

Yes

Pin 7 In IC702
Has about p-p 1V signal?
Yes

A

Pin 2 / 4 in IC702 is
In Low and high state
Respectively?
Yes

Pin80 in VIC1 of Main PCB
has about p-p 1V level?

Check the connection between Pin 2 and
Pin 4 in IC702 and Pin 92 and 91 in IC601.

No
Pin9/10
L/L : RF Signal
L/H : Line1
H/L : Line2
H/H : Reserved
No

Check the connection between Pin 80 in
VIC1 of Main PCB and Pin 7 in IC702.

Yes

Pin40 and pin 54~43 in VIC1
of Main PCB has Clock and
Digital Video Signal
normal form ?

No

Check VIC1 of Main PCB
peripheral circuit. .
CVBS(Color -bar)

Yes
Change Main PCB

5-6

Samsung Electronics

Troubleshooting

AV1 S-Video Video Input Error

Pin 36 and 42 in VIC1 of Main
PCB has *normal level?

No

Check the connection between
Pin 36 and 42 in VIC1 of Main PCB
and L1 S-Video Jack.

Yes
# Nomal level
: pin 35 is 1Vpk-pk
pin 42 is 0.28V on color burst
Pin40 and pin 54~43 in VIC1
of Main PCB has Clock and
Digital Video Signal
normal form ?
Yes

No

Check VIC1 of Main PCB
peripheral circuit.

VIC1 of Main PCB Clock

Change Main PCB

VIC1 of Main PCB DATA

Samsung Electronics

5-7

Troubleshooting

Tuner Video Input Error

Tuner input line signal is OK?
(jack PCB)

No

Connect tuner line to TV directly

Yes

Supplied power
(Pin 3 : 5V pin 14 : 33V) for
tuner is OK?

No

Pin 3 : 5V pin 14 : 33V check its line
(jack PCB)

Yes

A

5-8

Samsung Electronics

Troubleshooting

Component output error

Pin2/4/6 in CN3 of
Jack PCB or CN2 of Main PCB
has * normal level?

No

Check the DIC1 on MAIN B/D.

Yes

Analog signals are
Inputted normally
VIC1(pin6/8/9)

No

Check the connection between
Pin2/4/6 in CN3 Of JACK PCB
and VIC1(pin6/8/9)

Yes

Power is
Normal(5v) at VIC1(pin1)?

No

Check the connection between
VIC1[pin1] and Power line (VL6, PPIF1).

Yes

Pin13 in VIC1 is
In high state?

No

Check the connection between
VIC1(PIN3) and IC601(PIN89).
Check VIC1 peripheral circuit.

Yes

Video signal of
About 1V pk-pk appears at
Output Jack?
Yes

Check the RCA cable
Y(Color-bar)

Samsung Electronics

No

Check the connection between
VIC1 and output jack.

# Nomal level
: pin 6 is 1Vpk-pk
pin 2/4 is + 0.35V

Pb(Color-bar)

Pr(Color-bar)

5-9

Troubleshooting

Digital clock(10)

Audio Input is not Recording

Check the select signal pin9,10
of IC203(JACK PCB)

No

Check pin 90,91(5V) of the
Front Micom IC601 (JACK PCB)

Yes
Digital clock(11)

Check all the 12Vcc
pin 16 of IC203 and 12Vcc of CN10
AIC4(JACK).

No

Check SMPS

Yes

Check the 3.3V pin14
and 5V pin5 of AU5
(MAIN PCB)

No

Replace Main PCB
Digital clock(12)

Yes

Check Digital clock and data
pin 10, 11, 12, 15 of
AU5(MAIN PCB)

No

Replace Main PCB

Yes
Digital clock(15)

Check the passive parts
around jack pin.

5-10

Samsung Electronics

Troubleshooting

There is no Audio Output

Check he audio signal
AR413 and AR437
(JACK PCB)

No

Check the Low state pin22 of the
Front Micom IC601(JACL PCB)

Yes

Check all the 5V pin8
of AIC1
(MAIN PCB)

No

Check SMPS

Yes

Check the audio signal pin7
pin8 of AIC1
(MAIN PCB)

No

Replace Main PCB

Yes

Check digital clock and
data pin1, 2, 3, 16 of AIC1
(MAIN PCB)
Yes

No
Replace MAIN PCB

AUDIO DATA

Check the passive parts
arond Jack pin.

Samsung Electronics

5-11

Troubleshooting

EDS [Extended data Services]
is abnormal

Tuner input line signal
is OK?

No

Tuner line connect TV directly.

Yes

IIC line (SCL,SDA) from
front micom is OK?

No

Check the IIC line

Yes

Does TY2 make 14.31
Mhz signal? (jack PCB)

No

Check TY2 or around elements

Yes

Change IC601 or check
around elements

5-12

Samsung Electronics

Troubleshooting

Disc Ioading error

Are Main and deck
power OK?
(5v, 12v)

No

Check he power

Yes

Is the 40pin
FFC cable(betweenmain & deck)
inserted correctly?

No

Reinsert FFC cable correctly

Yes

Is the wavefrom
of DIC3 pin26 normal?
(MAIN PCB)
Yes

No

Change the Main board

DIC3-Pin26

Change the deck

Samsung Electronics

5-13

Troubleshooting

Tuner Video Out Abnormal

Tuner input line signal(pin16)
is OK? (Jack PCB)

No

Connect tuner line to TV directly

Yes

Supplied power
(Pin 3 : 5V pin 14 : 33V) for
tuner is OK?

No

Pin 3 : 5V pin 14 : 33V check its line
(jack PCB)

No

Check IC203 or its around elements
(jack PCB)

Yes

Video signal of TE14 is OK?
(jack PCB)
Yes

Tuner Video

Refer to video line in abnormal

5-14

Samsung Electronics

Troubleshooting

Tuner Audio Out Abnormal

Tuner line signal is OK?

No

Connect tuner line to TV directly.

Yes

Supplied power
IC604(Jack PCB) is OK?
(Pin 5 : about 5V)

No

Check its power line or around elements

Yes

4.5MHz signal from 13 pin
of tuner(TM1) is OK?

No

Check the SIF signal or tuner

Yes

Does XT4M01
make 3.58MHz signal?
(jack PCB)
Yes

No

Check XT4M01 or around elements

Tuner Audio

If TIC1 is normal, refer to
audio line in abnomal

Samsung Electronics

5-15

Troubleshooting

Remocon Error

KRMC1(pin1) signal
is OK? (SMPS PCB)

No

Check the power(pin2) line
orchange KRMC1.

Yes

IC601(pin5) signal
is OK? (Jack PCB)

No

Check the signal line or surrounding
elements.

Yes

Change IC601 or
surrounding elements

5-16

Samsung Electronics

6. Exploded View and Parts List
Page
6-1 Cabinet Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

Samsung Electronics

6-2

6-1

Exploded Views and Parts List

6-1 Cabinet Assembly
W009

W009

(3 x 10 Y)

W200

(3 x 10 Y)

(3 x 8 Y)

H001

P001

W001
(3 x 10 B)

W001
(3 x 10 B)

W275
(3 x 6 Y)

P022

W275
(3 x 6 Y)

C015

P004

W001
(3 x 10 B)

P025
W268
(3 x 6 W)

S.N.A.: Service Not Available

C001

A001

W009
(3 x 10 Y)

C002
P007
C657

6-2

Samsung Electronics

Exploded Views and Parts List

Loc. No

Parts No.

A001
C001
C002
C015
C657
H001
P001
P004
P007
P022
P025
W001
W009

AK59-00055A
AK97-01447L
AK64-01432A
AK64-01444B
AK64-01433G
AK97-01553A
AK92-00872A
AK97-01530A
AK92-00891A
AK92-00873A
AH39-10061A
6003-000275
6003-000276

REMOCON-ASSY;DVD-R130/XAA,SEC,197.
ASSY-CABINET FRONT;HIPS 94 HB,DVDDOOR-TRAY;DVD-R130,ABS 94HB,T2,H15
CABINET-TOP;SV-R3600,PCM,T0.6,W430
DOOR-JACK;DVD-R130/XSA,ABS 94HB,T2
ASSY-LOADER;-,SV-R3600,LOADER ASSY
ASSY PCB-MAIN;DVD-R130/XAA,MAIN PC
ASSY PCB-KEY PCB;SV-R3600,ANDES
ASSY PCB-KEY;DVD-R130/XAA,KEY PCB
ASSY PCB-JACK;DVD-R130/XAA,JACK PC
CBF-POWER CORD;KJ-10W,EP2,AWG2/18,
SCREW-TAPTITE;BH,+,-,B,M3,L10,ZPC(
SCREW-TAPTITE;BH,+,-,B,M3,L10,ZPC(

1
1
1
1
1
1
1
1
1
1
1
5
8

SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA

W200
W268
W275

6003-001375
6003-000254
6003-001561

SCREW-TAPTITE;BH,+,B,M3,L8,ZPC(YEL
SCREW-TAPTITE;BH,+,-,S,M3,L6,ZPC(W
SCREW-TAPTITE;BH,+,-,B,M3,L6,ZPC(Y

2
1
5

SA
SA
SA

Samsung Electronics

Description ; Specification

Q ty S.N.A

Remark

6-3

Exploded Views and Parts List

MEMO

6-4

Samsung Electronics

7. Electrical Parts List
Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

P001
AC1
AC12
AC14
AC15

AK92-00872A
2203-005148
2203-005148
2203-005148
2203-005148

ASSY PCB-MAIN;DVD-R130/XAA,MAIN PC
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

AC18
AIC1
AIC2
AL1
AL2

2203-005148
1002-001395
1002-001459
3301-001419
3301-001419

C-CER,CHIP;100nF,10%,16V,X7R,1608
IC-D/A CONVERTER;PCM1753,24Bit,SSO
IC-A/D CONVERTER;PCM1803A,24BIT,SS
BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M

1
1
1
1
1

SA
SA
SA
SA
SA

AR1
AR11
AR13
AR2
AR3

2011-000515
2007-000084
2007-000070
2011-000515
2011-000515

R-NET;4.7Kohm,5%,1/16W,L,CHIP,8P,T
R-CHIP;4.7Kohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-NET;4.7Kohm,5%,1/16W,L,CHIP,8P,T
R-NET;4.7Kohm,5%,1/16W,L,CHIP,8P,T

1
1
1
1
1

SA
SA
SA
SA
SA

AR4
ATC1
ATC2
ATC3
ATC5

2011-000515
2402-001217
2402-000204
2402-001059
2402-000007

R-NET;4.7Kohm,5%,1/16W,L,CHIP,8P,T
C-AL,SMD;220UF,20%,16V,WT,TP,6.6X6
C-AL,SMD;10UF,20%,16V,WT,TP,4.3X4.
C-AL,SMD;220UF,20%,6.3V,-,TP,6X6.6
C-AL,SMD;22uF,20%,6.3V,GP,TP,4.3x4

1
1
1
1
1

SA
SA
SA
SA
SA

ATC6
C1
C10
C100
C101

2402-000204
2203-000384
2203-005148
2203-005148
2203-005148

C-AL,SMD;10UF,20%,16V,WT,TP,4.3X4.
C-CER,CHIP;0.015nF,5%,50V,C0G,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C102
C103
C104
C106
C107

2203-005148
2203-005148
2203-005148
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C108
C109
C11
C110
C112

2203-005148
2203-005148
2203-005148
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C113
C114
C116
C117
C119

2203-005148
2203-005148
2203-001683
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;0.068nF,5%,50V,NP0,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C12
C121
C122
C13
C14

2203-005148
2203-005148
2203-000315
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;0.12nF,5%,50V,C0G,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C15
C16
C17
C18
C19

2203-005148
2203-005148
2203-005148
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C2

2203-000426

C-CER,CHIP;0.018nF,5%,50V,C0G,1608

1

SA

Samsung Electronics

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

C20
C21
C22
C23

2203-005148
2203-005148
2203-001554
2203-001554

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;1.8nF,10%,50V,X7R,TP,16
C-CER,CHIP;1.8nF,10%,50V,X7R,TP,16

1
1
1
1

SA
SA
SA
SA

C24
C25
C26
C27
C28

2203-005148
2203-001554
2203-001554
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;1.8nF,10%,50V,X7R,TP,16
C-CER,CHIP;1.8nF,10%,50V,X7R,TP,16
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C29
C3
C30
C31
C32

2203-005148
2203-005148
2203-005148
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C33
C34
C35
C36
C37

2203-005148
2203-005148
2203-005148
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C38
C39
C4
C41
C42

2203-005148
2203-005148
2203-005148
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C43
C44
C46
C48
C49

2203-005148
2203-005148
2203-005148
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C5
C50
C51
C52
C53

2203-005148
2203-005148
2203-005148
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C54
C55
C6
C64
C65

2203-005148
2203-005148
2203-005148
2203-000440
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;1nF,10%,50V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C66
C67
C68
C69
C7

2203-005148
2203-005148
2203-000440
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;1nF,10%,50V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C70
C71
C74
C75
C76

2203-005148
2203-005148
2203-000440
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;1nF,10%,50V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C77
C78

2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1

SA
SA

This Document can not be used without Samsung’s authorization

7-1

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

C79
C8
C80

2203-005148
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1

SA
SA
SA

C81
C82
C83
C84
C85

2203-000440
2203-005148
2203-005148
2203-005148
2203-005148

C-CER,CHIP;1nF,10%,50V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C86
C87
C89
C9
C90

2203-005148
2203-005148
2203-005148
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C91
C92
C93
C94
C95

2203-005148
2203-005148
2203-000975
2203-005148
2203-001607

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;47nF,10%,25V,X7R,TP,160
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;0.22nF,5%,50V,NP0,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C96
C97
C99
CE1
CE3

2203-000851
2203-005148
2203-000851
2402-001059
2402-001059

C-CER,CHIP;0.039nF,5%,50V,C0G,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;0.039nF,5%,50V,C0G,1608
C-AL,SMD;220UF,20%,6.3V,-,TP,6X6.6
C-AL,SMD;220UF,20%,6.3V,-,TP,6X6.6

1
1
1
1
1

SA
SA
SA
SA
SA

CE4
CN5
CON1
CON2
DIC1

2402-001059
3708-001935
3710-002075
3710-002075
1205-002704

C-AL,SMD;220UF,20%,6.3V,-,TP,6X6.6
CONNECTOR-FPC/FFC/PIC;40P,0.5mm,SM
SOCKET-BOARD TO BOARD;30P,2R,2MM,S
SOCKET-BOARD TO BOARD;30P,2R,2MM,S
IC-CODEC;S5L3200,BGA,292P,27x27mm,

1
1
1
1
1

SA
SA
SA
SA
SA

DIC2
DIC3
DIC4
DIC5
DIC6

1105-001563
1107-001242
0801-002624
0801-002624
1103-001134

IC-DRAM;HYB25D256160CE-6,16Mx16Bit
IC-FLASH MEMORY;39VF160,1Mx16,TSOP
IC-CMOS LOGIC;74LVC16374A,16BIT D
IC-CMOS LOGIC;74LVC16374A,16BIT D
IC-EEPROM;24C040,512x8,SOP,8P,5.13

1
1
1
1
1

SA
SNA
SA
SA
SA

DIC7
DIC9
FIC1
R10
R102

0801-002701
0801-002166
1205-001988
2007-000084
2007-001014

IC-CMOS LOGIC;74VHCT125A,BUFFER,TS
IC-CMOS LOGIC;7SHU04,INVERTER,SSOP
IC-DATA COMM./GEN.;TSB41AB1-PAP,QF
R-CHIP;4.7Kohm,5%,1/10W,TP,1608
R-CHIP;51OHM,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R103
R104
R105
R11
R113

2007-001014
2007-001014
2007-001014
2007-000084
2007-000078

R-CHIP;51OHM,5%,1/10W,TP,1608
R-CHIP;51OHM,5%,1/10W,TP,1608
R-CHIP;51OHM,5%,1/10W,TP,1608
R-CHIP;4.7Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R118
R119
R12
R122
R123

2007-000074
2007-000113
2007-000070
2007-000071
2007-000071

R-CHIP;100ohm,5%,1/10W,TP,1608
R-CHIP;33ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;22ohm,5%,1/10W,TP,1608
R-CHIP;22ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R124
R125
R13
R14
R15

2007-000071
2007-000071
2007-000070
2007-000070
2007-000070

R-CHIP;22ohm,5%,1/10W,TP,1608
R-CHIP;22ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R16
R17

2007-000070
2007-000070

R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608

1
1

SA
SA

7-2

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

R18
R19
R2

2007-000084
2007-000763
2007-000084

R-CHIP;4.7Kohm,5%,1/10W,TP,1608
R-CHIP;330ohm,1%,1/10W,TP,1608
R-CHIP;4.7Kohm,5%,1/10W,TP,1608

1
1
1

SA
SA
SA

R20
R21
R29
R3
R33

2007-000078
2007-000078
2007-000090
2007-000109
2007-000084

R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;1Mohm,5%,1/10W,TP,1608
R-CHIP;4.7Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R34
R35
R36
R37
R38

2007-000074
2007-000074
2007-000070
2007-000078
2007-000070

R-CHIP;100ohm,5%,1/10W,TP,1608
R-CHIP;100ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R39
R40
R41
R43
R45

2007-000077
2007-000086
2007-000102
2007-000078
3301-001419

R-CHIP;470ohm,5%,1/10W,TP,1608
R-CHIP;5.6Kohm,5%,1/10W,TP,1608
R-CHIP;100Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
BEAD-SMD;220ohm,1608,TP,133ohm/70M

1
1
1
1
1

SA
SA
SA
SA
SA

R46
R50
R51
R52
R53

2007-000090
2007-000070
2007-000113
2007-000074
2007-001044

R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;33ohm,5%,1/10W,TP,1608
R-CHIP;100ohm,5%,1/10W,TP,1608
R-CHIP;56ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R54
R55
R56
R58
R59

2007-000965
2007-001044
2007-001056
2007-001044
2007-000090

R-CHIP;5.1Kohm,5%,1/10W,TP,1608
R-CHIP;56ohm,5%,1/10W,TP,1608
R-CHIP;6.2Kohm,5%,1/10W,TP,1608
R-CHIP;56ohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R6
R60
R61
R66
R7

2007-000070
2007-001044
2007-000090
2007-000074
2007-000084

R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;56ohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;100ohm,5%,1/10W,TP,1608
R-CHIP;4.7Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R71
R72
R73
R8
R88

2007-000083
2007-000074
2007-000074
2007-000084
2007-000078

R-CHIP;3Kohm,5%,1/10W,TP,1608
R-CHIP;100ohm,5%,1/10W,TP,1608
R-CHIP;100ohm,5%,1/10W,TP,1608
R-CHIP;4.7Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R89
R90
RIC1
RIC2
RP1

3301-001309
3301-001309
1203-003996
1203-003806
2011-000585

BEAD-SMD;47ohm,1608,TP,-,BEAD-SMD;47ohm,1608,TP,-,IC-POSI.FIXED REG.;KIA78R025F,DPAK
IC-POSI.ADJUST REG.;KIA78R000,DPAK
R-NET;47ohm,5%,1/16W,L,CHIP,8P,TP,

1
1
1
1
1

SA
SA
SA
SA
SA

RP10
RP12
RP2
RP20
RP21

2011-000585
2011-000585
2011-000585
2011-001194
2011-001194

R-NET;47ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;47ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;47ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,

1
1
1
1
1

SA
SA
SA
SA
SA

RP22
RP23
RP24
RP25
RP26

2011-001194
2011-001194
2011-001194
2011-001194
2011-001194

R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,

1
1
1
1
1

SA
SA
SA
SA
SA

RP27

2011-001194

R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,

1

SA

This Document can not be used without Samsung’s authorization

Samsung Electronics

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

RP28
RP3
RP30
RP31

2011-001194
2011-000585
2011-000585
2011-000585

R-NET;51ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;47ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;47ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;47ohm,5%,1/16W,L,CHIP,8P,TP,

1
1
1
1

SA
SA
SA
SA

RP42
RP43
RP44
RP45
RP5

2011-000002
2011-000002
2011-000002
2011-000002
2011-000585

R-NET;22ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;22ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;22ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;22ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;47ohm,5%,1/16W,L,CHIP,8P,TP,

1
1
1
1
1

SA
SA
SA
SA
SA

RP6
RP8
TC1
TC14
TC16

2011-000585
2011-000585
2402-001059
2402-001059
2402-001238

R-NET;47ohm,5%,1/16W,L,CHIP,8P,TP,
R-NET;47ohm,5%,1/16W,L,CHIP,8P,TP,
C-AL,SMD;220UF,20%,6.3V,-,TP,6X6.6
C-AL,SMD;220UF,20%,6.3V,-,TP,6X6.6
C-AL,SMD;1uF,20%,50V,HR,TP,4.3x4.3

1
1
1
1
1

SA
SA
SA
SA
SA

TC3
TC5
TC6
TC7
TC9

2402-001086
2402-001086
2402-001086
2402-001059
2402-001059

C-AL,SMD;100UF,20%,16V,WT,TP,6.6X6
C-AL,SMD;100UF,20%,16V,WT,TP,6.6X6
C-AL,SMD;100UF,20%,16V,WT,TP,6.6X6
C-AL,SMD;220UF,20%,6.3V,-,TP,6X6.6
C-AL,SMD;220UF,20%,6.3V,-,TP,6X6.6

