Nokia 6233 Rm 145 6234 123 Service Manual 34 V1

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Nokia Customer Care

Service Manual
RM-123; RM-145 (Nokia 6233; Nokia 6234)

Mobile Terminal
Part No: 9249152 (Issue 1)

COMPANY CONFIDENTIAL

Copyright © 2006 Nokia. All rights reserved.

RM-123; RM-145
Amendment Record Sheet

Nokia Customer Care

Amendment Record Sheet
Amendment No
Original issue

Page ii

Date
04/2006

Inserted By

Comments

J Bryman

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Issue 1

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Copyright

Nokia Customer Care

Copyright
Copyright © 2006 Nokia. All rights reserved.
Reproduction, transfer, distribution or storage of part or all of the contents in this document in any form
without the prior written permission of Nokia is prohibited.
Nokia, Nokia Connecting People, and Nokia X and Y are trademarks or registered trademarks of Nokia
Corporation. Other product and company names mentioned herein may be trademarks or tradenames of
their respective owners.
Nokia operates a policy of continuous development. Nokia reserves the right to make changes and
improvements to any of the products described in this document without prior notice.
Under no circumstances shall Nokia be responsible for any loss of data or income or any special, incidental,
consequential or indirect damages howsoever caused.
The contents of this document are provided "as is". Except as required by applicable law, no warranties of
any kind, either express or implied, including, but not limited to, the implied warranties of merchantability
and fitness for a particular purpose, are made in relation to the accuracy, reliability or contents of this
document. Nokia reserves the right to revise this document or withdraw it at any time without prior notice.
The availability of particular products may vary by region.

IMPORTANT
This document is intended for use by qualified service personnel only.

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Warnings and cautions

Nokia Customer Care

Warnings and cautions

Warnings
• IF THE DEVICE CAN BE INSTALLED IN A VEHICLE, CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED
WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI-SKID BRAKING SYSTEMS. UNDER CERTAIN FAULT
CONDITIONS, EMITTED RF ENERGY CAN AFFECT THEIR OPERATION. IF NECESSARY, CONSULT THE VEHICLE DEALER/
MANUFACTURER TO DETERMINE THE IMMUNITY OF VEHICLE ELECTRONIC SYSTEMS TO RF ENERGY.
• THE PRODUCT MUST NOT BE OPERATED IN AREAS LIKELY TO CONTAIN POTENTIALLY EXPLOSIVE ATMOSPHERES,
FOR EXAMPLE, PETROL STATIONS (SERVICE STATIONS), BLASTING AREAS ETC.
• OPERATION OF ANY RADIO TRANSMITTING EQUIPMENT, INCLUDING CELLULAR TELEPHONES, MAY INTERFERE
WITH THE FUNCTIONALITY OF INADEQUATELY PROTECTED MEDICAL DEVICES. CONSULT A PHYSICIAN OR THE
MANUFACTURER OF THE MEDICAL DEVICE IF YOU HAVE ANY QUESTIONS. OTHER ELECTRONIC EQUIPMENT MAY
ALSO BE SUBJECT TO INTERFERENCE.
• BEFORE MAKING ANY TEST CONNECTIONS, MAKE SURE YOU HAVE SWITCHED OFF ALL EQUIPMENT.

Cautions
• Servicing and alignment must be undertaken by qualified personnel only.
• Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.
• Ensure solder, wire, or foreign matter does not enter the telephone as damage may result.
• Use only approved components as specified in the parts list.
• Ensure all components, modules, screws and insulators are correctly re-fitted after servicing and
alignment.
• Ensure all cables and wires are repositioned correctly.
• Never test a mobile phone WCDMA transmitter with full Tx power, if there is no possibility to perform the
measurements in a good performance RF-shielded room. Even low power WCDMA transmitters may disturb
nearby WCDMA networks and cause problems to 3G cellular phone communication in a wide area.
• During testing never activate the GSM or WCDMA transmitter without a proper antenna load, otherwise
GSM or WCDMA PA may be damaged.

Page iv

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Copyright © 2006 Nokia. All rights reserved.

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For your safety

Nokia Customer Care

For your safety

QUALIFIED SERVICE
Only qualified personnel may install or repair phone equipment.

ACCESSORIES AND BATTERIES
Use only approved accessories and batteries. Do not connect incompatible products.

CONNECTING TO OTHER DEVICES
When connecting to any other device, read its user’s guide for detailed safety instructions. Do not connect
incompatible products.

Issue 1

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Care and maintenance

Nokia Customer Care

Care and maintenance
This product is of superior design and craftsmanship and should be treated with care. The suggestions below
will help you to fulfil any warranty obligations and to enjoy this product for many years.
• Keep the phone and all its parts and accessories out of the reach of small children.
• Keep the phone dry. Precipitation, humidity and all types of liquids or moisture can contain minerals that
will corrode electronic circuits.
• Do not use or store the phone in dusty, dirty areas. Its moving parts can be damaged.
• Do not store the phone in hot areas. High temperatures can shorten the life of electronic devices, damage
batteries, and warp or melt certain plastics.
• Do not store the phone in cold areas. When it warms up (to its normal temperature), moisture can form
inside, which may damage electronic circuit boards.
• Do not drop, knock or shake the phone. Rough handling can break internal circuit boards.
• Do not use harsh chemicals, cleaning solvents, or strong detergents to clean the phone.
• Do not paint the phone. Paint can clog the moving parts and prevent proper operation.
• Use only the supplied or an approved replacement antenna. Unauthorised antennas, modifications or
attachments could damage the phone and may violate regulations governing radio devices.
All of the above suggestions apply equally to the product, battery, charger or any accessory.

Page vi

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ESD protection

Nokia Customer Care

ESD protection
Nokia requires that service points have sufficient ESD protection (against static electricity) when servicing
the phone.
Any product of which the covers are removed must be handled with ESD protection. The SIM card can be
replaced without ESD protection if the product is otherwise ready for use.
To replace the covers ESD protection must be applied.
All electronic parts of the product are susceptible to ESD. Resistors, too, can be damaged by static electricity
discharge.
All ESD sensitive parts must be packed in metallized protective bags during shipping and handling outside
any ESD Protected Area (EPA).
Every repair action involving opening the product or handling the product components must be done under
ESD protection.
ESD protected spare part packages MUST NOT be opened/closed out of an ESD Protected Area.
For more information and local requirements about ESD protection and ESD Protected Area, contact your local
Nokia After Market Services representative.

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Battery information

Nokia Customer Care

Battery information
Note: A new battery's full performance is achieved only after two or three complete charge and
discharge cycles!
The battery can be charged and discharged hundreds of times but it will eventually wear out. When the
operating time (talk-time and standby time) is noticeably shorter than normal, it is time to buy a new battery.
Use only batteries approved by the phone manufacturer and recharge the battery only with the chargers
approved by the manufacturer. Unplug the charger when not in use. Do not leave the battery connected to
a charger for longer than a week, since overcharging may shorten its lifetime. If left unused a fully charged
battery will discharge itself over time.
Temperature extremes can affect the ability of your battery to charge.
For good operation times with Ni-Cd/NiMh batteries, discharge the battery from time to time by leaving the
product switched on until it turns itself off (or by using the battery discharge facility of any approved accessory
available for the product). Do not attempt to discharge the battery by any other means.
Use the battery only for its intended purpose.
Never use any charger or battery which is damaged.
Do not short-circuit the battery. Accidental short-circuiting can occur when a metallic object (coin, clip or
pen) causes direct connection of the + and - terminals of the battery (metal strips on the battery) for example
when you carry a spare battery in your pocket or purse. Short-circuiting the terminals may damage the battery
or the connecting object.
Leaving the battery in hot or cold places, such as in a closed car in summer or winter conditions, will reduce
the capacity and lifetime of the battery. Always try to keep the battery between 15°C and 25°C (59°F and 77°
F). A phone with a hot or cold battery may temporarily not work, even when the battery is fully charged.
Batteries' performance is particularly limited in temperatures well below freezing.
Do not dispose of batteries in a fire!
Dispose of batteries according to local regulations (e.g. recycling). Do not dispose as household waste.

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Copyright © 2006 Nokia. All rights reserved.

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Company Policy

Nokia Customer Care

Company Policy
Our policy is of continuous development; details of all technical modifications will be included with service
bulletins.
While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If
any errors are found by the reader, NOKIA MOBILE PHONES Business Group should be notified in writing/email.
Please state:
• Title of the Document + Issue Number/Date of publication
• Latest Amendment Number (if applicable)
• Page(s) and/or Figure(s) in error

Please send to:
NOKIA CORPORATION
Nokia Mobile Phones Business Group
Nokia Customer Care
PO Box 86
FIN-24101 SALO
Finland
E-mail: Service.Manuals@nokia.com

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Company Policy

Nokia Customer Care

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Nokia 6233; Nokia 6234 Service Manual Structure

Nokia Customer Care

Nokia 6233; Nokia 6234 Service Manual Structure
1 General information
2 Parts and layouts
3 Service Software Instructions
4 Service Tools and Service Concepts
5 Disassembly and reassembly instructions
6 BB Troubleshooting and Manual Tuning Guide
7 RF troubleshooting
8 System Module
9 Schematics
Glossary

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RM-123; RM-145
Nokia 6233; Nokia 6234 Service Manual Structure

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Issue 1

Nokia Customer Care

1 — General information

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General information

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General information

Nokia Customer Care

Table of Contents
Product selection....................................................................................................................................................1–5
Phone features........................................................................................................................................................1–6
Software and User interface features...................................................................................................................1–6
Accessories..............................................................................................................................................................1–9
Technical specifications.......................................................................................................................................1–10
General specifications.....................................................................................................................................1–10
Main RF characteristics for triple GSM band and WCDMA band phones (Europe).....................................1–11
Battery endurance...........................................................................................................................................1–11
Environmental conditions..............................................................................................................................1–12

List of Tables
Table 1 Battery and chargers................................................................................................................................1–9
Table 2 Car accessories..........................................................................................................................................1–9
Table 3 Audio..........................................................................................................................................................1–9
Table 4 Connectivity.............................................................................................................................................1–10
Table 5 Imaging and lifestyle..............................................................................................................................1–10
Table 6 Messaging................................................................................................................................................1–10
Table 7 Music........................................................................................................................................................1–10

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General information

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General information

Nokia Customer Care

Product selection
RM-123 (Nokia 6234) and RM-145 (Nokia 6233) are both WCDMA/GSM dual mode phones, supporting WCDMA
2100 (UMTS) and EGSM900/1800/1900 bands.
RM-123 is a special Vodafone customised model. Even though the appearance is different, they both use the
same PWB and offer the same features.

Key Features:
• Stereo speakers and 3D sound effects
• Up to 70 MB total memory for storing pictures, messages, etc.
• 2-megapixel camera with 8x digital zoom and landscape mode
• Stereo FM radio supporting visual radio
• Music player
• Enhanced Java email client
• Video, MP3, eACC+, and polyphonic ringing tones
• FM visual stereo radio with integrated 3D stereo speakers

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General information

Nokia Customer Care

Phone features

Display and keypad features
• 262 K colour QVGA 240 x 320 pixels display
• Active TFT display
• Side volume keys with zoom functionality
• Dedicated camera key

Hardware features
• 2-megapixel camera landscape mode and 8x digital zoom
• PopPortTM™
• 2 mm charger plug interface
• Bluetooth
• USB
• FM radio
• MP3 player
• Internal vibrator
• Plug-in SIM (1.8 V and 3.0 V)
• Real time clock

RF features
• WCDMA 2100
• GSM/EDGE 900/1800/1900
• EDGE*: Class 10
• GPRS: Class 10
• HSCSD

Software and User interface features

Software features
• ISA OS 8.0s Platform
• Nokia Series 40 User interface (UI): Java MIDP 2.0

UI features
Integrated digital camera

• 2-megapixel camera with 8x smooth, digital zoom and dedicated key
• Landscape support mode
• Full screen viewfinder
• Print images directly from the phone over a Bluetooth connection or
using an MMC (depending on the printer)

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General information
Multimedia

Nokia Customer Care
• Integrated video player for download and playback or for streaming:
3GPP, H.263 video, MPEG-4, and AMR
• Add video and music to your caller ID
• Interactive 3D games with multi-player support
• Music player supports MP3, MP4, eAAC+ and AAC music files
• Use pre-loaded polyphonic midi ring tones, MP3, eAAC+, and message
alerts
• OTA download of ringing tones, themes, wallpapers
• Download/upload images and video clips
• Kodak Photo services for high-quality, easy printing
• Stereo FM Radio
• Video Sharing
• 3GPP streaming for mobile access to the latest sports, weather,
entertainment, and news information

Messaging

• Common inbox (MMS, SMS, e-mail)
• Full MMS 1.2 functionality for sending and receiving messages including
video, photos, and music
• Improved Java email client with easy settings and spam filter
• Email: supports SMTP, POP3, and IMAP4 protocols
• Text messaging: supports concatenated SMS and picture messaging
• Presence: includes Wireless Village and Dynamic phonebook; know
someone's status before you call

Memory functions

• Up to 70MB total memory (6MB internal + 64MB memory card)
• Supports up to 2GB of expandable, microSD memory
• Back up important files such as presentations and documents, or just
store images on your personal mobile storage device

Games

• Nokia World Cup, 3D Street Racer, and 3D Snake
• Download new Java games

Applications

• Enhanced Java email client with easy settings and spam filter
• Data synchronization
• Visual Radio
• Wireless presenter
• Notepad and voice memo recorder
• Translator
• World Clock II
• Converter II
• Java MIDP 2.0 with Bluetooth API makes downloading new applications
easy
• Active standby mode

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General information

Nokia Customer Care
Connectivity

• Transfer images, video clips, audio files, and other files
• Bluetooth wireless technology: wide range of profiles and APIs for
seamless connectivity
• Infrared
• USB port
• Easy remote or local synchronization with a PC or other compatible device
• OMA DRM 1.0 protects copyrighted material
• Push to talk over cellular (PoC) lets you use your phone like a walkie-talkie

Browsing

• WAP 2.0, XHTML browser over HTTP/TCP/IP stack HSCSD
• HSCSD, CSD for browsing and as data modem
• 3GPP video streaming

Data transfer

• EDGE Class 10 (4+1, 3+2): speed up to 236.8 kbps
• GPRS (General Packet Radio Service) class 10 (4+1, 3+2)
• HSCSD (High-Speed Circuit-Switched Data) transfer up to 43.2 kbps in
HSCSD networks
• DRM 1.0 for secure content downloading
• Speech codec support for FR, EFR, AMR
• TCP/IP

Call management

• Speed dialing: up to 9 names
• Last-number redial from dialed calls list (Dial key brings up the dialed
calls list)
• Automatic redial (max 10 attempts)
• Automatic answer (works with headset or car kit only)
• Call waiting, call hold, call divert, call timer
• Automatic and manual network selection
• Caller identification with image
• Closed User Group
• Fixed Dialing Number, allows calls only to predefined numbers
• Conference call (up to 5 participants)
• Vibrating alert

Voice features

• Nokia Push to Talk with dedicated key
• Two effect speakers (each 15mm x 11mm)
• 3D effect sound
• Nokia Express Audio Messaging
• 16 voice commands
• Integrated Handsfree speakers
• Voice dialing, 25 presets

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General information

Nokia Customer Care

Accessories
Table 1 Battery and chargers

Type

Name

Note: This phone is charged through the smaller Nokia standard interface (2.0 mm plug). The 3.5 mm
standard charger can be used together with the CA-44 charger adapter.
AC-3

Compact charger

AC-4

Travel performance charger

BP-6M-S

Battery 1100 mAh Li-Ion

CA-44

Charger adapter (from 3.5 mm -> 2 mm)

Table 2 Car accessories

Type

Name

BHF-3

Headrest handsfree

CA-55

Converter

CARK-91

Advanced HF car kit

CK-1W

Wireless car kit

CK-7W

Advanced Car Kit

CK-10

Car kit

CR-56

Mobile holder

DC-4

Mobile charger

HF-3

Plug-in car handsfree

HF-6W

Wireless plug-in handsfree

N616

Car kit
Nokia universal holder

Table 3 Audio

Type

Name

HDA-10

Phone adapter

HDB-4

Boom headset

HDS-3

Stereo headset

HDW-3

Wireless headset

HS-3

Stereo headset: fashion

HS-4W

Wireless boom headset

HS-5

Headset

HS-6

Display headset

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General information

Nokia Customer Care
Type

Name

HS-11W

Wireless headset

HS-21W

Wireless clip-on headset

HS-23

Stereo headset

HS-26W

Wireless headset

HS-31

Fashion stereo headset

HS-36W

Wireless headset

LPS-4

Loopset

MD-1

Music stand

Table 4 Connectivity

Type
CA-53

Name
USB cable

Table 5 Imaging and lifestyle

Type
PT-6

Name
Remote camera

Table 6 Messaging

Type
SU-1B

Name
Digital pen

Table 7 Music

Type
MD-1

Name
Music stand

Technical specifications
General specifications
Unit

Dimension (mm)

Weight (g)

Volume (cc)

RM-123 Transceiver
with BP-6M-S 1100 mAh
Li-Ion battery pack

108x46.5x17.5

100

76

RM-145 Transceiver
with BP-6M-S 1100 mAh
Li-Ion battery pack

108x46.5x18

110

81

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General information

Nokia Customer Care

Main RF characteristics for triple GSM band and WCDMA band phones (Europe)
Parameter
Cellular system

Unit
GSM/EGSM900,GSM1800/1900
WCDMA2100

Rx frequency band

EGSM900: 925 - 935 MHz
GSM900: 935 - 960 MHz
GSM1800: 1805 - 1880 MHz
GSM1900: 1930 - 1990 MHz
WCDMA: 2110- 2170 MHz

Tx frequency band

EGSM900: 880 - 890 MHz
GSM900: 890 - 915 MHz
GSM1800: 1710 - 1785 MHz
GSM1900: 1850 - 1910 MHz
WCDMA: 1920 - 1980 MHz

Output power

GSM900: +5 … +32.5 dBm
GSM1800: +0 … +30 dBm
GSM1900: +0 ... +30 dBm
WCDMA2100: 0 ...+24 dBm

Number of RF channels

GSM900: 125
GSM1800: 375
GSM1900: 300
WCDMA2100: 8

Channel spacing

GSM 200 KHz
WCDMA 4.8 MHz

Number of Tx power levels

GSM900: 15
GSM1800: 16
GSM1900: 16
WCDMA2100: 12

Battery endurance
Battery
BP-6M-S 1100 mAh Li-ion

Talk time
GSM: up to 4 hours

Standby time
Up to 340 hours

WCDMA: up to 3.1 hours

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General information

Nokia Customer Care

Note: Variation in operation times will occur depending on SIM card, network settings and usage.
Talk time is increased by up to 30% if half rate is active, and reduced by 5% if enhanced full rate is
active.

