LG KS10 Manual

User Manual: LG-KS10-Manual

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Date: July, 2007 / Issue 1.0

Service Manual Model : KS10

Service Manual

KS10

- 3 -

1. INTRODUCTION.................................. 5

1.1 Purpose ...................................................... 5

1.2 Regulatory Information ............................... 5

2. PERFORMANCE ..................................7

2.1 System Overview.........................................7

2.2 Usable environment.....................................8

2.3 Radio Performance......................................8

2.4 Current Consumption.................................14

2.5 RSSI BAR ..................................................14

2.6 Battery BAR ...............................................15

2.7 Sound Pressure Level ...............................16

2.8 Charging ....................................................16

3. TECHNICAL BRIEF............................17

3.1 General Description ...................................17

3.2 GSM Mode.................................................19

3.3 UMTS Mode...............................................23

3.4 LO Phase-locked Loop ..............................26

3.5 Off-chip RF Components ...........................29

3.6 Digital Baseband

(Stn8810 / MSM6275)................................34

3.7. Hardware Architecture ..............................36

3.8. Subsystem of STn8810 ............................39

3.9. Hardware Peripheral system of

Stn8810 ....................................................42

3.10. Subsystem of MSM6275.........................47

3.11. External memory interface......................50

3.12. Hardware sub system of MSM6275........51

3.13. Audio and sound.....................................61

3.14. Camera interface ....................................67

3.15 Bluetooth..................................................76

3.16 Main Features..........................................77

4. TROUBLE SHOOTING.......................83

4.1 RF Component ..........................................83

4.2 SIGNAL PATH ...........................................85

4.3 Checking VCXO Block...............................87

4.4 Checking Ant. Switch Module Block ..........91

4.5 Checking WCDMA Block ...........................93

4.6 Checking GSM Block...............................103

4.7 Power on trouble......................................111

4.8 USB trouble .............................................114

4.9 SIM detect trouble....................................115

4.10 Key sense trouble ..................................116

4.11 Keypad backlight trouble .......................118

4.12 Folder on/off trouble...............................120

4.13 Micro SD trouble ....................................122

4.14 Charging trouble ....................................124

4.15 Audio trouble..........................................127

4.16 Camera trouble ......................................143

4.17 Main LCD trouble...................................149

4.18 Bluetooth trouble....................................152

5. DOWNLOAD.....................................155

5.1 Composition omposition ..........................155

5.2 LGDP2 Program install LGDP2 Program

install........................................................156

5.3 USB Driver setup USB Driver setup ........159

5.4 KS10 LGDP2 run file & DLL file setup .....162

5.5 Execute LGDP2 program.........................163

6. BLOCK DIAGRAM ...........................178

6.1 GSM & WCDMA RF Block.......................178

6.2 Interface Diagram ....................................180

6.3 KS10 Modem & Baseband

Block Diagram .........................................184

6.4 KS10 Application Processor Block

Diagram ...................................................185

6.5 KS10 Audio & BT Block Diagram ............186

Table Of Contents

LGE Internal Use Only

Only for training and service purposes

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6.6 KS10 Camera Block Diagram .................187

6.7 KS10 LCD Block Diagram ......................188

6.8 KS10 Power Distribution Diagram ...........189

6.9 KS10 Clock Distribution Diagram ...........190

7. Circuit Diagram................................177

8. PCB LAYOUT ...................................202

9. Usage of Hot-Kimchi .......................209

9.1 Usage of Hot-Kimchi................................195

10. Engineering Mode .........................212

10.1 Version Info............................................213

10.2 Device Test............................................213

10.3 Factory Reset ........................................214

10.4 MTC .......................................................214

10.5 Save Log................................................214

11. EXPLODED VIEW & REPLACEMENT

PART LIST ..................................... 216

10.1 EXPLODED VIEW ................................ 216

10.2 Replacement Parts

<Mechanic component> ....................... 219

<Main component> ............................... 222

10.3 Accessory ............................................. 246

LGE Internal Use Only

Only for training and service purposes

- 5 -

LGE Internal Use Only

Only for training and service purposes

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the

features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system.

There are may be risks of toll fraud associated with your telecommunications system. System users

are responsible for programming and configuring the equipment to prevent unauthorized use. The

manufacturer does not warrant that this product is immune from the above case but will prevent

unauthorized use of commoncarrier telecommunication service of facilities accessed through or

connected to it. The manufacturer will not be responsible for any charges that result from such

unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly

causing harm or interruption in service to the telephone network, it should disconnect telephone

service until repair can be done. A telephone company may temporarily disconnect service as long as

repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these

changes could reasonably be expected to affect the use of the phones or compatibility with the net

work, the telephone company is required to give advanced written notice to the user, allowing the user

to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the manufacturer or its authorized

agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system

and may void any remaining warranty.

1. INTRODUCTION

- 6 -

LGE Internal Use Only

Only for training and service purposes

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information

such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly

different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from

unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.

Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is

also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as

described.

1. INTRODUCTION

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LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

2.1 System Overview

2. PERFORMANCE

Item Specification

Shape GSM900/1800/1900 and WCDMA Slide Handset

Size 104 X 52 X 18.9 mm

Weight 118 g (with 950mAh Battery)

Power 3.7V normal, 950 mAh Li-Polymer

Talk Time Over 150 min (WCDMA, Tx=12 dBm, Voice)

(with 950mAh) Over 175 min (GSM, Tx=Max, Voice)

Standby Time Over 200 Hrs (WCDMA, DRX=1.28)

(with 950mAh) Over 220 Hrs (GSM, Paging period=9)

Antenna Internal type and Antenna

LCD Main 240 X 320 pixel TFT (QVGA LCD Module)

LCD Backlight Blue LED Back Light (main only)

Camera Dual Camera ; 1.3 Mega pixel (CMOS), VGA Camera (CMOS)

Vibrator Yes (Cylinder Type)

LED Indicator No

MIC Yes

Receiver Yes

Earphone Jack Yes

Connectivity Bluetooth, USB

Volume Key Push Type(+, -)

External Memory Micro-SD

I/O Connect 18 Pin

- 8 -

LGE Internal Use Only

Only for training and service purposes

2.2 Usable environment

1) Environment

2) Environment (Accessory)

* CLA : 12 ~ 24 V(DC)

2.3 Radio Performance

1) Transmitter - GSM Mode

* In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910

2. PERFORMANCE

Item Specification

Voltage 3.7 V(Typ), [Shut Down : 3.22 V]

Operation Temp -20 ~ +60°C

Storage Temp -20 ~ +70°C

Humidity 85 % (Max)

Reference Spec. Min Typ. Max Unit

TA Power Available power 100 220 240 Vac

No Item GSM DCS & PCS

100k~1GHz -39dBm

9k ~ 1GHz -39dBm

MS allocated 1G~[A]MHz -33dBm

Channel

1G~12.75GHz -33dBm

[A]M~[B]MHz -39dBm

Conducted [B]M~12.75GHz -33dBm

1Spurious 100k~880MHz -60dBm 100k~880MHz -60dBm

Emission 880M~915MHz -62dBm 880M~915MHz -62dBm

Idle Mode

915M~1GHz -60dBm 915M~1GHz -60dBm

1G~[A]MHz -50dBm 1G~[A]MHz -50dBm

[A]M~[B]MHz -56dBm [A]M~[B]MHz -56dBm

[B]M~12.5GHz -50dBm [B]M~12.5GHz -50dBm

- 9 -

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

* In case of DCS : [A] -> 1710, [B] -> 1785 * In case of PCS : [A] -> 1850, [B] -> 1910

No Item GSM DCS & PCS

30M ~ 1GHz -36dBm

30M~1GHz -36dBm

MS allocated 1G~[A]MHz -30dBm

Channel

1G ~ 4GHz -30dBm

[A]M~[B]MHz -36dBm

Radiated [B]M~4GHz -30dBm

2Spurious 30M ~ 880MHz -57dBm 30M~880MHz -57dBm

Emission 880M ~ 915MHz -59dBm 880M~915MHz -59dBm

Idle Mode

915M~1GHz -57dBm 915M~1GHz -57dBm

1G~[A]MHz -47dBm 1G~[A]MHz -47dBm

[A]M~[B]MHz -53dBm [A]M~[B]MHz -53dBm

[B]M~4GHz -47dBm [B]M~4GHz -47dBm

3Frequency Error ±0.1ppm ±0.1ppm

4Phase Error

±5(RMS) ±5(RMS)

±20(PEAK) ±20(PEAK)

3dB below reference sensitivity 3dB below reference sensitivity

Frequency Error RA250 : ±200Hz RA250: ±250Hz

5Under Multipath and HT100 : ±100Hz HT100: ±250Hz

Interference Condition TU50 : ±100Hz TU50: ±150Hz

TU3 : ±150Hz TU1.5: ±200Hz

0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB

200kHz -30dB 200kHz -30dB

250kHz -33dB 250kHz -33dB

Due to 400kHz -60dB 400kHz -60dB

Output RF

modulation 600 ~ 1800kHz -60dB 600 ~ 1800kHz -60dB

61800 ~ 3000kHz -63dB 1800 ~ 6000kHz -65dB

Spectrum

3000 ~ 6000kHz -65dB ≥6000kHz -73dB

≥6000kHz -71dB

Due to

400kHz -19dB 400kHz -22dB

Switching

600kHz -21dB 600kHz -24dB

transient

1200kHz -21dB 1200kHz -24dB

1800kHz -24dB 1800kHz -27dB

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LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

No Item GSM DCS & PCS

Frequency offset 800kHz

7Intermodulation attenuation –

Intermodulation product should

be Less than 55dB below the

level of Wanted signal

Power control

Power Tolerance

Power control

Power Tolerance

Level (dBm) (dB) Level (dBm) (dB)

533±3 030±3

631±3 128±3

729±3 226±3

827±3 324±3

925±3 422±3

10 23 ±3 5 20 ±3

8Transmitter Output Power 11 21 ±3 6 18 ±3

12 19 ±3 7 16 ±3

13 17 ±3 8 14 ±3

14 15 ±3 9 12 ±4

15 13 ±3 10 10 ±4

16 11 ±5 11 8 ±4

17 9 ±5 12 6 ±4

18 7 ±5 13 4 ±4

19 5 ±5 14 2 ±5

15 0 ±5

9Burst timing Mask IN Mask IN

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LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

2) Transmitter - WCDMA Mode

No Item Specification

1Maximum Output Power Class 3 : +24dBm(+1/-3dB)

Class 4 : +21dBm(±2dB)

2Frequency Error ±0.1ppm

3Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme

Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4.5

4Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4.5

Group (10 equel command group)

+1 +8/+12 +16/+24

5Minimum Output Power -50dBm(3.84MHz)

Qin/Qout : PCCH quality levels

6Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB

Ton@DPCCH/Ior : -24 -> -18dB

7Transmit OFF Power -56dBm(3.84MHz)

8Transmit ON/OFF Time Mask

±25us

PRACH,CPCH,uplinlk compressed mode

±25us

9Change of TFC

Power varies according to the data rate

DTX : DPCH off

(minimize interference between UE)

10 Power setting in uplink compressed ±3dB(after 14slots transmission gap)

11 Occupied Bandwidth(OBW) 5MHz(99%)

-35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k

12 Spectrum emission Mask

-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M

-39-10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M

-49dBc@∆f=8.5~12.5MHz,1M

- 12 -

LGE Internal Use Only

Only for training and service purposes

3)Receiver - GSM Mode

2. PERFORMANCE

No Item Specification

13 Adjacent Channel Leakage Ratio(ACLR)

33dB@5MHz, ACP>-50dBm

43dB@10MHz, ACP>-50dBm

-36dBm@f=9~150KHz, 1K BW

-36dBm@f=50KHz~30MHz, 10K BW

-36dBm@f=30MHz~1000MHz, 100K BW

Spurious Emissions -30dBm@f=1~12.5GHz, 1M BW

(*: additional requirement) (*)-41dBm@f=1893.5~1919.6MHz, 300K

(*)-67dBm@f=925~935MHz, 100K BW

(*)-79dBm@f=935~960MHz, 100K BW

(*)-71dBm@f=1805~1880MHz, 100K BW

15 Transmit Intermodulation

-31dBc@5MHz,Interferer -40dBc

-41dBc@10MHz, Interferer -40dBc

16 Error Vector Magnitude (EVM)

17.5%(>-20dBm)

(@12.2K, 1DPDCH+1DPCCH)

17 Transmit OFF Power

-15dB@SF=4.768Kbps, Multi-code

transmission

No Item GSM DCS & PCS

Sensitivity (TCH/FS Class II) -105dBm -105dBm

Co-Channel Rejection

C/Ic=7dB Storage -30 ~ +85

(TCH/FS Class II, RBER, TU high/FH)

3Adjacent Channel 200kHz C/Ia1=-12dB C/Ia1=-12dB

Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB

Wanted Signal :-98dBm Wanted Signal :-96dBm

Intermodulation Rejection 1st interferer:-44dBm 1st interferer:-44dBm

2nd interferer:-45dBm 2nd interferer:-44dBm

Blocking Response Wanted Signal :-101dBm Wanted Signal :-101dBm

(TCH/FS Class II, RBER)

Unwanted : Depend on Frequency Unwanted : Depend on Frequency

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LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

4) Receiver - WCDMA Mode

No Item Specification

1Reference Sensitivity Level -106.7 dBm(3.84 MHz)

-25dBm(3.84MHz)

2Maximum Input Level -44dBm/3.84MHz(DPCH_Ec)

UE@+20dBm output power(Class3)

3Adjacent Channel Selectivity (ACS)

33dB

UE@+20dBm output power(Class3)

-56dBm/3.84MHz@10MHz

4In-band Blocking UE@+20dBm output power(Class3)

-44dBm/3.84MHz@15MHz

UE@+20dBm output power(Class3)

-44dBm/3.84MHz@f=2050~2095 and

2185~2230MHz

UE@+20dBm output power(Class3)

-30dBm/3.84MHz@f=2025~2050 and

5Out-band Blocking 2230~2255MHz

UE@+20dBm output power(Class3)

-15dBm/3.84MHz@f=1~2025 and

2255~12500MHz

UE@+20dBm output power(Class3)

6Spurious Response

-44dBm CW

UE@+20dBm output power(Class3)

-46dBm CW@10MHz

7Intermodulation Characteristic -46dBm/3.84MHz@20MHz

UE@+20dBm output power(Class3)

-57dBm@f=9KHz~1GHz, 100K BW

8Spurious Emissions -47dBm@f=1~12.5GHz, 1M BW

-60dBm@f=1920MHz~1980MHz, 3.84M BW

-60dBm@f=2110MHz~2170MHz, 3.84M BW

- 14 -

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

2.4 Current Consumption

(Stand by Test Condition : Bluetooth off, LCD backlight off)

(Call Test Condition : Bluetooth off, LCD backlight dimming mode)

(VT Test Condition : Speaker off, LCD backlight On)

2.5 RSSI BAR

Stand by Voice Call VT

WCDMA

Under 4.32 mA Under 335 mA Under 569mA

(DRX=1.28) (Tx=10dBm -Low power) (Tx=10dBm -Low power)

Under 4.32 mA Under 380 mA

GSM (Paging=5period) (Tx=Max power)

Level Change WCDMA GSM

BAR 7 → 6-86 ±2 dBm -82 ±2dBm

BAR 6 → 5-90 ±2 dBm -86 ±2dBm

BAR 5 → 4-94 ±2 dBm -90 ±2dBm

BAR 4 → 3-98 ±2 dBm -94 ±2dBm

BAR 3 → 2-102 ±2 dBm -98 ±2dBm

BAR 2 → 1-106 ±2 dBm -102 ±2dBm

BAR 1 → 0-110 ±2 dBm -106 ±2dBm

- 15 -

LGE Internal Use Only

Only for training and service purposes

2.6 Battery BAR

2. PERFORMANCE

Indication Standby

Bar 7 3.96 ± 0.05V

Bar 7 →63.95 ± 0.05V

Bar 6 →53.86 ± 0.05V

Bar 5 →43.78 ± 0.05V

Bar 4 →33.74 ± 0.05V

Bar 3 →23.69 ± 0.05V

Bar 2 →13.63 ± 0.05V

Bar 1 →Empty 3.50 ± 0.05V

Low Voltage, 3.63,3.50 ± 0.05V (Stand-by) / 3.63, 3.50 ± 0.05V (Talk)

Warning message + tone Bar 2 → 1 / Bar 1 →Empty

Power Off 3.20 ± 0.05V

- 16 -

LGE Internal Use Only

Only for training and service purposes

2. PERFORMANCE

2.7 Sound Pressure Level

2.8 Charging

- Charging Method : CC & CV (Constant Current & Constant Voltage)

- Maximum Charging Voltage : 4.2V

- Maximum Charging Current : 650mA

- Nominal Battery Capacity : 950 mAh

- Charger Voltage : 4.8V

- Charging time : Max 3 h (Except time trickle charging)

- Full charge indication current (icon stop current) : 60mA

- Low battery POP UP : 3.48V

- Low battery alarm interval : Idle - 3 min, Dedicated - 1min

- Cut-off voltage : 3.22V

No Test Item Specification

1Sending Loudness Rating (SLR) 8 ±3 dB

2Receiving Loudness Rating (RLR) Nor -4 ± 3 dB

Max -15 ± 3 dB

3Side Tone Masking Rating (STMR) Min 17 dB

4Echo Loss (EL) Min 40 dB

5Sending Distortion (SD) Refer to Table 30.3

6Receiving Distortion (RD) Refer to Table 30.4

7Idle Noise-Sending (INS) Max -64 dBm0p

8Idle Noise-Receiving (INR) Nor Under -47 dBPA

Max Under -36 dBPA

9Sending Loudness Rating (SLR) 8±3dB

10 Receiving Loudness Rating (RLR) Nor -1 ±3 dB

Max -12 ±3 dB

11 Side Tone Masking Rating (STMR) Min 25 dB

12 Echo Loss (EL) Min 40 dB

13 Sending Distortion (SD) Refer to Table 30.3

14 Receiving Distortion (RD) Refer to Table 30.4

15 Idle Noise-Sending (INS) Max -55 dBm0p

16 Idle Noise-Receiving (INR) Nor Under -45 dBPA

Max Under -40 dBPA

TDMA Noise

-. GSM : Power Level : 5

DCS/PCS : Power Level : 0

(Cell Power : -90 ~ -105 dBm)

-. Acoustic (Max Vol.)

MS/Headset SLR : 8

3dB

MS/Headset RLR : -15 ± 3dB/-12dB

(SLR/RLR : Mid-value setting)

Headset

MS and

Headset

Max Under -62 dBm

- 17 -

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

3.1 General Description

The KS10 supports UMTS-2100 DS-WCDMA, EGSM-900, DCS-1800, and PCS-1900. All receivers

and the UMTS transmitter use the radio One1Zero-IF architecture to eliminate intermediate

frequencies, directly converting signals between RF and baseband. The EGSM, DCS1800 and

PCS1900 transmitters use a baseband-to-IF up-conversion followed by an offset phase-locked loop

that translates the GMSK-modulated signal to RF.

1QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.

3. TECHNICAL BRIEF

KS10 high-level RF functional block diagram

- 18 -

LGE Internal Use Only

Only for training and service purposes

A generic, high-level functional block diagram of KS10 is shown in Figure 1-1. One antenna collects

base station forward link signals and radiates handset reverse link signals. The antenna connects with

receive and transmit paths through a switch module (plus a duplexer for UMTS-2100 operation).

UMTS band signals at the antenna are switched to the relevant UMTS duplexer. The UMTS receive

band signals are amplified by the front-end LNAs of the RFR6250 IC before passing through a band-

pass filter and being applied to the mixer inputs of the RFR6250 IC. On-chip circuits down-convert the

received signal directly from RF to baseband using radioOne Zero-IF techniques. Generation and

distribution of the UMTS LO, for the down-converter, is performed entirely on-chip (except for the loop

filter). The RFR6250 IC outputs analog baseband signals for processing by the MSM device. This

baseband interface is shared with the RTR6250 GSM receiver outputs, but is separate from the GPS

baseband interface.

EGSM, DCS and PCS receive signals from the antenna switch module pass through their band-pass

filters, then are applied to the RTR6250 IC. In a similar fashion to the UMTS paths, RTR6250 IC

circuits down-convert the received signals directly from RF to baseband. The GSM LO for multiband

down conversion is entirely generated within the RTR6250 IC (PLL and distribution functions) with

exception of the off-chip loop filter. The RTR analog baseband outputs are routed to the MSM6275 IC

for further processing (an interface shared with the RFR UMTS receive paths).

The UMTS transmit path begins with analog baseband signals from the MSM device that drive the

RTR6250 IC. Integrated PLL and VCO circuits generate the Tx LO used in the quadrature upconverter

that translates baseband signals directly to RF. The RTR6250 output driver stages deliver fairly high-

level signals that are filtered and applied to the power amplifiers (PA). The PA output is routed to the

antenna through a duplexer and switch module.

The shared EGSM-900, DCS-1800, and PCS-1900 transmit path begins with the same baseband

interface from the MSM6275 IC that is used for the UMTS band. A single EGSM/DCS/PCS quadrature

upconverter translates the GMSK-modulated signal to a convenient intermediate frequency (IF) that

forms one input to an offset phase-locked loop (OPLL). OPLL functions are split between the

RTR6250 IC and off-chip loop filter and dual Tx VCO circuits, and translate the GMSK-modulated

signal to the desired EGSM-900, DCS-1800 or PCS-1900 channel frequency. This signal is applied to

a dual power amplifier (only one is active at a time). The enabled path continues with the PA, an

automated power control (APC) circuit that samples the transmit power and adjusts its level, the switch

module (which includes a band-appropriate lowpass filter), and the antenna.

KS10 power supply voltages are managed and regulated by the PM6250 Power Management IC. This

versatile device integrates all wireless handset power management, general housekeeping, and user

interface support functions into a single mixed signal IC. It monitors and controls the external power

source and coordinates battery recharging while maintaining the handset supply voltages using low

dropout, programmable regulators.

The device’s general housekeeping functions include an ADC and analog multiplexer circuit for

monitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chip

variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter

circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout

and crystal oscillator signal presence are monitored to protect against detrimental conditions.

3. TECHNICAL BRIEF

- 19 -

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

3.2 GSM Mode

3.2.1 GSM Receiver

The Dual-mode KS10’s receiver functions are split between the two RFICs as follows:

• UMTS-2100 operation uses the RFR6250 Receiver ICs to implement the receive signal path,

accepting an RF input and delivering analog baseband outputs (I and Q).

• EGSM-900, DCS-1800, and PCS-1900 modes both use the RTR6250 IC only. Each mode has

independent front-end circuits and down-converters, but they share common baseband circuits (with

only one mode active at a time). All receiver control functions are beginning with SBI2-controlled

parameters.

The EGSM, DCS, and PCS receiver inputs of RTR6250 are connected directly to the transceiver front-

end circuits(filters and antenna switch module). EGSM, DCS, and PCS receiver inputs are similar to

the RFR6250 UMTS Rx input in that they also use differential configurations to improve common-

mode rejection and second-order non-linearity performance.

The balance between the complementary signals is critical and must be maintained from the RF filter

outputs all the way into the IC pins Since EGSM, DCS, and PCS signals are time-division duplex (the

handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in

place of frequency duplexers - this is accomplished in the switch module.

The EGSM, DCS, and PCS receive signals are routed to the RTR6250 through band selection filters

and matching networks that transform single-ended 50-Ω sources to differential impedances optimized

for gain and noise figure. Similar to the RFR, the RTR input uses a differential configuration to improve

second-order inter-modulation and common mode rejection performance. The RTR6250 input stages

include MSM-controlled gain adjustments that maximize receiver dynamic range.

The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters.

The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q)

having passband and stopband characteristics suitable for GMSK processing. These filter circuits

include DC offset corrections. The filter outputs are buffered and passed on to the MSM6275 IC for

further processing (an interface shared with the RFR6250 UMTS receiver outputs).

2The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application

Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS

Software documentation for details.

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LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

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LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

3.2.2 GSM Transmitter

The shared GSM Low-band (EGSM900) and High-band (DCS1800, PCS1900) transmit path begins

with the baseband inputs from the MSM6275 IC. These differential analog input signals are buffered,

lowpass filtered, corrected for DC offsets then applied to the GSM quadrature upconverter. The

upconverter LO signals are generated from the transceiver VCO signal by the LO distribution and

generation circuits within RTR6250. This upconverter translates the GMSK-modulated signal to a

convenient intermediate frequency (IF) that forms one input to a frequency/phase detector circuit. This

IF signal is the reference input to an offset phase-locked loop (OPLL) circuit as shown in Figure 1.2.2-1.

The feedback path of this OPLL circuit includes a downconversion from the RF output frequency range

to the IF range. The two inputs to this downconversion mixer are formed as follows:

1. The dual Tx VCO output (operating in the desired RF output frequency range) is buffered within the

RTR6250 IC then applied to the mixer RF port.

2. The LO Generation and Distribution circuits that deliver the transmit path.s LO for the baseband-to-IF

upconversion also provides the offset LO signal that is applied to the feedback path.s mixer LO port.

Figure 1.2.2-1 Offset phase-locked loop interfaces

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LGE Internal Use Only

Only for training and service purposes

The mixer IF port output is the offset feedback signal - the variable input to the frequency/phase

detector circuit. The detector compares its variable input to its reference input and generates an error

signal that is lowpass filtered by the loop filter and applied to the dual Tx VCO tuning port to force the

VCO output in the direction that minimizes errors. As mentioned earlier, the VCO output is connected to

the feedback path thereby creating a closed-loop control system that will force frequency and phase

errors between the variable and reference inputs to zero.

The waveform at the dual Tx VCO output is the GMSK-modulated signal centered at the desired GSM

channel frequency. A phase-locked loop circuit is used to translate the GMSKmodulated signal from IF

to RF primarily for two reasons:

1. Phase-locked loops provide a lowpass filter function from the reference input to the VCO output.

These results in a bandpass function centered at the desired channel frequency that provides steep,

well-controlled rejection of the out-of-band spectrum.

2. The resulting output bandpass function is virtually unchanged as the transmitter is tuned over

channels spanning the GSM operating band.

The PA is a key component in any transmitter chain and must complement the rest of the transmitter

precisely. For GSM band operation, the closed-loop transmit power control functions add even more

requirements relative to the UMTS PA. In addition to gain control and switching requirements, the usual

RF parameters such as gain, output power level, several output spectrum requirements, and power

supply current are critical. The gain must be sufficient and variable to deliver the desired transmitter

output power given the VCO output level, the subsequent passive devices’ losses, and the control set

point. The maximum and minimum transmitter output power levels depend upon the operating band

class and mobile station class per the applicable standard. Transmitter timing requirements and in-band

and out-of-band emissions, all dominated by the PA, are also specified by the applicable standard.

The active dual Tx VCO output is applied to the dual power amplifier to continue the transmit path, and

feedback to the RTR6250 IC to complete the frequency control loop. The PA operating band (EGSM or

DCS/PCS) is selected by the MSM device GPIO control. (GSM_PA_BAND).

3. TECHNICAL BRIEF

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LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

3.3 WCDMA Mode

3.3.1 Receiver

The UMTS duplexer receiver output is routed to LNA circuits within the RFR6250 IC. The LNA gain is

dynamically controlled by the MSM6275 IC to cover full receiver dynamic range and to save current

consumption.

The UMTS LNA output is routed to the down conversion mixer inputs, in the RFR6250 IC, through a

band selection filter that transforms a single-ended 50-Ω source to differential 100-Ω load impedance

that is matched to the RFR6250 IC. The RFR input uses a differential configuration to improve second-

order inter-modulation and common mode rejection performance. The RFR6250 IC input stages include

MSM-controlled gain adjustments that further extend receiver dynamic range.

The amplifier output drives the RF port of the quadrature RF-to-baseband down-converter. The down-

converted baseband outputs are routed to low-pass filters (one I and one Q) having pass-band and

stop-band characteristics suitable for DS-WCDMA processing. The filter outputs are buffered and

passed on to the MSM6275 IC for further processing. This baseband interface is shared with the

RTR6250 GSM receiver outputs.

The RFR6250 IC includes LO generation and distribution circuitry to reduce off-chip component

requirements. The GPS RX LO source is created using the PLL control elements of the RTR6250

PLL2, via a discrete loop filter components, in tandem with the VCO in the RFR6250. Using only this

PLL signal, the RFR6250 LO generation and distribution circuits create the necessary LO signals for

the UMTS quadrature down-converter. By definition, the ZIF down-converter requires FLO equal to FRF,

and the RTR6250/RFR6250 design achieves this without allowing FVCO to equal FRF.

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LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

Figure 1.3.1-1 RFR6250 IC functional block diagram

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LGE Internal Use Only

Only for training and service purposes

3.3.2 Transmitter

The UMTS transmit path begins with analog baseband signals from the MSM device that drive the

RTR6250 IC. The RTR6250 IC provides all the UMTS transmitter active signalpath circuits except the

power amplifiers. Analog (I and Q) differential signals from the MSM device are buffered, filtered, and

applied to Baseband-to-RF quadrature upconverters. Gain control is implemented on-chip. The RF

outputs include an integrated matching inductor, reducing the off-chip matching network to a single

series capacitor.

The RTR6250 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly

high-level signals that are filtered and applied to the PA. The PA device used in KU950 is “Load

Insensitive PA”- no need to use isolator - and routed to the duplexer Tx port directly. Transmit power is

delivered from the duplexer to the antenna through the switch module.

The RTR6250 IC integrates LO generation and distribution circuits on-chip, substantially reducing off-

chip requirements. Various modes and programmable features result in a highly flexible transceiver LO

output that supports not only UMTS transmissions, but all EGSM900 and DCS1800/PCS1900 Rx and

Tx modes as well.

The UMTS Tx LO (PLL1) is generated almost entirely on-chip, requiring only the loop filter off-chip (two

capacitors and two resistors); all UMTS Tx VCO and PLL circuits are on-chip. An internal RTR6250

switch routes the internal VCO signal to the LO generation and distribution circuits to create the

necessary UMTS Tx LO signals.

3. TECHNICAL BRIEF

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LGE Internal Use Only

Only for training and service purposes

3.4 LO Phase-locked Loop

Most LO functions are fully integrated on-chip, do not require user adjustment, and need not be

considered by handset designers. QUALCOMM has established and implemented frequency plans

and LO generation schemes that support the radioOne 6250-IIseries chipset while requiring minimal

off-chip design effort. Only one area requires handset designer attention: the loop filters of each

phase-locked loop (PLL).

3.4.1 UMTS Rx PLL (PLL2)

UMTS Rx LO functional blocks are distributed between the RFR6250 IC, RTR6250 IC, and external

UMTS_RX_CH_VCO and loop filter components (Figure 1.4.1-1). The external UMTS_RX_CH_VCO

must be enabled for UMTS Rx operation and disabled otherwise; a dedicated MSM6275 IC signal

(UHF_VCO_EN ) enables the VCO.

3. TECHNICAL BRIEF

Figure 1.4.1-1 UMTS Rx PLL functional block diagram

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LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

The RFR6250 IC accommodates single-ended or differential LO inputs; if single-ended, either pin can

be active. AC-couple the inactive pin to ground using an appropriately valued capacitor (12 pF is used

in KS10). The 27 pF capacitor should be used to AC-couple the active pin to the VCO signal. Using

only the selected VCO signal, the RFR6250 IC LO generation and distribution circuits create the

necessary LO signals for the active quadrature downconverter.

A sample of the downconverter LO is buffered and routed from RFR6250 IC pin 19 to RTR6250 IC pin

32 (RX_VCO_IN). This signal requires a terminating resistor near the RTR6250 IC input pin and an AC

coupling capacitor that assures the internal RTR6250 IC biasing is not disrupted in the example. Good

microstrip or stripline controlled-impedance techniques must be used.

Most UMTS Rx PLL circuits are included within the RTR6250 IC: reference divider, phase detector,

charge pump, feedback divider, and digital logic that generate LOCK status. The buffered 19.2 MHz

TCXO signal provides the synthesizer input (REF), the frequency reference to which the PLL is phase

and frequency locked. The reference is divided by the RCounter to create a fixed frequency input to

the phase detector, FR. The other phase detector input (FV) varies as the loop acquires lock, and is

generated by dividing the RX_VCO_IN frequency using the feedback path.s N-Counter. The closed

loop will force FV to equal FR when locked. If the loop is not locked the error between FV and FR will

create an error signal at the output of the charge pump. This error signal is filtered by the loop filter

and applied to the VCO, tuning the output frequency such that the error is decreased. Ultimately the

loop forces the error to approach zero and the PLL is phase and frequency locked.

Many key PLL performance characteristics are largely determined by the loop filter design - stability,

transitory response, settling time, and phase noise.

3.4.2 Transceiver PLL (PLL1)

All LO functional blocks for the other handset modes(UMTS Tx, EGSM Tx/Rx, DCS Tx/Rx, PCS

Tx/Rx) are integrated into the RTR6250 IC except the loop filter components (Figure 1.4.2-1). On-chip

circuits include reference divider, phase detector, charge pump, VCO, feedback divider, and digital

logic status. The functional description given in Section 1.4.1 for the UMTS Rx PLL applies to the

Transceiver PLL as well.

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Only for training and service purposes

The off-chip loop filter allows optimization of key PLL performance characteristics (stability, transitory

response, settling time, and phase noise) for different applications. Guidelines are provided in the next

subsection for proper implementation of this critical circuit.

3. TECHNICAL BRIEF

Figure 1.4.2-1 Transceiver PLL functional block diagram

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LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

3.5 Off-chip RF Components

3.5.1 Front End Module(FL500)

Front End module integrates antenna switch module and GSM Rx filter.

The antenna switch module allows multiple operating bands and modes to share the same antenna. In

the KS10 design, a common antenna connects to one of six paths:

1) UMTS-2100 Rx/Tx, 2) EGSM Rx, 3) DCS-1800 Rx, 4) PCS-1900 Rx, 5)EGSM Tx, and 6) DCS-

1800, PCS-1900 Tx. UMTS operation requires simultaneous reception and transmission, so the

UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. GSM

band of operation is time division duplexed, so only the receiver or transmitter is active at any time

and a frequency duplexer is not required. The module includes lowpass filters for the GSM bands

transmit paths to reduce out-of-band emissions, PA harmonics in particular.

The GSM mode RF filters are located before their LNAs, so their insertion losses are extremely critical

(1.3 dB typical). Other important parameters are:

■Out-of-band rejection or attenuation levels

❏Far out-of-band signals - ranging from DC up to the first band of particular concern and from the

last band of particular concern to beyond three times the highest passband frequency.

❏Frequencies of particular concern . bands known to include other wireless transmitters that may

deliver significant power levels to the receiver input.

❏GSM band receivers operate while the handset transmitters are off so there are no Txband

leakage attenuation requirements.

■Phase and amplitude balance - the UMTS discussion presented above applies for GSM bands as

well. See the data sheet for specific values. Of course, passband ripple and return loss are still

important in all cases for the same reasons explained in the antenna switch module and duplexer

sections.

3.5.2 UMTS duplexer (U506)

A UMTS duplexer splits a single operating band into receive and transmit paths. Important

performance requirements include:

- Insertion loss . this component is also in the receive and transmit paths; In the KS10 typical losses:

UMTS Tx = 1.45 dB, UMTS Rx = 1.86 dB.

- Out-of-band rejection or attenuation . the duplexer provides input selectivity for the receiver, output

filtering for the transmitter, and isolation between the two. Rejection levels for both paths are

specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver

performance:

- Rx-band isolation . the transmitter is specified for out-of-band noise falling into the Rx band. This

noise leaks from the transmit path into the receive path, and must be limited to avoid degrading

receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and

Rx-band losses between the PA and LNA. Typical duplexer Rx band isolation value is 51 dB.

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LGE Internal Use Only

Only for training and service purposes

- Tx-band isolation . the transmit channel power also leaks into the receiver. In this case, the leakage

is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to

create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band

isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Typical

duplexer Tx-band isolation value is 57 dB.

- Passband ripple . the loss of this fairly narrowband device is not flat across its passband. Passband

ripple increases the receive or transmit insertion loss at specific frequencies, creating performance

variations across the bands channels, and should be controlled.

- Return loss . minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1).

- Power handling. high power levels in the transmit path must be accommodated without degraded

performance. The specified level depends on the operating band class and mobile station class (per

the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics

depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be

used between the UMTS PA and duplexer to assure proper performance.

3.5.3 UMTS Power Amplifier (U505)

The AWT6277 meets the increasing demands for higher output power in UMTS handsets. The PA

module is optimized for VREF = +2.85 V, a requirement for compatibility with the Qualcomm® 6250

chipset. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-

the-art reliability, temperature stability, and ruggedness. Selectable bias modes that optimize efficiency

for different output power levels, and a shutdown mode with low leakage current, increase handset talk

and standby time. The self-contained 4 mm x 4 mm x 1.1 mm surface mount package incorporates

matching networks optimized for output power, efficiency, and linearity in a 50 Ω system.

3. TECHNICAL BRIEF

Figure 1.5.3-1 UMTS PA functional block diagram

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LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

3.5.4 Thermistor (R527)

This thermistor senses temperature variations around UMTS PA to adjust PA gain deviation for

assure compliance with the applicable transmit power control standards. Negative temperature

compensation thermistor is used in the KS10.

3.5.5. UMTS transmit power detector (U504)

This detector couples PA output power level to calibrate the transmitter characteristic over the channel

variation and temperature. Its detector coupling range and converted voltage is based on diode

sensitivity and transmitter power level.

The KS10 uses National Semiconductor ADL5500 power detector IC. In Figure 1.5.5-1, C580 is set to

47ohm&Coupler resulting in an attenuation of 31.4dB. The output voltage is proportional to the

logarithm of the input power. Figure1.5.5-2 shows the output voltage versus PA output power of the

ADL5500 setup as depicted in Figure1.5.5-1

Figure 1.5.5-1 Block diagram of ADL5500 with resistive tap

Figure 1.5.5-2 Power detector response, Vout vs PA output power

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LGE Internal Use Only

Only for training and service purposes

3.5.6 Dual band GSM power amplifier (U501)

The TQM7M5003 is a high-power, high-efficiency power amplifier module with integrated power

control that provides over 50dB of control range. The devices is a self-contained 6mm°ø6mm module

with 50Ω input and output terminals. The device is designed for use as the final RF amplifier in

GSM850, EGSM900, DCS and PCS hand-held digital celluar equipment and other applications in the

824MHz to 849MHz, 880MHz to 915MHz, 1710MHz to 1785MHz and 1850MHz to 1910MHz bands.

The VBATT pin connects to an internal current-sense resistor and interfaces to an integrated power

amplifier control function, which is insensitive to variations in temperature, power supply, process, and

input power. The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain.

3.5.7 GSM transmit VCO (U502)

The dual Tx VCO is a key component within the GSM OPLL. This VCO performance directly impacts

PLL and transmitter performance. VCO specifications refer to muRata MQW5V0C869M datasheet.

The dual Tx VCO outputs, one for Low-band GSM and one for high band, drive a resistive network

that splits the active signal into two signals: 1) the input to the active PA . this is the low loss path,

and 2) the OPLL feedback signal . this is the high loss path. See Figure 8-1 for recommended

topology and resistor values.

The losses from the VCO outputs to the PA inputs must be factored into the output chain.s power

budget. Each path includes a π-pad that introduces approximately a 3-dB loss. The low band GSM

π-pad is formed by R516 plus R522, R521, and R524; the high band GSM π-pad is formed by R518

plus R523, R520, and R524. One leg of each π-pad is used to couple the VCO output to form the

feedback path as described below.

For a given VCO output drive level, the loss to the RTR6250 input must assure the specified input

level is achieved (-18 to -12 dBm). Large resistors included in the π-pads are used to lightly couple

off the VCO outputs to create the feedback signal. Since the RTR6250 TX_VCO_FB pin presents

fairly high impedance. A series capacitor (82 pF) AC couples the feedback signal into the RTR6250

IC.

3. TECHNICAL BRIEF

Figure 1.5.6-1 GSM PA functional block diagram

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LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

3.5.8 UMTS Rx RF filter (FL501)

An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical

as losses before the LNA. The most important parameters of this component include:

■Out-of-band rejection or attenuation levels, usually specified to meet these conditions:

❏Far out-of-band signals - ranging from DC up to the first band of particular concern and from the

last band of particular concern to beyond three times the highest passband frequency.

❏Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still

presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must

provide rejection of this Tx-band leakage.

❏Other frequencies of particular concern . bands known to include other wireless transmitters that

may deliver significant power levels to the receiver input.

■Phase and amplitude balance - the ZIF architecture requires well-balanced differential inputs to the

RFR6250 IC. This is accomplished by the RF filter which takes a single-ended output from the

RFL6250 IC and provides differential outputs having nominal 180 phase separation. Phase and/or

amplitude imbalance causes degraded common-mode rejection and second-order nonlinearity, so

their requirements are specified jointly.

❏±3 degrees and ± 1 dB

❏-12 to + 3 degrees and ± 0.7 dB

Of course, passband ripple and return loss are still important in all cases for the same reasons

explained in the antenna switch module and duplexer sections.

3.5.9 VCTCXO (X500)

The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the

reference frequency for all RFIC synthesizers as well as clock generation functions within the

MSM6275 IC. The 6275-series chipset requires a 19.2 MHz nominal VCTCXO frequency. The

oscillator frequency is controlled by the MSM6275’s TRK_LO_ADJ pulse density modulated signal in

the same manner as the transmit gain control.

The filtered PDM signal results in an analog control signal into the VCTCXO tuning port whose voltage

is directly proportional to the density of the digital bit stream. The MSM device varies the pulse density

to change the analog control voltage that sets the oscillator frequency - all within a feedback control

loop that minimizes handset frequency drift relative to the network.

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LGE Internal Use Only

Only for training and service purposes

3.6 Digital Baseband (Stn8810 / MSM6275)

3.6.1 General features of Stn8810 device

• Support for Peripheral Device & multimedia function

• Support for high-speed downlink packet access (HSDPA) - 1.8 Mbps

• Minimal support for high-level operating system such as Symbian™, Linux and WinCE® operating

systems (OSs).

• 1-Gbit NAND Flash memory, 512-Mbit DDR mobile RAM Stacked in Package

• Two DSP implementation for multimedia function

- Smart video accelerator : Programmable DSP (MMDSP+) for intermediate level processing,

clocked at 66 MHz,

- Smart audio accelerator : High-performance block, flexible sophisticated audio accelerator based

on the MMDSP+ programmable audio DSP, clocked at 133 MHz,

• ARM926EJ 32-bit RISC CPU at 350MHz

32-Kbyte instruction cache, 16-Kbyte data cache

• MultiMedia Card/SD Card/SDIO host controller

• 96 general-purpose I/Os (muxed with peripheral I/Os)

• Camera interfaces

- Supports high-resolution camera modules up to 4 Mpixels

- Serial camera interface up to 416 Mbit/s (MIPI legacy CSI)

- Parallel camera CCIR-656 interface up to 66 MHz (MIPI legacy CPI)

• Color LCD controller for STN or TFT panels or display interface for display module

- 24-bpp true color

- MIPI legacy DBI and DPI

• Host port interface (HPI)

- 16-bit parallel data bus,

- Multiplexed and non-multiplexed address/data bus,

- Indirect host access,

- Direct host access to a segment of STn8810 memory in multiplexed mode.