1
1
1
1
1

SA
SA
SA
SA
SA

VC1
VC11
VC12
VC13
VC15

2203-005148
2203-005148
2203-005148
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

VC16
VC17
VC18
VC2
VC20

2203-005148
2203-005148
2203-005148
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

VC21
VC22
VC23
VC24
VC25

2203-005148
2203-005148
2203-005148
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

VC26
VC27
VC28
VC29
VC5

2203-005148
2203-000280
2203-005148
2203-005148
2203-005148

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;0.01nF,0.5pF,50V,C0G,16
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

VC6
VC7
VC8
VC9
VIC1

2203-005148
2203-005148
2203-005148
2203-005148
1204-002419

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
IC-VIDEO DECODER;TW9906,TQFP,80P,1

1
1
1
1
1

SA
SA
SA
SA
SA

VL1
VR1
VR14
VR15
VR16

2703-000398
2007-000113
2007-000113
2007-000080
2007-000080

INDUCTOR-SMD;10uH,10%,3225
R-CHIP;33ohm,5%,1/10W,TP,1608
R-CHIP;33ohm,5%,1/10W,TP,1608
R-CHIP;2Kohm,5%,1/10W,TP,1608
R-CHIP;2Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

VR2
VR23
VR4
VR8
VRP1

2007-000113
2007-000074
2007-000113
2007-000113
2011-000002

R-CHIP;33ohm,5%,1/10W,TP,1608
R-CHIP;100ohm,5%,1/10W,TP,1608
R-CHIP;33ohm,5%,1/10W,TP,1608
R-CHIP;33ohm,5%,1/10W,TP,1608
R-NET;22ohm,5%,1/16W,L,CHIP,8P,TP,

1
1
1
1
1

SA
SA
SA
SA
SA

VRP2

2011-000002

R-NET;22ohm,5%,1/16W,L,CHIP,8P,TP,

1

SA

Samsung Electronics

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

VRP3
VRP4
VTC3
VTC4

2011-000816
2011-000816
2402-001059
2402-001059

R-NET;100ohm,5%,1/16W,L,CHIP,8P,TP
R-NET;100ohm,5%,1/16W,L,CHIP,8P,TP
C-AL,SMD;220UF,20%,6.3V,-,TP,6X6.6
C-AL,SMD;220UF,20%,6.3V,-,TP,6X6.6

1
1
1
1

SA
SA
SA
SA

Y1
Y2

2801-004095
2801-004021

CRYSTAL-SMD;27MHz,20ppm,28-ABY,14p
CRYSTAL-SMD;24.576MHz,20ppm,28-AAN

1
1

SA
SA

P004
CN704
FL286
SW703
SW705

AK97-01530A
3708-001803
3809-001667
3404-001182
3404-001182

ASSY PCB-KEY PCB;SV-R3600,ANDES
CONNECTOR-FPC/FFC/PIC;10P,1.25MM,A
FFC CABLE-FLAT;30V,80C,70mm,10P,1.
SWITCH-TACT;DC12V,50MA,100GF,6.0X6
SWITCH-TACT;DC12V,50MA,100GF,6.0X6

1
1
1
1
1

SA
SA
SA
SA
SA

SW706
SW707
SW708
SW709
SW710

3404-001182
3404-001182
3404-001182
3404-001182
3404-001182

SWITCH-TACT;DC12V,50MA,100GF,6.0X6
SWITCH-TACT;DC12V,50MA,100GF,6.0X6
SWITCH-TACT;DC12V,50MA,100GF,6.0X6
SWITCH-TACT;DC12V,50MA,100GF,6.0X6
SWITCH-TACT;DC12V,50MA,100GF,6.0X6

1
1
1
1
1

SA
SA
SA
SA
SA

P007
AR702
AR715
AR722
AR740

AK92-00891A
2001-000591
2001-000591
2001-000472
2001-000472

ASSY PCB-KEY;DVD-R130/XAA,KEY PCB
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8
R-CARBON;3.3KOHM,5%,1/8W,AA,TP,1.8
R-CARBON;2.7KOHM,5%,1/8W,AA,TP,1.8
R-CARBON;2.7KOHM,5%,1/8W,AA,TP,1.8

1
1
1
1
1

SA
SA
SA
SA
SA

AVIN2
AVIN2B
CN7
ESD01
ESD02

3722-002384
AK63-00307A
3722-002383
0403-001083
0403-001083

JACK-PIN;3P,SN/NI,YEL/WHT/RED,ANGL
GROUND-FRONT AV;DVD-R130,SUS,T0.2,
JACK-IEEE1394;4P/1,AU,BLK,ANGLE,IE
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200

1
1
1
1
1

SA
SA
SA
SA
SA

ESD03
ESD04
ESD05
ESD06
ESD07

0403-001083
0403-001083
0403-001083
0403-001083
0403-001083

DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200

1
1
1
1
1

SA
SA
SA
SA
SA

ESD08
FCON4
FL615
R720
SW711

0403-001083
3708-001695
3809-001787
2007-000098
3404-001261

DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
CONNECTOR-FPC/FFC/PIC;13P,1MM,STRA
FFC CABLE-FLAT;30V,80C,115mm,13P,1
R-CHIP;56Kohm,5%,1/10W,TP,1608
SWITCH-TACT;15V DC,20mA,100gf,7.4X

1
1
1
1
1

SA
SA
SA
SA
SA

VR40

2001-000969

R-CARBON;75OHM,5%,1/8W,AA,TP,1.8X3

1

SA

P022
AC16
AC17
AC405
AC406

AK92-00873A
2203-000315
2203-000315
2203-005148
2203-005148

ASSY PCB-JACK;DVD-R130/XAA,JACK PC
C-CER,CHIP;0.12nF,5%,50V,C0G,1608
C-CER,CHIP;0.12nF,5%,50V,C0G,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

AC407
AC408
AC409
AC410
AC413

2203-000125
2203-000125
2203-000315
2203-000315
2203-005148

C-CER,CHIP;1.2nF,10%,50V,X7R,TP,16
C-CER,CHIP;1.2nF,10%,50V,X7R,TP,16
C-CER,CHIP;0.12nF,5%,50V,C0G,1608
C-CER,CHIP;0.12nF,5%,50V,C0G,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

AC702

2203-000783

C-CER,CHIP;0.33nF,5%,50V,C0G,1608

1

SA

This Document can not be used without Samsung’s authorization

7-3

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

AC705
AC714
AC715
ACC2

2203-000783
2203-000783
2203-000783
2203-000315

C-CER,CHIP;0.33nF,5%,50V,C0G,1608
C-CER,CHIP;0.33nF,5%,50V,C0G,1608
C-CER,CHIP;0.33nF,5%,50V,C0G,1608
C-CER,CHIP;0.12nF,5%,50V,C0G,1608

1
1
1
1

SA
SA
SA
SA

ACC3
AD1
AD2
AD3
AE404

2203-000315
0407-000123
0407-000123
0407-000123
2401-003107

C-CER,CHIP;0.12nF,5%,50V,C0G,1608
DIODE-ARRAY;DAN202K,80V,100mA,CA2DIODE-ARRAY;DAN202K,80V,100mA,CA2DIODE-ARRAY;DAN202K,80V,100mA,CA2C-AL;47uF,20%,16V,GP,TP,5x7,5

1
1
1
1
1

SA
SA
SA
SA
SA

AE405
AE41
AE412
AE42
AE46

2401-003107
2401-000414
2401-002165
2401-000922
2401-000922

C-AL;47uF,20%,16V,GP,TP,5x7,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;100uF,20%,16V,GP,TP,6.3x7,5
C-AL;22uF,20%,16V,GP,TP,5x5,5
C-AL;22uF,20%,16V,GP,TP,5x5,5

1
1
1
1
1

SA
SA
SA
SA
SA

AE47
AE701
AE702
AE703
AE704

2401-000414
2401-000922
2401-000922
2401-000414
2401-000414

C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;22uF,20%,16V,GP,TP,5x5,5
C-AL;22uF,20%,16V,GP,TP,5x5,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;10uF,20%,16V,GP,TP,4x7,5

1
1
1
1
1

SA
SA
SA
SA
SA

AE705
AE712
AE714
AE715
AIC4

2401-000922
2401-000922
2401-000922
2401-000922
1201-000163

C-AL;22uF,20%,16V,GP,TP,5x5,5
C-AL;22uF,20%,16V,GP,TP,5x5,5
C-AL;22uF,20%,16V,GP,TP,5x5,5
C-AL;22uF,20%,16V,GP,TP,5x5,5
IC-OP AMP;4560,SOP,8P,173MIL,DUAL,

1
1
1
1
1

SA
SA
SA
SA
SA

AMC01
AME01
AQ1
AQ3
AQ4

2203-005148
2401-003107
0501-000341
0501-000341
0504-000128

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-AL;47uF,20%,16V,GP,TP,5x7,5
TR-SMALL SIGNAL;KSC1623-L,NPN,200m
TR-SMALL SIGNAL;KSC1623-L,NPN,200m
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT

1
1
1
1
1

SA
SA
SA
SA
SA

AQ5
AQ51
AQ52
AQ6
AQ7

0504-000156
0504-000128
0504-000156
0504-000128
0504-000156

TR-DIGITAL;KSR2103,PNP,200MW,22K/2
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT
TR-DIGITAL;KSR2103,PNP,200MW,22K/2
TR-DIGITAL;-,NPN,200MW,22K/22K,SOT
TR-DIGITAL;KSR2103,PNP,200MW,22K/2

1
1
1
1
1

SA
SA
SA
SA
SA

AR26
AR301
AR302
AR303
AR4

2007-000078
2007-000078
2001-000429
2007-000070
2001-000290

R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X

1
1
1
1
1

SA
SA
SA
SA
SA

AR40
AR403
AR404
AR407
AR408

2007-000078
2007-001010
2007-001010
2007-001010
2001-000837

R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;51Kohm,5%,1/10W,TP,1608
R-CHIP;51Kohm,5%,1/10W,TP,1608
R-CHIP;51Kohm,5%,1/10W,TP,1608
R-CARBON;51KOHM,5%,1/8W,AA,TP,1.8X

1
1
1
1
1

SA
SA
SA
SA
SA

AR409
AR410
AR411
AR412
AR413

2007-000092
2007-000092
2007-000070
2007-000090
2007-000075

R-CHIP;15Kohm,5%,1/10W,TP,1608
R-CHIP;15Kohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;220ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

AR414
AR415
AR420
AR421
AR460

2007-000075
2007-000075
2007-000122
2007-000090
2007-000122

R-CHIP;220ohm,5%,1/10W,TP,1608
R-CHIP;220ohm,5%,1/10W,TP,1608
R-CHIP;1.2Kohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;1.2Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

AR461

2007-000090

R-CHIP;10Kohm,5%,1/10W,TP,1608

1

SA

7-4

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

AR471
AR472
AR473
AR474

2007-000070
2007-000090
2007-000075
2007-000075

R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;220ohm,5%,1/10W,TP,1608
R-CHIP;220ohm,5%,1/10W,TP,1608

1
1
1
1

SA
SA
SA
SA

AR475
AR5
AR705
AR713
AR714

2007-000075
2001-000290
2007-000082
2007-000070
2007-000082

R-CHIP;220ohm,5%,1/10W,TP,1608
R-CARBON;10KOHM,5%,1/8W,AA,TP,1.8X
R-CHIP;3.3Kohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;3.3Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

AR725
AR734
AR735
AR900
AR901

2007-000081
2007-000081
2007-001167
2007-000070
2007-000070

R-CHIP;2.7Kohm,5%,1/10W,TP,1608
R-CHIP;2.7Kohm,5%,1/10W,TP,1608
R-CHIP;75ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

ASQ01
ASQ02
ASQ03
ASQ04
ASR01

0504-000142
0504-000118
0504-000142
0504-000118
2007-000084

TR-DIGITAL;FJN4301R,PNP,300MW,4.7K
TR-DIGITAL;KSR1003,NPN,300MW,22K/2
TR-DIGITAL;FJN4301R,PNP,300MW,4.7K
TR-DIGITAL;KSR1003,NPN,300MW,22K/2
R-CHIP;4.7Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

ASR02
AVJ1
AVJ2
AVJ5
BD05

2007-000084
3722-002449
3722-002450
3707-001070
3301-001419

R-CHIP;4.7Kohm,5%,1/10W,TP,1608
JACK-PIN;6P+VHS,Ni/Sn,RD-BU-GN/RDJACK-PIN;6P+VHS,Ni/Sn,RD-WH-YL/BLCONNECTOR-OPTICAL;PLUG,GP1FA550TZ,
BEAD-SMD;220ohm,1608,TP,133ohm/70M

1
1
1
1
1

SA
SA
SA
SA
SA

BD06
BD07
BD08
BD21
BD22

3301-001419
3301-001419
3301-001419
3301-001419
3301-001419

BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M

1
1
1
1
1

SA
SA
SA
SA
SA

BD23
BD24
C216
C220
C222

3301-001419
3301-001419
2203-005148
2203-005171
2203-000062

BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;1000nF,10%,16V,X7R,2012
C-CER,CHIP;47nF,+80-20%,50V,Y5V,16

1
1
1
1
1

SA
SA
SA
SA
SA

C4M17A
C4M18A
C4M19A
C603
C616

2203-000323
2203-000357
2203-000681
2203-005065
2203-005148

C-CER,CHIP;12nF,10%,50V,X7R,TP,201
C-CER,CHIP;0.15nF,5%,50V,C0G,1608
C-CER,CHIP;0.027nF,5%,50V,C0G,1608
C-CER,CHIP;1000nF,+80-20%,10V,Y5V,
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C617
C618
C619
C620
C621

2401-003107
2203-000426
2203-000426
2203-000626
2203-000626

C-AL;47uF,20%,16V,GP,TP,5x7,5
C-CER,CHIP;0.018nF,5%,50V,C0G,1608
C-CER,CHIP;0.018nF,5%,50V,C0G,1608
C-CER,CHIP;0.022nF,5%,50V,C0G,1608
C-CER,CHIP;0.022nF,5%,50V,C0G,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C622
C623
C626
C627
C628

2203-005065
2203-000236
2203-005148
2203-001697
2401-002069

C-CER,CHIP;1000nF,+80-20%,10V,Y5V,
C-CER,CHIP;0.1nF,5%,50V,C0G,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;0.082nF,5%,50V,NP0,1608
C-AL;33uF,20%,16V,GP,TP,6.3x5,5

1
1
1
1
1

SA
SA
SA
SA
SA

C629
C630
C631
C635
C636

2203-005221
2401-003107
2203-000257
2203-000257
2203-005148

C-CER,CHIP;15nF,10%,50V,X7R,1608
C-AL;47uF,20%,16V,GP,TP,5x7,5
C-CER,CHIP;10nF,10%,50V,X7R,1608
C-CER,CHIP;10nF,10%,50V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

This Document can not be used without Samsung’s authorization

Samsung Electronics

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

C637
C647
C651
C652
C658

2401-003107
2203-000681
2202-000216
2203-000681
2203-001683

C-AL;47uF,20%,16V,GP,TP,5x7,5
C-CER,CHIP;0.027nF,5%,50V,C0G,1608
C-CERAMIC,MLC-AXIAL;0.027NF,5%,50V
C-CER,CHIP;0.027nF,5%,50V,C0G,1608
C-CER,CHIP;0.068nF,5%,50V,NP0,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C701
C702
C703
C704
C707

2401-000118
2203-000257
2203-000257
2401-000240
2203-000257

C-AL;1000uF,20%,10V,GP,TP,10x12.5,
C-CER,CHIP;10nF,10%,50V,X7R,1608
C-CER,CHIP;10nF,10%,50V,X7R,1608
C-AL;100uF,20%,10V,GP,TP,5x11,5
C-CER,CHIP;10nF,10%,50V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

C708
CN3
CN4
CVL1
CVL2

2401-000118
3711-005563
3711-005563
3301-001419
3301-001419

C-AL;1000uF,20%,10V,GP,TP,10x12.5,
HEADER-BOARD TO BOARD;BOX,30P,2R,2
HEADER-BOARD TO BOARD;BOX,30P,2R,2
BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M

1
1
1
1
1

SA
SA
SA
SA
SA

CVL3
D702
D703
D704
D705

3301-001419
0401-000005
0401-000005
0401-000005
0401-000005

BEAD-SMD;220ohm,1608,TP,133ohm/70M
DIODE-SWITCHING;1N4148,75V,150mA,D
DIODE-SWITCHING;1N4148,75V,150mA,D
DIODE-SWITCHING;1N4148,75V,150mA,D
DIODE-SWITCHING;1N4148,75V,150mA,D

1
1
1
1
1

SA
SA
SA
SA
SA

D719
D720
DAR01
DOC3
DOC4

0402-001533
0402-000165
2007-000070
2203-005148
2203-005148

DIODE-RECTIFIER;1N5408,1000V,3A,-,
DIODE-RECTIFIER;1N5819,40V,1A,DO-4
R-CHIP;0ohm,5%,1/10W,TP,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

DOC5
DOE1
DOL2
DOL3
DOR1

2203-000998
2401-001915
3301-001419
2701-000114
2007-000040

C-CER,CHIP;0.047nF,5%,50V,C0G,1608
C-AL;1uF,20%,50V,GP,TP,3x5,5
BEAD-SMD;220ohm,1608,TP,133ohm/70M
INDUCTOR-AXIAL;10UH,10%,2534
R-CHIP;150ohm,1%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

DOR2
DOR3
DT701
E201
E202

2007-000074
2007-000075
AK07-00034A
2401-001915
2401-001915

R-CHIP;100ohm,5%,1/10W,TP,1608
R-CHIP;220ohm,5%,1/10W,TP,1608
LED DISPLAY-OVAL TYPE;BCD-9032B,DV
C-AL;1uF,20%,50V,GP,TP,3x5,5
C-AL;1uF,20%,50V,GP,TP,3x5,5

1
1
1
1
1

SA
SA
SA
SA
SA

E205
E212
E213
FC10
FC12

2401-001915
2401-003107
2401-003107
2203-000257
2203-005148

C-AL;1uF,20%,50V,GP,TP,3x5,5
C-AL;47uF,20%,16V,GP,TP,5x7,5
C-AL;47uF,20%,16V,GP,TP,5x7,5
C-CER,CHIP;10nF,10%,50V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

FC1S01
FC1S02
FCON1
FCON3
FD2

3602-000103
3602-000103
3708-001802
3708-001695
0402-000165

FUSE-CLIP;-,-,10mohm
FUSE-CLIP;-,-,10mohm
CONNECTOR-FPC/FFC/PIC;10P,1.25MM,S
CONNECTOR-FPC/FFC/PIC;13P,1MM,STRA
DIODE-RECTIFIER;1N5819,40V,1A,DO-4

1
1
1
1
1

SNA
SNA
SA
SA
SA

FD3
FD4
FD7
FDJ1
FDJ2

0402-000165
0401-000005
0402-000165
0402-000165
0402-000165

DIODE-RECTIFIER;1N5819,40V,1A,DO-4
DIODE-SWITCHING;1N4148,75V,150mA,D
DIODE-RECTIFIER;1N5819,40V,1A,DO-4
DIODE-RECTIFIER;1N5819,40V,1A,DO-4
DIODE-RECTIFIER;1N5819,40V,1A,DO-4

1
1
1
1
1

SA
SA
SA
SA
SA

FE4
FIC5
FL1
FL2
FL3

2401-002165
AC14-12006C
2701-000114
2701-000181
2701-000181

C-AL;100uF,20%,16V,GP,TP,6.3x7,5
IC;KA7533,DIP,INDUCTOR-AXIAL;10UH,10%,2534
INDUCTOR-AXIAL;33uH,5%,2434
INDUCTOR-AXIAL;33uH,5%,2434

1
1
1
1
1

SA
SA
SA
SA
SA

Samsung Electronics

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

FL4
FR24
FR25
IC203
IC601

2701-000114
2007-000100
2007-000503
0801-001270
AK09-00106A

INDUCTOR-AXIAL;10UH,10%,2534
R-CHIP;68Kohm,5%,1/10W,TP,1608
R-CHIP;2.2ohm,5%,1/10W,TP,1608
IC-CMOS LOGIC;4052,MUX/DEMUX,SOP,1
IC MICOM;MN101D10G-CB2,DVD-R130/XA

1
1
1
1
1

SA
SA
SA
SA
SA

IC603
IC604
IC701
IC702
JP34

1103-001134
1204-002509
1003-001561
1001-001056
2007-000070

IC-EEPROM;24C040,512x8,SOP,8P,5.13
IC-SIGNAL PROCESSOR;CXA2207N,SSOP,
IC-LED DRIVER;PT6961,SOP,32P,300MI
IC-VIDEO SWITCH;MM1113XF,-,SOP,8P,
R-CHIP;0ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

JPS07
KRMC1
L701
ME01
PACT1

2701-000002
0609-001225
2701-000002
2401-003499
2301-001792

INDUCTOR-AXIAL;100UH,10%,4298
MODULE REMOCON;VERTICAL,3.6mm,TR
INDUCTOR-AXIAL;100UH,10%,4298
C-AL;330uF,20%,16V,LZ,TP,8x11.5mm,
C-FILM,LEAD;150nF,20%,275V,BK,17.5

