COVER DVDR150

User Manual: DVDR150

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DVD- RECORDER
Chassis : Nexus (4th Generation)
BASIC : DVD-R157
Application Model
: DVD-R150
Application Areas
:XAC, XAX, XAP, XAO, RCL, STR,
XAZ, XBG
SERVICE
ŒMulti format recording
DVD ±R / ±RW
´Multi format playback
DVD/ DVD-RAM/ DVD-RW/ DVD-R/ DVD+R/
DVD+RW/ CD/ CD-R/ CD-RW/ MP3/ JPEG/
DivX
ˇRecording mode
XP(1Hour)/ SP(2Hour)/ LP(4Hour)/ EP(6~8Hour)
¨Automatic Chapter product on
ˆ49mm Slim Design
ØEZ REC MODE
Manual
DVD-RECORDER Merit & Character regarding Product
SERVICE MANUAL DVD-R150
ELECTRONICS
© Samsung Electronics Co., Ltd. FEB. 2007
Printed in Korea
AK82-01226A
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
international and/or domestic law.
CONTENTS
1. Precautions 1-1 ~ 1-6
1-1 Safety Precaution (1-1)
1-2 Servicing Precautions (1-3)
1-3 ESD Precautions (1-4)
1-4 Handling the optical pick-up (1-5)
2. Product Specification 2-1 ~ 2-4
2-1 Reference Information (2-1)
2-2 Chassis Product Specification (2-2)
2-3 Option Product Specification (2-3)
3. Software Update 3-1 ~ 3-4
3-1 Drive Firmware Update (3-1)
3-2 Flash Update (Main PCB) (3-3)
4. Disassembly and Reassembly 4-1 ~ 4-6
4-1 Cabinet and PCB (4-1)
4-2 PCB Location (4-6)
5. Trouble Shooting 5-1 ~ 5-14
6. Exploded View and Parts List 6-1 ~ 6-4
6-1 Cabinet Assembly (6-2)
7. Electrical Parts List 7-1 ~ 7-12
8. Block Diagrams 8-1 ~ 8-6
8-1 All Block Diagram (8-2)
8-2 DIC1(S5L3210) Block Diagram (8-3)
8-3 AIC1(PCM1753) Block Diagram (8-4)
8-4 FIC1(TSB4AB1) Block Diagram (8-5)
8-5 VIC1(TW9906) Block Diagram (8-6)
9. Wiring Diagram 9-1 ~ 9-2
10. PCB Diagrams 10-1 ~ 10-8
10-1 Main PCB (10-2)
10-2 Jack PCB (10-4)
10-3 Key PCB (10-6)
10-4 Function PCB (10-7)
11. Schematic Diagrams 11-1 ~ 11-14
11-1 S.M.P.S (Jack PCB) (11-2)
11-2 AV Input (Jack PCB) (11-3)
11-3 Micom (Jack PCB) (11-4)
11-4 I/O (Jack PCB) (11-5)
11-6 CODEC (Main PCB) (11-6)
11-7 AV (Main PCB) (11-7)
11-8 ATAPI-Flash (Main PCB) (11-8)
11-9 DDR (Main PCB) (11-9)
11-10 DV_1394 (Main PCB) (11-10)
11-11 Audio (Main PCB) (11-11)
11-12 Main Connector (Main PCB) (11-12)
11-13 HDMI (Main PCB) (11-13)
11-14 Sub and Key (Sub and Key PCB) (11-14)
12. Operating Instructions 12-1 ~ 12-14
13. Circuit Operating Descriptions 13-1 ~ 13-16
13-1 Power (13-1)
13-2 AV Codec (13-4)
13-3 SERVO (DVP Multi Drive) (13-7)
13-4 Video Input (13-9)
13-5 Video Output (13-11)
13-6 Audio (13-13)
13-7 Tuner (13-14)
13-8 IF (13-15)
CONTENTS
14. Reference Information 14-1 ~ 14-12
14-1 Introduction to DVD (14-1)
14-2 DVD-Video format (14-3)
14-3 About IEEE1394 (14-9)
CONTENTS
Samsung Electronics 1-1
1. Precautions
1-1 Safety Precautions
1) Before returning an instrument to the customer,
always make a safety check of the entire instrument,
including, but not limited to, the following items:
(1) Be sure that no built-in protective devices are
defective or have been defeated during servicing.
(1)Protective shields are provided to protect both
the technician and the customer. Correctly replace
all missing protective shields, including any
removed for servicing convenience.
(2)When reinstalling the chassis and/or other as-
sembly in the cabinet, be sure to put back in place
all protective devices, including, but not limited to,
nonmetallic control knobs, insulating fish papers,
adjustment and compartment covers/shields, and
isolation resistor/capacitor networks. Do not oper-
ate this instrument or permit it to be operated with-
out all protective devices correctly installed and
functioning.
(2) Be sure that there are no cabinet openings through
which adults or children might be able to insert
their fingers and contact a hazardous voltage. Such
openings include, but are not limited to, excessive-
ly wide cabinet ventilation slots, and an improper-
ly fitted and/or incorrectly secured cabinet back
cover.
(3) Leakage Current Hot Check-With the instrument
completely reassembled, plug the AC line cord
directly into a 120V AC outlet. (Do not use an iso-
lation transformer during this test.) Use a leakage
current tester or a metering system that complies
with American National Standards institute (ANSI)
C101.1 Leakage Current for Appliances and
Underwriters Laboratories (UL) 1270 (40.7). With
the instrument’s AC switch first in the ON position
and then in the OFF position, measure from a
known earth ground (metal water pipe, conduit,
etc.) to all exposed metal parts of the instrument
(antennas, handle brackets, metal cabinets, screw-
heads, metallic overlays, control shafts, etc.), espe-
cially any exposed metal parts that offer an electri-
cal return path to the chassis.
Any current measured must not exceed 0.5mA.
Reverse the instrument power cord plug in the out-
let and repeat the test. See Fig. 1-1.
Any measurements not within the limits specified
herein indicate a potential shock hazard that must
be eliminated before returning the instrument to
the customer.
Fig. 1-1 AC Leakage Test
(4) Insulation Resistance Test Cold Check-(1) Unplug
the power supply cord and connect a jumper wire
between the two prongs of the plug. (2) Turn on the
power switch of the instrument. (3) Measure the
resistance with an ohmmeter between the
jumpered AC plug and all exposed metallic cabinet
parts on the instrument, such as screwheads,
antenna, control shafts, handle brackets, etc. When
an exposed metallic part has a return path to the
chassis, the reading should be between 1 and 5.2
megohm. When there is no return path to the chas-
sis, the reading must be infinite. If the reading is
not within the limits specified, there is the possibil-
ity of a shock hazard, and the instrument must be
repaired and rechecked before it is returned to the
customer. See Fig. 1-2.
Fig. 1-2 Insulation Resistance Test
DEVICE
UNDER
TEST
(READING SHOULD
NOT BE ABOVE
0.5mA)
LEAKAGE
CURRENT
TESTER
EARTH
GROUND
TEST ALL
EXPOSED METER
SURFACES
ALSO TEST WITH
PLUG REVERSED
(USING AC ADAPTER
PLUG AS REQUIRED)
2-WIRE CORD
Antenna
Terminal
Exposed
Metal Part
ohm ohmmeter
Precautions
1-2 Samsung Electronics
2) Read and comply with all caution and safety re-
lated notes on or inside the cabinet, or on the chas-
sis.
3) Design Alteration Warning-Do not alter or add to
the mechanical or electrical design of this instru-
ment. Design alterations and additions, including
but not limited to, circuit modifications and the
addition of items such as auxiliary audio output
connections, might alter the safety characteristics of
this instrument and create a hazard to the user. Any
design alterations or additions will make you, the
servicer, responsible for personal injury or property
damage resulting therefrom.
4) Observe original lead dress. Take extra care to
assure correct lead dress in the following areas:
(1) near sharp edges, (2) near thermally hot parts (be
sure that leads and components do not touch ther-
mally hot parts), (3) the AC supply, (4) high voltage,
and (5) antenna wiring. Always inspect in all areas
for pinched, out-of-place, or frayed wiring, Do not
change spacing between a component and the
printed-circuit board. Check the AC power cord for
damage.
5) Components, parts, and/or wiring that appear to
have overheated or that are otherwise damaged
should be replaced with components, parts and/ or
wiring that meet original specifications.
Additionally, determine the cause of overheating
and/or damage and, if necessary, take corrective
action to remove any potential safety hazard.
6) Product Safety Notice-Some electrical and mechani-
cal parts have special safety-related characteristics
which are often not evident from visual inspection,
nor can the protection they give necessarily be
obtained by replacing them with components rated
for higher voltage, wattage, etc. Parts that have spe-
cial safety characteristics are identified by shading,
an ( )or a ( )on schematics and parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire and/or
other hazards. Product safety is under review con-
tinuously and new instructions are issued whenev-
er appropriate.
Precautions
Samsung Electronics 1-3
1-2 Servicing Precautions
CAUTION : Before servicing units covered by this
service manual and its supplements, read and follow
the Safety Precautions section of this manual.
Note : If unforseen circumstances create conflict
between the following servicing precautions and any
of the safety precautions, always follow the safety pre-
cautions. Remember: Safety First.
1-2-1 General Servicing Precautions
(1) a. Always unplug the instrument’s AC power cord
from the AC power source before (1) re-moving
or reinstalling any component, circuit board,
module or any other instrument assembly, (2)
disconnecting any instrument electrical plug or
other electrical connection, (3) connecting a test
substitute in parallel with an electrolytic capaci-
tor in the instrument.
b. Do not defeat any plug/socket B+ voltage inter-
locks with which instruments covered by this
service manual might be equipped.
c. Do not apply AC power to this instrument and
/or any of its electrical assemblies unless all
solid-state device heat sinks are correctly in-
stalled.
d. Always connect a test instrument’s ground lead
to the instrument chassis ground before connect-
ing the test instrument positive lead. Always
remove the test instrument ground lead last.
Note : Refer to the Safety Precautions section ground
lead last.
(2) The service precautions are indicated or printed on
the cabinet, chassis or components. When servic-
ing, follow the printed or indicated service precau-
tions and service materials.
(3) The components used in the unit have a specified
flame resistance and dielectric strength.
When replacing components, use components
which have the same ratings. Components identi-
fied by shading, by( ) or by ( ) in the circuit dia-
gram are important for safety or for the characteris-
tics of the unit. Always replace them with the exact
replacement components.
(4) An insulation tube or tape is sometimes used and
some components are raised above the printed
wiring board for safety. The internal wiring is
sometimes clamped to prevent contact with heat-
ing components. Install such elements as they
were.
(5) After servicing, always check that the removed
screws, components, and wiring have been in-
stalled correctly and that the portion around the
serviced part has not been damaged and so on.
Further, check the insulation between the blades of
the attachment plug and accessible conductive
parts.
1-2-2 Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet
and turn the power ON. Connect the insulation resi-
stance meter (500V) to the blades of the attachment
plug. The insulation resistance between each blade of
the attachment plug and accessible conductive
parts(see note) should be more than 1 Megohm.
Note : Accessible conductive parts include metal pan-
els, input terminals, earphone jacks, etc.
Precautions
1-4 Samsung Electronics
1-3 ESD Precautions
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be dam-
aged easily by static electricity.
Such components commonly are called Electrostati-
cally Sensitive Devices(ESD). Examples of typical ESD
devices are integrated circuits and some field-effect
transistors and semiconductor chip components. The
following techniques should be used to help reduce
the incidence of component damage caused by static
electricity.
(1) Immediately before handling any semiconductor
component or semiconductor-equipped assembly,
drain off any electrostatic charge on your body by
touching a known earth ground. Alternatively,
obtain and wear a commercially available dis-
charging wrist strap device, which should be
removed for potential shock reasons prior to apply-
ing power to the unit under test.
(2) After removing an electrical assembly equipped
with ESD devices, place the assembly on a conduc-
tive surface such as aluminum foil, to prevent elec-
trostatic charge buildup or exposure of the assem-
bly.
(3) Use only a grounded-tip soldering iron to solder or
unsolder ESD devices.
(4) Use only an anti-static solder removal devices.
Some solder removal devices not classified as
“anti-static” can generate electrical charges suffi-
cient to damage ESD devices.
(5) Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage
ESD devices.
(6) Do not remove a replacement ESD device from its
protective package until immediately before your
are ready to install it.(Most replacement ESD
devices are packaged with leads electrically short-
ed together by conductive foam, aluminum foil or
comparable conductive materials).
(7) Immediately before removing the protective ma-
terials from the leads of a replacement ESD device,
touch the protective material to the chassis or cir-
cuit assembly into which the device will be
installed.
CAUTION : Be sure no power is applied to the ch-
assis or circuit, and observe all other safety precau-
tions.
(8) Minimize bodily motions when handling unpack-
aged replacement ESD devices. (Otherwise harm-
less motion such as the brushing together of your
clothes fabric or the lifting of your foot from a car-
peted floor can generate static electricity sufficient
to damage an ESD device).
Precautions
Samsung Electronics 1-5
1-4 Handling the optical pick-up
The laser diode in the optical pick up may suffer elec-
trostatic breakdown because of potential static elec-
tricity from clothing and your body.
The following method is recommended.
(1) Place a conductive sheet on the work bench (The
black sheet used for wrapping repair parts.)
(2) Place the set on the conductive sheet so that the
chassis is grounded to the sheet.
(3) Place your hands on the conductive sheet(This
gives them the same ground as the sheet.)
(4) Remove the optical pick up block
(5) Perform work on top of the conductive sheet. Be
careful not to let your clothes or any other static
sources to touch the unit.
◆Be sure to put on a wrist strap grounded to the
sheet.
◆Be sure to lay a conductive sheet made of copper
etc. Which is grounded to the table.
Fig.1-3
(6) Short the short terminal on the PCB, which is in-
side the Pick-Up ASS’Y, before replacing the Pick-
Up. (The short terminal is shorted when the Pick-
Up Ass’y is being lifted or moved.)
(7) After replacing the Pick-up, open the short termi-
nal on the PCB.
THE UNIT
WRIST-STRAP
FOR GROUNDING
1M
1M CONDUCTIVE SHEET
Precautions
1-6 Samsung Electronics
MEMO
Power requirements 120V AC,60Hz
Power consumption 19Watts
General Weight 5.1 IB
Dimensions 16.9inch(W) x 8.5inch(D) x 1.9inch(H)
Operating temp +41°F to 95°F
Other conditions Keep level when operating. Less than 75% operating humidity
Video (1,2) 1.0 V p-p at 75ohm load, sync negative
Input S-Video input (Y:1.0Vp-p, C: 0.286Vp-p at 75ohm load)
Audio (1,2) Max. Audio input level : 2Vrms
DV Input IEEE 1394(4p) compatible jack
Audio output jacks 1,2
Optical/coaxial digital audio output
Audio
Full scale analog output level : 2Vrms
Output Video output jacks 1,
S-Video output 1 (Y: 1.0Vp-p, C:0.286Vp-p at 75 ohm load)
Video
Component output (Y: 1.0Vp-p ,Pb:0.70Vp-p, Pr:0.70Vp-p at 75ohm load)
Picture compression format MPEG-II
Audio compression format Dolby digital 2ch/256kbps
Recording Recording Quality XP (about 8 Mbps), SP (about 4 Mbps), LP (about 2 Mbps),
EP (about 1.2 Mbps), FR (about 1.2 Mbps to 8Mbps)
Audio frequency characteristics 20 Hz ~ 20 KHz
Samsung Electronics 2-1
2. Product Specification
2-1 Product Specification
General Model Name DVD-R135 DVD-R150
Function Standard Standard
COLOR SYSTEM NTSC NTSC
BROADCAST SYSTEM M M
AUTO CLOCK O -
DVD-RAM - O
DVD-R O O
DVD-RW O O
VIDEO MPEG-2 MPEG-2
AUDIO 2ch 2ch
DVD +R - -
DVD +RW - -
Flexible Recording O O
OTR O O
Time Slip - -
Video Plus+/Show View/G-Code -/- -/-
Quick Dubbing - -
EPG(Gemstar) - -
CBC(CABLE BOX CONTROL) - -
Play List O O
Auto Chaptering O O
JPEG Browser with BG music - O
DV Input O O
HDMI O -
DVD-RAM/-R/-RW/+R/+RW O O
DVD-Video/VCD/CD-DA O/-/O O/-/O
CD-R/RW O/O O/O
Music CD O O
Divx O O
Multi Memory Card - -
Progressive Scan Output O O
Upscaling(720P/1080i) O -
Video Input 2ea 2ea
Video Output 1ea 1ea
S-Video Input 1ea 1ea
S-Video Output 1ea 1ea
Component Output 1ea 1ea
HDMI Output 1ea -
Analog Audio Input(L/R) 2sets 2sets
Analog Audio Output(L/R) 2sets 2sets
Optical/Coaxial O/O O/O
CBC - -
Panel disply LED Module LED Module
REMOCON Multi 47key Multi 47key
IB English English/French
Size: Net(W x H x D) 430X49.5X210 430X95X215
Weigh 2.3Kg 2.3Kg
Product Specification
2-2 Samsung Electronics
2-2 Chassis Product Specification
DVD-R150
Chassis
Info
RECORDER
FUNCTION
SYSTEM
SUB
FUNCTION
PLAYBACK
FUNCTION
N/OUT
ETS
Product Specification
Samsung Electronics 2-3
2-3 Option Product Specification
Description Fig Description Parts No Remark
Remote
Control
Batteries for
Remote Control
AK59-00061E
AC43-12002H
Model Standard of
DVD-R150/XAC
Model Standard of
DVD-R150/XAC
S.N.A
Model Standard of
DVD-R150/XAC
Model Standard of
DVD-R150/XAC
S.N.A
Model Standard of
DVD-R150/XAC
AK68-01316A
AK68-01314A
AC39-00073A
User’s Manual
Quick Guide
Video/Audio
Cable
Product Specification
2-4 Samsung Electronics
MEMO
Samsung Electronics 3-1
3. Software Update
3-1 Drive Firmware Update
3-1-1 Introduction
When you can not record and play on specific recording media (especially on newly available DVD-RW or DVD-R).
3-1-2 How to make an update disc
• Write the downloaded file onto a blank CD-R or CD-RW disc, using the following settings :
1) Download the software update file from the samsung internet site. (www.samsung.com)
2) Write the file to disc using the CD-RW of your computer.
• Recommended Application Program
- Nero Burning / Easy CD Creator ..etc
• Option
- Extension name : “*.SMD”
- Multisession : No Multisession
- File name lenght : Max. of 11 = 8 + 3
- Character set : ISO 9660 or Joliet Format
- CD Close & Disc at once
N O T E
It is very important : please read the below notice below before updating your unit.
The following events may interrupt the update process and MAY RESULT IN PERMANENT DAMAGE TO THE UNIT WHILE UPDATING
!Unplugging the power cord.
@Power Outage.
#Dirt or Scratches on the disc.
$Opening a disc tray during processing.
WARNING
3-2
Software Update
Samsung Electronics
Fig. 3-1
* If you don’t see the message above, try another disc. Generally, this is caused by disc quality and by disc creating problem.
4) Press the ENTER button on the remote control (Fig. 3-2).
Fig.3-3
5) It takes about 1~2 minutes to complete the update.
The message below will be displayed in the screen after update is completed and the tray will open automatically.
Fig. 3-4
6) After removing the update disc, turn off the unit with power button.
And there after turn on the unit with power button and then the will be closed.
The drive firmware is now completed.
Atfer checking old and new version, select “Yes” or “No”
with “” or “ ” on the remote control.
* The Version is indicated by “XX.X modelname”
You will see “LOAD” on FLT Display.
Fig. 3-5
1) Press OPEN/CLOSE to open the disc tray.
2) Insert the update CD-R disc with the software update, label
facing up.
3) Press OPEN/CLOSE to close the disc tray.
* It takes about 1~2 minites before the mesage below appears.
Fig. 3-2 Remote Control
Software Update
3-3
Samsung Electronics
3-2 Flash Update (Main PCB)
3-2-1 Introduction
When you encounter a problem which is not related to the DVD drive.
3-2-2 How to make an update disc
Write the downloaded file onto a blank CD-R or CD-RW disc, using the following settings :
1) Download the software update file from the samsung internet site. (www.samsung.com)
2) Write the file to disc using the CD-RW of your computer.
