APL3512 Datatsheet. Www.s Manuals.com. Ra.6 Anpec

User Manual: Marking of electronic components, SMD Codes L2, L2 *, L2-***, L20, L21B, L24, L2902, L2902K, L2904, L2904AV, L2904V, L2A*, L2B, L2B*. Datasheets ADP3330ART-2.75, APL3512AB, APL3512BB, BAS40-06, BZX384-B6V2, DTD114GK, EML20, LM2902KDB, LM2902KPW, LM2902PW, LM2904AVQDR, LM2904AVQPWR, LM2904PSR, LM2904PW, LM2904VQDR, LM2904VQPWR, LP2980IM5-3.8, NZL6V8AXV3T1, RT9819E-24PV, SL24T1, SST502, UDZS9.1B, UML2N, mESD5.0DT5G.

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APL3512
Power-Distribution Switches with Soft Start

Features

General Description

•
•
•

90mΩ High Side MOSFET

The APL3512A/B is a power-distribution switch with some

2A Continuous Current

protection functions that can deliver current up to 2A. The
device incorporates a 90mΩ N-channel MOSFET power

Soft-Start Time Programmable by External

switch that is controlled by an enable logic pin and has a
SS pin dedicated to soft-start ramp-up rate control that

Capacitor

•
•
•
•
•
•

Wide Supply Voltage Range: 2.7V to 5.5V

can be used in application where the inrush current is
concerned.

Current-Limit and Short-Circuit Protections
Under-Voltage Lockout Protection

The device integrates some protection features, including current-limit protection, short-circuit protection, over-

Reverse Current Blocking when Switch Disabled

temperature protection, and UVLO. The current-limit and
short-circuit protection can protect down-stream devices

Over-Temperature Protection
Logic Level Enable Input

from catastrophic failure by limiting the output current at
current-limit threshold during over-load or short-circuit

APL3512A: Active High
APL3512B: Active Low

•

events. When VOUT drops below VIN-1.5V the devices limit
the current to a lower and safe level. The over-tempera-

Lead Free and Green Devices Available
(RoHS Compliant)

ture protection function shuts down the N-channel
MOSFET power switch when the junction temperature

Applications
•
•
•
•

rises beyond 140oC and will automatically turns on the
power switch when the temperature drops by 20oC. The

TFT LCD Modules

UVLO function keeps the power switch in off state until
there is a valid input voltage present.

Notebook and Desktop Computers
USB Ports

The device is available in lead free SOT-23-5, TDFN2x26 and SOP-8 packages with enable active-high(EN) and

High-Side Power Protection Switches

active-low(ENB) versions.

Simplified Application Circuit
APL3512A/B
VIN

VIN

VOUT

VOUT

SS
EN
Control

EN/ ENB
GND

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

1

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APL3512
Pin Configuration

VIN 1
SS 2
GND 3
NC 4

8 VOUT
7 NC
6 EN
5 NC

4 SS

8 VOUT
7 NC
6 ENB
5 NC

5 VIN

VOUT 1
GND 2
ENB 3

4 SS
SOT-23-5
APL3512B

SOP-8
APL3512B

6 VOUT
5 NC
4 EN

VIN 1
SS 2
GND 3
TDFN2x2-6
APL3512A

SOT-23-5
APL3512A

SOP-8
APL3512A

VIN 1
SS 2
GND 3
NC 4

5 VIN

VOUT 1
GND 2
EN 3

6 VOUT
5 NC
4 ENB

VIN 1
SS 2
GND 3
TDFN2x2-6
APL3512B

Exposed Pad, connect to large
ground plane for heat dissipation

Ordering and Marking Information
Package Code
B : SOT-23-5 K : SOP-8 QB : TDFN2x2-6
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
EN Function
A : Active High B : Active Low
Assembly Material
G : Halogen and Lead Free Device

APL3512
Assembly Material
Handling Code
Temperature Range
Package Code

EN Function

APL3512A B:

L2AX

X - Date Code

APL3512B B:

L2BX

X - Date Code

APL3512A K:

APL3512A
XXXXX

XXXXX - Date Code

APL3512B K:

APL3512B
XXXXX

XXXXX - Date Code

APL3512A QB:

