E220GEM Manual Ver 9.1

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1.0 Introduction

E220/E500 HP, EHP, & EHPi
MEDUIM CURRENT
ION IMPLANTER
GEM MANUAL
Revision 9.1

Varian Semiconductor Equipment Associates, Inc.
35 Dory Road
Gloucester, MA 01930-2297

WARNING
General Equipment Warning
Only persons trained in the operation and maintenance of Varian ion implanters should
attempt to perform these procedures.
Varian Semiconductor Equipment Associates Ion Implanters are complex systems that
contain high current, high voltage power supplies, gases under high pressure, hot
surfaces, toxic materials, ionizing and non- ionizing radiation and mechanical assemblies
that are in motion or which can move rapidly and powerfully in response to a command,
a component failure, or noise on a command line which is interpreted as a command.
These can represent significant hazards with the potential to cause the death of or
serious injury to any personnel not specifically trained in the operation and maintenance
of these machines. It is the “machine specific” knowledge gained in this training, which
makes the personnel aware of the nature and locations of the potential hazards and how
to avoid exposure to them while servicing the machines.
------------------------------------------------------------------This information in this document is proprietary to Varian Semiconductor Equipment
Associates and is intended solely for application to Varian equipment by Varian trained
personnel. It is not to be copied or disclosed to others without written permission from
Varian.

1.0

General Information

This document contains the following documentation, arranged in three parts, in accordance with SEMI GEM standard
E30-95, section 8:
General Information .
Manufacturer and product number
General description of equipment function
Function of the GEM interface
Software revision code
Changes from previous versions
Message Summary .
The message summary contains two lists of all messages understood and all messages sent by the
equipment in terms of their stream and function codes. All messages not listed on the received side are
implied to cause an error message to the host. All messages not listed on the sent side are assumed never to
be sent from the equipment.
Message Detail
The message detail contains the details for every message listed in the message summary. Messages that
appear on both the sent and received sides shall be detailed separately.

1.1

Manufacturer And Product Number

The purpose of this manual is to describe the GEM implementation for the E220HP / E500HP Ion Implanters.

1.2

General Description Of Equipment Function

The Varian E220HP / E500HP is a Medium Current Ion Implanter which processes one or two cassettes of wafers as
a batch, a single wafer at a time. A LOT ID (Material ID) can be specified for each cassette.

1.2.1

GEM Messages Defined

The following sections define the messages that are required for the GEM sub-system. Information in these sections
follow the SEMI documentation standard as defined in SEMI E5-95 section 8.

1.2.2

Messages From The E220

The following GEM SECS II transactions shall be implemented in GEM:

H --> E

H <--E
S1F0
S1F1

S1F2
S1F13
S1F14
S2F17
S2F18
S5F1
S5F2
S6F1
S6F2
S6F5
S6F6
S6F11
S6F12
S7F1
S7F2
S7F3
S7F4
S7F5
S7F6
S7F23
S7F24
S7F25
S7F26
S7F27
S7F28
S7F29
S7F30
S9F1
S9F3
S9F5
S9F7
S9F9
S9F11
S10F1
S10F2
S10F7

1.2.3

ABORT TRANSACTION S1
ARE YOU THERE REQUEST
ON-LINE DATA
ESTABLISH COMMUNICATIONS REQUEST
ESTABLISH COMMUNICATIONS ACKNOWLEDGE
DATE AND TIME REQUEST
DATE AND TIME DATA
ALARM REPORT SEND
ALARM REPORT ACKNOWLEDGE
TRACE DATA SEND
TRACE DATA ACKNOWLEDGE
MULTI-BLOCK DATA SEND INQUIRE
MULTI-BLOCK GRANT
EVENT REPORT SEND
EVENT REPORT ACKNOWLEDGE
PROCESS PROGRAM LOAD INQUIRE
PROCESS PROGRAM LOAD GRANT
PROCESS PROGRAM SEND
PROCESS PROGRAM ACKNOWLEDGE
PROCESS PROGRAM REQUEST
PROCESS PROGRAM DATA
FORMATTED PROCESS PROGRAM SEND
FORMATTED PROCESS PROGRAM ACKNOWLEDGE
FORMATTED PROCESS PROGRAM REQUEST
FORMATTED PROCESS PROGRAM DATA
PROCESS PROGRAM VERIFICATION SEND
PROCESS PROGRAM VERIFICATION ACKNOWLEDGE
PROCESS PROGRAM VERIFICATION INQUIRE
PROCESS PROGRAM VERIFICATION GRANT
UNRECOGNIZED DEVICE ID
UNRECOGNIZED STREAM TYPE
UNRECOGNIZED FUNCTION TYPE
ILLEGAL DATA
TRANSACTION TIMER TIMEOUT
DATA TOO LONG
TERMINAL REQUEST
TERMINAL REQUEST ACKNOWLEDGE
MULTI-BLOCK NOT ALLOWED

Messages To The E220

The following GEM SECS II transactions shall be implemented in GEM:

H --> E
S1F0
S1F1

H <--E

S1F2
S1F3
S1F4
S1F11
S1F12
S1F13
S1F14
S2F13
S2F14
S2F15
S2F16
S2F17
S2F18
S2F23
S2F24
S2F29
S2F30
S2F31
S2F32
S2F33
S2F34
S2F35
S2F36
S2F37
S2F38
S2F39
S2F40
S2F41
S2F42
S2F43
S2F44
S2F45
S2F46
S2F47
S2F48
S2F49
S2F50
S2F71
S2F72
S5F3
S5F4
S5F5
S5F6
S615
S6F16
S6F19
S6F20
S6F23
S6F24
S7F1
S7F2
S7F3
S7F4
S7F5
S7F6
S7F17
S7F18
S7F19
S7F20
S7F23
S7F24
S7F25
S7F26

A BORT TRA NSA CTION S1
A RE Y OU THERE
ON-LINE DA TA
SELECTED EQUIPMENT STA TUS REQUEST
SELECTED EQUIPMENT STA TUS DA TA
STA TUS V A RIA BLE NA MELIST REQUEST
STA TUS V A RIA BLE NA MELIST REPLY
ESTA BLISH COMMUNICA TIONS REQUEST
ESTA BLISH COMMUNICA TIONS REQUEST A CKNOWLEDGE
EQUIPMENT CONSTA NT REQUEST
EQUIPMENT CONSTA NT DA TA
NEW EQUIPMENT CONSTA NT SEND
NEW EQUIPMENT CONSTA NT A CKNOWLEDGE
DA TE A ND TIME REQUEST
DA TE A ND TIME DA TA
TRA CE INITIA LIZE SEND
TRA CE INITIA LIZE A CKNOWLEDGE
EQUIPMENT CONSTA NT NA MELIST REQUEST
EQUIPMENT CONSTA NT NA MELIST
DA TE A ND TIME SET REQUEST
DA TE A ND TIME SET A CKNOWLEDGE
DEFINE REPORT
A CKNOWLEDGE
LINK EV ENT REPORT
A CKNOWLEDGE
ENA BLE/DISA BLE EV ENT REPORT
A CKNOWLEDGE
MULTI-BLOCK INQUIRE
MULTI-BLOCK GRA NT
HOST COMMA ND SEND
HOST COMMA ND A CKNOWLEDGE
RESET SPOOLING STREA MS A ND FUNCTIONS
RESET SPOOLING A CKNOWLEDGE
DEFINE V A RIA BLE LIMIT A TTRIBUTES
V A RIA BLE LIMIT A TTRIBUTE A CKNOWLEDGE
V A RIA BLE LIMIT A TTRIBUTE REQUEST
V A RIA BLE LIMIT A TTRIBUTE SEND
ENHA NCED REMOTE COMMA ND
ENHA NCED REMOTE COMMA ND A CKNOWLEDGE
Initiate Processing Request ( Factory A utomation Only)
Initiate Processing A cknow ledge
ENA BLE/DISA BLE A LA RM SEND
A CKNOWLEDGE
LIST A LA RMS
A CKNOWLEDGE
EV ENT REPORT REQUEST
EV ENT REPORT DA TA
INDIV IDUA L REPORT REQUEST
INDIV IDUA L REPORT DA TA
REQUEST SPOOLED DA TA
REQUEST SPOOLED DA TA A CKNOWLEDGE
PROCESS PROGRA M LOA D INQUIRE
PROCESS PROGRA M LOA D GRA NT
PROCESS PROGRA M SEND
PROCESS PROGRA M A CKNOWLEDGE
PROCESS PROGRA M REQUEST
PROCESS PROGRA M DA TA
DELETE PROCESS PROGRA M SEND
DELETE PROCESS PROGRA M A CKNOWLEDGE
CURRENT EPPD REQUEST
CURRENT EPPD DA TA
FORMA TTED PROCESS PROGRA M SEND
FORMA TTED PROCESS PROGRA M A CKNOWLEDGE
FORMA TTED PROCESS PROGRA M REQUEST
FORMA TTED PROCESS PROGRA M DA TA

1.3

Function Of The GEM Interface

The GEM sub-system is composed of hardware and software. The hardware component is a SECS interface board, SIB311. The software has five components:
FORTH based GEM interface software which is integrated into the E220HP / E500HP control program.
A multi-tasking operating system to provide data sharing and intertask communication for the E220HP / E500HP
application and the GEM functions.
The GEM task, ‘C’ code to initialize the link between the E220HP / E500HP application and integrate the GWGEM
function library.
GWGEM, a ‘C’ function library, a product from GW Associates.
SDR, driver interfacing the SIB-311 to DOS and the E220HP / E500HP application

Protocol Parameter Parameter Description
T1
Inter Character Timeout
T2
Protocol Timeout
T3
Reply Timeout
T4
Inter Block Timeout
Connect Separation
T5
Timeout (HSMS only)
Control Transaction
T6
Timeout (HSMS only)
NOT SELECTED
T7
TIMEOUT (HSMS only)
Netw ork Intercharacter
T8
Timeout (HSMS only)
Baud
Baud Rate
Retry
Retry Limit

Units
Sec.
Sec.
Sec.
Sec.

Standard Default Value
0.5
10
45
45

Sec.

10

Sec.

5

Sec.

10

Sec.
Bits/Sec.
No. of

5
9600
3

Figure 1 – SCREEN 1, HOST INTERFACE
The Host Mode section has two button icons that contain the present control state of the communications: ON-LINE or
OFF-LINE, REMOTE or LOCAL. Touching the icon causes the control state to switch to the alternative state i.e.:
REMOTE -> LOCAL, LOCAL -> REMOTE; ON-LINE -> OFF-LINE, OFF-LINE -> ON-LINE.
The MODE MENU screen, shown below in Screen 2, displays the HOST CONTROL button when the GEM option is
active. Entry into the HOST CONTROL screen will be allowed if the equipment and Host have established
communications. Upon entry into the HOST CONTROL screen the GEM control state will be set to on-line and remote.

VERSION INTRODUCED: 12.20

Figure 2 - SCREEN 2, MODE MENU

1.3.1

Hardware Component

The hardware is a SECS interface board, SIB-311. The SIB-311 is a single printed circuit board occupying one expansion
slot on the ISA bus of the PC. The SIB-311 provides the following hardware: on-board CPU, RAM, I/O ports, interrupt
request signal, RS 232C interface with a DB37F connector. The SECS interface board contains its own microprocessor,
memory, and performs the entire SECS I, independently of the Intel 486. The SIB-311 interface includes addressing of
the memory and I/O port.
The customer host must be connected to port #1 of the SIB board connector located at the back of the PC.
Ports #2 and #3 are serial connections to the SMIF interface box. Port #2 provides the left SMIF serial connection while
port #3 provides serial communication to the right SMIF.
When option 125 (HSMS Host) is selected, the hardware used is 3COM ethernet card PCI-bus type. This configuration
requires the faster AMD 400 type control computer.

1.3.2 Software Component
The software components of GEM are a sub-system within the E220HP / E500HP application, see figure below.

Figure 3 – SMIF Level 1 System Architecture

In E220/E500 software versions previous to Version 10, the main control computer was based on the IBM DOS (MSDOS) operating system and the FORTH programming language. The SECS software was written completely in FORTH.
This software handled the SECS I, SECS II and high level communications. Since it was interleaved with the other
FORTH control software, the SECS I communications program and the control program of the implanter interfered with
each other.
In Version 10, DOS has been replaced by a DOS compatible, preemtive multitasking operating system called TSX-32.
This operating system was selected because of its ability to run 32 bit protected mode DOS programs (polyFORTH and
the GEM tasks), its preemptive multitasking, intertask communications, shared memory support and built in realtime
operating system features.
With this new architecture, the SIB board handles all of the SECS I protocol and timing. the GEM task (task 2 above) is a
separate program written in the ‘C’ programming language which handles most of the SECS II message interpretation and
creation. This allows the FORTH software (task 1) to independently control the implanter.
In Version 11.00.22, a multi-threader with an interface similar to PSOS, the VSECS component, and the Asyst SMIF LPT
2200 VSECS application was added to the TSX GEM task (task 2 above). This provides support for two Asyst SMIF LPT
2200 VSECS.

Acronym
Control Program in FORTH

SECS

Multi-task OS

GEMTASK
GWGEM
Host Control Application
SDR
LIMITS
VSECS
SMIF VSECS Application

Description
This is a modification of the most recent release of the E220HP / E500HP
system softw are. It controls the implanter.
The FORTH SECS softw are has been modified to use the SECS and GEM
functions provided by GWGEM and SDR. All FORTH calls to the SECS
softw are by other E220HP / E500HP softw are modules (objects) w ill remain,
but their processing has been moved to functions w ithin GWGEM, SDR or the
SIB-311
A third party task schedule, intertask communications, and resource sharing
program. The functions provided by the operating system allow the tw o tasks
to interact through shared memory and intertask message passing
A task w ritten in 'C' code to manage the link betw een the E220HP/E500HP
application and GWGEM and SDR functions. This includes function location,
variables, alarms, and process programs.
A 'C' function library w ritten by GW Associates, providing GEM compatibility.
A GWGEM application that provides host control for the E220
An application interfacing the SIB-311 to the E220HP / E500HP application by a
set of ‘C’ library functions.
This is a separate C program w hich executes the limits monitoring functions
required by GEM.
A "C" function component utilizing a PSOS style multi-threading component
that provides similar GWGEM functionality for addition SDR ports
An application that provides support for tw o Asyst SMIF LPT 2200 cassette
handling robots.

These components linked together with the E220HP / E500HP application and additional hardware comprise the entire
E220HP / E500HP Ion Implanter system with GEM compatibility as specified within this document.

1.3.3

Definitions, Acronyms, and Abbreviations

Acronym
ACH
C
EPPD
Equipment
function
GEM
GWGEM
Host
operator
FORTH
SECS

SECS I
SECS II
SECSIM
SEMI
SIB
SMIF
stream

VILL

VDLL

1.3.4

Definition
Automatic Cassette Handler - Support for the Daihen buffer (ACH).
Compiled computer language used in the E220HP / E500HP control system
Equipment Process Program Directory
intelligent system that communicates w ith the host, in this document it is
synonymous w ith the E220HP / E500HP
specific message of a stream (see stream in this section)
Generic Model for Communications and Control of SEMI Equipment (GEM) SEMI
standard E30-95
‘C’ language library of functions producing GEM compatibility
the intelligent system that communicates w ith the Equipment
individual using the user interface of the Equipment
threaded interpretative programming language, used in the E220 HP / E500HP
control system.
Semiconductor Equipment Communications Standard
the description of the physical connector, signal levels, data rate, and logical
protocols required to exchange messages betw een the host and Equipment
over a serial point to point data path
the description that gives form and meaning to messages exchanged betw een
Equipment and host using a message transfer protocol
SECS simulator w ith language that can produce SECS formatted messages,
product of GW Associates
Semiconductor Equipment Manufacturers International, standards organization
SECS Interface Board, product of GW Associates
Standard Mechanical Interface - Asyst, Ergospeed II, and Jenoptic, and fixed
Jenoptic SMIF units are supported w ith the E220 application.
category of activity defined by SECS II
Vacuum Independent Loadlocks (ECO 90). An ECO that enables the equipment
to load/unload a loadlock w hile the opposite loadlock’s w afers are being
implanted. (Feature available in V11.01)
Vacuum Dependent Loadlocks. Wafers cannot be implanted w hile any
loadlocks are loading or unloading. This operation is only operation available for
V10.00.00 through V11.00.XX

References

Name
E30-95: Generic Model for Communications and
Control of SEMI Equipment (GEM)
E4-91: SEMI Equipment Communications Standard;
Message Transfer (SECS-I)
E5-95: SEMI Equipment Communications Standard 2
Message Content (SECS-II)
EXTRION 220/500 Medium Current Ion Implanter SECS
Communication Manual

1.4 Software Revision Code

Date

Vers / Rev

Originator

1995

E30-95

SEMI

1991

E4-91

SEMI

1995

E5-95

SEMI

Feb-93

Rev. 2

Varian

All major threads of the E220/E500 operating system incorporate added features to the GEM interface. This manual
documents which revision certain features were added. To assist with a proper migration path, both a table and migration
flowchart have been provided for reference. The table established the software version where major features which
significantly impact the GEM interface were added. The flowchart provides a migration path to version 12 (and later)
features.
Name

V ersion Introduced

GEM

V 10.00.00

A dded the GEM interf ace.

Description

SMIF1

V 11.22.00

MID1

V 11.00.37

A dded support f or A syst SMIF LPT 2200
A dded controller to coordinate f actory automation,
Material Identif ication (MID) readers, and E220 basic
implanter. This sof tw are component is also
ref erred to as MID Module.

V ILL

V 11.01.00

V acuum Independent Load Locks.

Y 2K

V 11.00.37

MID Update

V 11.05.08

Y 2K support.
Updated GW A ssociates library introduced dif f erent
buf f ers f or host messages and complex variables
linked to events.

HSMS

V 12.12.00

Support f or HSMS.

ERGOSMIF

V 11.07.06

Support f or Ergospeed SMIF

BCR

V 12.12.00

LINEUP JOB QUEUE
Productivity Plus

V 12.23 revA
V 12.50

Support f or Bar Code Reader
User Interf ace f or the Lineup Job Queue w as
introduced in V 12.20 revA , and the
host interf ace w as introduced in V 12.23 revA .
Support f or the Dual-A rm Hardw are Upgrade.

1.5 Changes from Previous Versions
Revision
1

Date
1/16/1995

Reason for Change
Original, created from Requirements Document Rev 7

Author
Nick Parisi

2
3
4
5
6
7
8

4/3/1995
5/20/1996
8/30/1997
4/2/1998
11/16/1999
3/1/2001
2/1/2002

Jim Hamilton
Q. Wei
R. Naugle
R. Naugle
R. Cruz
K. Zeh
R. Cruz

8.1
9
9.1

3/26/2002
10/12/2004
2/15/2005

Moved events 55 thru 55 to 66 thru 69 to avoid conflicts with SECS2.
Update the change from Requirement Document Rev 9
Added Asyst Automation
Added flouroTrak Cassete ID reader
Finalized Revision
Updated manual and converted to on-line help format
Updated manual for V12.15 Rev B,C and D
Updates for V12.15 RevD Custom Software.
Deleted unimplemented or obsolete DVIDs
Updated manual for V12.20 up to V13.10
Added General Equipment Warning Section

R. Cruz
R. Cruz
R. Cruz

2.0 Data Item Directory

2.0

Data Item Directory

This section defines the data items used in the SECS II messages described in the Message Detail section. Each data
item is defined by the following:
1.
an unique mnemonic name
2.
allowable item format code as complying to SEMI SECS-II E5-95 Section 6.2, Item Format Codes
3.
a description of the specific values, and
4.
the messages in which the data item is used.

An item is an information packet which has a length and format defined by the first 2, 3, or 4 bytes of the item. These
first bytes are called the item header (IH). The item header consists of the format byte and the length byte(s) as shown
in Figure 2. Bits one and two of the item header tell how many of the following bytes refer to the length of the item.
This feature allows for long items without requiring the byte overhead for shorter items. The item length refers to the
number of bytes following the item header, called the item body (IB), which is the actual data of the item. The item
length refers only to the item body not including the item header, so the actual number of bytes in the message for one
item is the item length plus 2, 3, or 4 bytes for the item header. All bytes in the item body are in the format specified in
the format byte.

Item and List Header
A zero length in the format byte is illegal and produces an error. A zero length in the item length bytes has a special
meaning as defined in the detailed message definitions.
Bits 3 through 8 of the format byte of the item header define the format of the data which follows. Of the 64 possible
formats, fifteen are defined as shown in Table 1. Format code 0 is called a list and is defined in E5 6.3. The remaining 14
item formats define unspecified binary, code 10 (octal); Boolean, code 11 (octal); ASCII character strings, code 20 (octal);
JIS-8 character strings, code 21 (octal) signed integer, codes 30, 31, 32, 34 (octal); floating point, codes 40, 44 (octal);
and unsigned integer, codes 50, 51, 52, 54 (octal). These formats are used for groups of data which have the same
representation in order to save repeated item headers. Signed integers will be two's complement values. Floating point
numbers will conform to the IEEE standard 754. Boolean values will be byte quantities, with zero being equivalent to false,
and non-zero being equivalent to true.

2.0.1 Item Format Codes

Binary
765432
000000
001000
001001
010000
010001
100000
100100
101000
101001
101010
101100

Octal
00
10
11
20
21
40
44
50
51
52
54

0-LB
Symbol
L
B1
BOOL
A1
J1
F8
F4
U8
U1
U2
U4

0-LB
Hex
0
20
24
40
44
80
90
A0
A4
A8
B0

FORMAT
n-LB
Symbol
L+n
B8+n
B2+n
A1+n
J1+n
F8+n
F4+n
U8+n
U1+n
U2+n
U4+n

1-LB
Hex
1
21
25
41
45
81
91
A1
A5
A9
B1

2-LB
Hex
2
22
26
42
46
82
92
A2
A6
AA
B2

3-LB
Hex
3
23
27
43
47
83
93
A3
A7
AB
B3

MEANING
The data af ter the heading
has the f ollow ing f orm
LIST (length in elements)
Binary
Boolean
ASCII 1
JIS-8
8-byte f loating point 3
4-byte f loating point 3
8-byte integer (unsigned) 2
1-byte integer (unsigned)
2-byte integer (unsigned) 2
4-byte integer (unsigned) 2

1 Non-printing characters are equipment specific.
2 Most significant byte sent first.
3 IEEE 754. The byte containing the sign bit is sent first.

ABS -- Any binary string

Format: 10

Where Used: S2F25, S2F26

ACHA -- ACH Acknowledge code

Format: 10

0 = acknowledge, ok
1 = can not perform now
2 = requested recipe(PPID) not found
7 = Port is not enabled
10 = bad parameter in S2F71 left side list
11 = bad parameter in S2F71 right side list
12 = error in S2F71 message
13 = process parameter error
14 = cassette not loaded
15 = enqueue failed
16 = FA option or S2F71 queue disabled
Where Used: S2F72

ACKC5 -- Acknowledge code

Format: 10

0 = accepted
>0 = error, not accepted
1-63 = reserved
Where Used: S5F2, S5F4

ACKC6 -- Acknowledge code
0 = accepted

Format: 10

>0 = error, not accepted
1-63 = reserved
64 = Bad PPID
Where Used: S6F12, S6F14

ACKC7 -- Acknowledge code

Format: 10

0 = Accepted
1 = Permission not granted
2 = Length error
3 = Matrix overflow
4 = PPID not found
6 = Recipe with same name exists and can not overwrite (S7F4).
6-63 = reserved
Where Used: S7F4, S7F18

ACKC7A

Format: 31, 51

0 = Accepted
1 = MDLN is inconsistent
2 = SOFTREV is inconsistent
3 = Invalid CCODE
4 = Invalid PPARM value
5 = Other error (described by ERRW7)
6-63 = reserved
Where Used: S7F27

ACKC10 -- Acknowledge Code

Format: 10

0 = Accepted for display
1 = Message will not be displayed
2 = Terminal not available
3-63 reserved
64
Where Used: S10F2 , S10F4 , S10F6

ALCD -- Alarm code byte
bit 7 = 1 means alarm set
bit 7 = 0 means alarm cleared
bit 6-0 = alarm category
0 = not used
1 = Personal safety
2 = Equipment safety
3 = Parameter control warning
4 = Parameter control error
5 = Irrecoverable error

Format: 10

6 = Equipment status warning
7 = Attention flags
8 = Data integrity
>8 = other categories
9-63 = reserved
Where Used: S5F2, S5F6

ALED-- Alarm enable/disable code, 1 byte

Format: 10

bit 7 = 1 means enable alarm
bit 7 = 0 means disable alarm
Where Used: S5F3

ALID – Alarm identification

Format: 5( )

All alarm identifications can be found in Appendix B of this document.
Note: The format of ALID is 54 in S5F1
Where Used: S5F1, S5F3, S5F5, S5F6

ALTX -- Alarm text limited to 40 characters

Format: 20

All alarm text can be found in Appendix B of this document. Only the first 40 characters of the text is sent to the Host.
Where Used: S5F1

CCODE -- Command Code

Format: 32, 52

Each command code corresponds to a unique process operation the machine is capable of performing.

Process OperationCommand
DOPANT
PARAMETRIC MODE
MULTIPLE
MASS
CHARGE
SOURCE MODE
ENERGY
EXT_V
ACL/DCL
# SCANS
X SIGMA
ES VAC
CHECK
PURITY
W TYPE
eFLOOD
COOLING
MIRROR V
FLOOD MA
ROTATIONS
TILT
TWIST
DOSE MANTISSA
DOSE EXPONENT

Command Code
(CCODE)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66

Description
Ion Name
Parametrics Operation
Number of Doses (Max. 12)
Ion Weight
Charge
Gas/Vaporizer
Energy
Extraction Volts
Accel/Decel
Minimum Scans
Xsigma
Es Vacuum
Check Interval
Purity (E500 only)
Waf er Type
Electron Flood
Gas Cooling
Mirror Volts
eFlood Current
Rotate 1
Tilt 1
Tw ist 1
Mantissa
Exponent
Recipe Name
Sof tw are Revision
Recipe Version
Edit Date
Edit Time
Operator ID
Learn Date
EHP Option
Vaporizer Option
Recipe Status
Beam Slit
Interval Units
Dose Calibration
Arc Voltage
Arc Current
Filament Voltage
Filament Current
Extraction Current
Suppression Voltage
Suppression Current
Source Magnet Current
Source Magnet Voltage
Gas Pressure
Source Pressure
Pvaporizer Temperature
Vaporizer Temperature
X-Axis
Y-Axis
Z-Axis
Setup Beam Current
Setup Bias
Analyzer Current
Amu Tune Speed
Analyzer Pressure
Mirror Current
Mirror shunt Current
Quad1 Current
Quad1 Voltage
Quad2 Current
Quad2 Voltage
Def lector Voltage
Lens Current

68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107

BeamLine Pressure
FocusBeam Current
Source Type
Target Cup Bias
E Filament Voltage
E Filament Current
E Ripple Voltage
E Extraction Voltage
E Extraction Current
E Target Current
E Bias Voltage
E Bias Current
E Suppression Voltage
E Secondary Current
A Line
Beam Width
Target Beam Mantissa
Target Beam Exponent
Range Arc
X-Tune Speed
Y-Tune Speed
Noise
Ripple
Q1 Tune Speed
Q2 Tune Speed
Def lector Tune Speed
Beam Line Tune Speed
Calculated Scans
Gas String
Source Magnet Type
Num Pass
Num Fail
Last SetupDate
Last Setup Time
Spare 1
Spare 2
Spare 3
Spare 4
Spare 5
Spare 6

Where Used: S7F23, S7F26

CEED -- Collection event enable/disable code, 1 byte

Format: 11

FALSE = Disable
TRUE = Enable
Where Used: S2F37

CEID -- Collected event ID

Format: : 5( )

Identifies the event and report that is being sent. The format of CEID is 54 in S6F11. Supported Event ID's are:
CEID

Description

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57

Start up started
Start up complete
Shut down started
Shut down complete
Source setup started
Source setup complete
Beamline setup started
Beamline setup complete
Beamscan setup or check started
Beamscan setup or check complete
Batch started (GEM Compliant Process Started Started)
Batch complete (GEM Compliant Process Started completed)
Wafer started
Wafer complete
Alarm generated (GEM Compliant Alarmn Detected)
Alarm silence button pressed (GEM Compliant Alarmn Cleared)
Implant Held (GEM Compliant Processing Stopped)
Implant Continued
Abort started
Abort complete
Elevator vent started
Elevator vent complete
Door open started
Door open complete
Door close started
Door close complete
Elevator pump started
Elevator pump completed
Entering host control mode
Entering host monitor mode (SECS-II only)
High voltage enabled
High voltage disabled
Entering host ignore mode (SECS-II only)
Unload Sequence Started Version available 12.20
Pivot Retract Started Version available 12.20
Pivot Retract Complete Version available 12.20
Setup Only Complete
Wafer mapping started
Wafer mapping completed
Processing started
Cassette(s) removed
Ready to Process
Ready to Implant
Port Availability change at ACH or Eqpt
Cassette status change at ACH
Cassette status change at equipment port
Entering Factory Automation Off mode
Entering Factory Automation Manual mode
Entering Factory Automation Semi Auto mode
Entering Factory Automation Full Auto mode
Load/Unload ACH port Request
Load/Unload ACH port Request Complete
System Backup Started
System Backup Complete
Unused
Unused
Uniformity Precheck

58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113

Unused
Move Into ACH Port Request
Move Out of ACH Port Request
Move Into ACH Port Request Complete
Move Out of ACH Port Request Complete
Go Displayed
Go or Cont Button Pressed or remote command START received
from host
Pivot Extend Complete
Control State OFF-LINE
Control State ON-LINE, Local
Control State ON-LINE, Remote
Unused
Spool Activated
Spool Deactivated
Spool Transmit Failure
Operator Command Issued
Operator Command Complete
Processing State Change
Operator Changed Equipment Constant
Upper Trace Limit Exceeded
Lower Trace Limit Exceeded
Process Program Change
Process Program Selected
Message Recognition
Operator Log On
Operator Log Off
Ready to Receive Material
Material Sensed at Port
Host Command (Remote) Issued
Host Command (Remote) Complete
Job Created (Applicable to Process Job Queue)
Version available 12.20
Job Deleted (Applicable to Process Job Queue)
Job Completed (Applicable to Process Job Queue)
Queue Availability Changed (Applicable to Process Job Queue)
Job Processing Started (Applicable to Process Job Queue)
Job Processing Complete (Applicable to Process Job Queue)
Job Chain Modified (Applicable to Process Job Queue)
Timed Beam Run Started (Applicable to Process Job Queue)
Timed Beam Run Complete (Applicable to Process Job Queue)
Job Promoted (Applicable to Process Job Queue)
Job Preempt Successful (Applicable to Process Job Queue)
Job Preempt Unsuccessful (Applicable to Process Job Queue)
SMIF LPT Manual Control Mode
SMIF LPT Semi-Auto Control Mode
SMIF LPT Full-Auto Control Mode
SMIF LPT POD Placed
SMIF LPT POD Removed
SMIF LPT Load Ready
SMIF LPT Load Start
SMIF LPT Load Complete
SMIF LPT Unload Ready
SMIF LPT Unload Start
SMIF LPT Unload Complete
SMIF LPT Port Locked
SMIF LPT Port Unlocked
SMIF LPT Switched to Manual

114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
160
161
162
200
2000

SMIF LPT Switched to Auto
SMIF LPT Powered Up
SMIF LPT Load Aborted
SMIF LPT Unload Aborted
SMIF LPT init Started
SMIF LPT init Complete
SMIF LPT init aborted
SMIF LPT Cassette Placed on Equipment
SMIF LPT Port lock/unlock failed
Actual Smif Slot Map Available
EMID Actual Cassette ID Available Version available 12.15
EMID Actual Cassette ID Update Aborted Version available 12.15
Discard Job Version available 12.15
Actual SMIF Slot Map Validation Failed
Actual Cassette ID Validation Failed Version available 12.15
Actual Wafer ID Available
Actual Wafer ID Update Abort
Actual Wafer ID Validation Failed
Actual Equipment Slot Map Validation Failed
Actual Equipment Slot Map Update Aborted
Reject Pod
Actual Equipment Slot Map Validation Passed
Actual Smif Slot Map Validation Passed
EMID Validation Passed Version available 12.15
Actual Wafer ID Validation Passed
Actual Equipment Slot Map Validation Passed
Job Done Version available 11.05.04
Job Started Version available 11.05.04
Equipment Count Validation Failed Version available 11.05.04
Equipment Count Validation Passed Version available 11.05.04
SMIF Count Available Version available 11.05.04
SMIF Count Abort Version available 11.05.04
Smif Count Validation Failed Version available 11.05.04
SMIF Count Validation Passed Version available 11.05.04
SMART Tag Data Lot-id Available
SMART Tag File Data Available
SMART Tag Status Available
200+ Used for Limits Zone Transition for Analogs
2000+ Used for Alarm On / Off

In addition, each alarm ID, ALID , has two CEIDs associated with it, one for alarm clear and one for alarm set. The alarm
IDs are calculated at initialization time based on the contents of the MESSAGES.USA file. The formulas for calculating
the alarm IDs are as follow:
Alarm Off CEID = (Alarm ID *2) + 300
Alarm On CEID = Alarm Off CEID + 1
VARIAN RESERVES THE RIGHT TO ADD ADDITIONAL EVENT CEIDs
The Varian GEM uses the CEID number for the SFCD and accesses the reports associated with the CEID.
Where Used: S2F35, S2F37, S6F11, S6F13

CEPACK -- Command Enhanced Parameter Acknowledge, 1 byte
0 = no error
1 = Parameter Name (CPNAME) does not exist
2 = Illegal Value specified for CEPVAL
3 = Illegal Format specified for CEPVAL
4 = Parameter name (CPNAME) not valid as used
5-63 = reserved

Format: 10, 51

Where Used: S2F49

CEPVAL -- Command Enhanced Parameter Value

Format: 0, 10, 11, 20, 21, 3( ), 4( ), 5( )

A specific application of CEPVAL shall always be identified with a specific value of CPNAME. A CEPVAL has the
following forms: a single (non-list) value (eg. CPVAL), a list of single items of identical format and type, or a list of items of
the form:
L,2
1. CPNAME
2. CEPVAL
Where Used: S2F49

COMMACK -- Establish Communications Acknowledge Code, 1 byte

Format: 10

0 = Accepted
1 = Denied, Try Again
2-63 = Reserved
Where Used: S1F13, S1F14

CPACK -- Command Parameter Acknowledge Code, 1 byte

Format: 10

1 = Parameter Name (CPNAME) does not exist
2 = Illegal Value specified for CPVAL
3 = Illegal Format specified for CPVAL
>3 = Other equipment=specific error
4-63 = reserved
64 = Discrepancy detected between WaferID and SlotMap parameters
Where Used: S2F42

CPNAME -- Command Parameter Name

Format: 20

These are used in the remote command to designate the parameter being sent with the command. See the RCMD
section for CPNAME applicable to each remote command.
Where Used: S2F41

CPVAL -- Command Parameter Value

Format: 10, 11, 20, 21, 3( ), 5( )

These are used in the remote command to set parameter values. See the RCMD section for CPVAL applicable to each
remote command.
Where Used: S2F41

DATAID -- Data ID

Format: 5()

The data id is used to connect a multi- block request/grant message transaction with the actual multi- block message

transaction. In messages which originate from the Equipment, which include DATAID but are not multi- block, the
DATAID is undefined. In messages which originate from the Host and which are not multi- block but do contain
DATAID, DATAID will be ignored.
Note: The format of DATAID is 54 in S6F11
Where Used: S2F33, S235, S239, S6F5, S6F11, S6F13

DATALENGTH -- Total bytes to be sent

Format: 3( ),5( )

Where Used: S2F39, S6F5

DRACK -- Define Report Acknowledge Code, 1 byte

Format: 10

0 = Accept
1 = Denied. Insufficient space
2 = Denied. Invalid format
3 = Denied. At least one RPTID already defined
4 = Denied, At least VID does not exist
>4 = Other errors
5-63 = reserved
Where Used: S2F34

DSPER -- Data sample period

Format: 20

hhmmss, 6 bytes
Where Used: S2F23

DVID

Format: 5( )

The data variables may also be access with a VID of equivalent value using the functions appropriate for VID. See VID for
table showing relationship between data variables identifcation (DVID), equipment constant identifications(ECID), and
status variable identifications( SVID) . The data variable IDs are as follows:
DVID
100
101
102
103
104
105
106
107
108
109
110
111
112
113

DVNAME
Implant And Machine Status Variables
A(LLOT)
A(RLOT)
LWAF#
RWAF#
OP- NAME
OPERATOR- ID
WAFER- NUMBER
WAFER- START- TIME
WAFER- END- TIME
BATCH- START- TIME
BATCH- END- TIME
aXSIGMA
cSCANS
aDOSE

DVID
200
201
202
203
204
205
206
207
208
209
210
211
212
213

DVNAME
Recipe Data Process Program Variables
PPID
ION- NAME
ION- AMU
DOSE- MANTISSA
DOSE- EXPONENT
ENERGY
SCANS
COOLING
FLOOD
3 = Other equipment-specific error
4-63 = reserved
Where Used: S2F16

ECDEF -- Equipment constant default value
Where Used: S2F30E5_S2F30_Equipment_Constant_Namelist

Format: 20, 5( )

ECID -- Equipment Constant ID

Format: 5( )

The equipment constants may also be access with a VID of equivalent value using the functions appropriate for VID. See
VID for table showing relationship between data variables identification (DVID), equipment constant identifications(ECID),
and status variable identifications(SVID). The Equipment constant IDs are as follows:
ECID
250
251
252
253
254
255
256
257
258
259
260
261
262
263
264
265
266
267
268
269
270
271
272
273
274
275
276
277
278
279
280
281
282
283
284
285
286
287
288
289

ECNAME
T1
T2
T3
RTY
T4
Obsolete (always set to 0)
FORMAT
MODES
Mirror-mode
Accel-mode
Extraction-volts
TYPE-RCP
Establish-Comm-Timeout
FACTAUTO
PPTF
GemInitCommState
GemInitControlState
Baud-Rate
Equipment-ID
DEVICENAME
RPTYPE
CONFIGALARMS
CONFIGCONNECT
CONFIGEVENTS
WBITS5
WBITS6
WBITS10
HEARTBEAT
EQPORT_ENABLE
ACHPORT_ENABLE
GemConfigSpool
GemMaxSpoolFileSize
GemMaxSpoolTransmit
GemOverWriteSpool
GemSpoolFileName
GemMsgInterLv
MID-MODE
SMIF-MODE
GEMTASK LOG SIZE
EC TIMEFORMAT

ECID
290
291
292
293
294
295
296
297
298
299
350
351
352
353
354
355
356
357

ECNAME
Not Used
EQUIPMENT IP ADR
CONNECT MODE
PASSIVE IP ADDRESS
PASSIVE TCP PORT
T5
T6
T7
T8
BCR Mode
Connection Establishment
Circuit Assurance
TimeoutGrace
MemoryStall
WriteStall
Submask
Router
MidVersion (Not Supported)

Constants 258, 259 and 260 are used for recipe conversion and should be treated as a set. They are only used when
PPBODY1 recipes are used on version 9 software. These conversion numbers are ignored when using PPBODY2.
VARIAN RESERVES THE RIGHT TO ADD MORE EQUIPMENT
CONSTANTS
Where Used: S1F3, S1F11, S1F12, S2F23, S2F13, S2F15, S2F29, S2F30, S2F33, S2F45, S2F46, S2F47, S2F48;
S6F13, S6F18, S6F22

ECMAX -- Equipment constant maximum value

Format: 5( )

Where Used: S2F30

ECMIN -- Equipment constant minimum value

Format: 5( )

Where Used: S2F30

ECNAME -- Equipment constant name

Format: 20

See ECID for list of equipment constant names.
Where Used: S2F30

ECV -- Equipment Constant Value

Format: 20, 5( )

See variable dictionary for a list for individual ECV format.
Where Used: S2F15

EDID -- Expected data Identification

Format: 10, 20, 3( ), 5( )

Three possible responses.
MEXP EDID EDID
S02F03,  A[6]
S03Fl3,  B[1]
S07F03,  A[16], B[16]
Where Used: S9F13

ERACK -- Enable/Disable Event Report

Format: 10

Acknowledge Code, 1 byte
0 = Accepted
1 = Denied. At least one CEID does not exist
<1 = Other Errors
2-63 = reserved
Where Used: S2F38

ERRW7

Format: 20

Text string describing error found in process program
Where Used: S7F27

ESID - Equipment Port Number

Format: 10

ESID designates the stage location of the Equipment Port Number
1 = Left
2 = Right
Note: Factory Automation Only
Where Used: S2F71

FCNID -- Function Identification

Format: 51

Where Used: S2F43, S2F44

GRANT -- Grant code, 1 byte

Format: 10

0 = Permission Granted
1 = Busy, Try Again
2 = No Space Available
3 = Duplicate DATAID
>3 = Equipment Specific Error Code
4-63 = reserved
Where Used: S2F40

GRANT6 -- Permission to send, 1 byte

Format: 10

0 = Permission granted
1 = Busy, try again
2 = Not interested
>2 = Other errors
3-63 = reserved
Where Used: S6F6

HCACK -- Host Command Parameter Acknowledge Code, 1 byte
0 = Acknowledge, command has been performed
1 = Command does not exist
2 = Cannot perform now
3 = At least one parameter is invalid
4 = Acknowledge, command will be performed with completion signaled later by an event

Format: 10

5 = Rejected, Already in Desired Condition
6 = Object does not exist
7-63 = reserved
64= Double Implant not allowed
65-127 = Left and right SMIF LPT (LPT must be present to occur)

7
0
MSB
Bit 6
bits 5-3
bits 2-0

6
1

5
LPT1

4
LPT1

3
LPT1

2
LPT2

1
LPT2

LSB
0
LPT2

1
LPT HCACK code for the left LPT1
LPT HCACK code for the right LPT2

LPT HCACK code
0h: LPT Completed command
1h: LPT in manual mode
2h: No Pod in place
3h: Host not ready
4h: Limit not reached
5h: LPT already in desired state
6h: LPT does not understand command
7h: LPT cannot perform command or E220 cannot send command to LPT
Where Used: S2F42

LENGTH

Format: 5( )

Length of the service program or process program in bytes
Where Used: S7F1

LIMITACK

Format: 10

Acknowledgment code for variable limit attribute set, 1 byte.
1 = LIMITID does not exist
2 = UPPERDB > LIMITMAX
3 = LOWERDB < LIMITMIN
4 = UPPERDB < LOWERDB
5 = Illegal format specified for UPPERDB or LOWERDB
6 = ASCII value cannot be translated to numeric
7 = Duplicate limit definition for this variable
>7 = Other equipment-specific error
8-63 = reserved
Where Used: S2F46

LIMITID

Format: 10

The identifier of a specific limit in the set of limits (as defined by UPPERDB and LOWERDB) for a variable to which the
corresponding limit attributes refer, 1 byte. The range of allowable Ids is 0 - 6.
Where used: S2F45, S2F46, S2F48

LIMITMAX

Format: 20

Presently the highest possible value for the SV’s value (99.9, 9, 9.99999)
Where used: S2F48

LIMITMIN

Format: 20

Presently the lowest possible value for the SV’s value (0 or 0.0000099)
Where used: S2F48

LOTID - Material ID 16 bytes maximum

Format: 20

This is the lot number for 1 cassette of wafers to be processed.
Note: Factory Automation only
Where used: S2F71

LOWERDB

Format: 20

A variable limit attribute which defines the lower boundary of the deadband of a limit. The value applies to a single limit
(LIMITID) for a specified VID. Thus, UPPERDB and LOWERDB as a pair define a limit.
Where used: S2F45, S2F48

LRACK - Link Report Acknowledge Code, 1 byte

Format: 10

0 = Accepted
1 = Denied. Insufficient space
2 = Denied. Invalid format
3 = Denied. At least one CEID link already defined
4 = Denied. At least one CEID does not exist
5 = Denied. At least one RPTID does not exist
>5 = Other errors
6-63 = reserved
Where Used: S2F36

LVACK

Format: 10

Variable limit definition acknowledge code, 1 byte. Defines the error with the limit attributes for the referenced VID.
1 = Variable does not exist
2 = Variable has no limits capability
3 = Variable repeated in message
4 = Limit value error as described in LIMITACK

5-63 = reserved
Where Used: S2F46

MDLN -- Equipment Model Type, 6 bytes max

Format: 20

The Equipment model type of the E220 is a 4 character string and will be "E220"
Where Used: S1F2; S1F13 , S1F14

MEXP

Format: 20

Message expected in the form SxxFyy where x is stream and y is function.
Where Used: S9F13

MHEAD

Format: 10

SECS message block header associated with message block in error
Where Used: S9F1, S9F3, S9F5, S9F7, S9F11

MID 16 Characters maximum

Format: 20

This is the lot name for one cassette of wafers to be processed.
Where Used: S2F41, S2F71

OFLACK

Format: 10

Acknowledge code for OFF-LINE request.
0 = OFF-LINE Acknowledge
1-63 Reserved
Where Used: S1F16

ONLACK -- Acknowledge code for ON-LINE request.

