DMG2302U Datasheet. Www.s Manuals.com. Diodes

User Manual: Marking of electronic components, SMD Codes G2, G2**, G2-, G2-***, G21, G23, G28, G2=**, G2=***. Datasheets BF599, BGA2711, DMG2302U, DTD113ZK, DTD113ZU, EMG2, EUP7965-25VIR1, FMG2A, MIC5219-2.8BML, QN7002, RT9166-12GVL, RT9166-12PVL, RT9715CGQW, TC1188-SECT, UMG2N.

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DMG2302U
Document number: DS31838 Rev. 3 - 2
1 of 6
www.diodes.com
September 2013
© Diodes Incorporated
DMG2302U
N-CHANNEL ENHANCEMENT MODE MOSFET
Features
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT-23
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Finish Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Terminals Connections: See Diagram Below
Weight: 0.008 grams (approximate)
Ordering Information (Note 4)
Part Number Case Packaging
DMG2302U-7 SOT-23 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html
Marking Information
Date Code Key
Year 2009 2010 2011 2012 2013 2014 2015
Code W X Y Z A B C
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
TOP VIEW Internal Schematic TOP VIEW
D
GS
Source
Gate
Drain
G23 = Product Type Marking Code
YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)
YM = Date Code Marking for CAT (Chengdu Assembly/ Test site)
Y or Y = Year (ex: A = 2013)
M = Month (ex: 9 = September)
G23
YM
DMG2302U
Document number: DS31838 Rev. 3 - 2
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DMG2302U
Maximum Ratings @TA = +25°C unless otherwise specified
Characteristic Symbol Value Units
Drain-Source Voltage VDSS 20 V
Gate-Source Voltage VGSS ±8 V
Continuous Drain Current (Note 5) Steady
State
TA = +25°C
TA = +70°C ID 4.2
3.4 A
Pulsed Drain Current (Note 6) IDM 27 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 5) TA = +25°C
TA = +70°C PD 0.8
0.5 W
Thermal Resistance, Junction to Ambient @TA = +25°C RJA 156 °C/W
Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C
Notes: 5. Device mounted on FR-4 PCB, with minimum recommended pad layout.
6. Repetitive rating, pulse width limited by junction temperature.
Electrical Characteristics @TA = +25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage BVDSS 20 – V VGS = 0V, ID = 10A
Zero Gate Voltage Drain Current TJ = +25°C IDSS – – 1.0
A VDS = 20V, VGS = 0V
Gate-Source Leakage IGSS – – ±100 nA VGS = ±8V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage VGS
(
th
)
0.4 – 1.0 V VDS = VGS, ID = 50A
Static Drain-Source On-Resistance RDS (ON) – –
90
120 m VGS = 4.5V, ID = 3.6A
VGS = 2.5V, ID = 3.1A
Forward Transfer Admittance |Yfs| – 13 – S VDS = 5V, ID = 3.6A
Diode Forward Voltage VSD – 0.75 1.0 V VGS = 0V, IS = 1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance Ciss – 594.3 – pF
VDS = 10V, VGS = 0V,
f = 1.0MHz
Output Capacitance Coss – 64.5 – pF
Reverse Transfer Capacitance Crss – 57.7 – pF
Gate Resistance R
g
– 1.5 – VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge Q
g
– 7.0 – nC
VGS = 4.5V, VDS = 10V,
ID = 3.6A
Gate-Source Charge Q
g
s – 0.9 – nC
Gate-Drain Charge Q
g
d – 1.4 – nC
Turn-On Delay Time tD
(
on
)
– 7.4 – ns
VDD = 10V, VGS = 4.5V,
RL = 2.78, RG = 1.0
Turn-On Rise Time t
r
– 9.8 – ns
Turn-Off Delay Time tD
(
off
)
– 28.1 – ns
Turn-Off Fall Time tf – 6.7 – ns
Notes: 7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
DMG2302U
Document number: DS31838 Rev. 3 - 2
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September 2013
© Diodes Incorporated
DMG2302U
0
2
4
6
8
10
0 0.5 1 1.5 2 2.5 3
