Configurator PRIMERGY BX2560 M1 BX600 Cnfg BX2560M1

User Manual: PRIMERGY BX600

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PRIMERGY BX2560 M1
System configurator and order-information guide
Contents
Instructions
Configuration diagram
Configurator
10 XBX2560 M1 Dual Socket 20
11 XI Processor 21
12 XII Storage
13 XIII Memory
14 XIV iRMC S4, Graphics
15 XV
Mezzanine Cards
16
PRIMERGY Server
System configurator and order-information guide
PRIMERGY BX2560 M1 Status: 2016-04-01
This document contains basic product and configuration information that will enable you to configure your system via
System-Architect.
Only the tool "System-Arcitect" will ensure a fast and proper configuration of your PRIMERGY server or your complete
PRIMERGY Rack system.
Please pay attention to the naming conventions:
BX2560 M1
Dual Server Blade M1
You can configure your individual PRIMERGY server in order to adjust your specific requirements.
The System configurator is divided into several chapters that are identical to the current price list and PC-/ System-Architect.
Please follow the lines. If there is a junction, you can choose which way or component you would like to take. Go through
the configurator by following the lines from the top to the bottom.
Section IV Memory, example
There are 3 free memory banks available.
The memory banks can be populated with 512MB, 1GB, 2GB and 4GB DDR Memory.
The maximum total amount of memory is 12GB.
It is possible to select memory upgrade options up to 3 times.
ECC with memory scrubbing-function and hot-spare memorybank is standard on the PRIMERGY BX600 S2 Server Blades.
S26361-XXX-XXX S26361-XXX-XXX
Memory XXX MB Memory XXX MB
X times
max. X times per system max. X times per system
In one chapter you can only select as many components (here 3x) as the arrow indicates. 3x
Please note that there are information symbols which indicate necessary information.
For further information see:
http://ts.fujitsu.com/products/standard_servers/index.html
(internet)
https://partners.ts.fujitsu.com/com/order-supply/configurators/primergy_config/Pages/Currentconfigurators.aspx
(extranet)
Prices and availability see price list and PC-/ System-Architect
Subject to change and errors excepted
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Configuration diagram Dual Server Blade BX2560 M1
Mezzanine slot 1
upper
CPU1 Row 1 (4 DIMMS)
SAS 2.5"
or HDD dummy frame
Intel CPU lower
Row 2 (4 DIMMS)
SAS 2.5"
or HDD dummy frame
Mezzanine slot 2
Disk drives
CPU2 Row 1 (4 DIMMS) LSI HW Raid Ctrl.
Intel CPU Flash Backup Unit
Row 2 (4 DIMMS)
SATADOM
UFM
Processor
Memory Mezzanine slot Storage Options
Key:
Included in basic unit
Option
The population order for the CPU is: CPU1 first, then CPU2
The population order for the DIMMs: for each CPU, the DIMM row 1 (DIMMS 1A 1B 1C 1D) (DIMMS1E 1F 1G 1H) first,
then row 2 (DIMMs 2A 2B 2C 2D) (DIMMs 2E 2F 2G 2H)
or unpopulated
FC Mezz. card
1/10 GbE Mezz. card
IB Mezz. card
CNA Mezz. Card
or
unpopulated
FC Mezz. card
1/10 GbE Mezz. card
IB Mezz. card
CNA Mezz. Card
SAS Mezz. Card
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Section
X
Dual Socket Server Blade BX2560 M1
Server Blade with:
- Dual INTEL E5-26xxv3 Processor Support
- The base units with INTEL C610 chipset
- onbaord controller for SATA
- 16 DIMM sockets, organized in 2 DPC for each CPU (8 DIMMs per CPU)
- 1x Dual channel 10 Gbit Ethernet CNA controller on-board
- 2 bays for optional hot plug 2.5" SATA/ SAS HDD/ SSD or PCIe SSD
- iRMC S4 on-board
- Special connector for Y-cable (4x USB, 1 x serial 1x VGA).
The BX2560 M1 Server Blade can be installed max. 18x in the BX900 System Unit
The BX2560 M1 Server Blade can be installed max. 8x in the BX400 System Unit
S26361-K1466-V200 S26361-F4478-L2
PY BX2560 M1 Dual Server Blade PY BX900 Y-Cable frontside
up to 2x 2.5" hot plug drives.
for KVM connection to
Dual Server Blade Base Unit without Server Blade
18x CPU and without memory modules! 2x USB, 1x VGA, 1x seriell
For CPU and Memory configuration see below
Max. 18x per BX900 System Unit.
Max. 8x per BX400 System Unit.
S26361-F3552-E6
TPM Module
Trusted Platform Module on motherboard
PY TPM Module
Be aware of import restrictions!
Max. 1x per Server Blade.
S26361-F1790-E310
embedded Lifecycle Manager (eLCM)
SD-Card (min. Class 10)
SD-Card connected to iRMC to support e.g.
Backup/Restore function, eLCM, etc.
Max. 1x per Server Blade.
Following USB Components are available
1) USB DVD SM / Blu-Ray
External Blu-Ray Drive (as soon as available) S26341-F103-L120
2) USB Mouse:
S26381-K415-L100
Optical Wheel Mouse Tilt USB/PS2
3) USB Memorybird:
MyUSB P910 8GB (as soon as available)
MyUSBS A910 8GB, MLC Flash S26391-F6048-L208
MyUSB P910 8GB (as soon as available)
MyUSBS A910 16GB, MLC Flash S26391-F6048-L216
S26361-F2749-E1 S26361-F2749-E2
Service for Server Blade installation in the System Unit. Server Blade individually packed / delivered.
