COVER DVDR150

User Manual: DVDR150

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DVD- RECORDER
Chassis : Nexus (4th Generation)
BASIC : DVD-R157
Application Model
: DVD-R150
Application Areas
: XAC, XAX, XAP, XAO, RCL, STR,
SERVICE MANUAL

XAZ, XBG

DVD-R150

SERVICE
DVD-RECORDER

Manual
Merit & Character regarding Product
Œ Multi format recording
DVD ±R / ±RW

ELECTRONICS

´ Multi format playback
DVD/ DVD-RAM/ DVD-RW/ DVD-R/ DVD+R/
DVD+RW/ CD/ CD-R/ CD-RW/ MP3/ JPEG/
DivX
ˇ Recording mode
XP(1Hour)/ SP(2Hour)/ LP(4Hour)/ EP(6~8Hour)
¨ Automatic Chapter product on
ˆ 49mm Slim Design
Ø EZ REC MODE

This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
international and/or domestic law.

© Samsung Electronics Co., Ltd. FEB. 2007
Printed in Korea
AK82-01226A

CONTENTS
1. Precautions
1-1
1-2
1-3
1-4

Safety Precaution
Servicing Precautions
ESD Precautions
Handling the optical pick-up

2. Product Specification
2-1 Reference Information
2-2 Chassis Product Specification
2-3 Option Product Specification

3. Software Update
3-1 Drive Firmware Update
3-2 Flash Update (Main PCB)

4. Disassembly and Reassembly
4-1 Cabinet and PCB
4-2 PCB Location

5. Trouble Shooting
6. Exploded View and Parts List
6-1 Cabinet Assembly

7. Electrical Parts List
8. Block Diagrams
8-1
8-2
8-3
8-4
8-5

All Block Diagram
DIC1(S5L3210) Block Diagram
AIC1(PCM1753) Block Diagram
FIC1(TSB4AB1) Block Diagram
VIC1(TW9906) Block Diagram

9. Wiring Diagram

1-1 ~ 1-6
(1-1)
(1-3)
(1-4)
(1-5)

2-1 ~ 2-4
(2-1)
(2-2)
(2-3)

3-1 ~ 3-4
(3-1)
(3-3)

4-1 ~ 4-6
(4-1)
(4-6)

5-1 ~ 5-14
6-1 ~ 6-4
(6-2)

7-1 ~ 7-12
8-1 ~ 8-6
(8-2)
(8-3)
(8-4)
(8-5)
(8-6)

9-1 ~ 9-2

CONTENTS
10. PCB Diagrams
10-1
10-2
10-3
10-4

Main PCB
Jack PCB
Key PCB
Function PCB

11. Schematic Diagrams
11-1 S.M.P.S (Jack PCB)
11-2 AV Input (Jack PCB)
11-3 Micom (Jack PCB)
11-4 I/O (Jack PCB)
11-6 CODEC (Main PCB)
11-7 AV (Main PCB)
11-8 ATAPI-Flash (Main PCB)
11-9 DDR (Main PCB)
11-10 DV_1394 (Main PCB)
11-11 Audio (Main PCB)
11-12 Main Connector (Main PCB)
11-13 HDMI (Main PCB)
11-14 Sub and Key (Sub and Key PCB)

10-1 ~ 10-8
(10-2)
(10-4)
(10-6)
(10-7)

11-1 ~ 11-14
(11-2)
(11-3)
(11-4)
(11-5)
(11-6)
(11-7)
(11-8)
(11-9)
(11-10)
(11-11)
(11-12)
(11-13)
(11-14)

12. Operating Instructions

12-1 ~ 12-14

13. Circuit Operating Descriptions

13-1 ~ 13-16

13-1
13-2
13-3
13-4
13-5
13-6
13-7
13-8

Power
AV Codec
SERVO (DVP Multi Drive)
Video Input
Video Output
Audio
Tuner
IF

(13-1)
(13-4)
(13-7)
(13-9)
(13-11)
(13-13)
(13-14)
(13-15)

CONTENTS
14. Reference Information
14-1 Introduction to DVD
14-2 DVD-Video format
14-3 About IEEE1394

14-1 ~ 14-12
(14-1)
(14-3)
(14-9)

1. Precautions
1-1 Safety Precautions
1) Before returning an instrument to the customer,
always make a safety check of the entire instrument,
including, but not limited to, the following items:
(1) Be sure that no built-in protective devices are
defective or have been defeated during servicing.
(1)Protective shields are provided to protect both
the technician and the customer. Correctly replace
all missing protective shields, including any
removed for servicing convenience.
(2)When reinstalling the chassis and/or other assembly in the cabinet, be sure to put back in place
all protective devices, including, but not limited to,
nonmetallic control knobs, insulating fish papers,
adjustment and compartment covers/shields, and
isolation resistor/capacitor networks. Do not operate this instrument or permit it to be operated without all protective devices correctly installed and
functioning.
(2) Be sure that there are no cabinet openings through
which adults or children might be able to insert
their fingers and contact a hazardous voltage. Such
openings include, but are not limited to, excessively wide cabinet ventilation slots, and an improperly fitted and/or incorrectly secured cabinet back
cover.
(3) Leakage Current Hot Check-With the instrument
completely reassembled, plug the AC line cord
directly into a 120V AC outlet. (Do not use an isolation transformer during this test.) Use a leakage
current tester or a metering system that complies
with American National Standards institute (ANSI)
C101.1 Leakage Current for Appliances and
Underwriters Laboratories (UL) 1270 (40.7). With
the instrument’s AC switch first in the ON position
and then in the OFF position, measure from a
known earth ground (metal water pipe, conduit,
etc.) to all exposed metal parts of the instrument
(antennas, handle brackets, metal cabinets, screwheads, metallic overlays, control shafts, etc.), especially any exposed metal parts that offer an electrical return path to the chassis.
Any current measured must not exceed 0.5mA.
Reverse the instrument power cord plug in the outlet and repeat the test. See Fig. 1-1.

Any measurements not within the limits specified
herein indicate a potential shock hazard that must
be eliminated before returning the instrument to
the customer.
(READING SHOULD
NOT BE ABOVE
0.5mA)
LEAKAGE
CURRENT
TESTER

DEVICE
UNDER
TEST
TEST ALL
EXPOSED METER
SURFACES
2-WIRE CORD
ALSO TEST WITH
PLUG REVERSED
(USING AC ADAPTER
PLUG AS REQUIRED)

EARTH
GROUND

Fig. 1-1 AC Leakage Test
(4) Insulation Resistance Test Cold Check-(1) Unplug
the power supply cord and connect a jumper wire
between the two prongs of the plug. (2) Turn on the
power switch of the instrument. (3) Measure the
resistance with an ohmmeter between the
jumpered AC plug and all exposed metallic cabinet
parts on the instrument, such as screwheads,
antenna, control shafts, handle brackets, etc. When
an exposed metallic part has a return path to the
chassis, the reading should be between 1 and 5.2
megohm. When there is no return path to the chassis, the reading must be infinite. If the reading is
not within the limits specified, there is the possibility of a shock hazard, and the instrument must be
repaired and rechecked before it is returned to the
customer. See Fig. 1-2.
Antenna
Terminal

Exposed
Metal Part

ohm

ohmmeter

Fig. 1-2 Insulation Resistance Test
Samsung Electronics

1-1

Precautions

2) Read and comply with all caution and safety related notes on or inside the cabinet, or on the chassis.
3) Design Alteration Warning-Do not alter or add to
the mechanical or electrical design of this instrument. Design alterations and additions, including
but not limited to, circuit modifications and the
addition of items such as auxiliary audio output
connections, might alter the safety characteristics of
this instrument and create a hazard to the user. Any
design alterations or additions will make you, the
servicer, responsible for personal injury or property
damage resulting therefrom.
4) Observe original lead dress. Take extra care to
assure correct lead dress in the following areas:
(1) near sharp edges, (2) near thermally hot parts (be
sure that leads and components do not touch thermally hot parts), (3) the AC supply, (4) high voltage,
and (5) antenna wiring. Always inspect in all areas
for pinched, out-of-place, or frayed wiring, Do not
change spacing between a component and the
printed-circuit board. Check the AC power cord for
damage.

1-2

5) Components, parts, and/or wiring that appear to
have overheated or that are otherwise damaged
should be replaced with components, parts and/ or
wiring that meet original specifications.
Additionally, determine the cause of overheating
and/or damage and, if necessary, take corrective
action to remove any potential safety hazard.
6) Product Safety Notice-Some electrical and mechanical parts have special safety-related characteristics
which are often not evident from visual inspection,
nor can the protection they give necessarily be
obtained by replacing them with components rated
for higher voltage, wattage, etc. Parts that have special safety characteristics are identified by shading,
an (
)or a (
)on schematics and parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire and/or
other hazards. Product safety is under review continuously and new instructions are issued whenever appropriate.

Samsung Electronics

Precautions

1-2 Servicing Precautions
CAUTION : Before servicing units covered by this
service manual and its supplements, read and follow
the Safety Precautions section of this manual.
Note : If unforseen circumstances create conflict
between the following servicing precautions and any
of the safety precautions, always follow the safety precautions. Remember: Safety First.

1-2-1 General Servicing Precautions
(1) a. Always unplug the instrument’s AC power cord
from the AC power source before (1) re-moving
or reinstalling any component, circuit board,
module or any other instrument assembly, (2)
disconnecting any instrument electrical plug or
other electrical connection, (3) connecting a test
substitute in parallel with an electrolytic capacitor in the instrument.
b. Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this
service manual might be equipped.
c. Do not apply AC power to this instrument and
/or any of its electrical assemblies unless all
solid-state device heat sinks are correctly installed.
d. Always connect a test instrument’s ground lead
to the instrument chassis ground before connecting the test instrument positive lead. Always
remove the test instrument ground lead last.

(4) An insulation tube or tape is sometimes used and
some components are raised above the printed
wiring board for safety. The internal wiring is
sometimes clamped to prevent contact with heating components. Install such elements as they
were.
(5) After servicing, always check that the removed
screws, components, and wiring have been installed correctly and that the portion around the
serviced part has not been damaged and so on.
Further, check the insulation between the blades of
the attachment plug and accessible conductive
parts.

1-2-2 Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet
and turn the power ON. Connect the insulation resistance meter (500V) to the blades of the attachment
plug. The insulation resistance between each blade of
the attachment plug and accessible conductive
parts(see note) should be more than 1 Megohm.
Note : Accessible conductive parts include metal panels, input terminals, earphone jacks, etc.

Note : Refer to the Safety Precautions section ground
lead last.
(2) The service precautions are indicated or printed on
the cabinet, chassis or components. When servicing, follow the printed or indicated service precautions and service materials.
(3) The components used in the unit have a specified
flame resistance and dielectric strength.
When replacing components, use components
which have the same ratings. Components identified by shading, by( ) or by ( ) in the circuit diagram are important for safety or for the characteristics of the unit. Always replace them with the exact
replacement components.

Samsung Electronics

1-3

Precautions

1-3 ESD Precautions
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity.
Such components commonly are called Electrostatically Sensitive Devices(ESD). Examples of typical ESD
devices are integrated circuits and some field-effect
transistors and semiconductor chip components. The
following techniques should be used to help reduce
the incidence of component damage caused by static
electricity.
(1) Immediately before handling any semiconductor
component or semiconductor-equipped assembly,
drain off any electrostatic charge on your body by
touching a known earth ground. Alternatively,
obtain and wear a commercially available discharging wrist strap device, which should be
removed for potential shock reasons prior to applying power to the unit under test.

(7) Immediately before removing the protective materials from the leads of a replacement ESD device,
touch the protective material to the chassis or circuit assembly into which the device will be
installed.
CAUTION : Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
(8) Minimize bodily motions when handling unpackaged replacement ESD devices. (Otherwise harmless motion such as the brushing together of your
clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient
to damage an ESD device).

(2) After removing an electrical assembly equipped
with ESD devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
(3) Use only a grounded-tip soldering iron to solder or
unsolder ESD devices.
(4) Use only an anti-static solder removal devices.
Some solder removal devices not classified as
“anti-static” can generate electrical charges sufficient to damage ESD devices.
(5) Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage
ESD devices.
(6) Do not remove a replacement ESD device from its
protective package until immediately before your
are ready to install it.(Most replacement ESD
devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive materials).

1-4

Samsung Electronics

Precautions

1-4 Handling the optical pick-up
The laser diode in the optical pick up may suffer electrostatic breakdown because of potential static electricity from clothing and your body.

WRIST-STRAP
FOR GROUNDING

1M

The following method is recommended.
(1) Place a conductive sheet on the work bench (The
black sheet used for wrapping repair parts.)
(2) Place the set on the conductive sheet so that the
chassis is grounded to the sheet.
(3) Place your hands on the conductive sheet(This
gives them the same ground as the sheet.)
(4) Remove the optical pick up block
(5) Perform work on top of the conductive sheet. Be
careful not to let your clothes or any other static
sources to touch the unit.

THE UNIT

1M

CONDUCTIVE SHEET

Fig.1-3
(6) Short the short terminal on the PCB, which is inside the Pick-Up ASS’Y, before replacing the PickUp. (The short terminal is shorted when the PickUp Ass’y is being lifted or moved.)
(7) After replacing the Pick-up, open the short terminal on the PCB.

◆ Be sure to put on a wrist strap grounded to the
sheet.
◆ Be sure to lay a conductive sheet made of copper
etc. Which is grounded to the table.

Samsung Electronics

1-5

Precautions

MEMO

1-6

Samsung Electronics

2. Product Specification
2-1 Product Specification

General

Input

Power requirements

120V AC,60Hz

Power consumption

19Watts

Weight

5.1 IB

Dimensions

16.9inch(W) x 8.5inch(D) x 1.9inch(H)

Operating temp

+41°F to 95°F

Other conditions

Keep level when operating. Less than 75% operating humidity

Video (1,2)

1.0 V p-p at 75ohm load, sync negative
S-Video input (Y:1.0Vp-p, C: 0.286Vp-p at 75ohm load)

Audio (1,2)

Max. Audio input level : 2Vrms

DV Input

IEEE 1394(4p) compatible jack
Audio output jacks 1,2

Audio

Optical/coaxial digital audio output
Full scale analog output level : 2Vrms

Output

Video output jacks 1,
Video

S-Video output 1 (Y: 1.0Vp-p, C:0.286Vp-p at 75 ohm load)
Component output (Y: 1.0Vp-p ,Pb:0.70Vp-p, Pr:0.70Vp-p at 75ohm load)

Recording

Picture compression format

MPEG-II

Audio compression format

Dolby digital 2ch/256kbps

Recording Quality
Audio frequency characteristics

Samsung Electronics

XP (about 8 Mbps), SP (about 4 Mbps), LP (about 2 Mbps),
EP (about 1.2 Mbps), FR (about 1.2 Mbps to 8Mbps)
20 Hz ~ 20 KHz

2-1

Product Specification

2-2 Chassis Product Specification
General

Model Name

DVD-R135

Chassis
Info
SYSTEM

RECORDER
FUNCTION

SUB
FUNCTION

PLAYBACK
FUNCTION

N/OUT

ETS

2-2

DVD-R150
DVD-R150

Function
COLOR SYSTEM
BROADCAST SYSTEM
AUTO CLOCK
DVD-RAM
DVD-R
DVD-RW
VIDEO
AUDIO
DVD +R
DVD +RW
Flexible Recording
OTR
Time Slip
Video Plus+/Show View/G-Code
Quick Dubbing
EPG(Gemstar)
CBC(CABLE BOX CONTROL)
Play List
Auto Chaptering
JPEG Browser with BG music
DV Input
HDMI
DVD-RAM/-R/-RW/+R/+RW
DVD-Video/VCD/CD-DA
CD-R/RW
Music CD
Divx
Multi Memory Card
Progressive Scan Output
Upscaling(720P/1080i)
Video Input
Video Output
S-Video Input
S-Video Output
Component Output
HDMI Output
Analog Audio Input(L/R)
Analog Audio Output(L/R)
Optical/Coaxial
CBC
Panel disply
REMOCON
IB
Size: Net(W x H x D)
Weigh

Standard
NTSC
M
O
O
O
MPEG-2
2ch
O
O
-/O
O
O
O
O
O/-/O
O/O
O
O
O
O
2ea
1ea
1ea
1ea
1ea
1ea
2sets
2sets
O/O
LED Module
Multi 47key
English
430X49.5X210
2.3Kg

Standard
NTSC
M
O
O
O
MPEG-2
2ch
O
O
-/O
O
O
O
O
O/-/O
O/O
O
O
O
2ea
1ea
1ea
1ea
1ea
2sets
2sets
O/O
LED Module
Multi 47key
English/French
430X95X215
2.3Kg

Samsung Electronics

Product Specification

2-3 Option Product Specification
Description Fig

Description

Remote
Control

Batteries for
Remote Control

User’s Manual

Parts No

AK59-00061E

Remark

Model Standard of
DVD-R150/XAC

Model Standard of
AC43-12002H

DVD-R150/XAC
S.N.A

AK68-01316A

Model Standard of
DVD-R150/XAC

Model Standard of
Quick Guide

AK68-01314A

DVD-R150/XAC
S.N.A

Video/Audio
Cable

Samsung Electronics

AC39-00073A

Model Standard of
DVD-R150/XAC

2-3

Product Specification

MEMO

2-4

Samsung Electronics

3. Software Update
3-1 Drive Firmware Update
3-1-1 Introduction
When you can not record and play on specific recording media (especially on newly available DVD-RW or DVD-R).

3-1-2 How to make an update disc
• Write the downloaded file onto a blank CD-R or CD-RW disc, using the following settings :
1) Download the software update file from the samsung internet site. (www.samsung.com)
2) Write the file to disc using the CD-RW of your computer.

NOTE
• Recommended Application Program
- Nero Burning / Easy CD Creator ..etc
• Option
- Extension name : “*.SMD”
- Multisession : No Multisession
- File name lenght : Max. of 11 = 8 + 3
- Character set : ISO 9660 or Joliet Format
- CD Close & Disc at once

WARNING
It is very important : please read the below notice below before updating your unit.
The following events may interrupt the update process and MAY RESULT IN PERMANENT DAMAGE TO THE UNIT WHILE UPDATING
! Unplugging the power cord.
@ Power Outage.
# Dirt or Scratches on the disc.
$ Opening a disc tray during processing.

Samsung Electronics

3-1

Software Update

1) Press OPEN/CLOSE to open the disc tray.
2) Insert the update CD-R disc with the software update, label
facing up.
3) Press OPEN/CLOSE to close the disc tray.
* It takes about 1~2 minites before the mesage below appears.

Fig. 3-2 Remote Control
Atfer checking old and new version, select “Yes” or “No”
with “ ” or “ ” on the remote control.
* The Version is indicated by “XX.X modelname”

Fig. 3-1
* If you don’t see the message above, try another disc. Generally, this is caused by disc quality and by disc creating problem.
4) Press the ENTER button on the remote control (Fig. 3-2).
You will see “LOAD” on FLT Display.

Fig.3-3
5) It takes about 1~2 minutes to complete the update.
The message below will be displayed in the screen after update is completed and the tray will open automatically.

Fig. 3-4

Fig. 3-5

6) After removing the update disc, turn off the unit with power button.
And there after turn on the unit with power button and then the will be closed.
The drive firmware is now completed.
3-2

Samsung Electronics

Software Update

3-2 Flash Update (Main PCB)
3-2-1 Introduction
When you encounter a problem which is not related to the DVD drive.

3-2-2 How to make an update disc
Write the downloaded file onto a blank CD-R or CD-RW disc, using the following settings :
1) Download the software update file from the samsung internet site. (www.samsung.com)
2) Write the file to disc using the CD-RW of your computer.

NOTE
• Recommended Application Program
- Nero Burning / Easy CD Creator ..etc
• Option
- Multisession : No Multisession
- CD close & disc at once
- ISO 9660 or joliet format
- Extension name : “*.RUF”
• In order to increase dise playability, add a dummy file (over 100MB) together with the latest program.
(The dummy file can be used any kind of file except MP3 file etc which can be played in the unit and we recommend to use a file whin
extension name as “*.dmy”, which can be changed from original one.)

WARNING
It is very important : please read the below notice below before updating your unit.
The followong events may interrupt the update process and MAY RESULT IN PERMANENT DAMAGE TO THE UNIT WHILE UPDATING
! Unplugging the power cord.
@ Power Outage.
# Dirt or Scratches on the disc.
$ Opening a disc tray during processing.

Samsung Electronics

3-3

Software Update

1) Press OPEN/CLOSE to open the disc tray.
2) Insert the update CD-R disc with the software update, label
facing up.
3) Press OPEN/CLOSE to close the disc tray.

Fig. 3-7 Remote Control
Atfer checking old and new version, select “Yes” or “No”
with “ ” or “ ” on the remote control.
* The Version is indicated by “YYMMDD.xx modelname”
Fig. 3-6
* If you don’t see the message above, try another disc.
Generally, this is caused by disc quality and by disc creating problem.
4) Press the ENTER button on the remote control (Fig. 3-7).

Fig. 3-8
5) It takes about 5 minutes to complete the update.
The message below will be displayed in the screen after update is completed and the tray will open automatically.

* If the message to the left isn’t displayed after 10minutes
and the unit is no longer functioning properly, contact a
samsung authorized service center.

Fig. 3-9
6) After removing the update disc, turn off the unit with power button.
And there after turn on the unit with power button and then the will be closed.
The Flash update is now completed.

3-4

Samsung Electronics

4. Disassembly and Reassembly
4-1 Cabinet and PCB
Note : Reassembly in reverse order.

4-1-1 Top Cabinet Removal
1) Remove 5 Screws Œ, ´, ˇ.
2) Lift up the Top Cabinet in direction of arrow.

