WMOi3 UG 10

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June 2000/ version 1.0
WMOi3 Integrated Modem

Version :

1.0

Date :

June 2000

Reference :

WMOi3 user’s guide

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without prior written agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut
être communiqué ou divulgué à des tiers sans son autorisation préalable.

June 2000/ version 1.0
WMOi3 Integrated Modem

Level/
Indice
0.2

Date/
Date
June
2000

History of the evolution /
Historique des évolutions
Creation and Correction

Name / Nom
Written
by
/ B.Zenou
Rédigé par
Validated
by / D. MARTINEZ
Validé par
Approved by / P.Calvez
Approuvé par

Function /
Fonction
Product Marketing

Date/
Date
June
2000
Modem
Support June
Engineer
2000
Product
Marketing June
Senior Manager
2000

Writer / Rédacteur
P.
Calvez,
S.
Dechicha F. Doherier,
T.
Lapousterle,
M.Nau, D. Martinez,
B. Zenou
Signature/
Signature

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June 2000/ version 1.0
WMOi3 Integrated Modem

WMOi3 User’s Guide
Hardware Specifications

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June 2000/ version 1.0
WMOi3 Integrated Modem

Contents
1

Introduction to the WMOi3: outstanding assets.......................... 7

1.1

Scope of the user’s guide........................................................................ 7

1.2
1.2.1
1.2.2
1.2.3
1.2.4
1.2.5

General characteristics ............................................................................ 8
General ................................................................................................... 8
Electrical ................................................................................................. 8
Physical................................................................................................... 8
Basic Features......................................................................................... 8
Interfaces ................................................................................................ 9

1.3

Mechanical Design Overview ................................................................ 10

Safety precautions ..................................................................... 12

2.1
2.1.1
2.1.2
2.1.3
2.1.4

RF safety............................................................................................... 12
General ................................................................................................. 12
Exposure to RF energy .......................................................................... 12
Efficient modem operation..................................................................... 12
Antenna care and replacement.............................................................. 13

2.2
2.2.1
2.2.2
2.2.3
2.2.4
2.2.5
2.2.6
2.2.7
2.2.8

General safety ....................................................................................... 13
Driving .................................................................................................. 13
Electronic devices.................................................................................. 13
Vehicle electronic equipment................................................................. 13
Medical electronic equipment................................................................ 13
Aircraft .................................................................................................. 13
Children ................................................................................................ 14
Blasting areas ....................................................................................... 14
Potentially explosive atmospheres......................................................... 14

2.3

Safety standards ................................................................................... 14

Standard Compliance ................................................................. 15

3.1

GSM compliance................................................................................... 15

3.2
FTA Compliance.................................................................................... 16
3.2.1 IMEI Number......................................................................................... 16
3.2.2 CE Label ................................................................................................ 16
4

Hardware Interfaces................................................................... 17

4.1
4.1.1
4.1.2
4.1.3
4.1.4
4.1.5
4.1.6

Interfaces on the 50-pin general purpose connector............................. 17
The 50-pin connector description .......................................................... 17
Power supply ........................................................................................ 21
Serial link .............................................................................................. 22
ON / ~OFF ............................................................................................. 23
BOOT .................................................................................................... 25
Reset signal (~RST)............................................................................... 26

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June 2000/ version 1.0
WMOi3 Integrated Modem
4.1.7 General Purpose Input/Output ............................................................... 27
4.1.8 Analog to Digital Converter ................................................................... 28
4.1.9 Audio Interface...................................................................................... 29
4.1.10
SIM interface................................................................................... 33
4.1.11
SPI bus............................................................................................ 35
4.1.12
Keypad interface.............................................................................. 35
4.2
RF Interface........................................................................................... 37
4.2.1 RF connector ......................................................................................... 37
4.2.2 RF performances ................................................................................... 37
4.3

SIM interface ........................................................................................ 37

Connector Supplier and Peripheral devices................................ 38

5.1
Where to find the SMD connectors ...................................................... 38
5.1.1 GSM Antenna ....................................................................................... 39
5.1.2 The SIM card holder.............................................................................. 40
6

Climatic and mechanical environment ....................................... 41

Application examples ................................................................. 42

General guidelines for the use of the WMOi3............................. 43

8.1
8.1.1
8.1.2
8.1.3
8.1.4

Key information..................................................................................... 43
Hardware and RF .................................................................................. 43
The Antenna ......................................................................................... 43
Firmware upgrade................................................................................. 43
Getting started ...................................................................................... 44

8.2

AT command list................................................................................... 45

Index .......................................................................................... 50

Acronyms and Abbreviations ..................................................... 52

Reference documents ................................................................ 53

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June 2000/ version 1.0
WMOi3 Integrated Modem

Cautions:
Information furnished herein by Wavecom are accurate and reliable. However no
responsibility is assumed for its use.
Please read carefully Safety precautions
If you have any technical questions regarding this document or the product
described, please contact your distributor
General information about Wavecom and its range of products is available at the
following internet address: http://www.wavecom.com
Trademarks
Some mentioned
companies

products

are

registered

trademarks

their

respective

Copyright
The WMOi3 user’s guide is copyrighted by Wavecom SA with all rights
reserved. No part of this user’s guide may be produced in any form without the
prior written permission of
Wavecom SA.
No patent liability is assumed with respect to the use of the information
contained herein.

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June 2000/ version 1.0
WMOi3 Integrated Modem

1 Introduction
assets

the

WMOi3:

outstanding

WMOi3 integrated modem provides a quick and easy way to plug in GSM
functionality to systems and terminals. Available in dual-band configurations, this
full type approved integrated modem constitutes self-contained, fully integrated
implementations of the GSM standard.
Smallest on the market, light, state-of-the-art designed and energy efficient, the
WMOi3 incorporates one of the smallest module in the world.
The WMOi3 will be GPRS and WAP compliant at the coming time. Thanks to
standard interfaces, it can be integrated into any system which offers unlimited
assets. It is ready for voice, SMS, data and fax. WMOi3 integrated modem is a
product with a sole connector, which puts together all the interface signals in
order to facilitate its integration.
It has an integrated SIM connector as well as a standard RF connector type MMCX
(Miniature Micro Connector).
For system integrators, product developers, handset and terminal manufacturers,
and others, WMOi3 is the fast track to the wireless world.

1.1 Scope of the user’s guide
This document describes the hardware interface and technical specifications for
the WMOi3 integrated modem.
The integrated modem is referenced as WMOi3 according to the GSM 900
standard, the GSM 1800 standard and the GSM 1900 standard. This product is
based on new Dual Band WISMOTM concept : every integrated modem referenced
WMOi3 G900/1800 includes a G900/1800 module and every integrated modem
referenced WMOi3-G900/1900 includes a G900/1900 module. This two dual-band
modems have the same specifications unless otherwise specified.

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June 2000/ version 1.0
WMOi3 Integrated Modem

1.2 General characteristics
1.2.1 General
•
•
•
•
•
•
•
•
•
•
•

Dual Band GSM modem 900/1800/E-GSM or 900/1900/E-GSM
Class 4 (2W at 900MHz)
Class 1 (1W at 1800/1900 MHz)
Small size and low power consumption
Voice, SMS
fax and data transmission without extra hardware
Tricodec (FR/EFR/HR)
Internal 3V SIM interface
Easy remote control by AT commands for dedicated applications
Fully Type Approved against GSM Phase 2 specifications
Fully shielded and ready-to-use

1.2.2 Electrical
•
•
•

Power supply: 5 VDC +/- 5% 1A
300 mA average in GSM 900 at Tx power max 2W
9 mA in idle mode

1.2.3 Physical
•
•
•
•
•
•
•

Absolute maximum dimension: 46 x 64 x 12 mm
Weight: 90 g
Volume: 36.21 cm3
Casing: Complete shielding-stainless steelMounting: 4 screw holes
Operating temperature range: -20°C to + 55°C
Storage temperature: -35°C to +85°C

1.2.4 Basic Features
1.2.4.1
•
•
•

Telephony (TCH/FS) & Emergency calls
Full Rate, Enhanced Full Rate and Half Rate
Dual Tone Multi Frequency function (DTMF)

1.2.4.2
•
•
•

telephony

Short Message Service

point to point MT & MO
SMS Cell Broadcast
Return Call Message

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June 2000/ version 1.0
WMOi3 Integrated Modem
1.2.4.3
•
•
•
•

Data Features

Data circuit asynchronous, transparent and non transparent up to 14,400
bits/s
Automatic fax group 3 (Class 1 & 2)
Alternate speech and fax
V.42, V.42bis