• Recommended Application Program
- Nero Burning / Easy CD Creator ..etc
• Option
- Multisession : No Multisession
- CD close & disc at once
- ISO 9660 or joliet format
- Extension name : “*.RUF”
• In order to increase dise playability, add a dummy file (over 100MB) together with the latest program.
(The dummy file can be used any kind of file except MP3 file etc which can be played in the unit and we recommend to use a file whin
extension name as “*.dmy”, which can be changed from original one.)
N O T E
It is very important : please read the below notice below before updating your unit.
The followong events may interrupt the update process and MAY RESULT IN PERMANENT DAMAGE TO THE UNIT WHILE UPDATING
!Unplugging the power cord.
@Power Outage.
#Dirt or Scratches on the disc.
$Opening a disc tray during processing.
WARNING
3-4
Software Update
Samsung Electronics
Fig. 3-6
* If you don’t see the message above, try another disc.
Generally, this is caused by disc quality and by disc creating problem.
4) Press the ENTER button on the remote control (Fig. 3-7).
Fig. 3-8
5) It takes about 5 minutes to complete the update.
The message below will be displayed in the screen after update is completed and the tray will open automatically.
Fig. 3-9
6) After removing the update disc, turn off the unit with power button.
And there after turn on the unit with power button and then the will be closed.
The Flash update is now completed.
* If the message to the left isn’t displayed after 10minutes
and the unit is no longer functioning properly, contact a
samsung authorized service center.
Atfer checking old and new version, select “Yes” or “No”
with “” or “ ” on the remote control.
* The Version is indicated by “YYMMDD.xx modelname”
1) Press OPEN/CLOSE to open the disc tray.
2) Insert the update CD-R disc with the software update, label
facing up.
3) Press OPEN/CLOSE to close the disc tray.
Fig. 3-7 Remote Control
Samsung Electronics 4-1
4. Disassembly and Reassembly
4-1 Cabinet and PCB
4-1-1 Top Cabinet Removal
1) Remove 5 Screws Œ, ´, ˇ.
2) Lift up the Top Cabinet in direction of arrow.
Fig. 4-1 Top Cabinet Removal
Note : Reassembly in reverse order.
´1 SCREW
(3 x 10 B)
Œ3 SCREWS
(3 x 10 B)
ˇ1 SCREW
(3 x 10 B)
CABINET
4-2 Samsung Electronics
Disassembly and Reaasembly
Fig. 4-2 Ass’y Front-Cabinet Removal
4-1-2 Ass’y Front-Cabinet Removal
1) Release 6 Hooks Œ, ´, ˇ,¨ and Ass’y Front-Cabinet ˆ.
Œ1 HOOK ¨2 HOOKS
ˇ2 HOOKS
´1 HOOK
ˆASS’Y FRONT-CABINET
Disassembly and Reaasembly
Samsung Electronics 4-3
4-1-3 Ass’y Deck Removal
1) Remove 4 Screws Œ, ´ from the Ass’y Deck ˇand lift it up.
Fig. 4-3 Ass’y Deck Removal
ˇASS’Y DECK
´2 SCREWS
(3 x 10 W)
Œ2 SCREWS
(3 x 8 W)
4-4 Samsung Electronics
Disassembly and Reaasembly
Fig. 4-4 Main PCB Removal
4-1-4 Main PCB Removal
1) Remove 2 Screws Œ, from the Main PCB ´ and lift it up.
´MAIN PCB
Œ2 SCREWS
(3 x 10 W)
Disassembly and Reaasembly
Samsung Electronics 4-5
4-1-5 Jack PCB and Sub PCB Removal
1) Remove 5 Screws Œ, ´ from the Jack PCB ˇ and lift it up.
2) Remove 1 Screw ¨ from the Sub PCB ˆ and lift it up.
Fig. 4-5 Jack PCB and Sub PCB Removal
ˇJACK PCB
ˆSUB PCB
Œ4 SCREWS
(3 x 6 W)
¨1 SCREW
(3 x 6 W)
´1 SCREW
(3 x 6 W)
4-6 Samsung Electronics
Disassembly and Reaasembly
4-2 PCB Location
Fig. 4-6 PCB Location
JACK PCB
SUB PCB
MAIN PCB
Samsung Electronics 5-1
5. Trouble Shooting
NO Power Detected
(Stand by LED OFF)
PAFT1 is normal?
PADT1~PADT4
SHORT and OPEN
Are normal?
Is there voitage at
PQIZ1[Pin 5]?(Over 10V)
Operation of PQIZ1 is
Normal?
Check feed back
PQIZ1[PIN 3] Is 5.8V
Change fuse
Change PQIZ1 IC.
Replace PQIZ1
Change short circuited or
opened parts
No
Yes
No
Yes
No
Yes
No
Yes
Trouble Shooting
5-2 Samsung Electronics
There's no Digital Audio Out
Check Current Digital Audio
Setting is PCM.
ChecK Digital
AUDIO DATA at pin 24 of
CON2(MAIN PCB)
Check 5V AVJ5
Check the Cable
Set audio setting to
Bitstream in customer
menu.
No
Yes
No
Yes
No
Yes
Replace Main PCB
Replace AVJ5
Check the A/V Receiver
can Decode Current
Bit-Steam
No
Yes
IEC-958 (Pin24 of CON2)
Trouble Shooting
Samsung Electronics 5-3
CVBS (Video) output error
PIN 12 of
CN3 of Jack PCB
or CN2 of Main PCB has
1V pk-pk level?
Check the DIC1 on MAIN PCB
No
Yes
Power is Normal(5v)
at IC801[pin24, 29]?
Check the connection between
IC801[pin24, 29] and Power line
(FL1, PPIF2).
Check the connection between
IC801 and output jack.
No
Yes
Check pin25 of the
IC801 1V p-p level?
Check the connection between
IC801(Pin21,22) and IC601(Pin16,17).
Check IC801 peripheral circuit.
No
Yes
Video signal of
About P-P1V appears at
Output Jack?
Check the RCA Cable
No
Yes
Check pin7 of the
IC801 1V p-p level?
Check the connection between
12Pin in CN3 Of Jack PCB and IC801
No
Yes
CVBS (Pin12 of CON2)
Trouble Shooting
5-4 Samsung Electronics
S-Video output error
Pin10 and
Pin8 in CN3 of Jack PCB or
CON2 of Main PCB has *
normal level?
Check the DIC1 on MAIN PCB
Check the connection between
VIC1[pin1] and Power line (PPLI1,
PPII1).
Check the connection between
VIC1(PIN5) and IC601(PIN89).
Check VIC1 peripheral circuit.
Check the connection between
VIC1 and output jack.
Check the connection between
Pin10 and Pin8 in CN3 Of JACK PCB
and VIC1
No
Yes
Analog signals are
Inputted normally
VIC1(pin4,2)
No
Yes
Power is
Normal(5v) at VIC1(pin1)?
No
Yes
Pin5 in VIC1 is
In high state?
No
Yes
Video signal of
About P-P1V appears at
Output Jack?
Check the RCA cable
No
Yes Y (Pin10 of Main CON2
Pin10 of Jack CN3)
C (Pin8 of Main CON2
Pin10 of Jack CN3)
# Nomal level
: pin 10 is 1Vpk-pk
pin 8 is 0.28V on color burst
Trouble Shooting
Samsung Electronics 5-5
Check Pin 24, 29 in IC801
of input power(5V).
AV2 CVBS Video Input Error
Pin 28 In IC801
Has about p-p 1V level? Check the connection between
Pin 28 in IC801 and L2 Pin-Jack.
No
Yes
Pin5 In IC801
Has about p-p 1V signal?
A
No
Yes GCLK (Pin5 of Main VIC1)
Trouble Shooting
5-6 Samsung Electronics
AV1 CVBS Video Input Error
Pin 13 In IC801
Has about p-p 1V level? Check the connection between
Pin 13 in IC801 and L1 Pin-Jack.
No
Yes
Pin 5 In IC801
Has about p-p 1V signal?
Check Pin 24, 29 in IC801
of input power(5V).
No
Yes
Check Pin21,22
in IC801 of input
SDL/SDA Data
Check the connection between Pin 21 and
Pin 22 in IC801 and Pin 17 and 18 in IC601.
No
Yes
Pin 7 in IC801
has about p-p 1V
Signal?
Check DVD Main PCB
No
Yes
Pin 25 in IC801
has about p-p 1V
Signal?
No problem
Check the IC801
No
Yes CVBS_IN(Pin38 of Main VIC1)
A
Trouble Shooting
Samsung Electronics 5-7
AV1 S-Video Video Input Error
Pin 36 and 42
in VIC1 of DVD MainPCB has
*normal level?
Change DVD Main PCB
Check the connection between
Pin 36 and 42 in VIC1 of DVD
Main PCB and L1 S-Video Jack.
Check VIC1 of DVD Main PCB
peripheral circuit.
No
Yes
Pin40 and pin
54~43 in VIC1 of DVD
Main PCB has Clock and Digital
Video Signal normal
form ?
No
Yes
# Nomal level
: pin 35 is 1Vpk-pk
pin 42 is 0.28V on color burst
Y_IN (Pin36 of Main VIC1)
C_IN (Pin42 of Main VIC1)
Trouble Shooting
5-8 Samsung Electronics
Component output error
Pin2/4/6 in CN3 of
Jack PCB or CON2 of Main PCB
has * normal level?
Check the DIC1 on MAIN B/D.
Check the connection between
Pin2/4/6 in CN3 Of JACK PCB
and VIC1(pin6/8/9)
Check the connection between
VIC1[pin1] and Power line (PPLI1,PPII1).
Check the connection between
VIC1(PIN3) and IC601(PIN89).
Check VIC1 peripheral circuit.
Check the connection between
VIC1 and output jack.
# Nomal level
: pin 6 is 1Vpk-pk
pin 2/4 is + 0.35V
No
Yes
Analog signals
are Inputted normally
VIC1(pin6/8/9)
No
Yes
Power is
Normal(5v) at
VIC1(pin1)?
No
Yes
Pin13 in VIC1 is
In high state?
No
Yes
Video signal of
About 1V pk-pk appears at
Output Jack?
Check the RCA cable
No
Yes
Y_out (Pin6 of Main CON2
Pin6 of Jack CN3)
Pb_out (Pin4 of Main CON2
Pin4 of Jack CN3)
Pb_out (Pin2 of Main CON2
Pin2 of Jack CN3)
Trouble Shooting
Samsung Electronics 5-9
Audio Input is not Recording
Check the select
signal pin21,22of IC801
(JACK PCB)
Check pin 17,18(5V) of the
Front Micom IC601 (JACK
PCB)
Check SMPS
Replace Main PCB
Replace Main PCB
No
Yes
Check all the 12Vcc
pin 14 of IC801 and 12Vcc pin 8
of AIC4(JACK).
No
Yes
Check the 5V pin5 of
DIC1 (MAIN PCB)
No
Yes
Check Digital clock
and data pin 116,117,118,119 of
DIC1(MAIN PCB)
Check the passive parts
around jack pin.
No
Yes
I2S_LRCK (Pin116 of DIC1)
I2S_BCK (Pin117 of DIC1)
I2S_MCK (Pin118 of DIC1)
I2S_DATA (Pin119 of DIC1)
Trouble Shooting
5-10 Samsung Electronics
There is no Audio Output
Check he audio
signal AR413 and AR473
(JACK PCB)
Check the Low state pin22 of the
Front Micom IC601(Jack PCB)
No
Yes
Check all
the 5V pin6of AIC1
(MAIN PCB)
Check SMPS
Replace Main PCB
Replace MAIN PCB
No
Yes
Check the audio
signal pin7pin8 of AIC1
(MAIN PCB)
No
Yes
Check digital clock
anddata pin1, 2, 3, 16 of AIC1
(MAIN PCB)
Check the passive parts
arond Jack pin.
No
Yes Digital Audio Data (Pin2 of Main AIC1)
Trouble Shooting
Samsung Electronics 5-11
Disc Ioading error
Are Main
and deck power OK?
(5v, 12v) Check he power
Reinsert FFC cable correctly
Change the Main board
No
Yes
Is the 40pin
FFC cable(betweenmain & deck)
inserted correctly?
No
Yes
Is the wavefrom
of DIC3 pin26 normal?
(MAIN PCB)
Change the deck
No
Yes DIC3-Pin26
Trouble Shooting
5-12 Samsung Electronics
Remocon Error
KRMC1(pin1) signal
is OK? (SMPS PCB)
Check the power(pin2) line
orchange KRMC1.
Check the signal line or surrounding
elements.
No
Yes
IC601(pin5) signal
is OK? (Jack PCB)
Change IC601 or
surrounding elements
No
Yes
Samsung Electronics 6-1
6. Exploded View and Parts List
6-1 Cabinet Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-2
Exploded Views and Parts List
6-2 Samsung Electronics
6-1 Cabinet Assembly
W001
W009
W200
W275
P002
H001
P005
P022
C001
C002
P007
A001
P025
W001
W001
W001
W009
W009
W275
C015
W268
A001 AK59-00061E REMOCON-ASSY;DVD-R150/XAX,SEC,197.5 1 SA
C001 AK97-01889B ASSY-PANEL FRONT;HIPS94HB,DVD-R150/ 1 SA
C002 AK64-01928B DOOR-TRAY;DVD-R155,ABS 94HB,T2.5,H1 1 SA
C015 AK64-01896A CABINET-TOP;DVD-R157/XAA,TM6524,T0. 1 SA
H001 AK97-01883B ASSY-LOADER;-,DVD-R150,RAM Multi 1 SA
P002 AK92-01381A ASSY PCB-MAIN DVD;DVD-R150/XAC,- 1 SA
P005 AK92-01326A ASSY PCB-FUNCTION;DVD-R157/XAA,Func 1 SA
P007 AK97-01947A ASSY-R157 KEY;-,R157/XAA,NEXUS 1 SA
P022 AK92-01373A ASSY PCB-JACK I/O;DVD-R155/XAC,JACK 1 SA
P025 AC39-10200N CBF-POWER CORD;AT,US,EP2/Y,HOUSING( 1 SA
W001 6003-000275 SCREW-TAPTITE;BH,+,-,B,M3,L10,ZPC(B 5 SA
W009 6003-000276 SCREW-TAPTITE;BH,+,-,B,M3,L10,ZPC(W 8 SA
W200 6003-001375 SCREW-TAPTITE;BH,+,-,B,M3,L8,ZPC(WH 2 SA
W268 6003-000254 SCREW-TAPTITE;BH,+,-,S,M3,L6,ZPC(WH 1 SA
W275 6003-001561 SCREW-TAPTITE;BH,+,-,B,M3,L6,ZPC(WH 5 SA
Exploded Views and Parts List
6-3
Samsung Electronics
Loc. No Parts No. Description ; Specification Q ty S.N.A Remark
Exploded Views and Parts List
6-4 Samsung Electronics
MEMO
P002 AK92-01381A ASSY PCB-MAIN DVD;DVD-R150/XAC 1 SA
AC1 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
AC18 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
AE1 2402-001096 C-AL,SMD;220UF,20%,16V,GP,TP,6 1 SA
AE2 2402-000176 C-AL,SMD;10uF,20%,16V,GP,TP,4. 1 SA
AIC1 1002-001395 IC-D/A CONVERTER;PCM1753,24Bit 1 SA
AL1 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
CC1 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
CC2 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
CC3 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
CC4 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
CE1 2402-001248 C-AL,SMD;220UF,20%,6.3V,-,TP,6 1 SA
CE3 2402-001059 C-AL,SMD;220•ÏF,20%,6.3V,-,TP, 1 SA
CN5 3708-001935 CONNECTOR-FPC/FFC/PIC;40P,0.5m 1 SA
CON1 3710-002445 SOCKET-BOARD TO BOARD;16P,2R,2 1 SA
CON2 3710-002075 SOCKET-BOARD TO BOARD;30P,2R,2 1 SA
CR1 2007-001323 R-CHIP;3KOHM,5%,1/16W,TP,1005 1 SA
CR10 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
CR11 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
CR12 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
CR2 2007-000138 R-CHIP;100ohm,5%,1/16W,TP,1005 1 SA
CR3 2007-001320 R-CHIP;1.8Kohm,5%,1/16W,TP,100 1 SA
CR4 2007-001325 R-CHIP;3.3Kohm,5%,1/16W,TP,100 1 SA
DC1 2203-000386 C-CER,CHIP;0.015nF,5%,50V,C0G, 1 SA
DC15 2203-005138 C-CER,CHIP;1.8nF,10%,50V,X7R,1 1 SA
DC16 2203-005138 C-CER,CHIP;1.8nF,10%,50V,X7R,1 1 SA
DC17 2203-005138 C-CER,CHIP;1.8nF,10%,50V,X7R,1 1 SA
DC18 2203-005138 C-CER,CHIP;1.8nF,10%,50V,X7R,1 1 SA
DC2 2203-000330 C-CER,CHIP;0.012nF,5%,50V,C0G, 1 SA
DC20 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC22 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC23 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC24 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC25 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC26 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC27 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC3 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC4 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC50 2203-005481 C-CER,CHIP;47nF,10%,10V,X7R,TP 1 SA
DC51 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC52 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC53 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC54 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC56 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC57 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC58 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC59 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC6 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC60 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC61 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC62 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC63 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC64 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC65 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC66 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC67 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC68 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC69 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC7 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC70 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC71 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC72 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC73 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC74 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC75 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC76 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC77 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC78 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC79 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC8 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC80 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC81 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC82 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC83 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC84 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC85 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC86 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC89 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC90 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC91 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC92 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC93 2203-000311 C-CER,CHIP;0.12nF,5%,50V,C0G,1 1 SA
DC94 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC95 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC96 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DC97 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
DE2 2402-000007 C-AL,SMD;22uF,20%,6.3V,GP,TP,4 1 SA
DE5 2402-001248 C-AL,SMD;220UF,20%,6.3V,-,TP,6 1 SA
DE7 2402-001248 C-AL,SMD;220UF,20%,6.3V,-,TP,6 1 SA
DE8 2402-001248 C-AL,SMD;220UF,20%,6.3V,-,TP,6 1 SA
DIC1 1205-002844 IC-CODEC;S5L3210,LQFP,256P,28x 1 SA
DIC2 1105-001563 IC-DRAM;HYB25D256160CE-6,16Mx1 1 SA
DIC3 1107-001242 IC-FLASH MEMORY;39VF160,1Mx16, 1 SNA
DIC5 1103-001134 IC-EEPROM;24C040,512x8,SOP,8P, 1 SA
DIC7 0801-002701 IC-CMOS LOGIC;74VHCT125A,BUFFE 1 SA
DIC8 0801-002166 IC-CMOS LOGIC;7SHU04,INVERTER, 1 SA
DR1 2007-000174 R-CHIP;47ohm,5%,1/16W,TP,1005 1 SA
DR2 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
DR3 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
DR30 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
DR32 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
DR35 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
DR36 2007-000982 R-CHIP;5.6Kohm,5%,1/16W,TP,100 1 SA
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
This Document can not be used without Samsung’s authorization
Samsung Electronics 7-1
7. Electrical Parts List
7-2 Samsung Electronics
Electrical Parts List
This Document can not be used without Samsung’s authorization
DR37 2007-000932 R-CHIP;470OHM,5%,1/16W,TP,1005 1 SA
