UltraScale FPGA Product Tables And Selection Guide Ultra Scale FPGAs

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Kintex® UltraScale™ FPGAs
Logic Resources

Memory Resources

Clock Resources

I/O Resources

Integrated IP
Resources

Speed Grades

Footprint
Compatible with
Virtex® UltraScale
Devices

Device Name
System Logic Cells (K)
CLB Flip-Flops
CLB LUTs
Maximum Distributed RAM (Kb)
Block RAM/FIFO w/ECC (36Kb each)
Block RAM/FIFO (18Kb each)
Total Block RAM (Mb)
CMT (1 MMCM, 2 PLLs)
I/O DLL
Maximum Single-Ended HP I/Os
Maximum Differential HP I/O Pairs
Maximum Single-Ended HR I/Os
Maximum Differential HR I/O Pairs
DSP Slices
System Monitor
PCIe® Gen1/2/3
Interlaken
100G Ethernet
16.3Gb/s Transceivers (GTH/GTY)
Commercial
Extended
Industrial
Package
Package Dimensions
Footprint(3, 4, 5, 6)
(mm)
A784(7)
23x23(8)
A676(7)
27x27
A900(7)
31x31
A1156
35x35
A1517
40x40
C1517
40x40
D1517
40x40
B1760
42.5x42.5
A2104
47.5x47.5
B2104
47.5x47.5
D1924
45x45
F1924
45x45

KU025(1)
318
290,880
145,440
4,230
360
720
12.7
6
24
208
96
104
48
1,152
1
1
0
0
12
-1
-2
-1 -2

KU035
444
406,256
203,128
5,908
540
1,080
19.0
10
40
416
192
104
48
1,700
1
2
0
0
16
-1
-2 -3
-1 -1L -2

KU040
530
484,800
242,400
7,050
600
1,200
21.1
10
40
416
192
104
48
1,920
1
3
0
0
20
-1
-2 -3
-1 -1L -2

KU060
726
663,360
331,680
9,180
1,080
2,160
38.0
12
48
520
240
104
48
2,760
1
3
0
0
32
-1
-2 -3
-1 -1L -2

KU085
1,088
995,040
497,520
13,770
1,620
3,240
56.9
22
56
572
264
104
56
4,100
2
4
0
0
56
-1
-2 -3
-1 -1L -2

KU095
1,176
1,075,200
537,600
4,800
1,680
3,360
59.1
16
64
650
288
52
24
768
1
4
2
2
64(2)
-1
-2
-1 -2

HR I/O, HP I/O, GTH/GTY

104, 208, 12

104, 364, 8
104, 208, 16
104, 364, 16
104, 416, 16

104, 364, 8
104, 208, 16
104, 364, 16
104, 416, 20

104, 416, 28
104, 520, 32

52, 468, 28
104, 520, 48

104, 520, 48
52, 468, 40

104, 572, 44

52, 650, 48
52, 650, 64

104, 520, 56

Notes:
1. Certain advanced configuration features are not supported in the KU025. Refer to the Configuring FPGAs section in DS890, UltraScale Architecture and Product Overview.
2. GTY transceivers in KU095 devices support data rates up to 16.3Gb/s.
3. Packages with the same package footprint designator, e.g., A2104, are footprint compatible with all other UltraScale devices with the same sequence. See the migration table for details on inter-family migration.
4. Maximum achievable performance is device and package dependent; consult the associated data sheet for details.
5. For full part number details, see the Ordering Information section in DS890, UltraScale Architecture and Product Overview.
6. See UG575, UltraScale Architecture Packaging and Pinouts User Guide for more information.
7. GTH transceivers in A784, A676, and A900 packages support data rates up to 12.5Gb/s.
8. 0.8mm ball pitch. All other packages listed 1mm ball pitch.

Page 2

KU115
1,451
1,326,720
663,360
18,360
2,160
4,320
75.9
24
64
676
312
156
72
5,520
2
6
0
0
64
-1
-2 -3
-1 -1L -2

© Copyright 2013–2016 Xilinx
.

