APL3512 Datatsheet. Www.s Manuals.com. Ra.6 Anpec

User Manual: Marking of electronic components, SMD Codes L2, L2 *, L2-***, L20, L21B, L24, L2902, L2902K, L2904, L2904AV, L2904V, L2A*, L2B, L2B*. Datasheets ADP3330ART-2.75, APL3512AB, APL3512BB, BAS40-06, BZX384-B6V2, DTD114GK, EML20, LM2902KDB, LM2902KPW, LM2902PW, LM2904AVQDR, LM2904AVQPWR, LM2904PSR, LM2904PW, LM2904VQDR, LM2904VQPWR, LP2980IM5-3.8, NZL6V8AXV3T1, RT9819E-24PV, SL24T1, SST502, UDZS9.1B, UML2N, mESD5.0DT5G.

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Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw1

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and

advise customers to obtain the latest version of relevant information to verify before placing orders.

Power-Distribution Switches with Soft Start

•90mΩ High Side MOSFET

•2A Continuous Current

•Soft-Start Time Programmable by External

Capacitor

•Wide Supply Voltage Range: 2.7V to 5.5V

•Current-Limit and Short-Circuit Protections

•Under-Voltage Lockout Protection

•Reverse Current Blocking when Switch Disabled

•Over-Temperature Protection

•Logic Level Enable Input

APL3512A: Active High

APL3512B: Active Low

•Lead Free and Green Devices Available

(RoHS Compliant)

FeaturesGeneral Description

Applications

•TFT LCD Modules

•Notebook and Desktop Computers

•USB Ports

•High-Side Power Protection Switches

Simplified Application Circuit

The APL3512A/B is a power-distribution switch with some

protection functions that can deliver current up to 2A. The

device incorporates a 90mΩ N-channel MOSFET power

switch that is controlled by an enable logic pin and has a

SS pin dedicated to soft-start ramp-up rate control that

can be used in application where the inrush current is

concerned.

The device integrates some protection features, includ-

ing current-limit protection, short-circuit protection, over-

temperature protection, and UVLO. The current-limit and

short-circuit protection can protect down-stream devices

from catastrophic failure by limiting the output current at

current-limit threshold during over-load or short-circuit

events. When VOUT drops below VIN-1.5V the devices limit

the current to a lower and safe level. The over-tempera-

ture protection function shuts down the N-channel

MOSFET power switch when the junction temperature

rises beyond 140oC and will automatically turns on the

power switch when the temperature drops by 20oC. The

UVLO function keeps the power switch in off state until

there is a valid input voltage present.

The device is available in lead free SOT-23-5, TDFN2x2-

6 and SOP-8 packages with enable active-high(EN) and

active-low(ENB) versions.

VIN VOUT

GND

APL3512A/B

EN/ENB

VIN VOUT

Control

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw2

Pin Configuration

GND 2

5 VIN

ENB 3 4 SS

VOUT 1

SOT-23-5

APL3512B

GND 2

5 VIN

EN 3 4 SS

VOUT 1

SOT-23-5

APL3512A

SS 27 NC

GND 3

NC 46 ENB

5 NC

8 VOUT

VIN 1

SOP-8

APL3512B

SS 27 NC

GND 3

NC 46 EN

5 NC

8 VOUT

VIN 1

SOP-8

APL3512A

GND 3

6 VOUT

VIN 1

SS 25 NC

4 EN

TDFN2x2-6

APL3512A

GND 3

6 VOUT

VIN 1

SS 25 NC

4 ENB

TDFN2x2-6

APL3512B

Exposed Pad, connect to large

ground plane for heat dissipation

Ordering and Marking Information

Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which

are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for

MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen

free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by

weight).

