BSS138 Datasheet. Www.s Manuals.com. Fairchild

User Manual: Marking of electronic components, SMD Codes SS, SS12, SS14, sSG, sSN. Datasheets 2SC2405, 2SC3929, BSS138, BZX84J-B39, RP130K501A, SN7002, SN7002N, SN7002W, SS12T3 , SS14T3 .

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October 2005
2005 Fairchild Semiconductor Corporation BSS138 Rev C(W)
BSS138
N-Channel Logic Level Enhancement Mode Field Effect Transistor
General Description
These N-Channel enhancement mode field effect
transistors are produced using Fairchild’s proprietary,
high cell density, DMOS technology. These products
have been designed to minimize on-state resistance
while provide rugged, reliable, and fast switching
performance.These products are particularly suited for
low voltage, low current applications such as small
servo motor control, power MOSFET gate drivers, and
other switching applications.
Features
0.22 A, 50 V. R
DS(ON)
= 3.5@ V
GS
= 10 V
R
DS(ON)
= 6.0@ V
GS
= 4.5 V
High density cell design for extremely low R
DS(ON)
Rugged and Reliable
Compact industry standard SOT-23 surface mount
package
G
D
S
SOT-23
D
S
G
Absolute Maximum Ratings T
A
=25
o
C unless otherwise noted
Symbol Parameter Ratings Units
V
DSS
Drain-Source Voltage 50 V
V
GSS
Gate-Source Voltage ±20 V
I
D
Drain Current – Continuous (Note 1) 0.22 A
Pulsed 0.88
Maximum Power Dissipation (Note 1) 0.36 W
P
D
Derate Above 25°C 2.8 mW/°C
T
J
, T
STG
Operating and Storage Junction Temperature Range 55 to +150 °C
T
L
Maximum Lead Temperature for Soldering
Purposes, 1/16” from Case for 10 Seconds 300 °C
Thermal Characteristics
R
θJA
Thermal Resistance, Junction-to-Ambient (Note 1) 350 °C/W
Package Marking and Ordering Information
Device Marking Device Reel Size Tape width Quantity
SS BSS138 7’’ 8mm 3000 units
BSS138
BSS138 Rev C(W)
Electrical Characteristics T
A
= 25°C unless otherwise noted
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BV
DSS
Drain–Source Breakdown Voltage V
GS
= 0 V, I
D
= 250 µA 50 V
BV
DSS
T
J
Breakdown Voltage Temperature
Coefficient I
D
= 250 µA,Referenced to 25°C
72
mV/°C
I
DSS
Zero Gate Voltage Drain Current V
DS
= 50 V, V
GS
= 0 V 0.5 µA
V
DS
= 50 V, V
GS
= 0 V T
J
= 125°C 5
µA
V
DS
= 30 V, V
GS
= 0 V 100 nA
I
GSS
Gate–Body Leakage. V
GS
= ±20 V, V
DS
= 0 V
±100 nA
On Characteristics
(Note 2)
V
GS(th)
Gate Threshold Voltage V
DS
= V
GS
, I
D
= 1 mA 0.8 1.3 1.5V
V
GS(th)
T
J
Gate Threshold Voltage
Temperature Coefficient I
D
= 1 mA,Referenced to 25°C
–2
mV/°C
R
DS(on)
Static Drain–Source
On–Resistance V
GS
= 10 V, I
D
= 0.22 A
V
GS
= 4.5 V, I
D
= 0.22 A
V
GS
= 10 V, I
D
= 0.22 A, T
J
= 125°C
0.7
1.0
1.1
3.5
6.0
5.8
I
D(on)
On–State Drain Current V
GS
= 10 V, V
DS
= 5 V 0.2 A
g
FS
Forward Transconductance V
DS
= 10V, I
D
= 0.22 A 0.12 0.5 S
Dynamic Characteristics
C
iss
Input Capacitance 27 pF
C
oss
Output Capacitance 13 pF
C
rss
Reverse Transfer Capacitance
V
DS
= 25 V, V
GS
= 0 V,
f = 1.0 MHz
6 pF
R
G
Gate Resistance V
GS
= 15 mV, f = 1.0 MHz 9
Switching Characteristics
(Note 2)
t
d(on)
Turn–On Delay Time 2.5 5 ns
t
r
Turn–On Rise Time 9 18 ns
t
d(off)
Turn–Off Delay Time 20 36 ns
t
f
Turn–Off Fall Time
V
DD
= 30 V, I
D
= 0.29 A,
V
GS
= 10 V, R
GEN
= 6
7 14 ns
Q
g
Total Gate Charge 1.7 2.4 nC
Q
gs
Gate–Source Charge 0.1 nC
Q
gd
Gate–Drain Charge
V
DS
= 25 V, I
D
= 0.22 A,
V
GS
= 10 V
0.4 nC
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current 0.22 A
V
SD
Drain–Source Diode Forward
Voltage V
GS
= 0 V, I
S
= 0.44 A(Note 2) 0.8 1.4 V
Notes:
1. R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) 350°C/W when mounted on a
minimum pad..