L12A
X

X - Date Code

APL3512B QB:

L12B
X

X - Date Code

Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

2

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APL3512
Absolute Maximum Ratings
Symbol
VIN
VOUT
VENB, VEN

Parameter

Rating

Unit

VIN to GND Voltage

-0.3 ~ 6

V

VOUT to GND Voltage

-0.3 ~ 6

V

EN, ENB to GND Voltage

-0.3 ~ 6

V

VSS

SS to GND Voltage

IOUT

Continuous Output Current

TJ

(Note 1)

Maximum Junction Temperature

TSTG

Storage Temperature

TSDR

Maximum Lead Soldering Temperature, 10 Seconds

-0.3 ~ 6

V

Internally Limited

A

-40 ~ 150

o

-65 ~ 150

o

260

o

C
C
C

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.

Thermal Characteristics
Symbol

Parameter

Typical Value

Unit

Junction-to-Ambient Resistance in Free Air (Note 2)
SOT-23-5
250
SOP-8
160
TDFN2x2-6
225
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
θJA

o

C/W

Recommended Operating Conditions (Note 3)
Symbol

Parameter

VIN

VIN Input Voltage

IOUT

OUT Output Current
(Note 4)

Range

Unit

2.7 ~ 5.5

V

0 ~2

A

0.3 ~470

nF

CSS

SS Pin Soft-Start Capacitor

TA

Ambient Temperature

-40 ~ 85

o

TJ

Junction Temperature

-40 ~ 125

o

C
C

Note 3: Refer to the typical application circuit.
Note 4: Attaching a capacitor on SS pin can adjust the VOUT soft-start rate. If the CSS is out of the recommended range, the soft-start
rate could become internally controlled as if no CSS.

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

3

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APL3512
Electrical Characteristics
Unless otherwise specified, these specifications apply over VIN=5V, VEN=5V or VENB=0V and TA=-40~85oC. Typical values are at
TA=25oC.
Symbol

Parameter

APL3512A/B

Test Conditions

Unit

Min.

Typ.

Max.

-

-

1

µA

SUPPLY CURRENT
VIN Supply Current

No load, VEN=0V or VENB=5V
No load, VEN=5V or VENB=0V

-

60

100

µA

Leakage Current

VOUT=GND, VEN=0V or VENB=5V

-

-

1

µA

Reverse Leakage Current

VIN=GND, VOUT=5V, VEN=0V or VENB=5V

-

-

1

µA

IOUT=1.5A, TA=25oC

-

90

110

mΩ

IOUT=1.5A, TA=-40~85 C

-

90

140

mΩ

VIN rising, TA=-40~85oC

2.3

-

2.65

V

-

0.2

-

V

2.5

3.1

4.22

A

POWER SWITCH
RDS(ON)

Power Switch On Resistance

o

UNDER-VOLTAGE LOCKOUT
VIN UVLO Threshold Voltage
VIN UVLO Hysteresis
CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTIONS
ILIM
ISHORT

Current-Limit Threshold

VIN=2.7V to 5.5V, TA=-40~85oC

Short-Circuit Output Current

VIN=2.7V to 5.5V

-

0.8

-

A

VIN=5V, TA=-40~85oC

1

2

3

µA

VIN=5V, No load, COUT=1µF, CSS=10nF,
TA=-40~85oC

-

10

-

ms

VIN=3.3V, No load, COUT=1µF, CSS=10nF,
TA=-40~85oC

-

6.6

-

ms

VIN=3.3V, No load, COUT=1µF, No CSS or SS
tied to VIN, TA=-40~85oC

1

2

3

ms

V

SOFT-START CONTROL PIN
SS Current

tSS

Soft-Start Time

EN OR ENB INPUT PIN
VIH

Input Logic HIGH

VIN=2.7V to 5V

2

-

-

VIL

Input Logic LOW

VIN=2.7V to 5V

-

-

0.8

V

-

-

1

µA

VEN=0V or VENB=5V

-

150

-

Ω

TJ rising

-

140

-

°C

-

20

-

°C

Input Current
VOUT Discharge Resistance
OVER-TEMPERATURE PROTECTION (OTP)
TOTP

Over-Temperature Threshold
Over-Temperature Hysteresis

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

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APL3512
Typical Operating Characteristics
Switch On Resistance vs. Input
Voltage