Environmental conditions
Environmental
condition

Ambient temperature

Notes

Normal operation

15 oC ... +55 oC

Specifications fulfilled

Reduced performance

55 oC ... +70 oC

Operational only for short periods

Intermittent or no
operation

-40 oC ... -15 oC and +70 oC ... +85oC

Operation not guaranteed but an
attempt to operate will not damage
the phone

No operation or
storage

<-40 oC and >+85 oC

No storage. An attempt to operate
may cause permanent damage

Charging allowed

-15 oC ... +55 oC

Long term storage
conditions

0 oC ... +85 oC

Humidity and water
resistance

Relative humidity range is 5 to 95%.
Condensed or dripping water may
cause intermittent malfunctions.
Protection against dripping water
has to be implemented in (enclosure)
mechanics.
Continuous dampness will cause
permanent damage to the module.

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2 — Parts and layouts

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Parts and layouts

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Parts and layouts

Nokia Customer Care

Table of Contents
Exploded view.........................................................................................................................................................2–5
Mechanical parts list...............................................................................................................................................2–6
Swap units...............................................................................................................................................................2–8
Component parts list..............................................................................................................................................2–9
Component layouts..............................................................................................................................................2–21

List of Tables
Table 8 RM-123 Mechanical parts list...................................................................................................................2–6
Table 9 RM-145 Mechanical parts list...................................................................................................................2–7
Table 10 RM-123 Swap units.................................................................................................................................2–8
Table 11 RM-145 Swap units.................................................................................................................................2–9
Table 12 ..................................................................................................................................................................2–9

List of Figures
Figure 1 Main board layout, bottom side (1rra_08a)........................................................................................2–21
Figure 2 Main board layout, top side (1rra_08a)...............................................................................................2–21

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Parts and layouts

Nokia Customer Care

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Parts and layouts

Nokia Customer Care

Exploded view

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Parts and layouts

Nokia Customer Care

Mechanical parts list
Table 8 RM-123 Mechanical parts list

Item

Qty

Description

* = Not available as spare part
A1

A-cover assy

I001*

1

A-cover (A1)

I002*

1

A-cover window gasket

I003*

1

Power key

I004

1

Keymat

I009

1

LCD module

I005

1

Screw 1.8 x 9.6 TP 6IP

A2

Cover plate assembly

I006*

1

UI flex incl connector (A2)

I007*

1

EL-foil (a2)

I008*

1

Domesheet assembly (A2)

A3

C-cover assembly

I010*

1

C-cover (A3)

I011

1

Microphone Clapton

I012

1

C-cover plate grounding clip
Light swap engine module
assembly

A4
I013*

1

Light swap engine module

I014

1

Type label (Level 3/4 only)

I015

1

BBA lid (A4)

I016

1

WCDMA lid

I017

1

RF lid

I018

1

Camera module

A5

D-cover assembly

I019*

1

D-cover painted

I020

1

DC jack

I021

1

Earpiece

I022

1

Earpiece adhesive

I023*

1

IR window

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Parts and layouts
Item

Nokia Customer Care

Qty

Description

I024*

1

IHF pogo pin

I025*

1

IHF speaker left

I026*

1

IHF speaker right

I028*

1

SIM lid

I029*

1

Camera key

I030*

1

POC key

I031

1

Volume key

I032*

1

BT antenna

I033*

1

GSM antenna

I034*

1

WCDMA antenna

I035

1

Screw 1.8 x 10 TP 6IP

I040

1

B-cover
Table 9 RM-145 Mechanical parts list

Item

Qty

Description

* = Not available as spare part
A1

A-cover assy

I001*

1

A-cover (A1)

I002*

1

A-cover window gasket

I004

1

Keymat

I009

1

LCD module

I005

1

Screw 1.8 x 9.6 TP 6IP

A2

Cover plate assembly

I006*

1

UI flex incl connector (A2)

I007*

1

EL-foil (a2)

I008*

1

Domesheet assembly (A2)

A3

C-cover assembly

I010*

1

C-cover (A3)

I011

1

Microphone Clapton

I012

1

C-cover plate grounding clip
Light swap engine module
assembly

A4
I013*
Issue 1

1

Light swap engine module
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Parts and layouts

Nokia Customer Care
Item

Qty

Description

I014

1

Type label (Level 3/4 only)

I015

1

BBA lid (A4)

I016

1

WCDMA lid

I017

1

RF lid

I018

1

Camera module

A5

D-cover assembly

I019*

1

D-cover painted

I020

1

DC jack

I021

1

Earpiece

I022

1

Earpiece adhesive

I023*

1

IR window

I024*

1

IHF pogo pin

I025*

1

IHF speaker left

I026*

1

IHF speaker right

I028*

1

SIM lid

I029*

1

Camera key

I030*

1

POC key

I031*

1

Volume key

I032*

1

BT antenna

I033*

1

GSM antenna

I034*

1

WCDMA antenna

I035

1

Screw 1.8 x 10 TP 6IP

I036

1

Battery cover

I037

1

Camera bezel

A6

Top cover assembly

I038*

1

Top cover

I039*

1

Power key

Swap units
Table 10 RM-123 Swap units

Swap units for RM-123
RM-123 SWAP SOFT BLACK LATIN EURO-C
RM-123 SWAP SOFT BLACK LATIN EURO-C ZA

Page 2 –8

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Issue 1

RM-123; RM-145
Parts and layouts

Nokia Customer Care

Swap units for RM-123
RM-123 SWAP SOFT BLACK LATIN EURO-C FR
RM-123 SWAP SOFT BLACK LATIN EURO-D
RM-123 SWAP SOFT BLACK GREEK EURO-H
RM-123 SWAP SOFT BLACK ARABIC EURO-G
Table 11 RM-145 Swap units

Swap units for RM-145
RM-145 SWAP SILVER ALLOY CYRIL RUSSIA
RM-145 SWAP SILVER ALLOY CYRIL UKRAINE
RM-145 SWAP SILVER ALLOY EU-C TURKEY
RM-145 SWAP SILVER ALLOY LATIN EU-C FRA
RM-145 SWAP SILVER ALLOY LATIN EU-C ZA
RM-145 SWAP CLASSIC BLACK CYRIL UKRAINE
RM-145 SWAP CLASSIC BLACK CYRIL RUS
RM-145 SWAP SILVER ALLOY LATIN EURO-C
RM-145 SWAP CLASSIC BLACK LATIN TURKEY
RM-145 SWAP CLASSIC BLACK LATIN EU-C FRA
RM-145 SWAP CLASSIC BLACK LATIN EU-C ZA
RM-145 SWAP CLASSIC BLACK LATIN EURO-C