´ 1 SCREW
(3 x 10 B)

Œ 3 SCREWS
(3 x 10 B)

CABINET

ˇ 1 SCREW
(3 x 10 B)

Fig. 4-1 Top Cabinet Removal

Samsung Electronics

4-1

Disassembly and Reaasembly

4-1-2 Ass’y Front-Cabinet Removal
1) Release 6 Hooks Œ, ´, ˇ, ¨ and Ass’y Front-Cabinet ˆ.

¨ 2 HOOKS

Œ 1 HOOK

´ 1 HOOK
ˇ 2 HOOKS

ˆ ASS’Y FRONT-CABINET

Fig. 4-2 Ass’y Front-Cabinet Removal

4-2

Samsung Electronics

Disassembly and Reaasembly

4-1-3 Ass’y Deck Removal
1) Remove 4 Screws Œ, ´ from the Ass’y Deck ˇ and lift it up.

Œ 2 SCREWS

´ 2 SCREWS

(3 x 8 W)

(3 x 10 W)

ˇ ASS’Y DECK

Fig. 4-3 Ass’y Deck Removal

Samsung Electronics

4-3

Disassembly and Reaasembly

4-1-4 Main PCB Removal
1) Remove 2 Screws Œ, from the Main PCB ´ and lift it up.

Œ 2 SCREWS
(3 x 10 W)

´ MAIN PCB

Fig. 4-4 Main PCB Removal

4-4

Samsung Electronics

Disassembly and Reaasembly

4-1-5 Jack PCB and Sub PCB Removal
1) Remove 5 Screws Œ, ´ from the Jack PCB ˇ and lift it up.
2) Remove 1 Screw ¨ from the Sub PCB ˆ and lift it up.

¨ 1 SCREW

Œ 4 SCREWS

(3 x 6 W)

(3 x 6 W)

ˆ SUB PCB

ˇ JACK PCB

´ 1 SCREW
(3 x 6 W)

Fig. 4-5 Jack PCB and Sub PCB Removal

Samsung Electronics

4-5

Disassembly and Reaasembly

4-2 PCB Location

MAIN PCB

SUB PCB

JACK PCB

Fig. 4-6 PCB Location

4-6

Samsung Electronics

5. Trouble Shooting

NO Power Detected
(Stand by LED OFF)

PAFT1 is normal?

No

Change fuse

Yes

PADT1~PADT4
SHORT and OPEN
Are normal?

No

Change short circuited or
opened parts

Yes

Is there voitage at
PQIZ1[Pin 5]?(Over 10V)

No

Change PQIZ1 IC.

Yes

Operation of PQIZ1 is
Normal?

No

Replace PQIZ1

Yes
Check feed back
PQIZ1[PIN 3] Is 5.8V

Samsung Electronics

5-1

Trouble Shooting

There's no Digital Audio Out

Check Current Digital Audio
Setting is PCM.

No

No

Set audio setting to
Bitstream in customer
menu.

Yes

Yes

ChecK Digital
AUDIO DATA at pin 24 of
CON2(MAIN PCB)

Check the A/V Receiver
can Decode Current
Bit-Steam

No

Replace Main PCB

Yes

Check 5V AVJ5

No

Replace AVJ5
IEC-958 (Pin24 of CON2)

Yes

Check the Cable

5-2

Samsung Electronics

Trouble Shooting

CVBS (Video) output error

PIN 12 of
CN3 of Jack PCB
or CN2 of Main PCB has
1V pk-pk level?

No

Check the DIC1 on MAIN PCB

Yes

Check pin7 of the
IC801 1V p-p level?

No

Check the connection between
12Pin in CN3 Of Jack PCB and IC801

Yes

Power is Normal(5v)
at IC801[pin24, 29]?

No

Check the connection between
IC801[pin24, 29] and Power line
(FL1, PPIF2).

Yes

Check pin25 of the
IC801 1V p-p level?

No

Check the connection between
IC801(Pin21,22) and IC601(Pin16,17).
Check IC801 peripheral circuit.

Yes

Video signal of
About P-P1V appears at
Output Jack?

No

Check the connection between
IC801 and output jack.

CVBS (Pin12 of CON2)
Yes

Check the RCA Cable

Samsung Electronics

5-3

Trouble Shooting

S-Video output error

Pin10 and
Pin8 in CN3 of Jack PCB or
CON2 of Main PCB has *
normal level?

No

Check the DIC1 on MAIN PCB

Yes

Analog signals are
Inputted normally
VIC1(pin4,2)

No

Check the connection between
Pin10 and Pin8 in CN3 Of JACK PCB
and VIC1

Yes

Power is
Normal(5v) at VIC1(pin1)?

No

Check the connection between
VIC1[pin1] and Power line (PPLI1,
PPII1).

Yes

Pin5 in VIC1 is
In high state?
Yes

Video signal of
About P-P1V appears at
Output Jack?
Yes

No

Check the connection between
VIC1(PIN5) and IC601(PIN89).
Check VIC1 peripheral circuit.

# Nomal level
: pin 10 is 1Vpk-pk
pin 8 is 0.28V on color burst
No

Check the connection between
VIC1 and output jack.

Y (Pin10 of Main CON2
Pin10 of Jack CN3)

C (Pin8 of Main CON2
Pin10 of Jack CN3)

Check the RCA cable

5-4

Samsung Electronics

Trouble Shooting

AV2 CVBS Video Input Error

Pin 28 In IC801
Has about p-p 1V level?

No

Check the connection between
Pin 28 in IC801 and L2 Pin-Jack.

No

Check Pin 24, 29 in IC801
of input power(5V).

Yes

Pin5 In IC801
Has about p-p 1V signal?
Yes

GCLK (Pin5 of Main VIC1)

A

Samsung Electronics

5-5

Trouble Shooting

AV1 CVBS Video Input Error

Pin 13 In IC801
Has about p-p 1V level?

No

Check the connection between
Pin 13 in IC801 and L1 Pin-Jack.

No

Check Pin 24, 29 in IC801
of input power(5V).

No

Check the connection between Pin 21 and
Pin 22 in IC801 and Pin 17 and 18 in IC601.

Yes

Pin 5 In IC801
Has about p-p 1V signal?
Yes
A

Check Pin21,22
in IC801 of input
SDL/SDA Data
Yes

Pin 7 in IC801
has about p-p 1V
Signal?

No
Check DVD Main PCB

Yes

Pin 25 in IC801
has about p-p 1V
Signal?
Yes

No

Check the IC801

CVBS_IN(Pin38 of Main VIC1)

No problem

5-6

Samsung Electronics

Trouble Shooting

AV1 S-Video Video Input Error

Pin 36 and 42
in VIC1 of DVD MainPCB has
*normal level?
Yes

Pin40 and pin
54~43 in VIC1 of DVD
Main PCB has Clock and Digital
Video Signal normal
form ?

Check the connection between
Pin 36 and 42 in VIC1 of DVD
Main PCB and L1 S-Video Jack.

No

# Nomal level
: pin 35 is 1Vpk-pk
pin 42 is 0.28V on color burst
No

Check VIC1 of DVD Main PCB
peripheral circuit.

Yes
Y_IN (Pin36 of Main VIC1)
Change DVD Main PCB

C_IN (Pin42 of Main VIC1)

Samsung Electronics

5-7

Trouble Shooting

Component output error

Pin2/4/6 in CN3 of
Jack PCB or CON2 of Main PCB
has * normal level?

No

Check the DIC1 on MAIN B/D.

Yes

Analog signals
are Inputted normally
VIC1(pin6/8/9)

No

Check the connection between
Pin2/4/6 in CN3 Of JACK PCB
and VIC1(pin6/8/9)

Yes

Power is
Normal(5v) at
VIC1(pin1)?

No

Check the connection between
VIC1[pin1] and Power line (PPLI1,PPII1).

Yes

Pin13 in VIC1 is
In high state?

No

Check the connection between
VIC1(PIN3) and IC601(PIN89).
Check VIC1 peripheral circuit.

Yes

Video signal of
About 1V pk-pk appears at
Output Jack?
Yes

Check the RCA cable
Y_out (Pin6 of Main CON2
Pin6 of Jack CN3)

5-8

No

Check the connection between
VIC1 and output jack.

# Nomal level
: pin 6 is 1Vpk-pk
pin 2/4 is + 0.35V
Pb_out (Pin4 of Main CON2
Pin4 of Jack CN3)

Pb_out (Pin2 of Main CON2
Pin2 of Jack CN3)

Samsung Electronics

Trouble Shooting

I2S_LRCK (Pin116 of DIC1)

Audio Input is not Recording

Check the select
signal pin21,22of IC801
(JACK PCB)

Check pin 17,18(5V) of the
Front Micom IC601 (JACK
PCB)

No

Yes
I2S_BCK (Pin117 of DIC1)
Check all the 12Vcc
pin 14 of IC801 and 12Vcc pin 8
of AIC4(JACK).

No

Check SMPS

Yes

Check the 5V pin5 of
DIC1 (MAIN PCB)

No

Replace Main PCB
I2S_MCK (Pin118 of DIC1)

Yes

Check Digital clock
and data pin 116,117,118,119 of
DIC1(MAIN PCB)

No

Replace Main PCB

Yes
I2S_DATA (Pin119 of DIC1)
Check the passive parts
around jack pin.

Samsung Electronics

5-9

Trouble Shooting

There is no Audio Output

Check he audio
signal AR413 and AR473
(JACK PCB)

No

Check the Low state pin22 of the
Front Micom IC601(Jack PCB)

Yes

Check all
the 5V pin6of AIC1
(MAIN PCB)

No

Check SMPS

Yes

Check the audio
signal pin7pin8 of AIC1
(MAIN PCB)

No

Replace Main PCB

Yes

Check digital clock
anddata pin1, 2, 3, 16 of AIC1
(MAIN PCB)
Yes

No

Replace MAIN PCB

Digital Audio Data (Pin2 of Main AIC1)

Check the passive parts
arond Jack pin.

5-10

Samsung Electronics

Trouble Shooting

Disc Ioading error

Are Main
and deck power OK?
(5v, 12v)

No

Check he power

Yes

Is the 40pin
FFC cable(betweenmain & deck)
inserted correctly?

No

Reinsert FFC cable correctly

Yes

Is the wavefrom
of DIC3 pin26 normal?
(MAIN PCB)
Yes

No

Change the Main board

DIC3-Pin26

Change the deck

Samsung Electronics

5-11

Trouble Shooting

Remocon Error

KRMC1(pin1) signal
is OK? (SMPS PCB)

No

Check the power(pin2) line
orchange KRMC1.

No

Check the signal line or surrounding
elements.

Yes

IC601(pin5) signal
is OK? (Jack PCB)
Yes
Change IC601 or
surrounding elements

5-12

Samsung Electronics

6. Exploded View and Parts List

6-1 Cabinet Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

Samsung Electronics

6-2

6-1

Exploded Views and Parts List

6-1 Cabinet Assembly
W001
W001

W009
C015
W001

P002
W275

W275

W200

W009

P022

H001

P005

W268
P025

C001

A001

W009
C002

P007

6-2

Samsung Electronics

Exploded Views and Parts List

Loc. No

Parts No.

A001
C001
C002
C015
H001
P002
P005
P007
P022
P025
W001
W009
W200
W268
W275

AK59-00061E
AK97-01889B
AK64-01928B
AK64-01896A
AK97-01883B
AK92-01381A
AK92-01326A
AK97-01947A
AK92-01373A
AC39-10200N
6003-000275
6003-000276
6003-001375
6003-000254
6003-001561

Samsung Electronics

Description ; Specification
REMOCON-ASSY;DVD-R150/XAX,SEC,197.5
ASSY-PANEL FRONT;HIPS94HB,DVD-R150/
DOOR-TRAY;DVD-R155,ABS 94HB,T2.5,H1
CABINET-TOP;DVD-R157/XAA,TM6524,T0.
ASSY-LOADER;-,DVD-R150,RAM Multi
ASSY PCB-MAIN DVD;DVD-R150/XAC,ASSY PCB-FUNCTION;DVD-R157/XAA,Func
ASSY-R157 KEY;-,R157/XAA,NEXUS
ASSY PCB-JACK I/O;DVD-R155/XAC,JACK
CBF-POWER CORD;AT,US,EP2/Y,HOUSING(
SCREW-TAPTITE;BH,+,-,B,M3,L10,ZPC(B
SCREW-TAPTITE;BH,+,-,B,M3,L10,ZPC(W
SCREW-TAPTITE;BH,+,-,B,M3,L8,ZPC(WH
SCREW-TAPTITE;BH,+,-,S,M3,L6,ZPC(WH
SCREW-TAPTITE;BH,+,-,B,M3,L6,ZPC(WH

Q ty S.N.A
1
1
1
1
1
1
1
1
1
1
5
8
2
1
5

Remark

SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA

6-3

Exploded Views and Parts List

MEMO

6-4

Samsung Electronics

7. Electrical Parts List
Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

P002
AC1
AC18
AE1
AE2

AK92-01381A
2203-005061
2203-005061
2402-001096
2402-000176

ASSY PCB-MAIN DVD;DVD-R150/XAC
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-AL,SMD;220UF,20%,16V,GP,TP,6
C-AL,SMD;10uF,20%,16V,GP,TP,4.

1
1
1
1
1

SA
SA
SA
SA
SA

AIC1
AL1
CC1
CC2
CC3

1002-001395
3301-001419
2203-005061
2203-005061
2203-005061

IC-D/A CONVERTER;PCM1753,24Bit
BEAD-SMD;220ohm,1608,TP,133ohm
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

CC4
CE1
CE3
CN5
CON1

2203-005061
2402-001248
2402-001059
3708-001935
3710-002445

C-CER,CHIP;100nF,+80-20%,16V,Y
C-AL,SMD;220UF,20%,6.3V,-,TP,6
C-AL,SMD;220•ÏF,20%,6.3V,-,TP,
CONNECTOR-FPC/FFC/PIC;40P,0.5m
SOCKET-BOARD TO BOARD;16P,2R,2

1
1
1
1
1

SA
SA
SA
SA
SA

CON2
CR1
CR10
CR11
CR12

3710-002075
2007-001323
2007-000140
2007-000140
2007-000171

SOCKET-BOARD TO BOARD;30P,2R,2
R-CHIP;3KOHM,5%,1/16W,TP,1005
R-CHIP;1Kohm,5%,1/16W,TP,1005
R-CHIP;1Kohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

CR2
CR3
CR4
DC1
DC15

2007-000138
2007-001320
2007-001325
2203-000386
2203-005138

R-CHIP;100ohm,5%,1/16W,TP,1005
R-CHIP;1.8Kohm,5%,1/16W,TP,100
R-CHIP;3.3Kohm,5%,1/16W,TP,100
C-CER,CHIP;0.015nF,5%,50V,C0G,
C-CER,CHIP;1.8nF,10%,50V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

DC16
DC17
DC18
DC2
DC20

2203-005138
2203-005138
2203-005138
2203-000330
2203-005061

C-CER,CHIP;1.8nF,10%,50V,X7R,1
C-CER,CHIP;1.8nF,10%,50V,X7R,1
C-CER,CHIP;1.8nF,10%,50V,X7R,1
C-CER,CHIP;0.012nF,5%,50V,C0G,
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

DC22
DC23
DC24
DC25
DC26

2203-005061
2203-005061
2203-005061
2203-005061
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

DC27
DC3
DC4
DC50
DC51

2203-005061
2203-005061
2203-005061
2203-005481
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;47nF,10%,10V,X7R,TP
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

DC52
DC53
DC54
DC56
DC57

2203-005061
2203-005061
2203-005061
2203-005061
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

DC58
DC59
DC6
DC60
DC61

2203-005061
2203-005061
2203-005061
2203-005061
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

DC62
DC63

2203-005061
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1

SA
SA

Samsung Electronics

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

DC64
DC65
DC66

2203-005061
2203-005061
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1

SA
SA
SA

DC67
DC68
DC69
DC7
DC70

2203-005061
2203-005061
2203-005061
2203-005061
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

DC71
DC72
DC73
DC74
DC75

2203-005061
2203-005061
2203-005061
2203-005061
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

DC76
DC77
DC78
DC79
DC8

2203-005061
2203-005061
2203-005061
2203-005061
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

DC80
DC81
DC82
DC83
DC84

2203-005061
2203-005061
2203-005061
2203-005061
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

DC85
DC86
DC89
DC90
DC91

2203-005061
2203-005061
2203-005061
2203-005061
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

DC92
DC93
DC94
DC95
DC96

2203-005061
2203-000311
2203-005061
2203-005061
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;0.12nF,5%,50V,C0G,1
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

DC97
DE2
DE5
DE7
DE8

2203-005061
2402-000007
2402-001248
2402-001248
2402-001248

C-CER,CHIP;100nF,+80-20%,16V,Y
C-AL,SMD;22uF,20%,6.3V,GP,TP,4
C-AL,SMD;220UF,20%,6.3V,-,TP,6
C-AL,SMD;220UF,20%,6.3V,-,TP,6
C-AL,SMD;220UF,20%,6.3V,-,TP,6

1
1
1
1
1

SA
SA
SA
SA
SA

DIC1
DIC2
DIC3
DIC5
DIC7

1205-002844
1105-001563
1107-001242
1103-001134
0801-002701

IC-CODEC;S5L3210,LQFP,256P,28x
IC-DRAM;HYB25D256160CE-6,16Mx1
IC-FLASH MEMORY;39VF160,1Mx16,
IC-EEPROM;24C040,512x8,SOP,8P,
IC-CMOS LOGIC;74VHCT125A,BUFFE

1
1
1
1
1

SA
SA
SNA
SA
SA

DIC8
DR1
DR2
DR3
DR30

0801-002166
2007-000174
2007-000143
2007-000143
2007-000143

IC-CMOS LOGIC;7SHU04,INVERTER,
R-CHIP;47ohm,5%,1/16W,TP,1005
R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;4.7Kohm,5%,1/16W,TP,100

1
1
1
1
1

SA
SA
SA
SA
SA

DR32
DR35
DR36

2007-000143
2007-000140
2007-000982

R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;1Kohm,5%,1/16W,TP,1005
R-CHIP;5.6Kohm,5%,1/16W,TP,100

1
1
1

SA
SA
SA

This Document can not be used without Samsung’s authorization

7-1

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

DR37
DR38

2007-000932
2007-000171

R-CHIP;470OHM,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005

1
1

SA
SA

DR39
DR40
DR41
DR42
DR43

2007-000162
2007-000143
2007-000138
2007-000138
2007-001298

R-CHIP;100Kohm,5%,1/16W,TP,100
R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;100ohm,5%,1/16W,TP,1005
R-CHIP;100ohm,5%,1/16W,TP,1005
R-CHIP;51ohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

DR44
DR47
DR48
DR49
DR5

2007-001298
2007-001298
2007-001298
2007-000148
2007-000143

R-CHIP;51ohm,5%,1/16W,TP,1005
R-CHIP;51ohm,5%,1/16W,TP,1005
R-CHIP;51ohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;4.7Kohm,5%,1/16W,TP,100

1
1
1
1
1

SA
SA
SA
SA
SA

DR50
DR51
DR52
DR55
DR6

2007-001292
2007-000659
2007-001323
2007-000138
2007-000143

R-CHIP;33ohm,5%,1/16W,TP,1005
R-CHIP;27ohm,5%,1/10W,TP,1608
R-CHIP;3KOHM,5%,1/16W,TP,1005
R-CHIP;100ohm,5%,1/16W,TP,1005
R-CHIP;4.7Kohm,5%,1/16W,TP,100

1
1
1
1
1

SA
SA
SA
SA
SA

DR64
DR65
DR66
DR67
DR68

2007-000171
2007-000171
2007-000171
2007-000171
2007-000171

R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

DR69
DR70
DR71
DR72
DR74

3301-001309
3301-001309
2007-000174
2007-000174
2007-000173

BEAD-SMD;47ohm,1608,TP,-,BEAD-SMD;47ohm,1608,TP,-,R-CHIP;47ohm,5%,1/16W,TP,1005
R-CHIP;47ohm,5%,1/16W,TP,1005
R-CHIP;22ohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

DR75
DR76
DR79
DR8
DR80

2007-000173
2007-000173
2007-000140
2007-000170
2007-000140

R-CHIP;22ohm,5%,1/16W,TP,1005
R-CHIP;22ohm,5%,1/16W,TP,1005
R-CHIP;1Kohm,5%,1/16W,TP,1005
R-CHIP;1Mohm,5%,1/16W,TP,1005
R-CHIP;1Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

DR82
DR83
DR87
DR88
DR89

2007-000143
2007-000143
2007-000143
2007-000143
2007-000143

R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;4.7Kohm,5%,1/16W,TP,100

1
1
1
1
1

SA
SA
SA
SA
SA

DR9
DR90
DR91
DR92
DR93

2007-000171
2007-000143
2007-000143
2007-000033
2007-000171

R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

DRP1
DRP10
DRP11
DRP12
DRP13

2011-001474
2011-001474
2011-001261
2011-001261
2011-001261

R-NETWORK;47ohm,5%,1/16W,L,CHI
R-NETWORK;47ohm,5%,1/16W,L,CHI
R-NET;33ohm,5%,1/16W,L,CHIP,8P
R-NET;33ohm,5%,1/16W,L,CHIP,8P
R-NET;33ohm,5%,1/16W,L,CHIP,8P

1
1
1
1
1

SA
SA
SA
SA
SA

DRP14
DRP15
DRP16
DRP17
DRP18

2011-001261
2011-001478
2011-001478
2011-001478
2011-001478

R-NET;33ohm,5%,1/16W,L,CHIP,8P
R-NETWORK;51ohm,5%,1/16W,L,CHI
R-NETWORK;51ohm,5%,1/16W,L,CHI
R-NETWORK;51ohm,5%,1/16W,L,CHI
R-NETWORK;51ohm,5%,1/16W,L,CHI