Switch On Resistance vs. Junction
Temperature
130

140

Switch On Resistance, RDS(on) (mΩ)

Switch On Resistance , RDS(on) (mΩ)

160
VIN=3.3V

120
100
80
60

VIN=5V

40
IOUT=1.5A, CIN =1µF/X7R,
COUT =10µF/X7R

20
0

120
110
100
90
80
70

50

-50

0
50
100
Junction Temperature ( oC)

IOUT=1.5A, CIN =1µF/X7R,
COUT =1µF/X7R, TA=25oC

60

150

2.5

Supply Current vs. Junction
Temperature

5.0

5.5

Supply Current vs. Input Voltage

VIN =5V, RLOAD = Open,
CIN =COUT =33µF/Electrolytic

70

80

Supply Current, ICC (µA)

Supply Current, ICC (µA)

3.5
4.0
4.5
Input Voltage (V)

80

100

60
IC Enabled

40

20

IC Disabled

60
50

IC Enabled

40
RLOAD = Open,
CIN =COUT =1µF/X7R, TA=25oC

30
20

IC Disabled

10

0

00

-50

0
50
100
Junction Temperature ( oC)

2.5

150

3.6

3.6

Current-Limit Threshold, ILIM (A)

3.8

3.4
3.2
3.0
2.8
2.6
2.4

2.0
-50

VIN =5V
0

50

100

4.0

4.5

5.0

5.5

3.4
3.2
3.0
2.8
2.6
2.4
2.2
2.0
2.5

150

Junction Temperature ( oC)

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

3.5

Current-Limit Threshold vs.
Input Voltage

3.8

2.2

3.0

Input Voltage (V)

Current-Limit Threshold vs.
Junction Temperature
Current-Limit Threshold, ILIM (A)

3.0

TA =25oC
3.0

3.5

4.0

4.5

5.0

5.5

Input Voltage (V)

5

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APL3512

Short-Circuit Output Current vs.
Input Voltage

1.4

Current-Limit Response vs.
Output Peak Current
250

VIN =5V, TA=25oC

TA=25oC

1.2

Current-Limit Response (µs)

Short-Circuit Output Current, ISHORT (A)

Typical Operating Characteristics (Cont.)

1.0
0.8
0.6
0.4
0.2
0.0
2.5

3.0

3.5
4.0
4.5
Input Voltage (V)

5.0

200

150

100

50

0

5.5

0

2

Turn-On Rising Time vs. Junction
Temperature
VIN UVLO Threshold Voltage, VVLOC (V)

Turn-On Rising Time, tF (ms)

VIN = 5V, RLOAD =30Ω,
CIN = 1µF/X7R, COUT =33µF/Electrolytic
1.5

1.0

0.5

0
50
100
Junction Temperature ( oC)

3.2
2.8
UVLO Rising
2.4
UVLO Falling

2.0
1.6
1.2

IOUT =15mA,
CIN = 1µF/X7R, COUT =33µF/Electrolytic

0.8
-50

150

50

100

150

EN Pin Threshold Voltage vs.
Junction Temperature
3.0
EN Pin Threshold Voltage, VEN (V)

EN Pin Threshold Voltage, VEN (V)

0

Junction Temperature ( oC)

EN Pin Threshold Voltage vs.
Input Voltage
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8

12

VIN UVLO Threshold Voltage vs.
Junction Temperature

2.0

0.0
-50

4
6
8
10
Output Peak Current (A)

EN Rising

EN Falling

RLOAD =50Ω,
CIN = COUT =33µF/
Elctrolytic, TA=25oC
2.5

3.0

3.5
4.0
4.5
Input Voltage (V)

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

5.0

2.5
EN Rising

2.0
1.5

EN Falling

1.0
VIN =5V, RLOAD =50Ω,
CIN = COUT =33µF/Elctrolytic

0.5
5.5

-50

6

0
50
100
Junction Temperature (oC)

150

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APL3512
Typical Operating Characteristics (Cont.)
Output Voltage vs. Output Current

