HP ProLiant DL180 Gen9 Server Maintenance And Service Guide Pro Liant
User Manual: HP ProLiant DL180 Gen9 shared.swissparts.ch - /Manuals/HP/Server/
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HP ProLiant DL180 Gen9 Server Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. This guide is for an experienced service technician. HP assumes that you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions. Part Number: 775438-003 March 2015 Edition: 3 © Copyright 2014, 2015 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries. Microsoft® and Windows® are trademarks of the Microsoft group of companies. microSD is a trademark or a registered trademark of SD-3C in the United States, other countries or both. Red Hat® is a registered trademark of Red Hat, Inc. in the United States and other countries. VMware® is a registered trademark of trademark of VMware, Inc. in the United States and/or other jurisdictions. Contents Customer self repair ...................................................................................................................... 6 Parts only warranty service ......................................................................................................................... 6 Illustrated parts catalog ............................................................................................................... 16 Mechanical components........................................................................................................................... 16 System components ................................................................................................................................. 19 Removal and replacement procedures ........................................................................................... 24 Required tools ......................................................................................................................................... 24 Safety considerations ............................................................................................................................... 24 Preventing electrostatic discharge .................................................................................................... 24 Symbols on equipment ................................................................................................................... 24 Server warnings and cautions ......................................................................................................... 25 Rack warnings .............................................................................................................................. 26 Preparation procedures ............................................................................................................................ 26 Remove the security bezel (optional) ................................................................................................ 27 Power down the server ................................................................................................................... 27 Extend the server from the rack........................................................................................................ 28 Access the product rear panel ......................................................................................................... 30 Remove the server from the rack ...................................................................................................... 30 Remove the PCI riser cages ............................................................................................................. 31 Remove the air baffle ..................................................................................................................... 32 Remove the fan cage ..................................................................................................................... 33 Non-hot-plug drive carrier ........................................................................................................................ 34 Non-hot-plug drive ................................................................................................................................... 34 Hot-plug drive blanks ............................................................................................................................... 35 Hot-plug drive ......................................................................................................................................... 36 Access panel .......................................................................................................................................... 37 4-bay and 8-bay LFF non-hot-plug drive cable assemblies ............................................................................. 38 4-bay and 8-bay LFF hot-plug drive backplanes ........................................................................................... 40 8-bay SFF hot-plug drive backplane ........................................................................................................... 42 HP Smart Storage Battery ......................................................................................................................... 43 FBWC module ........................................................................................................................................ 44 M.2 SSD enablement kit ........................................................................................................................... 46 Optical drive .......................................................................................................................................... 48 Fan and fan blank ................................................................................................................................... 49 Fan population guidelines............................................................................................................... 49 Fan blank ..................................................................................................................................... 50 Hot-swap fan ................................................................................................................................ 51 DIMM .................................................................................................................................................... 52 Heatsink ................................................................................................................................................. 53 Processor ............................................................................................................................................... 55 Expansion board ..................................................................................................................................... 59 Two-slot and three-slot PCIe riser boards ..................................................................................................... 60 FlexibleLOM riser board........................................................................................................................... 61 System battery ........................................................................................................................................ 63 Dedicated iLO management module .......................................................................................................... 66 Contents 3 Enabling the dedicated iLO management module .............................................................................. 67 Front I/O assemblies for LFF and SFF chassis using thumbscrew rack ears ...................................................... 68 Quick-release latch rack ear assembly........................................................................................................ 70 Pull tab cage for SFF chassis using quick-release latch rack ears .................................................................... 72 System board ......................................................................................................................................... 73 HP 550-W Power Supply (non-hot plug) ..................................................................................................... 82 Hot-plug power input module .................................................................................................................... 83 RPS backplane ........................................................................................................................................ 84 HP Trusted Platform Module ...................................................................................................................... 86 Troubleshooting .......................................................................................................................... 87 Troubleshooting resources ........................................................................................................................ 87 Diagnostic tools .......................................................................................................................... 88 Product QuickSpecs ................................................................................................................................. 88 HP iLO ................................................................................................................................................... 88 Active Health System...................................................................................................................... 89 HP ProLiant Pre-boot Health Summary ............................................................................................... 89 Integrated Management Log ........................................................................................................... 90 HP UEFI System Utilities ............................................................................................................................ 90 Using HP UEFI System Utilities ......................................................................................................... 90 Embedded Diagnostics option ......................................................................................................... 91 Re-entering the server serial number and product ID ........................................................................... 91 HP Insight Diagnostics .............................................................................................................................. 92 HP Insight Diagnostics survey functionality ........................................................................................ 92 HP Insight Remote Support ........................................................................................................................ 92 USB support ........................................................................................................................................... 92 External USB functionality ............................................................................................................... 93 HP Smart Storage Administrator ................................................................................................................ 93 Automatic Server Recovery ....................................................................................................................... 94 Component identification ............................................................................................................. 95 Front panel components ........................................................................................................................... 95 Serial label pull tab information ................................................................................................................ 96 Front panel LEDs and buttons .................................................................................................................... 97 Front panel LED power fault codes ................................................................................................... 98 Rear panel components ............................................................................................................................ 99 Rear panel LEDs .................................................................................................................................... 100 PCIe riser board slot definitions ............................................................................................................... 100 System board components ...................................................................................................................... 102 DIMM slot locations ..................................................................................................................... 104 System maintenance switch ........................................................................................................... 104 NMI functionality ......................................................................................................................... 105 Drive numbering ................................................................................................................................... 105 HP SmartDrive LED definitions ................................................................................................................. 106 Fan locations ........................................................................................................................................ 107 Cabling ................................................................................................................................... 