Hereby the BX900 S1 will be delivered completely The Server Blade is not built in a BX900 S1,
configured and tested with Server Blades integrated.
it is separately tested and delivered.
This order number must be in the same order as the System Unit itself.
Contains ServerStart CD
min. 1x per System Unit; max. 18x per System Unit; max. 1x per Server Blade max. 1x per Server Blade
E
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Section
XI Processor
There are 2 processor sockets available.
The first socket must always be equipped with the first CPU which can be selected via configurator
Two processors with different clock frequencies are not possible
For CPU types E5-2637v3, E5-2643v3, E5-2667v3, E5-2697v3 and E5-2699v3
a larger heat sink is necessary for first CPU due to thermal conditions.
This leads to a limitation of CPU1´s memory array to 6 DIMM modules.
This follows the memory array of a single CPU configuration is limited to 6 DIMM modules
and the memory array of a dual CPU configuration is limited to 14 DIMM modules.
Max. two CPU`s can be selected per basic unit
One of following CPU´s can be selected once (only as first CPU)
for an orderable basic unit
Optional second CPU has to be the same type like the first CPU Max. DDR4 Bus Speed depends on:
Xeon E5-2600v3 (R) Basic - max. DDR4 Bus Speed from the CPU and
- 1x 64-bit Intel Xeon (15MB Smart Cache) - max. DDR4 Memory Speed and
1600 MHz DDR4 Bus; 6.4 GT/s QPI Bus - max. memory modules on one memory channel
occupies socket for one CPU
For CPUs which do not offer 1866 MHz support,
Xeon E5-2603v3 6C/6T 1.60GHz 15MB 6.4GT/s 1600MHz 85W S26361-F3849-E103
(Basic, Standard & Low Power class),
Xeon E5-2609v3 6C/6T 1.90GHz 15MB 6.4GT/s 1600MHz 85W S26361-F3849-E109 System Architect will not offer memory modules
Xeon E5-2600v3 (R) Standard supporting this frequency.
- 1x 64-bit Intel Xeon (15/20MB Smart Cache); Hyper-Threading (HT);
1866 MHz DDR4 Bus; 8.0 GT/s QPI Bus
occupies socket for one CPU
Xeon E5-2620v3 6C/12T 2.40GHz 15MB 8.0GT/s 1866MHz 85W S26361-F3849-E120
Xeon E5-2630v3 8C/16T 2.40GHz 20MB 8.0GT/s 1866MHz 85W S26361-F3849-E130
Xeon E5-2640v3 8C/16T 2.60GHz 20MB 8.0GT/s 1866MHz 90W S26361-F3849-E140
Xeon E5-2600v3 (R) Advanced
- 1x 64-bit Intel Xeon (25/30MB Smart Cache); Hyper-Threading (HT);
2133 MHz DDR4 Bus; 9.6 GT/s QPI Bus
occupies socket for one CPU
Xeon E5-2650v3 10C/20T 2.30GHz 25MB 9.6GT/s 2133MHz 105W S26361-F3849-E150
Xeon E5-2600v3 (R) Frequency Optimized
- 1x 64-bit Intel Xeon (10-20MB Smart Cache); Hyper-Threading (HT);
1866 & 2133 MHz DDR4 Bus; 8.0 & 9.6 GT/s QPI Bus
occupies socket for one CPU
Xeon E5-2623v3 4C/8T 3.00GHz 10MB 8.0GT/s 1866MHz 105W S26361-F3849-E123
Xeon E5-2600v3 (R) Advanced
- 1x 64-bit Intel Xeon (25/30MB Smart Cache); Hyper-Threading (HT);
2133 MHz DDR4 Bus; 9.6 GT/s QPI Bus
occupies socket for one CPU
Xeon E5-2660v3 10C/20T 2.60GHz 25MB 9.6GT/s 2133MHz 105W S26361-F3849-E160
Xeon E5-2670v3 12C/24T 2.30GHz 30MB 9.6GT/s 2133MHz 120W S26361-F3849-E170
Xeon E5-2680v3 12C/24T 2.50GHz 30MB 9.6GT/s 2133MHz 120W S26361-F3849-E180
Xeon E5-2690v3 12C/24T 2.60GHz 30MB 9.6GT/s 2133MHz 135W S26361-F3849-E190
Xeon E5-2600v3 (R) Frequency Optimized
- 1x 64-bit Intel Xeon (10-20MB Smart Cache); Hyper-Threading (HT);
1866 & 2133 MHz DDR4 Bus; 8.0 & 9.6 GT/s QPI Bus
occupies socket for one CPU
Xeon E5-2637v3 4C/8T 3.50GHz 15MB 9.6GT/s 2133MHz 135W S26361-F3849-E137
Xeon E5-2643v3 6C/12T 3.40GHz 20MB 9.6GT/s 2133MHz 135W S26361-F3849-E143
Xeon E5-2667v3 8C/16T 3.20GHz 20MB 9.6GT/s 2133MHz 135W S26361-F3849-E167
Xeon E5-2600v3 (R) High Core Count
- 1x 64-bit Intel Xeon (35-40MB Smart Cache); Hyper-Threading (HT);
2133 MHz DDR4 Bus; 9.6 GT/s QPI Bus
occupies socket for one CPU