1
1
1
1
1

SA
SA
SA
SA
SA

DRP19 2011-001478
DRP2 2011-001474
DRP20 2011-001478

R-NETWORK;51ohm,5%,1/16W,L,CHI
R-NETWORK;47ohm,5%,1/16W,L,CHI
R-NETWORK;51ohm,5%,1/16W,L,CHI

1
1
1

SA
SA
SA

7-2

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

DRP21 2011-001478
DRP22 2011-001478

R-NETWORK;51ohm,5%,1/16W,L,CHI
R-NETWORK;51ohm,5%,1/16W,L,CHI

1
1

SA
SA

DRP23
DRP26
DRP27
DRP28
DRP29

2011-001478
2011-001396
2011-001396
2011-001396
2011-001396

R-NETWORK;51ohm,5%,1/16W,L,CHI
R-NET;4.7KOHM,5%,1/16W,L,CHIP,
R-NET;4.7KOHM,5%,1/16W,L,CHIP,
R-NET;4.7KOHM,5%,1/16W,L,CHIP,
R-NET;4.7KOHM,5%,1/16W,L,CHIP,

1
1
1
1
1

SA
SA
SA
SA
SA

DRP3
DRP4
DRP5
DRP6
DRP7

2011-001474
2011-001474
2011-001474
2011-001474
2011-001474

R-NETWORK;47ohm,5%,1/16W,L,CHI
R-NETWORK;47ohm,5%,1/16W,L,CHI
R-NETWORK;47ohm,5%,1/16W,L,CHI
R-NETWORK;47ohm,5%,1/16W,L,CHI
R-NETWORK;47ohm,5%,1/16W,L,CHI

1
1
1
1
1

SA
SA
SA
SA
SA

DRP9
RIC1
RIC2
TC1
TC16

2011-001474
1203-003996
1203-003806
2203-000552
2203-000278

R-NETWORK;47ohm,5%,1/16W,L,CHI
IC-POSI.FIXED REG.;KIA78R025F,
IC-POSI.ADJUST REG.;KIA78R000,
C-CER,CHIP;0.02nF,5%,50V,C0G,1
C-CER,CHIP;0.01nF,0.5pF,50V,C0

1
1
1
1
1

SA
SA
SA
SA
SA

TC2
TC3
TC4
TC5
TC6

2203-000552
2203-005061
2203-005642
2203-005061
2203-005061

C-CER,CHIP;0.02nF,5%,50V,C0G,1
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;0.22nF,5%,50V,NP0,1
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

TC7
TC8
TC9
TE1
TE2

2203-005061
2203-005061
2203-005061
2402-001238
2402-001248

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-AL,SMD;1uF,20%,50V,HR,TP,4.3
C-AL,SMD;220UF,20%,6.3V,-,TP,6

1
1
1
1
1

SA
SA
SA
SA
SA

TIC1
TR10
TR11
TR12
TR13

1205-001988
2007-000140
2007-000140
2007-000140
2007-000148

IC-DATA COMM./GEN.;TSB41AB1-PA
R-CHIP;1Kohm,5%,1/16W,TP,1005
R-CHIP;1Kohm,5%,1/16W,TP,1005
R-CHIP;1Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

TR14
TR15
TR16
TR17
TR19

2007-000140
2007-000140
2007-000148
2007-000145
2007-002970

R-CHIP;1Kohm,5%,1/16W,TP,1005
R-CHIP;1Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;6.2Kohm,5%,1/16W,TP,100
R-CHIP;56ohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

TR2
TR20
TR21
TR22
TR24

2007-000148
2007-002970
2007-002970
2007-002970
2007-000144

R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;56ohm,5%,1/16W,TP,1005
R-CHIP;56ohm,5%,1/16W,TP,1005
R-CHIP;56ohm,5%,1/16W,TP,1005
R-CHIP;5.1KOHM,5%,1/16W,TP,100

1
1
1
1
1

SA
SA
SA
SA
SA

TR25
TR26
TR27
TR28
TR29

3301-001419
2007-000140
3301-001419
3301-001419
3301-001419

BEAD-SMD;220ohm,1608,TP,133ohm
R-CHIP;1Kohm,5%,1/16W,TP,1005
BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm

1
1
1
1
1

SA
SA
SA
SA
SA

TR3
TR30
TR31
TR32
TR33

2007-001292
3301-001419
2007-000170
2007-000073
3301-001419

R-CHIP;33ohm,5%,1/16W,TP,1005
BEAD-SMD;220ohm,1608,TP,133ohm
R-CHIP;1Mohm,5%,1/16W,TP,1005
R-CHIP;91ohm,5%,1/10W,TP,1608
BEAD-SMD;220ohm,1608,TP,133ohm

1
1
1
1
1

SA
SA
SA
SA
SA

TR4
TR9

2007-001292
2007-000140

R-CHIP;33ohm,5%,1/16W,TP,1005
R-CHIP;1Kohm,5%,1/16W,TP,1005

1
1

SA
SA

This Document can not be used without Samsung’s authorization

Samsung Electronics

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

TY1
V29
VC1

2801-004021
2203-005061
2203-005061

CRYSTAL-SMD;24.576MHz,20ppm,28
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1

SA
SA
SA

VC11
VC12
VC13
VC15
VC16

2203-005061
2203-005061
2203-005061
2203-005061
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

VC17
VC18
VC2
VC20
VC21

2203-005061
2203-005061
2203-005061
2203-005061
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

VC22
VC23
VC24
VC25
VC26

2203-005061
2203-005061
2203-005061
2203-005061
2203-005061

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

VC27
VC28
VC5
VC6
VC7

2203-000278
2203-005061
2203-005061
2203-005061
2203-005061

C-CER,CHIP;0.01nF,0.5pF,50V,C0
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

VC8
VC9
VE3
VE4
VIC1

2203-005061
2203-005061
2402-001248
2402-001248
1204-002419

C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-AL,SMD;220UF,20%,6.3V,-,TP,6
C-AL,SMD;220UF,20%,6.3V,-,TP,6
IC-VIDEO DECODER;TW9906,TQFP,8

1
1
1
1
1

SA
SA
SA
SA
SA

VL1
VR14
VR15
VR16
VR2

2703-000398
3301-000314
2007-000137
2007-000137
2007-001292

INDUCTOR-SMD;10uH,10%,3225
BEAD-SMD;120ohm,1.6x0.8x0.8mm,
R-CHIP;2KOHM,5%,1/16W,TP,1005
R-CHIP;2KOHM,5%,1/16W,TP,1005
R-CHIP;33ohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

VR23
VR25
VRP3
VRP4
Y1

2007-000138
2007-000171
2011-001344
2011-001344
2801-004621

R-CHIP;100ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-NET;100ohm,5%,1/16W,L,CHIP,8
R-NET;100ohm,5%,1/16W,L,CHIP,8
CRYSTAL-SMD;27MHz,15ppm,-,14pF

1
1
1
1
1

SA
SA
SA
SA
SA

P005
AR722
AR740
AVIN2
AVIN2B

AK92-01326A
2001-000281
2001-000281
3722-002384
AK63-00307A

ASSY PCB-FUNCTION;DVD-R157/XAA
R-CARBON;100OHM,5%,1/8W,AA,TP,
R-CARBON;100OHM,5%,1/8W,AA,TP,
JACK-PIN;3P,SN/NI,YEL/WHT/RED,
GROUND-FRONT AV;DVD-R130,SUS,T

1
1
1
1
1

SA
SA
SA
SA
SA

CN7
ESD01
ESD02
ESD03
ESD04

3722-002383
0403-001083
0403-001083
0403-001083
0403-001083

JACK-IEEE1394;4P/1,AU,BLK,ANGL
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V

1
1
1
1
1

SA
SA
SA
SA
SA

ESD05
ESD06
ESD07
ESD08
ESD09

0403-001083
0403-001083
0403-001083
0403-001083
0403-001083

DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V

1
1
1
1
1

SA
SA
SA
SA
SA

Samsung Electronics

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

ESD10
ESD11
ESD12
ESD13
ESD14

0403-001083
0403-001083
0403-001083
0403-001083
0403-001083

DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V

1
1
1
1
1

SA
SA
SA
SA
SA

FCON4
FL615
JP36
LD61A
LD701

3708-001695
3809-001787
2007-000070
AK61-00531A
0601-001928

CONNECTOR-FPC/FFC/PIC;13P,1MM,
FFC CABLE-FLAT;30V,80C,115mm,1
R-CHIP;0ohm,5%,1/10W,TP,1608
HOLDER-LED;DVD-R145,ABS 94HB,T
LED;ROUND,BLUE,3mm,465nm,3.6x3

1
1
1
1
1

SA
SA
SA
SA
SA

PWR01
PWR02
QWR01
R720
SW711

2007-000124
2007-000078
0501-000398
2007-000098
3404-001261

R-CHIP;2.2Kohm,5%,1/10W,TP,160
R-CHIP;1Kohm,5%,1/10W,TP,1608
TR-SMALL SIGNAL;KSC945-Y,NPN,2
R-CHIP;56Kohm,5%,1/10W,TP,1608
SWITCH-TACT;15V DC,20mA,100gf,

1
1
1
1
1

SA
SA
SA
SA
SA

VR40

2001-000969

R-CARBON;75OHM,5%,1/8W,AA,TP,1

1

SA

P007
CN704
FL286
LD702
QWR01

AK97-01947A
3708-001803
3809-001667
0601-001587
0501-000398

ASSY-R157 KEY;-,R157/XAA,NEXUS
CONNECTOR-FPC/FFC/PIC;10P,1.25
FFC CABLE-FLAT;30V,80C,70mm,10
LED;ROUND,RED,3.1mm,635nm,3.8x
TR-SMALL SIGNAL;KSC945-Y,NPN,2

1
1
1
1
1

SA
SA
SA
SA
SA

SW703
SW705
SW706
SW707
SW708

3404-001182
3404-001182
3404-001182
3404-001182
3404-001182

SWITCH-TACT;DC12V,50MA,100GF,6
SWITCH-TACT;DC12V,50MA,100GF,6
SWITCH-TACT;DC12V,50MA,100GF,6
SWITCH-TACT;DC12V,50MA,100GF,6
SWITCH-TACT;DC12V,50MA,100GF,6

1
1
1
1
1

SA
SA
SA
SA
SA

SW709 3404-001182
SW710 3404-001182

SWITCH-TACT;DC12V,50MA,100GF,6
SWITCH-TACT;DC12V,50MA,100GF,6

1
1

SA
SA

P022
AC16
AC17
AC405
AC406

AK92-01373A
2203-000315
2203-000315
2203-005148
2203-005148

ASSY PCB-JACK I/O;DVD-R155/XAC
C-CER,CHIP;0.12nF,5%,50V,C0G,1
C-CER,CHIP;0.12nF,5%,50V,C0G,1
C-CER,CHIP;100nF,10%,16V,X7R,1
C-CER,CHIP;100nF,10%,16V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

AC407
AC408
AC409
AC410
AC413

2203-000125
2203-000125
2203-000315
2203-000315
2203-005148

C-CER,CHIP;1.2nF,10%,50V,X7R,T
C-CER,CHIP;1.2nF,10%,50V,X7R,T
C-CER,CHIP;0.12nF,5%,50V,C0G,1
C-CER,CHIP;0.12nF,5%,50V,C0G,1
C-CER,CHIP;100nF,10%,16V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

ACC2
ACC3
AD1
AD2
AD3

2203-000315
2203-000315
0407-000123
0407-000123
0407-000123

C-CER,CHIP;0.12nF,5%,50V,C0G,1
C-CER,CHIP;0.12nF,5%,50V,C0G,1
DIODE-ARRAY;DAN202K,80V,100mA,
DIODE-ARRAY;DAN202K,80V,100mA,
DIODE-ARRAY;DAN202K,80V,100mA,

1
1
1
1
1

SA
SA
SA
SA
SA

AE404
AE405
AE412
AE42
AE46

2401-003107
2401-003107
2401-002165
2401-000922
2401-000922

C-AL;47uF,20%,16V,GP,TP,5x7,5
C-AL;47uF,20%,16V,GP,TP,5x7,5
C-AL;100uF,20%,16V,GP,TP,6.3x7
C-AL;22uF,20%,16V,GP,TP,5x5,5
C-AL;22uF,20%,16V,GP,TP,5x5,5

1
1
1
1
1

SA
SA
SA
SA
SA

AIC4
AQ1

1201-000163
0501-000341

IC-OP AMP;4560,SOP,8P,173MIL,D
TR-SMALL SIGNAL;KSC1623-L,NPN,

1
1

SA
SA

This Document can not be used without Samsung’s authorization

7-3

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

AQ3
AQ4
AQ5

0501-000341
0504-000128
0504-000156

TR-SMALL SIGNAL;KSC1623-L,NPN,
TR-DIGITAL;-,NPN,200MW,22K/22K
TR-DIGITAL;KSR2103,PNP,200MW,2

1
1
1

SA
SA
SA

AQ51
AQ52
AQ6
AQ7
AR105

0504-000128
0504-000156
0504-000128
0504-000156
2001-000633

TR-DIGITAL;-,NPN,200MW,22K/22K
TR-DIGITAL;KSR2103,PNP,200MW,2
TR-DIGITAL;-,NPN,200MW,22K/22K
TR-DIGITAL;KSR2103,PNP,200MW,2
R-CARBON;30KOHM,5%,1/8W,AA,TP,

1
1
1
1
1

SA
SA
SA
SA
SA

AR106
AR107
AR108
AR26
AR4

2001-000633
2007-000129
2007-000129
2001-000429
2007-000090

R-CARBON;30KOHM,5%,1/8W,AA,TP,
R-CHIP;27Kohm,5%,1/10W,TP,1608
R-CHIP;27Kohm,5%,1/10W,TP,1608
R-CARBON;1KOHM,5%,1/8W,AA,TP,1
R-CHIP;10Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

AR40
AR403
AR404
AR407
AR408

2001-000429
2007-001010
2007-001010
2007-001010
2001-000837

R-CARBON;1KOHM,5%,1/8W,AA,TP,1
R-CHIP;51Kohm,5%,1/10W,TP,1608
R-CHIP;51Kohm,5%,1/10W,TP,1608
R-CHIP;51Kohm,5%,1/10W,TP,1608
R-CARBON;51KOHM,5%,1/8W,AA,TP,

1
1
1
1
1

SA
SA
SA
SA
SA

AR409
AR410
AR412
AR413
AR414

2007-000092
2007-000092
2007-000090
2007-000075
2007-000075

R-CHIP;15Kohm,5%,1/10W,TP,1608
R-CHIP;15Kohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;220ohm,5%,1/10W,TP,1608
R-CHIP;220ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

AR415
AR420
AR421
AR460
AR461

2007-000075
2007-000122
2007-000090
2007-000122
2001-000290

R-CHIP;220ohm,5%,1/10W,TP,1608
R-CHIP;1.2Kohm,5%,1/10W,TP,160
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;1.2Kohm,5%,1/10W,TP,160
R-CARBON;10KOHM,5%,1/8W,AA,TP,

1
1
1
1
1

SA
SA
SA
SA
SA

AR471
AR472
AR473
AR474
AR475

2007-000070
2001-000290
2007-000075
2007-000075
2007-000075

R-CHIP;0ohm,5%,1/10W,TP,1608
R-CARBON;10KOHM,5%,1/8W,AA,TP,
R-CHIP;220ohm,5%,1/10W,TP,1608
R-CHIP;220ohm,5%,1/10W,TP,1608
R-CHIP;220ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

AR476
AR477
AR5
AR725
AR734

2007-000078
2007-000078
2007-000090
2007-000074
2007-000074

R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;100ohm,5%,1/10W,TP,1608
R-CHIP;100ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

AR735
AVJ1
AVJ2
AVJ5
BD05

2007-001167
3722-002449
3722-002450
3707-001070
3301-001419

R-CHIP;75ohm,5%,1/10W,TP,1608
JACK-PIN;6P+VHS,Ni/Sn,RD-BU-GN
JACK-PIN;6P+VHS,Ni/Sn,RD-WH-YL
CONNECTOR-OPTICAL;PLUG,GP1FA55
BEAD-SMD;220ohm,1608,TP,133ohm

1
1
1
1
1

SA
SA
SA
SA
SA

BD06
BD07
BD08
BD21
BD22

3301-001419
3301-001419
3301-001419
2007-000070
2007-000070

BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

BD23 2007-000070
BD24 2007-000070
C4M17A 2203-000323
C4M18A 2203-000357
C4M19A 2203-000681

R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
C-CER,CHIP;12nF,10%,50V,X7R,TP
C-CER,CHIP;0.15nF,5%,50V,C0G,1
C-CER,CHIP;0.027nF,5%,50V,C0G,

1
1
1
1
1

SA
SA
SA
SA
SA

C603
C616

C-CER,CHIP;1000nF,+80-20%,10V,
C-CER,CHIP;100nF,10%,16V,X7R,1

1
1

SA
SA

7-4

2203-005065
2203-005148

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

C617
C618
C619

2401-003107
2203-000426
2203-000426

C-AL;47uF,20%,16V,GP,TP,5x7,5
C-CER,CHIP;0.018nF,5%,50V,C0G,
C-CER,CHIP;0.018nF,5%,50V,C0G,

1
1
1

SA
SA
SA

C620
C621
C622
C623
C626

2203-000626
2203-000626
2203-005065
2203-000236
2203-005148

C-CER,CHIP;0.022nF,5%,50V,C0G,
C-CER,CHIP;0.022nF,5%,50V,C0G,
C-CER,CHIP;1000nF,+80-20%,10V,
C-CER,CHIP;0.1nF,5%,50V,C0G,16
C-CER,CHIP;100nF,10%,16V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

C627
C628
C629
C630
C631

2203-001697
2401-002069
2203-005221
2401-002165
2203-000257

C-CER,CHIP;0.082nF,5%,50V,NP0,
C-AL;33uF,20%,16V,GP,TP,6.3x5,
C-CER,CHIP;15nF,10%,50V,X7R,16
C-AL;100uF,20%,16V,GP,TP,6.3x7
C-CER,CHIP;10nF,10%,50V,X7R,16

1
1
1
1
1

SA
SA
SA
SA
SA

C635
C636
C637
C647
C651

2203-000257
2203-005148
2401-002165
2203-000681
2202-000216

C-CER,CHIP;10nF,10%,50V,X7R,16
C-CER,CHIP;100nF,10%,16V,X7R,1
C-AL;100uF,20%,16V,GP,TP,6.3x7
C-CER,CHIP;0.027nF,5%,50V,C0G,
C-CERAMIC,MLC-AXIAL;0.027NF,5%

1
1
1
1
1

SA
SA
SA
SA
SA

C652
C658
C701
C702
C703

2203-000681
2203-001683
2401-000118
2203-000257
2203-000257

C-CER,CHIP;0.027nF,5%,50V,C0G,
C-CER,CHIP;0.068nF,5%,50V,NP0,
C-AL;1000uF,20%,10V,GP,TP,10x1
C-CER,CHIP;10nF,10%,50V,X7R,16
C-CER,CHIP;10nF,10%,50V,X7R,16

1
1
1
1
1

SA
SA
SA
SA
SA

C704
C707
C708
C801
C802

2401-000240
2203-000257
2401-000118
2203-000972
2401-001915

C-AL;100uF,20%,10V,GP,TP,5x11,
C-CER,CHIP;10nF,10%,50V,X7R,16
C-AL;1000uF,20%,10V,GP,TP,10x1
C-CER,CHIP;47nF,10%,16V,X7R,16
C-AL;1uF,20%,50V,GP,TP,3x5,5

1
1
1
1
1

SA
SA
SA
SA
SA

C803
C804
C805
C806
C807

2401-004136
2203-005148
2401-002165
2203-005148
2401-003107

C-AL;100uF,°æ20%,16V,WT,TP,8X5
C-CER,CHIP;100nF,10%,16V,X7R,1
C-AL;100uF,20%,16V,GP,TP,6.3x7
C-CER,CHIP;100nF,10%,16V,X7R,1
C-AL;47uF,20%,16V,GP,TP,5x7,5

1
1
1
1
1

SA
SA
SA
SA
SA

C808
C809
C810
C811
C812

2401-003107
2401-003107
2401-003645
2401-003645
2401-000414

C-AL;47uF,20%,16V,GP,TP,5x7,5
C-AL;47uF,20%,16V,GP,TP,5x7,5
C-AL;1UF,20%,50V,WT,TP,4X5MM,5
C-AL;1UF,20%,50V,WT,TP,4X5MM,5
C-AL;10uF,20%,16V,GP,TP,4x7,5

1
1
1
1
1

SA
SA
SA
SA
SA

C813
C814
C815
C816
C817

2401-000414
2401-000414
2401-003645
2401-003645
2401-003645

C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;1UF,20%,50V,WT,TP,4X5MM,5
C-AL;1UF,20%,50V,WT,TP,4X5MM,5
C-AL;1UF,20%,50V,WT,TP,4X5MM,5

1
1
1
1
1

SA
SA
SA
SA
SA

C818
C819
C820
C821
C822

2401-003645
2401-003645
2401-003645
2401-000665
2401-000665

C-AL;1UF,20%,50V,WT,TP,4X5MM,5
C-AL;1UF,20%,50V,WT,TP,4X5MM,5
C-AL;1UF,20%,50V,WT,TP,4X5MM,5
C-AL;2.2uF,20%,50V,GP,TP,3.5x5
C-AL;2.2uF,20%,50V,GP,TP,3.5x5

1
1
1
1
1

SA
SA
SA
SA
SA

C824
C825
CN3
CN4
CVL1

2401-000665
2401-000665
3711-005563
3711-006319
3301-001419

C-AL;2.2uF,20%,50V,GP,TP,3.5x5
C-AL;2.2uF,20%,50V,GP,TP,3.5x5
HEADER-BOARD TO BOARD;BOX,30P,
HEADER-BOARD TO BOARD;BOX,16P,
BEAD-SMD;220ohm,1608,TP,133ohm

1
1
1
1
1

SA
SA
SA
SA
SA

CVL2

3301-001419

BEAD-SMD;220ohm,1608,TP,133ohm

1

SA

This Document can not be used without Samsung’s authorization

Samsung Electronics

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

CVL3
D702
D703
D704

3301-001419
0401-000005
0401-000005
0401-000005

BEAD-SMD;220ohm,1608,TP,133ohm
DIODE-SWITCHING;1N4148,75V,150
DIODE-SWITCHING;1N4148,75V,150
DIODE-SWITCHING;1N4148,75V,150