104, 234, 64
104, 598, 52
156, 676, 52
104, 598, 64
156, 676, 52
104, 624, 64

Virtex® UltraScale™ FPGAs
Logic Resources

Memory Resources

Clock Resources

I/O Resources

Integrated IP
Resources

Speed Grades

Footprint
Compatible with
Kintex® UltraScale
Devices

Device Name
System Logic Cells (K)
CLB Flip-Flops
CLB LUTs
Maximum Distributed RAM (Kb)
Block RAM/FIFO w/ECC (36Kb each)
Block RAM/FIFO (18Kb each)
Total Block RAM (Mb)
CMT (1 MMCM, 2 PLLs)
I/O DLL
Transceiver Fractional PLL
Maximum Single-Ended HP I/Os
Maximum Differential HP I/O Pairs
Maximum Single-Ended HR I/Os
Maximum Differential HR I/O Pairs
DSP Slices
System Monitor
PCIe® Gen1/2/3
Interlaken
100G Ethernet
GTH 16.3Gb/s Transceivers
GTY 30.5Gb/s Transceivers
Commercial
Extended
Industrial
Package
Package Dimensions
Footprint(1, 2, 3)
(mm)
C1517
D1517
B1760
A2104
B2104
C2104
B2377
A2577
A2892

40x40
40x40
42.5x42.5
47.5x47.5
47.5x47.5
47.5x47.5
50x50
52.5x52.5
55x55

XCVU065
783
716,160
358,080
4,830
1,260
2,520
44.3
10
40
5
468
216
52
24
600
1
2
3
3
20
20
–
-1H -2 -3
-1 -2

XCVU080
975
891,424
445,712
3,980
1,421
2,842
50.0
16
64
8
780
360
52
24
672
1
4
6
4
32
32
–
-1H -2 -3
-1 -2

XCVU095
1,176
1,075,200
537,600
4,800
1,728
3,456
60.8
16
64
8
780
360
52
24
768
1
4
6
4
32
32
–
-1H -2 -3
-1 -2

XCVU125
1,567
1,432,320
716,160
9,660
2,520
5,040
88.6
20
80
10
780
360
52
24
1,200
2
4
6
6
40
40
–
-1H -2 -3
-1 -2

XCVU160
2,027
1,852,800
926,400
12,690
3,276
6,552
115.2
28
120
13
650
300
52
24
1,560
3
4
8
9
52
52
–
-1H -2 -3
-1 -2

XCVU190
2,350
2,148,480
1,074,240
14,490
3,780
7,560
132.9
30
120
15
650
300
52
24
1,800
3
6
9
9
60
60
–
-1H -2 -3
-1 -2

HR I/O, HP I/O, GTH 16.3Gb/s, GTY 30.5Gb/s
52, 468, 20, 20

52, 468, 20, 20
52, 286, 32, 32
52, 650, 32, 16
52, 780, 28, 24
52, 650, 32, 32

52, 468, 20, 20
52, 286, 32, 32
52, 650, 32, 16
52, 780, 28, 24
52, 650, 32, 32
52, 364, 32, 32

52, 286, 40, 32
52, 650, 36, 16
52, 780, 28, 24
52, 650, 40, 36
52, 364, 40, 40

52, 650, 40, 36
52, 364, 52, 52

52, 650, 40, 36
52, 364, 52, 52
52, 1248, 36, 0
0, 448, 60, 60
52, 1404, 48, 0

Notes:
1. Packages with the same package footprint designator, e.g., A2104, are footprint compatible with all other UltraScale devices with the same sequence. See the migration table for details on inter-family migration.
2. For full part number details, see the Ordering Information section in DS890, UltraScale Architecture and Product Overview.
3. See UG575, Kintex UltraScale and Virtex UltraScale FPGAs Packaging and Pinouts User Guide for more information.

Page 3

XCVU440
5,541
5,065,920
2,532,960
28,710
2,520
5,040
88.6
30
120
0
1,404
648
52
24
2,880
3
6
0
3
48
0
-1
-2 -3
-1 -2

© Copyright 2013–2016 Xilinx
.