1.2.4.4

Supplementary services

Call Forwarding
Multiparty
Call Barring
Phone Book
Fixed Dialling Number
Call waiting & Call hold
Calling Line Identity
Advice of Charge
SIM Toolkit
SIM Lock
USSD
1.2.5 Interfaces
Single antenna interface
Internal SIM interface:
3V only
External SIM interface:
3V only for engineering sample.
3V or 5V for production unit
For Data Operation:
RS-232C serial link
remote control by AT commands (GSM 07.07 and 07.05)
baud rate from 300 to 115,200 bits/s
from 2,400 up to 19,200 with autobauding

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June 2000/ version 1.0
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1.3 Mechanical Design Overview
The WMOi3 integrated modem will use the following casing. It includes a
G900/1800 or G900/1900 WISMO™ module, a 50-pin connector, a SIM holder and
a RF connector.

figure 1 : mechanical description

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June 2000/ version 1.0
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figure 2 : mechanical description II
4 screw holes fix the WMOi3 on the mother PCB. The WMOi3 can be
indifferently on both sides (top or bottom) mounted.
Note: Interfaces
The integrated modem has a sole 50-pin connector which gathers all the
interface signals in order to facilitate its integration.
It has an integrated SIM card holder as well as a standard RF connector type
MMCX (Miniature Micro Connector)
The concept of the integrated modem has been defined to integrate a sole
device:
• Only one standard easy to find connector (worldwide supplied) gathering
the analog and digital interfaces
• A standard easy to find RF connector. See chapter RF connector page 34
• A SIM card holder. See chapter SIM interface page 35
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June 2000/ version 1.0
WMOi3 Integrated Modem

2 Safety precautions
IMPORTANT
FOR THE EFFICIENT AND SAFE OPERATION OF
YOUR GSM INTEGRATED MODEM
READ THIS INFORMATION BEFORE USE

2.1 RF safety
2.1.1 General
Your WMOi3 integrated modem is based on the GSM standard for cellular
technology. The GSM standard is spread all over the world. It covers Europe, Asia
and some parts of America and Africa. This is the most used telecommunication
standard.
Your modem is actually a low power radio transmitter and receiver. It sends out
and receives radio frequency energy. When you use your WMOi3 integrated
modem, the cellular system which handles your calls controls both the radio
frequency and the power level of your cellular modem.
2.1.2 Exposure to RF energy
There has been some public concern about possible health effects of using GSM
modems. Although research on health effects from RF energy has focused on the
current RF technology for many years, scientists have begun research regarding
newer radio technologies, such as GSM. After existing research had been
reviewed, and after compliance to all applicable safety standards had been tested,
it has been concluded that the product was fitted for use.
If you are concerned about exposure to RF energy there are things you can do to
minimize exposure. Obviously, limiting the duration of your calls will reduce your
exposure to RF energy. In addition, you can reduce RF exposure by operating your
cellular modem efficiently by following the below guidelines.
2.1.3 Efficient modem operation
For your modem to operate at the lowest power level, consistent with satisfactory
call quality :
If your modem has an extendible antenna, extend it fully. Some models allow you
to place a call with the antenna retracted. However your modem operates more
efficiently with the antenna fully extended.
Do not hold the antenna when the modem is « IN USE ». Holding the antenna
affects call quality and may cause the modem to operate at a higher power level
than needed.

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June 2000/ version 1.0
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2.1.4 Antenna care and replacement
Do not use the modem with a damaged antenna. If a damaged antenna comes
into contact with the skin, a minor burn may result. Replace a damaged antenna
immediately. Consult your manual to see if you may change the antenna yourself.
If so, use only a manufacturer-approved antenna. Otherwise, have your antenna
repaired by a qualified technician.
Use only the supplied or approved antenna. Unauthorized antennas, modifications
or attachments could damage the modem and may contravene local RF emission
regulations or invalidate type approval.

2.2 General safety

2.2.1 Driving
Check the laws and the regulations regarding the use of cellular devices in the area
where you have to drive as you always have to comply with them. When using
your modem while driving, please :
give full attention to driving,
pull off the road and park before making or answering a call if driving conditions so
require.
2.2.2 Electronic devices
Most electronic equipment, for example in hospitals and motor vehicles is shielded
from RF energy. However RF energy may affect some
improperly shielded
electronic equipment.
2.2.3 Vehicle electronic equipment
Check your vehicle manufacturer representative to determine if any on-board
electronic equipment is adequately shielded from RF energy.
2.2.4 Medical electronic equipment
Consult the manufacturer of any personal medical devices (such as pacemakers,
hearing aids, etc...) to determine if they are adequately shielded from external RF
energy.
Turn your modem OFF in health care facilities when any regulations posted in the
area instruct you to do so. Hospitals or health care facilities may be using RF
monitoring equipment.
2.2.5 Aircraft
Turn your modem OFF before boarding any aircraft.
• Use it on the ground only with crew permission.
• Do not use it in the air.
To prevent possible interference with aircraft systems, Federal Aviation
Administration (FAA) regulations require you to have permission from a crew
member to use your modem while the aircraft is on the ground. To prevent
interference with cellular systems, local RF regulations prohibit using your
modem while airborne.
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June 2000/ version 1.0
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2.2.6 Children
Do not allow children to play with your modem. It is not a toy. Children could hurt
themselves or others (by poking themselves or others in the eye with the antenna,
for example). Children could damage the modem, or make calls that increase your
modem bills.
2.2.7 Blasting areas
To avoid interfering with blasting operations, turn your unit OFF when in a
« blasting area » or in areas posted : « turn off two-way radio ». Construction
crew often use remote control RF devices to set off explosives.
2.2.8 Potentially explosive atmospheres
Turn your modem OFF when in any area with a potentially explosive atmosphere.
It is rare, but your modem or its accessories could generate sparks. Sparks in such
areas could cause an explosion or fire resulting in bodily injuries or even death.
Areas with a potentially explosive atmosphere are often, but not always, clearly
marked. They include fueling areas such as petrol stations ; below decks on
boats ; fuel or chemical transfer or storage facilities ; and areas where the air
contains chemicals or particles, such as grain, dust, or metal powders.
Do not transport or store flammable gas, liquid, or explosives, in the compartment
of your vehicle which contains your modem or accessories.
Before using your modem in a vehicle powered by liquefied petroleum gas (such
as propane or butane) ensure that the vehicle complies with the relevant fire and
safety regulations of the country in which the vehicle is to be used.

2.3 Safety standards
THIS WMOi3 INTEGRATED MODEM COMPLIES WITH ALL APPLICABLE RF
SAFETY STANDARDS.
This cellular modem meets the standards and recommendations for the
protection of public exposure to RF electromagnetic energy established by
governmental bodies and other qualified organizations, such as the following :
Directives of the European Community, Directorate General V in Matters of Radio
Frequency Electromagnetic Energy

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June 2000/ version 1.0
WMOi3 Integrated Modem

3 Standard Compliance
3.1 GSM compliance
Reference regulations: TBR 19, TBR 20, TBR 31, TBR 32

Table 1 : Wavecom acceptance test

Applied Standard
Acceptance Criteria
Full conformity to the recommendation regarding the
ETSI
recommendation for main RF parameters.
GSM/DCS
communication.
Cooking Test The test continues even after the Cooking Test milestone
has been reached
Stress Test
Therma shocks IEC Full conformity to the recommendation regarding the
68-2-14.
main parameters.
Vibration
Sinusoidal vibration No performance degradation or mechanical degradation
Test
IEC 68-2-6.
is allowed after test.
Vibration
Random
vibration No performance degradation or mechanical degradation
Test
IEC 68-2-36.
is allowed after test.
Shock Test
IEC 68-2-27.
No performance degradation or mechanical degradation
is allowed after test.
Bump Test
IEC 68-2-29.
No performance degradation or mechanical degradation
is allowed after test.
Humidity
Corrosion test IEC No visible degradation of the product, both visual and
Test
68-2-3.
functionnal.
The unit is tested at room temperature and must be fully
operative for the main RF parameters.
Warehouse
Low temperance IEC Under normal condition (room temperature) after the
Test
68-2-1.
test, the unit must behave in full conformity with the
main RF parameters specification.
Warehouse
High
temperature Under normal condition (room temperature) after the
Test
IEC 68-2-2.
test, the unit must behave in full conformity with the
main RF parameters specification.
Dust Test
MIL-STD-810D,
No visible dust in the visible areas. No more than 50
method 510-3.
dust particules in the cabinet of the product. The unit,
tested at room temperature must be fully operative.
Light Test
UV
radiation
and Visual inspection on the discoloration and other
temperature
EDF degradation effects such as cracks in the material of the
HN60E03.
unit after the test.
Fall Test
IEC 68-2-32.
Only minor casing degradation is allowed, with a
maximum dimension change of 1mm. The unit must
remain fully operative and full specification for the main
RF parameters.
Electro Static IEC 1000-4-2.
No performance degradation allowed after the test.
Discharge
Test

Tests
Performance
Test

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June 2000/ version 1.0
WMOi3 Integrated Modem
Salt
Mist IEC 68-2-11
Test
Atmosphere Flowing mixed gas
Test
corrosion. IEC 68-260
Marking
EN 60 950
Test

After the test, visual inspection on the unit.
After the test, visual inspection on the unit and inside.
After the test, visual inspection on
degradation is allowed on the marking.

the

unit.