Xeon E5-2683v3 14C/28T 2.00GHz 35MB 9.6GT/s 2133MHz 120W S26361-F3849-E183
Xeon E5-2695v3 14C/28T 2.30GHz 35MB 9.6GT/s 2133MHz 120W S26361-F3849-E195
Xeon E5-2697v3 14C/28T 2.60GHz 35MB 9.6GT/s 2133MHz 145W S26361-F3849-E197
Xeon E5-2698v3 16C/32T 2.30GHz 40MB 9.6GT/s 2133MHz 135W S26361-F3849-E198
Xeon E5-2699v3 18C/36T 2.30GHz 45MB 9.6GT/s 2133MHz 145W S26361-F3849-E199
Xeon E5-2600v3 (R) Low Power
- 1x 64-bit Intel Xeon (20/30MB Smart Cache); Hyper-Threading (HT);
1866/2133 MHz DDR4 Bus; 8.0/9.6 GT/s QPI Bus
occupies socket for one CPU
Xeon E5-2630Lv3 8C/16T 1.80GHz 20MB 8.0GT/s 1866MHz 55W S26361-F3849-E131
Xeon E5-2650Lv3 12C/24T 1.80GHz 30MB 9.6GT/s 2133MHz 65W S26361-F3849-E151
S26361-F3849-E100
Cooling Kit 2nd CPU
E1 E2
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One of following CPU´s has to be selected as second CPU
Optional second CPU has to be the same type like the first CPU
Xeon E5-2600v3 (R) Basic
- 1x 64-bit Intel Xeon (15MB Smart Cache)
1600 MHz DDR4 Bus; 6.4 GT/s QPI Bus
occupies socket for one CPU
Xeon E5-2603v3 6C/6T 1.60GHz 15MB 6.4GT/s 1600MHz 85W S26361-F3849-E103
Xeon E5-2609v3 6C/6T 1.90GHz 15MB 6.4GT/s 1600MHz 85W S26361-F3849-E109
Xeon E5-2600v3 (R) Standard
- 1x 64-bit Intel Xeon (15/20MB Smart Cache); Hyper-Threading (HT);
1866 MHz DDR4 Bus; 8.0 GT/s QPI Bus
occupies socket for one CPU
Xeon E5-2620v3 6C/12T 2.40GHz 15MB 8.0GT/s 1866MHz 85W S26361-F3849-E120
Xeon E5-2630v3 8C/16T 2.40GHz 20MB 8.0GT/s 1866MHz 85W S26361-F3849-E130
Xeon E5-2640v3 8C/16T 2.60GHz 20MB 8.0GT/s 1866MHz 90W S26361-F3849-E140
Xeon E5-2600v3 (R) Advanced
- 1x 64-bit Intel Xeon (25/30MB Smart Cache); Hyper-Threading (HT);
2133 MHz DDR4 Bus; 9.6 GT/s QPI Bus
occupies socket for one CPU
Xeon E5-2650v3 10C/20T 2.30GHz 25MB 9.6GT/s 2133MHz 105W S26361-F3849-E150
Xeon E5-2660v3 10C/20T 2.60GHz 25MB 9.6GT/s 2133MHz 105W S26361-F3849-E160
Xeon E5-2670v3 12C/24T 2.30GHz 30MB 9.6GT/s 2133MHz 120W S26361-F3849-E170
Xeon E5-2680v3 12C/24T 2.50GHz 30MB 9.6GT/s 2133MHz 120W S26361-F3849-E180
Xeon E5-2690v3 12C/24T 2.60GHz 30MB 9.6GT/s 2133MHz 135W S26361-F3849-E190
Xeon E5-2600v3 (R) Frequency Optimized
- 1x 64-bit Intel Xeon (10-20MB Smart Cache); Hyper-Threading (HT);
1866 & 2133 MHz DDR4 Bus; 8.0 & 9.6 GT/s QPI Bus
occupies socket for one CPU
Xeon E5-2623v3 4C/8T 3.00GHz 10MB 8.0GT/s 1866MHz 105W S26361-F3849-E123
Xeon E5-2637v3 4C/8T 3.50GHz 15MB 9.6GT/s 2133MHz 135W S26361-F3849-E137
Xeon E5-2643v3 6C/12T 3.40GHz 20MB 9.6GT/s 2133MHz 135W S26361-F3849-E143
Xeon E5-2667v3 8C/16T 3.20GHz 20MB 9.6GT/s 2133MHz 135W S26361-F3849-E167
Xeon E5-2600v3 (R) High Core Count
- 1x 64-bit Intel Xeon (35-40MB Smart Cache); Hyper-Threading (HT);
2133 MHz DDR4 Bus; 9.6 GT/s QPI Bus
occupies socket for one CPU
Xeon E5-2683v3 14C/28T 2.00GHz 35MB 9.6GT/s 2133MHz 120W S26361-F3849-E183
Xeon E5-2695v3 14C/28T 2.30GHz 35MB 9.6GT/s 2133MHz 120W S26361-F3849-E195
Xeon E5-2697v3 14C/28T 2.60GHz 35MB 9.6GT/s 2133MHz 145W S26361-F3849-E197
Xeon E5-2698v3 16C/32T 2.30GHz 40MB 9.6GT/s 2133MHz 135W S26361-F3849-E198
Xeon E5-2699v3 18C/36T 2.30GHz 45MB 9.6GT/s 2133MHz 145W S26361-F3849-E199
Xeon E5-2600v3 (R) Low Power
- 1x 64-bit Intel Xeon (20/30MB Smart Cache); Hyper-Threading (HT);
1866/2133 MHz DDR4 Bus; 8.0/9.6 GT/s QPI Bus
occupies socket for one CPU
Xeon E5-2630Lv3 8C/16T 1.80GHz 20MB 8.0GT/s 1866MHz 55W S26361-F3849-E131
Xeon E5-2650Lv3 12C/24T 1.80GHz 30MB 9.6GT/s 2133MHz 65W
S26361-F3849-E151
Separate orderable CPU upgrade kits
S26361-F3849-L603 Xeon E5-2603v3 6C/6T 1.60GHz 15MB 6.4GT/s 1600MHz 85W
S26361-F3849-L609 Xeon E5-2609v3 6C/6T 1.90GHz 15MB 6.4GT/s 1600MHz 85W
S26361-F3849-L620 Xeon E5-2620v3 6C/12T 2.40GHz 15MB 8.0GT/s 1866MHz 85W
S26361-F3849-L630 Xeon E5-2630v3 8C/16T 2.40GHz 20MB 8.0GT/s 1866MHz 85W