APL3512 Package Code

B : SOT-23-5 K : SOP-8 QB : TDFN2x2-6

Operating Ambient Temperature Range

I : -40 to 85 oC

Handling Code

TR : Tape & Reel

EN Function

A : Active High B : Active Low

Assembly Material

G : Halogen and Lead Free Device

Handling Code

Temperature Range

Package Code

Assembly Material

APL3512A B:L2AX X - Date Code

APL3512B B:L2BX X - Date Code

EN Function

APL3512A K:APL3512A

XXXXX XXXXX - Date Code

APL3512B K:XXXXX - Date Code

APL3512B

XXXXX

APL3512A QB:X - Date Code

L12A

APL3512B QB:X - Date Code

L12B

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw3

Absolute Maximum Ratings (Note 1)

Symbol Parameter Rating Unit

VIN VIN to GND Voltage -0.3 ~ 6 V

VOUT VOUT to GND Voltage -0.3 ~ 6 V

VENB, VEN EN, ENB to GND Voltage -0.3 ~ 6 V

VSS SS to GND Voltage -0.3 ~ 6 V

IOUT Continuous Output Current Internally Limited A

TJ Maximum Junction Temperature -40 ~ 150 oC

TSTG Storage Temperature -65 ~ 150 oC

TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 oC

Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-

mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device

reliability.

Thermal Characteristics

Symbol Parameter Typical Value Unit

θJA

Junction-to-Ambient Resistance in Free Air (Note 2) SOT-23-5

SOP-8

TDFN2x2-6

250

160

225

oC/W

Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.

Symbol

Parameter Range Unit

VIN VIN Input Voltage 2.7 ~ 5.5 V

IOUT OUT Output Current 0 ~2 A

CSS SS Pin Soft-Start Capacitor (Note 4) 0.3 ~470 nF

TA Ambient Temperature -40 ~ 85 oC

TJ Junction Temperature -40 ~ 125 oC

Recommended Operating Conditions (Note 3)

Note 3: Refer to the typical application circuit.

Note 4: Attaching a capacitor on SS pin can adjust the VOUT soft-start rate. If the CSS is out of the recommended range, the soft-start

rate could become internally controlled as if no CSS.

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw4

Electrical Characteristics

Unless otherwise specified, these specifications apply over VIN=5V, VEN=5V or VENB=0V and TA=-40~85oC. Typical values are at

TA=25oC.

APL3512A/B

Symbol

Parameter Test Conditions Min. Typ. Max.

Unit

SUPPLY CURRENT

No load, VEN=0V or VENB=5V - - 1 µA

VIN Supply Current No load, VEN=5V or VENB=0V - 60 100 µA

Leakage Current VOUT=GND, VEN=0V or VENB=5V - - 1 µA

Reverse Leakage Current VIN=GND, VOUT=5V, VEN=0V or VENB=5V - - 1 µA

POWER SWITCH

IOUT=1.5A, TA=25oC - 90 110 mΩ

RDS(ON)

Power Switch On Resistance IOUT=1.5A, TA=-40~85oC - 90 140 mΩ

UNDER-VOLTAGE LOCKOUT

VIN UVLO Threshold Voltage VIN rising, TA=-40~85oC 2.3 - 2.65 V

VIN UVLO Hysteresis - 0.2 - V

CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTIONS

ILIM Current-Limit Threshold VIN=2.7V to 5.5V, TA=-40~85oC 2.5 3.1 4.22 A

ISHORT

Short-Circuit Output Current VIN=2.7V to 5.5V - 0.8 - A

SOFT-START CONTROL PIN

SS Current VIN=5V, TA=-40~85oC 1 2 3 µA

VIN=5V, No load, COUT=1µF, CSS=10nF,

TA=-40~85oC - 10 - ms

VIN=3.3V, No load, COUT=1µF, CSS=10nF,

TA=-40~85oC - 6.6 - ms

tSS Soft-Start Time

VIN=3.3V, No load, COUT=1µF, No CSS

or SS

tied to VIN, TA=-40~85oC 1 2 3 ms

EN OR ENB INPUT PIN

VIH Input Logic HIGH VIN=2.7V to 5V 2 - - V

VIL Input Logic LOW VIN=2.7V to 5V - - 0.8 V

Input Current - - 1 µA

VOUT Discharge Resistance VEN=0V or VENB=5V - 150 - Ω

OVER-TEMPERATURE PROTECTION (OTP)

TOTP Over-Temperature Threshold TJ rising - 140 - °C

Over-Temperature Hysteresis - 20 - °C

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw5

Typical Operating Characteristics

Supply Current vs. Junction

Temperature

Supply Current, ICC (µA)

-50 0 50 100 150

Junction Temperature (oC)