108 Cabling overview .................................................................................................................................. 108 Storage cabling .................................................................................................................................... 108 4-bay LFF non-hot-plug SATA drive cabling ..................................................................................... 109 8-bay LFF non-hot-plug SATA drive cabling ..................................................................................... 109 8-bay LFF hot-plug SATA drive cabling ........................................................................................... 110 8-bay LFF hot-plug SAS/SATA drive cabling ................................................................................... 110 8-bay SFF hot-plug SATA drive cabling ........................................................................................... 111 Contents 4 8-bay SFF hot-plug SAS/SATA drive cabling ................................................................................... 112 16-bay SFF hot-plug SAS/SATA drive cabling ................................................................................. 113 M.2 SSD cabling ......................................................................................................................... 114 FBWC module backup power cabling...................................................................................................... 115 HP Smart Storage Battery cabling ............................................................................................................ 115 Optical drive cabling ............................................................................................................................. 116 Fan cabling .......................................................................................................................................... 116 GPU power drive cabling ....................................................................................................................... 117 FlexibleLOM sideband signal cabling ...................................................................................................... 117 Power supply cabling............................................................................................................................. 118 HP 550-W Power Supply cabling (non-hot-plug) .............................................................................. 118 HP Redundant Power Supply cabling (hot-plug) ............................................................................... 118 Front panel cabling ............................................................................................................................... 119 Specifications ........................................................................................................................... 122 Environmental specifications ................................................................................................................... 122 Mechanical specifications ...................................................................................................................... 122 Power supply specifications .................................................................................................................... 123 Hot-plug power supply calculations .......................................................................................................... 123 Acronyms and abbreviations ...................................................................................................... 124 Documentation feedback ........................................................................................................... 127 Index ....................................................................................................................................... 128 Contents 5 Customer self repair HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. • Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product. NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog. Based on availability and where geography permits, CSR parts will be shipped for next business day delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits. If assistance is required, you can call the HP Technical Support Center and a technician will help you over the telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material. Failure to return the defective part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping and part return costs and determine the courier/carrier to be used. For more information about HP's Customer Self Repair program, contact your local service provider. For the North American program, refer to the HP website (http://www.hp.com/go/selfrepair). Parts only warranty service Your HP Limited Warranty may include a parts only warranty service. Under the terms of parts only warranty service, HP will provide replacement parts free of charge. For parts only warranty service, CSR part replacement is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. Réparation par le client (CSR) Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR: Customer self repair 6 Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit. REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré. Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou le transporteur à utiliser. Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP (http://www.hp.com/go/selfrepair). Service de garantie "pièces seules" Votre garantie limitée HP peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de rechange fournies par HP ne sont pas facturées. Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. Riparazione da parte del cliente Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione. Vi sono due categorie di parti CSR: Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio. Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto. NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti. Customer self repair 7 In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare. Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair). Servizio di garanzia per i soli componenti La garanzia limitata HP può includere un servizio di garanzia per i soli componenti. Nei termini di garanzia del servizio per i soli componenti, HP fornirà gratuitamente le parti di ricambio. Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione da parte del cliente. Se il cliente invece richiede la sostituzione ad HP, dovrà sostenere le spese di spedizione e di manodopera per il servizio. Customer Self Repair HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt: Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet. Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen. HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das Customer self repair 8 defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst. Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter (http://www.hp.com/go/selfrepair). Parts-only Warranty Service (Garantieservice ausschließlich für Teile) Ihre HP Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice ausschließlich für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt HP Ersatzteile kostenlos zur Verfügung. Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet. Reparaciones del propio cliente Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías: • Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio. • Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto. NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el catálogo ilustrado de componentes. Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no Customer self repair 9 enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair). Servicio de garantía exclusivo de componentes La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes. Según las condiciones de este servicio exclusivo de componentes, HP le facilitará los componentes de repuesto sin cargo adicional alguno. Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por parte del usuario (CSR). Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio. Customer Self Repair Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee categorieën CSR-onderdelen: Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht. Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product. OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee". Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt. Customer self repair 10 Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair). Garantieservice "Parts Only" Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen. Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht. Reparo feito pelo cliente Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se, durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente. Existem duas categorias de peças CSR: Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado. Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis. A peça com defeito deve ser enviada com a documentação correspondente no material de transporte fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço postal a ser utilizado. Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP (http://www.hp.com/go/selfrepair). Serviço de garantia apenas para peças A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa. Customer self repair 11 No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. Customer self repair 12 Customer self repair 13 Customer self repair 14 Customer self repair 15 Illustrated parts catalog Mechanical components HP continually improves and changes product parts. For complete and current supported parts information, see the HP PartSurfer website (http://partsurfer.hp.com). Item Description Spare part number Customer self repair (on page 6) 1 Access panel 779087-001 Mandatory1 2 Pull tab cage for SFF drive models with quick-release latch rack ears Fan blank 785787-001 Optional2 779092-001 Mandatory1 3 Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. 2 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product. 3 No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog. 1 Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. 1 Illustrated parts catalog 16 Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit. 3 No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré. 2 Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio. 2 Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto. 3 No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un “No” nel Catalogo illustrato dei componenti. 1 Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet. 2 Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen. 3 No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. 1 Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio. 2 Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto. 3 No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes. 1 Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening. 2 Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product. 3 No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee". 1 Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. 2 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. 3 No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No” (Não), no catálogo de peças ilustrado. 1 Illustrated parts catalog 17 Illustrated parts catalog 18 System components HP continually improves and changes product parts. For complete and current supported parts information, see the HP PartSurfer website (http://partsurfer.hp.com). Item Description Spare part number Customer self repair (on page 6) 4 System battery 234556-001 Mandatory1 5 Three-slot PCIe riser board 779085-001 Mandatory1 6 Two-slot PCIe riser board 779084-001 Mandatory1 7 FlexibleLOM riser board 794360-001 Mandatory1 8 Dedicated iLO management module 779095-001 Mandatory1 9 SATA M.2 SSD single module enablement kit 797907-001 Optional2 a) M.2 SSD enablement board — — Illustrated parts catalog 19 Item Description Spare part number Customer self repair (on page 6) b) M.2 SSD module — — c) SATA cable* — — d) Low-profile board bracket* — — SATA M.2 SSD dual module enablement kit 797908-001 Optional2 a) M.2 SSD enablement board — — b) M.2 SSD modules (2) — — c) SATA cables (2) — — d) Low-profile board bracket* — — 11 HP RPS backplane 784636-001 Optional2 12 HP 800-W/900-W Gold AC Power Input Module 754376-001 Mandatory1 13 HP 550-W Power Supply (non-hot-plug) 766879-001 Optional2 14 Hot-swap fan 779093-001 Mandatory1 15 8-bay LFF hot-plug drive backplane 779083-001 Optional2 16 4-bay LFF hot-plug drive backplane 779096-001 Optional2 17 8-bay SFF hot-plug drive backplane 780971-001 Optional2 18 Front I/O assembly for LFF chassis using thumbscrew 779088-001 rack ears Front I/O assembly for SFF chassis using thumbscrew 779089-001 rack ears Quick-release latch rack ear assembly 779090-001 Optional2 4-bay LFF non-hot-plug drive cable assembly (includes 782466-001 Mini-SAS and drive power cables) 8-bay LFF non-hot-plug drive cable assembly (includes 782458-001 Mini-SAS and drive power cables) HP Smart Storage Battery 750450-001 Mandatory1 10 19 20 21 22 23 24 25 26 Optional2 Optional2 Mandatory1 Mandatory1 System board (include alcohol pad and thermal compound) DIMMs 779094-001 Optional2 — — a) 4 GB, single-rank x8 PC4-2133P-R* 804842-001 Mandatory1 b) 4 GB, single-rank x8 PC4-2133R-15 774169-001 Mandatory1 c) 8 GB, single-rank x4 PC4-2133R-15* 774170-001 Mandatory1 d) 8 GB, single-rank x8 PC4-2133P-R* 804843-001 Mandatory1 e) 8 GB, dual-rank x8 PC4-2133P-R* 774171-001 Mandatory1 f) 16 GB, dual-rank x4 PC4-2133R-15* 774172-001 Mandatory1 g) 16 GB, dual-rank x4 PC4-2133P-L* 774173-001 Mandatory1 h) 32 GB, dual-rank x4 PC4-2133P-R* 774175-001 Mandatory1 i) 32 GB, quad-rank x4 PC4-2133P-L* 774174-001 Mandatory1 Processors (include alcohol pad and thermal compound) a) 1.60-GHz Intel Xeon E5-2603 v3, 6C, 85 W — — 762441-001 Optional2 b) 1.80-GHz Intel Xeon E5-2630L v3, 8C, 55 W* 762459-001 Optional2 Illustrated parts catalog 20 Item Description Spare part number Customer self repair (on page 6) c) 1.80-GHz Intel Xeon E5-2650L v3, 12C, 65 W* 762461-001 Optional2 d) 1.90-GHz Intel Xeon E5-2609 v3, 6C, 85 W* 762443-001 Optional2 e) 2.30-GHz Intel Xeon E5-2650 v3, 10C, 105 W* 762448-001 Optional2 f) 2.40-GHz Intel Xeon E5-2620 v3, 6C, 85 W* 762445-001 Optional2 g) 2.40-GHz Intel Xeon E5-2630 v3, 8C, 85 W* 762446-001 Optional2 h) 2.60-GHz Intel Xeon E5-2640 v3, 8C, 90 W* 762447-001 Optional2 i) 2.60-GHz Intel Xeon E5-2660 v3, 10C, 105 W* 762449-001 Optional2 j) 3.00-GHz Intel Xeon E5-2623 v3, 4C, 105 W* 780762-001 Optional2 27 Heatsink 779091-001 Optional2 28 System cables — — 29 a) 4-bay LFF hot-plug Mini-SAS cable for connection 782464-001 to the onboard storage controller or to an HP H-series Host Bus Adapter* b) 4-bay or 12-bay LFF hot-plug Mini-SAS cable for an 782465-001 HP Smart Array P-series Controller* c) 8-bay LFF hot-plug Mini-SAS cable assembly* 782459-001 Mandatory1 Mandatory1 d) 8-bay LFF hot-plug Mini-SAS Y-cable* 782460-001 Mandatory1 e) 12-bay LFF drive identification signal cable* 782467-001 Mandatory1 f) 8-bay SFF hot-plug Mini-SAS cables* 782461-001 Mandatory1 g) 8-bay SFF hot-plug Mini-SAS Y-cable* 782462-001 Mandatory1 h) 20-pin power cable for LFF drive models* 782455-001 Mandatory1 i) 20-pin power cable for SFF drive models* 782453-001 Mandatory1 j) Optical drive SATA cable* 782457-001 Mandatory1 k) GPU power cable* 782456-001 Mandatory1 l) FlexibleLOM sideband signal cable* 789801-001 Mandatory1 Trusted Platform Module* 505836-001 No3 Mandatory1 * Not shown 1 Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. 