AP2316GN HF 3 Datasheet. Www.s Manuals.com. Apec

User Manual: Marking of electronic components, SMD Codes NI**. Datasheets AP2316GN-HF-3.

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Advanced Power
Electronics Corp.
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AP2316GN-HF-3
N-channel Enhancement-mode Power MOSFET
DSS
DS(ON)
D
Description
Absolute Maximum Ratings
Symbol Units
VDS
VGS
ID A
IDM
D at TA=25°C
TSTG
J
Symbol Value Unit
Parameter Rating
Gate-Source Voltage +
Continuous Drain Current3
Pulsed Drain Current1
Thermal Data
Parameter
Storage Temperature Range
A
dvanced Power MOSFETs from APEC provide the designer with the best
combination of fast switching, low on-resistance and cost-effectiveness.
The AP2316GN-HF-3 is in the popular SOT-23 small surface-mount package
BV 30V
Simple Drive Requirement
Low Gate Charge
Drain-Source Voltage 30 V
20 V
Rthj-a Maximum Thermal Resistance, Junction-ambient
which is widely used in commercial and industrial applications where a small
board footprint is required.
This device is well suited for use in medium current applications such as
load switches.
Ordering Information
D A
I Continuous Drain Current 3
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RoHS-compliant, halogen-free I 4.7A
at T =25°C 4.7 A
at T = 70°C 3.7 A
10 A
P Total Power Dissipation 1.38 W
-55 to 150 °C
T Operating Junction Temperature Range -55 to 150 °C
90 °C/W
©2010 Advanced Power Electronics Corp. USA 201008182-3
Surface Mount Device R 42m
D
G
S
SOT-23
G
D
S
AP2316GN-HF-3TR RoHS-compliant halogen-free SOT-23, shipped on tape and reel, 3000pcs/ reel
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Electronics Corp.
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AP2316GN-HF-3
©2010 Advanced Power Electronics Corp. USA
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Electrical Specifications at Tj=25°C (unless otherwise specified)
Source-Drain Diode
Notes:
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
1. Pulse width limited by maximum junction temperature.
RELIABILITY, FUNCTION OR DESIGN.
copper pad of FR4 board, t <10sec; 270°C/W when mounted on minimum copper pad.
2
2. Pulse test - pulse width < 300µs , duty cycle < 2%
3. Surface mounted on 1in
Symbol Parameter Test Conditions Min. Typ. Max. Units
BVDSS
Drain-Source Breakdown Voltage VGS=0V, ID=250uA 30 - - V
BVDSS/Tj Breakdown Voltage Temperature Coefficient Reference to 25°C, ID=1mA - 0.02 - V/°C
RDS(ON) Static Drain-Source On-Resistance VGS=10V, ID=4A - - 42 m
VGS=4.5V, ID=2A - - 72 m
VGS(th)
Gate Threshold Voltage VDS=VGS, ID=250uA 1 - 3 V
gfs
Forward Transconductance VDS=10V, ID=4A - 5 - S
IDSS
Drain-Source Leakage Current
VDS=30V, VGS=0V - - 1
uA
VDS=24V,VGS=0V, TJ=70°C - - 10 uA
IGSS Gate-Source Leakage VGS=±20V - - ±100 nA
Qg
Total Gate Charge2
ID=4A - 5 8
nC
Qgs
Gate-Source Charge VDS=24V - 1 -
nC
Qgd Gate-Drain ("Miller") Charge VGS=4.5V - 3 - nC
td(on)
Turn-on Delay Time2
VDS=15V - 7 -
ns
tr
Rise Time ID=1A - 8 -
ns
td(off) Turn-off Delay Time RG=3.3, VGS=10V - 12 - ns
tf
Fall Time RD=15 -3-ns
Ciss Input Capacitance VGS=0V - 270 430 pF
Coss Output Capacitance VDS=25V - 70 - pF
Crss Reverse Transfer Capacitance f=1.0MHz - 60 - pF
Rg
Gate Resistance f=1.0MHz - 1.4 2.1
Symbol Parameter Test Conditions Min. Typ. Max. Units
VSD Forward On Voltage2IS=1.2A, VGS=0V - - 1.2 V
trr Reverse Recovery Time2IS=4A, VGS=0V, - 14 - ns
Qrr Reverse Recovery Charge dI/dt=100A/µs - 9 - nC
Advanced Power
Electronics Corp.