VIN =5V, RLOAD = Open,

CIN =COUT =33µF/Electrolytic

IC Enabled

IC Disabled

100

Switch On Resistance vs. Input

Voltage

Switch On Resistance, RDS(on) (mΩ)

Input Voltage (V)

IOUT=1.5A,CIN =1µF/X7R,

COUT =1µF/X7R, TA=25oC

2.5 3.0 3.5 4.0 4.5 5.0 5.5

100

110

120

130

Switch On Resistance , RDS(on) (mΩ)

Switch On Resistance vs. Junction

Temperature

VIN=3.3V

Junction Temperature (oC)

VIN=5V

IOUT=1.5A, CIN =1µF/X7R,

COUT =10µF/X7R

100

120

140

160

0-50 0 50 100 150

Supply Current vs. Input Voltage

Input Voltage (V)

2.5 3.0 3.5 4.0 4.5 5.0 5.5

Supply Current, ICC (µA)

RLOAD = Open,

CIN =COUT =1µF/X7R, TA=25oC

IC Disabled

IC Enabled

Current-Limit Threshold vs.

Junction Temperature

Current-Limit Threshold, ILIM (A)

-50 0 50 100 150

Junction Temperature (oC)

2.0

2.8

3.0

3.2

3.4

3.6

3.8

VIN =5V

2.6

2.4

2.2

Input Voltage (V)

Current-Limit Threshold, ILIM (A)

Current-Limit Threshold vs.

Input Voltage

TA =25oC

2.0

2.2

2.4

2.6

2.8

3.0

3.2

3.4

3.6

3.8

2.5 3.0 3.5 4.0 4.5 5.0 5.5

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw6

Typical Operating Characteristics (Cont.)

EN Pin Threshold Voltage vs.

Junction Temperature

EN Pin Threshold Voltage, VEN (V)

EN Falling

EN Rising

Junction Temperature (oC)

VIN =5V, RLOAD =50Ω,

CIN = COUT =33µF/Elctrolytic

-50 0 50 100 150

0.5

1.0

1.5

2.0

2.5

3.0

Turn-On Rising Time vs. Junction

Temperature

Turn-On Rising Time, tF (ms)

Junction Temperature (oC)

VIN = 5V, RLOAD =30Ω,

CIN = 1µF/X7R, COUT =33µF/Electrolytic

1.0

1.5

2.0

0.5

0.0-50 0 50 100 150

EN Pin Threshold Voltage vs.

Input Voltage

Input Voltage (V)

EN Pin Threshold Voltage, VEN (V)

EN Falling

EN Rising

RLOAD =50Ω,

CIN = COUT =33µF/

Elctrolytic, TA=25oC

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

0.8

0.9

1.0

1.1

1.2

2.5 3.0 3.5 4.0 4.5 5.0 5.5

VIN UVLO Threshold Voltage vs.

Junction Temperature

VIN UVLO Threshold Voltage, VVLOC (V)

Junction Temperature (oC)

IOUT =15mA,

CIN = 1µF/X7R, COUT =33µF/Electrolytic

1.2

1.6

2.0

2.4

2.8

3.2

0.8 -50 0 50 100 150

UVLO Rising

UVLO Falling

Short-Circuit Output Current vs.

Input Voltage

Input Voltage (V)

2.5 3.0 3.5 4.0 4.5 5.0 5.5

Short-Circuit Output Current, ISHORT (A)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

TA=25oC

Current-Limit Response vs.

Output Peak Current

Current-Limit Response (µs)

100

150

200

250

Output Peak Current (A)

VIN =5V, TA=25oC

0 2 4 6 8 10 12

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw7

Typical Operating Characteristics (Cont.)

Output Voltage, VOUT (V)

Output Current (A)

Output Voltage vs. Output Current

VIN=5V

TA=25oC

0.0

2.5

3.0

3.5

4.0

4.5

5.0

2.0

1.5

1.0

0.5

0 1 2 3 4

VIN=3.3V

Turn Off Leakage Current vs.

Junction Temperature

Turn Off Leakage Current, ILEAK(µA)

Junction Temperature (oC)

VIN = 5V, RLOAD = 0Ω,

CIN = COUT =1µF/X7R

-50 0 50 100 150

SS Current vs. Junction Temperature

SS Current, ISS (µA)

Junction Temperature (oC)

VIN =5V

0.4

1.2

2.0

2.4

2.8

3.2

1.6

0.8

-50 0 50 100 150

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw8

Operating Waveforms

The test condition is VIN=5V, TA= 25oC unless otherwise specified.