3.2 FTA Compliance
The WMOi3 has received a Full-Type Approval (against normal
requirements) in the configuration using the internal SIM interface.

3.2.1 IMEI Number
GSM 900/1800:
TAC: 5 000 64
FAC: 11
Serial Numbers: 000000 to 999999
GSM 900/1900:
TAC: 500 100
FAC: 11
Serial Number: 000000 to 999999
3.2.2 CE Label
The WMOi3 integrated modem is CE compliant which implies that the modem is
in conformity with the European Community directives and it bears the CE label
Carrying out tests:
Electro-magnetic field immunity
EN 61000-4-3
ETS 300-342—1
Radiated emission
EN 55022
ETS 300-342
ESD immunity
EN 61000-4-2
ETS 300-342-1

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June 2000/ version 1.0
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4 Hardware Interfaces
This chapter describes the hardware interfaces:
• The interfaces on the 50-pin general purpose connector
• The RF interface
• The SIM interface

4.1 Interfaces on the 50-pin general purpose connector
4.1.1 The 50-pin connector description

Table 2 : 50-pin connector description
Pin #
1
2
3
4
5
6

Name
GND
GND
+5V
+5V
CT109/DCD
GND
GPIO4

I/O

I/O type

Supply
Supply
CMOS/2X

I/O

CMOS/2X

7
8
9
10
11

SPK2N
CT125/RI
SPK2P
Flashing LED

O
O
O
I/O

Analog
CMOS/2X
Analog
CMOS/2X

12
13

SPK1P
CT106/CTS

O
O

Analog
1X

14
15
16

SPK1N
ON/~OFF
MIC2P

O
I
I

Analog
Analog

17
18

AUXV0
MIC2N

I
I

Analog
Analog

19
20

~RST
MIC1P

I
I

Analog

21
22

GND
MIC1N

I
I

Analog

23
24
25

BOOT
GND
CT103/TX

I
I

GPIO0

I/O

CMOS/2X

Description
GROUND
GROUND

Comment
High current
High current
High current
High current

RS232-Data Carrier Detect
GROUND
High current
General Purpose I/O
Speaker2 negative output
RS232-Ring Indicator
Speaker 2 positive output
Working mode indication
Led
Speaker 1 positive output
RS232 interface Clear To
Send
Speaker 1 negative output
Power ON/OFF control
Microphone 2 positive
input
Auxiliary ADC input
Microphone 2 negative
input
Reset active low
Microphone 1 positive
input
Ground
Microphone 1 negative
input
BOOT
GROUND
RS232 interface - Transmit

Driven by module

ON = VCC

(3)

Open Collector

Open Collector
High current
(3)
Pull up to VCC
with 100KΩ when
not used

General Purpose I/O

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June 2000/ version 1.0
WMOi3 Integrated Modem

Pin #
27

Name
CT107/DSR

28
29

CT104/RX
O
CT108-2/DTR I

CT105/RTS

31
32
33
34
35
36
37
38
39
40
41

I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O

1X
1X
1X
1X
1X
1X
1X
1X
1X
1X

42
43
44
45
46
47

COL3
COL4
COL1
COL2
ROW4
COL0
ROW2
ROW3
ROW0
ROW1
(1)
GND
(2)
NC
SPI_EN
SPI_IO
SPI_CLK
SIMCLK
SIMRST
SIMVCC

O
I/O
O
O
O
O

1X
1X
1X
2X
2X

SIMPRES1

49
50

I/O
O

I/O type
1X
1X

Description
Comment
RS232 interface
Data Set Ready
RS232 interface – Receive
(3)
RS232 interface
Pull up to VCC
Data Terminal Ready
with 100KΩ when
not used
(3)
RS232 interface
Pull up to VCC
Request To Send
with 100KΩ when
not used
Keypad column
Keypad column
Keypad column
Keypad column
Keypad row
Keypad column
Keypad row
Keypad row
Keypad row
Keypad row
(1)
GROUND
High current
(2)
No Connected
SPI enable
2
I C Data or SPI Data
2
I C Clock or SPI Clock
Clock for SIM Interface
3V mode
Reset for SIM interface
3V mode
SIM card supply
3V mode
6mA max
SIM card detect
Connected to SIM
connector pin 8.
Pin 4 of SIM
connector must be
pulled down to
GND with 1 KΩ*
I/O for SIM interface
3V mode
See (1) and (2)
High current

SIMDATA
I/O
3X
(1)
GND ,
GPO0(2)**
(1)
for engineering sample
(2)
for production unit.
(3)
VCC = application digital power supply either 5V or 2.8V
*see SIM socket diagram 4.3 SIM interface
** GPO0 is a general purpose output for selection of external SIM 3V or 5V

18/54
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June 2000/ version 1.0
WMOi3 Integrated Modem

Table 3 : operating conditions
Parameter

I/O type

Min

Max

Vinput low

CMOS

-0.5 V

0.8 V

Vinput high

CMOS

2.1 V

3.0 V

Voutput low

0.2 V

IOL = -1 mA

0.2 V

IOL = -2 mA

0.2 V

IOL = -3 mA

Voutput high

Condition

2.6 V

IOH = 1 mA

2.6 V

IOH = 2 mA

2.6 V

IOH = 3 mA

19/54
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June 2000/ version 1.0
WMOi3 Integrated Modem

GND

+5V

CT109/DCD

GND

GPIO4

SPK2N

CT125/RI

SPK2P

FLASHING LED

SPK1P

CT106/CTS

SPK1N

ON/~OFF

MIC2P

AUXV0

MIC2N

~RST

MIC1P

GND

MIC1N

BOOT

GND

CT103/Tx

GPIO0

CT107/DSR

CT104/Rx

CT108-2/DTR

CT105/RTS

COL3

COL4

COL1

COL2

ROW4

COL0

ROW2

ROW3

ROW0

ROW1

(2)

SPI EN

SPI IO

SPI CLK

SIMCLK

SIMRST

SIMVCC

SIMPRES1

SIMDATA

GND(1), GPO0(2)

(1)

GND , NC

(1) for engineering sample
(2) for production unit
figure 3 : 50-pin connector

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June 2000/ version 1.0
WMOi3 Integrated Modem

figure 4 : pin numbering/bottom view

4.1.2 Power supply
The main power supply is provided through a double connection. These
connections are respectively the pin 3 and 4 for the +5V and the pins 1 and 2 for
the ground (GND). The pins 6, 21, 24 and 40 are also ground connection in order
to produce a proper ground plane.
A 5V +/-5% - 1A power is strictly required to supply the modem. Otherwise,
serious dysfunctions may appear. However, the modem does not have to
constantly deliver 1A current at 5V on this power supply.
This power supply is internally regulated to a nominal value VBATT.

Table 4 : power supply pin description
Pin number
Name
1
GND
2
GND
3
+5 V
4
+5 V
6
GND
21
GND
24
GND
41*
GND
50*
GND
*for engineering sample

Description
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground

Comment
High Current
High Current
High Current
High Current
High Current
High Current
High Current
High Current
High Current

Table 5 : Power consumption in EGSM mode
Conditions

INOM

IMAX

+5V

During TX bursts @ 2W

tbd

+5V

During RX bursts

tbd

+5V

Average @ 2W

320 mA

800 mA

+5V

Average @ 0.5W

tbd

+5V

Average Idle mode

9 mA

tbd

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June 2000/ version 1.0
WMOi3 Integrated Modem

Table 6 : Power consumption in GSM 1800 and1900 mode
Conditions

INOM

IMAX

+5V

During TX bursts @ 1W

tbd

+5V

During RX bursts

tbd

+5V

Average @ 1W

tbd

+5V

Average @ 0.25W

tbd

+5V

Average Idle mode

tbd

4.1.3 Serial link
A serial link interface is available complying with V24 protocol signalling but not
with V28 (electrical interface) due to a 2.8 Volts interface. TX, RTS and DTR can be
either 5V or 3V.
The signals are Tx data (CT103/TX), Rx data (CT104/RX), Request To Send
(CT105/RTS), Clear To Send (CT106/CTS), Data Terminal Ready (CT108-2/DTR)
and Data Set Ready (CT107/DSR).
The set of RS232 signals can be required for GSM DATA services application. The
2 additional signals are Data Carrier Detect (CT109/DCD) and Ring Indicator
(CT125/RI).