Format: 10

0 = ON-LINE Accepted
1 = ON-LINE Not Allowed
2 = Equipment Already ON-LINE
3-63 = Reserved
Where Used: S1F18

PPARM -- Process Parameter

Format: 11, 20, 3( ), 4( ), 5( )

Numeric or Boolean SECS data item, single or multiple value, or text string which provides information required to
complete the process command to which the parameter refers.
PPID used by the PPselect remote command.
Where Used: S7F23, S7F26

PPBODY -- Process program body

Format: 10

The process program describes to the equipment, in its own language, the actions to be taken in processing the material it
receives. . Four process program formats are supported. They are supported for the sake of compatibility with former
models and software revisions of the equipment.
The equipment can receive any format and convert it to the most recent format for operator editing and equipment use.
Parameters not available in older formats are set to default values.
The equipment will transmit the format set by the TYPE-RCP equipment constant.
Where Used: S7F3, S7F6, S7F18

PPBODY1 -- Process program body (Version 8)

Format: 10

This process program is made up of 24 fields for each pass. All fields are two bytes long. If a field should not change
from one pass to the next, it must be given a value of 32768. All items in the body are 2 byte integers (format: 32) except
for Ion Name which consists of 2 ASCII characters. Each 2 byte field should be given in reverse order, that is, LSB first,
MSB second. In the case of the Ion Name, the two letters should be in reverse order.
The Fields are:
Ion Name
Ion Weight
Dose Mantissa
Dose Exponent
Energy
Minimum Scans
Gas Cooling
Flood
Tilt
Twist
Charge
ES Vacuum
X-Sigma
Y-Sigma if value = 0 then Accel Mode; if -1 the Decel Mode
Check Interval
Quality if value > 5 it will be stored as Mirror.
Wafer type
Unused1
Unused2
Unused3
Unused4
Unused5
Unused6
Unused7

The Unused space is reserved for future additions and should be space filled. Each process will be a multiple of 48 bytes
long.

Where Used: S7F3, S7F6, S7F18

PPBODY2

Format: 10

All quantities are 16 bit format.
Byte
1
2
3
4
5

Field name
Ion Name
Learned
#multilines
Ion Weight
Charge

6
7

Gas/Vapor
Energy

8

Extraction Volts

9
10
11
12
13
14
15

Accel/Decel
Minimum scans
Xsigma
Es Vacuum
Check interval
Purity
Waf er Type

16

Electron Flood

17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33

Gas Cooling
Mirror volts
Ef lood Current
Unused
Unused
Unused
Unused
Unused
Unused
Rotate 1
Tilt 1
Tw ist 1
Mantissa
Exponent
Unused
Unused
Unused

Description
ASCII 2 characters
0 or 1 (Reset (0) af ter a Dow nload)
1-12 If equipped w ith rotating platen
1, 2, or 3
0 - Gas
1 - Vaporizer
1 - 750
Unit 0.1 0 - 400 E220
0 - 700 E500
0 - Accel
1 - Decel
Unit 0.01
Unit 10-7 torr
Unit 1 minute
E500 only
0-5
0 - Disabled
1 - Enabled
0 - Disabled
1 - Enabled
Units 0.1 0 - 300
Unit 0.1 mA

0, 1 no rotation 0 - 30
0 - 90
0 - 359
3 digits
Machine Specif ic Range

Where Used: S7F3, S7F6, S7F18

PPBODY2 LONG
Contains the data from a PPBODY2 SHORT in addition to the following:

Format: 10

Byte
34
35
36
37
38
39
40
41
58
59
60
61
62
63
64
65
82
83
84
85
86
87
88
89
106
107
108
109
110
111
112
113

Name
Rotate 2
Tilt 2
Tw ist 2
Mantissa
Exponent
Unused
Unused
Unused
Rotate 5
Tilt 5
Tw ist 5
Mantissa
Exponent
Unused
Unused
Unused
Rotate 8
Tilt 8
Tw ist 8
Mantissa
Exponent
Unused
Unused
Unused
Rotate 11
Tilt 11
Tw ist 11
Mantissa
Exponent
Unused
Unused
Unused

Byte
42
43
44
45
46
47
48
49
66
67
68
69
70
71
72
73
90
91
92
93
94
95
96
97
114
115
116
117
118
119
120
121

Name
Rotate 3
Tilt 3
Tw ist 3
Mantissa
Exponent
Unused
Unused
Unused
Rotate 6
Tilt 6
Tw ist 6
Mantissa
Exponent
Unused
Unused
Unused
Rotate 9
Tilt 9
Tw ist 9
Mantissa
Exponent
Unused
Unused
Unused
Rotate 12
Tilt 12
Tw ist 12
Mantissa
Exponent
Unused
Unused
Unused

Byte
50
51
52
53
54
55
56
57
74
75
76
77
78
79
80
81
98
99
100
101
102
103
104
105

Name
Rotate 4
Tilt 4
Tw ist 4
Mantissa
Exponent
Unused
Unused
Unused
Rotate 7
Tilt 7
Tw ist 7
Mantissa
Exponent
Unused
Unused
Unused
Rotate 10
Tilt 10
Tw ist 10
Mantissa
Exponent
Unused
Unused
Unused

Where Used: S7F3, S7F6, S7F18

PPBODY3 - High Performance Recipe

Format: 10

PPBODY2 formatting contains all data from the PPBODY2 LONG format with the addition of learned parameters,
maximum/minimum ranges for each parameter, and the type of interlock when a processing parameter exceeds the
specified range. PPBODY3 is the recommended formatting for the E220/E500 medium current ion implanter
PPBODY3 has a total length of 1518 bytes. This lays out the length and possible values of each data item as it appears
in SECS messages downloaded from or uploaded to the host. The possible data types used are:
Type
ASCII
Short
Ushort

Tgt_lim

Description
Plain text
Signed 2-byte integer
Unsigned 2-byte integer
8-byte structure consisting of :
2 bytes ushort Low Limit
2 bytes ushort Target
2 bytes ushort HiLimit
2 bytes ushort Interlock

The possible values for Interlock are:
0 = Ignore
1 = Warning

2 = Critical

Scaler is also included in the Remarks column. This number is applied to the raw value to get the final value as displayed
in the E220/500 recipe screen. For example, a raw value of 2000 with a scaler of 2 will be displayed as 20.00. For data
items with the Tgt_lim type, scalar is only applied to the LowLimit, Target and HiLimit.
Data items with format marked as "(learned)" are filled in by the E220/500 after the recipe has been learned in
parametric setup.
Header Parameters
Parameter
PPID Name
Sof tw are Rev

Ccode
25
26

Bytes
16
8

Type
ASCII
ASCII

Of f set
0
16

Recipe Version

27

2

Ushort

24

Edit Date
Edit Time
Operator ID

28
29
30

10
10
8

ASCII
ASCII
ASCII

26
36
46

Learn Status

2

2

Ushort

54

Learn Date

31

10

ASCII

56

Setup Dif f iculty

32

2

Ushort

66

Vaporizer Option

33

2

Ushort

68

Recipe Status
#Multilines
Last Setup Date
Last Setup time
Dopant
Gas String

34
3
100
101
1
96

2
2
10
10
2
6

Ushort
Ushort
ASCII
ASCII
ASCII
ASCII

70
72
74
84
94
96

Charge
Accel/Decel

5
9

2
2

Ushort
Short

102
104

Raw Values

Remarks

xx.xx.xx
Incremented af ter
each edit
mm/dd/yy
hh:mm

2 Trailing blanks
5 Trailing blanks

1=Learned
0=NotLearned
mm/dd/yy
99=Ehp
0= Not Ehp
1=standard
59=dual
vaporizer
0 - 300
12-Jan
mm/dd/yy
hh:mm
(learned)
1 if DECEL
1,2,3 if ACCEL
#NAME?

Gas/Vapo Flag

6

2

Short

106

#NAME?

EFlood

16

2

Short

108

Cooling

17

2

Short

110

Beam Slit

35

2

Ushort

112

Interval Units
Check Interval

36
13

2
2

Ushort
Ushort

114
116

#NAME?
-1 = On/ 0 or
any other value
= Of f
If option 75 is
set, 0,1,2 else,
0,1
0 = w af ers
1 = minutes
0 - 60

Beam Purity

14

2

Ushort

118

0 - 2000

Dose Calibration
Waf er Type
XSigma

37
15
11

2
2
2

Ushort
Ushort
Ushort

120
122
124

0 - 20000
0 - 20
0 - 1000

2 Trailing blanks

Units
16 Char
8 Char
#NAME?
mm/dd/yy
10 Char
hh:mm, 10 Char
8 Char
Y/N Short
mm/dd/yy
10 Char
Short

59 valid only if
option 59 is
enabled

2 Trailing blanks
5 Trailing blanks
Gas Identif ier

Short
ro/rw /appr
Short
Short
10 Char
10 Char
2 Char
6 Char
1+/2+/3+, Short
A/D, Short

If option 1 or
option 59 is set,
vaporizer can be
on or of f , else
must be vaporizer
Must match Ef lood
option

Waf er cooling
0 = of f
1 = narrow
2 = w ide

G/V, Short
ON/OFF, Short

ON/OFF, Short
OUT/NAR/WIDE,
Short
min/w af , Short
Short

Unit = %
scaler = 2
Unit = %
scaler = 2
Scaler = 2

%, Short
%, Short
#, Short
#, Short

Source Parameters
Parameter
Arc V
Arc I
Arc Range
Filament V
Filament I
Extraction V
Extraction I
Suppression V
Suppression I
Src Magnet I
Src Magnet V
Gas Press
Source Pressure
Vap Temp
Heater Temp
X Axis
Y Axis
Z Axis
X Tune Speed
Y Tune Speed
Set Up Beam I
Set Up Bias
Spare 1
Spare 2
Spare 3
Noise
Ripple

Def ault
Min / Max
5%

Spec.
Min / Max
0/300

Def ault
Interlock
w arning

5%

0/999

w arning

V
V
kV
mA
kV
mA
A
V
PSI
TORR
*C
*C
mm
mm
mm

20%
20%
1%
1%
1%
1%
5%
5%
5%
5%
5%
5%
5%
5%
5%

0/7.5
0/200
0/40.0
0/25.0
0/2.00
0/50.0
0/50.0
0/20.0
0/9.99
0
0/999
0/999
0/999.
0/999.
0/999.

ignore
ignore
critical
ignore
critical
ignore
w arning
ignore
w arning
ignore
w arning
w arning
w arning
w arning
w arning

amps
(range dependent)
V

--5%

0/999

not monitored
w arning

Units
V
amps
(range dependent)

Parameter
Arc V

Ccode
38

Bytes
8

Type
Tgt_lim

Of f set
126

Raw Values
0 – 300

Arc I

39

8

Tgt_lim

134

0 – 9999 f or Non-EHP
0 – 15000 f or EHP

Arc Range
Filament V
Filament I
Extraction V
Extraction I
Suppression V
Suppression I
Src Magnet I
Src Magnet V
Gas Press
Source Pressure

86
40
41
8
42
43
44
45
46
47
48

2
8
8
8
8
8
8
8
8
8
8

Ushort
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim

142
144
152
160
168
176
184
192
200
208
216

0-4
0 - 750
0 - 200
0 - 720
0 - 250
0 - 200
0 - 5000
0 - 500
0 -200
0 - 999
0 - 4000

PVap Temp
Vap Temp
X Axis
Y Axis
Z Axis
X Tune Speed
Y Tune Speed

49
50
51
52
53
87
88

8
8
8
8
8
2
2

Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Ushort
Ushort

224
232
240
248
256
264
266

0 - 999
0 - 999
0 - 999
0 - 999
0 - 999
(learned)
(learned)

Set Up Beam I
Set Up Bias
Spare 1
Spare 2
Spare 3
Noise
Ripple

54
55
102
103
104
89
90

2
2
2
2
2
2
2

Ushort
Ushort
Ushort
Ushort
Ushort
Ushort
Ushort

268
270
272
274
276
278
280

(learned)
(learned)

Beamline Parameters

(learned)
(learned)

Remarks
Unit = V, scaler = 0
Unit = Arc Range
dependent (see item
below ), scaler = 0
0 = A, 4 = uA, other
value = mA
Unit = V, scaler = 2
Unit = A, scaler = 0
Unit = kV, scaler = 1
Unit = mA, scaler = 1
Unit = KV, scaler = 2
Unit = mA, scaler = 2
Unit = A, scaler = 1
Unit = V, scaler = 1
Unit = PSI, scaler = 2
Unit = uT, scaler = 2
Unit =
(prog lamp temperature)
Unit =
Unit = mm, scaler = 0
Unit = mm, scaler = 0
Unit = mm, scaler = 0

Unit = A (range
dependent)
Unit = V
Unused
Unused
Unused

Parameter
Analyzer I
Analyzer AMU
AMU tune speed
Analyzer
Pressure
Mirror V
0/60.0
Mirror I
Mirror Shunt I
Q1 I
Q1 V
Q2 I
Q2 V
Def lector V
Spare 4
Spare 5
Spare 6
Q1 Tune Speed
Q2 Tune Speed
Def lector Tune
Speed
Bmln Y Tune
Speed
Lens I
Lens V
Bmln Pressure
Scans

Units
A
AMU
#

Def ault
Min / Max
0.20%
0.5 AMU
---

Spec.
Min / Max
0/150
0/200
---

Def ault
Interlock
w arning
critical
not monitored

TORR
kV
critical
mA
mA
A
V
A
V
kV

5%
5%

0
0/30.0

ignore

5%
5%
5%
5%
5%
5%
5%

0/2.50
0/2.50
0/50.0
0/20.0
0/50.0
0/20.0
0/20.0

ignore
ignore
w arning
ignore
w arning
ignore
w arning

mA
V

5%
5%

0/150.0
0/40.0

w arning
ignore

#

10%

4000

w arning

Calculated Scans
#
Focus Cup Beam
amps
I
(range dependent)
Src Type
Src Mag Type

---

0/4000

not monitored

---

0/999

not monitored

Calculated Scans
#
Num Pass
Num Fail
Target Cup Beam
amps
I
(range dependent)
Target Beam I
Exponent

---

0/4000

not monitored

---

0/999

not monitored

Parameter

Ccode

Bytes

Type

Of f set

Raw Values

Analyzer I

56

8

Tgt_lim

282

0 – 1500 f or non-EHP
0 – 1200 f or EHP

Analyzer AMU
AMU tune speed
Analyzer
Pressure

4
57

8
2

Tgt_lim
Ushort

290
298

0 – 1500 f or non-EHP
0 – 1200 f or EHP
(learned)

58

8

Tgt_lim

300

0 - 4000

Mirror V
Mirror I
Mirror Shunt I
Q1 I
Q1 V
Q2 I
Q2 V
Def lector V
Spare 4
Spare 5
Spare 6
Q1 Tune Speed
Q2 Tune Speed
Def lector Tune
Speed
Bmln Y Tune
Speed
Lens I
Lens V
Bmln Pressure
Scans

18
59
60
61
62
63
64
65
105
106
107
91
92

8
8
8
8
8
8
8
2
2
2
2
2
2

Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Ushort
Ushort
Ushort
Ushort
Ushort
Ushort

308
316
324
332
340
348
356
364
366
368
370
372
374

0 – 600
0 - 120
0 - 250
0 - 500
0 - 200
0 - 500
0 - 200
(learned)

(learned)
(learned)

93

2

Ushort

376

(learned)

94
66
67
68
10

2
8
8
8
8

Ushort
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim

378
380
388
396
404

(learned)
0 - 1500
0 - 4000
0 - 4000
1-4000

Calculated Scans
Focus Cup Beam
I
Src Type
Src Mag Type
Num Pass
Num Fail
TargetCup Beam
I
Target Beam I
Exponent

95

2

Ushort

412

(learned)

69
70
97
98
99

2
2
2
2
2

Ushort
Ushort
Ushort
Ushort
Ushort

414
416
418
420
422

(learned)
(learned)
(learned)
(learned)
(learned)

84

2

Ushort

424

(learned)

85

2

Short

426

(learned)

End Station Parameters

Remarks
Unit = A
Scaler = 1 f or non-EHP
Scaler = 2 f or EHP
Unit = AMU
scaler = 1 f or non-EHP
Unit = Gauss
scaler = 2 f or EHP
Unit = uT, scaler = 2,
option = Analyzer CCIG
Unit = kV, scaler = 1
Option = 60kV Mirror
Unit = mA, scaler = 2
Unit = mA, scaler = 2
Unit = A, scaler = 1
Unit = V, scaler = 1
Unit = A, scaler = 1
Unit = V, scaler = 1
Unit = kV, scaler = 1
Unused
Unused
Unused

Unit = mA, scaler = 1
Unit = V, scaler = 2
Unit = uT, scaler = 2
Unit = #, scaler = 0
Unit = #
Unit = A (range
dependent)

Unit = A (range
dependent)

Parameter
ES Vac Pressure
Target Cup Bias V
Beam Width
eFilament V
eFilament I
eRipple Volts
eExtraction V
eExtraction I
eTarget I
eBias V
eBias I
eSuppression V
eSecondary I
Parameter
Ccode
ES Vac Pressure
12

Units
TORR
V

Def ault
Min / Max
1%
5%

Spec.
Min / Max
0
0/250

Def ault
Interlock
w arning
w arning

Volts
Amps
Volts
Volts
Amps
mA
Volts
mA
Volts
mA

5%
5%
5%
5%
5%
5%
5%
5%
5%
5%

0/20.0
0/13.0
0/50.0
0/350
0/99.9
0/99.9
0/25.0
0/10.0
0/999
0/10.0

ignore
ignore
ignore
ignore
ignore
ignore
ignore
ignore
ignore
ignore

Bytes
8

Type
Tgt_lim

Of f set
428

Target Cup Bias V
Beam Width

71
83

8
2

Tgt_lim
Ushort

436
444

Raw Values
0 -5000
0 – 250 f or non-f lood
gun
0 – 999 f or f lood gun
(learned)

eFilament V

72

8

Tgt_lim

446

0 - 200

eFilament I

73

8

Tgt_lim

454

0 - 130

eRipple Volts

74

8

Tgt_lim

462

0 - 500

eExtraction V

75

8

Tgt_lim

470

0 - 350

eExtraction I

76

8

Tgt_lim

478

0 - 999

eTarget I

77

8

Tgt_lim

486

0 - 999

eBias V

78

8

Tgt_lim

494

0 - 250

eBias I

79

8

Tgt_lim

502

0 - 100

eSuppression V

80

8

Tgt_lim

510

0 - 999

eSecondary I
AnalyzerG
Spares

81
109

8
8
192

Tgt_lim
Tgt_lim
Uchar

518
526
534

0 - 100
0 - 1200

Remarks
Unit = uT, scaler = 2

Unit = V, scaler = 0
Unit = V, scaler=
1,option= ef lood
Unit = A, scaler=
1,option= ef lood
Unit = V, scaler=
1,option= ef lood
Unit = V, scaler=
0,option= ef lood
Unit = A, scaler=
1,option= ef lood
Unit = mA, scaler=
1,option= ef lood
Unit = V, scaler= 1,
option= ef lood
Unit= mA, scaler= 1,
option= ef lood
Unit = V, scaler = 0,
option = ef lood
Unit= mA, scaler=
1,option = ef lood
Unit= G, scaler= 2

Multi-line Parameters
Note: There are 12 recipe lines, each consisting of data with the structure shown below.
CCODE 82 is the whole multi-line section, consisting of the parameters below.
CCODE 108 is one line.

Parameter
Dose (mant+expo)
Dose Exponent
Rotations
Tilt
Tw ist
Energy
Accel V
Accel I
Decel V
Decel I
Accel Suppression V
Accel Suppression I
Parameter

Ccode

Dose Mantissa
Dose Exponent
Rotations
Tilt
Tw ist
Energy
Accel V
Accel I
Decel V
Decel I
Accel Suppr V
Accel Suppr I

Units
ions/cm²

Def ault
Min / Max
----

Spec.
Min / Max
1.00E+20

Def ault
Interlock
----

#
DEG
DEG
keV
kV
mA
V
mA
V
mA

---------1%
1%
1%
1%
1%
5%
5%

0 /16
0/90
0/359
1/400
/200.
5
30
2.5
5
5

critical
critical
critical
w arning
ignore
ignore
ignore
ignore
ignore
ignore

Bytes

Type

Of f set

Raw Values

2
2
2
2
2
8
8
8
8
8
8
8

Ushort
Ushort
Ushort
Ushort
Ushort
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim
Tgt_lim

726
728
730
732
734
736
744
752
760
768
776
784

1000 - 9999
17-Sep
0 - 30
0 -90
0 - 359
0 - 750
0 - 1950
0 - 8000
0 - 300
0 - 250
0 - 500
0 - 500

Remarks
Unit= ions/cm², scaler
=3
Unit = #
Unit = DEG
Unit = DEG
Unit = keV, scaler = 0
Unit = kV, scaler = 1
Unit = mA, scaler = 3
Unit = V, scaler = 1
Unit = mA, scaler = 2
Unit = V, scaler = 2
Unit = mA, scaler = 2

Multiline 2 offset = 792
Multiline 3 offset = 858
Multiline 4 offset = 924
Multiline 5 offset = 990
Multiline 6 offset = 1056
Multiline 7 offset = 1122
Multiline 8 offset = 1188
Multiline 9 offset = 1254
Multiline 10 offset = 1320
Multiline 11 offset = 1386
Multiline 12 offset = 1452
End of recipe offset = 1518
Where Used: S7F3, S7F6, S7F18

PPGNT -- Process program grant status, 1 byte
0 = OK
1 = already have
2 = no space
3 = invalid PPID
4 = busy, try later
5 = will not accept
>5 = other error
6-63 = reserved
Where Used: S7F2

Format: 10

PPID -- Process program ID.

Format: 20

The recipe name as it appears in the process screens of the E220. Maximum of 16 characters. Trailing spaces are
ignored
Where Used: S7F1, S7F3, S7F5, S7F6, S7F17, S7F20

RCMD

Format: 20

Code

Name

1

START-UP

Pump vacuum system, initialize handler

2

SHUT-DOWN

Turn off ion source, idle vacuum system

3

STOP

Cease setting up or processing wafers

4

START

Start processing wafers or continue setting
up

5

ABORT

Action commanded

Abort current operation and return wafers if
aborting during implant

6

VENT-ONLY

Vent elevators (Doors not opened)

7

PUMP-ONLY

Pump elevators

8

OPEN-ONLY

Open elevator doors

9

CLOSE-ONLY

Close elevator doors

10

CLOSE&PUMP

Close elevator doors, pump elevators and
maps wafers

11

VENT&OPEN

Vent elevators and open elevator doors

12

CYCLE-TEST

13

RR-PROCEED

14

RR-NOT-

Map and cycle all wafers present
Not available in V11.01 and newer software
Proceed, Response to E220 Operator
Message
Do Not Proceed, Response to E220

Screens
(See note on screens
below)
Host Control
Batch Status
Host Control
Batch Status
Host Control
Batch Status
Implant
Auto Source
Auto Scan
Manual Beam
Host Control
Batch Status
Implant
Auto Source
Auto Scan
Manual Beam
Host Control
Batch Status
Implant
Auto Source
Auto Scan
Manual Beam
Host Control
Batch Status
Host Control
Batch Status
Host Control
Batch Status
Host Control
Batch Status
Host Control
Batch Status
Host Control
Batch Status
Host Control
Batch Status
Any Screen after message
appears

15
16

PROCEED
FACTORYAUTO
PPSELECT

Operator Message
Factory Automation Equipment lot
scheduling start
Choose Process Program for Batch
Parameter Name CPNAME = PPID
Parameter Value CPVAL (Format A) = 16character PPID name
CPNAME = LOC
CPVAL (Format B) =
1 - Left
2 – Right
3 - Both
CPNAME = MID1
CPVAL (Format A) = 16- character Left Lot
Name
CPNAME = MID2
CPVAL (Format A) = 16-character Right Lot
Name
CPNAME = START-WAF1
CPVAL (Format B) = starting slot to process
on the left
CPNAME = WAF-COUNT1
CPVAL (Format B) = number of wafers to
process on the left
CPNAME = START-WAF2
CPVAL (Format B) = starting slot to process
on the right
CPNAME = WAF-COUNT2
CPVAL (Format B) = number of wafers to
process on the left
CPNAME = JOB-TIME
CPVAL (Format U2) = number of minutes to
wait after a SETUP-ONLY job. 0 to 120
minutes. Applicable only if Process Job
Queue is enabled.
CPNAME = WAFER-RANGE-CHECK
CPVAL (Format BOOLEAN)
If true, the number of wafers to be
processed as specified by START-WAF and
WAF-COUNT are checked against the
number of wafers mapped. If there is a
conflict, an error message is displayed.
CPNAME = SHUFFLE-MODE
CPVAL (Format BOOLEAN)

Any Screen after message
appears
Host Control
Batch Status

If true, a shuffle mode will be performed.
Note: This command will be rejected if ECO
37 (Wafer Shuffle Mode) is not selected.
CPNAME = JOB-ID
CPVAL (Format A) = 16-character Hostassigned job-id. If the host specifies a JOBID that has a duplicate, the equipment
replies with S2F42, HCACK=3, invalid JOBID.
CPNAME = PPID-LIST
CPVAL (Format L) = list of 16-character
PPID names that the job’s materials will be
process with. (chained implant).
S2F49 message should be used with this
parameter.
CPNAME = WaferID1
CPVAL (Format L) = list of 48-character
WaferIDs on the left side that will be used to
identify the wafer being processed. If the
slot is empty, a blank WaferID should be
used. Applicable only if MID Module is
enabled.
CPNAME = SlotMap1
CPVAL (Format L) = list of Format- B flags
to specify that the wafer in a slot exists on
the left.
0x00 – no wafer in the slot
0x01 – wafer exists in the slot
Applicable only if MID Module is enabled.
CPNAME = WaferID2
CPVAL (Format L) = list of 48-character
WaferIDs on the right side that will be used
to identify the wafer being processed. If the
slot is empty, a blank WaferID should be
used. Applicable only if MID Module is
enabled.
CPNAME = SlotMap2

17

PPCLEAR-LEFT

18

PPCLEARRIGHT

19

SETUP-ONLY

20

STARTPROCESS

CPVAL (Format L) = list of Format- B flags
to specify that the wafer in a slot exists on
the right.
0x00 – no wafer in the slot
0x01 – wafer exists in the slot
Applicable only if MID Module is enabled.
Clears the selected process program and lot
id for the left loadlock. Not applicable in FA
semi or full-auto mode.
Clears the selected process program and lot
id for the right loadlock. Not applicable in
FA semi or full-auto mode.
Starts source, beamline and beamscan
setups even if the loadlocks are not closed
and pumped.
Start the job at the top of the Process Job
queue (V12.20 Feature).

Any screen

Any screen

Any screen

21
22
23
24
25
26
27

28
29
30
31
32
33
34
35
36
37

LEFT-VENT
LEFT-PUMP
LEFT-OPEN
LEFT-CLOSE
LEFT-CLOSEPUMP
LEFT-VENTOPEN
START-DUAL

START-LEFT
START-RIGHT
STARTIMPLANT
RIGHT-VENT
RIGHT-PUMP
RIGHT-OPEN
RIGHT-CLOSE
RIGHT-CLOSEPUMP
RIGHT-VENTOPEN
PPCLEARLINEUP-QUEUE

41

GO-LOCAL

42

GO-REMOTE

43
44

BUZZER-ON
BUZZER-OFF

45
46
47
48
49
50
51
52
53
54
55
56
57

BLUE-OFF
BLUE-FLASH
BLUE-ON
GREEN-OFF
GREEN-FLASH
GREEN-ON
YELLOW-OFF
YELLOW-FLASH
YELLOW-ON
RED-OFF
RED-FLASH
RED-ON
(unnamed)

Vent Left Loadlock
Pump Left Loadlock
Open Left Loadlock
Close Left Loadlock
Close and pump Left Loadlock, and map
wafers
Vent and Open Left Loadlock

Host Control, Batch Status
Host Control, Batch Status
Host Control, Batch Status
Host Control, Batch Status
Host Control, Batch Status

Applicable for both VILL and non-VILL
processing. Starts set up on both sides if
recipes are identical. If recipes are not
identical, starts sequential processing
Starts set up on left side
Starts set up on right side
Starts implanting wafers after setup

Host Control, Batch Status

Vent Right Loadlock
Pump Right Loadlock
Open Right Loadlock
Close Right Loadlock
Close and pump Right Loadlock, and map
wafers
Vent and Open Right Loadlock
Removes all entries in the Process Job
Queue except those that are already active.
V12.20 Feature
Switches host control mode to LOCAL in
GEM or MONITOR in SECS.
Switches host control mode to REMOTE in
GEM or CONTROL in SECS.
Turns audible alarm on
Turns audible alarm off. Note that this
remote command will be rejected if it is sent
while an alarm is unacknowledged. The
audible alarm will be turned off by alarm
acknowledgement through an operator or
host
Signal tower BLUE light turns OFF
Signal tower BLUE light FLASHES
Signal tower BLUE light turns ON
Signal tower GREEN light turns OFF
Signal tower GREEN light FLASHES
Signal tower GREEN light turns ON
Signal tower YELLOW light turns OFF
Signal tower YELLOW light FLASHES
Signal tower YELLOW light turns ON
Signal tower RED light turns OFF
Signal tower RED light FLASHES
Signal tower RED light turns ON
Sets run parameters LCASSETTE,
RCASSETTE, HOST-OPERATOR-ID and
OPERATION
CPNAME = LCASSETTE
CPVAL (Format A) = 16-character
Cassette name
CPNAME = RCASSETTE
CPVAL (Format A) = 16-character Cassette
name

Host Control, Batch Status

Host Control, Batch Status
Host Control, Batch Status
Host Control, Batch Status
Host Control, Batch Status
Host Control, Batch Status
Host Control, Batch Status
Host Control, Batch Status
Host Control, Batch Status
Host Control, Batch Status

Any screen
Any screen
Any screen
Any screen

Any screen
Any screen
Any screen
Any screen
Any screen
Any screen
Any screen
Any screen
Any screen
Any screen
Any screen
Any screen
Any screen

CPNAME = HOST-OPERATOR-ID
CPVAL (Format A) = operator id

58

SETLIGHTTOWER

CPNAME = OPERATION
CPVAL (Format A) = operation
Set signal tower lights with one remote
command.
CPNAME = RED

Any screen

CPVAL (Format U1) =
0 – Off
1 – On
2 – Flashing
CPNAME = YELLOW
CPVAL same as parameter value for RED
CPNAME = GREEN
CPVAL same as parameter value for RED
CPNAME = BLUE
CPVAL same as parameter value for RED

60

PPQ

NOTE: Setting for BLUE is ignored when a
3 light tower is used.
Specifies parameters PTN, PPID, and MID
CPNAME = PTN
CPVAL (Format B) =
CPNAME = PPID
CPVAL (Format A) = 16-character PPID
name

62

63

200

DELETE-JOB

PROMOTE-JOB

SMIF-ControlMode

CPNAME = MID
CPVAL (Format A) = 16-character Material
ID name
Deletes the specified job from the Process
Job Queue.
CPNAME = JOB-ID
CPVAL (Format A) = 16-character Hostassigned job-id. Applicable only if Process
Job Queue is enabled.
Sets the specified job to be the next one to
be processed in the Process Job Queue.
CPNAME = JOB-ID
CPVAL (Format A) = 16-character Hostassigned job-id. Applicable only if Process
Job Queue is enabled.
Perform a Load Cycle

201
202

CPNAME = MODE

Any screen

Any screen

203
204

CPVAL (Format U1) =
1 - Manual Mode
2 - Semi-auto Mode (Asyst smif only)
3 - Full-auto Mode
Perform a Load Cycle

Any screen

SMIF-Unload

CPNAME (Format A) = SMIF
CPVAL (Format U1) =
1 - Left SMIF 1
2 - Right SMIF 2
3 - Both
Perform a Unload Cycle

Any screen

SMIF-PortLock

CPNAME (Format A) = SMIF
CPVAL (Format U1) =
1 - Left SMIF 1
2 - Right SMIF 2
3 - Both
Lock the POD

Any screen

CPNAME (Format A) = SMIF
CPVAL (Format U1) =
1 - Left SMIF 1
2 - Right SMIF 2
3 - Both
Unlock the POD

Any screen

CPNAME (Format A) = SMIF
CPVAL (Format U1) =
1 - Left SMIF 1
2 - Right SMIF 2
3 - Both
Blink LED labled POD IN PLACE

Any screen

Emergency-Stop

CPNAME (Format A) = SMIF
CPVAL (Format U1) =
1 - Left SMIF 1
2 - Right SMIF 2
3 - Both
Unconditionally Stop

Any screen

SMIF-Home

CPNAME (Format A) = SMIF
CPVAL (Format U1) =
1 - Left SMIF 1
2 - Right SMIF 2
3 - Both
Perform a Home Cycle

Any screen

SMIF-Home-

CPNAME (Format A) = SMIF
CPVAL (Format U1) =
1 - Left SMIF 1
2 - Right SMIF 2
3 - Both
Perform a Level 2 Home Cycle

Any screen

SMIF-Load

205

206
207
208

209
210
211

212

SMIF-PortUNlock

213
214

215

Blink-POD-inLED

216
217

218
219
220

221
222
223

224

Level2

(Ergospeed 2 Only)

225
226
CPNAME (Format A) = SMIF

227

SMIF-HomeLevel3

CPVAL (Format U1) =
1 - Left SMIF 1
2 - Right SMIF 2
3 - Both
Perform a Level 3 Home Cycle
(Ergospeed 2 Only)

Any screen

228
229
CPNAME (Format A) = SMIF

230

Stop-Blink

CPVAL (Format U1) =
1 - Left SMIF 1
2 - Right SMIF 2
3 - Both
Stop Blinking of LED labled POD IN
PLACE (Ergospeed 2 Only)

Any screen

231
232

CPNAME (Format A) = SMIF
CPVAL (Format U1) =
1 - Left SMIF 1
2 - Right SMIF 2
3 - Both

Notes:
1) The list of remote commands (RCMD) is supported by the E220 GEM application. The maximum length of the RCMD is
20 printable characters. No spaces are allowed.
2) All RCMD names are case-sensitive.
3) CPNAMEs have ‘A’ format.
3) Codes 200-220 were added in V11.00.22. They are used to command dual SMIF LPTs. The dual SMIF LPTs must be
present, selected, and communications established between the E220 and the SMIF LPTs before the E220 will accept
these commands.
Codes 221-232 were added in V11.07.06. They are used to command Ergospeed SMIFs
4) In software versions before V11.01, remote commands are not always available for execution due to the state of the
E220. This is most notable by the displayed screen. The column labeled Screens denotes when a command will be
executed. Users must make sure the E220 is displaying the proper screen before leaving the machine. If a command
cannot be executed the message will be NAKed. In software version V11.01 and later, remote commands can be
executed independently from the screen.
5)
Examples of PPSELECT Remote Command Messages:
The structure for a dual sided PPSELECT will be as follows:
S2F41 W



>



>


>


>
>
>
The structure for a left single sided PPSELECT will be as follows:
S2F41 W



>


>


>


>
>
>
The structure for a dual sided PPSELECT with slotmap will be as follows (only wafers 1
and 2 have been specified):
S2F41 W



>


>


>


>



>


>

0x00 0x00 0x00 0x00 0x00 0x00 0x00
0x00 0x00 0x00 0x00 0x00 0x00 0x00

0x00 0x00 0x00 0x00 0x00 0x00 0x00
0x00 0x00 0x00 0x00 0x00 0x00 0x00

>
>
The structure for a left sided PPSELECT with slotmap will be as follows (only wafers 1
and 2 have been specified):
S2F41 W



>


>


>


>


>
>
>
The structure for a dual sided PPSELECT with wafer ID map will be as follows (only
wafers 1 and 2 have been specified):
S2F41 W



>



>


>


>


























>
>



























>
>
>
>
The structure for a left sided PPSELECT with Wafer ID map will be as follows (only
wafers 1 and 2 have been specified):
S2F41 W



>


>


>


>



























>
>
>
>

The structure for a left single sided PPSELECT with cassette slot and wafer ID map will
be as follows (MID-MODE ECID 286 WCC bit must be set. Slot and wafer map comparison is
made at the SMIF and not tool):



>


>


>


>



























>
>


>
>
>
>
The structure for a dual sided PPSELECT with cassette slot and wafer ID map will be as
follows (MID-MODE ECID 286 WCC bit must be set. Slot and wafer map comparison is made at
the SMIF and not tool):



>


>


>


>



























>
>


























>
>


>



0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00
0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00
0x00 0x00>

>
>
>

>

The structure for a dual-sided PPSELECT specifying a 3-recipe chained implant and wafer
ranges will be as follows:
S2F49 W







>
>


>


>


>


>


>


>




>
>
>.