Power OnPower Off

VIN

VOUT

IOUT

Turn On Response Turn Off Response

VIN

VOUT

IOUT

VOUT

VEN

IOUT

1VOUT

VIN

IOUT

TIME:5ms/Div

VIN =5V, RLOAD =30Ω,CIN =1µF/MLCC,

COUT =100µF/Electrolytic, SS open

CH1: VIN, 2V/Div, DC

CH2: VOUT, 2V/Div, DC

CH3: IOUT, 0.5A/Div, DC

TIME:20ms/Div

VIN =5V, RLOAD =30Ω,CIN =1µF/MLCC,

COUT =100µF/Electrolytic, SS open

CH1: VIN, 2V/Div, DC

CH2: VOUT, 2V/Div, DC

CH3: IOUT, 0.5A/Div, DC

TIME:0.5ms/Div

VIN =5V, RLOAD =30Ω,CIN =1µF/MLCC,

COUT =100µF/Electrolytic, SS open

CH1: VEN, 5V/Div, DC

CH2: VOUT, 2V/Div, DC

CH3: IOUT, 0.5A/Div, DC

TIME:1ms/Div

VIN =5V, RLOAD =30Ω,CIN =1µF/MLCC,

COUT =100µF/Electrolytic, SS open

CH1: VEN, 5V/Div, DC

CH2: VOUT, 2V/Div, DC

CH3: IOUT, 0.5A/Div, DC

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw9

Operating Waveforms (Cont.)

The test condition is VIN=5V, TA= 25oC unless otherwise specified.

Soft Start Ramp-up ControlCurrent Limit Response

CH1: VEN, 5V/Div, DC

CH2: VOUT, 2V/Div, DC

TIME: 0.5ms/Div

VIN =5V, RLOAD =30Ω, CIN =1µF/MLCC,

COUT=33µF/Electrolytic

Short Circuit Protection

CH1: VIN, 2V/Div, DC

TIME: 100µs/Div

VIN =5V, VOUT short to ground,

CIN =1µF/MLCC, COUT=33µF/Electrolytic

CH2: VOUT, 2V/Div, DC

CH3: IOUT, 20A/Div, DC

VEN

VOUT

CSS

=330pF

CSS

=560pF CSS

=unconnected

or SS tied to V IN

CSS

=2.2nF CSS

=3.3nF CSS

=4.4nF

CSS

=5.6nF

CSS

=820pF

VIN

VOUT

IOUT

VIN

VOUT

IOUT

CH1: VIN, 2V/Div, DC

CH2: VOUT, 2V/Div, DC

TIME: 2ms/Div

VIN =5V, CIN =1µF/MLCC,

COUT=33µF/Electrolytic

CH3: IOUT, 1A/Div, DC

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw10

Pin Description

NO.

SOT-23-5

SOP-8

TDFN2x2-6

NAME FUNCTION

1 8 6 VOUT Output Voltage Pin. The output voltage follows the input voltage. When ENB is

high or EN is low the output voltage is discharged by an internal resistor.

2 3 3 GND Ground

(APL3512A) Enable Input. Pull this pin to high to enable the device and pull this pin to low to

disable device. The EN pin cannot be left floating.

3 6 4 ENB

(APL3512B) Enable Input. Pull this pin to high to disable the device and pull this pin to low to

enable device. The ENB pin cannot be left floating.

4 2 2 SS Soft-Start Control Pin. Connect a capacitor to GND to control the soft-

tart rate. If

the SS pin is left floating or tied to VIN the soft-tart time is 2ms when VIN=5V.

5 1 1 VIN Power Supply Input. Connect this pin to external DC supply.