Table 7 : Serial Link pin description
Signal

Pin number I/O

I/O type*

Description

CT103 / TX

CMOS

Transmit serial data

CT104 / RX

Receive serial data

CT105 / RTS

CMOS

Ready To Send

CT106 / CTS

Clear To Send

CT107 / DSR

Data Set Ready

CT108-2 / DTR

CMOS

Data Terminal Ready

CT109 / DCD

CMOS / 2X

Data Carrier Detect

CT125 / RI

CMOS / 2X

Ring Indicator

CT102/GND

21,24…**

Ground

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin
connector description
** Any of the available GND pins can be used

22/54
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June 2000/ version 1.0
WMOi3 Integrated Modem

Modem

Level Shifter

28
25
1

Terminal

VCC
27

C1+

2
C1-

C2+

GND
VC
GND

3 C2-

VCC

RI T1IN

T1OUT 5

DCD

23 T2IN

T2OUT

22 T3IN

T3OUT

CTS T4IN

T4OUT

17 T5IN

T5OUT

DSR

DTR
TX
RTS

R1OUTB

R1IN
R2IN

R2OUT

R3IN

S_RI

S_DCD

S_RX

10
12

S_DSR

S_DTR

S_TX

S_RTS

R3OUT
ERROR 1
R4OUT
14

VCC ON

VCC

OFF

MAX 3238

figure 5 : level shifter application diagram for serial link

4.1.4 ON / ~OFF
This input is used to switch ON or OFF the WMOi3 modem. A high level signal
has to be provided on the pin ON/~OFF to switch on the modem. The level of the
voltage of this signal has to be maintained to VCC during a minimum time of 1
second. When powered off, the shutdown current is roughly 60 µA.

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June 2000/ version 1.0
WMOi3 Integrated Modem

Table 8 : ON / OFF pin description
Signal

Pin number

I/O

I/O type*

Description

ON/∼OFF

CMOS

Module Power ON/OFF

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin
connector description
4.1.4.1

Power OFF procedure

In order to power OFF the WMOi3, you have to switch OFF both via software
(AT+CPOF) and hardware line. See the diagram below.

ON/~OFF

Serial link
to WMOi3

AT+CPOF

Serial Link
from WMOi3

OK response

About
500 ms

WMOi3 Status
ON
OFF

figure 6 : power OFF procedure 1

ON/~OFF

Serial link
to WMOi3

AT+CPOFF

About
500 ms

Serial link
from WMOi3

OK response
About
About
500
500ms
ms

WMOi3 status
ON
OFF

figure 7 : power OFF procedure 2

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June 2000/ version 1.0
WMOi3 Integrated Modem
4.1.5 BOOT
This input is used to switch the WMOi3 into the download mode. The internal
boot procedure is started when this pin is low during the powering on of the
module. In normal mode, this pin has to be left open. if used, this input has to be
driven by an open collector or an open drain. See below an example of application
diagram. See also software upgrading in General Guidelines chapter 8

BOOT : pin 23

Switch BOOT

figure 8 : boot procedure
If Switch Boot = 1, Boot pin 23 = 0, to download mode
If Switch Boot = 0, Boot pin 23 = 1, to normal mode

Table 9 : BOOT pin description
Signal

Pin number

I/O

I/O type*

Description

BOOT

CMOS

SW downloading

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin
connector description

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June 2000/ version 1.0
WMOi3 Integrated Modem
4.1.6 Reset signal (~RST)
This signal is used to force a reset of the WMOi3. It has to be used by providing
low level during approximately 2ms. This signal has to be considered as an
emergency reset only. A reset procedure is already driven by an internal hardware
during the power-up sequence.
This signal can also be used to provide a reset to an external device. If no external
reset is necessary this input can be left open. If used (emergency reset), it has to
be driven by an open collector or an open drain. See below an example of
application diagram.

Reset : pin 19

Switch reset

figure 9 : reset procedure
If switch Reset = 1, Reset pin 19 = 0
If switch Reset = 0, Reset pin 19 = 1

Table 10 : reset signal pin description
Signal

Pin number

I/O

∼RST

I/O

I/O type*

Description
Module Reset

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin
connector description

Table 11 : reset signal electrical characteristics
Parameter

Min

Input Impedance ( R )

4.7

Input Impedance ( C )

Max

Unit
kΩ

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WMOi3 Integrated Modem

Table 12 : reset signal operating conditions
Parameter

Min

Max

*VT-

1.1V

1.2 V

*VT+

1.7V

1.9 V

VOL

0.4 V

VOH

2.0 V

Condition

IOL = -50 µA
IOH = 50 µA

VT-, VT+ : Hysterisis Level
4.1.7 General Purpose Input/Output
The WMOi3 provides 2 General Purpose I/O. They are used to control any external
device.

Table 13 : General Purpose pin description
Signal

Pin number

I/O

I/O type*

Description

GPIO0

I/O

CMOS / 2X

General Purpose I/O

GPIO4

I/O

CMOS / 2X

General Purpose I/O

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin
connector description
(1) for production unit
All digital I/O comply with 3Volts CMOS.

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June 2000/ version 1.0
WMOi3 Integrated Modem
4.1.8 Analog to Digital Converter
Analog to Digital converter (ADC) input is provided by the WMOi3. This converter
is a 10 bits one, ranging from 0 to 2.5V .

Table 14 : A/D converter pin description
Signal

Pin number

I/O

I/O type*

Description

AUXV0

Analog

A/D converter

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin
connector description description

Table 15 : A/D converter electrical characteristics
Parameter

Min

Resolution

bits

Sampling rate

90.3

Ksps

Input signal range

ADC Reference Accuracy

0.5

Integral Accuracy

+/- 1

LSB

Differential Accuracy

+/- 1

LSB

Input Impedance ( R )

MΩ

Input Impedance ( C )

Max

2.5V

Unit

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June 2000/ version 1.0
WMOi3 Integrated Modem
4.1.9 Audio Interface
Two different microphone inputs and two different speaker outputs are supported.
The connection can be either differential or single-ended but using a differential
connection in order to reject common mode noise and TDMA noise is
recommended.
4.1.9.1

Microphone 2 Inputs

The MIC2 inputs are differential ones. They already include the convenient
biasing for an electret microphone (0,5 mA and 2 Volts). This electret
microphone can be directly connected on these inputs. The impedance of the
microphone 2 has to be around 2kΩ. These inputs are the standard ones for a
handset design while MIC1 inputs can be connected to an external headset or a
handsfree kit.
The gain of MIC2 inputs is internally adjusted. The gain can be tuned from 30dB
to 51dB. The connexion to the microphone is direct. The gain control can be
monitor via the At command AT+VGR.
See chapter Connector Supplier and Peripheral devices
MIC2P
C1

C1 = 22pF to 100pF
33 pF recommanded

MIC2N
figure 10 : microphone 2 input
C1 has to be the nearest possible to the microphone. Microphone manufacturers
provide this capacitor directly soldered on the microphone.

Table 16 : microphone 2 input pin description
Signal

Pin #

I/O

I/O type*

Description

MIC2P

Analog

Microphone 2 positive input

MIC2N

Analog

Microphone 2 negative input

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin
connector description

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June 2000/ version 1.0
WMOi3 Integrated Modem
4.1.9.2

Microphone 1 Inputs

The MIC1 inputs are differential and do not include internal bias. To use these
inputs with an electret microphone, bias has to be generated outside the WMOI3
modem according to the characteristic of this electret microphone. These inputs
are the standard ones used for an external headset or a handsfree kit. When using
a single-ended connection, be sure to have a very good ground plane, a very good
filtering as well as shielding in order to avoid any disturbance on the audio path.
The gain of MIC1 inputs is internally adjusted. The gain can be tuned from 30dB to
51dB.
The gain control can be monitor via the AT command AT+VGR
Differential connection

VCC analog power supply 2.8V
R1

R2
MIC1P

MIC1N
R3

figure 11 : microphone 1 input

R1 = R4 = from 100 to 330 Ω
R2 = R3 = usually between 1KΩ and 3.3KΩ as per the
microphone characteristics
C1 = 22pF to 100pF
C2 = 47µF
R1 and R4 are used as a voltage supply filter with C2.
C1 has to be the nearest possible to the microphone. Microphone manufacturers
provide this capacitor directly soldered on the microphone.