S26361-F3849-L640 Xeon E5-2640v3 8C/16T 2.60GHz 20MB 8.0GT/s 1866MHz 90W
Special Release only S26361-F3849-L643 Xeon E5-2643v3 6C/12T 3.40GHz 20MB 9.6GT/s 2133MHz 135W
S26361-F3849-L650 Xeon E5-2650v3 10C/20T 2.30GHz 25MB 9.6GT/s 2133MHz 105W
S26361-F3849-L623 Xeon E5-2623v3 4C/8T 3.00GHz 10MB 8.0GT/s 1866MHz 105W
E3
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Section
XII
Storage / RAID Functionality on Server Blade
One UFM can be installed independent from the disk drives
Remark: UFM is part of the VMWare Embedded solution (26361-F2341-E433)
Configuration Hint - Second CPU needed for PCIe x4 Gen3 SSD/HDD Option
The PCIe HDD/SSD Option is only supported if the second CPU is installed
Please refer the following configuration matrix for your desired confuration.
S26361-F3823-E410
S26361-F3823-E400
S26361-F4008-E100 S26361-F4008-E101
PRAID EM400i
PRAID CM400i PCH connection Kit PCIe x4 Gen3
PY SAS 12G RAID HDD Module
PY SAS 12G RAID HDD Module supports up to 2 HDD/SSD
w/ 1 GB Cache w/o Cache connected to onboard PCH
MegaRAID MegaRAID
RAID level 0/1/1E/10/5/50/6/60 RAID level 0/1/10 Hint: 2nd CPU is mandatory
SAS 12 Gb/sec SAS 12 Gb/sec for this Option
incl. PRAID EM400i Riser
incl. PRAID EM400i Riser
for this Option
pluggable on the main board pluggable on the main board
PCIe Gen3 interface PCIe Gen3 interface SATA interface PCIe x4 Gen3 interface
4x SAS links to midplane
2x SAS links to internal HDD's
2x PCIe x4 Gen3 links
2x SAS links to internal HDD's 2x SATA links to int. HDD's to internal HDD's
max. 1x per Server Blade max. 1x per Server Blade max. 1x per Server Blade max. 1x per Server Blade
S26361-F3823-E10
PRAID EM400i FBU
PY FBU03 Module
Flash Backup Unit
incl. FBU holder SATA HDD / SSD
PCIe-SSD / HDD
S26361-F3823-E30
PRAID EM400i Mezz
PY SAS Expander Mezzanine Card
connection to SAS CB
incl. SAS cable
S26361-F3823-E20
S26361-F3823-E20
PRAID EM400i BP PRAID EM400i BP
PY SAS 12G HDD Backplane PY SAS 12G HDD Backplane
2 internal SAS links
2 internal SAS links
to PY SAS 12G RAID HDD Modul
to PY SAS 12G RAID HDD Modul
G
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Solid State Disk, Mainstream Endurance*
SSD SAS 12Gb/s 2.5" with hot plug/hot replace tray *) SSD Mainstream Endurance
200GB, Enterprise Performance S26361-F5298-E200 10DWPD over 5y
400GB, Enterprise Performance S26361-F5298-E400
800GB, Enterprise Performance S26361-F5298-E800
1 - 2x 1.6TB, Enterprise Performance S26361-F5298-E160
max. 2x per system
Solid State Disk, Mainstream Endurance*
SSD SATA 6Gb/s 2.5" with hot plug/hot replace tray *) SSD Mainstream Endurance
100GB, Mainstream Performance
S26361-F3821-E100 10DWPD over 5y
200GB, Mainstream Performance
S26361-F3821-E200
1 - 2x
400GB, Mainstream Performance
S26361-F3821-E400
800GB, Mainstream Performance
S26361-F3821-E800
max. 2x per system
Solid State Disk, Read-Intensive Endurance**
SSD SATA 6Gb/s 2.5" with hot plug/hot replace tray *) SSD Read-Intesive Endurance
1 - 2x 120GB, Read-Intensive S26361-F5525-E120
0.3DWPD over 5y
240GB, Read-Intensive S26361-F5525-E240
480GB, Read-Intensive S26361-F5525-E480
800GB, Read-Intensive S26361-F5525-E800
max. 2x per system
PCIe3.0 Solid State Disk, Mainstream Endurance*
SSD PCIe3.0 2.5" with hot plug/hot replace tray *) SSD Mainstream Endurance
800GB, MLC, NVMe, high Enterprise Performance S26361-F5534-E800 10DWPD over 5y
1 - 2x 1.6TB, MLC, NVMe, high Enterprise Performance S26361-F5534-E161
2TB, MLC, NVMe, high Enterprise Performance S26361-F5534-E201
max. 2x per system
SSD SATA DOM
32GB, Endurance=86 TBW (Seq. write) S26361-F5523-E32
64GB, Endurance=172 TBW (Seq. write) S26361-F5523-E64
1x 128GB, Endurance=345 TBW (Seq. write) S26361-F5523-E128
SATADOM is designed for use as a boot drive with the Endurance Spec. above.