Component parts list
Table 12

Item ref

Side

Object Name

Type

A

1000

T

BB SHIELD ASSEMBLY

Shield Assembly

A

1001

T

SIM SUPPORT SHIELD CuNi 18Zn20 F610

Shield

A

1050

B

GE SHIELD

Shield

A

7000

T

RF SHIELD ASSEMBLY

Shield Assembly

A

7001

T

WCDMA SHIELD ASSEMBLY

Shield Assembly

B

2200

T

CRYSTAL 32.768KHZ +/-30PPM 12.5PF

Crystal

C

1000

T

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

1001

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

1002

T

CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405

Ceramic Capacitor

C

1008

T

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

1009

T

CHIPCAP NP0 27P J 50V 0402

Ceramic Capacitor

C

1010

T

CHIPCAP NP0 27P J 50V 0402

Ceramic Capacitor

Issue 1

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Page 2 –9

RM-123; RM-145
Parts and layouts

Nokia Customer Care
Item ref

Side

Object Name

Type

C

1052

B

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

1053

B

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

1054

B

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

1055

B

CHIPCAP X5R 1U K 6V3 0402

Ceramic Capacitor

C

1056

B

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

1060

T

CHIPCAP X5R 220N K 6.3V 0402

Ceramic Capacitor

C

1061

B

CHIPCAP X5R 220N K 6.3V 0402

Ceramic Capacitor

C

1062

B

CHIPCAP X5R 4U7 K 6.3V 0603

Ceramic Capacitor

C

1063

B

CHIPCAP X5R 4U7 K 6V3 0805

Ceramic Capacitor

C

1064

B

CHIPCAP X5R 4U7 K 6V3 0805

Ceramic Capacitor

C

1065

B

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

1066

B

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

1069

B

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

1070

B

CHIPCAP NP0 27P J 50V 0402

Ceramic Capacitor

C

1071

B

CHIPCAP NP0 27P J 50V 0402

Ceramic Capacitor

C

1072

B

CHIPCAP NP0 27P J 50V 0402

Ceramic Capacitor

C

2000

B

CHIPCAP NP0 27P J 50V 0402

Ceramic Capacitor

C

2001

B

CHIPCAP X5R 470N K 25V 0603

Ceramic Capacitor

C

2002

B

CHIPCAP X7R 1N0 K 50V 0402

Ceramic Capacitor

C

2003

B

CHIPCAP FEEDTHRU 100N M 25V 0805

Ceramic Capacitor

C

2004

B

CHIPCAP X5R 4U7 K 6.3V 0603

Ceramic Capacitor

C

2005

B

CHIPCAP X7R 33N K 10V 0402

Ceramic Capacitor

C

2006

T

CHIPCAP X7R 33N K 10V 0402

Ceramic Capacitor

C

2007

B

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

2008

B

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

2009

B

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

2010

B

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

2011

B

CHIPCAP NP0 10P J 50V 0402

Ceramic Capacitor

C

2012

B

CHIPCAP NP0 10P J 50V 0402

Ceramic Capacitor

C

2013

B

CHIPCAP NP0 10P J 50V 0402

Ceramic Capacitor

C

2014

B

CHIPCAP NP0 10P J 50V 0402

Ceramic Capacitor

C

2015

B

CHIPCAP NP0 270P J 50V 0402

Ceramic Capacitor

C

2016

B

CHIPCAP X7R 33N K 10V 0402

Ceramic Capacitor

C

2020

B

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2021

B

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

Page 2 –10

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Issue 1

RM-123; RM-145
Parts and layouts
Item ref

Nokia Customer Care
Side

Object Name

Type

C

2071

T

CHIPCAP NP0 27P J 50V 0402

Ceramic Capacitor

C

2100

T

CHIPCAP X7R 33N K 10V 0402

Ceramic Capacitor

C

2101

T

CHIPCAP X7R 33N K 10V 0402

Ceramic Capacitor

C

2102

T

CHIPCAP X5R 4U7 K 6.3V 0603

Ceramic Capacitor

C

2106

T

CHIPCAP NP0 22P J 50V 0402

Ceramic Capacitor

C

2107

T

CHIPCAP NP0 22P J 50V 0402

Ceramic Capacitor

C

2108

T

CHIPCAP X7R 1N0 K 50V 0402

Ceramic Capacitor

C

2109

T

CHIPCAP X7R 1N0 K 50V 0402

Ceramic Capacitor

C

2110

T

CHIPCAP X7R 1N0 K 50V 0402

Ceramic Capacitor

C

2111

T

CHIPCAP NP0 22P J 50V 0402

Ceramic Capacitor

C

2112

T

CHIPCAP NP0 22P J 50V 0402

Ceramic Capacitor

C

2117

T

CHIPCAP X7R 33N K 10V 0402

Ceramic Capacitor

C

2118

T

CHIPCAP X7R 33N K 10V 0402

Ceramic Capacitor

C

2119

T

CHIPCAP X7R 33N K 10V 0402

Ceramic Capacitor

C

2120

T

CHIPCAP X7R 33N K 10V 0402

Ceramic Capacitor

C

2124

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2127

T

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

2132

T

CHIPCAP X7R 1N0 K 50V 0402

Ceramic Capacitor

C

2200

T

CHIPCAP X5R 1U K 6V3 0402

Ceramic Capacitor

C

2201

T

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

2202

T

CHIPCAP X7R 1N0 K 50V 0402

Ceramic Capacitor

C

2203

T

CHIPCAP X7R 1N0 K 50V 0402

Ceramic Capacitor

C

2204

T

CHIPCAP X7R 1N0 K 50V 0402

Ceramic Capacitor

C

2205

T

CHIPCAP X7R 1N0 K 50V 0402

Ceramic Capacitor

C

2206

T

CHIPCAP X7R 1N0 K 50V 0402

Ceramic Capacitor

C

2207

T

CHIPCAP X7R 1N0 K 50V 0402

Ceramic Capacitor

C

2208

T

CHIPCAP NP0 27P J 50V 0402

Ceramic Capacitor

C

2209

T

CHIPCAP NP0 22P J 50V 0402

Ceramic Capacitor

C

2210

T

CHIPCAP X5R 1U K 16V 0603

Ceramic Capacitor

C

2211

T

CHIPCAP X5R 4U7 K 10V 0805

Ceramic Capacitor

C

2212

T

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

2215

T

CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405

Ceramic Capacitor

C

2217

T

CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405

Ceramic Capacitor

C

2220

T

CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405

Ceramic Capacitor

C

2221

T

CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405

Ceramic Capacitor

Issue 1

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Page 2 –11

RM-123; RM-145
Parts and layouts

Nokia Customer Care
Item ref

Side

Object Name

Type

C

2222

T

CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405

Ceramic Capacitor

C

2223

T

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

2224

T

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

2225

T

CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405

Ceramic Capacitor

C

2226

T

CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405

Ceramic Capacitor

C

2230

T

CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405

Ceramic Capacitor

C

2231

T

CHIPCAP X5R 10U M 6V3 0805

Ceramic Capacitor

C

2236

T

CHIPCAP X7R 1N0 K 50V 0402

Ceramic Capacitor

C

2300

T

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

2301

T

CHIPCAP X5R 22U M 6V3 0805

Ceramic Capacitor

C

2302

T

CHIPCAP X5R 22U M 6V3 0805

Ceramic Capacitor

C

2303

T

CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405

Ceramic Capacitor

C

2304

T

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

2307

T

CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405

Ceramic Capacitor

C

2309

T

CHIPCAP X5R 22U M 6V3 0805

Ceramic Capacitor

C

2313

T

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

2405

B

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

2406

B

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

2412

B

CHIP ARRAY X5R 2X1U (2x1U2) K 6V3 0405

Ceramic Capacitor

C

2414

B

CHIPCAP NP0 27P J 50V 0402

Ceramic Capacitor

C

2415

B

CHIPCAP NP0 56P J 50V 0402

Ceramic Capacitor

C

2416

B

CHIPCAP X7R 6N8 K 25V 0402

Ceramic Capacitor

C

2418

B

CHIPCAP X5R 1U K 6V3 0402

Ceramic Capacitor

C

2420

B

CHIPCAP NP0 1N0 K 200V 1206

Ceramic Capacitor

C

2500

B

CHIPCAP X5R 100N M 16V 0402

Ceramic Capacitor

C

2501

B

CHIPCAP NP0 27P J 50V 0402

Ceramic Capacitor

C

2502

B

CHIPCAP X5R 4U7 K 6.3V 0603

Ceramic Capacitor

C

2503

B

CHIPCAP X5R 1U K 25V 0603

Ceramic Capacitor

C

2581

T

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

2600

T

CHIPCAP X5R 4U7 K 10V 0805

Ceramic Capacitor

C

2601

T

CHIPCAP NP0 22P J 50V 0402

Ceramic Capacitor

C

2602

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2603

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2700

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2701

T

CHIPCAP NP0 27P J 50V 0402

Ceramic Capacitor

Page 2 –12

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Issue 1

RM-123; RM-145
Parts and layouts
Item ref

Nokia Customer Care
Side

Object Name

Type

C

2800

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2801

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2802

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2803

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2804

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2805

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2806

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2807

T

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

2808

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2809

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2810

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2811

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2812

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2813

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2814

T

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

2815

T

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

2819

T

CHIPCAP NP0 27P J 50V 0402

Ceramic Capacitor

C

3000

T

CHIPCAP X5R 100N M 16V 0402

Ceramic Capacitor

C

3001

T

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

3002

T

CHIPCAP X5R 220N K 6.3V 0402

Ceramic Capacitor

C

3003

T

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

3004

T

CHIPCAP X5R 220N K 6.3V 0402

Ceramic Capacitor

C

3005

T

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

3006

T

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

3007

T

CHIPCAP X5R 220N K 6.3V 0402

Ceramic Capacitor

C

3008

T

CHIPCAP X5R 220N K 6.3V 0402

Ceramic Capacitor

C

3009

T

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

3010

T

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

3100

T

CHIPCAP NP0 27P J 50V 0402

Ceramic Capacitor

C

3200

B

CHIPCAP X5R 100N K 10V 0402

Ceramic Capacitor

C

3201

B

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

3202

B

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

3203

B

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

3221

T

CHIPCAP NP0 27P J 50V 0402

Ceramic Capacitor

C

6000

B

CHIPCAP X5R 100N M 16V 0402

Ceramic Capacitor

Issue 1

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Page 2 –13

RM-123; RM-145
Parts and layouts

Nokia Customer Care
Item ref

Side

Object Name

Type

C

6001

B

CHIPCAP X5R 100N M 16V 0402

Ceramic Capacitor

C

6002

B

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

6003

B

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

6004

B

CHIPCAP X5R 100N M 16V 0402

Ceramic Capacitor

C

6005

B

CHIPCAP X5R 100N M 16V 0402

Ceramic Capacitor

C

6010

B

CHIPCAP NP0 4P7 C 50V 0402

Ceramic Capacitor

C

6011

B

CHIPCAP NP0 5P6 C 50V 0402

Ceramic Capacitor

C

6050

B

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

6051

B

CHIPCAP X5R 1U K 6V3 0603

Ceramic Capacitor

C

6052

B

CHIPCAP NP0 15P J 50V 0402

Ceramic Capacitor

C

7500

T

CHIPCAP X5R 4U7 K 6.3V 0603

Ceramic Capacitor

C

7501

T

CHIPCAP X5R 4U7 K 6.3V 0603

Ceramic Capacitor

C

7502

T

CHIPCAP X5R 4U7 K 6.3V 0603

Ceramic Capacitor

C

7503

T

CHIPCAP X5R 4U7 K 6.3V 0603

Ceramic Capacitor

C

7504

T

CHIPCAP X7R 3N9 J 50V 0402

Ceramic Capacitor

C

7505

T

CHIPCAP X7R 10N K 16V 0402

Ceramic Capacitor

C

7506

T

CHIPCAP NP0 47P J 50V 0402

Ceramic Capacitor

C

7507

T

CHIPCAP X5R 100N M 16V 0402

Ceramic Capacitor

C

7508

T

CHIPCAP NP0 10P J 50V 0402

Ceramic Capacitor

C

7509

T

CHIPCAP X5R 100N M 16V 0402

Ceramic Capacitor

C

7510

T

CHIPCAP NP0 470P J 6V3 0402

Ceramic Capacitor

C

7511

T

CHIPCAP X7R 33N K 10V 0402

Ceramic Capacitor

C

7512

T

CHIPCAP NP0 2N2 G 16V 0603

Ceramic Capacitor

C

7514

T

CHIPCAP NP0 2P2 C 50V 0402

Ceramic Capacitor

C

7515

T

CHIPCAP NP0 2P7 C 50V 0402

Ceramic Capacitor

C

7516

T

CHIPCAP NP0 0P5 C 50V 0402

Ceramic Capacitor

C

7521

T

CHIPCAP X5R 4U7 K 6.3V 0603

Ceramic Capacitor

C

7541

T

CHIPCAP X5R 4U7 K 6.3V 0603

Ceramic Capacitor

C

7542

T

CHIPCAP X5R 4U7 K 6.3V 0603

Ceramic Capacitor

C

7543

T

CHIPCAP X5R 4U7 K 6.3V 0603

Ceramic Capacitor

C

7544

T

CHIPCAP X7R 22N K 16V 0402

Ceramic Capacitor

C

7545

T

CHIPCAP NP0 10P J 50V 0402

Ceramic Capacitor

C

7547

T

CHIPCAP NP0 2P7 C 50V 0402

Ceramic Capacitor

C

7597

T

CHIPTCAP 150U M 10V 6X3.2X1.5

Electrolytic Capacitor

D

3000

T

SDRAM 8MX16 1.8V/1.8V FBGA60 PBFREE

Memory IC

Page 2 –14

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Issue 1

RM-123; RM-145
Parts and layouts
Item ref

Nokia Customer Care
Side

Object Name

Type

D

6000

B

BTHFM1.0 ES4 Module

Hybrid

F

2000

B

SM FUSE F 2.0A 32V 0603

Fuse And Protector

G

2200

T

RTC BACKUP CAPAC 311 SIZE FOR 2.6V 4UAH

Battery And Battery Cell

L

1000

T

FERRITE BEAD 0.6R 600R/100MZ 0402

EMC Component

L

1001

T

FERRITE BEAD 0.6R 600R/100MZ 0402

EMC Component

L

1050

B

INDUCT WW 2.2UH 1A2 310 case size

Fixed Inductor

L

1051

B

FERR.BEAD 220R/100M 2A 0R05 0603

EMC Component

L

1067

B

INDUCT WW 2.2UH 1A2 310 case size

Fixed Inductor

L

2002

B

CHIP BEAD ARRAY 2X1000R 0405

EMC Component

L

2003

B

CHIP BEAD ARRAY 2X1000R 0405

EMC Component

L

2004

B

CHIP BEAD ARRAY 2X1000R 0405

EMC Component

L

2006

B

CHIP COIL 68NH J Q12/100MHZ 0603

Fixed Inductor

L

2100

B

CHIP BEAD ARRAY 2X1000R 0405

EMC Component

L

2101

T

FERR.BEAD 220R/100M 2A 0R05 0603

EMC Component

L

2102

T

CHIP COIL 30nH J Q65/500MHz 0805

Fixed Inductor

L

2103

T

CHIP COIL 30nH J Q65/500MHz 0805

Fixed Inductor

L

2104

T

FERR.BEAD 220R/100M 2A 0R05 0603

EMC Component

L

2105

T

FERR.BEAD 220R/100M 2A 0R05 0603

EMC Component

L

2107

T

FERR.BEAD 220R/100M 2A 0R05 0603

EMC Component

L

2108

T

FERR.BEAD 220R/100M 2A 0R05 0603

EMC Component

L

2109

T

CHIP COIL 30nH J Q65/500MHz 0805

Fixed Inductor

L

2110

T

FERR.BEAD 220R/100M 2A 0R05 0603

EMC Component

L

2111

T

FERRITE BEAD 0.6R 600R/100MZ 0402

EMC Component

L

2112

T

CHIP COIL 30nH J Q65/500MHz 0805

Fixed Inductor

L

2120

T

CHIP BEAD ARRAY 2X1000R 0405

EMC Component

L

2202

T

FERR.BEAD 220R/100M 2A 0R05 0603

EMC Component

L

2203

T

FERRITE BEAD 0.6R 600R/100MZ 0402

EMC Component

L

2204

T

FERRITE BEAD 0.6R 600R/100MZ 0402

EMC Component

L

2205

T

FERR.BEAD 220R/100M 2A 0R05 0603

EMC Component

L

2206

T

FERRITE BEAD 0.6R 600R/100MZ 0402

EMC Component

L

2301

T

FERR.BEAD 220R/100M 2A 0R05 0603

EMC Component

L

2302

T

INDUCT WW 10U 0A65 0R35 4X4X1.2

Fixed Inductor

L

2303

T

FERR.BEAD 0R03 42R/100MHZ 3A 0805

EMC Component

L

2304

T

FERRITE BEAD 0.6R 600R/100MZ 0402

EMC Component

L

2400

B

FERRITE BEAD 0.6R 600R/100MZ 0402

EMC Component

Issue 1

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Page 2 –15

RM-123; RM-145
Parts and layouts

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Item ref

Side

Object Name

Type

L

2401

B

FERRITE BEAD 0.6R 600R/100MZ 0402

EMC Component

L

2412

B

COIL 0.47MH 50MA 3.3X3.4X1.4MM

Fixed Inductor

L

2500

B

FERR.BEAD 0R03 42R/100MHZ 3A 0805

EMC Component

L

2501

B

CHOKE 22U M 0R7 0.35A 3.0X3.0X1.5

Fixed Inductor

L

3200

B

FERRITE BEAD 0.6R 600R/100MZ 0402

EMC Component

L

7500

T

FERRITE BEAD 0.6R 600R/100MZ 0402

EMC Component

L

7501

T

CHIP COIL 10N J Q30/800MHZ 0402

Fixed Inductor

L

7502

T

CHIP COIL 10N J Q30/800MHZ 0402

Fixed Inductor

L

7520

T

FERRITE BEAD 0R01 28R/100MHZ 0603

EMC Component

L

7540

T

CHOKE 3U3 1.2A 0R096 3X3X1.5

Fixed Inductor

L

7542

T

CHIP COIL 2N2 +-0N1 Q40/1GHZ 0402

Fixed Inductor

L

7543

T

CHIP COIL 3N9 +-0N3 Q28/800M 0402

Fixed Inductor

M

2100

T

SMD VIBRA MOTOR 1.3V 90MA 9000RPM

Vibrator

N

1050

B

DC/DC CONV TPS62311YZD 1.5V CSP8

Power Management IC

N

1051

B

OMAP DM290 GoldenEye nFBGA

Processor IC

N

1060

T

VREG 2.85/150MA(LP3987-2.85)USMD5

Analog IC

N

2000

B

TI Analog Switch TS5A3159DCKR

Interface And Controller IC

N

2001

B

TI Analog Switch TS5A3159DCKR

Interface And Controller IC

N

2101

T

AF AMP TPA2012D2 77DB/217HZ WCSP16

Analog IC

N

2413

B

EL DRIVER D381B 2-7V MSOP-10

Power Management IC
Power Management IC

N

2500

B

WHITE LED DRIVER 4LEDS 500mW 8bump
USMD8

N

2600

T

IRDA 1.15Mbps 2.2mm RoHS

Infrared

N

3200

B

VREG & LEVELSHIFT(LP3928)USMD16

Other IC

N

6050

B

VREG & LEVELSHIFT(LP3928)USMD16

Other IC

N

7500

T

RF SYSTEM MODULE PIHI2.22 9.0 x 9.0 x 1

Hybrid
Power Amplifier

N

7520

T

PW AMP PF89001 EGSM850/900/DCS/PCS
Cut12

N

7540

T

PW AMP QCPM-8883 K4-06 WCDMA 2100

Power Amplifier

N

7541

T

DC CONV LM3202TLX NOPB revB µSMD8

Power Management IC

R

1000

T

CHIPRES 0W06 33R J 0402

Fixed Resistor

R

1001

T

CHIPRES 0W06 100R J 0402

Fixed Resistor

R

1051

B

CHIPRES 0W06 100R J 0402

Fixed Resistor

R

1052

B

CHIPRES 0W06 100R J 0402

Fixed Resistor

R

1065

B

CHIPRES 0W06 33R J 0402

Fixed Resistor

Page 2 –16

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Issue 1

RM-123; RM-145
Parts and layouts
Item ref

Nokia Customer Care
Side

Object Name

Type

R

1072

B

CHIPRES 0W06 10K J 0402

Fixed Resistor

R

1078

B

CHIPRES 0W06 33R J 0402

Fixed Resistor

R

1080

B

CHIPRES 0W06 10K J 0402

Fixed Resistor

R

2000

B

ASIP MIC W/ESD RES+CAP+ZDI BGA11

Integrated Discretes

R

2001

B

CHIPRES 0W06 10K J 0402

Fixed Resistor

R

2002

B

CHIPRES 0W06 220R J 0402

Fixed Resistor

R

2003

B

VAR.ARRAY 2X16V 824-915MHZ 0405

Variable Resistor

R

2004

B

CHIPRES 0W06 33K J 0402

Fixed Resistor

R

2005

B

RES NETWORK 0W06 2X22R J 0404

Resistor Network

R

2006

B

RES NETWORK 0W06 2X22R J 0404

Resistor Network

R

2009

B

VAR.ARRAY 2X16V 824-915MHZ 0405

Variable Resistor

R

2010

B

VAR.ARRAY 2X16V 824-915MHZ 0405

Variable Resistor

R

2011

B

ASIP SILIC USB OTG / ESD BGA11

Integrated Discretes

R

2012

B

RES NETWORK 0W06 220K/120K J 0404

Resistor Network

R

2013

B

CHIPRES 0W06 100R J 0402

Fixed Resistor

R

2015

B

CHIPRES 0W06 10R J 0402

Fixed Resistor

R

2016

B

CHIP VARISTOR VWM14V VC50V 0402

Variable Resistor

R

2017

T

CHIPRES 0W06 4K7 J 0402

Fixed Resistor

R

2018

T

CHIPRES JUMPER 0R0 0402

Fixed Resistor

R

2022

B

CHIP VARISTOR VWM14V VC50V 0402

Variable Resistor

R

2023

T

CHIPRES JUMPER 0R0 0403

Fixed Resistor

R

2069

T

CHIPRES JUMPER 0R0 0404

Fixed Resistor

R

2070

T

NTC RES 0W1 47K J B 4050+-3% 0402

Variable Resistor

R

2071

T

CHIP VARISTOR VWM15V VC50V 0402

Variable Resistor

R

2100

T

ASIP MIC W/ESD RES+CAP+ZDI BGA11

Integrated Discretes

R

2101

T

CHIPRES 0W06 220R J 0402

Fixed Resistor

R

2102

T

CHIPRES 0W06 33K J 0402

Fixed Resistor

R

2103

B

VAR.ARRAY 2X16V 824-915MHZ 0405

Variable Resistor

R

2104

T

RES NETWORK 0W06 2X10R J 0404

Resistor Network

R

2117

T

VAR.ARRAY 2X16V 824-915MHZ 0405

Variable Resistor

R

2118

T

VAR.ARRAY 2X16V 824-915MHZ 0405

Variable Resistor

R

2119

T

VAR.ARRAY 2X16V 824-915MHZ 0405

Variable Resistor

R

2121

T

CHIPRES JUMPER 0R0 0405

Fixed Resistor

R

2124

T

CHIPRES JUMPER 0R0 0406

Fixed Resistor

R

2200

T

CHIPRES 0W06 100K J 0402

Fixed Resistor

Issue 1

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Page 2 –17

RM-123; RM-145
Parts and layouts

Nokia Customer Care
Item ref

Side

Object Name

Type

R

2201

T

CHIPRES 0W06 120K J 0402

Fixed Resistor

R

2203

T

CHIPRES 0W06 2M2 J 0402

Fixed Resistor

R

2206

T

CHIPRES 0W06 470R J 0402

Fixed Resistor

R

2223

T

CHIPRES 0W06 220R J 0402

Fixed Resistor

R

2400

B

CHIPRES 0W06 100K J 0402

Fixed Resistor

R

2412

B

CHIPRES JUMPER 0R0 0407

Fixed Resistor

R

2415

B

CHIPRES 0W06 120K J 0402

Fixed Resistor

R

2500

B

CHIPRES 0W06 10K J 0402

Fixed Resistor

R

2501

B

CHIPRES 0W06 33R J 0402

Fixed Resistor

R

2580

T

CHIPRES 0W06 10K J 0402

Fixed Resistor

R

2600

T

CHIPRES 0W125 4R7 J 0805

Fixed Resistor

R

2700

T

ASIP SIM INTERFACE **low cap** BGA8

Integrated Discretes

R

2800

T

CHIPRES 0W06 100K J 0402

Fixed Resistor

R

3000

T

CHIPRES 0W06 4K7 J 0402

Fixed Resistor

R

3200

B

ASIP MMC FILTER *** PB-FREE ***

Integrated Discretes

R

3205

B

CHIPRES 0W06 680R J 0402

Fixed Resistor

R

3221

T

CHIPRES 0W06 100R J 0402

Fixed Resistor

R

6010

B

CHIPRES 0W06 10K J 0402

Fixed Resistor

R

6011

B

CHIPRES 0W06 8K2 J 0402

Fixed Resistor

R

6020

B

CHIPRES JUMPER 0R0 0408

Fixed Resistor

R

6050

T

CHIPRES JUMPER 0R0 0409

Fixed Resistor

R

7500

T

CHIPRES 0W06 22K J 0402

Fixed Resistor

R

7501

T

CHIPRES 0W06 4K7 J 0402

Fixed Resistor

R

7503

T

CHIPRES 0W06 1K0 F 200PPM 0402

Fixed Resistor

R

7504

T

CHIPRES 0W06 8K2 F 0402

Fixed Resistor

R

7505

T

CHIPRES 0W06 5R6 J 0402

Fixed Resistor

R

7520

T

CHIPRES 0W06 27K F 0402

Fixed Resistor

R

7522

T

CHIPRES JUMPER 0R0 0410

Fixed Resistor

R

7540

T

CHIPRES 0W06 47K F 200PPM 0402

Fixed Resistor

R

7541

T

CHIPRES 0W06 1K2 F 250PPM 0402

Fixed Resistor

R

7542

T

CHIPRES JUMPER 0R0 0411

Fixed Resistor

R

7543

T

CHIPRES 0W06 10K J 0402

Fixed Resistor

R

7544

T

CHIPRES 0W06 10R J 0402

Fixed Resistor

S

2580

T

SM SW TACT SPST 12V SIDE KEY 2.2N

Switch And Knob

S

2596

T

SM SW TACT SPST 12V SIDE KEY 2.2N

Switch And Knob

Page 2 –18

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Issue 1

RM-123; RM-145
Parts and layouts
Item ref

Nokia Customer Care
Side

Object Name

Type

S

2597

T

SM SW TACT SPST 12V SIDE KEY 2.2N

Switch And Knob

S

2598

T

SM SW TACT SPST 12V SIDE KEY 2.2N

Switch And Knob

S

2599

T

SM SW TACT SPST 12V SIDE KEY 2.2N

Switch And Knob

T

7500

T

TRANSF BALUN 2134 +/- 30MHZ 0805

Balun

T

7501

T

TRANSF BALUN 3800 +/- 550MHZ 0805

Balun

V

2000

B

ASIP TVS BGA4

Integrated Discretes

V

2412

B

DI FAST 1SS400 75V 0A1 4NS SOD523

Diode

V

2413

B

DI ZEN 100V 6% 0W2 SOD323

Diode

V

2414

B

DI ZEN 100V 6% 0W2 SOD323

Diode

X

1000

T

SM CAMERA MOD SKT 2X8F

Socket

X

2000

T

CONN SYST SM 14POL

System Connector

X

2070

T

SM BATTERY CONN 3POL SPR 12V 2A

Battery Connector

X

2400

B

SM CONN 2X12F P0.4 30V.3A PWB/PWB

Board To Board Connector

X

2411

B

C-SPRING EL FOIL SUS301

Spring

X

2412

B

C-SPRING EL FOIL SUS301

Spring

X

2580

B

SM CONN 2X12F P0.5 PWB/PWB

Multipole Connector

X

2700

T

SM SIM CONN 6POL P2.54 H1.8

Multipole Connector

X

3200

T

CONN SMC TRANSFLASH MMC

Smartcard Connector

X

8000

T

SM CONN RF JACK 50R 2W 6GHZ

Coaxial Connector

X

8001

T

C-SPRING ANTENNA ( active )

Spring

X

8002

T

C-SPRING ANTENNA

Spring

X

8003

T

SM CONN RF JACK 50R 2W 6GHZ

Coaxial Connector

X

8004

T

C-SPRING ANTENNA ( active )

Spring

X

8005

T

C-SPRING ANTENNA

Spring

X

8006

T

C-SPRING ANTENNA

Spring

X

8007

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

X

8008

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

X

8009

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

X

8010

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

X

8011

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

X

8012

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

X

8013

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

X

8014

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

X

8015

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

X

8016

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

Issue 1

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Page 2 –19

RM-123; RM-145
Parts and layouts

Nokia Customer Care
Item ref

Side

Object Name

Type

X

8017

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

X

8018

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

X

8019

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

X

8020

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

X

8021

B

C-SPRING FOR DISPLAY CAN GROUNDING

Spring

X

8023

B

C-SPRING GROUNDING C-COVER PLATE
SUS301

Spring

Z

2000

B

FERRITE BEAD 0.6R 600R/100MZ 0402

EMC Component

Z

2001

B

FERRITE BEAD 0.6R 600R/100MZ 0402

EMC Component

Z

2005

B

FERRITE BEAD 0.6R 600R/100MZ 0402

EMC Component

Z

2403

B

ASIP 10-CH ESD EMI FILTER BGA25

Integrated Discretes

Z

2404

B

ASIP 10-CH ESD EMI FILTER BGA25

Integrated Discretes

Z

2580

B

ASIP 10-CH ESD EMI FILTER BGA25

Integrated Discretes

Z

2581

B

ASIP 10-CH ESD EMI FILTER BGA25

Integrated Discretes

Z

2597

T

ASIP EMI/ESD FILTER BGA6

Integrated Discretes

Z

2598

T

ASIP EMI/ESD FILTER BGA6

Integrated Discretes

Z

2599

T

ASIP EMI/ESD FILTER BGA6

Integrated Discretes

Z

2600

T

ASIP EMI/ESD FILTER BGA6

Integrated Discretes

Z

7520

T

CER FILT LFL181699TC1 2400-2483MHz 1.6

Ceramic Filter

Z

7540

T

DUPL SAW 1920-1980/2110-2170MHZ
3.8x3.8

Duplexer

CHIPRES 0W06 180K J 0402

Fixed Resistor

CHIPCAP NP0 1P2 C 50V 0402

Ceramic Capacitor

Page 2 –20

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

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Component layouts

Figure 1 Main board layout, bottom side (1rra_08a)

Figure 2 Main board layout, top side (1rra_08a)

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Copyright © 2006 Nokia. All rights reserved.