- Interface to modem for data communication

• I/O peripherals

- 3 autobaud UARTs (one with modem control signals) up to 3.692 Mbit/s

- 1 synchronous serial port (SSP) up to 24 Mbit/s

- 3 multichannel serial ports (MSP) up to 48 Mbit/s

- 2 I©˜C multi-master/slave interfaces

- One 8-channel, full-duplex high-speed serial interface, 108 Mbit/s

- Host port interface

- JTAG

3. TECHNICAL BRIEF

3. BB Technical Description

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LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

3.6.2 General features of MSM6275 device

• Support for multimode operation - WCDMA(UMTS), GSM/GPRS, EDGE

• Support for high-speed downlink packet access (HSDPA) - 1.8 Mbps

• Support for WCDMA (UMTS) uplink data rate up to 384 kbps

• High-performance ARM926EJ-S running at up to 225 MHz

• ARM Jazelle Java hardware acceleration for faster Java-based games and other applets

• QDSP4000 high-performance DSP cores

• Integrated gpsOne position location technology functionality

• Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals

• High-speed, serial mobile display digital interface (MDDI) Type I, which optimizes the interconnection

cost between the MSM device and LCD panel

• Direct interface to digital camera module with video front end (VFE) image processing

• Vocoder support (AMR, FR, EFR, HR)

• Advanced 14x14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology

• WCDMA Access

- Maximum of eight simultaneous transport channels

- Four coded composite transport channels (CCTrCH)

- PS data rates supporting 384kbps DL / 64kbps UL

• GSM/GPRS Access

- GSM/GPRS network signaling (from Layer 1 to 3)

- GSM AMR,EFR,FR

• Operation and Services

- USIM Interfaces

- General Purpose I/O (GPIO) Interface

- Dual Memory Buses (EBI1-SDRAM & EBI2-NAND Flash)

- JTAG

- RTC

• Data Communication

- UARTs (ACB, EDB (RS232))

- Slave USB

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3. TECHNICAL BRIEF

3.7. Hardware Architecture

LGE Internal Use Only

Only for training and service purposes

MSM6275

PM6650

SDRAM

+ NAND

MAIN LCD

GSM

Quadband

BLUETOOTH

18pin MMI

Connector

18pin MMI

Connector

1.3M CAMERA

Receiver

/SPEAKER

MIC

RFR6250

RTR6250

Micro SD

USIM

GSMQua

TX VCO

UMTS

(2100)

WCDMA RX

WCDMA TX

GSM

900/1800/1900

RX FILTER

GSM RX

GSM TX

UMTS

FILTER

UMTS

FILTER

VGA CAMERA

FEM

STn8810

STw4810

Audio Codec.

(WM8753)

HPI I/F

Figure. Simplified Block Diagram

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 37 -

Figure. STn8810 and supported peripherals

3.7.1. STn8810 and supported peripherals

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 38 -

3.7.2. MSM6275 and supported peripherals

Figure. MSM6275 and supported peripherals

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 39 -

3.8. Subsystem of STn8810

3.8.1. ARM926EJ processor

The STn8810 CPU is an ARM926EJ reduced instruction set computer (RISC) processor. This 32-bit

processor core supports 32-bit ARM® and 16-bit Thumb instruction sets, enabling the user to trade off

between high performance and high code density.

The cached ARM CPU features a memory management unit (MMU) and is clocked at 264 MHz.

It has a 32-Kbyte instruction cache and a 16-Kbyte data cache, and supports the Jazelle™ extensions

for Java acceleration. It also includes an embedded trace module (ETM Medium+) for real-time CPU

activity tracing and debugging. It supports 4-bit and 8-bit normal trace mode and 4-bit demultiplexed

trace mode, with normal or half-rate clock.

3.8.2. Smart video accelerator (SVA)

Using leading-edge technology, this block is a low-power, high-performance video accelerator that

supports the following features:

• MPEG-4 simple profile level 3 video encoder and decoder; real time up to VGA 30 fps (encode only

or decode only)

• H.263 profile 3 level 10 video codec; real time subQCIF or QCIF 15 fps for videoconferencing

• H.263 profile 3 level 30 video encoder or decoder; real-time up to CIF 30 fps

• JPEG baseline accelerated encoder or decoder, up to 4080 x 4080 pixels

• Programmable DSP (MMDSP+) for intermediate level processing, clocked at 66 MHz

• Picture pre-/post-processing

• Low-power implementation

3.8.3. Smart audio accelerator (SAA)

This high-performance block is a flexible sophisticated audio accelerator based on the MMDSP+

programmable audio DSP, clocked at 133 MHz, and features:

• 24-bit data path

• Ultra-low power implementation

The audio accelerator features:

• MP3, AAC, AAC+ (SBR) decoding, Midi synthesis, and more

• Speech codecs: AMR (WB, NB), and more

• Audio sample rates of 32 kHz, 44.1 kHz and 48 kHz

• Noise reduction and echo cancelling

• Stereo enhancements and surround effects

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 40 -

3.8.4. Advanced power management unit (PMU)

The dynamic PMU optimizes power consumption of the STn8810. It delivers all the platform clocks,

and handles reset management. It also manages GPIO levels during sleep mode and emergency

self-refresh of SDRAM.

The PMU controls the external voltage regulator, in order to change its settings in different modes.

In deep-sleep mode, only GPIOs, the real-time clock (RTC), system and reset controller (SRC),

PMU and secured RAM remain in operation. The PMU also controls the embedded 1.2 V voltage

switch that switches off the logic supply after the platform has entered sleep mode.

The family of power manager ICs, STw481x companion chips, seamlessly interface with the

Nomadik STn8810 and optimize global system power consumption leveraging on the PMU.

3.8.5. Host port interface (HPI)

The host port interface features:

• 16-bit parallel data bus

• Multiplexed and non-multiplexed address/data bus

• Indirect host access

• Direct host access to a segment of STn8810 memory in multiplexed mode

3.8.6. General purpose inputs/outputs (GPIOs)

The STn8810 provides 96 programmable inputs or outputs that have switchable pull-up and pull-down

resistors and are controllable in two modes:

• Software mode through an APB bus interface

• Hardware mode through a hardware control interface

The GPIO interface provides the following individually programmable functions:

• Any number of pins may be configured as interrupt sources

• Debouncing logic can be enabled for each GPIO to filter out glitches on I/Os

• Any GPIO may be used to wake up the device from sleep mode independent of interrupt

programming, and the input level that triggers wake-up is definable for each enabled GPIO

3.8.7. Universal asynchronous receivers-transmitters (UARTs)

The STn8810 provides three autobaud UARTs, one of which offers all modem control/status signals.

They are enhanced versions of the industry-standard 16C550 UART with a high data rate up to 3.692

Mbit/s.

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 41 -

3.8.8. USB interface

The STn8810 USB interface is USB 2.0 compliant, with On-The-Go standard extension (rev 1.0)

compliance. The USB-OTG features:

• Supports full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) signaling bit rate

• Supports session request protocol (SRP) and host negotiation protocol (HNP)

• 8 bidirectional endpoints plus control endpoint 0

• Digital interface to external PHY

• Fully compatible with STw4810 power manager companion chip

3.8.9. I2C bus interface

The STn8810 provides two I©˜C bus interfaces that support the following features:

• Slave transmitter/receiver and master transmitter/receiver modes

• Multi-master capability

• 10-bit addressing

• Standard (100 kHz) and fast (400 kHz) speeds

• Compliance with I2C and DDC standards

In addition to receiving and transmitting data, the interface converts data from serial to parallel

format and vice-versa using an interrupt or polled handshake. The interrupts are enabled and

disabled in software.

3.8.10. MultiMediaCard/secure data card interface (MMC/SD/SDIO)

This interface can directly control one SD card (without encryption/decryption logic) or SDIO card, or

one MultiMediaCard. It also supports several of each card type using the GPIOs for card selection.

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 42 -

3.9. Hardware Peripheral system of Stn8810

3.9.1. Keypad

KS10 has 28 buttons, 12 function keys in Sub PCB (Folder), 12 numeric keys in main and 4 side keys.

KS10 use key coder IC because Stn8810 has not enough GPIO. Key coder IC use interrupt and I2C

interface for communication with STn8810. Figure shows the Keypad circuit.

°ÆEND’ Key is connected to PM_ON_SW_N to PM6650

Table. Key Matrix Mapping Table

Figure. Schematic of key coder IC

COL0 COL1 COL2 COL3 COL4 COL5 COL6

ROW0 1 2 3 Vol. UP Left Soft Key UP Right Soft Key

ROW1 4 5 6 Vol. DOWN MENU OK CANCEL

ROW2 7 8 9 SHOT SEND DOWN END

ROW3 * 0 # LEFT EDIT RIGHT

Main Side Key Folder

TP407

0.1u

C418

R415

3.3K

TP406

C419

0.1u

3.3K

R414

Wake_INP2 E7

Wake_INP3

Wake_INP4

Wake_INP5 A7

Wake_INP6

B5 Wake_INP7

_RESET

NC1 F5

NC2

NC3 F6

NC4

NC5

NC6 C1

NC7

NC8 B7

F1 PWM

SCL_AB E6

SDA_AB

VCC1

VCC2

WD_Out

Wake_INP0 D7

Wake_INP1Gen_IO_0

D1 Gen_IO_1

Gen_IO_2

Gen_IO_3

A1 Gen_In0

Gen_In1

Int_Rx G2

Int_Tx F2

K_Out0

K_Out1 F4

K_Out2

K_Out3 G5

K_Out4

B4 K_Out5

K_Out6

A3 K_Out7

LM8333GGR8_NOPB

U404

B1 CLK_In

GND1

C4 GND2

C5 GND3

GND4

D4 GND5

GND6

GND7

E4 GND8

GND9

AP_VDD_IO_2.7V

68KR419

FOLDER_DETECT

I2CSCL1

I2CSDA1

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

KEY_COL(4:7)

KEYCODER_RSTN

KEYCODER_INT

KEY_ROW(0:3)

KEY_ROW(2)

KEY_ROW(3)

KEY_ROW(0)

KEY_ROW(1)

KEY_COL(3)

KEY_COL(2)

KEY_COL(3:0)

KEY_COL(1)KEY_COL(4)

KEY_COL(0)

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 43 -

Figure. Schematic of keypad

SW400

SW411

SW407

VA403 EVLC14S02050

VA405 EVLC14S02050

EVLC14S02050VA404

SW408

VA401 EVLC14S02050

EVLC14S02050VA406

SW401

EVLC14S02050VA402

SW409 SW410

SW402

VA407 EVLC14S02050

SW406

AP_VDD_IO_2.7V

SW404

RA400 100K

SW405SW403

KEY_COL(1)

KEY_COL(2)

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_COL(0)

VA102 RSB6.8CST2R

RSB6.8CST2RVA101

SW106 SW108

VA105

VA104

RSB6.8CST2R

SW107

VA103

VA107

RSB6.8CST2R

VA106

RSB6.8CST2R

SW104 SW105SW103

SW102SW100

SW111SW109

SW101

SW110

KEY_ROW(0)

KEY_ROW(1)

KEY_COL(6)

KEY_COL(4)

KEY_COL(5)

KEY_ROW(3)

KEY_ROW(2)

D402 RSB6.8CST2R

RSB6.8CST2RD401

D400 RSB6.8CST2R

CN400

KEY_ROW(0)

KEY_ROW(1)

KEY_COL(3)

RSB6.8CST2RD405

CN401

D404 RSB6.8CST2R

RSB6.8CST2RD403

KEY_COL(3)

KEY_ROW(2)

KEY_ON_SW_N

Side Key (Vol. UP/Down)

Side Key (Power/Shot)

Main PCB

Sub PCB

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 44 -

3.9.2. Folder on/off operation

There is a magnet to detect the folder status, opened or closed. If a magnet is close to the hall-effect

switch, the voltage at pin1 of U402 goes to 0V. Otherwise, 2.7V. This folder signal is delivered to

GPIO0 of the Key coder IC .

AP_VDD_IO_2.7V

0.1u

C414

U402 A3212EEH-T

3GND1

GND2 4

2NC1 5

NC2

1OUTPUT

PGND

VDD

EUSY0200301

R413

100K

C413

ZD1

RSB6.8CST2R

FOLDER_DETECT

Figure. Schematic of folder on/off detection circuit

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 45 -

3.9.3. Keypad backlight

There are 8 White LEDs on Top side of Main PCB and 9 White LEDs on Top side of sub PCB in board

backlight circuit and, which are driven by KEYBD_BACKLIGHT line form PM6650. Key Pad backlight

controlled by PM6650.

Figure. Schematic of main PCB keypad backlight circuit

100ohmR411

SSC-TWH104-HLS

LD407

SSC-TWH104-HLS

LD406

SSC-TWH104-HLS

LD402

EVL14K02200

VA400

R409 100ohm

100ohmR412

AP_+VPWR

LD400

SSC-TWH104-HLS

100ohmR406

R400

R408 100ohm

SSC-TWH104-HLS

LD401

SSC-TWH104-HLS

LD403

R403 100ohm

SSC-TWH104-HLS

LD405

100ohmR405

R402 100ohm

LD404

SSC-TWH104-HLS

KPD_DRV_N

Figure. Schematic of key PCB keypad backlight circuit

100ohmR109

EVL14K02200

VA100

100ohmR111

100ohmR110

LD108

SSC-TWH104-HLSSSC-TWH104-HLS

LD107

LD104

SSC-TWH104-HLS

AP_+VPWR

SSC-TWH104-HLS

LD103

100ohm

100ohmR113

R112

100ohmR114

LD102

SSC-TWH104-HLS

LD100

SSC-TWH104-HLS

100ohmR107 100ohm R108R106 100ohm

SSC-TWH104-HLS

LD101

LD105

SSC-TWH104-HLS SSC-TWH104-HLS

LD106

KPD_DRV_N

LGE Internal Use Only

Only for training and service purposes

3.9.4. Micro SD

3. TECHNICAL BRIEF

- 46 -

CPU

(ST Micro.)

PMIC

(ST Micro.) SD Socket

Clock Clock

Command Command

Data Data

1.8V Signal 2.85V Signal

Level shifting

SD_INT

VMMC_3.1V

VMMC K5

H8 USBINTN

K7 USBRCV

G9 USBSCL

USBSDA

USBVM

VBAT_MMC J4

MCDATA31DIR

MCFBCLK

B1 NC1

NC2

B8 NC3

NC4

NC5

NC6

NC7

K10

GPO1 K6

GPO2

LATCHCLK F3G2 MCCLK

H1 MCCMD

MCCMDDIR

K2 MCDAT0DIR

K9 MCDAT2DIR

MCDATA0

H3 MCDATA1

J1 MCDATA2

MCDATA3

CLKOUT G1

CMDOUT

DATAOUT0

DATAOUT1 E2

DATAOUT2

DATAOUT3 F1

GND1

GND2

TP305

C335

2.2u

C332

C334

C336

USBINTN

SD_CMD

SD_DAT(2)

SD_CLK

SD_DAT(3)

SD_DAT(1)

MCDAT2DIR

MCDAT31DIR

MCDAT1

MCDAT3

MCDAT2

USBSCL

USBSDA

MCCLK

MCCMDDIR

MCCMD

MCFBCLK

MCDAT0DIR

MCDAT0

SD_DAT(0)

USBVM

USBRCV

D15

F24

MSPTXD2_SMPCE2N

D12

MCCLK

C12

MCCMD

MCCMDDIR E13

MCDAT0 D14

C14

MCDAT0DIR

E14

MCDAT1

MCDAT2 C13

MCDAT3 D13

MCDAT31DIR E15

MCFBCLK E17

E16

MSPRXD0

MSPSCK0 F17

H22

MSPTCK2_SMPIORN

MSPTFS0 C15

G24

MSPTFS2_SMPCE1N

MSPTXD0

MCDAT1

MCDAT0DIR

MCDAT0

MCCMDDIR

MCCMD

MCCLK

REMOTE_PWR_ON_AP

MSPTXD0

SW_RESET

MSPTFS0

SD_INT

MCDAT2DIR

MSPRXD0

MCFBCLK

MCDAT31DIR

MCDAT3

MCDAT2

C339

R310 51K

D301

PLR0504F

51K

R309

R311 51K

51K

R313

PLR0504F

D300

R314 51K

C343

R312

SWASWBGND

GND

GCC110-8S-R-E1000

S300

VMMC_3.1V

SD_INT

SD_DAT(1)

SD_DAT(0)

SD_CLK

SD_CMD

SD_DAT(3)

SD_DAT(2)

PMIC

(ST Micro.)

SD Socket

CPU

(ST Micro.)

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 47 -

3.10. Subsystem of MSM6275

3.10.1. ARM Microprocessor Subsystem

The MSM6275 device uses an embedded ARM926EJ-S microprocessor. This microprocessor,

through the system software, controls most of the functionality for the MSM device, including control of

the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a

generic serial bus interface (SBI) the ARM926EJ-S configures and controls the functionality of the

RFL6202, RFR6202, RTR6250, RTR6200, and PM6650 devices.

3.10.2. UMTS/HSDPA Subsystem

The UMTS/HSDPA subsystem performs the digital release 99 June 2004 of the WCDMA FDD

standard and release 5 specifications of HSDPA signal processing.

The UMTS Subsystem performs the digital UMTS signal processing. Its components include:

•

Searcher engine

•

Demodulating fingers

•

Combining block

•

Frame deinterleaver

•

Viterbi decoder

•

Up-link subsystem

•

Turbo decoder

On the down-link channel the UMTS subsystem searches, demodulates, and decodes incoming

CPICH, CCPCH, SCH, and Traffic Channel information. It extracts packet data from the downlink

traffic channel and prepares the packet data for processing. For the up-link, the WCDMA subsystem

processes the packet data and modulates the up-link traffic channel (DCH).

3.10.3. GSM/GPRS Subsystem

The GSM/GPRS/EGPRS subsystem reuses the MSM6275 GSM core. It performs the digital GSM

signal processing and PA gain controls for GPRS support. The PA output level is controlled by an

analog signal generated on the MSM. In GSM mode, the power profile ramps up before The burst and

ramps down after the burst. In GPRS mode, at the beginning of each burst (up to Four active transmit

slots), PA must be smoothly ramped up to some desired output power level, Held at that level for the

current slot, smoothly ramped down/up during the transition period and Held to the new level for the

next slot until the last slot. Then it must be smoothly ramped down to near-zero level. The MSM6275

support differential GSM PA power control output.

LGE Internal Use Only

Only for training and service purposes

3.10.4. RF Interface

The RF interface communicates with the mobile station external RF circuits. Signals to these Circuits

control signal gain in the Rx and Tx signal path, control DC offset errors, and maintain the system

frequency reference.

3.10.5. Serial Bus Interface (SBI)

The MSM6275 device’s SBI is designed specifically to be a quick, low pin count control Protocol for

QUALCOMM’s RFL6202, RFR6202, RTR6250, RTR6200, and PM6650 ASICs. Using the SBI, the

RTR6250, RFR6200, RFL6200, and PM6650 devices can be configured for different operating modes

and for minimum power consumption, extending battery life in standby mode. The SBI also controls

DC baseband offset errors.

3.10.6. HKADC

The MSM6275 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is Intended to

digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF

power levels.

The MSM6275 device has seven analog input pins (HKAIN[5:0]) which are multiplexed to the input of

the internal HKADC.

3.10.7. Stereo Wideband CODEC

The MSM6275 device integrates a wideband voice/audio codec into the MSM. The codec supports two

differential microphone inputs, one differential earphone output, one single-ended earphone output,

and a differential analog auxiliary interface. The codec integrates the microphone and earphone

amplifiers into the MSM6275 device, reducing the external component count to just a few passive

components. The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the

second stage set externally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for

digital transmission systems.

3.10.8. Vocoder Subsystem

The MSM6275 QDSP4000 supports AMR, FR, EFR, and HR. In addition, the QDSP4000 has modules

to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume

controls, Tx/Rx automatic gain control (AGC), Rx automatic volume control (AVC), ear seal echo

canceller (ESEC), acoustic echo canceller (AEC), noise suppression (NS), and programmable, 13-tap,

Type-I, FIR, Tx/Rx compensation filters. The MSM6275 device’s integrated ARM9TDMI processor

downloads the firmware into the QDSP4000 and configures the QDSP4000 to support the desired

functionality.

3. TECHNICAL BRIEF

- 48 -

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 49 -

3.10.9. General-Purpose Input/Output Interface

The MSM6275 device has general-purpose bidirectional input/output pins. Some of the GPIO pins

have alternate functions supported on them. The alternate functions include USB interface, additional

RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function

of these pins is documented in the various software releases.

3.10.10. UART

There are three UARTs in the MSM6275 ASIC:

•

UART1 for data

•

UART2 (can be used for USIM interface)

•

UART3 (can be used for PM SBI interface)

3.10.11. USB

The MSM6275 device integrates a universal serial bus(USB) controller that supports both

unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral

communicating with the USB host. It is also capable of a USB OTG interface to a USB OTG

Transceiver.

LGE Internal Use Only

Only for training and service purposes

3.11. External memory interface

The MSM6275 have two external memory interfaces with arbitration for the multi-layer AHB system

and memory controllers. The EBI1 bus is a high performance bus that supports a wide variety of

memories. EBI2 bus is targeted to be the interface for slow peripheral devices(i,.e., LCD) as well as

the NAND flash memory.

•

EBI1 Features

- 16 bit static and dynamic memory interface

- 32 bit dynamic memory interface

- 24 bits of address for static memory devices which can support up to 32MBytes on each chip select

- Synchronous burst memories supported (burst NOR, burst PSRAM)

- Synchronous DRAM memories supported

- Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses

- Pseudo SRAM (PSRAM) memory support

•

EBI2 Features

- Support for asynchronous FLASH and SRAM(16bit & 8bit).

- Interface support for byte addressable 16bit devices(UB_N & LB_N signals).

- 2Mbytes of memory per chip select.

- Support for 8 bit wide NAND flash.

- Support for parallel LCD interfaces, port mapped of memory mapped(16 & 8 bit)

•

512Mb NAND flash memory + 512Mb SDRAM (1die)

3. TECHNICAL BRIEF

- 50 -

Interface Spec

Device Part Name Maker Read Access Time Write Access Time

FLASH TY90009800COGG Toshiba 35 ns/Bytes 50 ns/Bytes

SDRAM TY90009800COGG Toshiba 107 ns/4Double Word 53 ns/4Double Word

Table. External memory interface for KS10

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 51 -

3.12. Hardware sub system of MSM6275

3.12.1. RF Interface

3.12.1.1. RTR6250 (WCDMA_Tx, GSM_Tx/Rx)

MSM6275 controls RF part(RTR6250) using these signals.

•

SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset

•

PA_ON : Power AMP on RF part

•

RX_I/Q,TX_I/Q : I/Q for Tx/Rx of RF

•

TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier

3.12.1.2. RFR6250 (WCDMA_Rx)

•

SBST,SBDT,SBCK : SBI I/F signals for control Sub-chipset

•

RX_I/Q, : I/Q for Rx of RF

3.12.1.3. The others

•

GSM_PA_BAND : DCS/GSM Band Selection of Power Amp

•

TRK_LO_ADJ : TCXO(19.2M) Control

•

PA_ON : WCDMA TX Power Amp Enable

•

ANT_SEL[0-2] : Ant Switch Module Mode Selection (WCDMA,GSM Tx/Rx,DCS Tx/Rx)

•

GSM_PA_RAMP : Power Amp Gain Control of APC_IC

•

GSM_PA_EN : Power Amp Gain Control Enable of APC_IC

•

GSM_TX_VCO_0_EN_N : GSM Band Tx VCO Enable of Dual VCO

•

GSM_TX_VCO_1_EN_N : DCS Band Tx VCO Enable of Dual VCO

- 52 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

(WCMDA 2100PAM Enable)

(WCMDA PAM MODE)

(Check CAM_DATA PINOUT !!!!)

MSM pin AD26

Place near

10%

Near to MSM

XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77

L25

UART3_RFR_N_GPIO87

TDI

TDO

A17

TMS

F15

TRK_LO_ADJ

L13

H15

TRST_N

H13

TX_AGC_ADJ

TX_ON_GRFC10

H12

UART2_DP_RX_DATA_GPIO89

F18

SYNTH0_GP_PDM0_GPIO92

H23

SYNTH1_GPIO41

TCK

D16

TCXO_EN_GPIO94

F19

D15

SBDT

H26

SBST

SBST1_GPIO93

H18

P25

PA_POWER_CTL

AA25

Q_IM_CH0

Q_IM_CH1

W23

Y25

Q_IP_CH0

Q_IP_CH1

V23

B12

Q_OUT

A12

Q_OUT_N

RINGER_GPIO18

L19

RTCK

H16

L21

SBCK

J23

PA_ON0

F17

MDDIC_DATN

A23

A22

MDDIC_DATP

MDDIC_STBN

B23

B22

MDDIC_STBP

MDDIH_DATN

B19

B20

MDDIH_DATP

MDDIH_STBN

A19

A20

MDDIH_STBP

I2C_SCL_GPIO27

K21

I2C_SDA_GPIO26

AB25

I_IM_CH0

V25

I_IM_CH1

AC25

I_IP_CH0

W25

I_IP_CH1

I_OUT

B13

I_OUT_N

A13

GRFC3_GPIO6

GRFC4_AUX_SBCK_GPIO7

H10

D11

GRFC5_AUX_SBST_GPIO8

GRFC7_GPIO10

T23

GRFC8_GPIO11

GRFX6_GPIO9

T19

GSM_PA_DAC_REF

AD26

N16

H17

GP_PDM1_PA_RANGE0

D17

GP_PDM2_PA_RANGE1

GRFC0_GPIO3

GRFC1_AUX_SBDT_GPIO4

GRFC2_GPIO5

F10

F12

DAC_REF

GPIO17

K26

GPIO19

G21

L15

CAMIF_DATA7_GPIO59

D20

F16

CAMIF_DATA8_GPIO60

F20

CAMIF_DATA9_GPIO61

E23

CAMIF_HSYNC_GPIO15

CAMIF_PCLK_GPIO82

K23

CAMIF_VSYNC_GPIO16

G23

BT_CLK_GPIO25

BT_DATA_GPIO20

R19

E26

BT_SBCK_GPIO23

BT_SBDT_GPIO22

E25

F23

BT_SBST_GPIO24

BT_TX_RX_N_GPIO21

H21

CAMIF_DATA0_GPIO83

J25

J26

CAMIF_DATA1_GPIO81

D21

CAMIF_DATA2_AUX_TRST_N_GPIO54

CAMIF_DATA3_AUX_TCK_GPIO55

C25

CAMIF_DATA4_AUX_TMS_GPIO56

D22

J19

CAMIF_DATA5_AUX_TDI_GPIO57

CAMIF_DATA6_AUX_TDO_GPIO58

AUX_PCM_CLK_GRFC14_GPIO80

K19

N21

AUX_PCM_DIN_GRFC13_GPIO14

AUX_PCM_DOUT_GRFC12_GPIO103

AUX_PCM_SYNC_GRFC11_GPIO102

600-1

M6275_A

R609100K

0.01u

C644

100K R611

51K

R610

R6071K

C646

0.1u

R6082K

VREG_MSMP_2.7V

C645

33nF

HPIEV_IT_STATE_ETMTRIGIN

RX0_I_P

RX0_I_M

RX0_Q_P

RX0_Q_M

EAR_SENSE_N

MSM_RTCK

MSM_TDO

HPI_IT_APE_ETMPSTA0_XTIDAT

HPI_IT_MOD_ETMSYNCA_XTIDAT

HPI_EME_MOD_ETMPSTA1_XTIDAT

HPI_EME_APE_ETMPSTA2_XTIDAT

MSM_TDI

MSM_TCK

TCXO_EN

MSM_TMS

MSM_TRST_N

TX_ON

TX_I_M

PA_ON

GSM_PA_RAMP

TX_Q_P

TX_Q_M

RF_SBCK

RF_SBDT

RF_SBST

DAC_REF

W_VMODE_N

GSM_PA_EN

GSM_PA_BAND

GSM_TX_VCO_1_EN_N

GSM_TX_VCO_0_EN_N

ANT_SEL1

ANT_SEL2

ANT_SEL0

GSM_PA_DAC_REF

TX_I_P

TX_AGC_ADJ

TRK_LO_ADJ

Figure. Schematic of RF Interface of MSM6275

- 53 -

3. TECHNICAL BRIEF

3.12.2. MSM sub system

3.12.2.1. SIM interface

SIM interface scheme is shown in Figure.

And, there control signals are followed

•

USIM_CLK : USIM Clock

•

USIM_Reset : USIM Reset

•

USIM_Data : USIM Data T/Rx

3.12.2.2. UART interface

UART signals are connected to MSM GPIO through IO connector with 115.2kbps speed.

And, used for RF calibration and Data download.

LGE Internal Use Only

Only for training and service purposes

Figure. SIM Interface

Table. UART interface

MSM6275 PM6650 USIM

USIM CLK

USIM Reset

USIM Data

USIM Reset

USIM CLK

VREG_USIM 2.85V

GPIO_Map Name Note

GPIO_96 UART_RXD Data_Rx

GPIO_95 UART_TXD Data_Tx

- 54 -

3. TECHNICAL BRIEF

3.12.2.3. USB

The MSM6275 device contains a Universal Serial Bus (USB) interface to provide an efficient

interconnect between the mobile phone and a personal computer (PC). The USB interface of the

MSM6275 was designed to comply with the definition of a peripheral as specified in USB Specification,

Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB

Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation,

namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the

MSM6275. KS10’s USB interface uses the PM6650 internal logic for USB Transceiver.

LGE Internal Use Only

Only for training and service purposes

Name Note

USB_RCV Rx_Data to MSM

USB_DAT Data to/from MSM

USB_SE0 Data to/from MSM

USB_OE_N Out-Put Enable of Transceiver

USB_VBUS USB_Power From Host(PC)

USB_D+ USB Data+ to Host

USB_D- USB Data- to Host

Table. USB signal interface

Figure. USB Interface

MSM6275_USB Block PM6650_USB Block

Figure. Schematic of USB block (MSM6275 Side & PM6650 Side)

MSM6275 PM6650 MMI

Connector

USB_D-

USB_D+

USB_VBU

USB_SE0

USB_DAT

USB_OE_

UART3_DP_RX_DATA_GPIO85

UART3_DP_TX_DATA_GPIO84

M19

P16

UART1_CTS_N_GPIO97

UART1_DP_RX_DATA_GPIO96

M23

UART1_DP_TX_DATA_GPIO95

L26

P21

UART1_RFR_N_PA_POWER_CTL_M_GPIO98

UART2_CTS_N_GPIO90

UART2_DP_TX_DATA_GPIO88

UART2_RFR_N_GPIO91

UART3_CTS_N_GPIO86

L23

M21

GPIO42

GPIO44

F14

GPIO64

GPIO39

GPIO40

PM_SBCK

MSM_UART_RXD

MSM_UART_TXD

MSM_USIM_RST_N

MSM_USIM_DATA

MSM_USIM_CLK

PM_SBDT

PM_SBST

PM_INT_N

PS_HOLD

Draw the Artwork_line thickly !!!!!

--->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-

Power Line --> Route carefully!!!!!

4.7u

smd_1608h_9_r

C731

47K R710

C7321u

+VPWR

RB521S-30

D701

GP1_DRV_N(MPP7)

LCD_DRV_N

KPD_DRV_N

KPDPWR_N

VIB_DRV_N

VSW_5V

USB_CTL_N

USB_VBUS

USB_DAT

USB_D_P

USB_SE0

USB_D_M

VREG_5V

USB_OE_N

USB_VBUS

100K

USB_CTL_N

USB_OE_N

USB_DAT

MSM_USB_D+

USB_SE0

MSM_USB_D-

- 55 -

3. TECHNICAL BRIEF

3.12.2.3. HKADC (House Keeping ADC)

The MSM6275 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to

digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF

power levels. The MSM6275 device has six analog input pins which are multiplexed to the input of the

internal HKADC.

LGE Internal Use Only

Only for training and service purposes

Figure. MSM6275 HKADC Block diagram

Table. HKADC channel table

ADC Ch# Signal Name Note

HKADC0 AMUX_OUT RF PAM Temperature sensing

HKADC1 VBATT_SENSE Battery voltage level sensing

HKADC2 HDET1 RF WCDMA PAM Power Level sensing

HKADC3 VBAT_TEMP Battery Temperature sensing

HKADC4 - -

HKADC5 - -

LGE Internal Use Only

Only for training and service purposes

3.12.3. Power Block

3.12.3.1. General

MSM6275A, included RF, is fully covered by PM6650-1M(Qualcomm PMIC). PM6650-1M cover the

power of MSM6275A, MSM memory, RF block, USIM and TCXO.

Major power components are :

PM6650-1M (U700) : Phone power supply

NUS5530MN (Q701) : External charger supply switching & Main Battery charging control

3.12.3.2. PM6650-1M

The PM6650-1M device (Figure 1-1) integrates all wireless handset power management. The power

management portion accepts power from all the most common sources - battery, external charger,

adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate

handset electronics. It monitors and controls the power sources, detecting which sources are applied,

verifying that they are within acceptable operational limits, and coordinates battery and coin cell

recharging while maintaining the handset electronics supply voltages. Eight programmable output

voltages are generated using low dropout voltage regulators, all derived from a common trimmed

voltage reference.

A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (under-

voltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental

conditions.

MSM device controls and statuses the PM6650-1M IC using a three-line Serial BusInterface(SBI)

supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface

circuit monitors multiple trigger events and controls the power-on sequence.

3. TECHNICAL BRIEF

- 56 -

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 57 -

Figure. PM6650-1M Functional Block Diagram

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 58 -

3.12.3.3. Charging control

A programmable charging block in PM6650-1M is used for battery charging. It is possible to set limits

for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on

this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is

applied or not. For additional accuracy or to capture variations over time, this voltage is routed

internally to the housekeeping ADC via the analog multiplexer. PM6650-1M circuits monitor voltages at

VCHARGER and ICHARGE pins to determine which supply should be used and when to switch

between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector)

contacts of the pass transistor respectively.

4.2V~3.96V 3.86V~3.79V 3.78V~3.75V

3.95V ~ 3.87V 3.74V~3.70V 3.69V~3.64V 3.63V~3.51V 3.50V~3.20V

KS10 Charging Control block

Figure. KS10 Battery Bar Display (Standby condition)

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 59 -

3.12.3.3.1 Trickle charging

Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided

by the PM6650-1M IC, The trickle charger is on-chip programmable current source that supplies

current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries,

with its performance specified below (3.2V). The charging current is set to 80mA.

Parameter Min Typ Max Unit

Trickle Current 60 80 100 mA

- 60 -

3. TECHNICAL BRIEF

3.12.3.3.2 Constant current charging

The PM6650-1M IC supports constant current charging of the main battery by controlling the charger

pass transistor and the battery transistor. The constant current charging continues until the battery

reaches its target voltage, 4.2V.

3.12.3.3.3 Constant voltage charging

Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of

constant voltage charging is commonly detected 10% of the full charging current (60mA)

•

Charging Method : CC & CV (Constant Current & Constant Voltage)

•

Maximum Charging Voltage : 4.2V

•

Maximum Charging Current : 650mA

•

Nominal Battery Capacity : 950 mAh

•

Charger Voltage : 4.8V

•

Charging time : Max 3 h (Except time trickle charging)

•

Full charge indication current (icon stop current) : 60mA

•

Low battery POP UP : 3.63V , 3.50V

•

Low battery alarm interval : warning tone once only

•

Cut-off voltage : 3.20V

LGE Internal Use Only

Only for training and service purposes

- 61 -

3. TECHNICAL BRIEF

3.13. Audio and sound

3.13.1. Overview of Audio & Sound & BT path

LGE Internal Use Only

Only for training and service purposes

MSM

AMP

Level

Shifter

AU_19.2M

Level

Shifter

I2CSCL0

I2CSDA0

PM_SCL SCL

SDA

UART0

UART

PCM PCM

I2S

WM_BCLK

WM_LRC

WM_MSPTCK0

WM_MSPTFS0

MSPRFS0

MSPRCK0

RXP

RSN

WM_MONO1

WM_MONO2

MIC1

MIC2

MIC_BIAS

SPK_AMP_SD_N

OUT3

LOUT1

Speaker

Receiver

Head Set

MIC

LOUT2

ROUT2

ROUT1

EAR_SENSE_N

HOOK_SENSE_N

GPIO

Switch

STN8810

(CPU)

I2S

WM_DACDAT

WM_MSPRXD0

MSPRXD0

GPIO

Filter

BT_19.2M

ANT

WM_8753

(Audio Codec)

STLC2500C

(BT)

VREG_MSMP_2.7V

PM_SDA

Figure. Block diagram ofaAudio &sSound path

LGE Internal Use Only

Only for training and service purposes

3.13.2. Audio signal processing & interface

3.13.2.1. MSM6275A audio interface

The MSM6275 device integrates a wideband audio CODEC into the mobile station modem. The

wideband codec allows the MSM device to support stereo music/ringer Melody applications in addition

to the 8 kHz voice band applications on the forward link. In the audio transmit path, the device

operates as 13-bit linear converter with software selectable 8 kHz and 16 kHz sampling rate. In the

audio receive path, the device operates as a software selectable 13-bit or 16-bit linear converter with

software selectable 8 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz sampling rate.

Through software, the Rx path can be configured as either a mono or stereo output.

The integrated CODEC contains all of the required conversion and amplification stages for the audio

front end. The CODEC operates as a 13-bit linear CODEC with the transmit (Tx) and receive (Rx)

filters designed to meet ITU-T G.712 requirements. The CODEC includes a programmable sidetone

path for summing a portion of the Tx audio into the Rx path. An on-chip Voltage/Current reference is

provided to generate the precise voltages and currents required by the CODEC.

The interface supports two differential microphone inputs and a differential auxiliary input, each of

which can be configured as single-ended if desired. In addition, the interface supports one differential

earphone output, one single-ended earphone output, and one differential auxiliary output or two single-

ended line outputs.

The CODEC is configured through the QDSP4000 command types and is not directly controlled by the

microprocessor. The CODEC configuration command is sent to the QDSP4000 and then the

QDSP4000 executes the command and configures the CODEC. Data is exchanged between the

codec interface and the QDSP4000 through its DMA interface. The QDSP4000 uses the Ex_DMA_4

channel for reading data from the codec and uses the Ex_DMA_5 channel to transfer data to the

codec. The CODEC interface is shown in more detail in Figure below.

3. TECHNICAL BRIEF

- 62 -

Figure. Detailed diagram of MSM6275 audio interface

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 63 -

3.13.2.2. STn8810 audio interface

Smart Audio Accelerator (SAA)

This high-performance block performs an audio hardware accelerator based on a programmable audio

DSP with 24-bit data path and ultra low power implementation.

Figure. Detailed diagram of STn8810 audio interface

- 64 -

3. TECHNICAL BRIEF

3.13.2.3. WM8753L audio interface

The WM8753L is a low Power, high quality stereo Codec with integrated Voice CODEC designed for

portable digital telephony applications such as mobile phone, or headset with Hi-Fi playback capability.

The device integrates dual interfaces to two differentially connected microphones, and includes

drevers for speakers, headphone and earpiece. External component requirements are reduced as no

separate microphone or headphone amplifiers are required.

Advanced on-chip digital signal processing performs tone control, Bass Boost and automatic level

control for the microphone or line input through the ADC.

LGE Internal Use Only

Only for training and service purposes

Figure. Detailed diagram of WM8753L audio interface

- 65 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

MSM6275A BLK Handset main MIC BLK

Place near

(CODEC VSS)

MSM pin W18

10%

SDCC_DAT1_GPIO99

F25

M25

SDCC_DAT2_GPIO100

SDCC_DAT3_GPIO101

M26

MICFBN

MICFBP

AC21

MICINN

AC19

AC20

MICINP

MICOUTN

AA18

AA19

MICOUTP

MDP_VSYNC_PRIMARY_GPIO105

AD2

AE3

MDP_VSYNC_SECONDA_GPIO104

MIC1N

AF20

MIC1P

AE20

AF21

MIC2N

MIC2P

AF22

MICBIAS

T15

AC22

HPH_L

W17

AA17

HPH_R

EAR1ON

AE18

EAR1OP

AF18

CCOMP

AA20

AF19

AUXIN

AE19

AUXIP

AC18

AUXON_AUXOR

AUXOP_AUXOL

AC17

C611

NANA

C608

C610

0.1u

C607

C609

L600

100nH

C600

10p

WM_HPH_R

WM_HPH_L

MICINP

WM_MONO1

WM_MONO2

MICFBN

MICFBP

MICINN

MICOUTN

MICOUTP

WM_RXN

WM_RXP

C245 1u

EVLC18S02015

VA200

C247

10p

2.2K

R221

C251

39p

2.2K

R227

MIC200

SUMY0009203

C252

39p

VA201

EVLC18S02015

39p

C246

1uC248

WM_MICBIAS

WM_MIC1P

WM_MIC1N

Head Set Jack BLK

1608

CONNECTOR VBATT_SENSE PIN CHECK!!