2 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product. 3 No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog. Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. 2 Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit. 3 No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré. 1 Illustrated parts catalog 21 Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio. 2 Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto. 3 No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un “No” nel Catalogo illustrato dei componenti. 1 Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet. 2 Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen. 3 No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. 1 Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio. 2 Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto. 3 No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes. 1 Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening. 2 Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product. 3 No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee". 1 Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. 2 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. 3 No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No” (Não), no catálogo de peças ilustrado. 1 Illustrated parts catalog 22 Illustrated parts catalog 23 Removal and replacement procedures Required tools You need the following items for some procedures: • T-25 Torx screwdriver (to loosen the shipping screws located inside the server quick-release latch rack ears) • T-10/T-15 Torx screwdriver • Flathead screwdriver (for replacing the system battery) • HP Insight Diagnostics (on page 92) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device. To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers. • Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations. • Place parts on a grounded surface before removing them from their containers. • Avoid touching pins, leads, or circuitry. • Always be properly grounded when touching a static-sensitive component or assembly. Symbols on equipment The following symbols may be placed on equipment to indicate the presence of potentially hazardous conditions. This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel. WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel. Removal and replacement procedures 24 This symbol indicates the presence of electric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason. WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure. This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle. This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching. This symbol indicates that the component exceeds the recommended weight for one individual to handle safely. WARNING: To reduce the risk of personal injury or damage to the equipment, observe local occupational health and safety requirements and guidelines for manual material handling. These symbols, on power supplies or systems, indicate that the equipment is supplied by multiple sources of power. WARNING: To reduce the risk of injury from electric shock, remove all power cords to completely disconnect power from the system. Server warnings and cautions WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the equipment: • Observe local occupational health and safety requirements and guidelines for manual material handling. • Get help to lift and stabilize the product during installation or removal, especially when the product is not fastened to the rails. HP recommends that a minimum of two people are required for all rack server installations. A third person may be required to help align the server if the server is installed higher than chest level. • Use caution when installing the server in or removing the server from the rack; it is unstable when not fastened to the rails. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed. CAUTION: Protect the server from power fluctuations and temporary interruptions with a regulating uninterruptible power supply. This device protects the hardware from damage caused by power surges and voltage spikes and keeps the system in operation during a power failure. Removal and replacement procedures 25 CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. Rack warnings WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: • • • • • The leveling jacks are extended to the floor. The full weight of the rack rests on the leveling jacks. The stabilizing feet are attached to the rack if it is a single-rack installation. The racks are coupled together in multiple-rack installations. Only one component is extended at a time. A rack may become unstable if more than one component is extended for any reason. WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack: • At least two people are needed to safely unload the rack from the pallet. An empty 42U rack can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might become unstable when being moved on its casters. • Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle the rack from both sides. WARNING: To reduce the risk of personal injury or damage to the equipment, adequately stabilize the rack before extending a component outside the rack. Extend only one component at a time. A rack may become unstable if more than one component is extended. WARNING: When installing a server in a telco rack, be sure that the rack frame is adequately secured at the top and bottom to the building structure. Preparation procedures To access some components and perform certain service procedures, you must perform one or more of the following procedures: • Access the product front panel ("Remove the security bezel (optional)" on page 27). • Power down the server (on page 27). If you must remove a server from a rack or a non-hot-plug component from a server, power down the server. • Extend the server from the rack (on page 28). If you are performing service procedures in an HP, Compaq branded, Telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components. For more information about Telco rack solutions, see the RackSolutions website (http://www.racksolutions.com/hp-dl180-g9-rails.html). • Access the product rear panel (on page 30). • Remove the server from the rack (on page 30). Removal and replacement procedures 26 If the rack environment, cabling configuration, or the server location in the rack creates awkward conditions, remove the server from the rack. • Remove the PCI riser cages (on page 31). • Remove the air baffle (on page 32). • Remove the fan cage (on page 33). Remove the security bezel (optional) To access the front panel components, unlock and then remove the security bezel. The security bezel is only supported in servers that are using the quick-release latch rack ears. Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs. IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the system. To power down the server, use one of the following methods: • Press and release the Power On/Standby button. This method initiates a controlled shutdown of applications and the OS before the server enters standby mode. • Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter standby mode. This method forces the server to enter standby mode without properly exiting applications and the OS. If an application stops responding, you can use this method to force a shutdown. • Use a virtual power button selection through iLO 4. This method initiates a controlled remote shutdown of applications and the OS before the server enters standby mode. Removal and replacement procedures 27 Before proceeding, verify the server is in standby mode by observing that the system power LED is amber. Extend the server from the rack WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is adequately stabilized before extending a component from the rack. 1. If the rear panel cables are not secured by a cable management arm, do the following: a. Power down the server (on page 27). b. Disconnect all peripheral cables from the server. c. Disconnect each power cord from the server. 2. In a server that uses thumbscrew rack ears, loosen the captive thumbscrews that secure the server faceplate to the front of the rack, and then slide the server out of the rack. 3. In a server that uses quick-release latch rack ears: a. Open the latches on both sides of the server. b. If necessary, use a T-25 Torx screwdriver to loosen the shipping screws. Removal and replacement procedures 28 c. Slide the server out of the rack. 4. After performing the installation or maintenance procedure, slide the server back into the rack, and then press the server firmly into the rack to secure it in place. 5. Do one of the following: 6. o In a server that uses thumbscrew rack ears, tighten the captive thumbscrews. o In a server that uses quick-release latch rack ears, if necessary, tighten the shipping screws. If the rear panel cables were disconnected because a cable management arm is not in use, do the following: a. Connect each power cord to the server. b. Connect all peripheral cables to the server. c. Power up the server. Removal and replacement procedures 29 Access the product rear panel Opening the cable management arm To access the server rear panel: 1. Release the cable management arm. 2. Open the cable management arm. The cable management arm can be right-mounted or left-mounted. Remove the server from the rack Removal and replacement procedures 30 WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the equipment: • Observe local occupational health and safety requirements and guidelines for manual material handling. • Get help to lift and stabilize the product during installation or removal, especially when the product is not fastened to the rails. HP recommends that a minimum of two people are required for all rack server installations. A third person may be required to help align the server if the server is installed higher than chest level. • Use caution when installing the server in or removing the server from the rack; it is unstable when not fastened to the rails. To remove the server from an HP, Compaq-branded, Telco, or a third-party rack: 1. Power down the server (on page 27). 2. Extend the server on the rack rails until the server rail-release latches engage. 3. Disconnect all peripheral cables from the server. 4. Disconnect each power cord from the server. 5. Remove the server from the rack. For instructions on how to extend or remove the server from the rack, see the documentation that ships with the rack rail system. 6. Place the server on a sturdy, level surface. Remove the PCI riser cages WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to the server or expansion boards, power down the server, and disconnect all power cords before removing or installing the PCI riser cage. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. Remove the access panel ("Access panel" on page 37). 5. If the server was just extended from the rack and expansion boards with external cabling are installed on the PCI riser cage, disconnect all cables from the expansion boards to completely remove the cage from the server. 6. Lift the release tab, and then rotate it 180° counterclockwise. 7. Grasp the PCI riser cage at the touch points and lift it out of the chassis. Removal and replacement procedures 31 8. o Primary PCI riser cage o Secondary PCI riser cage If expansion boards with internal cabling are installed on the PCI riser cage, disconnect all internal cables from the expansion boards to completely remove the cage from the server. Remove the air baffle CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: Removal and replacement procedures 32 a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. Remove the access panel ("Access panel" on page 37). 5. If a full-length expansion board is installed on a PCI riser cage, remove the riser cage ("Remove the PCI riser cages" on page 31). 6. Remove the air baffle. Remove the fan cage To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. Remove the access panel ("Access panel" on page 37). 