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Table 17 : microphone 1 input pin description
Signal

Pin #

I/O

I/O type*

Description

MIC1P

Analog

Microphone 1 positive input

MIC1N

Analog

Microphone 1 negative input

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin
connector description
4.1.9.3

Speaker 2 Outputs

Speaker outputs SPK2 are push-pull amplifiers and can be loaded down to 50
Ohms and up to 1nF. These outputs are differential and the output power can be
adjusted by step of 2dB. The output can be directly connected to a speaker.
When using a single-ended connection, be sure to have a very good ground plane,
a very good filtering as well as shielding in order to avoid any disturbance on the
audio path.
Differential Connection
SPK2P

SPK2N
Single-ended Connection

C1
SPK2P

figure 12 : speaker 2 output
C1 = from 100nF to 47µF as per the speaker characteristics and the output
power.
Using a single-ended connection also includes losing half of the output power
compared to a differential connection.

Table 18 : speaker 2 output pin description
Signal

Pin #

I/O

I/O type*

Description

SPK2P

Analog

Speaker 2 positive output

SPK2N

Analog

Speaker 2 negative output

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin
connector description

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June 2000/ version 1.0
WMOi3 Integrated Modem
4.1.9.4

Speaker 1 Outputs

Speaker outputs SPK1 are push-pull amplifiers and can be loaded down to 50
Ohms and up to 1nF. These outputs are differential and the output power can be
adjusted by step of 2dB. The output can be directly connected to a speaker.
When using a single-ended connection, be sure to have a very good ground
plane, a very good filtering as well as a shielding in order to avoid any
disturbance on the audio path.
Differential Connection

SPK1P
SPK1N
Single-ended Connection

C1
SPK1P

figure 13 : speaker 1 output
C1 = from 100nF to 47µF as per the speaker characteristics.
Using a single-ended connection also includes losing half of the output power compared to a
differential connection.

Table 19 : speaker 1 output pin description
Signal

Pin #

I/O

I/O type*

Description

SPK1P

Analog

Speaker 1 positive output

SPK1N

Analog

Speaker 1 negative output

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin
connector description

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June 2000/ version 1.0
WMOi3 Integrated Modem
4.1.10 SIM interface
The external SIM interface is available through the 50-pin connector in order to
use a stand-alone SIM card holder. This interface is 3V for engineering sample
and can be 5V for production unit using a level shifter.
SIM line must not exceed 15 cm. see also “General guidelines” chapter 8
5 signals exist:
SIMVCC: SIM power supply.
SIMRST: reset.
SIMCLK: clock.
SIMDATA: I/O port.
SIMPRES1 SIM card detect. It is connected to external SIM connector at pin 8. Pin
4 of SIM connector must be pulled down to GND with 1 KΩ.
This interface is fully compliant with GSM 11.11 recommendations concerning
the SIM functionality.
Transient Voltage Suppressor diodes are internally added on the signals connected
to the SIM socket in order to prevent any Electro-Static Discharge. TVS diodes
with low capacitance (less than 10pF) are connected on SIMCLK and SIMDATA to
avoid any disturbance of the rising and falling edge.

Table 20 : SIM interface pin description
Signal

Pin number

I/O

I/O type*

Description

SIMCLK

SIM Clock

SIMRST

SIM Reset

SIMDATA

I/O

CMOS / 3X

SIM Data

SIMVCC

SIMPRES1

CMOS

SIM Card Detect

GPO0**

SIM 3V or 5V

SIM Power Supply

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin
connector description
** for production unit

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June 2000/ version 1.0
WMOi3 Integrated Modem

Table 21 : SIM interface electrical characteristics
Parameter

Conditions

Min

SIMDATA VIH

IIH = ± 20µA

0.7xSIMVCC

SIMDATA VIL

IIL = 1mA

SIMRST,
SIMDATA
SIMCLK VOH
SIMRST,
SIMDATA
SIMCLK VOL

Source
20µA

SIMVCC
Voltage

Typ

Max

V
0.3xSIMVCC

current

Sink current
200µA

Output ISIMVCC <= 6mA

= SIMVCC – 0.1V

SIMCLK Rise/Fall Loaded with 30pF
Time

V
V

2.70

Unit

2.80

0.1

2.85

SIMRST,
SIMDATA
Rise/Fall Time

Loaded with 30pF

µs

SIMCLK
Frequency

Loaded with 30pF

3.25

MHz

Table 22 : SIM socket pin description
Signal
VCC
RST
CLK
CC4
GND
VPP
I/O
CC8

Pin number
1
2
3
4
5
6
7
8

Description
SIMVCC
SIMRST
SIMCLK
R10 to GROUND
GROUND
Not connected
SIMDATA
SIMPRES1

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June 2000/ version 1.0
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SIMVCC

SIMRST

2 RST
3 CLK

SIMCLK
GND

VCC

CC4

GND
VPP
SIMDATA

SIMPRES1

I/O
CC8

figure 14 : SIM socket

4.1.11 SPI bus
The SPI bus includes a CLK signal, an I/O signal and an EN signal complying with
SPI bus standard. The maximum speed transfer is 3.25Mb/s.

Table 23 : SPI Bus pin description
Signal

Pin number

I/O

I/O type*

Description

SPI_CLK

SPI Serial Clock

SPI_IO

I/O

CMOS / 1X

SPI Data

SPI_EN

SPI Enable

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin
connector description
4.1.12 Keypad interface
This interface provides 10 connections : 5 rows (R0 to R4) and 5 columns (C0 to
C4).
The scanning is a digital one, and the debouncing is done in the integrated
modem through the module. No discrete components like R,C (Resistor, Capacitor)
are needed.
It is possible to scan the column and rows via the AT command : AT+ CMER
See AT command user’s guide

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June 2000/ version 1.0
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Table 24 : keypad interface pin description
Signal

Pin number

I/O

I/O type*

Description

ROW0

I/O

CMOS / 1X

Row scan

ROW1

I/O

CMOS / 1X

Row scan

ROW2

I/O

CMOS / 1X

Row scan

ROW3

I/O

CMOS / 1X

Row scan

ROW4

I/O

CMOS / 1X

Row scan

COL0

I/O

CMOS / 1X

Column scan

COL1

I/O

CMOS / 1X

Column scan

COL2

I/O

CMOS / 1X

Column scan

COL3

I/O

CMOS / 1X

Column scan

COL4

I/O

CMOS / 1X

Column scan

*See Table 3 “operating conditions” in subdivision 4.1.1The 50-pin
connector description

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4.2 RF Interface
The impedance is 50 Ohms nominal.

4.2.1 RF connector
The RF connector is MMCX (Miniature Micro Connector) standard type.
An antenna can be directly connected through the matting connector or using a
small adaptor. See also
GSM Antenna
4.2.2 RF performances
RF performances are compliant with the ETSI recommendation 05.05 and 11.10.
The main parameters are :
• Receiver:
• EGSM Sensitivity : < -104 dBm
• GSM 1800/GSM 1900 Sensitivity : < -102 dBm
• Selectivity @ 200 kHz : > +9 dBc
• Selectivity @ 400 kHz : > +41 dBc
• Dynamic range : 62 dB
• Intermodulation : > -43 dBm
• Co-channel rejection : + 9 dBc
Transmitter :
• Maximum output power (EGSM) : 33 dBm +/- 2 dB
• Maximum output power (DCS/PCS) : 30 dBm +/- 2 dB
• Minimum output power (EGSM): 5 dBm +/- 5 dB
• Minimum output power (DCS/PCS): 0 dBm +/- 5 dB
• H2 level : < -30 dBm
• H3 level : < -30 dBm
• Noise in 925 - 935 MHz : < -67 dBm
• Noise in 935 - 960 MHz : < -79 dBm
• Noise in 1805 - 1880 MHz : < -71 dBm
• Phase error at peak power : < 5 ° RMS
• Frequency error : +/- 0.1 ppm max

4.3 SIM interface
The internal SIM interface of the WMOi3 integrated modem fits with a 3V SIM
card holder only.
The part number reference of the SIM card holder supplier is MOLEX 91228-0002
The part number reference of the SIM receptacle supplier is MOLEX 91236-0002
See also subdivision The SIM card holder.