- 4, 5, 7

5 NC Internally not connected.

Block Diagram

Gate Driver and

Control Logic

UVLO

VIN VOUT

Charge

Pump

EN/

ENB

OTP

GND

Current

-Limit

Soft-Start

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw11

Typical Application Circuit

VIN VOUT

GND

APL3512A/B

EN/ENB

Controller

1µF10µF

10nF

VIN VOUT

0.1µF

COUT

CIN

CSS

CBY

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw12

Function Description

VIN Under-Voltage Lockout (UVLO)

The APL3512A/B power switch is built-in an under-volt-

age lockout circuit to keep the output shut off until internal

circuitry is operating properly. The UVLO circuit has hys-

teresis and a de-glitch feature so that it will typically ig-

nore undershoot transients on the input. When input volt-

age exceeds the UVLO threshold, the output voltage starts

a soft-start to reduce the inrush current.

Power Switch

The power switch is an N-channel MOSFET with a low

RDS(ON). The internal power MOSFET does not have the

body diode. When IC is off, the MOSFET prevents a cur-

rent flowing from the VOUT back to VIN and VIN to VOUT.

Current-Limit Protection

The APL3512A/B power switch provides the current-limit

protection function. During current-limit, the devices limit

output current at current-limit threshold. For reliable

operation, the device should not be operated in current-

limit for extended period.

Short-Circuit Protection

When the output voltage drops below VIN-1.5V, which is

caused by the over load or short-circuit, the devices limit

the output current down to a safe level. The short circuit

current-limit is used to reduce the power dissipation dur-

ing short-circuit condition. If the junction temperature is

over the thermal shutdown temperature, the device will

enter the thermal shutdown.

Soft-Start

The APLA3512A/B provides an adjustable soft-start cir-

cuitry to control rise rate of the output voltage and limit the

current surge during start-up. The soft-start ramp-up rate

is controlled by a capacitor from SS pin to the ground.

Under a specific VIN being applied to the APL3512A/B, the

soft start time can be calculated by the following equation:

tSS = 0.2 x CSS x VIN

where,

tSS is soft-start time of VOUT rising from 0 to 100%, of which

unit is second.

CSS is the value of the capacitor connected from SS pin to

GND, of which unit is micro-Farad.

VIN is the amplitude of input voltage applied to this device,

of which unit is volt.

If the CSS is not connected or SS pin is tied to VIN, the soft-

start time is 2ms when VIN=5V.

Enable/Disable

Pull the ENB above 2V, or EN below 0.8V to disable the

device and pull ENB pin below 0.8V or EN above 2V to

enable the device. When the IC is disabled, the supply

current is reduced to less than 1µA. The enable input is

compatible with both TTL and CMOS logic levels. The

EN/ENB pins cannot be left floating.

Over-Temperature Protection

When the junction temperature exceeds 140oC, the inter-

nal thermal sense circuit turns off the power FET and

allows the device to cool down. When the device’s junc-

tion temperature cools by 20oC, the internal thermal

sense circuit will enable the device, resulting in a pulsed

output during continuous thermal protection. Thermal

protection is designed to protect the IC in the event of

over-temperature conditions. For normal operation, the

junction temperature cannot exceed TJ=+125oC.

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw13

Application Information

Input Capacitor

A 1µF ceramic bypass capacitor from VIN to GND, located

near the APL3512, is strongly recommended to suppress

the ringing during short-circuit fault event. Without the by-

pass capacitor, the output short may cause sufficient ring-

ing on the input (from supply lead inductance) to damage

internal control circuitry.

Output Capacitor

A low-ESR 10µF MLCC, aluminum electrolytic or tanta-

lum between VOUT and GND is strongly recommended

to reduce the voltage droop during hot-attachment of

downstream peripheral. Higher-value output capacitor is

better when the output load is heavy. Additionally, bypass-

ing the output with a 0.1µF ceramic capacitor improves

the immunity of the device to short-circuit transients.

Layout Consideration

The PCB layout should be carefully performed to maxi-

mize thermal dissipation and to minimize voltage drop,

droop and EMI. The following guidelines must be

considered:

1. Please place the input capacitors near the VIN pin as

close as possible.

2. Output decoupling capacitors for load must be placed

near the load as close as possible for decoupling high-

frequency ripples.

3. Locate APL3512 and output capacitors near the load to

reduce parasitic resistance and inductance for excel-

lent load transient performance.

4. The negative pins of the input and output capacitors

and the GND pin must be connected to the ground plane

of the load.