SS Current vs. Junction Temperature
3.2

5.0
4.5
Output Voltage, VOUT (V)

SS Current, ISS (µA)

2.8
2.4
2.0
1.6
1.2
0.8

VIN=5V

4.0
3.5
3.0
2.5

VIN=3.3V

2.0
1.5
1.0
0.5

VIN =5V

TA=25oC

0.0

0.4
-50

0

50

100

0

150

Junction Temperature ( oC)

1

2

3

4

Output Current (A)

Turn Off Leakage Current vs.
Junction Temperature
Turn Off Leakage Current, ILEAK(µA)

10
VIN = 5V, RLOAD = 0Ω,
CIN = COUT =1µF/X7R

8

6

4

2

0
-50

0
50
100
Junction Temperature ( oC)

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

150

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APL3512
Operating Waveforms
The test condition is VIN=5V, TA= 25oC unless otherwise specified.

Power On

Power Off

VIN
V IN
1

1
VOUT

VOUT

2

2
I OUT

IOUT
3

3

VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC,
COUT =100µF/Electrolytic, SS open

VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC,
COUT =100µF/Electrolytic, SS open

CH1: VIN, 2V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: IOUT, 0.5A/Div, DC
TIME:5ms/Div

CH1: VIN, 2V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: IOUT, 0.5A/Div, DC
TIME:20ms/Div

Turn On Response

Turn Off Response

VIN
VE N
1

1
VOUT

V OUT
2

2

I OUT

I OUT
3

3

VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC,
COUT =100µF/Electrolytic, SS open

VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC,
COUT =100µF/Electrolytic, SS open

CH1: VEN, 5V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: IOUT, 0.5A/Div, DC
TIME:0.5ms/Div

CH1: VEN, 5V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: IOUT, 0.5A/Div, DC
TIME:1ms/Div

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

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APL3512
Operating Waveforms (Cont.)
The test condition is VIN=5V, TA= 25oC unless otherwise specified.

Soft Start Ramp-up Control

Current Limit Response

VE N

V IN

1

VOUT
CS S=560pF

CS S=820pF

1

CS S=unconnected
or SS tied to V IN

C S S=330pF

2
CS S=5.6nF
2
VOUT

CS S=2.2nF

CS S=3.3nF

CS S=4.4nF

IOUT
3

VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC,
COUT=33µF/Electrolytic

VIN =5V, CIN =1µF/MLCC,
COUT=33µF/Electrolytic
CH1: VIN, 2V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: IOUT, 1A/Div, DC
TIME: 2ms/Div

CH1: VEN, 5V/Div, DC
CH2: VOUT, 2V/Div, DC
TIME: 0.5ms/Div

Short Circuit Protection

VIN
VOUT
1

2

IOUT

3

VIN =5V, VOUT short to ground,
CIN =1µF/MLCC, COUT=33µF/Electrolytic
CH1: VIN, 2V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: IOUT, 20A/Div, DC
TIME: 100µs/Div

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

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APL3512
Pin Description
PIN
FUNCTION

NO.
SOT-23-5

NAME

SOP-8 TDFN2x2-6

1

8

6

VOUT

Output Voltage Pin. The output voltage follows the input voltage. When ENB is
high or EN is low the output voltage is discharged by an internal resistor.

2

3

3

GND

Ground

3

6

4

EN
(APL3512A)

Enable Input. Pull this pin to high to enable the device and pull this pin to low to
disable device. The EN pin cannot be left floating.

ENB
(APL3512B)

Enable Input. Pull this pin to high to disable the device and pull this pin to low to
enable device. The ENB pin cannot be left floating.

4

2

2

SS

Soft-Start Control Pin. Connect a capacitor to GND to control the soft-tart rate. If
the SS pin is left floating or tied to VIN the soft-tart time is 2ms when VIN=5V.

5

1

1

VIN

Power Supply Input. Connect this pin to external DC supply.

-

4, 5, 7

5

NC

Internally not connected.