Between (VBATT & +5V_PWR) and (Mic signal)

CAD for EMC Noise

C249 47n

R717

VREG_MSMP_2.7V

R716

U203

NCS2200SQ2T2G

GND

OUT

VCC

VIN+

VIN-

AP_VDD_IO_2.7V

CN202

C242 33u

FB503 1000

33uC244

10pC258

47pC255

R223 68

R225 NA

C240 1u

RSB6.8CST2RVA211

EVLC14S02050VA205

EVLC14S02050

VBATT

CN203

VA208

smd_1608h_9_r

C254

2.2K

R217

680K

R226

C259

33p

0.01u

C257

C238

0.1u

C239

10p

USB_VBUS_IN

VA206 EVLC14S02050

1IN 2

OUT

NFM21PC105B1A3

U205

FB245

10u

C237

100K R219

+5V_PWR

47pC256

EVLC14S02050VA204

PSD12-LFD200

VREG_MSMP_2.7V

INSTPAR

470K

R224

C253

33u

VA203 EVLC18S02003

330K

R218

VA207 EVLC14S02050

C241 1u

AP_VDD_IO_1.8V

EVLC18S02003

VA202

0.1u

C260

68R222

ICVL0505600V150FRVA209

R216

VA210 RSB6.8CST2R

11K

R228

PSD05-LF

D201 INSTPAR

USB_D+

USB_D-

EAR_SENSE_N

HOOK_SENSE

WM_LOUT1

UART_RXD

UART_TXD

VBAT_TEMP

WM_MIC2N

WM_MIC2P

REMOTE_PWR_ON

VBATT_SENSE

WM_ROUT1

- 66 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Audio Codec(WM8753) BLK

WM_DVDD

WM_AVDD

1u C229

NAC231

C227

10p

1uC224

100K R214

C223

C226 1u

1u C230

C233 39p

C222 1u

AP_VDD_CAM_1.8V

R213100K

R209

C232 39p

R212

C235

4.7u

R211

VMID

B5 VREF

VXCLK

VXDIN

J2 VXDOUT

VXFS

R215100K

MONO2

NC1 C8

NC2 F8

NC3

NC4 G2

OUT3

OUT4 E9

J8 PCMCLK

H9 PGND

PVDD

ROUT1 D9

ROUT2 B9

RXN

RXP

H1 SCLK

G1 SDIN

SPKRVDD

GPIO4

HPVDD F9

HP_SPKRGND C9

LINE1

A1 LINE2

LOUT1

LOUT2

H4 LRC

J6 MCLK

C1 MIC1

MIC1N

D1 MIC2

MIC2N

MICBIAS

F1 MODE_GPIO3

MONO1 B6

U202

WM8753LEB-RV

A3 ACIN

B3 ACOP

ADCDAT

A5 AGND

AVDD

J4 BCLK

CSB_GPIO5

DACDAT

DBVDD

DCVDD J7

DGND H7

G8 GP1_CLK1

GP2_CLK2

C225 1u

C228 1u

C234

4.7u

WM_DVDD

C236

4.7u

WM_DACDAT

WM_LRC

WM_MSPRXD0

MSPTXD0

MSPTCK0

MSPTFS0

WM_BCLK

WM_ADCDAT

SPK_AMP_EN

WM_HPH_R

WM_HPH_L

RECEIVER--

WM_ROUT2WM_MICBIAS

AU_SW

VT_SW

PM_SDA

PM_SCL

AU_19.2M

WM_RXP

WM_RXN

RECEIVER-

WM_MONO2

WM_MONO1

WM_MIC1N

WM_ROUT1

WM_MIC1P

WM_LOUT1WM_MIC2N

WM_LOUT2

WM_MIC2P

RECEIVER+

Audio Amp for loud Speaker

SPEAKER AMP

C262

0.068u

68KR230

R232 68K

R233

10K

R229

C261

0.068u

C267

AP_+VPWR

R231

100K

2.2u

C263

1_SHUTDOWN

BYPASS

GND

IN+

4IN- 9

PGND

VDD

VO+ 5

VO- 8

TPA6205A1DRBRU208

C268 NA

C266

0.22u

SPKL-

SPKL+

SPK_AMP_EN

WM_LOUT2

WM_ROUT2

- 67 -

3. TECHNICAL BRIEF

3.14. Camera interface

KS10 has two cameras : 2M Pixel CMOS and VGA Pixel CMOS Camera Below figures shows the

camera board to board connector and camera I/F signal.

3.14.1. Mega Camera Interface

LGE Internal Use Only

Only for training and service purposes

R206 0

EVRC18S03Q015050R

G1 5

G2 10

1INOUT_A1

INOUT_A2

3INOUT_A3

INOUT_A4

INOUT_B1 9

INOUT_B2

INOUT_B3 7

INOUT_B4

FL201

G2 10

1INOUT_A1

INOUT_A2

3INOUT_A3

INOUT_A4

INOUT_B1 9

INOUT_B2

INOUT_B3 7

INOUT_B4

FL202 EVRC18S03Q015050R

G2 10

1INOUT_A1

INOUT_A2

3INOUT_A3

INOUT_A4

INOUT_B1 9

INOUT_B2

INOUT_B3 7

INOUT_B4

FL200 EVRC18S03Q015050R

G1 5

CCIRID(0)_CAM

CCIRID(1)_CAM

CCIRID(3)_CAM

CCIRID(2)_CAM

CCIRICLK_CAM

CCIRID(5)_CAM

CCIRID(4)_CAM

CCIRID(3)

CCIRID(2)

CCIRID(1)

CCIRID(0)

CCIRID(7)

CCIRID(6)

CCIRID(5)

CCIRID(4)

CCIRID(6)_CAM

CCIRID(7)_CAM

CCIRIHS_CAM

CCIRIVS_CAM

CAMCLK_27MHZ_CAM CAMCLK_27MHZ

CCIRIHS

CCIRIVS

CCIRICLK

CAMCLK_27MHZ

MCAM_27M

Figure. Schematic of 2 Mega Camera EMI/ESD filter I/F

Hi-Z

AXK7L34227

DrivenLOW

HIGH

2M_CAMERA

C2130.1u

HB-1M1005-601JT

FB207

C21210u

17 18

G3 G4

CN200

CSC3R270000BEVRS00 X200

27MHz

GND

3OUT

TRI_OPEN 1

VDD

AP_VDD_IO_2.7V

HB-1M1005-601JT

FB206

R207 100K

AP_VDD_CAM_2.7V

C214

0.01u

C21010u

INOUT_A1

2INOUT_A2

INOUT_A3

4INOUT_A4

INOUT_B1

INOUT_B2 8

INOUT_B3

INOUT_B4 6

FL203 EVRC18S03Q015050R

AP_VDD_CAM_2.7V

0.1u C211

10u C218

C207

COM1

COM2

GND

IN1

IN2

NC1

NC2

NO1

NO2

101

VCC

SLAS4717EPMTR2G

U200

AP_VDD_CAM_1.8V

C21510u

0.1u C217

HB-1M1005-601JT

FB204

FB205

HB-1M1005-601JT

0.1u C216

I2CSDA0_SW

I2CSCL0_CAM

I2CSDA0_CAM

2M_PWDN

I2CSCL0_CAM

I2CSDA0_CAM

I2CSCL0_SW

I2CSDA0_SW

2M_RSTn

2M_RSTn_CAM

CCIRID(4)_CAM

CCIRID(3)_CAM

I2CSCL0_SW

CCIRID(2)_CAM

CAM_PWR_EN

CCIRID(1)_CAM

CCIRID(0)_CAM

CCIRIVS_CAM

CCIRIHS_CAM

I2CSDA0

I2CSCL0

CCIRICLK_CAM

CCIRID(7)_CAM

CCIRID(6)_CAM

CCIRID(5)_CAM

Figure. Schematic of 2 Mega Camera Board to Board Connector

- 68 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Table. Interface between 2M Camera Module and Main Board (in camera module)

Image data outputOYUV730

Image data outputOYUV629

Image data outputOYUV528

Image data outputOYUV427

Digital I/O VoltagePIOVDD32

Digital I/O VoltagePIOVDD31

Image data outputOYUV326

Digital Core VoltagePDVDD 1.8V33

GroundGNDGND6

Initializes sensor, Active LowIRESET5

GroundGNDGND4

GroundGNDGND3

Pixel ClockOPCLK2

Non-connectionNCNC11

Non-connectionNCNC10

Clock for two-wire serial interfaceISCK9

Data for two-wire serial interfaceI/OSDA8

Non-connectionNCNC7

Analog VoltagePAVDD 2.8V16

Actuator VoltagePLVDD 2.8V15

Actuator VoltagePLVDD 2.8V14

Power down mode, active HighIPDOWN13

GroundGNDGND12

Master clockICLKIN21

GroundGNDGND20

Vertical Synchronous signalOVSYNC19

Horizontal Synchronous signalOHSYNC18

Analog VoltagePAVDD 2.8V17

GNDGNDGND1

GroundGNDGND22

Image data outputOYUV023

Image data outputOYUV124

Image data outputOYUV225

Digital Core VoltagePDVDD 1.8V34

NotePortNameNo

- 69 -

3. TECHNICAL BRIEF

The 2MCamera module is connected to main board with 34pin Board to Board connector

(AXK8L34125). Its interface is dedicated camera interface port in STN8810. The camera port supply

24MHz master clock to camera module and receive 40.078MHz pixel clock (max.15fps), vertical sync

signal, horizontal sync signal, reset signal and 8bits data from camera module.

The camera module is controlled by I2C port from STN8810.

LGE Internal Use Only

Only for training and service purposes

- 70 -

3. TECHNICAL BRIEF

3.14.2. VGA Camera Interface

LGE Internal Use Only

Only for training and service purposes

Figure. Schematic of Main slider FPCB B to B connector (in main BD)

Figure. Schematic of VGA Camera Board to Board Connector (in main slider FPCB)

AXK7L70227

MAIIN-SLIDER CON-HEADER

0R728

0R727

0R726

0R725

0R724

0R723

0R722

0R721

0R720

0R719

0R718

FB239

AP_VDD_CAM_2.7V

FB224

FB235

FB232

FB229

AP_+VPWR

INOUT_B4

G1 10

INOUT_A1

INOUT_A2 2

INOUT_A3

INOUT_A4 4

INOUT_B1

8INOUT_B2

INOUT_B3

EVRC14S03Q030100R FL204

FB222

FB236

FB237

G1 10

INOUT_A1 2

INOUT_A2 3

INOUT_A3

INOUT_A4 4

INOUT_B1

8INOUT_B2

INOUT_B3

6INOUT_B4

FB227

EVRC14S03Q030100R FL208

FB233

FB242

FB225

FB243

FB221

AP_VDD_CAM_1.8V

FB244

INOUT_A3

4INOUT_A4

INOUT_B1

INOUT_B2 8

INOUT_B3

INOUT_B4 6

FL206 EVRC18S03Q015050R

INOUT_A1

2INOUT_A2

FB241

G1 5

G2 10

INOUT_A1 1

INOUT_A2

INOUT_A3 3

INOUT_A4

9INOUT_B1

INOUT_B2

7INOUT_B3

INOUT_B4

FL205EVRC14S03Q030100R

FB223

AP_VDD_LCD_2.8V

INOUT_A1

INOUT_A2 2

INOUT_A3

INOUT_A4 4

INOUT_B1

8INOUT_B2

INOUT_B3

6INOUT_B4

EVRC14S03Q030100R FL207

G1 10

FB234

FB231FB230

G1 G2

G3 G4

35 36

CN201

FB240

FB238

CCIRID(2)

CCIRID(1)

CCIRID(0)

CCIRICLK

CCIRIHS

I2CSCL0_CAM

I2CSDA0_CAM

VGA_RSTn

CCIRIVS

CCIRID(7)

CCIRID(6)

CCIRID(5)

CCIRID(4)

CCIRID(3)

DIS_CSN

LCD_NRESET

DIS_WEN

DIS_RS

CAMCLK_27MHZ_CAM

RECEIVER+

RECEIVER-

RECEIVER--

LCD_VS

LCD_DATA(3)

LCD_DATA(5)

LCD_DATA(7)

LCD_DATA(9)

LCD_DATA(11)

LCD_DATA(13)

LCD_DATA(15)

LCD_DATA(14)

LCD_DATA(12)

LCD_DATA(10)

LCD_DATA(8)

LCD_DATA(0)

LCD_DATA(2)

LCD_DATA(4)

LCD_DATA(6)

MOT_PWR-

WLED_CTL

VGA_STANDBY

KPD_DRV_N

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_COL(4)

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

LCD_DATA(1)

VGA_CAMERA

AXK720145G

HB-1M1005-601JT

FB101

FB100

HB-1M1005-601JT

C102

AP_VDD_CAM_2.7V

C101

0.1u

C100

0.1u

192

10 11

AP_VDD_CAM_1.8V

CN100

VGA_STANDBY

CAMCLK_27MHZ_CAM

I2CSCL0_CAMCCIRICLK_CAM

I2CSDA0_CAMCCIRID(0)_CAM

CCIRID(1)_CAM

VGA_RSTn

CCIRIHS_CAMCCIRID(2)_CAM

CCIRIVS_CAMCCIRID(3)_CAM

CCIRID(7)_CAMCCIRID(4)_CAM

CCIRID(6)_CAMCCIRID(5)_CAM

- 71 -

3. TECHNICAL BRIEF

The VGA Camera module is connected to main slider FPCB with 20pin Board to Board

connector(AXK820145). The main slider FPCB is connected to main board with 70pin board to board

connector.

Its interface is dedicated camera interface port in STN8810. The camera port supply 24MHz master

clock to camera module and receive 13.5MHz pixel clock (max. 15fps), vertical sync signal, horizontal

sync signal, reset signal and 8bits data from camera module.

The camera module is controlled by I2C port from STN8810.

LGE Internal Use Only

Only for training and service purposes

Table. Interface between Camera Module and Main Board (in camera module)

Image Data[1]OD16

Image Data[0]OD05

Video Output Clock D[0:7]OPCLK4

GroundGNDGND3

Master ClockIMCLK2

Image Data[6]OD611

Image Data[5]OD510

Image Data[4]OD49

Image Data[3]OD38

Image Data[2]OD27

Data for two wire serial interfaceI/OSDA16

GroundGNDGND15

Horizontal SynchronizationOHSYNC14

Vertical SynchronizationOVSYNC13

Image Data[7]OD712

Analog core circuit power supply voltage

& Digital I/O circuit power supply voltage

PAVDD & IOVDD20

Digital core circuit power supply voltagePDVDD19

Reset initializes sensor Active LowIRESET18

Clock for two wire serial interfaceISCL17

Active ëHighíIENABLE1

NotePortNameNo

- 72 -

3. TECHNICAL BRIEF

3.14.3. LCD backlight / Camera LDO

U100(in SUB board, AAT3151) is a charge pump. U301(in main board, BH18LB1WHFB) supply a

1.8V power of mega camera and VGA camera. U303(in main board, MIC5219-2.7YM5) supply a 2.7V

power of mega camera and VGA camera.

These parts are controlled by GPIOs of STN8810.

LGE Internal Use Only

Only for training and service purposes

Figure. Schematic of charge pump

LCD_Backlight driver

ZD101

RSB6.8CST2R

C102

C101

C100

100K

R101

D4 1

EN_SET

9GND

13 PGND

8VIN

VOUT

AP_+VPWR

AAT3151IWP_T1

C1+

C1- 4

C2+ 6

C2- 10

D1 11

D2 12

U100

4.7u

C103

WLED_CTL

LED_ANODE

LED4

LED3

LED2

LED1

Figure. Schematic of camera LDO

AP_+VPWR AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

C305

2.2u

C309

AP_+VPWR

U301 BH18LB1WHFV

BGND 6

GND

1STBY

VIN

VOUT 4

BYPEN

3GND

1IN 5

OUT

U303

MIC5219-2.7YM5

C308

2.2u

C307C306

470p

CAM_PWR_EN

- 73 -

3. TECHNICAL BRIEF

3.14.4. LCD module

LGE Internal Use Only

Only for training and service purposes

Figure. LCD I/F Block Diagram

STN8810 LCD

MM_LCD_DATA[0:15]

MM_LCD_WE_N

MM_LCD_ADS_N

MM_LCD_CS_N

MM_LCD_IF_MODE_1

MM_LCD_IF_MODE_0

MM_LCD_RESET

MM_LCD_VSYNC

MM_LCD_RD_N

MM_LCD_RESET

MM_LCD_VSYNC

MM_LCD_RD_N

MM_LCD_DATA[0:15]

MM_LCD_WE_N

MM_LCD_ADS_N

MM_LCD_CS_N

Figure. LCD Module

MAIN LCD

MODULE

260K Color TFT

240 * 320 Pixel

BD663474(Hitachi) Graphic Controller Driver Main LCD Panel

- 74 -

3. TECHNICAL BRIEF

3.14.5. Display

LCD module is connected to SUB board with 35-pin zip connector(XF2B-3545-31A).

The LCD is controlled by 16-bit in STN8810.

LGE Internal Use Only

Only for training and service purposes

Figure. Schematic of Main slider FPCB B to B connector (in main BD)

Figure. Schematic of LCD connector (in SUB board)

AXK7L70227

MAIIN-SLIDER CON-HEADER

0R728

0R727

0R726

0R725

0R724

0R723

0R722

0R721

0R720

0R719

0R718

FB239

AP_VDD_CAM_2.7V

FB224

FB235

FB232

FB229

AP_+VPWR

INOUT_B4

G1 10

INOUT_A1

INOUT_A2 2

INOUT_A3

INOUT_A4 4

INOUT_B1

8INOUT_B2

INOUT_B3

EVRC14S03Q030100R FL204

FB222

FB236

FB237

G1 10

INOUT_A1 2

INOUT_A2 3

INOUT_A3

INOUT_A4 4

INOUT_B1

8INOUT_B2

INOUT_B3

6INOUT_B4

FB227

EVRC14S03Q030100R FL208

FB233

FB242

FB225

FB243

FB221

AP_VDD_CAM_1.8V

FB244

INOUT_A3

4INOUT_A4

INOUT_B1

INOUT_B2 8

INOUT_B3

INOUT_B4 6

FL206 EVRC18S03Q015050R

INOUT_A1

2INOUT_A2

FB241

G1 5

G2 10

INOUT_A1 1

INOUT_A2

INOUT_A3 3

INOUT_A4

9INOUT_B1

INOUT_B2

7INOUT_B3

INOUT_B4

FL205EVRC14S03Q030100R

FB223

AP_VDD_LCD_2.8V

INOUT_A1

INOUT_A2 2

INOUT_A3

INOUT_A4 4

INOUT_B1

8INOUT_B2

INOUT_B3

6INOUT_B4

EVRC14S03Q030100R FL207

G1 10

FB234

FB231FB230

G1 G2

G3 G4

35 36

CN201

FB240

FB238

CCIRID(2)

CCIRID(1)

CCIRID(0)

CCIRICLK

CCIRIHS

I2CSCL0_CAM

I2CSDA0_CAM

VGA_RSTn

CCIRIVS

CCIRID(7)

CCIRID(6)

CCIRID(5)

CCIRID(4)

CCIRID(3)

DIS_CSN

LCD_NRESET

DIS_WEN

DIS_RS

CAMCLK_27MHZ_CAM

RECEIVER+

RECEIVER-

RECEIVER--

LCD_VS

LCD_DATA(3)

LCD_DATA(5)

LCD_DATA(7)

LCD_DATA(9)

LCD_DATA(11)

LCD_DATA(13)

LCD_DATA(15)

LCD_DATA(14)

LCD_DATA(12)

LCD_DATA(10)

LCD_DATA(8)

LCD_DATA(0)

LCD_DATA(2)

LCD_DATA(4)

LCD_DATA(6)

MOT_PWR-

WLED_CTL

VGA_STANDBY

KPD_DRV_N

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_COL(4)

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

LCD_DATA(1)

XF2B-3545-31A-P

LCD Connector

(lower contact)

C105

820p

0R115

CN100

ZD100 RSB6.8CST2R

100K

R102

R103 100K

R104 100K

1uC104

AP_VDD_LCD_2.8V

TP100

TP102

TP101

LCD_NRESET

LCD_DATA(0)

LCD_VS

DIS_CSN

DIS_WEN

DIS_RS

LED_ANODE

LED3

LED2

LED1

LCD_DATA(1)

LCD_DATA(10)

LCD_DATA(11)

LCD_DATA(12)

LCD_DATA(13)

LCD_DATA(14)

LCD_DATA(15)

LCD_DATA(2)

LCD_DATA(3)

LCD_DATA(4)

LCD_DATA(5)

LCD_DATA(6)

LCD_DATA(7)

LCD_DATA(8)

LCD_DATA(9)

LCD_DATA(0:15)

LED4

- 75 -

3. TECHNICAL BRIEF

LGE Internal Use Only

Only for training and service purposes

Table. Interface between 2M Camera Module and Main Board (in camera module

Interface I/O PowerPVCC234

Interface mode selectIIM230

ResetIRESET29

Data Bus (Instruction & Display Data)I/ODB1528

Data Bus (Instruction & Display Data)I/ODB1427

Maker ID (HI : VCC2 level)OMID(HIGH)32

Interface mode selectIIM131

Data Bus (Instruction & Display Data)I/ODB1326

Power Supply for Analog CircuitPVCC133

Power Supply for LED-LED(AN)6

Ground for LED-LED(CA)5

Ground for LED-LED(CA)4

Ground for LED-LED(CA)3

Ground for LED-LED(CA)2

Read StrobeIRD11

Write StrobeIWR10

Chip SelectICS8

Frame Head Pulse SignalOVSYNC-OUT7

Data Bus (Instruction & Display Data)I/ODB316

Data Bus (Instruction & Display Data)I/ODB215

Data Bus (Instruction & Display Data)I/ODB114

Data Bus (Instruction & Display Data)I/ODB013

GroundGNDGND12

Data Bus (Instruction & Display Data)I/ODB821

Data Bus (Instruction & Display Data)I/ODB720

Data Bus (Instruction & Display Data)I/ODB619

Data Bus (Instruction & Display Data)I/ODB518

Data Bus (Instruction & Display Data)I/ODB417

GroundGNDGND1

Data Bus (Instruction & Display Data)I/ODB922

Data Bus (Instruction & Display Data)I/ODB1023

Data Bus (Instruction & Display Data)I/ODB1124

Data Bus (Instruction & Display Data)I/ODB1225

Ground GNDGND35

NotePortNameNo

- 76 -

3. TECHNICAL BRIEF

3.15 Bluetooth

KS10 supported bluetooth, which is possible to data file transfer, BT headset call.

CPU (STn8810) interfaces with bluetooth one chip module (U401) which includes RF and baseband.

The STLC2500C is a single chip ROM-based Bluetooth solution for applications requiring integration

up to HCI level.

The STLC2500C's main interfaces are UART for HCI transport between CPU (STn8810) and bluetooth

module, PCM for voice between audio codec.(WM8753) and bluetooth module and GPIOs for control

purposes. Voice data is transferred to CPU(STn8810) through audio codec.(WM8753).

The radio has been designed specifically for single chip requirements and for low power consumption.

Radio signal from bluetooth antenna (ANT400) is transferred to bluetooth module through BALUN filter

(FL400). Bluetooth module has its’ own oscillator (X400, 27MHz) for normal operation and use sleep

clock(32.768KHz) from PM6650, PMIC of MSM 6275.

■ Bluetooth™ specification compliance: V1.2

■ Transmit Power : Power Class2

■ Ultra low power architecture with 3 different low power levels:

- Sleep Mode

- Deep Sleep Mode

- Complete Power Down Mode

LGE Internal Use Only

Only for training and service purposes

Figure. Diagram of STLC2500C

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 77 -

3.16 Main Features

3.16.1. Main features of KS10

- Slide Type

- WCDMA(2100) + GSM(900,1800) + PCS(1900) Triple mode

- Main LCD: 320*240, 262K (2.4”)

- 2.0M Pixel CMOS Camera

- VGA CMOS Camera

- φ17 speaker

- Stereo Headset

- Video telephony in WCDMA with camera

- HSDPA up to 1.8Mbps

- Loud Speaker phone(in GSM and WCDMA)

- 64 Poly Sound

- MP3/AAC/WMA decoder and play

- MPEG4 encoder/decoder and play/save

- H.263 decoder

- JPEG en/decoder

- Support Bluetooth, USB

- 104 x 52 x 18.9 mm

- 950mAh hard pack

LGE Internal Use Only

Only for training and service purposes

2. Main Components of KS10

3. TECHNICAL BRIEF

- 78 -

LCD

MAIN Bottom SideMAIN Top Side

KEY Top Side KEY Bottom Side

1.3M camera

VGA camera

LCD FPCB

Intenna

Speaker

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 79 -

2. 1 Main Top Side

CN201

X500

U508

U701

U700

U402

U404

U406

U403

X200

U207

FL206

U306 X700

FL203

Side Key

Reference Description Reference Description

U207 over voltage protection IC X200 27MHz OSCILLATOR

U406 Analog Switch FL203 EMI_ESD FILTER

U403 Analog Switch Multiplexer FL206 EMI_ESD FILTER

U404 Key Coder IC CN201 B To B CONNECTOR

U402 hall-effect switch IC U508 RF Receiver(RFR6250E)

U701 MCP Memory U700 PMIC for MSM

U306 LDO Regulator X500 TCXO 19.2MHz

--X700 TCXO 32.768kHz

LGE Internal Use Only

Only for training and service purposes

2.2. Main Bottom Side

3. TECHNICAL BRIEF

- 80 -

Reference Description Reference Description

CN200 B To B CONNECTOR CN202 Connector(I/O, Ear jack, Power)

SW500 RF SWITCH CONNECTOR U501 GSM/EDGE Quadband PAM

CN402 JTAG-JIG-FPCB-CON CN203 Battery Connector

FL500 FILTER, SAPERATOR BAT700 Back up Battery

U506 DUPLEXER, GSM U208 AUDIO AMPLIFIER

U505 PAM _power amplifier module U502 Voltage Controlled Oscillator

U500 RF Transceiver (RTR6250D) U202 Audio Codec.

FL400 SAW FILTER _BPF U600 MSM6275 (Modem BB Chip)

J300 USIM Connector X100 19.2MHz Oscillator

U401 Bluetooth Single Chip U100 STN8810S12B2V1 (CPU)

X400 19.2MHz Oscillator U310 PMIC for CPU

U400 LDO Regulator L301 Power Inductor

S300 Micro-SD CONNECTOR MIC200 Microphone

CN202

J300 U600

U100

U310

CN402

U208

CN200

U505

U506

FL500

U500

SW500

S300

U202

BAT700

CN203

X100

U401

X400

U400

MIC200

U501

U502

L301

FL400

LGE Internal Use Only

Only for training and service purposes

3. TECHNICAL BRIEF

- 81 -

2.3. KEY Top Side

2.4. KEY Bottom Side

SW100

CN101

U100

CN100

Reference Description Reference Description

SW100 Dome Switch U100 LCD Backlight Driver

CN100 LCD Connector CN101 FUNCTION-SLIDER Connector

(FPCB to KEYPCB)

LGE Internal Use Only

Only for training and service purposes

2.5. LCD FPCB

3. TECHNICAL BRIEF

- 82 -

Reference Description Reference Description

Vibrator Vibrator PAD CN101

FUNCTION-SLIDER

Receiver Receiver PAD

Connector (FPCB to KEYPCB)

CN100 VGA_CAMERA Connector CN102

MAIN-SLIDER CON-SOCKET

CN101

CN100

Receiver

CN102

Vibrator PAD

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 83 -

4. TROUBLE SHOOTING

4.1 RF Component

RF component (Bottom)

U502

U503

U505

SW500

U504

U507

U501

U506

U500

FL500

Reference Description Reference Description

U505 WCDMA PAM U507 Coupler

U506 WCDMA Duplexer U501 GSM/D/PCS PAM

U503 WCDMA TX SAW U504 HDET

FL500 Front-End-Module U500 GSM/WCDMA Transceiver (RTR)

U502 GSM TX VCO SW500 RF Antenna Connector

LGE Internal Use Only

Only for training and service purposes

RF component (Top)

4. TROUBLE SHOOTING

- 84 -

FL501

U508

Reference Description

U508 RFR6250(WCDMA RX)

FL501 WCDMA RX SAW

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 85 -

4.2 SIGNAL PATH

GSM/DCS/PCS Rx Tx PATH

A. GSM/DCS/PCS Tx PATH

B. GSM/DCS/PCS Rx PATH

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 86 -

WCDMA RX/ TX PATH

C. WCDMA Tx PATH

D. WCDMA Rx PATH

- 87 -

4. TROUBLE SHOOTING

4.3 Checking VCXO Block

The reference frequency (19.2MHz) from X100 (VCXO) is used WCDMA TX

part, GSM part and BB part.

LGE Internal Use Only

Only for training and service purposes

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 88 -

Check 1. Crystal part

If you already check this crystal part, you can skip check 1.

Test Point (Crystal Part)

TCXO

C564

0.01u

C567

1000p

100ohm

R525

C563 1000p

GNDOUT

VCC

4VCONT 1

19.2MHz

X500

100pC559

C566

0.1uF

VREG_TCXO_2.85V

1000pC562

TCXO_PM

RTR6250_TCXO

RFR6250_TCXO

TRK_LO_ADJ

Schematic of the Crystal Part

TP3

TP2

TP1

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 89 -

Schematic of the Crystal Part (19.2MHz)

TP1

C153

0.1u

C152

AP_VDD_IO_1.8V

TRI_OPEN

VDD

19.2MHz

X100

CSC3M192000EEVRS00

GND

OUT

VCC

NL17SZ08XV5T2

U101

GND

AP_VDD_IO_1.8V

VCC U103

NL17SZ08XV5T2

GND

C1540.1u

C1510.1u

AU_CLK_EN

AU_19.2M

REQUEST_MC

PWREN

CPU_19.2M

TP1

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 90 -

Check TP1

VCC of VCXO

VCC 2.8V

Check TP2

TRK_LO_ADJ

3V Voltage 0V

Check TP3

With Oscilloscope

19.2MHz Signal

VCXO is OK

Check other part

Check PMIC

Check MSM

Check soldering

and components

Yes

≥

≥≥

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 91 -

4.4 Checking Ant. Switch Module Block

VREG_RFR_2.85V

C511

47p

C502

56p

ANT500

C506

C512

L514 7.5nH

C520

0.1u

ANT501

47p

C510

L502

UMTS_TX_RX

VC1

VC2

VC3

VDD

ANT

DCS_PCS_TX

DCS_RX1

DCS_RX2

EGSM_RX1

EGSM_RX2

EGSM_TX

GND1

GND2

GND3

GND4

GND5

GND6

PCS_RX1

PCS_RX2

FL500ESHS-L090UB

C500 56pC501

C509

47p

KMS-512

SW500

ANT

G2RF

56nH

L504

C519

47p

C507 1.5nH

C513

WCDMA_2100

ANT_SEL0

ANT_SEL1

ANT_SEL2

Schematic of the Antenna Switch Block

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 92 -

Logic Table of the Antenna Switch

Checking Switch Block power source

Check Soldering of

ANT_SEL0, 1, 2 High Level

2.5V < Voltgae < 3.0V Check VCC

TP1 VREG_RFRX_0_2.85V

Check the Logic

in each mode

YES

Mode ANT_SEL0 ANT_SEL1 ANT_SEL2

EGSM TX High Low Low

EGSM RX Low Low Low

DCS/PCS TX Low High High

DCS RX Low Low High

PCS RX Low High Low

UMTS Low Low Low

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 93 -

4.5 Checking WCDMA Block

START

1. Check VCXO 19.2MHz

2. Check ANT. SW Module

ANT_SEL0, 1, 2

3. Check RF Tx Level

4. Check PAM Block

5. Check RF Rx Level

6. Re-download SW & CAL.

3.4

LGE Internal Use Only

Only for training and service purposes

4.5.1 Checking VCXO Block

Refer to 3.3

4.5.2 Checking Ant. SW module

Refer to 3.4

4.5.3 Checking RF TX Level

Test Point (RF TX Level)

4. TROUBLE SHOOTING

- 94 -

TP1

TP2

TP3

TP4

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 95 -

VREG_RFR_2.85V

C511

47p

C502

56p

ANT500

C506

C512

L514 7.5nH

C520

0.1u

ANT501

47p

C510

L502

UMTS_TX_RX

VC1

VC2

VC3

VDD

ANT

DCS_PCS_TX

DCS_RX1

DCS_RX2

EGSM_RX1

EGSM_RX2

EGSM_TX

GND1

GND2

GND3

GND4

GND5

GND6

PCS_RX1

PCS_RX2

FL500ESHS-L090UB

C500 56pC501

C509

47p

KMS-512

SW500

ANT

G2RF

56nH

L504

C519

47p

C507 1.5nH

C513

WCDMA_2100

ANT_SEL0

ANT_SEL1

ANT_SEL2

WCDMA

C570

0.01u

L526

3.9nH

C561

22p

12p

C581

C569

15p

C580

L527

1.2p

R531

100p

C574

INOUT

EFCH1950TDC1

U503

G3 1

+VPWR

C568

22u

U506ACMD-7601

ANT

RX TX

1.8nHC560

C573

0.1u

450OHM

COUP

OUT

6.2KR529

110 VCC2

VMODE

VREF 5

AWT6277R U505

GND1 3

GND2

7GND3

9GND4

GND5

RFIN

RFOUT

VCC1

C575

1.8nH

L525

8.2nH

C571

3.9nH

R530

0.01u

WCDMA_2100_TX_OUT

WCDMA_2100

W_VMODE_N

TP1

TP4

TP3

TP2

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 96 -

For testing, Max power output is needed.

Set the Phone Tx is ON

and PDM is 450

Check TP1

Over 21dBm ?

Change the board

RF Tx Level is OK

Check FEM

Check PAM Block

Refer to 3.5.4

YES

Check TP2

Over 19dBm ?

YES

Check TP3

Over 15dBm ?

YES

Check TP4

Over -5dBm ?

YES

Check Duplexer

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 97 -

4.5.4 Checking PAM Block

PAM control signal

PA_ON : WCDMA Tx Power Detect IC(HDET) Enable

PA_RO: WCDMA Tx Power Amp Gain Control

PA_ON must be HIGH(over 2.5V)

PA_FET_N must be LOW if the max Tx power is set (lower than 0.5V)

PAM_OUT

PAM_IN

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 98 -

PAM IN/OUT Signal

PAM OUT must be over 15dBm

PAM IN must be over -5dBm

PAM_IN

PAM_OUT

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 99 -

WCDMA

C570

0.01u

L526

3.9nH

C561

22p

12p

C581

C569

15p

C580

L527

1.2p

R531

100p

C574

INOUT

EFCH1950TDC1

U503

G3 1

+VPWR

C568

22u

U506ACMD-7601

ANT

RX TX

1.8nHC560

C573

0.1u

450OHM

COUP

OUT

6.2KR529

110 VCC2

VMODE

VREF 5

AWT6277R U505

GND1 3

GND2

7GND3

9GND4

GND5

RFIN

RFOUT

VCC1

C575

1.8nH

L525

8.2nH

C571

3.9nH

R530

0.01u

WCDMA_2100_TX_OUT

WCDMA_2100

W_VMODE_N

ILNA_OUT

TP1

TP3

TP2

LGE Internal Use Only

Only for training and service purposes

4.5.5 Check RF Rx Level

Test Point (RF Rx Level)

4. TROUBLE SHOOTING

- 100 -

TP1

TP2

TP4 TP3 BIAS

TOP BOTTOM

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 101 -

VREG_RFR_2.85V

C511

47p

C502

56p

ANT500

C506

C512

L514 7.5nH

C520

0.1u

ANT501

47p

C510

L502

UMTS_TX_RX

VC1

VC2

VC3

VDD

ANT

DCS_PCS_TX

DCS_RX1

DCS_RX2

EGSM_RX1

EGSM_RX2

EGSM_TX

GND1

GND2

GND3

GND4

GND5

GND6

PCS_RX1

PCS_RX2

FL500ESHS-L090UB

C500 56pC501

C509

47p

KMS-512

SW500

ANT

G2RF

56nH

L504

C519

47p

C507 1.5nH

C513

WCDMA_2100

ANT_SEL0

ANT_SEL1

ANT_SEL2

(1%)

4.7u

C593

VOPS VRMS

ADL5500 U504

C594

0.1u

100p

C592

C570

0.01u

12p

C581

R535

R532

11.3K

680p

C587

10p

C595

C599

100p

C580

L527

1.2p

C585

100p

R531

100p

C574

L532

100nH

L533

2.7nH

100p

C800

VREG_RFR_2.85V

C568

22u

U506ACMD-7601

ANT

RX TX

32 VDDA5

VDDA6

36 VDDA7

VDDA8 45

VDDM

VDDRF1 3

VDDRF2

19 VDDRF3

PMIXM

PMIXP 11

RX_IM

20 RX_IP

23 RX_QM

RX_QP

R_BIAS

SBCK 42

SBDT 43

SBST

33 TCXO

25 UMTS_TUNE

VDDA1 7

24 VDDA2

26 VDDA3

VDDA4

GND

GPS_TUNE

GRX_IM 39

GRX_IP

GRX_QM

GRX_QP 38

ILNA_BIAS

18 ILNA_IN

ILNA_OUT

IMIXM

IMIXP 928 LO_OUT

PGND

15 PLNA_BIAS

PLNA_IN

PLNA_OUT

BLANK 2

29 CP_DUMP

CP_OUT

31 FAQ

GLNA_BIAS

GLNA_IN

GLNA_OUT

GMIXM 5

GMIXP

RFR6250E

U508

C572

1500pC573

0.1u

100p

C588

450OHM

COUP

OUT

110 VCC2

VMODE

VREF 5

AWT6277R U505

GND1 3

GND2

7GND3

9GND4

GND5

RFIN

RFOUT

VCC1

C596

4.7p

C575

1.8nH

C586

100p

1.2p

C597

0.1u

C598

C591

4.7u

C571

3.9nH

R530

0.01u

WCDMA_2100

HDET1

CP2_OUT

ILNA_OUT

RX0_I_M

RX0_I_P

RX0_Q_M

RX0_Q_P

0.1u

C579

C578

8.2p

C584

33p

L530

2.2nH

L529

33nH

B7827

FL501

L528

2.7nH

C577

33p

L531

2.7nH

ILNA_OUT

IMT_RX_M

IMT_RX_P

TP1

TP2

TP3 BIAS

TP4

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 102 -

Set the Phone Rx is ON

Check BIAS

Over 2V ?

Change the board

Check bias block

soldering

Check RF s/w

Check Duplexer

YES

Check TP1

Signal exist?

YES

Check TP2

Signal exist?

YES

Check TP3

Signal exist?

YES

Check FEM

Check TP4

Signal exist?

Check RFR6250

YES

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 103 -

4.6 Checking GSM Block

Start

1. Check TXVCO Block

2. Check ANT.SW

Module

3. Check TX PAM Block

4. Check RF RX Level

4. Re download SW & CAL

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 104 -

4.6.1 Checking VCO Block

NO OSCILLATION HIGH

(1%)

DCS1800/PCS1900

HIGH

(1%)

TX VCO CONTROL LOGIC

GSM850/900 HIGH

HIGHLOW

TP5

LOW

TP4

C537

120p

15p

C556 15p

C557

R517 100ohm

330p

VBATT

C535

VREG_RFTX_2.85V

R523

FB502

270

100p

C547

R524

0.1uF

C555

39 VDDA11

VDDA12

43 VDD_M

40 TX_MOD_

TX_VCO_F

38 GSM900_I

VREG_MSMP_2.7V

R521

220

R519 100ohm

C554

33p

0R508

R507 100

GND1 2

GND2 4

GND3 6

GND4

GND5

GND6

13 GND7

GND8

5OUT_DCSPCS

1OUT_GSM 9

SW1 11

SW2

MQW5V0C869M U502

R513

C553

tcc_1608h_9_r

4.7u

R510

100

C546

1000p

15R518

15R516

0.01u

C545

220

R520

100ohmR514

C541 82p

270

R522

C539

5.6n

ECHU1C562JX5

22u

C543

GSM_PA_RAMP

GSM_TX_VCO_0_EN_N

GSM_TX_VCO_1_EN_N

TX_ON

TP2 TP1

TP3

TP5

TP4

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 105 -

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 106 -

4.6.2 Checking Ant. SW Module

Refer to chapter 3.4

4.6.3 Checking RF Tx level

LOW

DCS RX LOW

(1%)

IN_C

LOW

HIGH

LOW

IN_B

LOW

IN_A

LOWGSM 900 RX

PCS RX

DCS/PCS TX

ANTENNA SWITCH MODULE LOGIC

LOW

HIGH

UMTS 2100

HIGH

LOWGSM900 TX

LOWLOW

HIGH

VREG_RFR_2.85V

C531

33p

C511

47p

C528

C502

56p

ANT500

C506

2.2KR506

C512

C529

L514 7.5nH

C536

68p

C530

33p

C520

0.1u

ANT501

47p

C510

L522

18nH

L502

UMTS_TX_RX

VC1

VC2

VC3

VDD

ANT

DCS_PCS_TX

DCS_RX1

DCS_RX2

EGSM_RX1

EGSM_RX2

EGSM_TX

GND1

GND2

GND3

GND4

GND5

GND6

PCS_RX1

PCS_RX2

FL500ESHS-L090UB

C500 56pC501

C509

47p

KMS-512

SW500

ANT

G2RF

56nH

L504

L523

22nH

C519

47p

GND3

GND4

GND5

GND6

GND7

17 GND8

GSM_IN

9GSM_OUT

TX_EN 3

VBATT

VCC

VRAMP

TQM7M5003

U501

DCS_PCS_IN 1

DCS_PCS_OUT

GND1 5

GND2

R511

L524

1.5nH

C507 1.5nH

C513

GSM_PA_EN

GSM_PA_BAND

WCDMA_2100

ANT_SEL0

ANT_SEL1

ANT_SEL2

TP3

TP2

TP1

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 107 -

Check TP1

If GSM over 31dBm ?

If DCS/PCS over 28dBm ?

STAR

GSM/DCS/PCS

Tx is Ok

Check other part

Check ANT. SW

Module

Refer to chapter 3.4

Change the Board

Check Soldering of

PAM (U101)

If problems stiil exist, replace

PAM.

YES

Check TP2, TP3

If TP2 over 29dBm ?

If TP3 over 25dBm ?

Check PAM Block

OK ?

Refer to chapter 3.6.4

Check TXVCO

Refer to chapter 3.6.1

YES

Problems resolved?

YES GSM/DCS/PCS

Tx is OK

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 108 -

4.6.4 Checking PAM Block

PAM Control Signal

TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.5V < Vapc <

2.6V,

TP2. GSM_PA_EN : Power Amp Enable

(Power ON : higher than 2.5V , Power OFF : lower than 0.7V)

TP3. +VPWR : PAM Supply Voltage Vcc higher than 3.28V

(1%)

C531

33p

VBATT

R523

270

2.2KR506

R524

C544

100p

C536

68p

C530

33p

R521

220

L522

18nH

R513

15R518

15R516

220

R520

GND3

GND4

GND5

GND6

GND7

17 GND8

GSM_IN

9GSM_OUT

TX_EN 3

VBATT

VCC

VRAMP

TQM7M5003

U501

DCS_PCS_IN 1

DCS_PCS_OUT

GND1 5

GND2

R511

L524

1.5nH

270

R522

22u

C543

GSM_PA_EN

GSM_PA_BAND

GSM_PA_RAMP

TP1

TP3

TP2

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 109 -

4.6.5 Checking RF Rx Block

(1%)

(change to 4.53k)

(1%)

C514

1000p

9.1nH

L519

L510

3.3nH

R502

4.7K

3.3nH

L500

L516

10nH

L520

C504

1000p

R501

4.3K

FB500

39 VDDA11

VDDA6

VDDA7 26

VDDA8 27

31 VDDA9

VDDA10

34 GSM1800_INN

GSM1800_INP

GSM1900_INN

GSM1900_INP 25

GSM850_INP 22

38 GSM900_INN

GSM900_INP

RX_VCO_IN

32 R_BIAS

U500

RTR6250D

CP2

CP_HOLD2

FAQ2

L517

9.1nH

1000p

C527

3.6nH

L505

C515

33p

5.1nH

L513

0R508

R507 100

6.8n

C526

ECHU1C682JX5

C508 33p

L507

5.1nH

VREG_RFTX_2.85V

C521

680p

11.3KR503

C516

33p

L508

7.5nH

C525

0.01u

L501

3.6nH

7.5nH

L511

CP2_OUT

UHF_LO_BUFF

PCS Band Rx

1930-1990 MHz

DCS Band Rx

1805-1880 MHz

GSM Band Rx

925-960 MHz

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 110 -

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 111 -

BB Trouble Shooting

4.7 Power on trouble

Power on sequence of KS10 is :

PWR key press →KEY_ON_SW_N go to low (D405, PM6650-1M KPDPWR_N pin#24) →PM6650-

1M Power Up →VREG_MSMC_1.375V(C735), VREG_MSME_1.8V(C736),

VREG_MSMP_2.7V(C730), VREG_MSMA_2.6V(C726), VREG_TCXO_2.85V(C710) power up →

PON_RESET_N assert to MSM and PON assert to STn8810 →VDD_IO_2.7V(C304),

VDD_IO_1.8V(C311),AP_VCORE(C314),AP_VPLL(C328),AP_VFUSE(C329) power up -> CPU and

Phone booting & PS_HOLD(D700) assert High to PMIC(PM6650-1M)

Start

Battery voltg. higher

than 3.22V?

