............................... 222 10.3 Accessory ............................................. 246 LGE Internal Use Only -4- Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of this model. 1.2 Regulatory Information A. Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use. B. Incidence of Harm If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done. C. Changes in Service A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service. D. Maintenance Limitations Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes -5- LGE Internal Use Only 1. INTRODUCTION E. Notice of Radiated Emissions This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user. F. Pictures The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different. G. Interference and Attenuation A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems. H. Electrostatic Sensitive Devices ATTENTION Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the Following information is ESD handling: sign. • Service personnel should ground themselves by using a wrist strap when exchange system boards. • When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. • Use a suitable, grounded soldering iron. • Keep sensitive parts in these protective packages until these are used. • When returning system boards or parts like EEPROM to the factory, use the protective package as described. LGE Internal Use Only -6- Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 2. PERFORMANCE 2. PERFORMANCE 2.1 System Overview Item Shape Size Specification GSM900/1800/1900 and WCDMA Slide Handset 104 X 52 X 18.9 mm Weight 118 g (with 950mAh Battery) Power 3.7V normal, 950 mAh Li-Polymer Talk Time Over 150 min (WCDMA, Tx=12 dBm, Voice) (with 950mAh) Over 175 min (GSM, Tx=Max, Voice) Standby Time Over 200 Hrs (WCDMA, DRX=1.28) (with 950mAh) Over 220 Hrs (GSM, Paging period=9) Antenna LCD LCD Backlight Internal type and Antenna Main 240 X 320 pixel TFT (QVGA LCD Module) Blue LED Back Light (main only) Camera Dual Camera ; 1.3 Mega pixel (CMOS), VGA Camera (CMOS) Vibrator Yes (Cylinder Type) LED Indicator No MIC Yes Receiver Yes Earphone Jack Yes Connectivity Bluetooth, USB Volume Key Push Type(+, -) External Memory I/O Connect Micro-SD 18 Pin Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes -7- LGE Internal Use Only 2. PERFORMANCE 2.2 Usable environment 1) Environment Item Specification Voltage 3.7 V(Typ), [Shut Down : 3.22 V] Operation Temp -20 ~ +60°C Storage Temp -20 ~ +70°C Humidity 85 % (Max) 2) Environment (Accessory) Reference Spec. Min Typ. Max Unit TA Power Available power 100 220 240 Vac * CLA : 12 ~ 24 V(DC) 2.3 Radio Performance 1) Transmitter - GSM Mode No Item GSM 100k~1GHz DCS & PCS MS allocated Channel 1G~12.75GHz -39dBm 1G~[A]MHz -33dBm [A]M~[B]MHz -39dBm [B]M~12.75GHz -33dBm -33dBm Conducted 1 9k ~ 1GHz -39dBm Spurious 100k~880MHz -60dBm 100k~880MHz -60dBm Emission 880M~915MHz -62dBm 880M~915MHz -62dBm 915M~1GHz -60dBm 915M~1GHz -60dBm 1G~[A]MHz -50dBm 1G~[A]MHz -50dBm [A]M~[B]MHz -56dBm [A]M~[B]MHz -56dBm [B]M~12.5GHz -50dBm [B]M~12.5GHz -50dBm Idle Mode * In case of DCS : [A] -> 1710, [B] -> 1785 LGE Internal Use Only * In case of PCS : [A] -> 1850, [B] -> 1910 -8- Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 2. PERFORMANCE No Item GSM 30M ~ 1GHz DCS & PCS MS allocated Channel 1G ~ 4GHz -36dBm 1G~[A]MHz -30dBm [A]M~[B]MHz -36dBm [B]M~4GHz -30dBm -30dBm Radiated 2 30M~1GHz -36dBm Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm 915M~1GHz -57dBm 915M~1GHz -57dBm 1G~[A]MHz -47dBm 1G~[A]MHz -47dBm [A]M~[B]MHz -53dBm [A]M~[B]MHz -53dBm [B]M~4GHz -47dBm [B]M~4GHz -47dBm Idle Mode 3 Frequency Error 4 Phase Error ±0.1ppm ±0.1ppm ±5(RMS) ±5(RMS) ±20(PEAK) ±20(PEAK) 3dB below reference sensitivity 3dB below reference sensitivity 5 Frequency Error RA250 : ±200Hz RA250: ±250Hz Under Multipath and HT100 : ±100Hz HT100: ±250Hz Interference Condition TU50 : ±100Hz TU50: ±150Hz TU3 : ±150Hz TU1.5: ±200Hz Due to modulation 0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB 200kHz -30dB 200kHz -30dB 250kHz -33dB 250kHz -33dB 400kHz -60dB 400kHz -60dB 600 ~ 1800kHz -60dB 600 ~ 1800kHz -60dB 1800 ~ 3000kHz -63dB 1800 ~ 6000kHz -65dB 3000 ~ 6000kHz -65dB ≥6000kHz -73dB ≥6000kHz -71dB 400kHz -19dB 400kHz -22dB 600kHz -21dB 600kHz -24dB 1200kHz -21dB 1200kHz -24dB 1800kHz -24dB 1800kHz -27dB Output RF 6 Spectrum Due to Switching transient * In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910 Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes -9- LGE Internal Use Only 2. PERFORMANCE No Item GSM DCS & PCS Frequency offset 800kHz Intermodulation product should 7 Intermodulation attenuation – be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance 8 9 Transmitter Output Power Burst timing LGE Internal Use Only Level (dBm) (dB) Level (dBm) (dB) 5 33 ±3 0 30 ±3 6 31 ±3 1 28 ±3 7 29 ±3 2 26 ±3 8 27 ±3 3 24 ±3 9 25 ±3 4 22 ±3 10 23 ±3 5 20 ±3 11 21 ±3 6 18 ±3 12 19 ±3 7 16 ±3 13 17 ±3 8 14 ±3 14 15 ±3 9 12 ±4 15 13 ±3 10 10 ±4 16 11 ±5 11 8 ±4 17 9 ±5 12 6 ±4 18 7 ±5 13 4 ±4 19 5 ±5 14 2 ±5 15 0 ±5 Mask IN - 10 - Mask IN Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 2. PERFORMANCE 2) Transmitter - WCDMA Mode No 1 Item Specification Maximum Output Power Class 3 : +24dBm(+1/-3dB) Class 4 : +21dBm(±2dB) 2 Frequency Error ±0.1ppm 3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme Adjust output(TPC command) 4 Inner Loop Power control in uplink cmd 1dB 2dB 3dB +1 +0.5/1.5 +1/3 +1.5/4.5 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -1 -0.5/-1.5 -1/-3 -1.5/-4.5 Group (10 equel command group) +1 5 Minimum Output Power +8/+12 +16/+24 -50dBm(3.84MHz) Qin/Qout : PCCH quality levels 6 Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB Ton@DPCCH/Ior : -24 -> -18dB 7 Transmit OFF Power 8 Transmit ON/OFF Time Mask -56dBm(3.84MHz) ±25us PRACH,CPCH,uplinlk compressed mode ±25us Power varies according to the data rate 9 Change of TFC DTX : DPCH off (minimize interference between UE) 10 Power setting in uplink compressed ±3dB(after 14slots transmission gap) 11 Occupied Bandwidth(OBW) 5MHz(99%) -35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k -35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M 12 Spectrum emission Mask -39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M -49dBc@∆f=8.5~12.5MHz,1M Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 11 - LGE Internal Use Only 2. PERFORMANCE No Item Specification 33dB@5MHz, ACP>-50dBm 13 Adjacent Channel Leakage Ratio(ACLR) 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW (*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K 14 (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc 15 Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc 17.5%(>-20dBm) 16 Error Vector Magnitude (EVM) (@12.2K, 1DPDCH+1DPCCH) -15dB@SF=4.768Kbps, Multi-code 17 Transmit OFF Power transmission 3)Receiver - GSM Mode No Item GSM DCS & PCS 1 Sensitivity (TCH/FS Class II) -105dBm -105dBm C/Ic=7dB Storage -30 ~ +85 Co-Channel Rejection 2 (TCH/FS Class II, RBER, TU high/FH) 3 4 Adjacent Channel 200kHz C/Ia1=-12dB C/Ia1=-12dB Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB Wanted Signal :-98dBm Wanted Signal :-96dBm 1st interferer:-44dBm 1st interferer:-44dBm 2nd interferer:-45dBm 2nd interferer:-44dBm Blocking Response Wanted Signal :-101dBm Wanted Signal :-101dBm (TCH/FS Class II, RBER) Unwanted : Depend on Frequency Unwanted : Depend on Frequency Intermodulation Rejection 5 LGE Internal Use Only - 12 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 2. PERFORMANCE 4) Receiver - WCDMA Mode No 1 Item Specification Reference Sensitivity Level -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) 2 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB 3 Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz 4 In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3) -30dBm/3.84MHz@f=2025~2050 and 5 Out-band Blocking 2230~2255MHz UE@+20dBm output power(Class3) -15dBm/3.84MHz@f=1~2025 and 2255~12500MHz UE@+20dBm output power(Class3) -44dBm CW 6 Spurious Response UE@+20dBm output power(Class3) -46dBm CW@10MHz 7 Intermodulation Characteristic -46dBm/3.84MHz@20MHz UE@+20dBm output power(Class3) -57dBm@f=9KHz~1GHz, 100K BW 8 Spurious Emissions -47dBm@f=1~12.5GHz, 1M BW -60dBm@f=1920MHz~1980MHz, 3.84M BW -60dBm@f=2110MHz~2170MHz, 3.84M BW Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 13 - LGE Internal Use Only 2. PERFORMANCE 2.4 Current Consumption WCDMA GSM Stand by Voice Call VT Under 4.32 mA Under 335 mA Under 569mA (DRX=1.28) (Tx=10dBm -Low power) (Tx=10dBm -Low power) Under 4.32 mA Under 380 mA (Paging=5period) (Tx=Max power) (Stand by Test Condition : Bluetooth off, LCD backlight off) (Call Test Condition : Bluetooth off, LCD backlight dimming mode) (VT Test Condition : Speaker off, LCD backlight On) 2.5 RSSI BAR Level Change WCDMA GSM BAR 7 → 6 -86 ± 2 dBm -82 ± 2dBm BAR 6 → 5 -90 ± 2 dBm -86 ± 2dBm BAR 5 → 4 -94 ± 2 dBm -90 ± 2dBm BAR 4 → 3 -98 ± 2 dBm -94 ± 2dBm BAR 3 → 2 -102 ± 2 dBm -98 ± 2dBm BAR 2 → 1 -106 ± 2 dBm -102 ± 2dBm BAR 1 → 0 -110 ± 2 dBm -106 ± 2dBm LGE Internal Use Only - 14 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 2. PERFORMANCE 2.6 Battery BAR Indication Standby Bar 7 3.96 ± 0.05V Bar 7 → 6 3.95 ± 0.05V Bar 6 → 5 3.86 ± 0.05V Bar 5 → 4 3.78 ± 0.05V Bar 4 → 3 3.74 ± 0.05V Bar 3 → 2 3.69 ± 0.05V Bar 2 → 1 3.63 ± 0.05V Bar 1 → Empty 3.50 ± 0.05V Low Voltage, 3.63,3.50 ± 0.05V (Stand-by) / 3.63, 3.50 ± 0.05V (Talk) Warning message + tone Bar 2 → 1 / Bar 1 → Empty Power Off 3.20 ± 0.05V Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 15 - LGE Internal Use Only 2. PERFORMANCE 2.7 Sound Pressure Level No 1 Test Item Sending Loudness Rating (SLR) 2 Receiving Loudness Rating (RLR) 3 4 5 6 7 Side Tone Masking Rating (STMR) Echo Loss (EL) Sending Distortion (SD) Receiving Distortion (RD) Idle Noise-Sending (INS) 8 Idle Noise-Receiving (INR) 9 Sending Loudness Rating (SLR) 10 Receiving Loudness Rating (RLR) 11 12 13 14 15 Side Tone Masking Rating (STMR) Echo Loss (EL) Sending Distortion (SD) Receiving Distortion (RD) Idle Noise-Sending (INS) 16 Idle Noise-Receiving (INR) MS Max Nor Max Specification 8 ±3 dB -4 ± 3 dB -15 ± 3 dB 17 dB 40 dB Refer to Table 30.3 Refer to Table 30.4 -64 dBm0p Under -47 dBPA Under -36 dBPA 8±3dB -1 ±3 dB -12 ±3 dB 25 dB 40 dB Refer to Table 30.3 Refer to Table 30.4 -55 dBm0p Under -45 dBPA Under -40 dBPA Max Under -62 dBm Nor Max Min Min Max Nor Max Headset TDMA Noise -. GSM : Power Level : 5 DCS/PCS : Power Level : 0 (Cell Power : -90 ~ -105 dBm) MS and Headset 17 -. Acoustic (Max Vol.) MS/Headset SLR : 8 ± 3dB MS/Headset RLR : -15 ± 3dB/-12dB (SLR/RLR : Mid-value setting) Nor Max Min Min 2.8 Charging - Charging Method : CC & CV (Constant Current & Constant Voltage) - Maximum Charging Voltage : 4.2V - Maximum Charging Current : 650mA - Nominal Battery Capacity : 950 mAh - Charger Voltage : 4.8V - Charging time : Max 3 h (Except time trickle charging) - Full charge indication current (icon stop current) : 60mA - Low battery POP UP : 3.48V - Low battery alarm interval : Idle - 3 min, Dedicated - 1min - Cut-off voltage : 3.22V LGE Internal Use Only - 16 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 General Description The KS10 supports UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. All receivers and the UMTS transmitter use the radio One1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The EGSM, DCS1800 and PCS1900 transmitters use a baseband-to-IF up-conversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF. KS10 high-level RF functional block diagram 1 QUALCOMM’s branded chipset that implements a Zero-IF radio architecture. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 17 - LGE Internal Use Only 3. TECHNICAL BRIEF A generic, high-level functional block diagram of KS10 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a switch module (plus a duplexer for UMTS-2100 operation). UMTS band signals at the antenna are switched to the relevant UMTS duplexer. The UMTS receive band signals are amplified by the front-end LNAs of the RFR6250 IC before passing through a bandpass filter and being applied to the mixer inputs of the RFR6250 IC. On-chip circuits down-convert the received signal directly from RF to baseband using radioOne Zero-IF techniques. Generation and distribution of the UMTS LO, for the down-converter, is performed entirely on-chip (except for the loop filter). The RFR6250 IC outputs analog baseband signals for processing by the MSM device. This baseband interface is shared with the RTR6250 GSM receiver outputs, but is separate from the GPS baseband interface. EGSM, DCS and PCS receive signals from the antenna switch module pass through their band-pass filters, then are applied to the RTR6250 IC. In a similar fashion to the UMTS paths, RTR6250 IC circuits down-convert the received signals directly from RF to baseband. The GSM LO for multiband down conversion is entirely generated within the RTR6250 IC (PLL and distribution functions) with exception of the off-chip loop filter. The RTR analog baseband outputs are routed to the MSM6275 IC for further processing (an interface shared with the RFR UMTS receive paths). The UMTS transmit path begins with analog baseband signals from the MSM device that drive the RTR6250 IC. Integrated PLL and VCO circuits generate the Tx LO used in the quadrature upconverter that translates baseband signals directly to RF. The RTR6250 output driver stages deliver fairly highlevel signals that are filtered and applied to the power amplifiers (PA). The PA output is routed to the antenna through a duplexer and switch module. The shared EGSM-900, DCS-1800, and PCS-1900 transmit path begins with the same baseband interface from the MSM6275 IC that is used for the UMTS band. A single EGSM/DCS/PCS quadrature upconverter translates the GMSK-modulated signal to a convenient intermediate frequency (IF) that forms one input to an offset phase-locked loop (OPLL). OPLL functions are split between the RTR6250 IC and off-chip loop filter and dual Tx VCO circuits, and translate the GMSK-modulated signal to the desired EGSM-900, DCS-1800 or PCS-1900 channel frequency. This signal is applied to a dual power amplifier (only one is active at a time). The enabled path continues with the PA, an automated power control (APC) circuit that samples the transmit power and adjusts its level, the switch module (which includes a band-appropriate lowpass filter), and the antenna. KS10 power supply voltages are managed and regulated by the PM6250 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators. The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions. LGE Internal Use Only - 18 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.2 GSM Mode 3.2.1 GSM Receiver The Dual-mode KS10’s receiver functions are split between the two RFICs as follows: • UMTS-2100 operation uses the RFR6250 Receiver ICs to implement the receive signal path, accepting an RF input and delivering analog baseband outputs (I and Q). • EGSM-900, DCS-1800, and PCS-1900 modes both use the RTR6250 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SBI2-controlled parameters. The EGSM, DCS, and PCS receiver inputs of RTR6250 are connected directly to the transceiver frontend circuits(filters and antenna switch module). EGSM, DCS, and PCS receiver inputs are similar to the RFR6250 UMTS Rx input in that they also use differential configurations to improve commonmode rejection and second-order non-linearity performance. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins Since EGSM, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers - this is accomplished in the switch module. The EGSM, DCS, and PCS receive signals are routed to the RTR6250 through band selection filters and matching networks that transform single-ended 50-Ω sources to differential impedances optimized for gain and noise figure. Similar to the RFR, the RTR input uses a differential configuration to improve second-order inter-modulation and common mode rejection performance. The RTR6250 input stages include MSM-controlled gain adjustments that maximize receiver dynamic range. The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM6275 IC for further processing (an interface shared with the RFR6250 UMTS receiver outputs). 2 The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS Software documentation for details. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 19 - LGE Internal Use Only 3. TECHNICAL BRIEF LGE Internal Use Only - 20 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.2.2 GSM Transmitter The shared GSM Low-band (EGSM900) and High-band (DCS1800, PCS1900) transmit path begins with the baseband inputs from the MSM6275 IC. These differential analog input signals are buffered, lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and generation circuits within RTR6250. This upconverter translates the GMSK-modulated signal to a convenient intermediate frequency (IF) that forms one input to a frequency/phase detector circuit. This IF signal is the reference input to an offset phase-locked loop (OPLL) circuit as shown in Figure 1.2.2-1. Figure 1.2.2-1 Offset phase-locked loop interfaces The feedback path of this OPLL circuit includes a downconversion from the RF output frequency range to the IF range. The two inputs to this downconversion mixer are formed as follows: 1. The dual Tx VCO output (operating in the desired RF output frequency range) is buffered within the RTR6250 IC then applied to the mixer RF port. 2. The LO Generation and Distribution circuits that deliver the transmit path.s LO for the baseband-to-IF upconversion also provides the offset LO signal that is applied to the feedback path.s mixer LO port. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 21 - LGE Internal Use Only 3. TECHNICAL BRIEF The mixer IF port output is the offset feedback signal - the variable input to the frequency/phase detector circuit. The detector compares its variable input to its reference input and generates an error signal that is lowpass filtered by the loop filter and applied to the dual Tx VCO tuning port to force the VCO output in the direction that minimizes errors. As mentioned earlier, the VCO output is connected to the feedback path thereby creating a closed-loop control system that will force frequency and phase errors between the variable and reference inputs to zero. The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM channel frequency. A phase-locked loop circuit is used to translate the GMSKmodulated signal from IF to RF primarily for two reasons: 1. Phase-locked loops provide a lowpass filter function from the reference input to the VCO output. These results in a bandpass function centered at the desired channel frequency that provides steep, well-controlled rejection of the out-of-band spectrum. 2. The resulting output bandpass function is virtually unchanged as the transmitter is tuned over channels spanning the GSM operating band. The PA is a key component in any transmitter chain and must complement the rest of the transmitter precisely. For GSM band operation, the closed-loop transmit power control functions add even more requirements relative to the UMTS PA. In addition to gain control and switching requirements, the usual RF parameters such as gain, output power level, several output spectrum requirements, and power supply current are critical. The gain must be sufficient and variable to deliver the desired transmitter output power given the VCO output level, the subsequent passive devices’ losses, and the control set point. The maximum and minimum transmitter output power levels depend upon the operating band class and mobile station class per the applicable standard. Transmitter timing requirements and in-band and out-of-band emissions, all dominated by the PA, are also specified by the applicable standard. The active dual Tx VCO output is applied to the dual power amplifier to continue the transmit path, and feedback to the RTR6250 IC to complete the frequency control loop. The PA operating band (EGSM or DCS/PCS) is selected by the MSM device GPIO control. (GSM_PA_BAND). LGE Internal Use Only - 22 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.3 WCDMA Mode 3.3.1 Receiver The UMTS duplexer receiver output is routed to LNA circuits within the RFR6250 IC. The LNA gain is dynamically controlled by the MSM6275 IC to cover full receiver dynamic range and to save current consumption. The UMTS LNA output is routed to the down conversion mixer inputs, in the RFR6250 IC, through a band selection filter that transforms a single-ended 50-Ω source to differential 100-Ω load impedance that is matched to the RFR6250 IC. The RFR input uses a differential configuration to improve secondorder inter-modulation and common mode rejection performance. The RFR6250 IC input stages include MSM-controlled gain adjustments that further extend receiver dynamic range. The amplifier output drives the RF port of the quadrature RF-to-baseband down-converter. The downconverted baseband outputs are routed to low-pass filters (one I and one Q) having pass-band and stop-band characteristics suitable for DS-WCDMA processing. The filter outputs are buffered and passed on to the MSM6275 IC for further processing. This baseband interface is shared with the RTR6250 GSM receiver outputs. The RFR6250 IC includes LO generation and distribution circuitry to reduce off-chip component requirements. The GPS RX LO source is created using the PLL control elements of the RTR6250 PLL2, via a discrete loop filter components, in tandem with the VCO in the RFR6250. Using only this PLL signal, the RFR6250 LO generation and distribution circuits create the necessary LO signals for the UMTS quadrature down-converter. By definition, the ZIF down-converter requires FLO equal to FRF, and the RTR6250/RFR6250 design achieves this without allowing FVCO to equal FRF. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 23 - LGE Internal Use Only 3. TECHNICAL BRIEF Figure 1.3.1-1 RFR6250 IC functional block diagram LGE Internal Use Only - 24 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.3.2 Transmitter The UMTS transmit path begins with analog baseband signals from the MSM device that drive the RTR6250 IC. The RTR6250 IC provides all the UMTS transmitter active signalpath circuits except the power amplifiers. Analog (I and Q) differential signals from the MSM device are buffered, filtered, and applied to Baseband-to-RF quadrature upconverters. Gain control is implemented on-chip. The RF outputs include an integrated matching inductor, reducing the off-chip matching network to a single series capacitor. The RTR6250 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. The PA device used in KU950 is “Load Insensitive PA”- no need to use isolator - and routed to the duplexer Tx port directly. Transmit power is delivered from the duplexer to the antenna through the switch module. The RTR6250 IC integrates LO generation and distribution circuits on-chip, substantially reducing offchip requirements. Various modes and programmable features result in a highly flexible transceiver LO output that supports not only UMTS transmissions, but all EGSM900 and DCS1800/PCS1900 Rx and Tx modes as well. The UMTS Tx LO (PLL1) is generated almost entirely on-chip, requiring only the loop filter off-chip (two capacitors and two resistors); all UMTS Tx VCO and PLL circuits are on-chip. An internal RTR6250 switch routes the internal VCO signal to the LO generation and distribution circuits to create the necessary UMTS Tx LO signals. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 25 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.4 LO Phase-locked Loop Most LO functions are fully integrated on-chip, do not require user adjustment, and need not be considered by handset designers. QUALCOMM has established and implemented frequency plans and LO generation schemes that support the radioOne 6250-IIseries chipset while requiring minimal off-chip design effort. Only one area requires handset designer attention: the loop filters of each phase-locked loop (PLL). 3.4.1 UMTS Rx PLL (PLL2) UMTS Rx LO functional blocks are distributed between the RFR6250 IC, RTR6250 IC, and external UMTS_RX_CH_VCO and loop filter components (Figure 1.4.1-1). The external UMTS_RX_CH_VCO must be enabled for UMTS Rx operation and disabled otherwise; a dedicated MSM6275 IC signal (UHF_VCO_EN ) enables the VCO. Figure 1.4.1-1 UMTS Rx PLL functional block diagram LGE Internal Use Only - 26 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF The RFR6250 IC accommodates single-ended or differential LO inputs; if single-ended, either pin can be active. AC-couple the inactive pin to ground using an appropriately valued capacitor (12 pF is used in KS10). The 27 pF capacitor should be used to AC-couple the active pin to the VCO signal. Using only the selected VCO signal, the RFR6250 IC LO generation and distribution circuits create the necessary LO signals for the active quadrature downconverter. A sample of the downconverter LO is buffered and routed from RFR6250 IC pin 19 to RTR6250 IC pin 32 (RX_VCO_IN). This signal requires a terminating resistor near the RTR6250 IC input pin and an AC coupling capacitor that assures the internal RTR6250 IC biasing is not disrupted in the example. Good microstrip or stripline controlled-impedance techniques must be used. Most UMTS Rx PLL circuits are included within the RTR6250 IC: reference divider, phase detector, charge pump, feedback divider, and digital logic that generate LOCK status. The buffered 19.2 MHz TCXO signal provides the synthesizer input (REF), the frequency reference to which the PLL is phase and frequency locked. The reference is divided by the RCounter to create a fixed frequency input to the phase detector, FR. The other phase detector input (FV) varies as the loop acquires lock, and is generated by dividing the RX_VCO_IN frequency using the feedback path.s N-Counter. The closed loop will force FV to equal FR when locked. If the loop is not locked the error between FV and FR will create an error signal at the output of the charge pump. This error signal is filtered by the loop filter and applied to the VCO, tuning the output frequency such that the error is decreased. Ultimately the loop forces the error to approach zero and the PLL is phase and frequency locked. Many key PLL performance characteristics are largely determined by the loop filter design - stability, transitory response, settling time, and phase noise. 3.4.2 Transceiver PLL (PLL1) All LO functional blocks for the other handset modes(UMTS Tx, EGSM Tx/Rx, DCS Tx/Rx, PCS Tx/Rx) are integrated into the RTR6250 IC except the loop filter components (Figure 1.4.2-1). On-chip circuits include reference divider, phase detector, charge pump, VCO, feedback divider, and digital logic status. The functional description given in Section 1.4.1 for the UMTS Rx PLL applies to the Transceiver PLL as well. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 27 - LGE Internal Use Only 3. TECHNICAL BRIEF Figure 1.4.2-1 Transceiver PLL functional block diagram The off-chip loop filter allows optimization of key PLL performance characteristics (stability, transitory response, settling time, and phase noise) for different applications. Guidelines are provided in the next subsection for proper implementation of this critical circuit. LGE Internal Use Only - 28 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.5 Off-chip RF Components 3.5.1 Front End Module(FL500) Front End module integrates antenna switch module and GSM Rx filter. The antenna switch module allows multiple operating bands and modes to share the same antenna. In the KS10 design, a common antenna connects to one of six paths: 1) UMTS-2100 Rx/Tx, 2) EGSM Rx, 3) DCS-1800 Rx, 4) PCS-1900 Rx, 5)EGSM Tx, and 6) DCS1800, PCS-1900 Tx. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. GSM band of operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required. The module includes lowpass filters for the GSM bands transmit paths to reduce out-of-band emissions, PA harmonics in particular. The GSM mode RF filters are located before their LNAs, so their insertion losses are extremely critical (1.3 dB typical). Other important parameters are: ■ Out-of-band rejection or attenuation levels ❏ Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency. ❏ Frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input. ❏ GSM band receivers operate while the handset transmitters are off so there are no Txband leakage attenuation requirements. ■ Phase and amplitude balance - the UMTS discussion presented above applies for GSM bands as well. See the data sheet for specific values. Of course, passband ripple and return loss are still important in all cases for the same reasons explained in the antenna switch module and duplexer sections. 3.5.2 UMTS duplexer (U506) A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include: - Insertion loss . this component is also in the receive and transmit paths; In the KS10 typical losses: UMTS Tx = 1.45 dB, UMTS Rx = 1.86 dB. - Out-of-band rejection or attenuation . the duplexer provides input selectivity for the receiver, output filtering for the transmitter, and isolation between the two. Rejection levels for both paths are specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver performance: - Rx-band isolation . the transmitter is specified for out-of-band noise falling into the Rx band. This noise leaks from the transmit path into the receive path, and must be limited to avoid degrading receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and Rx-band losses between the PA and LNA. Typical duplexer Rx band isolation value is 51 dB. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 29 - LGE Internal Use Only 3. TECHNICAL BRIEF - Tx-band isolation . the transmit channel power also leaks into the receiver. In this case, the leakage is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Typical duplexer Tx-band isolation value is 57 dB. - Passband ripple . the loss of this fairly narrowband device is not flat across its passband. Passband ripple increases the receive or transmit insertion loss at specific frequencies, creating performance variations across the bands channels, and should be controlled. - Return loss . minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1). - Power handling. high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be used between the UMTS PA and duplexer to assure proper performance. 3.5.3 UMTS Power Amplifier (U505) The AWT6277 meets the increasing demands for higher output power in UMTS handsets. The PA module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6250 chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-ofthe-art reliability, temperature stability, and ruggedness. Selectable bias modes that optimize efficiency for different output power levels, and a shutdown mode with low leakage current, increase handset talk and standby time. The self-contained 4 mm x 4 mm x 1.1 mm surface mount package incorporates matching networks optimized for output power, efficiency, and linearity in a 50 Ω system. Figure 1.5.3-1 UMTS PA functional block diagram LGE Internal Use Only - 30 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.5.4 Thermistor (R527) This thermistor senses temperature variations around UMTS PA to adjust PA gain deviation for assure compliance with the applicable transmit power control standards. Negative temperature compensation thermistor is used in the KS10. 