Block Diagram

VIN

VOUT

UVLO

Charge
Pump

EN/
ENB

Current
-Limit

Gate Driver and
Control Logic

Soft-Start

SS

OTP
GND

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

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APL3512
Typical Application Circuit

APL3512A/B
VOUT

VIN

VIN

VOUT

CIN

CBY

COUT

1µF

0.1µF

10µF

CSS

SS

10nF

Controller

EN/ENB
GND

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

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APL3512
Function Description
VIN Under-Voltage Lockout (UVLO)

VIN is the amplitude of input voltage applied to this device,

The APL3512A/B power switch is built-in an under-voltage lockout circuit to keep the output shut off until internal

of which unit is volt.
If the CSS is not connected or SS pin is tied to VIN, the soft-

circuitry is operating properly. The UVLO circuit has hysteresis and a de-glitch feature so that it will typically ig-

start time is 2ms when VIN=5V.
Enable/Disable

nore undershoot transients on the input. When input voltage exceeds the UVLO threshold, the output voltage starts

Pull the ENB above 2V, or EN below 0.8V to disable the
device and pull ENB pin below 0.8V or EN above 2V to

a soft-start to reduce the inrush current.

enable the device. When the IC is disabled, the supply
current is reduced to less than 1µA. The enable input is

Power Switch

compatible with both TTL and CMOS logic levels. The
EN/ENB pins cannot be left floating.

The power switch is an N-channel MOSFET with a low
RDS(ON). The internal power MOSFET does not have the
body diode. When IC is off, the MOSFET prevents a cur-

Over-Temperature Protection

rent flowing from the VOUT back to VIN and VIN to VOUT.
Current-Limit Protection

When the junction temperature exceeds 140oC, the internal thermal sense circuit turns off the power FET and

The APL3512A/B power switch provides the current-limit
protection function. During current-limit, the devices limit

allows the device to cool down. When the device’s junction temperature cools by 20 oC, the internal thermal

output current at current-limit threshold. For reliable
operation, the device should not be operated in current-

sense circuit will enable the device, resulting in a pulsed
output during continuous thermal protection. Thermal

limit for extended period.

protection is designed to protect the IC in the event of

Short-Circuit Protection

over-temperature conditions. For normal operation, the
junction temperature cannot exceed TJ=+125oC.

When the output voltage drops below VIN-1.5V, which is
caused by the over load or short-circuit, the devices limit
the output current down to a safe level. The short circuit
current-limit is used to reduce the power dissipation during short-circuit condition. If the junction temperature is
over the thermal shutdown temperature, the device will
enter the thermal shutdown.
Soft-Start
The APLA3512A/B provides an adjustable soft-start circuitry to control rise rate of the output voltage and limit the
current surge during start-up. The soft-start ramp-up rate
is controlled by a capacitor from SS pin to the ground.
Under a specific VIN being applied to the APL3512A/B, the
soft start time can be calculated by the following equation:
tSS = 0.2 x CSS x VIN
where,
tSS is soft-start time of VOUT rising from 0 to 100%, of which
unit is second.
CSS is the value of the capacitor connected from SS pin to
GND, of which unit is micro-Farad.

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

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APL3512
Application Information
Input Capacitor

refer to the Recommended Operating Conditions), the

A 1µF ceramic bypass capacitor from VIN to GND, located

soft-start time will become internally controlled as if there
is no CSS, tSS=2ms when VIN=5V, for example. If a soft-

near the APL3512, is strongly recommended to suppress
the ringing during short-circuit fault event. Without the by-

start capacitor is used, please make sure the CSS is in the
recommeded operating range.

pass capacitor, the output short may cause sufficient ringing on the input (from supply lead inductance) to damage

Layout Consideration

internal control circuitry.
Output Capacitor

The PCB layout should be carefully performed to maximize thermal dissipation and to minimize voltage drop,

A low-ESR 10µF MLCC, aluminum electrolytic or tantalum between VOUT and GND is strongly recommended

droop and EMI. The following guidelines must be
considered:

to reduce the voltage droop during hot-attachment of
downstream peripheral. Higher-value output capacitor is

1. Please place the input capacitors near the VIN pin as
close as possible.

better when the output load is heavy. Additionally, bypassing the output with a 0.1µF ceramic capacitor improves