Press PWR key

Keypad LED on?

VA100 high to low

when key press?

Is clock ok?

X100 : 19.2M

X600 : 32.768Khz

Change the Main board

Change or charging the

Battery

Follow the LED trouble

shoot

Check open Pattern

of power button

Change the Main board

Check the TXCO

YES

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 112 -

VDD_IO_2.7V(C304)

VDD_IO_1.8V(C311)

AP_VCORE(C314)

AP_VPLL(C328)

AP_VFUSE(C329)

X100

PS_HOLD(D700)

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 113 -

KEY_ON_SW_N (D405)

VREG_MSMC_1.375V(C735)

VREG_MSME_1.8V(C736)

VREG_MSMP_2.7V(C730)

VREG_MSMA_2.6V(C726)

VREG_TCXO_2.85V(C710)

X500

X700

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 114 -

4.8 USB trouble

USB Initial sequence of KS10 is :

USB connected to KS10 →USB_VBUS_IN(VA205) go to 5V

→USB_VBUS_EN go to high (Q702 Pin_2) →USB_VBUS(D701) go to 5V

→USB_D+(VA202) go to 3.3V →48M Crystal on →USB_DATA is triggered →USB work

Start

USB_VBUS is about

to 5V?

USB_D+ is about to 3.3V?

48MHz is run?

Change the Main board

Check Q702, D701

USB cable

Check VA202

Check X600

YES

Cable is insert?

YES

Cable insert

X600(48MHz)

VA202 (USB_D+)

VA205(USB_VBUS_IN)

D701(USB_D+)

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 115 -

4.9 SIM detect trouble

USB Initial sequence of KS10 is :

VREG_USIM_2.85V(C739 of PM6650) go to 2.85V →USIM clock, reset and data triggered

→USIM IF work (Schematic and place are refer to SIM technical brief)

Start

Work well?

VREG_USIM_2.85V is 3.0V?

USIM_P_CLK is run?

Change the Main board

End

Check J300, C739,

VA300,VA301,

VA302,VA303

Yes

YES

Re-insert the SIM card

Change SIM card

Work well? End

Yes

VA303 (VREG_USIM_2.85V)

VA302(USIM_P_RST_N)

C739 (VREG_USIM_2.85V)

J300

VA301 (USIM_P_CLK)

VA300 (USIM_P_DATA)

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 116 -

4.10 Key sense trouble

Key Sense sequence of KS10 is :

Default condition ROW(0-3) is 2.7V →Press the key →Corresponding ROW(x) and COL(x) go to

0V →Key sensing by key coder IC (U404) →Key coder IC send the key information to CPU by I2C

interface

Check Metal

DOME SHEET

Sub & Main

board

Check the RA400 with no key press

Change the Main board

Yes

Change the side key

Check the RA400 with key press

ROW(0-4) is 2.7V? Check RA400

Yes

ROW(0-4),

COL(0-4) is 0V?

Work well?

End

START

Check R414, 415, C418,TP407,TP406

YES

Change FPCB

Work well?

Change Sub board

Work well?

YES

Dome sheet

Side Key

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 117 -

RA400 U404R415R414

C418TP406 TP407

TP407

0.1u

C418

R415

3.3K

TP406

C419

0.1u

3.3K

R414

Wake_INP2 E7

Wake_INP3

Wake_INP4

Wake_INP5 A7

Wake_INP6

B5 Wake_INP7

_RESET

NC1 F5

NC2

NC3 F6

NC4

NC5

NC6 C1

NC7

NC8 B7

F1 PWM

SCL_AB E6

SDA_AB

VCC1

VCC2

WD_Out

Wake_INP0 D7

Wake_INP1Gen_IO_0

D1 Gen_IO_1

Gen_IO_2

Gen_IO_3

A1 Gen_In0

Gen_In1

Int_Rx G2

Int_Tx F2

K_Out0

K_Out1 F4

K_Out2

K_Out3 G5

K_Out4

B4 K_Out5

K_Out6

A3 K_Out7

LM8333GGR8_NOPB

U404

B1 CLK_In

GND1

C4 GND2

C5 GND3

GND4

D4 GND5

GND6

GND7

E4 GND8

GND9

AP_VDD_IO_2.7V

68KR419

FOLDER_DETECT

I2CSCL1

I2CSDA1

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

KEY_COL(4:7)

KEYCODER_RSTN

KEYCODER_INT

KEY_ROW(0:3)

KEY_ROW(2)

KEY_ROW(3)

KEY_ROW(0)

KEY_ROW(1)

KEY_COL(3)

KEY_COL(2)

KEY_COL(3:0)

KEY_COL(1)KEY_COL(4)

KEY_COL(0)

SW400

SW409

SW406

AP_VDD_IO_2.7V

RA400 100K

SW403

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

RA400

R415

TP406

TP407

C418

R414

Schematic of key sense part

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 118 -

4.11 Keypad backlight trouble

Key Pad Back Light is on as below :

Key pressing →STn8810 commend MSM6275 lighting the Key LED →

MSM 6275 KPD_DRV_N go to Low →LED On (Key Pad LED controlled by PM6650)

Start

Check device short :

LD400~407 and R402~412 (Main)

LD101~108 and R106~114 (Sub)

Yes

Key press

Signal KPD_DRV_N

is Low?

AP_+VPWR is OK?

Check connection

between Main and FPCB

and between FPCB and Sub

Only Sub board LED

is not work?

Change the main board

Yes

Yes Check device open :

LD400~407 and R402~412 (Main)

LD101~108 and R106~114 (Sub)

Some LED

is not work?

Work well?

Yes

Change the main & Sub board

En d

LD400~407 and R402~412 (Main)

LD101~108 and R106~114 (Sub)

R400 (AP_+VPWR)

VA400 (KPD_DRV_N)

- 119 -

4. TROUBLE SHOOTING

Main

SUB

LGE Internal Use Only

Only for training and service purposes

100ohmR411

SSC-TWH104-HLS

LD407

SSC-TWH104-HLS

LD406

SSC-TWH104-HLS

LD402

EVL14K02200

VA400

R409 100ohm

100ohmR412

AP_+VPWR

LD400

SSC-TWH104-HLS

100ohmR406

R400

R408 100ohm

SSC-TWH104-HLS

LD401

SSC-TWH104-HLS

LD403

R403 100ohm

SSC-TWH104-HLS

LD405

100ohmR405

R402 100ohm

LD404

SSC-TWH104-HLS

KPD_DRV_N

100ohmR109

EVL14K02200

VA100

100ohmR111

100ohmR110

LD108

SSC-TWH104-HLSSSC-TWH104-HLS

LD107

LD104

SSC-TWH104-HLS

AP_+VPWR

SSC-TWH104-HLS

LD103

100ohm

100ohmR113

R112

100ohmR114

LD102

SSC-TWH104-HLS

LD100

SSC-TWH104-HLS

100ohmR107 100ohm R108R106 100ohm

SSC-TWH104-HLS

LD101

LD105

SSC-TWH104-HLS SSC-TWH104-HLS

LD106

KPD_DRV_N

LD400~407 and R402~412 (Main)

LD100~108 and R106~114 (Sub)

VA400 (KPD_DRV_N)

R400 (AP_+VPWR)

Schematic of keypad backlight part

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 120 -

4.12 Folder on/off trouble

Folder On/Off(Close/Open) is worked as below :

Folder On/Off Event →Flip(U402 pin 1,key board) is triggered(Open : about 2.7V, Close : 0V)

→Key coder IC(U404) sense the Folder Flip Event →Key coder IC send the key

information to CPU by I2C interface

Insert the magnet

Check the magnet in

folder Assy

Approach the magnet to U402

FLIP(U402p in 1) is 0V?

Yes

Check the U402

And check the R413

for AP_VDD_IO_2.7V

Start

End

Yes

Change the Main Board

Check R414, 415, C418,TP407,TP406

Work well?

YES

Work well?

RA400 U404

R415

R414

C418

TP406

TP407

magnet

U402

R413

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 121 -

TP407

0.1u

C418

R415

3.3K

TP406

C419

0.1u

3.3K

R414

Wake_INP2 E7

Wake_INP3

Wake_INP4

Wake_INP5 A7

Wake_INP6

B5 Wake_INP7

_RESET

NC1 F5

NC2

NC3 F6

NC4

NC5

NC6 C1

NC7

NC8 B7

F1 PWM

SCL_AB E6

SDA_AB

VCC1

VCC2

WD_Out

Wake_INP0 D7

Wake_INP1Gen_IO_0

D1 Gen_IO_1

Gen_IO_2

Gen_IO_3

A1 Gen_In0

Gen_In1

Int_Rx G2

Int_Tx F2

K_Out0

K_Out1 F4

K_Out2

K_Out3 G5

K_Out4

B4 K_Out5

K_Out6

A3 K_Out7

LM8333GGR8_NOPB

U404

B1 CLK_In

GND1

C4 GND2

C5 GND3

GND4

D4 GND5

GND6

GND7

E4 GND8

GND9

AP_VDD_IO_2.7V

68KR419

FOLDER_DETECT

I2CSCL1

I2CSDA1

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

KEY_COL(4:7)

KEYCODER_RSTN

KEYCODER_INT

KEY_ROW(0:3)

KEY_ROW(2)

KEY_ROW(3)

KEY_ROW(0)

KEY_ROW(1)

KEY_COL(3)

KEY_COL(2)

KEY_COL(3:0)

KEY_COL(1)KEY_COL(4)

KEY_COL(0)

SW400

SW409

SW406

AP_VDD_IO_2.7V

RA400 100K

SW403

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3) FOLDER_SENSE

AP_VDD_IO_2.7V

0.1u

C414

U402 A3212EEH-T

3GND1

GND2 4

2NC1 5

NC2

1OUTPUT

PGND

VDD

EUSY0200301

R413

100K

C413

ZD1

RSB6.8CST2R

FOLDER_DETECT

R414 R415

TP406

TP407

C418

RA400

R413

U402

U404

Schematic of Folder on/off part

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 122 -

4.13 Micro SD trouble

Micro SD is worked as below :

Micro SD insertion →Card Detect (SD_INT) goes to low →STn8810 detect SD_INT and

assert VMMC_3.1V by STw4810 →go working

Does the micro SD icon

appears ?

SD_INT(C343,NA)

is be low ?

Insert the Micro SD Card

Start

End Check the Pull up resistor

R309, R310,R311,R313,R314

Check VMMC_3.1V

is over 2.85V?

Work well?

YES

C343 (SD_INT)

C339 (VMMC_3.1V)

Change the main board

YES

R309 R310

R311

R313

R314

- 123 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

C339

R310 51K

D301

PLR0504F

51K

R309

R311 51K

51K

R313

PLR0504F

D300

R314 51K

C343

R312

SWASWBGND

GND

GCC110-8S-R-E1000

S300

VMMC_3.1V

SD_INT

SD_DAT(1)

SD_DAT(0)

SD_CLK

SD_CMD

SD_DAT(3)

SD_DAT(2)

R309

R310

C343 (SD_INT)

R311 R313

R314

C339 (VMMC_3.1V)

Schematic of Micro SD

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 124 -

4.14 Charging trouble

• Charging Procedure

- Connecting TA or USB Cable

- Control the charging current by PM6650-1M IC using USB_CNT_N or CHG_CNT_N signal

- Charging Current flows into the battery by control BATT_FET_N

• Check Point

- Connection of TA or USB Cable

- Charging current path

- Battery

• Trouble Shooting Setup

- Connect TA or USB Cable and battery to the phone

• Trouble Shooting Procedure

- Check the charger connector

- Check the charging current path

- Check the battery

Battery charging circuit !!!!!

2012

Route as equal length as possible! -> ICHARGE, ICHARGEOUT

+5V_PWR

+VPWR

Drain_B

Emitter 8

Gate

NC1

NC2 6

Source

Q701 NUS5530MN

Base

2Collector

Collector_B 9

4Drain

USB_VBUS

0.1R713

VBATT

Q700

QST4

312

ICHARGE

BATT_FET_N

ICHARGEOUT

USB_CTL_N

CHG_CNT_N

Pass control Tr

(ON)

4.2~4.25V

Main

Battery

(4.6V)

Battery FET

(ON)

Charging Current Flow

Pass control Tr

(ON)

USB Cable

(5.0V)

USB Charging control

TA Charging

control

Charging current

sensing

Battery charging

control

Q700

Q701

Q602

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 125 -

Start

Check the pin and battery

Connect terminals of I/O connector

Connection OK? Change I/O connector

Is the TA voltage 4.8V?

Is the USB voltage 5.0V? Change TA/USB cable

Check the Q700,Q701

END

Change the board

Yes

Charging OK?

Yes

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 126 -

Q701

Q700

VBAT

GND

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 127 -

4.15 Audio trouble

4.15.1 Receiver path

Voice Receiver path as below:

MSM6275A Ear1ON/Ear1OP → U202(audio codec) →CN201(b’d to b’d connector for LCD Module)

→CN102(LCD b’d to b’d connector of LCD FPCB) →R100, R101 →Receiver

Start

Change the Main board

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

YES

The sine wave appear at

R100,R101 of LCD FPCB?

Can you hear the tone?

YES

END

Check connector pin

or change the LCD FPCB

YES

Change the Receiver

Hear the tone to the receiver?

END

The sine wave appear at

C225,C226?

The sine wave appear at

R211,C212?

Check the U202 or

Change the Main board

YES

Check the pads of Receiver

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 128 -

LCD connector

C225, C226

ReceiverR100, R101

Receiver

pads

R211, R212

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 129 -

4.15.2 Voice path for headset

Voice path for Head_Set as below:

MSM6275A HPH_R, HPH_L →C222,C224 U202(audio codec) →FB702, FB704 →C242,C244

→ #4, #5 pin of CN202 headset Jack

Start

The sine wave appear at

C222,C224 ? Change the Main board

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

And insert head_Set

The sine wave appear at

C242,C244 ?

YES

Check the U202

or change the Main b'd

Can you hear the tone?

YES

END

Headset insertion detection

in the Main LCD Display OK?

Check #8 pin of CN202

or change the Main b'd

YES

Check the CN202

or change the Main b'd

- 130 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

CN202

C242

C244

1608

CN202

C242 33u

FB503 1000

33uC244R223 68

R225 NA

C240 1u

VBATT

1IN 2

OUT

U205

FB245

100K R219

+5V_PWR

C241 1u

68R222

USB_D+

USB_D-

EAR_SENSE_N

WM_LOUT1

WM_MIC2N

WM_MIC2P

REMOTE_PWR_O

WM_ROUT1

Schematic of voice path

C242

C244

- 131 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

Schematic of voice path

C222 C224

U202

WM_DVDD

WM_AVDD

1u C229

1uC224

100K R214

C226 1u

1u C230

C222 1u

R213100K

C235

4.7u

VMID

B5 VREF

VXCLK

VXDIN

J2 VXDOUT

VXFS

R215100K

MONO2

NC1 C8

NC2 F8

NC3

NC4 G2

OUT3

OUT4 E9

J8 PCMCLK

H9 PGND

PVDD

ROUT1 D9

ROUT2 B9

RXN

RXP

H1 SCLK

G1 SDIN

SPKRVDD

GPIO4

HPVDD F9

HP_SPKRGND C9

LINE1

A1 LINE2

LOUT1

LOUT2

H4 LRC

J6 MCLK

C1 MIC1

MIC1N

D1 MIC2

MIC2N

MICBIAS

F1 MODE_GPIO3

MONO1 B6

U202

WM8753LEB-RV

A3 ACIN

B3 ACOP

ADCDAT

A5 AGND

AVDD

J4 BCLK

CSB_GPIO5

DACDAT

DBVDD

DCVDD J7

DGND H7

G8 GP1_CLK1

GP2_CLK2

C225 1u

C228 1u

C234

4.7u

WM_DVDD

C236

4.7u

WM_DACDAT

WM_LRC

WM_MSPRXD0

MSPTXD0

MSPTCK0

MSPTFS0

WM_BCLK

WM_ADCDAT

SPK_AMP_EN

WM_HPH_R

WM_HPH_L

WM_ROUT2WM_MICBIAS

AU_SW

VT_SW

PM_SDA

PM_SCL

AU_19.2M

WM_RXP

WM_RXN

WM_MONO2

WM_MONO1

WM_MIC1N

WM_ROUT1

WM_MIC1P

WM_MIC2N

WM_LOUT2

WM_MIC2P

U202

C222

C224

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 132 -

4.15.3 Sound path for headset

Multimedia Sound path for Head_Set as below:

STN8810(msptxd0) →U202(audio codec) → C242,C244 → #4,#5 pin of CN202 headset Jack

Start

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

And insert head_Set

The sine wave appear at

C242,C244 ?

Check the U202

or change the Main b'd

Can you hear the tone?

YES

END

Headset insertion detection

in the Main LCD Display OK?

Check #8 pin of CN202

or change the Main b'd

YES

Check the CN202

or change the Main b'd

1608

CN202

C242 33u

FB503 1000

33uC244R223 68

C240 1u

VBATT

1IN 2

OUT

U205

FB245

100K R219

+5V_PWR

C241 1u

68R222

USB_D+

USB_D-

EAR_SENSE_N

WM_LOUT1

WM_MIC2N

WM_MIC2P

REMOTE_PWR_ON

WM_ROUT1

C242, C244

CN202

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 133 -

C242, C244

U202

Audio codec

CN202

Headset connector

C222, C224

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 134 -

4.15.4 Loud speaker path (voice speaker phone)

Loud speaker path as below:

MSM6275A HPH_R, HPH_L →C222,C224 →U202(audio codec) → C262,C267 → U208

(Speaker AMP) →pads of speaker →Speaker

Start

The sine wave appear at

C222,C224?

Change the Main board

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

Set phone with speaker phone mode

The sine wave appear at

C262, C267?

YES

Check the U202 or

Change the Main board

Check the U208

and R229, R233

YES

Can you hear the tone? Change the speaker

YES

END

The sine wave appear at

pads of speaker?

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 135 -

1uC224

C226 1u

C222 1u

NC1 C8

NC2 F8

NC3

NC4 G2

RXN

RXP

LINE1

A1 LINE2

MIC1N

U202

WM8753LEB-RV

A3 ACIN

B3 ACOP

DBVDD

DCVDD J7

DGND H7

C225 1u

C228 1u

WM_HPH_R

WM_HPH_L

WM_RXP

WM_RXN

C222, C224

C262

0.068u

68KR230

R232 68K

R233

10K

R229

C261

0.068u

C267

R231

100K

1_SHUTDOWN

BYPASS

GND

IN+

4IN- 9

PGND

VDD

VO+ 5

VO- 8

TPA6205A1DRBRU208

C268 NA

C266

0.22u

SPKL-

SPKL+

SPK_AMP_EN

WM_LOUT2

WM_ROUT2

C222, C224

C262, C267 R229, R233

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 136 -

4.15.5 Loud speaker path (VT, multimedia play, etc)

Loud speaker path (VT, multimedia play) as below:

STN8810(msptxd0) →U202(audio codec) → C262,C267 → U208 (Speaker AMP) →

pads of speaker →Speaker

Start

Connect the phone to network

Equipment and setup call

Setup 1KHz tone out

Set phone with speaker phone mode

The sine wave appear at

C262, C267?

Check the U202 or

Change the Main board

Check the U208

and R229, R233

YES

Can you hear the tone? Change the speaker

YES

END

The sine wave appear at

pads of speaker?

- 137 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

1u C229

1u C230

VXCLK

VXDIN

J2 VXDOUT

VXFS

MONO2

J8 PCMCLK

PGND

ROUT1 D9

ROUT2 B9

H1 SCLK

G1 SDIN

GPIO4

LOUT2

H4 LRC

F1 MODE_GPIO3

MONO1 B6

U202

WM8753LEB-RV

ADCDAT

J4 BCLK

CSB_GPIO5

DACDAT

G8 GP1_CLK1

GP2_CLK2

WM_ROUT2

WM_MONO2

WM_MONO1

WM_ROUT1

WM_LOUT2

Audio Codec

Speaker AMP

C262

0.068u

68KR230

R232 68K

R233

10K

R229

C261

0.068u

C267

R231

100K

1_SHUTDOWN

BYPASS

GND

IN+

4IN- 9

PGND

VDD

VO+ 5

VO- 8

TPA6205A1DRBRU208

C268 NA

C266

0.22u

SPKL-

SPKL+

SPK_AMP_EN

WM_LOUT2

WM_ROUT2

C262, C267 R229, R233

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 138 -

U208 (Speaker Amp)

R711

Pads of Speaker

C722

C723

U202 (audio codec)

R229, R233

C262, C267

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 139 -

4.15.6 Microphone for main MIC

Main Microphone path as below:

MIC →C245,C248 →U202(audio codec) → C229,C230 →MSM6275A →

MIC feed back gain logic →MSM internal CODEC

C245 1u

EVLC18S02015

VA200

C247

10p

2.2K

R221

C251

39p

2.2K

R227

MIC200

SUMY0009203

C252

39p

VA201

EVLC18S02015

39p

C246

1uC248

WM_MICBIAS

WM_MIC1P

WM_MIC1N

WM_DVDD

WM_AVDD

1u C229

1uC224

100K R214

C226 1u

1u C230

C222 1u

R213100K

C235

4.7u

VMID

B5 VREF

VXCLK

VXDIN

J2 VXDOUT

VXFS

R215100K

MONO2

NC1 C8

NC2 F8

NC3

NC4 G2

OUT3

OUT4 E9

J8 PCMCLK

H9 PGND

PVDD

ROUT1 D9

ROUT2 B9

RXN

RXP

H1 SCLK

G1 SDIN

SPKRVDD

GPIO4

HPVDD F9

HP_SPKRGND C9

LINE1

A1 LINE2

LOUT1

LOUT2

H4 LRC

J6 MCLK

C1 MIC1

MIC1N

D1 MIC2

MIC2N

MICBIAS

F1 MODE_GPIO3

MONO1 B6

U202

WM8753LEB-RV

A3 ACIN

B3 ACOP

ADCDAT

A5 AGND

AVDD

J4 BCLK

CSB_GPIO5

DACDAT

DBVDD

DCVDD J7

DGND H7

G8 GP1_CLK1

GP2_CLK2

C225 1u

C228 1u

C234

4.7u

WM_DVDD

C236

4.7u

WM_DACDAT

WM_LRC

WM_MSPRXD0

MSPTXD0

MSPTCK0

MSPTFS0

WM_BCLK

WM_ADCDAT

SPK_AMP_EN

WM_HPH_R

WM_HPH_L

WM_ROUT2WM_MICBIAS

AU_SW

VT_SW

PM_SDA

PM_SCL

AU_19.2M

WM_RXP

WM_RXN

WM_MONO2

WM_MONO1

WM_MIC1N

WM_ROUT1

WM_MIC1P

WM_MIC2N

WM_LOUT2

WM_MIC2P

Can you scoping some

sound signal at C245,C248?

Change the MIC

YES

make some sound or

voice to MIC

Work well? END

YES

Can you scoping some

sound signal at C229,C230?

Check the U202 or

Change the Main B'd

Start

MIC_BIAS(C102) is 2.7V? Change the Main B'd

Make a call

Place near

(CODEC VSS)

MSM pin W18

10%

SDCC_DAT1_GPIO99

F25

M25

SDCC_DAT2_GPIO100

M26

MICINN

AC19

AC20

MICINP

MIC1N

AF20

MIC1P

AE20

AF21

MIC2N

MIC2P

AF22

CCOMP

AA20

AF19

AUXIN

AE19

AUXIP

C611

NANA

C608

C610

0.1u

C607

C609

L600

100nH

C600

10p

MICINP

WM_MONO1

WM_MONO2

MICINN

R221

C245,C248

[main MIC]

[audio codec]

[MSM6275A]

C229,C230

- 140 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

MIC200 (MIC for Handset)

C229, C239

C245, C248

- 141 -

4. TROUBLE SHOOTING

4.15.7 Microphone for headset

MIC for Head_Set path as below:

Insert Headset →EAR_SENSE_N(pin8) go 0V →MSM6275A and STN8810 sense Head_Set

insertion →MIC signal → U202(audio codec) →MSM6275.

[CN202(headset connector)]

[MSM6275A]

LGE Internal Use Only

Only for training and service purposes

1608

CONNECTOR VBATT_SENSE PIN CHECK!!

C249 47n

R717

R716

U203

NCS2200SQ2T2G

GND

OUT

VCC

VIN+

VIN-

CN202

C242 33u

FB503 1000

33uC244

10pC258

47pC255

R223 68

R225 NA

C240 1u

RSB6.8CST2RVA211

EVLC14S02050VA205

EVLC14S02050

VBATT

CN203

VA208

smd_1608h_9_r

C254

2.2K

R217

680K

R226

C259

33p

0.01u

C257

C238

0.1u

C239

10p

USB_VBUS_IN

VA206 EVLC14S02050

1IN 2

OUT

NFM21PC105B1A3

U205

FB245

10u

C237

100K R219

+5V_PWR

47pC256

EVLC14S02050VA204

PSD12-LFD200

VREG_MSMP_2.7V

INSTPAR

470K

R224

C253

33u

VA203 EVLC18S02003

330K

R218

VA207 EVLC14S02050

C241 1u

AP_VDD_IO_1.8V

EVLC18S02003

VA202

0.1u

C260

68R222

ICVL0505600V150FRVA209

R216

VA210 RSB6.8CST2R

11K

R228

PSD05-LF

D201 INSTPAR

USB_D+

USB_D-

EAR_SENSE_N

HOOK_SENSE

WM_LOUT1

UART_RXD

UART_TXD

VBAT_TEMP

WM_MIC2N

WM_MIC2P

REMOTE_PWR_ON

VBATT_SENSE

WM_ROUT1

WM_AVDD

1u C229

1uC224

C226 1u

1u C230

C222 1u

VMID

B5 VREF

VXCLK

VXDIN

J2 VXDOUT

VXFS

MONO2

NC1 C8

NC2 F8

NC3

NC4 G2

OUT3

OUT4 E9

J8 PCMCLK

H9 PGND

PVDD

ROUT1 D9

ROUT2 B9

RXN

RXP

H1 SCLK

G1 SDIN

SPKRVDD

GPIO4

HPVDD F9

HP_SPKRGND C9

LINE1

A1 LINE2

LOUT1

LOUT2

H4 LRC

J6 MCLK

C1 MIC1

MIC1N

D1 MIC2

MIC2N

MICBIAS

F1 MODE_GPIO3

MONO1 B6

U202

WM8753LEB-RV

A3 ACIN

B3 ACOP

ADCDAT

A5 AGND

AVDD

J4 BCLK

CSB_GPIO5

DACDAT

DBVDD

DCVDD J7

DGND H7

G8 GP1_CLK1

GP2_CLK2

C225 1u

C228 1u

C234

4.7u

WM_DVDD

WM_HPH_R

WM_HPH_L

WM_ROUT2WM_MICBIAS

WM_RXP

WM_RXN

WM_MONO2

WM_MONO1

WM_MIC1N

WM_ROUT1

WM_MIC1P

WM_MIC2N

WM_LOUT2

WM_MIC2P

Start

EAR_SENSE_N is 0V?

END

Make a call

Change the Main b'd

MIC_BIAS is 2.7V ?

YES

Try change the head set

Can you scoping some

sound signal at C240,C241?

Change the MIC

YES

make some sound or

voice to MIC

Work well? END

YES

Can you scoping some

sound signal at C229,C230?

Check the U202 or

Change the Main B'd

YES

Place near

(CODEC VSS)

MSM pin W18

10%

SDCC_DAT1_GPIO99

F25

M25

SDCC_DAT2_GPIO100

SDCC_DAT3_GPIO101

M26

MICFBP

MICINN

AC19

AC20

MICINP

MDP_VSYNC_PRIMARY_GPIO105

AD2

AE3

MDP_VSYNC_SECONDA_GPIO104

MIC1N

AF20

MIC1P

AE20

AF21

MIC2N

MIC2P

AF22

CCOMP

AA20

AF19

AUXIN

AE19

AUXIP

C611

NANA

C608

C610

0.1u

C607

C609

L600

100nH

C600

10p

MICINP

WM_MONO1

WM_MONO2

MICINN

[audio codec]

C240,C241

C229,C230

- 142 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

#8 pin of ear connector

to check EAR_SENSE_N

C237

Capacitor to check MIC bias (2.7V)

C240

- 143 -

4. TROUBLE SHOOTING

4.16 Camera trouble

Camera control signals are generated by STN8810 and directly connected with STN8810.

KS10 has two cameras. The one is a 2 Mega Camera, the other is VGA camera.

LGE Internal Use Only

Only for training and service purposes

Check AP_VDD_CAM_2.7V,

AP_VDD_CAM_1.8V

Camera is OK?

Check the camera conn. and

reconnect the camera

Change the LDO (U301, U303)

Camera is OK

Check the CCIRCLK_CAM

Change the camera

Yes

(FL201 #2)

Change the Main board

End

Yes

End

2M START

STN8810 output signal check

(2M_RSTn_CAM, CAM_PWR_EN))

Yes

Check master clock

OSC X200 output

Yes

Change the OSC (X200)

Yes

Check the EMI/ESD filter

(FL201 #8)

Yes

Change the Filter (FL201)

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 144 -

2M_RSTn_CAM

CAM_PWR_EN

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

24MHZ OSC output

FL201

- 145 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

Hi-Z

AXK7L34227

DrivenLOW

HIGH

2M_CAMERA

C2130.1u

C21210u

17 18

G3 G4

CN200

CSC3R270000BEVRS00 X200

27MHz

GND

OUT

TRI_OPEN

VDD

R207 100K

AP_VDD_CAM_2.7V

C214

0.01u

C21010u

INOUT_A1

2INOUT_A2

INOUT_A3

4INOUT_A4

INOUT_B1

INOUT_B2 8

INOUT_B3

INOUT_B4 6

FL203 EVRC18S03Q015050R

0.1u C211

C207

AP_VDD_CAM_1.8V

HB-1M1005-601JT

FB204

FB205

HB-1M1005-601JT

I2CSCL0_CAM

I2CSDA0_CAM

2M_PWDN

I2CSCL0_CAM

I2CSDA0_CAM

I2CSCL0_SW

I2CSDA0_SW

2M_RSTn

2M_RSTn_CAM

CCIRID(4)_CAM

CCIRID(3)_CAM

CCIRID(2)_CAM

CCIRID(1)_CAM

CCIRID(0)_CAM

CCIRIVS_CAM

CCIRIHS_CAM

CCIRICLK_CAM

CCIRID(7)_CAM

CCIRID(6)_CAM

CCIRID(5)_CAM

AP_+VPWR AP_VDD_CAM_2.7V

C305

BYPEN

3GND

1IN 5

OUT

U303

MIC5219-2.7YM5

2.2u

C307C306

470p

CAM_PWR_EN

EVRC18S03Q015050R

G1 5

G2 10

1INOUT_A1

INOUT_A2

3INOUT_A3

INOUT_A4

INOUT_B1 9

INOUT_B2

INOUT_B3 7

INOUT_B4

FL201

CCIRICLK_CAM

CCIRIHS_CAM

CCIRIVS_CAM

CAMCLK_27MHZ_CAM CAMCLK_27MHZ

CCIRIHS

CCIRIVS

CCIRICLK

2M_RSTn_CAM

FL201 (#2)

24MHZ OSC output

CAM_PWR_EN

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 146 -

Check AP_VDD_CAM_2.7V,

AP_VDD_CAM_1.8V

Camera is OK?

Check the camera & 70-pin

main conn.

And reconnect these connectors

Change the LDO (U301, U303)

Camera is OK

Check the CCIRCLK

Yes

(R719)

Change the Main board

End

Yes

End

VGA START

STN8810 output signal check

(VGA_RSTn, VGA_STNADBY)

Yes

Check master clock

(CAMCLK_27MHZ : R206)

Yes

Check the EMI/ESD filter

(FL201 #1)

Change the Filter (FL201)

Yes

Change the camera

Change the slider FPCB

Check the CCIRCLK (in FPCB)

(R104 in slider FPCB))

Yes

- 147 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

FL201

VGA_RSTnVGA_STANDBY

AP_VDD_CAM_1.8V

AP_VDD_CAM_2.7V

R719 (CCIRICLK)

CAMCLK_27MHZ

R104 (CCIRICLK)

- 148 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

MAIIN-SLIDER CON-HEADER

0R728

0R727

0R726

0R725

0R724

0R723

0R722

0R721

0R720

0R719

0R718

FB224

FB235

FB232

FB229

FB236

FB227

FB233

FB225

FB221

15050R

FB223

FB234

FB231FB230

G1 G2

CN201

CCIRICLK

CCIRIHS

L0_CAM

A0_CAM

VGA_RSTn

LCD_NRESET

CAMCLK_27MH

RECEIVER+

RECEIVER-

RECEIVER--

MOT_PWR-

WLED_CTL

VGA_STANDBY

R206 0

EVRC18S03Q015050R

G1 5

G2 10

1INOUT_A1

INOUT_A2

3INOUT_A3

INOUT_A4

INOUT_B1 9

INOUT_B2

INOUT_B3 7

INOUT_B4

FL201

CCIRICLK_CAM

CCIRIHS_CAM

CCIRIVS_CAM

CAMCLK_27MHZ_CAM CAMCLK_27MHZ

CCIRIHS

CCIRIVS

CCIRICLK

CAMCLK_27MHZ

MCAM_27M

G1 G2

CN102

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

R104

I2CSCL0_CAM

I2CSDA0_CAM

VGA_RSTn

CCIRICLK_CAM

CCIRIHS_CAM

VGA_CAMERA

AXK720145G

HB-1M1005-601JT

FB101

FB100

HB-1M1005-601JT

C102

AP_VDD_CAM_2.7V

C101

0.1u

C100

0.1u

192

10 11

AP_VDD_CAM_1.8V

CN100

I2CSCL0_CAM

I2CSDA0_CAM

VGA_RSTn

CCIRIHS_CAM

CCIRIVS_CAM

CCIRID(7)_CAM

CCIRID(6)_CAM

VGA_RSTn

R719 (CCIRICLK)

VGA_STANDBY

FL201 (#1)

R104 (CCIRICLK)

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

CAMCLK_27MHZ

Schematic of VGA camera part

- 149 -

4. TROUBLE SHOOTING

4.17 Main LCD trouble

Main LCD control signals are generated by STN8810. Those signal’s path are :

STN8810 -> 70-pin main connector(CN201 in main PCB) -> 70-pin connector (CN102 in slider FPCB)

-> 40-pin connector (CN101 in slider FPCB) -> 40-pin connector (CN101 in SUB PCB) -> LCD zip

connector (CN100 in SUB PCB) -> LCD Module

LGE Internal Use Only

Only for training and service purposes

The LCD works

START

Press END key

to turn the power on

Is the circuit powered?

Follow the Power ON

trouble shooting

LCD display OK?

Check AP_VDD_LCD_2.8V, LCD_NRESET,

LCD_DATA(0) in Main BD

Yes

Disconnect and reconnect

70-pin , 40-pin B to B,

and 35-pin zip connector

Change the Main BD

End

Yes

Check the same signal

in SUB BD

No Yes

Change the slider FPCB

& re-check

Display OK?

Yes

Change the LCD module

Yes

Change the SUB BD

- 150 -

4. TROUBLE SHOOTING

Main BD

SUB BD

LGE Internal Use Only

Only for training and service purposes

AP_VDD_LCD_2.8VLCD_DATA(0)

LCD_NRESET

AP_VDD_LCD_2.8V

LCD_DATA(0)

LCD_NRESET

- 151 -

4. TROUBLE SHOOTING

LGE Internal Use Only

Only for training and service purposes

MAIIN-SLIDER CON-HEADER

0R728

0R727

0R726

0R725

0R724

0R723

0R722

0R721

0R720

0R719

0R718

FB224

FB235

FB232

FB229

AP_+VPWR FB222

FB236

FB227

FB233

FB225

FB221

3Q015050R

FB223

AP_VDD_LCD_2.8V

FB234

FB231FB230

G1 G2

CN201

CCIRID(2)

CCIRID(1)

CCIRID(0)

CCIRICLK

CCIRIHS

CSCL0_CAM

SDA0_CAM

VGA_RSTn

CCIRIVS

CCIRID(7)

CCIRID(6)

CCIRID(5)

CCIRID(4)

CCIRID(3)

LCD_NRESET

CAMCLK_27MHZ_CAM

RECEIVER+

RECEIVER-

RECEIVER--

MOT_PWR-

WLED_CTL

VGA_STANDBY

XF2B-3545-31A-P

LCD Connector

(lower contact)

C105

820p

0R115

CN100

ZD100 RSB6.8CST2R

100K

R102

R103 100K

R104 100K

1uC104

AP_VDD_LCD_2.8V

TP100

TP102

TP101

LCD_NRESET

LCD_DATA(0)

LCD_VS

DIS_CSN

DIS_WEN

DIS_RS

LED_ANODE

LED3

LED2

LED1

LCD_DATA(1)

LCD_DATA(10)

LCD_DATA(11)

LCD_DATA(12)

LCD_DATA(13)

LCD_DATA(14)

LCD_DATA(15)

LCD_DATA(2)

LCD_DATA(3)

LCD_DATA(4)

LCD_DATA(5)

LCD_DATA(6)

LCD_DATA(7)

LCD_DATA(8)

LCD_DATA(9)

LCD_DATA(0:15)

LED4

Schematic of LCD part

AP_VDD_LCD_2.8V

LCD_DATA(0)

LCD_NRESET

AP_VDD_LCD_2.8V

LGE Internal Use Only

Only for training and service purposes

4.18 Bluetooth trouble

Bluetooth control signals are generated by STN8810.

Those signal’s path are : STN8810 →AP_VDD_IO_1.8V and AP_VDD_BT_2.7V is asserted →

CLK32K is asserted →Bluetooth ON →BT_RESETN is High CLK_REQ_OUT_1 is High →

REF_CLK_IN is asserted →transmit/receive data/control through UART →transmit/receive voice data

through PCM I/F

Figure. Schematic of Bluetooth Interface

4. TROUBLE SHOOTING

- 152 -

R401

U_BP

C409 0.1u

DEA212450BT-7043C1

FL400

5BP1

4BP2 BP_DC 2

3G1

TP400

R715

AP_VDD_BT_2.7V

0.1u

C401

R404

G2 VDD_D

VDD_DSM

A7 VDD_HV_A

VDD_HV_D

VDD_IO_A

F3 VDD_IO_B

C7 VDD_N

VDD_RF

VSS_ANA1

VSS_ANA2 B6

VSS_ANA3

VSS_DIG1 E3

VSS_DIG2

VSS_RF1 A5

VSS_RF2

D2 PCM_A

PCM_B

PCM_CLK

PCM_SYNC

REF_CLK_IN

D3 RESET_N

RFN A4

RFP

TOUT_IN_QP

A6 TOUT_IP_QN

G4 UART_CTS UART_RTS F4

F5 UART_RXD UART_TXD F6

D7 VDD_CL

VDD_CLD

C5 BT_WAKEUP

E6 CLK_REQ_IN_1

G6 CLK_REQ_IN_2

CLK_REQ_OUT2

CLK_REQ_OUT_1 C4

E2 CONFIG_1

CONFIG_2

F2 CONFIG_3

GPIO_0

C1 GPIO_10

GPIO_11

B3 GPIO_16

GPIO_8

GPIO_9

HOST_WAKEUP

LP_CLK

STLC2500CU401

AF_PRG

220nC405

220nC408

AP_VDD_BT_2.7V

GND

OUT 3

1TRI_OPEN

VDD

19.2MHz

X400 CSC3M192000EEVRS00

0.1uC412

C404 0.1u

0.1uC411

C410 220n

C407 220n

R410

FEED

NC1

NC2

AP_VDD_IO_1.8V

ANT400

220nC406

BT_RESETN

UCTS0N

URXD0

PCMDATAOUT

PCMDATAIN

PCMCLK

PCMSYNC

UTXD0

URTS0N

CLK32K

X400

R404

FL400 ANT400

33u

C400C402

AP_+VPWR

R714

470p

C403

MIC5219-2.7YM5U400

BYP 43 EN

2GND

1OUT 5

AP_VDD_BT_2.7V

PON

U400

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 153 -

Bluetooth RF Test

TC-3000A (Bluetooth Tester)

1. Set phone to bluetooth test-mode:

Enter Test Mode(*#32*36907#) →Module Test Set →BT DUT →BT DUT ON

2. Connect phone to bluetooth tester

3. Set channel to 39

4. Measure output-power

5. Check TP1 : output-power > -6 dBm

LGE Internal Use Only

Only for training and service purposes

4. TROUBLE SHOOTING

- 154 -

Set the bluetooth ON

AP_VDD_BT_2.7V

is asserted?

Check LDO

(U400) Pin#5

REF_CLK_IN

is asserted?

Check Oscillator

(X400)

RF Power (R404)

< -6 dBm?

Check BT Antenna

(ANT400) soldering

Check FL400

soldering

Bluetooth is work well? Change

the main board

END

U400 X400

ANT400 FL400

R404

- 155 -

5. DOWNLOAD

5.1 Composition omposition

5.1.1 PC OS

- Windows 2000(SP4) & Windows XP(SP2)

- RAM : 256M

- USB : 1.1 or 2.0

5.1.2 D/L Tool

- TA-25G

- 3G USB DLC

- USB HUB : Support 1.1 with 2.0

4 ~7 ports USB

Using the external power (Adaptor)

5.1.3 Program

- LGDP2 program: V32

5.1.4 Solution for KS10

- AP : Nomadik application processors

- MP : Qualcomm application processors

5. DOWNLOAD

LGE Internal Use Only

Only for training and service purposes

<TA-25G> <3G USB DLC> <USB Hub>

LGE Internal Use Only

Only for training and service purposes

5. DOWNLOAD

- 156 -

5.2 LGDP2 Program install LGDP2 Program install

5.2.1 The "LGDP2_for set-up zip" file is downloaded on CSMG site.

5.2.2 The "LGDP2_for set-up zip" file is unzip as same name in PC.

5.2.3 Select "First LGDP2_set-up" folder.

5.2.4 Open "serial_number" file.

5.2.5 Double click "LGDP2_31_INCLUDE_LGDP1_Setup" file.

LGE Internal Use Only

Only for training and service purposes

5. DOWNLOAD

- 157 -

5.2.6 Click “Next” button.

5.2.7 Writing Serial number and then click “Next” button.

5.2.8 Click “Install” button.

LGE Internal Use Only

Only for training and service purposes

5.2.9 Click “Finish” button.

5. DOWNLOAD

- 158 -

LGE Internal Use Only

Only for training and service purposes

5. DOWNLOAD

- 159 -

5.3 USB Driver setup USB Driver setup

5.3.1 Setup the USB driver for MP.

5.3.1.1 Select "LG USB Modem Driver 4"1".7(WHQL)" in "LGDP2_for set-up" folder.

5.3.1.2 Double click

“LGUSBModemDriver_WHQL_Eng_Ver_4.7”

LGE Internal Use Only

Only for training and service purposes

5.3.1.3 Click “Next” button. 5.3.1.4 Click “OK” button.

5. DOWNLOAD

- 160 -

LGE Internal Use Only

Only for training and service purposes

5. DOWNLOAD

- 161 -

5.3.2 Setup the KS10 USB driver for AP.

5.3.2.1 Copy "KS10_USB_20070426" folder in "LGDP2_for set-up" folder.

5.3.2.2 And then paste this folder on "DOWNLOAD" folder in

C driver as below picture.