1
1
1
1
1

SA
SA
SA
SA
SA

PACT2
PADT1
PADT2
PADT3
PADT4

2301-001792
0402-001111
0402-001111
0402-001111
0402-001111

C-FILM,LEAD;150nF,20%,275V,BK,17.5
DIODE-RECTIFIER;1N5397GP,600V,1.5A
DIODE-RECTIFIER;1N5397GP,600V,1.5A
DIODE-RECTIFIER;1N5397GP,600V,1.5A
DIODE-RECTIFIER;1N5397GP,600V,1.5A

1
1
1
1
1

SA
SA
SA
SA
SA

PAFT1
PALT2
PART1
PAVV1
PAVV2

3601-000244
AC29-00002A
2002-000121
1405-000186
1405-001026

FUSE-CARTRIDGE;250V,2A,SLOW-BLOW,G
FILTER LINE NOISE;-,30mH,-,-,BLF-2
R-COMPOSITION;1Mohm,10%,1/2W,AA,TP
VARISTOR;470V,2500A,17.5x7.5mm,TP
VARISTOR;470V,600A,9x7mm,TP

1
1
1
1
1

SC
SA
SA
SA
SA

PAWT1
PBCU1
PBCU2
PBCU3
PBCU4

3711-000203
2201-002044
2201-002044
2201-000828
2201-000828

HEADER-BOARD TO CABLE;1WALL,2P/3P,
C-CERAMIC,DISC;0.1NF,10%,400V,Y5P,
C-CERAMIC,DISC;0.1NF,10%,400V,Y5P,
C-CERAMIC,DISC;3.3NF,20%,400V,Y5U,
C-CERAMIC,DISC;3.3NF,20%,400V,Y5U,

1
1
1
1
1

SA
SA
SA
SA
SA

PBIZ1
PDCZ1
PFCF1
PFCZ1
PFID1

0604-001028
2301-001654
2301-000129
2307-000104
AC14-12006D

PHOTO-COUPLER;TR,50-600%,250mW,DIP
C-FILM,LEAD-PEF;1000nF,5%,100V,TP,
C-FILM,LEAD-PEF;100nF,5%,50V,TP,10
C-FILM,LEAD-PCF;10nF,5%,50V,TP,-,5
IC;KA431Z,TO-92,TAPING

1
1
1
1
1

SA
SA
SA
SA
SA

PFRF1
PFRF2
PFRF3
PFRF4
PFRF5

2001-000780
2001-000221
2001-000429
2001-000674
2004-000459

R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X
R-CARBON;1.2KOHM,5%,1/8W,AA,TP,1.8
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3
R-CARBON;360OHM,5%,1/8W,AA,TP,1.8X
R-METAL;2.2Kohm,1%,1/8W,AA,TP,1.8x

1
1
1
1
1

SA
SA
SA
SA
SA

PFRF6
PFRZ1
PLCZ1
PLRU1
PLRZ1

2004-000459
2001-000429
2301-000129
1404-001361
2003-000105

R-METAL;2.2Kohm,1%,1/8W,AA,TP,1.8x
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3
C-FILM,LEAD-PEF;100nF,5%,50V,TP,10
THERMISTOR-NTC;3ohm,4A,-,35mW/C,0u
R-METAL OXIDE;0.33ohm,5%,2W,AD,TP,

1
1
1
1
1

SA
SA
SA
SA
SA

PPCD1
PPCD2
PPCF1
PPCF2
PPCF3

2401-003480
2401-001479
2401-003480
2401-003480
2401-001479

C-AL;1000UF,20%,10V,LZ,TP,10X16MM,
C-AL;470uF,20%,10V,GP,TP,6.3*11mm,
C-AL;1000UF,20%,10V,LZ,TP,10X16MM,
C-AL;1000UF,20%,10V,LZ,TP,10X16MM,
C-AL;470uF,20%,10V,GP,TP,6.3*11mm,

1
1
1
1
1

SA
SA
SA
SA
SA

PPCF4
PPCF5
PPCF6
PPCF7
PPCF8

2401-001250
2401-001250
2401-001479
2401-001479
2401-002165

C-AL;4.7uF,20%,35V,GP,TP,4x5,5
C-AL;4.7uF,20%,35V,GP,TP,4x5,5
C-AL;470uF,20%,10V,GP,TP,6.3*11mm,
C-AL;470uF,20%,10V,GP,TP,6.3*11mm,
C-AL;100uF,20%,16V,GP,TP,6.3x7,5

1
1
1
1
1

SA
SA
SA
SA
SA

This Document can not be used without Samsung’s authorization

7-5

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

PPCF9
PPCI1
PPCI2
PPCI3
PPCO1

2401-001502
2401-001126
2401-001126
2401-003499
2401-000385

C-AL;47uF,20%,16V,GP,TP,6.3x5,2.5
C-AL;330uF,20%,25V,WT,TP,10x12.5,5
C-AL;330uF,20%,25V,WT,TP,10x12.5,5
C-AL;330uF,20%,16V,LZ,TP,8x11.5mm,
C-AL;10uF,20%,100V,GP,TP,6.3x11,5

1
1
1
1
1

SA
SA
SA
SA
SC

R622
R623
R624
R633
R638

2001-000780
2007-000084
2007-000084
2007-000106
2007-000082

R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X
R-CHIP;4.7Kohm,5%,1/10W,TP,1608
R-CHIP;4.7Kohm,5%,1/10W,TP,1608
R-CHIP;220Kohm,5%,1/10W,TP,1608
R-CHIP;3.3Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

PPCO2
PPDD1
PPDD2
PPDF10
PPDF2

2401-002300
0404-001235
0401-000005
0404-001235
0404-001235

C-AL;47uF,20%,50V,GP,TP,6.3x11,5
DIODE-SCHOTTKY;SHK65-45R,60V,3000m
DIODE-SWITCHING;1N4148,75V,150mA,D
DIODE-SCHOTTKY;SHK65-45R,60V,3000m
DIODE-SCHOTTKY;SHK65-45R,60V,3000m

1
1
1
1
1

SA
SA
SA
SA
SA

R639
R652
R653
R656
R666

2007-000081
2007-000090
2007-000078
2007-000090
2001-000281

R-CHIP;2.7Kohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X

1
1
1
1
1

SA
SA
SA
SA
SA

PPDF3
PPDI1
PPDO1
PPID1
PPIF1

0402-001533
0402-001624
0402-000012
1203-003216
1203-001589

DIODE-RECTIFIER;1N5408,1000V,3A,-,
DIODE-RECTIFIER;SF26,400V,2A,DO-15
DIODE-RECTIFIER;UF4007,1KV,1A,DO-4
IC-POSI.FIXED REG.;G9133,TO-220F,4
IC-POSI.FIXED REG.;278R05,TO-220F,

1
1
1
1
1

SA
SA
SA
SA
SA

R667
R668
R670
R673
R674

2001-000281
2001-000429
2007-000074
2007-000078
2007-000078

R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3
R-CHIP;100ohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

PPIF2
PPII1
PPLD1
PPLF1
PPLI1

1203-001589
1203-002183
AC27-12001N
AH27-00039A
AC27-12001N

IC-POSI.FIXED REG.;278R05,TO-220F,
IC-SWITCH VOL. REG.;278R12,TO-220F
COIL CHOKE;10UH-15%,RA,K-30,Q80,15
COIL CHOKE;DR CHOKE(8*6),DVD-R2000
COIL CHOKE;10UH-15%,RA,K-30,Q80,15

1
1
1
1
1

SA
SA
SA
SA
SA

R676
R677
R678
R680
R6A01

2007-000078
2001-000429
2001-000281
2001-000472
2007-000090

R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X
R-CARBON;2.7KOHM,5%,1/8W,AA,TP,1.8
R-CHIP;10Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

PPRD1
PPRF2
PPRF3
PPRF4
PPRF5

2003-000148
2001-000429
2007-000078
2007-000078
2001-000281

R-METAL OXIDE;100ohm,5%,2W,AE,TP,6
R-CARBON;1KOHM,5%,1/8W,AA,TP,1.8X3
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X

1
1
1
1
1

SC
SA
SA
SA
SA

R6A02
R6A04
R6A05
R6A10
R701

2007-000090
2007-000078
2007-000078
2001-000273
2001-000837

R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CARBON;100KOHM,5%,1/8W,AA,TP,1.8
R-CARBON;51KOHM,5%,1/8W,AA,TP,1.8X

1
1
1
1
1

SA
SA
SA
SA
SA

PPRF6
PPRI1
PPRO1
PPZO1
PQIZ1

2007-000078
2001-000281
2001-000062
0403-000390
1203-003883

R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X
R-CARBON;470OHM,5%,1/4W,AA,TP,2.4X
DIODE-ZENER;UZP33B,31.4-34.6V,1000
IC-PWM CONTROLLER;3B2065P-2,TO-220

1
1
1
1
1

SA
SA
SA
SA
SA

R702
R703
R704
R711
R7K1

2007-000078
2007-000078
2007-000078
2007-000090
2007-000092

R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;15Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

PQIZ1A
PQTZ1
PRCU1
PSCX1
PSCZ2

AH62-30122A
AC26-00014K
2401-003024
2305-001029
2201-000129

HEAT SINK-POWER;1,AL,VO,T1.3,ANODI
TRANS SWITCHING-RAM RECORDER;EER35
C-AL;220uF,20%,200V,WT,BK,22x35,10
C-FILM,LEAD-PEF;10nF,10%,630V,TP,1
C-CERAMIC,DISC;0.1nF,10%,1000V,Y5P

1
1
1
1
1

SNA
SA
SA
SA
SA

R7K2
R7K3
RA606
SVL2
SVLA

2007-000092
2007-000092
2001-000281
3301-001419
3301-001419

R-CHIP;15Kohm,5%,1/10W,TP,1608
R-CHIP;15Kohm,5%,1/10W,TP,1608
R-CARBON;100OHM,5%,1/8W,AA,TP,1.8X
BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M

1
1
1
1
1

SA
SA
SA
SA
SA

PSDZ1
PSRZ1
PSRZ2
PVCL1
PVDL1

0402-000012
2006-000273
2006-000273
2401-002608
0402-001195

DIODE-RECTIFIER;UF4007,1KV,1A,DO-4
R-CEMENT;27KOHM,5%,2W,CA,BK,6.4X6.
R-CEMENT;27KOHM,5%,2W,CA,BK,6.4X6.
C-AL;33uF,20%,35V,GP,TP,5x11,5
DIODE-RECTIFIER;F1T4,400V,1A,DO-20

1
1
1
1
1

SA
SA
SA
SA
SA

SW701
SW702
TC1
TC10
TC11

3404-001261
3404-001261
2401-004014
2401-001915
2401-004014

SWITCH-TACT;15V DC,20mA,100gf,7.4X
SWITCH-TACT;15V DC,20mA,100gf,7.4X
C-AL;4.7•ÏF,20%,16V,NP,TP,4x5,2.5m
C-AL;1uF,20%,50V,GP,TP,3x5,5
C-AL;4.7•ÏF,20%,16V,NP,TP,4x5,2.5m

1
1
1
1
1

SA
SA
SA
SA
SA

PVRL4
PVZL1
PWR09
PWR10
PZWZ1

2001-000793
0403-000713
2007-000119
2007-000078
3711-004379

R-CARBON;47OHM,5%,1/8W,AA,TP,1.8X3
DIODE-ZENER;MTZJ20B,18.63-17.7V,50
R-CHIP;560ohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
HEADER-BOARD TO CABLE;BOX,4P,1R,2m

1
1
1
1
1

SA
SA
SA
SA
SA

TC12
TC13
TC14
TC15
TC16

2202-000253
2401-000414
2401-002165
2401-001250
2401-001250

C-CERAMIC,MLC-AXIAL;4.7nF,20%,16V,
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;100uF,20%,16V,GP,TP,6.3x7,5
C-AL;4.7uF,20%,35V,GP,TP,4x5,5
C-AL;4.7uF,20%,35V,GP,TP,4x5,5

1
1
1
1
1

SA
SA
SA
SA
SA

Q4M01
Q4M02
R4M06
R4M07
R4M08

0501-000398
0501-000398
2007-000090
2007-000084
2007-000124

TR-SMALL SIGNAL;KSC945-Y,NPN,250mW
TR-SMALL SIGNAL;KSC945-Y,NPN,250mW
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;4.7Kohm,5%,1/10W,TP,1608
R-CHIP;2.2Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

TC17
TC19
TC2
TC20
TC21

2203-001652
2203-001662
2203-000531
2203-005148
2203-000257

C-CER,CHIP;470nF,+80-20%,16V,Y5V,1
C-CER,CHIP;5.6nF,10%,50V,X7R,1608
C-CER,CHIP;2.7nF,10%,50V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;10nF,10%,50V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R4M09
R4M10
R4M20
R611
R621

2007-000084
2007-000965
2007-000070
2007-000074
2001-000780

R-CHIP;4.7Kohm,5%,1/10W,TP,1608
R-CHIP;5.1Kohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;100ohm,5%,1/10W,TP,1608
R-CARBON;470OHM,5%,1/8W,AA,TP,1.8X

1
1
1
1
1

SA
SA
SA
SA
SA

TC22
TC3
TC4
TC5
TC6

2203-005148
2203-000972
2401-001250
2401-001020
2401-004014

C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;47nF,10%,16V,X7R,1608
C-AL;4.7uF,20%,35V,GP,TP,4x5,5
C-AL;3.3UF,20%,50V,GP,TP,4X7,5
C-AL;4.7•ÏF,20%,16V,NP,TP,4x5,2.5m

1
1
1
1
1

SA
SA
SA
SA
SA

7-6

This Document can not be used without Samsung’s authorization

Samsung Electronics

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

TC7
TC74
TC8
TC9
TE12

2401-000414
2203-005148
2401-000414
2401-000414
2401-001250

C-AL;10uF,20%,16V,GP,TP,4x7,5
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;4.7uF,20%,35V,GP,TP,4x5,5

1
1
1
1
1

SA
SA
SA
SA
SA

TE5
TE8
TM1
TR1
TR10

2401-003107
2401-002165
AK40-00019A
2007-000082
2007-000121

C-AL;47uF,20%,16V,GP,TP,5x7,5
C-AL;100uF,20%,16V,GP,TP,6.3x7,5
TM BLOCK;VRA05ASE,NTSC,181CH,-,25d
R-CHIP;3.3Kohm,5%,1/10W,TP,1608
R-CHIP;820ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

TR2
TR3
TR4
TR5
TR6

2007-000842
2007-000125
2007-001125
2007-000109
2007-000102

R-CHIP;3Kohm,1%,1/10W,TP,1608
R-CHIP;3.9Kohm,5%,1/10W,TP,1608
R-CHIP;68Kohm,1%,1/10W,TP,1608
R-CHIP;1Mohm,5%,1/10W,TP,1608
R-CHIP;100Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

TR7
TR8
TR9
VC17
VC6

2007-000075
2007-000075
2007-000121
2203-005148
2203-005148

R-CHIP;220ohm,5%,1/10W,TP,1608
R-CHIP;220ohm,5%,1/10W,TP,1608
R-CHIP;820ohm,5%,1/10W,TP,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608
C-CER,CHIP;100nF,10%,16V,X7R,1608

1
1
1
1
1

SA
SA
SA
SA
SA

VC7
VC8
VC9
VDR1
VDR2

2202-000797
2202-002037
2202-002037
2007-001164
2007-001164

C-CERAMIC,MLC-AXIAL;10NF,30%,16V,Y
C-CERAMIC,MLC-AXIAL;100nF,80-20%,5
C-CERAMIC,MLC-AXIAL;100nF,80-20%,5
R-CHIP;75ohm,1%,1/10W,TP,1608
R-CHIP;75ohm,1%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

VDR4
VDR5
VDR6
VE1
VE10

2007-001164
2007-001164
2007-001164
2401-002165
2401-001479

R-CHIP;75ohm,1%,1/10W,TP,1608
R-CHIP;75ohm,1%,1/10W,TP,1608
R-CHIP;75ohm,1%,1/10W,TP,1608
C-AL;100uF,20%,16V,GP,TP,6.3x7,5
C-AL;470uF,20%,10V,GP,TP,6.3*11mm,

1
1
1
1
1

SA
SA
SA
SA
SA

VE2
VE4
VE5
VE6
VE7

2401-000922
2401-001479
2401-001479
2401-001479
2401-001479

C-AL;22uF,20%,16V,GP,TP,5x5,5
C-AL;470uF,20%,10V,GP,TP,6.3*11mm,
C-AL;470uF,20%,10V,GP,TP,6.3*11mm,
C-AL;470uF,20%,10V,GP,TP,6.3*11mm,
C-AL;470uF,20%,10V,GP,TP,6.3*11mm,

1
1
1
1
1

SA
SA
SA
SA
SA

VE8
VE9
VIC1
VL1
VL11

2401-001915
2401-001915
1201-002335
3301-001419
2701-000181

C-AL;1uF,20%,50V,GP,TP,3x5,5
C-AL;1uF,20%,50V,GP,TP,3x5,5
IC-VIDEO AMP;MM1692XVBE,TSOP,16P,5
BEAD-SMD;220ohm,1608,TP,133ohm/70M
INDUCTOR-AXIAL;33uH,5%,2434

1
1
1
1
1

SA
SA
SA
SA
SA

VL12
VL6
VR30
VR31
VR32

2701-000181
2703-000398
2007-001167
2007-001167
2007-001167

INDUCTOR-AXIAL;33uH,5%,2434
INDUCTOR-SMD;10uH,10%,3225
R-CHIP;75ohm,5%,1/10W,TP,1608
R-CHIP;75ohm,5%,1/10W,TP,1608
R-CHIP;75ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

VR33
VR34
VR35
VR36
VR60

2007-001167
2007-001167
2007-001167
2007-001167
2007-001167

R-CHIP;75ohm,5%,1/10W,TP,1608
R-CHIP;75ohm,5%,1/10W,TP,1608
R-CHIP;75ohm,5%,1/10W,TP,1608
R-CHIP;75ohm,5%,1/10W,TP,1608
R-CHIP;75ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

VZ1
VZ10
VZ11
VZ12
VZ2

0403-001083
0403-001083
0403-001083
0403-001083
0403-001083

DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200

1
1
1
1
1

SA
SA
SA
SA
SA

Samsung Electronics

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

VZ3
VZ4
VZ5
VZ6
VZ7

0403-001083
0403-001083
0403-001083
0403-001083
0403-001083

DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200

1
1
1
1
1

SA
SA
SA
SA
SA

VZ8
VZ9
W004
W623
W793

0403-001083
0403-001083
6003-000283
2007-000033
2007-000033

DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
DIODE-ZENER;UDZ9.1B,8.85-9.23V,200
SCREW-TAPTITE;BH,+,B,M3,L8,ZPC(YEL
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216

1
1
1
1
1

SA
SA
SA
SA
SA

W807
W823
W846
W868
W881

2007-000033
2007-000033
2007-000033
2007-000033
2007-000070

R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

W882
W885
W889
W890
W893

2007-000070
2007-000033
2007-000033
2007-000033
2007-000070

R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

W894
W920
W922
W923
W927

2007-000070
2007-000033
2007-000033
2007-000033
2007-000033

R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216

1
1
1
1
1

SA
SA
SA
SA
SA

XT4M01
XT601
XT602

2801-003399
2801-001384
2801-003318

CRYSTAL-UNIT;3.579545MHz,15ppm,28CRYSTAL-UNIT;14.31818MHz,30ppm,28CRYSTAL-UNIT;32.768KHz,20ppm,28-AA

1
1
1

SA
SC
SA

H001
C012
C771
CIC1
CN1

AK97-01553A
AK61-00475A
AK61-00390A
1203-003177
3708-002193

ASSY-LOADER;-,SV-R3600,LOADER ASSY
SPRING ETC;SOH-DDR,SUS,-,-,-,L6.8,
HOLDER-WIRE;SOH-DR2,PPS,T5.2,W14.1
IC-VOL. DETECTOR;BD5326G,SSOP,5P,2
CONNECTOR-FPC/FFC/PIC;50P,0.5mm,SM

1
1
1
1
1

SA
SNA
SNA
SA
SA

DECK_C
H001
H103
H104
H105

3708-002176
AK97-01324A
AK66-00042A
AK97-00608A
6602-001076

CONNECTOR-FPC/FFC/PIC;5P,1mm,SMD-A
ASSY-RECORDER DECK;-,DP-RW2,GEAR-PULLEY;DP-15,POM,-,-,-,WHT,-,
ASSY-MOTOR LOAD;-,DP-15,BELT-RECTANGULAR;CR,T1.2,4.3%,1.2X

1
1
1
1
1

SA
SNA
SA
SA
SA

H106
H107
H108
H202
H207

AK66-00041A
AK66-00071A
AK63-00276A
AK73-00038A
AK31-00028A

GEAR-TRAY;DP-15,POM,-,-,-,WHT,-,-,
SLIDER-HOUSING;DP-RW2,POM,T17,W17.
TRAY-DISC;DP-RW2,ABS,T1.5,W124,L18
RUBBER-INSULATOR;DP-R3L,Butyl,8.9*
MOTOR SPINDLE;DP-R3L,8500,9.8mN.m,