2. Output decoupling capacitors for load must be placed
near the load as close as possible for decoupling high-

the immunity of the device to short-circuit transients.
During soft-start process, the output bulk capacitor draws

frequency ripples.
3. Locate APL3512 and output capacitors near the load to

inrush current from VIN. If the inrush current reaches
foldback current-limit threshold, namely 0.8A, the output

reduce parasitic resistance and inductance for excellent load transient performance.

current will be clamped in 0.8A level. It will take longer to
complete the soft-start process since the soft-start rate

4. The negative pins of the input and output capacitors
and the GND pin must be connected to the ground plane
of the load.

is controlled neither by internal soft-start nor by external

5. Keep VIN and VOUT traces as wide and short as possible.

soft-start circuitry. When the COUT meets the following
formula, the soft-start will be controlled by foldback current-limiting:
COUT > (0.8xtSS)/VIN

Recommended Minimum Footprint

Where,
tSS is 1ms when SS is open or tied to VIN, or obtained by
the tss equation, described in the paragraph of Soft-Start

0.075

in Functional Description section when CSS is used.
If the soft-start rate is controlled by the foldback current0.1

limiting, the soft-start time can be got by the following
equation:
tSS_Foldback = (COUT x VIN)/0.8

0.05

Soft-Start Capacitor
The APL3512 has a built-in adjustable soft-start control
for user to set an optimum soft-start time for the app-

0.037

lication. The soft-start time can be calculated by the
equation, described in the paragraph of Soft-Start in Func-

0.02
Unit : Inch

SOT-23-5

tional Description section. Please note that there are minimum and maximum limitations of soft-start capacitor. If
the value of soft-start capacitor is less than the minimum
limitation or higher than the maximum limitation (please
Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

13

www.anpec.com.tw

APL3512
Recommended Minimum Footprint

7

6

5

1

2

3

4

6.0

8

1.3

0.5

1.27

Unit : mm

SOP-8

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

14

www.anpec.com.tw

APL3512
Package Information
SOT-23-5
D
e

E

E1

SEE
VIEW A

b

c

0.25

A

L

0

GAUGE PLANE
SEATING PLANE

A1

A2

e1

VIEW A

S
Y
M
B
O
L

SOT-23-5
INCHES

MILLIMETERS
MIN.

MIN.

MAX.

A

1.45

A1

0.00

0.15

A2

0.90

MAX.
0.057

0.000

0.006

1.30

0.035

0.051
0.020

b

0.30

0.50

0.012

c

0.08

0.22

0.003

0.009

D

2.70

3.10

0.106

0.122
0.118
0.071

E

2.60

3.00

0.102

E1

1.40

1.80

0.055

e

0.95 BSC

e1

1.90 BSC

0.037 BSC
0.075 BSC

L

0.30

0.60

0

0°

8°

0.012
0°

0.024
8°

Note : 1. Follow JEDEC TO-178 AA.
2. Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

15

www.anpec.com.tw

APL3512
Package Information
SOP-8
-T-

SEATING PLANE < 4 mils

D

E

E1

SEE VIEW A

h X 45

°

c

A

0.25

b

GAUGE PLANE
SEATING PLANE

A1

A2

e

L
VIEW A

S
Y
M
B
O
L

SOP-8
INCHES

MILLIMETERS
MIN.

MAX.

A

MIN.

MAX.

1.75

0.069
0.010

0.004

0.25

A1

0.10

A2

1.25

b

0.31

0.51

0.012

0.020

c

0.17

0.25

0.007

0.010

D

4.80

5.00

0.189

0.197

E

5.80

6.20

0.228

0.244

E1

3.80

4.00

0.150

0.157

e

0.049

1.27 BSC

0.050 BSC

h

0.25

0.50

0.010

0.020

L

0.40

1.27

0.016

0.050

0

0°

8°

0°

8°

Note: 1. Follow JEDEC MS-012 AA.
2. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
3. Dimension “E” does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

16

www.anpec.com.tw

APL3512
Package Information
TDFN2x2-6
A

b

E

D

D2

A1
A3

L

K

E2

Pin 1 Corner

e
TDFN2x2-6

S
Y
M
B
O
L

MIN.

MAX.

A

0.70
0.00

A1

MILLIMETERS

A3

INCHES
MIN.