LGE Internal Use Only

Only for training and service purposes

5. DOWNLOAD

- 162 -

5.4 KS10 LGDP2 run file & DLL file setup

5.4.1 Setup the KS10 run file & DLL file.

5.4.1.1 Copy "LGDP2_V32" file &

"Model" folder in "LGDP2_for set-

up" folder.

5.4.1.2 And then paste these file & folder

on "DOWNLOAD" folder in C

driver.

LGE Internal Use Only

Only for training and service purposes

5. DOWNLOAD

- 163 -

5.5 Execute LGDP2 program

5.5.1 Double click “LGDP2_V32” file in "DOWNLOAD" folder.

5.5.2 Click “LOGIN” button.

- 164 -

5. DOWNLOAD

5.5.3 You choose the "UMTS" in "Division" Box

5.5.4 Click “OK” button.

LGE Internal Use Only

Only for training and service purposes

- 165 -

5. DOWNLOAD

5.5.5 Click “Operation(C)” on menu and then select “Config”.

5.5.6 Click “OK” button.

* Ignore these below message

5.5.7 Click “All” icon.

LGE Internal Use Only

Only for training and service purposes

- 166 -

5. DOWNLOAD

5.5.8 Choose the "KS10.DLL" file on "Model" folder in "Download" folder.

5.5.9 Click “Run Download Configuration” button.

5.5.10 Select AP download & Old Version Binary & MP Download icons.

LGE Internal Use Only

Only for training and service purposes

Explain Old Version Binary icon

It is control "Binary" type.

We use old type Binary in now so, you should be

check this category.

But in the future, We will release the new Binary.

So, If the new Binary is released, you don't check

"Old Version Binary" category.

- 167 -

5. DOWNLOAD

5.5.11 Insert “SW-KS10-STN8810-V10a-MAY-05-2007

-OPEN-IT-SEC-OFC” in "KS10" folder on "Model" folder after click

"..." icon on "BIN" Box right side.

5.5.12 Insert “KS10M.Dll” in "KS10_DLL" folder on "Model" folder after

click "..." icon on "DLL" Box right side.

LGE Internal Use Only

Only for training and service purposes

- 168 -

5. DOWNLOAD

5.5.13 Insert “SW-KS10-MSM6275-V10a-MAY-05-2007

-OPEN-IT-SEC-OFC.dz” in "KS10" folder on "Model" folder after

click "..." icon on "BIN" Box right side.

5.5.14 Click “OK” button.

LGE Internal Use Only

Only for training and service purposes

- 169 -

5. DOWNLOAD

5.5.15 Click “OK” button.

5.5.16 Click “START” button and then connect phone.

5.5.17 PC create New hardware driver.

LGE Internal Use Only

Only for training and service purposes

- 170 -

5. DOWNLOAD

5.5.18 Click “Next” button.

5.5.19 Select “11” icon and then click “Next” button.

5.5.20 Select “22” icon and then click “Next” button.

LGE Internal Use Only

Only for training and service purposes

- 171 -

5. DOWNLOAD

5.5.21 Select "KS10_USB_Driver_20070426" folder in "DOWNLOAD"

folder.

5.5.22 Click the "lgjoyusb" file.

5.5.23 Click “OK” button.

LGE Internal Use Only

Only for training and service purposes

- 172 -

5. DOWNLOAD

5.5.24 Click “OK” button.

5.5.25 Click “Finish” button.

5.5.26 the LGDP2 program is running automatically.

LGE Internal Use Only

Only for training and service purposes

- 173 -

5. DOWNLOAD

5.5.27 Remember a first com ports No..

5.5.28 It is displayed "Fail" message after completing AP downloading.

Don’t disconnection phone.

5.5.29 Click mouse right button on “My computer”. Then select

“Manage”.

LGE Internal Use Only

Only for training and service purposes

- 174 -

5. DOWNLOAD

5.5.30 Follow up as below step. Device Manager >>LGE CDMA USB Serial port >>

click mouse right button >>select “properties”

5.5.31 Select “Port settings” icon. Then click “Advanced” button.

LGE Internal Use Only

Only for training and service purposes

- 175 -

5. DOWNLOAD

5.5.32 You should select com port No. which first com No. plus 40 is for MP.

ex) First com port : com 4 port Select com 44 (= 4+ 40 ) port

5.5.33 Click “OK” button.

LGE Internal Use Only

Only for training and service purposes

- 176 -

5. DOWNLOAD

5.5.34 Click “OK” button.

5.5.35 Checking com port number.

LGE Internal Use Only

Only for training and service purposes

- 177 -

5. DOWNLOAD

5.5.36 Disconnect and reconnect the phone.

And then the program is running automatically.

5.5.37 Running the LGDP2 program.

❇ If you want to download the other phone, you just do from 5-17 to 5-36

category on this Guide.

LGE Internal Use Only

Only for training and service purposes

- 178 -

6. BLOCK DIAGRAM

6.1 GSM & WCDMA RF Block

6. BLOCK DIAGRAM

LGE Internal Use Only

Only for training and service purposes

Fig 2.1-1.UMTS-2100 + EGSM-900/DCS-1800/PCS-1900 RF Functional Block Diagram

- 179 -

6. BLOCK DIAGRAM

LGE Internal Use Only

Only for training and service purposes

Table 2.1-1. RF Block Component

- 180 -

6. BLOCK DIAGRAM

6.2 Interface Diagram

LGE Internal Use Only

Only for training and service purposes

KS10 Interface Diagram

- 181 -

6. BLOCK DIAGRAM

Main RF signal (black)

GSM TX : GSM Tx RF signal

GSM RX : GSM Rx RF signal

DCS TX : DCS Tx RF signal

DCS RX : DCS Rx RF signal

PCS TX : PCS Tx RF signal

PCS RX : PCS Rx RF signal

UMTS TX : UMTS Tx RF signal

UMTS RX : UMTS Rx RF signal

TX_I/Q : I/Q for Tx of RF

RX_I/Q : I/Q for Rx of RF

Control signal(red)

ANT_SEL 0,1,2 : Ant Switch Module Mode Selection

(WCDMA, GSM Tx/Rx, DCS Tx/Rx, PCS Tx/Rx)

GSM PA_CTL Signal

GSM_PA_BAND : DCS or PCS /GSM Mode Selection

GSM_PA_EN : Power Amp Gain Control Enable

GSM_PA_RAMP : Power Amp Gain Control

GSM/DCS/PCS_VCO_EN

GSM_TX_VCO_0_EN_N : GSM band Tx VCO Enable

GSM_TX_VCO_1_EN_N : DCS or PCS band Tx VCO Enable

UMTS PA_CTL Signal

TX_AGC_ADJ : WCDMA Tx Power Level Control

HDET1 : WCDMA Tx High Power Level Control

PA_ON : WCDMA Tx Power Amp Enable

W_VMODE_N : WCDMA Tx Power Amp Gain Control

TRK_LO_ADJ : TCXO(19.2M) Control

LGE Internal Use Only

Only for training and service purposes

- 182 -

6. BLOCK DIAGRAM

*Top Side

LGE Internal Use Only

Only for training and service purposes

- 183 -

6. BLOCK DIAGRAM

*Bottom Side

LGE Internal Use Only

Only for training and service purposes

- 184 -

6. BLOCK DIAGRAM

6.3 KS10 Modem & Baseband Block Diagram

LGE Internal Use Only

Only for training and service purposes

- 185 -

6. BLOCK DIAGRAM

6.4 KS10 Application Processor Block Diagram

LGE Internal Use Only

Only for training and service purposes

- 186 -

6. BLOCK DIAGRAM

6.5 KS10 Audio & BT Block Diagram

LGE Internal Use Only

Only for training and service purposes

MSM

AMP

Level

Shifter

AU_19.2M

Level

Shifter

I2CSCL0

I2CSDA0

PM_SCL

PM_SDA SCL

SDA

UART0

UART

PCM PCM

I2S

WM_BCLK

WM_LRC

WM_MSPTCK0

WM_MSPTFS0

MSPRFS0

MSPRCK0

RXP

RSN

WM_MONO1

WM_MONO2

MIC1

MIC2

MIC_BIAS

SPK_AMP_SD_N

OUT3

LOUT1

Speaker

Receiver

Head Set

MIC

LOUT2

ROUT2

ROUT1

EAR_SENSE_N

HOOK_SENSE_N

GPIO

Switch

STN8810

(CPU)

I2S

WM_DACDAT

WM_MSPRXD0MSPRXD0

GPIO

Filter

BT_19.2M

ANT

WM_8753

(Audio Codec.)

STLC2500C

(BT)

- 187 -

6. BLOCK DIAGRAM

6.6 KS10 Camera Block Diagram

LGE Internal Use Only

Only for training and service purposes

CPU

VGA Camera

module

Data[7:0]

VSYNC

HSYNC

PCLK

2M_nReset

2M_PWDN

CAM_PWR_EN

I2CSDA0

I2CSCL0

MCLK

VGA_nRESET

VGA_STANDBY

Slide

2M Camera

module

Each part (2M camera & VGA camera)

supports the Hi-Z state in power down mode.

Level

Shifter

OSC MCLK

ON/OFF

CAM power

1.2V

CAM power

2.7V

Slide

LGE Internal Use Only

Only for training and service purposes

6.7 KS10 LCD Block Diagram

6. BLOCK DIAGRAM

- 188 -

CPU

LCD module

(Hitachi 2.4íí)

Data[15:0]

nCS1

nWE

nRESET

LCD_VSYNC

WLED_EN

Slide

LCD power

2.8V

Backlight

Driver

Control

LGE Internal Use Only

Only for training and service purposes

6. BLOCK DIAGRAM

- 189 -

6.8 KS10 Power Distribution Diagram

STw4810

(PMIC)

AP_+VPWR

MIC5219-2.7

(LDO IO)

VBAT

STn8810

(CPU)

WM8753LEB

(Audio Codec.)

TPA6205A1DRBR

(Audio AMP)

Reset

Logic

Power ON/Off

Logic

ST2378

(Level Shifter)

ST2378

(Level Shifter)

STLC2500

(BT)

BH33FB1WHFV

(LDO Audio)

BH18LB1WHFY

(LDO MCAM)

MIC5219-2.7

(LDO CAM)

Key Pad

Array pull up

LM8333

(Key Coder)

SLAS4717EPMTR2G

(USB SW)

NLAS3158MNR2G

(UART SW)

MAX4717

(AU SW)

VDD_IO

2M_CAMERA

(Connector)

R1114N281D-TR-F

(LDO LCD)

Key Pad

Array pull up

(Folder)

VGA_CAM

(Connector)

LCD

(Connector)

TransFlash

(Connector)

RST

AP_VDD_IO_1.8V

AP_VDD_IO_2.7V

VUSB_3.1V

VMMC_3.1V

VCORE/

VPLL/

VFUSE

VDDIOC/D/E

VDDQ/DDR/NAND

VDDIOA/B/F

Vibrator

AU_3.3V CAM_1.8V CAM_2.7V LCD_2.8V

AAT3151IWP_T1

(LCD Backlight

Driver)

Key Pad

LED

A3212EEH-T

(Folder Sense)

Charging

Circuit

PM6650

(PMIC)

MSM6275

+VPWR

TY90009800

COGG

(Memory)

RF Block

VREG_MSMA

_2.6V

VREG_MSMC

_1.375

VREG_MSMP

_2.7V

VREG_MSME

_1.8V

USIM

(Socket)

VREG_USIM

_2.85V

VREG_TCXO

_2.85V

VREG_SYNTH

_2.85V

VREG_RFTX

_2.85V

VREG_RFR

_2.85V

Power

LGE Internal Use Only

Only for training and service purposes

6.9 KS10 Clock Distribution Diagram

6. BLOCK DIAGRAM

- 190 -

WM9712 (Audio Codec.)

Nomadik

STLC2500C (BT)

STw4810

PM6650

19.2MHz

OSC

Request_MC

SLEEP CLK

PWREN

TCXO_EN

L/S

AU_PWR_EN

L/S

2M Camera

L/S

CLKOUT0

MXTALI

27MHz

OSC

REF_CLK_IN

LP_CLK

CLK_REQ_OUT_1

SXTALI

CLK_32K_IN

CLK_32K

VGA Camera

19.2MHz

OSC

MSM6275

19.2MHz

TCXO

RF Block

32.768KHz

(X-tal)

USB 48MHz

(X-tal)

TCXO_OUT

TCXO

19.2MHz

27MHz

32.768KHz

19.2MHz

RTR6250_TCXO

RFR6250_TCXO

- 191 -

LGE Internal Use Only

Only for training and service purposes

7. CIRCUIT DIAGRAM

DRAWING

513

Sheets

Approved

2 4

Sheet/

NO.

10 12

LG Electronics Inc.

Section

2 75

NAME

LG Electronics Inc.

NO.

Sheet/

LG(42)-A-5505-10:01

6131 87

Approved

15158

LG Electronics Inc.

1610

Sheets

148

DRAWING

LG Electronics Inc.

106

Sign & Name

Date

MODEL

Checked

Designer

LG(42)-A-5505-10:01

4 6

DRAWING

2006

MAY LGE JOY 1.3

1/7

AP CPU & Memory

47K

R307

AP_VDD_IO_1.8V

0.1u

C138 C139

0.1u

C153

AP_VFUSE

TP104

0.1u

C144

120p

R108

C105

C117

0.1u

R104

0.1u

C141

10KR109

C130

0.1u

120p C106

R103 10

VDDIOF

R101

VDDQVDDIOF

VDDNAND

C152

VDD12

AP_VDD_IO_1.8V

VDDIOC

VDDIOE

0R114

0R102

C123

0.1u

VDDIOE

VDDIOC

VDDIOA

0.1u

C127

0.1u

VDDIOE

VDDNAND

C115

VCC

0.1u

C146

U102

NL17SZ08XV5T2

GND

C118

VDDIOD

0.1u

C102120p

120p C101

C122

0.1u

VDDIOA

VDDQ

VDDNAND

VDDIOE

C109120p

10KR111

VDDQ

0.1u

C114

C120

0.1u

AP_VDD_IO_1.8V

TRI_OPEN

VDD

VDDIOA

TP102

R112

100K

19.2MHz

X100

CSC3M192000EEVRS00

GND

OUT

AP_VCORE

VDDDDR

C112

0.1u

C116

0.1u

C143

VDDIOA

VDD12

0.1u

C129

4.7K

R110

0.1u

3K R107

VDDNAND1 B15

VDDNAND2

VDDNAND3 AE12

AE15

VDDNAND4

VDDOK

D19

VDDQ1 M2

VDDQ2

VDDQ3 W2

VDDQ4

VOTP

AA15

VDDIOC7 AA16

AA18

VDDIOC8

VDDIOC9 AA21

VDDIOD1 H21

VDDIOD2 K21

VDDIOD3 M21

VDDIOD4 T21

U21

VDDIOD5

VDDIOD6 N21

VDDIOE1 F14

F20

VDDIOE2

VDDIOE3 F13

VDDIOF1 F9

F10

VDDIOF2 F12

VDDIOF3

B12

VDDIOA4

VDDIOB1 U6

VDDIOB2 W6

AA9

VDDIOB3

Y21

VDDIOC1

VDDIOC10 AB20

W23

VDDIOC11 AA13

VDDIOC12 AA20

VDDIOC13

VDDIOC14 AB11

AB18

VDDIOC15

Y22

VDDIOC2

VDDIOC3 AA11

AA12

VDDIOC4

VDDIOC5 AA14

VDDIOC6

F18

VDD12_4 G21

VDD12_5 L6

VDD12_6

VDD12_7 L21

VDD12_8 P6

R21

VDD12_9

VDDA F3

VDDDDR1 G25

VDDDDR2

VDDDDR3 L2

VDDDDR4

VDDDDR5 Y2

Y25

VDDDDR6

VDDIOA1 K6

VDDIOA2

VDDIOA3

G22

USBOEN G23

USBRCV F23

USBSCL E23

E22

USBSDA

F22

USBVM

E24

USBVP

UTXD0

VDD12_1 F11

VDD12_10 T6

VDD12_11 V6

V21

VDD12_12

VDD12_13 AA8

AA17

VDD12_14

VDD12_15 AB24

F16

VDD12_2

VDD12_3

L24

SXTALI

C19

C20 SXTALO

H24 TAPSEL

D4 TCK

TDI

D5 TDO

AE7 TMPWNG0

AE8 TMPWNG1

E6 TMS

TRSTN

TSTCLK

L11

UCTS0N E7

URTS0N

URXD0 F7

URXD2 AB6

USBINTN

V24

SMA_DQ5

U24

P23 SMA_DQ6

SMA_DQ7

P22

SMA_DQ8

V22

SMA_DQ9

U23

K22 SMCS0N

J22 SMCS1N

SMFRSTN

Y24

Y23 SMFWPN

P21 SMOEN

E18 SMPIOIS16N

SMPIOWN

H23

SMPS0N

J21

W21 SMPS1N

SMWAITN

P24

SMWEN

SMAD4

N24 SMAD5

SMAD6

J23

SMAD7

L22

J24 SMAD8

SMAD9

M23

SMA_DQ0

W22

V23 SMA_DQ1

SMA_DQ10

U22

SMA_DQ11

W24

R23 SMA_DQ12

SMA_DQ13

R22

SMA_DQ14

T24

SMA_DQ15

R24

T23 SMA_DQ2

SMA_DQ3

T22

SMA_DQ4

SDRDQ6

AB17 SDRDQ7

AC13 SDRDQ8

SDRDQ9

AB12

SDRDQML

AB16 SDRDQMU

AB14

AC17 SDRDQSL

AB13 SDRDQSU

AB15 SDRFBCK

SDRRASN

AB22

AD21 SDRWRN

N23 SMAD0

SMAD1

K23

M24 SMAD10

SMAD2

L23

K24 SMAD3

M22

SDRCKN

AC14 SDRCKP

AA19 SDRCS0N

SDRCS1N

AA10

AB21 SDRDQ0

SDRDQ1

AC20

SDRDQ10

AC12

AB9 SDRDQ11

SDRDQ12

AC10

AC9 SDRDQ13

AC11 SDRDQ14

SDRDQ15

AB10

SDRDQ2

AC22

AC19 SDRDQ3

AC21 SDRDQ4

SDRDQ5

AC18

AB19

AD20

AD14 SDRAD11

AD15 SDRAD12

SDRAD13

AA22

AC23 SDRAD14

AD19 SDRAD2

SDRAD3

AD18

AD9 SDRAD4

AD17 SDRAD5

AD10 SDRAD6

AD13 SDRAD7

SDRAD8

AD16

AD11 SDRAD9

SDRCASN

AD22

SDRCKE0

AD12 SDRCKE1

AC16

AC15

D15

F24

MSPTXD2_SMPCE2N

MXTALI

C21

C22 MXTALO

AE20 NANDWP01

AE19 NANDWP0N

D20 PORN

PWLOUT E21

E20 PWREN

RCOMP C7

REMAP0_SMDIRN

F19 REMAP1_SMPREGN

E19

N22 SCANEN

SCANMOD

D23

AB23 SDRAD0

AA23 SDRAD1

SDRAD10

I2CSDA0

D12

MCCLK

C12

MCCMD

MCCMDDIR E13

MCDAT0 D14

C14

MCDAT0DIR

E14

MCDAT1

MCDAT2 C13

MCDAT3 D13

MCDAT31DIR E15

MCFBCLK E17

E16

MSPRXD0

MSPSCK0 F17

H22

MSPTCK2_SMPIORN

MSPTFS0 C15

G24

MSPTFS2_SMPCE1N

MSPTXD0

D11 HDAT14_MSPSCK1

C11

E12 HDAT15

U5 HDAT2

HDAT3

T3 HDAT4

T5 HDAT5

R3 HDAT6

HDAT7

R4 HDAT8

P4 HDAT9

N4 HPIEV

G4 HRDN_SSPCLK

E4 HRDY_RTCK

G6 HWRN_SSPFRM

I2CSCL0 F5

GPIO6

D22

GPIO76 K4

GPIO91 J3

GPIO92

HADR0

J5 HADR1_UTXD1

H4 HADR2_URXD1

HALEN_SSPRXD

J4 HBHEN

HCSN

U3 HDAT0

HDAT1

D10 HDAT10_MSPTXD1

C10 HDAT11_MSPTFS1

HDAT12

E11 HDAT13

F15

D16

GPIO21 C16

GPIO22

GPIO26 C17

GPIO28 D18

C18

GPIO29

GPIO3

GPIO34 AB8

AB7

GPIO35 AC7

GPIO36 AD7

GPIO37

GPIO38 AD6

GPIO4 D7

GPIO5

GPIO53

GPIO54 N5

GPIO58_SSPTXD

AE16

M12 GND7

B1 GND70

GND71

GND72

GND73

B11

B16 GND74

GND75

B19

GND76

B20

H25

GND77

GND78 M25

GND79 R25

GND8

M13

GND80 W25

M14 GND9

GNDA

GPIO19

AE1

AE2 GND55

GND56

AE3

AF1 GND57

AF2 GND58

AF3 GND59

GND6

M11

GND60

AD25

AD26 GND61

AE24 GND62

AE25

GND63 AE26

GND64

GND65 AF24

GND66 AF25

AF26

GND67

AE11 GND68

GND69

L15

GND40

B25

C2 GND41

C25 GND42

A1 GND43

GND44

A3 GND45

GND46

A24 GND47

GND48

A25

A26 GND49

L16 GND5

GND50

B26

C26 GND51

GND52

AD1

AD2 GND53

GND54

R12

R13 GND26

GND27

R14

R15 GND28

R16 GND29

L14 GND3

T11 GND30

GND31

T12

T13 GND32

GND33

T14

T15 GND34

GND35

T16

GND36

AA24

B2 GND37

GND38

B24 GND39

GND4

M15

M16 GND11

GND12

N11

N12 GND13

N13 GND14

N14 GND15

GND16

N15

N16 GND17

P11 GND18

GND19

P12

GND2

L13

P13 GND20

GND21

P14

P15 GND22

GND23

P16

R11 GND24

GND25

C23

DECOUPLING10

DECOUPLING11 C24

D24

DECOUPLING12

DECOUPLING13 F21

DECOUPLING2

DECOUPLING3 D3

AC3

DECOUPLING4 AD3

DECOUPLING5 AD4

DECOUPLING6

DECOUPLING7 AC24

AD23

DECOUPLING8

DECOUPLING9 AD24

DU1 L25

DU2 T25

L12 GND1

GND10

AD8

CLCD17 AC8

CLCD2 Y6

CLCD3 Y4

AA3

CLCD4

CLCD5

AB3

CLCD6

CLCD7 AA4

CLCD8 AB4

CLCD9 AC4

AA7

CLFPVS

CLKOUT0

D17

CLLE V4

CLLPHS W4

CLPCK

CLPWR V3

DECOUPLING1

CCIRIHS

CCIRIIVS

E10

CCPCKN

CCPCKP

CCPDAN E9

CCPDAP D9

CCPRSET C8

CLACDE

CLCD0 W5

CLCD1

AD5

CLCD10

AA5

CLCD11

CLCD12 AA6

AC5

CLCD13

AB5

CLCD14

AC6

CLCD15

CLCD16

U100

BATOK

D21

CCIRICLK_CCIROCLK

CCIRID0_CCIROD0 M3

CCIRID1_CCIROD1 M5

CCIRID2_CCIROD2 M4

CCIRID3_CCIROD3 L3

CCIRID4_CCIROD4 L5

CCIRID5_CCIROD5

CCIRID6_CCIROD6 K3

CCIRID7_CCIROD7 K5

C124

STN8810S12B2V1

VCC

0.1u

NL17SZ08XV5T2

U101

GND

C149

0.1u

C147

C111

0.1u

C1000.33u

0.1u

VDDDDRVDDIOD

VDDIOB

C134

0.33u C104

0.1u

C132

C145

0.1u

AP_VDD_IO_1.8V

VDDIOD

100K

R113

TP103

VDDIOD

15K R106

VDDIOD

C121

0.1u

VDDIOE

0.1u

C142

15K R105

AP_VDD_IO_1.8V

VDDA

0.1u

C125

C136

0.1u

VDDDDR

VDDIOB

AP_VDD_IO_2.7V

100K

R115

VDDA

0.1u

C128

0.1u

C137

0.1u

C133

C1081u

VDDIOF

C110

0.1u

TP100

VCC

VDDIOB

U103

NL17SZ08XV5T2

GND

C103

C135

0.33u

C154

AP_VDD_IO_1.8V

0.1u

0.33u

TP101

C107

C1510.1u

0.1u

C113

C150

0.1u

C148

0.1u

VDDIOC

C126

0.1u

C140

0.1u

VDDIOD

0.1u

C119

0.1u

AP_VPLL

C131

51K R100

AP_TDO

AP_TMS

AP_RTCK

MCAM_CLK_OUT

CPU_19.2M

PORN

CLK32K

REMOTE_PWR_ON

AU_CLK_EN

AU_19.2M

VGA_STANDBY_AP

REQUEST_MC

MSPRFS0

2M_RSTN_AP

2M_PWDN_AP

REMOTE_PWR_ON_AP

AP_TRST_N

UART_SW

HPIEV_IT_STATE_ETMTRIGIN

KEYCODER_RSTN

PWREN

CPU_19.2M

LCD_DATA(12)

LCD_DATA(11)

LCD_DATA(10)

LCD_DATA(1)

LCD_DATA(0)

DIS_WEN

CCIRIVS

CCIRIHS

CCIRID(7)

CCIRID(6)

CCIRID(5)

CCIRID(4)

CCIRID(3)

CCIRID(2)

CCIRID(1)

CCIRID(0)

CCIRICLK

DIS_CSN

DIS_RS

LCD_VS

LCD_DATA(9)

LCD_DATA(8)

LCD_DATA(7)

LCD_DATA(6)

LCD_DATA(5)

LCD_DATA(4)

LCD_DATA(3)

LCD_DATA(2)

VGA_RSTN

LCD_NRESET

LCD_DATA(15)

LCD_DATA(14)

LCD_DATA(13)

HPI_IT_APE_ETMPSTA0_XTIDAT

HPI_IT_MOD_ETMSYNCA_XTIDAT

HOOK_SENSE

BT_RESETN

I2CSDA1

I2CSCL1

PWR_BTN

KEYCODER_INT

UTXD2

USB_SW

CAM_PWR_EN

LCD_PWR_EN

AU_PWR_EN

WLED_CTL

LEVEL_SHIFT_EN

MSPRCK0

MSPTCK0

EBI2_DATA(14)

EBI2_DATA(13)

EBI2_DATA(12)

EBI2_DATA(11)

EBI2_DATA(10)

EBI2_DATA(1)

EBI2_DATA(0)

HPI_EME_APE_ETMPSTA2_XTIDAT

EBI2_ADDR(2)

EBI2_ADDR(1)

HPI_EME_MOD_ETMPSTA1_XTIDAT

MCDAT1

MCDAT0DIR

MCDAT0

MCCMDDIR

MCCMD

MCCLK

EBI2_DATA(9)

EBI2_DATA(8)

EBI2_DATA(7)

EBI2_DATA(6)

EBI2_DATA(5)

EBI2_DATA(4)

EBI2_DATA(3)

EBI2_DATA(2)

EBI2_DATA(15)

URXD0

URTS0N

UCTS0N

EAR_SENSE_N

PWREN

IT_WAKE_UP_AP

REMOTE_PWR_ON_AP

MSPTXD0

SW_RESET

MSPTFS0

SD_INT

MCDAT2DIR

MSPRXD0

MCFBCLK

MCDAT31DIR

MCDAT3

MCDAT2

VDDOK

UTXD0

USBVP

USBVM

USBSDA

USBSCL

USBRCV

USBOEN

USBINTN

URXD2

AP_TDI

AP_TCK

EBI2_WE_N

EBI2_OE_N

EBI2_DATA(0:15)

I2CSCL0

I2CSDA0

HCSN_ETMCLK_XTICLK

LCD_DATA(0:15)

- 192 -

LGE Internal Use Only

Only for training and service purposes

7. CIRCUIT DIAGRAM

VBAT

PWR

URXD

UTXD

3G2.5G

GND

UFLS

ON_SW

1608

Checked

Sign & Name

LG Electronics Inc.

Hi-Z

SPK PAD size 2 by2

CONNECTOR VBATT_SENSE PIN CHECK!!

06.02.22 spk connect to contact type

Sheet/

DRAWING

MODEL

AXK7L34227

PLACE CLOSE TO MSM

SPEAKER AMP

LG(42)-A-5505-10:01

LG Electronics Inc.

Designer

NAME

Driven

Section

TA OVP Circuit

2/7

AUDIO & 18PIN & CAMERA

Sheets

3 9

LOW

116

AXK7L70227

DRAWING

MAIIN-SLIDER CON-HEADER

HIGH

Approved

Between (VBATT & +5V_PWR) and (Mic signal)

Date

CAD for EMC Noise

2M_CAMERA

NO.

MSM6725 EXT FILTER

WM_AVDD

WM_DVDD

LGE

2006

MAY JOY 1.3

0.1u C200

C249 47n

WM_AVDD

R717

VREG_MSMP_2.7V

R716

0R728

0R727

0R726

0R725

0R724

0R723

0R722

0R721

0R720

0R719

0R718

C2130.1u

HB-1M1005-601JT

FB207

U203

NCS2200SQ2T2G

GND

OUT

VCC

VIN+

VIN-

C262

0.068u

AP_VDD_IO_2.7V

WM_AVDD

1u C229

NAC231

C227

10p

1uC224

CN202

100K

R210

C245 1u

100K R214

VREG_MSMP_2.7V

0.1u

C242 33u

C243

68KR230

C21210u

22p C265

17 18

G3 G4

TP205

CN200

FB239

WM_DVDD

R232 68K

AP_VDD_CAM_2.7V

FB224

CSC3R270000BEVRS00 X200

27MHz

GND

OUT

TRI_OPEN

VDD

0.015u

WM_DVDD

FB235

C206

FB232

0.015u C202

C2050.1u

IN1

IN2

NC1

NC2

NO1

NO2

VCC

AP_VDD_IO_2.7V

SLAS4717EPMTR2G

U206

COM1

COM2

GND

FB229

FB503 1000

AP_+VPWR

0.1u

R206 0

C201

C2090.1u

R203

470K

U207

NUS3065MUTAG

CNTRL

DRAIN 4

9DRAIN_THERMAL

6GATE

GND

OUT

SRC

VCC

RTS

VBAT

EVLC18S02015 VA212

INOUT_B4

UT200

CTS

DSR

GND

NC1

NC2

NC3

NC4

ON_SW

G1 10

INOUT_A1

INOUT_A2 2

INOUT_A3

INOUT_A4 4

INOUT_B1

8INOUT_B2

INOUT_B3

HB-1M1005-601JT

EVRC14S03Q030100R FL204

TP204

FB206

33uC244

R233

10K

10pC258

R207 100K

VCC

VA213

EVLC18S02015

U204

NLAS4157DFT2G

GND

47pC255

R223 68

C223

FB222

FB236

R225 NA

C240 1u

C226 1u

RSB6.8CST2R

FB237

VA211

EVLC14S02050VA205

10K

R229

C2040.1u

AP_VDD_CAM_2.7V

EVLC14S02050

VBATT

CN203

EVLC18S02015

VA208

VA200

C230

C247

10p

2.2K

R221

C251

EVRC18S03Q015050R

G1 5

G2 10

1INOUT_A1

INOUT_A2

3INOUT_A3

INOUT_A4

INOUT_B1 9

INOUT_B2

INOUT_B3 7

INOUT_B4

39p

FL201

C233 39p

2.2K

R227

smd_1608h_9_r

MIC200

SUMY0009203

C254

C26422p

2.2K

C214

R217

0.01u

680K

R226

C21010u

G1 10

INOUT_A1 2

INOUT_A2 3

INOUT_A3

INOUT_A4 4

INOUT_B1

8INOUT_B2

INOUT_B3

6INOUT_B4

FB227

EVRC14S03Q030100R FL208

C259

33p

0.01u

C257

0.1u

C250

C203

10u

C238

0.1u

G2 10

1INOUT_A1

INOUT_A2

3INOUT_A3

INOUT_A4

INOUT_B1 9

INOUT_B2

INOUT_B3 7

INOUT_B4

FL202 EVRC18S03Q015050R

FB233

R202

10K

INOUT_A1

2INOUT_A2

INOUT_A3

4INOUT_A4

INOUT_B1

INOUT_B2 8

INOUT_B3

INOUT_B4 6

FB242

FL203 EVRC18S03Q015050R

FB225

C239

10p

FB243

C252

FB221

C222 1u

39p

AP_VDD_CAM_1.8V

R213100K

FB244

USB_VBUS_IN

C261

VA206

0.1u C221

EVLC14S02050

R209

+VPWR

1IN 2

OUT

NFM21PC105B1A3

U205

C232 39p

FB245

10u

OUT200

AP_VDD_CAM_2.7V

C237

0.068u

C267

0.1u C211

C208

AP_+VPWR

0.1u

INOUT_A3

4INOUT_A4

INOUT_B1

INOUT_B2 8

INOUT_B3

INOUT_B4 6

R208

FL206 EVRC18S03Q015050R

INOUT_A1

2INOUT_A2

100K R219

FB241

+5V_PWR

47pC256

EVLC14S02050VA204

PSD12-LFD200

VREG_MSMP_2.7V

INSTPAR

R204

10K

470K

G1 5

G2 10

INOUT_A1 1

INOUT_A2

INOUT_A3 3

INOUT_A4

9INOUT_B1

INOUT_B2

7INOUT_B3

INOUT_B4

R224

FL205EVRC14S03Q030100R

R212

C253

33u

10u C218

VA203 EVLC18S02003

VA201

EVLC18S02015

330K

R218

C207

FB223

R231

100K

2.2u

C263

39p

VA207

C246

R201

EVLC14S02050

AP_VDD_LCD_2.8V

C241 1u

COM1

COM2

GND

IN1

IN2

NC1

NC2

NO1

NO2

101

VCC

AP_VDD_IO_1.8V

SLAS4717EPMTR2G

U200

1_SHUTDOWN

0.1u C220

BYPASS

GND

IN+

4IN- 9

PGND

VDD

VO+ 5

VO- 8

C235

TPA6205A1DRBRU208

INOUT_A1

INOUT_A2 2

INOUT_A3

INOUT_A4 4

INOUT_B1

8INOUT_B2

INOUT_B3

6INOUT_B4

4.7u

EVRC14S03Q030100R FL207

G1 10

AP_VDD_IO_1.8V

R211

EVLC18S02003

VA202

0.1u

C260

AP_AU_3.3V

NOV+

U201DG2011DX-T1-E3

COM 5

GND

1IN

68R222

C268

WM_DVDD

R200

180K

VMID

B5 VREF

VXCLK

VXDIN

J2 VXDOUT

VXFS

R215100K

MONO2

NC1 C8

NC2 F8

NC3

NC4 G2

OUT3

OUT4 E9

J8 PCMCLK

H9 PGND

PVDD

ROUT1 D9

ROUT2 B9

RXN

RXP

H1 SCLK

G1 SDIN

SPKRVDD

GPIO4

HPVDD F9

HP_SPKRGND C9

LINE1

A1 LINE2

LOUT1

LOUT2

H4 LRC

J6 MCLK

C1 MIC1

MIC1N

D1 MIC2

MIC2N

MICBIAS

F1 MODE_GPIO3

MONO1 B6

U202

WM8753LEB-RV

A3 ACIN

B3 ACOP

ADCDAT

A5 AGND

AVDD

J4 BCLK

CSB_GPIO5

DACDAT

DBVDD

DCVDD J7

DGND H7

G8 GP1_CLK1

GP2_CLK2

G2 10

1INOUT_A1

INOUT_A2

3INOUT_A3

INOUT_A4

INOUT_B1 9

INOUT_B2

INOUT_B3 7

INOUT_B4

FL200 EVRC18S03Q015050R

G1 5

AP_VDD_CAM_1.8V

OUT201

C215

FB234

10u

FB231

ICVL0505600V150FR

FB230

0.1u

VA209

C217

HB-1M1005-601JT

FB204

R216

VA210 RSB6.8CST2R

G1 G2

G3 G4

35 36

CN201

11K

R228

R205

180K

C225

PSD05-LF

D201

C228

INSTPAR

FB205

HB-1M1005-601JT

C234

4.7u

C219

FB240

10u

FB238

0.1u C216

TP202

TP203

1uC248

WM_DVDD

C266

0.22u

CCIRID(2)

CCIRID(1)

CCIRID(0)

C236

4.7u

USB_D+

USB_D-

CCIRICLK

CCIRID(0)_CAM

CCIRID(1)_CAM

CCIRID(3)_CAM

CCIRID(2)_CAM

CCIRIHS

I2CSCL0_CAM

I2CSDA0_CAM

VGA_RSTn

CCIRIVS

CCIRID(7)

CCIRID(6)

CCIRID(5)

CCIRID(4)

CCIRID(3)

MSM_UART_RXD_IN

MSM_UART_RXD

SPKL-

SPKL+

SPK_AMP_EN

EAR_SENSE_N

WM_DACDAT

WM_LRC

WM_MSPRXD0

MSPTXD0

MSPTCK0

I2CSDA0_SW

I2CSCL0_CAM

I2CSDA0_CAM

CCIRICLK_CAM

CCIRID(5)_CAM

CCIRID(4)_CAM

2M_PWDN

DIS_CSN

MSM_UART_RXD_IN

REMOTE_PWR_ON

LCD_NRESET

DIS_WEN

DIS_RS

MSM_UART_TXD

HOOK_SENSE

I2CSCL0_CAM

I2CSDA0_CAM

I2CSCL0_SW

I2CSDA0_SW

MSPTFS0

WM_BCLK

WM_ADCDAT

WM_LOUT2

WM_ROUT2

SPK_AMP_EN

CAMCLK_27MHZ_CAM

RECEIVER+

RECEIVER-

RECEIVER--

2M_RSTn

2M_RSTn_CAM

LCD_VS

LCD_DATA(3)

LCD_DATA(5)

LCD_DATA(7)

LCD_DATA(9)

LCD_DATA(11)

LCD_DATA(13)

LCD_DATA(15)

LCD_DATA(14)

LCD_DATA(12)

LCD_DATA(10)

LCD_DATA(8)

LCD_DATA(0)

LCD_DATA(2)

LCD_DATA(4)

LCD_DATA(6)

WM_HPH_R

WM_HPH_L

MOT_PWR-

WLED_CTL

VGA_STANDBY

KPD_DRV_N

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_COL(4)

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

LCD_DATA(1)

CCIRID(3)

CCIRID(2)

CCIRID(1)

CCIRID(0)

CCIRID(7)

CCIRID(6)

CCIRID(5)

CCIRID(4)

CCIRID(6)_CAM

CCIRID(7)_CAM

CCIRIHS_CAM

CCIRIVS_CAM

CAMCLK_27MHZ_CAM

VT_SW

MSPRXD0

WM_DACDAT

WM_MSPRXD0

MSPRFS0

MSPTCK0

WM_BCLK

AU_SW

MSPRCK0

RECEIVER--

CAMCLK_27MHZ

CCIRIHS

CCIRIVS

CCIRICLK

WM_LOUT1

UART_RXD

UART_TXD

VBAT_TEMP

SPKL-

SPKL+

WM_LRC

MSPTFS0

WM_MIC2N

WM_MICBIAS

WM_MIC2P

WM_MIC1P

REMOTE_PWR_ON

WM_MIC1N

VBATT_SENSE

WM_ROUT1

VBATT

WM_ROUT2

KEY_ON_SW_N

WM_MICBIAS

MSM_UART_TXD

MSM_UART_RXD_IN

AU_SW

VT_SW

PM_SDA

PM_SCL

AU_19.2M

WM_RXP

WM_RXN

RECEIVER-

WM_MONO2

WM_MONO1

WM_MIC1N

WM_ROUT1

WM_MIC1P

WM_LOUT1WM_MIC2N

USB_D+

WM_LOUT2

USB_D-

WM_MIC2P

USB_VBUS

CAMCLK_27MHZ

RECEIVER+

CCIRID(4)_CAM

CCIRID(3)_CAM

I2CSCL0_SW

CCIRID(2)_CAM

CAM_PWR_EN

CCIRID(1)_CAM

CCIRID(0)_CAM

MICOUTP

MICINN

CCIRIVS_CAM

MICFBP

CCIRIHS_CAM

MCAM_27M

I2CSDA0

I2CSCL0

CCIRICLK_CAM

MICOUTN

MICINP

CCIRID(7)_CAM

MICFBN

CCIRID(6)_CAM

CCIRID(5)_CAM

- 193 -

LGE Internal Use Only

Only for training and service purposes

7. CIRCUIT DIAGRAM

Sign & Name

LG Electronics Inc.

DRAWING

Sheets

114

MODEL

NAME

MODEL

146

Sign & Name

LG Electronics Inc.

510

Approved

Designer

Checked

DRAWING

Approved

Sheets

NO.

124

Sheet/

Date

3 5 16

Designer

USIM Connector

3/7

LGE

MAY

2006 LGE

AP POWER & T-Flash CON

JOY 1.3

DRAWING

Sheet/

Section

NAME

LG Electronics Inc.

Checked

NO.

Date

LG Electronics Inc.