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COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Issue 1

Nokia Customer Care

3 — Service Software
Instructions

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Copyright © 2006 Nokia. All rights reserved.

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COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

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Table of Contents
Phoenix installation steps in brief........................................................................................................................3–5
Installing Phoenix...................................................................................................................................................3–6
Updating Phoenix installation..............................................................................................................................3–8
Uninstalling Phoenix..............................................................................................................................................3–9
Repairing Phoenix installation...........................................................................................................................3–11
Phone data package overview............................................................................................................................3–11
Installing phone data package...........................................................................................................................3–12
Uninstalling phone data package.......................................................................................................................3–15
Configuring users in Phoenix..............................................................................................................................3–17
Managing connections in Phoenix......................................................................................................................3–17
Installing flash support files for FPS-8 and FPS-10...........................................................................................3–19
Updating FPS-8 and FPS-10 flash prommer software.......................................................................................3–22
Activating FPS-8....................................................................................................................................................3–23
Deactivating FPS-8................................................................................................................................................3–24

List of Figures
Figure 3 Dongle not found.....................................................................................................................................3–6
Figure 4 Disclaimer text.........................................................................................................................................3–7
Figure 5 InstallShield Wizard Complete...............................................................................................................3–8
Figure 6 Installation interrupted..........................................................................................................................3–9
Figure 7 Remove program...................................................................................................................................3–10
Figure 8 Finish uninstallation.............................................................................................................................3–10
Figure 9 Repair program.....................................................................................................................................3–11
Figure 10 Data package setup information.......................................................................................................3–13
Figure 11 Data package destination folder.......................................................................................................3–14
Figure 12 InstallShield Wizard Complete...........................................................................................................3–15
Figure 13 Uninstalling phone data package......................................................................................................3–16
Figure 14 Finishing data package uninstallation..............................................................................................3–16
Figure 15 Phoenix login.......................................................................................................................................3–17
Figure 16 New user configured..........................................................................................................................3–17
Figure 17 Select mode: Manual...........................................................................................................................3–18
Figure 18 Connections list...................................................................................................................................3–19
Figure 19 Connection information.....................................................................................................................3–19
Figure 20 Product support module information (example from RM-1)..........................................................3–19
Figure 21 Flash update welcome dialog............................................................................................................3–20
Figure 22 Flash installation interrupted............................................................................................................3–20
Figure 23 Flash destination folder......................................................................................................................3–21
Figure 24 Finish flash update..............................................................................................................................3–22
Figure 25 Flash directory window......................................................................................................................3–22
Figure 26 Prommer software update finished..................................................................................................3–23
Figure 27 Prommer Maintenance window........................................................................................................3–23
Figure 28 Box activation......................................................................................................................................3–24
Figure 29 Deactivation warning.........................................................................................................................3–24

Issue 1

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Copyright © 2006 Nokia. All rights reserved.

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Phoenix installation steps in brief

Prerequisites
Recommended hardware requirements:
• Computer processor: Pentium 700 MHz or higher
• RAM 256 MB
• Disk space 100-300 MB
Supported operating systems:
• Windows 2000 Service Pack 3 or higher
• Windows XP Service Pack 1 or higher

Context
Phoenix is a service software for reprogramming, testing and tuning phones.
Phoenix installation contains:
• Service software support for all phone models included in the package
• Flash update package files for programming devices
• All needed drivers for:
• PKD-1 (DK2) dongle
• DKU-2 USB cable
Note: Separate installation packages for flash update files and drivers are also available, but it is
not necessary to use them unless there are updates between Phoenix service software releases. If
separate update packages are used, they should be used after Phoenix and data packages have been
installed.
The phone model specific data package includes all changing product specific data:
• Product software binary files
• Files for type label printing
• Validation file for the faultlog repair data reporting system
• All product specific configuration files for Phoenix software components
Note: Phoenix and phone data packages should only be used as complete installation packages.
Uninstallation should be made from the Windows Control Panel.
To use Phoenix, you need to:

Steps
1. Connect a PKD-1 (DK2) dongle to the computer parallel port.
2. Install Phoenix.
3. Install the phone-specific data package.
4. Configure users.
5. Manage connection settings (depends on the tools you are using).
If you use FPS-8:

• Update FPS-8 software
• Activate FPS-8

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If you use FPS-10:

• Update FPS-10 software
Note: There is no need to activate FPS-10.
• Activate SX-4 smart card, if you need tuning and
testing functions.
Note: When FPS-10 is used only for
product software updates, SX-4 smart
card is not needed.

Results
Phoenix is ready to be used with FPS-8 or FPS-10 flash prommers and other service tools.

Installing Phoenix

Prerequisites
• Check that a dongle is attached to the parallel port of your computer.
• Download the Phoenix installation package (for example, phoenix_service_sw_2004_39_x_xx.exe) to your
computer (in C:\TEMP, for instance).
• Close all other programs.
• Depending on your operating system, administrator rights may be required to install Phoenix.
• If uninstalling or rebooting is needed at any point, you will be prompted by the InstallShield program.

Context
At some point during the installation procedure, you may get the following message:

Figure 3 Dongle not found

This may be a result of a defective or too old PKD-1 dongle.
Check the COM/parallel ports used. After correcting the problem, you can restart the installation.
For more detailed information, please refer to Phoenix Help files.
Tip: Each feature in Phoenix has its own Help function, which can be activated while running the
program. Press the F1 key or the feature’s Help button to activate a Help file.

Steps
1. To start the installation, run the application file (for example,phoenix_service_sw_2004_39_x_xx.exe).
2. In the Welcome dialogue, click Next.

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COMPANY CONFIDENTIAL
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3. Read the disclaimer text carefully and click Yes.

Figure 4 Disclaimer text

4. Choose the destination folder.
The default folder C:\ProgramFiles\Nokia\Phoenix is recommended.
5. To continue, click Next.
To choose another location, click Browse (not recommended).
6. Wait for the components to be copied.
The progress of the installation is shown in the Setup Status window.
7. Wait for the drivers to be installed and updated.
The process may take several minutes to complete.
If the operating system does not require rebooting, the PC components are registered right away.
If the operating system requires restarting your computer, the Install Shield Wizard will notifies about it.
Select Yes... to reboot the PC immediately or No... to reboot the PC manually afterwards.
After the reboot, all components are registered.
Note: Phoenix does not work, if the components have not been registered.

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8. To end the installation, click Finish.

Figure 5 InstallShield Wizard Complete

Next actions
After the installation, Phoenix can be used after:
• installing phone model specific data package for Phoenix
• configuring users and connections
FPS-8 and FPS-10 flash prommers can be used after updating their flash update package files.

Updating Phoenix installation

Context
• If you already have the Phoenix service software installed on your computer, you need to update the
software when new versions are released.
• To update Phoenix, you need to follow the same steps as when installing it for the first time.
• When you are updating, for example, from version a14_2004_16_4_47 to a15_2004_24_7_55, the update
will take place automatically without uninstallation.
• Always use the latest available versions of both Phoenix and the phone-specific data package. Instructions
can be found in the phone model specific Technical Bulletins and phone data package readme.txt files
(shown during installation).
• If you try to update Phoenix with the same version you already have (for example, a15_2004_24_7_55
to a15_2004_24_7_55), you are asked if you want to uninstall the existing version. In this case you can
choose between a total uninstallation or a repair installation in a similar way when choosing to uninstall
the application from the Windows Control Panel.
• If you try to install an older version (for example, downgrade from a15_2004_24_7_55 to
a14_2004_16_4_47), installation will be interrupted.
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Figure 6 Installation interrupted

• Always follow the instructions on the screen.

Steps
1. Download the installation package to your computer hard disk.
2. Close all other programs.
3. Run the application file (for example, phoenix_service_sw_2004_39_x_xx.exe).

Results
A new Phoenix version is installed and driver versions are checked and updated.

Uninstalling Phoenix

Context
You can uninstall Phoenix service software manually from the Windows Control Panel.

Steps
1. Open the Windows Control Panel, and choose Add/Remove Programs.

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2. To uninstall Phoenix, choose Phoenix Service Software→Change/Remove→Remove .

Figure 7 Remove program

The progress of the uninstallation is shown.
3. If the operating system does not require rebooting, click Finish to complete.

Figure 8 Finish uninstallation

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If the operating system requires rebooting, InstallShield Wizard will notify you. Select Yes... to reboot the
PC immediately and No... to reboot the PC manually afterwards.

Repairing Phoenix installation

Context
If you experience any problems with the service software or suspect that files have been lost, use the repair
function before completely reinstalling Phoenix.
Note: The original installation package (for example, phoenix_service_sw_a15_2004_24_7_55.exe)
must be found on your PC when you run the repair setup.

Steps
1. Open Windows Control Panel→Add/Remove Programs .
2. Choose Phoenix Service Software→Change/Remove .
3. In the following view, select Repair.

Figure 9 Repair program

Phoenix reinstalls components and registers them.
The procedure is the same as when updating Phoenix.
4. To complete the repair, click Finish.

Phone data package overview
Each product has its own data package (DP). The product data package contains all product-specific data files
to make the Phoenix service software and tools usable with a certain phone model.
The phone data package contains the following:
• Product software binary files
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• Files for type label printing
• Validation file for the fault log repair data reporting system
• All product-specific configuration files for Phoenix software components
Data files are stored in C:\Program Files\Nokia\Phoenix (default).

Installing phone data package

Prerequisites
• A phone-specific data package contains all data required for the Phoenix service software and service tools
to be used with a certain phone model.
• Check that a dongle is attached to the parallel port of your computer.
• Install Phoenix service software.
• Download the installation package (for example, XX-XX_dp_EA_v_1_0.exe) to your computer (for example,
in C:\TEMP).
• Close all other programs.
(XX-XX = type designator of the product)
If you already have Phoenix installed on your computer, you will need to update it when a new version is
released.
Note: Often Phoenix and the phone-specific data package come in pairs, meaning that a certain
version of Phoenix can only be used with a certain version of a data package. Always use the latest
available versions of both. Instructions can be found in phone-specific Technical Bulletins and
readme.txt files of data packages.

Steps
1. To start the installation, run the application file (for example, XX-XX_dp_EA_ v_1_0.exe),
Wait for the installation files to be extracted.

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2. Click Next.

3. In the following view you can see the contents of the data package. Read the text carefully. There is
information about the Phoenix version required with this data package.

Figure 10 Data package setup information

4. To continue, click Next.
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5. Choose the destination folder, and click Next to continue.

Figure 11 Data package destination folder

The InstallShield Wizard checks where Phoenix is installed, and the directory is shown.
6. To start copying the files, click Next.

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Phone model specific files are installed. Please wait.
7. To complete the installation, click Finish.

Figure 12 InstallShield Wizard Complete

Next actions
Phoenix can be used for flashing phones and printing type labels after:
• Configuring users
• Managing connections
FPS-8 and FPS-10 can be used after updating their flash update package files.

Uninstalling phone data package

Context
There is no need to uninstall an older version of a data package, unless instructions to do so are given in
the readme.txt file of the data package and bulletins related to the release.
Please read all related documents carefully.

Steps
1. Locate the data package installation file (e.g. XX-XX_dp_EA_v_1_0.exe) from your computer.
2. To start the uninstallation procedure, double-click the data package installation file.

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3. To uninstall the data package, click OK or to interrupt the uninstallation, click Cancel.

Figure 13 Uninstalling phone data package

4. When the data package is uninstalled, click Finish.

Figure 14 Finishing data package uninstallation

Alternative steps
• You can also uninstall the data package manually from
Control Panel→Add/Remove Programs→xx-xx* Phone Data Package . (*= type designator of the
phone).

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Configuring users in Phoenix

Steps
1. Start Phoenix service software, and log in.

Figure 15 Phoenix login

If the user ID is already configured, select s/he from the User name drop-down list, and click OK.
2. To add a new user, or to edit existing ones, click Maintain.
3. To add a new user, click New.
4. Type in the name and initials of the user, and click OK.
The user is added to the user name list.
5. Select the desired user from the User name drop-down list, and click OK.

Figure 16 New user configured

Managing connections in Phoenix

Context
With the Manage Connections feature you can edit and delete existing connections or create new ones.
Note: After choosing the desired connection, and connecting the phone to a PC for the first time,
allow the PC to install the USB device drivers first. Please note that this may take some time to
complete.
If there are problems after the driver installation, check that the USB connection is active from
the Windows Control Panel. If the problem persists, contact the local PC support.

Steps
1. Start Phoenix, and log in.
2. Choose File→Manage Connections... .
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3. To add a new connection, click Add.

4. Select Manual mode, and click Next to continue.
If you want to create the connection using the Connection Wizard, connect the tools and a phone to your
PC. The wizard will automatically try to configure the correct connection.

Figure 17 Select mode: Manual

i

For an FPS-10 flash prommer with a USB Connection, choose the following connection settings:
• Media: FPS-10 USB
• DEVICE_INDEX: 0
• SERIAL_NUM: See Serial No from the label attached to the bottom of FPS-10
• ACTIVE_MEDIA: USB

ii

For an FPS-10 flash prommer with a LAN connection, choose the following connection settings:
• Media: FPS-10 TCP/IP
• NET_SERV_NAME: Click Scan.... Choose your own FPS-10 device based on the correct MAC address.
See Serial No from the label attached to the bottom of your FPS-10.
• PORT_NUM: Use the default value, and click Next.
• PROTOCOL_FAMILY: Use the default value, and click Next.
• SOCKET TYPE: Use the default value, and click Next.
• TX_BUFFER_SIZE: Use the default value, and click Next.
• RX_BUFFER_SIZE: Use the default value, and click Next.

iii For an FPS-8 flash prommer, choose the following connection settings:
• Media: FPS-8
• PORT_NUM: COM Port where FPS-8 is connected
• COMBOX_DEF_MEDIA: FBUS
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iv For a plain USB connection, choose the following connection settings:
Note: First connect the DKU-2 USB cable between the PC USB port and phone.
• Media: USB
5. To complete the configuration, click Finish.
6. Click the connection you want to activate. Use the up/down arrows located on the right hand side to move
it on top of the list, then click Apply.

Figure 18 Connections list

The connection is activated, and it can be used after closing the Manage Connection window.
The connection information is shown at the right hand bottom corner of the screen.

Figure 19 Connection information

7. To use the connection, connect the phone to your PC with correct service tools. Make sure the phone is
switched on, and then choose File→Scan Product .

Results
The product support module information appears in the status bar:

Figure 20 Product support module information (example from RM-1)

Installing flash support files for FPS-8 and FPS-10

Prerequisites
• Install Phoenix service software.
• Install phone model specific data package for Phoenix.
• If you want to update the flash support files, they are delivered in the same installation package with
Phoenix or newer Phoenix packages beginning from December 2004.
In case you want to update the MCU files, install the latest data package (see Technical Bulletins for
information on the latest one).
Normally, it is enough to install Phoenix and the phone-specific data package because the installation
always includes the latest flash update package files for FPS-8 and FPS-10.
• A separate installation package for flash support files is available. The files can be updated according to
these instructions, if updates appear between Phoenix data package releases.

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Context
If you are not using a separate installation package, you can skip this section and continue with "Updating
FPS-8 and FPS-10 flash prommer software" (page 3–22) after installing a new phone data package.

Steps
1. To begin the installation, double-click the flash update file (for example,
flash_update_03_183_0014.exe).

Figure 21 Flash update welcome dialog

If the same version of the flash update package already exists, and you want to reinstall it, the previous
package is first uninstalled.
Restart installation again after the uninstallation.
2. If you try to downgrade the existing version to older ones, the setup will be aborted. If there is a need to
downgrade the version, uninstall newer files manually from the Windows Control Panel, and then rerun
the installation.

Figure 22 Flash installation interrupted

If an older version exists on your PC and it needs to be updated, click Next to continue installation.
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3. It is recommended to install the files to the default destination folder C:\Program Files\Nokia\Phoenix.
To continue, click Next.

Figure 23 Flash destination folder

When installing the flash update files for the first time, you may choose another location by selecting
Browse (not recommended).

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4. To complete the installation procedure, click Finish .

Figure 24 Finish flash update

Next actions
FPS-8 and FPS-10 flash prommers must be updated using Phoenix.

Updating FPS-8 and FPS-10 flash prommer software

Steps
1. Start Phoenix service software, and log in.
2. Choose the correct connection for your flash prommer: File→Manage Connections...
3. Choose Flashing→Prommer maintenance .
4. To update the FPS-8/FPS-10 software, click Update, and select the appropriate file fps8upd.ini (for FPS-8)
or fpsxupd.ini (for FPS-10) from C:\Program Files\Nokia\Phoenix\Flash.

Figure 25 Flash directory window

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Tip: All files can be loaded separately to the prommer used. To do this, click the right mouse button
in the Flash Box Files pane and select the file type(s) to be loaded.
5. Click OK.