3.5.5. UMTS transmit power detector (U504) This detector couples PA output power level to calibrate the transmitter characteristic over the channel variation and temperature. Its detector coupling range and converted voltage is based on diode sensitivity and transmitter power level. The KS10 uses National Semiconductor ADL5500 power detector IC. In Figure 1.5.5-1, C580 is set to 47ohm&Coupler resulting in an attenuation of 31.4dB. The output voltage is proportional to the logarithm of the input power. Figure1.5.5-2 shows the output voltage versus PA output power of the ADL5500 setup as depicted in Figure1.5.5-1 Figure 1.5.5-1 Block diagram of ADL5500 with resistive tap Figure 1.5.5-2 Power detector response, Vout vs PA output power Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 31 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.5.6 Dual band GSM power amplifier (U501) The TQM7M5003 is a high-power, high-efficiency power amplifier module with integrated power control that provides over 50dB of control range. The devices is a self-contained 6mm°ø6mm module with 50Ω input and output terminals. The device is designed for use as the final RF amplifier in GSM850, EGSM900, DCS and PCS hand-held digital celluar equipment and other applications in the 824MHz to 849MHz, 880MHz to 915MHz, 1710MHz to 1785MHz and 1850MHz to 1910MHz bands. The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power amplifier control function, which is insensitive to variations in temperature, power supply, process, and input power. The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain. Figure 1.5.6-1 GSM PA functional block diagram 3.5.7 GSM transmit VCO (U502) The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts PLL and transmitter performance. VCO specifications refer to muRata MQW5V0C869M datasheet. The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network that splits the active signal into two signals: 1) the input to the active PA . this is the low loss path, and 2) the OPLL feedback signal . this is the high loss path. See Figure 8-1 for recommended topology and resistor values. The losses from the VCO outputs to the PA inputs must be factored into the output chain.s power budget. Each path includes a π-pad that introduces approximately a 3-dB loss. The low band GSM π-pad is formed by R516 plus R522, R521, and R524; the high band GSM π-pad is formed by R518 plus R523, R520, and R524. One leg of each π-pad is used to couple the VCO output to form the feedback path as described below. For a given VCO output drive level, the loss to the RTR6250 input must assure the specified input level is achieved (-18 to -12 dBm). Large resistors included in the π-pads are used to lightly couple off the VCO outputs to create the feedback signal. Since the RTR6250 TX_VCO_FB pin presents fairly high impedance. A series capacitor (82 pF) AC couples the feedback signal into the RTR6250 IC. LGE Internal Use Only - 32 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.5.8 UMTS Rx RF filter (FL501) An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include: ■ Out-of-band rejection or attenuation levels, usually specified to meet these conditions: ❏ Far out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency. ❏ Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage. ❏ Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input. ■ Phase and amplitude balance - the ZIF architecture requires well-balanced differential inputs to the RFR6250 IC. This is accomplished by the RF filter which takes a single-ended output from the RFL6250 IC and provides differential outputs having nominal 180 phase separation. Phase and/or amplitude imbalance causes degraded common-mode rejection and second-order nonlinearity, so their requirements are specified jointly. ❏ ±3 degrees and ± 1 dB ❏ -12 to + 3 degrees and ± 0.7 dB Of course, passband ripple and return loss are still important in all cases for the same reasons explained in the antenna switch module and duplexer sections. 3.5.9 VCTCXO (X500) The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6275 IC. The 6275-series chipset requires a 19.2 MHz nominal VCTCXO frequency. The oscillator frequency is controlled by the MSM6275’s TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control. The filtered PDM signal results in an analog control signal into the VCTCXO tuning port whose voltage is directly proportional to the density of the digital bit stream. The MSM device varies the pulse density to change the analog control voltage that sets the oscillator frequency - all within a feedback control loop that minimizes handset frequency drift relative to the network. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 33 - LGE Internal Use Only 3. TECHNICAL BRIEF 3. BB Technical Description 3.6 Digital Baseband (Stn8810 / MSM6275) 3.6.1 General features of Stn8810 device • Support for Peripheral Device & multimedia function • Support for high-speed downlink packet access (HSDPA) - 1.8 Mbps • Minimal support for high-level operating system such as Symbian™, Linux and WinCE® operating systems (OSs). • 1-Gbit NAND Flash memory, 512-Mbit DDR mobile RAM Stacked in Package • Two DSP implementation for multimedia function - Smart video accelerator : Programmable DSP (MMDSP+) for intermediate level processing, clocked at 66 MHz, - Smart audio accelerator : High-performance block, flexible sophisticated audio accelerator based on the MMDSP+ programmable audio DSP, clocked at 133 MHz, • ARM926EJ 32-bit RISC CPU at 350MHz 32-Kbyte instruction cache, 16-Kbyte data cache • MultiMedia Card/SD Card/SDIO host controller • 96 general-purpose I/Os (muxed with peripheral I/Os) • Camera interfaces - Supports high-resolution camera modules up to 4 Mpixels - Serial camera interface up to 416 Mbit/s (MIPI legacy CSI) - Parallel camera CCIR-656 interface up to 66 MHz (MIPI legacy CPI) • Color LCD controller for STN or TFT panels or display interface for display module - 24-bpp true color - MIPI legacy DBI and DPI • Host port interface (HPI) - 16-bit parallel data bus, - Multiplexed and non-multiplexed address/data bus, - Indirect host access, - Direct host access to a segment of STn8810 memory in multiplexed mode. - Interface to modem for data communication • I/O peripherals - 3 autobaud UARTs (one with modem control signals) up to 3.692 Mbit/s - 1 synchronous serial port (SSP) up to 24 Mbit/s - 3 multichannel serial ports (MSP) up to 48 Mbit/s - 2 I©˜C multi-master/slave interfaces - One 8-channel, full-duplex high-speed serial interface, 108 Mbit/s - Host port interface - JTAG LGE Internal Use Only - 34 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.6.2 General features of MSM6275 device • Support for multimode operation - WCDMA(UMTS), GSM/GPRS, EDGE • Support for high-speed downlink packet access (HSDPA) - 1.8 Mbps • Support for WCDMA (UMTS) uplink data rate up to 384 kbps • High-performance ARM926EJ-S running at up to 225 MHz • ARM Jazelle Java hardware acceleration for faster Java-based games and other applets • QDSP4000 high-performance DSP cores • Integrated gpsOne position location technology functionality • Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals • High-speed, serial mobile display digital interface (MDDI) Type I, which optimizes the interconnection cost between the MSM device and LCD panel • Direct interface to digital camera module with video front end (VFE) image processing • Vocoder support (AMR, FR, EFR, HR) • Advanced 14x14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology • WCDMA Access - Maximum of eight simultaneous transport channels - Four coded composite transport channels (CCTrCH) - PS data rates supporting 384kbps DL / 64kbps UL • GSM/GPRS Access - GSM/GPRS network signaling (from Layer 1 to 3) - GSM AMR,EFR,FR • Operation and Services - USIM Interfaces - General Purpose I/O (GPIO) Interface - Dual Memory Buses (EBI1-SDRAM & EBI2-NAND Flash) - JTAG - RTC • Data Communication - UARTs (ACB, EDB (RS232)) - Slave USB Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 35 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.7. Hardware Architecture GSM Quadband GSMQua d PA TX VCO GSM TX USIM GSM 900/1800/1900 RX FILTER FEM GSM RX RTR6250 MSM6275 WCDMA TX D U P L E X E R UMTS UMTS (2100) TX FILTER PA WCDMA RX SDRAM + NAND UMTS RX FILTER RFR6250 PM6650 18pin 18pin MMI MMI Connector Connector STw4810 Receiver / SPEAKER MIC HPI I/F Audio Codec. (WM8753) BLUETOOTH Micro SD STn8810 1.3M CAMERA VGA CAMERA MAIN LCD Figure. Simplified Block Diagram LGE Internal Use Only - 36 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.7.1. STn8810 and supported peripherals Figure. STn8810 and supported peripherals Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 37 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.7.2. MSM6275 and supported peripherals Figure. MSM6275 and supported peripherals LGE Internal Use Only - 38 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.8. Subsystem of STn8810 3.8.1. ARM926EJ processor The STn8810 CPU is an ARM926EJ reduced instruction set computer (RISC) processor. This 32-bit processor core supports 32-bit ARM® and 16-bit Thumb instruction sets, enabling the user to trade off between high performance and high code density. The cached ARM CPU features a memory management unit (MMU) and is clocked at 264 MHz. It has a 32-Kbyte instruction cache and a 16-Kbyte data cache, and supports the Jazelle™ extensions for Java acceleration. It also includes an embedded trace module (ETM Medium+) for real-time CPU activity tracing and debugging. It supports 4-bit and 8-bit normal trace mode and 4-bit demultiplexed trace mode, with normal or half-rate clock. 3.8.2. Smart video accelerator (SVA) Using leading-edge technology, this block is a low-power, high-performance video accelerator that supports the following features: • MPEG-4 simple profile level 3 video encoder and decoder; real time up to VGA 30 fps (encode only or decode only) • H.263 profile 3 level 10 video codec; real time subQCIF or QCIF 15 fps for videoconferencing • H.263 profile 3 level 30 video encoder or decoder; real-time up to CIF 30 fps • JPEG baseline accelerated encoder or decoder, up to 4080 x 4080 pixels • Programmable DSP (MMDSP+) for intermediate level processing, clocked at 66 MHz • Picture pre-/post-processing • Low-power implementation 3.8.3. Smart audio accelerator (SAA) This high-performance block is a flexible sophisticated audio accelerator based on the MMDSP+ programmable audio DSP, clocked at 133 MHz, and features: • 24-bit data path • Ultra-low power implementation The audio accelerator features: • MP3, AAC, AAC+ (SBR) decoding, Midi synthesis, and more • Speech codecs: AMR (WB, NB), and more • Audio sample rates of 32 kHz, 44.1 kHz and 48 kHz • Noise reduction and echo cancelling • Stereo enhancements and surround effects Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 39 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.8.4. Advanced power management unit (PMU) The dynamic PMU optimizes power consumption of the STn8810. It delivers all the platform clocks, and handles reset management. It also manages GPIO levels during sleep mode and emergency self-refresh of SDRAM. The PMU controls the external voltage regulator, in order to change its settings in different modes. In deep-sleep mode, only GPIOs, the real-time clock (RTC), system and reset controller (SRC), PMU and secured RAM remain in operation. The PMU also controls the embedded 1.2 V voltage switch that switches off the logic supply after the platform has entered sleep mode. The family of power manager ICs, STw481x companion chips, seamlessly interface with the Nomadik STn8810 and optimize global system power consumption leveraging on the PMU. 3.8.5. Host port interface (HPI) The host port interface features: • 16-bit parallel data bus • Multiplexed and non-multiplexed address/data bus • Indirect host access • Direct host access to a segment of STn8810 memory in multiplexed mode 3.8.6. General purpose inputs/outputs (GPIOs) The STn8810 provides 96 programmable inputs or outputs that have switchable pull-up and pull-down resistors and are controllable in two modes: • Software mode through an APB bus interface • Hardware mode through a hardware control interface The GPIO interface provides the following individually programmable functions: • Any number of pins may be configured as interrupt sources • Debouncing logic can be enabled for each GPIO to filter out glitches on I/Os • Any GPIO may be used to wake up the device from sleep mode independent of interrupt programming, and the input level that triggers wake-up is definable for each enabled GPIO 3.8.7. Universal asynchronous receivers-transmitters (UARTs) The STn8810 provides three autobaud UARTs, one of which offers all modem control/status signals. They are enhanced versions of the industry-standard 16C550 UART with a high data rate up to 3.692 Mbit/s. LGE Internal Use Only - 40 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.8.8. USB interface The STn8810 USB interface is USB 2.0 compliant, with On-The-Go standard extension (rev 1.0) compliance. The USB-OTG features: • Supports full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) signaling bit rate • Supports session request protocol (SRP) and host negotiation protocol (HNP) • 8 bidirectional endpoints plus control endpoint 0 • Digital interface to external PHY • Fully compatible with STw4810 power manager companion chip 3.8.9. I2C bus interface The STn8810 provides two I©˜C bus interfaces that support the following features: • Slave transmitter/receiver and master transmitter/receiver modes • Multi-master capability • 10-bit addressing • Standard (100 kHz) and fast (400 kHz) speeds • Compliance with I2C and DDC standards In addition to receiving and transmitting data, the interface converts data from serial to parallel format and vice-versa using an interrupt or polled handshake. The interrupts are enabled and disabled in software. 3.8.10. MultiMediaCard/secure data card interface (MMC/SD/SDIO) This interface can directly control one SD card (without encryption/decryption logic) or SDIO card, or one MultiMediaCard. It also supports several of each card type using the GPIOs for card selection. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 41 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.9. Hardware Peripheral system of Stn8810 3.9.1. Keypad KS10 has 28 buttons, 12 function keys in Sub PCB (Folder), 12 numeric keys in main and 4 side keys. KS10 use key coder IC because Stn8810 has not enough GPIO. Key coder IC use interrupt and I2C interface for communication with STn8810. Figure shows the Keypad circuit. °ÆEND’ Key is connected to PM_ON_SW_N to PM6650 COL0 COL1 COL2 COL3 COL4 COL5 COL6 ROW0 1 2 3 Vol. UP Left Soft Key UP Right Soft Key ROW1 4 5 6 Vol. DOWN MENU OK CANCEL ROW2 7 8 9 SHOT SEND DOWN END ROW3 * 0 # LEFT EDIT RIGHT Main Side Key Folder Table. Key Matrix Mapping Table AP_VDD_IO_2.7V KEY_ROW(0:3) R414 R415 KEY_ROW(1) KEY_ROW(0) KEY_ROW(3) KEY_ROW(2) 3.3K 3.3K NC5 NC6 NC7 NC8 NC1 NC2 NC3 NC4 K_Out3 K_Out2 K_Out1 K_Out0 _RESET Int_Rx WD_Out Int_Tx U404 LM8333GGR8_NOPB FOLDER_DETECT 68K R419 KEY_COL(3:0) G5 G4 F4 G3 F3 G2 G1 F2 KEY_COL(3) KEY_COL(2) KEY_COL(1) KEY_COL(0) TP406 KEYCODER_RSTN KEYCODER_INT TP407 C3 C4 C5 D3 D4 D5 E3 E4 E5 GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 Wake_INP6 Wake_INP7 K_Out4 K_Out5 K_Out6 K_Out7 Gen_IO_2 Gen_IO_3 B2 A1 B1 D2 D1 F1 E1 E2 KEY_COL(4) KEY_COL(5) KEY_COL(6) KEY_COL(7) A6 B5 A5 B4 A4 A3 B3 A2 Gen_In1 Gen_In0 CLK_In Gen_IO_0 Gen_IO_1 PWM VCC1 VCC2 KEY_COL(4:7) Wake_INP5 Wake_INP4 Wake_INP1 Wake_INP0 Wake_INP3 Wake_INP2 SCL_AB SDA_AB A7 B6 C7 D7 D6 E7 E6 F7 C2 C1 C6 B7 F5 G6 F6 G7 I2CSCL1 I2CSDA1 C418 C419 0.1u 0.1u AP_VDD_IO_2.7V Figure. Schematic of key coder IC LGE Internal Use Only - 42 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF AP_VDD_IO_2.7V CN400 SW404 SW405 SW406 SW407 SW408 SW409 SW410 SW411 D400 RSB6.8CST2R SW403 KEY_ROW(0) RSB6.8CST2R SW402 D402 SW401 D401 2 4 6 8 RA400 100K 1 3 5 7 SW400 RSB6.8CST2R 1 KEY_ROW(0) KEY_COL(3) KEY_ROW(1) 2 3 4 KEY_ROW(1) KEY_ROW(2) KEY_ROW(3) Side Key (Vol. UP/Down) RSB6.8CST2R RSB6.8CST2R D404 D405 VA406 VA407 KEY_ON_SW_N KEY_COL(3) KEY_ROW(2) RSB6.8CST2R EVLC14S02050 EVLC14S02050 VA405 CN401 1 2 3 4 D403 EVLC14S02050 EVLC14S02050 VA404 EVLC14S02050 EVLC14S02050 VA403 EVLC14S02050 VA402 VA401 KEY_COL(0) KEY_COL(1) KEY_COL(2) Main PCB SW100 SW101 SW102 SW103 SW104 SW105 SW106 SW107 SW108 SW109 SW110 SW111 KEY_ROW(0) KEY_ROW(1) Side Key (Power/Shot) KEY_ROW(2) RSB6.8CST2R RSB6.8CST2R RSB6.8CST2R VA104 VA105 VA106 RSB6.8CST2R RSB6.8CST2R VA103 VA107 RSB6.8CST2R RSB6.8CST2R VA102 KEY_COL(4) KEY_COL(5) KEY_COL(6) VA101 KEY_ROW(3) Sub PCB Figure. Schematic of keypad Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 43 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.9.2. Folder on/off operation There is a magnet to detect the folder status, opened or closed. If a magnet is close to the hall-effect switch, the voltage at pin1 of U402 goes to 0V. Otherwise, 2.7V. This folder signal is delivered to GPIO0 of the Key coder IC . AP_VDD_IO_2.7V R413 100K U402 ZD1 RSB6.8CST2R FOLDER_DETECT C413 1u 1 2 3 A3212EEH-T 6 VDD 5 NC2 4 GND2 7 GND1 PGND OUTPUT NC1 C414 0.1u EUSY0200301 Figure. Schematic of folder on/off detection circuit LGE Internal Use Only - 44 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.9.3. Keypad backlight There are 8 White LEDs on Top side of Main PCB and 9 White LEDs on Top side of sub PCB in board backlight circuit and, which are driven by KEYBD_BACKLIGHT line form PM6650. Key Pad backlight controlled by PM6650. 0 R400 AP_+VPWR LD400 LD401 R402 100ohm R403 100ohm SSC-TWH104-HLS SSC-TWH104-HLS LD402 LD403 R405 100ohm R406 100ohm SSC-TWH104-HLS SSC-TWH104-HLS LD404 LD405 R408 100ohm R409 100ohm SSC-TWH104-HLS SSC-TWH104-HLS LD406 LD407 R411 100ohm SSC-TWH104-HLS R412 100ohm SSC-TWH104-HLS KPD_DRV_N VA400 EVL14K02200 Figure. Schematic of main PCB keypad backlight circuit AP_+VPWR LD100 LD101 R106 100ohm R107 100ohm SSC-TWH104-HLS SSC-TWH104-HLS LD103 LD104 R109 100ohm SSC-TWH104-HLS LD105 LD106 R112 100ohm SSC-TWH104-HLS SSC-TWH104-HLS LD107 LD108 R113 100ohm SSC-TWH104-HLS SSC-TWH104-HLS R110 100ohm SSC-TWH104-HLS R111 100ohm LD102 R108100ohm R114 100ohm SSC-TWH104-HLS KPD_DRV_N VA100 EVL14K02200 Figure. Schematic of key PCB keypad backlight circuit Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 45 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.9.4. Micro SD 1.8V Signal Level shifting 2.85V Signal Clock Command Data PMIC (ST Micro.) Clock Command Data CPU (ST Micro.) SD Socket SD_INT USBVM USBRCV G2 H5 G3 H1 K2 K1 H4 H3 H2 K9 J1 TP305 MCCLK MCFBCLK MCCMDDIR MCCMD MCDAT0DIR MCDATA0 MCDATA31DIR MCDATA1 MCDATA3 MCDAT2DIR MCDATA2 K5 VMMC PMIC F3 LATCHCLK G1 CLKOUT C332 2.2u F1 E3 E2 E1 F2 DATAOUT3 DATAOUT2 DATAOUT1 DATAOUT0 CMDOUT (ST Micro.) B1 B7 B8 C5 F8 G8 K10 C335 NA J4 VBAT_MMC NC1 NC2 NC3 NC4 NC5 NC6 NC7 MCCLK MCFBCLK MCCMDDIR MCCMD MCDAT0DIR MCDAT0 MCDAT31DIR MCDAT1 MCDAT3 MCDAT2DIR MCDAT2 DN USBVM K7 USBRCV H8 USBINTN G9 USBSCL H9 USBSDA USBSCL USBSDA VMMC_3.1V J5 GPO1 K6 GPO2 B9 GND1 D3 GND2 NA USBINTN C334 1u SD_DAT(1) SD_DAT(0) SD_CLK SD_CMD SD_DAT(3) SD_DAT(2) C336 NA 51K R314 NA 51K R312 R311 R313 51K 51K 51K R310 R309 S300 GCC110-8S-R-E1000 GND SWB SWA SD_DAT(1) SD_DAT(0) 8 7 6 5 4 3 2 1 SD_CLK SD_CMD SD_DAT(3) SD_DAT(2) PLR0504F 4 6 5 C339 1u 3 2 1 D301 6 1 3 D300 PLR0504F 5 4 GND 2 MSPTXD0 MSPTFS0 MSPRXD0 MCDAT2DIR REMOTE_PWR_ON_AP SW_RESET SD_INT D15 C15 E16 F17 F24 G24 H22 SD Socket MSPTXD0 MSPTFS0 MSPRXD0 MSPSCK0 MSPTXD2_SMPCE2N MSPTFS2_SMPCE1N MSPTCK2_SMPIORN MCCLK MCFBCLK MCCMD MCCMDDIR MCDAT3 MCDAT2 MCDAT1 MCDAT0 MCDAT0DIR MCDAT31DIR MCCLK MCFBCLK MCCMD MCCMDDIR MCDAT3 MCDAT2 MCDAT1 MCDAT0 MCDAT0DIR MCDAT31DIR D12 E17 C12 E13 D13 C13 E14 D14 C14 E15 VMMC_3.1V SD_INT C343 NA CPU (ST Micro.) LGE Internal Use Only - 46 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.10. Subsystem of MSM6275 3.10.1. ARM Microprocessor Subsystem The MSM6275 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM device, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a generic serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the RFL6202, RFR6202, RTR6250, RTR6200, and PM6650 devices. 3.10.2. UMTS/HSDPA Subsystem The UMTS/HSDPA subsystem performs the digital release 99 June 2004 of the WCDMA FDD standard and release 5 specifications of HSDPA signal processing. The UMTS Subsystem performs the digital UMTS signal processing. Its components include: • Searcher engine • Demodulating fingers • Combining block • Frame deinterleaver • Viterbi decoder • Up-link subsystem • Turbo decoder On the down-link channel the UMTS subsystem searches, demodulates, and decodes incoming CPICH, CCPCH, SCH, and Traffic Channel information. It extracts packet data from the downlink traffic channel and prepares the packet data for processing. For the up-link, the WCDMA subsystem processes the packet data and modulates the up-link traffic channel (DCH). 3.10.3. GSM/GPRS Subsystem The GSM/GPRS/EGPRS subsystem reuses the MSM6275 GSM core. It performs the digital GSM signal processing and PA gain controls for GPRS support. The PA output level is controlled by an analog signal generated on the MSM. In GSM mode, the power profile ramps up before The burst and ramps down after the burst. In GPRS mode, at the beginning of each burst (up to Four active transmit slots), PA must be smoothly ramped up to some desired output power level, Held at that level for the current slot, smoothly ramped down/up during the transition period and Held to the new level for the next slot until the last slot. Then it must be smoothly ramped down to near-zero level. The MSM6275 support differential GSM PA power control output. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 47 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.10.4. RF Interface The RF interface communicates with the mobile station external RF circuits. Signals to these Circuits control signal gain in the Rx and Tx signal path, control DC offset errors, and maintain the system frequency reference. 3.10.5. Serial Bus Interface (SBI) The MSM6275 device’s SBI is designed specifically to be a quick, low pin count control Protocol for QUALCOMM’s RFL6202, RFR6202, RTR6250, RTR6200, and PM6650 ASICs. Using the SBI, the RTR6250, RFR6200, RFL6200, and PM6650 devices can be configured for different operating modes and for minimum power consumption, extending battery life in standby mode. The SBI also controls DC baseband offset errors. 3.10.6. HKADC The MSM6275 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is Intended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6275 device has seven analog input pins (HKAIN[5:0]) which are multiplexed to the input of the internal HKADC. 3.10.7. Stereo Wideband CODEC The MSM6275 device integrates a wideband voice/audio codec into the MSM. The codec supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface. The codec integrates the microphone and earphone amplifiers into the MSM6275 device, reducing the external component count to just a few passive components. The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set externally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems. 3.10.8. Vocoder Subsystem The MSM6275 QDSP4000 supports AMR, FR, EFR, and HR. In addition, the QDSP4000 has modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx automatic volume control (AVC), ear seal echo canceller (ESEC), acoustic echo canceller (AEC), noise suppression (NS), and programmable, 13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM6275 device’s integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures the QDSP4000 to support the desired functionality. LGE Internal Use Only - 48 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.10.9. General-Purpose Input/Output Interface The MSM6275 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases. 3.10.10. UART There are three UARTs in the MSM6275 ASIC: • UART1 for data • UART2 (can be used for USIM interface) • UART3 (can be used for PM SBI interface) 3.10.11. USB The MSM6275 device integrates a universal serial bus(USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral communicating with the USB host. It is also capable of a USB OTG interface to a USB OTG Transceiver. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 49 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.11. External memory interface The MSM6275 have two external memory interfaces with arbitration for the multi-layer AHB system and memory controllers. The EBI1 bus is a high performance bus that supports a wide variety of memories. EBI2 bus is targeted to be the interface for slow peripheral devices(i,.e., LCD) as well as the NAND flash memory. • EBI1 Features - 16 bit static and dynamic memory interface - 32 bit dynamic memory interface - 24 bits of address for static memory devices which can support up to 32MBytes on each chip select - Synchronous burst memories supported (burst NOR, burst PSRAM) - Synchronous DRAM memories supported - Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses - Pseudo SRAM (PSRAM) memory support • EBI2 Features - Support for asynchronous FLASH and SRAM(16bit & 8bit). - Interface support for byte addressable 16bit devices(UB_N & LB_N signals). - 2Mbytes of memory per chip select. - Support for 8 bit wide NAND flash. - Support for parallel LCD interfaces, port mapped of memory mapped(16 & 8 bit) • 512Mb NAND flash memory + 512Mb SDRAM (1die) Interface Spec Device Part Name Maker Read Access Time Write Access Time FLASH TY90009800COGG Toshiba 35 ns/Bytes 50 ns/Bytes SDRAM TY90009800COGG Toshiba 107 ns/4Double Word 53 ns/4Double Word Table. External memory interface for KS10 LGE Internal Use Only - 50 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.12. Hardware sub system of MSM6275 3.12.1. RF Interface 3.12.1.1. RTR6250 (WCDMA_Tx, GSM_Tx/Rx) MSM6275 controls RF part(RTR6250) using these signals. • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • PA_ON : Power AMP on RF part • RX_I/Q,TX_I/Q : I/Q for Tx/Rx of RF • TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier 3.12.1.2. RFR6250 (WCDMA_Rx) • SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset • RX_I/Q, : I/Q for Rx of RF 3.12.1.3. The others • GSM_PA_BAND : DCS/GSM Band Selection of Power Amp • TRK_LO_ADJ : TCXO(19.2M) Control • PA_ON : WCDMA TX Power Amp Enable • ANT_SEL[0-2] : Ant Switch Module Mode Selection (WCDMA,GSM Tx/Rx,DCS Tx/Rx) • GSM_PA_RAMP : Power Amp Gain Control of APC_IC • GSM_PA_EN : Power Amp Gain Control Enable of APC_IC • GSM_TX_VCO_0_EN_N : GSM Band Tx VCO Enable of Dual VCO • GSM_TX_VCO_1_EN_N : DCS Band Tx VCO Enable of Dual VCO Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 51 - LGE Internal Use Only 3. TECHNICAL BRIEF GP_PDM2_PA_RANGE1 GP_PDM1_PA_RANGE0 TRST_N TCK TMS TDI TDO RTCK AUX_PCM_CLK_GRFC14_GPIO80 AUX_PCM_DIN_GRFC13_GPIO14 AUX_PCM_DOUT_GRFC12_GPIO103 AUX_PCM_SYNC_GRFC11_GPIO102 TX_ON_GRFC10 MDDIH_STBN MDDIH_STBP MDDIH_DATN MDDIH_DATP RINGER_GPIO18 1K 2K L13 F19 R607 R608 TX_AGC_ADJ TRK_LO_ADJ TCXO_EN PA_ON (WCMDA 2100PAM Enable) TX_Q_M TX_Q_P TX_I_M TX_I_P DAC_REF F17 A12 B12 A13 B13 F12 C644 0.01u C645 33nF W23 V23 VREG_MSMP_2.7V V25 W25 AA25 AB25 AC25 R609 RX0_Q_M RX0_Q_P RX0_I_M RX0_I_P Y25 D17 H17 H15 MSM_TRST_N MSM_TCK MSM_TMS MSM_TDI MSM_TDO MSM_RTCK D16 F15 D15 A17 H16 K19 N21 G4 (WCMDA PAM MODE) W_VMODE_N J8 H12 B4 T23 T19 D11 H10 F10 D9 A8 TX_ON ANT_SEL2 ANT_SEL1 ANT_SEL0 GSM_TX_VCO_0_EN_N GSM_TX_VCO_1_EN_N GSM_PA_BAND GSM_PA_EN B8 G23 F23 E26 E25 H21 R19 HPIEV_IT_STATE_ETMTRIGIN HPI_EME_APE_ETMPSTA2_XTIDAT HPI_EME_MOD_ETMPSTA1_XTIDAT HPI_IT_MOD_ETMSYNCA_XTIDAT HPI_IT_APE_ETMPSTA0_XTIDAT A22 A23 B22 B23 B20 B19 A20 A19 AD26 MDDIC_DATP MDDIC_DATN MDDIC_STBP MDDIC_STBN H13 GSM_PA_RAMP GSM_PA_DAC_REF L19 PA_POWER_CTL GSM_PA_DAC_REF BT_CLK_GPIO25 BT_SBST_GPIO24 BT_SBCK_GPIO23 BT_SBDT_GPIO22 BT_TX_RX_N_GPIO21 BT_DATA_GPIO20 P25 H23 J26 K26 J25 G21 B3 K23 E23 D21 J19 C25 D22 I2C_SDA_GPIO26 I2C_SCL_GPIO27 CAMIF_DATA9_GPIO61 CAMIF_DATA8_GPIO60 CAMIF_DATA7_GPIO59 CAMIF_DATA6_AUX_TDO_GPIO58 CAMIF_DATA5_AUX_TDI_GPIO57 CAMIF_DATA4_AUX_TMS_GPIO56 CAMIF_DATA3_AUX_TCK_GPIO55 CAMIF_DATA2_AUX_TRST_N_GPIO54 CAMIF_VSYNC_GPIO16 CAMIF_HSYNC_GPIO15 CAMIF_PCLK_GPIO82 CAMIF_DATA0_GPIO83 CAMIF_DATA1_GPIO81 GPIO19 GPIO17 SYNTH1_GPIO41 L15 F16 D20 F20 K21 N16 J23 L21 RF_SBST RF_SBDT RF_SBCK H26 SBST SBDT SBCK GRFC8_GPIO11 GRFC7_GPIO10 GRFX6_GPIO9 GRFC5_AUX_SBST_GPIO8 GRFC4_AUX_SBCK_GPIO7 GRFC3_GPIO6 GRFC2_GPIO5 GRFC1_AUX_SBDT_GPIO4 GRFC0_GPIO3 Near to MSM H18 100K 600-1 M6275_A F18 R611 Q_IM_CH1 Q_IP_CH1 I_IM_CH1 I_IP_CH1 Q_IM_CH0 Q_IP_CH0 I_IM_CH0 I_IP_CH0 H6 100K Q_OUT_N Q_OUT I_OUT_N I_OUT DAC_REF EAR_SENSE_N L25 51K TX_AGC_ADJ TRK_LO_ADJ TCXO_EN_GPIO94 PA_ON0 Y6 R610 XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77 UART3_RFR_N_GPIO87 UART2_DP_RX_DATA_GPIO89 SYNTH0_GP_PDM0_GPIO92 SBST1_GPIO93 C646 0.1u 10% Place near MSM pin AD26 (Check CAM_DATA PINOUT !!!!) Figure. Schematic of RF Interface of MSM6275 LGE Internal Use Only - 52 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.12.2. MSM sub system 3.12.2.1. SIM interface SIM interface scheme is shown in Figure. And, there control signals are followed • USIM_CLK : USIM Clock • USIM_Reset : USIM Reset • USIM_Data : USIM Data T/Rx USIM CLK MSM6275 VREG_USIM 2.85V USIM Reset PM6650 USIM CLK USIM Reset USIM Data USIM USIM Data Figure. SIM Interface 3.12.2.2. UART interface UART signals are connected to MSM GPIO through IO connector with 115.2kbps speed. And, used for RF calibration and Data download. GPIO_Map Name Note GPIO_96 UART_RXD Data_Rx GPIO_95 UART_TXD Data_Tx Table. UART interface Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 53 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.12.2.3. USB The MSM6275 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6275 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the MSM6275. KS10’s USB interface uses the PM6650 internal logic for USB Transceiver. Name Note USB_RCV Rx_Data to MSM USB_DAT Data to/from MSM USB_SE0 Data to/from MSM USB_OE_N Out-Put Enable of Transceiver USB_VBUS USB_Power From Host(PC) USB_D+ USB Data+ to Host USB_D- USB Data- to Host Table. USB signal interface MSM6275 USB_OE_ N USB_DAT PM6650 USB_SE0 USB_VBU S USB_D+ USB_D- MMI Connector Figure. USB Interface PM6650_USB Block USB_CTL_N USB_DAT MSM_USB_D+ USB_SE0 MSM_USB_D- 13 14 15 16 17 18 19 20 21 VREG_5V USB_OE_N VSW_5V USB_CTL_N USB_VBUS USB_DAT USB_D_P USB_SE0 USB_D_M GP1_DRV_N(MPP7) 22 LCD_DRV_N 23 KPD_DRV_N 24 KPDPWR_N 25 VIB_DRV_N C731 4.7u RB521S-30 smd_1608h_9_r UART3_CTS_N_GPIO86 UART3_DP_RX_DATA_GPIO85 UART3_DP_TX_DATA_GPIO84 GPIO40 D7 GPIO42 D701 USB_VBUS D6 L23 M19 M21 F4 E4 UART2_RFR_N_GPIO91 UART2_CTS_N_GPIO90 UART2_DP_TX_DATA_GPIO88 USB_OE_N G6 L26 P16 P21 M23 UART1_RFR_N_PA_POWER_CTL_M_GPIO98 UART1_CTS_N_GPIO97 UART1_DP_RX_DATA_GPIO96 UART1_DP_TX_DATA_GPIO95 D8 GPIO44 F7 GPIO39 F14 GPIO64 MSM6275_USB Block 47K R710 1u C732 Power Line --> Route carefully!!!!! +VPWR --->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWRPM_SBDT PM_SBST PM_SBCK PM_INT_N PS_HOLD MSM_USIM_CLK MSM_USIM_RST_N MSM_USIM_DATA MSM_UART_RXD MSM_UART_TXD Draw the Artwork_line thickly !!!!! 