1
1
1
1

SA
SA
SA
SA

D705
D719
D720
DAR01
DOC3

0401-000005
0402-001533
0402-000165
2007-000070
2203-005148

DIODE-SWITCHING;1N4148,75V,150
DIODE-RECTIFIER;1N5408,1000V,3
DIODE-RECTIFIER;1N5819,40V,1A,
R-CHIP;0ohm,5%,1/10W,TP,1608
C-CER,CHIP;100nF,10%,16V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

DOC4
DOC5
DOE1
DOL2
DOL3

2203-005148
2203-000998
2401-001915
3301-001419
2701-000114

C-CER,CHIP;100nF,10%,16V,X7R,1
C-CER,CHIP;0.047nF,5%,50V,C0G,
C-AL;1uF,20%,50V,GP,TP,3x5,5
BEAD-SMD;220ohm,1608,TP,133ohm
INDUCTOR-AXIAL;10UH,10%,2534

1
1
1
1
1

SA
SA
SA
SA
SA

DOR1
DOR2
DOR3
DT701
FC10

2007-000040
2007-000074
2007-000075
AK07-00063A
2203-000257

R-CHIP;150ohm,1%,1/10W,TP,1608
R-CHIP;100ohm,5%,1/10W,TP,1608
R-CHIP;220ohm,5%,1/10W,TP,1608
LED DISPLAY;BCD-9051A,DVD-R155
C-CER,CHIP;10nF,10%,50V,X7R,16

1
1
1
1
1

SA
SA
SA
SA
SA

FC12
FCON1
FCON3
FD2
FD3

2203-005148
3708-001802
3708-001695
0402-000165
0402-000165

C-CER,CHIP;100nF,10%,16V,X7R,1
CONNECTOR-FPC/FFC/PIC;10P,1.25
CONNECTOR-FPC/FFC/PIC;13P,1MM,
DIODE-RECTIFIER;1N5819,40V,1A,
DIODE-RECTIFIER;1N5819,40V,1A,

1
1
1
1
1

SA
SA
SA
SA
SA

FD4
FD7
FDJ1
FDJ2
FE4

0401-000005
0402-000165
0402-000165
0402-000165
2401-002165

DIODE-SWITCHING;1N4148,75V,150
DIODE-RECTIFIER;1N5819,40V,1A,
DIODE-RECTIFIER;1N5819,40V,1A,
DIODE-RECTIFIER;1N5819,40V,1A,
C-AL;100uF,20%,16V,GP,TP,6.3x7

1
1
1
1
1

SA
SA
SA
SA
SA

FE5
FIC5
FL2
FL3
FR24

2401-001992
AC14-12009W
2701-000181
2701-000181
2007-000100

C-AL;2200UF,20%,10V,WT,TP,10X2
IC-RESET;PST572K,TO-92,R59-176
INDUCTOR-AXIAL;33uH,5%,2434
INDUCTOR-AXIAL;33uH,5%,2434
R-CHIP;68Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

FR25
IC603
IC604
IC701
IC801

2007-000503
1103-001134
1204-002509
1003-001561
1204-001763

R-CHIP;2.2ohm,5%,1/10W,TP,1608
IC-EEPROM;24C040,512x8,SOP,8P,
IC-SIGNAL PROCESSOR;CXA2207N,S
IC-LED DRIVER;PT6961,SOP,32P,3
IC-AUDIO PROCESSOR;LA73024V,SS

1
1
1
1
1

SA
SA
SA
SA
SA

JPS07
KRMC1
L701
L801
L802

2701-000002
0609-001225
2701-000002
2701-000002
2701-000002

INDUCTOR-AXIAL;100UH,10%,4298
MODULE REMOCON;VERTICAL,3.6mm,
INDUCTOR-AXIAL;100UH,10%,4298
INDUCTOR-AXIAL;100UH,10%,4298
INDUCTOR-AXIAL;100UH,10%,4298

1
1
1
1
1

SA
SA
SA
SA
SA

ME01
PACT1
PACT2
PADT1
PADT2

2401-003499
2301-001792
2301-001792
0402-001196
0402-001196

C-AL;330uF,20%,16V,LZ,TP,8x11.
C-FILM,LEAD;150nF,20%,275V,BK,
C-FILM,LEAD;150nF,20%,275V,BK,
DIODE-RECTIFIER;1T5,600V,1A,TS
DIODE-RECTIFIER;1T5,600V,1A,TS

1
1
1
1
1

SA
SA
SA
SA
SA

PADT3
PADT4
PAFT1
PALT2
PART1

0402-001196
0402-001196
3601-000244
AC29-00003A
2002-000121

DIODE-RECTIFIER;1T5,600V,1A,TS
DIODE-RECTIFIER;1T5,600V,1A,TS
FUSE-CARTRIDGE;250V,2A,SLOW-BL
FILTER LINE NOISE;-,20mH MIN,R-COMPOSITION;1Mohm,10%,1/2W,A

1
1
1
1
1

SA
SA
SC
SA
SA

VARISTOR;470V,2500A,17.5x7.5mm

1

SA

PAVV1 1405-000186

Samsung Electronics

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

PAVV2
PAWT1
PBCU1
PBCU2

1405-001026
3711-000203
2201-002044
2201-002044

VARISTOR;470V,600A,9x7mm,TP
HEADER-BOARD TO CABLE;1WALL,2P
C-CERAMIC,DISC;0.1NF,10%,400V,
C-CERAMIC,DISC;0.1NF,10%,400V,

1
1
1
1

SA
SA
SA
SA

PBCU3
PBCU4
PBIZ1
PDCZ1
PFCF1

2201-000828
2201-000828
0604-001028
2301-001654
2301-000129

C-CERAMIC,DISC;3.3NF,20%,400V,
C-CERAMIC,DISC;3.3NF,20%,400V,
PHOTO-COUPLER;TR,50-600%,250mW
C-FILM,LEAD-PEF;1000nF,5%,100V
C-FILM,LEAD-PEF;100nF,5%,50V,T

1
1
1
1
1

SA
SA
SA
SA
SA

PFCZ1
PFID1
PFRF1
PFRF2
PFRF3

2307-000104
AC14-12006D
2001-000780
2001-000221
2001-000429

C-FILM,LEAD-PCF;10nF,5%,50V,TP
IC;KA431Z,TO-92,TAPING
R-CARBON;470OHM,5%,1/8W,AA,TP,
R-CARBON;1.2KOHM,5%,1/8W,AA,TP
R-CARBON;1KOHM,5%,1/8W,AA,TP,1

1
1
1
1
1

SA
SA
SA
SA
SA

PFRF4
PFRF5
PFRF6
PFRZ1
PLCZ1

2001-000674
2004-000459
2004-000459
2001-000429
2301-000129

R-CARBON;360OHM,5%,1/8W,AA,TP,
R-METAL;2.2Kohm,1%,1/8W,AA,TP,
R-METAL;2.2Kohm,1%,1/8W,AA,TP,
R-CARBON;1KOHM,5%,1/8W,AA,TP,1
C-FILM,LEAD-PEF;100nF,5%,50V,T

1
1
1
1
1

SA
SA
SA
SA
SA

PLRU1
PLRZ1
PPCD1
PPCD2
PPCF1

1404-001361
2003-000105
2401-003480
2401-001479
2401-003480

THERMISTOR-NTC;3ohm,4A,-,35mW/
R-METAL OXIDE;0.33ohm,5%,2W,AD
C-AL;1000UF,20%,10V,LZ,TP,10X1
C-AL;470uF,20%,10V,GP,TP,6.3*1
C-AL;1000UF,20%,10V,LZ,TP,10X1

1
1
1
1
1

SA
SA
SA
SA
SA

PPCF2
PPCF3
PPCF4
PPCF7
PPCF8

2401-003480
2401-001479
2401-001250
2401-001479
2401-002165

C-AL;1000UF,20%,10V,LZ,TP,10X1
C-AL;470uF,20%,10V,GP,TP,6.3*1
C-AL;4.7uF,20%,35V,GP,TP,4x5,5
C-AL;470uF,20%,10V,GP,TP,6.3*1
C-AL;100uF,20%,16V,GP,TP,6.3x7

1
1
1
1
1

SA
SA
SA
SA
SA

PPCI1
PPCI2
PPCI3
PPCO1
PPCO2

2401-001126
2401-001126
2401-003499
2401-000385
2401-002300

C-AL;330uF,20%,25V,WT,TP,10x12
C-AL;330uF,20%,25V,WT,TP,10x12
C-AL;330uF,20%,16V,LZ,TP,8x11.
C-AL;10uF,20%,100V,GP,TP,6.3x1
C-AL;47•ÏF,20%,50V,GP,TP,6.3x1

1
1
1
1
1

SA
SA
SA
SC
SA

PPDD1
PPDD2
PPDF10
PPDF2
PPDF3

0404-001235
0401-000005
0404-001235
0404-001235
0402-001533

DIODE-SCHOTTKY;SHK65-45R,60V,3
DIODE-SWITCHING;1N4148,75V,150
DIODE-SCHOTTKY;SHK65-45R,60V,3
DIODE-SCHOTTKY;SHK65-45R,60V,3
DIODE-RECTIFIER;1N5408,1000V,3

1
1
1
1
1

SA
SA
SA
SA
SA

PPDI1
PPDO1
PPID1
PPIF2
PPII1

0402-001624
0402-000012
1203-003216
1203-001589
1203-002183

DIODE-RECTIFIER;SF26,400V,2A,D
DIODE-RECTIFIER;UF4007,1KV,1A,
IC-POSI.FIXED REG.;G9133,TO-22
IC-POSI.FIXED REG.;278R05,TO-2
IC-SWITCH VOL. REG.;278R12,TO-

1
1
1
1
1

SA
SA
SA
SA
SA

PPLD1
PPLF1
PPLI1
PPRD1
PPRF2

AC27-12001N
AH27-00039A
AC27-12001N
2003-000148
2001-000429

COIL CHOKE;10UH-15%,RA,K-30,Q8
COIL CHOKE;DR CHOKE(8*6),DVD-R
COIL CHOKE;10UH-15%,RA,K-30,Q8
R-METAL OXIDE;100ohm,5%,2W,AE,
R-CARBON;1KOHM,5%,1/8W,AA,TP,1

1
1
1
1
1

SA
SA
SA
SC
SA

PPRF4
PPRF6
PPRO1
PPZO1
PQIZ1

2007-000078
2007-000078
2001-000062
0403-000390
1203-003883

R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CARBON;470OHM,5%,1/4W,AA,TP,
DIODE-ZENER;UZP33B,31.4-34.6V,
IC-PWM CONTROLLER;3B2065P-2,TO

1
1
1
1
1

SA
SA
SA
SA
SA

This Document can not be used without Samsung’s authorization

7-5

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

PQTZ1
PRCU1
PSCX1
PSCZ2
PSDZ1

AC26-00014K
2401-003024
2305-001029
2201-000129
0402-000012

TRANS SWITCHING-RAM RECORDER;E
C-AL;220uF,20%,200V,WT,BK,22x3
C-FILM,LEAD-PEF;10nF,10%,630V,
C-CERAMIC,DISC;0.1nF,10%,1000V
DIODE-RECTIFIER;UF4007,1KV,1A,

1
1
1
1
1

SA
SA
SA
SA
SA

PSRZ1
PSRZ2
PVCL1
PVDL1
PVRL4

2003-000994
2003-000994
2401-002608
0402-001195
2001-000793

R-METAL OXIDE(S);33Kohm,5%,2W,
R-METAL OXIDE(S);33Kohm,5%,2W,
C-AL;33uF,20%,35V,GP,TP,5x11,5
DIODE-RECTIFIER;F1T4,400V,1A,D
R-CARBON;47OHM,5%,1/8W,AA,TP,1

1
1
1
1
1

SA
SA
SA
SA
SA

PVZL1
PWR09
PWR10
PZWZ1
Q4M01

0403-000713
2007-000119
2007-000078
3711-004379
0501-000398

DIODE-ZENER;MTZJ20B,18.63-17.7
R-CHIP;560ohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
HEADER-BOARD TO CABLE;BOX,4P,1
TR-SMALL SIGNAL;KSC945-Y,NPN,2

1
1
1
1
1

SA
SA
SA
SA
SA

Q4M02
R4M06
R4M07
R4M08
R4M09

0501-000398
2007-000090
2007-000084
2007-000124
2007-000084

TR-SMALL SIGNAL;KSC945-Y,NPN,2
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;4.7Kohm,5%,1/10W,TP,160
R-CHIP;2.2Kohm,5%,1/10W,TP,160
R-CHIP;4.7Kohm,5%,1/10W,TP,160

1
1
1
1
1

SA
SA
SA
SA
SA

R4M10
R4M20
R611
R621
R622

2007-000965
2007-000070
2007-000074
2001-000780
2001-000780

R-CHIP;5.1Kohm,5%,1/10W,TP,160
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;100ohm,5%,1/10W,TP,1608
R-CARBON;470OHM,5%,1/8W,AA,TP,
R-CARBON;470OHM,5%,1/8W,AA,TP,

1
1
1
1
1

SA
SA
SA
SA
SA

R623
R624
R633
R638
R639

2007-000084
2007-000084
2007-000106
2007-000082
2007-000081

R-CHIP;4.7Kohm,5%,1/10W,TP,160
R-CHIP;4.7Kohm,5%,1/10W,TP,160
R-CHIP;220Kohm,5%,1/10W,TP,160
R-CHIP;3.3Kohm,5%,1/10W,TP,160
R-CHIP;2.7Kohm,5%,1/10W,TP,160

1
1
1
1
1

SA
SA
SA
SA
SA

R652
R653
R656
R666
R667

2007-000090
2007-000078
2007-000090
2001-000281
2001-000281

R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CARBON;100OHM,5%,1/8W,AA,TP,
R-CARBON;100OHM,5%,1/8W,AA,TP,

1
1
1
1
1

SA
SA
SA
SA
SA

R668
R670
R673
R674
R676

2001-000429
2007-000074
2007-000078
2007-000078
2007-000078

R-CARBON;1KOHM,5%,1/8W,AA,TP,1
R-CHIP;100ohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R677
R678
R680
R6A01
R6A02

2001-000429
2001-000281
2001-000472
2007-000090
2007-000090

R-CARBON;1KOHM,5%,1/8W,AA,TP,1
R-CARBON;100OHM,5%,1/8W,AA,TP,
R-CARBON;2.7KOHM,5%,1/8W,AA,TP
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R6A04
R6A05
R6A10
R701
R702

2007-000078
2007-000078
2001-000273
2007-001010
2007-000078

R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CARBON;100KOHM,5%,1/8W,AA,TP
R-CHIP;51Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R703
R704
R705
R706
R707

2007-000078
2007-000078
2007-000078
2007-000078
2007-000078

R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

7-6

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

R708
R711
R7K1
R7K2
R7K3

2007-000078
2007-000090
2007-000092
2007-000092
2007-000092

R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;10Kohm,5%,1/10W,TP,1608
R-CHIP;15Kohm,5%,1/10W,TP,1608
R-CHIP;15Kohm,5%,1/10W,TP,1608
R-CHIP;15Kohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

R801
R802
R803
R804
R805

2007-001164
2007-001164
2001-000429
2001-000429
2001-000281

R-CHIP;75ohm,1%,1/10W,TP,1608
R-CHIP;75ohm,1%,1/10W,TP,1608
R-CARBON;1KOHM,5%,1/8W,AA,TP,1
R-CARBON;1KOHM,5%,1/8W,AA,TP,1
R-CARBON;100OHM,5%,1/8W,AA,TP,

1
1
1
1
1

SA
SA
SA
SA
SA

R806
R807
R808
R809
R810

2001-000281
2007-000083
2007-000083
2007-000079
2007-000079

R-CARBON;100OHM,5%,1/8W,AA,TP,
R-CHIP;3Kohm,5%,1/10W,TP,1608
R-CHIP;3Kohm,5%,1/10W,TP,1608
R-CHIP;1.8Kohm,5%,1/10W,TP,160
R-CHIP;1.8Kohm,5%,1/10W,TP,160

1
1
1
1
1

SA
SA
SA
SA
SA

R811
R812
R813
R814
RA606

2007-000078
2007-000078
2001-000429
2001-000429
2001-000281

R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/10W,TP,1608
R-CARBON;1KOHM,5%,1/8W,AA,TP,1
R-CARBON;1KOHM,5%,1/8W,AA,TP,1
R-CARBON;100OHM,5%,1/8W,AA,TP,

1
1
1
1
1

SA
SA
SA
SA
SA

SVL2
SVLA
SW701
SW702
TC1

3301-001419
3301-001419
3404-001182
3404-001261
2401-004014

BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm
SWITCH-TACT;DC12V,50MA,100GF,6
SWITCH-TACT;15V DC,20mA,100gf,
C-AL;4.7•ÏF,20%,16V,NP,TP,4x5,

1
1
1
1
1

SA
SA
SA
SA
SA

TC10
TC11
TC12
TC13
TC14

2401-001915
2401-004014
2202-000253
2401-000414
2401-002165

C-AL;1uF,20%,50V,GP,TP,3x5,5
C-AL;4.7•ÏF,20%,16V,NP,TP,4x5,
C-CERAMIC,MLC-AXIAL;4.7nF,20%,
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;100uF,20%,16V,GP,TP,6.3x7

1
1
1
1
1

SA
SA
SA
SA
SA

TC15
TC16
TC17
TC19
TC2

2401-001250
2401-001250
2203-001652
2203-001662
2203-000531

C-AL;4.7uF,20%,35V,GP,TP,4x5,5
C-AL;4.7uF,20%,35V,GP,TP,4x5,5
C-CER,CHIP;470nF,+80-20%,16V,Y
C-CER,CHIP;5.6nF,10%,50V,X7R,1
C-CER,CHIP;2.7nF,10%,50V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

TC20
TC21
TC22
TC3
TC4

2203-005148
2203-000257
2203-005148
2203-000972
2401-001249

C-CER,CHIP;100nF,10%,16V,X7R,1
C-CER,CHIP;10nF,10%,50V,X7R,16
C-CER,CHIP;100nF,10%,16V,X7R,1
C-CER,CHIP;47nF,10%,16V,X7R,16
C-AL;4.7uF,20%,35V,GP,TP,4x5,2

1
1
1
1
1

SA
SA
SA
SA
SA

TC5
TC6
TC74
TC9
TE12

2401-001020
2401-004014
2203-005148
2401-000414
2401-001250

C-AL;3.3UF,20%,50V,GP,TP,4X7,5
C-AL;4.7•ÏF,20%,16V,NP,TP,4x5,
C-CER,CHIP;100nF,10%,16V,X7R,1
C-AL;10uF,20%,16V,GP,TP,4x7,5
C-AL;4.7uF,20%,35V,GP,TP,4x5,5

1
1
1
1
1

SA
SA
SA
SA
SA

TE8
TM1
TR1
TR10
TR2

2401-002165
AK40-00019A
2007-000082
2007-000121
2007-000842

C-AL;100uF,20%,16V,GP,TP,6.3x7
TM BLOCK;VRA05ASE,NTSC,181CH,R-CHIP;3.3Kohm,5%,1/10W,TP,160
R-CHIP;820ohm,5%,1/10W,TP,1608
R-CHIP;3Kohm,1%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

TR3
TR4
TR5
TR6
TR7

2007-000125
2007-001125
2007-000109
2007-000102
2007-000075

R-CHIP;3.9Kohm,5%,1/10W,TP,160
R-CHIP;68Kohm,1%,1/10W,TP,1608
R-CHIP;1Mohm,5%,1/10W,TP,1608
R-CHIP;100Kohm,5%,1/10W,TP,160
R-CHIP;220ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

This Document can not be used without Samsung’s authorization

Samsung Electronics

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

TR8
TR9
VC10
VC17
VC6

2007-000075
2007-000121
2203-000440
2203-005148
2203-005148

R-CHIP;220ohm,5%,1/10W,TP,1608
R-CHIP;820ohm,5%,1/10W,TP,1608
C-CER,CHIP;1nF,10%,50V,X7R,160
C-CER,CHIP;100nF,10%,16V,X7R,1
C-CER,CHIP;100nF,10%,16V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

VC7
VC8
VC9
VDR1
VDR2

2202-000797
2202-002037
2202-002037
2007-001164
2007-001164

C-CERAMIC,MLC-AXIAL;10NF,30%,1
C-CERAMIC,MLC-AXIAL;100nF,80-2
C-CERAMIC,MLC-AXIAL;100nF,80-2
R-CHIP;75ohm,1%,1/10W,TP,1608
R-CHIP;75ohm,1%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

VDR3
VDR4
VDR5
VDR6
VDR7

2007-001131
2007-001164
2007-001164
2007-001164
2007-000879

R-CHIP;68ohm,1%,1/10W,TP,1608
R-CHIP;75ohm,1%,1/10W,TP,1608
R-CHIP;75ohm,1%,1/10W,TP,1608
R-CHIP;75ohm,1%,1/10W,TP,1608
R-CHIP;4.7ohm,1%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

VE1
VE10
VE2
VE4
VE5

2401-002165
2401-001479
2401-000922
2401-001479
2401-001479

C-AL;100uF,20%,16V,GP,TP,6.3x7
C-AL;470uF,20%,10V,GP,TP,6.3*1
C-AL;22uF,20%,16V,GP,TP,5x5,5
C-AL;470uF,20%,10V,GP,TP,6.3*1
C-AL;470uF,20%,10V,GP,TP,6.3*1

1
1
1
1
1

SA
SA
SA
SA
SA

VE6
VE7
VE8
VE9
VIC1

2401-001479
2401-001479
2401-001915
2401-001915
1201-002335

C-AL;470uF,20%,10V,GP,TP,6.3*1
C-AL;470uF,20%,10V,GP,TP,6.3*1
C-AL;1uF,20%,50V,GP,TP,3x5,5
C-AL;1uF,20%,50V,GP,TP,3x5,5
IC-VIDEO AMP;MM1692XVBE,TSOP,1

