MT7682 HDKs' Stamp Module Layout Guide HDK
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Page Count: 17
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1. Introduction
2. PCB Specifications
2.1. PCB stack-up
2.2. PCB design rules
2.3. Layers
3. Layout
3.1. Component placement
3.2. 4 Layer PCB design
3.2.1. Layer 1
3.2.2. Layer 2
3.2.3. Layer 3
3.2.4. Layer 4
4. Layout Guidelines
4.1. RF section
4.1.1. RF component placement and routing
4.1.2. Antenna placement and routing
4.1.3. Transmission line
4.2. Power section
4.3. Clock section
4.3.1. 26MHz XTAL
4.3.2. 32.768kHz XTAL
4.4. Digital I/O
4.5. QFN Ground
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