Figure 26 Prommer software update finished

6. To close the Prommer Maintenance window, click Close.

Figure 27 Prommer Maintenance window

Activating FPS-8

Context
Before FPS-8 can be successfully used for phone programming, it must first be activated.
First fill in the FPS-8 activation request sheet in the FPS-8 sales package, and follow the instructions given.
When activation file is received (for example, 00000.in), copy it to the C:\ProgramFiles\Nokia\Phoenix
\BoxActivation directory on your computer (this directory is created when Phoenix is installed).
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Steps
1. Start Phoenix service software.
2. Choose Flashing→Prommer Maintenance .
3. In the Prommer Maintenance window, click Activate.
4. To find the activation file, click Browse.
5. To activate the prommer, select the activation file and click Open.

Figure 28 Box activation

6. To complete the activation, restart FPS-8.

Deactivating FPS-8

Context
If there is, for example, a need to send the FPS-8 box for repair, it must be deactivated first.

Steps
1. Start Phoenix service software.
2. Choose Flashing→Prommer Maintenance .
3. In the Prommer Maintenance window, click Deactivate.
4. To confirm the deactivation, click Yes.

Figure 29 Deactivation warning

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The box is deactivated.
5. To complete the deactivation, restart FPS-8.

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4 — Service Tools and Service
Concepts

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Table of Contents
Service tools............................................................................................................................................................4–5
CA-31D................................................................................................................................................................4–5
CA-35S.................................................................................................................................................................4–5
CA-53...................................................................................................................................................................4–5
CU-4.....................................................................................................................................................................4–6
FLS-4S..................................................................................................................................................................4–7
FPS-10.................................................................................................................................................................4–7
FS-31...................................................................................................................................................................4–7
JBT-9....................................................................................................................................................................4–7
JXS-1....................................................................................................................................................................4–8
MJ-91...................................................................................................................................................................4–8
PCS-1...................................................................................................................................................................4–8
PKD-1..................................................................................................................................................................4–8
RJ-104.................................................................................................................................................................4–9
RJ-108.................................................................................................................................................................4–9
RJ-114.................................................................................................................................................................4–9
RJ-57...................................................................................................................................................................4–9
RJ-93...................................................................................................................................................................4–9
SA-103..............................................................................................................................................................4–10
SPS-1.................................................................................................................................................................4–10
SRT-6.................................................................................................................................................................4–10
SS-45.................................................................................................................................................................4–11
SS-46.................................................................................................................................................................4–11
SS-51.................................................................................................................................................................4–11
SS-62.................................................................................................................................................................4–11
ST-37.................................................................................................................................................................4–11
ST-40.................................................................................................................................................................4–12
ST-41.................................................................................................................................................................4–12
ST-44.................................................................................................................................................................4–12
SX-4...................................................................................................................................................................4–12
XCS-4.................................................................................................................................................................4–12
XRF-1.................................................................................................................................................................4–13
Service concepts...................................................................................................................................................4–13
Flash concept with FPS-10..............................................................................................................................4–13
Module jig concept..........................................................................................................................................4–14
POS (Point of Sale) flash concept...................................................................................................................4–15
RF testing and BB testing...............................................................................................................................4–16
CU-4 flash concept with FPS-10......................................................................................................................4–17
Service concept for RF/BB testing and tuning..............................................................................................4–18
LAN connection flash concept........................................................................................................................4–19

List of Figures
Figure 30 Basic flash concept with FPS-10.........................................................................................................4–13
Figure 31 Module jig service concept.................................................................................................................4–14
Figure 32 POS flash concept................................................................................................................................4–15
Figure 33 RF testing and BB testing...................................................................................................................4–16
Figure 34 CU-4 flash concept with FPS-10..........................................................................................................4–17
Figure 35 Service concept for RF/BB testing and tuning..................................................................................4–18
Figure 36 LAN connection flash concept............................................................................................................4–19
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Service tools
The table below gives a short overview of service tools that can be used for testing, error analysis and repair
of product RM-123; RM-145, refer to various concepts.
CA-31D

USB cable

The CA-31D USB cable is used to connect FPS-10 or FPS-11 to a PC. It is
included in the FPS-10 and FPS-11 sales packages.

CA-35S

Power cable

CA-35S is a power cable for connecting, for example, the FPS-10 flash
prommer to the Point-Of-Sales (POS) flash adapter.

CA-53

USB connectivity
cable

USB to system connector cable.

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CU-4

Control unit

CU-4 is a general service tool used with a module jig and/or a flash
adapter. It requires an external 12 V power supply.
The unit has the following features:
• software controlled via USB
• EM calibration function
• Forwards FBUS/Flashbus traffic to/from terminal
• Forwards USB traffic to/from terminal
• software controlled BSI values
• regulated VBATT voltage
• 2 x USB2.0 connector (Hub)
• FBUS and USB connections supported
When using CU-4, note the special order of connecting cables and
other service equipment:

Instructions
1 Connect a service tool (jig, flash adapter) to CU-4.
2 Connect CU-4 to your PC with a USB cable.
3 Connect supply voltage (12 V)
4 Connect an FBUS cable (if necessary).
5 Start Phoenix service software.

Note: Phoenix enables CU-4 regulators via USB when it is
started.
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Reconnecting the power supply requires a Phoenix restart.
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FLS-4S

Flash device

FLS-4S is a dongle and flash device incorporated into one package,
developed specifically for POS use.

FPS-10

Flash prommer

FPS-10 interfaces with:
• PC
• Control unit
• Flash adapter
• Smart card
FPS-10 flash prommer features:
• Flash functionality for BB5 and DCT-4 terminals
• Smart Card reader for SX-2 or SX-4
• USB traffic forwarding
• USB to FBUS/Flashbus conversion
• LAN to FBUS/Flashbus and USB conversion
• Vusb output switchable by PC command
FPS-10 sales package includes:
• FPS-10 prommer
• Power Supply with 5 country specific cords
• USB cable
FS-31

Flash adapter

• FS-31 is equipped with a clip interlock system
• provides standardised interface towards Control Unit
• provides RF connection using coupler
• multiplexing between USB and FBUS media, controlled by VUSB

JBT-9

Bluetooth test and
interface box (sales
package)

The JBT-9 test box is a generic service device used to perform
Bluetooth bit error rate (BER) testing, and establishing cordless FBUS
connection via Bluetooth. An ACP-8x charger is needed for BER testing
and an AXS-4 cable in case of cordless interface usage testing .
Sales package includes:
• JBT-9 test box
• Installation and warranty information
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JXS-1

RF shield box

Because the WCDMA network disturbs the RX side testing of the WCDMA
phone and the Tx signal of the WCDMA phone can severely disturb the
WCDMA network, a shield box is needed in all testing, tuning and fault
finding which requires WCDMA RF signal.
The shield box is not an active device, it contains only passive filtering
components for RF attenuation.

MJ-91

Module jig

MJ-91 is meant for component level troubleshooting.
The jig includes an RF interface for GSM, WCDMA and Bluetooth. In
addition, it has the following features:
• Provides mechanical interface with the engine module
• Provides galvanic connection to all needed test pads in module
• Multiplexing between USB and FBUS media, controlled by Vusb
• MMC interface
• Duplicated SIM connector
• Connector for control unit
• Access for Pop-PortTM system connector
Note: Be careful when closing the jig, not to harm the display
with the screws on the jig!
PCS-1

Power cable

The PCS-1 power cable (DC) is used with a docking station, a module
jig or a control unit to supply a controlled operating voltage.

PKD-1

SW security device

SW security device is a piece of hardware enabling the use of the
service software when connected to the parallel (LPT) port of the PC.
Without the device, it is not possible to use the service software.
Printer or any such device can be connected to the PC through the
device if needed.

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RJ-104

BTHFM rework jig

RJ-104 is a rework jig used when servicing the BTHFM module. It is
used together with rework stencil ST-37.

RJ-108

Soldering jig

RJ-108 is a soldering jig used for soldering and as a rework jig for the
engine module.

RJ-114

Rework jig

RJ-114 is a rework jig used with ST-41.

RJ-57

Rework jig

RJ-57 is a rework jig used with ST-22.

RJ-93

Rework jig

RJ-93 is used as a rework jig for the engine module.
This stencil takes the front end module (FEM) or power amplifier (PA)
module for spreading the soldering paste to the component. Must be
used together with the ST-40 stencil.

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SA-103

RF coupler

SA-103 is an RF coupler for WCDMA and GSM RF testing. It is used
together with the product-specific flash adapter.
The following table shows attenuations from the antenna pads of the
mobile terminal to the SMA connectors of SA-103:
•

Frequency

Att. (dB)

GSM900 TX

2,7 dB +/- 0,5 dB

GSM900 RX

2,6 dB +/- 0,7 dB

GSM1800 TX

8,2 dB +/- 2,0 dB

GSM1800 RX

5,3 dB +/- 0,4 dB

GSM1900 TX

5,1 dB +/- 0,1dB

GSM1900 RX

5,2 dB +/- 0,6 dB

WCDMA2100 TX

10,0 dB +/- 0,9dB

WCDMA2100 RX

6,8 dB +/- 0,4 dB

SPS-1

Soldering Paste
Spreader

SRT-6

Opening tool

SRT-6 is used to open phone covers and B-to-B connectors.

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SS-45

Front camera
removal tool

The front camera removal tool SS-45 is used to remove/attach the
front camera module from/to the socket.

SS-46

Interface adapter

SS-46 acts as an interface adapter between the flash adapter and
FPS-10.

SS-51

Front camera
removal tool

The front camera removal tool SS-51 is used to remove/attach a front
camera module from/to the camera socket of the phone PWB.

SS-62

Generic flash adapter
base for BB5

• generic base for flash adapters and couplers
• SS-62 equipped with a clip interlock system
• provides standardised interface towards Control Unit
• provides RF connection using galvanic connector or coupler
• multiplexing between USB and FBUS media, controlled by VUSB
ST-37

BTHFM rework stencil

ST-37 stencil is used with RJ-104 BTHFM rework jig.

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ST-40

PA rework stencil

This stencil is to be used together with RJ-93 and covering FEM module.

ST-41

Rework stencil

ST-41 is a rework stencil used with rework jig RJ-114.

ST-44

Rework stencil

ST-44 is a rework stencil used with rework jig RJ-57.

SX-4

Smart card

SX-4 is a BB5 security device used to protect critical features in tuning
and testing.
SX-4 is also needed together with FPS-10 when DCT-4 phones are
flashed.

XCS-4

Modular cable

XCS-4 is a shielded (one specially shielded conductor) modular cable
for flashing and service purposes.

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XRF-1

RF cable

The RF cable is used to connect, for example, a module repair jig to
the RF measurement equipment.
SMA to N-Connector ca. 610mm.
Attenuation for:
• GSM850/900: 0.3+-0.1 dB
• GSM1800/1900: 0.5+-0.1 dB
• WLAN: 0.6+-0.1dB

Service concepts
Flash concept with FPS-10

Figure 30 Basic flash concept with FPS-10

Note: FPS-8 concept can also be used for flashing.
Item
1
Issue 1

Type
FS-31

Description
Flash adapter

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Item

Type

Description

2

SS-46

Interface adapter

3

CA-35S

Power cable

4

XCS-4

Modular cable

5

FPS-10

Flash prommer box

6

Standard USB cable

7

PKD-1

SW security device

Module jig concept

Module jig concept is meant for BB / RF testing + tuning and for flashing purposes.
Figure 31 Module jig service concept

Item

Type

Description

1

MJ-91

Module jig

2

CU-4

Control unit

3

FPS-10

Flash prommer box

4

SX-4

Smart card

5

XCS-4

Modular cable

6

PCS-1

DC power cable

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Item

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Type

Description

7

Standard USB cable

8

Standard USB cable

9

GPIB control cable

10

XRS-6

RF cable

11

PKD-1

SW security device

12

RF shield box
Note: Item 12 not shown in the picture.

POS (Point of Sale) flash concept

Figure 32 POS flash concept

Item

Type

Description

1

CA-53

USB connectivity cable

2

FLS-4S

POS flash device

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RF testing and BB testing

Figure 33 RF testing and BB testing

Item
1

Type

Description

SS-62

Flash adapter base

SA-103

Flash adapter

2

CU-4

Control unit

3

SA-103

RF coupler

4

PCS-1

Power cable

5

Standard USB cable

6

Standard USB cable + smart card reader

7

SX-4

8

Smart card
GPIB control cable

9

XRS-6

RF cable

10

PKD-1

SW security device

11

RF shield box
Note: Item 11 is not shown in the figure.

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CU-4 flash concept with FPS-10

Figure 34 CU-4 flash concept with FPS-10

Note: FPS-8 concept can also be used for flashing.
Item
1

Type

Description

SS-62

Flash adapter base

FS-31

Flash adapter

2

CU-4

Control unit

3

XCS-4

Modular cable

4

PCS-1

Power cable

5

FPS-10

Flash prommer box

6

Standard USB cable

7

Standard USB cable

8

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PKD-1

SW security device

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Service concept for RF/BB testing and tuning

Figure 35 Service concept for RF/BB testing and tuning

Item

Type

Description

1

MJ-91

Module jig

2

CU-4

Control unit

3

Standard USB cable

4

PCS-1

5

DC power cable
Standard USB cable + smart card reader

6

SX-4

Smart card

7

XRS-6

RF cable

8

GPIB control cable

9

PKD-1

10

SW security device
RF shield box

Note: Item 10 not shown in the picture.

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LAN connection flash concept

Figure 36 LAN connection flash concept

Item
1

Type

Description

SS-62

Flash adapter base

FS-31

Flash adapter

2

SS-46

Interface adapter

3

CA-35S

Power cable

4

XCS-4

Modular cable

5

FPS-10

Flash prommer box

6

LAN cable

7

LAN cable

8

Issue 1

PKD-1

SW security device

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5 — Disassembly and
reassembly instructions

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Table of Contents
Disassembly instructions.......................................................................................................................................5–5
Reassembly instructions......................................................................................................................................5–16

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Disassembly instructions

Steps
1.

You will need these tools:

2.

Protect the window with a protective film.

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3.

Open the battery cover and ensure that a battery is inserted..

4.

Undo the Torx Plus size 6 screws in the shown order.
Note: For assembly, use the reverse order and a torque of 15 Ncm.

5.

Discard the screws and always use new ones because of the locking compound.

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6.

This picture shows the position of the holding clips on the left side unit.

7.

This picture shows the position of the holding clips on the right side of the unit.

8.

Bring the SRT-6 exactly to the position over the (invisible) clips.

Nokia Customer Care

Note: A little sliding motion could be needed (like a 'credit card') when releasing the snaps. Do not
damage the edges of the A-cover.

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9.

Stick the SRT-6 between the covers and release the four clips.

10. Remove the A-cover and protect the inner window with a protective film.

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11. Protect the LCD module with a protective film.

12. Press out the keymat.

13. Stick the SRT-6 into between the top cover and the camera bezel and release the top cover.

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14. Now, remove the top cover.

15. To release the camera bezel, stick the closed tweezers between the camera bezel and the D-cover.

16. Now, remove the camera bezel.

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17. Unlock the four clips of the C-cover plate assy and loosen it.

18. Flip over the C-cover plate assy and pay attention to the flex foil.

19. Carefully open the flex connector with the SRT-6.

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20. Now, also open the flex connector of the LCD module.

21. Open the Torx Plus size 6 screws in the shown order.
Note: For assembly, use the reverse order and a torque of 17 Ncm.

22. Take off the C-cover assy with the LCD module.

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23. Release the LCD module from the C-cover assy by pushing the edges outwards first. Mind the grounding
clips.

24. Remove the microphone clapton with the dental pick.

25. Use the SRT-6 as an aid to lift out the engine module from the D-cover assy.

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26. Use the soldering jig RJ-108 as a support when working on the camera module. This prevents damaging
or soiling the underneath spring contacts.

27. Take the SS-45 and fit it between the camera module and the shielding.

28. Press the tool and pull out the camera module.

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29. Remove the DC-jack with a DC-plug.

30. Carefully remove the earpiece with a dental tool. Always use a new adhesive tape when replacing
the earpiece.

31. The disassembly procedure is now finished.

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Reassembly instructions

Steps
1. Follow the disassembly instructions in reversed order.
Note: Pay special attention to step 21 and step 4!