Where Used: S2F41

REPGSZ -- Reporting group size

Format: 5( )

Where Used: S2F23

RPTID -- Report ID

Format: 5( )

Identifier of a defined report. Either a default report or a report defined with S2F33 /S2F34 .
Where Used: S2F33, S2F35; S6F11, S6F13

RSACK -- Ready to Send Acknowledge code, 1 byte

Format: 10

0 = acknowledge, OK (note that 'OK' differs from 'ready')
1 = invalid port number
2 = port is already occupied
3 = busy, unable to move material at this time. Try again
4 = receiver does not have permission to perform this operation
5-63 = reserved
Where Used:

RSDA -- Request Spool Data Acknowledge

Format: 10

0 = OK
1 = Denied, busy try later
2 = Denied, spooled data does not exist
3-63 = Reserved
Where Used: S6F24

RSDC -- Request Spool Data Code
0 = Transmit Spooled Messages
1 = Purge Spooled Messages
2-63 = Reserved
Where Used: S6F23

Format: 51

SEQNUM -- Command Number

Format: 52

Value which identifies a unique process program command by its position in the list of commands relative to the first. For
the first command of the process program, SEQNUM is l.
Where Used: S7F27

SFCD -- Status form code, 1 byte

Format: 10

Where Used:

SHEAD -- Stored header related to the transaction timer

Format: 10

Where Used: S9F9

SMPLN -- Sample number

Format: 5( )

Where Used: S6F1

SOFTREV -- Software revision code 8 bytes maximum Format: 20
The software revision code for the E220 is a 4 to 8 character string of the form "10.00.00".
Where Used: S1F2, S1F13, S1F14

STIME -- Sample time, 12 bytes

Format: 20

yymmddhhmmss
Where Used: S6F1

STRACK -- Spool Stream Acknowledge

Format: 10

1 = Spooling not allowed for stream (i.e., Stream 1)
2 = Stream unknown
3 = Unknown function specified for this stream
4 = Secondary function specified for this stream
Where Used: S2F44

STRID -- Stream Identification

Format: 51

Where Used: S2F43, S2F44

SV -- Status variable value

Format: 20, 5( )

Where Used: S1F4, S6F1

SVID -- Status variable ID

Format: 5( )

The status variables may also be access with a VID of equivalent value using the functions appropriate for VID. See VID
for table showing relationship between data variables identifcation (DVID), equipment constant identifications(ECID), and
status variable identifications( SVID) ). The status variable IDs are as follows:
SVID
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37

SVNAME
Analog Readback Variables
TERMINAL- MEGOHMS
GROUND- MEGOHMS
TERMINAL- WATER- TEMP
GROUND- WATER- TEMP
CITY- WATER- TEMP
SOURCE- PRESSURE
SCANNER- PRESSURE
CHAMBER- PRESSURE
SOURCE- TURBO- SPEED
SCANNER- TURBO- SPEED
LEFT- CRYO- TEMP
CHAMBER- CRYO- TEMP
RIGHT- CRYO- TEMP
LEFT- ELEVATOR- TC
CHAMBER- CRYO- TC
RIGHT- ELEVATOR- TC
GAS
G1- PRES
G2- PRES
G3- PRES
G4- PRES
FIL- I
FIL- VOLTS
ARC- I
RANGE- ARC
ARC- VOLTS
MAG- I
EXT- VOLTS
EXT- I
SUP- VOLTS
SUP- I
X- AXIS
Y- AXIS
Z- AXIS
AMU- I
AMU
BIAS

SVID
400
401
402
403
404
405
406
407
408
409
410
411
412
413
414
415
416
417
418
419
420
421
422
423
424
425
426
427
428
429
430
431
432
433
434
435
436

SVNAME
Pump Analog Readback Variables
a1ESTurboSpeed[0]
a1ESTurboNormalizedSpeed[0]
a1ESTurboCurrent[0]
a1ESTurboVoltage[0]
a1ESTurboTempC[0]
a1ESTurboLifeHR[0]
a1ESTurboCycles[0]
a1ESTurboCycleTimeMIN[0]
a1ESTurboSpeed[1]
a1ESTurboNormalizedSpeed[1]
a1ESTurboCurrent[1]
a1ESTurboVoltage[1]
a1ESTurboTempC[1]
a1ESTurboLifeHR[1]
a1ESTurboCycles[1]
a1ESTurboCycleTimeMIN[1]
a1OnBoardRegenStep[0]
a1OnBoardFirstStageTemp[0]
a1OnBoardSecondStageTemp[0]
a1OnBoardTcGaugePress[0]
a1OnBoardTotalOperatingTime[0]
a1OnBoardTempSinceLastFullRegen[0]
a1OnBoardTempSinceLastFastRegen[0]
a1OnBoardBasePressure[0]
a1OnBoardRegenStep[1]
a1OnBoardFirstStageTemp[1]
a1OnBoardSecondStageTemp[1]
a1OnBoardTcGaugePress[1]
a1OnBoardTotalOperatingTime[1]
a1OnBoardTempSinceLastFullRegen[1]
a1OnBoardTempSinceLastFastRegen[1]
a1OnBoardBasePressure[1]
a1OnBoardRegenStep[2]
a1OnBoardFirstStageTemp[2]
a1OnBoardSecondStageTemp[2]
a1OnBoardTcGaugePress[2]
a1OnBoardTotalOperatingTime[2]

38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
1001
1002
1003
1004
1005
1006
1007
1008
1009
1010
1011

BEAM
BEAM- I- RANGE
MIR- VOLTS
MIR- I
MIR- SHUNT- I
Q1- I
Q2- I
DEFLECTOR
LENS- I
ACCEL- VOLTS
ACCEL- I
DEC- VOLTS
DEC- I
ENERGY-PROBE
TARGET- BIAS
VAP- TEMP
COOLING
eFIL- VOLTS
eFIL- I
eRPL- VOLTS
eEXT- VOLTS
eEXT- I
eTARGET- I
eBIAS- VOLTS
eBIAS- I
eSUP- VOLTS
ANALYZER- PRESSURE
DRY- PUMP- TC
Not Used
MAG-VOLTS
Q1-VOLTS
Q2-VOLTS
LENS-VOLTS
eSECOND-I
HTR-TEMP
DECEL-VOLTS
DECEL-I
AMU-G
HELIUM-PRESSURE
TERM-DI-RETURN-TEMP
ES-DIFFER-TC
DI-WATER-DELTA-TEMP
ANALYZER-TC
BEAMLINE-TC
DECEL-SUPPRESSION-VOLTS
Low Analog Readback On Last Wafer
lwTERMINAL- MEGOHMS
lwGROUND- MEGOHMS
lwTERMINAL- WATER- TEMP
lwGROUND- WATER- TEMP
lwCITY- WATER- TEMP
lwSOURCE- PRESSURE
lwSCANNER- PRESSURE
lwCHAMBER- PRESSURE
lwSOURCE- TURBO- SPEED
lwSCANNER- TURBO- SPEED
lwLEFT- CRYO- TEMP

437
438
439

a1OnBoardTempSinceLastFullRegen[2]
a1OnBoardTempSinceLastFastRegen[2]
a1OnBoardBasePressure[2]

506
507
508
517

GEM System Data Variables
TIME
MDLN
SOFTREV
ALARMSTATE

2001
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011

Highest Analog Readback On Last Wafer
hwTERMINAL- MEGOHMS
hwGROUND- MEGOHMS
hwTERMINAL- WATER- TEMP
hwGROUND- WATER- TEMP
hwCITY- WATER- TEMP
hwSOURCE- PRESSURE
hwSCANNER- PRESSURE
hwCHAMBER- PRESSURE
hwSOURCE- TURBO- SPEED
hwSCANNER- TURBO- SPEED
hwLEFT- CRYO- TEMP

1012
1013
1014
1015
1016
1017
1018
1019
1020
1021
1022
1023
1024
1025
1026
1027
1028
1029
1030
1031
1032
1033
1034
1035
1036
1037
1038
1039
1040
1041
1042
1043
1044
1045
1046
1047
1048
1049
1050
1051
1052
1053
1054
1055
1056
1057
1058
1059
1060
1061
1062
1063
1064
1065
1066
1067
1068

lwCHAMBER- CRYO- TEMP
lwRIGHT- CRYO- TEMP
lwLEFT- ELEVATOR- TC
lwCHAMBER- CRYO- TC
lwRIGHT- ELEVATOR- TC
lwGAS
lwG1- PRES
lwG2- PRES
lwG3- PRES
lwG4- PRES
lwFIL- I
lwFIL- VOLTS
lwARC- I
lwRANGE- ARC
lwARC- VOLTS
lwMAG- I
lwEXT- VOLTS
lwEXT- I
lwSUP- VOLTS
lwSUP- I
lwX- AXIS
lwY- AXIS
lwZ- AXIS
lwAMU- I
lwAMU
lwBIAS
lwBEAM
lwBEAM- I- RANGE
lwMIR- VOLTS
lwMIR- I
lwMIR- SHUNT- I
lwQ1- I
lwQ2- I
lwDEFLECTOR
lwLENS- I
lwACCEL- VOLTS
lwACCEL- I
lwDEC- VOLTS
lwDEC- I
lwENERGY-PROBE
lwTARGET- BIAS
lwVAP- TEMP
lwCOOLING
lweFIL- VOLTS
lweFIL- I
lweRPL- VOLTS
lweEXT- VOLTS
lweEXT- I
lweTARGET- I
lweBIAS- VOLTS
lweBIAS- I
lweSUP- VOLTS
lwANALYZER- PRESSURE
lwDRY- PUMP- TC
Not Used
lwMAG-VOLTS
lwQ1-VOLTS

2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
2023
2024
2025
2026
2027
2028
2029
2030
2031
2032
2033
2034
2035
2036
2037
2038
2039
2040
2041
2042
2043
2044
2045
2046
2047
2048
2049
2050
2051
2052
2053
2054
2055
2056
2057
2058
2059
2060
2061
2062
2063
2064
2065
2066
2067
2068

hwCHAMBER- CRYO- TEMP
hwRIGHT- CRYO- TEMP
hwLEFT- ELEVATOR- TC
hwCHAMBER- CRYO- TC
hwRIGHT- ELEVATOR- TC
hwGAS
hwG1- PRES
hwG2- PRES
hwG3- PRES
hwG4- PRES
hwFIL- I
hwFIL- VOLTS
hwARC- I
hwRANGE- ARC
hwARC- VOLTS
hwMAG- I
hwEXT- VOLTS
hwEXT- I
hwSUP- VOLTS
hwSUP- I
hwX- AXIS
hwY- AXIS
hwZ- AXIS
hwAMU- I
hwAMU
hwBIAS
hwBEAM
hwBEAM- I- RANGE
hwMIR- VOLTS
hwMIR- I
hwMIR- SHUNT- I
hwQ1- I
hwQ2- I
hwDEFLECTOR
hwLENS- I
hwACCEL- VOLTS
hwACCEL- I
hwDEC- VOLTS
hwDEC- I
hwENERGY-PROBE
hwTARGET- BIAS
hwVAP- TEMP
hwCOOLING
hweFIL- VOLTS
hweFIL- I
hweRPL- VOLTS
hweEXT- VOLTS
hweEXT- I
hweTARGET- I
hweBIAS- VOLTS
hweBIAS- I
hweSUP- VOLTS
hwANALYZER- PRESSURE
hwDRY- PUMP- TC
Not Used
hwMAG-VOLTS
hwQ1-VOLTS

1069
1070
1071
1072
1073
1074
1075
1076
1077
1078
1079
1080
1081
3001
3002
3003
3004
3005
3006
3007
3008
3009
3010
3011
3012
3013
3014
3015
3016
3017
3018
3019
3020
3021
3022
3023
3024
3025
3026
3027
3028
3029
3030
3031
3032
3033
3034
3035
3036
3037
3038
3039
3040
3041
3042
3043

lwQ2-VOLTS
lwLENS-VOLTS
lweSECOND-I
lwHTR-TEMP
lwDECEL-VOLTS
lwDECEL-I
lwAMU-G
lwHELIUM-PRESSURE
lwTERM-DI-RETURN-TEMP
lwES-DIFFER-TC
lwDI-WATER-DELTA-TEMP
lwANALYZER-TC
lwBEMLINE-TC
Ave. Analog Readback On Last Wafer
awTERMINAL- MEGOHMS
awGROUND- MEGOHMS
awTERMINAL- WATER- TEMP
awGROUND- WATER- TEMP
awCITY- WATER- TEMP
awSOURCE- PRESSURE
awSCANNER- PRESSURE
awCHAMBER- PRESSURE
awSOURCE- TURBO- SPEED
awSCANNER- TURBO- SPEED
awLEFT- CRYO- TEMP
awCHAMBER- CRYO- TEMP
awRIGHT- CRYO- TEMP
awLEFT- ELEVATOR- TC
awCHAMBER- CRYO- TC
awRIGHT- ELEVATOR- TC
awGAS
awG1- PRES
awG2- PRES
awG3- PRES
awG4- PRES
awFIL- I
awFIL- VOLTS
awARC- I
awRANGE- ARC
awARC- VOLTS
awMAG- I
awEXT- VOLTS
awEXT- I
awSUP- VOLTS
awSUP- I
awX- AXIS
awY- AXIS
awZ- AXIS
awAMU- I
awAMU
awBIAS
awBEAM
awBEAM- I- RANGE
awMIR- VOLTS
awMIR- I
awMIR- SHUNT- I
awQ1- I

2069
2070
2071
2072
2073
2074
2075
2076
2077
2078
2079
2080
2081
4001
4002
4003
4004
4005
4006
4007
4008
4009
4010
4011
4012
4013
4014
4015
4016
4017
4018
4019
4020
4021
4022
4023
4024
4025
4026
4027
4028
4029
4030
4031
4032
4033
4034
4035
4036
4037
4038
4039
4040
4041
4042
4043

hwQ2-VOLTS
hwLENS-VOLTS
hweSECOND-I
hwHTR-TEMP
hwDECEL-VOLTS
hwDECEL-I
hwAMU-G
hwHELIUM-PRESSURE
hwTERM-DI-RETURN-TEMP
hwES-DIFFER-TC
hwDI-WATER-DELTA-TEMP
hwANALYZER-TC
hwBEMLINE-TC
Lowest Analog Readback On Last Batch
lbTERMINAL- MEGOHMS
lbGROUND- MEGOHMS
lbTERMINAL- WATER- TEMP
lbGROUND- WATER- TEMP
lbCITY- WATER- TEMP
lbSOURCE- PRESSURE
lbSCANNER- PRESSURE
lbCHAMBER- PRESSURE
lbSOURCE- TURBO- SPEED
lbSCANNER- TURBO- SPEED
lbLEFT- CRYO- TEMP
lbCHAMBER- CRYO- TEMP
lbRIGHT- CRYO- TEMP
lbLEFT- ELEVATOR- TC
lbCHAMBER- CRYO- TC
lbRIGHT- ELEVATOR- TC
lbGAS
lbG1- PRES
lbG2- PRES
lbG3- PRES
lbG4- PRES
lbFIL- I
lbFIL- VOLTS
lbARC- I
lbRANGE- ARC
lbARC- VOLTS
lbMAG- I
lbEXT- VOLTS
lbEXT- I
lbSUP- VOLTS
lbSUP- I
lbX- AXIS
lbY- AXIS
lbZ- AXIS
lbAMU- I
lbAMU
lbBIAS
lbBEAM
lbBEAM- I- RANGE
lbMIR- VOLTS
lbMIR- I
lbMIR- SHUNT- I
lbQ1- I

3044
3045
3046
3047
3048
3049
3050
3051
3052
3053
3054
3055
3056
3057
3058
3059
3060
3061
3062
3063
3064
3065
3066
3067
3068
3069
3070
3071
3072
3073
3074
3075
3076
3077
3078
3079
3080
3081
5001
5002
5003
5004
5005
5006
5007
5008
5009
5010
5011
5012
5013
5014
5015
5016
5017
5018

awQ2- I
awDEFLECTOR
awLENS- I
awACCEL- VOLTS
awACCEL- I
awDEC- VOLTS
awDEC- I
awENERGY-PROBE
awTARGET- BIAS
awVAP- TEMP
awCOOLING
aweFIL- VOLTS
aweFIL- I
aweRPL- VOLTS
aweEXT- VOLTS
aweEXT- I
aweTARGET- I
aweBIAS- VOLTS
aweBIAS- I
aweSUP- VOLTS
awANALYZER- PRESSURE
awDRY- PUMP- TC
Not Used
awMAG-VOLTS
awQ1-VOLTS
awQ2-VOLTS
awLENS-VOLTS
aweSECOND-I
awHTR-TEMP
awDECEL-VOLTS
awDECEL-I
awAMU-G
awHELIUM-PRESSURE
awTERM-DI-RETURN-TEMP
awES-DIFFER-TC
awDI-WATER-DELTA-TEMP
awANALYZER-TC
awBEMLINE-TC
High Analog Readback On Last Batch
hbTERMINAL- MEGOHMS
hbGROUND- MEGOHMS
hbTERMINAL- WATER- TEMP
hbGROUND- WATER- TEMP
hbCITY- WATER- TEMP
hbSOURCE- PRESSURE
hbSCANNER- PRESSURE
hbCHAMBER- PRESSURE
hbSOURCE- TURBO- SPEED
hbSCANNER- TURBO- SPEED
hbLEFT- CRYO- TEMP
hbCHAMBER- CRYO- TEMP
hbRIGHT- CRYO- TEMP
hbLEFT- ELEVATOR- TC
hbCHAMBER- CRYO- TC
hbRIGHT- ELEVATOR- TC
hbGAS
hbG1- PRES

4044
4045
4046
4047
4048
4049
4050
4051
4052
4053
4054
4055
4056
4057
4058
4059
4060
4061
4062
4063
4064
4065
4066
4067
4068
4069
4070
4071
4072
4073
4074
4075
4076
4077
4078
4079
4080
4081
6001
6002
6003
6004
6005
6006
6007
6008
6009
6010
6011
6012
6013
6014
6015
6016
6017
6018

lbQ2- I
lbDEFLECTOR
lbLENS- I
lbACCEL- VOLTS
lbACCEL- I
lbDEC- VOLTS
lbDEC- I
lbENERGY-PROBE
lbTARGET- BIAS
lbVAP- TEMP
lbCOOLING
lbeFIL- VOLTS
lbeFIL- I
lbeRPL- VOLTS
lbeEXT- VOLTS
lbeEXT- I
lbeTARGET- I
lbeBIAS- VOLTS
lbeBIAS- I
lbeSUP- VOLTS
lbANALYZER- PRESSURE
lbDRY- PUMP- TC
Not Used
lbMAG-VOLTS
lbQ1-VOLTS
lbQ2-VOLTS
lbLENS-VOLTS
lbeSECOND-I
lbHTR-TEMP
lbDECEL-VOLTS
lbDECEL-I
lbAMU-G
lbHELIUM-PRESSURE
lbTERM-DI-RETURN-TEMP
lbES-DIFFER-TC
lbDI-WATER-DELTA-TEMP
lbANALYZER-TC
lbBEMLINE-TC
Average Analog Readback On Last Batch
abTERMINAL- MEGOHMS
abGROUND- MEGOHMS
abTERMINAL- WATER- TEMP
abGROUND- WATER- TEMP
abCITY- WATER- TEMP
abSOURCE- PRESSURE
abSCANNER- PRESSURE
abCHAMBER- PRESSURE
abSOURCE- TURBO- SPEED
abSCANNER- TURBO- SPEED
abLEFT- CRYO- TEMP
abCHAMBER- CRYO- TEMP
abRIGHT- CRYO- TEMP
abLEFT- ELEVATOR- TC
abCHAMBER- CRYO- TC
abRIGHT- ELEVATOR- TC
abGAS
abG1- PRES

5019
5020
5021
5022
5023
5024
5025
5026
5027
5028
5029
5030
5031
5032
5033
5034
5035
5036
5037
5038
5039
5040
5041
5042
5043
5044
5045
5046
5047
5048
5049
5050
5051
5052
5053
5054
5055
5056
5057
5058
5059
5060
5061
5062
5063
5064
5065
5066
5067
5068
5069
5070
5071
5072
5073
5074
5075

hbG2- PRES
hbG3- PRES
hbG4- PRES
hbFIL- I
hbFIL- VOLTS
hbARC- I
hbRANGE- ARC
hbARC- VOLTS
hbMAG- I
hbEXT- VOLTS
hbEXT- I
hbSUP- VOLTS
hbSUP- I
hbX- AXIS
hbY- AXIS
hbZ- AXIS
hbAMU- I
hbAMU
hbBIAS
hbBEAM
hbBEAM- I- RANGE
hbMIR- VOLTS
hbMIR- I
hbMIR- SHUNT- I
hbQ1- I
hbQ2- I
hbDEFLECTOR
hbLENS- I
hbACCEL- VOLTS
hbACCEL- I
hbDEC- VOLTS
hbDEC- I
hbENERGY-PROBE
hbTARGET- BIAS
hbVAP- TEMP
hbCOOLING
hbeFIL- VOLTS
hbeFIL- I
hbeRPL- VOLTS
hbeEXT- VOLTS
hbeEXT- I
hbeTARGET- I
hbeBIAS- VOLTS
hbeBIAS- I
hbeSUP- VOLTS
hbANALYZER- PRESSURE
hbDRY- PUMP- TC
Not Used
hbMAG-VOLTS
hbQ1-VOLTS
hbQ2-VOLTS
hbLENS-VOLTS
hbeSECOND-I
hbHTR-TEMP
hbDECEL-VOLTS
hbDECEL-I
hbAMU-G

6019
6020
6021
6022
6023
6024
6025
6026
6027
6028
6029
6030
6031
6032
6033
6034
6035
6036
6037
6038
6039
6040
6041
6042
6043
6044
6045
6046
6047
6048
6049
6050
6051
6052
6053
6054
6055
6056
6057
6058
6059
6060
6061
6062
6063
6064
6065
6066
6067
6068
6069
6070
6071
6072
6073
6074
6075

abG2- PRES
abG3- PRES
abG4- PRES
abFIL- I
abFIL- VOLTS
abARC- I
abRANGE- ARC
abARC- VOLTS
abMAG- I
abEXT- VOLTS
abEXT- I
abSUP- VOLTS
abSUP- I
abX- AXIS
abY- AXIS
abZ- AXIS
abAMU- I
abAMU
abBIAS
abBEAM
abBEAM- I- RANGE
abMIR- VOLTS
abMIR- I
abMIR- SHUNT- I
abQ1- I
abQ2- I
abDEFLECTOR
abLENS- I
abACCEL- VOLTS
abACCEL- I
abDEC- VOLTS
abDEC- I
abENERGY-PROBE
abTARGET- BIAS
abVAP- TEMP
abCOOLING
abeFIL- VOLTS
abeFIL- I
abeRPL- VOLTS
abeEXT- VOLTS
abeEXT- I
abeTARGET- I
abeBIAS- VOLTS
abeBIAS- I
abeSUP- VOLTS
abANALYZER- PRESSURE
abDRY- PUMP- TC
Not Used
abMAG-VOLTS
abQ1-VOLTS
abQ2-VOLTS
abLENS-VOLTS
abeSECOND-I
abHTR-TEMP
abDECEL-VOLTS
abDECEL-I
abAMU-G

5076
5077
5078
5079
5080
5081
7001
7002
7003
7004
7005
7006
7007
7008
7009
7010
7011
7012
7013
7014
7015
7016
7017
7018
7019
7020
7021
7022
7023
7024
7025
7026
7027
7028
7029
7030
7031
7032
7033
7034
7035
7036
7037
7038
7039
7040
7041
7042
7043
7044
7045
7046
7047
7048
7049
7050

hbHELIUM-PRESSURE
hbTERM-DI-RETURN-TEMP
hbES-DIFFER-TC
hbDI-WATER-DELTA-TEMP
hbANALYZER-TC
hbBEMLINE-TC
Analog Readback Non-ACSII Format
TERMINAL- MEGOHMS
GROUND- MEGOHMS
TERMINAL- WATER- TEMP
GROUND- WATER- TEMP
CITY- WATER- TEMP
SOURCE- PRESSURE
SCANNER- PRESSURE
CHAMBER- PRESSURE
SOURCE- TURBO- SPEED
SCANNER- TURBO- SPEED
LEFT- CRYO- TEMP
CHAMBER- CRYO- TEMP
RIGHT- CRYO- TEMP
LEFT- ELEVATOR- TC
CHAMBER- CRYO- TC
RIGHT- ELEVATOR- TC
GAS
G1- PRES
G2- PRES
G3- PRES
G4- PRES
FIL- I
FIL- VOLTS
ARC- I
RANGE- ARC
ARC- VOLTS
MAG- I
EXT- VOLTS
EXT- I
SUP- VOLTS
SUP- I
X- AXIS
Y- AXIS
Z- AXIS
AMU- I
AMU
BIAS
BEAM
BEAM- I- RANGE
MIR- VOLTS
MIR- I
MIR- SHUNT- I
Q1- I
Q2- I
DEFLECTOR
LENS- I
ACCEL- VOLTS
ACCEL- I
DEC- VOLTS
DEC- I

6076
6077
6078
6079
6080
6081
8000
8001
8002

abHELIUM-PRESSURE
abTERM-DI-RETURN-TEMP
abES-DIFFER-TC
abDI-WATER-DELTA-TEMP
abANALYZER-TC
abBEMLINE-TC
Asyst and Ergospeed II SMIF Common Variables
SMIF Port Id
SMIF1 Controls
SMIF Tool

7051
7052
7053
7054
7055
7056
7057
7058
7059
7060
7061
7062
7063
7064
7065
7066
7067
7068
7069
7070
7071
7072
7073
7074
7075
7076
7077
7078
7079
7080
7081
8100
8101
8102
8103
8104
8105
8106
8107
8108
8109
8110
8111
8112
8113
8114
8115
8116
8117
8118
8119
8120
8121
8122
8123
8124

ENERGY-PROBE
TARGET- BIAS
VAP- TEMP
COOLING
eFIL- VOLTS
eFIL- I
eRPL- VOLTS
eEXT- VOLTS
eEXT- I
eTARGET- I
eBIAS- VOLTS
eBIAS- I
eSUP- VOLTS
ANALYZER- PRESSURE
DRY- PUMP- TC
Not Used
MAG-VOLTS
Q1-VOLTS
Q2-VOLTS
LENS-VOLTS
eSECOND-I
HTR-TEMP
DECEL-VOLTS
DECEL-I
AMU-G
HELIUM-PRESSURE
TERM-DI-RETURN-TEMP
ES-DIFFER-TC
DI-WATER-DELTA-TEMP
ANALYZER-TC
BEMLINE-TC
Left Asyst SMIF Variables
Left SMIF1 Full Status
Left SMIF1 Ctl Status
Left SMIF1 ARMTYPE
Left SMIF1 ARM_SW
Left SMIF1 COLST
Left SMIF1 COUNT
Left SMIF1 DIPSW
Left SMIF1 ELDN
Left SMIF1 ELPOS
Left SMIF1 ELUP
Left SMIF1 FUNC
Left SMIF1 GPST
Left SMIF1 HOMEST
Left SMIF1 LFUNC
Left SMIF1 MARMDN
Left SMIF1 MARMPOS
Left SMIF1 MARMUP
Left SMIF1 SWITCH MODE
Left SMIF1 MOT
Left SMIF1 MVSTAT
Left SMIF1 PIO_LOCK
Left SMIF1 PIO_LRDY
Left SMIF1 PIO_LU
Left SMIF1 PIO_URDY
Left SMIF1 PIP

8200
8201
8202
8203
8204
8205
8206
8207
8208
8209
8210
8211
8212
8213
8214
8215
8216
8217
8218
8219
8220
8221
8222
8223
8224

Right Asyst SMIF Variables
Right SMIF2 Full Status
Right SMIF2 Ctl Status
Right SMIF2 ARMTYPE
Right SMIF2 ARM_SW
Right SMIF2 COLST
Right SMIF2 COUNT
Right SMIF2 DIPSW
Right SMIF2 ELDN
Right SMIF2 ELPOS
Right SMIF2 ELUP
Right SMIF2 FUNC
Right SMIF2 GPST
Right SMIF2 HOMEST
Right SMIF2 LFUNC
Right SMIF2 MARMDN
Right SMIF2 MARMPOS
Right SMIF2 MARMUP
Right SMIF2 SWITCH MODE
Right SMIF2 MOT
Right SMIF2 MVSTAT
Right SMIF2 PIO_LOCK
Right SMIF2 PIO_LRDY
Right SMIF2 PIO_LU
Right SMIF2 PIO_URDY
Right SMIF2 PIP

8125
8126
8127
8128
8129
8130
8131
8132
8133
8134
8135
8136
8137
8138
8139
8140
8141
8314
8315
8316
8317
8318

Left SMIF1 PLDN
Left SMIF1 PLPOS
Left SMIF1 PRTST
Left SMIF1 RDYST
Left SMIF1 SWPOS
Left SMIF1 TLTDN
Left SMIF1 TLTPOS
Left SMIF1 TLTUP
Left SMIF1 XPOS
Left SMIF1 YPOS
Left SMIF1 Position
Left SMIF1 PIO Status
Left SMIF1 Wafer Map
Left SMIF1 Wafer Count
Left SMIF1 PLUP
Left SMIF1 ECV
Left SMIF1 ALED
Left Ergospeed II SMIF Variables
Left ErgoSMIF MDLN
Left ErgoSMIF SoftRev
Left ErgoSMIF Control State
Left ErgoSMIF Process State
Left ErgoSMIF PIO State

8225
8226
8227
8228
8229
8230
8231
8232
8233
8234
8235
8236
8237
8238
8239
8240
8241
8414
8415
8416
8417
8418

Right SMIF2 PLDN
Right SMIF2 PLPOS
Right SMIF2 PRTST
Right SMIF2 RDYST
Right SMIF2 SWPOS
Right SMIF2 TLTDN
Right SMIF2 TLTPOS
Right SMIF2 TLTUP
Right SMIF2 XPOS
Right SMIF2 YPOS
Right SMIF2 Position
Right SMIF2 PIO Status
Right SMIF2 Wafer Map
Right SMIF2 Wafer Count
Right SMIF2 PLUP
Right SMIF2 ECV
Right SMIF2 ALED
Right Ergospeed II SMIF Variables
Right ErgoSMIF MDLN
Right ErgoSMIF SoftRev
Right ErgoSMIF Control State
Right ErgoSMIF Process State
Right ErgoSMIF PIO State

Where Used: S1F3, S1F11, S1F12, S2F23, S2F33, S2F45, S2F46, S2F47, S2F48; S6F13, S6F18, S6F22

SVNAME -- Status Variable Name

Format: 20

Defined in the SVID table above.
Where Used: S1F12

TEXT -- A single line of characters.

Format: 20

Where Used: S10F1, S10F3, S10E5

TIAACK -- Equipment acknowledgement code, 1 byte

Format: 10

0 = everything correct
1 = too many SVIDs
2 = no more traces allowed
3 = invalid period
>3 = equipment specified error
4-63 reserved
Where Used: S2F24

TIACK -- Time Acknowledge Code, 1 byte

Format: 10

0 = OK
1 = Error, not done
2-63 = reserved
Where Used: S2F32

TID -- Terminal number, 1 byte

Format: 10

0 = single or main terminal
>0 = additional terminals at the same equipment
Where Used: S10F1, S10F3, S10F5, S10F7

TIME -- Time of day

Format: 20

FOR the Y2K feature
IF EC 289 (TIMEFORMAT ) = 0,
TIME is 12 bytes: yymmddhhmmss
ELSE IF EC 289 (TIMEFORMAT ) = 1,
TIME is 16 bytes: yyyymmddhhmmsscc
OTHERWISE:
TIME is 12 bytes: yymmddhhmmss
Where Used: S2F18

TOTSMP -- Total samples to be made

Format: 20, 3( ), 5( )

Where Used: S2F23

TRID -- Trace Request ID

Format: 20,.3( ), 5( )

Where Used: S2F23, S6F1

TSID - Material Port Number (ACH)

Format: 20

It designates the stage location of the automatic cassette handler. The stage is numbered from left to right facing the
equipment, 1 to 4.
Note: For Factory Automation Only
Where Used: S2F71 S2F71

UNITS -- Units Identifier

Format: 20

As allowed by E5 Section 9
Where Used: S1F12, S2F30, S2F48

UPPERDB - Upper Dead Band

Format: 20

A variable limit attribute which defines the upper boundary of the deadband of a limit. The value applies to a single limit
(LIMITID) for a specified VID. Thus, UPPERDB and LOWERDB as a pair define a limit.
Where used: S2F45, S2F48

V -- Variable data

Format: 20

Where Used: S6F11, S6F13

VLAACK -- Variable Limit Attribute Acknowledge Code, 1 byte

Format: 10

0 = Acknowledge, command will be performed
1 = Limit attribute definition error
2 = Cannot perform now
>2 = Other equipment-specific error
3-63 = Reserved
Where Used: S2F46

VID -- Variable ID

Format: 20, 3( ), 5( )

The variable id will be the identification of one of the three classes of identifications: data variable identification (DVID),
equipment constant identification (ECID), or status variable identification (SVID).
VID

Description

Class

1 – 99

Analog readback variables

SVID

(available for tracing)
100 - 199

Data variables (Implant and Machine Status)

DVID

(not available for tracing)
200 - 249

Data process program variables (Recipe)

DVID

(not available for tracing)
250 - 299

Equipment Constants

ECID

300 - 349

GEM compliant data variables

DVID

350 - 399

Equipment Constants

ECID

400 - 499

Status Variables (Pump Analog Readback)

SVID

500 - 599

GEM System data variables

DVID/ SVID

600 - 699

Data Variables (IQDP Status)
lowest analog readback SV value on last wafer

DVID

1001-1099
2001-2099
3001-3099

highest analog readback SV value on last wafer
average analog readback SV value on last wafer

SVID
SVID
SVID

4001-4099
5001-5099
6001-6099
7000-7099

lowest analog readback SV value on last batch
highest analog readback SV value on last batch
average analog readback SV value on last batch
Analog readback variables in a non-ASCII format.

SVID
SVID
SVID
SVID

(available for tracing)
8000-8099

Asyst and Ergospeed common SMIF Variables

SVID

8100-8199

Left Asyst SMIF Variables

SVID

8200-8299

Right Asyst SMIF Variables

SVID

8300-8399

Left Ergospeed SMIF Variables

SVID /DVID

8400-8499

Right Ergospeed SMIF Variables

SVID /DVID

Where Used: S1F3, S1F11, S1F12, S2F23, S2F33, S2F45, S2F46, S2F47, S2F48; S6F13, S6F18, S6F22

VNAME -- Variable Name

Format: 20

Variable names are defined in the VID table above. The name will be the name of one of the three classes of variables:
data variable name (DVNAME), equipment constant name (ECNAME), or status variable name (SVNAME).
Where Used: S1F3, S1F11, S1F12, S2F23

3.0 Message Detail
3.0 Message Detail
This section defines a number of specific functions in different streams to be used as the basis for the GEM
communications between Equipment and Host. The functions are defined in the form of transaction message pairs.
The transactions are described in a standard form, as defined by SEMI E5-95 section 7, which involves specification of
the number, name, single or multiple block, direction of communication, nature of reply required, description, variable
definition, and the detailed structure of the message in terms of lists and items. Double lines separate streams and single
lines separate transactions to aid in readability.
The functions are described in a standard form which involves specification of the number, name, single or multiple block,
direction of communication, nature of reply required, description, variable definition, and the detailed structure of the
message in terms of lists and items. Double lines separate streams, and single lines separate transactions to aid
readability.
The abbreviations used in each transaction are as follows:

Description: A description of the action generated by the function.

Structure: Detailed structure showing lists and defined items. Lists are denoted by a capital L followed by the length
separated by a comma. The individual elements in the list are numbered on separate lines. Nested lists are indented to
emphasize the structure. The detailed form of the items is given in the define section at the beginning of the transaction.
The symbols "<" and ">" are used to enclose each item in the structure data and imply that there is an item header. A
detailed description of each data item as well as a list of the allowable data formats can be found in the Data Item
Dictionary.
Exception: Special cases in the structure that have a different meaning.

SnFm+1 Name of function (same structure as above
(secondary)
except never with reply)

Stream 1 Equipment Status
This stream provides a means for exchanging information about the status of the equipment, including its current mode,
depletion of various consumable items, and the status of transfer operations.

S1F0 Abort Transaction (S1F0)

S,H<->E

Description:

Used in lieu of an expected reply to abort a transaction. Function 0 is defined in every stream and has the same meaning
in every stream.
Structure:

Header Only.

S1F1 Are You There Request (R)

S,H<->E,reply

Description:

Establishes if the equipment is on-line. A function 0 response to this message means the communication is inoperative. In
the equipment, a function 0 is equivalent to a timeout on the receive timer after issuing S1F1 to the host.
Structure:

Header only

S1F2 On Line Data (D)

S,H<->E

Description:

Data signifying that the equipment is alive.
Structure:
[1]

[1][2]

>
Exception:
This will not change the ON-LINE/OFF-LINE state of the Equipment. The Host sends a zero length list

to the Equipment.

S1F3 Selected Equipment Status Request (SSR)

S,H->E,reply

Description:

A request to the equipment to report selected values of its status.
Structure:

The following structure is approved for all item formats and should be used by all new implementations:

[1]
[1][1]
.
.
[1][n]


.
.

>

The following structure is included for compatibility with previous implementations and may only be used for items of
format 3 ( ) and 5 ( ):

[1] 

or



Exception:

A zero-length for list item [1] or item [1][x] means report all VIDs.

S1F4 Selected Equipment Status Data (SSD)

M,H<-E

Description:
The equipment reports the value of each SVID requested in the order requested. The host remembers the names of
values requested.
Structure:

[1]
[1][1]
.
.
[1][n]


.
.

>

Exceptions:

A zero length for item [1] means no response can be made. A zero-length for item [1][x], SVx, means that SVIDx does not
exist.

S1F11 Status Variable Namelist Request (SVNR)
Description:

A request to the equipment to identify certain status variables.

S,H->E,reply

Structure:

[1]
[1][1]
.
.
[1][n]


.
.

>

Exception:

A zero length for item [1] means report all VIDs.

S1F12 Status Variable Namelist Reply (SVNRR)

M,H<-E

Description:

The equipment reports to the host the name and units of the requested SV s.
Structure:

[1]
[1][1]
[1][1][1]
[1][1][2]
[1][1][3]




>
.
.



>

.
.
[1][n]
[1][n][1]
[1][n][2]
[1][n][3]
>

S1F13 Establish Communications Request (CR)

S,H<->E,reply

Description:

The purpose of this message is to provide a formal means of initializing communications at a logical application level both
on power-up and following a break in commuications. It should be the first message sent following any period where host
and Equipment SECS applications are unable to communicate. An attempt to send an Establish Communications
Request (S1F13) should be repeated at programmable intervals until an Establish Communications Acknowledge (S1F14)
is received within the transaction timeout period with an acknowledgement code accepting the establishment.
Structure:

[1]
[1][1]
[1][2]



>

Exception:

The host sends a zero-length list for item [1] to the equipment.

S1F14 Establish Communications Request Acknowledge (CRA)

S,H<->E

Description:
Accept or deny Establish Communications Request (S1F13). MDLN and SOFTREV are on-line data and are valid only if
COMMACK = 0.

Structure:

[1]
[1][1]
[1][2]
[1][2][1]
[1][2][2]


< L,2


>
>

Exception:

The host sends a zero-length for list item [1][2] to the equipment

S1F15 Request OFF-LINE (ROFL)

S,H->E,reply

Description:

The host requests that the equipment transition to the OFF-LINE state.
Structure:

Header only.