Section

3 7

R300

C323

AP_VDD_IO_1.8V

AP_VDD_IO_2.7V

AP_+VPWR

C314

22u

C339

VMMC_3.1V

USB_VBUS

R310 51K

D301

PLR0504F

3GND

NC 4

1VDD 5

VOUT

AP_VDD_LCD_2.8V

U306 R1114N281D-TR-F

C3370.1u

51K

R309

EVLC18S02015

VA302

GND

VCC

VMINUS_VCORE2

VMINUS_VIO_VMEM1 A2

VMINUS_VIO_VMEM2

VMMC K5

VPLL A8

VREF_18

VUSB F10

NL17SZ32XV5T2U311

VBAT_VIO_VMEM2

VBAT_VPLL_FUSE C7

VBUS G10

VCORE A10

VDDOK

VFUSE

VIO_VMEM

VLX_VCORE1 D8

C10

VLX_VCORE2

VLX_VIO_VMEM1

VLX_VIO_VMEM2 A3

VMINUS_ANA B5

C3 VMINUS_DIG

VMINUS_USB J9

VMINUS_VCORE1 C9

B10

TCXO_EN

H8 USBINTN

USBOEN

K7 USBRCV

G9 USBSCL

USBSDA

J8 USBVM

J7 USBVP

VAUX

VBAT_ANA C6

VBAT_DIG

VBAT_MMC J4

VBAT_USB

VBAT_VAUX B6

VBAT_VCORE1

VBAT_VCORE2 D10

VBAT_VIO_VMEM1

MCDATA31DIR

MCFBCLK

B1 NC1

NC2

B8 NC3

NC4

NC5

NC6

NC7

K10

C8 PON

J3 PORN

PWREN

REQUEST_MC

J6 SCL

SDA

SW_RESET

GPO1 K6

GPO2

IT_WAKE_UP

LATCHCLK F3

D2 MASTER_CLK

G2 MCCLK

H1 MCCMD

MCCMDDIR

K2 MCDAT0DIR

K9 MCDAT2DIR

MCDATA0

H3 MCDATA1

J1 MCDATA2

MCDATA3

CLK32K

CLK32K_IN

CLKOUT G1

CMDOUT

J10

H10

DATAOUT0

DATAOUT1 E2

DATAOUT2

DATAOUT3 F1

E10

DP E9

GND1

GND2

U310

STW4810AHDT_LF

C802

C34012p

AP_+VPWR

0.1u

R303 47K

C322

TP302

22R305

VA301

EVLC18S02015

C320

33u

C328

AP_VDD_CAM_2.7V

C312

AP_VDD_IO_2.7V

4.7u

C3380.1u

U304

ST1G3234BJR

A1 A1C1 B1

GND

B2 VCCA A3

VCCB

C310

4.7u

C321

AP_VDD_CAM_1.8V

+VPWR

R308 0

smd_1608h_5_r

2.2u

R311 51K

AP_VCORE

TP304

TP303

TP301

VUSB_3.1V

AP_+VPWR

0.1u C300

C305

CLK

GND

I_O 6

RST

1VCC 5

VPP

J300

C303

C325

AP_VDD_IO_1.8V

470p

TP305

C335

C317

0.1u

56nH

L302

GND

IN1

IN2

NC1

NC2

NO1

NO2

VCC

NLAS5223BMNR2G

U300

COM1

COM2

U312

GND

NL17SZ08XV5T2

C3260.1u

R306 22

51K

R313

EVLC18S02015

VA300

C302

0.1u

AP_VDD_IO_1.8V

C301

PLR0504F

D300

2.2u

C304

1uC319

MIC5219-2.7YM5

U302

BYP 43 EN

2GND

1OUT 5

AP_AU_3.3V

L301

4.7uH

AP_+VPWR

VREG_USIM_2.85V

TP300

R729 100K

2.2u

C309

C329

AP_VPLL

2.2u

U307 BH33FB1WHFV

BGND 6

GND

1STBY

VIN

VOUT

C332

AP_+VPWR

C3270.47u

AP_VFUSE

AP_+VPWR

C311

22u

R314 51K

U301 BH18LB1WHFV

BGND 6

GND

1STBY

VIN

VOUT

BYPEN

3GND

1IN 5

OUT

AP_VDD_IO_2.7V

AP_VDD_IO_1.8V

U303

MIC5219-2.7YM5

C343

0.1uC318

4.7u

C331

12p

U308

ST1G3234BJR

A1 A1C1 B1

GND

B2 VCCA A3

VCCB

C341

C308

4.7uH

L300

C334

C336

AP_VDD_IO_1.8V

R304

2.2u

R312

C307

C306

C324

470p

C313

AP_+VPWR

A1B1

B2 GND

VCCA

VCCB C3

VREG_MSMP_2.7V

4.7u

4.7K

ST1G3234BJR

U313

SWASWB

R315

GND

EVL5M02200

VA303

GCC110-8S-R-E1000

S300

VMMC_3.1V

0.1u

C330

C342

SD_INT

PON

IT_WAKE_UP_AP

IT_WAKE_UP

CLK32K

MSM_RESIN_N

SW_RESET

USIM_P_DATA

LCD_PWR_EN

SD_DAT(1)

SD_DAT(0)

SD_CLK

SD_CMD

SD_DAT(3)

SD_DAT(2)

IT_WAKE_UP

MCAM_27MMCAM_CLK_OUT

USIM_P_RST_N

USIM_P_CLK

USBINTN

SLEEP_CLK

PON

REQUEST_MC

AU_CLK_EN

AU_PWR_EN

VDDOK

SD_CMD

SD_DAT(2)

SD_CLK

PORN

SD_DAT(3)

SD_DAT(1)

MCDAT2DIR

AU_PWR_EN

AP_USB_D-

AP_USB_D+

MCDAT31DIR

MCDAT1

MCDAT3

MCDAT2

PWREN

PM_SDA

CAM_PWR_EN

USBSCL

USBSDA

MCCLK

MCCMDDIR

MCCMD

MCFBCLK

MCDAT0DIR

MCDAT0

PM_SCL

SD_DAT(0)

USBVP

USBVM

USBRCV

USBOEN

- 194 -

LGE Internal Use Only

Only for training and service purposes

7. CIRCUIT DIAGRAM

NO.

NAME

Approved

MODEL

JTAG-JIG-FPCB-CON

LG Electronics Inc.

Sheet/

NO.

UART SWITCH

NAME

Checked

Section

Checked

11 12

Designer

Date

LG Electronics Inc.

Designer

DRAWING

Sheets

LG(42)-A-5505-10:01

DRAWING

LG Electronics Inc.

810

Section

LG Electronics Inc.

USB SWITCH

DRAWING

Date

LG(42)-A-5505-10:01

Approved

FOLDER_SENSE

Sheet/

Sign & Name

Sheets

MODEL

742

Sign & Name

4 93

R401

2006 LGE JOY 1.3

BT & KEYCODER

LGE

MAY

USB SW & LEVEL SHIFTER

4/7

SW400

100ohmR411

AP_VDD_IO_2.7V

SSC-TWH104-HLS

LD407

33u

C400

U_BP

C409 0.1u

DEA212450BT-7043C1

FL400

5BP1

4BP2 BP_DC 2

3G1

R421 1K

U406

SLAS4717EPMTR2G

COM1

COM2

GND

IN1

IN2

NC1

NC2

NO1

NO2

VCC

TP407

SSC-TWH104-HLS

TP400

LD406

C402

SW411

VCC1 9

VCC2

TP421

NLAS3158MNR2G

U403

0B0

0B1 11

51B0 8

1B1

4A1

3GND1

6GND2

10 11

192

CN402

R715

0.1u

SW407

AP_VDD_IO_2.7V

C414

VA403 EVLC14S02050

D402 RSB6.8CST2R

C416

0.1u

C418

VA405 EVLC14S02050

C421

0.1u

AP_VDD_BT_2.7V

C417

0.1u

RSB6.8CST2RD405

C420

0.1u

C401

SSC-TWH104-HLS

R415

3.3K

EVLC14S02050VA404

LD402

R404

CN401

EVL14K02200

VA400

SW408

R409 100ohm

AP_+VPWR

R714

G2 VDD_D

VDD_DSM

A7 VDD_HV_A

VDD_HV_D

VDD_IO_A

F3 VDD_IO_B

C7 VDD_N

VDD_RF

VSS_ANA1

VSS_ANA2 B6

VSS_ANA3

VSS_DIG1 E3

VSS_DIG2

VSS_RF1 A5

VSS_RF2

D2 PCM_A

PCM_B

PCM_CLK

PCM_SYNC

REF_CLK_IN

D3 RESET_N

RFN A4

RFP

TOUT_IN_QP

A6 TOUT_IP_QN

G4 UART_CTS UART_RTS F4

F5 UART_RXD UART_TXD F6

D7 VDD_CL

VDD_CLD

C5 BT_WAKEUP

E6 CLK_REQ_IN_1

G6 CLK_REQ_IN_2

CLK_REQ_OUT2

CLK_REQ_OUT_1 C4

E2 CONFIG_1

CONFIG_2

F2 CONFIG_3

GPIO_0

C1 GPIO_10

GPIO_11

B3 GPIO_16

GPIO_8

GPIO_9

HOST_WAKEUP

LP_CLK

AP_VDD_IO_1.8V

STLC2500CU401

AF_PRG

100ohmR412

VA401 EVLC14S02050

U402 A3212EEH-T

3GND1

GND2 4

2NC1 5

NC2

1OUTPUT

PGND

VDD

AP_+VPWR

220n

EUSY0200301

TP406

C405

220nC408

AP_VDD_BT_2.7V

EVLC14S02050VA406

0.1u

TP420

C422

GND

OUT

TRI_OPEN

VDD

19.2MHz

X400 CSC3M192000EEVRS00

C419

SW401

LD400

0.1u

SSC-TWH104-HLS

100ohmR406

C412

3.3K

R414

D404

EVLC14S02050VA402

RSB6.8CST2R

SW409

470p

C403

C404

VUSB_3.1V

0.1u

R413

100K

SW410

0.1uC411

VREG_MSMP_2.7V

RSB6.8CST2RD401

C410 220n

C407 220n

R400

R408 100ohm

SSC-TWH104-HLS

SW402

LD401

VA407 EVLC14S02050

D400 RSB6.8CST2R

Wake_INP2 E7

Wake_INP3

Wake_INP4

Wake_INP5 A7

Wake_INP6

B5 Wake_INP7

_RESET

NC1 F5

NC2

NC3 F6

NC4

NC5

NC6 C1

NC7

NC8 B7

F1 PWM

SCL_AB E6

SDA_AB

VCC1

VCC2

WD_Out

Wake_INP0 D7

Wake_INP1Gen_IO_0

D1 Gen_IO_1

Gen_IO_2

Gen_IO_3

A1 Gen_In0

Gen_In1

Int_Rx G2

Int_Tx F2

K_Out0

K_Out1 F4

K_Out2

K_Out3 G5

K_Out4

B4 K_Out5

K_Out6

A3 K_Out7

LM8333GGR8_NOPB

U404

B1 CLK_In

GND1

C4 GND2

C5 GND3

GND4

D4 GND5

GND6

GND7

E4 GND8

GND9

SW406

SSC-TWH104-HLS

LD403

C413

R403 100ohm

R410

RSB6.8CST2RD403

SSC-TWH104-HLS

LD405

IOVCC7

IOVCC8 A4

IOVL1

D1 IOVL2

IOVL3

C1 IOVL4

C2 IOVL5

IOVL6

IOVL7

A1 IOVL8

VCC

E1 VL

TP419

ST2378EBJRU407

GND

IOVCC1 E3

IOVCC2

IOVCC3

IOVCC4 C4

IOVCC5

IOVCC6 B4

100ohmR405

R450

AP_VDD_IO_2.7V

AP_VDD_IO_1.8V

R402 100ohm

AP_VDD_IO_2.7V

C415

0.1u

SW404

RA400 100K

FEED

NC1

NC2

AP_VDD_IO_1.8V

MIC5219-2.7YM5U400

BYP 43 EN

2GND

1OUT 5

ANT400

SW405

AP_VDD_IO_2.7V

ZD1

RSB6.8CST2R

AP_VDD_BT_2.7V

R416

100K

R417

100K

220nC406

AP_VDD_IO_2.7V

R451

CN400

IOVCC8

E2 IOVL1

IOVL2

D2 IOVL3

IOVL4

IOVL5

B1 IOVL6

B2 IOVL7

IOVL8

OE A2

VCC E4

U405 ST2378EBJR

A3 GND

IOVCC1

IOVCC2

IOVCC3 D3

IOVCC4

IOVCC5 C3

IOVCC6

IOVCC7

LD404

SSC-TWH104-HLS

R418

100K

SW403

R420 1K

68KR419

KEY_COL(3)

KEY_ROW(2)

URXD2

MSM_UART_RXD

UART_SW

MSM_UART_TXD

UTXD2

FOLDER_DETECT

AP_VDD_IO_2.7V

FOLDER_DETECT

BT_RESETN

MSM_TDI

MSM_TRST_N

MSM_RESIN_N

MSM_TCK

MSM_TMS

MSM_RTCK

MSM_TDO

JTAG_PS_HOLD

AP_TRST_N

AP_TDI

AP_TMS

AP_TCK

AP_TDO

PON

AP_RTCK

KEY_ROW(0)

KEY_ON_SW_N

KEY_COL(1)

KEY_COL(2)

KEY_ROW(0)

UCTS0N

PCMDATAOUT

PCMSYNC

PM_SDA

2M_PWDN_AP

I2CSCL1

I2CSDA1

LEVEL_SHIFT_EN

VGA_STANDBY_AP VGA_STANDBY

KEY_COL(5)

KEY_COL(6)

KEY_COL(7)

KEY_COL(4:7)

KPD_DRV_N

KEY_ROW(1)

KEY_ROW(2)

KEY_ROW(3)

KEY_COL(0)

USB_SW

KEY_ROW(1)

KEY_COL(3)

PM_SCL

2M_RSTN

I2CSDA0

I2CSCL0

2M_PWDN

2M_RSTN_AP

LEVEL_SHIFT_EN

URXD0

PCMDATAOUT

PCMDATAIN

PCMCLK

PCMSYNC

UTXD0

URTS0N

KEYCODER_RSTN

MSM_USB_D+

MSM_USB_D-

AP_USB_D+

AP_USB_D-

USB_D-

USB_D+

PCMCLK

WM_ADCDAT

WM_BCLK

UART_RXD

KEYCODER_INT

KEY_ROW(0:3)

KEY_ROW(2)

KEY_ROW(3)

KEY_ROW(0)

KEY_ROW(1)

KEY_COL(3)

KEY_COL(2)

KEY_COL(3:0)

KEY_COL(1)KEY_COL(4)

KEY_COL(0)

PCMDATAIN

UART_TXD

WM_DACDAT

WM_LRC

CLK32K

- 195 -

LGE Internal Use Only

Only for training and service purposes

7. CIRCUIT DIAGRAM

11 14

NO OSCILLATION

LOW

TCXO

942

(1%)

HIGH

C C

(1%)

LOW

(1%)

DCS RX LOW

3146

LG Electronics Inc.

DRAWING

D D

MODEL

(1%)

IN_C

LOW

HIGH

LOW

DCS1800/PCS1900

IN_B

Sheets

LG Electronics Inc.

LOW

Designer

Section

Sheets

LG Electronics Inc.

LOW

IN_A

LOW

Thermistor Circuit

GSM 900 RX

WCDMA

PCS RX

DCS/PCS TX

GSM/EDGE

1 5

(1%)

ANTENNA SWITCH MODULE LOGIC

LG(42)-A-5505-10:01

HIGH

(1%)

Sheet/

(change to 4.53k)

LG Electronics Inc.

(1%)

TX VCO CONTROL LOGIC

GSM850/900 HIGH

(1%)

LG(42)-A-5505-10:01

LOW

HIGH

UMTS 2100

Date

3 94

HIGH

LOW

NO.

Approved NAME

Sign & Name

Approved

HIGH

LOW

165

Sheet/

SW1

NAME

15151371

LOW

NO.

SW2

Checked

DRAWING

R515 1K

LGE

2006

MAY JOY 1.3

5/7

GSM900 TX

DRAWING

LOWLOW

HIGH

VREG_RFR_2.85V

C537

120p

R509 3.3K

C514

1000p

C564

0.01u

15p

C556 15p

4.7u

C557

C593

C531

33p

R517 100ohm

9.1nH

L519

COMMRFIN

VOPS VRMS

ADL5500 U504

L510

3.3nH

C511

47p

0.068u

330p

C565

VBATT

C535

C594

0.1u

100p

C592

C570

0.01u

R502

4.7K

C534

VREG_RFTX_2.85V

C567

0.1uF

1000p

3.3nH

L500

L526

3.9nH

C558

0.01u

C528

L516

10nH

L520

C504

1000p

C561

22p

ECHU1C392JX5

C538

3.9n

12p

C581

47nH

L518

R534

C502

0.1u

FB501

C579

R523

FB502

270

56p

L521

47nH

ANT500

C506

33p

C549

R501

4.3K

C505

47p

100ohm

R525

2.2KR506

C569

FB500

15p

R535

100p

C547

C512

R532

11.3K

R524

0.1uF

C532

C555

33p

680p

C587

VTUNE_REF 8

R533

39 VDDA11

VDDA12

VDDA13

50 VDDA14

VDDA15

VDDA16

56 VDDA17

VDDA2

VDDA3

VDDA4 10

VDDA5

VDDA6

VDDA7 26

VDDA8 27

31 VDDA9

43 VDD_M

SBDT

46 SBST

TCXO 6

TX_IN

TX_IP

40 TX_MOD_CP

TX_QN 17

TX_QP

TX_VCO_FB

53 UMTS1900_OUT

51 UMTS2100_OUT

UMTS800_OUT

VCONTROL

VCO_TUNE 9

VDDA1 4

VDDA10

34 GSM1800_INN

GSM1800_INP

GSM1900_INN

GSM1900_INP 25

GSM850_INN 21

GSM850_INP 22

38 GSM900_INN

GSM900_INP

47 RF_ON_TX_ON

RX_IN

RX_IP 13

RX_QN 12

RX_QP 11

RX_VCO_IN

32 R_BIAS

SBCK

U500

RTR6250D

CP1

CP2

CP_HOLD1 1

CP_HOLD2

DAC_REF 20

FAQ1

FAQ2

GND_SLUG

C529

L514 7.5nH

VREG_RFTX_2.85V

C563 1000p

2.2uH

L503

L517

9.1nH

10p

C544

VREG_MSMP_2.7V

C595

GNDOUT

VCC

4VCONT 1

100p

19.2MHz

X500

C599

100p

C536

68p

1000p

C527

R505 0

C580

VREG_MSMP_2.7V

C530

33p

C578

8.2p

VREG_SYNTH_2.85V

3.6nH

L505

C515

33p

4700p

C550 C552

100p

C520

0.1u

C590

R521

100pC559

220

R500

68K

R527

100p

C582

ANT501

47p

C510

5.1nH

L513

VREG_RFTX_2.85V

6.2K

R512

L527

1.2p

R519 100ohm

L522

18nH

2.2uH

L509

UMC4N

Q500

C554

33p

C584

33p

0R508

C585

100p

R531

C524

0.1uF

C523

R507 100

100p

L502

C583

0.1u

GND1 2

GND2 4

GND3 6

GND4

GND5

GND6

13 GND7

GND8

5OUT_DCSPCS

1OUT_GSM 9

SW1 11

SW2

MQW5V0C869M U502

UMTS_TX_RX

VC1

VC2

VC3

VDD

470K

R528

ANT

DCS_PCS_TX

DCS_RX1

DCS_RX2

EGSM_RX1

EGSM_RX2

EGSM_TX

GND1

GND2

GND3

GND4

GND5

GND6

PCS_RX1

PCS_RX2

6.8n

FL500ESHS-L090UB

C526

ECHU1C682JX5

100p

C574

C508 33p

INOUT

VREG_RFTX_2.85V

2.2uH

L506

EFCH1950TDC1

U503

G3 1

390p

C542

L532

100nH

C500

L533

2.7nH

56pC501

100p

C800

0.1uF

C503

+VPWR

C551

47p

VREG_RFR_2.85V

C566

0.1uF

C568

22u

R513

L507

5.1nH

C553

tcc_1608h_9_r

4.7u

L515

47nH

U506ACMD-7601

ANT

RX TX

1.8nH

VREG_TCXO_2.85V

C560

L530

2.2nH

C517

0.1uF

C548

4.7u

32 VDDA5

VDDA6

36 VDDA7

VDDA8 45

VDDM

VDDRF1 3

VDDRF2

19 VDDRF3

L529

33nH

PMIXM

PMIXP 11

RX_IM

20 RX_IP

23 RX_QM

RX_QP

R_BIAS

SBCK 42

SBDT 43

SBST

33 TCXO

25 UMTS_TUNE

VDDA1 7

24 VDDA2

26 VDDA3

VDDA4

GND

GPS_TUNE

GRX_IM 39

GRX_IP

GRX_QM

GRX_QP 38

ILNA_BIAS

18 ILNA_IN

ILNA_OUT

IMIXM

IMIXP 928 LO_OUT

PGND

15 PLNA_BIAS

PLNA_IN

PLNA_OUT

BLANK 2

29 CP_DUMP

CP_OUT

31 FAQ

GLNA_BIAS

GLNA_IN

GLNA_OUT

GMIXM 5

GMIXP

RFR6250E

U508

R510

100

C572

1500pC573

0.1u

C509

47p

B7827

100p

FL501

KMS-512

SW500

ANT

G2RF

C588

450OHM

COUP

OUT

2.2uH

L512

C546

1000p

4.7u

VREG_RFTX_2.85V

6.2KR529

110 VCC2

VMODE

VREF 5

C518

AWT6277R U505

GND1 3

GND2

7GND3

9GND4

GND5

RFIN

RFOUT

VCC1

1000pC562

56nH

L504

15R518

C521

680p

C596

4.7p

11.3KR503

33p

C575

C533

1.8nH

L528

2.7nH

15R516

VREG_TCXO_2.85V

0R504

L523

22nH

0.01u

C545

80.6K

R526

220

C516

R520

C522

33p

VREG_RFTX_2.85V

33p

C519

47p

GND3

GND4

GND5

GND6

GND7

17 GND8

GSM_IN

9GSM_OUT

TX_EN 3

VBATT

VCC

VRAMP

TQM7M5003

U501

DCS_PCS_IN 1

DCS_PCS_OUT

GND1 5

GND2

C586

100p

1.2p

R511

C597

C589

10p

L524

1.5nH

L525

8.2nH

0.1u

100ohmR514

C598

L508

7.5nH

C525

0.01u

C507 1.5nH

C591

4.7u

C577

L501

3.6nH

33p

C571

3.9nH

R530

0.01u

C541 82p

C540

0.01u

270

R522

C513

7.5nH

L511

L531

2.7nH

C539

5.6n

ECHU1C562JX5

22u

C543

GSM_PA_EN

GSM_PA_BAND

ILNA_OUT

WCDMA_2100_TX_OUT

WCDMA_2100

TX_Q_M

TX_Q_P

TX_I_P

CP2_OUT

HDET1

IMT_RX_M

IMT_RX_P

W_VMODE_N

CP2_OUT

UHF_LO_BUFF

TX_I_M

ILNA_OUT

IMT_RX_M

IMT_RX_P

RX0_I_M

RX0_I_P

RX0_Q_M

RX0_Q_P

RFR6250_TCXO

RF_SBST

RF_SBDT

RF_SBCK

TCXO_PM

RTR6250_TCXO

GSM_PA_RAMP

PA_ON

GSM_TX_VCO_0_EN_N

GSM_TX_VCO_1_EN_N

ANT_SEL0

ANT_SEL1

ANT_SEL2

TX_ON

TX_AGC_ADJ

RX0_I_M

RX0_I_P

RX0_Q_M

RX0_Q_P

RFR6250_TCXO

TRK_LO_ADJ

PA_THERM

DAC_REF

RF_SBCK

RF_SBDT

RF_SBST

RTR6250_TCXO

WCDMA_2100_TX_OUT

- 196 -

LGE Internal Use Only

Only for training and service purposes

7. CIRCUIT DIAGRAM

DRAWING

HKADC[4] - PCB_Rev_ADC

(WCMDA 2100PAM Enable)

Default Pull-up

ADC

Place near

( Default Pull-Down)

0 1

NAME

150K : 68K : 0.81V

DRAWING

0 1 0

2 12

Sign & Name

LG(42)-A-5505-10:01

1005 0.1uF 16V +80/-20%

Date

WDOG_EN (1:Enable , 0:Disable)

for VSS_THERMAL

(CODEC VSS)

(WCMDA PAM MODE)

8-bit, NAND boot

HKADC[1] - VBATT_SENSE

Trusted boot

LG Electronics Inc.

8 13

Native, ARM JTAG

Sheet/

MSM pin W18

(VDD_DAC_REF)

0 0 0

NOR boot

Near to B18 (VDD_PLL)

2200p cap => place between

MODE

PMIC_AUXIN[1]

150K : 47K : 0.62V

MODE2 MODE1 MODE0

(2012)

MODEL

150K : 100K : 1.04V

HKADC[0] - AMUX_OUT

10%

(Check CAM_DATA PINOUT !!!!)

PMIC_AUXIN[2] - PA_THERM

MSM pin AD26

Checked

HKADC[2] - HDET1

Place near

HKADC[3]

Native, MSM JTAG

10%

150K : 680K : 2.13V

Section

150K : 10K : 0.016V

BOOT_MODE2 BOOT_MODE

HKADC(5):PCB_Rev_ADC

150K : 150K : 1.30V

Sheets

Designer

(PLLOUT_TEST)

150K : 300K : 1.73V

2012 10uF 6.3V +80/-20% Ceramic

BOOT_MODE3

10%

NO.

150K : 470K : 1.97V

HKADC[5] - CHARGER_THERM

16-bit, NAND boot

MAY

2006 LGE

MODEM CPU

6/7

JOY 1.3

D12(VDDA1) and F12(DAC_REF)

Approved

LG Electronics Inc.

1 1

150K : 750K : 2.17V

w18 (Analog VSS guard ring for CODEC)

(CAD : 10uF=>Input MSMA_2.6V)

Normal boot

Near to MSM

USB 48M CLK

X 0

48MHz

X600

EXRY0002401

XMEM1_CS_N1_GPIO76

XMEM1_CS_N2_SDRAM1_CS_N0

XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77

XMEM1_HWAIT_N AA2

XMEM1_LWAIT_N_SDRAM1_CAS_N K8

W14

XMEM2_CS_N0

XMEM2_CS_N1

AC15

XMEM2_CS_N2_GPIO35

W15

AA15

XMEM2_CS_N3_GPIO36

TP601

UART3_DP_RX_DATA_GPIO85

UART3_DP_TX_DATA_GPIO84

M19

L25

UART3_RFR_N_GPIO87

UB1_N_SDRAM1_DQM1 M6

UB2_N

AF10

USB_DAT_VP

N26

N25 USB_OE_TP_N

USB_RX_DATA_GPIO29

N19

USB_SE0_VM

N23

A10

USB_XTAL48_IN B10

USB_XTAL48_OUT

AE17

WDOG_EN

WDOG_STB_SBCK1_GPIO0

H25

WE1_N_SDRAM1_WE_N

WE2_N

AF4

XMEM1_CS_N0 W6

AA1

TDI

TDO

A17

TMS

F15

TRK_LO_ADJ

L13

H15

TRST_N

H13

TX_AGC_ADJ

TX_ON_GRFC10

H12

P16 UART1_CTS_N_GPIO97

UART1_DP_RX_DATA_GPIO96

M23

UART1_DP_TX_DATA_GPIO95

L26

P21 UART1_RFR_N_PA_POWER_CTL_M_GPIO98

G6 UART2_CTS_N_GPIO90

UART2_DP_RX_DATA_GPIO89

UART2_DP_TX_DATA_GPIO88

UART2_RFR_N_GPIO91

UART3_CTS_N_GPIO86

L23

M21

SDRAM1_D31

AB4

SDRAM1_D4

SDRAM1_D5

SDRAM1_D6

SDRAM1_D7

SDRAM1_D8

SDRAM1_D9

A16

SLEEP_XTAL_IN B16

SLEEP_XTAL_OUT

F18

SYNTH0_GP_PDM0_GPIO92

H23 SYNTH1_GPIO41

SYNTH2_GPIO65

TCK

D16

TCXO D18

TCXO_EN_GPIO94

F19

D15

SDRAM1_D17

SDRAM1_D18

R11

SDRAM1_D19

SDRAM1_D2

AB2

SDRAM1_D20

SDRAM1_D21

SDRAM1_D22

SDRAM1_D23

SDRAM1_D24

SDRAM1_D25

SDRAM1_D26

SDRAM1_D27

SDRAM1_D28

SDRAM1_D29

SDRAM1_D3

SDRAM1_D30

SBDT

F26

SBDT1_GPIO1

H26 SBST

SBST1_GPIO93

H18

SDCC_DAT1_GPIO99

F25

M25

SDCC_DAT2_GPIO100

SDCC_DAT3_GPIO101

M26

SDRAM1_CLK_EN

SDRAM1_D0

SDRAM1_D1

SDRAM1_D10

SDRAM1_D11

SDRAM1_D12

SDRAM1_D13

SDRAM1_D14

SDRAM1_D15

SDRAM1_D16

PA_ON1_GPIO2

P25 PA_POWER_CTL

AA25

Q_IM_CH0

Q_IM_CH1

W23

Y25

Q_IP_CH0

Q_IP_CH1

V23

B12

Q_OUT

A12

Q_OUT_N

RESIN_N F13

RESOUT_N F11

AA4

RESOUT_N_EBI1

RINGER_GPIO18

L19

ROM1_ADV_N_SDRAM1_RAS_N G1

AB1

ROM1_CLK_SDRAM1_CLK

RTCK

H16

L21 SBCK

J23

MICFBN

MICFBP AC21

MICINN AC19

AC20

MICINP

MICOUTN AA18

AA19

MICOUTP

M16 MMC_CLK_SDCC_CLK_GPIO31

MMC_CMD_GPIO30

H14

L14 MMC_DATA_SDCC_DAT0_GPIO32

MODE0 Y23

MODE1 U23

T21

MODE2

T14

NAND2_FLASH_READY_GPIO33

OE1_N V2

AF7

OE2_N

PA_ON0

F17

H11

LCD_EN_GPIO37

MDDIC_DATN

A23

A22

MDDIC_DATP

MDDIC_STBN

B23

B22

MDDIC_STBP

MDDIH_DATN

B19

B20 MDDIH_DATP

MDDIH_STBN

A19

A20 MDDIH_STBP

MDP_VSYNC_PRIMARY_GPIO105

AD2

AE3

MDP_VSYNC_SECONDA_GPIO104

MIC1N AF20

MIC1P AE20

AF21

MIC2N

MIC2P AF22

MICBIAS T15

AC22

I2C_SCL_GPIO27

K21 I2C_SDA_GPIO26

AB25

I_IM_CH0

V25

I_IM_CH1

AC25

I_IP_CH0

W25

I_IP_CH1

I_OUT

B13

I_OUT_N

A13

R21 KEYSENSE0_N_GPIO62

KEYSENSE1_N_GPIO63

P19 KEYSENSE2_N_GPIO46

D14 KEYSENSE3_N_GPIO47

R23

U21 KEYSENSE4_N_GPIO48

LB1_N_SDRAM1_DQM0 L2

LB2_N_A2_0

AE10

LCD_CS_N_GPIO38

AF14

AE13

GRFC3_GPIO6

GRFC4_AUX_SBCK_GPIO7

H10

D11

GRFC5_AUX_SBST_GPIO8

GRFC7_GPIO10

T23

GRFC8_GPIO11

GRFC9_GPIO12

GRFX6_GPIO9

T19

GSM_PA_DAC_REF

AD26

V21

HKAIN0

HKAIN1 AA23

W21

HKAIN2

HKAIN3 V19

Y21

HKAIN4

HKAIN5 AB23

HPH_L W17

AA17

HPH_R

N16

GPIO42

GPIO43

GPIO44

A4 GPIO45

GPIO49

F9 GPIO50

B7 GPIO51

A7 GPIO52

D10

L12 GPIO53

F14 GPIO64

GPIO66

H17

GP_PDM1_PA_RANGE0

D17

GP_PDM2_PA_RANGE1

GRFC0_GPIO3

GRFC1_AUX_SBDT_GPIO4

GRFC2_GPIO5

F10

AE4

AC6

D2_3

AE5

D2_4

AA7

D2_5

AF5

D2_6

D2_7

AC7

D2_8

AA8

D2_9

F12

DAC_REF

EAR1ON AE18

EAR1OP AF18

GPIO17

K26 GPIO19

G21

GPIO28

GPIO39

GPIO40

L15 CAMIF_DATA7_GPIO59

D20

F16 CAMIF_DATA8_GPIO60

F20 CAMIF_DATA9_GPIO61

E23 CAMIF_HSYNC_GPIO15

CAMIF_PCLK_GPIO82

K23

CAMIF_VSYNC_GPIO16

CCOMP AA20

D2_0

AC5

AF3

D2_1

AC8

D2_10

AE7

D2_11

AA9

D2_12

W10

D2_13

D2_14

AC9

D2_15

AA10

D2_2

BOOT_MODE

BOOT_MODE2 AE22

AD1

BOOT_MODE3

G23

BT_CLK_GPIO25

BT_DATA_GPIO20

R19

E26

BT_SBCK_GPIO23

BT_SBDT_GPIO22

E25

F23

BT_SBST_GPIO24

BT_TX_RX_N_GPIO21

H21

CAMCLK_PO_GP_MN_GPIO13

J21

CAMIF_DATA0_GPIO83

J25

J26 CAMIF_DATA1_GPIO81

D21 CAMIF_DATA2_AUX_TRST_N_GPIO54

CAMIF_DATA3_AUX_TCK_GPIO55

C25 CAMIF_DATA4_AUX_TMS_GPIO56

D22

J19 CAMIF_DATA5_AUX_TDI_GPIO57

CAMIF_DATA6_AUX_TDO_GPIO58

A2_20_GPIO34

A2_3

W11

AC10

A2_4

AA11

A2_5

A2_6

AC11

T12

A2_7

W12

A2_8

A2_9

AA12

AF19

AUXIN AE19

AUXIP

AC18

AUXON_AUXOR

AUXOP_AUXOL AC17

AUX_PCM_CLK_GRFC14_GPIO80

K19

N21

AUX_PCM_DIN_GRFC13_GPIO14

AUX_PCM_DOUT_GRFC12_GPIO103

AUX_PCM_SYNC_GRFC11_GPIO102

AE21

A1_6

A1_7 N6

A1_8 N2

A1_9

AE9

A2_1

AC12

A2_10

A2_11

AE12

A2_12

AF12

AA13

A2_13

A2_14

AC13

A2_15

W13

A2_16

AE14

AC14

A2_17

A2_18

T13

A2_19

AA14

AF9

A2_2

AF13

A1_1

A1_10

A1_11 P2

A1_12 P6

A1_13

A1_14 P11

A1_2

A1_23_SDRAM1_DQM2_GPIO78

A1_24_GPIO79

A1_25_SDRAM1_DQM3_GPIO75

A1_3 M4

A1_4

A1_5 N11

U600-1

MSM6275_A

TP602

R609100K

0.01u

C644

1000p

C623

0.01u

C624

100K R611

10u

smd_2125h1_45_r

C603

0.01u

C627

0.01u

C616

0.01u

C643

51K

R610

R600

R60251K

C640

0.1uF

C628

C642

0.1u

0.1uF

C639

C613

0.01u

VREG_MSMA_2.6V

VREG_MSMP_2.7V

R601100K

0.1uF

C620

C602

0.01u

51 R605

100p

C606

1000p

VREG_MSMP_2.7V

R6071K

VREG_MSME_1.8V

C631

0.1uF

C618

C611

0.01u

VREG_MSMC_1.375V

C635

1000p

C633

C646

0.1u

R6082K

1000p

C638

C608

C610

C615

0.1uF

VREG_MSMP_2.7V

C617

0.01u

R603100K

0.1u

C607

VREG_MSMA_2.6V

1000p

C637

0.01u

C626

100K R604

B17

VSS_PAD3_2

A15

VSS_PAD3_3

VSS_DIG_3

VSS_DIG_4

AF8

VSS_DIG_5

AF16

VSS_DIG_6

T26

G26

VSS_DIG_7

D26

VSS_DIG_8

A24

VSS_DIG_9

VSS_PAD1_0

VSS_PAD1_1

VSS_PAD1_2

VSS_PAD1_3

VSS_PAD1_4

VSS_PAD2_0

AF6

AF11

VSS_PAD2_1

AF15

VSS_PAD2_2

VSS_PAD3_0

R26

VSS_PAD3_1

VSSA15

VSSA16

AF24

VSSA2

A21

D13

VSSA3

D19

VSSA4

VSSA5

P26

VSSA6

U19

VSSA7

V26

W16

VSSA8

W18

VSSA9

VSS_DIG_0

VSS_DIG_1

A14

VSS_DIG_10

VSS_DIG_11

A11

VSS_DIG_12

VSS_DIG_2

AC1

AE26

AF1

VSS48

VSS49

AF2

VSS5

AF25

VSS50

VSS51

AF26

B2 VSS6

VSS7

B25

B26 VSS8

VSS9

A18

VSSA1

VSSA10

W26

VSSA11

AB26

AC16

VSSA12

VSSA13

AC26

AD25

VSSA14

AF23

R13

R14 VSS33

VSS34

R15

R16 VSS35

VSS36

T11

T16 VSS37

W8 VSS38

VSS39

W19

A26 VSS4

VSS40

AA6

AA21

VSS41

AC4

VSS42

VSS43

AC23

AE1

VSS44

VSS45

AE2

AE25

VSS46

VSS47

M11

M12 VSS19

A2 VSS2

VSS20

M13

M14 VSS21

VSS22

M15

N12 VSS23

VSS24

N13

N14 VSS25

VSS26

N15

P12 VSS27

VSS28

P13

P14 VSS29

VSS3

A25

VSS30

P15

R12 VSS31

VSS32

VDD_PAD2_2

R25

VDD_PAD3_0 K25

VDD_PAD3_1

VDD_PAD3_2 B15

VDD_PAD3_3 B9

VDD_PAD4_0 A3

B18

VDD_PLL

VSS1

D23 VSS10

F6 VSS11

VSS12

F21

VSS13

H19 VSS14

K10 VSS15

VSS16

L11

L16 VSS17

VSS18

VDD_DIG_3 AC2

VDD_DIG_4 AE8

VDD_DIG_5 AE16

T25

VDD_DIG_6

VDD_DIG_7 G25

VDD_DIG_8 D25

B24

VDD_DIG_9

VDD_MDDI B21

VDD_PAD1_0 K2

VDD_PAD1_1

VDD_PAD1_2 M2

VDD_PAD1_3 R2

VDD_PAD1_4 U2

VDD_PAD2_0 AE6

AE11

VDD_PAD2_1 AE15

RESERVED

VDDA1 D12

AF17

VDDA10

VDDA2 P23

U25

VDDA3

VDDA4 U26

VDDA5 Y26

VDDA6 AA26

AE23

VDDA7

VDDA8 AE24

VDDA9 AA16

VDD_DIG_0 H2

VDD_DIG_1

B14

VDD_DIG_10

VDD_DIG_11 B11

VDD_DIG_12 B5

VDD_DIG_2

U600-2

MSM6275_B

C26

C612

VREG_MSMP_2.7V

0.01u

0.1uF

C605

C636

1000p

C629

0.1uF

C614

0.01u

smd_2125h1_45_r

C601

C609

10u

C632

1000p

C634 C641

1000p 0.1uF

R606

L600

100nH

C619

0.1uF

C621

1000p

C600

0.01u

10p

C625

C645

33nF

0.1uF

C604

C622

1000p

C630

2200p

HPIEV_IT_STATE_ETMTRIGIN

RX0_I_P

RX0_I_M

RX0_Q_P

RX0_Q_M

USB_XTALOUT

USB_XTALIN

WM_HPH_R

WM_HPH_L

EAR_SENSE_N

MSM_RTCK

MSM_TDO

FOLDER_DETECT

HPI_IT_APE_ETMPSTA0_XTIDAT

HPI_IT_MOD_ETMSYNCA_XTIDAT

HPI_EME_MOD_ETMPSTA1_XTIDAT

HPI_EME_APE_ETMPSTA2_XTIDAT

PM_SBCK

SDRAM_DQM(1)

USB_DAT

USB_OE_N

USB_PWR_EN

USB_SE0

USB_XTALIN

USB_XTALOUT

SDRAM_WE_N

SDRAM_CS_N(0)

SDRAM_CAS_N

HCSN_ETMCLK_XTICLK

MSM_TDI

MICINP

WM_MONO1

SLEEP_CLK

MSM_TCK

BUFF_TCXO

TCXO_EN

MSM_TMS

MSM_TRST_N

TX_ON

MSM_UART_RXD

MSM_UART_TXD

MSM_USIM_RST_N

MSM_USIM_DATA

MSM_USIM_CLK

PM_SBDT

PM_SBST

TX_I_M

SDRAM_DQM(0)

WM_MONO2

MICFBN

MICFBP

MICINN

MICOUTN

MICOUTP

PA_ON

GSM_PA_RAMP

TX_Q_P

TX_Q_M

MSM_RESIN_N

RESOUT_EBI2_N

SDRAM_RAS_N

RF_SBCK

RF_SBDT

RF_SBST

SDRAM_CLK_EN

DAC_REF

WM_RXN

WM_RXP

PWR_BTN

PM_INT_N

PS_HOLD

W_VMODE_N

GSM_PA_EN

GSM_PA_BAND

GSM_TX_VCO_1_EN_N

GSM_TX_VCO_0_EN_N

ANT_SEL1

ANT_SEL2

ANT_SEL0

GSM_PA_DAC_REF

AMUX_OUT

VBATT_SENSE

HDET1

VBAT_TEMP

TX_I_P

SDRAM_ADDR(10)

SDRAM_ADDR(11)

SDRAM_ADDR(12)

SDRAM_ADDR(13)

SDRAM_ADDR(14)

SDRAM_ADDR(2)

SDRAM_DQM(2)

SDRAM_ADDR(0)

SDRAM_DQM(3)

SDRAM_ADDR(3)

SDRAM_ADDR(4)

SDRAM_ADDR(5)

SDRAM_ADDR(6)

SDRAM_ADDR(7)

SDRAM_ADDR(8)

SDRAM_ADDR(9)

SDRAM_DATA(4)

SDRAM_DATA(3)

SDRAM_DATA(2)

SDRAM_DATA(1)

EBI2_DATA(15)

EBI2_DATA(14)

EBI2_DATA(13)

EBI2_DATA(12)

EBI2_DATA(11)

EBI2_DATA(10)

EBI2_DATA(9)

EBI2_DATA(8)

EBI2_ADDR(1)

EBI2_ADDR(2)

NAND_ALE

EBI2_WE_N

SDRAM_ADDR(1)

SDRAM_DATA(20)

SDRAM_DATA(19)

SDRAM_DATA(18)

SDRAM_DATA(17)

SDRAM_DATA(16)

SDRAM_DATA(15)

SDRAM_DATA(14)

SDRAM_DATA(13)

SDRAM_DATA(12)

SDRAM_DATA(11)

SDRAM_DATA(10)

SDRAM_DATA(9)

SDRAM_DATA(8)

SDRAM_DATA(7)

SDRAM_DATA(6)

SDRAM_DATA(5) TX_AGC_ADJ

TRK_LO_ADJ

SDRAM_DATA(0)

SDRAM_DATA(0:31)

SDRAM_DATA(31)

SDRAM_DATA(30)

SDRAM_DATA(29)

SDRAM_DATA(28)

SDRAM_DATA(27)

SDRAM_DATA(26)

SDRAM_DATA(25)

SDRAM_DATA(24)

SDRAM_DATA(23)

SDRAM_DATA(22)

SDRAM_DATA(21)

EBI2_DATA(0)

NAND_READY

NAND_CLE

DAC_REF

EBI2_DATA(0:15)

EBI2_DATA(7)

EBI2_DATA(6)

EBI2_DATA(5)

EBI2_DATA(4)

EBI2_DATA(3)

EBI2_DATA(2)

EBI2_DATA(1)

SDRAM_ADDR(0:14)

EBI2_OE_N

NAND_CS_N

SDRAM_CLK

- 197 -

LGE Internal Use Only

Only for training and service purposes

7. CIRCUIT DIAGRAM

VDD_ANA : 0.1uF

Artwork --> Place crystal and load caps close to PM6650 !!