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6 — BB Troubleshooting and
Manual Tuning Guide

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Table of Contents
Troubleshooting overview....................................................................................................................................6–5
Power and charging troubleshooting..................................................................................................................6–6
Dead or jammed device troubleshooting.......................................................................................................6–6
General power checking...................................................................................................................................6–8
Golden eye troubleshooting.............................................................................................................................6–9
Charging troubleshooting..............................................................................................................................6–10
Interface troubleshooting...................................................................................................................................6–11
Flash programming fault troubleshooting...................................................................................................6–11
CMT SDRAM memory troubleshooting...........................................................................................................6–13
CMT NOR flash fault troubleshooting............................................................................................................6–14
SD card troubleshooting.................................................................................................................................6–15
USB interface troubleshooting.......................................................................................................................6–17
SIM card troubleshooting...............................................................................................................................6–19
User interface troubleshooting...........................................................................................................................6–21
Power key troubleshooting............................................................................................................................6–21
Key troubleshooting.......................................................................................................................................6–21
Display module troubleshooting...................................................................................................................6–22
General instructions for display troubleshooting...................................................................................6–22
Display troubleshooting............................................................................................................................6–25
Display and top keyboard backlight troubleshooting............................................................................6–26
Main keyboard backlight troubleshooting..............................................................................................6–26
Camera module troubleshooting........................................................................................................................6–27
Introduction to camera troubleshooting.....................................................................................................6–27
Taking and evaluating test pictures..............................................................................................................6–27
Camera hardware failure message troubleshooting...................................................................................6–28
Camera baseband HW troubleshooting........................................................................................................6–29
Camera viewfinder troubleshooting.............................................................................................................6–30
Bad camera image quality troubleshooting.................................................................................................6–31
Audio troubleshooting.........................................................................................................................................6–32
Audio troubleshooting test instructions......................................................................................................6–32
Internal earpiece troubleshooting................................................................................................................6–36
Internal microphone troubleshooting..........................................................................................................6–37
IHF troubleshooting........................................................................................................................................6–38
External microphone troubleshooting..........................................................................................................6–39
External earpiece troubleshooting................................................................................................................6–40
Vibra troubleshooting....................................................................................................................................6–41
Baseband manual tuning guide.........................................................................................................................6–41
Certificate restoring for BB5.0 products.......................................................................................................6–41
Energy management calibration...................................................................................................................6–47

List of Tables
Table 13 Display module troubleshooting cases..............................................................................................6–23
Table 14 Pixel defects..........................................................................................................................................6–23
Table 15 Calibration value limits........................................................................................................................6–47

List of Figures
Figure 37 Flashing pic 1. Take single trig measurement for the rise of the BSI signal.................................6–12
Figure 38 Flashing pic 2. Take single trig measurement for the rise of the BSI signal.................................6–13
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Figure 39 NOR CLK from J3004............................................................................................................................6–14
Figure 40 SD card initialization from pin J3206................................................................................................6–16
Figure 41 USB 1: D-TXD (PopPort TM pin 6) and D+RXD (PopPort TM pin 7) voltage levels when USB is
connected...................................................................................................................................................6–18
Figure 42 SIM interface signals...........................................................................................................................6–19
Figure 43 Single-ended output waveform of the Ext_in_HP_out measurement when earpiece is
connected...................................................................................................................................................6–34
Figure 44 Differential output waveform of the Ext_in_IHF_out out loop measurement when speaker is
connected...................................................................................................................................................6–34
Figure 45 Single-ended output waveform of the HP_in_Ext_out loop when microphone is connected....
6–35

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Troubleshooting overview
For practical reasons, troubleshooting is divided into two sections;
• Baseband troubleshooting, including camera
• RF troubleshooting, including FM radio and Bluetooth

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Power and charging troubleshooting
Dead or jammed device troubleshooting

Troubleshooting flow

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General power checking

Voltages
Check the following voltages:
Signal
Rename

Regulator

Sleep

Idle

Nominal
voltage

Main user

Notes

VIO

RETU

ON

ON

1.82

Memory, I/Os,
IrDA, Display

VBACK

RETU

ON

ON

2.5

Back-up
battery

VSIM1

RETU

ON

ON

1.8/3.0

SIM card

VSIM2

RETU

OFF

OFF

3.0

Keyboard
backlight

VDRAM

RETU

ON

ON

1.82

SDRAM

VAUX

RETU

OFF

OFF

2.5

IrDA

VANA

RETU

ON

ON

2.5

Audio, some
pull-ups

VR1

RETU

OFF

ON

2.5

Crystal
oscillators

VRFC

RETU

OFF

ON

1.8

RAP3G
converters

VRCP1

RETU

4.5

To RF parts

RF active

VRCP2

RETU

4.5

To RF parts

RF active

VREF

RETU

ON

ON

1.35

RF reference

VCORE

TAHVO

ON

ON

1.4

RAP3G digital

VOUT

TAHVO

OFF

OFF

2.5

VCAM_2V8

LP3987ITLX-2.
85/N1060

OFF

OFF

2.85

Camera

Camera ON

VCAM_1V8

LM3671TLX-1.
82/N1080

OFF

OFF

1.8

Camera

Camera ON

VCAM_1V5

TPS62311YZD
R/N1050

OFF

OFF

1.5

Camera

Camera ON

2V8_FM_LCD

LP3985ITLX-2.
85/N6050

ON

ON

2.85

FM, LCD, Hall
sensor

VMMC

LP3928TLX-18
28/N3200

OFF

OFF

3.0

MCC card

LCD_LED_OUT

4w_LED_DRIVE
R

OFF

OFF

Page 6 –8

EL-foil driver

IrDA active

Accessory
connected

LCD Backlight

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Golden eye troubleshooting

Context
Golden eye is placed under a non removable shield and cannot be replaced.
Please swap the board.

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Charging troubleshooting

Troubleshooting flow

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Interface troubleshooting
Flash programming fault troubleshooting

Part 1

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Part 2

Figure 37 Flashing pic 1. Take single trig measurement for the rise of the BSI signal.

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Figure 38 Flashing pic 2. Take single trig measurement for the rise of the BSI signal.

CMT SDRAM memory troubleshooting

Troubleshooting flow

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CMT NOR flash fault troubleshooting

Troubleshooting flow

Figure 39 NOR CLK from J3004

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SD card troubleshooting

Troubleshooting flow

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Take single trig measurement on the rising edge of the DAT signal.
Figure 40 SD card initialization from pin J3206

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USB interface troubleshooting

Troubleshooting flow

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Figure 41 USB 1: D-TXD (PopPort TM™ pin 6) and D+RXD (PopPort TM™ pin 7) voltage levels when USB is connected.

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SIM card troubleshooting

Troubleshooting flow

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SIM CLK frequency = 3.2MHz (Take single triggered measurement in boot on the VSIM1 line).
Figure 42 SIM interface signals

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User interface troubleshooting
Power key troubleshooting

Troubleshooting flow

Key troubleshooting

Context
There are two possible failure modes in the keyboard module:

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• One or more keys are stuck, so that the key does not react when a keydome or a side key is pressed. This
kind of failure is caused by mechanical reasons (dirt, rust, mechanical damage, etc.)
• Malfunction of several keys at the same time; this happens when one or more rows or columns in the key
matrix are failing (shortcut or open connection).
If the failure mode is not clear, start with the Keyboard test in Phoenix.

Troubleshooting flow

Display module troubleshooting

General instructions for display troubleshooting

Context
• The display is in a normal mode when the phone is in active use.
• Display is in a partial idle mode when the phone is in the screen saver mode.
• The operating modes of the display can be controlled with the help of Phoenix.

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Table 13 Display module troubleshooting cases

Display blank

There is no image on the display. The display looks
the same when the phone is on as it does when the
phone is off. The backlight can be on in some cases.

Image on the display not correct

Image on the display can be corrupted or a part of
the image can be missing. If a part of the image is
missing, change the display module. If the image is
otherwise corrupted, follow the appropriate
troubleshooting diagram.

Backlight dim or not working at all

Backlight LED components are inside the display
module. Backlight failure can also be in the
connector or in the backlight power source in the
main engine of the phone.
This means that in case the display is working
(image OK), the backlight is faulty.

Visual defects (pixel)

Pixel defects can be checked by controlling the
display with Phoenix. Use both colours, black and
white, on a full screen.
The display may have some random pixel defects
that are acceptable for this type of display. The
criteria when pixel defects are regarded as a display
failure, resulting in a replacement of the display, are
presented the following table.

Table 14 Pixel defects

Item
1

White dot defect
Defect
counts

2

Combine
d defect
counts

Black dot
defect

R

G

B

White
Dot
Total

1

1

1

1

1

Total
1

Not allowed.
Two single dot defects that are within 5 mm of each other should
be interpreted as combined dot defect.

Steps
1. Verify with a working display that the fault is not on the display module itself.
The display module cannot be repaired.
2. Check that the cellular engine is working normally.
i

To check the functionality, connect the phone to a docking station.

ii

StartPhoenix service software.

iii Read the phone information to check that also the application engine is functioning normally (you
should be able to read the APE ID).

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3. Proceed to the display troubleshooting flowcharts.

Use the Display Test tool in Phoenix to find the detailed fault mode.

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Display troubleshooting

Troubleshooting flow

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Display and top keyboard backlight troubleshooting

Context
The device has one LED driver that provides current for both display and keyboard backlights.

Troubleshooting flow

Main keyboard backlight troubleshooting

Context
The device has one LED driver that provides current for the main keyboard backlights.

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Troubleshooting flow

Camera module troubleshooting
Introduction to camera troubleshooting
Bad conditions often cause bad pictures. Therefore, the camera operation has to be checked in constant
conditions or by using a second, known-to-be-good Nokia device as reference. Image quality is hard to
measure quantitatively, and the difference between a good and a bad picture can be small. Some training
or experience may be needed to detect what is actually wrong.
When checking for possible errors in camera functionality, knowing what error is suspected significantly
helps the testing by narrowing down the amount of test cases. The following types of image quality problems
are common:
• Dust (black spots)
• Lack of sharpness
• Bit errors

Taking and evaluating test pictures
When taking a test picture, remember the following:
• Avoid bright fluorescent light, 50/60Hz electrical network or high artificial illumination levels
• If the phone is hot, let it rest for a while before taking the picture
• Make sure the optical system is clean
• Use highest possible resolution
• Make sure the light is suffiecient (bright office lightning)
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• Do not take the picture towards light source
• Be as still as possible when taking the picture
• Distance should be at least 40cm, 1-2m is recommended
When evaluating a test picture, remember the following:
• The center of the picture is sharper than the edges

• The image may be blurred, though it does not show in the viewfinder
• Analyse the picture from your PC monitor, full colour setting is recommended
• If possible, compare with a picture of the same motive taken with a similar Nokia device

Camera hardware failure message troubleshooting

Context
If you get a hardware failure message when using the camera, follow the next troubleshooting flowchart.

Troubleshooting flow

Note: Make sure that the phone has the latest software before continuing.
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Camera baseband HW troubleshooting

Troubleshooting flow

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Camera viewfinder troubleshooting

Troubleshooting flow

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Bad camera image quality troubleshooting

Troubleshooting flow

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Audio troubleshooting
Audio troubleshooting test instructions
Differential external earpiece and internal earpiece outputs can be measured either with a single-ended or
a differential probe.
When measuring with a single-ended probe each output is measured against the ground.
Internal handsfree output is measured using a current probe, if a special low-pass filter designed for
measuring a digital amplifier is not available. Note also that when using a current probe, the input signal
frequency must be set to 2kHz.
The input signal for each loop test can be either single-ended or differential.

Required equipment
The following equipment is needed for the tests:
• Oscilloscope
• Function generator (sine waveform)
• 'Active speaker' or 'speaker and power amplifier'
• Sound level meter
• Current probe (Internal handsfree DPMA output measurement)
• Phoenix service software
• Battery voltage 3.7V

Test procedure
Audio can be tested using the Phoenix audio routings option. Three different audio loop paths can be
activated:
• External microphone to Internal earpiece
• External microphone to Internal handsfree speaker
• Internal microphone to External earpiece
Each audio loop sets routing from the specified input to the specified output enabling a quick in-out test.
Loop path gains are fixed and they cannot be changed using Phoenix. Correct pins and signals for each test
are presented in the following table.

Phoenix audio loop tests and test results
The results presented in the table apply when no accessory is connected and battery voltage is set to 3.7V.
Earpiece, internal microphone and speaker are in place during measurement. Applying a headset accessory
during measurement causes a significant drop in measured quantities.
The gain values presented in the table apply for a differential output vs. single-ended/differential input.

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Loop test

Input
terminal

Output
terminal

External Mic to
External Earpiece

XMICP and
GND

HSEAR R P,
HSEAR R N
and GND

Nokia Customer Care
Path
Input
Differential
gain [dB] voltage
output
(fixed) [mVp-p]
voltage
[mVp-p]

Output
DC level
[V]

Output
current
[mA]

-2.9

1000

720

1.2

NA

-4.5

1000

600

1.2

NA

-5

1000

560

0

25mA
(calc.)

22.7

100

1360

1.2

NA

HSEAR P,
HSEAR N
and GND
XMICN and
GND

HSEAR R P,
HSEAR R N
and GND
HSEAR P,
HSEAR N
and GND

External Mic to
Internal Earpiece

XMICP and
GND

EarP and
GND
EarN and
GND

XMICN and
GND

EarP and
GND
EarN and
GND

External Mic to
Internal
handsfree

XMICP and
GND

B2102 pads

XMICN and
GND

B2102 pads

Internal Mic to
External Earpiece

B2100
(OUT/GND)

HSEAR R P,
HSEAR R N
and GND
HSEAR P,
HSEAR N
and GND
HSEAR R P,
HSEAR R N
and GND
HSEAR P,
HSEAR N
and GND

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Measurement data

Figure 43 Single-ended output waveform of the Ext_in_HP_out measurement when earpiece is connected.

If a special low-pass filter designed for measuring digital amplifiers is unavailable, the measurement must be performed with a
current probe and the input signal frequency must be 2kHz.
Figure 44 Differential output waveform of the Ext_in_IHF_out out loop measurement when speaker is connected.

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Figure 45 Single-ended output waveform of the HP_in_Ext_out loop when microphone is connected.

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Internal earpiece troubleshooting

Troubleshooting flow

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Internal microphone troubleshooting

Troubleshooting flow

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IHF troubleshooting

Troubleshooting flow

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External microphone troubleshooting

Troubleshooting flow

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External earpiece troubleshooting

Troubleshooting flow

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Vibra troubleshooting

Troubleshooting flow

Baseband manual tuning guide
Certificate restoring for BB5.0 products

Context
This procedure is performed when the device certificate is corrupted for some reason.
All tunings (RF & Baseband, UI) must be done after performing the certificate restoring procedure.
The procedure for certificate restoring is the following:
• Flash the phone with the latest available software using FPS-8 or FPS-10.
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Note: USB flashing does not work for a dead BB5.0 phone.
• Create a request file.
• Send the file to Nokia by e-mail. Use the following addresses depending on your location:
• APAC: sydney.service@nokia.com
• CHINA: repair.ams@nokia.com
• E&A: salo.repair@nokia.com
• AMERICAS: fls1.usa@nokia.com
• When you receive a reply from Nokia, carry out certificate restoring.
• Tune the phone completely.
Note: SX-4 smart card is needed.
• If the phone resets after certificate restoring, reflash the phone again.
Required equipment and setup:
• Phoenix service software v 2004.39.7.70 or newer.
• The latest phone model specific Phoenix data package.
• PKD-1 dongle
• SX-4 smart card (Enables BB5.0 testing and tuning features)
• External smart card reader
Note: The smart card reader is only needed when FPS-8 is used. FPS-10 has an integrated smart card
reader.
• Activated FPS-8 flash prommer OR FPS-10 flash prommer
• Flash update package 03.18.004 or newer for FPS-8 or FPS-10 flash prommers
• CU-4 control unit
• USB cable from PC USB Port to CU-4 control unit
• Phone model specific adapter for CU-4 control unit
• PCS-1 cable to power CU-4 from external power supply
• XCS-4 modular cable between flash prommer and CU-4
Note: CU-4 must be supplied with +12 V from an external power supply in all steps of certificate
restoring.

Steps
1. Program the phone software.
i

Start Phoenix and login. Make sure the connection has been managed correctly for FPS-8 or FPS-10.

ii

Update the phone MCU software to the latest available version.
If the new flash is empty and the phone cannot communicate with Phoenix, reflash the phone.

iii Choose the product manually from File→Open Product , and click OK.
Wait for the phone type designator (e.g. “RM-1” ) to be displayed in the status bar.
iv Go to Flashing→SW Update and wait until Phoenix reads the product data as shown in the following
picture.

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Product

is automatically set according to the phone support module which was opened manually,
but the flash files cannot be found because the correct data cannot be read from the phone
automatically.

Code

must be chosen manually, it determines the correct flash files to be used. Please choose the
correct product code (can be seen in the phone type label) from the dropdown list.

Flash Type

must be set to Phone as Manufactured.

v

To continue, click Start.
Progress bars and messages on the screen show actions during phone programming, please wait.

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Programming is completed when Flashing Completed message is displayed.
The product type designator and MCU SW version are displayed in the status bar.
vi Close the SW Update window and then choose File→Close Product .
2. Create a Request file.
For this procedure, you must supply +12 V to CU-4 from an external power supply.
i

To connect the phone with Phoenix, choose File→Scan Product .

ii

Choose Tools→Certificate Restore .

iii To choose a location for the request file, click Browse.

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iv Name the file so that you can easily identify it, and click Open.

The name of the file and its location are shown.

v

To create the Request file, click Start.

vi When the file for certificate restore has been created, send it to Nokia as an e-mail attachment.
3. Restore certificate.
For this procedure, you must supply +12 V to CU-4 from an external power supply.
i

Save the reply file sent by Nokia to your computer.

ii

Start Phoenix service software.

iii Choose File→Scan Product .

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iv From the Tools menu, choose Certificate Restore and select Process a response file in the Action
pane.

v

To choose the location where response file is saved, click Browse.

vi Click Open.

The name of the file and the path where it is located are shown.
vii To write the file to phone, click Start.

Next actions
After a successful rewrite, you must retune the phone completely by using Phoenix tuning functions.
Important: Perform all tunings: RF, BB, and UI.
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Energy management calibration

Prerequisites
Energy Management (EM) calibration is performed to calibrate the setting (gain and offset) of AD converters
in several channels (that is, battery voltage, BSI, battery current) to get an accurate AD conversion result.
Hardware setup:
• An external power supply is needed.
• Supply 12V DC from an external power supply to CU-4 to power up the phone.
• The phone must be connected to a CU-4 control unit with a product-specific flash adapter.

Steps
1.

Place the phone to the docking station adapter (CU-4 is connected to the adapter).

2.

Start Phoenix service software.

3.

Choose File→ Scan Product.

4.

Choose Tuning→Energy Management Calibration.

5.

To show the current values in the phone memory, click Read, and check that communication between
the phone and CU-4 works.

6.

Check that the CU-4 used check box is checked.

7.

Select the item(s) to be calibrated.
Note: ADC calibration has to be performed before other item(s). However, if all calibrations are
selected at the same time, there is no need to perform the ADC calibration first.

8.

Click Calibrate.
The calibration of the selected item(s) is carried out automatically.
The candidates for the new calibration values are shown in the Calculated values column. If the new
calibration values seem to be acceptable (please refer to the following "Calibration value limits" table),
click Write to store the new calibration values to the phone permanent memory.
Table 15 Calibration value limits

Parameter

9.

Min.

Max.

ADC Offset

-20

20

ADC Gain

12000

14000

BSI Gain

1100

1300

VBAT Offset

2400

2650

VBAT Gain

19000

23000

VCHAR Gain

N/A

N/A

IBAT (ICal) Gain

7750

12250

Click Read, and confirm that the new calibration values are stored in the phone memory correctly. If the
values are not stored to the phone memory, click Write and/or repeat the procedure again.