100K Figure. Schematic of USB block (MSM6275 Side & PM6650 Side) LGE Internal Use Only - 54 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.12.2.3. HKADC (House Keeping ADC) The MSM6275 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6275 device has six analog input pins which are multiplexed to the input of the internal HKADC. Figure. MSM6275 HKADC Block diagram ADC Ch# Signal Name Note HKADC0 AMUX_OUT RF PAM Temperature sensing HKADC1 VBATT_SENSE Battery voltage level sensing HKADC2 HDET1 RF WCDMA PAM Power Level sensing HKADC3 VBAT_TEMP Battery Temperature sensing HKADC4 - - HKADC5 - Table. HKADC channel table Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 55 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.12.3. Power Block 3.12.3.1. General MSM6275A, included RF, is fully covered by PM6650-1M(Qualcomm PMIC). PM6650-1M cover the power of MSM6275A, MSM memory, RF block, USIM and TCXO. Major power components are : PM6650-1M (U700) : Phone power supply NUS5530MN (Q701) : External charger supply switching & Main Battery charging control 3.12.3.2. PM6650-1M The PM6650-1M device (Figure 1-1) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference. A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (undervoltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions. MSM device controls and statuses the PM6650-1M IC using a three-line Serial BusInterface(SBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence. LGE Internal Use Only - 56 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF Figure. PM6650-1M Functional Block Diagram Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 57 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.12.3.3. Charging control A programmable charging block in PM6650-1M is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM6650-1M circuits monitor voltages at VCHARGER and ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively. KS10 Charging Control block 4.2V~3.96V 3.95V ~ 3.87V 3.86V~3.79V 3.78V~3.75V 3.74V~3.70V 3.69V~3.64V 3.63V~3.51V 3.50V~3.20V Figure. KS10 Battery Bar Display (Standby condition) LGE Internal Use Only - 58 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.12.3.3.1 Trickle charging Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650-1M IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its performance specified below (3.2V). The charging current is set to 80mA. Parameter Min Typ Max Unit Trickle Current 60 80 100 mA Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 59 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.12.3.3.2 Constant current charging The PM6650-1M IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V. 3.12.3.3.3 Constant voltage charging Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected 10% of the full charging current (60mA) • Charging Method : CC & CV (Constant Current & Constant Voltage) • Maximum Charging Voltage : 4.2V • Maximum Charging Current : 650mA • Nominal Battery Capacity : 950 mAh • Charger Voltage : 4.8V • Charging time : Max 3 h (Except time trickle charging) • Full charge indication current (icon stop current) : 60mA • Low battery POP UP : 3.63V , 3.50V • Low battery alarm interval : warning tone once only • Cut-off voltage : 3.20V LGE Internal Use Only - 60 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.13. Audio and sound 3.13.1. Overview of Audio & Sound & BT path VREG_MSMP_2.7V ANT Filter STLC2500C (BT) AU_19.2M Level Shifter PCM PCM MIC_BIAS BT_19.2M MIC MIC1 UART GPIO LOUT2 ROUT2 WM_DACDAT AMP UART0 MSPRXD0 WM_MSPRXD0 GPIO Switch STN8810 (CPU) I2S GPIO WM_BCLK WM_LRC MSPRCK0 MSPRFS0 WM_MSPTCK0 WM_MSPTFS0 GPIO Level Shifter PM_SCL PM_SDA Speaker OUT3 LOUT1 ROUT1 WM_8753 (Audio Codec) Switch I2CSCL0 I2CSDA0 SPK_AMP_SD_N Receiver I2S SCL SDA MIC2 Head Set RXP RSN MSM WM_MONO1 WM_MONO2 HOOK_SENSE_N EAR_SENSE_N Figure. Block diagram ofaAudio &sSound path Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 61 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.13.2. Audio signal processing & interface 3.13.2.1. MSM6275A audio interface The MSM6275 device integrates a wideband audio CODEC into the mobile station modem. The wideband codec allows the MSM device to support stereo music/ringer Melody applications in addition to the 8 kHz voice band applications on the forward link. In the audio transmit path, the device operates as 13-bit linear converter with software selectable 8 kHz and 16 kHz sampling rate. In the audio receive path, the device operates as a software selectable 13-bit or 16-bit linear converter with software selectable 8 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz sampling rate. Through software, the Rx path can be configured as either a mono or stereo output. The integrated CODEC contains all of the required conversion and amplification stages for the audio front end. The CODEC operates as a 13-bit linear CODEC with the transmit (Tx) and receive (Rx) filters designed to meet ITU-T G.712 requirements. The CODEC includes a programmable sidetone path for summing a portion of the Tx audio into the Rx path. An on-chip Voltage/Current reference is provided to generate the precise voltages and currents required by the CODEC. The interface supports two differential microphone inputs and a differential auxiliary input, each of which can be configured as single-ended if desired. In addition, the interface supports one differential earphone output, one single-ended earphone output, and one differential auxiliary output or two singleended line outputs. The CODEC is configured through the QDSP4000 command types and is not directly controlled by the microprocessor. The CODEC configuration command is sent to the QDSP4000 and then the QDSP4000 executes the command and configures the CODEC. Data is exchanged between the codec interface and the QDSP4000 through its DMA interface. The QDSP4000 uses the Ex_DMA_4 channel for reading data from the codec and uses the Ex_DMA_5 channel to transfer data to the codec. The CODEC interface is shown in more detail in Figure below. Figure. Detailed diagram of MSM6275 audio interface LGE Internal Use Only - 62 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.13.2.2. STn8810 audio interface Smart Audio Accelerator (SAA) This high-performance block performs an audio hardware accelerator based on a programmable audio DSP with 24-bit data path and ultra low power implementation. Figure. Detailed diagram of STn8810 audio interface Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 63 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.13.2.3. WM8753L audio interface The WM8753L is a low Power, high quality stereo Codec with integrated Voice CODEC designed for portable digital telephony applications such as mobile phone, or headset with Hi-Fi playback capability. The device integrates dual interfaces to two differentially connected microphones, and includes drevers for speakers, headphone and earpiece. External component requirements are reduced as no separate microphone or headphone amplifiers are required. Advanced on-chip digital signal processing performs tone control, Bass Boost and automatic level control for the microphone or line input through the ADC. Figure. Detailed diagram of WM8753L audio interface LGE Internal Use Only - 64 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF Handset main MIC BLK L600 100nH 2.2K WM_MICBIAS R221 WM_HPH_R WM_HPH_L WM_RXN WM_RXP WM_MONO2 WM_MONO1 MSM6275A BLK WM_MIC1P MIC200 C245 1 2 C246 39p 1u C247 10p SUMY0009203 WM_MIC1N 2.2K R227 VA201 EVLC18S02015 C251 39p 1u C252 39p Place near C608 C609 C610 C611 NA NA NA NA MSM pin W18 (CODEC VSS) AA20 AE20 AF20 AF22 AF21 AE19 C607 0.1u 10% AF19 AC20 AC19 AC21 AC22 AA19 AA18 T15 AF18 AE18 W17 AA17 AC17 MICOUTN MICOUTP MICFBN MICFBP MICINN MICINP C600 10p AUXON_AUXOR AUXOP_AUXOL HPH_R HPH_L EAR1ON EAR1OP MICBIAS MICOUTN MICOUTP MICFBN MICFBP MICINN MICINP AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P CCOMP AC18 VA200 EVLC18S02015 C248 SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100 SDCC_DAT3_GPIO101 MDP_VSYNC_SECONDA_GPIO104 MDP_VSYNC_PRIMARY_GPIO105 F25 M25 M26 AE3 AD2 Head Set Jack BLK C239 10p C237 10u C238 0.1u R216 1M R217 2.2K AP_VDD_IO_1.8V VIN- 4 VIN+ 3 5 VCC 1 GND OUT CN202 R219 R218 330K 21 19 WM_MIC2N WM_MIC2P C242 R223 33u C244 68 33u FB245 U205 1 1608 IN OUT 2 G1 G2 VBATT_SENSE USB_VBUS_IN UART_TXD UART_RXD C253 33u CN203 1 5 2 4 3 1% 11K ICVL0505600V150FR VA209 INSTPAR 0.01u C259 D201 PSD05-LF EVLC14S02050 VA208 EVLC14S02050 EVLC14S02050 VA207 VA206 47p 47p C256 INSTPAR PSD12-LF D200 C255 EVLC14S02050 EVLC14S02050 VA204 VA205 EVLC18S02003 VA202 EVLC18S02003 VREG_MSMP_2.7V VA203 RSB6.8CST2R VA211 RSB6.8CST2R smd_1608h_9_r 1u 10p C254 33p C258 CONNECTOR VBATT_SENSE PIN CHECK!! 1% +5V_PWR 4 NFM21PC105B1A3 C257 470K NA 3 20 22 R224 REMOTE_PWR_ON 680K R225 WM_LOUT1 WM_ROUT1 USB_D+ USB_DEAR_SENSE_N VBATT 47n 68 R228 R222 1u R226 1000 C240 1u C249 C241 FB503 VA210 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 HOOK_SENSE U203 NCS2200SQ2T2G 2 100K R716 0 NA R717 AP_VDD_IO_2.7V VREG_MSMP_2.7V VBAT_TEMP C260 0.1u CAD for EMC Noise Between (VBATT & +5V_PWR) and (Mic signal) Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 65 - LGE Internal Use Only 3. TECHNICAL BRIEF Audio Codec(WM8753) BLK A1 WM_HPH_L WM_RXP WM_RXN C225 1u C226 1u B1 C2 F9 R209 RECEIVER-- HPVDD C9 A8 H6 J7 LINE2 SPKRVDD 1u HP_SPKRGND C224 LINE1 A7 NC1 C8 NC2 F8 NC3 G2 NC4 A2 WM_HPH_R DBVDD 1u WM_AVDD DCVDD C222 DGND H7 WM_DVDD OUT4 OUT3 NA C223 NA E9 AP_VDD_CAM_1.8V R211 E8 RECEIVER+ 0 RXP LOUT1 C227 10p D8 RXN R212 D9 39p C230 C233 1u NA B6 39p B7 C229 C231 MONO1 ROUT1 0 WM_MONO2 WM_MONO1 WM_ROUT1 LOUT2 WM_LOUT1 A9 WM_LOUT2 B9 WM_ROUT2 GPIO4 ROUT2 E1 F1 MODE_GPIO3 H1 SCLK G1 SDIN F2 CSB_GPIO5 J4 BCLK H4 LRC H5 DACDAT J5 ADCDAT G8 GP1_CLK1 J9 GP2_CLK2 J8 PCMCLK AVDD C235 4.7u J6 MCLK G9 PVDD H9 PGND A5 VREF MICBIAS C234 4.7u J3 VXFS J1 VXDIN J2 VXDOUT H3 VXCLK MIC2 B5 B4 WM_MICBIAS WM8753LEB-RV MIC2N AGND D1 WM_MIC2P MONO2 1u MIC1 VMID E2 A6 C1 WM_MIC1P WM_MIC2N ACOP U202 MIC1N A4 1u C228 B3 D2 WM_MIC1N ACIN C232 RECEIVERA3 C236 4.7u 100K R213 100K R214 VT_SW PM_SCL PM_SDA WM_DVDD MSPTCK0 MSPTFS0 MSPTXD0 WM_MSPRXD0 WM_AVDD WM_LRC WM_DACDAT WM_ADCDAT WM_BCLK AU_19.2M SPK_AMP_EN AU_SW 100K R215 Audio Amp for loud Speaker C261 NA WM_ROUT2 C262 R229 0.068u 10K R230 68K AP_+VPWR U208 1 2 100K R231 SPK_AMP_EN 3 C266 0.22u C267 WM_LOUT2 0.068u R233 10K 4 TPA6205A1DRBR 6 VDD _SHUTDOWN BYPASS VO- IN+ VO+ IN- GND PGND R232 68K C268 NA 8 5 SPKL- C263 2.2u SPKL+ 7 9 SPEAKER AMP LGE Internal Use Only - 66 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.14. Camera interface KS10 has two cameras : 2M Pixel CMOS and VGA Pixel CMOS Camera Below figures shows the camera board to board connector and camera I/F signal. CCIRID(3)_CAM CCIRID(2)_CAM CCIRID(1)_CAM CCIRID(0)_CAM 4 3 2 1 10 G2 G1 5 3.14.1. Mega Camera Interface INOUT_A4 INOUT_B4 INOUT_A3 INOUT_B3 INOUT_A2 INOUT_B2 INOUT_A1 INOUT_B1 4 3 2 1 INOUT_A3 INOUT_B3 INOUT_A2 INOUT_B2 INOUT_A1 INOUT_B1 FL201 2 1 CAMCLK_27MHZ 9 10 CAMCLK_27MHZ INOUT_A4 INOUT_B4 INOUT_A3 INOUT_B3 INOUT_A2 INOUT_B2 INOUT_A1 INOUT_B1 FL202 8 G2 5 3 7 0 G1 4 CCIRIHS CCIRIVS CCIRICLK 6 EVRC18S03Q015050R R206 CCIRID(7)_CAM CCIRID(6)_CAM CCIRID(5)_CAM CCIRID(4)_CAM 9 10 INOUT_A4 INOUT_B4 MCAM_27M 8 G2 G1 CCIRIHS_CAM CCIRIVS_CAM CCIRICLK_CAM CAMCLK_27MHZ_CAM 7 EVRC18S03Q015050R 5 FL200 CCIRID(3) CCIRID(2) CCIRID(1) CCIRID(0) 6 CCIRID(7) CCIRID(6) CCIRID(5) CCIRID(4) 6 7 8 9 EVRC18S03Q015050R Figure. Schematic of 2 Mega Camera EMI/ESD filter I/F AP_VDD_IO_2.7V AP_VDD_CAM_2.7V AP_VDD_CAM_2.7V AP_VDD_CAM_1.8V I2CSDA0_SW U200 SLAS4717EPMTR2G 7 IN1 NC2 NC1 GND 5 C207 1u 6 I2CSDA0_CAM I2CSCL0_CAM C215 C216 C217 C218 10u 0.1u 0.1u 10u 2M_PWDN LOW Driven HIGH Hi-Z 1 2 3 4 5 6 7 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 G2 8 9 10 11 12 13 14 15 16 17 G3 CCIRID(7)_CAM CCIRID(6)_CAM CCIRID(5)_CAM CCIRID(4)_CAM CCIRID(3)_CAM CCIRID(2)_CAM CCIRID(1)_CAM CCIRID(0)_CAM CSC3R270000BEVRS00 X200 3 4 OUT VDD 2 1 GND CCIRIVS_CAM CCIRIHS_CAM TRI_OPEN 27MHz G4 C214 0.01u AXK7L34227 FL203 2 3 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 5 9 8 7 6 2M_RSTn I2CSDA0_SW I2CSCL0_SW 10 G1 4 EVRC18S03Q015050R INOUT_A1 INOUT_B1 G2 1 2M_RSTn_CAM I2CSDA0_CAM I2CSCL0_CAM R207 100K C213 4 CCIRICLK_CAM 2M_RSTn_CAM C212 8 0.1u CAM_PWR_EN CN200 G1 9 IN2 10u COM2 COM1 C211 NO1 2 3 C210 NO2 0.1u I2CSCL0 10 VCC 10u FB207 HB-1M1005-601JT FB206 HB-1M1005-601JT 1 FB204 HB-1M1005-601JT 2M_CAMERA I2CSDA0 FB205 HB-1M1005-601JT I2CSCL0_SW Figure. Schematic of 2 Mega Camera Board to Board Connector Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 67 - LGE Internal Use Only 3. TECHNICAL BRIEF No Name Port Note 1 GND GND GND 2 PCLK O 3 GND GND Ground 4 GND GND Ground 5 RESET 6 GND 7 NC NC Non-connection 8 SDA I/O Data for two-wire serial interface 9 SCK I Clock for two-wire serial interface 10 NC NC Non-connection 11 NC NC Non-connection 12 GND 13 PDOWN I Power down mode, active High 14 LVDD 2.8V P Actuator Voltage 15 LVDD 2.8V P Actuator Voltage 16 AVDD 2.8V P Analog Voltage 17 AVDD 2.8V P Analog Voltage 18 HSYNC O Horizontal Synchronous signal 19 VSYNC O Vertical Synchronous signal 20 GND 21 CLKIN 22 GND GND 23 YUV0 O Image data output 24 YUV1 O Image data output 25 YUV2 O Image data output 26 YUV3 O Image data output 27 YUV4 O Image data output 28 YUV5 O Image data output 29 YUV6 O Image data output 30 YUV7 O Image data output 31 IOVDD P Digital I/O Voltage 32 IOVDD P Digital I/O Voltage 33 DVDD 1.8V P Digital Core Voltage 34 DVDD 1.8V P Digital Core Voltage I GND GND GND I Pixel Clock Initializes sensor, Active Low Ground Ground Ground Master clock Ground Table. Interface between 2M Camera Module and Main Board (in camera module) LGE Internal Use Only - 68 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF The 2MCamera module is connected to main board with 34pin Board to Board connector (AXK8L34125). Its interface is dedicated camera interface port in STN8810. The camera port supply 24MHz master clock to camera module and receive 40.078MHz pixel clock (max.15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from STN8810. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 69 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.14.2. VGA Camera Interface MAIIN-SLIDER CON-HEADER 2 3 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 5 9 FB223 FB224 7 6 LCD_NRESET VGA_STANDBY FB230 FB233 KPD_DRV_N KEY_ROW(0) KEY_ROW(1) KEY_ROW(2) KEY_ROW(3) KEY_COL(4) KEY_COL(5) KEY_COL(6) KEY_COL(7) G3 7 FB222 8 9 5 G1 G2 AP_+VPWR INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1 LCD_DATA(6) LCD_DATA(4) LCD_DATA(2) LCD_DATA(0) 4 3 2 1 FB225 6 FB227 7 FB229 8 FB231 9 FB232 5 G1 10 EVRC14S03Q030100R FL204 G2 WLED_CTL 8 10 G1 4 EVRC18S03Q015050R INOUT_A1 INOUT_B1 G2 1 6 CAMCLK_27MHZ_CAM INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1 LCD_DATA(8) LCD_DATA(10) LCD_DATA(12) LCD_DATA(14) 4 3 2 1 EVRC14S03Q030100R FL205 FB234 FB235 FB236 FB237 FB238 6 FB239 7 FB240 8 FB241 9 FB244 G4 INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1 LCD_DATA(15) LCD_DATA(13) LCD_DATA(11) LCD_DATA(9) 4 3 2 1 EVRC14S03Q030100R FL207 FB242 FB243 6 7 AXK7L70227 5 FL206 LCD_VS DIS_CSN DIS_RS DIS_WEN AP_VDD_LCD_2.8V 10 MOT_PWR- CCIRIVS CCIRID(7) CCIRID(6) CCIRID(5) CCIRID(4) CCIRID(3) CCIRID(2) CCIRID(1) CCIRID(0) G1 RECEIVER+ RECEIVERRECEIVER-- 0 0 0 0 0 0 0 0 0 G2 0 R720 R721 R722 R723 R724 R725 R726 R727 R728 8 9 5 CCIRICLK 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 10 R719 VGA_RSTn I2CSDA0_CAM I2CSCL0_CAM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 G1 AP_VDD_CAM_1.8V 0 FB221 G2 AP_VDD_CAM_2.7V R718 10 CN201 G1 G2 CCIRIHS INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1 LCD_DATA(7) LCD_DATA(5) LCD_DATA(3) LCD_DATA(1) 4 3 2 1 EVRC14S03Q030100R FL208 Figure. Schematic of Main slider FPCB B to B connector (in main BD) VGA_CAMERA CN100 VGA_STANDBY CAMCLK_27MHZ_CAM CCIRICLK_CAM CCIRID(0)_CAM CCIRID(1)_CAM CCIRID(2)_CAM CCIRID(3)_CAM CCIRID(4)_CAM CCIRID(5)_CAM 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 AP_VDD_CAM_1.8V FB101 HB-1M1005-601JT FB100 HB-1M1005-601JT AP_VDD_CAM_2.7V VGA_RSTn I2CSCL0_CAM I2CSDA0_CAM CCIRIHS_CAM CCIRIVS_CAM CCIRID(7)_CAM CCIRID(6)_CAM C102 1u C100 0.1u C101 0.1u AXK720145G Figure. Schematic of VGA Camera Board to Board Connector (in main slider FPCB) LGE Internal Use Only - 70 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF The VGA Camera module is connected to main slider FPCB with 20pin Board to Board connector(AXK820145). The main slider FPCB is connected to main board with 70pin board to board connector. Its interface is dedicated camera interface port in STN8810. The camera port supply 24MHz master clock to camera module and receive 13.5MHz pixel clock (max. 15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from STN8810. No Name 1 ENABLE 2 3 Port Note I Active ëHighí MCLK I Master Clock GND GND 4 PCLK O Video Output Clock D[0:7] 5 D0 O Image Data[0] 6 D1 O Image Data[1] 7 D2 O Image Data[2] 8 D3 O Image Data[3] Ground 9 D4 O Image Data[4] 10 D5 O Image Data[5] 11 D6 O Image Data[6] 12 D7 O Image Data[7] 13 VSYNC O Vertical Synchronization 14 HSYNC O Horizontal Synchronization 15 GND GND 16 SDA I/O Data for two wire serial interface 17 SCL I Clock for two wire serial interface 18 RESET I Reset initializes sensor Active Low 19 DVDD P Digital core circuit power supply voltage 20 AVDD & IOVDD P Analog core circuit power supply voltage & Digital I/O circuit power supply voltage Ground Table. Interface between Camera Module and Main Board (in camera module) Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 71 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.14.3. LCD backlight / Camera LDO U100(in SUB board, AAT3151) is a charge pump. U301(in main board, BH18LB1WHFB) supply a 1.8V power of mega camera and VGA camera. U303(in main board, MIC5219-2.7YM5) supply a 2.7V power of mega camera and VGA camera. These parts are controlled by GPIOs of STN8810. AP_+VPWR U100 8 5 LED_ANODE 2 C102 1u 100K ZD101 R101 C103 4.7u RSB6.8CST2R WLED_CTL 9 13 VIN AAT3151IWP_T1 3 C1+ VOUT C1C2+ EN_SET GND PGND C2D1 D2 D3 D4 C100 1u 4 6 C101 1u 7 10 11 12 1 LED1 LED2 LED3 LED4 LCD_Backlight driver Figure. Schematic of charge pump AP_VDD_CAM_2.7V AP_+VPWR AP_VDD_CAM_1.8V AP_+VPWR U301 1 2 3 CAM_PWR_EN U303 BH18LB1WHFV 5 6 4 MIC5219-2.7YM5 1 5 IN OUT 2 GND 3 4 EN BYP STBY NC GND BGND VIN VOUT CAM_PWR_EN C308 1u C305 1u C309 2.2u C306 470p C307 2.2u Figure. Schematic of camera LDO LGE Internal Use Only - 72 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.14.4. LCD module MM_LCD_ADS_N MM_LCD_ADS_N MM_LCD_CS_N MM_LCD_CS_N MM_LCD_WE_N MM_LCD_WE_N STN8810 LCD MM_LCD_RD_N MM_LCD_RD_N NC MM_LCD_VSYNC MM_LCD_VSYNC MM_LCD_RESET MM_LCD_RESET MM_LCD_IF_MODE_0 MM_LCD_DATA[0:15] MM_LCD_IF_MODE_1 MM_LCD_DATA[0:15] Figure. LCD I/F Block Diagram MAIN LCD MODULE 260K Color TFT 240 * 320 Pixel BD663474(Hitachi) Graphic Controller Driver Main LCD Panel Figure. LCD Module Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 73 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.14.5. Display LCD module is connected to SUB board with 35-pin zip connector(XF2B-3545-31A). The LCD is controlled by 16-bit in STN8810. MAIIN-SLIDER CON-HEADER 2 3 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 5 10 G1 4 9 FB223 FB224 7 6 FB230 LCD_NRESET FB233 VGA_STANDBY KPD_DRV_N KEY_ROW(0) KEY_ROW(1) KEY_ROW(2) KEY_ROW(3) KEY_COL(4) KEY_COL(5) KEY_COL(6) KEY_COL(7) G3 7 8 9 5 G1 G2 FB222 INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1 4 3 2 1 LCD_DATA(6) LCD_DATA(4) LCD_DATA(2) LCD_DATA(0) FB225 6 FB227 7 FB229 8 FB231 9 FB232 5 10 EVRC14S03Q030100R FL204 G1 WLED_CTL 8 AP_+VPWR G2 EVRC18S03Q015050R INOUT_A1 INOUT_B1 G2 1 6 CAMCLK_27MHZ_CAM INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1 4 3 2 1 LCD_DATA(8) LCD_DATA(10) LCD_DATA(12) LCD_DATA(14) EVRC14S03Q030100R FL205 FB234 FB235 FB236 FB237 FB238 6 FB239 7 FB240 8 FB241 9 5 FL206 LCD_VS DIS_CSN DIS_RS DIS_WEN AP_VDD_LCD_2.8V 10 MOT_PWR- CCIRIVS CCIRID(7) CCIRID(6) CCIRID(5) CCIRID(4) CCIRID(3) CCIRID(2) CCIRID(1) CCIRID(0) G1 RECEIVER+ RECEIVERRECEIVER-- 0 0 0 0 0 0 0 0 0 G2 0 R720 R721 R722 R723 R724 R725 R726 R727 R728 INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1 4 3 2 1 LCD_DATA(15) LCD_DATA(13) LCD_DATA(11) LCD_DATA(9) EVRC14S03Q030100R FL207 FB242 FB243 FB244 G4 6 7 AXK7L70227 8 9 5 CCIRICLK 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 10 R719 VGA_RSTn I2CSDA0_CAM I2CSCL0_CAM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 G1 AP_VDD_CAM_1.8V 0 FB221 G2 AP_VDD_CAM_2.7V R718 10 CN201 G1 G2 CCIRIHS INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1 LCD_DATA(7) LCD_DATA(5) LCD_DATA(3) LCD_DATA(1) 4 3 2 1 EVRC14S03Q030100R FL208 Figure. Schematic of Main slider FPCB B to B connector (in main BD) AP_VDD_LCD_2.8V LCD Connector (lower contact) TP100 TP101 TP102 C105 820p C104 XF2B-3545-31A-P LCD_DATA(0:15) LCD_DATA(0) LCD_DATA(1) LCD_DATA(2) LCD_DATA(3) LCD_DATA(4) LCD_DATA(5) LCD_DATA(6) LCD_DATA(7) LCD_DATA(8) LCD_DATA(9) LCD_DATA(10) LCD_DATA(11) LCD_DATA(12) LCD_DATA(13) LCD_DATA(14) LCD_DATA(15) LCD_NRESET 1u R103 100K R104 100K 0 RSB6.8CST2R 100K R115 LED1 LED2 LED3 LED4 LED_ANODE LCD_VS DIS_CSN DIS_RS DIS_WEN ZD100 R102 CN100 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Figure. Schematic of LCD connector (in SUB board) LGE Internal Use Only - 74 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF No Name Port Note 1 GND GND Ground 2 LED(CA) - Ground for LED 3 LED(CA) - Ground for LED 4 LED(CA) - Ground for LED 5 LED(CA) - Ground for LED 6 LED(AN) - Power Supply for LED 7 VSYNC-OUT O Frame Head Pulse Signal 8 CS I Chip Select 9 RS I Register Select 10 WR I Write Strobe 11 RD I Read Strobe 12 GND GND 13 DB0 I/O Ground Data Bus (Instruction & Display Data) 14 DB1 I/O Data Bus (Instruction & Display Data) 15 DB2 I/O Data Bus (Instruction & Display Data) 16 DB3 I/O Data Bus (Instruction & Display Data) 17 DB4 I/O Data Bus (Instruction & Display Data) 18 DB5 I/O Data Bus (Instruction & Display Data) 19 DB6 I/O Data Bus (Instruction & Display Data) 20 DB7 I/O Data Bus (Instruction & Display Data) 21 DB8 I/O Data Bus (Instruction & Display Data) 22 DB9 I/O Data Bus (Instruction & Display Data) 23 DB10 I/O Data Bus (Instruction & Display Data) 24 DB11 I/O Data Bus (Instruction & Display Data) 25 DB12 I/O Data Bus (Instruction & Display Data) 26 DB13 I/O Data Bus (Instruction & Display Data) 27 DB14 I/O Data Bus (Instruction & Display Data) 28 DB15 I/O Data Bus (Instruction & Display Data) 29 RESET I Reset 30 IM2 I Interface mode select 31 IM1 I Interface mode select 32 MID(HIGH) O Maker ID (HI : VCC2 level) 33 VCC1 P Power Supply for Analog Circuit 34 VCC2 P Interface I/O Power 35 GND GND Ground Table. Interface between 2M Camera Module and Main Board (in camera module Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 75 - LGE Internal Use Only 3. TECHNICAL BRIEF 3.15 Bluetooth KS10 supported bluetooth, which is possible to data file transfer, BT headset call. CPU (STn8810) interfaces with bluetooth one chip module (U401) which includes RF and baseband. The STLC2500C is a single chip ROM-based Bluetooth solution for applications requiring integration up to HCI level. The STLC2500C's main interfaces are UART for HCI transport between CPU (STn8810) and bluetooth module, PCM for voice between audio codec.(WM8753) and bluetooth module and GPIOs for control purposes. Voice data is transferred to CPU(STn8810) through audio codec.(WM8753). The radio has been designed specifically for single chip requirements and for low power consumption. Radio signal from bluetooth antenna (ANT400) is transferred to bluetooth module through BALUN filter (FL400). Bluetooth module has its’ own oscillator (X400, 27MHz) for normal operation and use sleep clock(32.768KHz) from PM6650, PMIC of MSM 6275. ■ Bluetooth™ specification compliance: V1.2 ■ Transmit Power : Power Class2 ■ Ultra low power architecture with 3 different low power levels: - Sleep Mode - Deep Sleep Mode - Complete Power Down Mode Figure. Diagram of STLC2500C LGE Internal Use Only - 76 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 3.16 Main Features 3.16.1. Main features of KS10 - Slide Type - WCDMA(2100) + GSM(900,1800) + PCS(1900) Triple mode - Main LCD: 320*240, 262K (2.4”) - 2.0M Pixel CMOS Camera - VGA CMOS Camera - φ17 speaker - Stereo Headset - Video telephony in WCDMA with camera - HSDPA up to 1.8Mbps - Loud Speaker phone(in GSM and WCDMA) - 64 Poly Sound - MP3/AAC/WMA decoder and play - MPEG4 encoder/decoder and play/save - H.263 decoder - JPEG en/decoder - Support Bluetooth, USB - 104 x 52 x 18.9 mm - 950mAh hard pack Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 77 - LGE Internal Use Only 3. TECHNICAL BRIEF 2. Main Components of KS10 MAIN Top Side MAIN Bottom Side KEY Top Side KEY Bottom Side VGA camera 1.3M camera Speaker Intenna LGE Internal Use Only LCD FPCB - 78 - LCD Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 2. 1 Main Top Side X200 U207 FL203 U406 FL206 CN201 U403 U508 U404 Side Key U402 U700 U701 X500 U306 X700 Side Key Reference Description Reference Description U207 over voltage protection IC X200 27MHz OSCILLATOR U406 Analog Switch FL203 EMI_ESD FILTER U403 Analog Switch Multiplexer FL206 EMI_ESD FILTER U404 Key Coder IC CN201 B To B CONNECTOR U402 hall-effect switch IC U508 RF Receiver(RFR6250E) U701 MCP Memory U700 PMIC for MSM U306 LDO Regulator X500 TCXO 19.2MHz - - X700 TCXO 32.768kHz Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 79 - LGE Internal Use Only 3. TECHNICAL BRIEF 2.2. Main Bottom Side CN200 CN202 SW500 U501 CN203 FL500 U506 BAT700 U505 U208 U502 U202 U500 CN402 FL400 J300 U401 X400 U400 U600 X100 U100 U310 S300 L301 MIC200 Reference Description Reference Description CN200 B To B CONNECTOR CN202 Connector(I/O, Ear jack, Power) SW500 RF SWITCH CONNECTOR U501 GSM/EDGE Quadband PAM CN402 JTAG-JIG-FPCB-CON CN203 Battery Connector FL500 FILTER, SAPERATOR BAT700 Back up Battery U506 DUPLEXER, GSM U208 AUDIO AMPLIFIER U505 PAM _power amplifier module U502 Voltage Controlled Oscillator U500 RF Transceiver (RTR6250D) U202 Audio Codec. FL400 SAW FILTER _BPF U600 MSM6275 (Modem BB Chip) J300 USIM Connector X100 19.2MHz Oscillator U401 Bluetooth Single Chip U100 STN8810S12B2V1 (CPU) X400 19.2MHz Oscillator U310 PMIC for CPU U400 LDO Regulator L301 Power Inductor S300 Micro-SD CONNECTOR MIC200 Microphone LGE Internal Use Only - 80 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 3. TECHNICAL BRIEF 2.3. KEY Top Side SW100 2.4. KEY Bottom Side U100 CN100 CN101 Reference Description Reference Description SW100 Dome Switch U100 LCD Backlight Driver CN100 LCD Connector CN101 FUNCTION-SLIDER Connector (FPCB to KEYPCB) Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 81 - LGE Internal Use Only 3. TECHNICAL BRIEF 2.5. LCD FPCB CN100 Receiver Vibrator PAD CN101 CN102 Reference Description Reference Description Vibrator Vibrator PAD CN101 FUNCTION-SLIDER Receiver Receiver PAD CN100 VGA_CAMERA Connector LGE Internal Use Only Connector (FPCB to KEYPCB) CN102 - 82 - MAIN-SLIDER CON-SOCKET Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 RF Component SW500 FL500 U504 U501 U506 U507 U505 U502 U503 U500 RF component (Bottom) Reference Description Reference Description U505 WCDMA PAM U507 Coupler U506 WCDMA Duplexer U501 GSM/D/PCS PAM U503 WCDMA TX SAW U504 HDET FL500 Front-End-Module U500 GSM/WCDMA Transceiver (RTR) U502 GSM TX VCO SW500 RF Antenna Connector Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 83 - LGE Internal Use Only 4. TROUBLE SHOOTING U508 FL501 RF component (Top) LGE Internal Use Only Reference Description U508 RFR6250(WCDMA RX) FL501 WCDMA RX SAW - 84 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.2 SIGNAL PATH A GSM/DCS/PCS Rx Tx PATH A. GSM/DCS/PCS Tx PATH B. GSM/DCS/PCS Rx PATH Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 85 - LGE Internal Use Only 4. TROUBLE SHOOTING WCDMA RX/ TX PATH C. WCDMA Tx PATH D. WCDMA Rx PATH LGE Internal Use Only - 86 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.3 Checking VCXO Block The reference frequency (19.2MHz) from X100 (VCXO) is used WCDMA TX part, GSM part and BB part. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 87 - LGE Internal Use Only 4. TROUBLE SHOOTING Check 1. Crystal part If you already check this crystal part, you can skip check 1. Test Point (Crystal Part) TP3 TCXO C559 19.2MHz 100p TCXO_PM C562 1000p C563 1000p 3 RTR6250_TCXO 4 OUT GND VCCVCONT R525 100ohm 2 TRK_LO_ADJ 1 X500 RFR6250_TCXO C564 0.01u TP2 VREG_TCXO_2.85V C566 0.1uF C567 1000p TP1 Schematic of the Crystal Part LGE Internal Use Only - 88 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING TP1 AP_VDD_IO_1.8V AP_VDD_IO_1.8V TP1 0.1u C151 X100 REQUEST_MC 4 1 VDD PWREN CSC3M192000EEVRS00 3 OUT 2 TRI_OPEN 1 VCC 5 U101 4 2 GND 19.2MHz C152 NA 3 GND CPU_19.2M NL17SZ08XV5T2 C153 0.1u AP_VDD_IO_1.8V 0.1u C154 AU_CLK_EN 1 VCC 5 U103 4 2 AU_19.2M NL17SZ08XV5T2 3 GND Schematic of the Crystal Part (19.2MHz) Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 89 - LGE Internal Use Only 4. TROUBLE SHOOTING Check TP1 VCC of VCXO VCC ≥ 2.8V No Check PMIC Yes Check TP2 TRK_LO_ADJ 3V ≥ Voltage ≥ 0V No Check MSM Yes Check TP3 With Oscilloscope 19.2MHz Signal No Check soldering and components Yes VCXO is OK Check other part LGE Internal Use Only - 90 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.4 Checking Ant. Switch Module Block SW500 KMS-512 G2RF ANT G1 L504 56nH ANT501 17 15 14 ANT_SEL0 ANT_SEL1 ANT_SEL2 C509 47p C511 47p C510 47p L514 12 GND1 FL500 EGSM_RX1 GND2 EGSM_RX2 GND3 DCS_RX1 GND4 DCS_RX2 GND5 PCS_RX1 GND6 PCS_RX2 VC1 DCS_PCS_TX VC2 EGSM_TX VC3 UMTS_TX_RX 1 2 3 4 5 6 8 10 19 C507 1.5nH WCDMA_2100 56p C506 7 9 11 13 18 20 ANT ESHS-L090UB C502 NA 16 L502 1p C501 56p VDD C500 0 ANT500 C512 NA C513 NA 7.5nH VREG_RFR_2.85V C519 47p C520 0.1u Schematic of the Antenna Switch Block Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 91 - LGE Internal Use Only 4. TROUBLE SHOOTING Logic Table of the Antenna Switch Mode ANT_SEL0 ANT_SEL1 ANT_SEL2 EGSM TX High Low Low EGSM RX DCS/PCS TX Low Low Low High Low High DCS RX Low Low High PCS RX Low High Low UMTS Low Low Low Checking Switch Block power source Check Soldering of ANT_SEL0, 1, 2 High Level 2.5V < Voltgae < 3.0V NO Check VCC TP1 VREG_RFRX_0_2.85V YES Check the Logic in each mode LGE Internal Use Only - 92 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.5 Checking WCDMA Block 2 START 3.4 1. Check VCXO 19.2MHz 2. Check ANT. SW Module ANT_SEL0, 1, 2 3. Check RF Tx Level 5 4. Check PAM Block 5. Check RF Rx Level 1 6. Re-download SW & CAL. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 93 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.5.1 Checking VCXO Block Refer to 3.3 4.5.2 Checking Ant. SW module Refer to 3.4 4.5.3 Checking RF TX Level TP1 TP2 TP3 TP4 Test Point (RF TX Level) LGE Internal Use Only - 94 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING TP1 SW500 KMS-512 G2RF ANT G1 12 ESHS-L090UB C502 NA 7 9 11 13 18 20 L504 56nH ANT501 17 15 14 ANT_SEL0 ANT_SEL1 ANT_SEL2 GND2 EGSM_RX2 GND3 DCS_RX1 GND4 DCS_RX2 GND5 PCS_RX1 GND6 PCS_RX2 VC1 DCS_PCS_TX VC2 EGSM_TX VC3 UMTS_TX_RX C511 47p C510 47p L514 FL500 EGSM_RX1 1 2 3 4 5 6 TP2 8 10 19 C507 1.5nH WCDMA_2100 16 C509 47p GND1 56p C506 L502 1p C501 56p ANT ANT500 VDD C500 0 C513 NA C512 NA 7.5nH VREG_RFR_2.85V C519 47p C520 0.1u TP4 WCDMA C560 C561 22p U503 EFCH1950TDC1 3 1 4 G3 OUTIN G2G1 5 2 L525 8.2nH 1.8nH WCDMA_2100_TX_OUT L526 3.9nH R529 6.2K W_VMODE_N C569 15p +VPWR C568 22u C570 0.01u C571 0.01u WCDMA_2100 C573 0.1u TP3 U506 R530 3.9nH C575 1.8nH 6 7 8 9 10 11 TX 1 1.2p L527 GND2 GND3 RFOUT GND4 VCC2 GND5 VREF 5 VMODE 4 GND1 3 RFIN 2 VCC1 1 AWT6277R U505 4 3 COUP 50OHM OUT IN 2 G7 G6 G5 G4 G3 G2 G1 RX ANT ACMD-7601 C574 100p C580 51 R531 47 C581 12p Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 95 - LGE Internal Use Only 4. TROUBLE SHOOTING For testing, Max power output is needed. Set the Phone Tx is ON and PDM is 450 Check TP1 Over 21dBm ? YES RF Tx Level is OK NO Check TP2 Over 19dBm ? YES Check FEM NO Check TP3 Over 15dBm ? YES Check Duplexer NO Check TP4 Over -5dBm ? YES Check PAM Block Refer to 3.5.4 NO Change the board LGE Internal Use Only - 96 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.5.4 Checking PAM Block PAM control signal PA_ON : WCDMA Tx Power Detect IC(HDET) Enable PA_RO: WCDMA Tx Power Amp Gain Control PAM_OUT PAM_IN PA_ON must be HIGH(over 2.5V) PA_FET_N must be LOW if the max Tx power is set (lower than 0.5V) Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 97 - LGE Internal Use Only 4. TROUBLE SHOOTING PAM IN/OUT Signal PAM_OUT PAM_IN PAM OUT must be over 15dBm PAM IN must be over -5dBm LGE Internal Use Only - 98 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING WCDMA TP1 C560 C561 22p U503 EFCH1950TDC1 3 4 G3 1 OUTIN G2G1 5 2 L525 8.2nH 1.8nH WCDMA_2100_TX_OUT L526 3.9nH R529 6.2K W_VMODE_N C569 15p +VPWR C568 22u C570 0.01u C571 0.01u WCDMA_2100 C573 0.1u U506 R530 3.9nH C575 1.8nH 6 7 8 9 10 11 TX 1 1.2p L527 VREF VMODE GND1 RFIN VCC1 5 4 3 2 1 U505 TP2 4 50OHM IN COUP 3 51 R531 47 C581 12p GND2 GND3 RFOUT GND4 VCC2 GND5 AWT6277R OUT 2 G7 G6 G5 G4 G3 G2 G1 RX ANT ACMD-7601 C574 100p TP3 C580 ILNA_OUT Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 99 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.5.5 Check RF Rx Level BOTTOM TOP TP1 TP2 TP4 TP 3 BIAS Test Point (RF Rx Level) LGE Internal Use Only - 100 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 12 C501 56p ANT501 17 15 14 ANT_SEL0 ANT_SEL1 ANT_SEL2 GND2 EGSM_RX2 GND3 DCS_RX1 GND4 DCS_RX2 GND5 PCS_RX1 GND6 PCS_RX2 VC1 DCS_PCS_TX VC2 EGSM_TX VC3 UMTS_TX_RX C511 47p C510 47p L514 FL500 EGSM_RX1 1 2 3 4 5 6 8 10 19 C507 1.5nH WCDMA_2100 16 C509 47p GND1 56p C506 7 9 11 13 18 20 L504 56nH ANT ESHS-L090UB C502 NA VDD ANT500 L502 1p TP1 SW500 KMS-512 G2RF ANT G1 C500 0 C513 NA C512 NA 7.5nH VREG_RFR_2.85V C519 47p C520 0.1u TP2 C570 0.01u C568 22u C571 0.01u HDET1 VOPS VRMS ADL5500 U504 WCDMA_2100 C573 0.1u U506 R530 3.9nH C575 1.8nH 1 1.2p L527 OUT 2 VREF 5 VMODE 4 GND1 3 RFIN 2 VCC1 1 AWT6277R U505 4 3 COUP 50OHM IN GND2 GND3 RFOUT GND4 VCC2 GND5 6 7 8 9 10 11 TX G7 G6 G5 G4 G3 G2 G1 RX ANT ACMD-7601 C572 1500p C574 100p C580 C585 100p C591 C588 4.7u 100p 49 PGND 48 47 GLNA_IN 46 R_BIAS 45 VDDA8 44 SBST 43 SBDT 42 SBCK 41 VDDM 40 GRX_IP 39 GRX_IM 38 GRX_QP 37 GLNA_BIAS RFR6250E U508 C587 680p (1%) R532 11.3K GRX_QM C592 100p C593 4.7u 25 26 27 28 29 30 31 32 33 34 35 36 C586 1.2p PLNA_OUT ILNA_OUT PLNA_BIAS PLNA_IN ILNA_BIAS ILNA_IN VDDRF3 RX_IP RX_IM RX_QP RX_QM VDDA2 UMTS_TUNE VDDA3 VDDA4 LO_OUT CP_DUMP CP_OUT FAQ VDDA5 TCXO VDDA6 GPS_TUNE VDDA7 L533 2.7nH L532 100nH 13 14 15 16 17 18 19 20 21 22 23 24 GLNA_OUT ILNA_OUT VDDRF2 PMIXP PMIXM IMIXP IMIXM VDDA1 GMIXP GMIXM GND VDDRF1 BLANK 12 11 10 9 8 7 6 5 4 3 2 1 51 R531 47 C581 12p VREG_RFR_2.85V C594 0.1u C595 10p 10 BIAS C596 4.7p R535 TP3 RX0_Q_M CP2_OUT C598 0.1u RX0_Q_P RX0_I_M C599 100p C597 100p C800 100p RX0_I_P C577 33p TP4 IMT_RX_P 1 8.2p C578 ILNA_OUT 3 G1 O1 IN G2 O2 5 L529 33nH C579 0.1u FL501 B7827 2 L528 2.7nH 4 C584 33p L530 2.2nH L531 2.7nH IMT_RX_M Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 101 - LGE Internal Use Only 4. TROUBLE SHOOTING Set the Phone Rx is ON Check BIAS Over 2V ? NO Check bias block soldering YES Check TP1 Signal exist? NO Check RF s/w YES Check TP2 Signal exist? NO Check FEM YES Check TP3 Signal exist? NO Check Duplexer YES Check TP4 Signal exist? NO Check RFR6250 YES Change the board LGE Internal Use Only - 102 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.6 Checking GSM Block Start 1. Check TXVCO Block 2. Check ANT.SW Module 3. Check TX PAM Block 3 2 4. Check RF RX Level 1 4. Re download SW & CAL 4 Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 103 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.6.1 Checking VCO Block GSM_PA_RAMP C537 120p R510 100 (1%) C535 330p C539 5.6n ECHU1C562JX5 C541 R513 _ GSM900_I VDDA11 TX_MOD_ VDDA12 TX_VCO_F 82p VDD_M 37 38 39 40 41 42 0 (1%) 43 R507 100 (1%) R508 VBATT 0 TP3 C543 22u TX_ON R514 100ohm VREG_MSMP_2.7V TP2 MQW5V0C869M 10 VC R516 15 R518 R522 270 U502 VB 15 