1
1
1
4
1

SA
SNA
SNA
SNA
SNA

H209
H211
H212
H213
H241

AK64-01335A
AK97-01360A
AK61-00484A
AK97-01330A
AK41-00399A

CHASSIS-SUB;DP-RW2,ABS,T1.5,W60.9,
ASSY-PICK UP;ZN,SOH-DR3,HOLDER-CHUCK;DP-RW2,ABS,T3,W141,L9
ASSY-PCB MOTOR;ASSY,DP-RW2,ASSY
FFC-PU;DP-RW2,PITCH : 0.5,UL2896,5

1
1
1
1
1

SNA
SNA
SNA
SNA
SNA

H265
H268
H271
H275
H401

AK61-00489A
AK61-00452A
AK61-00491A
AK66-00072A
AK61-00485B

BRACKET-SHAFT PU;DP-RW2,SUS-301CSP
SPRING ETC-HINGE PU;DP-R2,SUS304WP
HINGE-PU;DP-RW2,POM KEPITAL TX-31,
SHAFT-PU;DP-RW2,SUS420J2,91.5,3,NA
FRAME-MAIN;DP-R3,ABS,ABS,-,BLK,-,W

2
1
1
2
1

SNA
SNA
SNA
SNA
SNA

This Document can not be used without Samsung’s authorization

7-7

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

JP9
PC1
PC10
PC12
PC14

3708-001331
2203-006048
2402-000179
2203-006048
2203-006048

CONNECTOR-FPC/FFC/PIC;40P,0.5mm,SM
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-AL,SMD;47uF,20%,16V,GP,TP,6.6x6.
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RC46
RC47
RC48
RC49
RC50

2203-000438
2203-000627
2203-000438
2203-000438
2203-000254

C-CER,CHIP;1nF,10%,50V,X7R,1005
C-CER,CHIP;0.022nF,5%,50V,C0G,1005
C-CER,CHIP;1nF,10%,50V,X7R,1005
C-CER,CHIP;1nF,10%,50V,X7R,1005
C-CER,CHIP;10nF,10%,16V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

PC15
PC2
PC3
PC4
PC5

2404-001131
2203-006214
2402-001042
2203-005061
2402-001042

C-TA,CHIP;22UF,10%,10V,GP,TP,3528
C-CER,CHIP;2200nF,10%,25V,X7R,3216
C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6
C-CER,CHIP;100nF,+80-20%,16V,Y5V,1
C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6

1
1
1
1
1

SA
SA
SA
SA
SA

RC51
RC52
RC53
RC54
RC55

2203-000254
2203-000254
2203-000233
2203-006048
2404-000284

C-CER,CHIP;10nF,10%,16V,X7R,1005
C-CER,CHIP;10nF,10%,16V,X7R,1005
C-CER,CHIP;0.1nF,5%,50V,C0G,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-TA,CHIP;10uF,20%,16V,-,TP,3528

1
1
1
1
1

SA
SA
SA
SA
SA

PC6
PC7
PC8
PC9
PCN

2203-006048
2203-005171
2203-005171
2402-000179
3711-005477

C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;1000nF,10%,16V,X7R,2012
C-CER,CHIP;1000nF,10%,16V,X7R,2012
C-AL,SMD;47uF,20%,16V,GP,TP,6.6x6.
HEADER-BOARD TO CABLE;BOX,4P,1R,2m

1
1
1
1
1

SA
SA
SA
SA
SA

RC56
RC57
RC58
RC59
RC6

2203-006048
2203-006048
2404-000284
2203-006048
2203-005496

C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-TA,CHIP;10uF,20%,16V,-,TP,3528
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;220nF,+80-20%,10V,Y5V,1

1
1
1
1
1

SA
SA
SA
SA
SA

PIC2
PIC3
PL1
PL3
PL4

1203-003997
1203-003999
2901-001281
2901-001281
2901-001281

IC-MULTI REG.;BA30E00WHFP,HRP,7P,9
IC-POSI.FIXED REG.;BH25FB1WHFV,HVS
FILTER-EMI SMD;16V,2A,-,220000pF,2
FILTER-EMI SMD;16V,2A,-,220000pF,2
FILTER-EMI SMD;16V,2A,-,220000pF,2

1
1
1
1
1

SA
SA
SA
SA
SA

RC60
RC61
RC62
RC63
RC64

2203-006048
2203-006048
2203-005642
2203-005642
2203-005642

C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;0.22nF,5%,50V,NP0,1005
C-CER,CHIP;0.22nF,5%,50V,NP0,1005
C-CER,CHIP;0.22nF,5%,50V,NP0,1005

1
1
1
1
1

SA
SA
SA
SA
SA

PL5
PR1
PR2
RC10
RC13

2901-001281
2007-000097
2007-000616
2203-006048
2203-006048

FILTER-EMI SMD;16V,2A,-,220000pF,2
R-CHIP;47Kohm,5%,1/10W,TP,1608
R-CHIP;24Kohm,5%,1/10W,TP,1608
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RC65
RC66
RC67
RC68
RC69

2203-005642
2203-000254
2203-000254
2203-000254
2203-000233

C-CER,CHIP;0.22nF,5%,50V,NP0,1005
C-CER,CHIP;10nF,10%,16V,X7R,1005
C-CER,CHIP;10nF,10%,16V,X7R,1005
C-CER,CHIP;10nF,10%,16V,X7R,1005
C-CER,CHIP;0.1nF,5%,50V,C0G,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RC14
RC15
RC16
RC17
RC19

2203-006048
2203-006048
2203-006048
2203-006048
2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RC7
RC70
RC71
RC72
RC73

2203-005496
2203-001239
2203-001239
2203-000254
2203-006048

C-CER,CHIP;220nF,+80-20%,10V,Y5V,1
C-CER,CHIP;0.082nF,5%,50V,NP0,1005
C-CER,CHIP;0.082nF,5%,50V,NP0,1005
C-CER,CHIP;10nF,10%,16V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RC21
RC22
RC23
RC25
RC26

2203-006048
2404-001020
2203-006048
2404-001020
2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1005
C-TA,CHIP;10uF,20%,10V,GP,TP,3216
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-TA,CHIP;10uF,20%,10V,GP,TP,3216
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RC74
RIC2
RR10
RR11
RR13

2203-000489
AK13-00028A
2007-000151
2007-000143
2007-000171

C-CER,CHIP;2.2nF,10%,50V,X7R,1005
IC ASIC;S1L1101X01,-,128,5V,-0 ~ +
R-CHIP;15Kohm,5%,1/16W,TP,1005
R-CHIP;4.7Kohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SNA
SA
SA
SA

RC27
RC28
RC29
RC3
RC30

2404-001020
2203-000254
2203-000254
2203-006048
2203-000254

C-TA,CHIP;10uF,20%,10V,GP,TP,3216
C-CER,CHIP;10nF,10%,16V,X7R,1005
C-CER,CHIP;10nF,10%,16V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;10nF,10%,16V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RR16
RR17
RR18
RR21
RR22

2007-000159
2007-003009
2007-000157
2007-007107
2007-007107

R-CHIP;56Kohm,5%,1/16W,TP,1005
R-CHIP;16Kohm,5%,1/16W,TP,1005
R-CHIP;47Kohm,5%,1/16W,TP,1005
R-CHIP;100Kohm,1%,1/16W,TP,1005
R-CHIP;100Kohm,1%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RC31
RC32
RC33
RC34
RC35

2203-006048
2203-000233
2203-000254
2203-000254
2203-000254

C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;0.1nF,5%,50V,C0G,1005
C-CER,CHIP;10nF,10%,16V,X7R,1005
C-CER,CHIP;10nF,10%,16V,X7R,1005
C-CER,CHIP;10nF,10%,16V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RR24
RR25
RR26
RR27
RR28

2007-000145
2007-000154
2007-001320
2007-000148
2007-000148

R-CHIP;6.2Kohm,5%,1/16W,TP,1005
R-CHIP;24KOHM,5%,1/16W,TP,1005
R-CHIP;1.8Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RC36
RC37
RC38
RC39
RC40

2203-006048
2404-000284
2203-000254
2404-000284
2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1005
C-TA,CHIP;10uF,20%,16V,-,TP,3528
C-CER,CHIP;10nF,10%,16V,X7R,1005
C-TA,CHIP;10uF,20%,16V,-,TP,3528
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RR29
RR30
RR32
RR33
RR35

2007-000148
2007-000157
2007-000159
2007-000154
2007-000140

R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;47Kohm,5%,1/16W,TP,1005
R-CHIP;56Kohm,5%,1/16W,TP,1005
R-CHIP;24KOHM,5%,1/16W,TP,1005
R-CHIP;1Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RC41
RC42
RC43
RC44
RC45

2203-000254
2203-000254
2203-006048
2203-006048
2203-000438

C-CER,CHIP;10nF,10%,16V,X7R,1005
C-CER,CHIP;10nF,10%,16V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;1nF,10%,50V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RR37
RR40
RR41
RR43
RR44

2007-000170
2007-000171
2007-000171
2007-000171
2007-000151

R-CHIP;1Mohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;15Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

7-8

This Document can not be used without Samsung’s authorization

Samsung Electronics

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

RR45
RR46
S.N.A
S.N.A
S.N.A

2007-000151
2007-000171
AK66-00006A
AH31-00025A
0201-001006

R-CHIP;15Kohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
PULLEY MOTOR;DP-9,POM ,-,BLK,-,-,MOTOR-LOADING;RF-300EA-1D390,DP-7,
ADHESIVE-AA;#7452,TRP,-,-

1
1
1
1
0.02

SA
SA
SNA
SNA
SNA

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

0201-000169
0201-001411
0201-001525
0201-001819
0202-001214

ADHESIVE-CYA;ARCN-A501F,NTR
ADHESIVE-UV;8833,YEL,50000,250G/1B
ADHESIVE-UV;8840L,YEL,TRANS,23000,
ADHESIVE-UV;8833M,YELLOW,21000mPas
SOLDER-WIRE FLUX;HI-ALMIT HR19M LF

0.01
0.01
0.05
0.08
0.2

SNA
SNA
SNA
SNA
SNA

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

AK97-01362A
0201-001718
0201-001553
0202-001214
AK97-01358A

ASSY-SUB PICK UP;ZN,SOH-DR3,ADHESIVE-A.C.F;A-80T,SILVER,11000ADHESIVE-TP;G-800-A,GRY,220?40Pa.S
SOLDER-WIRE FLUX;HI-ALMIT HR19M LF
ASSY-FPCB;-,SOH-DR2.5,RAMBO2.5 FPC

1 SNA
0.003 SNA
0.013 SNA
0.5 SNA
1 SNA

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

0603-001181
0603-001187
1003-001854
2104-001087
AK32-00004A

PHOTO DIODE;5.5V,658.79nm,PHOTO-RECEIVER;6.0V,17.0mA,650nm,M
IC-DIODE DRIVER;EL6939CLZ,LPP,32P,
VR-SMD;2.2Kohm,25%,0.15W,TOP
SENSOR PHOTO;CNB1001,-25~85,-,-,20

1
1
1
2
1

SA
SNA
SA
SA
SNA

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

1404-001328
2007-000076
3708-002193
0201-000172
AK41-00422A

THERMISTOR-NTC;10Kohm,-,3370K,-,-,
R-CHIP;330ohm,5%,1/10W,TP,1608
CONNECTOR-FPC/FFC/PIC;50P,0.5mm,SM
ADHESIVE-AA;EP-171,BRN
FPC-FPCB-MAIN;SOH-DR2.5,00,POLYAMI

1
1
1
0.01
1

SNA
SA
SA
SNA
SNA

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

AK61-00548A
AK67-00053A
2011-001344
2203-000189
2203-000626

PLATE-PD;SOH-DR3.5,Zn,T1.3,-,L11.5
LENS-CDL;SOH-DR3,ZEONEX,CLEAR,4.2X
R-NET;100ohm,5%,1/16W,L,CHIP,8P,TP
C-CER,CHIP;100nF,+80-20%,25V,Y5V,1
C-CER,CHIP;0.022nF,5%,50V,C0G,1608

1
1
1
8
1

SNA
SNA
SA
SA
SA

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

2203-005664
3301-001419
2007-000070
2007-000078
2007-000309

C-CER,CHIP;4700nF,10%,6.3V,X5R,201
BEAD-SMD;220ohm,1608,TP,133ohm/70M
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;10ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

2007-000869
2007-000929
2011-001261
AK97-01361A
0201-001411

R-CHIP;4.7Kohm,1%,1/10W,TP,1608
R-CHIP;470ohm,1%,1/10W,TP,1608
R-NET;33ohm,5%,1/16W,L,CHIP,8P,TP,
ASSY-OPT;ZN,SOH-DR3,ADHESIVE-UV;8833,YEL,50000,250G/1B

1
1
1
1
0.04

SA
SA
SA
SNA
SNA

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

0201-001525
0201-001819
AH61-00812A
AK61-00470A
AK61-00472A

ADHESIVE-UV;8840L,YEL,TRANS,23000,
ADHESIVE-UV;8833M,YELLOW,21000mPas
SPRING ETC-L/G HOLDER;SOH-DH2,PBR,
HOLDER-LD CD;SOH-DDR,Zn,-,W6.8,L6.
HOLDER-LD DVD;SOH-DDR,Zn,T3.14,W7.

0.01
0.03
1
1
1

SNA
SNA
SNA
SNA
SNA

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

AK61-00473A
AK61-00546A
AK61-00547A
AK63-00264A
0602-001127

HOLDER-LG;SOH-DDR,Zn,T5.7,W7.2,L10
BASE-PU;SOH-DR3.5,ZnDC,T14.1,W36.3
HOLDER-DVD GT;SOH-DR3.5,Zn,-,T5,L3
COVER-BASE;SOH-DDR,CU,T0.3,W31.3,L
DIODE-LASER;160mW,2,658nm,CAN

1
1
1
1
1

SNA
SNA
SNA
SNA
SNA

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

0602-001128
AK67-00012A
AK67-00033A
AK67-00034A
AK67-00035A

DIODE-LASER;8.5mW,2,785nm,CAN
LENS-DR1 CL;SHO-DR1,PLASTIC,NTR,•’
LENS-PLATE;SOH-DR3,GLS,WHT,8.0*4.0
LENS-PBS;SOH-DR3,GLS,WHT,8.7*4.0,2
LENS-MR;SOH-DR3,GLS,WHT,5.0*4.0,2.

1
1
1
1
1

SNA
SNA
SNA
SNA
SNA

Samsung Electronics

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

AK67-00036A
AK67-00038A
AK67-00041A
AK67-00052A
0201-001709

LENS-DVD GT;SOH-DR3,GLS,WHT,2.5*3.
LENS-CBS;SOH-DR3,GLS,WHT,3.0*3.0,3
LENS-CD GT;SOH-DR2.5,GLS,WHT,2.0*1
LENS-ASL;DR3/BDP,APEL/Z340R,WHT,4P
ADHESIVE-UV;8839L,YEL,24500mPa.s,-

1
1
1
1
0.02

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

AK97-01377A
0201-001081
0201-001230
0201-001793
0202-001214

ASSY-ACT;-,SOH-DR3,ADHESIVE-AA;1401C,RED,-,BOND-LOCK
ADHESIVE-CYA;LOCTITE 480,BLK,300,ADHESIVE-UV;8791L3,WHITE,20000mPa.
SOLDER-WIRE FLUX;HI-ALMIT HR19M LF

1 SNA
0.006 SNA
0.002 SNA
0.004 SNA
0.085 SNA

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

3302-001651
3812-001263
3812-001419
AK62-00020A
AK97-01376A

MAGNET-RARE EARTH;AF,14000Gauss,47
WIRE-NO SHEATH CU;SCW,-,19MM,-,-,W
WIRE-NO SHEATH CU;SCW,0V,18.5mm,1/
YOKE-ACT;SOH-DR3,SPCC,T7.6,W24.8,L
ASSY-BLADE;-,SOH-DR3,-

2
5
1
1
1

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

0201-001371
0202-001215
AK61-00480A
AK67-00037A
AK67-00040A

ADHESIVE-SIL;KE3494,GRAY,50 PA,OL
SOLDER-BAR;HSE-16,S60S-20,D3,SN/0.
BLADE-ACT;SOH-DR3,E5006J\L,IVORY,1
LENS-QWP;SOH-DR3,GLS,WHT,4.5*4.5,1
LENS-OL;SOH-DR3,PLS,WHT,3.8,1.7,-,

0.001 SNA
0.01 SNA
1 SNA
1 SNA
1 SNA

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

0201-001421
0201-001709
AK61-00490A
AK31-00024A
AK61-00488A

ADHESIVE-UV;SDM-118,TRP,5500,250G/
ADHESIVE-UV;8839L,YEL,24500mPa.s,SPRING ETC-SHAFT PU;DP-RW2,PW2,0.8
MOTOR STEP-FEED;-,DP-RW,727 mA,200
BRACKET-DECK;DP-RW2,SECC US COATIN

0.04
0.01
2
1
1

SNA
SNA
SNA
SNA
SNA

SPIN_C
STEP_C
U8
U9
UB1

3708-002067
3708-002018
AK13-00025A
1107-001369
1105-001397

CONNECTOR-FPC/FFC/PIC;12P,1mm,SMDCONNECTOR-FPC/FFC/PIC;4P,1MM,SMD-A
IC ASIC;S5L1484A01,RAMBO-3,256,3.3
IC-FLASH MEMORY;29LV800,8Mbit,1Mx8
IC-DRAM;K4S641632,-,64Mbit,1Mx16x4

1
1
1
1
1

SA
SA
SNA
SNA
SA

UC19
UC21
UC22
UC23
UC24

2203-000386
2203-006048
2203-006048
2203-006048
2203-006048

C-CER,CHIP;0.015nF,5%,50V,C0G,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UC25
UC26
UC27
UC28
UC29

2203-006048
2203-006048
2203-006048
2404-001020
2404-001020

C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-TA,CHIP;10uF,20%,10V,GP,TP,3216
C-TA,CHIP;10uF,20%,10V,GP,TP,3216

1
1
1
1
1

SA
SA
SA
SA
SA

UC30
UC31
UC32
UC33
UC34

2404-001020
2203-006048
2203-006048
2203-006048
2203-006048

C-TA,CHIP;10uF,20%,10V,GP,TP,3216
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UC35
UC36
UC37
UC38
UC39

2203-006048
2203-006048
2203-006048
2203-006048
2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UC40
UC41
UC42
UC43
UC44

2203-006048
2203-006048
2203-006048
2203-006048
2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

This Document can not be used without Samsung’s authorization

SNA
SNA
SNA
SNA
SNA

SNA
SNA
SNA
SNA
SNA

7-9

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

UC45
UC46
UC47
UC48
UC49

2203-000438
2203-006048
2203-000254
2203-006048
2203-006048

C-CER,CHIP;1nF,10%,50V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;10nF,10%,16V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR42
UR43
UR44
UR47
UR48

2007-007001
2007-000148
2007-000171
2007-000148
2007-000148

R-CHIP;3.9KOHM,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UC50
UC51
UC52
UC53
UC54

2203-006048
2203-006048
2203-006048
2203-006048
2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR49
UR5
UR55
UR58
UR59

2007-000143
2011-001261
2007-000143
2007-000143
2007-000143

R-CHIP;4.7Kohm,5%,1/16W,TP,1005
R-NET;33ohm,5%,1/16W,L,CHIP,8P,TP,
R-CHIP;4.7Kohm,5%,1/16W,TP,1005
R-CHIP;4.7Kohm,5%,1/16W,TP,1005
R-CHIP;4.7Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UC55
UC56
UC57
UC62
UC63

2203-006048
2203-001071
2203-005438
2203-006048
2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;0.056nF,5%,50V,C0G,1608
C-CER,CHIP;0.15nF,10%,50V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR6
UR63
UR64
UR69
UR7

2007-000173
2007-000084
2007-000143
2007-000148
2007-001217

R-CHIP;22ohm,5%,1/16W,TP,1005
R-CHIP;4.7Kohm,5%,1/10W,TP,1608
R-CHIP;4.7Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;82OHM,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UC64
UC65
UC67
UC69
UC70

2203-006048
2203-006048
2203-006048
2404-001020
2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-TA,CHIP;10uF,20%,10V,GP,TP,3216
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR73
UR75
UR76
UR77
UR8

3301-001419
2007-000113
2007-000070
3301-001419
2007-001217

BEAD-SMD;220ohm,1608,TP,133ohm/70M
R-CHIP;33ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
BEAD-SMD;220ohm,1608,TP,133ohm/70M
R-CHIP;82OHM,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UC71
UC72
UC75
UC76
UC77

2404-001020
2203-006048
2404-001020
2203-006048
2203-006048

C-TA,CHIP;10uF,20%,10V,GP,TP,3216
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-TA,CHIP;10uF,20%,10V,GP,TP,3216
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR80
UR81
UR87
UR88
UR89

2007-000140
2007-000171
2007-000148
3301-001419
2007-000171

R-CHIP;1Kohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
BEAD-SMD;220ohm,1608,TP,133ohm/70M
R-CHIP;0ohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UC79
UC80
UC81
UR1
UR10