5. Remove the air baffle (on page 32). 6. Disconnect the fan cables. Removal and replacement procedures 33 7. Remove the fan cage. Non-hot-plug drive carrier CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27). 4. Remove the drive carrier. To replace the component, slide the component into the bay until it clicks. Non-hot-plug drive Removal and replacement procedures 34 CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Back up all server data on the drive. 2. Power down the server (on page 27). 3. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27). 5. Remove the non-hot-plug drive. 6. Remove the drive from the carrier. To replace the component, reverse the removal procedure. Hot-plug drive blanks CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27). 2. Remove the drive blank. Removal and replacement procedures 35 o Hot-plug LFF drive blank To replace the LFF drive blank, slide the component into the bay until it clicks. o Hot-plug SFF drive blank To replace the SFF drive blank, while pressing the release latch, slide the component into the bay until it is fully seated. Hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. Back up all server data on the drive. 2. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27). 3. Determine the status of the drive from the drive LED definitions ("HP SmartDrive LED definitions" on page 106). 4. Remove the hot-plug drive. Removal and replacement procedures 36 o Hot-plug LFF drive o Hot-plug SFF drive To replace the component, reverse the removal procedure. Access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. To remove the component: 1. Power down the server (on page 27). 2. If you are performing a non-hot-plug procedure, remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. Removal and replacement procedures 37 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. If the locking latch is locked, use a T-15 Torx screwdriver to unlock the latch. 5. Open the locking latch. The access panel slides back, releasing it from the chassis. 6. Lift and remove the access panel. To replace the component, reverse the removal procedure. 4-bay and 8-bay LFF non-hot-plug drive cable assemblies WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27). 4. Remove all drives ("Non-hot-plug drive" on page 34) and drive carriers ("Non-hot-plug drive carrier" on page 34). Removal and replacement procedures 38 5. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 6. Remove the access panel ("Access panel" on page 37). 7. If an expansion board is installed in the primary PCI riser cage, then remove the PCI riser cage ("Remove the PCI riser cages" on page 31). 8. Remove the air baffle (on page 32). 9. Remove the fan cage (on page 33). 10. Prepare the non-hot-plug drive cable assembly for removal: a. Disconnect the Mini-SAS and drive power cables from the system board. b. Release the Mini-SAS and drive power cables from the front chassis cable clips. — 4-bay LFF non-hot-plug drive cable disconnections — 8-bay LFF non-hot-plug drive cable disconnections Removal and replacement procedures 39 11. Remove the non-hot-plug drive cable assembly. o 4-bay LFF non-hot-plug drive cable assembly removal o 8-bay LFF non-hot-plug drive cable assembly removal To replace the component, reverse the removal procedure. 4-bay and 8-bay LFF hot-plug drive backplanes This procedure shows the removal of the 4-bay and 8-bay LFF drive backplanes from a 12-bay LFF hot-plug drive configuration. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. Removal and replacement procedures 40 CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27). 4. Remove all drives ("Hot-plug drive" on page 36). 5. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 6. Remove the access panel ("Access panel" on page 37). 7. Remove the air baffle (on page 32). 8. Remove the fan cage (on page 33). 9. Disconnect all cables from the drive backplane. 10. Remove the drive backplane. o 4-bay LFF hot-plug drive backplane removal Removal and replacement procedures 41 o 8-bay LFF hot-plug drive backplane removal To replace the component, reverse the removal procedure. 8-bay SFF hot-plug drive backplane WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27). 4. Remove all drives ("Hot-plug drive" on page 36). 5. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 6. Remove the access panel ("Access panel" on page 37). 7. Disconnect all cables from the drive backplane. Removal and replacement procedures 42 8. Remove the drive backplane. To replace the component, reverse the removal procedure. HP Smart Storage Battery WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. 4. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). Remove the access panel ("Access panel" on page 37). Removal and replacement procedures 43 5. Slightly pull up the battery holder from the chassis to access the battery cable connection underneath it, and then disconnect the HP Smart Storage Battery cable. 6. Remove the HP Smart Storage Battery from its holder. To replace the component, reverse the removal procedure. FBWC module WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up. Removal and replacement procedures 44 CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. 4. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). Remove the access panel ("Access panel" on page 37). CAUTION: When connecting or disconnecting the cache module cable, the connectors on the cache module and cable are susceptible to damage. Avoid excessive force and use caution to avoid damage to these connectors. 5. If necessary for easier access to the cache module connector and/or removal of an air scoop, remove the storage controller from the PCI riser cage or from the system board ("Expansion board" on page 59). 6. If the cache module is covered by an air scoop, remove the air scoop. 7. Disconnect the cache module backup power cable from the cache module. Removal and replacement procedures 45 8. Remove the cache module. To replace the component, reverse the removal procedure. M.2 SSD enablement kit For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the HP website (http://www.hp.com/go/qs). To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. Remove the access panel ("Access panel" on page 37). 5. Disconnect the SATA cables from the system board. Removal and replacement procedures 46 6. o Disconnecting the SATA cables from the system board when the M.2 SSD enablement board is installed in the primary PCI riser cage o Disconnecting the SATA cables from the system board when the M.2 SSD enablement board is installed in the secondary PCI riser cage Remove the PCI riser cage ("Remove the PCI riser cages" on page 31). Removal and replacement procedures 47 7. Disconnect the SATA cables from the M.2 SSD enablement board. 8. Remove the M.2 SSD enablement board. To replace the component, reverse the removal procedure. Optical drive WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. CAUTION: To prevent improper cooling and thermal damage, do not operate the chassis unless all bays are populated with a component or a blank. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. Removal and replacement procedures 48 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27). 5. Remove the access panel ("Access panel" on page 37). 6. Disconnect the optical drive cable from the drive. 7. Remove the optical drive. To replace the component, reverse the removal procedure. Fan and fan blank Fan population guidelines Removal and replacement procedures 49 Configuration Fan bay 1 Fan bay 2 One processor, non-redundant Blank Blank One processor, redundant Fan bay 3 Fan bay 4 Fan bay 5 Fan Blank Blank Fan Fan Fan Fan Fan Two processors, non-redundant Fan Fan Blank Fan Fan Two processors, redundant Fan Fan Fan Fan Fan • • In a redundant fan mode: o If one fan fails, the system continues to operate without redundancy. This condition is indicated by a flashing amber Health LED. o If two fans fail, the system shuts down. The minimum fan requirement to make this server bootable is: o Two fans (fans 2 and 5) for a single processor configuration o Four fans (fans 1, 2, 4, and 5) for dual processor configuration Fan blank WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. If a full-length expansion board is installed in the server, do the following: a. Power down the server (on page 27). b. Disconnect each power cord from the power source. c. 2. Disconnect each power cord from the server. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 3. Remove the access panel ("Access panel" on page 37). 4. Remove the air baffle (on page 32). Removal and replacement procedures 50 5. Remove the fan blank. To replace the component, reverse the removal procedure. Hot-swap fan WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: 1. If a full-length expansion board is installed in the server, do the following: a. Power down the server (on page 27). b. Disconnect each power cord from the power source. c. 2. Disconnect each power cord from the server. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 3. Remove the access panel ("Access panel" on page 37). 4. Remove the air baffle (on page 32). 5. Disconnect the fan cable. Removal and replacement procedures 51 6. Remove the fan. To replace the component, reverse the removal procedure. DIMM WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. Remove the access panel ("Access panel" on page 37). 5. Remove the air baffle (on page 32). 6. Open the DIMM slot latches. Removal and replacement procedures 52 7. Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. Remove the access panel ("Access panel" on page 37). 5. Remove the air baffle (on page 32). 6. Remove the heatsink: a. Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. b. Completely loosen all screws in the same sequence. Removal and replacement procedures 53 c. Remove the heatsink from the processor backplate. To replace the component: 1. Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 2. Remove the thermal interface protective cover from the heatsink. 3. Install the heatsink: a. Position the heatsink on the processor backplate. b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. Removal and replacement procedures 54 c. Finish the installation by completely tightening the screws in the same sequence. 4. Install the air baffle. 5. Install the access panel. 6. Do one of the following: o Slide the server into the rack. o Install the server into the rack. 7. Connect each power cord to the server. 8. Connect each power cord to the power source. 9. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. Processor WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this server. CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number. CAUTION: To prevent possible server overheating, always populate processor socket 2 with a processor and a heatsink or a processor socket cover and a heatsink blank. Removal and replacement procedures 55 CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. IMPORTANT: If installing a processor with a faster speed, update the system ROM before installing the processor. IMPORTANT: Processor socket 1 must be populated at all times or the server does not function. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. Remove the access panel ("Access panel" on page 37). 5. Remove the air baffle (on page 32). 6. Remove the heatsink ("Heatsink" on page 53). 7. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. Removal and replacement procedures 56 8. Remove the processor from the processor retaining bracket. To replace the component: 1. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. Removal and replacement procedures 57 CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket. 2. Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket. 3. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. 4. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. 5. Apply all the grease to the top of the processor in the following pattern to ensure even distribution. Removal and replacement procedures 58 6. Install the heatsink: a. Position the heatsink on the processor backplate. b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. c. Finish the installation by completely tightening the screws in the same sequence. 7. Install the air baffle. 8. Install the access panel. 9. Do one of the following: o Slide the server into the rack. o Install the server into the rack. 10. Connect each power cord to the server. 11. Connect each power cord to the power source. 12. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. Expansion board WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. Removal and replacement procedures 59 b. Disconnect each power cord from the server. 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. Remove the access panel ("Access panel" on page 37). 5. Remove the PCI riser cage ("Remove the PCI riser cages" on page 31). 6. Disconnect any internal cables that are connected to the expansion board. 7. If you are removing a storage controller board with a cache module installed, remove the cache module ("FBWC module" on page 44). 8. Remove the expansion board. To replace the component, reverse the removal procedure. Two-slot and three-slot PCIe riser boards WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. Remove the access panel ("Access panel" on page 37). 5. Remove the PCI riser cage ("Remove the PCI riser cages" on page 31). Removal and replacement procedures 60 6. If an expansion board is installed in the PCI riser cage, remove the board ("Expansion board" on page 59). 7. Remove the PCIe riser board. o Two-slot PCIe riser board o Three-slot PCIe riser board To replace the component, reverse the removal procedure. FlexibleLOM riser board WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. Removal and replacement procedures 61 CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. Remove the access panel ("Access panel" on page 37). 