R520 R521 220 220 8 GND5 12 GND6 13 GND7 14 GND8 C546 1000p C547 100p FB502 3 VREG_RFTX_2.85V 1 9 OUT_GSM SW1 5 11 OUT_DCSPCS SW2 R523 270 C545 0.01u TP5 TP1 2 GND1 4 GND2 6 GND3 7 GND4 C554 33p C553 4.7u tcc_1608h_9_r C556 C557 15p R517 100ohm R519 100ohm GSM_TX_VCO_0_EN_N GSM_TX_VCO_1_EN_N TX VCO CONTROL LOGIC TP4 TP5 HIGH LOW DCS1800/PCS1900 LOW HIGH NO OSCILLATION HIGH HIGH 15p R524 51 GSM850/900 C555 0.1uF TP4 LGE Internal Use Only - 104 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 105 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.6.2 Checking Ant. SW Module Refer to chapter 3.4 4.6.3 Checking RF Tx level SW500 KMS-512 G2RF ANT G1 ANT501 TP1 17 15 14 ANT_SEL0 ANT_SEL1 ANT_SEL2 C510 47p GND1 EGSM_RX2 GND3 DCS_RX1 GND4 DCS_RX2 GND5 PCS_RX1 GND6 PCS_RX2 VC1 DCS_PCS_TX VC2 EGSM_TX VC3 UMTS_TX_RX 1 2 3 4 5 6 8 10 19 C507 1.5nH WCDMA_2100 16 C511 47p L514 FL500 EGSM_RX1 GND2 56p C506 7 9 11 13 18 20 L504 56nH C509 47p 12 ESHS-L090UB C502 NA ANT L502 1p C501 56p VDD C500 0 ANT500 C512 NA C513 NA 7.5nH VREG_RFR_2.85V C520 0.1u TP2 TP3 C528 NA C529 NA C530 33p ANTENNA SWITCH MODULE LOGIC HIGH HIGH LOW UMTS 2100 LOW LOW LOW DCS RX LOW LOW HIGH GSM 900 RX LOW LOW LOW 10 11 12 GND6 DCS_PCS_IN GND5 BS VCC U501 TQM7M5003 GND4 GND3 GSM_OUT 8 9 17 GND2 LGE Internal Use Only 2.2K (1%) L524 1.5nH - 106 - DCS_PCS_OUT LOW HIGH LOW GND7 LOW LOW GND8 HIGH PCS RX 14 GSM900 TX DCS/PCS TX R506 C536 68p L522 18nH L523 22nH 13 IN_C 0 IN_B R511 IN_A C531 33p 16 C519 47p TX_EN VBATT GND1 VRAMP GSM_IN 1 2 3 GSM_PA_BAND GSM_PA_EN 4 5 6 7 15 Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING STAR Check TP1 If GSM over 31dBm ? If DCS/PCS over 28dBm ? YES GSM/DCS/PCS Tx is Ok Check other part NO Check TP2, TP3 If TP2 over 29dBm ? If TP3 over 25dBm ? YES Check ANT. SW Module Refer to chapter 3.4 NO Check PAM Block OK ? Refer to chapter 3.6.4 YES Check TXVCO Refer to chapter 3.6.1 NO Check Soldering of PAM (U101) If problems stiil exist, replace PAM. NO Problems resolved? YES GSM/DCS/PCS Tx is OK NO Change the Board Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 107 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.6.4 Checking PAM Block PAM Control Signal TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc < 2.6V, TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 2.5V , Power OFF : lower than 0.7V) TP3. +VPWR : PAM Supply Voltage Vcc higher than 3.28V TP1 C530 33p C531 33p GSM_PA_RAMP R506 C536 68p 2.2K (1%) 0 R511 L522 18nH TP3 L524 1.5nH R513 VBATT BS U501 TQM7M5003 GND4 GSM_OUT 17 GND2 GND7 GND3 DCS_PCS_OUT VCC 8 9 DCS_PCS_IN GND5 16 10 11 12 GND6 GND8 13 14 0 TX_EN VBATT GND1 VRAMP GSM_IN 1 2 3 C544 100p C543 22u GSM_PA_BAND GSM_PA_EN 4 R516 5 15 R518 6 TP2 7 R522 270 15 15 R523 270 R520 R521 220 220 R524 51 LGE Internal Use Only - 108 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.6.5 Checking RF Rx Block PCS Band Rx 1930-1990 MHz L500 L501 3.6nH 3.3nH L507 5.1nH L510 3.3nH DCS Band Rx 1805-1880 MHz C514 1000p L511 7.5nH FB500 VREG_RFTX_2.85V C516 33p C515 33p L517 9.1nH GSM Band Rx 925-960 MHz L519 9.1nH 4.7K C521 680p R502 (1%) L516 10nH 33p R501 4.3K (change to 4.53k) 28 27 26 25 24 23 22 L513 5.1nH C508 C525 0.01u C527 1000p C526 6.8n ECHU1C682JX5 CP2_OUT UHF_LO_BUFF R503 11.3K (1%) L520 10nH R507 100 (1%) R508 Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 109 - 0 (1%) 29 30 31 32 33 34 35 36 37 38 39 FAQ2 VDDA8 VDDA7 GSM1900_INP GSM1900_INN VDDA6 GSM850_INP L508 7.5nH C504 1000p L505 3.6nH CP_HOLD2 CP2 VDDA9 RX_VCO_IN R_BIAS GSM1800_INN GSM1800_INP VDDA10 GSM900_INP GSM900_INN VDDA11 RTR6250D U500 LGE Internal Use Only 4. TROUBLE SHOOTING LGE Internal Use Only - 110 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING BB Trouble Shooting 4.7 Power on trouble Power on sequence of KS10 is : PWR key press → KEY_ON_SW_N go to low (D405, PM6650-1M KPDPWR_N pin#24) → PM66501M Power Up → VREG_MSMC_1.375V(C735), VREG_MSME_1.8V(C736), VREG_MSMP_2.7V(C730), VREG_MSMA_2.6V(C726), VREG_TCXO_2.85V(C710) power up → PON_RESET_N assert to MSM and PON assert to STn8810 → VDD_IO_2.7V(C304), VDD_IO_1.8V(C311),AP_VCORE(C314),AP_VPLL(C328),AP_VFUSE(C329) power up -> CPU and Phone booting & PS_HOLD(D700) assert High to PMIC(PM6650-1M) Start Battery voltg. higher than 3.22V? NO Change or charging the Battery NO Follow the LED trouble shoot YES Press PWR key Keypad LED on? YES VA100 high to low when key press? NO Check open Pattern of power button YES NO Change the Main board YES Is clock ok? X100 : 19.2M X600 : 32.768Khz NO Check the TXCO YES Change the Main board Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 111 - LGE Internal Use Only 4. TROUBLE SHOOTING PS_HOLD(D700) VDD_IO_2.7V(C304) X100 VDD_IO_1.8V(C311) AP_VFUSE(C329) AP_VPLL(C328) AP_VCORE(C314) LGE Internal Use Only - 112 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING KEY_ON_SW_N (D405) VREG_TCXO_2.85V(C710) VREG_MSMA_2.6V(C726) VREG_MSMP_2.7V(C730) X500 X700 VREG_MSME_1.8V(C736) VREG_MSMC_1.375V(C735) Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 113 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.8 USB trouble USB Initial sequence of KS10 is : USB connected to KS10 → USB_VBUS_IN(VA205) go to 5V → USB_VBUS_EN go to high (Q702 Pin_2) → USB_VBUS(D701) go to 5V → USB_D+(VA202) go to 3.3V → 48M Crystal on → USB_DATA is triggered → USB work Start NO Cable insert Cable is insert? YES USB_VBUS is about to 5V? NO Check Q702, D701 USB cable YES NO Check VA202 USB_D+ is about to 3.3V? YES NO 48MHz is run? Check X600 YES Change the Main board VA202 (USB_D+) VA205(USB_VBUS_IN) D701(USB_D+) X600(48MHz) LGE Internal Use Only - 114 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.9 SIM detect trouble USB Initial sequence of KS10 is : VREG_USIM_2.85V(C739 of PM6650) go to 2.85V → USIM clock, reset and data triggered → USIM IF work (Schematic and place are refer to SIM technical brief) Start Re-insert the SIM card Work well? Yes End No VREG_USIM_2.85V is 3.0V? USIM_P_CLK is run? NO YES Check J300, C739, VA300,VA301, VA302,VA303 Change SIM card Yes Work well? End No Change the Main board VA300 (USIM_P_DATA) C739 (VREG_USIM_2.85V) J300 VA303 (VREG_USIM_2.85V) VA302(USIM_P_RST_N)VA301 (USIM_P_CLK) Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 115 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.10 Key sense trouble Key Sense sequence of KS10 is : Default condition ROW(0-3) is 2.7V → Press the key → Corresponding ROW(x) and COL(x) go to 0V → Key sensing by key coder IC (U404) → Key coder IC send the key information to CPU by I2C interface START Check the RA400 with no key press NO ROW(0-4) is 2.7V? Check RA400 Yes Check the RA400 with key press ROW(0-4), COL(0-4) is 0V? Yes Side Key Check Metal DOME SHEET Sub & Main board NO Change the side key Work well? NO YES Change FPCB NO Work well? YES Dome sheet NO Change Sub board NO Work well? NO YES Check R414, 415, C418,TP407,TP406 Work well? NO Change the Main board LGE Internal Use Only YES En d - 116 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING AP_VDD_IO_2.7V TP407 C418 RA400 100K 2 4 6 8 TP406 1 3 5 7 RA400 SW400 KEY_ROW(0) SW403 KEY_ROW(1) SW406 KEY_ROW(2) SW409 R414 R415 RA400 U404 KEY_ROW(3) AP_VDD_IO_2.7V R414 KEY_ROW(0:3) R415 R414 R415 KEY_ROW(1) KEY_ROW(0) KEY_ROW(3) KEY_ROW(2) 3.3K 3.3K NC5 NC6 NC7 NC8 NC1 NC2 NC3 NC4 KEY_COL(3:0) K_Out3 K_Out2 K_Out1 K_Out0 _RESET Int_Rx WD_Out Int_Tx U404 LM8333GGR8_NOPB KEY_COL(3) KEY_COL(2) KEY_COL(1) KEY_COL(0) G5 G4 F4 G3 F3 G2 G1 F2 GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 Wake_INP6 Wake_INP7 K_Out4 K_Out5 K_Out6 K_Out7 Gen_IO_2 Gen_IO_3 TP406 KEYCODER_RSTN KEYCODER_INT TP407 C3 C4 C5 D3 D4 D5 E3 E4 E5 B2 A1 B1 D2 D1 F1 E1 E2 KEY_COL(4) KEY_COL(5) KEY_COL(6) KEY_COL(7) A6 B5 A5 B4 A4 A3 B3 A2 Gen_In1 Gen_In0 CLK_In Gen_IO_0 Gen_IO_1 PWM VCC1 VCC2 KEY_COL(4:7) Wake_INP5 Wake_INP4 Wake_INP1 Wake_INP0 Wake_INP3 Wake_INP2 SCL_AB SDA_AB A7 B6 C7 D7 D6 E7 E6 F7 C2 C1 C6 B7 F5 G6 F6 G7 I2CSCL1 I2CSDA1 FOLDER_DETECT R419 68K TP406 C418 C419 0.1u 0.1u TP407 C418 AP_VDD_IO_2.7V Schematic of key sense part Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 117 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.11 Keypad backlight trouble Key Pad Back Light is on as below : Key pressing → STn8810 commend MSM6275 lighting the Key LED → MSM 6275 KPD_DRV_N go to Low → LED On (Key Pad LED controlled by PM6650) Start Key press AP_+VPWR is OK? Check device short : LD400~407 and R402~412 (Main) LD101~108 and R106~114 (Sub) NO Yes NO Signal KPD_DRV_N is Low? Yes Yes Only Sub board LED is not work? Change the main board Check connection between Main and FPCB and between FPCB and Sub NO Some LED is not work? Yes NO Work well? NO Check device open : LD400~407 and R402~412 (Main) LD101~108 and R106~114 (Sub) Change the main & Sub board Yes En d R400 (AP_+VPWR) VA400 (KPD_DRV_N) LD101~108 and R106~114 (Sub) LGE Internal Use Only LD400~407 and R402~412 (Main) - 118 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING Main R400 (AP_+VPWR) 0 R400 AP_+VPWR LD400 LD401 R402 100ohm R403 100ohm SSC-TWH104-HLS SSC-TWH104-HLS LD402 LD403 R405 100ohm R406 100ohm SSC-TWH104-HLS SSC-TWH104-HLS LD404 LD405 R408 100ohm R409 100ohm SSC-TWH104-HLS SSC-TWH104-HLS LD406 LD407 R411 100ohm SSC-TWH104-HLS R412 100ohm SSC-TWH104-HLS KPD_DRV_N VA400 (KPD_DRV_N) VA400 EVL14K02200 LD400~407 and R402~412 (Main) SUB AP_+VPWR LD100 LD101 R106 100ohm R107 100ohm SSC-TWH104-HLS SSC-TWH104-HLS LD103 LD104 R109 100ohm SSC-TWH104-HLS LD105 LD106 R112 100ohm SSC-TWH104-HLS SSC-TWH104-HLS LD107 LD108 R113 100ohm SSC-TWH104-HLS SSC-TWH104-HLS R110 100ohm SSC-TWH104-HLS R111 100ohm LD102 R108100ohm R114 100ohm SSC-TWH104-HLS KPD_DRV_N VA100 EVL14K02200 LD100~108 and R106~114 (Sub) Schematic of keypad backlight part Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 119 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.12 Folder on/off trouble Folder On/Off(Close/Open) is worked as below : Folder On/Off Event → Flip(U402 pin 1,key board) is triggered(Open : about 2.7V, Close : 0V) → Key coder IC(U404) sense the Folder Flip Event → Key coder IC send the key information to CPU by I2C interface Start NO Check the magnet in folder Assy Insert the magnet Yes Approach the magnet to U402 NO FLIP(U402p in 1) is 0V? Check the U402 And check the R413 for AP_VDD_IO_2.7V Yes YES Work well? NO Check R414, 415, C418,TP407,TP406 NO Work well? Change the Main Board Yes End C418 TP407 TP406 R414 RA400 U404 R415 U402 R413 magnet LGE Internal Use Only - 120 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING AP_VDD_IO_2.7V R414 KEY_ROW(0:3) R415 R414 R415 KEY_ROW(1) KEY_ROW(0) KEY_ROW(3) KEY_ROW(2) 3.3K 3.3K NC5 NC6 NC7 NC8 NC1 NC2 NC3 NC4 K_Out3 K_Out2 K_Out1 K_Out0 _RESET Int_Rx WD_Out Int_Tx U404 LM8333GGR8_NOPB U404 KEY_COL(3:0) KEY_COL(3) KEY_COL(2) KEY_COL(1) KEY_COL(0) G5 G4 F4 G3 F3 G2 G1 F2 KEYCODER_RSTN TP406 KEYCODER_INT GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 Wake_INP6 Wake_INP7 K_Out4 K_Out5 K_Out6 K_Out7 Gen_IO_2 Gen_IO_3 TP407 C3 C4 C5 D3 D4 D5 E3 E4 E5 B2 A1 B1 D2 D1 F1 E1 E2 KEY_COL(4) KEY_COL(5) KEY_COL(6) KEY_COL(7) A6 B5 A5 B4 A4 A3 B3 A2 Gen_In1 Gen_In0 CLK_In Gen_IO_0 Gen_IO_1 PWM VCC1 VCC2 KEY_COL(4:7) Wake_INP5 Wake_INP4 Wake_INP1 Wake_INP0 Wake_INP3 Wake_INP2 SCL_AB SDA_AB A7 B6 C7 D7 D6 E7 E6 F7 C2 C1 C6 B7 F5 G6 F6 G7 I2CSCL1 I2CSDA1 FOLDER_DETECT R419 68K TP406 C418 C419 0.1u 0.1u TP407 AP_VDD_IO_2.7V C418 RA400 100K 2 4 6 8 AP_VDD_IO_2.7V RA400 1 3 5 7 R413 AP_VDD_IO_2.7V SW400 R413 KEY_ROW(0) 100K U402 SW403 KEY_ROW(1) SW406 ZD1 RSB6.8CST2R FOLDER_DETECT C413 1u 1 2 3 A3212EEH-T 6 VDD 5 NC2 4 GND2 7 GND1 PGND OUTPUT NC1 U402 C414 0.1u EUSY0200301 KEY_ROW(2) SW409 FOLDER_SENSE KEY_ROW(3) Schematic of Folder on/off part Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 121 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.13 Micro SD trouble Micro SD is worked as below : Micro SD insertion → Card Detect (SD_INT) goes to low → STn8810 detect SD_INT and assert VMMC_3.1V by STw4810 → go working Start Insert the Micro SD Card NO NO SD_INT(C343,NA) is be low ? Does the micro SD icon appears ? YES YES NO Check VMMC_3.1V is over 2.85V? Work well? NO YES YES Check the Pull up resistor R309, R310,R311,R313,R314 End Change the main board R313 R314 C339 (VMMC_3.1V) C343 (SD_INT) R311 LGE Internal Use Only R310 R309 - 122 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING R311 R313 VMMC_3.1V R314 R310 51K S300 GCC110-8S-R-E1000 R314 51K R312 R313 NA 51K R311 R309 R310 51K 51K R309 GND SWB SWA SD_DAT(1) SD_DAT(0) 8 7 6 5 4 3 2 1 SD_CLK SD_CMD SD_DAT(3) SD_DAT(2) PLR0504F 4 5 6 C339 1u C339 (VMMC_3.1V) 3 2 D301 1 1 2 3 D300 PLR0504F 6 5 4 GND SD_INT C343 (SD_INT) C343 NA Schematic of Micro SD Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 123 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.14 Charging trouble Charging Current Flow USB Cable (5.0V) 4.2~4.25V USB_VBUS 6 5 4 1 2 3 Charging current sensing Q700 2012 Route as equal length as possible! -> ICHARGE, ICHARGEOUT 1% ICHARGEOUT R713 0.1 ICHARGE Q701 Main Battery +VPWR VBATT Q701 Q700 QST4 USB Charging control Pass control Tr (ON) USB_CTL_N NUS5530MN 10 Drain_B 1 9 NC1 Collector_B 8 2 Collector Emitter 3 7 Source Base 6 4 NC2 Drain 5 Gate Q602 Pass control Tr (ON) TA Charging control +5V_PWR CHG_CNT_N BATT_FET_N TA (4.6V) Battery FET (ON) Battery charging circuit !!!!! Battery charging control • Charging Procedure - Connecting TA or USB Cable - Control the charging current by PM6650-1M IC using USB_CNT_N or CHG_CNT_N signal - Charging Current flows into the battery by control BATT_FET_N • Check Point - Connection of TA or USB Cable - Charging current path - Battery • Trouble Shooting Setup - Connect TA or USB Cable and battery to the phone • Trouble Shooting Procedure - Check the charger connector - Check the charging current path - Check the battery LGE Internal Use Only - 124 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING Start Check the pin and battery Connect terminals of I/O connector NO Connection OK? Change I/O connector Yes NO Is the TA voltage 4.8V? Is the USB voltage 5.0V? Change TA/USB cable Yes Check the Q700,Q701 Yes Yes Charging OK? END NO Change the board Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 125 - LGE Internal Use Only 4. TROUBLE SHOOTING Q701 VBAT GND Q700 LGE Internal Use Only - 126 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.15 Audio trouble 4.15.1 Receiver path Voice Receiver path as below: MSM6275A Ear1ON/Ear1OP → U202(audio codec) → CN201(b’d to b’d connector for LCD Module) → CN102(LCD b’d to b’d connector of LCD FPCB) → R100, R101 → Receiver Start Connect the phone to network Equipment and setup call Setup 1KHz tone out Hear the tone to the receiver? NO YES Change the Receiver NO The sine wave appear at C225,C226? END Change the Main board YES NO The sine wave appear at R211,C212? Check the U202 or Change the Main board YES YES The sine wave appear at R100,R101 of LCD FPCB? Check the pads of Receiver NO Check connector pin or change the LCD FPCB Can you hear the tone? YES END Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 127 - LGE Internal Use Only 4. TROUBLE SHOOTING Receiver pads R100, R101 LCD connector Receiver R211, R212 C225, C226 LGE Internal Use Only - 128 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.15.2 Voice path for headset Voice path for Head_Set as below: MSM6275A HPH_R, HPH_L → C222,C224 U202(audio codec) → FB702, FB704 → C242,C244 → #4, #5 pin of CN202 headset Jack Start Connect the phone to network Equipment and setup call Setup 1KHz tone out And insert head_Set Headset insertion detection in the Main LCD Display OK? NO Check #8 pin of CN202 or change the Main b'd YES The sine wave appear at C222,C224 ? NO Change the Main board YES The sine wave appear at C242,C244 ? NO Check the U202 or change the Main b'd YES NO Can you hear the tone? Check the CN202 or change the Main b'd YES END Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 129 - LGE Internal Use Only 4. TROUBLE SHOOTING 21 19 C242 1000 C244 CN202 FB503 FB245 R222 R225 68 R223 1608 NA 68 C242 C242 33u C244 33u 100K 1 3 R219 IN G2 OUT U205 G1 2 4 C241 C240 1u 1u WM_MIC2N WM_MIC2P WM_LOUT1 WM_ROUT1 USB_D+ USB_DEAR_SENSE_N VBATT +5V_PWR REMOTE_PWR_O Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 130 - LGE Internal Use Only 1 2 3 4 5 6 7 8 9 10 11 12 13 14 CN202 C244 Schematic of voice path 4. TROUBLE SHOOTING U202 C222 WM_MIC2N D1 WM_MIC2P B4 WM_MICBIAS F9 HPVDD C9 A8 HP_SPKRGND A7 NC1 C8 NC2 F8 NC3 G2 NC4 H6 DBVDD J7 DCVDD ACOP MONO2 U202 WM8753LEB-RV MONO1 MIC1N ROUT1 B7 1u C229 B6 1u C230 D9 WM_MONO2 WM_MONO1 WM_ROUT1 MIC1 MIC2N LOUT2 A9 WM_LOUT2 MIC2 MICBIAS A5 C234 4.7u D8 ROUT2 C236 4.7u C235 4.7u B9 WM_ROUT2 GPIO4 E2 E8 E1 C1 WM_MIC1P U202 ACIN F1 MODE_GPIO3 H1 SCLK G1 SDIN F2 CSB_GPIO5 WM_MIC1N LOUT1 J4 BCLK H4 LRC H5 DACDAT J5 ADCDAT D2 OUT3 E9 RXN J3 VXFS J1 VXDIN J2 VXDOUT H3 VXCLK B3 OUT4 RXP G8 GP1_CLK1 J9 GP2_CLK2 J8 PCMCLK C224 A3 DGND H7 C2 J6 MCLK G9 PVDD H9 PGND 1u AVDD C226 LINE2 VREF B1 1u 1u C228 WM_RXP WM_RXN C225 A6 WM_HPH_L LINE1 B5 A1 AGND A2 1u VMID 1u A4 C222 WM_HPH_R C224 WM_AVDD WM_DVDD SPKRVDD C222 C224 100K R213 100K R214 VT_SW PM_SCL PM_SDA WM_DVDD MSPTCK0 MSPTFS0 MSPTXD0 WM_MSPRXD0 WM_AVDD WM_LRC WM_DACDAT WM_ADCDAT WM_BCLK AU_SW AU_19.2M SPK_AMP_EN 100K R215 Schematic of voice path Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 131 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.15.3 Sound path for headset Multimedia Sound path for Head_Set as below: STN8810(msptxd0) → U202(audio codec) → C242,C244 → #4,#5 pin of CN202 headset Jack Start Connect the phone to network Equipment and setup call Setup 1KHz tone out And insert head_Set NO Headset insertion detection in the Main LCD Display OK? Check #8 pin of CN202 or change the Main b'd YES Check the U202 or change the Main b'd The sine wave appear at C242,C244 ? YES NO Check the CN202 or change the Main b'd Can you hear the tone? YES END C242, C244 CN202 100K CN202 21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 R219 C241 FB503 1000 R222 68 C242 R223 68 33u C244 FB245 LGE Internal Use Only U205 1 - 132 - 1u WM_MIC2N WM_MIC2P WM_LOUT1 WM_ROUT1 USB_D+ USB_DEAR_SENSE_N VBATT 33u 1608 C240 1u IN OUT 2 REMOTE_PWR_ON +5V_PWR Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING CN202 Headset connector C242, C244 U202 Audio codec C222, C224 Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 133 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.15.4 Loud speaker path (voice speaker phone) Loud speaker path as below: MSM6275A HPH_R, HPH_L → C222,C224 → U202(audio codec) → C262,C267 → U208 (Speaker AMP) → pads of speaker → Speaker Start Connect the phone to network Equipment and setup call Setup 1KHz tone out Set phone with speaker phone mode The sine wave appear at C222,C224? NO Change the Main board YES The sine wave appear at C262, C267? NO Check the U202 or Change the Main board YES The sine wave appear at pads of speaker? NO Check the U208 and R229, R233 YES Can you hear the tone? NO Change the speaker YES END LGE Internal Use Only - 134 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes C224 A1 WM_HPH_L B1 1u C2 C224 C226 1u WM_RXN 1u A3 C228 WM_RXP C222, C225 B3 LINE1 LINE2 H6 A7 NC1 C8 NC2 F8 NC3 G2 NC4 1u DBVDD A2 DCVDD 1u DGND C222 WM_HPH_R J7 H7 4. TROUBLE SHOOTING C222, C224 RXP RXN ACIN U202 D2 C262, C267 ACOP WM8753LEB-RV MIC1N R229, R233 C261 NA WM_ROUT2 C262 R229 0.068u 10K R230 68K U208 1 2 100K R231 SPK_AMP_EN 3 C266 0.22u C267 WM_LOUT2 4 R233 0.068u Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 10K - 135 - TPA6205A1DRBR 6 VDD _SHUTDOWN VO- BYPASS IN+ VO+ IN- GND PGND R232 68K C268 NA 8 5 SPKLSPKL+ 7 9 LGE Internal Use Only 4. TROUBLE SHOOTING 4.15.5 Loud speaker path (VT, multimedia play, etc) Loud speaker path (VT, multimedia play) as below: STN8810(msptxd0) → U202(audio codec) → C262,C267 → U208 (Speaker AMP) → pads of speaker → Speaker Start Connect the phone to network Equipment and setup call Setup 1KHz tone out Set phone with speaker phone mode The sine wave appear at C262, C267? NO Check the U202 or Change the Main board NO Check the U208 and R229, R233 YES The sine wave appear at pads of speaker? YES Can you hear the tone? NO Change the speaker YES END LGE Internal Use Only - 136 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING MONO2 U202 WM8753LEB-RV MONO1 ROUT1 C229 B6 1u C230 D9 WM_MONO2 WM_MONO1 WM_ROUT1 A9 WM_LOUT2 B9 WM_ROUT2 GPIO4 ROUT2 1u E1 F1 MODE_GPIO3 H1 SCLK G1 SDIN F2 CSB_GPIO5 J4 BCLK H4 LRC H5 DACDAT J5 ADCDAT J3 VXFS J1 VXDIN J2 VXDOUT H3 VXCLK PGND G8 GP1_CLK1 J9 GP2_CLK2 J8 PCMCLK LOUT2 B7 Audio Codec C262, C267 R229, R233 C261 NA WM_ROUT2 C262 R229 0.068u 10K R230 68K U208 1 2 100K R231 SPK_AMP_EN 3 C266 0.22u C267 WM_LOUT2 0.068u 4 R233 10K TPA6205A1DRBR 6 VDD _SHUTDOWN VO- BYPASS IN+ VO+ IN- GND PGND R232 68K C268 NA 8 5 SPKLSPKL+ 7 9 Speaker AMP Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 137 - LGE Internal Use Only 4. TROUBLE SHOOTING Pads of Speaker U208 (Speaker Amp) R229, R233 C262, C267 U202 (audio codec) R711 C723 C722 LGE Internal Use Only - 138 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.15.6 Microphone for main MIC Main Microphone path as below: MIC → C245,C248 → U202(audio codec) → C229,C230 → MSM6275A → MIC feed back gain logic → MSM internal CODEC WM_AVDD WM_DVDD F9 HPVDD C9 A8 SPKRVDD HP_SPKRGND H6 DBVDD DGND DCVDD ROUT1 MIC1 [audio codec] MIC2N E8 D8 LOUT2 B7 1u C229 B6 1u C230 D9 WM_MONO2 WM_MONO1 WM_ROUT1 A9 WM_LOUT2 MIC2 C235 4.7u ROUT2 B9 WM_ROUT2 GPIO4 MICBIAS A5 C234 4.7u E9 E1 B4 MIC1N F1 MODE_GPIO3 H1 SCLK G1 SDIN F2 CSB_GPIO5 D1 WM_MIC2P WM_MICBIAS MONO2 MONO1 J4 BCLK H4 LRC H5 DACDAT J5 ADCDAT C252 39p U202 WM8753LEB-RV J3 VXFS J1 VXDIN J2 VXDOUT H3 VXCLK 2.2K R227 C251 39p ACOP G8 GP1_CLK1 J9 GP2_CLK2 J8 PCMCLK E2 WM_MIC2N ACIN AVDD C1 WM_MIC1P 1u OUT3 RXN VREF D2 OUT4 LOUT1 J6 MCLK G9 PVDD H9 PGND WM_MIC1N C248 VA201 EVLC18S02015 B3 WM_MIC1N SUMY0009203 VA200 EVLC18S02015 A3 LINE2 B5 1u C247 10p C2 LINE1 RXP AGND 1u B1 VMID C226 WM_MIC1P C246 39p A1 1u A6 WM_RXN C245 1 2 A2 1u C225 1u 2.2K R221 WM_RXP MIC200 1u C228 WM_MICBIAS C224 WM_HPH_L A4 C222 WM_HPH_R C245,C248 J7 H7 R221 A7 NC1 C8 NC2 F8 NC3 G2 NC4 C229,C230 C236 4.7u [main MIC] 100K R213 100K R214 VT_SW PM_SCL PM_SDA MSPTCK0 MSPTFS0 MSPTXD0 WM_MSPRXD0 WM_DVDD WM_MONO2 WM_MONO1 WM_AVDD WM_LRC WM_DACDAT WM_ADCDAT WM_BCLK AU_19.2M SPK_AMP_EN AU_SW 100K R215 Start L600 100nH Make a call SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100 Can you scoping some sound signal at C245,C248? NO Can you scoping some sound signal at C229,C230? NO Change the MIC Place near MSM pin W18 C608 C609 C610 C611 NA NA NA NA (CODEC VSS) AA20 AE20 AF20 AF22 AF21 MICINN MICINP AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P CCOMP AC19 make some sound or voice to MIC C607 0.1u 10% AE19 YES C600 10p AF19 Change the Main B'd MICINN MICINP NO AC20 MIC_BIAS(C102) is 2.7V? F25 M25 M26 [MSM6275A] Check the U202 or Change the Main B'd YES YES Work well? END Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 139 - LGE Internal Use Only 4. TROUBLE SHOOTING C245, C248 MIC200 (MIC for Handset) C229, C239 LGE Internal Use Only - 140 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.15.7 Microphone for headset 0 NA R716 R717 MIC for Head_Set path as below: Insert Headset → EAR_SENSE_N(pin8) go 0V → MSM6275A and STN8810 sense Head_Set insertion → MIC signal → U202(audio codec) → MSM6275. WM_DVDD C229,C230 G2 680K G1 USB_VBUS_IN UART_TXD UART_RXD WM_MIC1P E2 WM_MIC2N D1 WM_MIC2P C253 33u C234 4.7u F9 HPVDD C9 A8 SPKRVDD HP_SPKRGND J7 DGND ACIN ACOP U202 MONO2 WM8753LEB-RV MONO1 [audio codec] MIC1N MIC1 ROUT1 MIC2N LOUT2 E8 D8 B7 1u C229 B6 1u C230 D9 A9 WM_MONO2 WM_MONO1 WM_ROUT1 WM_LOUT2 MIC2 MICBIAS A5 11K CN203 1 5 2 4 3 R228 INSTPAR ICVL0505600V150FR 0.01u C259 B4 WM_MICBIAS 1% ROUT2 B9 WM_ROUT2 VBAT_TEMP VA209 D201 PSD05-LF EVLC14S02050 EVLC14S02050 VA208 VA207 47p 47p EVLC14S02050 EVLC14S02050 VA206 C256 C255 EVLC14S02050 INSTPAR PSD12-LF D200 VA204 VA205 EVLC18S02003 EVLC18S02003 RSB6.8CST2R C1 VREG_MSMP_2.7V VA203 VA210 VA211 10p 1u 33p smd_1608h_9_r C258 C254 C257 20 22 VA202 RSB6.8CST2R NFM21PC105B1A3 D2 WM_MIC1N LOUT1 RXN GPIO4 +5V_PWR 4 B3 VBATT_SENSE RXP E9 E1 2 R225 NA 3 CONNECTOR VBATT_SENSE PIN CHECK!! 1% A3 OUT4 OUT3 F1 MODE_GPIO3 H1 SCLK G1 SDIN F2 CSB_GPIO5 IN OUT 470K C2 J4 BCLK H4 LRC H5 DACDAT J5 ADCDAT 1 1608 R224 REMOTE_PWR_ON 1u LINE2 J3 VXFS J1 VXDIN J2 VXDOUT H3 VXCLK U205 C226 LINE1 AVDD FB245 B1 AGND 33u WM_RXP WM_RXN WM_LOUT1 WM_ROUT1 USB_D+ USB_DEAR_SENSE_N VBATT 1u VMID 33u C244 A1 C225 1u C242 68 A2 1u WM_HPH_L 68 R223 1u WM_HPH_R WM_MIC2N WM_MIC2P 47n R222 1u R226 FB503 1000 C240 1u C249 C241 A4 C222 R218 330K C224 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 A6 100K R219 21 19 H6 HOOK_SENSE DBVDD 1 OUT 2 U203 NCS2200SQ2T2G A7 NC1 C8 NC2 F8 NC3 G2 NC4 5 VCC GND G8 GP1_CLK1 J9 GP2_CLK2 J8 PCMCLK 3 H7 4 VIN+ C228 CN202 VIN- DCVDD 10u AP_VDD_IO_1.8V C240,C241 VREF 10p WM_AVDD C238 0.1u R216 1M R217 2.2K B5 C237 J6 MCLK G9 PVDD H9 PGND C239 C260 0.1u [CN202(headset connector)] WM_MONO2 WM_MONO1 Start Make a call YES L600 100nH END Try change the head set NO NO Change the Main b'd EAR_SENSE_N is 0V? C600 10p NO Change the Main b'd MIC_BIAS is 2.7V ? MICINN MICINP YES C607 0.1u 10% Place near MSM pin W18 C608 C609 C610 C611 NA NA NA NA (CODEC VSS) AA20 AE20 AF20 AF22 AF21 AE19 AF19 AC19 MICFBP MICINN MICINP AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P CCOMP AC20 YES make some sound or voice to MIC NO Can you scoping some sound signal at C240,C241? Change the MIC SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100 SDCC_DAT3_GPIO101 MDP_VSYNC_SECONDA_GPIO104 MDP_VSYNC_PRIMARY_GPIO105 F25 M25 M26 AE3 AD2 [MSM6275A] YES NO Can you scoping some sound signal at C229,C230? Check the U202 or Change the Main B'd YES YES Work well? END Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 141 - LGE Internal Use Only 4. TROUBLE SHOOTING C240 #8 pin of ear connector to check EAR_SENSE_N C237 Capacitor to check MIC bias (2.7V) C240 LGE Internal Use Only - 142 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.16 Camera trouble Camera control signals are generated by STN8810 and directly connected with STN8810. KS10 has two cameras. The one is a 2 Mega Camera, the other is VGA camera. 2M START Check the camera conn. and reconnect the camera Yes End Camera is OK? NO NO STN8810 output signal check (2M_RSTn_CAM, CAM_PWR_EN)) Yes NO Check AP_VDD_CAM_2.7V, AP_VDD_CAM_1.8V Change the LDO (U301, U303) Yes NO Check master clock OSC X200 output Change the OSC (X200) Yes No Check the CCIRCLK_CAM (FL201 #2) Check the EMI/ESD filter (FL201 #8) Yes No Yes Change the camera Change the Filter (FL201) Yes Camera is OK End NO Change the Main board Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 143 - LGE Internal Use Only 4. TROUBLE SHOOTING 2M_RSTn_CAM CAM_PWR_EN AP_VDD_CAM_2.7V AP_VDD_CAM_1.8V 24MHZ OSC output FL201 LGE Internal Use Only - 144 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING LOW Driven HIGH Hi-Z G3 R207 100K G4 C214 0.01u AXK7L34227 FL203 3 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 G1 5 4 EVRC18S03Q015050R INOUT_A1 INOUT_B1 CCIRIHS_CAM CCIRIVS_CAM CCIRICLK_CAM CAMCLK_27MHZ_CAM 4 3 2 1 9 8 2M_RSTn I2CSDA0_SW I2CSCL0_SW 7 6 10 2 2M_RSTn_CAM I2CSDA0_CAM I2CSCL0_CAM G2 1 2M_RSTn_CAM C213 27MHz C212 TRI_OPEN 0.1u GND CCIRIVS_CAM CCIRIHS_CAM 10u CSC3R270000BEVRS00 X200 3 4 OUT VDD 2 1 C211 2M_PWDN 8 9 10 11 12 13 14 15 16 17 CCIRID(7)_CAM CCIRID(6)_CAM CCIRID(5)_CAM CCIRID(4)_CAM CCIRID(3)_CAM CCIRID(2)_CAM CCIRID(1)_CAM CCIRID(0)_CAM C210 I2CSDA0_CAM I2CSCL0_CAM 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 G2 0.1u C207 1u 1 2 3 4 5 6 7 10u AP_VDD_CAM_1.8V CN200 G1 CCIRICLK_CAM 2M_RSTn_CAM FB204 HB-1M1005-601JT AP_VDD_CAM_2.7V 2M_CAMERA FB205 HB-1M1005-601JT AP_VDD_CAM_2.7V AP_VDD_CAM_1.8V INOUT_A4 INOUT_B4 INOUT_A3 INOUT_B3 INOUT_A2 INOUT_B2 INOUT_A1 INOUT_B1 FL201 CCIRIHS CCIRIVS CCIRICLK 6 7 8 CAMCLK_27MHZ 9 EVRC18S03Q015050R FL201 (#2) AP_VDD_CAM_2.7V AP_+VPWR 24MHZ OSC output U303 MIC5219-2.7YM5 1 5 IN OUT 2 GND 3 4 EN BYP CAM_PWR_EN C305 1u C306 470p C307 2.2u CAM_PWR_EN Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 145 - LGE Internal Use Only 4. TROUBLE SHOOTING VGA START Check the camera & 70-pin main conn. And reconnect these connectors Yes End Camera is OK? NO NO STN8810 output signal check (VGA_RSTn, VGA_STNADBY) Yes NO Check AP_VDD_CAM_2.7V, AP_VDD_CAM_1.8V Change the LDO (U301, U303) Yes NO Check master clock (CAMCLK_27MHZ : R206) Yes NO Check the EMI/ESD filter (FL201 #1) Change the Filter (FL201) Yes NO Check the CCIRCLK (R719) Check the CCIRCLK (in FPCB) (R104 in slider FPCB)) No Yes Change the camera Change the slider FPCB Yes Yes Camera is OK End NO Change the Main board LGE Internal Use Only - 146 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING VGA_STANDBY VGA_RSTn R719 (CCIRICLK) FL201 R104 (CCIRICLK) AP_VDD_CAM_1.8V AP_VDD_CAM_2.7V CAMCLK_27MHZ Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 147 - LGE Internal Use Only 4. TROUBLE SHOOTING MAIIN-SLIDER CON-HEADER CN201 G1 G2 CCIRIHS R718 0 FB221 R719 0 VGA_RSTn A0_CAM L0_CAM VGA_RSTn CCIRICLK R719 (CCIRICLK) RECEIVER+ RECEIVERRECEIVER-MOT_PWR- 15050R WLED_CTL FB223 FB224 LCD_NRESET VGA_STANDBY FB230 FB233 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 R720 R721 R722 R723 R724 R725 R726 R727 R728 0 0 0 0 0 0 0 0 0 CAMCLK_27MH FB225 FB227 FB229 FB231 FB232 FB234 FB235 FB236 4 3 2 1 10 INOUT_A4 INOUT_B4 INOUT_A3 INOUT_B3 INOUT_A2 INOUT_B2 INOUT_A1 INOUT_B1 FL201 FL201 (#1) MCAM_27M CCIRIHS CCIRIVS CCIRICLK 6 7 8 CAMCLK_27MHZ 9 EVRC18S03Q015050R R206 0 CAMCLK_27MHZ AP_VDD_CAM_2.7V G1 AP_VDD_CAM_2.7V AP_VDD_CAM_1.8V CCIRIHS_CAM VGA_RSTn I2CSDA0_CAM I2CSCL0_CAM R104 CCIRICLK_CAM 0 1 2 3 4 5 6 7 8 9 10 11 12 G2 FB100 HB-1M1005-601JT CN102 AP_VDD_CAM_2.7V VGA_CAMERA CN100 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 AP_VDD_CAM_1.8V FB101 HB-1M1005-601JT CCIRIHS_CAM CCIRIVS_CAM CCIRICLK_CAM CAMCLK_27MHZ_CAM G2 G1 5 VGA_STANDBY VGA_RSTn I2CSCL0_CAM I2CSDA0_CAM CCIRIHS_CAM CCIRIVS_CAM CCIRID(7)_CAM CCIRID(6)_CAM AP_VDD_CAM_1.8V C102 1u C100 0.1u C101 0.1u AXK720145G CAMCLK_27MHZ R104 (CCIRICLK) Schematic of VGA camera part LGE Internal Use Only - 148 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING 4.17 Main LCD trouble Main LCD control signals are generated by STN8810. Those signal’s path are : STN8810 -> 70-pin main connector(CN201 in main PCB) -> 70-pin connector (CN102 in slider FPCB) -> 40-pin connector (CN101 in slider FPCB) -> 40-pin connector (CN101 in SUB PCB) -> LCD zip connector (CN100 in SUB PCB) -> LCD Module START Press END key to turn the power on No Is the circuit powered? Follow the Power ON trouble shooting Yes Disconnect and reconnect 70-pin , 40-pin B to B, and 35-pin zip connector Yes LCD display OK? No Check AP_VDD_LCD_2.8V, LCD_NRESET, LCD_DATA(0) in Main BD Yes No Change the Main BD Check the same signal in SUB BD No Yes Yes Display OK? Change the slider FPCB & re-check No Yes No Change the LCD module Change the SUB BD The LCD works End Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 149 - LGE Internal Use Only 4. TROUBLE SHOOTING Main BD LCD_NRESET LCD_DATA(0) AP_VDD_LCD_2.8V SUB BD LCD_DATA(0) LCD_NRESET AP_VDD_LCD_2.8V LGE Internal Use Only - 150 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING MAIIN-SLIDER CON-HEADER CN201 G1 G2 R718 CCIRIHS VGA_RSTn SDA0_CAM CSCL0_CAM R719 CCIRICLK 0 FB221 0 RECEIVER+ RECEIVERRECEIVER-MOT_PWR3Q015050R 9 WLED_CTL FB223 FB224 8 7 6 LCD_NRESET FB230 FB233 VGA_STANDBY 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 R720 R721 R722 R723 R724 R725 R726 R727 R728 0 0 0 0 0 0 0 0 0 CCIRIVS CCIRID(7) CCIRID(6) CCIRID(5) CCIRID(4) CCIRID(3) CCIRID(2) CCIRID(1) CCIRID(0) CAMCLK_27MHZ_CAM AP_VDD_LCD_2.8V AP_VDD_LCD_2.8V AP_+VPWR FB222 FB225 FB227 FB229 FB231 FB232 FB234 FB235 FB236 LCD_DATA(0) LCD_NRESET LCD Connector AP_VDD_LCD_2.8V (lower contact) 100K 0 TP100 TP101 LCD_DATA(0:15) LCD_DATA(0) LCD_DATA(1) LCD_DATA(2) LCD_DATA(3) LCD_DATA(4) LCD_DATA(5) LCD_DATA(6) LCD_DATA(7) LCD_DATA(8) LCD_DATA(9) LCD_DATA(10) LCD_DATA(11) LCD_DATA(12) LCD_DATA(13) LCD_DATA(14) LCD_DATA(15) LCD_DATA(0) LCD_NRESET TP102 1u R103 100K R104 100K R115 C104 XF2B-3545-31A-P C105 820p RSB6.8CST2R R102 LED1 LED2 LED3 LED4 LED_ANODE LCD_VS DIS_CSN DIS_RS DIS_WEN LCD_NRESET ZD100 AP_VDD_LCD_2.8V CN100 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Schematic of LCD part Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 151 - LGE Internal Use Only 4. TROUBLE SHOOTING 4.18 Bluetooth trouble Bluetooth control signals are generated by STN8810. Those signal’s path are : STN8810 → AP_VDD_IO_1.8V and AP_VDD_BT_2.7V is asserted → CLK32K is asserted → Bluetooth ON → BT_RESETN is High CLK_REQ_OUT_1 is High → REF_CLK_IN is asserted → transmit/receive data/control through UART → transmit/receive voice data through PCM I/F AP_VDD_BT_2.7V X400 U401 D3 D6 G3 C5 F5 G4 UTXD0 URTS0N D1 C2 D2 E1 PCMCLK PCMSYNC PCMDATAIN PCMDATAOUT CLK_REQ_OUT_1 0 E2 F2 F1 G7 AP_VDD_IO_1.8V 0 R410 A6 B5 G2 G5 F3 E7 0 A7 UART_RXD UART_CTS C408 F6 F4 URXD0 UCTS0N GPIO_0 CLK_REQ_IN_1 CLK_REQ_IN_2 HOST_WAKEUP CONFIG_1 CONFIG_3 CONFIG_2 GPIO_11 VSS_RF1 VSS_RF2 B2 A2 A5 FL400 ANT400 DEA212450BT-7043C1 FL400 RFP RFN A3 A4 5 4 BP1 BP2 CLK_REQ_OUT2 U_BP BP_DC 1 2 ANT400 NC1 R404 FEED NC2 0 TOUT_IP_QN TOUT_IN_QP VSS_DIG1 VSS_DIG2 E3 E4 R404 VDD_D VDD_IO_A VDD_IO_B VDD_CLD VDD_HV_A VSS_ANA1 VSS_ANA2 VSS_ANA3 B4 B6 C6 VDD_HV_D VDD_DSM VDD_N VDD_CL VDD_RF AF_PRG E5 220n 0.1u 0.1u 220n 220n C407 UART_TXD UART_RTS C410 C411 C412 220n C406 C409 0.1u 220n C405 C404 0.1u B7 C7 D7 A1 C400 33u PCM_CLK PCM_SYNC PCM_A PCM_B R715 G1 C403 470p 6 3 R401 AP_VDD_BT_2.7V C402 1u C4 BT_WAKEUP B3 GPIO_16 C3 GPIO_8 B1 GPIO_9 C1 GPIO_10 D5 E6 G6 F7 PON STLC2500C RESET_N REF_CLK_IN LP_CLK U400 MIC5219-2.7YM5 1 5 IN OUT 2 GND 3 4 EN BYP G2 G1 TP400 X400 CSC3M192000EEVRS00 BT_RESETN 3 VDD OUT 2 TRI_OPEN GND CLK32K 19.2MHz C401 0.1u 4 1 R714 U400 0 AP_+VPWR AP_VDD_BT_2.7V Figure. Schematic of Bluetooth Interface LGE Internal Use Only - 152 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 4. TROUBLE SHOOTING Bluetooth RF Test TC-3000A (Bluetooth Tester) 1. Set phone to bluetooth test-mode: Enter Test Mode(*#32*36907#) → Module Test Set → BT DUT → BT DUT ON 2. Connect phone to bluetooth tester 3. Set channel to 39 4. Measure output-power 5. Check TP1 : output-power > -6 dBm Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 153 - LGE Internal Use Only 4. TROUBLE SHOOTING Set the bluetooth ON AP_VDD_BT_2.7V is asserted? Check LDO (U400) Pin#5 REF_CLK_IN is asserted? Check Oscillator (X400) RF Power (R404) < -6 dBm? Check BT Antenna (ANT400) soldering ANT400 R404 FL400 Check FL400 soldering Bluetooth is work well? Change the main board U400 X400 END LGE Internal Use Only - 154 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 5. DOWNLOAD 5.1 Composition omposition 5.1.1 PC OS - Windows 2000(SP4) & Windows XP(SP2) - RAM : 256M - USB : 1.1 or 2.0 5.1.2 D/L Tool - TA-25G - 3G USB DLC - USB HUB : Support 1.1 with 2.0 4 ~7 ports USB Using the external power (Adaptor) 5.1.3 Program - LGDP2 program: V32 5.1.4 Solution for KS10 - AP : Nomadik application processors - MP : Qualcomm application processors Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes <3G USB DLC> - 155 - LGE Internal Use Only 5. DOWNLOAD 5.2 LGDP2 Program install LGDP2 Program install 5.2.1 The "LGDP2_for set-up zip" file is downloaded on CSMG site. 5.2.2 The "LGDP2_for set-up zip" file is unzip as same name in PC. 5.2.3 Select "First LGDP2_set-up" folder. 