S1F16 OFF-LINE Acknowledge (OFLA)

S,H<-E

Description:

Acknowledge or error.
Structure:
[1] 

S1F17 Request ON-LINE (RONL)

S,H->E,reply

Description:

The host requests that the equipment transition to the ON-LINE state.
Structure:

Header only

S1F18 ON-LINE Acknowledge (ONLA)
Description:

S,H<-E

Acknowledge or error.
Structure:
[1] 

Stream 2 Equipment Control and Diagnostics
Messages which deal with control of the equipment from the host. This includes all remote operations and equipment selfdiagnostics and calibration but specifically excludes the control operations which are associated with material transfer
(see stream 4 ), loading of executive and boot programs (stream 8 ), and all file and operating system calls (stream 10
and stream 13 ).

S2F0 Abort Transaction

S,H<->E

Description:

Same form as S1F0

S2F13 Equipment Constant Request (ECR)

S,H->E,reply

Description:

Constants such as for calibration, servo gain, alarm limits, data collection mode and other values that are changed
infrequently can be obtained using this message.
Structure:

[1]
[1][1]
.
.
[1][n]

< L,n

.
.

>

The following structure is included for compatibility with previous implementations and may only be used for items of
format 3 ( ) and 5 ( ) :

[1] 

or



Exceptions:

A zero-length for list item [1] or item [1][x] means report all ECV 's according to a predefined order.

S2F14 Equipment Constant Data (ECD)
Description:

Data Response to S2F13 in the order requested.
Structure:

[1]
[1][1]



M,H<-E

[1][2]
.
.
[1][n]


.
.

>

Exceptions:

A zero-length for list item [1] means no response exists. A zero-length for list item [1][x], ECVx , means that ECIDx does
not exist.

S2F15 New Equipment Constant Send (ECS)

S,H->E,reply

Description:

Change one or more equipment constants.
Structure:

[1]
[1][1]
[1][1][1]
[1][1][2]



>

[1][2]
[1][2][1]
[1][2][2]



>

.
.
.
[1][n]
[1][n][1]
[1][n][2]

.
.
.


>
>

S2F16 New Equipment Constant Acknowledge (ECA)

S,H<-E

Description:

Acknowledge or error. If EAC contains a non-zero error code, the equipment should not change any of the ECIDs
specified in S2F15.
Structure:
[1] 
Note:
Equipment constants cannot be changed if the E220 is displaying either the GEM SETUP or ECO & OPTION,
and only can be changed when E220 is in the idle state. This is done to prevent conflict between operator and
Host attempting to modify the same equipment constant and prevent a change during implanting.

S2F17 Date and Time Request (DTR)

S,H<->E,reply

Description:

Useful to check equipment time base or for equipment to synchronize with the host time base.
Structure:

Header only.

S2F18 Data and Time Data (DTD)

S,H<->E

Description

Actual time data.
Structure:
[1] 

Max Characters
2

If a recipe is a multi-line recipe, #MULTIPLE indicates the number of implant iterations. Significant only if it is 2 or larger.

#WAFER

Format: 20
DVNAME
#WAFER

Class
DV

VID/DVID
121

UNITS
# w afers

Structure


Max Characters
2

Number of wafers on the side being reported at the start or end of a batch implant.



Max Characters
2

Tilt angle of the wafer relative to the ion beam in degrees.



Max Characters
4

Angle of rotation of the wafer flat or notch relative to the axis about which it is tilted in degrees.

A(LLOT)

Format: 20
DVNAME
A(LLOT)

Class
DV

VID/DVID
100

UNITS
none

Structure


Max Characters
16

The MID of the left cassette, or the expected MID.

A(RLOT)

Format: 20
DVNAME
A(RLOT)

Class
DV

VID/DVID
101

UNITS
none

Structure


Max Characters
16

The MID of the right cassette, or the expected MID.

a1OnBoardPumpStatus[0]

Format

: 20

DVNAME
a1OnBoardPumpStatus[0]

Class
DV

VID/DVID
605

UNITS
none

Structure


Max Characters
4

The on board target chamber pump status.

a1ESTurboCommStatus[0]
DVNAME
a1ESTurboCommStatus[0]

Format
Class
DV

VID/DVID
600

UNITS
none

Structure


: 20

Max Characters
4

The left end station turbo communication status.

a1ESTurboState[0]
DVNAME
a1ESTurboState[0]

Format
Class
DV

VID/DVID
601

UNITS
none

Structure


: 20

Max Characters
4

The left end station turbo state.

a1ESTurboCommStatus[1]
DVNAME
a1ESTurboCommStatus[1]

Format
Class
DV

VID/DVID
602

UNITS
none

Structure


: 20

Max Characters
4

The right end station turbo communication status.

a1ESTurboState[1]
DVNAME
a1ESTurboState[1]

Format
Class
DV

VID/DVID
603

UNITS
none

Structure


: 20

Max Characters
4

The right end station turbo state.

1OnBoardCommStatus
DVNAME
1OnBoardCommStatus

The on board communications status.

Format
Class
DV

VID/DVID
604

UNITS
none

Structure


: 20

Max Characters
4

a1OnBoardDelayRestart[0]
DVNAME
a1OnBoardDelayRestart[0]

Format
Class
DV

VID/DVID
610

UNITS
minutes

Structure


: 20

Max Characters
4

The on board target chamber pump delay restart in minutes.

a1OnBoardDelayStart[0]
DVNAME
a1OnBoardDelayStart[0]

Format
Class
DV

VID/DVID
609

UNITS
minutes

Structure


: 20

Max Characters
4

The on board target chamber pump delay start in minutes.

a1OnBoardExtendedPurge[0]
DVNAME
a1OnBoardExtendedPurge[0]

Format
Class
DV

VID/DVID
612

UNITS
minutes

Structure


: 20

Max Characters
4

The on board target chamber pump extended purge in minutes.

a1OnBoardFastRoughTest[0]
DVNAME
a1OnBoardFastRoughTest[0]

Format
Class
DV

VID/DVID
611

UNITS
seconds

Structure


: 20

Max Characters
4

The on board target chamber pump fast rough test in seconds.

a1OnBoardFirstStageTempSetpoint[0]
DVNAME
a1OnBoardFirstStageTempSetpoint[0]

Class
DV

Format
VID/DVID
618

UNITS
oK

Structure


: 20

Max Characters
4

The on board target chamber pump first stage temperature setpoint in Kelvin.

a1OnBoardPowerFailRecoveryTemp[0]
DVNAME
a1OnBoardPow erFailRecoveryTemp[0]

Class
DV

Format
VID/DVID
617

UNITS
oK

Structure


: 20

Max Characters
4

The on board target chamber pump power fail recovery temperature in Kelvin.

a1OnBoardPurgeValveStatus[0]
DVNAME
a1OnBoardPurgeValveStatus[0]

Format
Class
DV

VID/DVID
607

UNITS
none

Structure


: 20

Max Characters
4

The on board target chamber pump purge valve status.

a1OnBoardRegenStatus[0]
DVNAME
a1OnBoardRegenStatus[0]

Format
Class
DV

VID/DVID
606

UNITS
none

Structure


: 20

Max Characters
4

The on board target chamber pump regen status.

a1OnBoardRepurgeCycles[0]
DVNAME
a1OnBoardRepurgeCycles[0]

Format
Class
DV

VID/DVID
614

UNITS
none

Structure


: 20

Max Characters
4

The on board target chamber pump repurge cycles.

a1OnBoardRepurgeTime[0]
DVNAME
a1OnBoardRepurgeTime[0]

Format
Class
DV

VID/DVID
613

UNITS
minutes

Structure


: 20

Max Characters
4

The on board target chamber pump repurge time in minutes.

a1OnBoardRORCycles[0]
DVNAME
a1OnBoardRORCycles[0]

Format
Class
DV

VID/DVID
616

UNITS
none

Structure


: 20

Max Characters
4

The on board target chamber pump ROR cycles.

a1OnBoardRORLimit[0]

Format

: 20

DVNAME
a1OnBoardRORLimit[0]

Class
DV

VID/DVID
615

UNITS
microns

Structure


Max Characters
4

The on board target chamber pump ROR limit in microns.

a1OnBoardRoughValveStatus[0]
DVNAME
a1OnBoardRoughValveStatus[0]

Format
Class
DV

VID/DVID
608

UNITS
none

Structure


: 20

Max Characters
4

The on board target chamber pump rough valve status.

a1OnBoardSecondStageTempSetpoint[0]
DVNAME
a1OnBoardSecondStageTempSetpoint[0]

Class
DV

VID/DVID
619

Format
UNITS
oK

Structure


: 20

Max Characters
4

The on board target chamber pump second stage temperature setpoint in Kelvin.

a1OnBoardPumpStatus[1]
DVNAME
a1OnBoardPumpStatus[1]

Format
Class
DV

VID/DVID
620

UNITS
none

Structure


: 20

Max Characters
4

The on board left elevator pump status.

a1OnBoardRegenStatus[1]
DVNAME
a1OnBoardRegenStatus[1]

Format
Class
DV

VID/DVID
621

UNITS
none

Structure


: 20

Max Characters
4

The on board left elevator pump regen status.

a1OnBoardPurgeValveStatus[1]
DVNAME
a1OnBoardPurgeValveStatus[1]

Format
Class
DV

The on board left elevator pump purge valve status.

VID/DVID
622

UNITS
none

Structure


: 20

Max Characters
4

a1OnBoardRoughValveStatus[1]
DVNAME
a1OnBoardRoughValveStatus[1]

Format
Class
DV

VID/DVID
623

UNITS
none

Structure


: 20

Max Characters
4

The on board left elevator pump rough valve status.

a1OnBoardDelayStart[1]
DVNAME
a1OnBoardDelayStart[1]

Format
Class
DV

VID/DVID
624

UNITS
minutes

Structure


: 20

Max Characters
4

The on board left elevator pump delay start in minutes.

a1OnBoardDelayRestart[1]
DVNAME
a1OnBoardDelayRestart[1]

Format
Class
DV

VID/DVID
625

UNITS
minutes

Structure


: 20

Max Characters
4

The on board left elevator pump delay restart in minutes.

a1OnBoardFastRoughTest[1]
DVNAME
a1OnBoardFastRoughTest[1]

Format
Class
DV

VID/DVID
626

UNITS
seconds

Structure


: 20

Max Characters
4

The on board left elevator pump fast rough test in seconds.

a1OnBoardExtendedPurge[1]
DVNAME
a1OnBoardExtendedPurge[1]

Format
Class
DV

VID/DVID
627

UNITS
minutes

Structure


: 20

Max Characters
4

The on board left elevator pump extended purge in minutes.

a1OnBoardRepurgeTime[1]
DVNAME
a1OnBoardRepurgeTime[1]

Format
Class
DV

VID/DVID
628

UNITS
minutes

Structure


: 20

Max Characters
4

The on board left elevator pump repurge time in minutes.

a1OnBoardRepurgeCycles[1]
DVNAME
a1OnBoardRepurgeCycles[1]

Format
Class
DV

VID/DVID
629

UNITS
none

Structure


: 20

Max Characters
4

The on board left elevator pump repurge cycles.

a1OnBoardRORLimit[1]
DVNAME
a1OnBoardRORLimit[1]

Format
Class
DV

VID/DVID
630

UNITS
microns

Structure


: 20

Max Characters
4

The on board left elevator pump ROR limit in microns.

a1OnBoardRORCycles[1]
DVNAME
a1OnBoardRORCycles[1]

Format
Class
DV

VID/DVID
631

UNITS
none

Structure


: 20

Max Characters
4

The on board left elevator pump ROR cycles.

a1OnBoardPowerFailRecoveryTemp[1]
DVNAME
a1OnBoardPow erFailRecoveryTemp[1]

Class
DV

Format
VID/DVID
632

UNITS
oK

Structure


: 20

Max Characters
4

The on board left elevator pump power fail recovery temperature in Kelvin.

a1OnBoardFirstStageTempSetpoint[1]
DVNAME
a1OnBoardFirstStageTempSetpoint[1]

Class
DV

Format
VID/DVID
633

UNITS
oK

Structure


: 20

Max Characters
4

The on board left elevator pump first stage temperature setpoint in Kelvin.

a1OnBoardSecondStageTempSetpoint[1]

Format

: 20

DVNAME
a1OnBoardSecondStageTempSetpoint[1]

Class
DV

VID/DVID
634

UNITS
oK

Structure


Max Characters
4

The on board left elevator pump second stage temperature setpoint in Kelvin.

a1OnBoardPumpStatus[2]
DVNAME
a1OnBoardPumpStatus[2]

Format
Class
DV

VID/DVID
635

UNITS
none

Structure


: 20

Max Characters
4

The on board right elevator pump status.

a1OnBoardRegenStatus[2]
DVNAME
a1OnBoardRegenStatus[2]

Format
Class
DV

VID/DVID
636

UNITS
none

Structure


: 20

Max Characters
4

The on board right elevator pump regen status.

a1OnBoardPurgeValveStatus[2]
DVNAME
a1OnBoardPurgeValveStatus[2]

Format
Class
DV

VID/DVID
637

UNITS
none

Structure


: 20

Max Characters
4

The on board right elevator pump purge valve status.

a1OnBoardRoughValveStatus[2]
DVNAME
a1OnBoardRoughValveStatus[2]

Format
Class
DV

VID/DVID
638

UNITS
none

Structure


: 20

Max Characters
4

The on board right elevator pump rough valve status.

a1OnBoardDelayStart[2]
DVNAME
a1OnBoardDelayStart[2]

Format
Class
DV

VID/DVID
639

The on board right elevator pump delay start in minutes.

UNITS
minutes

Structure


: 20

Max Characters
4

a1OnBoardDelayRestart[2]
DVNAME
a1OnBoardDelayRestart[2]

Format
Class
DV

VID/DVID
640

UNITS
minutes

Structure


: 20

Max Characters
4

The on board right elevator pump delay restart in minutes.

a1OnBoardFastRoughTest[2]
DVNAME
a1OnBoardFastRoughTest[2]

Format
Class
DV

VID/DVID
641

UNITS
seconds

Structure


: 20

Max Characters
4

The on board right elevator pump fast rough test in seconds.

a1OnBoardExtendedPurge[2]
DVNAME
a1OnBoardExtendedPurge[2]

Format
Class
DV

VID/DVID
642

UNITS
minutes

Structure


: 20

Max Characters
4

The on board right elevator pump extended purge in minutes.

a1OnBoardRepurgeTime[2]
DVNAME
a1OnBoardRepurgeTime[2]

Format
Class
DV

VID/DVID
643

UNITS
minutes

Structure


: 20

Max Characters
4

The on board right elevator pump repurge time in minutes.

a1OnBoardRepurgeCycles[2]
DVNAME
a1OnBoardRepurgeCycles[2]

Format
Class
DV

VID/DVID
644

UNITS
none

Structure


: 20

Max Characters
4

The on board right elevator pump repurge cycles.

a1OnBoardRORLimit[2]
DVNAME
a1OnBoardRORLimit[2]

Format
Class
DV

VID/DVID
645

UNITS
microns

Structure


: 20

Max Characters
4

The on board right elevator pump ROR limit in microns.

a1OnBoardRORCycles[2]
DVNAME
a1OnBoardRORCycles[2]

Format
Class
DV

VID/DVID
646

UNITS
none

Structure


: 20

Max Characters
4

The on board right elevator pump ROR cycles.

a1OnBoardPowerFailRecoveryTemp[2]
DVNAME
a1OnBoardPow erFailRecoveryTemp[2]

Class
DV

Format
VID/DVID
647

UNITS
oK

Structure


: 20

Max Characters
4

The on board right elevator pump power fail recovery temperature in Kelvin.

a1OnBoardFirstStageTempSetpoint[2]
DVNAME
a1OnBoardFirstStageTempSetpoint[2]]

Class
DV

Format
VID/DVID
648

UNITS
oK

Structure


: 20

Max Characters
4

The on board right elevator pump first stage temperature setpoint in Kelvin.

a1OnBoardSecondStageTempSetpoint[2]
DVNAME
a1OnBoardSecondStageTempSetpoint[2]

Class
DV

VID/DVID
649

Format
UNITS
oK

Structure


: 20

Max Characters
4

The on board right elevator pump second stage temperature setpoint in Kelvin.

ACCEL/DECEL
DVNAME
ACCEL/DECEL

Format: 20
Class
DV

VID/DVID
222

UNITS
none

Structure


Max Characters
1

Energy mode; Accel if 0, Decel if 1.

ACH-STATUS

Format: 20

DVNAME
ACH-STATUS

Class
DV

VID/DVID
127

UNITS
none

Structure


Max Characters
5

Complete cassette status of automatic cassette handler(2 bytes)
stg1
1

stg2
1

2

1st byte
0
1
2
3
4
5
6
7
8

2

stg3
1

2

stg4
1

2

stg5
1

cassette status
stage available
agv to stage transition
load cassette at stage
stage to eq transition
load cassette at eq
eq to stage transition
unload cassette at stage
stage to agv
not in use

2

stg6
1

2nd byte
0
1
2

2

stg7
1

2

stg8
1

2

equipment status
stage available
lef t port
right port

Note: 2nd byte data of 2 (middle port) is not applicable to E220/E500. The stages, stg5 to stg8, are not applicable to
E220/E500.

ACTUAL-MID(LLOT)
DVNAME
ACTUAL-MID(LLOT)

Format
Class
DV

VID/DVID
160

UNITS
None

Structure


: 20

Max Characters
16

The actual cassette id read on the left side. In MID module terminology, this is the left EMID.

ACTUAL-MID(RLOT)
DVNAME
ACTUAL-MID(RLOT)

Format
Class
DV

VID/DVID
161

UNITS
None

Structure


: 20

Max Characters
16

The actual cassette id read on the right side. In MID module terminology, this is the right EMID.

aDOSE

Format:20
DVNAME
aDOSE

Class
DV

VID/DVID
113

UNITS
%

Structure


Max Characters
6

Dose on the last wafer as a percentage of the recipe dose. .

AlarmID

Format:3( ), 5( )

DVNAME
AlarmID

Class
DV

VID/DVID
502

UNITS
None

Structure
None

Max Characters
None

This variable is valid only upon the setting or clearing of an alarm condition and contains the current alarm identification
(ALID ), regardless of whether that alarm is enabled for reporting.

AlarmsEnabled

Format: 00

DVNAME

Class

VID/DVID

UNITS

AlarmsEnabled

DV

307

None

Structure

>

Max Characters

List of enabled alarms.
Contains the list of alarms (ALIDs) enabled for reporting (via Stream 5 ).

AlarmsSet

Format: 00
DVNAME

Class

VID/DVID

UNITS

AlarmsSet

DV

308

None

Structure

>

Max Characters

List of alarms set.
Contents of this variable is a list of alarms (ALIDs) currently in the UNSAFE (alarm set) state, regardless whether the
alarms are enabled for reporting.

alIqdpCommunicationsStatus[0]
DVNAME
alIqdpCommunicationsStatus[0]

Format
Class
DV

VID/DVID
652

UNITS
none

Structure


alIqdpPumpStatus[0]
DVNAME
alIqdpPumpStatus[0]

VID/DVID
653

UNITS
none

Structure


alIqdpPumpTemperature[0]
DVNAME
alIqdpPumpTemperature[0]

Max Characters
4

Format
Class
DV

VID/DVID
654

UNITS
oC

Structure


: 20

Max Characters
4

Format
Class
DV

: 20

: 20

Max Characters
4

alIqdpPumpPower[0]
DVNAME
alIqdpPumpPow er[0]

Format
Class
DV

VID/DVID
655

UNITS
kW

Structure


alIqdpPumpCurrent[0]
DVNAME
alIqdpPumpCurrent[0]

VID/DVID
656

UNITS
A

Structure


allqdpExhaustPressure[0]
DVNAME
alIqdpExhaustPressure[0]

Class
DV

VID/DVID
657

UNITS
Psi

Structure


VID/DVID
658

UNITS
none

Structure


alIqdpRunningTime[0]
DVNAME
alIqdpRunningTime[0]

VID/DVID
659

UNITS
hours

Structure


alIqdpOilLevel[0]
DVNAME
alIqdpOilLevel[0]

VID/DVID
660

UNITS
none

Structure


alIqdpBlowerStatus[0]
DVNAME
alIqdpBlow erStatus[0]

alIqdpBlowerOilLevel[0]

VID/DVID
661

UNITS
none

Structure


: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format

alIqdpWaterFlow[0]
DVNAME
alIqdpWaterFlow [0]

Max Characters
4

Format
Class
DV

: 20

: 20

Max Characters
4

Format

: 20

DVNAME
alIqdpBlow erOilLevel[0]

Class
DV

VID/DVID
662

UNITS
none

Structure


alIqdpBlowerMotorTemperature[0]
DVNAME
alIqdpBlow erMotorTemperature[0]

Class
DV

Format
VID/DVID
663

UNITS
oC

Structure


alIqdpBlowerPower[0]
DVNAME
alIqdpBlow erPow er[0]

Class
DV

VID/DVID
664

UNITS
kW

Structure


VID/DVID
665

UNITS
A

Structure


alIqdpCommunicationsStatus[1]
DVNAME
alIqdpCommunicationsStatus[1]

VID/DVID
666

UNITS
none

Structure


alIqdpPumpStatus[1]
DVNAME
alIqdpPumpStatus[1]

VID/DVID
667

UNITS
none

Structure


alIqdpPumpTemperature[1]
DVNAME
alIqdpPumpTemperature[1]

VID/DVID
668

UNITS
oC

Structure


alIqdpPumpPower[1]
DVNAME
alIqdpPumpPow er[1]

VID/DVID
669

UNITS
kW

Structure


: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format

alIqdpBlowerPhaseCurrent[0]
DVNAME
alIqdpBlow erPhaseCurrent[0]

Max Characters
4

: 20

Max Characters
4

alIqdpPumpCurrent[1]
DVNAME
alIqdpPumpCurrent[1]

Format
Class
DV

VID/DVID
670

UNITS
A

Structure


alIqdpExhaustPressure[1]
DVNAME
alIqdpExhaustPressure[1]

VID/DVID
671

UNITS
Psi

Structure


alIqdpWaterFlow[1]
DVNAME
alIqdpWaterFlow [1]

Class
DV

VID/DVID
672

UNITS
none

Structure


VID/DVID
673

UNITS
hours

Structure


alIqdpOilLevel[1]
DVNAME
alIqdpOilLevel[1]

VID/DVID
674

UNITS
none

Structure


alIqdpBlowerStatus[1]
DVNAME
alIqdpBlow erStatus[1]

VID/DVID
675

UNITS
none

Structure


alIqdpBlowerOilLevel[1]
DVNAME
alIqdpBlow erOilLevel[1]

VID/DVID
676

UNITS
none

Structure


: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format

alIqdpRunningTime[1]
DVNAME
alIqdpRunningTime[1]

Max Characters
4

Format
Class
DV

: 20

: 20

Max Characters
4

alIqdpBlowerMotorTemperature[1]
DVNAME
alIqdpBlow erMotorTemperature[1]

Class
DV

Format
VID/DVID
677

UNITS
oC

Structure


alIqdpBlowerPower[1]
DVNAME
alIqdpBlow erPow er[1]

VID/DVID
678

UNITS
kW

Structure


alIqdpBlowerPhaseCurrent[1]
DVNAME
alIqdpBlow erPhaseCurrent[1]

Class
DV

VID/DVID
679

UNITS
A

Structure


VID/DVID
680

UNITS
none

Structure


alIqdpPumpStatus[2]
DVNAME
alIqdpPumpStatus[2]

VID/DVID
681

UNITS
none

Structure


alIqdpPumpTemperature[2]
DVNAME
alIqdpPumpTemperature[2]

VID/DVID
682

UNITS
oC

Structure


alIqdpPumpPower[2]
DVNAME
alIqdpPumpPow er[2]

alIqdpPumpCurrent[2]

VID/DVID
683

UNITS
kW

Structure


: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format

alIqdpCommunicationsStatus[2]
DVNAME
alIqdpCommunicationsStatus[2]

Max Characters
4

Format
Class
DV

: 20

: 20

Max Characters
4

Format

: 20

DVNAME
alIqdpPumpCurrent[2]

Class
DV

VID/DVID
684

UNITS
A

Structure


alIqdpExhaustPressure[2]
DVNAME
alIqdpExhaustPressure[2]

Format
Class
DV

VID/DVID
685

UNITS
Psi

Structure


alIqdpWaterFlow[2]
DVNAME
alIqdpWaterFlow [2]

Class
DV

VID/DVID
686

UNITS
none

Structure


VID/DVID
687

UNITS
hours

Structure


alIqdpOilLevel[2]
DVNAME
alIqdpOilLevel[2]

VID/DVID
688

UNITS
none

Structure


alIqdpBlowerStatus[2]
DVNAME
alIqdpBlow erStatus[2]

VID/DVID
689

UNITS
none

Structure


alIqdpBlowerOilLevel[2]
DVNAME
alIqdpBlow erOilLevel[2]

VID/DVID
690

UNITS
none

Structure


alIqdpBlowerMotorTemperature[2]
DVNAME
alIqdpBlow erMotorTemperature[2]

Class
DV

UNITS
oC

Structure


: 20

Max Characters
4

Format
VID/DVID
691

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format
Class
DV

: 20

Max Characters
4

Format

alIqdpRunningTime[2]
DVNAME
alIqdpRunningTime[2]

Max Characters
4

: 20

Max Characters
4

alIqdpBlowerPower[2]
DVNAME
alIqdpBlow erPow er[2]

Format
Class
DV

VID/DVID
692

UNITS
kW

Structure


alIqdpBlowerPhaseCurrent[2]
DVNAME
alIqdpBlow erPhaseCurrent[2]

Max Characters
4

Format
Class
DV

VID/DVID
693

UNITS
A

Structure


aSCANS

: 20

: 20

Max Characters
4

Format:20
DVNAME
aSCANS

Class
DV

VID/DVID
114

UNITS
# scans

Structure


Max Characters
5

Number of mechanical scans used to implant the wafer. .

aXSIGMA

Format:20
DVNAME
aXSIGMA

Class
DV

VID/DVID
111

UNITS
%

Structure


Max Characters
5

The variation in dose across the wafer as measured by the traveling Faraday during beamscan setup.

aYSIGMA

Format:20
DVNAME
aYSIGMA

Class
DV

VID/DVID
115

UNITS
%

Structure


Max Characters
5

The uniformity controller keeps a record of the dose at each scan line position in Y. The line spacing is 0.1 in in normal
mode and 0.05 in in X compressed mode. At the end of an implant or when on hold it calculates the sigma of the array
of doses.

BATCH-END-TIME
DVNAME
BATCH-END-TIME

Format:20
Class
DV

VID/DVID
110

Implant end time for one batch in the format yymmddhhmmss.

UNITS
None

Structure


Max Characters
12

BATCH-HOLDS
DVNAME
BATCH-HOLDS

Format:20
Class
DV

VID/DVID
119

UNITS
# holds

Structure


Max Characters
3

Total number of normal hold conditions (retry conditions) during implant of the current batch. The units are the # of
normal holds.

BATCH-START-TIME
DVNAME
BATCH-START-TIME

Format:20
Class
DV

VID/DVID
109

UNITS

Structure


Max Characters
12

Implant start time for one batch in the format yymmddhhmmss.

BATCH_WAFERS_IMPLANTED
DVNAME
BATCH_WAFERS_IMPLANTED

Format
Class
DV

VID/DVID
174

UNITS
# w afers

Structure


: 20

Max Characters
3

Version Introduced 11.05.08
The number of wafers for the last batch that were completely or partially implanted with the specified recipe. When a
wafer that is partially implanted is on hold, this SVID will not be incremented. However, as soon as the implant is aborted,
these variables will be incremented to reflect the partially implanted wafer.

BEAM-WIDTH
DVNAME
BEAM-WIDTH

Format:20
Class
DV

VID/DVID
124

UNITS
mm

Structure


Max Characters
3

The width of the beam in the end station in units of millimeters.

BPTN

Format:20
DVNAME
BPTN

Class
DV

VID/DVID
128

UNITS

Structure


Max Characters
1

ACH stage number; ACH stage (port) is designated 1 to 4, left to right facing the equipment. Port information is no longer
supported for DVID 128 with V12 and greater. DVID 151 should be used to send port information instead of DVID 128.
BPTN is no longer supported in V12 since this is actually the port-id for an automatic cassette handler.

CHK-INT

Format:20
DVNAME
CHK-INT

Class
DV

VID/DVID
215

UNITS
minute

Structure


Max Characters
2

Checking interval. The E220 will recheck the uniformity across the wafer periodically to ensure against beam drift when
running long implants. CHK-INT is the time in minutes between checks. If the value is set to zero, checking will be
performed only between batches of wafers.

CLOCK

Format: 20
DVNAME
CLOCK

Class
DV

VID/DVID
305

UNITS
cs

Structure


Max Characters
16

The value of the equipment's internal clock. This is a format requirement only and does not imply a precision or accuracy.
Format: YYYYMMDDhhmmsscc
YYYY=Year
0000 to 9999
MM=Month
01 to 12
DD=Day
01 to 31
hh=Hour
00 to 23
mm=Minute
00 to 59
ss=Second
00 to 59
cc=Centisecond 00 to 99

ControlState
DVNAME
ControlState

Format: 51
Class
SV

VID/DVID
309

UNITS
None

Structure


Max Characters

This status variable contains the code which identifies the current control state of the equipment. When reported related to
a control state transition, its value should represent the state current after the transition.
1 = OFF-LINE/EQUIPMENT OFF-LINE
2 = OFF-LINE/ATTEMPT ON-LINE
3 = OFF-LINE/HOST OFF-LINE
4 = ON-LINE/LOCAL
5 = ON-LINE/REMOTE
6-63 Reserved

COOLING

Format:20
DVNAME
COOLING

Class
DV

VID/DVID
207

UNITS

Structure


Max Characters
3

Logical value = true if wafer cooling is to be used.

CSTATUS

Format: 20

DVNAME
CSTATUS

Class
DV

VID/DVID
129

UNITS

Structure


Max Characters
1

Cassette status at ACH stage; identical to the first byte of ACH-STATUS.

DATAID

Format
DVNAME
DATAID

Class
DV

VID/DVID
503

UNITS
None

Structure


: 54

Max Characters

The data ID for the most recent event report.

DI-WATER-FLOW
DVNAME
DI-WATER-FLOW

Format
Class
VID/DVID
UNITS
DV
175
None
Version Introduced 12.14

Structure


: 20

Max Characters
1

Terminal DI water flow.
Possible values are:
0 - insufficient flow
1 - sufficient flow

DOSE-CALIBRATION-FACTOR
DVNAME
DOSE-CALIBRATION-FACTOR

Format
Class
DV

VID/DVID
188

UNITS
%

Structure


: 20

Max Characters
5

The number is used to adjust the DOSE measurement system so that two ion implants with the same recipe (DOSE) will
result in the same DOSE on the wafer when measured by Prometrix or Thermawave.

DOSE-EXPONENT
DVNAME
DOSE-EXPONENT

Format: 20
Class
DV

VID/DVID
204

UNITS

Structure


Max Characters
2

Exponent of the desired dose.

DOSE-MANTISSA
DVNAME
DOSE-EXPONENT

Format
Class
DV

VID/DVID
203

UNITS
None

Structure


: 20

Max Characters
2

Mantissa of the desired dose.

ECO_SETTINGS
DV NA ME
ECO_SETTINGS

Format
Clas s
SV

V ID/DV ID
821

UNITS

Struc ture


: 20

Max Charac ters

Array of ECO Settings. The first byte corresponds to ECO 0 which is unused. The equipment screen may only show a
portion of the ECO settings, but there are actually 512 ECO settings slots allocated for future use. Available in V13.20

ENERGY

Format
DVNAME
ENERGY

Class
DV

VID/DVID
205

UNITS
KeV

Structure


: 20

Max Characters
3

The total ion energy in units of Kev. In the case of doubly charged ions (P ++, etc) this is twice the total voltage used.

ErgoSMIF Cassette in Gripper
DVNAME
Left ErgoSMIF Cassette in Gripper
Right ErgoSMIF Cassette in Gripper

Format
Class
DV
DV

VID/DVID
8309
8409

UNITS
None
None

Structure



: 51

Max Characters

Version Available : 11.07.06
Gripper Cassette Sensor
0 - no cassette in gripper
1 - cassette in gripper

ErgoSMIF Elevator State
DVNAME
Lef t ErgoSMIF Elevator State
Right ErgoSMIF Elevator State

Format
Class
DV
DV

VID/DVID
8303
8403

UNITS
None
None

Structure



: 51

Max Characters

Version Available : 11.07.06
ErgoSpeed Elevator State
0 - not at home position
1 - at home position

ErgoSMIF FFU State
DVNAME
Left ErgoSMIF FFU State
Right ErgoSMIF FFU State

Format
Class
DV
DV

VID/DVID
8313
8413

UNITS
None
None

Structure



: 51

Max Characters

Version Available : 11.07.06
Fan Filter Unit State (FFU)
0 - FFU not available
1 - FFU available

ErgoSMIF Gripper State
DVNAME
Lef t ErgoSMIF Gripper State
Right ErgoSMIF Gripper State

Format
Class
DV
DV

VID/DVID
8308
8408

UNITS
None
None

Structure



: 51

Max Characters

Version Available : 11.07.06
Gripper
0 - undefined
1 - closed
2 - open

ErgoSMIF Home State
DVNAME
Lef t ErgoSMIF Home State
Right ErgoSMIF Home State

Format
Class
DV
DV

VID/DVID
8306
8406

UNITS
None
None

Structure



: 51

Max Characters

Version Available : 11.07.06
Pneumatic Arm Position
0 - undefined
1 - at home
2 - at equipment position

ErgoSMIF Last Function
DVNAME
Left ErgoSMIF Last Function
Right ErgoSMIF Last Function

Format
Class
DV
DV

VID/DVID
8301
8401

UNITS
None
None

Structure



: 51

Max Characters

Version Available : 11.07.06
Last Function Completed. Refer to Infab ErgoSpeed SECS II Interface Specification for possible values.

ErgoSMIF Lock State
DVNAME
Left ErgoSMIF Lock State
Right ErgoSMIF Lock State

Format
Class
DV
DV

VID/DVID
8305
8405

UNITS
None
None

Version Available : 11.07.06

Structure



: 51

Max Characters

Pod Lock State
0 - undefined
1 - locked
2 - unlocked

ErgoSMIF Low Load
DVNAME
Lef t ErgoSMIF Low Load
Right ErgoSMIF Low Load

Format
Class
DV
DV

VID/DVID
8310
8410

UNITS
None
None

Structure



: 51

Max Characters

Version Available : 11.07.06
LowLoad Position
0 - not at load level
1 - at load level

ErgoSMIF Pneumatic Stroke State
DVNAME
Left ErgoSMIF Pneumatic Stroke State
Right ErgoSMIF Pneumatic Stroke State

Format

Class
DV
DV

VID/DVID
8307
8407

UNITS
None
None

Structure



: 51

Max Characters

Version Available : 11.07.06
Pneumatic Stroke
0 - undefined
1 - raised
2 - lowered

ErgoSMIF Pod Placed
DVNAME
Left ErgoSMIF Pod Placed
Right ErgoSMIF Pod Placed

Format
Class
DV
DV

VID/DVID
8304
8404

UNITS
None
None

Structure



: 51

Max Characters

Version Available : 11.07.06
Pod Presence
0 - not placed
1 - placed

ErgoSMIF Port Door State
DVNAME
Left ErgoSMIF Port Door State
Right ErgoSMIF Port Door State

Format
Class
DV
DV

VID/DVID
8311
8411

UNITS
None
None

Version Available : 11.07.06
Port Door State

Structure



: 51

Max Characters

1 - locked
2 - unlocked

ErgoSMIF Pressure State
DVNAME
Left ErgoSMIF Pressure State
Right ErgoSMIF Pressure State

Format
Class
DV
DV

VID/DVID
8312
8412

UNITS
None
None

Structure



: 51

Max Characters

Version Available : 11.07.06
Pressure State
0 - low pressure
1 - sufficient pressure

ErgoSMIF RCMD Compl State
DVNAME
Lef t ErgoSMIF RCMD Compl State
Right ErgoSMIF RCMD Compl State

Format
Class
DV
DV

VID/DVID
8302
8402

UNITS
None
None

Structure



: 52

Max Characters

Version Available : 11.07.06

Return code of last remote command
1 - Success
>1 - Error (return code)

cSCANS

Format:20
DVNAME
cSCANS

Class
DV

VID/DVID
112

UNITS
# scans

Structure


Max Characters
5

The number of mechanical scans that the beam scan setup program expects will be required to implant the wafer. .

ECLAMP-I

Format
DVNAME
ECLAMP-I

Class
DV

VID/DVID
194

UNITS
mA

Structure


: 20

Max Characters
4

Eclamp current in mA.

EST-VAC

Format

: 20

DVNAME
ENERGY

Class
DV

VID/DVID
212

UNITS
Torr

Structure


Max Characters
4

Maximum end station vacuum allowed during an implant as a multiple of 1E-7 Torr. For example, 500 would correspond
to 5E-5 Torr.

EventsEnabled

Format: 00

DVNAME

Class

VID/DVID

UNITS

EventsEnabled

DV

306

None

Structure

>

Max Characters

Contains the list of events (CEIDs) enabled for reporting (via Stream 6).

EventLimit

Format
DVNAME
EventLimit

Class
DV

VID/DVID
311

UNITS
none

Structure


: U1

Max Characters
1

Used with the Limits Monitoring capability, it contains the LIMITID of the limit reached or crossed by LimitVariable. Since
multiple zone transitions for a variable may occur simultaneously (e.g., due to identical limit definitions or a slow data
sampling rate), EventLimit has been defined to allow for a list of LIMITIDs.

EXPECTED-SLOT-MAP(LLOT)
DVNAME
EXPECTED-SLOT-MAP(LLOT)

Format
Class
DV

VID/DVID
156

UNITS

Structure


: 10

Max Characters
26

The MID Module expected slot map for the left side. The first Boolean b is for slot 1, the second for slot 2 … etc. When
there is no expected map, the variable is . For each b,0 = absent, 1 = present.

EXPECTED-SLOT-MAP(RLOT)
DVNAME
EXPECTED-SLOT-MAP(RLOT)

Format
Class
DV

VID/DVID
157

UNITS

Structure


: 10

Max Characters
26

The MID Module expected slot map for the right side. The first Boolean b is for slot 1, the second for slot 2 … etc. When
there is no expected map, the variable is . For each b,0 = absent, 1 = present.

EXPECTED-WID(LLOT)

Format

: 00

DVNAME

Class

VID/DVID

EXPECTED-WID(LLOT)

DV

158

UNITS

Structure

>

Max Characters

The MID Module expected wafer ids for the left side as specified in the WaferIDn parameter of the PPSELECT remote
command.

EXPECTED-WID(RLOT)

Format

DVNAME

Class

VID/DVID

EXPECTED-WID(RLOT)

DV

159

UNITS

Structure

>

: 00

Max Characters

The MID Module expected wafer ids for the right side as specified in the WaferIDn parameter of the PPSELECT remote
command.

CURRENT-WAFER-ID
DVNAME
CURRENT-WAFER-ID

Format
Class
DV

VID/DVID
166

UNITS

Structure


: 20

Max Characters
48

Wafer id of the wafer that is currently being implanted as specified in the MID module’s WaferIDn parameter of the
PPSELECT remote command.

EXTR-HV-TIME
DV NA ME
EXTR-HV -TIME

Format
Clas s
SV

V ID/DV ID
819

UNITS
hours

Struc ture


: 20

Max Charac ters
9

Accumulated number of hours the extraction power supply is on. The timer can be reset from the maintenance screen.
Available in V13.10

EXTRACTION
DVNAME
EXTRACTION

Format
Class
DV

VID/DVID
221

UNITS
.1 KeV

Structure


: 20

Max Characters
4

Extraction voltage; unit is 0.1 keV.

F-LEARNED

Format

: 20

DVNAME
F-LEARNED

Class
DV

VID/DVID
218

UNITS
.1 KeV

Structure


Max Characters
1

Parametric recipe marker. If a recipe is marked as learned in the implanter recipe directory, this field returns 1, otherwise
0.