2203-006048
2203-000438
2203-006048
2011-001432
2007-001217

C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;1nF,10%,50V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005
R-NET;82ohm,5%,1/16W,L,CHIP,8P,TP,
R-CHIP;82OHM,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR9
UR90
UR91
UR92
UR93

2007-000173
2007-000831
2007-000171
2007-000171
2007-000171

R-CHIP;22ohm,5%,1/16W,TP,1005
R-CHIP;39Kohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR11
UR12
UR13
UR14
UR16

2007-000173
2007-000173
2007-001217
2007-001217
2007-000170

R-CHIP;22ohm,5%,1/16W,TP,1005
R-CHIP;22ohm,5%,1/16W,TP,1005
R-CHIP;82OHM,5%,1/16W,TP,1005
R-CHIP;82OHM,5%,1/16W,TP,1005
R-CHIP;1Mohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR97
UR98
VC1
VC10
VC11

2007-000171
2007-000148
2203-006047
2203-000438
2203-005061

R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
C-CER,CHIP;33nF,10%,16V,X7R,1005
C-CER,CHIP;1nF,10%,50V,X7R,1005
C-CER,CHIP;100nF,+80-20%,16V,Y5V,1

1
1
1
1
1

SA
SA
SA
SA
SA

UR17
UR2
UR20
UR21
UR22

2007-000143
2011-001261
2007-000148
2007-000148
2007-000148

R-CHIP;4.7Kohm,5%,1/16W,TP,1005
R-NET;33ohm,5%,1/16W,L,CHIP,8P,TP,
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

VC12
VC13
VC14
VC15
VC16

2203-005061
2404-000284
2203-006048
2203-000254
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y5V,1
C-TA,CHIP;10uF,20%,16V,-,TP,3528
C-CER,CHIP;100nF,10%,10V,X7R,1005
C-CER,CHIP;10nF,10%,16V,X7R,1005
C-CER,CHIP;100nF,+80-20%,16V,Y5V,1

1
1
1
1
1

SA
SA
SA
SA
SA

UR23
UR24
UR25
UR26
UR27

2007-000174
2007-000148
2007-001292
2007-001292
2007-000148

R-CHIP;47ohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;33ohm,5%,1/16W,TP,1005
R-CHIP;33ohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

VC17
VC18
VC19
VC2
VC20

2203-005061
2203-005061
2203-005061
2203-006047
2203-006048

C-CER,CHIP;100nF,+80-20%,16V,Y5V,1
C-CER,CHIP;100nF,+80-20%,16V,Y5V,1
C-CER,CHIP;100nF,+80-20%,16V,Y5V,1
C-CER,CHIP;33nF,10%,16V,X7R,1005
C-CER,CHIP;100nF,10%,10V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR28
UR29
UR3
UR32
UR36

2007-000148
2007-000148
2011-001261
2007-000171
2007-000171

R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-NET;33ohm,5%,1/16W,L,CHIP,8P,TP,
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

VC21
VC3
VC4
VC5
VC6

2404-001020
2203-006047
2203-006047
2203-006047
2203-006047

C-TA,CHIP;10uF,20%,10V,GP,TP,3216
C-CER,CHIP;33nF,10%,16V,X7R,1005
C-CER,CHIP;33nF,10%,16V,X7R,1005
C-CER,CHIP;33nF,10%,16V,X7R,1005
C-CER,CHIP;33nF,10%,16V,X7R,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR37
UR39
UR4
UR40
UR41

2007-001325
2007-000775
2011-001261
2007-000171
2007-000171

R-CHIP;3.3Kohm,5%,1/16W,TP,1005
R-CHIP;33KOHM,5%,1/16W,TP,1005
R-NET;33ohm,5%,1/16W,L,CHIP,8P,TP,
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

VIC1
VR1
VR10
VR11
VR12

1003-001881
2007-000138
2007-000138
2007-000034
2007-000034

IC-MOTOR DRIVER;BD7956FS,HSSOP,54P
R-CHIP;100ohm,5%,1/16W,TP,1005
R-CHIP;100ohm,5%,1/16W,TP,1005
R-CHIP;1OHM,5%,1/4W,TP,3216
R-CHIP;1OHM,5%,1/4W,TP,3216

1
1
1
1
1

SA
SA
SA
SA
SA

7-10

This Document can not be used without Samsung’s authorization

Samsung Electronics

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

VR13
VR14
VR16
VR18
VR20

2007-000034
2007-000034
2007-000034
2007-000034
2007-000148

R-CHIP;1OHM,5%,1/4W,TP,3216
R-CHIP;1OHM,5%,1/4W,TP,3216
R-CHIP;1OHM,5%,1/4W,TP,3216
R-CHIP;1OHM,5%,1/4W,TP,3216
R-CHIP;10Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

A001
CT01
CT02
LDT01
OP03

AK59-00055A
2401-002144
2203-000192
0601-000519
2007-000029

REMOCON-ASSY;DVD-R130/XAA,SEC,197.
C-AL;47uF,20%,16V,GP,TP,5x11,5
C-CER,CHIP;100nF,+80-20%,50V,Y5V,2
LED-IR;ROUND,5mm,170mW,4V,940nm,TP
R-CHIP;0ohm,5%,1/8W,TP,2012

1
1
1
1
1

SA
SA
SA
SA
SA

VR25
VR26
VR27
VR28
VR31

2007-007107
2007-000159
2007-000159
2007-000148
3301-001419

R-CHIP;100Kohm,1%,1/16W,TP,1005
R-CHIP;56Kohm,5%,1/16W,TP,1005
R-CHIP;56Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
BEAD-SMD;220ohm,1608,TP,133ohm/70M

1
1
1
1
1

SA
SA
SA
SA
SA

QT01
RT01
RT02
RT03

0501-000534
2007-000881
2007-000593
2007-000029

TR-SMALL SIGNAL;2SC2412K,NPN,200mW
R-CHIP;4.7ohm,5%,1/8W,TP,2012
R-CHIP;22ohm,5%,1/8W,TP,2012
R-CHIP;0ohm,5%,1/8W,TP,2012

1
1
1
1

SA
SA
SA
SA

VR32
VR33
VR34
VR35
VR36

3301-001419
3301-001419
3301-001419
3301-001419
3301-001419

BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M

1
1
1
1
1

SA
SA
SA
SA
SA

C001
C002
C011
C015
C657

AK97-01447L
AK64-01432A
AK61-00519A
AK64-01444B
AK64-01433G

ASSY-CABINET FRONT;HIPS 94 HB,DVDDOOR-TRAY;DVD-R130,ABS 94HB,T2,H15
SPRING ETC-DOOR;DVD-SR420,STS304WP
CABINET-TOP;SV-R3600,PCM,T0.6,W430
DOOR-JACK;DVD-R130/XSA,ABS 94HB,T2

1
1
1
1
1

SA
SA
SA
SA
SA

VR37
VR38
VR39
VR40
VR41

3301-001419
3301-001419
3301-001419
3301-001419
3301-001419

BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M

1
1
1
1
1

SA
SA
SA
SA
SA

FL614
P025
S.N.A
VS106
W001

3809-001780
AH39-10061A
AK69-00371Y
AK39-00086A
6003-000275

FFC CABLE-FLAT;30V,80C,105mm,40P,0
CBF-POWER CORD;KJ-10W,EP2,AWG2/18,
PACKING CASE;DVD-R129/XAA,SW-2, PA
LEAD CONNECTOR;SV-R3600,LEAD CONNE
SCREW-TAPTITE;BH,+,-,B,M3,L10,ZPC(

1
1
1.01
1
2

SA
SA
SA
SA
SA

VR42
VR43
VR5
VR6
VR8

3301-001419
3301-001419
2007-000148
2007-000148
2007-000148

BEAD-SMD;220ohm,1608,TP,133ohm/70M
BEAD-SMD;220ohm,1608,TP,133ohm/70M
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

W009
W200
W268
W272
W275

6003-000276
6003-001375
6003-000254
6003-001464
6003-001561

SCREW-TAPTITE;BH,+,-,B,M3,L10,ZPC(
SCREW-TAPTITE;BH,+,B,M3,L8,ZPC(YEL
SCREW-TAPTITE;BH,+,-,S,M3,L6,ZPC(W
SCREW-TAPTITE;BH,+,B,M3,L10,ZPC(WH
SCREW-TAPTITE;BH,+,-,B,M3,L6,ZPC(Y

4
2
1
5
5

SA
SA
SA
SA
SA

VR9
W012
W018
W274
W291

2007-000164
6002-001086
6003-001450
6001-001730
6001-001291

R-CHIP;150KOHM,5%,1/16W,TP,1005
SCREW-TAPPING;PH,+,B,M1.7,L5.0,ZPC
SCREW-TAPTITE;PH,+,S,M2.6,L5,ZPC(Y
SCREW-MACHINE;BH,+,-,M1.7,L2.5,ZPC
SCREW-MACHINE;CH(0.5),*,-,M1.7,L4,

1
1
2
2
3

SA
SA
SA
SA
SA

AC39-00073A
AC39-42001J
AK68-01174A

CABLE-RCA;SJ01-08-099,1.2MT,3P,A/V
CABLE-RF ASSY;-,-,#1365,1200mm,3A,
MANUAL USERS;DVD-R129/XAA,XAA,ENG,

1
1
1

SA
SA
SA

W350
W352
W353
W354
W355

6001-001003
6001-000883
6003-001199
6003-001258
6003-001526

SCREW-MACHINE;BH,+,M2.6,L6,ZPC(BLK
SCREW-MACHINE;PH,+,M1.4,L5,ZPC(BLK
SCREW-TAPTITE;PWH,+,B,M2,L7,ZPC(YE
SCREW-TAPTITE;PH,+,B,M1.4,L2.0,NI
SCREW-TAPTITE;CH,+,S-TITE,M1.4,L4,

4
1
4
4
2

SA
SNA
SA
SA
SNA

Y1

2802-001163
AK92-00876A
AC99-40311H
0202-001221
AK41-00476A

RESONATOR-CERAMIC;33.86MHz,0.5%,TP
ASSY PCB-F/END;SV-R3600,F/END ASSY
ASSY PCB-F/END,c;SV-R3600,F/END AS
SOLDER-CREAM;PF305-116HO(A),-,25~4
PCB-FONT;RAMBO3,EPOXY,2,-,1.3T,132

1
1
1
4.04
0.5

SA
SNA
SNA
SNA
SNA

AC99-90312K
0202-001214
AK97-01325A
3403-001026
AK41-00397A

ASSY PCB-F/END,m;SV-R3600,F/END AS
SOLDER-WIRE FLUX;HI-ALMIT HR19M LF
ASSY-HOUSING;-,DP-RW2,ASSY
SWITCH-PUSH;5V,0.7mA,DPST,OFF-ON-O
PCB-DECK;DP-RW2,PHENOL,1,00,T1.6,2

1 SNA
0.167 SNA
1 SNA
1 SA
1 SNA

AK41-00400A
AK68-00433A
AK97-01328A
AK97-01331A
AK61-00486A

FFC-DECK;DP-RW2,PITCH1.0,PET,5P,-,
LABEL WARNING-DRIVE;DP-R1,-,ART PA
ASSY-HOLDER CHUCK;ASSY,DP-RW2,DP-R
ASSY-CLAMPER;POM+MAGNET,DP-RW2,ASS
BODY CLAMPER-UPPER;DP-RW2,POM,T0.7

1
1
1
1
1

AK61-00487A
BG33-30001D
AK97-01327A
0202-001221
0201-001253

BRACKET-CLAMPER;DP-RW2,SECC,T0.6,1
MAGNET-CLAMPER;-,-,-,-,13.5x6x1.1
ASSY-P U DECK;ASSY,DP-RW2,DP-RW2
SOLDER-CREAM;PF305-116HO(A),-,25~4
ADHESIVE-STR;TB2212B,BLK,25(250),T

1 SNA
1 SNA
1 SNA
0.12 SNA
0.008 SNA

Samsung Electronics

SNA
SNA
SNA
SNA
SNA

This Document can not be used without Samsung’s authorization

7-11

Electrical Parts List

MEMO

7-12

This Document can not be used without Samsung’s authorization

Samsung Electronics

8. Block Diagrams
8-1 All Block Diagram- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

8-2

8-2 DIC1(S5L3200) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

8-3

8-3 AIC1(PCM1742) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

8-4

8-4 AIC2 (PCM1802) Block Diagram- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

8-5

8-5 FIC1 (TSB4AB1) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

8-6

8-6 VIC1 (TW9906) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

8-7

8-7 IC4N01(MSP3407G) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - -

8-8

Samsung Electronics

This Document can not be used without Samsung’s authorization.

8-1

Block Diagrams

8-1 All Block Diagram
DVD- DRIVE (4.7GB)

RF

AUDIO
VIDEO

DIC2 (Main)
DDR-SDRAM

DIC3(Main) FLASH

ATAPI

TM1(JACK)
TM BLOCK

CVBS from Tuner
Component (480i / 480P)
IC201
(JACK)

Y
PB

CVBS1

PR

VIC1(Main)
Video Decoder

S-VIDEO1

S-VIDEO

DIC1 (Main)
MPEG-2 A/V CODEC

CVBS2

VIDEO
L1
L2

L/R from
Tuner

IC203
(JACK)

AIC1(Main)
Audio D/A

R1
R2

L1

AIC2(Main)
Audio A/D

R1
L2
R2

COAXIAL

IC601 (JACK)
Front Micom

IEC-958
OPTICAL
DIGITAL AUDIO OUT
Key Input

Front PCB

Remocon

FIC1 (Main)
IEEE1394PHY
1394 JACK

8-2

This Document can not be used without Samsung’s authorization.

Samsung Electronics

Block Diagrams

8-2 DIC1(S5L3200) Block Diagram
DDR SDRAM #0

DDR SDRAM #1

Dual Channel
DDR Controller
& AHB+ BUS

BT656(IN)

SDIN
ARM9TDMI
Video Pre-processor
4KB
I-Cache

4KB
D-Cache

IEEE1394

IEEE1394
MPEG2 Encoder

USB

USB 1.1 Host

AHB+ Wrapper

MPEG2 Decoder

ATAPI

Dual ATAPI (w/ AES)
DV Decoder
CalmADM #0

PSD
PIP Scaler

4KB
I-Cache

PSM

12KB
D-Cache

Graphic Accelerator
BT656(OUT)

Video Processor

CalmADM #1

MIXER

SDOUT

Video PENTA DAC
Analog Video Out

4KB
I-Cache

SPD

12KB
D-Cache
IODMA

PLL, Clock/Reset
Generation Block

APB Bridge

27MHz X-tal

I2S
SPDIF(IN)
SPDIF(OUT)
SPI
UART
WDT
IR
Host I/F
TIMER
I2C
GPIO

Samsung Electronics

This Document can not be used without Samsung’s authorization.

8-3

Block Diagrams

8-3 AIC1(PCM1742) Block Diagram

8-4

This Document can not be used without Samsung’s authorization.

Samsung Electronics

Block Diagrams

8-4 AIC2 (PCM1802) Block Diagram

Samsung Electronics

This Document can not be used without Samsung’s authorization.

8-5

Block Diagrams

8-5 FIC1 (TSB4AB1) Block Diagram

8-6

This Document can not be used without Samsung’s authorization.

Samsung Electronics

Block Diagrams

8-6 VIC1 (TW9906) Block Diagram

Samsung Electronics

This Document can not be used without Samsung’s authorization.

8-7

Block Diagrams

8-7 IC4N01(MSP3407G) Block Diagram

8-8

This Document can not be used without Samsung’s authorization.

Samsung Electronics

9. Wiring Diagram

Samsung Electronics

9-1

Wiring Diagram

MEMO

9-2

Samsung Electronics

10. PCB Diagrams
10-1 Main PCB - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

10-2

10-2 Jack PCB - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

10-4

10-3 Key PCB - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

10-6

10-4 Sub PCB - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

10-7

Samsung Electronics

10-1

PCB Diagrams

10-1 Main PCB
COMPONENT SIDE

AIC1

AIC2

DIC7

RIC1

DIC3

DIC2

RIC2

10-2

Samsung Electronics

PCB Diagrams

CONDUCTOR SIDE

DIC5

DIC4

FIC1

Samsung Electronics

VIC1

10-3

PCB Diagrams

10-2 Jack PCB
COMPONENT SIDE

IC703
AIC4
IC604

IC603

VIC1
IC601

IC203

IC701

10-4

Samsung Electronics

PCB Diagrams

CONDUCTOR SIDE

IC703
AIC4
IC604

IC603

VIC1
IC601

IC702

IC203

IC701

Samsung Electronics

10-5

PCB Diagrams

10-3 Key PCB
COMPONENT SIDE

CONDUCTOR SIDE

10-6

Samsung Electronics

PCB Diagrams

10-4 Sub PCB
COMPONENT SIDE

CONDUCTOR SIDE

Samsung Electronics

10-7

PCB Diagrams

MEMO

10-8

Samsung Electronics

11. Schematic Diagrams
11-1 S.M.P.S (Jack PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-2

11-2 TM Block (Jack PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-3

11-3 AV Input (Jack PCB)

------------------------------------

11-4

11-4 Micom (Jack PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-5

11-5 CBS Function Block (Jack PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-6

11-6 I/O (Jack PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-7

11-7 AV Codec (Main PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-8

11-8 DDR (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-9

11-9 DV_1394 (Main PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-10

11-10 Latch And Audio (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-11

11-11 Main Connector (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-12

11-12 Video Decoder (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-13

11-13 Sub and Key (Sub and Key PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-14

Samsung Electronics

This Document can not be used without Samsung’s authorization.

11-1

Schematic Diagrams

11-1 S.M.P.S (Jack PCB)

Power

11-2

This Document can not be used without Samsung’s authorization.

Samsung Electronics

Schematic Diagrams

11-2 TM Block (Jack PCB)

Power

Samsung Electronics

Video

Audio

This Document can not be used without Samsung’s authorization.

11-3

Schematic Diagrams

11-3 AV Input (Jack PCB)

Power

11-4

Video

Audio

This Document can not be used without Samsung’s authorization.

Samsung Electronics

Schematic Diagrams

11-4 Micom (Jack PCB)
Power

Samsung Electronics

This Document can not be used without Samsung’s authorization.

11-5

Schematic Diagrams

11-5 CBS Function Block (Jack PCB)

11-6

This Document can not be used without Samsung’s authorization.

Samsung Electronics

Schematic Diagrams

11-6 I/O (Jack PCB)
Power

Samsung Electronics

Video

Audio

This Document can not be used without Samsung’s authorization.

11-7

Schematic Diagrams

11-7 AV Codec (Main PCB)

Power

11-8

Video

Audio

This Document can not be used without Samsung’s authorization.

Samsung Electronics

Schematic Diagrams

11-8 DDR (Main PCB)
Power

Samsung Electronics

This Document can not be used without Samsung’s authorization.

11-9

Schematic Diagrams

11-9 DV_1394 (Main PCB)

Power

11-10

This Document can not be used without Samsung’s authorization.

Samsung Electronics

Schematic Diagrams

11-10 Latch And Audio (Main PCB)

Power

Samsung Electronics

Audio

This Document can not be used without Samsung’s authorization.

11-11

Schematic Diagrams

11-11 Main Connector (Main PCB)
Power

11-12

Video

Audio

This Document can not be used without Samsung’s authorization.

Samsung Electronics

Schematic Diagrams

11-12 Video Decoder (Main PCB)

Power

Samsung Electronics

Video

This Document can not be used without Samsung’s authorization.

11-13

Schematic Diagrams

11-13 Sub and Key (Sub and Key PCB)

Power

11-14

Audio

This Document can not be used without Samsung’s authorization.

Samsung Electronics

12. Operating Instructions

Description
Getting Started

Front panel

1. POWER
Turns the recorder on and off.
2. AV 2 IN
Connect external equipment.
3. DV-IN
Connects external digital equipment with a DV
jack. (such as a camcorder)
4. DISC TRAY
Opens to accept a disc.
5. OPEN/CLOSE
Opens and closes the disc tray.
6. DISPLAY
Displays the playing status, time, etc.

7. SEARCH
Go to the next title/chapter/track, or goes back
to the previous title/chapter/track.
8. STOP
Stops disc playback.
9. PLAY/PAUSE
Plays a disc or pauses playback.
10. P.SCAN
Selects the progressive scan mode.
11. REC
Starts recording.
12. CH (
)
Select TV channels.

Front Panel Display

1. Lights when a disc is loaded.
2. Lights in the record mode.
3. Lights to indicate the timer record mode.

4. Lights when a DVD-R/-RW/-RAM disc is
loaded.
5. Alpha/Numeric display.
6. Lights in the progressive scan mode.

English - 11

Samsung Electronics

12-1

Operating Instructions

Getting Started

Rear Panel

1. DIGITAL AUDIO OUT(OPTICAL)
Connects to an amplifier having a digital optical
audio input jack.
2. DIGITAL AUDIO OUT(COAXIAL)
Connects to an amplifier having a digital coaxial
audio input jack.
3. AV AUDIO OUT
Connect to the audio input of external equipment
using audio cables.
4. AV VIDEO OUT(good video quality)
Connects the input of external equipment using a
Video cable.
5. AV S-VIDEO OUT(better video quality)
Connects the input of external equipment using
an S-Video cable.