10. To end the procedure, close the Energy Management Calibration window.

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7 — RF troubleshooting

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Table of Contents
General RF troubleshooting...................................................................................................................................7–5
General RF troubleshooting.............................................................................................................................7–5
RF key components...........................................................................................................................................7–6
Auto tuning for BB5.0............................................................................................................................................7–6
GSM Receivers.........................................................................................................................................................7–7
GSM RX Troubleshooting...................................................................................................................................7–7
GSM Transmitters....................................................................................................................................................7–8
GSM900/1800/1900 TX Troubleshooting........................................................................................................7–8
WCDMA Receiver...................................................................................................................................................7–10
WCDMA RX Troubleshooting...........................................................................................................................7–10
WCDMA Transmitter.............................................................................................................................................7–11
WCDMA TX Troubleshooting...........................................................................................................................7–11
Synthesizer troubleshooting ..............................................................................................................................7–12
PIHI (N7500) Troubleshooting.......................................................................................................................7–12
Synthesizer Troubleshooting.........................................................................................................................7–13
Bluetooth and FM radio.......................................................................................................................................7–15
Bluetooth troubleshooting............................................................................................................................7–15
FM radio troubleshooting...............................................................................................................................7–16

List of Figures
Figure 46 Auto tuning concept with CMU200......................................................................................................7–7
Figure 47 GSM900/1800/1900 RX test points......................................................................................................7–8
Figure 48 GSM900/1800/1900 TX test points......................................................................................................7–9
Figure 49 WCDMA RX test points.........................................................................................................................7–11
Figure 50 WCDMA TX test points.........................................................................................................................7–12
Figure 51 PIHI (N7500) test points.....................................................................................................................7–13
Figure 52 Synthesizer test points.......................................................................................................................7–14
Figure 53 Troubleshooting diagram: Bluetooth...............................................................................................7–15
Figure 54 Troubleshooting diagram: FM radio.................................................................................................7–16

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General RF troubleshooting
General RF troubleshooting

Most RF semiconductors are static discharge sensitive
Two types of measurements are used in the following. It will be specified if the measurement type is "RF" or
"LF".
• RF measurements are done with a Spectrum Analyzer and a high-frequency 500 ohm passive probe, for
example HP54006A. (Note that when measuring with the 500 ohm probe the signal will be around 20 dB
attenuated. The values in the following will have these 20 dB subtracted and represent the real value seen
on the spectrum analyzer). Note that the testing have some losses which must be taken into consideration
when calibrating the test system.
• LF (Low frequency) and DC measurements should be done with a 10:1 probe and an oscilloscope. The probe
used in the following is 10 Mohm/8pF passive probe. If using another probe then bear in mind that the
voltages displayed may be slightly different. Always make sure the measurement set-up is calibrated when
measuring RF parameters on the antenna pad. Remember to include the loss in the module repair jig when
realigning the phone.
So ESD protection must be applied during repair (ground straps and ESD soldering irons). RF IC N7500 and
Frond end module (N7520) are moisture sensitive so parts must be pre-baked prior to soldering. Apart from
key-components described in this document there are a lot of discrete components (resistors, inductors and
capacitors) for which troubleshooting is done by checking if soldering of the component is done properly
and checking if the component is missing from PWB. Capacitors can be checked for short-circuiting and
resistors for value by means of an ohmmeter, but be aware in-circuit measurements should be evaluated
carefully. In the following both the name EGSM and GSM 900 will be used for the lower band and both PCN
and GSM 1800 will be used for the upper band.

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RF key components

Auto tuning for BB5.0
This phone can be tuned automatically.
Autotune is designed to align the phone's RF part easier and faster. It performs calibrations, tunings and
measurements of RX and TX. The results are displayed and logged in a result file, if initiated.

Hardware set up
Hardware requirements for auto tuning:
• PC (Windows 2000/XP) with GPIB card
• Power supply
• Product specific module jig
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• Cables: XRF-1 (RF cable), USB cable, GBIP cable and DAU-9S
• Signal analyser (TX), signal generator (RX) and RF-splitter or one device including all.

Figure 46 Auto tuning concept with CMU200

Phoenix preparations
Install the phone specific data package, for example RM-123/145_dp_1.78_sw_sh3.26.exe. This defines phone
specific settings..

Auto tuning procedure
1 Make sure the phone (in the jig) is connected to the equipment. Else, some menus will not be shown in
Phoenix.
2 To go to autotune, select Tuning (Alt-U) > Auto-Tune (Alt-A) from the menu.
3 Start autotuning, clicking the Tune button.

GSM Receivers
GSM RX Troubleshooting

Preparations
Make the following settings:
Setting

GSM900

Phoenix RF Control

GSM1800

GSM1900

Continues RX and AGC gain step 14

Phoenix channel

37

700

661

Signal generator to
antenna connector

942.46771 MHz
(67.71kHz offset) at
-60dBm

1842.86771MHz
(67.71kHz offset) at
-60dBm

1960.06771MHz
(67.71kHz offset) at
-60dBm

Spectrum analyzer

RBW=500kHz, VBW=500kHz, span=20kHz

Centre frequency

942MHz

1840MHz

1960MHz

Check the following
Check the levels in the steps below.

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NO.

Signal Name

Test point

GSM900

GSM1800

GSM1900

1

RXIP (out)

J7515

124mVpp,
730mVDC

106mVpp,
760mVDC

100mVpp,
780mVDC

2

RXQP (OUT)

J7517

124mVpp,
730mVDC

106mVpp,
690mVDC

100mVpp,
690mVDC

3

VC1_TXFEM

J7530

0V

0V

0V

4

VC2_TXFEM

J7531

0V

2.7VDC

2.7VDC

5

VC3_TXFEM

J7532

0V

0V

2.7VDC

1 Measure RXIP 1
and RXQP 2.
2 Measure front end module control signal voltages 3, 4 and 5.

Figure 47 GSM900/1800/1900 RX test points

GSM Transmitters
GSM900/1800/1900 TX Troubleshooting

Preparations
Make the following settings:

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Setting

GSM900

GSM1800

Phoenix RF Control

Operational mode = Burst

Phoenix Tx Power level

Tx data type = Random
10

GSM1900

5

5

Check the following
Check the voltages in the steps below.
NO.

Signal Name

Test point

GSM900

GSM1800

GSM1900

1

V_Det_GSM

J7533

730mVDC

660mVDC

690mVDC

2

PA_supply-VBAT

C7521

3.8VDC

3.8VDC

3.8VDC

3

RF level-ANT_GSM

Conn.

23dBm

20dBm

20dBm

4

Sw cont-VC1_TXFEM

J7530

2.75VDC

2.75VDC

2.75VDC

5

Sw con-VC2_TXFEM

J7531

0V

2.75VDC

2.75VDC

6

Sw con-VC3_TXFEM

J7532

2.75VDC

2.75VDC

2.75VDC

7

Tx-1

R7522

897.4MHz/-28.7
dBm

-

-

Figure 48 GSM900/1800/1900 TX test points

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WCDMA Receiver
WCDMA RX Troubleshooting

Preparations
Set Phoenix to RF local mode WCDMA RX.
Equipment/Settinig

Unit

Phoenix
WCDMA

FDD

RF channel

2140MHz ~10700

Frequency offset

+0.000kHz

Output channel power

-60dBm
P-sch~ -2dB
S-sch~ -2dB
P-cc pch~ -2dB
DPDch~ -7dB

AGCMod*

Algorithm

Channel*

10700

BB AGC*

0dB

Spectrum analyzer*
Span

~ 20MHz

Centre frequency

2140MHz

VBW

500kHz

RBW

500kHz

Output channel power

-30dB

RF AH

~ 30dB

Check the following
Check the levels in the steps below.
NO.

Signal Name

Test point

Check

1

PXIP (out)

J7515

720mVpp single ended

2

RXQP (OUT)

J7517

720mVpp single ended

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Figure 49 WCDMA RX test points

WCDMA Transmitter
WCDMA TX Troubleshooting

Preparations
Set Phoenix to RF local mode WCDMA TX (Channel 9737, 0 dBm output).

Check the following
Check the levels in the steps below.
NO.

Signal Name

Test point

Check

1

WTXDET

C7544

115mVDC

2

VBAT

C7542

3.82VDC

3

PA supply - Vreg

C7543

~1.3 VDC @ 0dBm

4

RF level - ANT_WCDMA

X8003

0dBm on antenna

6

WDET

C7545

2.75 VDC

7

DAC101

R7541

300 mVDC

8

DAC201

J7538

1.5 VDC

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Figure 50 WCDMA TX test points

Synthesizer troubleshooting
PIHI (N7500) Troubleshooting

Preparations
Set Phoenix to RF local mode RX burst.

Check the following
Check the voltages in the steps below.
NO.

Signal Name

Test point

Check GSM900

Suppliers
1

VBATRF (in)

L7500

3.8VDC

2

VR1_RX (out)

C7503

2.8VDC

3

VR1_TX (out)

C7502

2.8VDC

4

VR2_TX (out)

C7501

2.8VDC

5

VREFRF01 (in)

R7501

1.36VDC

C2221

4.76VDC

VB_EXT
6

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Figure 51 PIHI (N7500) test points

Synthesizer Troubleshooting

Preparations
Set Phoenix to RF local mode RX continuous.

Check the following
Check the levels in the steps below.
NO.

Signal Name

Test point

Check

VCTCXO
1

VXO (in)

C7504

2.4VDC

2

OSCIN

G7500

85mVpp at 38.4MHz

3

AFC (in)

R7500

1.2VDC

4

VVCO_EXT

R7505

2.72VDC

5

VCO Output

T7501

-17dBm at 3769.6MHz

6

VCO Control

C7510

2.7VDC

VCO

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Figure 52 Synthesizer test points

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Bluetooth and FM radio
Bluetooth troubleshooting

Troubleshooting flow

Figure 53 Troubleshooting diagram: Bluetooth

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FM radio troubleshooting

Troubleshooting flow

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CONFIDENTIAL
Figure 54COMPANY
Troubleshooting
diagram: FM radio
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8 — System Module

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Table of Contents
Introduction............................................................................................................................................................8–5
Block diagram....................................................................................................................................................8–5
Energy management..............................................................................................................................................8–7
Battery and interface........................................................................................................................................8–7
Normal and extreme voltages.........................................................................................................................8–7
Power key and system power-up....................................................................................................................8–8
Modes of operation...........................................................................................................................................8–8
Power distribution............................................................................................................................................8–9
Clocking scheme................................................................................................................................................8–9
USB, SIM, MMC.......................................................................................................................................................8–10
USB....................................................................................................................................................................8–10
SIM interface....................................................................................................................................................8–10
µSD card interface...........................................................................................................................................8–11
Camera...................................................................................................................................................................8–11
Camera.............................................................................................................................................................8–11
User interface........................................................................................................................................................8–12
Display interface..............................................................................................................................................8–12
Keyboard and side keys..................................................................................................................................8–12
Backlight and illumination.............................................................................................................................8–13
Audio concept.......................................................................................................................................................8–14
Audio hardware architecture.........................................................................................................................8–14
Internal microphone.......................................................................................................................................8–15
External microphone.......................................................................................................................................8–16
Internal earpiece.............................................................................................................................................8–16
Internal speaker..............................................................................................................................................8–17
External earpiece.............................................................................................................................................8–17
Vibra circuitry..................................................................................................................................................8–18
Pop-portTM connector....................................................................................................................................8–18
Bluetooth and FM radio.......................................................................................................................................8–19
Bluetooth.........................................................................................................................................................8–19
FM radio............................................................................................................................................................8–20
RF description.......................................................................................................................................................8–21
Introduction to receiver functionality...........................................................................................................8–21
WCDMA receiver functionality........................................................................................................................8–21
GSM receiver functionality..............................................................................................................................8–21
Introduction to transmitter functionality.....................................................................................................8–21
WCDMA transmitter functionality..................................................................................................................8–21
GSM transmitter functionality........................................................................................................................8–22
Frequency synthesizers..................................................................................................................................8–23
Regulators........................................................................................................................................................8–23

List of Tables
Table 16 Nominal voltages....................................................................................................................................8–7
Table 17 Pop-PortTMpin and signal table..........................................................................................................8–18

List of Figures
Figure 55 Block diagram........................................................................................................................................8–6
Figure 56 Battery pin order...................................................................................................................................8–7
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Figure 57 Power regulator diagram.....................................................................................................................8–9
Figure 58 Clocking scheme..................................................................................................................................8–10
Figure 59 SIM interface........................................................................................................................................8–11
Figure 60 LCD module..........................................................................................................................................8–12
Figure 61 Audio block diagram...........................................................................................................................8–15
Figure 62 Internal microphone circuitry............................................................................................................8–16
Figure 63 External microphone circuitry (Pop-Port connects to the right side)............................................8–16
Figure 64 Internal earpiece circuitry..................................................................................................................8–16
Figure 65 Internal speaker circuitry...................................................................................................................8–17
Figure 66 External earpiece circuitry (system connector connected on the right).......................................8–17
Figure 67 Vibra circuitry......................................................................................................................................8–18
Figure 68 System connector pin layout.............................................................................................................8–18
Figure 69 Bluetooth interface.............................................................................................................................8–20
Figure 70 FM interface.........................................................................................................................................8–20
Figure 71 GSM transmitter...................................................................................................................................8–22
Figure 72 RF supply connections from the BB mixed mode ASIC....................................................................8–24

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Introduction
Block diagram
RAP3G is the main digital baseband ASIC in the phone. It contains functionality for both WCDMA and GSM EDGA
and the Golden Eye is used as a co-processor.
Retu is mainly the audio ASIC in the phone and Tahvo is basically the energy management controller for the
phone.
Bluetooth and stereo FM Radio is integrated in one single ASIC.

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Figure 55 Block diagram

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Energy management
Battery and interface
The phone i powered by a 3-pole BP-6M S-pack 1100 mAh battery. The three poles are named VBAT, BSI and
GND where the BSI line is used to recognize the battery capacity. This is done by means of an internal battery
pull down resistor.

Figure 56 Battery pin order

Battery temperature is estimated by measuring separate battery temperature NTC via the BTEMP line, which
is located on the main PWB, at a place where the phone temperature is most stabile.
The connection from the charger connector to the charger is established via a charger adaptor type CA-44.
For service purposes, the device SW can be forced into local mode by using pull down resistors connected to
the BSI line.

Normal and extreme voltages
Energy management is mainly carried out in the two Application Specific Integrated Circuits (ASICs) RETU and
TAHVO. These two circuits contains a number of regulators. In addition there are some external regulators
too.
In the table below normal and extreme voltages are shown when a BP-6M S-pack battery is used.
Table 16 Nominal voltages

Voltage

Voltage [V]

Condition

General Conditions
Nominal voltage

3.9

Lower extreme voltage

3.215

Higher extreme voltage
(fast charging)

4.23
HW Shutdown Voltages

Vmstr+

2.1 ± 0.1

Off to on

Vmstr-

1.9 ± 0.1

On to off

SW Shutdown Voltages
Sw shutdown

3.1

In call

Sw shutdown

3.2

In idle

Min Operating Voltage
Vcoff+

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2.9 ± 0.1

Off to on

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Voltage

Voltage [V]

Condition

Vcoff-

2.6 ± 0.1

On to off

Power key and system power-up
When the battery is placed in the phone the power key circuits are energized. When the power key is pressed,
the system boots up (if an adequate battery voltage is present).
Power down can be initiated by pressing the power key again (the system is powered down with the aid of
SW). The power key is connected to RETU ASIC via PWRONX signal.

Different power-up conditions
Power up can be caused by the following reasons:
• Power key is pressed
• Charger is connected
• RTC alarm occurs
• MBUS wake-up
After that:
• RETU activates sleep clock and VANA, VDRAM, VIO and VR1 regulators.
• Voltage appearing at RETU’s RSTX pin is used for enabling TAHVO ASIC.
• TAHVO enables VCORE regulator and its internal RC-oscillator (600kHz).
• VCTCXO regulator is set ON and RF clock (main system clock) is started to produce.
• RETU will release PURX ~ 16ms after power up is enabled (the RF clock is then stable enough).
• Synchronizing clock (2.4MHz) for TAHVO is started to be produced. After PURX is released and two rising
edges of 2.4MHz synchronous clock have been detected in SMPSClk input TAHVO is starting to use that
instead of 600kHz internal RC-oscillator.
• HW start-up procedure has been finalized and the system is up and running. Now it is possible for SW to
switch ON other needed regulators.

Modes of operation
Mode

Description

NO_SUPPLY

(dead) mode means that the main battery is not present or its voltage is too low (below
RETU master reset threshold) and that the back-up battery voltage is too low.

BACK_UP

The main battery is not present or its voltage is too low but back-up battery voltage is
adequate and the 32kHz oscillator is running (RTC is on).

PWR_OFF

In this mode (warm), the main battery is present and its voltage is over RETU master
reset threshold. All regulators are disabled, PurX is on low state, the RTC is on and the
oscillator is on. PWR_OFF (cold) mode is almost the same as PWR_OFF (warm), but the
RTC and the oscillator are off.

RESET

RESET mode is a synonym for start-up sequence. RESET mode uses 32kHz clock to count
the REST mode delay (typically 16ms).

SLEEP

SLEEP mode is entered only from PWR_ON mode with the aid of SW when the system’s
activity is low.

FLASHING

FLASHING mode is for SW downloading.

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Power distribution
The power distribution is shown in the diagram below. Current consumption is measured via the Current
Gauge Resistor and the battery voltage is stabilized by means of a capacitor. The tables below specifies the
voltages.

Figure 57 Power regulator diagram

Clocking scheme
In BB5.0, two main clocks are provided to the system: 38.4MHz RF clock produced by VCTCXO in RF section
and 32.768kHz sleep clock produced by RETU with an external crystal.
32k Sleep Clock is always powered on after startup. Sleep clock is used by RAP3G and OMAP for low-power
operation.
SMPS Clk is 2.4MHz clock line from RAP3G to TAHVO. In deep sleep mode, when VCTCXO is off, this signal is
set to '0'-state.
BT Clk is 38.4MHz signal from HINKU ASIC to BT module.
CLK600 is 600KHz signal from TAHVO to APE VCORE SMPS. The clock source is internal RC oscillator in TAHVO
(during the power-up sequence) or RAP3G SMPS Clk.

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Figure 58 Clocking scheme

USB, SIM, MMC
USB
USB (Universal Serial Bus) provides a wired connectivity between a USB host PC and peripheral devices.
USB is a differential serial bus for USB devices. USB controller supports USB specification revision 2.0 with full
speed USB (12 Mbps). The device is connected to the USB host through the system connector. The USB bus is
hot plugged capable, which means that USB devices may be plugged in/out at any time.

SIM interface
The device has one SIM (Subscriber Identification Module) interface. It is only accessible if battery is removed.
The SIM interface consists of an internal interface between RAP and EM ASIC (N2200), and of an external
interface between N2200 and SIM contacts.
The SIM IF is shown in the following figure:

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Figure 59 SIM interface

The EM ASIC handles the detection of the SIM card. The detection method is based in the BSI line. Because of
the location of the SIM card, removing the battery causes a quick power down of the SIM IF.
The EM ASIC SIM1 interface supports both 1.8 V and 3.0 V SIM cards. The SIM interface voltage is first 1.8 V
when the SIM card is inserted, and if the card does not response to the ATR a 3 V interface voltage is used.