DR38 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
DR39 2007-000162 R-CHIP;100Kohm,5%,1/16W,TP,100 1 SA
DR40 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
DR41 2007-000138 R-CHIP;100ohm,5%,1/16W,TP,1005 1 SA
DR42 2007-000138 R-CHIP;100ohm,5%,1/16W,TP,1005 1 SA
DR43 2007-001298 R-CHIP;51ohm,5%,1/16W,TP,1005 1 SA
DR44 2007-001298 R-CHIP;51ohm,5%,1/16W,TP,1005 1 SA
DR47 2007-001298 R-CHIP;51ohm,5%,1/16W,TP,1005 1 SA
DR48 2007-001298 R-CHIP;51ohm,5%,1/16W,TP,1005 1 SA
DR49 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
DR5 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
DR50 2007-001292 R-CHIP;33ohm,5%,1/16W,TP,1005 1 SA
DR51 2007-000659 R-CHIP;27ohm,5%,1/10W,TP,1608 1 SA
DR52 2007-001323 R-CHIP;3KOHM,5%,1/16W,TP,1005 1 SA
DR55 2007-000138 R-CHIP;100ohm,5%,1/16W,TP,1005 1 SA
DR6 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
DR64 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
DR65 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
DR66 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
DR67 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
DR68 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
DR69 3301-001309 BEAD-SMD;47ohm,1608,TP,-,- 1 SA
DR70 3301-001309 BEAD-SMD;47ohm,1608,TP,-,- 1 SA
DR71 2007-000174 R-CHIP;47ohm,5%,1/16W,TP,1005 1 SA
DR72 2007-000174 R-CHIP;47ohm,5%,1/16W,TP,1005 1 SA
DR74 2007-000173 R-CHIP;22ohm,5%,1/16W,TP,1005 1 SA
DR75 2007-000173 R-CHIP;22ohm,5%,1/16W,TP,1005 1 SA
DR76 2007-000173 R-CHIP;22ohm,5%,1/16W,TP,1005 1 SA
DR79 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
DR8 2007-000170 R-CHIP;1Mohm,5%,1/16W,TP,1005 1 SA
DR80 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
DR82 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
DR83 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
DR87 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
DR88 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
DR89 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
DR9 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
DR90 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
DR91 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
DR92 2007-000033 R-CHIP;0ohm,5%,1/4W,TP,3216 1 SA
DR93 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
DRP1 2011-001474 R-NETWORK;47ohm,5%,1/16W,L,CHI 1 SA
DRP10 2011-001474 R-NETWORK;47ohm,5%,1/16W,L,CHI 1 SA
DRP11 2011-001261 R-NET;33ohm,5%,1/16W,L,CHIP,8P 1 SA
DRP12 2011-001261 R-NET;33ohm,5%,1/16W,L,CHIP,8P 1 SA
DRP13 2011-001261 R-NET;33ohm,5%,1/16W,L,CHIP,8P 1 SA
DRP14 2011-001261 R-NET;33ohm,5%,1/16W,L,CHIP,8P 1 SA
DRP15 2011-001478 R-NETWORK;51ohm,5%,1/16W,L,CHI 1 SA
DRP16 2011-001478 R-NETWORK;51ohm,5%,1/16W,L,CHI 1 SA
DRP17 2011-001478 R-NETWORK;51ohm,5%,1/16W,L,CHI 1 SA
DRP18 2011-001478 R-NETWORK;51ohm,5%,1/16W,L,CHI 1 SA
DRP19 2011-001478 R-NETWORK;51ohm,5%,1/16W,L,CHI 1 SA
DRP2 2011-001474 R-NETWORK;47ohm,5%,1/16W,L,CHI 1 SA
DRP20 2011-001478 R-NETWORK;51ohm,5%,1/16W,L,CHI 1 SA
DRP21 2011-001478 R-NETWORK;51ohm,5%,1/16W,L,CHI 1 SA
DRP22 2011-001478 R-NETWORK;51ohm,5%,1/16W,L,CHI 1 SA
DRP23 2011-001478 R-NETWORK;51ohm,5%,1/16W,L,CHI 1 SA
DRP26 2011-001396 R-NET;4.7KOHM,5%,1/16W,L,CHIP, 1 SA
DRP27 2011-001396 R-NET;4.7KOHM,5%,1/16W,L,CHIP, 1 SA
DRP28 2011-001396 R-NET;4.7KOHM,5%,1/16W,L,CHIP, 1 SA
DRP29 2011-001396 R-NET;4.7KOHM,5%,1/16W,L,CHIP, 1 SA
DRP3 2011-001474 R-NETWORK;47ohm,5%,1/16W,L,CHI 1 SA
DRP4 2011-001474 R-NETWORK;47ohm,5%,1/16W,L,CHI 1 SA
DRP5 2011-001474 R-NETWORK;47ohm,5%,1/16W,L,CHI 1 SA
DRP6 2011-001474 R-NETWORK;47ohm,5%,1/16W,L,CHI 1 SA
DRP7 2011-001474 R-NETWORK;47ohm,5%,1/16W,L,CHI 1 SA
DRP9 2011-001474 R-NETWORK;47ohm,5%,1/16W,L,CHI 1 SA
RIC1 1203-003996 IC-POSI.FIXED REG.;KIA78R025F, 1 SA
RIC2 1203-003806 IC-POSI.ADJUST REG.;KIA78R000, 1 SA
TC1 2203-000552 C-CER,CHIP;0.02nF,5%,50V,C0G,1 1 SA
TC16 2203-000278 C-CER,CHIP;0.01nF,0.5pF,50V,C0 1 SA
TC2 2203-000552 C-CER,CHIP;0.02nF,5%,50V,C0G,1 1 SA
TC3 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
TC4 2203-005642 C-CER,CHIP;0.22nF,5%,50V,NP0,1 1 SA
TC5 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
TC6 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
TC7 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
TC8 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
TC9 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
TE1 2402-001238 C-AL,SMD;1uF,20%,50V,HR,TP,4.3 1 SA
TE2 2402-001248 C-AL,SMD;220UF,20%,6.3V,-,TP,6 1 SA
TIC1 1205-001988 IC-DATA COMM./GEN.;TSB41AB1-PA 1 SA
TR10 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
TR11 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
TR12 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
TR13 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
TR14 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
TR15 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
TR16 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
TR17 2007-000145 R-CHIP;6.2Kohm,5%,1/16W,TP,100 1 SA
TR19 2007-002970 R-CHIP;56ohm,5%,1/16W,TP,1005 1 SA
TR2 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
TR20 2007-002970 R-CHIP;56ohm,5%,1/16W,TP,1005 1 SA
TR21 2007-002970 R-CHIP;56ohm,5%,1/16W,TP,1005 1 SA
TR22 2007-002970 R-CHIP;56ohm,5%,1/16W,TP,1005 1 SA
TR24 2007-000144 R-CHIP;5.1KOHM,5%,1/16W,TP,100 1 SA
TR25 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
TR26 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
TR27 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
TR28 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
TR29 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
TR3 2007-001292 R-CHIP;33ohm,5%,1/16W,TP,1005 1 SA
TR30 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
TR31 2007-000170 R-CHIP;1Mohm,5%,1/16W,TP,1005 1 SA
TR32 2007-000073 R-CHIP;91ohm,5%,1/10W,TP,1608 1 SA
TR33 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
TR4 2007-001292 R-CHIP;33ohm,5%,1/16W,TP,1005 1 SA
TR9 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
Electrical Parts List
Samsung Electronics 7-3
This Document can not be used without Samsung’s authorization
TY1 2801-004021 CRYSTAL-SMD;24.576MHz,20ppm,28 1 SA
V29 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC1 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC11 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC12 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC13 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC15 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC16 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC17 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC18 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC2 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC20 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC21 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC22 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC23 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC24 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC25 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC26 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC27 2203-000278 C-CER,CHIP;0.01nF,0.5pF,50V,C0 1 SA
VC28 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC5 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC6 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC7 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC8 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC9 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VE3 2402-001248 C-AL,SMD;220UF,20%,6.3V,-,TP,6 1 SA
VE4 2402-001248 C-AL,SMD;220UF,20%,6.3V,-,TP,6 1 SA
VIC1 1204-002419 IC-VIDEO DECODER;TW9906,TQFP,8 1 SA
VL1 2703-000398 INDUCTOR-SMD;10uH,10%,3225 1 SA
VR14 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm, 1 SA
VR15 2007-000137 R-CHIP;2KOHM,5%,1/16W,TP,1005 1 SA
VR16 2007-000137 R-CHIP;2KOHM,5%,1/16W,TP,1005 1 SA
VR2 2007-001292 R-CHIP;33ohm,5%,1/16W,TP,1005 1 SA
VR23 2007-000138 R-CHIP;100ohm,5%,1/16W,TP,1005 1 SA
VR25 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
VRP3 2011-001344 R-NET;100ohm,5%,1/16W,L,CHIP,8 1 SA
VRP4 2011-001344 R-NET;100ohm,5%,1/16W,L,CHIP,8 1 SA
Y1 2801-004621 CRYSTAL-SMD;27MHz,15ppm,-,14pF 1 SA
P005 AK92-01326A ASSY PCB-FUNCTION;DVD-R157/XAA 1 SA
AR722 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP, 1 SA
AR740 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP, 1 SA
AVIN2 3722-002384 JACK-PIN;3P,SN/NI,YEL/WHT/RED, 1 SA
AVIN2B AK63-00307A GROUND-FRONT AV;DVD-R130,SUS,T 1 SA
CN7 3722-002383 JACK-IEEE1394;4P/1,AU,BLK,ANGL 1 SA
ESD01 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
ESD02 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
ESD03 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
ESD04 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
ESD05 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
ESD06 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
ESD07 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
ESD08 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
ESD09 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
ESD10 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
ESD11 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
ESD12 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
ESD13 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
ESD14 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
FCON4 3708-001695 CONNECTOR-FPC/FFC/PIC;13P,1MM, 1 SA
FL615 3809-001787 FFC CABLE-FLAT;30V,80C,115mm,1 1 SA
JP36 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
LD61A AK61-00531A HOLDER-LED;DVD-R145,ABS 94HB,T 1 SA
LD701 0601-001928 LED;ROUND,BLUE,3mm,465nm,3.6x3 1 SA
PWR01 2007-000124 R-CHIP;2.2Kohm,5%,1/10W,TP,160 1 SA
PWR02 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
QWR01 0501-000398 TR-SMALL SIGNAL;KSC945-Y,NPN,2 1 SA
R720 2007-000098 R-CHIP;56Kohm,5%,1/10W,TP,1608 1 SA
SW711 3404-001261 SWITCH-TACT;15V DC,20mA,100gf, 1 SA
VR40 2001-000969 R-CARBON;75OHM,5%,1/8W,AA,TP,1 1 SA
P007 AK97-01947A ASSY-R157 KEY;-,R157/XAA,NEXUS 1 SA
CN704 3708-001803 CONNECTOR-FPC/FFC/PIC;10P,1.25 1 SA
FL286 3809-001667 FFC CABLE-FLAT;30V,80C,70mm,10 1 SA
LD702 0601-001587 LED;ROUND,RED,3.1mm,635nm,3.8x 1 SA
QWR01 0501-000398 TR-SMALL SIGNAL;KSC945-Y,NPN,2 1 SA
SW703 3404-001182 SWITCH-TACT;DC12V,50MA,100GF,6 1 SA
SW705 3404-001182 SWITCH-TACT;DC12V,50MA,100GF,6 1 SA
SW706 3404-001182 SWITCH-TACT;DC12V,50MA,100GF,6 1 SA
SW707 3404-001182 SWITCH-TACT;DC12V,50MA,100GF,6 1 SA
SW708 3404-001182 SWITCH-TACT;DC12V,50MA,100GF,6 1 SA
SW709 3404-001182 SWITCH-TACT;DC12V,50MA,100GF,6 1 SA
SW710 3404-001182 SWITCH-TACT;DC12V,50MA,100GF,6 1 SA
P022 AK92-01373A ASSY PCB-JACK I/O;DVD-R155/XAC 1 SA
AC16 2203-000315 C-CER,CHIP;0.12nF,5%,50V,C0G,1 1 SA
AC17 2203-000315 C-CER,CHIP;0.12nF,5%,50V,C0G,1 1 SA
AC405 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
AC406 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
AC407 2203-000125 C-CER,CHIP;1.2nF,10%,50V,X7R,T 1 SA
AC408 2203-000125 C-CER,CHIP;1.2nF,10%,50V,X7R,T 1 SA
AC409 2203-000315 C-CER,CHIP;0.12nF,5%,50V,C0G,1 1 SA
AC410 2203-000315 C-CER,CHIP;0.12nF,5%,50V,C0G,1 1 SA
AC413 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
ACC2 2203-000315 C-CER,CHIP;0.12nF,5%,50V,C0G,1 1 SA
ACC3 2203-000315 C-CER,CHIP;0.12nF,5%,50V,C0G,1 1 SA
AD1 0407-000123 DIODE-ARRAY;DAN202K,80V,100mA, 1 SA
AD2 0407-000123 DIODE-ARRAY;DAN202K,80V,100mA, 1 SA
AD3 0407-000123 DIODE-ARRAY;DAN202K,80V,100mA, 1 SA
AE404 2401-003107 C-AL;47uF,20%,16V,GP,TP,5x7,5 1 SA
AE405 2401-003107 C-AL;47uF,20%,16V,GP,TP,5x7,5 1 SA
AE412 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7 1 SA
AE42 2401-000922 C-AL;22uF,20%,16V,GP,TP,5x5,5 1 SA
AE46 2401-000922 C-AL;22uF,20%,16V,GP,TP,5x5,5 1 SA
AIC4 1201-000163 IC-OP AMP;4560,SOP,8P,173MIL,D 1 SA
AQ1 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN, 1 SA
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
7-4 Samsung Electronics
Electrical Parts List
This Document can not be used without Samsung’s authorization
AQ3 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN, 1 SA
AQ4 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K 1 SA
AQ5 0504-000156 TR-DIGITAL;KSR2103,PNP,200MW,2 1 SA
AQ51 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K 1 SA
AQ52 0504-000156 TR-DIGITAL;KSR2103,PNP,200MW,2 1 SA
AQ6 0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K 1 SA
AQ7 0504-000156 TR-DIGITAL;KSR2103,PNP,200MW,2 1 SA
AR105 2001-000633 R-CARBON;30KOHM,5%,1/8W,AA,TP, 1 SA
AR106 2001-000633 R-CARBON;30KOHM,5%,1/8W,AA,TP, 1 SA
AR107 2007-000129 R-CHIP;27Kohm,5%,1/10W,TP,1608 1 SA
AR108 2007-000129 R-CHIP;27Kohm,5%,1/10W,TP,1608 1 SA
AR26 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1 1 SA
AR4 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
AR40 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1 1 SA
AR403 2007-001010 R-CHIP;51Kohm,5%,1/10W,TP,1608 1 SA
AR404 2007-001010 R-CHIP;51Kohm,5%,1/10W,TP,1608 1 SA
AR407 2007-001010 R-CHIP;51Kohm,5%,1/10W,TP,1608 1 SA
AR408 2001-000837 R-CARBON;51KOHM,5%,1/8W,AA,TP, 1 SA
AR409 2007-000092 R-CHIP;15Kohm,5%,1/10W,TP,1608 1 SA
AR410 2007-000092 R-CHIP;15Kohm,5%,1/10W,TP,1608 1 SA
AR412 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
AR413 2007-000075 R-CHIP;220ohm,5%,1/10W,TP,1608 1 SA
AR414 2007-000075 R-CHIP;220ohm,5%,1/10W,TP,1608 1 SA
AR415 2007-000075 R-CHIP;220ohm,5%,1/10W,TP,1608 1 SA
AR420 2007-000122 R-CHIP;1.2Kohm,5%,1/10W,TP,160 1 SA
AR421 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
AR460 2007-000122 R-CHIP;1.2Kohm,5%,1/10W,TP,160 1 SA
AR461 2001-000290 R-CARBON;10KOHM,5%,1/8W,AA,TP, 1 SA
AR471 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
AR472 2001-000290 R-CARBON;10KOHM,5%,1/8W,AA,TP, 1 SA
AR473 2007-000075 R-CHIP;220ohm,5%,1/10W,TP,1608 1 SA
AR474 2007-000075 R-CHIP;220ohm,5%,1/10W,TP,1608 1 SA
AR475 2007-000075 R-CHIP;220ohm,5%,1/10W,TP,1608 1 SA
AR476 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
AR477 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
AR5 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
AR725 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 1 SA
AR734 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 1 SA
AR735 2007-001167 R-CHIP;75ohm,5%,1/10W,TP,1608 1 SA
AVJ1 3722-002449 JACK-PIN;6P+VHS,Ni/Sn,RD-BU-GN 1 SA
AVJ2 3722-002450 JACK-PIN;6P+VHS,Ni/Sn,RD-WH-YL 1 SA
AVJ5 3707-001070 CONNECTOR-OPTICAL;PLUG,GP1FA55 1 SA
BD05 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
BD06 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
BD07 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
BD08 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
BD21 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
BD22 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
BD23 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
BD24 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
C4M17A 2203-000323 C-CER,CHIP;12nF,10%,50V,X7R,TP 1 SA
C4M18A 2203-000357 C-CER,CHIP;0.15nF,5%,50V,C0G,1 1 SA
C4M19A 2203-000681 C-CER,CHIP;0.027nF,5%,50V,C0G, 1 SA
C603 2203-005065 C-CER,CHIP;1000nF,+80-20%,10V, 1 SA
C616 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
C617 2401-003107 C-AL;47uF,20%,16V,GP,TP,5x7,5 1 SA
C618 2203-000426 C-CER,CHIP;0.018nF,5%,50V,C0G, 1 SA
C619 2203-000426 C-CER,CHIP;0.018nF,5%,50V,C0G, 1 SA
C620 2203-000626 C-CER,CHIP;0.022nF,5%,50V,C0G, 1 SA
C621 2203-000626 C-CER,CHIP;0.022nF,5%,50V,C0G, 1 SA
C622 2203-005065 C-CER,CHIP;1000nF,+80-20%,10V, 1 SA
C623 2203-000236 C-CER,CHIP;0.1nF,5%,50V,C0G,16 1 SA
C626 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
C627 2203-001697 C-CER,CHIP;0.082nF,5%,50V,NP0, 1 SA
C628 2401-002069 C-AL;33uF,20%,16V,GP,TP,6.3x5, 1 SA
C629 2203-005221 C-CER,CHIP;15nF,10%,50V,X7R,16 1 SA
C630 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7 1 SA
C631 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,16 1 SA
C635 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,16 1 SA
C636 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
C637 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7 1 SA
C647 2203-000681 C-CER,CHIP;0.027nF,5%,50V,C0G, 1 SA
C651 2202-000216 C-CERAMIC,MLC-AXIAL;0.027NF,5% 1 SA
C652 2203-000681 C-CER,CHIP;0.027nF,5%,50V,C0G, 1 SA
C658 2203-001683 C-CER,CHIP;0.068nF,5%,50V,NP0, 1 SA
C701 2401-000118 C-AL;1000uF,20%,10V,GP,TP,10x1 1 SA
C702 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,16 1 SA
C703 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,16 1 SA
C704 2401-000240 C-AL;100uF,20%,10V,GP,TP,5x11, 1 SA
C707 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,16 1 SA
C708 2401-000118 C-AL;1000uF,20%,10V,GP,TP,10x1 1 SA
C801 2203-000972 C-CER,CHIP;47nF,10%,16V,X7R,16 1 SA
C802 2401-001915 C-AL;1uF,20%,50V,GP,TP,3x5,5 1 SA
C803 2401-004136 C-AL;100uF,°æ20%,16V,WT,TP,8X5 1 SA
C804 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
C805 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7 1 SA
