OSD335X One Page Overview
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OSD335x Family
Rev. 3 2/29/2016
Octavo Systems LLC
www.octavosystems.com
Introduction
The OSD335x Family of System-In-
Package (SIP) products are building blocks
designed to allow easy and cost-effective
implementation of systems based on Texas
Instruments’ powerful Sitara™ AM335x line
of processors. The OSD335x integrates the
AM335x along with the TI TPS65217C
PMIC, the TI TL5209 LDO, up to 1 Gigabyte
of DDR3 Memory, and over 140 resistors,
capacitors, and inductors all into a single
design-in-ready package.
With this level of integration the OSD335x
Family of SIPs allows designers to focus on
the key aspects of their system without
spending time on the complicated high-
speed design of the processor/DDR3
interface. It also reduces the overall size
and complexity of the design. The
OSD335x can significantly decrease the
time to market for AM335x-based products.
Features
TI AM335x, TPS65217C, TL5209,
DDR3, and over 140 Passive
components integrated into a single
package
TI AM335x Features:
o ARM® Cortex®-A8 up to 1GHz
o 8 channel 12-bit SAR ADC
o Ethernet 10/100/1000 x 2
o USB 2.0 HS OTG + PHY x2
o MMC, SD and SDIO x2
o LCD Controller and 3D Graphics
Engine
Access to All AM335x GPIOs and
Peripherals
Up to 1GB DDR3
PWR In from USB or Li-Ion Battery
PWR Out: 1.8V, 3.3V and SYS
Benefits
Integrates over 140 Components
into one
Compatible with AM335x
Development tools and software
Wide BGA ball pitch allows for low-
cost assembly.
Significantly Reduces Design Time
Decreases Layout Complexity
Saves board space
Increased Reliability through
reduced number of components
Power Savings
shorter signal trace lengths,
reduced parasitics,
400 Ball BGA (20 X 20)
1.27mm pitch
27mm X 27mm package size
Temp Range: 0 to 90°C
For More Information
Contact Octavo Systems at
osd335@octavosystems.com
Figure 1. OSD335X Block Diagram