FAUTO

Format
DVNAME
FAUTO

Class
DV

VID/DVID
126

UNITS
none

Structure


: 20

Max Characters
1

Factory automation status variable:
VALUE
DESCRIPTION
0
f actory automation of f or not installed, Host is of f -line.
f actory automation in manual mode
Host is on-line
ACH is not linked to E220/500, AGV is not used.
LPORT and RPORT are directly accessed by hand carried cassette or by ACH in Local Manual
Mode.
Cassette Load Complete buttons show n in HOST CONTROL screen. Button activation (pressing)
w ill cause E220 to send S4F69.
1
2
Reserved
f actory automation in semi auto mode :
Host is on-line
ACH is linked to E220/500, but AGV and parallel i/o are of f .
3
The operator places a cassette on ACH or removes it f rom ACH.
f ull auto mode
:Host is on-line
both ACH and AGV are linked
AGV perf orms material handling.
4

FLOOD

Format
DVNAME
FLOOD

Class
DV

VID/DVID
208

UNITS
degree

Structure


: 20

Max Characters
3

Logical value = true if the electron flood gun is to be used for the implant.

FLOOD-CURRENT
DVNAME
FLOOD-CURRENT

Format : 20
Class
DV

VID/DVID
225

UNITS
0.1 mA

Structure


Max Characters
4

Electron flood current; unit is 0.1 mA.

GAS/VAPOR

Format : 20

DVNAME
GAS/VAPOR

Class
DV

VID/DVID
220

UNITS
none

Structure


Max Characters
1

Ion source is gas if 0, vaporizer if 1.

GAS1_4_PM
DVNAME
GAS1_4_PM

Format
Class
DV

VID/DVID
150

UNITS
none

Structure


: 20

Max Characters
9

Sum of the total use times of Gasses 1-4 since the last periodic maintenance, expressed in hours and hundredths of
hours.

GAS1_4_TOTAL
DVNAME
GAS1_4_TOTAL

Format
Class
DV

VID/DVID
145

UNITS
none

Structure


: 20

Max Characters
9

Sum of the total use times of Gasses 1-4 expressed in hours and hudredths of hours.

GAS1_PM

Format
DVNAME
GAS1_PM

Class
DV

VID/DVID
146

UNITS
none

Structure


: 20

Max Characters
9

Total use time of Gas 1 since the last periodic maintenance, expressed in hours and hundredths of hours.

GAS1_TOTAL
DVNAME
GAS1_TOTAL

Format
Class
DV

VID/DVID
141

UNITS
none

Structure


: 20

Max Characters
9

Total use time of Gas 1 expressed in hours and hundredths of hours.

GAS2_TOTAL
DVNAME
GAS2_TOTAL

Format
Class
DV

VID/DVID
142

Total use time of Gas 2 expressed in hours and hundredths of hours.

UNITS
none

Structure


: 20

Max Characters
9

GAS2_PM

Format
DVNAME
GAS2_PM

Class
DV

VID/DVID
147

UNITS
none

Structure


: 20

Max Characters
9

Total use time of Gas 2 since the last periodic maintenance, expressed in hours and hundredths of hours.

GAS3_PM

Format
DVNAME
GAS3_PM

Class
DV

VID/DVID
148

UNITS
none

Structure


: 20

Max Characters
9

Total use time of Gas 3 since the last periodic maintenance, expressed in hours and hundredths of hours.

GAS3_TOTAL
DVNAME
GAS3_TOTAL

Format
Class
DV

VID/DVID
143

UNITS
none

Structure


: 20

Max Characters
9

Total use time of Gas 3 expressed in hours and hundredths of hours.

GAS4_PM

Format
DVNAME
GAS4_PM

Class
DV

VID/DVID
149

UNITS
none

Structure


: 20

Max Characters
9

Total use time of Gas 4 since the last periodic maintenance, expressed in hours and hundredths of hours.

GAS4_TOTAL
DVNAME
GAS4_TOTAL

Format
Class
DV

VID/DVID
144

UNITS
none

Structure


: 20

Max Characters
9

Total use time of Gas 4 expressed in hours and hundredths of hours.

GemSpoolFull
DVNAME
GemSpoolFull

Format
Class
DV

VID/DVID
514

If active, the entire spool file has been filled with messages.

UNITS
None

Structure


: 51

Max Characters

GemSpoolLoadSubstate
DVNAME
GemSpoolLoadSubstate

Format
Class
DV

VID/DVID
515

UNITS
None

Structure


: 51

Max Characters

Writes new equipment initiated promary messages to the spool file. The current state is kept in GemSpoolLoad
Substate and is one of the following:
6 – Spool Not Full – In this state, there is space in the spool file for writing new messages.
7 – Spool Full – In this state, the entire spool file has been filled with messages, and GWGEM is taking the appropriate
action.

GemSpoolState
DVNAME
GemSpoolState

Format
Class
DV

VID/DVID
513

UNITS
None

Structure


: 51

Max Characters

Status variable GemSpoolState contains the current state of the spool finite state machine
1 – Spool Inactive
2 – Spool Active

GemSpoolUnloadSubstate
DVNAME
GemSpoolUnloadSubstate

Format
Class
DV

VID/DVID
516

UNITS
None

Structure


: 51

Max Characters

Removes previously spooled equipment-initiated primary messages from the spool file and sends them to the host. The
current state is kept in GemSpoolUnloadSubstate and is one of the following:
5 – No Spool Output – In this state, no messages are being removed from the spool file.
4 – Transmit Spool – In this state, messages are being removed from the spool file and transmitted to the host.
3 – Purge Spool – In this state, the equipment is erasing its spool file and not transmitting the messages to the host.

HOST-CONTROL
DVNAME
HOST-CONTROL

VALUE
1
2
3
4

Format
Class
DV

VID/DVID
125

UNITS

Structure


: 20

Max Characters
1

DESCRIPTION
Ignore
Monitor
Control
Control w ith Implant

ID-VALIDATION(LLOT)

Format

: 51

DVNAME
ID-VALIDATION(LLOT)

Class
DV

VID/DVID
167

UNITS

Structure


Max Characters
33

MID module validation statuses on the left side are reported in the following format:

Each status variable validation will have one of the following values:
0 = empty
1 = exist
2 = validation failed
3 = validation pass

ID-VALIDATION(RLOT)
DVNAME
ID-VALIDATION(RLOT)

Format
Class
DV

VID/DVID
168

UNITS

Structure


: 51

Max Characters
33

MID module validation statuses on the right side. Same as ID-VALIDATION(LLOT).

IMPLANT-STEP-PROCESS-TIME
DVNAME
IMPLANT-STEP-PROCESS-TIME

Format
Class
DV

VID/DVID
814

UNITS
seconds

: 20

Structure
Max Characters

10

The time in seconds it took the latest implant step to complete. The last value is preserved and is only reset on software
reset. It reflects beam-on-wafer time and does not count implant-on-hold time.

ION-AMU

Format
DVNAME
ION-AMU

Class
DV

VID/DVID
202

The atomic weight of the ion or molecule used for the implant.

UNITS
AMU

Structure


: 20

Max Characters
3

ION-CHARGE
DVNAME
ION-CHARGE

Format
Class
DV

VID/DVID
211

UNITS
none

Structure


: 20

Max Characters
1

The charge state of the ion: 1 for singly charged, 2 for doubly charged implants. The E220 will set up for doubly charged
implants if the ENERGY exceeds the 200 KV rating of the implanter regardless of the value in ION-CHARGE.

ION-NAME

Format

DVNAME
FLOOD-CURRENT

Class
DV

VID/DVID
201

UNITS
none

Structure


: 20

Max Characters
2

The 2 character name of the ion to be used: Ar, B, As, etc. This name is used to search through the gas bottles and
vaporizer for the one with the correct species.

JOB_ID

Format
JOB_ID

DV

195

none



: 20

5

A job identifier automatically assigned by the equipment, but can also be assigned by the host. It identifies which job a
job-related event occurred on.

JOB_ID_LIST
DVNAME
JOB_ID_LIST

Format
Class
DV

VID/DVID
193

UNITS
none

Structure

>

: 20

Max Characters
5

A list of up to 5 jobs in the job queue that are not yet active. This is applicable if ECO 104 (Lineup job queue) is selected.

LEFT_WAFERS_IMPLANTED
DVNAME
LEFT_WAFERS_IMPLANTED

Format
Class
DV

VID/DVID
172

UNITS
# w afers

Structure


: 20

Max Characters
3

Version Introduced 11.05.08
The number of wafers in the left loadlock that were completely or partially implanted with the specified recipe in the last
batch. When a wafer that is partially implanted is on hold, this SVID will not be incremented. However, as soon as the
implant is aborted, these variables will be incremented to reflect the partially implanted wafer.

LimitVariable
DVNAME
LimitVariable

Format
Class
DV

VID/DVID
312

UNITS
none

Structure


: 54

Max Characters

This variable contains the VID for the variable whose value changed monitoring zones.

LMATERIAL-STATUS
DVNAME
LPORT-STATUS

Format
Class
DV

VID/DVID
154

UNITS
none

Structure


: 20

Max Characters
3

Side-specific material status for left side. Normal progression 0-1-2-3-0…
VALUE
0
1
2
3
255

DESCRIPTION
No material
Unprocessed material
Partially processed material
Fully processed material
Unknow n material status (lost records)

LOT

Format: 20
DVNAME
LOT

Class
DV

VID/DVID
120

UNITS
lot #

Structure


Max Characters
16

Lot number of side being reported on start or end batch or wafer reports.

LEFT-PPID

Format
DVNAME
LEFT-PPID

Class
DV

VID/DVID
227

UNITS
KeV

Structure


: U1

Max Characters
16

The 16 character name of the last recipe run on the left side.

lIqdpEnabled
DVNAME
lIqdpEnabled

lIqdpEndTask

Format
Class
DV

VID/DVID
651

UNITS
none

Structure


: 20

Max Characters
4

Format

: 20

DVNAME
lIqdpEndTask

Class
DV

VID/DVID
650

UNITS
none

Structure


LEFT-ELEV-SERVO-DAC
DVNAME
LEFT-ELEV-SERVO-DAC

Max Characters
4

Format
Class
DV

VID/DVID
801

UNITS
encoder cnts

Structure


: 20

Max Characters
8

Left elevator position in raw encoder counts.

LEFT-HANDLER-DAC
DVNAME
LEFT-HANDLER-DAC

Format
Class
DV

VID/DVID
805

UNITS
encoder cnts

Structure


: 20

Max Characters
8

Left handler position in raw encoder counts.

ECO_SETTINGS

Format

DV NA ME

Clas s

V ID/DV ID

ECO_SETTINGS

DV

821

UNITS

Struc ture


: 20

Max Charac ters
512

Array of ECO Settings. The first byte corresponds to ECO 0 which is unused. The equipment screen may only show a
portion of the ECO settings, but there are actually 512 ECO settings slots allocated for future use. Available in V13.20

LEFT-ORIENTER-DAC
DVNAME
LEFT-ORIENTER-DAC

Format
Class
DV

VID/DVID
803

UNITS
encoder cnts

Structure


: 20

Max Characters
8

Left orienter position in raw encoder counts.

LEFT-UPPER-ARM
DV NA ME
LEFT-UPPER-A RM

Format
Clas s
DV

V ID/DV ID
816

UNITS
enc oder c nts

Struc ture


: 20

Max Charac ters
8

Left upper arm position in raw encoder counts. Applicable only to Productivity Plus equipment and V12.50 and later.

LINE#

Format

: 20

DVNAME
LINE#

Class
DV

VID/DVID
813

UNITS
none

Structure


Max Characters
2

The current recipe line number being executed. This variable is reset to 1 on the next wafer.

LPORT

Format
DVNAME
LPORT

Class
DV

VID/DVID
130

UNITS
none

Structure


: 20

Max Characters
1

Left side port status
0 - cassette not present
1 - cassette present
2 - not in use
Note: When FAUTO is either 1 or 0, 0 indicates the port is ready for load cassette, 1 not ready.
LPORT is valid with the cassette sense option.

LPORT-STATUS
DVNAME
LPORT-STATUS

Format
Class
DV

VID/DVID
152

UNITS
none

Structure


: 20

Max Characters
3

Side-specific port status for left side: Normal progression 0-1-2-3-4-5-6-7-0
VALUE
0
1
2
3
4
5
6
7
255

DESCRIPTION
Port available
Load ready
Loading
Process ready
In process
Unload ready
Unloading
Ready f or pickup
Unknow n port status

LTAG-BATSTAT
DVNAME
LTAG-BATSTAT

Format
Class
VID/DVID
UNITS
DV
198
None
Version Introduced 12.14

Battery Status of the left Tag.
0 = Battery check pass
255 = Battery check fail
Data is valid only when linked with CEID 162

Structure


: 51

Max Characters

LWAF#

Format
DVNAME
LWAF#

Class
DV

VID/DVID
102

UNITS
# w afers

Structure


: 20

Max Characters
2

The number of wafers on the left side.

MIR-V

Format
DVNAME
MIR-V

Class
DV

VID/DVID
224

UNITS
0.1 keV

Structure


: 20

Max Characters
4

Mirror voltage; unit is 0.1 keV.

NUMBER_OF_SCANS
DVNAME
NUMBER_OF_SCANS

Format
Class
DV

VID/DVID
140

UNITS
none

Structure


: 20

Max Characters
6

Total number of wafer scans.

OP-NAME

Format
DVNAME
OP-NAME

Class
DV

VID/DVID
104

UNITS
none

Structure


: 20

Max Characters
6

The name of the operator running the implanter.

OPERATOR-ID
DVNAME
OPERATOR-ID

Format
Class
DV

VID/DVID
105

UNITS
none

Structure


: 20

Max Characters
6

The ID code of the operator.

OPTION_SETTINGS
DV NA ME
OPTION_SETTINGS

Format
Clas s
SV

V ID/DV ID
822

UNITS

Struc ture


: 20

Max Charac ters

Array of OPTION Settings. The first byte corresponds to OPTION 0 which is unused. The equipment screen may only
show a portion of the OPTION settings, but there are actually 512 OPTION settings slots allocated for future use.
Available in V13.20

PLATEN-TILT-DAC
DVNAME
PLATEN-TILT-DAC

Format
Class
DV

VID/DVID
807

UNITS
encoder cnts

Structure


: 20

Max Characters
8

Platen tilter position in raw encoder counts.

PLATEN-ROTATION-SENSOR-COUNT
DV NA ME
PLA TEN-ROTA TION-SENSOR-COUNT

Clas s
DV

Format
V ID/DV ID
818

UNITS
enc oder c nts

Struc ture


: 20

Max Charac ters
8

Accumulated rotation sensor counts for every rotation on the wafer ONLY while implanting. This means that no rotation
counts is accumulated for rotating platen movements done manually in INITIALIZATION or ES-MANUAL screens.
.Applicable only if OPTION 83 (Platen Movement Sensor) is selected. Available in V13.10

PORT-ID

Format: 20
DVNAME
PORT-ID

Class
DV

VID/DVID
151

UNITS
none

Structure


Max Characters
1

Event identification by port number (side). This DVID should be used with V12 and greater for sending port information.
VALUE
0
1
2
3

DESCRIPTION
Event is not side-related
Event occurred for lef t side
Event occurred for right side
Event occurred for both sides

PORT-STATUS
DVNAME
PORT-STATUS

Format: 20
Class
DV

VID/DVID
132

UNITS
none

Structure


Max Characters
5

PORT-STATUS is in a 2-byte format. Feedback from port sensors. If a sensor is "made" the associated bit in PORTSTATUS =1. If a sensor is not installed, the associated bit always = 0.

Pivot
Extended

Right Load Lock
Pivot
Door
Door
Not
Cassette Not
Retracted Opened
Closed
Used
Present
Used
7
6
5
4
3
2

Lef t Load Lock
Pivot
Pivot
Door
Door
Not
Cassette Not
Extended Retracted Opened
Closed
Used
Present
Used
15
14
13
12
11
10

Not
Used
1

0

Not
Used
9

8

PPChangeName
DVNAME
PPChangeName

Format
Class
DV

VID/DVID
301

UNITS
none

Structure


: 20

Max Characters
16

The PPID which was affected upon the event of the creation, editing, or deletion of a Process Program local to the
equipment.

PPChangeStatus
DVNAME
PPChangeStatus

Format
Class
DV

VID/DVID
300

UNITS
none

Structure


: 51

Max Characters

The action taken on the Process Program named in PPChangeName. This variable is valid upon the event of the creation,
editing, or deletion of a Process Program local to the equipment.
1 - Created
2 - Edited
3 - Deleted
4 - Learned
5-63 - Reserved

PPID

Format
DVNAME
PPID

Class
DV

VID/DVID
200

UNITS
none

Structure


: 20

Max Characters
16

The 16 character name of the last recipe run on the machine.

PPExecName
DVNAME
PPExecName

Format
Class
DV

VID/DVID
304

UNITS
none

Structure


: 20

Max Characters
16

The PPID(s) of the Process Program that is currently set up. Start of the beam setup updates this variable.

PREVIOUSCEID
DVNAME
PREVIOUSCEID

Format
Class
DV

PREVIOUSCEID is the most recent event report.

VID/DVID
504

UNITS
None

Structure


: 54

Max Characters

PreviousControlState
DVNAME
PreviousControlState

Format
Class
DV

VID/DVID
310

UNITS
none

Structure


: 51

Max Characters

1=Off-Line
5=On-Line (Remote)
4=On-Line (Local)

PreviousProcessState
DVNAME
PreviousProcessState

Format
Class
DV

VID/DVID
303

UNITS
none

Structure


: 51

Max Characters

The previous processing state of the equipment, before the most recent process state change. Values are the same as in
ProcessState.

ProcessState
DVNAME
ProcessState

Format
Class
DV

VID/DVID
302

UNITS
none

Structure


: 51

Max Characters

The current processing state of the equipment.
0=Not ready
1=Ready
2=Unused
3=Setting up
4=Implant ready
5=Implanting
6=Implant hold
7=Aborting
255=Unknown state

PURITY

Format: 20
DVNAME
PURITY

Class
DV

VID/DVID
223

UNITS
0.01

Structure


Max Characters
4

For E500 only; unit is 0.01.

Q-SOURCE

Format

: 20

DVNAME
Q-SOURCE

Class
DV

VID/DVID
216

UNITS
none

Structure


Max Characters
1

Obsolete.

QUEUE_FREE_SLOTS
DVNAME
QUEUE_FREE_SLOTS

Format
Class
VID/DVID
UNITS
DV
196
None
Version Introduced 12.20

Structure


: 20

Max Characters
2

Status variable #196 returns the number of job entries allowed from the host. As the lineup queue currently contains a
maximum of 5 entries, a value of 0 to 5 will be returned dependent upon the number of jobs currently contained in the
queue. A check of this ASCII SVID will allow the host to determine the number of jobs that can be sent to the tool.

QUEUE-FULL
DVNAME
QUEUE-FULL

Format
Class
DV

VID/DVID
171

UNITS
None

Structure


: 20

Max Characters
1

Version Introduced 12.10.21
Status variable #171 returns a value of 1 if the lineup queue is full.

REMOTE-CONTROL
DVNAME
REMOTE-CONTROL

Format
Class
DV

VID/DVID
122

UNITS
none

Structure


: 20

Max Characters
3

True if the E220 is in Host Control and will accept remote commands.

RIGHT-ELEV-SERVO-DAC
DVNAME
RIGHT-ELEV-SERVO-DAC

Format
Class
DV

VID/DVID
802

UNITS
encoder cnts

Structure


: 20

Max Characters
8

Right elevator position in raw encoder counts.

RIGHT-HANDLER-DAC
DVNAME
RIGHT-HANDLER-DAC

Format
Class
DV

Right handler position in raw encoder counts.

VID/DVID
806

UNITS
encoder cnts

Structure


: 20

Max Characters
8

RIGHT-ORIENTER-DAC
DVNAME
RIGHT-ORIENTER-DAC

Format
Class
DV

VID/DVID
804

UNITS
encoder cnts

Structure


: 20

Max Characters
8

Right orienter position in raw encoder counts.

RIGHT-ORIENTER-LIFTER-DAC
DVNAME
RIGHT-ORIENTER-LIFTER-DAC

Format
Class
DV

VID/DVID
809

UNITS
encoder cnts

Structure


: 20

Max Characters
8

Right orienter lifter position in raw encoder counts.

RIGHT-PPID
DVNAME
RIGHT-PPID

Format
Class
DV

VID/DVID
228

UNITS
none

Structure


: 20

Max Characters
16

The name of the recipe selected on the right side.

RIGHT-UPPER-ARM
DV NA ME
RIGHT-UPPER-A RM

Format
Clas s
DV

V ID/DV ID
817

UNITS
enc oder c nts

Struc ture


: 20

Max Charac ters
8

Left upper arm position in raw encoder counts. Applicable only to Productivity Plus equipment and V12.50 and later.

RIGHT_WAFERS_IMPLANTED
DVNAME
RIGHT_WAFERS_IMPLANTED

Format
Class
DV

VID/DVID
173

UNITS
# w afers

Structure


: 20

Max Characters
2

Version Introduced 11.05.08
The number of wafers in the right loadlock that were completely or partially implanted with the specified recipe in the last
batch. When a wafer that is partially implanted is on hold, this SVID will not be incremented. However, as soon as the
implant is aborted, these variables will be incremented to reflect the partially implanted wafer.

RMATERIAL-STATUS

DVNAME
RMATERIAL-STATUS

Class
DV

VID/DVID
155

UNITS
none

Structure


Max Characters
3

Side-specific material status for right side. Normal progression 0-1-2-3-0… See LMATERIAL-STATUS for values.

ROPINS-MOTOR-DAC
DVNAME
ROPINS-MOTOR-DAC

Format
Class
DV

VID/DVID
811

UNITS
encoder cnts

Structure


: 20

Max Characters
8

Ropins position in raw encoder counts.

ROTATING-PLATEN-DAC
DVNAME
ROTATING-PLATEN-DAC

Format
Class
DV

VID/DVID
810

UNITS
encoder cnts

Structure


: 20

Max Characters
8

Rotating platen position in raw encoder counts.

ROTATION#
DVNAME
ROTATION#

Format
Class
DV

VID/DVID
812

UNITS
none

Structure


: 20

Max Characters
2

The current rotation number being executed. This variable is reset to 1 on the next line of a multi-line recipe or the next
wafer.

RTAG-BATSTAT
DVNAME
RTAG-BATSTAT

Format
Class
VID/DVID
UNITS
DV
199
None
Version Introduced 12.14

Structure


: 51

Max Characters

Battery Status of the right Tag.
0 = Battery check pass
255 = Battery check fail
Data is valid only when linked with CEID 162

ROTATE

Format
DVNAME
ROTATE

Class
DV

VID/DVID
226

UNITS
# rotations

For rotating platen option only, this DVID displays the number of rotations.

Structure


: 20

Max Characters
2

RPORT

Format
DVNAME
RPORT

Class
DV

VID/DVID
131

UNITS
none

Structure


: 20

Max Characters
1

Right side port status
0 - cassette not present
1 - cassette present
2 - not in use
Note: When FAUTO is either 1 or 0, 0 indicates the port is ready for load cassette, 1 is not ready. RPORT is valid with the
cassette sense option.

RPORT-STATUS
DVNAME
RPORT-STATUS

Format
Class
DV

VID/DVID
153

UNITS
none

Structure


: 20

Max Characters
3

Side-specific port status for right side: Normal progression 0-1-2-3-4-5-6-7-0… See LPORT-STATUS for values.

RWAF#

Format
DVNAME
RWAF#

Class
DV

VID/DVID
103

UNITS
# w afers

Structure


: 20

Max Characters
2

The number of wafers on the right side.

SCANS

Format
DVNAME
SCANS

Class
DV

VID/DVID
206

UNITS
# scans

Structure


: 20

Max Characters
4

The minimum number of mechanical scans to be used for the implant.

SHUFFLE-MODE
DV NA ME
SHUFFLE-MODE

Format
Clas s
SV

Indicates the SHUFFLE-MODE the equipment is in.
0 – no shuffling
1 – left to right shuffle
2 – right to left shuffle

V ID/DV ID
815

UNITS
none

Struc ture


: 20

Max Charac ters
1

SOURCE-TIME
DV NA ME
SOURCE-TIME

Format
Clas s
SV

V ID/DV ID
820

UNITS
hours

Struc ture


: 20

Max Charac ters
9

Accumulated number of hours the filament power is on. The timer can be reset from the maintenance screen. Available
in V13.10

SPOOLCOUNT ACTUAL
DVNAME
SPOOLCOUNTACTUAL

Format
Class
DV

VID/DVID
511

UNITS
None

Structure


: 54

Max Characters
None

Used to keep a count of the messages actually contained in the equipment's spool area. Multi-block inquire/grant
messages are not spooled and not included in this count. Required for GEM compliance.

SPOOLCOUNTTOTAL
DVNAME
SPOOLCOUNTTOTAL

Format
Class
DV

VID/DVID
512

UNITS
None

Structure


: 54

Max Characters
None

Used to keep a count of the total number of primary messages directed to the spool, regardless of whether placed or
retained in the spool. Multi-block inquire/grant messages are not spooled and not included in this count.

SPOOLFULLTIME
DVNAME
SPOOLFULLTIME

Format
Class
DV

VID/DVID
510

UNITS
None

Structure
None

: 20

Max Characters
None

Contains the timestamp from the time the spool last became full. If the spool was not filled during the last spooling period,
this will contain a time value prior to the current SpoolStartTime.
Format: YYYYMMDDHHMMSSCC
YYYY=Year
0000 to 9999
MM=Month
01 to 12
DD=Day
01 to 31
HH=Hour
00 to 23
MM=Minute
00 to 59
SS=Second
00 to 59
CC=Centisecond
00 to 99

SPOOLSTARTTIME
DVNAME
SPOOLSTARTTIME

Format: 0, 10, 11, 20, 21, 3(), 4(), 5()
Class
DV

VID/DVID
509

Contains the timestamp from the time spooling last became active.

UNITS
None

Structure
None

Max Characters
None

Format: YYYYMMDDHHMMSSCC
YYYY=Year
0000 to 9999
MM=Month
01 to 12
DD=Day
01 to 31
HH=Hour
00 to 23
MM=Minute
00 to 59
SS=Second
00 to 59
CC=Centisecond
00 to 99

STATUS

Format
DVNAME
STATUS

VALUE
1
2
3
4
5
6

Class
DV

VID/DVID
117

UNITS
none

Structure


: 20

Max Characters
2

DESCRIPTION
standby
loading(pumping or ventng cassette)
ready(w aiting f or cassette)
beam setup
implanting
on hold

TAG-FILEDATA
DVNAME
TAG-FILEDATA

Format
Class
VID/DVID
UNITS
DV
197
None
Version Introduced 12.14

Structure


: 20

Max Characters
32757

This variable should be linked with CEID 161 to get the file data from the Tag on the side where the event occurred on.

TARGET-FARADAY-DAC
DVNAME
TARGET-FARADAY-DAC

Format
Class
DV

VID/DVID
800

UNITS
encoder cnts

Structure


: 20

Max Characters
8

Target faraday position in raw encoder counts.

TARGET-I

Format
DVNAME
TARGET-I

Class
DV

The integrated beam current in the end station.

VID/DVID
123

UNITS
amp

Structure


: 20

Max Characters
8

TransitionType
DVNAME
TransactionType

Format
Class
DV

VID/DVID
313

UNITS
none

Structure


: 51

Max Characters

Used with the Limits Monitoring capability, it defines the direction of the zone transition which has occurred.
0 - Transition from lower to upper zone.
1 - Transition from upper to lower zone.

W-TYPE

Format
DVNAME
W-TYPE

Class
DV

VID/DVID
217

UNITS
none

Structure


: 20

Max Characters
1

Specifies the flat configuration on the wafer to allow the implanter to confirm that the right kind of wafers are being run. In
addition, wafer type 5 is used for semitransparent wafers such as silicon on sapphire or LCD display on glass.

WAFER-END-TIME
DVNAME
WAFER-END-TIME

Format
Class
DV

VID/DVID
108

UNITS
none

Structure


: 20

Max Characters
12

Implant end time for wafer in the format yymmddhhmmss.

WAFER-HOLDS
DVNAME
WAFER-HOLDS

Format
Class
DV

VID/DVID
118

UNITS
# holds

Structure


: 20

Max Characters
2

Total number of normal hold conditions (retry conditions) during implant of the current wafer.

WAFER-NUMBER
DVNAME
WAFER-NUMBER

Format
Class
DV

VID/DVID
106

UNITS
# holds

Structure


: 20

Max Characters
3

Current wafer being implanted. For 25-wafer cassettes, wafer numbers 1 to 25 are on the left loadlock and 26 to 50 are
on the right. For 26-wafer cassettes, 1 to 26 are on the left and 27 to 52 are on the right.
If ECID 256 (FORMAT) bit 9 (counting from 0) is set, wafer numbers are sequential from 1 to 25 (or 26) on both sides.

WAFER-START-TIME

Format

: 20

DVNAME
WAFER-START-TIME

Class
DV

VID/DVID
107

UNITS
none

Structure


Max Characters
12

Implant start time for wafer in the format yymmddhhmmss.

WAFERS_IMPLANTED
DVNAME
WAFERS_IMPLANTED

Format
Class
DV

VID/DVID
139

UNITS
none

Structure


: 20

Max Characters
6

Total number of wafers implanted. This count is not reset every batch. This counter may be reset in the wafer/gas
metering screen.

WFR_CYC_PM_L/R
DVNAME
WFR_CYCL_PM_L/R

Format
Class
DV

VID/DVID
138

UNITS
none

Structure


: 20

Max Characters
6

Wafer cycles on the left and right sides since the last periodic maintenance.

WFR_CYC_PM_LEFT
DVNAME
WFR_CYCL_PM_LEFT

Format
Class
DV

VID/DVID
136

UNITS
none

Structure


: 20

Max Characters
6

Wafer cycles on the left side since the last periodic maintenance.

WFR_CYC_PM_RIGHT
DVNAME
WFR_CYCL_PM_RIGHT

Format
Class
DV

VID/DVID
137

UNITS
none

Structure


: 20

Max Characters
6

Wafer cycles on the right side since the last periodic maintenance.

WFR_CYC_TOT_L/R
DVNAME
WFR_CYCL_TOT_L/R

Format
Class
DV

Wafer cycles total for the left and right sides.

VID/DVID
135

UNITS
none

Structure


: 20

Max Characters
6

WFR_CYC_TOT_LEFT
DVNAME
WFR_CYCL_TOT_LEFT

Format
Class
DV

VID/DVID
133

UNITS
none

Structure


: 20

Max Characters
6

Wafer cycles total for the left side.

WFR_CYC_TOT_RIGHT
DVNAME
WFR_CYCL_TOT_RIGHT

Format
Class
DV

VID/DVID
134

UNITS
none

Structure


: 20

Max Characters
6

Wafer cycles total for the right side.

WHEREIS(LLOT)
DVNAME
WHEREIS(LLOT)

Format
Class
DV

VID/DVID
176

UNITS
none

Structure


: 34

Max Characters

Current location of each wafer on the left loadlock as tracked by the MID module. Values are as follows:
0 = unknown
1 = located in automation ready for locking
2 = located in automation ready to load to tool
3 = automation loading to tool loadlock
4 = located in the tool loadlock ready for readying
5 = located in the tool loadlock ready for processing
6 = tool processing
7 = tool finished processing
8 = located in the tool loadlock ready for returning
9 = located in the tool loadlock ready for unloading
10 = automation unloading from tool loadlock
11 = located in automation ready for unlocking
12 = located in automation ready for removal

WHEREIS(RLOT)
DVNAME
WHEREIS(RLOT)

Format
Class
DV

VID/DVID
177

UNITS
none

Structure


: 34

Max Characters

Current location of each wafer on the right loadlock as tracked by the MID module. Values are the same as in
WHEREIS(LLOT).

X-SIGMA

Format

: 20

DVNAME
X-SIGMA

Class
DV

VID/DVID
213

UNITS
0.01%

Structure


Max Characters
5

Maximum non-uniformity allowed across the wafer as measured during the scanner setup. Units are 0.1%.

ECID Variable Dictionary
Accel-mode

Format: 51
ECNAME
Accel-mode

CLASS
ECV

VID/ECID
259

Min. Value
0

Max. Value
1

Default Value
0

CEID’s 258, 259 and 260 are used for recipe conversion and should be treated as a set. They are only used when
PPBODY1 recipes are used on version 9 software. These conversion numbers are ignored when using PPBODY2.
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

ACHPORT_ENABLE

Format:54

ECNAME
ACHPORT_ENABLE

7

6

CLASS
ECV

5

4

VID/ECID
279

3
Port 4

Min. Value
None

2
Port 3

Default Value
None

LSB
0

1
Port 2

Max. Value
None

Port 1

15

14

13

12

11

10

9

8

23

22

21

20

19

18

17

16

31

30

29

28

27

26

25

24

MSB

0: Disabled
1: Enabled

Baud-Rate

Format: 54
ECNAME
Baud-Rate

CLASS
ECV

VID/ECID
267

Min. Value
150

Max. Value
19200

Default Value
9600

Default Baud rate of the communications port in bps.
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

BCR MODE

Format: : 54
ECNAME
BCR MODE

CLASS
ECV

VID/ECID
299

Min. Value

Max. Value

Default Value

Set to flag if the BCR is enabled on each side (left and/or right). Aside from being host configurable, the operator shall
be able to configure it in the Barcode Reader screen.
BCR Mode bits shall also be configurable using the GUI and its value shall be stored in permanent storage.
LSB

SYM
MSB

SYM

SYM

SYM

Field
LBCR

Description
Left Barcode Reader

RBCR

Right Barcode Reader

BCRTR

Barcode Reader Trigger
Specifies how Bar code
reading is triggered by the
operator.

MODEL

SYM

Note: in this document,
barcode reading for the
E500 always refers to
retracting the cassette and
reading the barcode.
Barcode Reader Model

Barcode Reader
Symbology

MODEL

BCRTR

RBCR

LBCR

MODEL

MODEL

MODEL

Value - Description
0 – Left BCR disabled
1 – Left BCR enabled
0 – Right BCR disabled
1 – Right BCR enabled
0 - BCR read after operator
touches LOAD (BCR Read)
button. (default)
1 - BCR automatically read after
cassette is sensed.
(Note: setting 1 will be
implemented in a future software
release. )
The following Barcode hardware
are supported:
0 - Sickoptic CLA430A (default)
0 – Code 39 (default)

Circuit Assurance
ECNAME
Circuit Assurance

Format: : 54
CLASS
ECV

VID/ECID
351

Min. Value
1

Max. Value
240

Default Value
15

This specifies the frequency (in seconds) at which the equipment will initiate the HSMS Linktest control transaction to
verify that the link is still functional. A smaller value means more frequent control messages. The equipment sends
Linktest transactions only during idle periods, when there is no normal Data Message traffic which indicates that the
connection remains functional. If you specify the value 0, the equipment initiates no Linktest transactions, and does
not verify that the link remains active.

CONFIGALARMS
ECNAME
CONFIGALARMS

Determines what alarm report is sent.
0: S5F1 (default)

Format:54
CLASS
ECV

VID/ECID
271

Min. Value
0

Max. Value
2

Default Value
0

1: S5F71
2: S5F73
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

CONFIGCONNECT
ECNAME
CONFIGCONNECT

Format:54
CLASS
ECV

VID/ECID
272

Min. Value
0

Max. Value
2

Default Value
2

Determines what message will be used to establish communications.
0: S1F1
1: S1F65
2: S1F13 (default).
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

CONFIGEVENTS
ECNAME
CONFIGEVENTS

Format:54
CLASS
ECV

VID/ECID
273

Min. Value
0

Max. Value
1

Default Value
1

Controls whether event reports are sent in S6F11/S6F13 GEM format or S6F3/S6F9 SECS format.
0: S6F3/S6F9
(SECS Format)
1: S6F11 /S6F13 (GEM Format)

Note: Default value is set when performing a
HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

CONNECT MODE
ECNA ME
CONNECT MODE

Format: : 54
CLA SS
ECV

V ID/ECID
292

Min. V alue

Max . V alue

Def ault V alue

Controls whether the equipment is the HSMS Active or Passive Entity .
0: HSMS Passive Entity
non-zero: HSMS Active Entity

CONNECTION ESTABLISHMENT
ECNAME
CONNECTION ESTABLISHMENT

Format: : 54
CLASS
ECV

VID/ECID
350

Min. Value
1

Max. Value
240

Default Value
10

For a Port configured as ACTIVE, this parameter specifies the maximum time in seconds the equipment will wait after
issuing a TCP/IP connect command without receiving success or failure status from TCP/IP, before the equipment gives

up and assumes the connect attempt has failed. For certain complex networks with many routers, this can be long.

DEVICENAME
ECNAME
DEVICENAME

Format: 20
CLASS
ECV

VID/ECID
269

Min. Value
asc_lo

Max. Value
asc_hi

Default Value
E220

Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

EC TIMEFORMAT
ECNAME
EC TIMEFORMAT

Format : 51
CLASS
ECV

VID/ECID
289

Min. Value
None

Max. Value
None

Default Value
None

This EC controls the date/time format for all applicable SECS II messages. See also TIME data item. Y2K feature.
0 - date/time format = YYMMDDHHMMSS
1 - date/time format = YYYYMMDDHHMMSSCC (Y2K compliant)

EQPORT_ENABLE
ECNAME
EQPORT_ENABLE

Format : 54
CLASS
ECV

VID/ECID
278

Min. Value
None

Max. Value
None

Default Value
None

1: Right Side Enabled
2: Left Side Enabled
3: Both Sides Enabled

Equipment-ID
ECNAME
Equipment-ID

Format: 54
CLASS
ECV

VID/ECID
268

Min. Value
0

Max. Value
32000

Default Value
0

Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

EQUIPMENT IP ADR
ECNAME
EQUIPMENT IP ADR

Format: : A
CLASS
ECV

VID/ECID
291

Min. Value

Max. Value

Default Value

The passive IP address which is always set to the equipment internet IP address. This is a requirement for the passive
(server) Connect Mode.

Format : 54

Establish-Comm-Timeout
ECNAME
Establish-Comm-Timeout

CLASS
ECV

VID/ECID
262

Min. Value
1

Max. Value
36000

Default Value
10

Establish communications timeout. The length of time in seconds of the interval between attempts to send S1F13 when
establishing communications.
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

Extraction-volts

Format: : 51

ECNAME
Extraction-volts

CLASS
ECV

VID/ECID
260

Min. Value
0

Max. Value
71

Default Value
0

CEID’s 258, 259 and 260 are used for recipe conversion and should be treated as a set. They are only used when
PPBODY1 recipes are used on version 9 software. These conversion numbers are ignored when using PPBODY2.
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

FACTAUTO

Format: : 54
ECNAME
FACTAUTO

CLASS
ECV

VID/ECID
263

Min. Value
0

Max. Value
4

Default Value
1

This equipment constant determines the factory automation configuration as follows:
0: Factory Automation is not installed
1: Host Communication is enabled, but no Cassette Handler or Automatic Guided Vehicle
2: Host Communication and Cassette Handler is enabled, no Automatic Guided Vehicle
3: All components of Factory Automation are enable, Host Commuication, Cassette Handler, and Automatic Guided
Vehicle.
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

FORMAT

Format: : 54
ECNAME
FORMAT

Report data format
MSB
10
bit 10
bit 9
I

CLASS
ECV

VID/ECID
256

Min. Value
0

Max. Value
32

Default Value
128

LSB
0
H

X

F

E

D

C

B

X

H : Set to one if a separate end of batch report is to be sent for each cassette in a batch when two cassettes are
implanted at the same time.

Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.
I : When set, ESPressure recipe parameter is in lo/target/hi/interlock format when used in formatted recipe
upload/download. When clear, ESPressure only has a target value.
Bit 9: When set, VID 106 (WAFER-NUMBER) shall be reported as 1 to 25 (26 for 26-wafer cassette) for both sides. The
right side shall NOT be reported as 25 (26 ) to 50 (52).
Bit 10: When set, the following variables shall report "NONE" when the value is blank:
VID 100 A(LLOT)
VID 101 A(RLOT)
VID 120 LOT
VID 200 PPID
VID 227 LEFT-PPID
VID 228 RIGHT-PPID
VID 304 PPExecName

GemConfigSpool
ECNAME
GemConf igSpool

Format
CLASS
ECV

VID/ECID
280

Min. Value
0

Max. Value
1

: 51

Default Value
None

1: Spooling Enabled
0: Spooling Disabled

GemInitCommState
ECNAME
GemInitCommState

Format: : 51
CLASS
ECV

VID/ECID
265

Min. Value
0

Max. Value
1

Default Value
0

Specifies the Equipment’s default communications state after power on.
0 – DISABLED
1 - ENABLED
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

GemInitControlState
ECNAME
GemInitControlState

Format : 51
CLASS
ECV

VID/ECID
266

Min. Value
0

Max. Value
2

Default Value
0

EQUIPMENT DEFAULT CONTROL STATE. Specifies the Equipment’s default control state after a power on.
0 - OFFLINE
1 - LOCAL
2 - REMOTE
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

GemMaxSpoolFileSize
ECNAME
GemMaxSpoolFileSize

Format : 54
CLASS
ECV

VID/ECID
281

Min. Value
None

Max. Value
None

Default Value
None

Maximum size of the spool file, default is 10000 units. Units depend upon the operating system call to create the file.