MAX.

0.80

0.028

0.031

0.05

0.000

0.002

0.20 REF

0.008 REF
0.30

0.007

0.012

1.90

2.10

0.075

0.083

D2

1.00

1.60

0.039

0.063

E

1.90

2.10

0.075

0.083

1.00

0.024

0.039

0.45

0.012

b
D

E2

0.18

0.60

e

0.65 BSC

L

0.30

K

0.20

0.026 BSC
0.018

0.008

Note : 1. Followed from JEDEC MO-229 WCCC.

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

17

www.anpec.com.tw

APL3512
Carrier Tape & Reel Dimensions
P0

P2

P1

A

B0

W

F

E1

OD0

K0

A0

A

OD1 B

B

T

SECTION A-A

SECTION B-B

H
A

d

T1

Application

SOT-23-5

Application

SOP-8

Application

TDFN2x2-6

A

H

T1

C

d

D

W

E1

F

178.0±2.00

50 MIN.

8.4+2.00
-0.00

13.0+0.50
-0.20

1.5 MIN.

20.2 MIN.

8.0±0.30

1.75±0.10

3.5±0.05

P0

P1

P2

D0

D1

T

A0

B0

K0

2.0±0.05

1.5+0.10
-0.00

1.0 MIN.

0.6+0.00
-0.40

3.20±0.20

3.10±0.20

1.50±0.20

W

E1

F

4.0±0.10

4.0±0.10

A

H

T1

C

d

D

330.0±2.00

50 MIN.

12.4+2.00
-0.00

13.0+0.50
-0.20

1.5 MIN.

20.2 MIN.

P0

P1

P2

D0

D1

T

1.5 MIN.

0.6+0.00
-0.40

12.0±0.30 1.75±0.10
A0

B0

5.5±0.05
K0

4.0±0.10

8.0±0.10

2.0±0.05

1.5+0.10
-0.00

A

H

T1

C

d

D

178.0±2.00

50 MIN.

8.4+2.00
-0.00

13.0+0.50
-0.20

1.5 MIN.

20.2 MIN.

P0

P1

P2

D0

D1

T

A0

B0

K0

2.0±0.05

1.5+0.10
-0.00

1.5 MIN.

0.6+0.00
-0.40

2.35+0.20

2.35+0.20

1.30±0.20

4.0±0.10

4.0±0.10

6.40±0.20 5.20±0.20
W

E1

12.0±0.30 1.75±0.10

2.10±0.20
F
5.5±0.05

(mm)

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

18

www.anpec.com.tw

APL3512
Devices Per Unit
Package Type

Unit

Quantity

SOT-23-5

Tape & Reel

3000

SOP-8

Tape & Reel

2500

TQFN2x2-6

Tape & Reel

3000

Taping Direction Information
SOT-23-5
USER DIRECTION OF FEED

SOP-8
USER DIRECTION OF FEED

TDFN2x2-6

USER DIRECTION OF FEED

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

19

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APL3512
Classification Profile

Classification Reflow Profiles
Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

100 °C
150 °C
60-120 seconds

150 °C
200 °C
60-120 seconds

3 °C/second max.

3°C/second max.

183 °C
60-150 seconds

217 °C
60-150 seconds

See Classification Temp in table 1

See Classification Temp in table 2

Time (tP)** within 5°C of the specified
classification temperature (Tc)

20** seconds

30** seconds

Average ramp-down rate (Tp to Tsmax)

6 °C/second max.

6 °C/second max.

6 minutes max.

8 minutes max.

Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*

Time 25°C to peak temperature

* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

20

www.anpec.com.tw

APL3512
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm

Volume mm
<350
235 °C
220 °C

3

Volume mm
≥350
220 °C
220 °C

3

Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm

Volume mm
<350
260 °C
260 °C
250 °C

3

Volume mm
350-2000
260 °C
250 °C
245 °C

3

Volume mm
>2000
260 °C
245 °C
245 °C

3

Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up

Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78

Description
5 Sec, 245°C
1000 Hrs, Bias @ Tj=125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA

Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838

Copyright  ANPEC Electronics Corp.
Rev. A.6 - Aug., 2012

21

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www.s-manuals.com



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