UltraScale Device Ordering Information

Footprint

XC V U ###
Xilinx
Commercial

V: Virtex UltraScale
K: Kintex

Value Index

-1
Speed Grade
-1 = Slowest
-L1 = Low Power
(Kintex only)

-H1 = Slowest or Mid

F

L

V A #### C

F: Flip-Chip F: Lid
V: RoHS 6/6 Package
(1.0mm)
L: Lid SSI
G: RoHS 6/6 Designator
S: Flip-Chip B: Lidless w/exemption 15
(0.8mm)

Package
Pin Count

Temperature
Grade
(C, E, I)

(Virtex only)

-2 = Mid
-3 = Fastest

C = Commercial (Tj = 0°C to +85°C)
E = Extended (Tj = 0°C to +100°C)
I = Industrial (Tj = –40°C to +100°C)

For valid part/package combinations,
go to DS890, UltraScale Architecture and Product Overview: Device-Package Combinations and Maximum I/Os Tables

Important: Verify all data in this document with the device data sheets found at www.xilinx.com
Page 4

© Copyright 2013–2016 Xilinx
.

UltraScale™ Device Footprint Compatibility
HR I/O, HP I/O, GTH 16.3Gb/s; GTY 30.5Gb/s
Package
Dimensions
(mm)

23x23

27x27

31x31

35x35

Package
Footprint

A784

A676

A900

A1156

XCKU025

23mm–42.5mm
40x40
A1517

C1517

42.5x42.5
D1517

B1760

104, 208, 12, 0

XCKU035 104, 364, 8, 0 104, 208, 16, 0 104, 364, 16, 0 104, 416, 16, 0
XCKU040 104, 364, 8, 0 104, 208,16, 0 104, 364, 16, 0 104, 416, 20, 0
XCKU060

104, 416, 28, 0 104, 520, 32, 0

XCKU085

N/A

104, 520, 48, 0

XCKU095

52, 468, 20, 8(1)

N/A

52, 468, 20, 20(1)

104, 520, 48, 0

N/A

XCKU115
XCVU065
XCVU080

104, 572, 44, 0

52, 468, 20, 20

52, 650, 32, 16(1)
104, 234, 64, 0 104, 598, 52, 0
N/A

N/A

52, 468, 20, 20 52, 286, 32, 32 52, 650, 32, 16

Footprint compatibility is
indicated by shading per column.

XCVU095

52, 468, 20, 20 52, 286, 32, 32 52, 650, 32, 16

XCVU125

52, 286, 40, 32 52, 650, 36, 16

Notes:
1. GTY transceivers in KU095 devices support data rates up to 16.3Gb/s. Refer to data sheet for details.

Important: Verify all data in this document with the device data sheets found at www.xilinx.com
Page 5

© Copyright 2013–2016 Xilinx
.

UltraScale™ Device Footprint Compatibility

45mm–55mm

HR I/O, HP I/O, GTH 16.3Gb/s; GTY 30.5Gb/s
Package
Dimensions
(mm)
Package
Footprint

45x45

D1924

47.5x47.5

F1924

A2104

B2104

C2104

50x50

52.5x52.5

55x55

B2377

A2577

A2892

XCKU035
XCKU040
XCKU060
XCKU085

104, 520, 56, 0

XCKU095

N/A

XCKU115

156, 676, 52, 0

104, 624, 64, 0

52, 650, 32, 32(1)
156, 676, 52, 0

104, 598, 64, 0

XCVU065

N/A

N/A

XCVU080

52, 780, 28, 24

52, 650, 32, 32

XCVU095

52, 780, 28, 24

52, 650, 32, 32

52, 364, 32, 32

XCVU125

52, 780, 28, 24

52, 650, 40, 36

52, 364, 40, 40

52, 650, 40, 36

52, 364, 52, 52

52, 650, 40, 36

52, 364, 52, 52

XCVU160
XCVU190

Footprint compatibility is
indicated by shading per column.