GemMaxSpoolTransmit
ECNAME
GemMaxSpoolTransmit

Format: 54
CLASS
ECV

VID/ECID
282

Min. Value
None

Max. Value
None

Default Value
None

The maximum number of messages which the equipment will transmit from the spool in response to an S6F23 "Transmit
Spooled Messages" request. If MaxSpoolTransmit is set to zero, no limit is placed on the messages sent from the spool.
Multi-block inquire/grant messages are not counted in this total.

GemMsgInterLv
ECNAME
GemMsgInterLv

Format : 51
CLASS
ECV

VID/ECID
285

Min. Value
0

Max. Value
1

Default Value
None

This EC enables/disables the message interleaving capability.
0: Disabled (default)
1: Enabled
Where Used: S2F15

GemOverWriteSpool
ECNAME
GemOverWriteSpool

Format: : 51
CLASS
ECV

VID/ECID
283

Min. Value
0

Max. Value
1

Default Value
None

This Equipment Constant is used to indicate to the equipment either to overwrite data in the spool area or to stop spooling
whenever the spool area limits are exceeded.
TRUE- to overwrite spooled data
FALSE - to stop spooling when limits exceeded

GemSpoolFileName
ECNAME
GemSpoolFileName

Format: : 20
CLASS
ECV

VID/ECID
284

This EC specifies which file to be used to hold the spooled data.

Min. Value
asc_lo

Max. Value
asc_hi

Default Value
SPOOL LOG

HEARTBEAT
ECNAME
HEARTBEAT

Format: : 54
CLASS
ECV

VID/ECID
277

Min. Value
None

Max. Value
None

Default Value
20

Length of delay in the range of 0 - 99 seconds, between the S1F1 being sent to the Host. Setting to 0 disables heartbeat.
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

GEMTASK LOG SIZE
ECNAME
GEMTAKSK LOG SIZE

Format : 54
CLASS
ECV

VID/ECID
288

Min. Value
None

Max. Value
None

Default Value
None

Version Introduced: 11.05.05
Logging files such as gemtask.log and forth.log continue to increase in size as the tool is run. The possibility exists that
logging files can increase until virtually all hard disk space is utilized. 11.05.05 will now automatically zip all logs including
machine.con. In order prevent filling the hard disk, only the last eight zipped logs files will be kept. The user is able to
determine the file size at which the zipping process begins through the specification of new equipment constant 288.
Setting EC288 to 4000000 limits gemtask.log and gemtask.old to 400K before compression. Compressed logs will be
kept in the c:\data directory under the file names logs1.zip – logs8.zip. In addition to automatic zipping of all log files,
gemtask.log now contains a time stamp as well as converting the SDR hex bytes to SML. To obtain current zip logs, the
following procedure must be used:
[If running, hit any key, type BYE to shutdown to TSX]
cd \tsxutil
copy gemtest.cmd gemtask.cmd
E220
[run a test that highlights the failure]
[hit any key]
BYE
[IF you go into TSX]
sy
[IF gemtask is running, note its {job-id} say 12 ]
DBSTOP {job-id}
[ENDIF]
ZIPLOGS
[ELSE]
[wait five minutes for the log caches to flush reboot by pushing reset button in back of the computer (e220.cmd
will automatically zip all logs)]
[ENDIF]
cd \tsxutil
copy gemrel.cmd gemtask.cmd
cd \data
[put a blank disk in drive a:]
copy LOGS1.ZIP
[email the factory LOGS1.ZIP]
Note: This ECID was changed from MAX-WAFERS in 11.05.05.

MemoryStall

Format: : 54

ECNAME
MemoryStall

CLASS
ECV

VID/ECID
353

Min. Value
1

Max. Value
240

Default Value
10

This limits how long (in seconds) the equipment will tolerate a situation where all equipment buffers are full and the
other end of the link attempts to send more data. If the MEMORY STALL timeout expires, the equipment will terminate
the connection, to avoid clogging the TCP/IP network.

MID-MODE

Format: : 54
ECNAME
MID-MODE

7
CWID

6
CEM

15
ICEM

5
CSM

14
ICWID

23

CLASS
ECV

AWI
13

ICCID
22

4

3
AW

12
WIZ

21

VID/ECID
286

2
ACI

11
STRT

20

Min. Value
0

10
WCC

19

LSB
0

1
AC

ESM
9

POD
18

Max. Value
0x1FFFF

8
CCID

17
CCIDJ

16
ICSM

MSB
31

30

29

28

27

26

25

24

Default Value
0

FIELD

ESM

AC

ACI
AW*
AWI*

CSM

CEM*

CWID*

CCID

POD*

WCC

STRT

WIZ*

ICCID

ICWID*

ICSM*

ICEM*

CCIDJ

DESCRIPTION

VALUE
1 - Enable SMIF slot map reader (User can also independently
enable reader using the GUI).
Enable SMIF Map
0 – Disable
1 - Allow operator EMID (actual cassette identif ication) input
w hen reader Fails.
0 - Do not allow operator (EMID) actual cassette input w hen
reader f ails.
Allow Operator EMID Input
1 - Allow operator to ignore EMID (actual cassette ID) reader
f ailures.
0 - Do not allow Operator to ignore EMID (actual cassette ID)
reader f ailures.
Allow Operator EMID Ignore
1 - Allow Operator w af er ID input w hen reader f ails.
Allow Operator Waf er ID Input 0 - Do not allow operator w af er ID input w hen reader f ails.
1 - Allow operator to ignore w af er ID reader f ailures.
Allow Operator Waf er ID Ignore 0 - Do not allow Operator to ignore w af er ID reader f ailures.
1 - Validate SMIF actual slot map against host expected slot
map.
Validate SMIF Slot Map
0 - Do not compare actual SMIF Slot Map.
1 - Validate equipment actual slot map against host expected
slot map.
Validate Equip Slot Map
0 - Do not validate equipment actual slot map.
1 - Validate the equipment actual w af er ID against the host
expected w af er ID.
Validate Waf er ID
0 - Do not validate equipment actual w af er ID.
1 - Validate the EMID (actual cassette id) against the MID
(expected cassette id).
0 - Do not validate EMID (actual cassette ID) against the MID
Check Material ID
(expected cassette ID).
1 - The host sends the PPSELECT or SetWaf erParameters
message w ith the MID af ter the cassette arrives at the
equipment. Validate the EMID (actual cassette ID) against the
MID (expected cassette ID) as soon as the MID (expected
cassette ID) is received.
0 - The host sends the PPSELECT or SetWaf erParameters
bef ore the cassette arrives at the equipment. Validate the
EMID (actual cassette ID) against the MID (expected cassette
ID) as soon as the EMID is received.
1 - Validate expected slot map against expected w af er.
Validate Host Expected Waf er 0 - Both a Waf er ID and Slot Map are invalid if both are
Parameters
received at the same time.
1 Send a START command as soon as all the EMID(actual
cassette id) are validated.
0 Do not Auto Start.
Note: If STRT is set, ECID 257 bit Y (smif autoload/unload)
Auto-Start
should be cleared and vice versa.
1 - Provide helpf ul Popups that tell the operator w hich buttons
to touch.
0 - Do not provide helpf ul Popups.
1 - Allow the operator to ignore the EMID (actual cassette id)
validation f ailure.
Operator Ignore CID
0 - Do not allow operator to ignore EMID validation f ailures.
Comparision
1 - Allow the operator to ignore the actual w af er id validation
f ailure.
0 - Do not allow operator to ignore actual w af er id validation
Operator Ignore WID
f ailures.
Comparison
1 - Allow the operator to ignore the SMIF slot map validation
f ailure.
Operator Ignore Smif Slot Map 0 - Do not allow operator to ignore SMIF slot map validation
f ailures.
Comparison
1 - Allow the operator to ignore the equipment slot map
validation f ailure.
Operator Ignore Equipment Slot 0 - Do not allow operator to ignore equipment slot map
validation f ailures.
Map Comparison
On MID/EMID mismatch:
1 - Discard job on MID/EMID mismatch and let the host issue
another PPSELECT.
0 - Retain job on MID/EMID mismatch so operator can place the
ID Mismatch Job Action

* These fields are reserved. They presently have no effect.
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

Mirror-mode

Format:

ECNAME
Mirror-mode

CLASS
ECV

VID/ECID
258

Min. Value
0

Max. Value
3

: 51

Default Value
0

CEID’s 258, 259 and 260 are used for recipe conversion and should be treated as a set. They are only used when
PPBODY1 recipes are used on version 9 software. These conversion numbers are ignored when using PPBODY2.
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

MODES

Format: : 54
ECNAME
MODES

7
C

6
N

15
Z

5
A

14
Y

23

CLASS
ECV

E
13

G
22

4

3
R

2

11
I

10

19
Bit 19

V
9

B
18

Bit 18

Max. Value
BIT 20
LSB
0

1
S

F

20
Bit 20

Min. Value
0

P

12
D

21

VID/ECID
257

8
X

17
Bit 17

16
Bit 16

MSB
31

30

29

28

27

26

Modes control bits

25

24

Default Value
1

BIT
Charac ter
V
S

BIT
Number
0
1

P
R
E

2
3
4

A

5

N

6

C
X

7
8

B
F

9
10

I
D

11
12

G

13

Y

14

Z

15

Bit 16

16

Bit 17

17

Bit 18

18

Bit 19

19

Bit 20

20

DESCRIPTION
Set to one to v ent automatic ally at the end of the implant.
Set to one to automatic ally s tart implanting af ter beams c an.
Set to one to s kip c as s ette remov al mes s age at the end of the batc h
proc es s ing.
Set to one to indic ate no operator ac c es s to Rec ipe and Lot f ields .
Set to one to indic ate A LID is a 4 by te integer.
Set to one to indic ate Equipment Sc heduling. Cleared to indic ate Hos t
Sc heduling. Not us ed in GEM.
Set to one to indic ate automatic s tart af ter S2F27 in Hos t Sc heduling
Mode. Not us ed in GEM.
Set to one to indic ate Ev ent Reports f or enabled ev ents 51, 52, 55,
and 56 are s ent to the Hos t.
Res erv ed.
Set to one to indic ate tw o additional rec ipe f ields , Beam Slit and Dos e
Calibration Fac tor, in PPBODY 2 MSB.
Set to one to s et orienter to notc h. Cleared to s et orienter to f lat.
Set to one to allow a mes s age w ith TID > 0 to s how on main
s c reenSet f or s upport of S10F5. Not us ed in GEM.
Set to one to s uppres s the Double Implant w arning mes s age.
Set to one to indic ate Chained Implant. If this bit is s et, the equipment
w ill not v ent automatic ally ev en if bit V is s et.
A utomatic ally unload to SMIF LPT af ter an implant and the door
opens ; ignore if there is no SMIF LPT.
Note: When MID module is in us e, if bit Y is s et, ECID 286 (MIDMode)
bit STRT s hould be c leared and v ic e v ers a.
If c lear, PPSELECT and STA RT remote c ommands w ill be ex ec uted
only if the E500 is in the HOST-CONTROL s c reen. If s et, thes e
c ommands w ill be ex ec uted in HOST-CONTROL, FULL A UTOMA TED
or manual BA TCH s c reens . (A pplic able only to V 11; not in V 12 and
new er s of tw are)
Set to one if S1F1 and S2F17 are s ent only the f irs t time eqpt is
s w itc hed to CONTROL mode and not ev ery time the HOST-CONTROL
button is touc hed in the MODE MENU s c reen.
Set to one to f orc e both s ides to report "mapping done" ev ent (ECID
39) s imultaneous ly .
Set to one if the S2F71 and S2F72 trans ac tion is v erif ied to be
s uc c es s f ul bef ore queueing the proc es s .
V ers ion Introduc ed: 12.11
Set to one to s w itc h c ontrol modes w ith the remote c ommands G0LOCA L and GO-REMOTE.
V ers ion Introduc ed: 12.14
If ECID=257 (MODES) bit 20 is s et, then a new PPSELECT s hall be
rejec ted and the E500 s hall NOT ov erw rite the LOTID and PPID of a
prev ious PPSELECT w hen the prev ious one has not s tarted
proc es s ing.
If the hos t has to ov erw rite the prev ious PPSELECT, it s hall hav e to
s end a PPCLEA R-LEFT and/or PPCLEA R-RIGHT f irs t bef ore s ending
the new PPSELECT.
ECID=257 (MODES) bit 20 s hall hav e no ef f ec t if ECO 104 (Job
Queue) is enabled.
V ers ion introduc ed: 12.15

In GEM, the A, N, I bits are ignored (bits 5, 6, and 11).
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

PASSIVE IP ADDRESS

Format: : A

ECNA ME
PA SSIV E IP A DDRESS

CLA SS
ECV

V ID/ECID
293

Min. V alue
N/A

Max . V alue
N/A

Def ault V alue
N/A

Specifies the IP Address at which the PASSIVE ENTITY waits for connection on this HSMS link. A typical TCP Port
Number is 5000.

PASSIVE TCP PORT
ECNAME
PASSIVE TCP PORT

Format: : 54
CLASS
ECV

VID/ECID
294

Min. Value
N/A

Max. Value
N/A

Default Value
N/A

Specifies the TCP Port Number at which the PASSIVE ENTITY waits for connection on this HSMS link. A typical TCP
Port Number is 5000. TCP Port 5001 is reserved for the Remote Recipe Editor, a separate option.

PPTF

Format: : 51
ECNAME
PPTF

CLASS
ECV

VID/ECID
264

Min. Value
0

Max. Value
1

Default Value
0

Process Program Transfer Format. Determines the type of process program transfer from the Equipment to the Host.
Both types are available from the Host to the Equipment.
0 - Unformatted
1 - Formatted.
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

Router

Format: : A
ECNAME
Router

CLASS
ECV

VID/ECID
356

Min. Value
N/A

Max. Value
N/A

Default Value
N/A

Used to define a route to access a host that is not directly connected to the equipment. This specifies the internet
address of the computer to which messages addressed to the host or to another intermediate computer on the path are to
be routed.

RPTYPE

Format: : 51
ECNAME
RPTYPE

CLASS
ECV

VID/ECID
270

Min. Value
None

Max. Value
None

Default Value
0

Controls whether Normal (S6F11) or Annotated (S6F13) event reports are used.
1: Annotated
0: Normal
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

RTY

Format: : 54
ECNAME
RTY

CLASS
ECV

VID/ECID
253

Min. Value
0

Max. Value
31

Default Value
3

SECS retry count
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

SMIF-MODE

Format : 54
ECNAME
SMIF-MODE

7

6

CLASS
ECV

5

4

VID/ECID
287

3

Min. Value
0

2
DMode2

Max. Value
0xFFFF

1

LSB
0
AutoLock

DMode1

15

14

13

12

11

10

9

8

23

22

21

20

19

18

17

16

31

30

29

28

27

26

25

24

Default Value
0

MSB

AutoLock:

1 - Lock Pod as soon as placed on Asyst/ErgospeedII SMIF
0 - Do not Lock Pod when placed on Asyst/ErgospeedII SMIF

On bootup, the Asyst/ErgospeedII SMIFs are configured based on Dmode1 and Dmode2 settings as follows:
Dmode2
0
0
1
1

Dmode1
0
1
0
1

Note: Default value is set when performing a
HOST_COMM_FACTORY_INIT as described in the software revision
release notes. DMode1 and DMode2 bits can be set in the Asyst or
ErgospeedII smif screens.

Submask

Format: : A
ECNAME
Submask

CLASS
ECV

VID/ECID
355

Min. Value
N/A

Max. Value
N/A

Default Value
N/A

Used to define a route to access a host that is not directly connected to the equipment. The value is used to determine
whether a message goes to a computer that is on the same subnet as the computer that sent the message. The standard

netmask for a class C network is 255.255.255.0 - basically the last octet, .0, says 'look here for the machine number, the
rest (255) is network number'.

T1

Format : 54
ECNAME
T1

CLASS
ECV

VID/ECID
250

Min. Value
1

Max. Value
100

Default Value
5

SECS T1 timer timeout in .1 seconds.
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

T2

Format: : 54
ECNAME
T2

CLASS
ECV

VID/ECID
251

Min. Value
2

Max. Value
250

Default Value
100

SECS T2 timer timeout in .1 seconds.
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

T3

Format : 54
ECNAME
T3

CLASS
ECV

VID/ECID
252

Min. Value
1

Max. Value
120

Default Value
45

SECS transaction timer timeout in seconds
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

T4

Format : 54
ECNAME
T4

CLASS
ECV

VID/ECID
254

Min. Value
1

Max. Value
120

Default Value
45

SECS II conversation timeout in seconds.
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

T5

Format: : 54
ECNAME
T5

CLASS
ECV

VID/ECID
295

Min. Value
1

Max. Value
240

Default Value
10

Connect Separation Timeout
Specifies the amount of time in seconds between successive attempts to connect to a given remote entry.

T6

Format: : 54
ECNA ME
T6

CLA SS
ECV

V ID/ECID
296

Min. V alue
1

Max . V alue
240

Def ault V alue
90

Control Transaction Timeout
Specifies the time which a control transaction may remain open before it is considered a communications failure.

T7

Format: : 54
ECNAME
T7

CLASS
ECV

VID/ECID
297

Min. Value
1

Max. Value
240

Default Value
10

NOT SELECTED Timeout
Time which a TCP/IP connection can remain in NOT SELECTED state (i.e., no HSMS activity) before it is considered a
communication failure.

T8

Format: : 54
ECNAME
T8

CLASS
ECV

VID/ECID
298

Min. Value
1

Max. Value
120

Default Value
5

Network Intercharacter Timeout
Maximum time between successive bytes of a single HSMS message which may expire before it is considered a
communications failure.

TimeoutGrace
ECNAME
TimeoutGrace

Format: : 54
CLASS
ECV

VID/ECID
352

Min. Value
1

Max. Value
240

Default Value
10

While the equipment is attempting to establish a connection, this specifies the ‘grace period’ (in seconds) during which
the equipment will accept message send operations and will cause messages to be buffered during connection
establishment. The TimeoutGrace interval ends with a timeout or successful connection establishment. If the
connection is successfully established within the TimeoutGrace interval, the messages will be sent. If a TimeoutGrace
timeout occurs, the buffered message will each be failed.

TYPE-RCP

Format : 54
ECNAME
TYPE-RCP

CLASS
ECV

VID/ECID
261

Min. Value
1

Determines the type of the PPBODY to be one of the following:

Max. Value
4

Default Value
1

1: PPBODY1 (48 bytes)
2: PPBODY2 short (66 bytes)
3: PPBODY2 long (242 bytes)
4:PPBODY3 (1518 bytes) The PPBODY returned with S7F6 will have the length specified by TYPE-RCP. If the PPID
requested in S7F5 was PPBODY inappropriate with TYPE-RCP, the zero length list is returned.
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

WBITS5

Format : 54
ECNAME
WBITS5

CLASS
ECV

VID/ECID
274

Min. Value
0

Max. Value
1

Default Value
1

Controls whether the alarm report is sent with a W-Bit of "0" or "1".
0 : No ACK
1 : ACK
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

WBITS6

Format : 54
ECNAME
WBITS6

CLASS
ECV

VID/ECID
275

Min. Value
0

Max. Value
1

Default Value
1

Controls whether the event report is sent with a W-Bit of "0" or "1".
0 : No ACK
1 : ACK
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

WBITS10

Format: : 54
ECNAME
WBITS10

CLASS
ECV

VID/ECID
276

Min. Value
0

Max. Value
1

Default Value
1

Determines whether the W-Bit is set for the S10F1 message from the E220.
0 : No ACK
1 : ACK
Note: Default value is set when performing a HOST_COMM_FACTORY_INIT as described in the software revision
release notes.

WriteStall

Format: : 54
ECNAME
WriteStall

CLASS
ECV

VID/ECID
354

Min. Value
1

Max. Value
240

Default Value
10

This limits how long (in seconds) the equipment will wait for TCP/IP to accept data the equipment is passing to TCP/IP.

If a WRITE STALL timeout occurs, TCP/IP has a problem and the equipment terminates the connection.

SVID Variable Dictionary
3.0 Variable Item Dictionary
This section defines variable items available to the Host for data collection.
Name: A unique mnemonic name for this variable data item. This name is provided for reference only.
Class: The variable data (V) type classification (SV , ECV , or DVVAL) of the item. Status values (SV's) always contain valid information,
while data values (DVVAL's) may only be valid upon the occurrence of a particular event. All equipment constants (ECV's)
are settable by the Host.
Format: The allowable item format codes which can be used for this variable data item.
IDThe variable data identification, VID.
Description: A description of the variable data item, with the meanings of specific values. Also, specify validity for item of class DVVAL.

3.1 Min, Max, Average Data Variables and non-ASCII
formatting
Status variables are organized according to the operator control "screen" on which they are displayed. The ASCII name
matches the name of the program variable from which the value is derived whenever possible.
Status variable ID’s from 1 to 99 are reserved for analog readback which the E220 monitors several times a second. The
maximum, minimum and average value of each status variable from 1 to 99 is calculated and stored for each wafer and
batch. The ID’s of these discrete variables is the status variable numeric ID plus a multiple of 1000. The name is the same
as the discrete variable name preceded by two characters. The first character indicates lowest/highest/average and the
second one indicates per-wafer/per-batch.
1000 lw
low est SV value on last w af er
2000 hw
highest SV value on last w af er
3000 aw
average SV value on last w af er
4000 lb
low est SV value on last batch
5000 hb
highest SV value on last batch
6000 ab
average SV value on last batch
For example:
ID
28
1028
2028
3028
4028
5028
6028

ASCII ID
EXT-VOLTS
lw EXT-VOLTS
hw EXT-VOLTS
aw EXT-VOLTS
lbEXT-VOLTS
hbEXT-VOLTS
abEXT-VOLTS

Description
Current Extraction Voltage
Low est Extraction Voltage on last w af er implant
Highest Extraction Voltage on last w af er implant
Average Extraction Voltage on last w af er implant
Low est Extraction Voltage on last batch implant
Highest Extraction Voltage on last batch implant
Average Extraction Voltage on last batch implant

The same offset value and two character prefix is used for all of the first 99 status variables. The calculated values should
be included in the end of wafer or end of batch event report. Otherwise they will be overwritten as soon as the next wafer
or batch starts. The variable item dictionary lists all the status variables that are available on the E200 by SVID number
and ASCII value.
Support for non-ASCII formatting is available for releases 11.05.05 and greater. These versions have added non ASCII
formatting for all traceable analog readback values.
70XX
Non-ASCII f ormat of Analog readback values
For example:
SVID
ASCII ID
Description
28
EXT-VOLTS
SVID ASCII formatting
7028
EXT-VOLTS
SVID non-ASCII f ormatting
The same offset value and two character prefix (70) is used for all of the first 99 status variables. The variable item
dictionary lists all the status variables that are available on the E200 by SVID number and ASCII value.

a1ESTurboSpeed[0]
SV NA ME
a1EST urboSpeed[0]

Format
Class
SV

V ID/SV ID
400

UNITS
KRP M

Structure


: 20

Max Characters
4

The left end station turbo speed in KRPM.

a1ESTurboNormalizedSpeed[0]
SV NA ME
a1EST urboNormalizedSpeed[0]

Format
Class
SV

V ID/SV ID
401

UNITS
%

Structure


: 20

Max Characters
2

The left end station turbo normalized speed.

a1ESTurboCurrent[0]
SV NA ME
a1EST urboCurrent [0]

Format
Class
SV

V ID/SV ID
402

UNITS
mA

Structure


: 20

Max Characters
4

The left end station turbo current in mA.

a1ESTurboVoltage[0]
SV NA ME
a1EST urboVolt age[0]

Format
Class
SV

V ID/SV ID
403

UNITS
V

Structure


: 20

Max Characters
3

The left end station turbo voltage.

a1ESTurboTempC[0]
SV NA ME
a1EST urboT empC[0]

Format
Class
SV

V ID/SV ID
404

UNITS
Co

Structure


: 20

Max Characters
3

The left end station turbo temperature in degrees C.

a1ESTurboLifeHR[0]
SV NA ME
a1EST urboLifeHR[0]

The left end station turbo life in hours.

Format
Class
SV

V ID/SV ID
405

UNITS
hours

Structure


: 20

Max Characters
4

a1ESTurboCycles[0]
SV NA ME
a1EST urboCycles[0]

Format
Class
SV

V ID/SV ID
406

UNITS
none

Structure


: 20

Max Characters
4

The left end station turbo cycles.

a1ESTurboCycleTimeMIN[0]
SV NA ME
a1EST urboCycleT imeMIN[0]

Format
Class
SV

V ID/SV ID
407

UNITS
Minut es

Structure


: 20

Max Characters
4

The left end station turbo cycle time in minutes.

a1ESTurboSpeed[1]
SV NA ME
a1EST urboSpeed[1]

Format
Class
SV

V ID/SV ID
408

UNITS
KRP M

Structure


: 20

Max Characters
4

The right end station turbo speed in KRPM.

a1ESTurboNormalizedSpeed[1]
SV NA ME
a1EST urboNormalizedSpeed[1]

Format
Class
SV

V ID/SV ID
409

UNITS
%

Structure


: 20

Max Characters
2

The right end station turbo normalized speed.

a1ESTurboCurrent[1]
SV NA ME
a1EST urboCurrent [1]

Format
Class
SV

V ID/SV ID
410

UNITS
mA

Structure


: 20

Max Characters
4

The right end station turbo current in mA.

a1ESTurboVoltage[1]
SV NA ME
a1EST urboVolt age[1]

The right end station turbo voltage.

Format
Class
SV

V ID/SV ID
411

UNITS
V

Structure


: 20

Max Characters
3

a1ESTurboTempC[1]
SV NA ME
a1EST urboT empC[1]

Format
Class
SV

V ID/SV ID
412

UNITS
Co

Structure


: 20

Max Characters
3

The right end station turbo temperature in degrees C.

a1ESTurboLifeHR[1]
SV NA ME
a1EST urboLifeHR[1]

Format
Class
SV

V ID/SV ID
413

UNITS
Hours

Structure


: 20

Max Characters
4

The right end station turbo life in hours.

a1ESTurboCycles[1]
SV NA ME
a1EST urboCycles[1]

Format
Class
SV

V ID/SV ID
414

UNITS
none

Structure


: 20

Max Characters
4

The right end station turbo cycles.

a1ESTurboCycleTimeMIN[1]
SV NA ME
a1EST urboCycleT imeMIN[1]

Format
Class
SV

V ID/SV ID
415

UNITS
Minut es

Structure


: 20

Max Characters
4

The right end station turbo cycle time in minutes.

a1OnBoardRegenStep[0]
SV NA ME
a1OnBoardRegenSt ep[0]

Format
Class
SV

V ID/SV ID
416

UNITS
none

Structure


: 20

Max Characters
4

The on board target chamber pump regen step number.

a1OnBoardFirstStageTemp[0]
SV NA ME
a1OnBoardFirst St ageT emp[0]

Format
Class
SV

V ID/SV ID
417

The on board target chamber pump first stage temperature in Kelvin.

UNITS
Ko

Structure


: 20

Max Characters
3

a1OnBoardSecondStageTemp[0]
SV NA ME
a1OnBoardSecondSt ageT emp[0]

Class
SV

Format
V ID/SV ID
418

UNITS
Ko

Structure


: 20

Max Characters
3

The on board target chamber pump second stage temperature in Kelvin.

a1OnBoardTcGaugePress[0]
SV NA ME
a1OnBoardT cGaugeP ress[0]

Format
Class
SV

V ID/SV ID
419

UNITS
microns

Structure


: 20

Max Characters
4

The on board target chamber pump thermocouple gauge pressure in microns.

a1OnBoardTotalOperatingTime[0]
SV NA ME
a1OnBoardT ot alOperat ingT ime[0]

Class
SV

Format
V ID/SV ID
420

UNITS
hours

Structure


: 20

Max Characters
4

The on board target chamber pump total operating time in hours.

a1OnBoardTempSinceLastFullRegen[0]
SV NA ME
a1OnBoardT empSinceLast FullRegen[0]

Class
SV

V ID/SV ID
421

Format
UNITS
hours

Structure


: 20

Max Characters
3

The on board target chamber pump time since the last full regen in hours.

a1OnBoardTempSinceLastFastRegen[0]
SV NA ME
a1OnBoardT empSinceLast Fast Regen[0]

Class
SV

V ID/SV ID
422

Format
UNITS
hours

Structure


: 20

Max Characters
4

The on board target chamber pump time in hours.

a1OnBoardBasePressure[0]
SV NA ME
a1OnBoardBaseP ressure[0]

Format
Class
SV

V ID/SV ID
423

The on board target chamber pump base pressure in microns.

UNITS
microns

Structure


: 20

Max Characters
4

a1OnBoardRegenStep[1]
SV NA ME
a1OnBoardRegenSt ep[1]

Format
Class
SV

V ID/SV ID
424

UNITS
none

Structure


: 20

Max Characters
4

The on board left elevator pump regen step number.

a1OnBoardFirstStageTemp[1]
SV NA ME
a1OnBoardFirst St ageT emp[1]

Format
Class
SV

V ID/SV ID
425

UNITS
Ko

Structure


: 20

Max Characters
3

The on board left elevator pump first stage temperature in Kelvin.

a1OnBoardSecondStageTemp[1]
SV NA ME
a1OnBoardSecondSt ageT emp[1]

Class
SV

Format
V ID/SV ID
426

UNITS
Ko

Structure


: 20

Max Characters
3

The on board left elevator pump second stage temperature in Kelvin.

a1OnBoardTcGaugePress[1]
SV NA ME
a1OnBoardT cGaugeP ress[1]

Format
Class
SV

V ID/SV ID
427

UNITS
microns

Structure


: 20

Max Characters
4

The on board left elevator pump thermocouple gauge pressure in microns.

a1OnBoardTotalOperatingTime[1]
SV NA ME
a1OnBoardT ot alOperat ingT ime[1]

Class
SV

Format
V ID/SV ID
428

UNITS
hours

Structure


: 20

Max Characters
4

The on board left elevator pump total operating time in hours.

a1OnBoardTempSinceLastFullRegen[1]
SV NA ME
a1OnBoardT empSinceLast FullRegen[1]

Class
SV

V ID/SV ID
429

The onboard left elevator pump total operating time in hours.

Format
UNITS
hours

Structure


: 20

Max Characters
4

a1OnBoardTempSinceLastFastRegen[1]
SV NA ME
a1OnBoardT empSinceLast Fast Regen[1]

Class
SV

V ID/SV ID
430

Format
UNITS
hours

Structure


: 20

Max Characters
4

The on board left elevator pump time since the last fast regen in hours.

a1OnBoardBasePressure[1]
SV NA ME
a1OnBoardBaseP ressure[1]

Format
Class
SV

V ID/SV ID
431

UNITS
micron

Structure


: 20

Max Characters
4

The on board left elevator pump base pressure in microns.

a1OnBoardRegenStep[2]
SV NA ME
a1OnBoardRegenSt ep[2]

Format
Class
SV

V ID/SV ID
432

UNITS
none

Structure


: 20

Max Characters
4

The on board right elevator pump regen step.

a1OnBoardFirstStageTemp[2]
SV NA ME
a1OnBoardFirst St ageT emp[2]

Format
Class
SV

V ID/SV ID
433

UNITS
Ko

Structure


: 20

Max Characters
3

The on board right elevator pump first stage temperature in Kelvin.

a1OnBoardSecondStageTemp[2]
SV NA ME
a1OnBoardSecondSt ageT emp[2]

Class
SV

Format
V ID/SV ID
434

UNITS
Ko

Structure


: 20

Max Characters
3

The on board right elevator pump second stage temperature in Kelvin.

a1OnBoardTcGaugePress[2]
SV NA ME
a1OnBoardT cGaugeP ress[2]

Format
Class
SV

V ID/SV ID
435

UNITS
micron

The on board right elevator pump thermocouple gauge pressure in microns.

Structure


: 20

Max Characters
4

a1OnBoardTotalOperatingTime[2]
SV NA ME
a1OnBoardT ot alOperat ingT ime[2]

Class
SV

Format
V ID/SV ID
436

UNITS
hours

Structure


: 20

Max Characters
4

The on board right elevator pump total operating time in hours.

a1OnBoardTempSinceLastFullRegen[2]
SV NA ME
a1OnBoardT empSinceLast FullRegen[2]

Class
SV

Format

V ID/SV ID
437

UNITS
hours

Structure


: 20

Max Characters
4

The on board right elevator pump time since the last full regen in hours.

a1OnBoardTempSinceLastFastRegen[2]
SV NA ME
a1OnBoardT empSinceLast Fast Regen[2]

Class
SV

V ID/SV ID
438

Format
UNITS
hours

Structure


: 20

Max Characters
4

The on board right elevator pump time since the last fast regen in hours.

a1OnBoardBasePressure[2]
SV NA ME
a1OnBoardBaseP ressure[2]

Format
Class
SV

V ID/SV ID
439

UNITS
micron

Structure


: 20

Max Characters
4

The on board right elevator pump base pressure in microns.

ACCEL-I

Format: 20
SVNAME
ACCEL-I

SVID
48
1048
2048
3048
4048
5048
6048
7048

SVNAME
ACCEL-I
lw ACCEL-I
hw ACCEL-I
aw ACCEL-I
lbACCEL-I
hbACCEL-I
abACCEL-I
ACCEL-I

Acceleration power supply current.

Class
SV

VID/SVID
48

UNITS
mamp

Structure


Max Characters
5

DESCRIPTION
Current Acceleration pow er supply current
Low est Acceleration pow er supply current on last w af er implant
Highest Acceleration pow er supply current on last w af er implant
Average Acceleration pow er supply current on last w af er implant
Low est Acceleration pow er supply current on last batch implant
Highest Acceleration pow er supply current on last batch implant
Average Acceleration pow er supply current on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

ACCEL-VOLTS

Format: 20

SVNAME
ACCEL-VOLTS
SVID
47
1047
2047
3047
4047
5047
6047
7047

SVNAME
ACCEL-VOLTS
lw ACCEL-VOLTS
hw ACCEL-VOLTS
aw ACCEL-VOLTS
lbACCEL-VOLTS
hbACCEL-VOLTS
abACCEL-VOLTS
ACCEL-VOLTS

Class
SV

VID/SVID
47

UNITS
Kvolts

Structure


Max Characters
5

DESCRIPTION
Current Acceleration pow er supply voltage
Low est Acceleration pow er supply voltage on last w af er implant
Highest Acceleration pow er supply voltage on last w af er implant
Average Acceleration pow er supply voltage on last w af er implant
Low est Acceleration pow er supply voltage on last batch implant
Highest Acceleration pow er supply voltage on last batch implant
Average Acceleration pow er supply voltage on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Acceleration power supply voltage in kilovolts.

ALARMSTATE

Format

SVNAME
ALARMST AT E

Class
SV

VID/SVID
517

UNITS
None

Structure


: U1

Max Characters
1

ALARMSTATE is the GEM compliant format of reporting the alarm state of the most recent alarm ID. The default value of
ALARMSTATE is 0.

AMU

Format: 20
SVNAME
AMU

SVID
36
1036
2036
3036
4036
5036
6036
7036

SVNAME
AMU
lw AMU
hw AMU
aw AMU
lbAMU
hbAMU
abAMU
AMU

Class
SV

VID/SVID
36

UNITS
none

Structure


Max Characters
5

DESCRIPTION
Current AMU
Low est AMU on last w af er implant
Highest AMU on last w af er implant
Average AMU on last w af er implant
Low est AMU on last batch implant
Highest AMU on last batch implant
Average AMU on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

AMU value calculated from the extraction voltage, analyzer current, ion charge in the recipe and the analyzer magnet
constant table.

AMU-I

Format: 20
SVNAME
AMU-I

Class
SV

VID/SVID
35

UNITS
amp

Structure


Max Characters
5

SVID
35
1035
2035
3035
4035
5035
6035
7035

SVNAME
AMU-I
lw AMU-I
hw AMU-I
aw AMU-I
lbAMU-I
hbAMU-I
abAMU-I
AMU-I

DESCRIPTION
Current AMU-I
Low est AMU-I on last w af er implant
Highest AMU-I on last w af er implant
Average AMU-I on last w af er implant
Low est AMU-I on last batch implant
Highest AMU-I on last batch implant
Average AMU-I on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Analyzer magnet current in amperes.

AMU-G

Format: 20
SVNAME
AMU-G

SVID
75
1075
2075
3075
4075
5075
6075
7075

SVNAME
AMU-G
lw AMU-G
hw AMU-G
aw AMU-G
lbAMU-G
hbAMU-G
abAMU-G
AMU-G

Class
SV

VID/SVID
75

UNITS
kGauss

Structure


Max Characters
5

DESCRIPTION
Current AMU-G
Low est AMU-G on last w af er implant
Highest AMU-G on last w af er implant
Average AMU-G on last w af er implant
Low est AMU-G on last batch implant
Highest AMU-G on last batch implant
Average AMU-G on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

ANALYZER-PRESSURE
SVNAME
ANALYZER-PRESSURE
SVID
64
1064
2064
3064
4064
5064
6064
7064

SVNAME
ANALYZER-PRESSURE
lw ANALYZER-PRESSURE
hw ANALYZER-PRESSURE
aw ANALYZER-PRESSURE
lbANALYZER-PRESSURE
hbANALYZER-PRESSURE
abANALYZER-PRESSURE
ANALYZER-PRESSURE

Format: 20
Class
SV

VID/SVID
64

UNITS
Torr

Structure


Max Characters
6

DESCRIPTION
Current analyzer pressure
Low est analyzer pressure on last w af er implant
Highest analyzer pressure on last w af er implant
Average analyzer pressure on last w af er implant
Low est analyzer pressure on last batch implant
Highest analyzer pressure on last batch implant
Average analyzer pressure on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Read back from the CCIG near the resolving aperture.

ANALYZER-TC
SV NA ME
ANALYZER-T C

Format
Class
SV

V ID/SV ID
80

UNITS
micron

Structure


: 20

Max Characters
4

SV ID
80
1080
2080
3080
4080
5080
6080
7080

SV NA ME
A NA LY ZER-TC
lw A NA LY ZER-TC
hw A NA LY ZER-TC
aw A NA LY ZER-TC
lbA NA LY ZER-TC
hbA NA LY ZER-TC
abA NA LY ZER-TC
A NA LY ZER-TC

DESCRIPTION
Current analyzer thermocouple reading
Low est analyzer thermocouple reading on last w af er implant
Highest analyzer thermocouple reading on last w af er implant
A verage analyzer thermocouple reading on last w af er implant
Low est analyzer thermocouple reading on last batch implant
Highest analyzer thermocouple reading on last batch implant
A verage analyzer thermocouple reading on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Analyzer thermocouple reading for the additional thermocouple gauge option.

ARC-I

Format: 20
SVNAME
ARC-I

SVID
24
1024
2024
3024
4024
5024
6024
7024

SVNAME
ARC-I
lw ARC-I
hw ARC-I
aw ARC-I
lbARC-I
hbARC-I
abARC-I
ARC-I

Class
SV

VID/SVID
24

UNITS
A/mA

Structure


Max Characters
5

DESCRIPTION
Current arc current
Low est arc current on last w af er implant
Highest arc current on last w af er implant
Average arc current on last w af er implant
Low est arc current on last batch implant
Highest arc current on last batch implant
Average arc current on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Arc current.

ARC-VOLTS

Format: 20

SVNAME
ARC-VOLTS
SVID
26
1026
2026
3026
4026
5026
6026
7026

SVNAME
ARC-VOLTS
lw ARC-VOLTS
hw ARC-VOLTS
aw ARC-VOLTS
lbARC-VOLTS
hbARC-VOLTS
abARC-VOLTS
ARC-VOLTS

Class
SV

VID/SVID
26

UNITS
volts

Structure


Max Characters
4

DESCRIPTION
Current arc voltage
Low est arc voltage on last w af er implant
Highest arc voltage on last w af er implant
Average arc voltage on last w af er implant
Low est arc voltage on last batch implant
Highest arc voltage on last batch implant
Average arc voltage on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Arc voltage in volts.