µSD card interface

The µSD card is connected to the engine by an external level shifter and ESD protection filter. Supplied
voltages:
• VMMC: 2.85 V (from level shifter)
• VIO: 1.8 V (from Retu)
The card removal is detected by a push detect switch.

Camera
Camera
The camera uses a 2.0 megapixel camera module with a sensor resolution of 1600 x 1200.

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User interface
Display interface

Display module mechanical concept

Figure 60 LCD module

Display features:
• 262 k colours
• Partial display function Power saving by pausing display process on part of the screen.
• Built-in RAM capacity 176rows×208lines×16bit = 585,728 bits
The display has two different operating modes:
1 Normal mode, Full screen, 262k colours
2 Normal Partial mode, 262k colours but only part of the display is active
The interconnection between the LCD module and the Nokia engine is implemented with a 24-pin board-toboard connector.
The display module does not require any tuning in service.

Keyboard and side keys
The side keys are placed on the main PWB. The numerical keys and the navigation keys are included in the
UI flex on top of the phone.
The numerical keys and the side keys are included in the 4x4 scan matrix. The navigation keys are individually
routed.

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Backlight and illumination
There is backlight illuminating the display.
Behind the keypad there is an electroluminescent (EL) foil, giving the keys a blue lamaninate. The EL foil
backlight the keys with blue light for numeric soft keys and green/red for Send/End keys.

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Audio concept
Audio hardware architecture
The functional core of the audio hardware is built around two ASICs: RAPGSM engine ASIC and the mixedsignal ASIC Retu.
Retu provides an interface for the transducers and the accessory connector. Integrated hands free stereo
speakers are driven by a D-class audio amplifier.
There are four audio transducers:
• Dynamic earpiece
• Two dynamic speakers
• Microphone module
In addition to the audio transducers, Retu also provides an output for the dynamic vibra component.

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Figure 61 Audio block diagram

Internal microphone
Internal microphone is used for HandPortable (HP) and Internal HandsFree (IHF) call modes.
An analogue electret microphone is connected to N2200 Mic1P and Mic1N inputs via asymmetric electrical
connection.
The microphone is biased by N2200 MicB1 bias voltage output.

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Figure 62 Internal microphone circuitry

External microphone
Galvanic accessories are connected to the system connector.
The accessory audio mode is automatically enabled/disabled during connection/disconnection of dedicated
phone accessories.
External microphone circuitry is biased by N2200 MicB2 bias voltage output. The circuitry provides a
symmetrical connection for the microphone from the system connector connections, XMICN and XMICP, to
N2200 inputs, Mic2P and Mic2N.

Figure 63 External microphone circuitry (Pop-Port™ connects to the right side)

Internal earpiece
The internal earpiece is used in the HandPortable (HP) call mode. A dynamic 8 mm earpiece capsule is
connected to N2200 differential outputs EarP and EarN.

Figure 64 Internal earpiece circuitry

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Internal speaker
The internal speaker is used in Internal HandsFree (IHF) call mode.
A dynamic 16 mm speaker is connected to N2200 outputs HFSpP and HFSpN.
The IHF amplifier integrated in N2200 is a Digital Pulse Modulated Amplifier (DPMA).

Figure 65 Internal speaker circuitry

External earpiece
All galvanic accessories are connected to the system connector.
The accessory audio mode is automatically enabled/disabled during connection/disconnection of dedicated
phone accessories.

Figure 66 External earpiece circuitry (system connector connected on the right)

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Vibra circuitry
The vibra circuitry is used for the vibra-alarm function.
The vibra motor is connected to the EM ASIC (N2200) VibraP and VibraN Pulse Width Modulated (PWM) outputs.

Figure 67 Vibra circuitry

Pop-portTM connector
Pop-PortTM connector provides a fully differential 4–wire stereo line-level output connection and fully
differential 2-wire mono line-level or microphone level input connection.
The handsfree driver in Retu is meant for the headset.
The output is driven in a fully differential mode. In the fully differential mode, the handsfree pin is the
negative output and the HFCM pin is the positive output. The gain of the handsfree driver in the differential
mode is 6 dB.
The earpiece and headset signals are multiplexed so that the outputs cannot be used simultaneously.

Figure 68 System connector pin layout
Table 17 Pop-PortTMpin and signal table

Pin #/ Signal
name

Signal
description

Spectral range

Voltage/
Current levels

Max or
nominal serial
impedance

1/ Charge

V Charge

DC

0-9V/ 0.85A

2/ GND

Charge GND

-

0.85A

100mΩ (PWB+
conn.)

3/ ACI

ACI

1kbits/s

Digital 0 /

47Ω

2.5-2.78V

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Notes

Insertion &
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Pin #/ Signal
name
4/ Vout

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Signal
description
DC out

Spectral range

Voltage/
Current levels

Max or
nominal serial
impedance

DC

2.78V 70 mA

100mΩ (PWB+
conn.)

2.5V 90mA
4.375-5.25VDC

Notes

200mW

5/USB Vbus

USB power

6/Fbus_RX/USB
D+

Data
connection

115.2kbit

7/Fbus_TX/USB
D+

Data
connection

115.2kbit

8/Data GND

USB Ground

115.2kbit

9 / XMIC N

Audio in

300-8k

115.2kbit

1Vpp &
2.5-2.78VDC

10 / XMIC P

Audio in

300-8k

1Vpp &
2.5-2.78VDC

11 / XEAR N

Audio out

20-20k

1Vpp

10Ω

12 / XEAR P

Audio out

20-20k

1Vpp

10Ω

13 / XEAR R N

Audio out

20-20k

1Vpp

10Ω

Not conn. in
mono

14 / XEAR R P

Audio out

20-20k

1Vpp

10Ω

Not conn. in
mono

Bluetooth and FM radio
Bluetooth
Bluetooth provides a fully digital link for communication between a master unit (the phone) and one or more
slave units (e.g. a wireless headset). Data and control interface for a low power RF module is provided by the
module.
The Bluetooth is physically integrated with the FM radio into one single module. From a functional point of
view they, however, have nothing in common.

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Figure 69 Bluetooth interface

The Bluetooth has a separate built in antenna and is powered by VBAT and the regulated voltage VIO. For
audio applications the Bluetooth has a PCM data bus. In addition a UART (universal asynchronous receiver/
transmitter) is used for data communication and controls.

FM radio
The FM radio is physically integrated with the Bluetooth into one single module. From a functional point of
view they, however, have nothing in common.

Figure 70 FM interface

The FM radio is an integrated circuit, controlled by MCU software through a serial bus interface. The wires of
the headset are used as poles of the antenna, and no other antenna is needed for FM radio reception.
In addition to the Bluetooth unit the FM radio is provided with LDO (low drop out) voltage 2V8_FM_LCD.
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The radio has an automatic band search function, which can search for a strong write/read signal from a
certain frequency. When this is found, data is transmitted to the radio. When the signal strength is low, the
RETU can read data, which is available until the signal is strong again.

RF description
Introduction to receiver functionality
Receiver functions are implemented in an RF ASIC.
The receiver is a linear direct conversion receiver consisting of separate front ends (LNA (Low Noise Amplifier)
and demodulator) for each supported system. After the demodulators, the signal paths are combined to one
common BB path.

WCDMA receiver functionality
In the WCDMA mode, the received signal is fed from the antenna to a duplex filter. After the duplex filter the
signal goes via a balun to an LNA (Low Noise Amplifier) residing in N7500. From the LNA, the signal goes
trough a band pass filter.
After filtering, the signal goes to the down conversion mixer, which converts the signal to baseband I and Q
signals. At the BB frequency the signal is amplified, and fed to a low pass filter. The Rx channel filter must be
calibrated with an automatic routine whenever the Rx ASIC IC is changed to a phone.
In the WCDMA mode, the corner frequency of the filter is set to approximately 2.1 MHz. The filter is followed
by an AGC (Automatic Gain Control) amplifier with an adjustable gain. The signal is further amplified before
it is fed to balanced analogue IQ output pins. The analogue output pins are accompanied by reference voltage
output, which sets the DC level for the AD converter in the BB ASIC RAP.
The last stage of the RF Rx chain is an output buffer which feeds the signal and a reference voltage (VREFCM)
to the BB ASIC.

GSM receiver functionality
As GSM Rx branches are functionally identical, the following description is applicable to all of them.
The received signal goes from the GSM antenna to the antenna switch module.
The antenna switch module is followed by integrated LNAs residing in the Rx ASIC.
The LNAs are followed by demodulators which downconvert the signal to baseband I and Q signals.
After the down conversion mixer, the Rx chain is similar to the WCDMA Rx. The channel select filter is set to
115 kHz in the GSM mode.

Introduction to transmitter functionality
Transmitter functions are implemented in an RF ASIC. The ASIC contains a BB frequency low pass filter, which
is tunable according to the signal bandwidth of the system in use.
In addition, the ASIC contains separate RF paths comprising a final frequency IQ modulator and VGA amplifiers.

WCDMA transmitter functionality
In the transmitter side, an analogue I/Q modulated signal is received from digital baseband into an RF ASIC
and fed through a low pass filter. After the filter the signal is fed to the IQ modulator, which converts the
signal to final Tx frequency. There are two separate I/Q modulators: one for WCDMA and another for GSM
signals. The signal then exits the RF ASIC via a balanced line. Next, the signal is band pass filtered by a SAW
filter before it is fed to the WCDMA PA module. After the PA, the transmitted WCDMA signal is fed through an
isolator and a duplex filter to the antenna.

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WCDMA power control
WCDMA Tx power control is accomplished by the two VGA amplifier stages in the Tx ASIC.
The VGAs have a common temperature compensation circuit and one voltage mode analogue input for gain
control (TXC).
Another function of the detector voltage is to steer the DC/DC converter, which is providing a variable supply
voltage for the WCDMA PA.

WCDMA PA module
The WCDMA PA is housed in a separate module having:
• a variable supply voltage input for the amplifier stages (Vcc11),
• a battery supply voltage for the bias circuits (Vcc12),
• and two bias current inputs.
Bias currents are generated by 5-bit DA converters in the RF ASIC.
If a different manufacturer's PA is changed to the phone, this setting must be set again.

PA DC/DC converter
The control of the DC/DC converter is fed back from the power detector circuit.

GSM transmitter functionality
An RF ASIC receives an analogue IQ modulated signal from digital BB, which is first low pass filtered with
filter corner frequency set to approximately 200 kHz. After the filter, the signal is routed to the GSM modulator.
The amplifier gives 40 dB of power control dynamic range.
After the VGA stage the signal exits the RF ASIC. In case of GSM1800/1900 the signal goes via a balun to the
GSM PA module. In case of GSM900, the PA module is preceded by a SAW filter. After the filter, the signal is
fed to the GSM front end module (FEM). Finally, the signal is routed via FEM to the antenna.

Figure 71 GSM transmitter

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GSM power control
A closed control loop comprise an integrated power detector (in PA module) and an error amplifier. The error
amplifier resides in N7500, and it controls the transmitter power of GSM.

GSM PA module
A single GSM/EDGE PA module contains two separate amplifier chains, one for GSM900 and another for
GSM1800/1900. Both amplifiers have a battery supply connection and two bias current inputs.

Frequency synthesizers
RF has separate synthesizers for Rx and Tx. Both synthesizers consist of:
• PLL (Phase-Locked Loop)
• loop filter
• VCO (Voltage Controlled Oscillator)
• balun
The VCO frequencies are locked by PLLs into a reference oscillator, VCTCXO (Voltage Controlled Temperature
Compensated Crystal Oscillator).
The PLLs are located in RF ASICs and controlled via RFBus.

Reference oscillators
A 38.4MHz VCTCXO is used as a reference oscillator for the frequency synthesizers.

Regulators
RF ASIC contain integrated regulators to supply regulated voltages for their internal circuitry and other RF
parts. Rx VCO supply is got via a switch from an RF ASIC VR1 regulator. VCO can be switched on and off by
controlling the switch via RFBus.
Supply voltage for the VCTCXO is provided by a BB mixed mode ASIC. The same supply is used for reference
clock input buffers, output buffers and for the digital control blocks of both RF ASICs.
Other supplies, like 4.7 V supply for PLL charge pumps and bias reference (VREFRF01) are also provided by
the BB mixed mode ASIC.

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Figure 72 RF supply connections from the BB mixed mode ASIC

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Table of Contents
Schematics..............................................................................................................................................................9–4

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Schematics

System connector

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RETU, SIM, Audio

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TAHVO and LED/EL driver

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RAPGSM, Memory, µSD

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FM radio, Bluetooth

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Camera

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RF part

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Signal overview

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Component finder

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Glossary

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A/D-converter

Analog-to-digital converter

ACI

Accessory Control Interface

ADC

Analog-to-digital converter

ADSP

Application DPS (expected to run high level tasks)

AGC

Automatic gain control (maintains volume)

ALS

Ambient light sensor

AMSL

After Market Service Leader

ARM

Advanced RISC Machines

ARPU

Average revenue per user (per month or per year)

ASIC

Application Specific Integrated Circuit

ASIP

Application Specific Interface Protector

B2B

Board to board, connector between PWB and UI board

BB

Baseband

BC02

Bluetooth module made by CSR

BIQUAD

Bi-quadratic ,type of filter function)

BSI

Battery Size Indicator

BT

Bluetooth

CBus

MCU controlled serial bus connected to UPP_WD2,UEME and Zocus

CCP

Compact Camera Port

CDSP

Cellular DSP (expected to run at low levels)

CLDC

Connected limited device configuration

CMOS

Complimentary metal-oxide semiconductor circuit (low power consumption)

COF

Chip on Foil

COG

Chip on Glass

CPU

Central Processing Unit

CSR

cambridge silicon radio

CSTN

Color Super Twisted Nematic

CTSI

Clock Timing Sleep and interrupt block of Tiku

CW

Continuous wave

D/A-converter

Digital-to-analouge converter

DAC

Digital-to-analouge converter

DBI

Digital Battery Interface

DBus

DSP controlled serial bus connected between UPP_WD2 and Helgo

DCT-4

Digital Core Technology

DMA

Direct memory access

DP

Data Package

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RM-123; RM-145
Glossary

Nokia Customer Care
DPLL

Digital Phase Locked Loop

DSP

Digital Signal Processor

DtoS

Differential to Single ended

EDGE

Enhanced data rates for global/GSM evaluation

EGSM

Extended GSM

EM

Energy management

EMC

Electromagnetic compability

EMI

Electromagnetic interference

ESD

Electrostatic discharge

FCI

Functional cover interface

FPS

Flash Programming Tool

FR

Full rate

FSTN

Film compensated super twisted nematic

GND

Ground, conductive mass

GPIB

General-purpose interface bus

GPRS

General Packet Radio Service

GSM

Group Special Mobile/Global System for Mobile communication

HF

Hands free

HFCM

Handsfree Common

HS

Handset

HSCSD

High speed circuit switched data (data transmission connection faster than GSM)

HW

Hardware

I/O

Input/Output

IBAT

Battery current

IC

Integrated circuit

ICHAR

Charger current

IF

Interface

IHF

Integrated hands free

IMEI

International Mobile Equipment Identity

IR

Infrared

IrDA

Infrared Data Associasion

ISA

Intelligent software architecture

JPEG/JPG

Joint Photographic Experts Group

LCD

Liquid Crystal Display

LDO

Low Drop Out

LED

Light-emitting diode

Page Glossary–4

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Issue 1

RM-123; RM-145
Glossary

Nokia Customer Care

LPRF

Low Power Radio Frequency

MCU

Micro Controller Unit (microprocessor)

MCU

Multiport control unit

MIC, mic

Microphone

MIDP

Mobile Information Device Profile

MIN

Mobile identification number

MIPS

Million instructions per second

MMC

Multimedia card

MMS

Multimedia messaging service

NTC

Negative temperature coefficient, temperature sensitive resistor used as a
temperature sensor

OMA

Object management architechture

OMAP

Operations, maintenance, and administartion part

Opamp

Operational Amplifier

PA

Power amplifier

PDA

Pocket Data Application

PDA

Personal digital assistant

PDRAM

Program/Data RAM (on chip in Tiku)

Phoenix

Software tool of DCT4.x

PIM

Personal Information Management

PLL

Phase locked loop

PM

(Phone) Permanent memory

PUP

General Purpose IO (PIO), USARTS and Pulse Width Modulators

PURX

Power-up reset

PWB

Printed Wiring Board

PWM

Pulse width modulation

RC-filter

Resistance-Capacitance filter

RF

Radio Frequency

RF PopPort TM

Reduced function PopPortTM interface

RFBUS

Serial control Bus For RF

RSK

Right Soft Key

RS-MMC

Reduced size Multi Media Card

RSSI

Receiving signal strength indicator

RST

Reset Switch

RTC

Real Time Clock (provides date and time)

RX

Radio Receiver

Issue 1

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Page Glossary–5

RM-123; RM-145
Glossary

Nokia Customer Care
SARAM

Single Access RAM

SAW filter

Surface Acoustic Wave filter

SDRAM

Synchronous Dynamic Random Access Memory

SID

Security ID

SIM

Subscriber Identity Module

SMPS

Switched Mode Power Supply

SNR

Signal-to-noice ratio

SPR

Standard Product requirements

SRAM

Static random access memory

STI

Serial Trace Interface

SW

Software

SWIM

Subscriber/Wallet Identification Module

TCXO

Temperature controlled Oscillator

Tiku

Finnish for Chip, Successor of the UPP, Official Tiku3G

TX

Radio Transmitter

UART

Universal asynchronous receiver/transmitter

UEME

Universal Energy Management chip (Enhanced version)

UEMEK

See UEME

UI

User Interface

UPP

Universal Phone Processor

UPP_WD2

Communicator version of DCT4 system ASIC

USB

Universal Serial Bus

VBAT

Battery voltage

VCHAR

Charger voltage

VCO

Voltage controlled oscillator

VCTCXO

Voltage Controlled Temperature Compensated Crystal Oscillator

VCXO

Voltage Controlled Crystal Oscillator

Vp-p

Peak-to-peak voltage

VSIM

SIM voltage

WAP

Wireless application protocol

WD

Watchdog

XHTML

Extensible hypertext markup language

Zocus

Current sensor, (used to monitor the current flow to and from the battery)

Page Glossary–6

COMPANY CONFIDENTIAL
Copyright © 2006 Nokia. All rights reserved.

Issue 1



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