BSS84 Datasheet. Www.s Manuals.com. Diodes

User Manual: Marking of electronic components, SMD Codes C8, C8*, C8***, C8-**, C8-***, C84, C8=**, C8=***, C8A, C8B, C8C, C8D, C8E, C8F, C8G, C8H, C8J, C8K, C8L, C8M, C8N, C8P, C8Q, C8R, C8S, C8T, C8U, C8V, C8W, C8X, C8Y, C8Z. Datasheets BSS84, BZX585-B4V7, CMPZ5226B, CMPZ5227B, CMPZ5228B, CMPZ5229B, CMPZ5230B, CMPZ5231B, CMPZ5232B, CMPZ5233B, CMPZ5234B, CMPZ5235B, CMPZ5236B, CMPZ5237B, CMPZ5238B, CMPZ5239B, CMPZ5240B, CMPZ5241B, CMPZ5242B, CMPZ5243B, CMPZ5244B, CMPZ5245B, CMPZ5246B, CMPZ5247B, CMPZ5248B, CMPZ5249B, RT

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BSS84
P-CHANNEL ENHANCEMENT MODE MOSFET

Product Summary

Features and Benefits

V(BR)DSS

RDS(on) max

-50V

10 @ VGS = -5V

ID
TA = +25°C
-130mA

Description
This MOSFET has been designed to minimize the on-state resistance
(RDS(on)) and yet maintain superior switching performance, making it



Low On-Resistance



Low Gate Threshold Voltage



Low Input Capacitance



Fast Switching Speed



Low Input/Output Leakage



Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)



Halogen and Antimony Free. “Green” Device (Note 3)



Qualified to AEC-Q101 Standards for High Reliability

ideal for high efficiency power management applications.

Mechanical Data

Applications



Case: SOT23



General Purpose Interfacing Switch



Case Material: UL Flammability Classification Rating 94V-0



Power Management Functions



Moisture Sensitivity: Level 1 per J-STD-020



Analog Switch



Terminals: Matte Tin Finish (Lead Free Plating) Solderable per
MIL-STD-202, Method 208 e3



Terminal Connections: See Diagram



Weight: 0.008 grams (approximate)

Drain

SOT23
D
Gate

S

G
Source

Top View

Top View

Equivalent Circuit

Ordering Information (Note 4)
Part Number
BSS84-7-F
BSS84Q-7-F
BSS84-13-F
BSS84Q-13-F
Notes:

Qualification
Commercial
Automotive
Commercial
Automotive

Case
SOT23
SOT23
SOT23
SOT23

Packaging
3000/Tape & Reel
3000/Tape & Reel
10000/Tape & Reel
10000/Tape & Reel

1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html

K84

Date Code Key
Year
Code
Month
Code

1998
J
Jan
1

1999
K
Feb
2

BSS84
Document number: DS30149 Rev. 18 - 2

2000
L

C84

2001
M
Mar
3

2002
N
Apr
4

YM

YM

Marking Information

2003
P
May
5

K = SAT (Shanghai Assembly / Test site)
C = CAT (Chengdu Assembly / Test site)
84 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: N = 2002)
M = Month (ex: 9 = September)
2004
R

…
…

Jun
6

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2011
Y
Jul
7

2012
Z
Aug
8

2013
A
Sep
9

2014
B
Oct
O

2015
C

2016
D
Nov
N

2017
E
Dec
D

February 2013
© Diodes Incorporated

BSS84

Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Drain-Gate Voltage RGS  20K
Gate-Source Voltage
Drain Current (Note 5)
Pulsed Drain Current

Thermal Characteristics

Symbol
VDSS
VDGR
VGSS
ID
IDM

Continuous
Continuous

Value
-50
-50
20
-130
-1.2

Units
V
V
V
mA
A

Value
300
417
-55 to +150

Units
mW
C/W
C

(@TA = +25°C, unless otherwise specified.)

Characteristic
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range

Symbol
PD
RJA
TJ, TSTG

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage

Symbol

Min

Typ

Max

Unit

BVDSS

-50








-1
-2
-100

µA
µA
nA

10

nA

VGS = 0V, ID = -250µA
VDS = -50V, VGS = 0V, TJ = +25°C
VDS = -50V, VGS = 0V, TJ = +125°C
VDS = -25V, VGS = 0V, TJ = +25°C
VGS = 20V, VDS = 0V

V

Test Condition

Zero Gate Voltage Drain Current

IDSS

Gate-Body Leakage
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
SWITCHING CHARACTERISTICS (Note 7)
Turn-On Delay Time
Turn-Off Delay Time

IGSS






VGS(th)
RDS (ON)
gFS

-0.8

0.05





-2.0
10


V

S

VDS = VGS, ID = -1mA
VGS = -5V, ID = -0.100A
VDS = -25V, ID = -0.1A

Ciss
Coss
Crss









45
25
12

pF
pF
pF

VDS = -25V, VGS = 0V, f = 1.0MHz

tD(ON)
tD(OFF)




10
18




ns
ns

VDD = -30V, ID = -0.27A,
RGEN = 50, VGS = -10V

Notes:

5. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001,
which can be found on our website at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing

BSS84
Document number: DS30149 Rev. 18 - 2

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© Diodes Incorporated

BSS84

-600

400

ID, DRAIN-SOURCE CURRENT (mA)

PD, POWER DISSIPATION (mW)

350
300
250
200
150
100
50
0

-500

-400

-300

-200

-100
0
0

50
75 100 125 150 175 200
TA, AMBIENT TEMPERATURE (°C)
Fig. 1 Max Power Dissipation vs. Ambient Temperature
0

25

-1
-2
-3
-4
-5
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 2 Drain-Source Current vs. Drain-Source Voltage

-1.0

RDS(ON), NORMALIZED DRAIN-SOURCE
ON-RESISTANCE ()

10

ID, DRAIN-CURRENT (A)

-0.8

-0.6

-0.4

-0.2

0.0
0

9
8
7
6
5
4
3
2

0

-1

-2
-3
-4
-5
-6
-7
-8
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 3 Drain-Current vs. Gate-Source Voltage

15

TA = 125°C

1
TA = 25°C

0

-2
-3
-4
-5
VGS, GATE-SOURCE (V)
Fig. 4 On-Resistance vs. Gate-Source Voltage
-1

25.0
VGS = -10V
ID = -0.13A

RDS(ON), ON-RESISTANCE ()

RDS(ON), ON-RESISTANCE ()

12

9

6

3

0
-50

-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Fig. 5 On-Resistance vs. Junction Temperature

BSS84
Document number: DS30149 Rev. 18 - 2

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20.0

15.0

10.0

5.0

0.0
0.0

-0.2

-0.4
-0.6
-0.8
ID, DRAIN-CURRENT (A)
Fig. 6 On-Resistance vs. Drain-Current

-1.0

February 2013
© Diodes Incorporated

BSS84

Package Outline Dimensions

A

SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.903 1.10
1.00
K1
0.400
L
0.45
0.61
0.55
M
0.085 0.18
0.11
0°
8°

All Dimensions in mm

B C

H
K
J

M

K1
F

D
L

G

Suggested Pad Layout

Y
Z

C

X

BSS84
Document number: DS30149 Rev. 18 - 2

Dimensions Value (in mm)
Z
2.9
X
0.8
Y
0.9
C
2.0
E
1.35

E

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© Diodes Incorporated

BSS84

IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com

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Document number: DS30149 Rev. 18 - 2

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