C806 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
C807 2401-003107 C-AL;47uF,20%,16V,GP,TP,5x7,5 1 SA
C808 2401-003107 C-AL;47uF,20%,16V,GP,TP,5x7,5 1 SA
C809 2401-003107 C-AL;47uF,20%,16V,GP,TP,5x7,5 1 SA
C810 2401-003645 C-AL;1UF,20%,50V,WT,TP,4X5MM,5 1 SA
C811 2401-003645 C-AL;1UF,20%,50V,WT,TP,4X5MM,5 1 SA
C812 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 1 SA
C813 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 1 SA
C814 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 1 SA
C815 2401-003645 C-AL;1UF,20%,50V,WT,TP,4X5MM,5 1 SA
C816 2401-003645 C-AL;1UF,20%,50V,WT,TP,4X5MM,5 1 SA
C817 2401-003645 C-AL;1UF,20%,50V,WT,TP,4X5MM,5 1 SA
C818 2401-003645 C-AL;1UF,20%,50V,WT,TP,4X5MM,5 1 SA
C819 2401-003645 C-AL;1UF,20%,50V,WT,TP,4X5MM,5 1 SA
C820 2401-003645 C-AL;1UF,20%,50V,WT,TP,4X5MM,5 1 SA
C821 2401-000665 C-AL;2.2uF,20%,50V,GP,TP,3.5x5 1 SA
C822 2401-000665 C-AL;2.2uF,20%,50V,GP,TP,3.5x5 1 SA
C824 2401-000665 C-AL;2.2uF,20%,50V,GP,TP,3.5x5 1 SA
C825 2401-000665 C-AL;2.2uF,20%,50V,GP,TP,3.5x5 1 SA
CN3 3711-005563 HEADER-BOARD TO BOARD;BOX,30P, 1 SA
CN4 3711-006319 HEADER-BOARD TO BOARD;BOX,16P, 1 SA
CVL1 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
CVL2 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
Electrical Parts List
Samsung Electronics 7-5
This Document can not be used without Samsung’s authorization
CVL3 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
D702 0401-000005 DIODE-SWITCHING;1N4148,75V,150 1 SA
D703 0401-000005 DIODE-SWITCHING;1N4148,75V,150 1 SA
D704 0401-000005 DIODE-SWITCHING;1N4148,75V,150 1 SA
D705 0401-000005 DIODE-SWITCHING;1N4148,75V,150 1 SA
D719 0402-001533 DIODE-RECTIFIER;1N5408,1000V,3 1 SA
D720 0402-000165 DIODE-RECTIFIER;1N5819,40V,1A, 1 SA
DAR01 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
DOC3 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
DOC4 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
DOC5 2203-000998 C-CER,CHIP;0.047nF,5%,50V,C0G, 1 SA
DOE1 2401-001915 C-AL;1uF,20%,50V,GP,TP,3x5,5 1 SA
DOL2 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
DOL3 2701-000114 INDUCTOR-AXIAL;10UH,10%,2534 1 SA
DOR1 2007-000040 R-CHIP;150ohm,1%,1/10W,TP,1608 1 SA
DOR2 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 1 SA
DOR3 2007-000075 R-CHIP;220ohm,5%,1/10W,TP,1608 1 SA
DT701 AK07-00063A LED DISPLAY;BCD-9051A,DVD-R155 1 SA
FC10 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,16 1 SA
FC12 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
FCON1 3708-001802 CONNECTOR-FPC/FFC/PIC;10P,1.25 1 SA
FCON3 3708-001695 CONNECTOR-FPC/FFC/PIC;13P,1MM, 1 SA
FD2 0402-000165 DIODE-RECTIFIER;1N5819,40V,1A, 1 SA
FD3 0402-000165 DIODE-RECTIFIER;1N5819,40V,1A, 1 SA
FD4 0401-000005 DIODE-SWITCHING;1N4148,75V,150 1 SA
FD7 0402-000165 DIODE-RECTIFIER;1N5819,40V,1A, 1 SA
FDJ1 0402-000165 DIODE-RECTIFIER;1N5819,40V,1A, 1 SA
FDJ2 0402-000165 DIODE-RECTIFIER;1N5819,40V,1A, 1 SA
FE4 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7 1 SA
FE5 2401-001992 C-AL;2200UF,20%,10V,WT,TP,10X2 1 SA
FIC5 AC14-12009W IC-RESET;PST572K,TO-92,R59-176 1 SA
FL2 2701-000181 INDUCTOR-AXIAL;33uH,5%,2434 1 SA
FL3 2701-000181 INDUCTOR-AXIAL;33uH,5%,2434 1 SA
FR24 2007-000100 R-CHIP;68Kohm,5%,1/10W,TP,1608 1 SA
FR25 2007-000503 R-CHIP;2.2ohm,5%,1/10W,TP,1608 1 SA
IC603 1103-001134 IC-EEPROM;24C040,512x8,SOP,8P, 1 SA
IC604 1204-002509 IC-SIGNAL PROCESSOR;CXA2207N,S 1 SA
IC701 1003-001561 IC-LED DRIVER;PT6961,SOP,32P,3 1 SA
IC801 1204-001763 IC-AUDIO PROCESSOR;LA73024V,SS 1 SA
JPS07 2701-000002 INDUCTOR-AXIAL;100UH,10%,4298 1 SA
KRMC1 0609-001225 MODULE REMOCON;VERTICAL,3.6mm, 1 SA
L701 2701-000002 INDUCTOR-AXIAL;100UH,10%,4298 1 SA
L801 2701-000002 INDUCTOR-AXIAL;100UH,10%,4298 1 SA
L802 2701-000002 INDUCTOR-AXIAL;100UH,10%,4298 1 SA
ME01 2401-003499 C-AL;330uF,20%,16V,LZ,TP,8x11. 1 SA
PACT1 2301-001792 C-FILM,LEAD;150nF,20%,275V,BK, 1 SA
PACT2 2301-001792 C-FILM,LEAD;150nF,20%,275V,BK, 1 SA
PADT1 0402-001196 DIODE-RECTIFIER;1T5,600V,1A,TS 1 SA
PADT2 0402-001196 DIODE-RECTIFIER;1T5,600V,1A,TS 1 SA
PADT3 0402-001196 DIODE-RECTIFIER;1T5,600V,1A,TS 1 SA
PADT4 0402-001196 DIODE-RECTIFIER;1T5,600V,1A,TS 1 SA
PAFT1 3601-000244 FUSE-CARTRIDGE;250V,2A,SLOW-BL 1 SC
PALT2 AC29-00003A FILTER LINE NOISE;-,20mH MIN,- 1 SA
PART1 2002-000121 R-COMPOSITION;1Mohm,10%,1/2W,A 1 SA
PAVV1 1405-000186 VARISTOR;470V,2500A,17.5x7.5mm 1 SA
PAVV2 1405-001026 VARISTOR;470V,600A,9x7mm,TP 1 SA
PAWT1 3711-000203 HEADER-BOARD TO CABLE;1WALL,2P 1 SA
PBCU1 2201-002044 C-CERAMIC,DISC;0.1NF,10%,400V, 1 SA
PBCU2 2201-002044 C-CERAMIC,DISC;0.1NF,10%,400V, 1 SA
PBCU3 2201-000828 C-CERAMIC,DISC;3.3NF,20%,400V, 1 SA
PBCU4 2201-000828 C-CERAMIC,DISC;3.3NF,20%,400V, 1 SA
PBIZ1 0604-001028 PHOTO-COUPLER;TR,50-600%,250mW 1 SA
PDCZ1 2301-001654 C-FILM,LEAD-PEF;1000nF,5%,100V 1 SA
PFCF1 2301-000129 C-FILM,LEAD-PEF;100nF,5%,50V,T 1 SA
PFCZ1 2307-000104 C-FILM,LEAD-PCF;10nF,5%,50V,TP 1 SA
PFID1 AC14-12006D IC;KA431Z,TO-92,TAPING 1 SA
PFRF1 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP, 1 SA
PFRF2 2001-000221 R-CARBON;1.2KOHM,5%,1/8W,AA,TP 1 SA
PFRF3 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1 1 SA
PFRF4 2001-000674 R-CARBON;360OHM,5%,1/8W,AA,TP, 1 SA
PFRF5 2004-000459 R-METAL;2.2Kohm,1%,1/8W,AA,TP, 1 SA
PFRF6 2004-000459 R-METAL;2.2Kohm,1%,1/8W,AA,TP, 1 SA
PFRZ1 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1 1 SA
PLCZ1 2301-000129 C-FILM,LEAD-PEF;100nF,5%,50V,T 1 SA
PLRU1 1404-001361 THERMISTOR-NTC;3ohm,4A,-,35mW/ 1 SA
PLRZ1 2003-000105 R-METAL OXIDE;0.33ohm,5%,2W,AD 1 SA
PPCD1 2401-003480 C-AL;1000UF,20%,10V,LZ,TP,10X1 1 SA
PPCD2 2401-001479 C-AL;470uF,20%,10V,GP,TP,6.3*1 1 SA
PPCF1 2401-003480 C-AL;1000UF,20%,10V,LZ,TP,10X1 1 SA
PPCF2 2401-003480 C-AL;1000UF,20%,10V,LZ,TP,10X1 1 SA
PPCF3 2401-001479 C-AL;470uF,20%,10V,GP,TP,6.3*1 1 SA
PPCF4 2401-001250 C-AL;4.7uF,20%,35V,GP,TP,4x5,5 1 SA
PPCF7 2401-001479 C-AL;470uF,20%,10V,GP,TP,6.3*1 1 SA
PPCF8 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7 1 SA
PPCI1 2401-001126 C-AL;330uF,20%,25V,WT,TP,10x12 1 SA
PPCI2 2401-001126 C-AL;330uF,20%,25V,WT,TP,10x12 1 SA
PPCI3 2401-003499 C-AL;330uF,20%,16V,LZ,TP,8x11. 1 SA
PPCO1 2401-000385 C-AL;10uF,20%,100V,GP,TP,6.3x1 1 SC
PPCO2 2401-002300 C-AL;47•ÏF,20%,50V,GP,TP,6.3x1 1 SA
PPDD1 0404-001235 DIODE-SCHOTTKY;SHK65-45R,60V,3 1 SA
PPDD2 0401-000005 DIODE-SWITCHING;1N4148,75V,150 1 SA
PPDF10 0404-001235 DIODE-SCHOTTKY;SHK65-45R,60V,3 1 SA
PPDF2 0404-001235 DIODE-SCHOTTKY;SHK65-45R,60V,3 1 SA
PPDF3 0402-001533 DIODE-RECTIFIER;1N5408,1000V,3 1 SA
PPDI1 0402-001624 DIODE-RECTIFIER;SF26,400V,2A,D 1 SA
PPDO1 0402-000012 DIODE-RECTIFIER;UF4007,1KV,1A, 1 SA
PPID1 1203-003216 IC-POSI.FIXED REG.;G9133,TO-22 1 SA
PPIF2 1203-001589 IC-POSI.FIXED REG.;278R05,TO-2 1 SA
PPII1 1203-002183 IC-SWITCH VOL. REG.;278R12,TO- 1 SA
PPLD1 AC27-12001N COIL CHOKE;10UH-15%,RA,K-30,Q8 1 SA
PPLF1 AH27-00039A COIL CHOKE;DR CHOKE(8*6),DVD-R 1 SA
PPLI1 AC27-12001N COIL CHOKE;10UH-15%,RA,K-30,Q8 1 SA
PPRD1 2003-000148 R-METAL OXIDE;100ohm,5%,2W,AE, 1 SC
PPRF2 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1 1 SA
PPRF4 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
PPRF6 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
PPRO1 2001-000062 R-CARBON;470OHM,5%,1/4W,AA,TP, 1 SA
PPZO1 0403-000390 DIODE-ZENER;UZP33B,31.4-34.6V, 1 SA
PQIZ1 1203-003883 IC-PWM CONTROLLER;3B2065P-2,TO 1 SA
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
7-6 Samsung Electronics
Electrical Parts List
This Document can not be used without Samsung’s authorization
PQTZ1 AC26-00014K TRANS SWITCHING-RAM RECORDER;E 1 SA
PRCU1 2401-003024 C-AL;220uF,20%,200V,WT,BK,22x3 1 SA
PSCX1 2305-001029 C-FILM,LEAD-PEF;10nF,10%,630V, 1 SA
PSCZ2 2201-000129 C-CERAMIC,DISC;0.1nF,10%,1000V 1 SA
PSDZ1 0402-000012 DIODE-RECTIFIER;UF4007,1KV,1A, 1 SA
PSRZ1 2003-000994 R-METAL OXIDE(S);33Kohm,5%,2W, 1 SA
PSRZ2 2003-000994 R-METAL OXIDE(S);33Kohm,5%,2W, 1 SA
PVCL1 2401-002608 C-AL;33uF,20%,35V,GP,TP,5x11,5 1 SA
PVDL1 0402-001195 DIODE-RECTIFIER;F1T4,400V,1A,D 1 SA
PVRL4 2001-000793 R-CARBON;47OHM,5%,1/8W,AA,TP,1 1 SA
PVZL1 0403-000713 DIODE-ZENER;MTZJ20B,18.63-17.7 1 SA
PWR09 2007-000119 R-CHIP;560ohm,5%,1/10W,TP,1608 1 SA
PWR10 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
PZWZ1 3711-004379 HEADER-BOARD TO CABLE;BOX,4P,1 1 SA
Q4M01 0501-000398 TR-SMALL SIGNAL;KSC945-Y,NPN,2 1 SA
Q4M02 0501-000398 TR-SMALL SIGNAL;KSC945-Y,NPN,2 1 SA
R4M06 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
R4M07 2007-000084 R-CHIP;4.7Kohm,5%,1/10W,TP,160 1 SA
R4M08 2007-000124 R-CHIP;2.2Kohm,5%,1/10W,TP,160 1 SA
R4M09 2007-000084 R-CHIP;4.7Kohm,5%,1/10W,TP,160 1 SA
R4M10 2007-000965 R-CHIP;5.1Kohm,5%,1/10W,TP,160 1 SA
R4M20 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
R611 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 1 SA
R621 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP, 1 SA
R622 2001-000780 R-CARBON;470OHM,5%,1/8W,AA,TP, 1 SA
R623 2007-000084 R-CHIP;4.7Kohm,5%,1/10W,TP,160 1 SA
R624 2007-000084 R-CHIP;4.7Kohm,5%,1/10W,TP,160 1 SA
R633 2007-000106 R-CHIP;220Kohm,5%,1/10W,TP,160 1 SA
R638 2007-000082 R-CHIP;3.3Kohm,5%,1/10W,TP,160 1 SA
R639 2007-000081 R-CHIP;2.7Kohm,5%,1/10W,TP,160 1 SA
R652 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
R653 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R656 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
R666 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP, 1 SA
R667 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP, 1 SA
R668 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1 1 SA
R670 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 1 SA
R673 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R674 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R676 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R677 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1 1 SA
R678 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP, 1 SA
R680 2001-000472 R-CARBON;2.7KOHM,5%,1/8W,AA,TP 1 SA
R6A01 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
R6A02 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
R6A04 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R6A05 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R6A10 2001-000273 R-CARBON;100KOHM,5%,1/8W,AA,TP 1 SA
R701 2007-001010 R-CHIP;51Kohm,5%,1/10W,TP,1608 1 SA
R702 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R703 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R704 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R705 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R706 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R707 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R708 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R711 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
R7K1 2007-000092 R-CHIP;15Kohm,5%,1/10W,TP,1608 1 SA
R7K2 2007-000092 R-CHIP;15Kohm,5%,1/10W,TP,1608 1 SA
R7K3 2007-000092 R-CHIP;15Kohm,5%,1/10W,TP,1608 1 SA
R801 2007-001164 R-CHIP;75ohm,1%,1/10W,TP,1608 1 SA
R802 2007-001164 R-CHIP;75ohm,1%,1/10W,TP,1608 1 SA
R803 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1 1 SA
R804 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1 1 SA
R805 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP, 1 SA
R806 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP, 1 SA
R807 2007-000083 R-CHIP;3Kohm,5%,1/10W,TP,1608 1 SA
R808 2007-000083 R-CHIP;3Kohm,5%,1/10W,TP,1608 1 SA
R809 2007-000079 R-CHIP;1.8Kohm,5%,1/10W,TP,160 1 SA
R810 2007-000079 R-CHIP;1.8Kohm,5%,1/10W,TP,160 1 SA
R811 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R812 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
R813 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1 1 SA
R814 2001-000429 R-CARBON;1KOHM,5%,1/8W,AA,TP,1 1 SA
RA606 2001-000281 R-CARBON;100OHM,5%,1/8W,AA,TP, 1 SA
SVL2 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
SVLA 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
SW701 3404-001182 SWITCH-TACT;DC12V,50MA,100GF,6 1 SA
SW702 3404-001261 SWITCH-TACT;15V DC,20mA,100gf, 1 SA
TC1 2401-004014 C-AL;4.7•ÏF,20%,16V,NP,TP,4x5, 1 SA
TC10 2401-001915 C-AL;1uF,20%,50V,GP,TP,3x5,5 1 SA
TC11 2401-004014 C-AL;4.7•ÏF,20%,16V,NP,TP,4x5, 1 SA
TC12 2202-000253 C-CERAMIC,MLC-AXIAL;4.7nF,20%, 1 SA
TC13 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 1 SA
TC14 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7 1 SA
TC15 2401-001250 C-AL;4.7uF,20%,35V,GP,TP,4x5,5 1 SA
TC16 2401-001250 C-AL;4.7uF,20%,35V,GP,TP,4x5,5 1 SA
TC17 2203-001652 C-CER,CHIP;470nF,+80-20%,16V,Y 1 SA
TC19 2203-001662 C-CER,CHIP;5.6nF,10%,50V,X7R,1 1 SA
TC2 2203-000531 C-CER,CHIP;2.7nF,10%,50V,X7R,1 1 SA
TC20 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
TC21 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,16 1 SA
TC22 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
TC3 2203-000972 C-CER,CHIP;47nF,10%,16V,X7R,16 1 SA
TC4 2401-001249 C-AL;4.7uF,20%,35V,GP,TP,4x5,2 1 SA
TC5 2401-001020 C-AL;3.3UF,20%,50V,GP,TP,4X7,5 1 SA
TC6 2401-004014 C-AL;4.7•ÏF,20%,16V,NP,TP,4x5, 1 SA
TC74 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
TC9 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 1 SA
TE12 2401-001250 C-AL;4.7uF,20%,35V,GP,TP,4x5,5 1 SA
TE8 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7 1 SA
TM1 AK40-00019A TM BLOCK;VRA05ASE,NTSC,181CH,- 1 SA
TR1 2007-000082 R-CHIP;3.3Kohm,5%,1/10W,TP,160 1 SA
TR10 2007-000121 R-CHIP;820ohm,5%,1/10W,TP,1608 1 SA
TR2 2007-000842 R-CHIP;3Kohm,1%,1/10W,TP,1608 1 SA
TR3 2007-000125 R-CHIP;3.9Kohm,5%,1/10W,TP,160 1 SA
TR4 2007-001125 R-CHIP;68Kohm,1%,1/10W,TP,1608 1 SA
TR5 2007-000109 R-CHIP;1Mohm,5%,1/10W,TP,1608 1 SA
TR6 2007-000102 R-CHIP;100Kohm,5%,1/10W,TP,160 1 SA
TR7 2007-000075 R-CHIP;220ohm,5%,1/10W,TP,1608 1 SA
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
Electrical Parts List
Samsung Electronics 7-7
This Document can not be used without Samsung’s authorization
TR8 2007-000075 R-CHIP;220ohm,5%,1/10W,TP,1608 1 SA
TR9 2007-000121 R-CHIP;820ohm,5%,1/10W,TP,1608 1 SA
VC10 2203-000440 C-CER,CHIP;1nF,10%,50V,X7R,160 1 SA
VC17 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
VC6 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,1 1 SA
VC7 2202-000797 C-CERAMIC,MLC-AXIAL;10NF,30%,1 1 SA
VC8 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-2 1 SA
VC9 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,80-2 1 SA
VDR1 2007-001164 R-CHIP;75ohm,1%,1/10W,TP,1608 1 SA
VDR2 2007-001164 R-CHIP;75ohm,1%,1/10W,TP,1608 1 SA
VDR3 2007-001131 R-CHIP;68ohm,1%,1/10W,TP,1608 1 SA
VDR4 2007-001164 R-CHIP;75ohm,1%,1/10W,TP,1608 1 SA
VDR5 2007-001164 R-CHIP;75ohm,1%,1/10W,TP,1608 1 SA
VDR6 2007-001164 R-CHIP;75ohm,1%,1/10W,TP,1608 1 SA
VDR7 2007-000879 R-CHIP;4.7ohm,1%,1/10W,TP,1608 1 SA
VE1 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7 1 SA
VE10 2401-001479 C-AL;470uF,20%,10V,GP,TP,6.3*1 1 SA
VE2 2401-000922 C-AL;22uF,20%,16V,GP,TP,5x5,5 1 SA
VE4 2401-001479 C-AL;470uF,20%,10V,GP,TP,6.3*1 1 SA
VE5 2401-001479 C-AL;470uF,20%,10V,GP,TP,6.3*1 1 SA
VE6 2401-001479 C-AL;470uF,20%,10V,GP,TP,6.3*1 1 SA
VE7 2401-001479 C-AL;470uF,20%,10V,GP,TP,6.3*1 1 SA
VE8 2401-001915 C-AL;1uF,20%,50V,GP,TP,3x5,5 1 SA
VE9 2401-001915 C-AL;1uF,20%,50V,GP,TP,3x5,5 1 SA
VIC1 1201-002335 IC-VIDEO AMP;MM1692XVBE,TSOP,1 1 SA
VL1 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VL11 2701-000181 INDUCTOR-AXIAL;33uH,5%,2434 1 SA
VL12 2701-000181 INDUCTOR-AXIAL;33uH,5%,2434 1 SA
VL6 2703-000398 INDUCTOR-SMD;10uH,10%,3225 1 SA
VR30 2007-001167 R-CHIP;75ohm,5%,1/10W,TP,1608 1 SA
VR31 2007-001167 R-CHIP;75ohm,5%,1/10W,TP,1608 1 SA
VR32 2007-001167 R-CHIP;75ohm,5%,1/10W,TP,1608 1 SA
VR33 2007-001167 R-CHIP;75ohm,5%,1/10W,TP,1608 1 SA
VR34 2007-001167 R-CHIP;75ohm,5%,1/10W,TP,1608 1 SA
VR60 2007-001167 R-CHIP;75ohm,5%,1/10W,TP,1608 1 SA
VZ1 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ10 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ11 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ12 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ13 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ14 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ15 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ16 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ17 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ18 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ19 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ2 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ20 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ3 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ4 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ5 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ6 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ7 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ8 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
VZ9 0403-001083 DIODE-ZENER;UDZ9.1B,8.85-9.23V 1 SA
