TO 252 2 Leaded Package Dimensions
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TO-252 2 LEAD SURFACE MOUNT JEDEC TO-252 PLASTIC PACKAGE (FOR RECTIFIERS ONLY) A E H1 INCHES A1 b2 SEATING PLANE D 1 L 2 b1 b L1 c e1 J1 TERM. 3 L3 0.265 (6.7) b3 MAX MIN MAX A 0.086 0.094 2.19 2.38 NOTES - A1 0.018 0.022 0.46 0.55 3, 4 b 0.028 0.032 0.72 0.81 3, 4 b1 0.033 0.040 0.84 1.01 3 b2 0.205 0.215 5.21 5.46 3, 4 b3 0.190 - 4.83 - 2 c 0.018 0.022 0.46 0.55 3, 4 - D 0.270 0.290 6.86 7.36 E 0.250 0.265 6.35 6.73 0.180 BSC 4.57 BSC 6 H1 0.035 0.045 0.89 1.14 - J1 0.040 0.045 1.02 1.14 - L 0.100 0.115 2.54 2.92 - L1 0.020 - 0.51 - 3, 5 L3 0.170 - 4.32 - 2 NOTES: 1. No current JEDEC outline for this package. 2. L3 and b3 dimensions establish a minimum mounting surface for terminal 3. 3. Dimension (without solder). 4. Add typically 0.002 inches (0.05mm) for solder plating. 5. L1 is the terminal length for soldering. 6. Position of lead to be measured 0.090 inches (2.28mm) from bottom of dimension D. 7. Controlling dimension: Inch. 8. Revision 8 dated 5-99. 0.070 (1.8) 0.118 (3.0) BACK VIEW 0.063 (1.6) TYP 0.090 (2.3) TYP MINIMUM PAD SIZE RECOMMENDED FOR SURFACE-MOUNTED APPLICATIONS ©2002 Fairchild Semiconductor Corporation MIN e1 0.265 (6.7) MILLIMETERS SYMBOL 1 February 2002, Rev A
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File Type : PDF File Type Extension : pdf MIME Type : application/pdf PDF Version : 1.4 Linearized : Yes Create Date : 2002:02:11 21:39:52Z Modify Date : 2002:02:11 17:18:21-08:00 Page Count : 1 Creation Date : 2002:02:11 21:39:52Z Mod Date : 2002:02:11 17:18:21-08:00 Producer : Acrobat Distiller 5.0 (Windows) Author : Metadata Date : 2002:02:11 17:18:21-08:00 Creator : Title : TO-252 2 Leaded Package DimensionsEXIF Metadata provided by EXIF.tools