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width 300 µs, Duty Cycle 2.0%
BSS138
BSS138 Rev C(W)
Typical Characteristics
0
0.2
0.4
0.6
0.8
1
00.511.522.53
V
DS, DRAIN TO SOURCE VOLTAGE (V)
ID, DRAIN CURRENT (A)
V
GS
= 10V
2.0V
3.0V
2.5V
6.0V 4.5V 3.5V
0.6
1
1.4
1.8
2.2
2.6
3
3.4
0 0.2 0.4 0.6 0.8 1
I
D
, DRAIN CURRENT (A)
R
DS(ON)
, NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
V
GS
= 2.5V
4.5V
3.0V
4.0V
3.5V
6.0V
10V
Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with
Drain Current and Gate Voltage.
0.6
0.8
1
1.2
1.4
1.6
1.8
2
-50 -25 0 25 50 75 100 125 150
T
J
, JUNCTION TEMPERATURE (
o
C)
R
DS(ON)
, NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
I
D
= 220mA
V
GS
= 10V
0.5
1.1
1.7
2.3
2.9
3.5
4.1
0246810
V
GS
, GATE TO SOURCE VOLTAGE (V)
R
DS(ON)
, ON-RESISTANCE (OHM)
I
D
= 110mA
T
A
= 125
o
C
T
A
= 25
o
C
Figure 3. On-Resistance Variation with
Temperature. Figure 4. On-Resistance Variation with
Gate-to-Source Voltage.
0
0.1
0.2
0.3
0.4
0.5
0.6
0.511.522.533.5
V
GS
, GATE TO SOURCE VOLTAGE (V)
I
D
, DRAIN CURRENT (A)
T
A
= -55
o
C25
o
C
125
o
C
V
DS
= 10V
0.0001
0.001
0.01
0.1
1
0 0.2 0.4 0.6 0.8 1 1.2
V
SD
,
BODY DIODE FORWARD VOLTAGE (V)
I
S
, REVERSE DRAIN CURRENT (A)
V
GS
= 0V
T
A
= 125
o
C
25
o
C
-55
o
C
Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation
with Source Current and Temperature.
BSS138
BSS138 Rev C(W)
Typical Characteristics
0
2
4
6
8
10
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
Q
g
, GATE CHARGE (nC)
V
GS
, GATE-SOURCE VOLTAGE (V)
I
D
= 220mA V
DS
= 8V 25V
30V
0
20
40
60
80
100
0 1020304050
V
DS
, DRAIN TO SOURCE VOLTAGE (V)
CAPACITANCE (pF)
C
ISS
C
OSS
C
RSS
f = 1 MHz
V
GS
= 0 V
Figure 7. Gate Charge Characteristics. Figure 8. Capacitance Characteristics.
0.001
0.01
0.1
1
10
0.1 1 10 100
V
DS
, DRAIN-SOURCE VOLTAGE (V)
ID, DRAIN CURRENT (A)
DC
1s
100ms
100
µ
s
R
DS(ON)
LIMIT
V
GS
= 10V
SINGLE PULSE
R
θJA
= 350
o
C/W
T
A
= 25
o
C
10ms
1ms
0
1
2
3
4
5
0.001 0.01 0.1 1 10 100 1000
t
1
, TIME (sec)
P(pk), PEAK TRANSIENT POWER (W)
SINGLE PULSE
R
θJA
= 350°C/W
T
A
= 25°C
Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum
Power Dissipation.
0.001
0.01
0.1
1
0.0001 0.001 0.01 0.1 1 10 100 1000
t
1
, TIME (sec)
r(t), NORMALIZED EFFECTIVE TRANSIENT
THERMAL RESISTANCE
R
θJA
(t) = r(t) * R
θJA
R
θJA
= 350
o
C/W
T
J
- T
A
= P * R
θJA
(t)
Duty Cycle, D = t
1
/ t
2
P(pk)
t
1
t
2
SINGLE PULSE
0.01
0.02
0.05
0.1
0.2
D = 0.5
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1a.
Transient thermal response will change depending on the circuit board design.
BSS138
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
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In Design
First Production
Full Production
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