TO 252 2 Leaded Package Dimensions

User Manual:

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1

©2002 Fairchild Semiconductor Corporation February 2002, Rev A

b2

E

D

L3

b1

b

12

A

L

c

SEATING

BACK VIEW

H1A1

b3

e1J1

L1

TERM. 3 0.265

MINIMUM PAD SIZE RECOMMENDED FOR

SURFACE-MOUNTED APPLICATIONS

(6.7)

0.265 (6.7

)

0.070 (1.8)

0.118 (3.0)

0.063 (1.6) TYP

0.090 (2.3) TYP

PLANE

SYMBOL

INCHES MILLIMETERS

NOTESMIN MAX MIN MAX

A 0.086 0.094 2.19 2.38 -

A10.018 0.022 0.46 0.55 3, 4

b 0.028 0.032 0.72 0.81 3, 4

b10.033 0.040 0.84 1.01 3

b20.205 0.215 5.21 5.46 3, 4

b30.190 - 4.83 - 2

c 0.018 0.022 0.46 0.55 3, 4

D 0.270 0.290 6.86 7.36 -

E 0.250 0.265 6.35 6.73 -

e10.180 BSC 4.57 BSC 6

H10.035 0.045 0.89 1.14 -

J10.040 0.045 1.02 1.14 -

L 0.100 0.115 2.54 2.92 -

L10.020 - 0.51 - 3, 5

L30.170 - 4.32 - 2

NOTES:

1. No current JEDEC outline for this package.

2. L3 and b3 dimensions establish a minimum mounting surface for

terminal 3.

3. Dimension (without solder).

4. Add typically 0.002 inches (0.05mm) for solder plating.

5. L1 is the terminal length for soldering.

6. Position of lead to be measured 0.090 inches (2.28mm) from bottom

of dimension D.

7. Controlling dimension: Inch.

8. Revision 8 dated 5-99.

TO-252

2 LEAD SURFACE MOUNT JEDEC TO-252 PLASTIC PACKAGE

(FOR RECTIFIERS ONLY)