1
1
1
1
1

SA
SA
SA
SA
SA

VL1
VL11
VL12
VL6
VR30

3301-001419
2701-000181
2701-000181
2703-000398
2007-001167

BEAD-SMD;220ohm,1608,TP,133ohm
INDUCTOR-AXIAL;33uH,5%,2434
INDUCTOR-AXIAL;33uH,5%,2434
INDUCTOR-SMD;10uH,10%,3225
R-CHIP;75ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

VR31
VR32
VR33
VR34
VR60

2007-001167
2007-001167
2007-001167
2007-001167
2007-001167

R-CHIP;75ohm,5%,1/10W,TP,1608
R-CHIP;75ohm,5%,1/10W,TP,1608
R-CHIP;75ohm,5%,1/10W,TP,1608
R-CHIP;75ohm,5%,1/10W,TP,1608
R-CHIP;75ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

VZ1
VZ10
VZ11
VZ12
VZ13

0403-001083
0403-001083
0403-001083
0403-001083
0403-001083

DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V

1
1
1
1
1

SA
SA
SA
SA
SA

VZ14
VZ15
VZ16
VZ17
VZ18

0403-001083
0403-001083
0403-001083
0403-001083
0403-001083

DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V

1
1
1
1
1

SA
SA
SA
SA
SA

VZ19
VZ2
VZ20
VZ3
VZ4

0403-001083
0403-001083
0403-001083
0403-001083
0403-001083

DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V

1
1
1
1
1

SA
SA
SA
SA
SA

VZ5
VZ6
VZ7
VZ8
VZ9

0403-001083
0403-001083
0403-001083
0403-001083
0403-001083

DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V
DIODE-ZENER;UDZ9.1B,8.85-9.23V

1
1
1
1
1

SA
SA
SA
SA
SA

Samsung Electronics

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

W004
W224
W233
W324
W868

6003-000283
3301-000297
2701-000002
2007-000070
3301-001689

SCREW-TAPTITE;BH,+,-,B,M3,L8,Z
BEAD-AXIAL;25ohm,3.6x1.2x5.7mm
INDUCTOR-AXIAL;100UH,10%,4298
R-CHIP;0ohm,5%,1/10W,TP,1608
BEAD-SMD;220ohm,2012,TP,80ohm/

1
1
1
1
1

SA
SA
SA
SA
SA

W881
W882
W889
W890
W920

2007-000070
2007-000070
2007-000033
2007-000033
2007-000033

R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/10W,TP,1608
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/4W,TP,3216

1
1
1
1
1

SA
SA
SA
SA
SA

W923 2007-000033
W946 2007-000070
XT4M01 2801-003399
XT601 2801-001384
XT602 2801-003318

R-CHIP;0ohm,5%,1/4W,TP,3216
R-CHIP;0ohm,5%,1/10W,TP,1608
CRYSTAL-UNIT;3.579545MHz,15ppm
CRYSTAL-UNIT;14.31818MHz,30ppm
CRYSTAL-UNIT;32.768KHz,20ppm,2

1
1
1
1
1

SA
SA
SA
SC
SA

H001
C771
CIC1
CN1
DECK_C

AK97-01883B
AK61-00390A
1203-003177
3708-002193
3708-002176

ASSY-LOADER;-,DVD-R150,RAM Mul
HOLDER-WIRE;SOH-DR2,PPS,T5.2,W
IC-VOL. DETECTOR;BD5326G,SSOP,
CONNECTOR-FPC/FFC/PIC;50P,0.5m
CONNECTOR-FPC/FFC/PIC;5P,1mm,S

1
1
1
1
1

SA
SNA
SA
SA
SA

H001
H103
H105
H106
H108

AK97-01878A
AK66-00061A
6602-001076
AK66-00062A
AK63-00432A

ASSY-RECORDER DECK;DP-R4L,-,GEAR-PULLEY;DP-RW,POM,-,-,-,-,
BELT-RECTANGULAR;CR,T1.2,4.3%,
GEAR-TRAY;DP-RW,POM,-,-,-,WHT,
TRAY-DISC;DP-R3.5,ABS,-,-,-,-,

1
1
1
1
1

SNA
SNA
SA
SNA
SNA

H207
H209
H211
H212
H241

AK31-00028A
AK64-01462A
AK97-01856A
AK61-00738A
AK41-00609A

MOTOR SPINDLE;DP-R3L,8500,9.8m
CHASSIS-SUB;DP-R3H,ABS,T2,W114
ASSY-PICK UP;-,SOH-DR4,HOLDER-CHUCK;DP-R3.5L,ABS,-,-,
FFC-PU;DP-R3.5,POLYESTER,PITCH

1
1
1
1
1

SNA
SNA
SNA
SNA
SNA

H265
H268
H271
H275
H401

AK61-00736A
AK61-00452A
AK61-00735A
AK66-00072A
AK61-00734A

BRACKET-SHAFT PU;DP-R3.5,SUS T
SPRING ETC-HINGE PU;DP-R2,SUS3
HINGE-PU;DP-R3.5,POM,-,-,-,-,SHAFT-PU;DP-RW2,SUS420J2,91.5,
FRAME-MAIN;DP-R3.5,ABS,-,-,-,-

2
1
1
2
1

SNA
SNA
SNA
SNA
SNA

JP9
PC1
PC10
PC12
PC14

3708-001331
2203-006048
2402-000179
2203-006048
2203-006048

CONNECTOR-FPC/FFC/PIC;40P,0.5m
C-CER,CHIP;100nF,10%,10V,X7R,1
C-AL,SMD;47uF,20%,16V,GP,TP,6.
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

PC15
PC2
PC3
PC4
PC5

2404-001131
2203-006214
2402-001042
2203-005061
2402-001042

C-TA,CHIP;22UF,10%,10V,GP,TP,3
C-CER,CHIP;2200nF,10%,25V,X7R,
C-AL,SMD;100uF,20%,16V,GP,TP,6
C-CER,CHIP;100nF,+80-20%,16V,Y
C-AL,SMD;100uF,20%,16V,GP,TP,6

1
1
1
1
1

SA
SA
SA
SA
SA

PC6
PC7
PC8
PC9
PCB

2203-006048
2203-005171
2203-005171
2402-000179
AK41-00623B

C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;1000nF,10%,16V,X7R,
C-CER,CHIP;1000nF,10%,16V,X7R,
C-AL,SMD;47uF,20%,16V,GP,TP,6.
PCB-FRONT;RAMBO4,CEM-3,2,-,1.6

1
1
1
1
0.5

SA
SA
SA
SA
SNA

PCN
PIC2

3711-005477
1203-003997

HEADER-BOARD TO CABLE;BOX,4P,1
IC-MULTI REG.;BA30E00WHFP,HRP,

1
1

SA
SA

This Document can not be used without Samsung’s authorization

7-7

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

PIC3
PL1
PL3

1203-003999
2901-001281
2901-001281

IC-POSI.FIXED REG.;BH25FB1WHFV
FILTER-EMI SMD;16V,2A,-,220000
FILTER-EMI SMD;16V,2A,-,220000

1
1
1

SA
SA
SA

PL4
PL5
PR1
PR2
PR3

2901-001281
2901-001281
2007-000097
2007-000616
3301-001495

FILTER-EMI SMD;16V,2A,-,220000
FILTER-EMI SMD;16V,2A,-,220000
R-CHIP;47Kohm,5%,1/10W,TP,1608
R-CHIP;24Kohm,5%,1/10W,TP,1608
BEAD-SMD;120ohm,2012,2500mA,TP

1
1
1
1
1

SA
SA
SA
SA
SA

RC10
RC11
RC12
RC13
RC14

2203-006048
2203-006048
2203-006048
2203-006048
2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

RC15
RC16
RC17
RC21
RC22

2203-006048
2203-006048
2203-006048
2203-006048
2404-001020

C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-TA,CHIP;10uF,20%,10V,GP,TP,3

1
1
1
1
1

SA
SA
SA
SA
SA

RC23
RC25
RC26
RC27
RC28

2203-006048
2404-001020
2203-006048
2404-001020
2203-000254

C-CER,CHIP;100nF,10%,10V,X7R,1
C-TA,CHIP;10uF,20%,10V,GP,TP,3
C-CER,CHIP;100nF,10%,10V,X7R,1
C-TA,CHIP;10uF,20%,10V,GP,TP,3
C-CER,CHIP;10nF,10%,16V,X7R,10

1
1
1
1
1

SA
SA
SA
SA
SA

RC29
RC3
RC30
RC31
RC32

2203-000254
2203-006048
2203-000254
2203-006048
2203-000233

C-CER,CHIP;10nF,10%,16V,X7R,10
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;10nF,10%,16V,X7R,10
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;0.1nF,5%,50V,C0G,10

1
1
1
1
1

SA
SA
SA
SA
SA

RC33
RC34
RC35
RC36
RC37

2203-000254
2203-000254
2203-000254
2203-006048
2404-000284

C-CER,CHIP;10nF,10%,16V,X7R,10
C-CER,CHIP;10nF,10%,16V,X7R,10
C-CER,CHIP;10nF,10%,16V,X7R,10
C-CER,CHIP;100nF,10%,10V,X7R,1
C-TA,CHIP;10uF,20%,16V,-,TP,35

1
1
1
1
1

SA
SA
SA
SA
SA

RC38
RC39
RC40
RC41
RC42

2203-000254
2404-000284
2203-006048
2203-000254
2203-000254

C-CER,CHIP;10nF,10%,16V,X7R,10
C-TA,CHIP;10uF,20%,16V,-,TP,35
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;10nF,10%,16V,X7R,10
C-CER,CHIP;10nF,10%,16V,X7R,10

1
1
1
1
1

SA
SA
SA
SA
SA

RC43
RC44
RC45
RC46
RC47

2203-006048
2203-006048
2203-000438
2203-000438
2203-000627

C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;1nF,10%,50V,X7R,100
C-CER,CHIP;1nF,10%,50V,X7R,100
C-CER,CHIP;0.022nF,5%,50V,C0G,

1
1
1
1
1

SA
SA
SA
SA
SA

RC48
RC49
RC50
RC51
RC52

2203-000438
2203-000438
2203-000254
2203-000254
2203-000254

C-CER,CHIP;1nF,10%,50V,X7R,100
C-CER,CHIP;1nF,10%,50V,X7R,100
C-CER,CHIP;10nF,10%,16V,X7R,10
C-CER,CHIP;10nF,10%,16V,X7R,10
C-CER,CHIP;10nF,10%,16V,X7R,10

1
1
1
1
1

SA
SA
SA
SA
SA

RC53
RC54
RC55
RC56
RC57

2203-000233
2203-006048
2404-000284
2203-006048
2203-006048

C-CER,CHIP;0.1nF,5%,50V,C0G,10
C-CER,CHIP;100nF,10%,10V,X7R,1
C-TA,CHIP;10uF,20%,16V,-,TP,35
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

RC58
RC59

2404-000284
2203-006048

C-TA,CHIP;10uF,20%,16V,-,TP,35
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1

SA
SA

7-8

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

RC6
RC60
RC61

2203-005496
2203-006048
2203-006048

C-CER,CHIP;220nF,+80-20%,10V,Y
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1
1

SA
SA
SA

RC62
RC63
RC64
RC65
RC66

2203-005642
2203-005642
2203-005642
2203-005642
2203-000254

C-CER,CHIP;0.22nF,5%,50V,NP0,1
C-CER,CHIP;0.22nF,5%,50V,NP0,1
C-CER,CHIP;0.22nF,5%,50V,NP0,1
C-CER,CHIP;0.22nF,5%,50V,NP0,1
C-CER,CHIP;10nF,10%,16V,X7R,10

1
1
1
1
1

SA
SA
SA
SA
SA

RC67
RC68
RC69
RC7
RC70

2203-000254
2203-000254
2203-000233
2203-005496
2203-001239

C-CER,CHIP;10nF,10%,16V,X7R,10
C-CER,CHIP;10nF,10%,16V,X7R,10
C-CER,CHIP;0.1nF,5%,50V,C0G,10
C-CER,CHIP;220nF,+80-20%,10V,Y
C-CER,CHIP;0.082nF,5%,50V,NP0,

1
1
1
1
1

SA
SA
SA
SA
SA

RC71
RC72
RC73
RC74
RIC2

2203-001239
2203-000254
2203-006048
2203-000489
AK13-00028A

C-CER,CHIP;0.082nF,5%,50V,NP0,
C-CER,CHIP;10nF,10%,16V,X7R,10
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;2.2nF,10%,50V,X7R,1
IC ASIC;S1L1101X01,-,128,5V,-0

1
1
1
1
1

SA
SA
SA
SA
SNA

RR10
RR11
RR13
RR16
RR17

2007-000151
2007-000143
2007-000171
2007-000159
2007-003009

R-CHIP;15Kohm,5%,1/16W,TP,1005
R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;56Kohm,5%,1/16W,TP,1005
R-CHIP;16Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RR18
RR21
RR22
RR24
RR25

2007-000157
2007-007107
2007-007107
2007-000145
2007-000154

R-CHIP;47Kohm,5%,1/16W,TP,1005
R-CHIP;100Kohm,1%,1/16W,TP,100
R-CHIP;100Kohm,1%,1/16W,TP,100
R-CHIP;6.2Kohm,5%,1/16W,TP,100
R-CHIP;24KOHM,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RR25
RR26
RR27
RR28
RR29

2203-006048
2007-001320
2007-000148
2007-000148
2007-000148

C-CER,CHIP;100nF,10%,10V,X7R,1
R-CHIP;1.8Kohm,5%,1/16W,TP,100
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RR30
RR32
RR32
RR33
RR35

2007-000157
2007-000159
2203-006048
2007-000154
2007-000140

R-CHIP;47Kohm,5%,1/16W,TP,1005
R-CHIP;56Kohm,5%,1/16W,TP,1005
C-CER,CHIP;100nF,10%,10V,X7R,1
R-CHIP;24KOHM,5%,1/16W,TP,1005
R-CHIP;1Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

RR37
RR43
RR44
RR45
RR46

2007-000170
2007-000171
2007-000151
2007-000151
2007-000171

R-CHIP;1Mohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;15Kohm,5%,1/16W,TP,1005
R-CHIP;15Kohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

AK61-00740A
AK73-00053A
AK97-01876A
AK31-00024A
AK61-00490A

BRACKET-DECK;DP-R3.5L,SECC T1.
RUBBER-DECK;DP-R3.5,BUTYL,-,-,
ASSY-TRAVERSE;DP-R4,-,MOTOR STEP-FEED;-,DP-RW,727 mA
SPRING ETC-SHAFT PU;DP-RW2,PW2

1
4
1
1
2

SNA
SNA
SNA
SNA
SNA

S.N.A
S.N.A
S.N.A
S.N.A
S.N.A

AK97-01877A
AK97-01331B
AK61-00486A
AK61-00739A
BG33-30001D

ASSY-HOLDER CHUCK;DP-R4L,-,ASSY-CLAMPER;DP-R4L,-,BODY CLAMPER-UPPER;DP-RW2,POM,
BRACKET-CLAMPER;DP-R3.5L,SECC
MAGNET-CLAMPER;-,-,-,-,13.5x6x

1
1
1
1
1

SNA
SNA
SNA
SNA
SNA

ASSY-HOUSING;-,DP-R4,-

1

SNA

S.N.A AK97-01879A

This Document can not be used without Samsung’s authorization

Samsung Electronics

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

S.N.A
S.N.A
S.N.A
S.N.A

AH31-00025A
AK66-00038A
AK97-01646A
3403-001026

MOTOR-LOADING;RF-300EA-1D390,D
PULLEY MOTOR;DP-R1,POM,-,BLK,1
ASSY-MOTOR PCB;PHENOL,DP-R3H,S
SWITCH-PUSH;5V,0.7mA,DPST,OFF-

1
1
1
1

SNA
SNA
SNA
SA

S.N.A
S.N.A
SPIN_C
STEP_C
T037

AK41-00400A
AK41-00546A
3708-002067
3708-002018
AK66-00079A

FFC-DECK;DP-RW2,PITCH1.0,PET,5
PCB-MOTOR;DP-R3H,PHENOL,1,1,1.
CONNECTOR-FPC/FFC/PIC;12P,1mm,
CONNECTOR-FPC/FFC/PIC;4P,1MM,S
SLIDER-CAM;DP-R3H,POM,T10,W89,

1
1
1
1
1

SNA
SNA
SA
SA
SNA

U8
U9
UB1
UC100
UC18

AK13-00025A
1107-001551
1105-001284
2203-006048
2404-001020

IC ASIC;S5L1484A01,RAMBO-3,256
IC-FLASH MEMORY;S29AL016M10TAI
IC-DRAM;636165,-,16Mbit,1Mx16B
C-CER,CHIP;100nF,10%,10V,X7R,1
C-TA,CHIP;10uF,20%,10V,GP,TP,3

1
1
1
1
1

SNA
SNA
SA
SA
SA

UC19
UC21
UC22
UC23
UC24

2203-000278
2203-006048
2203-006048
2203-006048
2203-006048

C-CER,CHIP;0.01nF,0.5pF,50V,C0
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

UC25
UC26
UC27
UC28
UC29

2203-006048
2203-006048
2203-006048
2404-001020
2404-001020

C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-TA,CHIP;10uF,20%,10V,GP,TP,3
C-TA,CHIP;10uF,20%,10V,GP,TP,3

1
1
1
1
1

SA
SA
SA
SA
SA

UC30
UC31
UC32
UC33
UC34

2404-001020
2203-006048
2203-006048
2203-006048
2203-006048

C-TA,CHIP;10uF,20%,10V,GP,TP,3
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

UC35
UC36
UC37
UC38
UC39

2203-006048
2203-006048
2203-006048
2203-006048
2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

UC40
UC41
UC42
UC43
UC44

2203-006048
2203-006048
2203-006048
2203-006048
2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

UC45
UC46
UC47
UC48
UC49

2203-000438
2203-006048
2203-000254
2203-006048
2203-006048

C-CER,CHIP;1nF,10%,50V,X7R,100
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;10nF,10%,16V,X7R,10
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

UC50
UC51
UC52
UC53
UC54

2203-006048
2203-006048
2203-006048
2203-006048
2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

UC55
UC56
UC57
UC58
UC62

2203-006048
2203-000854
2203-001072
2203-006048
2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;0.039nF,5%,50V,C0G,
C-CER,CHIP;0.056nF,5%,50V,NP0,
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

UC63

2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1

1

SA

Samsung Electronics

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

UC64
UC67
UC69
UC70

2203-006048
2203-006048
2404-001020
2203-006048

C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1
C-TA,CHIP;10uF,20%,10V,GP,TP,3
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1
1
1

SA
SA
SA
SA

UC71
UC72
UC75
UC76
UC77

2404-001020
2203-006048
2404-001020
2203-006048
2203-006048

C-TA,CHIP;10uF,20%,10V,GP,TP,3
C-CER,CHIP;100nF,10%,10V,X7R,1
C-TA,CHIP;10uF,20%,10V,GP,TP,3
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

UC79
UC80
UC81
UC82
UR1

2203-006048
2203-000438
2203-006048
2203-001072
2011-001432

C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;1nF,10%,50V,X7R,100
C-CER,CHIP;100nF,10%,10V,X7R,1
C-CER,CHIP;0.056nF,5%,50V,NP0,
R-NET;82ohm,5%,1/16W,L,CHIP,8P

1
1
1
1
1

SA
SA
SA
SA
SA

UR10
UR100
UR11
UR12
UR13

2007-001217
2007-000148
2007-000173
2007-000173
2007-001217

R-CHIP;82OHM,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;22ohm,5%,1/16W,TP,1005
R-CHIP;22ohm,5%,1/16W,TP,1005
R-CHIP;82OHM,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR14
UR16
UR17
UR19
UR2

2007-001217
2007-000170
2007-000143
3301-001419
2011-001261

R-CHIP;82OHM,5%,1/16W,TP,1005
R-CHIP;1Mohm,5%,1/16W,TP,1005
R-CHIP;4.7Kohm,5%,1/16W,TP,100
BEAD-SMD;220ohm,1608,TP,133ohm
R-NET;33ohm,5%,1/16W,L,CHIP,8P

1
1
1
1
1

SA
SA
SA
SA
SA

UR20
UR21
UR22
UR23
UR24

2007-000148
2007-000148
2007-000148
2007-000174
2007-000148

R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;47ohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR25
UR26
UR27
UR28
UR29

2007-001292
2007-001292
2007-000148
2007-000148
2007-000148

R-CHIP;33ohm,5%,1/16W,TP,1005
R-CHIP;33ohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR3
UR30
UR31
UR32
UR33

2011-001261
2007-000138
2007-000138
2007-000138
2007-000138

R-NET;33ohm,5%,1/16W,L,CHIP,8P
R-CHIP;100ohm,5%,1/16W,TP,1005
R-CHIP;100ohm,5%,1/16W,TP,1005
R-CHIP;100ohm,5%,1/16W,TP,1005
R-CHIP;100ohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR34
UR35
UR36
UR37
UR39

2007-000139
2007-000138
2007-000139
2007-001325
2007-000775

R-CHIP;220ohm,5%,1/16W,TP,1005
R-CHIP;100ohm,5%,1/16W,TP,1005
R-CHIP;220ohm,5%,1/16W,TP,1005
R-CHIP;3.3Kohm,5%,1/16W,TP,100
R-CHIP;33KOHM,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR4
UR42
UR43
UR44
UR47

2011-001261
2007-007001
2007-000148
2007-000171
2007-000148

R-NET;33ohm,5%,1/16W,L,CHIP,8P
R-CHIP;3.9KOHM,5%,1/16W,TP,100
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR48
UR5
UR50
UR55
UR58