W004 6003-000283 SCREW-TAPTITE;BH,+,-,B,M3,L8,Z 1 SA
W224 3301-000297 BEAD-AXIAL;25ohm,3.6x1.2x5.7mm 1 SA
W233 2701-000002 INDUCTOR-AXIAL;100UH,10%,4298 1 SA
W324 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
W868 3301-001689 BEAD-SMD;220ohm,2012,TP,80ohm/ 1 SA
W881 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
W882 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
W889 2007-000033 R-CHIP;0ohm,5%,1/4W,TP,3216 1 SA
W890 2007-000033 R-CHIP;0ohm,5%,1/4W,TP,3216 1 SA
W920 2007-000033 R-CHIP;0ohm,5%,1/4W,TP,3216 1 SA
W923 2007-000033 R-CHIP;0ohm,5%,1/4W,TP,3216 1 SA
W946 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
XT4M01 2801-003399 CRYSTAL-UNIT;3.579545MHz,15ppm 1 SA
XT601 2801-001384 CRYSTAL-UNIT;14.31818MHz,30ppm 1 SC
XT602 2801-003318 CRYSTAL-UNIT;32.768KHz,20ppm,2 1 SA
H001 AK97-01883B ASSY-LOADER;-,DVD-R150,RAM Mul 1 SA
C771 AK61-00390A HOLDER-WIRE;SOH-DR2,PPS,T5.2,W 1 SNA
CIC1 1203-003177 IC-VOL. DETECTOR;BD5326G,SSOP, 1 SA
CN1 3708-002193 CONNECTOR-FPC/FFC/PIC;50P,0.5m 1 SA
DECK_C 3708-002176 CONNECTOR-FPC/FFC/PIC;5P,1mm,S 1 SA
H001 AK97-01878A ASSY-RECORDER DECK;DP-R4L,-,- 1 SNA
H103 AK66-00061A GEAR-PULLEY;DP-RW,POM,-,-,-,-, 1 SNA
H105 6602-001076 BELT-RECTANGULAR;CR,T1.2,4.3%, 1 SA
H106 AK66-00062A GEAR-TRAY;DP-RW,POM,-,-,-,WHT, 1 SNA
H108 AK63-00432A TRAY-DISC;DP-R3.5,ABS,-,-,-,-, 1 SNA
H207 AK31-00028A MOTOR SPINDLE;DP-R3L,8500,9.8m 1 SNA
H209 AK64-01462A CHASSIS-SUB;DP-R3H,ABS,T2,W114 1 SNA
H211 AK97-01856A ASSY-PICK UP;-,SOH-DR4,- 1 SNA
H212 AK61-00738A HOLDER-CHUCK;DP-R3.5L,ABS,-,-, 1 SNA
H241 AK41-00609A FFC-PU;DP-R3.5,POLYESTER,PITCH 1 SNA
H265 AK61-00736A BRACKET-SHAFT PU;DP-R3.5,SUS T 2 SNA
H268 AK61-00452A SPRING ETC-HINGE PU;DP-R2,SUS3 1 SNA
H271 AK61-00735A HINGE-PU;DP-R3.5,POM,-,-,-,-,- 1 SNA
H275 AK66-00072A SHAFT-PU;DP-RW2,SUS420J2,91.5, 2 SNA
H401 AK61-00734A FRAME-MAIN;DP-R3.5,ABS,-,-,-,- 1 SNA
JP9 3708-001331 CONNECTOR-FPC/FFC/PIC;40P,0.5m 1 SA
PC1 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
PC10 2402-000179 C-AL,SMD;47uF,20%,16V,GP,TP,6. 1 SA
PC12 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
PC14 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
PC15 2404-001131 C-TA,CHIP;22UF,10%,10V,GP,TP,3 1 SA
PC2 2203-006214 C-CER,CHIP;2200nF,10%,25V,X7R, 1 SA
PC3 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6 1 SA
PC4 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
PC5 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6 1 SA
PC6 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
PC7 2203-005171 C-CER,CHIP;1000nF,10%,16V,X7R, 1 SA
PC8 2203-005171 C-CER,CHIP;1000nF,10%,16V,X7R, 1 SA
PC9 2402-000179 C-AL,SMD;47uF,20%,16V,GP,TP,6. 1 SA
PCB AK41-00623B PCB-FRONT;RAMBO4,CEM-3,2,-,1.6 0.5 SNA
PCN 3711-005477 HEADER-BOARD TO CABLE;BOX,4P,1 1 SA
PIC2 1203-003997 IC-MULTI REG.;BA30E00WHFP,HRP, 1 SA
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
7-8 Samsung Electronics
Electrical Parts List
This Document can not be used without Samsung’s authorization
PIC3 1203-003999 IC-POSI.FIXED REG.;BH25FB1WHFV 1 SA
PL1 2901-001281 FILTER-EMI SMD;16V,2A,-,220000 1 SA
PL3 2901-001281 FILTER-EMI SMD;16V,2A,-,220000 1 SA
PL4 2901-001281 FILTER-EMI SMD;16V,2A,-,220000 1 SA
PL5 2901-001281 FILTER-EMI SMD;16V,2A,-,220000 1 SA
PR1 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
PR2 2007-000616 R-CHIP;24Kohm,5%,1/10W,TP,1608 1 SA
PR3 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP 1 SA
RC10 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC11 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC12 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC13 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC14 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC15 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC16 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC17 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC21 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC22 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3 1 SA
RC23 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC25 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3 1 SA
RC26 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC27 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3 1 SA
RC28 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC29 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC3 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC30 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC31 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC32 2203-000233 C-CER,CHIP;0.1nF,5%,50V,C0G,10 1 SA
RC33 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC34 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC35 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC36 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC37 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,35 1 SA
RC38 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC39 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,35 1 SA
RC40 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC41 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC42 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC43 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC44 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC45 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,100 1 SA
RC46 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,100 1 SA
RC47 2203-000627 C-CER,CHIP;0.022nF,5%,50V,C0G, 1 SA
RC48 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,100 1 SA
RC49 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,100 1 SA
RC50 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC51 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC52 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC53 2203-000233 C-CER,CHIP;0.1nF,5%,50V,C0G,10 1 SA
RC54 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC55 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,35 1 SA
RC56 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC57 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC58 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,35 1 SA
RC59 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC6 2203-005496 C-CER,CHIP;220nF,+80-20%,10V,Y 1 SA
RC60 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC61 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC62 2203-005642 C-CER,CHIP;0.22nF,5%,50V,NP0,1 1 SA
RC63 2203-005642 C-CER,CHIP;0.22nF,5%,50V,NP0,1 1 SA
RC64 2203-005642 C-CER,CHIP;0.22nF,5%,50V,NP0,1 1 SA
RC65 2203-005642 C-CER,CHIP;0.22nF,5%,50V,NP0,1 1 SA
RC66 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC67 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC68 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC69 2203-000233 C-CER,CHIP;0.1nF,5%,50V,C0G,10 1 SA
RC7 2203-005496 C-CER,CHIP;220nF,+80-20%,10V,Y 1 SA
RC70 2203-001239 C-CER,CHIP;0.082nF,5%,50V,NP0, 1 SA
RC71 2203-001239 C-CER,CHIP;0.082nF,5%,50V,NP0, 1 SA
RC72 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
RC73 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RC74 2203-000489 C-CER,CHIP;2.2nF,10%,50V,X7R,1 1 SA
RIC2 AK13-00028A IC ASIC;S1L1101X01,-,128,5V,-0 1 SNA
RR10 2007-000151 R-CHIP;15Kohm,5%,1/16W,TP,1005 1 SA
RR11 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
RR13 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
RR16 2007-000159 R-CHIP;56Kohm,5%,1/16W,TP,1005 1 SA
RR17 2007-003009 R-CHIP;16Kohm,5%,1/16W,TP,1005 1 SA
RR18 2007-000157 R-CHIP;47Kohm,5%,1/16W,TP,1005 1 SA
RR21 2007-007107 R-CHIP;100Kohm,1%,1/16W,TP,100 1 SA
RR22 2007-007107 R-CHIP;100Kohm,1%,1/16W,TP,100 1 SA
RR24 2007-000145 R-CHIP;6.2Kohm,5%,1/16W,TP,100 1 SA
RR25 2007-000154 R-CHIP;24KOHM,5%,1/16W,TP,1005 1 SA
RR25 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RR26 2007-001320 R-CHIP;1.8Kohm,5%,1/16W,TP,100 1 SA
RR27 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
RR28 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
RR29 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
RR30 2007-000157 R-CHIP;47Kohm,5%,1/16W,TP,1005 1 SA
RR32 2007-000159 R-CHIP;56Kohm,5%,1/16W,TP,1005 1 SA
RR32 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
RR33 2007-000154 R-CHIP;24KOHM,5%,1/16W,TP,1005 1 SA
RR35 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
RR37 2007-000170 R-CHIP;1Mohm,5%,1/16W,TP,1005 1 SA
RR43 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
RR44 2007-000151 R-CHIP;15Kohm,5%,1/16W,TP,1005 1 SA
RR45 2007-000151 R-CHIP;15Kohm,5%,1/16W,TP,1005 1 SA
RR46 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
S.N.A AK61-00740A BRACKET-DECK;DP-R3.5L,SECC T1. 1 SNA
S.N.A AK73-00053A RUBBER-DECK;DP-R3.5,BUTYL,-,-, 4 SNA
S.N.A AK97-01876A ASSY-TRAVERSE;DP-R4,-,- 1 SNA
S.N.A AK31-00024A MOTOR STEP-FEED;-,DP-RW,727 mA 1 SNA
S.N.A AK61-00490A SPRING ETC-SHAFT PU;DP-RW2,PW2 2 SNA
S.N.A AK97-01877A ASSY-HOLDER CHUCK;DP-R4L,-,- 1 SNA
S.N.A AK97-01331B ASSY-CLAMPER;DP-R4L,-,- 1 SNA
S.N.A AK61-00486A BODY CLAMPER-UPPER;DP-RW2,POM, 1 SNA
S.N.A AK61-00739A BRACKET-CLAMPER;DP-R3.5L,SECC 1 SNA
S.N.A BG33-30001D MAGNET-CLAMPER;-,-,-,-,13.5x6x 1 SNA
S.N.A AK97-01879A ASSY-HOUSING;-,DP-R4,- 1 SNA
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
Electrical Parts List
Samsung Electronics 7-9
This Document can not be used without Samsung’s authorization
S.N.A AH31-00025A MOTOR-LOADING;RF-300EA-1D390,D 1 SNA
S.N.A AK66-00038A PULLEY MOTOR;DP-R1,POM,-,BLK,1 1 SNA
S.N.A AK97-01646A ASSY-MOTOR PCB;PHENOL,DP-R3H,S 1 SNA
S.N.A 3403-001026 SWITCH-PUSH;5V,0.7mA,DPST,OFF- 1 SA
S.N.A AK41-00400A FFC-DECK;DP-RW2,PITCH1.0,PET,5 1 SNA
S.N.A AK41-00546A PCB-MOTOR;DP-R3H,PHENOL,1,1,1. 1 SNA
SPIN_C 3708-002067 CONNECTOR-FPC/FFC/PIC;12P,1mm, 1 SA
STEP_C 3708-002018 CONNECTOR-FPC/FFC/PIC;4P,1MM,S 1 SA
T037 AK66-00079A SLIDER-CAM;DP-R3H,POM,T10,W89, 1 SNA
U8 AK13-00025A IC ASIC;S5L1484A01,RAMBO-3,256 1 SNA
U9 1107-001551 IC-FLASH MEMORY;S29AL016M10TAI 1 SNA
UB1 1105-001284 IC-DRAM;636165,-,16Mbit,1Mx16B 1 SA
UC100 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC18 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3 1 SA
UC19 2203-000278 C-CER,CHIP;0.01nF,0.5pF,50V,C0 1 SA
UC21 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC22 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC23 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC24 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC25 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC26 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC27 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC28 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3 1 SA
UC29 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3 1 SA
UC30 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3 1 SA
UC31 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC32 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC33 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC34 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC35 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC36 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC37 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC38 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC39 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC40 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC41 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC42 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC43 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC44 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC45 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,100 1 SA
UC46 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC47 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
UC48 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC49 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC50 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC51 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC52 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC53 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC54 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC55 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC56 2203-000854 C-CER,CHIP;0.039nF,5%,50V,C0G, 1 SA
UC57 2203-001072 C-CER,CHIP;0.056nF,5%,50V,NP0, 1 SA
UC58 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC62 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC63 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC64 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC67 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC69 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3 1 SA
UC70 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC71 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3 1 SA
UC72 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC75 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3 1 SA
UC76 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC77 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC79 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC80 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,100 1 SA
UC81 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
UC82 2203-001072 C-CER,CHIP;0.056nF,5%,50V,NP0, 1 SA
UR1 2011-001432 R-NET;82ohm,5%,1/16W,L,CHIP,8P 1 SA
UR10 2007-001217 R-CHIP;82OHM,5%,1/16W,TP,1005 1 SA
UR100 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
UR11 2007-000173 R-CHIP;22ohm,5%,1/16W,TP,1005 1 SA
UR12 2007-000173 R-CHIP;22ohm,5%,1/16W,TP,1005 1 SA
UR13 2007-001217 R-CHIP;82OHM,5%,1/16W,TP,1005 1 SA
UR14 2007-001217 R-CHIP;82OHM,5%,1/16W,TP,1005 1 SA
UR16 2007-000170 R-CHIP;1Mohm,5%,1/16W,TP,1005 1 SA
UR17 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
UR19 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
UR2 2011-001261 R-NET;33ohm,5%,1/16W,L,CHIP,8P 1 SA
UR20 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
UR21 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
UR22 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
UR23 2007-000174 R-CHIP;47ohm,5%,1/16W,TP,1005 1 SA
UR24 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
UR25 2007-001292 R-CHIP;33ohm,5%,1/16W,TP,1005 1 SA
UR26 2007-001292 R-CHIP;33ohm,5%,1/16W,TP,1005 1 SA
UR27 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
UR28 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
UR29 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
UR3 2011-001261 R-NET;33ohm,5%,1/16W,L,CHIP,8P 1 SA
UR30 2007-000138 R-CHIP;100ohm,5%,1/16W,TP,1005 1 SA
UR31 2007-000138 R-CHIP;100ohm,5%,1/16W,TP,1005 1 SA
UR32 2007-000138 R-CHIP;100ohm,5%,1/16W,TP,1005 1 SA
UR33 2007-000138 R-CHIP;100ohm,5%,1/16W,TP,1005 1 SA
UR34 2007-000139 R-CHIP;220ohm,5%,1/16W,TP,1005 1 SA
UR35 2007-000138 R-CHIP;100ohm,5%,1/16W,TP,1005 1 SA
UR36 2007-000139 R-CHIP;220ohm,5%,1/16W,TP,1005 1 SA
UR37 2007-001325 R-CHIP;3.3Kohm,5%,1/16W,TP,100 1 SA
UR39 2007-000775 R-CHIP;33KOHM,5%,1/16W,TP,1005 1 SA
UR4 2011-001261 R-NET;33ohm,5%,1/16W,L,CHIP,8P 1 SA
UR42 2007-007001 R-CHIP;3.9KOHM,5%,1/16W,TP,100 1 SA
UR43 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
UR44 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
UR47 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
UR48 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
UR5 2011-001261 R-NET;33ohm,5%,1/16W,L,CHIP,8P 1 SA
UR50 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
UR55 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
UR58 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
7-10 Samsung Electronics
Electrical Parts List
This Document can not be used without Samsung’s authorization
UR59 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
UR6 2007-000173 R-CHIP;22ohm,5%,1/16W,TP,1005 1 SA
UR63 2007-000084 R-CHIP;4.7Kohm,5%,1/10W,TP,160 1 SA
UR64 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,100 1 SA
UR69 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
UR7 2007-001217 R-CHIP;82OHM,5%,1/16W,TP,1005 1 SA
UR73 2007-001305 R-CHIP;120ohm,5%,1/16W,TP,1005 1 SA
UR75 2007-001292 R-CHIP;33ohm,5%,1/16W,TP,1005 1 SA
UR76 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
UR77 3301-001861 BEAD-SMD;600ohm,1005,TP,500ohm 1 SNA
UR8 2007-001217 R-CHIP;82OHM,5%,1/16W,TP,1005 1 SA
UR80 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
UR81 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
UR82 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 1 SA
UR83 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 1 SA
UR87 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
UR88 2007-001305 R-CHIP;120ohm,5%,1/16W,TP,1005 1 SA
UR89 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
UR9 2007-000173 R-CHIP;22ohm,5%,1/16W,TP,1005 1 SA
UR90 2007-000831 R-CHIP;39Kohm,5%,1/16W,TP,1005 1 SA
UR91 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
UR92 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