6. COMPONENT VIDEO OUT(best video quality)
Connect to equipment having Component video
input jacks.
7. AV 1 AUDIO IN
Connect the output of external equipment using
audio cables
8. AV 1 VIDEO IN
Connects the output of external equipment using
a video cable.
9. AV 1 S-VIDEO IN
Connects the output of external equipment using
an S-Video cable.
10. ANT IN/ANT OUT (TO TV)
Connect antenna cables.
■

NOTE

The Antenna connection does not pass
audio/video signals. To watch a DVD on your
TV, you must connect audio/video cables.

Unpacking

Accessories
Check for the supplied accessories below.

Video/Audio Cable
(AC39-00073A)

RF Cable for TV
(AC39-42001J)

Remote Control
(AK59-00055A)

Batteries for Remote
Control (AAA Size)
(AC43-12002H)

Instruction Manual
(AK68-01174A)

Quick Guide
(AK68-01175A)

12 - English

12-2

Samsung Electronics

Operating Instructions

12. TITLE LIST/DISC MENU Button

Tour of the Remote Control

Use this to enter the View Recording list/Disc menu.

13. ANYKEY Button
28

29

27

30

14. REC Button

1

16

15. REC MODE Button

Use this to view the status of the disc that is being played.

17
2

Use this to set the desired Recording time and picture quality.
(XP/SP/LP/EP)

16. SUBTITLE Button

Getting Started

Use to make a recording on DVD-RW/-R discs.

Press this to switch the DVD’s subtitle language.
3
4
5
6
7
8

18

To open and close the disc tray.

18. ANGLE Button
19
20

11

19. PLAY/PAUSE Button
Press to play/pause a disc or pause the recording.

20. CH Button

9
10

17. OPEN/CLOSE Button

21
22

Use this to select a TV channel.

21. AUDIO Button
Use this to access various audio functions on a disc.

22. RETURN Button
23. PLAY LIST/TITLE MENU Button
Use this to return to the Title menu, or to view the recorded
Playlist.

12
13
14

23
24
25

24. CANCEL Button

15

26

25. TIMER Button
Press to directly enter the Timer Recording Mode menu.

26. INFO Button
This will display current setting or disc status.

27. REPEAT Button
Allows you to repeat a title, chapter, track or disc.

1. POWER Button
2. NUMBER Buttons
3. 100+ Button
Press this to select channel 100 or higher.

4. REVERSE/FORWARD SKIP Buttons
Press to skip a disc backwards or forwards.

28. REPEAT A-B Button
Allows you to repeat a certain section.

29. ZOOM Button
30. INPUT SEL. Button
Selects line input signal in external input mode. (Tuner, AV1,
AV2 or DV)

5. REVERSE/FORWARD STEP Buttons
Press to play frame by frame.

6. REVERSE/FORWARD SEARCH Buttons
Press to search a disc backwards or forwards.

7. STOP Button
Press to stop a disc or to stop the recording.

8. CM SKIP Button
The unit can be set to automatically skip a portion of the
program during playback of a DVD disc.

9. MARKER Button
Use this to bookmark or mark a position while playing a disc.

10. MENU Button
Brings up the DVD recorder’s setup menu.

11. ENTER/DIRECTION Buttons
(UP/DOWN and LEFT/RIGHT Buttons)
This button functions as a toggle switch.

English - 13

Samsung Electronics

12-3

Operating Instructions

Connecting &
Setting Up

Connecting &
Setting Up

Quick Overview
A Quick Overview presented in this guide will give
you enough information to start using the recorder.

This section involves various methods of
connecting the DVD Recorder to other external
components and setting required initial modes.

Step 1 : Connecting the Antenna Cable

†
Step 2 : Connecting the Video Cable

†
Step 3 : Connecting the Audio Cable

†
Step 4 : Connecting External Devices

†
Step 5 : Connecting the Power Cord

†
Step 6 : Preparing the Remote Control

Quick Overview . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Step 1 : Connecting the Antenna Cable . . . . . . . .15
Step 2 : Connecting the Video Cable . . . . . . . . . .18
Step 3 : Connecting the Audio Cable . . . . . . . . . .21
Step 4 : Connecting External Devices . . . . . . . . . .24
Step 5 : Connecting the Power Cord . . . . . . . . . . .27
Step 6 : Preparing the Remote Control . . . . . . . . .27

• Note to CATV system installer: : This reminder is
provided to call CATV system installer’s attention to
Article 820-40 of the National Electrical Code
(Section 54 of Canadian Electrical Code, Part I),
that provides guidelines for proper grounding and,
in particular, specifies that the cable ground shall
be connected to the grounding system of the
building as close to the point of cable entry as
practical.

14 - English

12-4

Samsung Electronics

Operating Instructions

Step 1: Connecting the Antenna Cable

There are several ways to connect your DVD Recorder. Select one of the Antenna connections on the following pages.

You can record non-scrambled channels by selecting the channel on the DVD Recorder. Also use this method if you
watch channels without cable box.

■

NOTE

Connecting &
Setting Up

Antenna + DVD Recorder + TV : No Cable box

The VHF/UHF ANT (RF) OUT jack of this
product sends only signals received through
the antenna. It does not output Audio/Video
signals. You must connect Audio/Video cables
to view Video from the unit.
(i.e. DVD playback)

English - 15

Samsung Electronics

12-5

Connecting &
Setting Up

Operating Instructions

Antenna + Cable box + DVD Recorder + TV : Cable box with many scrambled
channels
You can record channels by selecting the channel on the cable box. You cannot record one channel while watching
another channel. Be sure that the cable box is turned on.

■

NOTE

The VHF/UHF ANT (RF) OUT jack of this
product sends only signals received through
the antenna. It does not output Audio/Video
signals. You must connect Audio/Video cables
to view Video from the unit.
(i.e. DVD playback)

16 - English

12-6

Samsung Electronics

Operating Instructions

You can record non-scrambled channels by selecting the channel on the DVD Recorder. You cannot record scrambled
channels that require a cable box.

■

NOTE

Connecting &
Setting Up

Antenna + DVD Recorder + Cable box + TV : Cable box with a few scrambled
channels

The VHF/UHF ANT (RF) OUT jack of this
product sends only signals received through
the antenna. It does not output Audio/Video
signals. You must connect Audio/Video cables
to view Video from the unit.
(i.e. DVD playback)

English - 17

Samsung Electronics

12-7

Operating Instructions

Step 2 : Connecting the Video Cable

Connecting &
Setting Up

There are several ways to connect your DVD Recorder. Select one of the video connections on the following pages.
The VHF/UHF RF OUT jack of this product sends only signals received through the antenna. It does not output
audio/video signals. You must use one of the following audio/video connections on this unit.

Connecting to a Video input jack
Connect a video(yellow) cable between the VIDEO(yellow) OUT jack on DVD Recorder and VIDEO(yellow) IN jack on
the TV (or AV amplifier).

• You will enjoy normal quality images.
• Connect audio cables(white and red) between the
AUDIO OUT jacks on the DVD Recorder and AUDIO
IN jacks on your TV(or AV amplifier).
(See pages 21 ~ 23)

18 - English

12-8

Samsung Electronics

Operating Instructions

Connect an S-Video cable(not supplied) between the S-VIDEO OUT jack on DVD Recorder and S-VIDEO IN jack on
your TV (or AV amplifier).

• You will enjoy high quality images. S-Video separates
the picture element into black and white (Y) and color
(C) signals to present clearer images than regular
video input mode.
• Connect audio cables(white and red) between the
AUDIO OUT jacks on the DVD Recorder and AUDIO
IN jacks on TV(or AV amplifier).
(See pages 21 ~ 23)

■

NOTE

Connecting &
Setting Up

Connecting to an S-Video input jack

S-Video or Component video outputs are
available only if your TV supports S-Video
input or Component video input, respectively.
If S-Video or Component video output does
not work, check the TV connections and the
TV input selection settings.

English - 19

Samsung Electronics

12-9

Connecting &
Setting Up

Operating Instructions

Connecting to Component video input jacks (Y,PB,PR)

1. Connect Component video cables(not supplied)
between the COMPONENT OUT(Y,PB,PR) jacks on
DVD Recorder and COMPONENT IN(Y,PB,PR) jacks
on your TV (or AV amplifier).
2. If the connected TV supports Progressive Scan,
press the P.SCAN button on the front of the DVD
Recorder to enjoy best quality video.
Pressing the P.SCAN button switches Progressive
(480p) / Interlace (480i) scan mode in turn.
• You will enjoy best quality accurate color reproduction
images. Component video separates the picture
element into black and white(Y), blue(PB), red(PR)
signals to present clear and clean images.
• Connect audio cables(white and red) between the
AUDIO OUT jacks on the DVD Recorder and AUDIO
IN jacks on TV(or AV amplifier).
(See pages 21 ~ 23)

■

NOTE

■

Compared to standard interlaced video, progressive
scan doubles the amount of video lines fed to your
TV, resulting in a more stable, flicker-free, and clear
image than interlaced video. The progressive scan
video output jack is used in progressive output
mode. This is only available with TVs that support
progressive scan.
Progressive Scan Output (480p).
Not all high definition television sets are fully
compatible with this product. If the 480p progressive
scan picture is not satisfactory, press the P.SCAN
button on the unit to switch to the Interlace mode.
If there are questions regarding TV set compatibility
with this model, please contact our customer
service center at 1-800-SAMSUNG.

20 - English

12-10

Samsung Electronics

Operating Instructions

Step 3 : Connecting the Audio Cable

There are several ways to connect your DVD Recorder. Select one of the audio connections on the following pages.

Connecting &
Setting Up

Connecting to your TV
This connection will use your TV’s speakers.

English - 21

Samsung Electronics

12-11

Connecting &
Setting Up

Operating Instructions

Connecting to a stereo amplifier with analog input jacks
If your stereo amplifier only has AUDIO INPUT jacks(L and R), use the AUDIO OUT jacks.

22 - English

12-12

Samsung Electronics

Operating Instructions

If your AV amplifier has a Dolby Digital or DTS decoder and a digital input jack, use this connection. To enjoy Dolby
Digital or DTS sound, you will need to set up the audio settings. (See pages 32~33)

Connecting &
Setting Up

Connecting to an AV amplifier with a digital input jack

Manufactured under license from Dolby
Laboratories. “Dolby” and the double-D symbol are
trademarks of Dolby Laboratories.
“DTS” and “DTS Digital Out” are trademarks of
DTS, Inc.

English - 23

Samsung Electronics

12-13

Operating Instructions

Step 4 : Connecting External Devices

Connecting &
Setting Up

This allows you to connect your DVD Recorder to other external devices and view or record their outputs.

Connecting a VCR, Set-Top Box(STB) or DVD Player to the AV 1 IN jacks
Connecting a VCR or external device to the AV 1 IN jacks of the DVD Recorder.
You can record from connected equipment (VCR, STB or DVD Player).

24 - English

12-14

Samsung Electronics

Operating Instructions

You can also use the AV 2 IN jacks on the front panel of the DVD Recorder. You can record from connected
equipment, such as a camcorder.
When an input source is inserted into AV 2 while watching TV, the input will be switched to AV 2 automatically.

Connecting &
Setting Up

Connecting a Camcorder to the AV 2 IN jacks

English - 25

Samsung Electronics

12-15

Connecting &
Setting Up

Operating Instructions

Connecting a Camcorder to the DV IN jack
If your camcorder has a DV output jack, connect it to the DV input jack of your DVD Recorder.

(See page 48)

■

NOTE
■

If the input is not selected automatically, press the
INPUT SEL. button on the remote control to select
the DV input.
Check your camcorder's owner's manual to see
how to use the camcorder in this mode.

26 - English

12-16

Samsung Electronics

Operating Instructions

Step 5 : Connecting the
Power Cord
After all connections are complete, plug the power cord
in the wall outlet.

Connecting &
Setting Up

“Auto” appears in the panel display. This means
that the current time is being set automatically
(Auto Program) through the antenna under
connection and also the channel is being set.
The setup may take a few minutes.
When the DVD Recorder operates normally, the current time
is automatically set and displayed in the front panel display.
■

NOTE

After the current time is set automatically, the
recorder will perform Auto Channel Memory for
about 3 minutes. If power is on before finishing
the Auto Channel Memory process, Auto
Channel Memory will stop.
In this case, do Auto Channel Memory from
MENU(see page 31).

Step 6 : Preparing the
Remote Control
Install Batteries in the Remote Control
• Open the battery cover on the back of the remote.
• Insert two AAA batteries. Make sure that the polarities
(+ and -) are aligned correctly.

• Replace the battery cover.
If the remote control does not operate properly:
• Check the polarity + - of the batteries (Dry-Cell)
• Check if the batteries are drained.
• Check if remote sensor is blocked by obstacles.
• Check if there is any fluorescent lighting nearby.
Dispose of batteries according to local environmental
regulations. Do not put them in the household trash.

English - 27

Samsung Electronics

12-17

Operating Instructions

MEMO

12-18

Samsung Electronics

13. Circuit Operating Descriptions
13-1 Power
13-1-1 About S.M.P.S (Ringing Choke Converter Method)
Vout

Transformer
(Np)
(Ns)
–
+
(Vp)
(Vs)
+
–

Vreg
REGULATOR

+
+
Vin

Switch

ON/OFF Control

+
Vs switch
–
I switch

Fig. 13-1
◆Terms
1) 1st : Common power input to 1st winding.
2) 2nd : Circuit followings output winding of transformer.
3) f (Frequency) : Switching frequency (T : Switching cycle)
4) Duty : (Ton/T) x 100

13-1-2 Circuit description [FLY-Back RCC(Ringing Choke Converter)] Control
(a) AC Power Rectification/Smoothing Terminal
1) PADT1, PADT2, PADT3, PADT4 : Convert AC power to DC (Wave rectification).
2) PRCU1 : Smooth the voltage converted to DC.
3) PALT1, PALT2, PACT1, PACT2 : Noise removal at power input/output.
4) PLRU1 : Rush current limit resistance at the momemt of power cord insertion.
· Without PLRT1, the bridge diode might be damaged as the rush current increases.

Samsung Electronics

13-1

Circuit Operating Descriptions

(b) SNUBBER Circuit :
PSRZ1, PSRZ2, PSCX1, PSCZ2, PSDZ1

Vswitch
Inverted power
by leakage
inductance

1) Prevent residual high voltage at the terminals of
switch during switch off/Suppress noise.
High inverted power occurs at switch off,
because of the 1st winding of transformer :
(V=-L1 xdi/dt. L1 : Leakage Induction)
A very high residual voltage exist on both terminals
of PQIZ1 because dt is a very short.

dt

0

t
Toff

Fig. 13-2

2) SNUBBER circuit protects PQIZ1 from damage
through leakage voltage suppression by RC,
(Charges the leakage voltage to PSDZ1 and PSCX1
and discharges to PSRZ1, PSRZ2).
3) PSCZ2 : For noise removal

(c) PQIZ1 Vcc circuit
1) PQIZ1 Vcc : PVRL4, PVDL1, PVCL1
! Use the output of transformer as Vcc,because the current starts to flow into transformer while PQIZ1 is
active
@ Rectify to PVDL1 and smooth to PVCL1.
# Use the output of transformer as PQIZ1 Vcc : The loads are different before and after PQIZ1 driving.
(Vcc of PQIZ1 decreases below OFF voltage , using only the resistance dut to lode increase after PQIZ1
driving.)

(d) Feedback Control Circuit
TRANS(PQTZ1)

PPDF1

PPC1

ICE3B2065P

5.8V

PPLF1
PPCF3

PFRF4
PFRF1
PFRF5
PBIZ1

PFRF2
PFRF3

PFCF1

PFID1
PFRF6

Fig. 13-3
13-2

Samsung Electronics

Circuit Operating Descriptions

1) F/B terminal of PQIZ1 determines output duty cyle.
2) C-E (Collector-Emitter) of PQIZ1 and F/B potential of PQIZ1 are same.

13-1-3 Internal Block Diagram (Internal Block Diagram of S.M.P.S. Circuit)
3.0V Rectified
Smoothing Circuit

Smoothing
Circuit
Noise
Removal
(SNUBBER)

12V Rectified
Smoothing Circuit

Converter

5.4V Rectified
Smoothing Circuit

Rectified Circuit

Line Filter

3.3V Rectified
Smoothing Circuit

PWM Control
Circuit
(ICE3B2065P)

12V Rectified
VoltageCircuit

5V Rectified
VoltageCircuit

O
U
T
P
U
T

33V Rectified
Smoothing Circuit

Voltage
Detection
Circuit
Power IN
(110V)

Fig. 13-4

Samsung Electronics

13-3

Circuit Operating Descriptions

13-2 AV Codec
DVD
MULTI DRIVE
(SERVO)
ATAPI
DIC2
K4H561638F
(DDR SDRAM)

32bit

Audio output block

SDRAM I/F

AUDIO OUT
DIC4,DIC5
LVC16374 x2

VIDEO OUT

DIC3
39V51601
(Flash Memory)

FIC1
TSB41AB2PAP
(1394 PHY)

Audio Input
Block

AIC2
PCM1802
(AUDIO A/D)

Video Input
Block

VIC1
TW9906
(VIDEO DEC)

AIC1
PCM1753KE
(AUDIO D/A)

HOST I/F

16bit

IEEE 1934
(DV Input) Block

I2S

Y,Pb,Pr, Y/C, CVBS

Video output
block

DIC1
S5L3200
(A/V CODEC)

8bit

12S

ITU-R656

DV I/F

AUDIO IN

VIDEO IN
Front Panel I/F

IC601
MN101DF06
(Front MICOM)

Fig. 13-5
· Main system control
· A/V Encoding/Decoding
· Transcoding/rating
· IEEE 1394 link layer function

13-4

· ATAPI interface with DVD-Multi Drive
· Analog Progressive/interlaced video output

Samsung Electronics

Circuit Operating Descriptions

13-2-1 GENERAL DESCRIPTION
Samsung S5L3200 MPEG AV Codec is designed to provide a cost-effective, low power size and high performance
DVD recorder solution for DVD-VR, DVD-video, DVD-audio & many of CD applications. To reduce total system
cost, The S5L3200 also provides the following features: a front-end controller, a back-end decoder, a control CPU
with separate 4KB instruction and 4KB data cache, an improved audio DSP, a programmable video encoder with
a dual output capability of interlaced and progressive scan, DDR memory controller, 4-channel timers with PWM,
I/O ports, 5-channel 10-bit DACs, 2-channel UARTs with handshake, IIC bus interface, IIS bus interface, SPI, dual
ATAPI, IEEE1394, USB 1.1 Host I/F and PLL for clock generation.

13-2-2 A/V Processor (DIC1) Functional Description
1) RISC processor architecture
· ARM940T core processor
· Fully 16/32-bit RISC architecture
· Harvard cache architecture with separate 4KB instruction and 4KB data cache
· Protection unit to partition memory and set individual protection attributes for each partition
· Up to 200 MHz operating frequency.
2) Memory controller
· Address space: 256 M-byte for each bank (total 1 Gbyte space)
· Supports programmable 8/16-bit data bus width for ROM/SRAM interface
· Supports 16-bit data bus width for DDR-SDRAM interface
· 3 memory banks; 2 memory banks for ROM, SRAM etc, 1 memory bank for SDRAM
· Fully programmable access cycles for all memory banks
· Supports external wait signal to expand the bus cycle.
3) Cache memory
· 64 way set-associative cache with I-cache (4KB) and Dcache (4KB)
· 8-words per line with one valid bit and two dirty bits per line
· Pseudo random or round robin replacement algorithm
· Write through or write back cache operation to update the main memory
· Write buffer can hold 8 words of data and four addresses.
Clock & power manager
· Low power consumption
· On-chip PLLs
· Clock can be fed selectively to each function block by software
· Power mode: normal, slow and idle mode (normal mode: normal operating mode, slow mode:
low frequencclock without PLL, idle mode: stop CPU clock only)
· Wake up by interrupt from idle mode.

Samsung Electronics

13-5

Circuit Operating Descriptions

4) Interrupt controller
· 32 interrupt sources (watch dog timer, 4 timers, UARTs, 8 external interrupts, IIC, IIS, SPI, IR, etc.)
· Edge detect mode on external interrupt source
· Programmable polarity of rising and falling
· Supports FIQ (fast interrupt request) for very urgent interrupt request.
5) Video pre-processor
· Noise reduction by motion-compensated temporal filtering
· Bitmap generation for motion estimation of MPEG encoder
· Scene change detection.
6) MPEG video encoder
· Encodes MPEG1 & MPEG2 video stream (MP@ML)
· Efficient motion estimation by hierarchical motion vector search and binary image matching.
7) MPEG video decoder
· Decodes MPEG1 & MPEG2 video stream (MP@ML)
· Error detection and autonomous error concealment.
8) Audio DSP
· Decodes Dolby AC-3, MPEG1, MPEG2, DTS, MLP, HDCD, AAC and WMA
· Supports down mix
· MAC2424 for audio signal processing
– 24-bit high performance fixed-point DSP coprocessor, 24x24 MAC operation in 1 cycle.
– 2 multiplier accumulator registers, 4 general accumulator registers, and 8 pointer registers.