XCVU440

0, 448, 60, 60
52, 1248, 36, 0

52, 1404, 48, 0

Notes:
Important: Verify all data in this document with the device data sheets found at www.xilinx.com
1.
GTY transceivers in KU095 devices support data rates up to 16.3Gb/s. Refer to data sheet for details.
Page 6
© Copyright 2013–2016 Xilinx
.

UltraScale Architecture Migration Table
UltraScale and UltraScale+ families provide footprint compatibility to enable users to migrate designs from one
device or family to another. Any two packages with the same footprint identifier code are footprint compatible.
Kintex® UltraScale™
Pkg

Kintex UltraScale+™

Virtex® UltraScale

Virtex UltraScale+

mm
KU025 KU035 KU040 KU060 KU085 KU095 KU115 KU3P KU5P KU9P KU11P KU13P KU15P VU065 VU080 VU095 VU125 VU160 VU190 VU440 VU3P VU5P VU7P VU9P VU11P VU13P

A784

23

B784

23

A676

27

B676

27

A900

31

D900

31

E900

31

A1156

35

A1517

40

C1517

40

D1517

40

E1517

40

A1760

42.5

B1760

42.5

E1760

42.5

D1924

45

F1924

45

A2104

47.5(1)

B2104

47.5(1)

C2104

47.5(1)

B2377

50

A2577

52.5

A2892

55

X

X

X

X

X

X

X

X

X

X

X

X

X
X

X

X

X

X
X

X
X

X
X

X

X
X

X
X
X

X

X

X

X

X

X

X

X

X

X
X

X

X

X
X
X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X
X
X

Notes:
1.
The body size of the VU13P device in the A2104, B2104, and C2104 packages is 52.5mm. These packages are footprint compatible with the corresponding 47.5mm body size packages.
See UG583, UltraScale Architecture PCB Design User Guide for important migration details.

Legend
Device
Migration Path

Page 7

© Copyright 2013–2016 Xilinx
.

Digital Signal Processing Metrics
UltraScale architecture further enhances the Xilinx DSP48 slice with features designed to allow users to
do more calculations in fewer DSP resources, enhancing both device utilization and performance.
Examples include wider multipliers for floating point calculations, wide XOR functions for ECC, CRC, and
EFEC, and pre-adder squaring for rounding algorithms.
DSP Slice Count

XCKU025
XCKU035
XCKU040
XCKU060
XCKU085
XCKU095
XCKU115
XCVU065
XCVU080
XCVU095
XCVU125
XCVU160
XCVU190
XCVU440

1152
1700
1920
2760
4100
768
5520
600
672
768
1200
1560
1800

Speed grade
FMAX [MHz]
Max GMAC/s

2880

-1
594
6558

-2
661
7297

For more information, refer to: UG579, UltraScale Architecture DSP Slice User Guide
Important: Verify all data in this document with the device data sheets found at www.xilinx.com
Page 8

© Copyright 2013–2016 Xilinx
.

-3
741
8181

Block RAM Metrics
UltraScale architecture block RAM adds new features to increase performance, device utilization, and
power efficiency. These new features are designed to provide highly efficient solutions for applications in
the Wireless, Wired, Video, and Signal Processing markets by offering hardened memory cascade to
reduce fabric use and increase performance, and flexible hard FIFO and user accessible dynamic power
control to reduce power.
XCKU025
XCKU035
XCKU040
XCKU060
XCKU085
XCKU095
XCKU115
XCVU065
XCVU080
XCVU095
XCVU125
XCVU160
XCVU190
XCVU440

Block RAM Capacity (Mb)

13

19
21
38
57
59
76
44
50

61
89
115
133
89

Speed grade
-1
-2
-3
True dual-port Block RAM FMAX [MHz]
525
585
660
For more information, refer to: UG573, UltraScale Architecture Memory Resources User Guide
Important: Verify all data in this document with the device data sheets found at www.xilinx.com
Page 9

© Copyright 2013–2016 Xilinx
.