5.2.4 Open "serial_number" file. 5.2.5 Double click "LGDP2_31_INCLUDE_LGDP1_Setup" file. LGE Internal Use Only - 156 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 5.2.6 Click “Next” button. 5.2.7 Writing Serial number and then click “Next” button. 5.2.8 Click “Install” button. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 157 - LGE Internal Use Only 5. DOWNLOAD 5.2.9 Click “Finish” button. LGE Internal Use Only - 158 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 5.3 USB Driver setup USB Driver setup 5.3.1 Setup the USB driver for MP. 5.3.1.1 Select "LG USB Modem Driver 4"1".7(WHQL)" in "LGDP2_for set-up" folder. 5.3.1.2 Double click “LGUSBModemDriver_WHQL_Eng_Ver_4.7” Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 159 - LGE Internal Use Only 5. DOWNLOAD 5.3.1.3 Click “Next” button. LGE Internal Use Only 5.3.1.4 Click “OK” button. - 160 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 5.3.2 Setup the KS10 USB driver for AP. 5.3.2.1 Copy "KS10_USB_20070426" folder in "LGDP2_for set-up" folder. 5.3.2.2 And then paste this folder on "DOWNLOAD" folder in C driver as below picture. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 161 - LGE Internal Use Only 5. DOWNLOAD 5.4 KS10 LGDP2 run file & DLL file setup 5.4.1 Setup the KS10 run file & DLL file. 5.4.1.2 And then paste these file & folder 5.4.1.1 Copy "LGDP2_V32" file & "Model" folder in "LGDP2_for set- on "DOWNLOAD" folder in C up" folder. driver. LGE Internal Use Only - 162 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 5.5 Execute LGDP2 program 5.5.1 Double click “LGDP2_V32” file in "DOWNLOAD" folder. 5.5.2 Click “LOGIN” button. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 163 - LGE Internal Use Only 5. DOWNLOAD 5.5.3 You choose the "UMTS" in "Division" Box 5.5.4 Click “OK” button. LGE Internal Use Only - 164 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 5.5.5 Click “Operation(C)” on menu and then select “Config”. 5.5.6 Click “OK” button. * Ignore these below message 5.5.7 Click “All” icon. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 165 - LGE Internal Use Only 5. DOWNLOAD 5.5.8 Choose the "KS10.DLL" file on "Model" folder in "Download" folder. 5.5.9 Click “Run Download Configuration” button. 5.5.10 Select AP download & Old Version Binary & MP Download icons. Explain Old Version Binary icon It is control "Binary" type. We use old type Binary in now so, you should be check this category. But in the future, We will release the new Binary. So, If the new Binary is released, you don't check "Old Version Binary" category. LGE Internal Use Only - 166 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 5.5.11 Insert “SW-KS10-STN8810-V10a-MAY-05-2007 -OPEN-IT-SEC-OFC” in "KS10" folder on "Model" folder after click "..." icon on "BIN" Box right side. 5.5.12 Insert “KS10M.Dll” in "KS10_DLL" folder on "Model" folder after click "..." icon on "DLL" Box right side. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 167 - LGE Internal Use Only 5. DOWNLOAD 5.5.13 Insert “SW-KS10-MSM6275-V10a-MAY-05-2007 -OPEN-IT-SEC-OFC.dz” in "KS10" folder on "Model" folder after click "..." icon on "BIN" Box right side. 5.5.14 Click “OK” button. LGE Internal Use Only - 168 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 5.5.15 Click “OK” button. 5.5.16 Click “START” button and then connect phone. 5.5.17 PC create New hardware driver. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 169 - LGE Internal Use Only 5. DOWNLOAD 5.5.18 Click “Next” button. 1” icon and then click “Next” button. 5.5.19 Select “1 1 2” icon and then click “Next” button. 5.5.20 Select “2 2 LGE Internal Use Only - 170 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 5.5.21 Select "KS10_USB_Driver_20070426" folder in "DOWNLOAD" folder. 5.5.22 Click the "lgjoyusb" file. 5.5.23 Click “OK” button. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 171 - LGE Internal Use Only 5. DOWNLOAD 5.5.24 Click “OK” button. 5.5.25 Click “Finish” button. 5.5.26 the LGDP2 program is running automatically. LGE Internal Use Only - 172 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 5.5.27 Remember a first com ports No.. 5.5.28 It is displayed "Fail" message after completing AP downloading. Don’t disconnection phone. 5.5.29 Click mouse right button on “My computer”. Then select “Manage”. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 173 - LGE Internal Use Only 5. DOWNLOAD 5.5.30 Follow up as below step. Device Manager > LGE CDMA USB Serial port > click mouse right button > select “properties” 5.5.31 Select “Port settings” icon. Then click “Advanced” button. LGE Internal Use Only - 174 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 5.5.32 You should select com port No. which first com No. plus 40 is for MP. ex) First com port : com 4 port Select com 44 (= 4+ 40 ) port 5.5.33 Click “OK” button. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 175 - LGE Internal Use Only 5. DOWNLOAD 5.5.34 Click “OK” button. 5.5.35 Checking com port number. LGE Internal Use Only - 176 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 5. DOWNLOAD 5.5.36 Disconnect and reconnect the phone. And then the program is running automatically. 5.5.37 Running the LGDP2 program. ❇ If you want to download the other phone, you just do from 5-17 to 5-36 category on this Guide. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 177 - LGE Internal Use Only 6. BLOCK DIAGRAM 6. BLOCK DIAGRAM 6.1 GSM & WCDMA RF Block Fig 2.1-1.UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram LGE Internal Use Only - 178 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 6. BLOCK DIAGRAM Table 2.1-1. RF Block Component Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 179 - LGE Internal Use Only 6. BLOCK DIAGRAM 6.2 Interface Diagram KS10 Interface Diagram LGE Internal Use Only - 180 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 6. BLOCK DIAGRAM Main RF signal (black) GSM TX : GSM Tx RF signal GSM RX : GSM Rx RF signal DCS TX : DCS Tx RF signal DCS RX : DCS Rx RF signal PCS TX : PCS Tx RF signal PCS RX : PCS Rx RF signal UMTS TX : UMTS Tx RF signal UMTS RX : UMTS Rx RF signal TX_I/Q : I/Q for Tx of RF RX_I/Q : I/Q for Rx of RF Control signal(red) ANT_SEL 0,1,2 : Ant Switch Module Mode Selection (WCDMA, GSM Tx/Rx, DCS Tx/Rx, PCS Tx/Rx) GSM PA_CTL Signal GSM_PA_BAND : DCS or PCS /GSM Mode Selection GSM_PA_EN : Power Amp Gain Control Enable GSM_PA_RAMP : Power Amp Gain Control GSM/DCS/PCS_VCO_EN GSM_TX_VCO_0_EN_N : GSM band Tx VCO Enable GSM_TX_VCO_1_EN_N : DCS or PCS band Tx VCO Enable UMTS PA_CTL Signal TX_AGC_ADJ : WCDMA Tx Power Level Control HDET1 : WCDMA Tx High Power Level Control PA_ON : WCDMA Tx Power Amp Enable W_VMODE_N : WCDMA Tx Power Amp Gain Control TRK_LO_ADJ : TCXO(19.2M) Control Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 181 - LGE Internal Use Only 6. BLOCK DIAGRAM *Top Side LGE Internal Use Only - 182 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 6. BLOCK DIAGRAM *Bottom Side Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 183 - LGE Internal Use Only 6. BLOCK DIAGRAM 6.3 KS10 Modem & Baseband Block Diagram LGE Internal Use Only - 184 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 6. BLOCK DIAGRAM 6.4 KS10 Application Processor Block Diagram Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 185 - LGE Internal Use Only 6. BLOCK DIAGRAM 6.5 KS10 Audio & BT Block Diagram ANT Filter AU_19.2M STLC2500C (BT) PCM Level Shifter MIC_BIAS PCM BT_19.2M MIC MIC1 UART GPIO LOUT2 ROUT2 WM_DACDAT UART0 MSPRXD0 WM_MSPRXD0 GPIO Switch MSPRCK0 MSPRFS0 WM_8753 (Audio Codec.) Switch WM_MSPTCK0 WM_MSPTFS0 STN8810 (CPU) I2CSCL0 Level Shifter I2CSDA0 GPIO GPIO PM_SCL PM_SDA SPK_AMP_SD_N Speaker OUT3 LOUT1 ROUT1 GPIO WM_BCLK WM_LRC I2S AMP Receiver I2S MIC2 SCL SDA Head Set RXP RSN MSM WM_MONO1 WM_MONO2 HOOK_SENSE_N EAR_SENSE_N LGE Internal Use Only - 186 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 6. BLOCK DIAGRAM 6.6 KS10 Camera Block Diagram Each part (2M camera & VGA camera) supports the Hi-Z state in power down mode. OSC CAM_PWR_EN I2CSDA0 I2CSCL0 CPU MCLK CAM power 1.2V 8 Data[7:0] VSYNC HSYNC PCLK 2M_nReset 2M_PWDN 2M Camera module CAM power 2.7V ON/OFF SW Slide Slide MCLK VGA_nRESET VGA_STANDBY VGA Camera module Level Shifter Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 187 - LGE Internal Use Only 6. BLOCK DIAGRAM 6.7 KS10 LCD Block Diagram Slide LCD power 2.8V CPU Data[15:0] nCS1 nWE RS nRESET LCD_VSYNC 16 LCD module (Hitachi 2.4íí) Backlight Driver WLED_EN LGE Internal Use Only - 188 - Control Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 6. BLOCK DIAGRAM 6.8 KS10 Power Distribution Diagram DC Power VBAT Power ON/Off Logic Charging Circuit AP_+VPWR +VPWR R0 VREG_MSMA _2.6V VREG_MSMC _1.375 PM6650 (PMIC) Vibrator Key Pad LED TPA6205A1DRBR (Audio AMP) BH33FB1WHFV (LDO Audio) AU_3.3V CAM_1.8V WM8753LEB (Audio Codec.) MAX4717 (AU SW) MSM6275 BH18LB1WHFY (LDO MCAM) MIC5219-2.7 (LDO CAM) AAT3151IWP_T1 (LCD Backlight Driver) LCD_2.8V CAM_2.7V 2M_CAMERA (Connector) R1114N281D-TR-F (LDO LCD) VGA_CAM (Connector) LCD (Connector) VDD_IO VREG_MSMP _2.7V AP_VDD_IO_1.8V VREG_MSME _1.8V TY90009800 COGG (Memory) VCORE/ VPLL/ VFUSE STw4810 (PMIC) VDDIOC/D/E VDDQ/DDR/NAND STn8810 (CPU) Reset Logic ST2378 (Level ST2378 Shifter) (Level Shifter) STLC2500 (BT) RST VDDIOA/B/F VREG_USIM _2.85V VREG_TCXO _2.85V VREG_SYNTH _2.85V VREG_RFTX _2.85V VREG_RFR _2.85V USIM (Socket) VUSB_3.1V VMMC_3.1V TransFlash (Connector) RF Block MIC5219-2.7 (LDO IO) SLAS4717EPMTR2G (USB SW) AP_VDD_IO_2.7V Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Key Pad Array pull up - 189 - LM8333 (Key Coder) NLAS3158MNR2G (UART SW) A3212EEH-T (Folder Sense) Key Pad Array pull up (Folder) LGE Internal Use Only 6. BLOCK DIAGRAM 6.9 KS10 Clock Distribution Diagram 19.2MHz OSC 19.2MHz 27MHz MXTALI VGA Camera L/S CLKOUT0 19.2MHz PWREN Nomadik AU_PWR_EN 19.2MHz 27MHz 27MHz OSC SXTALI 2M Camera 19.2MHz OSC WM9712 (Audio Codec.) REF_CLK_IN 19.2MHz CLK_REQ_OUT_1 STLC2500C (BT) PWREN CLK_32K LP_CLK 32.768KHz L/S TCXO_EN STw4810 32.768KHz Request_MC CLK_32K_IN L/S 32.768KHz SLEEP CLK 19.2MHz TCXO 19.2MHz PM6650 32.768KHz (X-tal) TCXO_OUT 19.2MHz RTR6250_TCXO RFR6250_TCXO TCXO RF Block MSM6275 LGE Internal Use Only USB 48MHz (X-tal) - 190 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 7. CIRCUIT DIAGRAM 15K VDDIOD D TP100 R109 10K TP101 E VDDIOD EAR_SENSE_N VGA_STANDBY_AP 4.7K VDDIOA H25 M25 R25 W25 GND77 GND78 GND79 GND80 MSPTXD0 MSPTFS0 MSPRXD0 MCDAT2DIR REMOTE_PWR_ON_AP SW_RESET SD_INT D15 C15 E16 F17 F24 G24 H22 C107 0.33u MCCLK MCFBCLK MCCMD MCCMDDIR MCDAT3 MCDAT2 MCDAT1 MCDAT0 MCDAT0DIR MCDAT31DIR D12 E17 C12 E13 D13 C13 E14 D14 C14 E15 MCCLK MCFBCLK MCCMD MCCMDDIR MCDAT3 MCDAT2 MCDAT1 MCDAT0 MCDAT0DIR MCDAT31DIR C103 C104 C105 C106 120p C100 C101 C102 0.33u 120p 120p F6 VOTP C7 51K RCOMP M2 R2 W2 H2 F3 VDDA VDDQ1 VDDQ2 VDDQ3 VDDQ4 G2 G25 L2 T2 Y2 Y25 VDDDDR1 VDDDDR2 VDDDDR3 VDDDDR4 VDDDDR5 VDDDDR6 B12 B15 AE12 AE15 VDDNAND1 VDDNAND2 VDDNAND3 VDDNAND4 VDD12_1 VDD12_2 VDD12_3 VDD12_4 VDD12_5 VDD12_6 VDD12_7 VDD12_8 VDD12_9 VDD12_10 VDD12_11 VDD12_12 VDD12_13 VDD12_14 VDD12_15 F11 F16 F18 G21 J6 L6 L21 P6 R21 T6 V6 V21 AA8 AA17 AB24 F14 F20 F13 F9 F10 F12 VDDIOF1 VDDIOF2 VDDIOF3 VDDIOE1 VDDIOE2 VDDIOE3 H21 K21 M21 T21 U21 N21 VDDIOD1 VDDIOD2 VDDIOD3 VDDIOD4 VDDIOD5 VDDIOD6 Y21 Y22 AA11 AA12 AA14 AA15 AA16 AA18 AA21 AB20 W23 AA13 AA20 AB11 AB18 VDDIOC1 VDDIOC2 VDDIOC3 VDDIOC4 VDDIOC5 VDDIOC6 VDDIOC7 VDDIOC8 VDDIOC9 VDDIOC10 VDDIOC11 VDDIOC12 VDDIOC13 VDDIOC14 VDDIOC15 U6 W6 AA9 U100 CCPDAP CCPDAN CCPCKP CCPCKN CCPRSET CLPWR CLLPHS CLPCK CLFPVS CLACDE CLLE CLCD17 CLCD16 CLCD15 CLCD14 CLCD13 CLCD12 CLCD11 CLCD10 CLCD9 CLCD8 CLCD7 CLCD6 CLCD5 CLCD4 CLCD3 CLCD2 CLCD1 CLCD0 DU1 DU2 AC15 AC14 AB15 AC16 AD12 AA10 AA19 AB22 AD22 AD21 AB13 AC17 AB14 AB16 AB23 AA23 AD19 AD18 AD9 AD17 AD10 AD13 AD16 AD11 AD20 AD14 AD15 AA22 AC23 AB21 AC20 AC22 AC19 AC21 AC18 AB19 AB17 AC13 AB12 AC12 AB9 AC10 AC9 AC11 AB10 EBI2_DATA(0) HCSN HALEN_SSPRXD HADR2_URXD1 HADR1_UTXD1 HADR0 HBHEN HWRN_SSPFRM HRDN_SSPCLK HRDY_RTCK HPIEV HDAT15 HDAT14_MSPSCK1 HDAT13 HDAT12 HDAT11_MSPTFS1 HDAT10_MSPTXD1 HDAT9 HDAT8 HDAT7 HDAT6 HDAT5 HDAT4 HDAT3 HDAT2 HDAT1 HDAT0 GND63 GND64 GND65 GND66 GND67 R102 0 R103 10 AP_VPLL VDDA VDDIOE B VDDQ VDDDDR VDDNAND USBVP USBVM USBRCV USBSDA USBINTN USBOEN USBSCL E24 F22 F23 E22 G22 G23 E23 C112 0.1u C113 0.1u C114 0.1u C115 0.1u C116 0.1u C117 0.1u C118 0.1u C110 0.1u C119 0.1u I2CSCL0 I2CSDA0 VDD12 CCIRID(7) CCIRID(6) CCIRID(5) CCIRID(4) CCIRID(3) CCIRID(2) CCIRID(1) CCIRID(0) CCIRIVS CCIRIHS CCIRICLK D C120 0.1u C121 0.1u C122 0.1u C123 0.1u C124 0.1u C125 0.1u C126 0.1u C127 0.1u C128 0.1u D9 E9 C9 E10 C8 E VDDIOD V3 W4 V5 AA7 W3 V4 AC8 AD8 AC6 AB5 AC5 AA6 AA5 AD5 AC4 AB4 AA4 AB3 Y5 AA3 Y4 Y6 Y3 W5 VDDIOF VDDIOE DIS_CSN DIS_RS LCD_VS DIS_WEN VGA_RSTN LCD_NRESET LCD_DATA(15) LCD_DATA(14) LCD_DATA(13) LCD_DATA(12) LCD_DATA(11) LCD_DATA(10) LCD_DATA(9) LCD_DATA(8) LCD_DATA(7) LCD_DATA(6) LCD_DATA(5) LCD_DATA(4) LCD_DATA(3) LCD_DATA(2) LCD_DATA(1) LCD_DATA(0) C129 0.1u LCD_DATA(0:15) C130 0.1u C131 0.1u C132 0.1u C134 0.1u C133 0.1u C135 0.1u C136 0.1u C137 0.1u F VDDIOC C138 0.1u C139 0.1u C140 0.1u C141 0.1u C142 0.1u C143 0.1u C144 0.1u L25 T25 C AE25 AE26 AF24 AF25 AF26 C VDDIOB VDDIOA TP104 VDDIOA AP_VDD_IO_2.7V R114 0 D 100K VDDIOB R115 D C111 0.1u IT_WAKE_UP_AP E21 K5 K3 L4 L5 L3 M4 M5 M3 P5 P3 R5 VDDDDR VDDIOE GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10 GND11 GND12 GND13 GND14 GND15 GND16 GND17 GND18 GND19 GND20 GND21 GND22 GND23 GND24 GND25 GND26 GND27 GND28 GND29 GND30 GND31 GND32 GND33 GND34 GND35 GND36 GND37 GND38 GND39 GND40 GND41 GND42 GND43 GND44 GND45 GND46 GND47 GND48 GND49 GND50 GND51 GND52 GND53 GND54 GND55 GND56 GND57 GND58 GND59 GND60 GND61 GND62 GND68 GND69 GND70 GND71 GND72 GND73 GND74 GND75 GND76 H3 G5 H4 H5 J5 HPI_EME_MOD_ETMPSTA1_XTIDAT HPI_EME_APE_ETMPSTA2_XTIDAT J4 G6 EBI2_WE_N 100K G4 EBI2_OE_N E4 AP_RTCK R113 N4 EBI2_DATA(0:15) HPIEV_IT_STATE_ETMTRIGIN E12 EBI2_DATA(15) C11 EBI2_DATA(14) D11 EBI2_DATA(13) E11 EBI2_DATA(12) C10 EBI2_DATA(11) D10 EBI2_DATA(10) N3 EBI2_DATA(9) P4 EBI2_DATA(8) R4 EBI2_DATA(7) R3 EBI2_DATA(6) T5 TP103 EBI2_DATA(5) T4 EBI2_DATA(4) T3 EBI2_DATA(3) U5 EBI2_DATA(2) U4 EBI2_DATA(1) U3 UART_SW EBI2_ADDR(2) EBI2_ADDR(1) R112 C CCIRID7_CCIROD7 CCIRID6_CCIROD6 CCIRID5_CCIROD5 CCIRID4_CCIROD4 CCIRID3_CCIROD3 CCIRID2_CCIROD2 CCIRID1_CCIROD1 CCIRID0_CCIROD0 CCIRIIVS CCIRIHS CCIRICLK_CCIROCLK AP_VCORE VDDNAND F5 I2CSCL0 F4 I2CSDA0 PWLOUT 10K 100K F USBVP USBVM USBRCV USBSDA USBINTN USBOEN USBSCL STN8810S12B2V1 0 VDDQ UTXD0 URXD0 UCTS0N URTS0N URXD2 D6 UTXD0 F7 URXD0 E7 UCTS0N D8 URTS0N AB6 URXD2 M24 SMAD10 W21 SMPS1N J21 SMPS0N J22 SMCS1N K22 SMCS0N M23 SMAD9 L24 SMWEN P21 SMOEN N23 SMAD0 K23 SMAD1 L23 SMAD2 K24 SMAD3 M22 SMAD4 N24 SMAD5 J23 SMAD6 L22 SMAD7 J24 SMAD8 P24 SMWAITN Y23 SMFWPN Y24 SMFRSTN W22 SMA_DQ0 V23 SMA_DQ1 T23 SMA_DQ2 T22 SMA_DQ3 V24 SMA_DQ4 U24 SMA_DQ5 P23 SMA_DQ6 P22 SMA_DQ7 V22 SMA_DQ8 U23 SMA_DQ9 U22 SMA_DQ10 W24 SMA_DQ11 R23 SMA_DQ12 R22 SMA_DQ13 T24 SMA_DQ14 R24 SMA_DQ15 H23 SMPIOWN E18 SMPIOIS16N AE7 TP102 AE8 TMPWNG0 TMPWNG1 AE19 NANDWP0N AE20 NANDWP01 HCSN_ETMCLK_XTICLK R101 KEYCODER_RSTN KEYCODER_INT PWR_BTN HOOK_SENSE MSPTCK0 MSPRFS0 MSPRCK0 2M_RSTN_AP LEVEL_SHIFT_EN WLED_CTL AU_PWR_EN LCD_PWR_EN CAM_PWR_EN USB_SW UTXD2 I2CSCL1 I2CSDA1 BT_RESETN 2M_PWDN_AP HPI_IT_MOD_ETMSYNCA_XTIDAT HPI_IT_APE_ETMPSTA0_XTIDAT C6 D7 F8 E8 F15 D16 C16 C17 D18 C18 AB8 AB7 AC7 AD7 AD6 N6 N5 G3 D22 K4 J3 L12 L13 L14 L15 L16 M11 M12 M13 M14 M15 M16 N11 N12 N13 N14 N15 N16 P11 P12 P13 P14 P15 P16 R11 R12 R13 R14 R15 R16 T11 T12 T13 T14 T15 T16 AA24 B2 B3 B24 B25 C2 C25 A1 A2 A3 C1 A24 A25 A26 B26 C26 AD1 AD2 AE1 AE2 AE3 AF1 AF2 AF3 AD25 AD26 AE24 AE11 AE16 B1 B7 B8 B11 B16 B19 B20 R111 BATOK VDDOK PWREN REMAP1_SMPREGN REMAP0_SMDIRN SDRCKN SDRCKP SDRFBCK SDRCKE1 SDRCKE0 SDRCS1N SDRCS0N SDRRASN SDRCASN SDRWRN SDRDQSU SDRDQSL SDRDQMU SDRDQML SDRAD0 SDRAD1 SDRAD2 SDRAD3 SDRAD4 SDRAD5 SDRAD6 SDRAD7 SDRAD8 SDRAD9 SDRAD10 SDRAD11 SDRAD12 SDRAD13 SDRAD14 SDRDQ0 SDRDQ1 SDRDQ2 SDRDQ3 SDRDQ4 SDRDQ5 SDRDQ6 SDRDQ7 SDRDQ8 SDRDQ9 SDRDQ10 SDRDQ11 SDRDQ12 SDRDQ13 SDRDQ14 SDRDQ15 15K D21 D19 E20 E19 F19 VDDOK PWREN SCANEN SCANMOD TSTCLK VDD12 AP_VDD_IO_1.8V VDDIOD GPIO3 GPIO4 GPIO5 GPIO6 GPIO19 GPIO21 GPIO22 GPIO26 GPIO28 GPIO29 GPIO34 GPIO35 GPIO36 GPIO37 GPIO38 GPIO53 GPIO54 GPIO58_SSPTXD GPIO76 GPIO91 GPIO92 R107 N22 D23 L11 C R110 TMS TDO TDI TCK TRSTN TAPSEL R104 R106 R105 47K R307 NA E6 C5 D5 D4 E5 H24 A VDDIOC 3K AP_TMS AP_TDO AP_TDI AP_TCK AP_TRST_N 16 15 R108 VDDIOD AP_VDD_IO_1.8V VDDIOE 14 13 3K PORN MCAM_CLK_OUT B MSPTXD0 MSPTFS0 MSPRXD0 MSPSCK0 MSPTXD2_SMPCE2N MSPTFS2_SMPCE1N MSPTCK2_SMPIORN CLK32K MXTALI MXTALO SXTALI SXTALO PORN CLKOUT0 VDDIOB1 VDDIOB2 VDDIOB3 C21 C22 C19 C20 D20 D17 VDDIOA1 VDDIOA2 VDDIOA3 VDDIOA4 H6 K6 M6 R6 A CPU_19.2M 12 11 AP_VFUSE VDDA VDDQ 0.33u 0.33u 120p VDDNAND VDDDDR VDD12 C3 C4 D3 AC3 AD3 AD4 AC24 AD23 AD24 C23 C24 D24 F21 VDDIOF R100 VDDIOE 10 9 8 DECOUPLING1 DECOUPLING2 DECOUPLING3 DECOUPLING4 DECOUPLING5 DECOUPLING6 DECOUPLING7 DECOUPLING8 DECOUPLING9 DECOUPLING10 DECOUPLING11 DECOUPLING12 DECOUPLING13 VDDIOD VDDIOC 7 C108 C109 VDDIOB 6 1u 120p VDDIOA 5 E3 4 3 GNDA 2 1 C145 0.1u C146 0.1u C147 0.1u C148 0.1u C149 0.1u C150 0.1u VDDIOF AP_VDD_IO_1.8V AP_VDD_IO_1.8V 0.1u C151 X100 AP_VDD_IO_1.8V REQUEST_MC E 4 1 VDD PWREN CSC3M192000EEVRS00 3 OUT 2 TRI_OPEN VCC 5 1 U101 4 2 CPU_19.2M NL17SZ08XV5T2 3 GND GND 19.2MHz C152 NA E C153 0.1u 1 Date Sign & Name Designer MAY 2006 LGE AP_VDD_IO_1.8V 5 U102 VCC 4 REMOTE_PWR_ON Section 0.1u C154 REMOTE_PWR_ON_AP 2 VCC 5 GND NL17SZ08XV5T2 3 AU_CLK_EN 1 4 AU_19.2M LG Electronics Inc. 3 4 4 5 6 7 8 AP CPU & Memory DRAWING NO. 9 LG Electronics Inc. LG(42)-A-5505-10:01 Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 1/7 DRAWING NAME Approved 2 JOY 1.3 Checked NL17SZ08XV5T2 3 GND 1 MODEL U103 2 F Sheet/ Sheets - 191 - LGE Internal Use Only 7. CIRCUIT DIAGRAM 7 9 8 10 CCIRID(3) CCIRID(2) CCIRID(1) CCIRID(0) 6 7 8 9 U200 SLAS4717EPMTR2G 1 C208 10 5 G1 C206 0.1u 10K 0.015u R205 R204 0.1u 0.1u R203 470K 0.1u C209 CCIRIHS_CAM CCIRIVS_CAM CCIRICLK_CAM CAMCLK_27MHZ_CAM MICOUTP 180K MICINN 4 3 2 1 B INOUT_A2 INOUT_B2 INOUT_A1 INOUT_B1 FL201 MICFBP 10 VCC NO2 2 I2CSCL0 NO1 COM2 3 8 COM1 7 IN1 NC2 NC1 GND C207 1u 6 CCIRIHS CCIRIVS CCIRICLK 6 7 8 10 11 12 13 14 15 16 17 EVRC18S03Q015050R 2M_PWDN WM_DVDD WM_AVDD 2 1 INOUT_A2 INOUT_B2 INOUT_A1 INOUT_B1 8 9 C217 HIGH Hi-Z G3 TRI_OPEN GND CCIRIVS_CAM CCIRIHS_CAM R207 100K 27MHz G4 10u 1 2 2M_RSTn_CAM I2CSDA0_CAM I2CSCL0_CAM EVRC18S03Q015050R A B C214 0.01u AXK7L34227 C218 C216 7 C215 INOUT_A3 INOUT_B3 FL202 Driven CSC3R270000BEVRS00 X200 3 4 OUT VDD 2 1 FL203 CCIRID(7) CCIRID(6) CCIRID(5) CCIRID(4) 6 0.1u 3 INOUT_A4 INOUT_B4 0.1u 4 LOW CCIRID(7)_CAM CCIRID(6)_CAM CCIRID(5)_CAM CCIRID(4)_CAM CCIRID(3)_CAM CCIRID(2)_CAM CCIRID(1)_CAM CCIRID(0)_CAM 3 4 EVRC18S03Q015050R INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 G1 0.1u 0.1u C219 10u C CCIRID(7)_CAM CCIRID(6)_CAM CCIRID(5)_CAM CCIRID(4)_CAM 10u C220 C221 0 G1 5 R208 CAMCLK_27MHZ 10 MSM6725 EXT FILTER PLACE CLOSE TO MSM WM_DVDD 0 G2 AP_VDD_IO_1.8V R206 MCAM_27M 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 8 9 I2CSDA0_CAM I2CSCL0_CAM CAMCLK_27MHZ 9 G2 1 2 3 4 5 6 7 CCIRICLK_CAM 2M_RSTn_CAM IN2 4 CAM_PWR_EN CN200 G1 9 5 INOUT_A4 INOUT_B4 INOUT_A3 INOUT_B3 2M_CAMERA I2CSDA0 EVRC18S03Q015050R FB205 HB-1M1005-601JT C202 INOUT_A1 INOUT_B1 C213 10K 0.015u INOUT_A2 INOUT_B2 C212 C203 10u R202 C204 C205 0 INOUT_A4 INOUT_B4 INOUT_A3 INOUT_B3 FL200 0.1u 1 10u 2 FB204 HB-1M1005-601JT 3 AP_VDD_CAM_2.7V AP_VDD_CAM_1.8V C211 4 16 C210 MICOUTN FB206 HB-1M1005-601JT C201 FB207 HB-1M1005-601JT 0.1u C200 10 5 0.1u 180K 15 I2CSCL0_SW G2 G1 CCIRID(3)_CAM CCIRID(2)_CAM CCIRID(1)_CAM CCIRID(0)_CAM MICINP R200 R201 14 I2CSDA0_SW G2 A MICFBN WM_AVDD 13 AP_VDD_IO_2.7V AP_VDD_CAM_2.7V AP_AU_3.3V 12 11 0.1u 6 10u 5 4 5 MAIIN-SLIDER CON-HEADER 9 8 2M_RSTn I2CSDA0_SW I2CSCL0_SW 7 6 C G2 3 10 2 1 CN201 G1 G2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 G1 WM_LOUT1 A9 6 FB233 VGA_STANDBY B9 KPD_DRV_N KEY_ROW(0) KEY_ROW(1) KEY_ROW(2) KEY_ROW(3) KEY_COL(4) KEY_COL(5) KEY_COL(6) KEY_COL(7) WM_ROUT2 GPIO4 C236 4.7u LCD_NRESET WM_LOUT2 E1 F1 MODE_GPIO3 H1 SCLK G1 SDIN F2 CSB_GPIO5 100K R213 100K R214 G3 5 G1 INOUT_A2 INOUT_B1 INOUT_A1 3 2 1 FB227 7 FB229 8 FB231 9 FB232 MSM_UART_RXD_IN INOUT_A4 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1 LCD_DATA(8) LCD_DATA(10) LCD_DATA(12) LCD_DATA(14) 4 3 2 1 FB235 FB236 FB237 FB238 6 FB239 7 FB240 8 FB241 9 INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1 3 2 1 FB244 G4 6 7 INOUT_B4 INOUT_A4 INOUT_B3 INOUT_A3 INOUT_B2 INOUT_A2 INOUT_B1 INOUT_A1 AP_VDD_IO_2.7V VREG_MSMP_2.7V LCD_DATA(7) LCD_DATA(5) LCD_DATA(3) LCD_DATA(1) 4 3 2 1 VT_SW C239 C237 10u E WM_ROUT2 0.068u 10K R230 VIN- 4 VIN+ 3 IN OUT 2 G1 G2 1 GND OUT F C267 WM_LOUT2 0.068u R233 10K SPKL- OUT201 R232 68K C268 NA 7 9 3 4 5 6 7 7 8 9 R224 REMOTE_PWR_ON 470K UFLS TX RX GND CONNECTOR VBATT_SENSE PIN CHECK!! 1% VBATT_SENSE D 11K 1% R228 ICVL0505600V150FR C253 33u CN203 1 5 2 4 3 VA209 INSTPAR 0.01u C259 D201 PSD05-LF EVLC14S02050 VA208 EVLC14S02050 EVLC14S02050 VA207 VA206 47p INSTPAR 47p C256 C255 EVLC14S02050 PSD12-LF D200 EVLC14S02050 VA204 VA205 EVLC18S02003 EVLC18S02003 VA202 RSB6.8CST2R SRC DRAIN GATE CNTRL OUT GND VCC IN 4 VBAT_TEMP C260 0.1u E Section Date Sign & Name Designer MAY 2006 LGE 3 2 Sheet/ Sheets MODEL DRAIN_THERMAL TA OVP Circuit JOY 1.3 2/7 1 NUS3065MUTAG Checked DRAWING NAME Approved AUDIO & 18PIN & CAMERA DRAWING NO. 9 8 LG Electronics Inc. LG(42)-A-5505-10:01 LGE Internal Use Only WM_LOUT1 WM_ROUT1 USB_D+ USB_DEAR_SENSE_N VBATT USB_VBUS_IN UART_TXD UART_RXD LG Electronics Inc. 2 GND HOOK_SENSE +5V_PWR SPEAKER AMP 1 RX VREG_MSMP_2.7V VA203 1u 6 C265 C264 GND PGND SPKL+ VA213 IN- C263 2.2u SPKL- VA212 VO+ 5 22p 4 IN+ 8 TX CAD for EMC Noise Between (VBATT & +5V_PWR) and (Mic signal) 5 22p C266 0.22u VO- BYPASS NC1 U207 OUT200 EVLC18S02015 3 E ON_SW ON_SW U203 NCS2200SQ2T2G 4 NFM21PC105B1A3 06.02.22 spk connect to contact type SPK PAD size 2 by2 SPKL+ TPA6205A1DRBR 6 _SHUTDOWN VDD EVLC18S02015 100K R231 2 UTXD URXD PWR VBAT 5 VCC NA 68K AP_+VPWR 1 VBAT 47n 1 3 20 22 U208 SPK_AMP_EN NC2 WM_MIC2N WM_MIC2P 33u C261 NA R229 NC3 2.5G 3G UT200 680K R225 RSB6.8CST2R 1u C252 39p 1u U205 VA211 C251 39p 68 1608 10p D C262 DSR NC4 C 33u C244 FB245 VA210 2.2K R221 WM_MIC1N C248 MSPTFS0 6 1u C247 10p smd_1608h_9_r GND MSPRXD0 C246 39p SUMY0009203 C240 1u 68 R223 C254 NC1 5 MSPTCK0 1 2 4 C250 NC2 C245 VT_SW 5 R222 C242 33p NLAS4157DFT2G 7 IN1 6 1000 C258 A IN2 4 RTS R218 330K C241 FB503 C257 B0 S VCC 2.2K GND R227 WM_MSPRXD0 B1 VA200 EVLC18S02015 COM1 3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 WM_MIC1P MIC200 0.1u 2 MSPRFS0 8 3 1 WM_DACDAT WM_LRC 9 R219 21 19 VA201 EVLC18S02015 0.1u C243 AU_SW TP205 MSPRCK0 COM2 CTS C238 0.1u R216 1M R217 2.2K AP_VDD_IO_1.8V U204 10 NO2 NO1 12 11 10 9 8 7 6 5 4 3 2 1 MSM_UART_TXD MSM_UART_RXD_IN EVRC14S03Q030100R FL207 FB242 FB243 10p WM_MICBIAS VCC TP204 USB_D+ USB_DUSB_VBUS VBATT KEY_ON_SW_N LCD_DATA(15) LCD_DATA(13) LCD_DATA(11) LCD_DATA(9) 4 EVRC14S03Q030100R FL208 WM_DVDD 2 TP203 REMOTE_PWR_ON EVRC14S03Q030100R FL205 8 WM_DVDD 1 TP202 MSM_UART_TXD INOUT_B4 INOUT_B3 FB234 100K WM_BCLK MSM_UART_RXD_IN D CN202 U206 SLAS4717EPMTR2G 5 LCD_DATA(6) LCD_DATA(4) LCD_DATA(2) LCD_DATA(0) 4 2 C MSM_UART_RXD 4 F PM_SCL PM_SDA MSPTCK0 MSPTFS0 MSPTXD0 WM_MSPRXD0 WM_LRC WM_DACDAT WM_ADCDAT WM_BCLK AU_SW SPK_AMP_EN WM_DVDD 10 6 100K R215 WM_AVDD G2 FB225 9 AU_19.2M INOUT_A3 INOUT_B2 NC GND COM EVRC14S03Q030100R FL204 AXK7L70227 F INOUT_A4 INOUT_B3 R226 J4 BCLK H4 LRC H5 DACDAT J5 ADCDAT ROUT2 FB230 INOUT_B4 IN C249 C235 4.7u J3 VXFS J1 VXDIN J2 VXDOUT H3 VXCLK A4 A5 C234 4.7u G8 GP1_CLK1 J9 GP2_CLK2 J8 PCMCLK MICBIAS FB223 FB224 7 10 5 LOUT2 WLED_CTL 8 9 0 4 9 8 NA 3 EVRC18S03Q015050R INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 7 FB222 3 R716 WM_ROUT1 2 AP_+VPWR R717 FL206 1 LCD_VS DIS_CSN DIS_RS DIS_WEN 6 CAMCLK_27MHZ_CAM 1 100K 5 MOT_PWR- WM_MONO1 AP_VDD_LCD_2.8V 10 39p C233 WM_MONO2 G2 D9 NA C230 39p 1u C231 B6 C232 C229 MIC2 AGND B4 WM_MICBIAS MIC2N AVDD D1 WM_MIC2P VMID WM_MIC2N E B7 1u 0 MIC1 VREF E2 MONO2 MONO1 ROUT1 J6 MCLK G9 PVDD H9 PGND C1 WM_MIC1P U202 WM8753LEB-RV MIC1N B5 D2 WM_MIC1N ACOP A6 1u C228 B3 ACIN 0 RECEIVER+ RECEIVERRECEIVER-- RECEIVERA3 R719 CCIRICLK R212 U201 DG2011DX-T1-E3 2 6 V+ NO R210 G1 C227 10p D8 VREG_MSMP_2.7V G2 LOUT1 RXN +VPWR CCIRIVS CCIRID(7) CCIRID(6) CCIRID(5) CCIRID(4) CCIRID(3) CCIRID(2) CCIRID(1) CCIRID(0) 5 A8 C9 H6 J7 F9 HPVDD 0 RXP 0 0 0 0 0 0 0 0 0 10 C2 RECEIVER+ R720 R721 R722 R723 R724 R725 R726 R727 R728 G1 B1 R211 E8 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 G2 1u 1u 0 FB221 5 C225 C226 OUT3 E9 R718 CCIRIHS VGA_RSTn I2CSDA0_CAM I2CSCL0_CAM 10 WM_RXN OUT4 AP_VDD_CAM_1.8V G1 WM_RXP D LINE2 RECEIVER-NA C223 NA G2 A1 SPKRVDD 1u HP_SPKRGND C224 WM_HPH_L LINE1 A7 NC1 C8 NC2 F8 NC3 G2 NC4 A2 DBVDD 1u DGND C222 WM_HPH_R DCVDD H7 AP_VDD_CAM_2.7V R209 - 192 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 7. CIRCUIT DIAGRAM 1 2 3 4 6 5 8 10 9 11 12 14 13 15 16 AP_VDD_IO_1.8V VREG_MSMP_2.7V AP_VDD_IO_1.8V 7 AP_VCORE AP_+VPWR AP_+VPWR A AP_VDD_IO_2.7V AP_+VPWR AP_VDD_CAM_2.7V AP_+VPWR A AP_VDD_CAM_1.8V AP_+VPWR AP_VDD_IO_1.8V C802 0.1u 0.1u C301 TP300 L300 4.7uH TP301 A1 3 8 COM1 IT_WAKE_UP IN2 4 MSM_RESIN_N L301 4.7uH PON C302 1u 7 IN1 NC2 6 GND NLAS5223BMNR2G U300 U301 AP_VDD_IO_1.8V PM_SCL PM_SDA B2 GND A1 ST1G3234BJR R304 NA J7 K8 J8 K7 H8 G9 H9 USBVP USBOEN USBVM USBRCV USBSCL USBSDA NL17SZ32XV5T2 1 U312 MCCLK MCFBCLK MCCMDDIR MCCMD MCDAT0DIR MCDAT0 MCDAT31DIR MCDAT1 MCDAT3 MCDAT2DIR MCDAT2 4 4 2 TP305 G2 H5 G3 H1 K2 K1 H4 H3 H2 K9 J1 C9 VMINUS_VCORE1 B10 VMINUS_VCORE2 A10 VCORE D9 VBAT_VCORE1 D10 VBAT_VCORE2 D8 VLX_VCORE1 C10 VLX_VCORE2 U310 STW4810AHDT_LF U307 AP_VPLL 1 2 3 AU_PWR_EN AP_VFUSE C319 C324 ID VBAT_MMC VMMC BH33FB1WHFV 5 6 4 STBY NC GND BGND VIN VOUT 1u 1u C328 C329 1u 1u 0.47u C327 U306 R1114N281D-TR-F 1 5 VDD VOUT 2 GND 4 3 NC CE LCD_PWR_EN C322 1u DATAOUT3 DATAOUT2 DATAOUT1 DATAOUT0 CMDOUT B1 B7 B8 C5 F8 G8 K10 C323 NA VUSB_3.1V USB_VBUS TP304 E8 R305 C330 C331 1u 4.7u D 22 AP_USB_D+ AP_USB_D- R306 22 J4 K5 F3 LATCHCLK G1 CLKOUT MCCLK MCFBCLK MCCMDDIR MCCMD MCDAT0DIR MCDATA0 MCDATA31DIR MCDATA1 MCDATA3 MCDAT2DIR MCDATA2 C C320 33u C321 2.2u C325 1u E9 DP E10 DN 3 GND C335 NA 0.1u F10 VUSB G10 VBUS USBVP USBOEN USBVM USBRCV USBINTN USBSCL USBSDA 2 3 GND A9 F9 VBAT_USB J9 VMINUS_USB H10 CP J10 CN NC1 NC2 NC3 NC4 NC5 NC6 NC7 PORN VCC 5 NL17SZ08XV5T2 1 VREF_18 C318 A7 B6 VBAT_VAUX A6 VAUX J6 SCL H7 SDA USBINTN AP_VDD_IO_1.8V VFUSE +VPWR AP_+VPWR C332 2.2u F1 E3 E2 E1 F2 J5 GPO1 K6 GPO2 B9 GND1 D3 GND2 C3 A3 VCCB VCCA SW_RESET C7 VBAT_VPLL_FUSE A8 VPLL H6 PWREN J2 VDDOK J3 PORN K3 CLK32K K4 SW_RESET TP302 TP303 AU_CLK_EN VCC 5 AP_VDD_LCD_2.8V AP_AU_3.3V AP_+VPWR C2 IT_WAKE_UP B2 REQUEST_MC C1 TCXO_EN PWREN VDDOK 0.1u C326 C6 VBAT_ANA B5 VMINUS_ANA A4 B4 C4 A3 B3 A2 A5 C8 PON A1 CLK32K_IN D2 MASTER_CLK 47K U308 D1 VBAT_DIG C3 VMINUS_DIG VBAT_VIO_VMEM1 VBAT_VIO_VMEM2 VLX_VIO_VMEM1 VLX_VIO_VMEM2 VMINUS_VIO_VMEM1 VMINUS_VIO_VMEM2 VIO_VMEM R303 IT_WAKE_UP REQUEST_MC U311 C307 2.2u C314 22u C313 4.7u AP_+VPWR CLK32K A1 C306 470p C305 1u C309 2.2u C308 1u B C311 22u C310 4.7u AP_VDD_IO_2.7V B1 MIC5219-2.7YM5 1 5 IN OUT 2 GND 3 4 EN BYP NC1 C317 0.1u AU_PWR_EN U303 BH18LB1WHFV 5 6 4 STBY NC GND BGND VIN VOUT CAM_PWR_EN C304 2.2u C303 470p PON C1 1 2 3 CAM_PWR_EN 5 ST1G3234BJR C312 A1 B2 IT_WAKE_UP_AP COM2 0 MIC5219-2.7YM5 1 5 IN OUT 2 GND 3 4 EN BYP NO2 9 NO1 GND B1 R729 100K 10 VCC 2 4.7u C1 SLEEP_CLK R300 U302 1 U304 VCCB VCCA A3 C3 0.1u C300 R308 E 0 VMMC_3.1V smd_1608h_5_r C334 1u SD_DAT(1) SD_DAT(0) SD_CLK SD_CMD SD_DAT(3) SD_DAT(2) C336 NA VMMC_3.1V 51K S300 GCC110-8S-R-E1000 R314 R312 R313 NA 51K 51K R311 R309 R310 51K 51K F GND SWB SWA SD_DAT(1) SD_DAT(0) 8 7 6 5 4 3 2 1 SD_CLK SD_CMD SD_DAT(3) SD_DAT(2) VREG_USIM_2.85V AP_VDD_IO_1.8V 4 PLR0504F 6 5 3 2 1 1 D301 6 PLR0504F 5 4 D300 3 C339 1u VA300 EVLC18S02015 56nH USIM_P_DATA L302 C342 0.1u EVL5M02200 VA303 12p EVLC18S02015 VA302 MCAM_27M B2 4.7K R315 4 GND 5 VPP 6 I_O C340 A1 C341 A1 EVLC18S02015 VA301 VCCB B1 J300 1 VCC 2 RST 3 CLK USIM_P_RST_N USIM_P_CLK GND C1 VCCA A3 MCAM_CLK_OUT U313 ST1G3234BJR 12p 0.1u C338 C3 0.1u C337 C GND 2 AP_VDD_IO_2.7V D SD_INT C343 NA USIM Connector E Section Date Sign & Name Designer MAY 2006 LGE Sheet/ Sheets MODEL JOY 1.3 3/7 Checked DRAWING NAME Approved LG Electronics Inc. 1 2 3 4 5 6 7 8 AP POWER & T-Flash CON DRAWING NO. 9 LG Electronics Inc. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 193 - LGE Internal Use Only 7. CIRCUIT DIAGRAM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 AP_VDD_BT_2.7V AP_VDD_BT_2.7V AP_VDD_IO_2.7V PON C402 1u SW408 RSB6.8CST2R KEY_ROW(1) D5 E6 G6 F7 LD400 KEY_ROW(2) SW410 1 2 3 4 SW411 SSC-TWH104-HLS LD402 LD403 KEY_COL(0) KEY_COL(1) KEY_COL(2) RSB6.8CST2R RSB6.8CST2R KEY_ROW(3) R405 100ohm LD404 AP_VDD_BT_2.7V R406 100ohm 0 LD405 R408 100ohm AP_VDD_IO_1.8V A6 B5 SSC-TWH104-HLS LD406 LD407 G2 G5 R412 100ohm F3 SSC-TWH104-HLS SSC-TWH104-HLS E7 UART_RXD UART_CTS UART_TXD UART_RTS A7 G1 B7 C7 D7 A1 U402 1 2 ZD1 RSB6.8CST2R R414 R415 B GPIO_11 GPIO_0 CLK_REQ_IN_1 CLK_REQ_IN_2 HOST_WAKEUP A2 VSS_RF1 A5 VSS_RF2 DEA212450BT-7043C1 FL400 RFP RFN CONFIG_1 CONFIG_3 CONFIG_2 TOUT_IP_QN TOUT_IN_QP 3 A3212EEH-T 6 VDD 5 NC2 4 GND2 7 PGND OUTPUT NC1 GND1 NC1 NC2 C VDD_IO_A VDD_IO_B VDD_CLD VSS_ANA1 VSS_ANA2 VSS_ANA3 VDD_HV_A B4 B6 C6 D VDD_HV_D E5 220n 0.1u 0.1u C409 0.1u 220n C408 AF_PRG C410 C411 C412 220n 220n C406 VDD_DSM VDD_N VDD_CL VDD_RF C414 0.1u E UART SWITCH AP_VDD_IO_2.7V R450 NA C2 C1 C6 B7 F5 G6 F6 G7 NC5 NC6 NC7 NC8 NC1 NC2 NC3 NC4 Wake_INP5 Wake_INP4 Wake_INP1 Wake_INP0 Wake_INP3 Wake_INP2 SCL_AB SDA_AB A7 B6 C7 D7 D6 E7 E6 F7 K_Out3 K_Out2 K_Out1 K_Out0 _RESET Int_Rx WD_Out Int_Tx G5 G4 F4 G3 F3 G2 G1 F2 C418 C419 0.1u 0.1u R451 NA U403 1 A0 2 0B0 UART_TXD UTXD2 KEY_COL(3) KEY_COL(2) KEY_COL(1) KEY_COL(0) U405 KEYCODER_RSTN TP406 R417 100K R416 100K KEY_COL(3:0) E1 E2 KEYCODER_INT C416 TP407 D1 0.1u WM_ADCDAT C3 C4 C5 D3 D4 D5 E3 E4 E5 GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 Gen_In1 Gen_In0 CLK_In Gen_IO_0 Gen_IO_1 PWM VCC1 VCC2 C 68K BP_DC FEED 0 2 EUSY0200301 D2 WM_DACDAT R419 BP2 ANT400 R404 1 VDD_D FOLDER_SENSE B2 A1 B1 D2 D1 F1 E1 E2 U_BP BP1 E3 VSS_DIG1 E4 VSS_DIG2 I2CSCL1 I2CSDA1 U404 LM8333GGR8_NOPB C1 WM_LRC C2 WM_BCLK FOLDER_DETECT 5 4 AP_VDD_IO_2.7V Wake_INP6 Wake_INP7 K_Out4 K_Out5 K_Out6 K_Out7 Gen_IO_2 Gen_IO_3 A3 A4 CLK_REQ_OUT2 AP_VDD_IO_1.8V A6 B5 A5 B4 A4 A3 B3 A2 B2 B1 B2 A1 AP_VDD_IO_2.7V A3 ST2378EBJR VL VCC IOVL1 IOVCC1 IOVL2 IOVCC2 IOVL3 IOVCC3 IOVL4 IOVCC4 IOVL5 IOVCC5 IOVL6 IOVCC6 IOVL7 IOVCC7 IOVL8 IOVCC8 GND OE 4 A1 5 1B0 3 GND1 6 GND2 UART_RXD URXD2 E4 E3 D4 MSM_UART_RXD C415 0.1u 0.1u PCMDATAOUT D3 MSM_UART_TXD UART_SW 8 1B1 7 S1 NLAS3158MNR2G C417 F 12 VCC2 9 VCC1 11 0B1 10 S0 100K KEY_ROW(1) KEY_ROW(0) KEY_ROW(3) KEY_ROW(2) 3.3K 3.3K KEY_COL(4) KEY_COL(5) KEY_COL(6) KEY_COL(7) URXD0 UCTS0N R418 KEY_ROW(0:3) C413 1u C407 100K FOLDER_DETECT E 220n 0.1u AP_VDD_IO_2.7V R413 KEY_COL(4:7) F6 F4 EVL14K02200 AP_VDD_IO_2.7V F C4 PCM_CLK PCM_SYNC PCM_A PCM_B R715 VA400 C404 EVLC14S02050 EVLC14S02050 VA406 VA407 0 C405 EVLC14S02050 VA405 D405 EVLC14S02050 VA404 D403 EVLC14S02050 EVLC14S02050 VA403 EVLC14S02050 VA402 VA401 KPD_DRV_N D CLK_REQ_OUT_1 BT_WAKEUP R409 100ohm SSC-TWH104-HLS R411 100ohm E2 F2 F1 G7 SSC-TWH104-HLS SSC-TWH104-HLS RSB6.8CST2R KEY_ON_SW_N KEY_COL(3) KEY_ROW(2) R401 R403 100ohm 0 SW409 LD401 R402 100ohm SSC-TWH104-HLS CN401 D404 C STLC2500C RESET_N REF_CLK_IN LP_CLK B3 GPIO_16 C3 GPIO_8 B1 GPIO_9 C1 GPIO_10 R410 SW407 D1 C2 D2 E1 0 SW406 R400 SW405 D401 D400 SW404 C5 F5 G4 UTXD0 URTS0N AP_+VPWR KEY_ROW(0) SW403 C400 33u PCMCLK PCMSYNC PCMDATAIN PCMDATAOUT SW402 SW401 D3 D6 G3 D402 SW400 C403 470p 2 3 4 RSB6.8CST2R 1 3 5 7 B RSB6.8CST2R 1 TP400 X400 CSC3M192000EEVRS00 BT_RESETN 3 VDD OUT 2 TRI_OPEN GND CLK32K 19.2MHz C401 0.1u 4 1 6 3 RA400 100K 2 4 6 8 CN400 KEY_ROW(0) KEY_COL(3) KEY_ROW(1) A U401 U400 MIC5219-2.7YM5 1 5 IN OUT 2 GND 3 4 EN BYP G2 G1 A 0 R714 AP_+VPWR PCMDATAIN C4 PCMSYNC C3 C PCMCLK B4 JTAG-JIG-FPCB-CON B3 A4 VREG_MSMP_2.7V A2 LEVEL_SHIFT_EN CN402 G1 D 1 2 3 4 5 6 7 8 9 10 AP_VDD_IO_2.7V JTAG_PS_HOLD MSM_RESIN_N MSM_TDO MSM_RTCK MSM_TCK MSM_TMS MSM_TDI MSM_TRST_N AP_VDD_IO_1.8V 0.1u C420 VUSB_3.1V 9 NO1 AP_USB_D- NC2 5 PM_SCL E2 PM_SDA D1 0.1u IN2 7 IN1 AP_USB_D+ C422 8 COM1 4 USB_SW E1 USB_D- COM2 3 USB_D+ U407 MSM_USB_D- NO2 2 MSM_USB_D+ E C421 10 VCC 2M_PWDN_AP D2 2M_RSTN_AP C1 6 NC1 GND C2 VGA_STANDBY_AP TP420 B1 B2 A1 A3 F ST2378EBJR VL VCC IOVL1 IOVCC1 IOVL2 IOVCC2 IOVL3 IOVCC3 IOVL4 IOVCC4 IOVL5 IOVCC5 IOVL6 IOVCC6 IOVL7 IOVCC7 IOVL8 IOVCC8 OE GND USB SWITCH E4 R420 1K R421 1K 0.1u E3 I2CSCL0 D4 I2CSDA0 E 2M_PWDN D3 C4 TP419 Section Date Sign & Name Designer MAY 2006 LGE VGA_STANDBY B4 B3 2 3 4 5 6 7 JOY 1.3 4/7 TP421 LEVEL_SHIFT_EN DRAWING NAME Approved BT & KEYCODER USB SW & LEVEL SHIFTER DRAWING NO. 9 8 LG Electronics Inc. LG(42)-A-5505-10:01 LGE Internal Use Only MODEL Checked A4 A2 Sheet/ Sheets 2M_RSTN C3 LG Electronics Inc. 1 D AP_TDO AP_RTCK AP_TCK AP_TMS AP_TDI AP_TRST_N G2 U406 SLAS4717EPMTR2G 1 20 19 18 17 16 15 14 13 12 11 - 194 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 7. CIRCUIT DIAGRAM 2 7 6 9 8 10 11 12 ESHS-L090UB C502 NA 7 9 11 13 18 20 L504 56nH ANT501 A GND1 C510 47p EGSM_RX2 GND3 DCS_RX1 DCS_RX2 GND5 PCS_RX1 GND6 PCS_RX2 VC1 DCS_PCS_TX VC2 EGSM_TX VC3 UMTS_TX_RX C511 47p L507 5.1nH L510 C508 L512 2.2uH TX_Q_P C516 33p 28 27 26 25 24 23 22 21 20 19 18 17 16 15 HIGH HIGH LOW GSM_PA_RAMP R506 C536 68p C535 330p 2.2K (1%) R510 100 C537 120p C539 5.6n ECHU1C562JX5 (1%) L524 1.5nH C541 R513 UMTS800_OUT LOW HIGH LOW 0 (1%) 82p 14 13 12 11 10 9 8 7 6 5 4 3 2 1 C523 100p L518 47nH C524 0.1uF C518 4.7u B RX0_I_M RX0_I_P RX0_Q_M RX0_Q_P R504 L521 0 47nH R505 VREG_RFTX_2.85V RTR6250_TCXO 0 R509 3.3K (1%) C532 33p C534 0.1uF C533 33p C538 3.9n ECHU1C392JX5 C540 0.01u 55 LOW LOW R507 100 (1%) R508 RTR6250D U500 RX_IN RX_IP RX_QN RX_QP VDDA4 VCO_TUNE VTUNE_REF VDDA3 TCXO VDDA2 VDDA1 FAQ1 CP1 CP_HOLD1 VDDA17 56 GND_SLUG 57 29 30 31 32 33 34 35 36 37 38 39 40 41 42 11.3K (1%) R503 C522 33p FAQ2 VDDA8 VDDA7 GSM1900_INP GSM1900_INN VDDA6 GSM850_INP GSM850_INN DAC_REF TX_IN TX_IP TX_QN TX_QP VDDA5 CP2_OUT UHF_LO_BUFF CP_HOLD2 CP2 VDDA9 RX_VCO_IN R_BIAS GSM1800_INN GSM1800_INP VDDA10 GSM900_INP GSM900_INN VDDA11 TX_MOD_CP VDDA12 TX_VCO_FB VDD_M SBCK SBDT SBST RF_ON_TX_ON VDDA13 VCONTROL VDDA14 UMTS2100_OUT VDDA15 UMTS1900_OUT VDDA16 C527 1000p C526 6.8n ECHU1C682JX5 L522 18nH L523 22nH 0 HIGH PCS RX L515 47nH VREG_SYNTH_2.85V C525 0.01u L519 9.1nH C531 33p R511 GSM900 TX DCS/PCS TX R500 10 C517 0.1uF R501 4.3K (change to 4.53k) 4.7K R502 C521 680p L517 9.1nH C529 NA ANTENNA SWITCH MODULE LOGIC A C505 47p VREG_RFTX_2.85V C515 33p L516 10nH IN_C TX_I_P TX_Q_M L509 2.2uH 33p FB500 C514 1000p L511 7.5nH L513 5.1nH L520 10nH IN_B C504 1000p 7.5nH C530 33p C503 47p L506 2.2uH WCDMA_2100 C513 NA C512 NA (1%) IN_A 16 TX_I_M L503 2.2uH L505 3.6nH L508 7.5nH C507 1.5nH C520 0.1u C528 NA C 15 14 L501 3.6nH 3.3nH 8 10 19 VREG_RFR_2.85V B 13 43 44 45 46 47 48 49 50 51 52 53 54 L514 L500 3.3nH 1 2 3 4 5 6 16 C509 47p FL500 EGSM_RX1 GND2 GND4 17 15 14 ANT_SEL0 ANT_SEL1 ANT_SEL2 C519 47p 12 DAC_REF 56p C506 L502 1p 5 C501 56p ANT ANT500 4 3 SW500 KMS-512 G2RF ANT G1 C500 0 VDD 1 R512 6.2K C542 390p (1%) VBATT 0 LOW HIGH LOW LOW LOW 12 10 11 D DCS_PCS_IN GND5 BS U501 TQM7M5003 VCC GND4 GND3 GSM_OUT 8 9 GND6 DCS_PCS_OUT LOW 17 GND2 GND7 DCS RX GSM 900 RX TX_ON GND8 LOW 16 LOW 14 LOW 13 UMTS 2100 TX_EN 1 C544 100p 2 3 GSM_PA_EN MQW5V0C869M 10 VC R516 5 GND1 15 R518 15 6 VRAMP 8 GND5 12 GND6 13 GND7 14 GND8 R523 R522 7 GSM_IN 270 270 15 VB R520 R521 220 220 VREG_RFTX_2.85V C549 33p 3 C550 100p C551 0.1uF VREG_RFTX_2.85V R517 C553 4.7u tcc_1608h_9_r C556 C554 33p C557 15p C552 4700p C548 4.7u D 100ohm R519 2 GND1 4 GND2 6 GND3 7 GND4 1K C547 100p FB502 U502 1 9 OUT_GSM SW1 5 11 OUT_DCSPCS SW2 R515 FB501 C546 1000p C545 0.01u 4 VBATT WCDMA_2100_TX_OUT TX_AGC_ADJ R514 100ohm VREG_MSMP_2.7V C543 22u GSM_PA_BAND GSM_TX_VCO_0_EN_N GSM_TX_VCO_1_EN_N 100ohm TX VCO CONTROL LOGIC SW2 RF_SBST RF_SBDT RF_SBCK SW1 15p GSM850/900 C555 0.1uF R524 51 GSM/EDGE HIGH LOW DCS1800/PCS1900 LOW HIGH NO OSCILLATION HIGH HIGH E E UMC4N Q500 TCXO VREG_RFTX_2.85V C558 0.01u PA_ON 2 C561 22p WCDMA_2100_TX_OUT 100p 1000p C563 1000p 4 OUT GND R525 100ohm 2 VCCVCONT TRK_LO_ADJ 1 X500 RFR6250_TCXO L526 3.9nH Thermistor Circuit 19.2MHz 3 RTR6250_TCXO 5 2 L525 8.2nH C559 C562 TCXO_PM 1 U503 EFCH1950TDC1 3 1 4 G3 OUTIN G2G1 1.8nH 5 C560 3 4 WCDMA C564 0.01u R526 80.6K PA_THERM VREG_RFTX_2.85V VREG_TCXO_2.85V (1%) R528 C566 0.1uF F C567 1000p C565 0.068u 470K R527 F (1%) 68K R529 6.2K W_VMODE_N C569 15p +VPWR C568 22u C570 0.01u RFIN COMM C571 0.01u HDET1 VOPS VRMS ADL5500 U504 WCDMA_2100 C573 0.1u R530 3.9nH C C575 1.8nH 6 7 8 9 10 11 TX VREF VMODE GND1 RFIN VCC1 5 4 3 2 1 IMT_RX_P U505 50OHM VREG_TCXO_2.85V C585 100p PGND RFR6250E U508 GLNA_BIAS (1%) GLNA_IN R_BIAS VDDA8 SBST SBDT SBCK VDDM GRX_IP GRX_IM GRX_QP UMTS_TUNE VDDA3 VDDA4 LO_OUT CP_DUMP CP_OUT FAQ VDDA5 TCXO VDDA6 GPS_TUNE VDDA7 C591 C588 4.7u 100p GLNA_OUT 12 11 10 9 8 7 6 5 4 3 2 1 13 PLNA_OUT 14 ILNA_OUT 15 PLNA_BIAS 16 PLNA_IN 17 ILNA_BIAS 18 ILNA_IN 19 VDDRF3 20 RX_IP 21 RX_IM 22 RX_QP 23 RX_QM 24 VDDA2 L532 100nH L533 2.7nH C587 680p C586 1.2p GRX_QM 49 48 47 46 45 44 43 42 41 40 39 38 37 C595 10p 4 D L531 2.7nH R532 11.3K RF_SBST RF_SBDT RF_SBCK R533 E VREG_MSMP_2.7V C589 10p C590 1u 51 R534 C592 100p C593 4.7u Section Date Sign & Name Designer MAY 2006 LGE Sheet/ Sheets 10 MODEL JOY 1.3 5/7 10 RFR6250_TCXO C596 4.7p R535 RX0_Q_M Checked UHF_LO_BUFF DRAWING NAME CP2_OUT C597 100p F C598 0.1u L529 33nH IMT_RX_M VREG_RFR_2.85V C594 0.1u 5 L530 2.2nH C583 0.1u 25 26 27 28 29 30 31 32 33 34 35 36 E VDDRF2 PMIXP PMIXM IMIXP IMIXM VDDA1 GMIXP GMIXM GND VDDRF1 BLANK ILNA_OUT C582 100p L528 2.7nH 3 G1 O1 IN G2 O2 C584 33p C580 51 R531 C581 12p 1 ILNA_OUT 4 COUP 3 FL501 B7827 2 47 D C IMT_RX_P IMT_RX_M C579 0.1u 2 1 AWT6277R OUT IN 1.2p L527 GND2 GND3 RFOUT GND4 VCC2 GND5 C577 33p U506 G7 G6 G5 G4 G3 G2 G1 RX ANT ACMD-7601 8.2p C578 C C572 1500p C574 100p RX0_Q_P RX0_I_M C599 100p C800 100p Approved RF RX0_I_P LG Electronics Inc. 1 2 3 4 5 6 7 8 9 LG Electronics Inc. LG(42)-A-5505-10:01 Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes DRAWING NO. - 195 - LGE Internal Use Only 7. CIRCUIT DIAGRAM 1 2 3 6 5 4 USB 48M CLK 7 8 9 10 11 12 13 14 15 16 WDOG_EN (1:Enable , 0:Disable) MODE Default Pull-up HKADC(5):PCB_Rev_ADC ADC USB_XTALIN R600 BOOT_MODE X 0 1 0 1 1 NOR boot 8-bit, NAND boot 16-bit, NAND boot 150K : 300K : 1.73V smd_2125h1_45_r smd_2125h1_45_r AA20 C615 0.1uF C616 0.01u C617 0.01u C603 10u C604 0.1uF C605 0.1uF C618 0.1uF C619 0.1uF C620 0.1uF M25 M26 AE3 C621 C622 C623 1000p 1000p 1000p AD2 C624 0.01u C625 0.01u C626 0.01u C628 0.1uF C627 0.01u C629 0.1uF 2200p cap => place between D12(VDDA1) and F12(DAC_REF) H25 2200p C630 F26 H11 D5 DAC_REF J21 TP602 A6 N19 W15 PWR_BTN USB_PWR_EN C631 C632 C633 C634 1000p 1000p 1000p 1000p HCSN_ETMCLK_XTICLK AA15 AE13 C636 C637 1000p 1000p C635 0.01u C639 0.1uF C638 1000p C640 0.1uF C641 0.1uF D FOLDER_DETECT H9 Near to B18 (VDD_PLL) VREG_MSMA_2.6V B6 F8 R606 AA1 Y6 0 EAR_SENSE_N L25 H6 C642 0.1u W23 AF6 AF11 V23 VREG_MSMP_2.7V AF15 W25 H10 F10 D9 AF17 AA16 AE24 AE23 AA26 U26 Y26 U25 D12 B21 B18 A3 P23 VDDA2 VDDA3 VDDA4 VDDA5 VDDA6 VDDA7 VDDA8 VDDA9 VDDA10 VDDA1 (VDD_DAC_REF) VDD_PLL VDD_MDDI B9 B15 R25 AE15 AE11 AE6 U2 R2 M2 K2 F2 B5 B11 B14 B24 D25 G25 T25 AE8 AC2 K25 VDD_PAD3_0 VDD_PAD3_1 VDD_PAD3_2 VDD_PAD3_3 W8 T16 T11 R16 R15 R14 R13 P13 C26 VSS40 VSS41 VSS42 VSS43 VSS44 VSS45 VSS46 VSS47 VSS48 VSS49 VSS50 VSS51 C1 H1 W1 AC1 AF8 AF16 T26 G26 D26 A24 A14 F A11 A5 AA6 AA21 AC4 AC23 AE1 AE2 AE25 AE26 AF1 AF2 AF25 AF26 C W19 D11 P12 T19 A1 ANT_SEL2 ANT_SEL1 ANT_SEL0 GSM_TX_VCO_0_EN_N GSM_TX_VCO_1_EN_N T23 N15 B4 N14 AF24 TX_ON N13 H12 N12 AF23 M15 J8 M14 AD25 M13 AC26 M12 G4 AC16 M11 N21 W26 AB26 w18 (Analog VSS guard ring for CODEC) L16 R610 K19 V26 W18 51K H16 U19 W16 L11 A17 K10 D15 H19 F15 H8 MSM_TRST_N MSM_TCK MSM_TMS MSM_TDI MSM_TDO MSM_RTCK D16 F21 P26 D23 D13 VSSA1 VSSA2 VSSA3 VSSA4 VSSA5 VSSA6 VSSA7 VSSA8 VSSA9 VSSA10 VSSA11 VSSA12 VSSA13 VSSA14 VSSA15 VSSA16 D4 A21 B26 100K (WCMDA PAM MODE) W_VMODE_N A18 D19 H15 VSS_DIG_0 VSS_DIG_1 VSS_DIG_2 VSS_DIG_3 VSS_DIG_4 VSS_DIG_5 VSS_DIG_6 VSS_DIG_7 VSS_DIG_8 VSS_DIG_9 VSS_DIG_10 VSS_DIG_11 VSS_DIG_12 U600-2 MSM6275_B B25 AB25 AC25 VSS_PAD3_0 B17 VSS_PAD3_1 A15 VSS_PAD3_2 A9 VSS_PAD3_3 B2 Y25 E RESERVED R26 RX0_Q_M RX0_Q_P RX0_I_M RX0_I_P C643 0.01u 10% (PLLOUT_TEST) VSS_PAD2_0 VSS_PAD2_1 VSS_PAD2_2 B1 V25 AA25 W2 VSS_PAD1_0 VSS_PAD1_1 VSS_PAD1_2 R1 VSS_PAD1_3 U1 VSS_PAD1_4 VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSS9 VSS10 VSS11 VSS12 VSS13 VSS14 VSS15 VSS16 VSS17 VSS18 VSS19 VSS20 VSS21 VSS22 VSS23 VSS24 VSS25 VSS26 VSS27 VSS28 VSS29 VSS30 VSS31 VSS32 VSS33 VSS34 VSS35 VSS36 VSS37 VSS38 VSS39 B13 F12 F1 K1 M1 A2 A13 A25 B12 A26 A12 C645 33nF VDD_PAD2_0 VDD_PAD2_1 VDD_PAD2_2 TX_AGC_ADJ TRK_LO_ADJ C644 0.01u VDD_PAD1_0 VDD_PAD1_1 VDD_PAD1_2 VDD_PAD1_3 VDD_PAD1_4 R607 R608 VDD_DIG_0 VDD_DIG_1 VDD_DIG_2 VDD_DIG_3 VDD_DIG_4 VDD_DIG_5 VDD_DIG_6 VDD_DIG_7 VDD_DIG_8 VDD_DIG_9 VDD_DIG_10 VDD_DIG_11 VDD_DIG_12 C2 1K 2K TCXO_EN PA_ON (WCMDA 2100PAM Enable) TX_Q_M TX_Q_P TX_I_M TX_I_P DAC_REF H2 Near to MSM H18 AE16 F18 R609 AE20 AF20 AF22 AF21 AE19 AF19 AC20 MICOUTN MICOUTP MICFBN MICFBP MICINN MICINP AC19 AC21 AA19 AC22 AA18 T15 AF18 AE18 AA17 W17 AC17 AB23 Y21 V19 AC18 AUXON_AUXOR AUXOP_AUXOL HPH_R HPH_L EAR1ON EAR1OP MICBIAS MICOUTN MICOUTP MICFBN MICFBP MICINN MICINP AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P CCOMP W21 AA23 AD1 AE22 AE21 V21 BOOT_MODE BOOT_MODE2 BOOT_MODE3 HKAIN0 HKAIN1 HKAIN2 HKAIN3 HKAIN4 HKAIN5 T21 F13 MODE2 U23 MODE1 Y23 MODE0 RESIN_N F11 RESOUT_N AA4 RESOUT_N_EBI1 AE17 WDOG_EN D18 W6 TCXO A10 USB_XTAL48_IN B10 USB_XTAL48_OUT A16 SLEEP_XTAL_IN B16 SLEEP_XTAL_OUT V2 L2 M6 U4 V8 U8 AA2 C614 0.01u C613 0.01u F6 R602 R603 R604 51K 100K 100K AMUX_OUT VBATT_SENSE HDET1 VBAT_TEMP R601 100K MSM_RESIN_N RESOUT_EBI2_N BUFF_TCXO USB_XTALIN USB_XTALOUT SLEEP_CLK R605 51 K8 G1 N4 Y4 P8 P11 AB1 ROM1_CLK_SDRAM1_CLK XMEM1_CS_N2_SDRAM1_CS_N0 SDRAM1_CLK_EN ROM1_ADV_N_SDRAM1_RAS_N XMEM1_LWAIT_N_SDRAM1_CAS_N XMEM1_HWAIT_N WE1_N_SDRAM1_WE_N A1_25_SDRAM1_DQM3_GPIO75 A1_23_SDRAM1_DQM2_GPIO78 UB1_N_SDRAM1_DQM1 LB1_N_SDRAM1_DQM0 OE1_N XMEM1_CS_N0 P6 P2 P1 N1 N6 N2 N8 N11 M4 M8 L1 GSM_PA_BAND A8 GSM_PA_EN HPIEV_IT_STATE_ETMTRIGIN HPI_EME_APE_ETMPSTA2_XTIDAT HPI_EME_MOD_ETMPSTA1_XTIDAT F23 E26 E25 H21 for VSS_THERMAL 100K G23 R611 B8 HPI_IT_MOD_ETMSYNCA_XTIDAT HPI_IT_APE_ETMPSTA0_XTIDAT R19 D PA_POWER_CTL GSM_PA_DAC_REF A22 MDDIH_STBN MDDIH_STBP MDDIH_DATN B20 MDDIH_DATP U21 AE9 C602 0.01u C601 10u (2012) MDDIC_DATP A23 MDDIC_DATN B22 MDDIC_STBP B23 MDDIC_STBN B19 AF9 A20 W11 A19 AA11 AC10 EBI2_ADDR(2) EBI2_ADDR(1) AD26 T12 AC11 RINGER_GPIO18 W12 D L19 AA12 BT_CLK_GPIO25 BT_SBST_GPIO24 BT_SBCK_GPIO23 BT_SBDT_GPIO22 BT_TX_RX_N_GPIO21 BT_DATA_GPIO20 P25 AC12 H23 AE12 K26 AF12 G21 AA13 J26 W13 J25 AE14 K23 T13 AC14 AC13 A2_20_GPIO34 A2_19 A2_18 A2_17 A2_16 A2_15 A2_14 A2_13 A2_12 A2_11 A2_10 A2_9 A2_8 A2_7 A2_6 A2_5 A2_4 A2_3 A2_2 A2_1 E23 AA14 GRFC8_GPIO11 GRFC7_GPIO10 GRFX6_GPIO9 GRFC5_AUX_SBST_GPIO8 GRFC4_AUX_SBCK_GPIO7 GRFC3_GPIO6 GRFC2_GPIO5 GRFC1_AUX_SBDT_GPIO4 GRFC0_GPIO3 B3 AF13 D21 AC5 J19 AF3 L15 AE4 AUX_PCM_CLK_GRFC14_GPIO80 AUX_PCM_DIN_GRFC13_GPIO14 AUX_PCM_DOUT_GRFC12_GPIO103 AUX_PCM_SYNC_GRFC11_GPIO102 TX_ON_GRFC10 C25 AC6 D22 AE5 D20 AF5 AA7 TRST_N TCK TMS TDI TDO RTCK CAMIF_DATA9_GPIO61 CAMIF_DATA8_GPIO60 CAMIF_DATA7_GPIO59 CAMIF_DATA6_AUX_TDO_GPIO58 CAMIF_DATA5_AUX_TDI_GPIO57 CAMIF_DATA4_AUX_TMS_GPIO56 CAMIF_DATA3_AUX_TCK_GPIO55 CAMIF_DATA2_AUX_TRST_N_GPIO54 CAMIF_VSYNC_GPIO16 CAMIF_HSYNC_GPIO15 CAMIF_PCLK_GPIO82 CAMIF_DATA0_GPIO83 CAMIF_DATA1_GPIO81 GPIO19 GPIO17 SYNTH1_GPIO41 W9 AA8 AC7 F20 AC8 F16 AE7 B F25 D17 I2C_SDA_GPIO26 I2C_SCL_GPIO27 AA9 VREG_MSMA_2.6V (CODEC VSS) GP_PDM2_PA_RANGE1 H17 GP_PDM1_PA_RANGE0 SBST SBDT SBCK W10 D2_15 D2_14 D2_13 D2_12 D2_11 D2_10 D2_9 D2_8 D2_7 D2_6 D2_5 D2_4 D2_3 D2_2 D2_1 D2_0 J23 AC9 L21 C AA10 K21 EBI2_DATA(15) EBI2_DATA(14) EBI2_DATA(13) EBI2_DATA(12) EBI2_DATA(11) EBI2_DATA(10) EBI2_DATA(9) EBI2_DATA(8) EBI2_DATA(7) EBI2_DATA(6) EBI2_DATA(5) EBI2_DATA(4) EBI2_DATA(3) EBI2_DATA(2) EBI2_DATA(1) EBI2_DATA(0) N16 T14 H26 AE10 MMC_CMD_GPIO30 MMC_DATA_SDCC_DAT0_GPIO32 MMC_CLK_SDCC_CLK_GPIO31 AF4 L14 AF7 Q_IM_CH1 Q_IP_CH1 I_IM_CH1 I_IP_CH1 Q_IM_CH0 Q_IP_CH0 I_IM_CH0 I_IP_CH0 U600-1 MSM6275_A UB2_N XMEM2_CS_N0 OE2_N WE2_N LB2_N_A2_0 NAND2_FLASH_READY_GPIO33 H14 F W14 M16 NAND_CLE NAND_CS_N EBI2_OE_N EBI2_WE_N NAND_ALE NAND_READY EBI2_DATA(0:15) XMEM2_CS_N1 LCD_CS_N_GPIO38 USB_DAT_VP USB_SE0_VM USB_OE_TP_N AF10 N25 AF14 VREG_MSMP_2.7V C SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100 SDCC_DAT3_GPIO101 MDP_VSYNC_SECONDA_GPIO104 MDP_VSYNC_PRIMARY_GPIO105 Q_OUT_N Q_OUT I_OUT_N I_OUT DAC_REF N26 AC15 VREG_MSME_1.8V (CAD : 10uF=>Input MSMA_2.6V) C612 0.01u WDOG_STB_SBCK1_GPIO0 SBDT1_GPIO1 PA_ON1_GPIO2 GRFC9_GPIO12 CAMCLK_PO_GP_MN_GPIO13 GPIO28 USB_RX_DATA_GPIO29 XMEM2_CS_N2_GPIO35 XMEM2_CS_N3_GPIO36 LCD_EN_GPIO37 GPIO43 SYNTH2_GPIO65 GPIO66 XMEM1_CS_N1_GPIO76 XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77 UART3_RFR_N_GPIO87 UART2_DP_RX_DATA_GPIO89 SYNTH0_GP_PDM0_GPIO92 SBST1_GPIO93 N23 E2 UART3_CTS_N_GPIO86 UART3_DP_RX_DATA_GPIO85 M19 UART3_DP_TX_DATA_GPIO84 D6 GPIO40 D7 GPIO42 D2 C608 C609 C610 C611 NA NA NA NA TX_AGC_ADJ L13 TRK_LO_ADJ F19 TCXO_EN_GPIO94 F17 PA_ON0 L23 D1 AB2 M21 J6 AB4 Place near MSM pin W18 H13 UART2_RFR_N_GPIO91 UART2_CTS_N_GPIO90 UART2_DP_TX_DATA_GPIO88 G2 F4 J4 P4 H4 E4 J2 G6 J1 K6 F7 L8 K4 D8 L6 F14 V4 U6 L26 R11 M23 Y1 E1 UART1_RFR_N_PA_POWER_CTL_M_GPIO98 UART1_CTS_N_GPIO97 UART1_DP_RX_DATA_GPIO96 UART1_DP_TX_DATA_GPIO95 GPIO44 GPIO39 GPIO64 Y2 P16 V6 P21 W4 GPIO45 GPIO53 GPIO52 A7 GPIO51 B7 GPIO50 F9 GPIO49 R4 A4 T1 R6 SDRAM1_D31 SDRAM1_D30 SDRAM1_D29 SDRAM1_D28 SDRAM1_D27 SDRAM1_D26 SDRAM1_D25 SDRAM1_D24 SDRAM1_D23 SDRAM1_D22 SDRAM1_D21 SDRAM1_D20 SDRAM1_D19 SDRAM1_D18 SDRAM1_D17 SDRAM1_D16 SDRAM1_D15 SDRAM1_D14 SDRAM1_D13 SDRAM1_D12 SDRAM1_D11 SDRAM1_D10 SDRAM1_D9 SDRAM1_D8 SDRAM1_D7 SDRAM1_D6 SDRAM1_D5 SDRAM1_D4 SDRAM1_D3 SDRAM1_D2 SDRAM1_D1 SDRAM1_D0 L12 T2 D10 T4 KEYSENSE4_N_GPIO48 KEYSENSE3_N_GPIO47 KEYSENSE2_N_GPIO46 KEYSENSE1_N_GPIO63 R21 KEYSENSE0_N_GPIO62 E T6 R8 P19 D T8 D14 SDRAM_DATA(31) SDRAM_DATA(30) SDRAM_DATA(29) SDRAM_DATA(28) SDRAM_DATA(27) SDRAM_DATA(26) SDRAM_DATA(25) SDRAM_DATA(24) SDRAM_DATA(23) SDRAM_DATA(22) SDRAM_DATA(21) SDRAM_DATA(20) SDRAM_DATA(19) SDRAM_DATA(18) SDRAM_DATA(17) SDRAM_DATA(16) SDRAM_DATA(15) SDRAM_DATA(14) SDRAM_DATA(13) SDRAM_DATA(12) SDRAM_DATA(11) SDRAM_DATA(10) SDRAM_DATA(9) SDRAM_DATA(8) SDRAM_DATA(7) SDRAM_DATA(6) SDRAM_DATA(5) SDRAM_DATA(4) SDRAM_DATA(3) SDRAM_DATA(2) SDRAM_DATA(1) SDRAM_DATA(0) 150K : 680K : 2.13V 150K : 750K : 2.17V 2012 10uF 6.3V +80/-20% Ceramic C600 10p C607 0.1u 10% 150K : 470K : 1.97V Normal boot Trusted boot VREG_MSMC_1.375V C606 100p 150K : 150K : 1.30V 1005 0.1uF 16V +80/-20% L600 100nH TP601 A1_24_GPIO79 A1_1 A1_2 A1_3 A1_4 A1_5 A1_6 A1_7 A1_8 A1_9 A1_10 A1_11 A1_12 A1_13 A1_14 SDRAM_DATA(0:31) R23 C L4 V1 SDRAM_ADDR(0) SDRAM_ADDR(1) SDRAM_ADDR(2) SDRAM_ADDR(3) SDRAM_ADDR(4) SDRAM_ADDR(5) SDRAM_ADDR(6) SDRAM_ADDR(7) SDRAM_ADDR(8) SDRAM_ADDR(9) SDRAM_ADDR(10) SDRAM_ADDR(11) SDRAM_ADDR(12) SDRAM_ADDR(13) SDRAM_ADDR(14) SDRAM_ADDR(0:14) SDRAM_WE_N SDRAM_DQM(3) SDRAM_DQM(2) SDRAM_DQM(1) SDRAM_DQM(0) SDRAM_CLK SDRAM_CS_N(0) SDRAM_CLK_EN SDRAM_RAS_N SDRAM_CAS_N 0 1 A 150K : 47K : 0.62V 150K : 68K : 0.81V 150K : 100K : 1.04V PMIC_AUXIN[1] PMIC_AUXIN[2] - PA_THERM BOOT_MODE3 B 150K : 10K : 0.016V HKADC[0] - AMUX_OUT HKADC[1] - VBATT_SENSE HKADC[2] - HDET1 HKADC[3] HKADC[4] - PCB_Rev_ADC HKADC[5] - CHARGER_THERM P15 USB_XTALOUT BOOT_MODE2 Native, ARM JTAG Native, MSM JTAG R12 VREG_MSMP_2.7V VREG_MSMP_2.7V 48MHz ( Default Pull-Down) 0 0 VDD_PAD4_0 1M MODE0 0 1 P14 X600 WM_MONO2 WM_MONO1 EXRY0002401 0 0 WM_HPH_R WM_HPH_L WM_RXN WM_RXP 2 1 3 A MODE2 MODE1 GSM_PA_RAMP GSM_PA_DAC_REF RF_SBST RF_SBDT RF_SBCK USB_DAT USB_SE0 USB_OE_N PM_SBDT PM_SBST PM_SBCK PM_INT_N PS_HOLD MSM_USIM_CLK MSM_USIM_RST_N MSM_USIM_DATA E MSM_UART_RXD MSM_UART_TXD E C646 0.1u 10% 3 4 5 6 7 Designer MAY 2006 LGE Sheet/ Sheets MODEL JOY 1.3 6/7 DRAWING NAME Approved Place near 8 MODEM CPU LG Electronics Inc. DRAWING NO. 9 LG Electronics Inc. LG(42)-A-5505-10:01 LGE Internal Use Only Sign & Name MSM pin AD26 (Check CAM_DATA PINOUT !!!!) 2 Date Checked F 1 Section - 196 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 7. CIRCUIT DIAGRAM 1 2 4 3 5 6 7 9 8 10 11 13 12 15 14 16 A W14 W13 W12 W11 W4 W3 W2 W1 Y14 Y13 Y12 Y11 Y4 Y3 Y2 Y1 V14 V13 V2 V1 U14 U3 U1 T13 T7 T3 T2 R9 R7 R2 P8 P7 N13 N12 N11 N10 N9 N6 N5 N4 N3 A SDRAM_ADDR(0) SDRAM_ADDR(1) SDRAM_ADDR(2) SDRAM_ADDR(3) SDRAM_ADDR(4) SDRAM_ADDR(5) SDRAM_ADDR(6) SDRAM_ADDR(7) SDRAM_ADDR(8) SDRAM_ADDR(9) SDRAM_ADDR(10) SDRAM_ADDR(11) SDRAM_ADDR(12) R702 R703 C713 C712 smd_1608h_9_r EBI2_OE_N NAND_READY VREG_MSME_1.8V SDRAM_CLK_EN SDRAM_ADDR(13) SDRAM_ADDR(14) 1u USB_OE_N USB_CTL_N D701 USB_VBUS E 4.7u USB_DAT MSM_USB_D+ USB_SE0 MSM_USB_D47K R710 1u C732 PM_INT_N TCXO_PM PS_HOLD D700 4.7u C726 R707 TCXO_EN +VPWR +VPWR JTAG_PS_HOLD VREG_MSMA_2.6V 0 smd_1608h_9_r R708 C6 F7 G2 G13 L13 P2 P13 R8 U2 U6 U10 U13 BUFF_TCXO smd_1608h_9_r 4.7u C730 51 PM_SBST R709 PM_SBCK PM_SBDT SLEEP_CLK USIM_P_RST_N VREG_MSMP_2.7V 0 D7 J12 K4 K5 K9 K10 K11 K13 K14 L1 L2 L3 L4 L5 L9 L11 L14 M5 M6 M12 N2 Load=12.5p C733 18p C734 18p Artwork --> Place crystal and load caps close to PM6650 !! 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 C731 smd_1608h_9_r RB521S-30 U700 PM6650-1M K12 RB521S-30 0.01u BATT_FET_N MSM_RESIN_N 470K ML414RM_F9CL 0.1uF VBATT C729 R704 BAT700 R705 121K 1% V4 V9 C728 C725 0.1u REF_BYP REF_GND REF_ISET VCOIN MSM_INT_N TCXO_IN PS_HOLD VREG_MSMA TCXO_EN VDD_ANA TCXO_OUT VDD_MSM SBST VREG_MSMP SBCK VBACKUP SBDT XTAL_OUT SLEEP_CLK XTAL_IN RUIM_RST(MPP6) VREG_MSMP_2.7V C727 1u ADC_BYP VCHG ISNS_P CHG_CTL_N ISNS_M VBAT BAT_FET_N FLSH_DRV_N PON_RESET_N VREG_USB USB_ID VREG_5V USB_OE_N VSW_5V USB_CTL_N USB_VBUS USB_DAT USB_D_P USB_SE0 USB_D_M GP1_DRV_N(MPP7) C715 C723 X700 10K C724 ICHARGE CHG_CNT_N ICHARGEOUT 0.1u 1 2 32.768KHz R706 +5V_PWR 1u 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 LCD_DRV_N KPD_DRV_N KPDPWR_N VIB_DRV_N RUIM_IO(MPP12) VSW_PA VREG_PA VDD_PA RUIM_M_IO(MPP11) VSW_MSMC VREG_MSMC VDD_MSMC RUIM_M_CLK(MPP9) VDD_MSME VREG_MSME VSW_MSME RUIM_CLK(MPP10) VREG_MMC RUIM_M_RST(MPP5) VDD_RUIM VREG_RUIM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Route carefully to avoid corrupting sensitive analog and RF signals!!!!! USIM_P_CLK _WP _WEN _RAS _WED _CAS CLK _CS ALE CLE _CE _RE RY__BY CKE BA0 BA1 PM_SBDT , PM_SBCK , PM_SBST , PM_INT_N VCCQD1 VCCQD2 VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSS9 VSS10 VSS11 VSS12 NC1 NC2 NC3 NC4 NC5 NC6 NC7 NC8 NC9 NC10 NC11 NC12 NC13 NC14 NC15 NC16 NC17 NC18 NC19 NC20 NC21 NC22 NC23 NC24 NC25 NC26 NC27 NC28 NC29 NC132 NC131 NC71 NC72 NC73 NC74 NC75 NC76 NC77 NC78 NC79 NC80 NC81 NC82 NC83 NC84 NC85 NC86 NC87 NC88 NC89 M11 M13 L10 L12 J9 H12 H10 G12 EBI2_DATA(0) EBI2_DATA(1) EBI2_DATA(2) EBI2_DATA(3) EBI2_DATA(4) EBI2_DATA(5) EBI2_DATA(6) EBI2_DATA(7) B C SDRAM_DQM(0) SDRAM_DQM(1) SDRAM_DQM(2) SDRAM_DQM(3) EBI2_DATA(0:7) D A1 A2 A3 A4 A11 A12 A13 A14 B1 B2 B3 B4 B11 B12 B13 B14 C1 C2 C5 C13 C14 D1 D14 E1 E7 E8 E9 E10 E11 E F K3 K2 K1 J13 J11 J10 J6 J5 J4 J3 J2 H13 H11 H9 H6 H5 H4 H3 H2 G11 G10 G9 G8 G7 G6 G5 G4 G3 F13 F12 F11 F10 F9 F8 F6 F5 F4 F3 F2 E13 E12 smd_1608h_9_r C739 4.7u 2.2u C738 C736 1000p smd_1608h_9_r 1000p C737 SDRAM_DATA(0) SDRAM_DATA(1) SDRAM_DATA(2) SDRAM_DATA(3) SDRAM_DATA(4) SDRAM_DATA(5) SDRAM_DATA(6) SDRAM_DATA(7) SDRAM_DATA(8) SDRAM_DATA(9) SDRAM_DATA(10) SDRAM_DATA(11) SDRAM_DATA(12) SDRAM_DATA(13) SDRAM_DATA(14) SDRAM_DATA(15) SDRAM_DATA(16) SDRAM_DATA(17) SDRAM_DATA(18) SDRAM_DATA(19) SDRAM_DATA(20) SDRAM_DATA(21) SDRAM_DATA(22) SDRAM_DATA(23) SDRAM_DATA(24) SDRAM_DATA(25) SDRAM_DATA(26) SDRAM_DATA(27) SDRAM_DATA(28) SDRAM_DATA(29) SDRAM_DATA(30) SDRAM_DATA(31) C USB_VBUS_IN 0 R712 4.7u C735 smd_1608h_9_r KPD_DRV_N KEY_ON_SW_N MOT_PWRUSIM_P_DATA smd_1608h_9_r 4.7u C761 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 EUSY0297301 VCCN2 L701 4.7uH L700 4.7uH U4 T4 T5 V5 U5 T6 V6 U7 T9 T10 V10 T11 U11 V11 T12 U12 P3 R3 P4 R4 P5 R5 P6 R6 P9 P10 R10 P11 R11 P12 R12 R13 U8 DQM0 T8 DQM1 V7 DQM2 U9 DQM3 U701 TY90009800COGG +VPWR 1000p C760 smd_1608h_9_r 4.7u C708 C705 1000p C ----->> SDRAM_DATA(0:31) DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31 NC70 NC69 NC68 NC67 NC66 NC65 NC64 NC63 NC62 NC61 NC60 NC59 NC58 NC57 NC56 NC55 NC54 NC53 NC52 NC51 NC50 NC49 NC48 NC47 NC46 NC45 NC44 NC43 NC42 NC41 NC40 NC39 NC38 NC37 NC36 NC35 NC34 NC33 NC32 NC31 NC30 R711 +VPWR MSM_USIM_RST_N 100K +VPWR --->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR- +VPWR +VPWR MSM_USIM_DATA +VPWR Draw the Artwork_line thickly !!!!! MSM_USIM_CLK +VPWR Power Line --> Route carefully!!!!! F A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 C7 VCCD1 D2 VCCD2 D13 VCCD3 V3 VCCD4 V8 VCCD5 V12 VCCD6 C716 C717 C718 C719 C720 C721 C722 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 GND_SLUG VREG_TCXO VDD_MAIN AMUX_OUT VREG_SYNT REF_OUT(MPP8) SPKR_OUT_M SPKR_IN_M VDD_SPKR SPKR_IN_P SPKR_OUT_P SPKR_BYP VREG_RFTX AMUX_IN2(MPP2) VDD_RF AMUX_IN1(MPP1) VREG_RFRX1 CBL0PWR_N(MPP3) VREG_RFRX2 CBL1PWR_N(MPP4) VDD_WLAN VREG_WLAN Artwork --> Place resistor and capacitor close to PM6650 !! D C3 D3 E3 E2 D12 C12 D11 C11 D10 C10 E4 D9 C9 L6 K6 D5 D6 E6 C8 E5 M3 M4 M9 M10 M2 D8 C4 D4 EBI2_WE_N SDRAM_RAS_N SDRAM_WE_N SDRAM_CAS_N SDRAM_CLK SDRAM_CS_N(0) NAND_ALE NAND_CLE 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 2.2u 2.2u 0.1u smd_1608h_9_r +VPWR +VPWR +VPWR C714 +VPWR C710 C711 1u NAND_CS_N 10K REMOTE_PWR_ON C 1u VREG_MSMP_2.7V 100K AMUX_OUT C700 RESOUT_EBI2_N 33u tcc_2125h1_r C704 0.1u smd_1608h_9_r 4.7u C709 C703 0.1u 0.1u 0.1u C706 smd_1608h_9_r 4.7u C707 C701 C702 0.1u +VPWR NA R701 VDD_MAIN : 0.1uF VDD_SPKR : 100K : 0.1uF VREG_RFR_2.85V VDD_RF VDD_WLAN : 0.1uF VREG_RFTX_2.85V VDD_RUIM : 0.1uF : 4.7uF PA_THERM VREG_TCXO_2.85V VDD_PA VREG_SYNTH_2.85V GSM_PA_DAC_REF VDD_ANA : 0.1uF VDD_MSME : 4.7uF B SDRAM_ADDR(0:12) VDD_MSM : 0.1uF VDD_MSMC : 4.7uF NC130 NC129 NC128 NC127 NC126 NC125 NC124 NC123 NC122 NC121 NC120 NC119 NC118 NC117 NC116 NC115 NC114 NC113 NC112 NC111 NC110 NC109 NC108 NC107 NC106 NC105 NC104 NC103 NC102 NC101 NC100 NC99 NC98 NC97 NC96 NC95 NC94 NC93 NC92 NC91 NC90 PMIC_VPWR_BYPASS USB_VBUS 5 4 1 2 3 R730 Q700 QST4 NA D 4 6 3 VREG_USIM_2.85V USB_PWR_EN 2 NA 2012 Route as equal length as possible! -> ICHARGE, ICHARGEOUT 1% ICHARGEOUT KRX102E Q702 Q701 NUS5530MN Drain_B 1 NC1 Collector_B 2 Collector Emitter 3 Source Base 4 NC2 Drain Gate +VPWR VBATT 5 USB_CTL_N 1 ICHARGE R713 0.1 D VREG_MSME_1.8V VREG_MSMC_1.375V USB_VBUS 10 9 8 7 6 5 +5V_PWR CHG_CNT_N USB Booting Protection BATT_FET_N E E Battery charging circuit !!!!! Section Date Sign & Name Designer MAY 2006 LGE Sheet/ Sheets MODEL JOY 1.3 7/7 Checked F Approved LG Electronics Inc. 1 2 3 4 5 6 7 MODEM POWER DRAWING NO. draw_number 9 8 LG Electronics Inc. LG(42)-A-5505-10:01 Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes DRAWING NAME - 197 - LGE Internal Use Only 7. CIRCUIT DIAGRAM 1 2 3 4 5 7 6 8 9 11 10 12 13 14 15 16 A A AP_+VPWR U100 8 VIN AAT3151IWP_T1 3 C1+ LCD Connector 0 TP100 TP101 5 3 4 LCD_DATA(8) LCD_DATA(7) 2 5 3 4 LCD_DATA(15) LCD_DATA(13) LCD_DATA(5) 1 6 2 5 3 4 LCD_DATA(12) LCD_DATA(11) LCD_DATA(14) LCD_DATA(9) 1 6 2 5 3 4 PLR0504F 2 WLED_CTL C102 1u C103 4.7u DIS_CSN PLR0504F D103 PLR0504F D102 LCD_DATA(0:15) LCD_DATA(0) LCD_DATA(1) LCD_DATA(2) LCD_DATA(3) LCD_DATA(4) LCD_DATA(5) LCD_DATA(6) LCD_DATA(7) LCD_DATA(8) LCD_DATA(9) LCD_DATA(10) LCD_DATA(11) LCD_DATA(12) LCD_DATA(13) LCD_DATA(14) LCD_DATA(15) 2 DIS_WEN LED_ANODE 6 9 13 VOUT C1C2+ EN_SET GND PGND 4 6 7 C210 D1 11 D2 12 D3 1 D4 C100 1u B C101 1u LED1 LED2 LED3 LED4 LCD_DATA(1) C LCD_DATA(3) LCD_Backlight driver PLR0504F D104 LCD_DATA(4) LCD_DATA(6) 1 6 2 5 3 4 LCD_VS DIS_RS D PLR0504F TP102 C105 820p C104 XF2B-3545-31A-P LCD_DATA(2) LCD_DATA(10) 1 LCD_NRESET 1u R103 100K R104 100K R115 LED1 LED2 LED3 LED4 LED_ANODE LCD_VS DIS_CSN DIS_RS DIS_WEN 6 RSB6.8CST2R 100K LCD_DATA(0) 1 FUNCTION-SLIDER CON-HEADER ZD100 R102 CN100 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 5 R101 (lower contact) D101 RSB6.8CST2R D100 100K ZD101 AP_VDD_LCD_2.8V E CN101 SW100 SW101 SW102 SW103 SW104 SW105 FUNCTION KEYPAD LED KEY_ROW(0) AP_+VPWR AP_+VPWR 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 LCD_DATA(0) LCD_DATA(2) LCD_DATA(4) LCD_DATA(6) LCD_DATA(8) LCD_DATA(10) LCD_DATA(12) LCD_DATA(14) LCD_DATA(15) LCD_DATA(13) LCD_DATA(11) LCD_DATA(9) LCD_DATA(7) LCD_DATA(5) LCD_DATA(3) LCD_DATA(1) KEY_ROW(1) SW106 SW107 SW108 SW109 SW110 SW111 KEY_ROW(2) LD100 R106 100ohm LD104 R109 100ohm SSC-TWH104-HLS LD105 LD106 SSC-TWH104-HLS LD107 RSB6.8CST2R RSB6.8CST2R RSB6.8CST2R RSB6.8CST2R RSB6.8CST2R RSB6.8CST2R AP_VDD_LCD_2.8V F WLED_CTL SSC-TWH104-HLS C R112 100ohm SSC-TWH104-HLS R113 100ohm SSC-TWH104-HLS RSB6.8CST2R LCD_NRESET DIS_WEN DIS_RS DIS_CSN LCD_VS R110 100ohm SSC-TWH104-HLS R111 100ohm KEY_COL(7) KEY_COL(6) KEY_COL(5) KEY_COL(4) KEY_ROW(3) KEY_ROW(2) KEY_ROW(1) KEY_ROW(0) KPD_DRV_N LD102 R108100ohm R107 100ohm SSC-TWH104-HLS LD103 KEY_ROW(3) KEY_COL(4) KEY_COL(5) KEY_COL(6) LD101 SSC-TWH104-HLS 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 LD108 R114 100ohm SSC-TWH104-HLS KPD_DRV_N VA100 EVL14K02200 VA107 VA106 VA105 VA104 VA103 VA102 VA101 D E Section Date Sign & Name Designer MAY 2006 LGE Sheet/ Sheets MODEL JOY 1.3 1/1 Checked DRAWING NAME Approved LG Electronics Inc. 1 2 3 4 5 6 7 LCD & FUNCTION KEY DRAWING NO. 9 8 LG Electronics Inc. LGE Internal Use Only - 198 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 7. CIRCUIT DIAGRAM 1 2 3 4 3 5 6 9 8 7 10 13 12 11 14 15 16 A A AP_VDD_CAM_2.7V AP_VDD_CAM_1.8V B CN100 1 2 3 4 5 6 7 8 9 10 CCIRICLK_CAM CCIRID(0)_CAM CCIRID(1)_CAM CCIRID(2)_CAM CCIRID(3)_CAM CCIRID(4)_CAM CCIRID(5)_CAM FB101 HB-1M1005-601JT FB100 HB-1M1005-601JT VGA_CAMERA VGA_STANDBY CAMCLK_27MHZ_CAM 20 19 18 17 16 15 14 13 12 11 R100 0 OUT100 RECEIVER+ R101 0 OUT101 RECEIVER- VGA_RSTn I2CSCL0_CAM I2CSDA0_CAM R103 NA RECEIVER-CCIRIHS_CAM CCIRIVS_CAM CCIRID(7)_CAM CCIRID(6)_CAM C100 0.1u C102 1u C101 0.1u VA100 EVLC18S02015 VA101 EVLC18S02015 C MOT_PWR- D AXK720145G AP_+VPWR OUT102 OUT103 L100 56nH D100 RB521S-30 MAIIN-SLIDER CON-SOCKET E FUNCTION-SLIDER CON-SOCKET CN102 G1 AP_VDD_CAM_2.7V AP_VDD_CAM_1.8V G2 R104 CCIRICLK_CAM 0 RECEIVER+ RECEIVERRECEIVER-MOT_PWRWLED_CTL LCD_VS DIS_CSN DIS_RS DIS_WEN LCD_NRESET VGA_STANDBY KPD_DRV_N KEY_ROW(0) KEY_ROW(1) KEY_ROW(2) KEY_ROW(3) KEY_COL(4) KEY_COL(5) KEY_COL(6) KEY_COL(7) CN101 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 CCIRIHS_CAM VGA_RSTn I2CSDA0_CAM I2CSCL0_CAM G3 CCIRIVS_CAM CCIRID(7)_CAM CCIRID(6)_CAM CCIRID(5)_CAM CCIRID(4)_CAM CCIRID(3)_CAM CCIRID(2)_CAM CCIRID(1)_CAM CCIRID(0)_CAM CAMCLK_27MHZ_CAM AP_+VPWR AP_VDD_LCD_2.8V AP_+VPWR 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 KEY_COL(7) KEY_COL(6) KEY_COL(5) KEY_COL(4) KEY_ROW(3) KEY_ROW(2) KEY_ROW(1) KEY_ROW(0) KPD_DRV_N F LCD_NRESET DIS_WEN DIS_RS AP_VDD_LCD_2.8V DIS_CSN LCD_VS WLED_CTL C TP105TP106TP107TP108TP109 D G4 E Section Date Sign & Name Designer MAY 2006 LGE Sheet/ Sheets MODEL JOY 1.3 1/1 Checked DRAWING NAME Approved LG Electronics Inc. 1 2 3 4 4 5 6 7 SLIDER FPCB DRAWING NO. 9 8 LG Electronics Inc. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 199 - LGE Internal Use Only 7. CIRCUIT DIAGRAM 1 2 3 4 5 6 7 9 8 10 A AA B BB VOLUME SIDE KEY KB100 VOLUME UP CN? 1 2 3 4 VOLUME DOWN KB101 C C TP2 TP1 D D E Section Date Designer AUG 2006 Sign & Name Sheet/ MODEL Sheets JOY 1/1 Checked DRAWING NAME VOLUME_SIDEKEY_FPCB Approved Iss. 1 2 3 4 Notice No. Name DRAWING LG Electronics Inc. NO. Rev_C 5 LGIC(42)-A-5505-10:01 LGE Internal Use Only Date LG Electronics Inc. - 200 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 7. CIRCUIT DIAGRAM 1 2 3 4 5 7 6 9 8 10 A AA B BB KB100 POWER KEY CN100 1 2 3 4 KB101 CAMERA KEY C C TP1 TP2 D D E Section Date Designer AUG 2006 Sign & Name MODEL LGE Checked JOY Sheet/ Sheets 1/1 DRAWING NAME POWER_Camera_BUTTON Approved Iss. 1 2 3 4 Date Name LG Electronics Inc. DRAWING NO. 5 LGIC(42)-A-5505-10:01 Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Notice No. LG Electronics Inc. - 201 - LGE Internal Use Only 8. PCB LAYOUT LGE Internal Use Only - 202 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 8. PCB LAYOUT Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 203 - LGE Internal Use Only 8. PCB LAYOUT LGMC LGE Internal Use Only - 204 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 8. PCB LAYOUT Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 205 - LGE Internal Use Only 8. PCB LAYOUT LGMC LGE Internal Use Only - 206 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 8. PCB LAYOUT LGMC Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 207 - LGE Internal Use Only LGE Internal Use Only - 208 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 9. Usage of Hot-Kimchi 9. Usage of Hot-Kimchi 9.1 Usage of Hot-Kimchi 9.1.1 Calibration Model Name Calibration only • Procedure 1. Click SETTING in menu, and logic operation in sub-menu. Choose “1” in LOGIC MODE (means calibration alone) 2.Select the model name which you want in list box 3.Click Start button to calibrate a phone Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 209 - LGE Internal Use Only 9. Usage of Hot-Kimchi 9.1.2 Basic Setting • Contents ✔ Click SETTING in menu, and logic operation in sub-menu. ✔ You can select how to control AT comm, Testset, and Power supply in DLL Operating Mode. ✔ You can set UART Port and logic mode. (mode 1 : Calibration alone) ✔ You can set Result File’s name type. If you choose “TIME”, the saved files’ name is saved in a run - time. ✔ You can run the multi mode (S/B1,S/B2 : You can use S/B1 for only one port.) ✔ You can set the path of HOTKIMCHI program. LGE Internal Use Only - 210 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 9. Usage of Hot-Kimchi 9.1.3 Log of Calibration and Test • Contents ✔ On Running, Log window is created in center area. It displays logs of command, and measurements of Calibration or Autotest. ✔ The result files are saved in the directory “~janghee\debug\Cal”, “~janghee\debug\Auto”, or “~janghee\debug\CalAuto”. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 211 - LGE Internal Use Only 10. Engineering Mode 10. Engineering Mode A. About Engineering Mode Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. B. Access Codes The key sequence for switching the engineering mode on is *#001*2580#. Pressing END will switch back to non-engineering mode operation. Engineering Mode 1. Version 2. Device 3. Factory Info Test Reset AP/MP/HW Factory 4. MTC 5. Save Log Auto All Test LCD LED Vibrator Sound Camera Keypad MP Msg Viewer RTC Test Options of in Main view : - Set AP Debugmode On - Set MP Debugmode On LGE Internal Use Only - 212 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 10. Engineering Mode 10.1 Version Info 10.1.1 AP/MP/HW Version 10.1.2 Factory Version 10.2 Device Test 10.2.1 Auto All Test LCD On/Off -> Keypad LED On/Off -> Color Auto Test -> Ringtone Test -> Vibrator Test -> Keypad Test 10.2.2 LCD 1) Auto Color Test Red -> Green -> Blue -> Balck -> White To exit test, press the right arrow key. 2) Color Table Test : display the RGB table 10.2.3 LED 1) Backlight Test This controls brightness of Backlight. When entering into the menu, the present backlight-value in the phone is displayed. Use Left/Right key to adjust the level of brightness. 