Vmware not supported.
max. 1x per system
HDD SATA 6Gb/s 2.5" hot plug/hot replace
250GB 7.200rpm,<9,5ms, 64MB Cache S26361-F3816-E250
1-2x
500GB 7.200rpm,<9,5ms, 64MB Cache S26361-F3816-E500
1TB 7.200rpm,<9,5ms, 64MB Cache S26361-F3816-E100
max. 1x per system
HDD SAS 6Gb/s 2.5" hot plug/hot replace
146GB 15krpm,<4,5ms, 32MB Cache, 512n S26361-F3818-E514
300GB 10000rpm,<4,5ms, 32MB Cache, 512n S26361-F3818-E130
1 - 2x 450GB 10000rpm,<4,5ms, 32MB Cache, 512n S26361-F3818-E145
600GB 10000rpm,<4,5ms, 32MB Cache, 512n S26361-F3818-E160
900GB 10000rpm,<4,5ms, 32MB Cache, 512n S26361-F3818-E190
1.2TB 10000rpm,<4,5ms, 64MB Cache, 512n
S26361-F3818-E112
500GB 7.2krpm,<9,5ms, 64MB Cache, 512n S26361-F3817-E500
1TB 7.2krpm,<9,5ms, 64MB Cache, 512n S26361-F3817-E100
HDD SAS 12Gb/s 2.5" hot plug/hot replace
450GB 10000rpm, 128MB Cache, 512e S26361-F5543-E145
600GB 10000rpm, 128MB Cache, 512e S26361-F5543-E160
900GB 10000rpm, 128MB Cache, 512e S26361-F5543-E190
1.2TB 10000rpm, 128MB Cache, 512e S26361-F5543-E112
1.8TB 10000rpm, 128MB Cache, 512e S26361-F5543-E118
300GB 10000rpm, 128MB Cache, 512n S26361-F5550-E130
600GB 10000rpm, 128MB Cache, 512n S26361-F5550-E160
900GB 10000rpm, 128MB Cache, 512n S26361-F5550-E190
1.2TB 10000rpm, 128MB Cache, 512n S26361-F5550-E112
300GB 15krpm,<=3,1ms, 128MB Cache, 512n S26361-F5531-E530
450GB 15krpm,<=3,1ms, 128MB Cache, 512n S26361-F5531-E545
600GB 15krpm,<=3,1ms, 128MB Cache, 512n S26361-F5531-E560
max. 2x per system
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Section III Memory
- There are 8 memory slots per CPU for max.
512GB LRDIMM (8x 64GB 4R)
256GB RDIMM (8x 32GB 2R)
=> max. 1024GB for two CPU`s ( 512GB per CPU ), using LRDIMM
- The memory area is divided into 4 channels per CPU with 2 slots per channel
- Slot 1 of each channel belongs to memory bank 1, slot 2 belongs to memory bank 2
Registered and Load Reduced DIMMs can be selected
No mix of registered and load reduced modules is allowed.
Memory will be operated at 1.2V.
Depending on the CPU following memory speeds will be reached:
In a single DIMM per channel configuration 2133MHz will be supported
This is also valid for dual DIMM configurations (2133MHz)
SDDC (Chipkill) is supported for registered and load redueced x4 organized memory modules
1.) In the "Independent Channel Mode" is following configuration possible
Channels can be populated in any order in Independent Channel Mode. All four
channels may be populated in any order and have no matching requirements. All
channels must run at the same interface frequency but individual channels may run at
different DIMM timings (RAS latency, CAS latency, and so forth)
No mix of registered and load reduced modules is allowed.
2.) "Rank Sparing Mode" configuration
Within a memory channel, one rank is a spare of the other ranks.
The Spare Rank is held in reserve and is not available as system memory
For the effective memory capacity, please refer to the spreadsheet below.
The BIOS is set to the rank sparing setting.
Minimum configuration is: 2x 1R, 2x 2R or 1x4R DDR4 module per channel
3.) "Performance Mode" configuration
In this configuration, the memory module population ex factory is spread across all channels.
The BIOS is set to the max. performance for memory.
Minimum configuration is four identical modules per CPU
4.) In the "Mirrored Channel Mode" is following configuration possible
Each memory bank can optionally be equipped with four registered or load reduced DDR4 modules
In each memory bank channel A and B / C and D of CPU 1 or channel E and F / G and H of CPU 2 have to be
equipped with identical modules for mirrored channel mode.