5. Keep VIN and VOUT traces as wide and short as possible.

During soft-start process, the output bulk capacitor draws

inrush current from VIN. If the inrush current reaches

foldback current-limit threshold, namely 0.8A, the output

current will be clamped in 0.8A level. It will take longer to

complete the soft-start process since the soft-start rate

is controlled neither by internal soft-start nor by external

soft-start circuitry. When the COUT meets the following

formula, the soft-start will be controlled by foldback cur-

rent-limiting:

COUT > (0.8xtSS)/VIN

Where,

tSS is 1ms when SS is open or tied to VIN, or obtained by

the tss equation, described in the paragraph of Soft-Start

in Functional Description section when CSS is used.

If the soft-start rate is controlled by the foldback current-

limiting, the soft-start time can be got by the following

equation:

tSS_Foldback = (COUT x VIN)/0.8

Soft-Start Capacitor

The APL3512 has a built-in adjustable soft-start control

for user to set an optimum soft-start time for the app-

lication. The soft-start time can be calculated by the

equation, described in the paragraph of Soft-Start in Func-

tional Description section. Please note that there are mini-

mum and maximum limitations of soft-start capacitor. If

the value of soft-start capacitor is less than the minimum

limitation or higher than the maximum limitation (please

refer to the Recommended Operating Conditions), the

soft-start time will become internally controlled as if there

is no CSS, tSS=2ms when VIN=5V, for example. If a soft-

start capacitor is used, please make sure the CSS is in the

recommeded operating range.

0.05

0.02

0.1

0.037

0.075

Unit : Inch

Recommended Minimum Footprint

SOT-23-5

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw14

Recommended Minimum Footprint

SOP-8

6.0

1.3

1.27

0.5

1234

8765

Unit : mm

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw15

Package Information

SOT-23-5

MAX.

0.057

0.051

0.024

0.006

0.009

0.0200.012

L0.30

0.08

0.30

0.60 0.012

0.95 BSC

1.90 BSC

0.22

0.50

0.037 BSC

0.075 BSC

0.003

MIN.

MILLIMETERS

0.00

0.90

SOT-23-5

MAX.

1.45

0.15

1.30

MIN.

0.000

0.035

INCHES

VIEW A

0.25

GAUGE PLANE

SEATING PLANE

A2A1

SEE

VIEW A

1.40

2.60

1.80

3.00

2.70 3.10 0.122

0.071

0.1180.102

0.055

0.106

Note : 1. Follow JEDEC TO-178 AA.

2. Dimension D and E1 do not include mold flash, protrusions or gate

burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil

per side.

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw16

Package Information

SOP-8

A1A2

VIEW A

0.25

SEATING PLANE

GAUGE PLANE

Note: 1. Follow JEDEC MS-012 AA.

2. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.

3. Dimension “E” does not include inter-lead flash or protrusions.

Inter-lead flash and protrusions shall not exceed 10 mil per side.

LMIN. MAX.

1.75

0.10

0.17 0.25

0.25

MILLIMETERS

b0.31 0.51

SOP-8

0.25 0.50

0.40 1.27

MIN. MAX.

INCHES

0.069

0.004

0.012 0.020

0.007 0.010

0.010 0.020

0.016 0.050

0.010

1.27 BSC 0.050 BSC

A2 1.25 0.049

3.80

5.80

4.80

4.00

6.20

5.00 0.189 0.197

0.228 0.244

0.150 0.157

SEE VIEW A

h X 45

SEATING PLANE < 4 mils-T-

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw17

Package Information

TDFN2x2-6

LMIN. MAX.

0.80

0.00

0.18 0.30

1.00 1.60

0.05

0.60

MILLIMETERS

A3 0.20 REF

TDFN2x2-6

0.30 0.45

1.00

0.008 REF

MIN. MAX.

INCHES

0.031

0.000

0.007 0.012

0.039 0.063

0.024

0.012 0.018

1.90 2.10 0.075 0.083

0.20K0.008

0.70

0.039

0.028

0.002

0.65 BSC 0.026 BSC

Note : 1. Followed from JEDEC MO-229 WCCC.