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AP2316GN-HF-3
©2010 Advanced Power Electronics Corp. USA
www.a-powerusa.com
Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics
vs. Junction Temperature
Fig 5. Forward Characteristic of Fig 6. Gate Threshold Voltage vs.
Reverse Diode Junction Temperature
Typical Electrical Characteristics
Gate Voltage
Fig 3. On-Resistance vs. Fig 4. Normalized On-Resistance
0
4
8
12
01234
VDS , Drain-to-Source Voltage (V)
ID , Drain Current (A)
TA=25 oC
VG= 3.0 V
10V
7.0V
5.0V
4.5V
0
4
8
12
01234
VDS , Drain-to-Source Voltage (V)
ID , Drain Current (A)
TA= 150 oC 10 V
7.0 V
5.0 V
4.5 V
VG= 3.0 V
0.6
0.9
1.2
1.5
1.8
-50 0 50 100 150
Tj , Junction Temperature ( oC)
Normalized RDS(ON)
ID=4A
VG=10V
0.2
0.6
1.0
1.4
1.8
-50 0 50 100 150
Tj , Junction Temperature ( oC)
Normalized VGS(th) (V)
0.0
1.0
2.0
3.0
4.0
0 0.2 0.4 0.6 0.8 1 1.2
VSD , Source-to-Drain Voltage (V)
IS(A)
Tj=25 oCT j=150 oC
25
35
45
55
65
246810
VGS , Gate-to-Source Voltage (V)
RDS(ON) (m)
ID=2A
TA=25 oC
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Electronics Corp.
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AP2316GN-HF-3
©2010 Advanced Power Electronics Corp. USA
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Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics
Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance
Fig 11. Transfer Characteristics Fig 12. Gate Charge Waveform
Typical Electrical Characteristics (cont.)
0
2
4
6
8
10
02468
QG , Total Gate Charge (nC)
VGS , Gate to Source Voltage (V)
ID=4A
VDS =15V
V DS =20V
V DS =24V
Q
VG
4.5V
QGS QGD
QG
Charge
0.001
0.01
0.1
1
0.0001 0.001 0.01 0.1 1 10 100 1000
t , Pulse Width (s)
Normalized Thermal Response (Rthja)
0.01
0.05
0.1
0.2
Duty factor=0.5
Single Pulse
PDM
Duty factor = t/T
Peak Tj = PDM x Rthja + Ta
Rthja = 270°C/W
t
T
0.01
0.1
1
10
100
0.1 1 10 100
VDS , Drain-to-Source Voltage (V)
ID (A)
100us
1ms
10ms
100ms
1s
DC
TA=25 oC
Single Pulse
0
3
6
9
12
0246
VGS , Gate-to-Source Voltage (V)
ID , Drain Current (A)
Tj=150 oCT j=25 oC
VDS =5V
10
100
1000
1 5 9 13 17 21 25 29
VDS , Drain-to-Source Voltage (V)
C (pF)
f
=1.0MH
z
Ciss
Coss
Crss
Advanced Power
Electronics Corp.
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AP2316GN-HF-3
©2010 Advanced Power Electronics Corp. USA
www.a-powerusa.com
Package Dimensions: SOT-23
Marking Information: SOT-23
NIXX
Product: NI = AP2316GN-HF-3
Date/lot code
For details of how to convert this
to standard YYWW date code format,
please contact us directly.
1. All dimensions are in millimeters.
2. Dimensions do not include mold protrusions.
Millimeters
MIN NOM MAX
A 0.88 -- 1.30
A1 0.00 -- 0.10
A2 0.08 -- 0.25
D1 0.30 0.40 0.50
e 1.70 2.00 2.30
D 2.70 2.90 3.10
E 2.20 2.60 3.00
E1 1.20 1.50 1.80
M -- 10°
L 0.30 -- 0.60
SYMBOLS
D
E1 E
e
D1
AA2
A1
M
M
L
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