13-6

Samsung Electronics

Circuit Operating Descriptions

13-3 SERVO (DVP Multi Drive)
1) Pick-Up
Data in the disc is processed from the optical pick-up unit (OPU). OPU includes the Elantec chip (EL6912c)
which is a highly integrated laser diode driver designed to support multi-standard writable optical drives. This
chip also has an IV amplifier with concurrent read and write sampling. The architecture allows reprogramming
of the timers to support different media DVD or CD standards, and different speed.
2) A-Chip
A chip is RF processor. This module performs RF signal processing which includes RFIP, RFIN, AGC, RF equal
izer. This processor is able to detect tracking error, focus error and various signals such as CE, PE, SBAD,
DEFECT, BCA, MIRROR, Wobble, TZC, RC, and RECD.
3) C-Chip
C-Chip is composed of DP1, PRML and WS.
First, the Data processor1 (DP1) performs EFM/EFM+ Demodulation and data is stored in the buffer
memory in data processor2 (DP2). DVD data in this buffer is transferred to CSS/ATAPI through
error-correction code
(ECC), descramble process and error detection code (EDC).
Second, WS performs the following processes.
! Delay compensation using Shift register
@ Sample/Hold pulse generation
# I/V Gain Control
$ Providing clock for RF chip
% OPC Control signal generation
Lastly, PRML completes the adaptive EQ/VD and Digital PLL.
4) D-Chip
D-Chip consists of Servo DSP, DP2 and 1Mbit memory. Servo DSP is dealing with controlling the servo-mecha
nism in DVD recorder. Servo-DSP has the following features.
! Bulit-in 10Bit ADC(8ch), DAC(3ch) and PWM(7ch)
@ Step Motor Control Logic: Macro/Micro Step
# Track Counter: long distance velocity control direct seek
$ Shock/Defect detection
% Header (DVD-RAM)/Land Pre-Pit (DVD-R/RW) Detection
^ Several Servo Monitor Signal Detection
& RF IC Interface
* Micom Interface
( Digital Servo Control of focus, tracking, sled and seek
) Disc Auto-Detection
1 Automatic Adjustment of the offset, balance and gain of Focus and Tracking Signal
2 Direct Seek with Velocity Control
3 Step Motor Control: Macro Seek
4 De-Track and Lens Shift Detection and Compensation
5 Center Error Control
6 DVD Layer Jump
7 Tilt Detect and Compensation
DP2 performs High Speed ECC and CD DA Decoder.

Samsung Electronics

13-7

Circuit Operating Descriptions

5) ATAPI Controller
ATAPI (ATA Packet Interface) the standard interface protocol used to connect the CD/DVD Drive to IDE inter
face. Data from the front-end is processed to back-end through this ATAPI protocol. Sanyo chip (LC98600CTXB0) is utilized for ATAPI interface. LC98600CT-XB0 has the following features.
! ECC and EDC correction/addition for CD-ROM data
@ Subcode decoding/encoding
# Spindle servo control
$ CLV/CAV servo control using ATIP data
% ATIP decoding and CRC check functions
^ Providing random EFM output for PCA use
& High-accuracy write strategy signal output enabled (CD-R 52x)
* Buffer RAM can be accessed by the microcontroller through the LC98600CT-XB0
( Built-in ATA-PI(IDE) interface (supports Ultra DMA modes 0,1, and 2)
) 52x decoding speed/52x encoding speed supported with 33.8688Mhz
1 Maximum transfer speed PIO mode: 16.6 MB/s (with IORDY), Ultra-DMA: 66MB/s (with DMARQ)
2 User can freely set the CD main channel, C2 flag, and subcode areas in buffer RAM
3 Built-in batch transfer function for transferring (CD main channel, C2 flag, etc., in a single operation)
4 Built-in multi-transfer function (allows multiple blocks to be sent to the host automatically in a single
operation)

A.chip (RIC1)
FPD,PD,I/V amp

RF Signal
(AGC/EQ)

C.chip (CIC1)

D.chip (DIC1)

PRML
SERVO
Processor

HOST

Servo Error
(FE/TE/CE/PE
SBAD/RC/TILT)
ENDEC
Pick up

Miscellaneous
Signal
(DFT/LPP
/WOBBLE)

LD,LD Driver

ECC
Processor

Focus Actuator

ATAPI chip
(ZIC1)

Tracking Actuator
APC & OPC
WRITE
STRATEGY

TILT Actuator

Sled
Motor

Spindle
Motor

Tray
Motor

Motor
Driver

MICOM (MIC1)

Deck

Fig. 13-6

13-8

Samsung Electronics

Circuit Operating Descriptions

13-4 Video Input
13-4-1 Video Input Outline
DVD-R129 is the two AV Video input. AV 1 Video input is CVBS1 & S-Video1 at the Rear Panel. Line 2 Video
input is CVBS2 at the Front Panel.
The analog Video signal select AV 1 or AV 2 by the IC601 (Front Micom).
TIC1 (Video Decoder) diverges from the 27MHz crystal, then generates ITU-R656 (10bits) and
27MHz clock. VIC1 (Video Decoder) does closed caption, copy guard detect processing and A/D conversion
of analog Video signal converted into 11bit Digital Video signal (ITU-R656 Format) is outputted via DIC1 (MPEG2
Decoder &Encoder with video Encoder) of digital part.

RF

CVBS

AV 1
(Rear)
Video
Input

CVBS 1

AV 2
(Front)
Video
Input

Y1
C1

MM1113
Analog MUX
IC702

CVBS
ITU-R656 10bit
27MHz

Video
Decoder
VIC1

CVBS2
Y

V_SYNC
/RSTAV

A/V CODEC
DIC1

SCL
SDA
C

Fig. 13-7

13-4-2 Analog Mux (MM1113)
IC702 is Analog Mux.
As Pin 2, 4 of the IC702 are controlled by the Front Micom, IC702 select RF OF CVBS(Pin1)
Line1 of CVBS[Pin3] and AV2 of CVBS[Pin 5].
The analog Video Signal of IC201 output is selected by the IC601 via VIC1(Video Decoder : TW9906) of analog
Video Input parts.

Samsung Electronics

13-9

Circuit Operating Descriptions

13-4-3 NTSC/PAL Video Decoder (TW9906 : Video Decoder)
The VIC1 (Video Decoder : TW9906) device is a high quality, single-chip digital video decoder that digitizes and
decodes all popular baseband analog video formats into digital component video. The VIC1 (Video Decoder :
TW9906) supports the analog-to-digital (A/D) conversion of component RGB and YPbPr signals, as well as the
A/D conversion and decoding of NTSC, PAL and SECAM composite and S-video into component YCbCr.
This VIC1 (Video Decoder : TW9906) includes four 10-bit 30-MSPS A/D converters. and A/D conversion of 10bit
analog Video signal converted into Digital Video signal (ITU-R656 Format) is outputted via DIC1 (MPEG2
Decoder & Encoder with video Encoder) of digital part.
The following output formats supply 10-bit 4:2:2 YCbCr to the DIC1 (MPEG2 Decoder & Encoder with video
Encoder) of digital part.
On CVBS and S-video inputs, the user can control video characteristics such as contrast, Brightness, saturation,
and hue via an I2C DIC1 port [PIN V17, V18] interface.
The TW9906 decoder includes methods for advanced vertical blanking interval (VBI) data retrieval. The VBI data
processor (VDP) slices, parses, and performs error checking on teletext, closed caption (CC), Copy Guard Detect
Processing and other VBI data.

13-10

Samsung Electronics

Circuit Operating Descriptions

13-5 Video Output
13-5-1 Outline
DIC1 (MPEG2 Decoder & Encoder with video Encoder) diverges from the 13.5MHz crystal, then generates
VSYNC and HSYNC.
DIC1 (MPEG2 Decoder & Encoder with video Encoder) does RGB encoding, copy guard processing and D/A
conversion of 10bit Video signal converted into analog signal is outputted via amplifer of
analog part.

CVBS
Y
A/V CODEC
DIC1

LOW
PASS
FILTER
(6MHz)

C
Y
Cb

6dB
AMP
&
75ohm
Drive

Cr

Y
C
Y
Cb

MM1692
VIC1

Front
Micom
IC601

Cr

PSO

Fig. 13-8

13-5-2 NTSC/PAL Digital
DIC1 inputted from pin E1 with 13.5MHz generates HSYNC and VSYNC which are based on video signal. DIC1
is synchronous signals with decoded video signal.
The above signals, which are CVBS (Composite Video Burst Synchronized), Y(S_Video), C(S_Video),
Y(Component)/G(Green), Cr(component)/R(Red), Cb(component)/B(Blue), are selectively outputted 480I(interlaced Video Output), 480P(progressive Video Output) by the Pront button DIC1 adopts 10bit D/A converter.
DIC1 perform video en-coding as well as copy protection.

Samsung Electronics

13-11

Circuit Operating Descriptions

13-5-3 Amplifier (MM1692)
VIC1 of JACK PCB is 6dB amplifier.
Based on CVBS signal, the final output level must be 2Vpp without 75ohm terminal resistance.
Because the level of video encoder output is only 1Vpp, the level is adjusted with the special
amplifier.
When mute of pin 5 is high active, if the pin is floating and connect to power, the output
signal is never outputted.
Y, C, Y(R), Cb(B), Cr(R) outputted from video encoder are inputted to VIC1 [Pin14, 16, 13, 12,
11] respectively. And CVBS Output[Pin 15] is made by Y & C Mixing signal.
The signal to which gain is adjusted by amplifier is outputted from jack via 75ohm Resistance
(VDR1,2,4,5,6,).

13-12

Samsung Electronics

Circuit Operating Descriptions

13-6 Audio
13-6-1 Input Block
This Model has two stereo line input terminals. and internal TV-audio from RF Tuner Block.
These three Analog audio signal source are converted to digital data by Input Block.
Input Block has a Multiplexer (IC203), A/D converter (AIC2).
IC203 change it’s output by selection control signal from IC601 (Front Micom).

13-6-2 Output Block
DVD-R129 has two stereo analog line out terminal, and two digital output terminal.
Decoded signal by DIC1 is inputted to AIC1 (D/A Converter), then filtered and amplified by AIC4 (OP-Amp).
And the digital audio signal (IEC-958) is outputted in Optical/Coaxial (S/PDIF) terminal.

AV IN1
(Rear)

L1-in
R1-in
L2-in

AV IN2
(Front)
TV Audio
(from tuner
block)

L2-in

SCKI
AU5
PCM1803
(Audio A/D
Coverter)

IC203
BU4052
Multiplexer

BCK
LRCK
DOUT

RF-L

DIC1
S5L3200
A/V Processor

RF-R

IC601
(micro controller)

(Dolby AC-3
Encoder/Decoder)
AIC4
4560 OP-AMP

AV OUT
(Rear)

SCKI
BCK
L-out

AU2
PCM1742KE

R-out
(Audio D/A
Coverter)

LRCK
DOUT
ML
MC
MD

Optical
Out
Coaxial
Out

IEC958 DATA

Fig. 13-9

Samsung Electronics

13-13

Circuit Operating Descriptions

13-7 Tuner
1) Low Pass Filter & High Pass Filter
This consists of IF trap circuit and UHF & VHF separation circuit. If the input signal is IF (45.75MHz),
this filter
prevents interference.
2) Single tune
This consists of a filter circuit, RF AMF, impedance conversion circuit, image trap and a single tuning circuit. It
prevents noise and other interference signals. It is very important part which improves NF (noise figure) and
prevents the various of spurious signals.
3) RF AMF
RF AMF is made of FET (Field Effects Transistor). It is controlled by AGC coming from IF DEMOD block.
4) Double tune
It consists of a double tuning circuit to improve characteristic of rejection that results in a better band
characteristic.
5) Mixer IC (Mixer, OSC, PLL)
It consists a VHF and UHF OSC and Mixer circuit. We applied mixer to make better characteristic of rejection,
it shows especially various beat characteristic.
6) PLL IC
The PLL IC plays a role selection of Tuner channel. It was built-in three wire PLL IC, charge pump and band
driver.
The minimum of step frequency is 31.25KH z.

a
Fran
Modulafor

VHF
8.P.F

b

VHF
SingleTune

c VHF
RF Amp

d

VHF
Double Tune


e

3

~
1

~

IF Single

5

~

< +B >

OSC 8uffer

VHF OSC
7

8

4

9

10

Fram IF Sect lon

V V U
9 8 6
L

f PLL IC
Mix IC IC100

TO IF Sect lon

< IF >
12

IF Amp

Mixer

Fram IF Sectlon

H

1/8 Prescaler

Band Driver

Prog.Dirlder

Band Driver

OSC Amp

3

4MHz
15 X-tal
~ 1

2

Phese Code

3wice Bas
Recelver

VHF OCS
VHF
1 Charge Pump

L.P.F

VHF
Single Tune

VHF
-RF Amp

16

VHF Mixer
VHF
Double Tune

14

13

12

VHF OSC

^
PB

&
TU

* ( )
CLOCK DATA ENABLE

1
LOCK

Fig.13-10

13-14

Samsung Electronics

Circuit Operating Descriptions

13-8 IF
1) SAW FILTER
It passes only needed band of the signal that is converted to IF frequency and decrease the others band to
minimize the effect of adjacent channel.
2) RF AGC Control
It used adjusting to determine RF AGC working point in tuner.
3) VCO Tank
When VCO tank detects PLL, it makes the signal which sets a standard.
4) AFT (Auto Frequency Tuning)
AFT automatically controls the oscillator frequency in the tuner, so that it retains a constant level.
It is a quadrature detection type. The carrier, which is detected from video det is directly input to AFT.
The 90 degree delayed phase signal is input at the same time to AFT and, the results come out.
5) IF AMP
IF signal , which is selected in Saw filter, is amplified in IF amp frequency enough to be detected. The IF amp
has parallel inputs & outputs structure.

Lim Amp

1

d
4.5 MHz
Tunlng

AGC

2

b RF AGC Control

Video Det
Video Amp

4
From
Tuner Section

a SAM Filter
(IF Amp)

21

5
6

APC
Det

Pra
Amp

To Tuner Section

SIF filter
4.5MHz

24

FM Det

10

N.S.C

EQ.Amp
B/W

19

VCD

16

APC Tine
Const SW

Mix

SIF Trap

17

Lock Det

15

IF AGC

14

c
VCD Tank

RF AGC
11
AFT Tank

RF AGC Amp
AFT

12

To Tuner Section

3
+B

4
AUDIO OUT

5
AFT OUT

6
VIDEO OUT

Fig. 13-11

Samsung Electronics

13-15

Circuit Operating Descriptions

MEMO

13-16

Samsung Electronics

14. Reference Information
14-1 About IEEE-1394
14-1-1 Comparison between IEEE-1394 and other digital interfaces
Since there are many different interfaces available, for example, RS422, RS644, and USB, vision system integ rators
are very likely to be confused when choos ing the right interface for their application. For the ideal design of a
vision syste m, it is vital to have the righ t bus/inte rface. To make things even more complex, ther e is no easy
answer such as IEEE-1394 is the best choice.
Furthermore, the new CameraLink standard, promoted by compan ies such as Puln ix, Basler AG, and many
frame grabb er companies, seems to be the stat e of the art interface. So why should IEEE-1394 be an alternative?
These questions are as complex as mostvision applicatio ns and there is no simple guideline .
Each of these interfaces offers many benefits and each of them has its individual drawbacks and restric tions. In
the table below, we try to give a brief comparison of the most popular interface systems.

Topology
Windows Driver
“Guaranteed”

RS 644 [1]

CameraLink

IEEE-1394

USB 2

Link

Link

Bus

Bus

Proprietary

Proprietary

Native

Native

(Win 200, Win 98)

(Win 200, Win 98)

~20 to 40 MByte/s

~255 MBytes/s

~32 MBytes/s[2]

~38 MBytes/s[2]

~10 m @ 40MHz

~10 meters

4.5 meters

5 meters

10

4

2

~8 MBytes/s [2]

~9 MBytes/s [2]

Bandwidth
Cable Length

~20 m @ 200MHz
Wires Needed for
8 Data Bits

22[3]

Parameter Port

No

≥ 1 KByte/s

[1] These specs are for a typical 8-bit camera application operating at 20 MHz or at 40 MHz.
[2] 80% of the bus bandwidth is used for image data and 20% is used for parameter data.
[3] 16 wires are used for data bit transfer and two wires each are used for the separate Line
Valid, Frame Valid, and Pixel Clock signals required with RS-644 transmission.
A careful comparison of the specifications shown in the table should be your first sele ction guide for the interface. For example, for an integ rator who needs very high speed, USB 2 and IEEE-1394 are not the first choice. On
the other hand, these buses are the ones to select in cases
where multiple cameras are needed or cost is a critical issue. Also, the user needs to be aware
that the D-Cam specification curre ntly does not specifically support Line Scan cameras.
However, the specification is open and line scan suppor t could be achieved via Format 7. As
for USB 2, it is still in its infancy in machine vision and we are not aware of any kind of machine vision support.

Samsung Electronics

14-1

Reference Information

14-1-2 Fiexibility and Cost Reduction
Many image processing application engineers face a familiar group of problems when designing and building a
system. The end user requires system flexib ility, simple adaptation, fast delivery times, and most importantly a
reasonable price. With conve ntional systems, whether analogor digital, engine ers must confine them selves to
certain combina tions of the existing cameras, frame grabbers, and software. The product choice for this system
config uration is limited. Unless the decision is made to use a high cost frame grabber that supports multiple cameras, sometimes known as multi-norm , it is usually not possible to operate camera s with different resolutions
from the same frame grabber.
For many applications, the introductio n of digital cameras is hindered by the cost specified by the end custom er,
however technically effective digital cameras may be. With the increa sed use of IEEE-1394 in the industrial image
processing business, many of these problems are solvable in a sure , safe , and cost effec tive way.
1) Hardware Cost Example
This example compares two simi lar vision systems. Each system uses four Megapixel
resolution digital cameras . The traditio nal solu tion consists of one frame grabber per camera, one parallel digital
data cable per camera, and one power supply per camera.
The 1394 solution requi res one hub and one interface card to connect the four cameras , along
with five ine xpensive 1394 cables. The 1394 cables carry power to the cameras directly from the computers internal power supply. (Note tha t not all compute rs are capab le of supplyi ng enough power for the cameras. In
some cases a separate power supply may be required.)

Traditional Solution
with multiple frame grabbers

Price

1394 Solution

Price

Four Cameras

18,000

Four 1394 Cameras

18,000

Four Frame Grabbers

4,400

One 1394 Interface Card

100

Four Cable

400

One 1394 Hub

120

Four power Supplies

320

Five Cables

150

Total

14-2

$23,120

Total

$18,370

Samsung Electronics

Reference Information

14-1-3 Application Examples
Today, there are already applications realizing the benefits of IEEE-1394 technology. For example, at one of our
customer sites, Basler was faced with a vision system which has the following specificatio ns:
The machine is a hig h-speed assembly system . Two indepe ndent robots take different par ts
(different in size, shape, and reflection) from a support unit and mount these parts on a mounting plate. Timing is
crucial, and in the worst case, a part must be taken from the tray every 100 ms. Accuracy of parts mounting is also
critical (0.5 mm) . To have a vision system inspecting these operations , 4 cameras (2 on each of the rob ots) are
needed:
- 2 low resolution Basler A302f camera s (640 x 480) for checking if the mounting plate is in place
- 2 high-resolution Basler A101f cameras (13 00 x 1030) for checking the components to be mounted.
Since most of the parts are differen t, the two A101f cameras must be reconfigured before almost every image
acquisit ion. In the worst case, the AOI, shutter, and som etim es gain need to be adjusted.
1) Solution used before Basler s Intervention
The customer used analog camera s with CCIR resolution (768 x 582) only. This drast ically restricted the number
of parts which could be mounted using the robots. Sin ce thes e camera s had no communication por t for configuration, adjusting the AOI was not possible and differ ences in reflection of the parts needed to be adjusted for by
driving a flash circuit. All cameras were interfaced into one frame grabber (one PC).
2) Possible solution wih digial cameas using RS 644 OR Camera Link
Using RS 644 or CameraLink based camera s, the customer would need one frame grabber for
each camera. It is very likely that the user would need two PCs (one for each robot). Changing the camera-configuration on the fly would require adv ance d grab ber cards since simple grabbers are not capable of easily changing their registers for different AOIs.
3) IEEE-1394 solution
All cameras are attached to a sing le interface card in the PC. The Basler A302f is only used when a new mounting
plate is pos itione d by the handler. In norm al operation , only the two Basler A101f cameras will be sending data
at the same time and they will be operating at about 10 FPS. This results in a data rate of about 27 MBytes/s,
which is well within the specification for IEEE-1394.
Since IEEE-1394 supports bi-directional communication between the camera and the PC, before each frame
capture , the PC can easily change resolution, gain , offset, shutter speed, or whatev er is required.
The IEEE-13 94 solution results in the se clea r advanta ges for the custom er:
- Onlyone PC,
- Only one inter face card (very inexpensive compare d with frame grabber cards ),
- Easy and inexpens ive cabl ing ,
- The system meet s the expect ations for spee d and accuracy,
- The range of inspect able parts is much bigger than with the old syste m.