In channel B / D is always the mirrored memory of channel A / C of CPU 1
In channel F / H is always the mirrored memory of channel E / G of CPU 2
Minimum configuration is: 4x identical modules
F1
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PRIMERGY BX2560 M1 Status: 2016-04-01
S26361-F3694-E10
Independent Mode
Independent Channel Mode allows all channels to be populated in any order. No specific Memory RAS features are defined
Requires min 1 memory Module per CPU
S26361-F3694-E1 Rank Sparing Mode Installation
BIOS Setup factory preinstalled to this mode. One Rank is spare of other ranks on the same channel. Spare Rank is not shown in System Memory.
For effective capacity within a channel, please have a look below.
1x per CPU
Requires min 2x 1R/2R or 1x 4R modules per CPU
S26361-F3694-E2 Performance Mode Installation
BIOS Setup factory preinstalled for maximum Performance, Four identical memory modules
will be equipped in one memory bank to achieve highest memory performance. All four modules are active and full capacity can be used.
Multiple of 4 identical modules to be configured per CPU
S26361-F3694-E3 Mirrored Channel Mode Installation
BIOS Setup factory preinstalled to this mode. Four identical memory modules are always equipped in one memory bank to use the
Mirrored channel Mode. Only two modules contain active data, the remain two modules contain mirrored data
Multiple of 4 identical modules to be configured per CPU
Effective Memory capacity / Rank Sparing Mode, 1 Channel populated
2R
4R
4R
Minimum one memory module or order code per CPU = first memory
Note 1)
Max. DDR4 memory speed depends on the memory configuration
(No of mem modules per channel) as well as on the CPU type.
The memory channel with the lowest speed defines the speed
of all CPU channels in the system, also for the channels of the
second CPU if configured.
For real memory speed (depending on memory type / population),
please check the spreadsheet "Memory speed" below
Note 2)
Mix of memory modules is only possible within the same group
Registered Memory (RDIMM) with SDDC (chipkill) support
- one DDR4 registered ECC memory Module, 1.2V
Choose up to 8 order codes per CPU
8GB (1x8GB) 1Rx4 DDR4-2133 R ECC S26361-F3843-E614
16GB (1x16GB) 2Rx4 DDR4-2133 R ECC
S26361-F3843-E616
32GB (1x32GB) 2Rx4 DDR4-2133 R ECC
S26361-F3843-E617
as soon as available
Registered Memory (RDIMM) no SDDC (chipkill) support
8x per - one DDR4 registered ECC memory Module, 1.2V
CPU, max. Choose up to 8 order codes per CPU
2 modules 8GB (1x8GB) 2Rx8 DDR4-2133 R ECC S26361-F3843-E615
per channel Load Reduced Memory (LRDIMM) with SDDC (chipkill) support
- one DDR4 load reduced ECC memory Module, 1.2V
Choose up to 8 order codes per CPU
32GB (1x32GB) 4Rx4 DDR4-2133 LR ECC S26361-F3844-E617
64GB (1x64GB) 4Rx4 DDR4-2133 LR ECC S26361-F3844-E618
as soon as available
G
2DPC
8GB
24GB
48GB
56GB
32GB
64GB
1DPC
24GB
112GB
RDIMM
LRDIMM
8GB
1R
16GB
2R
32GB
48GB
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PRIMERGY BX2560 M1 Status: 2016-04-01
Memory Configuration PRIMERGY BX2560 M1
Each CPU offers 8 Slots for DDR4 Memory Modules organised in 2 Banks and 4 Channels.
If you need more than 8 Slots you have to configure the 2nd CPU.
Depending on the amount of memory configured you can decide between 4 basic modes of operation (see explanation below).
There are 2 different kinds of DDR4 Memory Modules available: RDIMM and LRDIMM
Mix of RDIMM and LRDIMM is not allowed.
Mode Configuration Application
SDDC (chipkill) support any no yes detect multi-bit errors
Independant Channel Mode 1, 2 or 3 Modules per Bank yes yes
offers max. flexibility, upgradeability, capacity
Mirrored Channel Mode *) 4 identical Modules / Bank no yes offers maximum security
Performance Mode 4 identical Modules / Bank yes yes offers maximum performance and capacity
Rank Sparing Mode *) min. 2 Ranks / Channel no yes
balances security and capacity
*) For the delivery ex works the system will be prepared with dedicated BIOS setting.
Capacity Configuration RDIMM LRDIMM Notes
Min. Memory per CPU 1 Module / CPU with one CPU
Max. Memory per CPU 8/12 Modules / CPU with one CPU
Max. Memory per System 16/24 Modules / System 512GB
1024GB
if second CPU is configured
Memory-Speed:
Max. DDR4 memory speed depends on the memory configuration on one memory channel and the speed of the CPU
The memory channel with the lowest speed defines the speed of all CPU channels in the system
Voltage setting (BIOS)
CPU with 2133MHz DDR4 Bus
CPU with 1866MHz DDR4 Bus
CPU with 1600MHz DDR4 Bus
1R - Single Rank
4R - Quad Rank
2R - Dual Rank
8R - Eight Rank
1DPC = 1 DIMM per Channel
2DPC = 2 DIMM per Channel
Configuration hints:
- The memory sockets on the systemboard offer a color coding:
Bank I black sockets
Bank II blue sockets
- A so called Bank consits of 1 memory module on every Channel available on one CPU (examples see below)
Bank I on CPU 1/2 up to 4 memory modules connected to Channel A - H on the 1st/2nd CPU
Bank II on CPU 1/2 up to 4 memory modules connected to Channel A - E on the 1st/2nd CPU
- See below and next page for a detailed descriptions of the memory configuration supported.