2007-000148
2011-001261
2007-000143
2007-000143
2007-000143

R-CHIP;10Kohm,5%,1/16W,TP,1005
R-NET;33ohm,5%,1/16W,L,CHIP,8P
R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;4.7Kohm,5%,1/16W,TP,100

1
1
1
1
1

SA
SA
SA
SA
SA

This Document can not be used without Samsung’s authorization

7-9

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

UR59
UR6
UR63
UR64
UR69

2007-000143
2007-000173
2007-000084
2007-000143
2007-000148

R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;22ohm,5%,1/16W,TP,1005
R-CHIP;4.7Kohm,5%,1/10W,TP,160
R-CHIP;4.7Kohm,5%,1/16W,TP,100
R-CHIP;10Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR7
UR73
UR75
UR76
UR77

2007-001217
2007-001305
2007-001292
2007-000171
3301-001861

R-CHIP;82OHM,5%,1/16W,TP,1005
R-CHIP;120ohm,5%,1/16W,TP,1005
R-CHIP;33ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
BEAD-SMD;600ohm,1005,TP,500ohm

1
1
1
1
1

SA
SA
SA
SA
SNA

UR8
UR80
UR81
UR82
UR83

2007-001217
2007-000140
2007-000171
2007-000113
2007-000113

R-CHIP;82OHM,5%,1/16W,TP,1005
R-CHIP;1Kohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;33ohm,5%,1/10W,TP,1608
R-CHIP;33ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SA
SA
SA
SA

UR87
UR88
UR89
UR9
UR90

2007-000148
2007-001305
2007-000171
2007-000173
2007-000831

R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;120ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;22ohm,5%,1/16W,TP,1005
R-CHIP;39Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

UR91
UR92
UR93
UR94
UR95

2007-000171
2007-000171
2007-000171
2011-001432
2011-001432

R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/16W,TP,1005
R-NET;82ohm,5%,1/16W,L,CHIP,8P
R-NET;82ohm,5%,1/16W,L,CHIP,8P

1
1
1
1
1

SA
SA
SA
SA
SA

UR96
UR97
UR98
UR99
VC1

2011-001432
2011-001432
2007-000148
2007-000070
2203-006047

R-NET;82ohm,5%,1/16W,L,CHIP,8P
R-NET;82ohm,5%,1/16W,L,CHIP,8P
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;0ohm,5%,1/10W,TP,1608
C-CER,CHIP;33nF,10%,16V,X7R,10

1
1
1
1
1

SA
SA
SA
SA
SA

VC10
VC11
VC12
VC13
VC14

2203-000438
2203-005061
2203-005061
2404-000284
2203-006048

C-CER,CHIP;1nF,10%,50V,X7R,100
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-TA,CHIP;10uF,20%,16V,-,TP,35
C-CER,CHIP;100nF,10%,10V,X7R,1

1
1
1
1
1

SA
SA
SA
SA
SA

VC15
VC16
VC17
VC18
VC19

2203-000254
2203-005061
2203-005061
2203-005061
2203-005061

C-CER,CHIP;10nF,10%,16V,X7R,10
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y
C-CER,CHIP;100nF,+80-20%,16V,Y

1
1
1
1
1

SA
SA
SA
SA
SA

VC2
VC20
VC21
VC3
VC4

2203-006047
2203-006048
2404-001020
2203-006047
2203-006047

C-CER,CHIP;33nF,10%,16V,X7R,10
C-CER,CHIP;100nF,10%,10V,X7R,1
C-TA,CHIP;10uF,20%,10V,GP,TP,3
C-CER,CHIP;33nF,10%,16V,X7R,10
C-CER,CHIP;33nF,10%,16V,X7R,10

1
1
1
1
1

SA
SA
SA
SA
SA

VC5
VC6
VC7
VC8
VIC1

2203-006047
2203-006047
2203-000233
2203-000233
1003-001881

C-CER,CHIP;33nF,10%,16V,X7R,10
C-CER,CHIP;33nF,10%,16V,X7R,10
C-CER,CHIP;0.1nF,5%,50V,C0G,10
C-CER,CHIP;0.1nF,5%,50V,C0G,10
IC-MOTOR DRIVER;BD7956FS,HSSOP

1
1
1
1
1

SA
SA
SA
SA
SA

VR1
VR10
VR11
VR12
VR13

2007-000138
2007-000138
2007-000034
2007-000034
2007-000034

R-CHIP;100ohm,5%,1/16W,TP,1005
R-CHIP;100ohm,5%,1/16W,TP,1005
R-CHIP;1OHM,5%,1/4W,TP,3216
R-CHIP;1OHM,5%,1/4W,TP,3216
R-CHIP;1OHM,5%,1/4W,TP,3216

1
1
1
1
1

SA
SA
SA
SA
SA

7-10

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

VR14
VR15
VR16
VR18
VR20

2007-000034
2007-000034
2007-000034
2007-000034
2007-000148

R-CHIP;1OHM,5%,1/4W,TP,3216
R-CHIP;1OHM,5%,1/4W,TP,3216
R-CHIP;1OHM,5%,1/4W,TP,3216
R-CHIP;1OHM,5%,1/4W,TP,3216
R-CHIP;10Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

VR25
VR26
VR27
VR28
VR31

2007-007107
2007-000159
2007-000159
2007-000148
3301-001419

R-CHIP;100Kohm,1%,1/16W,TP,100
R-CHIP;56Kohm,5%,1/16W,TP,1005
R-CHIP;56Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
BEAD-SMD;220ohm,1608,TP,133ohm

1
1
1
1
1

SA
SA
SA
SA
SA

VR32
VR33
VR34
VR35
VR36

3301-001419
3301-001419
3301-001419
3301-001419
3301-001419

BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm

1
1
1
1
1

SA
SA
SA
SA
SA

VR37
VR38
VR39
VR40
VR41

3301-001419
3301-001419
3301-001419
3301-001419
3301-001419

BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm

1
1
1
1
1

SA
SA
SA
SA
SA

VR42
VR43
VR44
VR45
VR46

3301-001419
3301-001419
3301-001419
3301-001419
3301-001419

BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm

1
1
1
1
1

SA
SA
SA
SA
SA

VR47
VR48
VR5
VR6
VR8

3301-001419
3301-001419
2007-000148
2007-000148
2007-000148

BEAD-SMD;220ohm,1608,TP,133ohm
BEAD-SMD;220ohm,1608,TP,133ohm
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005
R-CHIP;10Kohm,5%,1/16W,TP,1005

1
1
1
1
1

SA
SA
SA
SA
SA

VR9
W012
W018
W274
W350

2007-000164
6002-001086
6003-001450
6001-001730
6001-001003

R-CHIP;150KOHM,5%,1/16W,TP,100
SCREW-TAPPING;PH,+,-,B,M1.7,L5
SCREW-TAPTITE;PH,+,-,S,M2.6,L5
SCREW-MACHINE;BH,+,-,M1.7,L2.5
SCREW-MACHINE;BH,+,M2.6,L6,ZPC

1
1
2
2
4

SA
SA
SA
SA
SA

W352
W353
W354
W355
W377

6001-000883
6003-001199
6003-001258
6003-001526
6001-001291

SCREW-MACHINE;PH,+,M1.4,L5,ZPC
SCREW-TAPTITE;PWH,+,-,B,M2,L7,
SCREW-TAPTITE;PH,+,B,M1.4,L2.0
SCREW-TAPTITE;CH,+,S-TITE,M1.4
SCREW-MACHINE;CH(0.5),*,-,M1.7

1
4
4
2
3

SNA
SA
SA
SNA
SA

Y1

2802-001163
AK92-01223A
AC99-40322L
0202-001221
AC99-90324K

RESONATOR-CERAMIC;33.86MHz,0.5
ASSY PCB-LOADER;DVD-R135A/XAA,
ASSY PCB-LOADER,c;DVD-R135A/XA
SOLDER-CREAM;PF305-116HO(A),-,
ASSY PCB-LOADER,m;DVD-R135A/XA

1
1
1
4.04
1

SA
SNA
SNA
SNA
SNA

0202-001214
AK97-01857A
0201-000169
0201-000172
0201-001006

SOLDER-WIRE FLUX;HI-ALMIT HR19
ASSY-SUB PICK UP;-,SOH-DR4,ADHESIVE-CYA;ARCN-A501F,NTR
ADHESIVE-AA;EP-171,BRN
ADHESIVE-AA;#7452,TRP,-,-

0.024
1
0.01
0.01
0.02

SNA
SNA
SNA
SNA
SNA

0201-001553
0201-001718
0201-001819

ADHESIVE-TP;G-800-A,GRY,220?40
ADHESIVE-A.C.F;A-80T,SILVER,11
ADHESIVE-UV;8833M,YELLOW,21000

0.013 SNA
0.003 SNA
0.05 SNA

This Document can not be used without Samsung’s authorization

Samsung Electronics

Electrical Parts List

Loc.No Part No

Description ; Specification

Q’ty S.N.A Remark

0202-001499
0602-001127

SOLDER-WIRE FLUX;SR34 SUPER LF
DIODE-LASER;160mW,2,658nm,CAN

AH61-00812A
AK61-00720A
AK61-00721A
AK61-00722A
AK61-00747A

SPRING ETC-L/G HOLDER;SOH-DH2,
HOLDER-LD DVD;SOH-DR3.5,Zn,4.8
HOLDER-LD CD;SOH-DR3.5,Zn,T6.2
HOLDER-LG;SOH-DR3.5,Zn,T6.43,W
SPRING ETC-SHAFT GUIDE;SOH-DR4

1
1
1
1
1

SNA
SNA
SNA
SNA
SNA

AK63-00438A
AK97-01859A
0201-001081
0201-001230
0201-001709

COVER BASE;SOH-DR4,Cu,T0.2,W32
ASSY-ACT;-,SOH-DR4,ADHESIVE-AA;1401C,RED,-,BOND-L
ADHESIVE-CYA;LOCTITE 480,BLK,3
ADHESIVE-UV;8839L,YEL,24500mPa

1
1
0.006
0.002
0.01

SNA
SNA
SNA
SNA
SNA

0201-001793
0202-001499
3302-001651
3812-001263
3812-001419

ADHESIVE-UV;8791L3,WHITE,20000
SOLDER-WIRE FLUX;SR34 SUPER LF
MAGNET-RARE EARTH;AF,14000Gaus
WIRE-NO SHEATH CU;SCW,-,19MM,WIRE-NO SHEATH CU;SCW,0V,18.5m

0.01
0.085
2
1
5

SNA
SNA
SNA
SNA
SNA

AK62-00020A
AK67-00040A
AK97-01858A
0201-001253
0201-001371

YOKE-ACT;SOH-DR3,SPCC,T7.6,W24
LENS-OL;SOH-DR3,PLS,WHT,3.8,1.
ASSY-BLADE;-,SOH-DR4,ADHESIVE-STR;TB2212B,BLK,25(25
ADHESIVE-SIL;KE3494,GRAY,50 PA

1
1
1
0.008
0.002

SNA
SNA
SNA
SNA
SNA

0202-001215
AK61-00480A
0201-001911
AK97-01860A
0202-001221

SOLDER-BAR;HSE-16,S60S-20,D3,S
BLADE-ACT;SOH-DR3,E5006J,L,IVO
ADHESIVE-UV;ZV-102L,WHITE,8200
ASSY-FPCB;-,SOH-DR4,DVD-RECORD
SOLDER-CREAM;PF305-116HO(A),-,

0.01
1
0.06
1
0.12

SNA
SNA
SNA
SNA
SNA

0603-001181
0603-001187
1003-001854
1404-001328
2007-000070

PHOTO DIODE;5.5V,658.79nm,PHOTO-RECEIVER;6.0V,17.0mA,650
IC-DIODE DRIVER;EL6939CLZ,LPP,
THERMISTOR-NTC;10Kohm,-,3370K,
R-CHIP;0ohm,5%,1/10W,TP,1608

1
1
1
1
1

SA
SNA
SA
SNA
SA

2007-000076
2007-000113
2007-000140
2007-000309
2007-000932

R-CHIP;330ohm,5%,1/10W,TP,1608
R-CHIP;33ohm,5%,1/10W,TP,1608
R-CHIP;1Kohm,5%,1/16W,TP,1005
R-CHIP;10ohm,5%,1/10W,TP,1608
R-CHIP;470OHM,5%,1/16W,TP,1005

1
2
1
1
1

SA
SA
SA
SA
SA

2007-001319
2007-007136
2011-001261
2011-001344
2104-001087

R-CHIP;1.2KOHM,5%,1/16W,TP,100
R-CHIP;4.7Kohm,1%,1/16W,TP,100
R-NET;33ohm,5%,1/16W,L,CHIP,8P
R-NET;100ohm,5%,1/16W,L,CHIP,8
VR-SMD;2.2Kohm,25%,0.15W,TOP

1
1
1
1
2

SA
SA
SA
SA
SA

2203-000189
2203-000626
2203-005664
2203-006158
3301-001419

C-CER,CHIP;100nF,+80-20%,25V,Y
C-CER,CHIP;0.022nF,5%,50V,C0G,
C-CER,CHIP;4700nF,10%,6.3V,X5R
C-CER,CHIP;100nF,10%,16V,X7R,1
BEAD-SMD;220ohm,1608,TP,133ohm

5
1
1
4
1

SA
SA
SA
SNA
SA

3708-002193
AK32-00004A
AK41-00626A
AK61-00723A
AK97-01862A

CONNECTOR-FPC/FFC/PIC;50P,0.5m
SENSOR PHOTO;CNB1001,-25~85,-,
FPC-MAIN;SOH-DR4,00,POLYAMIDE,
PLATE-PD;SOH-DR3.5,Zn,1.2,13.4
ASSY-OPT;-,SOH-DR4,DVD-RECORDE

1
1
1
1
1

SA
SNA
SNA
SNA
SNA

0201-001525
0201-001709
0201-001819

ADHESIVE-UV;8840L,YEL,TRANS,23
ADHESIVE-UV;8839L,YEL,24500mPa
ADHESIVE-UV;8833M,YELLOW,21000

0.03
0.02
0.05

SNA
SNA
SNA

Samsung Electronics

Loc.No Part No

0.085 SNA
1 SNA

Description ; Specification

Q’ty S.N.A Remark

AK61-00717A
AK61-00724A

BASE-PICK UP;SOH-DR4,ZnDC,T12,
HOLDER-GT;SOH-DR3.5,Zn,T1.6,W5

1
1

SNA
SNA

AK61-00742A
AK67-00061A
AK67-00055A
AK67-00056A
AK67-00058A

SPRING ETC-DVD GT;SOH-DR4,Cu,LENS-CL;SOH-DR4,PLS,WHT,6.6,1.
LENS-CDL;SOH-DR4,-,CLEAR,R1.9,
LENS-ASL;SOH-DR4,-,CLEAR,5.9*5
LENS-QWP;SOH-DR4,GLS,WHT,5.5 *

1
1
1
1
1

SNA
SNA
SNA
SNA
SNA

AK67-00060A
AK67-00062A
AK67-00063A
AK67-00036A
0602-001115

LENS-WBS;SOH-DR4,GLS,WHT,5.5 *
LENS-MR;SOH-DR4,GLS,WHT,7.0 *
LENS-PBS;SOH-DR4,GLS,WHT,4.0 *
LENS-DVD GT;SOH-DR3,GLS,WHT,2.
DIODE-LASER;4.5MW,2V,785NM,TR

1
1
1
1
1

SNA
SNA
SNA
SNA
SNA

AK67-00059A

LENS-CD GT;SOH-DR4,GLS,WHT,2.0

1

SNA

C011
C022
FL261
VS203
W001

AK61-00519A
AK64-01939B
3809-001906
AK39-00103A
6003-000275

SPRING ETC-DOOR;DVD-SR420,STS3
DOOR-FRONT;DVD-R150/XAX,ABS 94
FFC CABLE-FLAT;30V,80,65mm,40P
LEAD CONNECTOR-ASSY;DVD-R135A/
SCREW-TAPTITE;BH,+,-,B,M3,L10,

1
1
1
1
5

SA
SA
SA
SA
SA

W009
W200
W268
W275

6003-000276
6003-001375
6003-000254
6003-001561
AC39-00073A

SCREW-TAPTITE;BH,+,-,B,M3,L10,
SCREW-TAPTITE;BH,+,-,B,M3,L8,Z
SCREW-TAPTITE;BH,+,-,S,M3,L6,Z
SCREW-TAPTITE;BH,+,-,B,M3,L6,Z
CABLE-RCA;SJ01-08-099,1.2MT,3P

4
2
1
4
1

SA
SA
SA
SA
SA

AC39-42001J
AK68-01316A
AK69-00500B

CABLE-RF ASSY;-,-,#1365,1200mm
MANUAL USERS;DVD-R150/XAC,XAC,
PACKING CASE;DVD-R150//XAC,PEP

1
1
1

SA
SA
SA

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7-11

Electrical Parts List

MEMO

7-12

Samsung Electronics

8. Block Diagrams
8-1 All Block Diagram- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

8-2

8-2 DIC1(S5L3210) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

8-3

8-3 AIC1(PCM1753) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

8-4

8-4 FIC1(TSB4AB1) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

8-5

8-5 VIC1(TW9906) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

8-6

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8-1

Block Diagrams

8-1 All Block Diagram
DVD- DRIVE (4.7GB)
AUDIO
VIDEO

DIC2 (Main)
DDR-SDRAM

DIC3(Main) FLASH

ATAPI

Component (480i / 480P)
IC201
(JACK)

Y
PB

CVBS1

PR

VIC1(Main)
Video Decoder

S-VIDEO1

S-VIDEO

DIC1 (Main)
MPEG-2 A/V CODEC

CVBS2

VIDEO
L1
L2

L/R from
Tuner

IC203
(JACK)

AIC1(Main)
Audio D/A

R1
R2

L1
R1
L2
R2

COAXIAL

IC601 (JACK)
Front Micom

IEC-958
OPTICAL
DIGITAL AUDIO OUT
Key Input

Front PCB

Remocon

HIC1(HDMI)
Transmitter

FIC1 (Main)
IEEE1394PHY
1394 JACK

8-2

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Block Diagrams

8-2 DIC1(S5L3210) Block Diagram

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8-3

Block Diagrams

8-3 AIC1(PCM1753) Block Diagram

8-4

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Block Diagrams

8-4 FIC1(TSB4AB1) Block Diagram

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8-5

Block Diagrams

8-5 VIC1(TW9906) Block Diagram

8-6

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CON 4

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1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30

16 P (B/D to B/D)

GND
Cr/R_O
Cr/R_IN
Cb/B_O
Y/G_IN
Y/G_O
Cb/B_IN
C_O
CVBS_IN
Y_O
Y_IN
CVBS_O
C_IN
GND
GND
L_IN
R_IN
GND
GND
R_OUT
AL5V
L_OUT
AUD_MUTE
IEC_958
ZERO_L
1.35 IN
ZERO_R
1.35 IN
5VCC
3.3V

2.5 IN
2.5 IN
RESET
TXD
FF_SCLK
RXD
RRQ
SRQ
WAKEUP
GND
TPBTPA+
GND
GND
TPB+
TPA-

CON 1

GND
Cr/R_O
Cr/R_IN
Cb/B_O
Y/G_IN
Y/G_O
Cb/B_IN
C_O
CVBS_IN
Y_O
Y_IN
CVBS_O
C_IN
GND
GND
L_IN
R_IN
GND
GND
R_OUT
F5V
L_OUT
AUDIO_MUTE
IEC_958
ZERO_L
1.35 IN
ZERO_R
1.35 IN
AL5V
V3.3

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16

2.5 IN
2.5 IN
RESET
TXD
FF_SCLK
RXD
RRQ
SRQ
WAKEUP
GND
TPBTPA+
GND
GND
TPB+
TPA-

9. Wiring Diagram
CN 5

40 PIN_FFC_CON

JP 9

CON 2

30 P (B/D to B/D)

PZWZ1

CON 3
FCON1
FCON5

FCON3

FCON4

9-1

Wiring Diagram

MEMO

9-2

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10. PCB Diagrams
10-1 Main PCB - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

10-2

10-2 Jack PCB - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

10-4

10-3 Key PCB - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

10-6

10-4 Function PCB - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

10-7

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10-1

PCB Diagrams

10-1 Main PCB
COMPONENT SIDE

Œ AUDIO DATA

´ VIC1 of Main PCB Clock

ˇ VIC1 of Main PCB DATA

¨ Digital clock(117)

ˆ Digital clock(118)

Ø Digital clock(119)

Œ
¨
ˆ
Ø

DIC1
VIC1

´
´
ˇ

∏

RIC2

DIC2

∏ DIC1 of Main PCB Clock

RIC1

DIC7
LOC.NO
DIC7
RIC2
VIC1
RIC1
DIC2
DIC1

10-2

X-Y
A-0
A-1
A-3
B-0
C-0
C-3

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PCB Diagrams

CONDUCTOR SIDE
”

∏
Ø
ˆ
¨
ˇ
´
Œ

Œ CVBS(Color-bar)

´ Y(Color-bar)

ˇ C(Color-bar)

¨ Y(Color-bar)

ˆ Pb(Color-bar)

Ø Pr(Color-bar)

∏ Digital clock(116)

” DIC3-Pin26

AIC1

DIC3

DIC5

TIC1

DIC6

LOC.NO
CEIC1
AIC1
DIC3
TIC1
DIC5

Samsung Electronics

X-Y
A-2
B-3
D-0
D-2
D-5

10-3

PCB Diagrams

10-2 Jack PCB
COMPONENT SIDE

IC703

LOC.NO
IC601
IC703
IC603
IC801
VIC1
IC701
AIC4
IC604

X-Y
A-4
A-6
B-5
C-2
C-4
D-0
E-5
F-5

IC603

IC604

IC601
VIC1

IC801

IC701

10-4

Samsung Electronics

PCB Diagrams

CONDUCTOR SIDE

IC703

LOC.NO
IC601
IC703
IC603
IC801
VIC1
IC701
AIC4
IC604

X-Y
A-4
A-6
B-5
C-2
C-4
D-0
E-5
F-5

IC603

IC604

IC601
VIC1

IC801

IC701

Samsung Electronics

10-5

PCB Diagrams

10-3 Key PCB
COMPONENT SIDE

CONDUCTOR SIDE

10-6

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PCB Diagrams

10-4 Function PCB
COMPONENT SIDE

CONDUCTOR SIDE

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10-7

PCB Diagrams

MEMO

10-8

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11. Schematic Diagrams
11-1 S.M.P.S (Jack PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

Note

11-2

11-2 AV Input (Jack PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-3

11-3 Micom (Jack PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-4

11-4 I/O (Jack PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-5

11-6 CODEC (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-6

11-7 AV (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-7

11-8 ATAPI-Flash (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-8

11-9 DDR (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-9

11-10 DV_1394 (Main PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-10

11-11 Audio (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-11

11-12 Main Connector (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-12

11-13 HDMI (Main PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-13

11-14 Sub and Key (Sub and Key PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - -

11-14

For schematic Diagram
- Resistors are in ohms, 1/8W unless otherwise noted.
Special note :
Most semiconductor devices are electrostatically sensitive and therefore require the special handling techniques described under the
“electrostatically sensitive (ES) devices” section of this service manual.
Note :
Do not use the part number shown on this drawing for ordering. The correct part number is shown in the parts list (may be slightly
different or amended since this drawing was prepared).
Important safety notices :
Components identified with the mark
Use only the same type.

have the special characteristics for safety. When replacing any of these components.