Fig. 1 Typical Output Characteristics
V , DRAIN-SOURCE VOLTAGE (V)
DS
I, D
R
AIN
C
U
R
R
EN
T
(A)
D
V = 1.2V
GS
V = 1.5V
GS
V = 2.0V
GS
V = 2.5V
GS
V = 3.0V
GS
V = 4.5V
GS
V = 8.0V
GS
0
2
4
6
8
10
0 0.5 1 1.5 2
Fig. 2 Typical Transfer Characteristics
V , GATE SOURCE VOLTAGE (V)
GS
I, D
R
AI
N
C
U
R
R
E
N
T
(A)
D
V = 5V
DS
T = -55°C
A
T = 25°C
A
T = 125°C
A
T = 150°C
A
T = 85°C
A
0.02
0.025
0.03
0.035
0.04
0.045
0.05
0.055
0.06
0.1 1 10
Fig. 3 Typical On-Resistance
vs. Drain Current and Gate Voltage
I , DRAIN-SOURCE CURRENT (A)
D
R , DRAIN-SOURCE ON-RESISTANCE ( )
DS(ON)
V = 1.8V
GS
V = 4.5V
GS
V = 2.5V
GS
0.01
0.015
0.02
0.025
0.03
0.035
0.04
0.045
0.05
0.055
0.06
024 6810
I , DRAIN CURRENT (A)
Fig. 4 Typical Drain-Source On-Resistance
vs. Drain Current and Temperature
D
R
, D
R
AI
N
-S
O
U
R
C
E
O
N
-
R
ESIS
T
A
N
C
E ( )
DS(ON)
V = 4.5V
GS
T = -55°C
A
T = 25°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
Fig. 5 On-Resistance Variation with Temperature
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE (°C)
J
0.6
0.8
1.0
1.2
1.4
1.6
1.8
, D
AIN-S
E
ON-RESISTANCE (NORMALIZED)
DS(ON)
V = 4.5V
I = 10A
GS
D
V = 2.5V
I = 5A
GS
D
Fig. 6 On-Resistance Variation with Temperature
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE (°C)
J
0
0.01
0.02
0.03
0.04
0.06
, D
AIN-S
E
N-
ESIS
AN
E ( )
DS(ON)
0.05
V = 4.5V
I = 10A
GS
D
V = 2.5V
I = 5A
GS
D
DMG2302U
Document number: DS31838 Rev. 3 - 2
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September 2013
© Diodes Incorporated
DMG2302U
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
-50 -25 0 25 50 75 100 125 150
T , AMBIENT TEMPERATURE (°C)
A
0
0.2
0.4
0.6
0.8
1.0
1.4
V,
A
E
ES
L
V
L
A
E (V)
GS(TH)
1.2
I = 1mA
D
I = 250µA
D
0
2
4
6
8
10
0 0.2 0.4 0.6 0.8 1.0 1.2
V , SOURCE-DRAIN VOLTAGE (V)
SD
Fig. 8 Diode Forward Voltage vs. Current
I, S
O
U
R
C
E
C
U
R
R
EN
T
(A)
S
T = 25°C
A
10
100
1,000
048121620
Fig. 9 Typical Capacitance
V , DRAIN-SOURCE VOLTAGE (V)
DS
C
,
C
A
P
A
C
I
T
AN
C
E (p
F
)
f = 1MHz
C
iss
C
oss
C
rss
Fig. 10 Typical Drain-Source Leakage Current
vs. Drain-Source Voltage
0 2 4 6 8 101214161820
V , DRAIN-SOURCE VOLTAGE (V)
DS
0.1
1
10
100
1,000
10,000
I, D
AIN-S
E LEAKA
E
EN
(nA)
DSS
T = -55°C
A
T = 25°C
A
T = 85°C
A
T = 125°C
A
T = 150°C
A
Fig. 11 Transient Thermal Response
t , PULSE DURATION TIME (s)
1
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000
0.001
0.01
0.1
1
r(t),
T
R
ANSIEN
T
T
H
E
R
MAL
R
ESIS
T
AN
C
E
T - T = P * R (t)
Duty Cycle, D = t /t
JA JA
12
R (t) = r(t) *
JA
R
R = 157°C/W
JA
JA
P(pk) t
1
t
2
D = 0.7
D = 0.5
D = 0.3
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
D = 0.9
D = 0.1
DMG2302U
Document number: DS31838 Rev. 3 - 2
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September 2013
© Diodes Incorporated
DMG2302U
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
SOT23
Dim Min Max Typ
A 0.37 0.51 0.40
B 1.20 1.40 1.30
C 2.30 2.50 2.40
D 0.89 1.03 0.915
F 0.45 0.60 0.535
G 1.78 2.05 1.83
H 2.80 3.00 2.90
J 0.013 0.10 0.05
K 0.890 1.00 0.975
K1 0.903 1.10 1.025
L 0.45 0.61 0.55
L1 0.25 0.55 0.40
M 0.085 0.150 0.110

All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
Dimensions Value (in mm)
Z 2.9
X 0.8
Y 0.9
C 2.0
E 1.35
XE
Y
C
Z
DMG2302U
Document number: DS31838 Rev. 3 - 2
6 of 6
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September 2013
© Diodes Incorporated
DMG2302U
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
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