Mem. Speed provided
by CPU
Real maximum memory-bus speed depending on CPU type, memory configuration (DPC)
and voltage setting (BIOS)
RDIMM
2133MHz
DPC
DPC
2133
DPC
DPC
2133
1.2V
LRDIMM
2133MHz
1.2V
1
2
1
2
1866
1866
2133
2133
1866
1866
1600
1600
1600
1600
1x32GB
8x32GB
8x64GB
RDIMM
RDIMM
LRDIMM
x8
x4
1x8GB
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1. Independent Channel Mode PRIMERGY BX2560 M1 Status: 2016-04-01
required
required if 2nd CPU is configured
Bank I Data Data Data Data Data Data Data Data optional, same type in Bank per CPU
(black sockets)
Bank II Data Data Data Data Data Data Data Data optional, any type
(blue sockets)
--------
not used
Independent Channel Mode allows all channels to be populated in any order
Can run with differently rated DIMMs and use the settings of the slowest DIMM installed in the system
2. Mirrored Channel Mode
required
required if 2nd CPU is configured
Bank I Data Mirror Data Mirror Data Mirror Data Mirror optional, same type in Bank per CPU
(black sockets)
Bank II Data Mirror Data Mirror Data Mirror Data Mirror
(blue sockets)
Mirrored Channel Mode requires identical modules on channel A,B, C, D (1st CPU) or channel E, F, G and H (2nd CPU)
50% of the capacity is used for the mirror => the available memory for applications is only half of the installed memory
If this mode is used, a multiple of 4 identical modules has to be ordered.
3. Performance Channel Mode
required
required if 2nd CPU is configured
Bank I Data Data Data Data Data Data Data Data optional, same type in Bank per CPU
(black sockets)
Bank II Data Data Data Data Data Data Data Data optional, any type
(blue sockets)
Performance Channel Mode requires identical modules on all channels of each Bank per CPU.
If this mode is used, a multiple of 4 identical modules has to be ordered.
Channel A
Channel B
Channel C
Channel D
Channel E
Channel F
Channel E
Channel F
Channel H
1st XEON CPU
2nd XEON CPU
Channel A
Channel B
Channel C
Channel D
Channel E
Channel F
Channel G
Channel H
1st XEON CPU
2nd XEON CPU
Channel G
Channel H
1st XEON CPU
2nd XEON CPU
Channel A
Channel B
Channel C
Channel D
Channel G
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4. Rank Sparing Mode PRIMERGY BX2560 M1 Status: 2016-04-01
required
required if 2nd CPU is configured
Bank I Spare Spare Spare Spare Spare Spare Spare Spare optional, same type in Channel per CPU
(black sockets)
Bank II Data Data Data Data Data Data Data Data optional, any type
(blue sockets)
Bank I R1 Spare Spare Spare Spare Spare Spare Spare Spare
required
(black)
R2 Data Data Data Data Data Data Data Data
required if 2nd CPU is configured
Bank II R1 Data Data Data Data Data Spare Spare Spare
(blue)
R2 Data Data Data Data Data Data Data Data optional, same type in Channel per CPU
optional, any type
Bank I R1 Spare Spare Spare Spare Spare Spare Spare Spare
required
(black)
R2 Data Data Data Data Data Data Data Data
R3 Data Data Data Data Data Data Data Data required if 2nd CPU is configured
R4 Data Data Data Data Data Data Data Data
optional, same type in Channel per CPU
Bank II R1 Data Data Data Data Data Spare Spare Spare
(blue)
R2 Data Data Data Data Data Data Data Data optional, any type
R3 Data Data Data Data Data Data Data Data
R4 Data Data Data Data Data Data Data Data
Rank Sparing Mode requires identical modules (same capacity and technology) within the same channel.
The available memory for applications will vary depending on configuration. Please refer to the spreadsheet above
"Effective Memory capacity with active Rank Sparing Mode". Population rule for Rank sparing mode is to achieve max.
available memory, e.g. 8 DIMMs will be spread across two channels, each with 4DPC
1st XEON CPU
2nd XEON CPU
Channel G
Channel H
1st XEON CPU
2nd XEON CPU
4-Rank Memory modules (LRDIMM)
Channel A
Channel B
Channel C
Channel F
Channel G
Channel H
Channel F
Channel G
Channel H
1st XEON CPU
Channel A
Channel B
Channel C
Channel F
Channel E
Channel D
2nd XEON CPU
2-Rank Memory modules (RDIMM)
Channel A
Channel B
Channel C
Channel D
Channel E
Channel E
Channel D
1-Rank Memory modules (RDIMM)
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Section
XIV iRMC S4, Graphics
Graphic Controller is part of the onboard Management Controller iRMC S4.
Other graphics are not possible.
The iRMC S4 advanced pack is included in the system delivery.
A corresponding license order is not necessary.
Section
XV
Mezzanine cards for Dual Socket Server Blade
The Dual Server Blade supports the following optional mezzanine cards.
A Fibre Channel Switch / Pass-Thru blade, an Ethernet LAN Switch / Pass-Thru blade,
respectively an InfiniBand switch is required in the system unit for this functionality.