Block Identification of PCB

AV Block
TM Block

System
Control
Block

AV Block
SMPS Block

AV Block

Connect
SMPS Block
System
Control
Block

System
Control
Block

AV Block

SMPS Block

LED Display Block

Jack PCB (Component Side)

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11-1

Schematic Diagrams

11-1 S.M.P.S (Jack PCB)

Power

11-2

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Schematic Diagrams

11-2 AV Input (Jack PCB)

Power 5V, 12V

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Audio input

Audio output

Video input

Video output

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11-3

Schematic Diagrams

11-3 Micom (Jack PCB)
Power 5V

11-4

Video input

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Schematic Diagrams

11-4 I/O (Jack PCB)
Power 3.3V

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Power 5V

Audio input

Audio output

Video input

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Video output

11-5

Schematic Diagrams

11-6 CODEC (Main PCB)
Power
GND
Video
Audio
Œ IEC958
(DIC1-Pin128)

´ CVBS(Color-bar)
(DIC1-Pin106)

ˇ Y(Color-bar)
(DIC1-Pin103)

Œ
¨ C(Color-bar)
(DIC1-Pin104)

´ˇ¨

◆ These are the waveforms of DVD-R150.
Caution There can be some differences
(Voltage, Frequency, stc.) among cameras.

11-6

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Schematic Diagrams

11-7 AV (Main PCB)
Power
GND
Video
Audio

Œ I2S_LRCK
(AIC1_Pin3)

´ I2S_BCK
(AIC1_Pin1)

ˇ I2S_MCK
(AIC1_Pin16)

ˇ

´¨

¨ I2S_DOO
(AIC1_Pin2)

Œ

◆ These are the waveforms of DVD-R150.
Caution There can be some differences
(Voltage, Frequency, stc.) among cameras.

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11-7

Schematic Diagrams

11-8 ATAPI-Flash (Main PCB)

Power

GND

Œ DIC3-Pin26

Œ

◆ These are the waveforms of DVD-R150.
Caution There can be some differences (Voltage, Frequency, stc.) among cameras.

11-8

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Schematic Diagrams

11-9 DDR (Main PCB)

Power
GND

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11-9

Schematic Diagrams

11-10 DV_1394 (Main PCB)

Power
GND

Œ

Œ 1394_SCLK
(TIC1_Pin2)

◆ These are the waveforms of DVD-R150.
Caution There can be some differences (Voltage, Frequency, stc.) among cameras.

11-10

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Schematic Diagrams

11-11 Audio (Main PCB)

Vcc

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Audio

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11-11

Schematic Diagrams

11-12 Main Connector (Main PCB)
Power
GND
Video
Audio

Œ Y(Color-bar)
(CON2_Pin6)

´ Cb(Color-bar)
(CON2_Pin4)

ˇ Cr(Color-bar)
(CON2_Pin2)

¨ IEC958
(CON2_Pin24)

ˇ´Œ

◆ These are the waveforms of DVD-R150.
Caution There can be some differences
(Voltage, Frequency, stc.) among cameras.
¨

11-12

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Schematic Diagrams

11-13 HDMI (Main PCB)

Power
GND

Œ I2C_CLK

´Œ
´ I2C_DAT

¨
ˇ

ˇ IEC958

¨ VO_CLK

◆ These are the waveforms of DVD-R150.
Caution There can be some differences (Voltage, Frequency, stc.) among cameras.

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11-13

Schematic Diagrams

11-14 Sub and Key (Sub and Key PCB)

Power

11-14

Audio

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12. Operating Instructions

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12-1

Operating Instructions

12-2

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Operating Instructions

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12-3

Operating Instructions

12-4

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Operating Instructions

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12-5

Operating Instructions

12-6

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Operating Instructions

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12-7

Operating Instructions

12-8

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Operating Instructions

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12-9

Operating Instructions

12-10

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Operating Instructions

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12-11

Operating Instructions

12-12

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Operating Instructions

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12-13

Operating Instructions

12-14

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13. Circuit Operating Descriptions
13-1 Power
13-1-1 About S.M.P.S (Ringing Choke Converter Method)
Vout

Transformer
(Ns)
(Np)
–
+
(Vs)
(Vp)
+
–

Vreg
REGULATOR

+
+
Vin

Switch

ON/OFF Control

+
Vs switch
–
I switch

Fig. 13-1
◆Terms
1) 1st : Common power input to 1st winding.
2) 2nd : Circuit followings output winding of transformer.
3) f (Frequency) : Switching frequency (T : Switching cycle)
4) Duty : (Ton/T) x 100

13-1-2 Circuit description [FLY-Back RCC(Ringing Choke Converter)] Control
(a) AC Power Rectification/Smoothing Terminal
1) PADT1, PADT2, PADT3, PADT4 : Convert AC power to DC (Wave rectification).
2) PRCU1 : Smooth the voltage converted to DC.
3) PALT1, PALT2, PACT1, PACT2 : Noise removal at power input/output.
4) PLRU1 : Rush current limit resistance at the momemt of power cord insertion.
· Without PLRT1, the bridge diode might be damaged as the rush current increases.

Samsung Electronics

13-1

Circuit Operating Descriptions

(b) SNUBBER Circuit :
PSRZ1, PSRZ2, PSCX1, PSCZ2, PSDZ1

Vswitch
Inverted power
by leakage
inductance

1) Prevent residual high voltage at the terminals of
switch during switch off/Suppress noise.
High inverted power occurs at switch off,
because of the 1st winding of transformer :
(V=-L1 xdi/dt. L1 : Leakage Induction)
A very high residual voltage exist on both terminals
of PQIZ1 because dt is a very short.

dt

0

t
Toff

Fig. 13-2

2) SNUBBER circuit protects PQIZ1 from damage
through leakage voltage suppression by RC,
(Charges the leakage voltage to PSDZ1 and PSCX1
and discharges to PSRZ1, PSRZ2).
3) PSCZ2 : For noise removal

(c) PQIZ1 Vcc circuit
1) PQIZ1 Vcc : PVRL4, PVDL1, PVCL1
! Use the output of transformer as Vcc,because the current starts to flow into transformer while PQIZ1 is
active
@ Rectify to PVDL1 and smooth to PVCL1.
# Use the output of transformer as PQIZ1 Vcc : The loads are different before and after PQIZ1 driving.
(Vcc of PQIZ1 decreases below OFF voltage , using only the resistance dut to lode increase after PQIZ1
driving.)

(d) Feedback Control Circuit
TRANS(PQTZ1)

PPDF1

PPC1

ICE3B2065P

5.8V

PPLF1
PPCF3

PFRF4
PFRF1
PFRF5
PBIZ1

PFRF2
PFRF3

PFCF1

PFID1
PFRF6

Fig. 13-3
13-2

Samsung Electronics

Circuit Operating Descriptions

1) F/B terminal of PQIZ1 determines output duty cyle.
2) C-E (Collector-Emitter) of PQIZ1 and F/B potential of PQIZ1 are same.

13-1-3 Internal Block Diagram (Internal Block Diagram of S.M.P.S. Circuit)
3.0V Rectified
Smoothing Circuit

Smoothing
Circuit
Noise
Removal
(SNUBBER)

12V Rectified
Smoothing Circuit

Converter

5.4V Rectified
Smoothing Circuit

Rectified Circuit

Line Filter

3.3V Rectified
Smoothing Circuit

PWM Control
Circuit
(ICE3B2065P)

12V Rectified
VoltageCircuit

5V Rectified
VoltageCircuit

O
U
T
P
U
T

33V Rectified
Smoothing Circuit

Voltage
Detection
Circuit
Power IN
(110V)

Fig. 13-4

Samsung Electronics

13-3

Circuit Operating Descriptions

13-2 AV Codec

Fig. 13-5
· Main system control
· A/V Encoding/Decoding
· Transcoding/rating
· IEEE 1394 link layer function

13-4

· ATAPI interface with DVD-Multi Drive
· Analog Progressive/interlaced video output

Samsung Electronics

Circuit Operating Descriptions

13-2-1 GENERAL DESCRIPTION
SAMSUNG S5L3210 MPEG AV Codec is designed to provide a cost-effective, low power and high performance
DVD recorder solution for DVD-VR, DVD-Video, DVD-Audio & many of CD applications. To reduce total system
cost, S5L3210 also provides the following features: a front-end controller, a back-end decoder, a control CPU with
separate 4KB Instruction and 4KB Data Cache, improved audio DSPs, a programmable video encoder with a dual
output capability of interlaced and progressive scan, a DDR memory controller, 4-channel Timers with PWM, I/O
Ports, 6-channel 10-bit Video DACs, 2-channel PWM processors for Hi-fi Audio, 2-channel UARTs with handshake, IIC-BUS interface, IIS interface, SPI, ATAPI, IEEE1394, USB 2.0 Full & Low Speed Host I/F and PLL for
clock generation.

13-2-2 A/V Processor (DIC1) Functional Description
1) RISC processor architecture
· ARM946ES Core processor
· Fully 16/32-bit RISC architecture.
· Harvard cache architecture with separate 4KB Instruction and 4KB Data cache
· Protection unit to partition memory and set individual protection attributes for each partition
· Up to 160 MHz operating frequency
2) Memory controller
· Address space: 128M bytes for each bank (Total 1Gbyte space)
· Supports programmable 8/16-bit data bus width for ROM/SRAM interface.
· Supports 16-bit data bus width for DDR-SDRAM interface.
· 3 memory banks. - 2 memory banks for ROM, SRAM etc. - 1 memory banks for SDRAM
· Fully Programmable access cycles for all memory banks.
· Supports external wait signal to expand the bus cycle.
3) Cache memory
· 64 way set-associative cache with I-Cache (4KB) and D-Cache (4KB).
· 8-words per line with one valid bit and two dirty bits per line
· Pseudo random or round robin replacement algorithm.
· Write through or write back cache operation to update the main memory.
· The write buffer can hold 8 words of data and four address.
4) Clock & power manager
· Low power consumption
· On-chip PLLs
· Clock can be fed selectively to each function block by software.

Samsung Electronics

13-5

Circuit Operating Descriptions

5) Interrupt controller
· 62 interrupt sources(Watch dog timer, 4 Timers, UARTs, 8 External interrupts, IIC, IIS, SPI, IR,...)
· Edge detect mode on external interrupt source.
· Programmable polarity of rising and falling.
· Supports FIQ (Fast Interrupt request) for very urgent interrupt request.
6) Video pre-processor
· Noise Reduction by Motion-compensated Temporal Filtering.
· Bitmap Generation for Motion Estimation of MPEG Encoder.
· Scene Change Detection.
7) MPEG video encoder
· Encodes MPEG1 & MPEG2 video stream (MP@ML)
· Efficient Motion Estimation by reduced calculation and accurate Motion Vector Search
8) MPEG video decoder
· Decodes MPEG1, MPEG2 (MP@ML) & DivX/MPEG4 video stream(ASP)
· Error detection and autonomous error concealment.
9) Audio DSP
· Decodes Dolby AC-3, MPEG1, MPEG2, DTS and WMA
· Supports down mix
· MAC2424 for audio signal processing
- 24-bit high performance fixed-point DSP coprocessor, 24x24 MAC operation in 1 cycle
- 2 multiplier accumulator registers, 4 general accumulator registers, and 8 pointer registers

13-6

Samsung Electronics

Circuit Operating Descriptions

13-3 SERVO (DVP Multi Drive)
1) Pick-Up
Data in the disc is processed from the optical pick-up unit (OPU). OPU includes the Elantec chip (EL6912c)
which is a highly integrated laser diode driver designed to support multi-standard writable optical drives. This
chip also has an IV amplifier with concurrent read and write sampling. The architecture allows reprogramming
of the timers to support different media DVD or CD standards, and different speed.
2) A-Chip
A chip is RF processor. This module performs RF signal processing which includes RFIP, RFIN, AGC, RF equal
izer. This processor is able to detect tracking error, focus error and various signals such as CE, PE, SBAD,
DEFECT, BCA, MIRROR, Wobble, TZC, RC, and RECD.
3) C-Chip
C-Chip is composed of DP1, PRML and WS.
First, the Data processor1 (DP1) performs EFM/EFM+ Demodulation and data is stored in the buffer
memory in data processor2 (DP2). DVD data in this buffer is transferred to CSS/ATAPI through
error-correction code
(ECC), descramble process and error detection code (EDC).
Second, WS performs the following processes.
! Delay compensation using Shift register
@ Sample/Hold pulse generation
# I/V Gain Control
$ Providing clock for RF chip
% OPC Control signal generation
Lastly, PRML completes the adaptive EQ/VD and Digital PLL.
4) D-Chip
D-Chip consists of Servo DSP, DP2 and 1Mbit memory. Servo DSP is dealing with controlling the servo-mecha
nism in DVD recorder. Servo-DSP has the following features.
! Bulit-in 10Bit ADC(8ch), DAC(3ch) and PWM(7ch)
@ Step Motor Control Logic: Macro/Micro Step
# Track Counter: long distance velocity control direct seek
$ Shock/Defect detection
% Header (DVD-RAM)/Land Pre-Pit (DVD-R/RW) Detection
^ Several Servo Monitor Signal Detection
& RF IC Interface
* Micom Interface
( Digital Servo Control of focus, tracking, sled and seek
) Disc Auto-Detection
1 Automatic Adjustment of the offset, balance and gain of Focus and Tracking Signal
2 Direct Seek with Velocity Control
3 Step Motor Control: Macro Seek
4 De-Track and Lens Shift Detection and Compensation
5 Center Error Control
6 DVD Layer Jump
7 Tilt Detect and Compensation
DP2 performs High Speed ECC and CD DA Decoder.

Samsung Electronics

13-7

Circuit Operating Descriptions

5) ATAPI Controller
ATAPI (ATA Packet Interface) the standard interface protocol used to connect the CD/DVD Drive to IDE inter
face. Data from the front-end is processed to back-end through this ATAPI protocol. Sanyo chip (LC98600CTXB0) is utilized for ATAPI interface. LC98600CT-XB0 has the following features.
! ECC and EDC correction/addition for CD-ROM data
@ Subcode decoding/encoding
# Spindle servo control
$ CLV/CAV servo control using ATIP data
% ATIP decoding and CRC check functions
^ Providing random EFM output for PCA use
& High-accuracy write strategy signal output enabled (CD-R 52x)
* Buffer RAM can be accessed by the microcontroller through the LC98600CT-XB0
( Built-in ATA-PI(IDE) interface (supports Ultra DMA modes 0,1, and 2)
) 52x decoding speed/52x encoding speed supported with 33.8688Mhz
1 Maximum transfer speed PIO mode: 16.6 MB/s (with IORDY), Ultra-DMA: 66MB/s (with DMARQ)
2 User can freely set the CD main channel, C2 flag, and subcode areas in buffer RAM
3 Built-in batch transfer function for transferring (CD main channel, C2 flag, etc., in a single operation)
4 Built-in multi-transfer function (allows multiple blocks to be sent to the host automatically in a single
operation)

A.chip (RIC1)
FPD,PD,I/V amp

RF Signal
(AGC/EQ)

C.chip (CIC1)

D.chip (DIC1)

PRML
SERVO
Processor

HOST

Servo Error
(FE/TE/CE/PE
SBAD/RC/TILT)
ENDEC
Pick up

Miscellaneous
Signal
(DFT/LPP
/WOBBLE)

LD,LD Driver

ECC
Processor

Focus Actuator

ATAPI chip
(ZIC1)

Tracking Actuator
APC & OPC
WRITE
STRATEGY

TILT Actuator

Sled
Motor

Spindle
Motor

Tray
Motor

Motor
Driver

MICOM (MIC1)

Deck

Fig. 13-6

13-8

Samsung Electronics

Circuit Operating Descriptions

13-4 Video Input
13-4-1 Video Input Outline
The model specified in this book uses service manual is the two AV Video input. AV 1 Video input is CVBS1 & SVideo1 at the Rear Panel. AV 2 Video
input is CVBS2 at the Front Panel.
The analog Video signal select AV 1 or AV 2 by the IC601 (Front Micom).
TIC1 (Video Decoder) diverges from the 27MHz crystal, then generates ITU-R656 (10bits) and
27MHz clock. VIC1 (Video Decoder) does closed caption, copy guard detect processing and A/D conversion
of analog Video signal converted into 11bit Digital Video signal (ITU-R656 Format) is outputted via DIC1 (MPEG2
Decoder &Encoder with video Encoder) of digital part.

RF

CVBS

AV 1
(Rear)
Video
Input

CVBS 1

AV 2
(Front)
Video
Input

Y1
C1

MM1113
Analog MUX
IC702

CVBS
ITU-R656 10bit
27MHz

Video
Decoder
VIC1

CVBS2
Y

V_SYNC
/RSTAV

A/V CODEC
DIC1

SCL
SDA
C

Fig. 13-7

13-4-2 Analog Mux (MM1113)
IC702 is Analog Mux.
As Pin 2, 4 of the IC702 are controlled by the Front Micom, IC702 select RF OF CVBS(Pin1)
Line1 of CVBS[Pin3] and AV2 of CVBS[Pin 5].
The analog Video Signal of IC201 output is selected by the IC601 via VIC1(Video Decoder : TW9906) of analog
Video Input parts.

Samsung Electronics

13-9

Circuit Operating Descriptions

13-4-3 NTSC/PAL Video Decoder (TW9906 : Video Decoder)
The VIC1 (Video Decoder : TW9906) device is a high quality, single-chip digital video decoder that digitizes and
decodes all popular baseband analog video formats into digital component video. The VIC1 (Video Decoder :
TW9906) supports the analog-to-digital (A/D) conversion of component RGB and YPbPr signals, as well as the
A/D conversion and decoding of NTSC, PAL and SECAM composite and S-video into component YCbCr.
This VIC1 (Video Decoder : TW9906) includes four 10-bit 30-MSPS A/D converters. and A/D conversion of 10bit
analog Video signal converted into Digital Video signal (ITU-R656 Format) is outputted via DIC1 (MPEG2
Decoder & Encoder with video Encoder) of digital part.
The following output formats supply 10-bit 4:2:2 YCbCr to the DIC1 (MPEG2 Decoder & Encoder with video
Encoder) of digital part.
On CVBS and S-video inputs, the user can control video characteristics such as contrast, Brightness, saturation,
and hue via an I2C DIC1 port [PIN V17, V18] interface.
The TW9906 decoder includes methods for advanced vertical blanking interval (VBI) data retrieval. The VBI data
processor (VDP) slices, parses, and performs error checking on teletext, closed caption (CC), Copy Guard Detect
Processing and other VBI data.

13-10

Samsung Electronics

Circuit Operating Descriptions

13-5 Video Output
13-5-1 Outline
DIC1 (MPEG2 Decoder & Encoder with video Encoder) diverges from the 13.5MHz crystal, then generates
VSYNC and HSYNC.
DIC1 (MPEG2 Decoder & Encoder with video Encoder) does RGB encoding, copy guard processing and D/A
conversion of 10bit Video signal converted into analog signal is outputted via amplifer of
analog part.

CVBS
Y
A/V CODEC
DIC1

LOW
PASS
FILTER
(6MHz)

C
Y
Cb

6dB
AMP
&
75ohm
Drive

Cr

Y
C
Y
Cb

MM1692
VIC1

Front
Micom
IC601

Cr

PSO

Fig. 13-8

13-5-2 NTSC/PAL Digital
DIC1 inputted from pin E1 with 13.5MHz generates HSYNC and VSYNC which are based on video signal. DIC1
is synchronous signals with decoded video signal.
The above signals, which are CVBS (Composite Video Burst Synchronized), Y(S_Video), C(S_Video),
Y(Component)/G(Green), Cr(component)/R(Red), Cb(component)/B(Blue), are selectively outputted 480I(interlaced Video Output), 480P(progressive Video Output) by the Pront button DIC1 adopts 10bit D/A converter.
DIC1 perform video en-coding as well as copy protection.

Samsung Electronics

13-11

Circuit Operating Descriptions

13-5-3 Amplifier (MM1692)
VIC1 of JACK PCB is 6dB amplifier.
Based on CVBS signal, the final output level must be 2Vpp without 75ohm terminal resistance.
Because the level of video encoder output is only 1Vpp, the level is adjusted with the special
amplifier.
When mute of pin 5 is high active, if the pin is floating and connect to power, the output
signal is never outputted.
Y, C, Y(R), Cb(B), Cr(R) outputted from video encoder are inputted to VIC1 [Pin14, 16, 13, 12,
11] respectively. And CVBS Output[Pin 15] is made by Y & C Mixing signal.
The signal to which gain is adjusted by amplifier is outputted from jack via 75ohm Resistance
(VDR1,2,4,5,6,).