Samsung Electronics

14-3

Reference Information

MEMO

14-4

Samsung Electronics

Introducing
Introducing Samsung
Samsung DVD
DVD Recorder
Recorder
(( DVD-R128_R129
DVD-R128_R129 ))

Samsung Electronics Co. LTD
Digital Video Division

1. What is SEC’s DVD-R128_R129?

Digital
DigitalA/V
A/Vsystem
systemfor
forvideo
videoplaying
playing&&recording
recording
using
usingoptical
opticaldisc
discas
asthe
themedium
mediumformat
format

High-quality Recording
High picture and sound quality

Optical Medium Recording
Digital recording by an optical

recording capability comparing

medium format allows random

with analog medium recording

access capability and easy &

systems

convenient recording

2

2. Samsung DVD Recorder
 General Introduction
 Model No : DVD-R128_R129
 Market Introduction Date
: Feb 2006 (Europe)

 Characteristics
1. Super picture & sound quality recording with MPEG-2(VBR)
2. Convenient control through random accessibility of optical discs
- One touch recording : Automatic empty area recording
- Program Navigation
- High Speed Search and Play
3. Advanced playback functions for multiple purposes
(Compatible with DVD, Audio-CD, CD-R/RW(MP-3), DVD-R, DVD-RW,DVD-RAM Disc)
3

3. DVD-R128_R129 Playback & other Features
■Progressive Scan
By scanning all 480 lines in one pass,
progressive scanning provides high vertical
resolution and flicker-free, high-density image
output that does not suffer from the loss of
quality during subject movement -- which is
characteristic of the conventional interlaced
scanning method. (U.S. version Only)

30 Frame/Sec

60 Frame/Sec

■ Program Navigator
Recorded programs are shown as thumbnail pictures, and information such as title, recording
dates and times are displayed on menu screen. User can choose a desired program.
■ Editing
Simple non-linear editing is possible on menu screen without additional editing
system. User can delete part of a program or entire program, and edit program title.
4

■Product Specification

■Chassis Product Specification

4. Disassembly and Reassembly

5. Specifications

6. DVD-R120 Key Features
 Recording Features
■ MPEG-2 VBR(Variable Bit Rate) Recording
■ Creating a DVD video title using DVD-RW/DVD-R
■ One-Touch Recording
■ Automated Quality Adjustment for Timer Recording
■ Copying data from a digital camcorder using a DV input jack
■ Selectable Recording Mode
■ Quick Recording

 Playing Features
■ Progressive Scan
■ Program Navigation

 Other Features
■ Easy Editing
■ Auto Chaptering

16

7. BLOCK DIAGRAM & CIRCUITS EXPLANATION
7-1. S5L3200 H/W Interface
■HOST Interface
■Peripheral / Storage Interface
■ATAPI Controller
■IEEE 1394 Interface
■Video Interface
■Audio Interface
■SDRAM Interface
■Serial I/O Interface
■UART Interface

7-2. Front-Micom Interface
• Front-Micom MN101D10F(IC601, Panasonic)is used to
control Power, LED Module, MTS Block, EDS, KEY Input
Matrix etc.
• The SPI(Serial Peripheral Interface) port provides a bus
for a serial interface with AV-CODEC
S5L3200(DIC1)

7-3. Video Input Outline
•

DVD-R130 is the two AV Video input. AV 1 Video input is CVBS1 & S-Video1 at the Rea
r Panel. AV 2 Video input is CVBS2 at the Front Panel.
The analog Video signal select AV 1 or AV 2 by the IC601 (Front Micom).
VIC1 (Video Decoder) diverges from the 27MHz crystal, then generates ITU-R656 (10bit
s) and 27MHz clock.
VIC1 (Video Decoder) does closed caption, copy guard detect processing and A/D conve
rsion of analog Video signal converted into 11bit Digital Video signal (ITU-R656 Format)
is outputted via U1 (MPEG2 Decoder & Encoder with video Encoder) of digital part.

7-4. Analog MUX(MM1113)
 IC702 is Analog Mux.
 As Pin 2, 4 of the IC702 are controlled by the Front Micom, IC702 select
RF OF CVBS(Pin1) AV1 of CVBS[Pin3] and AV2 of CVBS [Pin 5]
 The analog Video Signal of IC201 output is selected by the ic601 via VIC
1(Video Decoder : TW9906) of analog Video Input parts.

7-5. NTSC/PAL Video DECODER
 The VIC1 (Video Decoder : TW9906) device is a high quality, single-chip digital video dec
oder that digitizes and decodes all popular baseband analog video formats into digital co
mponent video. The VIC1 (Video Decoder :TW9906) supports the analog-to-digital (A/D)
conversion of component RGB and YPbPr signals, as well as the A/D conversion and dec
oding of NTSC, PAL and SECAM composite and S-video into component YCbCr.
 This VIC1 (Video Decoder : TW9906) includes four 10-bit 30-MSPS A/D converters. and
A/D conversion of 10bit analog Video signal converted into Digital Video signal (ITU-R656
Format) is outputted via DIC1 (MPEG2 Decoder & Encoder with video Encoder) of digital
part.
 The following output formats supply 10-bit 4:2:2 YCbCr to the DIC1 (MPEG2 Decoder &
Encoder with video Encoder) of digital part.
 On CVBS and S-video inputs, the user can control video characteristics such as contrast,
Brightness, saturation, and hue via an I2C U1 port [PIN V17, V18] interface.
 The TW9906 decoder includes methods for advanced vertical blanking interval (VBI) data
retrieval. The VBI data processor (VDP) slices, parses, and performs error checking on te
letext, closed caption (CC), Copy Guard Detect Processing and other VBI data.

7-6. Video Output Interface
 DIC1 (MPEG2 Decoder & Encoder with video Encoder) diverges from the 1
3.5MHz crystal, then generates VSYNC and HSYNC.
 DIC1 (MPEG2 Decoder & Encoder with video Encoder) does RGB encodin
g, copy guard processing and D/A conversion of 10bit Video signal converte
d into analog signal is outputted via amplifer of analog part.

7-7. NTSC/PAL Digital encoder
 DIC1 inputted from pin E1 with 13.5MHz generates HSYNC and VSYNC
which are based on video signal. DIC1 is synchronous signals with
decoded video signal.
 The above signals, which are CVBS (Composite Video Burst Synchroniz
ed), Y(S_Video), C(S_Video), Y(Component)/G(Green), Cr(component)/
R(Red), Cb(component)/B(Blue), are selectively outputted 480i (interlace
d Video Output), 480P(progressive Video Output) by the Pront button DI
C1 adopts 10bit D/A converter.
 DIC1 perform video en-coding as well as copy protection.

7-8. AMP (MM1692)
 VIC1 is 6dB amplifier.
 Based on CVBS signal, the final output level must be 2Vpp without 75 ohm
terminal resistance. Because the level of video encoder output is only 1Vpp,
the level is adjusted with the special amplifier.
 When mute of pin 5 is high active, if the pin is floating and connect to
, the output signal is never outputted.

power

 Y, C, Y(R), Cb(B), Cr(R) outputted from video encoder are inputted to VIC1 [
Pin14, 16, 13, 12, 11] respectively. And CVBS Output[Pin 15] is made by Y
& C Mixing signal.
 The signal to which gain is adjusted by amplifier is outputted from jack via
75ohm Resistance (VDR1,2,4,5,6,).

7-9. AUDIO
1. Input block
This Model has two stereo line input terminals. and internal TV-audio from RF
Tuner Block.
These three Analog audio signal source are converted to digital data by Input
Block.
Input Block has a Multiplexer (IC203), A/D converter (AIC2).
IC203 change it’s output by selection control signal from IC601 (Front Micom).
2. Output Block
DVD-R130 has two stereo analog line out terminal, and two digital output
terminal.
Decoded signal by DIC1 is inputted to AIC1 (D/A Converter), then filtered and
amplified by AIC4 (OP-Amp).
And the digital audio signal (IEC-958) is outputted in Optical/Coaxial (S/PDIF)
terminal..



7-10. Stereo/Bilingual (MTS)
 summary
1) MTS SIGNAL : mono(L+R),STEREO(L,R),MONO+SAP,STEREO+SAP
2) SAP : Sub Audio Program Signal (american MTS system only)
< MTS system base-band spectrum >
(KHz)
50

주
파
수
편
이

AM- DBS- SC

L- R
dbx- TV
NR

25

FM
L+R

15

50~ 15KHz

5
3
0

Sub Audio Prog ram Signal
↓

SAP
dbx- TV NR

Pilo t
↙

fh

FM 10KHz
50~ 10KHz
2f h

3fh

4fh

5fh

Telemetry Signal
↓

6fh 6.5fh

< MTS signal table >
i t em

Si gnal
f r eq. Band

si gnal
Monaur al Si gnal
( L + R)
St er eo Pi l ot
St er eo Si gnal
( L- R)

Si gnal Pr ocessi ng Syst em

50Hz~15KHz
15. 734 KHz
50Hz~15KHz

Maxi mum Audi o
Car r i er dev( KHz)
25

Onl y St er eo Br oadcast i ng
AM modul at i on( Carr i er f r equency 2f h)
dbx Noi se Reduct i on pr ocessi ng

5
50

FM modul at i on( Carr i er f r equency 5f h)

SAP Si gnal

50Hz~10KHz

Maxi mum f r equency devi at i on 10KHz)

15

dbx Noi se Reduct i on pr ocessi ng

Tel emet r y
Si gnal

Audi o
Dat a

0Hz~3. 4KHz
0Hz~1. 5KHz

FM modul at i on( Carr i er f r equency 6. 5f h)
Maxi mum f r equency devi at i on 3KHz)

3

 Signal route
1) SIF signal from tuner(TM1) is connected to MTS processor (IC604 1pin).
*.SIF : Sound Intermediate Frequency
2) MTS processor(IC604) detect the stereo and sap signal , send the
detecting state to front micom(IC601) by I2C data.
It will display the screen by OSD.
*.OSD : On Screen Display
3) MTS processor decode the SIF signal and send the decoded audio signal to
22pin(R out) and 23pin(Lout).
4) Lout(23pin) and Rout(22pin) of MTS processor go to IC203 for audio processing.

7-11. Tuner/Demodulator


 Tuner
Tuner consists of LPF/HPF,Single Tune,RF amplifier,Double Tune and MOP
circuits.(see the block diagram)
ⓐ LPF/HPF(Low Pass Filter/High Pass Filter)
-. IF rejection : preventing for IF frequency signal interference from antenna.
-. LPF : for VHF band ,remove UHF band signal
-. HPF : for UHF band, remove VHF band signal

ⓑ Single Tune/RF AMP
-. Single Tune: for receiving Channel initially
-. RF AMP : Gain control of tuned signal from Single Tune.
AMP Gain is controlled by AGC circuits in IF Demodulator.
ⓒ Double Tune
-. Improve the band quality,
-. minimize the loss of band signal
-. Remove the spurious signal

ⓓ MOP(Mixer,OSC,PLL)
-. MOP is consisted of VHF OSC,UHF OSC,Mixer circuits.
-. It have double balance mixer for removing interference.
-. MOP tuned the selected channel.
-. It is very important function in tuner.
-. MOP generate IF signal and connect to IF demodulator.
*.OSC : OSCILLATOR, PLL : Phase Locked Loop
IF : Intermediate Frequency

 Demodulator
-. Demodulate the IF signal for base band video and audio.
-. The demodulated video and audio signal go to AV processing.
: go to MUX IC for AV input switching
*.MUX : Multiplexer

< Block diagram of demodulator>

7-12. Loader
Loader System Overview and Rambo-II Block Diagram
S5L1482
S5L1482 Features
PRML
Data Processor I, II (DP1, DP2)
ATAPI
ARM7TDMI
WSC Interface
Servo Block
Servo Hardware and Software Features
Data Management
One Chip Solution
RF Processor and Sub Blocks

Loader System Overview
FPD, PD, I/V amp

RF Signal
(AGC/EQ)
Servo Error
(FE/TE/CE/PE
SBAD/RC/TILT)

Focus Actuator

Miscellaneous
Signal
(DFT/LPP
/WOBBLE)

Tracking Actuator

APC & OPC

LD, LD Driver

PRML

SERVO
Processor

DRAM

ECC
Processor

ATAPI

ENDEC

WRITE
STRATEGY

TILT Actuator
Sled
Motor

Spindle
Motor

Tray
Motor

Motor
Driver
MICOM

Rambo-III Block Diagram
RAMBO II Chipset

Pick-up

Host I/F

I/V AMP
Elantec

LD Drive

16-Mbit DRAM
RF Processor

Data Processor 2
Data Processor 1

Elantec

Mecha.
SpindleMotor

1-Mbit SRAM

PRML

APC

Servo DSP

WSC

ATAPI Controller
CD ENDEC
Copy Protection
·CSS/CPRM/CPPM
LC895040
CMOS/0.35um
216Pins/LQFP

Feed Motor

MICOM
ARM7

BackEnd

S5L1482A
S5L1482A is the Integrated Circuit(IC) adequate for dvd-recorder which
not only plays CD Family, DVD-ROM/-R/-RW/+R/+RW/RAM Disc but
record video and audio to DVD-R/-RW/+R/+RW/RAM Disc.
This IC is dealing with transferring playable signals generated by optical
pick-up unit (OPU). Signal from OPU is transferred to RF chip which
performs analog signal processing in order to generate RF signal. This
RF signal is fed to S5L1482A which the RF signal is transferred to the
HOST through PRML, Data Processor1(DP1), Data Processor2(DP2)
and ATAPI inside of.
Various blocks such as ARM7TDMI core which controls the entire chip
itself, WSC I/F block for the support of dvd-recording, SERVO Control
block dealing with controlling spindle motor and processing focus and
tracking signals are embedded in S5L1482A.

S5L1482 Features 1
§ CD-ROM/R/RW/DA/Video Maximum 8X Play
§ DVD-ROM/R/RW,DVD-RAM 8X Play
§ DVD-R/-RW/+R/+RW/RAM 8X Play
§ System on Chip Solution which includes SERVO, PRML, Data
Processor I(DP1), Data Processor II(DP2), ATAPI, WSC I/F
§ ARM 7TDMI Embedded
§ ATAPI Interface Support
§ External Micom I/F Support
§ Auto Disc Detection and Motor Control
§ Tilt Compensation

S5L1482 Features 2
§ Digital DC Offset Compensation
§ EFM & EFM+ De-modulation
§ BCA(Burst Cutting Area) Decoding
§ Descrambling, ECC & EDC Check
§ Bus-authentication (CSS, CPPM, CPRM)
§ Jitter Measurement of Write pattern
§ Maximum 16MByte External SDRAM Support
§ 33.8688MHz x 8 PLL Adoption
§ 0.18um(STD130, Samsung Library)
§ 3.3V (5V tolerant)
§ Operating Temperature Range : 0℃ ~ 70℃
§ 256-PIN QFP

PRML
Data Sync-Lock is generated as well as Asymmetry and DC-offset are
compensated by extracting frequency and phase difference using analogto-digital(A/D) conversion of signal from RF.
Data restoration ability is improved by adopting wave quantization,
Viterbi detector and adaptation technique through the equalizer.

Data Processor I (DP1)
EFM/EFM+ demodulation is performed by detection, protection and
insertion of bit stream transferred from PRML in terms of synchronization
signal, and generation of internal synchronization signal.
Data is transferred to DP2 in order to be stored in buffer memory.
During encoring, the position information is identified by land pre-pit(LPP)
data, PID or address in pre-groove(ADIP).
After performing EFM+ 8/16 modulation by requesting data stored in
buffer memory embedded in DP2, data related to DVD format such as
SYNC, Guard1, VFO3, PS, Guard2 and etc. are added and NRZI bit
stream transformed in order to facilitate record propagate through Write
Strategy Block.

Data Processor II (DP2)
After deinterleaving data transferred from DP1, data is stored in buffer
memory. As far as the DVD data in buffer memory, after performing error
correction code(ECC), descrambling and verifying error detection
code(EDC), data is transferred to ATAPI. As for CD data, after
performing error correction, interpolation and attenuation, data is
transferred to DAC/ATAPI/AV Decoder. Burst cutting area(BCA) data fed
through RF-Amp. originated from DVD-Disc, is stored to the buffer
memory after detecting the synchronization signal, then it performs error
correction and verifies EDC. Next, data is transferred to the
microprocessor unit. In addition, data transferred from ATAPI is activated
by EDC and scrambling. Data is stored in buffer memory after appending
EDC parity and Data-ID. After the procedures of appending the parity
utilized in error correction, transferring to DP1, performing EFM+
modulation, and adding data required for the DVD-format such as SYNC,
bit stream which will be recorded in DVD-RAM is outputted to Auto Laser
Power Controller(ALPC).

ATAPI
It is dealing with data scramble(CD case), functionalities related to data
communication to host(PIO,DMA,UDMA), management of packet
command, and authentication(CSS,CPRM).
It supports PIO/MDMA/UltraDMA, which abide by ATA/ATAPI standard
transmission method.
It is capable of controlling external buffer memory. SRAM, external
buffer, can be supported by maximum capacity of 16Mbytes, which is
shared with DP2 for the purpose of data storage.

ARM7TDMI
ARM7TDMI play a role of microprocessor by controlling various internal
blocks. Without intervention of an external microprocessor, it is capable
of controlling S5L1482A.
It embeds 16KByte SRAM and 4KByte ROM as well as supports an
external ROM/SDRAM/Flash.
If necessary, the firmware is upgradeable through ATAPI interface.
S5L1482A not only embeds ARM core but also has the capability of
adopting various kinds of external microprocessor units according to its
hardware configurations.

WSC Interface
WSC I/F is in charge of the interface between LD driver chip generating
the write pulses utilized in recording to optical disc and data processors
making write data.
The recordable optical discs are DVD-R, DVD-RW, 4.7GB DVD-RAM
and 2.6GB DVD-RAM.

Servo Block
Servo block includes digital servo controller(Teaklite Core) in order to
play DVD-RAM/ROM/R/RW and CD-ROM/R/RW discs.
Disc auto detection, focus and tracking control is performed in
automatic manner.

Servo Block Hardware Features
- Downloadable 16Kwords Program RAM
- Built-in 10Bit ADC, 8ch Sample&Hold DAC
- Track Counter : Long Distance Velocity Control Oriented Direct Seek
- Shock / Defect Detection
- De_track Detection
- Header(DVD-RAM)/LAND Pre-Pit(DVD-R/RW) Detection
- Various Servo Monitor Signal Generation
- Determination of Various Loop Filter Characteristics and Coefficients by
System Controller
- RF IC , Elantec IC serial Interface
- Micom Interface : Compatible with NEC and HITACHI Microprocessor
I/F

Servo Block Software Features
- Digital Servo Controller (Focus Controller, Tracking Controller, Sled
Controller, Seek Controller)
- Disc Auto Detection, Focus/Tracking Pull_in
- Auto Adjustment/Calibration: Focus/Tracking Loop의
Offset/Balance/Loop Gain Adjustment
- Velocity Control Oriented Direct Seek
- Step Motor Control : Macro Seek
- De-track Compensation
- Center Error Control Servo
- DVD Layer Jump
- Shock/Defect Handling
- Tilt Compensation

Data Management
The data size for data transfer between internal buffer memory and
each functional block of data processor is dependent upon disc media.
Data is transferred by 2 symbol units(2bytes, 16bits) in the case of DVD
and 2 symbol units(1bytes, 8bits) in the case of CD and BCA. The
microprocessor deals with memory management.
The microprocessor manages DVD data by 1 ECC block unit and CD
data by frame unit automatically.
BCA data is stored at the specific location of memory and managed. In
the case of an external buffer memory, the microprocessor is also in
charge of memory management and the buffer control block of ATAPI
deals with the a serious if data transfer process.

One Chip Solution
The rest block systems except RF, that is PRML, SERVO, Data
Processor, ATAPI, WSC I/F and ARM7TDMI, integrated into one chip.
This system on chip solution reinforces the reduction of power
consumption, stable and hi-speed data transfer, minimal size and
improvement of reliability.

RF Processor
RAMBO-II drive RF processor is the analog front end LSI which has the
capability of playing and recording DVD media(DVD-ROM/R/RW/RAM)
as well as playing CD media.
By adopting 0.65um Bi-CMOS manufacturing process, the frequency
characteristics and power consumption are significantly improved.
It is operated by +5V power and it does level shift for the external
interface. RF processor LSI is mainly divided by for four sub-blocks.

RF Processor Sub Blocks
▶Pick-up Interface Block : As the input interface block, this block
consists of RF Input Mux and Servo Input Mux. By receiving PD signal
and sum signal from pick-up as inputs, it selects corresponding signal
and amplification degree with respect to disc media.
▶RF Signal Processing Block : By receiving output from RF Input mux, it
performs AGC, EQ, and Header signal processing. Then, it outputs
signals to PRML and DP.
▶Servo Error Signal Processing Block : It generates various servo signal
and outputs to Servo DSP.
▶Various Signal Detection and ALPC Block : It detects Mirror, Defect,
BCA, Land Pre-pit, Wobble signals which are utilized for signal
processing in Servo and DP. Also, it has the functionality of controlling
LD Power which are Automation Power Control(APC), Optimum Power
Control(OPC) and Running Optimum Power Contol(ROPC).

8. Troubleshooting

9. Software Upgrade



---

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