2) Keypad Light Test This controls brightness of keypad light. When entering into the menu, the present keypad light-value in the phone is displayed. Use Left/Right key to adjust the level of brightness of keypad. 3) Blinking Test Keypad & LCD Backlight blinking test. 10.2.4 Vibrator This menu is to test the vibration mode. 10.2.5 Sound 1) Ringtone Test This menu is test ring tone. 2) Audio Calibration This menu is to test db value of each volume level 3) Vocoder Calibration This menu is to test db value of each frequency of codec. Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 213 - LGE Internal Use Only 10. Engineering Mode 4) Echo Cancelation This menu is to test echo cancellation parameter of codec. 5) Sound Calibration This menu is to test volume gain of codec. 6) Loopback Test This menu is to test the vibration mode. 7) AES/ACS Tunning This menu is to test acoustic echo cancellation/suppression. 10.2.6 Camera Camera application will be launched. 10.2.7 Keypad This menu is to test all keys. 10.2.8 MP Msg Viewer This menu is to display messages from MP 10.2.9 RTC Test This menu is to display current time. 10.3 Factory Reset This menu is to restore factory setting value. 10.4 MTC Not to use. 10.5 Save Log To save the latest log messages. In Main view Options Set AP Debugmode On : UART switch is changed to AP / MP side Set MP Debugmode On : not to use. LGE Internal Use Only - 214 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 215 - LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST 11.1 EXPLODED VIEW 78 71 70 65 66 67 69 68 85 61 79 60 59 58 72 55 80 73 53 54 51 62 46 81 84 76 50 47 75 39 77 43 74 37 35 33 32 83 44 52 57 63 64 38 36 56 55 34 31 30 22 23 16 24 48 17 15 45 42 12 8 25 9 40 6 7 4 1 41 26 5 3 49 18 10 82 2 29 19 27 20 13 28 21 14 11 LGE Internal Use Only - 216 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 217 - LGE Internal Use Only LGE Internal Use Only - 218 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. EXPLODED VIEW & REPLACEMENT PART LIST 11.2 Replacement Parts Level Location No 1 Part Name IMT,FOLDER Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Part Number Spec Color Remark TIFF0011101 2 AAAY00 ADDITION AAAY0123901 3 MCCZ00 CAP MCCZ0021601 BOX, TW, , , , , Without Color 3 MCJZ00 COVER MCJZ0046701 BOX, TW, , , , , Without Color 3 MLAC00 LABEL,BARCODE MLAC0004501 Export(105*40) Without Color 3 MLAJ00 LABEL,MASTER BOX MLAJ0004401 LABEL,MASTER BOX(for C1300i NEW_CGR) Without Color 3 MPBZ00 PAD MPBZ0155609 BOX, TW, , , , , Without Color 3 MPCY00 PALLET MPCY0012403 COMPLEX, (empty), , , , , DARK BLUE 2 APEY00 PHONE APEY0241401 Metal Black 3 ACGM00 COVER ASSY,REAR ACGM0079901 Black 4 MCCC00 CAP,EARPHONE JACK MCCC0040001 COMPLEX, (empty), , , , , Black 61 4 MCCF00 CAP,MOBILE SWITCH MCCF0041201 MOLD, Urethane Rubber S190A, , , , , Black 77 4 MCCG00 CAP,MULTIMEDIA CARD MCCG0006801 COMPLEX, (empty), , , , , Black 74 4 MCJN00 COVER,REAR MCJN0058801 MOLD, PC LUPOY SC-1004ML, , , , , Black 66 4 MDAD00 DECO,CAMERA MDAD0026001 ELECTROFORMING, Ni, , , , , Black 70 4 MGAD00 GASKET,SHIELD FORM MGAD0140101 COMPLEX, (empty), , , , , Without Color 67 4 MGAE00 GASKET,DUST MGAE0000401 COMPLEX, (empty), , , , , Without Color 57 4 MGAE01 GASKET,DUST MGAE0000501 COMPLEX, (empty), , , , , Without Color 64 4 MHGB00 HOLDER,CARD MHGB0001801 PRESS, STS, 0.2T, , , , Without Color 75 4 MIDZ00 INSULATOR MIDZ0131001 COMPLEX, (empty), , , , , Without Color 4 MIDZ01 INSULATOR MIDZ0131101 COMPLEX, (empty), , , , , Without Color 63 4 MLAB00 LABEL,A/S MLAB0001102 C2000 USASV DIA 4.0 White 55 4 MLAN00 LABEL,QUALCOMM MLAN0000603 White,95C 4 MLEA00 LOCKER,BATTERY MLEA0035001 MOLD, PC LUPOY SC-1004ML, , , , , Black 73 4 MLEY00 LOCKER MLEY0000801 SIM LOCKER Silver 76 4 MPBH00 PAD,MIKE MPBH0030201 COMPLEX, (empty), , , , , Without Color 56 4 MPBL00 PAD,MSM MPBL0005201 COMPLEX, (empty), , , , , Without Color 65 4 MPBN00 PAD,SPEAKER MPBN0038201 COMPLEX, (empty), , , , , Without Color 58 4 MPBN01 PAD,SPEAKER MPBN0041401 COMPLEX, (empty), , , , , Without Color 60 4 MPBT00 PAD,CAMERA MPBT0037801 COMPLEX, (empty), , , , , Without Color 68 4 MSDB00 SPRING,COIL MSDB0003901 CUTTING, BeCu, , , , , Silver 72 4 MTAA00 TAPE,DECO MTAA0131201 COMPLEX, (empty), , , , , Without Color 69 4 MTAB00 TAPE,PROTECTION MTAB0170801 COMPLEX, (empty), , , , , Without Color Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Metal Black - 219 - 62 Transparent LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 4 MTAZ00 4 Part Name TAPE Part Number Spec Color Remark Without Color 80,83 MTAZ0181001 COMPLEX, (empty), , , , , MWAE00 WINDOW,CAMERA MWAE0020901 CUTTING, NS, , , , , Black 79 5 MBJC00 BUTTON,FUNCTION MBJC0020501 COMPLEX, (empty), , 51.9, 104, 12.2, Black 44 5 MBJN00 BUTTON,VOLUME MBJN0010101 COMPLEX, (empty), , 51.9, 104, 12.2, Black 38 5 MCJK00 COVER,FRONT MCJK0064501 MOLD, PC LUPOY SC-1004ML, , 51.9, 104, 12.2, Black 39 6 MICE00 INSERT,NUT MICE0000801 EXTRUSION, LDPE, , , , , Gold 5 MDAG00 DECO,FRONT MDAG0023701 MOLD, POM TX-31, , 51.9, 104, 12.2, Black 40 5 MIDZ00 INSULATOR MIDZ0130401 COMPLEX, (empty), , , , , Without Color 43 5 MIDZ01 INSULATOR MIDZ0130501 COMPLEX, (empty), , , , , Without Color 47 5 MIDZ02 INSULATOR MIDZ0130601 COMPLEX, (empty), , , , , Without Color 48 5 MPBH00 PAD,MIKE MPBH0027601 COMPLEX, (empty), , , , , Without Color 42 5 MTAA00 TAPE,DECO MTAA0131301 COMPLEX, (empty), , , , , Without Color 41 5 MTAB00 TAPE,PROTECTION MTAB0148801 COMPLEX, (empty), , , , , Without Color 5 MTAB01 TAPE,PROTECTION MTAB0170201 COMPLEX, (empty), , , , , Without Color 4 ACGR00 COVER ASSY,SLIDE(LOWER) ACGR0008301 5 MCJV00 COVER,SLIDE(LOWER) MCJV0008401 MOLD, PC LUPOY SC-1004ML, , 51.9, 104, 7.6, Black 5 MDAY00 DECO MDAY0032901 MOLD, POM TX-31, , 51.9, 104, 12.2, Black 5 MMAA00 MAGNET,SWITCH MMAA0000901 G7000 12x2x0.7t 5 MPBG00 PAD,LCD MPBG0056401 COMPLEX, (empty), , , , , Without Color 30 5 MPBU00 PAD,CONNECTOR MPBU0000501 COMPLEX, (empty), , , , , Without Color 26 5 MTAF00 TAPE,MOTOR MTAF0010701 COMPLEX, (empty), , , , , Without Color 31 5 MTAZ00 TAPE MTAZ0181101 COMPLEX, (empty), , , , , Without Color 35 5 MTAZ01 TAPE MTAZ0181201 COMPLEX, (empty), , , , , Without Color 32 5 MTAZ02 TAPE MTAZ0181301 COMPLEX, (empty), , , , , Without Color 29 4 ACGS00 COVER ASSY,SLIDE(UPPER) ACGS0009301 5 MBFF00 BRACKET,LCD MBFF0011801 CASTING, Al Alloy, , , , , Black 9 5 MCJW00 COVER,SLIDE(UPPER) MCJW0009801 CASTING, Al Alloy, , 51.9, 104, 7.6, Black 4 6 MICC00 INSERT,FRONT(UPPER) MICC0010001 D2.2 L2.0 KURL 45 Gold 5 MFBB00 FILTER,RECEIVER MFBB0020401 COMPLEX, (empty), , , , , 5 MKAC00 KEYPAD,FUNCTION MKAC0009501 MOLD, ABS MP-220, , 51.9, 104, 7.6, 5 MPBG00 PAD,LCD MPBG0056301 5 MPBJ00 PAD,MOTOR 5 MPBM00 5 Black 33 Metal Silver Black Without Color 5 Black 11 COMPLEX, (empty), , , , , Without Color 12 MPBJ0040701 COMPLEX, (empty), , , , , Without Color 6 PAD,RECEIVER MPBM0017401 COMPLEX, (empty), , , , , Without Color 7 MPBT00 PAD,CAMERA MPBT0037901 COMPLEX, (empty), , , , , Without Color 10 5 MPBZ00 PAD MPBZ0172101 COMPLEX, (empty), , , , , Without Color 8 5 MTAB00 TAPE,PROTECTION MTAB0153501 COMPLEX, (empty), , , , , Without Color LGE Internal Use Only - 220 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 5 MTAD00 5 Part Name TAPE,WINDOW Part Number Spec Color Remark Without Color 3 Black 2 Black 36 MTAD0064501 COMPLEX, (empty), , , , , MWAC00 WINDOW,LCD MWAC0072201 CUTTING, PMMA MR 200, , 51.9, 104, 12.2, 4 ARDY00 RAIL ASSY,SLIDE ARDY0001601 4 GMEY00 SCREW MACHINE,BIND GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK Without Color 82,85 4 GMZZ00 SCREW MACHINE GMZZ0022101 1.4 mm,1.7 mm,MSWR3(BK) ,A ,+ ,- , Without Color 84 4 GMZZ01 SCREW MACHINE GMZZ0020501 3.5 mm,1.5 mm,SWCH18A ,A ,+ ,- , Black 4 MCCH00 CAP,SCREW MCCH0093901 MOLD, Urethane Rubber S190A, , , , , Black 37 4 MGAD00 GASKET,SHIELD FORM MGAD0139601 COMPLEX, (empty), , , , , Without Color 21 4 MGAE00 GASKET,DUST MGAE0000101 COMPLEX, (empty), , , , , Without Color 4 MGAE01 GASKET,DUST MGAE0000201 COMPLEX, (empty), , , , , Without Color 20 4 MGAE02 GASKET,DUST MGAE0000301 COMPLEX, (empty), , , , , Without Color 27 4 MIDZ00 INSULATOR MIDZ0130701 COMPLEX, (empty), , , , , Without Color 18 4 MIDZ01 INSULATOR MIDZ0130801 COMPLEX, (empty), , , , , Without Color 19 4 MIDZ02 INSULATOR MIDZ0135601 COMPLEX, (empty), , , , , Without Color 28 4 MIDZ03 INSULATOR MIDZ0143101 COMPLEX, (empty), , , , , Without Color 4 MKAZ00 KEYPAD MKAZ0033201 MOLD, ABS MP-220, , , , , Black 4 MLAZ00 LABEL MLAZ0038303 PRINTING, (empty), , , , , White 4 MPBF00 PAD,FLEXIBLE PCB MPBF0021901 COMPLEX, (empty), , , , , Without Color 17 4 MPBZ00 PAD MPBZ0172201 COMPLEX, (empty), , , , , Without Color 25 4 MPBZ01 PAD MPBZ0183901 COMPLEX, (empty), , , , , Without Color 16 4 MTAB00 TAPE,PROTECTION MTAB0170401 COMPLEX, (empty), , , , , Without Color 1 4 MTAB01 TAPE,PROTECTION MTAB0176601 COMPLEX, (empty), , , , , Without Color 7 MBFP00 BRACKET,CAMERA MBFP0006501 MOLD, PC LUPOY SC-1004ML, , , , , 7 MTAK00 TAPE,CAMERA MTAK0000701 COMPLEX, (empty), , , , , Without Color 7 MTAZ00 TAPE MTAZ0189701 COMPLEX, (empty), , , , , Without Color 5 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Without Color Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 221 - Black 45 53 54 LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST 11.2 Replacement Parts

Level Location No 4 SNGF00 4 Part Name Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC Part Number Spec ANTENNA,GSM,FIXED SNGF0024701 3.0 ,-2 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL ,; ,QUAD ,-2.0 ,50 ,3.0 71 SUSY00 SPEAKER SUSY0022601 PIN ,8 ohm,90 dB,17 mm,Spring Contact Type 59 3 ACGQ00 COVER ASSY,SLIDE ACGQ0013301 Black 4 ACGK00 COVER ASSY,FRONT ACGK0080001 Black 4 SACY00 PCB ASSY,FLEXIBLE SACY0053101 5 SACB00 PCB ASSY,FLEXIBLE,INSERT SACB0035701 5 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0048001 6 SACC00 PCB ASSY,FLEXIBLE,SMT BOTTOM SACC0028501 7 CN100 CONNECTOR,BOARD TO BOARD ENBY0019501 6 SACD00 PCB ASSY,FLEXIBLE,SMT TOP SACD0039101 7 C100 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 7 C101 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 7 C102 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 7 CN101 CONNECTOR,BOARD TO BOARD ENBY0035901 40 PIN,0.4 mm,ETC , ,H=1.0, Plug 7 CN102 CONNECTOR,BOARD TO BOARD ENBY0022901 70 PIN,0.4 mm,ETC , ,H=0.9, Plug 7 D100 DIODE,SWITCHING EDSY0011901 EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) 7 FB100 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 , 7 FB101 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 , 7 L100 INDUCTOR,CHIP ELCH0005007 56 nH,J ,1005 ,R/TP , 7 R100 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 7 R101 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 7 R104 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 7 VA100 VARISTOR SEVY0003801 18 V, ,SMD , 7 VA101 VARISTOR SEVY0003801 18 V, ,SMD , 6 SPCY00 PCB,FLEXIBLE SPCY0072601 POLYI ,.4 mm,MULTI-4 , SLIDE-FPCB 4 SAJY00 PCB ASSY,SUB SAJY0022201 5 SAJB00 PCB ASSY,SUB,INSERT SAJB0010801 6 ADCA00 DOME ASSY,METAL ADCA0062701 5 SAJE00 PCB ASSY,SUB,SMT SAJE0016601 LGE Internal Use Only Color Remark LCD FPCB 20 PIN,.4 mm,ETC , ,H=1.5, Socket 14 Without Color - 222 - 13 Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 SAJC00 PCB ASSY,SUB,SMT BOTTOM SAJC0014901 7 C100 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 7 C101 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 7 C102 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 7 C103 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 7 C104 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 7 CN100 CONNECTOR,FFC/FPC ENQY0010901 35 PIN,0.3 mm,ETC , ,H=1.2 7 CN101 CONNECTOR,BOARD TO BOARD ENBY0036001 40 PIN,0.4 mm,ETC , ,H=1.0, Socket 7 D100 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE 7 D101 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE 7 D102 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE 7 D103 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE 7 D104 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE 7 R101 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 7 R102 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 7 R103 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 7 R104 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 7 R106 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 7 R107 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 7 R111 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 7 R112 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 7 R115 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 7 U100 IC EUSY0337001 TDFN33 ,12 PIN,R/TP ,3x3x1.0 7 VA101 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 7 VA102 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 7 VA103 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 7 VA105 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 7 VA107 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 7 ZD100 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 7 ZD101 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 6 SAJD00 PCB ASSY,SUB,SMT TOP SAJD0017001 7 LD100 DIODE,LED,CHIP EDLH0012501 Part Name Part Number Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Spec Color Remark Snow White ,1608 ,R/TP ,color concept - 223 - LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 7 LD101 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 7 LD102 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 7 LD103 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 7 LD104 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 7 LD105 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 7 LD106 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 7 LD107 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 7 LD108 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 7 R108 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 7 R109 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 7 R110 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 7 R113 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 7 R114 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 7 VA100 VARISTOR SEVY0000702 14 V,10% ,SMD , 7 VA104 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 7 VA106 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 6 SPJY00 PCB,SUB SPJY0025701 FR-4 ,0.8 mm,SBL 6 ,KS10 4 SJMY00 VIBRATOR,MOTOR SJMY0006508 3 V,.08 A,10*3.45 ,17mm , ,3V , , ,12500 , , , ,38 4 SURY00 RECEIVER SURY0012801 4 SVCY00 CAMERA SVCY0014001 CMOS ,VGA ,5.5x11.4x3.2t, Magna 1/7.4" 24 4 SVLM00 LCD MODULE SVLM0020701 MAIN ,2.4" 240*320 ,42.88*60.65 ,262k ,TFT ,TM ,BD663474 , 15 3 GMEY00 SCREW MACHINE,BIND GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK 3 MCCH00 CAP,SCREW MCCH0094001 COMPLEX, (empty), , , , , Black 3 MCCH01 CAP,SCREW MCCH0097701 MOLD, Urethane Rubber S190A, , , , , Black 3 MLAK00 LABEL,MODEL MLAK0006901 3 SAFY00 PCB ASSY,MAIN SAFY0184101 4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0071301 5 ACMY00 CAMERA ASSY ACMY0005701 Black 6 ABFZ00 BRACKET ASSY ABFZ0011401 Black 6 SVCY00 CAMERA SVCY0014101 5 ADCA00 DOME ASSY,METAL ADCA0062801 5 MAAA00 ABSORBER,ELECTROMAG NETIC WAVE MAAA0000101 COMPLEX, (empty), , , , , 5 SPKY00 PCB,SIDEKEY SPKY0034201 POLYI ,0.2 mm,DOUBLE ,POWER_SIDE_KEY 5 SPKY01 PCB,SIDEKEY SPKY0034401 POLYI ,0.2 mm,DOUBLE ,SIDE KEY(Volume) 4 SAFF00 PCB ASSY,MAIN,SMT SAFF0105101 Part Name LGE Internal Use Only Part Number Spec Color Remark 22 23 Without Color 78 51 CMOS ,MEGA ,2M AF(FPCB,Micron 1/4" SOC2020,90') Without Color - 224 - 49 Without Color Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 5 SAFC00 PCB ASSY,MAIN,SMT BOTTOM SAFC0084601 6 ANT400 ANTENNA,GSM,FIXED SNGF0023801 3.0 ,-2.0 dBd,, ,Chip, bluetooth ,; ,SINGLE ,-2.0 ,50 ,3.0 6 BAT700 BATTERY,CELL,LITHIUM SBCL0001305 3 V,1 mAh,COIN ,SMT Temp.260 degree. PB-Free B/B 6 C100 CAP,CERAMIC,CHIP ECCH0000275 0.33 uF,16V,Z,Y5V,HD,1608,R/TP 6 C101 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP 6 C102 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP 6 C103 CAP,CERAMIC,CHIP ECCH0000275 0.33 uF,16V,Z,Y5V,HD,1608,R/TP 6 C104 CAP,CERAMIC,CHIP ECCH0000275 0.33 uF,16V,Z,Y5V,HD,1608,R/TP 6 C105 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP 6 C106 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP 6 C107 CAP,CERAMIC,CHIP ECCH0000275 0.33 uF,16V,Z,Y5V,HD,1608,R/TP 6 C108 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C109 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP 6 C110 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C111 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C112 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C113 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C114 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C115 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C116 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C117 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C118 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C119 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C120 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C121 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C122 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C123 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C124 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C125 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C126 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C127 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C128 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C129 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C130 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C131 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C132 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Part Name Part Number Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Spec - 225 - Color Remark LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 C133 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C134 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C135 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C136 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C137 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C138 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C139 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C140 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C141 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C142 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C143 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C144 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C145 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C146 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C147 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C148 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C149 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C150 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C151 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C153 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C154 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C200 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C201 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C202 CAP,CERAMIC,CHIP ECCH0000157 15 nF,16V,K,X7R,HD,1005,R/TP 6 C203 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP 6 C204 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C205 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C206 CAP,CERAMIC,CHIP ECCH0000157 15 nF,16V,K,X7R,HD,1005,R/TP 6 C207 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C208 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C209 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C219 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP 6 C220 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C221 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C222 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C224 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C225 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP Part Name LGE Internal Use Only Part Number Spec - 226 - Color Remark Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 C226 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C227 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP 6 C228 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C229 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C230 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C232 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP 6 C233 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP 6 C234 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C235 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C236 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C240 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C241 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C242 CAP,TANTAL,CHIP ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP 6 C243 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C244 CAP,TANTAL,CHIP ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP 6 C245 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C246 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP 6 C247 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP 6 C248 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C249 CAP,CERAMIC,CHIP ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP 6 C250 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C251 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP 6 C252 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP 6 C253 CAP,TANTAL,CHIP ECTH0002002 33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty] ,[empty] 6 C254 CAP,CHIP,MAKER ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP 6 C255 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP 6 C256 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP 6 C257 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C258 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP 6 C259 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C260 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C262 CAP,CERAMIC,CHIP ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP 6 C263 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 6 C264 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C265 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C266 CAP,CERAMIC,CHIP ECCH0002004 0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP Part Name Part Number Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Spec - 227 - Color Remark LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 C267 CAP,CERAMIC,CHIP ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP 6 C300 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C301 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C302 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C303 CAP,CHIP,MAKER ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 6 C304 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 6 C305 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C306 CAP,CHIP,MAKER ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 6 C307 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 6 C310 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C311 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP 6 C312 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C313 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C314 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP 6 C317 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C318 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C319 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C321 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 6 C324 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C325 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C326 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C327 CAP,CHIP,MAKER ECZH0001503 0.47 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C328 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C329 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C330 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C331 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C332 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 6 C334 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C337 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C338 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C339 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C340 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C341 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C342 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C400 CAP,TANTAL,CHIP ECTH0002002 33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty] ,[empty] 6 C401 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Part Name LGE Internal Use Only Part Number Spec - 228 - Color Remark Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 C402 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 6 C403 CAP,CHIP,MAKER ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 6 C404 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C405 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C406 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C407 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C408 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C409 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C410 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 6 C411 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C412 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C416 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C417 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C421 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C422 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C500 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 C501 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C503 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP 6 C504 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C505 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP 6 C506 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C507 INDUCTOR,CHIP ELCH0001033 1.5 nH,S ,1005 ,R/TP ,PBFREE 6 C508 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C509 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP 6 C510 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP 6 C511 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP 6 C514 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C515 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C516 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C517 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C518 CAP,TANTAL,CHIP,MAKER ECTZ0006002 4.7 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 6 C519 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP 6 C520 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C521 CAP,CHIP,MAKER ECZH0001122 680 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 6 C522 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C523 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C524 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP Part Name Part Number Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Spec - 229 - Color Remark LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 C525 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C526 CAP,FILM,MPP ECFD0000604 6.8 nF,16V ,J ,NI ,SMD ,2012 mm,R/TP 6 C527 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C530 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C531 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C532 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C533 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C534 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C535 CAP,CERAMIC,CHIP ECCH0000137 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 6 C536 CAP,CHIP,MAKER ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C537 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP 6 C538 CAP,FILM,MPP ECFD0000703 3900 pF,16V ,J ,NI ,SMD ,2012 mm,R/TP 6 C539 CAP,FILM,MPP ECFD0000614 5.6 nF,16V ,J ,NI ,SMD ,2012 mm,R/TP 6 C540 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C541 CAP,CERAMIC,CHIP ECCH0000127 82 pF,50V,J,NP0,TC,1005,R/TP 6 C542 CAP,CERAMIC,CHIP ECCH0000138 390 pF,50V,K,X7R,HD,1005,R/TP 6 C543 CAP,TANTAL,CHIP ECTH0001704 22 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,2.2X1.25X1.2MM ,[empty] ,[empty] ,[empty] 6 C544 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C545 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C546 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C547 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C548 CAP,TANTAL,CHIP,MAKER ECTZ0006002 4.7 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 6 C549 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C550 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C551 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C552 CAP,CHIP,MAKER ECZH0001106 4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP 6 C553 CAP,TANTAL,CHIP,MAKER ECTZ0006002 4.7 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 6 C554 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C555 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C556 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP 6 C557 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP 6 C559 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C560 INDUCTOR,CHIP ELCH0005010 1.8 nH,S ,1005 ,R/TP , 6 C561 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP 6 C562 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C563 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP Part Name LGE Internal Use Only Part Number Spec - 230 - Color Remark Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 C566 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C567 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C568 CAP,TANTAL,CHIP ECTH0001903 22 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 6 C570 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C571 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C572 CAP,CERAMIC,CHIP ECCH0000145 1.5 nF,50V,K,X7R,HD,1005,R/TP 6 C573 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C574 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C575 INDUCTOR,CHIP ELCH0005010 1.8 nH,S ,1005 ,R/TP , 6 C580 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP 6 C600 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP 6 C601 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP 6 C602 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C603 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP 6 C604 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C605 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C606 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C607 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C612 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C613 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C614 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C615 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C616 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C617 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C618 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C619 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C620 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C621 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C622 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C623 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C624 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C625 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C626 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C627 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C628 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C629 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C630 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP Part Name Part Number Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Spec - 231 - Color Remark LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 C631 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C632 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C633 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C634 