UR93 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005 1 SA
UR94 2011-001432 R-NET;82ohm,5%,1/16W,L,CHIP,8P 1 SA
UR95 2011-001432 R-NET;82ohm,5%,1/16W,L,CHIP,8P 1 SA
UR96 2011-001432 R-NET;82ohm,5%,1/16W,L,CHIP,8P 1 SA
UR97 2011-001432 R-NET;82ohm,5%,1/16W,L,CHIP,8P 1 SA
UR98 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
UR99 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
VC1 2203-006047 C-CER,CHIP;33nF,10%,16V,X7R,10 1 SA
VC10 2203-000438 C-CER,CHIP;1nF,10%,50V,X7R,100 1 SA
VC11 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC12 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC13 2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,35 1 SA
VC14 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
VC15 2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,10 1 SA
VC16 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC17 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC18 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC19 2203-005061 C-CER,CHIP;100nF,+80-20%,16V,Y 1 SA
VC2 2203-006047 C-CER,CHIP;33nF,10%,16V,X7R,10 1 SA
VC20 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,1 1 SA
VC21 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3 1 SA
VC3 2203-006047 C-CER,CHIP;33nF,10%,16V,X7R,10 1 SA
VC4 2203-006047 C-CER,CHIP;33nF,10%,16V,X7R,10 1 SA
VC5 2203-006047 C-CER,CHIP;33nF,10%,16V,X7R,10 1 SA
VC6 2203-006047 C-CER,CHIP;33nF,10%,16V,X7R,10 1 SA
VC7 2203-000233 C-CER,CHIP;0.1nF,5%,50V,C0G,10 1 SA
VC8 2203-000233 C-CER,CHIP;0.1nF,5%,50V,C0G,10 1 SA
VIC1 1003-001881 IC-MOTOR DRIVER;BD7956FS,HSSOP 1 SA
VR1 2007-000138 R-CHIP;100ohm,5%,1/16W,TP,1005 1 SA
VR10 2007-000138 R-CHIP;100ohm,5%,1/16W,TP,1005 1 SA
VR11 2007-000034 R-CHIP;1OHM,5%,1/4W,TP,3216 1 SA
VR12 2007-000034 R-CHIP;1OHM,5%,1/4W,TP,3216 1 SA
VR13 2007-000034 R-CHIP;1OHM,5%,1/4W,TP,3216 1 SA
VR14 2007-000034 R-CHIP;1OHM,5%,1/4W,TP,3216 1 SA
VR15 2007-000034 R-CHIP;1OHM,5%,1/4W,TP,3216 1 SA
VR16 2007-000034 R-CHIP;1OHM,5%,1/4W,TP,3216 1 SA
VR18 2007-000034 R-CHIP;1OHM,5%,1/4W,TP,3216 1 SA
VR20 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
VR25 2007-007107 R-CHIP;100Kohm,1%,1/16W,TP,100 1 SA
VR26 2007-000159 R-CHIP;56Kohm,5%,1/16W,TP,1005 1 SA
VR27 2007-000159 R-CHIP;56Kohm,5%,1/16W,TP,1005 1 SA
VR28 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
VR31 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR32 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR33 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR34 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR35 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR36 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR37 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR38 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR39 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR40 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR41 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR42 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR43 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR44 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR45 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR46 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR47 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR48 3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
VR5 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
VR6 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
VR8 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005 1 SA
VR9 2007-000164 R-CHIP;150KOHM,5%,1/16W,TP,100 1 SA
W012 6002-001086 SCREW-TAPPING;PH,+,-,B,M1.7,L5 1 SA
W018 6003-001450 SCREW-TAPTITE;PH,+,-,S,M2.6,L5 2 SA
W274 6001-001730 SCREW-MACHINE;BH,+,-,M1.7,L2.5 2 SA
W350 6001-001003 SCREW-MACHINE;BH,+,M2.6,L6,ZPC 4 SA
W352 6001-000883 SCREW-MACHINE;PH,+,M1.4,L5,ZPC 1 SNA
W353 6003-001199 SCREW-TAPTITE;PWH,+,-,B,M2,L7, 4 SA
W354 6003-001258 SCREW-TAPTITE;PH,+,B,M1.4,L2.0 4 SA
W355 6003-001526 SCREW-TAPTITE;CH,+,S-TITE,M1.4 2 SNA
W377 6001-001291 SCREW-MACHINE;CH(0.5),*,-,M1.7 3 SA
Y1 2802-001163 RESONATOR-CERAMIC;33.86MHz,0.5 1 SA
AK92-01223A ASSY PCB-LOADER;DVD-R135A/XAA, 1 SNA
AC99-40322L ASSY PCB-LOADER,c;DVD-R135A/XA 1 SNA
0202-001221 SOLDER-CREAM;PF305-116HO(A),-, 4.04 SNA
AC99-90324K ASSY PCB-LOADER,m;DVD-R135A/XA 1 SNA
0202-001214 SOLDER-WIRE FLUX;HI-ALMIT HR19 0.024 SNA
AK97-01857A ASSY-SUB PICK UP;-,SOH-DR4,- 1 SNA
0201-000169 ADHESIVE-CYA;ARCN-A501F,NTR 0.01 SNA
0201-000172 ADHESIVE-AA;EP-171,BRN 0.01 SNA
0201-001006 ADHESIVE-AA;#7452,TRP,-,- 0.02 SNA
0201-001553 ADHESIVE-TP;G-800-A,GRY,220?40 0.013 SNA
0201-001718 ADHESIVE-A.C.F;A-80T,SILVER,11 0.003 SNA
0201-001819 ADHESIVE-UV;8833M,YELLOW,21000 0.05 SNA
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
Electrical Parts List
Samsung Electronics 7-11
This Document can not be used without Samsung’s authorization
0202-001499 SOLDER-WIRE FLUX;SR34 SUPER LF 0.085 SNA
0602-001127 DIODE-LASER;160mW,2,658nm,CAN 1 SNA
AH61-00812A SPRING ETC-L/G HOLDER;SOH-DH2, 1 SNA
AK61-00720A HOLDER-LD DVD;SOH-DR3.5,Zn,4.8 1 SNA
AK61-00721A HOLDER-LD CD;SOH-DR3.5,Zn,T6.2 1 SNA
AK61-00722A HOLDER-LG;SOH-DR3.5,Zn,T6.43,W 1 SNA
AK61-00747A SPRING ETC-SHAFT GUIDE;SOH-DR4 1 SNA
AK63-00438A COVER BASE;SOH-DR4,Cu,T0.2,W32 1 SNA
AK97-01859A ASSY-ACT;-,SOH-DR4,- 1 SNA
0201-001081 ADHESIVE-AA;1401C,RED,-,BOND-L 0.006 SNA
0201-001230 ADHESIVE-CYA;LOCTITE 480,BLK,3 0.002 SNA
0201-001709 ADHESIVE-UV;8839L,YEL,24500mPa 0.01 SNA
0201-001793 ADHESIVE-UV;8791L3,WHITE,20000 0.01 SNA
0202-001499 SOLDER-WIRE FLUX;SR34 SUPER LF 0.085 SNA
3302-001651 MAGNET-RARE EARTH;AF,14000Gaus 2 SNA
3812-001263 WIRE-NO SHEATH CU;SCW,-,19MM,- 1 SNA
3812-001419 WIRE-NO SHEATH CU;SCW,0V,18.5m 5 SNA
AK62-00020A YOKE-ACT;SOH-DR3,SPCC,T7.6,W24 1 SNA
AK67-00040A LENS-OL;SOH-DR3,PLS,WHT,3.8,1. 1 SNA
AK97-01858A ASSY-BLADE;-,SOH-DR4,- 1 SNA
0201-001253 ADHESIVE-STR;TB2212B,BLK,25(25 0.008 SNA
0201-001371 ADHESIVE-SIL;KE3494,GRAY,50 PA 0.002 SNA
0202-001215 SOLDER-BAR;HSE-16,S60S-20,D3,S 0.01 SNA
AK61-00480A BLADE-ACT;SOH-DR3,E5006J,L,IVO 1 SNA
0201-001911 ADHESIVE-UV;ZV-102L,WHITE,8200 0.06 SNA
AK97-01860A ASSY-FPCB;-,SOH-DR4,DVD-RECORD 1 SNA
0202-001221 SOLDER-CREAM;PF305-116HO(A),-, 0.12 SNA
0603-001181 PHOTO DIODE;5.5V,658.79nm,- 1 SA
0603-001187 PHOTO-RECEIVER;6.0V,17.0mA,650 1 SNA
1003-001854 IC-DIODE DRIVER;EL6939CLZ,LPP, 1 SA
1404-001328 THERMISTOR-NTC;10Kohm,-,3370K, 1 SNA
2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
2007-000076 R-CHIP;330ohm,5%,1/10W,TP,1608 1 SA
2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 2 SA
2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005 1 SA
2007-000309 R-CHIP;10ohm,5%,1/10W,TP,1608 1 SA
2007-000932 R-CHIP;470OHM,5%,1/16W,TP,1005 1 SA
2007-001319 R-CHIP;1.2KOHM,5%,1/16W,TP,100 1 SA
2007-007136 R-CHIP;4.7Kohm,1%,1/16W,TP,100 1 SA
2011-001261 R-NET;33ohm,5%,1/16W,L,CHIP,8P 1 SA
2011-001344 R-NET;100ohm,5%,1/16W,L,CHIP,8 1 SA
2104-001087 VR-SMD;2.2Kohm,25%,0.15W,TOP 2 SA
2203-000189 C-CER,CHIP;100nF,+80-20%,25V,Y 5 SA
2203-000626 C-CER,CHIP;0.022nF,5%,50V,C0G, 1 SA
2203-005664 C-CER,CHIP;4700nF,10%,6.3V,X5R 1 SA
2203-006158 C-CER,CHIP;100nF,10%,16V,X7R,1 4 SNA
3301-001419 BEAD-SMD;220ohm,1608,TP,133ohm 1 SA
3708-002193 CONNECTOR-FPC/FFC/PIC;50P,0.5m 1 SA
AK32-00004A SENSOR PHOTO;CNB1001,-25~85,-, 1 SNA
AK41-00626A FPC-MAIN;SOH-DR4,00,POLYAMIDE, 1 SNA
AK61-00723A PLATE-PD;SOH-DR3.5,Zn,1.2,13.4 1 SNA
AK97-01862A ASSY-OPT;-,SOH-DR4,DVD-RECORDE 1 SNA
0201-001525 ADHESIVE-UV;8840L,YEL,TRANS,23 0.03 SNA
0201-001709 ADHESIVE-UV;8839L,YEL,24500mPa 0.02 SNA
0201-001819 ADHESIVE-UV;8833M,YELLOW,21000 0.05 SNA
AK61-00717A BASE-PICK UP;SOH-DR4,ZnDC,T12, 1 SNA
AK61-00724A HOLDER-GT;SOH-DR3.5,Zn,T1.6,W5 1 SNA
AK61-00742A SPRING ETC-DVD GT;SOH-DR4,Cu,- 1 SNA
AK67-00061A LENS-CL;SOH-DR4,PLS,WHT,6.6,1. 1 SNA
AK67-00055A LENS-CDL;SOH-DR4,-,CLEAR,R1.9, 1 SNA
AK67-00056A LENS-ASL;SOH-DR4,-,CLEAR,5.9*5 1 SNA
AK67-00058A LENS-QWP;SOH-DR4,GLS,WHT,5.5 * 1 SNA
AK67-00060A LENS-WBS;SOH-DR4,GLS,WHT,5.5 * 1 SNA
AK67-00062A LENS-MR;SOH-DR4,GLS,WHT,7.0 * 1 SNA
AK67-00063A LENS-PBS;SOH-DR4,GLS,WHT,4.0 * 1 SNA
AK67-00036A LENS-DVD GT;SOH-DR3,GLS,WHT,2. 1 SNA
0602-001115 DIODE-LASER;4.5MW,2V,785NM,TR 1 SNA
AK67-00059A LENS-CD GT;SOH-DR4,GLS,WHT,2.0 1 SNA
C011 AK61-00519A SPRING ETC-DOOR;DVD-SR420,STS3 1 SA
C022 AK64-01939B DOOR-FRONT;DVD-R150/XAX,ABS 94 1 SA
FL261 3809-001906 FFC CABLE-FLAT;30V,80,65mm,40P 1 SA
VS203 AK39-00103A LEAD CONNECTOR-ASSY;DVD-R135A/ 1 SA
W001 6003-000275 SCREW-TAPTITE;BH,+,-,B,M3,L10, 5 SA
W009 6003-000276 SCREW-TAPTITE;BH,+,-,B,M3,L10, 4 SA
W200 6003-001375 SCREW-TAPTITE;BH,+,-,B,M3,L8,Z 2 SA
W268 6003-000254 SCREW-TAPTITE;BH,+,-,S,M3,L6,Z 1 SA
W275 6003-001561 SCREW-TAPTITE;BH,+,-,B,M3,L6,Z 4 SA
AC39-00073A CABLE-RCA;SJ01-08-099,1.2MT,3P 1 SA
AC39-42001J CABLE-RF ASSY;-,-,#1365,1200mm 1 SA
AK68-01316A MANUAL USERS;DVD-R150/XAC,XAC, 1 SA
AK69-00500B PACKING CASE;DVD-R150//XAC,PEP 1 SA
Loc.No Part No Description ; Specification Q’ty S.N.A Remark Loc.No Part No Description ; Specification Q’ty S.N.A Remark
7-12 Samsung Electronics
Electrical Parts List
MEMO
This Document can not be used without Samsung’s authorization.Samsung Electronics 8-1
8. Block Diagrams
8-1 All Block Diagram- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
8-2 DIC1(S5L3210) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
8-3 AIC1(PCM1753) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
8-4 FIC1(TSB4AB1) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
8-5 VIC1(TW9906) Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
8-2
8-3
8-4
8-5
8-6
Block Diagrams
8-2 Samsung Electronics
This Document can not be used without Samsung’s authorization.
8-1 All Block Diagram
CVBS1
S-VIDEO1
CVBS2
VIC1(Main)
Video Decoder
DIC1 (Main)
MPEG-2 A/V CODEC
DIC3(Main) FLASH
DVD- DRIVE (4.7GB)
L1
R1
L2
R2
L/R from
Tuner
1394 JACK
FIC1 (Main)
IEEE1394PHY
IC601 (JACK)
Front Micom
Front PCB
Key Input
Remocon
DIC2 (Main)
DDR-SDRAM
ATAPI
Y
PB
PR
S-VIDEO
VIDEO
AIC1(Main)
Audio D/A
HIC1(HDMI)
Transmitter
L1
L2
R1
R2
COAXIAL
OPTICAL
DIGITAL AUDIO OUT
IEC-958
Component (480i / 480P)
IC201
(JACK)
IC203
(JACK)
AUDIO
VIDEO
Block Diagrams
Samsung Electronics 8-3This Document can not be used without Samsung’s authorization.
8-2 DIC1(S5L3210) Block Diagram
Block Diagrams
8-4 Samsung Electronics
This Document can not be used without Samsung’s authorization.
8-3 AIC1(PCM1753) Block Diagram
Block Diagrams
Samsung Electronics 8-5This Document can not be used without Samsung’s authorization.
8-4 FIC1(TSB4AB1) Block Diagram
Block Diagrams
8-6 Samsung Electronics
This Document can not be used without Samsung’s authorization.
8-5 VIC1(TW9906) Block Diagram
Samsung Electronics 9-1
9. Wiring Diagram
2.5 IN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
2.5 IN
RESET
TXD
16 P (B/D to B/D)
CON 1
30 P (B/D to B/D)
CON 2
40 PIN_FFC_CON
CN 5
CON 4 CON 3
PZWZ1
FCON5
FCON1
FCON3
FCON4
JP 9
FF_SCLK
RXD
RRQ
SRQ
GND
GND
WAKEUP
WAKEUP GND
TPB-
TPA+
TPA-
TPB+
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
GND
Cr/R_O
Cr/R_IN
R_IN
Cb/B_O
Cb/B_O
Y/G_IN
Y/G_O
R_OUT
Cb/B_IN
AL5V
C_O
L_OUT
C_IN
GND
CVBS_IN
Y_O
AUD_MUTE
IEC_958
5VCC
3.3V
Y_IN
CVBS_O
ZERO_L
ZERO_R
1.35 IN
1.35 IN
L_IN
GND
GND
GND
2.5 IN 1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
2.5 IN
RESET
TXD
RXD
RRQ
SRQ
GND
GND
GND
TPB-
TPA+
TPA-
TPB+
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
GND
Cr/R_O
Cr/R_IN
R_IN
Y/G_IN
Y/G_O
R_OUT
Cb/B_IN
F5V
C_O
L_OUT
C_IN
GND
CVBS_IN
Y_O
AUDIO_MUTE
IEC_958
AL5V
V3.3
Y_IN
CVBS_O
ZERO_L
ZERO_R
1.35 IN
1.35 IN
L_IN
GND
GND
GND
FF_SCLK
Wiring Diagram
9-2 Samsung Electronics
MEMO
Samsung Electronics 10-1
10. PCB Diagrams
10-1 Main PCB - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-2 Jack PCB - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-3 Key PCB - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-4 Function PCB - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
10-2
10-4
10-6
10-7
PCB Diagrams
10-2 Samsung Electronics
10-1 Main PCB
DIC1
VIC1
RIC1
RIC2
DIC7
DIC2
Œ
¨
ˆ
Ø
´
´
ˇ
∏
COMPONENT SIDE
LOC.NO X-Y
DIC7 A-0
RIC2 A-1
VIC1 A-3
RIC1 B-0
DIC2 C-0
DIC1 C-3
ŒAUDIO DATA ´VIC1 of Main PCB Clock
ˇVIC1 of Main PCB DATA ¨Digital clock(117)
ˆDigital clock(118) ØDigital clock(119)
∏DIC1 of Main PCB Clock
PCB Diagrams
Samsung Electronics 10-3
DIC3
DIC5 TIC1
DIC6
AIC1
Ø
∏
ˆ
¨
ˇ
´
Œ
”
CONDUCTOR SIDE
LOC.NO X-Y
CEIC1 A-2
AIC1 B-3
DIC3 D-0
TIC1 D-2
DIC5 D-5
ŒCVBS(Color-bar) ´Y(Color-bar)
ˇC(Color-bar) ¨Y(Color-bar)
ˆPb(Color-bar) ØPr(Color-bar)
∏Digital clock(116) ”DIC3-Pin26
PCB Diagrams
10-4 Samsung Electronics
IC601
IC703
IC801
IC701
IC604
IC603
VIC1
10-2 Jack PCB
COMPONENT SIDE LOC.NO X-Y
IC601 A-4
IC703 A-6
IC603 B-5
IC801 C-2
VIC1 C-4
IC701 D-0
AIC4 E-5
IC604 F-5
PCB Diagrams
Samsung Electronics 10-5
IC703
IC601
IC801
IC701
IC604
IC603
VIC1
CONDUCTOR SIDE
LOC.NO X-Y
IC601 A-4
IC703 A-6
IC603 B-5
IC801 C-2
VIC1 C-4
IC701 D-0
AIC4 E-5
IC604 F-5
PCB Diagrams
10-6 Samsung Electronics
COMPONENT SIDE
CONDUCTOR SIDE
10-3 Key PCB
PCB Diagrams
Samsung Electronics 10-7
10-4 Function PCB
COMPONENT SIDE
CONDUCTOR SIDE
PCB Diagrams
10-8 Samsung Electronics
MEMO
This Document can not be used without Samsung’s authorization.
Samsung Electronics 11-1
11. Schematic Diagrams
11-1 S.M.P.S (Jack PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-2 AV Input (Jack PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-3 Micom (Jack PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-4 I/O (Jack PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-6 CODEC (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-7 AV (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-8 ATAPI-Flash (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-9 DDR (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-10 DV_1394 (Main PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-11 Audio (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-12 Main Connector (Main PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-13 HDMI (Main PCB)- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-14 Sub and Key (Sub and Key PCB) - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
11-2
11-3
11-4
11-5
11-6
11-7
11-8
11-9
11-10
11-11
11-12
11-13
11-14
For schematic Diagram
- Resistors are in ohms, 1/8W unless otherwise noted.
Note
Special note :
Most semiconductor devices are electrostatically sensitive and therefore require the special handling techniques described under the
“electrostatically sensitive (ES) devices” section of this service manual.
Note :
Do not use the part number shown on this drawing for ordering. The correct part number is shown in the parts list (may be slightly
different or amended since this drawing was prepared).
Important safety notices :
Components identified with the mark have the special characteristics for safety. When replacing any of these components.
Use only the same type.
System
Control
Block
System
Control
Block
System
Control
Block
AV Block
AV Block
AV Block
AV Block TM Block
SMPS Block
SMPS Block
SMPS Block
LED Display Block
Connect
Block Identification of PCB
Jack PCB (Component Side)
Schematic Diagrams
11-2 Samsung Electronics
This Document can not be used without Samsung’s authorization.
11-1 S.M.P.S (Jack PCB)
Power
Schematic Diagrams
Samsung Electronics 11-3
This Document can not be used without Samsung’s authorization.
Power 5V, 12V Audio input Audio output Video input Video output
11-2 AV Input (Jack PCB)
Schematic Diagrams
11-4 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Power 5V Video input
11-3 Micom (Jack PCB)
Schematic Diagrams
Samsung Electronics 11-5
This Document can not be used without Samsung’s authorization.
Power 3.3V Video output
Power 5V Audio input Audio output Video input
11-4 I/O (Jack PCB)
Schematic Diagrams
11-6 Samsung Electronics
This Document can not be used without Samsung’s authorization.
GND
Video
Audio
Œ
Power
´ ˇ ¨
11-6 CODEC (Main PCB)
ŒIEC958
(DIC1-Pin128)
´CVBS(Color-bar)
(DIC1-Pin106)
ˇY(Color-bar)
(DIC1-Pin103)
¨C(Color-bar)
(DIC1-Pin104)
◆
These are the waveforms of DVD-R150.
Caution There can be some differences
(Voltage, Frequency, stc.) among cameras.
Schematic Diagrams
Samsung Electronics 11-7
This Document can not be used without Samsung’s authorization.
Power
GND
Video
Audio
´¨
Œ
ˇ
11-7 AV (Main PCB)
ŒI2S_LRCK
(AIC1_Pin3)
´I2S_BCK
(AIC1_Pin1)
ˇI2S_MCK
(AIC1_Pin16)
¨I2S_DOO
(AIC1_Pin2)
◆
These are the waveforms of DVD-R150.
Caution There can be some differences
(Voltage, Frequency, stc.) among cameras.
Schematic Diagrams
11-8 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Power GND
Œ
11-8 ATAPI-Flash (Main PCB)
ŒDIC3-Pin26
◆
These are the waveforms of DVD-R150.
Caution There can be some differences (Voltage, Frequency, stc.) among cameras.
Schematic Diagrams
Samsung Electronics 11-9
This Document can not be used without Samsung’s authorization.