13-12

Samsung Electronics

Circuit Operating Descriptions

13-6 Audio
13-6-1 Input Block
This Model has two stereo line input terminals. and internal TV-audio from RF Tuner Block.
These three Analog audio signal source are converted to digital data by Input Block.
Input Block has a Multiplexer (IC203), A/D converter (AIC2).
IC203 change it’s output by selection control signal from IC601 (Front Micom).

13-6-2 Output Block
The model specified in this book uses service manual has two stereo analog line out terminal, and two digital output terminal.
Decoded signal by DIC1 is inputted to AIC1 (D/A Converter), then filtered and amplified by AIC4 (OP-Amp).
And the digital audio signal (IEC-958) is outputted in Optical/Coaxial (S/PDIF) terminal.

AV IN1
(Rear)

L1-in
R1-in
L2-in

AV IN2
(Front)
TV Audio
(from tuner
block)

L2-in

SCKI
AU5
PCM1803
(Audio A/D
Coverter)

IC203
BU4052
Multiplexer

BCK
LRCK
DOUT

RF-L

DIC1
S5L3210
A/V Processor

RF-R

IC601
(micro controller)

(Dolby AC-3
Encoder/Decoder)
AIC4
4560 OP-AMP

AV OUT
(Rear)

SCKI
BCK
L-out

AU2
PCM1742KE

R-out
(Audio D/A
Coverter)

LRCK
DOUT
ML
MC
MD

Optical
Out
Coaxial
Out

IEC958 DATA
Fig. 13-9

Samsung Electronics

13-13

Circuit Operating Descriptions

13-7 Tuner
1) Low Pass Filter & High Pass Filter
This consists of IF trap circuit and UHF & VHF separation circuit. If the input signal is IF (45.75MHz),
this filter
prevents interference.
2) Single tune
This consists of a filter circuit, RF AMF, impedance conversion circuit, image trap and a single tuning circuit. It
prevents noise and other interference signals. It is very important part which improves NF (noise figure) and
prevents the various of spurious signals.
3) RF AMF
RF AMF is made of FET (Field Effects Transistor). It is controlled by AGC coming from IF DEMOD block.
4) Double tune
It consists of a double tuning circuit to improve characteristic of rejection that results in a better band
characteristic.
5) Mixer IC (Mixer, OSC, PLL)
It consists a VHF and UHF OSC and Mixer circuit. We applied mixer to make better characteristic of rejection,
it shows especially various beat characteristic.
6) PLL IC
The PLL IC plays a role selection of Tuner channel. It was built-in three wire PLL IC, charge pump and band
driver.
The minimum of step frequency is 31.25KH z.

a
Fran
Modulafor

VHF
8.P.F

b

VHF
SingleTune

c VHF
RF Amp

d

VHF
Double Tune


e

3

~
1

~

IF Single

5

~

< +B >

OSC 8uffer

VHF OSC
7

8

4

9

10

Fram IF Sect lon

V V U
9 8 6
L

f PLL IC
Mix IC IC100

TO IF Sect lon

< IF >
12

IF Amp

Mixer

Fram IF Sectlon

H

1/8 Prescaler

Band Driver

Prog.Dirlder

Band Driver

OSC Amp

3

4MHz
15 X-tal
~ 1

2

Phese Code

3wice Bas
Recelver

VHF OCS
VHF
1 Charge Pump

L.P.F

VHF
Single Tune

VHF
-RF Amp

16

VHF Mixer
VHF
Double Tune

14

13

12

VHF OSC

^
PB

&
TU

* ( )
CLOCK DATA ENABLE

1
LOCK

Fig.13-10

13-14

Samsung Electronics

Circuit Operating Descriptions

13-8 IF
1) SAW FILTER
It passes only needed band of the signal that is converted to IF frequency and decrease the others band to
minimize the effect of adjacent channel.
2) RF AGC Control
It used adjusting to determine RF AGC working point in tuner.
3) VCO Tank
When VCO tank detects PLL, it makes the signal which sets a standard.
4) AFT (Auto Frequency Tuning)
AFT automatically controls the oscillator frequency in the tuner, so that it retains a constant level.
It is a quadrature detection type. The carrier, which is detected from video det is directly input to AFT.
The 90 degree delayed phase signal is input at the same time to AFT and, the results come out.
5) IF AMP
IF signal , which is selected in Saw filter, is amplified in IF amp frequency enough to be detected. The IF amp
has parallel inputs & outputs structure.

Lim Amp

1

d
4.5 MHz
Tunlng

AGC

2

b RF AGC Control

Video Det
Video Amp

4
From
Tuner Section

a SAM Filter
(IF Amp)

21

5
6

APC
Det

Pra
Amp

To Tuner Section

SIF filter
4.5MHz

24

FM Det

10

N.S.C

EQ.Amp
B/W

19

VCD

16

APC Tine
Const SW

Mix

SIF Trap

17

Lock Det

15

IF AGC

14

c
VCD Tank

RF AGC
11
AFT Tank

RF AGC Amp
AFT

12

To Tuner Section

3
+B

4
AUDIO OUT

5
AFT OUT

6
VIDEO OUT

Fig. 13-11

Samsung Electronics

13-15

Circuit Operating Descriptions

MEMO

13-16

Samsung Electronics

14. Reference Information
14-1 Introduction to DVD
14-1-1 The Definition of DVD
DVD is the next generation medium and is the acronym of the Digital Versatile Disc or thr Digital Video Disc,
which maximizes the saving density of the disk surface using the MPEG-2 compression technology to enable the
storage of 17G bytes of data on the same size CD.
1) 7 times the storage capacity of the conventional CD
- Minimized the track pitch and pit size to 1/2 of conventional CD.
- Uses red laser with short-wavelenght of 650nm (635nm).
DVD Vs. CD-ROM
CD-ROM

CD-R/RW

DVD-ROM

DVD-R/RW

DVD-RAM

1.2mm

1.2mm

0.6*2mm

0.6*2mm

0.6*2mm

0.45

0.45(0.5)

0.6

0.6

0.6

Laser wavelenght

780um

780um

650um

650um

650um

Track pitch

1.6pm

1.6pm

0.74pm

0.74pm

0.615pm

Capacity

0.65GB

0.65GB

4.7GB

4.7GB

4.7GB

Track structure

Pit train

Groove

Pit train

Groove

Land/Groove

Disc Thickness
Lens NA

2) Disc Formats
DVD consists of two 0.6mm discs attached together, enabling access to the upper and lower side of the disk,
and 4 sides could be used at maximum.

Samsung Electronics

14-1

Reference Information

14-1-2 DVD Types
FORMAT

TYPE

DVD-Video

Playback Only

DVD-ROM

Read Only

DVD-Audio

Playback Only

DVD-R

1 Time Recording
Rewritable

APPLICATIONS
High quality image and sound for movies and other video media.
Multi-functional, multi-media software that requires large storage capacity.
High quality sound that exceeds the CD, multi-channel Audio.
As with CD-R, write only once
This can be virtually used as hard-disk, with a random

DVD-RAM
(more than 100,000 times)
Rewritable

read-write access
Similar to DVD-RAM except than its technology features

DVD-RW
(About 1,000 times)

14-2

a separated read-write access more like phonograph than a hard disk.

Samsung Electronics

Reference Information

14-2 DVD-Video Format
14-2-1 Main Features
1) Able to store up to 160 minutes of Movie by utilizing the MPEG-2 compression technology. ( Aver. 133min.)
2) Enables more than 500 lines of horizontal resolution. (Class corresponding to the Master Tapes used in
broadcasting stations)
3) Provides Dolby Digital 5.1ch Surround 3D sound, which enables theater quality sound (NTSC area).
• For PAL areas, 1 of either MPEG-2 Audio or Dolby Digital must be selected.
4) Multi-Language
• Able to store up to 8 languages of dubbing.
• Able to store up to 32 subtitle languages.
5) Multi-Aspect Ratio
3TV Mode alternatives ; 16:9 Wide Screen (DVD Basic)/4:3 Pan & Scan/Letter Box.
6) Multi-Story
Possible to implement Interactive Viewing which enables the user to select the scenario.
7) Multi-Angle
Able to view the camera angle you selected among the scenes recorded with multiple camera angles.
Note ; The above media features must have the DVD Title that contains the appropriate contents to function
properly.

14-2-2 Audio & Video Specifications
Classification

VIDEO

DVD-Video

Video-CD

Compression

MPEG-2

MPEG-1

Pixel

720 x 480

352 x 240

Horizontal resolution

Max. 500 Lines

Max. 250 Lines

Compression rate

1/40

1/140

Transmission speed

Max. 9.8Mbps (variable)

1.15Mbps (fixed)

TV aspect

16:9 / 4:3

Audio

Max. 8 streams

Recording type
AUDIO

4:3
2CH stereo

Dolby Digital

Linear PCM

MPEG-1 Layer 2

Transmission rate

448Kbps/stream

6.144Mbps/stream

224Kbps

Channel

5.1CH/stream

8CH/stream

2CH

Sampling frequency

48KHz

16, 20, 24Bit/48, 96KHz

16Bit/44.1KHz

Samsung Electronics

LD
Analog
Max.420 Lines
Analog
4:3
2 Analog CH.
2 Digital CH.
(16Bit/44.1KHz)

or
1 Analog CH.
1 Stream of Dolby Digital
2 Digital CH.
(16Bit/44.1KHz)

14-3

Reference Information

14-2-3 Detailed Feature
DVD-Video Feature 1

When Developing the DVD Software, various addition and modification is possible.

As the storage capacity increases, the DVD-Video separates the main data and the additional data such as the
Multi-Function into different data areas, enabling the control of time-data ratio to provide the format that enables
the flexible Software development
• 1 Movie (3.5Mbps)
+ Subtitle (1 Language)
+ Surround Audio (1 Language)
= 160min storage (4.673Gbytes)
• 1 Movie (3.5Mbps)
+ Subtitle (4 Language)
+ Surround Audio (4 Language)
= 160min storage (4.680Gbytes)
• 1 Music Video (4Mbps)
+ 2ch High quality Audio (96kHz/24bit)
= 72min storage (4.648Gbytes)

DVD-Video Feature 2

Application of the MPEG-2 compression technology.

DVD-Video uses the variable compresion technology, the MPEG-2 to compress the moving image optimally, minimizing the Data loss to Provide a clear, natural screen while increasing the storage time.

• MPEG-2 (Variable compression : Max. 1/40)

DVD-Video

Video-CD

- Field unit compression.
- Compression rate change according to the amount of Data.
- Differentiates the still image and the moving image
compression rate, reducing Data loss and enables
efficient compression.

• MPEG-1 (Fixed compression : Max. 1/140)
- Frame unit compression.
- Compresses all data using the same ratio.
- Fast movements are jagged, and unnatural

14-4

Samsung Electronics

Reference Information

DVD-Video Feature 3

High quality surround audio.

DVD-Video can store the audio using the 5.1ch Dolby Digital compression or the advanced Liner PCM method,
providing the better-than-CD quality and theater like audio quality.
• DTS (Digital Theater System)
Home theatre and music playback in the home, DTS provides high quality 5.1-channel surround sound with
many extras not offered by other consumer formats. As well as handling DTS-branded releases from a growing
number of music labels and consumer software producers, DTS provides enhanced 6.1 matrix and DTS 6.1
discrete decoding that envelopes the listener in sound. DTS technology is featured in a wide cross section of
receiver/pre-amplifiers, DVD players and and add-on components from leading consumer audio vendors
• Dolby Digital (AC-3)
- Unlike the traditional Dolby pro-Logic method, the Dolby Digital method separates all 5 main channels
(Front L/R, Center, Surround (Rear) L/R)and the Sub woofer to provide live surround audio.
- Using the Down Mix method, the conventional Dolby Pro-Logic and Stereo are all compatible.
- Each separated channels are played back at CD quality sound. (Frequency band: 20Hz ~ 20KHz)
• Linear PCM (Pulse Code Modulation)
- Provides the high quality Digital sound without the audio data compression.
- Various Digital Recordings are possible as shown in the table to the right.

Sampling Frequency

Bit Rate
16bit

48KHz

20bit
24bit
16bit

96KHz

20bit
24bit

• Dolby Digital compatible Audio Mode
Channel Format
Audio Coding
Mode

Front
L

1/0

R

L

O

3/0

O

2/1

O

3/1

O

2/2

O

3/2

O

Mono
O

O

O

O

Remark

R

O

2/0

Samsung Electronics

C

Surround (Rear)

Stereo

O
O

Mono

O

Mono

Surround

O

O

O

O

O

O

14-5

Reference Information

DVD-Video Feature 4

Multi-Language

• Audio Dubbing - Max. 8 Languages
• Subtitle - Max. 32 Languages. Capable of storing, and selectiong.
• Linear PCM (Pulse Code Modulation)

DVD-Video Feature 5

Multi-Aspect

• Unlike the conventional VCD or LD, DVD-Video has the default of 16:9 Wide, and can be viewed using the
conventional 4:3 TV, enabling the expansion of viewer selection capabilities.
- 16 : 9 TV : Wide Mode (16:9 Wide Full Screen)
- 4 : 3 TV : Letter Box Mode, Pan & Scan Mode

Note ; This function is disc-dependent, may not work on all DVDs.

DVD-Video Feature 6

Multi-Angle

• Up to 9 angles of view may be stored, enabling the viewer to select a specific viewpoint at a given time.
--> Especially, for the Music Video and Sports Title, this provides a more lively image of the scene.

Note ; This function is disc-dependent, may not work on all DVDs.

14-6

Samsung Electronics

Reference Information

DVD-Video Feature 7

Multi-Story

• DVD-Video provides the enviroment suitable for the bi-directional Software develoment, providing multiple
scenarios. This feature enables the Multi-Story function.

OPTION

Parental Lock

• For the titles that are not suitable for children viewing, Parental Locks are set, requesting user defined
passwords for viewing
• Parential Locks may be set on specific frames of the Title, enabling the player to skip those frames during
playback.

COPYRIGHT

Regional Code & Macrovision

• Classify the world into 6 regions, and if the DVD Title and the Player’s “Reginal Code” do not agree, playback
is prohibited.
• Regionnal Coding is optional for the Soft developers (Region 0 All Code), but the Hardware developers
must adopt the appropriate regionnal code for sale.
- Region 1 : The United States and its territories, Canada.
- Region 2 : Europe, Japan, Greenland, Egypt, South Africa, the Middle East.
- Region 3 : Taiwan, Hongkong, Korea, South East Asia.
- Region 4 : Mexico, South America, Australia, New Zealand.
- Region 5 : Russia, Eastern Europe, India, Africa.
- Region 6 : China.
- Region 0 : Worldwide (All Code)

• Adoptation of the Macrovision System disables the copying on to other media.

Samsung Electronics

14-7

Reference Information

Remark

DVD-Video Authoring Process

• The image quality of the DVD-Video may vary accoring to the quality of the Master and the Authoring Process
- The image quality of the DVD-Video varies according to the Digital Mastering Source such as the
conventional LD, VCD, or Original Film.
- Different Authoring Process are used accoring to the Software developers, and this may affect the
DVD image quality.
• Authoring Process

14-8

Samsung Electronics

Reference Information

14-3 About IEEE1394
14-3-1 Comparison between IEEE-1394 and other digital interfaces
Since there are many different interfaces available, for example, RS422, RS644, and USB, vision system integ rators
are very likely to be confused when choos ing the right interface for their application. For the ideal design of a
vision syste m, it is vital to have the righ t bus/inte rface. To make things even more complex, ther e is no easy
answer such as IEEE-1394 is the best choice.
Furthermore, the new CameraLink standard, promoted by compan ies such as Puln ix, Basler AG, and many
frame grabb er companies, seems to be the stat e of the art interface. So why should IEEE-1394 be an alternative?
These questions are as complex as mostvision applicatio ns and there is no simple guideline .
Each of these interfaces offers many benefits and each of them has its individual drawbacks and restric tions. In
the table below, we try to give a brief comparison of the most popular interface systems.

Topology
Windows Driver
“Guaranteed”

RS 644 [1]

CameraLink

IEEE-1394

USB 2

Link

Link

Bus

Bus

Proprietary

Proprietary

Native

Native

(Win 200, Win 98)

(Win 200, Win 98)

~20 to 40 MByte/s

~255 MBytes/s

~32 MBytes/s[2]

~38 MBytes/s[2]

~10 m @ 40MHz

~10 meters

4.5 meters

5 meters

Bandwidth
Cable Length

~20 m @ 200MHz
Wires Needed for
8 Data Bits

22[3]

10

4

2

Parameter Port

No

1 KByte/s

~8 MBytes/s [2]

~9 MBytes/s [2]

[1] These specs are for a typical 8-bit camera application operating at 20 MHz or at 40 MHz.
[2] 80% of the bus bandwidth is used for image data and 20% is used for parameter data.
[3] 16 wires are used for data bit transfer and two wires each are used for the separate Line
Valid, Frame Valid, and Pixel Clock signals required with RS-644 transmission.
A careful comparison of the specifications shown in the table should be your first sele ction guide for the interface. For example, for an integ rator who needs very high speed, USB 2 and IEEE-1394 are not the first choice. On
the other hand, these buses are the ones to select in cases
where multiple cameras are needed or cost is a critical issue. Also, the user needs to be aware
that the D-Cam specification curre ntly does not specifically support Line Scan cameras.
However, the specification is open and line scan suppor t could be achieved via Format 7. As
for USB 2, it is still in its infancy in machine vision and we are not aware of any kind of machine vision support.

Samsung Electronics

14-9

Reference Information

14-3-2 Fiexibility and Cost Reduction
Many image processing application engineers face a familiar group of problems when designing and building a
system. The end user requires system flexib ility, simple adaptation, fast delivery times, and most importantly a
reasonable price. With conve ntional systems, whether analogor digital, engine ers must confine them selves to
certain combina tions of the existing cameras, frame grabbers, and software. The product choice for this system
config uration is limited. Unless the decision is made to use a high cost frame grabber that supports multiple cameras, sometimes known as multi-norm , it is usually not possible to operate camera s with different resolutions
from the same frame grabber.
For many applications, the introductio n of digital cameras is hindered by the cost specified by the end custom er,
however technically effective digital cameras may be. With the increa sed use of IEEE-1394 in the industrial image
processing business, many of these problems are solvable in a sure , safe , and cost effec tive way.
1) Hardware Cost Example
This example compares two simi lar vision systems. Each system uses four Megapixel
resolution digital cameras . The traditio nal solu tion consists of one frame grabber per camera, one parallel digital
data cable per camera, and one power supply per camera.
The 1394 solution requi res one hub and one interface card to connect the four cameras , along
with five ine xpensive 1394 cables. The 1394 cables carry power to the cameras directly from the computers internal power supply. (Note tha t not all compute rs are capab le of supplyi ng enough power for the cameras. In
some cases a separate power supply may be required.)

Traditional Solution
with multiple frame grabbers

Price

1394 Solution

Price

Four Cameras

18,000

Four 1394 Cameras

18,000

Four Frame Grabbers

4,400

One 1394 Interface Card

100

Four Cable

400

One 1394 Hub

120

Four power Supplies

320

Five Cables

150

Total

14-10

$23,120

Total

$18,370

Samsung Electronics

Reference Information

14-3-3 Application Examples
Today, there are already applications realizing the benefits of IEEE-1394 technology. For example, at one of our
customer sites, Basler was faced with a vision system which has the following specificatio ns:
The machine is a hig h-speed assembly system . Two indepe ndent robots take different par ts
(different in size, shape, and reflection) from a support unit and mount these parts on a mounting plate. Timing is
crucial, and in the worst case, a part must be taken from the tray every 100 ms. Accuracy of parts mounting is also
critical (0.5 mm) . To have a vision system inspecting these operations , 4 cameras (2 on each of the rob ots) are
needed:
- 2 low resolution Basler A302f camera s (640 x 480) for checking if the mounting plate is in place
- 2 high-resolution Basler A101f cameras (13 00 x 1030) for checking the components to be mounted.
Since most of the parts are differen t, the two A101f cameras must be reconfigured before almost every image
acquisit ion. In the worst case, the AOI, shutter, and som etim es gain need to be adjusted.
1) Solution used before Basler s Intervention
The customer used analog camera s with CCIR resolution (768 x 582) only. This drast ically restricted the number
of parts which could be mounted using the robots. Sin ce thes e camera s had no communication por t for configuration, adjusting the AOI was not possible and differ ences in reflection of the parts needed to be adjusted for by
driving a flash circuit. All cameras were interfaced into one frame grabber (one PC).
2) Possible solution wih digial cameas using RS 644 OR Camera Link
Using RS 644 or CameraLink based camera s, the customer would need one frame grabber for
each camera. It is very likely that the user would need two PCs (one for each robot). Changing the camera-configuration on the fly would require adv ance d grab ber cards since simple grabbers are not capable of easily changing their registers for different AOIs.
3) IEEE-1394 solution
All cameras are attached to a sing le interface card in the PC. The Basler A302f is only used when a new mounting
plate is pos itione d by the handler. In norm al operation , only the two Basler A101f cameras will be sending data
at the same time and they will be operating at about 10 FPS. This results in a data rate of about 27 MBytes/s,
which is well within the specification for IEEE-1394.
Since IEEE-1394 supports bi-directional communication between the camera and the PC, before each frame
capture , the PC can easily change resolution, gain , offset, shutter speed, or whatev er is required.
The IEEE-13 94 solution results in the se clea r advanta ges for the custom er:
- Onlyone PC,
- Only one inter face card (very inexpensive compare d with frame grabber cards ),
- Easy and inexpens ive cabl ing ,
- The system meet s the expect ations for spee d and accuracy,
- The range of inspect able parts is much bigger than with the old syste m.

Samsung Electronics

14-11

Reference Information

MEMO

14-12

Samsung Electronics

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