LKE2

Pin 1 Corner

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw18

Carrier Tape & Reel Dimensions

OD0

BA0

SECTION B-B

SECTION A-A

OD1

Application

A H T1 C d D W E1 F

178.0±2.00

50 MIN.

8.4+2.00

-0.00

13.0+0.50

-0.20

1.5 MIN.

20.2 MIN.

8.0±0.30

1.75±0.10

3.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0

SOT-23-5

4.0±0.10

2.0±0.05

1.5+0.10

-0.00

1.0 MIN.

0.6+0.00

-0.40

3.20±0.20

3.10±0.20

1.50±0.20

Application

A H T1 C d D W E1 F

330.0±2.00

50 MIN.

12.4+2.00

-0.00

13.0+0.50

-0.20

1.5 MIN.

20.2 MIN.

12.0±0.30

1.75±0.10

5.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0

SOP-8

4.0±0.10

8.0±0.10

2.0±0.05

1.5+0.10

-0.00

1.5 MIN.

0.6+0.00

-0.40

6.40±0.20

5.20±0.20

2.10±0.20

Application

A H T1 C d D W E1 F

178.0±2.00

50 MIN.

8.4+2.00

-0.00

13.0+0.50

-0.20

1.5 MIN.

20.2 MIN.

12.0±0.30

1.75±0.10

5.5±0.05

P0 P1 P2 D0 D1 T A0 B0 K0

TDFN2x2-6

4.0±0.10

2.0±0.05

1.5+0.10

-0.00

1.5 MIN.

0.6+0.00

-0.40 2.35+0.20

2.35+0.20

1.30±0.20

(mm)

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw19

Taping Direction Information

SOT-23-5

USER DIRECTION OF FEED

SOP-8

USER DIRECTION OF FEED

Devices Per Unit

Package Type Unit Quantity

SOT-23-5 Tape & Reel 3000

SOP-8 Tape & Reel 2500

TQFN2x2-6 Tape & Reel 3000

TDFN2x2-6

USER DIRECTION OF FEED

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw20

Classification Reflow Profiles

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Preheat & Soak

Temperature min (Tsmin)

Temperature max (Tsmax)

Time (Tsmin to Tsmax) (ts)

100 °C

150 °C

60-120 seconds

150 °C

200 °C

60-120 seconds

Average ramp-up rate

(Tsmax to TP) 3 °C/second max. 3°C/second max.

Liquidous temperature (TL)

Time at liquidous (tL) 183 °C

60-150 seconds 217 °C

60-150 seconds

Peak package body Temperature

(Tp)* See Classification Temp in table 1 See Classification Temp in table 2

Time (tP)** within 5°C of the specified

classification temperature (Tc) 20** seconds 30** seconds

Average ramp-down rate (Tp to Tsmax)

6 °C/second max. 6 °C/second max.

Time 25°C to peak temperature 6 minutes max. 8 minutes max.

* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.

** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Classification Profile

Rev. A.6 - Aug., 2012

APL3512

www.anpec.com.tw21

Customer Service

Anpec Electronics Corp.

Head Office :

No.6, Dusing 1st Road, SBIP,

Hsin-Chu, Taiwan, R.O.C.

Tel : 886-3-5642000

Fax : 886-3-5642050

Taipei Branch :

2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,

Sindian City, Taipei County 23146, Taiwan

Tel : 886-2-2910-3838

Fax : 886-2-2917-3838

Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)

Package

Thickness

Volume mm3

<350

Volume mm3

≥350

<2.5 mm 235 °C 220 °C

≥2.5 mm 220 °C 220 °C

Table 2. Pb-free Process – Classification Temperatures (Tc)

Package

Thickness

Volume mm3

<350

Volume mm3

350-2000

Volume mm3

>2000

<1.6 mm 260 °C 260 °C 260 °C

1.6 mm – 2.5 mm 260 °C 250 °C 245 °C

≥2.5 mm 250 °C 245 °C 245 °C

Reliability Test Program

Test item Method Description

SOLDERABILITY JESD-22, B102 5 Sec, 245°C

HOLT JESD-22, A108 1000 Hrs, Bias @ Tj=125°C

PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C

TCT JESD-22, A104 500 Cycles, -65°C~150°C

HBM MIL-STD-883-3015.7 VHBM≧2KV

MM JESD-22, A115 VMM≧200V

Latch-Up JESD 78 10ms, 1tr≧100mA

Classification Reflow Profiles (Cont.)

www.s-manuals.com

APL3512 Datatsheet. Www.s Manuals.com. Ra.6 Anpec

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