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C635 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C636 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C637 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C638 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C639 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C640 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C641 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C642 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C643 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C644 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C645 CAP,CERAMIC,CHIP ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP 6 C646 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C802 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 CN200 CONNECTOR,BOARD TO BOARD ENBY0015601 34 PIN,0.4 mm,STRAIGHT ,AU ,0.9MM HEIGHT 6 CN202 CONNECTOR,I/O ENRY0006801 18 PIN,0.4 mm,ETC , , ,; ,18 ,0.40MM ,ANGLE ,RECEPTACLE ,SMD ,R/TP , 6 CN203 CONNECTOR,ETC ENZY0017601 3 PIN,2.5 mm,ETC , ,H=2.5 6 CN402 CONNECTOR,BOARD TO BOARD ENBY0016701 20 PIN,0.4 mm,STRAIGHT ,AU ,0.9 STACKING,MALE 6 D201 DIODE,TVS EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE 6 D300 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE 6 D301 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE 6 D400 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 6 D401 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 6 D402 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 6 D700 DIODE,SWITCHING EDSY0011901 EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) 6 FB245 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB500 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 , 6 FB501 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 , 6 FB502 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 , 6 FB503 FILTER,BEAD,CHIP SFBH0002301 1000 ohm,1608 ,CHIP FERRITE BEAD BLM11 Part Name LGE Internal Use Only Part Number Spec - 232 - Color Remark Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 FL400 FILTER,SAW SFSY0027301 2450 MHz,2.0*1.5*1.0 ,SMD ,Pb-free_B/T_SAW 6 FL500 FILTER,SEPERATOR SFAY0007601 900.1800 ,1900.2100 , dB, dB, dB, dB,ETC ,GSM TRIPLE, WCDMA2100 Quad Band FEM, 6.5X4.8X1.5 Size 6 J300 CONN,SOCKET ENSY0001602 6 PIN,ETC ,5 IRECTIONAL ,2.54 mm,K(GC200) 6 L300 INDUCTOR,SMD,POWER ELCP0009401 4.7 uH,M ,2.8*2.6*1.0 ,R/TP , 6 L301 INDUCTOR,SMD,POWER ELCP0009401 4.7 uH,M ,2.8*2.6*1.0 ,R/TP , 6 L302 INDUCTOR,CHIP ELCH0001022 56 nH,J ,1005 ,R/TP ,Pb Free 6 L500 INDUCTOR,CHIP ELCH0001405 3.3 nH,S ,1005 ,R/TP ,PBFREE 6 L501 INDUCTOR,CHIP ELCH0003816 3.6 nH,S ,1005 ,R/TP , 6 L502 CAP,CHIP,MAKER ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 L503 INDUCTOR,CHIP ELCH0010401 2.2 uH,M ,1005 ,R/TP , 6 L504 INDUCTOR,CHIP ELCH0001022 56 nH,J ,1005 ,R/TP ,Pb Free 6 L505 INDUCTOR,CHIP ELCH0003816 3.6 nH,S ,1005 ,R/TP , 6 L506 INDUCTOR,CHIP ELCH0010401 2.2 uH,M ,1005 ,R/TP , 6 L507 INDUCTOR,CHIP ELCH0003814 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005 6 L508 INDUCTOR,CHIP ELCH0003817 7.5 nH,J ,1005 ,R/TP , 6 L509 INDUCTOR,CHIP ELCH0010401 2.2 uH,M ,1005 ,R/TP , 6 L510 INDUCTOR,CHIP ELCH0001405 3.3 nH,S ,1005 ,R/TP ,PBFREE 6 L511 INDUCTOR,CHIP ELCH0003817 7.5 nH,J ,1005 ,R/TP , 6 L512 INDUCTOR,CHIP ELCH0010401 2.2 uH,M ,1005 ,R/TP , 6 L513 INDUCTOR,CHIP ELCH0003814 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005 6 L514 INDUCTOR,CHIP ELCH0003817 7.5 nH,J ,1005 ,R/TP , 6 L515 INDUCTOR,CHIP ELCH0001421 47 nH,J ,1005 ,R/TP ,PBFREE 6 L516 INDUCTOR,CHIP ELCH0001428 10 nH,J ,1005 ,R/TP , 6 L517 INDUCTOR,CHIP ELCH0003818 9.1 nH,J ,1005 ,R/TP , 6 L518 INDUCTOR,CHIP ELCH0001421 47 nH,J ,1005 ,R/TP ,PBFREE 6 L519 INDUCTOR,CHIP ELCH0003818 9.1 nH,J ,1005 ,R/TP , 6 L520 INDUCTOR,CHIP ELCH0001428 10 nH,J ,1005 ,R/TP , 6 L521 INDUCTOR,CHIP ELCH0001421 47 nH,J ,1005 ,R/TP ,PBFREE 6 L522 INDUCTOR,CHIP ELCH0001402 18 nH,J ,1005 ,R/TP ,Pb Free 6 L523 INDUCTOR,CHIP ELCH0001413 22 nH,J ,1005 ,R/TP ,PBFREE 6 L524 INDUCTOR,CHIP ELCH0001404 1.5 nH,S,1005,R/TP 6 L525 INDUCTOR,CHIP ELCH0005016 8.2 nH,J ,1005 ,R/TP , 6 L526 INDUCTOR,CHIP ELCH0005012 3.9 nH,S ,1005 ,R/TP , 6 L527 CAP,CERAMIC,CHIP ECCH0000701 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 L600 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , 6 MIC200 MICROPHONE SUMY0009203 UNIT ,42 dB,4*1.5 ,Reverse TYPE Part Name Part Number Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Spec - 233 - Color Remark LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 Q700 TR,BJT,PNP EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680 6 Q701 TR,FET,P-CHANNEL EQFP0008601 DFN8 ,1.3 W,-20 V,-3.9 A,R/TP ,Intergrated power MOSFET with PNP Transistor 6 R100 RES,CHIP,MAKER ERHZ0000295 51 Kohm,1/16W ,F ,1005 ,R/TP 6 R101 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R102 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R103 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP 6 R105 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP 6 R106 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP 6 R107 RES,CHIP,MAKER ERHZ0000459 3 Kohm,1/16W ,J ,1005 ,R/TP 6 R108 RES,CHIP,MAKER ERHZ0000459 3 Kohm,1/16W ,J ,1005 ,R/TP 6 R109 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP 6 R110 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP 6 R111 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP 6 R112 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R113 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R114 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R115 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R200 RES,CHIP,MAKER ERHZ0000433 180 Kohm,1/16W ,J ,1005 ,R/TP 6 R201 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R202 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP 6 R203 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP 6 R204 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP 6 R205 RES,CHIP,MAKER ERHZ0000433 180 Kohm,1/16W ,J ,1005 ,R/TP 6 R206 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R208 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R210 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R211 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R212 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R213 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R214 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R215 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R221 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP 6 R222 RES,CHIP,MAKER ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP 6 R223 RES,CHIP,MAKER ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP 6 R224 RES,CHIP,MAKER ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP 6 R226 RES,CHIP,MAKER ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP Part Name LGE Internal Use Only Part Number Spec - 234 - Color Remark Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 R227 6 Part Name Part Number Spec RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP R228 RES,CHIP ERHY0011601 11 Kohm,1/16W ,F ,1005 ,R/TP 6 R229 RES,CHIP,MAKER ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP 6 R230 RES,CHIP,MAKER ERHZ0000507 68 Kohm,1/16W ,J ,1005 ,R/TP 6 R231 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R232 RES,CHIP,MAKER ERHZ0000507 68 Kohm,1/16W ,J ,1005 ,R/TP 6 R233 RES,CHIP,MAKER ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP 6 R300 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R303 RES,CHIP,MAKER ERHZ0000287 47 Kohm,1/16W ,F ,1005 ,R/TP 6 R305 RES,CHIP,MAKER ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP 6 R306 RES,CHIP,MAKER ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP 6 R307 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP 6 R308 RES,CHIP,MAKER ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP 6 R309 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R310 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R311 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R313 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R314 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R315 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP 6 R401 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R404 RES,CHIP ERHY0000101 0 ohm,1/16W,F,1005,R/TP 6 R410 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R420 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP 6 R421 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP 6 R500 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP 6 R501 RES,CHIP ERHY0000253 4.3K ohm,1/16W,J,1005,R/TP 6 R502 RES,CHIP,MAKER ERHZ0000286 4700 ohm,1/16W ,F ,1005 ,R/TP 6 R503 RES,CHIP,MAKER ERHZ0003203 11.3 Kohm,1/16W ,F ,1005 ,R/TP 6 R504 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R505 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R506 RES,CHIP ERHY0000186 2.2 Kohm,1/16W ,F ,1005 ,R/TP 6 R507 RES,CHIP,MAKER ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP 6 R508 RES,CHIP ERHY0000101 0 ohm,1/16W,F,1005,R/TP 6 R509 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP 6 R510 RES,CHIP,MAKER ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP 6 R511 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R512 RES,CHIP,MAKER ERHZ0000307 6200 ohm,1/16W ,F ,1005 ,R/TP Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 235 - Color Remark LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 R513 RES,CHIP,MAKER ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP 6 R514 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R515 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP 6 R516 RES,CHIP,MAKER ERHZ0000419 15 ohm,1/16W ,J ,1005 ,R/TP 6 R517 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R518 RES,CHIP,MAKER ERHZ0000419 15 ohm,1/16W ,J ,1005 ,R/TP 6 R519 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R520 RES,CHIP ERHY0003501 220 ohm,1/16W ,J ,1005 ,R/TP 6 R521 RES,CHIP ERHY0003501 220 ohm,1/16W ,J ,1005 ,R/TP 6 R522 RES,CHIP,MAKER ERHZ0000531 270 ohm,1/16W ,J ,1005 ,R/TP 6 R523 RES,CHIP,MAKER ERHZ0000531 270 ohm,1/16W ,J ,1005 ,R/TP 6 R524 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP 6 R530 INDUCTOR,CHIP ELCH0005012 3.9 nH,S ,1005 ,R/TP , 6 R531 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP 6 R600 RES,CHIP,MAKER ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP 6 R601 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R602 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R603 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R604 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R605 RES,CHIP ERHY0000105 51 ohm,1/16W,F,1005,R/TP 6 R606 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R607 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP 6 R608 RES,CHIP,MAKER ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP 6 R609 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R610 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP 6 R611 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R713 RES,CHIP,MAKER ERHZ0003901 .1 ohm,1/4W ,F ,2012 ,R/TP 6 R714 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R715 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R729 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R730 RES,CHIP,MAKER ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP 6 S300 CONN,SOCKET ENSY0018901 8 PIN,ETC , ,2.54 mm,Micro-SD, Reverse 6 SW500 CONN,RF SWITCH ENWY0002304 STRAIGHT ,SMD ,0.8 dB,MUSE MODEL 6 U100 IC EUSY0269702 BGA(14*14) ,355 PIN,R/TP ,1Gbit NAND+512Mbit DDR SDRAM, 3G Smart Phone for Open OS MAP 6 U101 IC EUSY0149402 SOT-553 ,5 PIN,R/TP ,Single 2 Input AND Gate 6 U102 IC EUSY0149402 SOT-553 ,5 PIN,R/TP ,Single 2 Input AND Gate Part Name LGE Internal Use Only Part Number Spec - 236 - Color Remark Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 U103 IC EUSY0149402 SOT-553 ,5 PIN,R/TP ,Single 2 Input AND Gate 6 U201 IC EUSY0198601 SOT-666 ,6 PIN,R/TP ,Single SPDT Analog Switch 6 U202 IC EUSY0269401 I2C Dual Codec ,48 PIN,R/TP , 6 U204 IC EUSY0263301 SC-88(2.0x2.1) ,6 PIN,R/TP ,Single SPDT Switch, Pb Free 6 U206 IC EUSY0317101 WQFN ,10 PIN,R/TP ,1.8*1.4*0.75 6 U208 IC EUSY0335701 QFN ,8 PIN,R/TP ,1.2W, Mono, Differencial Audio AMP 6 U300 IC EUSY0300101 WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog Switch, PB-Free 6 U302 IC EUSY0064501 6 U303 IC EUSY0064501 6 U304 IC EUSY0241401 FLIP-CHIP 5 ,5 PIN,R/TP ,1-BIT DUAL SUP. BUS BUFFER LEVEL TRANS / 26 OHM SERIES ON A 6 U307 IC EUSY0223003 HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT CONTROL / 3.3V 6 U308 IC EUSY0241401 FLIP-CHIP 5 ,5 PIN,R/TP ,1-BIT DUAL SUP. BUS BUFFER LEVEL TRANS / 26 OHM SERIES ON A 6 U310 IC EUSY0269501 TFBGA ,84 PIN,R/TP ,PMIC for Application Processor Engine of STM, Pb Free 6 U311 IC EUSY0162301 SOT-553 ,5 PIN,R/TP ,Single 2 Input OR Gate 6 U312 IC EUSY0149402 SOT-553 ,5 PIN,R/TP ,Single 2 Input AND Gate 6 U313 IC EUSY0241401 FLIP-CHIP 5 ,5 PIN,R/TP ,1-BIT DUAL SUP. BUS BUFFER LEVEL TRANS / 26 OHM SERIES ON A 6 U400 IC EUSY0064501 SOT-23-5 ,5 PIN,R/TP ,2.7V LDO REGULATOR,PBFREE 6 U401 IC EUSY0293401 VFBGA ,48 PIN,R/TP ,Bluetooth Single Chip(V2.0+EDR) 6 U405 IC EUSY0269201 Flip-Chip20 ,20 PIN,R/TP ,8 bit Level Translator, Pb Free 6 U407 IC EUSY0269201 Flip-Chip20 ,20 PIN,R/TP ,8 bit Level Translator, Pb Free 6 U500 IC EUSY0203802 QFN ,56 PIN,R/TP ,GSM/WCDMA TRANSMITTER & GSM RECEIVER 6 U501 PAM SMPY0013501 35 dBm,51 %, A, dBc, dB,7x7x1.1 ,SMD ,Polar Edge 6 U502 VCO EXSC0009201 MHz, PPM, pF,SMD ,5.5*4.8*1.5 ,824MHz ~ 915MHz, 1710MHz ~ 1910MHz, 14pin 6 U503 FILTER,SAW SFSY0023001 1950 MHz,2.0*1.4*0.8 ,SMD ,5pin, Unbal-Unbal, 50//50 6 U504 IC EUSY0280501 , PIN,R/TP , 6 U505 PAM SMPY0013301 dBm,43 %, A,-40 dBc,26 dB,4x4x1.1 ,SMD ,2.1GHz, HSDPA 6 U506 DUPLEXER,GSM SDGY0000701 1950 MHz,2140 MHz,1.6 dB,1 dB,45 dB,51 dB,3.8*3.8*1.4 ,SMD ,WCDMA (FBAR) 6 U507 COUPLER,RF DIRECTIONAL SCDY0003402 -20 dB,-0.25 dB,-35 dB,1.0*0.58*0.35 ,SMD ,1850M ~ 1910M, 4pin, Pb Free 6 U600 IC EUSY0241701 BALL CSP ,409 PIN,R/TP ,WCDMA/GSM/GPRS/EDGE/HSDPA MODEM 6 VA200 VARISTOR SEVY0003801 18 V, ,SMD , Part Name Part Number Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Spec Color Remark SOT-23-5 ,5 PIN,R/TP ,2.7V LDO REGULATOR,PBFREE SOT-23-5 ,5 PIN,R/TP ,2.7V LDO REGULATOR,PBFREE - 237 - LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 VA201 VARISTOR SEVY0003801 18 V, ,SMD , 6 VA208 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 6 VA209 VARISTOR SEVY0003602 5.6 V, ,SMD ,1005, 60pF 6 VA210 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 6 VA211 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 6 VA212 VARISTOR SEVY0003801 18 V, ,SMD , 6 VA213 VARISTOR SEVY0003801 18 V, ,SMD , 6 VA300 VARISTOR SEVY0003801 18 V, ,SMD , 6 VA301 VARISTOR SEVY0003801 18 V, ,SMD , 6 VA302 VARISTOR SEVY0003801 18 V, ,SMD , 6 VA303 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005 6 X100 OSCILLATOR EXSY0022201 19.2 MHz,20 PPM,15 pF,SMD ,3.2*2.5*1.0 ,1.71V ~ 1.89V, -20'C ~ +70'C ,; ,19.2MHz ,20PPM ,1.8V ,3.2 ,2.5 ,1.0 , ,SMD ,R/TP 6 X400 OSCILLATOR EXSY0022201 19.2 MHz,20 PPM,15 pF,SMD ,3.2*2.5*1.0 ,1.71V ~ 1.89V, -20'C ~ +70'C ,; ,19.2MHz ,20PPM ,1.8V ,3.2 ,2.5 ,1.0 , ,SMD ,R/TP 6 X600 RESONATOR EXRY0002401 48 MHz,.5 %,14 pF,SMD ,2.0*1.2*0.65 ,Outgoing Tolerance 0.2%, 0.05% at -40'C ~ +85C, Built-In Cap 5 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0083601 6 C210 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP 6 C211 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C212 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP 6 C213 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C214 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C215 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP 6 C216 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C217 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C218 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP 6 C237 CAP,TANTAL,CHIP ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP 6 C238 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C239 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP 6 C308 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C309 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 6 C320 CAP,TANTAL,CHIP ECTH0002002 33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty] ,[empty] 6 C322 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C413 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C414 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Part Name LGE Internal Use Only Part Number Spec - 238 - Color Remark Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 C415 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C418 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C419 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C420 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C558 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C564 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C565 CAP,CERAMIC,CHIP ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP 6 C569 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP 6 C577 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C578 CAP,CHIP,MAKER ECZH0000853 8.2 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP 6 C579 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C581 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C582 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C583 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C584 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C585 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C586 CAP,CERAMIC,CHIP ECCH0000173 1.2 pF,16V ,B ,NP0 ,TC ,1005 ,R/TP 6 C587 CAP,CHIP,MAKER ECZH0001122 680 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 6 C588 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C589 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP 6 C590 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C591 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C592 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C593 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C594 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C595 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP 6 C596 CAP,CHIP,MAKER ECZH0000839 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 C597 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C598 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C599 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 6 C700 CAP,TANTAL,CHIP ECTH0002002 33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] , ,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty] ,[empty] 6 C701 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C702 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C703 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C704 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C705 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP Part Name Part Number Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Spec - 239 - Color Remark LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 C706 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C707 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C708 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C709 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C710 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C711 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C712 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 6 C713 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 6 C714 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C715 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C716 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C717 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C718 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C719 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C720 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C721 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C722 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C723 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C724 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C725 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 6 C726 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C727 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP 6 C728 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 6 C729 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C730 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C731 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C732 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 6 C733 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP 6 C734 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP 6 C735 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C736 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C737 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C738 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C739 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP 6 C760 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP 6 C761 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP 6 C800 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Part Name LGE Internal Use Only Part Number Spec - 240 - Color Remark Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 CN201 6 Part Name Part Number Spec CONNECTOR,BOARD TO BOARD ENBY0022801 70 PIN,0.4 mm,ETC , ,H=0.9, Socket D200 DIODE,TVS EDTY0008602 SOD-323 ,13.3 V,400 W,R/TP ,PB-FREE 6 D403 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 6 D404 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 6 D405 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 6 D701 DIODE,SWITCHING EDSY0011901 EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) 6 FB204 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 , 6 FB205 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 , 6 FB206 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 , 6 FB207 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 , 6 FB221 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB222 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 , 6 FB223 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB224 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB225 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB227 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB229 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB230 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB231 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB232 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB233 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB234 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB235 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB236 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB237 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB238 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB239 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 241 - Color Remark LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 Part Name Part Number FB240 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB241 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB242 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB243 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FB244 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty] ,R/TP 6 FL200 FILTER,EMI/POWER SFEY0013601 SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm, 7.5pF) 6 FL201 FILTER,EMI/POWER SFEY0013601 SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm, 7.5pF) 6 FL202 FILTER,EMI/POWER SFEY0013601 SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm, 7.5pF) 6 FL203 FILTER,EMI/POWER SFEY0013601 SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm, 7.5pF) 6 FL204 FILTER,EMI/POWER SFEY0013201 SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 100ohm 6 FL205 FILTER,EMI/POWER SFEY0013201 SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 100ohm 6 FL206 FILTER,EMI/POWER SFEY0013601 SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm, 7.5pF) 6 FL207 FILTER,EMI/POWER SFEY0013201 SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 100ohm 6 FL208 FILTER,EMI/POWER SFEY0013201 SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 100ohm 6 FL501 FILTER,SAW SFSY0025601 2140 MHz,2.0*1.4*0.68 ,SMD ,Balanced Output (100ohm) 6 L528 INDUCTOR,CHIP ELCH0005002 2.7 nH,S ,1005 ,R/TP , 6 L529 INDUCTOR,CHIP ELCH0005006 33 nH,J ,1005 ,R/TP , 6 L530 INDUCTOR,CHIP ELCH0005001 2.2 nH,S ,1005 ,R/TP , 6 L531 INDUCTOR,CHIP ELCH0005002 2.7 nH,S ,1005 ,R/TP , 6 L532 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP , 6 L533 INDUCTOR,CHIP ELCH0003815 2.7 nH,S ,1005 ,R/TP , 6 L700 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , 6 L701 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , 6 LD400 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 6 LD401 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 6 LD402 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 6 LD403 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 6 LD404 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 6 LD405 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 6 LD406 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 6 LD407 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept 6 Q500 TR,BJT,ARRAY EQBA0000301 SC-88A,0.15W,R/TP,NPN/PNP DUAL 6 R207 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R216 RES,CHIP,MAKER ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP LGE Internal Use Only Spec - 242 - Color Remark Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 R217 6 Part Name Part Number Spec RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP R218 RES,CHIP,MAKER ERHZ0000467 330 Kohm,1/16W ,J ,1005 ,R/TP 6 R219 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R400 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R402 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R403 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R405 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R406 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R408 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R409 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R411 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R412 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R413 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R414 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP 6 R415 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP 6 R416 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R417 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R418 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R419 RES,CHIP,MAKER ERHZ0000507 68 Kohm,1/16W ,J ,1005 ,R/TP 6 R525 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP 6 R526 RES,CHIP,MAKER ERHZ0000318 80.6 Kohm,1/16W ,F ,1005 ,R/TP 6 R527 THERMISTOR SETY0000903 NTC ,68000 ohm,SMD ,+/- 10% / 2012 SIZE, Pb Free 6 R528 RES,CHIP,MAKER ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP 6 R529 RES,CHIP,MAKER ERHZ0000502 6200 ohm,1/16W ,J ,1005 ,R/TP 6 R532 RES,CHIP,MAKER ERHZ0003203 11.3 Kohm,1/16W ,F ,1005 ,R/TP 6 R533 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP 6 R534 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP 6 R535 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP 6 R701 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R702 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP 6 R703 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R704 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP 6 R705 RES,CHIP,MAKER ERHZ0004201 121000 ohm,1/16W ,F ,1005 ,R/TP 6 R706 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP 6 R707 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R708 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP 6 R709 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes - 243 - Color Remark LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 R710 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP 6 R711 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP 6 R712 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R716 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R718 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R719 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R720 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R721 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R722 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R723 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R724 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R725 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R726 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R727 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 R728 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP 6 RA400 RES,ARRAY,R ERNR0000404 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP 6 SPFY01 PCB,MAIN SPFY0108901 FR-4 ,1 mm,STAGGERED-10 ,IVH(3-8), JOY 6 U200 IC EUSY0317101 WQFN ,10 PIN,R/TP ,1.8*1.4*0.75 6 U203 IC EUSY0250501 SC70 ,5 PIN,R/TP ,Comparator, pin compatible to EUSY0077701 6 U205 FILTER,EMI/POWER SFEY0006501 SMD ,3 TERMINAL EMI FILTER 6 U207 IC EUSY0333701 TLLGA ,8 PIN,R/TP ,OVP 6 U301 IC EUSY0223006 HVSOF5 ,5 PIN,R/TP ,1.8V ,150mA LDO 6 U306 IC EUSY0232802 sot 23-5 ,5 PIN,R/TP ,2.8V,150mA LDO 6 U402 IC EUSY0200301 Leadless chip ,6 PIN,R/TP ,Hall S/W, Pb Free 6 U403 IC EUSY0254201 DFN ,12 PIN,R/TP ,Dual SPDT Analog Switch(Pb Free) 6 U404 IC EUSY0270601 Microarray ,49 PIN,R/TP ,Key Scan Controller(up to 72 keys), Pb Free 6 U406 IC EUSY0317101 WQFN ,10 PIN,R/TP ,1.8*1.4*0.75 6 U508 IC EUSY0246002 QFN ,48 PIN,R/TP ,UMTS-1900/-2100 and GPS RF Receiver IC 6 U700 IC EUSY0306301 BCCS ,84 PIN,R/TP ,PMIC(MSMC 1.375V) (Rev.M), Pb Free 6 U701 IC EUSY0297301 11*14*1.2 ,225 PIN,R/TP ,NAND(90nm), DRAM(90nm) 6 VA202 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 6 VA203 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005 6 VA204 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 6 VA205 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 6 VA206 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 Part Name LGE Internal Use Only Part Number Spec - 244 - Color Remark Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes 11. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No 6 VA207 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 6 VA400 VARISTOR SEVY0000702 14 V,10% ,SMD , 6 VA401 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 6 VA402 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 6 VA403 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 6 VA404 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 6 VA405 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 6 VA406 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 6 VA407 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005 6 X200 OSCILLATOR EXSY0022103 27 MHz,50 PPM,15 pF,SMD ,3.2*2.5*1.0 ,2.3V ~ 3.2V, 20'C ~ +70'C ,; ,27MHz ,50PPM ,2.8V ,3.2 ,2.5 ,1.0 , ,SMD ,R/TP 6 X500 VCTCXO EXSK0007801 19.2 MHz,2 PPM,10 pF,SMD ,3.3*2.5*1.0 ,2ppm at 30~+85, AFC 0.4V~2.4V, 2.8V ,; ,19.2MHz ,2PPM ,2.8V ,3.3mm ,2.5mm ,1.0mm , ,SMD ,R/TP 6 X700 X-TAL EXXY0018701 32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9 , 6 ZD1 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW ,[empty] ,[empty] ,2P ,1 Part Name Part Number Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Spec - 245 - Color Remark LGE Internal Use Only 11. EXPLODED VIEW & REPLACEMENT PART LIST Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC 11.3 Accessory Level Location No Part Name Part Number Spec Color 3 ADEY00 DATA KIT ADEY0009701 KS10 CD Ass'y for Italy 4 MCHZ00 COMPACT DISK MCHZ0036101 COMPLEX, (empty), , , , , SILVER SNOW 4 MEAY00 ENVELOPE MEAY0000401 PRINTING, (empty), , , , , Without Color 3 SBPP00 BATTERY PACK,LIPOLYMER 3 SDGY00 3 SGEY00 3 SSAD00 DATA CABLE EAR PHONE/EAR MIKE SET ADAPTOR,AC-DC Without Color SBPP0021101 3.7 V,950 mAh,1 CELL,PRISMATIC ,KS10 ITAML Batt, Europe Label, Pb-Free ,; ,3.7 ,950 ,0.2C ,PRISMATIC ,59x38x37 , ,BLACK ,Hardpack ,Europe Label SGDY0010901 LG-US03K ,18pin USB DataCable SGEY0005516 GSM FORDER ,KG320(C2EAR PHONE) SSAD0021002 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug ADAPTOR,AC-DC SSAD0021001 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug ADAPTOR,AC-DC SSAD0021004 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug ADAPTOR,AC-DC SSAD0021005 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug ADAPTOR,AC-DC SSAD0021006 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug ADAPTOR,AC-DC SSAD0021008 LGE Internal Use Only Remark Metal Black 100-240V ,5060 Hz,4.8 V,0.9 A,CE&CB ,18pin Plug ,; , , , , , ,[empty] ,I/O CONNECTOR , - 246 - Copyright © 2007 LG Electronics. Inc. All right reserved. Only for training and service purposes Note Note