OSD335X One Page Overview
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OSD335x Family Rev. 3 2/29/2016 Introduction The OSD335x Family of System-InPackage (SIP) products are building blocks designed to allow easy and cost-effective implementation of systems based on Texas Instruments’ powerful Sitara™ AM335x line of processors. The OSD335x integrates the AM335x along with the TI TPS65217C PMIC, the TI TL5209 LDO, up to 1 Gigabyte of DDR3 Memory, and over 140 resistors, capacitors, and inductors all into a single design-in-ready package. With this level of integration the OSD335x Family of SIPs allows designers to focus on the key aspects of their system without spending time on the complicated highspeed design of the processor/DDR3 interface. It also reduces the overall size and complexity of the design. The OSD335x can significantly decrease the time to market for AM335x-based products. Features TI AM335x, TPS65217C, TL5209, DDR3, and over 140 Passive components integrated into a single package TI AM335x Features: o ARM® Cortex®-A8 up to 1GHz o 8 channel 12-bit SAR ADC o Ethernet 10/100/1000 x 2 o USB 2.0 HS OTG + PHY x2 o MMC, SD and SDIO x2 o LCD Controller and 3D Graphics Engine Access to All AM335x GPIOs and Peripherals Up to 1GB DDR3 PWR In from USB or Li-Ion Battery PWR Out: 1.8V, 3.3V and SYS Figure 1. OSD335X Block Diagram Benefits Integrates over 140 Components into one Compatible with AM335x Development tools and software Wide BGA ball pitch allows for lowcost assembly. Significantly Reduces Design Time Decreases Layout Complexity Saves board space Increased Reliability through reduced number of components Power Savings shorter signal trace lengths, reduced parasitics, 400 Ball BGA (20 X 20) 1.27mm pitch 27mm X 27mm package size Temp Range: 0 to 90°C For More Information Contact Octavo Systems at osd335@octavosystems.com Octavo Systems LLC www.octavosystems.com
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