5. Disconnect the FlexibleLOM sideband signal cable from the riser board. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an expansion board installed. Removal and replacement procedures 62 6. Remove the FlexibleLOM riser cage. 7. If an expansion board is installed in the PCI riser cage, remove the board ("Expansion board" on page 59). 8. Remove the FlexibleLOM riser board. To replace the component, reverse the removal procedure. System battery If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. Removal and replacement procedures 63 WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • • • • Do not attempt to recharge the battery. Do not expose the battery to temperatures higher than 60°C (140°F). Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water. Replace only with the spare designated for this product. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. Remove the access panel ("Access panel" on page 37). 5. If there is a secondary PCI riser cage installed and an expansion board is installed on it, remove the secondary PCI riser cage ("Remove the PCI riser cages" on page 31). 6. Locate the battery on the system board ("System board components" on page 102). 7. If the system battery is secured by a metal tab, do the following: a. Use your finger or a small flat-bladed, nonconductive tool to press the metal tab. This will partially release the battery from the socket. b. Remove the battery. 8. If the system battery is secured by a plastic outer lip, do the following: a. Use a small flat-bladed, nonconductive tool to carefully lift the front of the battery from the socket. Removal and replacement procedures 64 b. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, use BIOS/Platform Configuration (RBSU) in the UEFI System Utilities ("HP UEFI System Utilities" on page 90) to reconfigure the system. To install the component: 1. If the battery socket design uses a metal tab to secure the battery, insert the battery with the "+" side facing up on the socket, and then press the battery down to secure it in place. 2. If the battery socket design has a plastic outer lip to secure the battery, insert the battery with the "+" side facing up underneath the outer lip of the socket, and then press the battery down to secure it in place. 3. If removed, install the secondary PCI riser cage. Removal and replacement procedures 65 4. Install the access panel. 5. Do one of the following: 6. o Slide the server into the rack. o Install the server into the rack. Power up the server. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider. Dedicated iLO management module WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. Remove the access panel ("Access panel" on page 37). 5. If an expansion board is installed in the primary PCI riser cage, then remove the PCI riser cage ("Remove the PCI riser cages" on page 31). Removal and replacement procedures 66 6. Remove the dedicated iLO management module. To replace the component, reverse the removal procedure. After installing the new dedicated iLO management module, enable the dedicated iLO connector ("Enabling the dedicated iLO management module" on page 67). Enabling the dedicated iLO management module The onboard NIC 1/shared iLO connector is set as the default system iLO connector. To enable the dedicated iLO management module, use the iLO 4 Configuration Utility accessible within the HP UEFI System Utilities. For more information on the HP UEFI System Utilities, see the UEFI documentation on the HP website (http://www.hp.com/go/ProLiantUEFI/docs). IMPORTANT: If the iLO configuration settings are reset to the default values, remote access to the machine will be lost. Access the physical machine and repeat the procedure described in this section to re-enable the dedicated iLO management connector. To enable the dedicated iLO management module: 1. During the server startup sequence after installing the module, press F9 in the POST screen. The System Utilities screen appears. 2. Select System Configuration | iLO 4 Configuration Utility. The iLO 4 Configuration Utility screen appears. 3. Select Network Options, and then press Enter. The Network Options screen appears. 4. Set the Network Interface Adapter field to ON, and then press Enter. 5. Press F10 to save your changes. A message prompt to confirm the iLO settings reset appears. 6. Press Enter to reboot the iLO settings. 7. Press Esc until the main menu is displayed. Removal and replacement procedures 67 8. Select Reboot the System to exit the utility and resume the boot process. The IP address of the enabled dedicated iLO connector appears on the POST screen on the subsequent boot-up. Access the Network Options screen again to view this IP address for later reference. Front I/O assemblies for LFF and SFF chassis using thumbscrew rack ears CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27). 5. Remove the access panel ("Access panel" on page 37). 6. Release the front I/O cabling from the server: a. Detach the ambient thermal sensor cable from its clip. b. Release the ambient thermal sensor cable from the front chassis cable clip. c. Disconnect the front I/O assembly cable. — Front I/O cabling disconnection in an LFF chassis Removal and replacement procedures 68 — Front I/O cabling disconnection in an SFF chassis 7. Remove the front I/O assembly from the chassis: o Front I/O assembly removal in an LFF chassis Removal and replacement procedures 69 o Front I/O assembly removal in an SFF chassis To replace the component, reverse the removal procedure. Quick-release latch rack ear assembly WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Remove the server from the rack (on page 30). 4. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27). 5. Remove the access panel ("Access panel" on page 37). 6. If an expansion board is installed in the primary PCI riser cage, then remove the PCI riser cage ("Remove the PCI riser cages" on page 31). 7. Release the front I/O cabling from the server: a. Detach the ambient thermal sensor cable from its clip. b. Release the ambient thermal sensor cable from the front chassis cable clip. c. Disconnect the USB 3.0 cable. d. Disconnect the front I/O assembly cable. Removal and replacement procedures 70 e. Release the front I/O cabling from the side chassis metal clip. 8. Remove the cable cover behind the right quick-release latch rack ear. Removal and replacement procedures 71 9. Remove the right quick-release latch rack ear assembly. 10. Remove the left quick-release latch rack ear. To replace the component, reverse the removal procedure. Pull tab cage for SFF chassis using quick-release latch rack ears CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). Removal and replacement procedures 72 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Remove the server from the rack (on page 30). 4. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27). 5. Remove the right quick-release latch rack ear screws, and then move the ear away from the right side of the pull tab cage. 6. Remove the pull tab cage. To replace the component, reverse the removal procedure. System board Removal and replacement procedures 73 WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. CAUTION: To avoid ESD damage, when removing electrostatic-sensitive components from the failed system board, place the components on a static-dissipating work surface or inside separate antistatic bags. To remove the system board: 1. Power down the server (on page 27). 2. Remove all power: a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 3. Do one of the following: o Extend the server from the rack (on page 28). o Remove the server from the rack (on page 30). 4. Remove the access panel ("Access panel" on page 37). 5. Remove the PCI riser cages (on page 31). 6. Remove the air baffle (on page 32). 7. Remove the fan cage (on page 33). 8. Remove all DIMMs ("DIMM" on page 52). 9. Remove the heatsink: a. Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. b. Completely loosen all screws in the same sequence. c. Remove the heatsink from the processor backplate. Removal and replacement procedures 74 10. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. 11. Remove the processor from the processor retaining bracket. 12. If installed, remove the dedicated iLO module ("Dedicated iLO management module" on page 66). 13. Disconnect all cables connected to the system board. Removal and replacement procedures 75 14. Remove the failed system board. 15. Remove the DIMM guard from the failed system board. Removal and replacement procedures 76 To replace the system board: 1. Install the DIMM guard removed from the failed system board on the system board replacement. 2. Install the system board. Removal and replacement procedures 77 3. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. 4. Remove the clear processor socket cover. Retain the processor socket cover for future use. Removal and replacement procedures 78 5. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket. CAUTION: Close and hold down the processor cover socket while closing the processor locking levers. The levers should close without resistance. Forcing the levers closed can damage the processor and socket, requiring system board replacement. 6. Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket. Removal and replacement procedures 79 7. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. 8. Install the processor socket cover on the failed system board. 9. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 10. Apply all the grease to the top of the processor in the following pattern to ensure even distribution. 11. Install the heatsink: a. Position the heatsink on the processor backplate. b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. Removal and replacement procedures 80 c. Finish the installation by completely tightening the screws in the same sequence. 12. Install all components removed from the failed system board. 13. Connect all cables disconnected from the failed system board. 14. Install the fan cage. 15. Install the air baffle. 16. Install the PCI riser cages. 17. Install the access panel. 18. Do one of the following: o Slide the server into the rack. o Install the server into the rack. 19. Connect each power cord to the server. 20. Connect each power cord to the power source. 21. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. IMPORTANT: Install all components with the same configuration that was used on the failed system board. After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequence, press the F9 key to access UEFI System Utilities. 2. Select the System Configuration > BIOS/Platform Configuration (RBSU) > Advanced Options > Advanced System ROM Options > Serial Number, and then press the Enter key. 3. Enter the serial number and press the Enter key. The following message appears: The serial number should only be modified by qualified service personnel. This value should always match the serial number located on the chassis. 4. Press the Enter key to clear the warning. 5. Enter the serial number and press the Enter key. Removal and replacement procedures 81 6. Select Product ID. The following warning appears: Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis. 7. Enter the product ID and press the Enter key. 8. Press the F10 key to confirm exiting System Utilities. The server automatically reboots. HP 550-W Power Supply (non-hot plug) WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Access the product rear panel (on page 30). 3. Release the power cord from the strain relief clip. 4. Remove all power: a. Disconnect the power cord from the power source. b. Disconnect the power cord from the server. 5. Remove the server from the rack (on page 30). 6. Remove the access panel ("Access panel" on page 37). 7. If installed, remove the secondary PCI riser cage ("Remove the PCI riser cages" on page 31). Removal and replacement procedures 82 8. Remove the HP Smart Storage Battery holder. 9. Disconnect all power supply cables from the system board and any associated component (drive backplane, GPU, etc.). 10. Remove the non-hot-plug power supply. To replace the component, reverse the removal procedure. Hot-plug power input module To remove the component: 1. If the server is using a single hot-plug power input module only, power down the server (on page 27). 2. Access the product rear panel (on page 30). Removal and replacement procedures 83 3. Release the power cord from the hook-and-loop strap. 4. Disconnect the power cord from the power source. 5. Remove the power input module. To replace the component, reverse the removal procedure. RPS backplane WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: 1. Power down the server (on page 27). 2. Access the product rear panel (on page 30). 3. Remove all power: Removal and replacement procedures 84 a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server. 4. Remove all installed power input modules ("Hot-plug power input module" on page 83). 5. Remove the server from the rack (on page 30). 6. Place the server on a sturdy, level surface. 7. Remove the access panel ("Access panel" on page 37). 8. If installed, remove the secondary PCI riser cage ("Remove the PCI riser cages" on page 31). 9. Remove the HP Smart Storage Battery holder. 10. Disconnect the RPS backplane cables. 11. Release the RPS backplane cables from the cable clips. Removal and replacement procedures 85 12. Remove the RPS backplane. To replace the component, reverse the removal procedure. HP Trusted Platform Module The TPM is not a customer-removable part. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data. If you suspect a TPM board failure, leave the TPM installed and remove the system board ("System board" on page 73). Contact an HP authorized service provider for a replacement system board and TPM board. Removal and replacement procedures 86 Troubleshooting Troubleshooting resources The HP ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/Gen9_TSG_en) • French (http://www.hp.com/support/Gen9_TSG_fr) • Spanish (http://www.hp.com/support/Gen9_TSG_es) • German (http://www.hp.com/support/Gen9_TSG_de) • Japanese (http://www.hp.com/support/Gen9_TSG_ja) • Simplified Chinese (http://www.hp.com/support/Gen9_TSG_zh_cn) The HP ProLiant Gen9 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/Gen9_EMG_en) • French (http://www.hp.com/support/Gen9_EMG_fr) • Spanish (http://www.hp.com/support/Gen9_EMG_es) • German (http://www.hp.com/support/Gen9_EMG_de) • Japanese (http://www.hp.com/support/Gen9_EMG_ja) • Simplified Chinese (http://www.hp.com/support/Gen9_EMG_zh_cn) Troubleshooting 87 Diagnostic tools Product QuickSpecs For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the HP website (http://www.hp.com/go/qs). HP iLO The iLO 4 subsystem is a standard component of HP ProLiant servers that simplifies initial server setup, server health monitoring, power and thermal optimization, and remote server administration. The iLO 4 subsystem includes an intelligent microprocessor, secure memory, and a dedicated network interface. This design makes iLO 4 independent of the host server and its operating system. iLO 4 enables and manages the Active Health System (on page 89) and also features Agentless Management. All key internal subsystems are monitored by iLO 4. If enabled, SNMP alerts are sent directly by iLO 4 regardless of the host operating system or even if no host operating system is installed. Embedded remote support software is available on HP ProLiant Gen8 and later servers with iLO 4, regardless of the operating system software and without installing OS agents on the server. Using iLO 4, you can do the following: • Access a high-performance and secure Integrated Remote Console to the server from anywhere in the world if you have a network connection to the server. • Use the shared .NET Integrated Remote Console to collaborate with up to four server administrators. • Remotely mount high-performance Virtual Media devices to the server. • Securely and remotely control the power state of the managed server. • Implement true Agentless Management with SNMP alerts from HP iLO, regardless of the state of the host server. • Download the Active Health System log. • Register for HP Insight Remote Support. • Use iLO Federation to manage multiple servers from one system running the iLO web interface. • Use Virtual Power and Virtual Media from the GUI, the CLI, or the iLO scripting toolkit for many tasks, including the automation of deployment and provisioning. • Control iLO by using a remote management tool. For more information about iLO 4 features, see the iLO 4 documentation on the HP website (http://www.hp.com/go/ilo/docs). The HP iLO 4 hardware and firmware features and functionality, such as NAND size and embedded user partition, vary depending on the server model. For a complete list of supported features and functionality, see the HP iLO 4 QuickSpecs on the HP website (http://h18000.www1.hp.com/products/quickspecs/14276_div/14276_div.pdf). Diagnostic tools 88 Active Health System HP Active Health System provides the following features: • Combined diagnostics tools/scanners • Always on, continuous monitoring for increased stability and shorter downtimes • Rich configuration history • Health and service alerts • Easy export and upload to Service and Support The HP Active Health System monitors and records changes in the server hardware and system configuration. The Active Health System assists in diagnosing problems and delivering rapid resolution if server failures occur. The Active Health System collects the following types of data: • Server model • Serial number • Processor model and speed • Storage capacity and speed • Memory capacity and speed • Firmware/BIOS HP Active Health System does not collect information about Active Health System users' operations, finances, customers, employees, partners, or data center, such as IP addresses, host names, user names, and passwords. HP Active Health System does not parse or change operating system data from third-party error event log activities, such as content created or passed through by the operating system. The data that is collected is managed according to the HP Data Privacy policy. For more information see the HP website (http://www.hp.com/go/privacy). The Active Health System, in conjunction with the system monitoring provided by Agentless Management or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status, and service alerts for various server components. The Agentless Management Service is available in the SPP, which can be downloaded from the HP website (http://www.hp.com/go/spp/download). The Active Health System log can be downloaded manually from iLO 4 or HP Intelligent Provisioning and sent to HP. For more information, see the following documents: • HP iLO User Guide on the HP website (http://www.hp.com/go/ilo/docs) • HP Intelligent Provisioning User Guide on the HP website (http://www.hp.com/go/intelligentprovisioning/docs) HP ProLiant Pre-boot Health Summary If the server will not start up, you can use iLO 4 to display diagnostic information on an external monitor. This feature is supported on servers that support external video and have a UID button or an SUV connector. When power is available to the server but the server is not powered on, iLO runs on auxiliary power and can take control of the server video adapter to display the HP ProLiant Pre-boot Health Summary. Diagnostic tools 89 For additional information, see the following documents: • HP iLO 4 User Guide — See the HP website (http://www.hp.com/go/ilo/docs). • HP ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting — See "Troubleshooting Resources (on page 87)." Integrated Management Log The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity. You can view recorded events in the IML in several ways, including the following: • From within HP SIM • From within HP UEFI System Utilities (on page 90) • From within the Embedded UEFI shell • From within operating system-specific IML viewers: o For Windows: IML Viewer o For Linux: IML Viewer Application • From within the iLO 4 web interface • From within HP Insight Diagnostics (on page 92) HP UEFI System Utilities The HP UEFI System Utilities is embedded in the system ROM. The UEFI System Utilities enable you to perform a wide range of configuration activities, including: • Configuring system devices and installed options • Enabling and disabling system features • Displaying system information • Selecting the primary boot controller • Configuring memory options • Selecting a language • Launching other pre-boot environments such as the Embedded UEFI Shell and Intelligent Provisioning For more information on the HP UEFI System Utilities, see the HP UEFI System Utilities User Guide for HP ProLiant Gen9 Servers on the HP website (http://www.hp.com/go/ProLiantUEFI/docs). Scan the QR code located at the bottom of the screen to access mobile-ready online help for the UEFI System Utilities and UEFI Shell. For on-screen help, press F1. Using HP UEFI System Utilities To use the System Utilities, use the following keys. Action Key Access System Utilities F9 during server POST Diagnostic tools 90 Action Key Navigate menus Up and Down arrows Select items Enter Save selections F10 Access Help for a highlighted configuration option* F1 *Scan the QR code on the screen to access online help for the UEFI System Utilities and UEFI Shell. Default configuration settings are applied to the server at one of the following times: • Upon the first system power-up • After defaults have been restored Default configuration settings are sufficient for typical server operations; however, you can modify configuration settings as needed. The system prompts you for access to the System Utilities each time the system is powered up. Embedded Diagnostics option The system BIOS in all HP ProLiant Gen9 servers includes an Embedded Diagnostics option in the ROM. The Embedded Diagnostics option can run comprehensive diagnostics of the server hardware, including processors, memory, drives, and other server components. For more information on the Embedded Diagnostics option, see the HP UEFI System Utilities User Guide for HP ProLiant Gen9 Servers on the HP website (http://www.hp.com/go/ProLiantUEFI/docs). Re-entering the server serial number and product ID After you replace the system board, you must re-enter the server serial number and the product ID. 1. During the server startup sequence, press the F9 key to access UEFI System Utilities. 2. Select the System Configuration > BIOS/Platform Configuration (RBSU) > Advanced Options > Advanced System ROM Options > Serial Number, and then press the Enter key. 3. Enter the serial number and press the Enter key. The following message appears: The serial number should only be modified by qualified service personnel. This value should always match the serial number located on the chassis. 4. Press the Enter key to clear the warning. 5. Enter the serial number and press the Enter key. 6. Select Product ID. The following warning appears: Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis. 7. Enter the product ID and press the Enter key. 8. Press the F10 key to confirm exiting System Utilities. The server automatically reboots. Diagnostic tools 91 HP Insight Diagnostics HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation. HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, boot the server using Intelligent Provisioning. HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft Windows and Linux versions, the utility helps to ensure proper system operation. For more information or to download the utility, see the HP website (http://www.hp.com/servers/diags). HP Insight Diagnostics Online Edition is also available in the SPP. HP Insight Diagnostics survey functionality HP Insight Diagnostics (on page 92) provides survey functionality that gathers critical hardware and software information on ProLiant servers. This functionality supports operating systems that are supported by the server. For operating systems supported by the server, see the HP website (http://www.hp.com/go/supportos). If a significant change occurs between data-gathering intervals, the survey function marks the previous information and overwrites the survey data files to reflect the latest changes in the configuration. Survey functionality is installed with every Intelligent Provisioning-assisted HP Insight Diagnostics installation, or it can be installed through the SPP. HP Insight Remote Support HP strongly recommends that you register your device for remote support to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or HP contractual support agreement. HP Insight Remote Support supplements your monitoring continuously to ensure maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product’s service level. Notifications can be sent to your authorized HP Channel Partner for onsite service, if configured and available in your country. For more information, see HP Insight Remote Support and Insight Online Setup Guide for ProLiant Servers and BladeSystem c-Class Enclosures on the HP website (http://www.hp.com/go/insightremotesupport/docs). HP Insight Remote Support is available as part of HP Warranty, HP Care Pack Service, or HP contractual support agreement. USB support HP servers support both USB 2.0 ports and USB 3.0 ports. Both types of ports support installing all types of USB devices (USB 1.0, USB 2.0, and USB 3.0), but may run at lower speeds in specific situations: • USB 3.0 capable devices operate at USB 2.0 speeds when installed in a USB 2.0 port. • When the server is configured for UEFI Boot Mode, HP provides legacy USB support in the pre-boot environment prior to the operating system loading for USB 1.0, USB 2.0 , and USB 3.0 speeds. Diagnostic tools 92 • When the server is configured for Legacy BIOS Boot Mode, HP provides legacy USB support in the pre-boot environment prior to the operating system loading for USB 1.0 and USB 2.0 speeds. While USB 3.0 ports can be used with all devices in Legacy BIOS Boot Mode, they are not available at USB 3.0 speeds in the pre-boot environment. Standard USB support (USB support from within the operating system) is provided by the OS through the appropriate USB device drivers. Support for USB 3.0 varies by operating system. For maximum compatibility of USB 3.0 devices with all operating systems, HP provides a configuration setting for USB 3.0 Mode. Auto is the default setting. This setting impacts USB 3.0 devices when connected to USB 3.0 ports in the following manner: • Auto (default)—If configured in Auto Mode, USB 3.0 capable devices operate at USB 2.0 speeds in the pre-boot environment and during boot. When a USB 3.0 capable OS USB driver loads, USB 3.0 devices transition to USB 3.0 speeds. This mode provides compatibility with operating systems that do not support USB 3.0 while still allowing USB 3.0 devices to operate at USB 3.0 speeds with state-of-the art operating systems. • Enabled—If Enabled, USB 3.0 capable devices operate at USB 3.0 speeds at all times (including the pre-boot environment) when in UEFI Boot Mode. This mode should not be used with operating systems that do not support USB 3.0. If operating in Legacy Boot BIOS Mode, the USB 3.0 ports cannot function in the pre-boot environment and are not bootable. • Disabled—If configured for Disabled, USB 3.0 capable devices function at USB 2.0 speeds at all times. The pre-OS behavior of the USB ports is configurable in System Utilities, so that the user can change the default operation of the USB