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June 2000/ version 1.0
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5 Connector Supplier and Peripheral devices
5.1 Where to find the SMD connectors
The matting connector for the main connector is made by SAMTEC France. You
will find hereafter the SAMTEC web site
http://www.samtec.com/
Many SAMTEC products are available via SAMTEC dealers throughout the world.

figure 15 : high and low profile connectors

Part number : SD 25 01 N
figure 16 : flexible flat cable

Part number : FTS 125 01LDVA
figure 17 : flex cable connector

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June 2000/ version 1.0
WMOi3 Integrated Modem
5.1.1 GSM Antenna
The integrated modem antenna connector is a MMCX connector. The MMCX
connector incorporates a 'Snap On' latching action in order to make the connection
easier with an excellent RF performance. An additional advantage is its small
physical size which is 50% of the standard MCX connector.
This type of connector is suitable for the standard ranges of flexible and semi-rigid
cables. The characteristic impedance of the MMCX coaxial connector is 50 ohm.
The antenna manufacturer must guarantee that the antenna will be working
according to the following radio frequencies:

Table 25 : radio frequencies
Frequency RX
Frequency TX
RF power stand

GSM 1800
1805 to 1880 MHz
1710 to 1785 MHZ
1W at 12.5 % duty
cycle

GSM 1900
1930 to 1990 MHz
1850 to 1910 MHz
1W at 12.5 % duty
cycle

50 Ω
<2

Impedance
VSWR
Typical
gain

EGSM 900
925 to 960 MHz
880 to 915 MHz
2W at 12.5 % duty
cycle

radiated

0 dBi on azimuth plane

The WMOi3 integrated modem requires an MMCX (Miniature Micro
Connector) plug to connect an antenna

figure 18 : MMCX connector example (right angle)
An antenna with matting connector can be ordered, for example, from :
IMS Connectors Systems GMBH
Obere Hauptstrasse 30
D-79843 Löffingen
Germany
Tel : +49 76 54 90 10
Fax : +49 76 54 90 11 99
http://www.imscs.com/

or using a small MMCX / SMA adaptor can be ordered, for example, from :
Amphenol Socapex
http://www.amphenol.com/
Order N° : 908-31100

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June 2000/ version 1.0
WMOi3 Integrated Modem
5.1.2 The SIM card holder
The SIM card holder used in the integrated modem is a MOLEX connector.
Part number connector: 99228-0002
Part number holder : 91236-0002
For more information about this connector :
http://www.molex.com/
It is possible to use a stand-alone SIM card holder through the 50-pin connector
(the length of the SIM line must not exceed 15 cm).

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June 2000/ version 1.0
WMOi3 Integrated Modem

6 Climatic and mechanical environment
Table 26 : climatic and mechanical environment
WM2C-G900/G1800

ENVIRONNEMENTAL CLASSES

TYPE OF TEST

STANDARDS

STORAGE
Class 1.2

TRANSPORTATION
Class 2.3

Cold

IEC 68-2.1
Ab test

-25° C

72 h

-40° C

72 h

-20° C (GSM)
-10° C (DCS)

Dry heat

IEC 68-2.2
Bb test

+70° C

72 h

+70° C

72 h

+55° C

Change of temperature

IEC 68-2.14
Na/Nb test

Damp heat
cyclic

IEC 68-2.30
Db test

+30° C
2 cycles
90% - 100% RH
variant 1

+40° C
2 cycles
90% - 100% RH
variant 1

Damp heat

IEC 68-2.56
Cb test

+30° C

+40° C

Sinusoidal vibration

IEC 68-2.6
Fc test

5 - 62 Hz :
5 mm / s
62 - 200Hz :
2 m / s2
3 x 5 sweep cycles

Random vibration
wide band

IEC 68-3.36
Fdb test

-40° / +30° C

4 days

5 cycles
t1 = 3 h

4 days

5 - 20 Hz :
0.96 m2 / s3
20 - 500Hz :
- 3 dB / oct
3 x 10 min

OPERATING (PORT USE)
Class 7.3
16 h
16 h

16 h

-20° / +30° C (GSM) 3 cycles
-10° / +30° C (DCS) 3 cycles
t1 = 3 h

4 days

10 -12 Hz :
0.96 m2 / s3
12 - 150Hz :
- 3 dB / oct
3 x 30 min

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June 2000/ version 1.0
WMOi3 Integrated Modem

7 Application examples
Download

Flashing
LED

Test
connector

RS 232
serial link

Power
Supply
5V only/1 A

Audio RJ 9
Handset and
handsfree

Flex
connector

ON/OFF

Reset

Keypad

WMOi3
Integrated
Modem

SIM
Card
Holder

Antenna
Connector

figure 19 : demoboard pattern photograph
The demoboard is manufactured at Wavecom and can also be ordered at
Wavecom headquarters or directly to your distributor.

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June 2000/ version 1.0
WMOi3 Integrated Modem

8 General guidelines for the use of the WMOi3
8.1 Key information
8.1.1 Hardware and RF
•
•
•
•
•
•

Ground plane: Wavecom recommends to have a common ground
plane for analog, digital and RF grounds.
Length of the SIM interface lines (15 cm maximum)
Bias of the Microphone inputs must be properly adjusted when
using audio connectors (mic + speaker) 1.
EMC protection on audio input/output (filters against 900 MHz)
ESD protection on serial link,…
Possible spurious emission radiated by the application to the RF
receiver in the receiver band

8.1.2 The Antenna
The antenna sub-system and integration in the application is a major issue. It is a
major issue in the choice of the antenna cable ( type, length, performances,
thermal resistance, etc.)
These elements could affect GSM performances such as sensitivity and emitted
power.
The antenna should be isolated as much as possible from the digital circuitry
including the interface signals.
It is recommended to shield the terminal. On terminals including the antenna, a
poor shielding could dramatically affect the sensitivity of the terminal.
Subsequently, the power emitted through the antenna could affect the application.
8.1.3 Firmware upgrade
The WMOi3 firmware is stored in flash memory and it can easily be upgraded.
Two upgrade procedures are available:
8.1.3.1

Nominal upgrade procedure

The firmware file can be downloaded into the modem using the Xmodem protocol.
To enter this mode, the AT+WDWL command (see description in the AT command
manual) has to be sent to the WMOi3
The necessary serial signals to proceed with the Xmodem downloading are:
Rx, Tx, RTS, CTS, GND.

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June 2000/ version 1.0
WMOi3 Integrated Modem
8.1.3.2

backup procedure

In case the nominal upgrade mode is not possible (due to critical corruption on the
flash memory),
a backup procedure is also available. It requires a WAVECOM specific software to
download the firmware file into the modem.
This tool has to run on a PC connected to the serial bus of the modem. As this
procedure is very specific and needs Wavecom tools, this process has to be
executed by your distributor.
The necessary signals to proceed with the downloading are: Rx, Tx, RTS, CTS,
GND.
Prior to running the WAVECOM downloader, the modem has to be set in
download mode.
For this, the BOOT signal has to be set to low while powering ON (or reseting) the
modem.
The software upgrading is easy through the terminal: it is possible to download a
new GSM software from the outside, i.e., without removing the module from the
terminal.
Therefore the application must support serial speed changes, up to 115,200 bps
and hardware flow control.
The software upgrading can be handled either in using the Xmodem protocol
combined with the appropriate AT command AT+ WDWL through the nominal
mode or in using the Wavecom firmware in emergency mode (backup procedure).
8.1.4 Getting started
8.1.4.1

Minimum hardware interface to get started

As a minimum, it is necessary to connect the following signals to properly
operate the WMOi3 :
Pin
Name
Description
number
1
GND
GROUND
2
GND
GROUND
3
+5V
Power supply
4
+5V
Power supply
6
GND
GROUND
13
CT106/CTS Clear To Send
15
ON/OFF
Power On/OFF*
21
GND
GROUND
24
GND
GROUND
25
CT103/TX
Transmit
28
CT104/RX
Receive
30
CT105/RTS Request To Send
* connected to +5V for example
The serial link signals must be used through the implementation of the serial link
level shifter. See figure 5 : level shifter application diagram for serial link

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June 2000/ version 1.0
WMOi3 Integrated Modem
8.1.4.2

Terminal emulator setup

Here below is an example based on the WindowsTM Hyperterminal application.
You use the Hyperterminal program to monitor your WMOi3 integrated modem.
Setup:
START – PROGRAMS – ACCESSORIES – HYPERTERMINAL , then
Start the software HYPERTRM
Give the name of your choice, click on the icone of your choice, then click “OK”,
then
choose:
Connect using : direct to COM1
Properties :
choose 9600 bps – 8 bits data – no party – 1 stop bit – hardware flow control
Click “OK”
Now your HYPERTERMINAL is opened.
Your WMOi3 is ready to receive AT commands
Please see the “Informative Example” annex in the AT command user’s guide to
test your WMOi3.