Power
GND
11-9 DDR (Main PCB)
Schematic Diagrams
11-10 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Power
GND
Œ
11-10 DV_1394 (Main PCB)
Œ1394_SCLK
(TIC1_Pin2)
◆
These are the waveforms of DVD-R150.
Caution There can be some differences (Voltage, Frequency, stc.) among cameras.
Schematic Diagrams
Samsung Electronics 11-11
This Document can not be used without Samsung’s authorization.
Vcc Audio
11-11 Audio (Main PCB)
Schematic Diagrams
11-12 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Power
GND
Video
Audio
ˇ´Œ
¨
11-12 Main Connector (Main PCB)
ŒY(Color-bar)
(CON2_Pin6)
´Cb(Color-bar)
(CON2_Pin4)
ˇCr(Color-bar)
(CON2_Pin2)
¨IEC958
(CON2_Pin24)
◆
These are the waveforms of DVD-R150.
Caution There can be some differences
(Voltage, Frequency, stc.) among cameras.
Schematic Diagrams
Samsung Electronics 11-13
This Document can not be used without Samsung’s authorization.
GND
´ Œ
Power
¨
ˇ
11-13 HDMI (Main PCB)
ŒI2C_CLK
´I2C_DAT
ˇIEC958
¨VO_CLK
◆
These are the waveforms of DVD-R150.
Caution There can be some differences (Voltage, Frequency, stc.) among cameras.
Schematic Diagrams
11-14 Samsung Electronics
This Document can not be used without Samsung’s authorization.
Power Audio
11-14 Sub and Key (Sub and Key PCB)
Samsung Electronics 12-1
12. Operating Instructions
Operating Instructions
12-2 Samsung Electronics
Operating Instructions
12-3
Samsung Electronics
Operating Instructions
12-4 Samsung Electronics
Operating Instructions
12-5
Samsung Electronics
Operating Instructions
12-6 Samsung Electronics
Operating Instructions
12-7
Samsung Electronics
Operating Instructions
12-8 Samsung Electronics
Operating Instructions
12-9
Samsung Electronics
Operating Instructions
12-10 Samsung Electronics
Operating Instructions
12-11
Samsung Electronics
Operating Instructions
12-12 Samsung Electronics
Operating Instructions
12-13
Samsung Electronics
Operating Instructions
12-14 Samsung Electronics
Samsung Electronics 13-1
13. Circuit Operating Descriptions
13-1 Power
13-1-1 About S.M.P.S (Ringing Choke Converter Method)
◆Terms
1) 1st : Common power input to 1st winding.
2) 2nd : Circuit followings output winding of transformer.
3) f (Frequency) : Switching frequency (T : Switching cycle)
4) Duty : (Ton/T) x 100
Transformer Vout
(Np)
(Vp)
Switch
Vs switch
I switch
Vin
ON/OFF Control
+
–+
–
+
+
+
–
(Vs)
(Ns)
Vreg
REGULATOR
Fig. 13-1
13-1-2 Circuit description [FLY-Back RCC(Ringing Choke Converter)] Control
(a) AC Power Rectification/Smoothing Terminal
1) PADT1, PADT2, PADT3, PADT4 : Convert AC power to DC (Wave rectification).
2) PRCU1 : Smooth the voltage converted to DC.
3) PALT1, PALT2, PACT1, PACT2 : Noise removal at power input/output.
4) PLRU1 : Rush current limit resistance at the momemt of power cord insertion.
· Without PLRT1, the bridge diode might be damaged as the rush current increases.
Circuit Operating Descriptions
13-2 Samsung Electronics
0
Vswitch
dt
Toff
t
Inverted power
by leakage
inductance
Fig. 13-2
(b) SNUBBER Circuit :
PSRZ1, PSRZ2, PSCX1, PSCZ2, PSDZ1
1) Prevent residual high voltage at the terminals of
switch during switch off/Suppress noise.
High inverted power occurs at switch off,
because of the 1st winding of transformer :
(V=-L1 xdi/dt. L1 : Leakage Induction)
A very high residual voltage exist on both terminals
of PQIZ1 because dt is a very short.
2) SNUBBER circuit protects PQIZ1 from damage
through leakage voltage suppression by RC,
(Charges the leakage voltage to PSDZ1 and PSCX1
and discharges to PSRZ1, PSRZ2).
3) PSCZ2 : For noise removal
(c) PQIZ1 Vcc circuit
1) PQIZ1 Vcc : PVRL4, PVDL1, PVCL1
!Use the output of transformer as Vcc,because the current starts to flow into transformer while PQIZ1 is
active
@Rectify to PVDL1 and smooth to PVCL1.
#Use the output of transformer as PQIZ1 Vcc : The loads are different before and after PQIZ1 driving.
(Vcc of PQIZ1 decreases below OFF voltage , using only the resistance dut to lode increase after PQIZ1
driving.)
(d) Feedback Control Circuit
ICE3B2065P
TRANS(PQTZ1) PPDF1 PPLF1
PFRF5
PFRF3
PFID1
PBIZ1
PFRF1
PFRF2
PFRF6
PFCF1
PFRF4
PPCF3
PPC1
5.8V
Fig. 13-3
Circuit Operating Descriptions
Samsung Electronics 13-3
1) F/B terminal of PQIZ1 determines output duty cyle.
2) C-E (Collector-Emitter) of PQIZ1 and F/B potential of PQIZ1 are same.
13-1-3 Internal Block Diagram (Internal Block Diagram of S.M.P.S. Circuit)
Smoothing
Circuit
Rectified Circuit
Line Filter
Power IN
(110V)
(ICE3B2065P)
Noise
Removal
(SNUBBER)
PWM Control
Circuit
Converter
Voltage
Detection
Circuit
3.0V Rectified
Smoothing Circuit
5.4V Rectified
Smoothing Circuit
12V Rectified
Smoothing Circuit
3.3V Rectified
Smoothing Circuit
12V Rectified
VoltageCircuit
5V Rectified
VoltageCircuit
O
U
T
P
U
T
33V Rectified
Smoothing Circuit
Fig. 13-4
Circuit Operating Descriptions
13-4 Samsung Electronics
13-2 AV Codec
Fig. 13-5
· Main system control · ATAPI interface with DVD-Multi Drive
· A/V Encoding/Decoding · Analog Progressive/interlaced video output
· Transcoding/rating
· IEEE 1394 link layer function
Circuit Operating Descriptions
Samsung Electronics 13-5
13-2-1 GENERAL DESCRIPTION
SAMSUNG S5L3210 MPEG AV Codec is designed to provide a cost-effective, low power and high performance
DVD recorder solution for DVD-VR, DVD-Video, DVD-Audio & many of CD applications. To reduce total system
cost, S5L3210 also provides the following features: a front-end controller, a back-end decoder, a control CPU with
separate 4KB Instruction and 4KB Data Cache, improved audio DSPs, a programmable video encoder with a dual
output capability of interlaced and progressive scan, a DDR memory controller, 4-channel Timers with PWM, I/O
Ports, 6-channel 10-bit Video DACs, 2-channel PWM processors for Hi-fi Audio, 2-channel UARTs with hand-
shake, IIC-BUS interface, IIS interface, SPI, ATAPI, IEEE1394, USB 2.0 Full & Low Speed Host I/F and PLL for
clock generation.
13-2-2 A/V Processor (DIC1) Functional Description
1) RISC processor architecture
· ARM946ES Core processor
· Fully 16/32-bit RISC architecture.
· Harvard cache architecture with separate 4KB Instruction and 4KB Data cache
· Protection unit to partition memory and set individual protection attributes for each partition
· Up to 160 MHz operating frequency
2) Memory controller
· Address space: 128M bytes for each bank (Total 1Gbyte space)
· Supports programmable 8/16-bit data bus width for ROM/SRAM interface.
· Supports 16-bit data bus width for DDR-SDRAM interface.
· 3 memory banks. - 2 memory banks for ROM, SRAM etc. - 1 memory banks for SDRAM
· Fully Programmable access cycles for all memory banks.
· Supports external wait signal to expand the bus cycle.
3) Cache memory
· 64 way set-associative cache with I-Cache (4KB) and D-Cache (4KB).
· 8-words per line with one valid bit and two dirty bits per line
· Pseudo random or round robin replacement algorithm.
· Write through or write back cache operation to update the main memory.
· The write buffer can hold 8 words of data and four address.
4) Clock & power manager
· Low power consumption
· On-chip PLLs
· Clock can be fed selectively to each function block by software.
Circuit Operating Descriptions
13-6 Samsung Electronics
5) Interrupt controller
· 62 interrupt sources(Watch dog timer, 4 Timers, UARTs, 8 External interrupts, IIC, IIS, SPI, IR,...)
· Edge detect mode on external interrupt source.
· Programmable polarity of rising and falling.
· Supports FIQ (Fast Interrupt request) for very urgent interrupt request.
6) Video pre-processor
· Noise Reduction by Motion-compensated Temporal Filtering.
· Bitmap Generation for Motion Estimation of MPEG Encoder.
· Scene Change Detection.
7) MPEG video encoder
· Encodes MPEG1 & MPEG2 video stream (MP@ML)
· Efficient Motion Estimation by reduced calculation and accurate Motion Vector Search
8) MPEG video decoder
· Decodes MPEG1, MPEG2 (MP@ML) & DivX/MPEG4 video stream(ASP)
· Error detection and autonomous error concealment.
9) Audio DSP
· Decodes Dolby AC-3, MPEG1, MPEG2, DTS and WMA
· Supports down mix
· MAC2424 for audio signal processing
- 24-bit high performance fixed-point DSP coprocessor, 24x24 MAC operation in 1 cycle
- 2 multiplier accumulator registers, 4 general accumulator registers, and 8 pointer registers
Circuit Operating Descriptions
Samsung Electronics 13-7
13-3 SERVO (DVP Multi Drive)
1) Pick-Up
Data in the disc is processed from the optical pick-up unit (OPU). OPU includes the Elantec chip (EL6912c)
which is a highly integrated laser diode driver designed to support multi-standard writable optical drives. This
chip also has an IV amplifier with concurrent read and write sampling. The architecture allows reprogramming
of the timers to support different media DVD or CD standards, and different speed.
2) A-Chip
A chip is RF processor. This module performs RF signal processing which includes RFIP, RFIN, AGC, RF equal
izer. This processor is able to detect tracking error, focus error and various signals such as CE, PE, SBAD,
DEFECT, BCA, MIRROR, Wobble, TZC, RC, and RECD.
3) C-Chip
C-Chip is composed of DP1, PRML and WS.
First, the Data processor1 (DP1) performs EFM/EFM+ Demodulation and data is stored in the buffer
memory in data processor2 (DP2). DVD data in this buffer is transferred to CSS/ATAPI through
error-correction code
(ECC), descramble process and error detection code (EDC).
Second, WS performs the following processes.
! Delay compensation using Shift register
@ Sample/Hold pulse generation
# I/V Gain Control
$ Providing clock for RF chip
% OPC Control signal generation
Lastly, PRML completes the adaptive EQ/VD and Digital PLL.
4) D-Chip
D-Chip consists of Servo DSP, DP2 and 1Mbit memory. Servo DSP is dealing with controlling the servo-mecha
nism in DVD recorder. Servo-DSP has the following features.
! Bulit-in 10Bit ADC(8ch), DAC(3ch) and PWM(7ch)
@ Step Motor Control Logic: Macro/Micro Step
# Track Counter: long distance velocity control direct seek
$ Shock/Defect detection
% Header (DVD-RAM)/Land Pre-Pit (DVD-R/RW) Detection
^ Several Servo Monitor Signal Detection
& RF IC Interface
* Micom Interface
( Digital Servo Control of focus, tracking, sled and seek
) Disc Auto-Detection
1 Automatic Adjustment of the offset, balance and gain of Focus and Tracking Signal
2 Direct Seek with Velocity Control
3 Step Motor Control: Macro Seek
4 De-Track and Lens Shift Detection and Compensation
5 Center Error Control
6 DVD Layer Jump
7 Tilt Detect and Compensation
DP2 performs High Speed ECC and CD DA Decoder.
Circuit Operating Descriptions
13-8 Samsung Electronics
5) ATAPI Controller
ATAPI (ATA Packet Interface) the standard interface protocol used to connect the CD/DVD Drive to IDE inter
face. Data from the front-end is processed to back-end through this ATAPI protocol. Sanyo chip (LC98600CT-
XB0) is utilized for ATAPI interface. LC98600CT-XB0 has the following features.
! ECC and EDC correction/addition for CD-ROM data
@ Subcode decoding/encoding
# Spindle servo control
$ CLV/CAV servo control using ATIP data
% ATIP decoding and CRC check functions
^Providing random EFM output for PCA use
& High-accuracy write strategy signal output enabled (CD-R 52x)
* Buffer RAM can be accessed by the microcontroller through the LC98600CT-XB0
( Built-in ATA-PI(IDE) interface (supports Ultra DMA modes 0,1, and 2)
) 52x decoding speed/52x encoding speed supported with 33.8688Mhz
1 Maximum transfer speed PIO mode: 16.6 MB/s (with IORDY), Ultra-DMA: 66MB/s (with DMARQ)
2 User can freely set the CD main channel, C2 flag, and subcode areas in buffer RAM
3 Built-in batch transfer function for transferring (CD main channel, C2 flag, etc., in a single operation)
4 Built-in multi-transfer function (allows multiple blocks to be sent to the host automatically in a single
operation)
FPD,PD,I/V amp
LD,LD Driver
Focus Actuator
Tracking Actuator
TILT Actuator
Sled
Motor
Spindle
Motor
Tray
Motor
Motor
Driver
PRML
ENDEC
WRITE
STRATEGY
APC & OPC
Miscellaneous
Signal
(DFT/LPP
/WOBBLE)
Servo Error
(FE/TE/CE/PE
SBAD/RC/TILT)
RF Signal
(AGC/EQ)
SERVO
Processor
ECC
Processor
HOST
ATAPI chip
(ZIC1)
MICOM (MIC1)
A.chip (RIC1) C.chip (CIC1) D.chip (DIC1)
Pick up
Deck
Fig. 13-6
Circuit Operating Descriptions
Samsung Electronics 13-9
13-4 Video Input
13-4-1 Video Input Outline
The model specified in this book uses service manual is the two AV Video input. AV 1 Video input is CVBS1 & S-
Video1 at the Rear Panel. AV 2 Video
input is CVBS2 at the Front Panel.
The analog Video signal select AV 1 or AV 2 by the IC601 (Front Micom).
TIC1 (Video Decoder) diverges from the 27MHz crystal, then generates ITU-R656 (10bits) and
27MHz clock. VIC1 (Video Decoder) does closed caption, copy guard detect processing and A/D conversion
of analog Video signal converted into 11bit Digital Video signal (ITU-R656 Format) is outputted via DIC1 (MPEG2
Decoder &Encoder with video Encoder) of digital part.
AV 1
(Rear)
Video
Input
CVBS 1
Y1
C1
AV 2
(Front)
Video
Input
CVBS2
MM1113
Analog MUX
IC702
Video
Decoder
VIC1
A/V CODEC
DIC1
CVBS
Y
C
ITU-R656 10bit
27MHz
V_SYNC
SDA
SCL
/RSTAV
CVBS
RF
Fig. 13-7
13-4-2 Analog Mux (MM1113)
IC702 is Analog Mux.
As Pin 2, 4 of the IC702 are controlled by the Front Micom, IC702 select RF OF CVBS(Pin1)
Line1 of CVBS[Pin3] and AV2 of CVBS[Pin 5].
The analog Video Signal of IC201 output is selected by the IC601 via VIC1(Video Decoder : TW9906) of analog
Video Input parts.
Circuit Operating Descriptions
13-10 Samsung Electronics
13-4-3 NTSC/PAL Video Decoder (TW9906 : Video Decoder)
The VIC1 (Video Decoder : TW9906) device is a high quality, single-chip digital video decoder that digitizes and
decodes all popular baseband analog video formats into digital component video. The VIC1 (Video Decoder :
TW9906) supports the analog-to-digital (A/D) conversion of component RGB and YPbPr signals, as well as the
A/D conversion and decoding of NTSC, PAL and SECAM composite and S-video into component YCbCr.
This VIC1 (Video Decoder : TW9906) includes four 10-bit 30-MSPS A/D converters. and A/D conversion of 10bit
analog Video signal converted into Digital Video signal (ITU-R656 Format) is outputted via DIC1 (MPEG2
Decoder & Encoder with video Encoder) of digital part.
The following output formats supply 10-bit 4:2:2 YCbCr to the DIC1 (MPEG2 Decoder & Encoder with video
Encoder) of digital part.
On CVBS and S-video inputs, the user can control video characteristics such as contrast, Brightness, saturation,
and hue via an I2C DIC1 port [PIN V17, V18] interface.
The TW9906 decoder includes methods for advanced vertical blanking interval (VBI) data retrieval. The VBI data
processor (VDP) slices, parses, and performs error checking on teletext, closed caption (CC), Copy Guard Detect
Processing and other VBI data.
Circuit Operating Descriptions
Samsung Electronics 13-11
13-5 Video Output
13-5-2 NTSC/PAL Digital
DIC1 inputted from pin E1 with 13.5MHz generates HSYNC and VSYNC which are based on video signal. DIC1
is synchronous signals with decoded video signal.
The above signals, which are CVBS (Composite Video Burst Synchronized), Y(S_Video), C(S_Video),
Y(Component)/G(Green), Cr(component)/R(Red), Cb(component)/B(Blue), are selectively outputted 480I(inter-
laced Video Output), 480P(progressive Video Output) by the Pront button DIC1 adopts 10bit D/A converter.
DIC1 perform video en-coding as well as copy protection.
Fig. 13-8
A/V CODEC
DIC1
Y
C
Y
Cb
Cr
MM1692
VIC1
6dB
AMP
&
75ohm
Drive
LOW
PASS
FILTER
(6MHz)
CVBS
Y
C
Y
Cb
Cr
Front
Micom
IC601
PSO
13-5-1 Outline
DIC1 (MPEG2 Decoder & Encoder with video Encoder) diverges from the 13.5MHz crystal, then generates
VSYNC and HSYNC.
DIC1 (MPEG2 Decoder & Encoder with video Encoder) does RGB encoding, copy guard processing and D/A
conversion of 10bit Video signal converted into analog signal is outputted via amplifer of
analog part.
Circuit Operating Descriptions
13-12 Samsung Electronics
13-5-3 Amplifier (MM1692)
VIC1 of JACK PCB is 6dB amplifier.
Based on CVBS signal, the final output level must be 2Vpp without 75ohm terminal resistance.
Because the level of video encoder output is only 1Vpp, the level is adjusted with the special
amplifier.
When mute of pin 5 is high active, if the pin is floating and connect to power, the output
signal is never outputted.
Y, C, Y(R), Cb(B), Cr(R) outputted from video encoder are inputted to VIC1 [Pin14, 16, 13, 12,
11] respectively. And CVBS Output[Pin 15] is made by Y & C Mixing signal.
The signal to which gain is adjusted by amplifier is outputted from jack via 75ohm Resistance
(VDR1,2,4,5,6,).
Circuit Operating Descriptions
Samsung Electronics 13-13
13-6 Audio
13-6-1 Input Block
This Model has two stereo line input terminals. and internal TV-audio from RF Tuner Block.
These three Analog audio signal source are converted to digital data by Input Block.
Input Block has a Multiplexer (IC203), A/D converter (AIC2).
IC203 change it’s output by selection control signal from IC601 (Front Micom).
13-6-2 Output Block
The model specified in this book uses service manual has two stereo analog line out terminal, and two digital out-
put terminal.
Decoded signal by DIC1 is inputted to AIC1 (D/A Converter), then filtered and amplified by AIC4 (OP-Amp).
And the digital audio signal (IEC-958) is outputted in Optical/Coaxial (S/PDIF) terminal.