ports. For more information, see the HP UEFI System Utilities User Guide for HP ProLiant Gen9 Servers on the HP website (http://www.hp.com/go/ProLiantUEFI/docs). External USB functionality HP provides external USB support to enable local connection of USB devices for server administration, configuration, and diagnostic procedures. For additional security, external USB functionality can be disabled through USB options in UEFI System Utilities. HP Smart Storage Administrator HP SSA is a configuration and management tool for HP Smart Array controllers. Starting with HP ProLiant Gen8 servers, HP SSA replaces ACU with an enhanced GUI and additional configuration features. HP SSA exists in three interface formats: the HP SSA GUI, the HP SSA CLI, and HP SSA Scripting. Although all formats provide support for configuration tasks, some of the advanced tasks are available in only one format. Some HP SSA features include the following: • Supports online array capacity expansion, logical drive extension, assignment of online spares, and RAID or stripe size migration • Suggests the optimal configuration for an unconfigured system • Provides diagnostic and SmartSSD Wear Gauge functionality on the Diagnostics tab • For supported controllers, provides access to additional features. For more information about HP SSA, see the HP website (http://www.hp.com/go/hpssa). Diagnostic tools 93 Automatic Server Recovery ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND (does not apply to HP ProLiant DL980 Servers), or panic. A system fail-safe timer, the ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer. However, when the operating system fails, the timer expires and restarts the server. ASR increases server availability by restarting the server within a specified time after a system hang. At the same time, the HP SIM console notifies you by sending a message to a designated pager number that ASR has restarted the system. You can disable ASR from the System Management Homepage or through RBSU. Diagnostic tools 94 Component identification Front panel components • 4-bay LFF non-hot-plug drive model Item Description 1 LFF non-hot-plug drives 2 USB 2.0 connector • 8-bay LFF hot-plug drive model Item Description 1 Box 1 LFF hot-plug drives 2 Box 2 LFF hot-plug drives 3 USB 3.0 connector Component identification 95 • 8-bay SFF hot-plug drive model Item Description 1 HP Universal Media Bay (box 1, for the optical drive cage option) 2 8-bay SFF drive cage bay (box 2, for the second 8-bay SFF drive cage option) 3 Box 3 SFF hot-plug drives 4 Serial label pull tab ("Serial label pull tab information" on page 96) 5 USB 2.0 connector (in servers using thumbscrew rack ears) 6 USB 3.0 connector (in servers using quick-release latch rack ears) Serial label pull tab information The vertically oriented serial label pull tab in the SFF chassis is double-sided. The following server labels are attached to this pull tab: • Left side—Server serial number label and the customer asset tag label • Right side—Default iLO account information label and the QR code label Use your mobile device to scan the QR code label to display the server mobile product page (http://www.hp.com/qref/dl180gen9). This page contains links to server setup information, spare part numbers, QuickSpecs, troubleshooting resources, and other useful product links. In the LFF chassis, these server labels are attached on the front edge of the access panel instead. Component identification 96 Front panel LEDs and buttons • Front panel LEDs and buttons in an LFF chassis with thumbscrew rack ears • Front panel LEDs and buttons in an LFF chassis with quick-release latch rack ears • Front panel LEDs and buttons in an SFF chassis with thumbscrew rack ears Component identification 97 • Front panel LEDs and buttons in an SFF chassis with quick-release latch rack ears Item Description Status 1 UID button/LED* Solid blue = Activated Flashing blue: • • • 1 Hz/cycle per sec = Remote management or firmware upgrade in progress 4 Hz/cycle per sec = iLO manual reboot sequence initiated 8 Hz/cycle per sec = iLO manual reboot sequence in progress Off = Deactivated 2 Health LED* Solid green = Normal Flashing green (1 Hz/cycle per sec) = iLO is rebooting Flashing amber = System degraded** Flashing red (1 Hz/cycle per sec) = System critical** 3 NIC status LED* Solid green = Link to network Flashing green (1 Hz/cycle per sec) = Network active Off = No network activity 4 Solid green = System on Power On/Standby button and system power Flashing green (1 Hz/cycle per sec) = Performing power on sequence Solid amber = System in standby LED* Off = No power present† * When all four LEDs described in this table flash simultaneously, a power fault has occurred. For more information, see "Front panel LED power fault codes (on page 98)." ** If the health LED indicates a degraded or critical state, review the system IML or use iLO to review the system health status. † Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has occurred, or the front I/O cable is disconnected. Front panel LED power fault codes The following table provides a list of power fault codes, and the subsystems that are affected. Not all power faults are used by all servers. Subsystem Front panel LED behavior System board 1 flash Processor 2 flashes Memory 3 flashes Component identification 98 Subsystem Front panel LED behavior Riser board PCIe slots 4 flashes FlexibleLOM 5 flashes Removable HP Flexible Smart Array controller/Smart SAS HBA controller 6 flashes System board PCIe slots 7 flashes Power backplane or storage backplane 8 flashes Power supply 9 flashes For more information, see "Front panel LEDs and buttons (on page 97)." Rear panel components Item Description 1 PCIe3 riser slots 1-3 (primary, associated with processor 1) 2 PCIe3 riser slots 4-6 (secondary, associated with processor 2) 3 Non-hot plug power supply 4 Hot-plug power supply bay 2 5 Hot-plug power supply 1 6 NIC connector 2 7 NIC 1/shared iLO connector 8 Video connector 9 USB 3.0 connectors 10 Dedicated iLO management connector (optional) Component identification 99 Rear panel LEDs Item Description Status 1 UID LED Solid blue = Activated Flashing blue: • • • 1 Hz/cycle per sec = Remote management or firmware upgrade in progress 4 Hz/cycle per sec = iLO manual reboot sequence initiated 8 Hz/cycle per sec = iLO manual reboot sequence in progress Off = Deactivated 2 NIC link LED Green = Network link Off = No network link 3 NIC activity LED Solid green = Link to network Flashing green = Network active Off = No network activity 4 Power supply LED Solid green = Normal Off = One or more of the following conditions exists: • • • • Power Power Power Power is unavailable supply failed supply is in standby mode supply error PCIe riser board slot definitions The server ships with a primary PCI riser cage installed and a secondary PCI riser cage blank. A second processor is required to support installation in the secondary PCIe riser location. Component identification 100 • Two-slot PCI riser cage assembly: Install in either the primary or secondary PCIe riser board connector. Item Form factor Slot description 1 Full-height, full-length PCIe3 x16 (16, 8, 4, 1) 2 Full-height, half-length PCIe3 x8 (8, 4, 1) • Three-slot PCI riser cage assembly: Install in either the primary or secondary PCIe riser board connector. Item Form factor Slot description 1 Full-height, full-length PCIe3 x8 (8, 4, 1) 2 Full-height, half-length PCIe3 x8 (8, 4, 1) 3 Full-height, half-length PCIe3 x8 (8, 4, 1) • FlexibleLOM riser cage assembly: Install in the secondary PCIe riser board connector. Item Form factor Slot description 1 Full-height, full-length PCIe3 x8 (8, 4, 1) 2 Full-height, half-length PCIe3 x8 (8, 4, 1) Component identification 101 3 FlexibleLOM PCIe3 x8 System board components Item Description 1 FlexibleLOM sideband signal connector 2 System battery 3 Primary PCIe riser board connectors ("PCIe riser board slot definitions" on page 100) 4 Dedicated iLO module connector 5 microSD card slot 6 SATA connector 5 (for M.2 SSD 2) Component identification 102 Item Description 7 SATA connector 4 (for M.2 SSD 1 or optical drive) 8 Internal USB 3.0 connector (for USB flash devices) 9 Front USB 3.0 connector (for the USB 3.0 connector on the right quick-release latch rack ear) 10 Mini-SAS connector 1 11 Mini-SAS connector 2 12 Front I/O connector 13 Processor 1 14 Processor 1 DIMM slots 15 Fan connector 5 16 Fan connector 4 17 Reserved 18 Processor 2 DIMM slots 19 Fan connector 3 20 Fan connector 2 21 Fan connector 1 22 Reserved 23 12-bay LFF drive identification signal connector 24 GPU power connector 25 24-pin power supply connector 26 HP Smart Storage Battery connector 27 20-pin drive power connector 28 16-pin power supply sideband signal connector 29 10-pin RPS connector 30 Processor 2 31 NMI header 32 TPM connector 33 Secondary PCIe riser board connectors ("PCIe riser board slot definitions" on page 100) 34 System maintenance switch Component identification 103 DIMM slot locations DIMM slots are numbered sequentially (1 through 8) for each processor. The supported AMP modes use the letter assignments for population guidelines. The arrow points to the front of the server. System maintenance switch Position Default Function S1 Off Off = iLO 4 security is enabled. On = iLO 4 security is disabled. S2 Off Off = System configuration can be changed. On = System configuration is locked. S3 Off Reserved S4 Off Reserved S5 Off Off = Power-on password is enabled. On = Power-on password is disabled. S6 Off Off = No function On = ROM reads system configuration as invalid. S7 Off Off = Set default boot mode to UEFI. On = Set default boot mode to legacy. S8 — Reserved S9 — Reserved S10 — Reserved S11 — Reserved S12 — Reserved To access the redundant ROM, set S1, S5, and S6 to on. Component identification 104 When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM. CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly configure the server or data loss could occur. IMPORTANT: Before using the S7 switch to change to Legacy BIOS Boot Mode, be sure the HP Dynamic Smart Array B140i Controller is disabled. Do not use the B140i controller when the server is in Legacy BIOS Boot Mode. NMI functionality An NMI crash dump creates a crash dump log before resetting a system which is not responding. Crash dump log analysis is an essential part of diagnosing reliability problems, such as failures of operating systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is to restart the system. Resetting the system erases any information which could support problem analysis, but the NMI feature preserves that information by performing a memory dump before a system reset. To force the system to invoke the NMI handler and generate a crash dump log, do one of the following: • Use the iLO Virtual NMI feature. • Short the NMI header ("System board components" on page 102). For more information, see the HP website (http://www.hp.com/support/NMI). Drive numbering The following images show the drive numbering for each of the supported drive configurations. For drive box numbering information, see "Front panel components (on page 95)." • 4-bay LFF non-hot-plug drive model • 8-bay LFF hot-plug drive model Component identification 105 • 12-bay LFF hot-plug drive model • 8-bay SFF hot-plug drive model • 16-bay SFF hot-plug drive model HP SmartDrive LED definitions HP SmartDrives are the latest HP drive technology, and they are supported beginning with ProLiant Gen8 servers and server blades. The HP SmartDrive is not supported on earlier generation servers and server blades. Identify an HP SmartDrive by its carrier, shown in the following illustration. When a drive is configured as a part of an array and connected to a powered-up controller, the drive LEDs indicate the condition of the drive. Item LED Status Definition 1 Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Rotating green Drive activity Off No drive activity Solid white Do not remove the drive. Removing the drive causes one or more of the logical drives to fail. 2 3 Activity ring Do not remove Component identification 106 Item 4 LED Drive status Status Definition Off Removing the drive does not cause a logical drive to fail. Solid green The drive is a member of one or more logical drives. Flashing green The drive is rebuilding or performing a RAID migration, strip size migration, capacity expansion, or logical drive extension, or is erasing. Flashing amber/green The drive is a member of one or more logical drives and predicts the drive will fail. Flashing amber The drive is not configured and predicts the drive will fail. Solid amber The drive has failed. Off The drive is not configured by a RAID controller. The blue Locate LED is behind the release lever and is visible when illuminated. IMPORTANT: The HP Dynamic Smart Array B140i Controller is only available in UEFI Boot Mode. It cannot be enabled in Legacy BIOS Boot Mode. If the B140i controller is disabled, drives connected to the system board Mini-SAS connectors operate in AHCI or Legacy mode. Under this condition: • The drives cannot be a part of a hardware RAID or a logical drive. • The Locate, Drive status, and Do not remove LEDs of the affected drives are disabled. Use BIOS/Platform Configuration (RBSU) in the UEFI System Utilities ("HP UEFI System Utilities" on page 90) to enable or disable the B140i controller (System Configuration → BIOS/Platform Configuration (RBSU) → System Options → SATA Controller Options → Embedded SATA Configuration). Fan locations Component identification 107 Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped. Storage cabling The storage cabling illustrations in this section show both the drive data and power cables. The LFF and SFF drive models each has their own preinstalled 20-pin multi-output drive power cable. The LFF drive power cable has the