8.2 AT command list
For comprehensive information about AT Commands, please read the AT
Commands user’s guide

Table 27 : AT command list
General Commands
+CGMI
Manufacturer Identification
+CGMM
Request Model Identification
+CGMR
Request Revision Identification
+CGSN
Product Serial Number
+CSCS
Select TE Character Set
+CIMI
Request IMSI
+CCID
Card Identification
+GCAP
Capabilities List
A/
Repeat Last Command
+CPOF
Power Off
+CFUN
Set Phone Functionality
+CPAS
Phone Activity Status
+CMEE
Report Mobile Equipment Errors
+CKPD
Keypad Control

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June 2000/ version 1.0
WMOi3 Integrated Modem
Call Control Commands
D
Dial command
H
Hang-up Command
A
Answer a Call
+CEER
Extended Error Report
+VTD, +VTS
DTMF Signals
ATDL
Redial Last Telephone Number
AT%Dn
Automatic Dialing with DTR
ATSO
Automatic Answer
+CICB
Incoming Call Bearer
+VGR, +VGT
Gain Control
+CMUT
Microphone Mute Control
+SPEAKER
Speaker and Microphone Selection
+ECHO
Echo Cancellation
+SIDET
Side Tone Modification
+VIP
Initialize Voice Parameters
Network Service Commands
+CSQ
Signal Quality
+COPS
Operator Selection
+CREG
Network Registration
+WOPN
Read Operator Name
+CPOL
Preferred Operator List
Security Commands
+CPIN
Enter PIN
+CPIN2
Enter PIN2
+CPINC
PIN Remaining Attempt Number
+CLCK
Facility Lock
+CPWD
Change Password
Phone Book Commands
+CPBS
Select Phone Book Memory Storage
+CPBR
Read Phone Book Entries
+CPBF
Find Phone Book Entries
+CPBW
White Phone Book Entry
+CPBP
Phone Book Phone Search
+CPBN
Move Action in Phone Book
+CNUM
Subscriber Number
+WAIP
Avoid Phone Book Init

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June 2000/ version 1.0
WMOi3 Integrated Modem
Short Message Commands
+CSMS
Select Message Service
+CNMA
New Message Acknowledgement
+CPMS
Preferred Message Storage
+CMGF
Preferred Message Format
+CSAS
Save Settings
+CRES
Restore Settings
+CSDH
Show Text Mode parameters
+CNMI
New Message Indication
+CMGR
Read Message
+CMGL
List Message
+CMGS
Send Message
+CMGW
Write Message to Memory
+CMSS
Send Message from Storage
+CSMP
Set Text Mode Parameters
+CMGD
Delete Message
+CSCA
Service Center Address
+CSCB
Select Cell Broadcast Message Types
+WCBM
Cell Broadcast Message Identifiers
+WMSC
Message Status Modification
+WMGO
Message Overwriting
Supplementary Services Commands
+CCFC
Call Forwarding
+CLCK
Call Barring
+CPWD
Modify SS Password
+CCWA
Call Waiting
+CLIR
Calling Line Identification Restriction
+CLIP
Calling Line Identification Presentation
+COLP
Connected Line Identification Presentation
+CAOC
Advice Of Charge
+CACM
AccumulatedCcall Meter
+CAMM
Accumulated Call Meter Maximum
+CPUC
Price Per Unit and Currency Table
+CHLD
Call Related Supplementary Services
+CLCC
List Current Calls
+CSSN
Supplementary Service Notifications
+CUSD
Unstructured Supplementary Service Data
+CCUG
Closed User Group
Data Commands
+CBST
Bearer Type Selection
+FCLASS
Select Mode
+CR
Service Reporting Control
+CRC
Cellular Result Codes
+ILRR
DTE-DCE Local Rate Reporting
+CRLP
Radio Link Protocol Parameters
+DOPT
Others Radio Link Parameters
%C
Select Data Compression
+DS
V42 bis Data Compression
+DR
V42 bis Data Compression Report
\N
Select Data Error Correcting Mode

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June 2000/ version 1.0
WMOi3 Integrated Modem
Fax Commands
+FTM
Transmit Speed
+FRM
Receive Speed
+FTH
HDLC Transmit Speed
+FRH
HDLC Receive Speed
+FTS
Stop Transmission and Wait
+FRS
Receive Silence
Fax Class 2 Commands
+FDT
Transmit Data
+FDR
Receice Data
+FET
Transmit Page Punctuation
+FPTS
Page Transfer Status Parameters
+FK
Terminate Session
+FBOR
Page Transfer Bit Order
+FBUF
Buffer Size Report
+FCQ
Copy Quality Checking
+FCR
Capability to Receive
+FDIS
Current Sessions Parameters
+FDCC
DCE Capabilities Parameters
+FLID
Local ID String
+FPHCTO
Page Transfer Timeout Parameter
V24-V25 Commands
+IPR
Fixed DTE Rate
+ICF
DTE-DCE Character Framing
+IFC
DTE-DCE Local Flow Control
&C
Set DCD Signal
&D
Set DTR Signal
&S
Set DSR Signal
O
Back to Online Mode
Q
Result Code Suppression
V
DCE Response Format
Z
Default Configuration
&W
Save Configuration
&T
Auto-Tests
E
Echo
&F
Restore Factory Settings
&V
Display Configuration
I
Request Identification Information
SIM Toolkit Commands
+STSF
SIM Toolkit Set Facilities
+STIN
SIM Toolkit Indication
+STGI
SIM Toolkit Get Information
+STCR
SIM Toolkit Control Response
+STGR
SIM Toolkit Give Response

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June 2000/ version 1.0
WMOi3 Integrated Modem
Specific AT Commands
+CCED
Cell Environment Description
+CCED
Automatic RxLev Indication
+WIND
General Indications
+ADC
Analog Digital Converters Measurements
+CMER
Mobile Equipment Event Reporting
+WLPR
Read Language Preference
+WLPW
Write Language Preference
+WIOR
Read GPIO Value
+WIOW
Write GPIO Value
+WAC
Abort Command
+WTONE
Play Tone
+WDTMF
Play DTMF Tone
+WDWL
Wavecom Downloading
+WVR
Wavecom Voice Rate
+WDR
Data Rate
+WHWV
Hardware Version
+WDOP
Date Of Production
+WSVG
Wavecom Select Voice Gain
+WSTR
Wavecom Status Request
+WSCAN
Wavecom Scan

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June 2000/ version 1.0
WMOi3 Integrated Modem

9 Index
Numerics

Easy remote control,8
Echo,46, 48
EFR,8, 52
EMC protection,43
Emergency calls,8
ESD protection,43
ETSI,15, 37, 53

2X,17, 18, 19, 22, 27, 33
A
analog,11, 43
Analog,17, 28, 29, 31, 32, 49
antenna,9, 12, 13, 14, 37, 39,
43
antenna cable,43
asynchronous,9
AT commands,8, 9, 45
AT+ CMER,35
AT+CPOF,24
autobauding,9
AUXV0,17, 28

F
fax,7, 8, 9
Fixed Dialling Number,9
Flash LED,17
FR,8, 52
G
gain,29, 30, 39, 49
general purpose,17
General Purpose,17, 27
GND,21
GND,17, 18, 21, 22, 33, 34, 52
GPIO,49
GPRS,7, 52
Ground plane,43
GSM,7, 8, 9, 12, 15, 22, 33,
37, 39, 43, 44, 52, 53

B
baud rate,9
BOOT,17, 25
bursts,21, 22
C
Call Barring,9
Call Forwarding,9
Call waiting & Call hold,9
Casing,8
CE,16, 52
Cell Broadcast,8
Class 1,8, 9
Class 4,8
CMOS,17, 19, 22, 24, 25, 27,
33, 35, 36
column,18, 35
connector,7, 10, 11, 17, 18,
22, 24, 25, 26, 27, 28, 29, 31,
32, 33, 35, 36, 37, 38, 39, 40
converter,28

H
handset,7, 29
hardware,7, 8, 17, 24, 26, 44
HR,8, 52
I
I/O,17, 18, 19, 22, 24, 25, 26,
27, 28, 29, 31, 32, 33, 34, 35,
36
Idle,21, 22
idle mode,8
interface,7, 8, 9, 11, 17, 18,
22, 33, 34, 35, 36, 37, 43

D
data,7, 8, 22, 47, 48
Data Carrier Detect,17, 22
dB,37, 52
DCS,7, 15, 22, 37, 39, 53
digital,11, 27, 35, 43, 49
Digital,28, 52
dual-band,7

K
Keyboard,18, 35
M
MIC1N,17, 31
MIC1P,17, 31
MIC2N,17, 29

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June 2000/ version 1.0
WMOi3 Integrated Modem
MIC2P,17, 29
microphone,29, 30, 31, 46
Microphone,17, 29, 30, 31, 43,
46
MMCX (Miniature Micro
Connector),7, 11, 37, 39
MO,8, 52
modem,7, 8, 10, 11, 12, 13,
14, 16, 21, 23, 30, 35, 37, 39,
40
module,7, 10, 25, 35, 44
Mounting,8
MT,8, 52
Multiparty,9

