BC817DS NPN General Purpose Double Transistor Philips

User Manual: Marking of electronic components, SMD Codes N3, N3***, N3030LS, N306AD. Datasheets BC817DS, BFG520W, BZX384-B43, DMN3030LSS, ISL9N306AD3, ISL9N306AD3ST, MMSZ5263, Si2303CDS.

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DISCRETE SEMICONDUCTORS

DATA SHEET
book, halfpage

M3D302

BC817DS
NPN general purpose double
transistor
Product specification
Supersedes data of 2002 Aug 09

2002 Nov 22

Philips Semiconductors

Product specification

NPN general purpose double transistor
FEATURES

BC817DS

QUICK REFERENCE DATA

• High current (500 mA)

SYMBOL

• 600 mW total power dissipation

VCEO

collector-emitter voltage

45

V

IC

collector current (DC)

500

mA

ICM

peak collector current

1

A

• Replaces two SOT23 packaged transistors on same
PCB area.
APPLICATIONS

PARAMETER

MAX.

UNIT

PINNING

• General purpose switching and amplification

PIN

• Push-pull amplifiers
• Multi-phase stepper motor drivers.

DESCRIPTION

1, 4

emitter

TR1; TR2

2, 5

base

TR1; TR2

6, 3

collector

TR1; TR2

DESCRIPTION
NPN transistor pair in a SOT457 (SC-74) plastic package.
handbook, halfpage

6

MARKING
TYPE NUMBER

6
5

5

4

4
TR2

MARKING CODE
TR1

BC817DS

N3
1

2

Top view

Fig.1

3
1

2

3

MAM340

Simplified outline (SOT457) and symbol.

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

Per transistor unless otherwise specified
VCBO

collector-base voltage

open emitter

−

50

VCEO

collector-emitter voltage

open base

−

45

V

VEBO

emitter-base voltage

open collector

−

5

V

IC

collector current (DC)

−

500

mA

ICM

peak collector current

−

1

A

IBM

peak base current

−

200

mA

Ptot

total power dissipation

−

370

mW

Tstg

storage temperature

−65

+150

°C

Tj

junction temperature

−

150

°C

Tamb

operating ambient temperature

−65

+150

°C

−

600

mW

Tamb ≤ 25 °C; note 1

V

Per device
Ptot

total power dissipation

Tamb ≤ 25 °C; note 1

Note
1. Device mounted on a printed-circuit board; single sided copper; tinplated; mounting pad for collector 1 cm2.
2002 Nov 22

2

Philips Semiconductors

Product specification

NPN general purpose double transistor

BC817DS

THERMAL CHARACTERISTICS
SYMBOL
Rth j-a

PARAMETER

CONDITIONS

thermal resistance from junction to note 1
ambient

VALUE

UNIT

208

K/W

Note
1. Device mounted on a printed-circuit board; single sided copper; tinplated; mounting pad for collector 1 cm2.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Per transistor
VCB = 20 V; IE = 0

−

−

100

nA

VCB = 20 V; IE = 0; Tj = 150 °C

−

−

5

µA

VEB = 5 V; IC = 0

−

−

100

nA

VCE = 1 V; IC = 100 mA; note 1

160

−

400

ICBO

collector-base cut-off current

IEBO

emitter-base cut-off current

hFE

DC current gain

40

−

−

VCEsat

collector-emitter saturation voltage IC = 500 mA; IB = 50 mA; note 1

−

−

700

mV

VBE

base-emitter voltage

VCE = 1 V; IC = 500 mA;
notes 1 and 2

−

−

1.2

V

Cc

collector capacitance

VCB = 10 V; IE = Ie = 0; f = 1 MHz

−

5

−

pF

fT

transition frequency

VCE = 5 V; IC = 10 mA;
f = 100 MHz

100

−

−

MHz

VCE = 1 V; IC = 500 mA; note 1

Notes
1. Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
2. VBE decreases by approximately −2 mV/K with increasing temperature.

2002 Nov 22

3

Philips Semiconductors

Product specification

NPN general purpose double transistor

MBL747

500

BC817DS

MBL748

1000
IC

handbook, halfpage

handbook, halfpage

hFE

(mA)
800

(1)

400

(1) (2) (3) (4) (5)

(6)
(7)

300

(8)

600

(9)

(2)

400

200

(10)
(3)

100

200

0
10−1

1

10

102

0

103

2

0

IC (mA)
VCE = 1 V.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.

(1) IB = 15 mA.
(2) IB = 13.5 mA.
(3) IB = 12 mA.
(4) IB = 10.5 mA.

Fig.2

Fig.3

DC current gain as a function of collector
current; typical values.

MBL749

103
handbook, halfpage

4

6

(5) IB = 9 mA.
(6) IB = 7.5 mA.
(7) IB = 6 mA.
(8) IB = 4.5 mA.

8

10
VCE (V)

(9) IB = 3 mA.
(10) IB = 1.5 mA.

Collector current as a function of
collector-emitter voltage; typical values.

MBL750

1200
VBE

handbook, halfpage

(mV)
1000

VCEsat
(mV)

(1)

800
(2)

102
600
(1)

(3)

400

(2)
(3)

10
10−1

1

10

102

200
10−1

103
IC (mA)

IC/IB = 10.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.

VCE = 1 V.
(1) Tamb = −55 °C.
(2) Tamb = 25 °C.
(3) Tamb = 150 °C.

Fig.4

Fig.5

Collector-emitter saturation voltage as a
function of collector current; typical values.

2002 Nov 22

4

1

10

102

IC (mA)

103

Base-emitter voltage as a function of
collector current; typical values.

Philips Semiconductors

Product specification

NPN general purpose double transistor

BC817DS

PACKAGE OUTLINE
Plastic surface mounted package; 6 leads

SOT457

D

E

B

y

A

HE

6

5

X

v M A

4

Q

pin 1
index

A
A1
c

1

2

3
Lp
bp

e

w M B
detail X

0

1

2 mm

scale

DIMENSIONS (mm are the original dimensions)
UNIT

A

A1

bp

c

D

E

e

HE

Lp

Q

v

w

y

mm

1.1
0.9

0.1
0.013

0.40
0.25

0.26
0.10

3.1
2.7

1.7
1.3

0.95

3.0
2.5

0.6
0.2

0.33
0.23

0.2

0.2

0.1

OUTLINE
VERSION
SOT457

2002 Nov 22

REFERENCES
IEC

JEDEC

EIAJ
SC-74

5

EUROPEAN
PROJECTION

ISSUE DATE
97-02-28
01-05-04

Philips Semiconductors

Product specification

NPN general purpose double transistor

BC817DS

DATA SHEET STATUS
LEVEL

DATA SHEET
STATUS(1)

PRODUCT
STATUS(2)(3)
Development

DEFINITION

I

Objective data

II

Preliminary data Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

III

Product data

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).

Production

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS

DISCLAIMERS

Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

2002 Nov 22

6

Philips Semiconductors

Product specification

NPN general purpose double transistor
NOTES

2002 Nov 22

7

BC817DS

Philips Semiconductors – a worldwide company

Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

SCA74

© Koninklijke Philips Electronics N.V. 2002

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

613514/02/pp8

Date of release: 2002

Nov 22

Document order number:

9397 750 10582



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Title                           : BC817DS  NPN general purpose double  transistor
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Create Date                     : 2002:06:07 11:46:26
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