BEAM

Format: 20
SVNAME
BEAM

Class
SV

VID/SVID
38

UNITS
amp

Structure


Max Characters
3

SVID
38
1038
2038
3038
4038
5038
6038
7038

SVNAME
BEAM
lw BEAM
hw BEAM
aw BEAM
lbBEAM
hbBEAM
abBEAM
BEAM

DESCRIPTION
Current setup f araday cup current
Low est setup f araday cup current on last w af er implant
Highest setup f araday cup current on last w af er implant
Average setup f araday cup current on last w af er implant
Low est setup f araday cup current on last batch implant
Highest setup f araday cup current on last batch implant
Average setup f araday cup current on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Setup Faraday cup current. See SVID 39 for unit. The Faraday cup is retracted during implant so the reading is only
valid at the end of ion source setup and before beamline setup.

BEAM-I-RANGE

Format: 20

SVNAME
BEAM-I-RANGE
SVID
39
1039
2039
3039
4039
5039
6039
7039

SVNAME
BEAM-I-RANGE
lw BEAM-I-RANGE
hw BEAM-I-RANGE
aw BEAM-I-RANGE
lbBEAM-I-RANGE
hbBEAM-I-RANGE
abBEAM-I-RANGE
BEAM-I-RANGE

BEAM-I-RANGE
0
1
2
3
4
5

Class
SV

VID/SVID
39

UNITS
none

Structure


Max Characters
1

DESCRIPTION
Current beam current unit
Low est beam current unit on last w af er implant
Highest beam current unit on last w af er implant
Average beam current unit on last w af er implant
Low est beam current unit on last batch implant
Highest beam current unit on last batch implant
Average beam current unit on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Unit
Milliamp
Microamp
Microamp
Microamp
Nanoamp
Nanoamp

Unit for the BEAM current.

BEAMLINE-TC
BEAMLINE-TC
SV NA ME
BEAMLINE-T C

SV ID
81
1081
2081
3081
4081
5081
6081
7081

SV NA ME
BEA MLINE-TC
lw BEA MLINE-TC
hw BEA MLINE-TC
aw BEA MLINE-TC
lbBEA MLINE-TC
hbBEA MLINE-TC
abBEA MLINE-TC
BEA MLINE-TC

Format
Class
SV

V ID/SV ID
81

UNITS
micron

Structure


: 20

Max Characters
4

DESCRIPTION
Current beamline thermocouple reading
Low est beamline thermocouple reading on last w af er implant
Highest beamline thermocouple reading on last w af er implant
A verage beamline thermocouple reading on last w af er implant
Low est beamline thermocouple reading on last batch implant
Highest beamline thermocouple reading on last batch implant
A verage beamline thermocouple reading on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Beamline thermocouple reading for the additional thermocouple gauge option.

BIAS

Format: 20
SVNAME
BIAS

SVID
37
1037
2037
3037
4037
5037
6037
7037

SVNAME
BIAS
lw BIAS
hw BIAS
aw BIAS
lbBIAS
hbBIAS
abBIAS
BIAS

Class
SV

VID/SVID
37

UNITS
volts

Structure


Max Characters
3

DESCRIPTION
Current Faraday setup cup suppression voltage
Low est Faraday setup cup suppression voltage on last w af er implant
Highest Faraday setup cup suppression voltage on last w af er implant
Average Faraday setup cup suppression voltage on last w af er implant
Low est Faraday setup cup suppression voltage on last batch implant
Highest Faraday setup cup suppression voltage on last batch implant
Average Faraday setup cup suppression voltage on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Setup Faraday cup suppression voltage in volts.

CHAMBER-CRYO-TC
SVNAME
CHAMBER-CRYO-TC
SVID
15
1015
2015
3015
4015
5015
6015
7015

SVNAME
CHAMBER-CRYO-TC
lw CHAMBER-CRYO-TC
hw CHAMBER-CRYO-TC
aw CHAMBER-CRYO-TC
lbCHAMBER-CRYO-TC
hbCHAMBER-CRYO-TC
abCHAMBER-CRYO-TC
CHAMBER-CRYO-TC

Format: 20
Class
SV

VID/SVID
15

UNITS
micron

Structure


Max Characters
4

DESCRIPTION
Current chamber cryo pump temperature
Low est chamber cryo pump temperature on last w af er implant
Highest chamber cryo pump temperature on last w af er implant
highest chamber cryo pump temperature on last batch implant
Low est chamber cryo pump temperature on last batch implant
Highest chamber cryo pump temperature on last batch implant
Average chamber cryo pump temperature on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

The pressure inside the chamber cryo pump as measured by its thermocouple gauge.

CHAMBER-CRYO-TEMP
SV NA ME
CHA MBER-CRY O-TEMP

Format: 20
Class
SV

V ID/SV ID
12

UNITS
Ko

Structure


Max Characters
3

SVID
12
1012
2012
3012
4012
5012
6012
7012

SVNAME
CHAMBER-CRYO-TEMP
lw CHAMBER-CRYO-TEMP
hw CHAMBER-CRYO-TEMP
aw CHAMBER-CRYO-TEMP
lbCHAMBER-CRYO-TEMP
hbCHAMBER-CRYO-TEMP
abCHAMBER-CRYO-TEMP
CHAMBER-CRYO-TEMP

DESCRIPTION
Current ES cryo pump temperature
Low est ES cryo pump temperature on last w af er implant
Highest ES cryo pump temperature on last w af er implant
Average ES cryo pump temperature on last w af er implant
Low est ES cryo pump temperature on last batch implant
Highest ES cryo pump temperature on last batch implant
Average ES cryo pump temperature on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

The temperature of the cryo pump for the main end station chamber.

CHAMBER-PRESSURE
SVNAME
CHAMBER-PRESSURE
SVID
8
1008
2008
3008
4008
5008
6008
7008

SVNAME
CHAMBER-PRESSURE
lw CHAMBER-PRESSURE
hw CHAMBER-PRESSURE
aw CHAMBER-PRESSURE
lbCHAMBER-PRESSURE
hbCHAMBER-PRESSURE
abCHAMBER-PRESSURE
CHAMBER-PRESSURE

Format: 20
Class
SV

VID/SVID
8

UNITS
Torr

Structure


Max Characters
6

DESCRIPTION
Current CCIG pressure
Low est CCIG pressure on last w af er implant
Highest CCIG pressure on last w af er implant
Average CCIG pressure on last w af er implant
Low est CCIG pressure on last batch implant
Highest CCIG pressure on last batch implant
Average CCIG pressure on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

The readback from the CCIG mounted in the end station.

CITY-WATER-TEMP
SV NA ME
CITY -WA TER-TEMP

SVID
5
1005
2005
3005
4005
5005
6005
7005

SVNAME
CITY-WATER-TEMP
lw CITY-WATER-TEMP
hw CITY-WATER-TEMP
aw CITY-WATER-TEMP
lbCITY-WATER-TEMP
hbCITY-WATER-TEMP
abCITY-WATER-TEMP
CITY-WATER-TEMP

Format: 20
Class
SV

V ID/SV ID
5

UNITS
deg. C

Structure


Max Characters
3

DESCRIPTION
Current cooling w ater temperature
Low est cooling w ater temperature on last w af er implant
Highest cooling w ater temperature on last w af er implant
Average cooling w ater temperature on last w af er implant
Low est cooling w ater temperature on last batch implant
Highest cooling w ater temperature on last batch implant
Average cooling w ater temperature on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

The temperature of the cooling water supplied to the implanter from facilities.

COOLING

Format: 20
SVNAME
COOLING

Class
SV

VID/SVID
54

UNITS
Torr

Structure


Max Characters
4

SVID
54
1054
2054
3054
4054
5054
6054
7054

SVNAME
COOLING
lw COOLING
hw COOLING
aw COOLING
lbCOOLING
hbCOOLING
abCOOLING
COOLING

DESCRIPTION
Current gas pressure readback
Low est gas pressure readback on last w af er implant
Highest gas pressure readback on last w af er implant
Average gas pressure readback on last w af er implant
Low est gas pressure readback on last batch implant
Highest gas pressure readback on last batch implant
Average gas pressure readback on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Gas pressure regulator readback in Torr.

DECEL-I

Format: 20
SVNAME
DECEL-I

SVID
74
1074
2074
3074
4074
5074
6074
7074

Class
SV

SVNAME
DECEL-I
lw DECEL-I
hw DECEL-I
aw DECEL-I
lbDECEL-I
hbDECEL-I
abDECEL-I
DECEL-I

VID/SVID
74

UNITS
mamp

Structure


Max Characters
5

DESCRIPTION
Current decel current
Low est decel current on last w af er implant
Highest decel current on last w af er implant
Average decel current on last w af er implant
Low est decel current on last batch implant
Highest decel current on last batch implant
Average decel current on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Deceleration power supply current in milliamps.

DECEL-SUPPRESSION-VOLTS
SVNAME
DECEL-SUPPRESSION-VOLTS

SVID
82
1082
2082
3082
4082
5082
6082
7082

Format: 20
Class
SV

SVNAME
DECEL-SUPPRESSION-VOLTS
lw DECEL-SUPPRESSION-VOLTS
hw DECEL-SUPPRESSION-VOLTS
aw DECEL-SUPPRESSION-VOLTS
lbDECEL-SUPPRESSION-VOLTS
hbDECEL-SUPPRESSION-VOLTS
abDECEL-SUPPRESSION-VOLTS
DECEL-SUPPRESSION-VOLTS

VID/SVID
82

UNITS
Kvolts

Structure


Max Characters
5

DESCRIPTION
Current decel suppression voltage
Low est decel suppression voltage on last w afer implant
Highest decel suppression voltage on last w afer implant
Average decel suppression voltage on last w afer implant
Low est decel suppression voltage on last batch implant
Highest decel suppression voltage on last batch implant
Average decel suppression voltage on last batch implant
Non-ASCII formatting available w ith V 11.05.05 and above

Deceleration power supply voltage in kilovolts.

DECEL-VOLTS

Format: 20

SVNAME
DECEL-VOLTS
SVID
73
1073
2073
3073
4073
5073
6073
7073

SVNAME
DECEL-VOLTS
lw DECEL-VOLTS
hw DECEL-VOLTS
aw DECEL-VOLTS
lbDECEL-VOLTS
hbDECEL-VOLTS
abDECEL-VOLTS
DECEL-VOLTS

Class
SV

VID/SVID
73

UNITS
Kvolts

Structure


Max Characters
5

DESCRIPTION
Current decel voltage
Low est decel voltage on last w af er implant
Highest decel voltage on last w af er implant
Average decel voltage on last w af er implant
Low est decel voltage on last batch implant
Highest decel voltage on last batch implant
Average decel voltage on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Deceleration power supply voltage in kilovolts.

DEC-I

Format: 20
SVNAME
DEC-I

SVID
50
1050
2050
3050
4050
5050
6050
7050

SVNAME
DEC-I
lw DEC-I
hw DEC-I
aw DEC-I
lbDEC-I
hbDEC-I
abDEC-I
DEC-I

Class
SV

VID/SVID
50

UNITS
mamp

Structure


Max Characters
5

DESCRIPTION
Current suppression supply current
Low est suppression supply current on last w af er implant
Highest suppression supply current on last w af er implant
Average suppression supply current on last w af er implant
Low est suppression supply current on last batch implant
Highest suppression supply current on last batch implant
Average suppression supply current on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Accel column electron suppression supply current in milliamps.

DEC-VOLTS

Format: 20

SVNAME
DEC-VOLTS
SVID
49
1049
2049
3049
4049
5049
6049
7049

SVNAME
DEC-VOLTS
lw DEC-VOLTS
hw DEC-VOLTS
aw DEC-VOLTS
lbDEC-VOLTS
hbDEC-VOLTS
abDEC-VOLTS
DEC-VOLTS

Class
SV

VID/SVID
49

UNITS
kvolts

Structure


Max Characters
5

DESCRIPTION
Current suppression supply voltage
Low est suppression supply voltage on last w af er implant
Highest suppression supply voltage on last w af er implant
Average suppression supply voltage on last w af er implant
Low est suppression supply voltage on last batch implant
Highest suppression supply voltage on last batch implant
Average suppression supply voltage on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Accel column electron suppression supply voltage in kilovolts.

DEFLECTOR

Format: 20

SVNAME
DEFLECTOR
SVID
45
1045
2045
3045
4045
5045
6045
7045

SVNAME
DEFLECTOR
lw DEFLECTOR
hw DEFLECTOR
aw DEFLECTOR
lbDEFLECTOR
hbDEFLECTOR
abDEFLECTOR
DEFLECTOR

Class
SV

VID/SVID
45

UNITS
kvolts

Structure


Max Characters
4

DESCRIPTION
Current def lector voltage
Low est def lector voltage on last w af er implant
Highest def lector voltage on last w af er implant
Average def lector voltage on last w af er implant
Low est def lector voltage on last batch implant
Highest def lector voltage on last batch implant
Average def lector voltage on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

The voltage on the deflector electrode in kilovolts.

DI-WATER-DELTA-TEMP
SV NA ME
DI-W AT ER-DELT A-T EM P

SV ID
79
1079
2079
3079
4079
5079
6079
7079

SV NA ME
DI-WA TER-DELTA -TEMP
lw DI-WA TER-DELTA -TEMP
hw DI-WA TER-DELTA -TEMP
aw DI-WA TER-DELTA -TEMP
lbDI-WA TER-DELTA -TEMP
hbDI-WA TER-DELTA -TEMP
abDI-WA TER-DELTA -TEMP
DI-WA TER-DELTA -TEMP

Format
Clas s
SV

V ID/SV ID
79

UNITS
Celsius

Struc ture


: 20

Max Charac ters
3

DESCRIPTION
Current dif f erential temperature
Low est dif f erential temperature on last w af er implant
Highest dif f erential temperature on last w af er implant
A verage dif f erential temperature on last w af er implant
Low est dif f erential temperature on last batch implant
Highest dif f erential temperature on last batch implant
A verage dif f erential temperature on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Differential temperature between the terminal and return DI cooling water supply in degrees Celsius.

DRY-PUMP-TC
SVNAME
DRY-PUMP-TC
SVID
65
1065
2065
3065
4065
5065
6065
7065

SVNAME
DRY-PUMP-TC
lw DRY-PUMP-TC
hw DRY-PUMP-TC
aw DRY-PUMP-TC
lbDRY-PUMP-TC
hbDRY-PUMP-TC
abDRY-PUMP-TC
DRY-PUMP-TC

Format
Class
SV

VID/SVID
65

UNITS
micron

Structure


Max Characters
4

DESCRIPTION
Current f oreline thermocouple readback
Low est f oreline thermocouple readback on last w af er implant
Highest f oreline thermocouple readback on last w af er implant
Average f oreline thermocouple readback on last w af er implant
Low est f oreline thermocouple readback on last batch implant
Highest f oreline thermocouple readback on last batch implant
Average f oreline thermocouple readback on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Readback from the thermocouple gauge on the foreline of the source dry pump in units of microns.

: 20

eBIAS-I

Format
SVNAME
eBIAS-I

SVID
62
1062
2062
3062
4062
5062
6062
7062

SVNAME
eBIAS-I
lw eBIAS-I
hw eBIAS-I
aw eBIAS-I
lbeBIAS-I
hbeBIAS-I
abeBIAS-I
eBIAS-I

Class
SV

VID/SVID
62

UNITS
mamp

Structure


: 20

Max Characters
4

DESCRIPTION
Current bias current
Low est bias current on last w af er implant
Highest bias current on last w af er implant
Average bias current on last w af er implant
Low est bias current on last batch implant
Highest bias current on last batch implant
Average bias current on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Bias current in milliamps (can be negative).

eBIAS-VOLTS

Format

SVNAME
eBIAS-VOLTS
SVID
61
1061
2061
3061
4061
5061
6061
7061

SVNAME
eBIAS-VOLTS
lw eBIAS-VOLTS
hw eBIAS-VOLTS
aw eBIAS-VOLTS
lbeBIAS-VOLTS
hbeBIAS-VOLTS
abeBIAS-VOLTS
eBIAS-VOLTS

Class
SV

VID/SVID
61

UNITS
volt

Structure


: 20

Max Characters
4

DESCRIPTION
Current target bias voltage
Low est target bias voltage on last w af er implant
Highest target bias voltage on last w af er implant
Average target bias voltage on last w af er implant
Low est target bias voltage on last batch implant
Highest target bias voltage on last batch implant
Average target bias voltage on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Target bias voltage in volts.

eEXT-I

Format
SVNAME
eEXT-I

SVID
59
1059
2059
3059
4059
5059
6059
7059

SVNAME
eEXT-I
lw eEXT-I
hw eEXT-I
aw eEXT-I
lbeEXT-I
hbeEXT-I
abeEXT-I
eEXT-I

Class
SV

VID/SVID
59

UNITS
mamp

Structure


DESCRIPTION
Current extraction current
Low est extraction current on last w af er implant
Highest extraction current on last w af er implant
Average extraction current on last w af er implant
Low est extraction current on last batch implant
Highest extraction current on last batch implant
Average extraction current on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

: 20

Max Characters
6

Extraction current in amps.

eFIL-I

Format
SVNAME
eFIL-I

SVID
56
1056
2056
3056
4056
5056
6056
7056

SVNAME
eFIL-I
lw eFIL-I
hw eFIL-I
aw eFIL-I
lbeFIL-I
hbeFIL-I
abeFIL-I
eFIL-I

Class
SV

VID/SVID
56

UNITS
amp

Structure


: 20

Max Characters
4

DESCRIPTION
Current f ilament current
Low est f ilament current on last w af er implant
Highest f ilament current on last w af er implant
Average f ilament current on last w af er implant
Low est f ilament current on last batch implant
Highest f ilament current on last batch implant
Average f ilament current on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Filament current in amps.

eEXT-VOLTS

Format

SVNAME
eEXT-VOLTS
SVID
58
1058
2058
3058
4058
5058
6058
7058

SVNAME
eEXT-VOLTS
lw eEXT-VOLTS
hw eEXT-VOLTS
aw eEXT-VOLTS
lbeEXT-VOLTS
hbeEXT-VOLTS
abeEXT-VOLTS
eEXT-VOLTS

Class
SV

VID/SVID
58

UNITS
volt

Structure


: 20

Max Characters
3

DESCRIPTION
Current extraction voltage
Low est extraction voltage on last w af er implant
Highest extraction voltage on last w af er implant
Averageextraction voltage on last w af er implant
Low est extraction voltage on last batch implant
Highest extraction voltage on last batch implant
Average extraction voltage on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Extraction voltage in volts.

eFIL-VOLTS

Format

SVNAME
eFIL-VOLTS
SVID
55
1055
2055
3055
4055
5055
6055
7055

SVNAME
eFIL-VOLTS
lw eFIL-VOLTS
hw eFIL-VOLTS
aw eFIL-VOLTS
lbeFIL-VOLTS
hbeFIL-VOLTS
abeFIL-VOLTS
eFIL-VOLTS

Class
SV

VID/SVID
55

UNITS
volt

Structure


DESCRIPTION
Current f ilament voltage
Low est f ilament voltage on last w af er implant
Highest f ilament voltage on last w af er implant
Average f ilament voltage on last w af er implant
Low est f ilament voltage on last batch implant
Highest f ilament voltage on last batch implant
Average f ilament voltage on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

: 20

Max Characters
4

Filament voltage in volts.

ENERGY-PROBE
SV NA ME
ENERGY-P ROBE

SV ID
51
1051
2051
3051
4051
5051
6051
7051

SV NA ME
ENERGY -PROBE
lw ENERGY -PROBE
hw ENERGY -PROBE
aw ENERGY -PROBE
lbENERGY -PROBE
hbENERGY -PROBE
abENERGY -PROBE
ENERGY -PROBE

Format
Class
SV

V ID/SV ID
51

UNITS
none

Structure


: 20

Max Characters
5

DESCRIPTION
Current accel voltage
Low est accel voltage on last w af er implant
Highest accel voltage on last w af er implant
A verage accel voltage on last w af er implant
Low est accel voltage on last batch implant
Highest accel voltage on last batch implant
A verage accel voltage on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The total voltage used to accelerate the ion beam in kilovolts times the ion charge in the recipe. If the high voltage probe
option is installed, this value comes from the probe. Otherwise, it is calculated from the extraction and accelerating
voltages.

ErgoSMIF MDLN
SV NA ME
Left ErgoSMIF MDLN
Right ErgoSMIF MDLN

Format
Class
SV
SV

V ID/SV ID
8314
8414

UNITS
none
none

Structure



: A6

Max Characters
6
6

Version Available : 11.07.06
Equipment Model Type. The default is "ERGO 2"

ErgoSMIF SoftRev
SV NA ME
Left ErgoSMIF Soft Rev
Right ErgoSMIF Soft Rev

Format
Class
SV
SV

V ID/SV ID
8315
8415

UNITS
none
none

Structure



: A6

Max Characters
6
6

Version Available : 11.07.06
SMIF software revision V2.00 or higher. The default is "PID200"

ErgoSMIF Control State
SV NA ME
Left ErgoSMIF Cont rol St at e
Right ErgoSMIF Cont rol St at e

Format
Class
SV
SV

V ID/SV ID
8316
8416

UNITS
none
none

Structure



: U1

Max Characters
1
1

Version Available : 11.07.06
The current control state of the SMIF. The default is "4" (Local).
4 - local
5 - remote

ErgoSMIF Process State
SV NA ME
Left ErgoSMIF P rocess St at e
Right ErgoSMIF P rocess St at e

Format
Class
SV
SV

V ID/SV ID
8317
8417

UNITS
none
none

Structure



: U1

Max Characters
1
1

Version Available : 11.07.06
The process state of the SMIF. The default is "0" (Idle).
0 - idle
1 - loading
2 - unloading
3 - initializing
4 - service running
5 - load paused
6 - unload paused

ErgoSMIF PIO State
SV NA ME
Left ErgoSMIF P IO St at e
Right ErgoSMIF P IO St at e

Format
Class
SV
SV

V ID/SV ID
8318
8418

UNITS
none
none

Structure



: U2

Max Characters
2
2

Version Available : 11.07.06
The binary PIO State. The default is set as "0".

eRPL-VOLTS

Format

SVNAME
eRPL-VOLTS
SVID
57
1057
2057
3057
4057
5057
6057
7057

SVNAME
eRPL-VOLTS
lw eRPL-VOLTS
hw eRPL-VOLTS
aw eRPL-VOLTS
lbeRPL-VOLTS
hbeRPL-VOLTS
abeRPL-VOLTS
eRPL-VOLTS

Repeller voltage in volts.

Class
SV

VID/SVID
57

UNITS
volt

Structure


DESCRIPTION
Current repeller voltage
Low est repeller voltage on last w af er implant
Highest repeller voltage on last w af er implant
Average repeller voltage on last w af er implant
Low est repeller voltage on last batch implant
Highest repeller voltage on last batch implant
Average repeller voltage on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

: 20

Max Characters
4

ES-DIFFER-TC

Format

SV NA ME
ES-DIFFER-T C

SV ID
78
1078
2078
3078
4078
5078
6078
7078

SV NA ME
ES-DIFFER-TC
lw ES-DIFFER-TC
hw ES-DIFFER-TC
aw ES-DIFFER-TC
lbES-DIFFER-TC
hbES-DIFFER-TC
abES-DIFFER-TC
ES-DIFFER-TC

Class
SV

V ID/SV ID
78

UNITS
micron

Structure


: 20

Max Characters
4

DESCRIPTION
Current ES dif f erential pressure
Low est ES dif f erential pressure on last w af er implant
Highest ES dif f erential pressure on last w af er implant
A verage ES dif f erential pressure on last w af er implant
Low est ES dif f erential pressure on last batch implant
Highest ES dif f erential pressure on last batch implant
A verage ES dif f erential pressure on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

End station differential pressure.

eSECOND-I

Format

SVNAME
eSECOND-I
SVID
71
1071
2071
3071
4071
5071
6071
7071

SVNAME
eSECOND-I
lw eSECOND-I
hw eSECOND-I
aw eSECOND-I
lbeSECOND-I
hbeSECOND-I
abeSECOND-I
eSECOND-I

Class
SV

VID/SVID
71

UNITS
mamp

Structure


: 20

Max Characters
4

DESCRIPTION
Current secondary current sensor readback
Low est secondary current sensor readback on last w af er implant
Highest secondary current sensor readback on last w af er implant
Average secondary current sensor readback on last w af er implant
Low est secondary current sensor readback on last batch implant
Highest secondary current sensor readback on last batch implant
Average secondary current sensor readback on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

Secondary current sensor readback in milliamps if ECO Option # 44 is selected.

eSUP-VOLTS

Format

SVNAME
eSUP-VOLTS
SVID
63
1063
2063
3063
4063
5063
6063
7063

SVNAME
eSUP-VOLTS
lw eSUP-VOLTS
hw eSUP-VOLTS
aw eSUP-VOLTS
lbeSUP-VOLTS
hbeSUP-VOLTS
abeSUP-VOLTS
eSUP-VOLTS

Class
SV

VID/SVID
63

UNITS
volt

Structure


: 20

Max Characters
6

DESCRIPTION
Current ES Faraday suppression voltage
Low est ES Faraday suppression voltage on last w af er implant
Highest ES Faraday suppression voltage on last w af er implant
Average ES Faraday suppression voltage on last w af er implant
Low est ES Faraday suppression voltage on last batch implant
Highest ES Faraday suppression voltage on last batch implant
Average ES Faraday suppression voltage on last batch implant
Non-ASCII f ormatting available w ith V 11.05.05 and above

End station Faraday cup suppression voltage in volts.

eTARGET-I

Format

: 20

SV NA ME

Class

V ID/SV ID

UNITS

Structure

Max Characters

eTA RGET-I

SV

60

mamp



6

SV ID

SV NA ME

60
1060
2060
3060
4060
5060
6060
7060

eTA RGET-I
lw eTA RGET-I
hw eTA RGET-I
aw eTA RGET-I
lbeTA RGET-I
hbeTA RGET-I
eT ARGET -I
eT ARGET -I

DESCRIPTION
Current target current
Low est target current on last w af er implant
Highest target current on last w af er implant
A verage target current on last w af er implant
Low est target current on last batch implant
Highest target current on last batch implant
A verage target current on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Target current in milliamps.

EXT-I

Format: 20

SV ID
29
1029
2029
3029
4029
5029
6029
7029

SV NA ME

Class

V ID/SV ID

UNITS

Structure

Max Characters

EXT-I

SV

29

mamp



4

SV NA ME
EXT -I
lw EXT-I
hw EXT-I
aw EXT-I
lbEXT-I
hbEXT-I
abEXT-I
EXT-I

DESCRIPTION
Current extraction supply current
Low estextraction supply current on last w af er implant
Highestextraction supply current on last w af er implant
A verageextraction supply current on last w af er implant
Low est extraction supply current on last batch implant
Highest extraction supply current on last batch implant
A verage extraction supply current on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Extraction supply current in milliamps.

EXT-VOLTS

SV ID
28
1028
2028
3028
4028
5028
6028
7028

Format

: 20

SV NA ME

Class

V ID/SV ID

UNITS

Structure

Max Characters

EXT-VOLTS

SV

28

kvolts



5

SV NA ME
EXT -VOLT S
lw EXT-V OLTS
hw EXT-V OLTS
aw EXT-V OLTS
lbEXT-V OLTS
hbEXT-V OLTS
abEXT-V OLTS
EXT -VOLT S

DESCRIPTION
Current extraction supply voltage
Low est extraction supply voltage on last w af er implant
Highest extraction supply voltage on last w af er implant
A verage extraction supply voltage on last w af er implant
Low est extraction supply voltage on last batch implant
Highest extraction supply voltage on last batch implant
A verageextraction supply voltage on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Extraction supply voltage in kilovolts.

FIL-I

Format

SV ID
22
1022
2022
3022
4022
5022
6022
7022

: 20

SV NA ME

Class

V ID/SV ID

UNITS

Structure

Max Characters

FIL-I

SV

22

amp



5

SV NA ME
FIL-I
lw FIL-I
hw FIL-I
aw FIL-I
lbFIL-I
hbFIL-I
abFIL-I
FIL-I

DESCRIPTION
Current f ilament current
Low est f ilament current on last w af er implant
Highest f ilament current on last w af er implant
A verage f ilament current on last w af er implant
Low est f ilament current on last batch implant
Highest f ilament current on last batch implant
A verage f ilament current on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Filament current in amperes.

FIL-VOLTS

SV ID
23
1022
2023
3023
4023
5023
6023
7023

Format

: 20

SV NA ME

Class

V ID/SV ID

UNITS

Structure

Max Characters

FIL-VOLTS

SV

23

Volts



5

SV NA ME
FIL-V OLTS
lw FIL-V OLTS
hw FIL-V OLTS
aw FIL-V OLTS
lbFIL-V OLTS
hbFIL-V OLTS
abFIL-V OLTS
FIL-V OLTS

DESCRIPTION
Current f ilament voltage
Low est f ilament voltage on last w af er implant
Highest f ilament voltage on last w af er implant
A verage f ilament voltage on last w af er implant
Low est f ilament voltage on last batch implant
Highest f ilament voltage on last batch implant
A verage f ilament voltage on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Filament voltage in volts.

G1-PRES

SV ID
18
1018
2018
3018
4018
5018
6018
7018

Format

: 20

SV NA ME

Class

V ID/SV ID

UNITS

Structure

Max Characters

G1-PRES

SV

18

ps i



6

SV NA ME
G1-PRES
lw G1-PRES
hw G1-PRES
aw G1-PRES
lbG1-PRES
hbG1-PRES
abG1-PRES
G1-PRES

DESCRIPTION
Current pressure in gas bottle 1
Low est pressure in gas bottle 1 on last w af er implant
Highest pressure in gas bottle 1 on last w af er implant
A veragepressure in gas bottle 1 on last w af er implant
Low est pressure in gas bottle 1 on last batch implant
Highest pressure in gas bottle 1 on last batch implant
A verage pressure in gas bottle 1 on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Pressure in gas bottle 1. Units are pounds per square inch with a full scale of 3000 psi. The gauge readings should not be
used to determine when a bottle is empty since the pressure in most toxic gas bottles is only 300 psi when full and the
gauges have significant zero offsets.

G2-PRES

SV ID
19
1019
2019
3019
4019
5019
6019
7019

Format

: 20

SV NA ME

Class

V ID/SV ID

UNITS

Structure

Max Characters

G2-PRES

SV

19

ps i



6

SV NA ME
G2-P RES
lw G2-PRES
hw G2-PRES
aw G2-PRES
lbG2-PRES
hbG2-PRES
abG2-PRES
G2-P RES

DESCRIPTION
Current pressure in gas bottle 2
Low est pressure in gas bottle 2 on last w af er implant
Highest pressure in gas bottle 2 on last w af er implant
A verage pressure in gas bottle 2 on last w af er implant
Low est pressure in gas bottle 2 on last batch implant
Highest pressure in gas bottle 2 on last batch implant
A verage pressure in gas bottle 2 on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Pressure in gas bottle 2.

G3-PRES

Format

: 20

SV NA ME

Class

V ID/SV ID

UNITS

Structure

Max Characters

G3-PRES

SV

20

ps i



6

SV ID

SV NA ME

20
1020
2020
3020
4020
5020
6020
7020

G3-PRES
lw G3-PRES
hw G3-PRES
aw G3-PRES
lbG3-PRES
hbG3-PRES
abG3-PRES
G3-PRES

DESCRIPTION
Current pressure in gas bottle 3
Low est pressure in gas bottle 3 on last w af er implant
Highest pressure in gas bottle 3 on last w af er implant
A verage pressure in gas bottle 3 on last w af er implant
Low est pressure in gas bottle 3 on last batch implant
Highest pressure in gas bottle 3 on last batch implant
A verage pressure in gas bottle 3 on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Pressure in gas bottle 3.

G4-PRES

Format

: 20

SV NA ME

Class

V ID/SV ID

UNITS

Structure

Max Characters

G4-PRES

SV

21

ps i



6

SV ID
21
1021
2021
3021
4021
5021
6021
7021

SV NA ME
G4-PRES
lw G4-PRES
hw G4-PRES
aw G4-PRES
lbG4-PRES
hbG4-PRES
abG4-PRES
G4-PRES

DESCRIPTION
Current pressure in gas bottle 4
Low est pressure in gas bottle 4 on last w af er implant
Highestpressure in gas bottle 4 on last w af er implant
A veragepressure in gas bottle 4 on last w af er implant
Low est pressure in gas bottle 4 on last batch implant
Highest pressure in gas bottle 4 on last batch implant
A verage pressure in gas bottle 4 on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Pressure in gas bottle 4.
Note: Many special gas box configurations exist and the "bottle pressure" readings cited above may not apply to some
custom configurations.

GAS

Format

SV ID
17
1017
2017
3017
4017
5017
6017
7017

: 20

SV NA ME

Class

V ID/SV ID

UNITS

Structure

Max Characters

GAS

SV

17

Torr



5

SV NA ME
GA S
lw GA S
hw GA S
aw GA S
lbGA S
hbGA S
abGA S
GA S

DESCRIPTION
Current readback f rom manometer
Low est readback f rom manometer on last w af er implant
Highest readback f rom manometer on last w af er implant
A verage readback f rom manometer on last w af er implant
Low est readback f rom manometer on last batch implant
Highest readback f rom manometer on last batch implant
A verage readback f rom manometer on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The readback from the capacitance manometer pressure gauge that is used to control the gas flow to the ion source.

GROUND-MEGOHMS

Format

: 20

SV NA ME

Class

V ID/SV ID

UNITS

Structure

Max Characters

GROUND-MEGOHMS

SV

2

Mohm/cm



5

SV ID
2
1002
2002
3002
4002
5002
6002
7002

SV NA ME
GROUND-MEGOHMS
lw GROUND-MEGOHMS
hw GROUND-MEGOHMS
aw GROUND-MEGOHMS
lbGROUND-MEGOHMS
hbGROUND-MEGOHMS
abGROUND-MEGOHMS
GROUND-MEGOHMS

DESCRIPTION
Current resistivity of the cooling w ater
Low est resistivity of the cooling w ater on last w af er implant
Highest resistivity of the cooling w ater on last w af er implant
A verage resistivity of the cooling w ater on last w af er implant
Low est resistivity of the cooling w ater on last batch implant
Highest resistivity of the cooling w ater on last batch implant
A verage resistivity of the cooling w ater on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The resistivity of the cooling water at ground. The production machines do not use deionized cooling water at ground but
this may change to support electrostatic clamping of the water so the variable is provided for future use.

GROUND-WATER-TEMP

Format

: 20

SV NA ME

Class

V ID/SV ID

GROUND-W ATER-TEMP

SV

4

SV ID
4
1004
2004
3004
4004
5004
6004
7004

SV NA ME
GROUND-WA TER-TEMP
lw GROUND-WA TER-TEMP
hw GROUND-WA TER-TEMP
aw GROUND-WA TER-TEMP
lbGROUND-WA TER-TEMP
hbGROUND-WA TER-TEMP
abGROUND-WA TER-TEMP
GROUND-WA TER-TEMP

UNITS
o

C

Structure

Max Characters



3

DESCRIPTION
Current temperature of the cooling w ater
Low est temperature of the cooling w ater on last w af er implant
Highest temperature of the cooling w ater on last w af er implant
A verage temperature of the cooling w ater on last w af er implant
Low est temperature of the cooling w ater on last batch implant
Highest temperature of the cooling w ater on last batch implant
A verage temperature of the cooling w ater on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The temperature of the cooling water used to cool the end station.

HELIUM-PRESSURE
SV NA ME
HE LIUM -P RESSURE

SV ID
76
1076
2076
3076
4076
5076
6076
7076

SV NA ME
HELIUM-PRESSURE
lw HELIUM-PRESSURE
hw HELIUM-PRESSURE
aw HELIUM-PRESSURE
lbHELIUM-PRESSURE
hbHELIUM-PRESSURE
abHELIUM-PRESSURE
HELIUM-PRESSURE

Format
Clas s
SV

V ID/SV ID
76

UNITS
P si

Struc ture


: 20

Max Charac ters
5

DESCRIPTION
Current Helium pressure
Low est Helium pressure on last w af er implant
Highest Helium pressure on last w af er implant
A verage Helium pressure on last w af er implant
Low est Helium pressure on last batch implant
Highest Helium pressure on last batch implant
A verage Helium pressure on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Cryo compressor helium pressure.

HTR-TEMP

SV ID
72
1072
2072
3072
4072
5072
6072
7072

Format
SV NA ME

Class

V ID/SV ID

HTR-TEM P

SV

72

SV NA ME
HTR-TEMP
lw HTR-TEMP
hw HTR-TEMP
aw HTR-TEMP
lbHTR-TEMP
hbHTR-TEMP
abHTR-TEMP
HTR-TEMP

UNITS
o

C

: 20

Structure

Max Characters



3

DESCRIPTION
Current heater temperature
Low estheater temperature on last w af er implant
Highest heater temperature on last w af er implant
A verage heater temperature on last w af er implant
Low est heater temperature on last batch implant
Highest heater temperature on last batch implant
A verage heater temperature on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Temperature for the standard heater in degrees centigrade.

LEFT-CYRO-TEMP

Format

: 20

SV ID
11
1011
2011
3011
4011
5011
6011
7011

SV NA ME

Class

V ID/SV ID

LEFT-CYRO-TEMP

SV

11

SV NA ME
LEFT-CY RO-TEMP
lw LEFT-CY RO-TEMP
hw LEFT-CY RO-TEMP
aw LEFT-CY RO-TEMP
lbLEFT-CY RO-TEMP
hbLEFT-CY RO-TEMP
abLEFT-CY RO-TEMP
LEFT-CY RO-TEMP

UNITS

K

o

Structure

Max Characters



3

DESCRIPTION
Current temperature of lef t cryo
Low est temperature of lef t cryo on last w af er implant
Highest temperature of lef t cryo on last w af er implant
A verage temperature of lef t cryo on last w af er implant
Low est temperature of lef t cryo on last batch implant
Highest temperature of lef t cryo on last batch implant
A veragetemperature of lef t cryo on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The temperature of the left elevator cryo pump in degrees Kelvin. Generally the pump must be colder than 20 degrees
Kelvin to pump effectively.

LEFT-ELEVATOR-TC
SV NA ME
LEFT -ELEVAT OR-T C

SV ID
14
1014
2014
3014
4014
5014
6014
7014

SV NA ME
LEFT-ELEV A TOR-TC
lw LEFT-ELEV A TOR-TC
hw LEFT-ELEV A TOR-TC
aw LEFT-ELEV A TOR-TC
lbLEFT-ELEV A TOR-TC
hbLEFT-ELEV A TOR-TC
abLEFT-ELEV A TOR-TC
LEFT-ELEV A TOR-TC

Format: 20
Class
SV

V ID/SV ID
14

UNITS
micron

Structure


Max Characters
4

DESCRIPTION
Current lef t elevator pressure
Low est lef t elevator pressure on last w af er implant
Highest lef t elevator pressure on last w af er implant
A verage lef t elevator pressure on last w af er implant
Low est lef t elevator pressure on last batch implant
Highest lef t elevator pressure on last batch implant
A verage lef t elevator pressure on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The left elevator pressure as measured by its thermocouple pressure gauge. Units are microns. Reading above 2000
microns should be considered unreliable because the gauge cannot reliably measure pressures between 2000 microns
and atmosphere.

LEFT-ORIENTER-LIFTER-DAC
DVNAME
LEFT-ORIENTER-LIFTER-DAC

Format
Class
DV

VID/DVID
808

UNITS
encoder cnts

Structure


: 20

Max Characters
8

Left orienter lifter position in raw encoder counts.

LENS-I

Format: 20
SV NA ME
LENS-I

Class
SV

V ID/SV ID
46

UNITS
amp

Structure


Max Characters
5

SV ID
46
1046
2046
3046
4046
5046
6046
7046

SV NA ME
LENS-I
lw LENS-I
hw LENS-I
aw LENS-I
lbLENS-I
hbLENS-I
abLENS-I
LENS-I

DESCRIPTION
Current lens magnet current
Low est lens magnet current on last w af er implant
Highest lens magnet current on last w af er implant
A verage lens magnet current on last w af er implant
Low est lens magnet current on last batch implant
Highest lens magnet current on last batch implant
A veragelens magnet current on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Current in the lens magnet in amps.

LENS-VOLTS

Format: 20

SV NA ME
LENS-VOLT S

SV ID
70
1070
2070
3070
4070
5070
6070
7070

SV NA ME
LENS-V OLTS
lw LENS-V OLTS
hw LENS-V OLTS
aw LENS-V OLTS
lbLENS-V OLTS
hbLENS-V OLTS
abLENS-V OLTS
LENS-V OLTS

Class
SV

V ID/SV ID
70

UNITS
Kvolt s

Structure


Max Characters
5

DESCRIPTION
Current lens magnet voltage
Low est lens magnet voltage on last w af er implant
Highest lens magnet voltage on last w af er implant
A verage lens magnet voltage on last w af er implant
Low est lens magnet voltage on last batch implant
Highest lens magnet voltage on last batch implant
A verage lens magnet voltage on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Lens magnet voltage in kilovolts.