Ring Indicator,17, 22
RST,17, 26, 34
S
serial link,9, 22, 43
Signal,22, 24, 25, 26, 27, 28,
29, 31, 32, 33, 34, 35, 36, 46
SIM,7, 8, 9, 10, 11, 17, 18,
33, 34, 35, 37, 40, 43, 52, 53
SIMCLK,18, 33, 34
SIMDATA,18, 33, 34
SIMPRES,33
SIMRST,18, 33, 34
SIMVCC,18, 33, 34
SMS,7, 8, 52
socket,18, 33
software upgrading,44
speaker,29, 31, 32, 43
Speaker,17, 31, 32, 46
SPI,18, 35
SPK1N,17, 32
SPK1P,17, 32
Storage temperature,8

N
nominal value,21
O
OFF,13, 14, 17, 23, 24
Ohms,31, 32, 37
ON/~OFF,17, 23
operating conditions,19, 22,
24, 25, 26, 27, 28, 29, 31, 32,
33, 35, 36
Operating temperature
range,8

T
Telephony,8
terminal,7, 43, 44
Tricodec,8

P
PCB,11
PCS,7, 37, 39
Performance Test,15
Phone Book,9, 46
phonebook,46
point to point,8
power,8, 12, 21, 24, 26, 31,
32, 33, 37, 39, 43
power supply,21, 33
Power supply,8, 21
R
radio,12, 14, 39, 47
RF,7, 10, 11, 12, 13, 14, 15,
17, 37, 39, 43

V
V.42,9
V.42bis,9
VCC,17, 18, 34
voice,7, 46, 49
Volume,8
W
WAP,7, 52
Weight,8
WMOi3,1, 3, 6, 7, 10, 11, 12,
14, 16, 23, 24, 25, 26, 27, 28,
37, 43

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June 2000/ version 1.0
WMOi3 Integrated Modem

10 Acronyms and Abbreviations
ADC : Analog Digital Converter
ASIC : Application Specific Integrated Circuit
BCCH : Broadcast Control Channel
CE : Communauté Européenne
CLK : Clock
CTS : Clear To send
dB : decibel
DCD : Data Carrier Detect
DCE : Data Circuit Terminating Equipment
DSR : Data Set Ready
DTE : Data Terminal Equipment
DTR : Data Terminated Ready
EFR : Enhanced Full Rate
E-GSM : Extended- GSM
EMC : Electromagnetic Conformity
EN : Enable
ETSI :
FAC : Final Assembly Code
FR : Full-Rate
FTA : Full Type Approval
GND : Ground
GPIO : General Purpose Input Output
GPRS : General Packet Radio Service
GSM : Global System for Mobile Communication
HR : Half-Rate
IMEI : International Mobile Equipment Identity
MO : Mobile Originated
MT : Mobile Terminated
OEM : Original Equipment Manufacturer
PDA : Personal Digital Assistant
PCB : Printed Circuit Board
PRES : Presence
RI : Ring Indicator
RTS : Request To Send
SIM : Subscriber Identity Module
SMD : Surface Mounted Design
SMS : Short Message Service
TAC : Type Approval Code
TDMA : Time Code Multiple Access
TE : Terminal Equipment
VSWR : Voltage Standing Wave Ratio
WAP : Wireless application Protocol

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This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged
without prior written agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut
être communiqué ou divulgué à des tiers sans son autorisation préalable.

June 2000/ version 1.0
WMOi3 Integrated Modem

11 Reference documents
Table 28 : GSM ETSI recommendations for Phase I and Phase II.
Specification Reference
GSM ph2 Radio
DCS ph2 Radio
GSM ph2 Link-Management

Title
ETSI GSM 05.05 and GT 01 v4.2.1
ETSI GSM05.05 and GT01 v4.2.1
ETSI GSM 03.06, 04.08, 05.05, 05.08, 05.10, 07.01 an
GT 01 v4.2.1
GSM ph2 Link-Management ETSI GSM 03.06, 04.08, 05.05, 05.08, 05.10, 07.01 an
GT 01 v4.2.1
GSM ph2 Layer 2
ETSI GSM 04.06 and GT 01 v4.2.1
GSM ph2 Layer 3
ETSI GSM 04.08 and GT 01 v4.2.1
DCS ph2 Layer 3
ETSI GSM 04.08 and GT 01 v4.2.1
GSM/DCS Multiband
ETSI GSM 02.07, 03.22, 04.08, 04.13, 05.05, 05.08 an
GT 01 v4.2.1
GSM ph2 SIM
ETSI GSM 11.11 and GT 01 v4.2.1
GSM ph2 Teleservices
ETSI GSM 03.50 and GT 01 v4.2.1
GSM ph2 Miscellaneous
ETSI GSM 02.07, 03.40, 03.41, 04.08, 04.10, 04.11
06.10, 06.11, 06.12, 06.31, 06.32, 07.01, 09.07 and G
01 v4.2.1
DCS ph2 Miscellaneous
ETSI GSM 02.07, 03.40, 03.41, 04.08, 04.10, 04.11
06.10, 06.11, 06.12, 06.31, 06.32, 07.01, 09.07 and G
01 v4.2.1
You can find the documents on
ETSI Contacts:
ETSI Secr
Secretariat
etariat
F-06921 Sophia Antipolis cedex, France
e-mail: secretariat@etsi.fr
http://www.etsi.org
http://www.etsi.org

53/54
confidential ©
This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged
without prior written agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut
être communiqué ou divulgué à des tiers sans son autorisation préalable.

June 2000/ version 1.0
WMOi3 Integrated Modem

Figures
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mechanical description ................................................................
.................................................................
................................. 10
mechanical description II ..............................................................
.............................................................. 11
50-pin connecteur ................................................................
.........................................................................
......................................... 20
pin numbering/bottom view ..........................................................
.......................................................... 21
level shifter application diagram for serial link .............................. 23
power OFF procedure 1 ................................................................
.................................................................
................................. 24
power OFF procedure 2 ................................................................
.................................................................
................................. 24
boot procedure ................................................................
..............................................................................
.............................................. 25
reset procedure ................................................................
.............................................................................
............................................. 26
: microphone 2 input ................................................................
.....................................................................
..................................... 29
: microphone 1 input ................................................................
.....................................................................
..................................... 30
: speaker 2 output ................................................................
.........................................................................
......................................... 31
: speaker 1 output ................................................................
.........................................................................
......................................... 32
: SIM socket ................................................................
..................................................................................
.................................................. 35
: high and low profile connectors ..................................................
.................................................. 38
: flexible flat cable ................................................................
.........................................................................
......................................... 38
: flex cable connector ................................................................
....................................................................
.................................... 38
: MMCX connector example (right angle) ......................................
...................................... 39
: demoboard pattern photograph ..................................................
.................................................. 42

Tables
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28

Wavecom acceptance test .............................................................
............................................................. 15
50-pin connector description .........................................................
......................................................... 17
operating conditions ................................................................
......................................................................
...................................... 19
power supply pin description ........................................................
........................................................ 21
Power consumption in EGSM mode ..............................................
.............................................. 21
Power consumption in GSM 1800 and1900 mode.........................
mode......................... 22
description................................
..............................................................
Serial Link pin description
.............................................................. 22
ON / OFF pin description
description................................
................................................................
................................................................ 24
BOOT pin description ................................................................
....................................................................
.................................... 25
: reset signal pin description
description................................
on ..........................................................
.......................................................... 26
: reset signal electrical characteristics ...........................................
........................................... 26
conditions................................
.................................................
: reset signal operating conditions
................................................. 27
: General Purpose pin description ..................................................
.................................................. 27
: A/D converter pin description ......................................................
...................................................... 28
characteristics................................
........................................
: A/D converter electrical characteristics
........................................ 28
: microphone 2 input pin description .............................................
............................................. 29
: microphone 1 input pin description .............................................
............................................. 31
: speaker 2 output pin description .................................................
................................................. 31
: speaker 1 output pin description .................................................
................................................. 32
: SIM interface pin description .......................................................
....................................................... 33
: SIM interface electrical characteristics ........................................
........................................ 34
: SIM socket pin description ..........................................................
.......................................................... 34
description................................
................................................................
: SPI Bus pin description
................................................................ 35
: keypad interface pin description ..................................................
.................................................. 36
: radio frequencies ................................................................
.........................................................................
......................................... 39
: climatic and mechanical environment................................
environment..........................................
.......................................... 41
: AT command list................................
list................................................................
..........................................................................
.......................................... 45
: GSM ETSI recommendations for Phase I and Phase II. ................ 53

54/54
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This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged
without prior written agreement. Ce document est la propriété exlcusive de WAVECOM. Il ne peut
être communiqué ou divulgué à des tiers sans son autorisation préalable.

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