AV IN1
(Rear)
L1-in
R1-in
L2-in
L2-in
AV IN2
(Front)
TV Audio
(from tuner
block) RF-R
RF-L
IC203
BU4052
Multiplexer
IC601
(micro controller)
AU5
PCM1803
(Audio A/D
Coverter)
SCKI
BCK
LRCK
DOUT
AV OUT
(Rear)
Optical
Out
Coaxial
Out
AIC4
4560 OP-AMP AU2
PCM1742KE
(Audio D/A
Coverter)
L-out
R-out
SCKI
BCK
LRCK
DOUT
ML
MC
MD
DIC1
S5L3210
A/V Processor
(Dolby AC-3
Encoder/Decoder)
IEC958 DATA
Fig. 13-9
Circuit Operating Descriptions
13-14 Samsung Electronics
13-7 Tuner
1) Low Pass Filter & High Pass Filter
This consists of IF trap circuit and UHF & VHF separation circuit. If the input signal is IF (45.75MHz),
this filter
prevents interference.
2) Single tune
This consists of a filter circuit, RF AMF, impedance conversion circuit, image trap and a single tuning circuit. It
prevents noise and other interference signals. It is very important part which improves NF (noise figure) and
prevents the various of spurious signals.
3) RF AMF
RF AMF is made of FET (Field Effects Transistor). It is controlled by AGC coming from IF DEMOD block.
4) Double tune
It consists of a double tuning circuit to improve characteristic of rejection that results in a better band
characteristic.
5) Mixer IC (Mixer, OSC, PLL)
It consists a VHF and UHF OSC and Mixer circuit. We applied mixer to make better characteristic of rejection,
it shows especially various beat characteristic.
6) PLL IC
The PLL IC plays a role selection of Tuner channel. It was built-in three wire PLL IC, charge pump and band
driver.
The minimum of step frequency is 31.25KH z.
<
<
>
>
Fran
Modulafor
b
acd
e
VHF
8.P.F
VHF
SingleTune VHF
RF Amp
VHF
Double Tune
Mixer IF Amp
OSC 8uffer VHF OSC
IF Single
IF
<>
+B
1/8 Prescaler Band Driver
Prog.Dirlder
Phese Code
Charge Pump
Band Driver
3wice Bas
Recelver
VHF
Single Tune
VHF
-RF Amp
VHF
Double Tune
VHF Mixer
VHF OSC
VHF
OSC Amp
~
VHF OCS
L.P.F
~
~
~
AGC
10 986
15 X-tal
4MHz
1
*()1
4
3
2
1
^&
16 14 13 12
V
L
V
H
U
Fram IF Sectlon
Fram IF Sect lon
TO IF Sect lon
PB TU CLOCK DATA ENABLE LOCK
35
12
1
78 9
Mix IC IC100
fPLL IC
Fig.13-10
Circuit Operating Descriptions
Samsung Electronics 13-15
13-8 IF
1) SAW FILTER
It passes only needed band of the signal that is converted to IF frequency and decrease the others band to
minimize the effect of adjacent channel.
2) RF AGC Control
It used adjusting to determine RF AGC working point in tuner.
3) VCO Tank
When VCO tank detects PLL, it makes the signal which sets a standard.
4) AFT (Auto Frequency Tuning)
AFT automatically controls the oscillator frequency in the tuner, so that it retains a constant level.
It is a quadrature detection type. The carrier, which is detected from video det is directly input to AFT.
The 90 degree delayed phase signal is input at the same time to AFT and, the results come out.
5) IF AMP
IF signal , which is selected in Saw filter, is amplified in IF amp frequency enough to be detected. The IF amp
has parallel inputs & outputs structure.
FM Det
AFT
Lim Amp
1
2
4
5
6
10
11
12
24
21
19
14
15
16
17
Video Amp
N.S.C
APC Tine
Const SW
Lock Det
IF AGC
EQ.Amp
B/W
VCD
AGC
RF AGC Amp
Pra
Amp Mix
APC
Det
Video Det
4.5 MHz
Tunlng
AFT Tank
SIF filter
4.5MHz
SIF Trap
VCD Tank
3456
+B AUDIO OUT AFT OUT VIDEO OUT
To Tuner Section
RF AGC
To Tuner Section
From
Tuner Section
a
b
c
d
SAM Filter
RF AGC Control
(IF Amp)
Fig. 13-11
Circuit Operating Descriptions
13-16 Samsung Electronics
MEMO
Samsung Electronics 14-1
14. Reference Information
14-1 Introduction to DVD
14-1-1 The Definition of DVD
DVD is the next generation medium and is the acronym of the Digital Versatile Disc or thr Digital Video Disc,
which maximizes the saving density of the disk surface using the MPEG-2 compression technology to enable the
storage of 17G bytes of data on the same size CD.
1) 7 times the storage capacity of the conventional CD
- Minimized the track pitch and pit size to 1/2 of conventional CD.
- Uses red laser with short-wavelenght of 650nm (635nm).
DVD Vs. CD-ROM
CD-ROM CD-R/RW DVD-ROM DVD-R/RW DVD-RAM
Disc Thickness 1.2mm 1.2mm 0.6*2mm 0.6*2mm 0.6*2mm
Lens NA 0.45 0.45(0.5) 0.6 0.6 0.6
Laser wavelenght 780um 780um 650um 650um 650um
Track pitch 1.6pm 1.6pm 0.74pm 0.74pm 0.615pm
Capacity 0.65GB 0.65GB 4.7GB 4.7GB 4.7GB
Track structure Pit train Groove Pit train Groove Land/Groove
2) Disc Formats
DVD consists of two 0.6mm discs attached together, enabling access to the upper and lower side of the disk,
and 4 sides could be used at maximum.
Reference Information
14-2 Samsung Electronics
14-1-2 DVD Types
FORMAT TYPE APPLICATIONS
DVD-Video Playback Only High quality image and sound for movies and other video media.
DVD-ROM Read Only Multi-functional, multi-media software that requires large storage capacity.
DVD-Audio Playback Only High quality sound that exceeds the CD, multi-channel Audio.
DVD-R 1 Time Recording As with CD-R, write only once
DVD-RAM
Rewritable This can be virtually used as hard-disk, with a random
(more than 100,000 times) read-write access
Rewritable Similar to DVD-RAM except than its technology features
DVD-RW
(About 1,000 times) a separated read-write access more like phonograph than a hard disk.
Reference Information
14-3Samsung Electronics
14-2 DVD-Video Format
14-2-1 Main Features
1) Able to store up to 160 minutes of Movie by utilizing the MPEG-2 compression technology. ( Aver. 133min.)
2) Enables more than 500 lines of horizontal resolution. (Class corresponding to the Master Tapes used in
broadcasting stations)
3) Provides Dolby Digital 5.1ch Surround 3D sound, which enables theater quality sound (NTSC area).
• For PAL areas, 1 of either MPEG-2 Audio or Dolby Digital must be selected.
4) Multi-Language
• Able to store up to 8 languages of dubbing.
•Able to store up to 32 subtitle languages.
5) Multi-Aspect Ratio
3TV Mode alternatives ; 16:9 Wide Screen (DVD Basic)/4:3 Pan & Scan/Letter Box.
6) Multi-Story
Possible to implement Interactive Viewing which enables the user to select the scenario.
7) Multi-Angle
Able to view the camera angle you selected among the scenes recorded with multiple camera angles.
Note ; The above media features must have the DVD Title that contains the appropriate contents to function
properly.
14-2-2 Audio & Video Specifications
Classification DVD-Video Video-CD LD
Compression MPEG-2 MPEG-1 Analog
Pixel 720 x 480 352 x 240
VIDEO Horizontal resolution Max. 500 Lines Max. 250 Lines Max.420 Lines
Compression rate 1/40 1/140 Analog
Transmission speed Max. 9.8Mbps (variable) 1.15Mbps (fixed)
TV aspect 16:9 / 4:3 4:3 4:3
Audio Max. 8 streams 2CH stereo
Recording type Dolby Digital Linear PCM MPEG-1 Layer 2
AUDIO Transmission rate 448Kbps/stream 6.144Mbps/stream 224Kbps or
Channel 5.1CH/stream 8CH/stream 2CH
Sampling frequency 48KHz 16, 20, 24Bit/48, 96KHz 16Bit/44.1KHz
2 Analog CH.
2 Digital CH.
(16Bit/44.1KHz)
1 Analog CH.
1 Stream of Dolby Digital
2 Digital CH.
(16Bit/44.1KHz)
Reference Information
14-4 Samsung Electronics
14-2-3 Detailed Feature
As the storage capacity increases, the DVD-Video separates the main data and the additional data such as the
Multi-Function into different data areas, enabling the control of time-data ratio to provide the format that enables
the flexible Software development
• 1 Movie (3.5Mbps)
+ Subtitle (1 Language)
+ Surround Audio (1 Language)
= 160min storage (4.673Gbytes)
• 1 Movie (3.5Mbps)
+ Subtitle (4 Language)
+ Surround Audio (4 Language)
= 160min storage (4.680Gbytes)
• 1 Music Video (4Mbps)
+ 2ch High quality Audio (96kHz/24bit)
= 72min storage (4.648Gbytes)
DVD-Video Feature 1 When Developing the DVD Software, various addition and modification is possible.
DVD-Video uses the variable compresion technology, the MPEG-2 to compress the moving image optimally, mini-
mizing the Data loss to Provide a clear, natural screen while increasing the storage time.
DVD-Video Feature 2 Application of the MPEG-2 compression technology.
• MPEG-2 (Variable compression : Max. 1/40)
- Field unit compression.
DVD-Video - Compression rate change according to the amount of Data.
- Differentiates the still image and the moving image
compression rate, reducing Data loss and enables
efficient compression.
•MPEG-1 (Fixed compression : Max. 1/140)
- Frame unit compression.
Video-CD - Compresses all data using the same ratio.
- Fast movements are jagged, and unnatural
Reference Information
14-5Samsung Electronics
DVD-Video can store the audio using the 5.1ch Dolby Digital compression or the advanced Liner PCM method,
providing the better-than-CD quality and theater like audio quality.
•DTS (Digital Theater System)
Home theatre and music playback in the home, DTS provides high quality 5.1-channel surround sound with
many extras not offered by other consumer formats. As well as handling DTS-branded releases from a growing
number of music labels and consumer software producers, DTS provides enhanced 6.1 matrix and DTS 6.1
discrete decoding that envelopes the listener in sound. DTS technology is featured in a wide cross section of
receiver/pre-amplifiers, DVD players and and add-on components from leading consumer audio vendors
•Dolby Digital (AC-3)
- Unlike the traditional Dolby pro-Logic method, the Dolby Digital method separates all 5 main channels
(Front L/R, Center, Surround (Rear) L/R)and the Sub woofer to provide live surround audio.
- Using the Down Mix method, the conventional Dolby Pro-Logic and Stereo are all compatible.
- Each separated channels are played back at CD quality sound. (Frequency band: 20Hz ~ 20KHz)
•Linear PCM (Pulse Code Modulation)
- Provides the high quality Digital sound without the audio data compression.
- Various Digital Recordings are possible as shown in the table to the right.
DVD-Video Feature 3 High quality surround audio.
Sampling Frequency Bit Rate
16bit
48KHz 20bit
24bit
16bit
96KHz 20bit
24bit
•Dolby Digital compatible Audio Mode
Audio Coding
Channel Format
Mode
Front Surround (Rear) Remark
LCRLR
1/0 O Mono
2/0 O O Stereo
3/0 OOO
2/1 O O Mono
3/1 O O O Mono Surround
2/2 OOOO
3/2 OOOOO
Reference Information
14-6 Samsung Electronics
•Audio Dubbing - Max. 8 Languages
•Subtitle - Max. 32 Languages. Capable of storing, and selectiong.
•Linear PCM (Pulse Code Modulation)
DVD-Video Feature 4 Multi-Language
•Unlike the conventional VCD or LD, DVD-Video has the default of 16:9 Wide, and can be viewed using the
conventional 4:3 TV, enabling the expansion of viewer selection capabilities.
- 16 : 9 TV : Wide Mode (16:9 Wide Full Screen)
- 4 : 3 TV : Letter Box Mode, Pan & Scan Mode
DVD-Video Feature 5 Multi-Aspect
•Up to 9 angles of view may be stored, enabling the viewer to select a specific viewpoint at a given time.
--> Especially, for the Music Video and Sports Title, this provides a more lively image of the scene.
DVD-Video Feature 6 Multi-Angle
Note ; This function is disc-dependent, may not work on all DVDs.
Note ; This function is disc-dependent, may not work on all DVDs.
Reference Information
14-7Samsung Electronics
•DVD-Video provides the enviroment suitable for the bi-directional Software develoment, providing multiple
scenarios. This feature enables the Multi-Story function.
DVD-Video Feature 7 Multi-Story
• For the titles that are not suitable for children viewing, Parental Locks are set, requesting user defined
passwords for viewing
•Parential Locks may be set on specific frames of the Title, enabling the player to skip those frames during
playback.
OPTION Parental Lock
•Classify the world into 6 regions, and if the DVD Title and the Player’s “Reginal Code” do not agree, playback
is prohibited.
•Regionnal Coding is optional for the Soft developers (Region 0 All Code), but the Hardware developers
must adopt the appropriate regionnal code for sale.
- Region 1 : The United States and its territories, Canada.
- Region 2 : Europe, Japan, Greenland, Egypt, South Africa, the Middle East.
- Region 3 : Taiwan, Hongkong, Korea, South East Asia.
- Region 4 : Mexico, South America, Australia, New Zealand.
- Region 5 : Russia, Eastern Europe, India, Africa.
- Region 6 : China.
- Region 0 : Worldwide (All Code)
COPYRIGHT Regional Code & Macrovision
•Adoptation of the Macrovision System disables the copying on to other media.
Reference Information
14-8 Samsung Electronics
• The image quality of the DVD-Video may vary accoring to the quality of the Master and the Authoring Process
- The image quality of the DVD-Video varies according to the Digital Mastering Source such as the
conventional LD, VCD, or Original Film.
- Different Authoring Process are used accoring to the Software developers, and this may affect the
DVD image quality.
•Authoring Process
Remark DVD-Video Authoring Process
RS 644 [1] CameraLink IEEE-1394 USB 2
Topology Link Link Bus Bus
Windows Driver Proprietary Proprietary Native Native
(Win 200, Win 98) (Win 200, Win 98)
“Guaranteed” ~20 to 40 MByte/s ~255 MBytes/s ~32 MBytes/s[2] ~38 MBytes/s[2]
Bandwidth
Cable Length ~10 m @ 40MHz ~10 meters 4.5 meters 5 meters
~20 m @ 200MHz
Wires Needed for 22[3] 10 4 2
8 Data Bits
Parameter Port No 1 KByte/s ~8 MBytes/s [2] ~9 MBytes/s [2]
Reference Information
14-9Samsung Electronics
14-3 About IEEE1394
14-3-1 Comparison between IEEE-1394 and other digital interfaces
Since there are many different interfaces available, for example, RS422, RS644, and USB, vision system integ rators
are very likely to be confused when choos ing the right interface for their application. For the ideal design of a
vision syste m, it is vital to have the righ t bus/inte rface. To make things even more complex, ther e is no easy
answer such as IEEE-1394 is the best choice.
Furthermore, the new CameraLink standard, promoted by compan ies such as Puln ix, Basler AG, and many
frame grabb er companies, seems to be the stat e of the art interface. So why should IEEE-1394 be an alternative?
These questions are as complex as mostvision applicatio ns and there is no simple guideline .
Each of these interfaces offers many benefits and each of them has its individual drawbacks and restric tions. In
the table below, we try to give a brief comparison of the most popular interface systems.
[1] These specs are for a typical 8-bit camera application operating at 20 MHz or at 40 MHz.
[2] 80% of the bus bandwidth is used for image data and 20% is used for parameter data.
[3] 16 wires are used for data bit transfer and two wires each are used for the separate Line
Valid, Frame Valid, and Pixel Clock signals required with RS-644 transmission.
A careful comparison of the specifications shown in the table should be your first sele ction guide for the inter-
face. For example, for an integ rator who needs very high speed, USB 2 and IEEE-1394 are not the first choice. On
the other hand, these buses are the ones to select in cases
where multiple cameras are needed or cost is a critical issue. Also, the user needs to be aware
that the D-Cam specification curre ntly does not specifically support Line Scan cameras.
However, the specification is open and line scan suppor t could be achieved via Format 7. As
for USB 2, it is still in its infancy in machine vision and we are not aware of any kind of machine vision support.
Reference Information
14-10 Samsung Electronics
14-3-2 Fiexibility and Cost Reduction
1) Hardware Cost Example
Many image processing application engineers face a familiar group of problems when designing and building a
system. The end user requires system flexib ility, simple adaptation, fast delivery times, and most importantly a
reasonable price. With conve ntional systems, whether analogor digital, engine ers must confine them selves to
certain combina tions of the existing cameras, frame grabbers, and software. The product choice for this system
config uration is limited. Unless the decision is made to use a high cost frame grabber that supports multiple cam-
eras, sometimes known as multi-norm , it is usually not possible to operate camera s with different resolutions
from the same frame grabber.
For many applications, the introductio n of digital cameras is hindered by the cost specified by the end custom er,
however technically effective digital cameras may be. With the increa sed use of IEEE-1394 in the industrial image
processing business, many of these problems are solvable in a sure , safe , and cost effec tive way.
This example compares two simi lar vision systems. Each system uses four Megapixel
resolution digital cameras . The traditio nal solu tion consists of one frame grabber per camera, one parallel digital
data cable per camera, and one power supply per camera.
The 1394 solution requi res one hub and one interface card to connect the four cameras , along
with five ine xpensive 1394 cables. The 1394 cables carry power to the cameras directly from the computers inter-
nal power supply. (Note tha t not all compute rs are capab le of supplyi ng enough power for the cameras. In
some cases a separate power supply may be required.)
Traditional Solution
Price 1394 Solution Price
with multiple frame grabbers
Four Cameras 18,000 Four 1394 Cameras 18,000
Four Frame Grabbers 4,400 One 1394 Interface Card 100
Four Cable 400 One 1394 Hub 120
Four power Supplies 320 Five Cables 150
Total $23,120 Total $18,370
Reference Information
14-11Samsung Electronics
14-3-3 Application Examples
1) Solution used before Basler s Intervention
2) Possible solution wih digial cameas using RS 644 OR Camera Link
3) IEEE-1394 solution
Today, there are already applications realizing the benefits of IEEE-1394 technology. For example, at one of our
customer sites, Basler was faced with a vision system which has the following specificatio ns:
The machine is a hig h-speed assembly system . Two indepe ndent robots take different par ts
(different in size, shape, and reflection) from a support unit and mount these parts on a mounting plate. Timing is
crucial, and in the worst case, a part must be taken from the tray every 100 ms. Accuracy of parts mounting is also
critical (0.5 mm) . To have a vision system inspecting these operations , 4 cameras (2 on each of the rob ots) are
needed:
- 2 low resolution Basler A302f camera s (640 x 480) for checking if the mounting plate is in place
- 2 high-resolution Basler A101f cameras (13 00 x 1030) for checking the components to be mounted.
Since most of the parts are differen t, the two A101f cameras must be reconfigured before almost every image
acquisit ion. In the worst case, the AOI, shutter, and som etim es gain need to be adjusted.
The customer used analog camera s with CCIR resolution (768 x 582) only. This drast ically restricted the number
of parts which could be mounted using the robots. Sin ce thes e camera s had no communication por t for config-
uration, adjusting the AOI was not possible and differ ences in reflection of the parts needed to be adjusted for by
driving a flash circuit. All cameras were interfaced into one frame grabber (one PC).
Using RS 644 or CameraLink based camera s, the customer would need one frame grabber for
each camera. It is very likely that the user would need two PCs (one for each robot). Changing the camera-config-
uration on the fly would require adv ance d grab ber cards since simple grabbers are not capable of easily chang-
ing their registers for different AOIs.
All cameras are attached to a sing le interface card in the PC. The Basler A302f is only used when a new mounting
plate is pos itione d by the handler. In norm al operation , only the two Basler A101f cameras will be sending data
at the same time and they will be operating at about 10 FPS. This results in a data rate of about 27 MBytes/s,
which is well within the specification for IEEE-1394.
Since IEEE-1394 supports bi-directional communication between the camera and the PC, before each frame
capture , the PC can easily change resolution, gain , offset, shutter speed, or whatev er is required.
The IEEE-13 94 solution results in the se clea r advanta ges for the custom er:
- Onlyone PC,
- Only one inter face card (very inexpensive compare d with frame grabber cards ),
- Easy and inexpens ive cabl ing ,
- The system meet s the expect ations for spee d and accuracy,
- The range of inspect able parts is much bigger than with the old syste m.
Reference Information
14-12 Samsung Electronics
MEMO

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