following connections: • Common end connector—System board • BP1 cable connector—4-bay LFF backplane • BP2 cable connector—8-bay LFF backplane The SFF drive power cable has the following connections: • Common end connector—System board • BP3 cable connector—8-bay SFF backplane in box 3 • BP2 cable connector—8-bay SFF backplane in box 2 (16-bay SFF drive configuration) • ODD cable connector—Power connector in the SATA optical drive cable (if an optical drive is installed) Cabling 108 4-bay LFF non-hot-plug SATA drive cabling Item Description 1 Drive power cable 2 Mini-SAS cable 8-bay LFF non-hot-plug SATA drive cabling Item Description 1 Drive power cable 2 Mini-SAS cable 2 3 Mini-SAS cable 1 Cabling 109 8-bay LFF hot-plug SATA drive cabling Item Description 1 Drive power cable 2 Mini-SAS X-cable 8-bay LFF hot-plug SAS/SATA drive cabling • Drives connected to an HBA option Item Description 1 Drive power cable 2 Mini-SAS X-cable Cabling 110 • Drives connected to an HP Smart Array Controller option Item Description 1 Drive power cable 2 Mini SAS Y-cable 8-bay SFF hot-plug SATA drive cabling Item Description 1 Drive power cable 2 Mini-SAS cable 2 3 Mini-SAS cable 1 Cabling 111 8-bay SFF hot-plug SAS/SATA drive cabling • Drives connected to an HBA option Item Description 1 Drive power cable 2 Mini-SAS cable 2 3 Mini-SAS cable 1 • Drives connected to an HP Smart Array Controller option Item Description 1 Drive power cable 2 Mini-SAS Y-cable Cabling 112 16-bay SFF hot-plug SAS/SATA drive cabling • Drives connected to two HP Smart Array P440 Controllers Item Description 1 Drive power cable 2 Mini-SAS Y-cable to the box 3 drives 3 Mini-SAS Y-cable to the box 2 drives • Drives connected to an HP Smart Array P840 Controller Item Description 1 Drive power cables 2 Mini-SAS Y-cable to the box 3 drives 3 Mini-SAS Y-cable to the box 2 drives Cabling 113 M.2 SSD cabling • M.2 SSD cabling from the primary PCIe riser location Item Description 1 M.2 SSD 2 SATA cable 2 M.2 SSD 1 SATA cable • M.2 SSD cabling from the secondary PCIe riser location Item Description 1 M.2 SSD 2 SATA cable 2 M.2 SSD 1 SATA cable Cabling 114 FBWC module backup power cabling The FBWC solution is a separately purchased option. This server only supports FBWC module installation when an HP Smart Array P-Series controller is installed. Depending on the controller option installed, the actual storage controller connectors might look different from what is shown in this section. HP Smart Storage Battery cabling Cabling 115 Optical drive cabling Item Description 1 Optical drive power cable 2 Optical drive SATA cable Fan cabling Item Description 1 Fan 1 cable 2 Fan 2 cable 3 Fan 3 cable 4 Fan 4 cable Cabling 116 Item Description 5 Fan 5 cable GPU power drive cabling FlexibleLOM sideband signal cabling Cabling 117 Power supply cabling HP 550-W Power Supply cabling (non-hot-plug) Item Description 1 24-pin power supply cable 2 16-pin power supply sideband signal cable HP Redundant Power Supply cabling (hot-plug) Item Description 1 24-pin power supply cable 2 16-pin power supply sideband signal cable Cabling 118 Item Description 3 10-pin RPS cable Front panel cabling • Front panel cabling in an LFF chassis with thumbscrew rack ears Item Description 1 Ambient temperature sensor cable 2 USB 2.0 connector cable 3 Front I/O cable • Front panel cabling in an LFF chassis with quick-release latch rack ears Item Description Cabling 119 Item Description 1 Ambient temperature sensor cable 2 Front I/O cable 3 USB 3.0 connector cable • Front panel cabling in an SFF chassis with thumbscrew rack ears Item Description 1 Ambient temperature sensor cable 2 Front I/O cable • Front panel cabling in an SFF chassis with quick-release latch rack ears Item Description 1 Ambient temperature sensor cable 2 Front I/O cable Cabling 120 Item Description 3 USB 3.0 connector cable Cabling 121 Specifications Environmental specifications Specification Value Temperature range* — Operating 10°C to 35°C (50°F to 95°F) Nonoperating -30°C to 60°C (-22°F to 140°F) Relative humidity (noncondensing) — Operating Minimum to be the higher (more moisture) of -12°C (10.4°F) dew point or 8% relative humidity Maximum to be 24°C (75.2°F) dew point or 90% relative humidity Nonoperating 5% to 95% 38.7°C (101.7°F), maximum wet bulb temperature * All temperature ratings shown are for sea level. An altitude derating of 1.0°C per 304.8 m (1.8°F per 1000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed. Maximum rate of change is 20°C per hour (36°F per hour). The upper limit and rate of change might be limited by the type and number of options installed. For certain approved hardware configurations, the supported system inlet temperature range is extended: • 5°C to 10°C (41°F to 50°F) and 35°C to 40°C (95°F to 104°F) at sea level with an altitude derating of 1.0°C per every 175 m (1.8°F per every 574 ft) above 900 m (2953 ft) to a maximum of 3048 m (10,000 ft). • 40°C to 45°C (104°F to 113°F) at sea level with an altitude derating of 1.0°C per every 125 m (1.8°F per every 410 ft) above 900 m (2953 ft) to a maximum of 3048 m (10,000 ft). The approved hardware configurations for this system are listed on the HP website (http://www.hp.com/servers/ASHRAE). Mechanical specifications Dimension Value Height* 8.75 cm (3.44 in) Depth* 60.70 cm (23.90 in) Width* 44.54 cm (17.50 in) Weight (full load, approximate values) — 4-bay LFF drive model 16.59 kg (36.58 lb) 8-bay LFF drive model 19.19 kg (42.31 lb) 12-bay LFF drive model 21.59 kg (47.60 lb) Specifications 122 Dimension Value 8-bay SFF drive model with optical drive 16.09 kg (35.48 lb) 8-bay SFF drive model without optical drive 15.95 kg (35.17 lb) 16-bay SFF drive model with optical drive 17.95 kg (39.60 lb) 16-bay SFF drive model without optical drive 17.87 kg (39.40 lb) * These dimensions apply to all server models. Power supply specifications Depending on the installed options and/or the regional location where the server was purchased, the server is configured with one of the following power supplies: • HP 550-W Power Supply (PN 730941-B21) • HP 800-W/900-W Gold AC Power Input Module (PN 744689-B21) This is supported when the two-bay HP RPS Backplane option (PN 745813-B21) is installed. These are Entry Level Power Supply products for HP ProLiant servers. For more information about the power supply features, specifications, and compatibility, see the HP website (http://www.hp.com/go/proliant/powersupply). CAUTION: Check the system and power supply input ratings before powering up the server. Hot-plug power supply calculations For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, see the HP Power Advisor website (http://www.hp.com/go/hppoweradvisor). Specifications 123 Acronyms and abbreviations ABEND abnormal end AMP Advanced Memory Protection API application program interface ASHRAE American Society of Heating, Refrigerating and Air-Conditioning Engineers ASR Automatic Server Recovery BP backplane CSR Customer Self Repair FAT file allocation table FBWC flash-backed write cache GPU graphics processing unit HBA host bus adapter HP SIM HP Systems Insight Manager Acronyms and abbreviations 124 HP SSA HP Smart Storage Administrator iLO Integrated Lights-Out IML Integrated Management Log LFF large form factor LOM Lights-Out Management NAND Not AND NMI nonmaskable interrupt NVRAM nonvolatile memory ODD Optical Disk Drive PCIe Peripheral Component Interconnect Express POST Power-On Self Test QR code quick response code RBSU ROM-Based Setup Utility REST representational state transfer Acronyms and abbreviations 125 RPS redundant power supply SAS serial attached SCSI SATA serial ATA SD Secure Digital SFF small form factor SIM Systems Insight Manager SPP HP Service Pack for ProLiant SSD solid-state drive SUV serial, USB, video TPM Trusted Platform Module UEFI Unified Extensible Firmware Interface UID unit identification USB universal serial bus Acronyms and abbreviations 126 Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hp.com). Include the document title and part number, version number, or the URL when submitting your feedback. Index 127 Index A D access panel, remove 37 Active Health System 89 ACU (Array Configuration Utility) 93 air baffle, removal 32 air scoop 44 ambient temperature 122 ambient temperature sensor, cabling 119 Automatic Server Recovery (ASR) 94 dedicated iLO management connector 102 dedicated iLO management module 66 diagnosing problems 87 diagnostic tools 88, 91, 92, 94 dimensions and weight 122 DIMM slot locations 104, 105 DIMMs, removing 52 documentation feedback 127 drive backplane 40, 42 drive blank 35, 36 drive cabling 108 drive carrier 34 drive LEDs 106 drive numbering 105 drives, determining status of 106 B battery pack, removing 43 bezel, removing 27 boot options 90, 91 C cable management arm 30 cabling 108, 118 cabling, battery pack 115 cabling, drive 108, 109, 110, 111, 112, 113 cabling, fan 116 cabling, FBWC 115 cabling, FlexibleLOM 117 cabling, front I/O 119 cabling, GPU 117 cabling, hot-plug power supply 118 cabling, Mini-SAS cable option 110, 111 cabling, not-hot-plug power supply 118 cabling, optical drive 116 cabling, redundant power supply 118 cache module battery pack 43 Care Pack 92 clearing NVRAM 104 CMOS 104 components, front panel 95, 96 components, rear panel 99 components, system board 102 crash dump analysis 105 customer asset tag 96 customer self repair (CSR) 6 E electrostatic discharge 24 embedded UEFI diagnostics 91 environmental specifications 122 error messages 87 expansion board 59 extending server from rack 28 external USB functionality 93 F fan blank 50 fan cabling 116 fan cage 33 fan connectors 102 fan location 107 fan population guidelines 49 fans, removing 51 FBWC cabling 115 FBWC module 44 FlexibleLOM riser board 61 FlexibleLOM riser cage 61, 100 FlexibleLOM sideband signal cabling 117 front I/O assembly 68 front I/O cabling 119 front panel buttons 97 Index 128 front front front front panel panel panel panel cabling 119 components 95, 96 LED power fault codes 98 LEDs 97 G GPU power cabling 117 grounding methods 24 grounding requirements 24 H health driver 94 health LED 97 heatsink 53 hot-plug drive backplane 40, 42 hot-plug drive blank 35 hot-plug drive, removing 36 hot-plug power supply 83, 84, 123 hot-plug power supply calculations 123 hot-swap fan 51 HP iLO 88 HP Insight Diagnostics 92 HP Insight Diagnostics survey functionality 92 HP Insight Online 92 HP Insight Remote Support software 92 HP ProLiant Pre-boot Health Summary 89 HP Smart Storage Battery 43, 115 HP Smart Storage Battery cabling 115 HP SmartDrive LED definitions 106 HP SSA (HP Smart Storage Administrator) 93 HP Systems Insight Manager (SIM) 90, 92 HP technical support 6 HP Trusted Platform Module option 86 HP Universal Media bay 95 humidity 122 I illustrated parts catalog 16 iLO account information 96 iLO connector 102 Insight Diagnostics 92 Integrated Lights-Out (iLO) 88, 90 Integrated Management Log (IML) 90 Intelligent Provisioning 90, 92 internal USB connector 92, 102 L LED, health 97 LED, system power 97 LEDs, drive 106 LEDs, front panel 97 LEDs, NIC 97 LEDs, power fault 97, 98 LEDs, rear panel 100 LEDs, unit identification (UID) 97 legacy USB support 92 M M.2 SATA SSD enablement board 46 M.2 SSD cabling 114 management tools 88 mechanical components 16 mechanical specifications 122 memory dump 105 microSD card slot 102 Mini-SAS cabling 109, 110, 111 Mini-SAS Y-cabling 110, 111, 112, 113 N NIC activity LED 97, 100 NIC connectors 99 NIC link LED 97, 100 NMI functionality 105 NMI header 105 non-hot-plug drive cable assembly 38 non-hot-plug drive carrier 34 non-hot-plug drives 34 non-hot-plug power supply 82, 123 non-hot-plug power supply cabling 118 O operating system crash 94, 105 operating systems supported 92 optical drive 48 optical drive cabling 116 P PCI riser board 60 PCI riser board slot definitions 100 PCI riser cage, removing 31 POST error messages 87 power calculator 123 power fault 98 power input module 83 Power On/Standby button 97 power supply 82 Index 129 power supply cabling 118 power supply specifications 123 power supply, hot-plug 83, 84, 118, 123 power supply, non-hot-plug 82, 118, 123 powering down 27 power-on password 104 preparation procedures 26 problem diagnosis 87, 88 processor 55 Product ID 91 pull tab cage 72 Q QR code label 90, 96 quick-release latch rack ears 70 QuickSpecs 88 R rack ears 28, 70 rack warnings 26 RAID configuration 93 rear panel components 99 rear panel LEDs 100 rear panel, accessing 30 redundant power supply 84, 123 redundant power supply cabling 118 re-entering the server serial number 91 removal and replacement procedures 24 removing server from rack 30 removing the security bezel 27 required tools 24 requirements, environmental 122 ROM legacy USB support 92 ROM-Based Setup Utility (RBSU) 90 RPS cabling 118 static electricity 24 storage cabling, eight-bay drive 109, 110, 111, 112 storage cabling, four-bay drive 109 storage cabling, sixteen-bay drive 113 symbols on equipment 24 system board 73 system board battery 115 system board components 102 system components 19 system configuration settings 104 system maintenance switch 104 T technical support 6 temperature requirements 122 three-slot PCI riser cage 31, 100 TPM connector 102 troubleshooting resources 87 Trusted Platform Module (TPM) 86 two-slot PCI riser cage 31, 100 U UEFI System Utilities 90 UID (unit identification) 97 UID button 97 UID LED 97 USB connector 95, 99, 102 USB support 92 W warnings 25, 26 weight 122 S safety considerations 24 security bezel, removing 27 serial label pull tab 96 serial number 91 server specifications 122 server warnings and cautions 25, 26 solid state device 46, 114 specifications, environmental 122 specifications, mechanical 122 specifications, power supply 123 specifications, server 122 SPP 92 Index 130
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