High-Speed Serial Transceivers
For high bandwidth applications, including 500Gb/s, 400Gb/s, and 100Gb/s line cards, serial data transmission
across backplanes and longer distances is becoming increasingly important. UltraScale architecture serial
transceivers include the proven on-chip circuits required to provide optimal signal integrity in real world
environments, at data rates up to 16.3Gb/s (GTH) and 30.5Gb/s (GTY).
Total Transceiver Count

XCKU025
XCKU035
XCKU040

GTH = 16.3Gb/s
GTY = 30.5Gb/s

12
16

GTY

20

XCKU060

32

XCKU085

56

XCKU095

32(1)
64

32

XCKU115
XCVU065

GTH

20

20

XCVU080

32

32

XCVU095
XCVU125

32

32
40

40

XCVU160

52
60

XCVU190
XCVU440

52
60

48

For more information, refer to UG576, UltraScale Architecture GTH Transceivers User Guide and UG578, UltraScale Architecture GTY Transceivers User Guide
Notes:
1. GTY up to 16.3Gb/s. Refer to data sheet for details.
Page 10

Important: Verify all data in this document with the device data sheets found at www.xilinx.com

© Copyright 2013–2016 Xilinx
.

Transceiver Aggregate Bandwidth
For high bandwidth applications, including 500Gb/s, 400Gb/s, and 100Gb/s line cards, serial data transmission
across backplanes and longer distances is becoming increasingly important. UltraScale architecture serial
transceivers include the proven on-chip circuits required to provide optimal signal integrity in real world
environments, at data rates up to 16.3Gb/s (GTH) and 30.5Gb/s (GTY).
Transceiver Aggregate Bandwidth (Gb/s)
XCKU025 391
XCKU035 522
XCKU040
652
XCKU060

GTY

1826
1043(1)

1043

2086

XCKU115
XCVU065

GTH

1043

XCKU085
XCKU095

GTH = 16.3Gb/s
GTY = 30.5Gb/s

652

1220

XCVU080

1043

1952

XCVU095
XCVU125

1043
1304

1952

XCVU160
XCVU190
XCVU440

2440
1695
1956

3172
3660

1565

Transceiver Aggregate Bandwidth (Gb/s) = # of Transceivers x Maximum Line Rate x 2 (Full Duplex)
For more information, refer to UG576, UltraScale Architecture GTH Transceivers User Guide and UG578, UltraScale Architecture GTY Transceivers User Guide
Notes:
1. GTY up to 16.3Gb/s. Refer to data sheet for details.
Page 11

Important: Verify all data in this document with the device data sheets found at www.xilinx.com

© Copyright 2013–2016 Xilinx
.

References

DS890, UltraScale Architecture and Product Overview
DS892, Kintex UltraScale FPGA Data Sheet: DC and AC Switching Characteristics
DS893, Virtex UltraScale FPGA Data Sheet: DC and AC Switching Characteristics
UG570, UltraScale Architecture Configuration User Guide
UG571, UltraScale Architecture SelectIO Resources User Guide
UG572, UltraScale Architecture Clocking Resources User Guide
UG573, UltraScale Architecture Memory Resources User Guide
UG574, UltraScale Architecture Configurable Logic Block User Guide

UG575, Kintex UltraScale and Virtex UltraScale FPGAs Packaging and Pinout User Guide
UG576, UltraScale Architecture GTH Transceivers User Guide
UG578, UltraScale Architecture GTY Transceivers User Guide
UG579, UltraScale Architecture DSP Slice User Guide
UG580, UltraScale Architecture System Monitor User Guide
UG583, UltraScale Architecture PCB and Pin Planning User Guide
PG150, LogiCORE IP UltraScale Architecture-Based FPGAs Memory Interface Solutions
Important: Verify all data in this document with the device data sheets found at www.xilinx.com
Page 12

© Copyright 2013–2016 Xilinx
.

XMP102 (v1.7)



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Keywords                        : UltraScale FPGA, Kintex UltraScale, Virtex UltraScale, Product Tables, Product Selection Guide, XMP102
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