Designer

DRAWING

LG(42)-A-5505-10:01

Sheets

Designer

Checked

VDD_MSMC : 4.7uF

Section

NO.

Date

LG Electronics Inc.

VDD_WLAN : 0.1uF

DRAWING

Battery charging circuit !!!!!

Approved

VDD_SPKR : NA

VDD_MSME : 4.7uF

Draw the Artwork_line thickly !!!!!

Approved

Date

Checked

USB Booting Protection

EUSY0297301

LG Electronics Inc.

Sheet/

VDD_RUIM : 0.1uF

PMIC_VPWR_BYPASS

NAME

--->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-

Load=12.5p

Section

2 8

VDD_PA : 4.7uF

DRAWING

VDD_RF : 0.1uF

Sheets

Sheet/

Sign & Name

VDD_MSM : 0.1uF

NO.

MODEL

2012

E E

Power Line --> Route carefully!!!!!

LG(42)-A-5505-10:01

Route carefully to avoid corrupting sensitive analog and RF signals!!!!!

MODEL

NAME

2006 LGE

draw_number

7/7

JOY 1.3

MODEM POWER

MAY LGE

draw_number

VDD_MAIN : 0.1uF

Artwork --> Place resistor and capacitor close to PM6650 !!

LG Electronics Inc.

----->> PM_SBDT , PM_SBCK , PM_SBST , PM_INT_N

1 8

Route as equal length as possible! -> ICHARGE, ICHARGEOUT

Sign & Name

1000p C705

C761

smd_1608h_9_r

4.7u

smd_1608h_9_r

VREG_SYNTH_2.85V

+VPWR

VREG_MSMP_2.7V

C731

4.7u

smd_1608h_9_r

C709

R70210K

C706

R704 470K

0.1u

0.01u

NAR730

C727

C719 0.1uF

+5V_PWR

C716 0.1uF

X700

32.768KHz

USB_VBUS_IN

+VPWR

KRX102E

Q702

C715

0.1uFC722

VREG_MSME_1.8V

47K R710

+VPWR

C739

smd_1608h_9_r

2.2u

0.1u

RB521S-30

D700

C702

C710

4.7u

smd_1608h_9_r

C730

0R707

R709 0

10K R706

C704

0.1u

C729

+VPWR

4.7u

18p

C736

smd_1608h_9_r

C733

C732

+VPWR

1u C711

+VPWR

4.7u

smd_1608h_9_r

C708

VREG_RFR_2.85V

VREG_USIM_2.85V

smd_1608h_9_r

C735

VREG_RFTX_2.85V

4.7u

0.1uF

2.2u

smd_1608h_9_r

C713

C720

0.1uFC728

Drain_B

Emitter 8

Gate

NC1

NC2 6

Source

USB_VBUS

VREG_MSMP_2.7V

Q701 NUS5530MN

Base

2Collector

Collector_B 9

4Drain

0.1u C701

+VPWR

0.1u C714

+VPWR

VREG_TCXO_2.85V

C723

VREG_MSMC_1.375V

0.1u

C725

RB521S-30

D701

VREG_MSMA_2.6V

+VPWR

0.1u C703

4.7uH

L701

REF_OUT(MPP8) 80

VREG_SYNT 81

AMUX_OUT 82

VDD_MAIN 83

VREG_TCXO

GND_SLUG 85

PON_RESET_N

VREG_RFTX 73

SPKR_BYP 74

SPKR_OUT_P 75

SPKR_IN_P 76

VDD_SPKR 77

SPKR_IN_M 78

SPKR_OUT_M 79

FLSH_DRV_N

CBL1PWR_N(MPP4) 66

VREG_RFRX2 67

CBL0PWR_N(MPP3) 68

VREG_RFRX1 69

BAT_FET_N

AMUX_IN1(MPP1) 70

VDD_RF 71

AMUX_IN2(MPP2)

MSM_INT_N 59

VBAT

VCOIN 60

REF_ISET 61

REF_GND 62

REF_BYP 63

VREG_WLAN 64

VDD_WLAN

SBST 51

VDD_MSM 52

TCXO_OUT 53

VDD_ANA 54

TCXO_EN 55

VREG_MSMA 56

PS_HOLD 57

TCXO_IN

XTAL_IN 44

SLEEP_CLK 45

XTAL_OUT 46

SBDT 47

VBACKUP 48

SBCK 49

ISNS_M

VREG_MSMP

VREG_MSME

VSW_MSME

RUIM_CLK(MPP10)

VREG_MMC

CHG_CTL_N

RUIM_M_RST(MPP5)

VDD_RUIM

VREG_RUIM

RUIM_RST(MPP6)

VDD_PA

ISNS_P

RUIM_M_IO(MPP11)

VSW_MSMC

VREG_MSMC

VDD_MSMC

RUIM_M_CLK(MPP9)

VDD_MSME

GP1_DRV_N(MPP7)

LCD_DRV_N

KPD_DRV_N

KPDPWR_N

VIB_DRV_N

RUIM_IO(MPP12)

VSW_PA

VREG_PA

VSW_5V

USB_CTL_N

USB_VBUS

USB_DAT

USB_D_P

USB_SE0

VCHG

USB_D_M

ADC_BYP

VREG_USB

USB_ID

VREG_5V

USB_OE_N

1000p

U700

PM6650-1M

4.7u

C737

C726

smd_1608h_9_r

0.1uFC721

C738

1000p

VREG_MSMP_2.7V

R708

USB_VBUS

18p

C734

smd_1608h_9_r

2.2u

VREG_MSME_1.8V

+VPWR

C712

R703100K

100K

R711

VSS7

P13

VSS8

VSS9

E6 _CAS

_CE

_CS

D5 _RAS

M10 _RE

D6 _WED

K6 _WEN

_WP

D13 VCCD3

V3 VCCD4

V8 VCCD5

VCCD6

V12

VCCN2

K12

VCCQD1

V9 VCCQD2

C6 VSS1

VSS10

VSS11

U10

U13 VSS12

F7 VSS2

G2 VSS3

G13 VSS4

L13 VSS5

VSS6

NC88

M12

N2 NC89

NC9

NC90 N3

NC91 N5

NC92 N6

NC93

NC94 N9

N10

NC95

NC96 N11

N12

NC97

NC98 N13

NC99 P7

M2 RY__BY

C7 VCCD1

VCCD2

NC73

K10 NC74

NC75

K11

NC76

K13

K14 NC77

L1 NC78

L2 NC79

A14

NC8

NC80

L4 NC81

NC82

NC83

NC84

L11

L14 NC85

M5 NC86

NC87

H13 NC59

NC6 A12

NC60

J3 NC61

NC62

NC63

NC64

NC65

J10

J11 NC66

J13 NC67

NC68

K2 NC69

A13

NC7

NC70

K4 NC71

NC72

NC44

G5 NC45

NC46

G7 NC47

NC48

NC49

A11

NC5

NC50

G10

G11 NC51

NC52

H3 NC53

NC54

H5 NC55

NC56

H9 NC57

H11 NC58

NC3

NC30

E12

E13 NC31

NC32

F3 NC33

F4 NC34

F5 NC35

NC36

NC37

F9 NC38

NC39

F10

NC4

F11 NC40

NC41

F12

F13 NC42

G3 NC43

B13

NC15 B14

NC16

NC17 C1

NC18 C5

NC19

NC2 A2

C13

NC20 C14

NC21 D1

NC22

NC23 D14

NC24 E7

NC25

NC26 E8

NC27

NC28 E10

E11

NC29

NC12

NC120 Y12

Y13

NC121 Y14

NC122 W1

NC123

NC124 W2

NC125

NC126 W4

W11

NC127

NC128 W12

W13

NC129

B11

NC13

NC130 W14

J12 NC131

D7 NC132

B12

NC14

NC105 T3

NC106 T7

NC107 T13

NC108 U1

NC109

NC11

NC110 U14

NC111

NC112 V2

V13

NC113

NC114 V14

NC115

NC116 Y2

NC117

NC118 Y4

Y11

NC119

DQM3

M11

IO1

IO2 M13

IO3 L10

L12

IO4 J9

IO5 H12

IO6 H10

IO7

IO8 G12

NC1

NC10

NC100 R2

NC101

NC102 R7

NC103 R9

NC104

DQ26 R10

DQ27 P11

R11

DQ28

DQ29 P12

DQ3

DQ30 R12

R13

DQ31

DQ4 U5

DQ5 T6

DQ6 U7

DQ7

DQ8 T9

T10

DQ9

DQM0 T8

DQM1 V7

DQM2

T11

DQ11

DQ12 U11

DQ13 V11

T12

DQ14 U12

DQ15

DQ16 P3

DQ17 R3

DQ18 P4

DQ19

DQ2 T5

DQ20

DQ21 R5

DQ22 P6

DQ23

DQ24 P9

P10

DQ25

E2 A3

D12 A4

C12

D11

C11 A7

D10 A8

C10 A9

M3 ALE

C4 BA0

D4 BA1

D8 CKE

M4 CLE

C8 CLK

DQ0 U4

DQ1

DQ10 V10

TY90009800COGG

C3 A0

D3 A1

E4 A10

D9 A11

C9 A12

E3 A2

0.1uFC718

U701

C717 0.1uF

C724

R701 100K

R712

BAT700

121K

R705 ML414RM_F9CL

VBATT

C760

+VPWR

1000p

4.7u

smd_1608h_9_r

C707

4.7uH

L700

0.1R713

33u

tcc_2125h1_r

C700

+VPWR

VBATT

Q700

QST4

312

ICHARGE

BATT_FET_N

ICHARGEOUT

USB_CTL_N

NAND_CLE

NAND_ALE

SDRAM_CS_N(0)

CHG_CNT_N

USB_PWR_EN

SDRAM_DQM(3)

EBI2_DATA(0)

EBI2_DATA(1)

EBI2_DATA(2)

EBI2_DATA(3)

EBI2_DATA(4)

EBI2_DATA(5)

EBI2_DATA(6)

EBI2_DATA(7)

KEY_ON_SW_N

ICHARGEOUT

CHG_CNT_N

ICHARGE

SDRAM_DATA(24)

EBI2_OE_N SDRAM_DATA(25)

NAND_READY SDRAM_DATA(26)

SDRAM_CLK_EN SDRAM_DATA(27)

SDRAM_ADDR(13) SDRAM_DATA(28)

SDRAM_ADDR(14) SDRAM_DATA(29)

SDRAM_DATA(30)

SDRAM_DATA(31)

SDRAM_DQM(0)

SDRAM_DQM(1)

SDRAM_DQM(2)

SDRAM_DATA(15)

EBI2_WE_N SDRAM_DATA(16)

SDRAM_RAS_N

RESOUT_EBI2_N

SDRAM_DATA(17)

SDRAM_WE_N SDRAM_DATA(18)

SDRAM_CAS_N SDRAM_DATA(19)

SDRAM_CLK SDRAM_DATA(20)

SDRAM_DATA(21)

SDRAM_DATA(22)

SDRAM_DATA(23)

NAND_CS_N

SDRAM_DATA(6)SDRAM_ADDR(6)

SDRAM_DATA(7)SDRAM_ADDR(7)

SDRAM_DATA(8)SDRAM_ADDR(8)

SDRAM_DATA(9)SDRAM_ADDR(9)

SDRAM_DATA(10)SDRAM_ADDR(10)

SDRAM_DATA(11)SDRAM_ADDR(11)

SDRAM_DATA(12)SDRAM_ADDR(12)

SDRAM_DATA(13)

SDRAM_DATA(14)

REMOTE_PWR_ON

PS_HOLD

JTAG_PS_HOLD

SDRAM_DATA(0)SDRAM_ADDR(0)

SDRAM_DATA(1)SDRAM_ADDR(1)

SDRAM_DATA(2)SDRAM_ADDR(2)

SDRAM_DATA(3)SDRAM_ADDR(3)

SDRAM_DATA(4)SDRAM_ADDR(4)

SDRAM_DATA(5)SDRAM_ADDR(5)

MSM_USIM_RST_N

USIM_P_RST_N

PM_SBCK

BUFF_TCXO

PM_SBST

TCXO_EN

PM_INT_N

GSM_PA_DAC_REF

AMUX_OUT

USB_CTL_N

MSM_RESIN_N

SDRAM_ADDR(0:12)

EBI2_DATA(0:7)

SDRAM_DATA(0:31)

PA_THERM

SLEEP_CLK

PM_SBDT

TCXO_PM

BATT_FET_N

USB_OE_N

USB_DAT

MSM_USB_D+

USB_SE0

MSM_USB_D-

KPD_DRV_N

MOT_PWR-

USIM_P_DATA

MSM_USIM_DATA

MSM_USIM_CLK

USIM_P_CLK

- 198 -

LGE Internal Use Only

Only for training and service purposes

7. CIRCUIT DIAGRAM

XF2B-3545-31A-P

LCD Connector

NAME

DRAWING

FUNCTION KEYPAD LED

LG Electronics Inc.

Sheet/

314

NO.

Designer

Sheets

Section

DRAWING

Checked

3 5

Sheet/

DRAWING

Date

LCD_Backlight driver

(lower contact)

Section

862

Approved

Date

Approved

Sign & Name

3 8

Designer

Checked

15 16

MODEL

1 7

MODEL

FUNCTION-SLIDER CON-HEADER

DRAWING

LG Electronics Inc.

NAME

Sheets

Sign & Name

LG Electronics Inc. NO.

LGE

2006

MAY JOY 1.3

LCD & FUNCTION KEY

LGE

MAY

1/1

82 12

100ohm

C105

820p

R109

0R115

VA102 RSB6.8CST2R

RSB6.8CST2RVA101

EVL14K02200

VA100

SW106 SW108

VA105

VA104

RSB6.8CST2R

100ohm

RSB6.8CST2R

R111

CN100

CN101

SW107

100ohmR110

AP_+VPWR

LD108

SSC-TWH104-HLSSSC-TWH104-HLS

LD107

VA103

VA107

RSB6.8CST2R

VA106

RSB6.8CST2R

LD104

SSC-TWH104-HLS

RSB6.8CST2R

SW104 SW105SW103

SW102

ZD101

RSB6.8CST2R

SW100

ZD100 RSB6.8CST2R

AP_+VPWR

SSC-TWH104-HLS

LD103

100ohm

100ohmR113

R112

C102

C101

C100

100ohm

100K

R114

R102

R103 100K

R104 100K

LD102

SSC-TWH104-HLS

LD100

SSC-TWH104-HLS

SW111

PLR0504F

SW109

D104

PLR0504F

D103

PLR0504F

D101

PLR0504F

D102

D100

PLR0504F

100ohmR107 100ohm R108R106 100ohm

100K

AP_VDD_LCD_2.8V

R101

SW101

D4 1

EN_SET

9GND

13 PGND

8VIN

VOUT

AP_+VPWR

AAT3151IWP_T1

C1+

C1- 4

C2+ 6

C2- 10

D1 11

D2 12

U100

4.7u

C104

C103

AP_VDD_LCD_2.8V

SW110

SSC-TWH104-HLS

LD101

TP100

TP102

LD105

SSC-TWH104-HLS

TP101

SSC-TWH104-HLS

LD106

LCD_VS

LCD_DATA(14)

LCD_DATA(12)

LCD_DATA(3)

LCD_DATA(1)

LCD_DATA(0)

LCD_DATA(9)

LCD_DATA(2)

LCD_DATA(11)

LCD_DATA(4)

LCD_DATA(13)

LCD_DATA(7)

LCD_DATA(6)

LCD_DATA(15)

DIS_WEN

WLED_CTL

LCD_DATA(5)

LCD_DATA(3)

LCD_DATA(1)

KEY_ROW(0)

KEY_ROW(1)

KEY_COL(6)

LCD_NRESET

LCD_DATA(0)

LCD_VS

DIS_CSN

DIS_WEN

DIS_RS

LCD_DATA(8)

LCD_DATA(10)

DIS_CSN

LCD_DATA(5)

DIS_RS

LCD_NRESET

DIS_WEN

DIS_RS

DIS_CSN

LCD_VS

WLED_CTL

LCD_DATA(0)

LCD_DATA(2)

LCD_DATA(4)

LCD_DATA(6)

LCD_DATA(8)

LCD_DATA(10)

LCD_DATA(12)

LCD_DATA(14)

LCD_DATA(15)

LCD_DATA(13)

LCD_DATA(11)

LCD_DATA(9)

LCD_DATA(7)

KEY_COL(4)

KEY_COL(5)

KEY_ROW(3)

KEY_ROW(2)

KPD_DRV_N

LED_ANODE

LED4

LED3

LED2

LED1

KEY_COL(7)

KEY_COL(6)

KEY_COL(5)

KEY_COL(4)

KEY_ROW(3)

KEY_ROW(2)

KEY_ROW(1)

KEY_ROW(0)

KPD_DRV_N

LED_ANODE

LED3

LED2

LED1

LCD_DATA(1)

LCD_DATA(10)

LCD_DATA(11)

LCD_DATA(12)

LCD_DATA(13)

LCD_DATA(14)

LCD_DATA(15)

LCD_DATA(2)

LCD_DATA(3)

LCD_DATA(4)

LCD_DATA(5)

LCD_DATA(6)

LCD_DATA(7)

LCD_DATA(8)

LCD_DATA(9)

LCD_DATA(0:15)

LED4

- 199 -

LGE Internal Use Only

Only for training and service purposes

7. CIRCUIT DIAGRAM

FUNCTION-SLIDER CON-SOCKET

MODEL

DRAWING

NAME

MODEL

3 72

NO.

6 8

LG Electronics Inc.

MAIIN-SLIDER CON-SOCKET

VGA_CAMERA

Checked

Designer

NO.

613 14

Designer

Sheets

LG Electronics Inc.

Checked

SectionSection

LG Electronics Inc.

Approved

Sign & NameSign & Name

Approved NAME

Sheets

Sheet/

DRAWING

Sheet/

Date

DRAWING

AP_VDD_LCD_2.8V

2006 LGE

SLIDER FPCB

JOY 1.3

MAY LGE

1/1

AXK720145G

LG Electronics Inc.

623

Date

DRAWING

HB-1M1005-601JT

FB101

G1 G2

G3 G4

35 36

CN102

FB100

HB-1M1005-601JT

R103 NA

TP105

OUT100

TP106

EVLC18S02015

VA101

C102

AP_+VPWR

CN101

TP108

0R101

AP_VDD_CAM_2.7V

AP_VDD_CAM_1.8V

OUT101

OUT102

L100

VA100

EVLC18S02015

56nH

AP_+VPWR

AP_VDD_LCD_2.8V

AP_VDD_CAM_2.7V

OUT103

RB521S-30

D100

AP_+VPWR

C101

0.1u

C100

0.1u

192

10 11

TP107

AP_VDD_CAM_1.8V

CN100

TP109

R100 0

R104

CCIRID(2)_CAM

CCIRID(0)_CAM

CCIRID(1)_CAM

RECEIVER+

RECEIVER-

I2CSCL0_CAM

I2CSDA0_CAM

VGA_RSTn

RECEIVER--

CCIRIVS_CAM

CCIRICLK_CAM

VGA_STANDBY

MOT_PWR-

CAMCLK_27MHZ_CAM

CCIRID(4)_CAM

CCIRID(6)_CAM

CCIRID(7)_CAM

CCIRID(5)_CAM

CCIRIHS_CAM

CCIRID(3)_CAM

KEY_ROW(3)

KEY_COL(4)

KEY_COL(5)

WLED_CTL

LCD_NRESET

DIS_WEN

DIS_RS

DIS_CSN

LCD_VS

KPD_DRV_N

RECEIVER-

RECEIVER--

KEY_COL(6)

KEY_COL(7)

KEY_ROW(0)

KEY_ROW(1)

KEY_ROW(2)

DIS_WEN

DIS_CSN

DIS_RS

LCD_VS

KEY_ROW(3)

KEY_ROW(2)

KEY_ROW(1)

KEY_ROW(0)

KEY_COL(5)

KEY_COL(4)

KPD_DRV_N

KEY_COL(6)

KEY_COL(7)

WLED_CTL

RECEIVER+

VGA_STANDBY

CAMCLK_27MHZ_CAM

I2CSCL0_CAMCCIRICLK_CAM

I2CSDA0_CAMCCIRID(0)_CAM

CCIRID(1)_CAM

VGA_RSTn

CCIRIHS_CAMCCIRID(2)_CAM

CCIRIVS_CAMCCIRID(3)_CAM

CCIRID(7)_CAMCCIRID(4)_CAM

CCIRID(6)_CAMCCIRID(5)_CAM

MOT_PWR-

LCD_NRESET

- 200 -

LGE Internal Use Only

Only for training and service purposes

7. CIRCUIT DIAGRAM

Approved

LGIC(42)-A-5505-10:01

NO.

Sheet/

Sheets

Checked

MODEL

Sign & Name

Iss.

VOLUME DOWN

Date Name

DRAWING

LG Electronics Inc.

DRAWING

Section Date

VOLUME UP

NAME

Notice No.

VOLUME SIDE KEY

VOLUME_SIDEKEY_FPCB

Rev_C

1/1

JOY

Designer

LG Electronics Inc.

AUG

2006

TP2 TP1

CN?

KB101

KB100

- 201 -

LGE Internal Use Only

Only for training and service purposes

7. CIRCUIT DIAGRAM

TP1 TP2

KB100

KB101

POWER KEY

MODEL

Checked

CAMERA KEY

Sheets

AUG

2006

NAME

Notice No.

NO.

Sheet/

Date

LG Electronics Inc.

DRAWING

Designer

LGIC(42)-A-5505-10:01 LG Electronics Inc.

JOY 1/1

LGE

POWER_Camera_BUTTON

Date Name

DRAWING

Approved

Sign & Name

Iss.

Section

CN100

- 202 -

LGE Internal Use Only

Only for training and service purposes

8. PCB LAYOUT

- 203 -

LGE Internal Use Only

Only for training and service purposes

8. PCB LAYOUT

- 204 -

LGE Internal Use Only

Only for training and service purposes

8. PCB LAYOUT

LGMC

- 205 -

LGE Internal Use Only

Only for training and service purposes

8. PCB LAYOUT

- 206 -

LGE Internal Use Only

Only for training and service purposes

8. PCB LAYOUT

LGMC

- 207 -

LGE Internal Use Only

Only for training and service purposes

8. PCB LAYOUT

LGMC

- 208 -

LGE Internal Use Only

Only for training and service purposes

- 209 -

9. Usage of Hot-Kimchi

9.1 Usage of Hot-Kimchi

9.1.1 Calibration

•

Procedure

1. Click SETTING in menu, and logic operation in sub-menu.

Choose “1” in LOGIC MODE (means calibration alone)

2.Select the model name which you want in list box

3.Click Start button to calibrate a phone

9. Usage of Hot-Kimchi

LGE Internal Use Only

Only for training and service purposes

Model Name

Calibration only

- 210 -

9. Usage of Hot-Kimchi

9.1.2 Basic Setting

•

Contents

✔ Click SETTING in menu, and logic operation in sub-menu.

✔ You can select how to control AT comm, Testset, and Power supply in DLL Operating

Mode.

✔ You can set UART Port and logic mode. (mode 1 : Calibration alone)

✔ You can set Result File’s name type. If you choose “TIME”, the saved files’ name is

saved in a run - time.

✔ You can run the multi mode (S/B1,S/B2 : You can use S/B1 for only one port.)

✔ You can set the path of HOTKIMCHI program.

LGE Internal Use Only

Only for training and service purposes

- 211 -

9. Usage of Hot-Kimchi

9.1.3 Log of Calibration and Test

•

Contents

✔ On Running, Log window is created in center area. It displays logs of command, and

measurements of Calibration or Autotest.

✔ The result files are saved in the directory “~janghee\debug\Cal”, “~janghee\debug\Auto”,

or “~janghee\debug\CalAuto”.

LGE Internal Use Only

Only for training and service purposes

- 212 -

10. Engineering Mode

A. About Engineering Mode

Engineering mode is designed to allow a service man/engineer to view and test the basic

functions provided by a handset.

B. Access Codes

The key sequence for switching the engineering mode on is *#001*2580#. Pressing END will

switch back to non-engineering mode operation.

10. Engineering Mode

LGE Internal Use Only

Only for training and service purposes

5. Save

Log

4. MTC

2. Device

Test

3. F

Engineering Mode

actory

Reset

1. Version

Info

AP/MP/HW

Factory

Options of in Main view :

- Set AP Debugmode On

- Set MP Debugmode On

Auto All Test

LCD

LED

Vibrator

Sound

Camera

Keypad

MP Msg Viewer

RTC Test

- 213 -

10. Engineering Mode

10.1 Version Info

10.1.1 AP/MP/HW Version

10.1.2 Factory Version

10.2 Device Test

10.2.1 Auto All Test

LCD On/Off -> Keypad LED On/Off -> Color Auto Test -> Ringtone Test -> Vibrator Test ->

Keypad Test

10.2.2 LCD

1) Auto Color Test

Red -> Green -> Blue -> Balck -> White To exit test, press the right arrow key.

2) Color Table Test : display the RGB table

10.2.3 LED

1) Backlight Test

This controls brightness of Backlight. When entering into the menu, the present

backlight-value in the phone is displayed. Use Left/Right key to adjust the level of

brightness.

2) Keypad Light Test

This controls brightness of keypad light. When entering into the menu, the present

keypad light-value in the phone is displayed. Use Left/Right key to adjust the level of

brightness of keypad.

3) Blinking Test

Keypad & LCD Backlight blinking test.

10.2.4 Vibrator

This menu is to test the vibration mode.

10.2.5 Sound

1) Ringtone Test

This menu is test ring tone.

2) Audio Calibration

This menu is to test db value of each volume level

3) Vocoder Calibration

This menu is to test db value of each frequency of codec.

LGE Internal Use Only

Only for training and service purposes

- 214 -

10. Engineering Mode

4) Echo Cancelation

This menu is to test echo cancellation parameter of codec.

5) Sound Calibration

This menu is to test volume gain of codec.

6) Loopback Test

This menu is to test the vibration mode.

7) AES/ACS Tunning

This menu is to test acoustic echo cancellation/suppression.

10.2.6 Camera

Camera application will be launched.

10.2.7 Keypad

This menu is to test all keys.

10.2.8 MP Msg Viewer

This menu is to display messages from MP

10.2.9 RTC Test

This menu is to display current time.

10.3 Factory Reset

This menu is to restore factory setting value.

10.4 MTC

Not to use.

10.5 Save Log

To save the latest log messages.

In Main view

Options

Set AP Debugmode On : UART switch is changed to AP / MP side

Set MP Debugmode On : not to use.

LGE Internal Use Only

Only for training and service purposes

- 215 -

LGE Internal Use Only

Only for training and service purposes

- 216 -

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.1 EXPLODED VIEW

16 17

22 23 24

33 35

37 83

51 53 54

66 67 68

71 78

6357

- 217 -

LGE Internal Use Only

Only for training and service purposes

- 218 -

LGE Internal Use Only

Only for training and service purposes

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 219 -

11.2 Replacement Parts

Note: This Chapter is used for reference, Part order

is ordered by SBOM standard on GCSC

Level Location

No Part Name Part Number Spec Color Remark

1 IMT,FOLDER TIFF0011101

2 AAAY00 ADDITION AAAY0123901 Metal Black

3 MCCZ00 CAP MCCZ0021601 BOX, TW, , , , , Without Color

3 MCJZ00 COVER MCJZ0046701 BOX, TW, , , , , Without Color 62

3 MLAC00 LABEL,BARCODE MLAC0004501 Export(105*40) Without Color

3 MLAJ00 LABEL,MASTER BOX MLAJ0004401 LABEL,MASTER BOX(for C1300i NEW_CGR) Without Color

3 MPBZ00 PAD MPBZ0155609 BOX, TW, , , , , Without Color

3 MPCY00 PALLET MPCY0012403 COMPLEX, (empty), , , , , DARK BLUE

2 APEY00 PHONE APEY0241401 Metal Black

3 ACGM00 COVER ASSY,REAR ACGM0079901 Black

4 MCCC00 CAP,EARPHONE JACK MCCC0040001 COMPLEX, (empty), , , , , Black 61

4 MCCF00 CAP,MOBILE SWITCH MCCF0041201 MOLD, Urethane Rubber S190A, , , , , Black 77

4 MCCG00 CAP,MULTIMEDIA CARD MCCG0006801 COMPLEX, (empty), , , , , Black 74

4 MCJN00 COVER,REAR MCJN0058801 MOLD, PC LUPOY SC-1004ML, , , , , Black 66

4 MDAD00 DECO,CAMERA MDAD0026001 ELECTROFORMING, Ni, , , , , Black 70

4 MGAD00 GASKET,SHIELD FORM MGAD0140101 COMPLEX, (empty), , , , , Without Color 67

4 MGAE00 GASKET,DUST MGAE0000401 COMPLEX, (empty), , , , , Without Color 57

4 MGAE01 GASKET,DUST MGAE0000501 COMPLEX, (empty), , , , , Without Color 64

4 MHGB00 HOLDER,CARD MHGB0001801 PRESS, STS, 0.2T, , , , Without Color 75

4 MIDZ00 INSULATOR MIDZ0131001 COMPLEX, (empty), , , , , Without Color

4 MIDZ01 INSULATOR MIDZ0131101 COMPLEX, (empty), , , , , Without Color 63

4 MLAB00 LABEL,A/S MLAB0001102 C2000 USASV DIA 4.0 White 55

4 MLAN00 LABEL,QUALCOMM MLAN0000603 White,95C Transparent

4 MLEA00 LOCKER,BATTERY MLEA0035001 MOLD, PC LUPOY SC-1004ML, , , , , Black 73

4 MLEY00 LOCKER MLEY0000801 SIM LOCKER Silver 76

4 MPBH00 PAD,MIKE MPBH0030201 COMPLEX, (empty), , , , , Without Color 56

4 MPBL00 PAD,MSM MPBL0005201 COMPLEX, (empty), , , , , Without Color 65

4 MPBN00 PAD,SPEAKER MPBN0038201 COMPLEX, (empty), , , , , Without Color 58

4 MPBN01 PAD,SPEAKER MPBN0041401 COMPLEX, (empty), , , , , Without Color 60

4 MPBT00 PAD,CAMERA MPBT0037801 COMPLEX, (empty), , , , , Without Color 68

4 MSDB00 SPRING,COIL MSDB0003901 CUTTING, BeCu, , , , , Silver 72

4 MTAA00 TAPE,DECO MTAA0131201 COMPLEX, (empty), , , , , Without Color 69

4 MTAB00 TAPE,PROTECTION MTAB0170801 COMPLEX, (empty), , , , , Without Color

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 220 -

Level Location

No Part Name Part Number Spec Color Remark

4 MTAZ00 TAPE MTAZ0181001 COMPLEX, (empty), , , , , Without Color 80,83

4 MWAE00 WINDOW,CAMERA MWAE0020901 CUTTING, NS, , , , , Black 79

5 MBJC00 BUTTON,FUNCTION MBJC0020501 COMPLEX, (empty), , 51.9, 104, 12.2, Black 44

5 MBJN00 BUTTON,VOLUME MBJN0010101 COMPLEX, (empty), , 51.9, 104, 12.2, Black 38

5 MCJK00 COVER,FRONT MCJK0064501 MOLD, PC LUPOY SC-1004ML, , 51.9, 104, 12.2, Black 39

6 MICE00 INSERT,NUT MICE0000801 EXTRUSION, LDPE, , , , , Gold

5 MDAG00 DECO,FRONT MDAG0023701 MOLD, POM TX-31, , 51.9, 104, 12.2, Black 40

5 MIDZ00 INSULATOR MIDZ0130401 COMPLEX, (empty), , , , , Without Color 43

5 MIDZ01 INSULATOR MIDZ0130501 COMPLEX, (empty), , , , , Without Color 47

5 MIDZ02 INSULATOR MIDZ0130601 COMPLEX, (empty), , , , , Without Color 48

5 MPBH00 PAD,MIKE MPBH0027601 COMPLEX, (empty), , , , , Without Color 42

5 MTAA00 TAPE,DECO MTAA0131301 COMPLEX, (empty), , , , , Without Color 41

5 MTAB00 TAPE,PROTECTION MTAB0148801 COMPLEX, (empty), , , , , Without Color

5 MTAB01 TAPE,PROTECTION MTAB0170201 COMPLEX, (empty), , , , , Without Color

4 ACGR00 COVER

ASSY,SLIDE(LOWER) ACGR0008301 Black

5 MCJV00 COVER,SLIDE(LOWER) MCJV0008401 MOLD, PC LUPOY SC-1004ML, , 51.9, 104, 7.6, Black 33

5 MDAY00 DECO MDAY0032901 MOLD, POM TX-31, , 51.9, 104, 12.2, Black

5 MMAA00 MAGNET,SWITCH MMAA0000901 G7000 12x2x0.7t Metal Silver

5 MPBG00 PAD,LCD MPBG0056401 COMPLEX, (empty), , , , , Without Color 30

5 MPBU00 PAD,CONNECTOR MPBU0000501 COMPLEX, (empty), , , , , Without Color 26

5 MTAF00 TAPE,MOTOR MTAF0010701 COMPLEX, (empty), , , , , Without Color 31

5 MTAZ00 TAPE MTAZ0181101 COMPLEX, (empty), , , , , Without Color 35

5 MTAZ01 TAPE MTAZ0181201 COMPLEX, (empty), , , , , Without Color 32

5 MTAZ02 TAPE MTAZ0181301 COMPLEX, (empty), , , , , Without Color 29

4 ACGS00 COVER

ASSY,SLIDE(UPPER) ACGS0009301 Black

5 MBFF00 BRACKET,LCD MBFF0011801 CASTING, Al Alloy, , , , , Black 9

5 MCJW00 COVER,SLIDE(UPPER) MCJW0009801 CASTING, Al Alloy, , 51.9, 104, 7.6, Black 4

6 MICC00 INSERT,FRONT(UPPER) MICC0010001 D2.2 L2.0 KURL 45 Gold

5 MFBB00 FILTER,RECEIVER MFBB0020401 COMPLEX, (empty), , , , , Without Color 5

5 MKAC00 KEYPAD,FUNCTION MKAC0009501 MOLD, ABS MP-220, , 51.9, 104, 7.6, Black 11

5 MPBG00 PAD,LCD MPBG0056301 COMPLEX, (empty), , , , , Without Color 12

5 MPBJ00 PAD,MOTOR MPBJ0040701 COMPLEX, (empty), , , , , Without Color 6

5 MPBM00 PAD,RECEIVER MPBM0017401 COMPLEX, (empty), , , , , Without Color 7

5 MPBT00 PAD,CAMERA MPBT0037901 COMPLEX, (empty), , , , , Without Color 10

5 MPBZ00 PAD MPBZ0172101 COMPLEX, (empty), , , , , Without Color 8

5 MTAB00 TAPE,PROTECTION MTAB0153501 COMPLEX, (empty), , , , , Without Color

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 221 -

Level Location

No Part Name Part Number Spec Color Remark

5 MTAD00 TAPE,WINDOW MTAD0064501 COMPLEX, (empty), , , , , Without Color 3

5 MWAC00 WINDOW,LCD MWAC0072201 CUTTING, PMMA MR 200, , 51.9, 104, 12.2, Black 2

4 ARDY00 RAIL ASSY,SLIDE ARDY0001601 Black 36

4 GMEY00 SCREW MACHINE,BIND GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK Without Color 82,85

4 GMZZ00 SCREW MACHINE GMZZ0022101 1.4 mm,1.7 mm,MSWR3(BK) ,A ,+ ,- , Without Color 84

4 GMZZ01 SCREW MACHINE GMZZ0020501 3.5 mm,1.5 mm,SWCH18A ,A ,+ ,- , Black

4 MCCH00 CAP,SCREW MCCH0093901 MOLD, Urethane Rubber S190A, , , , , Black 37

4 MGAD00 GASKET,SHIELD FORM MGAD0139601 COMPLEX, (empty), , , , , Without Color 21

4 MGAE00 GASKET,DUST MGAE0000101 COMPLEX, (empty), , , , , Without Color

4 MGAE01 GASKET,DUST MGAE0000201 COMPLEX, (empty), , , , , Without Color 20

4 MGAE02 GASKET,DUST MGAE0000301 COMPLEX, (empty), , , , , Without Color 27

4 MIDZ00 INSULATOR MIDZ0130701 COMPLEX, (empty), , , , , Without Color 18

4 MIDZ01 INSULATOR MIDZ0130801 COMPLEX, (empty), , , , , Without Color 19

4 MIDZ02 INSULATOR MIDZ0135601 COMPLEX, (empty), , , , , Without Color 28

4 MIDZ03 INSULATOR MIDZ0143101 COMPLEX, (empty), , , , , Without Color

4 MKAZ00 KEYPAD MKAZ0033201 MOLD, ABS MP-220, , , , , Black 45

4 MLAZ00 LABEL MLAZ0038303 PRINTING, (empty), , , , , White

4 MPBF00 PAD,FLEXIBLE PCB MPBF0021901 COMPLEX, (empty), , , , , Without Color 17

4 MPBZ00 PAD MPBZ0172201 COMPLEX, (empty), , , , , Without Color 25

4 MPBZ01 PAD MPBZ0183901 COMPLEX, (empty), , , , , Without Color 16

4 MTAB00 TAPE,PROTECTION MTAB0170401 COMPLEX, (empty), , , , , Without Color 1

4 MTAB01 TAPE,PROTECTION MTAB0176601 COMPLEX, (empty), , , , , Without Color

7 MBFP00 BRACKET,CAMERA MBFP0006501 MOLD, PC LUPOY SC-1004ML, , , , , Black 53

7 MTAK00 TAPE,CAMERA MTAK0000701 COMPLEX, (empty), , , , , Without Color

7 MTAZ00 TAPE MTAZ0189701 COMPLEX, (empty), , , , , Without Color 54

5 MLAZ00 LABEL MLAZ0038301 PID Label 4 Array Without Color

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 222 -

Level Location

No Part Name Part Number Spec Color Remark

4 SNGF00 ANTENNA,GSM,FIXED SNGF0024701 3.0 ,-2 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL ,;

,QUAD ,-2.0 ,50 ,3.0 71

4 SUSY00 SPEAKER SUSY0022601 PIN ,8 ohm,90 dB,17 mm,Spring Contact Type 59

3 ACGQ00 COVER ASSY,SLIDE ACGQ0013301 Black

4 ACGK00 COVER ASSY,FRONT ACGK0080001 Black

4 SACY00 PCB ASSY,FLEXIBLE SACY0053101 LCD FPCB

5 SACB00 PCB

ASSY,FLEXIBLE,INSERT SACB0035701

5 SACE00 PCB ASSY,FLEXIBLE,SMT SACE0048001

6 SACC00 PCB ASSY,FLEXIBLE,SMT

BOTTOM SACC0028501

7 CN100 CONNECTOR,BOARD TO

BOARD ENBY0019501 20 PIN,.4 mm,ETC , ,H=1.5, Socket

6 SACD00 PCB ASSY,FLEXIBLE,SMT

TOP SACD0039101

7 C100 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

7 C101 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

7 C102 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

7 CN101 CONNECTOR,BOARD TO

BOARD ENBY0035901 40 PIN,0.4 mm,ETC , ,H=1.0, Plug

7 CN102 CONNECTOR,BOARD TO

BOARD ENBY0022901 70 PIN,0.4 mm,ETC , ,H=0.9, Plug

7 D100 DIODE,SWITCHING EDSY0011901 EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,

IR=30uA(VR=10V)