LPT SMIF Ctl Status
SV NA ME
Left SMIF1 Ct l St at us
Right SMIF 2 Ct l St at us




: U1

Max Characters
20
20

ECV 8x40,
ALED 8x41
>
 : Not available

LPT SMIF Ctl ARMTYPE
SV NA ME
Left SMIF1 Ct l ARMT YP E
Right SMIF 2 Ct l ARMT YP E

Value
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14

Format
Class
SV
SV

V ID/SV ID
8102
8202

UNITS
none
none

Structure



: U1

Max Characters
1
1

Arm Type
Arm 1000 V
Arm 1000 H Bar Towards
Arm 1000 H Bar Away
2000 Outside Move
2000 Inside Move
Arm 3000 V
Arm 3000 H Bar Towards
Arm 3000 H Bar Away
ALU 2000
Other Configuration
ALU 2200
Arm 2200 Outside V Move
Arm 2200 Inside V Move
Arm 2200 Outside H Move
Arm 2200 Inside H Move

LPT SMIF ARM SW
SV NA ME
Left SMIF1 ARM SW
Right SMIF 2 ARM SW

Format
Class
SV
SV

V ID/SV ID
8103
8203

UNITS
none
none

Structure



:A

Max Characters
20
20

LPT Arm software part number in 20 byte format.

LPT SMIF COLST
SV NA ME
Left SMIF1 COLST
Right SMIF 2 COLST

Value
1
2
3
4

Format
Class
SV
SV

V ID/SV ID
8104
8204

Collision Status
No Collision
Collision
Improper squat in cassette pickup during load
Improper squat in cassette place during load

UNITS
none
none

Structure



: U1

Max Characters
1
1

5
6
7

Improper squat in cassette pickup during unload
Improper squat in cassette place during unload
Improper wafer seating

LPT SMIF COUNT
SV NA ME
Left SMIF1 COUNT
Right SMIF 2 COUNT

Format
Class
SV
SV

V ID/SV ID
8105
8205

UNITS
count s
count s

Structure



: U2

Max Characters
1
1

(RESERVED, NOT USED)
The LPT SMIF count for Move Distance (n).

LPT SMIF DIPSW
SV NA ME
Left SMIF1 DIP SW
Right SMIF 2 DIP SW

Format
Class
SV
SV

V ID/SV ID
8106
8206

UNITS
none
none

Structure



: U1

Max Characters
1
1

Dip switch setting on the arm controller board.

LPT SMIF ELDN
SV NA ME
Left SMIF1 ELDN
Right SMIF 2 ELDN

Format
Class
SV
SV

V ID/SV ID
8107
8207

UNITS
none
none

Structure



: U1

Max Characters
1
1

Elevator platform flag
0 - Elevator not at down limit
1 - Elevator at down limit
 - Not available

LPT SMIF ELPOS
SV NA ME
Left SMIF1 ELP OS
Right SMIF 2 ELP OS

Elevator position
0 - Elevator at home position
xx - steps away from the home position
 - Not available

Format
Class
SV
SV

V ID/SV ID
8108
8208

UNITS
none
none

Structure



: U2

Max Characters
1
1

LPT SMIF ELUP
SV NA ME
Left SMIF1 ELUP
Right SMIF 2 ELUP

Format
Class
SV
SV

V ID/SV ID
8109
8209

UNITS
none
none

Structure



: U1

Max Characters
1
1

Elevator UP flag
0 - Elevator not at UP limit
1 - Elevator at UP limit
 - Not available

LPT SMIF FUNC
SV NA ME
Left SMIF1 FUNC
Right SMIF 2 FUNC

Format
Class
SV
SV

V ID/SV ID
8110
8210

UNITS
none
none

Structure



: U1

Max Characters
1
1

Function being done by the arm
0 - Idle
1 - Load/Open in progress
2 - Unload/Close in progress
3 - Auto Home in progress
 - Not available

LPT SMIF Full Status
SV NA ME
Left SMIF1 Full St at us
Right SMIF 2 Full St at us




Max Characters
1
1

:0

DIPSW 8x06,
ARMTYP 8x02,
ECV 08x40,
ALED 08x41
>




>
 - Not available

LPT SMIF GPST
SV NA ME
Left SMIF1 GP ST
Right SMIF 2 GP ST

Format
Class
SV
SV

V ID/SV ID
8111
8211

UNITS
none
none

Structure



: U1

Max Characters
1
1

Gripper Status
0 - Gripper Open
1 - Gripper Closed with Cassette
2 - Gripper Closed without Cassette
3 - None of the above
 - Not available

LPT SMIF HOMEST
SV NA ME
Left SMIF1 HOMEST
Right SMIF 2 HOMEST

Format
Class
SV
SV

V ID/SV ID
8112
8212

UNITS
none
none

Structure



: U1

Max Characters
1
1

Arm Home Status
0 - Arm not at home
1 - Arm at Home
 - Not available

LPT SMIF LFUNC
SV NA ME
Left SMIF1 LFUNC
Right SMIF 2 LFUNC

Format
Class
SV
SV

Last Function done
0 - Switched to manual/power up with manual
1 - Switched to auto/power up with auto mode
11 - Load/Open
12 - Unload/Close
13 - Auto Home
 - Not available

V ID/SV ID
8113
8213

UNITS
none
none

Structure



: U1

Max Characters
1
1

LPT SMIF MARMDN
SV NA ME
Left SMIF1 MARMDN
Right SMIF 2 MARMDN

Format
Class
SV
SV

V ID/SV ID
8114
8214

UNITS
none
none

Structure



: U1

Max Characters
1
1

Moving arm down flag
0 - Moving arm not at down limit
1 - Moving arm at down limit
 - Not available

LPT SMIF MARMPOS
SV NA ME
Left SMIF1 MARMP OS
Right SMIF 2 MARMP OS

Format
Class
SV
SV

V ID/SV ID
8115
8215

UNITS
count
count

Structure



: U2

Max Characters
1
1

(RESERVED, NOT USED)
Moving arm position
0 - Arm at home position
xx - Steps away from home position
 - Not available

LPT SMIF MARMUP
SV NA ME
Left SMIF1 MARMUP
Right SMIF 2 MARMUP

Format
Class
SV
SV

V ID/SV ID
8116
8216

UNITS
none
none

Structure



: U1

Max Characters
1
1

Moving arm up flag
0 - Moving arm not at UP limit
1 - Moving arm at UP limit
 - Not available

LPT SMIF SWITCH MODE
SV NA ME
Left SMIF1 SW IT CH MODE
Right SMIF 2 SW IT CH MODE

Format
Class
SV
SV

Switch Position on maintenance control panel
1- Auto mode
2 - Manual mode
 - Not available

V ID/SV ID
8117
8217

UNITS
none
none

Structure



: U1

Max Characters
1
1

LPT SMIF MOT
SV NA ME
Left SMIF1 MOT
Right SMIF 2 MOT

Format
Class
SV
SV

V ID/SV ID
8118
8218

UNITS
none
none

Structure



: U1

Max Characters
1
1

(RESERVED, NOT USED)
Motor id code
1 - Elevator motor
 - Not available

LPT SMIF MVSTAT
SV NA ME
Left SMIF1 MVST AT
Right SMIF 2 MVST AT

Format
Class
SV
SV

V ID/SV ID
8119
8219

UNITS
none
none

Structure



: U1

Max Characters
1
1

(RESERVED, NOT USED)
Motor move status
1 - Move motor
2 - Stop motor
 - Not available

LPT SMIF PIO LOCK
SV NA ME
Left SMIF1 P IO LOCK
Right SMIF 2 P IO LOCK

Format
Class
SV
SV

V ID/SV ID
8120
8220

UNITS
none
none

Structure



: U1

Max Characters
1
1

Parallel Interface Pod lock switch position
0 - Inactive
1 – Active
 - Not available

LPT SMIF PIO LRDY
SV NA ME
Left SMIF1 P IO LRDY
Right SMIF 2 P IO LRDY

Parallel Interface Host Ready to Load Line
0 - Inactive
1 – Active
 - Not available

Format
Class
SV
SV

V ID/SV ID
8121
8221

UNITS
none
none

Structure



: U1

Max Characters
1
1

LPT SMIF PIO LU
SV NA ME
Left SMIF1 P IO LU
Right SMIF 2 P IO LU

Format
Class
SV
SV

V ID/SV ID
8122
8222

UNITS
none
none

Structure



: U1

Max Characters
1
1

Parallel Interface Load / Unload Line
0 - Inactive
1 – Active
 - Not available

LPT SMIF PIO URDY
SV NA ME
Left SMIF1 P IO URDY
Right SMIF 2 P IO URDY

Format
Class
SV
SV

V ID/SV ID
8123
8223

UNITS
none
none

Structure



: U1

Max Characters
1
1

Parallel Interface Host Ready to Unload Line
0 - Inactive
1 – Active
 - Not available

LPT SMIF PIP
SV NA ME
Left SMIF1 P IP
Right SMIF 2 P IP

Format
Class
SV
SV

V ID/SV ID
8124
8224

UNITS
none
none

Structure



: U1

Max Characters
1
1

Pod in place state
0 - No pod present
1 - Pod present
 - Not available

LPT SMIF PLDN
SV NA ME
Left SMIF1 P LDN
Right SMIF 2 P LDN

Arm platform down flag
0 - Platform not at down limit
1 - Platform at down limit
 - Not available

Format
Class
SV
SV

V ID/SV ID
8125
8225

UNITS
none
none

Structure



: U1

Max Characters
1
1

LPT SMIF PLPOS
SV NA ME
Left SMIF1 P LP OS
Right SMIF 2 P LP OS

Format
Class
SV
SV

V ID/SV ID
8126
8226

UNITS
none
none

Structure



: U2

Max Characters
1
1

Arm platform position
0 - Arm platform at home position
xx - steps away from home position
 - Not available

LPT SMIF PRTST
SV NA ME
Left SMIF1 P RT ST
Right SMIF 2 P RT ST

Format
Class
SV
SV

V ID/SV ID
8127
8227

UNITS
none
none

Structure



: U1

Max Characters
1
1

SMIF Port Status
0 - port unlock
1 - port locked
2 - none of the above
 - Not available

LPT SMIF RDYST
SV NA ME
Left SMIF1 RDYST
Right SMIF 2 RDYST

Format
Class
SV
SV

V ID/SV ID
8128
8228

UNITS
none
none

Structure



: U1

Max Characters
1
1

Arm Ready status
0 - Arm not ready
1 - Arm ready to load/open
2 - Arm ready to unload/close
3 - Arm ready to load / unload
4 - Arm ready to auto home
 - Not available

LPT SMIF SWPOS
SV NA ME
Left SMIF1 SW P OS
Right SMIF 2 SW P OS

Load /unload switch position
0 - All positions
n - Position n
 - Not available

Format
Class
SV
SV

V ID/SV ID
8129
8229

UNITS
none
none

Structure



: U1

Max Characters
1
1

LPT SMIF TLTDN
SV NA ME
Left SMIF1 T LT DN
Right SMIF 2 T LT DN

Format
Class
SV
SV

V ID/SV ID
8130
8230

UNITS
none
none

Structure



: U1

Max Characters
1
1

(RESERVED, NOT USED)
Gripper tilt down flag
0 - Gripper tilt not at down limit
1 - Gripper tilt at down limit
 - Not available

LPT SMIF TLTPOS
SV NA ME
Left SMIF1 T LT P OS
Right SMIF 2 T LT P OS

Format
Class
SV
SV

V ID/SV ID
8131
8231

UNITS
count
count

Structure



: U2

Max Characters
1
1

Gripper tilt position
0 - Tilt at home position
xx - steps away from the home position
 - Not available

LPT SMIF TLTUP
SV NA ME
Left SMIF1 T LT UP
Right SMIF 2 T LT UP

Format
Class
SV
SV

V ID/SV ID
8132
8232

UNITS
none
none

Structure



: U1

Max Characters
1
1

Gripper tilt UP flag
0 - Gripper tilt not at UP limit
1 - Gripper tilt at UP limit
 - Not available

LPT SMIF XPOS
SV NA ME
Left SMIF1 XP OS
Right SMIF 2 XP OS

Format
Class
SV
SV

V ID/SV ID
8133
8233

X Coordinate of gripper
0 - Horizontal position of gripper is at home
nn - gripper is nn mils (1/1000 of in.) away from home
 - Not available

UNITS
none
none

Structure



: U2

Max Characters
1
1

LPT SMIF YPOS
SV NA ME
Left SMIF1 YP OS
Right SMIF 2 YP OS

Format
Class
SV
SV

V ID/SV ID
8134
8234

UNITS
none
none

Structure



: U2

Max Characters
1
1

Y Coordinate of gripper
0 - Horizontal position of gripper is at home
nn - gripper is nn mils(1/1000 of in.) away from home
 - Not available

LPT SMIF Position
SV NA ME
Left SMIF1 P osit ion
Right SMIF 2 P osit ion

Format
Class
SV
SV

V ID/SV ID
8135
8235

UNITS
none
none

Structure



: U2

Max Characters
4
4


 - Not available

LPT SMIF PIO Status
SV NA ME
Left SMIF1 P IO St at us
Right SMIF 2 P IO St at us

Format
Class
SV
SV

V ID/SV ID
8136
8236

UNITS
none
none

Structure



: U1

Max Characters
4
4


 - Not available

LPT SMIF Wafer Map
SV NA ME
Left SMIF1 W afer Map
Right SMIF 2 W afer Map

Format
Class
SV
SV

V ID/SV ID
8137
8237

UNITS
none
none


 - Not available
The slotx_status value may be returned as one of the following values:
0x00 – No wafer detected
0x01 – Wafer detected
0x02 – Cross slot detected

Structure



: U1

Max Characters
25
25

LPT SMIF Wafer Count
SV NA ME
Left SMIF1 W afer Count
Right SMIF 2 W afer Count

Format
Class
SV
SV

V ID/SV ID
8138
8238

UNITS
none
none

Structure



: U1

Max Characters
1
1

n - Wafer Count in Cassette handled by the SMIF LPT.
 - Not available

LPT SMIF PLUP
SV NA ME
Left SMIF1 P LUP
Right SMIF 2 P LUP

Format
Class
SV
SV

V ID/SV ID
8139
8239

UNITS
none
none

Structure



: U1

Max Characters
1
1

Vertical LPT positive over-travel status
0 - Vertical arm not at positive over-travel
1 - Vertical arm at positive over-travel
 - Not available

LPT SMIF ECV
SV NA ME
Left SMIF1 ECV
Right SMIF 2 ECV

Format
Class
SV
SV

V ID/SV ID
8140
8240

UNITS
none
none

Structure



: U1

Max Characters
1
1

ECV EQUIPMENT CONSTANT VALUE
0 - Do not report
1 - Report
 - Not available

LPT SMIF ALED
SV NA ME
Left SMIF1 ALED
Right SMIF 2 ALED

Format
Class
SV
SV

V ID/SV ID
8141
8241

UNITS
none
none

Structure



: U1

Max Characters
1
1

Where used: S1F3, F11, F12, S2F23
ALED Alarm Enable/Disable Code
Bit 8 = 1: Enable Alarm
Bit 8 = 0: Disable Alarm
 - Not available

MAG-I

Format

: 20

SV NA ME
MAG-I

SV ID
27
1027
2027
3027
4027
5027
6027
7027

SV NA ME
MA G-I
lw MA G-I
hw MA G-I
aw MA G-I
lbMA G-I
hbMA G-I
abMA G-I
MA G-I

Class
SV

V ID/SV ID
27

UNITS
amp

Structure


Max Characters
5

DESCRIPTION
Current source magent current
Low est source magent current on last w af er implant
Highest source magent current on last w af er implant
A verage source magent current on last w af er implant
Low est source magent current on last batch implant
Highest source magent current on last batch implant
A verage source magent current on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Source magnet current in amperes.

MAG-VOLTS

Format

SV NA ME
MAG-VOLT S

SV ID
67
1067
2067
3067
4067
5067
6067
7067

SV NA ME
MA G-V OLTS
lw MA G-V OLTS
hw MA G-V OLTS
aw MA G-V OLTS
lbMA G-V OLTS
hbMA G-V OLTS
abMA G-V OLTS
MA G-V OLTS

Class
SV

V ID/SV ID
67

UNITS
Kvolt s

Structure


: 20

Max Characters
4

DESCRIPTION
Current source magent voltage
Low est source magent voltage on last w af er implant
Highest source magent voltage on last w af er implant
A verage source magent voltage on last w af er implant
Low est source magent voltage on last batch implant
Highest source magent voltage on last batch implant
A verage source magent voltage on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Source magnet voltage in kilovolts.

MDLN

Format
SVNAME
MDLN

Class
SV

VID/SVID
507

UNITS
None

Structure


:A

Max Characters
4

GEM compliant equipment constant for the machine. This value is ‘E220’ by default.

MIR-I

Format
SV NA ME
MIR-I

Class
SV

V ID/SV ID
41

UNITS
mamp

Structure


: 20

Max Characters
5

SV ID
41
1041
2041
3041
4041
5041
6041
7041

SV NA ME
MIR-I
lw MIR-I
hw MIR-I
aw MIR-I
lbMIR-I
hbMIR-I
abMIR-I
MIR-I

DESCRIPTION
Current mirror current
Low est mirror current on last w af er implant
Highest mirror current on last w af er implant
A verage mirror current on last w af er implant
Low est mirror current on last batch implant
Highest mirror current on last batch implant
A verage mirror current on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The current output of the mirror supply in milliamps.

MIR-SHUNT-I

Format: 20

SV NA ME
MIR-SHUNT -I

SV ID
42
1042
2042
3042
4042
5042
6042
7042

SV NA ME
MIR-SHUNT-I
lw MIR-SHUNT-I
hw MIR-SHUNT-I
aw MIR-SHUNT-I
lbMIR-SHUNT-I
hbMIR-SHUNT-I
abMIR-SHUNT-I
MIR-SHUNT-I

Class
SV

V ID/SV ID
42

UNITS
mamp

Structure


Max Characters
5

DESCRIPTION
Current mirror shunt current
Low est mirror shunt current on last w af er implant
Highest mirror shunt current on last w af er implant
A verage mirror shunt current on last w af er implant
Low est mirror shunt current on last batch implant
Highest mirror shunt current on last batch implant
A verage mirror shunt current on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The current flowing into the shunt regulator in the mirror supply in milliamps. The net current in the supply is (MIR-I) minus
(MIR-SHUNT-I) and can be negative when running decel mode.

MIR-VOLTS

Format

SV NA ME
MIR-VOLT S

SV ID
40
1040
2040
3040
4040
5040
6040
7040

SV NA ME
MIR-V OLTS
lw MIR-V OLTS
hw MIR-V OLTS
aw MIR-V OLTS
lbMIR-V OLTS
hbMIR-V OLTS
abMIR-V OLTS
MIR-V OLTS

Class
SV

V ID/SV ID
40

UNITS
volt s

Structure


: 20

Max Characters
4

DESCRIPTION
Current mirror voltage
Low est mirror voltage on last w af er implant
Highest mirror voltage on last w af er implant
A verage mirror voltage on last w af er implant
Low est mirror voltage on last batch implant
Highest mirror voltage on last batch implant
A verage mirror voltage on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The voltage on the beam filter electrode(mirror) when running double charged ions. The same supply is connected to the
accel column and used to decelerate the ion beam when running in decel mode.

Q1-I

Format

: 20

SV NA ME
Q1-I

SV ID
43
1043
2043
3043
4043
5043
6043
7043

SV NA ME
Q1-I
lw Q1-I
hw Q1-I
aw Q1-I
lbQ1-I
hbQ1-I
abQ1-I
Q1-I

Class
SV

V ID/SV ID
43

UNITS
amp

Structure


Max Characters
4

DESCRIPTION
Current f irst quadrupole magnet current
Low est f irst quadrupole magnet current on last w af er implant
Highest f irst quadrupole magnet current on last w af er implant
A verage f irst quadrupole magnet current on last w af er implant
Low est f irst quadrupole magnet current on last batch implant
Highest f irst quadrupole magnet current on last batch implant
A verage f irst quadrupole magnet current on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The current in the first quadrupole magnet in amps.

Q1-VOLTS

Format
SV NA ME
Q1-VOLT S

SV ID
68
1068
2068
3068
4068
5068
6068
7068

SV NA ME
Q1-V OLTS
lw Q1-V OLTS
hw Q1-V OLTS
aw Q1-V OLTS
lbQ1-V OLTS
hbQ1-V OLTS
abQ1-V OLTS
Q1-V OLTS

Class
SV

V ID/SV ID
68

UNITS
Kvolt s

Structure


: 20

Max Characters
4

DESCRIPTION
Current f irst quadrupole magnet voltage
Low est f irst quadrupole magnet voltage on last w af er implant
Highest f irst quadrupole magnet voltage on last w af er implant
A verage f irst quadrupole magnet voltage on last w af er implant
Low est f irst quadrupole magnet voltage on last batch implant
Highest f irst quadrupole magnet voltage on last batch implant
A verage f irst quadrupole magnet voltage on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Quadrupole 1 magnet voltage in kilovolts.

Q2-I

Format
SV NA ME
Q2-I

SV ID
44
1044
2044
3044
4044
5044
6044
7044

SV NA ME
Q2-I
lw Q2-I
hw Q2-I
aw Q2-I
lbQ2-I
hbQ2-I
abQ2-I
Q2-I

Class
SV

V ID/SV ID
44

UNITS
amp

Structure


: 20

Max Characters
4

DESCRIPTION
Current second quadrupole magnet current
Low est second quadrupole magnet current on last w af er implant
Highest second quadrupole magnet current on last w af er implant
A verage second quadrupole magnet current on last w af er implant
Low est second quadrupole magnet current on last batch implant
Highest second quadrupole magnet current on last batch implant
A verage second quadrupole magnet current on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The current in the second quadrupole magnet in amps.

Q2-VOLTS

Format

: 20

SV NA ME
Q2-VOLT S

SV ID
69
1069
2069
3069
4069
5069
6069
7069

Class
SV

SV NA ME
Q2-V OLTS
lw Q2-V OLTS
hw Q2-V OLTS
aw Q2-V OLTS
lbQ2-V OLTS
hbQ2-V OLTS
abQ2-V OLTS
Q2-V OLTS

V ID/SV ID
69

UNITS
Kvolt s

Structure


Max Characters
4

DESCRIPTION
Current second quadrupole magnet voltage
Low est second quadrupole magnet voltage on last w af er implant
Highest second quadrupole magnet voltage on last w af er implant
A verage second quadrupole magnet voltage on last w af er implant
Low est second quadrupole magnet voltage on last batch implant
Highest second quadrupole magnet voltage on last batch implant
A verage second quadrupole magnet voltage on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Quadrupole 2 magnet voltage in kilovolts.

RANGE-ARC

Format

SV NA ME
RANGE-ARC

SV ID
25
1025
2025
3025
4025
5025
6025
7025

Class
SV

SV NA ME
RA NGE-A RC
lw RA NGE-A RC
hw RA NGE-A RC
aw RA NGE-A RC
lbRA NGE-A RC
hbRA NGE-A RC
abRA NGE-A RC
RA NGE-A RC

Arc current unit.
RANGE-ARC
0
1
2
3
4

V ID/SV ID
25

UNITS
none

Structure


: 20

Max Characters
1

DESCRIPTION
Current arc range
Low est arc range on last w af er implant
Highest arc range on last w af er implant
A verage arc range on last w af er implant
Low est arc range on last batch implant
Highest arc range on last batch implant
A verage arc range on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Unit
Amperes
Milliamps
Milliamps
Milliamps
Microamps

RIGHT-CRYO-TEMP
SV NA ME
RIGHT -CRYO-T EMP

Format
Class
SV

V ID/SV ID
13

UNITS
Ko

Structure


: 20

Max Characters
3

SV ID
13
1013
2013
3013
4013
5013
6013
7013

SV NA ME
RIGHT-CRY O-TEMP
lw RIGHT-CRY O-TEMP
hw RIGHT-CRY O-TEMP
aw RIGHT-CRY O-TEMP
lbRIGHT-CRY O-TEMP
hbRIGHT-CRY O-TEMP
abRIGHT-CRY O-TEMP
RIGHT-CRY O-TEMP

DESCRIPTION
Current right cryo temperature
Low est right cryo temperature on last w af er implant
Highest right cryo temperature on last w af er implant
A verage right cryo temperature on last w af er implant
Low est right cryo temperature on last batch implant
Highest right cryo temperature on last batch implant
A verage right cryo temperature on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The temperature of the right elevator cryo pump.

RIGHT-ELEVATOR-TC
SV NA ME
RIGHT -ELEVAT OR-T C

SV ID
16
1016
2016
3016
4016
5016
6016
7016

SV NA ME
RIGHT-ELEV A TOR-TC
lw RIGHT-ELEV A TOR-TC
hw RIGHT-ELEV A TOR-TC
aw RIGHT-ELEV A TOR-TC
lbRIGHT-ELEV A TOR-TC
hbRIGHT-ELEV A TOR-TC
abRIGHT-ELEV A TOR-TC
RIGHT-ELEV A TOR-TC

Format
Class
SV

V ID/SV ID
16

UNITS
micron

Structure


: 20

Max Characters
4

DESCRIPTION
Current pressure inside right elevator
Low est pressure inside right elevator on last w af er implant
Highest pressure inside right elevator on last w af er implant
A verage pressure inside right elevator on last w af er implant
Low est pressure inside right elevator on last batch implant
Highest pressure inside right elevator on last batch implant
A verage pressure inside right elevator on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The pressure inside the right elevator.

SCANNER-PRESSURE
SV NA ME
SCANNER-P RESSURE

SV ID
7
1007
2007
3007
4007
5007
6007
7007

SV NA ME
SCA NNER-PRESSURE
lw SCA NNER-PRESSURE
hw SCA NNER-PRESSURE
aw SCA NNER-PRESSURE
lbSCA NNER-PRESSURE
hbSCA NNER-PRESSURE
abSCA NNER-PRESSURE
SCA NNER-PRESSURE

Format
Class
SV

V ID/SV ID
7

UNITS
T orr

Structure


: 20

Max Characters
6

DESCRIPTION
Current scanner CCIG reading
Low est scanner CCIG reading on last w af er implant
Highest scanner CCIG reading on last w af er implant
A verage scanner CCIG reading on last w af er implant
Low est scanner CCIG reading on last batch implant
Highest scanner CCIG reading on last batch implant
A verage scanner CCIG reading on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The readback from the CCIG mounted in the beamline just past the scan plates.

SCANNER-TURBO-SPEED
SV NA ME
SCANNER-T URBO-SP EED

Format
Class
SV

V ID/SV ID
10

UNITS
%

Structure


: 20

Max Characters
2

SV ID
10
1010
2010
3010
4010
5010
6010
7010

SV NA ME
SCA NNER-TURBO-SPEED
lw SCA NNER-TURBO-SPEED
hw SCA NNER-TURBO-SPEED
aw SCA NNER-TURBO-SPEED
lbSCA NNER-TURBO-SPEED
hbSCA NNER-TURBO-SPEED
abSCA NNER-TURBO-SPEED
SCA NNER-TURBO-SPEED

DESCRIPTION
Current scanner turbo speed
Low est scanner turbo speed on last w af er implant
Highest scanner turbo speed on last w af er implant
A verage scanner turbo speed on last w af er implant
Low est scanner turbo speed on last batch implant
Highest scanner turbo speed on last batch implant
A verage scanner turbo speed on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The speed of the scanner turbo pump.

SMIF1 Controls
SV NA ME
SMIF1 Cont rols

Format
Class
SV

V ID/SV ID
8001

UNITS
none

Structure


: U1

Max Characters
1

The control mode for LPT units.
1 Manual
2 SEMI-Auto
3 FULL AUTO

SMIF Port ID
SV NA ME
SMIF P ort ID

Format
Class
SV

V ID/SV ID
8000

UNITS
none

Structure


: U1

Max Characters
1

Defines the SMIF unit port ID. This variable may be linked to SMIF-related CEID event reports to
determine which side the event was generated on.
1 – Left SMIF
2 – Right SMIF
This is also used for the material identification bar code reader. This SVID reports the side where the event occurs.
1 - left
2 - right

SMIF Tool

Format
SV NA ME
SMIF T ool

Class
SV

V ID/SV ID
8002

UNITS
none

Structure


: U1

Max Characters
1

The SMIF tool in use. Use these status variables in reports generated by a SMIF CEID to determine which tool originated
the report.
1 tool 1
2 tool 2

SOFTREV

Format
SVNAME
SP FT REV

Class
SV

VID/SVID
508

UNITS
None

Structure


:A

Max Characters
6

SOFTREV is the GEM compliant software version number. This will display the current software revision installed on the
implanter.

SOURCE-PRESSURE
SV NA ME
SOURCE-P RESSURE

SV ID
0
1006
2006
3006
4006
5006
6006
7006

SV NA ME
SOURCE-PRESSURE
lw SOURCE-PRESSURE
hw SOURCE-PRESSURE
aw SOURCE-PRESSURE
lbSOURCE-PRESSURE
hbSOURCE-PRESSURE
abSOURCE-PRESSURE
SOURCE-PRESSURE

Format
Class
SV

V ID/SV ID
6

UNITS
T orr

Structure


: 20

Max Characters
6

DESCRIPTION
Current source CCIG reading
Low est source CCIG reading on last w af er implant
Highest source CCIG reading on last w af er implant
A verage source CCIG reading on last w af er implant
Low est source CCIG reading on last batch implant
Highest source CCIG reading on last batch implant
A verage source CCIG reading on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The readback from the source cold cathode ion gauge in units of Torr. The format: is either "X.XE- X" or "OFF" if the ion
gauge is not operating.

SOURCE-TURBO-SPEED
SV NA ME
SOURCE-T URBO-SP EED

SV ID
9
1009
2009
3009
4009
5009
6009
7009

SV NA ME
SOURCE-TURBO-SPEED
lw SOURCE-TURBO-SPEED
hw SOURCE-TURBO-SPEED
aw SOURCE-TURBO-SPEED
lbSOURCE-TURBO-SPEED
hbSOURCE-TURBO-SPEED
abSOURCE-TURBO-SPEED
SOURCE-TURBO-SPEED

Format
Class
SV

V ID/SV ID
9

UNITS
%

Structure


: 20

Max Characters
2

DESCRIPTION
Current source turbo speed
Low est source turbo speed on last w af er implant
Highest source turbo speed on last w af er implant
A verage source turbo speed on last w af er implant
Low est source turbo speed on last batch implant
Highest source turbo speed on last batch implant
A verage source turbo speed on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The speed of the source turbo pump as a percentage of full speed. The turbo speeds are used as an indicator of the
roughing pressure and determine when the CCIG’s will be turned on.

SUP-VOLTS
SV NA ME
SUP -VOLT S

Format
Class
SV

V ID/SV ID
30

UNITS
kvolt s

Structure


: 20

Max Characters
5

SV ID
30
1030
2030
3030
4030
5030
6030
7030

SV NA ME
SUP-V OLTS
lw SUP-V OLTS
hw SUP-V OLTS
aw SUP-V OLTS
lbSUP-V OLTS
hbSUP-V OLTS
abSUP-V OLTS
SUP-V OLTS

DESCRIPTION
Current extraction supply voltage
Low est extraction supply voltage on last w af er implant
Highest extraction supply voltage on last w af er implant
A verage extraction supply voltage on last w af er implant
Low est extraction supply voltage on last batch implant
Highest extraction supply voltage on last batch implant
A verage extraction supply voltage on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Extraction electron suppression supply voltage in kilovolts.

SUP-I

Format
SV NA ME
SUP -I

SV ID
31
1031
2031
3031
4031
5031
6031
7031

SV NA ME
SUP-I
lw SUP-I
hw SUP-I
aw SUP-I
lbSUP-I
hbSUP-I
abSUP-I
SUP-I

Class
SV

V ID/SV ID
31

UNITS
mamp

Structure


: 20

Max Characters
4

DESCRIPTION
Current extraction suppression current
Low est extraction suppression current on last w af er implant
Highest extraction suppression current on last w af er implant
A verage extraction suppression current on last w af er implant
Low est extraction suppression current on last batch implant
Highest extraction suppression current on last batch implant
A verage extraction suppression current on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Extraction electron suppression supply current in milliamps.

TARGET-BIAS
SV NA ME
T ARGET -BIAS

SV ID
52
1052
2052
3052
4052
5052
6052
7052

SV NA ME
TA RGET-BIA S
lw TA RGET-BIA S
hw TA RGET-BIA S
aw TA RGET-BIA S
lbTA RGET-BIA S
hbTA RGET-BIA S
abTA RGET-BIA S
TA RGET-BIA S

Format
Class
SV

V ID/SV ID
52

UNITS
volt

Structure


: 20

Max Characters
5

DESCRIPTION
Current ES f araday electron suppression
Low est ES f araday electron suppression on last w af er implant
Highest ES f araday electron suppression on last w af er implant
A verage ES f araday electron suppression on last w af er implant
Low est ES f araday electron suppression on last batch implant
Highest ES f araday electron suppression on last batch implant
A verage ES f araday electron suppression on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

End station Faraday cup electron suppression voltage in volts. (only on machines without an electron flood gun!)
Note: The current readouts from the Faraday cups in the end station are hard to interpret because they are smaller than
the beam and the beam would not ordinarily be pointed at them most of the time so they are not provided as a status
variable.

TERM-DI-RETURN-TEMP

Format

: 20

SV NA ME
T ERM -DI-RET URN-T EM P

SV ID
77
1077
2077
3077
4077
5077
6077
7077

SV NA ME
TERM-DI-RETURN-TEMP
lw TERM-DI-RETURN-TEMP
hw TERM-DI-RETURN-TEMP
aw TERM-DI-RETURN-TEMP
lbTERM-DI-RETURN-TEMP
hbTERM-DI-RETURN-TEMP
abTERM-DI-RETURN-TEMP
TERM-DI-RETURN-TEMP

Clas s
SV

V ID/SV ID
77

UNITS
Celsius

Struc ture


Max Charac ters
3

DESCRIPTION
Current DI return temperature
Low est DI return temperature on last w af er implant
Highest DI return temperature on last w af er implant
A verage DI return temperature on last w af er implant
Low est DI return temperature on last batch implant
Highest DI return temperature on last batch implant
A verage DI return temperature on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Terminal DI Water Return Temperature.

TERMINAL-MEGOHMS
SV NA ME
T ERMINAL-MEGOHMS

SV ID
1
1001
2001
3001
4001
5001
6001
7001

SV NA ME
TERMINA L-MEGOHMS
lw TERMINA L-MEGOHMS
hw TERMINA L-MEGOHMS
aw TERMINA L-MEGOHMS
lbTERMINA L-MEGOHMS
hbTERMINA L-MEGOHMS
abTERMINA L-MEGOHMS
TERMINA L-MEGOHMS

Format
Class
SV

V ID/SV ID
1

UNITS
Mohm/cm

Structure


: 20

Max Characters
5

DESCRIPTION
Current terminal resistivity
Low est terminal resistivity on last w af er implant
Highest terminal resistivity on last w af er implant
A verage terminal resistivity on last w af er implant
Low est terminal resistivity on last batch implant
Highest terminal resistivity on last batch implant
A verage terminal resistivity on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The resistivity of the cooling water used to cool the terminal in Mohm-cm. Generally the value must exceed 2.00 Mohmcm. The water flows across the 180 KV gap to the terminal so high resistance is necessary to avoid drawing excessive
current from the high voltage supplies. Full scale: 9.99.

TERMINAL-WATER-TEMP
SV NA ME
T ERMINAL-W AT ER-T EMP

SV ID
3
1003
2003
3003
4003
5003
6003
7003

SV NA ME
TERMINA L-WA TER-TEMP
lw TERMINA L-WA TER-TEMP
hw TERMINA L-WA TER-TEMP
aw TERMINA L-WA TER-TEMP
lbTERMINA L-WA TER-TEMP
hbTERMINA L-WA TER-TEMP
abTERMINA L-WA TER-TEMP
TERMINA L-WA TER-TEMP

Format
Class
SV

V ID/SV ID
3

UNITS
Co

Structure


: 20

Max Characters
3

DESCRIPTION
Current cooling w ater temperature
Low est cooling w ater temperature on last w af er implant
Highest cooling w ater temperature on last w af er implant
A verage cooling w ater temperature on last w af er implant
Low est cooling w ater temperature on last batch implant
Highest cooling w ater temperature on last batch implant
A verage cooling w ater temperature on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

The temperature of the cooling water for the terminal in degrees centigrade. The control computer will shut down the
implanter if this or any other water circuit becomes too hot.

TIME

Format
SVNAME
T IME

Class
SV

VID/SVID
506

UNITS
None

Structure


:A

Max Characters
16

GEM compliant time format. Time will be displayed in the format YYYYMMDDHHMMSSCC.

VAP-TEMP

Format
SV NA ME
VAP -T EMP

SV ID
53
1053
2053
3053
4053
5053
6053
7053

SV NA ME
V A P-TEMP
lw V A P-TEMP
hw V A P-TEMP
aw V A P-TEMP
lbV A P-TEMP
hbV A P-TEMP
abV A P-TEMP
V A P-TEMP

Class
SV

V ID/SV ID
53

UNITS
Co

Structure


: 20

Max Characters
3

DESCRIPTION
Current vaporizer temperature
Low est vaporizer temperature on last w af er implant
Highest vaporizer temperature on last w af er implant
A verage vaporizer temperature on last w af er implant
Low est vaporizer temperature on last batch implant
Highest vaporizer temperature on last batch implant
A verage vaporizer temperature on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

For the vaporizer option. Vaporizer temperature is in degrees centigrade.

X-AXIS

Format
SV NA ME
X-AXIS

SV ID
32
1032
2032
3032
4032
5032
6032
7032

SV NA ME
X-A XIS
lw X-A XIS
hw X-A XIS
aw X-A XIS
lbX-A XIS
hbX-A XIS
abX-A XIS
X-A XIS

Class
SV

V ID/SV ID
32

UNITS
arb

Structure


: 20

Max Characters
3

DESCRIPTION
Current extraction electrode x axis position
Low est extraction electrode x axis position on last w af er implant
Highest extraction electrode x axis position on last w af er implant
A verage extraction electrode x axis position on last w af er implant
Low est extraction electrode x axis position on last batch implant
Highest extraction electrode x axis position on last batch implant
A verage extraction electrode x axis position on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Extraction electrode x axis position. The units are arbitrary and the values run from 0 to 999. The value 500 is the
approximate mechanical center.

Y-AXIS

Format
SV NA ME
Y-AXIS

Class
SV

V ID/SV ID
33

UNITS
arb

Structure


: 20

Max Characters
3

SV ID
33
1033
2033
3033
4033
5033
6033
7033

SV NA ME
Y -A XIS
lw Y -A XIS
hw Y -A XIS
aw Y -A XIS
lbY -A XIS
hbY -A XIS
abY -A XIS
Y -A XIS

DESCRIPTION
Current extraction electrode y axis position
Low est extraction electrode y axis position on last w af er implant
Highest extraction electrode y axis position on last w af er implant
A verage extraction electrode y axis position on last w af er implant
Low est extraction electrode y axis position on last batch implant
Highest extraction electrode y axis position on last batch implant
A verage extraction electrode y axis position on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Extraction electrode y axis position. The units are arbitrary and the values run from 0 to 999. The value 500 is the
approximate mechanical center.

Y-SIGMA

Format
SV NA ME
Y-SIGMA

Class
DV

V ID/SV ID
214

UNITS
0.01%

Structure


: 20

Max Characters
5

Obsolete.

Z-AXIS

Format
SV NA ME
Z-AXIS

SV ID
34
1034
2034
3034
4034
5034
6034
7034

SV NA ME
Z-AXIS
lw Z-A XIS
hw Z-A XIS
aw Z-A XIS
lbZ-A XIS
hbZ-A XIS
abZ-A XIS
Z-A XIS

Class
SV

V ID/SV ID
34

UNITS
arb

Structure


Max Characters
3

DESCRIPTION
Current extraction electrode z axis position
Low est extraction electrode z axis position on last w af er implant
Highest extraction electrode z axis position on last w af er implant
A verage extraction electrode z axis position on last w af er implant
Low est extraction electrode z axis position on last batch implant
Highest extraction electrode z axis position on last batch implant
A verage extraction electrode z axis position on last batch implant
Non-A SCII f ormatting available w ith V 11.05.05 and above

Extraction electrode z axis position. The units are arbitrary.

: 20



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