S26361-F4481-E1 S26361-F4480-E1
PY SAS RAID Mezz Card 6Gb PY SAS HBA Mezz Card 6Gb SAS/HBA Mezz. Card
MegaRAID HBA
Only to be used in slot 2
SAS 2.0
SAS 2.0
pluggable on the main board pluggable on the main board
PCIe Gen2 interface
PCIe Gen2 interface
4x SAS links to midplane
4x SAS links to midplane
1x
Path redundancy is not max. 1x per Server Blade
supported!
max. 1x per Server Blade
Requires an Ethernet LAN Requires a Fibre Channel Requires an InfiniBand
Switch, IBP or Pass-Thru Switch for each channel. Switch for each Mezz Card.
Blade for each channel.
S26361-F3331-E1 S26361-F3874-E1 S26361-F4534-E1
PY Eth Mezz Card 1Gb 4 Port PY FC Mezz Card 8Gb 2 Port PY IB CX3 Mezz Card 56Gb 2 Port
2x Intel Zoar controller
Emulex LPe12002 compatible
Interface to midplane:
4x 10/100/1000 Mbit/s.
pluggable on the main board, 2x 10Gb/s(SDR), 2x 20Gb/s(DDR)
pluggable on the main board,
MC-FC82E
2x 40Gb/s(QDR) 2x 56Gb/s(FDR)
four channel 1Gbit/s
Dual channel 8Gbit/s
Dual channel 56Gbit/s each
PCIe x4 Interface PCIe x8 interface PCIe x8 interface
max. 2x per Server Blade max. 2x per Server Blade max. 2x per Server Blade
S26361-F3997-E1 S26361-F4994-E402
PY Eth Mezz Card 10Gb 2 Port PY FC Mezz Card 16Gb 2 Port
Intel 82599EB LAN Controller Emulex LPe12002 compatible
2x 10Gbit/s. pluggable on the main board,
pluggable on the main board,
MC-FC162E
0 - 2x Dual channel 10Gbit/s Dual channel 16Gbit/s
PCIe x8 Interface PCIe x8 interface
iSCSI Boot (planned) max. 2x per Server Blade
max. 2x per Server Blade
as soon as available
S26361-F3592-E532
PY CNA Mezz Card 10Gb 2 Port
Emulex OCe11102 compatible
pluggable on the main board
MC-CNA112E
Dual channel 10Gbit/s
PCIe x8 Interface
max. 2x per Server Blade
R S T U V
R: see separate BX900 System Unit configurator, sheet "1 GB Ethernet"
S: see separate BX900 System Unit configurator, sheet "10 GB Ethernet"
T: see separate BX900 System Unit configurator, sheet "Fibre Channel"
U: see separate BX900 System Unit configurator, sheet "InfiniBand"
V: see separate BX900 System Unit configurator, sheet "CB SAS"
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Change Report
Date Order number Changes
2016-02-18 Update of hint for CPU thermal restriction
2016-01-08 Memory description updated (page Memory; line 14 - 20)
2015-09-01 S26361-F3849-L643 Special Release CPU added
2015-07-21 S26361-F5550-* Added 2.5" HDD SAS 12G 10Krpm 512n
2015-06-15 CPU configuration possibilites updated
2015-05-29 S26361-F5543-E* Added 2.5" HDD SAS 12G 10Krpm 512e up to 1.8TB.
2015-04-02 S26361-F3823-E4x0 Bugfix in RAID level description
2015-01-21 S26361-F4481-E1 Bug fix; internal Links deleted
2015-01-14
S26361-F3823-E400 Puma 4 Lite connection corrected
2015-01-07 S26341-F103-L119 S36341-F103-L119 removed
2014-09-30 2DPC RDIMM configuration @ 2.133MHz available in 11/2014
2014-08-27 S26361-F3818-E5* Added 2.5" HDD SAS 6G 15Krpm 300GB, 450GB, 600GB
2014-08-27 S26361-F3992-E2 IB QDR Mezz removed due to EOL of supplier
2014-08-25 S26361-F5523-E32 Added 32GB SATADOM
2014-08-25 S26361-F5531-E5* Added 2.5" HDD SAS 12G 15Krpm 300GB, 450GB, 600GB
2014-08-25 S26361-F3818-E5* Removed 2.5" HDD SAS 6G 15Krpm 300GB, 450GB, 600GB
2014-08-25
S26361-F5525-E080 Removed 2.5" 80GB Read-Intensive SSD
2014-08-15
CPU restrictions added restictions for CPU heat sink.
2014-08-06
S26361-F1790-E310 added embeded Lifcycle Manager Module
2014-07-30
S26361-F3823-E20 correction in relation to PRAID Modules
2014-07-21 S26361-F3843-E617 32GB RDIMM available in Q1/2015 - comment added
2014-07-17 S26361-F3849-L603 Added lose CPU components
2014-07-07 S26361-F3823-E40 Riser card moved to Puma delivery unit ( S26361-F3823-E400/E410)
2014-06-04 S26361-F2341-E432 Referenz to 4GB UFM Module added
2014-05-28 S26361-F3849-E143 corrected Cache on order number S26361-F3849-E143
2014-05-14 S26361-F4481-E1 Added hint for non supported redundant path
2014-05-06 S26361-F3849-E100
Processor segment updated
2014-05-05 Update from CPU Roadmap
2014-04-25 Update from CPU Roadmap
2014-04-22 HDD and SSD order numbers updated.
2014-03020 S26361-F4994-E402 Added 16 Gb FC Mezz Card
2014-03-04 Updatet Processor Section and Memory
2014-02-21 SD-Kart added
2013-12-05 S26361-F3552-E6 Changed TPM Module
2013-03-13 First release
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