7 FB100 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,

7 FB101 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,

7 L100 INDUCTOR,CHIP ELCH0005007 56 nH,J ,1005 ,R/TP ,

7 R100 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

7 R101 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

7 R104 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

7 VA100 VARISTOR SEVY0003801 18 V, ,SMD ,

7 VA101 VARISTOR SEVY0003801 18 V, ,SMD ,

6 SPCY00 PCB,FLEXIBLE SPCY0072601 POLYI ,.4 mm,MULTI-4 , SLIDE-FPCB

4 SAJY00 PCB ASSY,SUB SAJY0022201 14

5 SAJB00 PCB ASSY,SUB,INSERT SAJB0010801

6 ADCA00 DOME ASSY,METAL ADCA0062701 Without Color 13

5 SAJE00 PCB ASSY,SUB,SMT SAJE0016601

11.2 Replacement Parts

Note: This Chapter is used for reference, Part order

is ordered by SBOM standard on GCSC

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 223 -

Level Location

No Part Name Part Number Spec Color Remark

6 SAJC00 PCB ASSY,SUB,SMT

BOTTOM SAJC0014901

7 C100 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

7 C101 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

7 C102 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

7 C103 CAP,CERAMIC,CHIP ECCH0006201 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP

7 C104 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

7 CN100 CONNECTOR,FFC/FPC ENQY0010901 35 PIN,0.3 mm,ETC , ,H=1.2

7 CN101 CONNECTOR,BOARD TO

BOARD ENBY0036001 40 PIN,0.4 mm,ETC , ,H=1.0, Socket

7 D100 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE

7 D101 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE

7 D102 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE

7 D103 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE

7 D104 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE

7 R101 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

7 R102 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

7 R103 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

7 R104 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

7 R106 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

7 R107 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

7 R111 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

7 R112 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

7 R115 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

7 U100 IC EUSY0337001 TDFN33 ,12 PIN,R/TP ,3x3x1.0

7 VA101 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

7 VA102 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

7 VA103 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

7 VA105 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

7 VA107 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

7 ZD100 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

7 ZD101 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

6 SAJD00 PCB ASSY,SUB,SMT TOP SAJD0017001

7 LD100 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 224 -

Level Location

No Part Name Part Number Spec Color Remark

7 LD101 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

7 LD102 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

7 LD103 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

7 LD104 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

7 LD105 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

7 LD106 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

7 LD107 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

7 LD108 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

7 R108 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

7 R109 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

7 R110 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

7 R113 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

7 R114 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

7 VA100 VARISTOR SEVY0000702 14 V,10% ,SMD ,

7 VA104 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

7 VA106 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

6 SPJY00 PCB,SUB SPJY0025701 FR-4 ,0.8 mm,SBL 6 ,KS10

4 SJMY00 VIBRATOR,MOTOR SJMY0006508 3 V,.08 A,10*3.45 ,17mm , ,3V , , ,12500 , , , ,38 22

4 SURY00 RECEIVER SURY0012801 23

4 SVCY00 CAMERA SVCY0014001 CMOS ,VGA ,5.5x11.4x3.2t, Magna 1/7.4" 24

4 SVLM00 LCD MODULE SVLM0020701 MAIN ,2.4" 240*320 ,42.88*60.65 ,262k ,TFT ,TM

,BD663474 , 15

3 GMEY00 SCREW MACHINE,BIND GMEY0011201 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK Without Color

3 MCCH00 CAP,SCREW MCCH0094001 COMPLEX, (empty), , , , , Black 78

3 MCCH01 CAP,SCREW MCCH0097701 MOLD, Urethane Rubber S190A, , , , , Black

3 MLAK00 LABEL,MODEL MLAK0006901

3 SAFY00 PCB ASSY,MAIN SAFY0184101

4 SAFB00 PCB ASSY,MAIN,INSERT SAFB0071301 51

5 ACMY00 CAMERA ASSY ACMY0005701 Black

6 ABFZ00 BRACKET ASSY ABFZ0011401 Black

6 SVCY00 CAMERA SVCY0014101 CMOS ,MEGA ,2M AF(FPCB,Micron 1/4" SOC2020,90')

5 ADCA00 DOME ASSY,METAL ADCA0062801 Without Color 49

5 MAAA00 ABSORBER,ELECTROMAG

NETIC WAVE MAAA0000101 COMPLEX, (empty), , , , , Without Color

5 SPKY00 PCB,SIDEKEY SPKY0034201 POLYI ,0.2 mm,DOUBLE ,POWER_SIDE_KEY

5 SPKY01 PCB,SIDEKEY SPKY0034401 POLYI ,0.2 mm,DOUBLE ,SIDE KEY(Volume)

4 SAFF00 PCB ASSY,MAIN,SMT SAFF0105101

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 225 -

Level Location

No Part Name Part Number Spec Color Remark

5 SAFC00 PCB ASSY,MAIN,SMT

BOTTOM SAFC0084601

6 ANT400 ANTENNA,GSM,FIXED SNGF0023801 3.0 ,-2.0 dBd,, ,Chip, bluetooth ,; ,SINGLE ,-2.0 ,50 ,3.0

6 BAT700 BATTERY,CELL,LITHIUM SBCL0001305 3 V,1 mAh,COIN ,SMT Temp.260 degree. PB-Free B/B

6 C100 CAP,CERAMIC,CHIP ECCH0000275 0.33 uF,16V,Z,Y5V,HD,1608,R/TP

6 C101 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP

6 C102 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP

6 C103 CAP,CERAMIC,CHIP ECCH0000275 0.33 uF,16V,Z,Y5V,HD,1608,R/TP

6 C104 CAP,CERAMIC,CHIP ECCH0000275 0.33 uF,16V,Z,Y5V,HD,1608,R/TP

6 C105 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP

6 C106 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP

6 C107 CAP,CERAMIC,CHIP ECCH0000275 0.33 uF,16V,Z,Y5V,HD,1608,R/TP

6 C108 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C109 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP

6 C110 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C111 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C112 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C113 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C114 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C115 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C116 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C117 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C118 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C119 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C120 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C121 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C122 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C123 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C124 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C125 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C126 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C127 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C128 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C129 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C130 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C131 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C132 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 226 -

Level Location

No Part Name Part Number Spec Color Remark

6 C133 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C134 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C135 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C136 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C137 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C138 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C139 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C140 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C141 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C142 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C143 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C144 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C145 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C146 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C147 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C148 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C149 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C150 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C151 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C153 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C154 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C200 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C201 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C202 CAP,CERAMIC,CHIP ECCH0000157 15 nF,16V,K,X7R,HD,1005,R/TP

6 C203 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP

6 C204 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C205 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C206 CAP,CERAMIC,CHIP ECCH0000157 15 nF,16V,K,X7R,HD,1005,R/TP

6 C207 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C208 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C209 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C219 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP

6 C220 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C221 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C222 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C224 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C225 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 227 -

Level Location

No Part Name Part Number Spec Color Remark

6 C226 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C227 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C228 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C229 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C230 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C232 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

6 C233 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

6 C234 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C235 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C236 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C240 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C241 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C242 CAP,TANTAL,CHIP ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP

6 C243 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C244 CAP,TANTAL,CHIP ECTH0004402 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP

6 C245 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C246 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

6 C247 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C248 CAP,CHIP,MAKER ECZH0003202 1 uF,6.3V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C249 CAP,CERAMIC,CHIP ECCH0002002 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP

6 C250 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C251 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

6 C252 CAP,CERAMIC,CHIP ECCH0000120 39 pF,50V,J,NP0,TC,1005,R/TP

6 C253 CAP,TANTAL,CHIP ECTH0002002

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty]

,[empty]

6 C254 CAP,CHIP,MAKER ECZH0003503 1 uF,25V ,K ,X5R ,HD ,1608 ,R/TP

6 C255 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C256 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C257 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C258 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C259 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C260 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C262 CAP,CERAMIC,CHIP ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP

6 C263 CAP,CERAMIC,CHIP ECCH0005602 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP

6 C264 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C265 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C266 CAP,CERAMIC,CHIP ECCH0002004 0.22 uF,10V ,K ,B ,TC ,1005 ,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 228 -

Level Location

No Part Name Part Number Spec Color Remark

6 C267 CAP,CERAMIC,CHIP ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP

6 C300 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C301 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C302 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C303 CAP,CHIP,MAKER ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

6 C304 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

6 C305 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C306 CAP,CHIP,MAKER ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

6 C307 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

6 C310 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C311 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

6 C312 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C313 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C314 CAP,CERAMIC,CHIP ECCH0000393 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

6 C317 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C318 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C319 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C321 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

6 C324 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C325 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C326 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C327 CAP,CHIP,MAKER ECZH0001503 0.47 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C328 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C329 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C330 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C331 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C332 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

6 C334 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C337 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C338 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C339 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C340 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C341 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C342 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C400 CAP,TANTAL,CHIP ECTH0002002

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty]

,[empty]

6 C401 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 229 -

Level Location

No Part Name Part Number Spec Color Remark

6 C402 CAP,CHIP,MAKER ECZH0001215 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP

6 C403 CAP,CHIP,MAKER ECZH0001121 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

6 C404 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C405 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C406 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C407 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C408 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C409 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C410 CAP,CHIP,MAKER ECZH0001211 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP

6 C411 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C412 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C416 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C417 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C421 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C422 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C500 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 C501 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C503 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C504 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C505 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C506 CAP,CHIP,MAKER ECZH0000841 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C507 INDUCTOR,CHIP ELCH0001033 1.5 nH,S ,1005 ,R/TP ,PBFREE

6 C508 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C509 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C510 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C511 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C514 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C515 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C516 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C517 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C518 CAP,TANTAL,CHIP,MAKER ECTZ0006002 4.7 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

6 C519 CAP,CERAMIC,CHIP ECCH0000122 47 pF,50V,J,NP0,TC,1005,R/TP

6 C520 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C521 CAP,CHIP,MAKER ECZH0001122 680 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

6 C522 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C523 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C524 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 230 -

Level Location

No Part Name Part Number Spec Color Remark

6 C525 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C526 CAP,FILM,MPP ECFD0000604 6.8 nF,16V ,J ,NI ,SMD ,2012 mm,R/TP

6 C527 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C530 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C531 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C532 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C533 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C534 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C535 CAP,CERAMIC,CHIP ECCH0000137 330 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

6 C536 CAP,CHIP,MAKER ECZH0000844 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C537 CAP,CERAMIC,CHIP ECCH0000129 120 pF,50V,J,NP0,TC,1005,R/TP

6 C538 CAP,FILM,MPP ECFD0000703 3900 pF,16V ,J ,NI ,SMD ,2012 mm,R/TP

6 C539 CAP,FILM,MPP ECFD0000614 5.6 nF,16V ,J ,NI ,SMD ,2012 mm,R/TP

6 C540 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C541 CAP,CERAMIC,CHIP ECCH0000127 82 pF,50V,J,NP0,TC,1005,R/TP

6 C542 CAP,CERAMIC,CHIP ECCH0000138 390 pF,50V,K,X7R,HD,1005,R/TP

6 C543 CAP,TANTAL,CHIP ECTH0001704 22 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,[empty] , ,2.2X1.25X1.2MM ,[empty] ,[empty] ,[empty]

6 C544 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C545 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C546 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C547 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C548 CAP,TANTAL,CHIP,MAKER ECTZ0006002 4.7 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

6 C549 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C550 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C551 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C552 CAP,CHIP,MAKER ECZH0001106 4700 pF,25V ,K ,X7R ,HD ,1005 ,R/TP

6 C553 CAP,TANTAL,CHIP,MAKER ECTZ0006002 4.7 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

6 C554 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C555 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C556 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP

6 C557 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP

6 C559 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C560 INDUCTOR,CHIP ELCH0005010 1.8 nH,S ,1005 ,R/TP ,

6 C561 CAP,CERAMIC,CHIP ECCH0000115 22 pF,50V,J,NP0,TC,1005,R/TP

6 C562 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C563 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 231 -

Level Location

No Part Name Part Number Spec Color Remark

6 C566 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C567 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C568 CAP,TANTAL,CHIP ECTH0001903 22 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

6 C570 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C571 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C572 CAP,CERAMIC,CHIP ECCH0000145 1.5 nF,50V,K,X7R,HD,1005,R/TP

6 C573 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C574 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C575 INDUCTOR,CHIP ELCH0005010 1.8 nH,S ,1005 ,R/TP ,

6 C580 RES,CHIP,MAKER ERHZ0000483 47 ohm,1/16W ,J ,1005 ,R/TP

6 C600 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C601 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP

6 C602 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C603 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP

6 C604 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C605 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C606 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C607 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C612 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C613 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C614 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C615 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C616 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C617 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C618 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C619 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C620 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C621 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C622 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C623 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C624 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C625 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C626 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C627 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C628 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C629 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C630 CAP,CERAMIC,CHIP ECCH0000147 2.2 nF,50V,K,X7R,HD,1005,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 232 -

Level Location

No Part Name Part Number Spec Color Remark

6 C631 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C632 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C633 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C634 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C635 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C636 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C637 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C638 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C639 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C640 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C641 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C642 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C643 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C644 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C645 CAP,CERAMIC,CHIP ECCH0000161 33 nF,16V,K,X7R,HD,1005,R/TP

6 C646 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C802 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 CN200 CONNECTOR,BOARD TO

BOARD ENBY0015601 34 PIN,0.4 mm,STRAIGHT ,AU ,0.9MM HEIGHT

6 CN202 CONNECTOR,I/O ENRY0006801 18 PIN,0.4 mm,ETC , , ,; ,18 ,0.40MM ,ANGLE

,RECEPTACLE ,SMD ,R/TP ,

6 CN203 CONNECTOR,ETC ENZY0017601 3 PIN,2.5 mm,ETC , ,H=2.5

6 CN402 CONNECTOR,BOARD TO

BOARD ENBY0016701 20 PIN,0.4 mm,STRAIGHT ,AU ,0.9 STACKING,MALE

6 D201 DIODE,TVS EDTY0008601 SOD-323 ,6 V,400 W,R/TP ,PB-FREE

6 D300 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE

6 D301 DIODE,TVS EDTY0008607 SC70-6L ,6 V,200 W,R/TP ,PB-FREE

6 D400 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

6 D401 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

6 D402 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

6 D700 DIODE,SWITCHING EDSY0011901 EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,

IR=30uA(VR=10V)

6 FB245 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB500 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,

6 FB501 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,

6 FB502 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,

6 FB503 FILTER,BEAD,CHIP SFBH0002301 1000 ohm,1608 ,CHIP FERRITE BEAD BLM11

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 233 -

Level Location

No Part Name Part Number Spec Color Remark

6 FL400 FILTER,SAW SFSY0027301 2450 MHz,2.0*1.5*1.0 ,SMD ,Pb-free_B/T_SAW

6 FL500 FILTER,SEPERATOR SFAY0007601

900.1800 ,1900.2100 , dB, dB, dB, dB,ETC ,GSM

TRIPLE, WCDMA2100 Quad Band FEM, 6.5X4.8X1.5

Size

6 J300 CONN,SOCKET ENSY0001602 6 PIN,ETC ,5 IRECTIONAL ,2.54 mm,K(GC200)

6 L300 INDUCTOR,SMD,POWER ELCP0009401 4.7 uH,M ,2.8*2.6*1.0 ,R/TP ,

6 L301 INDUCTOR,SMD,POWER ELCP0009401 4.7 uH,M ,2.8*2.6*1.0 ,R/TP ,

6 L302 INDUCTOR,CHIP ELCH0001022 56 nH,J ,1005 ,R/TP ,Pb Free

6 L500 INDUCTOR,CHIP ELCH0001405 3.3 nH,S ,1005 ,R/TP ,PBFREE

6 L501 INDUCTOR,CHIP ELCH0003816 3.6 nH,S ,1005 ,R/TP ,

6 L502 CAP,CHIP,MAKER ECZH0000802 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6 L503 INDUCTOR,CHIP ELCH0010401 2.2 uH,M ,1005 ,R/TP ,

6 L504 INDUCTOR,CHIP ELCH0001022 56 nH,J ,1005 ,R/TP ,Pb Free

6 L505 INDUCTOR,CHIP ELCH0003816 3.6 nH,S ,1005 ,R/TP ,

6 L506 INDUCTOR,CHIP ELCH0010401 2.2 uH,M ,1005 ,R/TP ,

6 L507 INDUCTOR,CHIP ELCH0003814 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005

6 L508 INDUCTOR,CHIP ELCH0003817 7.5 nH,J ,1005 ,R/TP ,

6 L509 INDUCTOR,CHIP ELCH0010401 2.2 uH,M ,1005 ,R/TP ,

6 L510 INDUCTOR,CHIP ELCH0001405 3.3 nH,S ,1005 ,R/TP ,PBFREE

6 L511 INDUCTOR,CHIP ELCH0003817 7.5 nH,J ,1005 ,R/TP ,

6 L512 INDUCTOR,CHIP ELCH0010401 2.2 uH,M ,1005 ,R/TP ,

6 L513 INDUCTOR,CHIP ELCH0003814 5.1 nH,S ,1005 ,R/TP ,5.1nH,1005

6 L514 INDUCTOR,CHIP ELCH0003817 7.5 nH,J ,1005 ,R/TP ,

6 L515 INDUCTOR,CHIP ELCH0001421 47 nH,J ,1005 ,R/TP ,PBFREE

6 L516 INDUCTOR,CHIP ELCH0001428 10 nH,J ,1005 ,R/TP ,

6 L517 INDUCTOR,CHIP ELCH0003818 9.1 nH,J ,1005 ,R/TP ,

6 L518 INDUCTOR,CHIP ELCH0001421 47 nH,J ,1005 ,R/TP ,PBFREE

6 L519 INDUCTOR,CHIP ELCH0003818 9.1 nH,J ,1005 ,R/TP ,

6 L520 INDUCTOR,CHIP ELCH0001428 10 nH,J ,1005 ,R/TP ,

6 L521 INDUCTOR,CHIP ELCH0001421 47 nH,J ,1005 ,R/TP ,PBFREE

6 L522 INDUCTOR,CHIP ELCH0001402 18 nH,J ,1005 ,R/TP ,Pb Free

6 L523 INDUCTOR,CHIP ELCH0001413 22 nH,J ,1005 ,R/TP ,PBFREE

6 L524 INDUCTOR,CHIP ELCH0001404 1.5 nH,S,1005,R/TP

6 L525 INDUCTOR,CHIP ELCH0005016 8.2 nH,J ,1005 ,R/TP ,

6 L526 INDUCTOR,CHIP ELCH0005012 3.9 nH,S ,1005 ,R/TP ,

6 L527 CAP,CERAMIC,CHIP ECCH0000701 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6 L600 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP ,

6 MIC200 MICROPHONE SUMY0009203 UNIT ,42 dB,4*1.5 ,Reverse TYPE

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 234 -

Level Location

No Part Name Part Number Spec Color Remark

6 Q700 TR,BJT,PNP EQBP0009901 TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680

6 Q701 TR,FET,P-CHANNEL EQFP0008601 DFN8 ,1.3 W,-20 V,-3.9 A,R/TP ,Intergrated power

MOSFET with PNP Transistor

6 R100 RES,CHIP,MAKER ERHZ0000295 51 Kohm,1/16W ,F ,1005 ,R/TP

6 R101 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R102 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R103 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 R105 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP

6 R106 RES,CHIP,MAKER ERHZ0000422 15 Kohm,1/16W ,J ,1005 ,R/TP

6 R107 RES,CHIP,MAKER ERHZ0000459 3 Kohm,1/16W ,J ,1005 ,R/TP

6 R108 RES,CHIP,MAKER ERHZ0000459 3 Kohm,1/16W ,J ,1005 ,R/TP

6 R109 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

6 R110 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP

6 R111 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

6 R112 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R113 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R114 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R115 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R200 RES,CHIP,MAKER ERHZ0000433 180 Kohm,1/16W ,J ,1005 ,R/TP

6 R201 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R202 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

6 R203 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP

6 R204 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

6 R205 RES,CHIP,MAKER ERHZ0000433 180 Kohm,1/16W ,J ,1005 ,R/TP

6 R206 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R208 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R210 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R211 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R212 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R213 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R214 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R215 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R221 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

6 R222 RES,CHIP,MAKER ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP

6 R223 RES,CHIP,MAKER ERHZ0000504 68 ohm,1/16W ,J ,1005 ,R/TP

6 R224 RES,CHIP,MAKER ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP

6 R226 RES,CHIP,MAKER ERHZ0000537 680000 ohm,1/16W ,F ,1005 ,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 235 -

Level Location

No Part Name Part Number Spec Color Remark

6 R227 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

6 R228 RES,CHIP ERHY0011601 11 Kohm,1/16W ,F ,1005 ,R/TP

6 R229 RES,CHIP,MAKER ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP

6 R230 RES,CHIP,MAKER ERHZ0000507 68 Kohm,1/16W ,J ,1005 ,R/TP

6 R231 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R232 RES,CHIP,MAKER ERHZ0000507 68 Kohm,1/16W ,J ,1005 ,R/TP

6 R233 RES,CHIP,MAKER ERHZ0000203 10 Kohm,1/16W ,F ,1005 ,R/TP

6 R300 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R303 RES,CHIP,MAKER ERHZ0000287 47 Kohm,1/16W ,F ,1005 ,R/TP

6 R305 RES,CHIP,MAKER ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP

6 R306 RES,CHIP,MAKER ERHZ0000441 22 ohm,1/16W ,J ,1005 ,R/TP

6 R307 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

6 R308 RES,CHIP,MAKER ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP

6 R309 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R310 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R311 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R313 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R314 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R315 RES,CHIP,MAKER ERHZ0000485 4700 ohm,1/16W ,J ,1005 ,R/TP

6 R401 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R404 RES,CHIP ERHY0000101 0 ohm,1/16W,F,1005,R/TP

6 R410 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R420 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

6 R421 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

6 R500 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 R501 RES,CHIP ERHY0000253 4.3K ohm,1/16W,J,1005,R/TP

6 R502 RES,CHIP,MAKER ERHZ0000286 4700 ohm,1/16W ,F ,1005 ,R/TP

6 R503 RES,CHIP,MAKER ERHZ0003203 11.3 Kohm,1/16W ,F ,1005 ,R/TP

6 R504 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R505 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R506 RES,CHIP ERHY0000186 2.2 Kohm,1/16W ,F ,1005 ,R/TP

6 R507 RES,CHIP,MAKER ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP

6 R508 RES,CHIP ERHY0000101 0 ohm,1/16W,F,1005,R/TP

6 R509 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP

6 R510 RES,CHIP,MAKER ERHZ0000201 100 ohm,1/16W ,F ,1005 ,R/TP

6 R511 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R512 RES,CHIP,MAKER ERHZ0000307 6200 ohm,1/16W ,F ,1005 ,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 236 -

Level Location

No Part Name Part Number Spec Color Remark

6 R513 RES,CHIP,MAKER ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP

6 R514 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

6 R515 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

6 R516 RES,CHIP,MAKER ERHZ0000419 15 ohm,1/16W ,J ,1005 ,R/TP

6 R517 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

6 R518 RES,CHIP,MAKER ERHZ0000419 15 ohm,1/16W ,J ,1005 ,R/TP

6 R519 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

6 R520 RES,CHIP ERHY0003501 220 ohm,1/16W ,J ,1005 ,R/TP

6 R521 RES,CHIP ERHY0003501 220 ohm,1/16W ,J ,1005 ,R/TP

6 R522 RES,CHIP,MAKER ERHZ0000531 270 ohm,1/16W ,J ,1005 ,R/TP

6 R523 RES,CHIP,MAKER ERHZ0000531 270 ohm,1/16W ,J ,1005 ,R/TP

6 R524 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

6 R530 INDUCTOR,CHIP ELCH0005012 3.9 nH,S ,1005 ,R/TP ,

6 R531 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

6 R600 RES,CHIP,MAKER ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP

6 R601 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R602 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R603 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R604 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R605 RES,CHIP ERHY0000105 51 ohm,1/16W,F,1005,R/TP

6 R606 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R607 RES,CHIP,MAKER ERHZ0000404 1 Kohm,1/16W ,J ,1005 ,R/TP

6 R608 RES,CHIP,MAKER ERHZ0000437 2 Kohm,1/16W ,J ,1005 ,R/TP

6 R609 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R610 RES,CHIP,MAKER ERHZ0000493 51 Kohm,1/16W ,J ,1005 ,R/TP

6 R611 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R713 RES,CHIP,MAKER ERHZ0003901 .1 ohm,1/4W ,F ,2012 ,R/TP

6 R714 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R715 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R729 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R730 RES,CHIP,MAKER ERHZ0000701 0 ohm,1/10W ,J ,1608 ,R/TP

6 S300 CONN,SOCKET ENSY0018901 8 PIN,ETC , ,2.54 mm,Micro-SD, Reverse

6 SW500 CONN,RF SWITCH ENWY0002304 STRAIGHT ,SMD ,0.8 dB,MUSE MODEL

6 U100 IC EUSY0269702 BGA(14*14) ,355 PIN,R/TP ,1Gbit NAND+512Mbit DDR

SDRAM, 3G Smart Phone for Open OS MAP

6 U101 IC EUSY0149402 SOT-553 ,5 PIN,R/TP ,Single 2 Input AND Gate

6 U102 IC EUSY0149402 SOT-553 ,5 PIN,R/TP ,Single 2 Input AND Gate

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 237 -

Level Location

No Part Name Part Number Spec Color Remark

6 U103 IC EUSY0149402 SOT-553 ,5 PIN,R/TP ,Single 2 Input AND Gate

6 U201 IC EUSY0198601 SOT-666 ,6 PIN,R/TP ,Single SPDT Analog Switch

6 U202 IC EUSY0269401 I2C Dual Codec ,48 PIN,R/TP ,

6 U204 IC EUSY0263301 SC-88(2.0x2.1) ,6 PIN,R/TP ,Single SPDT Switch, Pb

Free

6 U206 IC EUSY0317101 WQFN ,10 PIN,R/TP ,1.8*1.4*0.75

6 U208 IC EUSY0335701 QFN ,8 PIN,R/TP ,1.2W, Mono, Differencial Audio AMP

6 U300 IC EUSY0300101 WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog

Switch, PB-Free

6 U302 IC EUSY0064501 SOT-23-5 ,5 PIN,R/TP ,2.7V LDO

REGULATOR,PBFREE

6 U303 IC EUSY0064501 SOT-23-5 ,5 PIN,R/TP ,2.7V LDO

REGULATOR,PBFREE

6 U304 IC EUSY0241401 FLIP-CHIP 5 ,5 PIN,R/TP ,1-BIT DUAL SUP. BUS

BUFFER LEVEL TRANS / 26 OHM SERIES ON A

6 U307 IC EUSY0223003 HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH

OUTPUT CONTROL / 3.3V

6 U308 IC EUSY0241401 FLIP-CHIP 5 ,5 PIN,R/TP ,1-BIT DUAL SUP. BUS

BUFFER LEVEL TRANS / 26 OHM SERIES ON A

6 U310 IC EUSY0269501 TFBGA ,84 PIN,R/TP ,PMIC for Application Processor

Engine of STM, Pb Free

6 U311 IC EUSY0162301 SOT-553 ,5 PIN,R/TP ,Single 2 Input OR Gate

6 U312 IC EUSY0149402 SOT-553 ,5 PIN,R/TP ,Single 2 Input AND Gate

6 U313 IC EUSY0241401 FLIP-CHIP 5 ,5 PIN,R/TP ,1-BIT DUAL SUP. BUS

BUFFER LEVEL TRANS / 26 OHM SERIES ON A

6 U400 IC EUSY0064501 SOT-23-5 ,5 PIN,R/TP ,2.7V LDO

REGULATOR,PBFREE

6 U401 IC EUSY0293401 VFBGA ,48 PIN,R/TP ,Bluetooth Single Chip(V2.0+EDR)

6 U405 IC EUSY0269201 Flip-Chip20 ,20 PIN,R/TP ,8 bit Level Translator, Pb Free

6 U407 IC EUSY0269201 Flip-Chip20 ,20 PIN,R/TP ,8 bit Level Translator, Pb Free

6 U500 IC EUSY0203802 QFN ,56 PIN,R/TP ,GSM/WCDMA TRANSMITTER &

GSM RECEIVER

6 U501 PAM SMPY0013501 35 dBm,51 %, A, dBc, dB,7x7x1.1 ,SMD ,Polar Edge

6 U502 VCO EXSC0009201 MHz, PPM, pF,SMD ,5.5*4.8*1.5 ,824MHz ~ 915MHz,

1710MHz ~ 1910MHz, 14pin

6 U503 FILTER,SAW SFSY0023001 1950 MHz,2.0*1.4*0.8 ,SMD ,5pin, Unbal-Unbal, 50//50

6 U504 IC EUSY0280501 , PIN,R/TP ,

6 U505 PAM SMPY0013301 dBm,43 %, A,-40 dBc,26 dB,4x4x1.1 ,SMD ,2.1GHz,

HSDPA

6 U506 DUPLEXER,GSM SDGY0000701 1950 MHz,2140 MHz,1.6 dB,1 dB,45 dB,51

dB,3.8*3.8*1.4 ,SMD ,WCDMA (FBAR)

6 U507 COUPLER,RF

DIRECTIONAL SCDY0003402 -20 dB,-0.25 dB,-35 dB,1.0*0.58*0.35 ,SMD ,1850M ~

1910M, 4pin, Pb Free

6 U600 IC EUSY0241701 BALL CSP ,409 PIN,R/TP

,WCDMA/GSM/GPRS/EDGE/HSDPA MODEM

6 VA200 VARISTOR SEVY0003801 18 V, ,SMD ,

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 238 -

Level Location

No Part Name Part Number Spec Color Remark

6 VA201 VARISTOR SEVY0003801 18 V, ,SMD ,

6 VA208 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA209 VARISTOR SEVY0003602 5.6 V, ,SMD ,1005, 60pF

6 VA210 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

6 VA211 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

6 VA212 VARISTOR SEVY0003801 18 V, ,SMD ,

6 VA213 VARISTOR SEVY0003801 18 V, ,SMD ,

6 VA300 VARISTOR SEVY0003801 18 V, ,SMD ,

6 VA301 VARISTOR SEVY0003801 18 V, ,SMD ,

6 VA302 VARISTOR SEVY0003801 18 V, ,SMD ,

6 VA303 VARISTOR SEVY0003901 5.5 V, ,SMD ,480pF, 1005

6 X100 OSCILLATOR EXSY0022201

19.2 MHz,20 PPM,15 pF,SMD ,3.2*2.5*1.0 ,1.71V ~

1.89V, -20'C ~ +70'C ,; ,19.2MHz ,20PPM ,1.8V ,3.2 ,2.5

,1.0 , ,SMD ,R/TP

6 X400 OSCILLATOR EXSY0022201

19.2 MHz,20 PPM,15 pF,SMD ,3.2*2.5*1.0 ,1.71V ~

1.89V, -20'C ~ +70'C ,; ,19.2MHz ,20PPM ,1.8V ,3.2 ,2.5

,1.0 , ,SMD ,R/TP

6 X600 RESONATOR EXRY0002401 48 MHz,.5 %,14 pF,SMD ,2.0*1.2*0.65 ,Outgoing

Tolerance 0.2%, 0.05% at -40'C ~ +85C, Built-In Cap

5 SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0083601

6 C210 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP

6 C211 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C212 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP

6 C213 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C214 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C215 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP

6 C216 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C217 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C218 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP

6 C237 CAP,TANTAL,CHIP ECTH0002201 10 uF,6.3V ,M ,STD ,1608 ,R/TP

6 C238 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C239 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C308 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C309 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

6 C320 CAP,TANTAL,CHIP ECTH0002002

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty]

[

6 C322 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C413 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C414 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 239 -

Level Location

No Part Name Part Number Spec Color Remark

6 C415 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C418 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C419 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C420 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C558 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C564 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C565 CAP,CERAMIC,CHIP ECCH0000165 68 nF,6.3V,K,X5R,HD,1005,R/TP

6 C569 CAP,CERAMIC,CHIP ECCH0000112 15 pF,50V,J,NP0,TC,1005,R/TP

6 C577 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C578 CAP,CHIP,MAKER ECZH0000853 8.2 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP

6 C579 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C581 CAP,CHIP,MAKER ECZH0000816 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C582 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C583 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C584 CAP,CHIP,MAKER ECZH0000830 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C585 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C586 CAP,CERAMIC,CHIP ECCH0000173 1.2 pF,16V ,B ,NP0 ,TC ,1005 ,R/TP

6 C587 CAP,CHIP,MAKER ECZH0001122 680 pF,50V ,K ,X7R ,HD ,1005 ,R/TP

6 C588 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C589 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C590 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C591 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C592 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C593 CAP,CERAMIC,CHIP ECCH0007801 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C594 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C595 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP

6 C596 CAP,CHIP,MAKER ECZH0000839 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP

6 C597 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C598 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C599 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

6 C700 CAP,TANTAL,CHIP ECTH0002002

33 uF,10V ,M ,L_ESR ,2012 ,R/TP ,; , ,[empty] ,[empty] ,

,-55TO+125C , ,2.2X1.1X1.1MM ,[empty] ,[empty]

[

6 C701 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C702 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C703 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C704 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C705 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 240 -

Level Location

No Part Name Part Number Spec Color Remark

6 C706 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C707 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C708 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C709 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C710 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C711 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C712 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

6 C713 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

6 C714 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C715 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C716 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C717 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C718 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C719 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C720 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C721 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C722 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C723 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C724 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C725 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP

6 C726 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C727 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP

6 C728 CAP,CHIP,MAKER ECZH0004402 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

6 C729 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C730 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C731 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C732 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

6 C733 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP

6 C734 CAP,CERAMIC,CHIP ECCH0000113 18 pF,50V,J,NP0,TC,1005,R/TP

6 C735 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C736 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C737 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C738 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C739 CAP,CHIP,MAKER ECZH0001421 2.2 uF,6.3V ,K ,X5R ,HD ,1608 ,R/TP

6 C760 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP

6 C761 CAP,CHIP,MAKER ECZH0026301 4.7 uF,6.3V ,Z ,Y5V ,HD ,1608 ,R/TP

6 C800 CAP,CHIP,MAKER ECZH0000813 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 241 -

Level Location

No Part Name Part Number Spec Color Remark

6 CN201 CONNECTOR,BOARD TO

BOARD ENBY0022801 70 PIN,0.4 mm,ETC , ,H=0.9, Socket

6 D200 DIODE,TVS EDTY0008602 SOD-323 ,13.3 V,400 W,R/TP ,PB-FREE

6 D403 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

6 D404 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

6 D405 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

6 D701 DIODE,SWITCHING EDSY0011901 EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) ,

IR=30uA(VR=10V)

6 FB204 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,

6 FB205 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,

6 FB206 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,

6 FB207 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,

6 FB221 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB222 FILTER,BEAD,CHIP SFBH0000903 600 ohm,1005 ,

6 FB223 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB224 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB225 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB227 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB229 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB230 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB231 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB232 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB233 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB234 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB235 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB236 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB237 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB238 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB239 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 242 -

Level Location

No Part Name Part Number Spec Color Remark

6 FB240 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB241 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB242 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB243 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FB244 FILTER,BEAD,CHIP SFBH0009304 1500 ohm,1005 ,Chip bead ,; ,1500ohm ,1x0. ,[empty]

,R/TP

6 FL200 FILTER,EMI/POWER SFEY0013601 SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm, 7.5pF)

6 FL201 FILTER,EMI/POWER SFEY0013601 SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm, 7.5pF)

6 FL202 FILTER,EMI/POWER SFEY0013601 SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm, 7.5pF)

6 FL203 FILTER,EMI/POWER SFEY0013601 SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm, 7.5pF)

6 FL204 FILTER,EMI/POWER SFEY0013201 SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 100ohm

6 FL205 FILTER,EMI/POWER SFEY0013201 SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 100ohm

6 FL206 FILTER,EMI/POWER SFEY0013601 SMD ,18 V,4ch. EMI_ESD Filter (50 Ohm, 7.5pF)

6 FL207 FILTER,EMI/POWER SFEY0013201 SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 100ohm

6 FL208 FILTER,EMI/POWER SFEY0013201 SMD ,1608 ,EMI-ESD Filter, 4ch, 14V, 15pF, 100ohm

6 FL501 FILTER,SAW SFSY0025601 2140 MHz,2.0*1.4*0.68 ,SMD ,Balanced Output

(100ohm)

6 L528 INDUCTOR,CHIP ELCH0005002 2.7 nH,S ,1005 ,R/TP ,

6 L529 INDUCTOR,CHIP ELCH0005006 33 nH,J ,1005 ,R/TP ,

6 L530 INDUCTOR,CHIP ELCH0005001 2.2 nH,S ,1005 ,R/TP ,

6 L531 INDUCTOR,CHIP ELCH0005002 2.7 nH,S ,1005 ,R/TP ,

6 L532 INDUCTOR,CHIP ELCH0005009 100 nH,J ,1005 ,R/TP ,

6 L533 INDUCTOR,CHIP ELCH0003815 2.7 nH,S ,1005 ,R/TP ,

6 L700 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,

6 L701 INDUCTOR,SMD,POWER ELCP0008001 4.7 uH,M ,2.5*2.0*1.0 ,R/TP ,

6 LD400 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

6 LD401 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

6 LD402 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

6 LD403 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

6 LD404 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

6 LD405 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

6 LD406 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

6 LD407 DIODE,LED,CHIP EDLH0012501 Snow White ,1608 ,R/TP ,color concept

6 Q500 TR,BJT,ARRAY EQBA0000301 SC-88A,0.15W,R/TP,NPN/PNP DUAL

6 R207 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R216 RES,CHIP,MAKER ERHZ0000407 1000 Kohm,1/16W ,J ,1005 ,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 243 -

Level Location

No Part Name Part Number Spec Color Remark

6 R217 RES,CHIP,MAKER ERHZ0000443 2200 ohm,1/16W ,J ,1005 ,R/TP

6 R218 RES,CHIP,MAKER ERHZ0000467 330 Kohm,1/16W ,J ,1005 ,R/TP

6 R219 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R400 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R402 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

6 R403 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

6 R405 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

6 R406 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

6 R408 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

6 R409 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

6 R411 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

6 R412 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

6 R413 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R414 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP

6 R415 RES,CHIP,MAKER ERHZ0000267 3300 ohm,1/16W ,F ,1005 ,R/TP

6 R416 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R417 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R418 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R419 RES,CHIP,MAKER ERHZ0000507 68 Kohm,1/16W ,J ,1005 ,R/TP

6 R525 RES,CHIP ERHY0003301 100 ohm,1/16W ,J ,1005 ,R/TP

6 R526 RES,CHIP,MAKER ERHZ0000318 80.6 Kohm,1/16W ,F ,1005 ,R/TP

6 R527 THERMISTOR SETY0000903 NTC ,68000 ohm,SMD ,+/- 10% / 2012 SIZE, Pb Free

6 R528 RES,CHIP,MAKER ERHZ0000288 470 Kohm,1/16W ,F ,1005 ,R/TP

6 R529 RES,CHIP,MAKER ERHZ0000502 6200 ohm,1/16W ,J ,1005 ,R/TP

6 R532 RES,CHIP,MAKER ERHZ0003203 11.3 Kohm,1/16W ,F ,1005 ,R/TP

6 R533 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

6 R534 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 R535 RES,CHIP,MAKER ERHZ0000402 10 ohm,1/16W ,J ,1005 ,R/TP

6 R701 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R702 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

6 R703 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R704 RES,CHIP,MAKER ERHZ0000487 470 Kohm,1/16W ,J ,1005 ,R/TP

6 R705 RES,CHIP,MAKER ERHZ0004201 121000 ohm,1/16W ,F ,1005 ,R/TP

6 R706 RES,CHIP,MAKER ERHZ0000405 10 Kohm,1/16W ,J ,1005 ,R/TP

6 R707 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R708 RES,CHIP,MAKER ERHZ0000490 51 ohm,1/16W ,J ,1005 ,R/TP

6 R709 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 244 -

Level Location

No Part Name Part Number Spec Color Remark

6 R710 RES,CHIP,MAKER ERHZ0000486 47 Kohm,1/16W ,J ,1005 ,R/TP

6 R711 RES,CHIP,MAKER ERHZ0000406 100 Kohm,1/16W ,J ,1005 ,R/TP

6 R712 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R716 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R718 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R719 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R720 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R721 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R722 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R723 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R724 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R725 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R726 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R727 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 R728 RES,CHIP,MAKER ERHZ0000401 0 ohm,1/16W ,J ,1005 ,R/TP

6 RA400 RES,ARRAY,R ERNR0000404 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP

6 SPFY01 PCB,MAIN SPFY0108901 FR-4 ,1 mm,STAGGERED-10 ,IVH(3-8), JOY

6 U200 IC EUSY0317101 WQFN ,10 PIN,R/TP ,1.8*1.4*0.75

6 U203 IC EUSY0250501 SC70 ,5 PIN,R/TP ,Comparator, pin compatible to

EUSY0077701

6 U205 FILTER,EMI/POWER SFEY0006501 SMD ,3 TERMINAL EMI FILTER

6 U207 IC EUSY0333701 TLLGA ,8 PIN,R/TP ,OVP

6 U301 IC EUSY0223006 HVSOF5 ,5 PIN,R/TP ,1.8V ,150mA LDO

6 U306 IC EUSY0232802 sot 23-5 ,5 PIN,R/TP ,2.8V,150mA LDO

6 U402 IC EUSY0200301 Leadless chip ,6 PIN,R/TP ,Hall S/W, Pb Free

6 U403 IC EUSY0254201 DFN ,12 PIN,R/TP ,Dual SPDT Analog Switch(Pb Free)

6 U404 IC EUSY0270601 Microarray ,49 PIN,R/TP ,Key Scan Controller(up to 72

keys), Pb Free

6 U406 IC EUSY0317101 WQFN ,10 PIN,R/TP ,1.8*1.4*0.75

6 U508 IC EUSY0246002 QFN ,48 PIN,R/TP ,UMTS-1900/-2100 and GPS RF

Receiver IC

6 U700 IC EUSY0306301 BCCS ,84 PIN,R/TP ,PMIC(MSMC 1.375V) (Rev.M), Pb

Free

6 U701 IC EUSY0297301 11*14*1.2 ,225 PIN,R/TP ,NAND(90nm), DRAM(90nm)

6 VA202 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005

6 VA203 VARISTOR SEVY0004001 18 V, ,SMD ,3pF, 1005

6 VA204 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA205 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA206 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

LGE Internal Use Only

Only for training and service purposes

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 245 -

Level Location

No Part Name Part Number Spec Color Remark

6 VA207 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA400 VARISTOR SEVY0000702 14 V,10% ,SMD ,

6 VA401 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA402 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA403 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA404 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA405 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA406 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 VA407 VARISTOR SEVY0001001 14 V, ,SMD ,50pF, 1005

6 X200 OSCILLATOR EXSY0022103

27 MHz,50 PPM,15 pF,SMD ,3.2*2.5*1.0 ,2.3V ~ 3.2V, -

20'C ~ +70'C ,; ,27MHz ,50PPM ,2.8V ,3.2 ,2.5 ,1.0 ,

,SMD ,R/TP

6 X500 VCTCXO EXSK0007801

19.2 MHz,2 PPM,10 pF,SMD ,3.3*2.5*1.0 ,2ppm at -

30~+85, AFC 0.4V~2.4V, 2.8V ,; ,19.2MHz ,2PPM ,2.8V

,3.3mm ,2.5mm ,1.0mm , ,SMD ,R/TP

6 X700 X-TAL EXXY0018701 32.768 KHz,20 PPM,12.5 pF,70 Kohm,SMD ,3.2*1.5*0.9

6 ZD1 DIODE,TVS EDTY0009401 VMN2 ,5 V,10 W,R/TP ,1.0*0.6*0.4 ,; , ,7.82V , , ,100mW

,[empty] ,[empty] ,2P ,1

LGE Internal Use Only

Only for training and service purposes

11.3 Accessory Note: This Chapter is used for reference, Part order

is ordered by SBOM standard on GCSC

Level Location

No Part Name Part Number Spec Color Remark

3 ADEY00 DATA KIT ADEY0009701 KS10 CD Ass'y for Italy Without Color

4 MCHZ00 COMPACT DISK MCHZ0036101 COMPLEX, (empty), , , , , SILVER

SNOW

4 MEAY00 ENVELOPE MEAY0000401 PRINTING, (empty), , , , , Without Color

3 SBPP00 BATTERY PACK,LI-

POLYMER SBPP0021101

3.7 V,950 mAh,1 CELL,PRISMATIC ,KS10 ITAML Batt,

Europe Label, Pb-Free ,; ,3.7 ,950 ,0.2C ,PRISMATIC

,59x38x37 , ,BLACK ,Hardpack ,Europe Label

Metal Black

3 SDGY00 DATA CABLE SGDY0010901 LG-US03K ,18pin USB DataCable

3 SGEY00 EAR PHONE/EAR MIKE

SET SGEY0005516 GSM FORDER ,KG320(C2EAR PHONE)

3 SSAD00 ADAPTOR,AC-DC SSAD0021002 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

 ADAPTOR,AC-DC SSAD0021001 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

 ADAPTOR,AC-DC SSAD0021004 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

 ADAPTOR,AC-DC SSAD0021005 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

 ADAPTOR,AC-DC SSAD0021006 100-240V ,5060 Hz,4.8 V,0.9 A,CB & CE ,18pin plug

 ADAPTOR,AC-DC SSAD0021008 100-240V ,5060 Hz,4.8 V,0.9 A,CE&CB ,18pin Plug ,; , , ,

, , ,[empty] ,I/O CONNECTOR ,

11. EXPLODED VIEW & REPLACEMENT PART LIST

- 246 -

Note

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